Revision Date: Sep. 27, 2007
16 H8S/2329 Group
Hardware Manual
Renesas 16-Bit Single-Chip Microcomputer
H8S Family/H8S/2300 Series
H8S/2329 HD64F2329B H8S/2324S HD6412324S
HD64F2329E H8S/2323 HD6432323
H8S/2328 HD6432328 H8S/2322R HD6412322R
HD64F2328B H8S/2321 HD6412321
H8S/2327 HD6432327 H8S/2320 HD6412320
H8S/2326 HD64F2326
Rev.6.00
REJ09B0220-0600
The revision list can be viewed directly by
clicking the title page.
The revision list summarizes the locations of
revisions and additions. Details should always
be checked by referring to the relevant text.
Rev.6.00 Sep. 27, 2007 Page ii of xxx
REJ09B0220-0600
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate
Renesas products for their use. Renesas neither makes warranties or representations with respect to the
accuracy or completeness of the information contained in this document nor grants any license to any
intellectual property rights or any other rights of Renesas or any third party with respect to the information in
this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising
out of the use of any information in this document, including, but not limited to, product data, diagrams, charts,
programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military
applications such as the development of weapons of mass destruction or for the purpose of any other military
use. When exporting the products or technology described herein, you should follow the applicable export
control laws and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and
application circuit examples, is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas products listed in this
document, please confirm the latest product information with a Renesas sales office. Also, please pay regular
and careful attention to additional and different information to be disclosed by Renesas such as that disclosed
through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas
assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information
included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in
light of the total system before deciding about the applicability of such information to the intended application.
Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any
particular application and specifically disclaims any liability arising out of the application and use of the
information in this document or Renesas products.
7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas
products are not designed, manufactured or tested for applications or otherwise in systems the failure or
malfunction of which may cause a direct threat to human life or create a risk of human injury or which require
especially high quality and reliability such as safety systems, or equipment or systems for transportation and
traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication
transmission. If you are considering the use of our products for such purposes, please contact a Renesas
sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who
elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas
Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect
to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or
damages arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific
characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use
conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and
injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for
hardware and software including but not limited to redundancy, fire control and malfunction prevention,
appropriate treatment for aging degradation or any other applicable measures. Among others, since the
evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or
system manufactured by you.
11. In case Renesas products listed in this document are detached from the products to which the Renesas
products are attached or affixed, the risk of accident such as swallowing by infants and small children is very
high. You should implement safety measures so that Renesas products may not be easily detached from your
products. Renesas shall have no liability for damages arising out of such detachment.
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written
approval from Renesas.
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this
document, Renesas semiconductor products, or if you have any other inquiries.
Notes regarding these materials
Rev.6.00 Sep. 27, 2007 Page iii of xxx
REJ09B0220-0600
General Precautions in the Handling of MPU/MCU Products
The following usage notes are applicable to all MPU/MCU products from Renesas. For detailed usage notes
on the products covered by this manual, refer to the relevant sections of the manual. If the descriptions under
General Precau t ions in the Handling of MPU/MCU Products and in the bod y of th e manual differ from each
other, th e description in th e body of the manual takes p r ecedence.
1. Handling of Unused Pins
Handle unused pins in accord with the directions given under Handling of Unused Pins in
the manual.
⎯ The input pins of CMOS products are generally in the high-impedance state. In
operation with an unused pin in the open-circuit state, extra electromagnetic noise is
induced in the vicinity of LSI, an associated shoot-through current flows internally, and
malfunctions may occur due to the false recognition of the pin state as an input signal.
Unused pins should be handled as described under Handling of Unused Pins in the
manual.
2. Processing at Power-on
The state of the product is undefined at the moment when power is supplied.
⎯ The states of internal circuits in the LSI are indeterminate and the states of register
settings and pins are undefined at the moment when power is supplied.
In a finished product where the reset signal is applied to the external reset pin, the
states of pins are not guaranteed from the moment when power is supplied until the
reset process is completed.
In a similar way, the states of pins in a product that is reset by an on-chip power-on
reset function are not guaranteed from the moment when power is supplied until the
power reaches the level at which resetting has been specified.
3. Prohibition of Access to Reserved Addresses
Access to reserved addresses is prohibited.
⎯ The reserved addresses are provided for the possible future expansion of functions. Do
not access these addresses; the correct operation of LSI is not guaranteed if they are
accessed.
4. Clock Signals
After applying a reset, only release the reset line after the operating clock signal has
become stable. When switching the clock signal during program execution, wait until the
target clock signal has stabilized.
⎯ When the clock signal is generated with an external resonator (or from an external
oscillator) during a reset, ensure that the reset line is only released after full stabilization
of the clock signal. Moreover, when switching to a clock signal produced with an
external resonator (or by an external oscillator) while program execution is in progress,
wait until the target clock signal is stable.
5. Differences between Products
Before changing from one product to another, i.e. to one with a different type number,
confirm that the change will not lead to problems.
⎯ The characteristics of MPU/MCU in the same group but having different type numbers
may differ because of the differences in internal memory capacity and layout pattern.
When changing to products of different type numbers, implement a system-evaluation
test for each of the products.
Rev.6.00 Sep. 27, 2007 Page iv of xxx
REJ09B0220-0600
Rev.6.00 Sep. 27, 2007 Page v of xxx
REJ09B0220-0600
Preface
This LSI is a single-chip microcomputer made up of the H8S/2000 CPU with an internal 32-bit
architecture as its core, and the peripheral functions required to configure a system.
This LSI is equipped with ROM, RAM, a bus controller, data transfer controller (DTC), a 16-bit
timer pulse unit (TPU), a watchdog timer (WDT), a serial communication interface (SCI), DMA
controller (DMAC), a D/A converter, an A/D converter, and I/O ports as on-chip supporting
modules. This LSI is suitable for use as an embedded processor for high-level control systems. Its
on-chip ROM are flash memory (F-ZTAT™*) and mask ROM that provides flexibility as it can
be reprogrammed in no time to cope with all situations from the early stages of mass production to
full-scale mass prod uction. This is particularly applicable to applicatio n devices with
specifications that will most prob a bly change.
Note: * F-ZTAT is a trademark of Renesas Technology Corp.
Target Users: This manual was written for users who will be using the H8S/2329 Group,
H8S/2328 Group in the design of application systems. Members of this audience are
expected to understand the fundamentals of electrical circuits, logical circuits, and
microcomputers.
Objective: This manual was written to explain the hardware functions and electrical
characteristics of the H8S/2329 Group, H8S/2328 Group to the above audience.
Refer to the H8S/2600 Series, H8S/2000 Series Software Manual for a detailed
description of the instr uction set.
Notes on reading this manual:
• In order to understand the overall functions of the chip
Read the man ual according to the contents. This manual can be roughly categorized into par t s
on the CPU, system control functions, peripheral functions and electrical characteristics.
• In order to understand the details of the CPU's functions
Read the H8S/2600 Series, H8S/2000 Series Software Manual.
• In order to understand the details of a register when its na me is known
The addresses, bits, and initial values of t he registers are summarized in appendix B, Internal
I/O Regi sters.
Example: Bit order: The MSB is on the left and the LSB is on the right.
Related Manuals: The latest versions of all related manuals are available from our web site.
Please ensure you have the latest versions of all documents you require.
(http://www.renesas.co m/eng/)
Rev.6.00 Sep. 27, 2007 Page vi of xxx
REJ09B0220-0600
H8S/2329 Group, H8S/2328 Group Manuals:
Document Title Document No.
H8S/2329 Group, H8S/2328 Group Hardware Manual This manual
H8S/2600 Series, H8S/2000 Series Software Manual REJ09B0139
User’s Manuals for Development Tools:
Document Title Document No.
H8S, H8S/300 Series C/C++ Compiler, Assembler, Optimized Linkage
Editor Compiler Package Ver.6.01 User's Manual REJ10B0161
H8S, H8S/300 Series Simulator/Debugger (for W indows) User’s Manual ADE-702-037
High-performance Embedded Workshop (for Windows 95/98 and Windows
NT 4.0) User’s Manual ADE-702-201
Application Notes:
Document Title Document No.
H8S Series Technical Q & A Application Note REJ05B0397
Rev.6.00 Sep. 27, 2007 Page vii of xxx
REJ09B0220-0600
Main Revisions for This Edition
Item Page Revision (See Manual for Details)
1.3.1 Pin Arrangement
Figure 1.3 Mask ROM
Versions, F-ZTAT
Versions, H8S/2324S,
H8S/2322R, H8S/2320
Pin Arrangement (TFP-
120: Top View)
10 Figure amended
RES
WDTOVF (FWE )*
P20/PO
0
/TIOCA
3
73
72
71
Note amended
Note: * The FWE pin applies to the H8S/2328B F-ZTAT and
H8S/2326 F-ZTAT only.
The WDTOVF pin function is not available in the F-
ZTAT versions.
Figure 1.4 Mask ROM
Versions, F-ZTAT
Versions, H8S/2324S,
H8S/2322R, H8S/2320
Pin Arrangement (FP-
128B: Top View)
11 Figure amended
RES
WDTOVF (FWE )*
P20/PO0/TIOCA3
81
80
79
Note amended
Note: * The FWE pin applies to the H8S/2328B F-ZTAT and
H8S/2326 F-ZTAT only.
The WDTOVF pin function is not available in the F-
ZTAT versions.
Figure 1.7
HD64F2329B Pin
Arrangement (TFP-
120: Top View)
14 Figure added
Rev.6.00 Sep. 27, 2007 Page viii of xxx
REJ09B0220-0600
Item Page Revision (See Manual for Details)
1.3.1 Pin Arrangement
Figure 1.8
HD64F2329B Pin
Arrangement (FP-
128B: Top View)
15 Figure added
1.3.3 Pin Functions
Table 1.3 Pin Functions26 Table amended
MD
2
MD
1
MD
0
Operating
Mode
0 0 1 —
1 0 Mode 2*
1
1 Mode 3*
1
1 0 0 Mode 4*
2
1 Mode 5*
2
1 0 Mode 6
1 Mode 7
6.3.5 Chip Select
Signals 169 Description amended
Enabling or disabling of the CSn signal is performed by setting
the data direction register (DDR) for the port corresponding to
the particular CSn pin and either the CS167 enable bit
(CS167E) or the CS25 enable bit (CS25E).
In ROM-disabled expansion mode, the CS0 pin is placed in the
output state after a power-on reset. Pins CS1 to CS7 are placed
in the input state after a power-on reset, so the corresponding
DDR bits, and CS167E or CS25E, should be set to 1 when
outputting signals CS1 to CS7.
In ROM-enabled expansion mode, pins CS0 to CS7 are all
placed in the input state after a power-on reset, so the
corresponding DDR bits, and CS167E or CS25E, should be set
to 1 when outputting signals CS0 to CS7.
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Item Page Revision (See Manual for Details)
14.2.8 Bit Rate
Register (BRR)
Table 14.3 BRR
Settings for Various Bit
Rates (Asynchronous
Mode)
618 Table amended
φ = 25 MHz
Bit Rate
(bits/s)
n
N Error
(%)
110 3 110 –0.02
150 3 80 0.47
300 2 162 –0.15
600 2 80 0.47
1200 1 162 –0.15
2400 1 80 0.47
4800 0 162 –0.15
9600 0 80 0.47
19200 0 40 –0.76
31250 0 24 1.00
38400 0 19 1.73
19.4.1 Features 740 Description amended
The flash memory can be reprogrammed minimum 100 times.
19.13.1 Features 791 Description amended
The flash memory can be reprogrammed minimum 100 times.
19.22.1 Features 849 Description amended
The flash memory can be reprogrammed minimum 100 times.
22.2.6 Flash Memory
Characteristics
Table 22.22 Flash
Memory Characteristics
977 Table amended
Item Symbol Min Typ Max Unit
Test
Conditions
Programming time
*1 *2 *4
t
P
— 10 200 ms/
128 bytes
Erase time
*1 *3 *6
t
E
— 50 1000 ms/block
Rewrite times N
WEC
100*
7
10000*
8
— Times
Data hold time t
DRP
*
9
10 — — year
Programming Wait time after SWE bit setting
*1
x 1 — — s
Wait time after PSU bit setting
*1
y 50 — — s
Rev.6.00 Sep. 27, 2007 Page x of xxx
REJ09B0220-0600
Item Page Revision (See Manual for Details)
22.2.6 Flash Memory
Characteristics
Table 22.22 Flash
Memory Characteristics
978 Notes added
7. The minimum number of rewrites after which all
characteristics are guaranteed. (The guaranteed range is one
to min. rewrites.)
8. Reference value at 25°C. (This is a general indication of the
number of rewrites possible under normal conditions.)
9. The data retention characteristics within the specified range,
including min. rewrites.
Appendix F Package
Dimensions
Figure F.1 TFP-120
Package Dimensions
1267 Figure replaced
Figure F.2 FP-128B
Package Dimensions 1268 Figure replaced
All trademarks and registered trademarks are the property of their respective owners.
Rev.6.00 Sep. 27, 2007 Page xi of xxx
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Contents
Section 1 Overview............................................................................................1
1.1 Overview...........................................................................................................................1
1.2 Block Diagram..................................................................................................................8
1.3 Pin Description..................................................................................................................10
1.3.1 Pin Arrangement..................................................................................................10
1.3.2 Pin Functions in Each Operating Mode...............................................................18
1.3.3 Pin Functions .......................................................................................................24
Section 2 CPU....................................................................................................33
2.1 Overview...........................................................................................................................33
2.1.1 Features................................................................................................................33
2.1.2 Differences between H8S/2600 CPU and H8S/2000 CPU..................................34
2.1.3 Differences from H8/300 CPU ............................................................................35
2.1.4 Differences from H8/300H CPU..........................................................................35
2.2 CPU Operating Modes......................................................................................................36
2.3 Address Space...................................................................................................................39
2.4 Register Configuration......................................................................................................40
2.4.1 Overview..............................................................................................................40
2.4.2 General Registers.................................................................................................41
2.4.3 Control Registers .................................................................................................42
2.4.4 Initial Register Values..........................................................................................44
2.5 Data Formats.....................................................................................................................44
2.5.1 General Register Data Formats............................................................................45
2.5.2 Memory Data Formats.........................................................................................47
2.6 Instruction Set...................................................................................................................48
2.6.1 Overview..............................................................................................................48
2.6.2 Instructions and Addressing Modes.....................................................................49
2.6.3 Table of Instructions Classified by Function .......................................................50
2.6.4 Basic Instruction Formats ....................................................................................60
2.7 Addressing Modes and Effective Address Calculation.....................................................61
2.7.1 Addressing Mode.................................................................................................61
2.7.2 Effective Address Calculation .............................................................................64
2.8 Processing States.............................................................................................................. .68
2.8.1 Overview..............................................................................................................68
2.8.2 Reset State............................................................................................................69
2.8.3 Exception-Handling State....................................................................................70
2.8.4 Program Execution State ......................................................................................72
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2.8.5 Bus-Released State...............................................................................................72
2.8.6 Power-Down State...............................................................................................73
2.9 Basic Timing.....................................................................................................................73
2.9.1 Overview..............................................................................................................73
2.9.2 On-Chip Memory (ROM, RAM).........................................................................73
2.9.3 On-Chip Supporting Module Access Timing.......................................................75
2.9.4 External Address Space Access Timing ..............................................................76
2.10 Usage Note........................................................................................................................76
2.10.1 TAS Instruction....................................................................................................76
Section 3 MCU Operating Modes .....................................................................77
3.1 Overview...........................................................................................................................77
3.1.1 Operating Mode Selection (H8S/2328B F-ZTAT, H8S/2326 F-ZTAT)..............77
3.1.2 Operating Mode Selection (Mask ROM and ROMless Versions,
H8S/2329B F-ZTAT)...........................................................................................78
3.1.3 Register Configuration.........................................................................................80
3.2 Register Descriptions........................................................................................................80
3.2.1 Mode Control Register (MDCR) .........................................................................80
3.2.2 System Control Register (SYSCR)......................................................................81
3.2.3 System Control Register 2 (SYSCR2) (F-ZTAT Version Only) .........................82
3.3 Operating Mode Descriptions...........................................................................................83
3.3.1 Mode 1.................................................................................................................83
3.3.2 Mode 2 (H8S/2329B F-ZTAT Only)...................................................................83
3.3.3 Mode 3 (H8S/2329B F-ZTAT Only)...................................................................83
3.3.4 Mode 4 (Expanded Mode with On-Chip ROM Disabled)...................................83
3.3.5 Mode 5 (Expanded Mode with On-Chip ROM Disabled)...................................84
3.3.6 Mode 6 (Expanded Mode with On-Chip ROM Enabled) ....................................84
3.3.7 Mode 7 (Single-Chip Mode)................................................................................84
3.3.8 Modes 8 and 9 (H8S/2328B F-ZTAT and H8S/2326 F-ZTAT Only) .................84
3.3.9 Mode 10 (H8S/2328B F-ZTAT and H8S/2326 F-ZTAT Only)...........................84
3.3.10 Mode 11 (H8S/2328B F-ZTAT and H8S/2326 F-ZTAT Only)...........................85
3.3.11 Modes 12 and 13..................................................................................................85
3.3.12 Mode 14 (H8S/2328B F-ZTAT and H8S/2326 F-ZTAT Only)...........................85
3.3.13 Mode 15 (H8S/2328B F-ZTAT and H8S/2326 F-ZTAT Only)...........................85
3.4 Pin Functions in Each Operating Mode............................................................................85
3.5 Memory Map in Each Operating Mode ............................................................................86
Section 4 Exception Handling...........................................................................101
4.1 Overview...........................................................................................................................101
4.1.1 Exception Handling Types and Priority...............................................................101
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4.1.2 Exception Handling Operation.............................................................................102
4.1.3 Exception Vector Table .......................................................................................102
4.2 Reset..................................................................................................................................104
4.2.1 Overview..............................................................................................................104
4.2.2 Reset Sequence ....................................................................................................104
4.2.3 Interrupts after Reset............................................................................................105
4.2.4 State of On-Chip Supporting Modules after Reset Release.................................105
4.3 Traces................................................................................................................................106
4.4 Interrupts...........................................................................................................................107
4.5 Trap Instruction.................................................................................................................108
4.6 Stack Status after Exception Handling..............................................................................108
4.7 Notes on Use of the Stack.................................................................................................109
Section 5 Interrupt Controller............................................................................111
5.1 Overview...........................................................................................................................111
5.1.1 Features................................................................................................................111
5.1.2 Block Diagram.....................................................................................................112
5.1.3 Pin Configuration.................................................................................................113
5.1.4 Register Configuration.........................................................................................113
5.2 Register Descriptions........................................................................................................114
5.2.1 System Control Register (SYSCR)......................................................................114
5.2.2 Interrupt Priority Registers A to K (IPRA to IPRK)............................................115
5.2.3 IRQ Enable Register (IER)..................................................................................116
5.2.4 IRQ Sense Control Registers H and L (ISCRH, ISCRL).....................................117
5.2.5 IRQ Status Register (ISR)....................................................................................118
5.3 Interrupt Sources...............................................................................................................119
5.3.1 External Interrupts ...............................................................................................119
5.3.2 Internal Interrupts.................................................................................................121
5.3.3 Interrupt Exception Vector Table ........................................................................121
5.4 Interrupt Operation ............................................................................................................127
5.4.1 Interrupt Control Modes and Interrupt Operation................................................127
5.4.2 Interrupt Control Mode 0.....................................................................................130
5.4.3 Interrupt Control Mode 2.....................................................................................132
5.4.4 Interrupt Exception Handling Sequence ..............................................................134
5.4.5 Interrupt Response Times....................................................................................136
5.5 Usage Notes ......................................................................................................................137
5.5.1 Contention between Interrupt Generation and Disabling.....................................137
5.5.2 Instructions that Disable Interrupts......................................................................138
5.5.3 Times when Interrupts Are Disabled ...................................................................138
5.5.4 Interrupts during Execution of EEPMOV Instruction..........................................138
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5.6 DTC and DMAC Activation by Interrupt.........................................................................139
5.6.1 Overview..............................................................................................................139
5.6.2 Block Diagram.....................................................................................................140
5.6.3 Operation .............................................................................................................141
Section 6 Bus Controller....................................................................................143
6.1 Overview...........................................................................................................................143
6.1.1 Features................................................................................................................143
6.1.2 Block Diagram.....................................................................................................145
6.1.3 Pin Configuration.................................................................................................146
6.1.4 Register Configuration.........................................................................................148
6.2 Register Descriptions........................................................................................................149
6.2.1 Bus Width Control Register (ABWCR)...............................................................149
6.2.2 Access State Control Register (ASTCR) .............................................................150
6.2.3 Wait Control Registers H and L (WCRH, WCRL)..............................................151
6.2.4 Bus Control Register H (BCRH) .........................................................................154
6.2.5 Bus Control Register L (BCRL) ..........................................................................157
6.2.6 Memory Control Register (MCR)........................................................................159
6.2.7 DRAM Control Register (DRAMCR).................................................................162
6.2.8 Refresh Timer Counter (RTCNT)........................................................................164
6.2.9 Refresh Time Constant Register (RTCOR) .........................................................164
6.3 Overview of Bus Control..................................................................................................165
6.3.1 Area Partitioning..................................................................................................165
6.3.2 Bus Specifications................................................................................................166
6.3.3 Memory Interfaces...............................................................................................167
6.3.4 Advanced Mode...................................................................................................168
6.3.5 Chip Select Signals..............................................................................................169
6.4 Basic Bus Interface ...........................................................................................................170
6.4.1 Overview..............................................................................................................170
6.4.2 Data Size and Data Alignment.............................................................................170
6.4.3 Valid Strobes........................................................................................................172
6.4.4 Basic Timing........................................................................................................173
6.4.5 Wait Control ........................................................................................................181
6.5 DRAM Interface (Not supported in the H8S/2321)..........................................................183
6.5.1 Overview..............................................................................................................183
6.5.2 Setting DRAM Space ...........................................................................................183
6.5.3 Address Multiplexing...........................................................................................184
6.5.4 Data Bus...............................................................................................................184
6.5.5 Pins Used for DRAM Interface ............................................................................185
6.5.6 Basic Timing........................................................................................................186
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6.5.7 Precharge State Control .......................................................................................187
6.5.8 Wait Control ........................................................................................................188
6.5.9 Byte Access Control ............................................................................................190
6.5.10 Burst Operation....................................................................................................192
6.5.11 Refresh Control....................................................................................................195
6.6 DMAC Single Address Mode and DRAM Interface (Not supported in the H8S/2321)...198
6.6.1 When DDS = 1.....................................................................................................198
6.6.2 When DDS = 0.....................................................................................................199
6.7 Burst ROM Interface.........................................................................................................200
6.7.1 Overview..............................................................................................................200
6.7.2 Basic Timing........................................................................................................200
6.7.3 Wait Control ........................................................................................................202
6.8 Idle Cycle..........................................................................................................................203
6.8.1 Operation .............................................................................................................203
6.8.2 Pin States in Idle Cycle........................................................................................208
6.9 Write Data Buffer Function ..............................................................................................209
6.10 Bus Release.......................................................................................................................210
6.10.1 Overview..............................................................................................................210
6.10.2 Operation .............................................................................................................210
6.10.3 Pin States in External Bus Released State............................................................211
6.10.4 Transition Timing ................................................................................................212
6.10.5 Usage Note...........................................................................................................213
6.11 Bus Arbitration..................................................................................................................213
6.11.1 Overview..............................................................................................................213
6.11.2 Operation .............................................................................................................213
6.11.3 Bus Transfer Timing............................................................................................214
6.11.4 External Bus Release Usage Note........................................................................215
6.12 Resets and the Bus Controller...........................................................................................215
Section 7 DMA Controller (Not Supported in the H8S/2321) ..........................217
7.1 Overview...........................................................................................................................217
7.1.1 Features................................................................................................................217
7.1.2 Block Diagram.....................................................................................................218
7.1.3 Overview of Functions.........................................................................................219
7.1.4 Pin Configuration.................................................................................................221
7.1.5 Register Configuration.........................................................................................222
7.2 Register Descriptions (1) (Short Address Mode)..............................................................223
7.2.1 Memory Address Registers (MAR).....................................................................224
7.2.2 I/O Address Register (IOAR) ..............................................................................225
7.2.3 Execute Transfer Count Register (ETCR) ...........................................................225
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7.2.4 DMA Control Register (DMACR) ......................................................................227
7.2.5 DMA Band Control Register (DMABCR) ..........................................................231
7.3 Register Descriptions (2) (Full Address Mode)................................................................237
7.3.1 Memory Address Register (MAR).......................................................................237
7.3.2 I/O Address Register (IOAR) ..............................................................................237
7.3.3 Execute Transfer Count Register (ETCR) ...........................................................238
7.3.4 DMA Control Register (DMACR) ......................................................................240
7.3.5 DMA Band Control Register (DMABCR) ..........................................................244
7.4 Register Descriptions (3) ..................................................................................................250
7.4.1 DMA Write Enable Register (DMAWER)..........................................................250
7.4.2 DMA Terminal Control Register (DMATCR).....................................................253
7.4.3 Module Stop Control Register (MSTPCR)..........................................................254
7.5 Operation...........................................................................................................................255
7.5.1 Transfer Modes....................................................................................................255
7.5.2 Sequential Mode ..................................................................................................257
7.5.3 Idle Mode.............................................................................................................260
7.5.4 Repeat Mode........................................................................................................263
7.5.5 Single Address Mode...........................................................................................267
7.5.6 Normal Mode.......................................................................................................270
7.5.7 Block Transfer Mode...........................................................................................273
7.5.8 DMAC Activation Sources..................................................................................279
7.5.9 Basic DMAC Bus Cycles.....................................................................................282
7.5.10 DMAC Bus Cycles (Dual Address Mode)...........................................................283
7.5.11 DMAC Bus Cycles (Single Address Mode) ........................................................291
7.5.12 Write Data Buffer Function .................................................................................297
7.5.13 DMAC Multi-Channel Operation........................................................................298
7.5.14 Relation Between the DMAC and External Bus Requests, Refresh Cycles,
and the DTC.........................................................................................................300
7.5.15 NMI Interrupts and DMAC..................................................................................301
7.5.16 Forced Termination of DMAC Operation............................................................302
7.5.17 Clearing Full Address Mode................................................................................303
7.6 Interrupts...........................................................................................................................304
7.7 Usage Notes ......................................................................................................................305
Section 8 Data Transfer Controller....................................................................311
8.1 Overview...........................................................................................................................311
8.1.1 Features................................................................................................................311
8.1.2 Block Diagram.....................................................................................................312
8.1.3 Register Configuration.........................................................................................313
8.2 Register Descriptions........................................................................................................314
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8.2.1 DTC Mode Register A (MRA) ............................................................................314
8.2.2 DTC Mode Register B (MRB).............................................................................315
8.2.3 DTC Source Address Register (SAR)..................................................................317
8.2.4 DTC Destination Address Register (DAR)..........................................................317
8.2.5 DTC Transfer Count Register A (CRA) ..............................................................318
8.2.6 DTC Transfer Count Register B (CRB)...............................................................318
8.2.7 DTC Enable Registers (DTCER).........................................................................319
8.2.8 DTC Vector Register (DTVECR)........................................................................320
8.2.9 Module Stop Control Register (MSTPCR)..........................................................321
8.3 Operation...........................................................................................................................321
8.3.1 Overview..............................................................................................................321
8.3.2 Activation Sources...............................................................................................325
8.3.3 DTC Vector Table................................................................................................326
8.3.4 Location of Register Information in Address Space............................................330
8.3.5 Normal Mode.......................................................................................................331
8.3.6 Repeat Mode........................................................................................................332
8.3.7 Block Transfer Mode...........................................................................................333
8.3.8 Chain Transfer .....................................................................................................335
8.3.9 Operation Timing.................................................................................................336
8.3.10 Number of DTC Execution States .......................................................................337
8.3.11 Procedures for Using DTC...................................................................................339
8.3.12 Examples of Use of the DTC...............................................................................340
8.4 Interrupts...........................................................................................................................344
8.5 Usage Notes ......................................................................................................................345
Section 9 I/O Ports.............................................................................................347
9.1 Overview...........................................................................................................................347
9.2 Port 1.................................................................................................................................352
9.2.1 Overview..............................................................................................................352
9.2.2 Register Configuration.........................................................................................353
9.2.3 Pin Functions .......................................................................................................355
9.3 Port 2.................................................................................................................................363
9.3.1 Overview..............................................................................................................363
9.3.2 Register Configuration.........................................................................................364
9.3.3 Pin Functions .......................................................................................................366
9.4 Port 3.................................................................................................................................374
9.4.1 Overview..............................................................................................................374
9.4.2 Register Configuration.........................................................................................374
9.4.3 Pin Functions .......................................................................................................377
9.5 Port 4.................................................................................................................................379
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9.5.1 Overview..............................................................................................................379
9.5.2 Register Configuration.........................................................................................380
9.5.3 Pin Functions .......................................................................................................380
9.6 Port 5.................................................................................................................................381
9.6.1 Overview..............................................................................................................381
9.6.2 Register Configuration.........................................................................................382
9.6.3 Pin Functions .......................................................................................................386
9.7 Port 6.................................................................................................................................388
9.7.1 Overview..............................................................................................................388
9.7.2 Register Configuration.........................................................................................389
9.7.3 Pin Functions .......................................................................................................392
9.8 Port A................................................................................................................................394
9.8.1 Overview..............................................................................................................394
9.8.2 Register Configuration.........................................................................................395
9.8.3 Pin Functions .......................................................................................................400
9.8.4 MOS Input Pull-Up Function ...............................................................................403
9.9 Port B................................................................................................................................404
9.9.1 Overview..............................................................................................................404
9.9.2 Register Configuration.........................................................................................405
9.9.3 Pin Functions .......................................................................................................407
9.9.4 MOS Input Pull-Up Function ...............................................................................409
9.10 Port C................................................................................................................................410
9.10.1 Overview..............................................................................................................410
9.10.2 Register Configuration.........................................................................................411
9.10.3 Pin Functions .......................................................................................................413
9.10.4 MOS Input Pull-Up Function...............................................................................415
9.11 Port D................................................................................................................................416
9.11.1 Overview..............................................................................................................416
9.11.2 Register Configuration.........................................................................................417
9.11.3 Pin Functions .......................................................................................................420
9.11.4 MOS Input Pull-Up Function...............................................................................421
9.12 Port E ................................................................................................................................422
9.12.1 Overview..............................................................................................................422
9.12.2 Register Configuration.........................................................................................423
9.12.3 Pin Functions .......................................................................................................425
9.12.4 MOS Input Pull-Up Function...............................................................................427
9.13 Port F.................................................................................................................................428
9.13.1 Overview..............................................................................................................428
9.13.2 Register Configuration.........................................................................................429
9.13.3 Pin Functions .......................................................................................................433
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9.14 Port G................................................................................................................................435
9.14.1 Overview..............................................................................................................435
9.14.2 Register Configuration.........................................................................................436
9.14.3 Pin Functions .......................................................................................................439
Section 10 16-Bit Timer Pulse Unit (TPU)........................................................441
10.1 Overview...........................................................................................................................441
10.1.1 Features................................................................................................................441
10.1.2 Block Diagram.....................................................................................................445
10.1.3 Pin Configuration.................................................................................................446
10.1.4 Register Configuration.........................................................................................448
10.2 Register Descriptions........................................................................................................450
10.2.1 Timer Control Registers (TCR) ...........................................................................450
10.2.2 Timer Mode Registers (TMDR) ..........................................................................455
10.2.3 Timer I/O Control Registers (TIOR)....................................................................457
10.2.4 Timer Interrupt Enable Registers (TIER) ............................................................470
10.2.5 Timer Status Registers (TSR)..............................................................................472
10.2.6 Timer Counters (TCNT) ......................................................................................476
10.2.7 Timer General Registers (TGR)...........................................................................477
10.2.8 Timer Start Register (TSTR)................................................................................478
10.2.9 Timer Synchro Register (TSYR) .........................................................................479
10.2.10 Module Stop Control Register (MSTPCR)..........................................................480
10.3 Interface to Bus Master.....................................................................................................481
10.3.1 16-Bit Registers ...................................................................................................481
10.3.2 8-Bit Registers .....................................................................................................481
10.4 Operation...........................................................................................................................483
10.4.1 Overview..............................................................................................................483
10.4.2 Basic Functions....................................................................................................484
10.4.3 Synchronous Operation........................................................................................490
10.4.4 Buffer Operation..................................................................................................492
10.4.5 Cascaded Operation.............................................................................................496
10.4.6 PWM Modes........................................................................................................498
10.4.7 Phase Counting Mode..........................................................................................504
10.5 Interrupts...........................................................................................................................510
10.5.1 Interrupt Sources and Priorities............................................................................510
10.5.2 DTC/DMAC Activation.......................................................................................512
10.5.3 A/D Converter Activation....................................................................................512
10.6 Operation Timing..............................................................................................................513
10.6.1 Input/Output Timing............................................................................................513
10.6.2 Interrupt Signal Timing........................................................................................517
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10.7 Usage Notes ......................................................................................................................521
Section 11 Programmable Pulse Generator (PPG)............................................531
11.1 Overview...........................................................................................................................531
11.1.1 Features................................................................................................................531
11.1.2 Block Diagram.....................................................................................................532
11.1.3 Pin Configuration.................................................................................................533
11.1.4 Registers...............................................................................................................534
11.2 Register Descriptions........................................................................................................535
11.2.1 Next Data Enable Registers H and L (NDERH, NDERL)...................................535
11.2.2 Output Data Registers H and L (PODRH, PODRL)............................................536
11.2.3 Next Data Registers H and L (NDRH, NDRL)....................................................537
11.2.4 Notes on NDR Access .........................................................................................537
11.2.5 PPG Output Control Register (PCR)....................................................................539
11.2.6 PPG Output Mode Register (PMR)......................................................................541
11.2.7 Port 1 Data Direction Register (P1DDR).............................................................543
11.2.8 Port 2 Data Direction Register (P2DDR).............................................................544
11.2.9 Module Stop Control Register (MSTPCR)..........................................................544
11.3 Operation...........................................................................................................................545
11.3.1 Overview..............................................................................................................545
11.3.2 Output Timing......................................................................................................546
11.3.3 Normal Pulse Output............................................................................................547
11.3.4 Non-Overlapping Pulse Output............................................................................549
11.3.5 Inverted Pulse Output ..........................................................................................552
11.3.6 Pulse Output Triggered by Input Capture............................................................553
11.4 Usage Notes ......................................................................................................................554
11.4.1 Operation of Pulse Output Pins............................................................................554
11.4.2 Note on Non-Overlapping Output........................................................................554
Section 12 8-Bit Timers.....................................................................................557
12.1 Overview...........................................................................................................................557
12.1.1 Features................................................................................................................557
12.1.2 Block Diagram.....................................................................................................558
12.1.3 Pin Configuration.................................................................................................559
12.1.4 Register Configuration.........................................................................................559
12.2 Register Descriptions........................................................................................................560
12.2.1 Timer Counters 0 and 1 (TCNT0, TCNT1).........................................................560
12.2.2 Time Constant Registers A0 and A1 (TCORA0, TCORA1)...............................560
12.2.3 Time Constant Registers B0 and B1 (TCORB0, TCORB1)................................561
12.2.4 Time Control Registers 0 and 1 (TCR0, TCR1) ..................................................561
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12.2.5 Timer Control/Status Registers 0 and 1 (TCSR0, TCSR1)..................................563
12.2.6 Module Stop Control Register (MSTPCR)..........................................................566
12.3 Operation...........................................................................................................................567
12.3.1 TCNT Incrementation Timing.............................................................................567
12.3.2 Compare Match Timing.......................................................................................568
12.3.3 Timing of TCNT External Reset..........................................................................570
12.3.4 Timing of Overflow Flag (OVF) Setting .............................................................570
12.3.5 Operation with Cascaded Connection..................................................................571
12.4 Interrupts...........................................................................................................................572
12.4.1 Interrupt Sources and DTC Activation ................................................................572
12.4.2 A/D Converter Activation....................................................................................572
12.5 Sample Application...........................................................................................................573
12.6 Usage Notes ......................................................................................................................574
12.6.1 Contention between TCNT Write and Clear........................................................574
12.6.2 Contention between TCNT Write and Increment................................................575
12.6.3 Contention between TCOR Write and Compare Match ......................................576
12.6.4 Contention between Compare Matches A and B.................................................577
12.6.5 Switching of Internal Clocks and TCNT Operation.............................................577
12.6.6 Interrupts and Module Stop Mode.......................................................................579
Section 13 Watchdog Timer ..............................................................................581
13.1 Overview...........................................................................................................................581
13.1.1 Features................................................................................................................581
13.1.2 Block Diagram.....................................................................................................582
13.1.3 Pin Configuration.................................................................................................583
13.1.4 Register Configuration.........................................................................................583
13.2 Register Descriptions........................................................................................................584
13.2.1 Timer Counter (TCNT)........................................................................................584
13.2.2 Timer Control/Status Register (TCSR)................................................................585
13.2.3 Reset Control/Status Register (RSTCSR)............................................................587
13.2.4 Notes on Register Access.....................................................................................588
13.3 Operation...........................................................................................................................589
13.3.1 Operation in Watchdog Timer Mode...................................................................589
13.3.2 Operation in Interval Ti mer Mode.......................................................................591
13.3.3 Timing of Overflow Flag (OVF) Setting .............................................................592
13.3.4 Timing of Watchdog Timer Overflow Flag (WOVF) Setting..............................593
13.4 Interrupts...........................................................................................................................594
13.5 Usage Notes......................................................................................................................594
13.5.1 Contention between Timer Counter (TCNT) Write and Increment.....................594
13.5.2 Changing Value of CKS2 to CKS0......................................................................595
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13.5.3 Switching between Watchdog Timer Mode and Interval Timer Mode................595
13.5.4 System Reset by WDTOVF Signal......................................................................595
13.5.5 Internal Reset in Watchdog Timer Mode.............................................................596
Section 14 Serial Communication Interface (SCI)............................................597
14.1 Overview...........................................................................................................................597
14.1.1 Features................................................................................................................597
14.1.2 Block Diagram.....................................................................................................599
14.1.3 Pin Configuration.................................................................................................600
14.1.4 Register Configuration.........................................................................................601
14.2 Register Descriptions........................................................................................................602
14.2.1 Receive Shift Register (RSR) ..............................................................................602
14.2.2 Receive Data Register (RDR)..............................................................................602
14.2.3 Transmit Shift Register (TSR).............................................................................603
14.2.4 Transmit Data Register (TDR).............................................................................603
14.2.5 Serial Mode Register (SMR)................................................................................604
14.2.6 Serial Control Register (SCR)..............................................................................607
14.2.7 Serial Status Register (SSR) ................................................................................611
14.2.8 Bit Rate Register (BRR) ......................................................................................615
14.2.9 Smart Card Mode Register (SCMR)....................................................................623
14.2.10 Module Stop Control Register (MSTPCR)..........................................................625
14.3 Operation...........................................................................................................................626
14.3.1 Overview..............................................................................................................626
14.3.2 Operation in Asynchronous Mode.......................................................................628
14.3.3 Multiprocessor Communication Function............................................................639
14.3.4 Operation in Synchronous Mode .........................................................................647
14.4 SCI Interrupts....................................................................................................................656
14.5 Usage Notes ......................................................................................................................658
Section 15 Smart Card Interface........................................................................667
15.1 Overview...........................................................................................................................667
15.1.1 Features................................................................................................................667
15.1.2 Block Diagram.....................................................................................................668
15.1.3 Pin Configuration.................................................................................................669
15.1.4 Register Configuration.........................................................................................670
15.2 Register Descriptions........................................................................................................671
15.2.1 Smart Card Mode Register (SCMR)....................................................................671
15.2.2 Serial Status Register (SSR) ................................................................................673
15.2.3 Serial Mode Register (SMR)................................................................................675
15.2.4 Serial Control Register (SCR)..............................................................................677
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15.3 Operation...........................................................................................................................678
15.3.1 Overview..............................................................................................................678
15.3.2 Pin Connections...................................................................................................678
15.3.3 Data Format .........................................................................................................680
15.3.4 Register Settings..................................................................................................682
15.3.5 Clock....................................................................................................................684
15.3.6 Data Transfer Operations.....................................................................................686
15.3.7 Operation in GSM Mode .....................................................................................694
15.3.8 Operation in Block Transfer Mode......................................................................695
15.4 Usage Notes ......................................................................................................................696
Section 16 A/D Converter (8 Analog Input Channel Version)..........................701
16.1 Overview...........................................................................................................................701
16.1.1 Features................................................................................................................701
16.1.2 Block Diagram.....................................................................................................702
16.1.3 Pin Configuration.................................................................................................703
16.1.4 Register Configuration.........................................................................................704
16.2 Register Descriptions........................................................................................................705
16.2.1 A/D Data Registers A to D (ADDRA to ADDRD) .............................................705
16.2.2 A/D Control/Status Register (ADCSR) ...............................................................706
16.2.3 A/D Control Register (ADCR) ............................................................................708
16.2.4 Module Stop Control Register (MSTPCR)..........................................................709
16.3 Interface to Bus Master.....................................................................................................710
16.4 Operation...........................................................................................................................711
16.4.1 Single Mode (SCAN = 0) ....................................................................................711
16.4.2 Scan Mode (SCAN = 1).......................................................................................713
16.4.3 Input Sampling and A/D Conversion Time..........................................................715
16.4.4 External Trigger Input Timing.............................................................................716
16.5 Interrupts...........................................................................................................................717
16.6 Usage Notes ......................................................................................................................718
Section 17 D/A Converter..................................................................................723
17.1 Overview...........................................................................................................................723
17.1.1 Features................................................................................................................723
17.1.2 Block Diagram.....................................................................................................724
17.1.3 Pin Configuration.................................................................................................725
17.1.4 Register Configuration.........................................................................................725
17.2 Register Descriptions........................................................................................................726
17.2.1 D/A Data Registers 0, 1 (DADR0, DADR1).......................................................726
17.2.2 D/A Control Registers 01 (DACR01)..................................................................726
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17.2.3 Module Stop Control Register (MSTPCR)..........................................................728
17.3 Operation...........................................................................................................................728
Section 18 RAM................................................................................................731
18.1 Overview...........................................................................................................................731
18.1.1 Block Diagram.....................................................................................................731
18.1.2 Register Configuration.........................................................................................732
18.2 Register Descriptions........................................................................................................732
18.2.1 System Control Register (SYSCR)......................................................................732
18.3 Operation...........................................................................................................................733
18.4 Usage Note........................................................................................................................733
Section 19 ROM................................................................................................735
19.1 Overview...........................................................................................................................735
19.1.1 Block Diagram.....................................................................................................735
19.1.2 Register Configuration.........................................................................................736
19.2 Register Descriptions........................................................................................................736
19.2.1 Mode Control Register (MDCR) .........................................................................736
19.2.2 Bus Control Register L (BCRL) ..........................................................................737
19.3 Operation...........................................................................................................................737
19.4 Overview of Flash Memory (H8S/2329B F-ZTAT).........................................................740
19.4.1 Features................................................................................................................740
19.4.2 Overview..............................................................................................................741
19.4.3 Flash Memory Operating Modes .........................................................................742
19.4.4 On-Board Programming Modes...........................................................................743
19.4.5 Flash Memory Emulation in RAM ......................................................................745
19.4.6 Differences between Boot Mode and User Program Mode .................................746
19.4.7 Block Configuration.............................................................................................747
19.4.8 Pin Configuration.................................................................................................748
19.4.9 Register Configuration.........................................................................................749
19.5 Register Descriptions........................................................................................................750
19.5.1 Flash Memory Control Register 1 (FLMCR1).....................................................750
19.5.2 Flash Memory Control Register 2 (FLMCR2).....................................................753
19.5.3 Erase Block Register 1 (EBR1) ...........................................................................754
19.5.4 Erase Block Registers 2 (EBR2)..........................................................................754
19.5.5 System Control Register 2 (SYSCR2).................................................................755
19.5.6 RAM Emulation Register (RAMER)...................................................................756
19.6 On-Board Program m ing Modes........................................................................................758
19.6.1 Boot Mode ...........................................................................................................759
19.6.2 User Program Mode.............................................................................................763
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19.7 Programming/Erasing Flash Memory...............................................................................765
19.7.1 Program Mode .....................................................................................................765
19.7.2 Program-Verify Mode..........................................................................................766
19.7.3 Erase Mode..........................................................................................................768
19.7.4 Erase-Verify Mode...............................................................................................768
19.8 Flash Memory Protection..................................................................................................770
19.8.1 Hardware Protection ............................................................................................770
19.8.2 Software Protection..............................................................................................770
19.8.3 Error Protection....................................................................................................771
19.9 Flash Memory Emulation in RAM ...................................................................................773
19.9.1 Emulation in RAM...............................................................................................773
19.9.2 RAM Overlap ......................................................................................................774
19.10 Interrupt Handling when Programming/Erasing Flash Memory.......................................775
19.11 Flash Memory PROM Mode .............................................................................................776
19.11.1 PROM Mode Setting............................................................................................776
19.11.2 Socket Adapters and Memory Map......................................................................776
19.11.3 PROM Mode Operation.......................................................................................778
19.11.4 Memory Read Mode............................................................................................779
19.11.5 Auto-Program Mode............................................................................................783
19.11.6 Auto-Erase Mode.................................................................................................785
19.11.7 Status Read Mode................................................................................................786
19.11.8 Status Polling.......................................................................................................788
19.11.9 PROM Mode Transition Time.............................................................................788
19.11.10 Notes on Memory Programming........................................................................789
19.12 Flash Memory Programming and Erasing Precautions.....................................................789
19.13 Overview of Flash Memory (H8S/2328B F-ZTAT).........................................................791
19.13.1 Features................................................................................................................791
19.13.2 Overview..............................................................................................................792
19.13.3 Flash Memory Operating Modes .........................................................................793
19.13.4 On- Board Prog ramming Modes...........................................................................794
19.13.5 Flash Memory Emulation in RAM ......................................................................796
19.13.6 Differences between Boot Mode and User Program Mode .................................797
19.13.7 Block Configuration.............................................................................................798
19.13.8 Pin Configuration.................................................................................................799
19.13.9 Register Configuration.........................................................................................800
19.14 Register Descriptions........................................................................................................801
19.14.1 Flash Memory Control Register 1 (FLMCR1) .....................................................801
19.14.2 Flash Memory Control Register 2 (FLMCR2) .....................................................804
19.14.3 Erase Block Register 1 (EBR1) ...........................................................................805
19.14.4 Erase Block Registers 2 (EBR2)..........................................................................805
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19.14.5 System Control Register 2 (SYSCR2).................................................................806
19.14.6 RAM Emulation Register (RAMER)...................................................................807
19.15 On-Board Program m ing Modes........................................................................................809
19.15.1 Boot Mode ...........................................................................................................809
19.15.2 User Program Mode.............................................................................................815
19.16 Programming/Erasing Flash Memory...............................................................................817
19.16.1 Program Mode .....................................................................................................817
19.16.2 Program-Verify Mode..........................................................................................818
19.16.3 Erase Mode..........................................................................................................820
19.16.4 Erase-Verify Mode...............................................................................................820
19.17 Flash Memory Protection..................................................................................................822
19.17.1 Hardware Protection ............................................................................................822
19.17.2 Software Protection..............................................................................................822
19.17.3 Error Protection....................................................................................................823
19.18 Flash Memory Emulation in RAM ...................................................................................825
19.18.1 Emulation in RAM...............................................................................................825
19.18.2 RAM Overlap ......................................................................................................826
19.19 Interrupt Handling when Programming/Erasing Flash Memory.......................................827
19.20 Flash Memory PROM Mode .............................................................................................828
19.20.1 PROM Mode Setting............................................................................................828
19.20.2 Socket Adapters and Memory Map......................................................................829
19.20.3 PROM Mode Operation.......................................................................................831
19.20.4 Memory Read Mode............................................................................................832
19.20.5 Auto-Program Mode............................................................................................836
19.20.6 Auto-Erase Mode.................................................................................................838
19.20.7 Status Read Mode................................................................................................840
19.20.8 Status Polling.......................................................................................................841
19.20.9 PROM Mode Transition Time.............................................................................842
19.20.10 Notes on Memory Programming........................................................................843
19.21 Flash Memory Programming and Erasing Precautions.....................................................843
19.22 Overview of Flash Memory (H8S/2326 F-ZTAT)............................................................849
19.22.1 Features................................................................................................................849
19.22.2 Overview..............................................................................................................850
19.22.3 Flash Memory Operating Modes .........................................................................851
19.22.4 On- Board Prog ramming Modes...........................................................................852
19.22.5 Flash Memory Emulation in RAM ......................................................................854
19.22.6 Differences between Boot Mode and User Program Mode .................................855
19.22.7 Block Configuration.............................................................................................856
19.22.8 Pin Configuration.................................................................................................857
19.22.9 Register Configuration.........................................................................................858
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19.23 Register Descriptions........................................................................................................859
19.23.1 Flash Memory Control Register 1 (FLMCR1) .....................................................859
19.23.2 Flash Memory Control Register 2 (FLMCR2) .....................................................862
19.23.3 Erase Block Register 1 (EBR1) ...........................................................................865
19.23.4 Erase Block Registers 2 (EBR2)..........................................................................866
19.23.5 System Control Register 2 (SYSCR2).................................................................867
19.23.6 RAM Emulation Register (RAMER)...................................................................868
19.24 On-Board Program m ing Modes........................................................................................870
19.24.1 Boot Mode ...........................................................................................................870
19.24.2 User Program Mode.............................................................................................876
19.25 Programming/Erasing Flash Memory...............................................................................878
19.25.1 Program Mode (n = 1 for addresses H'000000 to H'03FFFF
and n = 2 for addresses H'040000 to H'07FFFF) .................................................878
19.25.2 Program-Verify Mode (n = 1 for addresses H'000000 to H'03FFFF and
n = 2 for addresses H'040000 to H'07FFFF)........................................................879
19.25.3 Erase Mode (n = 1 for addresses H'000000 to H'03FFFF
and n = 2 for addresses H'040000 to H'07FFFF) .................................................881
19.25.4 Erase-Verify Mode (n = 1 for addresses H'000000 to H'03FFFF and
n = 2 for addresses H'040000 to H'07FFFF)........................................................882
19.26 Flash Memory Protection..................................................................................................884
19.26.1 Hardware Protection ............................................................................................884
19.26.2 Software Protection..............................................................................................884
19.26.3 Error Protection....................................................................................................885
19.27 Flash Memory Emulation in RAM ...................................................................................887
19.27.1 Emulation in RAM...............................................................................................887
19.27.2 RAM Overlap ......................................................................................................888
19.28 Interrupt Handling when Programming/Erasing Flash Memory.......................................889
19.29 Flash Memory PROM Mode .............................................................................................890
19.29.1 PROM Mode Setting............................................................................................890
19.29.2 Socket Adapters and Memory Map......................................................................891
19.29.3 PROM Mode Operation.......................................................................................893
19.29.4 Memory Read Mode............................................................................................894
19.29.5 Auto-Program Mode............................................................................................898
19.29.6 Auto-Erase Mode.................................................................................................900
19.29.7 Status Read Mode................................................................................................902
19.29.8 Status Polling.......................................................................................................904
19.29.9 PROM Mode Transition Time.............................................................................904
19.29.10 Notes on Memory Programming........................................................................905
19.30 Flash Memory Programming and Erasing Precautions.....................................................906
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REJ09B0220-0600
Section 20 Clock Pulse Generator.....................................................................911
20.1 Overview...........................................................................................................................911
20.1.1 Block Diagram.....................................................................................................911
20.1.2 Register Configuration.........................................................................................912
20.2 Register Descriptions........................................................................................................912
20.2.1 System Clock Control Register (SCKCR)...........................................................912
20.3 Oscillator...........................................................................................................................914
20.3.1 Connecting a Crystal Resonator...........................................................................914
20.3.2 External Clock Input............................................................................................916
20.4 Duty Adjustment Circuit...................................................................................................918
20.5 Medium-Speed Clock Divider ..........................................................................................918
20.6 Bus Master Clock Selection Circuit..................................................................................918
Section 21 Power-Down Modes........................................................................919
21.1 Overview...........................................................................................................................919
21.1.1 Register Configuration.........................................................................................920
21.2 Register Descriptions........................................................................................................921
21.2.1 Standby Control Register (SBYCR) ....................................................................921
21.2.2 System Clock Control Register (SCKCR)...........................................................923
21.2.3 Module Stop Control Register (MSTPCR)..........................................................925
21.3 Medium-Speed Mode........................................................................................................925
21.4 Sleep Mode.......................................................................................................................926
21.5 Module Stop Mode............................................................................................................927
21.5.1 Module Stop Mode ..............................................................................................927
21.5.2 Usage Notes.........................................................................................................928
21.6 Software Standby Mode....................................................................................................929
21.6.1 Software Standby Mode .......................................................................................929
21.6.2 Clearing Software Standby Mode........................................................................929
21.6.3 Setting Oscillation Stabilization Time after Clearing Software Standby Mode...9 3 0
21.6.4 Software Standby Mode Application Example....................................................930
21.6.5 Usage Notes.........................................................................................................931
21.7 Hardware Standby Mode ..................................................................................................932
21.7.1 Hardware Standby Mode .....................................................................................932
21.7.2 Hardware Standby Mode Timing.........................................................................932
21.8 φ Clock Output Disabling Function ..................................................................................933
Section 22 Electrical Characteristics.................................................................935
22.1 Electrical Characteristics of Mask ROM Version (H8S/2328, H8S/2327, H8S/2323)
and ROMless Version (H8S/2324S, H8S/2322R, H8S/2321, H8S/2320)........................935
22.1.1 Absolute Maximum Ratings ................................................................................935
Rev.6.00 Sep. 27, 2007 Page xxix of xxx
REJ09B0220-0600
22.1.2 DC Characteristics...............................................................................................936
22.1.3 AC Characteristics...............................................................................................940
22.1.4 A/D Conversion Characteristics...........................................................................964
22.1.5 D/A Conversion Characteristics...........................................................................965
22.2 Electrical Characteristics of F-ZTAT (H8S/2329B F-ZTAT, H8S/2329E F-ZTAT,
H8S/2328B F-ZTAT, H8S/2326 F-ZTAT).......................................................................966
22.2.1 Absolute Maximum Ratings ................................................................................966
22.2.2 DC Characteristics...............................................................................................967
22.2.3 AC Characteristics...............................................................................................970
22.2.4 A/D Conversion Characteristics...........................................................................975
22.2.5 D/A Conversion Characteristics...........................................................................976
22.2.6 Flash Memory Characteristics .............................................................................977
22.3 Usage Note........................................................................................................................978
Appendix A Instruction Set ...............................................................................979
A.1 Instruction List..................................................................................................................979
A.2 Instruction Codes..............................................................................................................1003
A.3 Operation Code Map.........................................................................................................1018
A.4 Number of States Required for Instruction Execution......................................................1022
A.5 Bus States during Instruction Execution...........................................................................1036
A.6 Condition Code Modification ...........................................................................................1050
Appendix B Internal I/O Registers ....................................................................1056
B.1 List of Registers (Address Order).....................................................................................1056
B.2 List of Registers (By Module)...........................................................................................1066
B.3 Functions...........................................................................................................................1077
Appendix C I/O Port Block Diagrams...............................................................1219
C.1 Port 1.................................................................................................................................1219
C.2 Port 2.................................................................................................................................1222
C.3 Port 3.................................................................................................................................1226
C.4 Port 4.................................................................................................................................1229
C.5 Port 5.................................................................................................................................1230
C.6 Port 6.................................................................................................................................1234
C.7 Po rt A................................................................................................................................1240
C.8 Port B................................................................................................................................1243
C.9 Po rt C................................................................................................................................1244
C.10 Port D................................................................................................................................1245
C.11 Port E ................................................................................................................................1246
C.12 Port F.................................................................................................................................1247
Rev.6.00 Sep. 27, 2007 Page xxx of xxx
REJ09B0220-0600
C.13 Port G................................................................................................................................1255
Appendix D Pin States.......................................................................................1259
D.1 Port States in Each Mode..................................................................................................1259
Appendix E Product Lineup..............................................................................1266
Appendix F Package Dimensions......................................................................1267
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 1 of 1268
REJ09B0220-0600
Section 1 Overview
1.1 Overview
The H8S/2329 Group and H8S/2328 Group are series of microcomputers (MCUs: microcomputer
units), built around the H8S/2000 CPU, employing Renesas’ proprietary architecture, and
equipped with supporting functions on-chip.
The H8S/2000 CPU has an internal 32-bit architecture, is provided with sixteen 16-bit general
registers and a concise, optimized instruction set designed for high-speed operation, and can
address a 16-Mbyte linear address space. The instruction set is upward-compatible with H8/300
and H8/300H CPU instructions at the object-code level, facilitating migration from the H8/300,
H8/300L, or H8/300H Series.
On-chip supporting functions required for system configuration include DMA controller
(DMAC)*1 and data transfer controller (DTC) bus masters, ROM and RAM, a 16-bit timer-pulse
unit (TPU), programmable pulse generator (PPG), 8-bit timer, watchdog timer (WDT), serial
communication interface (SCI), A/D converter, D/A converter, and I/O ports.
A high-functionality bus controller is also provided, enabling fast and easy connection of DRAM
and other kinds of memory.
Singl e -p ower -s up p l y flas h memor y (F - ZTAT ™ *2) and mask ROM versions are available,
providing a quick and flexible response to conditions from ramp-up through full-scale volume
production, even for applications with frequently changing specifications. ROM is connected to
the CPU via a 16-bit data bus, enabling both byte and word data to be accessed in one state.
Instruction fetching is thus speeded up, and processing speed increased.
The features of the H8S/2329 Group is shown in table 1.1.
Notes: 1. The DMAC is not supported in the H8S/2321.
2. F-ZTAT is a trademark of Renesas Technology Corp.
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 2 of 1268
REJ09B0220-0600
Table 1.1 Overview
Item Specification
CPU • General-register machine
⎯ Sixteen 16-bit general registers (also usable as sixteen 8-bit registers
or eight 32-bit registers)
• High-speed operation suitable for realtime control
⎯ Maximum clock rate: 25 MHz
⎯ High-speed arithmetic operations
8/16/32-bit register-register add/subtract: 40 ns (at 25-MHz operation)
16 × 16-bit register-register multiply: 800 ns (at 25-MHz operation)
32 ÷ 16-bit register-register divide: 800 ns (at 25-MHz operation)
• Instruction set suitable for high-speed operation
⎯ Sixty- five basic inst ructi ons
⎯ 8/16/32-bit move/arithmetic and logic instructions
⎯ Unsigned/ signed multiply and divide instr uctions
⎯ Powerful bit-manipulation instructions
• CPU operating mode
⎯ Advanced mode: 16-Mbyte address space
Bus controller • Address space divided into 8 areas, with bus specifications settable
independently for each area
• Chip select output possible for each area
• Choice of 8-bit or 16-bit access space for each area
• 2-state or 3-state access space can be designated for each area
• Number of program wait states can be set for each area
• Burst ROM directly connectable
• Maximum 8-Mbyte DRAM* directly connectable (or use of interval timer
possible)
• Extern al bus release function
DMA controller*
(DMAC) • Choice of short address mode or full address mode
• 4 channels in short address mode
• 2 channels in full address mode
• Transfer possible in repeat mode, block transfer mode, etc.
• Single address mode transfer possible
• Can be activated by internal in terrupt
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 3 of 1268
REJ09B0220-0600
Item Specification
Data transfer
controller (DTC) • Can be activated by internal in terrupt or softw are
• Multiple transfers or multiple types of transfer possible for one activation
source
• Transfer possible in repeat mode, block transfer mode, etc.
• Request can be sent to CPU for interrupt that activated DTC
16-bit timer-pulse
unit (TPU) • 6-channel 16-bit timer
• Pulse I/O processing capability for up to 16 pins
• Automatic 2-phase encoder count capability
Programmable
pulse generator
(PPG)
• Maximum 16-bit pulse output possible with TPU as time base
• Output trigger selectable in 4-bit groups
• Non-overlap margin can be set
• Direct output or inverse output setting possible
8-bit timer,
2 channels • 8-bit up-counter (external event count capability)
• Two time constant registers
• Two-channel connection possible
Watchdog timer
(WDT) • Watchdog timer or interval timer selectable
Serial
communication
interface (SCI),
3 channels
• Asynchronous mode or synchronous mode selectable
• Multiprocessor communication function
• Smart card interface funct ion
A/D converter • Resolution: 10 bits
• Input: 8 channel
• High-speed conversion: 6.7 µs minimum conversion time
(at 20-MHz operation)
• Single or scan mode selectable
• Sample-and-hold circuit
• A/D conversion can be activated by external trigger or timer trigger
D/A converter • Resolution: 8 bits
• Output: 2 channels
I/O ports • 86 input/output pins, 9 input pins
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 4 of 1268
REJ09B0220-0600
Item Specification
Memory • Flash memory, mask ROM
• High-speed static RAM
Product Code ROM RAM
H8S/2329B, H8S/2329E*1 384 kbytes 32 kbytes
H8S/2328*2, H8S/2328B 256 kbytes 8 kbytes
H8S/2327 128 kbytes 8 kbytes
H8S/2326 512 kbytes 8 kbytes
H8S/2324S — 32 kbytes
H8S/2323 32 kbytes 8 kbytes
H8S/2322R — 8 kbytes
H8S/2321 — 4 kbytes
H8S/2320 — 4 kbytes
Notes: 1. The on-chip debug function can be used with the E10A emulator
(E10A compatible version). However, some function modules and
pin functions are unavailable when the on-chip debug function is
in use. Refer to figures 1.7 and 1.8, Pin Arrangement. For
specifications, refer to the item for the H8S/2329B F-ZTAT.
2. Mask ROM version only.
Interrupt controller • 39 external interrupt pins (NMI, IRQ0 to IRQ7)
• 52 internal interrupt sources
• Eight priority levels settable
Power-down state • Medium-speed mode
• Sleep mode
• Module stop mode
• Software standby mode
• Hardware standby mode
• Variable clock division ratio
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 5 of 1268
REJ09B0220-0600
Item Specification
Operating modes • Eight MCU operating modes (H8S/2328B F-ZTAT, H8S/2326 F-ZTAT)
External Data Bus
Mode
CPU
Operating
Mode
Description On-Chip
ROM Initial
Value Maximum
Value
1 — — — — —
2
3
4 Advanced Disabled 16 bits 16 bits
5
On-chip ROM disabled
expansion mod e 8 bits 16 bits
6 On-chip ROM enabled
expansion mod e Enabled 8 bits 16 bits
7 Single-chip mode — —
8 — — — — —
9
10 Advanced Boot mode Enabled 8 bits 16 bits
11 — —
12 — — — — —
13
14 Advanced User program mode Enabled 8 bits 16 bits
15 — —
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 6 of 1268
REJ09B0220-0600
Item Specification
Operating modes • Four MCU operating modes (ROMless, mask ROM versions, H8S/2329B
F-ZTAT)
External Data Bus
Mode
CPU
Operating
Mode
Description On-Chip
ROM Initial
Value Maximum
Value
1 — — — — —
2
*1
3
*1
4
*2 Advanced On-chip ROM disabled
expansion mod e Disabled 16 bits 16 bits
5
*2 On-chip ROM disabled
expansion mod e Disabled 8 bits 16 bits
6 On-chip ROM enabled
expansion mod e Enabled 8 bits 16 bits
7 Single-chip mode Enabled — —
Notes: 1. Boot mode in the H8S/2329B F-ZTAT. See table 19.9, for
information on H8S/2329B F-ZTAT user boot modes. See table
19.9, for information on H8S/2329B F-ZTAT user program modes.
2. The ROMless versions can use only modes 4 and 5.
Clock pulse
generator • Built-in duty correction circuit
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 7 of 1268
REJ09B0220-0600
Item Specification
Product lineup Condition A Condition B
Operating power supply voltage 2.7 to 3.6 V 3.0 to 3.6 V
Operating frequency 2 to 20 MHz 2 to 25 MHz
Model HD64F2329B —
O
HD64F2329E* — O
HD6432328
O O
HD64F2328B —
O
HD6432327
O O
HD64F2326 —
O
HD6412324S
O O
HD6432323
O O
HD6412322R
O O
HD6412321
O O
HD6412320
O O
O: Products in the current lineup
Note: * The on-chip debug function can be used with the E10A emulator
(E10A compatible version). However, some function modules and pin
functions are unavailable when the on-chip debug function is in use.
Refer to figures 1.7 and 1.8, Pin Arrangement. For specifications, refer
to the item for the H8S/2329B F-ZTAT.
Note: * Not supported in the H8S/2321.
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 8 of 1268
REJ09B0220-0600
1.2 Block Diagram
PE
7
/D
7
PE
6
/D
6
PE
5
/D
5
PE
4
/D
4
PE
3
/D
3
PE
2
/D
2
PE
1
/D
1
PE
0
/D
0
PD
7
/D
15
PD
6
/D
14
PD
5
/D
13
PD
4
/D
12
PD
3
/D
11
PD
2
/D
10
PD
1
/D
9
PD
0
/D
8
Port D
V
CC
V
CC
V
CC
V
CC
V
CC
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
Port
A
PA
7
/A
23
/IRQ
7
PA
6
/A
22
/IRQ
6
PA
5
/A
21
/IRQ
5
PA
4
/A
20
/IRQ
4
PA
3
/A
19
PA
2
/A
18
PA
1
/A
17
PA
0
/A
16
PB
7
/A
15
PB
6
/A
14
PB
5
/A
13
PB
4
/A
12
PB
3
/A
11
PB
2
/A
10
PB
1
/A
9
PB
0
/A
8
PC
7
/A
7
PC
6
/A
6
PC
5
/A5
PC
4
/A
4
PC
3
/A
3
PC
2
/A
2
PC
1
/A
1
PC
0
/A
0
P3
5
/SCK
1
P3
4
/SCK
0
P3
3
/RxD
1
P3
2
/RxD
0
P3
1
/TxD
1
P3
0
/TxD
0
P5
3
/ADTRG/IRQ
7
/WAIT/BREQ
O
P5
2
/SCK
2
/IRQ
6
P5
1
/RxD
2
/IRQ
5
P5
0
/TxD
2
/IRQ
4
P4
7
/AN
7
/DA
1
P4
6
/AN
6
/DA
0
P4
5
/AN
5
P4
4
/AN
4
P4
3
/AN
3
P4
2
/AN
2
P4
1
/AN
1
P4
0
/AN
0
V
ref
AV
CC
AV
SS
P2
7
/PO
7
/TIOCB
5
/TMO
1
P2
6
/PO
6
/TIOCA
5
/TMO
0
P2
5
/PO
5
/TIOCB
4
/TMCI
1
P2
4
/PO
4
/TIOCA
4
/TMRI
1
P2
3
/PO
3
/TIOCD
3
/TMCI
0
P2
2
/PO
2
/TIOCC
3
/TMRI
0
P2
1
/PO
1
/TIOCB
3
P2
0
/PO
0
/TIOCA
3
P1
7
/PO
15
/TIOCB
2
/TCLKD
P1
6
/PO
14
/TIOCA
2
P1
5
/PO
13
/TIOCB
1
/TCLKC
P1
4
/PO
12
/TIOCA
1
P1
3
/PO
11
/TIOCD
0
/TCLKB
P1
2
/PO
10
/TIOCC
0
/TCLKA
P1
1
/PO
9
/TIOCB
0
/DACK
1
P1
0
/PO
8
/TIOCA
0
/DACK
0
P6
7
/CS
7
/IRQ
3
P6
6
/CS
6
/IRQ
2
P6
5
/IRQ
1
P6
4
/IRQ
0
P6
3
/TEND
1
P6
2
/DREQ
1
P6
1
/TEND
0
/CS
5
P6
0
/DREQ
0
/CS
4
PG
4
/CS
0
PG
3
/CS
1
PG
2
/CS
2
PG
1
/CS
3
PG
0
/CAS
PF
7
/φ
PF
6
/AS
PF
5
/RD
PF
4
/HWR
PF
3
/LWR
PF
2
/LCAS/WAIT /BREQO
PF
1
/BACK
PF
0
/BREQ
Notes: 1.
2.
The FWE pin applies to the H8S/2328B F-ZTAT and H8S/2326 F-ZTAT only.
The EMLE pin applies to the H8S/2329B F-ZTAT only.
The WDTOVF pin function is not available in the F-ZTAT versions.
ROM is not supported in the ROMless versions.
Clock pulse
generator
ROM*
2
RAM WDT
TPU SCI
PPG
MD
2
MD
1
MD
0
EXTAL
XTAL
STBY
RES
WDTOVF (FWE, EMLE)*
1
NMI
Bus controller
H8S/2000 CPU
DTC
Interrupt controller
Port E
DMAC
Internal data bus
Internal address bus
Port
B
Port
C
Port
3
Port
5
Port 4Port 2Port 1
Port
6
Port
G
Port
F
Peripheral data bus
Peripheral address bus
8-bit timer
D/A converter
A/D converter
Figure 1.1 Mask ROM Versions, F-ZTAT Versions, H8S/2324S, H8S/2322R, H8S/2320
Internal Block Diagram
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 9 of 1268
REJ09B0220-0600
PE
7
/D
7
PE
6
/D
6
PE
5
/D
5
PE
4
/D
4
PE
3
/D
3
PE
2
/D
2
PE
1
/D
1
PE
0
/D
0
PD
7
/D
15
PD
6
/D
14
PD
5
/D
13
PD
4
/D
12
PD
3
/D
11
PD
2
/D
10
PD
1
/D
9
PD
0
/D
8
Port D
V
CC
V
CC
V
CC
V
CC
V
CC
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
Port
A
PA
7
/A
23
/IRQ
7
PA
6
/A
22
/IRQ
6
PA
5
/A
21
/IRQ
5
PA
4
/A
20
/IRQ
4
PA
3
/A
19
PA
2
/A
18
PA
1
/A
17
PA
0
/A
16
PB
7
/A
15
PB
6
/A
14
PB
5
/A
13
PB
4
/A
12
PB
3
/A
11
PB
2
/A
10
PB
1
/A
9
PB
0
/A
8
PC
7
/A
7
PC
6
/A
6
PC
5
/A5
PC
4
/A
4
PC
3
/A
3
PC
2
/A
2
PC
1
/A
1
PC
0
/A
0
P3
5
/SCK
1
P3
4
/SCK
0
P3
3
/RxD
1
P3
2
/RxD
0
P3
1
/TxD
1
P3
0
/TxD
0
P5
3
/ADTRG/IRQ
7
/WAIT/BREQ
O
P5
2
/SCK
2
/IRQ
6
P5
1
/RxD
2
/IRQ
5
P5
0
/TxD
2
/IRQ
4
P4
7
/AN
7
/DA
1
P4
6
/AN
6
/DA
0
P4
5
/AN
5
P4
4
/AN
4
P4
3
/AN
3
P4
2
/AN
2
P4
1
/AN
1
P4
0
/AN
0
V
ref
AV
CC
AV
SS
P2
7
/PO
7
/TIOCB
5
/TMO
1
P2
6
/PO
6
/TIOCA
5
/TMO
0
P2
5
/PO
5
/TIOCB
4
/TMCI
1
P2
4
/PO
4
/TIOCA
4
/TMRI
1
P2
3
/PO
3
/TIOCD
3
/TMCI
0
P2
2
/PO
2
/TIOCC
3
/TMRI
0
P2
1
/PO
1
/TIOCB
3
P2
0
/PO
0
/TIOCA
3
P1
7
/PO
15
/TIOCB
2
/TCLKD
P1
6
/PO
14
/TIOCA
2
P1
5
/PO
13
/TIOCB
1
/TCLKC
P1
4
/PO
12
/TIOCA
1
P1
3
/PO
11
/TIOCD
0
/TCLKB
P1
2
/PO
10
/TIOCC
0
/TCLKA
P1
1
/PO
9
/TIOCB
0
P1
0
/PO
8
/TIOCA
0
P6
7
/CS
7
/IRQ
3
P6
6
/CS
6
/IRQ
2
P6
5
/IRQ
1
P6
4
/IRQ
0
P6
3
P6
2
P6
1
/CS
5
P6
0
/CS
4
PG
4
/CS
0
PG
3
/CS
1
PG
2
/CS
2
PG
1
/CS
3
PG
0
PF
7
/φ
PF
6
/AS
PF
5
/RD
PF
4
/HWR
PF
3
/LWR
PF
2
/WAIT/BREQO
PF
1
/BACK
PF
0
/BREQ
Clock pulse
generator
RAM WDT
TPU SCI
PPG
MD
2
MD
1
MD
0
EXTAL
XTAL
STBY
RES
WDTOVF
NMI
Bus controller
H8S/2000 CPU
DTC
Interrupt controller
Port E
Internal data bus
Internal address bus
Port
B
Port
C
Port
3
Port
5
Port 4Port 2Port 1
Port
6
Port
G
Port
F
Peripheral data bus
Peripheral address bus
8-bit timer
D/A converter
A/D converter
Figure 1.2 H8S/2321 Internal Block Diagram
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 10 of 1268
REJ09B0220-0600
1.3 Pin Description
1.3.1 Pin Arrangement
VCC
PC0/A0
PC1/A1
PC2/A2
PC3/A3
VSS
PC4/A4
PC5/A5
PC6/A6
PC7/A7
PB0/A8
PB1/A9
PB2/A10
PB3/A11
VSS
PB4/A12
PB5/A13
PB6/A14
PB7/A15
PA0/A16
PA1 /A17
PA2/A18
PA3/A19
VSS
PA4/A20/IRQ4
PA5/A21/IRQ5
PA6/A22/IRQ6
PA7/A23/IRQ7
P67/CS7/IRQ3
P66/CS6/IRQ2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
P51/RxD2/IRQ5
P50/TxD2/IRQ4
PF0/BREQ
PF1/BACK
PF2/LCAS/WAIT/BREQ
O
PF3/LWR
PF4/HWR
PF5/RD
PF6/AS
VCC
PF7/
φ
VSS
EXTAL
XTAL
VCC
STBY
NMI
RES
WDTOVF (FWE)*
P20/PO0/TIOCA3
P21/PO1/TIOCB3
P22/PO2/TIOCC3/TMRI0
P23/PO3/TIOCD3/TMCI0
P24/PO4/TIOCA4/TMRI1
P25/PO5/TIOCB4/TMCI1
P26/PO6/TIOCA5/TMO0
P27/PO7/TIOCB5/TMO1
P63/TEND1
P62/DREQ1
P61/TEND0/CS5
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
P60/DREQ0/CS4
VSS
P35/SCK1
P34/SCK0
P33/RxD1
P32/RxD0
P31/TxD1
P30/TxD0
VCC
PD7/D15
PD6/D14
PD5/D13
PD4/D12
VSS
PD3/D11
PD2/D10
PD1/D9
PD0/D8
PE7/D7
PE6/D6
PE5/D5
PE4/D4
VSS
PE3/D3
PE2/D2
PE1/D1
PE0/D0
VCC
P64/IRQ0
P65/IRQ1
P52/SCK2/IRQ6
P53/ADTRG/IRQ7/WAIT/BREQO
AVCC
Vref
P40/AN0
P41/AN1
P42/AN2
P43/AN3
P44/AN4
P45/AN5
P46/DA0/AN6
P47/DA1/AN7
AVSS
VSS
P17/PO15/TIOCB2/TCLKD
P16/PO14/TIOCA2
P15/PO13/TIOCB1/TCLKC
P14/PO12/TIOCA1
P13/PO11/TIOCD0/TCLKB
P12/PO10/TIOCC0/TCLKA
P11/PO9/TIOCB0/DACK1
P10/PO8/TIOCA0/DACK0
MD0
MD1
MD2
PG0/CAS
PG1/CS3
PG2/CS2
PG3/CS1
PG4/CS0
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
Note: * The FWE pin applies to the H8S/2328B F-ZTAT and H8S/2326 F-ZTAT only.
The WDTOVF pin function is not available in the F-ZTAT versions.
Figure 1.3 Mask ROM Versions, F-ZTAT Versions, H8S/2324S, H8S/2322R, H8S/2320 Pin
Arrangement (TFP-120: Top View)
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 11 of 1268
REJ09B0220-0600
PG3/CS1
PG4/CS0
VSS
VSSNC
VCC
PC0/A0
PC1/A1
PC2/A2
PC3/A3
VSS
PC4/A4
PC5/A5
PC6/A6
PC7/A7
PB0/A8
PB1/A9
PB2/A10
PB3/A11
VSS
PB4/A12
PB5/A13
PB6/A14
PB7/A15
PA0/A16
PA1/A17
PA2/A18
PA3/A19
VSS
PA4/A20/IRQ4
PA5/A21/IRQ5
PA6/A22/IRQ6
PA7/A23/IRQ7
P67/CS7/IRQ3
P66/CS6/IRQ2
VSS
VSS
P65/IRQ1
P64/IRQ0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
P53/ADTRG/IRQ7/WAIT/BREQ
O
P52/SCK2/IRQ6
VSS
VSS
P51/RxD2/IRQ5
P50/TxD2/IRQ4
PF0/BREQ
PF1/BACK
PF2/LCAS/WAIT/BREQO
PF3/LWR
PF4/HWR
PF5/RD
PF6/AS
VCC
PF7/
φ
VSS
EXTAL
XTAL
VCC
STBY
NMI
RES
WDTOVF (FWE)*
P20/PO0/TIOCA3
P21/PO1/TIOCB3
P22/PO2/TIOCC3/TMRI0
P23/PO3/TIOCD3/TMCI0
P24/PO4/TIOCA4/TMRI1
P25/PO5/TIOCB4/TMCI1
P26/PO6/TIOCA5/TMO0
P27/PO7/TIOCB5/TMO1
P63/TEND1
P62/DREQ1
P61/TEND0/CS5
VSS
VSS
P60/DREQ0/CS4
VSS
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
P35/SCK1
P34/SCK0
P33/RxD1
P32/RxD0
P31/TxD1
P30/TxD0
VCC
PD7/D15
PD6/D14
PD5/D13
PD4/D12
VSS
PD3/D11
PD2/D10
PD1/D9
PD0/D8
PE7/D7
PE6/D6
PE5/D5
PE4/D4
VSS
PE3/D3
PE2/D2
PE1/D1
PE0/D0
VCC
AVCC
Vref
P40/AN0
P41/AN1
P42/AN2
P43/AN3
P44/AN4
P45/AN5
P46/AN6/DA0
P47/AN7/DA1
AVSS
VSS
P17/PO15/TIOCB2/TCLKD
P16/PO14/TIOCA2
P15/PO13/TIOCB1/TCLKC
P14/PO12/TIOCA1
P13/PO11/TIOCD0/TCLKB
P12/PO10/TIOCC0/TCLKA
P11/PO9/TIOCB0/DACK1
P10/PO8/TIOCA0/DACK0
MD0
MD1
MD2
PG0/CAS
PG1/CS3
PG2/CS2
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
Note: * The FWE pin applies to the H8S/2328B F-ZTAT and H8S/2326 F-ZTAT only.
The WDTOVF pin function is not available in the F-ZTAT versions.
Figure 1.4 Mask ROM Versions, F-ZTAT Versions, H8S/2324S, H8S/2322R, H8S/2320 Pin
Arrangement (FP-128B: Top View)
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 12 of 1268
REJ09B0220-0600
VCC
PC0/A0
PC1/A1
PC2/A2
PC3/A3
VSS
PC4/A4
PC5/A5
PC6/A6
PC7/A7
PB0/A8
PB1/A9
PB2/A10
PB3/A11
VSS
PB4/A12
PB5/A13
PB6/A14
PB7/A15
PA0/A16
PA1 /A17
PA2/A18
PA3/A19
VSS
PA4/A20/IRQ4
PA5/A21/IRQ5
PA6/A22/IRQ6
PA7/A23/IRQ7
P67/CS7/IRQ3
P66/CS6/IRQ2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
P51/RxD2/IRQ5
P50/TxD2/IRQ4
PF0/BREQ
PF1/BACK
PF2/WAIT/BREQO
PF3/LWR
PF4/HWR
PF5/RD
PF6/AS
VCC
PF7/
φ
VSS
EXTAL
XTAL
VCC
STBY
NMI
RES
WDTOVF
P20/PO0/TIOCA3
P21/PO1/TIOCB3
P22/PO2/TIOCC3/TMRI0
P23/PO3/TIOCD3/TMCI0
P24/PO4/TIOCA4/TMRI1
P25/PO5/TIOCB4/TMCI1
P26/PO6/TIOCA5/TMO0
P27/PO7/TIOCB5/TMO1
P63
P62
P61/CS5
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
P60/CS4
VSS
P35/SCK1
P34/SCK0
P33/RxD1
P32/RxD0
P31/TxD1
P30/TxD0
VCC
PD7/D15
PD6/D14
PD5/D13
PD4/D12
VSS
PD3/D11
PD2/D10
PD1/D9
PD0/D8
PE7/D7
PE6/D6
PE5/D5
PE4/D4
VSS
PE3/D3
PE2/D2
PE1/D1
PE0/D0
VCC
P64/IRQ0
P65/IRQ1
P52/SCK2/IRQ6
P53/ADTRG/IRQ7/WAIT/BREQO
AVCC
Vref
P40/AN0
P41/AN1
P42/AN2
P43/AN3
P44/AN4
P45/AN5
P46/DA0/AN6
P47/DA1/AN7
AVSS
VSS
P17/PO15/TIOCB2/TCLKD
P16/PO14/TIOCA2
P15/PO13/TIOCB1/TCLKC
P14/PO12/TIOCA1
P13/PO11/TIOCD0/TCLKB
P12/PO10/TIOCC0/TCLKA
P11/PO9/TIOCB0
P10/PO8/TIOCA0
MD0
MD1
MD2
PG0
PG1/CS3
PG2/CS2
PG3/CS1
PG4/CS0
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
Figure 1.5 H8S/2321 Pin Arrangement (TFP-120: Top View)
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 13 of 1268
REJ09B0220-0600
PG3/CS1
PG4/CS0
VSS
VSSNC
VCC
PC0/A0
PC1/A1
PC2/A2
PC3/A3
VSS
PC4/A4
PC5/A5
PC6/A6
PC7/A7
PB0/A8
PB1/A9
PB2/A10
PB3/A11
VSS
PB4/A12
PB5/A13
PB6/A14
PB7/A15
PA0/A16
PA1/A17
PA2/A18
PA3/A19
VSS
PA4/A20/IRQ4
PA5/A21/IRQ5
PA6/A22/IRQ6
PA7/A23/IRQ7
P67/CS7/IRQ3
P66/CS6/IRQ2
VSS
VSS
P65/IRQ1
P64/IRQ0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
P53/ADTRG/IRQ7/WAIT/BREQ
O
P52/SCK2/IRQ6
VSS
VSS
P51/RxD2/IRQ5
P50/TxD2/IRQ4
PF0/BREQ
PF1/BACK
PF2/WAIT/BREQO
PF3/LWR
PF4/HWR
PF5/RD
PF6/AS
VCC
PF7/
φ
VSS
EXTAL
XTAL
VCC
STBY
NMI
RES
WDTOVF
P20/PO0/TIOCA3
P21/PO1/TIOCB3
P22/PO2/TIOCC3/TMRI0
P23/PO3/TIOCD3/TMCI0
P24/PO4/TIOCA4/TMRI1
P25/PO5/TIOCB4/TMCI1
P26/PO6/TIOCA5/TMO0
P27/PO7/TIOCB5/TMO1
P63
P62
P61/CS5
VSS
VSS
P60/CS4
VSS
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
P35/SCK1
P34/SCK0
P33/RxD1
P32/RxD0
P31/TxD1
P30/TxD0
VCC
PD7/D15
PD6/D14
PD5/D13
PD4/D12
VSS
PD3/D11
PD2/D10
PD1/D9
PD0/D8
PE7/D7
PE6/D6
PE5/D5
PE4/D4
VSS
PE3/D3
PE2/D2
PE1/D1
PE0/D0
VCC
AVCC
Vref
P40/AN0
P41/AN1
P42/AN2
P43/AN3
P44/AN4
P45/AN5
P46/AN6/DA0
P47/AN7/DA1
AVSS
VSS
P17/PO15/TIOCB2/TCLKD
P16/PO14/TIOCA2
P15/PO13/TIOCB1/TCLKC
P14/PO12/TIOCA1
P13/PO11/TIOCD0/TCLKB
P12/PO10/TIOCC0/TCLKA
P11/PO9/TIOCB0
P10/PO8/TIOCA0
MD0
MD1
MD2
PG0
PG1/CS3
PG2/CS2
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
Figure 1.6 H8S/2321 Pin Arrangement (FP-128B: Top View)
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 14 of 1268
REJ09B0220-0600
V
CC
PC
0
/A
0
PC
1
/A
1
PC
2
/A
2
PC
3
/A
3
V
SS
PC
4
/A
4
PC
5
/A
5
PC
6
/A
6
PC
7
/A
7
PB
0
/A
8
PB
1
/A
9
PB
2
/A
10
PB
3
/A
11
V
SS
PB
4
/A
12
PB
5
/A
13
PB
6
/A
14
PB
7
/A
15
PA
0
/A
16
PA
1
/A
17
PA
2
/A
18
PA
3
/A
19
V
SS
PA
4
/A
20
/IRQ
4
PA
5
/A
21
/IRQ
5
PA
6
/A
22
/IRQ
6
PA
7
/A
23
/IRQ
7
P6
7
/CS
7
/IRQ
3
P6
6
/CS
6
/IRQ
2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
P5
1
/RxD
2
/IRQ
5
P5
0
/TxD
2
/IRQ
4
PF
0
/BREQ
PF
1
/BACK
PF
2
/LCAS/WAIT/BREQ
O
PF
3
/LWR
PF
4
/HWR
PF
5
/RD
PF
6
/AS
V
CC
PF
7
/
φ
V
SS
EXTAL
XTAL
V
CC
STBY
NMI
RES
EMLE
P2
0
/PO
0
/TIOCA
3
P2
1
/PO
1
/TIOCB
3
P2
2
/PO
2
/TIOCC
3
/TMRI
0
P2
3
/PO
3
/TIOCD
3
/TMCI
0
P2
4
/PO
4
/TIOCA
4
/TMRI
1
P2
5
/PO
5
/TIOCB
4
/TMCI
1
P2
6
/PO
6
/TIOCA
5
/TMO
0
P2
7
/PO
7
/TIOCB
5
/TMO
1
P6
3
/TEND
1
P6
2
/DREQ
1
P6
1
/TEND
0
/CS
5
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
P6
0
/DREQ
0
/CS
4
V
SS
P3
5
/SCK
1
P3
4
/SCK
0
P3
3
/RxD
1
P3
2
/RxD
0
P3
1
/TxD
1
P3
0
/TxD
0
V
CC
PD
7
/D
15
PD
6
/D
14
PD
5
/D
13
PD
4
/D
12
V
SS
PD
3
/D
11
PD
2
/D
10
PD
1
/D
9
PD
0
/D
8
PE
7
/D
7
PE
6
/D
6
PE
5
/D
5
PE
4
/D
4
V
SS
PE
3
/D
3
PE
2
/D
2
PE
1
/D
1
PE
0
/D
0
V
CC
P6
4
/IRQ0
P6
5
/IRQ1
P5
2
/SCK
2
/IRQ
6
P5
3
/ADTRG/IRQ
7
/WAIT/BREQO
AV
CC
V
ref
P4
0
/AN
0
P4
1
/AN
1
P4
2
/AN
2
P4
3
/AN
3
P4
4
/AN
4
P4
5
/AN
5
P4
6
/DA
0
/AN
6
P4
7
/DA
1
/AN
7
AV
SS
V
SS
P1
7
/PO
15
/TIOCB
2
/TCLKD
P1
6
/PO
14
/TIOCA
2
P1
5
/PO
13
/TIOCB
1
/TCLKC
P1
4
/PO
12
/TIOCA
1
P1
3
/PO
11
/TIOCD
0
/TCLKB
P1
2
/PO
10
/TIOCC
0
/TCLKA
P1
1
/PO
9
/TIOCB
0
/DACK
1
P1
0
/PO
8
/TIOCA
0
/DACK
0
MD
0
MD
1
MD
2
PG
0
/CAS
PG
1
/CS
3
PG
2
/CS
2
PG
3
/CS
1
PG
4
/CS
0
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
Figure 1.7 HD64F2329B Pin Arrangement (TFP-120: Top View)
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 15 of 1268
REJ09B0220-0600
PG
3
/CS
1
PG
4
/CS
0
V
SS
V
SS
NC
V
CC
PC
0
/A
0
PC
1
/A
1
PC
2
/A
2
PC
3
/A
3
V
SS
PC
4
/A
4
PC
5
/A
5
PC
6
/A
6
PC
7
/A
7
PB
0
/A
8
PB
1
/A
9
PB
2
/A
10
PB
3
/A
11
V
SS
PB
4
/A
12
PB
5
/A
13
PB
6
/A
14
PB
7
/A
15
PA
0
/A
16
PA
1
/A
17
PA
2
/A
18
PA
3
/A
19
V
SS
PA
4
/A
20
/IRQ
4
PA
5
/A
21
/IRQ
5
PA
6
/A
22
/IRQ
6
PA
7
/A
23
/IRQ
7
P6
7
/CS
7
/IRQ
3
P6
6
/CS
6
/IRQ
2
V
SS
V
SS
P6
5
/IRQ
1
P6
4
/IRQ
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
P5
3
/ADTRG/IRQ
7
/WAIT/BREQ
O
P5
2
/SCK
2
/IRQ
6
V
SS
V
SS
P5
1
/RxD
2
/IRQ
5
P5
0
/TxD
2
/IRQ
4
PF
0
/BREQ
PF
1
/BACK
PF
2
/LCAS/WAIT/BREQO
PF
3
/LWR
PF
4
/HWR
PF
5
/RD
PF
6
/AS
V
CC
PF
7
/φ
V
SS
EXTAL
XTAL
V
CC
STBY
NMI
RES
EMLE
P2
0
/PO
0
/TIOCA
3
P2
1
/PO
1
/TIOCB
3
P2
2
/PO
2
/TIOCC
3
/TMRI
0
P2
3
/PO
3
/TIOCD
3
/TMCI
0
P2
4
/PO
4
/TIOCA
4
/TMRI
1
P2
5
/PO
5
/TIOCB
4
/TMCI
1
P2
6
/PO
6
/TIOCA
5
/TMO
0
P2
7
/PO
7
/TIOCB
5
/TMO
1
P6
3
/TEND
1
P6
2
/DREQ
1
P6
1
/TEND
0
/CS
5
V
SS
V
SS
P6
0
/DREQ
0
/CS
4
V
SS
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
P3
5
/SCK
1
P3
4
/SCK
0
P3
3
/RxD
1
P3
2
/RxD
0
P3
1
/TxD
1
P3
0
/TxD
0
V
CC
PD
7
/D
15
PD
6
/D
14
PD
5
/D
13
PD
4
/D
12
V
SS
PD
3
/D
11
PD
2
/D
10
PD
1
/D
9
PD
0
/D
8
PE
7
/D
7
PE
6
/D
6
PE
5
/D
5
PE
4
/D
4
V
SS
PE
3
/D
3
PE
2
/D
2
PE
1
/D
1
PE
0
/D
0
V
CC
AV
CC
V
ref
P4
0
/AN
0
P4
1
/AN
1
P4
2
/AN
2
P4
3
/AN
3
P4
4
/AN
4
P4
5
/AN
5
P4
6
/AN
6
/DA
0
P4
7
/AN
7
/DA
1
AV
SS
V
SS
P1
7
/PO
15
/TIOCB
2
/TCLKD
P1
6
/PO
14
/TIOCA
2
P1
5
/PO
13
/TIOCB
1
/TCLKC
P1
4
/PO
12
/TIOCA
1
P1
3
/PO
11
/TIOCD
0
/TCLKB
P1
2
/PO
10
/TIOCC
0
/TCLKA
P1
1
/PO
9
/TIOCB
0
/DACK
1
P1
0
/PO
8
/TIOCA
0
/DACK
0
MD
0
MD
1
MD
2
PG
0
/CAS
PG
1
/CS
3
PG
2
/CS
2
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
Figure 1.8 HD64F2329B Pin Arrangement (FP-128B: Top View)
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 16 of 1268
REJ09B0220-0600
V
CC
PC
0
/A
0
PC
1
/A
1
PC
2
/A
2
PC
3
/A
3
V
SS
PC
4
/A
4
PC
5
/A
5
PC
6
/A
6
PC
7
/A
7
PB
0
/A
8
PB
1
/A
9
PB
2
/A
10
PB
3
/A
11
V
SS
PB
4
/A
12
PB
5
/A
13
PB
6
/A
14
PB
7
/A
15
PA
0
/A
16
PA
1
/A
17
PA
2
/A
18
PA
3
/A
19
V
SS
PA
4
/A
20
/IRQ
4
PA
5
/A
21
/IRQ
5
PA
6
/A
22
/IRQ
6
PA
7
/A
23
/IRQ
7
P6
7
/CS
7
/IRQ
3
P6
6
/CS
6
/IRQ
2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
P5
1
/RxD
2
/IRQ
5
P5
0
/TxD
2
/IRQ
4
PF
0
/BREQ
PF
1
/BACK
PF
2
/LCAS/WAIT/BREQO
PF
3
/LWR
PF
4
/HWR
PF
5
/RD
PF
6
/AS
V
CC
PF
7
/φ
V
SS
EXTAL
XTAL
V
CC
STBY
NMI
RES
EMLE*
P2
0
/PO
0
/TIOCA
3
P2
1
/PO
1
/TIOCB
3
P2
2
/PO
2
/TIOCC
3
/TMRI
0
P2
3
/PO
3
/TIOCD
3
/TMCI
0
P2
4
/PO
4
/TIOCA
4
/TMRI
1
P2
5
/PO
5
/TIOCB
4
/TMCI
1
P2
6
/PO
6
/TIOCA
5
/TMO
0
P2
7
/PO
7
/TIOCB
5
/TMO
1
P6
3
/TEND
1
/TDO*
P6
2
/DREQ
1
/TDI*
P6
1
/TEND
0
/CS
5
/TCK*
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
P6
0
/DREQ
0
/CS
4
/TMS*
V
SS
P3
5
/SCK
1
P3
4
/SCK
0
*/TRST*
P3
3
/RxD
1
P3
2
/RxD
0
*
P3
1
/TxD
1
P3
0
/TxD
0
*
V
CC
PD
7
/D
15
PD
6
/D
14
PD
5
/D
13
PD
4
/D
12
V
SS
PD
3
/D
11
PD
2
/D
10
PD
1
/D
9
PD
0
/D
8
PE
7
/D
7
PE
6
/D
6
PE
5
/D
5
PE
4
/D
4
V
SS
PE
3
/D
3
PE
2
/D
2
PE
1
/D
1
PE
0
/D
0
V
CC
P6
4
/IRQ0
P6
5
/IRQ1
P5
2
/SCK
2
/IRQ
6
P5
3
/ADTRG/IRQ
7
/WAIT/BREQO
AV
CC
V
ref
P4
0
/AN
0
P4
1
/AN
1
P4
2
/AN
2
P4
3
/AN
3
P4
4
/AN
4
P4
5
/AN
5
P4
6
/DA
0
/AN
6
P4
7
/DA
1
/AN
7
AV
SS
V
SS
P1
7
/PO
15
/TIOCB
2
/TCLKD
P1
6
/PO
14
/TIOCA
2
P1
5
/PO
13
/TIOCB
1
/TCLKC
P1
4
/PO
12
/TIOCA
1
P1
3
/PO
11
/TIOCD
0
/TCLKB
P1
2
/PO
10
/TIOCC
0
/TCLKA
P1
1
/PO
9
/TIOCB
0
/DACK
1
P1
0
/PO
8
/TIOCA
0
/DACK
0
MD
0
MD
1
MD
2
PG
0
/CAS
PG
1
/CS
3
PG
2
/CS
2
PG
3
/CS
1
PG
4
/CS
0
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
Note: * If an E10A emulator is used, the TDO, TDI, TDK, TMS, and TRST pins are used exclusively for the H-UDI and the
functions and function modules associated with these pins are not available. SCI channel 0 is not available. Also, the
watchdog timer continues to operate during break states and, if the settings specify that an internal reset is to be
performed, a reset is generated if an overflow occurs.
Refer to the E10A Emulator User's Manual for E10A emulator connection examples.
E10A compatible version
Figure 1.9 HD64F2329E Pin Arrangement (TFP-120: Top View)
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 17 of 1268
REJ09B0220-0600
PG
3
/CS
1
PG
4
/CS
0
V
SS
NC
V
CC
PC
0
/A
0
PC
1
/A
1
PC
2
/A
2
PC
3
/A
3
V
SS
PC
4
/A
4
PC
5
/A
5
PC
6
/A
6
PC
7
/A
7
PB
0
/A
8
PB
1
/A
9
PB
2
/A
10
PB
3
/A
11
V
SS
PB
4
/A
12
PB
5
/A
13
PB
6
/A
14
PB
7
/A
15
PA
0
/A
16
PA
1
/A
17
PA
2
/A
18
PA
3
/A
19
V
SS
PA
4
/A
20
/IRQ
4
PA
5
/A
21
/IRQ
5
PA
6
/A
22
/IRQ
6
PA
7
/A
23
/IRQ
7
P6
7
/CS
7
/IRQ
3
P6
6
/CS
6
/IRQ
2
V
SS
V
SS
P6
5
/IRQ
1
P6
4
/IRQ
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
P5
3
/ADTRG/IRQ
7
/WAIT/BREQO
P5
2
/SCK
2
/IRQ
6
V
SS
V
SS
P5
1
/RxD
2
/IRQ
5
P5
0
/TxD
2
/IRQ
4
PF
0
/BREQ
PF
1
/BACK
PF
2
/LCAS/WAIT/BREQO
PF
3
/LWR
PF
4
/HWR
PF
5
/RD
PF
6
/AS
V
CC
PF
7
/
φ
V
SS
EXTAL
XTAL
V
CC
STBY
NMI
RES
EMLE*
P2
0
/PO
0
/TIOCA
3
P2
1
/PO
1
/TIOCB
3
P2
2
/PO
2
/TIOCC
3
/TMRI
0
P2
3
/PO
3
/TIOCD
3
/TMCI
0
P2
4
/PO
4
/TIOCA
4
/TMRI
1
P2
5
/PO
5
/TIOCB
4
/TMCI
1
P2
6
/PO
6
/TIOCA
5
/TMO
0
P2
7
/PO
7
/TIOCB
5
/TMO
1
P6
3
/TEND
1
/TDO*
P6
2
/DREQ
1
/TDI*
P6
1
/TEND
0
/CS
5
/TCK*
V
SS
V
SS
P6
0
/DREQ
0
/CS
4
/TMS*
V
SS
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
P3
5
/SCK
1
P3
4
/SCK
0*
/TRST*
P3
3
/RxD
1
P3
2
/RxD
0*
P3
1
/TxD
1
P3
0
/TxD
0*
V
CC
PD
7
/D
15
PD
6
/D
14
PD
5
/D
13
PD
4
/D
12
V
SS
PD
3
/D
11
PD
2
/D
10
PD
1
/D
9
PD
0
/D
8
PE
7
/D
7
PE
6
/D
6
PE
5
/D
5
PE
4
/D
4
V
SS
PE
3
/D
3
PE
2
/D
2
PE
1
/D
1
PE
0
/D
0
V
CC
AV
CC
V
ref
P4
0
/AN
0
P4
1
/AN
1
P4
2
/AN
2
P4
3
/AN
3
P4
4
/AN
4
P4
5
/AN
5
P4
6
/AN
6
/DA
0
P4
7
/AN
7
/DA
1
AV
SS
V
SS
P1
7
/PO
15
/TIOCB
2
/TCLKD
P1
6
/PO
14
/TIOCA
2
P1
5
/PO
13
/TIOCB
1
/TCLKC
P1
4
/PO
12
/TIOCA
1
P1
3
/PO
11
/TIOCD
0
/TCLKB
P1
2
/PO
10
/TIOCC
0
/TCLKA
P1
1
/PO
9
/TIOCB
0
/DACK
1
P1
0
/PO
8
/TIOCA
0
/DACK
0
MD
0
MD
1
MD
2
PG
0
/CA
S
PG
1
/CS
3
PG
2
/CS
2
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
Note: * If an E10A emulator is used, the TDO, TDI, TDK, TMS, and TRST pins are used exclusively for the H-UDI and the
functions and function modules associated with these pins are not available. SCI channel 0 is not available. Also, the
watchdog timer continues to operate during break states and, if the settings specify that an internal reset is to be
performed, a reset is generated if an overflow occurs.
Refer to the E10A Emulator User's Manual for E10A emulator connection examples.
E10A compatible version
Figure 1.10 HD64F2329E Pin Arrangement (FP-128B: Top View)
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 18 of 1268
REJ09B0220-0600
1.3.2 Pin Functions in Each Operating Mode
Table 1.2 Pin Functions in Each Operating Mode
Pin No. Pin Name
TFP-120
FP-128B
Mode 4*1
Mode 5*1
Mode 6
Mode 7
Flash Memory
Programmer
Mode
1 5 VCC V
CC V
CC V
CC V
CC
2 6 A0 A
0 PC0/A0 PC0 A
0
3 7 A1 A
1 PC1/A1 PC1 A
1
4 8 A2 A
2 PC2/A2 PC2 A
2
5 9 A3 A
3 PC3/A3 PC3 A
3
6 10 VSS V
SS V
SS V
SS V
SS
7 11 A4 A
4 PC4/A4 PC4 A
4
8 12 A5 A
5 PC5/A5 PC5 A
5
9 13 A6 A
6 PC6/A6 PC6 A
6
10 14 A7 A
7 PC7/A7 PC7 A
7
11 15 A8 A
8 PB0/A8 PB0 A
8
12 16 A9 A
9 PB1/A9 PB1 A
9
13 17 A10 A
10 PB2/A10 PB2 A
10
14 18 A11 A
11 PB3/A11 PB3 A
11
15 19 VSS V
SS V
SS V
SS V
SS
16 20 A12 A
12 PB4/A12 PB4 A
12
17 21 A13 A
13 PB5/A13 PB5 A
13
18 22 A14 A
14 PB6/A14 PB6 A
14
19 23 A15 A
15 PB7/A15 PB7 A
15
20 24 A16 A
16 PA0/A16 PA0 A
16
21 25 A17 A
17 PA1/A17 PA1 A
17
22 26 A18 A
18 PA2/A18 PA2 A
18
23 27 A19 A
19 PA3/A19 PA3 NC
24 28 VSS V
SS V
SS V
SS V
SS
25 29 A20 A
20 PA4/A20/IRQ4 PA4/IRQ4 NC
26 30 PA5/A21/IRQ5 PA5/A21/IRQ5 PA5/A21/IRQ5 PA5/IRQ5 NC
27 31 PA6/A22/IRQ6 PA6/A22/IRQ6 PA6/A22/IRQ6 PA6/IRQ6 NC
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 19 of 1268
REJ09B0220-0600
Pin No. Pin Na me
TFP-120
FP-128B
Mode 4*1
Mode 5*1
Mode 6
Mode 7
Flash Memory
Programmer
Mode
28 32 PA7/A23/IRQ7 PA7/A23/IRQ7 PA7/A23/IRQ7 PA7/IRQ7 NC
29 33 P67/IRQ3/CS7 P67/IRQ3/CS7 P67/IRQ3/CS7 P67/IRQ3 NC
30 34 P66/IRQ2/CS6 P66/IRQ2/CS6 P66/IRQ2/CS6 P66/IRQ2 V
CC
— 35 VSS V
SS V
SS V
SS V
SS
— 36 VSS V
SS V
SS V
SS V
SS
31 37 P65/IRQ1 P65/IRQ1 P65/IRQ1 P65/IRQ1 V
SS
32 38 P64/IRQ0 P64/IRQ0 P64/IRQ0 P64/IRQ0 V
SS
33 39 VCC V
CC V
CC V
CC V
CC
34 40 PE0/D0 PE0/D0 PE0/D0 PE0 NC
35 41 PE1/D1 PE1/D1 PE1/D1 PE1 NC
36 42 PE2/D2 PE2/D2 PE2/D2 PE2 NC
37 43 PE3/D3 PE3/D3 PE3/D3 PE3 NC
38 44 VSS V
SS V
SS V
SS V
SS
39 45 PE4/D4 PE4/D4 PE4/D4 PE4 NC
40 46 PE5/D5 PE5/D5 PE5/D5 PE5 NC
41 47 PE6/D6 PE6/D6 PE6/D6 PE6 NC
42 48 PE7/D7 PE7/D7 PE7/D7 PE7 NC
43 49 D8 D
8 D
8 PD0 I/O0
44 50 D9 D
9 D
9 PD1 I/O1
45 51 D10 D
10 D
10 PD2 I/O2
46 52 D11 D
11 D
11 PD3 I/O3
47 53 VSS V
SS V
SS V
SS V
SS
48 54 D12 D
12 D
12 PD4 I/O4
49 55 D13 D
13 D
13 PD5 I/O5
50 56 D14 D
14 D
14 PD6 I/O6
51 57 D15 D
15 D
15 PD7 I/O7
52 58 VCC V
CC V
CC V
CC V
CC
53 59 P30/TxD0 P30/TxD0 P30/TxD0 P30/TxD0 NC
54 60 P31/TxD1 P31/TxD1 P31/TxD1 P31/TxD1 NC
55 61 P32/RxD0 P32/RxD0 P32/RxD0 P32/RxD0 NC
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 20 of 1268
REJ09B0220-0600
Pin No. Pin Name
TFP-120
FP-128B
Mode 4*1
Mode 5*1
Mode 6
Mode 7
Flash Memory
Programmer
Mode
56 62 P33/RxD1 P33/RxD1 P33/RxD1 P33/RxD1 NC
57 63 P34/SCK0 P34/SCK0 P34/SCK0 P34/SCK0 NC
58 64 P35/SCK1 P35/SCK1 P35/SCK1 P35/SCK1 NC
59 65 VSS V
SS V
SS V
SS V
SS
60 66 P60/DREQ0*2/
CS4 P60/DREQ0*2/
CS4 P60/DREQ0*2/
CS4 P60/DREQ0*2 NC
— 67 VSS V
SS V
SS V
SS V
SS
— 68 VSS V
SS V
SS V
SS V
SS
61 69 P61/TEND0*2/
CS5 P61/TEND0*2/
CS5 P61/TEND0*2/
CS5 P61/TEND0*2 NC
62 70 P62/DREQ1*2 P62/DREQ1*2 P62/DREQ1*2 P62/DREQ1*2 NC
63 71 P63/TEND1*2 P63/TEND1*2 P63/TEND1*2 P63/TEND1*2 NC
64 72 P27/PO7/
TIOCB5/TMO1 P27/PO7/
TIOCB5/TMO1 P27/PO7/
TIOCB5/TMO1 P27/PO7/
TIOCB5/TMO1 NC
65 73 P26/PO6/
TIOCA5/TMO0 P26/PO6/
TIOCA5/TMO0 P26/PO6/
TIOCA5/TMO0 P26/PO6/
TIOCA5/TMO0 NC
66 74 P25/PO5/
TIOCB4/TMCI1 P25/PO5/
TIOCB4/TMCI1 P25/PO5/
TIOCB4/TMCI1 P25/PO5/
TIOCB4/TMCI1 VSS
67 75 P24/PO4/
TIOCA4/TMRI1 P24/PO4/
TIOCA4/TMRI1 P24/PO4/
TIOCA4/TMRI1 P24/PO4/
TIOCA4/TMRI1
WE
68 76 P23/PO3/
TIOCD3/TMCI0 P23/PO3/
TIOCD3/TMCI0 P23/PO3/
TIOCD3/TMCI0 P23/PO3/
TIOCD3/TMCI0
CE
69 77 P22/PO2/
TIOCC3/TMRI0 P22/PO2/
TIOCC3/TMRI0 P22/PO2/
TIOCC3/TMRI0 P22/PO2/
TIOCC3/TMRI0
OE
70 78 P21/PO1/
TIOCB3 P21/PO1/
TIOCB3 P21/PO1/
TIOCB3 P21/PO1/
TIOCB3 NC
71 79 P20/PO0/
TIOCA3 P20/PO0/
TIOCA3 P20/PO0/
TIOCA3 P20/PO0/
TIOCA3 NC
72 80 WDTOVF
(FWE, EMLE )*3WDTOVF
(FWE, EMLE )*3WDTOVF
(FWE, EMLE )*3WDTOVF
(FWE, EMLE )*3 FWE, EML E*3
73 81 RES RES RES RES RES
74 82 NMI NMI NMI NMI VCC
75 83 STBY STBY STBY STBY V
CC
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 21 of 1268
REJ09B0220-0600
Pin No. Pin Na me
TFP-120
FP-128B
Mode 4*1
Mode 5*1
Mode 6
Mode 7
Flash Memory
Programmer
Mode
76 84 VCC V
CC V
CC V
CC V
CC
77 85 XTAL XTAL XTAL XTAL XTAL
78 86 EXTAL EXTAL EXTAL EXTAL EXTAL
79 87 VSS V
SS V
SS V
SS V
SS
80 88 PF7/φ PF7/φ PF7/φ PF7/φ NC
81 89 VCC V
CC V
CC V
CC V
CC
82 90 PF6/AS PF6/AS PF6/AS PF6 NC
83 91 RD RD RD PF5 NC
84 92 HWR HWR HWR PF4 NC
85 93 PF3/LWR PF3/LWR PF3/LWR PF3 NC
86 94 PF2/LCAS*4/
WAIT/BREQO PF2/LCAS*4/
WAIT/BREQO PF2/LCAS*4/
WAIT/BREQO PF2 NC
87 95 PF1/BACK PF1/BACK PF1/BACK PF1 NC
88 96 PF0/BREQ PF0/BREQ PF0/BREQ PF0 NC
89 97 P50/TxD2/IRQ4 P50/TxD2/IRQ4 P50/TxD2/IRQ4 P50/TxD2/IRQ4 NC
90 98 P51/RxD2/IRQ5 P51/RxD2/IRQ5 P51/RxD2/IRQ5 P51/RxD2/IRQ5 V
CC
— 99 VSS V
SS V
SS V
SS V
SS
— 100 VSS V
SS V
SS V
SS V
SS
91 101 P52/SCK2/
IRQ6 P52/SCK2/
IRQ6 P52/SCK2/
IRQ6 P52/SCK2/
IRQ6 NC
92 102 P53/ADTRG/
IRQ7/WAIT/
BREQO
P53/ADTRG/
IRQ7/WAIT/
BREQO
P53/ADTRG/
IRQ7/WAIT/
BREQO
P53/ADTRG/
IRQ7 NC
93 103 AVCC AVCC AVCC AVCC V
CC
94 104 Vref V
ref V
ref V
ref V
CC
95 105 P40/AN0 P40/AN0 P40/AN0 P40/AN0 NC
96 106 P41/AN1 P41/AN1 P41/AN1 P41/AN1 NC
97 107 P42/AN2 P42/AN2 P42/AN2 P42/AN2 NC
98 108 P43/AN3 P43/AN3 P43/AN3 P43/AN3 NC
99 109 P44/AN4 P44/AN4 P44/AN4 P44/AN4 NC
100 110 P45/AN5 P45/AN5 P45/AN5 P45/AN5 NC
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 22 of 1268
REJ09B0220-0600
Pin No. Pin Name
TFP-120
FP-128B
Mode 4*1
Mode 5*1
Mode 6
Mode 7
Flash Memory
Programmer
Mode
101 111 P46/AN6/DA0 P46/AN6/DA0 P46/AN6/DA0 P46/AN6/DA0 NC
102 112 P47/AN7/ DA1 P47/AN7/DA1 P47/AN7/DA1 P47/AN7/DA1 NC
103 113 AVSS AVSS AVSS AVSS V
SS
104 114 VSS V
SS V
SS V
SS V
SS
105 115 P17/PO15/
TIOCB2/
TCLKD
P17/PO15/
TIOCB2/
TCLKD
P17/PO15/
TIOCB2/
TCLKD
P17/PO15/
TIOCB2/
TCLKD
NC
106 116 P16/PO14/
TIOCA2 P16/PO14/
TIOCA2 P16/PO14/
TIOCA2 P16/PO14/
TIOCA2 NC
107 117 P15/PO13/
TIOCB1/
TCLKC
P15/PO13/
TIOCB1/
TCLKC
P15/PO13/
TIOCB1/
TCLKC
P15/PO13/
TIOCB1/
TCLKC
NC
108 118 P14/PO12/
TIOCA1 P14/PO12/
TIOCA1 P14/PO12/
TIOCA1 P14/PO12/
TIOCA1 NC
109 119 P13/PO11/
TIOCD0/
TCLKB
P13/PO11/
TIOCD0/
TCLKB
P13/PO11/
TIOCD0/
TCLKB
P13/PO11/
TIOCD0/
TCLKB
NC
110 120 P12/PO10/
TIOCC0/
TCLKA
P12/PO10/
TIOCC0/
TCLKA
P12/PO10/
TIOCC0/
TCLKA
P12/PO10/
TIOCC0/
TCLKA
NC
111 121 P11/PO9/
TIOCB0/
DACK1*5
P11/PO9/
TIOCB0/
DACK1*5
P11/PO9/
TIOCB0/
DACK1*5
P11/PO9/
TIOCB0/
DACK1*5
NC
112 122 P10/PO8/
TIOCA0/
DACK0*6
P10/PO8/
TIOCA0/
DACK0*6
P10/PO8/
TIOCA0/
DACK0*6
P10/PO8/
TIOCA0/
DACK0*6
NC
113 123 MD0 MD0 MD0 MD0 V
SS
114 124 MD1 MD1 MD1 MD1 V
SS
115 125 MD2 MD2 MD2 MD2 V
SS
116 126 PG0/CAS *6 PG0/CAS *6 PG0/CAS *6 PG0 NC
117 127 PG1/CS3 PG1/CS3 PG1/CS3 PG1 NC
118 128 PG2/CS2 PG2/CS2 PG2/CS2 PG2 NC
119 1 PG3/CS1 PG3/CS1 PG3/CS1 PG3 NC
120 2 PG4/CS0 PG4/CS0 PG4/CS0 PG4 NC
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 23 of 1268
REJ09B0220-0600
Pin No. Pin Na me
TFP-120
FP-128B
Mode 4*1
Mode 5*1
Mode 6
Mode 7
Flash Memory
Programmer
Mode
— 3 VSS V
SS V
SS V
SS V
SS
— 4 VSSNC*7 V
SSNC*7 V
SSNC*7 V
SSNC*7 NC
Notes: 1. Only modes 4 and 5 are provided in the ROMless version.
2. The DREQ0, TEND0, DREQ1, and TEND1 pin functions are not supported in the
H8S/2321.
3. The FWE pin applies to the H8S/2328B F-ZTAT and H8S/2326 F-ZTAT only. The
EMLE pin applies to the H8S/2329B F-ZTAT only. The WDTOVF pin function is not
available in the F-ZTAT versions.
4. The LCAS pin function is not supported in the H8S/2321.
5. The DACK1 pin function is not supported in the H8S/2321.
6. The DACK0 and CAS pin functions are not supported in the H8S/2321.
7. The VSSNC pin is connected to the VSS pin or released.
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 24 of 1268
REJ09B0220-0600
1.3.3 Pin Functions
Table 1.3 Pin Functions
Pin No.
Type Symbol TFP-120 FP-128B I/O Name and Function
Power VCC 1, 33,
52, 76,
81
5, 39,
58, 84,
89
Input Power supply: For connection to the
power supply. All VCC pins s hould be
connected to the system power
supply.
V
SS 6, 15,
24, 38,
47, 59,
79, 104
3, 10,
19, 28,
35, 36,
44, 53,
65, 67,
68, 87,
99, 100,
114
Input Ground: For connection to ground
(0 V). All VSS pins should be
connected to the system power
supply (0 V).
Clock XTAL 77 85 Input Connects to a crystal resonator.
See section 20, Clock Pulse
Generator for typical connection
diagrams for a crystal resonator and
external clock input.
EXTAL 78 86 Input Connects to a crystal resonator.
The EXTAL pin can also input an
external clock.
See section 20, Clock Pulse
Generator for typical connection
diagrams for a crystal resonator and
external clock input.
φ 80 88 Output System clock: Supplies the system
clock to an external device.
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 25 of 1268
REJ09B0220-0600
Pin No.
Type Symbol TFP-120 FP-128B I/O Name and Function
Operating mode
control MD2 to
MD0 115 to
113 125 to
123 Input Mode pins: These pins set the
operating mod e.
The relation between the settings of
pins MD2 to MD0 and the operating
mode is shown below. These pins
should not be changed while the chip
is operating.
H8S/2328B F-ZTAT,
H8S/2326 F-ZTAT:
FWE
MD2
MD1
MD0 Operating
Mode
0 0 0 1 —
1 0 —
1 —
1 0 0 Mode 4
1 Mode 5
1 0 Mode 6
1 Mode 7
1 0 0 0 —
1 —
1 0 Mode 10
1 Mode 11
1 0 0 —
1 —
1 0 Mode 14
1 Mode 15
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 26 of 1268
REJ09B0220-0600
Pin No.
Type Symbol TFP-120 FP-128B I/O Name and Function
Operating mode
control MD2 to
MD0 115 to
113 125 to
123 Input Mask ROM and ROMless versions,
H8S/2329B F-ZTAT:
MD2
MD1
MD0 Operating
Mode
0 0 1 —
1 0 Mode 2*1
1 Mode 3*1
1 0 0 Mode 4*2
1 Mode 5*2
1 0 Mode 6
1 Mode 7
Notes: 1. Applies to the H8S/2329B
F-ZTAT only.
2. The ROMless versions can
use only modes 4 and 5.
System control RES 73 81 Input Reset input: When this pin is driven
low, the chip is reset.
STBY 75 83 Input Standby: When this pin is driven low,
a transition is made to hardw are
standby mode.
BREQ 88 96 Input Bus request: Used by an external
bus master to issue a bus request to
the chip.
BREQO 86, 92 94, 102 Output Bus request output: The external
bus request sig nal use d w hen an
internal bus master ac ces se s external
space in the external bus-released
state.
BACK 87 95 Output Bus request acknowledge:
Indicates that the bus has been
released to an external bus master.
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 27 of 1268
REJ09B0220-0600
Pin No.
Type Symbol TFP-120 FP-128B I/O Name and Function
System control FWE*1 72 80 Input Flash write enable: Enables/
disables flash memory programming.
EMLE*2 72 80 Input Emulator enable: For connection to
the power supply (0 V)
Interrupts NMI 74 82 Input Nonmaskable interrupt: Requests a
nonmaskab le interru pt. When this pin
is not used, it should be fixed high.
IRQ7 to
IRQ0 28 to 25,
29 to 32,
89 to 92
32 to 29,
33, 34,
37, 38, 97,
98, 101,
102
Input Interrupt request 7 to 0: These pins
request a maskable interrupt.
Address bus A23 to
A0 28 to 25,
23 to 16,
14 to 7,
5 to 2
32 to 29,
27 to 20,
18 to 11,
9 to 6
Output Address bus: These pins output an
address.
Data bus D15 to
D0 51 to 48,
46 to 39,
37 to 34
57 to 54,
52 to 45,
43 to 40
I/O Data bus: These pins constitute a
bidirectional data bus.
Bus control CS7 to
CS0 29, 30,
61, 60,
117 to 120
33, 34,
69, 66,
127, 128,
1, 2
Output Chip select: Signals for selecting
areas 7 to 0.
AS 82 90 Output Address strobe: When this pin is
low, it indicates that address output
on the address bus is enabled.
RD 83 91 Output Read: When this pin is low, it
indicates that the external address
space can be read.
HWR 84 92 Output High write/ write enable: A strobe
signal that writes to external space
and indicates that the upper half (D15
to D8) of the data bus is enabled.
The 2-CAS type DRAM write enable
signal.
LWR 85 93 Output Low write: A strobe signal that
writes to external space and
indicates that the lower half (D7 to D0)
of the data bus is enabled.
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 28 of 1268
REJ09B0220-0600
Pin No.
Type Symbol TFP-120 FP-128B I/O Name and Function
Bus control CAS*4 116 126 Output Upper column address strobe/
column address strobe: The 2-CAS
type DRAM upper column address
strobe signal.
LCAS*4 86 94 Output Lower column address stro be: The
2-CAS type DRAM lower column
address strobe signal.
WAIT 86, 92 94, 102 Input Wait: Requests insertion of a wait
state in the bus cycle when
accessing external 3-state access
space.
DMA controller
(DMAC) *3 DREQ1,
DREQ0 62, 60 70, 66 Input DMA request 1 and 0: These pins
request DMAC activation.
TEND1,
TEND0 63, 61 71, 69 Output DMA transfer end 1 and 0: These
pins indicate the end of DMAC data
transfer.
DACK1,
DACK0 111, 112 121, 122 Output DMA transfer acknowledge 1 and
0: These are the DMAC single
address transfer acknowledge pins.
16-bit timer
pulse unit
(TPU)
TCLKD to
TCLKA 105, 107,
109, 110 115, 117,
119, 120 Input Clock input D to A: These pins input
an external clock.
TIOCA0,
TIOCB0,
TIOCC0,
TIOCD0
112 to
109 122 to
119 I/O Input capture/output compare
match A0 to D0: The TGR0A to
TGR0D input capture input or output
compare output, or PWM output pins.
TIOCA1,
TIOCB1 108, 107 118, 117 I/O Input capture/output compare
match A1 and B1: The TGR1A and
TGR1B input capture input or output
compare output, or PWM output pins.
TIOCA2,
TIOCB2 106, 105 116, 115 I/O Input capture/output compare
match A2 and B2: The TGR2A and
TGR2B input capture input or output
compare output, or PWM output pins.
TIOCA3,
TIOCB3,
TIOCC3,
TIOCD3
71 to 68 79 to 76 I/O Input capture/output compare
match A3 to D3: The TGR3A to
TGR3D input capture input or output
compare output, or PWM output pins.
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 29 of 1268
REJ09B0220-0600
Pin No.
Type Symbol TFP-120 FP-128B I/O Name and Function
16-bit timer
pulse unit
(TPU)
TIOCA4,
TIOCB4 67, 66 75, 74 I/O Input capture/output compare
match A4 and B4: The TGR4A and
TGR4B input capture input or output
compare output, or PWM output pins.
TIOCA5,
TIOCB5 65, 64 73, 72 I/O Input capture/output compare
match A5 and B5: The TGR5A and
TGR5B input capture input or output
compare output, or PWM output pins.
Programmable
pulse generator
(PPG)
PO15 to
PO0 105 to
112,
64 to 71
115 to
122,
72 to 79
Output Pulse output 15 to 0: Pulse output
pins.
8-bit timer TMO0,
TMO1 65, 64 73, 72 Output Compare match output: The
compare match outp ut pins.
TMCI0,
TMCI1 68, 66 76, 74 Input Counter external clock input: Input
pins for the external clock input to the
counter.
TMRI0,
TMRI1 69, 67 77, 75 Input Counter external reset input: The
counter reset input pins.
Watchdog
timer (WDT) WDTOVF*572 80 Output Watchdog timer overflow: The
counter overflow signal output pin in
watchdog timer mode.
TxD2,
TxD1,
TxD0
89, 54,
53 97, 60,
59 Output Transmit data (channel 0, 1, 2):
Data output pins.
Serial
communication
interface (SCI)/
smart card
interface RxD2,
RxD1,
RxD0
90, 56,
55 98, 62,
61 Input Receive data (channel 0, 1, 2):
Data input pins.
SCK2,
SCK1,
SCK0
91, 58,
57 101, 64, 63I/O Serial clock (channel 0, 1, 2):
Clock I/O pins.
A/D converter AN7 to
AN0 102 to
95 112 to
105 Input Analog 7 to 0: Analog input pins.
ADTRG 92 102 Input A/D conversion external trigger
input: Pin for input of an external
trigger to start A/D conversion.
D/A converter DA1, DA0 102, 101 112, 111 Output Analog output: D/A converter
analog output pins.
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 30 of 1268
REJ09B0220-0600
Pin No.
Type Symbol TFP-120 FP-128B I/O Name and Function
A/D converter
and D/A
converter
AVCC 93 103 Input This is the power supply pin for the
A/D converter and D/A converter.
When the A/D converter and D/A
converter are not used, this pin
should be connected to the system
power supply (+3 V).
AVSS 103 113 Input This is the ground pin for the A/D
converter and D/A converter.
This pin should be connected to the
system power supply (0 V).
V
ref 94 104 Input This is the reference voltage input pin
for the A/D converter and D/A
converter.
When the A/D converter and D/A
converter are not used, this pin
should be connected to the system
power supply (+3 V).
I/O ports P17 to
P10 105 to
112 115 to
122 I/O Port 1: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port 1 data direction
register (P1DDR).
P27 to
P20 64 to 71 72 to 79 I/O Port 2: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port 2 data direction
register (P2DDR).
P35 to
P30 58 to 53 64 to 59 I/O Port 3: A 6-bit I/O port. Input or
output can be designated for each bit
by means of the port 3 data direction
register (P3DDR).
P47 to
P40 102 to
95 112 to
105 Input Port 4: An 8-bit input port.
P53 to
P50 92 to 89 102, 101,
98, 97 I/O Port 5: A 4-bit I/O port. Input or
output can be designated for each bit
by means of the port 5 data direction
register (P5DDR).
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 31 of 1268
REJ09B0220-0600
Pin No.
Type Symbol TFP-120 FP-128B I/O Name and Function
I/O ports P67 to
P60 29 to 32,
63 to 60 33, 34,
37, 38,
71 to 69,
66
I/O Port 6: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port 6 data direction
register (P6DDR).
PA7 to
PA0 28 to 25,
23 to 20 32 to 29,
27 to 24 I/O Port A: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port A data direction
register (PADDR).
PB7 to
PB0 19 to 16,
14 to 11 23 to 20,
18 to 15 I/O Port B*5: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port B data direction
register (PBDDR).
PC7 to
PC0 10 to 7,
5 to 2 14 to 11,
9 to 6 I/O Port C *5: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port C data direction
register (PCDDR).
PD7 to
PD0 51 to 48,
46 to 43 57 to 54,
52 to 49 I/O Port D*5: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port D data direction
register (PDDDR).
PE7 to
PE0 42 to 39,
37 to 34 48 to 45,
43 to 40 I/O Port E: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port E data direction
register (PEDDR).
PF7 to
PF0 80,
82 to 88 88,
90 to 96 I/O Port F: An 8-bit I/O port. Input or
output can be designated for each bit
by means of the port F data direction
register (PFDDR).
PG4 to
PG0 120 to
116 2, 1,
128 to
126
I/O Port G: A 5-bit I/O port. Input or
output can be designated for each bit
by means of the port G data direction
register (PGDDR).
Notes: 1. Applies to the H8S/2328B F-ZTAT and H8S/2326 F-ZTAT only.
2. Applies to the H8S/2329B F-ZTAT only.
3. Not supported in the H8S/2321.
4. Not available in the F-ZTAT versions.
5. Cannot be used as an I/O port in the ROMless versions.
Section 1 Overview
Rev.6.00 Sep. 27, 2007 Page 32 of 1268
REJ09B0220-0600
Section 2 CPU
Rev.6.00 Sep. 27, 2007 Page 33 of 1268
REJ09B0220-0600
Section 2 CPU
2.1 Overview
The H8S/2000 CPU is a high-speed central processing unit with an internal 32-bit architecture that
is upward-compatible with the H8/300 and H8/300H CPUs. The H8S/2000 CPU has sixteen 16-bit
general registers, can address a 16-Mbyte (architecturally 4-Gbyte) linear address space, and is
ideal for realtime control.
2.1.1 Features
The H8S/2000 CPU has the following features.
• Upward-compatible with H8/300 and H8/300H CPUs
⎯ Can execute H8/300 and H8/300H object programs
• General-register architecture
⎯ Sixteen 16 -bit genera l registers (als o usabl e as si xtee n 8-bit registers or e ight 32 -bit
registers)
• Sixty- five b asic i nstruc t ions
⎯ 8/16/32 -bit arithmetic and logic instructions
⎯ Multiply and divide instructions
⎯ Powerful bit-manipulation instructions
• Eight addressing modes
⎯ Register direct [Rn]
⎯ Register indirect [@ERn]
⎯ Register indirect with displacement [@(d:16,ERn) or @(d:32,ERn)]
⎯ Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn]
⎯ Absolute address [@aa:8, @aa:16, @aa:24, or @aa:32]
⎯ Immediate [#xx:8, #xx:16, or #xx:32]
⎯ Program-counter relative [@(d:8,PC) or @(d:16,PC)]
⎯ Memory indirect [@@aa:8]
• 16-Mbyte address space
⎯ Program: 16 Mbytes
⎯ Data: 16 Mbytes (4 Gbytes architecturally)
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• High-speed operation
⎯ All frequently-used instructions execute in one or two states
⎯ Maximum clock rate: 25 MHz
⎯ 8/16/32-bit register-register add/subtract: 40 ns
⎯ 8 × 8-bit register-register multiply: 480 ns
⎯ 16 ÷ 8-bit register-register divide: 480 ns
⎯ 16 × 16-bit register-register multiply: 800 ns
⎯ 32 ÷ 16-bit register-register divide: 800 ns
• CPU operating mode
⎯ Adva nce d mod e
• Power-down state
⎯ Transition to power-down state by SLEEP instruction
⎯ CPU clock speed selection
2.1.2 Differences between H8S/2600 CPU and H8S/2000 CPU
The differences between the H8S/2600 CPU and the H8S/2000 CPU are as shown below.
• Regist er configuration
The MAC register is supported only by the H8S/2600 CPU.
• Basic instructions
The four instructions MAC, CLRMAC, LDMAC, and STMAC are supported only by the
H8S/2600 CPU.
• Number of execution states
The number of exection states of the MULXU and MULXS instructions.
Internal Operation
Instruction Mnemonic H8S/2600 H8S/2000
MULXU MULXU.B Rs, Rd 3 12
MULXU.W Rs, ERd 4 20
MULXS MULXS.B Rs, Rd 4 13
MULXS.W Rs, ERd 5 21
There are also differences in the address space, CCR and EXR functions, power-down state, etc.,
depending on the product.
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2.1.3 Differences from H8/300 CPU
In comparison to the H8/300 CPU, the H8S/2000 CPU has the following enhancements.
• More general registers and control registers
⎯ Eight 16-bit expanded registers, and one 8-bit control register, have been added.
• Expanded address space
⎯ Advanced mode supports a maximum 16-Mbyte address space.
• Enhanced addressing
⎯ The addressing modes have been enhanced to make effective use of the 16-Mbyte address
space.
• Enha nced instruc tio ns
⎯ Addressing modes of bit-manipulation instructions have been enhanced.
⎯ Signed multiply and divide instructions have been added.
⎯ Two-bit shift instructions have been adde d.
⎯ Instructions for saving and restoring multiple registers have been added.
⎯ A test and set instruction has been added.
• Higher speed
⎯ Basic instructions execute twice as fast.
2.1.4 Differences from H8/300H CPU
In comparison to the H8/300H CPU, the H8S/2000 CPU has the following enhancements.
• Additional control register
⎯ One 8-bit control register has been added.
• Enha nced instruc tio ns
⎯ Addressing modes of bit-manipulation instructions have been enhanced.
⎯ Two-bit shift instructions have been adde d.
⎯ Instructions for saving and restoring multiple registers have been added.
⎯ A test and set instruction has been added.
• Higher speed
⎯ Basic instructions execute twice as fast.
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2.2 CPU Operating Modes
The H8S/2329 and H8S/2328 Group CPU has advanced operating mode. Advanced mode
supports a maximum 16-Mbyte total address space (architecturally a maximum 16-Mbyte program
area and a maximum of 4 Gbytes for program and data areas combined). The mode is selected by
the mode pins of the microcontroller.
Advanced Mode
Address Space: Linear access is provided to a 16-Mbyte maximum address space (architecturally
a maximum 16-Mbyte program area and a maximum 4-Gbyte data area, with a maximum of 4
Gbytes for program and data areas combined).
Extended Registers (En): The extended registers (E0 to E7) can be used as 16-bit registers, or as
the upper 16-bit segments of 32-bit registers or address registers.
Instructio n Set: All instructions and addressing modes can be used.
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Exception Vector Table and Memory Indirect Branch Addresses: In advanced mode the top
area starting at H'00000000 is allocated to the exception vector table in units of 32 bits. In each 32
bits, the upper 8 bits are ignored and a branch address is stored in the lower 24 bits (figure 2.1).
For details of the exception vector tab le, see sectio n 4, Exceptio n Handli ng.
H'00000000
H'00000003
H'00000004
H'0000000B
H'0000000C
Exception vector table
Reserved
Power-on reset exception vector
(Reserved for system use)
Reserved
Exception vector 1
Reserved
H'00000010
H'00000008
H'00000007
Figure 2.1 Exception Vector Table (Advanced Mode)
The memory indirect addressing mode (@@aa:8) employed in the JMP and JSR instructions uses
an 8-bit absolute address included in the instruction code to specify a memory operand that
contains a branch address. In advanced mode the operand is a 32-bit longword operand, providing
a 32-bit branch address. The upper 8 bits of these 32 bits are a reserved area that is regarded as
H'00. Branch addresses can be stored in the area from H'00000000 to H'000000FF. Note that the
first part of this range is also the exception vector table.
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Stack Structure: In advanced mode, when the program counter (PC) is pushed onto the stack in a
subroutine call, and the PC, condition-code register (CCR), and extended control register (EXR)
are pushed onto the stack in exception handling, they are stored as shown in figure 2.2. When
EXR is invalid, it is not pushed onto the stack. For details, s ee section 4, Exception Handling.
(a) Subroutine Branch (b) Exception Handling
PC
(24 bits)
EXR
*1
Reserved
*1 *3
CCR
PC
(24 bits)
SP SP
Notes: 1.
2.
3.
When EXR is not used it is not stored on the stack.
SP when EXR is not used.
Ignored when returning.
(SP )
*2
Reserved
Figure 2.2 Stack Structure in Advanced Mode
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2.3 Address Space
Figure 2.3 shows a memory map of the H8S/2000 CPU. The H8S/2000 CPU provides linear
access to a maximum 16-Mbyte (architecturally 4-Gbyte) address space in advanced mode.
Advanced Mode
H'00000000
H'FFFFFFFF
H'00FFFFFF Data area
Program area
Cannot be
used by the
H8S/2329 and
H8S/2328
Group
Figure 2.3 Memory Map
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2.4 Register Configuration
2.4.1 Overview
The CPU has the internal registers shown in figure 2.4. There are two types of registers: general
registers and control r egister s.
T
————
I2 I1 I0EXR 76543210
PC
23 0
15 07 07 0
E0
E1
E2
E3
E4
E5
E6
E7
R0H
R1H
R2H
R3H
R4H
R5H
R6H
R7H
R0L
R1L
R2L
R3L
R4L
R5L
R6L
R7L
General Registers (Rn) and Extended Registers (En)
Control Registers (CR)
Legend: Stack pointer
Program counter
Extended control register
Trace bit
Interrupt mask bits
Condition-code register
Interrupt mask bit
User bit or interrupt mask bit*
SP:
PC:
EXR:
T:
I2 to I0:
CCR:
I:
UI:
Note: * In the H8S/2329 Group and H8S/2328 Group, this bit cannot be used as an interrupt
mask.
ER0
ER1
ER2
ER3
ER4
ER5
ER6
ER7 (SP)
I
UI
HUNZVCCCR 76543210
Half-carry flag
User bit
Negative flag
Zero flag
Overflow flag
Carry flag
H:
U:
N:
Z:
V:
C:
Figure 2.4 CPU Registers
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2.4.2 General Registers
The CPU has eight 32-bit general registers. These general registers are all functionally alike and
can be used as both address registers and data registers. When a general register is used as a data
register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. When the general registers are used
as 32-bit registers or address registers, they are designated by the letters ER (ER0 to ER7).
The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R
(R0 t o R7). These registers are functionally equiva lent, providing a maximum sixteen 16-bit
registers. The E registers (E0 to E7) are also referred to as extended registers.
The R registers divide into 8-bit general registers designated by the letters RH (R0H to R7H) and
RL (R0L to R7L) . T hese registers a re fu nctionally equiva lent , pr oviding a maximum sixteen 8-bit
registers.
Figure 2.5 illustrates the usage of the general registers. The usage of each register can be selected
independently.
• Address registers
• 32-bit registers • 16-bit registers • 8-bit registers
ER registers
(ER0 to ER7)
E registers (extended registers)
(E0 to E7)
R registers
(R0 to R7)
RH registers
(R0H to R7H)
RL registers
(R0L to R7L)
Figure 2.5 Usage of General Registers
General register ER7 has the function of stack pointer (SP) in addition to its ge neral-register
function, and is used i mplicitly in exception handli ng and subro utine calls. Fig ure 2. 6 shows the
stack.
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Free area
Stack area
SP (ER7)
Figure 2.6 Stack
2.4.3 Control Registers
The control registers are the 24-bit program counter (PC), 8-bit extended control register (EXR),
and 8-bit conditio n-code regist e r (CCR).
(1) Program Counter (PC)
This 24-bit counter indicates the address of the next instructio n the CPU will execute. The length
of all CPU instructio ns is 2 bytes (one word), so the least significant P C bit is ignored. (When an
instruction is fetched, the least sig ni ficant PC bit is regarded as 0.)
(2) Extended Control Register (EXR)
This 8-bit register contains the trace bit (T) and three interrupt mask bits (I2 to I0).
Bit 7—Trace Bit (T): Selects trace mode. When this bit is cleared to 0, instructions are executed
in sequence. When this bit is set to 1, a trace exception is generated each time an instruction is
executed.
Bits 6 to 3—Reserved: These bits are reserved. They are always read as 1.
Bits 2 to 0—Interrupt Mask Bits (I2 to I0): These bits designate the interrupt mask level (0 to
7). For details, refer to section 5, Interrupt Controller.
Operations can be performed on the EXR bits by the LDC, STC, ANDC, ORC, and XORC
instructions. All interrupts, including NMI, are disabled for three states after one of these
instructions is executed, except for STC.
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(3) Condition-Code Register (CCR)
This 8-bit register contains internal CPU status information, including an interrupt mask bit (I) and
half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags.
Bit 7—Interrupt Mask Bit (I): Masks interrupts other than NMI when set to 1. (NMI is accepted
regardless of the I bit setting.) T he I bit is set to 1 by hardware at the start of an exception-
handling sequence. For details, refer to section 5, Interrupt Controller.
Bit 6—User Bit or Interrupt Mask Bit (UI): Can be wri t ten a nd read by software using the
LDC, STC, ANDC, ORC, and XORC instructions. With the H8S/2329 Group and H8S/2328
Group, this bit cannot be used as an interrupt mask bit.
Bit 5—Half-Carry Flag (H): When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B
instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and cleared to 0
otherwise. When the ADD.W, SUB . W, CMP.W, or NEG.W instruction is executed, the H flag is
set to 1 if there is a carry or borrow at bit 11, and cleared to 0 otherwise. When the ADD.L,
SUB.L, CMP.L, or NEG.L instruction is executed, the H flag is set to 1 if there is a carry or
borrow at bit 27, and cleared to 0 otherwise.
Bit 4—User Bit (U): Can be written and read b y soft ware using the LDC, STC, ANDC, ORC, a nd
XORC instructions.
Bit 3—Negative Flag (N): Stores the value of the most significant bit (sign bit) of data.
Bit 2—Zero Flag (Z): Set to 1 to indicate zero data, and cleared to 0 to indicate non-zero data.
Bit 1—Overflow Flag (V): Set to 1 when an arithmetic overflow occurs, and cleared to 0 at other
times.
Bit 0—Carry Flag (C): Set to 1 when a carry occurs, and cleared to 0 otherwise. Used by:
• Add instructions, to indicate a carry
• Subtract instructions, to indicate a borrow
• Shift and rotate instructions, to store the value shifted out of the end bit
The carry flag is also used as a bit accumulator by bit manipulation instructions.
Some instructions leave some or all of the flag bits unchanged. For the action of each instruction
on the flag bits, refer to Appendix A.1, Instruction List.
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Operations can be performed on the CCR bits by the LDC, STC, ANDC, ORC, and XORC
instructions. The N, Z, V, and C flags are used as branching conditions for conditional branch
(Bcc) instructions.
2.4.4 Initial Register Values
Reset exception handling loads the CPU's program counter (PC) from the vector table, clears the
trace bit in EXR to 0, and sets the interrupt mask bits in CCR and EXR to 1. The other CCR bits
and the general registers are not initialized. In particular, the stack pointer (ER7) is not initialized.
The stack pointer should therefore be initialized by an MOV.L instruction executed im mediately
after a reset.
2.5 Data Formats
The CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit (longword) data.
Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2, …, 7) of byte
operand data. The DAA and DAS decimal-adjust instructions treat byte data as two digits of 4-bit
BCD data.
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2.5.1 General Register Data Formats
Figure 2.7 shows the data formats in general registers.
7 6 5 4 3 2 1 0 Don’t care
70
Don’t care 76543210
43
70
70
Don’t careUpper Lower
LSB
MSB LSB
Data Type Register Number Data Format
1-bit data
1-bit data
4-bit BCD data
4-bit BCD data
Byte data
Byte data
RnH
RnL
RnH
RnL
RnH
RnL
MSB
Don’t care Upper Lower
43
70
Don’t care
70
Don’t care 70
Figure 2.7 General Register Data Formats
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0
MSB LSB
15
Word data
Word data
Rn
En
0
LSB
15
16
MSB
31
En Rn
General register ER
General register E
General register R
General register RH
General register RL
Most significant bit
Least significant bit
Legend:
ERn:
En:
Rn:
RnH:
RnL:
MSB:
LSB:
0
MSB LSB
15
Longword data ERn
Data Type Register Number Data Format
Figure 2.7 General Register Data Formats (cont)
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2.5.2 Memory Data Formats
Figure 2.8 shows the data formats in memory. The CPU can access word data and longword data
in memory, but word or longword data must begin at an even address. If an attempt is made to
access word or longword data at an odd address, no address error occurs but the least significant
bit of the address is regarded as 0, so the access starts at the preceding address. This also applies to
instruction fetches.
76543210
70
MSB LSB
MSB
LSB
MSB
LSB
Data Type Data Format
1-bit data
Byte data
Word data
Longword data
Address
Address L
Address L
Address 2M
Address 2M + 1
Address 2N
Address 2N + 1
Address 2N + 2
Address 2N + 3
Figure 2.8 Memory Data Formats
When ER7 is used as an address register to access the stack, the operand size should be word size
or longword size.
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2.6 Instruction Set
2.6.1 Overview
The H8S/2000 CPU has 65 types of instructions. The instructions are classified by function in
table 2.1.
Table 2.1 Instruction Classification
Function Instructions Size Types
Data transfer MOV BWL 5
POP*1, PUSH*1 WL
LDM, STM L
MOVFPE, MOVTPE*3 B
Arithmetic ADD, SUB, CMP, NEG BWL 19
operations ADDX, SUBX, DAA, DAS B
INC, DEC BWL
ADDS, SUBS L
MULXU, DIVXU, MULXS, DIVXS BW
EXTU, EXTS WL
TAS*4 B
Logic operations AND, OR, XOR, NOT BWL 4
Shift SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL, ROTXR BWL 8
Bit manipulation BSET, BCLR, BNOT, BTST, BLD, BILD, BST, BIST, BAND,
BIAND, BOR, BIOR, BXOR, BIXOR B 14
Branch Bcc*2, JMP, BSR, JSR, RTS — 5
System control TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP — 9
Block data transfer EEPMOV — 1
Total: 65
Legend:
B: Byte
W: Word
L: Longword
Notes: 1. POP.W Rn and PUSH.W Rn are identical to MOV.W @SP+, Rn and MOV.W Rn,
@-SP. POP.L ERn and PUSH.L ERn are identical to MOV.L @SP+, ERn and MOV.L
ERn, @-SP.
2. Bcc is the general name for conditional branch instructions.
3. Cannot be used in the H8S/2329 Group and H8S/2328 Group.
4. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
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2.6.2 Instructions and Addressing Modes
Table 2.2 indicates the combinations of instructions and addressing modes that the H8S/2600 CPU
can use.
Table 2.2 Combinatio ns of Instr uctions and Addressing Modes
Addressing Modes
Function
Data
transfer
Arithmetic
operations
Instruction
#xx
Rn
@ERn
@(d:16,ERn)
@(d:32,ERn)
@–ERn/@ERn+
@aa:8
@aa:16
@aa:24
@aa:32
@(d:8,PC)
@(d:16,PC)
@@aa:8
—
Logic
operations
System
control
Block data transfer
Shift
Bit manipulation
Branch
Legend:
B: Byte
W: Word
L: Longword
Notes: 1. Cannot be used in the H8S/2329 Group and H8S/2328 Group.
2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
MOV BWL BWL BWL BWL BWL BWL B BWL — BWL — — — —
POP, PUSH — — — — — — — — — — — — — WL
LDM, STM — — — — — — — — — — — — — L
MOVFPE, — — — — — — — B — — — — — —
MOVTPE
*1
ADD, CMP BWL BWL — — — — — — — — — — — —
SUB WL BWL — — — — — — — — — — — —
ADDX, SUBX B B — — — — — — — — — — — —
ADDS, SUBS — L — — — — — — — — — — — —
INC, DEC — BWL — — — — — — — — — — — —
DAA, DAS — B — — — — — — — — — — — —
MULXU, — BW — — — — — — — — — — — —
DIVXU
MULXS, — BW — — — — — — — — — — — —
DIVXS
NEG — BWL — — — — — — — — — — — —
EXTU, EXTS — WL — — — — — — — — — — — —
TAS
*2
— — B — — — — — — — — — — —
AND, OR, BWL BWL — — — — — — — — — — — —
XOR
NOT — BWL — — — — — — — — — — — —
— BWL — — — — — — — — — — — —
— B B — — — B B — B — — — —
Bcc, BSR — — — — — — — — — — — —
JMP, JSR — — — — — — — — — — — —
RTS — — — — — — — — — — — — —
TRAPA — — — — — — — — — — — — —
RTE — — — — — — — — — — — — —
SLEEP — — — — — — — — — — — — —
LDC B B W W W W — W — W — — — —
STC — B W W W W — W — W — — — —
ANDC, B — — — — — — — — — — — — —
ORC, XORC
NOP — — — — — — — — — — — — —
— — — — — — — — — — — — — BW
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2.6.3 Table of Instructions Classified by Function
Table 2.3 summarizes the instructions in each functional category. The notation used in table 2.3
is defined below.
Operation Notation
Rd General register (destination)*
Rs General register (source)*
Rn General register*
ERn General register (32-bit register)
(EAd) Destination operand
(EAs) Source operand
EXR Extended control register
CCR Condition-code register
N N (negative) flag in CCR
Z Z (zero) flag in CCR
V V (overflow) flag in CCR
C C (carry) flag in CCR
PC Program counter
SP Stack pointer
#IMM Immediate data
disp Displacement
+ Addition
– Subtraction
× Multiplication
÷ Division
∧ Logical AND
∨ Logical OR
⊕ Logical exclusive OR
→ Move
¬ NOT (logical complement)
:8/:16/:24/:32 8-, 16-, 24-, or 32-bit length
Note: * General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0 to
R7, E0 to E7), and 32-bit registers (ER0 to ER7).
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Table 2.3 Instructions Classified by Function
Type Instruction Size*1 Function
Data transfer MOV B/W/L (EAs) → Rd, Rs → (Ead)
Moves data between two general registers or between a
general register and memory, or moves immediate data
to a general register.
MOVFPE B Cannot be used in the H8S/2329 Group and H8S/2328
Group.
MOVTPE B Cannot be used in the H8S/2329 Group and H8S/2328
Group.
POP W/L @SP+ → Rn
Pops a register from the stack. POP.W Rn is identical to
MOV.W @SP+, Rn. POP.L ERn is identical to MOV.L
@SP+, ERn.
PUSH W/L Rn → @–SP
Pushes a register onto the stack. PUSH.W Rn is
identical to MOV.W Rn, @–SP. PUSH.L ERn is identical
to MOV.L ERn, @–SP.
LDM L @SP+ → Rn (register list)
Pops two or more general registers from the stack.
STM L Rn (register list) → @–SP
Pushes two or more general registers onto the stack.
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Type Instruction Size*1 Function
Arithmetic
operations ADD
SUB B/W/L Rd ± Rs → Rd, Rd ± #IMM → Rd
Performs addition or subtraction on data in two general
registers, or on immediate data and data in a general
register. (Immediate byte data cannot be subtracted from
byte data in a general register. Use the SUBX or ADD
instruction.)
ADDX
SUBX B Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd
Performs addition or subtraction with carry or borrow on
byte data in two general registers, or on immediate data
and data in a general register.
INC
DEC B/W/L Rd ± 1 → Rd, Rd ± 2 → Rd
Increments or decrements a general register by 1 or 2.
(Byte operands can be increm ented or decre men ted by
1 only.)
ADDS
SUBS L Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 → Rd
Adds or subtracts the value 1, 2, or 4 to or from data in a
32-bit register.
DAA
DAS B Rd decimal adjust → Rd
Decimal-adjusts an addition or subtraction result in a
general register by referring to the CCR to produce 4-bit
BCD data.
MULXU B/W Rd × Rs → Rd
Performs unsigned multiplication on data in two general
registers: either 8 bits × 8 bits → 16 bits or 16 bits ×
16 bits → 32 bits.
MULXS B/W Rd × Rs → Rd
Performs signed multiplication on data in two general
registers: either 8 bits × 8 bits → 16 bits or 16 bits ×
16 bits → 32 bits.
DIVXU B/W Rd ÷ Rs → Rd
Performs unsigned division on data in two general
registers: either 16 bits ÷ 8 bits → 8-bit quotient and 8-bit
remainder or 32 bits ÷ 16 bits → 16-bit quotient and 16-
bit remainder.
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Type Instruction Size*1 Function
Arithmetic
operations DIVXS B/W Rd ÷ Rs → Rd
Performs signed division on data in two general
registers: either 16 bits ÷ 8 bits → 8-bit quotient and 8-bit
remainder or 32 bits ÷ 16 bits → 16-bit quotient and 16-
bit remainder.
CMP B/W/L Rd – Rs, Rd – #IMM
Compares data in a general register with data in another
general register or with immediate data, and sets CCR
bits according to the result .
NEG B/W/L 0 – Rd → Rd
Takes the two's complement (arithmetic complement) of
data in a general register.
EXTU W/L Rd (zero extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size,
or the lower 16 bits of a 32-bit register to longword size,
by padding with zeros on the left.
EXTS W/L Rd (sign extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size,
or the lower 16 bits of a 32-bit register to longword size,
by extending the sign bit.
TAS B @ERd – 0, 1 → (<bit 7> of @Erd)*2
Tests memory contents, and sets the most significant bit
(bit 7) to 1.
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Type Instruction Size*1 Function
Logic
operations AND B/W/L Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
Performs a logical AND operation on a general register
and another general register or immediate data.
OR B/W/L Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register
and another general register or immediate data.
XOR B/W/L Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general
register and another general register or immediate data.
NOT B/W/L ¬ (Rd) → (Rd)
Takes the one's complement of general register
contents.
Shift
operations SHAL
SHAR B/W/L Rd (shift) → Rd
Performs an arithmetic shift on general register contents.
1-bit or 2-bit shift is possible.
SHLL
SHLR B/W/L Rd (shift) → Rd
Performs a logical shift on gen eral regi ster cont ent s.
1-bit or 2-bit shift is possible.
ROTL
ROTR B/W/L Rd (rotate) → Rd
Rotates general register contents.
1-bit or 2-bit rotation is possible.
ROTXL
ROTXR B/W/L Rd (rotate) → Rd
Rotates general register contents through the carry flag.
1-bit or 2-bit rotation is possible.
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Type Instruction Size*1 Function
Bit-
manipulation
instructions
BSET B 1 → (<bit-No.> of <EAd>)
Sets a specified bit in a general register or memory
operand to 1. The bit number is specified by 3-bit
immediate data or the lower three bits of a general
register.
BCLR B 0 → (<bit-No.> of <EAd>)
Clears a specified bit in a general register or memory
operand to 0. The bit number is specified by 3-bit
immediate data or the lower three bits of a general
register.
BNOT B ¬ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory
operand. The bit number is specified by 3-bit immediate
data or the lower three bits of a general register.
BTST B ¬ (<bit-No.> of <EAd>) → Z
Tests a specified bit in a general register or memory
operand and sets or clears the Z flag accordingly. The
bit number is specified by 3-bit immediate data or the
lower three bits of a general register.
BAND
BIAND
B
B
C ∧ (<bit-No.> of <EAd>) → C
ANDs the carry flag with a specified bit in a general
register or memory operand and stores the result in the
carry flag.
C ∧ ¬ (<bit-No.> of <EAd>) → C
ANDs the carry flag with the inverse of a specified bit in
a general register or memory operand and stores the
result in the carry flag.
The bit number is specified by 3-bit immediate data.
BOR
BIOR
B
B
C ∨ (<bit-No.> of <EAd>) → C
ORs the carry flag with a specified bit in a general
register or memory operand and stores the result in the
carry flag.
C ∨ ¬ (<bit-No.> of <EAd>) → C
ORs the carry flag with the inverse of a specified bit in a
general register or memory operand and stores the
result in the carry flag.
The bit number is specified by 3-bit immediate data.
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Type Instruction Size*1 Function
Bit-
manipulation
instructions
BXOR
BIXOR
B
B
C ⊕ (<bit-No.> of <EAd>) → C
Exclusive-O R s the carry flag w ith a specif ied bit in a
general register or memory operand and stores the
result in the carry flag.
C ⊕ ¬ (<bit-No.> of <EAd>) → C
Exclusive-ORs the carry flag with the inverse of a
specified bit in a general register or memory operand
and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
BLD
BILD
B
B
(<bit-No.> of <EAd>) → C
Transfers a specified bit in a general register or memory
operand to the carry flag.
¬ (<bit-No.> of <EAd>) → C
Transfers the inverse of a specified bit in a general
register or memory operand to the carry flag.
The bit number is specified by 3-bit immediate data.
BST
BIST
B
B
C → (<bit-No.> of <EAd>)
Transfers the carry flag value to a specified bit in a
general register or memory operand.
¬ C → (<bit-No.> of <EAd>)
Transfers the inverse of the carry flag value to a
specified bit in a general register or memory operand.
The bit number is specified by 3-bit immediate data.
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Type Instruction Size*1 Function
Branch
instructions Bcc — Branches to a specified address if a specified condition
is true. The branching conditions are listed below.
Mnemonic Description Condition
BRA(BT) Always (true) Always
BRN(BF) Never (false) Never
BHI High C ∨ Z = 0
BLS Low or same C ∨ Z = 1
BCC(BHS) Carry clear
(high or same) C = 0
BCS(BLO) Carry set (low) C = 1
BNE Not equal Z = 0
BEQ Equal Z = 1
BVC Overflow clear V = 0
BVS Overflow set V = 1
BPL Plus N = 0
BMI Minus N = 1
BGE Greater or equal N ⊕ V = 0
BLT Less than N ⊕ V = 1
BGT Greater than Z∨(N ⊕ V) = 0
BLE Less or equal Z∨(N ⊕ V) = 1
JMP — Branches unconditionally to a specified address.
BSR — Branches to a subroutine at a specified address.
JSR — Branches to a subroutine at a specified address.
RTS — Returns from a subroutine.
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Type Instruction Size*1 Function
TRAPA — Starts trap-instruction exception handling.
System control
instructions RTE — Returns from an exception-handling routine.
SLEEP — Causes a transition to a power-down state.
LDC B/W (EAs) → CCR, (EAs) → EXR
Moves the source operand contents or immediate data
to CCR or EXR. Although CCR and EXR are 8-bit
registers, word-size transfers are performed between
them and memory. The upper 8 bits are valid.
STC B/W CCR → (EAd), EXR → (EAd)
Transfers CCR or EXR contents to a general register or
memory. Although CCR and EXR are 8-bit registers,
word-size transfers are performed between them and
memory. The upper 8 bits are valid.
ANDC B CCR ∧ #IMM → CCR, EXR ∧ #IMM → EXR
Logically ANDs the CCR or EXR contents with
immediate data.
ORC B CCR ∨ #IMM → CCR, EXR ∨ #IMM → EXR
Logically ORs the CCR or EXR contents with immediate
data.
XORC B CCR ⊕ #IMM → CCR, EXR ⊕ #IMM → EXR
Logically exclusive-ORs the CCR or EXR contents with
immediate data.
NOP — PC + 2 → PC
Only increments the program counter.
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Type Instruction Size*1 Function
Block data
transfer
instruction
EEPMOV.B
EEPMOV.W
—
—
if R4L ≠ 0 then
Repeat @ER5+ → @ER6+
R4L–1 → R4L
Until R4L = 0
else next;
if R4 ≠ 0 then
Repeat @ER5+ → @ER6+
R4–1 → R4
Until R4 = 0
else next;
Transfers a data block according to parameters set in
general registers R4L or R4, ER5, and ER6.
R4L or R4: size of block (bytes)
ER5: starting source address
ER6: starting destination address
Execution of the next instruction begins as soon as the
transfer is completed.
Notes: 1. Size refers to the operand size.
B: Byte
W: Word
L: Longword
2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
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2.6.4 Basic Instruction Formats
The CPU instructions consist o f 2-byte (1-word) units. An instruction consi sts of an operation
field (op field), a register field (r field), an effective address extension (EA field), and a condition
field (cc).
Figure 2.9 shows examples of instruction formats.
op
op rn rm
NOP, RTS, etc.
ADD.B Rn, Rm, etc.
MOV.B @(d:16, Rn), Rm, etc.
(1) Operation field only
(2) Operation field and register fields
(3) Operation field, register fields, and effective address extension
rn rm
op
EA (disp)
(4) Operation field, effective address extension, and condition field
op cc EA (disp) BRA d:16, etc
Figure 2.9 Instruction Formats (Examples)
(1) Operation Field: Indicates the function of the instruction, the addressing mode, and the
operation to be carried out on the operand. The operation field always includes the first four bits of
the instruction. Some instructions have two operation fields.
(2) Register Field: Specifies a general register. Address registers are specified by 3 bits, data
registers by 3 bits or 4 bits. Some instructions ha ve two register fields. Some have no regist er
field.
(3) Effective Address Extension: Eight, 16, or 32 bits specifying immediate data, an absolute
address, or a displacement.
(4) Condition Field: Specifies the branching condition of Bcc instructions.
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2.7 Addressing Modes and Effective Address Calculation
2.7.1 Addressing Mode
The CPU supports the eight addressing modes listed in table 2.4. Each instruction uses a subset of
these addressing modes. Arithmetic and logic instructions can use the register direct and
immediate modes. Data transfer instructions can use all addressing modes except program-counter
relative and memory indirect. Bit manipulation instructions use register direct, register indirect, or
absolute addressing mode to specify an operand, and register direct (BSET, BCLR, BNOT, and
BTST instructions) or immediate (3-bit) addressing mode to specify a bit number in the operand.
Table 2.4 Addressing Modes
No. Addressing Mode Symbol
1 Register direct Rn
2 Register indirect @ERn
3 Register indirect with displacement @(d:16,ERn)/@(d:32,ERn)
4 Register indirect with post-increment
Register indirect with pre-decrement @ERn+
@–ERn
5 Absolute address @aa:8/@aa:16/@aa:24/@aa:32
6 Immediate #xx:8/#xx:16/#xx:32
7 Program-counter relative @(d:8,PC)/@(d:16,PC)
8 Memory indirect @@aa:8
(1) Register Direct—Rn: The register field of the instruction specifies an 8-, 16-, or 32-bit
general register containing the operand. R0H to R7H and R0L to R7L can be specified as 8-bit
registers. R0 to R7 and E0 to E7 can be specified as 16-bit registers. ER0 to ER7 can be specified
as 32-bit registers.
(2) Register Indirect—@ERn: The register field of the instruction code specifies an address
register (ERn) which contains the address of the operand on memory. If the address is a program
instruction address, the lower 24 bits are valid and the upper 8 bits are all assumed to be 0 (H'00).
(3) Register Indirect with Displacement—@(d:16, ERn) or @(d:32, ERn): A 16-bit or 32-bit
displacement contained in the instruction is added to an address register (ERn) specified by the
register field of the instruction, and the sum gives the address of a memory operand. A 16-bit
displacement is sign-extended when added.
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(4) Register Indirect with Post-Increment or Pre-Decrement—@ERn+ or @-ERn:
• Register indirect with post-increment—@ERn+
The register field of the instruction code specifies an address register (ERn) which contains the
address of a memory operand. After the operand is accessed, 1, 2, or 4 is added to the address
register contents and the sum is stored in the address register. The value added is 1 for byte
access, 2 for word transfer instruction, or 4 for longword transfer instruction. For word or
longword transfer instruction, the register value should be even.
• Register indirect with pre-decrement—@-ERn
The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field
in the instruction code, and the result becomes the address of a memory operand. The result is
also stored in the address register. The value subtracted is 1 for byte access, 2 for word transfer
instruction, or 4 for longword transfer instruction. For word or longword transfer instruction,
the register value should be even.
(5) Absolute Address—@aa:8, @aa:16, @aa:24, or @aa:32: The instruction code contains the
absolute address of a memory operand. The absolute address may be 8 bits long (@aa:8), 16 bits
long (@aa:16), 24 bits long (@aa:24), or 32 bits long (@aa:32).
To access data, the absolute address should be 8 bits (@aa:8), 16 bits (@aa:16), or 32 bits
(@aa:32) long. For an 8-bit absolute address, the upper 24 bits are all assumed to be 1 ( H'FFFF) .
For a 16-bit absolute address the upper 16 bits are a sign extension. A 32-bit absolute address can
access the entire address space.
A 24-bit absolute address (@aa:24) indicates the address of a program instruction. The upper 8
bits are all assumed to be 0 (H'00).
Table 2.5 indicates the accessible absolute address ranges.
Table 2.5 Absolute Address Access Ranges
Absolute Address Advanced Mode
Data address 8 bits (@aa:8) H'FFFF00 to H'FFFFFF
16 bits (@aa:16) H'000000 to H'007FFF,
H'FF8000 to H'FFFFFF
32 bits (@aa:32) H'000000 to H'FFFFFF
Program instruction address 24 bits (@aa:24)
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(6) Immediate—#xx:8, #xx:16, or #xx:32: The instruction contains 8-bit (#xx:8), 16-bit
(#xx:16), or 32-bit (#xx:32) immediate data as an operand.
The ADDS, SUBS, INC, and DEC instructions co ntai n i mmediate data implicitly. So me bit
manipulation instruction s co nt ain 3-bit immediate data in the instruction code, specifying a bit
number. The TRAPA instruction contains 2-bit immediate data in its instruction code, specifying a
vector address.
(7) Program-Counter Relative—@(d:8, PC) or @(d:16, PC): This mode is used in the Bcc and
BSR instructions. An 8-bit or 1 6-bit displacement contained in the instruction is si g n-extended and
added to the 24-bit PC contents to generate a branch address. Only the lower 24 bits of this branch
address are valid; the upper 8 bits are all assumed to be 0 (H'00). The PC value to which the
displacement is adde d is the addr ess of the first byte of the next instruction, so the possible
branching range is –126 to +128 bytes (–63 to +64 words) or –32766 to +32768 bytes (–16383 to
+16384 words) from the branch instruction. The resulting value should be an even number.
(8) Memory Indirect—@@aa:8: This mode can be used by the JMP and JSR instructions. The
instruction code contains an 8-bit absolute address specifying a memory operand. This memory
operand contains a branch address. The upper bits of the absolute address are all assumed to be 0,
so the address range is 0 to 255 (H'000000 to H'0000FF).
In advanced mode the memory operand is a long word operand, the first byte of which is assu med
to be all 0 (H'00).
Note that the first part of the address range is also the exception vector area. For further details,
refer to section 4, Exception Handling.
Advanced Mode
Specified
by @aa:8 Reserved
Branch address
Figure 2.10 Branch Address Specification in Memory Indirect Mode
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If an odd address is specified in word or longword memory access, or as a branch address, the
least significant bit is regarded as 0, causing data to be accessed or instruction code to be fetched
at the address preceding the specified address. (For further information, see section 2.5.2, Memory
Data Formats.)
2.7.2 Effective Address Calculation
Table 2.6 indicates how effective addresses are calculated in each addressing mode.
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Table 2.6 Effective Address Calculation
Register indirect with post-increment or
pre-decrement
•
Register indirect with post-increment @ERn+
No. Addressing Mode and Instruction Format Effective Address Calculation Effective Address (EA)
1 Register direct (Rn)
op rm rn Operand is general register contents.
Register indirect (@ERn)2
Register indirect with displacement
@(d:16, ERn) or @(d:32, ERn)
3
•
Register indirect with pre-decrement @-DERn
4
General register contents
General register contents
Sign extension disp
General register contents
1, 2, or 4
General register contents
1, 2, or 4
Byte
Word
Longword
1
2
4
Operand Size Value added
31 0
31 0
31 0
31 0
31 0 31 0
31 0
31 0
31 0
op r
r
op
op r
rop
disp
24 23
Don't care
24 23
Don't care
24 23
Don't care
24 23
Don't care
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5
@aa:8
Absolute address
@aa:16
@aa:32
6Immediate #xx:8/#xx:16/#xx:32
31 08 7
Operand is immediate data.
No. Addressing Mode and Instruction Format Effective Address Calculation Effective Address (EA)
@aa:24
31 0
16 15
31 0
24 23
31 0
op abs
op abs
abs
op
op
abs
op IMM
H'FFFF
Don
'
t care
24 23
Don
'
t care
24 23
Don
'
t care
24 23
Don
'
t care
Sign extension
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31
0
0
7Program-counter relative
@(d:8, PC)/@(d:16, PC)
8Memory indirect @@aa:8
• Advanced mode
No. Addressing Mode and Instruction Format Effective Address Calculation Effective Address (EA)
23
23
0
31 8 7
0
disp
abs
H'000000
31 0
24 23
31 0
24 23
op disp
op abs
Sign
extension
PC contents
Memory contents
Don’t care
Don’t care
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2.8 Processing States
2.8.1 Overview
The CPU has five main processing states: the reset state, exception handling state, program
execution state, bus-released state, and power-down state. Figure 2.11 shows a diagram of the
processing states. Figure 2.12 indicates the state transitions.
Reset state
The CPU and all on-chip supporting modules have been
initialized and are stopped.
Exception-handling
state
A transient state in which the CPU changes the normal
processing flow in response to a reset, interrupt, or trap
instruction.
Program execution
state
The CPU executes program instructions in sequence.
Bus-released state
The external bus has been released in response to a bus
request signal from a bus master other than the CPU.
Power-down state
CPU operation is stopped
to conserve power.*
Sleep mode
Software standby
mode
Hardware standby
mode
Processing
states
Note:
*The power-down state also includes a medium-speed mode, module stop mode etc.
Figure 2.11 Processing States
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End of bus request
Bus request
Program execution
state
Bus-released state
Sleep mode
Exception-handling state
External interrupt Software standby mode
RES = high
Reset state STBY = high, RES = low Hardware standby mode
*2
Power-down state
*1
Notes: 1.
2.
From any state except hardware standby mode, a transition to the reset state occurs whenever RES
goes low. A transition can also be made to the reset state when the watchdog timer overflows.
From any state, a transition to hardware standby mode occurs when STBY goes low.
SLEEP
instruction
with
SSBY = 0
SLEEP
instruction
with
SSBY = 1
Interrupt
request
End of bus
request Bus
request
Request for
exception
handling
End of
exception
handling
Figure 2.12 State Transitions
2.8.2 Reset State
When the RES input goes low all current processing stop s and the CPU enters the reset state. All
interrupts are masked in the reset state. Reset exception handling starts when the RES signal
changes from low to high.
The reset state can also be entered by a watchdog timer overflow. For details, refer to section 13,
Watchdog Timer.
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2.8.3 Exception-Handling State
The exception-handling state is a transient state that occurs when the CPU alters the normal
processing flow due to a reset, interrupt, or trap instruction. The CPU fetches a start address
(vector) from the exception vector table and branches to that address.
(1) Types of Exception Handling and Their Priority
Exception handling is performed for traces, resets, interrupts, and trap instructions. Table 2.7
indicates the types of exception handling and their priority. Trap instruction exception han dling is
always accepted, in the program execution state.
Exception handling and the stack structure depend on the in terrupt control mode set in SYSCR.
Table 2.7 Except ion Handling Types a nd Priority
Priority Type of Exception Detection Timing Start of Exception Handling
High
Reset Synchronized with clock Exception handling starts
immediately after a low-to-high
transition at the RES pin, or
when the watchdog timer
overflows
Trace End of instruction
execution or end of
exception-handling
sequence*1
When the trace (T) bit is set to
1, the trace starts at the end of
the current instruction or current
exception-h andling sequen ce
Interrupt End of instruction
execution or end of
exception-handling
sequence*2
When an interrupt is requested,
exception handling starts at the
end of the current instruction or
current exception-handling
sequence
Low
Trap instruction When TRAPA instruction
is executed Exception handling starts when
a trap (TRAPA) instruction is
executed*3
Notes: 1. Traces are enabled only in interrupt control mode 2. Trace exception-handling is not
executed at the end of the RTE instruction.
2. Interrupts are not detected at the end of the ANDC, ORC, XORC, and LDC instructions,
or immediately after reset exception handling.
3. Trap instruction exception handling is always accepted, in the program execution state.
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(2) Reset Exception Handling
After the RES pin has gone low and the reset state has been entered, when RES goes high again,
reset exception handling starts . When reset exception handling starts the CPU fetche s a start
address (vector) from the exception vector table and starts program execution from that address.
All interrupts, including NMI, are disabled during reset exception handling and after it ends.
(3) Traces
Traces are enabled only in interrupt control mode 2. Trace mode is entered when the T bit of EXR
is set to 1. When trace mode is established, trace exception handling starts at the end of each
instruction.
At the end of a trace exception-handling sequence, the T bit of EXR is cleared to 0 and trace mode
is cleared. Interrupt masks are not affected.
The T bit saved on the stack retains its value of 1, and when the RTE instruction is executed to
return from the trace exception-handling routine, trace mode is entered again. Trace exception-
handling is not executed at the end of the RTE instruction.
Trace mode is not entered in interrupt control mode 0, regardless of the state of the T bit.
(4) Interrupt Exception Handling and Trap Instruction Exception Handling
When interrup t or trap-inst ruc t ion except ion handling begins, the CPU references the stack pointer
(ER7) and pushes the program counter and other control registers onto the stack. Next, the CPU
alters the settings of t he interrupt mask bits in the control registers. Then the CPU fetches a start
address (vector) from the exception vector table and program execution starts from that start
address.
Figure 2.13 shows the stack after exception handling ends.
