Schottky Barrier Chip Diode Series - 0805
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
6
Features
■Lead free as standard
■RoHS compliant*
■Leadless
■Low stored charge
Applications
■Cellular phones
■PDAs
■Desktop PCs and
notebooks
■Digital cameras
■MP3 players
General Information
The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly
smaller electronic components.
Bourns offers small-signal high-speed Schottky Barrier Diodes for switching and rectification applications, in compact chip package 0805 size
format, which offer PCB real estate savings and are considerably smaller than competitive parts. The Schottky Barrier Diodes offer a forward
current of 30 mA, 100 mA or 200 mA, a reverse voltage of 30 V, 40 V or 45V and also have a low forward voltage option. The diodes are lead-
free with Cu/Ni/Au plated terminations and are compatible with lead-free manufacturing processes, conforming to many industry and
government regulations on lead-free components.
Bourns®Chip Diodes conform to JEDEC standards, easy to handle on standard pick and place equipment and their flat configuration makes
roll away much more difficult.
Parameter Symbol CD0805- CD0805- CD0805- CD0805- CD0805- CD0805- Unit
B00340 B0130 B0130L B0145 B0230 B0245
Forward Voltage (Max.) VF0.37 1.00 0.44 0.55 0.50 0.55 V
(If= 1 mA) (If= 0.1 A) (If= 0.1 A) (If= 0.1 A) (If= 0.2 A) (If= 0.2 A)
Capacitance Between 261261212
Terminals (Max.) CT(Vr= 1 V) (Vr= 10 V) (Vr= 10 V) (Vr= 10 V) (Vr= 10 V) (Vr= 10 V) pF
(f = 1 MHz)
Reverse Current (Max.) IR1 2 30 30 30 30 µA
(Vr= 40 V) (Vr= 25 V) (Vr= 30 V) (Vr= 45 V) (Vr= 30 V) (Vr= 45 V)
Electrical Characteristics (@ TA= 25 °C Unless Otherwise Noted)
How To Order
CD 0805 - B 01 30 L
Common Code
Chip Diode
Package
• 0805
Model
B = Schottky Barrier Series
Average Forward Current (Io) Code
003 = 30 mA
01 = 100 mA
02 = 200 mA
(Code x 1000 mA = Average Forward Current)
Reverse Voltage (VR) Code
30 = 30 V
40 = 40 V
45 = 45 V
Forward Voltage Suffix
L = Low Forward Voltage Vf(CD0805-B0130L)
Parameter Symbol CD0805- CD0805- CD0805- CD0805- CD0805- CD0805- Unit
B00340 B0130 B0130L B0145 B0230 B0245
Repetitive Peak
Reverse Voltage VRRM 45 30 35 50 35 50 V
Reverse Voltage VR40 30 30 45 30 45 V
Average Forward Current Io30 100 100 100 200 200 mA
Forward Current,
Surge Peak Isurge 500* 1000* 1000* 1000* 3000* 3000* mA
Power Dissipation PD 200 300 300 300 300 250 mW
Storage Temperature TSTG -40 to +125 °C
Junction Temperature TJ-40 to +125 °C
Absolute Ratings (@ TA= 25 °C Unless Otherwise Noted)
* Condition: 8.3 ms single half sine-wave superimposed on rate load
(JEDEC method).
*RoHS COMPLIANT
CD0805-xxxx products
are currently available,
although not recom-
mended for new designs. Use
CD1005-xxxx products as an
alternative.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CD0805-B00340..............................................................................B2
CD0805-B0130................................................................................B1
CD0805-B0130L..............................................................................B3
CD0805-B0145................................................................................B4
CD0805-B0230................................................................................B5
CD0805-B0245................................................................................B6
Schottky Barrier Chip Diode Series - 0805
Product Dimensions Recommended Pad Layout
Physical Specifications
Typical Part Marking
Case..........................................................0805(2012) Molded plastic
Terminals ......................Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity ....................................................Indicated by cathode band
Mounting Position ........................................................................Any
Weight ............................................0.000159 ounces / 0.0045 grams
Dimension 0805
A2.00 - 2.20
(0.079 - 0.087)
B1.20 - 1.40
(0.047 - 0.055)
C0.40 Typ.
