PS2705-1-F3-A - NEC - Product.Network

R08DS0093EJ0300 Rev.3.00 Page 1 of 13

Jan 29, 2013

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Data Sheet

PS2705-1

HIGH ISOLATION VOLTAGE AC INPUT RESPONSE

TYPE SOP MULTI PHOTOCOUPLER

DESCRIPTION

The PS2705-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon

phototransistor.

This package is SOP (Small Outline Package) type and has shield effect to cut off ambient light.

It is designed for high density mounting applications.

FEATURES

• AC input response

• High isolation voltage (BV = 3 750 Vr.m.s.)

• High current transfer ratio (CTR = 100% TYP.)

• SOP (Small Outline Package) type

• High-speed switching (tr = 3

s TYP., tf = 5

s TYP.)

• Ordering number of taping product : PS2705-1-F3

• Safety standards

• UL approved: No. E72422

• BSI approved (BS EN 60065, BS EN 60950)

• CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)

• SEMKO, NEMKO, DEMKO, FIMKO approved (EN 60065, EN 60950)

• DIN EN 60747-5-5 (VDE 0884-5) approved (Option)

APPLICATIONS

• Hybrid IC

• Telephone/FAX

• FA/OA equipment

• Programmable logic controllers

• Power supply

R08DS0093EJ0300

Rev.3.00

Jan 29, 2013

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1. Anode, Cathode

2. Cathode, Anode

3. Emitter

4. Collector

PIN CONNECTION

(Top View)

PS2705-1

R08DS0093EJ0300 Rev.3.00 Page 2 of 13

Jan 29, 2013

PACKAGE DIMENSIONS (UNIT: mm)

PS2705-1

4.0±0.5

7.0±0.3

4.4

0.5±0.3

0.15+0.10

–0.05

2.0

0.1±0.1

2.1±0.2

2.54

0.4+0.10

–0.05 0.25 M

PHOTOCOUPLER CONSTRUCTION

Parameter Unit (MIN.)

Air Distance 5 mm

Outer Creepage Distance 5 mm

Inner Creepage Distance 2.5 mm

Isolation Distance 0.3 mm

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PS2705-1

R08DS0093EJ0300 Rev.3.00 Page 3 of 13

Jan 29, 2013

MARKING EXAMPLE

3 01

CTR Rank Code

Year Assembled

(Last 1 Digit)

Week Assembled

2705

N301

No. 1 pin Mark

Remark "PS" and "-1" are omitted from original type number

Company initial

Type Number

Assembly Lot

Note: Bar indication contents of *1 and *2.

Made in Taiwan

2705

N301

*1: No indication

*2: No indication

*1: No indication

*2: " | " (Vertical bar) " " (Vertical bar)

:Made in Japan

Made in Japan

2705

N301

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PS2705-1

R08DS0093EJ0300 Rev.3.00 Page 4 of 13

Jan 29, 2013

ORDERING INFORMATION

Part Number Order Number Solder Plating

Specification

Packing Style Safety Standard

Approval

Application

Part Number*1

PS2705-1-F3 PS2705-1-F3-A Embossed Tape

3 500 pcs/reel

Standard products

(UL, BSI, CSA,

SEMKO, NEMKO,

DEMKO, FIMKO

approved)

PS2705-1-V-F3 PS2705-1-V-F3-A

Pb-Free

Embossed Tape

3 500 pcs/reel

DIN EN 60747-5-5

(VDE 0884-5)

Approved (Option)

PS2705-1

Note: *1. For the application of the Safety Standard, following part number should be used.

ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)

Parameter Symbol Ratings Unit

Diode Forward Current (DC) IF ± 50 mA

Power Dissipation Derating

PD/°C 0.8 mW/°C

Power Dissipation PD 80 mW

Peak Forward Current*1 IFP ± 1 A

Transistor Collector to Emitter Voltage VCEO 40 V

Emitter to Collector Voltage VECO 6 V

Collector Current IC 80 mA

Power Dissipation Derating

PC/°C 1.5 mW/°C

Power Dissipation PC 150 mW

Isolation Voltage*2 BV 3 750 Vr.m.s.

Operating Ambient Temperature TA –55 to +100 °C

Storage Temperature Tstg –55 to +150 °C

Note: *1. PW = 100

s, Duty Cycle = 1%

*2. AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.

Pins 1-2 shorted together, 3-4 shorted together.