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(c) Interrupt control mode 0 (d) Interrupt control mode 2
CCR
PC
(24 bits)
SP
Note: * Ignored when returning.
CCR
PC
(24 bits)
SP
EXR
Reserved*
A
dvanced mode
Figure 2.13 Stack Structure after Exception Handling (Examples)
2.8.4 Program Execution State
In this state the CPU executes program instructions in sequence.
2.8.5 Bus-Released State
This is a state in which the bus has been released in response to a bus request from a bus master
other than the CPU. W hile the bus is released, the CPU halts.
There is one other bus master in addition to the CP U: the DMA controller (DMAC)* and data
transfer controller (DTC).
For further details, refer to section 6, Bus Controller.
Note: * The DMAC is not supported in the H8S/2321.
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2.8.6 Power-Down State
The power-down state includes both modes in which the CPU stops operating and modes in which
the CPU does not stop. There are three modes in which the CPU stops operating: sleep mode,
software standby mode, and hardware standby mode. There are also two other power-down
modes: medium-speed mode, and module stop mode. In medium-speed mode the CPU and other
bus masters operate on a medium-speed clock. Module stop mode permits halting of the operation
of individual modules, other than the CPU. For details, refer to section 21, Power-Down Modes.
(1) Sleep Mode: A transition to sleep mode is made if the SLEEP instruction is exec uted while
the software standby bit (SSBY) in the standby control register (SBYCR) is cleared to 0. In sleep
mode, CPU operations stop immediately after execution of the SLEEP instruction. The contents of
CPU registers are retained.
(2) Software Standby Mode: A transition to software standby mode is made if the SLEEP
instruction is executed while the SSBY bit in SB YCR is set to 1 . In soft ware standb y mode, the
CPU and clock halt and all MCU operations stop . As long as a specified volta ge is supplied, the
contents of CPU registers and on-chip RAM are retained. The I/O ports also remain in their
existing states.
(3) Hardware Standby Mode: A transition to hard ware standb y mode is made when the STBY
pin goes low. In hardware standby mode, the CPU and clock halt and all MCU operations stop.
The on-chip supporting modules are reset, but as long as a specified voltage is supplied, on-chip
RAM contents are retained.
2.9 Basic Timing
2.9.1 Overview
The CPU is driven by a system clock, denoted by the symbol φ. The period from one rising edge
of φ to the next is referred to as a "state." The memory cycle or bus cycle consists of one, two, or
three states. Different methods are used to access on-chip memory, on-chip supporting modules,
and the external address space.
2.9.2 On-Chip Memory (ROM, RAM)
On-chip memory is accessed in one state. The data bus is 16 bits wide, permitting both byte and
word transfer instruction. Figure 2.14 shows the on-chip memory access cycle. Figure 2.15 shows
the pin states.
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Internal address bus
Internal read signal
Internal data bus
Internal write signal
Internal data bus
φ
Bus cycle
T1
Address
Read data
Write data
Read
access
Write
access
Figure 2.14 On-Chip Memory Access Cycle
Bus cycle
T1
Unchanged
ddress bus
AS
RD
HWR, LWR
Data bus
φ
High
High
High
High-impedance state
Figure 2.15 Pin States during On-Chip Memory Access
Section 2 CPU
Rev.6.00 Sep. 27, 2007 Page 75 of 1268
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2.9.3 On-Chip Supporting Module Access Timing
The on-chip supporting modules are accessed in two states. The data bus is either 8 bits or 16 bits
wide, depending on the particular internal I/O register being accessed. Figure 2.16 shows the
access timing for the on-chip supporting modules. Figure 2.17 shows the pin states.
Bus cycle
T1T2
Address
Read data
Write data
Internal read signal
Internal data bus
Internal write signal
Internal data bus
Read
access
Write
access
Internal address bus
φ
Figure 2.16 On-Chip Supp orting Module Access Cycle
Section 2 CPU
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Bus cycle
T1T2
Unchanged
A
ddress bus
AS
RD
HWR, LWR
Data bus
φ
High
High
High
High-impedance state
Figure 2.17 Pin States during On-Chip Supporting Module Access
2.9.4 External Address Space Acc ess Ti ming
The external address space is accessed with an 8-bit or 16-bit data bus width in a two-state or
three-state bus cycle. In three-state access, wait states can be inserted. For further details, refer to
section 6, Bus Controller.
2.10 Usage Note
2.10.1 TAS Instruction
Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. The TAS
instruction is not generated by the Renesas H8S and H8/300 Series C/C++ compilers. If the TAS
instruction is used as a user-defined intrinsic function, ensure that only register ER0, ER1, ER4, or
ER5 is used.
Section 3 MCU Operating Modes
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Section 3 MCU Operating Modes
3.1 Overview
3.1.1 Operating Mode Selection (H8S/2328B F-ZTAT, H8S/2326 F-ZTAT)
The H8S/2328B F-ZTAT and H8S/2326 F-ZTAT have eight operating modes (modes 4 to 7, 10,
11, 14 and 15). These modes are determined by the mode pin (MD2 to MD0) and flash write enable
pin (FWE) settings. The CPU op erating mode and initial bus width can be selected as shown in
table 3.1.
Table 3.1 lists the MCU operating modes.
Table 3.1 M CU Operating Mode Selection (H8S/2328B F-ZTAT, H8S/2326 F-ZTAT)
External Data
Bus
MCU
Operating
Mode
FWE
MD2
MD1
MD0
CPU
Operating
Mode
Description On-Chip
ROM Initial
Value Max
Value
1 0 0 0 1 — — — — —
2 1 0
3 1
4 1 0 0 Advanced Disabled 16 bits 16 bits
5 1 Expanded mode with
on-chip ROM disabled 8 bits 16 bits
6 1 0 Expanded mode with on-
chip ROM enabled Enabled 8 bits 16 bits
7 1 Single-chip mode — —
8 1 0 0 0 — — — — —
9 1
10 1 0 Advanced Boot mode Enabled 8 bits 16 bits
11 1 — —
12 1 0 0 — — — — —
13 1
14 1 0 Advanced User program mode Enabled 8 bits 16 bits
15 1 — —
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The CPU's architecture allows for 4 Gbytes of address space, but the H8S/2328B F-ZTAT and
H8S/2326 F-ZTAT actually accesses a maximum of 16 Mbytes.
Modes 4 to 6 are externally expanded modes that allow access to external memory and peripheral
devices.
The external expansion modes allow switching between 8-bit and 16-bit bus modes. After
program execution starts, an 8-bit or 16-bit address space can be set for each area, depending on
the bus controller setting. If 16-bit access is selected for any one area, 16-bit bus mode is set; if 8-
bit access is selected for all areas, 8-bit bus mode is set. Note that the functions of each pin depend
on the operating mode.
Modes 10, 11, 14, and 15 are boot modes and user program modes in which the flash memory can
be programmed and erased. For details, see section 19, ROM.
The H8S/2328B F-ZTAT and H8S/2326 F-ZTAT can only be used in modes 4 to 7, 10, 11, 14,
and 15. This means that the flash write enable pin and mode pins must be set to select one of these
modes.
Do not change the inputs at the mode pins during operation.
3.1.2 Operating Mode Selection (Mask ROM and ROMless Versions, H8S/2329B
F-ZTAT)
The ROMless and mask ROM versions have four operating modes (modes 4 to 7). H8S/2329B
F-ZTAT has six operating modes (modes 2 to 7). The operating mode is determined by the mode
pins (MD2 to MD0). The CPU operating mode, enabling or disabling of on-chip ROM, and the
initial bus width setti ng can be selected as sho wn in table 3.2.
Table 3.2 lists the MCU operating modes.
Section 3 MCU Operating Modes
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Table 3.2 MCU Operating Mode Selection (Mask ROM and ROMless Versions,
H8S/2329B F-ZTAT)
External Data Bus
MCU
Operating
Mode
MD2
MD1
MD0
CPU
Operating
Mode
Description On-Chip
ROM Initial
Value Max.
Value
1 0 0 1 — — — — —
2*1 1 0
3*1 1
4*2 1 0 0 Advanced Disabled 16 bits 16 bits
5*2 1 Expanded mode with
on-chip ROM disabled 8 bits 16 bits
6 1 0 Expanded mode with
on-chip ROM enabled Enabled 8 bits 16 bits
7 1 Single-chip mode — —
Notes: 1. Boot mode in the H8S/2329B F-ZTAT.
See table 19.9, for information on H8S/2329B F-ZTAT user boot modes. See table
19.9, for information on H8S/2329B F-ZTAT user program modes.
2. The ROMless versions can use only modes 4 and 5.
The CPU's architecture allows for 4 Gbytes of address space, but the mask ROM and ROMless
versions, and H8S/2329B F-ZTAT actually access a maximum of 16 Mbytes.
Modes 4 to 6 are externally expanded modes that allow access to external memory and peripheral
devices.
The external expansion modes allow switching between 8-bit and 16-bit bus modes. After
program execution starts, an 8-bit or 16-bit address space can be set for each area, depending on
the bus controller setting. If 16-bit access is selected for any one area, 16-bit bus mode is set; if 8-
bit access is selected for all areas, 8-bit bus mode is set. Note that the functions of each pin depend
on the operating mode.
The ROMless and mask ROM versions can only be used in modes 4 to 7. This means that the
mode pins must be set to select one of these modes. However, note that only mode 4 or 5 can be
set for the ROMless version.
H8S/2329B F-ZTAT can only be used in modes 2 to 7. This means that the mode pins must be set
to select one of these modes.
Do not change the inputs at the mode pins during operation.
Section 3 MCU Operating Modes
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3.1.3 Register Configuration
The H8S/2329 Group and H8S/2328 Group have a mode control register (MDCR) that indicates
the inputs at the mode pins (MD2 to MD0), and a system control register (SYSCR) and a system
control register 2 (SYSCR2)*2 that control the operation of the chip. Table 3.3 summarizes these
registers.
Table 3.3 Registers
Name Abbreviation R/W Initial Value Address*1
Mode control register MDCR R Undefined H'FF3B
System control regi ster SYSCR R/W H'01 H'FF39
System control register 2*2 SYSCR2 R/W H'00 H'FF42
Notes: 1. Lower 16 bits of the address.
2. The SYSCR2 register can only be used in the F-ZTAT versions. In the mask ROM and
ROMless versions this register will return an undefined value if read, and cannot be
modified.
3.2 Register Descriptions
3.2.1 Mode Control Register (MDCR)
Bit : 7 6 5 4 3 2 1 0
— — — — — MDS2 MDS1 MDS0
Initial value : 1 0 0 0 0 —* —
* —
*
R/W : — — — — — R R R
Note: * Determined by pins MD2 to MD0.
MDCR is an 8-bit read-only register that indicates the current operating mode of the H8S/2329
Group and H8S/2328 Group chip.
Bit 7—Reserved: This bit is always read as 1, and cannot be modified.
Bits 6 to 3—Reserved: These bits are always read as 0, and cannot be modified.
Bits 2 to 0—Mode Select 2 to 0 (MDS2 to MDS0): These bits indicate the input levels at pins
MD2 to MD0 (the current operating mode). Bits MDS2 to MDS0 correspond to pins MD2 to MD0.
MDS2 to MDS0 are read-only bits, and cannot be writte n to. The mode pin (MD2 to MD0) input
levels are latched into these bits when MDCR is read. These latches are canceled by a reset.
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3.2.2 Syste m Control Register (SYSCR)
Bit : 7 6 5 4 3 2 1 0
— — INTM1 INTM0 NMIEG LWROD IRQPAS RAME
Initial value : 0 0 0 0 0 0 0 1
R/W : R/W — R/W R/W R/W R/W R/W R/W
Bit 7—Reserved: Only 0 should be written to this bit.
Bit 6—Reserved: This bit is always read as 0, and cannot be modified.
Bits 5 and 4—Interrupt Cont rol Mode 1 and 0 (INTM1, INTM0): These bits select the control
mode of the interrupt controller. For details of the interrupt control modes, see section 5.4.1,
Interrupt Control Modes and Interrupt Operation.
Bit 5
INTM1 Bit 4
INTM0 Interrupt Control
Mode
Description
0 0 0 Control of interrupts by I bit (Initial value)
1 — Setting prohibited
1 0 2 Control of interrupts by I2 to I0 bits and IPR
1 — Setting prohibited
Bit 3—NMI Edge Select (NMIEG): Selects the valid edge of the NMI interrupt input.
Bit 3
NMIEG
Description
0 An interrupt is requested at the falling edge of NMI input (Initial value)
1 An interrupt is requested at the rising edge of NMI input
Bit 2—LWR Output Disable (LWROD): Enables or disables LWR output.
Bit 2
LWROD
Description
0 PF3 is designated as LWR output pin (Initial value)
1 PF3 is designated as I/O port, and does not function as LWR output pin
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Bit 1—IRQ Port Switching Select (IRQPAS): Selects switching of input pins for IRQ4 to IRQ7.
IRQ4 to IRQ7 input is always performed from one of the ports.
Bit 1
IRQPAS
Description
0 PA4 to PA7 are used for IRQ4 to IRQ7 input (Initial value)
1 P50 to P53 are used for IRQ4 to IRQ7 input
Bit 0—RAM Enable (RAME): Enables o r disables the on-chip RAM. The RAME bit is
initialized when the reset state is released . It is not initialized in software standby mode.
Bit 0
RAME
Description
0 On-chip RAM is disabled
1 On-chip RAM is enabled (Initial value)
3.2.3 System Control Register 2 (SYSCR2) (F- ZTAT Version Only)
Bit : 7 6 5 4 3 2 1 0
— — — — FLSHE — — —
Initial value : 0 0 0 0 0 0 0 0
R/W : — — — — R/W — — — (R/W)*
Note: * R/W in the H8S/2329B F-ZTAT.
SYSCR2 is an 8-bit readable/writable register that performs on-chip flash memory control.
SYSCR2 is initialized to H'00 by a reset, and in hardware standby mode.
Bits 7 to 4—Reserved: These bits are always read as 0, and cannot be modified.
Bit 3—Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash
memory control registers (FLMCR1, FLMCR2, EBR1, and EBR2). For details, see section 19,
ROM.
Section 3 MCU Operating Modes
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Bit 3
FLSHE
Description
0 Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB
(Initial value)
1 Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB
Bits 2 and 1—Reserved: These bits are always read as 0. Only 0 should be written to these bits.
Bit 0—Reserved: In the H8S/2328B F-ZTAT and H8S/2326 F-ZTAT, this bit is always read as 0
and should only be written with 0. In the H8S/2329B F-ZTAT, this bit is reserved and should only
be written with 0.
3.3 Operating Mode Descriptions
3.3.1 Mode 1
The H8S/2329 does not support mode 1. Do not select the mode 1 setting.
3.3.2 Mode 2 (H8S/2329B F-ZTAT Only)
This is a flash memory boot mode. See section 19, ROM, for details. This is the same as advanced
on-chip ROM enabled expansion mode, except when erasing and reprogramming flash memory.
3.3.3 Mode 3 (H8S/2329B F-ZTAT Only)
This is a flash memory boot mode. See section 19, ROM, for details. This is the same as advanced
single-chip ROM mode, except when erasing and reprogramming flash memory.
3.3.4 Mode 4 (Expa nded Mode with On-Chip ROM Disabled)
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is disabled.
Ports A, B, and C function as an address bus, port D functions as a data bus, and part of port F
carries bus control signals.
The initial bus mode after a reset is 16 bits, with 16-bit access to all areas. Ho wever, note that if 8-
bit access is designated by the bus controller for all areas, the bus mode switches to 8 bits.
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3.3.5 Mode 5 (Expa nded Mode with On-Chip ROM Disabled)
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is disabled.
Ports A, B, and C function as an address bus, port D functions as a data bus, and part of port F
carries bus control signals.
The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. Ho wever, note that if at
least one area is designated for 16-bit access by the bus controller, the bus mode switches to 16
bits and port E becomes a data bus.
3.3.6 Mode 6 (Expa nded Mode with On-Chip ROM Enabled)
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is enabled.
Ports A, B, and C function as input ports immediately after a reset. These pins can be set to output
addresses by setting the corresponding bits to 1 in pin function control register 1 (PFCR1) in the
case of ports A and B, or in the data direction register (DDR) for port C. Port D functions as a data
bus, and part of port F carries bus control signals.
The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. Ho wever, note that if at
least one area is designated for 16-bit access by the bus controller, the bus mode switches to 16
bits and port E becomes a data bus.
3.3.7 Mode 7 (Single-Chip Mode)
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is enabled,
but external addresses cannot be accessed.
All I/O ports are available for use as input/output ports.
3.3.8 Modes 8 and 9 (H8S/2328B F-ZTAT and H8S/2326 F-ZTAT Only)
Modes 8 and 9 are not supported and must not be set.
3.3.9 Mode 10 (H8S/2328B F-ZTAT and H8S/2326 F-ZTAT Only)
This is a flash memory boot mode. For details, see section 19, ROM.
Except for the fact that flash memory programming and erasing can be performed, operation in
this mode is the same as in advanced expanded mode with on-chip ROM enabled.
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3.3.10 Mode 11 (H8S/2328B F-ZTAT and H8S/2326 F-ZTAT Only)
This is a flash memory boot mode. For details, see section 19, ROM.
Except for the fact that flash memory programming and erasing can be performed, operation in
this mode is the same as in advanced single-chip mode.
3.3.11 Modes 12 and 13
Modes 12 and 13 are not supported and must not be set.
3.3.12 Mode 14 (H8S/2328B F-ZTAT and H8S/2326 F-ZTAT Only)
This is a flash memory user program mode. For details, see section 19, ROM.
Except for the fact that flash memory programming and erasing can be performed, operation in
this mode is the same as in advanced expanded mode with on-chip ROM enabled.
3.3.13 Mode 15 (H8S/2328B F-ZTAT and H8S/2326 F-ZTAT Only)
This is a flash memory user program mode. For details, see section 19, ROM.
Except for the fact that flash memory programming and erasing can be performed, operation in
this mode is the same as in advanced single-chip mode.
3.4 Pin Functions in Each Operating Mode
The pin functions of ports A to F vary depending on the operating mode. Table 3.4 shows their
functions in each operating mode.
Section 3 MCU Operating Modes
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Table 3.4 Pin Functio ns in Each Mode
Port Mode
2*4 Mode
3*4 Mode
4 Mode
5 Mode
6*2 Mode
7*2 Mode
10*3 Mode
11*3 Mode
14*3 Mode
15*3
Port A PA7 to
PA5 P*1/A P P*1/A P*1/A P*1/A P P*1/A P P*1/A P
PA4 to
PA0 A A
Port B P*1/A P A A P*1/A P P*1/A P P*1/A P
Port C P*1/A P A A P*1/A P P*1/A P P*1/A P
Port D D P D D D P D P D P
Port E P*1/D P P/D*1 P
*1/D P*1/D P P*1/D P P*1/D P
Port F PF7 P
*1/C P*1/C P*1/C P*1/C
PF6 P/C*1 P P/C*1 P/C*1 P/C*1 P P/C*1 P P/C*1 P
PF5 to
PF4 C C C C C C
PF3 P/C*1 P/C*1 P/C*1 P/C*1 P/C*1 P/C*1
PF2 to
PF0 P*1/C P*1/C P*1/C P*1/C P*1/C P*1/C
Legend:
P: I/O port
A: Address bus output
D: Data bus I/O
C: Control signals, clo ck I/O
Notes: 1. After reset.
2. Setting is prohibited in the ROMless versions.
3. Setting prohibited except in case of the H8S/2328B F-ZTAT and H8S/2326 F-ZTAT.
4. Valid only in the H8S/2329B F-ZTAT.
3.5 Memory Map in Each Operating Mode
Figures 3.1 to 3.9 show memory maps for each of the operating modes.
The address space is 16 Mbytes.
The address space is divided into eight areas.
Section 3 MCU Operating Modes
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Mode 2 Boot Mode
(advanced expanded mode
with on-chip ROM enabled)
Mode 3 Boot Mode
(advanced single-chip
mode)
On-chip ROM On-chip ROM
On-chip ROM/
reserved area*2 *5
External address
space
Reseved area*4
Reseved area*4
Reseved area*4
Reseved area*4
On-chip RAM*3On-chip RAM
Internal
I/O registers
External address
space
Internal
I/O registers
Internal
I/O registers
Internal
I/O registers
External address
space
H'000000 H'000000
H'FF7400
H'FFFBFF
H'FF7C00
H'FF7400
H'FF7C00
H'FFFFFF
H'FFFE50
H'FFFF07
H'FFFF28
On-chip ROM/
external address
space*1
H'010000 H'010000
H'07FFFF
H'060000H'060000
H'080000
H'FFFC00
H'FFFFFF
H'FFFF08
H'FFFF28
H'FFFE50
Notes: 1. External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
2. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
3. On-chip RAM is used for flash memory programming. Do not clear the RAME bit in SYSCR to 0.
4. Access to the reserved areas H'060000 to H'07FFFF and H'FF7400 to H'FF7BFF is prohibited.
5. Do not access a reserved area.
Figure 3.1 (a) H8S/2329B Memory Map in Each Operating Mode
Section 3 MCU Operating Modes
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Modes 4 and 5
(advanced expanded modes
with on-chip ROM disabled)
Mode 6
(advanced expanded mode
with on-chip ROM enabled)
Mode 7
(advanced single-chip
mode)
External address
space
On-chip ROM
On-chip RAM
*3
Notes: 1. External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
2. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
3. External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
4. Access to the reserved areas H'060000 to H'07FFFF and H'FF7400 to H'FF7BFF is prohibited.
5. Do not access a reserved area.
Internal
I/O registers
On-chip ROM
On-chip ROM/
reserved area
*2 *5
External address
space
External address
space
External address
space
Internal
I/O registers
External address
space
Reseved area
*4
Reseved area
*4
Reseved area
*4
Reseved area
*4
Reseved area
*4
Reseved area
*4
On-chip RAM
*3
On-chip RAM
Internal
I/O registers
External address
space
Internal
I/O registers
Internal
I/O registers
Internal
I/O registers
External address
space
H'000000 H'000000 H'000000
H'FFFC00
H'FFFFFF
H'FF7400
H'FFFBFF
H'FF7C00
H'FF7400
H'FF7C00
H'FF7400
H'FF7C00
H'FFFFFF
H'FFFF08
H'FFFE50
H'FFFF07
H'FFFF28 H'FFFF28
On-chip ROM/
external address
space
*1
H'FFFE50
H'010000 H'010000
H'07FFFF
H'060000H'060000H'060000
H'080000 H'080000
H'FFFC00
H'FFFFFF
H'FFFF08
H'FFFF28
H'FFFE50
Figure 3.1 (b) H8S/2329B Memory Map in Each Operating Mode
Section 3 MCU Operating Modes
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Modes 4 and 5
(advanced expanded modes
with on-chip ROM disabled)
Mode 6
(advanced expanded mode
with on-chip ROM enabled)
Mode 7
(advanced single-chip
mode)
External address
space
On-chip ROM
On-chip RAM
*3
Notes: 1. External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
2. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
3. External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
4. Do not access a reserved area.
Internal
I/O registers
On-chip ROM
On-chip ROM/
reserved area
*2 *4
External address
space
External address
space
Internal
I/O registers
External address
space
On-chip RAM
*3
On-chip RAM
Internal
I/O registers
External address
space
Internal
I/O registers
Internal
I/O registers
Internal
I/O registers
External address
space
H'000000 H'000000 H'000000
H'040000
H'FFFC00
H'FFFFFF
H'FFDC00H'FFDC00H'FFDC00
H'FFFBFF
H'FFFFFF
H'FFFF08
H'FFFE50
H'FFFF07
H'FFFF28 H'FFFF28
On-chip ROM/
external address
space
*1
H'FFFE50
H'010000 H'010000
H'03FFFF
H'FFFC00
H'FFFFFF
H'FFFF08
H'FFFF28
H'FFFE50
Figure 3.2 (a) H8S/2328 Memory Map in Each Operating Mode
Section 3 MCU Operating Modes
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Mode 10 Boot Mode
(advanced expanded mode
with on-chip ROM enabled)
Mode 11 Boot Mode
(advanced single-chip
mode)
On-chip ROM
Notes: 1. External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
2. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
3. On-chip RAM is used for flash memory programming. Do not clear the RAME bit in SYSCR to 0.
4. Do not access a reserved area.
On-chip ROM
External address
space
On-chip RAM*3On-chip RAM*3
On-chip ROM/
reserved area*2 *4
Internal
I/O registers
External address
space
Internal
I/O registers
Internal
I/O registers
Internal
I/O registers
External address
space
H'000000 H'000000
H'040000 H'03FFFF
H'FFDC00
H'FFFBFF
H'FFFFFF
H'FFFE50
H'FFFF07
H'FFFF28
On-chip ROM/
external address
space*1
H'010000 H'010000
H'FFDC00
H'FFFC00
H'FFFE50
H'FFFFFF
H'FFFF08
H'FFFF28
Figure 3.2 (b) H8S/2328 Memory Map in Each Operating Mode (F-ZTAT Only)
Section 3 MCU Operating Modes
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Mode 14 User Program Mode
(advanced expanded mode
with on-chip ROM enabled)
Mode 15 User Program Mode
(advanced single-chip
mode)
On-chip ROM
Notes: 1. External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
2. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
3. On-chip RAM is used for flash memory programming. Do not clear the RAME bit in SYSCR to 0.
4. Do not access a reserved area.
On-chip ROM
External address
space
On-chip RAM*3On-chip RAM*3
On-chip ROM/
reserved area*2 *4
Internal
I/O registers
External address
space
Internal
I/O registers
Internal
I/O registers
Internal
I/O registers
External address
space
H'000000 H'000000
H'040000 H'03FFFF
H'FFDC00
H'FFFBFF
H'FFFFFF
H'FFFE50
H'FFFF07
H'FFFF28
On-chip ROM/
external address
space*1
H'010000 H'010000
H'FFDC00
H'FFFC00
H'FFFE50
H'FFFFFF
H'FFFF08
H'FFFF28
Figure 3.2 (c) H8S/2328 Memory Map in Each Operating Mode (F-ZTAT Only)
Section 3 MCU Operating Modes
Rev.6.00 Sep. 27, 2007 Page 92 of 1268
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Modes 4 and 5
(advanced expanded modes
with on-chip ROM disabled)
Mode 6
(advanced expanded mode
with on-chip ROM enabled)
Mode 7
(advanced single-chip
mode)
External address
space
On-chip ROM
On-chip RAM
*4
Notes: 1. External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
2. External addresses when EAE = 1 in BCRL; reserved area when EAE = 0.
3. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
4. External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
5. Do not access a reserved area.
Internal
I/O registers
On-chip ROM
Reserved area
*5
External address
space
External address
space
Internal
I/O registers
External address
space
On-chip RAM
*4
On-chip RAM
Internal
I/O registers
External address
space
Internal
I/O registers
Internal
I/O registers
Internal
I/O registers
External address
space
H'000000 H'000000 H'000000
H'040000
H'FFFC00
H'FFFFFF
H'FFDC00H'FFDC00H'FFDC00
H'FFFBFF
H'FFFFFF
H'FFFF08
H'FFFE50
H'FFFF07
H'FFFF28 H'FFFF28
External address
space/reserved
area
*2 *5
External address
space/on-chip
ROM
*1
Reserved area
*5
/
on-chip ROM
*3
H'FFFE50
H'010000 H'010000
H'020000H'020000
H'03FFFF
H'FFFC00
H'FFFFFF
H'FFFF08
H'FFFF28
H'FFFE50
Figure 3.3 H8S/2327 Memory Map in Each Operating Mode
Section 3 MCU Operating Modes
Rev.6.00 Sep. 27, 2007 Page 93 of 1268
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Modes 4 and 5
(advanced expanded modes
with on-chip ROM disabled)
Mode 6
(advanced expanded mode
with on-chip ROM enabled)
Mode 7
(advanced single-chip
mode)
External address
space
On-chip ROM
On-chip RAM
*3
Notes: 1. External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
2. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
3. External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
4. Do not access a reserved area.
Internal
I/O registers
On-chip ROM
External address
space
External address
space
Internal
I/O registers
External address
space
On-chip RAM
*3
On-chip RAM
Internal
I/O registers
External address
space
Internal
I/O registers
Internal
I/O registers
Internal
I/O registers
External address
space
H'000000 H'000000 H'000000
H'080000
H'FFFC00
H'FFFFFF
H'FFDC00H'FFDC00H'FFDC00
H'FFFBFF
H'FFFFFF
H'FFFF08
H'FFFE50
H'FFFF07
H'FFFF28 H'FFFF28
On-chip ROM/
external address
space
*1
On-chip ROM/
reserved area
*2 *4
H'FFFE50
H'010000 H'010000
H'07FFFF
H'FFFC00
H'FFFFFF
H'FFFF08
H'FFFF28
H'FFFE50
Figure 3.4 (a) H8S/2326 F-ZTAT Memory Map in Each Operating Mode
Section 3 MCU Operating Modes
Rev.6.00 Sep. 27, 2007 Page 94 of 1268
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Mode 10 Boot Mode
(advanced expanded mode
with on-chip ROM enabled)
Mode 11 Boot Mode
(advanced single-chip
mode)
On-chip ROM
Notes: 1. External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
2. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
3. On-chip RAM is used for flash memory programming. Do not clear the RAME bit in SYSCR to 0.
4. Do not access a reserved area.
On-chip ROM
External address
space
On-chip RAM*3On-chip RAM*3
On-chip ROM/
reserved area*2 *4
Internal
I/O registers
External address
space
Internal
I/O registers
Internal
I/O registers
Internal
I/O registers
External address
space
H'000000 H'000000
H'080000 H'07FFFF
H'FFDC00
H'FFFBFF
H'FFFFFF
H'FFFE50
H'FFFF07
H'FFFF28
On-chip ROM/
external address
space*1
H'010000 H'010000
H'FFDC00
H'FFFC00
H'FFFE50
H'FFFFFF
H'FFFF08
H'FFFF28
Figure 3.4 (b) H8S/2326 F-ZTAT Memory Map in Each Operating Mode
Section 3 MCU Operating Modes
Rev.6.00 Sep. 27, 2007 Page 95 of 1268
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Mode 14 User Program Mode
(advanced expanded mode
with on-chip ROM enabled)
Mode 15 User Program Mode
(advanced single-chip
mode)
On-chip ROM
Notes: 1. External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
2. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
3. On-chip RAM is used for flash memory programming. Do not clear the RAME bit in SYSCR to 0.
4. Do not access a reserved area.
On-chip ROM
External address
space
On-chip RAM*3On-chip RAM*3
On-chip ROM/
reserved area*2 *4
Internal
I/O registers
External address
space
Internal
I/O registers
Internal
I/O registers
Internal
I/O registers
External address
space
H'000000 H'000000
H'080000 H'07FFFF
H'FFDC00
H'FFFBFF
H'FFFFFF
H'FFFE50
H'FFFF07
H'FFFF28
On-chip ROM/
external address
space*1
H'010000 H'010000
H'FFDC00
H'FFFC00
H'FFFE50
H'FFFFFF
H'FFFF08
H'FFFF28
Figure 3.4 (c) H8S/2326 F-ZTAT Memory Map in Each Operating Mode
Section 3 MCU Operating Modes
Rev.6.00 Sep. 27, 2007 Page 96 of 1268
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Modes 4 and 5
(advanced expanded modes
with on-chip ROM disabled)
External address
space
On-chip RAM*
Internal
I/O registers
External address
space
Internal
I/O registers
External address
space
H'000000
H'FFFC00
H'FFFFFF
H'FF7C00
H'FFFF08
H'FFFF28
H'FFFE50
Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3.5 H8S/2324S Memory Map in Each Operating Mode
Section 3 MCU Operating Modes
Rev.6.00 Sep. 27, 2007 Page 97 of 1268
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Modes 4 and 5
(advanced expanded modes
with on-chip ROM disabled)
Mode 6
(advanced expanded mode
with on-chip ROM enabled)
Mode 7
(advanced single-chip
mode)
External address
space
On-chip ROM
On-chip RAM
*2
Notes: 1. External addresses when EAE = 1 in BCRL; reserved area when EAE = 0.
2. External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
3. Do not access a reserved area.
Internal
I/O registers
On-chip ROM
Reserved area
*3
Reserved area
*3
Reserved area
*3
External address
space
External address
space
Internal
I/O registers
External address
space
On-chip RAM
*2
On-chip RAM
Internal
I/O registers
External address
space
Internal
I/O registers
Internal
I/O registers
Internal
I/O registers
External address
space
H'000000 H'000000 H'000000
H'040000
H'FFFC00
H'FFFFFF
H'FFDC00H'FFDC00H'FFDC00
H'FFFBFF
H'FFFFFF
H'FFFF08
H'FFFE50
H'FFFF07
H'FFFF28 H'FFFF28
External address
space/reserved
area
*1 *3
H'FFFE50
H'010000 H'010000
H'008000 H'008000
H'03FFFF
H'FFFC00
H'FFFFFF
H'FFFF08
H'FFFF28
H'FFFE50
Figure 3.6 H8S/2323 Memory Map in Each Operating Mode
Section 3 MCU Operating Modes
Rev.6.00 Sep. 27, 2007 Page 98 of 1268
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Modes 4 and 5
(advanced expanded modes
with on-chip ROM disabled)
External address
space
On-chip RAM*
Internal
I/O registers
External address
space
Internal
I/O registers
External address
space
H'000000
H'FFFC00
H'FFFFFF
H'FFDC00
H'FFFF08
H'FFFF28
H'FFFE50
Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3.7 H8S/2322R Memory Map in Each Operating Mode
Section 3 MCU Operating Modes
Rev.6.00 Sep. 27, 2007 Page 99 of 1268
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Modes 4 and 5
(advanced expanded modes
with on-chip ROM disabled)
External address
space
Reserved area
On-chip RAM*
Internal
I/O registers
External address
space
Internal
I/O registers
External address
space
H'000000
H'FFFC00
H'FFEC00
H'FFFFFF
H'FFDC00
H'FFFF08
H'FFFF28
H'FFFE50
Note: * External addresses can be accessed by clearing the RAME bit in SYSCR to 0.
Figure 3.8 H8S/2320 and H8S/2321 Memory Map in Each Operating Mode
Section 3 MCU Operating Modes
Rev.6.00 Sep. 27, 2007 Page 100 of 1268
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Section 4 Exception Handling
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Section 4 Exception Handling
4.1 Overview
4.1. 1 Exceptio n Handling Ty pes and Priority
As table 4.1 indicates, exception handlin g may be caused by a reset, trap instruction, or interrupt.
Exception handling is prioriti zed as shown in table 4.1. If two or more exceptions occur
simultaneously, they are accepted and processed in order of priority. Trap instruction exceptions
are accepted at all times in the program execution state.
Exceptio n handling sources, the sta ck structure, and t he operat i on of the CPU vary depe nding on
the interrupt control mode set by the INTM0 and INTM1 bits of SYSCR.
Table 4.1 Exception Types and Priority
Priority Exception Type Start of Exception Handling
High Reset Starts immediately after a low-to-high transition at the
RES pin, or when the watchdog timer overflows.
Trace*1 Starts when execution of the current instruction or
exception handling ends, if the trace (T) bit is set to 1
Interrupt Starts when execution of the current instruction or
exception handling ends, if an interrupt request has been
issued*2
Low Trap instruction (TRAPA) *3 Started by execution of a trap instruction (TRAPA)
Notes: 1. Traces are enabled only in interrupt control mode 2. Trace exception handling is not
executed after execution of an RTE instruction.
2. Interrupt detectio n is not performed on comple tion of ANDC, ORC, XORC, or LDC
instruction execution, or on completion of reset exception handling.
3. Trap instruction exception handling requests are accepted at all times in the program
execution state .
Section 4 Exception Handling
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4.1.2 Exception Handling Operation
Exceptions originate from various sources. Trap instructions and interrupts are handled as fo llows:
1. The program counter (PC), condition code register (CCR), and extend register (EXR) are
pushed onto the stack.
2. The interrupt mask bits are updated. T he T bit is cleared to 0.
3. A vector address corresponding to the exception source is generated, and program execution
starts from tha t address.
For a reset exception, steps 2 and 3 above are carried out.
4.1.3 Exception Vector Table
The exception sources are classified as shown in figure 4.1. Different vector addresses are
assigned to different exception sources.
Table 4.2 lists the exception sources and their vector addresses.
Exception
sources
• Reset
• Trace
• Interrupts
• Trap instruction
External interrupts: NMI, IRQ7 to IRQ0
Internal interrupts: interrupts from on-chip
supporting modules
Figure 4.1 Exception Sources
In modes 6 and 7, the on-chip ROM available for use after a po wer-on reset is the 64-kbyte area
comprising addresses H'000000 to H'00FFFF. Care is required when setting vector addresses. In
this case, clearing the EAE bit in BCRL enables the 256-kbyte (128 kbytes/384 kbytes/512
kbytes)* area comprising addresses H'000000 to H'03FFFF (to H'01FFFF/H'05FFFF/H'07FFFF)
to be used. For details, see section 6.2.5, Bus Control Register L (BCRL).
Note: * The amount of on-chip ROM differs depending on the product.
Section 4 Exception Handling
Rev.6.00 Sep. 27, 2007 Page 103 of 1268
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Table 4.2 Exception Vector Table
Vector Address*1
Exception Source Vector Number Advanced Mode
Reset 0 H'0000 to H'0003
Reserved 1 H'0004 to H'0007
Reserved for system use 2 H'0008 to H'000B
3 H'000C to H'000F
4 H'0010 to H'0013
Trace 5 H'0014 to H'0017
Reserved for system use 6 H'0018 to H'001B
External interrupt NMI 7 H'001C to H'001F
Trap instruction (4 sources) 8 H'0020 to H'0023
9 H'0024 to H'0027
10 H'0028 to H'002B
11 H'002C to H'002F
Reserved for system use 12 H'0030 to H'0033
13 H'0034 to H'0037
14 H'0038 to H'003B
15 H'003C to H'003F
External interrupt IRQ0 16 H'0040 to H'0043
IRQ1 17 H'0044 to H'0047
IRQ2 18 H'0048 to H'004B
IRQ3 19 H'004C to H'004F
IRQ4 20 H'0050 to H'0053
IRQ5 21 H'0054 to H'0057
IRQ6 22 H'0058 to H'005B
IRQ7 23 H'005C to H'005F
Internal interrupt*2 24
⎜
91
H'0060 to H'0063
⎜
H'016C to H'016F
Notes: 1. Lower 16 bits of the address.
2. For details of internal interrupt vectors, see section 5.3.3, Interrupt Exception Vector
Table.
Section 4 Exception Handling
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4.2 Reset
4.2.1 Overview
A reset has the highest exception priority.
When the RES pin goes low, all processing halts and the chip enters the reset state. A reset
initializes the internal state of the CPU and the registers of on-chip supporting modules.
Immediately after a reset, interrupt control mode 0 is set.
Reset exceptio n hand l ing begins when the RES pin changes from low to high.
A reset can also be caused by watchdog timer overflow. For details see section 13, Watchdog
Timer.
4.2.2 Reset Sequence
The chip enters the reset state when the RES pin goes low.
To ensure that the chip is reset, hold the RES pin lo w for at least 20 ms at power-up. To reset the
chip during operation, hold the RES pin lo w for at least 20 states.
When the RES pin goes high after being held low for the necessary time, the chip starts reset
exception handling as follows :
1. The internal state of the CPU and the registers of the on-chip supporting modules are
initialized, the T bit is cleared to 0 in EXR, and the I bit is set to 1 in EXR and CCR.
2. The reset exception vector address is read and transferred to the PC, and program execution
starts from the address indicated by the PC.
Figure 4.2 shows an example of the reset sequence.
Section 4 Exception Handling
Rev.6.00 Sep. 27, 2007 Page 105 of 1268
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A
ddress bus
Vector fetch Internal
processing Prefetch of first
program instruction
(1), (3) Reset exception handling vector address ((1) = H'000000, (3) = H'000002)
(2), (4) Start address (contents of reset exception vector address)
(5) Start address ((5) = (2), (4))
(6) First program instruction
φ
RES
(1) (5)
High
(2) (4)
(3)
(6)
RD
HWR, LWR
D15 to D0
*
Note: * 3 program wait states are inserted.
**
Figure 4.2 Reset Sequence (Mode 4)
4.2.3 Interrupts after Reset
If an interrupt is accepted after a reset but before the stack pointer (SP) is initialized, the PC and
CCR will not be saved co rrectly, leading to a program crash. To prevent this, all interrupt requests,
including NMI, are disabled immediately after a reset. Since the first instruction of a program is
always executed immediately after the reset state ends, make sure that this instruction initializes
the stack pointer (example: MOV.L #xx:32, SP).
4.2.4 St ate of On-Chip Supportin g Modules after Reset Release
After reset release, MSTPCR i s init ialized to H'3FFF and all mod ules except the DMAC* and
DTC enter module stop mode. Consequently, on-chip supporting module registers cannot be read
or written to. Register reading and writing is enabled when module stop mode is exited.
Note: * The DMAC is not supported in the H8S/2321.
Section 4 Exception Handling
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4.3 Traces
Traces are enabled in interrupt control mode 2. Trace mode is not activated in interrupt control
mode 0, irrespective of the state of the T bit. For de tails o f interrupt control modes, see sectio n 5,
Interrupt Controller.
If the T bit in EXR is set to 1, trace mode is activated. In trace mode, a trace exception occurs on
completion of each instruction.
Trace mode is canceled by clearing the T bit in EXR to 0. It is not affected by interrupt masking.
Table 4.3 shows the state of CCR and EXR after execution of trace exception handling.
Interrupts are accepted even within the trace exception handling routine.
The T bit saved on the stack retains its value of 1, and when control is returned from the trace
exception handling routine by the RTE instruction, trace mode resumes.
Trace exception handling is no t carried out after execution of the RTE instruction.
Table 4.3 Status of CCR and EXR a fter Trace Exception Handling
CCR EXR
Interrupt Control Mode I UI I2 to I0 T
0 Trace exception handling cannot be used.
2 1 — — 0
Legend:
1: Set to 1
0: Cleared to 0
—: Retains value prior to execution.
Section 4 Exception Handling
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4.4 Interrupts
Interrup t exception handling can be requested b y nine e xternal sources (NMI, IRQ7 t o IRQ 0) and
52 internal sources in the on-chip supporting modules. Figure 4.3 classifies the interrupt sources
and the number of interrupts of each type.
The on-chip supporting modules that can request interrupts include the watchdog timer (WDT),
refresh timer*, 16-bit timer-pulse unit (TPU), 8-bit timer, serial communication interface (SCI),
data transfer controller (DTC), DMA controller (DMAC)*, and A/D converter. Each interrupt
source has a separate vector address.
NMI is the highest-priority interrupt. Interrupts are controlled by the interrupt controller. The
interrupt controller has two interrupt control modes and can assign interrupts other than NMI to
eight priority/mask levels to enable multiplexed interrupt control.
For details of interrupts, see sectio n 5, Interrupt Controller.
Note: * The refresh timer and DMAC are not supported in the H8S/2321.
Interrupts
External
interrupts
Internal
interrupts
NMI (1)
IRQ7 to IRQ0 (8)
WDT
*1
(1)
Refresh timer
*2 *3
(1)
TPU (26)
8-bit timer (6)
SCI (12)
DTC (1)
DMAC (4)
*3
A/D converter (1)
Notes: Numbers in parentheses are the numbers of interrupt sources.
1. When the watchdog timer is used as an interval timer, it generates an interrupt request
at each counter overflow.
2. When the refresh timer is used as an interval timer, it generates an interrupt request at
each compare match.
3. The refresh timer and DMAC are not supported in the H8S/2321.
Figure 4.3 Interrupt Sources and Number of Interrupts
Section 4 Exception Handling
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4.5 Trap Instruction
Trap instruction exception han dling starts when a TRAPA instruction is executed. Trap instruction
exception handling can be executed at all times in the program execution state.
The TRAPA instruction fetches a start address from a vector table entry corresponding to a vector
number from 0 to 3, as specified in the instruction code.
Table 4.4 shows the status of CCR and EXR after execution of trap instruction exception handling.
Table 4.4 Status of CCR and EXR a fter Trap Instruction E xception Ha ndling
CCR EXR
Interrupt Control Mode I UI I2 to I0 T
0 1 — — —
2 1 — — 0
Legend:
1: Set to 1
0: Cleared to 0
—: Retains value prior to execution.
4.6 Stack Status after Exception Handling
Figure 4.4 shows the stack after completion of trap instruction exception handling and interrupt
exception handli ng.
SP
SP CCR
PC
(24 bits)
CCR
PC
(24 bits)
Reserved*
EXR
(a) Interrupt control mode 0 (b) Interrupt control mode 2
Note: * Ignored on return.
Figure 4.4 Stack Status after Exception Handling (Advanced Modes)
Section 4 Exception Handling
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4.7 Notes on Use of the Stack
When accessing word data or longword data, the chip assumes that the lowest address bit is 0. The
stack should always be accessed by word transfer instruction or longword transfer instruction, and
the value of the stack pointer (SP, ER7) should always be kept even. Use the following
instructions to save registers:
PUSH.W Rn (or MOV.W Rn, @-SP)
PUSH.L ERn (or MOV.L ERn, @-SP)
Use the following instructions to resto re registers:
POP.W Rn (or MOV.W @SP+, Rn)
POP.L ERn (or MOV.L @SP+, ERn)
Setting SP to an odd value may lead to a malfunction. Figure 4.5 shows an example of what
happens when the SP value is odd.
SP
Legend:
CCR: Condition code register
PC: Program counter
R1L: General register R1L
SP: Stack pointer
Note: This diagram illustrates an example in which the interrupt control mode is 0, in advanced
mode.
SP
SP
CCR
PC
R1L
PC
H'FFFEFA
H'FFFEFB
H'FFFEFC
H'FFFEFD
MOV.B R1L, @–ER7
SP set to H'FFFEFF
TRAP instruction executed
Data saved above SP Contents of CCR lost
Figure 4.5 Operation when SP Value is Odd
Section 4 Exception Handling
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Section 5 Interrupt Controller
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Section 5 Interrupt Controller
5.1 Overview
5.1.1 Features
The chip controls interrupts by means of an interrupt controller. The interrupt controller has the
following features. This chapter assumes the maximum number of interrupt sources available in
these series—nine external interrupts and 52 internal interrupts.
• Two interrupt control modes
⎯ Either of two interrupt control modes can be set by means of the INTM1 and INTM0 bits
in the system control register (SYSCR)
• Priorities settable with IPRs
⎯ Interrupt priority registers (IPRs) are provided for setting interrupt priorities. Eight priority
levels can be set for each module for all interrupts except NMI
⎯ NMI is assigned the highest priority level of 8, and can be accepted at all times
• Independent vector addresses
⎯ All interrupt sources are assigned independent vector addresses, making it unnecessary for
the source to be identified in the interrupt handling routine
• Nine external interrupt pins
⎯ NMI is the highest-priority interrupt, and is accepted at all times. Rising edge or falling
edge can be selected for NMI
⎯ Falling edge, rising edge, or both edge detection, or level sensing, can be selected for IRQ7
to IRQ0
• DTC and DMAC* control
⎯ DTC and DMAC* activation i s controlled b y means of interrupts
Note: * The DMAC is not supported in the H8S/2321.
Section 5 Interrupt Controller
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5.1.2 Block Diagram
A block diagram of the interrupt controller is shown in figure 5.1.
NMI input
IRQ input
Internal interrupt
request
SWDTEND to TEI
INTM1 INTM0
NMIEG
NMI input unit
IRQ input unit
ISR
ISCR IER
IPR
Interrupt controller
Priority
determination
Interrupt
request
Vector
number
I
I2 to I0 CCR
EXR
CPU
Legend:
ISCR: IRQ sense control register
IER: IRQ enable register
ISR: IRQ status register
IPR: Interrupt priority register
SYSCR: System control register
SYSCR
Figure 5.1 Block Diagram of Interrupt Controller
Section 5 Interrupt Controller
Rev.6.00 Sep. 27, 2007 Page 113 of 1268
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5.1.3 Pin Configuration
Table 5.1 summarizes the pins of the interrupt controller.
Table 5.1 Interrupt Controller Pins
Name Symbol I/O Function
Nonmaskable interrupt NMI Input Nonmaskable external interrupt; rising or
falling edge can be selected
External interrupt
requests 7 to 0 IRQ7 to IRQ0 Input Maskable external interrupts; rising, falling, or
both edges, or level sensing, can be selected
5.1.4 Register Configuration
Table 5.2 summarizes the registers of the interrupt controller.
Table 5.2 Interrupt Controller Registers
Name Abbreviation R/W Initial Value Address*1
System control regi ster SY SC R R/W H'01 H'FF39
IRQ sense con t rol re gister H ISCRH R/W H'00 H'FF2C
IRQ sense control register L ISCRL R/W H'00 H'FF2D
IRQ enable register IER R/W H'00 H'FF2E
IRQ status register ISR R/(W) *2 H'00 H'FF2F
Interrupt priority register A IPRA R/W H'77 H'FEC4
Interrupt priority register B IPRB R/W H'77 H'FEC5
Interrupt priority register C IPRC R/W H'77 H'FEC6
Interrupt priority register D IPRD R/W H'77 H'FEC7
Interrupt priority register E IPRE R/W H'77 H'FEC8
Interrupt priority register F IPRF R/W H'77 H'FEC9
Interrupt priority register G IPRG R/W H'77 H'FECA
Interrupt priority register H IPRH R/W H'77 H'FECB
Interrupt priority register I IPRI R/W H'77 H'FECC
Interrupt priority register J IPRJ R/W H'77 H'FECD
Interrupt priority register K IPRK R/W H'77 H'FECE
Notes: 1. Lower 16 bits of the address.
2. Can only be written with 0 for flag clearing.
Section 5 Interrupt Controller
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5.2 Register Descriptions
5.2.1 Syste m Control Register (SYSCR)
Bit : 7 6 5 4 3 2 1 0
— — INTM1 INTM0 NMIEG LWROD IRQPAS RAME
Initial value : 0 0 0 0 0 0 0 1
R/W : R/W — R/W R/W R/W R/W R/W R/W
SYSCR is an 8-bit readable/writable register that selects the interrupt control mode, and the
detected edge for NMI.
Only bits 5 to 3 are described here; for details of the other bits, see section 3, MCU Operating
Modes.
SYSCR is initialized to H'01 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 5 and 4—Interrupt Cont rol Mode 1 and 0 (INTM1, INTM0): These bits select one of two
interrupt control modes for the interrupt controller.
Bit 5
INTM1 Bit 4
INTM0 Interrupt
Control Mode
Description
0 0 0 Interrupts are controlled by I bit (Initial value)
1 — Setting prohibited
1 0 2 Interrupts are controlled by bits I2 to I0, and IPR
1 — Setting prohibited
Bit 3—NMI Edge Select (NMIEG): Selects the input edge for the NMI pin.
Bit 3
NMIEG
Description
0 Interrupt request generated at falling edge of NMI input (Initial value)
1 Interrupt request generated at rising edge of NMI input
Bit 1— IRQ Input Pin Select (IRQPAS): Selects switching of the pins that can be used for input
of IRQ4 to IRQ7. IRQ4 to IRQ7 input is always performed from one of the ports.
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5.2.2 Interrupt Priority Registers A to K (IPRA to IPRK)
Bit : 7 6 5 4 3 2 1 0
— IPR6 IPR5 IPR4 — IPR2 IPR1 IPR0
Initial value : 0 1 1 1 0 1 1 1
R/W : — R/W R/W R/W — R/W R/W R/W
The IPR registers are eleven 8-bit readable/ writable registers that set priorities (level s 7 to 0) for
interrupts other than NMI.
The correspondence between IPR settings and interrupt so urces is shown in table 5.3.
The IPR registers set a priority (levels 7 to 0) for each interrupt source other than NMI.
The IPR registers are initialized to H'77 b y a reset and in hardware standby mode.
Bits 7 and 3—Reserved: Read-only bits, always read as 0.
Table 5.3 Correspondence between Interrupt Sources and IPR Settings
Bits
Register 6 to 4 2 to 0
IPRA IRQ0 IRQ1
IPRB IRQ2
IRQ3 IRQ4
IRQ5
IPRC IRQ6
IRQ7 DTC
IPRD Watchdog timer Refresh timer
IPRE —*1 A/D converter
IPRF TPU channel 0 TPU channel 1
IPRG TPU channel 2 TPU channel 3
IPRH TPU channel 4 TPU channel 5
IPRI 8-bit timer channel 0 8-bit timer channel 1
IPRJ DMAC*2 SCI channel 0
IPRK SCI channel 1 SCI channel 2
Notes: 1. Reserved bits.
2. The refresh timer and DMAC are not supported in the H8S/2321.
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As shown in table 5.3, multiple interrupts are assigned to o ne IPR. Setting a value in the range
from H'0 to H'7 in the 3-bit groups of bits 6 to 4 and 2 to 0 sets the priority of the corresponding
interrupt. The lowest priority level, level 0, is assigned by setting H'0, and the highest priorit y
level, level 7, by setting H '7.
When interrupt requests are generated, the highest-priority interrupt according to the priority
levels set in the IPR registers is selected. This interrupt level is then compared with the interrupt
mask level set by the interrupt mask bits (I2 to I0) in the extend register (EXR) in the CPU, and if
the priority level of the interrupt is higher than the set mask level, an interrupt request is issued to
the CPU.
5.2.3 IRQ Enable Register (IER)
Bit : 7 6 5 4 3 2 1 0
IRQ7E IRQ6E IRQ5E IRQ4E IRQ3E IRQ2E IRQ1E IRQ0E
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
IER is an 8-bit readable/writable register that controls enabling and disabling of interrupt requests
IRQ7 to IRQ0.
IER is initialized to H'00 b y a reset and in hardware standby mode.
Bits 7 to 0—IRQ7 to IRQ0 Enable (IRQ7E to IRQ0E): These bits select whether IRQ7 to
IRQ0 are enabled or disabled.
Bit n
IRQnE
Description
0 IRQn interrupts disabled (Initial value)
1 IRQn interrupts enabled (n = 7 to 0)
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5.2.4 IRQ Sense Contro l Registers H and L (ISCRH, ISCRL)
ISCRH
Bit : 15 14 13 12 11 10 9 8
IRQ7SCB IRQ7SCA IRQ6SCB IRQ6SCA IRQ5SCB IRQ5SCA IRQ4SCB IRQ4SCA
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
ISCRL
Bit : 7 6 5 4 3 2 1 0
IRQ3SCB IRQ3SCA IRQ2SCB IRQ2SCA IRQ1SCB IRQ1SCA IRQ0SCB IRQ0SCA
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
ISCR (composed of ISCRH and ISCRL) is a 16-bit readable/writable register that selects rising
edge, falling edge, or both edge detection, or level sensing, for the input at pins IRQ7 to IRQ0.
ISCR is initialized to H'0000 by a reset and in hardware standby mode.
Bits 15 to 0 —IRQ7 Sense Cont rol A and B (IRQ7SCA, IRQ7SCB) t o IRQ0 Sense Cont rol A
and B (IRQ0SCA, IRQ0SCB )
Bits 15 to 0
IRQ7SCB to
IRQ0SCB IRQ7SCA to
IRQ0SCA
Description
0 0 Interrupt request generated at IRQ7 to IRQ0 input low level
(Initial value)
1 Interrupt request generated at falling edge of IRQ7 to IRQ0 input
1 0 Interrupt request generated at rising edge of IRQ7 to IRQ0 input
1 Interrupt request generated at both falling and rising edges of
IRQ7 to IRQ0 input
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5.2.5 IRQ Status Register (ISR)
Bit : 7 6 5 4 3 2 1 0
IRQ7F IRQ6F IRQ5F IRQ4F IRQ3F IRQ2F IRQ1F IRQ0F
Initial value : 0 0 0 0 0 0 0 0
R/W : R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)*
Note: * Only 0 can be written, to clear the flag.
ISR is an 8-bit readable/writable register that indicates the status of IRQ7 to IRQ0 interrupt
requests.
ISR is initialized to H'00 by a reset and in hardware standby mode.
Bits 7 to 0—IRQ7 to IRQ0 flags (IRQ7F to IRQ0F): These bits indicate the status of IRQ7 to
IRQ0 interrupt requests.
Bit n
IRQnF
Description
0 [Clearing conditions] (Initial value)
• Cleared by reading IRQnF flag when IRQnF = 1, then writing 0 to IRQnF flag
• When interrupt ex ception hand ling is executed when low-lev el detect ion is set
(IRQnSCB = IRQnSCA = 0) and IRQn input is high
• When IRQn interrupt exception handling is executed when falling, rising, or both-
edge detection is set (IRQnSCB = 1 or IRQnSCA = 1)
• When the DTC is activated by an IRQn interrupt, and the DISEL bit in MRB of the
DTC is cleared to 0
1 [Setting conditions]
• When IRQn input goes low when low-level detection is set (IRQnSCB = IRQnSCA =
0)
• When a falling edge occurs in IRQn input when falling edge detection is set
(IRQnSCB = 0, IRQnSCA = 1)
• When a rising edge occurs in IRQn input when rising edge detection is set
(IRQnSCB = 1, IRQnSCA = 0)
• When a falling or rising edge occurs in IRQn input when both-edge detection is set
(IRQnSCB = IRQnSCA = 1) (n = 7 to 0)
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5.3 Interrupt Sources
Interrupt sources comprise external interrupts (NMI and IRQ7 to IRQ0) and internal interrupts (52
sources).
5.3.1 External Interrupts
There are nine external interrupts: NMI and IRQ7 to IRQ0. NMI and IRQ7 to IRQ0 can be used to
restore the chip from software standby mode. (IRQ7 to IRQ3 can be designated for use as software
standby mode clearing sources b y setting the IRQ37S bit in SBYCR to 1.)
NMI Int errupt: NMI is the highest-priority interrupt, and is always accepted by the CPU
regardless of the status of the CPU interrupt mask bits. The NMIEG bit in SYSCR can be used to
select whether an interrupt is requested at a rising edge or a falling edge on the NMI pin.
The vector number for NMI interrupt exception handling is 7.
IRQ7 to IRQ0 Interrupts: Interrupts IRQ7 to IRQ0 are requested by an input signal at pins
IRQ7 to IRQ0. Interrupts IRQ7 to IRQ0 have the following features:
• Using ISCR, it is possib le to select whether an interrupt is generated by a low level, falling
edge, rising edge, or bot h edges, at pi ns IRQ7 to IRQ0.
• Enabling or disabling of interrupt requests IRQ7 to IRQ0 can be selected with IER.
• The interrupt priority level can be set with IPR.
• The status of interrupt requests IRQ7 to IRQ0 is indicated in ISR. ISR flags can be cleared to 0
by software.
A block diagram of interrupts IRQ7 to IRQ0 is shown in figure 5.2.
Section 5 Interrupt Controller
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IRQn interrupt
request
IRQnE
IRQnF
S
R
Q
Clear signal
Edge/level
detection circuit
IRQnSCA, IRQnSCB
IRQn input
Note: n = 7 to 0
Figure 5.2 Block Diagram of Interrupts IRQ7 to IRQ0
Figure 5.3 sho ws the timing of setting IRQnF.
φ
IRQn
input pin
IRQnF
Figure 5.3 Timing of Setting IRQnF
The vector numbers for IRQ7 to IRQ0 interrupt exception handling are 23 to 16.
Detection of IRQ7 to IRQ0 int errupts does not depend o n whether the relevant pin has been se t for
input or output. Therefore, when a pin is used as an external interrupt input pin, do not clear the
corresponding DDR bit to 0 and use the pin as an I/O pin for another function. The pins that can
be used for IRQ4 to IRQ7 interrupt input can be s witched b y means of the IRQPAS bit in SYSCR.
Section 5 Interrupt Controller
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5.3.2 Internal Interrupts
There are 52 sources for internal interrupts from on-chip supporting modules.
• For each on-chip supporting module there are flags that indicate the interrupt request status,
and enable bits that select enabling or disabling of these interrupts. If both of these are set to 1
for a particular interrupt source, an interrupt request is issued to the interrupt controller.
• The interrupt priority level can be set b y means of IPR.
• The DMAC* and DTC can be activated by a TPU, SCI, or other interrupt request. When the
DMAC* or DTC is activated b y an interrupt, the interrupt control mode and interrupt mask bits
have no effe ct.
Note: * The DMAC is not supported in the H8S/2321.
5.3.3 Interrupt Exception Vector Table
Table 5.4 shows interrupt exception handling sources, vector add resses, and interrupt priorities.
For default priorities, the lower the vector number, the higher the priority. Interrupt sources can
also be used to activate the DTC and DMAC*.
Priorities among modules can be set by mea ns of IP R. The situation when two o r more modules
are set to the same priority, and p riorities within a module, are fixed as sho wn in table 5.4 .
Note: * The DMAC is not supported in the H8S/2321.
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Table 5.4 Interrupt Sources, Vector Addresses, and Interrupt Priorities
Interrupt Source
Origin of
Interrupt
Source
Vector
Number
Vector
Address*1
IPR
Priority
DTC
Activa-
tion
DMAC*2
Activa-
tion
Power-on reset 0 H'0000 — High — —
Reserved 1 H'0004
Reserved for system 2 H'0008
use 3 H'000C
4 H'0010
Trace 5 H'0014
Reserved for system
use 6 H'0018
NMI External
pin 7 H'001C
8 H'0020 Trap instruction
(4 sources) 9 H'0024
10 H'0028
11 H'002C
12 H'0030
13 H'0034
Reserved for system
use
14 H'0038
15 H'003C
IRQ0 External
pin 16 H'0040 IPRA6 to
IPRA4 —
IRQ1 17 H'0044 IPRA2 to
IPRA0 —
IRQ2 18 H'0048 IPRB6 to —
IRQ3 19 H'004C
IPRB4 —
IRQ4 20 H'0050 IPRB2 to —
IRQ5 21 H'0054
IPRB0 —
IRQ6 22 H'0058 IPRC6 to —
IRQ7 23 H'005C
IPRC4 Low —
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Interrupt Source
Origin of
Interrupt
Source
Vector
Number
Vector
Address*1
IPR
Priority
DTC
Activa-
tion
DMAC*2
Activa-
tion
SWDTEND (software-
activated data transfer
end)
DTC 24 H'0060 IPRC2 to
IPRC0 High —
WOVI (interval timer) Watchdog
timer 25 H'0064 IPRD6 to
IPRD4 — —
CMI (compare match)*3Refresh
controller 26 H'0068 IPRD2 to
IPRD0 — —
Reserved — 27 H'006C IPRE6 to
IPRE4 — —
ADI (A/D conversion
end) A/D 28 H'0070 IPRE2 to
IPRE0
Reserved — 29
30
31
H'0074
H'0078
H'007C
— —
TGI0A (TGR0A input
capture/compare
match)
TPU
channel 0 32 H'0080 IPRF6 to
IPRF4
TGI0B (TGR0B input
capture/compare
match)
33 H'0084 —
TGI0C (TGR0C input
capture/compare
match)
34 H'0088 —
TGI0D (TGR0D input
capture/compare
match)
35 H'008C —
TCI0V (overflow 0) 36 H'0090 — —
Reserved — 37 H'0094 — —
38 H'0098
39 H'009C Low
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Interrupt Source
Origin of
Interrupt
Source
Vector
Number
Vector
Address*1
IPR
Priority
DTC
Activa-
tion
DMAC*2
Activa-
tion
TGI1A (TGR1A input
capture/compare
match)
TPU
channel 1 40
H'00A0
IPRF2 to
IPRF0 High
TGI1B (TGR1B input
capture/compare
match)
41
H'00A4
—
TCI1V (overflow 1) 42 H'00A8 — —
TCI1U (underflow 1) 43 H'00AC — —
TGI2A (TGR2A input
capture/compare
match)
TPU
channel 2 44
H'00B0
IPRG6 to
IPRG4
TGI2B (TGR2B input
capture/compare
match)
45
H'00B4
—
TCI2V (overflow 2) 46 H'00B8 — —
TCI2U (underflow 2) 47 H'00BC — —
TGI3A (TGR3A input
capture/compare
match)
TPU
channel 3 48 H'00C0 IPRG2 to
IPRG0
TGI3B (TGR3B input
capture/compare
match)
49 H'00C4
—
TGI3C (TGR3C input
capture/compare
match)
50
H'00C8
—
TGI3D (TGR3D input
capture/compare
match)
51 H'00CC
—
TCI3V (overflow 3) 52 H'00D0 — —
Reserved — 53
54
55
H'00D4
H'00D8
H'00DC
Low
— —
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Interrupt Source
Origin of
Interrupt
Source
Vector
Number
Vector
Address*1
IPR
Priority
DTC
Activa-
tion
DMAC*2
Activa-
tion
TGI4A (TGR4A input
capture/compare
match)
TPU
channel 4 56 H'00E0 IPRH6 to
IPRH4 High
TGI4B (TGR4B input
capture/compare
match)
57 H'00E4
—
TCI4V (overflow 4) 58 H'00E8 — —
TCI4U (underflow 4) 59 H'00EC — —
TGI5A (TGR5A input
capture/compare
match)
TPU
channel 5 60 H'00F0 IPRH2 to
IPRH0
TGI5B (TGR5B input
capture/compare
match)
61 H'00F4
—
TCI5V (overflow 5) 62 H'00F8 — —
TCI5U (underflow 5) 63 H'00FC — —
CMIA0 (compare
match A) 8-bit timer
channel 0 64 H'0100 IPRI6 to
IPRI4 —
CMIB0 (compare
match B) 65 H'0104 —
OVI0 (overflow 0) 66 H'0108 — —
Reserved — 67 H'010C — —
CMIA1 (compare
match A) 8-bit timer
channel 1 68 H'0110 IPRI2 to
IPRI0 —
CMIB1 (compare
match B) 69 H'0114 —
OVI1 (overflow 1) 70 H'0118 — —
Reserved — 71 H'011C Low — —
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Interrupt Source
Origin of
Interrupt
Source
Vector
Number
Vector
Address*1
IPR
Priority
DTC
Activa-
tion
DMAC*2
Activa-
tion
DEND0A (channel
0/channel 0A transfer
end)*3
DMAC 72 H'0120 IPRJ6 to
IPRJ4 High —
DEND0B (channel 0B
transfer end) *3 73 H'0124
—
DEND1A (channel
1/channel 1A transfer
end) *3
74
H'0128
—
DEND1B (channel 1B
transfer end) *3 75 H'012C
—
Reserved — 76
77
78
79
H'0130
H'0134
H'0138
H'013C
— —
ERI0 (receive error 0) 80 H'0140 IPRJ2 to — —
RXI0 (reception data
full 0)
SCI
channel 0 81 H'0144
IPRJ0
TXI0 (transmit data
empty 0) 82 H'0148
TEI0 (transmit end 0) 83 H'014C — —
ERI1 (receive error 1) 84 H'0150 IPRK6 to — —
RXI1 (reception data
full 1)
SCI
channel 1 85 H'0154
IPRK4
TXI1 (transmit data
empty 1) 86 H'0158
TEI1 (transmit end 1) 87 H'015C — —
ERI2 (receive error 2) 88 H'0160 IPRK2 to — —
RXI2 (reception data
full 2)
SCI
channel 2 89 H'0164
IPRK0 —
TXI2 (transmit data
empty 2) 90 H'0168 —
TEI2 (transmit end 2) 91 H'016C Low — —
Notes: 1. Lower 16 bits of the start address.
2. The DMAC is not supported in the H8S/2321.
3. Reserved in the H8S/2321.
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5.4 Interrupt Operation
5.4.1 Int errupt Control Modes a nd Interrupt O peration
Interrupt operations in the chip differ depending on the interrupt control mode.
NMI interrupts are accepted at all times except in the reset state and the hardware standby state. In
the case of IRQ interrupts and on-chip supporting module interrupts, an enable bit is provided for
each interrupt. Clearing an enable bit to 0 disables the corresponding interrupt request. Interrupt
sources for which the enable bits are set to 1 are controlled by the interrupt controller.
Table 5.5 shows the interrupt control modes.
The interrupt controller performs interrupt control according to the interrupt control mode set by
the INTM1 and INTM0 bits in SYSCR, the priorities se t in IPR, and the masking state indicated
by the I bit in the CPU’s CCR, and bits I2 to I0 in EXR.
Table 5.5 Interrupt Control Modes
SYSCR
Interrupt
Control Mode INTM1 INTM0 Priority Setting
Registers Interrupt
Mask Bits Description
0 0 0 — I Interrupt mask control is
performed by the I bit.
— 1 — — Setting prohibited
2 1 0 IPR I2 to I0 8-level interrupt mask contr ol
is performed by bits I2 to I0.
8 priority levels can be set
with IPR.
— 1 — — Setting prohibited
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Figure 5.4 shows a block diagram of the priority decision circuit.
Interrupt
acceptance
control
8-level
mask control
Default priority
determination Vector numbe
r
Interrupt control mode 2
IPR
Interrupt source
I2 to I0
Interrupt
control
mode 0 I
Figure 5.4 Block Diagram of Interrupt Control Operation
Interrupt Acceptance Control: In interrupt control mode 0, interrupt acceptance is controlled by
the I bit in CCR.
Table 5.6 shows the interrupts selected in each interrupt control mode.
Table 5.6 Interrupts Selected in Each Interrupt Control Mode (1)
Interrupt Mask Bits
Interrupt Control Mode I Selected Interrupts
0 0 All interrupts
1 NMI interrupts
2 * All interrupts
*: Don't care
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8-Level Control: In interrupt control mode 2, 8-level mask level determination is performed for
the selected interrupts in interrupt acceptance control according to the interrupt priority level
(IPR).
The interrupt source selected is the interrupt with the highest priority level, and whose priority
level set in IPR is higher than the mask level.
Table 5.7 Interrupts Selected in Each Interrupt Control Mode (2)
Interrupt Control Mode Selected Interrupts
0 All interrupts
2 Highest-priority-level (IPR) interrupt whose priority level is greater
than the mask level (IPR > I2 to I0)
Default Priority Determination: When an interrupt is selec ted b y 8-level control, its p r iority is
determined and a vector number is generated.
If the same value is set for IPR, acceptance of multiple interrupts is enabled, and so only the
interrupt source with the highest priority according to the preset d efault p r iorities is selected and
has a vector nu mber generate d.
Interrupt sources with a lower priority than the accepted interrupt source are held pending.
Table 5.8 shows operations and control signal functions in each interrupt control mode.
Table 5.8 Operatio ns and Control Sig nal Functions in Each Interrupt Control Mode
Setting Interrupt
Acceptance
Control 8-Level Control
Interrupt
Control
Mode INTM1 INTM0 I I2 to I0 IPR
Default Priority
Determination T (Trace)
0 0 0 IM X — —*2 —
2 1 0 X —*1 IM PR T
Legend:
: Interrupt operation control performed
X: No operation (All interrupts enabled)
IM: Used as interrupt mask bit
PR: Sets priority
—: Not used
Notes: 1. Set to 1 when interrupt is accepted.
2. Keep the initial setting.
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5.4.2 Interrupt Control Mode 0
Enabling and disabling of IRQ interrupts and on-chip supporting module interrupts can be set by
means of the I bit in the CPU’s CCR. Interrupts are enabled when the I bit is cleared to 0, and
disabled when set to 1.
Figure 5.5 shows a flowchart of the interrupt acceptance operation in this case.
[1] If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an
interrupt request is sent to the interrupt controller.
[2] T he I bit is then referenced. If the I bit is cleared to 0, the interrupt request is accepted. If the I
bit is set to 1, only an NMI interrupt is accepted, and other interrupt requests are held pending.
[3] Interrupt requests are sent to the interrupt controller, the highest-ranked interrupt according to
the priority system is accepted, and other interrupt requests are held pending.
[4] When an interrupt request is accepted, interrupt exception handling starts after execution of the
current instruction has been completed.
[5] The PC a nd CCR are saved to the stack area by interr upt exc eption handli ng. The PC saved on
the stack shows the address of the first instruction to be executed after returning from the
interrupt handling routine.
[6] Next, the I bit in CCR is set to 1. T his masks all interrupts except NMI.
[7] A vector address is generated for the accepted interrupt, and execution of the interrupt
handling routine starts at the address indicated by the contents of that vector address.
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Program execution state
Interrupt generated?
NMI?
IRQ0?
IRQ1?
TEI2?
I = 0?
Save PC and CCR
I ← 1
Read vector address
Branch to interrupt handling routine
Yes
No
Yes
Yes
Yes No
No
No
Yes
Yes
No
Hold pending
Figure 5.5 Flowchart of Procedure Up to Interrupt Acceptance in
Interrupt Control Mode 0
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5.4.3 Interrupt Control Mode 2
Eight-level masking is implemented for IRQ interrupts and on-chip supporting module interrupts
by comparing the interrupt mask level set by bits I2 to I0 of EXR in the CPU with IPR.
Figure 5.6 shows a flowchart of the interrupt acceptance operation in this case.
[1] If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an
interrupt request is sent to the interrupt controller.
[2] When interrupt requests are sent to the interrupt controller, the interrupt with the highest
priority according to the interrupt priority levels set in IPR is selected, and lower-priority
interrupt requests are held pending. If a number of interrupt requests with the same priority are
generated at the same time, the interrupt request with the highest priority according to the
priority system sho wn in table 5.4 is selected.
[3] Next, the priorit y of the selected interrupt request is compared with the interrupt mask level set
in EXR. An interrupt request with a priority no higher than the mask level set at that time is
held pending, and only an interrupt request with a priority higher than the interrupt mask level
is accepted.
[4] When an interrupt request is accepted, interrupt exception handling starts after execution of the
current instruction has been completed.
[5] The PC, CCR, and EXR are saved to the stack area by inte rrupt exception handli ng. The PC
saved on the stack shows the address of the first instruction to be executed after returning from
the interrupt handling routine.
[6] The T bit in EXR is cleared to 0. The interrupt mask level is re written with the priorit y level o f
the accepted interrupt.
If the accepted interrupt is NMI, the interrupt mask level is set to H'7.
[7] A vector address is generated for the accepted interrupt, and execution of the interrupt
handling routine starts at the address indicated by the contents of that vector address.
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Yes
Program execution state
Interrupt generated?
NMI?
Level 6 interrupt?
Mask level 5
or below?
Level 7 interrupt?
Mask level 6
or below?
Save PC, CCR, and EXR
Clear T bit to 0
Update mask level
Read vector address
Branch to interrupt handling routine
Hold pending
Level 1 interrupt?
Mask level 0?
Yes
Yes
No Yes
Yes
Yes
No
Yes
Yes
No
No
No
No
No
No
Figure 5.6 Flowchart of Procedure Up to Interrupt Acceptance in
Interrupt Control Mode 2
Section 5 Interrupt Controller
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5.4.4 Interrupt Exception Handling Sequence
Figure 5.7 shows the interrupt exception handling sequence. The example shown is for the case
where interrupt control mode 0 is set in advanced mode, and the program area and stack area are
in on-chip memory.
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(14)(12)(10)(8)
(6)(4)(2)
(1) (5)
(7) (9) (11) (13)
Interrupt handling
routine instruction
prefetch
Internal
operation
Vector fetchStack
Instruction
prefetch Internal
operation
Interrupt
acceptance
Interrupt level determination
Wait for end of instruction
Interrupt
request signal
Internal
address bus
Internal
read signal
Internal
write signal
Internal
data bus
φ
(3)
(1)
(2), (4)
(3)
(5)
(7)
Instruction prefetch address (Not executed.
This is the contents of the saved PC, the return address.)
Instruction code (Not executed.)
Instruction prefetch address (Not executed.)
SP-2
SP-4
Saved PC and saved CCR
Vector address
Interrupt handling routine start address (vector
address contents)
Interrupt handling routine start address ((13) = (10), (12))
First instruction of interrupt handling routine
(6), (8)
(9), (11)
(10), (12)
(13)
(14)
Figure 5.7 Interrupt Exception Handling
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5.4.5 Interrupt Response Times
The chip is capable of fast word transfer instruction to o n -chip memor y, and the program area is
provided in on-chip ROM and the stack area in on-chip RAM, enabling high-speed processing.
Table 5.9 shows interrupt response times—the interval between generation of an interrupt request
and execution of the first instruction in the interrupt handling routine. The execution status
symbols used in table 5.9 are explained in table 5.10.
Table 5.9 Interrupt Response Times
Advanced Mode
No. Item INTM1 = 0 INTM1 = 1
1 Interrupt priority determination*1 3 3
2 Number of wait states until executing
instruct ion end s*2 1 to (19 + 2·SI) 1 to (19 + 2·SI)
3 PC, CCR, EXR stack save 2·SK 3·SK
4 Vector fetch 2·SI 2·SI
5 Instruction fetch*3 2·SI 2·SI
6 Internal processing*4 2 2
Total (using on-chip me mory ) 12 to 32 13 to 33
Notes: 1. Two states in case of internal interrupt.
2. Refers to MULXS and DIVXS instructions.
3. Prefetch after interrupt acceptance and interrupt handling routine prefetch.
4. Internal processing after interrupt acceptance and internal processing after vector fetch.
Table 5.10 Number of States in Interrupt Handling Routine Execution
Object of Access
External Device
8-Bit Bus 16-Bit Bus
Symbol Internal
Memory 2-State
Access 3-State
Access 2-State
Access 3-State
Access
Instruction fetch SI 1 4 6 + 2m 2 3 + m
Branch address read SJ
Stack manipulation SK
Legend:
m: Number of wait states in an external device access.
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5.5 Usage Notes
5.5.1 Contention between Interrupt Generation and Disabling
When an interrupt enable bit is cleared to 0 to disable interrupts, the disabling becomes effective
after execution of the instruction.
In other words, when an interrupt enable bit is cleared to 0 by an instruction such as BCLR or
MOV, if an interrupt is generated during execution of the instruction, the interrupt concerned will
still be enabled on completion o f the instr uction, and so interrupt exception handli ng for that
interrupt will be executed on completion of the instruction. However, if there is an interrupt
request of higher priority than that interrupt, interrupt exception handling will be executed for the
higher-priority interrupt, and the lower-priority interrupt will be ignored.
The same also applies when an interrupt source flag is cleared.
Figure 5.8 shows an example in which the TGIEA bit in the TPU’s TIER0 register is cleared to 0.
Internal
address bus
Internal
write signal
φ
TGIEA
TGFA
TGI0A
interrupt signal
TIER0 write cycle by CPU TGI0A exception handling
TIER0 address
Figure 5.8 Contention between Interrupt Generation and Disabling
The above contention will not occur if an enable bit or interrupt source flag is cleared to 0 while
the interrupt is masked.
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5.5.2 Instruct ions that Disable Interr upts
Instructions that disable interrupts are LDC, ANDC, ORC, and XORC. After any of these
instructions is executed, all int errupts includin g NMI are dis abled and the next instruction is
always executed. When the I bit is set by one of these instructions, the new value becomes valid
two states after execution of the instruction ends.
5.5.3 Times w hen Interrupts Are Disabled
There are times when interrupt acceptance is disabled by the interrupt controller.
The interrupt controller disables interrupt acceptance for a 3-state period after the CPU has
updated the mask level with an LDC, ANDC, ORC, or XORC instr uction.
5.5.4 Interrupts during Execut ion of EEPMOV Inst ruction
Interrupt operation differs between the EEPMOV.B instruction and the EEPMOV.W instruction.
With the EEPMOV.B instruction, an interrupt request (inclu ding NMI) issued during the transfer
is not accepted until the move is completed.
With the EEPMOV.W instruction, if an interrupt request is is sued d uri ng the transfer, interrupt
exception handling starts at a break in the transfer cycle. The PC value saved on the stack in this
case is the address of the next instruction.
Therefore, if an interrupt is generated during execution of an EEPMOV.W instruction, the
following coding should be used.
L1: EEPMOV.W
MOV.W R4,R4
BNE L1
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5.6 DTC and DMAC Activation by Interrupt
5.6.1 Overview
The DTC and DMAC* can be activated by an interrupt. In this case, the following options are
available.
1. Interrupt request to CPU
2. Activatio n request to DTC
3. Activation request to DMAC*
4. Selection of a number of the above
For details of interrupt requests that can be used with to activate the DTC o r DMAC*, see section
8, Data Transfer Controller, and section 7, DM A Controller.
Note: * The DMAC is not supported in the H8S/2321.
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5.6.2 Block Diagram
Figure 5.9 shows a block diagram of the DTC, DMAC*, and interrupt controller.
Note: * The DMAC is not supported in the H8S/2321.
DMAC*
Selection
circuit
DTCER
DTVECR
Control logic
Determination of
priority CPU
DTC
DTC activation
request vector
number
Clear signal
CPU interrupt
request vector
number
Select
signal
Interrupt
request
Interrupt source
clear signal
IRQ
interrupt
Note: * The DMAC is not supported in the H8S/2321.
On-chip
supporting
module
Disable signal
Clear signal
Clear signal
Interrupt controller I, I2 to I0
SWDTE
clear signal
Figure 5.9 Interrupt Control for DTC and DMAC*
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5.6.3 Operation
The interrupt controller has three main functions in DTC and DMAC * control.
Selection of Interrupt Source: With the DMAC*, the activation source is input directly to each
channel. The activation source for each DMAC* channel is selected with bits DTF3 to DTF0 in
DMACR. Whether the selected activation source is to be managed by the DMAC* can be selected
with the DTA bit of DMABCR. When the DTA bit is set to 1, the interrupt source constituting that
DMAC* activation source is not a DTC activation source or CPU interrupt source.
For interrupt sources other than interrupts managed by the DMAC*, it is possible to select DTC
activation request or CP U interrupt request with the DTCE bit o f DTCERA to DTCERF in the
DTC.
After a DTC data transfer, the DTCE bit can be cleared to 0 and an interrupt request sent to the
CPU in accordance with the specification of the DISEL bit of MRB in the DTC.
When the DTC has performed the specified number of data transfers and the transfer counter value
is zero, the DTCE bit is cleared to 0 and an interrupt request is sent to the CPU after the DTC data
transfer.
Determination of Priority: The DTC activation source is selected in accordance with the default
priority order, and is not affected by mask or priority levels. See section 7.6, Interrupts, and
section 8.3.3, DTC Vecto r T able, for the respective priorities.
With the DMAC*, the activation source is input directly to each channel.
Operation Order: If the same interrupt is selected as a DTC activation source and a CPU
interrupt source, the DTC data transfer is performed first, followed by CPU interrupt exception
handling.
If the same interrupt is selected as a DMAC* activation source and a DTC activation source or
CPU interrupt source, operations are performed for them independently according to their
respective operating statuses and bus mastership pr iorities.
Table 5.11 summarizes interrupt source selection and interrupt source clearance control according
to the settings of the DTA bit of DMABCR in the DMAC*, the DTCE bit of DTCERA to
DTCERF in the DT C, and the DISEL bit of MRB in the DTC.
Note: * The DMAC is not supported in the H8S/2321.
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Table 5.11 Interrupt Source Selection and Clearing Control
Settings
DMAC DTC Interrupt Source Selection/Clearing Control
DTA DTCE DISEL DMAC*1 DTC CPU
0 0 * X
1 0 X
1
1 * * X X
Legend:
: The relevant interrupt is used. Interru pt source clear ing is performed.
(The CPU should clear the source flag in the interrupt handling routine.)
: The relevant interrupt is used. The interrupt source is not cleared.
X: The relevant interrupt cannot be used.
*: Don't care
Note: 1. The DMAC is not supported in the H8S/2321.
Usage Note: SCI and A/D converter interrupt sources are cleared when the DMAC* or DTC reads
or writes to the prescribed register, and are not dependent upon the DTA bit or DISEL bit.
Note: * The DMAC is not supported in the H8S/2321.
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Section 6 Bus Controller
6.1 Overview
The chip has an on-chip bus controller (BSC) that manages the external address space divided into
eight areas. The bus specifications, such as bus width and number of access states, can be set
independently for each area, enabling multiple memories to be connected easily.
The bus controller also has a bus arbitration functio n, and controls the operation of the internal bus
masters: the CPU, DMA controller (DMAC)*, and data transfer controller (DTC).
Note: * The DMAC is not supported in the H8S/2321.
6.1.1 Features
The features of the bus controller are listed below.
• Manages external address space in area units
⎯ In advanced mode, manages the external space as 8 areas of 2 Mbytes
⎯ Bus specifications can be set independently for each area
⎯ DRAM*/burst ROM interfaces can be set
• Basic bus interface
⎯ Chip select (CS0 to CS7) can be output for areas 0 to 7
⎯ 8-bit access or 16-bit access can be selected for each area
⎯ 2-state access or 3-state access can be selected for each area
⎯ Program wait states can be inserted for each area
• DRAM interface*
⎯ DRAM interface can be set for areas 2 to 5 (in advanced mode)
⎯ Row address/col umn address multiplexed output (8/9/10 bits)
⎯ 2-CAS access method
⎯ Burst operation (fast page mode)
⎯ TP cycle insertion to secure RAS precharging time
⎯ Choice of CAS-before-RAS refreshing or self-refreshing
• Burst ROM interface
⎯ Burst ROM interface can be set for area 0
⎯ Choice of 1- or 2-state burst access
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• Idle cycle insertion
⎯ An idle cycle can be inserted in case of an external read cycle between different areas
⎯ An idle cycle can be inserted when an external read cycle is immediately followed by an
external write cycle
• Write buffer functions
⎯ External write cycle and internal access can be executed in parallel
⎯ DMAC* single address mode and internal access can be executed in parallel
• Bus arbitration function
⎯ Includes a bus arbiter that arbitrates bus mastership among the CPU, DMAC, and DTC
• Other features
⎯ Refresh counter (refresh timer)* can be used as an interval timer
⎯ External bus release function
Note: * The DRAM interface, DMAC, and refresh counter are not supported in the H8S/2321.
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6.1.2 Block Diagram
Figure 6.1 shows a block diagram of the bus controller.
Area decoder
Bus
controller
ABWCR
ASTCR
BCRH
BCRL
Internal
address bus
CS0 to CS7
External bus control signals
BREQ
BACK
BREQO Internal control
signals
Wait
controller WCRH
WCRL
Bus mode signal
DRAM
controller*
RTCNT
RTCOR
DRAMCR
MCR
Bus arbiter
CPU bus request signal
DTC bus request signal
DMAC bus request signal*
CPU bus acknowledge signal
DTC bus acknowledge signal
DMAC bus acknowledge signal*
External DRAM
signals*
Note: * Not supported in the H8S/2321.
WAIT
Internal data bus
Figure 6.1 Block Diagram of Bus Controller
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6.1.3 Pin Configuration
Table 6.1 summarizes the pins of the bus controller.
Table 6.1 Bus Controller Pins
Name Symbol I/O Function
Address strobe AS Output Strobe signal indicating that address output
on address bus is enabled.
Read RD Output Strobe signal indicating that external space
is being read.
High write/write enable HWR Output Strobe signal indicating that external space
is to be written, and upper half (D15 to D8) of
data bus is enabled .
2-CAS DRAM write enable signal*.
Low write LWR Output Strobe signal indicating that external space
is to be written, and lower half (D7 to D0) of
data bus is enabled .
Chip select 0 CS0 Output Strobe signal indicating that area 0 is
selected.
Chip select 1 CS1 Output Strobe signal indicating that area 1 is
selected.
Chip select 2/row address
strobe 2 CS2 Output Strobe signal indicating that area 2 is
selected.
DRAM row address strobe signal when
area 2 is in DRAM space*.
Chip select 3/row address
strobe 3 CS3 Output Strobe signal indicating that area 3 is
selected.
DRAM row address strobe signal when
area 3 is in DRAM space*.
Chip select 4/row address
strobe 4 CS4 Output Strobe signal indicating that area 4 is
selected.
DRAM row address strobe signal when
area 4 is in DRAM space*.
Chip select 5/row address
strobe 5 CS5 Output Strobe signal indicating that area 5 is
selected.
DRAM row address strobe signal when
area 5 is in DRAM space*.
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Name Symbol I/O Function
Chip select 6 CS6 Output Strobe signal indicating that area 6 is
selected.
Chip select 7 CS7 Output Strobe signal indicating that area 7 is
selected.
Upper column address strobe CAS* Output 2-CAS DRAM upper column address strobe
signal.
Lower column strobe LCAS* Output DRAM lower column address strobe signal.
Wait WAIT Input Wait request signal when accessing
external 3-state access space.
Bus request BREQ Input Request signal that releases bus to
external device.
Bus request acknowledge BACK Output Acknowledge signal indicat ing that bus has
been released.
Bus request output BREQO Output External bus request signal used when
internal bus master ac ces se s external
space when external bus is released.
Note: * The DRAM interface and the CAS and LCAS pin functions are not supported in the
H8S/2321.
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6.1.4 Register Configuration
Table 6.2 summarizes the registers of the bus controller.
Table 6.2 Bus Controller Registers
Initial Value
Name Abbreviation R/W Reset Address*1
Bus width control register ABWCR R/W H'FF/H'00*2 H'FED0
Access state control register ASTCR R/W H'FF H'FED1
Wait control register H WCRH R/W H'FF H'FED2
Wait control register L WCRL R/ W H'FF H'FED3
Bus control regi ster H BCRH R/W H'D0 H'FED4
Bus control register L BCRL R/W H'3C H'FED5
Memory control register MCR*3 R/W H'00 H'FED6
DRAM control register DRAMCR*3 R/W H'00 H'FED7
Refresh timer counter RTCNT *3 R/W H'00 H'FED8
Refresh time constant r egister RTCOR*3 R/W H'FF H'FED9
Notes: 1. Lower 16 bits of the address.
2. Determined by the MCU operating mode.
3. In the H8S/2321 this register is reserved and must not be accessed.
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6.2 Register Descriptions
6.2.1 Bus Width Control Reg ister (ABWCR)
Bit : 7 6 5 4 3 2 1 0
ABW7 ABW6 ABW5 ABW4 ABW3 ABW2 ABW1 ABW0
Modes 5 to 7
Initial value : 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
Mode 4
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
ABWCR is an 8-bit readable/writable register that designates each area for either 8-bit access or
16-bit access.
ABWCR sets the data bus width for the external memory space. The bus width for on-chip
memory and internal I/O registers is fixed regardless of the settin gs in ABWCR.
After a reset and in hardware standby mode, ABWCR is initialized to H'FF in modes 5 to 7,* and
to H'00 in mode 4. It is not initialized in soft ware sta ndby mode.
Note: * Modes 6 and 7 are not provided in the ROMless version.
Bits 7 to 0—Area 7 to 0 Bus Width Control (ABW7 t o ABW0): These bits select whether the
corresponding area is to be designated for 8-bit access or 16-bit access.
Bit n
ABWn
Description
0 Area n is designated for 16-bit access
1 Area n is designated for 8-bit access (n = 7 to 0)
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6.2.2 Access State Control Register (ASTCR)
Bit : 7 6 5 4 3 2 1 0
AST7 AST6 AST5 AST4 AST3 AST2 AST1 AST0
Initial value : 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
ASTCR is an 8-bit readable/writable register that designates each area as either a 2-state access
space or a 3-state access space.
ASTCR sets the number of access states for the external memory space. The number of access
states for on-chip memory and internal I/O registers is fixed regardless of the settings in ASTCR.
ASTCR is i nitialized to H'FF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 0—Area 7 to 0 Access State Control (AST7 to AST0): These bits select whether the
corresponding area is to be designated as a 2-state access space or a 3-state access space.
Wait state insertion is enabled or disab led at the same time.
Bit n
ASTn
Description
0 Area n is designated for 2-state access
Wait state insertion in area n external space is disabled
1 Area n is designated for 3-state access (Initial value)
Wait state insertion in area n external space is enabled (n = 7 to 0)
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6.2.3 Wait Control Registers H and L (WCRH, WCRL)
WCRH and WCRL are 8-bit readable/writable registers that select the number of program wait
states for each area.
Program waits are not inserted in the case of on-chip memory or internal I/O registers.
WCRH and WCR L are initialized to H'FF by a reset and in hardware standby mode. They are not
initialized in software standby mode.
WCRH
Bit : 7 6 5 4 3 2 1 0
W71 W70 W61 W60 W51 W50 W41 W40
Initial value : 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
Bits 7 and 6—Area 7 Wait Control 1 and 0 (W71, W70): These bits select the number of
program wait states when area 7 in external space is accessed while the AST7 bit in ASTCR is set
to 1.
Bit 7
W71 Bit 6
W70
Description
0 0 Program wait not inserted when external space area 7 is accessed
1 1 program wait state inserted when external space area 7 is accessed
1 0 2 program wait states inserted when external space area 7 is accessed
1 3 program wait states inserted when external space area 7 is accessed
(Initial value)
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Bits 5 and 4—Area 6 Wait Control 1 and 0 (W61, W60): These bits select the number of
program wait states when area 6 in external space is accessed while the AST6 bit in ASTCR is set
to 1.
Bit 5
W61 Bit 4
W60
Description
0 0 Program wait not inserted when external space area 6 is accessed
1 1 program wait state inserted when external space area 6 is accessed
1 0 2 program wait states inserted when external space area 6 is accessed
1 3 program wait states inserted when external space area 6 is accessed
(Initial value)
Bits 3 and 2—Area 5 Wait Control 1 and 0 (W51, W50): These bits select the number of
program wait states when area 5 in external space is accessed while the AST5 bit in ASTCR is set
to 1.
Bit 3
W51 Bit 2
W50
Description
0 0 Program wait not inserted when external space area 5 is accessed
1 1 program wait state inserted when external space area 5 is accessed
1 0 2 program wait states inserted when external space area 5 is accessed
1 3 program wait states inserted when external space area 5 is accessed
(Initial value)
Bits 1 and 0—Area 4 Wait Control 1 and 0 (W41, W40): These bits select the number of
program wait states when area 4 in external space is accessed while the AST4 bit in ASTCR is set
to 1.
Bit 1
W41 Bit 0
W40
Description
0 0 Program wait not inserted when external space area 4 is accessed
1 1 program wait state inserted when external space area 4 is accessed
1 0 2 program wait states inserted when external space area 4 is accessed
1 3 program wait states inserted when external space area 4 is accessed
(Initial value)
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WCRL
Bit : 7 6 5 4 3 2 1 0
W31 W30 W21 W20 W11 W10 W01 W00
Initial value : 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
Bits 7 and 6—Area 3 Wait Control 1 and 0 (W31, W30): These bits select the number of
program wait states when area 3 in external space is accessed while the AST3 bit in ASTCR is set
to 1.
Bit 7
W31 Bit 6
W30
Description
0 0 Program wait not inserted when external space area 3 is accessed
1 1 program wait state inserted when external space area 3 is accessed
1 0 2 program wait states inserted when external space area 3 is accessed
1 3 program wait states inserted when external space area 3 is accessed
(Initial value)
Bits 5 and 4—Area 2 Wait Control 1 and 0 (W21, W20): These bits select the number of
program wait states when area 2 in external space is accessed while the AST2 bit in ASTCR is set
to 1.
Bit 5
W21 Bit 4
W20
Description
0 0 Program wait not inserted when external space area 2 is accessed
1 1 program wait state inserted when external space area 2 is accessed
1 0 2 program wait states inserted when external space area 2 is accessed
1 3 program wait states inserted when external space area 2 is accessed
(Initial value)
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Bits 3 and 2—Area 1 Wait Control 1 and 0 (W11, W10): These bits select the number of
program wait states when area 1 in external space is accessed while the AST1 bit in ASTCR is set
to 1.
Bit 3
W11 Bit 2
W10
Description
0 0 Program wait not inserted when external space area 1 is accessed
1 1 program wait state inserted when external space area 1 is accessed
1 0 2 program wait states inserted when external space area 1 is accessed
1 3 program wait states inserted when external space area 1 is accessed
(Initial value)
Bits 1 and 0—Area 0 Wait Control 1 and 0 (W01, W00): These bits select the number of
program wait states when area 0 in external space is accessed while the AST0 bit in ASTCR is set
to 1.
Bit 1
W01 Bit 0
W00
Description
0 0 Program wait not inserted when external space area 0 is accessed
1 1 program wait state inserted when external space area 0 is accessed
1 0 2 program wait states inserted when external space area 0 is accessed
1 3 program wait states inserted when external space area 0 is accessed
(Initial value)
6.2.4 Bus Control Register H (BCRH)
Bit : 7 6 5 4 3 2 1 0
ICIS1 ICIS0 BRSTRM BRSTS1 BRSTS0 RMTS2*RMTS1* RMTS0*
Initial value : 1 1 0 1 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
Note: * This bit is reserved in the H8S/2321.
BCRH is an 8-bit readable/writable register that selects enabling or disabling of idle cycle
insertion, and the memory interface for areas 2 to 5 and area 0.
BCRH is initialized to H'D0 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
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Bit 7—Idle Cycle Insert 1 (ICIS1): Selects whether or not one idle cycle state is to be inserted
between bus cycles when successive external read cycles are performed in different areas.
Bit 7
ICIS1
Description
0 Idle cycle not inserted in case of successive external read cycles in different areas
1 Idle cycle inserted in case of successive external read cycles in different areas
(Initial value)
Bit 6—Idle Cycle Insert 0 (ICIS0): Selects whether or not one idle cycle state is to be inserted
between bus cycles when successive external read and external write cycles are performed .
Bit 6
ICIS0
Description
0 Idle cycle not inserted in case of successive external read and external write cycles
1 Idle cycle inserted in case of successive external read and external write cycles
(Initial value)
Bit 5—Burst ROM Enable (BRSTRM): Selects whether area 0 is used as a burst ROM interface
area.
Bit 5
BRSTRM
Description
0 Area 0 is basic bus interface area (Initial value)
1 Area 0 is burst ROM interface area
Bit 4—Burst Cycle Select 1 (BRSTS1): Selects the number of burst cycles for the burst ROM
interface.
Bit 4
BRSTS1
Description
0 Bu rst cy cle co mpr i se s 1 state
1 Burst cy cle co mpri se s 2 stat es (Initial value)
Bit 3—Burst Cycle Select 0 (BRSTS0): Selects the number of words that can be accessed in a
burst ROM interface burst access.
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Bit 3
BRSTS0
Description
0 Max. 4 words in burst access (Initial value)
1 Max. 8 words in burst access
Bits 2 to 0—RAM Type Select (RMTS2 to RMTS0): These bits select the memory interface for
areas 2 to 5 in advanced mode.
When DRAM space is selected, the relevant area is designated as a DRAM interface area. In the
H8S/2321 these bits are reserved and should only be written with 0.
Bit 2 Bit 1 Bit 0 Description
RMTS2 RMTS1 RMTS0 Area 5 Area 4 Area 3 Area 2
0 0 0 Normal space
1 Normal space DRAM space
1 0 Normal space DRAM space
1 DRAM space
1 — — —
The LCAS pin is used for the LCAS signal on the 2-CAS DRAM interface. If it is wished to use
BREQO output and WAIT input when using the LCAS signal, it is p ossible to switch to the P53
pin by means of the BREQOPS bit in PFCR2. For details, see section 9.6, Port 5 and section 9.13,
Port F.
Note: This note applies to the H8S/2323 only. If all areas selected as DRAM space are 8-bit
space, the PF2 pin can be used as an I/O port, or as the BREQ0 or WAIT pin. Ho we ver, if
PF2 is used as the WAIT pin on the H8S/2323 only, normal space other than DRAM space
should be designated as 16-bit bus space. The RAS down mode cannot be used in this
case. Sample settings are shown below.
RMTS2 RMTS1 RMTS0 Area 5 Area 4 Area 3 Area 2
0 0 0 Normal space
1 Normal space
(16-bit bus) DRAM space
(8-bit bus)
1 0 Normal space
(16-bit bus) DRAM space
(8-bit bus)
1 DRAM space
(8-bit bus)
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6.2.5 Bus Control Reg ister L (BCRL)
Bit : 7 6 5 4 3 2 1 0
BRLE BREQOE EAE — DDS* — WDBE* WAITE
Initial value : 0 0 1 1 1 1 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
Note: * This bit is reserved in the H8S/2321.
BCRL is an 8-bit readable/writable register that performs selection of the external bus-released
state protocol, DMAC single address transfer, enabling or disabling of the write data buffer
function, and enabling or disabling of WAIT pin input.
BCRL is initialized to H'3C by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit 7—Bus Release Enable (BRLE): Enables or disables external bus release.
Bit 7
BRLE
Description
0 E xternal bus release is disabled. BREQ, BACK, and BREQO pins can be used as I/O
ports (Initial value)
1 E xternal bus release is enabled
Bit 6—BREQO Pin Enable (BREQOE): Outputs a signal that requests the external bus master
to drop the bus request signal (BREQ) in the external bus release state, when an internal bus
master performs an external space access, or when a refresh request is generated.
Bit 6
BREQOE
Description
0 BREQO output disabled. BREQO pin can be used as I/O port (Initial value)
1 BREQO output enabled
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Bit 5—External Address Enable (EAE): Selects whether addresses H'010000 to H'03FFFF*2 are
to be internal addresses or external addresses.
Description
Bit 5 H8S/2329B, H8S/2328*3,
H8S/2326
H8S/2327
H8S/2323
0 On-chip ROM Addresses H'010000 to
H'01FFFF are on-chip
ROM or address H'020000
to H'03FFFF are reserved
area*1
Reserved area*1
1 Addresses H'010000 to H'03FFFF*2are external addresses in external expanded mode
or reserved area*1 in single-chip mode (Initial value)
Notes: 1. Do not access a reserved area.
2. Addresses H'010000 to H'05FFFF in the H8S/2329B.
Addresses H'010000 to H'07FFFF in the H8S/2326.
3. H8S/2328B in F-ZTAT version.
Bit 4—Reserved: Only 1 should be written to this bit.
Bit 3—DACK Timing Select (DDS): Selects the DMAC si ngle address transfer bus timing for
the DRAM interface. In the H8S/2321 this bit is reserved and should only be written with 1.
Bit 3
DDS
Description
0 When DMAC single address transfer is performed in DRAM space, full access is
always executed
DACK signal goes low from Tr or T1 cycle
1 Burst access is possible when DMAC single address transfer is performed in DRAM
space
DACK signal goes low from Tc1 or T2 cycle (Initial value)
Bit 2—Reserved: Only 1 should be written to this bit.
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Bit 1—Write Data Buffer Enable (WDBE): Selects whether or not the write buffer functio n is
used for an external write cycle or DMAC single address cycle. In the H8S/2321 this bit is
reserved and should only be written with 0.
Bit 1
WDBE
Description
0 Write data buffer function not used (Initial value)
1 Write data buffer function used
Bit 0—WAIT Pin Enable (WAI TE): Selects enabling or disabling of wait input by the WAIT
pin.
Bit 0
WAITE
Description
0 Wait input by WAIT pin disabl e d. WAIT pin can be used as I/O port (Initial value)
1 Wait input by WAIT pin enabled
6.2.6 Memory Control Register (MCR)
Bit : 7 6 5 4 3 2 1 0
TPC BE RCDM — MXC1 MXC0 RLW1 RLW0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
MCR is an 8-bit readable/writable register that selects the DRAM strobe control method, number
of precharge cycles, access mode, address multiplexing shift size, and the number of wait states
inserted during refreshing, when areas 2 to 5 are designated as DRAM interface areas.
MCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Note: In the H8S/2321 this register is reserved and must not be accessed.
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Bit 7—TP Cycle Control (TPC): Selects whether a 1-state or 2-state precharge cycle (TP) is to be
used when areas 2 to 5 designated as DRAM space are accessed.
Bit 7
TPC
Description
0 1-state precharge cycle is inserted (Initial value)
1 2-state precharge cycle is inserted
Bit 6—Burst Access Enable (BE): Selects enabling or disabling of burst access to areas 2 to 5
designated as DRAM space. DRAM space burst access is performed in fast page mode.
Bit 6
BE
Description
0 Burst disabled (always full access) (Initial value)
1 For DRAM space access, access in fast page mode
Bit 5—RAS Down Mode (RCDM): When areas 2 to 5 are designated as DRAM space and
access to DRAM is interrupted, RCDM selects whether the next DRAM access is waited for with
the RAS signal held low (RAS down mode), or the RAS signal is driven high again (RAS up
mode).
Bit 5
RCDM
Description
0 DRAM interface: RAS up mode selected (Initial value)
1 DRAM interface: RAS down mode selected
Bit 4—Reserved: Only 0 should be written to this bit.
Bits 3 and 2—Multiplex Shift Count 1 and 0 (MXC1, MXC0): These bits select the size of the
shift to the lower half of the row address in row address/colu mn addr ess multiple xing for the
DRAM interface. In burst operation on the DRAM interface, these bits also select the row address
to be used for comparison.
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Bit 3
MXC1 Bit 2
MXC0
Description
0 0 8-bit shift (Initial value)
• When 8-bit ac cess space is de sign ated: Row address A23 to A8 used
for comparison
• When 16-bit access sp ace is designated: Row addre ss A23 to A9 used
for comparison
1 9-bit shift
• When 8-bit ac cess space is de sign ated: Row address A23 to A9 used
for comparison
• When 16-bit access sp ace is designated: Row addre ss A23 to A10 used
for comparison
1 0 10-bit shift
• When 8-bit ac cess space is de sign ated: Row address A23 to A10 used
for comparison
• When 16-bit access sp ace is designated: Row addre ss A23 to A11 used
for comparison
1 —
Bits 1 and 0—Refresh Cycle Wait Control 1 and 0 (RLW1, RLW0): These bits select the
number of wait states to be inserted in a DRAM interface CAS-before-RAS refresh cycle. This
setting is used for all areas designated as DRAM space. Wait input by the WAIT pin is disabled.
Bit 1
RLW1 Bit 0
RLW0
Description
0 0 No wait state inserted (Initial value)
1 1 wait state inserted
1 0 2 wait states inserted
1 3 wait states inserted
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6.2.7 DRAM Control Register (DRAMCR)
Bit : 7 6 5 4 3 2 1 0
RFSHE RCW RMODE CMF CMIE CKS2 CKS1 CKS0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
DRAMCR is an 8-bit readable/writable register that selects the DRAM refresh mode and refresh
counter clock, and controls the refresh timer.
DRAMCR is initialized to H'00 by a reset and in hardware standb y mode. It is not initialized in
software standby mode.
Note: In the H8S/2321 this register is reserved and must not be accessed.
Bit 7—Refresh Control (RFSHE): Selects whether or not refresh control is performed. When
refresh control is not performed, the refresh timer can be used as an interval timer.
Bit 7
RFSHE
Description
0 Refresh control is not performed (Initial value)
1 Refresh control is performed
Bit 6—RAS-CAS Wait (RCW): Controls wait state insertion in DRAM interface CAS-before-
RAS refreshing.
Bit 6
RCW
Description
0 Wait state insertion in CAS-before-RAS refreshing disabled (Initial value)
RAS falls in TRr cycle
1 One wait state inserted in CAS-before-RAS refreshing
RAS falls in TRc1 cycle
Bit 5—Refresh Mode (RMODE): When refresh control is performed (RFSHE = 1), selects
whether or not self-refresh control is performed in software standby mode.
Bit 5
RMODE
Description
0 Self-refr eshing is not performe d in softw are stand by mode (Initial value)
1 Self-refreshing is performed in software standby mode
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Bit 4—Compare Match Flag (CMF): Status flag that indicates a match between the values of
RTCNT and RTCOR.
When refresh control is performed (RFSHE = 1) , 1 should be written to the CMF bit when writing
to DRAMCR.
Bit 4
CMF
Description
0 [Clearing condition]
Cleared by reading the CMF flag when CMF = 1, then writing 0 to the CMF flag
(Initial value)
1 [Setting condition]
Set when RTCNT = RTCOR
Bit 3—Compare Match Interrupt Enable (CMIE): Enables or disables interrupt requests (CMI)
by the CMF flag when the CMF flag in DRAM CR is set to 1.
When refresh control is performed (RFSHE = 1), the CMIE bit is always cleared to 0.
Bit 3
CMIE
Description
0 Interrupt request (CMI) by CMF flag disabled (Initial value)
1 Interrupt request (CMI) by CMF flag enabled
Bits 2 to 0—Refresh Counter Clock Select (CKS2 to CKS0): These bits select the clock to be
input to RTCNT from among 7 internal clocks obtained by dividing the system clock (φ). When
the input clock is selected with bits CKS2 to CKS0, RTCNT begins counting up.
Bit 2
CKS2 Bit 1
CKS1 Bit 0
CKS0
Description
0 0 0 Count operation disabled (Initial value)
1 Count uses φ/2
1 0 Count uses φ/8
1 Count uses φ/32
1 0 0 Count uses φ/128
1 Count uses φ/512
1 0 Count uses φ/2048
1 Count uses φ/4096
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6.2.8 Refresh Ti mer Counter (RTCNT)
Bit : 7 6 5 4 3 2 1 0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
RTCNT is an 8-bit readable/writable up-counter.
RTCN T counts up using the internal clo ck sel ected by bits CKS2 to CKS0 in DRAMCR.
When RTCNT matches RTCOR (co mpare match), the CMF flag in DRAMCR is set to 1 and
RTCNT is cleared to H'00. If the RFSHE bit in DRAMCR is set to 1 at this time, a refresh cycle is
started. Also, if the CMIE bit in DRAMCR is set to 1, a compare match interrupt (CMI) is
generated.
RTCNT is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Note: In the H8S/2321 this register is reserved and must not be accessed.
6.2.9 Refresh Time Constant Register (RTCOR)
Bit : 7 6 5 4 3 2 1 0
Initial value : 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
RTCOR is an 8-bit readable/writable register that sets the period for compare match operations
with RTCNT.
The values of RTCOR and RTCNT are constantly compared, and if they match, the CMF flag in
DRAMCR is set to 1 and RTCNT is cleared to H'00.
RTCOR is i nitialized to H'FF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Note: In the H8S/2321 this register is reserved and must not be accessed.
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6.3 Overview of Bus Control
6.3.1 Area Partitioning
In advanced mode, the bus controller partitions the 16-Mbyte address sp ace into eight areas, 0 to
7, in 2-Mbyte units, and performs bus control for external space in area units. Figure 6.2 shows an
outline of the memory map.
Chip select signals (CS0 to CS7) can be output for each area.
Area 0
(2 Mbytes)
H'000000
H'FFFFFF
H'1FFFFF
H'200000 Area 1
(2 Mbytes)
H'3FFFFF
H'400000 Area 2
(2 Mbytes)
H'5FFFFF
H'600000 Area 3
(2 Mbytes)
H'7FFFFF
H'800000 Area 4
(2 Mbytes)
H'9FFFFF
H'A00000 Area 5
(2 Mbytes)
H'BFFFFF
H'C00000 Area 6
(2 Mbytes)
H'DFFFFF
H'E00000 Area 7
(2 Mbytes)
Advanced mode
Figure 6.2 Overview of Area Partitioning
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6.3.2 Bus Specifications
The external space bus specifications consist of three elements: bus width, number of access
states, and number of program wait states.
The bus width and number of access states for on-chip memory and internal I/O registers are
fixed, and are not affected by the bus controller.
Bus Width: A bus width of 8 or 16 bits can be selected with ABWCR. An area for which an 8-bit
bus is selected functions as an 8-bit access space, and an area for which a 16-bit bus is selected
functions as a16-bit access space.
If all areas are designated for 8-bit access, 8-bit bus mode is set; if any area is designated for 16-bit
access, 16-bit bus mode is set. When the burst ROM interface is designated, 16-bit bus mode is
always set.
Number of Access States: Two or three access states can be selected with ASTCR. An area for
which 2-state access is selected functions as a 2-state access space, and an area for which 3-state
access is selected functions as a 3-state access space.
With the DRAM interface* and burst ROM interface, the number of access states may be
determined without regard to AST CR.
When 2-state access space is designated, wait insertion is disabled.
Note: * The DRAM interface is not supported in the H8S/2321.
Number of Program Wait States: When 3-state access space is designated by ASTCR, the
number of program wait states to be inserted automatically is selected with WCRH and WCRL.
From 0 to 3 program wait states can be selected.
Table 6.3 shows the bus specifications for each basic bus interface area.
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Table 6.3 Bus Specifications for Each Area (Basic Bus Interface)
WCRH, WCRL Bus Specifications (Basic Bus Interface)
ABWCR
ABWn ASTCR
ASTn
Wn1
Wn0
Bus Width
Access States Program Wait
States
0 0 — — 16 2 0
1 0 0 3 0
1 1
1 0 2
1 3
1 0 — — 8 2 0
1 0 0 3 0
1 1
1 0 2
1 3
6.3.3 Memory Interfaces
The chip’s memory interfaces comprise a basic bus interface that allows direct connection of
ROM, SRAM, and so on; a DRAM interface* that allows direct co nnection of DRAM; an d a burst
ROM interface that allows direct connection of burst ROM. The interface can be selected
independently for each area.
An area for which the basic bus interface is designated functions as normal space, an area for
which the DRAM interface* is designated functions as DRAM space, and an area for which the
burst ROM interface is designated functions as burst ROM space.
Note: * The DRAM interface is not supported in the H8S/2321.
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6.3.4 Advanced Mode
The initial state of each area is basic bus interface, 3-state access space. T he initial bus width is
selected according to the operating mode. The bus specifications described here cover basic items
only, and the sections on each memory interface (6.4, Basic Bus Interface, 6.5, DRAM Interface
(Not supported in the H8S/2321), and 6.7, Burst ROM Interface) should be referred to for further
details.
Area 0: Area 0 includes on-chip ROM*1, and in ROM-disabled expansion mode, all of area 0 is
external space. In the ROM-enabled expansion mode, the space excluding on-chip ROM*1 is
external space.
When area 0 external space is accessed, the CS0 signal can be output.
Either basic bus interface or burst ROM interface can be selected for area 0.
Areas 1 and 6: In external expansion mode, all of area 1 and area 6 is external space.
When area 1 and 6 external space is accessed, the CS1 and CS6 pin signals respectively can be
output.
Only the basic bus interface can be used for areas 1 and 6.
Areas 2 to 5: In external expansion mode, all of area 2 to area 5 is external space.
When area 2 to 5 external space is accessed, signals CS2 to CS5 can be output.
Basic bus interface or DRAM interface*2 can be selected for areas 2 to 5. With the DRAM
interface*2, signal s CS2 to CS5 are used as RAS signals.
Area 7: Area 7 includes the on-chip RAM and internal I/O registers. In external expansion mode,
the space excluding the on-chip RAM and internal I/O registers is external space. The on-chip
RAM is enabled when the RAME b it in the syste m control register (SYSCR) is set to 1; when the
RAME bit is cleared to 0, the on-chip RAM is disabled and the corresponding space becomes
external space .
When area 7 external space is accessed, the CS7 signal can be output.
Only the basic bus interface can be used for the area 7 memory interface.
Notes: 1. Only applies to versions with ROM.
2. The DRAM interface is not supported in the H8S/2321.
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6.3.5 Chip Select Signals
The chip can output chip select signals (CS0 to CS7) to areas 0 to 7 , the signal being driven low
when the corresponding external space area is accessed.
Figure 6.3 shows an example of CSn (n = 0 to 7) output timing.
Enabling or disabling of the CSn signal is performed by setting the data direction register (DDR)
for the port corresponding to the particular CSn pin and either the CS167 enable bit (CS167E) or
the CS25 enable bit (CS25E).
In ROM-disabled expansion mode, the CS0 pin is placed in the output state after a power-on reset.
Pins CS1 to CS7 are placed in the input state after a power-on reset, so the corresponding DDR
bits, and CS167E or CS25E, should be set to 1 when outputting signals CS1 to CS7.
In ROM-enabled expansion mode, pins CS0 to CS7 are all placed in the input state after a power-
on reset, so the corresponding DDR bits, and CS167E or CS25E, should be set to 1 when
outputting signals CS0 to CS7.
For details, see section 9, I/O Ports.
When areas 2 to 5 are designated as DRAM space*, outputs CS2 to CS5 are used as RAS signa ls.
Note: * The DRAM interface is not supported in the H8S/2321.
Bus cycle
T1T2T3
Area n external address
A
ddress bus
φ
CSn
Figure 6.3 CSn Signal Output Timing (n = 0 to 7)
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6.4 Basic Bus Interface
6.4.1 Overview
The basic bus interface enables direct connection of ROM, SRAM, and so on.
The bus specifications can be selected with ABWCR, ASTCR, WCRH, and WCRL. (See table
6.3.)
6.4.2 Data Size and Data Alignment
Data sizes for the CPU and other internal bus masters are byte, word, and longword. The bus
controller has a data alignment function, and when accessing external space, controls whether the
upper data bus (D15 to D8) or lower data bus (D7 to D0) is used according to the bus specifications
for the area being accessed (8-bit access space or 16-bit access space) and the data size.
8-Bit Access Space: Figure 6.4 illustrates data alignment control for the 8-bit access space. With
the 8-bit access space, the upper data bus (D15 to D8) is always used for accesses. The amount of
data that can be accessed at one time is one byte: a word transfer instruction is performed as two
byte accesses, and a longword transfer instruction, as four byte accesses.
D15 D8D7D0
Upper data bus
Lower data bus
Byte size
Word size 1st bus cycle
2nd bus cycle
Longword size 1st bus cycle
2nd bus cycle
3rd bus cycle
4th bus cycle
Figure 6.4 Access Sizes and Data Alignment Control (8-Bit Access Space)
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16-Bit Access Space: Figure 6.5 illustrates data alignment control for the 16-bit access space.
With the 16-bit access space, the upper data bus (D15 to D8) and lower data bus (D7 to D0) are used
for accesses. The amount of data that can be accessed at one time is one byte or one word, and a
longword transfer instruction is executed as two word transfer instructions.
In byte access, whether the upper or lower data bus is used is determined by whether the address is
even or odd. The upper data bus is used for an even address, and the lower data bus for an odd
address.
D15 D8D7D0
Upper data bus
Byte size
Word size
1st bus cycle
2nd bus cycle
Longword
size
• Even address
Byte size • Odd address
Lower data bus
Figure 6.5 Access Sizes and Data Alignment Control (16-Bit Access Space)
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6.4.3 Valid Strobes
Table 6.4 shows the data buses used and valid strobes for the access spaces.
In a read, the RD signal is valid without discrimination between the upper and lower halves of the
data bus.
In a write, the HWR signal is valid for the upper half of the data bus, and the LWR signal for the
lower half.
Table 6.4 Data Buses Used and Valid Strobes
Area Access
Size Read/
Write
Address Valid
Strobe Upper Data Bus
(D15 to D8) Lower Data Bus
(D7 to D0)
Byte Read — RD Valid Invalid
8-bit access
space Write — HWR Hi-Z
Byte Read Even RD Valid Invalid 16-bit access
space Odd Invalid Valid
Write Even HWR Valid Hi-Z
Odd LWR Hi-Z Valid
Word Read — RD Valid Valid
Write — HWR, LWR Valid Valid
Notes: Hi-Z: High impedance
Invalid: Input state; input value is ignored.
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6.4.4 Basic Timing
8-Bit 2-State Access Space: Figure 6.6 shows the bus timing for an 8-bit 2-state access space.
When an 8-bit access space is accessed, the upper half (D15 to D8) of the data bus is used.
The LWR pin is fixed high. W ait sta tes cannot be i nserted.
Bus cycle
T
1
T
2
Address bus
φ
CSn
AS
RD
D
15
to D
8
Valid
D
7
to D
0
Invalid
Read
HWR
LWR
D
15
to D
8
Valid
D
7
to D
0
High impedance
Write
Note: n = 0 to 7
High
Figure 6.6 Bus Timing for 8-Bit 2-State Access Space
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8-Bit 3-State Access Space: Figure 6.7 shows the bus timing for an 8-bit 3-state access space.
When an 8-bit access space is accessed, the upper half (D15 to D8) of the data bus is used.
The LWR pin is fixed high. W ait states can be insert ed.
Bus cycle
T
1
T
2
Address bus
φ
CSn
AS
RD
D
15
to D
8
Valid
D
7
to D
0
Invalid
Read
HWR
LWR
D
15
to D
8
Valid
D
7
to D
0High impedance
Write
High
Note: n = 0 to 7
T3
Figure 6.7 Bus Timing for 8-Bit 3-State Access Space
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16-Bit 2-State Access Space: Figures 6.8 to 6.10 show bus timings for a 16-bit 2-state access
space. When a 16-bit access space is accessed, the upper half (D15 to D8) of the data bus is used for
the even address, and the lower half (D7 to D0) for the odd address.
Wait states cannot be inserted.
Bus cycle
T
1
T
2
Address bus
φ
CSn
AS
RD
D
15
to D
8
Valid
D
7
to D
0
Invalid
Read
HWR
LWR
D
15
to D
8
Valid
D
7
to D
0
High impedance
Write
High
Note: n = 0 to 7
Figure 6.8 Bus Timing for 16-Bit 2-State Access Space (1) (Even Address Byte Access)
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Bus cycle
T1T2
Address bus
φ
CSn
AS
RD
D15 to D8Invalid
D7 to D0Valid
Read
HWR
LWR
D15 to D8High impedance
D7 to D0Valid
Write
Note: n = 0 to 7
High
Figure 6.9 Bus Timing for 16-Bit 2-State Access Space (2) (Odd Address Byte Access)
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Bus cycle
T1T2
Address bus
φ
CSn
AS
RD
D15 to D8Valid
D7 to D0Valid
Read
HWR
LWR
D15 to D8Valid
D7 to D0Valid
Write
Note: n = 0 to 7
Figure 6.10 Bus Timing for 16-Bit 2-State Access Space (3) (Word Access)
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16-Bit 3-State Access Space: Figures 6.11 to 6.13 show bus timings for a 16-bit 3-state access
space. When a 16-bit access space is accessed , the upper half (D15 to D8) of the data bus is used
for the even address, and the lower half (D7 to D0) for the odd address.
Wait states can be inserted.
Bus cycle
T1T2
Address bus
φ
CSn
AS
RD
D15 to D8Valid
D7 to D0Invalid
Read
HWR
LWR
D15 to D8Valid
D7 to D0High impedance
Write
High
Note: n = 0 to 7
T3
Figure 6.11 Bus Timing for 16-Bit 3-State Access Space (1) (Even Address Byte Access)
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Bus cycle
T
1
T
2
Address bus
φ
CSn
AS
RD
D
15
to
D
8
Invalid
D
7
to
D
0
Valid
Read
HWR
LWR
D
15
to
D
8
High impedance
D
7
to
D
0
Valid
Write
High
Note: n = 0 to 7
T
3
Figure 6.12 Bus Timing for 16-Bit 3-State Access Space (2) (Odd Address Byte Access)
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Bus cycle
T
1
T
2
Address bus
φ
CSn
AS
RD
D
15
to D
8
Valid
D
7
to D
0
Valid
Read
HWR
LWR
D
15
to D
8
Valid
D
7
to D
0
Valid
Write
Note: n = 0 to 7
T
3
Figure 6.13 Bus Timing for 16-Bit 3-State Access Space (3) (Word Access)
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6.4.5 Wait Control
When accessing external space, the chip can extend the bus cycle by inserting one or more wait
states (Tw). There are two ways of inserting wait states: program wait insertion and pin wait
insertion using the WAIT pin.
Program Wait Insertion: From 0 to 3 wait states can be inserted automatically between the T2
state and T3 state on an individual area basis in 3-state access space, according to the settings of
WCRH a nd WCRL.
Pin Wait Insertion: Settin g the WAITE bit in BCRL to 1 enables wait insertion by means of the
WAIT pin. When external space is accessed in this state, program wait insertion is first carried out
according to the settings in WCRH and WCRL. Then, if the WAIT pin is low at the falling edge of
φ in the last T2 or Tw state, a Tw state is inserted. If the WAIT pin is held lo w, Tw states are
inserted until it goes high.
This is useful when inserting four o r more Tw states, or when changing the number of Tw states for
different external devices.
The WAITE bit setting applies to all areas. The WAITPS bit can be used to change the WAIT
input pin from PF2 to P53. T o make this change, select the inp ut pin with the WAITPS bit, then set
the WAITE bit.
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Figure 6.14 shows an example of wait state insertion timing.
By program wait
T1
Address bus
φ
AS
RD
Data bus Read data
Read
HWR, LWR
Write data
Write
Note: indicates the timing of WAIT pin sampling.
WAIT
Data bus
T2TwTwTwT3
By WAIT pin
Figure 6.14 Example of Wait State Insertion Timing
The settings after a po wer-on reset are: 3-state access, 3 program wait state insertio n, and WAIT
input disabled.
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6.5 DRAM Interface (Not supported in the H8S/2321)
6.5.1 Overview
When the chip is in advanced mode, external space areas 2 to 5 can be designated as DRAM
space, and DRAM interfacing performed. With the DRAM interface, DRAM can be directly
connected to the chip. A DRAM space of 2, 4, or 8 Mbytes can be set by means of bits RMTS2 to
RMTS0 in BCRH. Burst operation is also possible, using fast page mode.
6.5.2 Setting DRAM Space
Areas 2 to 5 are designated as DRAM space by setting bits RMTS2 to RMTS0 in BCRH. The
relation between the settings of bits RMTS2 to RMTS0 and DRAM space is shown in table 6.5.
Possible DRAM space settings are: one area (area 2), two areas (areas 2 and 3), and four areas
(areas 2 to 5).
Table 6.5 Settings of Bits RMTS2 to RMTS0 and Corresponding DRAM Spaces
RMTS2 RMTS1 RMTS0 Area 5 Area 4 Area 3 Area 2
0 0 1 Normal space DRAM space
1 0 Normal space DRAM space
1 DRAM space
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6.5.3 Address Multiplexing
With DRAM space, the row address and column address are multiplexed. In address multiplexing,
the size of the shift of the row address is selected with bits MXC1 and MXC0 in MCR. Table 6.6
shows the relation betwee n the settings of MXC1 and MXC0 and the shift size.
Table 6.6 Address Multiplexing Sett ings by B its MXC1 and MXC0
MCR
Shift Address Pins
MXC1 MXC0 Size A23 to A13 A12 A11 A10 A9 A
8 A
7 A
6 A
5 A
4 A
3 A
2 A
1 A
0
0 0 8 bits A23 to A13 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 A
8
1 9 bits A23 to A13 A12 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9
1 0 10 bits A23 to A13 A12 A11 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10
Row
address
1
Setting
prohibited — — — — — — — — — — — — — —
Column
address — — — A23 to A13 A12 A11 A10 A9 A
8 A
7 A
6 A
5 A
4 A
3 A
2 A
1 A
0
6.5.4 Data Bus
If the bit in ABWCR corresponding to an area designated as DRAM space is set to 1, that area is
designated as 8-bit DRAM space; if the bit is cleared to 0, the area is designated as 16-bit DRAM
space. In 16-bit DRAM space, ×16-bit configuration DRAM can be connected directly.
In 8-bit DRAM space the upper half of the data bus, D15 to D8, is enabled, while in 16-bit DRAM
space both the upper and lower halves of the data bus, D15 to D0, are enabled.
Access sizes and data alignment are the same as for the basic bus interface. For details, see section
6.4.2, Data Size and Data Alignment.
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6.5.5 Pins Used for DRAM Interface
Table 6.7 shows the pins used for DRAM interfacing and their functions.
Table 6.7 DRAM Interface Pins
Pin With DRAM
Setting
Name
I/O
Function
HWR WE Write enable Output When 2-CAS system is set,
write enable for DRAM space
access
LCAS LCAS Lower column address
strobe Output Lower column address strobe
for 16-bit DRAM space access
CS2 RAS2 Row address strobe 2 Output Row address strobe when area
2 is designated as DRAM space
CS3 RAS3 Row address strobe 3 Output Row address strobe when area
3 is designated as DRAM space
CS4 RAS4 Row address strobe 4 Output Row address strobe when area
4 is designated as DRAM space
CS5 RAS5 Row address strobe 5 Output Row address strobe when area
5 is designated as DRAM space
CAS UCAS Upper column address
strobe Output Upper column address strobe
for DRAM space access
WAIT WAIT Wait Input Wait request signal
A12 to A0 A
12 to A0 Address pins Output Row address/column address
multiplexed output
D15 to D0 D
15 to D0 Data pins I/O Data input/output pins
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6.5.6 Basic Timing
Figure 6.15 shows the basic access timing for DRAM space. The basic DRAM access timing is 4
states. Unlike the basic bus interface, the corresponding bits in ASTCR control only enabling or
disabling of wait insertion, and do not affect the number of access states. When the corresponding
bit in ASTCR is cleared to 0, wait states cannot be inserted in the DRAM access cycle.
The 4 states of the basic timing consist of one Tp (precharge cycle) state, one Tr (row address
output cycle), and two Tc (column address output cycle) states, Tc1 and Tc2.
Tp
φ
CSn (RAS)
Read
Write
CAS, LCAS
HWR (WE)
D15 to D0
HWR (WE)
D15 to D0
A23 to A0
TrTc1 Tc2
Row Column
Note: n = 2 to 5
Figure 6.15 Basic Access Timing
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6.5.7 Precharge State Control
When DRAM is accessed, an RAS precharging time must be secured. With the chip, one Tp state
is always inserted when DRAM space is accessed. This can be changed to two Tp states by setting
the TPC bit in MCR to 1. Set the approp riate number of Tp cycles according to the DRAM
connected and the operating frequency of the chip. Figure 6.16 shows the timing when two Tp
states are inserted.
When the TCP bit is set to 1, two Tp states are also used for refresh cycles.
T
p1
φ
CSn (RAS)
Read
Write
CAS, LCAS
D
15
to D
0
D15 to D0
A
23
to A
0
T
p2
T
r
T
c1
Row Column
T
c2
HWR (WE)
HWR (WE)
Note: n = 2 to 5
Figure 6.16 Timing with 2-State Precharge Cycle
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6.5.8 Wait Control
There are two ways of inserting wait states in a DRAM access cycle: program wait insertion and
pin wait insertion using the WAIT pin.
Program Wait Insertion: When the bit in ASTCR corresponding to an area designated as DRAM
space is set to 1, from 0 to 3 wait states can be inserted automatically between the Tc1 state and Tc2
state, according to the settings of WCRH and WCRL.
Pin Wait Insertion: Whe n the WAITE bit in BCRH is set t o 1, wait input by means o f the WAIT
pin is enabled regardless of the setting of the AST bit in ASTCR. When DRAM space is accessed
in this state, a program wait is first inserted. If the WAIT pin is low at the falling edge of φ in the
last Tc1 or Tw state, another Tw state is inserted. If the WAIT pin is held low, Tw states are inserted
until it goes high.
Figure 6.17 shows an example of wait state insertion timing.
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By program wait
T
p
Address bus
φ
C
Sn (RAS)
CAS
Data bus Read data
Read
CAS
Write data
Write
WAIT*
Data bus
T
r
T
c1
T
w
T
w
T
c2
By WAIT pin
Notes: indicates the timing of WAIT pin sampling.
n = 2 to 5
Figure 6.17 Example of Wait State Insertion Timing
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6.5.9 By te Access Control
When DRAM with a ×16 configuration is connected, the 2-CAS system can be used for the
control signals required for byte access.
Figure 6.18 shows the control timing in the 2-CAS system, and figure 6.19 shows an example of
2-CAS type DRAM connection.
Tp
φ
CSn (RAS)
Byte control
A23 to A0
TrTc1 Tc2
Row
CAS
LCAS
HWR (WE)
Column
Note: n = 2 to 5
Figure 6.18 2-CAS System Control Timing (Upper Byte Write Access)
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Chip
(Address shift size set to 9 bits)
CS (RAS)
2-CAS type 4-Mbit DRAM
256-kbyte × 16-bit configuration
9-bit column address
OE
RAS
CAS UCAS
LCAS LCAS
HWR (WE)WE
A9A8
A8A7
A7A6
A6A5
A5A4
A4A3
A3A2
A2A1
A1A0
D15 to D0D15 to D0
Row address
input: A8 to A0
Column address
input: A8 to A0
Figure 6.19 Example of 2-CAS DRAM Connection
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6.5.10 Burst Operation
With DRAM, in addition to full access (normal access) in which data is accessed by outputting a
row address for each access, a fast page mode is also provided which can be used when making a
number of consecutive accesses to the same row address. This mode enables fast (burst) access of
data by simply changing the column address after the row address has been output. Burst access
can be selected by setting the BE bit in MCR to 1.
Burst Access (Fast Page Mode) Operation Timing: Figure 6.20 shows the operation timing for
burst access. When there are consecutive access cycles for DRAM space, the CAS signal and
column address output cycles (two states) continue as long as the row address is the same for
consecutive access cycles. The row address used for the comparison is set with bits MXC1 and
MXC0 in MCR.
Tp
φ
CSn (RAS)
Read
Write
CAS, LCAS
HWR (WE)
D15 to D0
HWR (WE)
D15 to D0
A23 to A0
TrTc1 Tc2
Row Column 1 Column 2
Tc1 Tc2
Note: n = 2 to 5
Figure 6.20 Operation Timing in Fast Page Mode
The bus cycle can also be extended in burst access by inserting wait states. The wait state insertion
method and timing are the same as for full access. For details, see section 6.5.8, Wait Control.
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RAS Down Mo de a nd RAS Up Mode: Even when burst operation is selected, it may happ en that
access to DRAM space is not continuous, but is interrupted by access to another space. In this
case, if the RAS signal is held low during the access to the other space, burst operation can be
resumed when the same row address in DRAM space is accessed again.
• RAS down mode
To select RAS down mode, set the RCDM bit in MCR to 1. If access to DRAM space is
interrupted and another space is accessed, the RAS signal is held low during the access to the
other space, and burst access is performed if the row address of the next DRAM space access
is the same as the row address of the previous DRAM space access. Figure 6.21 shows an
example of the timing in RAS down mode.
Note, however, that the RAS signal will go high if a refresh operation interrupts RAS do wn
mode.
External space
access
T
p
A
23
to A
0
φ
CSn (RAS)
C
AS, LCAS
D
15
to D
0
T
r
T
c1
T
c2
T
1
T
2
DRAM accessDRAM access T
c1
T
c2
Note: n = 2 to 5
Figure 6.21 Example of Operation Timing in RAS Down Mode
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• RAS up mode
To select RAS up mode, clear the RCDM bit in MCR to 0. Each time access to DRAM space
is interrupted and another space is accessed, the RAS signal goes high again. Burst operation is
only performed if DRAM space is continuous. Figure 6.22 shows an example of the timing in
RAS up mode.
In the case of burst ROM space access, the RAS sig nal is not restored to the high level.
CSn (RAS)
CAS, LCAS
External space
access
Tp
A23 to A0
φ
D15 to D0
TrTc1 Tc2 Tc1 Tc2
DRAM accessDRAM access T1T2
Note: n = 2 to 5
Figure 6.22 Example of Operation Timing in RAS Up Mode
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6.5.11 Refresh Control
The chip is provided with a DRAM refresh control function. Either of two refreshing methods can
be selected: CAS-before-RAS (CBR) refreshing, or self-refreshing.
CAS-before-RAS (CBR) Refreshing: To select CBR refreshing, set the RFSHE bit in DRAMCR
to 1, and clear the RMODE bit to 0.
With CBR refresh ing, RTCN T counts up using the inp ut clock selected by bits CKS2 to CKS0 in
DRAMCR, and when the count matches the value set in RTCOR (compare match), refresh control
is performed. At the same time, RTCNT is reset and starts counting again from H'00. Refreshing is
thus repeated at fixed intervals determined by RTCOR and bits CKS2 to CKS0. Set a value in
RTCOR and bits CKS2 to CKS0 that will meet the refreshing interval specification for the DRAM
used.
When bits CKS2 to CKS0 are set, RTCNT starts countin g up. RTCNT and RTCOR se tting s
should therefore be completed before setting bits CKS2 to CKS0.
Do not clear the CMF flag when refresh control is being performed (RFSHE = 1).
RTCNT operation is shown in figure 6.23, compare match timing in figure 6.24, and CBR refresh
timing in figure 6.25.
Access to other normal space can be performed during the CBR refresh interval.
RTCOR
H'00
Refresh request
RTCNT
Figure 6.23 RTCNT Operation
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RTCNT
φ
N
RTCOR N
H'00
Refresh request signal
and CMF bit setting signal
Figure 6.24 Compare Match Timing
T
Rp
φ
CS (RAS)
T
Rr
T
Rc1
T
Rc2
CAS, LCAS
Note: n = 2 to 5
Figure 6.25 CBR Refresh Timing
When the RCW bit is set to 1, RAS signal output is delayed by one cycle. The width of the RAS
signal should be adjusted with bits RLW1 and RLW0. These bits are only enabled in refresh
operations.
Figure 6.26 shows the timing when the RCW bit is set to 1.
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T
Rp
φ
CSn (RAS)
T
Rr
T
Rc1
T
Rw
CAS, LCAS
T
Rc2
Note: n = 2 to 5
Figure 6.26 CBR Refresh Timing (When RCW = 1, RLW1 = 0, RLW0 = 1)
Self-Refreshing: A self-refresh mode (battery backup mode) is provided for DRAM as a kind of
standby mode. In this mode, refresh timing and refresh addresses are generated within the DRAM.
To select self-refreshing, set the RF SHE bit and RMODE bit in DRAMCR to 1. Then, when a
SLEEP instruction is executed to enter software standby mode, the CAS and RAS signals are
output and DRAM enters self-refresh mode, as shown in figure 6.27.
When software standby mode is exited, the RMODE bit is cleared to 0 and self-refresh mode is
cleared.
When switching to software standby mode, if there is a CBR refresh request, CBR refreshing is
executed before self-refresh mode is entered.
T
Rp
φ
CSn (RAS)
T
Rcr
C
AS, LCAS
HWR (WE)
T
Rc3
Software
standby
Note: n = 2 to 5
High
Figure 6.27 Self-Refresh Timing
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6.6 DMAC Single Address Mode and DRAM Interface
(Not supported in the H8S/2321)
When burst mode is selected with the DRAM interface, the DACK output t iming can be selected
with the DDS bit. When DRAM space is accessed in DMAC single address mode at the same
time, this bit selects whether or not burst access is to be performed.
6.6.1 When DDS = 1
Burst access is performed by determining the address only, irrespective of the bus master. The
DACK output goes lo w fro m the TC1 state in the case of the DRAM interface.
Figure 6.28 shows the DACK output timing for the DRAM interface when DDS = 1.
T
p
φ
Read
Write
CSn (RAS)
HWR (WE)
D
15
to D
0
HWR (WE)
DACK
D
15
to D
0
A
23
to
A
0
T
r
T
c1
T
c2
Row
CAS (UCAS)
LCAS (LCAS)
Column
Note: n = 2 to 5
Figure 6.28 DACK Output Timing when DDS = 1 (Example of DRAM Access)
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6.6.2 When DDS = 0
When DRAM space is accessed in DMAC single address mode, full access (normal access) is
always performed. The DACK output goes low from the Tr state in the case of the DRAM
interface.
In modes other than DMAC single address mode, burst access can be used when accessing DRAM
space.
Figure 6.29 shows the DACK output timing for the DRAM interface when DDS = 0.
Tp
φ
Read
Write
CSn (RAS)
HWR (WE)
D15 to D0
HWR (WE)
DACK
D15 to D0
A23 to A0
TrTc1 Tc2
Row
CAS (UCAS)
LCAS (LCAS)
Column
Note: n = 2 to 5
Figure 6.29 DACK Output Timing when DDS = 0 (Example of DRAM Access)
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6.7 Burst ROM Interface
6.7.1 Overview
With the chip, external space area 0 can be designated as burst ROM space, and burst ROM
interfacing can be performed. The burst ROM space interface enables 16-bit configuration ROM
with burst access capability to be accessed at high speed.
Area 0 can be designated as burst ROM space by means of the BRSTRM bit in BCRH.
Consecutive burst accesses of a maximum of 4 words or 8 words can be performed for CPU
instruction fetches only. One or two states can be selected for burst access.
6.7.2 Basic Timing
The number of states in the initial cycle (full access) of the burst ROM interface is in accordance
with the setting of the AST 0 bit in ASTCR. Also, when the AST0 bit is set to 1, wait state
insertion is possible. One or two states can be selected for the burst cycle, according to the settin g
of the BRSTS1 bit in BCRH. Wait states cannot be inserted. When area 0 is designated as burst
ROM space, it becomes 16-bit access space regardless of the setting of the ABW0 bit in ABWCR.
When the BRSTS0 bit in BCRH is cleared to 0, burst access of up to 4 words is performed; when
the BRSTS0 bit is set to 1, burst access of up to 8 words is performed.
The basic access timing for burst ROM space is shown in figures 6.30 (a) and (b). The timing
shown in figure 6.30 (a) is for the case where the AST0 and BRSTS1 bits are both set to 1, and
that in figure 6.30 (b) is for the case where both these bits are cleared to 0.
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T1
A
ddress bus
φ
CS0
AS
Data bus
T2T3T1T2T1
Full access
T2
RD
Burst access
Only lower address changed
Read data Read data Read data
Figure 6.30 (a) Example of Burst ROM Access Timing (When AST0 = BRSTS1 = 1)
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T1
A
ddress bus
φ
CS0
AS
Data bus
T2T1T1
Full access
RD
Burst access
Only lower address changed
Read data Read data Read data
Figure 6.30 (b) Example of Burst ROM Access Timing (When AST0 = BRSTS1 = 0)
6.7.3 Wait Control
As with the basic bus interface, either program wait insertion or pin wait insertion using the WAIT
pin can be used in the initial cycle (full access) of the burst ROM interface. See section 6.4.5, Wait
Control.
Wait states cannot be inserted in a burst cycle.
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6.8 Idle Cycle
6.8.1 Operation
When the chip accesses external space, it can insert a 1-state idle cycle (TI) between bus cycles in
the following two cases: (1) when read accesses in different areas occur consecutively, and (2)
when a write cycle occurs immediately after a read cycle. By inserting an idle cycle it is possible,
for example, to avoid data collisions between ROM, with a long output floating time, and high-
speed memory, I/O interfaces, and so on.
Consecutive Reads in Different Areas: If consecutive reads in different areas occur while the
ICIS1 bit in BCRH is set to 1, an idle cycle is inserted at the start of the second read cycle. This is
enabled in advanced mode.
Figure 6.31 shows an example of the operation in this case. In this example, bus cycle A is a read
cycle from ROM with a long output floating time, and bus cycle B is a read cycle from SRAM,
each being located in a different area. In (a), an idle cycle is not inserted, and a collision occurs in
cycle B between the read data from ROM and that from SRAM. In (b), an idle cycle is inserted,
and a data collision is prevent ed.
T
1
A
ddress bus
φ
RD
Bus cycle A
Data bus
T
2
T
3
T
1
T
2
Bus cycle B Bus cycle A Bus cycle B
Long output
floating time
Data
collision
(a) Idle cycle not inserted
(ICIS1 = 0) (b) Idle cycle inserted
(ICIS1 = 1 (initial value))
T
1
Address bus
φ
RD
Data bus
T
2
T
3
T
I
T
1
T
2
CS (area A)
CS (area B)
CS (area A)
CS (area B)
Figure 6.31 Example of Idle Cycle Operation (1)
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Write after Read: If an external write occurs after an external read while the ICIS0 bit in BCRH
is set to 1, an idle cycle is inserted at the start of the write cycle.
Figure 6.32 shows an example of the operation in this case. In this example, bus cycle A is a read
cycle from ROM with a long output floating time, and bus cycle B is a CPU write cycle. In (a), an
idle cycle is not inserted, and a collision occurs i n cycle B between the read data from ROM and
the CPU write data. In (b), an idle cycle is inserted, and a data collision is preve nted.
T1
A
ddress bus
φ
RD
Bus cycle A
Data bus
T2T3T1T2
Bus cycle B
Long output
floating time
Data
collision
T1
Address bus
φ
RD
Bus cycle A
Data bus
T2T3TIT1
Bus cycle B
T2
HWR
HWR
CS (area A)
CS (area B)
CS (area A)
CS (area B)
(a) Idle cycle not inserted
(ICIS0 = 0) (b) Idle cycle inserted
(ICIS0 = 1 (initial value))
Figure 6.32 Example of Idle Cycle Operation (2)
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Relationship between Chip Select (CS) Signal and Read (RD) Signal: Depending on th e
system’s load conditions, the RD signal may lag be hind the CS signal. An example is shown in
figure 6.33.
In this case, with the setting for no idle cycle insertion (a), there may be a period of overlap
between the bus cycle A RD signal and the bus cycle B CS signal.
Setting idle cycle insertion, as in (b), however, will prevent any overlap between the RD and CS
signals.
In the initial state after reset release, idle cycle insertion (b) is set.
T1
A
ddress bus
φ
RD
Bus cycle A
T2T3T1T2
Bus cycle B
Possibility of overlap between
CS (area B) and RD
T1
Address bus
φ
Bus cycle A
T2T3TIT1
Bus cycle B
T2
CS (area A)
CS (area B)
RD
CS (area A)
CS (area B)
(a) Idle cycle not inserted
(ICIS1 = 0) (b) Idle cycle inserted
(ICIS1 = 1 (initial value))
Figure 6.33 Relationship between Chip Select (CS) and Read (RD)
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Usage Notes: When DRAM space* is accessed, t he ICIS0 and ICIS1 bit settings are disabled. In
the case of consecutive reads between different areas, for example, if the second access is a
DRAM access*, only a Tp cycle is inserted, and a TI cycle is not. The timing in this case is shown
in figure 6.34.
However, in burst access in RAS down mode these settings are enabled, and an idle cycle is
inserted. The timing in this case is shown in figures 6.35 (a) and (b).
Note: * The DRAM interface is not supported in the H8S/2321.
T1
A
ddress bus
φ
RD
External read
Data bus
T2T3TpTr
DRAM space read
Tc1 Tc2
Figure 6.34 Example of DRAM Access after External Read
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TpTrTc1 Tc2 T1T1T2T3Tc1 Tc2
Tc1
EXTAL
Address
RD
RAS
CAS, LCAS
Data bus
DRAM space read External read DRAM space read
Idle cycle
Figure 6.35 (a) Example of Idle Cycle Operation in RAS Down Mode (ICIS1 = 1)
T
p
T
r
T
c1
T
c2
T
1
T
1
T
2
T
3
T
c1
T
c2
T
c1
EXTAL
Address
RD
RAS
CAS, LCAS
Data bus
DRAM space read External read DRAM space write
Idle cycle
HWR
Figure 6.35 (b) Example of Idle Cycle Operation in RAS Down Mode (ICIS0 = 1)
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6.8.2 Pin States in Idle Cycle
Table 6.8 shows the pin states in an idle cycle.
Table 6.8 Pin States in Idle Cycle
Pins Pin State
A23 to A0 Contents of next bus cycle
D15 to D0 High impedance
CSn*2 High*1
CAS*4 High
AS High
RD High
HWR High
LWR High
DACKm*3 *4 High
Notes: 1. Remains low in DRAM space RAS down mode or a refresh cycle.
2. n = 0 to 7
3. m = 0 and 1
4. The CAS and DACKm pin functions are not supported in the H8S/2321.
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6.9 Write Data Buffer Function
The chip has a write data buffer function in the external data bus. Using the write data buffer
function enables external writes and DMA single address mode transfers to be executed in parallel
with internal accesses. The write data buffer function is made available by setting the WDBE bit
in BCRL to 1.
Figure 6.36 shows an example o f the timing when the write data buffer function is used. When this
function is used, if an external write or DMA single address mode transfer* continues for 2 states
or longer, and there is an internal access next, only an external write is executed in the first state,
but from the next state onward an internal access (on-chip memory or internal I/O register
read/write) is executed in parallel with the external write rather than waiting until it ends.
Note: * The DMAC is not supported in the H8S/2321.
T
1
Internal address bus
A
23
to A
0
External write cycle
HWR, LWR
T
2
T
W
T
W
T
3
On-chip memory read Internal I/O register read
Internal read signal
CSn
D
15
to D
0
External address
Internal memory
External
space
write
Internal I/O register address
Note: n = 0 to 7
Figure 6.36 Example of Timing when Write Data Buffer Function is Used
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6.10 Bus Release
6.10.1 Overview
The chip can release the external bus in response to a bus request from an external device. In the
external bus released state, the internal bus master continues to operate as long as there is no
external access.
If an internal bus master wants to make an external access in the external bus released state, or if a
refresh request* is generated, it can issue a bus request off-chip.
The BREQOPS bit can be used to change the BREQO output pin from PF2 to P53.
Note: * The DRAM interface is not supported in the H8S/2321.
6.10.2 Operation
In external expansion mode, the bus can be released to an external device by setting the BRLE bit
in BCRL to 1. Driving the BREQ pin low issues an external bus request to the chip. When the
BREQ pin is sampled, at the pr escribed timing the BACK pin is driven low, and the address bus,
data bus, and bus control signals are placed in the high-impedance state, establishing the external
bus released state.
In the external bus released state, an internal bus master can perform accesses using the internal
bus. When an internal bus master wants to make an external access, it temporarily defers
activation of the bus cycle, and waits for the bus request from the external bus master to be
dropped. Even if a refresh request* is generated in the external bus released state, refresh control*
is deferred until the external bus master drops the bus request.
If the BREQOE bit in BCRL is set to 1, when an internal bus master wants to make an external
access in the external bus released state, or when a refresh request* is generated, the BREQO pin
is driven low and a request can be made off-chip to drop the bus request.
When the BREQ pin is driven high, the BACK pin is driven high at the prescribed timing and the
external bus released state is terminated.
If an external bus release request and external access occur simultaneously, the order of priority is
as follows:
(High) External bus release > Internal bus master external access (Low)
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If a refresh request* and external bus release request occur simultaneously, the order of priority is
as follows:
(High) Refresh* > External bus release (Low)
As a refresh* and an external access by an internal bus master can be executed simultaneously,
there is no relative order of priority for these two operations.
Note: * The DRAM interface is not supported in the H8S/2321.
6.10.3 Pin States in External Bus Released State
Table 6.9 shows the pin states in the external bus released state.
Table 6.9 Pin States in Bus Released State
Pins Pin State
A23 to A0 High impedance
D15 to D0 High impedance
CSn*1 High impedance
CAS*3 High impedance
AS High impedance
RD High impedance
HWR High impedance
LWR High impedance
DACKm*2 *3 High
Notes: 1. n = 0 to 7
2. m = 0 or 1
3. The CAS and DACKm pin functions are not supported in the H8S/2321.
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6.10.4 Transition Timing
Figure 6.37 sho ws the timing for transition to the b us released state.
CPU
cycle
External bus released stateCPU cycle
Address
T
0
T
1
T
2
φ
A
ddress bus
Data bus
AS
HWR, LWR
BREQ
BACK
High impedance
Minimum
1 state
BREQO*
[1] [2] [3] [4] [5] [6]
[1]
[2]
[3]
[4]
[5]
[6]
Note: * Output only when BREQOE is set to 1.
Low level of BREQ pin is sampled at rise of T
2
state.
BACK pin is driven low at end of CPU read cycle, releasing bus to external
bus master.
BREQ pin state is still sampled in external bus released state.
High level of BREQ pin is sampled.
BACK pin is driven high, ending bus release cycle.
BREQO signal goes high 1.5 clocks after BACK signal goes high.
High impedance
High impedance
High impedance
RD High impedance
Figure 6.37 Bus Released State Transition Timing
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6.10.5 Usage Note
Do not set MSTP CR to H'FFFF or H'EFFF, since the external bus release function will ha lt if a
transition is made to sleep mode when either of these settings has been made.
6.11 Bus Arbitration
6.11.1 Overview
The chip has a bus arbiter that arbitrates bus master operations.
There are three bus masters, the CPU, DTC, and DMAC*, which perform read/write operations
when they have possession of the bus. Each bus master requests the bus by means of a bus request
signal. The bus arbiter determines prio rities at the prescribed timing, and permits use of the bus by
means of a bus request acknowledge signal. The selected bus master then takes possession of the
bus and begins its operation.
Note: * The DMAC is not supported in the H8S/2321.
6.11.2 Operation
The bus arbiter detects the bus masters' bus request signals, and if the bus is requested, sends a bus
request acknowledge signal to the bus master making the request. If there are bus requests from
more than one bus master, the bus request acknowledge signal is sent to the one with the highest
priority. When a bus master receives t he bus request ack nowledge signa l, it takes possession of the
bus until that signal is canceled.
The order of priority of the bus masters is as follows:
(High) DMAC* > DTC > CPU (Low)
An internal bus access by an internal bus master, external bus release, and refreshing*, can be
executed in parallel.
In the event of simultaneous external bus release request, refresh request*, and internal bus master
external access request generation, the order of priority is as follows:
(High) Refresh* > External bus release (Low)
(High) External bus release > Internal bus master external access (Low)
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As a refresh* and an external access by an internal bus master can be executed simultaneously,
there is no relative order of priority for these two operations.
Note: * The DMAC and DRAM interface are not supported in the H8S/2321.
6.11.3 Bus Transfer Timing
Even if a bus request is received from a bus master with a higher priority than that of the bus
master that has acquired the bus and is currently operating, the bus is not necessarily transferred
immediately. There are specific times at which each bus master can relinquish the bus.
CPU: The CPU is the lowest-priority bus master, and if a bus request is received from the DTC or
DMAC*, the bus arbiter transfers the bus to the bus master that issued the request. The timing for
transfer of the bus is as follows:
• The bus is transferred at a break between bus cycles. However, if a bus cycle is executed in
discrete operations, as in the case of a longword-size access, the bus is not transferred between
the operations. See appendix A.5, Bus States d uri ng I nstruction Execution, for ti mings at
which the bus is not transferred.
• If the CPU is in sleep mode, it transfers the bus immediately.
DTC: The DTC sends the bus arbiter a request for the bus when an activation request is generated.
The DTC can release the bus after a vector read, a register information read (3 states), a single data
transfer, or a register information write (3 states). It does not release the bus during a register
information read (3 states), a single data transfer, or a register information write (3 states).
DMAC*: The DMAC sends the bus arbiter a request for the bus when an activation request is
generated.
In the case of an external request in short address mode or normal mode, and in cycle steal mode,
the DMAC releases the bus after a single transfer.
In block transfer mode, it releases the bus after transfer of one block, and in burst mode, after
completion of a transfer.
Note: * The DMAC is not supported in the H8S/2321.
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6.11.4 External Bus Release Usage Note
External bus release can be performed on completion of an external bus cycle. The RD signal and
the DRAM interface* RAS and CAS signals remain low until the end of the external bus cycle.
Therefore, when external bus release is performed, the RD, RAS, and CAS signals may change
from the low level to the high-impedance state.
Note: * The DRAM interface is not supported in the H8S/2321.
6.12 Resets and the Bus Controller
In a reset, the chip, including the bus controller, enters the reset state at that point, and any
executing bus cycle is discontinued.
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Section 7 DMA Controller (Not Supported in the H8S/2321)
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Section 7 DMA Controller
(Not Supported in the H8S/2321)
7.1 Overview
The chip has a built-in DMA controller* (DMAC) which can carry out data transfer on up to 4
channels.
Note: * The DMAC is not supported in the H8S/2321.
7.1.1 Features
The features of the DMAC are listed below.
• Choice of short address mode or full address mode
Short address mode
⎯ Maximum of 4 channels can be used
⎯ Choice of dual address mode or single address mode
⎯ In dual address mode, one of the two addresses, transfer source and transfer destination, is
specified as 24 bits and the other as 16 bits
⎯ In single address mode, transfer source or transfer destination address only is specified as
24 bits
⎯ In single address mode, transfer can be performed in one bus cycle
⎯ Choice of sequential mode, idle mode, or repeat mode for dual address mode and single
address mode
Full address mode
⎯ Maximum of 2 channels can be used
⎯ Transfer source and transfer destination address specified as 24 bits
⎯ Choice of normal mode or block transfer mode
• 16-Mbyte address space can be specified directly
• Byte or word can be set as the transfer unit
• Activation sources: internal in terrupt, external request, auto-req uest (dep ending on transfer
mode)
⎯ Six 16-bit timer-pulse unit (TPU) compare match/input capture interrupts
⎯ Serial communication interface (SCI0, SCI1) transmission data empty interrupt, reception
data full interrupt
⎯ A/D converter conversion end interrupt
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⎯ External request
⎯ Auto-request
• Module stop mode can be set
⎯ The initial setting enable s DMAC registers to b e accessed. DMAC operation is ha lted by
setting module stop mode
7.1.2 Block Diagram
A block diagram of the DMAC is shown in figure 7.1.
Internal address bus
Address buffer
Processor
Internal interrupts
TGI0A
TGI1A
TGI2A
TGI3A
TGI4A
TGI5A
TXI0
RXI0
TXI1
RXI1
ADI
External pins
DREQ0
DREQ1
TEND0
TEND1
DACK0
DACK1
Interrupt signals
DEND0A
DEND0B
DEND1A
DEND1B
Control logic
DMAWER
DMACR1B
DMACR1A
DMACR0B
DMACR0A
DMATCR
DMABCR
Data buffer
Internal data bus
MAR0A
IOAR0A
ETCR0A
MAR0B
IOAR0B
ETCR0B
MAR1A
IOAR1A
ETCR1A
MAR1B
IOAR1B
ETCR1B
Legend:
DMAWER: DMA write enable register
DMATCR: DMA terminal control register
DMABCR: DMA band control register (for all channels)
DMACR: DMA control register
MAR: Memory address register
IOAR: I/O address register
ETCR: Execute transfer count register
Channel 0Channel 1
Channel 0AChannel 0BChannel 1AChannel 1B
Module data bus
Figure 7.1 Block Diagram of DMAC
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7.1.3 Overview of Functions
Tables 7.1 (1) and (2) summarize DMAC functions in short address mode and full address mode,
respectively.
Table 7.1 (1) Overview of DMAC Functions (Sho rt Address Mode)
Address Register Bit Length
Transfer Mode Transfer Source Source Destination
Dual address mode
• Sequential mode
⎯ 1-byte or 1-word transfer executed
for one transfer request
⎯ Memory address
incremented/decremented by 1 or 2
⎯ 1 to 65,536 transfers
• Idle mode
⎯ 1-byte or 1-word transfer executed
for one transfer request
⎯ Memory address fixed
⎯ 1 to 65,536 transfers
• Repeat mode
⎯ 1-byte or 1-word transfer executed
for one transfer request
⎯ Memory address incremented/
decremented by 1 or 2
⎯ After specified number of transfers
(1 to 256), initial state is restored
and operation continues
• TPU channel 0 to
5 compare
match/input
capture A
interrupt
• SCI transmit-
data-empty
interrupt
• SCI receive-
data-full interr upt
• A/D converter
conversion end
interrupt
• External request
24/16 16/24
• Single address mode
• 1-byte or 1-word transfer executed for
one transfer request
• Transfer in 1 bus cycle using DACK pin
in place of address specifying I/O
• Specifiable for sequential, idle, and
repeat modes
• External request 24/DACK DACK/24
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Table 7.1 (2) Overview of DMAC Functions (Full Address Mode)
Address Register Bit Length
Transfer Mode Transfer Source Source Destination
• Normal mode
Auto-request
⎯ Transfer request retained internally
⎯ Transfers continue for the specified
number of times (1 to 65,536)
⎯ Choice of burst or cycle ste al
transfer
• Auto-request 24 24
External request
⎯ 1-byte or 1-word transfer executed
for one transfer request
⎯ 1 to 65,536 transfers
• External request
• Block transfer mode
⎯ Specified block size transfer
executed for one transfer request
⎯ 1 to 65,536 transfers
⎯ Either source or desti nati on
specifiable as block area
⎯ Block size: 1 to 256 bytes or words
• TPU channel 0 to
5 compare
match/input
capture A
interrupt
• SCI transmit-
data-empty
interrupt
• SCI receive-
data-full interr upt
• External request
• A/D converter
conversion end
interrupt
24 24
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7.1.4 Pin Configuration
Table 7.2 summarizes the DMAC pins.
In short address mode, external request transfer, single address transfer, and transfer end output
are not performed for channel A.
The DMA transfer acknowledge function is used in channel B single ad dress mode in short
address mode.
When the DREQ pin is used, do not designate the corresponding port for output.
With regard to the DACK pins, setting single address transfer automatically sets the corresponding
port to output, functioning as a DACK pin.
With regard to the TEND pins, whether or not the corresponding port is used as a TEND pin can
be specified by means of a register setting.
Table 7.2 DMAC Pins
Channel Pin Name Symbol I/O Function
0 DMA request 0 DREQ0 Input DMAC channel 0 external
request
DMA transfer acknowledge 0 DACK0 Output D MAC channel 0 single address
transfer acknowledge
DMA transfer end 0 TEND0 Output DMAC channel 0 transfer end
1 DMA request 1 DREQ1 Input DMAC channel 1 external
request
DMA transfer acknowledge 1 DACK1 Output D MAC channel 1 single address
transfer acknowledge
DMA transfer end 1 TEND1 Output DMAC channel 1 transfer end
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7.1.5 Register Configuration
Table 7.3 summarizes the DMAC registers.
Table 7.3 DMAC Registers
Channel
Name
Abbreviation
R/W Initial
Value
Address* Bus Width
0 Memory address register 0A MAR0A R/W Undefined H'FEE0 16 bits
I/O address register 0A IOAR0A R/W Undefined H'FEE4 16 bits
Transfer count register 0A ETCR0A R/W Undefined H'FEE6 16 bits
Memory address register 0B MAR0B R/W Undefined H'FEE8 16 bits
I/O address register 0B IOAR0B R/W Undefined H'FEEC 16 bits
Transfer count register 0B ETCR0B R/W Undefined H'FEEE 16 bits
1 Memory address register 1A MAR1A R/W Undefined H'FEF0 16 bits
I/O address register 1A IOAR1A R/W Undefined H'FEF4 16 bits
Transfer count register 1A ETCR1A R/W Undefined H'FEF6 16 bits
Memory address register 1B MAR1B R/W Undefined H'FEF8 16 bits
I/O address register 1B IOAR1B R/W Undefined H'FEFC 16 bits
Transfer count register 1B ETCR1B R/W Undefined H'FEFE 16 bits
0, 1 DMA write enable register DMAWER R/W H'00 H'FF00 8 bits
DMA terminal control register DMATCR R/W H'00 H'FF01 8 bits
DMA control register 0A DMACR0A R/W H'00 H'FF02 16 bits
DMA control register 0B DMACR0B R/W H'00 H'FF03 16 bits
DMA control register 1A DMACR1A R/W H'00 H'FF04 16 bits
DMA control register 1B DMACR1B R/W H'00 H'FF05 16 bits
DMA band control register DMABCR R/W H'0000 H'FF06 16 bits
Module stop control register MSTPCR R/W H'3FFF H'FF3C 8 bits
Note: * Lower 16 bits of the address.
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7.2 Register Descriptions (1) (Short Address Mode)
Short address mode transfer can be performed for channels A and B independently.
Short address mode transfer is specified for each channel by clearing the FAE bit in DMABCR to
0, as shown in table 7.4. Short address mode or full address mode can be selected for channels 1
and 0 independently by means of bits FAE1 and FAE0.
Table 7.4 Short Address Mode and Full Address Mode (F or 1 Channel: Example of
Channel 0)
FAE0 Description
0 Short address mode specified (channels A and B operate independently)
Channel 0A
MAR0A Specifies transfer source/transfer destination address
Specifies transfer destination/transfer source address
Specifies number of transfers
Specifies transfer size, mode, activation source, etc.
Specifies transfer source/transfer destination address
Specifies transfer destination/transfer source address
Specifies number of transfers
Specifies transfer size, mode, activation source, etc.
IOAR0A
ETCR0A
DMACR0A
Channel 0B
MAR0B
IOAR0B
ETCR0B
DMACR0B
1 Full address mode specified (channels A and B operate in combination)
Channel 0
MAR0A Specifies transfer source address
Specifies transfer destination address
Not used
Not used
Specifies number of transfers
Specifies number of transfers (used in block transfer
mode only)
Specifies transfer size, mode, activation source, etc.
IOAR0A
ETCR0A
DMACR0A
MAR0B
IOAR0B
ETCR0B
DMACR0B
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7.2.1 Memory Address Registers (MAR)
Bit : 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
MAR : — — — — — — — —
Initial value : 0 0 0 0 0 0 0 0 * * * * * * * *
R/W : — — — — — — — — R/W R/W R/W R/W R/W R/W R/W R/W
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
MAR :
Initial value : * * * * * * * * * * * * * * * *
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
*: Undefined
MAR is a 32-bit readable/writable register that specifies the transfer source address or destination
address.
The upper 8 bits of MAR are reserved: they are always read as 0, and cannot be modified.
Whether MAR functions as the source address register or as the destination address register can be
selected by means o f the DT DIR bit in DMACR.
MAR is incremented or decremented each time a byte or word transfer is executed, so that the
address specified by MAR is constantly updated. For details, see section 7.2.4, DMA Control
Register (DMACR).
MAR is not initialized by a reset or in standby mode.
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7.2. 2 I/O Address Re gister (IOAR )
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
IOAR :
Initial value : * * * * * * * * * * * * * * * *
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
*: Undefined
IOAR is a 16-bit readable/writable register that specifies the lower 16 bits of the transfer source
address or destination address. The upper 8 bits of the transfer address are automatically set to
H'FF.
Whether IOAR functions as the source address register or as the destination address register can
be selected by means of the DTDIR bit in DMACR.
IOAR is invalid in sin gle address mode.
IOAR is not incremented or decremented each time a transfer is executed, so the address specified
by IOAR is fixed.
IOAR is not initialized by a reset or in standby mode.
7.2.3 Execute Transfer Count Register (ETCR)
ETCR is a 16-bit readable/writable register that specifies the number of transfers. The setting of
this register is different for sequential mode and idle mode on the one hand, and for repeat mode
on the other.
Sequential Mode and Idle Mode
Transfer Counter (ETCR)
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
:
Initial value : * * * * * * * * * * * * * * * *
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
*: Undefined
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In sequential mode and idle mod e, ETCR functions as a 16-bit transfer counter (with a count range
of 1 to 65,536). ETCR is decremented by 1 each time a transfer is performed, and when the count
reaches H'0000, the DTE bit in DMABCR is cleared, and transfer ends.
Repeat Mode
Transfer Number Storage (ETCRH)
Bit : 15 14 13 12 11 10 9 8
Initial value : * * * * * * * *
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
Transfer Counter (ETCRL)
Bit : 7 6 5 4 3 2 1 0
Initial value : * * * * * * * *
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
*: Undefined
In repeat mode, ETCR functions as transfer counter ETCRL (with a count range of 1 to 256) and
transfer number storage register ETCRH. ETCRL is decremented by 1 each time a transfer is
performed, and when the count reaches H'00, ETCRL is loaded with the value in ETCRH. At this
point, MAR is automatically restored to the value it had when the count was started. The DTE bit
in DMABCR is not cleared, and so transfers can be performed repeatedly until the DTE bit is
cleared by the user.
ETCR is not initialized by a reset or in standby mode.
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7.2.4 DM A Control Register (DMACR)
Bit : 7 6 5 4 3 2 1 0
DTSZ DTID5 RPE DTDIR DTF3 DTF2 DTF1 DTF0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
DMACR is an 8-bit readable/writable register that controls the operation of each DMAC channel.
DMACR is initialized to H'00 by a reset, and in standby mode.
Bit 7—Data Transfer Size (DTSZ): Selects the size of data to be transferred at one time.
Bit 7
DTSZ
Description
0 Byte-size transfer (Initial value)
1 Word-size transfer
Bit 6—Data Transfer Increment/Decrement (DTID): Selects incrementing or decrementing of
MAR after every data transfer in sequential mode or rep eat mode.
In idle mode, MAR is neither incremented nor decremented.
Bit 6
DTID
Description
0 MAR is incremented after a data transfer (Initial value)
• When DTSZ = 0, MAR is incremented by 1 after a transfer
• When DTSZ = 1, MAR is incremented by 2 after a transfer
1 MAR is decremented after a data transfer
• When DTSZ = 0, MAR is decremented by 1 after a transfer
• When DTSZ = 1, MAR is decremented by 2 after a transfer
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Bit 5—Repeat Enable (RPE): Used in combination with the DTIE bit in DMABCR to select the
mode (sequential, idle, or repeat) in which transfer is to be performed.
Bit 5
RPE DMABCR
DTIE
Description
0 0 Transfer in sequential mode (no transfer end interrupt) (Initial value)
1 Transfer in sequential mode (with transfer end interrupt)
1 0 Transfer in repeat mode (no transfer end interrupt)
1 Transfer in idle mode (with transfer end interrupt)
For details of operation in sequential, idle, and repeat mode, see section 7.5.2, Sequential Mode,
section 7.5.3, Idle Mode, and section 7.5.4, Repeat Mode.
Bit 4—Data Transfer Direction (DTDIR): Used in combination with the SAE bit in DMABCR
to specify the data transfer direction (source or destination). The function of this bit is therefore
different in dual address mode and single address mode.
DMABCR
SAE Bit 4
DTDIR
Description
0 0 Transfer with MAR as source address and IOAR as destination
address (Initial value)
1 Transfer with IOAR as source address and MAR as destination address
1 0 Transfer with MAR as source address and DACK pin as write strobe
1 Transfer with DACK pin as read strobe and MAR as destination address
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Bits 3 to 0—Data Transfer Factor (DTF3 to DTF0): These bits select the data transfer factor
(activation source). There are some differences in activation sources for channel A and for channel
B.
Channel A
Bit 3
DTF3 Bit 2
DTF2 Bit 1
DTF1 Bit 0
DTF0
Description
0 0 0 0 — (Initial value)
1 Activated by A/D converter conversion end interrupt
1 0 —
1 —
1 0 0 Activated by SCI channel 0 transmit-data-empty interrupt
1 Activated by SCI channel 0 receive-data-full interrupt
1 0 Activated by SCI channel 1 transmit-data-empty interrupt
1 Activated by SCI channel 1 receive-data-full interrupt
1 0 0 0 Activated by TPU channel 0 compare match/input capture
A interrupt
1 Activated by TPU channel 1 compare match/input capture
A interrupt
1 0 Activated by TPU channel 2 compare match/input capture
A interrupt
1 Activated by TPU channel 3 compare match/input capture
A interrupt
1 0 0 Activated by TPU channel 4 compare match/input capture
A interrupt
1 Activated by TPU channel 5 compare match/input capture
A interrupt
1 0 —
1 —
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Channel B
Bit 3
DTF3 Bit 2
DTF2 Bit 1
DTF1 Bit 0
DTF0
Description
0 0 0 0 — (Initial value)
1 Activated by A/D converter conversion end interrupt
1 0 Activated by DREQ pin falling edge input*
1 Activated by DREQ pin low-level input
1 0 0 Activated by SCI channel 0 transmit-data-empty interrupt
1 Activated by SCI channel 0 receive-data-full interrupt
1 0 Activated by SCI channel 1 transmit-data-empty interrupt
1 Activated by SCI channel 1 receive-data-full interrupt
1 0 0 0 Activated by TPU channel 0 compare match/input capture
A interrupt
1 Activated by TPU channel 1 compare match/input capture
A interrupt
1 0 Activated by TPU channel 2 compare match/input capture
A interrupt
1 Activated by TPU channel 3 compare match/input capture
A interrupt
1 0 0 Activated by TPU channel 4 compare match/input capture
A interrupt
1 Activated by TPU channel 5 compare match/input capture
A interrupt
1 0 —
1 —
Note: * Detected as a low level in the first transfer after transfer is enabled.
