DS-RM25C32DS–124B–11/2016
Features
Memory array: 32Kbit non-volatile serial EEPROM memory
Single supply voltage: 1.65V - 3.6V
Serial peripheral interface (SPI) compatible
-Supports SPI modes 0 and 3
1.6 MHz maximum clock rate for normal read
10 MHz maximum clock rate for fast read
Flexible Programming
- Byte/Page Program (1 to 32Bytes)
- Page size: 32 Bytes
64-byte, One-Time Programmable (OTP) Security Register
- 32 bytes factory programmed with a unique identifier
- 32 bytes user programmable
Low Energy Byte Write
-Byte Write consuming 50 nJ
Low power consumption
-0.20 mA active Read current (Typical)
-0.7 mA active Write current (Typical)
-0.5 µA ultra deep power-down current
Auto Ultra-Deep Power-Down
-Device can enter Ultra-Deep Power-Down automatically after finishing a Write
operation
Fast write
-Page Write in 1.5 ms (32 byte page)
-Byte Write within 60 µs
Industry’s lowest read cycle latency
Unlimited read cycles
Hardware reset
Page or chip erase capability
8-lead SOIC, TSSOP and UDFN packages
RoHS-compliant and halogen-free packaging
Data Retention: >40 years at 125°C
Endurance: 100,000 write cycles (for both byte and page write cycles)
- No degradation across temperature range
No data loss under UV exposure on bare die or WLCSP
Based on Adesto's proprietary CBRAM® technology
Description
The Adesto® RM25C32DS is a 32Kbit, serial EEPROM memory device that utilizes
Adesto's CBRAM® resistive memory technology. The memory devices use a single
low-voltage supply ranging from 1.65V to 3.6V.
RM25C32DS
32-Kbit 1.65V Minimum
Non-volatile Serial EEPROM
SPI Bus
Advance Datasheet
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The RM25C32DS is accessed through a 4-wire SPI interface consisting of a Serial Data Input (SDI), Serial Data Output
(SDO), Serial Clock (SCK), and Chip Select (CS). The maximum clock (SCK) frequency in normal read mode is 1.6MHz.
In fast read mode the maximum clock frequency is 20MHz.
Adesto's EEPROM endurance can be as much as 40X higher than industry standard EEPROM devices operating in byte
write mode at 85°C. Unlike EEPROMs based on floating gate technology (which require read-modify-write on a whole
page for every write operation) CBRAM write endurance is based on the capability to write each byte individually,
irrespective of whether the user writes single bytes or an entire page. Additionally, unlike floating gate technology,
CBRAM does not experience any degradation of endurance across the full temperature range. By contrast, in order to
modify a single byte, most EEPROMs modify and write full pages of 32, 64 or 128 bytes. This provides significantly less
endurance for floating gate devices used in byte write mode when compared to page write mode.
The device supports direct write eliminating the need to pre-erase. Writing into the device can be done from 1 to 32 bytes
at a time. All writing is internally self-timed. For compatibility with other devices, the device also features an Erase
function which can be performed on 32-byte pages or on the whole chip.
The device has both Byte Write and Page Write capability. Page Write is from 1 to 32 bytes. The Byte Write operation of
CBRAM consumes only 10% of the energy consumed by a Byte Write operation of EEPROM devices of similar size.
The Page Write operation of CBRAM is 4-6 times faster than the Page Write operation of similar EEPROM devices.
Both random and sequential reads are available. Sequential reads are capable of reading the entire memory in one
operation.
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1. Block Diagram
Figure 1-1. Block Diagram
SPI
Interface
CS
SDO
WP
GND
SCK
SDI
HOLD
Status
Registers
&
Control
Logic
I/O Buffers and Data
Latches
Y-Decoder
X-Decoder
Address
Latch
&
Counter
VCC
Page Buffer
32 Kb
CBRAM
Memory
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2. Absolute Maximum Ratings
Table 2-1. Absolute Maximum Ratings(1)
1. CAUTION: Stresses greater than Absolute Maximum Ratings may cause permanent damage to the devices. These
are stress ratings only, and operation of the device at these, or any other conditions outside those indicated in other
sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods
may reduce device reliability.
Parameter Specification
Operating ambient temp range -40°C to +85°C
Storage temperature range -65°C to +150°C
Input supply voltage, VCC to GND - 0.3V to 3.6V
Voltage on any pin with respect to GND -0.5V to (VCC + 0.5V)
ESD protection on all pins (Human Body Model) >2kV
Junction temperature 125°C
DC output current 5mA
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3. Electrical Characteristics
3.1 DC Operating Characteristics
Applicable over recommended operating range: TA = -40°C to +85° C, VCC = 1.65V to 3.6V
Symbol Parameter Condition Min Typ Max Units
TA=‐40°Cto+85°C,
VCC=1.65Vto3.6V
VCC Supply Range (1)
