CMF-SDP10A-2 - Bourns, Inc.

CMF-SDP Series - Telecom CPTC Resettable Fuses

Typical

Induction Rated Resistance Time to Trip

Voltage Rated Resistance Matching Hold Trip Imax @ @ Imax/

Model Withstand Voltage (RN) In Housing Current Current 230 VAC 230 VAC

VAC Volts Ohms Tolerance Ohms Amps @ 25 °C Amps @ 25 °C Amps Seconds

CMF-SDP07 600 230 7 ±20 % ±0.5 0.150 0.350 3.0 0.45

CMF-SDP10 600 230 10 ±20 % ±0.5 0.180 0.360 1.0 3.8

CMF-SDP10A 600 230 10 ±20 % ±0.5 0.150 0.360 1.0 3.8

CMF-SDP25 600 230 25 ±20 % ±0.5 0.130 0.260 2.8 0.2

CMF-SDP25A 600 230 25 ±20 % ±0.5 0.130 0.260 2.8 0.3

CMF-SDP35 600 230 35 +15/-20 % ±0.5 0.110 0.230 4.6 0.06

CMF-SDP35A 600 230 35 +15/-20 % ±0.5 0.110 0.230 4.6 0.04

CMF-SDP50 600 230 50 ±15 % ±0.5 0.090 0.190 2.5 0.13

CMF-SDP50A 600 230 50 ±15 % ±0.5 0.090 0.190 2.5 0.1

CMF-SDP75 600 230 75 ±20 % ±1 0.070 0.150 2.5 0.12

Electrical Characteristics

Features

■Two resistance-matched PTCs in a

plastic housing

■Narrow resistance tolerance

■RoHS compliant*

Applications

Used as a secondary overcurrent protection

device in:

■Customer Premise Equipment (CPE)

■Central Office (CO)

■Access equipment

*RoHS COMPLIANT

Operating Temperature Range: -40°C to +125 °C

*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Primary

Test Protection Test Condition Requirements

Mains Power Contact - ITU-T K.20, K.21 ....None................230 V rms, 10 ohms, 15 Min.......................................................(Ri-Rf) / Ri < ±10 %

Power Induction - ITU-T K.20, K.21..............None................600V rms, 600 ohms, 0.2 seconds, 10 cycles, every 1 Min. ......(Ri-Rf) / Ri < ±10 %

Power Induction - ITU-T K.20, K.21..............GDT ................600 V rms, 600 ohms, 1 second, 10 cycles, every 1 Min. ..........(Ri-Rf) / Ri < ±10 %

Power Induction - ITU-T K.20, K.21..............GDT ................600 V rms, 200 ohms, 1 second, 10 cycles, every 1 Min. ..........(Ri-Rf) / Ri < ±10 %

Lightning Surge - ITU-T K.20, K.21 ......................................10/700 µs, 25 ohms, 1.0 kV, 10 Tests, every 1 Min. ..................(Ri-Rf) / Ri < ±10 %

Lightning Surge......................................................................10/100 µs, 25 ohms, 1.5 kV, 30 Tests, every 3 Min. ..................(Ri-Rf) / Ri < ±10 %

Ri = R initial

Rf = R final

Test Procedures And Requirements For Model CMF-SDP Series

How to Order

CMF - SD P 35 A -XX - 2

Product Designator

Style

SD = Surface Mount

Dual Pkg.

Housing

P = Plastic

Rated Resistance (RN)

7-75 (7-75 Ohms)

Footprint and Height Option

Blank = Standard Product

A = Reduced Footprint and Height

Resistance Tolerance Option

Blank = Standard

-XX = XX %; e.g. -10 = ±10 %

Packaging Options

- 2 = Tape & Reel

Typical Part Marking

Represents total content. Layout may vary.