The same factor can be selected for more than one channel. In this case, activation starts with the
highest-priority channel according to the relative channel priorities. For relative channel prio rities,
see section 7.5.13, DMAC Multi-Channel Operation.
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7.2.5 DM A Band Control Register (DMABCR)
DMABCRH
Bit : 15 14 13 12 11 10 9 8
FAE1 FAE0 SAE1 SAE0 DTA1B DTA1A DTA0B DTA0A
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
DMABCRL
Bit : 7 6 5 4 3 2 1 0
DTE1B DTE1A DTE0B DTE0A DTIE1B DTIE1A DTIE0B DTIE0A
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
DMABCR is a 16-bit readable/writable register that controls the operation of each DMAC
channel.
DMABCR is initialized to H'0000 by a reset, and in hardware standby mode.
Bit 15—Full Address Enable 1 (FAE1): Specifies whether channel 1 is to be used in short
address mode or full address mode.
In short address mode, channels 1A and 1B can be used as independent channels.
Bit 15
FAE1
Description
0 Short address mode (Initial value)
1 Full address mode
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Bit 14—Full Address Enable 0 (FAE0): Specifies whether channel 0 is to be used in short
address mode or full address mode.
In short address mode, channels 0A and 0B can be used as independent channels.
Bit 14
FAE0
Description
0 Short address mode (Initial value)
1 Full address mode
Bit 13—Single Address Enable 1 (SAE1): Specifies whether channel 1B is to be used for
transfer in dual address mode or single address mode.
This bit is invalid in full address mode.
Bit 13
SAE1
Description
0 Transfer in dual address mode (Initial value)
1 Transfer in single address mode
Bit 12—Single Address Enable 0 (SAE0): Specifies whether channel 0B is to be used for
transfer in dual address mode or single address mode.
This bit is invalid in full address mode.
Bit 12
SAE0
Description
0 Transfer in dual address mode (Initial value)
1 Transfer in single address mode
Bits 11 to 8—Data Transfer Acknowledge (DTA): These bits enable or disable clearing, when
DMA transfer is performed, of the internal interrupt source selected by the data transfer factor
setting.
When DTE = 1 and DTA = 1, the internal interrupt source selected by the data transfer factor
setting is cleared automatically by DMA transfer. When DTE = 1 and DTA = 1, the internal
interrupt source selected by the data transfer factor setting d o es not issue an interrupt request to the
CPU or DTC.
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When DTE = 1 and DTA = 0, the internal interrupt source selected by the data transfer factor
setting is not cleared when a transfer is performed, and can issue an interrupt request to the CPU
or DTC in parallel. In this case, the interrupt source should be cleared by the CPU or DTC
transfer.
When DTE = 0, the internal interrupt source selected by the data transfer factor setting issues an
interrupt request to the CPU or DTC regardless of the DTA b it setting.
Bit 11—Data Transfer Acknowledge 1B (DTA1B): Enables or disables clearing, when DMA
transfer is performed, of the internal interrupt source selected by the channel 1B data transfer
factor setting.
Bit 11
DTA1B
Description
0 C learin g of select ed inter nal interrupt sour ce at time of DM A transfer is disab led
(Initial value)
1 C learin g of select ed inter nal interrupt sour ce at time of DM A transfer is enable d
Bit 10—Data Transfer Acknowledge 1A (DTA1A): Enables or disables clearing, when DMA
transfer is performed, of the internal interrupt source selected by the channel 1A data transfer
factor setting.
Bit 10
DTA1A
Description
0 C learin g of select ed inter nal interrupt sour ce at time of DM A transfer is disab led
(Initial value)
1 C learin g of select ed inter nal interrupt sour ce at time of DM A transfer is enable d
Bit 9—Data Transfer Acknowledge 0B (DTA0B): Enables or disables clearing, when DMA
transfer is performed, of the internal interrupt source selected by the channel 0B data transfer
factor setting.
Bit 9
DTA0B
Description
0 C learin g of select ed inter nal interrupt sour ce at time of DM A transfer is disab led
(Initial value)
1 C learin g of select ed inter nal interrupt sour ce at time of DM A transfer is enable d
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Bit 8—Data Transfer Acknowledge 0A (DTA0A): Enables or disables clearing, when DMA
transfer is performed, of the internal interrupt source selected by the channel 0A data transfer
factor setting.
Bit 8
DTA0A
Description
0 C learin g of select ed inter nal interrupt sour ce at time of DM A transfer is disab led
(Initial value)
1 C learin g of select ed inter nal interrupt sour ce at time of DM A transfer is enable d
Bits 7 to 4—Data Transfer Enable (DTE): When DTE = 0, data transfer is disabled and the
activation source selected by the data transfer factor setting is ignored. If the activation source is
an internal interrupt, an interrupt request is issued to the CPU or DTC. If the DTIE b it is set to 1
when DTE = 0, the DMAC regards this as indicating the end of a transfer, and issues a transfer
end interrupt request to the CPU or DTC.
The conditions for the DTE bit being cleared to 0 are as follows:
• When initialization is perfor m e d
• When the specified number of transfers have been completed in a transfer mode other than
repeat mode
• When 0 is written to the DTE bit to forcibly abort the transfer, or for a similar reason
When DTE = 1, data transfer is enabled and the DMAC waits for a request by the activation
source selected by the data transfer factor setting. When a request is issued by the activation
source, DMA transfer is executed.
The condition for the DTE b it being set to 1 is as follows:
• When 1 is written to the DTE bit after the DTE b it is read as 0
Bit 7—Data Transfer Enable 1B (DTE1B): Enables or disables data transfer on channel 1B.
Bit 7
DTE1B
Description
0 Data transfer disabled (Initial value)
1 Data transfer enabled
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Bit 6—Data Transfer Enable 1A (DTE1A): Enables or disables data transfer on channel 1A.
Bit 6
DTE1A
Description
0 Data transfer disabled (Initial value)
1 Data transfer enabled
Bit 5—Data Transfer Enable 0B (DTE0B): Enables or disables data transfer on channel 0B.
Bit 5
DTE0B
Description
0 Data transfer disabled (Initial value)
1 Data transfer enabled
Bit 4—Data Transfer Enable 0A (DTE0A): Enables or disables data transfer on channel 0A.
Bit 4
DTE0A
Description
0 Data transfer disabled (Initial value)
1 Data transfer enabled
Bits 3 to 0—Data Transfer End Interrupt Enable (DTIE): These bits enable or disable an
interrupt to the CPU or DTC when transfer ends. If the DTIE bit is set to 1 when DTE = 0, the
DMAC regards this as indicating the end of a transfer, and issues a transfer end interrupt request to
the CPU or DTC.
A transfer end interrupt can be canceled either by clearing the DTIE bit to 0 in the interrupt
handling routine, or by performing processing to continue transfer by setting the transfer counter
and address register again, and then setting the DTE bit to 1.
Bit 3—Data Transfer Interrupt Enable 1B (DTIE1B): Enables or disables the channel 1B
transfer end interrupt.
Bit 3
DTIE1B
Description
0 Transfer end interrupt disabled (Initial value)
1 Transfer end interrupt enabled
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Bit 2—Data Transfer Interrupt Enable 1A (DTIE1A): Enables or disables the channel 1A
transfer end interrupt.
Bit 2
DTIE1A
Description
0 Transfer end interrupt disabled (Initial value)
1 Transfer end interrupt enabled
Bit 1—Data Transfer Interrupt Enable 0B (DTIE0B): Enables or disables the channel 0B
transfer end interrupt.
Bit 1
DTIE0B
Description
0 Transfer end interrupt disabled (Initial value)
1 Transfer end interrupt enabled
Bit 0—Data Transfer Interrupt Enable 0A (DTIE0A): Enables or disables the channel 0A
transfer end interrupt.
Bit 0
DTIE0A
Description
0 Transfer end interrupt disabled (Initial value)
1 Transfer end interrupt enabled
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7.3 Register Descriptions (2) (Full Address Mode)
Full address mode transfer is performed with channels A and B together. For details of full address
mode setting, see table 7.4.
7.3.1 Memory Address Register (MAR)
Bit : 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
— — — — — — — —
Initial value : 0 0 0 0 0 0 0 0 * * * * * * * *
R/W : — — — — — — — — R/W R/W R/W R/W R/W R/W R/W R/W
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : * * * * * * * * * * * * * * * *
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
*: Undefined
MAR is a 32-bit readable/writable register; MARA functions as the transfer source address
register, and MARB as the destination address register.
MAR is composed of two 16-bit registers, MARH and MARL. The upper 8 bits of MARH are
reserved: they are always read as 0, and cannot be modified.
MAR is incremented or decremented each time a byte or word transfer is executed, so that the
source or destination memory address can be updated automatically. For details, see section 7.3.4,
DMA Control Register ( DMACR).
MAR is not initialized by a reset or in standby mode.
7.3. 2 I/O Address Re gister (IOAR )
IOAR is not used in full address transfer.
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7.3.3 Execute Transfer Count Register (ETCR)
ETCR is a 16-bit readable/writable register that specifies the number of transfers. The function of
this register is different in normal mode and in block transfer mode.
ETCR is not initialized by a reset or in standby mode.
Normal Mode
ETCRA
Transfer Counter
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : * * * * * * * * * * * * * * * *
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
*: Undefined
In normal mode, ETCRA functions as a 16-bit transfer counter. ETCRA is decremented by 1 each
time a transfer is performed, and transfer ends when the count reaches H'0000. ETCRB is not used
at this time.
ETCRB
ETCRB is not used in normal mode.
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Block Transfer Mode
ETCRA
Block Size Storage (ETCRAH)
Bit : 15 14 13 12 11 10 9 8
Initial value : * * * * * * * *
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
Block Size Counter (ETCRAL)
Bit : 7 6 5 4 3 2 1 0
Initial value : * * * * * * * *
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
*: Undefined
ETCRB
Block Transfer Counter
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : * * * * * * * * * * * * * * * *
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
*: Undefined
In block transfer mode, ETCRAL functions as an 8-bit block size counter and ETCRAH holds the
block size. ETCRAL is decremented each time a 1-byte or 1-wo rd transfer is performed, and when
the count reaches H'00, ETCRAL is loaded with the value in ETCRAH. So by setting the block
size in ETCRAH and ETCRAL, it is possible to repeatedly transfer blocks consisting of any
desired number of bytes or words.
ETCRB functions in block transfer mode, as a 16-bit block transfer counter. ETCRB is
decremented by 1 each time a block is transferred, and transfer ends when the count reaches
H'0000.
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7.3.4 DM A Control Register (DMACR)
DMACR is a 16-bit readable/writable register that controls the operation of each DMAC channel.
In full address mode, DMACRA and DMACRB have different functions.
DMACR is initialized to H'0000 by a reset, and in hardware standby mode.
DMACRA
Bit : 15 14 13 12 11 10 9 8
DTSZ SAID SAIDE BLKDIR BLKE — — —
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
DMACRB
Bit : 7 6 5 4 3 2 1 0
— DAID DAIDE — DTF3 DTF2 DTF1 DTF0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
Bit 15—Data Transfer Size (DTSZ): Selects the size of data to be transferred at one time.
Bit 15
DTSZ
Description
0 Byte-size transfer (Initial value)
1 Word-size transfer
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Bit 14—Source Address Increment/Decrement (SAID)
Bit 13—Source Address Increment/Decrement Enable (SAIDE): These bits specify whether
source address register MARA is to be incremented, decremented, or left unchanged, when data
transfer is performed.
Bit 14
SAID Bit 13
SAIDE
Description
0 0 MARA is fixed (Initial value)
1 MARA is incremented after a data transfer
• When DTSZ = 0, MARA is incremented by 1 after a transfer
• When DTSZ = 1, MARA is incremented by 2 after a transfer
1 0 MARA is fixed
1 MARA is decremented after a data transfer
• When DTSZ = 0, MARA is decremented by 1 after a transfer
• When DTSZ = 1, MARA is decremented by 2 after a transfer
Bit 12—Block Direction (BLKDIR)
Bit 11—Block Enable (BLKE): These bits specify whether normal mode or block transfer mode
is to be used. If block transfer mode is specified, the BLKDIR bit specifies whether the source side
or the destination side is to b e the bloc k area.
Bit 12
BLKDIR Bit 11
BLKE
Description
0 0 Transfer in normal mode (Initial value)
1 Transfer in block transfer mode, destination side is block area
1 0 Transfer in normal mode
1 Transfer in block transfer mode, source side is block area
For operation in normal mode and block transfer mode, see section 7.5, Operation.
Bits 10 to 7—Reserved: Can be read or written to. Only 0 should be written to these bits.
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Bit 6—Destination Address Increment/Decrement (DAID)
Bit 5—Destination Address Increment/Decrement Enable (DAIDE): These bits specify
whether destination address register MARB is to be incremented, decremented, or left unchanged,
when data transfer is performed.
Bit 6
DAID Bit 5
DAIDE
Description
0 0 MARB is fixed (Initial value)
1 MARB is incremented after a data transfer
• When DTSZ = 0, MARB is incremented by 1 after a transfer
• When DTSZ = 1, MARB is incremented by 2 after a transfer
1 0 MARB is fixed
1 MARB is decremented after a data transfer
• When DTSZ = 0, MARB is decremented by 1 after a transfer
• When DTSZ = 1, MARB is decremented by 2 after a transfer
Bit 4—Reserved: Can be read or written to. Only 0 should be written to this bit.
Bits 3 to 0—Data Transfer Factor (DTF3 to DTF0): These bits select the data transfer factor
(activation source). The factors that can be specified differ between normal mode and block
transfer mode.
• Normal Mode
Bit 3
DTF3 Bit 2
DTF2 Bit 1
DTF1 Bit 0
DTF0
Description
0 0 0 0 — (Initial value)
1 —
1 0 Activated by DREQ pin falling edge input
1 Activated by DREQ pin low-level input
1 0 * —
1 0 Auto-request (cycle steal)
1 Auto-request (burst)
1 * * * —
*: Don't care
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• Block Transfer Mode
Bit 3
DTF3 Bit 2
DTF2 Bit 1
DTF1 Bit 0
DTF0
Description
0 0 0 0 — (Initial value)
1 Activated by A/D converter conversion end interrupt
1 0 Activated by DREQ pin falling edge input*
1 Activated by DREQ pin low-level input
1 0 0 Activated by SCI channel 0 transmit-data-empty interrupt
1 Activated by SCI channel 0 receive-data-full interrupt
1 0 Activated by SCI channel 1 transmit-data-empty interrupt
1 Activated by SCI channel 1 receive-data-full interrupt
1 0 0 0 Activated by TPU channel 0 compare match/input capture
A interrupt
1 Activated by TPU channel 1 compare match/input capture
A interrupt
1 0 Activated by TPU channel 2 compare match/input capture
A interrupt
1 Activated by TPU channel 3 compare match/input capture
A interrupt
1 0 0 Activated by TPU channel 4 compare match/input capture
A interrupt
1 Activated by TPU channel 5 compare match/input capture
A interrupt
1 0 —
1 —
Note: * Detected as a low level in the first transfer after transfer is enabled.
The same factor can be selected for more than one channel. In this case, activation starts with the
highest-priority channel according to the relative channel priorities. For relative channel prio rities,
see section 7.5.13, DMAC Multi-Channel Operation.
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7.3.5 DM A Band Control Register (DMABCR)
DMABCRH:
Bit : 15 14 13 12 11 10 9 8
FAE1 FAE0 — — DTA1 — DTA0 —
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
DMABCRL:
Bit : 7 6 5 4 3 2 1 0
: DTME1 DTE1 DTME0 DTE0 DTIE1B DTIE1A DTIE0B DTIE0A
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
DMABCR is a 16-bit readable/writable register that controls the operation of each DMAC
channel.
DMABCR is initialized to H'0000 by a reset, and in hardware standby mode.
Bit 15—Full Address Enable 1 (FAE1): Specifies whether channel 1 is to be used in short
address mode or full address mode.
In full address mode, channels 1A and 1B are used together as a single channel.
Bit 15
FAE1
Description
0 Short address mode (Initial value)
1 Full address mode
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Bit 14—Full Address Enable 0 (FAE0): Specifies whether channel 0 is to be used in short
address mode or full address mode.
In full address mode, channels 0A and 0B are used together as a single channel.
Bit 14
FAE0
Description
0 Short address mode (Initial value)
1 Full address mode
Bits 13 and 12—Reserved: Can be read or written to. Only 0 should be written to these bits.
Bits 11 and 9—Data Transfer Acknowledge (DTA): These bits enable or disable clearing, when
DMA transfer is performed, of the internal interrupt source selected by the data transfer factor
setting.
When DTE = 1 and DTA = 1, the internal interrupt source selected by the data transfer factor
setting is cleared automatically by DMA transfer. When DTE = 1 and DTA = 1, the internal
interrupt source selected by the data transfer factor setting d o es not issue an interrupt request to the
CPU or DTC.
When DTE = 1 and DTA = 0, the internal interrupt source selected by the data transfer factor
setting is not cleared when a transfer is performed, and can issue an interrupt request to the CPU
or DTC in parallel. In this case, the interrupt source should be cleared by the CPU or DTC
transfer.
When DTE = 0, the internal interrupt source selected by the data transfer factor setting issues an
interrupt request to the CPU or DTC regardless of the DTA b it setting.
The state of the DTME bit does not affect the above operations.
Bit 11—Data Transfer Acknowledge 1 (DTA1): Enables or disables clearing, when DMA
transfer is performed, of the internal interrupt source selected by the channel 1 data transfer factor
setting.
Bit 11
DTA1
Description
0 C learin g of select ed inter nal interrupt sour ce at time of DM A transfer is disab led
(Initial value)
1 C learin g of select ed inter nal interrupt sour ce at time of DM A transfer is enable d
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Bit 9—Data Transfer Acknowledge 0 (DTA0): Enables or disables clearing, when DMA
transfer is performed, of the internal interrupt source selected by the channel 0 data transfer factor
setting.
Bit 9
DTA0
Description
0 C learin g of select ed inter nal interrupt sour ce at time of DM A transfer is disab led
(Initial value)
1 C learin g of select ed inter nal interrupt sour ce at time of DM A transfer is enable d
Bits 10 and 8—Reserved: Can be read or written to. Only 0 should be written to these bits .
Bits 7 and 5—Data Transfer Master Enable (DTME): Together with the DTE bit, these bits
control enabling or disabling of data transfer on the relevant channel. When both the DTME bit
and the DTE bit are set to 1, transfer is enabled for the channel.
If the relevant channel is in the middle of a burst mode transfer when an NMI interrupt is
generated, the DTME bit is cleared, the transfer is interrupted, and b us mastership pa sses to the
CPU. When the DTME bit is subsequentl y set to 1 agai n, the interrupted transfer is resume d . In
block transfer mode, however, the DTME bit is not cleared by an NMI interrupt, and transfer is
not interrupted.
The conditions for the DTME bit being cleared to 0 are as follows:
• When initialization is perfor m e d
• When NMI is input in burst mode
• When 0 is written to the DTME bit
The condition for DT ME being set to 1 is as follows:
• When 1 is written to DTME after DTME is read as 0
Bit 7—Data Transfer Master Enable 1 (DTME1): Enables or disables data transfer on channel
1.
Bit 7
DTME1
Description
0 Data transfer disabled. In burst mode, cleared to 0 by an NMI interrupt (Initial value)
1 Data transfer enabled
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Bit 5—Data Transfer Master Enable 0 (DTME0): Enables or disables data transfer on channel
0.
Bit 5
DTME0
Description
0 Data transfer disabled. In normal mode, cleared to 0 by an NMI interrupt (Initial value)
1 Data transfer enabled
Bits 6 and 4—Data Transfer Enable (DTE): When DTE = 0, data transfer is disabled and the
activation source selected by the data transfer factor setting is ignored. If the activation source is
an internal interrupt, an interrupt request is issued to the CPU or DTC. If the DTIE b it is set to 1
when DTE = 0, the DMAC regards this as indicating the end of a transfer, and issues a transfer
end interrupt request to the CPU.
The conditions for the DTE bit being cleared to 0 are as follows:
• When initialization is perfor m e d
• When the specified number of transfers have been completed
• When 0 is written to the DTE bit to forcibly abort the transfer, or for a similar reason
When DTE = 1 and DTME = 1, data transfer is enabled and the DMAC waits for a request by the
activation source selected by the data transfer factor setting. When a request is issued by the
activation source, DMA transfer is executed.
The condition for the DTE b it being set to 1 is as follows:
• When 1 is written to the DTE bit after the DTE b it is read as 0
Bit 6—Data Transfer Enable 1 (DTE1): Enables or disables data transfer on channel 1.
Bit 6
DTE1
Description
0 Data transfer disabled (Initial value)
1 Data transfer enabled
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Bit 4—Data Transfer Enable 0 (DTE0): Enables or disables data transfer on channel 0.
Bit 4
DTE0
Description
0 Data transfer disabled (Initial value)
1 Data transfer enabled
Bits 3 and 1—Data Transfer Interrupt Enable B (DTIEB): These bits enable or disable an
interrupt to the CPU or DTC when transfer is interrupted. If the DTIEB bit is set to 1 when
DTME = 0, the DMAC regards this as indicating a break in the transfer, and issues a transfer
break interrupt request to the CPU or DT C.
A transfer break interrupt can be canceled either by clearing the DTIEB bit to 0 in the interrupt
handling routine, or by performing processing to continue transfer by setting the DTME bit to 1.
Bit 3—Data Transfer Interrupt Enable 1B (DTIE1B): Enables or disables the channel 1
transfer break interrupt.
Bit 3
DTIE1B
Description
0 T r ansfer break int errupt di sabl ed (Initial value)
1 T r ansfer break int errupt ena bl ed
Bit 1—Data Transfer Interrupt Enable 0B (DTIE0B): Enables or disables the channel 0
transfer break interrupt.
Bit 1
DTIE0B
Description
0 T r ansfer break int errupt di sabl ed (Initial value)
1 T r ansfer break int errupt ena bl ed
Bits 2 and 0 —Data Transfer End Interrupt Enable A (DTIEA): T hese bits enable or disable
an interrupt to the CPU or DTC when transfer ends. If the DT IEA bit is set to 1 when DTE = 0,
the DMAC regards this as indicating the end of a transfer, and issues a transfer end interrupt
request to the CPU or DTC.
A transfer end interrupt can be canceled either by clearing the DTIEA bit to 0 in the interrupt
handling routine, or by performing processing to continue transfer by setting the transfer counter
and address register again, and then setting the DTE bit to 1.
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Bit 2—Data Transfer Interrupt Enable 1A (DTIE1A): Enables or disables the channel 1
transfer end interrupt.
Bit 2
DTIE1A
Description
0 Transfer end interrupt disabled (Initial value)
1 Transfer end interrupt enabled
Bit 0—Data Transfer Interrupt Enable 0A (DTIE0A): Enables or disables the channel 0
transfer end interrupt.
Bit 0
DTIE0A
Description
0 Transfer end interrupt disabled (Initial value)
1 Transfer end interrupt enabled
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7.4 Register Descriptions (3)
7.4.1 DMA Write Enable Register (DMAWER)
The DMAC can activate the DTC with a transfer end interrupt, rewrite the channel on which the
transfer ended using a DTC chain transfer, and reactivate the DTC. DMAWER applies restrictions
so that specific bits of DMACR for the specific channel, and also DMATCR and DMABCR, can
be changed to prevent inadvertent rewriting of registers other than those for the channel
concerned. The restrictions applied by DMAWER are valid for the DTC.
Figure 7.2 shows the transfer areas for activating the DTC with a channel 0A transfer end
interrupt, and reactivating channel 0A. The address register and count register area is re-set by the
first DTC transfer, then the control register area is re-set by the second DTC chain transfer.
When re-setting the control register area, perform masking by setting bits in DMAWER to pr event
modification of the contents of the other channels.
DTC
MAR0A
IOAR0A
ETCR0A
MAR0B
IOAR0B
ETCR0B
MAR1A
IOAR1A
ETCR1A
MAR1B
IOAR1B
ETCR1B
DMATCR
DMACR0B
DMACR1B
DMAWER
DMACR0A
DMACR1A
DMABCR
Second transfer area
using chain transfer
First transfer area
Figure 7.2 Areas for Register Re-Setting by DTC (Example: Channel 0A)
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Bit : 7 6 5 4 3 2 1 0
— — — — WE1B WE1A WE0B WE0A
Initial value : 0 0 0 0 0 0 0 0
R/W : — — — — R/W R/W R/W R/W
DMAWER is an 8-bit readable/writable register that controls enabling or disabling of writes to
DMACR, DMABCR, and DMATCR by the DT C.
DMAWER is initialized to H '0 0 by a reset, and in hardware standby mode.
Bits 7 to 4—Reserved: Read-only bits, always read as 0.
Bit 3—Write Enable 1B (WE1B): Enables or disables writes to all bits in DM ACR1B, bits 11, 7,
and 3 in DMABCR, and bit 5 in DMATCR, by the DTC.
Bit 3
WE1B
Description
0 Writes to all bits in DMACR1B, bits 11, 7, and 3 in DMABCR, and bit 5 in DMATCR
are disabled (Initial value)
1 Writes to all bits in DMACR1B, bits 11, 7, and 3 in DMABCR, and bit 5 in DMATCR
are enabled
Bit 2—Write Enable 1A (WE1A): Enables or disab les writes to all bits in DMAC R1A, and bits
10, 6, and 2 in DMABCR, by the DTC.
Bit 2
WE1A
Description
0 Writes to all bits in DMACR1A, and bits 10, 6, and 2 in DMABCR are disabled
(Initial value)
1 Writes to all bits in DMACR1A, and bits 10, 6, and 2 in DMABCR are enabled
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Bit 1—Write Enable 0B (WE0B): Enables or disables writes to all bits in DM ACR0B, bits 9, 5 ,
and 1 in DMABCR, and bit 4 in DMATCR, by the DTC.
Bit 1
WE0B
Description
0 Writes to all bits in DMACR0B, bits 9, 5, and 1 in DMABCR, and bit 4 in DMATCR
are disabled (Initial value)
1 Writes to all bits in DMACR0B, bits 9, 5, and 1 in DMABCR, and bit 4 in DMATCR
are enabled
Bit 0—Write Enable 0A (WE0A): Enables or disab les writes to all bits in DMAC R0A, and bits
8, 4, and 0 in DMABCR, by the DTC.
Bit 0
WE0A
Description
0 Writes to all bits in DMACR0A, and bits 8, 4, and 0 in DMABCR are disabled
(Initial value)
1 Writes to all bits in DMACR0A, and bits 8, 4, and 0 in DMABCR are enabled
Writes by the DTC to bits 15 to 1 2 (FAE and SAE) in DMABCR are invalid regardless of the
DMAWER settings. These bits should be changed, if necessary, by CPU processing.
In writes by the DTC to bits 7 to 4 (DTE) in DMABCR, 1 can be written without first reading 0.
To reactivate a channel set to full address mode, write 1 to both Write Enable A and W r ite Enable
B for the channel to be reactivated.
MAR, IOAR, and ETCR are always write-enabled regardless of the DMAWER settings. When
modifying these registers, the channel for which the modification is to b e made should be halted.
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7.4.2 DM A Terminal Control Register (DMATCR)
Bit : 7 6 5 4 3 2 1 0
— — TEE1 TEE0 — — — —
Initial value : 0 0 0 0 0 0 0 0
R/W : — — R/W R/W — — — —
DMATCR is an 8-bit readable/writable register that controls enabling or disabling of DMAC
transfer end pin output. A port can be set for output automatically, and a transfer end signal
output, by setting the approp r iate bit.
DMATCR is initialized to H'00 b y a reset, and in hardware standby mode.
Bits 7 and 6—Reserved: Read-only bits, always read as 0.
Bit 5—Transf e r End Enable 1 (TEE1): Enables or disables transfer end pin 1 (TEND1) output.
Bit 5
TEE1
Description
0 TEND1 pin output disabled (Initial value)
1 TEND1 pin output enabled
Bit 4—Transf e r End Enable 0 (TEE0): Enables or disables transfer end pin 0 (TEND0) output.
Bit 4
TEE0
Description
0 TEND0 pin output disabled (Initial value)
1 TEND0 pin output enabled
The TEND pins are assigned only to channel B in short address mode.
The transfer end signal indicates the transfer cycle in which the transfer counter reached 0,
regardless of the transfer source. An exception is block transfer mode, in which the transfer end
signal indicates the transfer cycle in which the block counter reached 0.
Bits 3 to 0—Reserved: Read-only bits, always read as 0.
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7.4.3 Module Stop Control Register (MSTPCR)
MSTPCRH MSTPCRL
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
When the MSTP 15 bit in MSTPCR is set to 1, the DM AC operation stops at the end of the bus
cycle and a transition is made to module stop mode. For details, see section 21.5, Module Stop
Mode.
MSTP CR is initialized to H'3FFF by a reset a nd in hardware stand by mode. It is not initialized in
software standby mode.
Bit 15—Module Stop (MSTP15): Specifies the DMAC module stop mode.
Bits 15
MSTP15
Description
0 D MAC module stop mode cleared (Initial value)
1 D MAC module stop mode set
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7.5 Operation
7.5.1 Transfer Modes
Table 7.5 lists the DMAC modes.
Table 7.5 DM AC Transfer Modes
Transfer Mode Transfer Sourc e Remarks
Short
address
mode
Dual
address
mode
(1) Sequential
mode
(2) Idle mode
(3) Repeat mode
• TPU channel 0 to 5
compare match/ inpu t
capture A interrupt
• SCI transmit-data-
empty interrupt
• SCI receive-data-full
interrupt
• A/D converter
conversion end
interrupt
• External request
• Up to 4 channels can
operate independently
• External request
applies to channel B
only
• Single address mode
applies to channel B
only
• Modes (1), (2), and (3)
can also be specified
for single address
mode
(4) Single address mode
Full
address
mode
(5) Normal mode • External request
• Auto-request
• Max. 2-channel
operation, combining
channels A and B
(6) Block transfer mode • TPU channel 0 to 5
compare match/ inpu t
capture A interrupt
• SCI transmit-data-
empty interrupt
• SCI receive-data-full
interrupt
• A/D converter
conversion end
interrupt
• External request
• With auto-request,
burst mode transfer or
cycle steal tra nsf er
can be selected
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Operation in each mode is summarized below.
Sequential Mode: In response to a single transfer request, the specified number of transfers are
carried out, one byte or one word at a time. An interrupt request can be sent to the CPU or DTC
when the specified number of transfers have been completed. One address is specified as 24 bits,
and the other as 16 bits. The transfer direction is programmable.
Idle M ode: In response to a single transfer request, the specified number of transfers are carried
out, one byte or one word at a time. An interrupt request can be sent to the CPU or DTC when the
specified number of transfers have been completed. One address is specified as 24 bits, and the
other as 16 bits. The transfer source address and transfer destination address are fixed. The transfer
direction is programmable.
Repeat Mode: In response to a single transfer request, the specified number of transfers are
carried out, one byte or one word at a time. When the specified number of transfers have been
completed, the addresses and transfer counter are restored to their original settin gs, and operation
is continued. No interrupt request is sent to the CPU or DTC. One address is specified as 24 bits,
and the other as 16 bits. The transfer direction is programmable.
Single Address Mode: In response to a single transfer request, the specified number of transfers
are carried out between external memory and an external device, one byte or one word at a time.
Unlike dual address mode, source and destination accesses are performed in parallel. Therefore,
either the source or the destination is an external device which can be accessed with a strobe alone,
usin g the DACK pin. One address is specified as 24 bits, and for the other, the pin is set
automatically. The transfer direction is programmable.
Sequential mode, idle mode, and repeat mode can also be specified for single address mode.
Normal Mode
• Auto-request
By means of register settings only, the DMAC is activated, and transfer continues until the
specified number of transfers have been completed. An interrupt request can be sent to the
CPU or DTC when transfer is completed. Both addresses are specified as 24 bits.
⎯ Cycle steal mode
The bus is released to another bus master after each byte or word transfer.
⎯ Burst mode
⎯ The bus is held and transfer continued until the specified number of transfers have been
completed.
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• External request
In response to a single transfer request, the specified number of transfers are carried out, one
byte or one word at a time. An interrupt request can be sent to the CPU or DTC when the
specified number of transfers have been completed. Both addresses are specified as 24 bits.
Block Transfer Mode: In response to a single transfer request, a block transfer of the specified
block size is carried out. This is repeated the specified number of times, once each time there is a
transfer request. At the end of each single block transfer, one address is restored to its original
setting. An interrupt request can be sent to the CPU or DTC when the specified number of block
transfers have been completed. Both addresses are specified as 24 bits.
7.5.2 Sequential Mode
Sequential mode can be specified by clearing the RPE bit in DMACR to 0. In sequential mode,
MAR is updated after each byte or word transfer in response to a single transfer request, and this is
executed the number of times specified in ETCR.
One address is specified by MAR, and the other by IOAR. The transfer direction can be specified
by the DTDIR bit in DMACR.
Table 7.6 summarizes register functions in sequential mode.
Table 7.6 Register Functions in Sequential Mode
Function
Register DTDIR = 0 DTDIR = 1 Initial Setting Operation
23 0
MAR
Source
address
register
Destination
address
register
Start address of
transfer destination
or transfer source
Incremented/
decremented ev ery
transfer
23 0
IOAR
15
H'FF
Destination
address
register
Source
address
register
Start address of
transfer source or
transfer destination
Fixed
015 ETCR
Transfer counter Number of transfers Decremented every
transfer; transfer
ends when count
reaches H'0000
Legend:
MAR: Memory address register
IOAR: I/O address register
ETCR: Execute transfer count register
DTDIR: Data transfer direction bit
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MAR specifies the start address of the transfer source or transfer destination as 24 bits. MAR is
incremented or decremented by 1 or 2 each time a byte or word is transferred.
IOAR specifies the lower 16 bits of the other address. The 8 bits above IOAR have a value of
H'FF.
Figure 7.3 illustrates operation in sequential mod e.
A
ddress T
A
ddress B
Transfer IOAR
1 byte or word transfer performed in
response to 1 transfer request
Legend:
Address T = L
Address B = L + (–1)DTID · (2DTSZ · (N–1))
Where : L = Value set in MAR
N = Value set in ETCR
Figure 7.3 Operatio n in Sequent ial Mo de
The number of transfers is specified as 16 bits in ETCR. ETCR is decremented by 1 each time a
transfer is executed, and when its value reaches H'0000, the DTE bit is cleared and transfer ends.
If the DTIE bit is set to 1 at this time, an interrupt request is sent to the CPU or DTC.
The maximum number of transfers, when H'0000 is set in ETCR, is 65,536.
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Transfer requests (activation sources) consist of A/D converter conversion end interrupts, external
requests, SCI transmission data empty/reception data full interrupts, and TPU channel 0 to 5
compare match/input capture A interrupts. External requests can be set for channel B only.
Figure 7.4 shows an example of the setting procedure for sequential mode.
Sequential mode setting
Set DMABCRH
Set transfer source
and transfer destination
addresses
Set number of transfers
Set DMACR
Read DMABCRL
Set DMABCRL
Sequential mode
[1]
[2]
[3]
[4]
[5]
[6]
[1] Set each bit in DMABCRH.
• Clear the FAE bit to 0 to select short address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
[2] Set the transfer source address and transfer
destination address in MAR and IOAR.
[3] Set the number of transfers in ETCR.
[4] Set each bit in DMACR.
• Set the transfer data size with the DTSZ bit.
• Specify whether MAR is to be incremented or
decremented with the DTID bit.
• Clear the RPE bit to 0 to select sequential
mode.
• Specify the transfer direction with the DTDIR
bit.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read the DTE bit in DMABCRL as 0.
[6] Set each bit in DMABCRL.
• Specify enabling or disabling of transfer end
interrupts with the DTIE bit.
• Set the DTE bit to 1 to enable transfer.
Figure 7.4 Example of Sequential Mode Setting Procedure
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7.5.3 Idle Mode
Idle mode can be specified by setting the RPE bit and DTIE bit in DMACR to 1. In idle mode , o ne
byte or word is transferred in response to a single transfer request, and this is executed the number
of times specified in ETCR.
One address is specified by MAR, and the other by IOAR. The transfer direction can be specified
by the DTDIR bit in DMACR.
Table 7.7 summarizes register functions in idle mode.
Table 7.7 Register Functions in Idle Mode
Function
Register DTDIR = 0 DTDIR = 1 Initial Setting Operation
23 0
MAR
Source
address
register
Destination
address
register
Start address of
transfer destination
or transfer source
Fixed
23 0
IOAR
15
H'FF
Destination
address
register
Source
address
register
Start address of
transfer source or
transfer destination
Fixed
015 ETCR
Transfer counter Number of transfers Decremented every
transfer; transfer
ends when count
reaches H'0000
Legend:
MAR: Memory address register
IOAR: I/O address register
ETCR: Execute transfer count register
DTDIR: Data transfer direction bit
MAR specifies the start address of the transfer source or transfer destination as 24 bits. MAR is
neither incremented nor decremented each time a byte or word is transferred.
IOAR specifies the lower 16 bits of the other address. The 8 bits above IOAR have a value of
H'FF.
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Figure 7.5 illustrates operatio n in idle mode.
Transfer IOAR
1 byte or word transfer performed in
response to 1 transfer request
MAR
Figure 7.5 Operation in Idle Mode
The number of transfers is specified as 16 bits in ETCR. ETCR is decremented by 1 each time a
transfer is executed, and when its value reaches H'0000, the DTE bit is cleared and transfer ends.
If the DTIE bit is set to 1 at this time, an interrupt request is sent to the CPU or DTC.
The maximum number of transfers, when H'0000 is set in ETCR, is 65,536.
Transfer requests (activation sources) consist of A/D converter conversion end interrupts, external
requests, SCI transmission data empty and reception data full interrupts, and TPU channel 0 to 5
compare match/input capture A interrupts. External requests can be set for channel B only.
When the DMAC is used in single address mode, only channel B can be set.
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Figure 7.6 shows an example of the setting procedure for idle mode.
Idle mode setting
Set DMABCRH
Set transfer source
and transfer destination
addresses
Set number of transfers
Set DMACR
Read DMABCRL
Set DMABCRL
Idle mode
[1]
[2]
[3]
[4]
[5]
[6]
[1] Set each bit in DMABCRH.
• Clear the FAE bit to 0 to select short address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
[2] Set the transfer source address and transfer
destination address in MAR and IOAR.
[3] Set the number of transfers in ETCR.
[4] Set each bit in DMACR.
• Set the transfer data size with the DTSZ bit.
• Specify whether MAR is to be incremented or
decremented with the DTID bit.
• Set the RPE bit to 1.
• Specify the transfer direction with the DTDIR
bit.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read the DTE bit in DMABCRL as 0.
[6] Set each bit in DMABCRL.
• Set the DTIE bit to 1.
• Set the DTE bit to 1 to enable transfer.
Figure 7.6 Example of Idle Mode Setting Procedure
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7.5.4 Repeat Mode
Repeat mode can be specified by setting the RPE bit in DMACR to 1, and clearing the DTIE bit to
0. In repeat mode, MAR is updated after each byte or word transfer in response to a single transfer
request, and this is executed the number of times specified in ETCR. On completion of the
specified number of transfers, MAR and ETCRL are automatically restored to their original
settings and operation continues.
One address is specified by MAR, and the other by IOAR. The transfer direction can be specified
by the DTDIR bit in DMACR.
Table 7.8 summarizes register functions in repeat mode.
Table 7.8 Register Functions in Repeat Mode
Function
Register DTDIR = 0 DTDIR = 1 Initial Setting Operation
23 0
MAR
Source
address
register
Destination
address
register
Start address of
transfer destination
or transfer source
Incremented/
decremented ev ery
transfer. Initial
setting is restor ed
when value reaches
H'0000
23 0
IOAR
15
H'FF
Destination
address
register
Source
address
register
Start address of
transfer source or
transfer destination
Fixed
0
ETCRH
7
0
ETCRL
7
Holds number of
transfers
Transfer counter
Number of transfers
Number of transfers
Fixed
Decremented every
transfer. Loaded with
ETCRH value when
count reaches H'00
Legend:
MAR: Memory address register
IOAR: I/O address register
ETCR: Execute transfer count register
DTDIR: Data transfer direction bit
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MAR specifies the start address of the transfer source or transfer destination as 24 bits. MAR is
incremented or decremented by 1 or 2 each time a byte or word is transferred.
IOAR specifies the lower 16 bits of the other address. The 8 bits above IOAR have a value of
H'FF.
The number of transfers is specified as 8 bits by ETCRH and ETCRL. The maximum number of
transfers, when H'00 is set in both ETCRH and ETCRL, is 256.
In repeat mode, ETCRL functions as the transfer counter, and ETCRH is used to hold the number
of transfers. ETCRL is decremented by 1 each time a transfer is executed, and when its value
reaches H'00, it is loaded with the value in ETCRH. At the same time, the value set in MAR is
restored in accordance with the values of the DTSZ and DTID bits in DMACR. The MAR
restoration operation is as shown below.
MAR = MAR – (–1)DTID · 2DTSZ · ETCRH
The same value should be set in ETCRH and ETCRL.
In repeat mode, operation continues until the DTE bit is cleared. To end the transfer operation,
therefore, the DTE bit should be cleared to 0. A transfer end interrupt request is not sent to the
CPU or DTC.
By setting the DTE bit to 1 again after it has been cleared, the operation can be restarted from the
transfer after that terminated when the DTE bit was cleared.
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Figure 7.7 illustrates operation in repeat mode.
A
ddress T
A
ddress B
Transfer IOAR
1 byte or word transfer performed in
response to 1 transfer request
Legend:
Address T = L
Address B = L + (–1)
DTID
· (2
DTSZ
· (N–1))
Where : L = Value set in MAR
N = Value set in ETCR
Figure 7.7 Operation in Repeat mode
Transfer requests (activation sources) consist of A/D converter conversion end interrupts, external
requests, SCI transmission data empty and reception data full interrupts, and TPU channel 0 to 5
compare match/input capture A interrupts. External requests can be set for channel B only.
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Figure 7.8 shows an example of the setting procedure for repeat mode.
Repeat mode setting
Set DMABCRH
Set transfer source
and transfer destination
addresses
Set number of transfers
Set DMACR
Read DMABCRL
Set DMABCRL
Repeat mode
[1]
[2]
[3]
[4]
[5]
[6]
[1] Set each bit in DMABCRH.
• Clear the FAE bit to 0 to select short address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
[2] Set the transfer source address and transfer
destination address in MAR and IOAR.
[3] Set the number of transfers in both ETCRH and
ETCRL.
[4] Set each bit in DMACR.
• Set the transfer data size with the DTSZ bit.
• Specify whether MAR is to be incremented or
decremented with the DTID bit.
• Set the RPE bit to 1.
• Specify the transfer direction with the DTDIR
bit.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read the DTE bit in DMABCRL as 0.
[6] Set each bit in DMABCRL.
• Clear the DTIE bit to 0.
• Set the DTE bit to 1 to enable transfer.
Figure 7.8 Example of Repeat Mode Setting Procedure
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7.5.5 Single Address Mode
Single address mode can only be specified for channel B. This mode can be specified b y setting
the SAE bit in DMABCR to 1 in short ad dress mode.
One address is specified by MAR, and the other is set automatically to the data transfer
acknowledge pin (DACK). The transfer direction can be specified by the DTDIR bit in DMACR.
Table 7.9 summarizes register functions in single address mode.
Table 7.9 Register Functions in Single Address Mode
Function
Register DTDIR = 0 DTDIR = 1 Initial Setting Operation
23 0
MAR
Source
address
register
Destination
address
register
Start address of
transfer destination
or transfer source
*
DACK pin Write
strobe Read
strobe (Set automatically
by SAE bit; IOAR is
invalid)
Strobe for external
device
015 ETCR
Transfer counter Number of transfers *
Legend:
MAR: Memory address register
IOAR: I/O address register
ETCR: Execute transfer register
DTDIR: Data transfer direction bit
DACK: Data transfer acknowledge
Note: * See the operation descriptions in sections 7.5.2, Sequential Mode, 7.5.3, Idle Mode, and
7.5.4, Repeat Mode.
MAR specifies the start address of the transfer source or transfer destination as 24 bits.
IOAR is invalid; in its place the strobe for external devices (DACK) is output.
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Figure 7.9 illustrates operation in single addr ess mode (when sequential mode is specified).
A
ddress T
A
ddress B
Transfer DAC
K
1 byte or word transfer performed in
response to 1 transfer request
Legend:
Address T = L
Address B = L + (–1)
DTID
· (2
DTSZ
· (N–1))
Where : L = Value set in MAR
N = Value set in ETCR
Figure 7.9 Operatio n in Single Address Mo de ( When Sequential Mode is Specified)
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Figure 7.10 shows an example of the setting procedure for single address mode (when sequential
mode is specified).
Single address
mode setting
Set DMABCRH
Set transfer source and
transfer destination
addresses
Set number of transfers
Set DMACR
Read DMABCRL
Set DMABCRL
Single address mode
[1]
[2]
[3]
[4]
[5]
[6]
[1] Set each bit in DMABCRH.
• Clear the FAE bit to 0 to select short address
mode.
• Set the SAE bit to 1 to select single address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
[2] Set the transfer source address/transfer
destination address in MAR.
[3] Set the number of transfers in ETCR.
[4] Set each bit in DMACR.
• Set the transfer data size with the DTSZ bit.
• Specify whether MAR is to be incremented or
decremented with the DTID bit.
• Clear the RPE bit to 0 to select sequential
mode.
• Specify the transfer direction with the DTDIR
bit.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read the DTE bit in DMABCRL as 0.
[6] Set each bit in DMABCRL.
• Specify enabling or disabling of transfer end
interrupts with the DTIE bit.
• Set the DTE bit to 1 to enable transfer.
Figure 7.10 Example of Single Address Mode Setting P rocedure
(When Sequential Mode is Specified)
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7.5.6 Normal Mode
In normal mode, transfer is performed with channels A and B used in combination. Normal mode
can be specified by setting the FAE bit in DMABCR to 1 and clearing the BLKE bit in DMACRA
to 0.
In normal mode, MAR is updated after each byte or word transfer in response to a single transfer
request, and this is executed the number of times specified in ETCRA. The transfer source is
specified by MARA, and the transfer destination by MARB.
Table 7.10 summarizes register functions in normal mode.
Table 7.10 Register Functions in Normal Mode
Register Function Initial Setting Operation
23 0
MARA
Source address
register Start address of
transfer source Incremented/decremented
every transfer, or fixed
23 0
MARB
Destination
address register Start address of
transfer destination Incremented/decremented
every transfer, or fixed
015 ETCRA
Transfer counter Number of transfers Decremented every
transfer; transfer ends
when count reaches
H'0000
Legend:
MARA: Memory address register A
MARB: Memory address register B
ETCRA: Execute transfer count register A
MARA and MARB specify the start addresses of the transfer source and transfer destination,
respectively, as 24 bits. MAR can be incremented or decremented by 1 or 2 each time a byte or
word is transferred, or can be fixed.
Incr ementing, decre menting, or hol ding a fixed val ue can be set separa tel y for M ARA and
MARB.
The number of transfers is specified by ETCRA as 16 bits. ETCRA is decremented each time a
transfer is performed, and when its value reaches H'0000 the DTE bit is cleared and transfer ends.
If the DTIE bit is set to 1 at this time, an interrupt request is sent to the CPU or DTC.
The maximum number of transfers, when H'0000 is set in ETCRA, is 65,536.
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Figure 7.11 illustrates op e ration in normal mode.
A
ddress T
A
A
ddress B
A
Transfer Address T
B
Legend:
Address
Address
Address
Address
Where :
Address B
B
= L
A
= L
B
= L
A
+ SAIDE · (–1)
SAID
· (2
DTSZ
· (N–1))
= L
B
+ DAIDE · (–1)
DAID
· (2
DTSZ
· (N–1))
= Value set in MARA
= Value set in MARB
= Value set in ETCRA
T
A
T
B
B
A
B
B
L
A
L
B
N
Figure 7.11 Operation in Normal Mode
Transfer requests (activation sources) are external requests and auto-requests.
With auto-request, the DMAC is o nl y activated by register setting, and the specified number of
transfers are performed automatically. With auto-request, cycle steal mode or burst mode can be
selected. In cycle steal mode, the bus is released to another bus master each time a transfer is
performed. In burst mode, the bus is held continuously until transfer ends.
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For setting details, see section 7.3.4, DMA Control Register (DMACR).
Figure 7.12 shows an example of the setting procedure for normal mode.
Normal mode setting
Set DMABCRH
Set transfer source and
transfer destination
addresses
Set number of transfers
Set DMACR
Read DMABCRL
Set DMABCRL
Normal mode
[1]
[2]
[3]
[4]
[5]
[6]
[1] Set each bit in DMABCRH.
• Set the FAE bit to 1 to select full address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
[2] Set the transfer source address in MARA, and
the transfer destination address in MARB.
[3] Set the number of transfers in ETCRA.
[4] Set each bit in DMACRA and DMACRB.
• Set the transfer data size with the DTSZ bit.
• Specify whether MARA is to be incremented,
decremented, or fixed, with the SAID and
SAIDE bits.
• Clear the BLKE bit to 0 to select normal
mode.
• Specify whether MARB is to be incremented,
decremented, or fixed, with the DAID and
DAIDE bits.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read DTE = 0 and DTME = 0 in DMABCRL.
[6] Set each bit in DMABCRL.
• Specify enabling or disabling of transfer end
interrupts with the DTIE bit.
• Set both the DTME bit and the DTE bit to 1 to
enable transfer.
Figure 7.12 Example of Normal Mode Setting Procedure
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7.5.7 Block Transfer Mode
In block transfer mode, transfer is performed with channels A and B used in combination. Block
transfer mode can be specified by setting the FAE bit in DMABCR and the BLKE bit in
DMACRA to 1.
In block transfer mode, a transfer of the specified block size is carried out in response to a single
transfer request, and this is executed the specified number of times. The transfer source is
specified by MARA, and the transfer destination by MARB. Either the transfer source or the
transfer destination can be selected as a block area (an area composed of a number of bytes or
words).
Table 7.11 summarizes register functions in block transfer mode.
Table 7.11 Register Functions in Block Transfer Mode
Register Function Initial Setting Operation
23 0
MARA
Source address
register Start address of
transfer source Incremented/decremented
every transfer, or fixed
23 0
MARB
Destination
address register Start address of
transfer destination Incremented/decremented
every transfer, or fixed
0
ETCRAH
7
0
ETCRAL
7
Holds block
size
Block size
counter
Block size
Block size
Fixed
Decremented every
transfer; ETCRH value
copied when count reaches
H'00
15 0
ETCRB
Block transfer
counter Number of block
transfers Decremented every block
transfer; transfer ends
when count reaches
H'0000
Legend:
MARA: Memory address register A
MARB: Memory address register B
ETCRA: E xecute transfer count register A
ETCRB: Execute transfer count register B
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MARA and MARB specify the start addresses of the transfer source and transfer destination,
respectively, as 24 bits. MAR can be incremented or decremented by 1 or 2 each time a byte or
word is transferred, or can be fixed.
Incr ementing, decre menting, or hol ding a fixed val ue can be set separa tel y for M ARA and
MARB.
Whether a block is to be designated for MARA or for MARB is specified by the BLKDIR bit in
DMACRA.
To specify the number of transfers, if M is the size of one block (where M = 1 to 256) and N
transfers are to be performed (where N = 1 to 65,536), M is set in both ETCRAH and ETCRAL,
and N in ETCRB.
Figure 7.13 illustrates operation in block tra nsfer mode when MARB is designated as a block area.
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A
ddress T
A
A
ddress B
A
Transfer
Address T
B
Address B
B
1st block
2nd block
Nth block
Block area
Consecutive transfer
of M bytes or words
is performed in
response to one
request
Legend:
Address
Address
Address
Address
Where :
= L
A
= L
B
= L
A
+ SAIDE · (–1)
SAID
· (2
DTSZ
· (M·N–1))
= L
B
+ DAIDE · (–1)
DAID
· (2
DTSZ
· (N–1))
= Value set in MARA
= Value set in MARB
= Value set in ETCRB
= Value set in ETCRAH and ETCRAL
T
A
T
B
B
A
B
B
L
A
L
B
N
M
Figure 7.13 Operation in Block Transfer Mode (BLKDIR = 0)
Figure 7.14 illustrates operation in block trans fer mode when MARA is designated as a block area.
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Address T
B
Address B
B
Transfer
A
ddress T
A
A
ddress B
A
1st block
2nd block
Nth block
Block area
Consecutive transfer
of M bytes or words
is performed in
response to one
request
Legend:
Address
Address
Address
Address
Where :
= L
A
= L
B
= L
A
+ SAIDE · (–1)
SAID
· (2
DTSZ
· (N–1))
= L
B
+ DAIDE · (–1)
DAID
· (2
DTSZ
· (M·N–1))
= Value set in MARA
= Value set in MARB
= Value set in ETCRB
= Value set in ETCRAH and ETCRAL
T
A
T
B
B
A
B
B
L
A
L
B
N
M
Figure 7.14 Operation in Block Transfer Mode (BLKDIR = 1)
ETCRAL is decremented by 1 each time a byte or word transfer is performed. In response to a
single transfer request, burst transfer is performed until the value in ET CRAL reaches H'00.
ETCRAL is then loaded with the value in ETCRAH. At this time, the value in the MAR register
for which a blo ck desi gnation has been given by t he BLKDIR bit in DM ACR A is restored in
accordance with the DTSZ, SAID/DAID, and SAIDE/DAIDE bits in DMACR.
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ETCRB is decremented by 1 after every block transfer, and when the count reaches H'0000 the
DTE bit is cleared and transfer ends. If the DTIE bit is set to 1 at this point, an interrupt request is
sent to the CPU or DTC.
Figure 7.15 shows the operation flow in block transfer mode.
Acquire bus
ETCRAL = ETCRAL – 1
Transfer request?
ETCRAL = H'00
Release bus
BLKDIR = 0
ETCRAL = ETCRAH
ETCRB = ETCRB – 1
ETCRB = H'0000
Start
(DTE = DTME = 1)
Read address specified by MARA
MARA = MARA + SAIDE · (–1)
SAID
· 2
DTSZ
Write to address specified by MARB
MARB = MARB + DAIDE · (–1)
DAID
· 2
DTSZ
MARB = MARB
–
DAIDE · (
–
1)
DAID
· 2
DTSZ
· ETCRAH
MARA = MARA
–
SAIDE · (–1)
SAID
· 2
DTSZ
· ETCRAH
No
Yes
No
Yes
No
Yes
No
Yes
Clear DTE bit to 0
to end transfer
Figure 7.15 Operation Flow in Block Transfer Mode
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Transfer requests (activation sources) consist of A/D converter conversion end interrupts, external
requests, SCI transmission data empty and reception data full interrupts, and TPU channel 0 to 5
compare match/input capture A interrupts.
For details, see section 7.3.4, DMA Control Register (DMACR).
Figure 7.16 shows an example of the setting procedure for block transfer mode.
Block transfer
mode setting
Set DMABCRH
Set transfer source
and transfer destination
addresses
Set number of transfers
Set DMACR
Read DMABCRL
Set DMABCRL
Block transfer mode
[1]
[2]
[3]
[4]
[5]
[6]
[1] Set each bit in DMABCRH.
• Set the FAE bit to 1 to select full address
mode.
• Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
[2] Set the transfer source address in MARA, and
the transfer destination address in MARB.
[3] Set the block size in both ETCRAH and
ETCRAL. Set the number of transfers in
ETCRB.
[4] Set each bit in DMACRA and DMACRB.
• Set the transfer data size with the DTSZ bit.
• Specify whether MARA is to be incremented,
decremented, or fixed, with the SAID and
SAIDE bits.
• Set the BLKE bit to 1 to select block transfer
mode.
• Specify whether the transfer source or the
transfer destination is a block area with the
BLKDIR bit.
• Specify whether MARB is to be incremented,
decremented, or fixed, with the DAID and
DAIDE bits.
• Select the activation source with bits DTF3 to
DTF0.
[5] Read DTE = 0 and DTME = 0 in DMABCRL.
[6] Set each bit in DMABCRL.
• Specify enabling or disabling of transfer end
interrupts to the CPU with the DTIE bit.
• Set both the DTME bit and the DTE bit to 1 to
enable transfer.
Figure 7.16 Example of Block Transfer Mode Setting Procedure
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7.5.8 DMAC Activation Sources
DMAC activation sources consist of internal interrupts, external requests, and auto-requests. The
activation sources that can be specified depend on the transfer mode and the channel, as shown in
table 7.12.
Table 7.12 DMAC Activation Sources
Short Address Mode Full Address Mode
Activation Source
Channels
0A and 1A
Channels
0B and 1B
Normal
Mode
Block
Transfer
Mode
Internal ADI X
Interrupts TXI0 X
RXI0 X
TXI1 X
RXI1 X
TGI0A X
TGI1A X
TGI2A X
TGI3A X
TGI4A X
TGI5A X
External DREQ pin falling edge input X
Requests DREQ pin low-level input X
Auto-request X X
X
Legend:
: Can be specified
X : Cannot be specified
Activatio n by Internal Interrupt: An interrupt request selected as a DMAC activation source
can be sent simultaneously to the CPU and DT C. For details, see section 5, Interrupt Controller.
With activation by an internal interrupt, the DMAC accepts the request independently of the
interrupt controller. Consequently, interrupt controller priority settings are irrelevant.
If the DMAC is activated by a CPU interrupt source or an interrupt source that is not used as a
DTC activation source (DTA = 1), the interrupt source flag is cleared automatically by the DMA
transfer. With ADI, TXI, and RXI interrupts, however, the interrupt source flag is not cleared
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unless the prescribed register is accessed in a DMA transfer. If the same interrupt is used as an
activation source for more than one channel, the interrupt request flag is cleared when the highest-
priority channel is activated first. Transfer requests for other channels are held pending in the
DMAC, and activation is carried out in order of priority.
When DTE = 0, such as after completion of a transfer, a request from the selected activation
source is not sent to the DMAC, regardless o f the DTA bit. In this case, the relevant interrupt
request is sent to the CPU or DT C.
In case of overlap with a CPU interrupt source or DTC activation source (DTA = 0), the interrupt
request flag is not cleared by the DMAC.
Activation by External Request: If an external request (DREQ pin) is specified as an activation
source, the relevant port should b e set to input mode in advance.
Leve l sensing or edge sensing can be used for external requests.
External request operation in normal mode (short address mode or full address mode) is described
below.
When edge sensing is selected, a 1-byte or 1-word transfer is executed each time a high-to-low
transition is detected on the DREQ pin. The next transfer may not be performed if the next edge is
input before transfer is completed.
When level sensing is selected, the DMAC stands b y for a transfer request while the DREQ pin is
held high. Whi l e the DREQ pin is held low, transfers continue in succession, with the bus being
released each time a byte or word is transferred. If the DREQ pin goes high in the middle of a
transfer, the transfer is interrupted and the DMAC stands by for a transfer request.
Activation by Auto- Request: Auto-request activation is performed by register setting only, and
transfer continues to the end.
With auto-request activation, cycle steal mode or burst mode can be selected.
In cycle steal mode, the DMAC releases the bus to another bus master each time a byte or word is
transferred. DMA and CPU cycles usually alternate.
In burst mode, the DMAC keeps possession of the bus until the end of the transfer, and transfer is
performed continuously.
Single Address Mode: T he DMAC can operate in dual address mode in which read cycles and
write cycles are separate cycles, or single address mode in which read and write cycles are
executed in parallel.
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In dual address mode, transfer is performed with the source address and destination address
specified separately.
In single address mode, on the other hand, transfer is performed between external space in which
either the transfer source or the transfer destination is specified by an address, and an external
device for which selection is performed by means of the DACK strobe, without regard to the
address. Figure 7.16 shows the data bus in single address mode.
External
memory
External
device
(Read)
(Write)
RD
HWR, LWR
A
23
to A
0
Chip
D
15
to D
0
(high impedance)
DACK
Address bus
Data bus
Figure 7.17 Data Bus in Single Address Mode
When using the DMAC for single address mode reading, transfer is performed from external
memory to the external device, and the DACK pin functions as a write strobe for the external
device. When using the DMAC for single address mode writing, transfer is performed from the
external device to external memory, and the DACK pin functions as a read strobe for the external
device. Since there is no directional control for the external device, one or other of the above
single directions should be used.
Bus cycles in single address mo de are in accordance with the settings of the bus controller for the
external memory area. On the external device side, DACK is output in synchronization with the
address strobe. For details of bus cycles, see section 7.5.11, DMAC Bus Cycles (Single Address
Mode).
Do not specify internal space for transfer addresses in single address mode.
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7.5.9 Ba sic DMAC Bus Cycles
An example of the basic DMAC bus cycle timing is shown in figure 7.18. In this example, word-
size transfer is performed from 16-bit , 2-state access space to 8-bit, 3-state access space. When
the bus is transferred from the CPU to the DMAC, a source address read and destination address
write are performed. The bus is not released in response to another bus request, etc., between these
read and write operations. As with CPU cycles, DMA cycles conform to the bus controller
settings.
φ
A
ddress bus
DMAC cycle (1-word transfer)
RD
LWR
HWR
Source
address Destination address
CPU cycle CPU cycle
T
1
T
2
T
3
T
1
T
2
T
3
T
1
T
2
Figure 7.18 Example of DMA Transfer Bus Timing
The address is not output to the external address bus in an access to on-chip memory or an internal
I/O register.
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7.5.10 DMAC B us Cy cles (Dual Address Mode)
Short Address Mode: Figure 7.19 shows a transfer example in which TEND output is enabled
and byte-size short address mode transfer (sequential/idle/repeat mode) is performed from external
8-bit, 2-state access space to internal I/O space.
DMA
read
φ
A
ddress bus
RD
LWR
TEND
HWR
Bus release Last transfer
cycle
DMA
write DMA
dead
DMA
read DMA
write
DMA
read DMA
write
Bus release Bus release Bus
release
Figure 7.19 Example of Short Address Mode Transfer
A one-byte or one-word transfer is performed for one transfer request, and after the transfer the
bus is released. While the bus is released one or more bus cycles are executed by the CPU or DTC.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead
cycle is inserted after the DMA write cycle.
In repeat mode, when TEND output is enabled, TEND output goes low in the transfer cycle in
which the transfer counter reaches 0.
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Full Address Mode (Cy cle Steal Mode): Figure 7.20 shows a transfer example in which TEND
output is enabled and word-size full address mode transfer (cycle steal mode) is performed from
external 16-bit, 2-state access space to external 16-bit, 2-state access space.
DMA
read
φ
A
ddress bus
RD
LWR
TEND
HWR
Bus release Last transfer
cycle
DMA
write DMA
read DMA
write DMA
read DMA
write DMA
dead
Bus release Bus release Bus
release
Figure 7.20 Example of Full Address Mode (Cycle Steal) Transfer
A one-byte or one-word transfer is performed, and after the transfer the bus is released. While the
bus is released one bus cycle is executed by the CPU or DTC.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead
cycle is inserted after the DMA write cycle.
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Full Address Mode (Burst Mode): Figure 7.21 shows a transfer example in which TEND output
is enabled and word-size full address mode transfer (burst mode) is performed from external 16-
bit, 2-state access space to external 16-bit, 2-state access space.
DMA
read
φ
A
ddress bus
RD
LWR
TEND
HWR
Bus release
DMA
write DMA
dead
DMA
read DMA
write DMA
read DMA
write
Bus release
Burst transfer Last transfer cycle
Figure 7.21 Example of Full Address Mode (Burst Mode) Transfer
In burst mode, one-byte or one-word transfers are executed consecutively until transfer end s.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead
cycle is inserted after the DMA write cycle.
If a request from another higher-priority channel is generated after burst transfer starts, that
channel has to wait until the burst transfer ends.
If an NMI is generated while a channel designated for burst transfer is in the transfer enabled state,
the DTME bit is cleared and the channel is placed in the transfer disabled state. If burst transfer
has already been activated inside the DMAC, the bus is released on completion of a one-byte or
one-word transfer within the burst transfer, and burst transfer is suspended. If the last transfer
cycle of the burst transfer has already been activated inside the DMAC, execution continues to the
end of the transfer even if the DTME bit is cleared.
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Full Address Mode (B lock Transfer Mode): Figure 7.22 shows a transfer example in which
TEND output is enabled and word-size full address mode transfer (block transfer mode) is
performed from internal 16-bit, 1-state access space to external 16-bit, 2-state access space.
DMA
read
φ
A
ddress bus
RD
LWR
TEND
HWR
Bus release Block transfer Last block transfer
DMA
write DMA
read DMA
write DMA
dead DMA
read DMA
write DMA
read DMA
write DMA
dead
Bus
release
Bus release
Figure 7.22 Example of Full Address Mode (Block Transfer Mode) Transfer
A one-block transfer is performed for one transfer request, and after the transfer the bus is
released. While the bus is released, one or more bus cycles are executed by the CPU or DTC.
In the transfer end cycle of each block (the cycle in which the transfer counter reaches 0), a one-
state DMA dead cycle is inserted after the DMA write cycle.
One block is transmitted without interruption. NMI generation does not affect block transfer
operation.
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DREQ Pin Falling Edge Activ ation Timing: Set the DTA bit for the channel for which the
DREQ pin is selected to 1.
Figure 7.23 shows an example of DREQ pin falling edge activated normal mode transfer.
DMA
read
φ
Address
bus
DREQ
Idle Write Idle
Bus release
DMA
control
Channel
Write Idle
Transfer source
Request
[1] [3][2] [4] [6][5] [7]
Acceptance resumes
Acceptance resumes
DMA
write Bus
release DMA
read DMA
write Bus
release
Request
Transfer destination
Transfer source
Transfer destination
Read Read
Request clear periodRequest clear period
Minimum
of 2 cycles Minimum
of 2 cycles
[1] Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of φ,
and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] Start of DMA cycle; DREQ pin high level sampling on the rising edge of φ starts.
[4] [7] When the DREQ pin high level has been sampled, acceptance is resumed after the write cycle
is completed.
(As in [1], the DREQ pin low level is sampled on the rising edge of φ, and the request is held.)
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7.23 Example of DREQ Pin Falling Edge Activated Nor mal Mo de Tra nsfer
DREQ pin sampling is performed every cycle, with the rising edge of the next φ cycle after the
end of the DMABCR write cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is
possible, the request is held in the DMAC. Then, when activation is initiated i n the DMAC, the
request is cleared, and DREQ pin high level sampling for edge detection is started . If DREQ pin
high level sampling has been completed by the time the DMA write cycle ends, acceptance
resumes after the end of the write cycle, DREQ pin low level sampling is performed again, and
this operation is repeated until the transfer ends.
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Figure 7.24 shows an example of DREQ pin falling edge activated block transfer mode transfer.
DMA
read
φ
A
ddress
bus
DREQ
Idle Write
Bus release
DMA
control
Channel
Write
Transfer source
Request
[1] [3][2] [4] [6][5] [7]
Acceptance resumes
DMA
dead
1 block transfer
IdleDead Dead
DMA
write
Bus
release
DMA
read DMA
write DMA
dead Bus
release
Transfer source
Request
Acceptance resumes
1 block transfer
Transfer destinationTransfer destination
ReadIdleRead
Minimum
of 2 cycles Minimum
of 2 cycles
Request clear periodRequest clear period
[1] Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of φ,
and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] Start of DMA cycle; DREQ pin high level sampling on the rising edge of φ starts.
[4] [7] When the DREQ pin high level has been sampled, acceptance is resumed after the dead cycle
is completed.
(As in [1], the DREQ pin low level is sampled on the rising edge of φ, and the request is held.)
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7.24 Example of DREQ Pin Falling Edge Activa ted Blo ck Transfer Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next φ cycle after the
end of the DMABCR write cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is
possible, the request is held in the DMAC. Then, when activation is initiated i n the DMAC, the
request is cleared, and DREQ pin high level sampling for edge detection is started . If DREQ pin
high level sampling has been completed by the time the DMA dead cycle ends, acceptance
resumes after the end of the dead cycle, DREQ pin low level sampling is performed again, and this
operation is repeated until the transfer ends.
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DREQ Level Activation Timing (Normal Mode): Set the DTA bit for the channel for which the
DREQ pin is selected to 1.
Figure 7.25 shows an example of DREQ level activated normal mode transfer.
DMA
read DMA
write
φ
Address
bus
DREQ
Idle Write Idle
Bus
release
DMA
control
Channel
Write Idle
Transfer source
Bus
release DMA
read DMA
write Bus
release
Request
[1] [3][2] [4] [6][5] [7]
Acceptance resumes
Acceptance resumes
Transfer destination Transfer source Transfer destination
Request
Request clear periodRequest clear period
Read Read
Minimum
of 2 cycles Minimum
of 2 cycles
[1] Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of φ,
and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] The DMA cycle is started.
[4] [7] Acceptance is resumed after the write cycle is completed.
(As in [1], the DREQ pin low level is sampled on the rising edge of φ, and the request is held.)
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7.25 Example of DREQ Level Activated Normal Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next φ cycle after the
end of the DMABCR write cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is
possible, the request is held in the DMAC. Then, when activation is initiated i n the DMAC, the
request is cleared. After the end of the write cycle, acceptance resumes, DREQ pin low level
sampling is performed again, and this op eration is repeated until the transfer ends.
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Figure 7.26 shows an example of DREQ level activated block transfer mode transfer.
DMA
read DMA
write
φ
Address
bus
DREQ
Idle Write
Bus release
DMA
control
Channel
Write
Transfer source
Request
[1] [3][2] [4] [6][5] [7]
Acceptance resumes
DMA
dead
Bus
release
DMA
read DMA
write DMA
dead Bus
release
1 block transfer
IdleDead Dead
1 block transfer
Acceptance resumes
Request
Minimum
of 2 cycles Minimum
of 2 cycles
Transfer source
Read
Request clear period
Read
Request clear period
Transfer destination
Transfer destination
Idle
[1] Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of φ,
and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] The DMA cycle is started.
[4] [7] Acceptance is resumed after the dead cycle is completed.
(As in [1], the DREQ pin low level is sampled on the rising edge of φ, and the request is held.)
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7.26 Example of DREQ Level Activated Block Transfer Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next φ cycle after the
end of the DMABCR write cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is
possible, the request is held in the DMAC. Then, when activation is initiated i n the DMAC, the
request is cleared. After the end of the dead cycle, acceptance resumes, DREQ pin low level
sampling is performed again, and this op eration is repeated until the transfer ends.
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7.5.11 DM AC Bus Cycles (Single Address Mode)
Single Address Mode (Read): Figure 7.27 shows a transfer example in which TEND output is
enabled and byte-size single address mode transfer (read) is performed from external 8-bit, 2-state
access space to an external device.
DMA read
φ
A
ddress bus
DMA
dead
RD
DACK
TEND
Bus
release
DMA read DMA read DMA read
Bus
release Bus
release Bus
release Bus
release
Last transfer
cycle
Figure 7.27 Example of Single Address Mode (Byte Read) Transfer
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Figure 7.28 shows a transfer example in which TEND output is enabled and word-size single
address mode transfer (read) is performed from external 8-bit, 2-state access space to an external
device.
DMA read
φ
A
ddress bus
DMA read DMA read DMA
dead
RD
TEND
DACK
Bus
release Bus
release Bus
release Bus
release
Last transfer
cycle
Figure 7.28 Example of Single Address Mode (Word Read) Transfer
A one-byte or one-word transfer is performed for one transfer request, and after the transfer the
bus is released. While the bus is released, one or more bus cycles are executed by the CPU or
DTC.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead
cycle is inserted after the DMA write cycle.
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Single Address Mode (Writ e ): Figure 7.29 shows a transfer example in which TEND output is
enabled and byte-size single address mode transfer (write) is performed from an external device to
external 8-bit, 2-state access space.
DMA write
φ
A
ddress bus
DMA
dead
HWR
DACK
TEND
Bus
release
LWR
DMA write DMA write DMA write
Bus
release Bus
release Bus
release Bus
release
Last transfer
cycle
Figure 7.29 Example of Single Address Mode (Byte Write) Transfer
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Figure 7.30 shows a transfer example in which TEND output is enabled and word-size single
address mode transfer (write) is performed from an external device to external 8-bit, 2-state access
space.
DMA write
φ
A
ddress bus
DMA write DMA write DMA
dead
HWR
TEND
DACK
Bus
release
LWR
Bus
release Bus
release Bus
release
Last transfer
cycle
Figure 7.30 Example of Single Address Mode (Word Write) Transfer
A one-byte or one-word transfer is performed for one transfer request, and after the transfer the
bus is released. While the bus is released one or more bus cycles are executed by the CPU or DTC.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead
cycle is inserted after the DMA write cycle.
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DREQ Pin Falling Edge Activ ation Timing: Set the DTA bit for the channel for which the
DREQ pin is selected to 1.
Figure 7.31 shows an example of DREQ pin falling edge activated single address mode transfer.
φ
DREQ
Bus release DMA single DMA single
A
ddress bus
DMA control
Channel
[2]
DACK
Transfer source/
destination
Idle Idle Idle
[1] [3] [5][4] [6] [7]
Acceptance resumesAcceptance resumes
Bus release Bus release
Transfer source/
destination
Request Request Request clear
period
Request clear
period
Minimum of
2 cycles Minimum of
2 cycles
SingleSingle
[1] Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of φ,
and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] Start of DMA cycle; DREQ pin high level sampling on the rising edge of φ starts.
[4] [7] When the DREQ pin high level has been sampled, acceptance is resumed after the single
cycle is completed. (As in [1], the DREQ pin low level is sampled on the rising edge of φ, and
the request is held.)
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7.31 Example of DREQ Pin Falling Edge Activ ated Single Address Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next φ cycle after the
end of the DMABCR write cycle for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is
possible, the request is held in the DMAC. Then, when activation is initiated i n the DMAC, the
request is cleared, and DREQ pin high level sampling for edge detection is started . If DREQ pin
high level sampling has been completed by the time the DMA single cycle ends, acceptance
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resumes after the end of the single cycle, DREQ pin low level sampling is performed again, and
this operation is repeated until the transfer ends.
DREQ Pin Low Level Activatio n Timing: Set the DTA bit for the channel for which the DREQ
pin is selected to 1.
Figure 7.32 shows an example of DREQ pin low level activated single address mode transfer.
φ
DREQ
Bus release DMA single
A
ddress bus
DMA control
Channel
[2]
DACK
Transfer source/
destination
Idle Idle Idle
[1] [3] [5][4] [6] [7]
Acceptance resumesAcceptance resumes
Bus release DMA single Bus
release
Transfer source/
destination
Request Request Request clear
period
Request clear
period
Single Single
Minimum of
2 cycles
Minimum of
2 cycles
[1] Acceptance after transfer enabling; the DREQ pin low level is sampled on the rising edge of φ,
and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] The DMAC cycle is started.
[4] [7] Acceptance is resumed after the single cycle is completed.
(As in [1], the DREQ pin low level is sampled on the rising edge of φ, and the request is held.)
Note: In write data buffer mode, bus breaks from [2] to [7] may be hidden, and not visible.
Figure 7.32 Example of DREQ Pin Low Level Activate d Single Address Mode Transfer
DREQ pin sampling is performed every cycle, with the rising edge of the next φ cycle after the
end of the DMABCR write cycle for setting the transfer enabled state as the starting point.
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When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is
possible, the request is held in the DMAC. Then, when activation is initiated i n the DMAC, the
request is cleared. After the end of the single cycle, acceptance resumes, DREQ pin low level
sampling is performed again, and this op eration is repeated until the transfer ends.
7.5.12 Write Data Buffer Function
DMAC internal-to-external dual address transfers and single address transfers can be executed at
high speed using the write data buffer function, enabling system throughput to be improved.
When the WDBE bit of BCRL in the bus controller is set to 1, enabling the write data buffer
function, dual address transfer external write cycles or single address transfers and internal
accesses (on-chip memory or internal I/O registers) are executed in parallel. Internal accesses are
independent of the bus master, and DMAC dead cycles are regarded as internal accesses.
A low level can always be output from the TEND pin if the bus cycle in whic h a low level is to be
output is an external bus cycle. However, a low level is not output fro m the TEND pin if the bus
cycle in which a low level is to be output from the TEND pin is an internal bus cycle, and an
external write cycle is executed in parallel with this cycle.
Figure 7.33 shows an example of burst mode transfer from on-chip RAM to external memory
using the write data buffer function.
φ
Internal address
Internal read signal
HWR, LWR
TEND
External address
DMA
read DMA
write DMA
read DMA
write DMA
read DMA
write DMA
read DMA
write DMA
dead
Figure 7.33 Example of Dual Address Transfer Using Write Data Buffer Function
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Figure 7.34 shows an example of single address transfer using the write data buffer function. In
this example, the CPU program area is in on-chip me mory.
φ
Internal address
Internal read signal
RD
DACK
External address
DMA
read DMA
single CPU
read DMA
single CPU
read
Figure 7.34 Example of Single Address Transfer Using Write Data Buffer Function
When the write data buffer function is activated, the DMAC recognizes that the bus cycle
concerned has ended, and starts the next operation. Therefore, DREQ pin sampling is started one
state after the start of the DMA write cycle or single address transfer.
7.5.13 DMAC Multi-Channel Operation
The DMAC channel priority order is: channel 0 > channel 1, and channel A > channel B. Table
7.13 summarizes the priority order for DMAC channels.
Table 7.13 DMAC Channel Priority Order
Short Address Mode Full Address Mode Priority
Channel 0A Channel 0 High
Channel 0B
Channel 1A Channel 1
Channel 1B Low
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If transfer requests are issued simultaneously for more than one channel, or if a transfer request for
another channel is issued during a transfer, when the bus is released the DMAC selects the
highest-priority channel from among those issuing a request according to the priority order shown
in table 7.13.
During burst transfer, or when one block is being transferred in block transfer, the channel will not
be changed until the end of the transfer.
Figure 7.35 shows a transfer example in which transfer requests are issued simultaneously for
channels 0A, 0B, and 1.
DMA read DMA write DMA read DMA write DMA read DMA write DMA
read
φ
A
ddress bus
RD
HWR
LWR
DMA control
Channel 0A
Channel 0B
Channel 1
Idle Write Idle Read Write Idle Read Write Read
Request
hold
Request
hold
Bus
release Channel 0A
transfer Bus
release Channel 0B
transfer Channel 1 transfer
Bus
release
Request
hold
Read
Selection
Non-
selection Selection
Request clear
Request clear
Request clear
Figure 7.35 Example of Multi-Channel Transfer
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7.5.14 Relation Between the DMAC and External Bus Requests, Refresh Cycles, and the
DTC
There can be no break between a DMA cycle read and a DMA cycle write. This means that a
refresh cycle, external bus release cycle, or DTC cycle is not generated between the external read
and external write in a DMA cycle.
In the case of successive read and write cycles, such as in burst transfer or block transfer, a refresh
or external bus released state may be inserted after a write cycle. Since the DTC has a lower
priority than the DMAC, the DTC does not operate until the DMAC releases the bu s.
When DMA cycle reads or writes are accesses to on-chip memory or internal I/O registers, these
DMA cycles can be executed at the same time as refresh cycles or external bus release. However,
simultaneous operation may not be possible when a write buffer is used.
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7.5.15 NMI Interrupts and DMAC
When an NMI interrupt is requested, burst mode transfer in full address mode is interrupted. An
NMI interrupt does not affect the operation of the DMAC in other modes.
In full address mode, transfer is enabled for a channel when both the DTE b it and the DTME bit
are set to 1. With burst mode setting, the DTME b it is cleared when an NMI interrupt is requested.
If the DTME bit is cleared during burst mode transfer, the DMAC discontinues transfer on
completion of the 1-byte or 1-word transfer in progress, then releases the bus, which passes to the
CPU.
The channel on which transfer was interrupted can be restarted by setting the DTME bit to 1 again.
Figure 7.36 shows the procedure for continuing transfer when it has been interrupted by an NMI
interrupt on a channel designated for burst mode transfer.
Resumption of
transfer on interrupted
channel
Set DTME bit to 1
Transfer continues
[1]
[2]
DTE = 1
DTME = 0
Transfer ends
No
Yes
[1]
[2]
Check that DTE = 1 and
DTME = 0 in DMABCRL.
Write 1 to the DTME bit.
Figure 7.36 Example of Procedure for Continuing Transfer on Channel Interrupt ed by
NMI Int errupt
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7.5.16 Forced Termination of DMAC Operation
If the DTE bit for the channel currently operating is cleared to 0, the DMAC stops on completion
of the 1-byte or 1-word transfer in progress. DMAC operation resumes when the DTE bit is set to
1 again.
In full address mode, the same app lies to the DTME bit.
Figure 7.37 shows the procedure for forcibly terminating DMAC operation by software.
Forced termination
of DMAC
Clear DTE bit to 0
Forced termination
[1]
[1] Clear the DTE bit in DMABCRL to 0.
To prevent interrupt generation after forced
termination of DMAC operation, clear the DTIE bit
to 0 at the same time.
Figure 7.37 Example of Procedure for Forcibly Terminating DMAC Operation
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7.5.17 Clearing Full Address Mode
Figure 7.38 shows the procedure for releasing and initializing a channel desig nated for full ad dress
mode. After full address mode has been cleared, the channel can be set to another transfer mode
using the appropriate setting pro cedure.
Clearing full
address mode
Stop the channel
Initialize DMACR
Clear FAE bit to 0
Initialization;
operation halted
[1]
[2]
[3]
[1] Clear both the DTE bit and the DTME bit in
DMABCRL to 0; or wait until the transfer ends
and the DTE bit is cleared to 0, then clear the
DTME bit to 0.
Also clear the corresponding DTIE bit to 0 at the
same time.
[2] Clear all bits in DMACRA and DMACRB to 0.
[3] Clear the FAE bit in DMABCRH to 0.
Figure 7.38 Example of Procedure for Clearing Full Address Mode
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7.6 Interrupts
The sources of interrupts generated by the DMAC are transfer end and transfer break. Table 7.14
shows the interrupt sources and their priority order.
Table 7.14 Interrupt Source Priority Order
Interrupt Source Interrupt
Interrupt
Name Short Address Mode Full Address Mode Priority Order
DEND0A Interrupt due to end of
transfer on channel 0A Interrupt due to end of
transfer on channel 0 High
DEND0B Interrupt due to end of
transfer on channel 0B Interrupt due to break in
transfer on channel 0
DEND1A Interrupt due to end of
transfer on channel 1A Interrupt due to end of
transfer on channel 1
DEND1B Interrupt due to end of
transfer on channel 1B Interrupt due to break in
transfer on channel 1
Low
Enabling or disabling of each interrupt source is set by means of the DTIE bit for the
corresponding channel in DMABCR, and interrupts from each source are sent to the interrupt
controller independently.
The relative priority of transfer end interrupts on each channel is decid e d by the interrupt
controller, as shown in table 7.14.
Figure 7.39 shows a block diagram of a transfer end/transfer break interrupt. An interrupt is
always generated when the DTIE bit is set to 1 while the DTE bit is cleared to 0.
DTE/
DTME
DTIE
Transfer end/transfe
r
break interrupt
Figure 7.39 Block Diagram of Transfer End/Transfer Break Interrupt
In full address mode, a transfer break interrupt is generated when the DTME bit is cleared to 0
while the DTIEB bit is set to 1.
In both short address mode and full address mode, DMABCR should be set so as to prevent the
occurrence of a combination that constitutes a condition for interrupt generation during setting.
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7.7 Usage Notes
DMAC Register Access during Operation: Except for forced termination, the operating
(including transfer waiting state) channel setting should not b e changed. T he op erating channel
setting should only be changed when transfer is disabled.
Also, MAC registers should not be written to in a DMA transfer.
DMAC register reads during operation (including the transfer waiting state) are described below.
(a) DMAC control starts one cycle before the bus cycle, with output of the internal address.
Consequently, MAR is updated in the bus cycle before DMAC transfer.
Figure 7.40 shows an example of the update timing for DMAC registers in dual address
transfer mode.
[1] Transfer source address register MAR operation (incremented/decremented/fixed)
Transfer counter ETCR operation (decremented)
Block size counter ETCR operation (decremented in block transfer mode)
[2] Transfer destination address register MAR operation (incremented/decremented/fixed)
[2'] Transfer destination address register MAR operation (incremented/decremented/fixed)
Block transfer counter ETCR operation (decremented, in last transfer cycle of a block
in block transfer mode)
[3] Transfer address register MAR restore operation (in block or repeat transfer mode)
Transfer counter ETCR restore (in repeat transfer mode)
Block size counter ETCR restore (in block transfer mode)
Notes: 1. In single address transfer mode, the update timing is the same as [1].
2. The MAR operation is post-incrementing/decrementing of the DMA internal address value.
[3]
[2] [1]
[1]
DMA transfer cycle
DMA read DMA read
DMA write DMA write DMA
dead
DMA Internal
address
DMA control
DMA register
operation
DMA last transfer cycle
Transfer
destination Transfer
destination
Transfer
source
Transfer
source
Idle Idle IdleRead Read Dead
Write Write
φ
[2']
Figure 7.40 DMAC Register Update Timing
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(b) If a DMAC transfer cycle occurs immediately after a DMAC register read cycle, the DMAC
register is read as shown in figure 7.41.
[2]
[1]
Note: The lower word of MAR is the updated value after the operation in [1].
CPU longword read DMA transfer cycle
MAR upper
word read MAR lower
word read DMA read DMA write
DMA internal
address
DMA control
DMA register
operation
Transfe
source Transfer
destination
Idle
φ
Read Write Idle
Figure 7.41 Contention between DMAC Register Update and CPU Read
Module Sto p: When the MSTP1 5 bit in MSTPCR is set to 1 , the DMAC clock stops, and the
module stop state is entered. Ho wever, 1 cannot be written to the MSTP15 bit if any of the DMAC
channels is enabled. This setting should therefore be made when DMAC operation is stopped.
When the DMAC clock stops, DMAC register accesses can no longer be made. Since the
following DMAC register sett ings are valid even i n the mod ule stop state, they should be
invalidated, if necessary, before a module stop.
• Transfer end/break interrupt (DTE = 0 and DTIE = 1)
• TEND pin enable (TEE = 1)
• DACK pin enable (FAE = 0 and SAE = 1)
Medium-Speed Mode: When the DTA bit is 0, internal inte rrupt signals specified as DMAC
transfer sources are edge-detected.
In medium-speed mode, the DMAC operates on a medium-speed clock, while on-chip supporting
modul es operate on a high-speed clock. Consequently, if the peri od in which the releva nt interrupt
source is cleared by the CPU, DTC, or another DMAC channel, and the next interrupt is
generated, is less than one state with respect to the DMAC clock (bus master clock), edge
detection may not be possible and the interrupt may be ignored.
Also, in medium-speed mode, DREQ pin sampling is performed on the rising edge of the medium-
speed clock.
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Write Data Buffer Function: When the WDBE bit of BCRL in the bus controller is set to 1,
enabling the write data buffer function, dual address transfer external write cycles or single
address transfers and internal accesses (on-chip memory or internal I/O registers) are executed in
parallel.
• Write Data Buffer Function an d DMAC Register Settin g
If the setting of a register that controls external accesses is changed during execution of an
external access by means of the write data buffer function, the external access may not be
performed normally. Registers that control external accesses should only be manipulated when
external reads, etc., are used with DMAC operation disabled, and the operation is not
performed in parallel with external access.
• Write Data Buffer Function and DMAC Op eratio n Timing
The DMAC can start its next operation during external access using the write data buffer
functio n. Con s equently, the DREQ pin sa mpling timing, TEND output timing, etc., are
different from the case in which the write data buffer function is disabled . Also , internal bus
cycles maybe hidden, and not visible.
• Write Data Buffer Function and TEND Output
A low level is not output at t he TEND pin if the bus cycle in which a low level is to be outp ut
at the TEND pin is an internal bus cycle, and an external write cycle is executed in parallel
with this cycle. Note, for example, that a low level may not be output at the TEND pin if the
write data buffer function is used when data transfer is performed between an internal I/O
register and on-chip memory.
If at least one of the DMAC transfer addresses is an external address, a low level is output at
the TEND pin.
Figure 7.42 shows an example in which a low level is not output at the TEND pin.
Section 7 DMA Controller (Not Supported in the H8S/2321)
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φ
Internal address
Internal read signal
External address
HWR, LWR
Internal write signal
TEND
Not output
DMA
read
External write by CPU, etc.
DMA
write
Figure 7.42 Example in Which Low Level is Not Output at TEND Pin
Activation by Falling Edge on DREQ Pin: DREQ pin falling edge detection is performed in
synchronization with DMAC internal operations. The operation is as follows:
[1] Activation request wait state: Wa its for de tectio n of a low level on the DREQ pin, and
switches to [2].
[2] T r ansfer wait state: Waits for DMAC data transfer to become possible, and switches to [3].
[3] Activation request disabled state: W aits for d etection of a high level on the DREQ pin, and
switches to [1].
After DMAC transfer is enable d , a transition is made to [1]. Thus, initial activation after transfer is
enabled is performed on detection of a low level.
Activation Source Acceptance: At the start of activation source acceptance, a low level is
detected in both DREQ pin falling edge se nsin g and low level sensing. Similarly, in the case of an
internal interrupt, the interrupt request is detected. Therefore, a request is accepted from an
internal interrupt or DREQ pin low level that occurs before execution of the DMABCRL write to
enable transfer.
When the DMAC is activated, take any necessary steps to prevent an internal interrupt or DREQ
pin low level remaining from the end of the previous transfer, etc.
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Internal Interrupt after End of Transfer: When the DTE bit is cleared to 0 at the end of a
transfer or by a forcible termination, the selected internal interrupt request will be sent to the CPU
or DTC even if DTA is set to 1.
Also, if internal DMAC activation has already been initiated when operation is forcibl y
terminated, the transfer is executed but flag clearing is not performed for the selected internal
interrupt even if DTA is set to 1.
An internal interrupt request following the end of transfer or a forcible termination should be
handled by the CPU as necessary.
Channel Re-Setting: To reactivate a number of channels when multiple channels are enabled, use
exclusive handling of transfer end interrupts, and perform DMABCR control bit operations
exclusively.
Note, in particular, that in cases where multiple interrupts are generated between reading and
writing of DMABCR, and a DMABCR operation is performed during new interrupt handling, the
DMABCR write data i n the original interrupt handling routine will be incorrect, and the write may
invalidate the results of the operations b y the multiple interr upts. En sure t hat overlapp in g
DMABCR operations are not p erformed b y multiple interrupts, and that there is no separation
between read and write operations by the use of a bit-manipulation instruction.
Also, when the DTE and DTME bits are cleared by the DMAC or are written with 0, they must
first be read while cleared to 0 before the CPU can write a 1 to them.
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Section 8 Data Transfer Controller
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Section 8 Data Transfer Controller
8.1 Overview
The chip includes a data transfer controller (DTC). The DTC can be activated for data transfer by
an interrupt or software.
8.1.1 Features
The features of the DTC are:
• Transfer possible over any number of channels
⎯ Transfer information is stor ed in memory
⎯ One activation source can trigger a number of data transfers (chain transfer)
⎯ Chain transfer execution can be set after data transfer (when counter = 0)
• Selection of transfer modes
⎯ Normal, repeat, and block transfer modes available
⎯ Incrementing, decrementing, and fixing of source and destination addresses can be selected
• Direct specification of 16-Mbyte address space possible
⎯ 24-bit transfer source and destination addresses can be specified
• Transfer can be set in byte or word units
• A CPU interrupt can be requested for the interrupt that activated the DTC
⎯ An interrupt request can be issued to the CPU after one data transfer ends
⎯ An interrupt request can be issued to the CPU after all the specified data transfers have
ended
• Activation b y soft ware is possible
• Module stop mode can be set
⎯ The initial setting enables DTC registers to be accessed. DTC op e ration is halted by settin g
module stop mode
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8.1.2 Block Diagram
Figure 8.1 shows a block diagram of the DTC.
The DTC’s register information is stored in the on-chip RAM*. A 32-bit bus connects the DTC to
the on-chip RAM (1 kbyte), enabling 32-bit, 1-state reading and writing of DTC register
information.
Note: * When the DTC is used, the RAME bit in SYSCR must be set to 1 .
Interrupt
request
Interrupt controller DTC
Internal address bus
DTC activation
request
Control logic
Register information
MRA MRB
CRA
CRB
DAR
SAR
CPU interrupt
request
On-chip
RAM
Internal data bus
Legend:
MRA, MRB
CRA, CRB
SAR
DAR
DTCERA to DTCERF
DTVECR
DTCERA
to
DTCERF
DTVECR
: DTC mode registers A and B
: DTC transfer count registers A and B
: DTC source address register
: DTC destination address register
: DTC enable registers A to F
: DTC vector register
Figure 8.1 Block Diagram of DTC
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8.1.3 Register Configuration
Table 8.1 summarizes the DTC registers.
Table 8.1 DTC Registers
Name Abbreviation R/W Initial Value Address*1
DTC mode register A MRA —*2 Undefined —*3
DTC mode register B MRB —*2 Undefined —*3
DTC source address register SAR —*2 Undefined —*3
DTC destination address register DAR —*2 Undefined —*3
DTC transfer count register A CRA —*2 Undefined —*3
DTC transfer count register B CRB —*2 Undefined —*3
DTC enable registers DTCER R/W H'00 H'FF30 to H'FF35
DTC vector reg ister DTVECR R/W H'00 H'FF37
Module stop control register MSTPCR R/W H'3FFF H'FF3C
Notes: 1. Lower 16 bits of the address.
2. Registers within the DTC cannot be read or written to directly.
3. Register information is located in on-chip RAM addresses H'F800 to H'FBFF. It cannot
be located in external space. When the DTC is used, do not clear the RAME bit in
SYSCR to 0.
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8.2 Register Descriptions
8.2.1 DTC M ode Register A (MRA)
Bit : 7 6 5 4 3 2 1 0
SM1 SM0 DM1 DM0 MD1 MD0 DTS Sz
Initial value : Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined
R/W : — — — — — — — —
MRA is an 8-bit register that controls the DTC op e rating mode.
Bits 7 and 6—Source Address Mode 1 and 0 (SM1, SM0): These bits specify whether SAR is
to be incremented, decremented, or left fixed after a data transfer.
Bit 7
SM1 Bit 6
SM0
Description
0 — SAR is fixed
1 0 SAR is incremented after a transfer
(by +1 when Sz = 0; by +2 when Sz = 1)
1 SAR is decremented after a transfer
(by –1 when Sz = 0; by –2 when Sz = 1)
Bits 5 and 4—Destination Address Mode 1 and 0 (DM1, DM0): These bits specify whether
DAR is to be incremented, d ecremented, or left fixed after a data transfer.
Bit 5
DM1 Bit 4
DM0
Description
0 — DAR is fixed
1 0 DAR is incremented after a transfer
(by +1 when Sz = 0; by +2 when Sz = 1)
1 DAR is decremented after a transfer
(by –1 when Sz = 0; by –2 when Sz = 1)
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Bits 3 and 2—DTC Mode (MD1, MD0): These bits specify the DTC transfer mode.
Bit 3
MD1 Bit 2
MD0
Description
0 0 Normal mode
1 Repeat mode
1 0 Block transfer mode
1 —
Bit 1—DTC Transfer Mode Select (DTS): Specifies whether the source side or the destination
side is set to be a repeat area or block area, in repeat mode or block transfer mode.
Bit 1
DTS
Description
0 Destination side is repeat area or block area
1 Source side is repeat area or block area
Bit 0—DTC Data Transfer Size (Sz): Specifies the size of data to be transferred.
Bit 0
Sz
Description
0 Byte-size transfer
1 Word-size transfer
8.2.2 DTC Mode Register B (MRB)
Bit : 7 6 5 4 3 2 1 0
CHNE DISEL CHNS — — — — —
Initial value : Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde -
fined Unde-
fined
R/W : — — — — — — — —
MRB is an 8-bit register that co ntrols the DT C operating mode.
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Bit 7—DTC Chain Transfer Enable (CHNE): Specifies chain transfer. With chain transfer, a
number of data transfers can be performed consecutively in response to a single transfer request.
In data transfer with CHNE set to 1, de termination of the end of the specified number of transfers,
clearing of the interrupt source flag, and clearing of DTCER are not performed.
When CHNE is set to 1, the chain transfer condition can be selected with the CHNS bit.
Bit 7
CHNE
Description
0 End of DTC data transfer (activation waiting state)
1 DTC chain transfer (new register information is read, then data is transferred)
Bit 6—DTC Interrupt Select (DISEL): Specifies whether interrupt requests to the CPU are
disabled or enabled after a data transfer.
Bit 6
DISEL
Description
0 After a data transfer ends, the CPU interrupt is disabled unless the transfer counter is
0 (the DTC clears the interrupt source flag of the activating interrupt to 0)
1 After a data transfer ends, the CPU interrupt is enabled (the DTC does not clear the
interrupt source flag of the activating interrupt to 0)
Bit 5—DTC Chain Tran sfer Select (CHNS): Sp ecifies the chain transfer condition when CHNE
is 1.
Bit 7
CHNE Bit 5
CHNS
Description
0 – No chain transfer (DTC data transfer end, activation waiting state entered)
1 0 DTC chain transfer
1 1 Chain transfer only when transfer counter = 0
Bits 4 to 0—Reserved: These bits have no effect on DTC operation in the chip and should always
be written with 0.
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8.2.3 DTC Source Address Register (SAR)
Bit : 23 22 21 20 19 – – – 4 3 2 1 0
– – –
Initial value : Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined – – – Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined
R/W : — — — — — – – – — — — — —
SAR is a 24-bit register that designates the source address of data to be transferred by the DTC.
For word-size transfer, specify an even source address.
8.2.4 DTC Destina tion Address R e gister (DAR)
Bit : 23 22 21 20 19 – – – 4 3 2 1 0
– – –
Initial value : Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined – – – Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined
R/W : — — — — — – – – — — — — —
DAR is a 24-bit register that designates the destination address of data to be transferred by the
DTC. For word-size transfer, specify an even destination address.
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8.2.5 DTC Transfer Co unt Register A (CRA)
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined
R/W : — — — — — — — — — — — — — — — —
←⎯⎯⎯⎯⎯⎯⎯ CRAH ⎯⎯⎯⎯⎯⎯→ ←⎯⎯⎯⎯⎯⎯⎯ CRAL ⎯⎯⎯⎯⎯⎯→
CRA is a 16-bit register that designates the number of times data is to be transferred by the DTC.
In normal mode, the entire CRA register functions as a 16-bit transfer counter (1 to 65,536). It is
decremented by 1 every time data is transferred, and transfer ends when the count reaches H'0000.
In repeat mode or block transfer mode, the CRA register is divided into two parts: the upper 8 bits
(CRAH) and the lower 8 bits (CRAL). CRAH holds the num ber of transfers while CRAL
functions as an 8-bit transfer counter (1 to 256). CRAL is decremented by 1 every time data is
transferred, and the contents of CRAH are sent when the count reaches H'00. This operation is
repeated.
8.2.6 DTC Transfer Co unt Register B (CRB)
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined
R/W : — — — — — — — — — — — — — — — —
CRB is a 16-bit register that designates the number of times data is to be transferred by the DTC in
block transfer mode. It functions as a 16-bit transfer counter (1 to 65,536) that is decremented by 1
every time data is transferred, and transfer ends when the count reaches H'0000.
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8.2.7 DTC Enable Registers (DTCER)
Bit : 7 6 5 4 3 2 1 0
DTCE7 DTCE6 DTCE5 DTCE4 DTCE3 DTCE2 DTCE1 DTCE0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
The DTC enable registers comprise six 8-bit readable/writable registers, DTCERA to DTCERF,
with bits corresponding to the interrupt sources that can activate the DTC. These bits enable or
disable DTC service for the corresponding interrupt sources.
The DTC enable registers are initialized to H'00 b y a reset and in hardware standby mode.
Bit n—DTC Activation Enable (DTCEn)
Bit n
DTCEn
Description
0 DTC activation by this interrupt is disabled (Initial value)
[Clearing conditions]
• When the DISEL bit is 1 and the data transfer has ended
• When the spe cif ied num ber of transfers have ended
1 DTC activation by this interrupt is enabled
[Holding condition]
When the DISEL bit is 0 and the specified number of transfers have not ended
(n = 7 to 0)
A DTCE bit can be set for each interrupt source that can activate the DTC. The correspondence
between interrupt sources and DTCE bits is shown in table 8.5 , together with the vector numbers
generated by the interrupt controller.
For DTCE bit setting, read/write operations must be performed using bit- manip ulation instructions
such as BSET and BCLR. For the initial setting only, however, when multiple activation sources
are set at one time, it is possible to disable interrupts and write after executing a dummy read on
the re leva nt register.
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8.2.8 DTC Vector Register (DTVECR)
Bit : 7 6 5 4 3 2 1 0
SWDTE DTVEC6 DTVEC5 DTVEC4 DTVEC3 DTVEC2 DTVEC1 DTVEC0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/(W) R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)*
Note: * Bits DTVEC6 to DTVEC0 can be written to when SWDTE = 0.
DTVECR is an 8-bit read ab le/writable register that enables or disab les DTC activation by
software, and sets a vector number for the software activation interrupt.
DTVECR is initialized to H'00 by a reset and in hardware standb y mode.
Bit 7—DTC Software Activation Enable (SWDTE): Enables or disables DTC activation by
software.
Bit 7
SWDTE
Description
0 DTC software activation is disabled (Initial value)
[Clearing conditions]
• When the DISEL bit is 0 and the specified number of transfers have not ended
• When 0 is written after a software activation data-transfer-complete interrupt is
issued to the CPU
1 DTC software activation is enabled
[Holding conditions]
• When the DISEL bit is 1 and data transfer has ended
• When the spe cif ied num ber of transfers have ended
• During data transfer due to software activation
Bits 6 to 0—DTC Software Activation Vectors 6 to 0 (DTVEC6 to DTVEC0): These bits
specify a vector number for DTC software activation.
The vector address is expressed as H'0400 + ((vector number) << 1). <<1 indicates a one-bit left-
shift. For example, when DTVEC6 to DTVEC0 = H'10, the vector address is H'0420.
Section 8 Data Transfer Controller
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8.2.9 Module Stop Control Register (MSTPCR)
MSTPCRH MSTPCRL
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
When the MSTP14 bit in MSTPCR is set to 1, DTC operation stops at the end of the bus cycle and
a transition is made to module stop mode. However, 1 cannot be written in the MSTP14 bit while
the DTC is operating. For details, see section 21.5, Module Stop Mode.
MSTP CR is initialized to H'3FFF by a reset a nd in hardware stand by mode. It is not initialized in
software standby mode.
Bit 14—Module Stop (MSTP14): Specifies the DTC module stop mode.
Bit 14
MSTP14
Description
0 DTC module stop mode cleared (Initial value)
1 DTC module stop mode set
8.3 Operation
8.3.1 Overview
When activated, the DTC reads register information that is already stored in memory and transfers
data on the basis of that register information. After the data tr ans fer, it writes updated register
information back to memory. Pre-stor age of register in formation in memory make s it possible to
transfer data over any required number of channels. Setting t he CHNE bit to 1 makes it possible to
perform a number of transfers with a single activation. A setting can also be made to have chain
transfer performed only when the transfer counter value is 0. This enables DTC re-setting to be
performed by the DTC itself.
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Figure 8.2 shows a flowchart of DTC operation, and table 8.2 summarizes the chain transfer
conditions (combinations for performing the second and thir d transfers are omitted).
Start
Read DTC vector
Next transfer
Read register information
Data transfer
Write register information
Clear activation flag
CHNE = 1?
End
No
No
No
No
No
Yes
Yes
Yes
Yes
Yes
Transfer counter = 0
or DISEL = 1?
Clear DTCER
Interrupt exception
handling
CHNS = 0?
DISEL = 1?
Transfer
counter = 0?
Figure 8.2 Flowchart of DTC Operation
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Table 8.2 Chain Transfer Conditions
1st Transfer 2nd Transfer
CHNE CHNS DISEL CR CHNE CHNS DISEL CR DTC Transfer
0 — 0 Not 0 — — — — Ends at 1st transfer
0 — 0 0 — — — — Ends at 1st transfer
0 — 1 — — — — — Interrupt request to CPU
1 0 — — 0 — 0 Not 0 Ends at 2nd transfer
0 — 0 0 Ends at 2nd transfer
0 — 1 — Interrupt request to CPU
1 1 0 Not 0 — — — — Ends at 1st transfer
1 1 — 0 0 — 0 Not 0 Ends at 2nd transfer
0 — 0 0 Ends at 2nd transfer
0 — 1 — Interrupt request to CPU
1 1 1 Not 0 — — — — Ends at 1st transfer
Interrupt request to CPU
The DTC transfer mode can be normal mode, repeat mode, or block transfer mode.
The 24-bit SAR designates the DTC transfer source address and the 24-bit DAR designates the
transfer destination address. After each transfer, SAR and DAR are independently incremented,
decremented, or left fixed.
Table 8.3 outlines the functions of the DTC.
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Table 8.3 DTC Functions
Address Registers
Transfer Mode
Activation Source Transfer
Source Transfer
Destination
• Normal mode
⎯ One transfer request transfers one byte
or one word
⎯ Memory addresses are incremented
or decremented by 1 or 2
⎯ Up to 65,536 transfers possible
• Repeat mode
⎯ One transfer request transfers one byte
or one word
⎯ Memory addresses are incremented
or decremented by 1 or 2
⎯ After the specified number of transfers
(1 to 256), the initial state resumes and
operation con tin ues
• Block transfer mode
⎯ One transfer request transfers a block
of the specified size
⎯ Block size is from 1 to 256 bytes or words
⎯ Up to 65,536 transfers possible
⎯ A block area can be designated at either
the source or destination
• IRQ
• TPU TGI
• 8-bit timer CMI
• SCI TXI or RXI
• A/D converter
ADI
• DMAC DEND*
• Software
24 bits 24 bits
Note: * The DMAC is not supported in the H8S/2321.
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8.3.2 Activation Sources
The DTC operates when activated by an interrupt or by a write to DTVECR by software. An
interrupt request can be directed to the CPU or DTC, as designated by the corresponding DTCER
bit. An interrupt becomes a DTC activation source when the correspo nding bit is set to 1, and a
CPU interrupt source when the bit is cleared to 0.
At the end of a data transfer (or the last consecutive transfer in the case of chain transfer), the
activation source or corresponding DTCER bit is cleared. Table 8.4 shows activation source and
DTCER clearance. The activation source flag, in the case of RXI0, for example, is the RDRF flag
of SCI0.
Table 8.4 Activation Source and DTCER Clearance
Activation Source
When the DISEL Bit Is 0 and
the Specified Number of
Transfers Have Not Ended
When the DISEL Bit Is 1, or when
the Specified Number of Transfers
Have Ended
Software activation The SWDTE bit is cleared to 0 • The SWDTE bit remains set to 1
• An interrupt is issued to the CPU
Interrupt activation • The corresponding DTCER
bit remains set to 1
• The activation source flag is
cleared to 0
• The corresponding DTCER bit is
cleared to 0
• The activation source flag remains set
to 1
• A request is issued to the CPU for the
activation source interr upt
Figure 8.3 shows a block diagram of activation source control. For details see section 5, Interrupt
Controller.
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On-chip
supporting
module
IRQ interrupt
DTVECR
Selection circuit
Interrupt controller CPU
DTC
DTCER
Clear
control
Select
Interrupt
request
Source flag clearance
Clear
Clear request
Interrupt mask
Figure 8.3 Block Diagram of DTC Activation Source Control
When an interrupt has been designated a DTC activation source, existing CPU mask level and
interrupt controller priorities have no effect. If there is more than one activation source at the same
time, the DTC operates in accordance with the default priorities.
8.3.3 DTC Vector Table
Figure 8.4 shows the correspondence between DTC vector addresses and register information.
Table 8.5 shows the correspondence between activation, vector addresses, and DTCER bits. When
the DTC is activated by software, the vector address is obtained from: H'0400 + (DTVECR[6:0]
<< 1) (where << 1 indicates a 1-bit left shift). For example, if DTVECR is H'10, the vector
address is H'0420.
The DTC reads the start address of the register information from the vector address set for each
activation source, and then reads the register information from that start address. The register
information can be placed at predetermined addresses in the on-chip RAM. The start address of
the register information should be an integral multiple of four.
The configuration of the vector address is a 2-byte unit. These two bytes specify the lower bits of
the address in the on-chip RAM.
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Table 8.5 Interrupt Source s, DTC Vector Addresses, a nd Corresponding DTCEs
Interrupt Source
Origin of
Interrupt
Source
Vector
Number
Vector
Address
DTCE*1
Priority
Write to DTVECR Software DTVECR H'0400+
(DTVECR
[6:0]<<1)
— High
IRQ0 External pin 16 H'0420 DTCEA7
IRQ1 17 H'0422 DTCEA6
IRQ2 18 H'0424 DTCEA5
IRQ3 19 H'0426 DTCEA4
IRQ4 20 H'0428 DTCEA3
IRQ5 21 H'042A DTCEA2
IRQ6 22 H'042C DTCEA1
IRQ7 23 H'042E DTCEA0
ADI (A/D conversion end) A/D 28 H'0438 DTCEB6
TGI0A (GR0A compare match/
input capture) TPU
channel 0 32 H'0440 DTCEB5
TGI0B (GR0B compare match/
input capture) 33 H'0442 DTCEB4
TGI0C (GR0C compa r e match/
input capture) 34 H'0444 DTCEB3
TGI0D (GR0D compa r e match/
input capture) 35 H'0446 DTCEB2
TGI1A (GR1A compare match/
input capture) TPU
channel 1 40 H'0450 DTCEB1
TGI1B (GR1B compare match/
input capture) 41 H'0452 DTCEB0
TGI2A (GR2A compare match/
input capture) TPU
channel 2 44 H'0458 DTCEC7
TGI2B (GR2B compare match/
input capture) 45 H'045A DTCEC6
Low
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Interrupt Source
Origin of
Interrupt
Source
Vector
Number
Vector
Address
DTCE*1
Priority
TGI3A (GR3A compare match/
input capture) TPU
channel 3 48 H'0460 DTCEC5 High
TGI3B (GR3B compare match/
input capture) 49 H'0462 DTCEC4
TGI3C (GR3C compa r e match/
input capture) 50 H'0464 DTCEC3
TGI3D (GR3D compa r e match/
input capture) 51 H'0466 DTCEC2
TGI4A (GR4A compare match/
input capture) TPU
channel 4 56 H'0470 DTCEC1
TGI4B (GR4B compare match/
input capture) 57 H'0472 DTCEC0
DMTEND0A (DMAC transfer
complete 0) DMAC 72 H'0490 DTCEE7
DMTEND0B (DMAC transfer
complete 1 73 H'0492 DTCEE6
DMTEND1A (DMAC transfer
complete 2) 74 H'0494 DTCEE5
DMTEND1B (DMAC transfer
complete 3) 75 H'0496 DTCEE4
TGI5A (GR5A compare match/
input capture) TPU
channel 5 60 H'0478 DTCED5
TGI5B (GR5B compare match/
input capture) 61 H'047A DTCED4
CMIA0 64 H'0480 DTCED3
CMIB0 8-bit timer
channel 0 65 H'0482 DTCED2
CMIA1 68 H'0488 DTCED1
CMIB1 8-bit timer
channel 1 69 H'048A DTCED0
DMTEND0A (DMAC transfer
complete 0) DMAC*2 72 H'0490 DTCEE7
DMTEND0B (DMAC transfer
complete 1) 73 H'0492 DTCEE6
DMTEND1A (DMAC transfer
complete 2) 74 H'0494 DTCEE5
DMTEND1B (DMAC transfer
complete 3) 75 H'0496 DTCEE4
Low
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Interrupt Source
Origin of
Interrupt
Source
Vector
Number
Vector
Address
DTCE*1
Priority
RXI0 (receive-data-full 0) 81 H'04A2 DTCEE3 High
TXI0 (transmit-data-empty 0) SCI
channel 0 82 H'04A4 DTCEE2
RXI1 (receive-data-full 1) 85 H'04AA DTCEE1
TXI1 (transmit-data-empty 1) SCI
channel 1 86 H'04AC DTCEE0
RXI2 (receive-data-full 2) SCI 89 H'04B2 DTCEF7
TXI2 (transmit-data-empty 2) channel 2 90 H'04B4 DTCEF6 Low
Notes: 1. DTCE bits with no corresponding interrupt are reserved, and should be written with 0.
2. The DMAC is not supported in the H8S/2321.
Register information
start address Register information
Next transfer
DTC vector
address
Figure 8.4 Correspondence between DTC Vector Address and Register Information
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8.3.4 Location of Register Information in Address Space
Figure 8.5 shows how the register information should be located in the address space.
Locate the MRA, SAR, MRB, DAR, CRA, and CRB registers, in that order, from the start address
of the register information (contents of the vector address). In the case of chain transfer, register
information should be located in consecutive areas.
Locate the register information in the on-chip RAM (addresses: H'FFF800 to H'FFFBFF).
Register
information
start address
Chain
transfer Register information
for 2nd transfer in
chain transfer
MRA SAR
MRB DAR
CRA CRB
4 bytes
Lower address
CRA CRB
Register information
MRA
0123
SAR
MRB DAR
Figure 8.5 Location of DTC Register Information in Address Space
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8.3.5 Normal Mode
In normal mode, one operation transfers one byte or one word of data.
From 1 to 65,536 transfers can be specified. Once the specified number of transfers have ended, a
CPU interrupt can be requested.
Table 8.6 lists the register information in normal mode and figure 8.6 shows the memory map in
normal mode.
Table 8.6 Register Information in Normal Mode
Name Abbreviation Function
DTC source address register SAR Designates source address
DTC destination address register DAR Designates destination address
DTC transfer count register A CRA Designates transfer count
DTC transfer count register B CRB Not used
Transfer
SAR DAR
Figure 8.6 Memory Map in Normal Mode
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8.3.6 Repeat Mode
In repeat mode, one operation transfers one byte or one word of data.
From 1 to 256 transfers can be specified. Once the specified number of transfers have ended, the
initial state of the transfer counter and the address register specified as the repeat area is restored,
and transfer is repeated. In repeat mode the transfer counter value does not reach H'00, and
therefore CPU interrupts cannot be requested when DISEL = 0.
Table 8.7 lists the register information in repeat mode and figure 8.7 shows the memory map in
repeat mode.
Table 8.7 Register Information in Repeat Mode
Name Abbreviation Function
DTC source address register SAR Designates source address
DTC destination address register DAR Designates destination address
DTC transfer count register AH CRAH Holds number of transfers
DTC transfer count register AL CRAL Transfer counter
DTC transfer count register B CRB Not used
Transfer
SAR or
DAR DAR o
r
SAR
Repeat area
Figure 8.7 Memory Map in Repeat Mode
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8.3.7 Block Transfer Mode
In block transfer mode, one operation transfers one block of data. Either the transfer source or the
transfer destination is designated as a block area.
The block size is 1 to 256. When the transfer of one block ends, the initial state of the block size
counter and the address register specified as the block area is restored. The other address register
is then incremented, decremented, or left fixed.
From 1 to 65,536 transfers can be specified. Once the specified number of transfers have ended, a
CPU interrupt is requested.
Table 8.8 lists the register information in block transfer mode and figure 8.8 shows the memory
map in block transfer mode.
Table 8.8 Register Information in Block Transfer Mode
Name Abbreviation Function
DTC source address register SAR Designates transfer source address
DTC destination address register DAR Designates destination address
DTC transfer count register AH CRAH Holds block size
DTC transfer count register AL CRAL Block size counter
DTC transfer count register B CRB Transfer counter
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Transfer
SAR or
DAR DAR o
r
SAR
Block area
First block
Nth block
·
·
·
Figure 8.8 Memory Map in Block Transfer Mode
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8.3.8 Chain Transfer
Setting the CHNE bit to 1 enables a number of data transfer s to be performed consecutively in
response to a single transfer request. It is also possible, by setting both the CHNE bit and CHNS
bit to 1, to specify execution of chain transfer only when the transfer counter value is 0. SAR,
DAR, CRA, CRB, MRA, and MRB, which define data transfers, can be set independently.
Figure 8.9 shows the memory map for chain transfer.
Source
Source
Destination
Destination
DTC vector
address Register information
start address
Register information
CHNE = 1
Register information
CHNE = 0
Figure 8.9 Chain Transfer Memory Map
In the case of transfer with CHNE set to 1, an interrupt request to the CPU is not generated at the
end of the specified number of transfers or by setting of the DISEL bit to 1, and the interrupt
source flag for the activation source is not affected.
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8.3.9 Operation Timing
Figures 8.10 to 8.12 show examples of DTC operation timing.
DTC activation
request
DTC
request
A
ddress
Vector read
Transfer
information read Transfer
information write
Data transfer
Read Write
φ
Figure 8.10 DTC Operation Timing (Example in Normal Mode or Repeat Mode)
Read Write Read Write
Data transfer
Transfer
information write
Transfer
information read
Vector read
φ
DTC activation
request
DTC request
A
ddress
Figure 8.11 DTC Operation Timing (Example of Block Transfer Mode,
with Block Size of 2)
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Read Write Read Write
A
ddress
φ
DTC activation
request
DTC
request Data transfer Data transfer
Transfer
information
write
Transfer
information
write
Transfer
information
read
Transfer
information
read
Vector read
Figure 8.12 DTC Operation Timing (Example of Chain Transfer)
8.3.10 Number of DTC Execution States
Table 8.9 lists execution phases for a single DTC data transfer, and table 8.10 shows the number
of states required for each execution phase.
Table 8.9 DTC Execution Phases
Mode
Vector Read
I
Register Information
Read/Write
J
Data Read
K
Data Write
L
Internal
Operations
M
Normal 1 6 1 1 3
Repeat 1 6 1 1 3
Block transfer 1 6 N N 3
N: Block size (initial setting of CRAH and CRAL)
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Table 8.10 Number of States Required for Each Execution Phase
Access To:
On-
Chip
RAM
On-
Chip
ROM
Internal I/O
Registers
External Devices
Bus width 32 16 8 16 8 16
Access states 1 1 2 2 2 3 2 3
Vector read SI — 1 — — 4 6+2m 2 3+m Execution
phase Register
information
read/write
SJ 1 — — — — — — —
Byte data read SK 1 1 2 2 2 3+m 2 3+m
Word data read SK 1 1 4 2 4 6+2m 2 3+m
Byte data write SL 1 1 2 2 2 3+m 2 3+m
Word data write SL 1 1 4 2 4 6+2m 2 3+m
Internal operation SM 1
The number of execution states is calculated from the formula below. Note that Σ means the sum
of all transfers activated by one activation event (the number in which the CHNE bit is set to 1,
plus 1).
Number of execution states = I · SI + Σ (J · SJ + K · SK + L · SL) + M · SM
For example, when the DTC vector address table is located in on-chip ROM, normal mode is set,
and data is transferred from the on-chip ROM to an internal I/O register, the time required for the
DTC op eration is 13 states. The time from activation to t he end of the data write is 10 states.
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8.3.11 Procedures for Using DTC
Activatio n by Interrupt: The procedure for using the DTC with interrupt activation is as follo ws:
[1] Set the MRA, MRB, SAR, DAR, CRA, and CRB register information in the on-chip RAM.
[2] Set the start address of the register information in the DTC vector address.
[3] Set the corresponding bit in DTCER to 1 .
[4] Set the e nable b its for the interrupt sources to be used as t he activation sources to 1. The DTC
is activated when an interrupt used as an activation source is generated.
[5] After the end of one data transfer, or after the specified number of data transfers have ended,
the DTCE bit is cleared to 0 and a CPU interrupt is requested. If the DTC is to continue
transferring data, set the DTCE bit to 1 .
Activation by Software: The procedure for using the DTC with software activation is as follows:
[1] Set the MRA, MRB, SAR, DAR, CRA, and CRB register information in the on-chip RAM.
[2] Set the start address of the register information in the DTC vector address.
[3] Check that the SWDTE bit is 0.
[4] W r ite 1 to the SWDTE bit and the vector number to DTVECR.
[5] Check the vector number written to DTVECR.
[6] After the end of one data trans fer, if the DISEL bit is 0 and a CPU interrupt is not requested,
the SWDTE bit is cleared to 0. If the DTC is to continue transferring data, set the SWDTE bit
to 1. When the DISEL bit is 1, or after the specified number of data transfers have ended, the
SWDTE b it is held at 1 and a CPU interrupt is requested.
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8.3.12 Examples of Use of the DTC
Normal Mode: An example is shown in which the DTC is used to receive 128 bytes of data via
the SCI.
[1] Set MRA to fixed source address (SM1 = SM0 = 0), incrementing destination address (DM1 =
1, DM0 = 0), normal mode (MD1 = MD0 = 0), and byte size (Sz = 0). The DTS bit can have
any value. Set MRB for one data transfer by one interrupt (CHNE = 0, DISEL = 0). Set the
SCI RDR add ress in SAR, the start address of the RAM area where the data will be received in
DAR, and 128 (H'0080) in CRA. CRB can be set to any value.
[2] Set the start address of the register information at the DTC vector address.
[3] Set the corresponding bit in DTCER to 1 .
[4] Set the SCI to the appropriate receive mode. Set the RIE bit in SCR to 1 to enable the reception
data full (RXI) interrupt. Since the generation of a receive error during the SCI receive
operation will disable subsequent reception, the CPU shou ld b e enabled to accept receive error
interrupts.
[5] Each time reception of one byte of data ends on the SCI, the RDRF flag in SSR is set to 1, an
RXI interrupt is generated, and the DTC is activated. The receive data is transferred from RDR
to RAM by the DTC. DAR is incremented and CRA is decremented. The RDRF flag is
automatically cleared to 0.
[6] When CRA becomes 0 after the 128 data transfers have ended, the RDRF flag is held at 1, the
DTCE bit is cleared to 0, and an RXI interrupt request is sent to the CPU. The interrupt
handling routine should perform wrap-up processing.
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Chain Transfer: An example of DTC chain transfer is shown in which pulse output is performed
using the PPG. Chain transfer can be used to perform pulse output data transfer and PPG output
trigger cycle updating. Repeat mode transfer to the PPG’s NDR is pe rformed in the first half of the
chain transfer, and normal mode transfer to the TPU’s TGR in the second half. This is because
clearing of the activation source and interrupt generation at the end of the specified number of
transfers are restricted to the second half of the chain transfer (transfer when CHNE = 0).
[1] Perform settings for transfer to the PPG’s NDR. Set MRA to source address incrementing
(SM1 = 1, SM0 = 0), fixed destination address (DM1 = DM0 = 0), repeat mode (MD1 = 0,
MD0 = 1), and word size (Sz = 1). Set the source side as a repeat area (DTS = 1). Set MRB to
chain mode (CHNE = 1, DISEL = 0). Set the data table start address in SAR, the NDRH
address in DAR, and the data table size in CRAH and CRAL. CRB can be set to any value.
[2] Perform settings for transfer to the TPU’s TGR. Set MRA to source address incrementing
(SM1 = 1, SM0 = 0), fixed destination address (DM1 = DM0 = 0), normal mode (MD1 = MD0
= 0), and word size (Sz = 1). Set the data table start address in SAR, the TGRA address in
DAR, and the data table size in CRA. CRB can be set to any value.
[3] Locate the TPU transfer register information consecutively after the NDR transfer register
information.
[4] Set the start address of the NDR transfer register information to the DTC vector address.
[5] Set the bit corresp onding to TGIA in DTCER to 1.
[6] Set T GRA as an output compare register (output disabled) with TIOR, and enable the TGIA
interrupt with TIER.
[7] Set the i nitial output value in PODR, and the next output va lue in NDR. Set bits in DDR a nd
NDER for which output is to be performed to 1. Using P CR, select the TPU compare match to
be use d as the output t rigger.
[8] Set the CST bit in TSTR to 1 , and start the TCNT count operation.
[9] Each time a TGRA compare match occurs, the next output value is transferred to NDR and the
set value of the next output trigger period is transferred to TGRA. The activation source TGFA
flag is cleared.
[10] When the specified number of transfers are completed (the TPU transfer CRA value is 0), the
TGFA flag is held at 1, the DTCE bit is cleared to 0, and a TGIA interrupt request is sent to the
CPU. Wrap-up processing should be performed in the interrupt handling routine.
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Chain Transfer when Counter = 0: By executing a second data transfer, and performing re-
setting of the first data transfer, only when the counter value is 0, it is possible to perform 256 or
more repeat transfers.
An example is shown in which a 128-kbyte input buffer is configured. The input buffer is assumed
to have been set to start at lower address H'0000. Figure 8.13 shows the memory map.
[1] For the first transfer, set the normal mode for input data. Set fixed transfer source address
(G/A, etc.), CRA = H'0000 (64k times), and CHNE = 1, CHNS = 1, and DISEL = 0.
[2] Prepare the upper 8-bit addresses of the start addresses for each of the 64k transfer start
addresses for the first data transfer in a separate area (in ROM, etc.). For example, if the input
buffer comprises H'200000 to H'21FFFF, prepare H'21 and H'20.
[3] For the second transfer, set repeat mode (with the source side as the repeat area) for re-setting
the transfer destination address for the first data transfer. Use the upper 8 bits of DAR in the
first register information area as the transfer destination. Set CHNE = DISEL = 0. If the above
input buffer is specified as H'200000 to H'21FFFF, set the transfer counter to 2.
[4] Execute the first data transfer 64k times by means of interrupts. When the transfer counter for
the first data transfer reaches 0, the second data transfer is started. Set the upper 8 bits of the
transfer source address for the first data transfer to H'21. The lower 16 bits of the transfer
destination address of the first data transfer and the transfer counter are H'0000.
[5] Next, execute the first data transfer the 64k times specified for the first data transfer by means
of interrupts. When the transfer counter for the first data transfer reaches 0, the second data
transfer is started. Set the upper 8 b its of the transfer source address for the first data transfer to
H'20. The lower 16 bits of the transfer destinatio n add r ess o f the first data transfer and the
transfer counter are H'0000.
[6] Steps [4] and [5] are repeated endlessly. As repeat mode is specified for the second data
transfer, an interrupt request is not sent to the CPU.
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First data
transfer register
information
Second data
transfer register
information
Chain transfer
(counter = 0) Upper 8 bits
of DAR
Input buffer
Input circuit
Figure 8.13 Chain Transfer when Counter = 0
Software Activation: An example is shown in which the DTC is used to transfer a block of 128
bytes of data by means of software activation. The transfer source address is H'1000 and the
destination address is H'2000. The vector number is H'60, so the vector address is H'04C0.
[1] Set MRA to incrementing source address (SM1 = 1, SM0 = 0), incrementing destination
address (DM1 = 1, DM0 = 0), block transfer mode (MD1 = 1, MD0 = 0), and byte size (Sz =
0). The DTS bit can have any value. Set MRB for one block transfer by one interrupt (CHNE =
0). Set the transfer source address (H'1000) in SAR, the destination address (H'2000) in DAR,
and 128 (H'8080) in CRA. Set 1 (H'0001) in CRB.
[2] Set the start address of the register information at the DTC vector address (H'04C0).
[3] Check that the SWDTE bit in DTVECR is 0. Check that there is currently no transfer activated
by software.
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[4] W r ite 1 to the SWDTE bit and the vector number (H'60) to DTVECR. The write data is H'E0.
[5] Read DTVECR again and check that it is set to the vector number (H'60). If it is not, this
indicates that the write failed. This is presumably because an interrupt occurred between steps
[3] and [4] and led to a different software activation. To activate this transfer, go back to step
[3].
[6] If the write was successful, the DTC is activated and a block of 128 bytes of data is transferred.
[7] After the transfer, an SWDTEND interrupt occurs. The interrupt handling routine should clear
the SWDTE bit to 0 and perform other wrap-up processing.
8.4 Interrupts
An interrupt request is issued to the CPU when the DTC finishes the specified number of data
transfers, or a data transfer for which the DISEL bit was set to 1. In the case of interrupt activation,
the interrupt set as the activation source is generated. These interrupts to the CPU are subject to
CPU mask level and interrupt controller priority level control.
In the case of activation by software, a software activated data transfer end interrupt (SWDTEND)
is ge nerat ed.
When the DISEL bit is 1 and one data transfer has ended, or the specified number of transfers
have ended, after data transfer ends, the SWDTE bit is held at 1 and an SWDTEND interrupt is
generated. The interrupt handling routine should clear the SWDTE bit to 0.
When the DTC is activated by software, an SWDT END interrupt is not generated during a data
transfer wait or during data transfer even if the SWDTE bit is set to 1.
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8.5 Usage Notes
Module Sto p: When the MSTP14 bit in MSTPCR is set to 1, the DTC clock stops, and the DTC
enters the module stop state. However, 1 cannot be written to the MSTP14 b it while the DTC is
operating.
On-Chip RAM: The MRA, MRB, SAR, DAR, CRA, and CRB registers are all located in on-chip
RAM. When the DTC is used, the RAME bit in SYSCR must not be cleared to 0.
DMAC Transfer End Interrupt*: When DTC transfer is activated by a DMAC transfer end
interrupt, regardless of the transfer counter and DISEL bit, the DMAC’s DTE bit is not subject to
DTC control, and the write data has priority. Consequently, an interrupt request may not be sent to
the CPU when the DTC transfer counter reaches 0.
Note: * The DMAC is not supported in the H8S/2321.
DTCE Bit Setting: For DTCE bit setting, read/write operations must be performed using bit-
manipulation instruction s suc h as BSET and BCLR. For the initial setting only, however, when
multiple activation sources are set at one time, it is possible to disable interrupts and write after
executing a dummy read on the relevant register.
Chain Transfer: When chain transfer is used, clearing of the activation source or DTCER is
performed when the last of the chain of data transfers is executed. SCI and A/D converter
interrupt/activation sources, on the other hand, are cleared when the DTC reads or writes to the
prescribed register.
Therefore, when the DTC is activated by an interrupt or activation source, if a read/write of the
relevant register is not included in the last chained data transfer, the interrupt or activation source
will be retained.
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Section 9 I/O Ports
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Section 9 I/O Ports
9.1 Overview
The chip has 12 I/O ports (ports 1, 2, 3, 5, 6, and A to G), and one input-only port (port 4).
Table 9.1 summarizes the port functions. The pins of each port also have other functions.
Each port includes a data direction register (DDR) that controls input/o utput ( not pr ovided for the
input-only port), a data register (DR) that stores output data, and a port register (PORT) used to
read the pin states.
Ports A to E have a built-in MOS p ull-up function, and in ad dition to DR and DDR, ha ve a MOS
input pull-up control register (PCR) to control the on/off stat e of MOS input pull-up.
Port 3 and port A include an open drain control register (ODR) that controls the on/off state of the
output buffer PMOS.
Ports 1 and A to F can drive a single TTL load and 50 pF capacitive load, and ports 2, 3, 5, 6, and
G can drive a single TTL load and 30 pF capacitive load.
Ports 1, 2, and 5 (only when used for IRQ input), and pins 64 to 67 and A4 to A7, are Schmitt-
triggered inputs.
Section 9 I/O Ports
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Table 9.1 Port Functions
Port Description Pins Mode 4*1 Mode 5*1 Mode 6 Mode 7
Port 1 • 8-bit I/O
port
• Schmitt-
triggered
input
P17/PO15/TIOCB2/TCLKD
P16/PO14/TIOCA2
P15/PO13/TIOCB1/TCLKC
P14/PO12/TIOCA1
P13/PO11/TIOCD0/TCLKB
P12/PO10/TIOCC0/TCLKA
P11/PO9/TIOCB0/DACK1*2
P10/PO8/TIOCA0/DACK0*2
8-bit I/O port also functioni ng as DMA controller output pins
(DACK0 and DACK1)*2, TPU I/O pins (TCLKA, TCLKB,
TCLKC, TCLKD, TIOCA0, TIOCB0, TIOCC0, TIOCD0,
TIOCA1, TIOCB1, TIOCA2, TIOCB2) and PPG output pins
(PO15 to PO8)
Port 2 • 8-bit I/O
port
• Schmitt-
triggered
input
P27/PO7/TIOCB5/TMO1
P26/PO6/TIOCA5/TMO0
P25/PO5/TIOCB4/TMCI1
P24/PO4/TIOCA4/TMRI1
P23/PO3/TIOCD3/TMCI0
P22/PO2/TIOCC3/TMRI0
P21/PO1/TIOCB3
P20/PO0/TIOCA3
8-bit I/O port also functioni ng as TPU I/O pins (TIO CA3,
TIOCB3, TIOCC3, TIOCD 3, TIOCA 4, TIOCB4, TIOCA5,
TIOCB5), 8-bit timer (channels 0 and 1) I/O pins (TMRI0,
TMCI0, TMO0, TMR I1, TMCI1, TMO1) and PPG output pins
(PO7 to PO0)
Port 3 • 6-bit I/O
port
• Open-drain
output
capability
P35/SCK1
P34/SCK0
P33/RxD1
P32/RxD0
P31/TxD1
P30/TxD0
6-bit I/O port also functioni ng as SCI (channel 0 and 1) I/O
pins (TxD0, RxD0, SCK0, TxD1, RxD1, SCK1)
Port 4 • 8-bit input
port P47/AN7/DA1
P46/AN6/DA0
P45/AN5
P44/AN4
P43/AN3
P42/AN2
P41/AN1
P40/AN0
8-bit input port also functioning as A/D converter analog
inputs (AN7 to AN0) and D/A converter analog outputs (DA 1
and DA0)
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 349 of 1268
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Port Description Pins Mode 4*1 Mode 5*1 Mode 6 Mode 7
Port 5 • 4-bit I/O
port
• Schmitt-
triggered
input
(IRQ input
only)
P53/ADTRG/IRQ7/WAIT/
BREQO I/O port also functi oni ng as A/D converter
input pin (ADTRG), and as interrupt input pin
(IRQ7) when IRQPAS = 1, WAIT input pin
when WAITE = 1, BREQOE = 0, WAITPS =
1, DDR = 0, and WAITE = 0, BREQOE = 1,
BREQO output pin when BREQOPS = 1
I/O port also
functioning as
A/D converter
input pin
(ADTRG),
and as inter-
rupt input pin
(IRQ7) when
IRQPAS = 1
P52/SCK2/IRQ6
P51/RxD2/IRQ5
P50/TxD2/IRQ4
I/O port also functioni ng as SCI (channel 2) I/O pins (TxD2,
RxD2, SCK2), and as interrupt input pins (IRQ4 to IRQ6)
when IRQPAS = 1
Port 6 • 8-bit I/O
port
• Schmitt-
triggered
input
(P64 to P67)
P67/IRQ3/CS7
P66/IRQ2/CS6
P65/IRQ1
P64/IRQ0
P63/TEND1*2
P62/DREQ1*2
P61/TEND0*2/CS5
P60/DREQ0*2/CS4
8-bit I/O port also functioni ng as DMA
controll er I/ O pins (DREQ0, TEND0, DREQ1,
TEND1) *2, bus control output pins (CS4 to
CS7), and interrupt i nput pins (IRQ0 to IRQ3)
8-bit I/O port
also function-
ing as inter-
rupt input pins
(IRQ0 to IRQ3)
Port A PA7/A23/IRQ7
PA6/A22/IRQ6
PA5/A21/IRQ5
When DDR = 0 (after reset):
dual functi on as input ports
and interrupt i nput pins (IRQ7
to IRQ5)
When DDR = 1 and A23E to
A21E = 1: address output
When DDR = 1 and A23E to
A21E = 0: DR value output
Dual functi on
as I/O ports
and interrupt
input pins
(IRQ7 to IRQ4)
• 8-bit I/O
port
• Built-in
MOS input
pull-up
• Open-drain
output
capability
• Schmitt-
triggered
input
(PA4 to
PA7)
PA4/A20/IRQ4 I/O port also functioning as
address output and interrupt
input pin (IRQ4)
When DDR =
0 (after reset):
dual functi on
as input ports
and interrupt
input pins
(IRQ7 to IRQ4)
When DDR =
1 and A23E to
A20E = 1:
address
output
When DDR =
1 and A23E to
A20E = 0: DR
value output
PA3/A19 to PA0/A16 Addres s output When DDR =
0 (after reset):
input ports
When DDR =
1: address
output
I/O ports
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 350 of 1268
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Port Description Pins Mode 4*1 Mode 5*1 Mode 6 Mode 7
Port B • 8-bit I/O
port
• Built-in
MOS input
pull-up
PB7/A15 to PB0/A8 Address output
When DDR =
0 (after reset):
input port
When DDR =
1: address
output
I/O ports
Port C • 8-bit I/O
port
• Built-in
MOS input
pull-up
PC7/A7 to PC0/A0 Address output
When DDR =
0 (after reset):
input port
When DDR =
1: address
output
I/O ports
Port D • 8-bit I/O
port
• Built-in
MOS input
pull-up
PD7/D15 to PD0/D8 Data bus i nput/output I/O ports
Port E • 8-bit I/O
port
• Built-in
MOS input
pull-up
PE7/D7 to PE0/D0 I n 8-bi t bus m ode: I/O port
In 16-bit bus mode: data bus input/output
I/O ports
Port F • 8-bit I/O
port PF7/φ When DDR = 0: input port
When DDR = 1 (after reset): φ output
When DDR =
0 (after reset):
input port
When DDR =
1: φ output
PF6/AS When ASOD = 1: I/O port
When ASOD = 0: AS output
I/O ports
PF5/RD
PF4/HWR
RD, HWR output
PF3/LWR When LWROD = 1: I/O port
When LWROD = 0: LWR output
PF2/LCAS*2/WAIT/BREQO When WAITE = 0 and BREQOE = 0 (after
reset): I/O port
When WAITE = 1, BREQOE = 0, and
WAITPS = 0, DDR = 0: WAIT input
When WAITE = 0, BREQOE = 1, and
BREQOPS = 0: BREQO output
When RMTS2 to RMTS0= B'001 to B'011,
and 16-bit access space is set: LCAS output
Section 9 I/O Ports
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Port Description Pins Mode 4*1 Mode 5*1 Mode 6 Mode 7
Port F • 8-bit I/O
port PF1/BACK
PF0/BREQ
When BRLE = 0 (after reset): I/O port
When BRLE = 1: BREQ input, BACK output
I/O ports
Port G • 5-bit I/O
port PG4/CS0 When DDR = 0*3: input port
When DDR = 1*4: CS0 output
I/O ports
PG3/CS1 When DDR = 0 (after reset): input port
When CS167E = 0 and DDR = 1: output port
When CS167E = 1 and DDR = 1: CS1
output
PG2/CS2 When DDR = 0 (after reset): input port
When CS25E = 0 and DDR = 1: output port
When CS25E = 1 and DDR = 1: CS2 output
PG1/CS3 When DDR = 0 (after reset): input port
When CS25E = 0 and DDR = 1: output port
When CS25E = 1 and DDR = 1: CS3 output
PG0/CAS*2 DRAM space set: CAS output
Otherwise (after reset): I/O port
Notes: 1. Only modes 4 and 5 are provided in the ROMless version.
2. The DACK1, DACK0, TEND1, DREQ1, TEND0, DREQ0 and LCAS are not supported
in the H8S/2321.
3. After a reset in mode 6.
4. After a reset in mode 4 or 5.
Section 9 I/O Ports
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9.2 Port 1
9.2.1 Overview
Port 1 is an 8-bit I/O port. Port 1 pins also function as PPG output pins (PO15 to PO8), TPU I/O
pins (TCLKA, TCLKB, TCLKC, TCLKD, TIOCA0, TIOCB0, TIOCC0, TIOCD0, TIOCA1,
TIOCB1, TIOCA2, and TIOCB2), and DMAC* output pins (DACK0 and DACK1). Port 1 pin
functions are the same in all operating modes. Port 1 uses Sc hmitt-triggered input.
Figure 9.1 shows the port 1 pin configuration.
Note: * Not supported in the H8S/2321.
P17 (I/O) / PO15 (output) / TIOCB2 (I/O) / TCLKD (input)
P16 (I/O) / PO14 (output) / TIOCA2 (I/O)
P15 (I/O) / PO13 (output) / TIOCB1 (I/O) / TCLKC (input)
P14 (I/O) / PO12 (output) / TIOCA1 (I/O)
P13 (I/O) / PO11 (output) / TIOCD0 (I/O) / TCLKB (input)
P12 (I/O) / PO10 (output) / TIOCC0 (I/O) / TCLKA (input)
P11 (I/O) / PO9 (output) / TIOCB0 (I/O) / DACK1* (output)
P10 (I/O) / PO8 (output) / TIOCA0 (I/O) / DACK0* (output)
Port 1
Port 1 pins
Note: * The DACK1 and DACK0 pin functions are not supported in the H8S/2321.
Figure 9.1 Port 1 Pin Functions
Section 9 I/O Ports
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9.2.2 Register Configuration
Table 9.2 shows the port 1 register configuration.
Table 9.2 Port 1 Registers
Name Abbreviation R/W Initial Value Address*
Port 1 data direction register P1DDR W H'00 H'FEB0
Port 1 data register P1DR R/W H'00 H'FF60
Port 1 register PORT1 R Undefined H'FF50
Note: * Lower 16 bits of the address.
Port 1 Data Direction Register (P1DDR)
Bit : 7 6 5 4 3 2 1 0
P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR
Initial value : 0 0 0 0 0 0 0 0
R/W : W W W W W W W W
P1DDR is an 8-bit write -only register, the individual bits of whic h specify i nput or output for the
pins of port 1. P1DDR cannot be read ; if it is, an undefined value will be read.
Setting a P1DDR bit to 1 makes the corresp onding port 1 pin an output pin, while clearing the bit
to 0 makes the pin an inp ut pin.
P1DDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in
software standby mode.
Section 9 I/O Ports
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Port 1 Data Register (P1DR)
Bit : 7 6 5 4 3 2 1 0
P17DR P16DR P15DR P14DR P13DR P12DR P11DR P10DR
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
P1DR is an 8-bit readable/writable register that stores output data for the port 1 pins (P17 to P10).
P1DR is initialized to H'00 b y a reset, and in hardware standby mode. It retains its prio r state in
software standby mode.
Port 1 Register (PORT1)
Bit : 7 6 5 4 3 2 1 0
P17 P16 P15 P14 P13 P12 P11 P10
Initial value : —* —
* —
* —
* —
* —
* —
* —
*
R/W : R R R R R R R R
Note: * Determined by state of pins P17 to P10.
PORT1 is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of
output data for the port 1 pins (P17 to P10) must always be performed on P1DR.
If a port 1 read is performed while P1DDR bits are set to 1, the P1DR values are read. If a port 1
read is performed while P1DDR bits are cleared to 0, the pin states are read.
After a reset and in hardware standby mode, PORT1 contents are determined by the pin states, as
P1DDR and P1 DR are initiali zed. PORT1 retains its prior state in software standby mode.
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 355 of 1268
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9.2.3 Pin Functions
Port 1 pins also function as PPG output pins (PO15 to PO8), TPU I/O pins (TCLKA, TCLKB,
TCLKC, TCLKD, TIOCA0, TIOCB0, TIOCC0, TIOCD0, TIOCA1, TIOCB1, TIOCA2, and
TIOCB2), and DMAC* outp ut pins (DACK0 and DACK1). Port 1 pin functions are shown in table
9.3.
Note: * The DMAC is not supported in the H8S/2321.
Table 9.3 Port 1 Pin Functions
Pin Selection Method and Pin Functions
P17/PO15/
TIOCB2/TCLKD The pin function is switched as shown below according to the combination of
the TPU channel 2 setting (by bits MD3 to MD0 in TMDR2, bits IOB3 to IOB0
in TIOR2, and bits CCLR1 and CCLR0 in TCR2), bits TPSC2 to TPSC0 in
TCR0 and TCR5, bit NDER15 in NDERH, and bit P17DDR.
TPU Channel
2 Setting
Table Below (1)
Table Below (2)
P17DDR — 0 1 1
NDER15 — — 0 1
Pin function TIOCB2 output P17
input P17
output PO15
output
TIOCB2 input*1
TCLKD input*2
Notes: 1. TIOCB2 input when MD3 to MD0 = B'0000 or B'01xx, and IOB3 = 1.
2. TCLKD input when the setting for either TCR0 or TCR5 is: TPSC2
to TPSC0 = B'111.
TCLKD input when channels 2 and 4 are set to phase counting
mode.
TPU Channel
2 Setting
(2)
(1)
(2)
(2)
(1)
(2)
MD3 to MD0 B'0000, B'01xx B'0010 B'0011
IOB3 to IOB0 B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
— B'xx00 Other than B'xx00
CCLR1,
CCLR0 — — — — Other
than B'10 B'10
Output
function — Output
compare
output
— — PWM
mode 2
output
—
x: Don’t care
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 356 of 1268
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Pin Selection Method and Pin Functions
P16/PO14/
TIOCA2 The pin function is switched as shown below according to the combination of
the TPU channel 2 setting (by bits MD3 to MD0 in TMDR2, bits IOA3 to IOA0
in TIOR2, and bits CCLR1 and CCLR0 in TCR2), bit NDER14 in NDERH, and
bit P16DDR.
TPU Channel
2 Setting
Table Below (1)
Table Below (2)
P16DDR — 0 1 1
NDER14 — — 0 1
Pin function TIOCA2 output P16
input P16
output PO14
output
TIOCA2 input*1
TPU Channel
2 Setting
(2)
(1)
(2)
(1)
(1)
(2)
MD3 to MD0 B'0000, B'01xx B'001x B'0011 B'0011
IOA3 to IOA0 B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
B'xx00 Other than B'xx00
CCLR1,
CCLR0 — — — — Other
than B'01 B'01
Output
function — Output
compare
output
— PWM
mode 1
output*2
PWM
mode 2
output
—
x: Don’t care
Notes: 1. TIOCA2 input when MD3 to MD0 = B'0000 or B'01xx, and IOA3 = 1.
2. TIOCB2 output is disabled.
Section 9 I/O Ports
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Pin Selection Method and Pin Functions
P15/PO13/
TIOCB1/TCLKC The pin function is switched as shown below according to the combination of
the TPU channel 1 setting (by bits MD3 to MD0 in TMDR1, bits IOB3 to IOB0
in TIOR1, and bits CCLR1 and CCLR0 in TCR1), bits TPSC2 to TPSC0 in
TCR0, TCR2, TCR4, and TCR5, bit NDER13 in NDERH, and bit P15DDR.
TPU Channel
1 Setting
Table Below (1)
Table Below (2)
P15DDR — 0 1 1
NDER13 — — 0 1
Pin function TIOCB1 output P15
input P15
output PO13
output
TIOCB1 input*1
TCLKC input*2
Notes: 1. TIOCB1 input when MD3 to MD0 = B'0000 or B'01xx, and IOB3
to IOB0 = B'10xx.
2. TCLKC input when the setting for either TCR0 or TCR2 is: TPSC2
to TPSC0 = B'110; or when the setting for either TCR4 or TCR5 is
TPSC2 to TPSC0 = B'101.
TCLKC input when channels 2 and 4 are set to phase counting
mode.
TPU Channel
1 Setting
(2)
(1)
(2)
(2)
(1)
(2)
MD3 to MD0 B'0000, B'01xx B'0010 B'0011
IOB3 to IOB0 B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
— B'xx00 Other than B'xx00
CCLR1,
CCLR0 — — — — Other
than
B'10
B'10
Output
function — Output
compare
output
— — PWM
mode 2
output
—
x: Don’t care
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 358 of 1268
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Pin Selection Method and Pin Functions
P14/PO12/
TIOCA1 The pin function is switched as shown below according to the combination of
the TPU channel 1 setting (by bits MD3 to MD0 in TMDR1, bits IOA3 to IOA0
in TIOR1, and bits CCLR1 and CCLR0 in TCR1), bit NDER12 in NDERH, and
bit P14DDR.
TPU Channel
1 Setting
Table Below (1)
Table Below (2)
P14DDR — 0 1 1
NDER12 — — 0 1
Pin function TIOCA1 output P14
input P14
output PO12
output
TIOCA1 input*1
TPU Channel
1 Setting
(2)
(1)
(2)
(1)
(1)
(2)
MD3 to MD0 B'0000, B'01xx B'001x B'0010 B'0011
IOA3 to IOA0 B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
B'xx00 Other
than
B'xx00
Other than B'xx00
CCLR1,
CCLR0 — — — — Other
than B'01 B'01
Output
function — Output
compare
output
— PWM
mode 1
output*2
PWM
mode 2
output
—
x: Don't care
Notes: 1. TIOCA1 input when MD3 to MD0 = B'0000 or B'01xx, and IOA3 to
IOA0 = B'10xx.
2. TIOCB1 output is disabled.
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 359 of 1268
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Pin Selection Method and Pin Functions
P13/PO11/
TIOCD0/TCLKB The pin function is switched as shown below according to the combination of
the TPU channel 0 setting (by bits MD3 to MD0 in TMDR0, bits IOD3 to IOD0
in TIOR0L, and bits CCLR2 to CCLR0 in TCR0), bits TPSC2 to TPSC0 in
TCR0 to TCR2, bit NDER11 in NDERH, and bit P13DDR.
TPU Channel
0 Setting
Table Below (1)
Table Below (2)
P13DDR — 0 1 1
NDER11 — — 0 1
Pin function TIOCD0 output P13
input P13
output PO11
output
TIOCD0 input*1
TCLKB input*2
Notes: 1. TIOCD0 input when MD3 to MD0 = B'0000, and IOD3 to IOD0 =
B'10xx.
2. TCLKB input when the setting for TCR0 to TCR2 is: TPSC2 to
TPSC0 = B'101.
TCLKB input when channels 1 and 5 are set to phase counting
mode.
TPU Channel
0 Setting
(2)
(1)
(2)
(2)
(1)
(2)
MD3 to MD0 B'0000 B'0010 B'0011
IOD3 to IOD0 B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
— B'xx00 Other than B'xx00
CCLR2 to
CCLR0 — — — — Other
than
B'110
B'110
Output
function — Output
compare
output
— — PWM
mode 2
output
—
x: Don’t care
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 360 of 1268
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Pin Selection Method and Pin Functions
P12/PO10/
TIOCC0/TCLKA The pin function is switched as shown below according to the combination of
the TPU channel 0 setting (by bits MD3 to MD0 in TMDR0, bits IOC3 to IOC0
in TIOR0L, and bits CCLR2 to CCLR0 in TCR0), bits TPSC2 to TPSC0 in
TCR0 to TCR5, bit NDER10 in NDERH, and bit P12DDR.
TPU Channel
0 Setting
Table Below (1)
Table Below (2)
P12DDR — 0 1 1
NDER10 — — 0 1
Pin function TIOCC0 output P12
input P12
output PO10
output
TIOCC0 input*1
TCLKA input*2
TPU Channel
0 Setting
(2)
(1)
(2)
(1)
(1)
(2)
MD3 to MD0 B'0000 B'001x B'0010 B'0011
IOC3 to IOC0 B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
B'xx00 Other than B'xx00
CCLR2 to
CCLR0 — — — — Other
than
B'101
B'101
Output
function — Output
compare
output
— PWM
mode 1
output*3
PWM
mode 2
output
—
x: Don’t care
Notes: 1. TIOCC0 input when MD3 to MD0 = B'0000, and IOC3 to IOC0 =
B'10xx.
2. TCLKA input when the setting for TCR0 to TCR5 is: TPSC2 to
TPSC0 = B'100.
TCLKA input when channels 1 and 5 are set to phase counting
mode.
3. TIOCD0 output is disabled.
When BFA = 1 or BFB = 1 in TMDR0, output is disabled and setting
(2) applies.
Section 9 I/O Ports
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Pin Selection Method and Pin Functions
P11/PO9/TIOCB0/
DACK1*2 The pin function is switched as shown below according to the combination of
the TPU channel 0 setting (by bits MD3 to MD0 in TMDR0, bits IOB3 to IOB0
in TIOR0H, and bits CCLR2 to CCLR0 in TCR0), bit NDER9 in NDERH, bit
SAE1*2 in DMABCRH, and bit P11DDR.
SAE1*2 0 1
TPU Channel
0 Setting Table
Below (1)
Table Below (2)
P11DDR — 0 1 1 —
NDER9 — — 0 1 —
Pin function TIOCB0
output P11
input P11
output PO9
output DACK1*2
output
TIOCB0 input*1
Notes: 1. TIOCB0 input when MD3 to MD0 = B'0000, and IOB3 to IOB0 =
B'10xx.
2. The DMAC and the DACK1 pin function are not supported in the
H8S/2321.
TPU Channel
0 Setting
(2)
(1)
(2)
(2)
(1)
(2)
MD3 to MD0 B'0000 B'0010 B'0011
IOB3 to IOB0 B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
— B'xx00 Other than B'xx00
CCLR2 to
CCLR0 — — — — Other
than
B'010
B'010
Output
function — Output
compare
output
— — PWM
mode 2
output
—
x: Don’t care
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 362 of 1268
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Pin Selection Method and Pin Functions
P10/PO8/TIOCA0/
DACK0*2 The pin function is switched as shown below according to the combination of
the TPU channel 0 setting (by bits MD3 to MD0 in TMDR0, bits IOA3 to IOA0
in TIOR0H, and bits CCLR2 to CCLR0 in TCR0), bit NDER8 in NDERH, bit
SAE0*2 in DMABCRH, and bit P10DDR.
SAE0*2 0 1
TPU Channel
0 Setting Table
Below (1)
Table Below (2)
—
P10DDR — 0 1 1 —
NDER8 — — 0 1 —
Pin function TIOCA0
output P10
input P10
output PO8
output DACK0*2
output
TIOCA0 input*1
TPU Channel
0 Setting
(2)
(1)
(2)
(1)
(1)
(2)
MD3 to MD0 B'0000 B'001x B'0010 B'0011
IOA3 to IOA0 B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
B'xx00 Other than B'xx00
CCLR2 to
CCLR0 — — — — Other
than
B'001
B'001
Output
function — Output
compare
output
— PWM
mode 1
output*3
PWM
mode 2
output
—
x: Don’t care
Notes: 1. TIOCA0 input when MD3 to MD0 = B'0000, and IOA3 to IOA0 =
B'10xx.
2. The DMAC and the DACK0 pin function are not supported in the
H8S/2321.
3. TIOCB0 output is disabled.
Section 9 I/O Ports
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9.3 Port 2
9.3.1 Overview
Port 2 is an 8-bit I/O port. Port 2 pins also function as PPG output pins (PO7 to PO0), TPU I/O pins
(TIOCA3, TIOCB3, TIOCC3, TIOCD3, TIOCA4, TIOCB4, TIOCA5, and TIOCB5) and 8-bit timer
I/O pins (TMRI0, TMCI0, TMO0, TMRI1, TMCI1, TMO1). Port 2 pin functions are the same in all
operating modes. Port 2 uses Schmitt-triggered input.
Figure 9.2 shows the port 2 pin configuration.
P2
7
(I/O) / PO
7
(output) / TIOCB
5
(I/O) / TMO
1
(output)
P2
6
(I/O) / PO
6
(output) / TIOCA
5
(I/O) / TMO
0
(output)
P2
5
(I/O) / PO
5
(output) / TIOCB
4
(I/O) / TMCI
1
(input)
P2
4
(I/O) / PO
4
(output) / TIOCA
4
(I/O) / TMRI
1
(input)
P2
3
(I/O) / PO
3
(output) / TIOCD
3
(I/O) / TMCI
0
(input)
P2
2
(I/O) / PO
2
(output) / TIOCC
3
(I/O) / TMRI
0
(input)
P2
1
(I/O) / PO
1
(output) / TIOCB
3
(I/O)
P2
0
(I/O) / PO
0
(output) / TIOCA
3
(I/O)
Port 2
Port 2 pins
Figure 9.2 Port 2 Pin Functions
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 364 of 1268
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9.3.2 Register Configuration
Table 9.4 shows the port 2 register configuration.
Table 9.4 Port 2 Registers
Name Abbreviation R/W Initial Value Address*
Port 2 data direction register P2DDR W H'00 H'FEB1
Port 2 data register P2DR R/W H'00 H'FF61
Port 2 register PORT2 R Undefined H'FF51
Note: * Lower 16 bits of the address.
Port 2 Data Direction Register (P2DDR)
Bit : 7 6 5 4 3 2 1 0
P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR
Initial value : 0 0 0 0 0 0 0 0
R/W : W W W W W W W W
P2DDR is an 8-bit write -only register, the individual bits of whic h specify i nput or output for the
pins of port 2. P2DDR cannot be read ; if it is, an undefined value will be read.
Setting a P2DDR bit to 1 makes the corresp onding port 2 pin an output pin, while clearing the bit
to 0 makes the pin an inp ut pin.
P2DDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in
software standby mode.
Section 9 I/O Ports
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Port 2 Data Register (P2DR)
Bit : 7 6 5 4 3 2 1 0
P27DR P26DR P25DR P24DR P23DR P22DR P21DR P20DR
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
P2DR is an 8-bit readable/writable register that stores output data for the port 2 pins (P27 to P20).
P2DR is initialized to H'00 b y a reset, and in hardware standby mode. It retains its prio r state in
software standby mode.
Port 2 Register (PORT2)
Bit : 7 6 5 4 3 2 1 0
P27 P26 P25 P24 P23 P22 P21 P20
Initial value : —* —
* —
* —
* —
* —
* —
* —
*
R/W : R R R R R R R R
Note: * Determined by state of pins P27 to P20.
PORT2 is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of
output data for the port 2 pins (P27 to P20) must always be performed on P2DR.
If a port 2 read is performed while P2DDR bits are set to 1, the P2DR values are read. If a port 2
read is performed while P2DDR bits are cleared to 0, the pin states are read.
After a reset and in hardware standby mode, PORT2 contents are determined by the pin states, as
P2DDR and P2 DR are initiali zed. PORT2 retains its prior state in software standby mode.
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 366 of 1268
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9.3.3 Pin Functions
Port 2 pins also function as PPG output pins (PO7 to PO0) and TPU I/O pins (TIOCA3, TIOCB3,
TIOCC3, TIOCD3, TIOCA4, TIOCB4, TIOCA5, and TIOCB5), and 8-bit timer I/O pins (TMRI0,
TMCI0, TMO0, TMRI1, TMCI1, and TMO1). Port 2 pin functions are shown in table 9.5.
Table 9.5 Port 2 Pin Functions
Pin Selection Method and Pin Functions
P27/PO7/TIOCB5/
TMO1 The pin function is switched as shown below according to the combination of
the TPU channel 5 setting (by bits MD3 to MD0 in TMDR5, bits IOB3 to IOB0
in TIOR5, and bits CCLR1 and CCLR0 in TCR5), bit NDER7 in NDERL, bits
OS3 to OS0 in TCSR1, and bit P27DDR.
OS3 to OS0 All 0 Not all 0
TPU Channel
5 Setting Table
Below (1)
Table Below (2)
—
P27DDR — 0 1 1 —
NDER7 — — 0 1 —
Pin function TIOCB5
output P27
input P27
output PO7
output TMO1
output
TIOCB5 input*
Note: * TIOCB5 input when MD3 to MD0 = B'0000 or B'01xx, and IOB3 = 1.
TPU Channel
5 Setting
(2)
(1)
(2)
(2)
(1)
(2)
MD3 to MD0 B'0000, B'01xx B'0010 B'0011
IOB3 to IOB0 B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
— B'xx00 Other than B'xx00
CCLR1,
CCLR0 — — — — Other
than B'10 B'10
Output
function — Output
compare
output
— — PWM
mode 2
output
—
x: Don’t care
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 367 of 1268
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Pin Selection Method and Pin Functions
P26/PO6/TIOCA5/
TMO0 The pin function is switched as shown below according to the combination of
the TPU channel 5 setting (by bits MD3 to MD0 in TMDR5, bits IOA3 to IOA0
in TIOR5, and bits CCLR1 and CCLR0 in TCR5), bit NDER6 in NDERL, bits
OS3 to OS0 in TCSR0, and bit P26DDR.
OS3 to OS0 All 0 Not all 0
TPU Channel
5 Setting Table
Below (1)
Table Below (2)
—
P26DDR — 0 1 1 —
NDER6 — — 0 1 —
Pin function TIOCA5
output P26
input P26
output PO6
output TMO0
output
TIOCA5 input*1
TPU Channel
5 Setting
(2)
(1)
(2)
(1)
(1)
(2)
MD3 to MD0 B'0000, B'01xx B'001x B'0010 B'0011
IOA3 to IOA0 B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
B'xx00 Other than B'xx00
CCLR1,
CCLR0 — — — — Other
than B'01 B'01
Output
function — Output
compare
output
— PWM
mode 1
output*2
PWM
mode 2
output
—
x: Don’t care
Notes: 1. TIOCA5 input when MD3 to MD0 = B'0000 or B'01xx, and IOA3 = 1.
2. TIOCB5 output is disabled.
Section 9 I/O Ports
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Pin Selection Method and Pin Functions
P25/PO5/TIOCB4/
TMCI1 This pin is used as the 8-bit timer external clock input pin when an external
clock is selected with bits CKS2 to CKS0 in TCR1.
The pin function is switched as shown below according to the combination of
the TPU channel 4 setting (by bits MD3 to MD0 in TMDR4, bits IOB3 to IOB0
in TIOR4, and bits CCLR1 and CCLR0 in TCR4), bit NDER5 in NDERL, and bit
P25DDR.
TPU Channel
4 Setting
Table Below (1)
Table Below (2)
P25DDR — 0 1 1
NDER5 — — 0 1
Pin function TIOCB4 output P25
input P25
output PO5
output
TIOCB4 input*
TMCI1 input
Note: * TIOCB4input when MD3 to MD0 = B'0000 or B'01xx, and IOB3 to IOB0
= B'10xx.
TPU Channel
4 Setting
(2)
(1)
(2)
(2)
(1)
(2)
MD3 to MD0 B'0000, B'01xx B'0010 B'0011
IOB3 to IOB0 B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
— B'xx00 Other than B'xx00
CCLR1,
CCLR0 — — — — Other
than B'10 B'10
Output
function — Output
compare
output
— — PWM
mode 2
output
—
x: Don’t care
Section 9 I/O Ports
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Pin Selection Method and Pin Functions
P24/PO4/TIOCA4/
TMRI1 This pin is used as the 8-bit timer counter reset pin when bits CCLR1 and
CCLR0 in TCR1 are both set to 1.
The pin function is switched as shown below according to the combination of
the TPU channel 4 setting (by bits MD3 to MD0 in TMDR4, bits IOA3 to IOA0
in TIOR4, and bits CCLR1 and CCLR0 in TCR4), bit NDER4 in NDERL, and bit
P24DDR.
TPU Channel
4 Setting
Table Below (1)
Table Below (2)
P24DDR — 0 1 1
NDER4 — — 0 1
Pin function TIOCA4 output P24
input P24
output PO4
output
TIOCA4 input*1
TMRI1 input
TPU Channel
4 Setting
(2)
(1)
(2)
(1)
(1)
(2)
MD3 to MD0 B'0000, B'01xx B'001x B'0010 B'0011
IOA3 to IOA0 B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
B'xx00 Other than B'xx00
CCLR1,
CCLR0 — — — — Other
than B'01 B'01
Output
function — Output
compare
output
— PWM
mode 1
output*2
PWM
mode 2
output
—
x: Don’t care
Notes: 1. TIOCA4 input when MD3 to MD0 = B'0000 or B'01xx, and IOA3 to
IOA0 = B'10xx.
2. TIOCB4 output is disabled.
Section 9 I/O Ports
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Pin Selection Method and Pin Functions
P23/PO3/TIOCD3/
TMCI0 This pin is used as the 8-bit timer external clock input pin when an external
clock is selected with bits CKS2 to CKS0 in TCR0.
The pin function is switched as shown below according to the combination of
the TPU channel 3 setting (by bits MD3 to MD0 in TMDR3, bits IOD3 to IOD0
in TIOR3L, and bits CCLR2 to CCLR0 in TCR3), bit NDER3 in NDERL, and bit
P23DDR.
TPU Channel
3 Setting
Table Below (1)
Table Below (2)
P23DDR — 0 1 1
NDER3 — — 0 1
Pin function TIOCD3 output P23
input P23
output PO3
output
TIOCD3 input*
TMCI0 input
Note: * TIOCD3 input when MD3 to MD0 = B'0000, and IOD3 to IOD0 = B'10xx.
TPU Channel
3 Setting
(2)
(1)
(2)
(2)
(1)
(2)
MD3 to MD0 B'0000 B'0010 B'0011
IOD3 to IOD0 B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
— B'xx00 Other than B'xx00
CCLR2 to
CCLR0 — — — — Other
than
B'110
B'110
Output
function — Output
compare
output
— — PWM
mode 2
output
—
x: Don’t care
Section 9 I/O Ports
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Pin Selection Method and Pin Functions
P22/PO2/TIOCC3/
TMRI0 This pin is used as the 8-bit timer counter reset pin when bits CCLR1 and
CCLR0 in TCR0 are both set to 1.
The pin function is switched as shown below according to the combination of
the TPU channel 3 setting (by bits MD3 to MD0 in TMDR3, bits IOC3 to IOC0
in TIOR3L, and bits CCLR2 to CCLR0 in TCR3), bit NDER2 in NDERL, and bit
P22DDR.
TPU Channel
3 Setting
Table Below (1)
Table Below (2)
P22DDR — 0 1 1
NDER2 — — 0 1
Pin function TIOCC3 output P22
input P22
output PO2
output
TIOCC3 input*1
TMRI0 input
TPU Channel
3 Setting
(2)
(1)
(2)
(1)
(1)
(2)
MD3 to MD0 B'0000 B'001x B'0010 B'0011
IOC3 to IOC0 B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
B'xx00 Other than B'xx00
CCLR2 to
CCLR0 — — — — Other
than
B'101
B'101
Output
function — Output
compare
output
— PWM
mode 1
output*2
PWM
mode 2
output
—
x: Don’t care
Notes: 1. TIOCC3 input when MD3 to MD0 = B'0000, and IOC3 to IOC0 =
B'10xx.
2. TIOCD3 output is disabled.
When BFA = 1 or BFB = 1 in TMDR3, output is disabled and setting
(2) applies.
Section 9 I/O Ports
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Pin Selection Method and Pin Functions
P21/PO1/TIOCB3 The pin function is switched as shown below according to the combination of
the TPU channel 3 setting (by bits MD3 to MD0 in TMDR3, bits IOB3 to IOB0
in TIOR3H, and bits CCLR2 to CCLR0 in TCR3), bit NDER1 in NDERL, and bit
P21DDR.
TPU Channel
3 Setting
Table Below (1)
Table Below (2)
P21DDR — 0 1 1
NDER1 — — 0 1
Pin function TIOCB3 output P21
input P21
output PO1
output
TIOCB3 input*
Note: * TIOCB3 input when MD3 to MD0 = B'0000, and IOB3 to IOB0 = B'10xx.
TPU Channel
3 Setting
(2)
(1)
(2)
(2)
(1)
(2)
MD3 to MD0 B'0000 B'0010 B'0011
IOB3 to IOB0 B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
— B'xx00 Other than B'xx00
CCLR2 to
CCLR0 — — — — Other
than
B'010
B'010
Output
function — Output
compare
output
— — PWM
mode 2
output
—
x: Don’t care
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 373 of 1268
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Pin Selection Method and Pin Functions
P20/PO0/TIOCA3 The pin function is switched as shown below according to the combination of
the TPU channel 3 setting (by bits MD3 to MD0 in TMDR3, bits IOA3 to IOA0
in TIOR3H, and bits CCLR2 to CCLR0 in TCR3), bit NDER0 in NDERL, and bit
P20DDR.
TPU Channel
3 Setting
Table Below (1)
Table Below (2)
P20DDR — 0 1 1
NDER0 — — 0 1
Pin function TIOCA3 output P20
input P20
output PO0
output
TIOCA3 input*1
TPU Channel
3 Setting
(2)
(1)
(2)
(1)
(1)
(2)
MD3 to MD0 B'0000 B'001x B'0010 B'0011
IOA3 to IOA0 B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
B'xx00 Other than B'xx00
CCLR2 to
CCLR0 — — — — Other
than
B'001
B'001
Output
function — Output
compare
output
— PWM
mode 1
output*2
PWM
mode 2
output
—
x: Don’t care
Notes: 1. TIOCA3 input when MD3 to MD0 = B'0000, and IOA3 to IOA0 =
B'10xx.
2. TIOCB3 output is disabled.
Section 9 I/O Ports
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9.4 Port 3
9.4.1 Overview
Port 3 is a 6-bit I/O port. Port 3 pins also function as SCI I/O pins (TxD0, RxD0, SCK0, TxD1,
RxD1, and SCK1). Port 3 pin functions are the same in all operating modes.
Figure 9.3 shows the port 3 pin configuration.
P3
5
(I/O) / SCK
1
(I/O)
P3
4
(I/O) / SCK
0
(I/O)
P3
3
(I/O) / RxD
1
(input)
P3
2
(I/O) / RxD
0
(input)
P3
1
(I/O) / TxD
1
(output)
P3
0
(I/O) / TxD
0
(output)
Port 3 pins
Port 3
Figure 9.3 Port 3 Pin Functions
9.4.2 Register Configuration
Table 9.6 shows the port 3 register configuration.
Table 9.6 Port 3 Registers
Name Abbreviation R/W Initial Value*2 Address*1
Port 3 data direction register P3DDR W H'00 H'FEB2
Port 3 data register P3DR R/W H'00 H'FF62
Port 3 register PORT3 R Undefined H'FF52
Port 3 open drain control register P3ODR R/W H'00 H'FF76
Notes: 1. Lower 16 bits of the address.
2. Value of bits 5 to 0.
Section 9 I/O Ports
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Port 3 Data Direction Register (P3DDR)
Bit : 7 6 5 4 3 2 1 0
— — P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR
Initial value : Undefined Undefined 0 0 0 0 0 0
R/W : — — W W W W W W
P3DDR is an 8-bit write -only register, the individual bits of whic h specify i nput or output for the
pins of port 3. Bits 7 and 6 are reserved. P3DDR cannot be read; if it is, an u ndefined val u e will be
read.
Setting a P3DDR bit to 1 makes the corresp onding port 3 pin an output pin, while clearing the bit
to 0 makes the pin an inp ut pin.
P3DDR is initialized to H'00 (b its 5 to 0) by a reset, and in hardware standby mode. It retains its
prior state in software standby mode. As the SCI is initialized, the pin states are determined by the
P3DDR and P3DR specifications.
Port 3 Data Register (P3DR)
Bit : 7 6 5 4 3 2 1 0
— — P35DR P34DR P33DR P32DR P31DR P30DR
Initial value : Undefined Undefined 0 0 0 0 0 0
R/W : — — R/W R/W R/W R/W R/W R/W
P3DR is an 8-bit readable/writable register that stores output data for the port 3 pins (P35 to P30).
