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200810 Rev. C Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice. September 8, 2008 1
SKY65146: 3.5 V Broadband MCM Power Amplifier
806–849 MHz
DATA SHEET
Applications
iDEN®(806–825 MHz)
TETRA (806–825 MHz)
TDMA (824–849 MHz)
AMPS (824–849 MHz)
Wireless Local Loop (WLL)
Features
Low voltage positive bias supply (3.5 V)
High gain 39 dB, high power: PSAT 35.6 dBm
High efficiency: PAE 51%
Good linearity
Dual mode operation
Large dynamic range
28-pin LCC package (10 x 13.97 x 1.45 mm)
Internal RF match
Power down control
Available on tape and reel
Available lead (Pb)-free and RoHS-compliant
Block Diagram
VREG
(1)
VD4
(28)
VD2
(22)
VD3
(8)
RF IN
(5)
RF OUT
(15)
INPUT
MATCH
INTER
STAGE
MATCH 1
INTER
STAGE
MATCH 2
OUTPUT
MATCH
CMOS
CONTROLLER
CIRCUIT
PA 1 PA 2
OUTPUT
STAGE
GaAs HBT IC
MODULE
Description
The SKY65146 is a fully matched 28-pin surface mount multi-chip
module (MCM) amplifier designed for Private Mobile Radio,
Wireless Local Loop, and TDMA/AMPS mobile units operating in
the 806-849 MHz cellular bandwidth. Microwave Monolithic
Integrated Circuits (MMICs), comprised of Gallium Arsenide (GaAs)
and Si CMOS, contain all active circuitry in the module, which
includes on-board bias circuitry as well as the interstage
matching circuit. The input and output match is realized off-chip
within the module package to optimize efficiency and high power
performance (P3 dB_sat 35.6 dBm) into a 50 load.
Primary bias to the SKY65146 can be supplied directly from a
single cell lithiumion or other suitable battery with a nominal
output of 3.5 V.
No external supply side switch is needed as typical “off” leakage
is a few microamperes with full primary voltage supplied from
the battery.
Skyworks offers lead (Pb)-free, RoHS (Restriction of
Hazardous Substances)-compliant packaging.
NEW
The ICs are manufactured on an advanced InGaP HBT process and
on a silicon CMOS process, providing for all positive voltage DC
supply operation while maintaining high efficiency and good linearity.
The module can operate over the temperature range of -40 ˚C to
85 ˚C. A populated evaluation board is available upon request.
Package Diagram
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
NC
NC
GND
RFIN
GND
NC
VREG
RFOUT
GND
GND
GND
GND
GND
GND
NC
NC
NC
GND
GND
GND
VD3
VD2
NC
NC
GND
GND
GND
VD4
6 5 4 3 2 1
15 16 17 18 10 20 21
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DATA SHEET SKY65146
2
Parameter Symbol Condition Min. Typ. Max. Unit
Frequency range F 806 825 MHz
Gain lS21lSmall signal 38.7 dB
Power gain Gp PO= 29 dBm 35.5 38.7 40 dB
Input VSWR lS11lSmall signal 12 17
Saturated output power P3 dB SAT Gain Comp < 3 dB 35.1 35.6 dBm
Power added efficiency PAE PO= P3 dB SAT 47 51 %
Current @ PSAT ICC SAT PO= P3 dB SAT 2 A
Quiescent current ICCQ No RF signal 270 329 370 mA
Harmonic Levels 2FO
3FO
4FO
PO< P3 dB SAT
PO< P3 dB SAT
PO< P3 dB SAT
-37
-60
-80
dBc
dBc
dBc
Noise power in Rx band
FC + 30 MHz, BW = 18 kHz
RxBN PO< 29 dBm -85 dBm/Hz
Noise figure NF CW 6.8 8 dB
Stability (spurious output) S Output VSWR = 10:1 -36 dBm
Ruggedness - no damage Ru PO< 29 dBm 15:1 VSWR
Thermal resistance θJC Junction to case 19 °C/W
Electrical Specifications
VCC (VD) = 3.5 V, VREG = 2.75 V, Frequency = 815 MHz, TC= 25 °C, unless otherwise specified.