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PS2705-1

R08DS0093EJ0300 Rev.3.00 Page 5 of 13

Jan 29, 2013

ELECTRICAL CHARACTERISTICS (TA = 25°C)

Parameter Symbol Conditions MIN. TYP. MAX. Unit

Diode Forward Voltage VF I

F = ± 5 mA 1.1 1.4 V

Terminal

Capacitance Ct V = 0 V, f = 1 MHz 60 pF

Transistor Collector to Emitter

Dark Current ICEO I

F = 0 mA, VCE = 40 V 100 nA

Coupled Current Transfer

Ratio (IC/IF)*1 CTR IF = ± 5 mA, VCE = 5 V 50 100 300 %

CTR Ratio*2 CTR1/

CTR2 IF = ± 5 mA, VCE = 5 V 0.3 1.0 3.0

Collector Saturation

Voltage VCE (sat) I

F = ± 10 mA, IC = 2 mA 0.3 V

Isolation Resistance RI-O V

I-O = 1 kVDC 1011 Ω

Isolation

Capacitance CI-O V = 0 V, f = 1 MHz 0.4 pF

Rise Time*3 t

r V

CC = 5 V, IC = 2 mA, RL = 100 Ω 3

Fall Time*3 t

f 5

Turn-on Time*3 t

on 5

Turn-off Time*3 t

off 4

Note: *1. CTR rank

M: 50 to 150 (%)

L: 100 to 300 (%)

N: 50 to 300 (%)

*2. CTR1 = IC1/IF1, CTR2 = IC2/IF2

*3. Test Circuit for Switching Time

Input

Output

90%

10%

off

OUT

= 100 Ω

PW = 100 s

Duty Cycle = 1/10

Pulse Input

50 Ω

In monitor

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PS2705-1

R08DS0093EJ0300 Rev.3.00 Page 6 of 13

Jan 29, 2013

TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)

100

25 50 75 100

Ambient Temperature TA (˚C)

Diode Power Dissipation PD (mW)

DIODE POWER DISSIPATION vs.

AMBIENT TEMPERATURE

200

150

100

025 50 75 100

Ambient Temperature TA (˚C)

Transistor Power Dissipation PC (mW)

TRANSISTOR POWER DISSIPATION vs.

AMBIENT TEMPERATURE

1.5 mW/˚C

100

0.1

0.01

0.6 1.0 1.4 1.60.8 1.2

Forward Voltage VF (V)

Forward Current IF (mA)

FORWARD CURRENT vs.

FORWARD VOLTAGE

+25 ˚C

0 ˚C

–25 ˚C

–55 ˚C

TA = +100 ˚C

+75 ˚C

+50 ˚C

10 000

0.1

100

1 000

–60 0 40 80–40 –20 20 60 100

Ambient Temperature TA (˚C)

COLLECTOR TO EMITTER DARK

CURRENT vs. AMBIENT TEMPERATURE

Collector to Emitter Dark Current ICEO (nA)

VCE = 40 V

24 V

10 V

0.1

0.5

0.2

0.2 0.6 1.00.0 0.4 0.8

Collector Saturation Voltage VCE (sat) (V)

Collector Current IC (mA)

COLLECTOR CURRENT vs.

COLLECTOR SATURATION VOLTAGE

IF = 25 mA

10 mA

5 mA

2 mA

1 mA

FORWARD CURRENT vs.

FORWARD VOLTAGE

Forward Voltage VF (V)

Forward Current IF (mA)

–40

–60

–80

–20

–1.2 0 0.4 1.2 1.6–1.6 –0.8 –0.4 0.8

Remark The graphs indicate nominal characteristics.

PS2705-1

R08DS0093EJ0300 Rev.3.00 Page 7 of 13

Jan 29, 2013

1.2

0.6

0.0

0.8

1.0

0.4

0.2

02550 100–50 –25 75

Ambient Temperature T

(˚C)

NORMALIZED CURRENT TRANSFER

RATIO vs. AMBIENT TEMPERATURE

Normalized Current Transfer Ratio CTR

Normalized to 1.0

at T

= 25 ˚C,

= 5 mA, V

= 5 V

300

250

150

200

100

0.05 0.5 5 50

0.1 1 10

Forward Current I

(mA)

Current Transfer Ratio CTR (%)

CURRENT TRANSFER RATIO vs.