Bits 7 and 6 are reserved; they return an undefined value if read, and cannot be modified.
P3DR is initialized to H'00 (b its 5 to 0) by a reset, and in hardware standby mode. It retains its
prior state in software standby mode.
Section 9 I/O Ports
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Port 3 Register (PORT3)
Bit : 7 6 5 4 3 2 1 0
— — P35 P34 P33 P32 P31 P30
Initial value : Undefined Undefined —* —
* —
* —
* —
* —
*
R/W : — — R R R R R R
Note: * Determined by state of pins P35 to P30.
PORT3 is an 8-bit read-only register that shows the pin states. W r iting o f output data for the port 3
pins (P35 to P30) must always be performed on P3DR.
Bits 7 and 6 are reserved; they return an undefined value if read, and cannot be modified.
If a port 3 read is performed while P3DDR bits are set to 1, the P3DR values are read. If a port 3
read is performed while P3DDR bits are cleared to 0, the pin states are read.
After a reset and in hardware standby mode, PORT3 contents are determined by the pin states, as
P3DDR and P3 DR are initiali zed. PORT3 retains its prior state in software standby mode.
Port 3 Open Drain Control Register (P3ODR)
Bit : 7 6 5 4 3 2 1 0
— — P35ODR P34ODR P33ODR P32ODR P31ODR P30ODR
Initial value : Undefined Undefined 0 0 0 0 0 0
R/W : — — R/W R/W R/W R/W R/W R/W
P3ODR is an 8-bit readable/writable register that controls the PMOS on/off status for each port 3
pin (P35 to P30).
Bits 7 and 6 are reserved; they return an undefined value if read, and cannot be modified.
Setting a P3ODR bit to 1 makes the corresp onding port 3 pin an NMOS open-drain output pin,
while clearing the bit to 0 makes the pin a CMOS output pin.
P3ODR is initialized to H'00 (b its 5 to 0) by a reset, and in hardware standby mode. It retains its
prior state in software standby mode.
Section 9 I/O Ports
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9.4.3 Pin Functions
Port 3 pins also function as SCI I/O pins (TxD0, RxD0, SCK0, TxD1, RxD1, and SCK1). Port 3 pin
functio ns are shown in ta ble 9.7 .
Table 9.7 Port 3 Pin Functions
Pin Selection Method and Pin Functions
P35/SCK1 The pin function is switched as shown below according to the combination of
bit C/A in the SCI1 SMR, bits CKE0 and CKE1 in SCR, and bit P35DDR.
CKE1 0 1
C/A 0 1 —
CKE0 0 1 — —
P35DDR 0 1 — — —
Pin function P35
input pin P35
output pin*SCK1
output pin*SCK1
output pin* SCK1
input pin
Note: * When P35ODR = 1, the pin becomes an NMOS open-drain output.
P34/SCK0 The pin function is switched as shown below according to the combination of
bit C/A in the SCI0 SMR, bits CKE0 and CKE1 in SCR, and bit P34DDR.
CKE1 0 1
C/A 0 1 —
CKE0 0 1 — —
P34DDR 0 1 — — —
Pin function P34
input pin P34
output pin*SCK0
output pin*SCK0
output pin* SCK0
input pin
Note: * When P34ODR = 1, the pin becomes an NMOS open-drain output.
Section 9 I/O Ports
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Pin Selection Method and Pin Functions
P33/RxD1 The pin function is switched as shown below according to the combination of
bit RE in the SCI1 SCR, and bit P33DDR.
RE 0 1
P33DDR 0 1 —
Pin function P33 input pin P33 output pin* RxD1 input pin
Note: * When P33ODR = 1, the pin becomes an NMOS open-drain output.
P32/RxD0 The pin function is switched as shown below according to the combination of
bit RE in the SCI0 SCR, and bit P32DDR.
RE 0 1
P32DDR 0 1 —
Pin function P32 input pin P32 output pin* RxD0 input pin
Note: * When P32ODR = 1, the pin becomes an NMOS open-drain output.
P31/TxD1 The pin function is switched as shown below according to the combination of
bit TE in the SCI1 SCR, and bit P31DDR.
TE 0 1
P31DDR 0 1 —
Pin function P31 input pin P31 output pin* TxD1 output pin
Note: * When P31ODR = 1, the pin becomes an NMOS open-drain output.
P30/TxD0 The pin function is switched as shown below according to the combination of
bit TE in the SCI0 SCR, and bit P30DDR.
TE 0 1
P30DDR 0 1 —
Pin function P30 input pin P30 output pin* TxD0 output pin
Note: * When P30ODR = 1, the pin becomes an NMOS open-drain output.
Section 9 I/O Ports
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9.5 Port 4
9.5.1 Overview
Port 4 is an 8-bit input-only port. Port 4 pins also function as A/D converter analog input pins
(AN0 to AN7) and D/A converter analog output pins (DA0 and DA1). Port 4 pin functi ons are the
same in all operating modes. Figure 9.4 shows the port 4 pin configuration.
P4
7
(input) / AN
7
(input) / DA
1
(output)
P4
6
(input) / AN
6
(input) / DA
0
(output)
P4
5
(input) / AN
5
(input)
P4
4
(input) / AN
4
(input)
P4
3
(input) / AN
3
(input)
P4
2
(input) / AN
2
(input)
P4
1
(input) / AN
1
(input)
P4
0
(input) / AN
0
(input)
Port 4 pins
Port 4
Figure 9.4 Port 4 Pin Functions
Section 9 I/O Ports
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9.5.2 Register Configuration
Table 9.8 shows the port 4 register configuration. Port 4 is an input-only port, and does not have a
data direction register or data register.
Table 9.8 Port 4 Register
Name Abbreviation R/W Initial Value Address*
Port 4 register PORT4 R Undefined H'FF53
Note: * Lower 16 bits of the address.
Port 4 Register (PORT4): The pin states are always read when a port 4 read is performed.
Bit : 7 6 5 4 3 2 1 0
P47 P46 P45 P44 P43 P42 P41 P40
Initial value : —* —
* —
* —
* —
* —
* —
* —
*
R/W : R R R R R R R R
Note: * Determined by state of pins P47 to P40.
9.5.3 Pin Functions
Port 4 pins also function as A/D converter analog input pins (AN0 to AN7) and D/A converter
analog output pins (DA0 and DA1).
Section 9 I/O Ports
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9.6 Port 5
9.6.1 Overview
Port 5 is a 4-bit I/O port. Port 5 pins also function as SCI I/O pins (TxD2, RxD2, and SCK2), the
A/D c onver t er input pin (ADTRG), interrupt input pins (IRQ4 to IRQ7), and bus control signal I/O
pins (WAIT and BREQO). The pin functions can be switched by means of settings in PFCR2 and
SYSCR. IRQ4 to IRQ7 only are Schmitt-triggered inputs. Figure 9.5 shows the port 5 pin
configuration.
P53 (I/O) / ADTRG (input) / IRQ7 (input) / WAIT (input) / BREQO (output)
P52 (I/O) / SCK2 (I/O) / IRQ6 (input)
P51 (I/O) / RxD2 (input) / IRQ5 (input)
P50 (I/O) / TxD2 (output) /IRQ4 (input)
Port 5 pins
Pin functions in mode 7
P53 (I/O) / ADTRG (input) / IRQ7 (input)
P52 (I/O) / SCK2 (I/O) / IRQ6 (input)
P51 (I/O) / RxD2 (input) / IRQ5 (input)
P50 (I/O) / TxD2 (output) / IRQ4 (input)
Pin functions in modes 4 to 6
P53 (I/O) / ADTRG (input) / IRQ7 (input) / WAIT (input) / BREQO (output)
P52 (I/O) / SCK2 (I/O) / IRQ6 (input)
P51 (I/O) / RxD2 (input) / IRQ5 (input)
P50 (I/O) / TxD2 (output) / IRQ4 (input)
Port 5
Figure 9.5 Port 5 Pin Functions
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 382 of 1268
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9.6.2 Register Configuration
Table 9.9 shows the port 5 register configuration.
Table 9.9 Port 5 Registers
Name Abbreviation R/W Initial Value Address*1
Port 5 data direction register P5DDR W H'0*2 H'FEB4
Port 5 data register P5DR R/W H'0*2 H'FF64
Port 5 register PORT5 R Undefined H'FF54
Port function control register 2 PFCR2 R/W H'30 H'FFAC
System control regi ster SYSCR R/W H'01 H'FF39
Notes: 1. Lower 16 bits of the address.
2. Value of bits 3 to 0.
Port 5 Data Direction Register (P5DDR)
Bit : 7 6 5 4 3 2 1 0
— — — — P53DDR P52DDR P51DDR P50DDR
Initial value : Undefined Undefined Undefined Undefined 0 0 0 0
R/W : — — — — W W W W
P5DDR is an 8-bit write -only register, the individual bits of whic h specify i nput or output for the
pins of port 5. Bits 7 to 4 are reserved. P5DDR cannot be read; if it is, an undefined value will be
read.
Setting a P5DDR bit to 1 makes the corresp onding port 5 pin an output pin, while clearing the bit
to 0 makes the pin an inp ut pin.
P5DDR is initialized to H'0 (bits 3 to 0) by a reset, and in hardware standby mode. It retains its
prior state in software standby mode. As the SCI is initialized, the pin states are determined by the
P5DDR and P5DR specifications.
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Port 5 Data Register (P5DR)
Bit : 7 6 5 4 3 2 1 0
— — — — P53DR P52DR P51DR P50DR
Initial value : Undefined Undefined Undefined Undefined 0 0 0 0
R/W : — — — — R/W R/W R/W R/W
P5DR is an 8-bit readable/writable register that stores output data for the port 5 pins (P53 to P50).
Bits 7 to 4 are reserved; they return an undefined value if read, and cannot be modified.
P5DR is initialized to H'0 (bits 3 to 0) by a reset, and in hardware standb y mode. It retains its prio r
state in software standby mode.
Port 5 Register (PORT5)
Bit : 7 6 5 4 3 2 1 0
— — — — P53 P52 P51 P50
Initial value : Undefined Undefined Undefined Undefined —* —
* —
* —
*
R/W : — — — — R R R R
Note: * Determined by state of pins P53 to P50.
PORT5 is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of
output data for the port 5 pins (P53 to P50) must always be performed on P5DR.
Bits 7 to 4 are reserved; they return an undefined value if read, and cannot be modified.
If a port 5 read is performed while P5DDR bits are set to 1, the P5DR values are read. If a port 5
read is performed while P5DDR bits are cleared to 0, the pin states are read.
After a reset and in hardware standby mode, PORT5 contents are determined by the pin states, as
P5DDR and P5 DR are initiali zed. PORT5 retains its prior state in software standby mode.
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Port Function Control Register 2 (PFCR2)
Bit : 7 6 5 4 3 2 1 0
WAITPS BREQOPS CS167E CS25E ASOD — — —
Initial value : 0 0 1 1 0 0 0 0
R/W : R/W R/W R/W R/W R/W R R R
PFCR2 is an 8-bit readab le/writable register that performs I/O port control. PFCR2 is initi alized to
H'30 by a reset, and in hardware standby mode.
Bit 7—WAIT Pin Select (WAITPS): Selects the WAIT input pin. Set the WAITPS bit before
setting the DDR bit clear to 0 and the WAITE bit in BCRL to 1.
Bit 7
WAITPS
Description
0 WAIT input is PF2 pin (Initial value)
1 WAIT input is P53 pin
Bit 6—BREQO Pin Select (BREQOPS): Selects the BREQO output pin. Set the BREQOPS bit
before setting the BREQOE bit in BCRL to 1.
Bit 6
BREQOPS
Description
0 BREQO output is PF2 pin (Initial value)
1 BREQO output is P53 pin
Bit 5—CS167 Enable (CS167E): Enables or disables CS1, CS6, and CS7 output. For details, see
section 9.7, Port 6, and section 9.14, Port G.
Bit 4—CS25 Enable (CS25E): Enables or disables CS2, CS3, CS4, and CS5 output. For details,
see section 9.7, Port 6, and section 9.14, Port G.
Bit 3—AS Output Disable (ASOD): Enables or disables AS output. For details, see section 9.13,
Port F.
Section 9 I/O Ports
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System Control Register (SYSCR)
Bit : 7 6 5 4 3 2 1 0
— — INTM1 INTM0 NMIEG LWROD IRQPAS RAME
Initial value : 0 0 0 0 0 0 0 1
R/W : R/W — R/W R/W R/W R/W R/W R/W
SYSCR is an 8-bit readable/writable register that selects the interrupt control mode, controls the
LWR pin, switc hes the IRQ4 to IRQ7 input pins, and selects the detected edge for NMI. SYSCR is
initialized to H'01 by a reset, and in hardware standb y mode. It is not initialized in software
standby mode.
Bits 5 and 4—Interrupt Cont rol Mode 1 and 0 (INTM1, INTM0): These bits select either of
two interrupt control modes for the interrupt controller. For details, see section 5, Interrupt
Controller.
Bit 3—NMI Edge Select (NMIEG): Selects the input edge for the NMI pin. For details, see
section 5, Interrupt Controller.
Bit 2—LWR Output Disable (LWROD): Enables or disables LWR output. For details, see
section 9.13, Port F.
Bit 1—IRQ Port Switching Select (IRQPAS): Selects switching of input pins for IRQ4 to IRQ7.
IRQ4 to IRQ7 input is always performed from one of the ports.
Bit 1
IRQPAS
Description
0 PA4 to PA7 used for IRQ4 to IRQ7 input (Initial value)
1 P50 to P53 used for IRQ4 to IRQ7 input
Bit 0—RAM Enable (RAME): Enables or disables on-chip RAM. For details, see section 18,
RAM.
Section 9 I/O Ports
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9.6.3 Pin Functions
Port 5 pins also function as SCI I/O pins (TxD2, RxD2, and SCK2), the A/D converter input pin
(ADTRG), interrupt input pins (IRQ4 to IRQ7), and bus control signal I/O pins (WAIT and
BREQO). Port 5 pin functions are shown in table 9.10.
Table 9.10 Port 5 Pin Functions
Pin Selection Method and Pin Functions
P53/ADTRG/
IRQ7/WAIT/
BREQO
The pin function is switched as shown below according to the combination of
the operating mode, bits TRGS1 and TRGS0 in the A/D control register
(ADCR), and bits IRQPAS, WAITE, WAITPS, BREQOE, BREQOPS, and
P53DDR.
Operating m ode Modes 4 t o 6 Mode 7
[BREQOE ·
BREQOPS] 0 1 —
[WAITE ·
WAITPS] 0 1 0 1 —
P53DDR 0 1 0 1 — — 0 1
Pin function P53
input
pin
P53
output
pin
WAIT
input
pin
Setting
pro-
hibited
BREQO
output
pin
Setting
pro-
hibited
P53
input
pin
P53
output
pin
ADTRG input pin*1
IRQ7 interrupt input pin*2
Notes: 1. ADTRG input when TRGS0 = TRGS1 = 1.
2. IRQ7 input when IRQPAS = 1.
P52/SCK2/IRQ6 The pin function is switched as shown below according to the combination of
bit C/A in the SCI2 SMR, bits CKE0 and CKE1 in SCR, and bits IRQPAS and
P52DDR.
CKE1 0 1
C/A 0 1 —
CKE0 0 1 — —
P52DDR 0 1 — — —
Pin function P52
input pin P52
output pin SCK2
output pin SCK2
output pin SCK2
input pin
IRQ6 interrupt input pin*
Note: * IRQ6 input when IRQPAS = 1.
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Pin Selection Method and Pin Functions
P51/RxD2/IRQ5 The pin function is switched as shown below according to the combination of
bit RE in the SCI2 SCR, and bits IRQPAS and P51DDR.
RE 0 1
P51DDR 0 1 —
Pin function P51 input pin P51 output pin RxD2 input pin
IRQ5 interrupt input pin*
Note: * IRQ5 input when IRQPAS = 1.
P50/TxD2/IRQ4 The pin function is switched as shown below according to the combination of
bit TE in the SCI2 SCR, and bits IRQPAS and P50DDR.
TE 0 1
P50DDR 0 1 —
Pin function P50 input pin P50 output pin TxD2 output pin
IRQ4 interrupt input pin*
Note: * IRQ4 input when IRQPAS = 1.
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9.7 Port 6
9.7.1 Overview
Port 6 is an 8-bit I/O port. Port 6 pins also function as interrupt input pins (IRQ0 to IRQ3),
DMAC* I/O pins (DREQ0, TEND0, DREQ1, and TEND1), and bus control output pins (CS4 to
CS7). The functions of pins P65 to P62 are the same in all operating modes, while the functions of
pins P67, P66, P61, and P60 change according to the operating mode. Switching of CS4 to CS7
output can be performed by setting PFCR2. Pins P67 to P64 are Schmitt-triggered inputs. Figure
9.6 shows the port 6 pin configuration.
Note: * The DMAC is not supported in the H8S/2321.
P6
7
/ IRQ
3
/ CS
7
P6
6
/ IRQ
2
/ CS
6
P6
5
/ IRQ
1
P6
4
/ IRQ
0
P6
3
/ TEND
1
P6
2
/ DREQ
1
P6
1
/ TEND
0
/ CS
5
P6
0
/ DREQ
0
/ CS
4
Port 6 pins
P6
7
(I/O) / IRQ
3
(input)
P6
6
(I/O) / IRQ
2
(input)
P6
5
(I/O) / IRQ
1
(input)
P6
4
(I/O) / IRQ
0
(input)
P6
3
(I/O) / TEND
1
* (output)
P6
2
(I/O) / DREQ
1
* (input)
P6
1
(I/O) / TEND
0
* (output)
P6
0
(I/O) / DREQ
0
* (input)
Pin functions in mode 7
P6
7
(I/O) / IRQ
3
(input) / CS
7
(output)
P6
6
(I/O) / IRQ
2
(input) / CS
6
(output)
P6
5
(I/O) / IRQ
1
(input)
P6
4
(I/O) / IRQ
0
(input)
P6
3
(I/O) / TEND
1
* (output)
P6
2
(I/O) / DREQ
1
* (input)
P6
1
(I/O) / TEND
0
* (output) / CS
5
(output)
P6
0
(I/O) / DREQ
0
* (input) / CS
4
(output)
Pin functions in modes 4 to 6
Port 6
Note: * The TEND
1
, DREQ
1
, TEND
0
, and DREQ
0
pin functions are not supported in the H8S/2321.
Figure 9.6 Port 6 Pin Functions
Section 9 I/O Ports
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9.7.2 Register Configuration
Table 9.11 shows the port 6 register configuration.
Table 9.11 Port 6 Registers
Name Abbreviation R/W Initial Value Address*
Port 6 data direction register P6DDR W H'00 H'FEB5
Port 6 data register P6DR R/W H'00 H'FF65
Port 6 register PORT6 R Undefined H'FF55
Port function control register 2 PFCR2 R/W H'30 H'FFAC
Note: * Lower 16 bits of the address.
Port 6 Data Direction Register (P6DDR)
Bit : 7 6 5 4 3 2 1 0
P67DDR P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR
Initial value : 0 0 0 0 0 0 0 0
R/W : W W W W W W W W
P6DDR is an 8-bit write -only register, the individual bits of whic h specify i nput or output for the
pins of port 6. P6DDR cannot be read ; if it is, an undefined value will be read.
Setting a P6DDR bit to 1 makes the corresp onding port 6 pin an output pin, while clearing the bit
to 0 makes the pin an inp ut pin.
P6DDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in
software standby mode.
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Port 6 Data Register (P6DR)
Bit : 7 6 5 4 3 2 1 0
P67DR P66DR P65DR P64DR P63DR P62DR P61DR P60DR
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
P6DR is an 8-bit readable/writable register that stores output data for the port 6 pins (P67 to P60).
P6DR is initialized to H'00 b y a reset, and in hardware standby mode. It retains its prio r state in
software standby mode.
Port 6 Register (PORT6)
Bit : 7 6 5 4 3 2 1 0
P67 P66 P65 P64 P63 P62 P61 P60
Initial value : —* —
* —
* —
* —
* —
* —
* —
*
R/W : R R R R R R R R
Note: * Determined by state of pins P67 to P60.
PORT6 is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of
output data for the port 6 pins (P67 to P60) must always be performed on P6DR.
If a port 6 read is performed while P6DDR bits are set to 1, the P6DR values are read. If a port 6
read is performed while P6DDR bits are cleared to 0, the pin states are read.
After a reset and in hardware standby mode, PORT6 contents are determined by the pin states, as
P6DDR and P6 DR are initiali zed. PORT6 retains its prior state in software standby mode.
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Port Function Control Register 2 (PFCR2)
Bit : 7 6 5 4 3 2 1 0
WAITPS BREQOPS CS167E CS25E ASOD — — —
Initial value : 0 0 1 1 0 0 0 0
R/W : R/W R/W R/W R/W R/W R R R
PFCR2 is an 8-bit readab le/writable register that performs I/O port control. PFCR2 is initi alized to
H'30 by a reset, and in hardware standby mode.
Bit 7—WAIT Pin Select (WAITPS) : Selects the WAIT i nput pin. For details, see section 9.6,
Port 5.
Bit 6—BREQO Pin Select (BREQOPS): Selects the BREQO output pin. For details, see section
9.6, Port 5.
Bit 5—CS167 Enable (CS167E): Enables or disables CS1, CS6, and CS7 output. Clear the DDR
bits to 0 before changing the CS167E bit setting.
Bit 5
CS167E
Description
0 CS1, CS6, and CS7 output disabled (can be used as I/O ports)
1 CS1, CS6, and CS7 output enabled (Initial value)
Bit 4—CS25 Enable (CS25E): Enables or disables CS2, CS3, CS4, and CS5 output. Clear the
DDR bits to 0 before changi ng the CS25E bit setting.
Bit 4
CS25E
Description
0 CS2, CS3, CS4, and CS5 output disabled (can be used as I/O ports)
1 CS2, CS3, CS4, and CS5 output enabled (Initial value)
Bit 3—As Output Disable (ASOD): Enables or disables AS output. For details, see section 9.1 3,
Port F.
Bits 2 to 0—Reserved: These bits are always read as 0.
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9.7.3 Pin Functions
Port 6 pins also function as interrupt input pins (IRQ0 to IRQ3), DMAC I/O pins (DREQ0, TEND0,
DREQ1, and TEND1)*, and bus control output pins (CS4 to CS7). Port 6 pin functions are shown in
table 9.12.
Table 9.12 Port 6 Pin Functions
Pin Selection Method and Pin Functions
P67/IRQ3/CS7 The pin function is switched as shown below according to the combination of
bits P67DDR and CS167E.
Mode Modes 4 to 6 Mode 7
P67DDR 0 1 0 1
CS167E — 0 1 — —
Pin function P67 input
pin P67 output
pin CS7 output
pin P67 input
pin P67 output
pin
IRQ3 interrupt input pin
P66/IRQ2/CS6 The pin function is switched as shown below according to the combination of
bits P66DDR and CS167E.
Mode Modes 4 to 6 Mode 7
P66DDR 0 1 0 1
CS167E — 0 1 — —
Pin function P66 input
pin P66 output
pin CS6 output
pin P66 input
pin P66 output
pin
IRQ2 interrupt input pin
P65/IRQ1 The pin function is switched as shown below according to bit P65DDR.
P65DDR 0 1
Pin function P65 input pin P65 output pin
IRQ1 interrupt input pin
P64/IRQ0 The pin function is switched as shown below according to bit P64DDR.
P64DDR 0 1
Pin function P64 input pin P64 output pin
IRQ0 interrupt input pin
Section 9 I/O Ports
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Pin Selection Method and Pin Functions
P63/TEND1* The pin function is switched as shown below according to the combination of
bit TEE1* in the DMAC DMATCR, and bit P63DDR.
TEE1* 0 1
P63DDR 0 1 —
Pin function P63 input pin P63 output pin TEND1 output*
P62/DREQ1* The pin function is switched as shown below according to bit P62DDR.
P62DDR 0 1
Pin function P62 input pin P62 output pin
DREQ1 input*
P61/TEND0*/CS5 The pin function is switched as shown below according to the combination of
bit TEE0* in the DMAC DMATCR, and bits P61DDR and CS25E.
Mode Modes 4 to 6 Mode 7
TEE0* 0 1 0 1
P61DDR 0 1 — 0 1 —
CS25E — 0 1 — — — —
Pin function P61
input
pin
P61
output
pin
CS5
output
pin
TEND0
output*P61
input
pin
P61
output
pin
TEND0
output*
P60/DREQ0*/CS4 The pin function is switched as shown below according to the combination of
bits P60DDR and CS25E.
Mode Modes 4 to 6 Mode 7
P60DDR 0 1 0 1
CS25E — 0 1 — —
Pin function P60 input
pin P60 output
pin CS4 output
pin P60 input
pin P60 output
pin
DREQ0 input*
Note: * The DMAC and the TEND1, DREQ1, TEND0, and DREQ0 pin functions are not supported in
the H8S/2321.
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9.8 Port A
9.8.1 Overview
Port A is an 8-bit I/O port. Port A pins also function as address bus outputs and interrupt input
pins (IRQ4 to IRQ7). The pin functions change according to the operating mode. IRQ4 to IRQ7
input can be switched to P50 to P53 by setting the IRQPAS bit in SYSCR to 1. The address output
or port output function can be selected by means of bits A23E to A20E in PFCR1.
Port A has a built-in MOS input pull-up function that can be controlled by software. Pins PA7 to
PA4 are Schmitt-triggered inputs.
Figure 9.7 shows the port A pin configuration.
PA
7
/ A
23
/ IRQ
7
PA
6
/ A
22
/ IRQ
6
PA
5
/ A
21
/ IRQ
5
PA
4
/ A
20
/ IRQ
4
PA
3
/ A
19
PA
2
/ A
18
PA
1
/ A
17
PA
0
/ A
16
PA
7
(I/O) / A
23
(output) / IRQ
7
(input)
PA
6
(I/O) / A
22
(output) / IRQ
6
(input)
PA
5
(I/O) / A
21
(output) / IRQ
5
(input)
PA
4
(output) / A
20
(output)
A
19
(output)
A
18
(output)
A
17
(output)
A
16
(output)
Port A pins Pin functions in modes 4 and 5
Pin functions in mode 6
PA
7
(I/O) / IRQ
7
(input)
PA
6
(I/O) / IRQ
6
(input)
PA
5
(I/O) / IRQ
5
(input)
PA
4
(I/O) / IRQ
4
(input)
PA
3
(I/O)
PA
2
(I/O)
PA
1
(I/O)
PA
0
(I/O)
Pin functions in mode 7
PA
7
(I/O) / A
23
(output) / IRQ
7
(input)
PA
6
(I/O) / A
22
(output) / IRQ
6
(input)
PA
5
(I/O) / A
21
(output) / IRQ
5
(input)
PA
4
(I/O) / A
20
(output) / IRQ
4
(input)
PA
3
(input) / A
19
(output)
PA
2
(input) / A
18
(output)
PA
1
(input) / A
17
(output)
PA
0
(input) / A
16
(output)
Port A
Figure 9.7 Port A Pin Functions
Section 9 I/O Ports
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9.8.2 Register Configuration
Table 9.13 shows the port A register configuration.
Table 9.13 Port A Registers
Name Abbreviation R/W Initial Value Address*
Port A data direction register PADDR W H'00 H'FEB9
Port A data register PADR R/W H'00 H'FF69
Port A register PORTA R Undefined H'FF59
Port A MOS pull-up control register PAPCR R/W H'00 H'FF70
Port A open drain control register PAODR R/W H'00 H'FF77
Port function control register 1 PFCR1 R/W H'0F H'FF45
System control regi ster SYSCR R/W H'01 H'FF39
Note: * Lower 16 bits of the address.
Port A Data Direction Register (PADDR)
Bit : 7 6 5 4 3 2 1 0
PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR
Initial value : 0 0 0 0 0 0 0 0
R/W : W W W W W W W W
PADDR is an 8-bit write-only register, the individual bits of which specify input or output for the
pins of port A. PADDR cannot be read; if it is, an undefined value will be read.
PADDR is initialized to H '00 b y a reset, and in hardware standby mode. It retains its prior state in
software standby mode. The OPE bit in SBYCR is used to select whether the address output pins
retain their output state or become high-impedance when a transition is made to software standby
mode.
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Port A Data Register (PADR)
Bit : 7 6 5 4 3 2 1 0
PA7DR PA6DR PA5DR PA4DR PA3DR PA2DR PA1DR PA0DR
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
PADR is an 8-bit readable/writable register that stores output data for the port A pins (PA7 to
PA0).
PADR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in
software standby mode.
Port A Register (PORTA)
Bit : 7 6 5 4 3 2 1 0
PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0
Initial value : —* —
* —
* —
* —
* —
* —
* —
*
R/W : R R R R R R R R
Note: * Determined by state of pins PA7 to PA0.
PORTA is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of
output data for the port A pins (PA7 to PA0) must always be performed on PADR.
If a port A read is performed while PADDR bits are set to 1, the PADR values are read. If a port A
read is performed while PADDR bits are cleared to 0, the pin states are read.
After a reset and in hardware standby mode, PORTA contents are determined by the pin states, as
PADDR and PADR are initialized. PORTA retains its prior state in software standby mode.
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Port A MOS Pull-Up Control Register (PAPCR)
Bit : 7 6 5 4 3 2 1 0
PA7PCR PA6PCR PA5PCR PA4PCR PA3PCR PA2PCR PA1PCR PA0PCR
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
PAPCR is an 8-bit readable/writable register that controls the MOS input pull -up function
incorporated into port A on an individual bit basis.
All the bits are valid in modes 6 and 7, and bits 7 to 5 are valid in modes 4 and 5. When a PADDR
bit is cleared to 0 (input port setting), setting the corresponding PAPCR bit to 1 turns on the MOS
input pull-up for the corresponding pin.
PAPCR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in
software standby mode.
Port A Open Drain Control Register (PAODR)
Bit : 7 6 5 4 3 2 1 0
PA7ODR PA6ODR PA5ODR PA4ODR PA3ODR PA2ODR PA1ODR PA0ODR
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
PAODR is an 8-bit readable/writable register that controls whether PMOS is on or off for each
port A pin (PA7 to PA0).
PAODR is valid only in mode 7. Do not set PAODR bits to 1 in modes 4 to 6.
Setting a PAODR bit to 1 makes the corresponding port A pin an NMOS open-drai n output, while
clearing the bit to 0 makes the pin a CMOS output.
PAODR is initialized to H '00 b y a reset, and in hardware standby mode. It retains its prior state in
software standby mode.
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Port Function Control Register 1 (PFCR1)
Bit : 7 6 5 4 3 2 1 0
— — — — A23E A22E A21E A20E
Initial value : 0 0 0 0 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
PFCR1 is an 8-bit readab le/writable register that performs I/O port control. PFCR1 is initi alized to
H'0F by a reset, and in hardware standby mode.
Bits 7 to 4—Reserved: Only 0 should be written to these bits.
Bit 3—Address 23 Enable (A23E): Enables or disables address output 23 (A23). This bit is valid
in modes 4 to 6.
Bit 3
A23E
Description
0 DR is output when PA7DDR = 1
1 A23 is output when PA7DDR = 1 (Initial value)
Bit 2—Address 22 Enable (A22E): Enables or disables address output 22 (A22). This bit is valid
in modes 4 to 6.
Bit 2
A22E
Description
0 DR is output when PA6DDR = 1
1 A22 is output when PA6DDR = 1 (Initial value)
Bit 1—Address 21 Enable (A21E): Enables or disables address output 21 (A21). This bit is valid
in modes 4 to 6.
Bit 1
A21E
Description
0 DR is output when PA5DDR = 1
1 A21 is output when PA5DDR = 1 (Initial value)
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Bit 0—Address 20 Enable (A20E): Enables or disables address output 20 (A20). This bit is valid
in modes 4 to 6.
Bit 0
A20E
Description
0 DR is output when PA4DDR = 1
1 A20 is output when PA4DDR = 1 (Initial value)
System Control Register (SYSCR)
Bit : 7 6 5 4 3 2 1 0
— — INTM1 INTM0 NMIEG LWROD IRQPAS RAME
Initial value : 0 0 0 0 0 0 0 1
R/W : R/W — R/W R/W R/W R/W R/W R/W
Bit 7—Reserved: Only 0 should be written to this bit.
Bit 6—Reserved: This bit is always read as 0, and cannot be modified.
Bits 5 and 4—Interrupt Cont rol Mode 1 and 0 (INTM1, INTM0): These bits select either of
two interrupt control modes for the interrupt controller. For details of the interrupt control modes,
see section 5.4.1, Interrupt Control Modes and Interrupt Operation.
Bit 5
INTM1 Bit 4
INTM0 Interrupt
Control Mode
Description
0 0 0 Interrupt control by I bit (Initial value)
1 — Setting prohibited
1 0 2 Interrupt control by bits I2 to I0
1 — Setting prohibited
Bit 3—NMI Edge Select (NMIEG): Selects the input edge for the NMI pin.
Bit 3
NMIEG
Description
0 Interrupt requested at falling edge of NMI input (Initial value)
1 Interrupt requested at rising edge of NMI input
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Bit 2—LWR Output Disable (LWROD): Enables or disables LWR output.
Bit 2
LWROD
Description
0 PF3 is designated as LWR output pin (Initial value)
1 PF3 is designated as I/O port, and does not function as LWR output pin
Bit 1—IRQ Port Switching Select (IRQPAS): Selects switching of input pins for IRQ4 to IRQ7.
IRQ4 to IRQ7 input is always performed from one of the ports.
Bit 1
IRQPAS
Description
0 PA4 to PA7 used for IRQ4 to IRQ7 input (Initial value)
1 P50 to P53 used for IRQ4 to IRQ7 input
Bit 0—RAM Enable (RAME): Enables or disables on-chip RAM. The RAME bit is initialized
when the reset state is released. It is not initialized in soft ware standby mode.
Bit 0
RAME
Description
0 On-chip RAM disabled
1 On-chip RAM enabled (Initial value)
9.8.3 Pin Functions
Port A pins function as address outputs, interrupt input pins (IRQ4 to IRQ7), and I/O ports. Port A
pin f uncti ons are shown i n t able 9 .14 .
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Table 9.14 Port A Pin Functions
Pin Selection Method and Pin Functions
PA7/A23/IRQ7 The pin function is switched as shown below according to the combination of
the operating mode and bits A23E and PA7DDR.
Operating
mode Modes 4 to 6 Mode 7
A23E 0 1 —
PA7DDR 0 1 0 1 0 1
Pin function PA7
input pin PA7
output pin PA7
input pin A23
output pin PA7
input pin PA7
output
pin*2
IRQ7 interrupt input pin*1
Notes: 1. IRQ7 input when IRQPAS = 0.
2. NMOS open-drain output when PA7ODR = 1.
PA6/A22/IRQ6 The pin function is switched as shown below according to the combination of
the operating mode and bits A22E and PA6DDR.
Operating
mode Modes 4 to 6 Mode 7
A22E 0 1 —
PA6DDR 0 1 0 1 0 1
Pin function PA6
input pin PA6
output pin PA6
input pin A22
output pin PA6
input pin PA6
output
pin*2
IRQ6 interrupt input pin*1
Notes: 1. IRQ6 input when IRQPAS = 0.
2. NMOS open-drain output when PA6ODR = 1.
PA5/A21/IRQ5 The pin function is switched as shown below according to the combination of
the operating mode and bits A21E and PA5DDR.
Operating
mode Modes 4 to 6 Mode 7
A21E 0 1 —
PA5DDR 0 1 0 1 0 1
Pin function PA5
input pin PA5
output pin PA5
input pin A21
output pin PA5
input pin PA5
output
pin*2
IRQ5 interrupt input pin*1
Notes: 1. IRQ5 input when IRQPAS = 0.
2. NMOS open-drain output when PA5ODR = 1.
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Pin Selection Method and Pin Functions
PA4/A20/IRQ4 The pin function is switched as shown below according to the combination of
the operating mode and bits A20E and PA4DDR.
Operating
mode Modes 4 and 5 Mode 6 Mode 7
A20E 0 1 0 1 —
PA4DDR 0 1 — 0 1 0 1 0 1
Pin function Setting
pro-
hibited
PA4
output
pin
A20
output
pin
PA4
input
pin
PA4
output
pin
PA4
input
pin
A20
output
pin
PA4
input
pin
PA4
output
pin*2
IRQ4 interrupt input pin*1
Notes: 1. IRQ4 input when IRQPAS = 0. Note that in this state in modes 4
and 5, although the pin designation is output-only, IRQ4 input is
also performed.
2. NMOS open-drain output when PA4ODR = 1.
PA3/A19
PA2/A18 The pin function is switched as shown below according to the combination of
the operating mode and bit PAnDDR.
PA1/A17
PA0/A16 Operating
mode Modes
4 and 5 Mode 6 Mode 7
PAnDDR*1— 0 1 0 1
Pin function Am output
pin*1 PAn
input pin*1 Am output
pin*1 PAn
input pin*1 PAn
output
pin*1 *2
Notes: 1. n = 0 to 3, m = 16 to 19
2. PAn output is NMOS open-drain output when PAnODR = 1.
Section 9 I/O Ports
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9.8.4 MOS Input Pull- Up Function
Port A has a built-in MOS input pull-up function that can be controlled by software. This MOS
input pull-up function can be used by pins PA7 to PA5 in modes 4 and 5, and by all pins in modes
6 and 7. MOS input pull-up can be specified as on or off on an individual bit basis.
When a PADDR bit is cleared to 0, setting the corresponding PAPCR bit to 1 turns on the MOS
input pull-up for that pin.
The MOS input pull-up function is in the off state after a reset, and in hardware standb y mode.
The prior state is retained in software sta ndby mode.
Table 9.15 summarizes the MOS input pull-up states.
Table 9.15 MOS Input Pull-Up States (Por t A)
Modes
Reset Hardware
Standby Mode Software
Standby Mode In Other
Operations
6, 7 PA7 to PA0 Off Off On/off On/off
4, 5 PA7 to PA5 On/off On/off
PA4 to PA0 Off Off
Legend:
Off: MOS input pull-up is always off.
On/off: On when PADDR = 0 and PAPCR = 1; otherwise off.
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9.9 Port B
9.9.1 Overview
Port B is an 8-bit I/O port. Port B has an address bus output function, and the pin functions change
according to the operating mode.
Port B has a built-in MOS input pull-up function that can be co ntrolled by software.
Figure 9.8 shows the port B pin configuration.
PB
7
/ A
15
PB
6
/ A
14
PB
5
/ A
13
PB
4
/ A
12
PB
3
/ A
11
PB
2
/ A
10
PB
1
/ A
9
PB
0
/ A
8
PB
7
(input) / A
15
(output)
PB
6
(input) / A
14
(output)
PB
5
(input) / A
13
(output)
PB
4
(input) / A
12
(output)
PB
3
(input) / A
11
(output)
PB
2
(input) / A
10
(output)
PB
1
(input) / A
9
(output)
PB
0
(input) / A
8
(output)
Port B pins
Pin functions in mode 6 Pin functions in mode 7
A
15
(output)
A
14
(output)
A
13
(output)
A
12
(output)
A
11
(output)
A
10
(output)
A
9
(output)
A
8
(output)
Pin functions in modes 4 and 5
PB
7
(I/O)
PB
6
(I/O)
PB
5
(I/O)
PB
4
(I/O)
PB
3
(I/O)
PB
2
(I/O)
PB
1
(I/O)
PB
0
(I/O)
Port B
Figure 9.8 Port B Pin Functions
Section 9 I/O Ports
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9.9.2 Register Configuration
Table 9.16 shows the port B register configuration.
Table 9.16 Port B Registers
Name Abbreviation R/W Initial Value Address*
Port B data direction register PBDDR W H'00 H'FEBA
Port B data register PBDR R/W H'00 H'FF6A
Port B register PORTB R Undefined H'FF5A
Port B MOS pull-up control register PBPCR R/W H'00 H'FF71
Note: * Lower 16 bits of the address.
Port B Data Direction Register (PBDDR)
Bit : 7 6 5 4 3 2 1 0
PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR
Initial value : 0 0 0 0 0 0 0 0
R/W : W W W W W W W W
PBDDR is an 8-bit write -onl y register, the individual bits of which specify i nput or o utput for the
pins of port B. PBDDR cannot be read; if it is, an undefined value will be read.
PBDDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in
software standby mode. The OPE bit in SBYCR is used to select whether the address output pins
retain their output state or become high-impedance when a transition is made to software standby
mode.
• Modes 4 and 5
The corresponding port B pins are address outputs irrespective of the value of the PBDDR bits.
• Mode 6
Setting a PBDDR bit to 1 makes the correspondin g port B pin an address outp ut, while
clearing the bit to 0 makes the p in an input port.
• Mode 7
Setting a PBDDR bit to 1 makes the corresponding port B pin an output port, while clearing
the bit to 0 makes the pi n an input po rt.
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Port B Data Register (PBDR)
Bit : 7 6 5 4 3 2 1 0
PB7DR PB6DR PB5DR PB4DR PB3DR PB2DR PB1DR PB0DR
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
PBDR is an 8-bit readable/writable register that stores output data for the port B pins (PB7 to PB0).
PBDR is initialized to H'00 b y a reset, and in hardware standby mode. It retains its prio r state in
software standby mode.
Port B Register (PORTB)
Bit : 7 6 5 4 3 2 1 0
PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0
Initial value : —* —
* —
* —
* —
* —
* —
* —
*
R/W : R R R R R R R R
Note: * Determined by state of pins PB7 to PB0.
PORTB is an 8-bit rea d-only r egister tha t shows the pin states. It canno t be written to. Writing of
output data for the port B pins (PB7 to PB0) must always be performed on PBDR.
If a port B read is performed while PBDDR bits are set to 1, the PBDR values are read. If a port B
read is performed while PBDDR bits are cleared to 0, the pin states are read.
After a reset and in hardware standby mode, PORTB contents are determined by the pin states, as
PBDDR and P BDR are initialized. PORTB retains its prior state in soft ware sta ndby mode.
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Port B MOS Pull-Up Control Register (PBPCR)
Bit : 7 6 5 4 3 2 1 0
PB7PCR PB6PCR PB5PCR PB4PCR PB3PCR PB2PCR PB1PCR PB0PCR
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
PBPCR is an 8-bit readable/writable register that controls the MOS input pull-up function
incorporated into port B on an individual bit basis.
When a PBDDR bit is cleared to 0 (input port setting) in mode 6 or 7, setting the corresponding
PBPCR bit to 1 turns on the MOS input pull-up for the corresponding pin.
PBPCR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in
software standby mode.
9.9.3 Pin Functions
Modes 4 and 5: In modes 4 and 5, port B pins are automatically designated as address outputs.
Port B pin functions in modes 4 and 5 are shown in figure 9.9.
A
15
(output)
A
14
(output)
A
13
(output)
A
12
(output)
A
11
(output)
A
10
(output)
A
9
(output)
A
8
(output)
Port B
Figure 9.9 Port B Pin Functions (Modes 4 and 5)
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Mode 6: In mode 6, port B pins function as address outputs or input ports. Input or output can be
specified on an individual bit basis. Setting a PBDDR bit to 1 makes the corresponding port B pin
an address output, while cleari ng the bit to 0 makes the pin an input port.
Port B pin functions in mode 6 are shown in figure 9.10.
A
15
(output)
A
14
(output)
A
13
(output)
A
12
(output)
A
11
(output)
A
10
(output)
A
9
(output)
A
8
(output)
PB
7
(input)
PB
6
(input)
PB
5
(input)
PB
4
(input)
PB
3
(input)
PB
2
(input)
PB
1
(input)
PB
0
(input)
When PBDDR = 1 When PBDDR = 0
Port B
Figure 9.10 Port B Pin Functions (Mode 6)
Mode 7: In mode 7, port B pins function as I/O ports. Input or output can be specified for each pin
on an individual bit basis. Setting a PBDDR bit to 1 makes the corresponding port B pin an output
port, while clearing the bit to 0 makes the pin an input port.
Port B pin functions in mode 7 are shown in figure 9.11.
A
15
(output)
A
14
(output)
A
13
(output)
A
12
(output)
A
11
(output)
A
10
(output)
A
9
(output)
A
8
(output)
PB
7
(input)
PB
6
(input)
PB
5
(input)
PB
4
(input)
PB
3
(input)
PB
2
(input)
PB
1
(input)
PB
0
(input)
When PBDDR = 1 When PBDDR = 0
Port B
Figure 9.11 Port B Pin Functions (Mode 7)
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9.9.4 MOS Input Pull- Up Function
Port B has a built-in MOS input pull-up function that can be co ntrolled by software. This MOS
input pull-up function can be used in modes 6 and 7, and can be specified as on or off on an
individual bit basis.
When a PBDDR bit is cleared to 0 in mode 6 or 7, setting the corresponding PBPCR bit to 1 turns
on the MOS input pull-up for that pin.
The MOS input pull-up function is in the off state after a reset, and in hardware standb y mode.
The prior state is retained in software sta ndby mode.
Table 9.17 summarizes the MOS input pull-up states.
Table 9.17 MOS Input Pull-Up States (Po r t B)
Modes
Reset Hardware
Standby Mode Software
Standby Mode In Other
Operations
4, 5 Off Off Off Off
6, 7 On/off On/off
Legend:
Off: MOS input pull-up is always off.
On/off: On when PBDDR = 0 and PBPCR = 1; otherwise off.
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9.10 Port C
9.10.1 Overview
Port C is an 8-bit I/O port. Port C has an address bus output function, and the pin functions change
according to the operating mode.
Port C has a built-in MOS input pull-up function that can be controlled by software.
Figure 9.12 shows the port C pin configuration.
PC
7
/ A
7
PC
6
/ A
6
PC
5
/ A
5
PC
4
/ A
4
PC
3
/ A
3
PC
2
/ A
2
PC
1
/ A
1
PC
0
/ A
0
Port C
PC
7
(input) / A
7
(output)
PC
6
(input) / A
6
(output)
PC
5
(input) / A
5
(output)
PC
4
(input) / A
4
(output)
PC
3
(input) / A
3
(output)
PC
2
(input) / A
2
(output)
PC
1
(input) / A
1
(output)
PC
0
(input) / A
0
(output)
Port C pins
Pin functions in mode 6 Pin functions in mode 7
A
7
(output)
A
6
(output)
A
5
(output)
A
4
(output)
A
3
(output)
A
2
(output)
A
1
(output)
A
0
(output)
Pin functions in modes 4 and 5
PC
7
(I/O)
PC
6
(I/O)
PC
5
(I/O)
PC
4
(I/O)
PC
3
(I/O)
PC
2
(I/O)
PC
1
(I/O)
PC
0
(I/O)
Figure 9.12 Port C Pin Functions
Section 9 I/O Ports
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9.10.2 Register Configuration
Table 9.18 shows the port C register configuration.
Table 9.18 Port C Registers
Name Abbreviation R/W Initial Value Address*
Port C data direction register PCDDR W H'00 H'FEBB
Port C data register PCDR R/W H'00 H'FF6B
Port C register PORTC R Undefined H'FF5B
Port C MOS pull-up control register PCPCR R/W H'00 H'FF72
Note: * Lower 16 bits of the address.
Port C Data Direction Register (PCDDR)
Bit : 7 6 5 4 3 2 1 0
PC7DDR PC6DDR PC5DDR PC4DDR PC3DDR PC2DDR PC1DDR PC0DDR
Initial value : 0 0 0 0 0 0 0 0
R/W : W W W W W W W W
PCDDR is an 8-bit write-only register, the individual bits of which specify input or output for the
pins of port C. PCDDR cannot be read; if it is, an undefined value will be read.
PCDDR is initialized to H'00 b y a reset, and in hardware standby mode. It retains its prior state in
software standby mode. The OPE bit in SBYCR is used to select whether the address output pins
retain their output state or become high-impedance when a transition is made to software standby
mode.
• Modes 4 and 5
The corresponding port C pins are address outputs irrespective of the value of the PCDDR bits.
• Mode 6
Setting a PCDDR bit to 1 makes the corresponding port C pin an address o utput, while
clearing the bit to 0 makes the p in an input port.
• Mode 7
Setting a PCDDR bit to 1 makes the correspondin g port C pin an output por t, while clearing
the bit to 0 makes the pi n an input port.
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Port C Data Register (PCDR)
Bit : 7 6 5 4 3 2 1 0
PC7DR PC6DR PC5DR PC4DR PC3DR PC2DR PC1DR PC0DR
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
PCDR is an 8-bit readable/writable register that stores output data for the port C pins (PC7 to PC0).
PCDR is initialized to H'00 b y a reset, and in hardware standby mode. It retains its prio r state in
software standby mode.
Port C Register (PORTC)
Bit : 7 6 5 4 3 2 1 0
PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0
Initial value : —* —
* —
* —
* —
* —
* —
* —
*
R/W : R R R R R R R R
Note: * Determined by state of pins PC7 to PC0.
PORTC is an 8-bit rea d-only r egister tha t shows the pin states. It canno t be written to. Writing of
output data for the port C pins (PC7 to PC0) must always be performed on PCDR.
If a port C read is performed while PCDDR bits are set to 1, the PCDR values are read. If a port C
read is performed while PCDDR bits are cleared to 0, the pin states are read.
After a reset and in hardware standby mode, PORTC contents are determined by the pin states, as
PCDDR and PCDR are initialized. PORTC retains its prior state in software standby mode.
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Port C MOS Pull-Up Control Register (PCPCR)
Bit : 7 6 5 4 3 2 1 0
PC7PCR PC6PCR PC5PCR PC4PCR PC3PCR PC2PCR PC1PCR PC0PCR
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
PCPCR is an 8-bit readable/writable register that controls the MOS input pull-up function
incorporated into p ort C on an individual bit basis.
When a PCDDR bit is cleared to 0 (input port setting) in mode 6 or 7, setting the corresponding
PCPCR bit to 1 turns on the MOS input pull-up for the corresponding pin.
PCPCR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in
software standby mode.
9.10.3 Pin Functions
Modes 4 and 5: In modes 4 and 5, port C pins are automatically designated as address outputs.
Port C pin functions in modes 4 and 5 are shown in figure 9.13.
A
7
(output)
A
6
(output)
A
5
(output)
A
4
(output)
A
3
(output)
A
2
(output)
A
1
(output)
A
0
(output)
Port C
Figure 9.13 Port C Pin Functions (Modes 4 and 5)
Section 9 I/O Ports
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Mode 6: In mode 6, port C pins function as address outputs or input ports. Input or output can be
specified on an individual bit basis. Setting a PCDDR bit to 1 makes the corresponding port C pin
an address output, while cleari ng the bit to 0 makes the pin an input port.
Port C pin functions in mode 6 are shown in figure 9.14.
A
7
(output)
A
6
(output)
A
5
(output)
A
4
(output)
A
3
(output)
A
2
(output)
A
1
(output)
A
0
(output)
Port C
PC
7
(input)
PC
6
(input)
PC
5
(input)
PC
4
(input)
PC
3
(input)
PC
2
(input)
PC
1
(input)
PC
0
(input)
When PCDDR = 1 When PCDDR = 0
Figure 9.14 Port C Pin Functions (Mode 6)
Mode 7: In mode 7, port C pins function as I/O ports. Input or output can be specified for each pin
on an individual bit basis. Setting a PCDDR bit to 1 makes the corresponding port C pin an output
port, while clearing the bit to 0 makes the pin an input port.
Port C pin functions in mode 7 are shown in figure 9.15.
PC
7
(I/O)
PC
6
(I/O)
PC
5
(I/O)
PC
4
(I/O)
PC
3
(I/O)
PC
2
(I/O)
PC
1
(I/O)
PC
0
(I/O)
Port C
Figure 9.15 Port C Pin Functions (Mode 7)
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 415 of 1268
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9.10.4 MO S Input Pull-U p F unction
Port C has a built-in MOS input pull-up function that can be controlled by software. This MOS
input pull-up function can be used in modes 6 and 7, and can be specified as on or off on an
individual bit basis.
When a PCDDR bit is cleared to 0 in mode 6 or 7, setting the corresponding PCPCR bit to 1 turns
on the MOS input pull-up for that pin.
The MOS input pull-up function is in the off state after a reset, and in hardware standb y mode.
The prior state is retained in software sta ndby mode.
Table 9.19 summarizes the MOS input pull-up states.
Table 9.19 MOS Input Pull-Up States (Por t C)
Modes
Reset Hardware
Standby Mode Software
Standby Mode In Other
Operations
4, 5 Off Off Off Off
6, 7 On/off On/off
Legend:
Off: MOS input pull-up is always off.
On/off: On when PCDDR = 0 and PCPCR = 1; otherwise off.
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 416 of 1268
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9.11 Port D
9.11.1 Overview
Port D is an 8-bit I/O port. Port D has a data bus I/O function, and the pin functions change
according to the operating mode.
Port D has a built-in MOS input pull-up function that can be co ntrolled b y software.
Figure 9.16 shows the port D pin configuration.
PD
7
/
D
15
PD
6
/
D
14
PD
5
/
D
13
PD
4
/
D
12
PD
3
/
D
11
PD
2
/
D
10
PD
1
/
D
9
PD
0
/
D
8
Port D
D
15
(I/O)
D
14
(I/O)
D
13
(I/O)
D
12
(I/O)
D
11
(I/O)
D
10
(I/O)
D
9
(I/O)
D
8
(I/O)
Port D pins Pin functions in modes 4 to 6
PD
7
(I/O)
PD
6
(I/O)
PD
5
(I/O)
PD
4
(I/O)
PD
3
(I/O)
PD
2
(I/O)
PD
1
(I/O)
PD
0
(I/O)
Pin functions in mode 7
Figure 9.16 Port D Pin Functions
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 417 of 1268
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9.11.2 Register Configuration
Table 9.20 shows the port D register configuration.
Table 9.20 Port D Registers
Name Abbreviation R/W Initial Value Address*
Port D data direction register PDDDR W H'00 H'FEBC
Port D data register PDDR R/W H'00 H'FF6C
Port D register PORTD R Undefined H'FF5C
Port D MOS pull-up control register PDPCR R/W H'00 H'FF73
Note: * Lower 16 bits of the address.
Port D Data Direction Register (PDDDR)
Bit : 7 6 5 4 3 2 1 0
PD7DDR PD6DDR PD5DDR PD4DDR PD3DDR PD2DDR PD1DDR PD0DDR
Initial value : 0 0 0 0 0 0 0 0
R/W : W W W W W W W W
PDDDR is an 8-bit write-o nl y register, the individual bits of which specify input or output for the
pins of port D. PDDDR cannot be read; if it is, an undefined value will be read .
PDDDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in
software standby mode.
• Modes 4 to 6
The input/output direction specification by PDDDR is ignored, and port D is automatically
designated for data I/O.
• Mode 7
Setting a PDDDR bit to 1 makes the corresponding port D p in an output port, while clearing
the bit to 0 makes the pi n an input po rt.
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 418 of 1268
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Port D Data Register (PDDR)
Bit : 7 6 5 4 3 2 1 0
PD7DR PD6DR PD5DR PD4DR PD3DR PD2DR PD1DR PD0DR
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
PDDR is an 8-bit readable/writable register that stores output data for the port D pins (PD7 to
PD0).
PDDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior sta te in
software standby mode.
Port D Register (PORTD)
Bit : 7 6 5 4 3 2 1 0
PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0
Initial value : —* —
* —
* —
* —
* —
* —
* —
*
R/W : R R R R R R R R
Note: * Determined by state of pins PD7 to PD0.
PORTD is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of
output data for the port D pins (PD7 to PD0) must always be performed on PDDR.
If a port D read is performed while PDDDR bits are set to 1, the PDDR values are read. If a port D
read is performed while PDDDR bits are cleared to 0, the pin states are read.
After a reset and in hardware standby mode, PORTD contents are determined by the pin states, as
PDDDR and PDDR are initialized. PORTD retains its prior state in software standb y mode.
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 419 of 1268
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Port D MOS Pull-Up Control Register (PDPCR)
Bit : 7 6 5 4 3 2 1 0
PD7PCR PD6PCR PD5PCR PD4PCR PD3PCR PD2PCR PD1PCR PD0PCR
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
PDPCR is an 8-bit readable/writable register that controls the MOS input pull-up function
incorporated into port D on an individual bit basis.
When a PDDDR bit is cleared to 0 (input port setting) in mode 7, setting the corresponding
PDPCR b it to 1 turns on the MOS input pull-up for the correspo nding pin.
PDPCR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in
software standby mode.
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 420 of 1268
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9.11.3 Pin Functions
Modes 4 to 6: In modes 4 to 6, port D pins are automatically designated as data I/O pins.
Port D pin functions in modes 4 to 6 are shown in figure 9.17.
D
15
(I/O)
D
14
(I/O)
D
13
(I/O)
D
12
(I/O)
D
11
(I/O)
D
10
(I/O)
D
9
(I/O)
D
8
(I/O)
Port D
Figure 9.17 Port D Pin Functions (Modes 4 to 6)
Mode 7: In mode 7, port D pins function as I/O ports. Input or output can be specified for each pin
on an individual bit basis. Setting a PDDDR bit to 1 makes the corresponding port D pin an output
port, while clearing the bit to 0 makes the pin an input port.
Port D pin functions in mode 7 are shown in figure 9.18.
PD
7
(I/O)
PD
6
(I/O)
PD
5
(I/O)
PD
4
(I/O)
PD
3
(I/O)
PD
2
(I/O)
PD
1
(I/O)
PD
0
(I/O)
Port D
Figure 9.18 Port D Pin Functions (Mode 7)
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 421 of 1268
REJ09B0220-0600
9.11.4 MO S Input Pull-U p F unction
Port D has a built-in MOS input pull-up function that can be co ntrolled b y software. T his MOS
input pull-up function can be used in mode 7, and can be specified as on or off on an individual bit
basis.
When a PDDDR bit is cleared to 0 in mode 7, setting the corresponding PDPCR bit to 1 turns on
the MOS input pull-up for that pin.
The MOS input pull-up function is in the off state after a reset, and in hardware standb y mode.
The prior state is retained in software sta ndby mode.
Table 9.21 summarizes the MOS input pull-up states.
Table 9.21 MOS Input Pull-Up States (Por t D)
Modes
Reset Hardware
Standby Mode Software
Standby Mode In Other
Operations
4 to 6 Off Off Off Off
7 On/off On/off
Legend:
Off: MOS input pull-up is always off.
On/off: On when PDDDR = 0 and PDPCR = 1; otherwise off.
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 422 of 1268
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9.12 Port E
9.12.1 Overview
Port E is an 8-bit I/O port. Port E has a data bus I/O function, and the pin functions change
according to the operating mode and whether 8-bit or 16-bit bus mode is selected.
Port E has a built-in MOS input pull-up function that can be controlled by software.
Figure 9.19 shows the port E pin configuration.
PE
7
/ D
7
PE
6
/ D
6
PE
5
/ D
5
PE
4
/ D
4
PE
3
/ D
3
PE
2
/ D
2
PE
1
/ D
1
PE
0
/ D
0
PE
7
(I/O) / D
7
(I/O)
PE
6
(I/O) / D
6
(I/O)
PE
5
(I/O) / D
5
(I/O)
PE
4
(I/O) / D
4
(I/O)
PE
3
(I/O) / D
3
(I/O)
PE
2
(I/O) / D
2
(I/O)
PE
1
(I/O) / D
1
(I/O)
PE
0
(I/O) / D
0
(I/O)
Port E pins Pin functions in modes 4 to 6
Pin functions in mode 7
PE
7
(I/O)
PE
6
(I/O)
PE
5
(I/O)
PE
4
(I/O)
PE
3
(I/O)
PE
2
(I/O)
PE
1
(I/O)
PE
0
(I/O)
Port E
Figure 9.19 Port E Pin Functions
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 423 of 1268
REJ09B0220-0600
9.12.2 Register Configuration
Table 9.22 shows the port E register configuration.
Table 9.22 Port E Registers
Name Abbreviation R/W Initial Value Address*
Port E data direction register PEDDR W H'00 H'FEBD
Port E data register PEDR R/W H'00 H'FF6D
Port E register PORTE R Undefined H'FF5D
Port E MOS pull-up control register PEPCR R/W H'00 H'FF74
Note: * Lower 16 bits of the address.
Port E Data Direction Register (PEDDR)
Bit : 7 6 5 4 3 2 1 0
PE7DDR PE6DDR PE5DDR PE4DDR PE3DDR PE2DDR PE1DDR PE0DDR
Initial value : 0 0 0 0 0 0 0 0
R/W : W W W W W W W W
PEDDR is an 8-bit write-only register, the individual bits of which specify input or output for the
pins of port E. PEDDR cannot be read; if it is, an undefined value will be read.
PEDDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in
software standby mode.
• Modes 4 to 6
When 8-bit bus mode has been selected, port E pins function as I/O ports. Setting a PEDDR bit
to 1 makes the corresponding port E pin an output port, while clearing the bit to 0 makes the
pin an input port.
When 16-bit bus mode has been selected, the input/output direction specification by PEDDR is
ignored, and port E is designated for data I/O.
For details of 8-bit and 16-bit bus modes, see section 6, Bus Controller.
• Mode 7
Setting a PEDDR bit to 1 makes the corresponding port E pin an output port, while clearing the
bit to 0 makes the pin an input port.
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 424 of 1268
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Port E Data Register (PEDR)
Bit : 7 6 5 4 3 2 1 0
PE7DR PE6DR PE5DR PE4DR PE3DR PE2DR PE1DR PE0DR
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
PEDR is an 8-bit readable/writable register that stores output data for the port E pins (PE7 to PE0).
PEDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior sta te in
software standby mode.
Port E Register (PORTE)
Bit : 7 6 5 4 3 2 1 0
PE7 PE6 PE5 PE4 PE3 PE2 PE1 PE0
Initial value : —* —
* —
* —
* —
* —
* —
* —
*
R/W : R R R R R R R R
Note: * Determined by state of pins PE7 to PE0.
PORTE is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of
output data for the port E pins (PE7 to PE0) must always be performed on PEDR.
If a port E read is performed while PEDDR bits are set to 1, the PEDR values are read. If a port E
read is performed while PEDDR bits are cleared to 0, the pin states are read.
After a reset and in hardware standby mode, PORTE contents are determined by the pin states, as
PEDDR and PEDR are initiali zed . PORTE retains its prior state in software standby mode.
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 425 of 1268
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Port E MOS Pull-Up Control Register (PEPCR)
Bit : 7 6 5 4 3 2 1 0
PE7PCR PE6PCR PE5PCR PE4PCR PE3PCR PE2PCR PE1PCR PE0PCR
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
PEPCR is an 8-bit readable/writable register that controls the MOS input pull-up functio n
incorporated into por t E on an individual bit basis.
When a PEDDR bit is cleared to 0 (input port setting) in mode 4, 5, or 6 with 8-bit bus mode
selected, or in mode 7, setting the corresponding PEPCR bit to 1 turns on the MOS input pull-up
for the corresponding pin.
PEPCR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in
software standby mode.
9.12.3 Pin Functions
Modes 4 to 6: In modes 4 to 6, when 8-bit access is designated and 8-bit bus mode is selected,
port E pins are automatically desig nated as I/O p orts. Setting a PEDDR bit to 1 makes the
corresponding port E pin an output port, while clearing the bit to 0 makes the pin an input port.
When 16-bit bus mode is selected, the input/output direction specification by PEDDR is ignored,
and port E is designated for data I/O.
Port E pin functions in modes 4 to 6 are shown in figure 9.20.
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 426 of 1268
REJ09B0220-0600
PE
7
(I/O)
PE
6
(I/O)
PE
5
(I/O)
PE
4
(I/O)
PE
3
(I/O)
PE
2
(I/O)
PE
1
(I/O)
PE
0
(I/O)
Port E
D
7
(I/O)
D
6
(I/O)
D
5
(I/O)
D
4
(I/O)
D
3
(I/O)
D
2
(I/O)
D
1
(I/O)
D
0
(I/O)
8-bit bus mode 16-bit bus mode
Figure 9.20 Port E Pin Functions (Modes 4 to 6)
Mode 7: In mode 7, port E pins function as I/O ports. Input or output can be specified for each pin
on a bit-by-bit basis. Setting a PEDDR bit to 1 makes the corresponding port E pin an output port,
while clearing the bit to 0 makes the pin an input port.
Port E pin functions in mode 7 are shown in figure 9.21.
PE
7
(I/O)
PE
6
(I/O)
PE
5
(I/O)
PE
4
(I/O)
PE
3
(I/O)
PE
2
(I/O)
PE
1
(I/O)
PE
0
(I/O)
Port E
Figure 9.21 Port E Pin Functions (Mode 7)
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 427 of 1268
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9.12.4 MO S Input Pull-U p F unction
Port E has a built-in MOS input pull-up function that can be controlled by software. T his MOS
input pull-up function can be used in modes 4 to 6 when 8-bit bus mode is selected, or in mode 7,
and can be specified as on or off on an individual bit basis.
When a PEDDR bit is cleared to 0 in mode 4, 5, or 6 when 8-bit bus mode is selected, or in mode
7, setting the correspondin g P E PCR bit to 1 turns on the MOS input pull-up for that pin.
The MOS input pull-up function is in the off state after a reset, and in hardware standb y mode.
The prior state is retained in software sta ndby mode.
Table 9.23 summarizes the MOS input pull-up states.
Table 9.23 MOS Input Pull-Up States (Po r t E)
Modes
Reset Hardware
Standby Mode Software
Standby Mode In Other
Operations
7 Off Off On/off On/off
4 to 6 8-bit bus
16-bit bus Off Off
Legend:
Off: MOS input pull-up is always off.
On/off: On when PEDDR = 0 and PEPCR = 1; otherwise off.
Section 9 I/O Ports
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9.13 Port F
9.13.1 Overview
Port F is an 8-bit I/O port. Port F pins also function as bus control signal input/output pins (AS,
RD, HWR, LWR, LCAS*, WAIT, BREQO, BREQ, and BACK) and the system clock (φ) output
pin. The AS, LWR, and BREQO output pins can be switched by means of settings in PFCR2 and
SYSCR.
Figure 9.22 shows the port F pin configuration.
Note: * LCAS is not supported in the H8S/2321.
PF
7
/ φ
PF
6
/ AS
PF
5
/ RD
PF
4
/ HWR
PF
3
/ LWR
PF
2
/ LCAS*
/ WAIT
/ BREQO
PF
1
/ BACK
PF
0
/ BREQ
Port F
Port F pins
PF
7
(input) / φ (output)
PF
6
(I/O)
PF
5
(I/O)
PF
4
(I/O)
PF
3
(I/O)
PF
2
(I/O)
PF
1
(I/O)
PF
0
(I/O)
Pin functions in mode 7
PF
7
(input) / φ (output)
PF
6
(I/O) / AS (output)
RD (output)
HWR (output)
PF
3
(I/O) / LWR (output)
PF
2
(I/O) / LCAS* (output) / WAIT (input) / BREQO (output)
PF
1
(I/O) / BACK (output)
PF
0
(I/O) / BREQ (input)
Pin functions in modes 4 to 6
Note: * LCAS is not supported in the H8S/2321.
Figure 9.22 Port F Pin Functions
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 429 of 1268
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9.13.2 Register Configuration
Table 9.24 shows the port F register configuration.
Table 9.24 Port F Registers
Name Abbreviation R/W Initial Value Address*1
Port F data direction register PFDDR W H'80/H'00*2 H'FEBE
Port F data register PFDR R/W H'00 H'FF6E
Port F register PORTF R Undefined H'FF5E
Port function control register 2 PFCR2 R/W H'30 H'FFAC
System control regi ster SYSCR R/W H'01 H'FF39
Notes: 1. Lower 16 bits of the address.
2. Initial value depends on the mode.
Port F Data Direction Register (PFDDR)
Bit : 7 6 5 4 3 2 1 0
PF7DDR PF6DDR PF5DDR PF4DDR PF3DDR PF2DDR PF1DDR PF0DDR
Modes 4 to 6
Initial value : 1 0 0 0 0 0 0 0
R/W : W W W W W W W W
Mode 7
Initial value : 0 0 0 0 0 0 0 0
R/W : W W W W W W W W
PFDDR is an 8-bit write -onl y register, the individual bits of which specify i nput or o utput for the
pins of port F. PFDDR cannot be read; if it is, an undefined value will be read.
PFDDR is initialized b y a reset, and in hardware standby mode, to H'80 in modes 4 to 6, and to
H'00 in mode 7. It retains its prior state in software standby mode. The OPE bit in SBYCR is used
to select whether the bus control output pins retain their output state or become high-impedance
when a transition is made to software standby mode.
Section 9 I/O Ports
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Port F Data Register (PFDR)
Bit : 7 6 5 4 3 2 1 0
PF7DR PF6DR PF5DR PF4DR PF3DR PF2DR PF1DR PF0DR
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
PFDR is an 8-bit readable/writable register that stores output data for the port F pins (PF7 to PF0).
PFDR is initialized to H'00 by a reset, and in hardware standby mode. It retains its prior state in
software standby mode.
Port F Register (PORTF)
Bit : 7 6 5 4 3 2 1 0
PF7 PF6 PF5 PF4 PF3 PF2 PF1 PF0
Initial value : —* —
* —
* —
* —
* —
* —
* —
*
R/W : R R R R R R R R
Note: * Determined by state of pins PF7 to PF0.
PORTF is a n 8-bit read-only register that sho ws the pi n stat es. It cannot be writ ten to. Wr iting of
output data for the port F pins (PF7 to PF0) must always be performed on PFDR.
If a port F read is performed while PFDDR bits are set to 1, the PFDR values are read. If a port F
read is performed while PFDDR bits are cleared to 0, the pin states are read.
After a reset and in hardware standby mode, PORTF contents are determined by the pin states, as
PFDDR and PFDR are initialized. PORTF retains its prior state in software standby mode.
Section 9 I/O Ports
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Port Function Control Register 2 (PFCR2)
Bit : 7 6 5 4 3 2 1 0
WAITPS BREQOPS CS167E CS25E ASOD — — —
Initial value : 0 0 1 1 0 0 0 0
R/W : R/W R/W R/W R/W R/W R R R
PFCR2 is an 8-bit readab le/writable register that performs I/O port control. PFCR2 is initi alized to
H'30 by a reset, and in hardware standby mode.
Bit 7—WAIT Pin Select (WAITPS): Selects the WAIT input pin. Set the WAITPS bit before
setting the DDR bit clear to 0 and the WAITE bit in BCRL to 1.
Bit 7
WAITPS
Description
0 WAIT input is pin PF2 (Initial value)
1 WAIT input is pin P53
Bit 6—BREQO Pin Select (BREQOPS): Selects the BREQO output pin. Set the BREQOPS bit
before setting the BREQOE bit in BCRL to 1.
Bit 6
BREQOPS
Description
0 BREQO output is pin PF2 (Initial value)
1 BREQO output is pin P53
Bit 5—CS167 Enable (CS167E): Enables or disables CS1, CS6, and CS7 output. For details, see
section 9.7, Port 6, and section 9.14, Port G.
Bit 4—CS25 Enable (CS25E): Enables or disables CS2, CS3, CS4, and CS5 output. For details,
see section 9.7, Port 6, and section 9.14, Port G.
Bit 3—AS Output Disable (ASOD): Enables or disables AS output. This bit is valid in modes 4
to 6.
Bit 3
ASOD
Description
0 PF6 is used as AS output pin (Initial value)
1 PF6 is designated as I/O port, and does not function as AS output pin
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 432 of 1268
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Bits 2 to 0—Reserved: These bits are always read as 0.
System Control Register (SYSCR)
Bit : 7 6 5 4 3 2 1 0
— — INTM1 INTM0 NMIEG LWROE IRQPAS RAME
Initial value : 0 0 0 0 0 0 0 1
R/W : R/W — R/W R/W R/W R/W R/W R/W
SYSCR is an 8-bit readable/writable register that selects the interrupt control mode, controls the
LWR pin, switc hes the IRQ4 to IRQ7 input pins, and selects the detected edge for NMI. SYSCR is
initialized to H'01 by a reset, and in hardware standb y mode. It is not initialized in software
standby mode.
Bits 5 and 4—Interrupt Cont rol Mode 1 and 0 (INTM1, INTM0): These bits select either of
two interrupt control modes for the interrupt controller. For details, see section 5, Interrupt
Controller.
Bit 3—NMI Edge Select (NMIEG): Selects the input edge for the NMI pin. For details, see
section 5, Interrupt Controller.
Bit 2—LWR Output Disable (LWROD): Enables or disables LWR output. This bit is valid in
modes 4 to 6.
Bit 2
LWROD
Description
0 PF3 is designated as LWR output pin (Initial value)
1 PF3 is designated as I/O port, and does not function as LWR output pin
Bit 1—IRQ Port Switching Select (IRQPAS): Selects switching of input pins for IRQ4 to IRQ7.
For details, see section 9.6, Port 5.
Bit 0—RAM Enable (RAME): Enables or disables on-chip RAM. For details, see section 18,
RAM.
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 433 of 1268
REJ09B0220-0600
9.13.3 Pin Functions
Port F pins also function as bus control signal input/output pins (AS, RD, HWR, LWR, LCAS*,
WAIT, BREQO, BREQ, and BACK) and the system clock (φ) output pin. The pin functions differ
between modes 4 to 6, and mode 7. Port F pin functions are shown in table 9.25.
Note: * The LCAS is not supported in the H8S/2321.
Table 9.25 Port F Pin Functions
Pin Selection Method and Pin Functions
PF7/φ The pin function is switched as shown below according to bit PF7DDR.
PF7DDR 0 1
Pin function PF7 inpu t pin φ output pin
PF6/AS The pin function is switched as shown below according to the operating mode,
bit PF6DDR, and bit ASOD in PFCR2.
Operating
Mode Modes 4 to 6 Mode 7
ASOD 0 1 —
PF6DDR — 0 1 0 1
Pin function AS output
pin PF6 input
pin PF6 output
pin PF6 input
pin PF6 output
pin
PF5/RD The pin function is switched as shown below according to the operating mode
and bit PF5DDR.
Operating
Mode Modes 4 to 6 Mode 7
PF5DDR — 0 1
Pin function RD output pin PF5 input pin PF5 output pin
PF4/HWR The pin function is switched as shown below according to the operating mode
and bit PF4DDR.
Operating
Mode Modes 4 to 6 Mode 7
PF4DDR — 0 1
Pin function HWR output pin PF4 input pin PF4 output pin
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 434 of 1268
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Pin Selection Method and Pin Functions
PF3/LWR The pin function is switched as shown below according to the operating mode,
bit PF3DDR, and bit LWROD in SYSCR.
Operating
Mode Modes 4 to 6 Mode 7
LWROD 0 1 —
PF3DDR — 0 1 0 1
Pin function
LWR
output pin PF3
input pin PF3
output pin PF3
input pin PF3
output pin
PF2/LCAS*2/WAIT/
BREQO The pin function is switched as shown below according to the combination of
the operating mode, and bits RMTS2 to RMTS0*2, BREQOE, WAITE, ABW5
to ABW2, BREQOPS, WAITPS, and PF2DDR.
Operati ng Mo de Modes 4 to 6 Mode 7
[DRAM space
setting]*2 ·
[16-bit access
setting]
0 1 —
[BREQOE ·
BREQOPS] 0 1 — —
[WAITE ·
WAITPS] 0 1 0 1 — —
PF2DDR 0 1 0 1 — — — 0 1
Pin function PF2
input
pin
PF2
output
pin
WAIT
input
pin*1
Setting
pro-
hibited
BREQO
output
pin
Setting
pro-
hibited
LCAS
output
pin*2
PF2
input
pin
PF2
output
pin
Notes: 1. W hen DRAM space is designated for 8-bit access and PF2 is used
as the WAIT input, this pin can be used for WAIT input when all
areas selected as DRAM space are 8-bit space and normal space
other than DRAM space is 16-bit space.
2. The DRAM interface and LCAS are not supported in the H8S/2321.
PF1/BACK The pin function is switched as shown below according to the combination of
the operating mode, and bits BRLE and PF1DDR.
Operating
Mode Modes 4 to 6 Mode 7
BRLE 0 1 —
PF1DDR 0 1 — 0 1
Pin function
PF1
input pin PF1
output pin BACK
output pin PF1
input pin PF1
output pin
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 435 of 1268
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Pin Selection Method and Pin Functions
PF0/BREQ The pin function is switched as shown below according to the combination of
the operating mode, and bits BRLE and PF0DDR.
Operating
Mode Modes 4 to 6 Mode 7
BRLE 0 1 —
PF0DDR 0 1 — 0 1
Pin function
PF0
input pin PF0
output pin BREQ
input pin PF0
input pin PF0
output pin
9.14 Port G
9.14.1 Overview
Port G is a 5-bit I/O port. Port G pins also function as bus control signal output pins (CS0 to CS3,
and CAS*). Enabling or disabling of CS1 to CS3 output can be changed by a setting in PFCR2.
Figure 9.23 shows the port G pin configuration.
Note: * CAS is not supported in the H8S/2321.
PG
4
/ CS
0
PG
3
/ CS
1
PG
2
/ CS
2
PG
1
/ CS
3
PG
0
/ CAS*
PG
4
(I/O)
PG
3
(I/O)
PG
2
(I/O)
PG
1
(I/O)
PG
0
(I/O)
Port G pins Pin functions in mode 7Pin functions in modes 4 to 6
PG
4
(input) / CS
0
(output)
PG
3
(I/O) / CS
1
(output)
PG
2
(I/O) / CS
2
(output)
PG
1
(I/O) / CS
3
(output)
PG
0
(I/O) / CAS* (output)
Port G
Note: * CAS is not supported in the H8S/2321.
Figure 9.23 Port G Pin Functions
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 436 of 1268
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9.14.2 Register Configuration
Table 9.26 shows the port G register configuration.
Table 9.26 Port G Registers
Name Abbreviation R/W Initial Value*2 Address*1
Port G data direc tio n register PGDDR W H'10/H'00*3 H'FEBF
Port G data register PGDR R/W H'00 H'FF6F
Port G register PORTG R Undefined H'FF5F
Port function register 2 PFCR2 R/W H'30 H'FFAC
Notes: 1. Lower 16 bits of the address.
2. Value of bits 4 to 0.
3. Initial value depends on the mode.
Port G Data Direction Register (PGDDR)
Bit : 7 6 5 4 3 2 1 0
— — — PG4DDR PG3DDR PG2DDR PG1DDR PG0DDR
Modes 4 and 5
Initial value : Undefined Undefined Undefined 1 0 0 0 0
R/W : — — — W W W W W
Modes 6 and 7
Initial value : Undefined Undefined Undefined 0 0 0 0 0
R/W : — — — W W W W W
PGDDR is an 8-bit write-o nl y register, the individual bits of which specify input or output for the
pins of port G. PGDDR cannot be read, and bits 7 to 5 are reserved. If PGDDR is read, an
undefined value will be read.
The PG4DDR b it is initialized by a reset, and in hardware standby mode, to 1 in modes 4 and 5,
and to 0 in modes 6 and 7. PGDDR retains its prior state in software standby mode. The OPE bit
in SBYCR is used to select whether the bus control output pins retain their output state or become
high-impedance when a transition is made to software standby mode.
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 437 of 1268
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Port G Data Register (PGDR)
Bit : 7 6 5 4 3 2 1 0
— — — PG4DR PG3DR PG2DR PG1DR PG0DR
Initial value : Undefined Undefined Undefined 0 0 0 0 0
R/W : — — — R/W R/W R/W R/W R/W
PGDR is an 8-bit readable/writable register that stores output data for the port G pins (PG4 to
PG0).
Bits 7 to 5 are reserved; they return an undefined value if read, and cannot be modified.
PGDR is initialized to H'00 (b its 4 to 0) by a reset, and in hardware standby mode. It retains its
prior state in software standby mode.
Port G Register (PORTG)
Bit : 7 6 5 4 3 2 1 0
— — — PG4 PG3 PG2 PG1 PG0
Initial value : Undefined Undefined Undefined —* —
* —
* —
* —
*
R/W : — — — R R R R R
Note: * Determined by state of pins PG4 to PG0.
PORTG is an 8-bit read-only register that shows the pin states. It cannot be written to. Writing of
output data for the port G pins (PG4 to PG0) must always be performed on PGDR.
Bits 7 to 5 are reserved; they return an undefined value if read, and cannot be modified.
If a port G read is performed while PGDDR bits are set to 1, the PGDR values are read. If a port G
read is performed while PGDDR bits are cleared to 0, the pin states are read.
After a reset and in hardware standby mode, PORTG contents are determined by the pin states, as
PGDDR and PGDR are initialized. PORTG retains its prior state in software standb y mode.
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 438 of 1268
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Port Function Control Register 2 (PFCR2)
Bit : 7 6 5 4 3 2 1 0
WAITPS BREQOPS CS167E CS25E ASOD — — —
Initial value : 0 0 1 1 0 0 0 0
R/W : R/W R/W R/W R/W R/W R R R
PFCR2 is an 8-bit readab le/writable register that performs I/O port control. PFCR2 is initi alized to
H'30 by a reset, and in hardware standby mode.
Bit 7—WAIT Pin Select (WAITPS) : Selects the WAIT i nput pin. For details, see section 9.6,
Port 5.
Bit 6—BREQO Pin Select (BREQOPS): Selects the BREQO output pin. For details, see section
9.6, Port 5.
Bit 5—CS167 Enable (CS167E): Enables or disables CS1, CS6, and CS7 output. Chan ge the
CS167E setting only when the DDR bits are cleared to 0.
Bit 5
CS167E
Description
0 CS1, CS6, and CS7 output disabled (can be used as I/O ports)
1 CS1, CS6, and CS7 output enabled (Initial value)
Bit 4—CS25 Enable (CS25E): Enables or disables CS2, CS3, CS4, and CS5 output. Change the
CS25E setting only when the DDR bits are cleared to 0.
Bit 4
CS25E
Description
0 CS2, CS3, CS4, and CS5 output disabled (can be used as I/O ports)
1 CS2, CS3, CS4, and CS5 output enabled (Initial value)
Bit 3—AS Output Disable (ASOD): Enables or disables AS output. For details, see section 9.13,
Port F.
Bits 2 to 0—Reserved: These bits are always read as 0.
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 439 of 1268
REJ09B0220-0600
9.14.3 Pin Functions
Po rt G pins al so fu nction as b us control si gnal outp ut pins (CS0 to CS3, and CAS*). The pin
functions are different in mode 7, and modes 4 to 6. Port G pin functions are shown in table 9.27.
Note: * The CAS is not supported in the H8S/2321.
Table 9.27 Port G Pin Functions
Pin Selection Method and Pin Functions
PG4/CS0 The pin function is switched as shown below according to the operating mode
and bit PG4DDR.
Operating
Mode Modes 4 to 6 Mode 7
PG4DDR 0 1 0 1
Pin function PG4 input pin CS0 output pin PG4 input pin PG4 output pin
PG3/CS1 The pin function is switched as shown below according to the operating mode
and bits PG3DDR and CS167E.
Operating
Mode Modes 4 to 6 Mode 7
PG3DDR 0 1 0 1
CS167E — 0 1 — —
Pin function PG3 input
pin PG3 output
pin CS1 output
pin PG3 input
pin PG3 output
pin
PG2/CS2 The pin function is switched as shown below according to the operating mode
and bits PG2DDR and CS25E.
Operating
Mode Modes 4 to 6 Mode 7
PG2DDR 0 1 0 1
CS25E — 0 1 — —
Pin function PG2 input
pin PG2 output
pin CS2 output
pin PG2 input
pin PG2 output
pin
Section 9 I/O Ports
Rev.6.00 Sep. 27, 2007 Page 440 of 1268
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Pin Selection Method and Pin Functions
PG1/CS3 The pin function is switched as shown below according to the operating mode
and bits PG1DDR and CS25E.
Operating
Mode Modes 4 to 6 Mode 7
PG1DDR 0 1 0 1
CS25E — 0 1 — —
Pin function PG1 input
pin PG1 output
pin CS3 output
pin PG1 input
pin PG1 output
pin
PG0/CAS* The pin function is switched as shown below according to the combination of
the operating mode and bits RMTS2 to RMTS0* and PG0DDR.
Operating
Mode Modes 4 to 6 Mode 7
RMTS2 to
RMTS0* B'000,
B'100 to B'111 B'001 to
B'011 —
PG0DDR 0 1 — 0 1
Pin function PG0
input
pin
PG0
output
pin
CAS
output
pin*
PG0
input
pin
PG0
output
pin
Note: * The DRAM interface and CAS are not supported in the H8S/2321.
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Sep. 27, 2007 Page 441 of 1268
REJ09B0220-0600
Section 10 16-Bit Timer Pulse Unit (TPU)
10.1 Overview
The chip has an on-chip 16-bit timer pulse unit (TPU) that comprises six 16-bit timer channe ls.
10.1.1 Features
• Maximum 16-pulse input/output
⎯ A total of 16 timer general registers (TGRs) are provided (four each for channels 0 and 3,
and two each for channels 1, 2, 4, and 5), each of which can be set independently as an
output compare/input capture register
⎯ TGRC and TGRD for channels 0 and 3 can also be used as buffer registers
• Selection of 8 counter input clocks for each channel
• The following operations can be set for each channel:
⎯ Waveform output at co mpare match: Sel ection of 0, 1, o r toggle output
⎯ Input capture funct io n: Selec t io n of rising edge, falling edge, o r both edge dete ctio n
⎯ Counter clear operation: Counter clearing possible by compare match or input capture
⎯ Synchronous operatio n: Multiple timer counters (T CNT) can be written to simultaneous ly
Simultaneous clearing by compare match and input capture possible
Register simultaneous input/output possible by counter synchronous operation
⎯ PWM mode: Any PWM output duty can be set
Maximum of 15-phase PWM output possible by combination with synchronous operation
• Buffer operation settable for channels 0 and 3
⎯ Input capture register double-buffering possible
⎯ Automatic rewriting of output compare register possible
• Phase counting mode settable independently for each of channels 1, 2, 4, and 5
⎯ Two-phase encoder pulse up/down-count possible
• Cascaded operation
⎯ Channel 2 (channel 5) input clock operates as 32-bit counter by setting channel 1 (channel
4) overflow/underflow
• Fast access via internal 16-bit bus
⎯ Fast access is possible via a 16-bit bus interface
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Sep. 27, 2007 Page 442 of 1268
REJ09B0220-0600
• 26 interrupt sources
⎯ For channels 0 and 3, four compare match/input capture dual-function interrupts and one
overflow interrupt can be requested independently
⎯ For channels 1, 2, 4, and 5, two compare match/input capture dual-function interrupts, one
overflow interrupt, and one underflow interrupt can be requested independently
• Automatic transfer of register data
⎯ Block transfer, 1-word data transfer, and 1-byte data transfer possible by data transfer
controller (DTC) or DMA controller (DMAC)* activation
• Programmable pulse generator (PPG) output trigger can be generated
⎯ Channel 0 to 3 compare match/input capture signals can be used as P PG output trigger
• A/D convert er conversion start tr igger c an be gener ated
⎯ Channel 0 to 5 compare match A/input capture A signals can be used as A/D converter
conversion start trigger
• Module stop mode can be set
⎯ As the initial settin g, TPU operation is halted. Register access is enabled by exiting module
stop mode
Note: * The DMAC is not supported in the H8S/2321.
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Sep. 27, 2007 Page 443 of 1268
REJ09B0220-0600
Table 10.1 lists the functions of the TP U.
Table 10.1 TPU Funct ions
Item Channel 0 Channel 1 Channel 2 Channel 3 Channel 4 Channel 5
Count clock φ/1
φ/4
φ/16
φ/64
TCLKA
TCLKB
TCLKC
TCLKD
φ/1
φ/4
φ/16
φ/64
φ/256
TCLKA
TCLKB
φ/1
φ/4
φ/16
φ/64
φ/1024
TCLKA
TCLKB
TCLKC
φ/1
φ/4
φ/16
φ/64
φ/256
φ/1024
φ/4096
TCLKA
φ/1
φ/4
φ/16
φ/64
φ/1024
TCLKA
TCLKC
φ/1
φ/4
φ/16
φ/64
φ/256
TCLKA
TCLKC
TCLKD
General registers TGR0A
TGR0B TGR1A
TGR1B TGR2A
TGR2B TGR3A
TGR3B TGR4A
TGR4B TGR5A
TGR5B
General registers/
buffer registers TGR0C
TGR0D — — TGR3C
TGR3D — —
I/O pins TIOCA0
TIOCB0
TIOCC0
TIOCD0
TIOCA1
TIOCB1 TIOCA2
TIOCB2 TIOCA3
TIOCB3
TIOCC3
TIOCD3
TIOCA4
TIOCB4 TIOCA5
TIOCB5
Counter clear
function TGR
compare
match or
input
capture
TGR
compare
match or
input
capture
TGR
compare
match or
input
capture
TGR
compare
match or
input
capture
TGR
compare
match or
input
capture
TGR
compare
match or
input
capture
Compare 0 output
match 1 output
output Toggle
output
Input capture
function
Synchronous
operation
PWM mode
Phase counting
mode — —
Buffer operation — — — —
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Sep. 27, 2007 Page 444 of 1268
REJ09B0220-0600
Item Channel 0 Channel 1 Channel 2 Channel 3 Channel 4 Channel 5
DMAC*
activation TGR0A
compare
match or
input capture
TGR1A
compare
match or
input capture
TGR2A
compare
match or
input capture
TGR3A
compare
match or
input capture
TGR4A
compare
match or
input capture
TGR5A
compare
match or
input capture
DTC
activation TGR
compare
match or
input capture
TGR
compare
match or
input capture
TGR
compare
match or
input capture
TGR
compare
match or
input capture
TGR
compare
match or
input capture
TGR
compare
match or
input capture
A/D con-
version
start
trigger
TGR0A
compare
match or
input capture
TGR1A
compare
match or
input capture
TGR2A
compare
match or
input capture
TGR3A
compare
match or
input capture
TGR4A
compare
match or
input capture
TGR5A
compare
match or
input capture
PPG
trigger TGR0A/
TGR0B
compare
match or
input capture
TGR1A/
TGR1B
compare
match or
input capture
TGR2A/
TGR2B
compare
match or
input capture
TGR3A/
TGR3B
compare
match or
input capture
— —
Interrupt
sources 5 sources
• Compare
match or
input
capture 0A
• Compare
match or
input
capture 0B
• Compare
match or
input
capture 0C
• Compare
match or
input
capture 0D
• Overflow
4 sources
• Compare
match or
input
capture 1A
• Compare
match or
input
capture 1B
• Overflow
• Underflow
4 sources
• Compare
match or
input
capture 2A
• Compare
match or
input
capture 2B
• Overflow
• Underflow
5 sources
• Compare
match or
input
capture 3A
• Compare
match or
input
capture 3B
• Compare
match or
input
capture 3C
• Compare
match or
input
capture 3D
• Overflow
4 sources
• Compare
match or
input
capture 4A
• Compare
match or
input
capture 4B
• Overflow
• Underflow
4 sources
• Compare
match or
input
capture 5A
• Compare
match or
input
capture 5B
• Overflow
• Underflow
Legend:
: Possible
—: Not possible
Note: * The DMAC is not supported in the H8S/2321.
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Sep. 27, 2007 Page 445 of 1268
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10.1.2 Block Diagram
Figure 10.1 shows a block diagram of the TPU.
Channel 3
TMDR
TIORL
TSR
TCR
TIORH
TIER
TGRA
TCNT
TGRB
TGRC
TGRD
Channel 4
TMDR
TSR
TCR
TIOR
TIER
TGRA
TCNT
TGRB
Control logic TMDR
TSR
TCR
TIOR
TIER
TGRA
TCNT
TGRB
Control logic for channels 3 to 5
TGRA
TCNT
TGRB
TGRC
Channel 1
TMDR
TSR
TCR
TIOR
TIER
TGRA
TCNT
TGRB
Channel 0
TMDR
TSR
TCR
TIORH
TIER
Control logic for channels 0 to 2
TGRD
TSYRTSTR
Input/output pins
TIOCA3
TIOCB3
TIOCC3
TIOCD3
TIOCA4
TIOCB4
TIOCA5
TIOCB5
Clock input
φ/1
φ/4
φ/16
φ/64
φ/256
φ/1024
φ/4096
TCLKA
TCLKB
TCLKC
TCLKD
Input/output pins
TIOCA0
TIOCB0
TIOCC0
TIOCD0
TIOCA1
TIOCB1
TIOCA2
TIOCB2
Interrupt request signals
Channel 3:
Channel 4:
Channel 5:
Interrupt request signals
Channel 0:
Channel 1:
Channel 2:
Internal data bus
A/D conversion start request signal
PPG output trigger signal
TIORL
Module data bus
TGI3A
TGI3B
TGI3C
TGI3D
TCI3V
TGI4A
TGI4B
TCI4V
TCI4U
TGI5A
TGI5B
TCI5V
TCI5U
TGI0A
TGI0B
TGI0C
TGI0D
TCI0V
TGI1A
TGI1B
TCI1V
TCI1U
TGI2A
TGI2B
TCI2V
TCI2U
Channel 3:
Channel 4:
Channel 5:
Internal clock:
External clock:
Channel 0:
Channel 1:
Channel 2:
TMDR
TSR
TCR
TIOR
TIER
TGRA
TCNT
TGRB
Channel 2 Common Channel 5
Bus interface
Figure 10.1 Block Diagram of TPU
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Sep. 27, 2007 Page 446 of 1268
REJ09B0220-0600
10.1.3 Pin Configuration
Table 10.2 summarizes the TPU pins.
Table 10.2 TPU Pins
Channel Name Symbol I/O Function
All Clock input A TCLKA Input External clock A input pin
(Channel 1 and 5 phase counting mode A
phase input)
Clock input B TCLKB Input External clock B input pin
(Channel 1 and 5 phase counting mode B
phase input)
Clock input C TCLKC Input External clock C input pin
(Channel 2 and 4 phase counting mode A
phase input)
Clock input D TCLKD Input External clock D input pin
(Channel 2 and 4 phase counting mode B
phase input)
0 Input capture/out
compare match A0 TIOCA0 I/O TGR0A input capture input/output compare
output/PWM outp ut pin
Input capture/out
compare match B0 TIOCB0 I/O TGR0B input capture input/output compare
output/PWM outp ut pin
Input capture/out
compare match C0 TIOCC0 I/O TGR0C input capture input/output compare
output/PWM outp ut pin
Input capture/out
compare match D0 TIOCD0 I/O TGR0D input capture input/output compare
output/PWM outp ut pin
1 Input capture/out
compare match A1 TIOCA1 I/O TGR1A input capture input/output compare
output/PWM outp ut pin
Input capture/out
compare match B1 TIOCB1 I/O TGR1B input capture input/output compare
output/PWM outp ut pin
2 Input capture/out
compare match A2 TIOCA2 I/O TGR2A input capture input/output compare
output/PWM outp ut pin
Input capture/out
compare match B2 TIOCB2 I/O TGR2B input capture input/output compare
output/PWM outp ut pin
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Sep. 27, 2007 Page 447 of 1268
REJ09B0220-0600
Channel Name Symbol I/O Function
3 Input capture/out
compare match A3 TIOCA3 I/O TGR3A input capture input/output compare
output/PWM outp ut pin
Input capture/out
compare match B3 TIOCB3 I/O TGR3B input capture input/output compare
output/PWM outp ut pin
Input capture/out
compare match C3 TIOCC3 I/O TGR3C input capture input/output compare
output/PWM outp ut pin
Input capture/out
compare match D3 TIOCD3 I/O TGR3D input capture input/output compare
output/PWM outp ut pin
4 Input capture/out
compare match A4 TIOCA4 I/O TGR4A input capture input/output compare
output/PWM outp ut pin
Input capture/out
compare match B4 TIOCB4 I/O TGR4B input capture input/output compare
output/PWM outp ut pin
5 Input capture/out
compare match A5 TIOCA5 I/O TGR5A input capture input/output compare
output/PWM outp ut pin
Input capture/out
compare match B5 TIOCB5 I/O TGR5B input capture input/output compare
output/PWM outp ut pin
Section 10 16-Bit Timer Pulse Unit (TPU)
Rev.6.00 Sep. 27, 2007 Page 448 of 1268
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10.1.4 Register Configuration
Table 10.3 summarizes the TPU registers.
Table 10.3 TPU Registers
Channel Name Abbreviation R/W Initial Value Address*1
0 Timer control register 0 TCR0 R/W H'00 H'FFD0
Timer mode register 0 TMDR0 R/W H'C0 H'FFD1
Timer I/O control register 0H TIOR0H R/W H'00 H'FFD2
Timer I/O control register 0L TIOR0L R/W H'00 H'FFD3
Timer interrupt enable register 0 TIER0 R/W H'40 H'FFD4
Timer status register 0 TSR0 R/(W)*2 H'C0 H'FFD5
Timer counter 0 TCNT0 R/W H'0000 H'FFD6
Timer general register 0A TGR0A R/W H'FFFF H'FFD8
Timer general register 0B TGR0B R/W H'FFFF H'FFDA
Timer general register 0C TGR0C R/W H'FFFF H'FFDC
Timer general register 0D TGR0D R/W H'FFFF H'FFDE
1 Timer control register 1 TCR1 R/W H'00 H'FFE0
Timer mode register 1 TMDR1 R/W H'C0 H'FFE1
Timer I/O control register 1 TIOR1 R/W H'00 H'FFE2
Timer interrupt enable register 1 TIER1 R/W H'40 H'FFE4
Timer status register 1 TSR1 R/(W)*2 H'C0 H'FFE5
Timer counter 1 TCNT1 R/W H'0000 H'FFE6
Timer general register 1A TGR1A R/W H'FFFF H'FFE8
Timer general register 1B TGR1B R/W H'FFFF H'FFEA
2 Timer control register 2 TCR2 R/W H'00 H'FFF0
Timer mode register 2 TMDR2 R/W H'C0 H'FFF1
Timer I/O control register 2 TIOR2 R/W H'00 H'FFF2
Timer interrupt enable register 2 TIER2 R/W H'40 H'FFF4
Timer status register 2 TSR2 R/(W)*2 H'C0 H'FFF5
Timer counter 2 TCNT2 R/W H'0000 H'FFF6
Timer general register 2A TGR2A R/W H'FFFF H'FFF8
Timer general register 2B TGR2B R/W H'FFFF H'FFFA
Section 10 16-Bit Timer Pulse Unit (TPU)
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Channel Name Abbreviation R/W Initial Value Address*1
3 Timer control register 3 TCR3 R/W H'00 H'FE80
Timer mode register 3 TMDR3 R/W H'C0 H'FE81
Timer I/O control register 3H TIOR3H R/W H'00 H'FE82
Timer I/O control register 3L TIOR3L R/W H'00 H'FE83
Timer interrupt enable register 3 TIER3 R/W H'40 H'FE84
Timer status register 3 TSR3 R/(W)*2 H'C0 H'FE85
Timer counter 3 TCNT3 R/W H'0000 H'FE86
Timer general register 3A TGR3A R/W H'FFFF H'FE88
Timer general register 3B TGR3B R/W H'FFFF H'FE8A
Timer general register 3C TGR3C R/W H'FFFF H'FE8C
Timer general register 3D TGR3D R/W H'FFFF H'FE8E
4 Timer control register 4 TCR4 R/W H'00 H'FE90
Timer mode register 4 TMDR4 R/W H'C0 H'FE91
Timer I/O control register 4 TIOR4 R/W H'00 H'FE92
Timer interrupt enable register 4 TIER4 R/W H'40 H'FE94
Timer status register 4 TSR4 R/(W)*2 H'C0 H'FE95
Timer counter 4 TCNT4 R/W H'0000 H'FE96
Timer general register 4A TGR4A R/W H'FFFF H'FE98
Timer general register 4B TGR4B R/W H'FFFF H'FE9A
5 Timer control register 5 TCR5 R/W H'00 H'FEA0
Timer mode register 5 TMDR5 R/W H'C0 H'FEA1
Timer I/O control register 5 TIOR5 R/W H'00 H'FEA2
Timer interrupt enable register 5 TIER5 R/W H'40 H'FEA4
Timer status register 5 TSR5 R/(W)*2 H'C0 H'FEA5
Timer counter 5 TCNT5 R/W H'0000 H'FEA6
Timer general register 5A TGR5A R/W H'FFFF H'FEA8
Timer general register 5B TGR5B R/W H'FFFF H'FEAA
All Timer start register TSTR R/W H'00 H'FFC0
Timer synchro register TSYR R/W H'00 H'FFC1
Module stop control register MSTPCR R/W H'3FFF H'FF3C
Notes: 1. Lower 16 bits of the address.
2. Can only be written with 0 for flag clearing.
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.2 Register Descriptions
10.2.1 Timer Control Registers (TCR)
Channel 0: TCR0
Channel 3: TCR3
Bit : 7 6 5 4 3 2 1 0
CCLR2 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
Channel 1: TCR1
Channel 2: TCR2
Channel 4: TCR4
Channel 5: TCR5
Bit : 7 6 5 4 3 2 1 0
— CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0
Initial value : 0 0 0 0 0 0 0 0
R/W : — R/W R/W R/W R/W R/W R/W R/W
The TCR registers are 8-bit registers that control the TCNT channels. The TPU has six TCR
registers, one for each of channels 0 to 5. The TCR registers are initialized to H'00 by a reset and
in hardware standby mode.
TCR register settings should be made only when TCNT operation is stopped.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Bits 7 to 5—Counter Clear 2 to 0 (CCLR2 to CCLR0): These bits select the TCNT counter
clearing source.
Channel Bit 7
CCLR2 Bit 6
CCLR1 Bit 5
CCLR0
Description
0, 3 0 0 0 TCNT clearing disabled (Initial value)
1 TCNT cleared by TGRA compare match/input
capture
1 0 TCNT cleared by TGRB compare match/input
capture
1 TCNT cleared by counter clearing for another
channel perfor mi ng sy nchro no us clearing/
synchronous operation*1
1 0 0 TCNT clearing disabled
1 TCNT cleared by TGRC compare match/input
capture*2
1 0 TCNT cleared by TGRD compare match/input
capture*2
1 TCNT cleared by counter clearing for another
channel perfor mi ng sy nchro no us clearing/
synchronous operation*1
Channel Bit 7
Reserved*3Bit 6
CCLR1 Bit 5
CCLR0
Description
1, 2, 4, 5 0 0 0 TCNT clearing disabled (Initial value)
1 TCNT cleared by TGRA compare match/input
capture
1 0 TCNT cleared by TGRB compare match/input
capture
1 TCNT cleared by counter clearing for another
channel perfor mi ng sy nchro no us clearing/
synchronous operation*1
Notes: 1. Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1.
2. When TGRC or TGRD is used as a buffer register, TCNT is not cleared because the
buffer register setting has priority, and compare match/input capture does not occur.
3. Bit 7 is reserved in channels 1, 2, 4, and 5. It is always read as 0 and cannot be
modified.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Bits 4 and 3—Clock Edge 1 and 0 (CKEG1, CKEG0): These bits select the input clock edge.
When the input clock is counted using both edges, the input clock period is halved (e.g. φ/4 both
edges = φ/2 rising edge). If phase counting mode is used on channels 1, 2, 4, and 5, this setting is
ignored and the phase counting mode setting has priority.
Bit 4
CKEG1 Bit 3
CKEG0
Description
0 0 Count at rising edge (Initial value)
1 Count at falling edge
1 — Count at both edges
Note: Internal clock edge selection is valid when the input clock is φ/4 or slower. This setting is
ignored if the input clo ck is φ/1, or when overflow/underflow of another channel is selected.
Bits 2 to 0—Time Prescaler 2 to 0 (TPSC2 to TPSC0): These bits select the TCNT counter
clock. The clock source can be selected independently for each channel. Table 10.4 shows the
clock sources that can be set for each channel.
Table 10.4 TPU Clock Sources
I n ternal Clock External Clock
Channel φ/1 φ/4 φ/16 φ/64 φ/256 φ/1024 φ/4096 TCLKA TCLKB TCLKC TCLKD
Overflow/
Underflow
on Another
Channel
0 o o o o o o o o
1 o o o o o o o o
2 o o o o o o o o
3 o o o o o o o o
4 o o o o o o o o
5 o o o o o o o o
Legend:
o: Setting
Blank: No setting
Section 10 16-Bit Timer Pulse Unit (TPU)
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Channel Bit 2
TPSC2 Bit 1
TPSC1 Bit 0
TPSC0
Description
0 0 0 0 Internal clock: counts on φ/1 (Initial value)
1 Internal clock: counts on φ/4
1 0 Internal clock: counts on φ/16
1 Internal clock: counts on φ/64
1 0 0 External clock: counts on TCLKA pin input
1 External clock: counts on TCLKB pin input
1 0 External clock: counts on TCLKC pin input
1 External clock: counts on TCLKD pin input
Channel Bit 2
TPSC2 Bit 1
TPSC1 Bit 0
TPSC0
Description
1 0 0 0 Internal clock: counts on φ/1 (Initial value)
1 Internal clock: counts on φ/4
1 0 Internal clock: counts on φ/16
1 Internal clock: counts on φ/64
1 0 0 External clock: counts on TCLKA pin input
1 External clock: counts on TCLKB pin input
1 0 Internal clock: counts on φ/256
1 Counts on TCNT2 overflow/underflow
Note: This setting is ignored when channel 1 is in phase counting mode.
Channel Bit 2
TPSC2 Bit 1
TPSC1 Bit 0
TPSC0
Description
2 0 0 0 Internal clock: counts on φ/1 (Initial value)
1 Internal clock: counts on φ/4
1 0 Internal clock: counts on φ/16
1 Internal clock: counts on φ/64
1 0 0 External clock: counts on TCLKA pin input
1 External clock: counts on TCLKB pin input
1 0 External clock: counts on TCLKC pin input
1 Internal clock: counts on φ/1024
Note: This setting is ignored when channel 2 is in phase counting mode.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Channel Bit 2
TPSC2 Bit 1
TPSC1 Bit 0
TPSC0
Description
3 0 0 0 Internal clock: counts on φ/1 (Initial value)
1 Internal clock: counts on φ/4
1 0 Internal clock: counts on φ/16
1 Internal clock: counts on φ/64
1 0 0 External clock: counts on TCLKA pin input
1 Internal clock: counts on φ/1024
1 0 Internal clock: counts on φ/256
1 Internal clock: counts on φ/4096
Channel Bit 2
TPSC2 Bit 1
TPSC1 Bit 0
TPSC0
Description
4 0 0 0 Internal clock: counts on φ/1 (Initial value)
1 Internal clock: counts on φ/4
1 0 Internal clock: counts on φ/16
1 Internal clock: counts on φ/64
1 0 0 External clock: counts on TCLKA pin input
1 External clock: counts on TCLKC pin input
1 0 Internal clock: counts on φ/1024
1 Counts on TCNT5 overflow/underflow
Note: This setting is ignored when channel 4 is in phase counting mode.
Channel Bit 2
TPSC2 Bit 1
TPSC1 Bit 0
TPSC0
Description
5 0 0 0 Internal clock: counts on φ/1 (Initial value)
1 Internal clock: counts on φ/4
1 0 Internal clock: counts on φ/16
1 Internal clock: counts on φ/64
1 0 0 External clock: counts on TCLKA pin input
1 External clock: counts on TCLKC pin input
1 0 Internal clock: counts on φ/256
1 External clock: counts on TCLKD pin input
Note: This setting is ignored when channel 5 is in phase counting mode.
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.2.2 Timer Mode Registers (TMDR)
Channel 0: TMDR0
Channel 3: TMDR3
Bit : 7 6 5 4 3 2 1 0
— — BFB BFA MD3 MD2 MD1 MD0
Initial value : 1 1 0 0 0 0 0 0
R/W : — — R/W R/W R/W R/W R/W R/W
Channel 1: TMDR1
Channel 2: TMDR2
Channel 4: TMDR4
Channel 5: TMDR5
Bit : 7 6 5 4 3 2 1 0
— — — — MD3 MD2 MD1 MD0
Initial value : 1 1 0 0 0 0 0 0
R/W : — — — — R/W R/W R/W R/W
The TMDR registers are 8-bit readable/writable registers that are used to set the operating mode
for each channel. The TPU has six TMDR registers, one for each channel. The T MDR registers
are initialized to H'C0 by a reset and in hardware standby mode.
TMDR register settings should be made only when TCNT operation is stopped.
Bits 7 and 6—Reserved: These bits cannot be modified and are always read as 1.
Bit 5—Buffer Operation B (BFB): Specifies whether TGRB is to operate in the normal way, or
TGRB and TGRD are to be used together for buffer operation. When TGRD is used as a buffer
register, TGRD input capture/output compare is not generated.
In channels 1, 2, 4, and 5, which have no TGRD, bit 5 is reserved. It is always read as 0 and
cannot be modified.
Bit 5
BFB
Description
0 TGRB operates normally (Initial value)
1 TGRB and TGRD used together for buffer operation
Section 10 16-Bit Timer Pulse Unit (TPU)
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Bit 4—Buffer Operation A (BFA): Specifies whether TGRA is to operate in the normal way, or
TGRA and TGRC are to be used together for buffer operation. When TGRC is used as a buffer
register, TGRC input capture/output compare is not generated.
In channels 1, 2, 4, and 5, which have no TGRC, bit 4 is reserved. It is always read as 0 and
cannot be modified.
Bit 4
BFA
Description
0 TGRA operates normally (Initial value)
1 TGRA and TGRC used together for buffer operation
Bits 3 to 0—Modes 3 to 0 (MD3 to MD0): These bits are used to set the timer operating mode.
Bit 3
MD3*1 Bit 2
MD2*2 Bit 1
MD1 Bit 0
MD0
Description
0 0 0 0 Normal operation (Initial value)
1 Reserved
1 0 PWM mode 1
1 PWM mode 2
1 0 0 Phase counting mode 1
1 Phase counting mode 2
1 0 Phase counting mode 3
1 Phase counting mode 4
1 * * * —
*: Don’t care
Notes: 1. MD3 is a reserved bit. In a write, it should always be written with 0.
2. Phase co unti ng mode cannot be set for channe ls 0 and 3. For these chan nel s, 0 should
always be written to MD2.
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.2.3 Timer I/O Control Registers (TIOR)
Channel 0: TIOR0H
Channel 1: TIOR1
Channel 2: TIOR2
Channel 3: TIOR3H
Channel 4: TIOR4
Channel 5: TIOR5
Bit : 7 6 5 4 3 2 1 0
IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
Channel 0: TIOR0L
Channel 3: TIOR3L
Bit : 7 6 5 4 3 2 1 0
IOD3 IOD2 IOD1 IOD0 IOC3 IOC2 IOC1 IOC0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
Note: When TGRC or TGRD is designated for buffer operation, this setting is invalid and the
register operates as a buffer register.
The TIOR registers are 8-bit registers that control the TGR registers. The TPU has eight TIOR
registers, two each for channels 0 and 3, and one each for channels 1, 2, 4, and 5. The TIOR
registers are initialized to H'00 by a reset and in hardware standby mode.
Care is required since TIOR is affected by the TMDR settin g. The initial output sp ecified b y TIOR
is valid when the counter is stopped (the CST bit in TSTR is cleared to 0). Note also that, in PWM
mode 2, the output at the point at which the counter is cleared to 0 is specified.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Bits 7 to 4— I/O Control B3 to B0 (IOB3 to IOB0)
I/O Control D3 to D0 (IOD3 to IOD0):
Bits IOB3 to IOB0 specify the function of TGRB.
Bits IOD3 to IOD0 sp ecify the function of TGRD.
Channel Bit 7
IOB3 Bit 6
IOB2 Bit 5
IOB1 Bit 4
IOB0
Description
0 0 0 0 0 Output disabled (Initial value)
1 1
0
1
TGR0B
is output
compare
register
Initial output is 0
output 0 output at compare match
1 output at compare match
Toggle output at compare
match
1 0 0 Output disabled
1 0 output at compare match
1 0 1 output at compare match
1
Initial output is 1
output
Toggle output at compare
match
1 0 0 0 Input capture at rising edge
1 Input capture at falling edge
1 *
TGR0B
is input
capture
register
Capture input
source is
TIOCB0 pin Input capture at both edges
1 * * Capture input
source is channel
1/count clo ck
Input capture at TCNT1
count-up/count-down*1
*: Don’t care
Note: 1. When bits TPSC2 to TPSC0 in TCR1 are set to B'000 and φ/1 is used as the TCNT1
count clock, this setting is invalid and input capture is not generated.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Channel Bit 7
IOD3 Bit 6
IOD2 Bit 5
IOD1 Bit 4
IOD0
Description
0 0 0 0 0 Output disabled (Initial value)
1 1
0
1
TGR0D
is output
compare
register*2
Initial output is 0
output 0 output at compare match
1 output at compare match
Toggle output at compare
match
1 0 0 Output disabled
1 0 output at compare match
1 0 1 output at compare match
1
Initial output is 1
output
Toggle output at compare
match
1 0 0 0 Input capture at rising edge
1 Input capture at falling edge
1 *
TGR0D
is input
capture
register*2
Capture input
source is
TIOCD0 pin Input capture at both edges
1 * * Capture input
source is channel
1/count clo ck
Input capture at TCNT1
count-up/count-down*1
*: Don’t care
Notes: 1. When bits TPSC2 to TPSC0 in TCR1 are set to B'000 and φ/1 is used as the TCNT1
count clock, this setting is invalid and input capture is not generated.
2. When the BFB bit in TMDR0 is set to 1 and TGR0D is used as a buffer register, this
setting is invalid and input capture/output compare is not generated.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Channel Bit 7
IOB3 Bit 6
IOB2 Bit 5
IOB1 Bit 4
IOB0
Description
1 0 0 0 0 Output disabled (Initial value)
1 1
0
1
TGR1B
is output
compare
register
Initial output is 0
output 0 output at compare match
1 output at compare match
Toggle output at compare
match
1 0 0 Output disabled
1 0 output at compare match
1 0 1 output at compare match
1
Initial output is 1
output
Toggle output at compare
match
1 0 0 0 Input capture at rising edge
1 Input capture at falling edge
1 *
Capture input
source is
TIOCB1 pin Input capture at both edges
1 * *
TGR1B
is input
capture
register Capture input
source is TGR0C
compare match/
input capture
Input capture at generat ion of
TGR0C compare match/input
capture
*: Don’t care
Channel Bit 7
IOB3 Bit 6
IOB2 Bit 5
IOB1 Bit 4
IOB0
Description
2 0 0 0 0 Output disabled (Initial value)
1 1
0
1
TGR2B
is output
compare
register
Initial output is 0
output 0 output at compare match
1 output at compare match
Toggle output at compare
match
1 0 0 Output disabled
1 0 output at compare match
1 0 1 output at compare match
1
Initial output is 1
output
Toggle output at compare
match
1 * 0 0 Capture input Input capture at rising edge
1 source is Input capture at falling edge
1 *
TGR2B
is input
capture
register TIOCB2 pin Input capture at both edges
*: Don’t care
Section 10 16-Bit Timer Pulse Unit (TPU)
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Channel Bit 7
IOB3 Bit 6
IOB2 Bit 5
IOB1 Bit 4
IOB0
Description
3 0 0 0 0 Output disabled (Initial value)
1 1
0
1
TGR3B
is output
compare
register
Initial output is 0
output 0 output at compare match
1 output at compare match
Toggle output at compare
match
1 0 0 Output disabled
1 0 output at compare match
1 0 1 output at compare match
1
Initial output is 1
output
Toggle output at compare
match
1 0 0 0 Input capture at rising edge
1 Input capture at falling edge
1 *
TGR3B
is input
capture
register
Capture input
source is
TIOCB3 pin Input capture at both edges
1 * * Capture input
source is channel
4/count clo ck
Input capture at TCNT4
count-up/count-down*1
*: Don’t care
Note: 1. When bits TPSC2 to TPSC0 in TCR4 are set to B'000 and φ/1 is used as the TCNT4
count clock, this setting is invalid and input capture is not generated.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Channel Bit 7
IOD3 Bit 6
IOD2 Bit 5
IOD1 Bit 4
IOD0
Description
3 0 0 0 0 Output disabled (Initial value)
1 1
0
1
TGR3D
is output
compare
register*2
Initial output is 0
output 0 output at compare match
1 output at compare match
Toggle output at compare
match
1 0 0 Output disabled
1 0 output at compare match
1 0 1 output at compare match
1
Initial output is 1
output
Toggle output at compare
match
1 0 0 0 Input capture at rising edge
1 Input capture at falling edge
1 *
TGR3D
is input
capture
register*2
Capture input
source is
TIOCD3 pin Input capture at both edges
1 * * Capture input
source is channel
4/count clo ck
Input capture at TCNT4 count-
up/count-down*1
*: Don’t care
Notes: 1. When bits TPSC2 to TPSC0 in TCR4 are set to B'000 and φ/1 is used as the TCNT4
count clock, this setting is invalid and input capture is not generated.
2. When the BFB bit in TMDR3 is set to 1 and TGR3D is used as a buffer register, this
setting is invalid and input capture/output compare is not generated.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Channel Bit 7
IOB3 Bit 6
IOB2 Bit 5
IOB1 Bit 4
IOB0
Description
4 0 0 0 0 Output disabled (Initial value)
1 1
0
1
TGR4B
is output
compare
register
Initial output is 0
output 0 output at compare match
1 output at compare match
Toggle output at compare
match
1 0 0 Output disabled
1 0 output at compare match
1 0 1 output at compare match
1
Initial output is 1
output
Toggle output at compare
match
1 0 0 0 Input capture at rising edge
1 Input capture at falling edge
1 *
TGR4B
is input
capture
register
Capture input
source is
TIOCB4 pin Input capture at both edges
1 * * Capture input
source is TGR3C
compare match/
input capture
Input capture at generation of
TGR3C compare match/
input capture
*: Don’t care
Channel Bit 7
IOB3 Bit 6
IOB2 Bit 5
IOB1 Bit 4
IOB0
Description
5 0 0 0 0 Output disabled (Initial value)
1 1
0
1
TGR5B
is output
compare
register
Initial output is 0
output 0 output at compare match
1 output at compare match
Toggle output at compare
match
1 0 0 Output disabled
1 0 output at compare match
1 0 1 output at compare match
1
Initial output is 1
output
Toggle output at compare
match
1 * 0 0 Input capture at rising edge
1 Input capture at falling edge
1 *
TGR5B
is input
capture
register
Capture input
source is TIOCB5
pin Input capture at both edges
*: Don’t care
Section 10 16-Bit Timer Pulse Unit (TPU)
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Bits 3 to 0— I/O Control A3 to A0 (IOA3 to IOA0)
I/O Control C3 to C0 (IOC3 to IOC0):
IOA3 to IOA0 specify the function of TGRA.
IOC3 to IOC0 specif y the fun ction of TGRC.
Channel Bit 3
IOA3 Bit 2
IOA2 Bit 1
IOA1 Bit 0
IOA0
Description
0 0 0 0 0 Output disabled (Initial value)
1 1
0
1
TGR0A
is output
compare
register
Initial output is 0
output 0 output at compare match
1 output at compare match
Toggle output at compare
match
1 0 0 Output disabled
1 0 output at compare match
1 0 1 output at compare match
1
Initial output is 1
output
Toggle output at compare
match
1 0 0 0 Input capture at rising edge
1 Input capture at falling edge
1 *
TGR0A is
input
capture
register
Capture input
source is
TIOCA0 pin Input capture at both edges
1 * * Capture input
source is channel
1/ count clock
Input capture at TCNT1 count-
up/count-down
*: Don’t care
Section 10 16-Bit Timer Pulse Unit (TPU)
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Channel Bit 3
IOC3 Bit 2
IOC2 Bit 1
IOC1 Bit 0
IOC0
Description
0 0 0 0 0 Output disabled (Initial value)
1 1
0
1
TGR0C
is output
compare
register*1
Initial output is 0
output 0 output at compare match
1 output at compare match
Toggle output at compare
match
1 0 0 Output disabled
1 0 output at compare match
1 0 1 output at compare match
1
Initial output is 1
output
Toggle output at compare
match
1 0 0 0 Input capture at rising edge
1 Input capture at falling edge
1 *
TGR0C
is input
capture
register*1
Capture input
source is
TIOCC0 pin Input capture at both edges
1 * * Capture input
source is channel
1/count clo ck
Input capture at TCNT1 count-
up/count-down
*: Don’t care
Note: 1. When the BFA bit in TMDR0 is set to 1 and TGR0C is used as a buffer register, this
setting is invalid and input capture/output compare is not generated.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Channel Bit 3
IOA3 Bit 2
IOA2 Bit 1
IOA1 Bit 0
IOA0
Description
1 0 0 0 0 Output disabled (Initial value)
1 1
0
1
TGR1A
is output
compare
register
Initial output is 0
output 0 output at compare match
1 output at compare match
Toggle output at compare
match
1 0 0 Output disabled
1 0 output at compare match
1 0 1 output at compare match
1
Initial output is 1
output
Toggle output at compare
match
1 0 0 0 Input capture at rising edge
1 Input capture at falling edge
1 *
TGR1A
is input
capture
register
Capture input
source is
TIOCA1 pin Input capture at both edges
1 * * Capture input
source is TGR0A
compare match/
input capture
Input capture at generat ion of
channel 0/TG R 0A compare
match/input cap ture
*: Don’t care
Section 10 16-Bit Timer Pulse Unit (TPU)
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Channel Bit 3
IOA3 Bit 2
IOA2 Bit 1
IOA1 Bit 0
IOA0
Description
2 0 0 0 0 Output disabled (Initial val
u
1 1
0
1
TGR2A
is output
compare
register
Initial output is
0 output 0 output at compare match
1 output at compare match
Toggle output at compare
match
1 0 0 Output disabled
1 0 output at compare match
1 0 1 output at compare match
1
Initial output is
1 output
Toggle output at compare
match
1 * 0 0 TGR2A is Capture input Input capture at rising edge
1 input capture source is Input capture at falling edge
1 * register TIOCA2 pin Input capture at both edges
*: Don’t care
Channel Bit 3
IOA3 Bit 2
IOA2 Bit 1
IOA1 Bit 0
IOA0
Description
3 0 0 0 0 Output disabled (Initial value)
1 1
0
1
TGR3A
is output
compare
register
Initial output is 0
output 0 output at compare match
1 output at compare match
Toggle output at compare
match
1 0 0 Output disabled
1 0 output at compare match
1 0 1 output at compare match
1
Initial output is 1
output
Toggle output at compare
match
1 0 0 0 Input capture at rising edge
1 Input capture at falling edge
1 *
TGR3A
is input
capture
register
Capture input
source is
TIOCA3 pin Input capture at both edges
1 * * Capture input
source is channel
4/count clo ck
Input capture at TCNT4 count-
up/count-down
*: Don’t care
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Channel Bit 3
IOC3 Bit 2
IOC2 Bit 1
IOC1 Bit 0
IOC0
Description
3 0 0 0 0 Output disabled (Initial value)
1 1
0
1
TGR3C
is output
compare
register*1
Initial output is 0
output 0 output at compare match
1 output at compare match
Toggle output at compare
match
1 0 0 Output disabled
1 0 output at compare match
1 0 1 output at compare match
1
Initial output is 1
output
Toggle output at compare
match
1 0 0 0 Input capture at rising edge
1 Input capture at falling edge
1 *
TGR3C
is input
capture
register*1
Capture input
source is
TIOCC3 pin Input capture at both edges
1 * * Capture input
source is channel
4/count clo ck
Input capture at TCNT4 count-
up/count-down
*: Don’t care
Note: 1. When the BFA bit in TMDR3 is set to 1 and TGR3C is used as a buffer register, this
setting is invalid and input capture/output compare is not generated.
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Channel Bit 3
IOA3 Bit 2
IOA2 Bit 1
IOA1 Bit 0
IOA0
Description
4 0 0 0 0 Output disabled (Initial value)
1 1
0
1
TGR4A
is output
compare
register
Initial output is 0
output 0 output at compare match
1 output at compare match
Toggle output at compare
match
1 0 0 Output disabled
1 0 output at compare match
1 0 1 output at compare match
1
Initial output is 1
output
Toggle output at compare
match
1 0 0 0 Input capture at rising edge
1 Input capture at falling edge
1 *
TGR4A
is input
capture
register
Capture input
source is
TIOCA4 pin Input capture at both edges
1 * * Capture input
source is TGR3A
compare match/
input capture
Input capture at generation of
TGR3A compare match/input
capture
*: Don’t care
Channel Bit 3
IOA3 Bit 2
IOA2 Bit 1
IOA1 Bit 0
IOA0
Description
5 0 0 0 0 Output disabled (Initial value)
1 1
0
1
TGR5A
is output
compare
register
Initial output is 0
output 0 output at compare match
1 output at compare match
Toggle output at compare
match
1 0 0 Output disabled
1 0 output at compare match
1 0 1 output at compare match
1
Initial output is 1
output
Toggle output at compare
match
1 * 0 0 Input capture at rising edge
1 Input capture at falling edge
1 *
TGR4A
is input
capture
register
Capture input
source is TIOCA4
pin Input capture at both edges
*: Don’t care
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10.2.4 Timer Interrupt Enable Registers (TIER)
Channel 0: TIER0
Channel 3: TIER3
Bit : 7 6 5 4 3 2 1 0
TTGE — — TCIEV TGIED TGIEC TGIEB TGIEA
Initial value : 0 1 0 0 0 0 0 0
R/W : R/W — — R/W R/W R/W R/W R/W
Channel 1: TIER1
Channel 2: TIER2
Channel 4: TIER4
Channel 5: TIER5
Bit : 7 6 5 4 3 2 1 0
TTGE — TCIEU TCIEV — — TGIEB TGIEA
Initial value : 0 1 0 0 0 0 0 0
R/W : R/W — R/W R/W — — R/W R/W
The TIER registers are 8-bit registers that control enabling or disabling of interrupt requests for
each channel. The TPU has six TIER registers, one for each channel. The TIER registers are
initialized to H'40 by a reset and in hardware standb y mode.
Bit 7—A/D Co nversion Star t Request Enable (TTGE): Enables or disables generation of A/D
conversion start requests by TGRA input capture/compare match.
Bit 7
TTGE
Description
0 A/D conversion start request generation disabled (Initial value)
1 A/D conversion start request generation enabled
Bit 6—Reserved: This bit cannot be modified and is always read as 1.
Bit 5—Underflow Interrupt Enable (TCIEU): Enables or disables interrupt requests (TCIU) by
the TCFU bit when the TCFU bit in TSR is set to 1 in cha nnels 1 and 2.
In channels 0 and 3, bit 5 is reserved. It is always read as 0 and cannot be modified.
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Bit 5
TCIEU
Description
0 Interrupt requests (TCIU) by TCFU disabled (Initial value)
1 Interrupt requests (TCIU) by TCFU enabled
Bit 4—Overflow Interrupt Enable (TCIEV): Enables or disables interrupt requests (TCIV) by
the TCFV bit when t he TCFV bit in TSR is set to 1 .
Bit 4
TCIEV
Description
0 Interrupt requests (TCIV) by TCFV disabled (Initial value)
1 Interrupt requests (TCIV) by TCFV enabled
Bit 3—TGR Interrupt Enable D (TGIED): Enables or disables interrupt requests (TGID) by the
TGFD bit when the TGFD b it in TSR is set to 1 in channels 0 and 3.
In channels 1, 2, 4, and 5, bit 3 is reserved. It is always read as 0 and cannot be modified.
Bit 3
TGIED
Description
0 Interrupt requests (TGID) by TGFD disabled (Initial value)
1 Interrupt requests (TGID) by TGFD enabled
Bit 2—TGR Interrupt Enable C (TGIEC): Enables or disables interrupt requests (TGIC) by the
TGFC bit when the TGFC bit in TSR is set to 1 in channels 0 and 3.
In channels 1, 2, 4, and 5, bit 2 is reserved. It is always read as 0 and cannot be modified.
Bit 2
TGIEC
Description
0 Interrupt requests (TGIC) by TGFC disabled (Initial value)
1 Interrupt requests (TGIC) by TGFC enabled
Bit 1—TGR Interrupt Enable B (TGIEB): Enables or disables interrupt requests (TGIB) by the
TGFB bit when the TGFB bit in TSR is set to 1.
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Bit 1
TGIEB
Description
0 Interrupt requests (TGIB) by TGFB disabled (Initial value)
1 Interrupt requests (TGIB) by TGFB enabled
Bit 0—TGR Interrupt Enable A (TGIEA): Enables or disables interrupt requests (TGIA) by the
TGFA bit when the TG FA bit in TSR is set to 1.
Bit 0
TGIEA
Description
0 Interrupt requests (TGIA) by TGFA disabled (Initial value)
1 Interrupt requests (TGIA) by TGFA enabled
10.2.5 Timer Status Registers (TSR)
Channel 0: TSR0
Channel 3: TSR3
Bit : 7 6 5 4 3 2 1 0
— — — TCFV TGFD TGFC TGFB TGFA
Initial value : 1 1 0 0 0 0 0 0
R/W : — — — R/(W)* R/(W)* R/(W)* R/(W)* R/(W)*
Note: * Only 0 can be written, to clear the flag.
Channel 1: TSR1
Channel 2: TSR2
Channel 4: TSR4
Channel 5: TSR5
Bit : 7 6 5 4 3 2 1 0
TCFD — TCFU TCFV — — TGFB TGFA
Initial value : 1 1 0 0 0 0 0 0
R/W : R — R/(W)* R/(W)* — — R/(W)* R/(W)*
Note: * Only 0 can be written, to clear the flag.
Section 10 16-Bit Timer Pulse Unit (TPU)
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The TSR registers are 8-bit registers that indicate the status of each channel. The TPU has six TSR
registers, one for each channel. The TSR registers are initialized to H'C0 by a reset and in
hardware standby mode.
Bit 7—Count Direction Flag (TCFD): Status flag that shows the direction in which TCNT
counts in channels 1, 2, 4, and 5.
In channels 0 and 3, bit 7 is reserved. It is always read as 1 and cannot be modified.
Bit 7
TCFD
Description
0 TCNT counts down
1 TCNT counts up (Initial value)
Bit 6—Reserved: This bit cannot be modified and is always read as 1.
Bit 5—Underflow Flag (TCFU): Status flag that indicates that TCNT underflow has occurred
when channels 1, 2, 4, and 5 are set to phase counting mode.
In channels 0 and 3, bit 5 is reserved. It is always read as 0 and cannot be modified.
Bit 5
TCFU
Description
0 [Clearing condition] (Initial value)
When 0 is written to TCFU after reading TCFU = 1
1 [Setting condition]
When the TCNT value underflows (changes from H'0000 to H'FFFF)
Bit 4—Overflow Flag (TCFV): Status flag that indicates that TCNT overflow has occurred.
Bit 4
TCFV
Description
0 [Clearing condition] (Initial value)
When 0 is written to TCFV after reading TCFV = 1
1 [Setting condition]
When the TCNT value overflows (changes from H'FFFF to H'0000 )
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Bit 3—Input Capture/Output Compare Flag D (TGFD): Status flag that indicates the
occurrence of TGRD input capture or compare match in channels 0 and 3.
In channels 1, 2, 4, and 5, bit 3 is reserved. It is always read as 0 and cannot be modified.
Bit 3
TGFD
Description
0 [Clearing conditions] (Initial value)
• When DTC is activated by TGID interrupt while DISEL bit of MRB in DTC is 0
• When 0 is written to TGFD after reading TGFD = 1
1 [Setting conditions]
• When TCNT = TGRD while TGRD is functioning as output compare register
• When TCNT value is transferred to TGRD by input capture signal while TGRD is
functioning as input capture register
Bit 2—Input Capture/Output Compare Flag C (TGFC): Status flag that indicates the
occurrence of TGRC input capture or compare match in channels 0 and 3.
In channels 1, 2, 4, and 5, bit 2 is reserved. It is always read as 0 and cannot be modified.
Bit 2
TGFC
Description
0 [Clearing conditions] (Initial value)
• When DTC is activated by TGIC interrupt while DISEL bit of MRB in DTC is 0
• When 0 is written to TGFC after reading TGFC = 1
1 [Setting conditions]
• When TCNT = TGRC while TGRC is functioning as output compare register
• When TCNT value is transferred to TGRC by input capture signal while TGRC is
functioning as input capture register
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Bit 1—Input Capture/Outpu t Compare Flag B (TGFB): Status flag that indicates the
occurrence of TGRB input capture or compare match.
Bit 1
TGFB
Description
0 [Clearing conditions] (Initial value)
• When DTC is activated by TGIB interrupt while DISEL bit of MRB in DTC is 0
• When 0 is written to TGFB after reading TGFB = 1
1 [Setting conditions]
• When TCNT = TGRB while TGRB is functioning as output compare register
• When TCNT value is transferred to TGRB by input capture signal while TGRB is
functioning as input capture register
Bit 0—Input Capture/Output Compare Flag A (TGFA): Status flag that indicates the
occurrence of TGRA input capture or compare match.
Bit 0
TGFA
Description
0 [Clearing conditions] (Initial value)
• When DTC is activated by TGIA interrupt while DISEL bit of MRB in DTC is 0
• When DMAC* is activated by TGIA interrupt while DTA bit of DMABCR in DMAC*
is 1
• When 0 is written to TGFA after reading TGFA = 1
1 [Setting conditions]
• When TCNT = TGRA while TGRA is functioning as output compare register
• When TCNT value is transferred to TGRA by input capture signal while TGRA is
functioning as input capture register
Note: * The DMAC is not supported in the H8S/2321.
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.2.6 Timer Counters (TCNT)
Channel 0: TCNT0 (up-counter)
Channel 1: TCNT1 (up/down-counter*)
Channel 2: TCNT2 (up/down-counter*)
Channel 3: TCNT3 (up-counter)
Channel 4: TCNT4 (up/down-counter*)
Channel 5: TCNT5 (up/down-counter*)
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: * These counters can be used as up/down-counters only in phase counting mode or when
counting overflow/underflow on another channel. In other cases they function as up-
counters.
The TCNT registers are 16-bit counters. The TPU has six TCNT counters, one for each channel.
The TCNT counters are initialized to H'0000 by a reset and in hardware standby mode.
The TCNT counters cannot be accessed in 8-bit units; they must always be accessed as a 16-bit
unit.
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.2.7 Timer General Registers (TGR)
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
The TGR registers are 16-bit registers with a dual function as output compare and input capture
registers. The TPU has 16 TGR registers, four each for channels 0 and 3 and two each for channels
1, 2, 4, and 5. TGRC and TGRD for channels 0 and 3 can also be designated for operation as
buffer registers*. The TGR registers are initialized to H'FFFF by a reset and in hardware standby
mode.
The TGR registers cannot be accessed in 8-bit units; they must always be accessed as a 16-bit unit.
Note: * TGR buffer register combinations are TGRA-TGRC and TGRB-TGRD.
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.2.8 Timer Start Register (TSTR)
Bit : 7 6 5 4 3 2 1 0
— — CST5 CST4 CST3 CST2 CST1 CST0
Initial value : 0 0 0 0 0 0 0 0
R/W : — — R/W R/W R/W R/W R/W R/W
TSTR is an 8-bit readable/writable register that selects operation/stoppage for channels 0 to 5.
TSTR is initialized to H'00 by a reset, and in hardware standby mode. W hen setting t he op erating
mode in TMDR or setting the co unt clock in TCR, first stop the T CNT counter.
Bits 7 and 6—Reserved: Must always be written with 0.
Bits 5 to 0—Counter Start 5 to 0 (CST5 to CST0): These bits select operation or stoppage for
TCNT.
Bit n
CSTn
Description
0 TCNTn count operation is stopped (Initial value)
1 TCNTn performs count operation n = 5 to 0
Note: If 0 is written to the CST bit during operation with the TIOC pin designated for output, the
counter stops but the TIOC pin output compare output level is retained. If TIOR is written to
when the CST bit is cleared to 0, the pin output level will be changed to the set initial output
value.
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.2.9 Timer Synchro Register (TSYR)
Bit : 7 6 5 4 3 2 1 0
— — SYNC5 SYNC4 SYNC3 SYNC2 SYNC1 SYNC0
Initial value : 0 0 0 0 0 0 0 0
R/W : — — R/W R/W R/W R/W R/W R/W
TSYR is an 8-bit readable/writable register that selects independent operation or synchronous
operat ion for the c hannel 0 to 4 TCNT counters. A chan nel performs s ynchr onous op erat ion when
the corresponding bit in TSYR is set to 1.
TSYR is initialized to H'00 by a reset and in hardware standby mode.
Bits 7 and 6—Reserved: Must always be written with 0.
Bits 5 to 0—Timer Synchro 5 to 0 (SYNC5 to SYNC0): These bits select whether operation is
independent of or synchronized with other channels.
When synchronous operation is selected , synchronous presetting of multiple cha nnels*1, and
synchronous clearing through counter clearing on another channel*2 are possible.
Bit n
SYNCn
Description
0 TCNTn operates independently (TCNT presetting/clearing is unrelated to
other channels) (Initial value)
1 TCNTn performs synchronous operation
TCNT synchronous presetting*1/synchronous clearing*2 is possible n = 5 to 0
Notes: 1. To set synchronous op eration, the SYNC bits for at least two channels must be set to 1.
2. To set s ynchrono us clearing, in addition to the SYNC b it , the TCNT clearing source
must also be set by means of bits CCLR2 to CCLR0 in TCR.
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.2.10 Module Stop Control Register (MSTPCR)
MSTPCRH MSTPCRL
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
When the MSTP13 bit in MSTPCR is set to 1, TPU operation stops at the end of the bus cycle and
a transition is made to module stop mode. Registers cannot be read or written to in module stop
mode. For details, see section 21.5, Module Stop Mode.
MSTP CR is initialized to H'3FFF by a reset a nd in hardware stand by mode. It is not initialized in
software standby mode.
Bit 13—Module Stop (MSTP13): Specifies the TPU module stop mode.
Bit 13
MSTP13
Description
0 TPU module stop mode cleared
1 TPU module stop mode set (Initial value)
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.3 Interface to Bus Master
10.3.1 16-Bit Registers
TCNT and TGR are 16-bit registers. As the data bus to the bus master is 16 bits wide, these
registers can be read and written to in 16-bit units.
These registers cannot be read or written to in 8-bit units; 1 6-bit access must always be used.
An example of 16-bit register access operation is shown in figure 10.2.
Bus interface
H
Internal data bus
L
Bus
master Module
data bus
TCNTH TCNTL
Figure 10.2 16-Bit Register Access Operation [Bus Master ↔ TCNT (16 Bits)]
10.3.2 8-Bit Registers
Registers other than TCNT and TGR are 8-bit. As the data bus to the CPU is 16 bits wide, these
registers can be read and written to in 16-bit units. T hey can also be read and written to in 8-bit
units.
Examples of 8-bit register access operation are shown in figures 10.3 to 10.5.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Bus interface
H
Internal data bus
LModule
data bus
TCR
Bus
master
Figure 10.3 8-Bit Register Access Operation [Bus Master ↔ TCR (Upper 8 Bits)]
Bus interface
H
Internal data bus
LModule
data bus
TMDR
Bus
master
Figure 10.4 8-Bit Register Access Operation [Bus Master ↔ TMDR (Lower 8 Bits)]
Bus interface
H
Internal data bus
LModule
data bus
TCR TMDR
Bus
master
Figure 10.5 8-Bit Register Access Operation [Bus Master ↔ TCR and TM DR (16 Bits)]
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.4 Operation
10.4.1 Overview
Operation in each mode is outlined below.
Normal Operation: Each channel ha s a TCNT and TGR regist er. TCNT performs up-counting,
and is also capable of free-running operation, synchronous counting, and external event counting.
Each TGR can be used as an input capture register or output compare register.
Synchronous Opera tion: When synchronous operation is designated for a channel, TCNT for
that channel performs synchronous presetting. That is, when TCNT for a channel designated for
synchronous operation is rewritten, t he TCNT counters for the other channels are also rewritten at
the same time. Synchronous clearing of the TCNT counters is also possible by setting the timer
synchro nizati on bi ts in TSYR for channel s designate d for sy nchro nous operation.
Buffer Operation
• When TGR is an output compare register
When a compare match occurs, the value in the buffer register for the relevant channel is
transferred to TGR.
• When TGR is an input capture register
When input capture occurs, the value in TCNT is transferred to TGR and the value previously
held in TGR is transferred to the buffer register.
Cascaded Operation: The channel 1 counter (TCNT1) and channel 2 counter (TCNT2), or the
channel 4 counter (TCNT4) and channel 5 counter (TCNT5), can be connected together to operate
as a 32-bit counter.
PWM Mode: In this mode, a PWM waveform is output. The output level can be set b y means of
TIOR. A PWM waveform with a duty of between 0% and 100% can be output, according to the
setting of each TGR register .
Phase Counting Mode: In this mode, T CNT is incremented or decremented by detecting the
phases of two clocks input from the external clock input pins in channels 1, 2, 4, and 5. When
phase counting mode is set, the corresponding TCLK pin functions as the clock pin, and TCNT
performs up/down-counting.
This can be used for two-phase encoder pulse input.
Section 10 16-Bit Timer Pulse Unit (TPU)
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10.4.2 Basic Functions
Counter Operation: When one of bits CST0 to CST5 is set to 1 in TSTR, the T CNT co unter for
the corresponding channel starts counting. TCNT can operate as a free-running counter, periodic
counter, and so on.
• Example of count operation setting procedure
Figure 10.6 shows an example of the count operation setting procedure.
Select counter clock
Operation selection
Select counter clearing source
Periodic counter
Set period
Start count
<Periodic counter>
[1]
[2]
[4]
[3]
[5]
Free-running counter
Start count
<Free-running counter>
[5]
[1]
[2]
[3]
[4]
[5]
Select output compare register
Select the counter
clock with bits
TPSC2 to TPSC0 in
TCR. At the same
time, select the
input clock edge
with bits CKEG1
and CKEG0 in TCR.
For periodic counter
operation, select the
TGR to be used as
the TCNT clearing
source with bits
CCLR2 to CCLR0 in
TCR.
Designate the TGR
selected in [2] as an
output compare
register by means of
TIOR.
Set the periodic
counter cycle in the
TGR selected in [2].
Set the CST bit in
TSTR to 1 to start
the counter
operation.
Figure 10.6 Example of Counter Operation Setting Procedure
Section 10 16-Bit Timer Pulse Unit (TPU)
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• Free-running count operation and periodic count operation
Immediately after a reset, the TPU’s TCNT counters are all designated as free-running
counters. When the relevant bit in TSTR is set to 1 the corresponding TCNT counter starts up-
count operation as a free-running counter. When TCNT overflows (from H'FFFF to H'0000),
the TCFV bit in TSR is set to 1. If the value of the corresponding TCIEV bit in TIER is 1 at
this point, the TPU req uests an interrupt. After ove rflow, TCNT starts counting up again from
H'0000.
Figure 10.7 illustrates free-running counter op eration.
TCNT value
H'FFFF
H'0000
CST bit
TCFV
Time
Figure 10.7 Free-Running Counter Operatio n
When compare match is selected as the TCNT clearing source, the TCNT counter for the
relevant cha nnel performs p eriodic count ope ration. The T GR r egister for set t ing the period is
designated as an output compare register, and counter clearing by compare match is selected
by means of bits CCLR2 to CCLR0 in TCR. After the settings have been made, TCNT starts
up-count operation as a periodic counter when the corresponding bit in TSTR is set to 1. When
the count value matches the value in TGR, the TGF bit in TSR is set to 1 and TCNT is cleared
to H'0000.
If the value of the corresponding TGIE bit in TIER is 1 at this point, the TPU requests an
interrupt. After a compare match, TCNT starts counting up again from H'0000.
Figure 10.8 illustrates periodic co unter operation.
Section 10 16-Bit Timer Pulse Unit (TPU)
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TCNT value
TGR
Note: * The DMAC is not supported in the H8S/2321.
H'0000
CST bit
TGF
Time
Counter cleared by TGR
compare match
Flag cleared by software or
DTC/DMAC* activation
Figure 10.8 Periodic Counter Operation
Waveform Output by Compare Match: The TPU can perform 0, 1, or toggle output from the
corresponding output pin using compare match.
• Example of setting procedure for waveform output by compare match
Figure 10.9 shows an example of the setting procedure for waveform output by compare match
Select waveform output mode
Output selection
Set output timing
Start count
<Waveform output>
[1]
[2]
[3]
[1] Select initial value 0 output or 1 output, and
compare match output value 0 output, 1 output,
or toggle output, by means of TIOR. The set
initial value is output at the TIOC pin until the
first compare match occurs.
[2] Set the timing for compare match generation in
TGR.
[3] Set the CST bit in TSTR to 1 to start the count
operation.
Figure 10.9 Example of Setting Procedure for Waveform Output by Compare Match
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• Examples of waveform output operation
Figure 10.10 shows an example of 0 output/1 output.
In this example TCNT has been designated as a free-running counter, and settings have been
made so that 1 is output by compare match A, and 0 is output by compare match B. When the
set level and the pin level coi ncide, the pin level does not ch ange.
TCNT value
H'FFFF
H'0000
TIOCA
TIOCB
Time
TGRA
TGRB
No change No change
No change No change
1 output
0 output
Figure 10.10 Example of 0 Output/1 Output Operation
Figure 10.11 shows an example of toggle output.
In this example TCNT has been designated as a periodic counter (with counter clearing
performed by compare match B), and settings have been made so that output is tog gled by both
compare match A and compare match B.
TCNT value
H'FFFF
H'0000
TIOCB
TIOCA
Time
TGRB
TGRA
Toggle output
Toggle output
Counter cleared by TGRB compare match
Figure 10.11 Example of Toggle Output Operation
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Input Capture Function: T he T CNT value can be transferred to TGR on detection of the TIOC
pin input edge.
Rising edge, fallin g edge, or both edges can be selec ted as the detected edge. For channels 0, 1, 3,
and 4, it is also possible to specify another channel’s counter input clock or compare match signal
as the input capture source.
Note: When another channel’s count er input clock is used as the i nput capture input for channels
0 and 3, φ/1 should not be selected as the counter input clock used for input capture input.
Input capture will not be generated if φ/1 is selected.
• Example of input capture operation setting procedure
Figure 10.12 shows an example of the input capture operation setting procedure.
Select input capture input
Input selection
Start count
<Input capture operation>
[1]
[2]
[1] Designate TGR as an input capture register by
means of TIOR, and select the input capture
source and input signal edge (rising edge, falling
edge, or both edges).
[2] Set the CST bit in TSTR to 1 to start the count
operation.
Figure 10.12 Example of Input Capture Operation Setting Procedure
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• Example of input capture operation
Figure 10.13 shows an example of input capture operation.
In this example both rising and falling edges ha ve been sele cted as the TIOCA pin input
capture input edge, falling edge has been selected as the T I OCB pin input capture input edge,
and counter clearing by TGRB input capture has been designated for TCNT.
TCNT value
H'0180
H'0000
TIOCA
TGRA
Time
H'0010
H'0005
Counter cleared by TIOCB
input (falling edge)
H'0160
H'0005 H'0160 H'0010
TGRB H'0180
TIOCB
Figure 10.13 Example of Input Ca pt ure Operation
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10.4.3 Synchronous Operation
In synchronous operation, the values in a number of TCNT counters can be rewritten
simultaneously (synchronous pr esettin g). Also, a number of TCNT counters can be cleared
simultaneously by making the appropriate setting in TCR (synchronous clearing).
Synchronous operation enables TGR to be incremented with respect to a single time base.
Channels 0 to 5 can all be designated for synchronous operation.
Example of Synchronous Operation Setting P rocedure: Figure 10.14 shows an example of the
synchro nous op eration setting procedure.
Synchronous operation
selection
Set TCNT
Synchronous presetting
<Synchronous presetting>
[1]
[2]
Synchronous clearing
Select counter
clearing source
<Counter clearing>
[3]
Start count [5]
Set synchronous
counter clearing
<Synchronous clearing>
[4]
Start count [5]
Clearing
source generation
channel?
No
Yes
[1] Set to 1 the SYNC bits in TSYR corresponding to the channels to be designated for synchronous operation.
[2] When the TCNT counter of any of the channels designated for synchronous operation is written to, the
same value is simultaneously written to the other TCNT counters.
[3] Use bits CCLR2 to CCLR0 in TCR to specify TCNT clearing by input capture/output compare, etc.
[4] Use bits CCLR2 to CCLR0 in TCR to designate synchronous clearing for the counter clearing source.
[5] Set to 1 the CST bits in TSTR for the relevant channels, to start the count operation.
Set synchronous
operation
Figure 10.14 Example of Synchronous Operation Setting Procedure
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Example of Synchronous Operation: Figure 10.15 shows an example of synchronous operation.
In this example, synchronous operation and PWM mode 1 have been designated for channels 0 to
2, TGR0B compare match has been set as the channel 0 counter clearing source, and synchronous
clearing has been set for the channel 1 and 2 counter clearing source.
Three-phase PWM waveforms are output from pins TIOC0A, TIOC1A, and TIOC2A. At this
time, synchronous presetting, and synchronous clearing by TGR0B compare match, is performed
for channel 0 to 2 TCNT counters, and the data set in TGR0B is used as the PWM cycle.
For details of PWM modes, see section 10.4.6, PWM Modes.
TCNT0 to TCNT2 values
H'0000
TIOC0A
TIOC1A
Time
TGR0B
Synchronous clearing by TGR0B compare match
TGR2A
TGR1A
TGR2B
TGR0A
TGR1B
TIOC2A
Figure 10.15 Example of Synchronous Operation
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10.4.4 Buffer Operation
Buffer operation, provided for channels 0 and 3, enables TGRC and TGRD to be used as buffer
registers.
Buffer operation differs depending on whether TGR has been designated as an input capture
register or as a compare match register.
Table 10.5 shows the register combinations used in buffer operation.
Table 10.5 Register Combinations in Buffer Operation
Channel Timer General Register Buffer Register
0 TGR0A TGR0C
TGR0B TGR0D
3 TGR3A TGR3C
TGR3B TGR3D
• When TGR is an output compare register
When a compare match occurs, the value in the buffer register for the corresponding channel is
transferred to the timer general register.
This operation is illustrated in figure 10.16.
Buffer register Timer general
register TCNTComparator
Compare match signal
Figure 10.16 Compare Match Buffer Operation
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• When TGR is an input capture register
When input capture occurs, the value in TCNT is transferred to TGR and the value previously
held in the timer general register is transferred to the buffer register.
This operation is illustrated in figure 10.17.
Buffer register Timer general
register TCNT
Input capture
signal
Figure 10.17 Input Capture Buffer Operation
Example of Buffer Operation Setting Procedure: Figure 10.18 shows an example of the buffer
operation setting proced ure.
Select TGR function
Buffer operation
Set buffer operation
Start count
<Buffer operation>
[1]
[2]
[3]
[1] Designate TGR as an input capture register or
output compare register by means of TIOR.
[2] Designate TGR for buffer operation with bits
BFA and BFB in TMDR.
[3] Set the CST bit in TSTR to 1 to start the count
operation.
Figure 10.18 Example of Buffer Operation Setting Procedure
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Examples of Buffer Operation
• When TGR is an output compare register
Figure 10.19 shows an operation example in which PWM mode 1 has been designated for
channel 0, and buffer operation has been designated for TGRA and TGRC. The settings used
in this example are TCNT clearing by compare match B, 1 output at compare match A, and 0
output at compare match B.
As buffer operation has been set, when compare match A occurs the output changes and the
value in buffer register TGRC is simultaneously transferred to timer general register TGRA.
This operation is repeated each time compare match A occurs.
For details of PWM modes, see section 10.4.6, PWM Modes.
TCNT value
TGR0B
H'0000
TGR0C
Time
TGR0A
H'0200 H'0520
TIOCA
H'0200
H'0450 H'0520
H'0450
TGR0A H'0450H'0200
Transfer
Figure 10.19 Example of Buffer Operation (1)
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• When TGR is an input capture register
Figure 10.20 shows an operation example in which TGRA has been designated as an input
capture register, and buffer operation has been designated for TGRA and TGRC.
Counter clearing by TGRA input capture has been set for TCNT, and both rising and falling
edges have been selected as the TIOCA pin input capture input edge.
As buffer operation has been set, when the TCNT value is stored in TGRA upon occurrence of
input capture A, the value previously stored in T GRA is simultaneously transferred to TGRC.
TCNT value
H'09FB
H'0000
TGRC
Time
H'0532
TIOCA
TGRA H'0F07H'0532
H'0F07
H'0532
H'0F07
H'09FB
Figure 10.20 Example of Buffer Operation (2)
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10.4.5 Cascaded Operation
In cascaded operation, two 16-bit counters for different channels are used together as a 32-bit
counter.
Thi s function works by count ing the channel 1 (channel 4 ) counter c lock upon overflow/u nder fl ow
of TCNT 2 (TCNT5) as set in bits TPSC2 to TPSC0 in T CR.
Underflow occurs only when the lower 16-bit TCNT is in phase-counting mode.
Table 10.6 shows the register combinations used in cascaded operation.
Note: When phase counting mode is set for channel 1 or 4, the counter clock setting is invalid
and the counter operates independently in phase counting mode.
Table 10.6 Cascaded Combinations
Combination Upper 16 Bits Lower 16 Bits
Channels 1 and 2 TCNT1 TCNT2
Channels 4 and 5 TCNT4 TCNT5
Example of Cascaded Operation Setting Procedure: Figure 10.21 shows an example of the
setting procedure for cascaded operation.
Set cascading
Cascaded operation
Start count
<Cascaded operation>
[1]
[2]
[1] Set bits TPSC2 to TPSC0 in the channel 1
(channel 4) TCR to B'111 to select TCNT2
(TCNT5) overflow/underflow counting.
[2] Set the CST bit in TSTR for the upper and lower
channel to 1 to start the count operation.
Figure 10.21 Cascaded Operation Setting Procedure
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Examples of Cascaded Operation: Figure 10.22 illustrates the operation when counting upon
TCNT2 overflow/underflow has been set for TCNT1, TGR1A, and TGR2A have been designated
as input capture registers, and TIOC pin rising edge has been selected.
When a rising edge is input to the TIOCA1 and TIOCA2 pins simultaneously, the upper 1 6 bits o f
the 32-bit data are transferred to TGR1A, and the lower 16 bits to TGR2A.
TCNT2
clock
TCNT2 H'FFFF H'0000 H'0001
TIOCA1,
TIOCA2
TGR1A H'03A2
TGR2A H'0000
TCNT1
clock
TCNT1 H'03A1 H'03A2
Figure 10.22 Example of Cascaded Operation (1)
Figure 10.23 illustrates the op eration when counting upon TCNT2 o verflow/underflow has been
set for TCNT1, and phase counting mode has been designated for channel 2.
TCNT1 is incremented by TCNT2 overflow and decremented by TCNT2 underflow.
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TCLKC
TCNT2 FFFD
TCNT1 0001
TCLKD
FFFE FFFF 0000 0001 0002 0001 0000 FFFF
0000 0000
Figure 10.23 Example of Cascaded Operation (2)
10.4.6 PWM Modes
In PWM mode, PWM waveforms are output from the output pins. 0, 1, or toggle output can be
selected as the output level in response to compare match of each TGR.
Designating TGR compare match as the counter clearing source enables the period to be set in that
register. All channels can be designated for PWM mode independently. Synchronous operation is
also possible.
There are two PWM modes, as described below.
• PWM mode 1
PWM output is generated from the TIOCA and TIOCC pins by pairing TGRA with TGRB and
TGRC with TGRD. The output specified by bits IOA3 to IOA0 and IOC3 to IOC0 in TIOR is
output from the TIOCA and TIOCC pins at compare matches A and C, and the output
specified by bits IOB3 to IOB0 and IOD3 to IOD0 in TIOR is output at compare matches B
and D. The initial output value is the value set in TGRA or TGRC. If the set values of paired
TGRs are identical, the output value does not change when a compare match occurs.
In PWM mode 1, a maximum 8-phase PWM output is possible.
• PWM mode 2
PWM output is generated using one TGR as the period register and the others as duty registers.
The output specified in TIOR is performed by means of compare matches. Upon counter
clearing by a synchronization register compare match, the output value of each pin is the initial
value set in TIOR. If the set values of the period and duty registers are identical, the output
value does not change when a compare match occurs.
In PWM mode 2, a maximum 15-phase PWM output is possible by combined use with
synchro nous op eration.
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The correspondence between PWM output pins and registers is shown in table 10.7.
Table 10.7 PWM Output Registers and Output Pins
Output Pins
Channel Registers PWM Mode 1 PWM Mode 2
0 TGR0A TIOCA0 TIOCA0
TGR0B TIOCB0
TGR0C TIOCC0 TIOCC0
TGR0D TIOCD0
1 TGR1A TIOCA1 TIOCA1
TGR1B TIOCB1
2 TGR2A TIOCA2 TIOCA2
TGR2B TIOCB2
3 TGR3A TIOCA3 TIOCA3
TGR3B TIOCB3
TGR3C TIOCC3 TIOCC3
TGR3D TIOCD3
4 TGR4A TIOCA4 TIOCA4
TGR4B TIOCB4
5 TGR5A TIOCA5 TIOCA5
TGR5B TIOCB5
Note: In PWM mode 2, PWM output is not possible for the TGR register in which the period is set.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Example of PWM Mode Setting Procedure: Figure 10.24 shows an example of the PWM mode
setting pr ocedure.
Select counter clock
PWM mode
Select counter clearing source
Select waveform output level
<PWM mode>
[1]
[2]
[3]
Set TGR [4]
Set PWM mode [5]
Start count [6]
[1] Select the counter clock with bits TPSC2 to
TPSC0 in TCR. At the same time, select the
input clock edge with bits CKEG1 and CKEG0 in
TCR.
[2] Use bits CCLR2 to CCLR0 in TCR to select the
TGR to be used as the TCNT clearing source.
[3] Use TIOR to designate the TGR as an output
compare register, and select the initial value and
output value.
[4] Set the period in the TGR selected in [2], and
set the duty in the other TGR.
[5] Select the PWM mode with bits MD3 to MD0 in
TMDR.
[6] Set the CST bit in TSTR to 1 to start the count
operation.
Figure 10.24 Example of PWM Mode Setting P rocedure
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Examples of PWM Mode Operation: Figure 10.25 shows an example of PWM mode 1
operation.
In this example, TGRA compare match is set as the TCNT clearing source, 0 is set for the TGRA
initial output value and output value, and 1 is set as the TGRB o utput value.
In this case, the value set in TGRA is used as the period, and the value set in TGRB as the duty.
TCNT value
TGRA
H'0000
TIOCA
Time
TGRB
Counter cleared by
TGRA compare match
Figure 10.25 Example of PWM Mode Operation (1)
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Figure 10.26 shows an example of PWM mode 2 operation.
In this example, synchronous operation is designated for channels 0 and 1, TGR1B compare
match is set as the TCNT clearing so urce, and 0 is set for the initial output value and 1 for the
output value of the other TGR registers (TGR0A to TGR0D, TGR1A), to output a 5-phase PW M
waveform.
In this case, the value set in TGR1B is used as the period, and the values set in the other TGR
registers as the d uty.
TCNT value
TGR1B
H'0000
TIOCA0
Counter cleared by TGR1B
compare match
TGR1A
TGR0D
TGR0C
TGR0B
TGR0A
TIOCB0
TIOCC0
TIOCD0
TIOCA1
Time
Figure 10.26 Example of PWM Mode Operation (2)
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Figure 10.27 shows examples of PWM waveform output with 0% duty and 100% duty in PWM
mode.
TCNT value
TGRA
H'0000
TIOCA
Time
TGRB
0% duty
TGRB rewritten
TGRB
rewritten
TGRB rewritten
TCNT value
TGRA
H'0000
TIOCA
Time
TGRB
100% duty
TGRB rewritten
TGRB rewritten
TGRB rewritten
Output does not change when period register and duty register
compare matches occur simultaneously
TCNT value
TGRA
H'0000
TIOCA
Time
TGRB
100% duty
TGRB rewritten
TGRB rewritten
TGRB rewritten
Output does not change when period register and duty
register compare matches occur simultaneously
0% duty
Figure 10.27 Examples of PWM Mode Operation (3)
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10.4.7 Phase Counting Mode
In phase counting mode, the phase difference between two external clock inputs is detected and
TCNT is incremented/decremented accordingly. This mode can be set for channels 1, 2, 4, and 5.
When phase counting mode is set, an external clock is selected as the counter input clock and
TCNT operates as an up/down-counter regardless of the setting of bits TPSC2 to TPSC0 and bits
CKEG1 and CKEG0 in TCR. However, the functions of bits CCLR1 and CCLR0 in TCR, and of
TIOR, TIER, and TGR are valid, and input capture/compare matc h and interrupt function s can be
used.
When overflow occurs while TCNT is counting up, the TCFV flag in TSR is set; when underflo w
occurs while TCNT is counting down, the TCFU flag is set.
The TCFD bit in TSR is t he count direction fla g. Readin g t he TCFD flag provides an indication of
whether TCNT is counting up or down.
Table 10.8 shows the correspondence between external clock pins and channels.
Table 10.8 Phase Counting Mode Clock Input Pin s
External Clock Pins
Channels A-Phase B-Phase
When channel 1 or 5 is set to phase counting mode TCLKA TCLKB
When channel 2 or 4 is set to phase counting mode TCLKC TCLKD
Example of P ha se Co unt ing Mode Setting Procedure: Figure 10.28 shows an example of the
phase counting mode setting procedure.
Select phase counting mode
Phase counting mode
Start count
<Phase counting mode>
[1]
[2]
[1] Select phase counting mode with bits MD3 to
MD0 in TMDR.
[2] Set the CST bit in TSTR to 1 to start the count
operation.
Figure 10.28 Example of Phase Counting Mode Setting Procedure
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Examples of Phase Counting Mode Operation: In phase counting mode, TCNT counts up or
down according to the phase difference between two external clocks. There are four modes,
according to the count conditions.
• Phase counting mode 1
Figure 10.29 shows an example of phase counting mode 1 operation, and table 10.9
summarizes the TCNT up/down-count conditions.
TCNT value
Time
Down-countUp-count
TCLKA (channels 1 and 5)
TCLKC (channels 2 and 4)
TCLKB (channels 1 and 5)
TCLKD (channels 2 and 4)
Figure 10.29 Example of Phase Counting Mode 1 Operation
Table 10.9 Up/Down-Count Co nditions in Phase Counting Mode 1
TCLKA (Channels 1 and 5)
TCLKC (Channels 2 and 4) TCLKB (Channels 1 and 5)
TCLKD (Channels 2 and 4)
Operation
High level Up-count
Low level
Low level
High level
High level Down-count
Low level
High level
Low level
Legend:
: Rising edge
: Falling edge
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• Phase counting mode 2
Figure 10.30 shows an example of phase counting mode 2 operation, and table 10.10
summarizes the TCNT up/down-count conditions.
TCNT value
Time
Down-countUp-count
TCLKA (channels 1 and 5)
TCLKC (channels 2 and 4)
TCLKB (channels 1 and 5)
TCLKD (channels 2 and 4)
Figure 10.30 Example of Phase Counting Mode 2 Operation
Table 10.10 Up/Down-Count Conditions in Phase Counting Mode 2
TCLKA (Channels 1 and 5)
TCLKC (Channels 2 and 4) TCLKB (Channels 1 and 5)
TCLKD (Channels 2 and 4)
Operation
High level Don’t care
Low level
Low level
High level Up-count
High level Don’t care
Low level
High level
Low level Down-count
Legend:
: Rising edge
: Falling edge
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• Phase counting mode 3
Figure 10.31 shows an example of phase counting mode 3 operation, and table 10.11
summarizes the TCNT up/down-count conditions.
TCNT value
Time
Up-count
TCLKA (channels 1 and 5)
TCLKC (channels 2 and 4)
TCLKB (channels 1 and 5)
TCLKD (channels 2 and 4)
Down-count
Figure 10.31 Example of Phase Counting Mode 3 Operation
Table 10.1 1 Up/Down- Count Conditions in Phase Counting Mo de 3
TCLKA (Channels 1 and 5)
TCLKC (Channels 2 and 4) TCLKB (Channels 1 and 5)
TCLKD (Channels 2 and 4)
Operation
High level Don’t care
Low level
Low level
High level Up-count
High level Down-count
Low level Don’t care
High level
Low level
Legend:
: Rising edge
: Falling edge
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• Phase counting mode 4
Figure 10.32 shows an example of phase counting mode 4 operation, and table 10.12
summarizes the TCNT up/down-count conditions.
Time
TCLKA (channels 1 and 5)
TCLKC (channels 2 and 4)
TCLKB (channels 1 and 5)
TCLKD (channels 2 and 4)
Up-count Down-count
TCNT value
Figure 10.32 Example of Phase Counting Mode 4 Operation
Table 10.12 Up/Down-Count Conditions in Phase Counting Mode 4
TCLKA (Channels 1 and 5)
TCLKC (Channels 2 and 4) TCLKB (Channels 1 and 5)
TCLKD (Channels 2 and 4)
Operation
High level Up-count
Low level
Low level Don’t care
High level
High level Down-count
Low level
High level Don’t care
Low level
Legend:
: Rising edge
: Falling edge
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Phase Counting Mode Application Example: Figure 10.33 shows an example in which phase
counting mode is designated for channel 1, and channel 1 is coupled with channel 0 to input servo
motor 2-phase encoder pulses in order to detect the position or speed .
Channel 1 is set to phase counting mode 1, and the encoder pulse A-phase and B-phase are input
to TCLKA and TCLKB.
Channel 0 operates with TCNT counter clearing by TGR0C compare match; TGR0A and TGR0C
are used for the compare match function, and are set with the speed control p eriod and position
control period. TGR0B is used for input capture, with T GR0 B and TGR0D operating in buffer
mode. The channel 1 counter input clock is designated as the TGR0B input capture source, and
detection of the pulse width of 2-phase encoder 4-multiplication pulses is performed.
TGR1A and TGR1B for channel 1 are designated for input capture, channel 0 TGR0A and
TGR0C compare matches are selected as the input capture source, and store the up/down-counter
values for the control periods.
This proced ure enables accurate position/speed d etection to be achieved.
Section 10 16-Bit Timer Pulse Unit (TPU)
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TCNT1
TCNT0
Channel 1
TGR1A
(speed period capture)
TGR0A (speed control period)
TGR1B
(position period capture)
TGR0C
(position control period)
TGR0B (pulse width capture)
TGR0D (buffer operation)
Channel 0
TCLKA
TCLKB
Edge
detection
circuit
+
–
+
–
Figure 10.33 Phase Counting Mode Application Example
10.5 Interrupts
10.5.1 Interrupt Sources and Priorities
There are three kinds of TPU interrupt source: TGR input capture/compare match, TCNT
overflow, and TCNT underflow. Each interrupt source has its own status flag and enable/disable
bit, allowing generation of interrupt request signals to be enabled or disabled individually.
When an interrupt request is generated, the corresponding status flag in TSR is set to 1. If the
corresponding enable/disable bit in TIER is set to 1 at this time, an interrupt is requested. The
interrupt request is cleared by clearing the status flag to 0.
Relative channel priorities can be changed by the interrupt controller, but the priority order within
a channel is fixed. For details, see section 5, Interrupt Co ntroller.
Section 10 16-Bit Timer Pulse Unit (TPU)
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Table 10.13 lists the T PU interrupt sources.
Table 10.13 TPU Interrupts
Channel Interrupt
Source
Description DMAC*
Activation DTC
Activation
Priority
0 TGI0A TGR0A input capture/compare match Possible Possible High
TGI0B TGR0B input capture/compare match Not possible Possible
TGI0C TGR0C input capture/compare match Not possible Possible
TGI0D TGR0D input capture/compare match Not possible Possible
TCI0V TCNT0 overflow Not possible Not possible
1 TGI1A TGR1A input capture/compare match Possible Possible
TGI1B TGR1B input capture/compare match Not possible Possible
TCI1V TCNT1 overflow Not possible Not possible
TCI1U TCNT1 underflow Not possible Not possible
2 TGI2A TGR2A input capture/compare match Possible Possible
TGI2B TGR2B input capture/compare match Not possible Possible
TCI2V TCNT2 overflow Not possible Not possible
TCI2U TCNT2 underflow Not possible Not possible
3 TGI3A TGR3A input capture/compare match Possible Possible
TGI3B TGR3B input capture/compare match Not possible Possible
TGI3C TGR3C input capture/compare match Not possible Possible
TGI3D TGR3D input capture/compare match Not possible Possible
TCI3V TCNT3 overflow Not possible Not possible
4 TGI4A TGR4A input capture/compare match Possible Possible
TGI4B TGR4B input capture/compare match Not possible Possible
TCI4V TCNT4 overflow Not possible Not possible
TCI4U TCNT4 underflow Not possible Not possible
5 TGI5A TGR5A input capture/compare match Possible Possible
TGI5B TGR5B input capture/compare match Not possible Possible
TCI5V TCNT5 overflow Not possible Not possible
TCI5U TCNT5 underflow Not possible Not possible Low
Notes: This table shows the initial state immediately after a reset. The relative channel priorities
can be changed by the interru pt control ler.
* The DMAC is not supported in the H8S/2321.
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Input Capture/Compare Match Interrupt: An interrupt is requested if the TGIE bit in TIER is
set to 1 when the TGF flag in TSR is set to 1 by the occurrence of a TGR input capture/compare
match on a particular channel. The interrupt request is cleared by clearing the TGF flag to 0. The
TPU has 16 input capture/compare match interrupts, four each for channels 0 and 3, and two each
for channels 1, 2, 4, and 5.
Overflow Interrupt: An interrupt is requested if the TCIEV bit in TI ER is set to 1 when the
TCFV flag in TSR is set to 1 by the occurrence of TCNT overflow on a channel. The interrupt
request is cleared by clearing the TCFV flag to 0. The TPU has six overflow interrupts, one for
each channel.
Underflow Interrupt: An interrupt is requested if the TCIEU bit in TIER is set to 1 when the
TCFU flag in TSR is set to 1 by the occurrence of TCNT underflow on a channel. The interrupt
request is cleared by clearing the TCFU flag to 0. The TPU has four underflow interrupts, one
each for channels 1, 2, 4, and 5.
10.5.2 DTC/DMAC* Activation
DTC Activation: The DTC can be activated by the TGR input capture/compare match interrupt
for a channel. For details, see section 8, Data Transfer Controller.
A total of 16 TPU input capture/compare match interrupts ca n be used as DTC activation sources,
four each for channels 0 and 3, and two each for channels 1, 2, 4, and 5.
DMAC* Activation: The DMAC can be activated by the T GRA input capture/compare match
interrupt for a channel. For details, see section 7, DMA Controller (Not Supported in the
H8S/2321).
In the TPU, a total of six TGRA input capture/co mpare match interrupts can be used as DMAC
activation sources, one for each channel.
Note: * The DMAC is not supported in the H8S/2321.
10.5.3 A/D Converter Activation
The A/D converter can be activated by the TGRA input capture/compare match for a channel.