DATA SHEET SKY65146
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200810 Rev. C Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice. September 8, 2008 3
Parameter Symbol Conditions Min. Typ. Max. Unit
Supply voltage VCC 3 3.5 4.4 V
Regulation voltage VREG 2.65 2.75 2.85 V
Operating frequency F 806 849 MHz
Continuous RMS output power PoRMS 29 31 dBm
Operating case temperature TC-40 +25 +85 °C
Recommended Operating Conditions
Characteristic Value
RF input power (PIN) 11 dBm(1)
Supply voltage (VCC) 6.9 V(2)
Regulated supply voltage (VREG)V
CC V(3)
Operating case temperature (TC) -40 °C to +85 °C
Storage temperature(TST) -55 °C to +125 °C
Junction temperature (TJ) 150 °C
Absolute Maximum Ratings
1. For pulsed operation with duty cycle < 25%.
2. When amplifier is biased off (VREG = 0 V).
3. Voltage on VREG pin may not exceed the applied VCC voltage.
Performance is guaranteed only under the conditions listed in the specifications table and is
not guaranteed under the full range(s) described by the Absolute Maximum specifications.
Exceeding any of the absolute maximum/minimum specifications may result in permanent
damage to the device and will void the warranty. Each absolute maximum rating listed is an
individual parameter. Biasing and driving the amplifier with more than one absolute maximum
rating listed may result in permanent damage to the device. Exposure to maximum rating
conditions for extended periods may reduce device reliability.
CAUTION: Although this device is designed to be as robust as
possible, ESD (Electrostatic Discharge) can damage
this device. This device must be protected at all times
from ESD. Static charges may easily produce poten-
tials of several kilovolts on the human body or
equipment, which can discharge without detection.
Industry-standard ESD precautions must be employed
at all times.
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DATA SHEET SKY65146
4
Typical Performance Data
VCC (VD) = 3.5 V, VREG = 2.75 V, Frequency = 815 MHz, TC= 25 °C, unless otherwise specified.
85 °C-40 °C 25 °C
Gain vs. Frequency Across Temperature
36
38
40
42
805 810 815 820 825
Frequency (MHz)
Gain (dB)
4.0 V3.0 V 3.5 V
Gain vs. Temperature Across VCC
Temperature (°C )
Gain (dB)
4.5 V
34
36
38
40
42
-40 -15 10 35 60 85
85 °C-40 °C 25 °C
Gain vs. POUT Across Temperature
POUT (dBm)
Gain (dB)
31
33
35
37
39
41
43
23 28 33 38
825 MHz806 MHz 815.5 MHz
Gain vs. POUT Across Frequency
POUT (dBm)
Gain (dB)
31
33
35
37
39
41
43
23 25 27 29 31 33 35 37
4.0 V3.0 V 3.5 V
Gain vs. POUT Across VCC
POUT (dBm)
Gain (dB)
4.5 V
31
33
35
37
39
41
43
23 25 27 29 31 33 35 37
85 °C-40 °C 25 °C
lS11l vs. Frequency Across Temperature
Frequency (MHz)
lS11l (dB)
-20
-19
-18
-17
-16
-15
805 810 815 820 825
DATA SHEET SKY65146
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200810 Rev. C Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice. September 8, 2008 5
Typical Performance Data
VCC (VD) = 3.5 V, VREG = 2.75 V, Frequency = 815 MHz, TC= 25 °C, unless otherwise specified.
