B57452V5103J62 - EPCOS / TDK

NTC thermistors for

temperature measurement

SMD NTC thermistors,

case size 0805 (2012), automotive series

Series/Type: B574**V5

Date: December 2016

information contained therein without EPCOS' prior express consent is prohibited.

EPCOS AG is a TDK Group Company.

1) Depends on mounting situation

Applications

Temperature measurement and compensation

Features

Qualification based on AEC-Q200 Rev-D

Multilayer SMD NTC with inner electrodes

Nickel barrier termination

For temperature measurement up to 150 °C

Excellent long-term aging stability in high

temperature and high humidity environment

UL approval (E69802)

Options

Alternative resistance ratings, resistance

tolerances and B value tolerances available on

request.

Delivery mode

Cardboard tape, 180-mm reel

Dimensional drawing

Dimensions in mm

Approx. weight 13 mg

General technical data

Operating temperature range Top 40 ... 150 °C

Max. power (at 25 °C, on PCB) P251) 210 mW

Resistance tolerance ∆RR/RR±3, ±5 %

Rated temperature TR25 °C

Dissipation factor (on PCB) δth1) approx. 3.5 mW/K

Thermal cooling time constant (on PCB) τc1) approx. 10 s

Heat capacity Cth1) approx. 35 mJ/K

Electrical specification and ordering codes

R25

Ω∆RR/RR

No. of R/T

characteristic

B25/50

B25/85

B25/100

Ordering code

+ = Resistance tolerance

H = ±3%

J = ±5%

4.7 k ±3, ±5 8500 3590 3635 3650 ±3% B57442V5472+062

4.7 k ±3, ±5 8507 4386 4455 4480 ±3% B57452V5472+062

10 k ±3, ±5 8500 3590 3635 3650 ±3% B57442V5103+062

10 k ±3, ±5 8502 3940 3980 4000 ±3% B57451V5103+062

10 k ±3, ±5 8507 4386 4455 4480 ±3% B57452V5103+062

33 k ±3, ±5 8502 3940 3980 4000 ±3% B57451V5333+062

47 k ±3, ±5 8502 3940 3980 4000 ±3% B57451V5473+062

100 k ±3, ±5 8507 4386 4455 4480 ±3% B57452V5104+062

Temperature measurement and compensation B574**V5

SMD NTC thermistors, case size 0805 (2012) Automotive series

Page 2 of 19Please read Cautions and warnings and

Important notes at the end of this document.

Reliability data

Tests of SMD NTC thermistors are based on AEC-Q200 Rev-D. The parts are mounted on

standardized PCB.

Test Standard Test conditions ∆R25/R25

(typical)

Remarks

Pre- and

post-stress

electrical test

Resistance at: 25 °C and 100 °C

High temperature

exposure

(storage)

MIL-STD-202,

method 108

Test temperature: 150 °C

Duration: 1000 h

Unpowered

< 5%

Temperature

cycling

JESD22,

method JA-104

Lower test temperature: 40 °C

Upper test temperature: 150 °C

Number of cycles: 1000

Transfer time: < 10 s

Dwell time: 15 min

Air Air

< 5%

Biased humidity MIL-STD-202,

method 103

Test temperature: 85 °C

Rel. humidity of air: 85%

Duration: 1000 h

Test voltage: VNTC = 0.3 V DC

< 5%

Operational life MIL-STD-202,

method 108

Test temperature: 150 °C

Pmax = 0.35 mW

Duration: 1000 h

< 5%

External visual MIL-STD-883E,

method 2009

Visual inspection

Physical

dimensions

JESD22,

method JB-100

Measured with calibers Within the

specified

values

Resistance to

solvents

MIL-STD-202,

method 215

Not applicable for SMD thermistors

(component has no marking, color

coding or coating)

Mechanical shock MIL-STD-202,

method 213

Peak value: 1500 g

Half sine

Condition F

< 5%

Vibration MIL-STD-202,

method 204

Acceleration: 5 g

Sweep time: 20 min

Frequency range: 10 ... 2000 Hz

3×12 cycles

< 5%

Resistance to

soldering heat

MIL-STD-202,

method 210

Dip: 260 °C; 10 s

1 heat cycle

< 3%

Temperature measurement and compensation B574**V5

SMD NTC thermistors, case size 0805 (2012) Automotive series

Page 3 of 19Please read Cautions and warnings and

Important notes at the end of this document.