35P8G

MANUFACTURER'S

TRADEMARK

PART

IDENTIFICATION:

07P = CMF-SDP07

10P = CMF-SDP10

10PA = CMF-SDP10A

25P = CMF-SDP25

25PA = CMF-SDP25A

35P = CMF-SDP35

35PA = CMF-SDP35A

50P = CMF-SDP50

50PA = CMF-SDP50A

75P = CMF-SDP75

YEAR CODE:

8 = 2008

BI-WEEKLY

DATE CODE:

WEEK 13-14 = G

Asia-Pacific:

Tel: +886-2 2562-4117

Fax: +886-2 2562-4116

Europe:

Tel: +41-41 768 5555

Fax: +41-41 768 5510

The Americas:

Tel: +1-951 781-5500

Fax: +1-951 781-5700

www.bourns.com

Solder Reflow Recommendations

160–220

300

250

200

150

100

10–20

Temperature (°C)

120

Preheating Soldering Cooling

Time (seconds)

Solder reflow

• Recommended reflow methods: IR, vapor phase oven, hot air oven.

• Devices are not designed to be wave soldered to the bottom side of the

board.

• Gluing the devices is not recommended.

• Recommended maximum paste thickness is 0.25 mm (.010 inch).

• Devices can be cleaned using standard industry methods and solvents.

Note:

• If reflow temperatures exceed the recommended profile, devices may not

meet the performance specifications.

Rework

• A device should not be reworked.

CMF-SDP SERIES, REV. C, 11/08

CMF-SDP Series - Telecom CPTC Resettable Fuses

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Product Dimensions

Recommended Pad LayoutRecommended Pad Layout

Packaging options: TAPE & REEL: 350 pcs. per reel Packaging options: TAPE & REEL: 400 pcs. per reel

(INCHES)

DIMENSIONS =

8.75

(.344) MAX.

MAX.

7.2

(.283)

3.9

(.154)

0.5

(.020)

2 PLCS.

10.2

(402)

2.4

(.094)

CMF-SDP10A, 25A, 35A & 50A

5.0

(.197)

11.0

(.433) MAX.

9.0

(.354) MAX.

11.5

(.453)

MAX.

2.6

(.102)

CMF-SDP07, 10, 25, 35, 50 & 75

7.2

(.283)

MAX.

8.75

(.344)

MAX.

3.2

(.126) 2.0

(.079)

2.4

(.094)

6.3

(.248)

3.9

(.154)

8.2

(.323)

9.0

(.354)

10.0

(.394)

3.2

(.126) 2.0

(.079)

2.6

(.102)

7.6

(.299)

11.0

(.433)

5.0

(.197)

CMF-SDP10-2, CMF-SDP25-2,

CMF-SDP-35-2, CMF-SDP50-2, CMF-SDP10A-2, CMF-SDP25A-2,

Tape Dimensions per EIA 481-2 CMF-SDP75-2 CMF-SDP35A-2, CMF-SDP50A-2

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

CMF-SDP Series Tape and Reel Specifications

DIMENSIONS = MM

(INCHES)

24.0 ±0.5

(0.945 ±0.020 )

4.0

(0.157)

2.0

(0.079)

9.1 ± 0.2

(0.358 ± 0.008)

11.20 ± 0.2

(0.441 ± 0.008)

1.75

(0.069)

11.7 ± 0.2

(0.433 ± 0.008)

11.5

(0.453)

1.5

(0.059)

P0T

P2-0.4

(-.016)

13.2 +0.2/-0

(.520 +.008/-0

100 ± 1.5

(3.94 ± .059)

DIA.

24.4

(.961) 30.4

(1.197)

MAX.

MIN.

330 -2/+0

(12.99 -.079/+0)

DIA.

0.5 ± 0.15

(0.020 ± 0.006)

24.0 ±0.5

(0.945 ±0.020 )

4.0

(0.157)

2.0

(0.079)

16.0

(0.630)

16.0

(0.630)

7.5 ± 0.2

(0.295 ± 0.008)

9.0 ± 0.2

(0.354 ± 0.008)

1.75

(0.069)

10.0 ± 0.2

(0.394 ± 0.008)

11.5

(0.453)

1.5

(0.059)

0.5 ± 0.15

(0.020 ± 0.006)