825 MHz806 MHz 815.5 MHz
ICC vs. POUT Across Frequency
POUT (dBm)
ICC (A)
0.4
0.9
1.4
1.9
2.4
22 24 26 28 30 32 34 36 38
4.0 V3.0 V 3.5 V
ICC vs. POUT Across VCC
POUT (dBm)
ICC (A)
4.5 V
0.4
0.9
1.4
1.9
2.4
22 24 26 28 30 32 34 36 38
4.0 V3.0 V 3.5 V
ICCQ vs. Temperature Across VCC
Temperature (°C)
ICCQ (A)
4.5 V
0.28
0.33
0.38
0.43
-40 -15 10 35 60 85
85 °C-40 °C 25 °C
NF vs. Frequency Across Temperature
Frequency (MHz)
NF (dB)
5
6
7
8
805 810 815 820 825
4.0 V3.0 V 3.5 V
NF vs. Temperature Across VCC
Temperature (°C)
NF (dB)
4.5 V
5
6
7
8
-40 -15 10 35 60 85
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DATA SHEET SKY65146
6
Typical Performance Data
VCC (VD) = 3.5 V, VREG = 2.75 V, Frequency = 815 MHz, TC= 25 °C, unless otherwise specified.
85 °C-40 °C 25 °C
PAE vs. POUT Across Temperature
POUT (dBm)
PAE (%)
8
18
28
38
48
58
20 22 24 26 28 30 32 34 36 38
825 MHz806 MHz 815.5 MHz
PAE vs. POUT Across Frequency
POUT (dBm)
PAE (%)
8
18
28
38
48
58
20 22 24 26 28 30 32 34 36 38
PAE vs. POUT Across VCC
POUT (dBm)
PAE (%)
4.0 V3.0 V 3.5 V 4.5 V
8
18
28
38
48
58
20 22 24 26 28 30 32 34 36 38
2nd Harmonics vs. Temperature Across PIN
-9 dBm-10 dBm -9.5 dBm
-8.5 dBm
34
36
38
40
42
44
-40 -15 10 35 60 85
Temperature (°C)
2nd Harmonics (dB)
-8 dBm
-9 dBm-10 dBm -9.5 dBm
-8.5 dBm
2nd Harmonics (dB)
-8 dBm
2nd Harmonics vs. Frequency Across PIN
34
36
38
40
42
44
805 810 815 820 825
Frequency (MHz)
-9 dBm-10 dBm -9.5 dBm
-8.5 dBm
2nd Harmonics (dB)
-8 dBm
2nd Harmonics vs. VCC Across PIN
34
37
40
43
46
49
52
3.00 3.25 3.50 3.75 4.00 4.25 4.50
VCC (V)
DATA SHEET SKY65146
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Typical Performance Data
VCC (VD) = 3.5 V, VREG = 2.75 V, Frequency = 815 MHz, TC= 25 °C, unless otherwise specified.
-9 dBm-10 dBm -9.5 dBm
-8.5 dBm -8 dBm
3rd Harmonics vs. Temperature Across PIN
56
57
58
59
60
61
-40 -15 10 35 60 85
Temperature ( C )
3rd Harmonics (dB)
-9 dBm-10 dBm -9.5 dBm
-8.5 dBm -8 dBm
3rd Harmonics vs. Frequency Across PIN
3rd Harmonics (dB)
57
58
59
60
61
805 810 815 820 825
Frequency (MHz)
-9 dBm-10 dBm -9.5 dBm
-8.5 dBm -8 dBm
3rd Harmonics vs. VCC Across PIN
3rd Harmonics (dB)
58
59
60
61
62
3.00 3.25 3.50 3.75 4.00 4.25 4.50
VCC (V)
-9 dBm-10 dBm -9.5 dBm
-8.5 dBm -8 dBm
4th Harmonics vs. Temperature Across PIN
74
76
78
80
82
84
-40 -15 10 35 60 85
Temperature (°C)
4th Harmonics (dB)
-9 dBm-10 dBm -9.5 dBm
-8.5 dBm -8 dBm
4th Harmonics (dB)
4th Harmonics vs. Frequency Across PIN
75
77
79
81
83
805 810 815 820 825
Frequency (MHz)
-9 dBm-10 dBm -9.5 dBm
-8.5 dBm -8 dBm
4th Harmonics (dB)
4th Harmonics vs. VCC Across PIN
76
78
80
82
3.00 3.25 3.50 3.75 4.00 4.25 4.50
VCC (V)
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DATA SHEET SKY65146
8
Typical Performance Data
VCC (VD) = 3.5 V, VREG = 2.75 V, Frequency = 815 MHz, TC= 25 °C, unless otherwise specified.
