Application Specification
Standard Edge Card (SEC) II,
SEC II Power, and High Current 114-13018
LOC B
1
of 20
E
2007 Tyco Electronics Corporation, Harrisburg, PA
All International Rights Reserved
TE logo and Tyco Electronics are trademarks.
*Trademark. Other products, logos, and company names used are the property of their respective owners.
TOOLING ASSISTANCE CENTER 1-800-722-1111
PRODUCT INFORMATION 1-800-522-6752 This controlled document is subject to change.
For latest revision and Regional Customer Service,
visit our website at
www.tycoelectronics.com
Card Edge Connectors
13 JUN 07 Rev B
All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and
inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2
_
.
Figures and illustrations are for identification only and are not drawn to scale.
1. INTRODUCTION
This specification covers the requirements for application of SEC II, SEC II Power, and High Current Card
Edge connectors onto printed circuit (pc) boards for use in computer and electronic equipment. The connectors
are designed to connect a module pc board (daughter card) to a main pc board (motherboard). These
connectors are available in vertical, right–angle, or straddle–mount configuration with through–hole, press–fit
(compliant pin), or surface–mount contacts. Each connector has a double row of contact cavities with a
centerline spacing of 2.54 [.100]. The connectors are available with 6 through 140 positions. The connectors
are available with or without a Pin 1 designation (an embossed triangle or square on the mating face of the
connector). The connectors feature omitted contacts for polarization to the pc board. In addition, SEC II vertical
and High Current Card Edge connectors are available with or without formed posts to retain the connector to
the pc board during soldering. All connectors, except the straddle–mount configuration, feature standoffs to
allow easy pc board cleaning after soldering.
Each connector features a housing with a card slot which accepts 1.37 through 1.78 [.054 through .070] thick
daughter card. The connectors are available with or without a molded key or inter–contact keying slots located
in the card slot. Each inter–contact keying slot which accepts a key plug (available separately) and the molded
key are used to ensure proper orientation with the mating daughter card—which must be slotted to accept a
molded key or key plug(s).
These connectors are available with or without mounting ears that accept a metal retaining clip (available
separately) to secure the daughter card in place, mounting ears that accept mounting hardware (customer
supplied) to secure the connector to the pc board, or integrated latches to support and hold the daughter card
in the mating position.
When corresponding with personnel, use the terminology provided in this specification to facilitate your
inquiries for information. Basic terms and features of this product are provided in Figure 1.
Figure 1 (Cont’d)
SEC II Vertical Card Edge Connector
With Through-Hole Contacts
Standoff
(2 Places)
Mounting Ear
(2 Places)
Contact
Solder Tine
Card Slot
Housing
Pin 1 Designator
(Optional) Molded Key
(Optional)
G
Omitted Contact
(Optional)
G
G
Position Varies
SEC II Right-Angle Card Edge Connector
With Through-Hole Contacts
Contact
Solder Tine
Card Slot
Standoff
(2 Places)
Housing
Inter-Contact
Keying Slot
(Optional)
Formed Post (Optional)
(8 Places)
Pin 1 Designator
(Optional)
Inter-Contact
Keying Slot
(Optional)
NOTE
i
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Figure 1 (End)
SEC II Power Straddle-Mount Card Edge Connector
With Surface-Mount Contacts High Current Vertical Card Edge Connector
With Press-Fit Contacts
Latch (2 Places)
(Shown in Open Position)
Housing
Press-Fit
Contact
Standoff
(2 Places)
G
Position Varies
Formed Post (Optional)
(8 Places)
Surface-Mount
Contact
Mounting Ear
With Hole (2 Places)
Card Slot
Housing
Power Module
(3 Places, Ref)
Molded Key
(Optional)
G
Omitted Contact
(Optional)
G
Omitted Contact
(Optional)
G
Card Slot
Molded Key
(Optional)
G
Pin 1 Designator
(Optional) Pin 1 Designator
(Optional)
Inter-Contact
Keying Slot
(Optional)
Inter-Contact
Keying Slot
(Optional)
The connectors are supplied in soft tray form for manual placement, and hard tray form for automatic machine
placement.
