© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 7/31/2014 1
One world. One KEMET
Benets
• Rated voltage: 16 & 50 VDC
• Capacitance range: 0.0033 – 0.1 µF
• EIA size: 1206 – 1812
• Capacitance tolerance: ±2%, ±5%
• Climatic category: 55/125/56
• RoHS Complaint and lead-free terminations
• Operatingtemperaturerangeof-55˚Cto+125˚C
Overview
Polyphenylenesulphide(PPS)lmcapacitorforsurface
mounting.
Applications
Typicalapplicationsincludetiming,lteringanduseasamemory
capacitor. The LDB Series is designed for high stability, accuracy
and temperature.
Surface Mount Metallized PPS Film Capacitor
LDB Series Unencapsulated Stacked Chip,
Size 1206 – 1812, 16 & 50 VDC
Part Number System
LDB A A 2120 GC5N0
Series
Rated Voltage
(VDC) Size Code Capacitance Code (pF)
Capacitance
Tolerance Dielectric Version Packaging Code Internal Use
Metallized PPS A = 16
C = 50
See Dimension
Table
Digits 2 – 4 indicate the
rstthreedigitsofthe
capacitance value.
First digit indicates the
number of zeros to be
added.
G = ±2%
J = ±5%
C = PPS 5 = Standard See Ordering
Options Table
0 (Standard)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 7/31/2014 2
Surface Mount Metallized PPS Film Capacitors
LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 & 50 VDC
Ordering Options Table
Packaging Type Packaging
Code
Standard Packaging Options
Tape & Reel (Standard Reel)
N
Dimensions – Millimeters
Size Code Chip Size
(EIA)
WH L
Nominal Tolerance Nominal Tolerance
A
1206
1.7
+/-0.2
See Part Number Table
3.3
B
1210
2.5
+/-0.3
3.3
C
1812
3.3
+/-0.3
4.7
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 7/31/2014 3
Surface Mount Metallized PPS Film Capacitors
LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 & 50 VDC
Performance Characteristics
Rated Voltage (VDC) 16 50
CapacitanceRange(μF) 0.012 – 0.1 0.0033 – 0.1
Chip Size (EIA) 1206 – 1812
Capacitance Values E12 series
Capacitance Tolerance ±2%, ±5%
Category Temperature Range -55°Cto+125°C
Rated Temperature +105°C
Voltage Derating Theratedvoltageisdecreasedwith1.25%/°Cfrom+105°Cto+125°C
Climatic Category 55/125/56
Capacitance Drift
Maximum1%aftera2yearstorageperiodatatemperatureof+10°Cto
+40°Candarelativehumidityof40%to60%
Reliability
(Reference MIL-HDBK-217)
Failurerate≤1FIT,T=+40°C,V=0.5xVR
1 FIT = 10-9 failures / (components * hours)
Failure criteria: open or short circuit, cap. change > 10%, DF 2 times the
catalog limits, IR < 0.005 x initial limit
Insulation Resistance
Measuredat+25°C±5°C
Minimum Value Between Terminals
3,000MΩ
Charging time: 1 minute
Charging voltage:
10 VDC for VR = 16 VDC
50 V
DC
for VR = 50 V
DC
Dissipation Factor
Maximum Values at 25°C ±5°C
1 kHz 0.6%
Surge Voltage Test 1.75 x VR (5 seconds; T = 25 ± 5°C)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 7/31/2014 4
Surface Mount Metallized PPS Film Capacitors
LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 & 50 VDC
PPS Dielectric Typical Temperature Graphs PPS Dielectric Typical Frequency Graphs
Note: measurements performed at T = 25 ± 5ºC
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 7/31/2014 5
Surface Mount Metallized PPS Film Capacitors
LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 & 50 VDC
Environmental Test Data
Damp Heat, Steady State
Test Conditions
Temperature +40°C±2°C
Relative Humidity (RH) 93% ±2%
Test Duration 56 days
Performance
CapacitanceChange|∆C/C| ≤5%
DFChange(∆tgδ) ≤30x10-4 at 1 kHz
Insulation Resistance ≥50%oflimitvalue
Endurance
Test Conditions
Temperature 125°C ±2°C
Test Duration 2,000 hours
Voltage Applied 1.25 x V
C
Performance
CapacitanceChange|∆C/C| ≤3%
DFChange(∆tgδ) ≤30x10-4 at 1 kHz
Insulation Resistance ≥50%oflimitvalue
