Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
SiGe BiCMOS INTEGRATED CIRCUIT
PD5740T6N
LOW NOISE WIDEBAND AMPLIFIER IC WITH THROUGH FUNCTION
Document No. PU10764EJ01V0DS (1st edition)
Date Published June 2009 NS
DESCRIPTION
The
PD5740T6N is a low noise wideband amplifier IC mainly designed for the portable digital TV application.
This IC has achieved low noise figure and the wideband operation. The
PD5740T6N has an LNA pass-through
function (bypass function) to prevent the degradation of the received signal quality at the strong electric field, and
achieve the high reception sensitivity and low power consumption.
The package is a 6-pin plastic TSON (Thin Small Out-line Non-leaded) (T6N) suitable for surface mount.
This IC is manufactured using our latest SiGe BiCMOS process that shows superior high frequency characteristics.
FEATURES
Low voltage operation : VCC = 2.3 to 3.3 V (2.8 V TYP.)
Low mode control voltage : Vcont (H) = 1.0 V to VCC, Vcont (L) = 0 to 0.5 V
Low current consumption : ICC1 = 5.0 mA TYP. @ VCC = 2.8 V (LNA-mode)
: ICC2 = 1
A MAX. @ VCC = 2.8 V (Bypass-mode)
Low noise (LNA-mode) : NF1 = 1.5 dB TYP. @ VCC = 2.8 V, f = 470 MHz
: NF2 = 1.5 dB TYP. @ VCC = 2.8 V, f = 770 MHz
High gain (LNA-mode) : GP1 = 15.0 dB TYP. @ VCC = 2.8 V, f = 470 MHz
: GP2 = 13.5 dB TYP. @ VCC = 2.8 V, f = 770 MHz
Low insertion loss (Bypass-mode) : Lins1 = 1.1 dB TYP. @ VCC = 2.8 V, f = 470 MHz
: Lins2 = 1.3 dB TYP. @ VCC = 2.8 V, f = 770 MHz
High-density surface mounting : 6-pin plastic TSON (T6N) package (1.5 1.5 0.37 mm)
Included protection circuits for ESD
APPLICATION
Low noise amplifier for the portable and mobile digital TV system, etc.
ORDERING INFORMATION
Part Number
Order Number
Package
Marking
Supplying Form
PD5740T6N-E2
PD5740T6N-E2-A
6-pin plastic TSON
(T6N) (Pb-Free)
C3U
8 mm wide embossed taping
Pin 1, 6 face the perforation side of the tape
Qty 3 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order:
PD5740T6N-A
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Data Sheet PU10764EJ01V0DS
PD5740T6N
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No.
Pin Name
1
INPUT
2
GND
3
Vcont
4
VCC
5
NC
6
OUTPUT
Remark Exposed pad : GND
TRUTH TABLE
Vcont
Gain
Mode
H
High
LNA-mode
L
Low
Bypass-mode
Remark H= Vcont (H), “L” = Vcont (L)
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Test Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25C
3.6
V
Mode Control Voltage
Vcont
TA = +25C
3.6
V
Total Power Dissipation
Ptot
150
mW
Operating Ambient Temperature
TA
40 to +85
C
Storage Temperature
Tstg
55 to +150
C
Input Power
Pin
+33
dBm
RECOMMENDED OPERATING RANGE
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
2.3
2.8
3.3
V
Mode Control Voltage (H)
Vcont (H)
1.0
VCC
V
Mode Control Voltage (L)
Vcont (L)
0
0.5
V
Operating Frequency
f
50
1 800
MHz
Operating Ambient Temperature
TA
40
+25
+85
C
Input Power (LNA-mode)
Pin
+7
dBm
Input Power (Bypass-mode)
Pin
+15
dBm
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Data Sheet PU10764EJ01V0DS
3
PD5740T6N
ELECTRICAL CHARACTERISTICS 1 (DC Characteristics)
(TA = +25C, VCC = 2.8 V, unless otherwise specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Circuit Current 1
ICC1
Vcont = 2.8 V, No Signal (LNA-mode)
3.8
5.0
6.5
mA
Circuit Current 2
ICC2
Vcont = 0 V, No Signal (Bypass-mode)
1
A
Mode Control Current 1
Icont1
Vcont = 2.8 V, No Signal (LNA-mode)
40
100
A
Mode Control Current 2
Icont2
Vcont = 0 V, No Signal (Bypass-mode)
1
A
ELECTRICAL CHARACTERISTICS 2 (LNA-mode)
(TA = +25C, VCC = Vcont = 2.8 V, unless otherwise specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Power Gain 1
GP1
f = 470 MHz, Pin = 30 dBm
13.0
15.0
17.0
dB
Power Gain 2
GP2
f = 770 MHz, Pin = 30 dBm
11.5
13.5
15.5
dB
Noise Figure 1
NF1
f = 470 MHz, excluded PCB and
connector losses Note
1.5
2.0
dB
Noise Figure 2
NF2
f = 770 MHz, excluded PCB and
connector losses Note
1.5
2.0
dB
Input Return Loss 1
RLin1
f = 470 MHz, Pin = 30 dBm
7
12
dB
Input Return Loss 2
RLin2
f = 770 MHz, Pin = 30 dBm
7
10
dB
Output Return Loss 1
RLout1
f = 470 MHz, Pin = 30 dBm
7
14
dB
Output Return Loss 2
RLout1
f = 770 MHz, Pin = 30 dBm
7
11
dB
Input 3rd Order Intercept Point 1
IIP31
f1 = 470 MHz, f2 = 471 MHz,
Pin = 30 dBm
4.0
1.0
dBm
Input 3rd Order Intercept Point 2
IIP32
f1 = 770 MHz, f2 = 771 MHz,
Pin = 30 dBm
1.0
+2.0
dBm
Note Input PCB and connector losses: 0.05 dB (at 470 MHz), 0.08 dB (at 770 MHz)
