CYW20737L
Bluetooth Low Energy
System in Package (SiP) Module
Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600
Document Number: 002-14886 Rev. *C Revised May 24, 2017
The Cypress CYW20737L is a compact, highly integrated Bluetooth Low Energy (BLE) system-in-package (SiP) module. The device
includes an embedded BLE antenna, 24 MHz clock, and 512 Kb EEPROM, so a minimal set of external components is needed to
create a standalone BLE device.
The CYW20737L accelerates time to market. The Bluetooth stack and several application profiles are built into the module, allowing
customers to focus on their core applications. To further reduce application development time, the CYW20737L includes integrated
software support, with one-click installation of the complete environment and a one-click compile/build/link/load cycle. Coupled with
an ultrasmall form factor and support for a wide voltage range, the CYW20737L is ideal for any BT Smart application.
Cypress Part Numbering Scheme
Cypress is converting the acquired IoT part numbers from Broadcom to the Cypress part numbering scheme. Due to this conversion,
there is no change in form, fit, or function as a result of offering the device with Cypress part number marking. The table provides
Cypress ordering part number that matches an existing IoT part number.
Features
■ARM Cortex-M3 microcontroller unit (MCU)
■Embedded 512 Kb EEPROM
■Broadcom Serial Control (BSC), SPI, and UART interfaces
■FCC and CE compliant
■RoHS compliant, certified lead- and halogen-free
■Moisture Sensitivity Level (MSL) 3 compliant
■6.5 mm × 6.5 mm × 1.2 mm Land Grid Array (LGA) 48-pin
package
■Requires external 1.2V DC-DC for low power in sleep and
active modes.
Applications
Profiles supported in ROM:
■Battery status
■Blood pressure monitor
■Find me
■Heart rate monitor
■Proximity
■Thermometer and Weight scale
■Time
■Blood glucose monitor
■Support for RSA security library
■Support for LE Audio
■Support for pairing using NFC tags
Additional profiles supported in RAM:
■Blood glucose monitor
■Temperature alarm
■Location
■Other custom profiles
Table 1. Mapping Table for Part Number between Broadcom and Cypress
Broadcom Part Number Cypress Part Number
BCM20737L CYW20737L
Document Number: 002-14886 Rev. *C Page 2 of 24
CYW20737L
Figure 1. CYW20737L BLE SiP Block Diagram
IoT Resources
Cypress provides a wealth of data at http://www.cypress.com/internet-things-iot to help you to select the right IoT device for your
design, and quickly and effectively integrate the device into your design. Cypress provides customer access to a wide range of
information, including technical documentation, schematic diagrams, product bill of materials, PCB layout information, and software
updates. Customers can acquire technical documentation and software from the Cypress Support Community website
(http://community.cypress.com/).
VBAT/VDDIO
BCM20737L
Bluetooth Low Energy
System-on-Chip with
ARM ® Cortex™ M3-based
Microprocessor Core
Antenna
Bandpass
Filter UART
SPI/I2C
Infrared
ADC
GPIOs
PWM
32.768 kHz
Oscillator
(optional)
24 MHz
XTAL
EEPROM
512 Kb I2C
BCM20737L
VDD1V2
CYW20737L
CYW20737L
Document Number: 002-14886 Rev. *C Page 3 of 24
CYW20737L
Contents
1. Functional Description ................................................. 4
1.1 External Reset....................................................... 4
1.2 32.768 kHz Oscillator ............................................ 4
1.3 External DC-DC Switcher Characteristics ............. 4
2. Pin Map and Signal Descriptions ................................ 5
3. Electrical Specifications ............................................10
4. RF Specifications ....................................................... 11
5. ADC Specifications .................................................... 12
6. Timing and AC Characteristics .................................13
6.1 SPI Timing........................................................... 13
6.2 BSC Interface Timing .......................................... 14
6.3 UART Timing....................................................... 15
7. PCB Design and Manufacturing Recommendations 16
7.1 Pad and Solder Mask Opening Dimensions........ 16
7.2 PCB Layout Recommendations .......................... 16
7.3 PCB Stencil ......................................................... 17
7.4 Solder Reflow...................................................... 17
8. Packaging and Storage Information ......................... 18
9. Mechanical Information ............................................. 20
10. Ordering Information ................................................ 22
Document History .......................................................... 23
Document Number: 002-14886 Rev. *C Page 4 of 24
CYW20737L
1. Functional Description
1.1 External Reset
External reset timing for the CYW20737L is illustrated in Figure 2.