Rapid Change of Temperature
Test Conditions
Temperature 1hourat-55°C,1hourat+125°C
Number of Cycles 1,000
Performance
CapacitanceChange|∆C/C| ≤3%
DFChange(∆tgδ) ≤50x10-4 at 1 kHz
Insulation Resistance ≥limitvalue
No Mechanical Damage
Reow
Test Conditions
See Solder Process
Performance
CapacitanceChange|∆C/C| ≤3%
DFChange(∆tgδ) ≤50x10-4 at 1 kHz
Insulation Resistance ≥limitvalue
No Mechanical Damage
Bending
Test Conditions
Deection 1 to 6 mm
Performance
CapacitanceChange|∆C/C| ≤1%
No visible damage on the terminations
(pealing) neither on the body (cracking)
Environmental Compliance
All KEMET surface mount capacitors are RoHS Compliant.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 7/31/2014 6
Surface Mount Metallized PPS Film Capacitors
LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 & 50 VDC
Table 1 – Ratings & Part Number Reference
VDC Capacitance
Value (µF) Size Code Dimensions in mm Chip Size New KEMET
Part Number
Legacy Part
Number
B H L
16 0.012 A1.7 1.1 3.3 1206 DBAA2120(1)C5N0 LDBAA2120(1)C5N0
16 0.015 A1.7 1.1 3.3 1206 DBAA2150(1)C5N0 LDBAA2150(1)C5N0
16 0.018 A1.7 1.1 3.3 1206 DBAA2180(1)C5N0 LDBAA2180(1)C5N0
16 0.022 A1.7 1.1 3.3 1206 DBAA2220(1)C5N0 LDBAA2220(1)C5N0
16 0.027 A1.7 1.1 3.3 1206 DBAA2270(1)C5N0 LDBAA2270(1)C5N0
16 0.033 A1.7 1.1 3.3 1206 DBAA2330(1)C5N0 LDBAA2330(1)C5N0
16 0.039 A1.7 1.2 3.3 1206 DBAA2390(1)C5N0 LDBAA2390(1)C5N0
16 0.047 A1.7 1.3 3.3 1206 DBAA2470(1)C5N0 LDBAA2470(1)C5N0
16 0.056 B2.5 1.7 3.3 1210 DBAB2560(1)C5N0 LDBAB2560(1)C5N0
16 0.068 B2.5 1.7 3.3 1210 DBAB2680(1)C5N0 LDBAB2680(1)C5N0
16 0.082 B2.5 1.7 3.3 1210 DBAB2824(1)C5N0 LDBAB2824(1)C5N0
16 0.10 B2.5 2.0 3.3 1210 DBAB3100(1)C5N0 LDBAB3100(1)C5N0
50 0.0033 A1.7 1.1 3.3 1206 DBCA1330(1)C5N0 LDBCA1330(1)C5N0
50 0.0039 A1.7 1.1 3.3 1206 DBCA1390(1)C5N0 LDBCA1390(1)C5N0
50 0.0047 A1.7 1.1 3.3 1206 DBCA1470(1)C5N0 LDBCA1470(1)C5N0
50 0.0056 A1.7 1.1 3.3 1206 DBCA1560(1)C5N0 LDBCA1560(1)C5N0
50 0.0068 A1.7 1.1 3.3 1206 DBCA1680(1)C5N0 LDBCA1680(1)C5N0
50 0.0082 A1.7 1.1 3.3 1206 DBCA1820(1)C5N0 LDBCA1820(1)C5N0
50 0.010 A1.7 1.1 3.3 1206 DBCA2100(1)C5N0 LDBCA2100(1)C5N0
50 0.012 A1.7 1.1 3.3 1206 DBCA2120(1)C5N0 LDBCA2120(1)C5N0
50 0.015 B2.5 1.4 3.3 1210 DBCB2150(1)C5N0 LDBCB2150(1)C5N0
50 0.018 B2.5 1.5 3.3 1210 DBCB2180(1)C5N0 LDBCB2180(1)C5N0
50 0.022 B2.5 1.5 3.3 1210 DBCB2220(1)C5N0 LDBCB2220(1)C5N0
50 0.027 B2.5 1.5 3.3 1210 DBCB2270(1)C5N0 LDBCB2270(1)C5N0
50 0.033 B2.5 1.7 3.3 1210 DBCB2330(1)C5N0 LDBCB2330(1)C5N0
50 0.039 B2.5 1.9 3.3 1210 DBCB2390(1)C5N0 LDBCB2390(1)C5N0
50 0.047 B2.5 2.3 3.3 1210 DBCB2470(1)C5N0 LDBCB2470(1)C5N0
50 0.056 C3.3 1.7 4.7 1812 DBCC2560(1)C5N0 LDBCC2560(1)C5N0
50 0.068 C3.3 1.7 4.7 1812 DBCC2680(1)C5N0 LDBCC2680(1)C5N0
50 0.082 C3.3 1.7 4.7 1812 DBCC2824(1)C5N0 LDBCC2824(1)C5N0
50 0.10 C3.3 2.0 4.7 1812 DBCC3100(1)C5N0 LDBCC3100(1)C5N0
VDC Capacitance
Value (µF) Size Code B (mm) H (mm) L (mm) Chip Size New KEMET
Part Number Legacy Part Number
(1) G = ±2%, J = ±5%.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 7/31/2014 7
Surface Mount Metallized PPS Film Capacitors
LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 & 50 VDC
Soldering Process
Reow Recommendations
Preheating
Maximum Preheating Time 180 seconds
Minimum Temperature 150°C
Maximum Temperature 200°C
Maximum Time within Tmax and
Tmax–5°C(∆T5)
30 seconds (Tmax≤250°C)
10 seconds (250 °C < Tmax≤260°C)
Maximum Time Over 217°C
(∆T
217
)150 seconds
Maximum Temperature Ramp Rate
3°C/seconds (heating)
6°C/seconds (cooling)
Secondreow
Iftworeowprocessesareneeded,besurethatbeforethesecondreow,
the temperature on the capacitor’s surface is lower than 50°C.