(0.016)
D0.20 R Typ.
(0.008)
E0.90 - 1.10
(0.035 - 0.043)
A
B
E
C
D
A
C
B
MM
(INCHES)
DIMENSIONS:
Dimension 0805
A (Max.) 2.10
(0.082)
B (Min.) 1.20
(0.047)
C (Min.) 1.20
(0.047)
MM
(INCHES)
DIMENSIONS:
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Schottky Barrier Chip Diode Series - 0805
Rating and Characteristic Curves: CD0805-B00340
Derating Curve Capacitance Between Terminals
Forward Characteristics Reverse Characteristics
10
1
0.1
0.01
Forward Current (mAmps)
0.0 0.1 0.2 0.3 0.4 0.5
Forward Voltage (Volts)
125 °C
85 °C-25 °C
25 °C
10
100
Reverse Current (nA)
1000
10000
1000000
100000
010203040
Reverse Voltage (Volts)
25 °C
85 °C
125 °C
120
100
80
60
40
20
00 25 50 75 100 125 150
I0 Current (%)
Ambient Temperature (°C)
Mounting on glass epoxy PCBs
16
8
10
12
14
6
4
2
00 5 10 15 20 25 30
Capacitance Between Terminals (pF)
Reverse Voltage (Volts)
F = 1 MHz
Ta = 25 °C
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Schottky Barrier Chip Diode Series - 0805
Rating and Characteristic Curves: CD0805-B0130
Derating Curve Capacitance Between Terminals
Forward Characteristics Reverse Characteristics
1000
100
1
Forward Current (mAmps)
0.0 0.1 0.2 0.3 0.4 0.5 0.6
Forward Voltage (Volts)
10
125 °C85 °C-25 °C
25 °C
10
100
Reverse Current (nA)
1000000
1000
10000
100000
0 5 10 15 20 25 30
Reverse Voltage (Volts)
25 °C
85 °C
125 °C
120
100
80
60
40
20
00 25 50 75 100 125 150
I0 Current (%)
Ambient Temperature (°C)
Mounting on glass epoxy PCBs
16
8
10
12
14
6
4
2
00 5 10 15 20 25 30
Capacitance Between Terminals (pF)
Reverse Voltage (Volts)
F = 1 MHz
Ta = 25 °C
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Schottky Barrier Chip Diode Series - 0805
Rating and Characteristic Curves: CD0805-B0130L
Derating Curve Capacitance Between Terminals
Forward Characteristics Reverse Characteristics
1000
1
Forward Current (mAmps)
0.00 0.11 0.22 0.33 0.4
Forward Voltage (Volts)
10
100
125 °C85 °C-25 °C
25 °C10
100
Reverse Current (nA)
10000000
1000000
1000
10000
100000
0 5 10 15 20 25 30 35
Reverse Voltage (Volts)
25 °C
85 °C
125 °C
120
100
80
60
40
20
00 25 50 75 100 125 150
I0 Current (%)
Ambient Temperature (°C)
Mounting on glass epoxy PCBs
20.0
8.0
10.0
12.0
14.0
16.0
18.0
6.0
4.0
2.0
0.0 010
51520253035
Capacitance Between Terminals (pF)
Reverse Voltage (Volts)
F = 1 MHz
Ta = Room Temperature
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Schottky Barrier Chip Diode Series - 0805
Rating and Characteristic Curves: CD0805-B0145
Derating Curve Capacitance Between Terminals
Forward Characteristics Reverse Characteristics
1000
1
Forward Current (mAmps)
0.0 0.2 0.3 0.50.40.1
10
100
125 °C85 °C-25 °C
25 °C
10
100
Reverse Current (nA)
1000000
1000
10000
100000
01020304050
Reverse Voltage (Volts)
25 °C
85 °C
125 °C
120
100
80
60
40
20
00 25 50 75 100 125 150
I0 Current (%)
Ambient Temperature (°C)
Mounting on glass epoxy PCBs