1. A low ESR 100nF capacitor should be connected between each supply pin and GND.
1.65 3.6 V
VVccI VCC Inhibit 1.55 V
ICC1 Supply current, Fast
Read
VCC= 3.3V SCK at 10 MHz
0.4 0.6 mA
SDO = Open, Read
ICC2
Supply Current,
Read Operation
VCC= 3.3V SCK at 1.0 MHz
SDO = Open, Read 0.18 0.2 mA
ICC3
Supply Current,
Program or Erase VCC= 3.3V, CS = VCC 0.7 1.3 mA
ICC4
Supply Current,
Standby, LPSE=0
VCC= 3.3V, CS = VCC
@25C71 77
µA
@85C89 97
Supply Current,
Standby, LPSE=1
@25C34 39
@85C52 61
Supply Current, Standby,
Auto Power Down
enabled
@25C1.6 2.7
@85C 9 12
ICC5
Supply Current,
Power Down VCC= 3.3V Power Down
@25C1.6 2.8
µA
@85C 9 12
ICC6
Supply Current,
Ultra Deep Power Down
Vcc = 3.3V,
Ultra Deep Power Down
@25C0.04 0.15
µA
@85C0.5 0.7
IIL Input Leakage SCK, SDI,CS,HOLD,WP
VIN=0V to VCC
1µA
IOL Output Leakage SDO ,CS=VCC
VIN=0V to VCC
1µA
VIL Input Low Voltage SCK, SDI,CS,HOLD,WP -0.3 VCC x 0.3 V
VIH Input High Voltage SCK, SDI,CS,HOLD,WP VCC x 0.7 VCC + 0.3 V
VOL Output Low Voltage IOL = 3.0mA 0.4 V
VOH Output High Voltage IOH = -100µA VCC - 0.2 V
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3.2 AC Operating Characteristics
Applicable over recommended operating range: TA = -40°C to +85° C, VCC = 1.65V to3.6V. CL = 1 TTL Gate plus 10pF
(unless otherwise noted)
Symbol Parameter Min Typ Max Units
fSCKF SCK Clock Frequency for Fast Read Mode 010 MHz
fSCK SCK Clock Frequency for Normal Read Mode 01.6 MHz
fAPD SCK Clock Frequency for Auto Power-Down Mode 01.0 MHz
tRI SCK Input Rise Time 1µs
tFL SCK Input Fall Time 1µs
tSCKH SCK High Time 7.5 ns
tSCKL SCK Low Time 7.5 ns
tCS CS High Time 100 ns
tCL CS Low Time 100 ns
tCSS CS Setup Time 10 ns
tCSH CS Hold Time 10 ns
tDS Data In Setup Time 4ns
tDH Data In Hold Time 4ns
tHS HOLD Setup Time 30 ns
tHD HOLD Hold Time 30 ns
tOV Output Valid 6.5 ns
tOH Output Hold Time Normal Mode 0 ns
tLZ HOLD to output Low Z 0200 ns
tHZ HOLD to output High Z 200 ns
tDIS Output Disable Time 100 ns
tPW Page Write Cycle Time, 32 byte page (up to 30K write cycles) 1.5 2.5
ms
Page Write Cycle Time, 32 byte page (up to 100K write cycles) 9
tBP Byte Write Cycle Time 60 100 µs
tPUD Vcc Power-up Delay (1)
1. VCC must be within operating range.
75 µs
tRPD Exit Power-Down Time 50 µs
tRESET Exit Ultra-Deep Power-Down Time 70 µs
tRDPD Chip Select High to Standby Mode 8µs
CIN SCK, SDI,CS,HOLD,WP VIN=0V 6pF
COUT SDO VIN=0V 8pF
Endurance 100,000 (2) Write Cycles
Retention 40 Years
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3.3 AC Test Conditions
4. Timing Diagrams
Figure 4-1. Synchronous Data Timing
Figure 4-2. Hold Timing
2. AdestomemoryproductsbasedonCBRAMtechnologyare“Direct‐Write”memories.Endurancecyclecalculationsfollow
JEDECspecificationJESD22‐A117B.Endurancedatacharacterizedat2.5V,+85°C.Endurancespecificationisidenticalforboth
byteandpagewrite(unlikecurrentEEPROMtechnologieswherebytewriteoperationsresultinlowerendurance).
AC Waveform
Timing Measurement
Reference Level
VLO = 0.2V
Input
Output
0.5 Vcc
0.5 Vcc
VHI = 3.4V
CL = 30pF (for 1.6 MHz SCK)
CL = 10pF (for 10 MHz SCK)
SDI
SCK
V
IH
V
IL
CS
V
IH
V
IL
V
IH
V
IL
VALID IN
t
CSS
t
SC KH
t
DS
t
DH
t
SC KL
SDO
V
IH
V
IL
HI-Z
t
OV
t
CS
t
CSH
HI-Z
t
DIS
t
OH
HZ
HOLD
SCK
CS
t
HD
t
HS
SDO
t
t
HD
t
LZ
t
HS
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Figure 4-3. Power-up Timing
5. Pin Descriptions and Pin-out
Table 5-1. Pin Descriptions
VCC
min
VCC
max
V
VCCI
Device in Reset
Program, Read, Erase and Write Commands Rejected
t
PUD
Device Fully
Accessible
TIME
VCC
Mnemonic Pin Number Pin Name Description
CS 1Chip Select
Making CS low activates the internal circuitry for device operation.
Making CS high deselects the device and switches into standby
mode to reduce power. When the device is not selected (CS high),
data is not accepted via the Serial Data Input pin (SDI) and the
Serial Data Output pin (SDO) remains in a high-impedance state.
To minimize power consumption, the master should ensure that
this pin always has a valid logic level.
SDO 2Serial Data Out
Sends read data or status on the falling edge of SCK. A pull-up
resistor, connected only when the device is in Ultra-Deep Power-
Down mode, ensures that the SDO line always has a valid logic
value.
WP 3Write Protect N/A
GND 4Ground
SDI 5Serial Data In
Device data input; accepts commands, addresses, and data on the
rising edge of SCK.
To minimize power consumption, the master should ensure that
this pin always has a valid logic level.
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Figure 5-1. Pin Out
SCK 6Serial Clock
Provides timing for the SPI interface. SPI commands, addresses,
and data are latched on the rising edge on the Serial Clock signal,
and output data is shifted out on the falling edge of the Serial Clock
signal.
To minimize power consumption, the master should ensure that
this pin always has a valid logic level.
HOLD 7Hold When pulled low, serial communication with the master device is
paused, without resetting the serial sequence.
Vcc 8Power Power supply pin.
Mnemonic Pin Number Pin Name Description
SOIC, UDFN and TSSOP
SPI
1
CS
2
3
4
SDO
WP
GND
8
7
6
5
VCC
HOLD
SCK
SDI
1 0
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6. SPI Modes Description
Multiple Adesto SPI devices can be connected onto a Serial Peripheral Interface (SPI) serial bus controlled by an SPI
master, such as a microcontroller, as shown in Figure 6-1.
Figure 6-1. Connection Diagram, SPI Master and SPI Slaves
The Adesto RM25C32DS supports two SPI modes: Mode 0 (0, 0) and Mode 3 (1, 1). The difference between these two
modes is the clock polarity when the SPI master is in standby mode (CS high). In Mode 0, the Serial Clock (SCK) stays
at 0 during standby. In Mode 3, the SCK stays at 1 during standby. An example sequence for the two SPI modes is
shown in Figure 6-2. For both modes, input data (on SDI) is latched in on the rising edge of Serial Clock (SCK), and
output data (SDO) is available beginning with the falling edge of Serial Clock (SCK).