* For LDB series this value is 260 °C.
Maximum Temperature on Component Body (Tmax)
Capacitor
Capacitor Volume (mm
3
)
H
max
(mm) < 350 350 – 2,000 > 2,000
< 1.6 255°C * 255°C * 255°C *
1.6 – 2.5 255°C * 250°C 245°C
> 2.5 250°C 245°C 245°C
*In line with JEDEC STD 020D ed. June 2007 with some limitations.
* For LDB series this value is 260 °C.
Flux/Cleaning/Storage and Moisture
Flux suggestions
Wesuggesttouseano-cleanuxwithahalogencontentlowerthan0.1%.
Cleaning suggestions
To clean the PCB assembly we suggest to use a suitable solvent like Isopropyl Alcohol, deionized water or neutral pH detergents.
Solvents like Toluene, Xylene and Trichloroethylene should not be used.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 7/31/2014 8
Surface Mount Metallized PPS Film Capacitors
LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 & 50 VDC
Flux/Cleaning/Storage and Moisture cont'd
Storage and moisture recommendations
KEMET SMD Film Capacitors are supplied in a MBB (Moisture Barrier Bag) Class 1. We can guarantee a 24 months shelf life
(temperature≤40°C/relativehumidity≤90%).AftertheMBBhasbeenopened,componentsmaystayinareaswithcontrolled
temperatureandhumidity(temperature≤30°C/relativehumidity≤60%)for168hours(ratedvoltage≤100VDC)or696hours(rated
voltage > 100 VDC). For longer periods of time and/or higher temperature and/or higher relative humidity values, it is absolutely
necessary to protect the components against humidity. If the reel inside the MBB is partially used, KEMET recommends to re-use
the same MBB or to avoid areas without controlled temperature and humidity (see above). If the above conditions are not respected,
componentsrequireabaking(minimumtime:48hoursat55±5°C)beforethereow.
Manual assembly recommendations
If PCBs are assembled manually, care must be taken to avoid any mechanical damage to the
components. Our recommendations are the following (see Fig. 1):
1. When using tweezers, the components should be gripped across the two terminations (A);
2. Avoid any contact with the two cutting surfaces (C);
3. A vacuum pen is recommended on the top and bottom surfaces (B).
Manual soldering recommendations
LDEandLDBserieshavebeendesignedforSurfaceMountTechnology,pick&placemachinesandreowsolderingsystems.Usinga
manual soldering iron, issues may occur because the typical temperature for manual soldering is around 350°C. Therefore please pay
careful attention:
• Never touch the capacitor body with the soldering iron but rather touch the soldering iron and the end termination with the tin wire
edge (see Fig. 2);
• If the soldering iron is equipped with a temperature controller device:
Set the temperature to 250 ± 3°C and proceed as per Fig. 2 (the maximum soldering time, on both terminations, is 5 seconds);
• If the soldering iron is NOT equipped with a temperature controller device:
This is the worst situation. The following are a few practical suggestions but, clearly, the operator’s experience is extremely important:
1. Proceed as per Fig. 2;
2. As soon as the tin wire starts melting, move the soldering iron away as quickly as possible;
3. Wait a few seconds and check that the soldering joint has been properly created;
• Ifthesolderingironisequippedwithahotairowdevice:
Set the hot air temperature to 250 ± 3°C and do not send the hot air directly onto the capacitor plastic body. In this situation, the
operator’s experience is very important;
• In any case, avoid mass-mounting SMD Film Capacitors manually.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 7/31/2014 9
Surface Mount Metallized PPS Film Capacitors
LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 & 50 VDC
Packaging Quantities
Chip Size (EIA) Height (mm) Reel
1206
1.1
3000
1206
1.2
3000
1206
1.3
3000
1210
1.4
2250
1210
1.5
2250
1210
1.7
2250
1210
1.9
2250
1210
2.0
2250
1210
2.3
2250
1812
1.7
4000
1812
2.0
3000
Landing
Size Dimensions in mm
A
B
C
D
1206
1.5
1.1
2.3
4.5
1210
2.3
1.1
2.3
4.5
1812
3
1.7
3.1
6.5
These landing area dimensions have the aim of taking full advantage of the new RoHS 6 terminations design.