2. REFERENCE MATERIAL
2.1. Revision Summary
Revisions to this application specification include:
S
Added NOTE to Paragraph 3.10
S
Modified Paragraphs 5.6 and 5.7
2.2. Customer Assistance
Reference Product Part Number 532600 (SEC II) and Product Code 2308, and Reference Product Part
Numbers 1761500 (SEC II Power) and 1489165 (High Current) and Product Code H089 are representative of
these connectors. Use of these numbers will identify the product line and expedite your inquiries through a
service network established to help you obtain product and tooling information. Such information can be
obtained through a local Representative (Field Service Engineer, Field Applications Engineer, etc.) or, after
purchase, by calling PRODUCT INFORMATION at the number at the bottom of page 1.
2.3. Drawings
Customer Drawings for product part numbers are available from the service network. If there is a conflict
between the information contained in the Customer Drawings and this specification or with any other technical
documentation supplied, call PRODUCT INFORMATION at the number at the bottom of page 1.
SEC II, SEC II Power, and High Current Card Edge Connectors 114-13018
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2.4. Manuals
Manuals (402–series) can be used as a guide to soldering. These manuals provide information on various flux
types and characteristics with the commercial designation, flux removal procedures, and a guide for
information on soldering problems. Documents available which pertain to this product are:
402–40 Solderability and Soldering
402–58–1 Lead–Free Soldering Guidelines for Wave Soldering Specific to Power Products
402–58–2 Lead–Free Soldering Guidelines for Reflow Soldering Specific to Power Products
2.5. Specifications
Product Specifications (108–series) provide product performance and test information. Documents available
which pertain to this product are:
108–2148 High Current Card Edge Connector Assembly
108–2202 SEC II Power Card Edge Connector
108–9039 Standard Edge Connector
108–9039–1 Standard Edge II Connector for VRM 8.5 and 9.0 Applications
108–9039–2 Standard Edge II Connector for VRM 9.1 Applications
Qualification Test Report (501–series) is a test report confirming successful qualification of the information in
product specifications. Documents available which pertain to this product are:
501–227 Standard Edge Connector
501–227–1 Standard Edge II Connector for VRM 8.5 and 9.0 Applications
501–227–2 Standard Edge II Connector for VRM 9.1 Applications
501–569 High Current Card Edge Connector Assembly
501–608 SEC II Power Card Edge Connector
Test Specification 109–11 provides solderability requirements and evaluation methods, and Workmanship
Specification 101–21 provides solder fillet requirements.
2.6. Instructional Material
Instruction Sheets (408–series) provide assembly instructions and Customer Manuals (409–series) provide
machine setup and operation procedures. Documents available which pertain to this product are:
408–6923 Manual Arbor Frame Assembly 58024–1
408–6927 Design Recommendations for PC Board Support Fixture
408–9027 Adapter Kit for GREENERD Frame Assembly
408–8666 Seating Tool Assembly 1424555–[ ]
409–5626 SM–3 Machine 814700–2
3. REQUIREMENTS
3.1. Safety
Do not stack component packages so high that the shipping containers buckle or deform.
3.2. Limitations
These connectors are designed to operate in a temperature range of –55
_
to 105
_
C [–67
_
to 221
_
F].
3.3. Material
The connector housing is made of glass–filled polyester. The contacts are made of copper alloy plated with
nickel; contact areas are plated with gold, and press–fit contact tines and solder tines are plated with tin or
tin–lead.
3.4. Storage
A. Ultraviolet Light
Prolonged exposure to ultraviolet light may deteriorate the chemical composition used in the connector
material.
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B. Shelf Life
The connectors should remain in the shipping containers until ready for use to prevent deformation to the
contacts. The connectors should be used on a first in, first out basis to avoid storage contamination that
could adversely affect performance.
3.5. Chemical Exposure
Do not store connectors near any chemical listed below as they may cause stress corrosion cracking in
the contacts.
Alkalies Ammonia Citrates Phosphates Citrates Sulfur Compounds
Amines Carbonates Nitrites Sulfur Nitrites Tartrates
3.6. PC Board (Motherboard)
A. Material and Thickness
The pc board material shall be glass epoxy (FR–4 or G–10). The pc board thickness range shall be 1.37
through 1.78 [.054 through .070] for connectors with surface–mount contacts, and a minimum of
1.37 [1.78] for connectors with through–hole or press–fit contacts.
Contact PRODUCT INFORMATION at the number at the bottom of page 1 for suitability of other board materials and
thicknesses.
B. Tolerance
Maximum allowable bow of the pc board shall be 0.03 [.001] over the length of the connector.
For connectors with press–fit contacts, maximum allowable recycle of the pc board holes shall be three
times.