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Data Sheet PU10764EJ01V0DS
PD5740T6N
ELECTRICAL CHARACTERISTICS 3 (Bypass-mode)
(TA = +25C, VCC = 2.8 V, unless otherwise specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Insertion Loss 1
Lins1
f = 470 MHz, Pin = 10 dBm, excluded
PCB and connector losses Note
1.1
2
dB
Insertion Loss 2
Lins2
f = 770 MHz, Pin = 10 dBm, excluded
PCB and connector losses Note
1.3
2
dB
Input Return Loss 1
RLin1
f = 470 MHz, Pin = 10 dBm
10
20
dB
Input Return Loss 2
RLin2
f = 770 MHz, Pin = 10 dBm
10
17
dB
Output Return Loss 1
RLout1
f = 470 MHz, Pin = 10 dBm
10
20
dB
Output Return Loss 2
RLout1
f = 770 MHz, Pin = 10 dBm
10
17
dB
Input 3rd Order Intercept Point
IIP3
f1 = 770 MHz, f2 = 771 MHz,
Pin = 2.5 dBm
+20
+30
dBm
Note Input-output PCB and connector losses: 0.10 dB (at 470 MHz), 0.16 dB (at 770 MHz)
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Data Sheet PU10764EJ01V0DS
5
PD5740T6N
STANDARD CHARACTERISTICS FOR REFERENCE 1 (LNA-mode)
(TA = +25C, VCC = Vcont = 2.8 V, unless otherwise specified)
Parameter
Symbol
Test Conditions
Reference
Unit
Isolation 1
ISL1
f = 470 MHz, Pin = 30 dBm
20
dB
Isolation 2
ISL2
f = 770 MHz, Pin = 30 dBm
20
dB
Gain 1 dB Compression Output
Power 1
PO (1 dB) 1
f = 470 MHz
5.5
dBm
Gain 1 dB Compression Output
Power 2
PO (1 dB) 2
f = 770 MHz
5.0
dBm
STANDARD CHARACTERISTICS FOR REFERENCE 2 (Bypass-mode)
(TA = +25C, VCC = 2.8 V, Vcont = 0 V, unless otherwise specified)
Parameter
Symbol
Test Conditions
Reference
Unit
Gain 1 dB Compression Output
Power
PO (1 dB)
f = 770 MHz
+8
dBm
TEST CIRCUIT
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Data Sheet PU10764EJ01V0DS
PD5740T6N
TYPICAL CHARACTERISTICS 1 (DC Characteristics) (TA = +25C, unless otherwise specified)
Remark The graphs indicate nominal characteristics.
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Data Sheet PU10764EJ01V0DS
7
PD5740T6N
TYPICAL CHARACTERISTICS 2 (LNA-mode) (TA = +25C, unless otherwise specified)
Remark The graphs indicate nominal characteristics.
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Data Sheet PU10764EJ01V0DS
PD5740T6N
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10764EJ01V0DS
9
PD5740T6N
Remark The graphs indicate nominal characteristics.
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Data Sheet PU10764EJ01V0DS
10
PD5740T6N
Remark The graphs indicate nominal characteristics.
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Data Sheet PU10764EJ01V0DS
11
PD5740T6N
Remark The graphs indicate nominal characteristics.
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Data Sheet PU10764EJ01V0DS
12
PD5740T6N
S-PARAMETERS 1 (LNA-mode) (TA = +25C, VCC = Vcont = 2.8 V, monitored at connector on board)
S11FREQUENCY
S22FREQUENCY
Remark The graphs indicate nominal characteristics.
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Data Sheet PU10764EJ01V0DS
13
PD5740T6N
TYPICAL CHARACTERISTICS 3 (Bypass-mode) (TA = +25C, unless otherwise specified)
Remark The graphs indicate nominal characteristics.
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Data Sheet PU10764EJ01V0DS
14
PD5740T6N
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10764EJ01V0DS
15
PD5740T6N
Remark The graphs indicate nominal characteristics.
DISCONTINUED
Data Sheet PU10764EJ01V0DS
16
PD5740T6N
Remark The graphs indicate nominal characteristics.
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Data Sheet PU10764EJ01V0DS
17
PD5740T6N
S-PARAMETERS 2 (Bypass-mode)
(TA = +25C, VCC = 2.8 V, Vcont = 0 V, monitored at connector on board)
S11FREQUENCY
S22FREQUENCY
Remark The graphs indicate nominal characteristics.
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Data Sheet PU10764EJ01V0DS
18
PD5740T6N
PACKAGE DIMENSIONS
6-PIN PLASTIC TSON (T6N) (UNIT: mm)
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Data Sheet PU10764EJ01V0DS 19
PD5740T6N
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance
difference.
(3) The bypass capacitor should be attached to VCC line.
(4) Do not supply DC voltage to INPUT pin.
(5) Pin 5 (NC) should be connected to the ground pattern.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220C or higher : 60 seconds or less
Preheating time at 120 to 180C : 12030 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
Partial Heating
Peak temperature (terminal temperature) : 350C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
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