S22
S11 S21
S-Parameters vs. Frequency
-20
-10
0
10
20
30
40
50
0.70 0.75 0.80 0.85 0.90 0.95 1.00
Frequency (GHz)
Sij (dB)
OIP3 vs. POUT/Tone Across Frequency
Tone Spacing =1 MHz
16 18 20 22 24 26 28
Power Out/Tone (dBm)
OIP3 (dBm)
30
31
32
33
34
35
36
37
38
39
40
890 MHz 930 MHz850 MHz
825 MHz806 MHz 815.5 MHz
Frequency (MHz)
P1dB vs. Frequency
32.0
32.5
33.0
33.5
34.0
34.5
35.0
35.5
36.0
P1 dB (dBm)
800 820 840 860 880 900 920 940
PAE @ P1dB vs. Frequency
30
35
40
45
50
55
800 820 840 860 880 900 920 940
Frequency (MHz)
PAE @ P1 dB (%)
DATA SHEET SKY65146
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200810 Rev. C Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice. September 8, 2008 9
Application Circuit Notes
Center Ground. It is extremely important that the device paddle
be sufficiently grounded for both thermal and stability reasons.
Multiple small vias are acceptable and will work well under the
device if solder migration is an issue.
VD2 (Pin 1). Supply voltage for output (final) stage collector bias
(typically 3.5 V). Bypassing of VD3 is accomplished with C2 and
C3 and should be placed in the approximate location shown on
the Evaluation Board, but placement is not critical.
Ground (Pins 2, 3, 6, 11, 13, 16, 19, 20, 23–28).
Attach all ground pins to the RF ground plane with the largest
diameter and lowest inductance via that the layout will allow.
Multiple small vias are also acceptable and will work well under
the device if solder migration is an issue.
No Connect (Pins 4, 5, 9, 10, 14, 17, 18, 21). The pins are open
and may or may not be connected to ground.
VD4 (Pin 7). Supply voltage for base bias circuitry to all stages
(typically 3.5 V). Bypassing of VD3 is accomplished with C1 which
should be placed in the approximate location shown on the
Evaluation Board, but placement is not critical.
VREG (Pin 8). VREG is the regulated bias enable control voltage to
the silicon CMOS controller, 0.0 V = Off, 2.75 V = On. Nominal
“On” operating range is between 2.65 VDC and 2.85 VDC. VREG set
to 0 VDC will force the amplifier into standby mode.
RF_IN (Pin 12). Amplifier RF Input Pin. ZO= 50 . The module
includes an onboard internal DC blocking capacitor. All imped-
ance matching is provided internal to the module.
VD3 (Pin 15). Supply voltage for driver collector bias (typically
3.5V). Bypassing of VD3 is accomplished with C4 and C5 which
should be placed in the approximate location shown on the
Evaluation Board, but placement is not critical.
RF_OUT (Pin 22). Amplifier RF Output Pin. ZO= 50 . The
module includes an onboard internal DC blocking capacitor. All
impedance matching is provided internally to the module.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is sub-
jected to high temperature during solder assembly.
Please refer to Skyworks’ solder reflow application note, available
at www.skyworksinc.com, for instructions on mounting the
SKY65146 to a printed circuit board.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Tape and Reel, document number 101568.
Electrostatic Discharge (ESD) Sensitivity
The SKY65146 is a static-sensitive electronic device. Do not
operate or store near strong electrostatic fields. Take proper ESD
precautions.
Theory of Operation
The SKY65146 is a fully matched 3-stage GaAs HBT power
amplifier module consisting of on-chip interstage matching cir-
cuits and bias circuitry. The input and output match is realized
off-chip, but within the module package. The amplifier employs
series feedback on the first and second stages to provide for high
gain and stability and power of up to 4 W.
The module includes a silicon CMOS controller circuit to provide
a regulated bias enable control, VREG (0–2.75 V) for amplifier
On/Off operation. In off operation, supply current is a few
microamperes with VREG = 0 V. The module operates with all
positive DC voltages while maintaining high efficiency and good
linearity. The nominal operating voltage is 3.5 V for maximum
power, but can be operated at slightly lower voltages for other
mobile applications.