We suggest to use a Sn/Ag/Cu solder paste (suggested thickness: 0.10 – 0.15 mm).
If a NOT Lead Free solder paste is used, a minimum peak temperature of 210°C on the component’s body is suggested.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 7/31/2014 10
Surface Mount Metallized PPS Film Capacitors
LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 & 50 VDC
Carrier Taping & Packaging (IEC 60286–2)
Horizontal Taping Orientation
Chip Size (EIA)
Horizontal
Mounting
Dimensions in mm Taping Specication
W
H L W P
1
A
0
B
0
K
0
D W
1
W
2
Nominal
Nominal
Nominal
-0.1/+0.3
+/-0.1
Nominal
Nominal
Nominal
-/+2.0
-0/+2
Maximum
1206
1.7
All
3.3
8
4
2
3.8
1.3
180
8
12
1210
2.5
All
3.3
8
4
3
3.8
2.1
180
8
12
1812
3.3
≤1.9
4.7
12
8
3.8
5.3
2
330
12
16
1812
3.3
2.1 – 2.6
4.7
12
8
3.9
5.2
2.6
330
12
16
In accordance with IEC 60286-3
Materials:
- carrier tape: antistatic material
- cover tape: polyester + polythene
- reel: recyclable polystyrene
All parts in reels are packed in hermetically sealed Moisture Barrier Bag (MBB) Class 1.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 7/31/2014 11
Surface Mount Metallized PPS Film Capacitors
LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 & 50 VDC
KEMET Corporation
World Headquarters
2835 KEMET Way
Simpsonville, SC 29681
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Corporate Of ces
Fort Lauderdale, FL
Tel: 954-766-2800
North America
Southeast
Lake Mary, FL
Tel: 407-855-8886
Northeast
Wilmington, MA
Tel: 978-658-1663
Central
Novi, MI
Tel: 248-306-9353
West
Milpitas, CA
Tel: 408-433-9950
Mexico
Guadalajara, Jalisco
Tel: 52-33-3123-2141
Europe
Southern Europe
Paris, France
Tel: 33-1-4646-1006
Sasso Marconi, Italy
Tel: 39-051-939111
Central Europe
Landsberg, Germany
Tel: 49-8191-3350800
Kamen, Germany
Tel: 49-2307-438110
Northern Europe
Bishop’s Stortford, United Kingdom
Tel: 44-1279-460122
Espoo, Finland
Tel: 358-9-5406-5000
Asia
Northeast Asia
Hong Kong
Tel: 852-2305-1168
Shenzhen, China
Tel: 86-755-2518-1306
Beijing, China
Tel: 86-10-5829-1711
Shanghai, China
Tel: 86-21-6447-0707
Taipei, Taiwan
Tel: 886-2-27528585
Southeast Asia
Singapore
Tel: 65-6586-1900
Penang, Malaysia
Tel: 60-4-6430200
Bangalore, India
Tel: 91-806-53-76817
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3082_LDB • 7/31/2014 12
Surface Mount Metallized PPS Film Capacitors
LDB Series Unencapsulated Stacked Chip, Size 1206 – 1812, 16 & 50 VDC
Disclaimer
Allproductspecications,statements,informationanddata(collectively,the“Information”)inthisdatasheetaresubjecttochange.Thecustomerisresponsibleforcheckingand
verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
StatementsofsuitabilityforcertainapplicationsarebasedonKEMETElectronicsCorporation’s(“KEMET”)knowledgeoftypicaloperatingconditionsforsuchapplications,butare
notintendedtoconstitute–andKEMETspecicallydisclaims–anywarrantyconcerningsuitabilityforaspeciccustomerapplicationoruse.TheInformationisintendedforuseonly
by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise
provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still
occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective
circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not
be required.