C. Pads
For connectors with surface–mount contacts, the pc board circuit pads must be solderable in accordance
with Test Specification 109–11.
D. Hole Dimensions
The holes in the pc board for through–hole contacts, press–fit contacts, and formed posts must be drilled
and plated through to specific dimensions. The plating type and thickness and finished hole size must be
as stated to provide unrestricted insertion. See Figure 2.
NOTE
i
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Tyco Electronics Corporation
A
Drilled Hole Diameter
B
Finished Hole Diameter
After Plating
Pad Width (Equals Finished
Hole Diameter Plus 0.51 [.020])
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
Trace Width (As Required)
C
Copper Plating (Max Hardness 150 Knoop)
D
CONNECTOR
DIMENSION
CONNECTOR
CONTACT
TYPE
A
B
C
D
TYPE
A
B
C
Surface Finish Thickness
Tin-Lead (SnPb) 0.008 [.0003] (Min)
Immersion Tin (Sn) 0.0005-0.004
[.00002-.0015]
Th hHl
1.15+/
-
0.03
1.02+/
-
0.08
0.051+0.025
Organic Solderability Preservative (OSP) 0.0002-0.0005
[.000008-.00002]
Through-Hole
1
.
15+/ 0
.
03
[.0453+/-.001]
1
.
02+/ 0
.
08
[.040+/-.003]
0
.
051+0
.
025
[.002+.001]
Immersion Gold (Au) Over Nickel (Ni) (ENIG)
0.0001-0.0005
[.000004-.00002] Au
0.004-0.0051
[.00015-.0002] Ni
Immersion Silver (Ag) 0.0001-0.0005
[.000004-.000008]
Hot Air Solder Leveling (HASL)
Tin-Lead (SnPb) 0.004-0.010
[.00015-.00039]
Immersion Tin (Sn) 0.0005-0.004
[.00002-.00015]
Press
-
Fit
1.20+/-0.03
[ 0472 / 001]
1.07 [.042]
Rf
0.025-0.050
[ 0001 0002]
Organic Solderability Preservative (OSP) 0.0002-0.0005
[.000008-.00002]
Press Fit
[.0472+/-.001] Ref [.0001-.0002]
Immersion Gold (Au) Over Nickel (Ni) (ENIG)
0.0001-0.0005
[.000004-.00002] Au
0.004-0.0051
[.00015-.0002] Ni
Immersion Silver (Ag) 0.0001-0.0005
[.000004-.000008]
Figure 2
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E. Layout
The holes (for through–hole contacts, press–fit contacts, and formed posts) or pads (for surface–mount
contacts) on the pc board must be precisely located to ensure proper placement and optimum
performance of the connector. The pc board layout must be designed using the dimensions provided on
the customer drawing for the specific connector. A
typical
recommended pc board layout for each is shown
in Figure 3.
Typical Recommended PC Board (Motherboard) Layout
Number of Holes
5.08
[.200]
Finished Hole Diameter After Plating (Refer to Figure 2)
0.15 [.006]
BSC
BSC
-X-
-Y-
Datums and Basic Dimensions Established by Customer
Figure 3
Number of Spaces at 2.54 [.100]
Connectors with Through-Hole or Press-Fit Contacts
Connectors with Surface-Mount Contacts
J-JSECTION
-R-
55.68
[2.192]
62.87
[2.475]
4.11
[.162]
2 PLC
5.75
[.226]
MIN
6.35
[.250]
MIN C/L DATUM R
-M-
J
J
-P-
0.76
[.030]
TYP
ACROSS PAD
S
1.57+0.20
[.062+.008]
5NO BURRS AND/OR SHARP EDGES ARE PERMISSABLE
5
0.25[.010] PR M
30
_
TYP
3.68+0.13
-0.00
[ .145+.005]
-.000
2 PLC
1.27+0.05 [.050+.002] TYP
0.25[.010] PRM
18
2.54 [.100 ] = 45.72 [1.800]
3.7. Daughter Card Configuration
The mating daughter card configuration must be in accordance with the dimensions and tolerances provided on
the customer drawing for the specific connector.
Typical
recommended daughter card configurations are shown
in Figure 4.