Figure 2. External Reset Timing
1.2 32.768 kHz Oscillator
The CYW20737L includes a standard Pierce oscillator. The oscillator circuit includes a comparator with hysteresis on the output to
create a single-ended digital output. The hysteresis eliminates chatter when the input is near the comparator threshold (~100 mV).
The oscillator circuit can is designed for a 32 kHz or 32.768 kHz crystal oscillator, and can also be driven by an external clock input
with a similar frequency. Characteristics for a 32 kHz oscillator are defined in Ta b l e 2 .
1.3 External DC-DC Switcher Characteristics
The CYW20737L requires an external 1.2V DC switcher to operate its internal digital and RF circuits. A suitable low-power, low-noise
switcher must be supplied for proper circuit operation. Digital and analog I/Os, as well as the internal EEPROM operation from the
VBAT/VDDIO, can be from 1.62V to 3.63V. The recommended setting is 3V nominal voltage.
The following switcher, from Torex Semiconductor LTD, has been qualified and is recommended for all designs.
■XC9265B/D (see http://www.torexsemi.com/products/detail.php?id=623)
Table 2. 32 kHz Crystal Oscillator Characteristics
Parameter Symbol Conditions Min. Typ. Max. Unit
Output frequency Foscout – – 32.768 – kHz
Frequency tolerance Ftol Crystal-dependent – 100 – ppm
Start-up time Tstartup –––500µs
Crystal drive level Pdrv For crystal selection 0.5 – – µW
Crystal series resistance Rseries For crystal selection – – 70 k
Crystal shunt capacitance Cshunt For crystal selection – – 1.3 pF
RESET_N
Pulsewidth
>20µs
CrystalEnable
BasebandReset
StartreadingEEPROMand
firmwareboot
Crystal
warm‐up
delay:
~5ms
Document Number: 002-14886 Rev. *C Page 5 of 24
CYW20737L
2. Pin Map and Signal Descriptions
The CYW20737L pin map is shown in Figure 3.
Figure 3. CYW20737L (TOP View)
The signal name, type, and description of each pin in the CYW20737L is listed in Table 3 on page 6. The symbols shown under I/O
Type indicate pin directions (I/O = bidirectional, I = input, O = output) and the internal pull-up/pull-down characteristics (PU = weak
internal pull-up resistor and PD = weak internal pull-down resistor), if any.
Document Number: 002-14886 Rev. *C Page 6 of 24
CYW20737L
Table 3. Pin Descriptions
Pin Name I/O Type Description
1GPIO: P27
PWM1 I
Default direction: Input.
After POR state: Input floating.
Drain current: 16 mA
Alternate function: MOSI (master and slave) for SPI_2
2GNDGND
GND
3 VBAT I Battery supply input.
4GNDGND
GND
5GNDGND
GND
6GNDGND
GND
7GNDGND
GND
8GNDGND
GND
9GNDGND
GND
10 Reserved – Leave floating
11 GND GND GND
12 GND GND GND
13 GND GND GND
14 GND GND GND
15 GND GND GND
16 VDDC I
Connects to the 1.2V DC-DC step down switcher input.
Note: The HIDOFF/Deep Sleep function is not available when the external DC-DC is
used.
17 GND GND GND
18 UART_RX I UART_RX. This pin is pulled low through an internal 10 k resistor.
19 UART_TX O, PU UART_TX
20 GND GND GND
21 SCL I/O, PU SCL I/O, PU clock signal for an external I2C device
22 SDA I/O, PU SDA I/O, PU data signal for an external I2C device
23 GND GND GND
24 GND GND GND
25 GPIO: P1 I
Default direction: Input.
After POR state: Input floating.
This pin is tied to the WP pin of the embedded EEPROM.
Requires an external 10K pull-up
26 TMC I Test mode control. Pull this pin high to invoke test mode; leave it floating if not used. This
pin is connected to GND through an internal 10 k resistor.
27 RESET_N I/O PU Active-low system reset with open-drain output
Document Number: 002-14886 Rev. *C Page 7 of 24
CYW20737L
28 GPIO: P0 I
Default direction: Input.
After POR state: Input floating.
Alternate functions:
■A/D converter input
■Peripheral UART TX (PUART_TX)
■MOSI (master and slave) for SPI_2
■IR_RX
■60Hz_main
29 GND GND GND
30 GPIO: P3 I
Default direction: Input.
After POR state: Input floating.
Alternate functions:
■Peripheral UART CTS (PUART_CTS)
■SPI_CLK (master and slave) for SPI_2
31 GPIO: P2 I
Default direction: Input.