Figure 6-2. SPI Modes
SDO
SPI Memory
Device
SPI Interface with
Mode 0 or Mode 3
SDI
SCK
SPI Master
(i.e. Microcontroller)
CS1CS2CS3
SCK SDO SDI
SPI Memory
Device
SPI Memory
Device
SCK SDO SDI SCK SDO SDI
CS CS CS
SDI
Mode 3 (1,1) SCK
SDO
Mode 0 (0,0) SCK
MSB
MSB
CS
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7. Registers
7.1 Instruction Register
The Adesto RM25C32DS uses a single 8-bit instruction register. The instructions and their operation codes are listed in
Table 7-1. All instructions, addresses, and data are transferred with the MSB first, and begin transferring with the first
low-to-high SCK transition after the CS pin goes low.
Table 7-1. Device Operating Instructions
7.2 Status Register Byte 1
The Adesto RM25C32DS uses a 2-byte Status Register. The Write In Progress (WIP) and Write Enable (WEL) status of
the device can be determined by reading the first byte of this register. The non-volatile configuration bits are also in the
first byte. The Status Register can be read at any time, including during an internally self-timed write operation.
Instruction Description
Operation
Code
Address
Cycles
Dummy
Cycles
Data
Cycles
WRSR Write Status
Register 01H 0 0 1
WR Write 1 to 32 bytes 02H 2 0 1-32
READ Read data from
memory array 03H 2 0 1 to ∞
FREAD Fast Read data
from data memory 0BH 2 1 1 to ∞
WRDI Write Disable 04H 0 0 0
RDSR Read Status
Register 05H 0 0 1 to ∞
WREN Write Enable 06H 0 0 0
PERS Page Erase
32 bytes 42H 2 0 0
CERS Chip Erase
60H 0 0 0
C7H 0 0 0
WRSR2 Write Status
Register2 31H 0 0 1
PD Power-Down B9H 0 0 0
ROTPSR Read the OTP
Security Register 77H 0 0 1-64
UDPD Ultra-Deep Power-
Down 79H 0 0 0
POTPSR
Programming the
OTP Security
Register
9BH 0 0 3
RES Resume from
Power-Down ABH 0 0 0
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The Status Register Byte 1 format is shown in Table 7-2. The Status Register Byte 1 bit definitions are shown in Table 7-
3.
Table 7-2. Status Register Byte 1 Format
Table 7-3. Status Register Byte 1 Bit Definitions
7.3 Status Register Byte 2
The Adesto RM25C32DS uses the second byte in the Status Register to hold volatile configuration bits. The Status
Register Byte 2 format is shown in table Table 7-4. The Status Register Byte 2 bit definitions are shown in table Table 7-
5.
Table 7-4. Status Register Byte 2 Format
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SRWD APDE LPSE 0BP1 BP0 WEL WIP
Bit Name Description R/W Non-Volatile Bit
0WIP
Write In Progress
“0” indicates the device is ready
“1” indicates that the program/erase cycle is in progress and the device is busy
RNo
1WEL
Write Enable Latch
“0” Indicates that the device is disabled
“1” indicates that the device is enabled
R/W No
2BP0 Block Protection Bits. "0" indicates the specific blocks are not protected.
"1" indicates that the specific blocks are protected. R/W Yes
3BP1
4UDPD
Ultra-Deep Power-Down Status.
Read as “0” if device is in Standby or in an active read/write operation, Read as
“1” if device is in Ultra-Deep Power-Down. Reading this bit after power-up or
after exiting Ultra-Deep Power-Down will indicate when the device is ready for
operation.
RNo
5LPSE
Low Power Standby Enable.
"0" indicates that the device will not use Low Power Standby Mode.
"1" indicates that the device will use Low Power Standby Mode.
R/W Yes
6APDE
Auto Power-Down Enable.
"0" indicates that the device will use Standby Mode.
"1" indicates that the device will use Power-Down Mode instead of Standby
Mode.
R/W Yes
7SRWD WP pin enable.
See Table 8-1. R/W Yes
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
000000SLOWOSC AUDPD
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Table 7-5. Status Register Byte 2 Bit Definitions
8. Write Protection
The Adesto RM25C32DS has two protection modes: hardware write protection, via the WP pin associated with the
SRWD bit in the Status Register, and software write protection in the form of the SRWD, WEL, BP0, and BP1 bits in the
Status Register.
8.1 Hardware Write Protection
There are three hardware write protection features:
• All write instructions must have the appropriate number of clock cycles before CS goes high or the write instruction
will be ignored.
• If the VCC is below the VCC Inhibit Voltage (VVccI, see DC Characteristics), all Read, Write, and Erase sequence
instructions will be ignored.
• The WP pin provides write protection for the Status Register. When WP is low, the Status Register is write
protected if the SRWD bit in the Status Register is High. When WP is high, the Status Register is writable independent of
the SRWD bit. See Table 8-1.
Bit Name Description R/W Non-Volatile Bit
0AUDP
D
Auto Ultra-Deep Power-Down Mode after Write Operation
“1” specifies that the device will enter the Ultra-Deep Power-Down mode after a
Write operation is completed.
“0” specifies that the device will enter the Standby mode after a Write operation
is completed.
R/W No
1SLOW
OSC
Slow Oscillator During Write Operation
"1" specifies that during the self-times Write operation the device will periodically
slow down on-chip oscillator.
"0" specifies that during the self-times Write operation the device will not slow
down on-chip oscillator
R/W No
2 N/A Reserved. Read as “0” N/A No
3 N/A Reserved. Read as “0” N/A No
4 N/A Reserved. Read as “0” N/A No
5 N/A Reserved. Read as “0” N/A No
6 N/A Reserved. Read as “0” N/A No
7 N/A Reserved. Read as “0” N/A No
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Table 8-1. Hardware Write Protection on Status Register
8.2 Software Write Protection
There are two software write protection features:
• Before any program, erase, or write status register instruction, the Write Enable Latch (WEL) bit in the Status
Register must be set to a one by execution of the Write Enable (WREN) instruction. If the WEL bit is not enabled, all
program, erase, or write register instructions will be ignored.
• The Block Protection bits (BP0 and BP1) allow a part or the whole memory area to be write protected.
See Table 8-2.
Table 8-2. Block Write Protect Bits
9. Reducing Energy Consumption
In normal operation, when the device is idle, (CS is high, no Write or Erase operation in progress), the device is in
Standby Mode, waiting for the next command. To reduce device energy consumption, the Power-Down or Ultra-Deep
Power-Down modes may be used.
To minimize power consumption, the master should ensure that the SCK, SDI and CS pins always has a valid logic level, these
pins should not be left floating when the device is in Standby, Power-Down or Ultra-Deep Power-Down modes.
