PART NUMBER DATA SHEET EC5925ETTS-20.000M TR SVHC 151 Dec 16, 2013 ELECTRICAL SPECIFICATIONS Nominal Frequency 20.000MHz Frequency Tolerance/Stability 25ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Ouput Load Change, First Year Aging at 25C, Shock, and Vibration) Operating Temperature Range -40C to +85C Supply Voltage 1.8Vdc 5% Input Current 2.5mA Maximum Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH = -4mA) Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL = +4mA) Rise/Fall Time 10nSec Maximum (Measured at 20% to 80% of waveform) Duty Cycle 50 10(%) (Measured at 50% of waveform) Load Drive Capability 15pF Maximum Output Logic Type CMOS Pin 1 Connection Tri-State (High Impedance) Tri-State Input Voltage (Vih and Vil) 90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output (High Impedance) Standby Current 10A Maximum (Disabled Output; High Impedance) RMS Phase Jitter 1pSec Maximum (12kHz to 20MHz offset frequency) Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Revision E 11/12/2012 | Page 1 of 7 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EC5925ETTS-20.000M TR MECHANICAL DIMENSIONS (all dimensions in millimeters) 2.00 0.10 0.675 0.100 MARKING ORIENTATION 4 2.50 0.10 1 0.775 0.100 PIN CONNECTION 1 Tri-State 2 Case/Ground 3 Output 4 Supply Voltage LINE MARKING 0.95 0.10 3 0.80 0.10 2 1 E20.0 E=Ecliptek Designator 2 XXXXX XXXXX=Ecliptek Manufacturing Identifier 0.650.10 Suggested Solder Pad Layout All Dimensions in Millimeters 1.0 (X4) 1.2 (X4) Solder Land (X4) 0.5 0.3 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision E 11/12/2012 | Page 2 of 7 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EC5925ETTS-20.000M TR CLOCK OUTPUT TRI-STATE INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 80% of Waveform OUTPUT DISABLE (HIGH IMPEDANCE STATE) 50% of Waveform 20% of Waveform VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Revision E 11/12/2012 | Page 3 of 7 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EC5925ETTS-20.000M TR Test Circuit for CMOS Output Frequency Counter Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Probe (Note 2) Output + Voltage Meter _ 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) Tri-State Note 1: An external 0.01F ceramic bypass capacitor in parallel with a 0.1F high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Revision E 11/12/2012 | Page 4 of 7 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EC5925ETTS-20.000M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units All Dimensions in Millimeters Compliant to EIA-481 4.00 0.10 2.00 0.10 1.55 0.05 0.25 0.05 3.50 0.10 8.00 0.20 A0* 2.75 0.10 4.00 0.10 B0* 1.5 MIN K0* 14.4 MAX DIA 40 MIN Access Hole at Slot Location 330 MAX DIA 50 MIN DIA 20.2 MIN DIA 13.0 0.2 2.5 MIN Width 10.0 MIN Depth Tape slot in Core for Tape Start 8.4 +1.5/-0.0 www.ecliptek.com | Specification Subject to Change Without Notice | Revision E 11/12/2012 | Page 5 of 7 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EC5925ETTS-20.000M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Time (t) tP 3C/Second Maximum 150C 175C 200C 60 - 180 Seconds 3C/Second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 Seconds 6C/Second Maximum 8 Minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision E 11/12/2012 | Page 6 of 7 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EC5925ETTS-20.000M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Time (t) tP 5C/Second Maximum N/A 150C N/A 60 - 120 Seconds 5C/Second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 2 Times / 230C Maximum 1 Time 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time 5C/Second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 Seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 Seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Revision E 11/12/2012 | Page 7 of 7 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200