XTC7004 * Temperature Compensated Crystal Oscillator * Miniature 3.2 x 2.5 mm SMD Package * Excellent Frequency Stability * Low Phase Noise * Complies with Directive 2002/95/EC (RoHS) 2 > 16.367667 MHz TCXO 4-Terminal SMD Case Electrical Characteristics Characteristic Sym Notes Minimum FO Nominal Frequency Frequency Tolerance after Reflow Typical Maximum 16.367667 Units MHz 2 ppm maximum @ 25 3 C Storage Temperature Range in Tape and Reel -40 +85 C Operating Temperature Range -30 +85 C VDD Power Supply Voltage Output Voltage with 10 pF || 10 K Load 2.70 2.85 3.00 Output Waveform V VP-P 0.8 Clipped Sinewave IDD 2.0 mA Temperature, -30 to 85 C 0.5 ppm Load Variation, 10 pF || 10 K10% 0.2 ppm Supply Voltage, 2.85 V 5% 0.2 ppm 0.05 ppm Short Term Stability (STS) 0.8 ppb Static Temperature Hysteresis 0.6 ppm Start Up Time, 90% of Final RF level in VP-P 2.0 ms Harmonics -7.0 dBc SSB Phase Noise @ 1 kHz Carrier Offset -130 dBc/Hz Power Supply Current Frequency Stability versus: Frequency Slope, one measurement every 2 C Aging @ 25 C 1.0 Stanard Shipping Quantity on 180 mm (7") Reel 1000 Lid Symbolization (in addition to Lot and/or Date Codes) ppm units Line1: 7004 Line2: YWWS Pin Connections Connection Terminals Ground 1 Ground 2 TCXO Output 3 VDD 4 CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes: 1. The design, manufacturing process, and specifications of this device are subject to change without notice. www.RFM.com E-mail: info@rfm.com (c)2009-2011 by RF Monolithics, Inc. Page 1 of 4 XTC7004 - 12/12/11 4-Terminal Surface-Mount Seam Weld Case 3.2 x 2.5 mm Nominal Footprint D A C 4 E 3 3 B F 4 G 2 1 2 Top 1 Bottom Side I H Case and PCB Land Dimensions 4 L 3 Dimension A B C D E F G H I J K L M M 1 2 K J PCB Land Pattern (Top View) Min 3.00 2.30 - mm Nom 3.20 2.50 3.08 1.80 2.38 1.00 0.60 0.65 3.60 1.60 2.90 0.80 Max 3.40 2.70 1.20 - Min 0.118 0.091 - Inches Nom 0.126 0.098 0.121 0.071 0.094 0.039 0.024 0.026 0.142 0.063 0.114 0.031 Max 0.134 0.106 0.047 - Case Materials Materials V D D Solder Pad Plating 0.3 to 1.0 m Gold over 1.27 to 8.89 m Nickel Lid Plating 2.0 to 3.0 m Nickel Body Al2O3 Ceramic Pb Free 1 2 T e m p C o m p C r O s c e ra tu re e n s a te d y s ta l illa to r 4 1 0 n F 3 O u tp u t TCXO Application Circuit www.RFM.com E-mail: info@rfm.com (c)2009-2011 by RF Monolithics, Inc. Page 2 of 4 XTC7004 - 12/12/11 Typical Solder Reflow Profile R a m p u p 3 0 0 P re h e a t R e flo w C o o l D o w n T e m p e ra tu re (d e g C ) 2 5 0 2 0 0 1 5 0 1 0 0 5 0 M a x im u m p e a k te m p e ra tu re : 2 6 0 O C 0 0 6 0 1 2 0 1 8 0 2 4 0 3 0 0 3 6 0 T im e (s e c o n d s ) www.RFM.com E-mail: info@rfm.com (c)2009-2011 by RF Monolithics, Inc. Page 3 of 4 XTC7004 - 12/12/11 Reel Dimensions mm A B C D E F G H T1 T2 T3 Dimension 180 60 13.0 2.0 9.1 2.9 4.9 3.9 9.0 11.4 1.2 Tolerance 1.0 +1.0/-0.0 0.2 0.5 0.5 0.5 0.5 0.5 0.3 1.0 0.1 Tape Dimensions mm A0 B0 W F E P0 P1 P2 D1 D K0 t Dimension 2.80 3.71 8.00 3.50 1.75 4.00 4.00 2.00 1.50 1.00 1.75 0.25 Tolerance 0.10 0.10 +0.30/-0.10 0.05 0.10 0.10 0.10 0.05 +0.10/-0.00 +0.25/-0.00 0.10 0.02 www.RFM.com E-mail: info@rfm.com (c)2009-2011 by RF Monolithics, Inc. Page 4 of 4 XTC7004 - 12/12/11 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Murata: XTC7004