Application Circuit
8
9
10
11
12
13 23
22
24
25
26
27
28
7654321
15 16 17 18 19 20 21
14
VREG
VD4
VD2
RF_IN
VD3
RF_OUT
C2
10 F
C3
1000 pF
C1
10 F
C5
1000 pF
C4
10 F
50
50
NC
NC
NC
NC
NC NC NC
NC
SKY65146
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DATA SHEET SKY65146
10
Pin Assignments
Pin Pin Name Description
1VD2Supply voltage for output (final) stage collector
bias (typically 3.5 V)
2 GND Low inductance ground connection
3 GND Low inductance ground connection
4 N/C No connect
5 N/C No connect
6 GND Low inductance ground connection
7VD4Supply voltage for base bias circuitry to all stages
(typically 3.5 V)
8VREG Regulated bias enable control voltage,
0.0 = Off, 2.75 V = On
9 N/C No connect
10 N/C No connect
11 GND Low inductance ground connection
12 RFIN 806–849 MHz RF input signal 50
13 GND Low inductance ground connection
14 N/C No connect
15 VD3Supply voltage for driver collector bias
(typically 3.5 V)
16 GND Low inductance ground connection
17 N/C No connect
18 N/C No connect
19 GND Low inductance ground connection
20 GND Low inductance ground connection
21 N/C No connect
22 RFOUT 806–849 MHz RF output signal 50
23 GND Low inductance ground connection
24 GND Low inductance ground connection
25 GND Low inductance ground connection
26 GND Low inductance ground connection
27 GND Low inductance ground connection
28 GND Low inductance ground connection
Center attachment pad must have a low inductance and low thermal resistance connection to
the customer's printed circuit board ground plane.
Evaluation Board
VCTL (NC)
GND
GND
J1
J3
J2
Pin 1
RF Out
RF In
SKY65146
U1
C5
C4
C2
C3
C1
SKY65146 Test Fixture
TW16-D390-
VD1 (NC)
VD2
VD3
VD4
VREG
Recommended Solder Reflow Profiles
Refer to the Recommended Solder Reflow Profile”
Application Note.
Tape andReel Information
Refer to the Discrete Devices and IC Switch/Attenuators
Tape and Reel Package Orientation” Application Note.
DATA SHEET SKY65146
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200810 Rev. C Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice. September 8, 2008 11
Evaluation Board Description
The Skyworks SKY65146 Evaluation Board is used to test the
performance of the SKY65146 power amplifier module. The fol-
lowing design considerations are general in nature and must be
followed regardless of final use or configuration.
1. Paths to ground should be made as short as possible.
2. The ground pad of the SKY65146 power amplifier module has
special electrical and thermal grounding requirements. This
pad is the main thermal conduit for heat dissipation. Since the
circuit board acts as the heat sink, it must shunt as much heat
as possible from the amplifiers. As such, design the connection
to the ground pad to dissipate the maximum wattage produced
to the circuit. Multiple vias to the grounding layer are required.
NOTE: Junction temperature (TJ) of the device increases with a
poor connection to the slug and ground. This reduces the
lifetime of the device.
Evaluation Board Test Procedure
Step 1. Connect RF test equipment to Amplifier input/output SMA
connectors.
Step 2. Connect DC ground.
Step 3. Connect all VCC (VD) lines to 3.5 V supply and VREG to
2.75 V. Verify the ICQ current is approximately 329 mA.
Step 4. Apply RF signal data -30 dBm level and observe that the
output level is approximately 8 dBm or the gain of the
device is approximately 38 dB.
NOTE: It is important that the VD2, VD3, and VD4 voltage source
be adjusted such that 3.5 V is measured at the board. The
high collector currents will drop the collector voltage sig-
nificantly if long leads are used. Adjust the bias voltage to
compensate.