Test Standard Test conditions ∆R25/R25

(typical)

Remarks

ESD AEC-Q200-002,

method -002

Discharge capacitance: 150 pF

Discharge resistance: 2 kΩ

Charging voltage: 6 kV

Contact discharge

2 pulses in each polarity

< 5%

Solderability J-STD-002 a) Dip: 235 °C; 5 s:

aging 4 h @ 155 °C

b) Dip: 215 °C; 5 s:

steam aging 8 h @ 92 °C

c) Dip: 260 °C; 7 s:

steam aging 8 h @ 92 °C

95% of

termination

wetted

Electrical

characterization

R(25 °C), R(100 °C), B(25/100) Within the

specified

values

Flammability UL-94,

V-0 or V-1

Not applicable for SMD thermistors

(component is not coated or

encapsulated with plastic materials)

Board flex AEC-Q200-005,

method -005

Max. bending: 2 mm

Duration @ max. bending: 60 s

< 5%

Terminal strength AEC-Q200-006,

method -006

Max. F: 17.7 N < 5%

Resistance drift

after soldering

Reflow soldering profile

Wave soldering profile

< 1%

Temperature measurement and compensation B574**V5

SMD NTC thermistors, case size 0805 (2012) Automotive series

Page 4 of 19Please read Cautions and warnings and

Important notes at the end of this document.

R/T characteristics

R/T No. 8500 8502 8507

T (°C) B25/100 = 3650 K B25/100 = 4000 K B25/100 = 4480 K

RT/R25 α(%/K) RT/R25 α(%/K) RT/R25 α(%/K)