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Figure 4 (Cont’d)
Typical Recommended Daughter Card Configuration
SEC II and High Current Card Edge Connectors
With Latches
SEC II and High Current Card Edge Connectors
With Mounting Ears or Without Latches or Mounting Ears
Keep Out Zone Applies to Both Sides of the Daughter Card (Front and Back)
0.113-kg [4-oz] Copper Required
SEC II, SEC II Power, and High Current Card Edge Connectors 114-13018
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Figure 4 (End)
SEC II Power Connector
With Surface-Mount Contacts
-C-
0.25[.010] CA B
4 PLC
1.27
[.050]
-A-
3.81
[.150] 50.47
[1.987]
5.08
[.200]
MIN
8.18
[.322]
MIN
-B-
C/L DATUM A
-F-
PAD 26
PAD 14
C/L PCB
ACROSS PADS
5
6.35+0.05
[.250+.002] TYP
1.65+0.05
[.065+.002] TYP
0.25[.010] CA B
1.07+0.05
[.042+.002]
0.60 [.024]
45
_
20
_
TYP
0.38+0.13
[.015+.005]
0.25[.010] FB
0.25[.010] CAB
5NO BURRS AND/OR SHARP EDGES ARE PERMISSABLE
1.57+0.20
[.062+.008]
2
7.62 [.300 ] = 14.64 [.600] 9
2.54 [.100 ] = 22.86 [.900]
3.8. Soldering
A. Connector with Through-Hole Contacts Ċ Tin-Lead Plated
Observe guidelines and procedures when soldering contacts. All solder joints should conform to those
specified in Workmanship Specification 101–21 and all other requirements specified in this document.
Solder, clean, and dry all wire leads to contacts according to the following:
1. Flux Selection
Contact solder tines must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of
the flux will depend on the type of pc board and other components mounted on the board. Additionally,
the flux must be compatible with the wave solder line, manufacturing, health, and safety requirements.
Call PRODUCT INFORMATION at the number at the bottom of page 1 for consideration of other types
of flux. Flux that is compatible with these connectors are provided in Figure 5.
COMMERCIAL DESIGNATION
KESTER ALPHA
RMA Mild Noncorrosive 186 611
Figure 5
2. Process
The connectors can be soldered using wave soldering or equivalent soldering techniques. It is
recommended using SN60, SN62, or tin solder for these connectors. The temperatures and exposure
time shall be as specified in Figure 6.
SOLDERING PROCESS TEMPERATURE
(Max) TIME
(At Max Temperature)
Wave 265
_
C [509
_
F] 5 Seconds
Figure 6
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3. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the
solder and flux for recommended cleaning solvents. Cleaners must be free of dissolved flux and other
contaminants. It is recommended that cleaning takes place with the pc board on its edge. The following
is a list of common cleaning solvents that will not the affect connectors for the time and temperature
specified. See Figure 7.
Even when using no clean" solder paste, it is imperative that the contact interface be kept clean of flux and residue,
since it acts as an insulator. Flux may migrate under certain conditions with elevated temperatures and, therefore,
cleaning is necessary.
CLEANER TIME TEMPERATURE
NAME TYPE
TIME
(Minutes)
TEMPERATURE
(Maximum)
ALPHA 2110 Aqueous 1 132
_
C [270
_
F]
BIOACT EC-7 Solvent 5 100
_
C [212
_
F]
Butyl CARBITOL Solvent 1 Ambient Room
Isopropyl Alcohol Solvent 5 100
_
C [212
_
F]
KESTER 5778 Aqueous 5 100
_
C [212
_
F]
KESTER 5779 Aqueous 5 100
_
C [212
_
F]
LONCOTERGE 520 Aqueous 5 100
_
C [212
_
F]
LONCOTERGE 530 Aqueous 5 100
_
C [212
_
F]
Terpene Solvent Solvent 5 100
_
C [212
_
F]
Figure 7
If a particular solvent is not listed, contact PRODUCT INFORMATION at the number at the bottom of page 1 for
recommendation.
Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.
Refer to the manufacturer's Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners. It is
recommended to not use Trichloroethylene and Methylene Chloride because of harmful occupational and
environmental effects. Both are carcinogenic (cancer-causing).
4. Drying
When drying cleaned assemblies and pc boards, make certain that temperature limitations are not
exceeded: –55
_
to 105
_
C [–67
_
to 221
_
F]. Excessive temperatures may cause housing degradation.
B. Connector with Through-Hole Contacts Ċ Tin Plated
Refer to 402–58–1.
