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RATING AND CHARACTERISTIC CURVES
S08M02-D SERIES
Characteristic Symbol Value Unit
Thermal Resistance - Junction to Ambient RthJA 156
/
℃
W
Thermal Resistance - Junction to Tab (Measured on MT2 Tab adjacent to Purposes) RthJT 25
/W
℃
Maximum Device Temperature for Soldering Purposes (for 10 Seconds Maximum)
T
L
260
℃
Characteristics Symbol Min Typ Max Unit
Peak Reptitive Forward or Reverse Blocking Current T
j
=25
℃
(V
AK
=Rated VDRM and VRRM; R
GK
=1000 Ohms) T
j
=110
℃
I
DRM
I
RRM
----
---- ----
----
10
200 uA
uA
Peak Forward On-State Voltage
(I
T=
±1.0 A Peak @Tp 300 us, Duty Cycle 2%)
≦ ≦
V
TM
---- ---- 1.7 Volts
Gate Trigger Current (Continuous dc)
(V
AK
= 12 Vdc; R
L
= 100 Ohms) I
GT
---- ---- 200 uA
Holding Current (V
AK
= 12 Vdc, Initiating Current =20 mA) I
H
---- ---- 5.0 mA
Gate Trigger Voltage (Continuous dc)
(V
AK
= 12 Vdc; R
L
=100 Ohms) V
GT
---- ---- 0.8 Volts
Critical Rate of Rise of Off-State Voltage
(V
AK
=Rated V
DRM
,Exponential Waveform Method,
R
GK
=1000 Ohms, T
C
=110 )
℃
dv/dt 10 ---- ---- V/us
THERMAL CHARACTERISTICS
ELECTRICAL CHARACTERISTICS
(T
c
=25 unless otherwise noted)
℃
OFF CHARACTERISTICS
ON CHARACTERISTICS
DYNAMIC CHARACTERISTICS