The low rho SMD (surface-mount device) series is well suited to space-constrained mobile applications. The devices can help provide both overcurrent and overtemperature protection for battery pack PCMs (protection circuit modules) used in compact consumer devices such as smartphones and MP3/MP4 media players. In particular, the low rho SMD series helps battery pack suppliers achieve their design goals and simplify their installation methods. The low rho SMD series comprises eleven devices. In the model number descriptions, the "micro" prefix refers to the 1210 form factor and the "nano" prefix refers to the 1206 form factor. Benefits PolySwitch Resettable Devices - low rho SMD Devices PolySwitch Resettable Devices Low rho SMD Devices Features * Helps save board space and power consumption, and therefore costs, in space-constrained mobile electronics * RoHS compliant * Are more compact in comparison with similiar offerings and are available in an industry-standard form factor * Current ratings from 1.75 to 5.0A * Can be assembled with a reflowable soldering technique, as opposed to the spot welding process required by many other components * Halogen free (refers to: Br#900ppm, Cl#900ppm, Br+Cl#1500ppm) * Agency recognition: UL, CSA, TUV * Small footprint * Fast time-to-trip * Maximum electrical rating: Voltage 6VDC and short circuit current 50A * Industry-standard form factor of 1210 (3.0mmx2.54mm, or 0.12inx0.10in), or 1206 (3.0mmx1.52mm; or 0.12inx0.060in) 11 * Useful for an operating current of 2A and above * Useful for and packaged for surface mounting on the PCB Applications * Mobile and smart phones * Digital still and video cameras * Media players (MP3/MP4) * Tablets RoHS Compliant, ELV Compliant 2013_CP_S11-Poly-3B-SMD.indd 161 HF Halogen Free * Mini notebooks 161 8/3/13 10:43 AM Table LR1 Thermal Derating for low rho SMD Devices [Hold Current (A) at Ambient Temperature (C)] Maximum Ambient Temperature -40C Part Number -20C 0C 20C 25C 40C 50C 60C 70C 80C 85C nanoSMDLR series Size 3216mm/1206mils Coming Soon nanoSMD175LR 3.00 2.60 2.20 1.75 1.70 1.40 1.20 1.00 0.80 0.60 0.50 nanoSMD200LR 3.60 3.20 2.80 2.00 1.90 1.80 1.60 1.40 1.20 1.00 0.80 nanoSMD270LR 4.00 3.50 3.00 2.70 2.60 2.20 2.00 1.60 1.40 1.20 1.10 nanoSMD350LR 5.50 4.80 4.00 3.50 3.30 2.70 2.30 1.90 1.60 1.40 1.30 nanoSMD400LR* 5.80 5.20 4.60 4.00 3.90 3.40 3.10 2.82 2.52 2.23 2.10 nanoSMD500LR 7.40 6.60 6.00 5.00 4.90 4.60 4.20 3.70 3.30 3.00 2.80 microSMDLR series Size 3225mm/1210mils Coming Soon microSMD190LR 3.40 2.90 2.40 1.90 1.80 1.40 1.15 0.90 0.65 0.40 0.28 microSMD200LR 3.50 3.00 2.50 2.00 1.90 1.50 1.25 1.00 0.75 0.50 0.38 microSMD250LR 4.40 3.80 3.20 2.50 2.40 1.90 1.60 1.30 1.00 0.65 0.50 microSMD350LR 5.40 4.75 4.00 3.50 3.20 2.70 2.40 2.00 1.70 1.35 1.20 microSMD450LR* 7.00 6.20 5.50 4.50 4.40 3.80 3.50 3.20 2.75 2.35 2.16 * Data is preliminary. Figure LR1 Thermal Derating Curve for low rho SMD Devices Figure LR1 160 % of Rated Hold and Trip Current 140 120 100 80 60 40 20 0 -40 -20 0 20 40 60 80 100 Ambient Temperature (C) Table LR2 Electrical Characteristics for low rho SMD Devices at Room Temperature Part Number IH (A) IT (A) VMAX (VDC) IMAX (A) PD MAX (W) Max Time-to-Trip (A) (s) RMIN R1 MAX Figure for Dimensions 9.50 1.00 0.008 0.034 LR2 nanoSMDLR series Size 3216mm/1206mils 11 Coming Soon nanoSMD175LR 1.75 5.00 6 50 1.00 nanoSMD200LR 2.00 6.00 6 50 1.00 9.50 3.00 0.006 0.024 LR2 nanoSMD270LR 2.70 6.30 6 50 1.00 8.00 5.00 0.005 0.018 LR2 nanoSMD350LR 3.50 6.30 6 50 1.00 8.00 5.00 0.004 0.018 LR2 nanoSMD400LR* 4.00 8.00 6 50 1.00 22.00 2.00 0.004 0.010 LR2 nanoSMD500LR 5.00 10.00 6 50 1.00 25.00 2.00 0.002 0.008 LR2 microSMDLR series Size 3225mm/1210mils Coming Soon microSMD190LR 1.90 4.90 6 50 1.00 9.50 4.00 0.006 0.021 LR3 microSMD200LR 2.00 5.00 6 50 1.00 9.50 4.00 0.006 0.021 LR3 microSMD250LR 2.50 5.20 6 50 1.00 9.50 5.00 0.005 0.018 LR3 microSMD350LR 3.50 9.00 6 50 1.00 9.50 10.00 0.0025 0.011 LR2 microSMD450LR* 4.50 9.00 6 50 1.00 25.00 2.00 0.002 0.008 LR3 * Data is preliminary. 162 RoHS Compliant, ELV Compliant 2013_CP_S11-Poly-3B-SMD.indd 162 HF Halogen Free 9/3/13 2:55 PM Figure LR2 Figure LR3 A B A B C C D D E Table LR3 Dimensions for low rho SMD Devices in Millimeters (Inches) Part Number Min A Max Min B Max Min C Max Min D Max E Min Figure nanoSMDLR Series Size 3216mm/1206mils Coming Soon nanoSMD175LR 3.00 (0.118) 3.43 (0.135) 0.50 (0.019) 1.00 (0.039) 1.37 (0.054) 1.85 (0.073) 0.25 (0.010) 0.75 (0.030) -- LR2 nanoSMD200LR 3.00 (0.118) 3.43 (0.135) 0.50 (0.019) 1.00 (0.039) 1.37 (0.054) 1.85 (0.073) 0.25 (0.010) 0.75 (0.030) -- LR2 nanoSMD270LR 3.00 (0.118) 3.43 (0.135) 0.50 (0.019) 1.00 (0.039) 1.37 (0.054) 1.85 (0.073) 0.25 (0.010) 0.75 (0.030) -- LR2 nanoSMD350LR 3.00 (0.118) 3.43 (0.135) 0.50 (0.019) 1.00 (0.039) 1.37 (0.054) 1.85 (0.073) 0.25 (0.010) 0.75 (0.030) -- LR2 nanoSMD400LR* 3.00 (0.118) 3.43 (0.135) 0.50 (0.019) 1.00 (0.039) 1.37 (0.054) 1.85 (0.073) 0.25 (0.010) 0.75 (0.030) -- LR2 nanoSMD500LR 3.00 (0.118) 3.43 (0.135) 0.50 (0.019) 1.00 (0.039) 1.37 (0.054) 1.85 (0.073) 0.25 (0.010) 0.75 (0.030) -- LR2 PolySwitch Resettable Devices - low rho SMD Devices Figures LR2-LR3 Dimensions Figures for low rho SMD Devices nanoSMDLR Series Size 3225mm/1210mils Coming Soon microSMD190LR 3.00 (0.118) 3.43 (0.135) 0.50 (0.019) 1.00 (0.039) 2.35 (0.092) 2.80 (0.110) 0.25 (0.010) 0.75 (0.030) 0.076 (0.003) LR3 microSMD200LR 3.00 (0.118) 3.43 (0.135) 0.50 (0.019) 1.00 (0.039) 2.35 (0.092) 2.80 (0.110) 0.25 (0.010) 0.75 (0.030) 0.076 (0.003) LR3 microSMD250LR 3.00 (0.118) 3.43 (0.135) 0.50 (0.019) 1.00 (0.039) 2.35 (0.092) 2.80 (0.110) 0.25 (0.010) 0.75 (0.030) 0.076 (0.003) LR3 microSMD350LR 3.00 (0.118) 3.43 (0.135) 0.50 (0.019) 1.00 (0.039) 2.35 (0.092) 2.80 (0.110) 0.25 (0.010) 0.75 (0.030) -- LR2 microSMD450LR* 3.00 (0.118) 3.43 (0.135) 0.50 (0.019) 1.00 (0.039) 2.35 (0.092) 2.80 (0.110) 0.25 (0.010) 0.75 (0.030) 0.076 (0.003) LR3 * Data is preliminary. Table LR4 Physical Characteristics for low rho SMD Devices 11 