20
8
10
12
14
16
18
6
4
2
0010
51520253035
Capacitance Between Terminals (pF)
Reverse Voltage (Volts)
F = 1 MHz
Ta = 25 °C
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Schottky Barrier Chip Diode Series - 0805
Rating and Characteristic Curves: CD0805-B0230
Derating Curve Capacitance Between Terminals
Forward Characteristics Reverse Characteristics
1000
1
Forward Current (mAmps)
0.0 0.2 0.3 0.50.4
Forward Voltage (Volts)
0.1
10
100
125 °C85 °C-25 °C
25 °C
10
100
Reverse Current (nA)
1000
10000
100000
1000000
10000000
0 5 10 15 20 25 30 35
Reverse Voltage (Volts)
25 °C
85 °C
125 °C
120
100
80
60
40
20
00 25 50 75 100 125 150
I0 Current (%)
Ambient Temperature (°C)
Mounting on glass epoxy PCBs
100.0
40.0
50.0
60.0
70.0
80.0
90.0
30.0
20.0
10.0
0.0 010
51520253035
Capacitance Between Terminals (pF)
Reverse Voltage (Volts)
F = 1 MHz
Ta = 25 °C
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Schottky Barrier Chip Diode Series - 0805
Rating and Characteristic Curves: CD0805-B0245
Derating Curve Capacitance Between Terminals
Forward Characteristics Reverse Characteristics
1000
1
Forward Current (mAmps)
0.0 0.2 0.3 0.50.4
Forward Voltage (Volts)
0.1
10
100
125 °C85 °C-25 °C
25 °C10
100
Reverse Current (nA)
1000
10000
100000
1000000
10000000
010 20 30 40 50
Reverse Voltage (Volts)
25 °C
85 °C
125 °C
120
100
80
60
40
20
00 25 50 75 100 125 150
I0 Current (%)
Ambient Temperature (°C)
Mounting on glass epoxy PCBs
100
40
50
60
70
80
90
30
20
10
0010
51520253035
Capacitance Between Terminals (pF)
Reverse Voltage (Volts)
F = 1 MHz
Ta = 25 °C
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Schottky Barrier Chip Diode Series - 0805
Packaging Information
The product will be dispensed in Tape and Reel format (see diagram below).
COPYRIGHT© 2003, BOURNS, INC. LITHO IN U.S.A. 10/03 e/IPA0303
.......
.......
....... ..............
....... ..............
P A
F
ET
120 °
D2
DD
1
W1
C
Index Hole
P
0
P
1
W
B
10 pitches (min.)
Direction of Feed
10 pitches (min.)
End
Trailer Device Leader
Start
d
Devices are packed in accordance with EIA standard
RS-481-A and specifications shown here.
MM
(INCHES)
DIMENSIONS:
Item Symbol 0805
Carrier Width A 1.55 ± 0.10
(0.061 - 0.004)
Carrier Length B 2.30 ± 0.10
(0.091 - 0.004)
Carrier Depth C 1.25 ± 0.10
(0.049 - 0.004)
Sprocket Hole d 1.55 ± 0.05
(0.061 - 0.002)
Reel Outside Diameter D 178
(7.008)
Reel Inner Diameter D160.0 MIN.
(2.362)
Feed Hole Diameter D213.0 ± 0.20
(0.512 - 0.008)
Sprocket Hole Position E 1.75 ± 0.10
(0.069 - 0.004))
Punch Hole Position F 3.50 ± 0.05
(0.138 - 0.002)
Punch Hole Pitch P 4.00 ± 0.10
(0.157 - 0.004)
Sprocket Hole Pitch P04.00 ± 0.10
(0.157 - 0.004)
Embossment Center P12.00 ± 0.05
(0.079 - 0.002)
Overall Tape Thickness T 0.25 ± 0.05
(0.010 - 0.002)
Tape Width W 8.00 ± 0.20
(0.315 - 0.008)
Reel Width W113.5 MAX.
(0.531)
Quantity per Reel -- 3,000
REV. 01/06