55.0 63.917 6.8 96.158 7.4 142.71 7.9

50.0 45.889 6.5 66.892 7.1 96.913 7.6

45.0 33.344 6.3 47.127 6.9 66.637 7.4

40.0 24.504 6.1 33.606 6.6 46.366 7.1

35.0 18.201 5.8 24.243 6.4 32.629 6.9

30.0 13.657 5.6 17.681 6.2 23.213 6.7

25.0 10.347 5.5 13.032 6.0 16.686 6.5

20.0 7.9114 5.3 9.702 5.8 12.115 6.3

15.0 6.1019 5.1 7.2923 5.6 8.8803 6.1

10.0 4.7454 4.9 5.5314 5.4 6.5692 5.9

5.0 3.7198 4.8 4.2325 5.3 4.9025 5.8

0.0 2.938 4.6 3.2657 5.1 3.6896 5.6

5.0 2.3372 4.5 2.54 4.9 2.7994 5.4

10.0 1.8722 4.4 1.9907 4.8 2.1406 5.3

15.0 1.5096 4.2 1.5716 4.7 1.6492 5.1

20.0 1.2249 4.1 1.2494 4.5 1.2798 5.0

25.0 1.0000 4.0 1.0000 4.4 1.0000 4.9

30.0 0.82111 3.9 0.80552 4.3 0.78663 4.7

35.0 0.67798 3.8 0.65288 4.1 0.62277 4.6

40.0 0.56279 3.7 0.53229 4.0 0.4961 4.5

45.0 0.46958 3.6 0.43645 3.9 0.39757 4.4

50.0 0.39374 3.5 0.35981 3.8 0.32044 4.3

55.0 0.33171 3.4 0.29819 3.7 0.2597 4.1

60.0 0.28073 3.3 0.24837 3.6 0.21161 4.0

65.0 0.23863 3.2 0.20787 3.5 0.17331 3.9

70.0 0.2037 3.1 0.17479 3.4 0.14265 3.8

75.0 0.17459 3.0 0.14763 3.3 0.11799 3.8

80.0 0.15022 3.0 0.12523 3.2 0.098035 3.7

85.0 0.12975 2.9 0.10667 3.2 0.081823 3.6

90.0 0.11247 2.8 0.091227 3.1 0.068589 3.5

95.0 0.097838 2.8 0.078319 3.0 0.057735 3.4

100.0 0.085396 2.7 0.067488 2.9 0.048796 3.3

105.0 0.074781 2.6 0.058363 2.9 0.041403 3.2

110.0 0.065691 2.6 0.050647 2.8 0.035263 3.2

115.0 0.057883 2.5 0.044098 2.7 0.030143 3.1

120.0 0.051153 2.4 0.03852 2.7 0.025858 3.0

125.0 0.045335 2.4 0.033752 2.6 0.022258 3.0

130.0 0.040289 2.3 0.029663 2.6 0.019223 2.9

135.0 0.0359 2.3 0.026146 2.5 0.016655 2.8

140.0 0.032071 2.2 0.023111 2.4 0.014476 2.8

145.0 0.028723 2.2 0.020484 2.4 0.012619 2.7

150.0 0.025786 2.1 0.018203 2.3 0.011033 2.7

Temperature measurement and compensation B574**V5

SMD NTC thermistors, case size 0805 (2012) Automotive series

Page 5 of 19Please read Cautions and warnings and

Important notes at the end of this document.

Taping and packing

1 Taping of SMD NTC thermistors

Tape and reel packing according to IEC 60286-3.

Tape material: Cardboard or blister, tape width 8 ±0.30 mm

2 Reel packing

Dimensions in mm

8-mm tape

180-mm reel 330-mm reel

A 180 +0/3 330 +0/2.0

W18.4 +1.5/0 8.4 +1.5/0

W214.4 max. 14.4 max.

Temperature measurement and compensation B574**V5

SMD NTC thermistors, case size 0805 (2012) Automotive series

Page 6 of 19Please read Cautions and warnings and

Important notes at the end of this document.

Leader, trailer

Packing units for discrete chip

Case size Chip thickness Cardboard tape Blister tape ∅180-mm reel ∅330-mm reel

inch/mm th W Wpcs. pcs.

0402/1005 0.5 mm 8 mm 10000 50000

0603/1608 0.8 mm 8 mm 8 mm 4000 16000

0805/2012 0.8 mm 8 mm 4000 16000

1.2 mm 8 mm 3000 12000

1206/3216 0.8 mm 8 mm 3000 12000

1.2 mm 8 mm 3000 12000

3 Packing codes

The last two digits of the complete ordering code state the packing mode:

Last two digits

60 SMD Cardboard tape 180-mm reel packing

62 SMD Blister tape 180-mm reel packing

70 SMD Cardboard tape 330-mm reel packing

72 SMD Blister tape 330-mm reel packing

Temperature measurement and compensation B574**V5

SMD NTC thermistors, case size 0805 (2012) Automotive series

Page 7 of 19Please read Cautions and warnings and

Important notes at the end of this document.

Mounting instructions

1 Soldering

1.1 SMD NTC thermistors

SMD NTC thermistors can be provided with a nickel barrier termination or on special request with

silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommend-

ed as well as a proper cleaning of the PCB.

The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the

silver base metalization layer. This allows great flexibility in the selection of soldering parameters.

The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The

nickel barrier termination is suitable for all commonly-used soldering methods.

Note: SMD NTCs with AgPd termination are not approved for lead-free soldering.

Figure 1

SMD NTC thermistors, structure of nickel barrier termination

Temperature measurement and compensation B574**V5

SMD NTC thermistors, case size 0805 (2012) Automotive series

Page 8 of 19Please read Cautions and warnings and

Important notes at the end of this document.

1.2 Wave soldering

Temperature characteristic at component terminal with dual wave soldering

Solder joint profiles for silver/nickel/tin terminations

Temperature measurement and compensation B574**V5

SMD NTC thermistors, case size 0805 (2012) Automotive series

Page 9 of 19Please read Cautions and warnings and

Important notes at the end of this document.

1.3 Reflow soldering

Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D

Profile feature Sn-Pb eutectic assembly Pb-free assembly

Preheat and soak

- Temperature min Tsmin 100 °C 150 °C

- Temperature max Tsmax 150 °C 200 °C

- Time tsmin to tsmax 60 ... 120 s 60 ... 120 s

Average ramp-up rate TLto Tp3°C/ s max. 3 °C/ s max.