Operating Temperature Range -40C to 85C Physical Characteristics Terminal Pad Material Gold with Nickel Underplate Soldering Characteristics ANSI/J-STD-002 Category 3 Solder Heat Withstand per IEC-STD 68-2-20, Test Tb, Section 5, Method 1A Flammability Resistance per IEC 695-2-2 Needle Flame Test for 20 sec. Recommended Storage Conditions 40C max, 70% R.H. max; Devices May Not Meet Specified Ratings if Storage Conditions Are Exceeded. RoHS Compliant, ELV Compliant 2013_CP_S11-Poly-3B-SMD.indd 163 HF Halogen Free 163 9/4/13 9:40 AM Table LR5 Packaging and Marking Information for low rho SMD Devices Recommended Pad Layout Figures [mm (in)] Part Number Tape & Reel Quantity Standard Package Part Marking Dimension A (Nom) Dimension B (Nom) Dimension C (Nom) Agency Recognition 3,000 15,000 J 1.75 (0.069) 1.10 (0.043) 2.00 (0.079) UL, CSA, TUV nanoSMDLR Series Size 3216mm/1206mils nanoSMD175LR Coming Soon nanoSMD200LR 3,000 15,000 T 1.75 (0.069) 1.10 (0.043) 2.00 (0.079) UL, CSA nanoSMD270LR 3,000 15,000 L 1.75 (0.069) 1.10 (0.043) 2.00 (0.079) UL, CSA, TUV nanoSMD350LR 3,000 15,000 P 1.75 (0.069) 1.10 (0.043) 2.00 (0.079) UL, CSA, TUV nanoSMD400LR* 3,000 15,000 S 1.75 (0.069) 1.10 (0.043) 2.00 (0.079) Pending nanoSMD500LR 3,000 15,000 H 1.75 (0.069) 1.10 (0.043) 2.00 (0.079) UL, CSA, TUV 3,000 15,000 None 2.65 (0.104) 1.00 (0.039) 2.00 (0.079) UL, CSA microSMDLR Series Size 3225mm/1210mils microSMD190LR Coming Soon microSMD200LR 3,000 15,000 T 2.65 (0.104) 1.00 (0.039) 2.00 (0.079) UL, CSA microSMD250LR 3,000 15,000 L 2.65 (0.104) 1.00 (0.039) 2.00 (0.079) UL, CSA microSMD350LR 3,000 15,000 P 2.65 (0.104) 1.10 (0.043) 2.00 (0.079) UL, CSA microSMD450LR* 3,000 15,000 H 2.65 (0.104) 1.00 (0.039) 2.00 (0.079) Pending * Data is preliminary. Figure LR4 Recommended Pad Layout for low rho SMD Devices A B C B Agency Recognition for low rho SMD Devices UL File # E74889 for all low rho SMD Devices CSA File # CA78165 for all low rho SMD Devices TUV Certificate Number Available Upon Request (Certified to IEC 60730-1) 11 164 RoHS Compliant, ELV Compliant 2013_CP_S11-Poly-3B-SMD.indd 164 HF Halogen Free 9/3/13 3:31 PM Classification Reflow Profiles Figure LR5 tp Critical Zone TL to Tp Tp Ramp Up TL Temperature Profile Feature Pb-Free Assembly Average Ramp-up Rate (TsMAX to Tp) 3C/s max Preheat * Temperature min (TsMIN) 150C * Temperature max (TsMAX) 200C * Time (tsMIN to tsMAX) 60-120s Time Maintained Above: * Temperature (TL) 217C * Time (tL) 60-150s Peak/Classification Temperature (Tp) 260C Time within 5C of Actual Peak Temperature Time (tp) 30s max Ramp down rate 2C/s max Time 25C to Peak Temperature 8 mins max tL TsMAX TsMIN ts Preheat 25 Reflow Profile Ramp Down t 25C to Peak Time Note: All temperatures refer to topside of the package measured on the package body surface. Solder Reflow * Recommended reflow methods: - IR - Hot air - Nitrogen * Recommended maximum paste thickness: 0.25mm (0.010in). * Devices can be cleaned using standard methods and aqueous solvents. * Experience