If the TTGE bit in TIER is set to 1 when the TGFA flag in TSR is set to 1 by the occurrence of a
TGRA input capture/compare match on a particular channel, a request to start A/D conversion is
sent to the A/D converter. If the TPU conversion start trigger has been selected on the A/D
converter side at this time, A/D conversion is started .
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In the TPU, a total of six TGRA input capture/compare match interrupts can be used as A/D
converter conversion start sources, one for each channel.
10.6 Operation Timing
10.6.1 Input/Output Timing
TCNT Count Timing: Figure 10.34 shows TCNT count timing in interna l clo ck op erat ion, and
figure 10.3 5 shows TCNT count timi ng in external clock operatio n.
TCNT
TCNT
input clock
Internal clock
φ
N–1 N N+1 N+2
Falling edge Rising edge
Figure 10.34 Count Timing in Internal Clock Operation
TCNT
TCNT
input clock
External clock
φ
N–1 N N+1 N+2
Rising edge Falling edge
Falling edge
Figure 10.35 Count Timing in External Clock Operation
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Output Compare Output Ti ming: A compare match signal is generated in the final state in
which TCNT and TGR match (the point at which the count value matched by TCNT is updated).
When a compare match signal is generated, the output val ue set in TIOR is output at the o u tput
compare output pin. After a match between TCNT and TGR, the compare match signal is not
generated until the TCNT input clock is generated.
Figure 10.36 shows output compare output timing.
TGR
TCNT
TCNT
input clock
φ
N
N N+1
Compare
match signal
TIOC pin
Figure 10.36 Output Compare Output Timing
Input Capture Signal Timing: Figure 10.37 shows input capture signal timing.
TCNT
Input capture
input
φ
N N+1 N+2
NN+2
TGR
Input capture
signal
Figure 10. 37 Input Capture Input Signal Timing
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Timing for Counter Clearing by Compare Match/Input Capture: Figure 10.38 shows the
timing when counter clearing by compare match occurrence is specified, and figure 10.39 shows
the timing when counter clearing by input capture occurrence is specified.
TCNT
Counter
clear signal
Compare
match signal
φ
TGR N
N H'0000
Figure 10.38 Counter Clear Timing (Compare Match)
TCNT
Counter clear
signal
Input capture
signal
φ
TGR
N H'0000
N
Figure 10.39 Counter Clear Timing (Input Ca pt ure)
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Buffer Operation Timing: Figures 10.40 and 10.41 show the timing in buffer operation.
TGRA,
TGRB
Compare
match signal
TCNT
φ
TGRC,
TGRD
nN
N
n n+1
Figure 10.40 Buffer Operation Timing (Compare Match)
TGRA,
TGRB
TCNT
Input capture
signal
φ
TGRC,
TGRD
N
n
n N+1
N
N N+1
Figure 10.41 Buffer Operation Timing (Input Ca pt ure)
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10.6.2 Interrupt Signal Timing
TGF Flag Setting Timing in Case of Compare Matc h: Figure 10.42 shows the timing for
setting of the TGF flag in TSR by compare match occurrence, and TGI interrupt request signal
timing.
TGR
TCNT
TCNT input
clock
φ
N
N N+1
Compare
match signal
TGF flag
TGI interrupt
Figure 10.42 TGI Interrupt Timing (Compare Match)
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TGF Flag Set ting Timing in Case of Input Capture: Figure 10.43 shows the timing for setting
of the TGF flag in TSR by input capture occurrence, and TGI interrupt request signal timing.
TGR
TCNT
Input capture
signal
φ
N
N
TGF flag
TGI interrupt
Figure 10.43 TGI Interrupt Timing (Input Capture)
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TCFV Flag/TCFU Flag Setting Timing: Figure 10.44 shows the timing for setting of the TCFV
flag in TSR by overflow occurrence, and TCIV interrupt request signal timing.
Figure 10.45 shows the timing for setting of the TCFU flag in TSR by underflow occurrence, and
TCIU interrupt request signal timing.
Overflow
signal
TCNT
(overflow)
TCNT input
clock
φ
H'FFFF H'0000
TCFV flag
TCIV interrupt
Figure 10.44 TCIV Interrupt Setting Timing
Underflow signal
TCNT
(underflow)
TCNT
input clock
φ
H'0000 H'FFFF
TCFU flag
TCIU interrupt
Figure 10.45 TCIU Interrupt Setting Timing
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Status Fla g Clearing Timing: After a status flag is read as 1 by the CPU, it is cleared by writing
0 to it. When the DTC or DMAC* is activated, the flag is cleared automatically. Figure 10.46
shows the timing for status flag clearing by the CPU, and figure 10.47 shows the timing for status
flag clearing by the DTC or DMAC*.
Note: * The DMAC is not supported in the H8S/2321.
Status flag
Write signal
A
ddress
φ
TSR address
Interrupt
request
signal
TSR write cycle
T1T2
Figure 10.46 Timing for Status Flag Clearing by CPU
Interrupt
request
signal
Note: * The DMAC is not supported in the H8S/2321.
Status flag
A
ddress
φ
Source address
DTC/DMAC*
read cycle
T
1
T
2
Destination
address
T
1
T
2
DTC/DMAC*
write cycle
Figure 10.47 Timing for Status Flag Clearing by DTC/DMAC Activation
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10.7 Usage Notes
Note that the kinds of operation and contention described below can occur during TPU operation.
Input Cloc k Re st rictions: The input clock pulse width must be at least 1.5 states in the case of
single-edge detection, and at least 2.5 states in the case of both-edge detection. The TPU will not
operate properly with a narrower pulse width.
In phase counting mode, the phase difference and overlap between the two input clocks must be at
least 1.5 states, and the pulse width must be at least 2.5 states. Figure 10.48 shows the input clock
conditions in phase counting mode.
Overlap
Phase
differ-
ence
Phase
differ-
ence
Overlap
TCLKA
(TCLKC)
TCLKB
(TCLKD)
Pulse width Pulse width
Pulse width Pulse width
Notes: Phase difference and overlap
Pulse width : 1.5 states or more
: 2.5 states or more
Figure 10.48 Phase Difference, Overlap, and Pulse Width in Phase Counting Mode
Caution on Period Setting: When counter clearing by compare match is set, TCNT is cleared in
the final state in which it matches the TGR val ue (the po int at which the count value matched by
TCNT is updated). Consequently, the actua l counter fre quen cy is given by the following formula:
f =
φ
(N + 1)
Where f : Counter frequency
φ : Operating frequency
N : TGR set value
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Contention between TCNT Write and Clear Operations: If the counter clear signal is
gener ated in the T2 state of a TCNT write cycle, TCNT clearing takes precedence and the TCNT
write is not performed.
Figure 10.49 shows the timing in this case.
Counter clear
signal
Write signal
A
ddress
φ
TCNT address
TCNT
TCNT write cycle
T
1
T
2
N H'0000
Figure 10.49 Contention between TCNT Write and Clear Operations
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Contention between TCNT Write and Increment Operations: If incrementing occurs in the T2
state of a TCNT write cycle, the TCNT write takes precedence and TCNT is not incremented.
Figure 10.50 shows the timing in this case.
TCNT input
clock
Write signal
A
ddress
φ
TCNT address
TCNT
TCNT write cycle
T
1
T
2
N M
TCNT write data
Figure 10.50 Contention between TCNT Write and Increment Operations
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Contention between TGR Write and Compare Match: If a compare match occurs in the T2
state of a TGR write cycle, the TGR write takes precedence and the compare match signal is
inhibited. A compare match does not occur even if the same value as before is written.
Figure 10.51 shows the timing in this case.
Compare
match signal
Write signal
A
ddress
φ
TGR address
TCNT
TGR write cycle
T
1
T
2
N M
TGR write data
TGR
N N+1
Inhibited
Figure 10.51 Contention between TGR Write and Compare Match
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Contention between Buffer Register Write and Compare Match: If a compare match occurs in
the T2 state of a TGR write cycle, the data transferred to TGR by the buffer operation will be the
data prior to the write.
Figure 10.52 shows the timing in this case.
Compare
match signal
Write signal
A
ddress
φ
Buffer register
address
Buffer
register
TGR write cycle
T
1
T
2
N
TGR
N M
Buffer register write data
Figure 10.52 Contention between Buffer Register Write and Compare Match
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Contention between TGR Read and Input Ca pt ure: If the input capture signal is generated in
the T1 state of a TGR read cycle, the data that is read will be the data after input capture tra nsfer.
Figure 10.53 shows the timing in this case.
Input capture
signal
Read signal
A
ddress
φ
TGR address
TGR
TGR read cycle
T
1
T
2
M
Internal
data bus
X M
Figure 10.53 Contention between TGR Read and Input Capture
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Contention between TGR Write and Input Capture: If the input capture signal is generated in
the T2 state of a TGR write cycle, the input capture operation takes precedence and the write to
TGR is not performed.
Figure 10.54 shows the timing in this case.
Input capture
signal
Write signal
A
ddress
φ
TCNT
TGR write cycle
T
1
T
2
M
TGR
M
TGR address
Figure 10.54 Contention between TGR Write and Input Capture
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Contention between Buffer Register Write and Input Capture: If the input capture signal is
gener ated in the T2 state of a buffer write cycle, the buffer operation takes precedence and the
write to the buffer register is not performed.
Figure 10.55 shows the timing in this case.
Input capture
signal
Write signal
A
ddress
φ
TCNT
Buffer register write cycle
T
1
T
2
N
TGR
N
M
M
Buffer
register
Buffer register
address
Figure 10.55 Contention between Buffer Register Write and Input Capture
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Contention between Overflow/Underflow and Counter Clearing: If overflow/underflow and
counter clearing occur simultaneously, the TCFV/TCFU flag in TSR is not se t and TCNT clearing
takes precedence.
Figure 10.56 shows the operation timing when a TGR compare match is specified as the clearing
source, and H'FFFF is set in TGR.
Counter
clear signal
TCNT input
clock
φ
TCNT
TGF
Prohibited
TCFV flag
H'FFFF H'0000
Figure 10.56 Contention between Overflow and Counter Clearing
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Contention between TCNT Write and Overflow/Underflow: If there is an up-count or down-
count in the T2 state of a TCNT write cycle, and overflow/underflow occurs, the TCNT write takes
precedence and the TCFV/TCFU flag in TSR is not set.
Figure 10.57 shows the operation timing when there is contention between TCNT write and
overflow.
Write signal
A
ddress
φ
TCNT address
TCNT
TCNT write cycle
T
1T2
H'FFFF M
TCNT write data
TCFV flag Prohibited
Figure 10.57 Contention between TCNT Write and Overflow
Multiplexing of I/O Pins: In the chip, the TCLKA input pin is multiplexed with the TIOCC0 I/O
pin, the TCLKB input pin with the TI OCD0 I/O pin, the TCLKC input pin with the TIOCB1 I/O
pin, and the TCLKD input pin with the TIOCB2 I/O pin. When an external clock is input,
compare match output should not be performed from a multiplexed pin.
Interrupts an d Module Stop Mode: If module stop mode is entered when an interrupt has been
requested, it will not be possible to clear the CP U interrupt so urce or the DMAC* or DTC
activation source. Interrupts should therefore be disabled before entering module stop mode.
Note: * The DMAC is not supported in the H8S/2321.
Section 11 Programmable Pulse Generator (PPG)
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Section 11 Program mable Pulse Generator (PPG)
11.1 Overview
The chip has a built-in programmable pulse generator (P PG) that provides pulse outputs by using
the 16-bit timer-pulse unit (TPU) as a ti me base. T he P PG pulse outputs are divided into 4-bit
groups (group 3 to group 0) that can operate both simultaneously and independently.
11.1.1 Features
PPG features are listed below.
• 16-bit output data
⎯ Maximum 16-bit data can be output, and output can be enabled on a bit-by-bit basis
• Four output groups
⎯ Output trigger signals can be selected in 4-bit groups to pr ovide up to four different 4-bit
outputs
• Selectable output trigger signals
⎯ Output trigger signals can be selected for each group from the compare match signals of
four TPU channel s
• Non-overlap mode
⎯ A non-overlap margin can be provided between pulse outputs
• Can operate together with the data transfer controller (DTC) and DMA controller (DMAC)*
⎯ The compare match signals selected as output trigger signals can activate the DTC or
DMAC for sequential output of data without CPU intervention
Note: * The DMAC is not supported in the H8S/2321.
• Inver t ed o ut put can be set
⎯ Inverted data can be output for each group
• Module stop mode can be set
⎯ As the initial setting, PPG operation is halted. Register access is enabled by exiting module
stop mode
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11.1.2 Block Diagram
Figure 11.1 shows a block diagram of the PPG.
Compare match signals
PO15
PO14
PO13
PO12
PO11
PO10
PO9
PO8
PO7
PO6
PO5
PO4
PO3
PO2
PO1
PO0
Legend:
PMR:
PCR:
NDERH:
NDERL:
NDRH:
NDRL:
PODRH:
PODRL:
PPG output mode register
PPG output control register
Next data enable register H
Next data enable register L
Next data register H
Next data register L
Output data register H
Output data register L
Internal
data bus
Pulse output
pins, group 3
Pulse output
pins, group 2
Pulse output
pins, group 1
Pulse output
pins, group 0
PODRH
PODRL
NDRH
NDRL
Control logic
NDERH
PMR
NDERL
PCR
Figure 11.1 Block Diagram of PPG
Section 11 Programmable Pulse Generator (PPG)
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11.1.3 Pin Configuration
Table 11.1 summarizes the PPG pins.
Table 11.1 PPG Pins
Name Symbol I/O Function
Pulse output 0 PO0 Output Group 0 pulse output
Pulse output 1 PO1 Output
Pulse output 2 PO2 Output
Pulse output 3 PO3 Output
Pulse output 4 PO4 Output Group 1 pulse output
Pulse output 5 PO5 Output
Pulse output 6 PO6 Output
Pulse output 7 PO7 Output
Pulse output 8 PO8 Output Group 2 pulse output
Pulse output 9 PO9 Output
Pulse output 10 PO10 Output
Pulse output 11 PO11 Output
Pulse output 12 PO12 Output Group 3 pulse output
Pulse output 13 PO13 Output
Pulse output 14 PO14 Output
Pulse output 15 PO15 Output
Section 11 Programmable Pulse Generator (PPG)
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11.1.4 Registers
Table 11.2 summarizes the PPG registers.
Table 11.2 PPG Registers
Name Abbreviation R/W Initial Value Address*1
PPG output control register PCR R/W H'FF H'FF46
PPG output mode register PMR R/W H'F0 H'FF47
Next data enable register H NDERH R/W H'00 H'FF48
Next data enable register L NDERL R/W H'00 H'FF49
Output data register H PODRH R/(W)*2 H'00 H'FF4A
Output data register L PODRL R/(W) *2 H'00 H'FF4B
Next data register H NDRH R/W H'00 H'FF4C/
H'FF4E*3
Next data register L NDRL R/W H'00 H'FF4 D/
H'FF4F*3
Port 1 data direction register P1DDR W H'00 H'FEB0
Port 2 data direction register P2DDR W H'00 H'FEB1
Module stop control register MSTPCR R/W H'3FFF H'FF3C
Notes: 1. Lower 16 bits of the address.
2. Bits used for pulse output cannot be written to.
3. When the same output trigger is selected for pulse output groups 2 and 3 by the PCR
setting, the NDRH address is H'FF4C. When the output triggers are different, the NDRH
address is H'FF4E for group 2 and H'FF4C for group 3.
Similarly, when the same output trigger is selected for pulse output groups 0 and 1 by
the PCR setting, the NDRL address is H'FF4D. When the output triggers are different,
the NDRL address is H'FF4F for group 0 and H'FF4D for group 1.
Section 11 Programmable Pulse Generator (PPG)
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11.2 Register Descriptions
11.2.1 Next Data Enable Registers H and L (NDERH, NDERL)
NDERH
Bit : 7 6 5 4 3 2 1 0
NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 NDER8
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
NDERL
Bit : 7 6 5 4 3 2 1 0
NDER7 NDER6 NDER5 NDER4 NDER3 NDER2 NDER1 NDER0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
NDERH and NDERL are 8-bit readable/writable registers that enable or disable pulse output on a
bit-by-bit basis.
If a bit is enabled for pulse output by NDERH or NDERL, the NDR value is automatically
transferred to the corresponding PODR bit when the TPU compare match event specified by PCR
occurs, updating the output value. If pulse output is disabled, the bit value is not transferred from
NDR to PODR and the output value doe s not change.
NDERH and NDERL are each initialized to H '00 b y a reset and in hardware standby mode. They
are not initialized in software standby mode.
NDERH Bits 7 to 0—Next Data Enable 15 to 8 (NDER1 5 to NDER8 ): These bits enable or
disable pulse output on a bit-by-bit basis.
Bits 7 to 0
NDER15 to NDER8
Description
0 Pulse outputs PO15 to PO8 are disabled (NDR15 to NDR8 are not
transferred to POD15 to POD8) (Initial value)
1 Pul se outputs PO15 to PO8 are enabled (NDR15 to NDR8 are transferred
to POD15 to POD8)
Section 11 Programmable Pulse Generator (PPG)
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NDERL Bits 7 to 0—Next Data Enable 7 to 0 (NDER7 to NDER0): These bits enable or
disable pulse output on a bit-by-bit basis.
Bits 7 to 0
NDER7 to NDER0
Description
0 Pulse outputs PO7 to PO0 are disabled (NDR7 to NDR0 are not
transferred to POD7 to POD0) (Initial value)
1 Pulse outputs PO7 to PO0 are enabled (NDR7 to NDR0 are transferred to
POD7 to POD0)
11.2.2 Output Data Registers H and L (PODRH, PODRL)
PODRH
Bit : 7 6 5 4 3 2 1 0
POD15 POD14 POD13 POD12 POD11 POD10 POD9 POD8
Initial value : 0 0 0 0 0 0 0 0
R/W : R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)*
PODRL
Bit : 7 6 5 4 3 2 1 0
POD7 POD6 POD5 POD4 POD3 POD2 POD1 POD0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R/(W)*
Note: * A bit that has been set for pulse output by NDER is read-only.
PODRH and PODRL are 8-bit readable/writable registers that store output data for use in pulse
output.
Section 11 Programmable Pulse Generator (PPG)
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11.2.3 Next Data Registers H and L (NDRH, NDRL)
NDRH and NDRL are 8-bit readable/writable registers that store the next data for pulse output.
During pulse output, the contents of NDRH and NDRL are transferred to the corresponding bits in
PODRH and PODRL when the TPU compare match event specified by PCR occurs. The NDRH
and NDRL addresses differ depending on whether pulse output groups have the same output
trigger or different output triggers. For details see section 11.2.4, Notes on NDR Access.
NDRH and NDRL are each initialized to H'00 by a reset and in hardware standby mode. They are
not initialized in software standby mode.
11.2.4 Notes on NDR Access
The NDRH and NDRL addresses differ depending on whether pulse output groups have the same
output trigger or diffe re nt output t rig gers.
Same Trigger for Pulse Output Groups: If pulse output groups 2 and 3 are triggered by the
same compare match event, the NDRH address is H'FF4C. The upper 4 bits belong to group 3 and
the lower 4 bits to group 2. Address H'FF4E consists entirely of reserved bits that cannot be
modified and are always read as 1.
Address H'FF4C
Bit : 7 6 5 4 3 2 1 0
NDR15 NDR14 NDR13 NDR12 NDR11 NDR10 NDR9 NDR8
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
Address H'FF4E
Bit : 7 6 5 4 3 2 1 0
— — — — — — — —
Initial value : 1 1 1 1 1 1 1 1
R/W : — — — — — — — —
If pulse output groups 0 and 1 are triggered by the same compare match event, the NDRL address
is H'FF4D. The upper 4 bits belong to group 1 and the lower 4 bits to group 0. Address H'FF4F
consists entirely of reserved bits that cannot be modified and are always read as 1.
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Address H'FF4D
Bit : 7 6 5 4 3 2 1 0
NDR7 NDR6 NDR5 NDR4 NDR3 NDR2 NDR1 NDR0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
Address H'FF4F
Bit : 7 6 5 4 3 2 1 0
— — — — — — — —
Initial value : 1 1 1 1 1 1 1 1
R/W : — — — — — — — —
Different Triggers for Pulse Output Groups: If pulse output groups 2 and 3 are triggered by
different compare match events, the address of the upper 4 bits in NDRH (group 3) is H'FF4C and
the address of the lower 4 bits (group 2) is H'FF4E. Bits 3 to 0 of address H'FF4C and bits 7 to 4
of address H'FF4E are reserved bits that cannot be modified and are always read as 1.
Address H'FF4C
Bit : 7 6 5 4 3 2 1 0
NDR15 NDR14 NDR13 NDR12 — — — —
Initial value : 0 0 0 0 1 1 1 1
R/W : R/W R/W R/W R/W — — — —
Address H'FF4E
Bit : 7 6 5 4 3 2 1 0
— — — — NDR11 NDR10 NDR9 NDR8
Initial value : 1 1 1 1 0 0 0 0
R/W : — — — — R/W R/W R/W R/W
If pulse output groups 0 and 1 are triggered by different compare match event, the address of the
upper 4 bits in NDRL (group 1) is H'FF4D and the address of the lower 4 bits (group 0) is H'FF4F.
Bits 3 to 0 of address H'FF4D and bits 7 to 4 of address H'FF4F are reserved bits that cannot be
modified and are always read as 1.
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Address H'FF4D
Bit : 7 6 5 4 3 2 1 0
NDR7 NDR6 NDR5 NDR4 — — — —
Initial value : 0 0 0 0 1 1 1 1
R/W : R/W R/W R/W R/W — — — —
Address H'FF4F
Bit : 7 6 5 4 3 2 1 0
— — — — NDR3 NDR2 NDR1 NDR0
Initial value : 1 1 1 1 0 0 0 0
R/W : — — — — R/W R/W R/W R/W
11.2.5 PPG Output Control Register (PCR)
Bit : 7 6 5 4 3 2 1 0
G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0
Initial value : 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
PCR is an 8-bit readab le/writable register that selects output trigger signals for PPG outputs on a
group-by-group basis.
PCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in software
standby mode.
Bits 7 and 6—Group 3 Compare Match Select 1 and 0 (G3CMS1, G3CMS0): These bits
select the compare match that triggers pulse o utput group 3 (pins PO15 to PO12 ) .
Description
Bit 7
G3CMS1 Bit 6
G3CMS0
Output Trigger for Pulse Output Group 3
0 0 Compare match in TPU channel 0
1 Compare match in TPU channel 1
1 0 Compare match in TPU channel 2
1 Compare match in TPU channel 3 (Initial value)
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Bits 5 and 4—Group 2 Compare Match Select 1 and 0 (G2CMS1, G2CMS0): These bits
select the compare match that triggers pulse o utput gro up 2 (pins PO11 to PO8).
Description
Bit 5
G2CMS1 Bit 4
G2CMS0
Output Trigger for Pulse Output Group 2
0 0 Compare match in TPU channel 0
1 Compare match in TPU channel 1
1 0 Compare match in TPU channel 2
1 Compare match in TPU channel 3 (Initial value)
Bits 3 and 2—Group 1 Compare Match Select 1 and 0 (G1CMS1, G1CMS0): These bits
select the compare match that triggers pulse o utput gro up 1 (pins PO7 to PO4).
Description
Bit 3
G1CMS1 Bit 2
G1CMS0
Output Trigger for Pulse Output Group 1
0 0 Compare match in TPU channel 0
1 Compare match in TPU channel 1
1 0 Compare match in TPU channel 2
1 Compare match in TPU channel 3 (Initial value)
Bits 1 and 0—Group 0 Compare Match Select 1 and 0 (G0CMS1, G0CMS0): These bits
select the compare match that triggers pulse o utput gro up 0 (pins PO3 to PO0).
Description
Bit 1
G0CMS1 Bit 0
G0CMS0
Output Trigger for Pulse Output Group 0
0 0 Compare match in TPU channel 0
1 Compare match in TPU channel 1
1 0 Compare match in TPU channel 2
1 Compare match in TPU channel 3 (Initial value)
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11.2.6 PPG Output Mode Register (PMR)
Bit : 7 6 5 4 3 2 1 0
G3INV G2INV G1INV G0INV G3NOV G2NOV G1NOV G0NOV
Initial value : 1 1 1 1 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
PMR is an 8-bit readable/writable register that selects pulse output inversion and non-overlapping
operation for each group.
The output trigger period of a non-overlapping operation PPG output waveform is set in TGRB
and the non-overlap margin is set in TGRA. The output values change at compare match A and B.
For details, see section 11.3.4, Non-Overlapping Pulse Output.
PMR is initialized to H'F0 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit 7—Group 3 Inversion (G3INV): Selects direct output or inverted output for pulse output
group 3 (pins PO15 to PO12).
Bit 7
G3INV
Description
0 Inve rted output for pulse output group 3 (low-level output at pin for a 1 in PODRH)
1 Direct output for pulse output group 3 (high-level output at pin for a 1 in PODRH)
(Initial value)
Bit 6—Group 2 Inversion (G2INV): Selects direct output or inverted output for pulse output
group 2 (pins PO11 to PO8).
Bit 6
G2INV
Description
0 Inve rted output for pulse output group 2 (low-level output at pin for a 1 in PODRH)
1 Direct output for pulse output group 2 (high-level output at pin for a 1 in PODRH)
(Initial value)
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Bit 5—Group 1 Inversion (G1INV): Selects direct output or inverted output for pulse output
group 1 (pins PO7 to PO4).
Bit 5
G1INV
Description
0 Inverted output for pulse output group 1 (low-level output at pin for a 1 in PODRL)
1 Direct output for pulse output group 1 (high-level output at pin for a 1 in PODRL)
(Initial value)
Bit 4—Group 0 Inversion (G0INV): Selects direct output or inverted output for pulse output
group 0 (pins PO3 to PO0).
Bit 4
G0INV
Description
0 Inverted output for pulse output group 0 (low-level output at pin for a 1 in PODRL)
1 Direct output for pulse output group 0 (high-level output at pin for a 1 in PODRL)
(Initial value)
Bit 3—Group 3 Non-Overlap (G3NOV): Selects normal or non-overla pping operation for p ul s e
output group 3 (pins PO15 to PO12).
Bit 3
G3NOV
Description
0 Normal operation in pulse output group 3 (output values updated at compare match A
in the selected TPU channel) (Initial value)
1 Non-overlapping operation in pulse output group 3 (independent 1 and 0 output at
compare match A or B in the selected TPU channel)
Bit 2—Group 2 Non-Overlap (G2NOV): Selects normal or non-overla pping operation for p ul s e
output group 2 (pins PO11 to PO8).
Bit 2
G2NOV
Description
0 Normal operation in pulse output group 2 (output values updated at compare match A
in the selected TPU channel) (Initial value)
1 Non-overlapping operation in pulse output group 2 (independent 1 and 0 output at
compare match A or B in the selected TPU channel)
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Bit 1—Group 1 Non-Overlap (G1NOV): Selects normal or non-overla pping operation for p ul s e
output group 1 (pins PO7 to PO4).
Bit 1
G1NOV
Description
0 Normal operation in pulse output group 1 (output values updated at compare match A
in the selected TPU channel) (Initial value)
1 Non-overlapping operation in pulse output group 1 (independent 1 and 0 output at
compare match A or B in the selected TPU channel)
Bit 0—Group 0 Non-Overlap (G0NOV): Selects normal or non-overla pping operation for p ul s e
output group 0 (pins PO3 to PO0).
Bit 0
G0NOV
Description
0 Normal operation in pulse output group 0 (output values updated at compare match A
in the selected TPU channel) (Initial value)
1 Non-overlapping operation in pulse output group 0 (independent 1 and 0 output at
compare match A or B in the selected TPU channel)
11.2.7 Port 1 Data Direction Register (P1DDR)
Bit : 7 6 5 4 3 2 1 0
P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR
Initial value : 0 0 0 0 0 0 0 0
R/W : W W W W W W W W
P1DDR is an 8-bit write -only register, the individual bits of whic h specify i nput or output for the
pins of port 1.
Port 1 is multiplexed with pins PO15 to PO8. Bits corresponding to pins used for PPG output must
be set to 1. For further information about P1DDR, see section 9, I/O Po rt.
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11.2.8 Port 2 Data Direction Register (P2DDR)
Bit : 7 6 5 4 3 2 1 0
P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR
Initial value : 0 0 0 0 0 0 0 0
R/W : W W W W W W W W
P2DDR is an 8-bit write -only register, the individual bits of whic h specify i nput or output for the
pins of port 2.
Port 2 is multiplexed with pins PO7 to PO0. Bits corresponding to pins used for PPG output must
be set to 1. For further information about P2DDR, see section 9, I/O Po rt.
11.2.9 Module Stop Control Register (MSTPCR)
MSTPCRH MSTPCRL
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
When the MSTP11 bit in MSTPCR is set to 1, PPG operation stops at the end of the bus cycle and
a transition is made to module stop mode. Registers cannot be read or written to in module stop
mode. For details, see section 21.5, Module Stop Mode.
MSTP CR is initialized to H'3FFF by a reset a nd in hardware stand by mode. It is not initialized in
software standby mode.
Bit 11—Module Stop (MSTP11): Specifies the PPG module stop mode.
Bit 11
MSTP11
Description
0 PPG module stop mode cleared
1 PPG module stop mode set (Initial value)
Section 11 Programmable Pulse Generator (PPG)
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11.3 Operation
11.3.1 Overview
PPG pulse output is enabled when the corresponding bits in P1DDR, P2DDR, and NDER are set
to 1. In this state the corresponding PODR contents are output.
When the compare match event specified by PCR occurs, the corresponding NDR bit contents are
transferred to PODR to update the output values.
Figure 11.2 illustrates the PPG output ope ratio n and table 11.3 summarizes the PPG operating
conditions.
Output trigger signal
Pulse output pin Internal data bus
Normal output/inverted output
C
PODRQD
NDER
Q
NDRQD
DDR
Q
Figure 11.2 PPG Output Operation
Table 11.3 PPG Operating Conditions
NDER DDR Pin Function
0 0 Generic input port
1 Generic output port
1 0 Generic input port (but the PODR bit is a read-only bit, and when
compare match occurs, the NDR bit value is transferred to the PODR bit)
1 PPG pulse output
Sequential output of data of up to 16 bits is possible by writing new output data to NDR before
the next compare match. For details of non-overlapping operation, see section 11.3.4, Non-
Overlapping Pulse Output.
Section 11 Programmable Pulse Generator (PPG)
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11.3.2 Output Timing
If pulse output is enabled, NDR contents are transferred to PODR and output when the specified
compare match event occurs. Figure 11.3 shows the timing of these operations for the case of
normal output in groups 2 and 3, triggered by compare match A.
TCNT N N+1
φ
TGRA N
Compare match
A signal
NDRH
mn
PODRH
PO8 to PO15
n
mn
Figure 11.3 Timing of Transfer and Output of NDR Contents (Example)
Section 11 Programmable Pulse Generator (PPG)
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11.3.3 Normal Pulse Output
Sample Setup Pro cedure f or Normal Pulse Output: Figure 11.4 shows a sample procedure for
setting up normal pu l se output.
Select TGR functions [1]
Set TGRA value
Set counting operation
Select interrupt request
Set initial output data
Enable pulse output
Select output trigger
Set next pulse
output data
Start count
Set next pulse
output data
Normal PPG output
No
Yes
TPU setup
Port and
PPG setup
TPU setup
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
Compare match?
[1] Set TIOR to make TGRA an output
compare register (with output
disabled).
[2] Set the PPG output trigger period.
[3] Select the counter clock source
with bits TPSC2 to TPSC0 in TCR.
Select the counter clear source
with bits CCLR1 and CCLR0.
[4] Enable the TGIA interrupt in TIER.
The DTC or DMAC* can also be
set up to transfer data to NDR.
[5] Set the initial output values in
PODR.
[6]
Set the DDR and NDER bits for the
pins to be used for pulse output to 1.
[7] Select the TPU compare match
event to be used as the output
trigger in PCR.
[8] Set the next pulse output values in
NDR.
[9] Set the CST bit in TSTR to 1 to
start the TCNT counter.
[10]
At each TGIA interrupt, set the next
output values in NDR.
Note:* The DMAC is not supported in
the H8S/2321.
Figure 11.4 Setup Procedure for Normal Pulse Output (Example)
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Example of Normal Pulse Output (Example of Five-Phase Pulse Output): Figure 11.5 shows
an example in which pulse output is used for cyclic five-phase pulse output.
TCNT value TCNT
TGRA
H'0000
NDRH
00 80 C0 40 60 20 30 10 18 08 88
PODRH
PO15
PO14
PO13
PO12
PO11
Time
Compare match
C0
80
C080 40 60 20 30 10 18 08 88 80 C0 40
Figure 11.5 Normal Pulse Output Example (Five-Phase Pulse Output)
[1] Set up the T PU channel to be used as the output trigger channel so that TGRA is an output
compare register and the counter will be cleared by compare match A. Set the trigger period in
TGRA and set the TGIEA bit in TI ER to 1 to enable the compare match A (TGIA) interrupt.
[2] Write H'F8 in P1DDR and NDERH, and set the G3CMS1 , G3CMS0, G2CMS1, and G2 CMS0
bits in PCR to select compare match in the TPU channel set up in the previous step to be the
output trigger. Write output data H'80 in NDRH.
[3] T he ti mer counter in the TPU channel starts. When compare match A occurs, the NDRH
contents are transferred to PODRH and output. The TGIA interrupt handling routine writes the
next outp ut data (H'C0) i n NDRH.
[4] Five-phase overlapping pulse output (one or two phases active at a time) can be obtained
subsequently by writing H'40, H'60, H'20, H'30. H'10, H'18, H'08, H'88... at successive TGIA
interrupts. If the DTC or DMAC* is set for activation by this interrupt, pulse output can be
obtained without imposing a load on the CPU.
Note: * The DMAC is not supported in the H8S/2321.
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11.3.4 Non-O verlapping Pulse O utput
Sample Setup Pro cedure for Non-Ov erlapping Pulse Output: Figure 11.6 shows a sample
procedure for se t ting up non -ove rlapping pulse output.
Select TGR functions [1]
Set TGR values
Set counting operation
Select interrupt request
Set initial output data
Enable pulse output
Select output trigger
Set next pulse
output data
Start count
Set next pulse
output data
Compare match? No
Yes
TPU setup
PPG setup
TPU setup
Non-overlapping
PPG output
Set non-overlapping groups
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[11]
[1] Set TIOR to make TGRA and
TGRB an output compare registers
(with output disabled).
[2] Set the pulse output trigger period
in TGRB and the non-overlap
margin in TGRA.
[3] Select the counter clock source
with bits TPSC2 to TPSC0 in TCR.
Select the counter clear source
with bits CCLR1 and CCLR0.
[4] Enable the TGIA interrupt in TIER.
The DTC or DMAC* can also be
set up to transfer data to NDR.
[5] Set the initial output values in
PODR.
[6] Set the DDR and NDER bits for the
pins to be used for pulse output to
1.
[7] Select the TPU compare match
event to be used as the pulse
output trigger in PCR.
[8] In PMR, select the groups that will
operate in non-overlap mode.
[9] Set the next pulse output values in
NDR.
[10] Set the CST bit in TSTR to 1 to
start the TCNT counter.
[11] At each TGIA interrupt, set the next
output values in NDR.
Note:* The DMAC is not supported in
the H8S/2321.
Figure 11.6 Setup Procedure for Non-O verlapping Pulse Output ( Example)
Section 11 Programmable Pulse Generator (PPG)
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Example of Non-Overla pping Pulse Output (Example of Four-Phase Complementary Non-
Overlapping Output): Figure 11.7 shows an example in which pulse output is used for four-
phase complementary non-overlapping pulse output.
TCNT value
TCNT
TGRB
TGRA
H'0000
NDRH 95 65 59 56 95 65
00 95 05 65 41 59 50 56 14 95 05 65
PODRH
PO15
PO14
PO13
PO12
PO11
PO10
PO9
PO8
Time
Non-overlap margin
Figure 11.7 Non-Overlapping Pulse Output Example (Four-Phase Complementary)
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[1] Set up the TPU channel to be used as the output trigger channel so that TGRA and TGRB are
output compare registers. Set the trigger period in TGRB and the non-overlap margin in
TGRA, and set the counter to be cleared by compare match B. Set the TGIEA bit in TIER to 1
to enable the TGIA interrupt.
[2] Write H'FF in P1DDR and N DERH, and set the G3CMS1 , G3CMS0, G2CMS1, and G2 CMS0
bits in PCR to select compare match in the TPU channel set up in the previous step to be the
output trigger. Set the G3NOV and G2NOV bits in PMR to 1 to select non-overlapp ing o utput.
Write output data H'95 in NDRH.
[3] T he ti mer counter in the TPU channel starts. When a compare match with TGRB occurs,
outputs change from 1 to 0. When a compare match with TGRA occurs, outputs change from 0
to 1 (the change from 0 to 1 is delayed by the value set in TGRA). The TGIA interrupt
handling routine writes the next output data (H'65) in NDRH.
[4] Four-phase co mplementa ry non-overla ppi ng puls e ou tput c an b e ob tained subsequentl y by
writing H'59, H'56, H'95... at successive TGIA interrupts. If the DTC or DMAC* is set for
activation by this interrupt, pulse output can be obtained without imposing a load on the CPU.
Note: * The DMAC is not supported in the H8S/2321.
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11.3.5 Inverted Pulse Output
If the G3INV, G2INV, G1INV, and G0INV bits in PMR are cleared to 0, values that are the
inverse of the PODR contents can be output.
Figure 11.8 shows the outputs when G3INV and G2INV are cleared to 0, in addition to the
settings of figure 11.7.
TCNT value
TCNT
TGRB
TGRA
H'0000
NDRH 95 65 59 56 95 65
00 95 05 65 41 59 50 56 14 95 05 65
PODRL
PO15
PO14
PO13
PO12
PO11
PO10
PO9
PO8
Time
Figure 11.8 Inverted Pulse Output (Example)
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11.3.6 Pulse Output Trigg ered by Input Capture
Pulse output can be triggered by TPU input capture as well as by compare match. If TGRA
functions as an input capture register in the TPU channel selected by PCR, pulse output will be
triggered by the input capture signal.
Figure 11.9 shows the timing of this output.
φ
N
MN
TIOC pin
Input capture
signal
NDR
PODR
MN
PO
Figure 11.9 Pulse Output Triggered by Input Ca pture (Example)
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11.4 Usage Notes
11.4.1 Operation of Pulse Output Pins
Pins PO0 to PO15 are also used for other supporting functions such as the TPU. When output by
another supporting function is enabled, the corresponding pins cannot be used for pulse output.
Note, however, that data transfer from NDR bits to PODR bits takes place, regardless of the usage
of the pins.
Pin functions should be changed o nl y under conditions in which the output tri gger event will not
occur.
11.4.2 Note on Non-Ov erlapping Output
During non-overlapping operation, the transfer of NDR bit values to PODR bits takes place as
follows.
• NDR bits are always transferred to PODR bits at compare match A.
• At compare match B, NDR bits are transferred only if their value is 0. Bits are not transferred
if their value is 1.
Figure 11.10 illustrates the non-overlapping pulse output operation.
Compare match A
Compare match B
Pulse
output
pin Normal output/inverted output
C
PODRQD
NDER
Q
NDRQD
Internal data bus
DDR
Figure 11. 10 Non-Overlapping Pulse Output
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Therefore, 0 data can be transferred ahead of 1 data by making compare match B occur before
compare match A. The NDR contents should not be altered during the interval from compare
match B to compare match A (the non-overlap margin).
This can be accomplished by having the TGIA interrupt handling routine write the next data in
NDR, or by having the TGIA interrupt activate the DTC or DMAC*. Note, ho we ver, that the next
data must be written before the next compare match B occurs.
Figure 11.11 shows the timing of this operation.
Note: * The DMAC is not supported in the H8S/2321.
0/1 output0 output 0/1 output0 output
Do not write
to NDR here
Write to NDR
here
Compare match A
Compare match B
NDR
PODR
Do not write
to NDR here
Write to NDR
here
Write to NDR Write to NDR
Figure 11.11 Non-Overlapping Operation and NDR Write Timing
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Section 12 8-Bit Timers
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Section 12 8-Bit Timers
12.1 Overview
The chip includes an 8-bit timer module with two channels (TMR0 and TMR1). Each channel has
an 8-bit counter (TCNT) and two time constant registers (TCORA and TCORB) that are
constantly compared with the TCNT value to detect compare match events. The 8-bit timer
module can thus be used for a variety of functions, including pulse output with an arbitrary duty
cycle.
12.1.1 Features
The features of the 8-bit timer module are listed below.
• Seleyction of four cl ock sourc es
The counters can be driven by one of three internal clock signals (φ/8, φ/64, or φ/8192) or an
external clock input (enabling use as an external event counter)
• Seleyction of three ways to clear the counters
The counters can be cleared on compare match A or B, or by an external reset signal
• Timyer output control by a combination of two compare match signals
The timer output signal in each channel is controlled by a combination of two independent
compare match signals, enabling the timer to generate output wavefor ms with an arbitrary duty
cycle or PWM output
• Provision for cascading of two channels
⎯ Operation as a 16-bit timer is possible, using channel 0 for the upper 8 bits and channel 1
for the lower 8 bits (16-bit count mode)
⎯ Channel 1 can be used to count channel 0 compare matches (compare match count mode)
• Three independent interrupts
Compare match A and B and overflow interrupts can be requested independently
• A/D convert er conversion start tr igger c an be gener ated
Channel 0 compare match A signal can be used as an A/D converter conversion start trigger
• Module stop mode can be set
As the initial setting, 8-bit timer operation is halted. Register access is enabled by exitin g
module stop mode
Section 12 8-Bit Timers
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12.1.2 Block Diagram
Figure 12.1 shows a block diagram of the 8-bit timer module.
External clock source Internal clock sources
φ/8
φ/64
φ/8192
Clock 1
Clock 0
Compare match A1
Compare match A0
Clear 1
CMIA0
CMIB0
OVI0
CMIA1
CMIB1
OVI1
Interrupt signals
TMO0
TMRI0
Internal bus
TCORA0
Comparator A0
Comparator B0
TCORB0
TCSR0
TCR0
TCORA1
Comparator A1
TCNT1
Comparator B1
TCORB1
TCSR1
TCR1
TMCI0
TMCI1
TCNT0
Overflow 1
Overflow 0
Compare match B1
Compare match B0
TMO1
TMRI1
A
/D
conversion
start request
signal
Clock select
Control logic
Clear 0
Figure 12.1 Block Diagram of 8-Bit Timer Module
Section 12 8-Bit Timers
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12.1.3 Pin Configuration
Table 12.1 summarizes the input and output pins of the 8-bit timer module.
Table 12.1 Input and Output P i ns of 8-Bit Timer
Channel Name Symbol I/O Function
0 Timer output pin 0 TMO0 Output Outputs at compare match
T imer cloc k input pin 0 TMCI0 Input Inputs external clo ck for coun t er
Timer reset input pin 0 TMRI0 Input Inputs external reset to counter
1 Timer output pin 1 TMO1 Output Outputs at compare match
T imer cloc k input pin 1 TMCI1 Input Inputs external clo ck for coun t er
Timer reset input pin 1 TMRI1 Input Inputs external reset to counter
12.1.4 Register Configuration
Table 12.2 summarizes the registers of the 8-bit timer module.
Table 12.2 8-Bit Timer Registers
Channel Name Abbreviation R/W Initial value Address*1
0 Timer control register 0 TCR0 R/W H'00 H'FFB0
Timer control/status register 0 TCSR0 R/(W)*2 H'00 H'FFB2
Time constant register A0 TCORA0 R/W H'FF H'FFB4
Time constant register B0 TCORB0 R/W H'FF H'FFB6
Timer counter 0 TCNT0 R/W H'00 H'FFB8
1 Timer control register 1 TCR1 R/W H'00 H'FFB1
Timer control/status register 1 TCSR1 R/(W)*2 H'10 H'FFB3
Time constant register A1 TCORA1 R/W H'FF H'FFB5
Time constant register B1 TCORB1 R/W H'FF H'FFB7
Timer counter 1 TCNT1 R/W H'00 H'FFB9
All Module stop control register MSTPCR R/W H'3FFF H'FF3C
Notes: 1. Lower 16 bits of the address
2. Only 0 can be written to bits 7 to 5, to clear these flags.
Each pair of registers for channel 0 and channel 1 is a 16-bit register with the upper 8 bits for
channel 0 and the lower 8 bits for channel 1, so they can be accessed together by a word transfer
instruction.
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12.2 Register Descriptions
12.2.1 Timer Counters 0 and 1 (TCNT0, TCNT1)
TCNT0 TCNT1
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
TCNT0 and TCNT1 are 8-bit readable/writable up-counters that increment on pulses generated
from an internal or external clock source. This clock source is selected by clock select bits CKS2
to CKS0 in TCR. The CPU can read or write to TCNT0 and TCNT1 at all times.
TCNT0 and TCNT1 comprise a single 16-bit register, so they can be accessed together by a word
transfer instruction.
TCNT0 and TCNT1 can be cleared by an external reset input or by a compare match signal.
Which signal is to be used for clearing is selected by clock clear bits CCLR1 and CCLR0 in TCR.
When a timer counter overflows from H'FF to H'00, OVF in TCSR is set to 1 .
TCNT0 and TCNT1 are each initialized to H'00 by a reset and in hardware standby mode.
12.2.2 Time Constant Registers A0 and A1 (TCORA0 , TCORA1)
TCORA0 TCORA1
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
TCORA0 and TCORA1 are 8-bit readable/writable registers. TCORA0 and TCORA1 comprise a
single 16-bit register so they can be accessed together by a word transfer instruction.
TCORA is continually compared with the value in TCNT. When a match is detected, the
corresponding CMFA flag in TCSR is set. Note, however, that comparison is disabled during the
T2 state of a TCOR write cycle.
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The timer output can be freely controlled by these compare match signals and the settings of bits
OS1 and OS0 in TCSR.
TCORA0 and TCORA1 are each initialized to H'FF by a reset and in hardware standby mode.
12.2.3 Time Constant Registers B0 and B1 (TCORB0, TCORB1)
TCORB0 TCORB1
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
TCORB0 and TCORB1 are 8-bit readable/writable registers. TCORB0 and TCORB1 comprise a
single 16-bit register so they can be accessed together by a word transfer instruction.
TCORB is continually compared with the value in TCNT. When a match is detected, the
corresponding CMFB flag in TCSR is set. Note, however, that comparison is disabled during the
T2 state of a TCOR write cycle.
The timer output can be freely controlled by these compare match signals and the settings of
output select bits OS3 and OS2 in TCSR.
TCORB0 and TCORB1 are each initialized to H'FF by a reset and in hardware standby mode.
12.2.4 Time Control Registers 0 and 1 (TCR0, TCR1)
Bit : 7 6 5 4 3 2 1 0
CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
TCR0 and TCR1 are 8-bit readable/writable registers that select the clock source and the time at
which TCNT is cleared, and enable interrupts.
TCR0 and TCR1 are each initialized to H'00 by a reset and in hardware standby mode.
For details of this timing, see sectio n 12 .3, Operation.
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Bit 7—Compare Match Interrupt Enable B (CMIEB): Selects whether CMFB interrup t
requests (CMIB) are enabled or disabled when the CMFB flag in TCSR is set to 1.
Bit 7
CMIEB
Description
0 C MFB interrupt requests (CMIB) are disabled (Initial value)
1 C MFB interrupt requests (CMIB) are enabled
Bit 6—Compare Match Interrupt Enable A (CMIEA): Selects whether CMFA interrupt
requests (CMIA) are enabled or disabled when the CMFA flag in TCSR is set to 1.
Bit 6
CMIEA
Description
0 C MFA interrupt requests (CMIA) are disabled (Initial value)
1 C MFA interrupt requests (CMIA) are enabled
Bit 5—Timer Overflow Interrupt Enable (OVIE): Selects whether OVF interrupt requests
(OVI) are enabled or disabled when the OVF flag in TCSR is set to 1.
Bit 5
OVIE
Description
0 OVF interrupt requests (OVI) are disabled (Initial value)
1 OVF interrupt requests (OVI) are enabled
Bits 4 and 3 —Counter Clear 1 and 0 (CCLR1 and CCLR0): These bits select the method by
which TCNT is cleared: by compare match A or B, or by an external reset input.
Bit 4
CCLR1 Bit 3
CCLR0
Description
0 0 Clearing is disabled (Initial value)
1 Clear by compare match A
1 0 Clear by compare match B
1 Clear by rising edge of external reset input
Bits 2 to 0—Clock Select 2 to 0 (CKS2 to CKS0): These bits select whether the clock input to
TCNT is an internal or external clock.
Three internal clocks can be selected, all divided from the system clock (φ): φ/8, φ/64, and φ/8192.
The falling edge of the selected internal clock triggers the co unt.
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When use of an external clock is selected, three types of count can be selected: at the rising edge,
the falling edge, and both r ising a nd fa lling edges.
Some functions differ between channel 0 and channel 1.
Bit 2
CKS2 Bit 1
CKS1 Bit 0
CKS0
Description
0 0 0 Clock input disabled (Initial value)
1 Internal clock, counted at falling edge of φ/8
1 0 Internal clock, counted at falling edge of φ/64
1 Internal clock, counted at falling edge of φ/8192
1 0 0 For channel 0: count at TCNT1 overflow signal*
For channel 1: count at TCNT0 compare match A*
1 External clock, counted at rising edge
1 0 E xternal clock, counted at falling edge
1 External clo ck, counted at both rising and fal ling edges
Note: * If the count input of channel 0 is the TCNT1 overflow signal and that of channel 1 is the
TCNT0 compare match signal, no incrementing clock is generated. Do not use this setting.
12.2.5 Timer Control/Status Registers 0 and 1 (TCSR0, TCSR1)
TCSR0
Bit : 7 6 5 4 3 2 1 0
CMFB CMFA OVF ADTE OS3 OS2 OS1 OS0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/(W)* R/(W)* R/(W)* R/W R/W R/W R/W R/W
TCSR1
Bit : 7 6 5 4 3 2 1 0
CMFB CMFA OVF — OS3 OS2 OS1 OS0
Initial value : 0 0 0 1 0 0 0 0
R/W : R/(W)* R/(W)* R/(W)* — R/W R/W R/W R/W
Note: * Only 0 can be written to bits 7 to 5, to clear these flags.
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TCSR0 and TCSR1 are 8-bit registers that display compare match and overflow statuses, and
control compare match output.
TCSR0 is initialized to H'00, and TCSR1 to H'10, by a reset and in hardware standby mode.
Bit 7—Compare Match Flag B (CMFB): Status flag indicating whether the values of TCNT and
TCORB match.
Bit 7
CMFB
Description
0 [Clearing conditions] (Initial value)
• Cleared by reading CMFB when CMFB = 1, then writing 0 to CMFB
• When DTC is activated by CMIB interrupt while DISEL bit of MRB in DTC is 0
1 [Setting condition]
Set when TCNT matches TCORB
Bit 6—Compare Match Flag A (CMFA): Status flag indicating whether the values of TCNT and
TCORA match.
Bit 6
CMFA
Description
0 [Clearing conditions] (Initial value)
• Cleared by reading CMFA when CMFA = 1, then writing 0 to CMFA
• When DTC is activated by CMIA interrupt while DISEL bit of MRB in DTC is 0
1 [Setting condition]
Set when TCNT matches TCORA
Bit 5—Timer Overflow Flag (OVF): Status flag indicating that TCNT has overflowed (changed
from H'FF to H'00).
Bit 5
OVF
Description
0 [Clearing condition] (Initial value)
Cleared by reading OVF when OVF = 1, then writing 0 to OVF
1 [Setting condition]
Set when TCNT overflows from H'FF to H'00
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Bit 4—A/D Trigger Enable (ADT E) (TCSR0 Only): Selects enabling or disabling of A/D
converter start requests by compare match A.
In TCSR1, this bit is reserved: it is always read as 1 and cannot be modified.
Bit 4
ADTE
Description
0 A/D converter start requests by compare match A are disabled (Initial value)
1 A/D converter start requests by compare match A are enabled
Bits 3 to 0—Output Select 3 to 0 (OS3 to OS0): These bits specify how the timer output level is
to be changed by a compare match of TCOR and TCNT.
Bits OS3 and OS2 select the effect of compare match B on the output level, bits OS1 and OS0
select the effect of compare match A on the output level, and both of them can be controlled
independently.
Note, however, that priorities are set such that: to g gle output > 1 output > 0 output. If compare
matches occur simultaneously, the output changes according to the compare match with the higher
priority.
Timer output is disabled when bits OS3 to OS0 are all 0.
After a reset, the timer output is 0 until the first compare match event occurs.
Bit 3
OS3 Bit 2
OS2
Description
0 0 No change when compare match B occurs (Initial value)
1 0 is output when compare match B occurs
1 0 1 is output when compare match B occurs
1 Output is inverted when compare match B occurs (toggle output)
Bit 1
OS1 Bit 0
OS0
Description
0 0 No change when compare match A occurs (Initial value)
1 0 is output when compare match A occurs
1 0 1 is output when compare match A occurs
1 Output is inverted when compare match A occurs (toggle output)
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12.2.6 Module Stop Control Register (MSTPCR)
MSTPCRH MSTPCRL
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
When the MSTP 12 bit in MSTPCR is set to 1, the 8-bit timer operatio n stops at the end of the bus
cycle and a transition is made to module stop mode. Registers cannot be read or written to in
module stop mode. For details, see section 21.5, Module Stop Mode.
MSTP CR is initialized to H'3FFF by a reset a nd in hardware stand by mode. It is not initialized in
software standby mode.
Bit 12—Module Stop (MSTP12): Specifies the 8-bit timer module stop mode.
Bit 12
MSTP12
Description
0 8-bit timer module stop mode cleared
1 8-bit timer module stop mode set (Initial value)
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12.3 Operation
12.3.1 TCNT Incrementation Timing
TCNT is incremented by input clock pulses (either internal or external).
Internal Clock: Three different internal clock signals (φ/8, φ/64, or φ/8192) di v i ded from the
system clock (φ) can be selected, by setting bits CKS2 to CKS0 in TCR. Figure 12.2 shows the
count timing.
φ
Internal clock
Clock input
to TCNT
TCNT N–1 N N+1
Figure 12.2 Count Timing for Internal Clock Input
External Clock: Three incrementation methods can be selected b y setting bits CKS2 to CKS0 in
TCR: at the rising edge, the fa llin g edge, and both risi ng and falling edges.
Note that the external clock pulse width must be at least 1.5 states for incrementation at a single
edge, and at least 2.5 states for incrementation at both edges. The counter will not increment
correctly if the pulse width is less than these values.
Figure 12.3 shows the timing of incrementation at both edges of an external clock signal.
Section 12 8-Bit Timers
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φ
External clock
input pin
Clock input
to TCNT
TCNT N–1 N N+1
Figure 12.3 Count Timing for External Clock Input
12.3.2 Compare Match Timing
Setting of Co mpare Match Flags A and B (CMFA, CMFB): The CMFA and CMFB flags in
TCSR are set to 1 by a compare match signal generated when the TCOR and TCNT values match.
The compare match signal is ge nerated at the last state in which the match is true, just before the
timer counter is updated.
Therefore, when TCOR and TCNT match, the compare match signal is not generated until the
next incrementation clock input. Figure 12.4 shows this timing.
φ
TCNT N N+1
TCOR N
Compare match
signal
CMF
Figure 12.4 Timing of CMF Setting
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Timer Output Timing: When compare match A or B occurs, the timer output changes as
specified by bits OS3 to OS0 in TCSR. Depending on these bits, the output can remain the same,
chan ge to 0, change t o 1, or toggle.
Figure 12.5 shows the timing when the output is set to toggle at compare match A.
φ
Compare match A
signal
Timer output pin
Figure 12.5 Timing of Timer Output
Timing of Compare Match Clear: The timer counter is cleared when compare match A or B
occurs, depending on the setting of the CCLR1 and CCLR0 bits in TCR. Figure 12.6 shows the
timing of this operation.
φ
N H'00
Compare match
signal
TCNT
Figure 12.6 Timing of Compare Match Clear
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12.3.3 Timing of TCNT External Reset
TCNT is cleared at the rising edge of an external reset input, depending on the settings of the
CCLR1 and CCLR0 bits in TCR. The clear pulse width must be at least 1.5 states. Figure 12.7
shows the timin g of this o peration.
φ
Clear signal
External reset
input pin
TCNT N H'00N–1
Figure 12.7 Timing of Clearance by External Reset
12.3.4 Timing of Overflow Flag (OVF) Setting
The OVF in TCSR is set to 1 when TCNT overflows (changes from H'FF to H'00). Figure 12.8
shows the timin g of this o peration.
φ
OVF
Overflow signal
TCNT H'FF H'00
Figure 12.8 Timing of OVF Setting
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12.3.5 Operation with Cascaded Connection
If bits CKS2 to CKS0 in either TCR0 or TCR1 are set to B’100, the 8-bit timers of the two
channels are cascaded. With this configuration, a single 16-bit timer could be used (16-bit counter
mode) or compare matches of the 8-bit channel 0 could be counted by the timer of channel 1
(compare match counter mode). In this case, the timer operates as below.
16-Bit Counter Mode: When bits CKS2 to CKS0 in TCR0 are set to B'100, the timer functions
as a single 16-bit timer with channel 0 occupying the upper 8 bits and channel 1 occupying the
lower 8 bits.
• Setting of compare match flag s
⎯ The CMF flag in TCSR0 is set to 1 when a 16-bit compare match event occurs.
⎯ The CMF flag in TCSR1 is set to 1 when a lower 8-bit compare match event occurs.
• Counter clear specification
⎯ If the CCLR 1 and CCLR0 bits in TCR0 have been set for counter clear at compare match,
the 16-bit counter (TCNT0 and TCNT1 together) is cleared when a 16-bit compare match
event occurs. The 16-bit counter (TCNT0 and TCNT1 together) is cleared even if counter
clear by the TMRI0 pin has also been set.
⎯ The settings of the CCLR1 and CCLR0 bits in TCR1 are igno r ed. The lower 8 bits cannot
be cleared independently.
• Pin output
⎯ Control of output from the TMO0 pin by bits OS3 to OS0 in TCSR0 is in accordance with
the 16-bit compare match conditions.
⎯ Control of output from the TMO1 pin by bits OS3 to OS0 in TCSR1 is in accordance with
the lower 8-bit compare match conditions.
Compare Mat ch Counter Mode: When bits CKS2 to CKS0 in TCR1 are B'100, TCNT1 counts
compare match A’s for channel 0.
Channels 0 and 1 are controlled independentl y. Conditions such as setting of the CMF fla g,
generation of interrupts, output from the TMO pin, and counter clear are in accordance with the
settings for each channel.
Usage Note: If the 16-bit counter mode and compare match counter mode are set simultaneously,
the input clock pulses for TCNT0 and TCNT1 are not generated and thus the counters will stop
operating. Software should therefore avoid using both these modes.
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12.4 Interrupts
12.4.1 Interrupt So urces and DT C Activatio n
There are three 8-bit timer interrupt sources: CMIA, CMIB, and OVI. Their relative priorities are
shown in table 12.3. Each interrupt source is set as enabled or disabled by the corresponding
interrupt enable bit in TCR, and independent interrupt requests are sent for each to the interrupt
controller. It is also possible to activate the DTC by means of CMIA and CMIB interrupts.
Table 12.3 8-Bit Timer Interrupt Sources
Channel Interrupt Source Description DTC Activation Priority
0 CMIA0 Interrupt by CMFA Possible High
CMIB0 Interrupt by CMFB Possible
OVI0 Interrupt by OVF Not possible
1 CMIA1 Interrupt by CMFA Possible
CMIB1 Interrupt by CMFB Possible
OVI1 Interrupt by OVF Not possible Low
Note: This table shows the initial state immediately after a reset. The relative channel priorities
can be changed by the interru pt control ler.
12.4.2 A/D Converter Activation
The A/D converter can be activated only by channel 0 compare match A.
If the ADTE bit in TCSR0 is set to 1 when the CMFA flag is set to 1 b y the occurrence of channel
0 compare match A, a request to start A/D conversion is sen t to the A/D converter. If the 8-bit
timer conversion start trigger has been selected on the A/D converter side at this time, A/D
conversion is started.
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12.5 Sample Application
In the example below, the 8-bit timer is used to generate a pulse output with a selected duty cycle,
as shown in figure 12.9. T he control bits are set as follo ws:
[1] In TCR, bit CCLR1 is cleared to 0 and b it CCLR0 is set to 1 so that the timer counter is
cleared when its value matches the constant in TCORA.
[2] In TCSR, bits OS3 to OS0 are set to B'0110, causing the output to change to 1 at a TCORA
compare match and to 0 at a TCORB compare match.
With these settings, the 8-bit timer provides output of pulses at a rate d etermined by TCORA with
a pulse width determined by TCORB. No software intervention is required.
TCNT
H'FF Counter clear
TCORA
TCORB
H'00
TMO
Figure 12.9 Example of Pulse Output
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12.6 Usage Notes
Note that the following kinds of contention can occur in the 8-bit timer module.
12.6.1 Contention between TCNT Write and Clear
If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the clear
takes priority, so that the counter is cleared and the write is not performed.
Figure 12.10 shows this operation.
φ
A
ddress TCNT address
Internal write signal
Counter clear signal
TCNT N H'00
T
1
T
2
TCNT write cycle by CPU
Figure 12.10 Contention between TCNT Write and Clear
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12.6.2 Contention between TCNT Write and Increment
If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the write
takes priority and the counter is not incremented.
Figure 12.11 shows this operation.
φ
A
ddress TCNT address
Internal write signal
TCNT input clock
TCNT NM
T
1
T
2
TCNT write cycle by CPU
Counter write data
Figure 12.11 Contention between TCNT Write and Increment
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12.6.3 Contention between TCOR Write and Co mpare Match
During the T2 state of a TCOR write cycle, the TCOR write has priority and the compare match
signal is inhibited even if a compare match event occurs.
Figure 12.12 shows this operation.
φ
A
ddress TCOR address
Internal write signal
TCNT
TCOR NM
T
1
T
2
TCOR write cycle by CPU
TCOR write data
N N+1
Compare match signal
Prohibited
Figure 12.12 Contention between TCOR Write and Compare Match
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12.6.4 Contentio n bet ween Co mpare Matches A and B
If compare match events A and B occur at the same time, the 8-bit timer operates in accordance
with the priorities for the output statuses set for compare match A and compare match B, as shown
in table 12.4.
Table 12.4 Timer Output Priorities
Output Setting Priority
Toggle output High
1 output
0 output
No change Low
12.6.5 Switching of Internal Clocks and TCNT Operation
TCNT may increment erroneously when the internal clock is switched over. Table 12.5 shows the
relationship between the timing at which the internal clock is switched (b y writing to the CKS1
and CKS0 bits) and the TCNT operation.
When the TCNT clock is generated from an internal clock, the falling edge of the internal clock
pulse is detected. If clock switching causes a change from high to low level, as shown in case 3 in
table 12.5, a TCNT clock pulse is generated on the assumption that the switchover is a falling
edge. This increments TCNT.
The erroneous incrementation can also happen when switching between internal and external
clocks.
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Table 12.5 Switching of Internal Clock and TCNT Operation
No.
Timing of Switchover
by Means of CKS1
and CKS0 Bits
TCNT Clock Operation
1 Switching from
low to low*1
Clock before
switchover
Clock after
switchover
TCNT clock
TCNT
CKS bit write
N N+1
2 Switching from
low to high*2
Clock before
switchover
Clock after
switchover
TCNT clock
TCNT
CKS bit write
NN+1N+2
3 Switching from
high to low*3
Clock before
switchover
Clock after
switchover
TCNT clock
TCNT
CKS bit write
NN+1 N+2
*4
Section 12 8-Bit Timers
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No.
Timing of Switchover
by Means of CKS1
and CKS0 Bits
TCNT Clock Operation
4 Switching from high
to high
Clock before
switchover
Clock after
switchover
TCNT clock
TCNT
CKS bit write
NN+1N+2
Notes: 1. Includes switching from low to stop, and from stop to low.
2. Includes switching from stop to high.
3. Includes switching from high to stop.
4. Generated on the assumption that the switchover is a falling edge; TCNT is
incremented.
12.6.6 Interrupts and Module Stop Mo de
If module stop mode is entered when an interrupt has been re q uested, it will not be possib le to
clear the CPU interrupt source or the DMAC* or DTC activation source. Interrupts should
therefore be disabled before entering module stop mode.
Note: * The DMAC is not supported in the H8S/2321.
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Section 13 Watchdog Timer
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Section 13 Watchdog Timer
13.1 Overview
The chip has a single -channel on-chip watchdog ti mer (WDT) for monitoring syst em o per ation.
The WDT outputs an overflow signal (WDTOVF)* if a system crash prevents the CPU from
writing to the timer counter, allowing it to overflow. At the same time, the WDT can also generate
an internal reset signal for the chip.
When this watchdog function is not needed, the WDT can be used as an interval timer. In interval
timer operation, an interval timer interrupt is generated each time the counter overflows.
13.1.1 Features
WDT features are listed below.
• Switchable between watchdog timer mode and interval timer mode
• WDTOVF output when in watchdog timer mode*
If the counter overflows, the WDT outputs WDTOVF*. It is possible to select whether or not
the entire chip is reset at the same time
• Interrupt generation when in interval timer mode
If the counter overflows, the WDT generates an interval timer interrupt
• Choice of eight counter clock sources
Note: * The WDTOVF pin function cannot be us ed in the F- ZTAT vers ions .
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13.1.2 Block Diagram
Figure 13.1 shows a block diagram of the WDT.
Overflow
Interrupt
control
WOVI
(interrupt request
signal)
WDTOVF*1
Internal reset signal*2Reset
control
RSTCSR TCNT TSCR
φ/2
φ/64
φ/128
φ/512
φ/2048
φ/8192
φ/32768
φ/131072
Clock Clock
select
Internal clock
sources
Bus
interface
Module bus
Legend:
TCSR:
TCNT:
RSTCSR:
Notes:
Timer control/status register
Timer counter
Reset control/status register
Internal bus
WDT
1. The WDTOVF pin function cannot be used in the F-ZTAT versions.
2. Internal reset signal generation is specified by means of a register setting.
Figure 13.1 Block Diagram of WDT
Section 13 Watchdog Timer
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13.1.3 Pin Configuration
Table 13.1 describes the WDT output pin.
Table 13.1 WDT Pin
Name Symbol I/O Function
Watchdog timer overf low WDTOVF* Output Outputs counter overflow signal in watchdog
timer mode
Note: * The WDTOVF pin function cannot be used in the F-ZTAT versions.
13.1.4 Register Configuration
The WDT has three registers, as summarized in table 13.2. These registers control clock selection,
WDT mode switching, and the reset signal.
Table 13.2 WDT Registers
Address*1
Name Abbreviation R/W Initial Value Write*2 Read
Timer control/status register TCSR R/(W)*3 H'18 H'FFBC H'FFBC
Timer counter TCNT R/W H'00 H'FFBC H'FFBD
Reset control/ status regi ster RSTCSR R/(W)*3 H'1F H'FFBE H'FFBF
Notes: 1. Lower 16 bits of the address.
2. For details of write operations, see section 13.2.4, Notes on Register Access.
3. Only a write of 0 is permitted to bit 7, to clear the flag.
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13.2 Register Descriptions
13.2.1 Timer Counter (TCNT)
Bit : 7 6 5 4 3 2 1 0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
TCNT is an 8-bit readable/writable*1 up-counter.
When the TME bit is set to 1 in TCSR, TCNT starts counting pulse s generate d from the inter nal
clock source selected by bits CKS2 to CKS0 in TCSR. When the count overflows (changes from
H'FF to H'00), either the watchdog timer overflow signal (WDTOVF)*2 or an interval timer
interrupt (WOVI) is generated, depending on the mode selected by the WT/IT bit in TCSR.
TCNT is initialized to H'00 by a reset, in hardware standby mode, or when the TME bit is cleared
to 0. It is not initialized in software standby mode.
Notes: 1. TCNT is write-protected by a password to prevent accidental overwriting. For details
see section 13.2.4, Notes on Register Access.
2. The WDTOVF pin functi on cannot be used in the F-ZTAT versions.
Section 13 Watchdog Timer
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13.2.2 Timer Control/Status Register (TCSR)
Bit : 7 6 5 4 3 2 1 0
OVF WT/IT TME — — CKS2 CKS1 CKS0
Initial value : 0 0 0 1 1 0 0 0
R/W : R/(W)* R/W R/W — — R/W R/W R/W
Note: * Only 0 can be written, to clear the flag.
TCSR is an 8-bit readable/writable* register . Its functi ons inc l ude selecting the clock source t o be
input to TCNT, and the timer mode.
TCR is initialized to H'18 by a reset and in hardware standby mode. It is not initialized in software
standby mode.
Note: * TCSR is write-protected by a password to prevent accidental overwriting. For details see
section 13.2.4, Notes on Register Access.
Bit 7—Overflow Flag (OVF): Indicates that TCNT has overflowed from H'FF to H'00, when in
interval timer mode. This flag cannot be set during watchdog timer operation.
Bit 7
OVF
Description
0 [Clearing condition] (Initial value)
Cleared by reading TCSR when OVF = 1*, then writing 0 to OVF
1 [Setting condition]
Set when TCNT overflows (changes from H'FF to H'00) in interval timer mode
Note: * When OVF is polled and the interval timer interrupt is disabled, OVF = 1 must be read at
least twice.
Bit 6—Timer Mode Select (WT/IT): Selects whether the WDT is used as a watchdog timer or
interval timer. If used as an interval timer, the WDT generates an interval timer interrupt request
(WOVI) when TCNT overflows. If used as a watchdog timer, the WDT generates the WDTOVF
signal*1 when TCNT overflows.
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Bit 6
WT/IT
Description
0 Interval timer: Sends the CPU an interval timer interrupt request (WOVI)
when TCNT overflows (Initial value)
1 Watchdog timer: Generates the WDTOVF signal*1 when TCNT overflows*2
Notes: 1. The WDTOVF pin function cannot be used in the F-ZTAT versions.
2. For details of the case where TCNT overflows in watchdog timer mode, see section
13.2.3, Reset Control/Status Register (RSTCSR).
Bit 5 — Timer Enable (TME): Selects whether TCN T runs or is halte d.
Bit 5
TME
Description
0 TCNT is initialized to H'00 and halted (Initial value)
1 TCNT counts
Bits 4 and 3—Reserved: These bits cannot be modified and are always read as 1.
Bits 2 to 0—Clock Select 2 to 0 (CKS2 to CKS0): These bits select one of eight internal clock
sources, obtained by dividing the system clock (φ), for input to TCNT.
Description
Bit 2
CKS2 Bit 1
CKS1 Bit 0
CKS0
Clock
Overflow Period (when φ = 20 MHz)*
0 0 0 φ/2 (Initial value) 25.6 µs
1 φ/64 819.2 µs
1 0 φ/128 1.6 ms
1 φ/512 6.6 ms
1 0 0 φ/2048 26.2 ms
1 φ/8192 104.9 ms
1 0 φ/32768 419.4 ms
1 φ/131072 1.68 s
Note: * The overflow period is the time from when TCNT starts counting up from H'00 until overflow
occurs.
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13.2.3 Reset Control/Status Register (RSTCSR)
Bit : 7 6 5 4 3 2 1 0
WOVF RSTE — — — — — —
Initial value : 0 0 0 1 1 1 1 1
R/W : R/(W)* R/W R/W — — — — —
Note: * Only 0 can be written, to clear the flag.
RSTCSR is an 8 -bit read ab le/writable* register that contro ls the generation of the internal reset
signal when TCNT overflows, and selects the type of internal reset signal.
RSTCSR is initialized to H'1F by a reset signal from the RES pin, but not by the WDT internal
reset signal caused by overflows.
Note: * RSTCSR is write-protected by a password to prevent accidental overwriting. For details
see section 13.2.4, Notes on Register Access.
Bit 7—Watchdog Timer Overflow Flag (WOVF): Indicates that TCNT has overflowed
(changed from H'FF to H'00) during watchdog ti mer operation. This bit is not set in interval timer
mode.
Bit 7
WOVF
Description
0 [Clearing condition] (Initial value)
Cleared by reading RSTCSR when WOVF = 1, then writing 0 to WOVF
1 [Setting condition]
Set when TCNT overflows (changes from H'FF to H'00) during watchdog timer
operation
Bit 6—Reset Enable (RSTE): Specifies whether or not a reset signal is generated in the chip if
TCNT overflows during watchdog timer operation.
Bit 6
RSTE
Description
0 R eset sig nal is not gener ated if TCNT overflow s* (Initial value)
1 R eset sig nal is gen erate d if TC NT overflows
Note: * The modules within the chip are not reset, but TCNT and TCSR within the WDT are reset.
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Bit 5—Reserved: This bit should be written with 0.
Bits 4 to 0—Reserved: These bits cannot be modified and are always read as 1.
13.2.4 Notes on Register Access
The watchdog timer’s TCNT, TCSR, and RSTCSR registers differ from other registers in being
more difficult to write to. The procedures for writing to and reading these registers are given
below.
Writing to TCNT and TCSR: These registers must be written to by a word transfer instruction.
They cannot be written to with byte instructions.
Figure 13.2 sho ws the format of data written to TCNT and TCSR. TCNT and TCSR both have the
same write address. For a write to TCNT, the upper byte of the writte n word must contain H'5 A
and the lower byte must contain the write data. For a write to TCSR, the upp er byte of the written
word must contain H'A5 and the lower byte must contain the write data. This transfers the write
data from the lower byte to TCNT or TCSR.
TCNT write
TCSR write
Address: H'FFBC
Address: H'FFBC
H'5A Write data
15 8 7 0
H'A5 Write data
15 8 7 0
Figure 13.2 Writing to TCNT and TCSR
Writing to RSTCSR: RSTCSR must be written to by a word transfer instructio n to address
H'FFBE. It cannot be written to with byte instructions.
Figure 13.3 shows the format of data written to RSTCSR. The method of writing 0 to the WOVF
bit differs from that for writing to the RSTE bit.
To write 0 to the WOVF bit, the write data must have H'A5 in the uppe r b yte and H'00 in the
lower byte. This clears the WOVF bit to 0, but has no effect on the RSTE bit. To write to the
RSTE bit, the upper byte must contain H'5A and the lower byte must contain the write data. This
writes the value in bit 6 of the lower byte into the RSTE bit, but has no effect on the WOVF bit.
Section 13 Watchdog Timer
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H'A5 H'00
15 8 7 0
H'5A Write data
15 8 7 0
Writing 0 to WOVF bit
Writing to RSTE bit
Address: H'FFBE
Address: H'FFBE
Figure 13.3 Writing to RSTCSR
Reading TCN T, TCSR, and RSTCSR: These registers are read in the same way as other
registers. The read addresses are H'FFBC for TCSR, H'FFBD for TCNT, and H'FFBF for
RSTCSR.
13.3 Operation
13.3.1 Operation in Watchdog Timer Mode
To use the WDT as a watchdog timer, set the WT /IT and TME bits to 1. Software must prevent
TCNT overflows by rewriting the TCNT value (normally be writing H'00) before overflow occurs.
This ensures that TCNT does not overflow while the system is operating normally. If TCNT
overflows without being rewritten because of a system crash or other error, the WDTOVF signal*
is output. This is shown in figure 13.4. This WDTOVF signal* can be used to reset the system.
The WDTOVF signal* is output for 132 states when RSTE = 1, and for 130 states when RSTE =
0.
If TCNT overflows when 1 is set in the RSTE bit in RSTCSR, a signal t hat reset s the c hip
internally is generated at the same time as the WDTOVF signal*. The internal reset signal is
output for 518 states.
If a reset caused by a signal input to the RES pin occurs at the same time as a reset caused by a
WDT overflow, the RES p in reset has priority and the WOV F b it in RSTCSR is cleared to 0.
Note: * The WDTOVF pin function cannot be us ed in the F- ZTAT vers ions .
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TCNT count
H'00 Time
H'FF
WT/IT=1
TME=1 H'00 written
to TCNT WT/IT=1
TME=1 H'00 written
to TCNT
132 states*
2
518 states
WDTOVF signal*
3
Internal reset signal*
1
WT/IT:
TME:
Notes: 1. The internal reset signal is generated only if the RSTE bit is set to 1.
2. 130 states when the RSTE bit is cleared to 0.
3. The WDTOVF pin function cannot be used in the F-ZTAT versions.
Overflow
WDTOVF*
3
and
internal reset are
generated
WOVF=1
Timer mode select bit
Timer enable bit
Legend:
Figure 13.4 Operation in Watchdog Timer Mode
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13.3.2 Operation in Interval Timer Mode
To use the WDT as an interval timer, clear the WT/IT bit in TCSR to 0 and set the TME b it to 1.
An interval timer interrupt (WOVI) is generated each time TCNT overflows, provided that the
WDT is operating as an interval timer, as shown in figure 13.5. This function can be used to
generate interrupt requests at regular intervals.
TCNT count
H'00 Time
H'FF
WT/IT=0
TME=1 WOVI
Overflow Overflow Overflow Overflow
Legend:
WOVI: Interval timer interrupt request generation
WOVI WOVI WOVI
Figure 13.5 Operation in Interval Timer Mode
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13.3.3 Timing of Overflow Flag (OVF) Setting
The OVF flag is set to 1 if TC NT overflows during interval timer operation. At the same time, an
interval timer interrupt (WOVI) is requested. This ti ming is sho wn in figure 13.6 .
φ
TCNT H'FF H'00
Overflow signal
(internal signal)
OVF
Figure 13.6 Timing of OVF Setting
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13.3.4 Timing of Watchdog Timer Overflow Flag (WOVF) Setting
The WOVF flag is set to 1 if TCNT overflows during watchdog timer operation. At the same time,
the WDTOVF signal* goes low. If TCNT overflows while the RSTE bit in RSTCSR is set to 1, an
internal reset signal is generated for the entire chip. Figure 13 .7 shows the timing in this case.
Note: * The WDTOVF pin funct ion cannot b e used in the F-ZTAT versions .
φ
TCNT
Note: * The WDTOVF pin function cannot be used in the F-ZTAT versions.
H'FF H'00
Overflow signal
(internal signal)
WOVF
WDTOVF signal*
Internal reset
signal
132 states
518 states
Figure 13.7 Timing of WOVF Setting
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13.4 Interrupts
During interval timer mode operation, an overflow generates an interval timer interrupt (WOVI).
The interval timer interrupt is requested whenever the OVF flag is set to 1 in TCSR.
13.5 Usage Notes
13.5.1 Contention between Timer Counter (TCNT) Write and Increment
If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the write
takes priority and the timer counter is not incremented. Fi gure 1 3 .8 shows this operation.
A
ddress
φ
Internal write signal
TCNT input clock
TCNT NM
T
1
T
2
TCNT write cycle
Counter write data
Figure 13.8 Contention between TCNT Write and Increment
Section 13 Watchdog Timer
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13.5.2 Changing Value of CKS2 to CKS0
If bits CKS2 to CKS0 in TCSR are written to while the WDT is operating, errors may occur in the
incrementation. Software must stop the watchdog ti mer (by clearing the TME bit to 0) before
changing the value of bits CKS2 to CKS0.
13.5.3 Switching betw een Watchdog Timer Mode and Interval Timer Mode
If the mode is switched from watchdog timer to interval timer, o r vice versa, while the WDT is
operating, errors may occur in the incrementation. Software must stop the watchdog timer (by
clearing the TME bit to 0) before switching the mode.
13.5.4 System Reset by WDTOVF Signal*
If the WDTOVF output signal* is input to the RES pin of the chip, the chip will not be initialized
correctly. Make sure that the WDTOVF signal * is not input logicall y to the RES pin. To reset the
entire system by means of the WDTOVF signal *, use the circuit shown in figure 13.9.
Note: * The WDTOVF pin function cannot be us ed in the F- ZTAT vers ions .
Reset input
Reset signal to entire system
Chip
RES
WDTOVF*
Note: * The WDTOVF pin function cannot be used in the F-ZTAT versions.
Figure 13.9 Circuit for System Reset by WDTOVF Signal (Example)
Section 13 Watchdog Timer
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13.5.5 Internal Reset in Watchdog Timer Mode
The chip is not reset internally if TCNT overflows while the RSTE b it is cleared to 0 during
watchdog timer operation, but TCNT and TCSR of the WDT are reset.
TCNT, TCSR, and RSTCR cannot be written to while the WDTOVF signal* is low. Also note that
a read of the WOVF flag is not recognized during this period. To clear the WOVF flag, therefore,
read RSTCSR after the WDTOVF signal* goes high, then write 0 to the WOVF fla g.
Note: * The WDTOVF pin function cannot be us ed in the F- ZTAT vers ions .
Section 14 Serial Communication Interface (SCI)
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Section 14 Serial Communication Interface (SCI)
14.1 Overview
The chip is equipped with a serial communication interface (SCI) that can handle both
async hronous and s ynchronous serial communi cat ion. A function is also pr ovide d for serial
communication between processo rs (multiprocessor communication function).
14.1.1 Features
SCI features are listed below.
• Choice of asynchronous or synchronous serial communication mode
Asynchronous mode
⎯ Serial data co mmunication execute d usi ng an asynchronous system in wh i ch
synchronization is achieved character by character
⎯ Serial data communication can be carried out with standard asynchronous communication
chips such as a Universal Asynchronous Receiver/Transmitter (UART) or Asynchronous
Communication Interface Adapter (ACIA)
⎯ A multiprocessor communication function is provided that enables serial data
communication with a number of processors
⎯ Choice of 12 serial data transfer formats
Data length: 7 or 8 bits
Stop bit length: 1 or 2 bits
Parity: Even, odd, or none
Multiprocessor bit: 1 or 0
⎯ Receive error detection: Parity, overrun, and framing errors
⎯ Break detection: Break can be detected by reading the RxD pin level directly in case of a
framing error
Synchr o no us mo d e
⎯ Serial data communication synchronized with a clock
⎯ Serial data communication can be carried out with other chips that have a synchronous
commu n ic ati o n functio n
⎯ One serial data transfer format
Data length: 8 bits
⎯ Receive error detection: Overrun errors detected
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• Full-duplex co mmunicatio n capability
⎯ The transmitter and receiver are mutually independent, enabling transmission and reception
to be executed simultaneously
⎯ Double-buffering is used in both the transmitter and the receiver, enabling continuous
transmission and continuous reception of serial data
• Choice of LSB-first or MSB-first transfer
⎯ Can be selected regardless of the communication mode*1 (except in the case of
asynchronous mode 7-bit data)
• Built-in baud rate generator allows any bit rate to be selected
• Choice of serial clock source: internal clock from baud rate generator or external clock from
SCK pin
• Four interrupt sources
⎯ Four interrupt sources—transmit-data-empty, transmit-end, receive-data-full, and receive
error—that can issue requests independently
⎯ The transmit-data-empty and receive-data-full interrupts can activate the DMA controller
(DMAC)*2 or data transfer controller (DTC) to execute data transfer
• Module stop mode can be set
⎯ As the initial settin g, SCI op eration is halted. Register access is enabled by exiting module
stop mode
Notes: 1. Descrip tions in this section refer to LSB-first transfer.
2. The DMAC is not supported in the H8S/2321.
Section 14 Serial Communication Interface (SCI)
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14.1.2 Block Diagram
Figure 14.1 shows a block diagram of the SCI.
Bus interface
TDR
RSR
RDR
Module data bus
TSR
SCMR
SSR
SCR
Transmission/
reception control
BRR
Baud rate
generator
Internal
data bus
RxD
TxD
SCK
Parity generation
Parity check
Clock
External clock
φ
φ/4
φ/16
φ/64
TXI
TEI
RXI
ERI
SMR
Legend:
SCMR: Smart card mode register
RSR: Receive shift register
RDR: Receive data register
TSR: Transmit shift register
TDR: Transmit data register
SMR: Serial mode register
SCR: Serial control register
SSR: Serial status register
BRR: Bit rate register
Figure 14.1 Block Diagram of SCI
Section 14 Serial Communication Interface (SCI)
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14.1.3 Pin Configuration
Table 14.1 shows the serial pins for each SCI channel.
Table 14.1 SCI Pin s
Channel Pin Name Symbol I/O Function
0 Serial clock pin 0 SCK0 I/O SCI0 clock input/output
Receive data pin 0 RxD0 Input SCI0 receive data input
Transmit data pin 0 TxD0 Output SCI0 transmit data output
1 Serial clock pin 1 SCK1 I/O SCI1 clock input/output
Receive data pin 1 RxD1 Input SCI1 receive data input
Transmit data pin 1 TxD1 Output SCI1 transmit data output
2 Serial clock pin 2 SCK2 I/O SCI2 clock input/output
Receive data pin 2 RxD2 Input SCI2 receive data input
Transmit data pin 2 TxD2 Output SCI2 transmit data output
Section 14 Serial Communication Interface (SCI)
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14.1.4 Register Configuration
The SCI has the internal registers shown in table 14.2. These registers are used to specify
asynchronous mode or synchronous mode, the data format, and the bit rate, and to control the
transmitter/receiver.
Table 14.2 SCI Registers
Channel Name Abbreviation R/W Initial Value Address*1
0 Serial mode register 0 SMR0 R/W H'00 H'FF78
Bit rate register 0 BRR0 R/W H'FF H'FF79
Serial control regi ster 0 SCR 0 R/W H'00 H'FF7A
Transmit data register 0 TDR0 R/W H'FF H'FF7B
Serial status register 0 SSR0 R/(W)*2 H'84 H'FF7C
Receive data register 0 RDR0 R H'00 H'FF7D
Smart card mode register 0 SCMR0 R/ W H'F2 H'FF7E
1 Serial mode register 1 SMR1 R/W H'00 H'FF80
Bit rate register 1 BRR1 R/W H'FF H'FF81
Serial control regi ster 1 SCR 1 R/ W H'00 H'FF82
Transmit data register 1 TDR1 R/W H'FF H'FF83
Serial status register 1 SSR1 R/(W)*2 H'84 H'FF84
Receive data register 1 RDR1 R H'00 H'FF85
Smart card mode register 1 SCMR1 R/W H'F2 H'FF86
2 Serial mode register 2 SMR2 R/W H'00 H'FF88
Bit rate register 2 BRR2 R/W H'FF H'FF89
Serial control regi ster 2 SCR 2 R/W H'00 H'FF8A
Transmit data register 2 TDR2 R/W H'FF H'FF8B
Serial status register 2 SSR2 R/(W)*2 H'84 H'FF8C
Receive data register 2 RDR2 R H'00 H'FF8D
Smart card mode register 2 SCMR2 R/ W H'F2 H'FF8E
All Module stop control register MSTPCR R/W H'3FFF H'FF3C
Notes: 1. Lower 16 bits of the address.
2. Can only be written with 0 for flag clearing.
Section 14 Serial Communication Interface (SCI)
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14.2 Register Descriptions
14.2.1 Receive Shift Register (RSR)
Bit : 7 6 5 4 3 2 1 0
R/W : — — — — — — — —
RSR is a register used to receive serial data.
The SCI sets serial data input from the RxD pin in RSR in the order received, starting with the
LSB (bit 0), and converts it to parallel data. When one byte of data has been received, it is
transferred to RDR automatically.
RSR cannot be directly read or written to by the CPU.
14.2.2 Receive Data Register (RDR)
Bit : 7 6 5 4 3 2 1 0
Initial value : 0 0 0 0 0 0 0 0
R/W : R R R R R R R R
RDR is a register that stores received serial data.
When the SCI has received one byte of serial data, it transfers the received serial data from RSR to
RDR where it is stored, and completes the receive operation. After this, RSR is receive-enabled.
Since RSR and RDR function as a double buffer in this way, continuous receive operations can be
performed.
RDR is a read-only register, and cannot be written to by the CPU.
RDR is initialized to H'00 by a reset, and in standby mode or module stop mode.
Section 14 Serial Communication Interface (SCI)
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14.2.3 Transmit Shift Register (TSR)
Bit : 7 6 5 4 3 2 1 0
R/W : — — — — — — — —
TSR is a register used to transmit serial data.
To perform serial data transmission, the SCI first transfers transmit data from TDR to TSR, then
sends the data to the TxD pin startin g with the LSB (bit 0).
When transmission of one byte is completed, the next transmit data is transferred from TDR to
TSR, and transmission started, automatically. However, data transfer from TDR to TSR is not
performed if the TDRE bit in SSR is set to 1.
TSR cannot be directly read or written to by the CPU.
14.2.4 Transmit Data Register (TDR)
Bit : 7 6 5 4 3 2 1 0
Initial value : 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
TDR is an 8-bit register that stores d a ta for serial transmission.
When the SCI detects that TSR is empty, it transfers t he transmit data written in TDR to TSR and
starts serial transmission. Continuous serial transmission can be carried out by writing the next
transmit data to TDR during serial transmission of the data in TSR.
TDR can be read or written to by the CPU at all times.
TDR is initialized to H'FF by a reset, and in standby mode or module stop mode.
Section 14 Serial Communication Interface (SCI)
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14.2.5 Serial Mode Register (SMR)
Bit : 7 6 5 4 3 2 1 0
C/A CHR PE O/E STOP MP CKS1 CKS0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
SMR is an 8-bit register used to set the SCI’s serial transfer format and select the baud rate
generator clock so urce.
SMR can be read o r written to by the CPU at all times.
SMR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode
and module stop mode it retains its previous state.
Bit 7—Communication Mode (C/A): Selects asynchronous mode or synchronous mode as the
SCI operating mode.
Bit 7
C/A
Description
0 Asynchronous mode (Initial value)
1 Synchronous mode
Bit 6—Character Length (CHR): Selects 7 or 8 bits as the data length in asynchronous mode. In
synchronous mode, a fixed data length of 8 bits is used regardless of the CHR setting.
Bit 6
CHR
Description
0 8-bit data (Initial value)
1 7-bit data*
Note: * When 7-bit data is selected, the MSB (bit 7) of TDR is not transmitted, and it is not possible
to choose between LSB-first or MSB-first transfer.
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Bit 5—Parity Enable (PE): In asynchronous mode, selects whether or not parity bit addition is
performed in transmission, and parity bit checking in reception. In synchronous mode and with a
multiprocessor format, parity bit add ition and checking is not performed, regardless of the PE b it
setting.
Bit 5
PE
Description
0 Parity bit addition and checking disabled (Initial value)
1 Parity bit addition and checking enabled*
Note:* When the PE bit is set to 1, the parity (even or odd) specified by the O/E bit is adde d to
transmit data before transmission. In reception, the parity bit is checked for the parity (even
or odd) specified by the O/E bi t.
Bit 4—Pa rity Mo de (O/E): Selects either even or odd parity for use in parity addition and
checking.
The O/E bit setting is only valid when the PE bit is set to 1, enabling parit y bit addition and
checking, in asynchronous mode. The O/E bit settin g is i nvalid in synchronous mode, and when
parity addition and checking is disabled in asynchronous mod e.
Bit 4
O/E
Description
0 Even parity*1 (Initial value)
1 Odd parity*2
Notes: 1. When even parity is set, parity bit addition is performed in transmission so that the total
number of 1 bits in the transmit character plus the parity bit is even.
In reception, a check is performed to see if the total number of 1 bits in the receive
character plus the parity bit is even.
2. When odd parity is set, parity bit addition is performed in transmission so that the total
number of 1 bits in the transmit character plus the parity bit is odd.
In reception, a check is performed to see if the total number of 1 bits in the receive
character plus the parity bit is odd.
Bit 3—Stop Bit Length (STOP): Selects 1 or 2 bits as the stop bit length in asynchronous mode.
The ST OP b its setting is only valid in asynchronous mode. If synchronous mode is set the STOP
bit setting is invalid since stop bits are not added.
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Bit 3
STOP
Description
0 1 stop bit: In transmission, a single 1-bit (stop bit) is added to the end of a transmit
character before it is sent. (Initial value)
1 2 stop bits: In transmission, two 1-bits (stop bits) are added to the end of a transmit
character before it is sent.
In reception, only the first stop bit is checked, regardless of the STOP bit setting. If the second
stop bit is 1, it is treated as a stop bit; if it is 0, it is treated as the start bit of the next transmit
character.
Bit 2—Multiprocessor Mode (MP): Selects multiprocessor format. When multiprocessor format
is selected, the PE bit and O/E bit parity settings are invalid . The MP bit setting is only valid in
asynchronous mode; it is invalid in synchronous mode.
For details of the multiprocess or communication function, see section 14.3.3, Multiprocessor
Communication Function.
Bit 2
MP
Description
0 Multiprocessor function disabled (Initial value)
1 Multiproce ssor form at sele cte d
Bits 1 and 0—Clock Select 1 and 0 (CKS1, CKS0): These bits select the clock source for the
baud rate generator. The clock source can be selected from φ, φ/4, φ/16, and φ/64, according to the
setting of bits CKS1 and CKS0.
For the relation between the clock source, the bit rate register settin g, and the baud rate, see
section 14.2.8, Bit Rate Register (BRR).
Bit 1
CKS1 Bit 0
CKS0
Description
0 0 φ clock (Initial value)
1 φ/4 clock
1 0 φ/16 clock
1 φ/64 clock
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14.2.6 Serial Control Register (SCR)
Bit : 7 6 5 4 3 2 1 0
TIE RIE TE RE MPIE TEIE CKE1 CKE0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
SCR is a register that performs enabling or disabling of SCI transfer operations, serial clock output
in asynchronous mode, and interrupt requests, and selection of the serial clock source.
SCR can be read or written to by the CPU at all times.
SCR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode and
module stop mode it retains its previous state.
Bit 7—Transmit Interrupt Enable (TIE): Enables or disables transmit-data-empty interrupt
(TXI) request generation when serial transmit data is transfe rred from TDR to TSR and the TDRE
flag in SSR is set to 1.
Bit 7
TIE
Description
0 Transmit-data-empty interrupt (TXI) requests disabled* (Initial value)
1 Transmit-data-empty interrupt (TXI) requests enabled
Note:* TXI interrupt request cancellation can be performed by reading 1 from the TDRE flag, then
clearing it to 0, or by clearing the TIE bit to 0.
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Bit 6—Receive Interrupt Enable (RIE): Enables or disables receive-data-full interrupt (RXI)
request and receive-error interrupt (ERI) request generation when serial receive data is transferred
from RSR to RDR and the RDRF flag in SSR is set to 1.
Bit 6
RIE
Description
0 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request
disabled* (Initial value)
1 Receive-data-full interrupt (RXI) request and receive-error interrupt (ERI) request
enabled
Note:* RXI and ERI interrupt request cancellation can be performed by reading 1 from the RDRF
flag, or the FER, PER, or ORER flag, then clearing the flag to 0, or by clearing the RIE bit to
0.
Bit 5—Transmit Enable (TE): Enables or disables the start of serial transmission by the SCI.
Bit 5
TE
Description
0 Transmission disabled*1 (Initial value)
1 Transmission enabled*2
Notes: 1. The TDRE flag in SSR is fixed at 1.
2. In this state, serial transmission is started when transmit data is written to TDR and the
TDRE flag in SSR is cleared to 0.
SMR setting must be performed to decide the transfer format before setting the TE bit
to 1.
Bit 4—Receive Enable (RE): Enables or disables the start of serial reception by the SCI.
Bit 4
RE
Description
0 Reception disabled*1 (Initial value)
1 Reception enabled*2
Notes: 1. Clearing the RE bit to 0 does not affect the RDRF, FER, PER, and ORER flags, which
retain their states.
2. Serial reception is started in this state when a start bit is detected in asynchronous
mode or serial clock input is detected in synchronous mode.
SMR setting must be performed to decide the transfer format before setting the RE bit
to 1.
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Bit 3—Multiprocessor Interrupt Enable (MPIE): Enables or disables multiprocessor in terrupts.
The MPIE bit setting is only valid in asynchronous mode when the MP bit in SMR is set to 1.
The MPIE bit setting is invalid in synchronous mode o r when the MP bit is cleared to 0.
Bit 3
MPIE
Description
0 Multiprocessor interrupts disabled (normal reception performed) (Initial value)
[Clearing conditions]
• When the MPIE bit is cleared to 0
• When data with MPB = 1 is received
1 Multiprocessor interrupts enabled*
Receive-data-full interrupt (RXI) requests, receive-error interrupt (ERI) requests, and
setting of the RDRF, FER, and ORER flags in SSR are disabled until data with the
multiprocessor bit set to 1 is received.
Note: * When receive data including MPB = 0 is received, receive data transfer from RSR to RDR,
receive error detection, and setting of the RDRF, FER, and ORER flags in SSR, is not
performed. When receive data including MPB = 1 is received, the MPB bit in SSR is set to
1, the MPIE bit is cleared to 0 automatically, and generation of RXI and ERI interrupts
(when the TIE and RIE bits in SCR are set to 1) and FER and ORER flag setting is enabled.
Bit 2 — Transmit End Interrupt Enable (TEIE): Enables or d isab les transmit-end interrupt
(TEI) request generation when there is no valid transmit data in TDR in MSB d ata transmi ssion.
Bit 2
TEIE
Description
0 Transmit end interrupt (TEI) request disabled* (Initial value)
1 Transmit end interrupt (TEI) request enabled*
Note: * TEI cancellation can be performed by reading 1 from the TDRE flag in SSR, then clearing it
to 0 and clearing the TEND flag to 0, or by clearing the TEIE bit to 0.
Bits 1 and 0—Clock Enable 1 and 0 (CKE1, CKE0): These bits are used to select the SCI clock
source and enable or disable clock output from the SCK pin. The combination of the CKE1 and
CKE0 bits determines whether the SCK pin functions as an I/O port, the serial clock output pin, or
the serial clock input pin.
The setting of the CKE0 bit, however, is only valid for internal clock operation (CKE1 = 0) in
asynchronous mode. The CKE0 bit setting is invalid in synchronous mode, and in the case of
external clock operation (CKE1 = 1). Set CKE1 and CKE0 before determining the SCI operating
mode with SMR.
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For details of clock source selection, see table 14.9.
Bit 1
CKE1 Bit 0
CKE0
Description
0 0 Asynchronous mode Internal clock/SCK pin functions as I/O port*1
Synchronous mode Internal clock/SCK pin functions as serial clock
output
1 Asynchronous mode Internal clock/SCK pin functions as clock output*2
Synchronous mode Internal clock/SCK pin functions as serial clock
output
1 0 Asynchronous mode External clock/SCK pin functions as clock input*3
Synchronous mode External clock/SCK pin functions as serial clock
input
1 Asynchronous mode External clock/SCK pin functions as clock input*3
Synchronous mode External clock/SCK pin functions as serial clock
input
Notes: 1. Initial value
2. Outputs a clock of the same frequency as the bit rate.
3. Inputs a clock with a frequency 16 times the bit rate.
Section 14 Serial Communication Interface (SCI)
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14.2.7 Serial Status Register (SSR)
Bit : 7 6 5 4 3 2 1 0
TDRE RDRF ORER FER PER TEND MPB MPBT
Initial value : 1 0 0 0 0 1 0 0
R/W : R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R R R/W
Note: * Only 0 can be written, to clear the flag.
SSR is an 8-bit register containing status flags that indicate the operating status of the SCI, and
multiprocessor bits.
SSR can be read or written to by the CPU at all times. However, 1 cannot be written to flags
TDRE, RDRF, ORER, PER, and FER. Also note that in order to clear these flags they must be
read as 1 beforehand. The TEND flag and MPB flag are read-only flags and cannot be modified.
SSR is initialized to H'84 by a reset, and in standby mode or module stop mode.
Bit 7—Transmit Data Register Empty (TDRE): Indicates that data has been transferred from
TDR to TSR and the next seri al data can be written to T DR.
Bit 7
TDRE
Description
0 [Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the DMAC* or DTC is activated by a TXI interrupt and writes data to TDR
1 [Setting conditions] (Initial value)
• When the TE bit in SCR is 0
• When data is transferred from TDR to TSR and data can be written to TDR
Note: * The DMAC is not supported in the H8S/2321.
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Bit 6—Receive Data Register Full (RDRF): Indicates that the received data is stored in RDR.
Bit 6
RDRF
Description
0 [Clearing conditions] (Initial value)
• When 0 is written to RDRF after reading RDRF = 1
• When the DMAC* or DTC is activated by an RXI interrupt and reads data from
RDR
1 [Setting condition]
W hen serial reception ends normally and receive data is transferred from RSR to RDR
Notes: RDR and the RDRF flag are not affected and retain their previous values when an error is
detected during reception or when the RE bit in SCR is cleared to 0.
If reception of the next data is completed while the RDRF flag is still set to 1, an overrun
error will occur and the receive data will be lost.
* The DMAC is not supported in the H8S/2321.
Bit 5—Overrun Error (ORER): Indicates that an overrun error occurred during reception,
causing abnormal termination.
Bit 5
ORER
Description
0 [Clearing condition] (Initial value)*1
When 0 is written to ORER after reading ORER = 1
1 [Setting condition]
When the next serial reception is completed while RDRF = 1*2
Notes: 1. The ORER flag is not affected and retains its previous state when the RE bit in SCR is
cleared to 0.
2. The receive data prior to the overrun error is retained in RDR, and the data received
subsequently is lost. Also, subsequent serial reception cannot be continued while the
ORER flag is set to 1. In synchronous mode, serial transmission cannot be continued,
either.
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Bit 4—Framing Error (FER): Indicates that a framing error occurred during reception in
asynchronous mode, causing abnormal termination.
Bit 4
FER
Description
0 [Clearing condition] (Initial value)*1
When 0 is written to FER after reading FER = 1
1 [Setting condition]
When the SCI checks the stop bit at the end of the receive data when reception ends,
and the stop bit is 0 *2
Notes: 1. The FER flag is not affected and retains its previous state when the RE bit in SCR is
cleared to 0.
2. In 2-stop-bit mode, only the first stop bit is checked for a value of 0; the second stop bit
is not checked. If a framing error occurs, the receive data is transferred to RDR but the
RDRF flag is not set. Also, subsequent serial reception cannot be continued while the
FER flag is set to 1. In synchronous mode, seri al tr ans mi ss io n cannot be continued,
either.
Bit 3—Parity Error (PER): Indicates that a parity error occurred during reception using parity
addition in asynchronous mode, causi ng abnormal termination.
Bit 3
PER
Description
0 [Clearing condition] (Initial value)*1
When 0 is written to PER after reading PER = 1
1 [Setting condition]
When, in reception, the number of 1 bits in the receive data plus the parity bit does not
match the parity setting (even or odd) specified by the O/E bit in SMR*2
Notes: 1. The PER flag is not affected and retains its previous state when the RE bit in SCR is
cleared to 0.
2. If a parity error occurs, the receive data is transferred to RDR but the RDRF flag is not
set. Also, subsequent serial reception cannot be continued while the PER flag is set to
1. In synchronou s mode , seria l transmi ss ion can not be cont in ued, either.
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Bit 2 — Tr ansmit End (TEND): Indicates that there is no v alid data in TDR when the last bit of
the transmit character is sent, and transmission has been ended.
The TEND flag is read-only and cannot be modified.
Bit 2
TEND
Description
0 [Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the DMAC* or DTC is activated by a TXI interrupt and writes data to TDR
1 [Setting conditions] (Initial value)
• When the TE bit in SCR is 0
• When TDRE = 1 at transmission of the last bit of a 1-byte serial transmit character
Note: * The DMAC is not supported in the H8S/2321.
Bit 1—Multiprocessor Bit (MPB): When reception is performed using multiprocessor format in
asynchronous mode, MPB stores the multiprocessor bit in the receive data.
MPB is a read-only bit, and cannot be modified.
Bit 1
MPB
Description
0 [Clearing condition] (Initial value)*
When data with a 0 multiproce ssor bit is rece iv ed
1 [Setting condition]
When data with a 1 multiproce ssor bit is rece iv ed
Note: * Retains its previous state when the RE bit in SCR is cleared to 0 with multiprocessor
format.
Bit 0—Multiprocessor Bit Transfer (MPBT): When transmission is performed using
multiprocessor for mat in asynchronou s mode, MPBT stor es the multiprocessor bit to be added to
the transmit data.
The MPBT bit setting is invalid when multipro cessor format is not used, when not transmitting,
and in synchronous mode.
Bit 0
MPBT
Description
0 Data with a 0 multiprocessor bit is transmitted (Initial value)
1 Data with a 1 multiprocessor bit is transmitted
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14.2.8 Bit Rate Register (BRR)
Bit : 7 6 5 4 3 2 1 0
Initial value : 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
BRR is an 8-bit register that sets the serial transfer bit rate in accordance with the baud rate
generator operating clock selected by bits CKS1 and CKS0 in SMR.
BRR can be read or written to by the CPU at all times.
BRR is initialized to H'FF by a reset and in hardware standby mode. In software standby mode
and module stop mode it retains its previous state.
As baud rate generator control is performed independently for each channel, different values can
be set for each channel.
Table 14.3 shows sample BRR settings in asynchronous mode, and table 14.4 shows sample BRR
setti ng s in sync hr ono us mo d e.
Table 14.3 BRR Settings for Various Bit Rates (Asynchronous Mode)
φ = 2 MHz φ = 2.097152 MHz φ = 2.4576 MHz φ = 3 MHz
Bit Rate
(bits/s)
n
N Error
(%)
n
N Error
(%)
n
N Error
(%)
n
N Error
(%)
110 1 141 0.03 1 148 –0.04 1 174 –0.26 1 212 0.03
150 1 103 0.16 1 108 0.21 1 127 0.00 1 155 0.16
300 0 207 0.16 0 217 0.21 0 255 0.00 1 77 0.16
600 0 103 0.16 0 108 0.21 0 127 0.00 0 155 0.16
1200 0 51 0.16 0 54 –0.70 0 63 0.00 0 77 0.16
2400 0 25 0.16 0 26 1.14 0 31 0.00 0 38 0.16
4800 0 12 0.16 0 13 –2.48 0 15 0.00 0 19 –2.34
9600 0 6 — 0 6 –2.48 0 7 0.00 0 9 –2.34
19200 0 2 — 0 2 — 0 3 0.00 0 4 –2.34
31250 0 1 0.00 0 1 — 0 1 — 0 2 0.00
38400 0 1 — 0 1 — 0 1 0.00 — — —
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φ = 3.6864 MHz φ = 4 MHz φ = 4.9152 MHz φ = 5 MHz
Bit Rate
(bits/s)
n
N Error
(%)
n
N Error
(%)
n
N Error
(%)
n
N Error
(%)
110 2 64 0.70 2 70 0.03 2 86 0.31 2 88 –0.25
150 1 191 0.00 1 207 0.16 1 255 0.00 2 64 0.16
300 1 95 0.00 1 103 0.16 1 127 0.00 1 129 0.16
600 0 191 0.00 0 207 0.16 0 255 0.00 1 64 0.16
1200 0 95 0.00 0 103 0.16 0 127 0.00 0 129 0.16
2400 0 47 0.00 0 51 0.16 0 63 0.00 0 64 0.16
4800 0 23 0.00 0 25 0.16 0 31 0.00 0 32 –1.36
9600 0 11 0.00 0 12 0.16 0 15 0.00 0 15 1.73
19200 0 5 0.00 0 6 — 0 7 0.00 0 7 1.73
31250 — — — 0 3 0.00 0 4 –1.70 0 4 0.00
38400 0 2 0.00 0 2 — 0 3 0.00 0 3 1.73
φ = 6 MHz φ = 6.144 MHz φ = 7.3728 MHz φ = 8 MHz
Bit Rate
(bits/s)
n
N Error
(%)
n
N Error
(%)
n
N Error
(%)
n
N Error
(%)
110 2 106 –0.44 2 108 0.08 2 130 –0.07 2 141 0.03
150 2 77 0.16 2 79 0.00 2 95 0.00 2 103 0.16
300 1 155 0.16 1 159 0.00 1 191 0.00 1 207 0.16
600 1 77 0.16 1 79 0.00 1 95 0.00 1 103 0.16
1200 0 155 0.16 0 159 0.00 0 191 0.00 0 207 0.16
2400 0 77 0.16 0 79 0.00 0 95 0.00 0 103 0.16
4800 0 38 0.16 0 39 0.00 0 47 0.00 0 51 0.16
9600 0 19 –2.34 0 19 0.00 0 23 0.00 0 25 0.16
19200 0 9 –2.34 0 9 0.00 0 11 0.00 0 12 0.16
31250 0 5 0.00 0 5 2.40 — — — 0 7 0.00
38400 0 4 –2.34 0 4 0.00 0 5 0.00 — — —
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φ = 9.8304 MHz φ = 10 MHz φ = 12 MHz φ = 12.288 MHz
Bit Rate
(bits/s)
n
N Error
(%)
n
N Error
(%)
n
N Error
(%)
n
N Error
(%)
110 2 174 –0.26 2 177 –0.25 2 212 0.03 2 217 0.08
150 2 127 0.00 2 129 0.16 2 155 0.16 2 159 0.00
300 1 255 0.00 2 64 0.16 2 77 0.16 2 79 0.00
600 1 127 0.00 1 129 0.16 1 155 0.16 1 159 0.00
1200 0 255 0.00 1 64 0.16 1 77 0.16 1 79 0.00
2400 0 127 0.00 0 129 0.16 0 155 0.16 0 159 0.00
4800 0 63 0.00 0 64 0.16 0 77 0.16 0 79 0.00
9600 0 31 0.00 0 32 –1.36 0 38 0.16 0 39 0.00
19200 0 15 0.00 0 15 1.73 0 19 –2.34 0 19 0.00
31250 0 9 –1.70 0 9 0.00 0 11 0.00 0 11 2.40
38400 0 7 0.00 0 7 1.73 0 9 –2.34 0 9 0.00
φ = 14 MHz φ = 14.7456 MHz φ = 16 MHz φ = 17.2032 MHz
Bit Rate
(bits/s)
n
N Error
(%)
n
N Error
(%)
n
N Error
(%)
n
N Error
(%)
110 2 248 –0.17 3 64 0.70 3 70 0.03 3 75 0.48
150 2 181 0.16 2 191 0.00 2 207 0.16 2 223 0.00
300 2 90 0.16 2 95 0.00 2 103 0.16 2 111 0.00
600 1 181 0.16 1 191 0.00 1 207 0.16 1 223 0.00
1200 1 90 0.16 1 95 0.00 1 103 0.16 1 111 0.00
2400 0 181 0.16 0 191 0.00 0 207 0.16 0 223 0.00
4800 0 90 0.16 0 95 0.00 0 103 0.16 0 111 0.00
9600 0 45 –0.93 0 47 0.00 0 51 0.16 0 55 0.00
19200 0 22 –0.93 0 23 0.00 0 25 0.16 0 27 0.00
31250 0 13 0.00 0 14 –1.70 0 15 0.00 0 16 1.20
38400 0 10 — 0 11 0.00 0 12 0.16 0 13 0.00
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φ = 18 MHz φ = 19.6608 MHz φ = 20 MHz φ = 25 MHz
Bit Rate
(bits/s)
n
N Error
(%)
n
N Error
(%)
n
N Error
(%)
n
N Error
(%)
110 3 79 –0.12 3 86 0.31 3 88 –0.25 3 110 –0.02
150 2 233 0.16 2 255 0.00 3 64 0.16 3 80 0.47
300 2 116 0.16 2 127 0.00 2 129 0.16 2 162 –0.15
600 1 233 0.16 1 255 0.00 2 64 0.16 2 80 0.47
1200 1 116 0.16 1 127 0.00 1 129 0.16 1 162 –0.15
2400 0 233 0.16 0 255 0.00 1 64 0.16 1 80 0.47
4800 0 116 0.16 0 127 0.00 0 129 0.16 0 162 –0.15
9600 0 58 –0.69 0 63 0.00 0 64 0.16 0 80 0.47
19200 0 28 1.02 0 31 0.00 0 32 –1.36 0 40 –0.76
31250 0 17 0.00 0 19 –1.70 0 19 0.00 0 24 1.00
38400 0 14 –2.34 0 15 0.00 0 15 1.73 0 19 1.73
Section 14 Serial Communication Interface (SCI)
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Table 14.4 BRR Settings for Va rious Bit Rates (Synchronous Mode)
Bit Rate φ = 2 MHz φ = 4 MHz φ = 8 MHz φ = 10 MHz φ = 16 MHz φ = 20 MHz φ = 25 MHz
(bits/s) n N n N n N n N n N n N n N
110 3 70
250 2 124 2 249 3 124 — — 3 249
500 1 249 2 124 2 249 — — 3 124 — —
1 k 1 124 1 249 2 124 — — 2 249 — — 3 97
2.5 k 0 199 1 99 1 199 1 249 2 99 2 124 2 155
5 k 0 99 0 199 1 99 1 124 1 199 1 249 2 77
10 k 0 49 0 99 0 199 0 249 1 99 1 124 1 155
25 k 0 19 0 39 0 79 0 99 0 159 0 199 0 249
50 k 0 9 0 19 0 39 0 49 0 79 0 99 0 124
100 k 0 4 0 9 0 19 0 24 0 39 0 49 0 62
250 k 0 1 0 3 0 7 0 9 0 15 0 19 0 24
500 k 0 0* 0 1 0 3 0 4 0 7 0 9 — —
1 M 0 0* 0 1 0 3 0 4 — —
2.5 M 0 0* 0 1 — —
5 M 0 0* — —
Note: As far as possib le, the sett ing shou ld be made so that the error is no more than 1%.
Blank: Cannot be set.
—: Can be set, but there will be a degree of error.
*: Continuous transfer is not possible.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 620 of 1268
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The BRR setting is found from the followi ng formula s .
Asynchronous mode:
N = φ
64 × 22n–1 × B
× 106 – 1
Synchr o no us mo d e:
N = φ
8 × 22n–1 × B
× 106 – 1
Where B: Bit rate (bits/s)
N: BRR setting for baud rate generator (0 ≤ N ≤ 255 )
φ: Operating frequency (MHz)
n: Baud rate generator input clock (n = 0 to 3)
(See the table below for the relation between n and the clock.)
SMR Setting
n Clock CKS1 CKS0
0 φ 0 0
1 φ/4 0 1
2 φ/16 1 0
3 φ/64 1 1
The bit rate error in asynchronous mode is found from the following formula:
Error (%) = { φ × 106
(N + 1) × B × 64 × 22n–1
– 1} × 100
Section 14 Serial Communication Interface (SCI)
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Table 14.5 shows the maximum bit rate for each frequency in asynchronous mode. Tables 14.6
and 14.7 show the maximum bit rates with external clock input.
Table 14.5 Maximum Bit Rate for Each Frequency (Asynchronous Mode)
φ (MHz) Maximum Bit Rate (bits/s) n N
2 62500 0 0
2.097152 65536 0 0
2.4576 76800 0 0
3 93750 0 0
3.6864 115200 0 0
4 125000 0 0
4.9152 153600 0 0
5 156250 0 0
6 187500 0 0
6.144 192000 0 0
7.3728 230400 0 0
8 250000 0 0
9.8304 307200 0 0
10 312500 0 0
12 375000 0 0
12.288 384000 0 0
14 437500 0 0
14.7456 460800 0 0
16 500000 0 0
17.2032 537600 0 0
18 562500 0 0
19.6608 614400 0 0
20 625000 0 0
25 781250 0 0
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 622 of 1268
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Table 14.6 Maximum Bit Rate with External Clock Input (Asynchronous Mode)
φ (MHz) External Input Clock (MHz) Maximum Bit Rate (bits/s)
2 0.5000 31250
2.097152 0.5243 32768
2.4576 0.6144 38400
3 0.7500 46875
3.6864 0.9216 57600
4 1.0000 62500
4.9152 1.2288 76800
5 1.2500 78125
6 1.5000 93750
6.144 1.5360 96000
7.3728 1.8432 115200
8 2.0000 125000
9.8304 2.4576 153600
10 2.5000 156250
12 3.0000 187500
12.288 3.0720 192000
14 3.5000 218750
14.7456 3.6864 230400
16 4.0000 250000
17.2032 4.3008 268800
18 4.5000 281250
19.6608 4.9152 307200
20 5.0000 312500
25 6.2500 390625
Section 14 Serial Communication Interface (SCI)
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Table 14.7 Maximum Bit Rate with External Clock Input (Synchronous Mode)
φ (MHz) External Input Clock (MHz) Maximum Bit Rate (bits/s)
2 0.3333 333333.3
4 0.6667 666666.7
6 1.0000 1000000.0
8 1.3333 1333333.3
10 1.6667 1666666.7
12 2.0000 2000000.0
14 2.3333 2333333.3
16 2.6667 2666666.7
18 3.0000 3000000.0
20 3.3333 3333333.3
25 4.1667 4166666.7
14.2.9 Smart Card Mode Register (SCMR)
Bit : 7 6 5 4 3 2 1 0
— — — — SDIR SINV — SMIF
Initial value : 1 1 1 1 0 0 1 0
R/W : — — — — R/W R/W — R/W
SCMR selects LSB-first or MSB-first transfer by means of bit SDIR. Except in the case of
asynchronous mode 7-bit data, LSB-first or MSB-first transfer can be selected regardless of the
serial communication mode. The descriptions in this chapter refer to LSB-first transfer.
For details of the other bits in SCMR, see section 15.2.1, Smart Card Mode Register (SCMR).
SCMR is initialized to H'F2 by a reset and in hardware standby mode. In software standby mode
and module stop mode it retains its previous state.
Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 1.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 624 of 1268
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Bit 3—Smart Card Data Transfer Direction (SDIR): Selects the serial/parallel conversion
format.
This bit is valid when 8-bit dat a is used as the transmit/receive for mat.
Bit 3
SDIR
Description
0 TDR contents are transmitted LSB-first (Initial value)
Receive data is stored in RDR LSB-first
1 TDR contents are transmitted MSB-first
Receive data is stored in RDR MSB-first
Bit 2—Smart Card Data Invert (SINV): Specifies inversion of the data logic level. The SINV
bit does not affect the logic level of the parity bit(s): parity bit inversion requires inversion of the
O/E bit in SMR.
Bit 2
SINV
Description
0 TDR contents are transmitted without modification (Initial value)
Receive data is stored in RDR without modification
1 TDR contents are inverted before being transmitted
Receive data is stored in RDR in inverted form
Bit 1—Reserved: This bit cannot be modified and is always read as 1.
Bit 0—Smart Card Interface Mode Select (SMIF): When the smart card interface operates as a
normal SCI, 0 should be written to this bit.
Bit 0
SMIF
Description
0 Operates as normal SCI (smart card interface function disabled) (Initial value)
1 Smart card interface funct ion e nable d
Section 14 Serial Communication Interface (SCI)
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14.2.10 Module Stop Control Register (MSTPCR)
MSTPCRH MSTPCRL
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
When the corresponding bit of bits MSTP7 to MSTP5 is set to 1, SCI operation stops at the end of
the bus cycle and a transition is made to module stop mode. Registers cannot be read or written to
in module stop mode. For details, see section 21.5, Module Stop Mode.
MSTP CR is initialized to H'3FFF by a reset a nd in hardware stand by mode. It is not initialized in
software standby mode.
Bit 7—Module Stop (MSTP7): Specifies the SCI channel 2 module stop mode.
Bit 7
MSTP7
Description
0 SCI channel 2 module stop mode cleared
1 SCI channel 2 module stop mode set (Initial value)
Bit 6—Module Stop (MSTP6): Specifies the SCI channel 1 module stop mode.
Bit 6
MSTP6
Description
0 SCI channel 1 module stop mode cleared
1 SCI channel 1 module stop mode set (Initial value)
Bit 5—Module Stop (MSTP5): Specifies the SCI channel 0 module stop mode.
Bit 5
MSTP5
Description
0 SCI channel 0 module stop mode cleared
1 SCI channel 0 module stop mode set (Initial value)
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 626 of 1268
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14.3 Operation
14.3.1 Overview
The SCI can carry out serial communication in two modes: asynchronous mode in which
synchronization is achieved character by character, and synchronous mode in which
synchro ni zation is achieved with c lock pulses.
Selection of asynchronous or synchronous mode and the transmission format is made using SMR
as shown in table 14.8. The SCI clock is determined by a combination of the C/A bit in SMR and
the CKE1 and CKE0 bits in SCR, as shown in table 14.9.
Asynchronous Mode
• Data length: Choice of 7 or 8 bits
• Choice of parity addition, multiprocessor b it addition, and addition of 1 or 2 stop bits (the
combination of these parameters determines the transfer format and character length)
• Detection of framing, parity, and overrun errors, and breaks, during reception
• Choice of internal or external clock as SCI clock source
⎯ When internal clock is selected:
The SCI operates on the baud rate generator clock and a clock with the same frequency as
the bit rate can be output
⎯ When external clock is selected:
A clock with a frequency of 16 ti mes the bit rate must be input (the built-in baud rate
gener ator is not used)
Synchronous Mode
• Transfer format: Fixed 8-bit data
• Detection of overrun errors during reception
• Choice of internal or external clock as SCI clock source
⎯ When internal clock is selected:
The SCI operates on the baud rate generator clock and a serial clock is output off-chip
⎯ When external clock is selected:
The built-in baud rate generator is not used, and the SCI operates on the input serial clock
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 627 of 1268
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Table 14.8 SMR Settings a nd Serial Transfer Fo rmat Selection
SMR Settings SCI Transfer Format
Bit 7 Bit 6 Bit 2 Bit 5 Bit 3
C/A CHR MP PE STOP Mode Data
Length
Multi-
processor
Bit Parity
Bit Stop Bit
Length
0 0 0 0 0 8-bit data No No 1 bit
1
Asynchronous
mode 2 bits
1 0 Yes 1 bit
1 2 bits
1 0 0 7-bit data No 1 bit
1 2 bits
1 0 Yes 1 bit
1 2 bits
0 1 — 0 8-bit data Yes No 1 bit
1
—
—
—
1
0
1
Asynchronous
mode (multi-
processor
format)
7-bit data
2 bits
1 bit
2 bits
1 — — — — Synchronous mode 8-bit data No None
Table 14.9 SMR and SCR Settings and SCI Clock Source Selection
SMR SCR Setting SCI Transmit/Receive Clock
Bit 7 Bit 1 Bit 0
C/A CKE1 CKE0 Mode Clock
Source SCK Pin Function
0 0 0 Internal SCI does not use SCK pin
1
Asynchronous
mode Outputs clock with same frequency as bit
rate
1 0 External
1 Inputs clock with frequency of 16 times
the bit rate
1 0 0 Internal Outputs serial cl oc k
1 1
0
1
Synchronous
mode
External
Inputs serial clock
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 628 of 1268
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14.3.2 Operation in Asynchronous Mode
In asynchronous mode, characters are sent or received, each preceded by a start bit indicating the
start of communication and one or two stop bits indicating the end of communication. Serial
communication is thus carried out with synchronization established on a character-by-character
basis.
Inside the SCI, the transmitter and receiver are independent units, enablin g full-duplex
communication. Both the transmitter and the receiver also have a double-buffered structure, so
that data can be read or written during transmission or reception, enabling continuous da ta
transfer.
Figure 14.2 shows the general format for asynchronous serial communication.
In asynchronous serial communication, the communication line is usually held in the mark state
(high level). The SCI monitors the communication line, and when it goes to the space state (low
level), recognizes a start bit and starts serial communication.
One serial communication character co nsists of a start bit (low level), followed by data (in LSB-
first order), a parity bit (high or low level), and finally one or two stop bits (high level).
In asynchronous mode, the SCI performs synchronization at the falling edge of the start bit in
reception. The SCI samples the data on the 8th pulse of a clock with a frequency of 16 times the
length of one bit, so that the transfer data is latched at the center of each bit.
LSB
Start
bit
MSB
Idle state
(mark state)
Stop bit(s)
0
Transmit/receive data
D0 D1 D2 D3 D4 D5 D6 D7 0/1 1 1
1 1
Serial
data Parity
bit
1 bit 1 or
2 bits
7 or 8 bits 1 bit,
or none
One unit of transfer data (character or frame)
Figure 14.2 Data Format in Asynchronous Communication
(Example with 8-Bit Data, Parity, Two Stop Bits)
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 629 of 1268
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Data Transfer Format
Table 14.10 shows the data transfer formats that can be used in asynchronous mode. Any of 12
transfer formats can be selected according to the SMR setting.
Table 14.10 Serial Transfer Formats (Asynchronous Mode)
PE
0
0
1
1
0
0
1
1
⎯
⎯
⎯
⎯
S8-bit data
STOP
S7-bit data
STOP
S8-bit data
STOP STOP
S8-bit data P
STOP
S7-bit data
STOP
P
S8-bit data
MPB STOP
S8-bit data
MPB STOP STOP
S7-bit data
STOPMPB
S7-bit data
STOPMPB STOP
S7-bit data
STOPSTOP
CHR
0
0
0
0
1
1
1
1
0
0
1
1
MP
0
0
0
0
0
0
0
0
1
1
1
1
STOP
0
1
0
1
0
1
0
1
0
1
0
1
SMR Settings
123456789101112
Serial Transfer Format and Frame Length
STOP
S8-bit data P
STOP
S7-bit data
STOP
P
STOP
Legend:
S: Start bit
STOP: Stop bit
P: Parity bit
MPB: Multiprocessor bit
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 630 of 1268
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Clock
Either an internal clock generated by the built-in baud rate generator or an external clock input at
the SCK pin can be selected as the SCI’s serial clock, according to the setting of the C/A bit in
SMR and the CKE1 a nd CKE0 bits in SCR. For details of SCI clock source selection, see tab le
14.9.
When an external clock is input at the SCK pin, the clock frequency should be 16 times the bit rate
used.
When the SCI is operated on an internal clock, the clock can be output from the SCK pin. The
frequency of the clock output in this case is equal to the bit rate, and the phase is such that the
rising edge of the clock is at the center of each transmit data bit, as shown in figure 14.3.
0
1 frame
D0 D1 D2 D3 D4 D5 D6 D7 0/1 1 1
Figure 14.3 Relation between Output Clock and Transfer Data Phase
(Asynchrono us Mode)
Data Transfer Operations
SCI initialization (a synchronous mode): Before transmitting or receiving data, first clear the TE
and RE bits in SCR to 0, then initialize the SCI as described below.
When the operating mode, transfer format, etc., is changed, the TE and RE bits must be cleared to
0 before making the change using the following procedure. When the TE bit is cleared to 0, the
TDRE flag is set to 1 and TSR is initialized. Note that clearing the RE bit to 0 does not change the
contents of the RDRF, PER, FER, and ORER flags, or the contents of RDR.
When an external clock is used the clock should not be stopped during operation, including
initialization, since operation will b e unreliable in this case.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 631 of 1268
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Figure 14.4 shows a sample SCI initialization flo wc hart.
Wait
<Initialization completed>
Start of initialization
Set data transfer format in
SMR and SCMR
[1]
Set CKE1 and CKE0 bits in SCR
(TE, RE bits 0)
No
Yes
Set value in BRR
Clear TE and RE bits in SCR to 0
[2]
[3]
Set TE or RE bit in
SCR to 1, and set RIE, TIE, TEIE,
and MPIE bits as necessary [4]
1-bit interval elapsed?
[1] Set the clock selection in SCR.
Be sure to clear bits RIE, TIE,
TEIE, and MPIE, and bits TE and
RE, to 0.
When the clock is selected in
asynchronous mode, it is output
immediately after SCR settings are
made.
[2] Set the data transfer format in SMR
and SCMR.
[3] Write a value corresponding to the
bit rate to BRR. (Not necessary if
an external clock is used.)
[4] Wait at least one bit interval, then
set the TE bit or RE bit in SCR to 1.
Also set the RIE, TIE, TEIE, and
MPIE bits as necessary.
Setting the TE or RE bit enables
the TxD or RxD pin to be used.
Figure 14.4 Sample SCI Initialization Flowchart
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 632 of 1268
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Serial data transmission (asynchronous mode): Figure 14.5 shows a sample flowchart for serial
transmission.
The following procedure should be used for serial data transmission.
No
<End>
[1]
Yes
Initialization
Note: * The DMAC is not supported in the H8S/2321.
Start of transmission
Read TDRE flag in SSR [2]
Write transmit data to TDR
and clear TDRE flag in SSR to 0
No
Yes
No
Yes
Read TEND flag in SSR
[3]
No
Yes
[4]
Clear DR to 0 and
set DDR to 1
Clear TE bit in SCR to 0
TDRE = 1?
All data transmitted?
TEND = 1?
Break output?
[1] SCI initialization:
The TxD pin is automatically
designated as the transmit data
output pin.
After the TE bit is set to 1, a frame
of 1s is output, and transmission is
enabled.
[2] SCI status check and transmit data
write:
Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR and clear the
TDRE flag to 0.
[3] Serial transmission continuation
procedure:
To continue serial transmission,
read 1 from the TDRE flag to
confirm that writing is possible,
then write data to TDR, and then
clear the TDRE flag to 0. Checking
and clearing of the TDRE flag is
automatic when the DMAC* or DTC
is activated by a transmit-data-
empty interrupt (TXI) request, and
data is written to TDR.
[4] Break output at the end of serial
transmission:
To output a break in serial
transmission, set DDR for the port
corresponding to the TxD pin to 1,
clear DR to 0, then clear the TE bit
in SCR to 0.
Figure 14.5 Sample Serial Transmission Flowchart
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 633 of 1268
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In serial transmission, the SCI operates as described below.
[1] The SCI monitors the TDRE flag in SSR, and if is 0, reco gnizes that data has been written to
TDR, and transfers the data from TDR to TSR.
[2] After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts
transmission.
If the TIE bit is set to 1 at this time, a transmit-data-empty interrupt (TXI) is generated.
The serial transmit data is sent from the TxD pin in the following order.
[a] Start bit:
One 0-bit is output.
[b] Transmit data:
8-bit or 7-bit data is output in LSB -first order.
[c] Parity bit or multiprocessor bit:
One parity bit (even or odd parity), or one multiprocessor bit is output.
A format in which neither a parity bit nor a multiprocessor bit is output ca n also b e
selected.
[d] Stop bit(s):
One or two 1-bits (stop bits) are output.
[e] Mark state:
1 is output continuou sly until the start bit that starts t he next transmission is se nt.
[3] T he SCI checks the TDRE flag at the timing for sending the stop bit.
If the TDRE flag is cleared to 0, the data is transferred from TDR to TSR, the stop bit is sent,
and then serial transmission of the next frame is started.
If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then t he
mark state is entered in which 1 is output continuously. If the TEIE bit in SCR is set to 1 at this
time, a TEI interrupt request is generated.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 634 of 1268
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Figure 14.6 shows an example of the operation for transmission in asynchronous mode.
TDRE
TEND
0
1 frame
D0 D1 D7 0/1 1 0 D0 D1 D7 0/1 1
1 1
DataStart
bit Parity
bit Stop
bit Start
bit Data Parity
bit Stop
bit
TXI interrupt
request generated Data written to TDR and
TDRE flag cleared to 0 in
TXI interrupt handling routine TEI interrupt
request generated
Idle state
(mark state)
TXI interrupt
request generated
Figure 14.6 Example of Transmit Operation in Asynchronous Mode
(Example with 8-Bit Data, Parity, One Stop Bit)
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 635 of 1268
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Serial data reception (asynchronous mode): Figure 14.7 shows a sample flowchart for serial
reception.
The following procedure should be used for serial data reception.
Yes
<End>
[1]
No
Initialization
Start of reception
[2]
No
Yes
Read RDRF flag in SSR [4]
[5]
Clear RE bit in SCR to 0
Read ORER, PER, and
FER flags in SSR
Error handling
(Continued on next page)
[3]
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
Yes
PER ∨ FER ∨ ORER = 1?
RDRF = 1?
All data received?
SCI initialization:
The RxD pin is automatically
designated as the receive data
input pin.
Receive error handling and
break detection:
If a receive error occurs, read the
ORER, PER, and FER flags in
SSR to identify the error. After
performing the appropriate error
processing, ensure that the
ORER, PER, and FER flags are
all cleared to 0. Reception cannot
be resumed if any of these flags
are set to 1. In the case of a
framing error, a break can be
detected by reading the value of
the input port corresponding to
the RxD pin.
SCI status check and receive
data read :
Read SSR and check that RDRF
= 1, then read the receive data in
RDR and clear the RDRF flag to
0. Transition of the RDRF flag
from 0 to 1 can also be identified
by an RXI interrupt.
Serial reception continuation
procedure:
To continue serial reception,
before the stop bit for the current
frame is received, read the
RDRF flag, read RDR, and clear
the RDRF flag to 0. The RDRF
flag is cleared automatically
when the DMAC* or DTC is
activated by an RXI interrupt and
the RDR value is read.
[1]
[2] [3]
[4]
[5]
Note: * The DMAC is not supported in the H8S/2321.
Figure 14.7 Sample Serial Reception Flowchart
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 636 of 1268
REJ09B0220-0600
<End>
[3]
Error handling
Parity error handling
No
Yes
Clear ORER, PER, and
FER flags in SSR to 0
No
Yes
No
Yes
Framing error handling
No
Yes
Overrun error handling
ORER = 1?
FER = 1?
Break?
PER = 1?
Clear RE bit in SCR to 0
Figure 14.7 Sample Serial Reception Flowchart (cont)
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 637 of 1268
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In serial reception, the SCI operates as described below.
[1] The SCI monitors the communication line, and if a 0 stop bit is detected, performs internal
synchronization and starts reception.
[2] T he received data is stored in RSR in LSB-to-MSB order.
[3] T he parity bit and stop bit are received.
After receiving these bits, the SCI carries out the following checks.
[a] Parity check:
The SCI checks whether the number of 1 bits in the receive data agrees with the parity
(even or odd) set in the O/E bit in SMR.
[b] Stop bit check:
The SCI checks whether the stop bit is 1.
If there are two stop bits, only the first is checked.
[c] Status check:
The SCI checks whether the RDRF flag is 0, indicating that the receive data can be
transfe rred fro m RSR to RDR.
If all the above checks are passed, the RDRF flag is set to 1, and the receive data is stored in
RDR.
If a receive error* is detected in the error check, the operation is as shown in table 14.11.
Note: * Subsequent receive operations cannot be performed when a receive error has occurred.
Also note that the RDRF flag is not set to 1 in reception, and so the error flags must be
cleared to 0.
[4] If the RIE bit in SCR is set to 1 when the RDRF flag changes to 1, a receive-data-full interrupt
(RXI) request is generated.
Also, if the RIE bit in SCR is set to 1 when the ORER, P E R, or FER flag changes to 1, a
receive-error interrupt (ERI) request is generated.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 638 of 1268
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Table 14.11 Receive Error Conditions
Receive Error Abbreviation Condition Data Transfer
Overrun error ORER When the next data reception is
comple ted whil e the RDRF flag
in SSR is set to 1
Receive data is not
transferred from RSR to
RDR
Framing error FER When the stop bit is 0 Receive data is transferre d
from RSR to RDR
Parity error PER When the received data differs
from the parity (even or odd) set
in SMR
Receive data is tran sferre d
from RSR to RDR
Figure 14.8 shows an example of the operation for reception in asynchronous mode.
RDRF
FER
0
1 frame
D0 D1 D7 0/1 1 0 D0 D1 D7 0/1 0
1 1
DataStart
bit Parity
bit Stop
bit Start
bit Data Parity
bit Stop
bit
RXI interrupt
request
generated ERI interrupt request
generated by framing
error
Idle state
(mark state)
RDR data read and RDRF
flag cleared to 0 in RXI
interrupt handling routine
Figure 14.8 Example of SCI Receive Operation
(Example with 8-Bit Data, Parity, One Stop Bit)
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 639 of 1268
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14.3.3 Multiprocessor Communication Function
The multiprocessor communication function performs serial communication using the
multiprocessor format, in which a multiprocessor bit is added to the transfer data, in asynchronous
mode. Use of this function enables data transfer to be performed among a number of processors
sharing a single serial communication line.
When multiprocessor communication is carried out, each receiving station is addressed by a
unique ID cod e.
The serial communication cycle consists of two component cycles: an ID transmission cycle
which specifies the receiving station, and a data transmission cycle. The multiprocessor bit is used
to differentiate between the ID transmission cycle and the data transmission cycle.
The transmitting station first sends the ID of the receiving station with which it wants to perform
serial communication as data with a 1 multiprocessor bit added. It then sends transmit dat a as d a ta
with a 0 multiprocessor bit added.
The receiving station skip s the data until data with a 1 multiprocessor bit is sent.
When data with a 1 multiprocessor bit is received, the receiving station compares that data with its
own ID. The station whose ID matches then receives the data sent next. Stations whose ID does
not match continue to skip the data until data with a 1 multiprocesso r bit is again received. In this
way, data communication is carried out among a number of processors.
Figure 14.9 shows an example of inter-processor communication using the multiprocessor format.
Data Transfer Formats
There are four data transfer formats.
When the multiprocessor form at is specified, the parity bit specificatio n is invalid.
For details, see table 14. 10.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 640 of 1268
REJ09B0220-0600
Clock
See section 14.3.2, Operation in Asynchronous Mode.
Transmitting
station
Receiving
station A
(ID= 01)
Receiving
station B
(ID= 02)
Receiving
station C
(ID= 03)
Receiving
station D
(ID= 04)
Serial communication line
Serial
data
ID transmission cycle=
receiving station
specification
Data transmission cycle=
Data transmission to
receiving station specified by ID
(MPB= 1) (MPB= 0)
H'01 H'AA
Legend:
MPB: Multiprocessor bit
Figure 14.9 Example of Inter-Processor Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A)
Data Transfer Operations
Multiprocessor serial data transmission: Figure 14.10 shows a sample flowchart for
multiprocessor serial data transmission.
The following procedure should be used for multiprocessor serial data transmission.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 641 of 1268
REJ09B0220-0600
No
<End>
[1]
Yes
Initialization
Start of transmission
Read TDRE flag in SSR [2]
Write transmit data to TDR and
set MPBT bit in SSR
No
Yes
No
Yes
Read TEND flag in SSR
[3]
No
Yes
[4]
Clear DR to 0 and set DDR to 1
Clear TE bit in SCR to 0
TDRE = 1?
All data transmitted?
TEND = 1?
Break output?
Clear TDRE flag to 0
SCI initialization:
The TxD pin is automatically
designated as the transmit data
output pin.
After the TE bit is set to 1,
a frame of 1s is output, and
transmission is enabled.
SCI status check and transmit
data write:
Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR. Set the
MPBT bit in SSR to 0 or 1.
Finally, clear the TDRE flag to 0.
Serial transmission continuation
procedure:
To continue serial transmission,
be sure to read 1 from the TDRE
flag to confirm that writing is
possible, then write data to TDR,
and then clear the TDRE flag to
0. Checking and clearing of the
TDRE flag is automatic when the
DMAC* or DTC is activated by a
transmit-data-empty interrupt
(TXI) request, and data is written
to TDR.
Break output at the end of serial
transmission:
To output a break in serial
transmission, set the port DDR to
1, clear DR to 0, then clear the
TE bit in SCR to 0.
[1]
[2]
[3]
[4]
Note: * The DMAC is not supported in the H8S/2321.
Figure 14.10 Sample Multiprocessor Serial Transmission Flowchart
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 642 of 1268
REJ09B0220-0600
In serial transmission, the SCI operates as described below.
[1] The SCI monitors the TDRE flag in SSR, and if is 0, reco gnizes that data has been written to
TDR, and transfers the data from TDR to TSR.
[2] After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts
transmission.
If the TIE bit is set to 1 at this time, a transmit-data-empty interrupt (TXI) is generated.
The serial transmit data is sent from the TxD pin in the following order.
[a] Start bit:
One 0-bit is output.
[b] Transmit data:
8-bit or 7-bit data is output in LSB -first order.
[c] Multiprocessor bit
One multiprocessor bit (MPBT value) is output.
[d] Stop bit(s):
One or two 1-bits (stop bits) are output.
[e] Mark state:
1 is output continuou sly until the start bit that starts t he next transmission is se nt.
[3] T he SCI checks the TDRE flag at the timing for sending the stop bit.
If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, the stop bit is sent, and
then serial transmission of the next frame is started.
If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then t he
mark state is entered in which 1 is output continuously. If the TEIE bit in SCR is set to 1 at this
time, a transmit-end interrupt (TEI) request is generated.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 643 of 1268
REJ09B0220-0600
Figure 14.11 shows an example of SCI operation for transmission using the multiprocessor
format.
TDRE
TEND
0
1 frame
D0 D1 D7 0/1 1 0 D0 D1 D7 0/1 1
1 1
DataStart
bit
Multi-
proces-
sor
bit Stop
bit Start
bit Data Multi-
proces-
sor bit Stop
bit
TXI interrupt
request generated Data written to TDR
and TDRE flag cleared to
0 in TXI interrupt handling
routine
TEI interrupt
request generated
Idle state
(mark state)
TXI interrupt
request generated
Figure 14.11 Example of SCI Transmit Operation
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit)
Multiprocessor serial data reception: Figure 14.12 shows a sample flowchart for
multiprocessor serial reception.
The following procedure should be used for multiprocessor serial data reception.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 644 of 1268
REJ09B0220-0600
Yes
<End>
[1]
No
Initialization
Start of reception
No
Yes
[4]
Clear RE bit in SCR to 0
Error handling
(Continued on
next page)
[5]
No
Yes
FER ∨ ORER = 1?
RDRF = 1?
All data received?
Read MPIE bit in SCR [2]
Read ORER and FER flags in SSR
Read RDRF flag in SSR [3]
Read receive data in RDR
No
Yes
This station's ID?
Read ORER and FER flags in SSR
Yes
No
Read RDRF flag in SSR
No
Yes
FER ∨ ORER = 1?
Read receive data in RDR
RDRF = 1?
SCI initialization:
The RxD pin is automatically
designated as the receive data
input pin.
ID reception cycle:
Set the MPIE bit in SCR to 1.
SCI status check, ID reception
and comparison:
Read SSR and check that the
RDRF flag is set to 1, then read
the receive data in RDR and
compare it with this station’s ID.
If the data is not this station’s ID,
set the MPIE bit to 1 again, and
clear the RDRF flag to 0.
If the data is this station’s ID,
clear the RDRF flag to 0.
SCI status check and data
reception:
Read SSR and check that the
RDRF flag is set to 1, then read
the data in RDR.
Receive error handling and break
detection:
If a receive error occurs, read the
ORER and FER flags in SSR to
identify the error. After
performing the appropriate error
handling, ensure that the ORER
and FER flags are both cleared
to 0.
Reception cannot be resumed if
either of these flags is set to 1.
In the case of a framing error, a
break can be detected by reading
the RxD pin value.
[1]
[2]
[3]
[4]
[5]
Figure 14.12 Sample Multiprocessor Serial Reception Flowchart
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 645 of 1268
REJ09B0220-0600
<End>
Error handling
Yes
No
Clear ORER, PER, and
FER flags in SSR to 0
No
Yes
No
Yes
Framing error handling
Overrun error handling
ORER = 1?
FER = 1?
Break?
Clear RE bit in SCR to 0
[5]
Figure 14.12 Sample Multiprocessor Serial Reception Flowchart (cont)
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 646 of 1268
REJ09B0220-0600
Figure 14.13 shows an example of SCI operation for multipro cesso r format reception.
MPIE
RDR
value
0D0 D1 D7 1 1 0 D0 D1 D7 0 1
1 1
Data (ID1)Start
bit MPB Stop
bit Start
bit Data (Data1) MPB Stop
bit
RXI interrupt
request
(multiprocessor
interrupt)
generated
MPIE = 0
Idle state
(mark state)
RDRF
RDR data read
and RDRF flag
cleared to 0 in
RXI interrupt
handling routine
If not this station's ID,
MPIE bit is set to 1
again
RXI interrupt request is
not generated, and RDR
retains its state
ID1
(a) Data does not match station's ID
MPIE
RDR
value
0D0 D1 D7 1 1 0 D0 D1 D7 0 1
1 1
Data (ID2)Start
bit MPB Stop
bit Start
bit Data (Data2) MPB Stop
bit
RXI interrupt
request
(multiprocessor
interrupt)
generated
MPIE = 0
Idle state
(mark state)
RDRF
RDR data read and
RDRF flag cleared
to 0 in RXI interrupt
handling routine
Matches this station's ID,
so reception continues, and
data is received in RXI
interrupt handling routine
MPIE bit set to 1
again
ID2
(b) Data matches station's ID
Data2ID1
Figure 14.13 Example of SCI Receive Operation
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit)
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 647 of 1268
REJ09B0220-0600
14.3.4 Operation in Synchronous Mode
In synchronous mode, data is transmitted or received in synchronization with clock pulses, makin g
it suitable for high-speed serial communication.
Inside the SCI, the transmitter and receiver are independent units, enablin g full-duplex
communication by use of a common clock. Both the transmitter and the receiver also have a
double-buffered structure, so that data can be read or written d uring transmission or reception,
enabling continuous data transfer.
Figure 14.14 shows the general format for synchronous serial communication.
Don't
care
Don't
care
One unit of transfer data (character or frame)
Bit 0
Serial
data
Serial
clock
Bit 1 Bit 3 Bit 4 Bit 5
LSB MSB
Bit 2 Bit 6 Bit 7
*
Note: * High except in continuous transfer
*
Figure 14.14 Data Format in Synchronous Communication
In synchronous serial communication, data on the communication line is output from one falling
edge of the serial clock to the next. Data confirmation is guaranteed at the rising edge of the serial
clock.
In synchronous serial communication, one character consists of data output starting with the LSB
and ending with the MSB. After the MSB is output, the communication line holds the MSB state.
In synchronous mode, the SCI receives data in synchronization with the rising edge of the serial
clock.
Data Transfer Format
A fixed 8-bit data format is used.
No parity or multiprocessor bits are add ed.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 648 of 1268
REJ09B0220-0600
Clock
Either an internal clock generated by the built-in baud rate generator or an external serial clock
input at the SCK pin can be selected, according to the setting of the C/A bit in SMR and the CKE1
and CKE0 bits in SCR. For details of SCI clock source selection, see table 14.9.
When the SCI is operated on an internal clock, the serial clock is output from the SCK pin.
Eight serial clock pulses are output in the transfer of one character, and when no transfer is
performed the clock is fixed high. When only receive operations are performed, however, the
serial clock is output until an overrun error occurs or the RE bit is cleared to 0. To perform receive
operations in units of one character, an external clock should be selected as the clock source.
Data Transfer Operations
SCI initialization (sy nchronous mode): Before transmitting or receiving data, first clear the TE
and RE bits in SCR to 0, then initialize the SCI as described below.
When the operating mode, transfer format, etc., is changed, the TE and RE bits must be cleared to
0 before making the change using the following procedure. When the TE bit is cleared to 0, the
TDRE flag is set to 1 and TSR is initialized. Note that clearing the RE bit to 0 does not change the
contents of the RDRF, PER, FER, and ORER flags, or the contents of RDR.
Figure 14.15 shows a sample SCI initialization flowchart.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 649 of 1268
REJ09B0220-0600
Wait
<Transfer start>
Start of initialization
Set data transfer format in
SMR and SCMR
No
Yes
Set value in BRR
Clear TE and RE bits in SCR to 0
[2]
[3]
Set TE or RE bit in SCR to 1, and
set RIE, TIE, TEIE, and MPIE bits
as necessary
Note: In simultaneous transmit and receive operations, the TE and RE bits should
both be cleared to 0 or set to 1 simultaneously.
[4]
1-bit interval elapsed?
Set CKE1 and CKE0 bits in SCR
(TE, RE bits 0) [1]
[1] Set the clock selection in SCR. Be sure
to clear bits RIE, TIE, TEIE, and MPIE,
TE and RE, to 0.
[2] Set the data transfer format in SMR
and SCMR.
[3] Write a value corresponding to the bit
rate to BRR. (Not necessary if an
external clock is used.)
[4] Wait at least one bit interval, then set
the TE bit or RE bit in SCR to 1.
Also set the RIE, TIE, TEIE, and MPIE
bits as necessary.
Setting the TE or RE bit enables the
TxD or RxD pin to be used.
Figure 14.15 Sample SCI Initialization Flow chart
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 650 of 1268
REJ09B0220-0600
Serial data t r ansmission (synchronous mode): Figure 14.16 shows a sample flowchart for serial
transmission.
The following procedure should be used for serial data transmission.
No
<End>
[1]
Yes
Initialization
Start of transmission
Read TDRE flag in SSR [2]
Write transmit data to TDR and
clear TDRE flag in SSR to 0
No
Yes
No
Yes
Read TEND flag in SSR
[3]
Clear TE bit in SCR to 0
TDRE = 1?
All data transmitted?
TEND = 1?
[1] SCI initialization:
The TxD pin is automatically
designated as the transmit data output
pin.
[2] SCI status check and transmit data
write:
Read SSR and check that the TDRE
flag is set to 1, then write transmit data
to TDR and clear the TDRE flag to 0.
[3] Serial transmission continuation
procedure:
To continue serial transmission, be
sure to read 1 from the TDRE flag to
confirm that writing is possible, then
write data to TDR, and then clear the
TDRE flag to 0.
Checking and clearing of the TDRE
flag is automatic when the DMAC* or
DTC is activated by a transmit-data-
empty interrupt (TXI) request and data
is written to TDR.
Note: * The DMAC is not supported in the H8S/2321.
Figure 14.16 Sample Serial Transmission Flowchart
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 651 of 1268
REJ09B0220-0600
In serial transmission, the SCI operates as described below.
[1] The SCI monitors the TDRE flag in SSR, and if is 0, reco gnizes that data has been written to
TDR, and transfers the data from TDR to TSR.
[2] After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts
transmission. If the TIE bit is set to 1 at this time, a transmit-data-empty interrupt (TXI) is
generated.
When clock output mode has been set, the SCI outputs 8 serial clock pulses. When use of an
external clock has been specified, data is output synchronized with the input clock.
The serial transmit data is sent from the TxD pin starting with the LSB (bit 0) and ending with
the MSB (bit 7).
[3] T he SCI checks the TDRE flag at the timing for sending the MSB (bit 7).
If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, and serial transmission
of the next frame is started.
If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, the MSB (bit 7) is sent, and the
TxD pin maintains its state.
If the TEIE bit in SCR is set to 1 at this ti me, a TEI interrupt request is generated.
[4] After co mpletio n of serial tra n smission, the SCK pin is fixed.
Figure 14.17 shows an example of SCI operation in transmission.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 652 of 1268
REJ09B0220-0600
Transfer direction
Bit 7
Serial data
Serial clock
1 frame
TDRE
TEND
Bit 0 Bit 7 Bit 0 Bit 1 Bit 7Bit 6
Data written to TDR
and TDRE flag
cleared to 0 in TXI
interrupt handling routine
TEI interrupt
request generated
TXI interrupt
request generated
TXI interrupt
request generated
Figure 14.17 Example of SCI Transmit Operation
Serial data reception (synchronous mode): Figure 14.18 shows a sample flowchart for serial
reception.
The following procedure should be used for serial data reception.
When changing the operating mode from asynchronous to sync hronous, be sure to check tha t the
ORER, PER, and FER flags are all cleared to 0.
The RDRF fla g will not be set if the FER or P E R flag is set t o 1, and neither transmit nor receive
operations will be possible.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 653 of 1268
REJ09B0220-0600
Yes
<End>
[1]
No
Initialization
Start of reception
[2]
No
Yes
Read RDRF flag in SSR [4]
[5]
Clear RE bit in SCR to 0
Error processing
(Continued below)
[3]
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
Yes
ORER = 1?
RDRF = 1?
All data received?
Read ORER flag in SSR
[1]
[2] [3]
[4]
[5]
SCI initialization:
The RxD pin is automatically
designated as the receive data
input pin.
Receive error handling:
If a receive error occurs, read the
ORER flag in SSR, and after
performing the appropriate error
handling, clear the ORER flag to
0. Transfer cannot be resumed if
the ORER flag is set to 1.
SCI status check and receive
data read:
Read SSR and check that the
RDRF flag is set to 1, then read
the receive data in RDR and
clear the RDRF flag to 0.
Transition of the RDRF flag from
0 to 1 can also be identified by
an RXI interrupt.
Serial reception continuation
procedure:
To continue serial reception,
before the MSB (bit 7) of the
current frame is received, finish
reading the RDRF flag, reading
RDR, and clearing the RDRF flag
to 0. The RDRF flag is cleared
automatically when the DMAC*
or DTC is activated by a
receive-data-full interrupt (RXI)
request and the RDR value is
read.
<End>
Error handling
Overrun error handling
[3]
Clear ORER flag in SSR to 0
Note: * The DMAC is not supported in the H8S/2321.
Figure 14.18 Sample Serial Reception Flowchart
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 654 of 1268
REJ09B0220-0600
In serial reception, the SCI operates as described below.
[1] The SCI performs internal initialization in synchronization with serial clock input or output.
[2] T he received data is stored in RSR in LSB-to-MSB order.
After reception, the SCI checks whether the RDRF flag is 0 and the receive data can be
transfe rred fro m RSR to RDR.
If this check is passed, the RDRF flag is set to 1, and the receive data is sto r ed in RDR. If a
receive error is detected in the error check, the operation is as shown in table 14.11.
Neither transmit nor receive operations can be performed subsequently when a receive error
has been found in the error check.
[3] If the RIE bit in SCR is set to 1 when the RDRF flag changes to 1, a receive-data-full interrupt
(RXI) request is generated.
Also, if the RIE bit in SCR is set to 1 when the ORER flag changes to 1, a receive-error
interrupt (ERI) request is generated.
Figure 14.19 shows an example of SCI operation in reception.
Bit 7
Serial
data
Serial
clock
1 frame
RDRF
ORER
Bit 0 Bit 7 Bit 0 Bit 1 Bit 6 Bit 7
RXI interrupt request
generated RDR data read and
RDRF flag cleared to 0
in RXI interrupt handling
routine
RXI interrupt request
generated ERI interrupt request
generated by overrun
error
Figure 14.19 Example of SCI Receive Operation
Simultaneous serial data transmission and reception (synchronous mode): Figure 14.20
shows a sample flowchart for simultaneous serial transmit and receive operations.
The following procedure should be used for simultaneous serial data transmit and receive
operations.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 655 of 1268
REJ09B0220-0600
Yes
<End>
[1]
No
Initialization
Start of transmission/reception
[5]
Error handling
[3]
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
Yes
ORER = 1?
All data received?
[2]
Read TDRE flag in SSR
No
Yes
TDRE = 1?
Write transmit data to TDR and
clear TDRE flag in SSR to 0
No
Yes
RDRF = 1?
Read ORER flag in SSR
[4]
Read RDRF flag in SSR
Clear TE and RE bits in SCR to 0
Notes: When switching from transmit or receive operation to simultaneous
transmit and receive operations, first clear the TE and RE bits to 0,
then set both these bits to 1 simultaneously.
* The DMAC is not supported in the H8S/2321.
[1]
[2]
[3]
[4]
[5]
SCI initialization:
The TxD pin is designated as the
transmit data output pin, and the
RxD pin is designated as the
receive data input pin, enabling
simultaneous transmit and receive
operations.
SCI status check and transmit data
write:
Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR and clear the
TDRE flag to 0.
Transition of the TDRE flag from 0 to
1 can also be identified by a TXI
interrupt.
Receive error handling:
If a receive error occurs, read the
ORER flag in SSR, and after
performing the appropriate error
handling, clear the ORER flag to 0.
Transmission/reception cannot be
resumed if the ORER flag is set to 1.
SCI status check and receive data
read:
Read SSR and check that the
RDRF flag is set to 1, then read the
receive data in RDR and clear the
RDRF flag to 0. Transition of the
RDRF flag from 0 to 1 can also be
identified by an RXI interrupt.
Serial transmission/reception
continuation procedure:
To continue serial transmission/
reception, before the MSB (bit 7) of
the current frame is received, finish
reading the RDRF flag, reading
RDR, and clearing the RDRF flag to
0. Also, before the MSB (bit 7) of
the current frame is transmitted,
read 1 from the TDRE flag to
confirm that writing is possible.
Then write data to TDR and clear
the TDRE flag to 0.
Checking and clearing of the TDRE
flag is automatic when the DMAC*
or DTC is activated by a transmit-
data-empty interrupt (TXI) request
and data is written to TDR. Also, the
RDRF flag is cleared automatically
when the DMAC* or DTC is
activated by a receive-data-full
interrupt (RXI) request and the RDR
value is read.
Figure 14.20 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 656 of 1268
REJ09B0220-0600
14.4 SCI Interrupts
The SCI has four interrupt sources: the transmit-end interrupt (TEI) request, receive-error interrupt
(ERI) request, receive-data-full interrupt (RXI) request, and transmit-data-empty interrupt (TXI)
request. Table 14.12 shows the interrupt sources and their relative prio rities. Individ ual i nt e rrupt
sources can be enabled or disabled with the TIE, RIE, and TEIE bits in the SCR. Each kind of
interrupt request is sent to the interrupt controller independently.
When the TDRE flag in SSR is set to 1, a TXI interrupt request is generated. When the TEND fla g
in SSR is set to 1, a T E I interrupt request is generated. A TXI interrupt can activate the DM AC*
or DTC to perform data transfer. The TDRE flag is cleared to 0 automatically when data transfer is
performed by the DMAC* or DTC. The DMAC* and DTC cannot be activated by a TEI interrupt
request.
When the RDRF flag in SSR is set to 1, an RXI interrupt request is generated. When the ORER,
PER, or FER flag in SSR is se t to 1, an ERI interrupt request is generated. An RXI interrupt can
activate the DMAC* or DTC to perform data transfer. The RDRF flag is cleared to 0
automatically when data transfer is performed by the DMAC* or DTC. The DMAC* and DTC
cannot be activated by an ERI interrupt request.
Also note that the DMAC* ca nnot be activated by an SCI channel 2 interrupt.
Note: * The DMAC is not supported in the H8S/2321.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 657 of 1268
REJ09B0220-0600
Table 14.12 SCI Interrupt Sources
Channel Interrupt
Source
Description DTC
Activation DMAC*2
Activation
Priority*1
0 ERI Interrupt due to receive error
(ORER, FER, or PER) Not
possible Not
possible High
RXI Interrupt due to receive data full
state (RDRF) Possible Possible
TXI Interrupt due to transmit data empty
state (TDRE) Possible Possible
TEI Interrupt due to transmission end
(TEND) Not
possible Not
possible
1 ERI Interrupt due to receive error
(ORER, FER, or PER) Not
possible Not
possible
RXI Interrupt due to receive data full
state (RDRF) Possible Possible
TXI Interrupt due to transmit data empty
state (TDRE) Possible Possible
TEI Interrupt due to transmission end
(TEND) Not
possible Not
possible
2 ERI Interrupt due to receive error
(ORER, FER, or PER) Not
possible Not
possible
RXI Interrupt due to receive data full
state (RDRF) Possible Not
possible
TXI Interrupt due to transmit data empty
state (TDRE) Possible Not
possible
TEI Interrupt due to transmission end
(TEND) Not
possible Not
possible
Low
Notes: 1. This table shows the initial state immediate after a reset. Relative priorities among
channels can be changed by the interrupt controller.
2. The DMAC is not supported in the H8S/2321.
A TEI interrupt is requested when the TEND flag is set to 1 while the TEIE bit is set to 1. The
TEND flag is cleared at the same time as the TDRE flag. Consequently, if a TEI interrupt and a
TXI interrupt are requested simultaneously, the TXI interrupt may be accepted first, with the result
that the TDRE and TE ND flags are cleared. No te that the TEI interrupt will not be accepted in this
case.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 658 of 1268
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14.5 Usage Notes
The following points should be noted when using the SCI.
Relation between Writes to TDR and the TDRE Flag: The TDRE flag in SSR is a status flag
that indicates that transmit data has been transferred from TDR to TSR. When the SCI transfers
data from TDR to TSR, the TDRE flag is set to 1.
Data can be written to TDR regardless of the state o f the TDRE flag. However, if new data is
written to TDR when the TDRE flag is cleared to 0, the da ta stored in TDR will be lost sinc e it has
not yet been transferred to TSR. It is therefore essential to check that the T DRE flag is set to 1
before writing transmit data to TDR.
Operation when Multiple Receive Errors Occur Simultaneously: If a number of receive errors
occur at the same time, the state of the status flags in SSR is as shown in table 14.13. If there is an
overrun error, data is not transferred from RSR to RDR, and the receive data is lost.
Table 14.13 State of SSR Status Flags and Transfer of Receive Data
SSR Status Flags
RDRF ORER FER PER Receive Data Transfer
from RSR to RDR Receive Error Status
1 1 0 0 X Overrun error
0 0 1 0 Framing error
0 0 0 1 Parity error
1 1 1 0 X Overrun error + framing error
1 1 0 1 X Overrun error + parity error
0 0 1 1 Framing error + parity error
1 1 1 1 X Overrun error + framing error +
parity error
Notes: : Receive data is transferred from RSR to RDR.
X : Receive data is not transferred from RSR to RDR.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 659 of 1268
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Break Detection and P rocessing (Asynchronous Mode Only): When framing error (FER)
detection is performed, a break can be detected by reading the RxD pin value directly. In a break,
the input from the RxD pin becomes all 0s, and so the FER flag is set, and the parity error flag
(PER) may also be set.
Note that, since the SCI continues the receive operation after receiving a break, even if the FER
flag is cleared to 0, it will be set to 1 again.
Sending a Break (Asynchronous Mode O nly): The TxD pin has a dual f uncti on as an I/O p ort
whose direction (input or output) is determined by DR and DDR. This can be used to send a break.
Between serial transmission initialization and settin g of the TE bit to 1, the mark state is replaced
by the value of DR (the pin does not function as the TxD pin until the T E bit is set to 1).
Therefore, DDR and DR for the port corresponding to the TxD pin should first be set to 1.
To send a break during serial transmission, first clear DR to 0, then clear the TE bit to 0.
When the TE bit is cleared to 0, the transmitter is initialized regardless of the current transmission
state, the TxD pin becomes an I/O port, and 0 is output from the TxD pin.
Receive Error Flags and Transmit Operations (Synchronous Mode Only): Transmission
cannot be started when a receive error flag (ORER, PER, or FER) is set to 1, even if the TDRE
flag is cleared to 0. Be sure to clear the receive error flags to 0 before starting transmission.
Note also that receive error flags cannot be cleared to 0 even if the RE bit is cleared to 0.
Receive Data Sampling Timing and Receive Margin in Asynchronous Mode: In asynchronous
mode, the SCI operates on a base clock with a frequency of 16 times the transfer rate.
In reception, the SCI samples the falling edge of the start bit using the base clock, and performs
internal synchronization. Receive data is latched internally at the risi ng edge o f the 8th pulse o f the
base clock. This is illustrated in figure 14.21.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 660 of 1268
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Internal base
clock
16 clocks
8 clocks
Receive data
(RxD)
Synchronization
sampling timing
Start bit D0 D1
Data sampling
timing
15 0 7 15 007
Figure 14.21 Receive Data Sampling Timing in Asynchronous Mode
Thus the receive margin in asynchronous mode is given by formula (1) below.
M = | (0.5 – 1
2N
) – (L – 0.5) F – | D – 0.5 |
N
(1 + F) | × 100%
... Formula (1)
Where M : Receive margin (%)
N : Ratio of bit rate to clock (N = 16)
D : Clock duty (D = 0 to 1.0)
L : Frame length (L = 9 to 12)
F : Absol ute value of clock rate deviation
Assuming values of F = 0 and D = 0.5 in formula (1), a receive margin of 46.875% is given by
formula (2) below.
When D = 0.5 and F = 0,
M = (0.5 – 1
2 × 16
) × 100%
= 46.875% ... Formula (2)
However, this is a theoretical value, and a margin of 20% to 30 % should be allowed in system
design.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 661 of 1268
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Restrictions on Use of DMAC* or DTC
• When an external clock source is used as the serial clock, the transmit clock should not be
input until at least 5 φ clock cycles after TDR is updated by the DMAC* or DTC.
Misoperation may occur if the transmit clock is input within 4 φ clocks after TDR is updated.
(Figure 14.22)
• When RDR is read by the DMAC* or DTC, be sure to set the activation source to the relevant
SCI receive-data-full interrupt (RXI).
Note: * The DMAC is not supported in the H8S/2321.
t
D0
LSB
Serial data
SCK
D1 D3 D4 D5D2 D6 D7
Note: When operating on an external clock, set t > 4 clocks.
TDRE
Figure 14.22 Example of Synchronous Transmission Using DTC
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 662 of 1268
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Operation in Case of Mode Transition
• Transmission
Operation should be stopped (by clearing TE, TIE, and TEIE to 0) before making a module
stop mode or so ft ware standby mode transition. TSR, TDR, and SSR are reset. The output pin
states in module stop mode or software standby mode depend on the port settings, and
becomes high-level output after the relevant mode is cleared. If a transition is made d uring
transmission, the data being transmitted will be unde fined. When transmitting without
changing the transmit mode after the relevant mode is cleared, transmission can be started by
setting TE to 1 again, and performing the following sequence: SSR read → TDR write →
TDRE clearance. To transmit with a different transmit mode after clearing the relevant mode,
the procedure must be started again from initialization. Fig ure 14.23 shows a sample flowchart
for mode transition during transmission. Port p in states are shown in figures 14.24 and 14.25.
Operation should also be stopped (by clearing TE, TIE, and TEIE to 0) before making a
transition from transmission by DTC transfer to module stop mode or software standby mode
transition. To perform transmission with the DTC after the relevant mode is cleared, setting TE
and TIE to 1 will set the TXI flag and start DTC trans missio n.
• Reception
Receive operation should be stopped (by clearing RE to 0) before making a module stop mode
or software standby mode transition. RSR, RDR, and SSR are reset. If a transition is made
without stopping operation, the data being received will be invalid.
To continue receiving without changing the reception mode after the relevant mode is cleared,
set RE to 1 before starting reception. To receive with a different receive mode, the procedure
must be started again from initialization.
Figure 14.26 shows a sample flowchart for mode transition during reception.
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 663 of 1268
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Read TEND flag in SSR
TE = 0
Transition to software
standby mode, etc.
Exit from software
standby mode, etc.
Change
operating mode? No
All data
transmitted?
TEND = 1?
Yes
Yes
Yes
<Transmission>
No
No
[1]
[3]
[2]
TE = 1Initialization
<Start of transmission>
[1] Data being transmitted is interrupted.
After exiting software standby mode,
etc., normal CPU transmission is
possible by setting TE to 1, reading
SSR, writing TDR, and clearing
TDRE to 0, but note that if the DTC
has been activated, the remaining
data in DTCRAM will be transmitted
when TE and TIE are set to 1.
[2] If TIE and TEIE are set to 1, clear
them to 0 in the same way.
[3] Includes module stop mode.
Figure 14.23 Sample Flowchart for Mode Transition during Transmission
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 664 of 1268
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SCK output pin
TE bit
TxD output pin Port input/output High outputPort input/output High output Start Stop
Start of transmission End of
transmission
Port input/output
SCI TxD output Port SCI TxD
output
Port
Transition
to software
standby
Exit from
software
standby
Figure 14.24 Asynchronous Transmission Using Internal Clock
Port input/output
Last TxD bit held
High output*Port input/output Marking output
Port input/output
SCI TxD output PortPort
Note: * Initialized by software standby.
SCK output pin
TE bit
TxD output pin
SCI TxD
output
Start of transmission End of
transmission
Transition
to software
standby
Exit from
software
standby
Figure 14.25 Synchronous Transmission Using Internal Clock
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 665 of 1268
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RE = 0
Transition to software
standby mode, etc.
Read receive data in RDR
Read RDRF flag in SSR
Exit from software
standby mode, etc.
Change
operating mode? No
RDRF = 1?
Yes
Yes
<Reception>
No [1]
[2]
RE = 1Initialization
<Start of reception>
[1] Receive data being received
becomes invalid.
[2] Includes module stop mode.
Figure 14.26 Sample Flowchart for Mode Transition during Reception
Section 14 Serial Communication Interface (SCI)
Rev.6.00 Sep. 27, 2007 Page 666 of 1268
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Section 15 Smart Card Interface
Rev.6.00 Sep. 27, 2007 Page 667 of 1268
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Section 15 Smart Card Interface
15.1 Overview
The SCI supports an IC card (smart card) interface conforming to ISO/IEC 7816-3 (identification
card) as a serial communication interface extension function.
Switching between the normal serial communication interface and the smart card interface is
carried out by means of a register setting.
15.1.1 Features
Features of the smart card interface supported by the chip is as follows.
• Asynchronous mode
⎯ Data length: 8 bits
⎯ Parity bit generation and checking
⎯ Transmission of error signal (parity error) in receive mode
⎯ Error signal detection and automatic data retransmission in tr ansmit mode
⎯ Direct convention and inverse convention both supported
• Built-in baud rate generator allows any bit rate to be selected
• Three interrupt sources
⎯ Three interrupt sources (transmit-data-empty, receive-data-full, and transmit/receive-error)
that can issue requests independently
⎯ The transmit-data-empty and receive-data-full interrupts can activate the DMA controller
(DMAC)* or data transfer controller (DTC) to execute data transfer
Note: * The DMAC is not supported in the H8S/2321.
Section 15 Smart Card Interface
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15.1.2 Block Diagram
Figure 15.1 shows a block diagram of the smart card interface.
Bus interface
TDR
RSR
RDR
Module data bus
TSR
SCMR
SSR
SCR
Transmission/
reception control
BRR
Baud rate
generator
Internal
data bus
RxD
TxD
SCK
Parity generation
Parity check
Clock
φ
φ/4
φ/16
φ/64
TXI
RXI
ERI
SMR
Legend:
SCMR: Smart card mode register
RSR: Receive shift register
RDR: Receive data register
TSR: Transmit shift register
TDR: Transmit data register
SMR: Serial mode register
SCR: Serial control register
SSR: Serial status register
BRR: Bit rate register
Figure 15.1 Block Diagram of Smart Card Interface
Section 15 Smart Card Interface
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15.1.3 Pin Configuration
Table 15.1 shows the smart card interface pin configuration.
Table 15.1 Smart Card Interface Pins
Channel Pin Name Symbol I/O Function
0 Serial clock pin 0 SCK0 I/O SCI0 clock input/output
Receive data pin 0 RxD0 Input SCI0 receive data input
Transmit data pin 0 TxD0 Output SCI0 transmit data output
1 Serial clock pin 1 SCK1 I/O SCI1 clock input/output
Receive data pin 1 RxD1 Input SCI1 receive data input
Transmit data pin 1 TxD1 Output SCI1 transmit data output
2 Serial clock pin 2 SCK2 I/O SCI2 clock input/output
Receive data pin 2 RxD2 Input SCI2 receive data input
Transmit data pin 2 TxD2 Output SCI2 transmit data output
Section 15 Smart Card Interface
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15.1.4 Register Configuration
Table 15.2 shows the registers used by the smart card interface. Details of SMR, BRR, SCR, TDR,
RDR, and MSTPCR are the same as for the normal SCI function: see the register descriptions in
section 14, Serial Communication Interface (SCI).