Liquidous temperature TL183 °C 217 °C

Time at liquidous tL60 ... 150 s 60 ... 150 s

Peak package body temperature Tp1) 220 °C ... 235 °C2) 245 °C ... 260 °C2)

Time (tP)3) within 5 °C of specified

classification temperature (Tc)tP20 s3) 30 s3)

Average ramp-down rate Tpto TL6°C/ s max. 6 °C/ s max.

Time 25 °C to peak temperature maximum 6 min maximum 8 min

1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.

2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.

3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.

Note: All temperatures refer to topside of the package, measured on the package body surface.

Number of reflow cycles: 3

Temperature measurement and compensation B574**V5

SMD NTC thermistors, case size 0805 (2012) Automotive series

Page 10 of 19Please read Cautions and warnings and

Important notes at the end of this document.

Solder joint profiles for silver/nickel/tin terminations

1.3.1 Recommended geometry of solder pads

Recommended maximum dimensions (mm)

Case size

inch/mm

ABC

0402/1005 0.6 0.6 1.7

0603/1608 1.0 1.0 3.0

0805/2012 1.3 1.2 3.4

1206/3216 1.8 1.2 4.5

1.3.2 Notes

Iron soldering should be avoided, hot air methods are recommended for repair purposes.

Temperature measurement and compensation B574**V5

SMD NTC thermistors, case size 0805 (2012) Automotive series

Page 11 of 19Please read Cautions and warnings and

Important notes at the end of this document.

2 Conductive adhesion

An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of

this method is that it involves no thermal stress. The adhesives used must be chemically inert.

3 Clamp contacting

Pressure contacting by means of clamps is particularly suitable for applications involving frequent

switching and high turn-on powers.

4 Cleaning, sealing and potting

Cleaning, sealing or potting processes can affect the reliability of components.

If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are rec-

ommended. Cleaning agents based on water are not allowed.

When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused

by thermal expansion during the production process (curing/ overmolding process) and during lat-

er operation. The upper category temperature of the thermistor must not be exceeded. Ensure

that the materials used (sealing/ potting compound and plastic material) are chemically neutral.

As thermistors are temperature sensitive components it should be considered that molding can af-

fect the thermal surrounding and may influence e.g. the response time.

Extensive testing is encouraged in order to determine whether overmolding or potting influences

the functionality and/ or reliability of the component.

5 Storage

In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.

Humidity, temperature and container materials are critical factors.

Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing ma-

terial may be deformed or SMDs may stick together, causing problems during mounting. After

opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.

The components should be left in the original packing. Touching the metallization of unsoldered

thermistors may change their soldering properties.

Storage temperature: 25 °Cupto45°C

Relative humidity (without condensation): ≤75% annual mean

<95%, maximum 30 days per annum

Solder the thermistors listed in this data book after shipment from EPCOS within the time speci-

fied:

SMDs: 12 months for Ni-barrier termination

6 months for AgPd termination

Temperature measurement and compensation B574**V5

SMD NTC thermistors, case size 0805 (2012) Automotive series

Page 12 of 19Please read Cautions and warnings and

Important notes at the end of this document.

6 Placement and orientation of SMD NTC thermistors on PCB

a) Component placement

It is recommended that the PC board

should be held by means of some

adequate supporting pins such as

shown left to prevent the SMDs from

being damaged or cracked.

b) Cracks

When placing a component near an

area which is apt to bend or a grid

groove on the PC board, it is advisable

to have both electrodes subjected to

uniform stress, or to position the

component's electrodes at right angles

to the grid groove or bending line (see

c) Component orientation).

c) Component orientation

Choose a mounting position that

minimizes the stress imposed on the

chip during flexing or bending of the

board.

Temperature measurement and compensation B574**V5

SMD NTC thermistors, case size 0805 (2012) Automotive series

Page 13 of 19Please read Cautions and warnings and

Important notes at the end of this document.

Cautions and warnings

General

See "Important notes".

Storage

Store thermistors only in original packaging. Do not open the package prior to processing.

Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative

humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is

inadmissible.

Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the

packing material may be deformed or components may stick together, causing problems during

mounting.

