150 MHz SAW Filter
5.7 MHz Bandwidth
Part Number SF0150BA03095S
IDT • SAW Products • 324 Clark Street, Worcester, MA 01606, USA • Ph 1-508-852-5400 • Fax 1-508-852-8456
www.idt.com DSSF0150BA03095S Rev - 18-Aug-2006
Page 1 of 4
DESCRIPTION
• 150 MHz SAW bandpass filter with 5.7 MHz bandwidth.
• 13.3 x 6.5 mm SMP.
• RoHS compliant.
TYPICAL PERFORMANCE
Horizontal: Frequency : 2.5 MHz/div
Vertical from Top: Relative Magnitude : 10 dB/div
Relative magnitude : 1 dB/div
Group Delay Deviation : 150 ns/div
S11 S22
150 MHz SAW Filter
5.7 MHz Bandwidth
Part Number SF0150BA03095S
IDT • SAW Products • 324 Clark Street, Worcester, MA 01606, USA • Ph 1-508-852-5400 • Fax 1-508-852-8456
www.idt.com DSSF0150BA03095S Rev - 18-Aug-2006
Page 2 of 4
SPECIFICATION
Parameter 1 Min Typ Max Units
Center Frequency (FC) 2 149.875 150.025 150.175 MHz
Insertion Loss 4 - 19.3 21 dB
1 dB Bandwidth 3 5.7 5.95 - MHz
3 dB Bandwidth 3 6.1 6.42 - dB
40 dB Bandwidth 3 - 7.95 8.3 dB
Stopband Rejection (25 to 135 MHz) 45 54 - dB
Stopband Rejection (165 to 2000 MHz) 45 53 - dB
Passband Amplitude Variation (Fc+/-2.75 MHz) - 0.67 0.8 dB p-p
Passband Group Delay Variation (Fc+/-2.75 MHz) 5 - 115 150 ns p-p
Absolute Delay - 1.81 2.0 us
Input and Output Return Loss(Fc+/-2.75 MHz) 5 - 1.3 1.8 :1
Source and Load Impedance - 50 - Ω
Ambient Temperature - 25 - °C
Notes: 1. All electrical specifications apply over the full operating temperature range and include allowance for
all manufacturing tolerance.
2. Defined as the mean of the 10 dB frequencies.
3. dB levels are taken to be relative to the insertion loss.
4. Measured at the maximum level (lowest insertion loss) of the response.
5. When matched as indicated below.
MAXIMUM RATINGS
Parameter Min Max Units
Storage Temperature Range -45 85 ˚C
Operating Temperature Range -10 50 ˚C
Input Power Level - 20 dBm
D.C. Voltage between Each Terminal - 15 V
ESD Level Human Body Model: 1000 V
Machine Model: 200 V
MATCHING CIRCUIT
Typical component values:
(Minimum inductor Q = 40)
Notes:
1. Required component tolerances: resistors +/-5%, inductors +/-2%, capacitors +/-5%
2. Component values shown are for guidance only and may change depending on board layout.
Ls1 = 39 nH Ls2 = 33 nH
Cp1 = 47 pF Cp2 = 50 pF
Rp1 = 220 Ω Rp2 = 130 Ω
10 5
All other pads
Input
50 Ω
Single-ended
Output
50 Ω
Single-ended
150 MHz SAW Filter
5.7 MHz Bandwidth
Part Number SF0150BA03095S
IDT • SAW Products • 324 Clark Street, Worcester, MA 01606, USA • Ph 1-508-852-5400 • Fax 1-508-852-8456
www.idt.com DSSF0150BA03095S Rev - 18-Aug-2006
Page 3 of 4
PACKAGE OUTLINE SUGGESTED FOOTPRINT
Package Material:
Body: Al2O3 ceramic
Lid: Kovar, Ni plated
Terminations: Au plating 1 µm min,
over a 1.3-8.9 µm Ni plating
Units: mm
Tolerances are ±0.15 mm except
for the overall length and width,
which are nominal values.
Pad Configuration:
Input: 10
Output: 5
Ground: 1,2,3,4,6,7,8,9
13.30
6.50
+.20
-.10
+.20
-.10
150 MHz SAW Filter
5.7 MHz Bandwidth
Part Number SF0150BA03095S
IDT • SAW Products • 324 Clark Street, Worcester, MA 01606, USA • Ph 1-508-852-5400 • Fax 1-508-852-8456
www.idt.com DSSF0150BA03095S Rev - 18-Aug-2006
Page 4 of 4
PHYSICAL AND ENVIRONMENTAL CHARACTERISTI CS
Parameter Qualification Conditions
Life Testing High temperature bake at +85 ºC for 168 hours.
Temperature Cycling
MIL-STD 883, Method 1010:
-40 ºC to +85 ºC, 10 cycles, 10 minutes dwell at
temperature extremes
Vibration
MIL-STD-202, Method 201A:
10 to 55 Hz, double amplitude of 0.06” for 2 hours in each
axis.
Mechanical Shock MIL-STD-883, Method 2002, Test Condition B:
1500 g, 3 impacts each axis
Solder Heat Resistance and Reflow
Condition
Peak temperature 240+/-5 ºC for 10 seconds.
Pre-heat: 150-170 ºC for 60 to 90 seconds.
Peak dwell: over 200 ºC for 23 to 26 seconds.
Handling: Class 1 per MIL-STD-1686
Reflow Profile is shown at the bottom of this table.
Lead Integrity MIL-STD 883 Method 2004, Condition D
8 oz for 30 seconds.
Solderability MIL-STD-883 Method 2003:
245 ºC +/-5 ºC; 95% coverage; no steam aging
Hermeticity MIL-STD 883 Method 1014:
Condition A2 and Condition C (no bomb)
ESD Classification
Class I per MIL-STD-883 Method 3015;
Ensure ESD shielding bag is used during transportation
processes;
Personal grounding must be worn at all times when
handling the device.
Precautions Do not subject devices to ultrasonic cleaning, which may
cause deterioration and destruction of the device.
All specifications are believed to be accurate and reliable. However, MNC reserves the right to make changes without notice.
© 2006 All rights reserved.
ISO 9001
Registered
Reflow Profile
0
50
100
150
200
250
0 50 100 150 200 250 300
TIM E (sec)
TEMP (deg C)