C. Connector with Surface-Mount Contacts Ċ Tin-Lead Plated
1. Solder Paste Characteristics
a. Alloy type shall be 63 Sn/37 Pb, 60 Sn/40 Pb, or 62 Sn/36 Pb/2 Ag.
b. Flux incorporated in the paste shall be rosin, mildly active (RMA) type.
c. Paste will be at least 80% solids by volume.
d. Mesh designation –200 to +325 (74 to 44 square micron openings, respectively).
e. Minimum viscosity of screen print shall be 5×10% cp (centipoise).
f. Minimum viscosity of stencil print shall be 7.5×10% cp (centipoise).
CAUTION
!
NOTE
i
DANGER
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2. Solder Volume
Minimum solder volume (V) (before curing) for each circuit pad is calculated by multiplying the pad
length (L) by the pad width (W) by the stencil thickness (T):
0.00(L)×0.00(W)×0.00(T) = 0.15 mm3 (V)
Solder volume for each connector must be 0.11 mm3 per contact solder tine.
Solder volume may vary depending on solder paste composition.
3. Solder Paste Thickness
Solder paste thickness for the solder tines shall be 0.20.
4. Screen (or Stencil)
Recommended screen (or stencil) thickness is 0.76 with 0.51 diameter openings.
All traces must be covered by solder mask in the solder deposit area. Exposed traces could cause bridging and create
a short, or wick solder away from the solder tines, producing a weak solder joint.
D. Connector with Surface-Mount Contacts Ċ Tin Plated
Refer to 402–58–2.
3.9. Connector Spacing
Care must be used to avoid interference between adjacent connectors and other components. The minimum
allowable distance between connectors to ensure proper mating is provided in Figure 8.
This requirement is for manual placement of connectors. If robotic equipment is used, other space allowances will be
required for the grippers.
Figure 8
40.64 [1.6] (Min)
Connectors With or Without Latches
Connectors With or Without Mounting Ears
5.08 [2.0] (Min)
Allowable Distance
(End Contact Centerline to End Contact Centerline)
40.64 [1.6] (Min) 5.08 [2.0] (Min)
NOTE
i
CAUTION
!
NOTE
i
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3.10. Connector Placement
Connectors should be handled only by the housing to avoid deformation, contamination, or damage to the contacts.
A. Connector with Press-Fit Contacts
When placing connectors on the pc board, contacts must be aligned and started into the matching holes
before seating the connector onto the board. The force required to seat the connector onto the board can
be calculated by:
Number of connector positions
maximum seating force per contact N [lb] =
connector seating force N [lb]
The maximum amount of seating force per contact is given in Figure 9.
CONNECTOR TYPE MAXIMUM SEATING FORCE
PER CONTACT (N [lb])
Press-Fit (Low Force) 35.6 [8]
Press-Fit (High Force) 53.4 [12]
Figure 9
A specific seating tool is required to seat connectors with the high force press-fit contacts. Refer to Paragraph 5.6.
B. Connector with Surface-Mount Contacts
Optimally, the contact solder tines should be centered on the pads; however, slight misalignment is
permissible as long as the entire solder tine is on the pad. Refer to Figure 10.
PC Board
Contact Solder Tine Centered on
Circuit Pad Preferred
Contact Solder Tine Overhang
Up to 25% is Permissible
Figure 10
3.11. Polarization
A connector can be polarized to the pc board if it has omitted contacts. This ensures that the connector is
placed onto the intended pc board and that the connector is properly oriented to the pc board.
The corresponding hole on the pc board must be omitted.
A connector can be polarized to the mating daughter card if the daughter card is slotted to accept the molded
key. This prevents the daughter card from being incorrectly inserted into the connector.
CAUTION
!
NOTE
i
NOTE
i
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3.12. Keying
A connector can be keyed to prevent the daughter card from being incorrectly inserted into the connector if the
connector contains inter–contact keying slots. A key plug is available to insert into any of the inter–contact
keying slots. The daughter card must be slotted to accept the key plug. The key plug must be inserted into the
inter–contact keying slot with the flat end facing up, then fully seated. Keying can be done before or after the
connector is installed onto the pc board. See Figure 11.
Figure 11
Key Plug
Inter-Contact
Keying Slot (Ref)
Note:
SEC II Card Edge vertical connector shown
Installing Key Plug
NOTE
i
Key Plug 650025-2 is
available for these
connectors.
3.13. Checking Installed Connector
A. Connector with Press-Fit Contacts
The widest section of each press–fit contact must be inside its intended pc board hole. The connector
standoffs must be seated on the pc board not exceeding the dimension shown in Figure 12.