9.1 Power-Down Mode
Power-Down mode allows the user to reduce the power of the device to its lowest power consumption state. The PD
command is used to instruct the device to enter Power-Down mode.
All instructions given during the Power-Down mode are ignored except the Resume From Power-Down (RES)
instruction. Therefore this mode can be used as an additional software write protection feature.
9.2 Ultra-Deep Power-Down Mode
The Ultra-Deep Power-Down mode allows the device to further reduce its energy consumption compared to the existing
Standby and Power-Down modes by shutting down additional internal circuitry. The UDPD command is used to instruct
the device to enter Ultra-Deep Power-Down mode.
SRWD WP
Status
Register
0Low Writable
1Low Protected
0High Writable
1High Writable
BP1 BP0 Protected Region RM25C32DS
Protected Address Protected Area Size
00None None 0
01Top ¼ 6000-7FFF 8K bytes
10Top ½ 4000-7FFF 16K bytes
11All 0-7FFF All
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When the device is in the Ultra-Deep Power-Down mode, all commands including the Read Status Register and Resume
From Power-Down commands will be ignored. Since all commands will be ignored, the mode can be used as an extra
protection mechanism against inadvertent or unintentional program and erase operations.
To test if the device is in Ultra-Deep Power-Down mode without risk of bringing it out of Ultra-Deep Power-Down mode,
use the Read Status Register Byte 1 instruction. The UDPD bit in Status Register Byte 1 will be 1 (pulled high by the
internal pull-up resistor) if the device is in Ultra-Deep Power-Down mode, 0 otherwise.
Only the Exit Ultra-Deep Power-Down signal sequences described in Section 10.15 will bring the device out of the Ultra-
Deep Power-Down mode.
9.3 Auto Ultra-Deep Power-Down Mode after Write Operation
The Auto Ultra-Deep Power-Down Mode after Write Operation allows the device to further reduce its energy
consumption by automatically entering the Ultra-Deep Power-Down Mode after completing an internally timed Write
operation. The operation can be any one of the commands WR (Write), or WRSR (Write Status Register). Note that the
WRSR2 command does not cause the device to go into Ultra-Deep Power-Down Mode.
Only the Exit Ultra-Deep Power-Down signal sequences described in Section 10.15 will bring the device out of the Ultra-
Deep Power-Down Mode.
9.4 Auto Power-Down Enable
For frequencies lower than fAPD (see AC Operating Characteristics), the APDE bit in the Status Register may be enabled.
The device will then automatically enter Power-Down mode instead of Standby mode when idle. (CS is high, no Write or
Erase operation in progress).
In this mode, the device will behave normally to all commands, and will leave Power-Down mode once CS is pulled
down.
If Auto Power-Down is enabled, and the SCK Clock Frequency is increased to a speed higher than fAPD, the device may
not react as expected to the command. Before changing SCK frequency, the APDE bit in the Status Register must be
disabled.
Note that the PD or UDPD commands may still be used as additional software write protection features when Auto
Power-Down is enabled. Note that if the PD command is issued while Auto Power-Down is enabled, the device will enter
Power-Down mode, and all instructions given will be ignored except the Resume From Power-Down (RES) instruction.
The device will not wake up immediately after CS is pulled down.
9.5 Low Power Standby Enable
For frequencies lower than fAPD (see AC Operating Characteristics), the LPSE bit in the Status Register may be enabled.
The device will then automatically enter Low Power Standby mode when idle. (CS is high, no Write or Erase operation in
progress).
In this mode, the device will behave normally to all commands, and will leave Low Power Standby mode once CS is
pulled down.
If Low Power Standby Mode is enabled, and the SCK Clock Frequency is increased to a speed higher than fAPD, the
device may not react as expected to the command. Before changing SCK frequency, the LPSE bit in the Status Register
must be disabled.
Note that the PD or UDPD commands may still be used as additional software write protection features when Low Power
Standby Mode is enabled. Note that if the PD command is issued while Low Power Standby Mode is enabled, the device
will enter Power-Down mode, and all instructions given will be ignored except the Resume From Power-Down (RES)
instruction. The device will not wake up immediately after CS is pulled down.
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9.6 Slow Oscillator During Write Operation
The Slow Oscillator During Write Operation mode allows the device to further reduce its average current consumption by
periodically slowing down the internal oscillator. This creates a duty cycle effect with time periods of high activity followed
by timer periods of low activity. While this operating mode will increase the effective Write time, the average current over
this Write time will be lower compared to the mode without this feature.
9.7 Exit Ultra-Deep Power-Down mode
Only the Exit Ultra-Deep Power-Down signal sequences described in Section 10.15 will bring the device out of the Ultra-
Deep Power-Down mode.
10. Command Descriptions
10.1 WREN (Write Enable, 06h):
The device powers up with the Write Enable Latch set to zero. This means that no write or erase instructions can be
executed until the Write Enable Latch is set using the Write Enable (WREN) instruction. The Write Enable Latch is also
set to zero automatically after any non-read instruction. Therefore, all page programming instructions and erase
instructions must be preceded by a Write Enable (WREN) instruction. The sequence for the Write Enable instruction is
shown in Figure 10-1.
Figure 10-1. WREN Sequence (06h)
Table 10-1 is a list of actions that will automatically set the Write Enable Latch to zero when successfully executed. If an
instruction is not successfully executed, for example if the CS pin is brought high before an integer multiple of 8 bits is
clocked, the Write Enable Latch will not be reset.
Table 10-1. Write Enable Latch to Zero
Instruction/Operation
Power-Up
WRDI (Write Disable)
WR (Write)
WRSR (Write Status Register)
WRSR2 (Write Status Register2)
SDI
SCK
SDO
CS
01234567
HI-Z
00000110
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10.2 WRDI (Write Disable, 04h):
To protect the device against inadvertent writes, the Write Disable instruction disables all write modes. Since the Write
Enable Latch is automatically reset after each successful write instruction, it is not necessary to issue a WRDI instruction
following a write instruction. The WRDI instruction is independent of the status of the WP pin. The WRDI sequence is
shown in Figure 10-2.
Figure 10-2. WRDI Sequence (04h)
10.3 RDSR (Read Status Register Byte 1, 05h):
The Read Status Register Byte 1 instruction provides access to the Status Register and indication of write protection
status of the memory.
Caution: The Write In Progress (WIP) and Write Enable Latch (WEL) indicate the status of the device. The RDSR sequence is
shown in Figure 10-3.