FORWARD CURRENT

= 5 V

Load Resistance R

(Ω)

SWITCHING TIME vs.

LOAD RESISTANCE

Switching Time t ( s)

= 5 V,

= 2 mA

100

0.5

0.1

50 200 1 k 2 k

100 500

Load Resistance R

(Ω)

SWITCHING TIME vs.

LOAD RESISTANCE

Switching Time t ( s)

off

1.2

0.4

0.0

0.8

0.6

0.2

1.0

20 500

5 10 2002 50 100

Frequency f (kHz)

Normalized Gain G

FREQUENCY RESPONSE

= 1 kΩ

510 Ω

300 Ω

100 Ω

= 5 mA, V

= 5 V,

CTR = 169 %

1 000

0.5

100

500

0.1

100 1 k 10 k 50 k500 5 k 100 k

61024 8

Collector to Emitter Voltage V

(V)

Collector Current I

(mA)

COLLECTOR CURRENT vs.

COLLECTOR TO EMITTER VOLTAGE

= 30 mA

20 mA

10 mA

15 mA

5 mA

Remark The graphs indicate nominal characteristics.

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PS2705-1

R08DS0093EJ0300 Rev.3.00 Page 8 of 13

Jan 29, 2013

TAPING SPECIFICATIONS (UNIT: mm)

Tape Direction

Outline and Dimensions (Reel)

Packing: 3 500 pcs/reel

2.0±0.5

R 1.0

13.0±0.2

21.0±0.8

330±2.0

100±1.0

2.0±0.5

11.9 to 15.4

Outer edge of

flange

17.5±1.0

13.5±1.0

13.0±0.2

PS2705-1-F3

1.55±0.1

2.0±0.05

4.0±0.1

1.75±0.1

4.6±0.1

2.9 MAX.

0.3

8.0±0.1

Outline and Dimensions (Tape)

2.4±0.1

1.5

+0.1

–0

7.4±0.1

5.5±0.05

12.0±0.2

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PS2705-1

R08DS0093EJ0300 Rev.3.00 Page 9 of 13

Jan 29, 2013

RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)

1.45

0.8

2.54

6.25

Remark All dimensions in this figure must be evaluated before use.

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PS2705-1

R08DS0093EJ0300 Rev.3.00 Page 10 of 13

Jan 29, 2013

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering

• Peak reflow temperature 260°C or below (package surface temperature)

• Time of peak reflow temperature 10 seconds or less

• Time of temperature higher than 220°C 60 seconds or less

• Time to preheat temperature from 120 to 180°C 120±30 s

• Number of reflows Three

• Flux Rosin flux containing small amount of chlorine (The flux

with a maximum chlorine content of 0.2 Wt% is

recommended.)

120±30 s

(preheating)

220˚C

180˚C

Package Surface Temperature T (˚C)

Time (s)

Recommended Temperature Profile of Infrared Reflow

(heating)

to 10 s

to 60 s

260˚C MAX.

120˚C

(2) Wave soldering

• Temperature 260°C or below (molten solder temperature)

• Time 10 seconds or less

• Preheating conditions 120°C or below (package surface temperature)

• Number of times One (Allowed to be dipped in solder including plastic mold portion.)

• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine

content of 0.2 Wt% is recommended.)

(3) Soldering by Soldering Iron

• Peak Temperature (lead part temperature) 350°C or below

• Time (each pins) 3 seconds or less

• Flux Rosin flux containing small amount of chlorine (The flux with a

maximum chlorine content of 0.2 Wt% is recommended.)

(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead

(4) Cautions

• Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

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PS2705-1

R08DS0093EJ0300 Rev.3.00 Page 11 of 13

Jan 29, 2013

2. Cautions regarding noise

Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between collector-

emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum

ratings.

3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler

Check the setting values before use, since the forward current conditions at CTR measurement differ according to

product.

When using products other than at the specified forward current, the characteristics curves may differ from the

standard curves due to CTR value variations or the like. This tendency may sometimes be obvious, especially below

IF = 1 mA.

Therefore, check the characteristics under the actual operating conditions and thoroughly take variations or the like

into consideration before use.