B. Connector with Through-Hole Contacts
All solder joints should conform to those specified in Workmanship Specification 101–21 and all other
requirements specified in this document. Each contact solder tine must be fully inserted into the pc board
hole, and the solder fillet must be 360
_
around the solder tine with no skips or voids. The connector
standoffs must be seated on the pc board not exceeding the dimension shown in Figure 12.
Figure 12
0.25 [.010] (Max)
Housing Standoffs
to PC Board
Widest Section of Each
Press-Fit Contact Must
Be Inside PC Board Hole
0.25 [.010] (Max)
Housing Standoffs
to PC Board
Solder Fillet Must Be 360
_
Around Each Contact Solder
Tine and Formed Post With
No Skips or Voids
Connector With Press-Fit Contacts Connector with Through-Hole Contacts
C. Connector with Surface-Mount Contacts
It is imperative that the contact solder tines are sufficiently pressed into the solder paste. The mounting
hardware must be secure.
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3.14. Daughter Card Mating and Unmating
When mating or unmating the daughter card, care should be taken to prevent longitudinal rocking of the daughter card
with respect to the connector. Angles greater than 3
_
could cause damage to the housing or misregistration of the
contacts and daughter card circuit pads.
A. Connector with Press-Fit Contacts
The daughter card must be mated to the connector according to the following requirements:
1. The connector locking latches must be in the open position (each latch is designed to rotate only 25
_
from the end of the connector). Refer to Figure 13, Detail A.
2. If the connector contains inter–contact keying slots or molded key, the keying slot of the daughter
card must be aligned with the molded key or key plug(s) (if used) of the connector.
3. The daughter card must be inserted straight into the connector card slot until the card is seated. The
connector locking latches must be against the daughter card, but not fully engaging the notches of the
card. Refer to Figure 13, Detail B.
4. The card must be further inserted to allow the latches to move to the closed position. The latches
must fully engage the notches in the daughter card. Refer to Figure 14, Detail C.
The daughter card must be removed from the connector according to the following requirements:
1. The connector locking latches must be simultaneously rotated away from the daughter card to the
open position (each latch is designed to rotate only 25
_
from the connector). The latches must not be
forced beyond the open position.
The locking latches are designed for retention purpose only. The latches MUST NOT be used to fully eject the
daughter card from the connector; otherwise, damage to the latches or connector will occur.
2. The daughter card must be carefully pulled straight out of the connector card slot.
B. Connector with Through-Hole Contacts
The daughter card must be mated to the connector according to the following requirements:
1. If the connector contains inter–contact keying slots or molded key, the keying slot of the daughter
card must be aligned with the molded key or key plug(s) (if used) of the connector. Refer to Figure 14,
Detail A.
2. The daughter card must be inserted straight into the connector card slot until the card is seated.
If using the retaining clip, the clip must be installed according to the following requirements:
1. One fastener of the retaining clip must fully engage one mounting ear of the connector with the top
corner of the card through the slit in the clip. The clip must be fitted around the edge of the daughter
card. Refer to Figure 14, Detail B.
2. The remaining fastener of the clip must fully engage the remaining mounting ear of the connector.
The sides of the fasteners must be flat against the sides of the mounting ears. Refer to Figure 14,
Detail B.
If the optional retaining clip was used, the clip must be removed according to the following requirements:
1. Slight pressure must be applied to the top of one side of the retaining clip. The fastener must be
released from the connector mounting ear, and while maintaining pressure, the fastener must be pulled
away from the mounting ear.
2. The remaining fastener of the clip must be released from the remaining mounting ear of the
connector.
To remove the daughter card from the connector, the daughter card must be pulled straight out of the
connector card slot.
CAUTION
!
CAUTION
!