Table 15.2 Smart Card Interface Registers
Channel Name Abbreviation R/W Initial Value Address*1
0 Serial mode register 0 SMR0 R/W H'00 H'FF78
Bit rate register 0 BRR0 R/W H'FF H'FF79
Serial control regi ster 0 SCR0 R/ W H'00 H'FF7A
Transmit data register 0 TDR0 R/W H'FF H'FF7B
Serial status register 0 SSR0 R/(W)*2 H'84 H'FF7C
Receive data register 0 RDR0 R H'00 H'FF7D
Smart card mode regist er 0 SCMR0 R/ W H'F2 H'FF7E
1 Serial mode register 1 SMR1 R/W H'00 H'FF80
Bit rate register 1 BRR1 R/W H'FF H'FF81
Serial control regi ster 1 SCR1 R/ W H'00 H'FF82
Transmit data register 1 TDR1 R/W H'FF H'FF83
Serial status register 1 SSR1 R/(W) *2 H'84 H'FF84
Receive data register 1 RDR1 R H'00 H'FF85
Smart card mode regist er 1 SCMR1 R/W H' F2 H'FF86
2 Serial mode register 2 SMR2 R/W H'00 H'FF88
Bit rate register 2 BRR2 R/W H'FF H'FF89
Serial control regi ster 2 SCR2 R/ W H'00 H'FF8A
Transmit data register 2 TDR2 R/W H'FF H'FF8B
Serial status register 2 SSR2 R/(W) *2 H'84 H'FF8C
Receive data register 2 RDR2 R H'00 H'FF8D
Smart card mode regist er 2 SCMR2 R/ W H'F2 H'FF8E
All Module stop control register MSTPCR R/W H'3FFF H'FF3C
Notes: 1. Lower 16 bits of the address.
2. Can only be written with 0 for flag clearing.
Section 15 Smart Card Interface
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15.2 Register Descriptions
Registers added with the smart card interface and bits for which the function changes are
described here.
15.2.1 Smart Card Mode Register (SCMR)
Bit : 7 6 5 4 3 2 1 0
— — — — SDIR SINV — SMIF
Initial value : 1 1 1 1 0 0 1 0
R/W : — — — — R/W R/W — R/W
SCMR is an 8-bit readable/writable register that selects the smart card interface function.
SCMR is initialized to H'F2 by a reset and in hardware standby mode. In software standby mode
and module stop mode it retains its previous state.
Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 1.
Bit 3—Smart Card Data Transfer Direction (SDIR): Selects the serial/parallel conversion
format.
Bit 3
SDIR
Description
0 TDR contents are transmitted LSB-first (Initial value)
Receive data is stored in RDR LSB-first
1 TDR contents are transmitted MSB-first
Receive data is stored in RDR MSB-first
Section 15 Smart Card Interface
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Bit 2—Smart Card Data Invert (SINV): Specifies inversio n of t he data lo gic level. This
function is used together with the SDIR bit for communication with an inverse convention card.
The SINV bit does not affect the logic level of the parity bit. For parity-related setting procedures,
see section 15.3.4, Register Settings.
Bit 2
SINV
Description
0 TDR contents are transmitted as they are (Initial value)
Receive data is stored as it is in RDR
1 TDR contents are inverted before being transmitted
Receive data is stored in inverted form in RDR
Bit 1—Reserved: Read-only bit, always read as 1.
Bit 0—Smart Card Interface Mode Select (SMIF): Enables or disables the smart card interface
function.
Bit 0
SMIF
Description
0 Smart card inter f ace function is disab led (Initial value)
1 Smart card interface funct ion i s enable d
Section 15 Smart Card Interface
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15.2.2 Serial Status Register (SSR)
Bit : 7 6 5 4 3 2 1 0
TDRE RDRF ORER ERS PER TEND MPB MPBT
Initial value : 1 0 0 0 0 1 0 0
R/W : R/(W)* R/(W)* R/(W)* R/(W)* R/(W)* R R R/W
Note: * Only 0 can be written to bits 7 to 3, to clear these flags.
Bit 4 of SSR has a different function in smart card interface mode. Coupled with this, the setting
conditions for bit 2, TEND, are also different.
Bits 7 to 5—Operate in the same way as for the normal SCI. For details, see section 14.2.7, Serial
Status Regis ter (SSR).
Bit 4—Error Signal Status (ERS): In smart card interface mode, bit 4 indicates the status of the
error signal sent back from the receiving end in transmission. Framing errors are not detected in
smart card interface mode.
Bit 4
ERS
Description
0 Indicates data received normally with no error signal (Initial value)
[Clearing conditions]
• Upon reset, and in standby mode or module sto p mode
• When 0 is written to ERS after reading ERS = 1
1 Indicates an error signal was sent showing detection of a parity error at the receiving
side
[Setting condition]
When the low level of the error signal is sampled
Note: Clearing the TE bit in SCR to 0 does not affect the ERS flag, which retains its previous
state.
Section 15 Smart Card Interface
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Bits 3 to 0—Operate in the same way as for the normal SCI. For details, see section 14.2.7, Serial
Status Regis ter (SSR).
However, the setting conditions for the T E ND bit, are as shown below.
Bit 2
TEND
Description
0
Indicates transfer in progress
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the DMAC* or DTC is activated by a TXI interrupt and writes data to TDR
1 Indicates transfer complete (Initial value)
[Setting conditions]
• Upon reset, and in standby mode or module sto p mode
• When the TE bit in SCR is 0 and the ERS bit is also 0
• When TDRE = 1 and ERS = 0 (normal transmission) 2.5 etu after transmission of a
1-byte serial character when GM = 0 and BLK = 0
• When TDRE = 1 and ERS = 0 (normal transmission) 1.5 etu after transmission of a
1-byte serial character when GM = 0 and BLK = 1
• When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a
1-byte serial character when GM = 1 and BLK = 0
• When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after transmission of a
1-byte serial character when GM = 1 and BLK = 1
Notes: etu: Elementary time unit (time for transfer of 1 bit)
* The DMAC is not supported in the H8S/2321.
Section 15 Smart Card Interface
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15.2.3 Serial Mode Register (SMR)
Bit : 7 6 5 4 3 2 1 0
GM BLK PE* O/E BCP1 BCP0 CKS1 CKS0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
Note: * The DMAC is not supported in the H8S/2321.
The function of bits 7, 6, 3, and 2 of SMR changes in smart card interface mode.
Bit 7—GSM Mode (GM): Sets the smart card interface function to GSM mode.
This bit is cleared to 0 when the normal smart card interface is used. In GSM mode, this bit is set
to 1, the timing of setting of the TEND flag that indicates transmission completion is advanced,
and clock output control mode addition is performed. The contents of the clock output control
mode addition are specified by bits 1 and 0 of the serial control register (SCR).
Bit 7
GM
Description
0 N ormal smart card interface mode operat ion (Initial value)
• TEND flag generation 12.5 etu (11.5 etu in block transfer mode) after beginning of
start bit
• Clock output on/off control only
1 GSM mode smart card interface mode operation
• TEND flag generation 11.0 etu after beginning of start bit
• High/low fixing control possible in addition to clock output on/off control (set by
SCR)
Note: etu: Elementary time unit (time for transfer of 1 bit)
Section 15 Smart Card Interface
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Bit 6—Block Transfer Mode (BLK): Selects block transfer mode.
Bit 6
BLK
Description
0 N ormal smart card interface mode operat ion (Initial value)
• Error signal transmission/detection and automatic data retransmission performed
• TXI interrupt generated by TEND flag
• TEND flag set 12.5 etu after start of transmission (11.0 etu in GSM mode)
1 Block transfer mode operation
• Error signal transmission/detection and automatic data retransmission not
performed
• TXI interrupt generated by TDRE flag
• TEND flag set 11.5 etu after start of transmission (11.0 etu in GSM mode)
Note: etu: Elementary time unit (time for transfer of 1 bit)
Bits 3 and 2—Base Clock Pulse 1 and 2 (BCP1, BCP0): These bits specify the number of base
clock periods in a 1-bit transfer interval on the smart card interface.
Bit 3
BCP1 Bit 2
BCP0
Description
0 0 32 clock periods (Initial value)
1 64 clock periods
1 0 372 clock peri ods
1 256 clock periods
Bits 5, 4, 1, and 0—Operate in the same way as for the normal SCI. For details, see section
14.2.5, Serial Mode Register (SMR).
Section 15 Smart Card Interface
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15.2.4 Serial Control Register (SCR)
Bit : 7 6 5 4 3 2 1 0
TIE RIE TE RE MPIE TEIE CKE1 CKE0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
In smart card interface mode, the function of bits 1 and 0 of SCR changes when bit 7 of the serial
mode register (SMR) is set to 1.
Bits 7 to 2—Operate in the same way as for the normal SCI. For details, see section 14.2.6, Serial
Contro l Register (SCR) .
Bits 1 and 0—Clock Enable 1 and 0 (CKE1, CKE0): These bits are used to select the SCI clock
source and enable or disable clock output from the SCK pin.
In smart card interface mode, in addition to the normal switching between clock outp ut enabling
and disabling, the clock output can be specified as being fixed high or low.
SCMR SMR SCR Setting
SMIF GM CKE1 CKE0 SCK Pin Function
0 See the SCI specification
1 0 0 0 Operates as port I/O pin
1 0 0 1 Outputs clock as SCK output pin
1 1 0 0 Operates as SCK output pin, with output fixed
low
1 1 0 1 Outputs clock as SCK output pin
1 1 1 0 Operates as SCK output pin, with output fixed
high
1 1 1 1 Outputs clock as SCK output pin
Section 15 Smart Card Interface
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15.3 Operation
15.3.1 Overview
The main functions of the smart card interface are as follows.
• One frame consists of 8-bit data plus a parity bit.
• In transmission, a guard time of at least 2 etu (1 etu in block transfer mode) (elementary time
unit: the time for transfer of 1 bit) is left between the end of the parity bit and the start of the
next frame .
• If a parity error is detected during reception, a low error signal level is output for one etu
period, 10.5 etu after the start bit. (This does not apply to block transfer mode.)
• If the error signal is sampled during transmission, the same data is transmitted automatically
after the elapse of 2 etu or longer. (This does not apply to block transfer mode.)
• Only asynchronous communication is supported; there is no synchronous communication
function.
15.3.2 Pin Connections
Figure 15.2 shows a schematic diagram of smart card interface related pin connections.
In communication with an IC card, since both transmission and reception are carried out on a
single data communication line, the chip ’s T xD pin and RxD p in sho uld b o th be co nnected to the
line, as shown in the figure. The data communication line should be p ulled up to the VCC power
supply with a re sistor .
When the clock generated on the smart card interface is used by an IC card, the SCK pin output is
input to the CLK pin of the IC card. No connection is needed if the IC card uses an internal clock.
Chip port output is used as the reset signal.
Other pins must normally be connected to the power supply or ground.
Section 15 Smart Card Interface
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TxD
RxD
SCK
Rx (port)
Chip
I/O
CLK
RST
VCC
Connected equipment
IC card
Data line
Clock line
Reset line
Figure 15.2 Schematic Diagram of Smart Card Interface Pin Connections
Note: If an IC card is not connected, and the TE and RE bits are both set to 1, closed
transmission/reception is possible, enabling self-diagnosis to be carried out.
Section 15 Smart Card Interface
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15.3.3 Data Format
Normal Transfer Mode: Figure 15.3 shows the smart card interface data format in the nor mal
transfer mode. In reception in this mode, a parity check is carried out on each frame. If an error is
detected an error signal is sent back to the transmitting end, and retransmission of the data is
requested. If an error signal is sampled during transmission, the same data is retransmitted.
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
When there is no parity error
Transmitting station output
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
When a parity error occurs
Transmitting station output
DE
Receiving station
output
Legend:
Ds: Start bit
D0 to D7: Data bits
Dp: Parity bit
DE: Error signal
Figure 15.3 Smart Card Interface Data Format
Section 15 Smart Card Interface
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The operation sequence is as follows.
[1] When the data line is not in use it is in the high-impedance state, and is fixed high with a pull-
up resistor.
[2] T he transmitting station starts transfer of one frame of data. The data frame starts with a start
bit (Ds, low-level), followed by 8 data b its (D0 to D7) and a parity bit (Dp).
[3] With the smart card interface, the data line then returns to the high-impedance state. The data
line is pulled high with a pull-up resistor.
[4] T he receiving station carries out a parity check.
If there is no parity error and the data is received normally, the receiving station waits for
reception of the next data.
If a parity error occurs, however, the receiving station outputs an error signal (DE, low-level)
to request retransmission of the data. After outputting the error signal for the prescrib ed length
of time, the receiving station places the signal line in the high-impedance state again. The
signal line is pulled high again by a pull-up resistor.
[5] If the transmitting station does not receive an error signal, it proceeds to transmit the next data
frame.
If it does receive an error signal, however, it returns to step [2] and retransmits the data in
which the error occurred.
Block Transfer Mode: The operation sequence in block transfer mode is as follows.
[1] When the data line is not in use it is in the high-impedance state, and is fixed high with a pull-
up resistor.
[2] T he transmitting station starts transfer of one frame of data. The data frame starts with a start
bit (Ds, low-level), followed by 8 data b its (D0 to D7) and a parity bit (Dp).
[3] With the smart card interface, the data line then returns to the high-impedance state. The data
line is pulled high with a pull-up resistor.
[4] T he receiving station carries out a parity check, but does not output an error signal even if an
error has occurred. Since subsequent receive operations cannot be carried out if an error
occurs, the error flag must be cleared to 0 before the parity bit for the next frame is received.
[5] T he transmitting station proceeds to transmit the next data frame.
Section 15 Smart Card Interface
Rev.6.00 Sep. 27, 2007 Page 682 of 1268
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15.3.4 Register Settings
Table 15.3 shows a bit map of the registers used by the smart card interface.
Bits indicated as 0 or 1 must b e set to the value shown. The setting of other bits is describ ed
below.
Table 15.3 Smart Card Interface Register Settings
Bit
Register Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
SMR GM BLK 1 O/E BCP1 BCP0 CKS1 CKS0
BRR BRR7 BRR6 BRR5 BRR4 BRR3 BRR2 BRR1 BRR0
SCR TIE RIE TE RE 0 0 CKE1* CKE0
TDR TDR7 TDR6 TDR5 TDR4 TDR3 TDR2 TDR1 TDR0
SSR TDRE RDRF ORER ERS PER TEND 0 0
RDR RDR7 RDR6 RDR5 RDR4 RDR3 RDR2 RDR1 RDR0
SCMR — — — — SDIR SINV — SMIF
Notes: — : Unused bit.
* The CKE1 bit must be cleared to 0 when the GM bit in SMR is cleared to 0.
SMR Set tings: The GM bit is cleared to 0 in normal smart card interface mode, and set to 1 in
GSM mode. The O/E bit is cleared to 0 if the IC card is of the direct convention type, and set to 1
if of the inverse convention type.
Bits CKS1 and CKS0 select the clock source of the built-in baud rate generator, and bits BCP1
and BCP0 select the number of base clock cycles during transfer of one bit. For details, see section
15.3.5, Clock.
The BLK bit is cleared to 0 when using the normal smart card interface mode, and set to 1 when
using block transfer mode.
BRR Setting: BRR is used to set the bit rate. See section 15.3 . 5, Clock, for the method of
calculating the value to be set.
SCR Settings: The function of the TIE, RIE, TE, and RE bits is the same as for the normal SCI.
For details, see section 14, Serial Communication Interface (SCI).
Bits CKE1 and CKE0 specify the clock output. When the GM bit in SMR is cleared to 0 , set these
bits to B'00 if a clock is not to b e output, or to B'01 if a clock is to be output. When the GM bit in
SMR is set to 1, clock output is performed. The clock output can also be fixed high or low.
Section 15 Smart Card Interface
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Smart Card Mode Register (SCM R) Settings: The SDIR bit is cleared to 0 if the IC card is of
the direct convention type, and set to 1 if of the inverse convention type.
The SINV bit is cleared to 0 if the IC card is of the direct convention type, and set to 1 if of the
inverse convention type.
The SMIF bit is set to 1 when the smart card interface is used.
Examples of register settings and the waveform of the start character are shown below for the two
types of IC card (direct convention and inverse convention).
• Direct convention (SDIR = SI NV = O/E = 0)
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
AZZAZZZAAZ(Z) (Z) State
With the direct convention type, the logic 1 level corresponds to state Z and the logic 0 level to
state A, and transfer is performed in LSB-first order. The start character data above is H'3B.
The parity bit is 1 since even parity is stipulated for the smart card.
• Inverse convention (SDIR = SINV = O/E = 1)
Ds D7 D6 D5 D4 D3 D2 D1 D0 Dp
AZZAAAAAAZ(Z) (Z) State
With the inverse convention type, the logic 1 level corresponds to state A and the logic 0 level
to state Z, and transfer is performed in MSB-first order. The start character data above is H'3F.
The parity bit is 0, corresponding to state Z, since even parity is stipulated for the smart card.
With the chip, inversion specified by the SINV bit applies only to the data bits, D7 to D0. For
parity bit inversion, the O/E bit in SMR should be set to odd parity mode (the same applies to
both transmission and reception).
Section 15 Smart Card Interface
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15.3.5 Clock
Only an int ernal clock generated b y the built-in ba ud ra te genera tor can be used as the
transmit/receive clock for the smart card interface. The bit rate is set with BRR and the CKS1,
CKS0, BCP1, and B CP 0 bits in SMR. The formula for calculating the bit rate is as shown below.
Table 15.5 shows some sample bit rates.
If clock output is selected by settin g CKE0 to 1, the clock is output fro m the SCK pi n. The clock
frequency is determined by the bit rate and the setting of bits BCP1 and B CP 0.
B = φ
S × 22n+1 × (N + 1)
× 106
Where: N = Value set in BRR (0 ≤ N ≤ 255)
B = Bit rate (bits/s)
φ = Op erat ing fr equenc y (MHz)
n = See table 15.4
S = Number of internal clock cycles in 1-bit period set by bits BCP1 and BCP0
Table 15.4 Correspondence between n and CKS1, CKS0
n CKS1 CKS0
0 0 0
1 1
2 1 0
3 1
Table 15.5 Examples of Bit Rate B (bits/s) for Various BRR Settings
(When n = 0 and S = 372)
φ (MHz)
N 10.00 10.714 13.00 14.285 16.00 18.00 20.00 25.00
0 13441 14400 17473 19200 21505 24194 26882 33602
1 6720 7200 8737 9600 10753 12097 13441 16801
2 4480 4800 5824 6400 7168 8065 8961 11201
Note: Bit rates are rounded to the nearest whole number.
Section 15 Smart Card Interface
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The method of calculating the value to be set in the bit rate register (BRR) from the operating
frequency and bit rate, on the other hand, is shown belo w. N is an integer, 0 ≤ N ≤ 255, and the
smaller error is specified.
N = φ
S × 22n+1 × B
× 106 – 1
Table 15.6 Examples of BRR Settings for Bit Rate B (bits/s) (When n = 0 and S = 372)
φ (MHz)
7.1424 10.00 10.7136 13.00 14.2848 16.00 18.00 20.00 25.00
Bits/s N Error N Error N Error N Error N Error N Error N Error N Error N Error
9600 0 0.00 1 30 1 25 1 8.99 1 0.00 1 12.01 2 15.99 2 6.60 3 12.49
Table 15.7 Maximum Bi t Rate at V arious Frequencies (Smart Card Interface Mode)
(When S = 372)
φ (MHz) Maximum Bit Rate (bits/s) N n
7.1424 9600 0 0
10.00 13441 0 0
10.7136 14400 0 0
13.00 17473 0 0
14.2848 19200 0 0
16.00 21505 0 0
18.00 24194 0 0
20.00 26882 0 0
25.00 33602 0 0
The bit rate error is given by the following formula:
Error (%) = ( φ
S × 22n+1 × B × (N + 1)
× 106 – 1) × 100
Section 15 Smart Card Interface
Rev.6.00 Sep. 27, 2007 Page 686 of 1268
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15.3.6 Data Transfer Operations
Initialization: Before transmitting or receiving data, initialize the SCI as describ ed below.
Initialization is also necessary when switching from transmit mode to receive mode, or vice versa.
[1] Clear the TE and RE bits in SCR to 0.
[2] Clear the error flags ERS, PER, and ORER in SSR to 0.
[3] Set the GM, BLK, O/E, BCP1, BCP0, CKS1, and CKS0 bits in SMR, and set the PE bit to 1.
[4] Set the SMI F, SDIR, and SINV bits in SCMR.
When the SMIF bit is set to 1, the TxD and RxD pins are both switched from ports to SCI pins,
and are placed in the high-impedance state.
[5] Set the value correspo nding to the bit rate in BRR.
[6] Set the CKE1 a nd CKE0 bits in SCR. Clear t he TIE, RIE, TE, RE, MPIE, and TEIE bits to 0.
If the CKE0 bit is set to 1, the clock is outp ut fro m the SCK pin.
[7] W a it at least o ne bit interval, then set the TIE, RIE, TE, and RE bits in SC R. Do not set the TE
bit and RE bit at the same time, except for self-diagnosis.
Section 15 Smart Card Interface
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Serial Data Transmission (Except Block Transfer Mode): As data transmission in smart card
mode involves error signal sampling and retransmission processing, the processing procedure is
different from that for the normal SCI. Figure 15.4 shows a flowchart for transmitting, and figure
15.5 sho ws the relation between a transmit operation and the internal registers.
[1] Perform smart card interface mode initialization as described above in Initialization.
[2] Check that the ERS error flag in SSR is cleared to 0.
[3] Repeat steps [2] and [3] until it can be confirmed that the TEND flag in SSR is set to 1.
[4] W r ite the transmit data to TDR, clear the TDRE flag to 0, and perfor m the transmit operation.
The TEND flag is cleared to 0.
[5] When transmittin g data continuously, go back to step [2].
[6] T o end transmission, clear the TE bit to 0.
With the above processing, interrupt handling or data transfer by the DMAC* or DTC is possible.
If transmission ends and the TEND fla g is set to 1 while the TIE bit is set to 1 and interrupt
requests are enabled, a transmit-data-empty interrupt (TXI) request will be generated. If an error
occurs in transmission and the ERS flag is set to 1 while the RIE bit is set to 1 and interrup t
requests are enabled, a transmit/receive-error interrupt (ERI) request will be generated.
The timing for setting the TEND flag depends on the value of the GM bit in SMR. The TEND flag
setting timing is shown in figure 15.6.
If the DMAC* or DTC is activated by a TXI request, the number of bytes set in the DMAC* or
DTC can be transmitted automatically, includi n g auto matic retransmission.
For details, see Interrupt Operations and Data Tr ansfer Operation b y DMAC* or DTC below.
Notes: For details of operation in block transfer mode, see section 14.3.2, Operation in
Asynchronous Mode.
* The DMAC is not supported in the H8S/2321.
Section 15 Smart Card Interface
Rev.6.00 Sep. 27, 2007 Page 688 of 1268
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Initialization
No
Yes
Clear TE bit to 0
Start of transmission
Start
No
No
No
Yes
Yes
Yes
Yes
No
End
Write data to TDR,
and clear TDRE flag
in SSR to 0
Error handling
Error handling
TEND = 1?
All data transmitted?
TEND = 1?
ERS = 0?
ERS = 0?
Figure 15.4 Sample Transmission Flowchart
Section 15 Smart Card Interface
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(1) Data write
TDR TSR
(shift register)
Data 1
(2) Transfer from
TDR to TSR Data 1 Data 1 ; Data remains in TDR
(3) Serial data output
Note: When the ERS flag is set, it should be cleared until transfer of the last bit (D7 in LSB-first
transmission, D0 in MSB-first transmission) of the next transfer data to be transmitted has
been completed.
In case of normal transmission: TEND flag is set
In case of transmit error: ERS flag is set
Steps (2) and (3) above are repeated until the TEND flag is set
I/O signal line output
Data 1 Data 1
Figure 15.5 Relation Between Transmit Operation and Internal Registers
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
I/O data
12.5 etu
TXI
(TEND interrupt)
11.0 etu
DE
Guard
time
When GM = 1
Legend:
Ds: Start bit
D0 to D7: Data bits
Dp: Parity bit
DE: Error signal
Note: etu: Elementary time unit (time for transfer of 1 bit)
When GM = 0
Figure 15.6 TEND Flag Generation Timing in Transmission
Section 15 Smart Card Interface
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Serial Data Reception (Except Block Transfer Mode): Data reception in smart card mode uses
the same processing procedure as for the normal SCI. Figure 15.7 shows an example of the
transmission processing flow.
[1] Perform smart card interface mode initialization as described above in Initialization.
[2] Check that the ORER flag and PER flag in SSR are cleared to 0. If either is set, perform the
appropriate receive error handling, then clear both the ORER and the PER flag to 0.
[3] Repeat steps [2] and [3] until it can be confirmed that the RDRF flag is set to 1.
[4] Read the receive data from RDR.
[5] When receiving data continuously, clear the RDRF flag to 0 and go back to step [2].
[6] T o end reception, clear the RE bit to 0.
Initialization
Read RDR and clear
RDRF flag in SSR to 0
Clear RE bit to 0
Start of reception
Start
Error handling
No
No
No
Yes
Yes
ORER = 0 and
PER = 0?
RDRF = 1?
All data received?
Yes
Figure 15.7 Sample Reception Flowchart
Section 15 Smart Card Interface
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With the above processing, interrupt handling or data transfer by the DMAC* or DTC is possible.
If reception ends and the RDRF flag is set to 1 while the RIE bit is set to 1 and interrupt requests
are enabled, a receive data full interrupt (RXI) request will be generated. If an error occurs in
reception and either the ORER flag or the PER flag is set to 1, a transmit/receive-error interrupt
(ERI) request will be generated.
If the DMAC* or DTC is activated by an RXI request, the receive data in which the error occurred
is skipped, and only the number of bytes of receive data set in the DMAC* or DT C are transferred.
For details, see Interrupt Operation and Data Transfer Operation by DMAC* or DTC below.
If a parity error occurs during reception and the PER is set to 1, the received d ata is still
transferred to RDR, and therefore this data can be read.
Notes: For details of operation in block transfer mode, see section 14.3.2, Operation in
Asynchronous Mode.
* The DMAC is not supported in the H8S/2321.
Mode Switching Operation: When switching from receive mode to transmit mode, first confirm
that the receive operation has been completed, then start from initialization, clearing RE bit to 0
and setting TE bit to 1. The RDRF flag or the PER and ORER flags can be used to check that the
receive operation has been completed.
When switching from transmit mode to receive mode, first confirm that the transmit operation has
been completed, then start from initializat ion, clearing TE bit to 0 and setting RE bit to 1 . The
TEND flag can be used to check that the transmit operation has been completed.
Fixing Clock Output: When the GSM bit in SMR is set to 1, the clock output can be fixed with
bits CKE1 and CKE0 in SCR. At this time, the minimum clock pulse width can be made the
specified width.
Figure 15.8 shows the timing for fixing the clock output. In this example, GSM is set to 1, CKE1
is cleared to 0, and the CKE0 bit is controlled.
Section 15 Smart Card Interface
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SCK
Specified pulse width
SCR write
(CKE0 = 0) SCR write
(CKE0 = 1)
Specified pulse width
Figure 15.8 Timing for Fixing Clock Output
Interrupt Operation (Except Block Transfer Mode): There are three interrupt sources in smart
card interface mode: transmit-data-empty interrupt (TXI) requests, transmit/receive-error interrupt
(ERI) requests, and receive-data-full interrupt (RXI) requests. The transmit-end interrupt (TEI)
request is not used in this mode.
When the TEND flag in SSR is set to 1, a T XI interrupt request is generated.
When the RDRF flag in SSR i s set to 1 , an RXI interrupt request i s ge nerated.
When any of flags ORER, PER, and ERS in SSR is set to 1, an ERI interrupt request is generated.
The relationship between the operating states and interrupt sources is shown in table 15.8.
Note: For details of operation in block transfer mode, see section 14.4, SCI Interrupts.
Table 15.8 Smart Card Mode Operating States and Interrupt So urces
Operating State
Flag
Enable Bit Interrupt
Source DTC
Activation DMAC*
Activation
Transmit
Mode Normal
operation TEND TIE TXI Possible Possible
Error ERS RIE ERI Not possible Not possible
Receive
Mode Normal
operation RDRF RIE RXI Possible Possible
Error PER, ORER RIE ERI Not possible Not possible
Note: * The DMAC is not supported in the H8S/2321.
Section 15 Smart Card Interface
Rev.6.00 Sep. 27, 2007 Page 693 of 1268
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Data Transfer Operation by DMAC* or DTC: In smart card mode, as with the normal SCI,
transfer can be carried out using the DMAC* or DTC. In a transmit operation, the TDRE flag is
also set to 1 at the same time as the TEND fla g in SSR, a nd a TXI interrupt is generated. If the
TXI request is designated beforehand as a DMAC* or DTC activation source, the DMAC* or
DTC will be activated by the T XI request, and transfer of the transmit data will be carried out. The
TDRE and TEND flags are automatically cleared to 0 when data transfer is performed by the
DMAC* or DTC. In the event of an error, the SCI retransmits the same data automatically. The
TEND flag remains cleared to 0 during this time, and the DMAC* is not activated. Thus, the
number of bytes specified by the SCI and DMAC* are transmitted automatically even in
retransmission following an error. However, the ERS flag is not cleared automatically when an
error occurs, and so the RIE bit should be set to 1 beforehand so that an ERI request will be
generated in the event of an error, and the ERS flag will be cleared.
When performing transfer using the DMAC* or DTC, it is e ssential to set and enable the DMAC*
or DTC before carrying out SCI setting. For details of the D MAC* and DTC setting procedures,
see section 7, DMA Controller*, and section 8, Data T r ansfer Controller.
In a receive operation, an RXI interrupt request is generated when the RDRF flag in SSR is set to
1. If the RXI request is designated beforehand as a DMAC* or DTC activation source, the
DMAC* or DTC will be activated by the RXI request, and transfer of the receive data will b e
carried out. The RDRF flag is cleared to 0 automatically when data transfer is performed by the
DMAC* or DTC. If an error occurs, an error flag is set but the RDRF flag is not. Consequently,
the DMAC* or DTC is not activated, but instead, an ERI interrupt request is sent to the CPU.
Therefore, the error flag should be cleared.
Notes: For details of operation in block transfer mode, see section 14.4, SCI Interrupts.
* The DMAC is not supported in the H8S/2321.
Section 15 Smart Card Interface
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15.3.7 Operation in GSM Mode
Switching the Mode: When switching between smart card interface mode and software standby
mode, the following switching procedure should be followed in order to maintain the clock duty.
• When changing from smart card interface mode to software standby mode
[1] Set the data register (DR) and data direction register (DDR) corresponding to the SCK pin to
the value for the fixed output state in software standby mode.
[2] W r ite 0 to the TE bit and RE bit in the serial control register (SCR) to halt the transmit/receive
operation. At the same time, set the CKE1 bit to the value for the fixed output state i n soft ware
standby mode.
[3] Write 0 to the CKE0 bit in SCR to halt the clock.
[4] Wait for one serial clock period.
During this interval, clock output is fixed at the specified level, with the duty preserved.
[5] W r ite H'00 to SMR and SCMR.
[6] Make the transition to the software sta ndby state.
• When returning to smart card interface mode from software standby mode
[7] Exit the software standby state.
[8] Set the CKE1 bit in SCR to the value for the fixed output state (current SCK pin sta te) when
software standby mode is initiated.
[9] Set smart card interface mode and output the clock. Signal generation is started with the
normal duty.
[1] [2] [3] [4] [5] [7][6] [8] [9]
Software
standby
Normal operation Normal operation
Figure 15.9 Clock Halt and Restart Procedure
Section 15 Smart Card Interface
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Powering On: To secure the clock duty from power-on, the following switching procedure should
be followed.
[1] The initial state is port input and high impedance. Use a pu ll-up resistor or pull-down resistor
to fix the potential.
[2] Fix the S CK pin to the sp ecifi ed output level with the CKE1 bit in SCR.
[3] Set SMR and SCMR, and switch to smart card mode operation.
[4] Set the CKE0 bit in SCR to 1 to start clock output.
15.3.8 Operation in Block Transfer Mode
Operation in block transfer mo de is the same as in SCI asynchronous mode, except for the
following points. For details, see section 14.3.2, Operation in Asynchronous Mode.
Data Format: The data format is 8 bits with parity. There is no stop bit, but there is a guard time
of 2 or more bits (1 or more bits in reception).
Also, except during transmissio n (with start bit, data bits, and parity bit), the transmission pins go
to the high-impedance state, so the signal lines must be fixed high with a pull-up resistor.
Transmit/Receive Clock: Only an internal clock generated by the built-in baud rate generator can
be used as the transmit/receive clock. T he number of basic clock periods in a 1-bit transfer interval
can be set to 32, 64, 372, or 256 with bits BCP1 and BCP0. For details, see section 15.3.5, Clock.
ERS (FER) Flag: As with the normal smart card interface, the ERS flag indicates the error signal
status, but since error signal transmission and reception is not performed, this flag is always
cleared to 0.
Section 15 Smart Card Interface
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15.4 Usage Notes
The following points should be noted when using the SCI as a smart card interface.
Receive Data Sampling Timing and Receive Margin in Smart Card Interface Mode: In smart
card interface mode, the SCI operates on a base clock with a frequency of 32, 64, 372, or 256
times the transfer rate (determined by bits BCP1 and BCP0).
In reception, the SCI samples the falling edge of the start bit using the base clock, and performs
internal synchronization. Receive data is latched internally at the rising edge o f the 16th, 32nd,
186th, or 128th pulse of the base clock. Use of a 372-times clock is illustrated in figure 15.10.
Internal
base
clock
372 clocks
186 clocks
Receive
data (RxD)
Synchro-
nization
sampling
timing
D0 D1
Data
sampling
timing
185 371 0
371
185 0
0
Start bit
Figure 15.10 Receive Data Sampling Timing in Smart Card Mode
(When Using 372-Times Clock)
Section 15 Smart Card Interface
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Thus the receive margin in asynchronous mode is given by the following formula.
M =⎥ (0.5 – 1
2N
) – (L – 0.5) F – ⎥ D – 0.5⎥
N
(1 + F)⎥ × 100%
Where M: Receive margin (%)
N: Ratio of bit rate to clock (N = 32, 64, 372, 256)
D: Clock duty (D = 0 to 1.0)
L: Frame length (L = 10)
F: Absolute value of clock frequency deviation
Assuming values of F = 0, D = 0.5, and N=372 in the above formula, the receive margin formula
is as follows.
When D = 0.5 and F = 0,
M = (0.5 – 1/2 × 372) × 100%
= 49.866%
Section 15 Smart Card Interface
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Retransfer Operations (Except Block Transfer Mode): Retransfer operations are performed by
the SCI in receive mode and transmit mode as described below.
• Retransfer operation when SCI is in receive mode
Figure 15.11 illustrates the retransfer operatio n when the SCI is in receive mode.
[1] If an error is found when the received parity bit is checked, the PER bit in SSR is
automatically set to 1. If the RIE bit in SCR is enabled at thi s time, an ERI interrupt request is
generated. The PER bit in SSR should be kept cleared to 0 until the next parity bit is sampled.
[2] T he RDRF bit in SSR is not set for a frame in which an error has occurred.
[3] If no error is found when the received parity bit is checked, the PER bit in SSR is not set.
[4] If no error is found when the received parity bit is checked, the receive operation is judged to
have been completed normally, and the RDRF flag in SSR is automatically set to 1. If the RIE
bit in SCR is enabled at this time, an RXI interrupt request is generated.
If DMAC* or DTC data transfer by an RXI source is enabled, the contents of RDR can be read
automatically. When the RDR data is read by the DMAC* or DTC, the RDRF flag is
automatically cleared to 0.
[5] When a normal frame is received, the pin retains the high-impedance state at the timing for
error signal transmission.
Note: * The DMAC is not supported in the H8S/2321.
D0D1D2D3D4D5D6D7Dp DE DsD0D1D2D3D4D5D6D7Dp(DE)DsD0D1D2D3D4Ds
Transfer
frame n+1
Retransferred framenth transfer frame
RDRF
[1]
PER
[2]
[3]
[4]
Figure 15.11 Retransfer Operation in SCI Receive Mode
Section 15 Smart Card Interface
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• Retransfer operation when SCI is in transmit mode
Figure 15.12 illustrates the retransfer operatio n when the SCI is in transmit mode.
[6] If an error signal is sent back from the receiving end after transmission of one frame is
completed, the ERS bit in SS R is set to 1. If the RIE bit in SCR is enabled at t his ti me, an ERI
interrupt request is generated. The ERS bit in SSR should b e kept cleared to 0 until the next
parity bit is sampled.
[7] The TEND bit in SSR is not set for a frame for which an error signal indicating an abnormality
is received.
[8] If an error signal is not sent back from the receiving end, the ERS bit in SSR is not set.
[9] If an error signal is not sent back from the receiving end, transmission of one frame, including
a retransfer, is judged to have been completed, and the TEND bit in SSR is set to 1 . If the TI E
bit in SCR is enabled at this time, a TXI interrupt request is generated.
If data transfer by the DMAC* or DTC by means of the TXI source is enabled, the next data
can be written to TDR automatically. When data is written to TDR by the DMAC* or DTC,
the TDRE bit is automatically cleared to 0.
Note: * The DMAC is not supported in the H8S/2321.
D0D1D2D3D4D5D6D7Dp DE DsD0D1D2D3D4D5D6D7Dp (DE) DsD0D1D2D3D4Ds
Transfer
frame n+1
Retransferred framenth transfer frame
TDRE
TEND
[6]
FER/ERS
Transfer to TSR from TDR
[7] [9]
[8]
Transfer to TSR from TDR Transfer to TSR
from TDR
Figure 15.12 Retransfer Operation in SCI Transmit Mode
Section 15 Smart Card Interface
Rev.6.00 Sep. 27, 2007 Page 700 of 1268
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Section 16 A/D Converter (8 Analog Input Channel Version)
Rev.6.00 Sep. 27, 2007 Page 701 of 1268
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Section 16 A/D Converter
(8 Analog Input Channel Version)
16.1 Overview
The chip incorporates a successive-approximations type 10-bit A/D converter that allows up to
eight analog input channels to be selected.
16.1.1 Features
A/D converter features are listed below
• 10-bit resolution
• Eight input channels
• Settable analog conversion voltage range
⎯ Conversion of analog voltages with the reference voltage pin (Vref) as the analog reference
voltage
• High-speed conversion
⎯ Minimum conversion time: 6.7 µs per channel (at 20-MHz ope ratio n)
• Choice of single mode or scan mode
⎯ Single mode: Single-channel A/D conversion
⎯ Scan mode: Continuous A/ D conve rsion on 1 to 4 channels
• Four d ata regi st ers
⎯ Conversion results are held in a 16-bit data register for each channel
• Sample and hold function
• Three kinds of conversion start
⎯ Choice of software or timer conversion start trigger (TP U or 8-bit timer), or ADTRG pin
• A/D c onversio n end interrupt generation
⎯ A/D conversion end interrupt (ADI) request can be generated at the end of A/D conversion
⎯ The DMA controller (DMAC)* or data transfer controller (DTC) can be activated for data
transfer by an interrupt
Note: * The DMAC is not supported in the H8S/2321.
• Module stop mode can be set
⎯ As the initial settin g, A/D con verter op eration is halted. Register access is enabled by
exiting module stop mode.
Section 16 A/D Converter (8 Analog Input Channel Version)
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16.1.2 Block Diagram
Figure 16.1 shows a block diagram of the A/D converter.
Module data bus
Control circuit
Internal data bus
10-bit D/A
converter
Comparator
+
−
Sample-and-
hold circuit
ADI interrupt
signal
Bus interface
A
D
C
S
R
A
D
C
R
A
D
D
R
D
A
D
D
R
C
A
D
D
R
B
A
D
D
R
A
A
V
CC
V
ref
A
V
SS
A
N0
A
N1
A
N2
A
N3
A
N4
A
N5
A
N6
A
N7
ADTRG Conversion start
trigger from 8-bit
timer or TPU
Successive approximations
register
Multiplexer
Legend:
ADCR:
ADCSR:
ADDRA:
ADDRB:
ADDRC:
ADDRD:
A/D control register
A/D control/status register
A/D data register A
A/D data register B
A/D data register C
A/D data register D
Figure 16.1 Block Diagram of A/D Converter
Section 16 A/D Converter (8 Analog Input Channel Version)
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16.1.3 Pin Configuration
Table 16.1 summarizes the input pins used by the A/D converter.
The AVCC and AVSS pins are the power supply pins for the analog block in the A/D converter. The
Vref pin is the A/D conversion reference vol tage pin.
The eight analog input pins are divided into two groups: group 0 (AN0 to AN3), and group 1
(AN4 to AN7).
Table 16.1 A/D Converter Pins
Pin Name Symbol I/O Function
Analog power supply pin AVCC Input Analog block power supply
Analog ground pin AVSS Input Analog block ground and A/D conversion
reference voltage
Reference voltage pin Vref Input A/D conversion reference voltage
Analog input pin 0 AN0 Input Group 0 analog inputs
Analog input pin 1 AN1 Input
Analog input pin 2 AN2 Input
Analog input pin 3 AN3 Input
Analog input pin 4 AN4 Input Group 1 analog inputs
Analog input pin 5 AN5 Input
Analog input pin 6 AN6 Input
Analog input pin 7 AN7 Input
A/D external trigger input pin ADTRG Input External trigger input for starting A/D
conversion
Section 16 A/D Converter (8 Analog Input Channel Version)
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16.1.4 Register Configuration
Table 16.2 summarizes the registers of the A/D converter.
Table 16.2 A/D Converter Registers
Name Abbreviation R/W Initial Value Address*1
A/D data register AH ADDRAH R H'00 H'FF90
A/D data register AL ADDRAL R H'00 H'FF91
A/D data register BH ADDRBH R H'00 H'FF92
A/D data register BL ADDRBL R H'00 H'FF93
A/D data register CH ADDRCH R H'00 H'FF94
A/D data register CL ADDRCL R H'00 H'FF9 5
A/D data register DH ADDRDH R H'00 H'FF96
A/D data register DL ADDRDL R H'00 H'FF9 7
A/D control/status register ADCSR R/(W)*2 H'00 H'FF98
A/D control register ADCR R/W H'3F H'FF99
Module stop control register MSTPCR R/W H'3FFF H'FF3C
Notes: 1. Lower 16 bits of the address.
2. Bit 7 can only be written with 0 for flag clearing.
Section 16 A/D Converter (8 Analog Input Channel Version)
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16.2 Register Descriptions
16.2.1 A/D Data Registers A to D (ADDRA to ADDRD)
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 — — — — — —
Initial value : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
R/W : R R R R R R R R R R R R R R R R
There are four 16-bit read-only ADDR registers, ADDRA to ADDRD, used to store the results of
A/D c onversion.
The 10-bit data resulting from A/D conversion is transferred to the ADDR register for the selected
channel and stored there. The upper 8 bits of the converted data are transferred to the upper byte
(bits 15 to 8) of ADDR, and the lower 2 bits are transferred to the lower byte (bits 7 and 6) and
stored. Bits 5 to 0 are always read as 0.
The correspondence between the analog input channels and ADDR registers is shown in table
16.3.
The ADDR registers can always be read by the CPU. The upper byte can be read directly, but for
the lower byte, data transfer is performed via a temporary register (TEMP). For details, see section
16.3, Interface to Bus Master.
The ADDR registers are initialized to H'0000 by a reset, and in standby mode or module stop
mode.
Table 16.3 Ana log Input Channels and Correspo nding ADDR Registers
Analog Input Channel
Group 0 Group 1 A/D Data Register
AN0 AN4 ADDRA
AN1 AN5 ADDRB
AN2 AN6 ADDRC
AN3 AN7 ADDRD
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16.2.2 A/D Control/Status Register (ADCSR)
Bit : 7 6 5 4 3 2 1 0
ADF ADIE ADST SCAN CKS CH2 CH1 CH0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/(W)* R/W R/W R/W R/W R/W R/W R/W
Note: * Only 0 can be written to bit 7, to clear this flag.
ADCSR is an 8-bit readab le/writable register that controls A/D conversion operatio ns and shows
the status of the operation.
ADCSR is initialized to H'00 by a reset, and in standby mode or module stop mode.
Bit 7—A/D End Flag (ADF): Status flag that indicates the end of A/D conversion.
Bit 7
ADF
Description
0 [Clearing conditions] (Initial value)
• When 0 is written to the ADF flag after reading ADF = 1
• When the DMAC* or DTC is activated by an ADI interrupt and ADDR is read
1 [Setting conditions]
• Single mode: When A/D conversion ends
• Scan mode: When A/D conversio n ends on all specified cha nnels
Note: * The DMAC is not supported in the H8S/2321.
Bit 6—A/D Interrupt Enable (ADIE): Selects enabli ng or disab ling o f interrupt (ADI) r equests
at the end of A/D conversion.
Bit 6
ADIE
Description
0 A/D conversion end interrupt (ADI) request disabled (Initial value)
1 A/D conversion end interrupt (ADI) request enabled
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Bit 5—A/D Start (ADST): Selects starting or stopping of A/D conversion. Holds a value of 1
during A/D conversion.
The ADST bit can be set to 1 by software, a timer conversion start trigger, or the A/D external
trigger input pin (ADTRG).
Bit 5
ADST
Description
0 A/D conversion stopped (Initial value)
1 • Single mode: A/D conversion is started. Cleared to 0 automatically when
convers ion on the spe cifi ed channel ends
• Scan mode: A/D conversion is started. Conversion continues sequentially on the
selected channels until ADST is cleared to 0 by software, a reset, or
a transition to standby mode or module stop mode
Bit 4—Scan Mode (SCAN): Selects single mode or scan mode as the A/D conversion operating
mode. See section 16.4, Operation, for details of single mode and scan mode operation. Only set
the SCAN bit while conversion is stopped (ADST = 0).
Bit 4
SCAN
Description
0 Single mode (Initial value)
1 Scan mode
Bit 3—Clock Select (CKS): Used together with the CKS1 bit in ADCR to set the A/D
conversion time. Only change the conversion time while conversion is stopped (ADST = 0).
ADCR3
CKS1 Bit 3
CKS
Description
0 0 Conversion time = 530 states (max.)
1 Conversion time = 68 states (max.)
1 0 Conversion time = 266 states (max.) (Initial value)
1 Conversion time = 134 states (max.)
Bits 2 to 0—Channel Select 2 to 0 (CH2 to CH0): These bits are used together with the SCAN
bit to select the analog input channels.
Only set the input channel(s) while conversion is stopped (ADST = 0).
Section 16 A/D Converter (8 Analog Input Channel Version)
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Group
Selection
Channel Selection
Description
CH2 CH1 CH0 Single Mode (SCAN = 0) Scan Mode (SCAN = 1)
0 0 0 AN0 (Initial value) AN0
1 AN1 AN0, AN1
1 0 AN2 AN0 to AN2
1 AN3 AN0 to AN3
1 0 0 AN4 AN4
1 AN5 AN4, AN5
1 0 AN6 AN4 to AN6
1 AN7 AN4 to AN7
16.2.3 A/D Control Register (ADCR)
Bit : 7 6 5 4 3 2 1 0
TRGS1 TRGS0 — — CKS1 CH3 — —
Initial value : 0 0 1 1 1 1 1 1
R/W : R/W R/W — — R/W R/W — —
ADCR is an 8-bit readable/writable register that enables or disables external triggering of A/D
conve rsion operatio ns.
ADCR is initialized to H '3F by a reset, and in standby mode or module stop mode.
Bits 7 and 6—Timer Trigger Select 1 and 0 (TRGS1, TRGS0): These bits select enabling or
disabling of the start of A/D c onversion by a trigger signal. Only set bits TRGS1 and TRGS0
while conversion is stopped (ADST = 0).
Bit 7
TRGS1 Bit 6
TRGS0
Description
0 0 A/D conversion start by external trigger is disabled (Initial value)
1 A/D conversion start by external trigger (TPU) is enabled
1 0 A/D conversion start by external trigger (8-bit timer) is enabled
1 A/D conversion start by external trigger pin (ADTRG) is enabled
Section 16 A/D Converter (8 Analog Input Channel Version)
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Bits 5, 4, 1, and 0—Reserved: These bits cannot be modified and are always read as 1.
Bit 3—Clock Select 1 (CKS1): Used together with the CKS bit in ADCSR to set the A/D
conversion time. See the description of the CKS bit for details.
Bit 2—Channel Select 3 (CH3): Reserved. A value of 1 must be written to this bit.
16.2.4 Module Stop Control Register (MSTPCR)
MSTPCRH MSTPCRL
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
When the MSTP9 bit in MSTPCR is set to 1, A/D converter operation stops at the end of the bus
cycle and a transition is made to module stop mode. Registers cannot be read or written to in
module stop mode. For details, see section 21.5, Module Stop Mode.
MSTP CR is initialized to H'3FFF by a reset a nd in hardware stand by mode. It is not initialized in
software standby mode.
Bit 9—Module Stop (MSTP9): Specifies the A/D converter module stop mode.
Bit 9
MSTP9
Description
0 A/D converter module stop mode cleared
1 A/D converter module stop mode set (Initial value)
Section 16 A/D Converter (8 Analog Input Channel Version)
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16.3 Interface to Bus Master
ADDRA to ADDRD are 16-bit registers, and the da ta bus to the bus ma ster is 8 bits wide.
Therefore, in accesses by the bus master, the upper byte is accessed directly, but the lower byte is
accessed via a temporary register (TEMP).
A data read from ADDR is performed as follows. When the upper byte is read, the upper byte
value is transferred to the CPU and the lower b yte value is transferred to TE MP. Next, when the
lower byte is read, the TEMP contents are transferred to the CPU.
When reading ADDR, always read the upper byte before the lower byte. It is possible to read only
the upper byte, but if only the lower byte is read, incorrect data may be obtained.
Figure 16.2 shows the data flow for ADDR access.
Bus master
(H'AA)
ADDRnH
(H'AA) ADDRnL
(H'40)
Lower byte read
ADDRnH
(H'AA) ADDRnL
(H'40)
TEMP
(H'40)
TEMP
(H'40)
(n = A to D)
(n = A to D)
Module data bus
Module data bus
Bus interface
Upper byte read
Bus master
(H'40) Bus interface
Figure 16.2 ADDR Access Operation (Reading H'AA40)
Section 16 A/D Converter (8 Analog Input Channel Version)
Rev.6.00 Sep. 27, 2007 Page 711 of 1268
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16.4 Operation
The A/D converter operates by successive approximations with 10-bit resolution. It has two
operating modes: single mode and scan mode.
16.4.1 Single Mode (SCAN = 0)
Single mode is selected when A/D conversion is to be performed on a single channel only. A/D
conversion is started when the ADST bit is set to 1 by software or by external trigger input. T he
ADST bit remains set to 1 during A/D conversion, and is automatically cleared to 0 when
conve rsion ends.
On completion of conversion, the ADF flag is set to 1. If the ADIE bit is set to 1 at this time, an
ADI interrupt request is generated. The ADF flag is cleared by writing 0 to it after reading
ADCSR.
When the operating mode or analog input channel must be changed during analog conversion, to
prevent incorrect operation, first clear the ADST b it to 0 in ADCSR to halt A/D conversion. After
making the necessar y cha nge s, set the ADST bit to 1 to start A/D conversion again. The ADST bit
can be set at the same time as the operating mode o r input channel is changed.
Typical operations when channel 1 (AN1) is selected in single mode are described next. Figure
16.3 shows a timing diagram for this example.
[1] Single mode is selected (SCAN = 0), input channel AN1 is selected (CH2 = 0, CH1 = 0,
CH0 = 1), the A/D interrupt is enabled (ADIE = 1), and A/D conversion is started (ADST = 1).
[2] W hen A/D conversion is completed, the result is transferred to ADDRB. At the same time the
ADF flag is set to 1, the ADST bit is cleared to 0, and the A/D converter becomes idle.
[3] Since ADF = 1 and ADIE = 1, an ADI interrupt is requested.
[4] The A/D inte rrup t handli ng routine starts.
[5] The routine reads ADCSR, then writes 0 to the ADF fla g.
[6] T he routine reads and processes the conversion result (ADDRB).
[7] Execution of the A/D interrupt handling routine ends. After that, if the ADST bit is set to 1,
A/D conversion starts again and steps [2] to [7] are repeated.
Section 16 A/D Converter (8 Analog Input Channel Version)
Rev.6.00 Sep. 27, 2007 Page 712 of 1268
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ADIE
ADST
ADF
State of
channel 0
(AN0)
A/D
conversion
starts
2
1
ADDRA
ADDRB
ADDRC
ADDRD
State of
channel 1
(AN1)
State of
channel 2
(AN2)
State of
channel 3
(AN3)
Note:
*
Vertical arrows ( ) indicate instructions executed by software.
Set
*
Set
*
Clear
*
Clear
*
A/D conversion result 1
A/D conversion
A/D conversion result 2
Read conversion result
Read conversion result
Idle
Idle
Idle
Idle
Idle Idle
A/D conversion
Set
*
Figure 16.3 Example of A/D Converter Operation (Single Mode, Channel 1 Selected)
Section 16 A/D Converter (8 Analog Input Channel Version)
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16.4.2 Scan Mode (SCAN = 1)
Scan mode is useful for monitoring analog inputs in a group of one or more channels. When the
ADST bit is set to 1 by software, or by timer or external trigger input, A/D conversion starts on the
first channel in the group (AN0). When two or more channels are selected, after conversion of the
first channel ends, conversion of the second channel (AN1) starts immediately. A/D conversion
continues cyclically on the selected channels until the ADST bit is cleared to 0. The conversion
results are transferred for storage into the ADDR registers corresponding to the channels.
When the operating mode or analog input channel must be changed during analog conversion, to
prevent incorrect operation, first clear the ADST b it to 0 in ADCSR to halt A/D conversion. After
making the necessar y cha nge s, set the ADST bit to 1 to start A/D conversion again. The ADST bit
can be set at the same time as the operating mode o r input channel is changed.
Typical operations when three channels (AN0 to AN2) are selected in scan mode are described
next. Figure 16.4 shows a timing diagram for this example.
[1] Scan mode is selected (SCAN = 1), scan group 0 is selected (CH2 = 0), analog input channels
AN0 to AN2 are selected (CH1 = 1, CH0 = 0), and A/D conversion is started (ADST = 1)
[2] W hen A/D conversion of the first channel (AN0) is completed, the result is transferred to
ADDRA. Next, conversion of the second channel (AN1) starts automatically.
[3] Conversion proceeds in the same way through the third channel (AN2).
[4] When conversion of all the selected channels (AN0 to AN2) is co mpleted, the ADF flag is set
to 1 and conversion of the first channel (AN0) starts again. If the ADIE bit is set to 1 at this
time, an ADI interrupt is requested after A/D conversion ends.
[5] Steps [2] to [4] are repeated as long as the ADST bit remains set to 1. When the ADST bit is
cleared to 0, A/D conversion stops. After that, if the ADST bit is set to 1, A/D co nver sion
starts again from the first channel ( AN0).
Section 16 A/D Converter (8 Analog Input Channel Version)
Rev.6.00 Sep. 27, 2007 Page 714 of 1268
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ADST
ADF
ADDRA
ADDRB
ADDRC
ADDRD
State of
channel 0
(AN0)
State of
channel 1
(AN1)
State of
channel 2
(AN2)
State of
channel 3
(AN3)
Set*
1
Clear*
1
Idle
Notes: 1. Vertical arrows ( ) indicate instructions executed by software.
2. Data currently being converted is ignored.
Clear*
1
Idle
Idle
A/D conversion time
Idle
Continuous A/D conversion
A/D conversion 1
Idle Idle
Idle
Idle
Idle
Transfer
*
2
A/D conversion 3
A/D conversion 2 A/D conversion 5
A/D conversion 4
A/D conversion result 1
A/D conversion result 2
A/D conversion result 3
A/D conversion result 4
Figure 16.4 Example of A/D Converter Operation
(Scan Mode, Channels AN0 to AN2 Selected)
Section 16 A/D Converter (8 Analog Input Channel Version)
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16.4.3 Input Sampling and A/D Conversion Time
The A/D converter has a built-in sample-and-hold circuit. The A/D converter samples the analog
input at a time tD after the ADST bit is set to 1, then starts c onversion. Figure 16.5 shows the A/D
conversion timing. Table 16.4 indicates the A/D conversion time.
As indicated in figure 16.5, the A/D conversion time include s tD and the input sampling time. The
length of tD varies depending on the timing of the write access to ADCSR. The total conversion
time therefore varies within the ranges indicated in table 16.4.
In scan mode, the values given in table 16.4 apply to the first conversion time. In the second and
subseque nt conversions the c onversion time is as shown in table 16.5.
(1)
(2)
t
D
t
SPL
t
CONV
φ
Input sampling
timing
A
DF
A
ddress bus
Write signal
Legend:
(1): ADCSR write cycle
(2): ADCSR address
t
D
: A/D conversion start delay
t
SPL
: Input sampling time
t
CONV
: A/D conversion time
Figure 16.5 A/D Conversion Timing
Section 16 A/D Converter (8 Analog Input Channel Version)
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Table 16.4 A/D Conversion Ti me (Sing le Mode)
CKS1 = 0 CKS1 = 1
CKS = 0 CKS = 1 CKS = 0 CKS = 1
Item Symbol Min Typ Max Min Typ Max Min Typ Max Min Typ Max
A/D conversion
start delay tD 18 — 33 4 — 5 10 — 17 6 — 9
Input sampling
time tSPL — 127 — — 15 — — 63 — — 31 —
A/D conversion
time tCONV 515 — 530 67 — 68 259 — 266 131 — 134
Note: Values in the table are the number of states.
Table 16.5 A/D Conversion Ti me (Sca n Mode)
CKS1 CKS Conversion Time (States)
0 0 512 (Fixed)
1 64 (Fixed)
1 0 256 (Fixed)
1 128 (Fixed)
16.4 .4 Ext ernal Trig ger Input Ti ming
A/D c onversion can be externally triggere d. When the TRGS1 and TRGS0 bits are set to B'11 in
ADCR, external trigger input is enabled at the ADTRG pin. A falling edge at the ADTRG pin sets
the ADST bit to 1 in ADCSR, starting A/D conversion. Other o perations, in both single and scan
modes, are the same as when the ADST bit has been set to 1 by software. Figure 16.6 shows the
timing.
Section 16 A/D Converter (8 Analog Input Channel Version)
Rev.6.00 Sep. 27, 2007 Page 717 of 1268
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φ
ADTRG
Internal trigger signal
A
DST
A/D conversion
Figure 16.6 External Trig ger Input Ti ming
16.5 Interrupts
The A/D converter generates an A/D conversion end interrupt (ADI) at the end of A/D conversion.
ADI interrupt requests can be enabled or disabled by means of the ADIE bit in ADCSR.
T he DTC or DMAC* can be activated by an ADI interrupt. Having the converted data read by the
DTC or DMAC* in response to an ADI interrupt enables continuous conversion to be achieved
without imposing a load on software.
The A/D converter interrupt source is shown in table 16.6.
Note: * The DMAC is not supported in the H8S/2321.
Table 16.6 A/D Converter Interrupt Source
Interrupt Source Description DTC Activation DMAC Activation*
ADI Interrupt due to end of conversion Possible Possible
Note: * The DMAC is not supported in the H8S/2321.
Section 16 A/D Converter (8 Analog Input Channel Version)
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16.6 Usage Notes
The following points should be noted when using the A/D converter.
Setting Range of Analog Power Supply and Other Pins
1. Analog input voltage range
The voltage applied to analog input pins ANn during A/D conversion should be in the range
AVSS ≤ AN n ≤ Vref.
2. Relation between AVCC, AVSS and VCC, VSS
As the relationship between AVCC, AVSS and VCC, VSS, set AVSS = VSS. If the A/D converter is
not used, the AVCC and AVSS pins must not be left open.
3. Vref input range
The analog reference voltage input at the Vref pin should be set in the range Vref ≤ AVCC. The
Vref pin should be set as Vref = VCC when the A/D converter is not used. Do not leave the Vref
pin open.
If conditions 1, 2, and 3 above are not met, the reliability of the device may be adversely affected.
Notes on Board Design: In board design, digital circuitry and analog circuitry should be as
mutually isolated as possible, and layout in which digital circuit si gnal lines and analog cir c uit
signal lines cross or are in close proximity should be avoided as far as possible. Failure to do so
may result in incorrect operation of the analog circuitry due to inductance, adversely affecting A/D
conve rsion values.
Also, digital circuitry must be isolated from the analog input signals (AN0 to AN7), analog
reference power supply (Vref), and analog power supply (AVCC) by the analog ground (AVSS).
Also, the analo g gro und (AVSS) should be connected at one point to a stable digital ground (VSS)
on the board.
Notes on Noise Countermeasures: A protection circuit connected to prevent damage due to an
abnormal voltage such as an excessive surge at the analog input pins (AN0 to AN7) and analog
reference power supply (Vref) should be connected between AVCC and AVSS as shown in figure
16.7.
Also, the bypass capacitors connected to AVCC and Vref and the filter capacitor connected to AN0
to AN7 must be connected to AVSS.
If a filter capacitor is connected as shown in figure 16.7, the input currents at the analog input pins
(AN0 to AN7) are averaged, and so an error may arise. Also, when A/D conversion is performed
Section 16 A/D Converter (8 Analog Input Channel Version)
Rev.6.00 Sep. 27, 2007 Page 719 of 1268
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frequently, as in scan mode, if the current charged and discharged by the capacitance of the
sample-and-hold circuit in the A/D converter exceeds the current input via the input impedance
(Rin), an error will arise in the analog input pin voltage. Careful consideration is therefore required
when deciding the circuit constants.
AVCC
*1*1
Vref
AN0 to AN7
AVSS
Notes: Values are reference values.
1.
2. Rin: Input impedance
Rin*2100 Ω
0.1 μF
0.01 μF10 μF
Figure 16.7 Example of Analog Input P r otection Circuit
A/D Conversion Precision Definitions: The chip’s A/D conversion precision definitions are
given below.
• Resolution
The number of A/D converter digital output codes
• Offset error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from the minimum voltage value B'0000000000 to
B'0000000001. (See figure 16.9.)
Section 16 A/D Converter (8 Analog Input Channel Version)
Rev.6.00 Sep. 27, 2007 Page 720 of 1268
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• Full-scale error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from B'1111111110 to B'1111111111. (See figure 16.9.)
• Quantization error
The devi atio n i nher ent i n the A/D converter , given by 1/2 LSB. (Se e figure 16.8.)
• Nonlinearity error
The error with respect to the ideal A/D conversion characteristic between the zero voltage and
the full-scale voltage. Does not include the offset error, full-scale error, or quantization error.
• Absolute p recision
The deviation between the digital value and the analog input value. Includes the offset error,
full-scale error, quantization error, and nonlinearity error.
111
110
101
100
011
010
001
000 FS
Quantization error
Digital output
Ideal A/D conversion
characteristic
Analog
input voltage
1
1024 2
1024 1022
1024 1023
1024
Figure 16.8 A/D Conversion Precision Definitions (1)
Section 16 A/D Converter (8 Analog Input Channel Version)
Rev.6.00 Sep. 27, 2007 Page 721 of 1268
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FS
Offset error
Nonlinearity
error
Actual A/D conversion
characteristic
Analog
input voltage
Digital output
Ideal A/D conversion
characteristic
Full-scale error
Figure 16.9 A/D Conversion Precision Definitions (2)
Permissible Signal Source Impedance: The chip’s analog input is designed so that conversion
precision is guaranteed for an input signal for which the signal source impedance is 5 kΩ or less.
This specification is pr ovided to enable the A/D converter's sample-and-hold circuit input
capacitance to be charged within the sampling time; if the sensor output impedance exceeds 5 kΩ,
charging may be insufficient and it may not be possible to guarantee the A/D conversion
precision.
If a large capacitance is provided externally, the input load will essentially comprise only the
internal input resistance of 10 kΩ, and the signal source impedance is ignored. However, since a
low-pass filter effect is obtained in this case, it may not be possible to follow an analog signal with
a large differential coefficient (e.g., 5 mV/µs or greater).
When converting a high-speed analog signal, a low-impedance buffer should be inserted.
Section 16 A/D Converter (8 Analog Input Channel Version)
Rev.6.00 Sep. 27, 2007 Page 722 of 1268
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Influences on Absolute Precision: Adding capacitance results in coupling with GND, and
therefore noise in GND may adversely affect absolute precision. Be sure to make the connection to
an electrically stable GND such as AVSS.
Care is also required to insure that filter circuits do not communicate with digital signal s on the
mounting board, so acting as antennas.
A/D converter
equivalent circuit
Chip
20 pFC
in
= 15 pF
10 kΩ
Low-pass
filter C
to 0.1 µF
Sensor output
impedance
Max. 5 kΩ
Sensor input
Note: Values are reference values.
Figure 16.10 Example of Analog Input Circuit
Section 17 D/A Converter
Rev.6.00 Sep. 27, 2007 Page 723 of 1268
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Section 17 D/A Converter
17.1 Overview
The chip includes an 8-bit resolution D/A converter with from two analog signal output channels.
17.1.1 Features
D/A converter features are listed below.
• 8-bit resolutio n
• Two output channels
• Maximum conversion time of 10 µs (with 20 pF load)
• Output voltage of 0 V to Vref
• D/A output hold function in software standby mode
• Module stop mode can be set
⎯ As the initial settin g, D/ A converter ope ratio n is halted. Register access is enabled by
exiting module stop mode.
Section 17 D/A Converter
Rev.6.00 Sep. 27, 2007 Page 724 of 1268
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17.1.2 Block Diagram
Figure 17.1 shows a block diagram of the D/A converter.
Module data bus Internal data bus
V
ref
A
V
CC
DA1
DA0
A
V
SS
8-bit
D/A
converter
Control circuit
DADR0
Bus interface
DADR1
DACR
Legend:
DACR: D/A control register
DADR0, 1: D/A data registers 0, 1
Figure 17.1 Block Diagram of D/A Converter
Section 17 D/A Converter
Rev.6.00 Sep. 27, 2007 Page 725 of 1268
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17.1.3 Pin Configuration
Table 17.1 summarizes the input and output pins of the D/A converter.
Table 17.1 Pin Configuration
Pin Name Symbol I/O Function
Analog power pin AVCC Input Analog power source
Analog ground pin AVSS Input Analog ground and reference voltage
Analog output pin 0 DA0 Output Channel 0 analog output
Analog output pin 1 DA1 Output Channel 1 analog output
Reference voltage pin Vref Input Analog reference voltage
17.1.4 Register Configuration
Table 17.2 summarizes the registers of the D/A converter.
Table 17.2 D/A Converter Registers
Channels Name Abbreviation R/W Initial Value Address*
0, 1 D/A data register 0 DADR0 R/W H'00 H'FFA4
D/A data register 1 DADR1 R/W H'00 H'FFA5
D/A control register 01 DACR01 R/W H'1F H'FFA6
Common Module stop control register MSTPCR R/W H'3FFF H'FF3C
Note: * Lower 16 bits of the address.
Section 17 D/A Converter
Rev.6.00 Sep. 27, 2007 Page 726 of 1268
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17.2 Register Descriptions
17.2.1 D/A Data Registers 0, 1 (DADR0, DADR1)
Bit : 7 6 5 4 3 2 1 0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
DADR0, DADR1 are 8-bit readable/writable registers that store data for conversion.
Whenever output is enabled, the values in DADR0 and DADR1 are converted and output from the
analog output pins.
DADR0 and DADR1 are each initialized to H'00 by a reset and in hardware standby mode.
17.2.2 D/A Control Registers 01 (DACR01 )
Bit : 7 6 5 4 3 2 1 0
DAOE1 DAOE0 DAE — — — — —
Initial value : 0 0 0 1 1 1 1 1
R/W : R/W R/W R/W — — — — —
DACR01 is a 8-bit readable/writable register that controls the operatio n of the D/A converter.
DACR01 is initialized to H'1F by a reset and in hardware standby mode.
Bit 7—D/A Output Enable 1 (DAOE1): Controls D/A conversion and analog output.
Bit 7
DAOE1
Description
0 Analog output DA1 is disabled (Initial value)
1 Channel 1 D/A conversion is enabled; analog output DA1 is enabled
Section 17 D/A Converter
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Bit 6—D/A Output Enable 0 (DAOE0): Controls D/A conversion and analog output.
Bit 6
DAOE0
Description
0 Analog output DA0 is disabled (Initial value)
1 Channel 0 D/A conversion is enabled; analog output DA0 is enabled
Bit 5—D/A Enable (DAE): Used to gether with the D AOE 0 and DAOE1 bits to control D/A
conversion. When the DAE bit is cleared to 0, channel 0 and 1 D/A conversions are controlled
independently. When the DAE bit is set to 1, channel 0 and 1 D/A conversions are controlled
together.
Output of conversion results is always controlled independently by the DAOE0 and DAOE1 bits.
Bit 7
DAOE1 Bit 6
DAOE0 Bit 5
DAE
Description
0 0 * Channel 0 and 1 D/A conversions disabled
1 0 Channel 0 D/A conversion enabled
Channel 1 D/A conversion disabled
1 Channel 0 and 1 D/A conversions enabled
1 0 0 Channel 0 D/A conversion disabled
Channel 1 D/A conversion enabled
1 Channel 0 and 1 D/A conversions enabled
1 * Channel 0 and 1 D/A conversions enabled
*: Don’t care
If the chip enters software standby mode when D/A conversion is enabled, the D/A output is held
and the analog power current is the same as during D/A conversion. When it is necessary to reduce
the analog power current in software standby mode, clear both the DAOE0 and DAOE1 bits to 0
to disable D/A output.
Bits 4 to 0—Reserved: These bits cannot be modified and are always read as 1.
Section 17 D/A Converter
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17.2.3 Module Stop Control Register (MSTPCR)
MSTPCRH MSTPCRL
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
When the MSTP1 0 bit in MSTPCR is set to 1, D/A converter operation stops at the end of the bus
cycle and a transition is made to module stop mode. Registers cannot be read or written to in
module stop mode. For details, see section 21.5, Module Stop Mode.
MSTP CR is initialized to H'3FFF by a reset a nd in hardware stand by mode. It is not initialized in
software standby mode.
Bit 10—Module Stop (MSTP10): Specifies the D/A converter channel 0 and 1module stop
mode.
Bit 10
MSTP10
Description
0 D/A converter module stop mode cleared
1 D/A converter module stop mode set (Initial value)
17.3 Operation
The D/A converter includes D/A conversion circuits for two channels, each of which can operate
independently.
D/A conversion is performed continuously while enabled by DACR. If either DADR0 or DADR1
is written to, the new data is immediately converted. The conversion result is output b y setting the
corresponding DAOE0 or DAOE1 bit to 1.
The operation example described in this section concerns D/A conversion on channel 0. Figure
17.2 shows the timing of this operation.
[1] W r ite the conversion data to DADR0.
Section 17 D/A Converter
Rev.6.00 Sep. 27, 2007 Page 729 of 1268
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[2] Set the D AOE0 bit in DACR01 to 1. D/A conversion is started and the DA0 pin becomes an
output pin. The convers i on re sult is output after the conversion time has elap sed. The output
value is expressed by the following formula:
DADR contents
256 × Vre
f
The conversion results are output continuously until DADR0 is written to again or the DAOE0
bit is cleared to 0.
[3] If DADR0 is written to again, the new data is immediately converted. The new conversion
result is output after the conversion time has elapsed .
[4] If the DAOE0 bit is cleared to 0, the DA0 pin becomes an input pin.
Conversion data 1
Conversion
result 1
High-impedance state
t
DCONV
DADR0
write cycle
DA0
DAOE0
DADR0
A
ddress
φ
DACR01
write cycle
Conversion data 2
Conversion
result 2
t
DCONV
Legend:
t
DCONV
: D/A conversion time
DADR0
write cycle DACR01
write cycle
Figure 17.2 Example of D/A Converter Operation
Section 17 D/A Converter
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Section 18 RAM
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Section 18 RAM
18.1 Overview
The H8S/2329B and H8S/2324S have 32 kbytes of on-chip high-speed static RAM, the H8S/2328
(H8S/2328B in flash memory version), H8S/2327, H8S/2326, H8S/2323, and H8S/2322R have 8
kbytes, and the H8S/2321 and H8S/2320 have 4 kbytes. The RAM is connected to the CPU by a
16-bit data bus, enabling one-state access by the CPU to both byte data and word data. This makes
it possible to perform fast word data transfer.
The on-chip RAM can be enabled or disabled by means of the RAM enable bit (RAME) in the
system control register (SYSCR).
18.1.1 Block Diagram
Figure 18.1 shows a block diagram of 32 kbytes of on-chip RAM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'FF7C00
H'FF7C02
H'FF7C04
H'FFFBFE
H'FF7C01
H'FF7C03
H'FF7C05
H'FFFBFF
Figure 18.1 Block Diagram of RAM (32 kbytes)
Section 18 RAM
Rev.6.00 Sep. 27, 2007 Page 732 of 1268
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18.1.2 Register Configuration
The on-chip RAM is controlle d by SYSCR. Ta ble 18.1 shows the address and initial value of
SYSCR.
Table 18.1 RAM Register
Name Abbreviation R/W Initial Value Address*
System control regi ster SYSCR R/W H'01 H'FF39
Note: * Lower 16 bits of the address.
18.2 Register Descriptions
18.2.1 System Control Register (SYSCR)
Bit : 7 6 5 4 3 2 1 0
— — INTM1 INTM0 NMIEG LWROD IRQPAS RAME
Initial value : 0 0 0 0 0 0 0 1
R/W : R/W — R/W R/W R/W R/W R/W R/W
The on-chip RAM is enabled or disabled by the RAME bit in SYSCR. For details of other bits in
SYSCR, see section 5.2.1, System Control Register (SYSCR).
Bit 0—RAM Enable (RAME): Enables o r disables the on-chip RAM. The RAME bit is
initialized when the reset state is released . It is not initialized in software standby mode.
Bit 0
RAME
Description
0 On-chip RAM is disabled
1 On-chip RAM is enabled (Initial value)
Section 18 RAM
Rev.6.00 Sep. 27, 2007 Page 733 of 1268
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18.3 Operation
When the RAME bit is set to 1, accesses to addresses H'FFDC00 to H'FFFBFF are directed to the
on-chip RAM. When the RAME bit is cleared to 0, the off-chip address space is accessed.
Since the on-chip RAM is connected to the CP U by an internal 16-bit data bus, it can be written to
and read in byte or word units. Each type of access can be performed in one state.
Even addresses use the upper 8 bits, and odd addresses use the lower 8 bits. Word data must start
at an even address.
Note: The amount of on-chip RAM differs depending on the product. Refer to section 3.5,
Memory Map in Each Operation Mode, for details.
18.4 Usage Note
DTC register information can be located in addresses H'FFF800 to H'FFFBFF. When the DTC is
used, the RAME bit must not be cleared to 0.
Section 18 RAM
Rev.6.00 Sep. 27, 2007 Page 734 of 1268
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Section 19 ROM
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Section 19 ROM
19.1 Overview
The Series has 512, 384, or 256 kbytes of on-chip flash memory, or 256, 128, or 32 kbytes of on-
chip mask ROM. The ROM is connected to the bus master via a 16-bit data bus, enabling both
byte and word data to be accessed in one state. Instruction fetching is thus speeded up, and
processing speed increased.
The on-chip ROM is enabled and disabled by means of the mode pins (MD2 to MD0) and the
EAE bit in BCRL.
The flash memory version of the chip can be erased and programmed with a PROM programmer,
as well as on-board.
19.1.1 Block Diagram
Figure 19.1 shows a block diagram of 256 kbytes of on-chip ROM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'000000
H'000002
H'03FFFE
H'000001
H'000003
H'03FFFF
Figure 19.1 Block Diagram of ROM (256 kbytes)
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 736 of 1268
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19.1.2 Register Configuration
The operating mode of the chip is controlled by the mode pins and the BCRL register. The ROM-
related registers are shown in table 19.1.
Table 19.1 ROM Registers
Register Name Abbreviation R/W Initial Value Address*
Mode control register MDCR R/W Undefined H'FF3B
Bus controller register BCRL R/W Undefined H'FED5
Note: * Lower 16 bits of the address.
19.2 Register Descriptions
19.2.1 Mode Control Register (MDCR)
Bit : 7 6 5 4 3 2 1 0
— — — — — MDS2 MDS1 MDS0
Initial value : 1 0 0 0 0 —* —
* —
*
R/W : — — — — — R R R
Note: * Determined by pins MD2 to MD0.
MDCR is an 8-bit read-only register used to monitor the current operating mode of the chip.
Bit 7—Reserved: This bit cannot be modified and is always read as 1.
Bits 6 to 3—Reserved: These bits cannot be modified and are always read as 0.
Bits 2 to 0—Mode Select 2 to 0 (MDS2 to MDS0): These bits indicate the input levels at pins
MD2 to MD0 (the current operating mode). Bits MDS2 to MDS0 correspond to pins MD2 to
MD0. MDS2 to MDS0 are read-only bits, and cannot be modified. The mode pin (MD2 to MD0)
input levels are latched into these bits when MDCR is read. These latches are canceled by a reset.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 737 of 1268
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19.2.2 Bus Control Register L (BCRL)
Bit : 7 6 5 4 3 2 1 0
BRLE BREQOE EAE — DDS — WDBE WAITE
Initial value : 0 0 1 1 1 1 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
Enabling or disabling of part of the on-chip ROM area in the chip can be selected by means of the
EAE bit in BCRL. For details of the other bits in BCRL, see section 6.2.5, Bus Control Register L
(BCRL).
Bit 5—External Address Enable (EAE): Selects whether addresses H'010000 to H'03FFFF*2 are
to be internal addresses or external addresses.
Description
Bit 5 H8S/2329B, H8S/2328*3,
H8S/2326
H8S/2327
H8S/2323
0 On-chip ROM Addresses H'010000 to
H'01FFFF are on-chip
ROM or address H'020000
to H'03FFFF are reserved
area*1
Reserved area*1
1 Addresses H'010000 to H'03FFFF*2 are external addresses in external expanded mode
or reserved area*1 in single-chip mode (Initial value)
Notes: 1. Do not access a reserved area.
2. Addresses H'010000 to H'05FFFF in the H8S/2329B.
Addresses H'010000 to H'07FFFF in the H8S/2326.
3. H8S/2328B in flash memory version.
19.3 Operation
The on-chip ROM is connected to the CPU by a 16-bit data bus, and both byte and word data can
be accessed in one state. Even addresses are connected to the upper 8 bits, and odd addresses to
the lower 8 bits. Word data must start at an even address.
The on-chip ROM is enabled and disabled by setting the mode pins (MD2 to MD0) and the EAE
bit in BCRL. These settings are shown in tables 19.2 and 19.3.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 738 of 1268
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Table 19.2 Operating Modes and ROM (H8S/2328B F-ZTAT, H8S/2326 F-ZTAT)
Mode Pins BCRL
Mode Operating Mode FWE MD2 MD1 MD0 EAE On-Chip ROM
1 — 0 0 0 1 — —
2 1 0
3 1
4 Advanced expanded mode
with on-chip ROM disabled 1 0 0 — Disabled
5 Advanced expanded mode
with on-chip ROM disabled 1
6 Advanced expanded mode
with on-chip ROM enabled 1 0 0
Enabled
(256 kbytes)*1*5
1
Enabled
(64 kbytes)
7 Advanced single-chip mode 1 0
Enabled
(256 kbytes) *1*5
1
Enabled
(64 kbytes)
8 — 1 0 0 0 — —
9 1
10 1 0 0
Enabled
(256 kbytes) *2*5
Boot mode (advanced
expanded mode with on-chip
ROM enabled)*3 1
Enabled
(64 kbytes)
11 Boot mode (advanced
single-chip mode) *4 1 0
Enabled
(256 kbytes) *2*5
1
Enabled
(64 kbytes)
12 — 1 0 0 — —
13 1
14 1 0 0
Enabled
(256 kbytes) *1*5
User program mode
(advanced expanded mode
with on-chip ROM enabled)*3 1
Enabled
(64 kbytes)
15 1 0
Enabled
(256 kbytes) *1*5
User program mode
(advanced single-chip
mode)*4 1
Enabled
(64 kbytes)
Notes: 1. Note that in modes 6, 7, 14, and 15, the on-chip ROM that can be used after a reset is
the 64-kbyte area from H'000000 to H'00FFFF.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 739 of 1268
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2. Note that in the mode 10 and mode 11 boot modes, the on-chip ROM that can be used
immediately after all flash memory is erased by the boot program is the 64-kbyte area
from H'000000 to H'00FFFF.
3. Apart from the fact that flash memory can be erased and programmed, operation is the
same as in advanced expanded mode with on-chip ROM enabled.
4. Apart from the fact that flash memory can be erased and programmed, operation is the
same as in advanced sin gle-chip mode .
5. The capacity of on-chip ROM in the H8S/2328B F-ZTAT is 256 kbytes.
The capacity of on-chip ROM in the H8S/2326 F-ZTAT is 512 kbytes.
Table 19.3 Operating Modes and ROM (H8S/2329B F-ZTAT and Mask ROM Version)
Mode Pins BCRL
Mode Operating Mode MD2 MD1 MD0 EAE On-Chip ROM
1 — 0 0 1 — —
2*3 1 0
3*3 1
4 Advanced expanded mode
with on-chip ROM disabled 1 0 0 — Disabled
5 Advanced expanded mode
with on-chip ROM disabled 1
6 1 0 0 Enabled (256 kbytes)*1*2
Advanced expanded mode
with on-chip ROM enabled 1 Enabled (64 kbytes)
7 Advanced single-chip mode 1 0 Enabled (256 kbytes)*1*2
1 Enabled (64 kbytes)
Notes: 1. Note that in modes 6 and 7, the on-chip ROM that can be used after a reset is the 64-
kbyte area from H'000000 to H'00FFFF.
2. The amount of on-chip RAM differs depending on the product. Refer to section 3.5,
Memory Map in Each Operation Mode, for details.
3. Boot mode in the H8S/2329B F-ZTAT.
See table 19.9, for information on H8S/2329B F-ZTAT user boot modes. See table
19.9, for information on H8S/2329B F-ZTAT user program modes.
Section 19 ROM
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19.4 Overview of Flash Memory (H8S/2329B F-ZTAT)
19.4.1 Features
The H8S/2329B F-ZTAT has 384 kbytes of on-chip flash memory. The features of the flash
memory are summarized below.
• Four flash memory operating modes
⎯ Program mode
⎯ Erase mode
⎯ Program-verify mode
⎯ Erase-verify mode
• Programming/erase methods
The flash memory is programmed 128 bytes at a time. Erasing is performed by block erase (in
single-block units). To erase the entire flash memory, the individual blocks must be erased
sequentially. Block erasing can be performed as required on 4-kbyte, 32-kbyte, and 64-kbyte
blocks.
• Progra mming/e ras e ti mes
The flash memory programming time is 10.0 ms (typ.) for simultaneous 128-byte
programming, equivalent to 78 µs (typ.) per byte, and the erase time is 50 ms (typ.).
• Reprogramming capability
The flash memory can be reprogrammed minimum 100 times.
• On-board programming modes
There are two modes in which flash memory can be programmed/erased/verified on-board:
⎯ Boot mode
⎯ User program mode
• Automatic bit rate adjustment
With data transfer in boot mode, the bit rate of the chip can be automatically adjusted to match
the transfer bit rate of the host.
• Flash memory emulation by RAM
Part of the RAM area can be overlapped onto flash memory, to emulate flash memory updates
in real time.
• Protect modes
There are three protect modes, hardware, software, and error protect, which allow protected
status to be designated for flash memory program/erase/verify operations.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 741 of 1268
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• PROM mode
Flash memory can be programmed/erased in PROM mode, using a PROM programmer, as
well as in on-board programming mode.
19.4.2 Overview
Block Diagram
Module bus
Bus interface/controller
Flash memory
(384 kbytes)
Operating
mode
EBR1
Internal address bus
Internal data bus (16 bits)
Mode pins
EBR2
SYSCR2
FLMCR2
FLMCR1
RAMER
Legend:
FLMCR1: Flash memory control register 1
FLMCR2: Flash memory control register 2
EBR1: Erase block register 1
EBR2: Erase block register 2
RAMER: RAM emulation register
SYSCR2: System control register 2
Figure 19.2 Block Diagram of Flash Memory
Section 19 ROM
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19.4.3 Flash Memory Operating Modes
Mode Transitions: When the mode pins are set in the reset state and a reset-start is executed, the
chip enters one of the operating modes shown in figure 19.3. In user mode, flash memory can be
read but not programmed or erased.
Flash memory can be programmed and erased in boot mode, user program mode, and PROM
mode.
Boot mode
On-board programming mode
User
program mode
User mode
(on-chip ROM
enabled)
Reset state
PROM mode
RES = 0
SWE = 1 SWE = 0
*
Notes: Only make a transition between user mode and user program mode when the CPU is
not accessing the flash memory.
* MD0 = 0, MD1 = 0, MD2 = 0, P66 = 1, P65 = 0, P64 = 0
RES = 0
RES = 0
RES = 0
MD1 = 1,
MD2 = 1
MD1 = 1,
MD2 = 0
Figure 19.3 Flash Memory Mode Transitions
Section 19 ROM
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19.4.4 On-Board Programming Modes
• Boot mode
Flash memory
Chip
RAM
Host
Programming control
program
SCI
Application program
(old version)
New application
program
Flash memory
Chip
RAM
Host
SCI
Application program
(old version)
Boot program area
New application
program
Flash memory
Chip
RAM
Host
SCI
Flash memory
prewrite-erase
Boot program
New application
program
Flash memory
Chip
Program execution state
RAM
Host
SCI
New application
program
Boot program
Programming control
program
1. Initial state
The old program version or data remains written
in the flash memory. The user should prepare the
programming control program and new
application program beforehand in the host.
2. Programming control program transfer
When boot mode is entered, the boot program in
the chip (originally incorporated in the chip) is
started and the programming control program in
the host is transferred to RAM via SCI
communication. The boot program required for
flash memory erasing is automatically transferred
to the RAM boot program area.
3. Flash memory initialization
The erase program in the boot program area (in
RAM) is executed, and the flash memory is
initialized (to H'FF). In boot mode, entire flash
memory erasure is performed, without regard to
blocks.
4. Writing new application program
The programming control program transferred
from the host to RAM is executed, and the new
application program in the host is written into the
flash memory.
Programming control
program
Boot programBoot program
Boot program area Boot program area
Programming control
program
Figure 19.4 Boot Mode
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• User program mode
Flash memory
Chip
RAM
Host
Programming/
erase control program
SCI
Boot program
New application
program
Flash memory
Chip
RAM
Host
SCI
New application
program
Flash memory
Chip
RAM
Host
SCI
Flash memory
erase
Boot program
New application
program
Flash memory
Chip
Program execution state
RAM
Host
SCI
Boot program
Boot program
Application program
(old version)
New application
program
1. Initial state
(1) The program that will transfer the
programming/erase control program to on-chip
RAM should be written into the flash memory by
the user beforehand. (2) The programming/erase
control program should be prepared in the host
or in the flash memory.
2. Programming/erase control program transfer
Executes the transfer program in the flash
memory, and transfers the programming/erase
control program to RAM.
3. Flash memory initialization
The programming/erase program in RAM is
executed, and the flash memory is initialized (to
H'FF). Erasing can be performed in block units,
but not in byte units.
4. Writing new application program
Next, the new application program in the host is
written into the erased flash memory blocks. Do
not write to unerased blocks.
Programming/
erase control program
Programming/
erase control program
Programming/
erase control program
Application program
(old version)
Transfer program
Transfer program
Transfer program
Transfer program
Figure 19.5 User Program Mode (Example)
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19.4.5 Flash Memory Emulation in RAM
Reading Overlap RAM Data in User Mode and User Program Mode: Emulatio n should be
performed in user mode or user program mode. When the emulation block set in RAMER is
accessed while the emulation function is bei ng executed, data written in the overlap RAM is read.
Application program
Execution state
Flash memory
Emulation block
RAM
SCI
Overlap RAM
(emulation is performed
on data written in RAM)
Figure 19.6 Reading Overlap RAM Data in User Mode and User Program Mode
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Writing Overlap RAM Data in User Program Mode: When overlap RAM data is confirmed,
the RAMS bit is cleared, RAM overlap is released, and writes should actually be performed to the
flas h me mory.
When the programming control program is transferred to RAM, ensure that the transfer destination
and the overlap RAM do not overlap, as this will cause data in the overlap RAM to be rewritten.
Application program
Flash memory RAM
SCI
Overlap RAM
(programming data)
Programming data
Programming control
program
Execution state
Figure 19.7 Writing Overlap RAM Data in User Program Mode
19.4.6 Differences between Boot Mode and User Program Mode
Table 19.4 Differences between Boot Mode and User Program Mode
Boot Mode User Program Mode
Entire memor y era se Y es Yes
Block erase No Yes
Programming control program* Program/program-verify Erase/erase-verify/program/
program-verify/emulation
Note: * To be provided by the user, in accordance with the recommended algorithm.
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19.4.7 Block Configuration
The flash memory is divided into five 64-kbyte blocks, one 32-kbyte block, and eight 4-kbyte
blocks.
Address H'00000
A
ddress H'5FFFF
64 kbytes
64 kbytes
64 kbytes
64 kbytes
64 kbytes
32 kbytes
384 kbytes
4 kbytes × 8
Figure 19.8 Flash Memory Block Configuration
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19.4.8 Pin Configuration
The flash memory is controlled by means of the pins shown in table 19.5.
Table 19.5 Flash Memory Pins
Pin Name Abbreviation I/O Function
Reset RES Input Reset
Mode 2 MD2 Input Sets MCU operating mode
Mode 1 MD1 Input Sets MCU operating mode
Mode 0 MD0 Input Sets MCU operating mode
Port 64 P64 Input Sets MCU operating mode in PROM mode
Port 65 P65 Input Sets MCU operating mode in PROM mode
Port 66 P66 Input Sets MCU operating mode in PROM mode
Transmit data TxD1 Output Serial transm it data output
Receive data RxD1 Input Serial receive data input
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19.4.9 Register Configuration
The registers used to control the on-chip flash memory when enabled are shown in table 19.6.
In order to access the FLMCR1, FLMCR2, EBR1, and EBR2 registers, the FLSHE bit must be set
to 1 in SYSCR2 (except R AME R).
Table 19.6 Flash Memory Registers
Register Name Abbreviation R/W Initial Value Address*1
Flash memory control register 1 FLMCR1*5 R/W*3 H'80 H'FFC8*2
Flash memory control register 2 FLMCR2*5 R/W*3 H'00 H'FFC9*2
Erase block regi ster 1 EBR1*5 R/W*3 H'00*4 H'FFCA*2
Erase block regi ster 2 EBR2*5 R/W*3 H'00*4 H'FFCB*2
System control register 2 SYSCR2*6 R/W H'00 H'FF42
RAM emulation register RAMER R/W H'00 H'FEDB
Notes: 1. Lower 16 bits of the address.
2. Flash memory. Registers selection is performed by the FLSHE bit in system control
register 2 (SYSCR2).
3. In modes in which the on-chip flash memory is disabled, a read will return H'00, and
writes are invalid.
4. If a high level is input and the SWE bit in FLMCR1 is not set, these registers are
initialized to H'00.
5. FLMCR1, FLMCR2, EBR1, and EBR2 are 8-bit registers. Only byte accesses are valid
for these registers, the access requiring 2 states.
6. The SYSCR2 register can only be used in the F-ZTAT version. In the mask ROM
version this register will return an undefined value if read, and cannot be modified.
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19.5 Register Descriptions
19.5.1 Flash Memory Control Register 1 (FLMCR1)
Bit : 7 6 5 4 3 2 1 0
FWE SWE ESU PSU EV PV E P
Initial value : 1 0 0 0 0 0 0 0
R/W : R R/W R/W R/W R/W R/W R/W R/W
FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode
or erase-verify mode is entered by setting SWE to 1, then setting the EV or PV bit. Program mode
is entered by setting SWE to 1, then setting the PSU bit, and finally setting the P bit. Erase mode is
entered by setting SWE to 1, then setting the ESU bit, and fi nally setting the E bit. FLMCR1 is
initialized to H'80 by a reset, and in hardware standby mode and software standby mode. When
on-chip flash memory is disabled, a read will return H'00, and writes are invalid.
Writing to bits ESU, PSU, EV, and PV in FLMCR1 is enabled only when SWE = 1; writing to the
E bit is enabled only when SWE = 1 , and ESU = 1 ; and writing to the P bit is enabled only when
SWE = 1, and PSU = 1.
Bit 7—Flash Write Enable Bit (FWE): Sets hardware prote ctio n against flash memory
programming/erasing. These bits cannot be modified and are always read as 1 in this model.
Bit 6—Software Write Enable Bit (SWE): Enables or disables flash memory programming and
erasing. This bit should be set when setting bits 5 to 0 in FLMCR1, EBR1 bits 7 to 0, and EBR2
bits 5 to 0.
When SWE = 1, the flash memory can only be read in program-verify or erase-verify mode.
Bit 6
SWE
Description
0 Writes disabled (Initial value)
1 Writes enabled
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Bit 5—Erase Setup Bit (ESU): Prepares for a transition to erase mode. Do not set the SW E, PSU,
EV, PV, E, or P bit at the same time.
Bit 5
ESU
Description
0 Erase setup cleared (Initial value)
1 Erase setup
[Setting condition]
When SWE = 1
Bit 4—Program Setup Bit (PSU): Prepares for a transition to program mode. Do not set the
SWE, ESU, EV, PV, E, or P bit at the same time.
Bit 4
PSU
Description
0 Program setup cleared (Initial value)
1 Program setup
[Setting condition]
When SWE = 1
Bit 3—Erase-Verify (EV): Selects erase-verify mode transition or clearing. Do not set the SWE,
ESU, PSU, PV, E, or P bit at the same time.
Bit 3
EV
Description
0 Erase-verify mode cleared (Initial value)
1 Transition to erase-verify mode
[Setting condition]
When SWE = 1
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Bit 2—Program-Verify (PV): Selects program-verify mode transition or clearing. Do not set the
SWE, ESU, PSU, EV, E, or P bit at the same time.
Bit 2
PV
Description
0 Program-verify mode cleared (Initial value)
1 T r ansitio n to program-v erify m ode
[Setting condition]
When SWE = 1
Bit 1—Erase (E): Selects erase mode transition or clearing. Do not set the SWE, ESU, PSU, EV,
PV, or P bit at the same time.
Bit 1
E
Description
0 Erase mode cleared (Initial value)
1 T r ansitio n to erase mode
[Setting condition]
When SWE = 1, and ESU = 1
Bit 0—Program (P): Selects program mode transition or clearing. Do not set the SWE, PSU,
ESU, EV, PV, or E bit at the same time.
Bit 0
P
Description
0 Program mode cleared (Initial value)
1 T r ansitio n to program mode
[Setting condition]
When SWE = 1, and PSU = 1
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19.5.2 Flash Memory Control Register 2 (FLMCR2)
Bit : 7 6 5 4 3 2 1 0
FLER — — — — — — —
Initial value : 0 0 0 0 0 0 0 0
R/W : R — — — — — — —
FLMCR2 is an 8-bit register that controls the flash memory operating modes. FLMCR2 is
initialized to H'00 by a reset, and in hardware standby mode and software standby mode.
When on-chip flash memory is disabled, a read will return H'00 and writes are invalid.
Bit 7—Flash Memory Error (FLER): Indicates that an error has occurred during an operation on
flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the error-
protection state.
Bit 7
FLER
Description
0 Flash memory is operating normally (Initial value)
Flash memory program/erase protection (error protection) is disabled
[Clearing condition]
Reset or hardware standby mode
1 An error has occurre d during fl ash me mory progr amming/erasing
Flash memory program/erase protection (error protection) is enabled
[Setting condition]
See section 19.8.3, Error Protection
Bits 6 to 0—Reserved: These bits cannot be modified and are always read as 0.
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19.5.3 Erase Block Register 1 (EBR1)
Bit : 7 6 5 4 3 2 1 0
EBR1 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
EBR1 is an 8-bit register that specifies the flash memory erase area block by block. EBR1 is
initialized to H'00 by a reset, in hardware standby mode and software standby mode, and the SWE
bit in FLMCR1 is not set. W hen a bit in EBR1 is set, the corresponding block can be erased. Other
blocks are erase-protected. Set only one bit in EBR1 and EBR2 together (setting more than one bit
will automatically clear all EBR1 and EBR2 bits to 0). When on-chip flash memory is disabled, a
read will return H'00 and writes are invalid.
The flash memory block configuration is shown in table 19.7.
19.5.4 Erase Block Registers 2 (EBR2)
Bit : 7 6 5 4 3 2 1 0
EBR2 — — EB13 EB12 EB11 EB10 EB9 EB8
Initial value : 0 0 0 0 0 0 0 0
R/W : — — R/W R/W R/W R/W R/W R/W
EBR2 is an 8-bit register that specifies the flash memory erase area block by block. EBR2 is
initialized to H'00 by a reset, in hardware standby mode and software standby mode, and the SWE
bit in FLMCR1 is not set. W hen a bit in EBR2 is set, the corresponding block can be erased. Other
blocks are erase-protected. Set only one bit in EBR2 and EBR1 together (setting more than one bit
will automatically clear all EBR1 and EBR2 bits to 0). Bits 7 and 6 are reserved: they are always
read as 0 and cannot be modified. When on-chip flash memory is disabled, a read will return H'00,
and writes are invalid.
The flash memory block configuration is shown in table 19.7.
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Table 19.7 Flash Memory Erase Blocks
Block (Size) Address
EB0 (4 kbytes) H'000000 to H'000FFF
EB1 (4 kbytes) H'001000 to H'001FFF
EB2 (4 kbytes) H'002000 to H'002FFF
EB3 (4 kbytes) H'003000 to H'003FFF
EB4 (4 kbytes) H'004000 to H'004FFF
EB5 (4 kbytes) H'005000 to H'005FFF
EB6 (4 kbytes) H'006000 to H'006FFF
EB7 (4 kbytes) H'007000 to H'007FFF
EB8 (32 kbytes) H'008000 to H'00FFFF
EB9 (64 kbytes) H'010000 to H'01FFFF
EB10 (64 kbytes) H'020000 to H'02FFFF
EB11 (64 kbytes) H'030000 to H'03FFFF
EB12 (64 kbytes) H'040000 to H'04FFFF
EB13 (64 kbytes) H'050000 to H'05FFFF
19.5.5 System Control Register 2 (SYSCR2)
Bit : 7 6 5 4 3 2 1 0
— — — — FLSHE — — —
Initial value : 0 0 0 0 0 0 0 0
R/W : — — — — R/W — — R/W
SYSCR2 is an 8-bit readable/writable register that performs on-chip flash memory control.
SYSCR2 is initial ized to H'00 by a reset and in hardware standby mode.
SYSCR2 can only be used in the F-ZTAT version. In the mask ROM version this register will
return an undefined value if read, and cannot be modified.
Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 0.
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Bit 3—Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash
memory control registers (FLMCR1, FLMCR2, EBR1, and EBR2). Writing 1 to the FLSHE bit
enables the flash memory control registers to be read and written to. Clearing FLSHE to 0
designates these registers as unselected (the register contents are retained).
Bit 3
FLSHE
Description
0 Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB
(Initial value)
1 Flash control registers are selected for addresses H'FFFFC8 to H'FFFFCB
Bits 2 and 1—Reserved: These bits cannot be modified and are always read as 0.
Bit 0—Reserved: This bit should not be written with 0.
19.5.6 RAM Emulation Register (RAMER)
Bit : 7 6 5 4 3 2 1 0
— — — — RAMS RAM2 RAM1 RAM0
Initial value : 0 0 0 0 0 0 0 0
R/W : — — — — R/W R/W R/W R/W
RAMER specifies the area of flash memory to be overlapped with part of RAM when emulating
real-time flash memory programming. RAMER is initialized to H'00 by a reset and in hardware
standby mode. It is not initialized in software standby mode. RAMER se ttings should be made in
user mode or user program mode.
Flash memory area divisions are shown in table 19.8. To ensure correct operation of the emulation
function, the ROM for which RAM emulation is performed should not be accessed immediately
after this register has been modified. Normal execution of an access immediately after register
modification is not guaranteed.
Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 0.
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Bit 3—RAM Select (RAMS): Specifies selection or non-selection of flash memory emulatio n in
RAM. When RAMS = 1, all flash memory blocks are program/erase-protected.
Bit 3
RAMS
Description
0 Emulation not selected (Initial value)
Program/erase-protection of all flash memory blocks is disabled
1 Emulation selected
Program/erase-protection of all flash memory blocks is enabled
Bits 2 to 0—Flash Memory Area Selection (RAM2 to RAM0): These bits are used together
with bit 3 to select the flash memory area to be overlapped with RAM. (See table 19.8.)
Table 19.8 Flash Memory Area Divisions
RAM Area Block Name RAMS RAM2 RAM1 RAM0
H'FFDC00 to H'FFEBFF RAM area, 4 kbytes 0 * * *
H'000000 to H'000FFF EB0 (4 kbytes) 1 0 0 0
H'001000 to H'001FFF EB1 (4 kbytes) 1 0 0 1
H'002000 to H'002FFF EB2 (4 kbytes) 1 0 1 0
H'003000 to H'003FFF EB3 (4 kbytes) 1 0 1 1
H'004000 to H'004FFF EB4 (4 kbytes) 1 1 0 0
H'005000 to H'005FFF EB5 (4 kbytes) 1 1 0 1
H'006000 to H'006FFF EB6 (4 kbytes) 1 1 1 0
H'007000 to H'007FFF EB7 (4 kbytes) 1 1 1 1
*: Don’t care
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19.6 On-Board Programming Modes
When pins are set to on-board programming mode, program/erase/verify operations can be
performed on the on-chip flash memory. There are two on-board programming modes: boot mode
and user program mode. The pin settings for transition to each of these modes are shown in table
19.9. For a diagram of the transitions to the various flash memory modes, see figure 19.3.
Table 19.9 Setting On-Board Progr amming Mo des
Mode Pins
MCU Mode CPU Operating Mode MD2 MD1 MD0
Boot mode Advanced expanded mode with
on-chip ROM enabled 0 1 0
Advanced single-chip mode 1
User program mode* Advanced expanded mode with
on-chip ROM enabled 1 1 0
Advanced single-chip mode 1
Note: * Normally, user mode should be used. Set the SWE bit to 1 to make a transition to user
program mode before performing a program/erase/verify operation.
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19.6.1 Boot Mode
When boot mode is used, the flash memory programming control program must be prepared in the
host b eforehand. The channel 1 SCI to be used i s set to asynchro nous mode.
When a reset-start is executed after the H8S/2329B F-ZTAT chip’s pins have been set to boot
mode, the boot program built into the chip is started and the programming control program
prepared in the host is serially transmitted to the chip via the SCI. In the chip, the pro gramming
control program received via the SCI is written into the programming control program area in on-
chip RAM. After the transfer is completed, control branches to the start address of the
programming control program area and the programming control program execution state is
entered (flash memory programming is performed).
The transferred programming control program must therefore include coding that follows the
programming algorithm given later.
The system configuration in boot mode is shown in figure 19.9, and the boot program mode
execution procedure in figure 19.10.
RxD1
TxD1 SCI1
Chip
Flash memory
Write data reception
Verify data transmission
Host
On-chip RAM
Figure 19.9 System Configuration in Boot Mode
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Note: If a memory cell does not operate normally and cannot be erased, one H'FF byte is
transmitted as an erase error, and the erase operation and subsequent operations
are halted.
Start
Set pins to boot mode
and execute reset-start
Host transfers data (H'00)
continuously at prescribed bit rate
Chip measures low period
of H'00 data transmitted by host
Chip calculates bit rate and
sets value in bit rate register
After bit rate adjustment, chip
transmits one H'00 data byte to
host to indicate end of adjustment
Host confirms normal reception
of bit rate adjustment end
indication (H'00), and transmits
one H'55 data byte
After receiving H'55,
chip transmits one H'AA
data byte to host
Host transmits number
of programming control program
bytes (N), upper byte followed
by lower byte
Chip transmits received
number of bytes to host as verify
data (echo-back)
n = 1
Host transmits programming control
program sequentially in byte units
Chip transmits received
programming control program to
host as verify data (echo-back)
Transfer received programming
control program to on-chip RAM
n = N? No
Yes
End of transmission
Check flash memory data, and
if data has already been written,
erase all blocks
After confirming that all flash
memory data has been erased,
chip transmits one H'AA data
byte to host
Execute programming control
program transferred to on-chip RAM
n + 1 → n
Figure 19.10 Boot Mode Execution Procedure
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Automatic SCI Bit Rate Adjustment: When boot mode is initiated, the H8S/2329B F-ZTAT
chip measures the low period of the asynchronous SCI communication data (H'00) transmitted
continuously from the host. The SCI transmit/receive format should be set as follows: 8-bit data, 1
stop bit, no parity. The chip calculates the bit rate of the transmission from the host from the
measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate
adjustment. The host should confirm that this adjustment end indication (H'00) has been received
normally, and transmit one H'55 byte to the chip. If reception cannot be performed normally,
initiate boot mode again (reset), and repeat the above operations. Depending on the host’s
transmission bit rate and the chip’s syste m clock frequency, there will be a discrepancy between
the bit rates of the host and the chip. To ensure correct SCI operation, the host’s transfer bit rate
should be set to 9,600 or 19,200 bps.
Table 19.10 shows typical host transfer bit rates and system clock frequencies for which automatic
adjustment of the MCU’s bit rate is possible. The boot program should be executed within this
system clock range.
Start
bit Stop
bit
D0 D1 D2 D3 D4 D5 D6 D7
Low period (9 bits) measured (H'00 data) High period
(1 or more bits)
Figure 19.11 Automatic SCI Bit Rate Adjustment
Table 19.10 Syst em Clock Frequencies for which Automatic Adjustment of H8S/2329 B
F-ZTAT Bit Rate is Possible
Host Bit Rate System Clock Frequency for which Automatic Adjustment
of H8S/2329B F-ZTAT Bit Rate is Possible
19,200 bps 16 MHz to 25 MHz
9,600 bps 8 MHz to 25 MHz
On-Chip RAM Area Divisions in Boot Mode: In boot mode, the 2-kbyte area from H'FF7C00 to
H'FF83FF is reserved for use by the boot program, as shown in figure 19.12. The area to which the
programming control program is transferred is H'FF8400 to H'FFFBFF. The boot program area
can be used when the programming control program transferred into RAM enters the execution
state. A stack area should be set up as required.
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H'FF7C00
H'FF83FF
Programming
control program
area
(30 kbytes)
H'FFFBFF
Boot program
area*
(2 kbytes)
Note: * The boot program area cannot be used until a transition is made to the execution state
for the programming control program transferred to RAM. Note that the boot program
remains stored in this area after a branch is made to the programming control program.
Figure 19.12 RAM Areas in Boot Mode
Notes on Use of Boot Mode
• When the chip comes out of reset in boot mode, it measures the low-level period of the input at
the SCI’s RxD1 pin. The reset should end with RxD1 high. After the reset ends, it takes
approximately 100 states before the chip is ready to measure the low-level period of the RxD1
pin.
• In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all
flash memory blocks are erased. Boot mode is for use when user program mode is unavailable,
such as the first time on-board programming is performed, or if the program activated in user
program mode is accidentally erased.
• Interrupts cannot be used while the flash memory is being programmed or erased.
• The RxD1 and TxD1 pins should be pulled up on the board.
• Before branching to the programming control program (RAM area H'FF8400 to H'FFFBFF),
the chip terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing
the RE and TE bits in SCR to 0), but the adjusted bit rate value remains set in BRR. T he
transmit data output pin, TxD1, goes to the high-level output state (P31DDR = 1, P31DR = 1).
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• The contents of the CPU’s internal general registers are undefined at this time, so these
registers must be initialized i m mediately after branching to the programming control program.
In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area
must be specified for use by the programming control program.
• Initial settings must also be made for the other on-chip registers.
• Boot mode can be entered by making the pin settings shown in table 19.9 and executing a
reset-start.
• Boot mode can be cleared by driving the reset pin low, waiting at least 20 states, then setting
the mode pins, and executing reset release*1. Boot mode can also be cleared by a WDT
overflow reset.
• Do not change the mode pin input levels in boot mode.
• If the mode pin input levels are changed (for example, from low to high) during a reset, the
state of ports with multiplexed addr ess functions and bus control o utput pins (AS, RD, HWR)
will change according to the change in the microcomputer’s operating mode*2.
Therefore, care must be taken to make pin settings to prevent these pins from becoming output
signal pins during a reset, or to prevent collision with sig nals outside the microcomputer.
Notes: 1. Mode pins input must satisfy the mode programming setup time (tMDS = 200 ns) with
respect to the reset release timing.
2. See section 9, I/O Ports.
19.6.2 User Program Mode
When set to user program mode, the chip can program and erase its flash memory by executing a
user program/erase control program. Therefore, on-board reprogramming of the on-chip flash
memory can be carried out by providing on-board means supply of programming data, and storing
a program/erase control program in part of the program area if necessary.
To select user program mode, select a mode that enables the on-chip flash memory (mode 6 or 7).
In this mode, on-chip supporting modules other than flash memory operate as they normally
would in modes 6 and 7.
The flash memory itself cannot be read while the SWE bit is set to 1 to perform programming or
erasing, so the control program that performs programming and erasing should be run in on-chip
RAM or external memory. When the program is located in external memory, an instruction for
programming the flash memory and the following instruction should be lo cated in on-chip RAM.
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Figure 19.13 shows the procedure for executing the program/erase control program when
transferred to on-chip RAM.
Branch to flash memory application
program
Branch to program/erase control
program in RAM area
Execute program/erase control
program (flash memory rewriting)
Transfer program/erase control
program to RAM
MD2, MD1, MD0 = 110, 111
Reset-start
Write the transfer program
(and the program/erase control
program if necessary) beforehand
Note: The watchdog timer should be activated to prevent overprogramming or overerasing
due to program runaway, etc.
Figure 19.13 User Program Mode Execution Procedure
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19.7 Programming/Erasing Flash Memory
In the on-board programming modes, flash memory programming and erasing is performed by
software, using the CPU. There are four flash memory operating modes: program mode, erase
mode, program-verify mode, and erase-verify mode. Transitions to these modes can be made by
setting the PSU, ESU, P, E, PV, and EV bits in FLMCR1.
The flash memory cannot be read while being programmed or erased. Therefore, the program that
controls flash me mory program mi ng/eras i ng (the pr ogramming contro l program) should be
located and executed in on-chip RAM or external memory. When the program is located in
external memory, an instruction for programming the flash memory and the following instruction
should be located in on-chip RAM. The DMAC or DTC should not be activated before or after the
instructi on for p rogrammi ng t he flash memory is executed.
Notes: 1. Op eration is not guaranteed if setting/resetting of the SWE, ESU, PSU, EV, PV, E, and
P bits in FLMCR1 is executed by a program in flash memory.
2. Perform programming in the erased state. Do not perform additional programming on
previously programmed addresses.
19.7.1 Program Mode
Follow the procedure shown in the program/program-verify flowchart in figure 19.14 to write data
or programs to flash memory. Performing program operations according to this flowchart will
enable data or programs to be written to flash memory without subjecting the device to voltage
stress or sacrificing program data reliab ility. Programming should be carried out 128 bytes at a
time.
For the wait times (x, y, z1, z2, z3 α, ß, γ, ε, η, and θ) after bits are set or cleared in flash memory
control register 1 (FLMCR1) and the maximum number of programming operations (N), see
section 22.2.6, Flash Memory Characteristics.
Following the elapse of (x) µs or more after the SWE bit is set to 1 in flash memory control
register 1 (FLMCR1), 128-byte program data is stored in the program data area and reprogram
data area, and the 128-byte data in the reprogram data area is written consecutively to the write
addresses. The lower 8 bits of the first address written to must be H'00 or H'80. 128 consecutive
byte data transfers are performed. The program address and program data are latched in the flash
memory. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this
case, H'FF data must be written to the extra addresses.
Next, the watchdog timer is set to prevent overprogramming in the event of program runaway, etc.
Set a value greater than (y + z2 + α + β) µs as the WDT overflow period. After this, preparation
for program mode (program setup) is carried out by setting the PSU bit in FLMCR1, and after the
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 766 of 1268
REJ09B0220-0600
elapse of (y) µs or more, the operating mode is switched to program mode by setting the P bit in
FLMCR1. The time during which the P bit is set is the flash memory program ming ti me. Set the
programming time according to the table in the programming flowchart.
19.7.2 Program-Verify Mode
In program-verify mode, the data written in program mode is read to check whether it has been
correctly written in the flash memory.
After the elapse of a given programming time, the programming mode is ex ited (the P bit in
FLMCR1 is cleared to 0, then the PSU bit is cleared to 0 at least (α) µs later). Next, the watchdog
timer is cleared after the elapse of (β) µs or more, and the operating mode is switched to program-
verify mod e by setting the PV bit in FLMCR1. Before reading in progr am- verify mode, a dumm y
write of H'FF data should be made to the addresses to be read. The dummy write should be
executed after the elapse of (γ) µs or more. When the flash memory is read in this state (verify data
is read in 16-bit units), the data at the latched address is read. Wait at least (ε) µs after the dummy
write before performing this read operation. Next, the originally written data is compared with the
verify data, and reprogram data is computed (see figure 19.14) and transferred to the reprogram
data area. After 128 bytes of data have been verified, exit program-verify mode in FLMCR1 to 0,
and wait again for at least (θ) μs. If reprogramming is necessary, set program mode again, and
repeat the program/program-verify sequence as before. However, ensure that the
program/program-verify sequence is not repeated more than (N) times on the same bits.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 767 of 1268
REJ09B0220-0600
Start
End of programming
End sub
Set SWE bit in FLMCR1
Wait (x) μs
n = 1
m = 0
Sub-routine-call
See Note 7 for pulse width
Note 7: Write Pulse Width
Start of programming
Sub-routine write pulse
Set PSU bit in FLMCR1
Enable WDT
Set P bit in FLMCR1
Wait (y) μs
Clear P bit in FLMCR1
Wait (z1) μs or (z2) μs or (z3) μs
Clear PSU bit in FLMCR1
Wait (α) μs
Disable WDT
Wait (β) μs
Write pulse application subroutine
NG
NG
NG
NG
NG NG
OK
OK
OK
OK
OK
Wait (γ) μs
Wait (ε) μs
*2
*4
*6
*6
*6
*6
*6
*6
*6
*6*6
*5*6
*6
*6
*6
*6
*1
Set PV bit in FLMCR1
H'FF dummy write to verify address
Read verify data
Additional program data computation
Transfer additional program data to
additional program data area
Read data = verify
data?
*4
*1
*4
*3
Reprogram data computation
Clear PV bit in FLMCR1
Clear SWE bit in FLMCR1
m = 1
128-byte
data verification
completed?
m = 0?
6 ≥ n ?
6 ≥ n ?
Increment address
Programming failure
OK
Clear SWE bit in FLMCR1
n ≥ N?
Write 128-byte data in RAM reprogram
data area consecutively to flash memory
Write pulse
(z1) μs or (z2) μs
Perform programming in the erased state.
Do not perform additional programming
on previously programmed addresses.
RAM
Program data area
(128 bytes)
Reprogram data area
(128 bytes)
Additional program data
area (128 bytes)
Store 128-byte program data in program
data area and reprogram data area
Number of Writes (n)
1
2
3
4
5
6
7
8
9
10
11
12
13
.
.
.
998
999
1000
Write Time (z) μs
z1
z1
z1
z1
z1
z1
z2
z2
z2
z2
z2
z2
z2
.
.
.
z2
z2
z2
0
1
0
1
0
1
1
0
1
Comments
Programming completed
Programming incomplete; reprogram
Still in erased state; no action
Program Data Operation Chart
Transfer reprogram data to reprogram
data area
n ← n + 1
Note: Use a (z3) µs write pulse for additional
programming.
Sequentially write 128-byte data in
additional program data area in RAM to
flash memory
Write Pulse
(z3 µs additional write pulse)
Wait (θ) μs
Wait (η) μs
Wait (θ) μs
Reprogram Data
(X)
Original Data
(D) Verify Data
(V) 0
1
0
1
0
1
0
1
Comments
Additional programming executed
Additional programming not executed
Additional programming not executed
Additional programming not executed
Additional Program Data Operation Chart
Additional
Program Data (Y)
Reprogram
Data (X') Verify Data
(V)
Notes: 1. Data transfer is performed by byte transfer. The lower 8 bits of the first
address written to must be H'00 or H'80. A 128-byte data transfer must
be performed even if writing fewer than 128 bytes; in this case, H'FF
data must be written to the extra addresses.
2. Verify data is read in 16-bit (W) units.
3. Even bits for which programming has been completed in the 128-byte
programming loop will be subjected to additional programming if they fail
the subsequent verify operation.
4. A 128-byte area for storing program data, a 128-byte area for storing
reprogram data, and a 128-byte area for storing additional program data
should be provided in RAM. The contents of the reprogram data and
additional program data areas are modified as programming proceeds.
5. A write pulse of (z1) or (z2) μs should be applied according to the progress
of programming. See Note 7 for the pulse widths. When the additional program
data is programmed, a write pulse of (z3) μs should be applied. Reprogram data X' stands for reprogram data to which a write pulse has been applied.
6. For the values of x, y, z1, z2, z3, α, β, γ, ε, η, θ, and N, see section 22.2.6, Flash Memory Characteristics.
Figure 19.14 Program/Program-Verify Flowchart
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 768 of 1268
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19.7.3 Erase Mode
Flash memory erasing should be performed block by block following the procedure shown in the
erase/erase-verify flowchart (single-block erase) shown in figure 19.15.
For the wait times (x, y, z, α, ß, γ, ε, η, θ) after bits are set or cleared in flash memory control
register 1 (FLMCR1) and the maximum number of programming operations (N), see section
22.2.6, Flash Memory Characteristics.
To perform data or program erasure, make a 1 bit setting for the flash memory area to be erased in
erase block register 1 or 2 (EBR1 or EBR2 ) at least (x) µs after setting the SWE bit to 1 in flash
memory control register 1 (FLMCR1). Next, the watchdog timer is set to prevent overerasing in
the event of program runaway, etc. Set a value greater than (y + z + α + ß) ms as the WDT
overflow period. After this, preparation for erase mode (erase setup) is carried out by setting the
ESU bit in FLMCR1, and a fter the elapse of (y) µs or more, the operating mode is switched to
erase mode by setting the E bit in FLMCR1. The time during which the E bit is set is the flash
memory erase time. Ensure that the erase time does not exceed (z) ms.
Note: With flash memory erasing, prewriting (setting all data in the memory to be erased to 0) is
not necessary before starting the erase procedure.
19.7.4 Erase-Verify Mode
In erase-verify mode, data is read after memory has been erased to check whether it has been
correctly erased.
After the elapse of the erase time, erase mode is exited (the E bit in FLMCR1 is cleared to 0, then
the ESU bit in FLMCR1 is cleared to 0 at least (α) µs later), the watchdog timer is cleared after
the elapse of (β) µs or more, and the operating mode is switched to erase-verify mode by setting
the EV bit in FLMCR1. Before read ing in erase-verify mode, a dummy write of H'FF data should
be made to the addresses to be read. The dummy write should be executed after the elapse of (γ)
µs or more. When the flash memory is read in this state (verify data is read in 16-bit units) , the
data at the latched address is read. Wait at least (ε) µs after the dummy write before performing
this read operation. If the read data has been erased (all 1), a dummy write is performed to the next
address, and erase-verify is performed. If the read data has not been erased, set erase mode again,
and repeat the erase/erase-verify sequence in the same way. However, ensure that the erase/erase-
verify sequence is not repeated more than (N) times. When verification is completed, exit erase-
verify mode, and wait for at least (η) µs. If erasure has been completed on all the erase blocks,
clear the SWE bit in FLMCR1 to 0 and wait for at least (θ) μs. If there are any unerased blocks,
make a 1 bit setting for the flash memory area to be erased, and repeat the erase/erase-verify
sequence in the same way.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 769 of 1268
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End of erasing
Start
Set SWE bit in FLMCR1
Set ESU bit in FLMCR1
Set E bit in FLMCR1
Wait (x) μs
Wait (y) μs
n = 1
Set EBR1, EBR2
Enable WDT
*2
*2
*4
Wait (z) ms
*2
Wait (α) μs
*2
Wait (β) μs
*2
Wait (γ) μs
Set block start address to verify address
*2
Wait (ε) μs
*2
*3
*2
Wait (η) μs
*2*2
*5
Start of erase
Clear E bit in FLMCR1
Clear ESU bit in FLMCR1
Set EV bit in FLMCR1
H'FF dummy write to verify address
Read verify data
Clear EV bit in FLMCR1
Wait (η) μs
Clear EV bit in FLMCR1
Clear SWE bit in FLMCR1
Disable WDT
Halt erase
*1
Verify data = all 1?
Last address of block?
End of
erasing of all erase
blocks?
Erase failure
Clear SWE bit in FLMCR1
n ≥ N?
NG
NG
NG NG
OK
OK
OK OK
n ← n + 1
Increment
address
Notes: 1. Prewriting (setting erase block data to all 0) is not necessary.
2. The values of x, y, z, α, β, γ, ε, η, θ, and N are shown in the section 22.2.6, Flash Memory Characteristics.
3. Verify data is read in 16-bit (W) units.
4. Set only one bit in EBR1or EBR2. More than one bit cannot be set.
5. Erasing is performed in block units. To erase a number of blocks, the individual blocks must be erased sequentially.
Wait (θ) μs Wait (θ) μs
Figure 19.15 Erase/Erase-Verify Flowchart
Section 19 ROM
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19.8 Flash Memory Protection
There are three kinds of flash memory program/erase protection: hardware protection, software
protection, and error protection.
19.8.1 Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly
disabled or aborted . Settings in flash memory control registers 1 and 2 (FLMCR1, FLMCR 2 ) and
erase block registers 1 and 2 (EBR1, EBR2) are reset (see table 19.11).
Table 19.11 Hardware Protection
Functions
Item Description Program Erase
Reset/standby
protection • In a reset (including a WDT overflow reset)
and in standby mode, FLMCR1, FLMCR2,
EBR1, and EBR2 are initialized, and the
program/erase-protected state is entered.
• In a reset via the RES pin, the reset state is
not entered unless the RES pin is held low
until oscillation stabilizes after powering on.
In the case of a reset during operation, hold
the RES pin low for the RES pulse width
specified in section 22.2.3, AC
Characteristics.
Yes Yes
19.8.2 Software Protection
Software protection can be implemented by setting the SWE bit in flash memory control register 1
(FLMCR1), erase block registers 1 and 2 (EBR1, EBR2), and the RAMS bit in the RAM
emulation register (RAMER). When software protection is in effect, setting the P o r E bit in
FLMCR1 does not cause a transition to program mode or erase mode (see table 19.12).
Section 19 ROM
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Table 19.12 Software Protection
Functions
Item Description Program Erase
S WE bit protection • Clearing the SWE bit to 0 in FLMCR1 sets the
program/erase-protected state for all blocks.
• (Execute in on-chip RAM or external memory.)
Yes Yes
Block specification
protection • Erase protection can be set for individual
blocks by settings in erase block registers
1 and 2 (EBR1, EBR2).
• Setting EBR1 and EBR2 to H'00 places all
blocks in the erase-prot ect ed s tate.
— Yes
Emulation protection • Setting the RAMS bit to 1 in the RAM emulation
register (RAMER) places all blocks in the
program/erase-protected state.
Yes Yes
19.8.3 Error Protection
In error protection, an error is detected when MCU runaway occurs during flash memory
programming/erasing, or operation is not performed in accordance with the program/erase
algorithm, and the program/erase operation is aborted. Aborting the program/erase operation
prevents damage to the flash memory due to overprogramming or overerasing.
If the MCU malfunctions during flash memory programming/erasing, the FLE R bit is set to 1 in
FLMCR2 and the error protection state is entered. The FLMCR1, FLMCR2, EBR1, and EBR2
settings are retained, but program mode or erase mode is aborted at the point at which the error
occurred. Program mode or erase mode cannot be re-entered by re-setting the P or E bit. However,
PV and EV bit setting is enabled, and a transition can be made to verify mode.
FLER bit setting conditions are as follows:
• When flash memory is read during programming/erasing (including a vector read or instruction
fetch)
• Immediately after exception handling (excluding a reset) during programming/erasing
• When a SLEEP instruction (including software standby) is executed during
programming/erasing
• When a bus master other than the CPU (the DMAC or DTC) has control of the bus during
programming/erasing
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 772 of 1268
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Error protection is released only by a reset and in hardware standby mode.
Figure 19.16 shows the flash memory state transition diagram.
RD VF PR ER
FLER = 0
Error
occurrence
RES = 0 or STBY = 0
RES = 0 or
STBY = 0
RD VF PR ER
FLER = 0
Normal operating mode
Program mode
Erase mode
Reset or hardware standby
(hardware protection)
RD VF PR ER
FLER = 1 RD VF PR ER
FLER = 1
Error protection mode Error protection mode
(software standby)
Software
standby mode
FLMCR1, FLMCR2 (except FLER
bit), EBR1, EBR2 initialization state
FLMCR1, FLMCR2,
EBR1, EBR2
initialization state
Software standby
mode release
RD: Memory read possible
VF: Verify-read possible
PR: Programming possible
ER: Erasing possible
RD: Memory read not possible
VF: Verify-read not possible
PR: Programming not possible
ER: Erasing not possible
Legend:
RES = 0 or
STBY = 0
Error occurrence
(software standby)
Figure 19.16 Flash Memory State Transitions
Section 19 ROM
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19.9 Flash Memory Emulation in RAM
19.9.1 Emulation in RAM
Making a setting in the RAM emulation register (RAMER) enables part of RAM to be overlapped
onto the flash memory area so that data to be written to flash memory can be emulated in RAM in
real time. After the RAMER setting has been made, accesses can be made from the flash memory
area or the RAM area overlapping flash memory. Emulation can be performed in user mode and
user program mode. Figure 19.17 shows an example of emulation of real-time flash memory
programming.
Start of emulation program
End of emulation program
Tuning OK?
Yes
No
Set RAMER
Write tuning data to overlap
RAM
Execute application program
Clear RAMER
Write to flash memory emulation
block
Figure 19.17 Flowchart for Flash Memory Emulation in RAM
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 774 of 1268
REJ09B0220-0600
19.9.2 RAM Overlap
An example in which flash memory block area EB1 is overlapped is shown below.
H'00000
H'01000
H'02000
H'03000
H'04000
H'05000
H'06000
H'07000
H'08000
H'5FFFF
Flash memory
EB8 to EB13
This area can be accessed
from both the RAM area
and flash memory area
EB0
EB1
EB2
EB3
EB4
EB5
EB6
EB7
H'FFDC00
H'FFEBFF
H'FFFBFF
On-chip RAM
Figure 19.18 Example of RAM Overlap Operation
Example in which Flash Memory Block Area EB1 is Overlapped
1. Set bits RAMS, RAM2, RAM1, and RAM0 in RAMER to 1, 0, 0, 1, to overlap part of RAM
onto the area (EB1) for which real-time programming is required.
2. Real-time programming is performed using the overlapping RAM.
3. After the program data has been confirmed, the RAMS bit is cleared, releasing RAM overlap.
4. The data written in the overlapping RAM is writte n i nto the flash memory space (EB1).
Notes: 1. When the RAMS bit is set to 1 , program/erase protection is enabled for all blocks
regardless of the value of RAM2, RAM1, and RAM0 (e mulation protection). In this
state, setting the P or E bit in flash memory control register 1 (FLMCR1) will not cause
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 775 of 1268
REJ09B0220-0600
a transition to program mode or erase mode. When actually programming a flash
memory area, the RAMS bit should be cleared to 0.
2. A RAM area cannot be erased by execution of software in accordance with the erase
algorithm while flash memory emulation in RAM is being used.
3. Block area EB0 includes the vector table. When performing RAM emulation, the
vector table is needed by the overlap RAM.
19.10 Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including NMI input, are disabled when flash memory is being programmed or
erased (when the P or E bit is set in FLMCR1), and while the boot program is executing in boot
mode*1, to give priority to the program or erase operation. There are three reasons for this:
1. Interrupt during programming or erasing might cause a violation of the programming or
erasing algorithm, with the result that normal operation could not be assured.
2. In the interrupt exception handling sequence during programming or erasing, the vector would
not be read correctly*2, possibly resulting in M CU runa way.
3. If an interrupt occurred during boot program execution, it would not be possible to execute the
normal boot mode sequence.
For these reasons, in on-board pro gramming mode alone there are conditio ns for disabling
interrupts, as an exception to the general rule. However, this provision does not guarantee normal
erasing and programming or MCU operation. All interrupt requests, includin g NMI, must
therefore be restricted inside and outside the MCU when programming or erasing flash memory.
The NMI interrupt is also disabled in the error-protection sta te while the P or E bit remains set in
FLMCR1.
Notes: 1. Interrupt requests must b e disabled inside and outside the MCU until the programming
control program has completed programming.
2. The vector may not be read correctly in this case for the follo wing two reasons:
• If flash memory is read while being programmed or erased (while the P or E bit is
set in FLMCR1), correct read data will not be ob tained (undetermined values will
be returned).
• If the interrupt entry in the vector table has not been programmed yet, interrupt
exception handling will not be executed correctly.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 776 of 1268
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19.11 Flash Memory PROM Mode
19.11.1 PROM Mode Setting
Programs and data can be written and erased in PROM mode as well as in the on-board
programming modes. In PROM mode, the on-chip ROM can be freely programmed using a
PROM programmer that supports the Renesas microcomputer device type with 512-kbyte on-chip
flash memory (FZTAT512V3A). Flash memory read mode, auto-program mode, auto-erase mode,
and status read mode are supported with this device type. In auto-program mode, auto-erase mode,
and status read mode, a status polling procedure is used, and in status read mode, detailed internal
signals are output after execution of an auto-program or auto-erase operation.
Table 19.13 shows PROM mode p in settings.
Table 19.13 PRO M Mode P in Set tings
Pin Names Settings/External Circuit Connection
Mode pins: MD2, MD1, MD0 Low-level input
Mode setting pins: P66, P65, P64 High-level input to P66, low-level input to P65 and P64
STBY pin High-level input (do not select hardware standby mode)
RES pin Reset circuit
XTAL, EXTAL pins Oscillator circuit
Other pins requiring setting: P32, P25 High-level input to P32, low-level input to P25
19.11.2 Socket Adapters and Memory Map
In PROM mode, a socket adapter is connected to the chip as shown in figure 19.20. Figure 19.19
shows the on-chip ROM memory map and figure 19.20 shows the socket adapter pin assignments.
H'00000000
MCU mode address PROM mode address
H'0005FFFF
H'00000
H'5FFFF
On-chip
ROM space
(384 kbytes)
Figure 19.19 Memory Map in PROM Mode
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 777 of 1268
REJ09B0220-0600
H8S/2329B F-ZTAT Socket Adapter
(40-Pin Conversion)
TFP-120 Pin Name
2
3
4
5
7
8
9
10
11
12
13
14
16
17
18
19
20
21
22
43
44
45
46
48
49
50
51
68
69
67
72
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
A
14
A
15
A
16
A
17
A
18
D
8
D
9
D
10
D
11
D
12
D
13
D
14
D
15
CE
OE
WE
EMLE
*3
HN27C4096HG (40 Pins)
Pin No. Pin Name
21
22
23
24
25
26
27
28
29
31
32
33
34
35
36
37
38
39
10
19
18
17
16
15
14
13
12
2
20
3
4
1, 40
11, 30
5, 6, 7
8
9
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
A
14
A
15
A
16
A
17
A
18
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
CE
OE
WE
FWE
V
CC
V
SS
NC
A
20
A
19
73
77
78
FP-128B
6
7
8
9
11
12
13
14
15
16
17
18
20
21
22
23
24
25
26
49
50
51
52
54
55
56
57
76
77
75
80
81
85
86
RES
XTAL
EXTAL
NC (OPEN)
1, 30, 33, 52, 55,74,
75, 76, 81, 93, 94
6, 15, 24, 31, 32, 38,
47, 59, 66, 79, 103,
104, 113, 114, 115
5, 34, 39, 58, 61, 82,
83, 84, 89, 103, 104
3, 10, 19, 28, 35, 36,
37, 38, 44, 53, 65,
67, 68, 74, 87, 99,
100, 113, 114, 123,
124, 125
V
CC
V
SS
Reset circuit
Oscillation circuit
Legend:
EMLE: Emulation enable
I/O
7
to I/O
0
: Data input/output
A
18
to A
0
: Address input
CE: Chip enable
OE: Output enable
WE: Write enable
*1
*2
Notes: 1. A reset oscillation stabilization time (t
osc1
) of at least 10 ms is required.
2. A 12 MHz crystal resonator should be used.
3. As the FWE pin becomes VCC in the H8S/2329B F-ZTAT, the EMLE pin is ignored in PROM mode.
This figure shows pin assignments, and does not show the entire socket adapter circuit.
Other pins
Figure 19.20 H8S/2329B F-ZTAT Socket Adapter Pin Assignments
Section 19 ROM
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19.11.3 PROM Mode Operation
Table 19.14 shows how the different operating modes are set when using PROM mode, and table
19.15 lists the commands used in PROM mode. Details of each mode are given below.
Memory Read Mode: Memory read mode supports byte reads.
Auto-Program Mode: Auto-program mode supports programming of 128 bytes at a time. Status
polling is used to confirm the end of auto-programming.
Auto-Erase Mode: Auto-erase mode supports automatic erasing of the entire flash memory.
Status polling is used to confir m the end of auto -erasi ng.
Status Read Mode: Status polling is used for auto-progra mming and auto-erasi ng, and normal
termination can be confirmed by reading the I/O6 signal. In status read mode, error information is
output if an error occurs.
Table 19.14 Settings for Each O perating Mode in PROM Mode
Pin Names
Mode CE OE WE I/O7 to I/O0 A
18 to A0
Read L L H Data output Ain
Output disable L H H Hi-Z X
Command write L H L Data input Ain*2
Chip disable*1 H X X Hi-Z X
Legend:
H: High level
L: Low level
Hi-Z: High impedance
X: Don’t care
Notes: 1. Chip disable is not a standby state; internally, it is an operation state.
2. Ain indicates that there is also address input in auto-program mode.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 779 of 1268
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Table 19.15 PRO M Mode Co mmands
1st Cycle 2nd Cycle
Command Name Number
of Cycles Mode Address Data Mode Address Data
Memory read mode 1 + n Write X H'00 Read RA Dout
Auto-program mode 129 Write X H'40 Write PA Din
Auto-erase mode 2 Write X H'20 Write X H'20
Status read mode 2 Write X H'71 Write X H'71
Legend:
RA: Read address
PA: Program address
Notes: 1. In auto-program mode, 129 cycles are required for command writing by a simultaneous
128-byte write.
2. In memory read mode, the number of cycles depends on the number of address write
cycles (n).
19.11.4 Memory Read Mode
• After the end of an auto-program, auto-erase, or status read operation, the command wait state
is entered. To read memory contents, a transition must be made to memory read mode by
means of a command write before the read is executed.
• Command writes can be performed in memory read mode, just as in the command wait state.
• Once memory read mode has been entered, consecutive reads can be performed.
• After power-on, memory read mode is entered.
Section 19 ROM
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Table 19.16 AC Characteristics in Memory Read Mode
Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Command write cycle tnxtc 20 — µs
CE hold time tceh 0 — ns
CE setup time tces 0 — ns
Data hold time tdh 50 — ns
Data setup time tds 50 — ns
Write pulse width twep 70 — ns
WE rise time tr — 30 ns
WE fall time tf — 30 ns
CE
A
18 to A0
Data H'00
OE
WE
Command write
twep tceh
tdh
tds
tftr
tnxtc
Note: Data is latched at the rising edge of WE.
tces
Memory read mode
Address stable
Data
Figure 19.21 Memory Read Mode Timing Waveforms after Command Write
Section 19 ROM
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Table 19.17 AC Characteristics when Entering Another Mode from Memory Read Mode
Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Command write cycle tnxtc 20 — µs
CE hold time tceh 0 — ns
CE setup time tces 0 — ns
Data hold time tdh 50 — ns
Data setup time tds 50 — ns
Write pulse width twep 70 — ns
WE rise time tr — 30 ns
WE fall time tf — 30 ns
CE
A
18
to A
0
I/O
7
to I/O
0
OE
WE
Other mode command write
t
ceh
t
ds
t
dh
t
f
t
r
t
nxtc
Note: Do not enable WE and OE at the same time.
t
ces
t
wep
Memory read mode
Address stable
Figure 19.22 Timing Waveforms when Entering Another Mode from Memory Read Mode
Section 19 ROM
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Table 19.18 AC Characteristics in Memory Read Mode
Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Access tim e tacc — 20 µs
CE output delay time tce — 150 ns
OE output delay time toe — 150 ns
Output disable delay time tdf — 100 ns
Data output hold time toh 5 — ns
CE
A
18
to A
0
I/O
7
to I/O
0
OE
WE VIH
VIL
VIL
t
acc
t
oh
t
oh
t
acc
Address stable Address stable
Figure 19.23 Timing Waveforms for CE/OE Enable State Read
CE
A18 to A0
I/O7 to I/O0
VIH
OE
WE
tce
tacc
toe
toh toh tdf
tce
tacc
toe
Address stable Address stable
tdf
Figure 19.24 Timing Waveforms for CE/OE Clocked Read
Section 19 ROM
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19.11.5 Auto-Program Mode
• In auto-program mode, 128 bytes are programmed simultaneously. For this purpose, 128
consecutive byte data transfers should be performed.
• A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case,
H'FF data must be written to the extra addresses.
• The lower 7 bits of the transfer addr ess must be held low. If an invalid address is input,
memory programming will be started but a programming error will occur.
• Memory address transfer is executed in the second cycle (figure 19.25). Do not perform
transfer later than the second cycle.
• Do not perform a command write during a programming operation.
• Perform one auto-programming operation for a 128-byte block for each address. One or more
additional programming operations cannot be carried o ut on add r ess b lo c ks that have already
been programmed.
• Confirm normal end of auto-programming by checking I/O6. Alternatively, status read mode
can also be used for this purpose (the I/O7 status polling pin is used to identify the end of an
auto-program operation).
• Status polling I/O6 and I/O7 information is retained until the next command write. As long as
the next command write has not been performed, reading is possible by enabling CE and OE.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 784 of 1268
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AC Characteristics
Table 19.19 AC Characteristics in Auto-Program Mode
Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Command write cycle tnxtc 20 — µs
CE hold time tceh 0 — ns
CE setup time tces 0 — ns
Data hold time tdh 50 — ns
Data setup time tds 50 — ns
Write pulse width twep 70 — ns
Status polling start time twsts 1 — ms
Status polling access time tspa — 150 ns
Address setup time tas 0 — ns
Address hold time tah 60 — ns
Memory write time twrite 1 3000 ms
WE rise time tr — 30 ns
WE fall time tf — 30 ns
Address stable
CE
A
18
to A
0
I/O
5
to I/O
0
I/O
6
I/O
7
OE
WE
t
as
t
ah
t
dh
t
ds
t
f
t
r
t
wep
t
wsts
t
write
t
spa
t
nxtc
t
nxtc
t
ceh
t
ces
Programming operation
end identification signal
Data transfer
1 byte to 128 bytes
H'40 H'00
Programming normal
end identification signal
Figure 19.25 Auto-Program Mode Timing Waveforms
Section 19 ROM
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19.11.6 Auto-Erase Mode
• Auto-erase mode supports only total memory erasing.
• Do not pe rfor m a c ommand write d uring auto-erasing.
• Confirm normal end of auto-erasing by checking I/O6. Alternatively, status read mode can also
be used for this purpose (the I/O7 status polling pin is used to identify the end of an auto-erase
operation).
• Status polling I/O6 and I/O7 pin information is retained until the next command write. As long
as the next command write has not been performed, reading is possible by enabling CE and
OE.
AC Characteristics
Table 19.20 AC Characteristics in Auto-Erase Mode
Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Command write cycle tnxtc 20 — µs
CE hold time tceh 0 — ns
CE setup time tces 0 — ns
Data hold time tdh 50 — ns
Data setup time tds 50 — ns
Write pulse width twep 70 — ns
Status polling start time tests 1 — ms
Status polling access time tspa — 150 ns
Memory erase time terase 100 40000 ms
WE rise time tr — 30 ns
WE fall time tf — 30 ns
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 786 of 1268
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CE
A
18
to A
0
I/O
5
to I/O
0
I/O
6
I/O
7
OE
WE
t
ests
t
erase
t
spa
t
dh
t
ds
t
f
t
r
t
wep
t
nxtc
t
nxtc
t
ceh
t
ces
Erase end identifi-
cation signal
Erase normal end
confirmation signal
H'20 H'20 H'00
Figure 19.26 Auto-Erase Mode Timing Waveforms
19.11.7 Status Read Mode
• Status read mode is used to identify what type of abnormal end has occurred. Use this mode
when an abnormal end occurs in auto-program mode or auto-erase mode.
• The return code is retained until a command write for other than status read mode is
performed.
Table 19.21 AC Characteristics in Status Read Mode
Condition s: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Command write cycle tnxtc 20 — µs
CE hold time tceh 0 — ns
CE setup time tces 0 — ns
Data hold time t dh 50 — ns
Data setup time tds 50 — ns
Write pulse width twep 70 — ns
OE output delay time toe — 150 ns
Disabl e delay time tdf — 100 ns
CE output delay time tce — 150 ns
WE rise time tr — 30 ns
WE fall time tf — 30 ns
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 787 of 1268
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CE
A
18
to A
0
I/O
7
to I/O
0
OE
WE
t
dh
t
df
t
ds
t
f
t
r
t
wep
t
nxtc
t
nxtc
t
f
t
r
t
wep
t
ds
t
dh
t
nxtc
t
ceh
t
ceh
t
oe
t
ces
t
ces
t
ce
H'71 H'71
Note: I/O
3
and I/O
2
are undefined.
Figure 19.27 Status Read Mode Timing Waveforms
Table 19.2 2 Status Read Mode Return Commands
Pin Name I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0
Attribute Normal
end
identification
Command
error Program-
ming error Erase
error — — Program-
ming or
erase count
exceeded
Effective
address error
Initial value 0 0 0 0 0 0 0 0
Indications Normal
end: 0
Abnormal
end: 1
Command
error: 1
Otherwise: 0
Program-
ming
error: 1
Otherwise: 0
Erase
error: 1
Otherwise: 0
— — Count
exceeded: 1
Otherwise: 0
Effective
address
error: 1
Otherwise: 0
Note: I/O3 and I/O2 are undefined.
Section 19 ROM
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19.11.8 Status Polling
• The I/O7 status polling flag indicates the operating status in auto-program or auto-erase mode.
• The I/O6 status polling flag indicates a normal or abnormal end in auto-program or auto-erase
mode.
Table 19.2 3 Status Polling Output Truth Table
Pin Names Internal Operation
in Progress
Abnormal End
—
Normal End
I/O7 0 1 0 1
I/O6 0 0 1 1
I/O0 to I/O5 0 0 0 0
19.11.9 PROM Mode Transition Time
Commands cannot be accepted during the oscillatio n stabilization period or the PROM mode setup
period. After the PROM mode setup time, a transition is made to memory read mode.
Table 19.24 Command Wait State Transition Time Specifications
Item Symbol Min Max Unit
Standby release (oscillation
stabilization time) tosc1 30 — ms
PROM mode setup time tbmv 10 — ms
VCC hold time tdwn 0 — ms
VCC
RES
Memory read
mode
Command
wait state
Command
wait state
Normal/
abnormal end
identification
Auto-program mode
Auto-erase mode
tosc1 tbmv tdwn
Command acceptance
Figure 19.28 Oscillation Stabilization Time, PROM Mode Setup Time, and Power Supply
Fall Sequence
Section 19 ROM
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19.11.10 Notes on Memory Programming
• When programming addresses which have previously been programmed, carry out auto-
era s ing b efore auto-programming.
• When performing programming using PROM mode on a chip that has been
programmed/erased in an on-board programming mode, auto-erasing is recommended before
carrying out auto-programming.
Notes: 1. The flash memory is initially in the erased state when the device is shipped by Renesas
Technology. For other chips for which the erasure history is unknown, it is
recommended that auto-erasing be executed to check and supplement the initialization
(erase) level.
2. Auto-programming should be performed once only on the same address block.
Additional programming cannot be carried out on address blocks that have already
been programmed.
19.12 Flash Memory Programming and Erasing Precautions
Precautions concerning the use of on-board programming mode, the RAM emulation function, and
PROM mode are summarized below.
Use the specified v oltages a nd ti ming fo r progra mming and erasing: Applied voltages in
excess of the rating can permanently damage the device. Use a PROM programmer that supports
the Renesas microcomputer device type with 512-kbyte on-chip flash memory (FZTAT512V3A).
Do not select the HN27C4096 setting for the PROM programmer, and only use the specified
socket adapter. Failure to observe these points may result in damage to the device.
Powering on and off: When applying or disconnecting VCC power, fix the RES pin low and place
the flash memory in the hardware protection state.
The power-on and power-off timing requirements should also be satisfied in the event of a power
failure and subsequent recovery.
Use the recommended algorithm when programming and erasing flash memory: The
recommended algorithm enables programming and erasing to be carried out without subjecting the
device to voltage stress or sacrificing program data reliabilit y. W hen setting the P or E bit in
FLMCR1, the watchdog timer should be set beforehand as a precaution against program runaway,
etc.
Section 19 ROM
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REJ09B0220-0600
Do not set o r clear the SWE bit during execution of a prog ram in flash memory: Wait for at
least 100 µs after clearing the SWE bit before executing a program or reading data in flash
memory. When the SWE bit is set, data in flash memory can be rewritten, but when SWE = 1,
flash memory can only be read in program-verify or erase-verify mode. Access flash memory only
for verify operations (verification during programming/erasing). Also, do not clear the SWE bit
during programming, erasing, or verifying.
Similarly, when using the RAM emulation function the SWE bit must be cleared before executing
a program or reading data in flash memory.
However, the RAM area overlapping flash memory space can be read and written to regardless of
whether the SWE bit is set or cleared.
Do not use interrupts while flash memory is being programmed or erased: When flash
memory is programmed or erased, all interrupt requests, including NMI, should be disabled to
give priority to program/erase operations.
Do not perform additional programming. Erase the memory before reprogramming: In on-
board programming, perform only one programming operation on a 128-byte programming unit
block. In PROM mode, too, perform only one programming operation on a 128-byte programming
unit block. Programming should be carried out with the entire programming unit block erased.
Before programming, check that the chip is correctly mounted in the PROM programmer:
Overcurrent damage to the device can result if the index marks on the PROM programmer socket,
socket adapter, and chip are not correctly aligned.
Do not to uch t he so cket adapt er or chip during programming: To uching either of these can
cause contact faults and write errors.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 791 of 1268
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19.13 Overview of Flash Memory (H8S/2328B F-ZTAT)
19.13.1 Features
The H8S/2328B F-ZTAT has 256 kbytes of on-chip flash memory. The features of the flash
memory are summarized below.
• Four flash memory operating modes
⎯ Program mode
⎯ Erase mode
⎯ Program-verify mode
⎯ Erase-verify mode
• Programming/erase methods
The flash memory is programmed 128 bytes at a time. Erasing is performed by block erase (in
single-block units). To erase the entire flash memory, the individual blocks must be erased
sequentially. Block erasing can be performed as required on 4-kbyte, 32-kbyte, and 64-kbyte
blocks.
• Progra mming/e ras e ti mes
The flash memory programming time is 10.0 ms (typ.) for simultaneous 128-byte
programming, equivalent to 78 µs (typ.) per byte, and the erase time is 50 ms (typ.).
• Reprogramming capability
The flash memory can be reprogrammed minimum 100 times.
• On-board programming modes
There are two modes in which flash memory can be programmed/erased/verified on-board:
⎯ Boot mode
⎯ User program mode
• Automatic bit rate adjustment
With data transfer in boot mode, the bit rate of the chip can be automatically adjusted to match
the transfer bit rate of the host.
• Flash memory emulation by RAM
Part of the RAM area can be overlapped onto flash memory, to emulate flash memory updates
in real time.
• Protect modes
There are three protect modes, hardware, software, and error protect, which allow protected
status to be designated for flash memory program/erase/verify operations.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 792 of 1268
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• PROM mode
Flash memory can be programmed/erased in PROM mode, using a PROM programmer, as
well as in on-board programming mode.
19.13.2 Overview
Block Diagram
Module bus
Bus interface/controller
Flash memory
(256 kbytes)
Operating
mode
EBR1
Internal address bus
Internal data bus (16 bits)
FWE pin
Mode pins
EBR2
SYSCR2
FLMCR2
FLMCR1
RAMER
Legend:
FLMCR1: Flash memory control register 1
FLMCR2: Flash memory control register 2
EBR1: Erase block register 1
EBR2: Erase block register 2
RAMER: RAM emulation register
SYSCR2: System control register 2
Figure 19.29 Block Diagram of Flash Memory
Section 19 ROM
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19.13.3 Flash Memory Operating Modes
Mode Transitions: When the mode pins and the FWE pin are set in the reset state and a reset-
start is executed, the chip enters one of the operating modes shown in figure 19.30. In user mode,
flash memory can be read but not programmed or erased.
Flash memory can be programmed and erased in boot mode, user program mode, and PROM
mode.
Boot mode
On-board programming mode
User
program mode
User mode
(on-chip ROM
enabled)
Reset state
PROM mode
RES = 0
FWE = 1,
SWE = 1
FWE = 0
or SWE = 0
*
Notes: Only make a transition between user mode and user program mode when the CPU is
not accessing the flash memory.
* MD0 = 0, MD1 = 0, MD2 = 0, P66 = 1, P65 = 0, P64 = 0
RES = 0
RES = 0
RES = 0
MD1 = 1,
MD2 = 1,
FWE = 0
FWE = 1,
MD1 = 1,
MD2 = 0
Figure 19.30 Flash Memory Mode Transitions
Section 19 ROM
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19.13.4 On-Board Programming Modes
• Boot mode
Flash memory
Chip
RAM
Host
Programming control
program
SCI
Application program
(old version)
New application
program
Flash memory
Chip
RAM
Host
SCI
Application program
(old version)
Boot program area
New application
program
Flash memory
Chip
RAM
Host
SCI
Flash memory
prewrite-erase
Boot program
New application
program
Flash memory
Chip
Program execution state
RAM
Host
SCI
New application
program
Boot program
Programming control
program
1. Initial state
The old program version or data remains written
in the flash memory. The user should prepare the
programming control program and new
application program beforehand in the host.
2. Programming control program transfer
When boot mode is entered, the boot program in
the chip (originally incorporated in the chip) is
started and the programming control program in
the host is transferred to RAM via SCI
communication. The boot program required for
flash memory erasing is automatically transferred
to the RAM boot program area.
3. Flash memory initialization
The erase program in the boot program area (in
RAM) is executed, and the flash memory is
initialized (to H'FF). In boot mode, entire flash
memory erasure is performed, without regard to
blocks.
4. Writing new application program
The programming control program transferred
from the host to RAM is executed, and the new
application program in the host is written into the
flash memory.
Programming control
program
Boot programBoot program
Boot program area Boot program area
Programming control
program
Figure 19.31 Boot Mode
Section 19 ROM
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• User program mode
Flash memory
Chip
Chip
RAM
Host
Programming/
erase control program
SCI
Boot program
New application
program
Flash memory RAM
Host
SCI
New application
program
Flash memory RAM
Host
SCI
Flash memory
erase
Boot program
New application
program
Flash memory
Program execution state
RAM
Host
SCI
Boot program
Boot program
FWE assessment
program
Application program
(old version)
New application
program
1. Initial state
(1) The FWE assessment program that confirms
that the FWE pin has been driven high, and (2)
the program that will transfer the programming/
erase control program to on-chip RAM should be
written into the flash memory by the user
beforehand. (3) The programming/erase control
program should be prepared in the host or in the
flash memory.
2. Programming/erase control program transfer
When the FWE pin is driven high, user software
confirms this fact, executes the transfer program
in the flash memory, and transfers the
programming/erase control program to RAM.
3. Flash memory initialization
The programming/erase program in RAM is
executed, and the flash memory is initialized (to
H'FF). Erasing can be performed in block units,
but not in byte units.
4. Writing new application program
Next, the new application program in the host is
written into the erased flash memory blocks. Do
not write to unerased blocks.
Programming/
erase control program
Programming/
erase control program
Programming/
erase control program
Transfer program
Application program
(old version)
Transfer program
FWE assessment
program
FWE assessment
program
Transfer program
FWE assessment
program
Transfer program
Chip
Chip
Figure 19.32 User Program Mode (Example)
Section 19 ROM
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19.13.5 Flash Memory Emulation in RAM
Reading Overlap RAM Data in User Mode and User Program Mode: Emulatio n should be
performed in user mode or user program mode. When the emulation block set in RAMER is
accessed while the emulation function is bei ng executed, data written in the overlap RAM is read.
Application program
Execution state
Flash memory
Emulation block
RAM
SCI
Overlap RAM
(emulation is performed
on data written in RAM)
Figure 19.33 Reading Overlap RAM Data in User Mode and User Program Mode
Section 19 ROM
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Writing Overlap RAM Data in User Program Mode: When overlap RAM data is confirmed,
the RAMS bit is cleared, RAM overlap is released, and writes should actually be performed to the
flas h me mory.
When the programming control program is transferred to RAM, ensure that the transfer destination
and the overlap RAM do not overlap, as this will cause data in the overlap RAM to be rewritten.
Application program
Flash memory RAM
SCI
Overlap RAM
(programming data)
Programming data
Programming control
program
Execution state
Figure 19.34 Writing Overlap RAM Data in User Program Mode
19.13.6 Differences between Boot Mode and User Program Mode
Table 19.25 Differnces between Boot Mode and User Program Mode
Boot Mode User Program Mode
Entire memor y era se Y es Yes
Block erase No Yes
Programming control program* Program/program-verify Erase/erase-verify/program/
program-verify/emulation
Note: * To be provided by the user, in accordance with the recommended algorithm.
Section 19 ROM
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19.13.7 Block Configuration
On-chip 256-kbyte flash memory is divided into three 64-kbyte blocks, one 32-kbyte block, and
eight 4-kbyte blocks.
Address H'00000
A
ddress H'3FFFF
4 kbytes × 8
32 kbytes
64 kbytes
256 kbytes
64 kbytes
64 kbytes
Figure 19.35 Flash Memory Block Configuration
Section 19 ROM
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19.13.8 Pin Configuration
The flash memory is controlled by means of the pins shown in tables 19.26.
Table 19.26 Flash Memory Pins
Pin Name Abbreviation I/O Function
Reset RES Input Reset
Flash write enable FW E Input Flash program/erase protection by hardware
Mode 2 MD2 Input Sets MCU operating mode
Mode 1 MD1 Input Sets MCU operating mode
Mode 0 MD0 Input Sets MCU operating mode
Port 64 P64 Input Sets MCU operating mode in PROM mode
Port 65 P65 Input Sets MCU operating mode in PROM mode
Port 66 P66 Input Sets MCU operating mode in PROM mode
Transmit data TxD1 Output Serial transmit data output
Receive data RxD1 Input Serial receive data input
Section 19 ROM
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19.13.9 Register Configuration
The registers used to control the on-chip flash memory when enabled are shown in table 19.27.
In order to access the FLMCR1, FLMCR2, EBR1, and EBR2 registers, the FLSHE bit must be set
to 1 in SYSCR2 (except R AME R).
Table 19.27 Flash Memory Registers
Register Name Abbreviation R/W Initial Value Address*1
Flash memory control register 1 FLMCR1*6 R/W*3 H'00/H'80*4 H'FFC8*2
Flash memory control register 2 FLMCR2*6 R/W*3 H'00 H'FFC9*2
Erase block regi ster 1 EBR1*6 R/W*3 H'00*5 H'FFCA*2
Erase block regi ster 2 EBR2*6 R/W*3 H'00*5 H'FFCB*2
System control register 2 SYSCR2*7 R/W H'00 H'FF42
RAM emulation register RAMER R/W H'00 H'FEDB
Notes: 1. Lower 16 bits of the address.
2. Flash memory. Registers selection is performed by the FLSHE bit in system control
register 2 (SYSCR2).
3. In modes in which the on-chip flash memory is disabled, a read will return H'00, and
writes are invalid. Writes are also disabled when the FW E bit is cleared to 0 in
FLMCR1.
4. When a high level is input to the FWE pin, the initial value is H'80.
5. When a low level is input to the FWE pin, or if a high level is input and the SWE bit in
FLMCR1 is not set, these registers are initialized to H'00.
6. FLMCR1, FLMCR2, EBR1, and EBR2 are 8-bit registers. Only byte accesses are valid
for these registers, the access requiring 2 states.
7. The SYSCR2 register can only be used in the F-ZTAT version. In the mask ROM
version this register will return an undefined value if read, and cannot be modified.
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19.14 Register Descriptions
19.14.1 Flash Memory Control Register 1 (FLMCR1)
Bit : 7 6 5 4 3 2 1 0
FWE SWE ESU PSU EV PV E P
Initial value : 1/0 0 0 0 0 0 0 0
R/W : R R/W R/W R/W R/W R/W R/W R/W
FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode
or erase-verify mode is entered by setting SWE to 1 when FWE = 1, then setting the EV or PV bit.
Program mode is entered by setting SWE to 1 when FWE = 1, then setting the PSU bit, and finally
setting the P bit. Erase mode is entered by setting SWE to 1 when FWE = 1, then setting the ESU
bit, and finally setting the E bit. FLMCR1 is initialized by a reset, and in hardware standb y mode
and software standby mode. Its initial value is H'80 when a high level is input to the FWE pin, and
H'00 when a low level is input. When on-chip flash memory is disabled, a read will return H'00,
and writes are invalid.
Writes to the SWE bit in FLM CR1 are enabled only when FWE = 1 ; writes to b its ESU, PSU, EV,
and PV only when FWE = 1 and SWE = 1; writes to the E bit only when FWE = 1, SWE = 1, and
ESU = 1; and writes to the P bit only when FWE = 1, SWE = 1, and PSU = 1.
Bit 7—Flash Write Enable Bit (FWE): Sets hardware prote ctio n against flash memory
programming/erasing.
Bit 7
FWE
Description
0 When a low level is input to the FWE pin (hardware-protected state)
1 When a high level is input to the FWE pin
Bit 6—Software Write Enable Bit (SWE): Enables or disables flash memory programming and
erasing. This bit should be set when setting bits 5 to 0 in FLMCR1, EBR1 bits 7 to 0, and EBR2
bits 3 to 0.
When SWE = 1, the flash memory can only be read in program-verify or erase-verify mode.
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Bit 6
SWE
Description
0 Writes disabled (Initial value)
1 Writes enabled
[Setting condition]
When FWE = 1
Bit 5—Erase Setup Bit (ESU): Prepares for a transition to erase mode. Do not set the SW E, PSU,
EV, PV, E, or P bit at the same time.
Bit 5
ESU
Description
0 Erase setup cleared (Initial value)
1 Erase setup
[Setting condition]
When FWE = 1 and SWE = 1
Bit 4—Program Setup Bit (PSU): Prepares for a transition to program mode. Do not set the
SWE, ESU, EV, PV, E, or P bit at the same time.
Bit 4
PSU
Description
0 Program setup cleared (Initial value)
1 Program setup
[Setting condition]
When FWE = 1 and SWE = 1
Bit 3—Erase-Verify (EV): Selects erase-verify mode transition or clearing. Do not set the SWE,
ESU, PSU, PV, E, or P bit at the same time.
Bit 3
EV
Description
0 Erase-verify mode cleared (Initial value)
1 Transition to erase-verify mode
[Setting condition]
When FWE = 1 and SWE = 1
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Bit 2—Program-Verify (PV): Selects program-verify mode transition or clearing. Do not set the
SWE, ESU, PSU, EV, E, or P bit at the same time.
Bit 2
PV
Description
0 Program-verify mode cleared (Initial value)
1 T r ansitio n to program-v erify m ode
[Setting condition]
When FWE = 1 and SWE = 1
Bit 1—Erase (E): Selects erase mode transition or clearing. Do not set the SWE, ESU, PSU, EV,
PV, or P bit at the same time.
Bit 1
E
Description
0 Erase mode cleared (Initial value)
1 T r ansitio n to erase mode
[Setting condition]
When FWE = 1, SWE = 1, and ESU = 1
Bit 0—Program (P): Selects program mode transition or clearing. Do not set the SWE, PSU,
ESU, EV, PV, or E bit at the same time.
Bit 0
P
Description
0 Program mode cleared (Initial value)
1 T r ansitio n to program mode
[Setting condition]
When FWE = 1, SWE = 1, and PSU = 1
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19.14.2 Flash Memory Control Register 2 (FLMCR2)
Bit : 7 6 5 4 3 2 1 0
FLER — — — — — — —
Initial value : 0 0 0 0 0 0 0 0
R/W : R — — — — — — —
FLMCR2 is an 8-bit register that controls the flash memory operating modes. FLMCR2 is
initialized to H'00 by a reset, and in hardware standby mode and software standby mode.
When on-chip flash memory is disabled, a read will return H'00 and writes are invalid.
Bit 7—Flash Memory Error (FLER): Indicates that an error has occurred during an operation on
flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the error-
protection state.
Bit 7
FLER
Description
0 Flash memory is operating normally (Initial value)
Flash memory program/erase protection (error protection) is disabled
[Clearing condition]
Reset or hardware standby mode
1 An error has occurre d during fl ash me mory progr amming/erasing
Flash memory program/erase protection (error protection) is enabled
[Setting condition]
See section 19.17.3, Error Protection
Bits 6 to 0—Reserved: These bits cannot be modified and are always read as 0.
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19.14.3 Erase Block Register 1 (EBR1)
Bit : 7 6 5 4 3 2 1 0
EBR1 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
EBR1 is an 8-bit register that specifies the flash memory erase area block by block. EBR1 is
initialized to H'00 by a reset, in hardware standby mode and software standby mode, when a low
level is input to the FWE pin, and when a high level is input to the FWE pin and the SWE b it in
FLMCR1 is not set. Whe n a bit in EBR1 is set, the corresponding block can be erased. Other
blocks are erase-protected. Set only one bit in EBR1 and EBR2 together (setting more than one bit
will automatically clear all EBR1 and EBR2 bits to 0). When on-chip flash memory is disabled, a
read will return H'00 and writes are invalid.
The flash memory block configuration is shown in table 19.28.
19.14.4 Erase Block Registers 2 (EBR2)
Bit : 7 6 5 4 3 2 1 0
EBR2 — — — — EB11 EB10 EB9 EB8
Initial value : 0 0 0 0 0 0 0 0
R/W : — — — — R/W R/W R/W R/W
EBR2 is an 8-bit register that specifies the flash memory erase area block by block. EBR2 is
initialized to H'00 by a reset, in hardware standby mode and software standby mode, when a low
level is input to the FWE pin, and when a high level is input to the FWE pin and the SWE b it in
FLMCR1 is not set. Whe n a bit in EBR2 is set, the corresponding block can be erased. Other
blocks are erase-protected. Set only one bit in EBR2 and EBR1 together (setting more than one bit
will automatically clear all EBR1 and EBR2 bits to 0). Bits 7 to 4 are reserved: they are always
read as 0 and cannot be modified. When on-chip flash memory is disabled, a read will return H'00,
and writes are invalid.
The flash memory block configuration is shown in table 19.28.
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Table 19.28 Flash Memory Erase Blocks
Block (Size) Address
EB0 (4 kbytes) H'000000 to H'000FFF
EB1 (4 kbytes) H'001000 to H'001FFF
EB2 (4 kbytes) H'002000 to H'002FFF
EB3 (4 kbytes) H'003000 to H'003FFF
EB4 (4 kbytes) H'004000 to H'004FFF
EB5 (4 kbytes) H'005000 to H'005FFF
EB6 (4 kbytes) H'006000 to H'006FFF
EB7 (4 kbytes) H'007000 to H'007FFF
EB8 (32 kbytes) H'008000 to H'00FFFF
EB9 (64 kbytes) H'010000 to H'01FFFF
EB10 (64 kbytes) H'020000 to H'02FFFF
EB11 (64 kbytes) H'030000 to H'03FFFF
19.14.5 System Control Register 2 (SYSCR2)
Bit : 7 6 5 4 3 2 1 0
— — — — FLSHE — — —
Initial value : 0 0 0 0 0 0 0 0
R/W : — — — — R/W — — —
SYSCR2 is an 8-bit readable/writable register that performs on-chip flash memory control.
SYSCR2 is initial ized to H'00 by a reset and in hardware standby mode.
SYSCR2 can only be used in the F-ZTAT versions. In the mask ROM versions this register will
return an undefined value if read, and cannot be modified.
Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 0.
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Bit 3—Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash
memory control registers (FLMCR1, FLMCR2, EBR1, and EBR2). Writing 1 to the FLSHE bit
enables the flash memory control registers to be read and written to. Clearing FLSHE to 0
designates these registers as unselected (the register contents are retained).
Bit 3
FLSHE
Description
0 Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB
(Initial value)
1 Flash control registers are selected for addresses H'FFFFC8 to H'FFFFCB
Bits 2 to 0—Reserved: These bits cannot be modified and are always read as 0.
19.14.6 RAM Emulation Register (RAMER)
Bit : 7 6 5 4 3 2 1 0
— — — — RAMS RAM2 RAM1 RAM0
Initial value : 0 0 0 0 0 0 0 0
R/W : — — — — R/W R/W R/W R/W
RAMER specifies the area of flash memory to be overlapped with part of RAM when emulating
real-time flash memory programming. RAMER is initialized to H'00 by a reset and in hardware
standby mode. It is not initialized in software standby mode. RAMER se ttings should be made in
user mode or user program mode.
Flash memory area divisions are shown in table 19.29. To ensure correct operation of the
emulation function, the ROM for which RAM emulation is performed should not be accessed
immediately after this register has been modified. Normal execution of an access immediately
after register modification is not guaranteed.
Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 0.
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Bit 3—RAM Select (RAMS): Specifies selection or non-selection of flash memory emulatio n in
RAM. When RAMS = 1, all flash memory blocks are program/erase-protected.
Bit 3
RAMS
Description
0 Emulation not selected (Initial value)
Program/erase-protection of all flash memory blocks is disabled
1 Emulation selected
Program/erase-protection of all flash memory blocks is enabled
Bits 2 to 0—Flash Memory Area Selection (RAM2 to RAM0): These bits are used together
with bit 3 to select the flash memory area to be overlapped with RAM (see table 19.29).
Table 19.29 Flash Memory Area Divisions
RAM Area Block Name RAMS RAM2 RAM1 RAM0
H'FFDC00 to H'FFEBFF RAM area, 4 kbytes 0 * * *
H'000000 to H'000FFF EB0 (4 kbytes) 1 0 0 0
H'001000 to H'001FFF EB1 (4 kbytes) 1 0 0 1
H'002000 to H'002FFF EB2 (4 kbytes) 1 0 1 0
H'003000 to H'003FFF EB3 (4 kbytes) 1 0 1 1
H'004000 to H'004FFF EB4 (4 kbytes) 1 1 0 0
H'005000 to H'005FFF EB5 (4 kbytes) 1 1 0 1
H'006000 to H'006FFF EB6 (4 kbytes) 1 1 1 0
H'007000 to H'007FFF EB7 (4 kbytes) 1 1 1 1
*: Don’t care
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19.15 On-Board Programming Modes
When pins are set to on-board programming mode, program/erase/verify operations can be
performed on the on-chip flash memory. There are two on-board programming modes: boot mode
and user program mode. The pin settings for transition to each of these modes are shown in table
19.30. For a diagram of the transitions to the various flash memory modes, see figure 19.31.
Table 19.30 Setting On-Board Programming Modes
Mode Pins
MCU Mode CPU Operating Mode FWE MD2 MD1 MD0
Boot mode Advanced expanded mode with
on-chip ROM enabled 1 0 1 0
Advanced single-chip mode 1
User program mode* Advanced expanded mode with
on-chip ROM enabled 1 1 1 0
Advanced single-chip mode 1
Note: * Normally, user mode should be used. Set the FWE pin to 1 to make a transition to user
program mode before performing a program/erase/verify operation.
19.15.1 Boot Mode
When boot mode is used, the flash memory programming control program must be prepared in the
host b eforehand. The channel 1 SCI to be used i s set to asynchro nous mode.
When a reset-start is executed after the H8S/2328B F-ZTAT chip’s pins have been set to boot
mode, the boot program built into the chip is started and the programming control program
prepared in the host is serially transmitted to the chip via the SCI. In the chip, the pro gramming
control program received via the SCI is written into the programming control program area in on-
chip RAM. After the transfer is completed, control branches to the start address of the
programming control program area and the programming control program execution state is
entered (flash memory programming is performed).
The transferred programming control program must therefore include coding that follows the
programming algorithm given later.
The system configuration in boot mode is shown in figure 19.36, and the boot program mode
execution procedure in figure 19.37.
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RxD1
TxD1 SCI1
Chip
Flash memory
Write data reception
Verify data transmission
Host
On-chip RAM
Figure 19.36 System Configuration in Boot Mode
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Note: If a memory cell does not operate normally and cannot be erased, one H'FF byte is
transmitted as an erase error, and the erase operation and subsequent operations
are halted.
Start
Set pins to boot mode
and execute reset-start
Host transfers data (H'00)
continuously at prescribed bit rate
Chip measures low period
of H'00 data transmitted by host
Chip calculates bit rate and
sets value in bit rate register
After bit rate adjustment, chip
transmits one H'00 data byte to
host to indicate end of adjustment
Host confirms normal reception
of bit rate adjustment end
indication (H'00), and transmits
one H'55 data byte
After receiving H'55,
chip transmits one H'AA
data byte to host
Host transmits number
of programming control program
bytes (N), upper byte followed
by lower byte
Chip transmits received
number of bytes to host as verify
data (echo-back)
n = 1
Host transmits programming control
program sequentially in byte units
Chip transmits received
programming control program to
host as verify data (echo-back)
Transfer received programming
control program to on-chip RAM
n = N? No
Yes
End of transmission
Check flash memory data, and
if data has already been written,
erase all blocks
After confirming that all flash
memory data has been erased,
chip transmits one H'AA data
byte to host
Execute programming control
program transferred to on-chip RAM
n + 1 → n
Figure 19.37 Boot Mode Execution Procedure
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Automatic SCI Bit Rate Adjustment: When boot mode is initiated, the H8S/2328B F-ZTAT
chip measures the low period of the asynchronous SCI communication data (H'00) transmitted
continuously from the host. The SCI transmit/receive format should be set as follows: 8-bit data, 1
stop bit, no parity. The chip calculates the bit rate of the transmission from the host from the
measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate
adjustment. The host should confirm that this adjustment end indication (H'00) has been received
normally, and transmit one H'55 byte to the chip. If reception cannot be performed normally,
initiate boot mode again (reset), and repeat the above operations. Depending on the host’s
transmission bit rate and the chip’s syste m clock frequency, there will be a discrepancy between
the bit rates of the host and the chip. To ensure correct SCI operation, the host’s transfer bit rate
should be set to 9,600 or 19,200 bps.