Figure 10-3. RDSR Sequence (05h)
10.4 WRSR (Write Status Register Byte 1, 01h):
The Write Status Register (WRSR) instruction allows the user to select one of three levels of protection. The memory
array can be block protected (see Table 8-2) or have no protection at all. The SRWD bit (in conjunction with the WP pin)
sets the write status of the Status Register (see Table 8-1).
PERS (Page Erase)
CERS (Chip Erase)
PD (Power-Down)
Instruction/Operation
SDI
SCK
SDO
CS
01234567
HI-Z
00000100
SDI
SCK
SDO
CS
01234567
HI-Z
89101112131415
765 432 10
00000101
WEL WIP
1 8
RM25C32DS
DS-RM25C32DS–124B–11/2016
Only the BP0, BP1, APDE, LPSE and SRWD bits are writable and are nonvolatile cells. When the WP pin is low, and the
SRWD bit in the Status Register is a one, a zero cannot be written to SRWD to allow the part to be writable. To set the
SRWD bit to zero, the WP pin must be high. The WRSR sequence is shown in Figure 10-4.
Figure 10-4. WRSR Sequence (01h)
10.5 WRSR2 (Write Status Register Byte 2, 31h):
The Write Status Register Byte 2 (WRSR2) instruction allows the user to set or clear the SLOWOSC or AUDPD bits.
The user must set the WEL bit before issuing this command. Once the device accepts the WRSR2 command the WIP bit
will be set to indicate that the device is busy. Once the device completes the operation, the WEL and WIP bits will be
automatically cleared.
The WRSR sequence is shown in Figure 10-5.
Figure 10-5. WRSR2 Sequence (31h)
10.6 READ (Read Data, 03h):
Reading the Adesto RM25C32DS via the Serial Data Output (SDO) pin requires the following sequence: First the CS line
is pulled low to select the device; then the READ op-code is transmitted via the SDI line, followed by the address to be
read (A15-A0). Although not all 16 address bits are used, a full 2 bytes of address must be transmitted to the device. For
the 32Kb device, only address A0 to A14 are used; the rest are don't cares and must be set to “0”.
Once the read instruction and address have been sent, any further data on the SDI line will be ignored. The data (D7-D0)
at the specified address is then shifted out onto the SDO line. If only one byte is to be read, the CS line should be driven
high after the byte of data comes out. This completes the reading of one byte of data.
The READ sequence can be automatically continued by keeping the CS low. At the end of the first data byte the byte
address is internally incremented and the next higher address data byte will be shifted out. When the highest address is
reached, the address counter will roll over to the lowest address (00000), thus allowing the entire memory to be read in
one continuous read cycle. The READ sequence is shown in Figure 10-6.
SDI
SCK
SDO
CS
012 456
HI-Z
3 7 8 9 10 11 12 13 14 15
7653210
STATUSINSTRUCTION
00110001 4
1 9
RM25C32DS
DS-RM25C32DS–124B–11/2016
Figure 10-6. Single Byte READ Sequence (03h)
10.7 FREAD (Fast Read Data, 0Bh):
The Adesto RM25C32DS also includes the Fast Read Data command, which facilitates reading memory data at higher
clock rates, up to 10 MHz. After the CS line is pulled low to select the device, the FREAD op-code is transmitted via the
SDI line. This is followed by the 2-byte address to be read (A15-A0) and then a 1-byte dummy. For the 32-Kbit device,
only address A0 to A14 are used; the rest are don't cares and must be set to "0".
The next 8 bits transmitted on the SDI are dummy bits. The data (D7-D0) at the specified address is then shifted out onto
the SDO line. If only one byte is to be read, the CS line should be driven high after the data comes out. This completes
the reading of one byte of data.
The FREAD sequence can be automatically continued by keeping the CS low. At the end of the first data byte, the byte
address is internally incremented and the next higher address data byte is then shifted out. When the highest address is
reached, the address counter rolls over to the lowest address (00000), allowing the entire memory to be read in one
continuous read cycle. The FREAD sequence is shown in Figure 10-7.
Figure 10-7. Two Byte FREAD Sequence (0Bh)
SDI
SCK
CS
01 2 4 56
HI-Z
3 7 8 9 10 11 20 21 22 23 24 25 26 27 28 29 30 31
15 14 13 3210
76543210
2 BYTE ADDRESS
DATA OUT
INSTRUCTION
00000011
SDI
SCK
CS
01 2 4 5 6
HI-Z
37891020 21 22
24 25 26 27 28 29 30 31
15 14 13 3210
76543210
2 BYTE ADDRESS
DATA BYTE 1 OUT
INSTRUCTION
00001011
SDO
65432107
DUMMY BYTE
23
32 33 34 35 36 37 38 39
7654 3210
DATA BYTE 2 OUT
40 41 42 43 44 45 46 47
SDI
SCK
SDO
CS
HI-Z
2 0
RM25C32DS
DS-RM25C32DS–124B–11/2016
10.8 WRITE (Write Data, 02h):
The Write (WR) instruction allows bytes to be written to the memory. But first, the device must be write-enabled via the
WREN instruction. The CS pin must be brought high after completion of the WREN instruction; then the CS pin can be
brought back low to start the WR instruction. The CS pin going high at the end of the WR input sequence initiates the
internal write cycle. During the internal write cycle, all commands except the RDSR instruction are ignored.
A WR instruction requires the following sequence: After the CS line is pulled low to select the device, the WR op-code is
transmitted via the SDI line, followed by the byte address (A15-A0) and the data (D7-D0) to be written. For the 32Kb
device, only address A0 to A14 are used; the rest are don't cares and must be set to “0”. The internal write cycle
sequence will start after the CS pin is brought high. The low-to-high transition of the CS pin must occur during the SCK
low-time immediately after clocking in the D0 (LSB) data bit.
The Write In Progress status of the device can be determined by initiating a Read Status Register (RDSR) instruction
and monitoring the WIP bit. If the WIP bit (Bit 0) is a “1”, the write cycle is still in progress. If the WIP bit is “0”, the write
cycle has ended. Only the RDSR instruction is enabled during the write cycle. The sequence of a one-byte WR is shown
in Figure 10-8.
Figure 10-8. One Byte Write Sequence (0Bh)
The Adesto RM25C32DS is capable of a 32-byte write operation.