SEC II, SEC II Power, and High Current Card Edge Connectors 114-13018
Rev
B14
of20 Tyco Electronics Corporation
Figure 13
Mating Daughter Card with Connector with Press-Fit Contacts
Connector Latches
Fully Engage Notches
in Daughter Card
(Closed Position)
Detail A
Detail B
Detail C
Daughter Card
Seated in Connector
Card Slot
Connector Latches Against
Daughter Card, But Not Fully
Engaging the Notches
Connector Latches in
Open Position
If Connector Contains Inter-Contact
Keying Slots or Molded Key
Daughter Card Keying Slot(s) Aligned with
Connector Molded Key or Key Plug(s)
Daughter Card
Fully Seated in
Connector Card Slot
SEC II, SEC II Power, and High Current Card Edge Connectors 114-13018
15
of 20Rev
B
Tyco Electronics Corporation
If Connector Contains Inter-Contact
Keying Slots or Molded Key
Daughter Card Keying Slot(s) Aligned with
Connector Molded Key or Key Plug(s)
Figure 14
Mating Daughter Card with Connector with Through-Hole Contacts
Detail A
Detail B
Detail C
Remaining Fastener of Optional Retaining Clip
Fully Engages Remaining Mounting Ear of
Connector
One Fastener of Optional Retaining
Clip Fully Engages One Mounting
Ear of Connector
Top Corner of Daughter
Card Through Slit in
Optional Retaining Clip
Top Corner of Daughter
Card Through Slit in
Optional Retaining Clip
Optional Retaining Clip
Fitted Around Edge of
Daughter Card
Sides of Fasteners (of
Optional Retaining Clip)
Flat Against Connector
Mounting Ears
Daughter Card
Fully Seated in
Connector Card Slot
SEC II, SEC II Power, and High Current Card Edge Connectors 114-13018
Rev
B16
of 20 Tyco Electronics Corporation
C. Connector with Surface-Mount Contacts
The daughter card must be mated to the straddle–mount connector according to the following
requirements:
1. If the connector contains inter–contact keying slots or molded key, the keying slot of the daughter
card must be aligned with the molded key or key plug(s) (if used) of the connector. Refer to Figure 15,
Detail A.
2. The daughter card must be inserted straight into the connector card slot until the card is seated. Refer
to Figure 15, Detail B.
To remove the daughter card from the straddle–mount connector, the daughter card must be pulled
straight out of the connector card slot.
Figure 15
Mating Daughter Card with Connector with Surface-Mount Contacts
Detail A
Detail B
Daughter Card
Fully Seated in
Connector Card Slot
If Connector Contains Inter-Contact
Keying Slots or Molded Key
Daughter Card Keying Slot(s) Aligned with
Connector Molded Key or Key Plug(s)
SEC II, SEC II Power, and High Current Card Edge Connectors 114-13018
17
of20Rev
B
Tyco Electronics Corporation
3.15. Connector Removal
A. Connector with Press-Fit Contacts
These connectors must be removed from the pc board using a push bar (or flat rock) covering all pins
protruding through the board. A housing support and pc board support must also be used during removal.
The force required to remove the connector from the pc board can be calculated by:
Number of connector positions
minimum extraction force per contact N [lb] =
connector extraction force N [lb]
The minimum amount of extraction force per contact is given in Figure 16.
CONNECTOR TYPE MINIMUM EXTRACTION FORCE
PER CONTACT (N [lb])
Press-Fit (Low Force) 8.9 [2]
Press-Fit (High Force) 17.8 [4]
Figure 16
B. Connector with Through-Hole or Surface-Mount Contacts
These connectors must be removed from the pc board using standard de–soldering methods, then
removed from the pc board using a push bar (or flat rock) covering all contacts protruding through the
board. A housing support and pc board support must also be used during removal.
3.16. Repair
These connectors are not repairable. Damaged connectors must be removed, discarded, and replaced with
new ones. DO NOT re–use connectors after being removed from the pc board.
4. QUALIFICATION
These connectors are Recognized under the Component Program of Underwriters Laboratories Inc. (UL) under
File E 28476 and Certified by CSA International under File LR 7189.
5. TOOLING
No tooling is required for manual placement of the connectors onto the pc board. Manually–operated tools, and
automatic and semi–automatic machines for power assisted application of the connectors are available. The
application tooling must provide sufficient amount of downward force to insert the contacts into the pc board
holes. Tooling part numbers and instructional material packaged with the tooling are shown in Figure 17.
5.1. Manual Tools
For low–volume production, commercial hand–operated arbor presses are available. For seating connectors
with press–fit contacts, the Greenerd manual frame assembly must be fitted with an adapter kit. The adapter
kit includes a board support plate.
5.2. Power Units
Power units are designed for high–volume production. SM–3 machine is a pneumatic bench–mounted power
unit controlled manually with pc board sensing or pressure sensing operation.
5.3. Robotic Equipment
Robotic equipment must have a true position accuracy tolerance of 0.25 [.010] to feed, pick up, and place the
connectors on the pc board. This includes gripper and fixture tolerances as well as equipment repeatability.