Avoid contamination of thermistor surface during storage, handling and processing.

Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc).

Use the components as soon as possible after opening the factory seals, i.e. the

polyvinyl-sealed packages.

Solder SMD NTC thermistors within the time specified after shipment from EPCOS. For SMD

components with nickel barrier termination 12 months, for SMD components with AgPd

termination 6 months.

Handling

NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused

during handling of NTCs.

Do not touch components with bare hands. Gloves are recommended.

Avoid contamination of thermistor surface during handling.

Washing processes may damage the product due to the possible static or cyclic mechanical

loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,

which might lead to reduced reliability or lifetime.

Soldering

Use resin-type flux or non-activated flux.

Insufficient preheating may cause ceramic cracks.

Rapid cooling by dipping in solvent is not recommended.

Complete removal of flux is recommended.

Temperature measurement and compensation B574**V5

SMD NTC thermistors, case size 0805 (2012) Automotive series

Page 14 of 19Please read Cautions and warnings and

Important notes at the end of this document.

Mounting

Ensure that no thermo-mechanical stress occurs due to production processes (curing or

overmolding processes) when thermistors are sealed, potted or overmolded or during their

subsequent operation. The maximum temperature of the thermistor must not be exceeded.

Ensure that the materials used (sealing/potting compound and plastic material) are chemically

neutral.

Electrodes/contacts must not be scratched or damaged before/during/after the mounting

process.

Contacts and housing used for assembly with the thermistor must be clean before mounting.

Ensure that adjacent materials are designed for operation at temperatures comparable to the

surface temperature of the thermistor. Be sure that surrounding parts and materials can

withstand the temperature.

Avoid contamination of the thermistor surface during processing.

The connections of sensors (e.g. cable end, wire end, plug terminal) may only be exposed to

an environment with normal atmospheric conditions.

Avoid using chemical substances as mounting aids. It must be ensured that no water or other

liquids enter the NTC thermistors (e.g. through plug terminals). In particular, water based

substances (e.g. soap suds) must not be used as mounting aids for sensors.

Operation

Use thermistors only within the specified operating temperature range.

Use thermistors only within the specified power range.

Environmental conditions must not harm the thermistors. Only use the thermistors under

normal atmospheric conditions or within the specified conditions.

Contact of NTC thermistors with any liquids and solvents should be prevented. It must be

ensured that no water enters the NTC thermistors (e.g. through plug terminals). For

measurement purposes (checking the specified resistance vs. temperature), the component

must not be immersed in water but in suitable liquids (e.g. perfluoropolyethers such as Galden).

Avoid dewing and condensation unless thermistor is specified for these conditions.

Be sure to provide an appropriate fail-safe function to prevent secondary product damage

caused by malfunction.

This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.

Temperature measurement and compensation B574**V5

SMD NTC thermistors, case size 0805 (2012) Automotive series

Page 15 of 19Please read Cautions and warnings and

Important notes at the end of this document.

Symbols and terms

Symbol English German

A Area Fläche

B B value B-Wert

B25/100 B value determined by resistance

measurement at 25 °C and 100 °C

B-Wert, ermittelt durch Widerstands-

messungen bei 25 °C und 100 °C

Cth Heat capacitance Wärmekapazität

I Current Strom

N Number (integer) Anzahl (ganzzahliger Wert)

P25 Maximum power at 25 °C Maximale Leistung bei 25 °C

Pdiss Power dissipation Verlustleistung

Pel Electrical power Elektrische Leistung

Pmax Maximum power within stated

temperature range

Maximale Leistung im

angegebenenTemperaturbereich

∆RB/RBResistance tolerance caused by

spread of B value

Widerstandstoleranz, die durch die

Streuung des B-Wertes verursacht wird

Rins Insulation resistance Isolationswiderstand

RPParallel resistance Parallelwiderstand

RRRated resistance Nennwiderstand

∆RR/RRResistance tolerance Widerstandstoleranz

RSSeries resistance Serienwiderstand

RTResistance at temperature T

(e.g. R25 = resistance at 25 °C)

Widerstand bei Temperatur T

(z.B. R25 = Widerstand bei 25 °C)