For the RM25C32DS: After each byte of data is received, the six low-order address bits (A5-A0) are internally
incremented by one; the high-order bits of the address will remain constant. All transmitted data that goes beyond the
end of the current page are written from the start address of the same page (from the address whose 6 least significant
bits [A5-A0] are all zero). If more than 32 bytes are sent to the device, previously latched data are discarded and the last
32 data bytes are ensured to be written correctly within the same page. If less than 32 data bytes are sent to the device,
they are correctly written at the requested addresses without having any effects on the other bytes of the same page.
The Adesto RM25C32DS is automatically returned to the write disable state at the completion of a program cycle. The
sequence for a 32 byte WR is shown in Figure 10-9. Note that the Multi-Byte Write operation is internally executed by
sequentially writing the words in the Page Buffer.
NOTE: If the device is not write enabled (WREN) previous to the Write instruction, the device will ignore the write instruction and
return to the standby state when CS is brought high. A new CS falling edge is required to re initiate the serial communication.
Product Density Page Size (bytes)
RM25C32CDS 32 Kbit 32
SDI
SCK
CS
012 456
HI-Z
3 7 8 9 10 11 20 21 22 23 24 25 26 27 28 29 30 31
15 14 13 321076543210
2 BYTE ADDRESS DATA ININSTRUCTION
00000010
SDO
2 1
RM25C32DS
DS-RM25C32DS–124B–11/2016
Figure 10-9. WRITE Sequence (02h)
10.9 OTP Security Register
The RM25C32DS device contains a specialized One-Time Programmable Security Register that can be used for
purposes such as unique device serialization or locked key storage. The register is comprised of a total of 64 bytes that
is divided into two portions. The first 32 bytes (byte locations 0 through 31) of the Security Register are allocated as an
One-Time Programmable space. Once these 32 bytes have been programmed, they cannot be erased or
reprogrammed. The remaining 32 bytes of the register (byte locations 32 through 63) are factory programmed by Adesto
and will contain a unique value for each device. The factory programmed data is fixed and cannot be changed.
Access: Security Register
10.9.1 Programming the OTP Security Register (9Bh, 00h, 00h)
The user programmable portion of the Security Register does not need to be erased before it is programmed.
To program the Security Register, a 3-byte opcode sequence of 9Bh, 00h, and 00h must be clocked into the device. After
the last bit of the opcode sequence has been clocked into the device, the data for the contents of the 32-byte user
programmable portion of the Security Register must be clocked in.
After the last data byte has been clocked in, the CS pin must be deasserted to initiate the internally self-timed program
cycle. The programming of the Security Register should take place in a time of tP, during which time the RDY/BUSY bit in
the Status Register will indicate that the device is busy. If the device is powered-down during the program cycle, then the
contents of the 32-byte user programmable portion of the Security Register cannot be guaranteed.
If the full 32 bytes of data are not clocked in before the CS pin is deasserted, then the values of the byte locations not
clocked in cannot be guaranteed.
SDI
SCK
CS
012 456
HI-Z
3 7 8 9 10 11 20 21 22 23 24 25 26 27 28 29 30 31
15 14 13 321076543210
2 BYTE ADDRESS DATA BYTE 1INSTRUCTION
00000010
SDO
SDI
SCK
32
HI-Z
76543210
SDO
76543210
DATA BYTE 2
33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
76543210
DATA BYTE 3 DATA BYTE N (N= 32,64)
CS
Security Register Byte Number
0 1 · · · 31 32 33 · · · 63
Data Type One-Time User Programmable Factory Programmed by Adesto
2 2
RM25C32DS
DS-RM25C32DS–124B–11/2016
Example: If only the first two bytes are clocked in instead of the complete 32 bytes, then the remaining 30 bytes of the
user programmable portion of the Security Register cannot be guaranteed. Furthermore, if more than
32 bytes of data is clocked into the device, then the data will wrap back around to the beginning of the
register. For example, if 33 bytes of data are clocked in, then the 33rd byte will be stored at byte location 0
of the Security Register.
Warning: The user programmable portion of the Security Register can only be programmed one time. Therefore, it is
not possible, for example, to only program the first two bytes of the register and then program the remaining
30 bytes at a later time.
The Program Security Register command utilizes the internal buffer for processing. Therefore, the contents
of the Buffer will be altered from its previous state when this command is issued.
Figure 10-10.Program Security Register
10.9.2 Reading the OTP Security Register (77h)
To read the Security Register, an opcode of 77h and two bytes of 00h must be clocked into the device. After the last
dummy bit has been clocked in, the contents of the Security Register can be clocked out on the SO pin. After the last
byte of the Security Register has been read, additional pulses on the SCK pin will result in undefined data being output
on the SO pin.
Deasserting the CS pin will terminate the Read Security Register operation and put the SO pin into a high-impedance
state.
Figure 10-11.Read Security Register
10.10 PERS (Page Erase 32 bytes, 42h):
Page Erase sets all bits inside the addressed 32-byte page to a 1. A Write Enable (WREN) instruction is required prior to
a Page Erase. After the WREN instruction is shifted in, the CS pin must be brought high to set the Write Enable Latch.
The Page Erase sequence is initiated by bringing the CS pin low; this is followed by the instruction code, then 2 address
bytes. Any address inside the page to be erased is valid. This means the bottom six bits (A5-A0) of the address are
ignored. Once the address is shifted in, the CS pin is brought high, which initiates the self-timed Page Erase function.
The WIP bit in the Status Register can be read, using the RDSR instruction, to determine when the Page Erase cycle is
complete.
The sequence for the PERS is shown in Figure 10-12.
Data
1
9Bh 00h 00h Data
2Data
63
CS
SI
Each transition represents eight bits
Data
0
77h 00h 00h
Data
0
Data
1
CS
Data
x
SI
SO
Each transition represents eight bits
2 3
RM25C32DS
DS-RM25C32DS–124B–11/2016
Figure 10-12.PERS Sequence (42h)
10.11 CERS (Chip Erase):
Chip Erase sets all bits inside the device to a 1. A Write Enable (WREN) instruction is required prior to a Chip Erase.
After the WREN instruction is shifted in, the CS pin must be brought high to set the Write Enable Latch.
The Chip Erase sequence is initiated by bringing the CS pin low; this is followed by the instruction code. There are two
different instruction codes for CER, 60h and C7h. Either instruction code will initiate the Chip Erase sequence. No
address bytes are needed. Once the instruction code is shifted in, the CS pin is brought high, which initiates the self-
timed Chip Erase function. The WIP bit in the Status Register can be read, using the RDSR instruction, to determine
when the Chip Erase cycle is complete.
