Feb. 2009
1
CM200TL-24NF
APPLICATION
AC drive inverters & Servo controls, etc
MITSUBISHI IGBT MODULES
CM200TL-24NF
HIGH POWER SWITCHING USE
¡IC ...................................................................200A
¡VCES ......................................................... 1200V
¡Insulated Type
¡6-elements in a pack
OUTLINE DRAWING & CIRCUIT DIAGRAM
Dimensions in mm
P
BU
N
CN-7
CN-8 CN-5
CN-6
UP-1
UP-2
V
CN-3
CN-4
VP-1
VP-2
W
CN-1
CN-2
WP-1
WP-2
NC
NC
NC
LABEL
U
BNP
VW
1
18
CN
11
WP VP UP
202016.5
18
110
±0.5
(6.05) (6.05)
11.7
262617.5
135
10.5
10.5
18.7
110
10.510.5
10.5 10.5
(13)
48.75
13.75
26.5
4
4-φ5.5
MOUNTING HOLES
78
±0.5
(6.05) (6.05)
2530.5 25 (13)
11
46.3
A
B
13
24.1
(SCREWING DEPTH)
6-M5 NUTS
+1
–0.5
Housing Type of A and B
(J.S.T.Mfg.Co.Ltd)
A = B8P-VH-FB-B, B = B2P-VH-FB-B
CIRCUIT DIAGRAM
Feb. 2009
2
IC = 20mA, VCE = 10V
Tj = 25°C
Tj = 125°C
VCE = 10V
VGE = 0V
VCE = VCES, VGE = 0V
±VGE = VGES, VCE = 0V
IC = 200A, VGE = 15V
VCC = 600V, IC = 200A, VGE = 15V
VCC = 600V, IC = 200A
VGE = ±15V
RG = 1.6Ω, Inductive load
IE = 200A
IE = 200A, VGE = 0V
IGBT part (1/6 module)*1
FWDi part (1/6 module)*1
Case to heat sink, Thermal compound Applied (1/6 module)
*2
1200
±20
200
400
200
400
1160
–40 ~ +150
–40 ~ +125
2500
2.5 ~ 3.5
2.5 ~ 3.5
750
MITSUBISHI IGBT MODULES
CM200TL-24NF
HIGH POWER SWITCHING USE
V
V
A
A
A
A
W
°C
°C
Vrms
N • m
N • m
g
1
0.5
3.1
—
35
3
0.68
—
130
70
400
350
150
—
3.8
0.11
0.17
—
21
mA
µA
nF
nF
nF
nC
ns
ns
ns
ns
µC
V
K/W
K/W
K/W
Ω
—
—
2.1
2.4
—
—
—
1000
—
—
—
—
—
9
—
—
—
0.051
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1.6
7V
V
68
ns
Collector cutoff current
Gate leakage current
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Reverse recovery time
Reverse recovery charge
Emitter-collector voltage
Contact thermal resistance
External gate resistance
Gate-emitter threshold voltage
Collector-emitter saturation voltage
Thermal resistance
ICES
IGES
Cies
Coes
Cres
QG
td(on)
tr
td(off)
tf
trr (
Note 1
)
Qrr (
Note 1
)
VEC(
Note 1
)
Rth(j-c)Q
Rth(j-c)R
Rth(c-f)
RG
Symbol Parameter
VGE(th)
VCE(sat)
*1 : Case temperature (Tc) measured point is just under the chips.
If you use this value, Rth(f-a) should be measured just under the chips.
*2 : Typical value is measured by using thermally conductive grease of
λ
= 0.9[W/(m • K)].
Note 1. IE, VEC, trr & Qrr represent characteristics of the anti-parallel, emitter-collector free-wheel diode (FWDi).
2. Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed Tjmax rating.
3. Junction temperature (Tj) should not increase beyond 150°C.
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
Collector-emitter voltage
Gate-emitter voltage
Maximum collector dissipation
Junction temperature
Storage temperature
Isolation voltage
Weight
G-E Short
C-E Short
DC, TC = 72°C*1
Pulse (Note 2)
Pulse (Note 2)
TC = 25°C
Terminals to base plate, f = 60Hz, AC 1 minute
Main terminals M5 screw
Mounting M5 screw
Typical value
Symbol Parameter
Collector current
Emitter current
Torque strength
Conditions UnitRatings
VCES
VGES
IC
ICM
IE (
Note 1
)
IEM (
Note 1
)
PC (
Note 3
)
Tj
Tstg
Viso
—
—
—
Unit
Typ.
Limits
Min. Max.
