DMTH10H030LK3
Document number: DS38737 Rev. 3 - 3
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June 2017
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DMTH10H030LK3
100V 175°C N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
BVDSS
RDS(ON) Max
ID
TC = +25°C
100V
30mΩ @ VGS = 10V
28A
45mΩ @ VGS = 6.0V
23A
Description
This new generation MOSFET features low on-resistance and fast
switching, making it ideal for high efficiency power management
applications.
Applications
Power Management Functions
DC-DC Converters
Backlighting
Ordering Information (Note 4)
Part Number
Case
Packaging
DMTH10H030LK3-13
TO252 (DPAK)
2,500/Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green" products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Marking Information
Equivalent Circuit
Pin Out Top View
= Manufacturers Marking
TH130LK or TH115LK = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Two Digits of Year (ex: 17 = 2017)
WW = Week Code (01 to 53)
Top View
Green
YYWW
TH115LK
YYWW
TH130LK
NOT RECOMMENDED FOR NEW DESIGN
USE DMTH10H025LK3
DMTH10H030LK3
Document number: DS38737 Rev. 3 - 3
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DMTH10H030LK3
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Drain-Source Voltage
VDSS
100
V
Gate-Source Voltage
VGSS
±20
V
Continuous Drain Current, VGS = 10V
TC = +25°C
TC = +10C
ID
28
18
A
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
IDM
150
A
Pulsed Body Diode Forward Current (10μs Pulse, Duty Cycle = 1%)
ISM
150
A
Maximum Continuous Body Diode Forward Current (Note 6)
IS
2.6
A
Avalanche Current, L = 3mH
IAS
7.5
A
Avalanche Energy, L = 3mH
EAS
85
mJ
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Total Power Dissipation (Note 5)
PD
2.1
W
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
RθJA
69
°C/W
Total Power Dissipation (Note 6)
PD
3.5
W
Thermal Resistance, Junction to Ambient (Note 6)
Steady State
RθJA
42
°C/W
Thermal Resistance, Junction to Case
RθJC
2
Operating and Storage Temperature Range
TJ, TSTG
-55 to +175
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BVDSS
100
V
VGS = 0V, ID = 1mA
Zero Gate Voltage Drain Current
IDSS
1
µA
VDS = 80V, VGS = 0V
Gate-Source Leakage
IGSS
±100
nA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
VGS(TH)
1.4
3.5
V
VDS = VGS, ID = 250 A
Static Drain-Source On-Resistance
RDS(ON)
30
m
VGS = 10V, ID = 20A
45
VGS = 6.0V, ID = 20A
Diode Forward Voltage
VSD
1.3
V
VGS = 0V, IS = 20A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Ciss
1,871
pF
VDS = 50V, VGS = 0V
f = 1MHz
Output Capacitance
Coss
261
Reverse Transfer Capacitance
Crss
6.9
Gate Resistance
RG
0.75
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge
QG
33.3
nC
VDD = 50V, ID = 10A,
VGS = 10V
Gate-Source Charge
QGS
6.9
Gate-Drain Charge
QGD
5.1
Turn-On Delay Time
tD(ON)
6.5
ns
VDD = 50V, VGS = 10V,
ID = 10A, RG = 6
Turn-On Rise Time
tR
7.0
Turn-Off Delay Time
tD(OFF)
19.7
Turn-Off Fall Time
tF
8.1
Reverse Recovery Time
tRR
37.9
ns
IF = 10A, di/dt = 100A/µs
Reverse Recovery Charge
QRR
51.9
nC
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
NOT RECOMMENDED FOR NEW DESIGN
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DMTH10H030LK3
Document number: DS38737 Rev. 3 - 3
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DMTH10H030LK3
0.0
5.0
10.0
15.0
20.0
25.0
30.0
0 0.5 1 1.5 2 2.5 3
ID, DRAIN CURRENT (A)
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
VGS = 3.0V
VGS = 3.5V
VGS = 4.0V
VGS = 4.5V
VGS = 5.0V
VGS = 6.0V
VGS = 10V
0
5
10
15
20
25
30
1 1.5 2 2.5 3 3.5 4 4.5 5
ID, DRAIN CURRENT (A)
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
VDS = 10V
-55oC
25oC
85oC
125oC
150oC
175oC
0.007
0.009
0.011
0.013
0.015
0 5 10 15 20 25 30
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Drain Current
and Gate Voltage