The sequence for the 60h CER instruction is shown in Figure 10-13. The sequence for the C7h CER instruction is shown
in Figure 10-14.
Figure 10-13.CERS Sequence (60h)
Figure 10-14.CERS Sequence (C7h)
10.12 PD (Power-Down, B9h):
Power-Down mode allows the user to reduce the power of the device to its lowest power consumption state.
SDI
SCK
SDO
CS
012 456
HI-Z
3 7 8 9 10 11 20 21 22 23
15 14 13 3210
2 BYTE ADDRESSINSTRUCTION
01000010
SDI
SCK
SDO
CS
01234567
HI-Z
01100000
SDI
SCK
SDO
CS
01234567
HI-Z
11000111
2 4
RM25C32DS
DS-RM25C32DS–124B–11/2016
All instructions given during the Power-Down mode are ignored except the Resume from Power-Down (RES) instruction.
Therefore this mode can be used as an additional software write protection feature.
The Power-Down sequence is initiated by bringing the CS pin low; this is followed by the instruction code. Once the
instruction code is shifted in the CS pin is brought high, which initiates the PD mode. The sequence for PD is shown in
Figure 10-15.
Figure 10-15.PD Sequence (B9h)
10.13 RES (Resume from Power-Down, ABh):
The Resume from Power-Down mode is the only command that will wake the device up from the Power-Down mode. All
other commands are ignored.
In the simple instruction command, after the CS pin is brought low, the RES instruction is shifted in. At the end of the
instruction, the CS pin is brought back high.
The rising edge of the SCK clock number 7 (8th rising edge) initiates the internal RES instruction. The device becomes
available for Read and Write instructions 75μS after the 8th rising edge of the SCK (tPUD, see AC Characteristics). The
sequence for simple RES instruction is shown in Figure 10-16.
Figure 10-16.Simple RES Sequence (ABh)
10.14 UDPD (Ultra-Deep Power-Down, 79h)
The Ultra-Deep Power-Down mode allows the device to further reduce its energy consumption compared to the existing
Standby and Power-Down modes by shutting down additional internal circuitry. When the device is in the Ultra-Deep
Power-Down mode, all commands including the Read Status Register and Resume from Deep Power-Down commands
will be ignored. Since all commands will be ignored, the mode can be used as an extra protection mechanism against
inadvertent or unintentional program and erase operations.
SDI
SCK
SDO
CS
01234567
HI-Z
10111001
SDI
SCK
SDO
CS
012 456
HI-Z
37
INSTRUCTION
10101011
t
RPD
2 5
RM25C32DS
DS-RM25C32DS–124B–11/2016
10.14.1 UDPD mode
Entering the Ultra-Deep Power-Down mode is accomplished by simply asserting the CS pin, clocking in the opcode 79h,
and then deasserting the CS pin. Any additional data clocked into the device after the opcode will be ignored. When the
CS pin is deasserted, the device will enter the Ultra-Deep Power-Down mode within the maximum time of tEUDPD.
The complete opcode must be clocked in before the CS pin is deasserted; otherwise, the device will abort the operation
and return to the standby mode once the CS pin is deasserted. In addition, the device will default to the standby mode
after a power cycle. The Ultra-Deep Power-Down command will be ignored if an internally self-timed operation such as a
program or erase cycle is in progress. The sequence for UDPD is shown in Figure 10-17.
Figure 10-17.Ultra-Deep Power-Down (79h)
10.15 Exit Ultra-Deep Power-Down
To exit from the Ultra-Deep Power-Down mode, one of the following operations can be performed:
10.15.1 Exit Ultra-Deep Power-Down / Hardware Reset
Issue the Exit Ultra-Deep Power-Down / Hardware Reset sequence as described in Section 10.16, Hardware Reset.
10.15.2 Power Cycling
The device can also exit the Ultra-Deep Power Mode by power cycling the device. The system must wait for the device to
return to the standby mode before normal command operations can be resumed. Upon recovery from Ultra-Deep Power-
Down all internal registers will be at their Power-On default state.
10.16 Hardware Reset
The Exit Ultra-Deep Power-Down / Hardware Reset command sequence can be used to wakeup the device from Ultra-
Deep Power-Down. This sequence can also be used to reset the device to its power on state without cycling power. It is
in any case recommended to run a Hardware Reset command sequence after every time the device is powered up.
The reset sequence does not use the SCK pin. The SCK pin has to be held low (mode 0) or high (mode 3) through the
entire reset sequence.This prevents any confusion with a command, as no command bits are transferred (clocked).
A reset is commanded when the data on the SDI pin is 0101 on four consecutive positive edges of the CS pin with no
edge on the SCK pin throughout. This is a sequence where
1) CS is driven active low to select the device. This powers up the SPI slave.
SCK
CS
SI
SO
MSB
ICC
2310
0
6754
Opcode
High-impedance
Ultra-Deep Power-Down Mode Current
Active Current
Standby Mode Current
tEUDPD
1111001
2 6
RM25C32DS
DS-RM25C32DS–124B–11/2016
2) Clock (SCK) remains stable in either a high or low state.
3) SDI is driven low by the bus master, simultaneously with CS going active low. No SPI bus slave drives SDI during CS
low before a transition of SCK ie: slave streaming output active is not allowed until after the first edge of SCK.
4) CS is driven inactive. The slave captures the state of SI on the rising edge of CS.
The above steps are repeated 4 times, each time alternating the state of SI.
After the fourth CS pulse, the slave triggers its internal reset. SI is low on the first CS, high on the second, low on the
third, high on the fourth. This provides a 5h, unlike random noise. Any activity on SCK during this time will halt the
sequence and a Reset will not be generated. Figure 10-18 below illustrates the timing for the Hardware Reset operation.