Table 19.31 shows typical host transfer bit rates and system clock frequencies for which automatic
adjustment of the MCU’s bit rate is possible. The boot program should be executed within this
system clock range.
Start
bit Stop
bit
D0 D1 D2 D3 D4 D5 D6 D7
Low period (9 bits) measured (H'00 data) High period
(1 or more bits)
Figure 19.38 Automatic SCI Bit Rate Adjustment
Table 19.31 Syst em Clock Frequencies for which Automatic Adjustment
of H8S/2328B F-ZTAT Bit Rate is Possible
Host Bit Rate System Clock Frequencies for which Automatic Adjustment
of H8S/2328B F-ZTAT Bit Rate is Possible
19,200 bps 16 MHz to 25 MHz
9,600 bps 8 MHz to 25 MHz
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On-Chip RAM Area Divisions in Boot Mode: In boot mode, the 2-kbyte area from H'FFDC00
to H'FFE3FF is reserved for use by the boot program, as shown in figure 19.39. The area to which
the programming control program is transferred is H'FFE400 to H'FFFBFF. The boot program
area can be used when the programming control program transferred into RAM enters the
execution state. A stack area should be set up as required.
H'FFDC00
H'FFE3FF
Programming
control program
area
(6 kbytes)
H'FFFBFF
Boot program
area*
(2 kbytes)
Note: * The boot program area cannot be used until a transition is made to the execution state
for the programming control program transferred to RAM. Note that the boot program
remains stored in this area after a branch is made to the programming control program.
Figure 19.39 RAM Areas in Boot Mode
Notes on Use of Boot Mode
• When the chip comes out of reset in boot mode, it measures the low-level period of the input at
the SCI’s RxD1 pin. The reset should end with RxD1 high. After the reset ends, it takes
approximately 100 states before the chip is ready to measure the low-level period of the RxD1
pin.
• In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all
flash memory blocks are erased. Boot mode is for use when user program mode is unavailable,
such as the first time on-board programming is performed, or if the program activated in user
program mode is accidentally erased.
• Interrupts cannot be used while the flash memory is being programmed or erased.
• The RxD1 and TxD1 pins should be pulled up on the board.
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• Before branching to the programming control program (RAM area H'FFE400 to H'FFFBFF),
the chip terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing
the RE and TE bits in SCR to 0), but the adjusted bit rate value remains set in BRR. T he
transmit data output pin, TxD1, goes to the high-level output state (P31DDR = 1, P31DR = 1).
• The contents of the CPU’s internal general registers are undefined at this time, so these
registers must be initialized i m mediately after branching to the programming control program.
In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area
must be specified for use by the programming control program.
• Initial settings must also be made for the other on-chip registers.
• Boot mode can be entered by making the pin settings shown in table 19.30 and executing a
reset-start.
• Boot mode can be cleared by driving the reset pin low, waiting at least 20 states, then setting
the FWE pin and mode pins, and executing reset release*1. Boot mode can also be cleared by a
WDT overfl ow reset.
• Do not change the mode pin input levels in boot mode, and do not drive the FWE pin low
while the boot program is being executed or while flash memory is being programmed or
erased*2.
• If the mode pin input levels are changed (for example, from low to high) during a reset, the
state of ports with multiplexed addr ess functions and bus control o utput pins (AS, RD, HWR)
will change according to the change in the microcomputer’s operating mode*3.
Therefore, care must be taken to make pin settings to prevent these pins from becoming output
signal pins during a reset, or to prevent collision with sig nals outside the microcomputer.
Notes: 1. Mode pins and FWE pin input must satisfy the mode programming setup time (tMDS =
200 ns) with respect to the reset release timing, as shown in figures 19.56 to 19.58.
2. For further information on FWE application and disconnection, see section 19.21,
Flash Memory Programming and Erasing Precautions.
3. See section 9, I/O Ports.
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19.15.2 User Progra m Mode
When set to user program mode, the chip can program and erase its flash memory by executing a
user program/erase control program. Therefore, on-board reprogramming of the on-chip flash
memory can be carried out by providing on-board means of FWE control and supply of
programming data, and storing a program/erase control program in part of the program area as
necessary.
To select user program mode, select a mode that enables the on-chip flash memory (mode 6 or 7),
and apply a high level to the FWE pin. In this mode, on-chip supporting modules other than flash
memory operate as they normally would in modes 6 and 7.
The flash memory itself cannot be read while the SWE bit is set to 1 to perform programming or
erasing, so the control program that performs programming and erasing should be run in on-chip
RAM or external memory. When the program is located in external memory, an instruction for
programming the flash memory and the following instruction should be lo cated in on-chip RAM.
Figure 19.40 shows the procedure for executing the program/erase control program when
transferred to on-chip RAM.
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Clear FWE*
FWE = high*
Branch to flash memory application
program
Branch to program/erase control
program in RAM area
Execute program/erase control
program (flash memory rewriting)
Transfer program/erase control
program to RAM
MD2, MD1, MD0 = 110, 111
Reset-start
Write the FWE assessment program and
transfer program (and the program/erase
control program if necessary) beforehand
Notes: Do not apply a constant high level to the FWE pin. Apply a high level to the FWE pin
only when the flash memory is programmed or erased. Also, while a high level is
applied to the FWE pin, the watchdog timer should be activated to prevent
overprogramming or overerasing due to program runaway, etc.
* For further information on FWE application and disconnection, see section 19.21,
Flash Memory Programming and Erasing Precautions.
Figure 19.40 User Program Mode Execution Procedure
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19.16 Programming/Erasing Flash Memory
In the on-board programming modes, flash memory programming and erasing is performed by
software, using the CPU. There are four flash memory operating modes: program mode, erase
mode, program-verify mode, and erase-verify mode. Transition to these modes can be made for
the on-chip ROM area by setting the PSU, ESU, P, E, PV, and EV bits in FLMCR1.
The flash memory cannot be read while being programmed or erased. Therefore, the program that
controls flash me mory program mi ng/eras i ng (the pr ogramming contro l program) should be
located and executed in on-chip RAM or external memory. When the program is located in
external memory, an instruction for programming the flash memory and the following instruction
should be located in on-chip RAM. The DMAC or DTC should not be activated before or after the
instructi on for p rogrammi ng t he flash memory is executed.
Notes: 1. Op eration is not guaranteed if setting/resetting of the SWE, ESU, PSU, EV, PV, E, and
P bits in FLMCR1 is executed by a program in flash memory.
2. When programming or erasing, set FWE to 1 (programming/erasing will not be
executed if FWE = 0).
3. Perform programming in the erased state. Do not perform additional programming on
previously programmed addresses.
19.16.1 Program Mode
Follow the procedure shown in the program/program-verify flowchart in figure 19.42 to write data
or programs to flash memory. Performing program operations according to this flowchart will
enable data or programs to be written to flash memory without subjecting the device to voltage
stress or sacrificing program data reliab ility. Programming should be carried out 128 bytes at a
time.
For the wait times (x, y, z1, z2, z3, α, ß, γ, ε, η, θ) after bits are set or cleared in flash memory
control register 1 (FLMCR1) and the maximum number of programming operations (N), see
section 22.2.6, Flash Memory Characteristics.
Following the elapse of (x) µs or more after the SWE bit is set to 1 in flash memory control
register 1 (FLMCR1), 128-byte program data is stored in the program data area and reprogram
data area, and the 128-byte data in the reprogram data area is written consecutively to the write
addresses. The lower 8 bits of the first address written to must be H'00 or H'80. 128 consecutive
byte data transfers are performed. The program address and program data are latched in the flash
memory. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this
case, H'FF data must be written to the extra addresses.
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Next, the watchdog timer is set to prevent overprogramming in the event of program runaway, etc.
Set a value greater than (y + z2 + α + β) µs as the WDT overflow period. After this, preparation
for program mode (program setup) is carried out by setting the PSU bit in FLMCR1, and after the
elapse of (y) µs or more, the operating mode is switched to program mode by setting the P bit in
FLMCR1. The time during which the P bit is set is the flash memory program ming ti me. Set the
programming time according to the table in the programming flowchart.
19.16.2 Program-Verify Mode
In program-verify mode, the data written in program mode is read to check whether it has been
correctly written in the flash memory.
After the elapse of a given programming time, the programming mode is ex ited (the P bit in
FLMCR1 is cleared to 0, then the PSU bit is cleared to 0 at least (α) µs later). Next, the watchdog
timer is cleared after the elapse of (β) µs or more, and the operating mode is switched to program-
verify mod e by setting the PV bit in FLMCR1. Before reading in progr am- verify mode, a dumm y
write of H'FF data should be made to the addresses to be read. The dummy write should be
executed after the elapse of (γ) µs or more. When the flash memory is read in this state (verify data
is read in 16-bit units), the data at the latched address is read. Wait at least (ε) µs after the dummy
write before performing this read operation. Next, the originally written data is compared with the
verify data, and reprogram data is computed (see figure 19.41) and transferred to the reprogram
data area. After 128 bytes of data have been verified, exit program-verify mode, wait for at least
(η) µs, then clear the SWE bit in FLMCR1 to 0, and wait again for at least (θ) μs. If
reprogramming is necessary, set program mode again, and repeat the program/program-verify
sequence as before. However, ensure that the program/program-verify sequence is not repeated
more than (N) times on the same bits.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 819 of 1268
REJ09B0220-0600
Start
End of programming
End sub
Set SWE bit in FLMCR1
Wait (x) μs
n = 1
m = 0
Sub-routine-call
See Note 7 for pulse width
Note 7: Write Pulse Width
Start of programming
Sub-routine write pulse
Set PSU bit in FLMCR1
Enable WDT
Set P bit in FLMCR1
Wait (y) μs
Clear P bit in FLMCR1
Wait (z1) μs or (z2) μs or (z3) μs
Clear PSU bit in FLMCR1
Wait (α) μs
Disable WDT
Wait (β) μs
Write pulse application subroutine
NG
NG
NG
NG
NG NG
OK
OK
OK
OK
OK
Wait (γ) μs
Wait (ε) μs
*2
*4
*6
*6
*6
*6
*6
*6
*6
*6*6
*5*6
*6
*6
*6
*6
*1
Set PV bit in FLMCR1
H'FF dummy write to verify address
Read verify data
Additional program data computation
Transfer additional program data to
additional program data area
Read data = verify
data?
*4
*1
*4
*3
Reprogram data computation
Clear PV bit in FLMCR1
Clear SWE bit in FLMCR1
m = 1
128-byte
data verification
completed?
m = 0?
6 ≥ n ?
6 ≥ n ?
Increment address
Programming failure
OK
Clear SWE bit in FLMCR1
n ≥ N?
Write 128-byte data in RAM reprogram
data area consecutively to flash memory
Write pulse
(z1) μs or (z2) μs
Perform programming in the erased state.
Do not perform additional programming
on previously programmed addresses.
RAM
Program data area
(128 bytes)
Reprogram data area
(128 bytes)
Additional program data
area (128 bytes)
Store 128-byte program data in program
data area and reprogram data area
Number of Writes (n)
1
2
3
4
5
6
7
8
9
10
11
12
13
.
.
.
998
999
1000
Write Time (z) μs
z1
z1
z1
z1
z1
z1
z2
z2
z2
z2
z2
z2
z2
.
.
.
z2
z2
z2
Notes: 1. Data transfer is performed by byte transfer. The lower 8 bits of the first
address written to must be H'00 or H'80. A 128-byte data transfer must
be performed even if writing fewer than 128 bytes; in this case, H'FF
data must be written to the extra addresses.
2. Verify data is read in 16-bit (W) units.
3. Even bits for which programming has been completed in the 128-byte
programming loop will be subjected to additional programming if they fail
the subsequent verify operation.
4. A 128-byte area for storing program data, a 128-byte area for storing
reprogram data, and a 128-byte area for storing additional program data
should be provided in RAM. The contents of the reprogram data and
additional program data areas are modified as programming proceeds.
0
1
0
1
0
1
1
0
1
Comments
Programming completed
Programming incomplete; reprogram
Still in erased state; no action
Program Data Operation Chart
Transfer reprogram data to reprogram
data area
n ← n + 1
Note: Use a (z3) µs write pulse for additional
programming.
Sequentially write 128-byte data in
additional program data area in RAM to
flash memory
Write Pulse
(z3) µs additional write pulse
Wait (θ) μs
Wait (η) μs
Wait (θ) μs
5. A write pulse of (z1) or (z2) μs should be applied according to the progress
of programming. See Note 7 for the pulse widths. When the additional program
data is programmed, a write pulse of (z3) μs should be applied. Reprogram data X' stands for reprogram data to which a write pulse has been applied.
6. For the values of x, y, z1, z2, z3, α, β, γ, ε, η, θ, and N, see section 22.2.6, Flash Memory Characteristics.
Original Data
(D) Verify Data
(V) Reprogram Data
(X) 0
1
0
1
0
1
0
1
Comments
Additional programming executed
Additional programming not executed
Additional programming not executed
Additional programming not executed
Additional Program Data Operation Chart
Reprogram
Data (X') Verify Data
(V) Additional
Program Data (Y)
Figure 19.41 Program/Program-Verify Flowchart
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 820 of 1268
REJ09B0220-0600
19.16.3 Erase Mode
Flash memory erasing should be performed block by block following the procedure shown in the
erase/erase-verify flowchart (single-block erase) shown in figure 19.43.
For the wait times (x, y, z, α, ß, γ, ε, η, θ) after bits are set or cleared in flash memory control
register 1 (FLMCR1) and the maximum number of programming operations (N), see section
22.2.6, Flash Memory Characteristics.
To perform data or program erasure, make a 1 bit setting for the flash memory area to be erased in
erase block register 1 or 2 (EBR1 or EBR2 ) at least (x) µs after setting the SWE bit to 1 in flash
memory control register 1 (FLMCR1). Next, the watchdog timer is set to prevent overerasing in
the event of program runaway, etc. Set a value greater than (y + z + α + ß) ms as the WDT
overflow period. After this, preparation for erase mode (erase setup) is carried out by setting the
ESU bit in FLMCR1, and a fter the elapse of (y) µs or more, the operating mode is switched to
erase mode by setting the E bit in FLMCR1. The time during which the E bit is set is the flash
memory erase time. Ensure that the erase time does not exceed (z) ms.
Note: With flash memory erasing, prewriting (setting all data in the memory to be erased to 0) is
not necessary before starting the erase procedure.
19.16.4 Erase-Verify Mode
In erase-verify mode, data is read after memory has been erased to check whether it has been
correctly erased.
After the elapse of the erase time, erase mode is exited (the E bit in FLMCR1 is cleared to 0, then
the ESU bit in FLMCR1 is cleared to 0 at least (α) µs later), the watchdog timer is cleared after
the elapse of (β) µs or more, and the operating mode is switched to erase-verify mode by setting
the EV bit in FLMCR1. Before read ing in erase-verify mode, a dummy write of H'FF data should
be made to the addresses to be read. The dummy write should be executed after the elapse of (γ)
µs or more. When the flash memory is read in this state (verify data is read in 16-bit units) , the
data at the latched address is read. Wait at least (ε) µs after the dummy write before performing
this read operation. If the read data has been erased (all 1), a dummy write is performed to the next
address, and erase-verify is performed. If the read data has not been erased, set erase mode again,
and repeat the erase/erase-verify sequence in the same way. However, ensure that the erase/erase-
verify sequence is not repeated more than (N) times. When verification is completed, exit erase-
verify mode, and wait for at least (η) µs. If erasure has been completed on all the erase blocks,
clear the SWE bit in FLMCR1 to 0 and wait for at least (θ) μs. If there are any unerased blocks,
make a 1 bit setting for the flash memory area to be erased, and repeat the erase/erase-verify
sequence in the same way.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 821 of 1268
REJ09B0220-0600
End of erasing
Start
Set SWE bit in FLMCR1
Set ESU bit in FLMCR1
Set E bit in FLMCR1
Wait (x) μs
Wait (y) μs
n = 1
Set EBR1, EBR2
Enable WDT
*2
*2
*4
Wait (z) ms
*2
Wait (α) μs
*2
Wait (β) μs
*2
Wait (γ) μs
Set block start address to verify address
*2
Wait (ε) μs
*2
*3
*2
Wait (η) μs
*2*2
*5
Start of erase
Clear E bit in FLMCR1
Clear ESU bit in FLMCR1
Set EV bit in FLMCR1
H'FF dummy write to verify address
Read verify data
Clear EV bit in FLMCR1
Wait (η) μs
Clear EV bit in FLMCR1
Clear SWE bit in FLMCR1
Disable WDT
Halt erase
*1
Verify data = all 1?
Last address of block?
End of
erasing of all erase
blocks?
Erase failure
Clear SWE bit in FLMCR1
n ≥ N?
NG
NG
NG NG
OK
OK
OK OK
n ← n + 1
Increment
address
Notes: 1. Prewriting (setting erase block data to all 0) is not necessary.
2. The values of x, y, z, α, β, γ, ε, η, θ, and N are shown in the section 22.2.6, Flash Memory Characteristics.
3. Verify data is read in 16-bit (W) units.
4. Set only one bit in EBR1or EBR2. More than one bit cannot be set.
5. Erasing is performed in block units. To erase a number of blocks, the individual blocks must be erased sequentially.
Wait (θ) μs Wait (θ) μs
Figure 19.42 Erase/Erase-Verify Flowchart
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 822 of 1268
REJ09B0220-0600
19.17 Flash Memory Protection
There are three kinds of flash memory program/erase protection: hardware protection, software
protection, and error protection.
19.17.1 Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly
disabled or aborted . Settings in flash memory control registers 1 and 2 (FLMCR1, FLMCR 2 ) and
erase block registers 1 and 2 (EBR1, EBR2) are reset (see table 19.10).
Table 19.32 Hardware Protection
Functions
Item Description Program Erase
FWE pin protection • When a low level is input to the FWE pin,
FLMCR1, FLMCR2, EBR1, and EBR2 are
initialized, and the program/erase-protected
state is entered.
Yes Yes
Reset/standby
protection • In a reset (including a WDT overflow reset)
and in standby mode, FLMCR1, FLMCR2,
EBR1, and EBR2 are initialized, and the
program/erase-protected state is entered.
• In a reset via the RES pin, the reset state is
not entered unless the RES pin is held low
until oscillation stabilizes after powering on.
In the case of a reset during operation, hold
the RES pin low for the RES pulse width
specified in section 22.2.3, AC
Characteristics.
Yes Yes
19.17.2 Software Protection
Software protection can be implemented by setting the SWE bit in flash memory control register 1
(FLMCR1), erase block registers 1 and 2 (EBR1, EBR2), and the RAMS bit in the RAM
emulation register (RAMER). When software protection is in effect, setting the P o r E bit in
FLMCR1 does not cause a transition to program mode or erase mode (see table 19.33).
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 823 of 1268
REJ09B0220-0600
Table 19.33 Software Protection
Functions
Item Description Program Erase
S WE bit protection • Clearing the SWE bit to 0 in FLMCR1 sets the
program/erase-protected state for all blocks
• (Execute in on-chip RAM or external memory.)
Yes Yes
Block specification
protection • Erase protection can be set for individual
blocks by settings in erase block registers 1
and 2 (EBR1, EBR2).
• Setting EBR1 and EBR2 to H'00 places all
blocks in the erase-prot ect ed s tate.
— Yes
Emulation protection • Setting the RAMS bit to 1 in the RAM emulation
register (RAMER) places all blocks in the
program/erase-protected state.
Yes Yes
19.17.3 Error Protection
In error protection, an error is detected when MCU runaway occurs during flash memory
programming/erasing, or operation is not performed in accordance with the program/erase
algorithm, and the program/erase operation is aborted. Aborting the program/erase operation
prevents damage to the flash memory due to overprogramming or overerasing.
If the MCU malfunctions during flash memory programming/erasing, the FLE R bit is set to 1 in
FLMCR2 and the error protection state is entered. The FLMCR1, FLMCR2, EBR1, and EBR2
settings are retained, but program mode or erase mode is aborted at the point at which the error
occurred. Program mode or erase mode cannot be re-entered by re-setting the P or E bit. However,
PV and EV bit setting is enabled, and a transition can be made to verify mode.
FLER bit setting conditions are as follows:
• When flash memory is read during programming/erasing (including a vector read or instruction
fetch)
• Immediately after exception handling (excluding a reset) during programming/erasing
• When a SLEEP instruction (including software standby) is executed during
programming/erasing
• When a bus master other than the CPU (the DMAC or DTC) has control of the bus during
programming/erasing
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 824 of 1268
REJ09B0220-0600
Error protection is released only by a reset and in hardware standby mode.
Figure 19.43 shows the flash memory state transition diagram.
RD VF PR ER
FLER = 0
Error
occurrence
RES = 0 or STBY = 0
RES = 0 or
STBY = 0
RD VF PR ER
FLER = 0
Normal operating mode
Program mode
Erase mode
Reset or hardware standby
(hardware protection)
RD VF PR ER
FLER = 1 RD VF PR ER
FLER = 1
Error protection mode Error protection mode
(software standby)
Software
standby mode
FLMCR1, FLMCR2 (except FLER
bit), EBR1, EBR2 initialization state
FLMCR1, FLMCR2,
EBR1, EBR2
initialization state
Software standby
mode release
RD: Memory read possible
VF: Verify-read possible
PR: Programming possible
ER: Erasing possible
RD: Memory read not possible
VF: Verify-read not possible
PR: Programming not possible
ER: Erasing not possible
Legend:
RES = 0 or
STBY = 0
Error occurrence
(software standby)
Figure 19.43 Flash Memory State Transitions
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 825 of 1268
REJ09B0220-0600
19.18 Flash Memory Emulation in RAM
19.18.1 Emulation in RAM
Making a setting in the RAM emulation register (RAMER) enables part of RAM to be overlapped
onto the flash memory area so that data to be written to flash memory can be emulated in RAM in
real time. After the RAMER setting has been made, accesses can be made from the flash memory
area or the RAM area overlapping flash memory. Emulation can be performed in user mode and
user program mode. Figure 19.44 shows an example of emulation of real-time flash memory
programming.
Start of emulation program
End of emulation program
Tuning OK?
Yes
No
Set RAMER
Write tuning data to overlap
RAM
Execute application program
Clear RAMER
Write to flash memory emulation
block
Figure 19.44 Flowchart for Flash Memory Emulation in RAM
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 826 of 1268
REJ09B0220-0600
19.18.2 RAM Overlap
An example in which flash memory block area EB1 is overlapped is shown below.
H'00000
H'01000
H'02000
H'03000
H'04000
H'05000
H'06000
H'07000
H'08000
H'3FFFF
Flash memory
EB8 to EB11
This area can be accessed
from both the RAM area
and flash memory area
EB0
EB1
EB2
EB3
EB4
EB5
EB6
EB7
H'FFDC00
H'FFEBFF
H'FFFBFF
On-chip RAM
Figure 19.45 Example of RAM Overlap Operation
Example in which Flash Memory Block Area EB1 is Overlapped
1. Set bits RAMS, RAM2, RAM1, and RAM0 in RAMER to 1, 0, 0, 1, to overlap part of RAM
onto the area (EB1) for which real-time programming is required.
2. Real-time programming is performed using the overlapping RAM.
3. After the program data has been confirmed, the RAMS bit is cleared, releasing RAM overlap.
4. The data written in the overlapping RAM is writte n i nto the flash memory space (EB1).
Notes: 1. When the RAMS bit is set to 1 , program/erase protection is enabled for all blocks
regardless of the value of RAM2, RAM1, and RAM0 (e mulation protection). In this
state, setting the P or E bit in flash memory control register 1 (FLMCR1) will not cause
a transition to program mode or erase mode. When actually programming a flash
memory area, the RAMS bit should be cleared to 0.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 827 of 1268
REJ09B0220-0600
2. A RAM area cannot be erased by execution of software in accordance with the erase
algorithm while flash memory emulation in RAM is being used.
3. Block area EB0 includes the vector table. When performing RAM emulation, the
vector table is needed by the overlap RAM.
19.19 Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including NMI input, are disabled when flash memory is being programmed or
erased (when the P or E bit is set in FLMCR1), and while the boot program is executing in boot
mode*1, to give priority to the program or erase operation. There are three reasons for this:
1. Interrupt during programming or erasing might cause a violation of the programming or
erasing algorithm, with the result that normal operation could not be assured.
2. In the interrupt exception handling sequence during programming or erasing, the vector would
not be read correctly*2, possibly resulting in M CU runa way.
3. If an interrupt occurred during boot program execution, it would not be possible to execute the
normal boot mode sequence.
For these reasons, in on-board pro gramming mode alone there are conditio ns for disabling
interrupts, as an exception to the general rule. However, this provision does not guarantee normal
erasing and programming or MCU operation. All interrupt requests, includin g NMI, must
therefore be restricted inside and outside the MCU when programming or erasing flash memory.
The NMI interrupt is also disabled in the error-protection sta te while the P or E bit remains set in
FLMCR1.
Notes: 1. Interrupt requests must b e disabled inside and outside the MCU until the programming
control program has completed programming.
2. The vector may not be read correctly in this case for the follo wing two reasons:
• If flash memory is read while being programmed or erased (while the P or E bit is
set in FLMCR1), correct read data will not be ob tained (undetermined values will
be returned).
• If the interrupt entry in the vector table has not been programmed yet, interrupt
exception handling will not be executed correctly.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 828 of 1268
REJ09B0220-0600
19.20 Flash Memory PROM Mode
19.20.1 PROM Mode Setting
Programs and data can be written and erased in PROM mode as well as in the on-board
programming modes. In PROM mode, the on-chip ROM can be freely programmed using a
PROM programmer that supports the Renesas microcomputer device type with 256-kbyte on-chip
flash memory (FZTAT256V3A). Flash memory read mode, auto-program mode, auto-erase mode,
and status read mode are supported with this device type. In auto-program mode, auto-erase mode,
and status read mode, a status polling procedure is used, and in status read mode, detailed internal
signals are output after execution of an auto-program or auto-erase operation.
Table 19.34 shows PROM mode p in settings.
Table 19.34 PRO M Mode P in Set tings
Pin Names Settings/External Circuit Connection
Mode pins: MD2, MD1, MD0 Low-level input
Mode setting pins: P66, P65, P64 High-level input to P66, low-level input to P65 and P64
FWE pin High-level input (in auto-program and auto-erase
modes)
STBY pin High-level input (do not select hardware standby mode)
RES pin Reset circuit
XTAL, EXTAL pins Oscillator circuit
Other pins requiring setting: P32, P25 High-level input to P32, low-level input to P25
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 829 of 1268
REJ09B0220-0600
19.20.2 Socket Adapters and Memory Map
In PROM mode, a socket adapter is connected to the chip as shown in figure 19.47. Figure 19.46
shows the on-chip ROM memory map and figure 19.47 shows the socket adapter pin assignments.
H'00000000
MCU mode address PROM mode address
H'0003FFFF
H'00000
H'3FFFF
On-chip
ROM space
256 kbytes
Figure 19.46 Memory Map in PROM Mode
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 830 of 1268
REJ09B0220-0600
H8S/2328B F-ZTAT Socket Adapter
(40-Pin Conversion)
TFP-120 Pin Name
2
3
4
5
7
8
9
10
11
12
13
14
16
17
18
19
20
21
22
43
44
45
46
48
49
50
51
68
69
67
72
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
A
14
A
15
A
16
A
17
A
18
D
8
D
9
D
10
D
11
D
12
D
13
D
14
D
15
CE
OE
WE
FWE
HN27C4096HG (40 Pins)
Pin No. Pin Name
21
22
23
24
25
26
27
28
29
31
32
33
34
35
36
37
38
39
10
19
18
17
16
15
14
13
12
2
20
3
4
1, 40
11, 30
5, 6, 7
8
9
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
A
14
A
15
A
16
A
17
A
18
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
CE
OE
WE
FWE
V
CC
V
SS
NC
A
20
A
19
73
77
78
FP-128B
6
7
8
9
11
12
13
14
15
16
17
18
20
21
22
23
24
25
26
49
50
51
52
54
55
56
57
76
77
75
80
81
85
86
RES
XTAL
EXTAL
NC (OPEN)
1, 30, 33, 52, 55,74,
75, 76, 81, 93, 94
6, 15, 24, 31, 32, 38,
47, 59, 66, 79, 103,
104, 113, 114, 115
5, 34, 39, 58, 61, 82,
83, 84, 89, 103, 104
3, 10, 19, 28, 35, 36,
37, 38, 44, 53, 65,
67, 68, 74, 87, 99,
100, 113, 114, 123,
124, 125
V
CC
V
SS
Reset circuit
Oscillation circuit
Legend:
FWE: Flash write enable
I/O
7
to I/O
0
: Data input/output
A
18
to A
0
: Address input
CE: Chip enable
OE: Output enable
WE: Write enable
*1
*2
Notes: This figure shows pin assignments, and does not show the entire socket adapter circuit.
1. A reset oscillation stabilization time (t
osc1
) of at least 10 ms is required.
2. A 12 MHz crystal resonator should be used.
Other pins
Figure 19.47 H8S/2328B F-ZTAT Socket Adapter Pin Assignments
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 831 of 1268
REJ09B0220-0600
19.20.3 PROM Mode Operation
Table 19.35 shows how the different operating modes are set when using PROM mode, and table
19.36 lists the commands used in PROM mode. Details of each mode are given below.
Memory Read Mode: Memory read mode supports byte reads.
Auto-Program Mode: Auto-program mode supports programming of 128 bytes at a time. Status
polling is used to confirm the end of auto-programming.
Auto-Erase Mode: Auto-erase mode supports automatic erasing of the entire flash memory.
Status polling is used to confir m the end of auto -erasi ng.
Status Read Mode: Status polling is used for auto-progra mming and auto-erasi ng, and normal
termination can be confirmed by reading the I/O6 signal. In status read mode, error information is
output if an error occurs.
Table 19.35 Settings for Each O perating Mode in PROM Mode
Pin Names
Mode FWE CE OE WE I/O7 to I/O0 A
18 to A0
Read H or L L L H Data output Ain
Output disable H or L L H H Hi-Z X
Command write H or L*3 L H L Data input Ain*2
Chip disable*1 H o r L H X X Hi-Z X
Legend:
H: High level
L: Low level
Hi-Z: High impedance
X: Don’t care
Notes: 1. Chip disable is not a standby state; internally, it is an operation state.
2. Ain indicates that there is also address input in auto-program mode.
3. For command writes when making a transition to auto-program or auto-erase mode,
input a high level to the FWE pin.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 832 of 1268
REJ09B0220-0600
Table 19.36 PRO M Mode Co mmands
Number 1st Cycle 2nd Cycle
Command Name of Cycles Mode Address Data Mode Address Data
Memory read mode 1 + n Write X H'00 Read RA Dout
Auto-program mode 129 Write X H'40 Write PA Din
Auto-erase mode 2 Write X H'20 Write X H'20
Status read mode 2 Write X H'71 Write X H'71
Legend:
RA: Read address
PA: Program address
Notes: 1. In auto-program mode, 129 cycles are required for command writing by a simultaneous
128-byte write.
2. In memory read mode, the number of cycles depends on the number of address write
cycles (n).
19.20.4 Memory Read Mode
• After the end of an auto-program, auto-erase, or status read operation, the command wait state
is entered. To read memory contents, a transition must be made to memory read mode by
means of a command write before the read is executed.
• Command writes can be performed in memory read mode, just as in the command wait state.
• Once memory read mode has been entered, consecutive reads can be performed.
• After power-on, memory read mode is entered.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 833 of 1268
REJ09B0220-0600
Table 19.37 AC Characteristics in Memory Read Mode
Condition s: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Command write cycle tnxtc 20 — µs
CE hold time tceh 0 — ns
CE setup time tces 0 — ns
Data hold time tdh 50 — ns
Data setup time tds 50 — ns
Write pulse width twep 70 — ns
WE rise time tr — 30 ns
WE fall time tf — 30 ns
CE
A
18 to A0
Data H'00
OE
WE
Command write
twep tceh
tdh
tds
tftr
tnxtc
Note: Data is latched at the rising edge of WE.
tces
Memory read mode
Address stable
Data
Figure 19.48 Memory Read Mode Timing Waveforms after Command Write
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 834 of 1268
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Table 19.38 AC Characteristics when Entering Another Mode from Memory Read Mode
Condition s: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Command write cycle tnxtc 20 — µs
CE hold time tceh 0 — ns
CE setup time tces 0 — ns
Data hold time tdh 50 — ns
Data setup time tds 50 — ns
Write pulse width twep 70 — ns
WE rise time tr — 30 ns
WE fall time tf — 30 ns
CE
A
18
to A
0
I/O
7
to I/O
0
OE
WE
Other mode command write
t
ceh
t
ds
t
dh
t
f
t
r
t
nxtc
Note: Do not enable WE and OE at the same time.
t
ces
t
wep
Memory read mode
Address stable
Figure 19.49 Timing Waveforms when Entering Another Mode from Memory Read Mode
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 835 of 1268
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Table 19.39 AC Characteristics in Memory Read Mode
Condition s: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Access tim e tacc — 20 µs
CE output delay time tce — 150 ns
OE output delay time toe — 150 ns
Output disable delay time tdf — 100 ns
Data output hold time toh 5 — ns
CE
A
18
to A
0
I/O
7
to I/O
0
OE
WE VIH
VIL
VIL
t
acc
t
oh
t
oh
t
acc
Address stable Address stable
Figure 19.50 Timing Waveforms for CE/OE Enable State Read
CE
A18 to A0
I/O7 to I/O0
VIH
OE
WE
tce
tacc
toe
toh toh tdf
tce
tacc
toe
Address stable Address stable
tdf
Figure 19.51 Timing Waveforms for CE/OE Clocked Read
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 836 of 1268
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19.20.5 Auto-Program Mode
• In auto-program mode, 128 bytes are programmed simultaneously. For this purpose, 128
consecutive byte data transfers should be performed.
• A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case,
H'FF data must be written to the extra addresses.
• The lower 7 bits of the transfer addr ess must be held low. If an invalid address is input,
memory programming will be started but a programming error will occur.
• Memory address transfer is executed in the second cycle (figure 19.52). Do not perform
transfer later than the second cycle.
• Do not perform a command write during a programming operation.
• Perform one auto-programming operation for a 128-byte block for each address. One or more
additional programming operations cannot be carried o ut on add r ess b lo c ks that have already
been programmed.
• Confirm normal end of auto-programming by checking I/O6. Alternatively, status read mode
can also be used for this purpose (the I/O7 status polling pin is used to identify the end of an
auto-program operation).
• Status polling I/O6 and I/O7 information is retained until the next command write. As long as
the next command write has not been performed, reading is possible by enabling CE and OE.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 837 of 1268
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AC Characteristics
Table 19.40 AC Characteristics in Auto-Program Mode
Condition s: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Command write cycle tnxtc 20 — µs
CE hold time tceh 0 — ns
CE setup time tces 0 — ns
Data hold time t dh 50 — ns
Data setup time tds 50 — ns
Write pulse width twep 70 — ns
Status polling start time twsts 1 — ms
Status polling access time tspa — 150 ns
Address setup time tas 0 — ns
Address hold time tah 60 — ns
Memory write time twrite 1 3000 ms
WE rise time tr — 30 ns
WE fall time tf — 30 ns
Write setup time tpns 100 — ns
Write end setup time tpnh 100 — ns
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 838 of 1268
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Address stable
CE
FWE
A
18
to A
0
I/O
5
to I/O
0
I/O
6
I/O
7
OE
WE
t
as
t
ah
t
dh
t
ds
t
f
t
r
t
wep
t
wsts
t
write
t
spa
t
pns
t
pnh
t
nxtc
t
nxtc
t
ceh
t
ces
Programming operation
end identification signal
Data transfer
1 byte to 128 bytes
H'40 H'00
Programming normal
end identification signal
Figure 19.52 Auto-Program Mode Timing Waveforms
19.20.6 Auto-Erase Mode
• Auto-erase mode supports only total memory erasing.
• Do not pe rfor m a c ommand write d uring auto-erasing.
• Confirm normal end of auto-erasing by checking I/O6. Alternatively, status read mode can
also be used for this purpose (the I/O7 status polling pin is used to identify the end of an auto-
erase operation).
• Status polling I/O6 and I/O7 pin information is retained until the next command write. As long
as the next command write has not been performed, reading is possible by enabling CE and OE.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 839 of 1268
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AC Characteristics
Table 19.41 AC Characteristics in Auto-Erase Mode
Condition s: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Command write cycle tnxtc 20 — µs
CE hold time tceh 0 — ns
CE setup time tces 0 — ns
Data hold time t dh 50 — ns
Data setup time tds 50 — ns
Write pulse width twep 70 — ns
Status polling start time tests 1 — ms
Status polling access time tspa — 150 ns
Memory erase time terase 100 40000 ms
WE rise time tr — 30 ns
WE fall time tf — 30 ns
Erase setup time tens 100 — ns
Erase end setup time tenh 100 — ns
CE
FWE
A
18
to A
0
I/O
5
to I/O
0
I/O
6
I/O
7
OE
WE
t
ests
t
erase
t
spa
t
dh
t
ds
t
f
t
r
t
wep
t
ens
t
enh
t
nxtc
t
nxtc
t
ceh
t
ces
Erase end identifi-
cation signal
Erase normal end
confirmation signal
H'20 H'20 H'00
Figure 19.53 Auto-Erase Mode Timing Waveforms
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 840 of 1268
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19.20.7 Status Read Mode
• Status read mode is used to identify what type of abnormal end has occurred. Use this mode
when an abnormal end occurs in auto-program mode or auto-erase mode.
• The return code is retained until a command write for other than status read mode is
performed.
Table 19.42 AC Characteristics in Status Read Mode
Condition s: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Command write cycle tnxtc 20 — µs
CE hold time tceh 0 — ns
CE setup time tces 0 — ns
Data hold time t dh 50 — ns
Data setup time tds 50 — ns
Write pulse width twep 70 — ns
OE output delay time toe — 150 ns
Disabl e delay time tdf — 100 ns
CE output delay time tce — 150 ns
WE rise time tr — 30 ns
WE fall time tf — 30 ns
CE
A
18
to A
0
I/O
7
to I/O
0
OE
WE
t
dh
t
df
t
ds
t
f
t
r
t
wep
t
nxtc
t
nxtc
t
f
t
r
t
wep
t
ds
t
dh
t
nxtc
t
ceh
t
ceh
t
oe
t
ces
t
ces
t
ce
H'71 H'71
Note: I/O
3
and I/O
2
are undefined.
Figure 19.54 Status Read Mode Timing Waveforms
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 841 of 1268
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Table 19.4 3 Status Read Mode Return Commands
Pin Name I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0
Attribute Normal
end
identification
Command
error Program-
ming error Erase
error — — Program-
ming or
erase count
exceeded
Effective
address error
Initial value 0 0 0 0 0 0 0 0
Indications Normal
end: 0
Abnormal
end: 1
Command
error: 1
Otherwise: 0
Program-
ming
error: 1
Otherwise: 0
Erase
error: 1
Otherwise: 0
— — Count
exceeded: 1
Otherwise: 0
Effective
address
error: 1
Otherwise: 0
Note: I/O3 and I/O2 are undefined.
19.20.8 Status Polling
• The I/O7 status polling flag indicates the operating status in auto-program or auto-erase mode.
• The I/O6 status polling flag indicates a normal or abnormal end in auto-program or auto-erase
mode.
Table 19.4 4 Status Polling Output Truth Table
Pin Names Internal Operation
in Progress
Abnormal End
—
Normal End
I/O7 0 1 0 1
I/O6 0 0 1 1
I/O0 to I/O5 0 0 0 0
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 842 of 1268
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19.20.9 PROM Mode Transition Time
Commands cannot be accepted during the oscillatio n stabilization period or the PROM mode setup
period. After the PROM mode setup time, a transition is made to memory read mode.
Table 19.45 Command Wait State Transition Time Specifications
Item Symbol Min Max Unit
Standby release (oscillation
stabilization time) tosc1 30 — ms
PROM mode setup time tbmv 10 — ms
VCC hold time tdwn 0 — ms
V
CC
RES
FWE
Memory read
mode
Command
wait state
Command
wait state
Normal/
abnormal end
identification
Auto-program mode
Auto-erase mode
t
osc1
t
bmv
t
dwn
Note: Except in auto-program mode and auto-erase mode, drive the FWE input pin low.
Figure 19.55 Oscillation Stabilization Time, PROM Mode Setup Time, and Power Supply
Fall Sequence
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 843 of 1268
REJ09B0220-0600
19.20.10 Notes on Memory Programming
• When programming addresses which have previously been programmed, carry out auto-
era s ing b efore auto-programming.
• When performing programming using PROM mode on a chip that has been
programmed/erased in an on-board programming mode, auto-erasing is recommended before
carrying out auto-programming.
Notes: 1. The flash memory is initially in the erased state when the device is shipped by Renesas
Technology. For other chips for which the erasure history is unknown, it is
recommended that auto-erasing be executed to check and supplement the initialization
(erase) level.
2. Auto-programming should be performed once only on the same address block.
Additional programming cannot be carried out on address blocks that have already
been programmed.
19.21 Flash Memory Programming and Erasing Precautions
Precautions concerning the use of on-board programming mode, the RAM emulation function, and
PROM mode are summarized below.
Use the specified v oltages a nd ti ming fo r progra mming and erasing: Applied voltages in
excess of the rating can permanently damage the device. Use a PROM programmer that supports
the Renesas microcomputer device type with 256-kbyte on-chip flash memory (FZTAT256V3A).
Do not select the HN27C4096 setting for the PROM programmer, and only use the specified
socket adapter. Failure to observe these points may result in damage to the device.
Powering on and off (see figures 19.56 to 19.58): Do not apply a high level to the FWE pin until
VCC has stabilized. Also, d r ive the FWE pin low before turning off VCC.
When applying or disconnecting VCC power, fix the FWE pin low and place the flash memory in
the hardware protection state.
The power-on and power-off timing requirements should also be satisfied in the event of a power
failure and subsequent recovery.
FWE application/disconnection (see figures 19.56 to 19.58): FWE application should be carried
out when MCU operation is in a stable co nditio n. If MCU op e ratio n is not stab le, fix the FW E p in
low and set the protection state.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 844 of 1268
REJ09B0220-0600
The following points must be observed concerning FWE application and disconnection to prevent
unintenti onal programming or erasing of flash memor y:
• Apply FWE when the VCC voltage has stab ilized within its rated voltage range.
• Apply FWE when oscillation has stabilized (after the elapse of the oscillation stabilization
time).
• In boot mode, apply and disconnect FWE during a reset.
• In user program mode, FWE can be switched between high and low level regardless of the
reset state. FWE input can also be switched during execution of a program in flash memory.
• Do not apply FWE if program runaway has occurred.
• Disconnect FWE only when the SWE, ESU, PSU, EV, PV, P, and E bits in FLMCR1 are
cleared.
Make sure that the SWE, ESU, PSU, EV, PV, P, and E bits are not set by mistake when
applying or disconnecting FWE.
Do not a pply a constant high level to t he F WE pin: Apply a high level to the FWE pin o nl y
when programming or erasing flash memory. A system configuration in which a high level is
constantly applied to the FWE pin should be avoid e d. Also, while a high level is applied to the
FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due
to program runaway, etc.
Use the recommended algorithm when programming and erasing flash memory: The
recommended algorithm enables programming and erasing to be carried out without subjecting the
device to voltage stress or sacrificing program data reliabilit y. W hen setting the P or E bit in
FLMCR1, the watchdog timer should be set beforehand as a precaution against program runaway,
etc.
Do not set o r clear the SWE bit during execution of a prog ram in flash memory: Wait for at
least 100 µs after clearing the SWE bit before executing a program or reading data in flash
memory. When the SWE bit is set, data in flash memory can be rewritten, but when SWE = 1,
flash memory can only be read in program-verify or erase-verify mode. Access flash memory only
for verify operations (verification during programming/erasing). Also, do not clear the SWE bit
during programming, erasing, or verifying.
Similarly, when using the RAM emulation function while a high level is being input to the FWE
pin, the SWE bit must be cleared before executing a program or reading data in flash memory.
However, the RAM area overlapping flash memory space can be read and written to regardless of
whether the SWE bit is set or cleared.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 845 of 1268
REJ09B0220-0600
Do not use interrupts while flash memory is being programmed or erased: All interrupt
requests, including NMI, should be disabled during FWE applicatio n to give pr iority to
program/erase operations.
Do not perform additional programming. Erase the memory before reprogramming: In on-
board programming, perform only one programming operation on a 128-byte programming unit
block. In PROM mode, too, perform only one programming operation on a 128-byte programming
unit block. Programming should be carried out with the entire programming unit block erased.
Before programming, check that the chip is correctly mounted in the PROM programmer:
Overcurrent damage to the device can result if the index marks on the PROM programmer socket,
socket adapter, and chip are not correctly aligned.
Do not to uch t he so cket adapt er or chip during programming: To uching either of these can
cause contact faults and write errors.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 846 of 1268
REJ09B0220-0600
Period during which flash memory access is prohibited
(x: Wait time after setting SWE bit)
*2
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
φ
V
CC
FWE
t
OSC1
Min 0 μs
Min 0 μs
t
MDS*3
t
MDS*3
MD2 to MD0
*1
RES
SWE bit SWE set SWE cleared
Programming/
erasing
possible
Wait time: x Wait time: 100 μs
Notes: 1. Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until
power-off by pulling the pins up or down.
2. See section 22.2.6, Flash Memory Characteristics.
3. Mode programming setup time t
MDS
(min) = 200 ns
Figure 19.56 Power-On/Off Timing (Boot Mode)
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 847 of 1268
REJ09B0220-0600
SWE set SWE cleared
φ
V
CC
FWE
t
OSC1
Min 0 μs
MD2 to MD0
*1
RES
SWE bit
Programming/
erasing
possible
Wait time: x Wait time: 100 μs
t
MDS*3
Period during which flash memory access is prohibited
(x: Wait time after setting SWE bit)
*2
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
Notes: 1. Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until
power-off by pulling the pins up or down.
2. See section 22.2.6, Flash Memory Characteristics.
3. Mode programming setup time t
MDS
(min) = 200 ns
Figure 19.57 Power-On/Off Timing (User Program Mode)
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 848 of 1268
REJ09B0220-0600
Period during which flash memory access is prohibited
(x: Wait time after setting SWE bit)
*3
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations prohibited)
φ
V
CC
FWE
t
OSC1
Min 0 μs
t
MDS
t
MDS
t
MDS*2
t
RESW
MD2 to MD0
RES
SWE bit
Mode
change
*1
Mode
change
*1
Boot
mode User
mode User program mode
SWE
set SWE
cleared
Programming/erasing
possible
Wait time: x
Wait time: 100 μs
Programming/erasing
possible
Wait time: x
Wait time: 100 μs
Programming/erasing
possible
Wait time: x
Wait time: 100 μs
Programming/erasing
possible
Wait time: x
Wait time: 100 μs
User
mode User program
mode
Notes: 1. When entering boot mode or making a transition from boot mode to another mode, mode switching must be
carried out by means of RES input. The state of ports with multiplexed address functions and bus control
output pins (AS, RD, WR) will change during this switchover interval (the interval during which the RES pin
input is low), and therefore these pins should not be used as output signals during this time.
2. When making a transition from boot mode to another mode, a mode programming setup time t
MDS
(min) of 200
ns is necessary with respect to RES clearance timing.
3. See section 22.2.6, Flash Memory Characteristics.
Figure 19.58 Mode Transition Timing
(Example: Boot Mode → User Mode ↔ User Program Mode)
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 849 of 1268
REJ09B0220-0600
19.22 Overview of Flash Memory (H8S/2326 F-ZTAT)
19.22.1 Features
The H8S/2326 F-ZTAT has 512 kbytes of on-chip flash memory. The features of the flash
memory are summarized below.
• Four flash memory operating modes
⎯ Program mode
⎯ Erase mode
⎯ Program-verify mode
⎯ Erase-verify mode
• Programming/erase methods
The flash memory is programmed 128 bytes at a time. Erasing is performed by block erase (in
single-block units). To erase the entire flash memory, the individual blocks must be erased
sequentially. Block erasing can be performed as required on 4-kbyte, 32-kbyte, and 64-kbyte
blocks.
• Progra mming/e ras e ti mes
The flash memory programming time is 10.0 ms (typ.) for simultaneous 128-byte
programming, equivalent to 78 μs (typ.) per byte, and the erase time is 50 ms (typ.).
• Reprogramming capability
The flash memory can be reprogrammed minimum 100 times.
• On-board programming modes
There are two modes in which flash memory can be programmed/erased/verified on-board:
⎯ Boot mode
⎯ User program mode
• Automatic bit rate adjustment
With data transfer in boot mode, the bit rate of the chip can be automatically adjusted to match
the transfer bit rate of the host.
• Flash memory emulation by RAM
Part of the RAM area can be overlapped onto flash memory, to emulate flash memory updates
in real time.
• Protect modes
There are three protect modes, hardware, software, and error protect, which allow protected
status to be designated for flash memory program/erase/verify operations.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 850 of 1268
REJ09B0220-0600
• PROM mode
Flash memory can be programmed/erased in PROM mode, using a PROM programmer, as
well as in on-board programming mode.
19.22.2 Overview
Block Diagram
Module bus
Bus interface/controller
Flash memory
(512 kbytes)
Operating
mode
EBR1
Internal address bus
Internal data bus (16 bits)
FWE pin
Mode pins
EBR2
SYSCR2
FLMCR2
FLMCR1
RAMER
Legend:
FLMCR1: Flash memory control register 1
FLMCR2: Flash memory control register 2
EBR1: Erase block register 1
EBR2: Erase block register 2
RAMER: RAM emulation register
SYSCR2: System control register 2
Figure 19.59 Block Diagram of Flash Memory
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 851 of 1268
REJ09B0220-0600
19.22.3 Flash Memory Operating Modes
Mode Transitions: When the mode pins and the FWE pin are set in the reset state and a reset-
start is executed, the chip enters one of the operating modes shown in figure 19.60. In user mode,
flash memory can be read but not programmed or erased.
Flash memory can be programmed and erased in boot mode, user program mode, and PROM
mode.
Boot mode
On-board programming mode
User
program mode
User mode
(on-chip ROM
enabled)
Reset state
PROM mode
RES = 0
FWE = 1,
SWE = 1
FWE = 0
or SWE = 0
*
Notes: Only make a transition between user mode and user program mode when the CPU is
not accessing the flash memory.
* MD0 = 0, MD1 = 0, MD2 = 0, P66 = 1, P65 = 0, P64 = 0
RES = 0
RES = 0
RES = 0
MD1 = 1,
MD2 = 1,
FWE = 0
FWE = 1,
MD1 = 1,
MD2 = 0
Figure 19.60 Flash Memory Mode Transitions
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 852 of 1268
REJ09B0220-0600
19.22.4 On-Board Programming Modes
• Boot mode
Flash memory
Chip
RAM
Host
Programming control
program
SCI
Application program
(old version)
New application
program
Flash memory
Chip
RAM
Host
SCI
Application program
(old version)
Boot program area
New application
program
Flash memory
Chip
RAM
Host
SCI
Flash memory
prewrite-erase
Boot program
New application
program
Flash memory
Chip
Program execution state
RAM
Host
SCI
New application
program
Boot program
Programming control
program
1. Initial state
The old program version or data remains written
in the flash memory. The user should prepare the
programming control program and new
application program beforehand in the host.
2. Programming control program transfer
When boot mode is entered, the boot program in
the chip (originally incorporated in the chip) is
started and the programming control program in
the host is transferred to RAM via SCI
communication. The boot program required for
flash memory erasing is automatically transferred
to the RAM boot program area.
3. Flash memory initialization
The erase program in the boot program area (in
RAM) is executed, and the flash memory is
initialized (to H'FF). In boot mode, entire flash
memory erasure is performed, without regard to
blocks.
4. Writing new application program
The programming control program transferred
from the host to RAM is executed, and the new
application program in the host is written into the
flash memory.
Programming control
program
Boot programBoot program
Boot program area Boot program area
Programming control
program
Figure 19.61 Boot Mode
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 853 of 1268
REJ09B0220-0600
• User program mode
Flash memory
Chip
Chip
RAM
Host
Programming/
erase control program
SCI
Boot program
New application
program
Flash memory RAM
Host
SCI
New application
program
Flash memory RAM
Host
SCI
Flash memory
erase
Boot program
New application
program
Flash memory
Program execution state
RAM
Host
SCI
Boot program
Boot program
FWE assessment
program
Application program
(old version)
New application
program
1. Initial state
(1) The FWE assessment program that confirms
that the FWE pin has been driven high, and (2)
the program that will transfer the programming/
erase control program to on-chip RAM should be
written into the flash memory by the user
beforehand. (3) The programming/erase control
program should be prepared in the host or in the
flash memory.
2. Programming/erase control program transfer
When the FWE pin is driven high, user software
confirms this fact, executes the transfer program
in the flash memory, and transfers the
programming/erase control program to RAM.
3. Flash memory initialization
The programming/erase program in RAM is
executed, and the flash memory is initialized (to
H'FF). Erasing can be performed in block units,
but not in byte units.
4. Writing new application program
Next, the new application program in the host is
written into the erased flash memory blocks. Do
not write to unerased blocks.
Programming/
erase control program
Programming/
erase control program
Programming/
erase control program
Transfer program
Application program
(old version)
Transfer program
FWE assessment
program
FWE assessment
program
Transfer program
FWE assessment
program
Transfer program
Chip
Chip
Figure 19.62 User Program Mode (Example)
Section 19 ROM
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19.22.5 Flash Memory Emulation in RAM
Reading Overlap RAM Data in User Mode and User Program Mode: Emulatio n should be
performed in user mode or user program mode. When the emulation block set in RAMER is
accessed while the emulation function is bei ng executed, data written in the overlap RAM is read.
Application program
Execution state
Flash memory
Emulation block
RAM
SCI
Overlap RAM
(emulation is performed
on data written in RAM)
Figure 19.63 Reading Overlap RAM Data in User Mode and User Program Mode
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Writing Overlap RAM Data in User Program Mode: When overlap RAM data is confirmed,
the RAMS bit is cleared, RAM overlap is released, and writes should actually be performed to the
flas h me mory.
When the programming control program is transferred to RAM, ensure that the transfer destination
and the overlap RAM do not overlap, as this will cause data in the overlap RAM to be rewritten.
Application program
Flash memory RAM
SCI
Overlap RAM
(programming data)
Programming data
Programming control
program
Execution state
Figure 19.64 Writing Overlap RAM Data in User Program Mode
19.22.6 Differences between Boot Mode and User Program Mode
Table 19.46 Differnces between Boot Mode and User Program Mode
Boot Mode User Program Mode
Entire memor y era se Y es Yes
Block erase No Yes
Programming control program* Program/program-verify Erase/erase-verify/program/
program-verify/emulation
Note: * To be provided by the user, in accordance with the recommended algorithm.
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19.22.7 Block Configuration
On-chip 512-kbyte flash memory is divided into seven 64-kbyte blocks, one 32-kbyte block, and
eight 4-kbyte blocks.
A
ddress H'07FFFF
Address H'000000
512 kbytes
64 kbytes
64 kbytes
64 kbytes
64 kbytes
64 kbytes
64 kbytes
64 kbytes
32 kbytes
4 kbytes × 8
Figure 19.65 Flash Memory Block Configuration
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19.22.8 Pin Configuration
The flash memory is controlled by means of the pins shown in tables 19.47.
Table 19.47 Flash Memory Pins
Pin Name Abbreviation I/O Function
Reset RES Input Reset
Flash write enable FW E Input Flash program/erase protection by hardware
Mode 2 MD2 Input Sets MCU operating mode
Mode 1 MD1 Input Sets MCU operating mode
Mode 0 MD0 Input Sets MCU operating mode
Port 64 P64 Input Sets MCU operating mode in PROM mode
Port 65 P65 Input Sets MCU operating mode in PROM mode
Port 66 P66 Input Sets MCU operating mode in PROM mode
Transmit data TxD1 Output Serial transmit data output
Receive data RxD1 Input Serial receive data input
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19.22.9 Register Configuration
The registers used to control the on-chip flash memory when enabled are shown in table 19.48.
In order to access the FLMCR1, FLMCR2, EBR1, and EBR2 registers, the FLSHE bit must be set
to 1 in SYSCR2 (except R AME R).
Table 19.48 Flash Memory Registers
Register Name Abbreviation R/W Initial Value Address*1
Flash memory control register 1 FLMCR1*6 R/W*3 H'00/H'80*4 H'FFC8*2
Flash memory control register 2 FLMCR2*6 R/W*3 H'00 H'FFC9*2
Erase block regi ster 1 EBR1*6 R/W*3 H'00*5 H'FFCA*2
Erase block regi ster 2 EBR2*6 R/W*3 H'00*5 H'FFCB*2
System control register 2 SYSCR2*7 R/W H'00 H'FF42
RAM emulation register RAMER R/W H'00 H'FEDB
Notes: 1. Lower 16 bits of the address.
2. Flash memory. Registers selection is performed by the FLSHE bit in system control
register 2 (SYSCR2).
3. In modes in which the on-chip flash memory is disabled, a read will return H'00, and
writes are invalid. Writes are also disabled when the FW E bit is cleared to 0 in
FLMCR1.
4. When a high level is input to the FWE pin, the initial value is H'80.
5. When a low level is input to the FWE pin, or if a high level is input and the SWE1 bit in
FLMCR1 is not set, bits EB11 to EB0 are initialized to 0, and if the SWE2 bit is not set,
bits EB15 to EB12 are initialized to 0.
6. FLMCR1, FLMCR2, EBR1, and EBR2 are 8-bit registers. Only byte accesses are valid
for these registers, the access requiring 2 states.
7. The SYSCR2 register can only be used in the F-ZTAT versions. In the mask ROM
versions this register will return an undefined value if read, and cannot be modified.
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19.23 Register Descriptions
19.23.1 Flash Memory Control Register 1 (FLMCR1)
Bit : 7 6 5 4 3 2 1 0
FWE SWE1 ESU1 PSU1 EV1 PV1 E1 P1
Initial value : 1/0 0 0 0 0 0 0 0
R/W : R R/W R/W R/W R/W R/W R/W R/W
FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode
or erase-verify mode for addresses H'000000 to H'03FFFF is entered by setting SWE1 to 1 when
FWE = 1, then setting the EV1 or PV1 bit. Program mode for addresses H'000000 to H'03FFFF is
entered by setting SWE1 to 1 when FWE = 1, then settin g the PSU1 bit, and finally setting the P1
bit. Erase mode for addresses H'000000 to H'03FFFF is entered by setting SWE1 to 1 when FWE
= 1, then setting the ESU1 bit, and finally setting the E1 bit. FLMCR1 is initialized by a reset, and
in hardware standby mode and software standby mode. The initial value is H'80 when a high level
is input to the FWE pin, and H'00 when a lo w level is input. When on-c hip flash memory is
disabled, a read will return H'00, and writes are invalid.
Writes to the SWE1 b it in FLMCR1 are valid only when FWE = 1 ;
writes to the ESU1, PSU1, EV1, and PV1 bits only when FWE = 1 and SWE1 = 1;
writes to the E1 bit only when FWE = 1, SWE1 = 1, and ESU1 = 1;
and writes to the P1 bit only when FWE = 1, SWE1 = 1, and PSU1 = 1.
Bit 7—Flash Write Enable Bit (FWE): Sets hardware prote ctio n against flash memory
programming/erasing.
Bit 7
FWE
Description
0 When a low level is input to the FWE pin (hardware-protected state)
1 When a high level is input to the FWE pin
Bit 6—Software Write Enable Bit 1 (SWE1): Enables or disables flash memory programming
and erasing for addresses H'000000 to H'03FFFF. This bit should be set when setting bits 5 to 0 in
FLMCR1, EB R1 bits 7 to 0, and EBR2 b its 3 to 0.
When SWE1 = 1, the flash memory can only be read in program-verify or erase-verify mode.
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Bit 6
SWE1
Description
0 Writes disabled (Initial value)
1 Writes enabled
[Setting condition]
When FWE = 1
Bit 5—Erase Setup Bit 1 (ESU1): Prepares for a transition to erase mode for addresses H'000000
to H'03FFFF. Do not set the SWE1, PSU1, EV1, PV1, E1, or P1 bit at the same time.
Bit 5
ESU1
Description
0 Erase setup cleared (Initial value)
1 Erase setup
[Setting condition]
When FWE = 1, SWE1 = 1
Bit 4—Program Setup Bit 1 (PSU1): Prepares for a transition to program mode for addresses
H'000000 to H'03FFFF. Do not set the SWE1, ESU1, EV1, PV1, E1, or P1 bit at the same time.
Bit 4
PSU1
Description
0 Program setup cleared (Initial value)
1 Program setup
[Setting condition]
When FWE = 1, SWE1 = 1
Bit 3—Erase-Verify 1 (EV1): Selects erase-verify mode transition or clearing for addresses
H'000000 to H'03FFFF. Do not set the SWE1, ESU1, PSU1, PV1, E1, or P1 bit at the same time.
Bit 3
EV1
Description
0 Erase-verify mode cleared (Initial value)
1 Transition to erase-verify mode
[Setting condition]
When FWE = 1, SWE1 = 1
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Bit 2—Program-Verify 1 (PV1): Selects program-verify mode transition or clearing for
addresses H'000000 to H'03FFFF. Do not set the SWE1, ESU1, PSU1, EV1, E1, or P1 bit at the
same time.
Bit 2
PV1
Description
0 Program-verify mode cleared (Initial value)
1 T r ansitio n to program-v erify m ode
[Setting condition]
When FWE = 1, SWE1 = 1
Bit 1—Erase 1 (E1): Selects erase mode transition or clearing for addresses H'000000 to
H'03FFFF. Do not set the SW E1, ESU1, PSU1, EV1, PV1, or P1 bit at the same time.
Bit 1
E1
Description
0 Erase mode cleared (Initial value)
1 T r ansitio n to erase mode
[Setting condition]
When FWE = 1, SWE1 = 1, and ESU1 = 1
Bit 0—Program 1 (P1): Selects program mode transition or clearing for addresses H'000000 to
H'03FFFF. Do not set the SWE1, PSU1, ESU1, EV1, PV1, or E1 bit at the same time.
Bit 0
P1
Description
0 Program mode cleared (Initial value)
1 T r ansitio n to program mode
[Setting condition]
When FWE = 1, SWE1 = 1, and PSU1 = 1
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19.23.2 Flash Memory Control Register 2 (FLMCR2)
Bit : 7 6 5 4 3 2 1 0
FLER SWE2 ESU2 PSU2 EV2 PV2 E2 P2
Initial value : 0 0 0 0 0 0 0 0
R/W : R R/W R/W R/W R/W R/W R/W R/W
FLMCR2 is an 8-bit register used for flash memory operating mode control. Program-verify mode
or erase-verify mode for addresses H'040000 to H'07FFFF is entered by setting SWE2 to 1 when
FWE = 1, then setting the EV2 or PV2 bit. Program mode for addresses H'040000 to H'07FFFF is
entered by setting SWE2 to 1 when FWE = 1, then settin g the PSU2 bit, and finally setting the P2
bit. Erase mode for addresses H'040000 to H'07FFFF is entered by setting SWE2 to 1 when FWE
= 1, then setting the ESU2 bit, and finally setting the E2 bit. FLMCR2 is initialized to H'00 by a
reset, and in hardware standby mode and software standby mode. When on-chip flash memory is
disabled, a read will return H'00, and writes are invalid.
Writes to the SWE2 b it in FLMCR2 are valid only when FWE = 1 ;
writes to the ESU2, PSU2, EV2, and PV2 bits only when FWE = 1 and SWE2 = 1;
writes to the E2 bit only when FWE = 1, SWE2 = 1, and ESU2 = 1;
and writes to the P2 bit only when FWE = 1, SWE2 = 1, and PSU2 = 1.
Bit 7—Flash Memory Error (FLER): Indicates that an error has occurred during an operation on
flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the error-
protection state.
Bit 7
FLER
Description
0 Flash memory is operating normally (Initial value)
Flash memory program/erase protection (error protection) is disabled
[Clearing condition]
Reset or hardware standby mode
1 An error has occurre d during fl ash me mory progr amming/erasing
Flash memory program/erase protection (error protection) is enabled
[Setting condition]
See section 19.26.3, Error Protection
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Bit 6—Software Write Enable Bit 2 (SWE2): Enables or disables flash memory programming
and erasing for addresses H'040000 to H'07FFFF. This bit should be set when setting bits 5 to 0 in
FLMCR2, and EBR2 bits 7 to 4.
When SWE2 = 1, the flash memory can only be read in program-verify or erase-verify mode.
Bit 6
SWE2
Description
0 Writes disabled (Initial value)
1 Writes enabled
[Setting condition]
When FWE = 1
Bit 5—Erase Setup Bit 2 (ESU2): Prepares for a transition to erase mode for addresses H'040000
to H'07FFFF. Do not set the SWE2, PSU2, EV2, PV2, E2, or P2 bit at the same time.
Bit 5
ESU2
Description
0 Erase setup cleared (Initial value)
1 Erase setup
[Setting condition]
When FWE = 1, SWE2 = 1
Bit 4—Program Setup Bit 2 (PSU2): Prepares for a transition to program mode for addresses
H'040000 to H'07FFFF. Do not set the SWE2, ESU2, EV2, PV2, E2, or P2 bit at the same time.
Bit 4
PSU2
Description
0 Program setup cleared (Initial value)
1 Program setup
[Setting condition]
When FWE = 1, SWE2 = 1
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Bit 3—Erase-Verify 2 (EV2): Selects erase-verify mode transition or clearing for addresses
H'040000 to H'07FFFF. Do not set the SWE2, ESU2, PSU2, PV2, E2, or P2 bit at the same time.
Bit 3
EV2
Description
0 Erase-verify mode cleared (Initial value)
1 Transition to erase-verify mode
[Setting condition]
When FWE = 1, SWE2 = 1
Bit 2—Program-Verify 2 (PV2): Selects program-verify mode transition or clearing for
addresses H'040000 to H'07FFFF. Do not set the SWE2, ESU2, PSU2, EV2, E2, or P2 bit at the
same time.
Bit 2
PV2
Description
0 Program-verify mode cleared (Initial value)
1 T r ansitio n to program-v erify m ode
[Setting condition]
When FWE = 1, SWE2 = 1
Bit 1—Erase 2 (E2): Selects erase mode transition or clearing for addresses H'040000 to
H'07FFFF. Do not set the SW E2, ESU2, PSU2, EV2, PV2, or P2 bit at the same time.
Bit 1
E2
Description
0 Erase mode cleared (Initial value)
1 T r ansitio n to erase mode
[Setting condition]
When FWE = 1, SWE2 = 1, and ESU2 = 1
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Bit 0—Program 2 (P2): Selects program mode transition or clearing for H'040000 to H'07FFFF.
Do not set the SWE2, PSU2, ESU2, EV2, P V2, or E2 bit at the same time.
Bit 0
P2
Description
0 Program mode cleared (Initial value)
1 T r ansitio n to program mode
[Setting condition]
When FWE = 1, SWE2 = 1, and PSU2 = 1
19.23.3 Erase Block Register 1 (EBR1)
Bit : 7 6 5 4 3 2 1 0
EBR1 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
EBR1 is an 8-bit register that specifies the flash memory erase area block by block. EBR1 is
initialized to H'00 by a reset, in hardware standby mode and software standby mode, when a low
level is being input to the FWE pin, and when the SWE1 b it in F LMCR1 is not set when a high
level is being input to the FWE pin. When a bit in EBR1 is set, the corresponding block can be
erased. Other blocks are erase-protected. Set only one bit in EBR1 and EBR2 together (setting
more than one bit will automatically clear all EBR1 and EBR2 b its to 0). When on-chip flash
memory is disabled, a read will return H'00 and writes are invalid.
The flash memory block configuration is shown in table 19.49
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19.23.4 Erase Block Registers 2 (EBR2)
Bit : 7 6 5 4 3 2 1 0
EBR2 EB15 EB14 EB13 EB12 EB11 EB10 EB9 EB8
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W R/W R/W R/W R/W R/W
EBR2 is an 8-bit register that specifies the flash memory erase area block by block. Bits 3 to 0 in
EBR2 are initialized to H'00 by a reset, in hardware standby mode and so ft ware standby mode,
when a low level is being input to the FWE pin, and when the SWE1 bit in FLMCR1 is not set
when a high level is being input to the FWE pin. Bits 7 to 4 are initialized to 0 when a low level is
input to the FWE pin, and when a high level is input to the FW E p in and the SWE2 bit in
FLMCR2 is not set. Whe n a bit in EBR2 is set, the corresponding block can be erased. Other
blocks are erase-protected. Set only one bit in EBR2 and EBR1 together (setting more than one bit
will automatically clear all EBR1 and EBR2 bits to 0). When on-chip flash memory is disabled, a
read will return H'00, and writes are invalid.
The flash memory block configuration is shown in table 19.49.
Section 19 ROM
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Table 19.49 Flash Memory Erase Blocks
Block (Size) Address
EB0 (4 kbytes) H'000000 to H'000FFF
EB1 (4 kbytes) H'001000 to H'001FFF
EB2 (4 kbytes) H'002000 to H'002FFF
EB3 (4 kbytes) H'003000 to H'003FFF
EB4 (4 kbytes) H'004000 to H'004FFF
EB5 (4 kbytes) H'005000 to H'005FFF
EB6 (4 kbytes) H'006000 to H'006FFF
EB7 (4 kbytes) H'007000 to H'007FFF
EB8 (32 kbytes) H'008000 to H'00FFFF
EB9 (64 kbytes) H'010000 to H'01FFFF
EB10 (64 kbytes) H'020000 to H'02FFFF
EB11 (64 kbytes) H'030000 to H'03FFFF
EB12 (64 kbytes) H'040000 to H'04FFFF
EB13 (64 kbytes) H'050000 to H'05FFFF
EB14 (64 kbytes) H'060000 to H'06FFFF
EB15 (64 kbytes) H'070000 to H'07FFFF
19.23.5 System Control Register 2 (SYSCR2)
Bit : 7 6 5 4 3 2 1 0
— — — — FLSHE — — —
Initial value : 0 0 0 0 0 0 0 0
R/W : — — — — R/W — — —
SYSCR2 is an 8-bit readable/writable register that performs on-chip flash memory control.
SYSCR2 is initial ized to H'00 by a reset and in hardware standby mode.
SYSCR2 can only be used in the F-ZTAT versions. In the mask ROM versions this register will
return an undefined value if read, and cannot be modified.
Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 0.
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Bit 3—Flash Memory Control Register Enable (FLSHE): Controls CPU access to the flash
memory control registers (FLMCR1, FLMCR2, EBR1, and EBR2). Writing 1 to the FLSHE bit
enables the flash memory control registers to be read and written to. Clearing FLSHE to 0
designates these registers as unselected (the register contents are retained).
Bit 3
FLSHE
Description
0 Flash control registers are not selected for addresses H'FFFFC8 to H'FFFFCB
(Initial value)
1 Flash control registers are selected for addresses H'FFFFC8 to H'FFFFCB
Bits 2 to 0—Reserved: These bits cannot be modified and are always read as 0.
19.23.6 RAM Emulation Register (RAMER)
Bit : 7 6 5 4 3 2 1 0
— — — — RAMS RAM2 RAM1 RAM0
Initial value : 0 0 0 0 0 0 0 0
R/W : — — — — R/W R/W R/W R/W
RAMER specifies the area of flash memory to be overlapped with part of RAM when emulating
real-time flash memory programming. RAMER is initialized to H'00 by a reset and in hardware
standby mode. It is not initialized in software standby mode. RAMER se ttings should be made in
user mode or user program mode.
Flash memory area divisions are shown in table 19.50. To ensure correct operation of the
emulation function, the ROM for which RAM emulation is performed should not be accessed
immediately after this register has been modified. Normal execution of an access immediately
after register modification is not guaranteed.
Bits 7 to 4—Reserved: These bits cannot be modified and are always read as 0.
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Bit 3—RAM Select (RAMS): Specifies selection or non-selection of flash memory emulatio n in
RAM. When RAMS = 1, all flash memory blocks are program/erase-protected.
Bit 3
RAMS
Description
0 Emulation not selected (Initial value)
Program/erase-protection of all flash memory blocks is disabled
1 Emulation selected
Program/erase-protection of all flash memory blocks is enabled
Bits 2 to 0—Flash Memory Area Selection (RAM2 to RAM0): These bits are used together
with bit 3 to select the flash memory area to be overlapped with RAM (see table 19.50).
Table 19.50 Flash Memory Area Divisions
RAM Area Block Name RAMS RAM2 RAM1 RAM0
H'FFDC00 to H'FFEBFF RAM area, 4 kbytes 0 * * *
H'000000 to H'000FFF EB0 (4 kbytes) 1 0 0 0
H'001000 to H'001FFF EB1 (4 kbytes) 1 0 0 1
H'002000 to H'002FFF EB2 (4 kbytes) 1 0 1 0
H'003000 to H'003FFF EB3 (4 kbytes) 1 0 1 1
H'004000 to H'004FFF EB4 (4 kbytes) 1 1 0 0
H'005000 to H'005FFF EB5 (4 kbytes) 1 1 0 1
H'006000 to H'006FFF EB6 (4 kbytes) 1 1 1 0
H'007000 to H'007FFF EB7 (4 kbytes) 1 1 1 1
*: Don’t care
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19.24 On-Board Programming Modes
When pins are set to on-board programming mode, program/erase/verify operations can be
performed on the on-chip flash memory. There are two on-board programming modes: boot mode
and user program mode. The pin settings for transition to each of these modes are shown in table
19.51. For a diagram of the transitions to the various flash memory modes, see figure 19.59.
Table 19.51 Setting On-Board Programming Modes
Mode Pins
MCU Mode CPU Operating Mode FWE MD2 MD1 MD0
Boot mode Advanced expanded mode with
on-chip ROM enabled 1 0 1 0
Advanced single-chip mode 1
User program mode* Advanced expanded mode with
on-chip ROM enabled 1 1 1 0
Advanced single-chip mode 1
Note: * Normally, user mode should be used. Set the FWE pin to 1 to make a transition to user
program mode before performing a program/erase/verify operation.
19.24.1 Boot Mode
When boot mode is used, the flash memory programming control program must be prepared in the
host b eforehand. The channel 1 SCI to be used i s set to asynchro nous mode.
When a reset-start is executed after the H8S/2326 F-ZTAT chip’s pins have been set to boot mode,
the boot program built into the chip is started and the programming control program prepared in
the host is serially transmitted to the chip via the SCI. In the chip, the programming control
program received via the SCI is written into the programming control program area in on-chip
RAM. After the transfer is completed, control br anches to the start address of the programming
control program area and the programming control program execution state is entered (flash
memory programming is performed).
The transferred programming control program must therefore include coding that follows the
programming algorithm given later.
The system configuration in boot mode is shown in figure 19.66, and the boot program mode
execution procedure in figure 19.67.
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RxD1
TxD1 SCI1
Chip
Flash memory
Write data reception
Verify data transmission
Host
On-chip RAM
Figure 19.66 System Configuration in Boot Mode
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Note: If a memory cell does not operate normally and cannot be erased, one H'FF byte is
transmitted as an erase error, and the erase operation and subsequent operations
are halted.
Start
Set pins to boot mode
and execute reset-start
Host transfers data (H'00)
continuously at prescribed bit rate
Chip measures low period
of H'00 data transmitted by host
Chip calculates bit rate and
sets value in bit rate register
After bit rate adjustment, chip
transmits one H'00 data byte to
host to indicate end of adjustment
Host confirms normal reception
of bit rate adjustment end
indication (H'00), and transmits
one H'55 data byte
After receiving H'55,
chip transmits one H'AA
data byte to host
Host transmits number
of programming control program
bytes (N), upper byte followed
by lower byte
Chip transmits received
number of bytes to host as verify
data (echo-back)
n = 1
Host transmits programming control
program sequentially in byte units
Chip transmits received
programming control program to
host as verify data (echo-back)
Transfer received programming
control program to on-chip RAM
n = N? No
Yes
End of transmission
Check flash memory data, and
if data has already been written,
erase all blocks
After confirming that all flash
memory data has been erased,
chip transmits one H'AA data
byte to host
Execute programming control
program transferred to on-chip RAM
n + 1 → n
Figure 19.67 Boot Mode Execution Procedure
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Automatic SCI Bit Rate Adjustment: When boot mode is initiated, the H8S/2326 F-ZTAT chip
measures the low period of the asynchronous SCI co mmunication data (H'00) transmitted
continuously from the host. The SCI transmit/receive format should be set as follows: 8-bit data, 1
stop bit, no parity. The chip calculates the bit rate of the transmission from the host from the
measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate
adjustment. The host should confirm that this adjustment end indication (H'00) has been received
normally, and transmit one H'55 byte to the chip. If reception cannot be performed normally,
initiate boot mode again (reset), and repeat the above operations. Depending on the host’s
transmission bit rate and the chip’s syste m clock frequency, there will be a discrepancy between
the bit rates of the host and the chip. To ensure correct SCI operation, the host’s transfer bit rate
should be set to 9,600 or 19,200 bps.
Table 19.52 shows typical host transfer bit rates and system clock frequencies for which automatic
adjustment of the MCU’s bit rate is possible. The boot program should be executed within this
system clock range.
Start
bit Stop
bit
D0 D1 D2 D3 D4 D5 D6 D7
Low period (9 bits) measured (H'00 data) High period
(1 or more bits)
Figure 19.68 Automatic SCI Bit Rate Adjustment
Table 19.52 Syst em Clock Frequencies for which Automatic Adjustment of H8S/2326
F-ZTAT Bit Rate is Possible
Host Bit Rate System Clock Frequency for which Automatic Adjustment
of H8S/2326 F-ZTAT Bit Rate is Possible
19,200 bps 16 MHz to 25 MHz
9,600 bps 8 MHz to 25 MHz
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On-Chip RAM Area Divisions in Boot Mode: In boot mode, the 2-kbyte area from H'FFDC00
to H'FFE3FF is reserved for use by the boot program, as shown in figure 19.69. The area to which
the programming control program is transferred is H'FFE400 to H'FFFBFF. The boot program
area can be used when the programming control program transferred into RAM enters the
execution state. A stack area should be set up as required.
H'FFDC00
H'FFE3FF
Programming
control program
area
(6 kbytes)
H'FFFBFF
Boot program
area*
(2 kbytes)
Note: * The boot program area cannot be used until a transition is made to the execution state
for the programming control program transferred to RAM. Note that the boot program
remains stored in this area after a branch is made to the programming control program.
Figure 19.69 RAM Areas in Boot Mode
Notes on Use of Boot Mode
• When the chip comes out of reset in boot mode, it measures the low-level period of the input at
the SCI’s RxD1 pin. The reset should end with RxD1 high. After the reset ends, it takes
approximately 100 states before the chip is ready to measure the low-level period of the RxD1
pin.
• In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all
flash memory blocks are erased. Boot mode is for use when user program mode is unavailable,
such as the first time on-board programming is performed, or if the program activated in user
program mode is accidentally erased.
• Interrupts cannot be used while the flash memory is being programmed or erased.
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• The RxD1 and TxD1 pins should be pulled up on the board.
• Before branching to the programming control program (RAM area H'FFE400 to H'FFFBFF),
the chip terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing
the RE and TE bits in SCR to 0), but the adjusted bit rate value remains set in BRR. T he
transmit data output pin, TxD1, goes to the high-level output state (P31DDR = 1, P31DR = 1).
• The contents of the CPU’s internal general registers are undefined at this time, so these
registers must be initialized i m mediately after branching to the programming control program.
In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area
must be specified for use by the programming control program.
Initial settings must also be made for the other on-chip registers.
• Boot mode can be entered by making the pin settings shown in table 19.51 and executing a
reset-start.
Boot mode can be cleared by driving the reset pin low, waiting at least 20 states, then setting
the mode pins, and executing reset release*1. Boot mode can also be cleared by a WDT
overflow reset.
Do not change the mode pin input levels in boot mode. Do not make the FWE pin low level
while a boot program is executing, or while programming or erasing flash memory*2.
• If the mode pin input levels are changed (for example, from low to high) during a reset, the
state of ports with multiplexed addr ess functions and bus control o utput pins (AS, RD, HWR)
will change according to the change in the microcomputer’s operating mode*3.
Therefore, care must be taken to make pin settings to prevent these pins from becoming output
signal pins during a reset, or to prevent collision with sig nals outside the microcomputer.
Notes: 1. Input to the mode pins and FWE pin must satisfy the mode programming setup time
(tMDS = 200 ns) requirement with regard to the reset release timing, as shown in figures
19.86 to 19.88.
2. Refer to section 19.30, Flash Memory Programming and Erasing Precautions, for
precautions regarding applying signals to and releasing the FWE pin.
3. See section 9, I/O Ports.
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19.24.2 User Progra m Mode
When set to user program mode, the chip can program and erase its flash memory by executing a
user program/erase control program. Therefore, on-board programming of the on-chip flash
memory can be carried out by providing ahead of time an on-board FWE control means to supply
programming data, and storing a program/erase control program in part of the program area if
necessary.
To select user program mode, select a mode that enables the on-chip flash memory (mode 6 or 7)
and apply a high level to the FWE pin. In this mode, on-chip supporting modules other than flash
memory operate as they normally would in modes 6 and 7.
While the SWE1 bit is set to 1 to perform programming or erasing for the addresses H'000000 to
H'03FFFF, this address area cannot be read. While the SWE2 bit is set to 1 to perform
programming or erasing for the addresses H'040000 to H'07FFFF, this address area cannot be
read. The control program that performs programming and erasing should be run in on-chip RAM
or flash memory except for the above address areas. When the program is located in external
memory, an instruction for progra mming the flash memory and the following instruction should
be located in on-chip RAM.
Figure 19.70 shows the procedure for executing the program/erase control program when
transferred to on-chip RAM.
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Execute programming/erase control
program (flash memory rewriting)
Branch to programming/erase
control program in RAM area
FWE = high*
Transfer programming/erase
control program to RAM
MD2, MD1, MD0 = 101 or 111
Reset start
Write FWE assessment program
and transfer program
(and programming/erase control
program if necessary) beforehand
Clear FWE*
Branch to application program
in flash memory
Notes: Do not apply a constant high level to the FWE pin. A high level should be applied to
the FWE pin only when programming or erasing flash memory. Also, while a high level
is applied to the FWE pin, the watchdog timer should be activated to prevent
overprogramming or overerasing due to program runaway, etc.
* For further information on FWE application and disconnection, see section 19.30,
Flash Memory Programming and Erasing Precautions.
Figure 19.70 Example of User Program Mode Execution Procedure
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19.25 Programming/Erasing Flash Memory
In the on-board programming modes, flash memory programming and erasing is performed by
software, using the CPU. There are four flash memory operating modes: program mode, erase
mode, program-verify mode, and erase-verify mode. Transition to these modes can be made for
addresses H'000000 to H'03FFFF by setting the PSU1, ESU1, P1, E1, PV1, and EV1 bits in
FLMCR1, and for addresses H'040000 to H'07FFFF by setting the PSU2, ESU2, P2, E2, PV2, and
EV2 bits in FLMCR2.
The flash memory cannot be read while being programmed or erased. Therefore, the program that
controls flash me mory program mi ng/eras i ng (the pr ogramming contro l program) should be
located and executed in on-chip RAM, external memory, or flash memory except for the above
address areas. When the progra m is located in external memory, an instruction for programming
the flash memory and the following instruction should be located in on-chip RAM. The DMAC or
DTC should not be activated before or after the instruction for programming the flash memory is
executed.
Notes: 1 . Operation is not guaranteed if setting/resetti ng o f the SWE1, ESU1, PSU1, EV1, P V1,
E1, and P1 bits in FLMCR1 or settin g/resett in g of the SWE2, ESU2, PSU2, EV2, PV2 ,
E2, and P2 bits in FLMCR2 is executed by a program in flash memory.
2. When programming or erasing, set FWE to 1 (programming/erasing is not performed
when FWE = 0).
3. Perform programming in the erased state. Do not perform additional programming on
previously programmed addresses.
4. Do not program addresses H'000000 to H'03FFFF and H'040000 to H'07FFFF
simultaneously. Operation is not guaranteed when programming is performed
simultaneously.
19.25.1 Program Mode (n = 1 for addresses H'000000 to H'03FFFF and n = 2 for addresses
H'040000 to H'07FFFF)
Follow the procedure shown in the program/program-verify flowchart in figure 19.70 to write data
or programs to flash memory. Performing program operations according to this flowchart will
enable data or programs to be written to flash memory without subjecting the device to voltage
stress or sacrificing program data reliab ility. Programming should be carried out 128 bytes at a
time.
For the wait times (x, y, z1, z2, z3 α, ß, γ, ε, η, and θ) after bits are set or cleared in flash memory
control register n (FLMCRn) and the maximum number of programming operations (N), see
section 22.2.6, Flash Memory Characteristics.
Section 19 ROM
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Following the elapse of (x) µs or more after the SWEn bit is set to 1 in flash memory control
register n (FLMCRn), 128-byte program data is stored in the program data area and reprogram
data area, and the 128-byte data in the reprogram data area is written consecutively to the write
addresses. The lower 8 bits of the first address written to must be H'00 or H'80. 128 consecutive
byte data transfers are performed. The program address and program data are latched in the flash
memory. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this
case, H'FF data must be written to the extra addresses.
Next, the watchdog timer is set to prevent overprogramming in the event of program runaway, etc.
Set a value greater than (y + z2 + α + β) µs as the WDT overflow period. After this, preparation
for program mode (program setup) is carried out by setting the PSUn bit in FLMCRn, and after
the elapse of (y) µs or more, the operating mode is switched to program mode by setting the Pn bit
in FLMCRn. The time during which the Pn bit is set is t he fl ash memory programming time. Set
the programming time according to the table in the programming flowchart.
19.25.2 Program-Verify Mode (n = 1 for addresses H'000000 to H'03FFFF and n = 2 for
addresses H'040000 to H'07FFFF)
In program-verify mode, the data written in program mode is read to check whether it has been
correctly written in the flash memory.
After the elapse of a given programming time, the programming mode is ex ited (the Pn bit in
FLMCRn is cleared to 0, then the PSUn bit is cleared to 0 at least (α) µs later). Next, the
watchdog timer is cleared after the elapse of (β) µs or more, and the operating mode is switched to
program-verify mode by setting the PVn bit in FLMCRn. Before reading in program-verify mode,
a dummy write of H'FF data should be made to the addresses to be read. The dummy write should
be executed after the elapse of (γ) µs or more. When the flash memory is read in this state (verify
data is read in 16-bit units), the data at the latched address is read. Wait at least (ε) µs after the
dummy write before performing this read operation. Next, the originally written data is co mpared
with the verify data, and reprogram data is computed (see figure 19.70) and transferred to the
reprogram data area. After 128 bytes of data have been verified, exit program-verify mode and
wait for at least (η) µs, then clear the SWEn bit in FLMCRn to 0, and wait again for at least (θ)
μs. If reprogramming is necessary, set program mode again, and repeat the program/program-
verify sequence as before. However, ensure that the program/program-verify sequence is not
repeated more than (N) times on the same bits.
Section 19 ROM
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Start
End of programming
End sub
Set SWE1 (2) bit in FLMCR1 (2)
Wait (x) μs
n = 1
m = 0
Sub-routine-call
See Note 7 for pulse width
Note 7: Write Pulse Width
Start of programming
Sub-routine write pulse
Set PSU1 (2) bit in FLMCR1 (2)
Enable WDT
Set P1 (2) bit in FLMCR1 (2)
Wait (y) μs
Clear P1 (2) bit in FLMCR1 (2)
Wait (z1) μs or (z2) μs or (z3) μs
Clear PSU1 (2) bit in FLMCR1 (2)
Wait (α) μs
Disable WDT
Wait (β) μs
Write pulse application subroutine
NG
NG
NG
NG
NG NG
OK
OK
OK
OK
OK
Wait (γ) μs
Wait (ε) μs
*2
*4
*6
*6
*6
*6
*6*6
*6
*6
*6
*5*6
*6
*6
*6
*6
*1
Set PV1 (2) bit in FLMCR1 (2)
H'FF dummy write to verify address
Read verify data
Additional program data computation
Transfer additional program data to
additional program data area
Read data = verify
data?
*4
*1
*4
*3
Reprogram data computation
Clear PV1 (2) bit in FLMCR1 (2)
Clear SWE1 (2) bit in FLMCR1 (2)
m = 1
128-byte
data verification
completed?
m = 0?
6 ≥ n ?
6 ≥ n ?
Increment address
Programming failure
OK
Clear SWE1 (2) bit in FLMCR1 (2)
n ≥ N?
Write 128-byte data in RAM reprogram
data area consecutively to flash memory
Write pulse
(z1) μs or (z2) μs
Perform programming in the erased state.
Do not perform additional programming
on previously programmed addresses.
RAM
Program data area
(128 bytes)
Reprogram data area
(128 bytes)
Additional program data
area (128 bytes)
Store 128-byte program data in program
data area and reprogram data area
Number of Writes (n)
1
2
3
4
5
6
7
8
9
10
11
12
13
.
.
.
998
999
1000
Write Time (z) μs
z1
z1
z1
z1
z1
z1
z2
z2
z2
z2
z2
z2
z2
.
.
.
z2
z2
z2
Notes: 1. Data transfer is performed by byte transfer. The lower 8 bits of the first
address written to must be H'00 or H'80. A 128-byte data transfer must
be performed even if writing fewer than 128 bytes; in this case, H'FF
data must be written to the extra addresses.
2. Verify data is read in 16-bit (W) units.
3. Even bits for which programming has been completed in the 128-byte
programming loop will be subjected to additional programming if they
fail the subsequent verify operation.
4. A 128-byte area for storing program data, a 128-byte area for storing
reprogram data, and a 128-byte area for storing additional program data
should be provided in RAM. The contents of the reprogram data and
additional program data areas are modified as programming proceeds.
0
1
0
1
0
1
1
0
1
Comments
Programming completed
Programming incomplete; reprogram
Still in erased state; no action
Program Data Operation Chart
Transfer reprogram data to reprogram
data area
n ← n + 1
Note: Use a (z3) µs write pulse for additional
programming.
Sequentially write 128-byte data in
additional program data area in RAM to
flash memory
Write Pulse
(z3) µs additional write pulse
Wait (θ) μs
Wait (η) μs
Wait (θ) μs
5. A write pulse of (z1) or (z2) μs should be applied according to the progress
of programming. See Note 7 for the pulse widths. When the additional program
data is programmed, a write pulse of (z3) μs should be applied. Reprogram data X' stands for reprogram data to which a write pulse has been applied.
6. For the values of x, y, z1, z2, z3, α, β, γ, ε, η, θ, and N, see section 22.2.6, Flash Memory Characteristics.
Original Data
(D) Verify Data
(V) Reprogram Data
(X) 0
1
0
1
0
1
0
1
Comments
Additional programming executed
Additional programming not executed
Additional programming not executed
Additional programming not executed
Additional Program Data Operation Chart
Reprogram
Data (X') Verify Data
(V) Additional
Program Data (Y)
Figure 19.71 Program/Program-Verify Flowchart
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19.25.3 Erase Mode (n = 1 for addresses H'000000 to H'03FFFF and n = 2 for addresses
H'040000 to H'07FFFF)
Flash memory erasing should be performed block by block following the procedure shown in the
erase/erase-verify flowchart (single-block erase) shown in figure 19.71.
For the wait times (x, y, z, α, ß, γ, ε, η, θ) after bits are set or cleared in flash memory control
register n (FLMCRn) and the maximum number of programming operations (N), see section
22.2.6, Flash Memory Characteristics.
To perform data or program erasure, make a 1 bit setting for the flash memory area to be erased in
erase block register 1 or 2 (EBR1 or EBR2 ) at least (x) µs after setting the SWEn bit to 1 in flash
memory control register n (FLMCRn). Next, the watchdog timer is set to prevent overerasing in
the event of program runaway, etc. Set a value greater than (y + z + α + ß) ms as the WDT
overflow period. After this, preparation for erase mode (erase setup) is carried out by setting the
ESUn bit in FLMCRn, and after the elapse of (y) µs or more, the operating mode is switched to
erase mode by setting the En bit in FLMCRn. T he ti me during which the En bit is set is the flash
memory erase time. Ensure that the erase time does not exceed (z) ms.
Note: With flash memory erasing, prewriting (setting all data in the memory to be erased to 0) is
not necessary before starting the erase procedure.
Section 19 ROM
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19.25.4 Erase-Verify Mode (n = 1 for addresses H'000000 to H'03FFFF and n = 2 for
addresses H'040000 to H'07FFFF)
In erase-verify mode, data is read after memory has been erased to check whether it has been
correctly erased.
After the elapse of the erase time, erase mode is exited (the En bit in FLMCRn is cleared to 0, then
the ESUn bit in FLMCRn is cleared to 0 at least (α) µs later), the watchdog timer is cleared after
the elapse of (β) µs or more, and the operating mode is switched to erase-verify mode by setting
the EVn bit in FLMCRn. Before reading in erase-verify mode, a dummy write of H'FF data should
be made to the addresses to be read. The dummy write should be executed after the elapse of (γ)
µs or more. When the flash memory is read in this state (verify data is read in 16-bit units) , the
data at the latched address is read. Wait at least (ε) µs after the dummy write before performing
this read operation. If the read data has been erased (all 1), a dummy write is performed to the next
address, and erase-verify is performed. If the read data has not been erased, set erase mode again,
and repeat the erase/erase-verify sequence in the same way. However, ensure that the erase/erase-
verify sequence is not repeated more than (N) times. When verification is completed, exit erase-
verify mode, and wait for at least (η) µs. If erasure has been completed on all the erase blocks,
clear the SWEn bit in FLMCRn to 0 and wait for at least (θ) μs. If there are any unerased blocks,
make a 1 bit setting for the flash memory area to be erased, and repeat the erase/erase-verify
sequence in the same way.
Section 19 ROM
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End of erasing
Start
Set SWE1 (2) bit in FLMCR1 (2)
Set ESU1 (2) bit in FLMCR1 (2)
Set E1 (2) bit in FLMCR1 (2)
Wait (x) μs
Wait (y) μs
n = 1
Set EBR1, EBR2
Enable WDT
*2
*2
*4
Wait (z) ms
*2
Wait (α) μs
*2
Wait (β) μs
*2
Wait (γ) μs
Set block start address to verify address
*2
Wait (ε) μs
*2
*3
*2
Wait (η) μs
*2*2
*5
Start of erase
Clear E1 (2) bit in FLMCR1(2)
Clear ESU1 (2) bit in FLMCR1 (2)
Set EV1 (2) bit in FLMCR1 (2)
H'FF dummy write to verify address
Read verify data
Clear EV1 (2) bit in FLMCR1 (2)
Wait (η) μs
Clear EV1 (2) bit in FLMCR1 (2)
Clear SWE1 (2) bit in FLMCR1 (2)
Disable WDT
Halt erase
*1
Verify data = all 1?
Last address of block?
End of
erasing of all erase
blocks?
Erase failure
Clear SWE1 (2) bit in FLMCR1 (2)
n ≥ N?
NG
NG
NG NG
OK
OK
OK OK
n ← n + 1
Increment
address
Notes: 1. Prewriting (setting erase block data to all 0) is not necessary.
2. The values of x, y, z, α, β, γ, ε, η, θ, and N are shown in the section 22.2.6, Flash Memory Characteristics.
3. Verify data is read in 16-bit (W) units.
4. Set only one bit in EBR1or EBR2. More than one bit cannot be set.
5. Erasing is performed in block units. To erase a number of blocks, the individual blocks must be erased sequentially.
Wait (θ) μs Wait (θ) μs
Figure 19.72 Erase/Erase-Verify Flowchart
Section 19 ROM
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19.26 Flash Memory Protection
There are three kinds of flash memory program/erase protection: hardware protection, software
protection, and error protection.
19.26.1 Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly
disabled or aborted . Settings in flash memory control registers 1 and 2 (FLMCR1, FLMCR 2 ) and
erase block registers 1 and 2 (EBR1, EBR2) are reset (see table 19.53).
Table 19.53 Hardware Protection
Functions
Item Description Program Erase
FWE pin protection • When a low level is input to the FWE pin,
FLMCR1, FLMCR2, EBR1, and EBR2 are
initialized and the program/erase protected
state is entered.
Yes Yes
Reset/standby
protection • In a reset (including a WDT overflow reset)
and in standby mode, FLMCR1, FLMCR2,
EBR1, and EBR2 are initialized, and the
program/erase-protected state is entered.
• In a reset via the RES pin, the reset state is
not entered unless the RES pin is held low
until oscillation stabilizes after powering on.
In the case of a reset during operation, hold
the RES pin low for the RES pulse width
specified in section 22.2.3, AC
Characteristics.
Yes Yes
19.26.2 Software Protection
Software protection can be implemented by setting the SWE1 bit in flash memory control register
1 (FLMCR1), SWE2 bit in FLMCR2 erase block registers 1 and 2 (EBR1, EBR2), and the RAMS
bit in the RAM emulation register (R AMER). Whe n software protection is in effect, setting the P1
or E1 bit in FLMCR1, or the P2 or E2 b it in FLMCR2 d oes not cause a transition to program
mode or erase mode (see table 19.54).
Section 19 ROM
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Table 19.54 Software Protection
Functions
Item Description Program Erase
S WE bit protection • Clearing the SWE1 bit to 0 in FLMCR1 sets
the program/erase-protected state for area
H'000000 to H'03FFFF (Execute in on-chip
RAM, external memory, or addresses
H'040000 to H'07FF FF)
• Clearing the SWE2 bit to 0 in FLMCR2 sets
the program/erase-protected state for area
H'040000 to H'07FFFF (Execute in on-chip
RAM, external memory, or addresses
H'000000 to H'03FFFF)
Yes Yes
Block specification
protection • Erase protection can be set for individual
blocks by settings in erase block registers 1
and 2 (EBR1, EBR2).
• Setting EBR1 and EBR2 to H'00 places all
blocks in the erase-prot ect ed s tate.
— Yes
Emulation protection • Setting the RAMS bit to 1 in the RAM
emulation register (RAMER) places all blocks
in the program/erase-protected state.
Yes Yes
19.26.3 Error Protection
In error protection, an error is detected when MCU runaway occurs during flash memory
programming/erasing, or operation is not performed in accordance with the program/erase
algorithm, and the program/erase operation is aborted. Aborting the program/erase operation
prevents damage to the flash memory due to overprogramming or overerasing.
If the MCU malfunctions during flash memory programming/erasing, the FLE R bit is set to 1 in
FLMCR2 and the error protection state is entered. The FLMCR1, FLMCR2, EBR1, and EBR2
settings are retained, but program mode or erase mode is aborted at the point at which the error
occurred. Program mode or erase mode cannot be re-entered by re-setting the P1, P2, E1, or E2
bit. However, PV1, PV2, EV1, and EV2 bit setting is enabled, and a transition ca n be made to
verify mode.
Section 19 ROM
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FLER bit setting conditions are as follows:
• When flash memory is read during programming/erasing (including a vector read or instruction
fetch)
• Immediately after exception handling (excluding a reset) during programming/erasing
• When a SLEEP instruction (including software standby) is executed during
programming/erasing
• When a bus master other than the CPU (the DMAC or DTC) has control of the bus during
programming/erasing
Error protection is released only by a reset and in hardware standby mode.
Figure 19.73 shows the flash memory state transition diagram.
RD VF PR ER
FLER = 0
Error
occurrence
RES = 0 or STBY = 0
RES = 0 or
STBY = 0
RD VF PR ER
FLER = 0
Normal operating mode
Program mode
Erase mode
Reset or hardware standby
(hardware protection)
RD VF PR ER
FLER = 1 RD VF PR ER
FLER = 1
Error protection mode Error protection mode
(software standby)
Software
standby mode
FLMCR1, FLMCR2 (except FLER
bit), EBR1, EBR2 initialization state
FLMCR1, FLMCR2,
EBR1, EBR2
initialization state
Software standby
mode release
RD: Memory read possible
VF: Verify-read possible
PR: Programming possible
ER: Erasing possible
RD: Memory read not possible
VF: Verify-read not possible
PR: Programming not possible
ER: Erasing not possible
Legend:
RES = 0 or
STBY = 0
Error occurrence
(software standby)
Figure 19.73 Flash Memory State Transitions
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19.27 Flash Memory Emulation in RAM
19.27.1 Emulation in RAM
Making a setting in the RAM emulation register (RAMER) enables part of RAM to be overlapped
onto the flash memory area so that data to be written to flash memory can be emulated in RAM in
real time. After the RAMER setting has been made, accesses can be made from the flash memory
area or the RAM area overlapping flash memory. Emulation can be performed in user mode and
user program mode. Figure 19.74 shows an example of emulation of real-time flash memory
programming.
Start of emulation program
End of emulation program
Tuning OK?
Yes
No
Set RAMER
Write tuning data to overlap
RAM
Execute application program
Clear RAMER
Write to flash memory emulation
block
Figure 19.74 Flowchart for Flash Memory Emulation in RAM
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19.27.2 RAM Overlap
An example in which flash memory block area EB1 is overlapped is shown below.
H'000000
H'001000
H'002000
H'030000
H'004000
H'005000
H'006000
H'007000
H'008000
H'07FFFF
Flash memory
EB8 to EB15
This area can be accessed
from both the RAM area
and flash memory area
EB0
EB1
EB2
EB3
EB4
EB5
EB6
EB7
H'FFDC00
H'FFEBFF
H'FFFBFF
On-chip RAM
Figure 19.75 Example of RAM Overlap Operation
Example in which Flash Memory Block Area EB1 is Overlapped
1. Set bits RAMS, RAM2, RAM1, and RAM0 in RAMER to 1, 0, 0, 1, to overlap part of RAM
onto the area (EB1) for which real-time programming is required.
2. Real-time programming is performed using the overlapping RAM.
3. After the program data has been confirmed, the RAMS bit is cleared, releasing RAM overlap.
4. The data written in the overlapping RAM is writte n i nto the flash memory space (EB1).
Notes: 1. When the RAMS bit is set to 1 , program/erase protection is enabled for all blocks
regardless of the value of RAM2, RAM1, and RAM0 (e mulation protection). In this
state, setting the P1 or E1 bit in flash memory control register 1 (FLMCR1), or setting
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 889 of 1268
REJ09B0220-0600
the P2 or E2 bit in FLMCR2 will not cause a transition to program mode or erase
mode. When actually programming a flash memory area, the RAMS bit should be
cleared to 0.
2. A RAM area cannot be erased by execution of software in accordance with the erase
algorithm while flash memory emulation in RAM is being used.
3. Block area EB0 includes the vector table. When performing RAM emulation, the
vector table is needed by the overlap RAM.
19.28 Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including NMI input, are disabled when flash memory is being programmed or
erased (when the P1 or E1 bit is set in FLMCR1, o r the P 2 or E2 b it is set in F LMCR2 ), and while
the boot program is executing in boot mode*1, to give priority to the program or erase operation.
There are three reasons for this:
1. Interrupt during programming or erasing might cause a violation of the programming or
erasing algorithm, with the result that normal operation could not be assured.
2. In the interrupt exception handling sequence during programming or erasing, the vector would
not be read correctly*2, possibly resulting in M CU runa way.
3. If an interrupt occurred during boot program execution, it would not be possible to execute the
normal boot mode sequence.
For these reasons, in on-board pro gramming mode alone there are conditio ns for disabling
interrupts, as an exception to the general rule. However, this provision does not guarantee normal
erasing and programming or MCU operation. All requests, including NMI, must therefore be
restricted inside and outside the MCU when programming or erasing flash memory. The NMI
interrupt is also disabled in the error-protection state while the P1 or E1 bit remains set in
FLMCR1, o r the P2 or E2 bit remains set in FLMCR2 .
Notes: 1. Interrupt requests must b e disabled inside and outside the MCU until the programming
control program has completed programming.
2. The vector may not be read correctly in this case for the follo wing two reasons:
• If flash memory is read while being programmed or erased (while the P1 or E1 bit
is set in FLMCR1, or the P2 or E2 bit is set in FLMCR2.), correct read data will not
be obtained (undetermined values will be returned).
• If the interrupt entry in the vector table has not been programmed yet, interrupt
exception handling will not be executed correctly.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 890 of 1268
REJ09B0220-0600
19.29 Flash Memory PROM Mode
19.29.1 PROM Mode Setting
Programs and data can be written and erased in PROM mode as well as in the on-board
programming modes. In PROM mode, the on-chip ROM can be freely programmed using a
PROM programmer that supports the Renesas microcomputer device type with 512-kbyte on-chip
flash memory (FZTAT512V3A). Flash memory read mode, auto-program mode, auto-erase mode,
and status read mode are supported with this device type. In auto-program mode, auto-erase mode,
and status read mode, a status polling procedure is used, and in status read mode, detailed internal
signals are output after execution of an auto-program or auto-erase operation.
Table 19.55 shows PROM mode p in settings.
Table 19.55 PRO M Mode P in Set tings
Pin Names Settings/External Circuit Connection
Mode pins: MD2, MD1, MD0 Low-level input
Mode setting pins: P66, P65, P64 High-level input to P66, low-level input to P65 and P64
FWE pin High-level input (in auto-program and auto-erase
modes)
STBY pin High-level input (do not select hardware standby mode)
RES pin Reset circuit
XTAL, EXTAL pins Oscillator circuit
Other pins requiring setting: P32, P25 High-level input to P32, low-level input to P25
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 891 of 1268
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19.29.2 Socket Adapters and Memory Map
In PROM mode, a socket adapter is connected to the chip as shown in figure 19.77. Figure 19.76
shows the on-chip ROM memory map and figure 19.77 shows the socket adapter pin assignments.
H'00000000
MCU mode address PROM mode address
H'0007FFFF
H'00000
H'7FFFF
On-chip
ROM space
512 kbytes
Figure 19.76 Memory Map in PROM Mode
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 892 of 1268
REJ09B0220-0600
H8S/2326 F-ZTAT Socket Adapter
(40-Pin Conversion)
TFP-120 Pin Name
2
3
4
5
7
8
9
10
11
12
13
14
16
17
18
19
20
21
22
43
44
45
46
48
49
50
51
68
69
67
72
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
A
14
A
15
A
16
A
17
A
18
D
8
D
9
D
10
D
11
D
12
D
13
D
14
D
15
CE
OE
WE
FWE
HN27C4096HG (40 Pins)
Pin No. Pin Name
21
22
23
24
25
26
27
28
29
31
32
33
34
35
36
37
38
39
10
19
18
17
16
15
14
13
12
2
20
3
4
1, 40
11, 30
5, 6, 7
8
9
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
A
14
A
15
A
16
A
17
A
18
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
CE
OE
WE
FWE
V
CC
V
SS
NC
A
20
A
19
73
77
78
FP-128B
6
7
8
9
11
12
13
14
15
16
17
18
20
21
22
23
24
25
26
49
50
51
52
54
55
56
57
76
77
75
80
81
85
86
RES
XTAL
EXTAL
NC (OPEN)
1, 30, 33, 52, 55,74,
75, 76, 81, 93, 94
6, 15, 24, 31, 32, 38,
47, 59, 66, 79, 103,
104, 113, 114, 115
5, 34, 39, 58, 61, 82,
83, 84, 89, 103, 104
3, 10, 19, 28, 35, 36,
37, 38, 44, 53, 65,
67, 68, 74, 87, 99,
100, 113, 114, 123,
124, 125
V
CC
V
SS
Reset circuit
Oscillation circuit
Legend:
FWE: Flash write enable
I/O
7
to I/O
0
: Data input/output
A
18
to A
0
: Address input
CE: Chip enable
OE: Output enable
WE: Write enable
*1
*2
Notes: This figure shows pin assignments, and does not show the entire socket adapter circuit.
1. A reset oscillation stabilization time (t
osc1
) of at least 10 ms is required.
2. A 12 MHz crystal resonator should be used.
Other pins
Figure 19.77 H8S/2326 F-ZTAT Socket Adapter Pin Assignments
Section 19 ROM
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19.29.3 PROM Mode Operation
Table 19.56 shows how the different operating modes are set when using PROM mode, and table
19.57 lists the commands used in PROM mode. Details of each mode are given below.
Memory Read Mode: Memory read mode supports byte reads.
Auto-Program Mode: Auto-program mode supports programming of 128 bytes at a time. Status
polling is used to confirm the end of auto-programming.
Auto-Erase Mode: Auto-erase mode supports automatic erasing of the entire flash memory.
Status polling is used to confir m the end of auto -erasi ng.
Status Read Mode: Status polling is used for auto-progra mming and auto-erasi ng, and normal
termination can be confirmed by reading the I/O6 signal. In status read mode, error information is
output if an error occurs.
Table 19.56 Settings for Each O perating Mode in PROM Mode
Pin Names
Mode FWE CE OE WE I/O7 to I/O0 A
18 to A0
Read H or L L L H Data output Ain
Output disable H or L L H H Hi-Z X
Command write H or L*3 L H L Data input Ain*2
Chip disable*1 H o r L H X X Hi-Z X
Legend:
H: High level
L: Low level
Hi-Z: High impedance
X: Don’t care
Notes: 1. Chip disable is not a standby state; internally, it is an operation state.
2. Ain indicates that there is also address input in auto-program mode.
3. For command writes when making a transition to auto-program or auto-erase mode,
input a high level to the FWE pin.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 894 of 1268
REJ09B0220-0600
Table 19.57 PRO M Mode Co mmands
Number 1st Cycle 2nd Cycle
Command Name of Cycles Mode Address Data Mode Address Data
Memory read mode 1 + n Write X H'00 Read RA Dout
Auto-program mode 129 Write X H'40 Write PA Din
Auto-erase mode 2 Write X H'20 Write X H'20
Status read mode 2 Write X H'71 Write X H'71
Legend:
RA: Read address
PA: Program address
Notes: 1. In auto-program mode, 129 cycles are required for command writing by a simultaneous
128-byte write.
2. In memory read mode, the number of cycles depends on the number of address write
cycles (n).
19.29.4 Memory Read Mode
• After the end of an auto-program, auto-erase, or status read operation, the command wait state
is entered. To read memory contents, a transition must be made to memory read mode by
means of a command write before the read is executed.
• Command writes can be performed in memory read mode, just as in the command wait state.
• Once memory read mode has been entered, consecutive reads can be performed.
• After power-on, memory read mode is entered.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 895 of 1268
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Table 19.58 AC Characteristics in Memory Read Mode
Condition s: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Command write cycle tnxtc 20 — µs
CE hold time tceh 0 — ns
CE setup time tces 0 — ns
Data hold time tdh 50 — ns
Data setup time tds 50 — ns
Write pulse width twep 70 — ns
WE rise time tr — 30 ns
WE fall time tf — 30 ns
CE
A
18 to A0
Data H'00
OE
WE
Command write
twep tceh
tdh
tds
tftr
tnxtc
Note: Data is latched at the rising edge of WE.
tces
Memory read mode
Address stable
Data
Figure 19.78 Memory Read Mode Timing Waveforms after Command Write
Section 19 ROM
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Table 19.59 AC Characteristics when Entering Another Mode from Memory Read Mode
Condition s: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Command write cycle tnxtc 20 — µs
CE hold time tceh 0 — ns
CE setup time tces 0 — ns
Data hold time tdh 50 — ns
Data setup time tds 50 — ns
Write pulse width twep 70 — ns
WE rise time tr — 30 ns
WE fall time tf — 30 ns
CE
A
18
to A
0
I/O
7
to I/O
0
OE
WE
Other mode command write
t
ceh
t
ds
t
dh
t
f
t
r
t
nxtc
Note: Do not enable WE and OE at the same time.
t
ces
t
wep
Memory read mode
Address stable
Figure 19.79 Timing Waveforms when Entering Another Mode from Memory Read Mode
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 897 of 1268
REJ09B0220-0600
Table 19.60 AC Characteristics in Memory Read Mode
Condition s: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Access tim e tacc — 20 µs
CE output delay time tce — 150 ns
OE output delay time toe — 150 ns
Output disable delay time tdf — 100 ns
Data output hold time toh 5 — ns
CE
A
18
to A
0
I/O
7
to I/O
0
OE
WE VIH
VIL
VIL
t
acc
t
oh
t
oh
t
acc
Address stable Address stable
Figure 19.80 Timing Waveforms for CE/OE Enable State Read
CE
A18 to A0
I/O7 to I/O0
VIH
OE
WE
tce
tacc
toe
toh toh tdf
tce
tacc
toe
Address stable Address stable
tdf
Figure 19.81 Timing Waveforms for CE/OE Clocked Read
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 898 of 1268
REJ09B0220-0600
19.29.5 Auto-Program Mode
• In auto-program mode, 128 bytes are programmed simultaneously. For this purpose, 128
consecutive byte data transfers should be performed.
• A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case,
H'FF data must be written to the extra addresses.
• The lower 7 bits of the transfer addr ess must be held low. If an invalid address is input,
memory programming will be started but a programming error will occur.
• Memory address transfer is executed in the second cycle (figure 19.82). Do not perform
transfer later than the second cycle.
• Do not perform a command write during a programming operation.
• Perform one auto-programming operation for a 128-byte block for each address. One or more
additional programming operations cannot be carried o ut on add r ess b lo c ks that have already
been programmed.
• Confirm normal end of auto-programming by checking I/O6. Alternatively, status read mode
can also be used for this purpose (the I/O7 status polling pin is used to identify the end of an
auto-program operation).
• Status polling I/O6 and I/O7 information is retained until the next command write. As long as
the next command write has not been performed, reading is possible by enabling CE and OE.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 899 of 1268
REJ09B0220-0600
AC Characteristics
Table 19.61 AC Characteristics in Auto-Program Mode
Condition s: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Command write cycle tnxtc 20 — µs
CE hold time tceh 0 — ns
CE setup time tces 0 — ns
Data hold time t dh 50 — ns
Data setup time tds 50 — ns
Write pulse width twep 70 — ns
Status polling start time twsts 1 — ms
Status polling access time tspa — 150 ns
Address setup time tas 0 — ns
Address hold time tah 60 — ns
Memory write time twrite 1 3000 ms
WE rise time tr — 30 ns
WE fall time tf — 30 ns
Write setup time tpns 100 — ns
Write end setup time tpnh 100 — ns
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 900 of 1268
REJ09B0220-0600
Address stable
CE
FWE
A
18
to A
0
I/O
5
to I/O
0
I/O
6
I/O
7
OE
WE
t
as
t
ah
t
dh
t
ds
t
f
t
r
t
wep
t
wsts
t
write
t
spa
t
pns
t
pnh
t
nxtc
t
nxtc
t
ceh
t
ces
Programming operation
end identification signal
Data transfer
1 byte to 128 bytes
H'40 H'00
Programming normal
end identification signal
Figure 19.82 Auto-Program Mode Timing Waveforms
19.29.6 Auto-Erase Mode
• Auto-erase mode supports only total memory erasing.
• Do not pe rfor m a c ommand write d uring auto-erasing.
• Confirm normal end of auto-erasing by checking I/O6. Alternatively, status read mode can also
be used for this purpose (the I/O7 status polling pin is used to identify the end of an auto-erase
operation).
• Status polling I/O6 and I/O7 pin information is retained until the next command write. As long
as the next command write has not been performed, reading is possible by enabling CE and
OE.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 901 of 1268
REJ09B0220-0600
AC Characteristics
Table 19.62 AC Characteristics in Auto-Erase Mode
Condition s: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Command write cycle tnxtc 20 — µs
CE hold time tceh 0 — ns
CE setup time tces 0 — ns
Data hold time t dh 50 — ns
Data setup time tds 50 — ns
Write pulse width twep 70 — ns
Status polling start time tests 1 — ms
Status polling access time tspa — 150 ns
Memory erase time terase 100 40000 ms
WE rise time tr — 30 ns
WE fall time tf — 30 ns
Erase setup time tens 100 — ns
Erase end setup time tenh 100 — ns
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 902 of 1268
REJ09B0220-0600
CE
FWE
A
18
to A
0
I/O
5
to I/O
0
I/O
6
I/O
7
OE
WE
t
ests
t
erase
t
spa
t
dh
t
ds
t
f
t
r
t
wep
t
ens
t
enh
t
nxtc
t
nxtc
t
ceh
t
ces
Erase end identifi-
cation signal
Erase normal end
confirmation signal
H'20 H'20 H'00
Figure 19.83 Auto-Erase Mode Timing Waveforms
19.29.7 Status Read Mode
• Status read mode is used to identify what type of abnormal end has occurred. Use this mode
when an abnormal end occurs in auto-program mode or auto-erase mode.
• The return code is retained until a command write for other than status read mode is
performed.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 903 of 1268
REJ09B0220-0600
Table 19.63 AC Characteristics in Status Read Mode
Condition s: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item Symbol Min Max Unit
Command write cycle tnxtc 20 — µs
CE hold time tceh 0 — ns
CE setup time tces 0 — ns
Data hold time t dh 50 — ns
Data setup time tds 50 — ns
Write pulse width twep 70 — ns
OE output delay time toe — 150 ns
Disabl e delay time tdf — 100 ns
CE output delay time tce — 150 ns
WE rise time tr — 30 ns
WE fall time tf — 30 ns
CE
A
18
to A
0
I/O
7
to I/O
0
OE
WE
t
dh
t
df
t
ds
t
f
t
r
t
wep
t
nxtc
t
nxtc
t
f
t
r
t
wep
t
ds
t
dh
t
nxtc
t
ceh
t
ceh
t
oe
t
ces
t
ces
t
ce
H'71 H'71
Note: I/O
3
and I/O
2
are undefined.
Figure 19.84 Status Read Mode Timing Waveforms
Section 19 ROM
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REJ09B0220-0600
Table 19.6 4 Status Read Mode Return Commands
Pin Name I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0
Attribute Normal
end
identification
Command
error Program-
ming error Erase
error — — Program-
ming or
erase count
exceeded
Effective
address error
Initial value 0 0 0 0 0 0 0 0
Indications Normal
end: 0
Abnormal
end: 1
Command
error: 1
Otherwise: 0
Program-
ming
error: 1
Otherwise: 0
Erase
error: 1
Otherwise: 0
— — Count
exceeded: 1
Otherwise: 0
Effective
address
error: 1
Otherwise: 0
Note: I/O3 and I/O2 are undefined.
19.29.8 Status Polling
• The I/O7 status polling flag indicates the operating status in auto-program or auto-erase mode.
• The I/O6 status polling flag indicates a normal or abnormal end in auto-program or auto-erase
mode.
Table 19.6 5 Status Polling Output Truth Table
Pin Names Internal Operation
in Progress
Abnormal End
—
Normal End
I/O7 0 1 0 1
I/O6 0 0 1 1
I/O0 to I/O5 0 0 0 0
19.29.9 PROM Mode Transition Time
Commands cannot be accepted during the oscillatio n stabilization period or the PROM mode setup
period. After the PROM mode setup time, a transition is made to memory read mode.
Section 19 ROM
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REJ09B0220-0600
Table 19.66 Command Wait State Transition Time Specifications
Item Symbol Min Max Unit
Standby release (oscillation
stabilization time) tosc1 30 — ms
PROM mode setup time tbmv 10 — ms
VCC hold time tdwn 0 — ms
V
CC
RES
FWE
Memory read
mode
Command
wait state
Command
wait state
Normal/
abnormal end
identification
Auto-program mode
Auto-erase mode
t
osc1
t
bmv
t
dwn
Note: Except in auto-program mode and auto-erase mode, drive the FWE input pin low.
Figure 19.85 Oscillation Stabilization Time, PROM Mode Setup Time, and Power Supply
Fall Sequence
19.29.10 Notes on Memory Programming
• When programming addresses which have previously been programmed, carry out auto-
era s ing b efore auto-programming.
• When performing programming using PROM mode on a chip that has been
programmed/erased in an on-board programming mode, auto-erasing is recommended before
carrying out auto-programming.
Notes: 1. The flash memory is initially in the erased state when the device is shipped by Renesas
Technology. For other chips for which the erasure history is unknown, it is
recommended that auto-erasing be executed to check and supplement the initialization
(erase) level.
2. Auto-programming should be performed once only on the same address block.
Additional programming cannot be carried out on address blocks that have already
been programmed.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 906 of 1268
REJ09B0220-0600
19.30 Flash Memory Programming and Erasing Precautions
Precautions concerning the use of on-board programming mode, the RAM emulation function, and
PROM mode are summarized below.
Use the specified v oltages a nd ti ming fo r progra mming and erasing: Applied voltages in
excess of the rating can permanently damage the device. Use a PROM programmer that supports
the Renesas microcomputer device type with 512-kbyte on-chip flash memory (FZTAT512V3A).
Do not select the HN27C4096 setting for the PROM programmer, and only use the specified
socket adapter. Failure to observe these points may result in damage to the device.
Powering on and off (see figures 19.86 to 19.88): Do not apply a high level to the FWE pin until
VCC has stabilized. Also, d r ive the FWE pin low before turning off VCC.
When applying or disconnecting VCC power, fix the FWE pin low and place the flash memory in
the hardware protection state.
The power-on and power-off timing requirements should also be satisfied in the event of a power
failure and subsequent recovery.
FWE application/disconnection (see figures 19.86 to 19.88): FWE application should be carried
out when MCU operation is in a stable co nditio n. If MCU op e ratio n is not stab le, fix the FW E p in
low and set the protection state.
The following points must be observed concerning FWE application and disconnection to prevent
unintenti onal programming or erasing of flash memor y:
• Apply FWE when the VCC voltage has stabilized within its r ated voltage range.
• Apply FWE when oscillation has stabilized (after the elapse of the oscillation stabilization
time).
• In boot mode, apply and disconnect FWE during a reset.
• In user program mode, FWE can be switched between high and low level regardless of the
reset state. FWE input can also be switched during execution of a program in flash memory.
• Do not apply FWE if program runaway has occurred.
• Disconnect FWE only when the SWE1, ESU1, PSU1, EV1, PV1, P1, and E1 bits in FLMCR1,
and SWE2, ESU2, PSU2, EV2, PV2, P2, and E2 bits in FLMCR2 are cleared.
Make sure that the SWE1, ESU1, PSU1, EV1, PV1, P1, E1, and SWE2, ESU2, PSU2, EV2,
PV2, P2, and E2 bits are not set by mistake when applying or disconnecting FWE.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 907 of 1268
REJ09B0220-0600
Do not a pply a constant high level to t he F WE pin: Apply a high level to the FWE pin o nl y
when programming or erasing flash memory. A system configuration in which a high level is
constantly applied to the FWE pin should be avoid e d. Also, while a high level is applied to the
FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due
to program runaway, etc.
Use the recommended algorithm when programming and erasing flash memory: The
recommended algorithm enables programming and erasing to be carried out without subjecting the
device to voltage stress or sacrificing program data reliabilit y. W hen setting the P1 or E1 bit in
FLMCR1 or the P2 or E2 bit in FLMCR2, the watchdog timer should be set beforehand as a
precaution against program runaway, etc.
Notes on set t ing/clearing o f bits SWE1 and SWE2: Do not set o r clear the SWE1 bit or SWE2
bit during execution of a program in flash memory. Wait for at least 100 µs after clearing the
SWE1 bit or SWE2 bit before executing a program or reading data in flash memory.
When the SWE1 bit or SW E2 bit is set, data in flash memor y can be rewritten, but flash memory
addresses H'000000 to H'03FFFF can only be read in program-verify or erase-verify mode when
SWE1 = 1, and flash memory addresses H'040000 to H'07FFFF can only be read in program-
verify or erase-verify mode when SWE2 = 1. Access the relevant address area in flash memory
only for verify operations (verification during programming/erasing).
Also, do not cle ar the SWE1 bit or SWE2 bit dur ing programmin g, era sing, or verif yi ng.
Similarly, when using the RAM emulation function while a high level is being input to the FWE
pin, the SWE1 bit must be cleared before executing a program or reading data in flash memory.
However, the RAM area overlapping flash memory space can be read and written to regardless of
whether the SWE1 bit is set or cleared.
Do not use interrupts while flash memory is being programmed or erased: All interrupt
requests, including NMI, should be disabled during FWE applicatio n to give pr iority to
program/erase operations.
Do not perform additional programming. Erase the memory before reprogramming: In on-
board programming, perform only one programming operation on a 128-byte programming unit
block. In PROM mode, too, perform only one programming operation on a 128-byte programming
unit block. Programming should be carried out with the entire programming unit block erased.
Before programming, check that the chip is correctly mounted in the PROM programmer:
Overcurrent damage to the device can result if the index marks on the PROM programmer socket,
socket adapter, and chip are not correctly aligned.
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 908 of 1268
REJ09B0220-0600
Do not to uch t he so cket adapt er or chip during programming: To uching either of these can
cause contact faults and write errors.
Period during which flash memory access is prohibited
(x: Wait time after setting SWE bit)
*2
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
φ
V
CC
FWE
t
OSC1
Min 0 μs
Min 0 μs
t
MDS*3
t
MDS*3
MD2 to MD0
*1
RES
SWE bit SWE set SWE cleared
Programming/
erasing
possible
Wait time: x Wait time: 100 μs
Notes: 1. Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until
power-off by pulling the pins up or down.
2. See section 22.2.6, Flash Memory Characteristics.
3. Mode programming setup time t
MDS
(min) = 200 ns
Figure 19.86 Power-On/Off Timing (Boot Mode)
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 909 of 1268
REJ09B0220-0600
SWE set SWE cleared
φ
V
CC
FWE
t
OSC1
Min 0 μs
MD2 to MD0
*1
RES
SWE bit
Programming/
erasing
possible
Wait time: x Wait time: 100 μs
t
MDS*3
Period during which flash memory access is prohibited
(x: Wait time after setting SWE bit)
*2
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
Notes: 1. Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until
power-off by pulling the pins up or down.
2. See section 22.2.6, Flash Memory Characteristics.
3. Mode programming setup time t
MDS
(min) = 200 ns
Figure 19.87 Power-On/Off Timing (User Program Mode)
Section 19 ROM
Rev.6.00 Sep. 27, 2007 Page 910 of 1268
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Period during which flash memory access is prohibited
(x: Wait time after setting SWE bit)
*3
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations prohibited)
φ
V
CC
FWE
t
OSC1
Min 0 μs
t
MDS
t
MDS
t
MDS*2
t
RESW
MD2 to MD0
RES
SWE bit
Mode
change
*1
Mode
change
*1
Boot
mode User
mode User program mode
SWE
set SWE
cleared
Programming/erasing
possible
Wait time: x
Wait time: 100 μs
Programming/erasing
possible
Wait time: x
Wait time: 100 μs
Programming/erasing
possible
Wait time: x
Wait time: 100 μs
Programming/erasing
possible
Wait time: x
Wait time: 100 μs
User
mode User program
mode
Notes: 1. When entering boot mode or making a transition from boot mode to another mode, mode switching must be
carried out by means of RES input. The state of ports with multiplexed address functions and bus control
output pins (AS, RD, WR) will change during this switchover interval (the interval during which the RES pin
input is low), and therefore these pins should not be used as output signals during this time.
2. When making a transition from boot mode to another mode, a mode programming setup time t
MDS
(min) of 200
ns is necessary with respect to RES clearance timing.
3. See section 22.2.6, Flash Memory Characteristics.
Figure 19.88 Mode Transition Timing
(Example: Boot Mode → User Mode ↔ User Program Mode)
Section 20 Clock Pulse Generator
Rev.6.00 Sep. 27, 2007 Page 911 of 1268
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Section 20 Clock Pulse Generator
20.1 Overview
The chip has an on-chip clock pulse generator (CPG) that generates the system clock (φ), the bus
master clock, and internal clocks.
The clock pulse generator consists of an oscillator circuit, a duty adjustment circuit, a medium-
speed clock divider, and a bus master clock selection circuit.
In the chip, the CPG has a medium-speed mode in which the bus master runs on a medium-speed
clock and the other supporting modules run on the high-speed clock, and a function that allows the
medium-speed mode to be disabled and the clock division ratio to be changed for the entire chip.
A clock from φ/2 to φ/32 can be selected.
20.1.1 Block Diagram
Figure 20.1 shows a block diagram of the clock pulse generator.
EXTAL
XTAL
Note: * The DMAC is not supported in the H8S/2321.
Duty
adjustment
circuit
Oscillator Medium-
speed clock
divider
System clock
to φ pin Internal clock
to supporting
modules
Bus master clock
to CPU, DTC,
and DMAC*
φ/2 to φ/32
DIV
SCK2 to SCK0
SCKCR
Bus master
clock
selection
circuit
Figure 20.1 Block Diagram of Clock Pulse Generator
Section 20 Clock Pulse Generator
Rev.6.00 Sep. 27, 2007 Page 912 of 1268
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20.1.2 Register Configuration
The clock pulse generator is controlled by SCKCR. Table 20.1 shows the register configuration.
Table 20.1 Clock Pulse Generator Register
Name Abbreviation R/W Initial Value Address*
System clo ck con tro l regi ster SCKCR R/W H'00 H'FF3A
Note: * Lower 16 bits of the address.
20.2 Register Descriptions
20.2.1 System Clock Control Register (SCKCR)
Bit : 7 6 5 4 3 2 1 0
PSTOP — DIV — — SCK2 SCK1 SCK0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W — — R/W R/W R/W
SCKCR is an 8-bit readable/writable register that controls φ clock output, the medium-speed mode
in which the bus master runs on a medium-speed clock and the other supporting modules run on
the high-speed clock, and a function that allows the medium-speed mode to be disabled and the
clock division ratio to be changed for the entire chip.
SCKCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit 7—φ Clock Output Disable (PSTOP): Contro ls φ output.
Description
Bit 7
PSTOP
Normal Operation
Sleep Mode Software
Standby Mode Hardw are
Standby Mode
0 φ output (Initial value) φ output Fixed high High impedance
1 Fixed high Fixed high Fixed high High impedance
Bit 6—Reserved: This bit can be read or written to, but only 0 should be written.
Section 20 Clock Pulse Generator
Rev.6.00 Sep. 27, 2007 Page 913 of 1268
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Bit 5—Division Ratio Select (DIV): When the DIV bit is set to 1, the medium-speed mode is
disabled and a clock obtained using the division ratio set with bits SCK2 to SCK0 is supplied to
the entire chip. In this way, the current dissipation within the chip is reduced in proportion to the
divisi on ratio. As t he fr equency o f φ changes, the following points must be noted.
• The division ratio set with bits SCK2 to SCK0 s hould be selected so as to fall within the
guaranteed o per ation range of clock cycle t ime t cyc given in t he AC timing table in the
Electrical Characteristics section. Ensure that φ min = 2 MHz, and the condition φ < 2 MHz
does not arise.
• All internal modules basically operate on φ. Note, therefore, that time processing involving the
timers, the SCI, etc., will change when the division ratio changes. The wait time when software
standby is cleared will also change in line with a change in the division ratio.
• The division ratio can be changed while the chip is operating. The clock output from the φ pin
will also change when the division ratio is changed. The frequency of the clock output from
the φ pin in this case will be as follows:
φ = EXTAL × n
Where: EXTAL: Crystal resonator or external clock frequency
n: Divi sion ra t io (n = φ/2, φ/4, or φ/8)
• Do not set the DIV bit and bits SCK2 to SCK0 simultaneousl y. First set the DIV bit, then bits
SCK2 to SCK0.
Bit 5
DIV
Description
0 When bits SCK2 to SCK0 are set to other than high-speed mode, medium-speed
mode is set (Initial value)
1 When bits SCK2 to SCK0 are set to other than high-speed mode, a divided clock is
supplied to the entir e chip
Bits 4 and 3—Reserved: These bits cannot be modified and are always read as 0.
Bits 2 to 0—System Clock Select 2 to 0 (SCK2 to SCK0): When the DIV bit is cleared to 0,
these bits select the mediu m-speed mode; when the DIV bit is set to 1, they select the division
ratio of the clock supplied to the entire chip.
Section 20 Clock Pulse Generator
Rev.6.00 Sep. 27, 2007 Page 914 of 1268
REJ09B0220-0600
Description
Bit 2
SCK2
Bit 1
SCK1
Bit 0
SCK0 DIV = 0 DIV = 1
0 0 0 Bus master is in high-speed
mode (Initial value)
Bus master is in high-speed
mode (Initial value)
1 Medium-speed clo ck is φ/2 Clock supplied to entire chip is φ/2
1 0 Medium-speed clo ck is φ/4 Clock supplied to entire chip is φ/4
1 Medium-speed clo ck is φ/8 Clock supplied to entire chip is φ/8
1 0 0 Medium-speed clock is φ/16 —
1 Medium-speed clo ck is φ/32 —
1 — — —
20.3 Oscillator
Clock pulses can be supplied by connecting a crystal resonator, or by input of an external clock.
20.3.1 Connecting a Crystal Resonator
Circuit Configuratio n: A crystal resonator can be connected as shown in the example in figure
20.2. Select the damping resistance Rd according to table 20.2. An AT-cut parallel-resonance
crystal should be used.
EXTAL
XTAL R
d
C
L2
C
L1
C
L1
= C
L2
= 10 to 22 pF
Figure 20.2 Connection of Crystal Resonator (Example)
Table 20.2 Damping Resistance Value
Frequency (MHz) 2 4 8 12 16 20 25
Rd (Ω) 6.8 k 500 200 0 0 0 0
Section 20 Clock Pulse Generator
Rev.6.00 Sep. 27, 2007 Page 915 of 1268
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Crystal Resonator: Fi gure 20.3 shows the eq ui vale nt circuit of the crystal reso nator . Use a cr yst al
resonator that has the characteristics shown in table 20.3 and the same resonance frequency as the
system clock (φ).
XTAL
CL
AT-cut parallel-resonance type
EXTAL
C0
LR
s
Figure 20.3 Crystal Resonator Equivalent Circuit
Table 20.3 Crystal Resonator Characteristics
Frequency (MHz) 2 4 8 12 16 20 25
RS max (Ω) 500 120 80 60 50 40 40
C0 max (pF) 7 7 7 7 7 7 7
Notes on Board Design: When a crystal resonator is connected, the following points should be
noted:
Other signal lines should be routed a way fro m the oscillator circuit to prevent induction from
interfering with correct oscillation. See figure 20.4.
When designing the board, place the crystal resonator and its load capacitors as close as possible
to the XTAL and EXTAL pins.
CL2
Signal A Signal B
CL1
Chip
XTAL
EXTAL
A
void
Figure 20.4 Example of Incorrect Board Design
Section 20 Clock Pulse Generator
Rev.6.00 Sep. 27, 2007 Page 916 of 1268
REJ09B0220-0600
20.3.2 External Clock Input
Circuit Configuratio n: An external clock signal can be input as shown in the examples in figure
20.5. If the XTAL pin is left open, make sure that stray capacitance is no more than 10 pF.
In example (b), make sure that the external clock is held high in standby mode.
EXTAL
XTAL
External clock input
Open
(a) XTAL pin left open
EXTAL
XTAL
External clock input
(b) Complementary clock input at XTAL pin
Figure 20. 5 External Cloc k Input (Examples)
External Clock: The external clock signal should have the same frequency as the system clock
(φ).
Table 20.4 and figure 20.6 show the input conditio ns for the external cloc k.
Section 20 Clock Pulse Generator
Rev.6.00 Sep. 27, 2007 Page 917 of 1268
REJ09B0220-0600
Table 20.4 External Clock Input Conditions
V
CC = 2.7 V
to 3.6 V V
CC = 3.0 V
to 3.6 V
Item Symbol Min Max Min Max Unit
Test
Conditions
External clo ck inpu t
low pulse width tEXL 20 — 10 — ns Figure 20.6
External clo ck inpu t
high pulse width tEXH 20 — 10 — ns
External clock rise time tEXr — 5 — 5 ns
External clock fall time tEXf — 5 — 5 ns
tCL 0.4 0.6 0.4 0.6 tcyc φ ≥ 5 MHz Figure 22-2 Clock low pulse width
level 80 — 80 — ns φ < 5 MHz
Clock high pulse width tCH 0.4 0.6 0.4 0.6 tcyc φ ≥ 5 MHz
level 80 — 80 — ns φ < 5 MHz
EXTAL
XTAL
External clock input
Open
(a) XTAL pin left open
EXTAL
XTAL
External clock input
(b) Complementary clock input at XTAL pin
Figure 20.6 External Clock Input Timing
Section 20 Clock Pulse Generator
Rev.6.00 Sep. 27, 2007 Page 918 of 1268
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20.4 Duty Adjustment Circuit
When the oscillator frequency is 5 MHz o r higher, the duty adjustment circuit adjusts the duty
cycle of the clock signal from the oscillator to generate the syste m clock (φ).
20.5 Medium-Speed Clock Divider
The medium-speed clock divider divides the system clock to generate φ/2, φ/4, φ/8, φ/16, and φ/32.
20.6 Bus Master Clock Selection Circuit
The bus master clock selection circuit selects the system clock (φ) or one of the medium-speed
clocks (φ/2, φ/4, φ/8, φ/16, or φ/32) to be supplied to the bus master, according to the settings of
the SCK2 to SCK0 bits in SCKCR.
Section 21 Power-Down Modes
Rev.6.00 Sep. 27, 2007 Page 919 of 1268
REJ09B0220-0600
Section 21 Power-Down Modes
21.1 Overview
In addition to the normal progra m execution state, the chip has fi ve power-down modes in which
operation of the CPU and oscillator is halted and power dissipation is reduced. Low-power
operation can be achieved by individually controlling the CPU, on-chip supporting modules, and
so on.
The chip operating modes are as follows:
1. High-speed mode
2. Medium-speed mode
3. Sleep mode
4. Module stop mode
5. Software standby mode
6. Hardware standby mode
Of these, 2 to 6 are power-down modes. Sleep mode is a CPU mode, medium-speed mode is a
CPU and bus master mode, and module stop mode is an on-chip supporting module mode
(including bus masters other than the CPU). A combination of these modes can be set.
After a reset, the chip is in high-speed mode.
Table 21.1 shows the conditions for transition to the various modes, the status of t he CPU, on-chip
supporting modules, etc., and the method of clearing each mode.
Section 21 Power-Down Modes
Rev.6.00 Sep. 27, 2007 Page 920 of 1268
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Table 21.1 Operating Mo des
CPU Modules
Operating
Mode Transition
Condition Clearing
Condition Oscillator Registers Registers I/O Ports
High speed
mode Control
register Functions High
speed Function High
speed Function High speed
Medium-
speed mode Control
register Functions Medium
speed Function High/
medium
speed *1
Function High speed
Sleep mode Instruction Interrupt Functions Halted Retained High
speed Function High speed
Module stop
mode Control
register Functions High/
medium
speed
Function Halted Retained/
reset *2 Retained
Software
standby
mode
Instruction External
interrupt Halted Halted Retained Halted Retained/
reset *2 Retained
Hardware
standby
mode
Pin Halted Halted Undefined Halted Reset High
impedance
Notes: 1. The bus master operates on the medium-speed clock, and other on-chip supporting
modules on the high- sp eed clo ck.
2. Some SCI registers and the A/D converter are reset, and other on-chip supporting
modules retain their states.
21.1.1 Register Configuration
Power-down modes are controlled by the SBYCR, SCKCR, and MSTPCR registers. Table 21.2
summarizes these registers.
Table 21.2 Power-Down Mode Registers
Name Abbreviation R/W Initial Value Address*
Standby control register SBYCR R/W H'08 H'FF38
System clo ck con tro l regi ster SCKCR R/W H'00 H'FF3A
Module stop control register H MSTPCRH R/W H'3F H'FF3C
Module stop control register L MSTPCRL R/W H'FF H'FF3D
Note: * Lower 16 bits of the address.
Section 21 Power-Down Modes
Rev.6.00 Sep. 27, 2007 Page 921 of 1268
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21.2 Register Descriptions
21.2.1 Standby Control Register (SBYCR)
Bit : 7 6 5 4 3 2 1 0
SSBY STS2 STS1 STS0 OPE — — IRQ37S
Initial value : 0 0 0 0 1 0 0 0
R/W : R/W R/W R/W R/W R/W — — R/W
SBYCR is an 8-bit readable/writable register that performs software standby mode control.
SBYCR is initialized to H'08 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit 7—So ftware Standby ( SSBY): Specifies a transition to software standby mode. Remains set
to 1 when software standby mode is released by an external interrupt, and a transition is made to
normal operation. The SSBY b it should be cleared by writing 0 to it.
Bit 7
SSBY
Description
0 Transition to sleep mode after execution of SLEEP instruction (Initial value)
1 Transition to software standby mode after execution of SLEEP instruction
Bits 6 to 4—Standby Timer Select 2 to 0 (STS2 to STS0): These bits select the time the MCU
waits for the clock to stabilize when software standby mode is cleared by an external interrupt.
With crystal oscillation, refer to tab le 2 1.4 and make a selection accord ing to the operating
frequency so that the standby time is at least 8 ms (the oscillation stabilization time). With an
external clock, any selection can be made*.
Note: * Except in the F-ZTAT versions.
Section 21 Power-Down Modes
Rev.6.00 Sep. 27, 2007 Page 922 of 1268
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Bit 6
STS2 Bit 5
STS1 Bit 4
STS0
Description
0 0 0 Standby time = 8192 states (Initial value)
1 Standby time = 16384 states
1 0 Standby time = 32768 states
1 Standby time = 65536 states
1 0 0 Standby time = 131072 states
1 Standby time = 262144 states
1 0 Reserved
1 Standby time = 16 states*
Note: * Not available in the F-ZTAT versions.
Bit 3—Output Port Enable (OPE): Specifies whether the output of the address bus and bus
control signals (CS0 to CS7, AS, RD, HWR, LWR, CAS) is retained or set to the high-impedance
state in software standby mode.
Bit 3
OPE
Description
0 In software standby mode, address bus and bus control signals are high-impedance
1 In software standby mode, address bus and bus control signals retain output state
(Initial value)
Bits 2 and 1—Reserved: These bits cannot be modified and are always read as 0.
Bit 0—IRQ37 Software Standby Clear Select (IRQ37S): Specifies whether inputs IRQ3 to
IRQ7 can be used as software standby mode clearing sources in addition to the usual sources, NMI
and IRQ0 to IRQ2 inputs.
Bit 0
IRQ37S
Description
0 Inputs IRQ3 to IRQ7 cannot be used as software standby mode clearing sources
(Initial value)
1 Inputs IRQ3 to IRQ7 can be used as software standby mode clearing sources
Section 21 Power-Down Modes
Rev.6.00 Sep. 27, 2007 Page 923 of 1268
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21.2.2 System Clock Control Register (SCKCR)
Bit : 7 6 5 4 3 2 1 0
PSTOP — DIV — — SCK2 SCK1 SCK0
Initial value : 0 0 0 0 0 0 0 0
R/W : R/W R/W R/W — — R/W R/W R/W
SCKCR is an 8-bit readable/writable register that controls φ clock output, the medium-speed mode
in which the bus master runs on a medium-speed clock and the other supporting modules run on
the high-speed clock, and a function that allows the medium-speed mode to be disabled and the
clock division ratio to be changed for the entire chip.
SCKCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit 7—φ Clock Output Disable (PSTOP): Contro ls φ output.
Description
Bit 7
PSTOP Normal
Operating Mode
Sleep Mode Software
Standby Mode Hardware
Standby Mode
0 φ output (Initial value) φ output Fixed high High impedance
1 Fixed high Fixed high Fixed high High impedance
Bit 6—Reserved: This bit can be read or written to, but only 0 should be written.
Bit 5—Division Ratio Select (DIV): When the DIV bit is set to 1 , the medium-speed mode is
disabled and a clock obtained using the division ratio set with bits SCK2 to SCK0 is supplied to
the entire chip. In this way, the current dissipation within the chip is reduced in proportion to the
divisi on ratio. As t he fr equency o f φ changes, the following points must be noted.
• The division ratio set with bits SCK2 to SCK0 s hould be selected so as to fall within the
guaranteed o per ation range of clock cycle t ime t cyc given in t he AC timing table in the
Electrical Characteristics section. Ensure that φ min = 2 MHz, and the condition φ < 2 MHz
does not arise.
• All internal modules basically operate on φ. Note, therefore, that time processing involving the
timers, the SCI, etc., will change when the division ratio changes. The wait time when software
standby is cleared will also change in line with a change in the division ratio.
Section 21 Power-Down Modes
Rev.6.00 Sep. 27, 2007 Page 924 of 1268
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• The division ratio can be changed while the chip is operating. The clock output from the φ pin
will also change when the division ratio is changed. The frequency of the clock output from
the φ pin in this case will be as follows:
φ = EXTAL × n
Where: EXT AL: Crystal resonator or external clock frequency
n: Divi si on rat i o (n = φ/2, φ/4, or φ/8)
• Do not set the DIV bit and bits SCK2 to SCK0 simultaneousl y. First set the DIV bit, then bits
SCK2 to SCK0.
Bit 5
DIV
Description
0 When bits SCK2 to SCK0 are set to other than high-speed mode, medium-speed
mode is set (Initial value)
1 When bits SCK2 to SCK0 are set to other than high-speed mode, a divided clock is
supplied to the entir e chip
Bits 4 and 3—Reserved: These bits cannot be modified and are always read as 0.
Bits 2 to 0—System Clock Select 2 to 0 (SCK2 to SCK0): When the DIV bit is cleared to 0,
these bits select the bus master clo c k; when the DIV bit is set to 1, they select the divi sion ratio of
the clock supplied to the entire chip.
Bit 2 Bit 1 Bit 0 Description
SCK2 SCK1 SCK0 DIV = 0 DIV = 1
0 0 0 Bus master is in high-speed
mode (Initial value)
Bus master is in high-speed
mode (Initial value)
1 Medium-speed clo ck is φ/2 Clock supplied to entire chip is φ/2
1 0 Medium-speed clo ck is φ/4 Clock supplied to entire chip is φ/4
1 Medium-speed clo ck is φ/8 Clock supplied to entire chip is φ/8
1 0 0 Medium-speed clock is φ/16 —
1 Medium-speed clo ck is φ/32 —
1 — — —
Section 21 Power-Down Modes
Rev.6.00 Sep. 27, 2007 Page 925 of 1268
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21.2.3 Module Stop Control Register (MSTPCR)
MSTPCRH MSTPCRL
Bit : 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Initial value : 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1
R/W : R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MSTPCR is a 16-bit readable/writable register that performs module stop mode control.
MSTP CR is initialized to H'3FFF by a reset a nd in hardware stand by mode. It is not initialized in
software standby mode.
Bits 15 to 0—Module Stop (MSTP15 to MSTP0): These bits specify module stop mode. See
table 21.3 for the method of selecting on-chip supporting modules.
Bits 15 to 0
MSTP15 to MSTP0
Description
0 Module stop mode cleared
1 Module stop mode set
21.3 Medium-Speed Mode
When the SCK2 to SCK0 bits in SCKCR are set to 1, the operating mode changes to mediu m-
speed mode as soon as the current bus cycle ends. In medium-speed mode, the CPU operates on
the operating clock (φ/2, φ/4, φ/8, φ/16, or φ/32) specified by the SCK2 to SCK0 bits. The bus
masters other than the CP U (the DMAC* and DTC) also operate in medium-speed mode. On-chip
supporting modules other than the bus masters always operate on the high-speed clock (φ).
In medium-speed mode, a bus access is executed in the specified number of states with respect to
the bus master operating clock. For example, if φ/4 is selected as the op erating clock, on-c hip
memory is accessed in 4 states, and internal I/O registers in 8 states.
Medium-speed mode is cleared by clearing all of bits SCK2 to SCK0 to 0. A transition is made to
high-speed mode and medium-speed mode is cleared at the end of the current bus cycle.
If a SLEEP instruction is executed when the SSBY b it in SBYCR is cleared to 0 , a transition is
made to sleep mode. When sleep mode is cleared by an interrupt, medium-speed mode is restored.
Section 21 Power-Down Modes
Rev.6.00 Sep. 27, 2007 Page 926 of 1268
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If a SLEEP instruction is exec uted when the SSBY bit in SB YCR is set to 1, a transition is made
to software standby mode. When software standby mode is cleared by an external interrupt,
medium-speed mode is restored.
When the RES pin is driven low, a transition is made to the reset state, and medium-speed mode is
cleared. The same applies in the case of a reset caused by overflow of the watchdog timer.
When the STBY pin is driven low, a transition is made to hard ware standby mode.
Figure 21.1 shows the timing for transition to and clearance of mediu m-speed mode.
Note: * The DMAC is not supported in the H8S/2321.
φ,
supporting module
clock
Bus master clock
Internal address bus
Internal write signal
Medium-speed mode
SCKCRSCKCR
Figure 21.1 Medium-Speed Mode Transition and Clearance Timing
21.4 Sleep Mode
If a SLEEP instruction is executed when the SSBY bit in SBYCR is cleared to 0, the CPU enters
sleep mode. In sleep mode, CPU operation stops but the contents of the CPU’s internal registers
are retained. Other supporting modules do not stop.
Sleep mode is cleared by a reset or any interrupt, and the CPU returns to the normal program
execution state via the exception handling state. Sleep mode is not cleared if interrupts are
disabled, or if interrupts other than NMI are masked by the CPU.
When the STBY pin is driven low, a transition is made to hard ware standby mode.
Section 21 Power-Down Modes
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21.5 Module Stop Mode
21.5.1 Module Stop Mode
Module stop mode can be set for individual on-chip supporting modules.
When the corresponding MSTP bit in MSTPCR is set to 1, module operation stops at the end of
the bus cycle and a transitio n is made to module stop mode. The CPU continues operating
independently.
Table 21.3 shows MSTP bits and the corresponding on-chip supporting modules.
When the corresponding MSTP bit is cleared to 0, module stop mode is cleared and the module
starts operating at the end of the bus cycle. In module stop mode, the internal states of modules
other than the SCI and A/D converter are retained.
After reset clearance, all modules other than DMAC* and DTC are in module stop mode.
When an on-chip supporting module is in module stop mode, read/write access to its registers is
disabled.
Do not make a transition to sleep mode with MSTPCR set to H'FFF F or H'EFFF, as this will halt
operation of the bus controller.
Note: * The DMAC is not supported in the H8S/2321.
Section 21 Power-Down Modes
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Table 21.3 MSTP Bits and Corresponding On-Chip Supporting Modules
Register Bit Module
MSTPCRH MSTP15 DMA controller (DMAC)*
MSTP14 Data transfer controller (DTC)
MSTP13 16-bit timer-pulse unit (TPU)
MSTP12 8-bit timer module
MSTP11 Programmable pulse generator (PPG)
MSTP10 D/A converter (channels 0 and 1)
MSTP9 A/D converter
MSTP8 —
MSTPCRL MSTP7 Serial communication interface (SCI) channel 2
MSTP6 Serial communication interface (SCI) channel 1
MSTP5 Serial communication interface (SCI) channel 0
MSTP4 —
MSTP3 —
MSTP2 —
MSTP1 —
MSTP0 —
Notes: Bits 8 and 4 to 0 can be read or written to, but do not affect operation.
* The DMAC is not supported in the H8S/2321.
21.5.2 Usage Notes
DMAC*/DTC Module Stop: Depending on the operat ing s tatus of the D MAC* or DTC, the
MSTP15 and MSTP14 bits may not be set to 1. Setting of the DMAC* or DTC module stop mode
should be carried out only when the respective module is not activated.
For details, refer to section 7, DMA Controller, and section 8, Data Transfer Controller.
On-Chip Supporting Module Interrupts: Relevant interrupt operations cannot be performed in
module stop mode. Consequently, if module stop mode is entered when an interrupt has been
requested, it will not be possible to clear the CP U interrupt so urce or the DMAC* or DTC
activation source. Interrupts should therefore be disabled before entering module stop mode.
Writing to MSTPCR: MSTPCR should only be writte n to by the CPU.
Note: * The DMAC is not supported in the H8S/2321.
Section 21 Power-Down Modes
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21.6 Software Standby Mode
21.6.1 Software Standby Mode
If a SLEEP instruction is executed when the SSBY bit in SBYCR is set to 1, software standby
mode is entered. In this mode, the CPU, on-chip supporting modules, and oscillator all stop.
However, the contents of the CPU’s internal registers, RAM data, and the states of on-chip
supporting modules other than the SCI and A/D converter, and I/O ports, are retained. Whether the
address bus and bus control signals are placed in the high-impedance state or retain the output
state can be specified by the OPE bit in SBYCR. See Appendix D, Pin States, for details.
In this mode the oscillator stops, and therefore power dissipation is significantly reduced.
21.6.2 Clearing Software St andby Mode
Software standby mode is cleared by an external interrupt (NMI pin, or pins IRQ0 to IRQ7*), or
by means of the RES pin or STBY pin.
Clearing with an Interrupt: When an NMI or IRQ0 to IRQ7* interrupt request signal is input,
clock oscillation starts, and after the elapse of the time set in b its STS2 to STS0 in SYSCR, stable
clocks are supplied to the entire chip, software standby mode is cleared, and interrupt exception
handling is started.
When clearing software standby mode with an IRQ0 to IRQ7* interrupt, set the corresponding
enable bit to 1 and ensure that no interrupt with a higher priority than interrupts IRQ0 to IRQ7* is
generated. Software standby mode cannot be cleared if the interrupt has been masked on the CPU
side or has been designated as a DTC activation source.
Note: * Setting the IRQ37S bit to 1 enables IRQ3 to IRQ7 to be used as software standby mode
clearing sources.
Clearing with the RES Pin: When the RES pi n is driven low, clock oscillation is started. At the
same time as clock oscillatio n starts, clocks are supplied to the entire chip. Note that the RES pin
must be held lo w until clock oscillation stabilizes. W hen the RES pin goes high, the CPU begins
reset exception handling.
Clearing with the STBY Pin: W hen the STBY p in i s dr iven low, a transition is made to hardware
standby mode.
Section 21 Power-Down Modes
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21.6.3 Setting O scilla tion Stabilization Time after Clea ring Software Standby Mo de
Bits STS2 to STS0 in SBYCR should be set as described below.
Using a Crystal Oscillato r: Set bits STS2 to STS0 so that the standby time is at lea st 8 ms (the
oscillation stabilization time).
Table 21.4 shows the standby times for different operating frequencies and settings of bits STS2 to
STS0.
Table 21.4 O scilla tion Stabilization Time Settings
STS2
STS1
STS0
Standby Time 25
MHz 20
MHz 16
MHz 12
MHz 10
MHz 8
MHz 6
MHz 4
MHz 2
MHz
Unit
0 0 0 8192 states 0.32 0.41 0.51 0.68 0.8 1.0 1.3 2.0 4.1 ms
1 16384 states 0.65 0.82 1.0 1.3 1.6 2.0 2.7 4.1 8.2
1 0 32768 states 1.3 1.6 2.0 2.7 3.3 4.1 5.5 8.2 16.4
1 65536 states 2.6 3.3 4.1 5.5 6.6 8.2 10.9 16.4 32.8
1 0 0 131072 states 5.2 6.6 8.2 10.9 13.1 16.4 21.8 32.8 65.5
1 262144 states 10.4 13.1 16.4 21.8 26.2 32.8 43.6 65.6 131.2
1 0 Reserved — — — — — — — — — —
1 16 states 0.6 0.8 1.0 1.3 1.6 2.0 2.7 4.0 8.0 µs
: Recommended time setting
Using an External Clock: Any value can be set. Normally, use of the minimum time is
recommended.*
Note: * The 16-state standby time cannot be used in the F-ZTAT versions; a standby time of 8192
states or longer should be used.
21.6.4 Soft w are Standby Mode Applicatio n Example
Figure 21.2 shows an example in which a transitio n is made to software standby mode at the
falling edge on the NMI pin, and software standby mode is cleared at the rising edge on the NMI
pin.
In this example, an NMI interrupt is accepted with the NMIEG bit in SYSCR cleared to 0 (falling
edge specification), then the NMIEG bit is set to 1 (rising edge specification), the SSBY b it is set
to 1, and a SLEEP instruction is executed, causin g a transition to software standby mode.
Section 21 Power-Down Modes
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Software standby mode is then cleared at the rising edge on the NMI pin.
Oscillator
φ
NMI
NMIEG
SSBY
NMI exception
handling
NMIEG=1
SSBY=1
SLEEP instruction
Software standby mode
(power-down mode) Oscillation
stabilization
time tOSC2
NMI exception
handling
Figure 21.2 Softw are Standby Mode Application Example
21.6.5 Usage Notes
I/O Port St atus: In software standby mode, I/O port states are retained. If the OPE bit is set to 1 ,
the address bus and bus control signal output is also retained. Therefore, there is no reduction in
curr ent di ssipation fo r the output cur rent when a hi gh-level signa l is output .
Current Dissipation during Oscillation Stabiliza t ion Wait Period: Current dissipation
increases during the oscillation stabilization wait period.
Write Data Buffer Function: The write data buffer function and software standby mode cannot
be used at the same time. When the write data buffer function is used, the WDBE b it in BCR L
should be cleared to 0 to cancel the write data buffer function before entering software standby
mode. Also check that external writes have finished, by reading external addresses, etc., before
executing a SLEEP instruction to enter software standby mode. See section 6.9, Write Data B uffer
Function, for details of the write data buffer function.
Section 21 Power-Down Modes
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21.7 Hardware Standby Mode
21.7.1 Hardware Standby Mode
When the STBY pin is driven low, a transition is made to hardware standby mode from any mode.
In hardware standby mode, all functions enter the reset state and stop o peration, resulting in a
significant reduction in power dissipation. As long as the prescribed voltage is supplied, on-chip
RAM data is retained. I/O ports are set to the high-impedance state.
In order to retain on-chip RAM data, the RAME bit in SYSCR should be cleared to 0 before
driving the STBY pi n low.
Do not change the state of the mode pins (MD2 to MD0) while the chip is in hardware standby
mode.
Hardware standby mode is cleared by means of the STBY pin and the RES pin. When the STBY
pin is driven high while the RES pin is low, the reset state is set and clock oscillation is started.
Ensure that the RES pin is held low until the clock oscillator stabilizes (at least 8 ms—the
oscillation stabilization ti me—when using a crystal oscillator). When the RES pin is subse quently
driven high, a transition is made to the program execution state via the reset exception han d ling
state.
21.7.2 Hardware Standby Mode Timing
Figure 21.3 shows an example of hardware standby mode timing.
When the STBY pin is driven low after the RES pin has been driven low, a transition is mad e to
hardware standby mode. Hardware standby mode is cleared by driving the STBY pin high,
waiting for the oscillation stab ilization time, then changing the RES pin from low to high.
Section 21 Power-Down Modes
Rev.6.00 Sep. 27, 2007 Page 933 of 1268
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Oscillator
RES
STBY
Oscillation
stabilization
time
Reset
exception
handling
Figure 21.3 Hardware Standby Mode Timing
21.8 φ Clock Output Disabling Function
Output of the φ clock can be controlled by means of the PSTOP bit in SCKCR, and DDR for the
corresponding port. When the PSTOP bit is set to 1, the φ clock stops at the end of the bus cycle,
and φ output goe s hig h. φ clock output is enabled when the PSTOP bit is cleared to 0. When DDR
for the corresponding port is cleared to 0, φ clock output is disabled and input port mode is set.
Table 21.5 shows the state of the φ pin in each processing state.
Table 21.5 φ P in St ate in Each Pro cessing State
DDR 0 1
PSTOP — 0 1
Hardware standby mode High impedance
Software standby mode High impedance Fixed high
Sleep mode High impedance φ output Fixed high
Normal operating state High impedance φ output Fixed high
Section 21 Power-Down Modes
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Section 22 Electrical Characteristics
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Section 22 Electrical Characteristics
22.1 Electrical Characteristics of Mask ROM Version (H8S/2328,
H8S/2327, H8S/2323) and ROMless Version (H8S/2324S, H8S/2322R,
H8S/2321, H8S/2320)
22.1.1 Absolute Maximum Ratings
Table 22.1 lists the abso lute maximum ratings.
Table 22.1 Absolut e M aximum Ratings
Item Symbol Value Unit
Power supply voltage VCC –0.3 to +4.6 V
Input voltage (except port 4) Vin –0.3 to VCC +0.3 V
Input voltage (port 4) Vin –0.3 to AVCC +0.3 V
Reference power supply voltage Vref –0.3 to AVCC +0.3 V
Analog power supply voltage AVCC –0.3 to +4.6 V
Analog input voltage VAN –0.3 to AVCC +0.3 V
Operating temperature Topr Regular specifications: –20 to +75 °C
Wide-range specifications: –40 to +85 °C
Storage temperature Tstg –55 to +125 °C
Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded.
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 936 of 1268
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22.1.2 DC Characteristics
Table 22.2 DC Characteristics (H8S/2328, H8S/2327, H8S/2323)
Conditions: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS =
0 V*1, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-
range specifications)
Item
Symbol
Min
Typ
Max
Unit Test
Conditions
VT– V
CC × 0.2 — — V
VT+ — — VCC × 0.7 V
Schmitt
trigger input
voltage
Ports 1, 2,
P64 to P67
PA4 to PA7
Port 5 (when using
IRQ)
VT+ – VT– V
CC × 0.07 — — V
Input high
voltage RES, STBY, NMI,
MD2 to MD0 VIH V
CC × 0.9 — VCC + 0.3 V
EXTAL VCC × 0.7 — VCC + 0.3 V
Ports 3, 5,
B to G, P60 to P63,
PA0 to PA3
2.2 — VCC + 0.3 V
Port 4 2.2 — AVCC + 0.3 V
Input low
voltage RES, STBY,
MD2 to MD0 VIL –0.3 — VCC × 0.1 V
NMI, EXTAL,
Ports 3 to 5,
B to G, P60 to P63,
PA0 to PA3
–0.3 — VCC × 0.2 V
All output pins VOH V
CC – 0.5 — — V IOH = –200 μA Output high
voltage V
CC – 1.0 — — V IOH = –1 mA
Output low
voltage All output pins VOL — — 0.4 V IOL = 1.6 mA
RES | Iin | — — 10.0 μA Input
leakage
current STBY, NMI,
MD2 to MD0 — — 1.0 μA
Vin = 0.5 V to
VCC – 0.5 V
Port 4 — — 1.0 μA Vin = 0.5 V to
AVCC – 0.5 V
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 937 of 1268
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Item
Symbol
Min
Typ
Max
Unit Test
Conditions
Three-state
leakage
current
(off state)
Ports 1, 2, 3, 5, 6, A
to G | ITSI | — — 1.0 μA Vin = 0.5 V to
VCC – 0.5 V
Input pull-up
MOS current Ports A to E –Ip 10 — 300 μA VCC = 2.7 V to
3.6 V,
Vin = 0 V
RES C
in — — 30 pF
NMI — — 30 pF
Input
capacitance
All input pins
except RES and
NMI
— — 15 pF
Vin = 0 V
f = 1 MHz
Ta = 25°C
Normal operatio n ICC*4 — 40 (3.0 V) 80 mA f = 20 MHz
— 55 (3.3 V) 100 mA f = 25 MHz
Current
dissipation*2
Sleep mode — 32 (3.0 V) 64 mA f = 20 MHz
— 44 (3.3 V) 80 mA f = 25 MHz
Standby mode*3 — 0.01 10 μA Ta ≤ 50°C
— — 80 μA 50°C < Ta
During A/D and
D/A conversion AICC — 0.2 (3.0 V) 2.0 mA Analog
power
supply
voltage Idle — 0.01 5.0 μA
During A/D and
D/A conversion AICC — 1.4 (3.0 V) 3.0 mA Reference
power
supply
voltage Idle — 0.01 5.0 μA
RAM standby voltage VRAM 2.0 — — V
Notes: 1. If the A/D and D/A converters are not used, do not leave the AVCC, Vref, and AVSS
pins open. Connect the AVCC and Vref pins to VCC, and the AVSS pin to VSS.
2. Current dissipation values are for VIH min = VCC – 0.5 V and VIL max = 0.5 V with all
output pins unloaded and all MOS input pull-ups in the off state.
3. The values are for VRAM ≤ VCC < 2.7 V, VIH min = VCC × 0.9, and VIL max = 0.3 V.
4. ICC depends on VCC and f as follows:
ICC max = 1.0 (mA) + 1.10 (mA/(MHz × V)) × VCC × f (normal operation)
ICC max = 1.0 (mA) + 0.88 (mA/(MHz × V)) × VCC × f (sleep mode)
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 938 of 1268
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Table 22.3 DC Characteristics (H8S/2324S, H8S/2322R, H8S/2321, H8S/2320)
Conditions: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS =
0 V*1, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-
range specifications)
Item
Symbol
Min
Typ
Max
Unit Test
Conditions
VT– V
CC × 0.2 — — V
VT+ — — VCC × 0.7 V
Schmitt
trigger input
voltage
Ports 1, 2,
P64 to P67
PA4 to PA7
Port 5 (when using
IRQ)
VT+ – VT– V
CC × 0.06 — — V
Input high
voltage RES, STBY, NMI,
MD2 to MD0 VIH V
CC × 0.9 — VCC + 0.3 V
EXTAL VCC × 0.7 — VCC + 0.3 V
Ports 3, 5,
B to G, P60 to P63,
PA0 to PA3
2.2 — VCC + 0.3 V
Port 4 2.2 — AVCC + 0.3V
Input low
voltage RES, STBY,
MD2 to MD0 VIL –0.3 — VCC × 0.1 V
NMI, EXTAL,
Ports 3 to 5,
B to G, P60 to P63,
PA0 to PA3
–0.3 — VCC × 0.2 V
All output pins VOH V
CC – 0.5 — — V IOH = –200 μA Output high
voltage V
CC – 1.0 — — V IOH = –1 mA
Output low
voltage All output pins VOL — — 0.4 V IOL = 1.6 mA
RES | Iin | — — 10.0 μA
STBY, NMI,
MD2 to MD0 — — 1.0 μA Vin = 0.5 V to
VCC – 0.5 V
Input
leakage
current
Port 4 — — 1.0 μA Vin = 0.5 V to
AVCC – 0.5 V
Three-state
leakage
current
(off state)
Ports 1, 2, 3, 5, 6, A
to G | ITSI | — — 1.0 μA Vin = 0.5 V to
VCC – 0.5 V
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 939 of 1268
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Item
Symbol
Min
Typ
Max
Unit Test
Conditions
Input pull-up
MOS current Ports A to E –Ip 10 — 300 μA VCC = 2.7 V
to 3.6 V,
Vin = 0 V
RES C
in — — 30 pF Vin = 0 V Input
capacitance NMI — — 30 pF f = 1 MHz
All input pins
except RES and
NMI
— — 15 pF Ta = 25°C
Normal operatio n ICC*4 — 30 (3.0 V) 66 mA f = 20 MHz Current
dissipation*2 — 42 (3.3 V) 82 mA f = 25 MHz
Sleep mode — 22 (3.0 V) 51 mA f = 20 MHz
— 31 (3.3 V) 64 mA f = 25 MHz
Standby mode*3 — 0.01 10 μA Ta ≤ 50°C
— — 80 μA 50°C < Ta
During A/D and
D/A conversion AICC — 0.2
(3.0 V) 2.0 mA Analog
power
supply
voltage Idle — 0.01 5.0 μA
During A/D and
D/A conversion AICC — 1.4
(3.0 V) 3.0 mA Reference
power
supply
voltage Idle — 0.01 5.0 μA
RAM standby voltage VRAM 2.0 — — V
Notes: 1. If the A/D and D/A converters are not used, do not leave the AVCC, Vref, and AVSS
pins open. Connect the AVCC and Vref pins to VCC, and the AVSS pin to VSS.
2. Current dissipation values are for VIH min = VCC – 0.2 V and VIL max = 0.2 V with all
output pins unloaded and all MOS input pull-ups in the off state.
3. The values are for VRAM ≤ VCC < 2.7 V, VIH min = VCC × 0.9, and VIL max = 0.3 V.
4. ICC depends on VCC and f as follows:
ICC max = 1.0 (mA) + 0.90 (mA/(MHz × V)) × VCC × f (normal operation)
ICC max = 1.0 (mA) + 0.70 (mA/(MHz × V)) × VCC × f (sleep mode)
Section 22 Electrical Characteristics
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Table 22.4 Permissible Output Currents
Conditions: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS =
0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-range
specifications)
Item Symbol Min Typ Max Unit
Permissible output
low current (per pin) All output pins IOL — — 2.0 mA
Permissible output
low current (total) Total of all output
pins ΣlOL — — 80 mA
Permissible output
high current (per pin) All output pins –IOH — — 2.0 mA
Permissible output
high current (total) Total of all output
pins Σ–IOH — — 40 mA
Note: To protect chip reliability, do not exceed the output current values in table 22.4.