VGS = 10V
VGS = 6V
0
0.02
0.04
0.06
0.08
0.1
0 4 8 12 16 20
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
ID= 20A
0
0.005
0.01
0.015
0.02
0.025
0.03
0 5 10 15 20 25 30
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
()
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs. Drain Current and
Junction Temperature
VGS = 10V
-55oC
25oC
85oC
125oC
150oC
175oC
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
-50 -25 025 50 75 100 125 150 175
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
TJ, JUNCTION TEMPERATURE ()
Figure 6. On-Resistance Variation with Junction
Temperature
VGS = 6V, ID= 20A
VGS = 10V, ID= 20A
NOT RECOMMENDED FOR NEW DESIGN
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Document number: DS38737 Rev. 3 - 3
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DMTH10H030LK3
0
0.005
0.01
0.015
0.02
0.025
0.03
-50 -25 025 50 75 100 125 150 175
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
TJ, JUNCTION TEMPERATURE ()
Figure 7. On-Resistance Variation with Junction
Temperature
VGS = 6V, ID= 20A
VGS = 10V, ID= 20A
0
0.5
1
1.5
2
2.5
3
3.5
4
-50 -25 025 50 75 100 125 150 175
VGS(TH), GATE THRESHOLD VOLTAGE (V)
TJ, JUNCTION TEMPERATURE ()
Figure 8. Gate Threshold Variation vs. Junction
Temperature
ID= 1mA
ID= 250µA
0
5
10
15
20
25
30
0 0.3 0.6 0.9 1.2 1.5
IS, SOURCE CURRENT (A)
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
TJ= -55oC
TJ= 25oC
TJ= 85oC
TJ= 125oC
TJ= 150oC
VGS = 0V
TJ= 175oC
1
10
100
1000
10000
010 20 30 40 50
CT, JUNCTION CAPACITANCE (pF)
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
f = 1MHz
Ciss
Coss
Crss
0
2
4
6
8
10
0 5 10 15 20 25 30 35
VGS (V)
Qg(nC)
Figure 11. Gate Charge
VDS = 50V, ID= 10A
0.01
0.1
1
10
100
1000
0.1 1 10 100 1000
ID, DRAIN CURRENT (A)
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12. SOA, Safe Operation Area
TJ(Max) = 175
TC= 25
Single Pulse
DUT on Infinite
Heatsink
VGS = 10V
RDS(ON)
Limited
PW= 1s
PW= 100ms
PW= 10ms
PW= 1ms
PW= 100µs
RDS(ON)
Limited
PW= 1µs
PW=10µs
NOT RECOMMENDED FOR NEW DESIGN
USE DMTH10H025LK3
DMTH10H030LK3
Document number: DS38737 Rev. 3 - 3
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DMTH10H030LK3
0.001
0.01
0.1
1
1E-06 1E-05 0.0001 0.001 0.01 0.1 1 10
r(t), TRANSIENT THERMAL RESISTANCE
t1, PULSE DURATION TIME (sec)
Figure 13. Transient Thermal Resistance
RθJC(t) = r(t) * RθJC
RθJC = 2/W
Duty Cycle, D = t1/t2
D=Single Pulse
D=0.005
D=0.01
D=0.02
D=0.05
D=0.1
D=0.3
D=0.5 D=0.7
D=0.9
NOT RECOMMENDED FOR NEW DESIGN
USE DMTH10H025LK3
DMTH10H030LK3
Document number: DS38737 Rev. 3 - 3
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DMTH10H030LK3
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
TO252 (DPAK)
TO252 (DPAK)
Dim
Min
Max
Typ
A
2.19
2.39
2.29
A1
0.00
0.13
0.08
A2
0.97
1.17
1.07
b
0.64
0.88
0.783
b2
0.76
1.14
0.95
b3
5.21
5.46
5.33
c
0.45
0.58
0.531
D
6.00
6.20
6.10
D1
5.21
-
-
e
-
-
2.286
E
6.45
6.70
6.58
E1
4.32
-
-
H
9.40
10.41
9.91
L
1.40
1.78
1.59
L3
0.88
1.27
1.08
L4
0.64
1.02
0.83
a
10°
-
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
TO252 (DPAK)
Dimensions
Value (in mm)
C
4.572
X
1.060
X1
5.632
Y
2.600
Y1
5.700
Y2
10.700
b3
E
L3
D
L4
b2(2x)
b(3x)
e
c
A
±
H
Seating Plane
A1
Gauge Plane
a
0.508
L
2.74REF
D1
A2
E1
X1
X
Y2
Y1
Y
C
NOT RECOMMENDED FOR NEW DESIGN
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DMTH10H030LK3
Document number: DS38737 Rev. 3 - 3
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DMTH10H030LK3
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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website, harmless against all damages.
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final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2017, Diodes Incorporated
www.diodes.com
NOT RECOMMENDED FOR NEW DESIGN
USE DMTH10H025LK3