Figure 10-18.Hardware Reset
HI Z
SDI
SCK
SDO
CS
t
CL
t
CH
Internal Reset
-
mode 3
mode 0
t
XUPD
Device is ready
2 7
RM25C32DS
DS-RM25C32DS–124B–11/2016
11. Typical Characteristics
Figure 11-1. Icc4 , Auto Powerdown
Average Icc Standby (Icc4, Auto Powerdown, uA) vs Temperature (C), by Vcc
-40 023 55 85
Temperature
Voltage
3.60 3.30 2.70 1.65
Current
12
11.5
11
10.5
10
9.5
9
8.5
8
7.5
7
6.5
6
5.5
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
2 8
RM25C32DS
DS-RM25C32DS–124B–11/2016
Figure 11-2. Icc4, Mode 0
Figure 11-3. Icc4, Mode 1
2 9
RM25C32DS
DS-RM25C32DS–124B–11/2016
Figure 11-4. Icc5
Figure 11-5. Icc6
3 0
RM25C32DS
DS-RM25C32DS–124B–11/2016
12. Ordering Information
12.1 Ordering Detail
12.2 Ordering Codes
RM25C32DS-LSNI-T
Device Type Shipping Carrier Option
RM25C = SPI serial access EEPROM B = Tube
T = Tape & Reel
Density Grade & Temperature
I = Green, NiPd Au lead finish,
Industrial temperature (-40-85°C)
Device/Die Revision Package Option
DSN = 8 lead 0.150” SOIC, Narrow
TA = 8 lead TSSOP
MA = 8 pad 2 x 3 x 0.6 mm UDFN
Operating Voltage
L = 1.65V to 3.6V
32= 32Kbit
Series
S = OTP Security Register
Ordering Code Package Density
Operating
Voltage fSCK
Device
Grade
Ship
Carrier
Qty.
Carrier
RM25C32CDS-LSNI-B
SN 32 Kbit 1.65V to 3.6V 20 MHz Industrial
(-40C to 85C)
Tube 100
RM25C32CDS-LSNI-T
Reel 4000
RM25C32CDS-LTAI-B
TA 32 Kbit 1.65V to 3.6V 20 MHz Industrial
(-40C to 85C)
Tube 100
RM25C32CDS-LTAI-T
Reel 4000
RM25C32CDS-LMAI-T
MA 32 Kbit 1.65V to 3.6V 20 MHz
Industrial
(-40C to 85C) Reel 5000
Package Type
SN 8-lead 0.150" wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
TA 8-lead 3 x 4.4 mm, Thin Shrink Small Outline Package
MA 8-pad, 2 x 3 x 0.6mm, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN)
3 1
RM25C32DS
DS-RM25C32DS–124B–11/2016
13. Package Information
13.1 SN (JEDEC SOIC)
DRAWING NO. REV. TITLE GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A1 0.10 – 0.25
A 1.35 – 1.75
b 0.31 – 0.51
C 0.17 – 0.25
D 4.80 – 5.05
E1 3.81 – 3.99
E 5.79 – 6.20
e 1.27 BSC
L 0.40 – 1.27
ØØ 0° – 8°
ØØ
EE
11
NN
TOP VIEWTOP VIEW
CC
E1E1
END VIEW
AA
bb
LL
A1A1
ee
DD
SIDE VIEWSIDE VIEW
Package Drawing Contact:
contact@adestotech.com
8S1 G
8/20/14
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
8S1, 8-lead (0.150” Wide Body), Plastic Gull
Wing Small Outline (JEDEC SOIC) SWB
3 2
RM25C32DS
DS-RM25C32DS–124B–11/2016
13.2 TA-TSSOP
DRAWING NO. REV. TITLE GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A - - 1.20
A1 0.05 - 0.15
A2 0.80 1.00 1.05
D 2.90 3.00 3.10 2, 5
E 6.40 BSC
E1 4.30 4.40 4.50 3, 5
b 0.19 – 0.30 4
e 0.65 BSC
L 0.45 0.60 0.75
L1 1.00 REF
C 0.09 - 0.20
Side View
End View
Top View
A2
A
L
L1
D
1
E1
N
b
Pin 1 indicator
this corner
E
e
Notes: 1. This drawing is for general information only. Refer to JEDEC
Drawing MO-153, Variation AA, for proper dimensions,
tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
4. Dimension b does not include Dambar protrusion. Allowable
Dambar protrusion shall be 0.08mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
H
8X E
12/8/11
TA, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP) TNR
C
A1
Package Drawing Contact:
contact@adestotech.com
®
3 3
RM25C32DS
DS-RM25C32DS–124B–11/2016
13.3 MA- – 2 x 3 UDFN
TITLE DRAWING NO.GPC REV.
Package Drawing Contact:
contact@adestotech.com
®
8MA3YCQ GT
8MA3, 8-pad, 2 x 3 x 0.6 mm Body, 0.5 mm Pitch,
1.6 x 0.2 mm Exposed Pad, Saw Singulated
Thermally Enhanced Plastic Ultra Thin Dual
Flat No Lead Package (UDFN/USON)
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX
A 0.45 0.60
A1 0.00 0.05
A3 0.150 REF
b 0.20 0.30
D 2.00 BSC
D2 1.50 1.60 1.70
E 3.00 BSC
E2 0.10 0.20 0.30
e 0.50 BSC
L 0.40 0.45 0.50
L1 0.00 0.10
L3 0.30 0.50
eee – – 0.08
8/26/14
Notes: 1. All dimensions are in mm. Angles in degrees.
2. Bilateral coplanarity zone applies to the exposed heat
sink slug as well as the terminals.
D
14
PIN 1 ID
E
5
23
678
eee
1
4
8
5
E2
D2
L3 L
Chamfer or half-circle
notch for Pin 1 indicator.
L1
3 4
RM25C32DS
DS-RM25C32DS–124B–11/2016
13.4 Revision History
Doc. Rev. Date Comments
RM25C32DS-A 7/2016 Initial document release
RM25C32DS-B 11/2016 Updated Endurance and Data Retention specifications. Updated TPW and TBW and fSCKF
specifications. Updated DC specifications and Typical Characteristics curves.
3 5
RM25C32DS
DS-RM25C32DS–124B–11/2016
Corporate Office
California | USA
Adesto Headquarters
3600 Peterson Way
Santa Clara, CA 95054
Phone: (+1) 408.400.0578
Email: contact@adestotech.com
© 2016 Adesto Technologies. All rights reserved. / Rev.: DS-RM25C32DS–124B–11/2016
Disclaimer: Adesto Technologies Corporation makes no warranty for the use of its products, other than those expressly contained in the Company's standard warranty which is detailed in Adesto's Terms
and Conditions located on the Company's web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications
detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Adesto are granted by the
Company in connection with the sale of Adesto products, expressly or by implication. Adesto's products are not authorized for use as critical components in life support devices or systems.
For Release Only Under Non-Disclosure Agreement (NDA)
Adesto®, the Adesto logo, CBRAM®, and DataFlash® are registered trademarks or trademarks of Adesto Technologies. All other marks are the property of their respective
owners.