Bill of Material for Evaluation Board
Part ID QTY Size Value Units Manufacturer Product Number
1 C1 1 1206 10 µF AVX TAJA106M006R
2 C2 1 1206 10 µF AVX TAJA106M006R
3 C3 1 0402 1000 pF Murata GRM155R71H102KA01
4 C4 1 1206 10 µF AVX TAJA106M006R
5 C5 1 0402 1000 pF Murata GRM155R71H102KA01
Capacitors C6 and C7 are shown on EVB, but are not used.
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DATA SHEET SKY65146
12
Evaluation Board Stack-Up
Cross Section Name Thickness (mm) Material εr
L1 0.025 Cu
Lam1 0.400 Rogers 4003 3.38
L2 0.025 Cu
Lam2 0.600 FR4 4.00
L3 0.025 Cu
Lam3 0.400 FR4 4.00
L4 0.025 Cu
Branding Specifications
SKY65146
EXXXXX.XX
YYWW MX
Manufacturing Part Number
Revision Number
Mark Pin 1
Identifier
Lot Number
YY = Manufacture Year
WW = Week Packaged
Sealed
MX = Country Code
Package Outline
Detail CDetail A Detail B
R 0.05
Max.
R 0.05
Max.
0.875 0.875
0.875 0.875
(0.147) 0.889 ± 0.05
0.762
± 0.05
1.016
± 0.05
(R 0.508)
(R 0.381)
0.02X 45°
1.163 ± 0.05
54X Solder Mask
Openings See Detail B
28X SMT Pad
(0.2x 45°)
Pin 1 Indicator
See Detail A
Pin 1
0
Units = mm.
4X 1.27
4X 2.54
4X 3.81
12X 4
12X 3
12X 2
12X 1
0
4X 1.27
4X 2.54
4X 3.81
0.5
1.5
2.5
See Detail B
14X 4.873
14X 6.873
C
Pin 28
Top
Pin 1 Indicator
10.04
14.04
1.45 ± 0.1
DATA SHEET SKY65146
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200810 Rev. C Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice. September 8, 2008 13
Solder Mask
12X
4 mm
14.44 mm
18X 1.5 mm
18X 0.5 mm
C
L
Package Outline
28X
0.862 mm
10.44 mm
18X 2.5 mm
12X
3 mm
12X
2 mm
12X
1 mm
Pin 1
0.20 X 45°
Pin 28
1.27 mm Typ.
L
C
28X 1.286 mm
0.875 mm Typ.
0.875 mm Typ.
R0.431 mm Typ.
Recommended Footprint
Thermal vias should be tented and filled with solder mask 30-35 µm copper plating recommended.
Pin 28
Pin 1
10.34 mm
14.34 mm
C
L
C
L
14X
0.762 mm
14X 1.186 mm
1.27 mm Typ.
0.6 mm
0.6 mm
0.25 mm Typ.
0.25 mm Typ.
R0.381 mm Typ.
Thermal via array Ø0.3 mm on
0.7 mm pitch additional vias in
common ground pad will
improve thermal performance
Stencil Pattern
Package
Outline
10.34 mm
14.34 mm
28X
1.186 mm
28X
0.762 mm
1.27 mm
Typ.
0.20 X 45°
C
L
L
C
Stencil aperture size
of 80 to 100%
of the module/pkg
solder mask
openings.
Pin 28
12X 1 mm
12X 2 mm
12X 3 mm
12X 4 mm
18X 0.5 mm
18X 1.5 mm
18X 2.5 mm
Pin 1
0.875 mm
Typ.
0.875 mm
Typ.
Copyright © 2007, 2008, Skyworks Solutions, Inc. All Rights Reserved.
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Ordering Information
Model Name Manufacturing Part Number Evaluation Kit Part Number
SKY65146: 3.5 V Broadband MCM Power Amplifier 806–849 MHz SKY65146-21 (Pb-free package) TW16-D390
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DATA SHEET SKY65146
Skyworks Solutions, Inc. Phone [781] 376-3000 Fax [781] 376-3100 sales@skyworksinc.com www.skyworksinc.com
September 8, 2008 Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice. 200810 Rev. C