USAGE CAUTIONS

1. Protect against static electricity when handling.

2. Avoid storage at a high temperature and high humidity.

PS2705-1

R08DS0093EJ0300 Rev.3.00 Page 12 of 13

Jan 29, 2013

SPECIFICATION OF VDE MARKS LICENSE DOCUMENT

Parameter Symbol Spec. Unit

Climatic test class (IEC 60068-1/DIN EN 60068-1) 55/100/21

Dielectric strength

maximum operating isolation voltage

Test voltage (partial discharge test, procedure a for type test and

random test)

Upr = 1.6 × UIORM, Pd < 5 pC

UIORM

Upr

707

1 131

Vpeak

Test voltage (partial discharge test, procedure b for all devices)

Upr = 1.875 × UIORM, Pd < 5 pC

Upr 1 325 Vpeak

Highest permissible overvoltage UTR 6 000 Vpeak

Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) 2

Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303

Part 11))

CTI 175

Material group (DIN EN 60664-1 VDE0110 Part 1) III a

Storage temperature range Tstg –55 to +150 °C

Operating temperature range TA –55 to +100 °C

Isolation resistance, minimum value

VIO = 500 V dc at TA = 25°C

VIO = 500 V dc at TA MAX. at least 100°C

Ris MIN.

1012

1011

Safety maximum ratings (maximum permissible in case of fault, see

thermal derating curve)

Package temperature

Current (input current IF, Psi = 0)

Power (output or total power dissipation)

Isolation resistance

VIO = 500 V dc at TA = Tsi

Tsi

Isi

Psi

Ris MIN.

150

300

500

109

°C

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PS2705-1

R08DS0093EJ0300 Rev.3.00 Page 13 of 13

Jan 29, 2013

Caution GaAs Products This product uses gallium arsenide (GaAs).

GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe

the following points.

• Follow related laws and ordinances when disposing of the product. If there are no applicable laws

and/or ordinances, dispose of the product as recommended below.

1. Commission a disposal company able to (with a license to) collect, transport and dispose of

materials that contain arsenic and other such industrial waste materials.

2. Exclude the product from general industrial waste and household garbage, and ensure that the

product is controlled (as industrial waste subject to special control) up until final disposal.

• Do not burn, destroy, cut, crush, or chemically dissolve the product.

• Do not lick the product or in any way allow it to enter the mouth.

All trademarks and registered trademarks are the property of their respective owners.

C - 1

Revision History PS2705-1 Data Sheet

Description

Rev. Date Page Summary

1.00 Mar 31, 2003 − This data sheet was released as PN10243EJ01V0DS

3.00 Jan 29, 2013 Throughout Renesas format is applied to this data sheet.

p.1 The safety standards are revised.

p.2 PHOTOCOUPLER CONSTRUCTION is added.

p.3 The explanation in MARKING EXAMPLE is revised.

p.4

ORDERING INFORMATION is modified with the revision of the safety

standards.

p.5

Turn-on Time (ton) and Turn-off Time(toff) are added to the table in

ELECTRICAL CHARACTERISTICS.

Time chart for switching time is added.

p.7 The graph of LONG TERM CTR DEGRADATION is deleted from those in

TYPICAL CHARACTERISTICS.

p.8

PS2705-1--F4 is deleted form Tape Direction image in TAPING

SPECIFICATIONS.

p.9 RECOMMENDED MOUNT PAD DIMENSIONS is added.

p.10

The note about temperature condition of the recommended soldering

conditions is deleted.

p.12 SPECIFICATION OF VDE MARKS LICENSE DOCUMENT is revised.

Notice

1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for

the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the

use of these circuits, software, or information.

2. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics

assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.

3. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or

technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or

others.

4. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Renesas Electronics assumes no responsibility for any losses incurred by you or

third parties arising from such alteration, modification, copy or otherwise misappropriation of Renesas Electronics product.

5. Renesas Electronics products are classified according to the following two quality grades: "Standard" and "High Quality". The recommended applications for each Renesas Electronics product depends on

the product's quality grade, as indicated below.

"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic

equipment; and industrial robots etc.

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incurred by you or third parties arising from the use of any Renesas Electronics product for which the product is not intended by Renesas Electronics.

6. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage

range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the

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malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the

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regulations. You should not use Renesas Electronics products or technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the

development of weapons of mass destruction. When exporting the Renesas Electronics products or technology described in this document, you should comply with the applicable export control laws and

regulations and follow the procedures required by such laws and regulations.

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contents and conditions set forth in this document, Renesas Electronics assumes no responsibility for any losses incurred by you or third parties as a result of unauthorized use of Renesas Electronics

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(Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries.

(Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.

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