T Temperature Temperatur

∆T Temperature tolerance Temperaturtoleranz

t Time Zeit

TAAmbient temperature Umgebungstemperatur

Tmax Upper category temperature Obere Grenztemperatur

(Kategorietemperatur)

Tmin Lower category temperature Untere Grenztemperatur

(Kategorietemperatur)

Top Operating temperature Betriebstemperatur

TRRated temperature Nenntemperatur

Tsurf Surface temperature Oberflächentemperatur

V Voltage Spannung

Vins Insulation test voltage Isolationsprüfspannung

Vop Operating voltage Betriebsspannung

Vtest Test voltage Prüfspannung

Temperature measurement and compensation B574**V5

SMD NTC thermistors, case size 0805 (2012) Automotive series

Page 16 of 19Please read Cautions and warnings and

Important notes at the end of this document.

Symbol English German

αTemperature coefficient Temperaturkoeffizient

∆Tolerance, change Toleranz, Änderung

δth Dissipation factor Wärmeleitwert

τcThermal cooling time constant Thermische Abkühlzeitkonstante

τaThermal time constant Thermische Zeitkonstante

Abbreviations / Notes

Symbol English German

Surface-mounted devices Oberflächenmontierbares Bauelement

* To be replaced by a number in ordering

codes, type designations etc.

Platzhalter für Zahl im Bestellnummern-

code oder für die Typenbezeichnung.

+ To be replaced by a letter. Platzhalter für einen Buchstaben.

All dimensions are given in mm. Alle Maße sind in mm angegeben.

The commas used in numerical values

denote decimal points.

Verwendete Kommas in Zahlenwerten

bezeichnen Dezimalpunkte.

Temperature measurement and compensation B574**V5

SMD NTC thermistors, case size 0805 (2012) Automotive series

Page 17 of 19Please read Cautions and warnings and

Important notes at the end of this document.

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for

certain areas of application. These statements are based on our knowledge of typical re-

quirements that are often placed on our products in the areas of application concerned. We

nevertheless expressly point out that such statements cannot be regarded as binding

statements about the suitability of our products for a particular customer application.

As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar

with them than the customers themselves. For these reasons, it is always ultimately incum-

bent on the customer to check and decide whether an EPCOS product with the properties de-

scribed in the product specification is suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or

failure before the end of their usual service life cannot be completely ruled out in the

current state of the art, even if they are operated as specified. In customer applications

requiring a very high level of operational safety and especially in customer applications in

which the malfunction or failure of an electronic component could endanger human life or

health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by

means of suitable design of the customer application or other action taken by the customer

(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by

third parties in the event of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this

publication may contain substances subject to restrictions in certain jurisdictions (e.g.

because they are classed as hazardous). Useful information on this will be found in our Ma-

terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-

tailed questions, please contact our sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this

publication may change from time to time. The same is true of the corresponding product

specifications. Please check therefore to what extent product descriptions and specifications

contained in this publication are still applicable before or when you place an order. We also

reserve the right to discontinue production and delivery of products. Consequently, we

cannot guarantee that all products named in this publication will always be available. The

aforementioned does not apply in the case of individual agreements deviating from the fore-

going for customer-specific products.

6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-

sion of the "General Terms of Delivery for Products and Services in the Electrical In-

dustry" published by the German Electrical and Electronics Industry Association

(ZVEI).

Important notes

Page 18 of 19

7. The trade names EPCOS, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CSSP, CTVS,

DeltaCap, DigiSiMic, DSSP, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD,

MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PQSine, SIFERRIT,

SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, TFAP,

ThermoFuse, WindCap are trademarks registered or pending in Europe and in other coun-

tries. Further information will be found on the Internet at www.epcos.com/trademarks.

Important notes

Page 19 of 19

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

EPCOS:

B57451V5333J62 B57452V5104J62 B57451V5103J62 B57452V5472J62 B57452V5103J62

EPCOS / TDK:

B57451V5333H62 B57442V5472H62 B57452V5472H62 B57442V5472J62 B57451V5103H62 B57452V5104H62

B57452V5103H62 B57442V5472J062 B57452V5104H062 B57442V5472H062 B57452V5472H062