After POR state: Input floating.
Alternate functions:
■Peripheral UART RX (PUART_RX)
■SPI_CS (slave only) for SPI_2
■SPI_MOSI (master only) for SPI_2
32 GPIO: P4 I
Default direction: Input.
After POR state: Input floating.
Alternate functions:
■Peripheral UART RX (PUART_RX)
■MOSI (master and slave) for SPI_2.
■IR_TX
33 GPIO: P8 I
Default direction: Input.
After POR state: Input floating.
Alternate functions: A/D converter input.
34 GPIO: P33 I
Default direction: Input.
After POR state: Input floating.
Alternate functions:
■A/D converter input
■MOSI (slave only) for SPI_2
■Auxiliary clock output (ACLK1)
■Peripheral UART RX (PUART_RX)
Table 3. Pin Descriptions (Cont.)
Pin Name I/O Type Description
Document Number: 002-14886 Rev. *C Page 8 of 24
CYW20737L
35 GPIO: P32 I
Default direction: Input.
After POR state: Input floating.
Alternate functions:
■A/D converter input
■SPI_CS (slave only) for SPI_2.
■Auxiliary clock output (ACLK0)
■Peripheral UART TX (PUART_TX)
36 GPIO: P25 I
Default direction: Input.
After POR state: Input floating.
Alternate functions:
■MISO (master and slave) for SPI_2
■Peripheral UART RX (PUART_RX)
37 GPIO: P24 I
Default direction: Input.
After POR state: Input floating.
Alternate functions:
■SPI_CLK (master and slave) for SPI_2
■Peripheral UART TX (PUART_TX)
38 NC NC No Connection (N/C).
39
GPIO: P13
PWM3 I
Default Direction: Input
After POR State: Input Floating
Drain current: 16 mA
Alternate function: A/D converter input
GPIO: P28
PWM2 I
Default direction: Input.
After POR state: Input floating.
Drain current: 16 mA
Alternate functions:
■A/D converter input
■LED1
■IR_TX
40
GPIO: P14
PWM2 I
Default direction: Input.
After POR state: Input floating.
Alternate function: A/D converter input
GPIO: P38 I
Default direction: Input.
After POR state: Input floating.
Alternate functions:
■A/D converter input
■MOSI (master and slave) for SPI_2
■IR_TX
41 GPIO: P15 I
Default direction: Input.
After POR state: Input floating.
Alternate functions:
■A/D converter input
■IR_RX
■60 Hz_main
Table 3. Pin Descriptions (Cont.)
Pin Name I/O Type Description
Document Number: 002-14886 Rev. *C Page 9 of 24
CYW20737L
42 GPIO: P26
PWM0 I
Default direction: Input.
After POR state: Input floating.
Drain current: 16 mA
Alternate function: SPI_CS (slave only) for SPI_2
43
GPIO: P12 I
Default direction: Input.
After POR state: Input floating.
Alternate functions:
■A/D converter input
■XTALO32K
XTALO32K O
Low-power oscillator (LPO) output.
Alternate functions:
P12
P26
44
GPIO: P11 I
Default direction: Input.
After POR state: Input floating.
Alternate functions:
■A/D converter input
■XTALI32K
XTALI32K I
Low-power oscillator (LPO) input.
Alternate functions:
■P11
■P27
45 GND GND GND
46 GND GND GND
47 GND GND GND
48 GND GND GND
Table 3. Pin Descriptions (Cont.)
Pin Name I/O Type Description
Document Number: 002-14886 Rev. *C Page 10 of 24
CYW20737L
3. Electrical Specifications
Absolute maximum ratings are defined in Table 4.
Power for the CYW20737L module is provided by the system through the power pins.
Note: All measurements taken at 25°C
Table 4. Absolute Maximum Ratings
Parameter Min. Max. Unit
Supply power NA 1.32 V
Storage temperature –40 125 °C
Voltage ripple 0±2%
Power supply (VBAT absolute maximum rating) 1.62 3.63 V
Table 5. Voltage
Symbol Parameter Min. Typ. Max. Unit
VBAT Battery voltage 1.62 – 3.63 V
Table 6. Current Consumption
Operating Mode Condition Nominal Maximum Unit
Receive Receiver and baseband are both operating, 100% 11.5 12.4 mA
Transmit Transmitter and baseband are both operating, 100% 9.0 9.8 mA
Sleep Wake in < 5 ms 29.0 35.0 µA
Document Number: 002-14886 Rev. *C Page 11 of 24
CYW20737L
4. RF Specifications
CYW20737L receiver specifications are defined in Ta b le 7.
