CM1401-03 4-Channel ESD/EMI Filter Array plus 4-Channel ESD Array for USB Features Product Description * The CM1401-03 is a multichannel array with four lowpass filter + ESD channels and four ESD-only channels. They reduce EMI/RFI emissions on a data port and protect against ESD on a USB port. Each EMI/RFI channel integrates a high quality pi-style filter (C-R-C) which provides greater than 30dB attenuation in the 800-2700 MHz range relative to the pass band attenuation. These pi-style filters are bidirectional, controlling EMI both to and from a data port connector. * * * * * * * * * * Functionally and pin compatible with CSPEMI307A device OptiguardTM coated for improved reliability at assembly Four channels of combined EMI/RFI filtering + ESD protection Four additional channels of ESD-only protection 40dB absolute attenuation (typical) at 1 GHz 35dB attenuation (typical) at 1 GHz relative to pass band +15kV ESD protection on all channels (IEC 61000-4-2 Level 4, contact discharge) +30kV ESD protection on all channels (HBM) 15-bump, 2.960mm X 1.330mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance Lead-free version available Applications * * * * * * * EMI filtering and ESD protection for both data and I/O ports Outer 4 channels provide ESD protection for USB lines and other I/O port applications Wireless Handsets Handheld PCs / PDAs MP3 Players Notebooks Desktop PCs The CM1401-03 provides a high-level of ESD protection on all eight channels for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of 15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 30kV. The CM1401-03 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package footprint and low weight. The CM1401-03 incorporates OptiguardTM coating which results in improved reliability at assembly and is available in a space-saving, low-profile chip scale package with optional lead-free finishing. Electrical Schematic 100 FILTER+ESDn* FILTER+ESDn* 30pF ESDn* 30pF 30pF GND (Pins B1-B3) 1 of 4 EMI/RFI + ESD Channels. 1 of 4 ESD-only Channels * See Package/Pinout Diagram for expanded pin information (c) 2004 California Micro Devices Corp. All rights reserved. 02/13/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 1 CM1401-03 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW TOP VIEW (Bumps Up View) (Bumps Down View) Orientation Marking (see note 2) 1 2 3 4 5 6 FILTER/ESD_2 ESD_3 A C1 C2 C3 N013 GND Orientation Marking C B1 A1 A1 B2 GND ESD_1 C6 A3 B3 FILTER/ESD_4 A4 FILTER/ESD_3 FILTER/ESD_1 ESD_4 GND FILTER/ESD_2 A2 C5 FILTER/ESD_3 FILTER/ESD_1 B FILTER/ESD_4 C4 A5 A6 ESD_2 CM1401-03 Notes: CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN(s) NAME DESCRIPTION A1 ESD_1 ESD Channel 1 A2 FILTER+ESD_1 Filter + ESD Channel 1 A3 FILTER+ESD_2 Filter + ESD Channel 2 A4 FILTER+ESD_3 Filter + ESD Channel 3 A5 FILTER+ESD_4 Filter + ESD Channel 4 A6 ESD_2 ESD Channel 2 B1-B3 GND Device Ground C1 ESD_3 ESD Channel 3 C2 FILTER+ESD_1 Filter + ESD Channel 1 C3 FILTER+ESD_2 Filter + ESD Channel 2 C4 FILTER+ESD_3 Filter + ESD Channel 3 C5 FILTER+ESD_4 C6 ESD_4 Filter + ESD Channel 4 ESD Channel 4 Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Ordering Part Ordering Part Pins Package Number1 Part Marking Number1 Part Marking 15 CSP CM1401-03CS N013 CM1401-03CP N013 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. (c) 2004 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 02/13/04 CM1401-03 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 C DC Power per Resistor 100 mW DC Package Power Rating 600 mW RATING UNITS -40 to +85 C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL PARAMETER R Resistance C Capacitance TCR CONDITIONS At 2.5V DC TCC Temperature Coefficient of Capacitance At 2.5V DC Diode Voltage (reverse bias) IDIODE=10A ILEAK Diode Leakage Current (reverse bias) VDIODE=3.3V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2,4 and 5 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and 5 Cut-off Frequency ZSOURCE=50, ZLOAD=50 R=100 , C=30pF VESD fC TYP MAX UNITS 80 100 120 24 30 36 pF Temperature Coefficient of Resistance VDIODE VCL MIN 1200 ppm/C -300 ppm/C 5.5 5.6 -0.4 V 6.8 -0.8 100 nA 9.0 -1.5 V V 30 kV 15 kV +10 -5 V V 58 MHz Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A2, then clamping voltage is measured at Pin C2. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization. (c) 2004 California Micro Devices Corp. All rights reserved. 02/13/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 3 CM1401-03 Performance Information Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A2-C2 to GND B2) Figure 2. Insertion Loss vs. Frequency (A3-C3 to GND B2) (c) 2004 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 02/13/04 CM1401-03 Performance Information Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (A4-C4 to GND B2) Figure 4. Insertion Loss vs. Frequency (A5-C5 to GND B2) (c) 2004 California Micro Devices Corp. All rights reserved. 02/13/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 5 CM1401-03 Performance Information Typical Filter Performance (TA=25C, 50 Ohm Environment) Figure 5. Comparison of Filter Response Curves for CM1401-03CS with DC Bias (c) 2004 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 02/13/04 CM1401-03 Performance Information (cont'd) 1.6 1.5 Normalized Capacitance 1.4 1.3 1.2 T = -40C T = +25C 1.1 T = +70C 1.0 0.9 0.8 0.7 0 1 2 3 4 5 DC Input Voltage (V) Figure 6. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25C) 1.100 1.080 Nornalized Resistance 1.060 1.040 1.020 1.000 0.980 0.960 0.940 0.920 0.900 -40 -20 0 20 40 60 80 100 Temperature ['C] Figure 7. Resistance vs. Temperature (normalized to resistance at 25C) (c) 2004 California Micro Devices Corp. All rights reserved. 02/13/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 7 CM1401-03 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance -- Edge To Corner Ball +50m Solder Ball Side Coplanarity +20m Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration Temperature (C) 250 200 150 100 50 0 Figure 9. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 10. Lead-free (SnAgCu) Solder Ball Reflow Profile (c) 2004 California Micro Devices Corp. All rights reserved. 8 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 02/13/04 CM1401-03 Mechanical Details CSP Mechanical Specifications Mechanical Package Diagrams CM1401-03 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. BOTTOM VIEW C1 15 Dim Millimeters B A 1 Inches Min Nom Max A1 2.915 2.960 3.005 0.1148 0.1165 0.1183 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.600 0.670 0.739 0.0236 0.0264 0.0291 D2 0.394 0.445 0.495 # per tape and reel Min A2 Bumps C C2 Custom CSP B2 B1 B4 B3 PACKAGE DIMENSIONS Package OptiGuardTM Coating A1 Nom 2 3 4 5 6 D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS Max SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1401-03 Chip Scale Package 0.0155 0.0175 0.0195 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1401-03 2.96 X 1.33 X 0.67 3.10 X 1.45 X 0.74 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape 0.2 mm Po Top Cover Tape Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment P1 Center Lines of Cavity User Direction of Feed Figure 11. Tape and Reel Mechanical Data (c) 2004 California Micro Devices Corp. All rights reserved. 02/13/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 9