has shown the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed underneath each device's termination. As such, we request that customers comply with our recommended solder pad layouts. * Customer should validate that the solder paste amount and reflow recommendations meet its application. * We request that customer board layouts refrain from placing raised features (e.g., vias, nomenclature, traces, etc.) underneath PolySwitch devices. It is possible that raised features could negatively impact solderability performance of our devices. PolySwitch Resettable Devices - low rho SMD Devices Solder Reflow Recommendation for low rho SMD Devices Table LR6 Tape and Reel Specifications for low rho SMD Devices in Millimeters Description nanoSMDLR Series EIA 481-1 microSMDLR Series EIA 481-1 W 8.0 0.30 8.0 0.30 P0 4.0 0.10 4.0 0.10 P1 4.0 0.10 4.0 0.10 P2 2.0 0.05 2.0 0.05 A0 1.95 0.10 2.9 0.10 B0 3.50 +0.1/-0.08 3.55 0.10 B1 mAx 4.35 4.35 D0 1.55 0.05 1.55 0.05 F 3.50 0.05 3.50 0.05 E1 1.75 0.10 1.75 0.10 E2 min 6.25 6.25 T mAx 0.3 0.3 T1 mAx 0.1 0.1 K0 0.89 0.10 1.27 0.10 A mAx 179 179 n min 53.5 53.5 W1 9.5 0.5 9.5 0.5 W2 mAx 15 15 RoHS Compliant, ELV Compliant 2013_CP_S11-Poly-3B-SMD.indd 165 HF Halogen Free 11 165 8/3/13 10:43 AM Figure LR6 EIA Referenced Taped Component Dimensions for low rho SMD Devices T P0 Cover Tape P2 D0 E1 F B1 W K0 E2 B0 T1 A0 Embossment P1 Center Lines of Cavity Figure LR7 EIA Referenced Reel Dimensions for low rho SMD Devices W2 (Measured at Hub) Cover Tape A N (Hub Dia.) W1 (Measured at Hub) Carrier Tape Embossed Cavity 11 166 RoHS Compliant, ELV Compliant 2013_CP_S11-Poly-3B-SMD.indd 166 HF Halogen Free 8/3/13 10:43 AM NANOSMD 175 LR -2 Packaging 2 = Tape and Reel Low Resistance Hold Current Indicator Product Series PolySwitch Resettable Devices - low rho SMD Devices Part Numbering System for low rho SMD Devices Warning: 11 * Users should independently evaluate the suitability of and test each product selected for their own application. * Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. * These devices are intended for protection against damage caused by occasional overcurrent or overtemperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated. * Contamination of the PPTC material with certain silicone-based oils or some aggressive solvents can adversely impact the performance of the devices. * Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components. * PPTC devices are not recommended for installation in applications where the device is constrained such that its PTC properties are inhibited, for example in rigid potting materials or in rigid housings, which lack adequate clearance to accommodate device expansion. * Operation in circuits with a large inductance can generate a circuit voltage (Ldi/dt) above the rated voltage of the device. RoHS Compliant, ELV Compliant 2013_CP_S11-Poly-3B-SMD.indd 167 HF Halogen Free 167 8/3/13 10:43 AM Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: TE Connectivity: NANOSMD500LR-2