ABSOLUTE MAXIMUM RATINGS (Tj = 25°C, unless otherwise specified)
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
Test conditions
Feb. 2009
3
MITSUBISHI IGBT MODULES
CM200TL-24NF
HIGH POWER SWITCHING USE
PERFORMANCE CURVES
0
10
1
10
2
2
3
5
7
10
3
2
3
5
7
0
400
350
300
250
200
150
100
50
0 100 200 300 40050 150 250 350
OUTPUT CHARACTERISTICS
(TYPICAL)
COLLECTOR CURRENT IC (A)
COLLECTOR-EMITTER VOLTAGE V
CE
(V)
Tj = 25°C
11
12
10
9
VGE =
20V 15
13
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL)
COLLECTOR-EMITTER
SATURATION VOLTAGE V
CE (sat)
(V)
COLLECTOR CURRENT I
C
(A)
VGE = 15V
Tj = 25°C
Tj = 125°C
10
8
6
4
2
02012 146810 16 18
GATE-EMITTER VOLTAGE V
GE
(V)
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL)
COLLECTOR-EMITTER
SATURATION VOLTAGE V
CE (sat)
(V)
Tj = 25°C
IC = 200A
IC = 400A
IC = 80A
12 435
FREE-WHEEL DIODE
FORWARD CHARACTERISTICS
(TYPICAL)
EMITTER CURRENT IE (A)
EMITTER-COLLECTOR VOLTAGE V
EC
(V)
Tj = 25°C
Tj = 125°C
10
–1
2
10
0
357 2
10
1
357 2
10
2
357
CAPACITANCE–VCE
CHARACTERISTICS
(TYPICAL)
CAPACITANCE C
ies
, C
oes
, C
res
(nF)
COLLECTOR-EMITTER VOLTAGE V
CE
(V)
Cies
Coes
Cres
VGE = 0V 10
0
10
1
2
3
5
7
10
2
2
3
5
7
10
3
2
3
5
7
10
–1
10
0
2
3
5
7
10
1
2
3
5
7
10
2
2
3
5
7
10
1
10
2
57
10
3
23 5723
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL)
SWITCHING TIME (ns)
COLLECTOR CURRENT I
C
(A)
Conditions:
VCC = 600V
VGE = ±15V
RG = 1.6Ω
Tj = 125°C
Inductive load
td(off)
td(on)
tf
tr
0246810 0
4
3
2
1
Feb. 2009
4
MITSUBISHI IGBT MODULES
CM200TL-24NF
HIGH POWER SWITCHING USE
10
1
10
2
23 57
10
3
23 57
10
1
10
2
2
3
5
7
10
3
2
3
5
7
t
rr
I
rr
REVERSE RECOVERY CHARACTERISTICS
OF FREE-WHEEL DIODE
(TYPICAL)
EMITTER CURRENT I
E
(A)
REVERSE RECOVERY TIME t
rr
(ns)
REVERSE RECOVERY CURRENT l
rr
(A)
Conditions:
V
CC
= 600V
V
GE
= ±15V
R
G
= 1.6Ω
T
j
= 25°C
Inductive load 10
–3
10
2
10
1
10
–5
10
–4
10
0
7
5
3
2
10
–2
7
5
3
2
10
–1
7
5
3
2
10
–3
23 57 23 57 23 57 23 57
10
1
10
–2
10
–1
10
0
10
–3
10
–3
7
5
3
2
10
–2
7
5
3
2
10
–1
23 57 23 57
Single Pulse,
T
C
= 25°C
Under the chip
TRANSIENT THERMAL
IMPEDANCE CHARACTERISTICS
(IGBT part & FWDi part)
NORMALIZED TRANSIENT
THERMAL IMPEDANCE Z
th (j–c)
(ratio)
TIME (s)
IGBT part:
Per unit base =
R
th(j–c)
= 0.11K/W
FWDi part:
Per unit base =
Rth(j–c) = 0.17K/W
10
0
2
3
5
7
2
3
5
7
10
1
10
2
57
10
3
23 5723
RECOVERY LOSS vs. I
E
(TYPICAL)
RECOVERY LOSS (mJ/pulse)
EMITTER CURRENT I
E
(A)
Conditions:
V
CC
= 600V
V
GE
= ±15V
R
G
= 1.6Ω
T
j
= 125°C
Inductive load
C snubber at bus
Err
10
2
10
1
10
0
2
3
5
7
2
3
5
7
10
1
10
2
57
10
3
23 5723
SWITCHING LOSS vs.
COLLECTOR CURRENT
(TYPICAL)
SWITCHING LOSS (mJ/pulse)
COLLECTOR CURRENT I
C
(A)
Conditions:
V
CC
= 600V
V
GE
= ±15V
R
G
= 1.6Ω
T
j
= 125°C
Inductive load
C snubber at bus
Esw(off)
Esw(on)
SWITCHING LOSS vs.
GATE RESISTANCE
(TYPICAL)
SWITCHING LOSS (mJ/pulse)
GATE RESISTANCE R
G
(Ω)
10
2
10
1
10
0
Conditions:
V
CC
= 600V
V
GE
= ±15V
I
C
= 200A
T
j
= 125°C
Inductive load
C snubber at bus
Esw(off)
Esw(on)
2
3
5
7
2
3
5
7
10
0
10
1
57
10
2
23 5723
10
2
10
1
10
0
2
3
5
7
2
3
5
7
10
0
10
1
57
10
2
23 5723
RECOVERY LOSS vs.
GATE RESISTANCE
(TYPICAL)
RECOVERY LOSS (mJ/pulse)
GATE RESISTANCE R
G
(Ω)
Conditions:
V
CC
= 600V
V
GE
= ±15V
I
E
= 200A
T
j
= 125°C
Inductive load
C snubber at bus
Err
Feb. 2009
5
400 800 1200200 600 1000 1400
0
20
16
12
8
4
0
GATE CHARGE
CHARACTERISTICS
(TYPICAL)
GATE-EMITTER VOLTAGE VGE (V)
GATE CHARGE QG (nC)
V
CC
= 600V
V
CC
= 400V
I
C
= 200A
0
MITSUBISHI IGBT MODULES
CM200TL-24NF
HIGH POWER SWITCHING USE