5.4. Housing Support
A housing support with sides and ends as close as possible to the connector housing is recommended when
removing connectors with press–fit contacts from the pc board. The support protects the housing from
damage.
SEC II, SEC II Power, and High Current Card Edge Connectors 114-13018
Rev
B18
of 20 Tyco Electronics Corporation
5.5. PC Board Support
(Customer Supplied)
When using application tooling, a pc board support must be used to provide proper support for the pc board
and to protect the pc board and connector from damage. It is also recommended using the pc board support
when removing connectors with press–fit contacts from the board. The board support fixture must be designed
for specific needs using the following recommendations:
— it should be at least 25.4 [1.0] wider than the pc board
— it should have a flat surface with a cutout or holes to allow adequate clearance for the contacts
5.6. Seating Tool
This seating tool is required to seat connectors with
high force
press–fit contacts onto the pc board. Each
seating tool is specifically designed for the number of contact positions and molded key position in the
connector. Power for the seating tool must be provided by application tooling (with a ram) capable of supplying
a downward force of 67 Newtons (N) [15 lb] per contact.
5.7. Push Bar (Flat Rock)
Commercially available bar stock with a flat surface large enough to cover all contacts can be used to seat
connectors with
low force
press–fit contacts. The push bar must be used with application tooling. The push bar
is also used to remove a connector with high force or low force press–fit contacts from the pc board.
Figure 17
PC Board Support
(Customer Supplied)
Robotic Equipment
(Designed Upon Request)
Greenerd 3A or 3B Manual
Frame Assembly (Commercially
Available) Used with Adapter Kit
(Refer to 408-9027)
SM-3 Machine 814700-2
(409-5626)
Manual Arbor Frame
Assembly 58024-1
(408-6923)
Housing Support
(Customer Supplied) Push Bar (Flat Rock)
(Customer Supplied)
Seating Tool Assembly
1424555-[ ] (408-8666)
SEC II, SEC II Power, and High Current Card Edge Connectors 114-13018
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of 20Rev
B
Tyco Electronics Corporation
6. VISUAL AID
The illustration below shows a typical application of SEC II, SEC II Power, and High Current Card Edge
connectors. This illustration should be used by production personnel to ensure a correctly applied product.
Applications which DO NOT appear correct should be inspected using the information in the preceding pages
of this specification and in the instructional material shipped with the product or tooling.
FIGURE 18. VISUAL AID (CONT’D)
CONNECTOR WITH
PRESS-FIT CONTACTS
CONNECTOR LATCHES
MUST FULLY ENGAGE
NOTCHES IN DAUGHTER
CARD (CLOSED POSITION)
DAUGHTER CARD MUST
BE FULLY SEATED IN
CONNECTOR CARD SLOT
CONNECTOR STANDOFFS
MUST BE SEATED ON
PC BOARD
WIDEST SECTION OF
EACH PRESS-FIT CONTACT
MUST BE INSIDE PC
BOARD HOLE
CONNECTOR WITH
THROUGH-HOLE CONTACTS
SOLDER FILLET MUST BE
360
_
AROUND EACH
CONTACT SOLDER TINE
AND FORMED POST WITH
NO SKIPS OR VOIDS
CONNECTOR STANDOFFS
MUST BE SEATED ON
PC BOARD
DAUGHTER CARD MUST
BE FULLY SEATED IN
CONNECTOR CARD SLOT
IF RETAINING CLIP IS USED,
FASTENERS MUST FULLY
ENGAGE CONNECTOR
MOUNTING EARS
IF RETAINING CLIP IS USED,
TOP CORNERS OF DAUGHTER
CARD MUST BE THROUGH
SLITS OF RETAINING CLIP
MOLDED KEY (Ref)
SEC II, SEC II Power, and High Current Card Edge Connectors 114-13018
Rev
B20
of 20 Tyco Electronics Corporation
FIGURE 18. VISUAL AID (END)
CONNECTOR WITH
SURFACE-MOUNT CONTACTS
DAUGHTER CARD MUST
BE FULLY SEATED IN
CONNECTOR CARD SLOT
MOUNTING HARDWARE
MUST BE SECURE
CONTACT SOLDER TINES MUST
BE SUFFICIENTLY PRESSED INTO
SOLDER PASTE
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Ï
Ï
Ï
ÏÏ
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Ï
Ï
Ï
Ï
MOLDED KEY (Ref)