Note: All measurements taken at 25°C
RF transmitter specifications are defined in Table 8.
Table 7. Receiver Specifications
Parameter Mode and Conditions Min. Typ. Max. Unit
Frequency range – 2402 – 2480 MHz
RX sensitivity (standard) Packets: 200
Payload: PRBS 9
Length: 37 Bytes
Dirty Transmitter: off.
PER: 30.8%
––94 – dBm
Maximum input – –10 – – dBm
Table 8. Transmitter Specifications
Parameter Min. Typ. Max. Unit
Transmitter
Frequency rangea
a. This parameter is taken from the Bluetooth 4.0 specification.
2402 – 2480 MHz
Output power adjustment range –20 – 4 dBm
Output power – 2 – dBm
Output power variation – 2.5 – dB
LO Performance
Initial carrier frequency tolerance – – ±150 kHz
Frequency Drift
Frequency drift – – ±50 kHz
Drift rate – – 20 kHz/50 µs
Frequency Deviation
Average deviation in payload
(sequence: 00001111)
225 – 275 kHz
Average deviation in payload
(sequence: 10101010)
185 – – kHz
Channel spacing – 2 – MHz
Document Number: 002-14886 Rev. *C Page 12 of 24
CYW20737L
5. ADC Specifications
CYW20737L ADC specifications are defined in Table 9.
Table 9. ADC Specifications
Parameter Symbol Conditions Min. Typ. Max. Unit
Number of input channels – – – 9 – -
Channel switching rate fch – – – 133.33 Kch/s
Input signal range Vinp –0–3.63V
Reference settling time – Charging refsel 7.5 – – µs
Input resistance Rinp Effective, single-ended – 500 – k
Input capacitance Cinp –––5pF
Conversion rate Fc– 5.859 – 187 kHz
Conversion time Tc– 5.35 – 170.7 µs
Resolution R – 16 Bits
Absolute voltage measurement error – Using on–chip ADC firmware
driver
–±2–%
Current I Iavdd1p2 + Iavdd3p3 ––1mA
Power P – – 1.5 – mW
Leakage Current Ileakage T = 25°C – – 100 nA
Power-up time Tpowerup – – – 200 µs
Integral nonlinearity INL In the guaranteed
performance range
–1 – 1 LSBa
a. LSBs are expressed at the 10-bit level.
Differential nonlinearity DNL In the guaranteed
performance range
–1 – 1 LSBa
Document Number: 002-14886 Rev. *C Page 13 of 24
CYW20737L
6. Timing and AC Characteristics
6.1 SPI Timing
SPI interface timing is illustrated in Figure 4 and Figure 5 and defined in Table 10 on page 14.
Figure 4. SPI Timing—Modes 0 and 2
Figure 5. SPI Timing—Modes 1 and 3
3
SPI_CSN
SPI_CLK
(Mode0)
SPI_MOSI ‐FirstBit
SPI_MISO NotDriven FirstBit
SecondBit
SecondBit
Lastbit
Lastbit
1
2
6
SPI_CLK
(Mode2)
NotDriven
‐
54
3
SPI_CSN
SPI_CLK
(Mode1)
SPI_MOSI ‐Invalidbit
SPI_MISO NotDriven Invalidbit
Firstbit
Firstbit
Lastbit
Lastbit
1
2
6
‐
NotDriven
SPI_CLK
(Mode3)
54
Document Number: 002-14886 Rev. *C Page 14 of 24
CYW20737L
6.2 BSC Interface Timing
BSC interface timing is illustrated in Figure 6 and is defined in Table 11 .
Figure 6. BSC Interface Timing
Table 10. SPI Interface Timing Specifications
Reference Characteristics Min. Typ. Max.
1 Time from CSN asserted to first clock edge 1 SCK 100
2 Master setup time – 1/2SCK –
3 Master hold time 1/2SCK - –
4 Slave setup time – 1/2 SCK –
5 Slave hold time 1/2 SCK – –
6 Time from last clock edge to CSN deasserted SCK 10 SCK 100
Table 11. BSC Interface Timing Specifications
Reference Characteristics Min. Max. Unit
1 Clock frequency – 100, 400, 800, 1000 kHz
2 START condition setup time 650 – ns
3 START condition hold time 280 – ns
4 Clock low time 650 – ns
5 Clock high time 280 – ns
6 Data input hold time 0 – ns
7 Data input setup time 100 – ns
8 STOP condition setup time 280 – ns
9 Output valid from clock – 400 ns
10 Bus free time 650 – ns
Document Number: 002-14886 Rev. *C Page 15 of 24
CYW20737L
6.3 UART Timing
UART timing is illustrated in Figure 7 and defined in Table 12.
Figure 7. UART Timing
Table 12. UART Timing Specifications
Reference Characteristics Min. Max. Unit
1 Delay time, UART_CTS_N low to UART_TXD valid – 24 Baudout cycles
2 Setup time, UART_CTS_N high before midpoint of stop bit – 10 ns
3 Delay time, midpoint of stop bit to UART_RTS_N high – 2 Baudout cycles
Document Number: 002-14886 Rev. *C Page 16 of 24
CYW20737L
7. PCB Design and Manufacturing Recommendations
7.1 Pad and Solder Mask Opening Dimensions
CYW20737L pad and solder mask opening dimensions are defined in Tab l e 1 3.
7.2 PCB Layout Recommendations
The following layout recommendations are referenced to Figure 8 on page 16.
■Connect to system ground from side D of the module (pins 13–22).
■The L-shaped ground plane is required for the embedded BLE antenna. Keep the GND continuous. Do not cut off the GND shape
to accommodate trace routes.
■An L-shaped ground plane is required. If the L-shaped GND plane is located on the top layer of the PCB, do not place components
on the ground plane. If this cannot be avoided, move the L-shaped ground plane to another layer.
■Antenna efficiency of 31–41% can be achieved based on the layout in Figure 8 on page 16 and the dimensions listed below. Following
these layout recommendations is expected to yield 50+ meters of usable range; deviating from these recommendations may reduce
the range of the antenna.
❐D: 4.5 mm (typical)
❐G, H, S: 3 mm (typical)
❐L: 3 mm (minimum)
❐W: 0.4 mm (typical)
■Route signal traces out of the module from side C (between pins 27 and 30) or side D (between pins 16 and 19) of the module.
Traces can be overlapped to avoid routing through the keep-out area.
■Do not route traces from side A or side B.
Figure 8. PCB Layout Example
Table 13. Pad and Solder Mask Dimensions
Pad Type Pad Dimensions Solder Mask Opening Dimensions Unit
Type A 0.6 × 0.25 0.7 × 0.35
mmType B 0.55 × 0.3 0.65 × 0.4
Type C 0.4 × 0.4 0.5 × 0.5
Document Number: 002-14886 Rev. *C Page 17 of 24
CYW20737L
7.3 PCB Stencil
The recommended PCB stencil is shown in Figure 9 (all measurements in mm). Use an unsolder mask to set the module footprint.
Figure 9. CYW20737L Stencil (Bottom View)
7.4 Solder Reflow
The recommended solder reflow profile for the CYW20737L is defined in Figure 10.
Figure 10. Solder Reflow Profile
245°C
217°C
200°C
150°C
Ti
Temperature
Pre‐Heating:90~120sec. Soldering:60~90sec.
Document Number: 002-14886 Rev. *C Page 18 of 24
CYW20737L
8. Packaging and Storage Information
The CYW20737L is available in a tape and reel package and is shipped in an ESD-protected moisture-resistant (MSL-3) bag as shown
in Figure 11. The storage temperature range is –40°C to +125°C.
Figure 11. CYW20737L ESD/Moisture Packaging
The moisture sensitivity label on the CYW20737L shipping bag is shown in Figure 12 on page 19.
Document Number: 002-14886 Rev. *C Page 22 of 24
CYW20737L
10. Ordering Information
Table 14. Ordering Information
Part Number Package Operating Temperature Humidity
CYW20737L 48-pin LGA –40°C to +85°C 95% max., noncondensing
Document Number: 002-14886 Rev. *C Page 23 of 24
CYW20737L
Document History
Document Title: CYW20737L Bluetooth Low Energy System in Package (SiP) Module
Document Number: 002-14886
Revision ECN Orig. of
Change
Submission
Date Description of Change
** – – 03/01/2016 20737L-DS100-R:
Initial release
*A – UTSV 03/24/2016
20737L-DS101-R:
Updated:
•Table 4 on page 10
•Table 6 on page 10
*B 5445313 UTSV 09/23/2016 Updated to Cypress template
*C 5746161 AESATP12 05/24/2017 Updated logo and copyright.
Revised May 24, 2017 Page 24 of 24
© Cypress Semiconductor Corporation, 2016-2017. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries
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CYW20737L
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