22.1.3 AC Characteristics
3 V
RL
R
H
C
Chip output pin
C = 50 pF: ports 1, A to F
C = 30 pF: ports 2, 3, 5, 6, G
RL = 2.4 kΩ
RH = 12 kΩ
Input/output timing measurement level:
1.5 V (VCC = 2.7 V to 3.6 V)
Figure 22.1 Output Load Circuit
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 941 of 1268
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(1) Clock Timing
Table 22.5 Clock Timing
Condition A: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 20 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition B : VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition A Condition B
Item Symbol Min Max Min Max Unit
Test
Conditions
Clock cycle time tcyc 50 500 40 500 ns Figure 22.2
Clock pulse high width tCH 20 — 15 — ns
Clock pulse low width tCL 20 — 15 — ns
Clock rise time tCr — 5 — 5 ns
Clock fall time tCf — 5 — 5 ns
Reset oscil lati on stab iliz at ion
time (crystal) tOSC1 10 — 10 — ms Figure 22.3
Software standby oscillation
stabilization time (crystal) tOSC2 10 — 10 — ms
External clo ck outp ut
stabilization delay time tDEXT 500 — 500 — μs Figure 22.3
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 942 of 1268
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tCr
tCL
tCf
tCH
φ
tcyc
Figure 22.2 System Clock Timing
tOSC1
tOSC1
EXTAL
VCC
STBY
RES
tDEXT tDEXT
NMI
φ
Figure 22.3 Oscillatio n Stabilization Timing
Section 22 Electrical Characteristics
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(2) Control Signal Timing
Table 22.6 Control Signal Timing
Condition A: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 20 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition B : VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition A Condition B
Item Symbol Min Max Min Max Unit
Test
Conditions
RES setup time t RESS 200 — 200 — ns Figure 22.4
RES pulse width tRESW 20 — 20 — tcyc
NMI setup time tNMIS 150 — 150 — ns Figure 22.5
NMI hold time tNMIH 10 — 10 —
NMI pulse width (in recovery
from software standby mode) tNMIW 200 — 200 —
IRQ setup time tIRQS 150 — 150 — ns
IRQ hold time tIRQH 10 — 10 —
IRQ pulse width (in recovery
from software standby mode) tIRQW 200 — 200 —
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 944 of 1268
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t
RESW
t
RESS
φ
t
RESS
RES
Figure 22.4 Reset Input Timing
φ
tIRQS
IRQ
edge input
tIRQH
tNMIS tNMIH
tIRQS
IRQ
level input
NMI
IRQ
tNMIW
tIRQW
Figure 22.5 Interrupt Input Timing
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 945 of 1268
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(3) Bus Timing
Table 22.7 Bus Timi ng
Condition A: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 20 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition B : VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition A Condition B
Item Symbol Min Max Min Max Unit Test Conditions
Address delay time tAD — 20 — 20 ns
Address setup time tAS 0.5 ×
tcyc – 15 — 0.5 ×
tcyc – 15 — ns
Figures 22.6 to
22.13
Address hold tim e tAH 0.5 ×
tcyc – 10 — 0.5 ×
tcyc – 8 — ns
Precharge time* t
PCH 1.5 ×
tcyc– 20 — 1.5 ×
tcyc– 15 — ns
CS delay time 1 tCSD1 — 20 — 15 ns
CS delay time 2* t
CSD2 — 20 — 15 ns
CS delay time 3* t
CSD3 — 25 — 20 ns
AS delay time tASD — 20 — 15 ns
RD delay time 1 tRSD1 — 20 — 15 ns
RD delay time 2 tRSD2 — 20 — 15 ns
CAS delay time* t
CASD — 20 — 15 ns
Read data setup time tRDS 15 — 15 — ns
Read data hold time tRDH 0 — 0 — ns
Read data access time 1 tACC1 — 1.0 ×
tcyc – 25 — 1.0 ×
tcyc – 20 ns
Read data access time 2 tACC2 — 1.5 ×
tcyc – 25 — 1.5 ×
tcyc – 20 ns
Read data access time 3 tACC3 — 2.0 ×
tcyc – 25 — 2.0 ×
tcyc – 20 ns
Read data access time 4 tACC4 — 2.5 ×
tcyc – 25 — 2.5 ×
tcyc – 20 ns
Read data access time 5 tACC5 — 3.0 ×
tcyc – 25 — 3.0 ×
tcyc – 20 ns
Read data access time 6*tACC6 — 1.0 ×
tcyc – 25 — 1.0 ×
tcyc – 20 ns
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 946 of 1268
REJ09B0220-0600
Condition A Condition B
Item Symbol Min Max Min Max Unit Test Conditions
WR delay time 1 tWRD1 — 20 — 15 ns
WR delay time 2 tWRD2 — 20 — 15 ns
Figures 22.6 to
22.13
WR pulse width 1 tWSW1 1.0 ×
tcyc – 20 — 1.0 ×
tcyc – 15 — ns
WR pulse width 2 tWSW2 1.5 ×
tcyc – 20 — 1.5 ×
tcyc – 15 — ns
Write data delay time tWDD — 30 — 20 ns
Write data setup time tWDS 0.5 ×
tcyc – 20 — 0.5 ×
tcyc – 15 — ns
Write data hold time tWDH 0.5 ×
tcyc – 10 — 0.5 ×
tcyc – 8 — ns
WR setup time* t
WCS 0.5 ×
tcyc – 10 — 0.5 ×
tcyc – 10 — ns
WR hold time* t
WCH 0.5 ×
tcyc – 10 — 0.5 ×
tcyc – 10 — ns
CAS setup time * t
CSR 0.5 ×
tcyc – 10 — 0.5 ×
tcyc – 8 — ns Figure 22.10
WAIT setup time tWTS 30 — 25 — ns Figure 22.8
WAIT hold time tWTH 5 — 5 — ns
BREQ setup time tBRQS 30 — 30 — ns Figure 22.14
BACK delay time tBACD — 15 — 15 ns
Bus floati ng time t BZD — 50 — 40 ns
BREQO delay time tBRQOD — 30 — 25 ns Figure 22.15
Note: * The DRAM interface is not supported in the H8S/2321.
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 947 of 1268
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φ
A
23 to A0
CS7 to CS0
AS
tRSD2
tAS tAH
tCSD1
tACC2
tRSD1
tASD tASD
tAD
tACC3
tWRD2
tWRD2
tWSW1
tWDD tWDH
T1T2
RD
(read)
D15 to D0
(read)
HWR, LWR
(write)
D15 to D0
(write)
tRDS
tAH
tAS
tAS
tRDH
Figure 22.6 Basic Bus Timing (2-State Access)
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 948 of 1268
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φ
A
23
to A
0
CS
7
to CS
0
AS
t
RSD2
t
AS
t
AH
t
CSD1
t
ACC4
t
RSD1
t
ASD
t
ASD
t
AD
t
ACC5
t
WRD2
t
WRD1
t
WSW2
t
WDD
t
WDH
T
1
T
3
RD
(read)
D
15
to D
0
(read)
HWR, LWR
(write)
D
15
to D
0
(write)
t
WDS
T
2
t
RDS
t
AS
t
AH
t
RDH
Figure 22.7 Basic Bus Timing (3-State Access)
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 949 of 1268
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φ
A
23
to A
0
CS
7
to CS
0
AS
t
WTH
T
1
T
2
RD
(read)
D
15
to D
0
(read)
HWR, LWR
(write)
D
15
to D
0
(write)
WAIT
T
w
T
3
t
WTS
t
WTH
t
WTS
Figure 22.8 Basic Bus Timing (3-State Access, 1 Wait)
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 950 of 1268
REJ09B0220-0600
t
WDS
φ
A
23
to A
0
CS
5
to CS
2
(RAS)
CAS
t
RDH
t
PCH
t
AD
t
WDD
T
p
D
15
to D
0
(read)
HWR, (WE)
(write)
D
15
to D
0
(write)
t
CASD
t
AS
t
ACC4
t
WRD2
t
ACC3
T
r
T
c1
T
c2
t
AD
t
ACC6
t
RDS
t
WRD2
t
WCS
t
WCH
t
AH
t
CSD2
t
WDH
t
CSD3
t
CASD
Figure 22.9 DRAM Bus Timing (Not Supported in the H8S/2321)
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 951 of 1268
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tCSD1
φ
tCSD2
tCASD
tCASD
CS5 to CS2
(RAS)
CAS
TRp TRr TRc1 TRc2
tCSR
Figure 22.10 CAS-Before-RAS Refresh Timing (Not Supported in the H8S/2321)
t
CSD2
t
CASD
t
CASD
T
Rp
T
Rr
T
Rc
T
Rc
φ
CS
5
to CS
2
(RAS)
CAS
t
CSD2
Figure 22.11 Self-Refresh Timing (Not Supported in the H8S/2321)
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 952 of 1268
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φ
A
23
to A
0
CS
0
AS
t
RSD2
t
AS
t
AH
t
ASD
t
ASD
t
AD
t
ACC3
t
RDS
t
RDH
T
1
T
2
RD
(read)
D
15
to D
0
(read)
T
2
or T
3
T
1
Figure 22.12 Burst ROM Access Timing (2-State Access)
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 953 of 1268
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t
AD
t
ACC1
t
RDS
t
RDH
T
1
T
2
or T
3
T
1
φ
A
23 to A0
CS0
AS
RD
(read)
D15 to D0
(read)
t
RSD2
Figure 22.13 Burst ROM Access Timing (1-State Access)
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 954 of 1268
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φ
BREQ
BACK
tBACD
tBZD
A
23 to A0,
CS7 to CS0,
AS, RD,
HWR, LWR,
CAS
tBACD
tBZD
tBRQS tBRQS
Figure 22.14 External Bus Release Timing
φ
BREQO
t
BRQOD
t
BRQOD
Figure 22.15 External Bus Request Output Timing
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 955 of 1268
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(4) DMAC Timing
Note: The DMAC is not supported in the H8S/2321.
Table 22.8 DMAC Timing
Condition A: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 20 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition B : VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition A Condition B
Item Symbol Min Max Min Max Unit
Test
Conditions
DREQ setup time tDRQS 30 — 25 — ns Figure 22.19
DREQ hold time tDRQH 10 — 10 —
TEND delay time tTED — 20 — 18 Figure 22.18
DACK delay time 1 tDACD1 — 20 — 18 ns
DACK delay time 2 tDACD2 — 20 — 18 Figures 22.16
and 22.17
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 956 of 1268
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t
DACD1
T
1
T
2
t
DACD2
φ
A
23
to A
0
AS
RD
(read)
D
15
to D
0
(read)
HWR, LWR
(write)
D
15
to D
0
(write)
DACK
0
, DACK
1
CS
7
to CS
0
Figure 22.16 DMAC Single Address Transfer Timing (2-State Access)
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 957 of 1268
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t
DACD1
T
1
T
2
t
DACD2
T
3
φ
A
23
to A
0
AS
RD
(read)
D
15
to D
0
(read)
HWR, LWR
(write)
D
15
to D
0
(write)
DACK
0
, DACK
1
CS
7
to CS
0
Figure 22.17 DMAC Single Address Transfer Timing (3-State Access)
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 958 of 1268
REJ09B0220-0600
φ
TEND
0,
TEND
1
t
TED
T
1
T
2
or T
3
t
TED
Figure 22.18 DMAC TEND Output Timing
φ
DREQ
0
, DREQ
1
t
DRQS
t
DRQH
Figure 22.19 DMAC DREQ Input Timing
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 959 of 1268
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(5) Timing of On-Chip Supporting Modules
Table 22.9 Timing of On-Chip Supporting Modules
Condition A: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 20 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition B : VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition A Condition B
Test
Item Symbol Min Max Min Max Unit Conditions
I/O ports Output data delay time tPWD — 50 — 40 ns Figure 22.20
Input data setup time tPRS 30 — 25 —
Input data hold time tPRH 30 — 25 —
PPG Pulse output delay time tPOD — 50 — 40 ns Figure 22.21
TPU Timer output delay time tTOCD — 50 — 40 ns Figure 22.22
Timer input setup time tTICS 30 — 25 —
Timer clock input setup time tTCKS 30 — 25 — ns Figure 22.23
Timer clock
pulse width Single-edge
specification tTCKWH 1.5 — 1.5 — tcyc
Both-edge
specification tTCKWL 2.5 — 2.5 —
8-bit timer Timer output delay time tTMOD — 50 — 40 ns Figure 22.24
Timer reset input setup time tTMRS 30 — 25 — ns Figure 22.26
Timer clock input setup time tTMCS 30 — 25 — ns Figure 22.25
Timer clock
pulse width Single-edge
specification tTMCWH 1.5 — 1.5 — tcyc
Both-edge
specification tTMCWL 2.5 — 2.5 —
WDT Overflow output delay time tWOVD — 50 — 40 ns Figure 22.27
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 960 of 1268
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Condition A Condition B
Test
Item Symbol Min Max Min Max Unit Conditions
SCI Asynchronous tScyc 4 — 4 — tcyc Figure 22.28
Input clock
cycle Synchronous 6 — 6 —
Input clock pulse width tSCKW 0.4 0.6 0.4 0.6 tScyc
Input clock ris e time tSCKr — 1.5 — 1.5 tcyc
Input clock fall time tSCKf — 1.5 — 1.5
Transmit data delay time tTXD — 50 — 40 ns Figure 22.29
Receive data setup time
(synchronous) tRXS 50 — 40 — ns
Receive data hold time
(synchronous) tRXH 50 — 40 — ns
A/D
converter Trigger input set up time tTRGS 30 — 30 — ns Figure 22.30
φ
Ports 1 to 6,
A
to G
(read)
t
PRS
T
1
T
2
t
PWD
t
PRH
Ports 1, 2, 3,
5, 6, A to G
(write)
Figure 22.20 I/O Po rt Input/Output Timing
φ
PO15 to PO0
tPOD
Figure 22.21 PPG Output Timing
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 961 of 1268
REJ09B0220-0600
φ
t
TICS
t
TOCD
Output compare
output*
Input capture
input*
Note: * TIOCA0 to TIOCA5, TIOCB0 to TIOCB5, TIOCC0, TIOCC3, TIOCD0, TIOCD3
Figure 22.22 TPU Input/Output Timing
t
TCKS
φ
t
TCKS
TCLKA to
TCLKD t
TCKWH
t
TCKWL
Figure 22.23 TPU Clock Input Timing
φ
tTMOD
TMO0, TMO1
Figure 22.24 8-Bit Timer Output Timing
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 962 of 1268
REJ09B0220-0600
tTMCS
φ
tTMCS
TMCI0, TMCI1
tTMCWH
tTMCWL
Figure 22 . 25 8-Bit Timer Clock Input Timing
φ
tTMRS
TMRI0, TMRI1
Figure 22 . 26 8-Bit Timer Reset Input Timing
φ
t
WOVD
WDTOVF
t
WOVD
Figure 22.27 WDT Output Timing
tScyc
tSCKr
tSCKW
SCK0 to SCK2
tSCKf
Figure 22.28 SCK Clock Input Timing
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 963 of 1268
REJ09B0220-0600
SCK0 to SCK2
TxD0 to TxD2
(transmit data)
RxD0 to RxD2
(receive data)
tTXD
tRXH
tRXS
Figure 22. 29 SCI Input/Ou t put Timing (Synchronous Mode)
φ
tTRGS
ADTRG
Figure 22.30 A/D Converter External Trigger Input Timing
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 964 of 1268
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22.1.4 A/D Conversion Characteristics
Table 22.10 A/D Conversion Characteristics
Condition A: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 20 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition B : VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition A Condition B
Item Min Typ Max Min Typ Max Unit
Resolution 10 10 10 10 10 10 Bits
Conversion time 6.7 — — 10.6 — — μs
Analog input
capacitance — — 20 — — 20 pF
Permissible signal
source impedance — — 5 — — 5 kΩ
Nonlinearity error — — ±5.5 — — ±5.5 LSB
Offset error — — ±5.5 — — ±5.5 LSB
Full-scale error — — ±5.5 — — ±5.5 LSB
Quantization error — — ±0.5 — — ±0.5 LSB
Absolute accuracy — — ±6.0 — — ±6.0 LSB
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 965 of 1268
REJ09B0220-0600
22.1.5 D/A Conversion Characteristics
Table 22.11 D/A Conversion Characteristics
Condition A: VCC = 2.7 V to 3.6 V, AVCC = 2.7 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 20 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition B : VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition A Condition B
Item Min Typ Max Min Typ Max Unit
Test
Conditions
Resolution 8 8 8 8 8 8 Bits
Conversion
time — — 10 — — 10 μs 20 pF capacitive
load
Absolute
accuracy — ±2.0 ±3.0 — ±2.0 ±3.0 LSB 2 MΩ resistive
load
— — ±2.0 — — ±2.0 LSB 4 MΩ resistive
load
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 966 of 1268
REJ09B0220-0600
22.2 Electrical Characteristics of F-ZTAT (H8S/2329B F-ZTAT,
H8S/2329E F-ZTAT, H8S/2328B F-ZTAT, H8S/2326 F-ZTAT)
22.2.1 Absolute Maximum Ratings
Table 22.12 Absolute Maximum Ratings
Item Symbol Value Unit
Power supply voltage VCC –0.3 to +4.3 V
Input voltage (FWE*2, EMLE*3) Vin –0.3 to VCC +0.3 V
Input voltage (except port 4) Vin –0.3 to VCC +0.3 V
Input voltage (port 4) Vin –0.3 to AVCC +0.3 V
Reference power supply voltage Vref –0.3 to AVCC +0.3 V
Analog power supply voltage AVCC –0.3 to +4.3 V
Analog input voltage VAN –0.3 to AVCC +0.3 V
Operating temperature Topr Regular specifications: –20 to +75*1 °C
Wide-range specifications: –40 to +85*1 °C
Storage temperature Tstg –55 to +125 °C
Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded.
Notes: 1. The operating temperature ranges for flash memory programming/erasing are as
follows:
Ta = 0°C to +75°C (regular specifications), Ta = 0°C to +85°C (wide-range
specifications).
2. The FWE pin applies to the H8S/2328B F-ZTAT and H8S/2326 F-ZTAT.
3. The EMLE pin applies to the H8S/2329B F-ZTAT and H8S/2329E F-ZTAT.
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 967 of 1268
REJ09B0220-0600
22.2.2 DC Characteristics
Table 22.13 DC Characteristics
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS =
0 V*1, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to +85°C (wide-
range specifications)
Item
Symbol
Min
Typ
Max
Unit Test
Conditions
VT– V
CC × 0.2 — — V
VT+ — — VCC × 0.7 V
Schmitt
trigger input
voltage
Ports 1, 2,
P64 to P67
PA4 to PA7
Port 5 (when
using IRQ)
VT+ – VT– V
CC × 0.07 — — V
Input high
voltage RES, STBY, NMI,
MD2 to MD0,,
FWE*2, EMLE*3
VIH V
CC × 0.9 — VCC + 0.3 V
EXTAL VCC × 0.7 — VCC + 0.3 V
Ports 3, 5,
B to G, P60 to P63,
PA0 to PA3
2.2 — VCC + 0.3 V
Port 4 2.2 — AVCC + 03V
Input low
voltage RES, STBY,
MD2 to MD0,
FWE*2, EMLE*3
VIL –0.3 — VCC × 0.1 V
NMI, EXTAL,
Ports 3 to 5,
B to G, P60 to P63,
PA0 to PA3
–0.3 — VCC × 0.2 V
All output pins VOH V
CC – 0.5 — — V IOH = –200 μA Output high
voltage V
CC – 1.0 — — V IOH = –1 mA
Output low
voltage All output pins VOL — — 0.4 V IOL = 1.6 mA
RES | Iin | — — 10.0 μA Input
leakage
current STBY, NMI,
MD2 to MD0,
FWE*2, EMLE*3
— — 1.0 μA Vin = 0.5 V to
VCC – 0.5 V
Port 4 — — 1.0 μA Vin = 0.5 V to
AVCC – 0.5 V
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 968 of 1268
REJ09B0220-0600
Item
Symbol
Min
Typ
Max
Unit Test
Conditions
Three-state
leakage
current
(off state)
Ports 1, 2, 3, 5, 6, A
to G | ITSI | — — 1.0 μA Vin = 0.5 V to
VCC – 0.5 V
Input pull-up
MOS current Ports A to E –Ip 10 — 300 μA VCC = 3.0 V to
3.6 V,
Vin = 0 V
RES C
in — — 30 pF Input
capacitance NMI — — 30 pF
All input pins
except RES and
NMI
— — 15 pF
Vin = 0 V
f = 1 MHz
Ta = 25°C
Normal operatio n ICC*6 — 55 (3.3 V) 100 mA f = 25 MHz
Sleep mode — 44 (3.3 V) 80 mA
Current
dissipation*4
Standby mode*5 — 0.01 10 μA Ta ≤ 50°C
— — 80 μA 50°C < Ta
During A/D and
D/A conversion AICC — 0.2 (3.0 V) 2.0 mA Analog
power
supply
voltage Idle — 0.01 5.0 μA
During A/D and
D/A conversion AICC — 1.4 (3.0 V) 3.0 mA Reference
power
supply
voltage Idle — 0.01 5.0 μA
RAM standby voltage VRAM 2.0 — — V
Notes: 1. If the A/D and D/A converters are not used, do not leave the AVCC, Vref, and AVSS
pins open. Connect the AVCC and Vref pins to VCC, and the AVSS pin to VSS.
2. The FWE pin applies to the H8S/2328B F-ZTAT and H8S/2326 F-ZTAT.
3. The EMLE pin applies to the H8S/2329B F-ZTAT and H8S/2329E F-ZTAT.
4. Current dissipation values are for VIH min = VCC – 0.2 V and VIL max = 0.2 V with all output
pins unloaded and all MOS input pull-ups in the off state.
5. The values are for VRAM ≤ VCC < 3.0 V, VIH min = VCC × 0.9, and VIL max = 0.3 V.
6. ICC depends on VCC and f as follows:
ICC max = 1.0 (mA) + 1.10 (mA/(MHz × V)) × VCC × f (normal operation)
ICC max = 1.0 (mA) + 0.88 (mA/(MHz × V)) × VCC × f (sleep mode)
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 969 of 1268
REJ09B0220-0600
Table 22.14 Permissible Output Currents
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC,
VSS = AVSS = 0 V, Ta = –20 to +75°C (regular specifications), Ta = –40 to +85°C
(wide-range specifications)
Item Symbol Min Typ Max Unit
Permissible output low
current (per pin) All output pins IOL — — 2.0 mA
Permissible output low
current (total) Total of all output
pins ∑ IOL — — 80 mA
Permissible output
high current (per pin) All output pins –IOH — — 2.0 mA
Permissible output
high current (total) Total of all output
pins ∑ –IOH — — 40 mA
Note: To protect chip reliability, do not exceed the output current values in table 22.14.
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 970 of 1268
REJ09B0220-0600
22.2.3 AC Characteristics
(1) Clock Timing
Table 22.15 Clock Timing
Condition B : VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition B
Item Symbol Min Max Unit Test Conditions
Clock cycle time tcyc 40 500 ns Figure 22.2
Clock pulse high width tCH 15 — ns
Clock pulse low width tCL 15 — ns
Clock rise time tCr — 5 ns
Clock fall time tCf — 5 ns
Reset oscil lati on stab iliz at ion t i me
(crystal) tOSC1 10 — ms Figure 22.3
Software standby oscillation
stabilization time (crystal) tOSC2 10 — ms
External clo ck outp ut stabi liz at ion
delay time tDEXT 500 — μs Figure 22.3
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 971 of 1268
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(2) Control Signal Timing
Table 22.16 Control Signal Timing
Condition B : VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition B
Item Symbol Min Max Unit Test Conditions
RES setup time tRESS 200 — ns Figure 22.4
RES pulse width tRESW 20 — tcyc
NMI setup time tNMIS 150 — ns Figure 22.5
NMI hold time tNMIH 10 —
NMI pulse width (in recovery from
software standby mode) tNMIW 200 —
IRQ setup time tIRQS 150 — ns
IRQ hold time tIRQH 10 —
IRQ pulse width (in recovery from
software standby mode) tIRQW 200 —
Section 22 Electrical Characteristics
Rev.6.00 Sep. 27, 2007 Page 972 of 1268
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(3) Bus Timing
Table 22.17 Bus Timing
Condition B : VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition B
Item Symbol Min Max Unit Test Conditions
Address delay time tAD — 20 ns Figures 22.6 to 22.13
Address setup time tAS 0.5 × tcyc – 15 — ns
Address hold tim e tAH 0.5 × tcyc – 8 — ns
Precharge time tPCH 1.5 × tcyc– 15 — ns
CS delay time 1 tCSD1 — 15 ns
CS delay time 2 tCSD2 — 15 ns
CS delay time 3 tCSD3 — 20 ns
AS delay time tASD — 15 ns
RD delay time 1 tRSD1 — 15 ns
RD delay time 2 tRSD2 — 15 ns
CAS delay time tCASD — 15 ns
Read data setup time tRDS 15 — ns
Read data hold time tRDH 0 — ns
Read data access time 1 tACC1 — 1.0 × tcyc – 20 ns
Read data access time 2 tACC2 — 1.5 × tcyc – 20 ns
Read data access time 3 tACC3 — 2.0 × tcyc – 20 ns
Read data access time 4 tACC4 — 2.5 × tcyc – 20 ns
Read data access time 5 tACC5 — 3.0 × tcyc – 20 ns
Read data access time 6 tACC6 — 1.0 × tcyc – 20 ns
WR delay time 1 tWRD1 — 15 ns
WR delay time 2 tWRD2 — 15 ns
WR pulse width 1 tWSW1 1.0 × tcyc – 15 — ns
WR pulse width 2 tWSW2 1.5 × tcyc – 15 — ns
Write data delay time tWDD — 20 ns
Write data setup time tWDS 0.5 × tcyc – 15 — ns
Write data hold time tWDH 0.5 × tcyc – 8 — ns
WR setup time tWCS 0.5 × tcyc – 10 — ns
WR hold time tWCH 0.5 × tcyc – 10 — ns
Section 22 Electrical Characteristics
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Condition B
Item Symbol Min Max Unit Test Conditions
CAS setup time tCSR 0.5 × tcyc – 8 — ns Figure 22.10
WAIT setup time tWTS 25 — ns Figure 22.8
WAIT hold time tWTH 5 — ns
BREQ setup time tBRQS 30 — ns Figure 22.14
BACK delay time tBACD — 15 ns
Bus floati ng time tBZD — 40 ns
BREQO delay time tBRQOD — 25 ns Figure 22.15
(4) DMAC Timing
Table 22.18 DM AC Timing
Condition B : VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 2.7 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition B
Item Symbol Min Max Unit Test Conditions
DREQ setup time tDRQS 25 — ns Figure 22.19
DREQ hold time tDRQH 10 —
TEND delay time tTED — 18 Figure 22.18
DACK delay time 1 tDACD1 — 18 ns Figures 22.16 and 22.17
DACK delay time 2 tDACD2 — 18
Section 22 Electrical Characteristics
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(5) Timing of On-Chip Supporting Modules
Table 22.19 Ti ming of On-Chip Supporting Modules
Condition B : VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition B
Item Symbol Min Max Unit Test Conditions
I/O ports Output data delay time tPWD — 40 ns Figure 22.20
Input data setup time tPRS 25 —
Input data hold tim e tPRH 25 —
PPG Pulse output delay time tPOD — 40 ns Figure 22.21
TPU Timer output delay time tTOCD — 40 ns Figure 22.22
Timer input setup time tTICS 25 —
Timer clock input setup time tTCKS 25 — ns Figure 22.23
Timer clock
pulse width Single-edge
specification tTCKWH 1.5 — tcyc
Both-edge
specification tTCKWL 2.5 —
8-bit timer Timer output delay tim e tTMOD — 40 ns Figure 22.24
Timer reset input setup time tTMRS 25 — ns Figure 22.26
Timer clock input setup time tTMCS 25 — ns Figure 22.25
Timer clock
pulse width Single-edge
specification tTMCWH 1.5 — tcyc
Both-edge
specification tTMCWL 2.5 —
SCI Asynchronous tScyc 4 — tcyc Figure 22.28
Input clock
cycle Synchronous 6 —
Input clock pulse width tSCKW 0.4 0.6 tScyc
Input cl ock ri se time tSCKr — 1.5 tcyc
Input cl ock fall time tSCKf — 1.5
Transmit data delay time tTXD — 40 ns Figure 22.29
Receive dat a set up time
(synchronous) tRXS 40 — ns
Receive dat a hol d time
(synchronous) tRXH 40 — ns
A/D
converter Trigger input setup time tTRGS 30 — ns Figure 22.30
Section 22 Electrical Characteristics
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22.2.4 A/D Conversion Characteristics
Table 22.20 A/D Conversion Characteristics
Condition B : VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition B
Item Min Typ Max Unit
Resolution 10 10 10 Bits
Conversion time 10.6 — — μs
Analog input capacitance — — 20 pF
Permissible signal source impedance — — 5 kΩ
Nonlinearity error — — ±5.5 LSB
Offset error — — ±5.5 LSB
Full-sca le error — — ±5.5 LSB
Quantization error — — ±0.5 LSB
Absolute ac cura cy — — ±6.0 LSB
Section 22 Electrical Characteristics
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22.2.5 D/A Conversion Characteristics
Table 22.21 D/A Conversion Characteristics
Condition B : VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS =
0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to 75°C (regular specifications),
Ta = –40°C to 85°C (wide-range specifications)
Condition B
Item Min Typ Max Unit Test Conditions
Resolution 8 8 8 Bits
Conversion time — — 10 μs 20 pF capacitive load
Absolute ac cura cy — ±2.0 ±3.0 LSB 2 MΩ resistive load
— — ±2.0 LSB 4 MΩ resistive load
Section 22 Electrical Characteristics
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22.2.6 Flash Memory Characteristics
Table 22.22 Flash Memory Characteristics
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, Vref = 3.0 V to AVCC, VSS = AVSS =
0 V, Ta = 0°C to +75°C (program/erase operating temperature range: regular
specifications), Ta = 0°C to +85°C (program/erase operating temperature range:
wide-range specifications)
Item
Symbol
Min
Typ
Max
Unit Test
Conditions
Programming time*1 *2 *4 t
P — 10 200 ms/
128 bytes
Erase time*1 *3 *6 t
E — 50 1000 ms/block
Rewrite times NWEC 100*7 10000*8— Times
Data hold time tDRP*9 10 — — year
Programming Wait time after SWE bit setting*1 x 1 — — μs
Wait time after PSU bit setting*1 y 50 — — μs
Wait time after P bit setting*1 *4 z (z1) — — 30 μs 1 ≤ n ≤ 6
(z2) — — 200 μs 7 ≤ n ≤ 1000
(z3) — — 10 μs Wait time for
additional
writing
Wait time after P bit clearing*1 α 5 — — μs
Wait time after PSU bit clearing*1 β 5 — — μs
Wait time after PV bit setting*1 γ 4 — — μs
Wait time after H'FF dummy write*1 ε 2 — — μs
Wait time after PV bit clearing*1 η 2 — — μs
Wait time after SWE bit cleari ng*1 θ 100 — — μs
Maximum number of writes*1 *4 N — — 1000*5Times
Erasing Wait time after SWE bit setting*1 x 1 — — μs
Wait time after ESU bit setting*1 y 100 — — μs
Wait time after E bit setting*1 *6 z — — 10 ms Wait time for
erase time
Wait time after E bit clearing*1 α 10 — — μs
Wait time after ESU bit clearing*1 β 10 — — μs
Wait time after EV bit setting*1 γ 20 — — μs
Wait time after H'FF dummy write*1 ε 2 — — μs
Wait time after EV bit clearing*1 η 4 — — μs
Wait time after SWE bit cleari ng*1 θ 100 — — μs
Maximum number of erases*1 *6 N — — 100 Times
Section 22 Electrical Characteristics
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Notes: 1. Follow the program/erase algorithms when making the time settings.
2. Programming time per 128 bytes. (In the H8S/2329B and H8S/2328B, indicates the
total time during which the P bit is set in flash memory control register 1 (FLMCR1). In
the H8S/2326, indicates the total time during which the P1 bit and P2 bit in flash
memory control registers 1 and 2 (FLMCR1, FLMCR2) are set. Does not include the
program-verify time.)
3. Time to erase one block. (In the H8S/2329B and H8S/2328B, indicates the time during
which the E bit is set in FLMCR1. In the H8S/2326, indicates the total time during which
the E1 bit in FLMCR1 and the E2 bit in FLMCR are set. Does not include the erase-
verify time.)
4. Maximum programming time
Σ wait time after P bit setting (z)
N
t
P
(max) = i=1
5. The maximum number of writes (N) should be set as shown below according to the
actual set value of z so as not to exceed the maximum programming time (tP(max)).
The wait time after P bit setting (z) should be changed as follows according to the
number of writes (n).
Number of writes (n)
1 ≤ n ≤ 6 z = 30 μs
7 ≤ n ≤ 1000 z = 200 μs
1 ≤ n ≤ 6 z = 10 μs: For additional writing
6. For the maximum erase time (tE(max)), the following relationship applies between the
wait time after E bit setting (z) and the maximum number of erases (N):
t
E(max) = Wait time after E bit setting (z) × maximum number of erases (N)
7. The minimum number of rewrites after which all characteristics are guaranteed. (The
guaranteed range is one to min. rewrites.)
8. Reference value at 25°C. (This is a general indication of the number of rewrites
possible under norm al con diti o ns.)
9. The data retention characteristics within the specified range, including min. rewrites.
22.3 Usage Note
Although both the F-ZTAT and mask ROM versions fully meet the electrical specifications listed
in this manual, there may be differences in the actual values of the electrical characteristics,
operating margins, noise margins, and so forth, due to differences in the fabrication process, the
on-chip ROM, and the layout patterns.
If the F-ZTAT version is used to carry out system evaluation and testing, therefore, when
switching to the mask ROM version the same eval uatio n and testing procedures should also be
conducted on t his version.
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 979 of 1268
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Appendix A Instruction Set
A.1 Instruction List
Operand Notation
Rd General register (destination)*1
Rs General register (source)*1
Rn General register*1
ERn General register (32-bit register)
MAC Multiply-and-accumulate register (32-bit register)*2
(EAd) Destination operand
(EAs) Source operand
EXR Extended control register
CCR Condition-code register
N N (negative) flag in CCR
Z Z (zero) flag in CCR
V V (overflow) flag in CCR
C C (carry) flag in CCR
PC Program counter
SP Stack pointer
#IMM Immediate data
disp Displacement
+ Add
– Subtract
× Multiply
÷ Divide
∧ Logical AND
∨ Logical OR
⊕ Logical exclusive OR
→ Transfer from the operand on the left to the operand on the right, or
transition from the state on the left to the state on the right
¬ Logical NOT (logical complement)
( ) < > Contents of operand
:8/:16/:24/:32 8-, 16-, 24-, or 32-bit length
Notes: 1. General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0
to R7, E0 to E7), and 32-bit registers (ER0 to ER7).
2. The MAC register cannot be used in the H8S/2329 Group and H8S/2328 Group.
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 980 of 1268
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Condition Code Notatio n
Symbol
Changes according to the result of the instruction
* Undetermined (no guaranteed value)
0 Always cleared to 0
1 Always set to 1
— Not affected by execution of the instruction
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 981 of 1268
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Table A.1 Instruction Set
(1) Data Transfer Instructions
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
MOV MOV.B #xx:8,Rd B 2
MOV.B Rs,Rd B 2
MOV.B @ERs,Rd B 2
MOV.B @(d:16,ERs),Rd B 4
MOV.B @(d:32,ERs),Rd B 8
MOV.B @ERs+,Rd B 2
MOV.B @aa:8,Rd B 2
MOV.B @aa:16,Rd B 4
MOV.B @aa:32,Rd B 6
MOV.B Rs,@ERd B 2
MOV.B Rs,@(d:16,ERd) B 4
MOV.B Rs,@(d:32,ERd) B 8
MOV.B Rs,@-ERd B 2
MOV.B Rs,@aa:8 B 2
MOV.B Rs,@aa:16 B 4
MOV.B Rs,@aa:32 B 6
MOV.W #xx:16,Rd W 4
MOV.W Rs,Rd W 2
MOV.W @ERs,Rd W 2
#xx:8→Rd8 — — 0 — 1
Rs8→Rd8 — — 0 — 1
@ERs→Rd8 — — 0 — 2
@(d:16,ERs)→Rd8 — — 0 — 3
@(d:32,ERs)→Rd8 — — 0 — 5
@ERs→Rd8,ERs32+1→ERs32 — — 0 — 3
@aa:8→Rd8 — — 0 — 2
@aa:16→Rd8 — — 0 — 3
@aa:32→Rd8 — — 0 — 4
Rs8→@ERd — — 0 — 2
Rs8→@(d:16,ERd) — — 0 — 3
Rs8→@(d:32,ERd) — — 0 — 5
ERd32-1→ERd32,Rs8→@ERd — — 0 — 3
Rs8→@aa:8 — — 0 — 2
Rs8→@aa:16 — — 0 — 3
Rs8→@aa:32 — — 0 — 4
#xx:16→Rd16 — — 0 — 2
Rs16→Rd16 — — 0 — 1
@ERs→Rd16 — — 0 — 2
Operation
Condition Code
IHNZVC Advanced
No. of States
*
1
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 982 of 1268
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Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
MOV MOV.W @(d:16,ERs),Rd W 4
MOV.W @(d:32,ERs),Rd W 8
MOV.W @ERs+,Rd W 2
MOV.W @aa:16,Rd W 4
MOV.W @aa:32,Rd W 6
MOV.W Rs,@ERd W 2
MOV.W Rs,@(d:16,ERd) W 4
MOV.W Rs,@(d:32,ERd) W 8
MOV.W Rs,@-ERd W 2
MOV.W Rs,@aa:16 W 4
MOV.W Rs,@aa:32 W 6
MOV.L #xx:32,ERd L 6
MOV.L ERs,ERd L 2
MOV.L @ERs,ERd L 4
MOV.L @(d:16,ERs),ERd L 6
MOV.L @(d:32,ERs),ERd L 10
MOV.L @ERs+,ERd L 4
MOV.L @aa:16,ERd L 6
MOV.L @aa:32,ERd L 8
@(d:16,ERs)→Rd16 — — 0 — 3
@(d:32,ERs)→Rd16 — — 0 — 5
@ERs→Rd16,ERs32+2→ERs32 — — 0 — 3
@aa:16→Rd16 — — 0 — 3
@aa:32→Rd16 — — 0 — 4
Rs16→@ERd — — 0 — 2
Rs16→@(d:16,ERd) — — 0 — 3
Rs16→@(d:32,ERd) — — 0 — 5
ERd32-2→ERd32,Rs16→@ERd — — 0 — 3
Rs16→@aa:16 — — 0 — 3
Rs16→@aa:32 — — 0 — 4
#xx:32→ERd32 — — 0 — 3
ERs32→ERd32 — — 0 — 1
@ERs→ERd32 — — 0 — 4
@(d:16,ERs)→ERd32 — — 0 — 5
@(d:32,ERs)→ERd32 — — 0 — 7
@ERs→
ERd32,ERs32+4
→
@ERs32
— — 0 — 5
@aa:16→ERd32 — — 0 — 5
@aa:32→ERd32 — — 0 — 6
Operation
Condition Code
IHNZVC Advanced
No. of States
*
1
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 983 of 1268
REJ09B0220-0600
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
MOV
POP
PUSH
LDM
STM
MOVFPE
MOVTPE
MOV.L ERs,@ERd L 4
MOV.L ERs,@(d:16,ERd) L 6
MOV.L ERs,@(d:32,ERd) L 10
MOV.L ERs,@-ERd L 4
MOV.L ERs,@aa:16 L 6
MOV.L ERs,@aa:32 L 8
POP.W Rn W 2
POP.L ERn L 4
PUSH.W Rn W 2
PUSH.L ERn L 4
LDM @SP+,(ERm-ERn) L 4
STM (ERm-ERn),@-SP L 4
MOVFPE @aa:16,Rd
MOVTPE Rs,@aa:16
ERs32→@ERd — — 0 — 4
ERs32→@(d:16,ERd) — — 0 — 5
ERs32→@(d:32,ERd) — — 0 — 7
ERd32-4
→
ERd32,ERs32
→@
ERd
— — 0 — 5
ERs32→@aa:16 — — 0 — 5
ERs32→@aa:32 — — 0 — 6
@SP→Rn16,SP+2→SP — — 0 — 3
@SP→ERn32,SP+4→SP — — 0 — 5
SP-2→SP,Rn16→@SP — — 0 — 3
SP-4→SP,ERn32→@SP — — 0 — 5
(@SP→ERn32,SP+4→SP) — — — — — — 7/9/11 [1]
Repeated for each register restored
(SP-4→SP,ERn32→@SP) — — — — — — 7/9/11 [1]
Repeated for each register saved
[2]
[2]
Operation
Condition Code
IHNZVC Advanced
No. of States*1
↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔
Cannot be used in the chip
Cannot be used in the chip
Appendix A Instruction Set
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(2) Arithmetic Instructions
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
ADD
ADDX
ADDS
INC
DAA
SUB
ADD.B #xx:8,Rd B 2
ADD.B Rs,Rd B 2
ADD.W #xx:16,Rd W 4
ADD.W Rs,Rd W 2
ADD.L #xx:32,ERd L 6
ADD.L ERs,ERd L 2
ADDX #xx:8,Rd B 2
ADDX Rs,Rd B 2
ADDS #1,ERd L 2
ADDS #2,ERd L 2
ADDS #4,ERd L 2
INC.B Rd B 2
INC.W #1,Rd W 2
INC.W #2,Rd W 2
INC.L #1,ERd L 2
INC.L #2,ERd L 2
DAA Rd B 2
SUB.B Rs,Rd B 2
SUB.W #xx:16,Rd W 4
Rd8+#xx:8→Rd8 — 1
Rd8+Rs8→Rd8 — 1
Rd16+#xx:16→Rd16 — [3] 2
Rd16+Rs16→Rd16 — [3] 1
ERd32+#xx:32→ERd32 — [4] 3
ERd32+ERs32→ERd32 — [4] 1
Rd8+#xx:8+C→Rd8 — [5] 1
Rd8+Rs8+C→Rd8 — [5] 1
ERd32+1→ERd32 — — — — — — 1
ERd32+2→ERd32 — — — — — — 1
ERd32+4→ERd32 — — — — — — 1
Rd8+1→Rd8 — — — 1
Rd16+1→Rd16 — — — 1
Rd16+2→Rd16 — — — 1
ERd32+1→ERd32 — — — 1
ERd32+2→ERd32 — — — 1
Rd8 decimal adjust→Rd8 — * * 1
Rd8-Rs8→Rd8 — 1
Rd16-#xx:16→Rd16 — [3] 2
Operation
Condition Code
IHNZVC Advanced
No. of States*
1
↔↔↔
↔
↔↔↔↔↔↔↔↔
↔↔ ↔↔↔↔↔
↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔
↔↔↔↔↔↔
↔↔↔↔↔↔↔↔
↔↔ ↔↔
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 985 of 1268
REJ09B0220-0600
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
SUB
SUBX
SUBS
DEC
DAS
MULXU
MULXS
SUB.W Rs,Rd W 2
SUB.L #xx:32,ERd L 6
SUB.L ERs,ERd L 2
SUBX #xx:8,Rd B 2
SUBX Rs,Rd B 2
SUBS #1,ERd L 2
SUBS #2,ERd L 2
SUBS #4,ERd L 2
DEC.B Rd B 2
DEC.W #1,Rd W 2
DEC.W #2,Rd W 2
DEC.L #1,ERd L 2
DEC.L #2,ERd L 2
DAS Rd B 2
MULXU.B Rs,Rd B 2
MULXU.W Rs,ERd W 2
MULXS.B Rs,Rd B 4
MULXS.W Rs,ERd W 4
Rd16-Rs16→Rd16 — [3] 1
ERd32-#xx:32→ERd32 — [4] 3
ERd32-ERs32→ERd32 — [4] 1
Rd8-#xx:8-C→Rd8 — [5] 1
Rd8-Rs8-C→Rd8 — [5] 1
ERd32-1→ERd32 — — — — — — 1
ERd32-2→ERd32 — — — — — — 1
ERd32-4→ERd32 — — — — — — 1
Rd8-1→Rd8 — — — 1
Rd16-1→Rd16 — — — 1
Rd16-2→Rd16 — — — 1
ERd32-1→ERd32 — — — 1
ERd32-2→ERd32 — — — 1
Rd8 decimal adjust→Rd8 — * * — 1
Rd8
×
Rs8
→
Rd16 (unsigned multiplication)
— — — — — — 12
Rd16×Rs16→ERd32 — — — — — — 20
(unsigned multiplication)
Rd8
×
Rs8
→
Rd16 (signed multiplication)
— — — — 13
Rd16×Rs16→ERd32 — — — — 21
(signed multiplication)
Operation
Condition Code
IHNZVC Advanced
No. of States
*
1
↔↔
↔↔
↔↔↔↔↔↔
↔↔↔↔↔↔
↔↔↔↔↔
↔↔↔
↔↔↔↔↔
↔↔↔↔↔
↔↔↔↔↔
↔↔
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 986 of 1268
REJ09B0220-0600
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
DIVXU
DIVXS
CMP
NEG
EXTU
DIVXU.B Rs,Rd B 2
DIVXU.W Rs,ERd W 2
DIVXS.B Rs,Rd B 4
DIVXS.W Rs,ERd W 4
CMP.B #xx:8,Rd B 2
CMP.B Rs,Rd B 2
CMP.W #xx:16,Rd W 4
CMP.W Rs,Rd W 2
CMP.L #xx:32,ERd L 6
CMP.L ERs,ERd L 2
NEG.B Rd B 2
NEG.W Rd W 2
NEG.L ERd L 2
EXTU.W Rd W 2
EXTU.L ERd L 2
Rd16÷Rs8→
Rd16 (RdH: remainder,
— — [6] [7] — — 12
RdL: quotient) (unsigned division)
ERd32÷Rs16
→
ERd32 (Ed: remainder,
— — [6] [7] — — 20
Rd: quotient) (unsigned division)
Rd16÷Rs8→
Rd16 (RdH: remainder,
— —
[8] [7] — — 13
RdL: quotient) (signed division)
ERd32
÷Rs16→
ERd32 (Ed: remainder,
— — [8] [7] — — 21
Rd: quotient) (signed division)
Rd8-#xx:8 — 1
Rd8-Rs8 — 1
Rd16-#xx:16 — [3] 2
Rd16-Rs16 — [3] 1
ERd32-#xx:32 — [4] 3
ERd32-ERs32 — [4] 1
0-Rd8→Rd8 — 1
0-Rd16→Rd16 — 1
0-ERd32→ERd32 — 1
0→(<bits 15 to 8> of Rd16) — — 0 0 — 1
0→(<bits 31 to 16> of ERd32) — — 0 0 — 1
Operation
Condition Code
IHNZVC Advanced
No. of States
*
1
↔↔↔ ↔↔
↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 987 of 1268
REJ09B0220-0600
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
EXTS
TAS
MAC
CLRMAC
LDMAC
STMAC
EXTS.W Rd W 2
EXTS.L ERd L 2
TAS @ERd*
3
B 4
MAC @ERn+, @ERm+
CLRMAC
LDMAC ERs,MACH
LDMAC ERs,MACL
STMAC MACH,ERd
STMAC MACL,ERd
(<bit 7> of Rd16)→ — — 0 — 1
(<bits 15 to 8> of Rd16)
(<bit 15> of ERd32)→ — — 0 — 1
(<bits 31 to 16> of ERd32)
@ERd-0→CCR set, (1)→ — — 0 — 4
(<bit 7> of @ERd)
[2]
Operation
Condition Code
IHNZVC Advanced
No. of States
*
1
↔ ↔ ↔
↔ ↔ ↔
Cannot be used in the chip
Appendix A Instruction Set
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REJ09B0220-0600
(3) Logical Instructions
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
AND
OR
XOR
NOT
AND.B #xx:8,Rd B 2
AND.B Rs,Rd B 2
AND.W #xx:16,Rd W 4
AND.W Rs,Rd W 2
AND.L #xx:32,ERd L 6
AND.L ERs,ERd L 4
OR.B #xx:8,Rd B 2
OR.B Rs,Rd B 2
OR.W #xx:16,Rd W 4
OR.W Rs,Rd W 2
OR.L #xx:32,ERd L 6
OR.L ERs,ERd L 4
XOR.B #xx:8,Rd B 2
XOR.B Rs,Rd B 2
XOR.W #xx:16,Rd W 4
XOR.W Rs,Rd W 2
XOR.L #xx:32,ERd L 6
XOR.L ERs,ERd L 4
NOT.B Rd B 2
NOT.W Rd W 2
NOT.L ERd L 2
Rd8∧#xx:8→Rd8 — — 0 — 1
Rd8∧Rs8→Rd8 — — 0 — 1
Rd16∧#xx:16→Rd16 — — 0 — 2
Rd16∧Rs16→Rd16 — — 0 — 1
ERd32∧#xx:32→ERd32 — — 0 — 3
ERd32∧ERs32→ERd32 — — 0 — 2
Rd8∨#xx:8→Rd8 — — 0 — 1
Rd8∨Rs8→Rd8 — — 0 — 1
Rd16∨#xx:16→Rd16 — — 0 — 2
Rd16∨Rs16→Rd16 — — 0 — 1
ERd32∨#xx:32→ERd32 — — 0 — 3
ERd32∨ERs32→ERd32 — — 0 — 2
Rd8⊕#xx:8→Rd8 — — 0 — 1
Rd8⊕Rs8→Rd8 — — 0 — 1
Rd16⊕#xx:16→Rd16 — — 0 — 2
Rd16⊕Rs16→Rd16 — — 0 — 1
ERd32⊕#xx:32→ERd32 — — 0 — 3
ERd32⊕ERs32→ERd32 — — 0 — 2
¬ Rd8→Rd8 — — 0 — 1
¬ Rd16→Rd16 — — 0 — 1
¬ ERd32→ERd32 — — 0 — 1
Operation
Condition Code
IHNZVC Advanced
No. of States
*
1
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
Appendix A Instruction Set
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(4) Shift Instructions
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
SHAL
SHAR
SHLL
SHAL.B Rd B 2
SHAL.B #2,Rd B 2
SHAL.W Rd W 2
SHAL.W #2,Rd W 2
SHAL.L ERd L 2
SHAL.L #2,ERd L 2
SHAR.B Rd B 2
SHAR.B #2,Rd B 2
SHAR.W Rd W 2
SHAR.W #2,Rd W 2
SHAR.L ERd L 2
SHAR.L #2,ERd L 2
SHLL.B Rd B 2
SHLL.B #2,Rd B 2
SHLL.W Rd W 2
SHLL.W #2,Rd W 2
SHLL.L ERd L 2
SHLL.L #2,ERd L 2
— — 1
— — 1
— — 1
— — 1
— — 1
— — 1
— — 0 1
— — 0 1
— — 0 1
— — 0 1
— — 0 1
— — 0 1
— — 0 1
— — 0 1
— — 0 1
— — 0 1
— — 0 1
— — 0 1
Operation
Condition Code
IHNZVC Advanced
No. of States*1
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
CMSB LSB
MSB LSB
0
C
MSB LSB
C
0
Appendix A Instruction Set
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REJ09B0220-0600
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
SHLR
ROTXL
ROTXR
SHLR.B Rd B 2
SHLR.B #2,Rd B 2
SHLR.W Rd W 2
SHLR.W #2,Rd W 2
SHLR.L ERd L 2
SHLR.L #2,ERd L 2
ROTXL.B Rd B 2
ROTXL.B #2,Rd B 2
ROTXL.W Rd W 2
ROTXL.W #2,Rd W 2
ROTXL.L ERd L 2
ROTXL.L #2,ERd L 2
ROTXR.B Rd B 2
ROTXR.B #2,Rd B 2
ROTXR.W Rd W 2
ROTXR.W #2,Rd W 2
ROTXR.L ERd L 2
ROTXR.L #2,ERd L 2
— — — 0 0 1
— — — 0 0 1
— — — 0 0 1
— — — 0 0 1
— — — 0 0 1
— — — 0 0 1
— — — 0 1
— — — 0 1
— — — 0 1
— — — 0 1
— — — 0 1
— — — 0 1
— — — 0 1
— — — 0 1
— — — 0 1
— — — 0 1
— — — 0 1
— — — 0 1
Operation
Condition Code
IHNZVC Advanced
No. of States
*
1
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔↔
C
MSB LSB
0
CMSB LSB
C
MSB LSB
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 991 of 1268
REJ09B0220-0600
— — 0 1
— — 0 1
— — 0 1
— — 0 1
— — 0 1
— — 0 1
— — — 0 1
— — — 0 1
— — — 0 1
— — 0 1
— — — 0 1
1 — — 0 1
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
ROTL
ROTR
ROTL.B Rd B 2
ROTL.B #2,Rd B 2
ROTL.W Rd W 2
ROTL.W #2,Rd W 2
ROTL.L ERd L 2
ROTL.L #2,ERd L 2
ROTR.B Rd B 2
ROTR.B #2,Rd B 2
ROTR.W Rd W 2
ROTR.W #2,Rd W 2
ROTR.L ERd L 2
ROTR.L #2,ERd L 2
Operation
Condition Code
IHNZVC Advanced
No. of States
*1
↔↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔↔↔↔↔↔↔
C
MSB LSB
CMSB LSB
Appendix A Instruction Set
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REJ09B0220-0600
(5) Bit-Manipulation Instructions
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
BSET
BCLR
BSET #xx:3,Rd B 2
BSET #xx:3,@ERd B 4
BSET #xx:3,@aa:8 B 4
BSET #xx:3,@aa:16 B 6
BSET #xx:3,@aa:32 B 8
BSET Rn,Rd B 2
BSET Rn,@ERd B 4
BSET Rn,@aa:8 B 4
BSET Rn,@aa:16 B 6
BSET Rn,@aa:32 B 8
BCLR #xx:3,Rd B 2
BCLR #xx:3,@ERd B 4
BCLR #xx:3,@aa:8 B 4
BCLR #xx:3,@aa:16 B 6
BCLR #xx:3,@aa:32 B 8
BCLR Rn,Rd B 2
BCLR Rn,@ERd B 4
BCLR Rn,@aa:8 B 4
BCLR Rn,@aa:16 B 6
(#xx:3 of Rd8)←1 — — — — — — 1
(#xx:3 of @ERd)←1 — — — — — — 4
(#xx:3 of @aa:8)←1 — — — — — — 4
(#xx:3 of @aa:16)←1 — — — — — — 5
(#xx:3 of @aa:32)←1 — — — — — — 6
(Rn8 of Rd8)←1 — — — — — — 1
(Rn8 of @ERd)←1 — — — — — — 4
(Rn8 of @aa:8)←1 — — — — — — 4
(Rn8 of @aa:16)←1 — — — — — — 5
(Rn8 of @aa:32)←1 — — — — — — 6
(#xx:3 of Rd8)←0 — — — — — — 1
(#xx:3 of @ERd)←0 — — — — — — 4
(#xx:3 of @aa:8)←0 — — — — — — 4
(#xx:3 of @aa:16)←0 — — — — — — 5
(#xx:3 of @aa:32)←0 — — — — — — 6
(Rn8 of Rd8)←0 — — — — — — 1
(Rn8 of @ERd)←0 — — — — — — 4
(Rn8 of @aa:8)←0 — — — — — — 4
(Rn8 of @aa:16)←0 — — — — — — 5
Operation
Condition Code
IHNZVC Advanced
No. of States
*
1
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 993 of 1268
REJ09B0220-0600
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
BCLR
BNOT
BTST
BCLR Rn,@aa:32 B 8
BNOT #xx:3,Rd B 2
BNOT #xx:3,@ERd B 4
BNOT #xx:3,@aa:8 B 4
BNOT #xx:3,@aa:16 B 6
BNOT #xx:3,@aa:32 B 8
BNOT Rn,Rd B 2
BNOT Rn,@ERd B 4
BNOT Rn,@aa:8 B 4
BNOT Rn,@aa:16 B 6
BNOT Rn,@aa:32 B 8
BTST #xx:3,Rd B 2
BTST #xx:3,@ERd B 4
BTST #xx:3,@aa:8 B 4
BTST #xx:3,@aa:16 B 6
(Rn8 of @aa:32)←0 — — — — — — 6
(#xx:3 of Rd8)←[¬ (#xx:3 of Rd8)] — — — — — — 1
(#xx:3 of @ERd)← — — — — — — 4
[¬ (#xx:3 of @ERd)]
(#xx:3 of @aa:8)← — — — — — — 4
[¬ (#xx:3 of @aa:8)]
(#xx:3 of @aa:16)← — — — — — — 5
[¬ (#xx:3 of @aa:16)]
(#xx:3 of @aa:32)← — — — — — — 6
[¬ (#xx:3 of @aa:32)]
(Rn8 of Rd8)←[¬ (Rn8 of Rd8)] — — — — — — 1
(Rn8 of @ERd)
←
[¬ (Rn8 of @ERd)]
— — — — — — 4
(Rn8 of @aa:8)
←
[¬ (Rn8 of @aa:8)]
— — — — — — 4
(Rn8 of @aa:16)← — — — — — — 5
[¬ (Rn8 of @aa:16)]
(Rn8 of @aa:32)← — — — — — — 6
[¬ (Rn8 of @aa:32)]
¬ (#xx:3 of Rd8)→Z — — — — — 1
¬ (#xx:3 of @ERd)→Z — — — — — 3
¬ (#xx:3 of @aa:8)→Z — — — — — 3
¬ (#xx:3 of @aa:16)→Z — — — — — 4
Operation
Condition Code
IHNZVC Advanced
No. of States
*
1
↔↔↔↔
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 994 of 1268
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Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
BTST
BLD
BILD
BST
BTST #xx:3,@aa:32 B 8
BTST Rn,Rd B 2
BTST Rn,@ERd B 4
BTST Rn,@aa:8 B 4
BTST Rn,@aa:16 B 6
BTST Rn,@aa:32 B 8
BLD #xx:3,Rd B 2
BLD #xx:3,@ERd B 4
BLD #xx:3,@aa:8 B 4
BLD #xx:3,@aa:16 B 6
BLD #xx:3,@aa:32 B 8
BILD #xx:3,Rd B 2
BILD #xx:3,@ERd B 4
BILD #xx:3,@aa:8 B 4
BILD #xx:3,@aa:16 B 6
BILD #xx:3,@aa:32 B 8
BST #xx:3,Rd B 2
BST #xx:3,@ERd B 4
BST #xx:3,@aa:8 B 4
¬ (#xx:3 of @aa:32)→Z — — — — — 5
¬ (Rn8 of Rd8)→Z — — — — — 1
¬ (Rn8 of @ERd)→Z — — — — — 3
¬ (Rn8 of @aa:8)→Z — — — — — 3
¬ (Rn8 of @aa:16)→Z — — — — — 4
¬ (Rn8 of @aa:32)→Z — — — — — 5
(#xx:3 of Rd8)→C — — — — — 1
(#xx:3 of @ERd)→C — — — — — 3
(#xx:3 of @aa:8)→C — — — — — 3
(#xx:3 of @aa:16)→C — — — — — 4
(#xx:3 of @aa:32)→C — — — — — 5
¬ (#xx:3 of Rd8)→C — — — — — 1
¬ (#xx:3 of @ERd)→C — — — — — 3
¬ (#xx:3 of @aa:8)→C — — — — — 3
¬ (#xx:3 of @aa:16)→C — — — — — 4
¬ (#xx:3 of @aa:32)→C — — — — — 5
C→(#xx:3 of Rd8) — — — — — — 1
C→(#xx:3 of @ERd) — — — — — — 4
C→(#xx:3 of @aa:8) — — — — — — 4
Operation
Condition Code
IHNZVC Advanced
No. of States
*
1
↔↔↔↔↔↔↔↔↔↔
↔↔↔↔↔↔
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 995 of 1268
REJ09B0220-0600
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
BST
BIST
BAND
BIAND
BOR
BST #xx:3,@aa:16 B 6
BST #xx:3,@aa:32 B 8
BIST #xx:3,Rd B 2
BIST #xx:3,@ERd B 4
BIST #xx:3,@aa:8 B 4
BIST #xx:3,@aa:16 B 6
BIST #xx:3,@aa:32 B 8
BAND #xx:3,Rd B 2
BAND #xx:3,@ERd B 4
BAND #xx:3,@aa:8 B 4
BAND #xx:3,@aa:16 B 6
BAND #xx:3,@aa:32 B 8
BIAND #xx:3,Rd B 2
BIAND #xx:3,@ERd B 4
BIAND #xx:3,@aa:8 B 4
BIAND #xx:3,@aa:16 B 6
BIAND #xx:3,@aa:32 B 8
BOR #xx:3,Rd B 2
BOR #xx:3,@ERd B 4
C→(#xx:3 of @aa:16) — — — — — — 5
C→(#xx:3 of @aa:32) — — — — — — 6
¬ C→(#xx:3 of Rd8) — — — — — — 1
¬ C→(#xx:3 of @ERd) — — — — — — 4
¬ C→(#xx:3 of @aa:8) — — — — — — 4
¬ C→(#xx:3 of @aa:16) — — — — — — 5
¬ C→(#xx:3 of @aa:32) — — — — — — 6
C∧(#xx:3 of Rd8)→C — — — — — 1
C∧(#xx:3 of @ERd)→C — — — — — 3
C∧(#xx:3 of @aa:8)→C — — — — — 3
C∧(#xx:3 of @aa:16)→C — — — — — 4
C∧(#xx:3 of @aa:32)→C — — — — — 5
C∧[¬ (#xx:3 of Rd8)]→C — — — — — 1
C∧[¬ (#xx:3 of @ERd)]→C — — — — — 3
C∧[¬ (#xx:3 of @aa:8)]→C — — — — — 3
C∧[¬ (#xx:3 of @aa:16)]→C — — — — — 4
C∧[¬ (#xx:3 of @aa:32)]→C — — — — — 5
C∨(#xx:3 of Rd8)→C — — — — — 1
C∨(#xx:3 of @ERd)→C — — — — — 3
Operation
Condition Code
IHNZVC Advanced
No. of States
*
1
↔↔↔↔↔↔↔↔↔↔↔↔
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 996 of 1268
REJ09B0220-0600
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
BOR
BIOR
BXOR
BIXOR
BOR #xx:3,@aa:8 B 4
BOR #xx:3,@aa:16 B 6
BOR #xx:3,@aa:32 B 8
BIOR #xx:3,Rd B 2
BIOR #xx:3,@ERd B 4
BIOR #xx:3,@aa:8 B 4
BIOR #xx:3,@aa:16 B 6
BIOR #xx:3,@aa:32 B 8
BXOR #xx:3,Rd B 2
BXOR #xx:3,@ERd B 4
BXOR #xx:3,@aa:8 B 4
BXOR #xx:3,@aa:16 B 6
BXOR #xx:3,@aa:32 B 8
BIXOR #xx:3,Rd B 2
BIXOR #xx:3,@ERd B 4
BIXOR #xx:3,@aa:8 B 4
BIXOR #xx:3,@aa:16 B 6
BIXOR #xx:3,@aa:32 B 8
C∨(#xx:3 of @aa:8)→C — — — — — 3
C∨(#xx:3 of @aa:16)→C — — — — — 4
C∨(#xx:3 of @aa:32)→C — — — — — 5
C∨[¬ (#xx:3 of Rd8)]→C — — — — — 1
C∨[¬ (#xx:3 of @ERd)]→C — — — — — 3
C∨[¬ (#xx:3 of @aa:8)]→C — — — — — 3
C∨[¬ (#xx:3 of @aa:16)]→C — — — — — 4
C∨[¬ (#xx:3 of @aa:32)]→C — — — — — 5
C⊕(#xx:3 of Rd8)→C — — — — — 1
C⊕(#xx:3 of @ERd)→C — — — — — 3
C⊕(#xx:3 of @aa:8)→C — — — — — 3
C⊕(#xx:3 of @aa:16)→C — — — — — 4
C⊕(#xx:3 of @aa:32)→C — — — — — 5
C⊕[¬ (#xx:3 of Rd8)]→C — — — — — 1
C⊕[¬ (#xx:3 of @ERd)]→C — — — — — 3
C⊕[¬ (#xx:3 of @aa:8)]→C — — — — — 3
C⊕[¬ (#xx:3 of @aa:16)]→C — — — — — 4
C⊕[¬ (#xx:3 of @aa:32)]→C — — — — — 5
Operation
Condition Code
IHNZVC Advanced
No. of States*
1
↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔↔
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 997 of 1268
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(6) Branch Instructions
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
Bcc Always — — — — — — 2
— — — — — — 3
Never — — — — — — 2
— — — — — — 3
C∨Z=0 — — — — — — 2
— — — — — — 3
C∨Z=1 — — — — — — 2
— — — — — — 3
C=0 — — — — — — 2
— — — — — — 3
C=1 — — — — — — 2
— — — — — — 3
Z=0 — — — — — — 2
— — — — — — 3
Z=1 — — — — — — 2
— — — — — — 3
V=0 — — — — — — 2
— — — — — — 3
Operation Condition Code
Branching
Condition
IHNZVC Advanced
No. of States*1
BRA d:8(BT d:8) — 2 if condition is true then
BRA d:16(BT d:16) — 4 PC←PC+d
BRN d:8(BF d:8) — 2 else next;
BRN d:16(BF d:16) — 4
BHI d:8 — 2
BHI d:16 — 4
BLS d:8 — 2
BLS d:16 — 4
BCC d:B(BHS d:8) — 2
BCC d:16(BHS d:16) — 4
BCS d:8(BLO d:8) — 2
BCS d:16(BLO d:16) — 4
BNE d:8 — 2
BNE d:16 — 4
BEQ d:8 — 2
BEQ d:16 — 4
BVC d:8 — 2
BVC d:16 — 4
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 998 of 1268
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Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
Bcc V=1 — — — — — — 2
— — — — — — 3
N=0 — — — — — — 2
— — — — — — 3
N=1 — — — — — — 2
— — — — — — 3
N⊕V=0 — — — — — — 2
— — — — — — 3
N⊕V=1 — — — — — — 2
— — — — — — 3
Z
∨
(N⊕V)=0
— — — — — — 2
— — — — — — 3
Z
∨
(N⊕V)=1
— — — — — — 2
— — — — — — 3
Operation Condition Code
Branching
Condition IHNZVC Advanced
No. of States
*1
BVS d:8 — 2
BVS d:16 — 4
BPL d:8 — 2
BPL d:16 — 4
BMI d:8 — 2
BMI d:16 — 4
BGE d:8 — 2
BGE d:16 — 4
BLT d:8 — 2
BLT d:16 — 4
BGT d:8 — 2
BGT d:16 — 4
BLE d:8 — 2
BLE d:16 — 4
Appendix A Instruction Set
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Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
JMP
BSR
JSR
RTS
JMP @ERn — 2
JMP @aa:24 — 4
JMP @@aa:8 — 2
BSR d:8 — 2
BSR d:16 — 4
JSR @ERn — 2
JSR @aa:24 — 4
JSR @@aa:8 — 2
RTS — 2
PC←ERn — — — — — — 2
PC←aa:24 — — — — — — 3
PC←@aa:8 — — — — — — 5
PC→@-SP,PC←PC+d:8 — — — — — — 4
PC→@-SP,PC←PC+d:16 — — — — — — 5
PC→@-SP,PC←ERn — — — — — — 4
PC→@-SP,PC←aa:24 — — — — — — 5
PC→@-SP,PC←@aa:8 — — — — — — 6
PC←@SP+ — — — — — — 5
Operation
Condition Code
IHNZVC Advanced
No. of States*
1
Appendix A Instruction Set
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(7) System Control Instructions
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
TRAPA
RTE
SLEEP
LDC
TRAPA #xx:2 —
RTE —
SLEEP —
LDC #xx:8,CCR B 2
LDC #xx:8,EXR B 4
LDC Rs,CCR B 2
LDC Rs,EXR B 2
LDC @ERs,CCR W 4
LDC @ERs,EXR W 4
LDC @(d:16,ERs),CCR W 6
LDC @(d:16,ERs),EXR W 6
LDC @(d:32,ERs),CCR W 10
LDC @(d:32,ERs),EXR W 10
LDC @ERs+,CCR W 4
LDC @ERs+,EXR W 4
LDC @aa:16,CCR W 6
LDC @aa:16,EXR W 6
LDC @aa:32,CCR W 8
LDC @aa:32,EXR W 8
PC→@-SP,CCR→@-SP, 1 — — — — — 8 [9]
EXR→@-SP,<vector>→PC
EXR←@SP+,CCR←@SP+, 5 [9]
PC←@SP+
Transition to power-down state — — — — — — 2
#xx:8→CCR 1
#xx:8→EXR — — — — — — 2
Rs8→CCR 1
Rs8→EXR — — — — — — 1
@ERs→CCR 3
@ERs→EXR — — — — — — 3
@(d:16,ERs)→CCR 4
@(d:16,ERs)→EXR — — — — — — 4
@(d:32,ERs)→CCR 6
@(d:32,ERs)→EXR — — — — — — 6
@ERs→CCR,ERs32+2→ERs32 4
@ERs→EXR,ERs32+2→ERs32 — — — — — — 4
@aa:16→CCR 4
@aa:16→EXR — — — — — — 4
@aa:32→CCR 5
@aa:32→EXR — — — — — — 5
Operation
Condition Code
IHNZVC Advanced
No. of States*
1
↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔
↔ ↔ ↔ ↔
↔ ↔ ↔ ↔
↔ ↔ ↔ ↔
↔ ↔ ↔ ↔
↔ ↔ ↔ ↔
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1001 of 1268
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Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
STC
ANDC
ORC
XORC
NOP
STC CCR,Rd B 2
STC EXR,Rd B 2
STC CCR,@ERd W 4
STC EXR,@ERd W 4
STC CCR,@(d:16,ERd) W 6
STC EXR,@(d:16,ERd) W 6
STC CCR,@(d:32,ERd) W 10
STC EXR,@(d:32,ERd) W 10
STC CCR,@-ERd W 4
STC EXR,@-ERd W 4
STC CCR,@aa:16 W 6
STC EXR,@aa:16 W 6
STC CCR,@aa:32 W 8
STC EXR,@aa:32 W 8
ANDC #xx:8,CCR B 2
ANDC #xx:8,EXR B 4
ORC #xx:8,CCR B 2
ORC #xx:8,EXR B 4
XORC #xx:8,CCR B 2
XORC #xx:8,EXR B 4
NOP — 2
CCR→Rd8 — — — — — — 1
EXR→Rd8 — — — — — — 1
CCR→@ERd — — — — — — 3
EXR→@ERd — — — — — — 3
CCR→@(d:16,ERd) — — — — — — 4
EXR→@(d:16,ERd) — — — — — — 4
CCR→@(d:32,ERd) — — — — — — 6
EXR→@(d:32,ERd) — — — — — — 6
ERd32-2→ERd32,CCR→@ERd — — — — — — 4
ERd32-2→ERd32,EXR→@ERd — — — — — — 4
CCR→@aa:16 — — — — — — 4
EXR→@aa:16 — — — — — — 4
CCR→@aa:32 — — — — — — 5
EXR→@aa:32 — — — — — — 5
CCR∧#xx:8→CCR 1
EXR∧#xx:8→EXR — — — — — — 2
CCR∨#xx:8→CCR 1
EXR∨#xx:8→EXR — — — — — — 2
CCR⊕#xx:8→CCR 1
EXR⊕#xx:8→EXR — — — — — — 2
PC←PC+2 — — — — — — 1
Operation
Condition Code
IHNZVC Advanced
No. of States*
1
↔ ↔ ↔
↔ ↔ ↔
↔ ↔ ↔
↔ ↔ ↔
↔ ↔ ↔
↔ ↔ ↔
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1002 of 1268
REJ09B0220-0600
(8) Block Transfer Instructions
Addressing Mode/
Instruction Length (Bytes)
Operand Size
#xx
Rn
@ERn
@(d,ERn)
@–ERn/@ERn+
@aa
@(d,PC)
@@aa
—
Mnemonic
EEPMOV
Notes: 1. The number of states is the number of states required for execution when the instruction and its operands are located in on-chip memory.
2. n is the initial value of R4L or R4.
3. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
[1] Seven states for saving or restoring two registers, nine states for three registers, or eleven states for four registers.
[2] Cannot be used in the chip.
[3] Set to 1 when a carry or borrow occurs at bit 11; otherwise cleared to 0.
[4] Set to 1 when a carry or borrow occurs at bit 27; otherwise cleared to 0.
[5] Retains its previous value when the result is zero; otherwise cleared to 0.
[6] Set to 1 when the divisor is negative; otherwise cleared to 0.
[7] Set to 1 when the divisor is zero; otherwise cleared to 0.
[8] Set to 1 when the quotient is negative; otherwise cleared to 0.
[9] One additional state is required for execution when EXR is valid.
EEPMOV.B — 4
EEPMOV.W — 4
if R4L 0 — — — — — — 4+2n
*2
Repeat @ER5→@ER6
ER5+1→ER5
ER6+1→ER6
R4L-1→R4L
Until R4L=0
else next;
if R4 0 — — — — — — 4+2n
*2
Repeat @ER5→@ER6
ER5+1→ER5
ER6+1→ER6
R4-1→R4
Until R4=0
else next;
Operation
Condition Code
IHNZVC Advanced
No. of States
*
1
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1003 of 1268
REJ09B0220-0600
A.2 Instruction Codes
Table A.2 shows the instruction codes.
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1004 of 1268
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Table A.2 Instruction Codes
ADD.B #xx:8,Rd
ADD.B Rs,Rd
ADD.W #xx:16,Rd
ADD.W Rs,Rd
ADD.L #xx:32,ERd
ADD.L ERs,ERd
ADDS #1,ERd
ADDS #2,ERd
ADDS #4,ERd
ADDX #xx:8,Rd
ADDX Rs,Rd
AND.B #xx:8,Rd
AND.B Rs,Rd
AND.W #xx:16,Rd
AND.W Rs,Rd
AND.L #xx:32,ERd
AND.L ERs,ERd
ANDC #xx:8,CCR
ANDC #xx:8,EXR
BAND #xx:3,Rd
BAND #xx:3,@ERd
BAND #xx:3,@aa:8
BAND #xx:3,@aa:16
BAND #xx:3,@aa:32
BRA d:8 (BT d:8)
BRA d:16 (BT d:16)
BRN d:8 (BF d:8)
BRN d:16 (BF d:16)
Mnemonic Size Instruction Format
1st byte 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte 10th byte
Instruc-
tion
ADD
ADDS
ADDX
AND
ANDC
BAND
Bcc
B
B
W
W
L
L
L
L
L
B
B
B
B
W
W
L
L
B
B
B
B
B
B
B
—
—
—
—
1
0
0
ers
IMM
erd
0
0
0
0
0
0
erd
erd
erd
erd
erd
erd
ers
IMM
IMM
0erd
0IMM
0IMM
0
0
0
8
0
7
0
7
0
0
0
0
9
0
E
1
7
6
7
0
0
0
7
7
7
6
6
4
5
4
5
rd
8
9
9
A
A
B
B
B
rd
E
rd
6
9
6
A
1
6
1
6
C
E
A
A
0
8
1
8
rd
rd
rd
rd
rd
rd
rd
0
1
rd
0
0
0
0
0
6
0
7
7
6
6
6
6
0
0
76 0
76 0
IMM
IMM
IMM
IMM
abs
disp
disp
rs
1
rs
1
0
8
9
rs
rs
6
rs
6
F
4
1
3
0
1
IMM
IMM
abs
disp
disp
IMM
IMM
abs
IMM
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1005 of 1268
REJ09B0220-0600
BHI d:8
BHI d:16
BLS d:8
BLS d:16
BCC d:8 (BHS d:8)
BCC d:16 (BHS d:16)
BCS d:8 (BLO d:8)
BCS d:16 (BLO d:16)
BNE d:8
BNE d:16
BEQ d:8
BEQ d:16
BVC d:8
BVC d:16
BVS d:8
BVS d:16
BPL d:8
BPL d:16
BMI d:8
BMI d:16
BGE d:8
BGE d:16
BLT d:8
BLT d:16
BGT d:8
BGT d:16
BLE d:8
BLE d:16
Mnemonic Size Instruction Format
1st byte 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte 10th byte
Instruc-
tion
Bcc —
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
2
8
3
8
4
8
5
8
6
8
7
8
8
8
9
8
A
8
B
8
C
8
D
8
E
8
F
8
2
3
4
5
6
7
8
9
A
B
C
D
E
F
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
disp
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1006 of 1268
REJ09B0220-0600
BCLR #xx:3,Rd
BCLR #xx:3,@ERd
BCLR #xx:3,@aa:8
BCLR #xx:3,@aa:16
BCLR #xx:3,@aa:32
BCLR Rn,Rd
BCLR Rn,@ERd
BCLR Rn,@aa:8
BCLR Rn,@aa:16
BCLR Rn,@aa:32
BIAND #xx:3,Rd
BIAND #xx:3,@ERd
BIAND #xx:3,@aa:8
BIAND #xx:3,@aa:16
BIAND #xx:3,@aa:32
BILD #xx:3,Rd
BILD #xx:3,@ERd
BILD #xx:3,@aa:8
BILD #xx:3,@aa:16
BILD #xx:3,@aa:32
BIOR #xx:3,Rd
BIOR #xx:3,@ERd
BIOR #xx:3,@aa:8
BIOR #xx:3,@aa:16
BIOR #xx:3,@aa:32
Mnemonic Size Instruction Format
1st byte 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte 10th byte
Instruc-
tion
BCLR
BIAND
BILD
BIOR
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
0
0
0
1
0
1
0
1
0
IMM
erd
erd
IMM
erd
IMM
erd
IMM
erd
0
1
1
1
IMM
IMM
IMM
IMM
0
1
1
1
IMM
IMM
IMM
IMM
7
7
7
6
6
6
7
7
6
6
7
7
7
6
6
7
7
7
6
6
7
7
7
6
6
2
D
F
A
A
2
D
F
A
A
6
C
E
A
A
7
C
E
A
A
4
C
E
A
A
1
3
rn
1
3
1
3
1
3
1
3
rd
0
8
8
rd
0
8
8
rd
0
0
0
rd
0
0
0
rd
0
0
0
7
7
6
6
7
7
7
7
7
7
2
2
2
2
6
6
7
7
4
4
rn
rn
0
0
0
0
0
0
0
0
0
0
7
6
7
7
7
2
2
6
7
4
rn
0
0
0
0
0
7
6
7
7
7
2
2
6
7
4
rn
0
0
0
0
0
abs
abs
abs
abs
abs
abs
abs
abs
abs
abs
abs
abs
abs
abs
abs
0
0
1
1
1
1
1
1
IMM
IMM
IMM
IMM
IMM
IMM
IMM
IMM
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1007 of 1268
REJ09B0220-0600
BIST #xx:3,Rd
BIST #xx:3,@ERd
BIST #xx:3,@aa:8
BIST #xx:3,@aa:16
BIST #xx:3,@aa:32
BIXOR #xx:3,Rd
BIXOR #xx:3,@ERd
BIXOR #xx:3,@aa:8
BIXOR #xx:3,@aa:16
BIXOR #xx:3,@aa:32
BLD #xx:3,Rd
BLD #xx:3,@ERd
BLD #xx:3,@aa:8
BLD #xx:3,@aa:16
BLD #xx:3,@aa:32
BNOT #xx:3,Rd
BNOT #xx:3,@ERd
BNOT #xx:3,@aa:8
BNOT #xx:3,@aa:16
BNOT #xx:3,@aa:32
BNOT Rn,Rd
BNOT Rn,@ERd
BNOT Rn,@aa:8
BNOT Rn,@aa:16
BNOT Rn,@aa:32
Mnemonic Size Instruction Format
1st byte 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte 10th byte
Instruc-
tion
BIST
BIXOR
BLD
BNOT
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
1
0
1
0
0
0
0
0
0
IMM
erd
IMM
erd
IMM
erd
IMM
erd
erd
IMM
IMM
IMM
IMM
IMM
IMM
IMM
IMM
1
1
0
0
IMM
IMM
IMM
IMM
1
1
0
0
IMM
IMM
IMM
IMM
1
1
1
1
0
0
0
0
6
7
7
6
6
7
7
7
6
6
7
7
7
6
6
7
7
7
6
6
6
7
7
6
6
7
D
F
A
A
5
C
E
A
A
7
C
E
A
A
1
D
F
A
A
1
D
F
A
A
1
3
1
3
1
3
1
3
rn
1
3
rd
0
8
8
rd
0
0
0
rd
0
0
0
rd
0
8
8
rd
0
8
8
6
6
7
7
7
7
7
7
6
6
7
7
5
5
7
7
1
1
1
1
rn
rn
0
0
0
0
0
0
0
0
0
0
6
7
7
7
6
7
5
7
1
1rn
0
0
0
0
0
6
7
7
7
6
7
5
7
1
1rn
0
0
0
0
0
abs
abs
abs
abs
abs
abs
abs
abs
abs
abs
abs
abs
abs
abs
abs
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1008 of 1268
REJ09B0220-0600
BOR #xx:3,Rd
BOR #xx:3,@ERd
BOR #xx:3,@aa:8
BOR #xx:3,@aa:16
BOR #xx:3,@aa:32
BSET #xx:3,Rd
BSET #xx:3,@ERd
BSET #xx:3,@aa:8
BSET #xx:3,@aa:16
BSET #xx:3,@aa:32
BSET Rn,Rd
BSET Rn,@ERd
BSET Rn,@aa:8
BSET Rn,@aa:16
BSET Rn,@aa:32
BSR d:8
BSR d:16
BST #xx:3,Rd
BST #xx:3,@ERd
BST #xx:3,@aa:8
BST #xx:3,@aa:16
BST #xx:3,@aa:32
BTST #xx:3,Rd
BTST #xx:3,@ERd
BTST #xx:3,@aa:8
BTST #xx:3,@aa:16
BTST #xx:3,@aa:32
BTST Rn,Rd
BTST Rn,@ERd
Mnemonic Size Instruction Format
1st byte 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte 10th byte
Instruc-
tion
BOR
BSET
BSR
BST
BTST
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
—
—
B
B
B
B
B
B
B
B
B
B
B
B
0
0
0
0
0
0
0
0
0
0
IMM
erd
IMM
erd
erd
IMM
erd
IMM
erd
erd
abs
abs
abs
disp
abs
abs
IMM
IMM
IMM
IMM
IMM
IMM
IMM
IMM
0
0
0
0
IMM
IMM
IMM
IMM
0
0
0
0
IMM
IMM
IMM
IMM
0
0
0
0
0
0
0
0
7
7
7
6
6
7
7
7
6
6
6
7
7
6
6
5
5
6
7
7
6
6
7
7
7
6
6
6
7
4
C
E
A
A
0
D
F
A
A
0
D
F
A
A
5
C
7
D
F
A
A
3
C
E
A
A
3
C
1
3
1
3
rn
1
3
0
1
3
1
3
rn
rd
0
0
0
rd
0
8
8
rd
0
8
8
0
rd
0
8
8
rd
0
0
0
rd
0
7
7
7
7
6
6
6
6
7
7
6
4
4
0
0
0
0
7
7
3
3
3
rn
rn
rn
0
0
0
0
0
0
0
0
0
0
0
7
7
6
6
7
4
0
0
7
3
rn
0
0
0
0
0
7
7
6
6
7
4
0
0
7
3
rn
0
0
0
0
0
abs
abs
abs
disp
abs
abs
abs
abs
abs
abs
abs
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1009 of 1268
REJ09B0220-0600
BTST Rn,@aa:8
BTST Rn,@aa:16
BTST Rn,@aa:32
BXOR #xx:3,Rd
BXOR #xx:3,@ERd
BXOR #xx:3,@aa:8
BXOR #xx:3,@aa:16
BXOR #xx:3,@aa:32
CLRMAC
CMP.B #xx:8,Rd
CMP.B Rs,Rd
CMP.W #xx:16,Rd
CMP.W Rs,Rd
CMP.L #xx:32,ERd
CMP.L ERs,ERd
DAA Rd
DAS Rd
DEC.B Rd
DEC.W #1,Rd
DEC.W #2,Rd
DEC.L #1,ERd
DEC.L #2,ERd
DIVXS.B Rs,Rd
DIVXS.W Rs,ERd
DIVXU.B Rs,Rd
DIVXU.W Rs,ERd
EEPMOV.B
EEPMOV.W
Mnemonic Size Instruction Format
1st byte 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte 10th byte
Instruc-
tion
BTST
BXOR
CLRMAC
CMP
DAA
DAS
DEC
DIVXS
DIVXU
EEPMOV
B
B
B
B
B
B
B
B
—
B
B
W
W
L
L
B
B
B
W
W
L
L
B
W
B
W
—
—
0
0
1
IMM
erd
ers
0
0
0
0
0
erd
erd
erd
erd
erd
IMM
IMM
0erd
0IMM
0IMM
0
0
7
6
6
7
7
7
6
6
A
1
7
1
7
1
0
1
1
1
1
1
1
0
0
5
5
7
7
E
A
A
5
C
E
A
A
rd
C
9
D
A
F
F
F
A
B
B
B
B
1
1
1
3
B
B
1
3
1
3
rs
2
rs
2
0
0
0
5
D
7
F
D
D
rs
rs
5
D
0
0
rd
0
0
0
rd
rd
rd
rd
rd
rd
rd
rd
0
0
rd
C
4
6
7
7
5
5
5
5
3
5
5
1
3
9
9
rn
rs
rs
8
8
0
0
0
rd
F
F
6
7
3
5
rn 0
0
6
7
3
5
rn 0
0
abs
abs
IMM
abs
abs
IMM
abs
abs
IMM
Cannot be used in the chip
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1010 of 1268
REJ09B0220-0600
EXTS.W Rd
EXTS.L ERd
EXTU.W Rd
EXTU.L ERd
INC.B Rd
INC.W #1,Rd
INC.W #2,Rd
INC.L #1,ERd
INC.L #2,ERd
JMP @ERn
JMP @aa:24
JMP @@aa:8
JSR @ERn
JSR @aa:24
JSR @@aa:8
LDC #xx:8,CCR
LDC #xx:8,EXR
LDC Rs,CCR
LDC Rs,EXR
LDC @ERs,CCR
LDC @ERs,EXR
LDC @(d:16,ERs),CCR
LDC @(d:16,ERs),EXR
LDC @(d:32,ERs),CCR
LDC @(d:32,ERs),EXR
LDC @ERs+,CCR
LDC @ERs+,EXR
LDC @aa:16,CCR
LDC @aa:16,EXR
Mnemonic Size Instruction Format
1st byte 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte 10th byte
Instruc-
tion
EXTS
EXTU
INC
JMP
JSR
LDC
W
L
W
L
B
W
W
L
L
—
—
—
—
—
—
B
B
B
B
W
W
W
W
W
W
W
W
W
W
0
0
ern
ern
0
0
0
0
erd
erd
erd
erd
ers
ers
ers
ers
ers
ers
ers
ers
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
0
5
5
5
5
5
5
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7
7
7
7
A
B
B
B
B
9
A
B
D
E
F
7
1
3
3
1
1
1
1
1
1
1
1
1
1
D
F
5
7
0
5
D
7
F
4
0
1
4
4
4
4
4
4
4
4
4
4
rd
rd
rd
rd
rd
0
0
1
rs
rs
0
1
0
1
0
1
0
1
0
1
0
6
6
6
6
7
7
6
6
6
6
7
9
9
F
F
8
8
D
D
B
B
0
0
0
0
0
0
0
0
0
0
0
0
6
6
B
B
2
2
0
0
abs
abs
abs
abs
IMM
IMM
disp
disp
abs
abs
disp
disp
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1011 of 1268
REJ09B0220-0600
0
0
rd
abs
rs
rd
LDC @aa:32,CCR
LDC @aa:32,EXR
LDM.L @SP+, (ERn-ERn+1)
LDM.L @SP+, (ERn-ERn+2)
LDM.L @SP+, (ERn-ERn+3)
LDMAC ERs,MACH
LDMAC ERs,MACL
MAC @ERn+,@ERm+
MOV.B #xx:8,Rd
MOV.B Rs,Rd
MOV.B @ERs,Rd
MOV.B @(d:16,ERs),Rd
MOV.B @(d:32,ERs),Rd
MOV.B @ERs+,Rd
MOV.B @aa:8,Rd
MOV.B @aa:16,Rd
MOV.B @aa:32,Rd
MOV.B Rs,@ERd
MOV.B Rs,@(d:16,ERd)
MOV.B Rs,@(d:32,ERd)
MOV.B Rs,@-ERd
MOV.B Rs,@aa:8
MOV.B Rs,@aa :16
MOV.B Rs,@aa:32
MOV.W #xx:16,Rd
MOV.W Rs,Rd
MOV.W @ERs,Rd
MOV.W @(d:16,ERs),Rd
MOV.W @(d:32,ERs),Rd
Mnemonic Size Instruction Format
1st byte 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte 10th byte
Instruc-
tion
LDC
LDM
LDMAC
MAC
MOV
W
W
L
L
L
L
L
—
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
W
W
W
W
W
0
0
0
0
1
1
0
1
0
0
0
ers
ers
ers
ers
erd
erd
erd
erd
ers
ers
ers
0
0
0
ern+1
ern+2
ern+3
0
0
0
0
0
F
0
6
6
7
6
2
6
6
6
6
7
6
3
6
6
7
0
6
6
7
1
1
1
1
1
rd
C
8
E
8
C
rd
A
A
8
E
8
C
rs
A
A
9
D
9
F
8
4
4
1
2
3
rs
0
2
8
A
0
rs
0
1
0
0
0
rd
rd
rd
0
rd
rd
rd
rs
rs
0
rs
rs
rs
rd
rd
rd
rd
0
6
6
6
6
6
6
6
6
B
B
D
D
D
A
A
B
2
2
7
7
7
2
A
2
IMM
abs
abs
disp
abs
disp
abs
IMM
disp
abs
abs
abs
abs
disp
disp
disp
Cannot be used in the chip
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1012 of 1268
REJ09B0220-0600
MOV.W @ERs+,Rd
MOV.W @aa:16,Rd
MOV.W @aa:32,Rd
MOV.W Rs,@ERd
MOV.W Rs,@(d:16,ERd)
MOV.W Rs,@(d:32,ERd)
MOV.W Rs,@-ERd
MOV.W Rs,@aa:16
MOV.W Rs,@aa:32
MOV.L #xx:32,Rd
MOV.L ERs,ERd
MOV.L @ERs,ERd
MOV.L @(d:16,ERs),ERd
MOV.L @(d:32,ERs),ERd
MOV.L @ERs+,ERd
MOV.L @aa:16 ,ERd
MOV.L @aa:32 ,ERd
MOV.L ERs,@ERd
MOV.L ERs,@(d:16,ERd)
MOV.L ERs,@(d:32,ERd)*1
MOV.L ERs,@-ERd
MOV.L ERs,@aa:16
MOV.L ERs,@aa:32
MOVFPE @aa:16,Rd
MOVTPE Rs,@aa:16
MULXS.B Rs,Rd
MULXS.W Rs,ERd
MULXU.B Rs,Rd
MULXU.W Rs,ERd
Mnemonic Size Instruction Format
1st byte 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte 10th byte
Instruc-
tion
MOV
MOVFPE
MOVTPE
MULXS
MULXU
W
W
W
W
W
W
W
W
W
L
L
L
L
L
L
L
L
L
L
L
L
L
L
B
B
B
W
B
W
0
1
1
0
1
1
ers
erd
erd
erd
erd
ers
0
0
0
erd
erd
erd
ers
ers
ers
ers
erd
erd
erd
erd
0
0
0
0
0
0
0
0
0
0
0
erd
erd
erd
erd
erd
ers
ers
ers
ers
ers
erd
0
0
erd
ers
0
0
0
0
1
1
0
1
6
6
6
6
6
7
6
6
6
7
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
5
5
D
B
B
9
F
8
D
B
B
A
F
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
2
0
2
8
A
0
0
0
0
0
0
0
0
0
0
0
0
0
C
C
rs
rs
rd
rd
rd
rs
rs
0
rs
rs
rs
0
0
0
0
0
0
0
0
0
0
0
0
0
0
rd
6
6
6
7
6
6
6
6
6
7
6
6
6
5
5
B
9
F
8
D
B
B
9
F
8
D
B
B
0
2
A
0
2
8
A
rs
rs
rs
0
0
rd
6
6
B
B
2
A
abs
disp
abs
abs
abs
IMM
disp
abs
disp
abs
disp
abs
abs
Cannot be used in the chip
disp
disp
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1013 of 1268
REJ09B0220-0600
NEG.B Rd
NEG.W Rd
NEG.L ERd
NOP
NOT.B Rd
NOT.W Rd
NOT.L ERd
OR.B #xx:8,Rd
OR.B Rs,Rd
OR.W #xx:16,Rd
OR.W Rs,Rd
OR.L #xx:32,ERd
OR.L ERs,ERd
ORC #xx:8,CCR
ORC #xx:8,EXR
POP.W Rn
POP.L ERn
PUSH.W Rn
PUSH.L ERn
ROTL.B Rd
ROTL.B #2, Rd
ROTL.W Rd
ROTL.W #2, Rd
ROTL.L ERd
ROTL.L #2, ERd
Mnemonic Size Instruction Format
1st byte 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte 10th byte
Instruc-
tion
NEG
NOP
NOT
OR
ORC
POP
PUSH
ROTL
B
W
L
—
B
W
L
B
B
W
W
L
L
B
B
W
L
W
L
B
B
W
W
L
L
0
0
0
0
0
erd
erd
erd
erd
erd
1
1
1
0
1
1
1
C
1
7
6
7
0
0
0
6
0
6
0
1
1
1
1
1
1
7
7
7
0
7
7
7
rd
4
9
4
A
1
4
1
D
1
D
1
2
2
2
2
2
2
8
9
B
0
0
1
3
rs
4
rs
4
F
4
7
0
F
0
8
C
9
D
B
F
rd
rd
0
rd
rd
rd
rd
rd
0
1
rn
0
rn
0
rd
rd
rd
rd
IMM
IMM
6
0
6
6
4
4
D
D
ers 0
0
0
erd
ern
ern
0
7
F
IMM
IMM
IMM
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1014 of 1268
REJ09B0220-0600
ROTR.B Rd
ROTR.B #2, Rd
ROTR.W Rd
ROTR.W #2, Rd
ROTR.L ERd
ROTR.L #2, ERd
ROTXL.B Rd
ROTXL.B #2, Rd
ROTXL.W Rd
ROTXL.W #2, Rd
ROTXL.L ERd
ROTXL.L #2, ERd
ROTXR.B Rd
ROTXR.B #2, Rd
ROTXR.W Rd
ROTXR.W #2, Rd
ROTXR.L ERd
ROTXR.L #2, ERd
RTE
RTS
SHAL.B Rd
SHAL.B #2, Rd
SHAL.W Rd
SHAL.W #2, Rd
SHAL.L ERd
SHAL.L #2, ERd
Mnemonic Size Instruction Format
1st byte 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte 10th byte
Instruc-
tion
ROTR
ROTXL
ROTXR
RTE
RTS
SHAL
B
B
W
W
L
L
B
B
W
W
L
L
B
B
W
W
L
L
—
—
B
B
W
W
L
L
0
0
0
0
0
0
0
0
erd
erd
erd
erd
erd
erd
erd
erd
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
5
5
1
1
1
1
1
1
3
3
3
3
3
3
2
2
2
2
2
2
3
3
3
3
3
3
6
4
0
0
0
0
0
0
8
C
9
D
B
F
0
4
1
5
3
7
0
4
1
5
3
7
7
7
8
C
9
D
B
F
rd
rd
rd
rd
rd
rd
rd
rd
rd
rd
rd
rd
0
0
rd
rd
rd
rd
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1015 of 1268
REJ09B0220-0600
SHAR.B Rd
SHAR.B #2, Rd
SHAR.W Rd
SHAR.W #2, Rd
SHAR.L ERd
SHAR.L #2, ERd
SHLL.B Rd
SHLL.B #2, Rd
SHLL.W Rd
SHLL.W #2, Rd
SHLL.L ERd
SHLL.L #2, ERd
SHLR.B Rd
SHLR.B #2, Rd
SHLR.W Rd
SHLR.W #2, Rd
SHLR.L ERd
SHLR.L #2, ERd
SLEEP
STC.B CCR,Rd
STC.B EXR,Rd
STC.W CCR,@ERd
STC.W EXR,@ERd
STC.W CCR,@(d:16,ERd)
STC.W EXR,@(d:16,ERd)
STC.W CCR,@(d:32,ERd)
STC.W EXR,@(d:32,ERd)
STC.W CCR,@-ERd
STC.W EXR,@-ERd
Mnemonic Size Instruction Format
1st byte 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte 10th byte
Instruc-
tion
SHAR
SHLL
SHLR
SLEEP
STC
B
B
W
W
L
L
B
B
W
W
L
L
B
B
W
W
L
L
—
B
B
W
W
W
W
W
W
W
W
0
0
0
0
0
0
erd
erd
erd
erd
erd
erd
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
1
1
1
1
1
1
1
2
2
1
1
1
1
1
1
1
1
8
C
9
D
B
F
0
4
1
5
3
7
0
4
1
5
3
7
8
0
1
4
4
4
4
4
4
4
4
rd
rd
rd
rd
rd
rd
rd
rd
rd
rd
rd
rd
0
rd
rd
0
1
0
1
0
1
0
1
erd
erd
erd
erd
erd
erd
erd
erd
1
1
1
1
0
0
1
1
6
6
6
6
7
7
6
6
9
9
F
F
8
8
D
D
0
0
0
0
0
0
0
0
6
6
B
B
A
A
0
0
disp
disp
disp
disp
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1016 of 1268
REJ09B0220-0600
STC.W CCR,@aa:16
STC.W EXR,@aa:16
STC.W CCR,@aa:32
STC.W EXR,@aa:32
STM.L(ERn-ERn+1), @-SP
STM.L (ERn-ERn+2), @-SP
STM.L (ERn-ERn+3), @-SP
STMAC MACH,ERd
STMAC MACL,ERd
SUB.B Rs,Rd
SUB.W #xx:16,Rd
SUB.W Rs,Rd
SUB.L #xx:32,ERd
SUB.L ERs,ERd
SUBS #1,ERd
SUBS #2,ERd
SUBS #4,ERd
SUBX #xx:8,Rd
SUBX Rs,Rd
TAS @ERd
*2
TRAPA #x:2
XOR.B #xx:8,Rd
XOR.B Rs,Rd
XOR.W #xx:16,Rd
XOR.W Rs,Rd
XOR.L #xx:32,ERd
XOR.L ERs,ERd
Mnemonic Size Instruction Format
1st byte 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte 10th byte
Instruc-
tion
STC
STM
STMAC
SUB
SUBS
SUBX
TAS
TRAPA
XOR
W
W
W
W
L
L
L
L
L
B
W
W
L
L
L
L
L
B
B
B
—
B
B
W
W
L
L
1
00
ers
IMM
0
0
0
0
0
0
erd
erd
erd
erd
erd
erd
erd
ers
0
0
0
0
ern
ern
ern
erd
0
0
0
0
0
0
0
0
0
1
7
1
7
1
1
1
1
B
1
0
5
D
1
7
6
7
0
1
1
1
1
1
1
1
8
9
9
A
A
B
B
B
rd
E
1
7
rd
5
9
5
A
1
4
4
4
4
1
2
3
rs
3
rs
3
0
8
9
rs
E
rs
5
rs
5
F
0
1
0
1
0
0
0
rd
rd
rd
rd
0
0
rd
rd
rd
0
6
6
6
6
6
6
6
7
6
B
B
B
B
D
D
D
B
5
8
8
A
A
F
F
F
0
0
0
0
C
abs
abs
abs
abs
IMM
IMM
IMM
IMM
IMM
IMM
Cannot be used in the chip
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1017 of 1268
REJ09B0220-0600
XORC #xx:8,CCR
XORC #xx:8,EXR
Mnemonic Size Instruction Format
1st byte 2nd byte 3rd byte 4th byte 5th byte 6th byte 7th byte 8th byte 9th byte 10th byte
Instruc-
tion
XORC B
B
0
0
5
1
4
1 0 5
IMM
IMM
Notes: 1. Bit 7 of the 4th byte of the MOV.L ERs, @(d:32,ERd) instruction can be either 1 or 0.
2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
Legend:
Address Register
32-Bit Register
Register
Field General
Register Register
Field General
Register Register
Field General
Register
000
001
•
•
•
111
ER0
ER1
•
•
•
ER7
0000
0001
•
•
•
0111
1000
1001
•
•
•
1111
R0
R1
•
•
•
R7
E0
E1
•
•
•
E7
0000
0001
•
•
•
0111
1000
1001
•
•
•
1111
R0H
R1H
•
•
•
R7H
R0L
R1L
•
•
•
R7L
16-Bit Register 8-Bit Register
IMM:
abs:
disp:
rs, rd, rn:
ers, erd, ern, erm:
The register fields specify general registers as follows.
Immediate data (2, 3, 8, 16, or 32 bits)
Absolute address (8, 16, 24, or 32 bits)
Displacement (8, 16, or 32 bits)
Register field (4 bits specifying an 8-bit or 16-bit register. The symbols rs, rd, and rn correspond to operand symbols Rs, Rd,and Rn.)
Register field (3 bits specifying an address register or 32-bit register. The symbols ers, erd, ern, and erm correspond to operand
symbols ERs, ERd, ERn, and ERm.)
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1018 of 1268
REJ09B0220-0600
A.3 Operation Code Map
Table A.3 shows the operation code map.
Table A.3 Operation Code Map (1)
Instruction code 1st byte 2nd byte
AH AL BH BL
Instruction when most significant bit of BH is 0.
Instruction when most significant bit of BH is 1.
0
NOP
BRA
MULXU
BSET
AH
Note: * Cannot be used in the chip.
AL
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
1
BRN
DIVXU
BNOT
2
BHI
MULXU
BCLR
3
BLS
DIVXU
BTST
STC
STMAC
LDC
LDMAC
4
ORC
OR
BCC
RTS
OR
BORBIOR
6
ANDC
AND
BNE
RTE
AND
5
XORC
XOR
BCS
BSR
XOR
BXOR
BIXOR
BAND
BIAND
7
LDC
BEQ
TRAPA
BST BIST
BLD BILD
8
BVC
MOV
9
BVS
A
BPL
JMP
B
BMI
EEPMOV
C
BGE
BSR
D
BLT
MOV
E
ADDX
SUBX
BGT
JSR
F
BLE
MOV.B
ADD
ADDX
CMP
SUBX
OR
XOR
AND
MOV
ADD
SUB
MOV
MOV
CMP
Table
A.3(2)
Table
A.3(2)
Table
A.3(2) Table
A.3(2) Table
A.3(2) Table
A.3(2) Table
A.3(2)
Table
A.3(2) Table
A.3(2)
Table
A.3(2) Table
A.3(2)
Table
A.3(2)
Table
A.3(2)
Table
A.3(2)
Table
A.3(2)
Table
A.3(2)
Table A.3(3)
**
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1019 of 1268
REJ09B0220-0600
Table A.3 Operation Code Map (2)
Instruction code 1st byte 2nd byte
AH AL BH BL
01
0A
0B
0F
10
11
12
13
17
1A
1B
1F
58
6A
79
7A
0
MOV
INC
ADDS
DAA
DEC
SUBS
DAS
BRA
MOV
MOV
MOV
SHLL
SHLR
ROTXL
ROTXR
NOT
1
LDM
BRN
ADD
ADD
2
BHI
MOV
CMP
CMP
3
STM
NOT
BLS
SUB
SUB
4
SHLL
SHLR
ROTXL
ROTXR
BCC
MOVFPE
*
OR
OR
5
INC
EXTU
DEC
BCS
XOR
XOR
6
MAC
BNE
AND
AND
7
INC
SHLL
SHLR
ROTXL
ROTXR
EXTU
DEC
BEQ
LDCSTC
8
SLEEP
BVC
MOV
ADDS
SHAL
SHAR
ROTL
ROTR
NEG
SUBS
9
BVS
A
CLRMAC
BPL
MOV
B
NEG
BMI
ADD
MOV
SUB
CMP
C
SHAL
SHAR
ROTL
ROTR
BGE
MOVTPE
*
D
INC
EXTS
DEC
BLT
E
TAS
BGT
F
INC
SHAL
SHAR
ROTL
ROTR
EXTS
DEC
BLE
BH
AH AL
Table
A.3(3) Table
A.3(3) Table
A.3(3)
Table
A.3(4) Table
A.3(4)
**
Note: * Cannot be used in the chip.
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1020 of 1268
REJ09B0220-0600
Table A.3 Operation Code Map (3)
Instruction code 1st byte 2nd byte
AH AL BH BL
3rd byte 4th byte
CH CL DH DL
r is the register specification field.
aa is the absolute address specification.
Instruction when most significant bit of DH is 0.
Instruction when most significant bit of DH is 1.
Notes:
AH AL BH BL CH
CL
01C05
01D05
01F06
7Cr06
*1
7Cr07
*1
7Dr06
*1
7Dr07
*1
7Eaa6
*2
7Eaa7
*2
7Faa6
*2
7Faa7
*2
0
MULXS
BSET
BSET
BSET
BSET
1
DIVXS
BNOT
BNOT
BNOT
BNOT
2
MULXS
BCLR
BCLR
BCLR
BCLR
3
DIVXS
BTST
BTST
BTST
BTST
4
OR
5
XOR
6
AND
789ABCDEF
1.
2.
BOR
BIOR
BXOR
BIXOR BAND
BIAND
BLDBILD
BSTBIST
BOR
BIOR
BXOR
BIXOR BAND
BIAND
BLDBILD
BSTBIST
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1021 of 1268
REJ09B0220-0600
Table A.3 Operation Code Map (4)
Instruction code 1st byte 2nd byte
AH AL BH BL
3rd byte 4th byte
CH CL DH DL
Instruction when most significant bit of FH is 0.
Instruction when most significant bit of FH is 1.
5th byte 6th byte
EH EL FH FL
Instruction code 1st byte 2nd byte
AH AL BH BL
3rd byte 4th byte
CH CL DH DL
Instruction when most significant bit of HH is 0.
Instruction when most significant bit of HH is 1.
Note: * aa is the absolute address specification.
5th byte 6th byte
EH EL FH FL
7th byte 8th byte
GH GL HH HL
6A10aaaa6*
6A10aaaa7*
6A18aaaa6*
6A18aaaa7*
AHALBHBLCHCLDHDLEH
EL 0
BSET
1
BNOT
2
BCLR
3
BTST BOR
BIOR
BXOR
BIXORBAND
BIAND
BLDBILD
BSTBIST
456789ABCDEF
6A30aaaaaaaa6
*
6A30aaaaaaaa7
*
6A38aaaaaaaa6
*
6A38aaaaaaaa7
*
AHALBHBL ... FHFLGH
GL 0
BSET
1
BNOT
2
BCLR
3
BTST BOR
BIOR
BXOR
BIXORBAND
BIAND
BLDBILD
BSTBIST
456789ABCDEF
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1022 of 1268
REJ09B0220-0600
A.4 Number of States Required for Instruction Execution
The tables in this section can be used to calculate the number of states required for instructio n
execution by the CPU. Table A.5 indicates the number of instruction fetch, data read/write, and
other cycles occurring in each instruction. Table A.4 indicates the number of states required for
each cycle. The number of states required for execution of an instruction can be calculated from
these two tables as follows:
Execution states = I × SI + J × SJ + K × SK + L × SL + M × SM + N × SN
Examples: Advanced mode, program code and stack located in external memory, on-chip
supporting modules accessed in two states with 8-bit bus width, external devices accessed in three
states with one wait state and 16-bit bus width.
1. BSET #0, @FFFFC7:8
From table A.5:
I = L = 2, J = K = M = N = 0
From table A.4:
SI = 4, SL = 2
Number of states required for execution = 2 × 4 + 2 × 2 = 12
2. JSR @@30
From table A.5:
I = J = K = 2, L = M = N = 0
From table A.4:
SI = SJ = SK = 4
Number of states required for execution = 2 × 4 + 2 × 4 + 2 × 4 = 24
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1023 of 1268
REJ09B0220-0600
Table A.4 Number of States per Cycle
Access Conditions
External Device
On-Chip Supporting
Module 8-Bit Bus 16-Bit Bus
Cycle On-Chip
Memory 8-Bit
Bus 16-Bit
Bus 2-State
Access 3-State
Access 2-State
Access 3-State
Access
Instruction fetch SI 1 4 2 4 6 + 2m 2 3 + m
Branch address read SJ
Stack operation SK
Byte data access SL 2 2 3 + m
Word data access SM 4 4 6 + 2m
Internal operation SN 1 1 1 1 1 1 1
Legend:
m: Number of wait states inserted into external device access
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1024 of 1268
REJ09B0220-0600
Table A.5 Number of Cycles in Instruction Execution
Instruction
Fetch
Branch
A ddress
Read
Stack
Operation
Byte
Data
Access
Word
Data
Access
Internal
Operation
Instruction Mnemonic I J K L M N
ADD ADD.B #xx:8,Rd 1
ADD.B Rs,Rd 1
ADD.W #xx:16,Rd 2
ADD.W Rs,Rd 1
ADD.L #xx:32,ERd 3
ADD.L ERs,ERd 1
ADDS ADDS #1/2/4,ERd 1
ADDX ADDX #xx:8,Rd 1
ADDX Rs,Rd 1
AND AND.B #xx:8,Rd 1
AND.B Rs,Rd 1
AND.W #xx:16,Rd 2
AND.W Rs,Rd 1
AND.L #xx:32,ERd 3
AND.L ERs,ERd 2
ANDC ANDC #xx:8,CCR 1
ANDC #xx:8,EXR 2
BAND BAND #xx:3,Rd 1
BAND #xx:3,@ERd 2 1
BAND #xx:3,@aa:8 2 1
BAND #xx:3,@aa:16 3 1
BAND #xx:3,@aa:32 4 1
Bcc BRA d:8 (BT d:8) 2
BRN d:8 (BF d:8) 2
BHI d:8 2
BLS d:8 2
BCC d:8 (BHS d:8) 2
BCS d:8 (BLO d:8) 2
BNE d:8 2
BEQ d:8 2
BVC d:8 2
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1025 of 1268
REJ09B0220-0600
Instruction
Fetch
Branch
A ddress
Read
Stack
Operation
Byte
Data
Access
Word
Data
Access
Internal
Operation
Instruction Mnemonic I J K L M N
Bcc BVS d:8 2
BPL d:8 2
BMI d:8 2
BGE d:8 2
BLT d:8 2
BGT d:8 2
BLE d:8 2
BRA d:16 (BT d:16) 2 1
BRN d:16 (BF d:16) 2 1
BHI d:16 2 1
BLS d:16 2 1
BCC d:16 (BHS d:16) 2 1
BCS d:16 (BLO d:16) 2 1
BNE d:16 2 1
BEQ d:16 2 1
BVC d:16 2 1
BVS d:16 2 1
BPL d:16 2 1
BMI d:16 2 1
BGE d:16 2 1
BLT d:16 2 1
BGT d:16 2 1
BLE d:16 2 1
BCLR BCLR #xx:3,Rd 1
BCLR #xx:3,@ERd 2 2
BCLR #xx:3,@aa:8 2 2
BCLR #xx:3,@aa:16 3 2
BCLR #xx:3,@aa:32 4 2
BCLR Rn,Rd 1
BCLR Rn,@ERd 2 2
BCLR Rn,@aa:8 2 2
BCLR Rn,@aa:16 3 2
BCLR Rn,@aa:32 4 2
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1026 of 1268
REJ09B0220-0600
Instruction
Fetch
Branch
A ddress
Read
Stack
Operation
Byte
Data
Access
Word
Data
Access
Internal
Operation
Instruction Mnemonic I J K L M N
BIAND BIAND #xx:3,Rd 1
BIAND #xx:3,@ERd 2 1
BIAND #xx:3,@aa:8 2 1
BIAND #xx:3,@aa:16 3 1
BIAND #xx:3,@aa:32 4 1
BILD BILD #xx:3,Rd 1
BILD #xx:3,@ERd 2 1
BILD #xx:3,@aa:8 2 1
BILD #xx:3,@aa:16 3 1
BILD #xx:3,@aa:32 4 1
BIOR BIOR #xx:8,Rd 1
BIOR #xx:8,@ERd 2 1
BIOR #xx:8,@aa:8 2 1
BIOR #xx:8,@aa:16 3 1
BIOR #xx:8,@aa:32 4 1
BIST BIST #xx:3,Rd 1
BIST #xx:3,@ERd 2 2
BIST #xx:3,@aa:8 2 2
BIST #xx:3,@aa:16 3 2
BIST #xx:3,@aa:32 4 2
BIXOR BIXOR #xx:3,Rd 1
BIXOR #xx:3,@ERd 2 1
BIXOR #xx:3,@aa:8 2 1
BIXOR #xx:3,@aa:16 3 1
BIXOR #xx:3,@aa:32 4 1
BLD BLD #xx:3,Rd 1
BLD #xx:3,@ERd 2 1
BLD #xx:3,@aa:8 2 1
BLD #xx:3,@aa:16 3 1
BLD #xx:3,@aa:32 4 1
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1027 of 1268
REJ09B0220-0600
Instruction
Fetch
Branch
A ddress
Read
Stack
Operation
Byte
Data
Access
Word
Data
Access
Internal
Operation
Instruction Mnemonic I J K L M N
BNOT BNOT #xx:3,Rd 1
BNOT #xx:3,@ERd 2 2
BNOT #xx:3,@aa:8 2 2
BNOT #xx:3,@aa:16 3 2
BNOT #xx:3,@aa:32 4 2
BNOT Rn,Rd 1
BNOT Rn,@ERd 2 2
BNOT Rn,@aa:8 2 2
BNOT Rn,@aa:16 3 2
BNOT Rn,@aa:32 4 2
BOR BOR #xx:3,Rd 1
BOR #xx:3,@ERd 2 1
BOR #xx:3,@aa:8 2 1
BOR #xx:3,@aa:16 3 1
BOR #xx:3,@aa:32 4 1
BSET BSET #xx:3,Rd 1
BSET #xx:3,@ERd 2 2
BSET #xx:3,@aa:8 2 2
BSET #xx:3,@aa:16 3 2
BSET #xx:3,@aa:32 4 2
BSET Rn,Rd 1
BSET Rn,@ERd 2 2
BSET Rn,@aa:8 2 2
BSET Rn,@aa:16 3 2
BSET Rn,@aa:32 4 2
BSR BSR d:8 Advanced 2 2
BSR d:16 Advanced 2 2 1
BST BST #xx:3,Rd 1
BST #xx:3,@ERd 2 2
BST #xx:3,@aa:8 2 2
BST #xx:3,@aa:16 3 2
BST #xx:3,@aa:32 4 2
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1028 of 1268
REJ09B0220-0600
Instruction
Fetch
Branch
A ddress
Read
Stack
Operation
Byte
Data
Access
Word
Data
Access
Internal
Operation
Instruction Mnemonic I J K L M N
BTST BTST #xx:3,Rd 1
BTST #xx:3,@ERd 2 1
BTST #xx:3,@aa:8 2 1
BTST #xx:3,@aa:16 3 1
BTST #xx:3,@aa:32 4 1
BTST Rn,Rd 1
BTST Rn,@ERd 2 1
BTST Rn,@aa:8 2 1
BTST Rn,@aa:16 3 1
BTST Rn,@aa:32 4 1
BXOR BXOR #xx:3,Rd 1
BXOR #xx:3,@ERd 2 1
BXOR #xx:3,@aa:8 2 1
BXOR #xx:3,@aa:16 3 1
BXOR #xx:3,@aa:32 4 1
CLRMAC CLRMAC Cannot be used in the chip
CMP CMP.B #xx:8,Rd 1
CMP.B Rs,Rd 1
CMP.W #xx:16,Rd 2
CMP.W Rs,Rd 1
CMP.L #xx:32,ERd 3
CMP.L ERs,ERd 1
DAA DAA Rd 1
DAS DAS Rd 1
DEC DEC.B Rd 1
DEC.W #1/2,Rd 1
DEC.L #1/2,ERd 1
DIVXS DIVXS.B Rs,Rd 2 11
DIVXS.W Rs,ERd 2 19
DIVXU DIVXU.B Rs,Rd 1 11
DIVXU.W Rs,ERd 1 19
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1029 of 1268
REJ09B0220-0600
Instruction
Fetch
Branch
A ddress
Read
Stack
Operation
Byte
Data
Access
Word
Data
Access
Internal
Operation
Instruction Mnemonic I J K L M N
EEPMOV EEPMOV.B 2 2n+2*2
EEPMOV.W 2 2n+2*2
EXTS EXTS.W Rd 1
EXTS.L ERd 1
EXTU EXTU.W Rd 1
EXTU.L ERd 1
INC INC.B Rd 1
INC.W #1/2,Rd 1
INC.L #1/2,ERd 1
JMP JMP @ERn 2
JMP @aa:24 2 1
JMP @@aa:8 Advanced 2 2 1
JSR JSR @ERn Advanced 2 2
JSR @aa:24 Advanced 2 2 1
JSR @@aa:8 Advanced 2 2 2
LDC LDC #xx:8,CCR 1
LDC #xx:8,EXR 2
LDC Rs,CCR 1
LDC Rs,EXR 1
LDC @ERs,CCR 2 1
LDC @ERs,EXR 2 1
LDC @(d:16,ERs),CCR 3 1
LDC @(d:16,ERs),EXR 3 1
LDC @(d:32,ERs),CCR 5 1
LDC @(d:32,ERs),EXR 5 1
LDC @ERs+,CCR 2 1 1
LDC @ERs+,EXR 2 1 1
LDC @aa:16,CCR 3 1
LDC @aa:16,EXR 3 1
LDC @aa:32,CCR 4 1
LDC @aa:32,EXR 4 1
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1030 of 1268
REJ09B0220-0600
Instruction
Fetch
Branch
A ddress
Read
Stack
Operation
Byte
Data
Access
Word
Data
Access
Internal
Operation
Instruction Mnemonic I J K L M N
LDM LDM.L @SP+,
(ERn-ERn+1) 2 4 1
LDM.L @SP+,
(ERn-ERn+2) 2 6 1
LDM.L @SP+,
(ERn-ERn+3) 2 8 1
LDMAC LDMAC ERs,MACH Cannot be used in the chip
LDMAC ERs,MACL
MAC MAC @E Rn+,@ERm+ Cannot be used in the chip
MOV MOV.B #xx:8,Rd 1
MOV.B Rs,Rd 1
MOV.B @ERs,Rd 1 1
MOV.B @(d:16,ERs),Rd 2 1
MOV.B @(d:32,ERs),Rd 4 1
MOV.B @ERs+,Rd 1 1 1
MOV.B @aa:8,Rd 1 1
MOV.B @aa:16,Rd 2 1
MOV.B @aa:32,Rd 3 1
MOV.B Rs,@ERd 1 1
MOV.B Rs,@(d:16,ERd) 2 1
MOV.B Rs,@(d:32,ERd) 4 1
MOV.B Rs,@-ERd 1 1 1
MOV.B Rs,@aa:8 1 1
MOV.B Rs,@aa:16 2 1
MOV.B Rs,@aa:32 3 1
MOV.W #xx:16,Rd 2
MOV.W Rs,Rd 1
MOV.W @ERs,Rd 1 1
MOV.W @(d:16,ERs),Rd 2 1
MOV.W @(d:32,ERs),Rd 4 1
MOV.W @ERs+,Rd 1 1 1
MOV.W @aa:16,Rd 2 1
MOV.W @aa:32,Rd 3 1
MOV.W Rs,@ERd 1 1
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1031 of 1268
REJ09B0220-0600
Instruction
Fetch
Branch
A ddress
Read
Stack
Operation
Byte
Data
Access
Word
Data
Access
Internal
Operation
Instruction Mnemonic I J K L M N
MOV MOV.W Rs,@(d:16,ERd) 2 1
MOV.W Rs,@(d:32,ERd) 4 1
MOV.W Rs,@-ERd 1 1 1
MOV.W Rs,@aa:16 2 1
MOV.W Rs,@aa:32 3 1
MOV.L #xx:32,ERd 3
MOV.L ERs,ERd 1
MOV.L @ERs,ERd 2 2
MOV.L @(d:16,ERs),ERd 3 2
MOV.L @(d:32,ERs),ERd 5 2
MOV.L @ERs+,ERd 2 2 1
MOV.L @aa:16,ERd 3 2
MOV.L @aa:32,ERd 4 2
MOV.L ERs,@ERd 2 2
MOV.L ERs,@(d:16,ERd) 3 2
MOV.L ERs,@(d:32,ERd) 5 2
MOV.L ERs,@-ERd 2 2 1
MOV.L ERs,@aa:16 3 2
MOV.L ERs,@aa:32 4 2
MOVFPE MOVFPE @:aa:16,Rd Can not be used in the chip
MOVTPE MOVTPE Rs,@:aa:16
MULXS MULXS.B Rs,Rd 2 11
MULXS.W Rs,ERd 2 19
MULXU MULXU.B Rs,Rd 1 11
MULXU.W Rs,ERd 1 19
NEG NEG.B Rd 1
NEG.W Rd 1
NEG.L ERd 1
NOP NOP 1
NOT NOT.B Rd 1
NOT.W Rd 1
NOT.L ERd 1
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1032 of 1268
REJ09B0220-0600
Instruction
Fetch
Branch
A ddress
Read
Stack
Operation
Byte
Data
Access
Word
Data
Access
Internal
Operation
Instruction Mnemonic I J K L M N
OR OR.B #xx:8,Rd 1
OR.B Rs,Rd 1
OR.W #xx:16,Rd 2
OR.W Rs,Rd 1
OR.L #xx:32,ERd 3
OR.L ERs,ERd 2
ORC ORC #xx:8,CCR 1
ORC #xx:8,EXR 2
POP POP.W Rn 1 1 1
POP.L ERn 2 2 1
PUSH PUSH.W Rn 1 1 1
PUSH.L ERn 2 2 1
ROTL ROTL.B Rd 1
ROTL.B #2,Rd 1
ROTL.W Rd 1
ROTL.W #2,Rd 1
ROTL.L ERd 1
ROTL.L #2,ERd 1
ROTR ROTR.B Rd 1
ROTR.B #2,Rd 1
ROTR.W Rd 1
ROTR.W #2,Rd 1
ROTR.L ERd 1
ROTR.L #2,ERd 1
ROTXL ROTXL.B Rd 1
ROTXL.B #2,Rd 1
ROTXL.W Rd 1
ROTXL.W #2,Rd 1
ROTXL.L ERd 1
ROTXL.L #2,ERd 1
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1033 of 1268
REJ09B0220-0600
Instruction
Fetch
Branch
A ddress
Read
Stack
Operation
Byte
Data
Access
Word
Data
Access
Internal
Operation
Instruction Mnemonic I J K L M N
ROTXR ROTXR.B Rd 1
ROTXR.B #2,Rd 1
ROTXR.W Rd 1
ROTXR.W #2,Rd 1
ROTXR.L ERd 1
ROTXR.L #2,ERd 1
RTE RTE 2 2/3*1 1
RTS RTS Advanced 2 2 1
SHAL SHAL.B Rd 1
SHAL.B #2,Rd 1
SHAL.W Rd 1
SHAL.W #2,Rd 1
SHAL.L ERd 1
SHAL.L #2,ERd 1
SHAR SHAR.B Rd 1
SHAR.B #2,Rd 1
SHAR.W Rd 1
SHAR.W #2,Rd 1
SHAR.L ERd 1
SHAR.L #2,ERd 1
SHLL SHLL.B Rd 1
SHLL.B #2,Rd 1
SHLL.W Rd 1
SHLL.W #2,Rd 1
SHLL.L ERd 1
SHLL.L #2,ERd 1
SHLR SHLR.B Rd 1
SHLR.B #2,Rd 1
SHLR.W Rd 1
SHLR.W #2,Rd 1
SHLR.L ERd 1
SHLR.L #2,ERd 1
SLEEP SLEEP 1 1
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1034 of 1268
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Instruction
Fetch
Branch
A ddress
Read
Stack
Operation
Byte
Data
Access
Word
Data
Access
Internal
Operation
Instruction Mnemonic I J K L M N
STC STC.B CCR,Rd 1
STC.B EXR,Rd 1
STC.W CCR,@ERd 2 1
STC.W EXR,@ERd 2 1
STC.W CCR,@(d:16,ERd) 3 1
STC.W EXR,@(d:16,ERd) 3 1
STC.W CCR,@(d:32,ERd) 5 1
STC.W EXR,@(d:32,ERd) 5 1
STC.W CCR,@-ERd 2 1 1
STC.W EXR,@-ERd 2 1 1
STC.W CCR,@aa:16 3 1
STC.W EXR,@aa:16 3 1
STC.W CCR,@aa:32 4 1
STC.W EXR,@aa:32 4 1
STM STM.L (ERn-ERn+1),
@-SP 2 4 1
STM.L (ERn-ERn+2),
@-SP 2 6 1
STM.L (ERn-ERn+3),
@-SP 2 8 1
STMAC ST MAC MACH,E Rd Cannot be us ed in the chip
STMAC MACL,ERd
SUB SUB.B Rs,Rd 1
SUB.W #xx:16,Rd 2
SUB.W Rs,Rd 1
SUB.L #xx:32,ERd 3
SUB.L ERs,ERd 1
SUBS SUBS #1/2/4,ERd 1
SUBX SUBX #xx:8,Rd 1
SUBX Rs,Rd 1
TAS TAS @ERd*3 2 2
TRAPA TRAPA #x:2 Advanced 2 2 2/3*1 2
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1035 of 1268
REJ09B0220-0600
Instruction
Fetch
Branch
A ddress
Read
Stack
Operation
Byte
Data
Access
Word
Data
Access
Internal
Operation
Instruction Mnemonic I J K L M N
XOR XOR.B #xx:8,Rd 1
XOR.B Rs,Rd 1
XOR.W #xx:16,Rd 2
XOR.W Rs,Rd 1
XOR.L #xx:32,ERd 3
XOR.L ERs,ERd 2
XORC XORC #xx:8,CCR 1
XORC #xx:8,EXR 2
Notes: 1. 2 when EXR is invalid, 3 when EXR is valid.
2. When n bytes of data are transferred.
3. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1036 of 1268
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A.5 Bus States during Instruction Execution
Table A.6 indicates the types of cycles that occur during instruction execution by the CPU. See
table A.4 for the number of states per cycle.
How to Read the Table:
Instruction
JMP@aa:24 R:W 2nd
Internal operation,
1 state
R:W EA
12345678
End of instruction
Order of execution
Read effective address (word-size read)
No read or write
Read 2nd word of current instruction
(word-size read)
Legend
R:B Byte-size read
R:W Word-size read
W:B Byte-size write
W:W Word-size write
:M Transfer of the bus is not performed immediately after this cycle
2nd Address of 2nd word (3rd and 4th bytes)
3rd Address of 3rd word (5th and 6th bytes)
4th Address of 4th word (7th and 8th bytes)
5th Address of 5th word (9th and 10th bytes)
NEXT Address of next instruction
EA Effective address
VEC Vector address
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1037 of 1268
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Figure A.1 shows timing waveforms for the address bus and the RD, HWR, and LWR signals
during execution of the above instruction with an 8-bit bus, using three-state access with no wait
states.
φ
A
ddress bus
RD
HWR, LWR
R:W 2nd
Fetching
2nd byte of
instruction at
jump address
Fetching
1st byte of
instruction at
jump address
Fetching
4th byte
of instruction
Fetching
3rd byte
of instruction
R:W EA
High
Internal
operation
Figure A.1 Address Bus, RD, HWR, and LWR Timing
(8-Bit Bus, Three-State Access, No Wait States)
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1038 of 1268
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Table A.6 Instruction Execution Cycles
Instruction
ADD.B #xx:8,Rd R:W NEXT
ADD.B Rs,Rd R:W NEXT
ADD.W #xx:16,Rd R:W 2nd R:W NEXT
ADD.W Rs,Rd R:W NEXT
ADD.L #xx:32,ERd R:W 2nd R:W 3rd R:W NEXT
ADD.L ERs,ERd R:W NEXT
ADDS #1/2/4,ERd R:W NEXT
ADDX #xx:8,Rd R:W NEXT
ADDX Rs,Rd R:W NEXT
AND.B #xx:8,Rd R:W NEXT
AND.B Rs,Rd R:W NEXT
AND.W #xx:16,Rd R:W 2nd R:W NEXT
AND.W Rs,Rd R:W NEXT
AND.L #xx:32,ERd R:W 2nd R:W 3rd R:W NEXT
AND.L ERs,ERd R:W 2nd R:W NEXT
ANDC #xx:8,CCR R:W NEXT
ANDC #xx:8,EXR R:W 2nd R:W NEXT
BAND #xx:3,Rd R:W NEXT
BAND #xx:3,@ERd R:W 2nd R:B EA R:W:M NEXT
BAND #xx:3,@aa:8 R:W 2nd R:B EA R:W:M NEXT
BAND #xx:3,@aa:16 R:W 2nd R:W 3rd R:B EA R:W:M NEXT
BAND #xx:3,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B EA R:W:M NEXT
BRA d:8 (BT d:8) R:W NEXT R:W EA
BRN d:8 (BF d:8) R:W NEXT R:W EA
BHI d:8 R:W NEXT R:W EA
BLS d:8 R:W NEXT R:W EA
BCC d:8 (BHS d:8) R:W NEXT R:W EA
BCS d:8 (BLO d:8) R:W NEXT R:W EA
BNE d:8 R:W NEXT R:W EA
BEQ d:8 R:W NEXT R:W EA
BVC d:8 R:W NEXT R:W EA
BVS d:8 R:W NEXT R:W EA
BPL d:8 R:W NEXT R:W EA
BMI d:8 R:W NEXT R:W EA
BGE d:8 R:W NEXT R:W EA
BLT d:8 R:W NEXT R:W EA
BGT d:8 R:W NEXT R:W EA
1 2 3 4 5 6 7 8 9
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1039 of 1268
REJ09B0220-0600
Instruction
BLE d:8 R:W NEXT R:W EA
BRA d:16 (BT d:16) R:W 2nd
Internal operation,
R:W EA
1 state
BRN d:16 (BF d:16) R:W 2nd
Internal operation,
R:W EA
1 state
BHI d:16 R:W 2nd
Internal operation,
R:W EA
1 state
BLS d:16 R:W 2nd
Internal operation,
R:W EA
1 state
BCC d:16 (BHS d:16) R:W 2nd
Internal operation,
R:W EA
1 state
BCS d:16 (BLO d:16) R:W 2nd
Internal operation,
R:W EA
1 state
BNE d:16 R:W 2nd
Internal operation,
R:W EA
1 state
BEQ d:16 R:W 2nd
Internal operation,
R:W EA
1 state
BVC d:16 R:W 2nd
Internal operation,
R:W EA
1 state
BVS d:16 R:W 2nd
Internal operation,
R:W EA
1 state
BPL d:16 R:W 2nd
Internal operation,
R:W EA
1 state
BMI d:16 R:W 2nd
Internal operation,
R:W EA
1 state
BGE d:16 R:W 2nd
Internal operation,
R:W EA
1 state
BLT d:16 R:W 2nd
Internal operation,
R:W EA
1 state
BGT d:16 R:W 2nd
Internal operation,
R:W EA
1 state
BLE d:16 R:W 2nd
Internal operation,
R:W EA
1 state
BCLR #xx:3,Rd R:W NEXT
BCLR #xx:3,@ERd R:W 2nd R:B:M EA R:W:M NEXT W:B EA
BCLR #xx:3,@aa:8 R:W 2nd R:B:M EA R:W:M NEXT W:B EA
BCLR #xx:3,@aa:16 R:W 2nd R:W 3rd R:B:M EA R:W:M NEXT W:B EA
1 2 3 4 5 6 7 8 9
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1040 of 1268
REJ09B0220-0600
Instruction
BCLR #xx:3,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B:M EA R:W:M NEXT W:B EA
BCLR Rn,Rd R:W NEXT
BCLR Rn,@ERd R:W 2nd R:B:M EA R:W:M NEXT W:B EA
BCLR Rn,@aa:8 R:W 2nd R:B:M EA R:W:M NEXT W:B EA
BCLR Rn,@aa:16 R:W 2nd R:W 3rd R:B:M EA R:W:M NEXT W:B EA
BCLR Rn,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B:M EA R:W:M NEXT W:B EA
BIAND #xx:3,Rd R:W NEXT
BIAND #xx:3,@ERd R:W 2nd R:B EA R:W:M NEXT
BIAND #xx:3,@aa:8 R:W 2nd R:B EA R:W:M NEXT
BIAND #xx:3,@aa:16 R:W 2nd R:W 3rd R:B EA R:W:M NEXT
BIAND #xx:3,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B EA R:W:M NEXT
BILD #xx:3,Rd R:W NEXT
BILD #xx:3,@ERd R:W 2nd R:B EA R:W:M NEXT
BILD #xx:3,@aa:8 R:W 2nd R:B EA R:W:M NEXT
BILD #xx:3,@aa:16 R:W 2nd R:W 3rd R:B EA R:W:M NEXT
BILD #xx:3,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B EA R:W:M NEXT
BIOR #xx:3,Rd R:W NEXT
BIOR #xx:3,@ERd R:W 2nd R:B EA R:W:M NEXT
BIOR #xx:3,@aa:8 R:W 2nd R:B EA R:W:M NEXT
BIOR #xx:3,@aa:16 R:W 2nd R:W 3rd R:B EA R:W:M NEXT
BIOR #xx:3,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B EA R:W:M NEXT
BIST #xx:3,Rd R:W NEXT
BIST #xx:3,@ERd R:W 2nd R:B:M EA R:W:M NEXT W:B EA
BIST #xx:3,@aa:8 R:W 2nd R:B:M EA R:W:M NEXT W:B EA
BIST #xx:3,@aa:16 R:W 2nd R:W 3rd R:B:M EA R:W:M NEXT W:B EA
BIST #xx:3,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B:M EA R:W:M NEXT W:B EA
BIXOR #xx:3,Rd R:W NEXT
BIXOR #xx:3,@ERd R:W 2nd R:B EA R:W:M NEXT
BIXOR #xx:3,@aa:8 R:W 2nd R:B EA R:W:M NEXT
BIXOR #xx:3,@aa:16 R:W 2nd R:W 3rd R:B EA R:W:M NEXT
BIXOR #xx:3,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B EA R:W:M NEXT
BLD #xx:3,Rd R:W NEXT
BLD #xx:3,@ERd R:W 2nd R:B EA R:W:M NEXT
BLD #xx:3,@aa:8 R:W 2nd R:B EA R:W:M NEXT
BLD #xx:3,@aa:16 R:W 2nd R:W 3rd R:B EA R:W:M NEXT
BLD #xx:3,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B EA R:W:M NEXT
BNOT #xx:3,Rd R:W NEXT
1 2 3 4 5 6 7 8 9
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1041 of 1268
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Instruction
BNOT #xx:3,@ERd R:W 2nd R:B:M EA R:W:M NEXT W:B EA
BNOT #xx:3,@aa:8 R:W 2nd R:B:M EA R:W:M NEXT W:B EA
BNOT #xx:3,@aa:16 R:W 2nd R:W 3rd R:B:M EA R:W:M NEXT W:B EA
BNOT #xx:3,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B:M EA R:W:M NEXT W:B EA
BNOT Rn,Rd R:W NEXT
BNOT Rn,@ERd R:W 2nd R:B:M EA R:W:M NEXT W:B EA
BNOT Rn,@aa:8 R:W 2nd R:B:M EA R:W:M NEXT W:B EA
BNOT Rn,@aa:16 R:W 2nd R:W 3rd R:B:M EA R:W:M NEXT W:B EA
BNOT Rn,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B:M EA R:W:M NEXT W:B EA
BOR #xx:3,Rd R:W NEXT
BOR #xx:3,@ERd R:W 2nd R:B EA R:W:M NEXT
BOR #xx:3,@aa:8 R:W 2nd R:B EA R:W:M NEXT
BOR #xx:3,@aa:16 R:W 2nd R:W 3rd R:B EA R:W:M NEXT
BOR #xx:3,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B EA R:W:M NEXT
BSET #xx:3,Rd R:W NEXT
BSET #xx:3,@ERd R:W 2nd R:B:M EA R:W:M NEXT W:B EA
BSET #xx:3,@aa:8 R:W 2nd R:B:M EA R:W:M NEXT W:B EA
BSET #xx:3,@aa:16 R:W 2nd R:W 3rd R:B:M EA R:W:M NEXT W:B EA
BSET #xx:3,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B:M EA R:W:M NEXT W:B EA
BSET Rn,Rd R:W NEXT
BSET Rn,@ERd R:W 2nd R:B:M EA R:W:M NEXT W:B EA
BSET Rn,@aa:8 R:W 2nd R:B:M EA R:W:M NEXT W:B EA
BSET Rn,@aa:16 R:W 2nd R:W 3rd R:B:M EA R:W:M NEXT W:B EA
BSET Rn,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B:M EA R:W:M NEXT W:B EA
BSR d:8 R:W NEXT R:W EA
W:W
:M
stack (H)
W:W stack (L)
BSR d:16 R:W 2nd
Internal operation,
R:W EA
W:W
:M
stack (H)
W:W stack (L)
1 state
BST #xx:3,Rd R:W NEXT
BST #xx:3,@ERd R:W 2nd R:B:M EA R:W:M NEXT W:B EA
BST #xx:3,@aa:8 R:W 2nd R:B:M EA R:W:M NEXT W:B EA
BST #xx:3,@aa:16 R:W 2nd R:W 3rd R:B:M EA R:W:M NEXT W:B EA
BST #xx:3,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B:M EA R:W:M NEXT W:B EA
BTST #xx:3,Rd R:W NEXT
BTST #xx:3,@ERd R:W 2nd R:B EA R:W:M NEXT
1 2 3 4 5 6 7 8 9
Advanced
Advanced
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1042 of 1268
REJ09B0220-0600
Instruction 1 2 3 4 5 6 7 8 9
BTST #xx:3,@aa:8 R:W 2nd R:B EA R:W:M NEXT
BTST #xx:3,@aa:16 R:W 2nd R:W 3rd R:B EA R:W:M NEXT
BTST #xx:3,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B EA R:W:M NEXT
BTST Rn,Rd R:W NEXT
BTST Rn,@ERd R:W 2nd R:B EA R:W:M NEXT
BTST Rn,@aa:8 R:W 2nd R:B EA R:W:M NEXT
BTST Rn,@aa:16 R:W 2nd R:W 3rd R:B EA R:W:M NEXT
BTST Rn,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B EA R:W:M NEXT
BXOR #xx:3,Rd R:W NEXT
BXOR #xx:3,@ERd R:W 2nd R:B EA R:W:M NEXT
BXOR #xx:3,@aa:8 R:W 2nd R:B EA R:W:M NEXT
BXOR #xx:3,@aa:16 R:W 2nd R:W 3rd R:B EA R:W:M NEXT
BXOR #xx:3,@aa:32 R:W 2nd R:W 3rd R:W 4th R:B EA R:W:M NEXT
CLRMAC Cannot be used in the chip
CMP.B #xx:8,Rd R:W NEXT
CMP.B Rs,Rd R:W NEXT
CMP.W #xx:16,Rd R:W 2nd R:W NEXT
CMP.W Rs,Rd R:W NEXT
CMP.L #xx:32,ERd R:W 2nd R:W 3rd R:W NEXT
CMP.L ERs,ERd R:W NEXT
DAA Rd R:W NEXT
DAS Rd R:W NEXT
DEC.B Rd R:W NEXT
DEC.W #1/2,Rd R:W NEXT
DEC.L #1/2,ERd R:W NEXT
DIVXS.B Rs,Rd R:W 2nd R:W NEXT Internal operation, 11 states
DIVXS.W Rs,ERd R:W 2nd R:W NEXT Internal operation, 19 states
DIVXU.B Rs,Rd R:W NEXT Internal operation, 11 states
DIVXU.W Rs,ERd R:W NEXT Internal operation, 19 states
EEPMOV.B R:W 2nd R:B EAs*
1
R:B EAd*
1
R:B EAs*
2
W:B EAd*
2
R:W NEXT
EEPMOV.W R:W 2nd R:B EAs*
1
R:B EAd*
1
R:B EAs*
2
W:B EAd*
2
R:W NEXT
EXTS.W Rd R:W NEXT ← Repeated n times*
2
→
EXTS.L ERd R:W NEXT
EXTU.W Rd R:W NEXT
EXTU.L ERd R:W NEXT
INC.B Rd R:W NEXT
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1043 of 1268
REJ09B0220-0600
Instruction
INC.W #1/2,Rd R:W NEXT
INC.L #1/2,ERd R:W NEXT
JMP @ERn R:W NEXT R:W EA
JMP @aa:24 R:W 2nd
Internal operation,
R:W EA
1 state
JMP @@aa:8
Advanced
R:W NEXT R:W:M aa:8 R:W aa:8
Internal operation,
R:W EA
1 state
JSR @ERn
Advanced
R:W NEXT R:W EA
W:W
:M
stack (H)
W:W stack (L)
JSR @aa:24
Advanced
R:W 2nd
Internal operation,
R:W EA
W:W
:M
stack (H) W:W stack (L)
1 state
JSR @@aa:8
Advanced
R:W NEXT R:W:M aa:8 R:W aa:8
W:W
:M
stack (H)
W:W stack (L)
R:W EA
LDC #xx:8,CCR R:W NEXT
LDC #xx:8,EXR R:W 2nd R:W NEXT
LDC Rs,CCR R:W NEXT
LDC Rs,EXR R:W NEXT
LDC @ERs,CCR R:W 2nd R:W NEXT R:W EA
LDC @ERs,EXR R:W 2nd R:W NEXT R:W EA
LDC @(d:16,ERs),CCR R:W 2nd R:W 3rd R:W NEXT R:W EA
LDC @(d:16,ERs),EXR R:W 2nd R:W 3rd R:W NEXT R:W EA
LDC @(d:32,ERs),CCR R:W 2nd R:W 3rd R:W 4th R:W 5th R:W NEXT R:W EA
LDC @(d:32,ERs),EXR R:W 2nd R:W 3rd R:W 4th R:W 5th R:W NEXT R:W EA
LDC @ERs+,CCR R:W 2nd R:W NEXT
Internal operation,
R:W EA
1 state
LDC @ERs+,EXR R:W 2nd R:W NEXT
Internal operation,
R:W EA
1 state
LDC @aa:16,CCR R:W 2nd R:W 3rd R:W NEXT R:W EA
LDC @aa:16,EXR R:W 2nd R:W 3rd R:W NEXT R:W EA
LDC @aa:32,CCR R:W 2nd R:W 3rd R:W 4th R:W NEXT R:W EA
LDC @aa:32,EXR R:W 2nd R:W 3rd R:W 4th R:W NEXT R:W EA
LDM.L @SP+, R:W 2nd R:W:M NEXT
Internal operation,
R:W:M stack (H)
*
3
R:W stack (L)
*
3
(ERn–ERn+1)
1 state
1 2 3 4 5 6 7 8 9
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1044 of 1268
REJ09B0220-0600
Instruction
LDM.L @SP+,(ERn–ERn+2)
R:W 2nd R:W NEXT
Internal operation,
R:W:M stack (H)
*
3
R:W stack (L)
*
3
1 state
LDM.L @SP+,(ERn–ERn+3)
R:W 2nd R:W NEXT
Internal operation,
R:W:M stack (H)
*
3
R:W stack (L)
*
3
1 state
LDMAC ERs,MACH Cannot be used in the chip
LDMAC ERs,MACL
MAC @ERn+,@ERm+
MOV.B #xx:8,Rd R:W NEXT
MOV.B Rs,Rd R:W NEXT
MOV.B @ERs,Rd R:W NEXT R:B EA
MOV.B @(d:16,ERs),Rd R:W 2nd R:W NEXT R:B EA
MOV.B @(d:32,ERs),Rd R:W 2nd R:W 3rd R:W 4th R:W NEXT R:B EA
MOV.B @ERs+,Rd R:W NEXT
Internal operation,
R:B EA
1 state
MOV.B @aa:8,Rd R:W NEXT R:B EA
MOV.B @aa:16,Rd R:W 2nd R:W NEXT R:B EA
MOV.B @aa:32,Rd R:W 2nd R:W 3rd R:W NEXT R:B EA
MOV.B Rs,@ERd R:W NEXT W:B EA
MOV.B Rs,@(d:16,ERd) R:W 2nd R:W NEXT W:B EA
MOV.B Rs,@(d:32,ERd) R:W 2nd R:W 3rd R:W 4th R:W NEXT W:B EA
MOV.B Rs,@–ERd R:W NEXT
Internal operation,
W:B EA
1 state
MOV.B Rs,@aa:8 R:W NEXT W:B EA
MOV.B Rs,@aa:16 R:W 2nd R:W NEXT W:B EA
MOV.B Rs,@aa:32 R:W 2nd R:W 3rd R:W NEXT W:B EA
MOV.W #xx:16,Rd R:W 2nd R:W NEXT
MOV.W Rs,Rd R:W NEXT
MOV.W @ERs,Rd R:W NEXT R:W EA
MOV.W @(d:16,ERs),Rd R:W 2nd R:W NEXT R:W EA
MOV.W @(d:32,ERs),Rd R:W 2nd R:W 3rd R:W 4th R:W NEXT R:W EA
MOV.W @ERs+, Rd R:W NEXT
Internal operation,
R:W EA
1 state
MOV.W @aa:16,Rd R:W 2nd R:W NEXT R:W EA
MOV.W @aa:32,Rd R:W 2nd R:W 3rd R:W NEXT R:B EA
MOV.W Rs,@ERd R:W NEXT W:W EA
1 2 3 4 5 6 7 8 9
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1045 of 1268
REJ09B0220-0600
Instruction 1 2 3 4 5 6 7 8 9
MOV.W Rs,@(d:16,ERd) R:W 2nd R:W NEXT W:W EA
MOV.W Rs,@(d:32,ERd) R:W 2nd R:W 3rd R:E 4th R:W NEXT W:W EA
MOV.W Rs,@–ERd R:W NEXT
Internal operation,
W:W EA
1 state
MOV.W Rs,@aa:16 R:W 2nd R:W NEXT W:W EA
MOV.W Rs,@aa:32 R:W 2nd R:W 3rd R:W NEXT W:W EA
MOV.L #xx:32,ERd R:W 2nd R:W 3rd R:W NEXT
MOV.L ERs,ERd R:W NEXT
MOV.L @ERs,ERd R:W 2nd R:W:M NEXT R:W:M EA R:W EA+2
MOV.L @(d:16,ERs),ERd R:W 2nd R:W:M 3rd R:W NEXT R:W:M EA R:W EA+2
MOV.L @(d:32,ERs),ERd R:W 2nd R:W:M 3rd R:W:M 4th R:W 5th R:W NEXT R:W:M EA R:W EA+2
MOV.L @ERs+,ERd R:W 2nd R:W:M NEXT
Internal operation,
R:W:M EA R:W EA+2
1 state
MOV.L @aa:16,ERd R:W 2nd R:W:M 3rd R:W NEXT R:W:M EA R:W EA+2
MOV.L @aa:32,ERd R:W 2nd R:W:M 3rd R:W 4th R:W NEXT R:W:M EA R:W EA+2
MOV.L ERs,@ERd R:W 2nd R:W:M NEXT W:W:M EA W:W EA+2
MOV.L ERs,@(d:16,ERd) R:W 2nd R:W:M 3rd R:W NEXT W:W:M EA W:W EA+2
MOV.L ERs,@(d:32,ERd) R:W 2nd R:W:M 3rd R:W:M 4th R:W 5th R:W NEXT W:W:M EA W:W EA+2
MOV.L ERs,@–ERd R:W 2nd R:W:M NEXT
Internal operation,
W:W:M EA W:W EA+2
1 state
MOV.L ERs,@aa:16 R:W 2nd R:W:M 3rd R:W NEXT W:W:M EA W:W EA+2
MOV.L ERs,@aa:32 R:W 2nd R:W:M 3rd R:W 4th R:W NEXT W:W:M EA W:W EA+2
MOVFPE @aa:16,Rd Cannot be used in the chip
MOVTPE Rs,@aa:16
MULXS.B Rs,Rd R:W 2nd R:W NEXT Internal operation, 11 states
MULXS.W Rs,ERd R:W 2nd R:W NEXT Internal operation, 19 states
MULXU.B Rs,Rd R:W NEXT Internal operation, 11 states
MULXU.W Rs,ERd R:W NEXT Internal operation, 19 states
NEG.B Rd R:W NEXT
NEG.W Rd R:W NEXT
NEG.L ERd R:W NEXT
NOP R:W NEXT
NOT.B Rd R:W NEXT
NOT.W Rd R:W NEXT
NOT.L ERd R:W NEXT
OR.B #xx:8,Rd R:W NEXT
OR.B Rs,Rd R:W NEXT
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1046 of 1268
REJ09B0220-0600
Instruction
OR.W #xx:16,Rd R:W 2nd R:W NEXT
OR.W Rs,Rd R:W NEXT
OR.L #xx:32,ERd R:W 2nd R:W 3rd R:W NEXT
OR.L ERs,ERd R:W 2nd R:W NEXT
ORC #xx:8,CCR R:W NEXT
ORC #xx:8,EXR R:W 2nd R:W NEXT
POP.W Rn R:W NEXT
Internal operation,
R:W EA
1 state
POP.L ERn R:W 2nd R:W:M NEXT
Internal operation,
R:W:M EA R:W EA+2
1 state
PUSH.W Rn R:W NEXT
Internal operation,
W:W EA
1 state
PUSH.L ERn R:W 2nd R:W:M NEXT
Internal operation,
W:W:M EA W:W EA+2
1 state
ROTL.B Rd R:W NEXT
ROTL.B #2,Rd R:W NEXT
ROTL.W Rd R:W NEXT
ROTL.W #2,Rd R:W NEXT
ROTL.L ERd R:W NEXT
ROTL.L #2,ERd R:W NEXT
ROTR.B Rd R:W NEXT
ROTR.B #2,Rd R:W NEXT
ROTR.W Rd R:W NEXT
ROTR.W #2,Rd R:W NEXT
ROTR.L ERd R:W NEXT
ROTR.L #2,ERd R:W NEXT
ROTXL.B Rd R:W NEXT
ROTXL.B #2,Rd R:W NEXT
ROTXL.W Rd R:W NEXT
ROTXL.W #2,Rd R:W NEXT
ROTXL.L ERd R:W NEXT
ROTXL.L #2,ERd R:W NEXT
ROTXR.B Rd R:W NEXT
ROTXR.B #2,Rd R:W NEXT
ROTXR.W Rd R:W NEXT
ROTXR.W #2,Rd R:W NEXT
ROTXR.L ERd R:W NEXT
1 2 3 4 5 6 7 8 9
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1047 of 1268
REJ09B0220-0600
Instruction
ROTXR.L #2,ERd R:W NEXT
RTE R:W NEXT
R:W stack (EXR) R:W stack (H) R:W stack (L)
Internal operation,
R:W*
4
1 state
RTS R:W NEXT
R:W:M stack (H) R:W stack (L)
Internal operation,
R:W*
4
1 state
SHAL.B Rd R:W NEXT
SHAL.B #2,Rd R:W NEXT
SHAL.W Rd R:W NEXT
SHAL.W #2,Rd R:W NEXT
SHAL.L ERd R:W NEXT
SHAL.L #2,ERd R:W NEXT
SHAR.B Rd R:W NEXT
SHAR.B #2,Rd R:W NEXT
SHAR.W Rd R:W NEXT
SHAR.W #2,Rd R:W NEXT
SHAR.L ERd R:W NEXT
SHAR.L #2,ERd R:W NEXT
SHLL.B Rd R:W NEXT
SHLL.B #2,Rd R:W NEXT
SHLL.W Rd R:W NEXT
SHLL.W #2,Rd R:W NEXT
SHLL.L ERd R:W NEXT
SHLL.L #2,ERd R:W NEXT
SHLR.B Rd R:W NEXT
SHLR.B #2,Rd R:W NEXT
SHLR.W Rd R:W NEXT
SHLR.W #2,Rd R:W NEXT
SHLR.L ERd R:W NEXT
SHLR.L #2,ERd R:W NEXT
SLEEP R:W NEXT
Internal operation:M
STC CCR,Rd R:W NEXT
STC EXR,Rd R:W NEXT
STC CCR,@ERd R:W 2nd R:W NEXT W:W EA
STC EXR,@ERd R:W 2nd R:W NEXT W:W EA
STC CCR,@(d:16,ERd) R:W 2nd R:W 3rd R:W NEXT W:W EA
1 2 3 4 5 6 7 8 9
Advanced
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1048 of 1268
REJ09B0220-0600
Instruction
STC EXR,@(d:16,ERd)
R:W 2nd R:W 3rd R:W NEXT W:W EA
STC CCR,@(d:32,ERd) R:W 2nd R:W 3rd R:W 4th R:W 5th R:W NEXT W:W EA
STC EXR,@(d:32,ERd) R:W 2nd R:W 3rd R:W 4th R:W 5th R:W NEXT W:W EA
STC CCR,@–ERd R:W 2nd R:W NEXT
Internal operation,
W:W EA
1 state
STC EXR,@–ERd R:W 2nd R:W NEXT
Internal operation,
W:W EA
1 state
STC CCR,@aa:16 R:W 2nd R:W 3rd R:W NEXT W:W EA
STC EXR,@aa:16 R:W 2nd R:W 3rd R:W NEXT W:W EA
STC CCR,@aa:32 R:W 2nd R:W 3rd R:W 4th R:W NEXT W:W EA
STC EXR,@aa:32 R:W 2nd R:W 3rd R:W 4th R:W NEXT W:W EA
STM.L(ERn–ERn+1),@–SP
R:W 2nd R:W:M NEXT
Internal operation,
W:W:M stack (H)
*
3
W:W stack (L)
*
3
1 state
STM.L(ERn–ERn+2),@–SP
R:W 2nd R:W:M NEXT
Internal operation,
W:W:M stack (H)
*
3
W:W stack (L)
*
3
1 state
STM.L(ERn–ERn+3),@–SP
R:W 2nd R:W:M NEXT
Internal operation,
W:W:M stack (H)
*
3
W:W stack (L)
*
3
1 state
STMAC MACH,ERd Cannot be used in the chip
STMAC MACL,ERd
SUB.B Rs,Rd R:W NEXT
SUB.W #xx:16,Rd R:W 2nd R:W NEXT
SUB.W Rs,Rd R:W NEXT
SUB.L #xx:32,ERd R:W 2nd R:W 3rd R:W NEXT
SUB.L ERs,ERd R:W NEXT
SUBS #1/2/4,ERd R:W NEXT
SUBX #xx:8,Rd R:W NEXT
SUBX Rs,Rd R:W NEXT
TAS @ERd*
8
R:W 2nd R:W NEXT R:B:M EA W:B EA
TRAPA #x:2 R:W NEXT
Internal operation,
W:W stack (L) W:W stack (H) W:W stack (EXR)
R:W:M VEC R:W VEC+2
Internal operation,
R:W
*
7
1 state
1 state
XOR.B #xx8,Rd R:W NEXT
XOR.B Rs,Rd R:W NEXT
XOR.W #xx:16,Rd R:W 2nd R:W NEXT
XOR.W Rs,Rd R:W NEXT
XOR.L #xx:32,ERd R:W 2nd R:W 3rd R:W NEXT
1 2 3 4 5 6 7 8 9
Advanced
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1049 of 1268
REJ09B0220-0600
Instruction
XOR.L ERs,ERd R:W 2nd R:W NEXT
XORC #xx:8,CCR R:W NEXT
XORC #xx:8,EXR R:W 2nd R:W NEXT
Reset exception
R:W VEC R:W VEC+2
Internal operation,
R:W
*5
handling
1 state
Interrupt exception
R:W
*6
Internal operation,
W:W stack (L) W:W stack (H)
W:W stack (EXR)
R:W:M VEC R:W VEC+2
Internal operation,
R:W
*7
handling
1 state
1 state
Notes: 1. EAs is the contents of ER5. EAd is the contents of ER6.
2. EAs is the contents of ER5. EAd is the contents of ER6. Both registers are incremented by 1 after execution of the instruction. n is the initial
value of R4L or R4. If n = 0, these bus cycles are not executed.
3. Repeated two times to save or restore two registers, three times for three registers, or four times for four registers.
4. Start address after return.
5. Start address of the program.
6. Prefetch address, equal to two plus the PC value pushed onto the stack. In recovery from sleep mode or software standby mode the read
operation is replaced by an internal operation.
7. Start address of the interrupt handling routine.
8. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
1 2 3 4 5 6 7 8 9
Advanced
Advanced
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1050 of 1268
REJ09B0220-0600
A.6 Condition Code Modification
This section indicates the effect o f each CPU instruction on the condition code. The notation used
in the table is defined below.
m =
31 for longword operands
15 for word operands
7 for byte operands
Si
Di
Ri
Dn
—
0
1
*
Z'
C'
T he i-th bit of the source operand
The i-th bit of the destination operand
The i-th bit of the result
The specified bit in the destination operand
Not affected
Modified according to the result of the instruction (see definition)
Always cleared to 0
Always set to 1
Undetermined (no guaranteed value)
Z flag before instruction execution
C flag before instruction execution
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1051 of 1268
REJ09B0220-0600
Table A.7 Condition Code Modif ica tion
Instruction H N Z V C Definition
ADD H = Sm–4 · Dm–4 + Dm–4 · Rm–4 + Sm–4 · Rm–4
N = Rm
Z = Rm · Rm–1 · ...... · R0
V = Sm · Dm · Rm + Sm · Dm · Rm
C = Sm · Dm + Dm · Rm + Sm · Rm
ADDS — — — — —
ADDX H = Sm–4 · Dm–4 + Dm–4 · Rm–4 + Sm–4 · Rm–4
N = Rm
Z = Z' · Rm · ...... · R0
V = Sm · Dm · Rm + Sm · Dm · Rm
C = Sm · Dm + Dm · Rm + Sm · Rm
AND — 0 — N = Rm
Z = Rm · Rm–1 · ...... · R0
ANDC Stores the corresponding bits of the result.
No flags change when the operand is EXR.
BAND — — — — C = C' · Dn
Bcc — — — — —
BCLR — — — — —
BIAND — — — — C = C' · Dn
BILD — — — — C = Dn
BIOR — — — — C = C' + Dn
BIST — — — — —
BIXOR — — — — C = C' · Dn + C' · Dn
BLD — — — — C = Dn
BNOT — — — — —
BOR — — — — C = C' + Dn
BSET — — — — —
BSR — — — — —
BST — — — — —
BTST — — — — Z = Dn
BXOR — — — — C = C' · Dn + C' · Dn
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1052 of 1268
REJ09B0220-0600
Instruction H N Z V C Definition
CLRMAC Cannot be used in the chip
CMP H = Sm–4 · Dm–4 + Dm–4 · Rm–4 + Sm–4 · Rm–4
N = Rm
Z = Rm · Rm–1 · ...... · R0
V = Sm · Dm · Rm + Sm · Dm · Rm
C = Sm · Dm + Dm · Rm + Sm · Rm
DAA * * N = Rm
Z = Rm · Rm–1 · ...... · R0
C: decimal arithmetic carry
DAS * * N = Rm
Z = Rm · Rm–1 · ...... · R0
C: decimal arithmetic borrow
DEC — — N = Rm
Z = Rm · Rm–1 · ...... · R0
V = Dm · Rm
DIVXS — — — N = Sm · Dm + Sm · Dm
Z = Sm · Sm–1 · ...... · S0
DIVXU — — — N = Sm
Z = Sm · Sm–1 · ...... · S0
EEPMOV — — — — —
EXTS — 0 — N = Rm
Z = Rm · Rm–1 · ...... · R0
EXTU — 0 0 — Z = Rm · Rm–1 · ...... · R0
INC — — N = Rm
Z = Rm · Rm–1 · ...... · R0
V = Dm · Rm
JMP — — — — —
JSR — — — — —
LDC Stores the correspondi ng bits of the result.
No flags change when the operand is EXR.
LDM — — — — —
LDMAC Cannot be used in the chip
MAC
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1053 of 1268
REJ09B0220-0600
Instruction H N Z V C Definition
MOV —
0 — N = Rm
Z = Rm · Rm–1 · ...... · R0
MOVFPE Cannot be used in the chip
MOVTPE
MULXS — — — N = R2m
Z = R2m · R2m–1 · ...... · R0
MULXU — — — — —
NEG H = Dm –4 + Rm–4
N = Rm
Z = Rm · Rm–1 · ...... · R0
V = Dm · Rm
C = Dm + Rm
NOP — — — — —
NOT — 0 — N = Rm
Z = Rm · Rm–1 · ...... · R0
OR — 0 — N = Rm
Z = Rm · Rm–1 · ...... · R0
ORC Stores the correspondi ng bits of the result.
No flags change when the operand is EXR.
POP — 0 — N = Rm
Z = Rm · Rm–1 · ...... · R0
PUSH — 0 — N = Rm
Z = Rm · Rm–1 · ...... · R0
ROTL — 0 N = Rm
Z = Rm · Rm–1 · ...... · R0
C = Dm (1-bit shift) or C = Dm–1 (2-bit shift)
ROTR — 0 N = Rm
Z = Rm · Rm–1 · ...... · R0
C = D0 (1-bit shift) or C = D1 (2-bit shift)
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1054 of 1268
REJ09B0220-0600
Instruction H N Z V C Definition
ROTXL —
0 N = Rm
Z = Rm · Rm–1 · ...... · R0
C = Dm (1-bit shift) or C = Dm–1 (2-bit shift)
ROTXR — 0 N = Rm
Z = Rm · Rm–1 · ...... · R0
C = D0 (1-bit shift) or C = D1 (2-bit shift)
RTE Stores the correspondi ng bits of the result.
RTS — — — — —
SHAL — N = Rm
Z = Rm · Rm–1 · ...... · R0
V = Dm · Dm–1 + Dm · Dm–1 (1-bit shift)
V = Dm · Dm–1 · Dm–2 · Dm · Dm–1 · Dm–2 (2-bit shift)
C = Dm (1-bit shift) or C = Dm–1 (2-bit shift)
SHAR — 0 N = Rm
Z = Rm · Rm–1 · ...... · R0
C = D0 (1-bit shift) or C = D1 (2-bit shift)
SHLL — 0 N = Rm
Z = Rm · Rm–1 · ...... · R0
C = Dm (1-bit shift) or C = Dm–1 (2-bit shift)
SHLR — 0 0 N = Rm
Z = Rm · Rm–1 · ...... · R0
C = D0 (1-bit shift) or C = D1 (2-bit shift)
SLEEP — — — — —
STC — — — — —
STM — — — — —
STMAC Cannot be used in the chip
Appendix A Instruction Set
Rev.6.00 Sep. 27, 2007 Page 1055 of 1268
REJ09B0220-0600
Instruction H N Z V C Definition
SUB H = Sm–4 · Dm–4 + Dm–4 · Rm–4 + Sm–4 · Rm–4
N = Rm
Z = Rm · Rm–1 · ...... · R0
V = Sm · Dm · Rm + Sm · Dm · Rm
C = Sm · Dm + Dm · Rm + Sm · Rm
SUBS — — — — —
SUBX H = Sm–4 · Dm–4 + Dm–4 · Rm–4 + Sm–4 · Rm–4
N = Rm
Z = Z' · Rm · ...... · R0
V = Sm · Dm · Rm + Sm · Dm · Rm
C = Sm · Dm + Dm · Rm + Sm · Rm
TAS — 0 — N = Dm
Z = Dm · Dm–1 · ...... · D0
TRAPA — — — — —
XOR — 0 — N = Rm
Z = Rm · Rm–1 · ...... · R0
XORC Stores the correspondi ng bits of the result.
No flags change when the operand is EXR.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1056 of 1268
REJ09B0220-0600
Appendix B Internal I/O Registers
B.1 List of Registers (Address Order)
Address
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
Data
Bus
Width
H'F800 MRA SM1 SM0 DM1 DM0 MD1 MD0 DTS Sz DTC
to SAR
H'FBFF
16/
32*1
bits
MRB CHNE DISEL CHNS — — — — —
DAR
CRA
CRB
H'FE80 TCR3 CCLR2 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 TPU3 16 bits
H'FE81 TMDR3 — — BFB BFA MD3 MD2 MD1 MD0
H'FE82 TIOR3H IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0
H'FE83 TIOR3L IOD3 IOD2 IOD1 IOD0 IOC3 IOC2 IOC1 IOC0
H'FE84 TIER3 TTGE — — TCIEV TGIED TGIEC TGIEB TGIEA
H'FE85 TSR3 — — — TCFV TGFD TGFC TGFB TGFA
H'FE86 TCNT3
H'FE87
H'FE88 TGR3A
H'FE89
H'FE8A TGR3B
H'FE8B
H'FE8C TGR3C
H'FE8D
H'FE8E TGR3D
H'FE8F
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1057 of 1266
REJ09B0220-0600
Address
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
Data
Bus
Width
H'FE90 TCR4 — CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 TPU4 16 bits
H'FE91 TMDR4 — — — — MD3 MD2 MD1 MD0
H'FE92 TIOR4 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0
H'FE94 TIER4 TTGE — TCIEU TCIEV — — TGIEB TGIEA
H'FE95 TSR4 TCFD — TCFU TCFV — — TGFB TGFA
H'FE96 TCNT4
H'FE97
H'FE98 TGR4A
H'FE99
H'FE9A TGR4B
H'FE9B
H'FEA0 TCR5 — CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 TPU5 16 bits
H'FEA1 TMDR5 — — — — MD3 MD2 MD1 MD0
H'FEA2 TIOR5 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0
H'FEA4 TIER5 TTGE — TCIEU TCIEV — — TGIEB TGIEA
H'FEA5 TSR5 TCFD — TCFU TCFV — — TGFB TGFA
H'FEA6 TCNT5
H'FEA7
H'FEA8 TGR5A
H'FEA9
H'FEAA TGR5B
H'FEAB
H'FEB0 P1DDR P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR Ports 8 bits
H'FEB1 P2DDR P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR
H'FEB2 P3DDR — — P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR
H'FEB4 P5DDR — — — — P53DDR P52DDR P51DDR P50DDR
H'FEB5 P6DDR P67DDR P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR
H'FEB9 PADDR PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR
H'FEBA PBDDR PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR
H'FEBB PCDDR PC7DDR PC6DDR PC5DDR PC4DDR PC3DDR PC2DDR PC1DDR PC0DDR
H'FEBC PDDDR PD7DDR PD6DDR PD5DDR PD4DDR PD3DDR PD2DDR PD1DDR PD0DDR
H'FEBD PEDDR PE7DDR PE6DDR PE5DDR PE4DDR PE3DDR PE2DDR PE1DDR PE0DDR
H'FEBE PFDDR PF7DDR PF6DDR PF5DDR PF4DDR PF3DDR PF2DDR PF1DDR PF0DDR
H'FEBF PGDDR — — — PG4DDR PG3DDR PG2DDR PG1DDR PG0DDR
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1058 of 1268
REJ09B0220-0600
Address
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
Data
Bus
Width
H'FEC4 IPRA — IPR6 IPR5 IPR4 — IPR2 IPR1 IPR0 8 bits
H'FEC5 IPRB — IPR6 IPR5 IPR4 — IPR2 IPR1 IPR0
Interrupt
controller
H'FEC6 IPRC — IPR6 IPR5 IPR4 — IPR2 IPR1 IPR0
H'FEC7 IPRD — IPR6 IPR5 IPR4 — IPR2 IPR1 IPR0
H'FEC8 IPRE — IPR6 IPR5 I PR4 — IPR2 IPR1 IPR0
H'FEC9 IPRF — IPR6 IPR5 IPR4 — IPR2 IPR1 IPR0
H'FECA IPRG — IPR6 IPR5 IPR4 — IPR2 IPR1 IPR0
H'FECB IPRH — IPR6 IPR5 IPR4 — IPR2 IPR1 IPR0
H'FECC IPRI — IPR6 IPR5 IPR4 — IPR2 IPR1 IPR0
H'FECD IPRJ — IPR6 IPR5 IPR4 — IPR2 IPR1 IPR0
H'FECE IPRK — IPR6 IPR5 IPR4 — IPR2 IPR1 IPR0
H'FED0 ABWCR ABW7 ABW6 ABW5 ABW4 ABW3 ABW2 ABW1 ABW0 8 bits
H'FED1 ASTCR AST7 AST6 AST5 AST4 AST3 AST2 AST1 AST0
Bus
controller
H'FED2 WCRH W71 W70 W61 W60 W51 W50 W41 W40
H'FED3 WCRL W31 W30 W21 W20 W11 W10 W01 W00
H'FED4 BCRH ICIS1 ICIS0 BRSTRM BRSTS1 BRSTS0 RMTS2*2RMTS1*2RMTS0*2
H'FED5 BCRL BRLE BREQOE EAE — DDS*2 — WDBE*2WAITE
H'FED6 MCR*3 TPC BE RCDM — MXC1 MXC0 RLW1 RLW0
H'FED7 DRAMCR
*3 RFSHE RCW RMODE CMF CMIE CKS2 CKS1 CKS0
H'FED8 RTCNT*3
H'FED9 RTCOR
H'FEDB RAMER*4 — — — — RAMS RAM2 RAM1 RAM0 Flash
memory 8 bits
H'FEE0 MAR0AH — — — — — — — — DMAC*5 16 bits
H'FEE1
H'FEE2 MAR0AL
H'FEE3
H'FEE4 IOAR0A
H'FEE5
H'FEE6 ETCR0A
H'FEE7
H'FEE8 MAR0BH — — — — — — — —
H'FEE9
H'FEEA MAR0BL
H'FEEB
H'FEEC IOAR0B
H'FEED
H'FEEE ETCR0B
H'FEEF
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1059 of 1266
REJ09B0220-0600
Address
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
Data
Bus
Width
H'FEF0 MAR1AH — — — — — — — — DMAC*5 16 bits
H'FEF1
H'FEF2 MAR1AL
H'FEF3
H'FEF4 IOAR1A
H'FEF5
H'FEF6 ETCR1A
H'FEF7
H'FEF8 MAR1BH — — — — — — — —
H'FEF9
H'FEFA MAR1BL
H'FEFB
H'FEFC IOAR1B
H'FEFD
H'FEFE ETCR1B
H'FEFF
H'FF00 DMAWER — — — — WE1B WE1A WE0B WE0A 8 bits
H'FF01 DMATCR — — TEE1 TEE0 — — — —
H'FF02 DMACR0A DTSZ DTID RPE DTDIR DTF3 DTF2 DTF1 DTF0 Short
address
mode
16 bits
DTSZ SAID SAIDE BLKDIR BLKE — — — Full
address
mode
H'FF03 DMACR0B DTSZ DTID RPE DTDIR DTF3 DTF2 DTF1 DTF0 Short
address
mode
— DAID DAIDE — DTF3 DTF2 DTF1 DTF0 Full
address
mode
H'FF04 DMACR1A DTSZ DTID RPE DTDIR DTF3 DTF2 DTF1 DTF0 Short
address
mode
DTSZ SAID SAIDE BLKDIR BLKE — — — Full
address
mode
H'FF05 DMACR1B DTSZ DTID RPE DTDIR DTF3 DTF2 DTF1 DTF0 Short
address
mode
— DAID DAIDE — DTF3 DTF2 DTF1 DTF0 Full
address
mode
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1060 of 1268
REJ09B0220-0600
Address
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
Data
Bus
Width
H'FF06 DMABCRH FAE1 FAE0 SAE1 SAE0 DTA1B DTA1A DTA0B DTA0A Short
address
mode
FAE1 FAE0 — — DTA1 — DTA0 — Full
address
mode
H'FF07 DMABCRL DTE1B DTE1A DTE0B DTE0A DTIE1B DTIE1A DTIE0B DTIE0A Short
address
mode
DTME1 DTE1 DTME0 DTE0 DTIE1B DTIE1A DTIE0B DTIE0A Full
address
mode
H'FF2C ISCRH IRQ7SCB IRQ7SCA IRQ6SCB IRQ6SCA IRQ5SCB IRQ5SCA IRQ4SCB IRQ4SCA 8 bits
H'FF2D ISCRL IRQ3SCB IRQ3SCA IRQ2SCB IRQ2SCA IRQ1SCB IRQ1SCA IRQ0SCB IRQ0SCA
H'FF2E IER IRQ7E IRQ6E IRQ5E IRQ4E IRQ3E IRQ2E IRQ1E IRQ0E
H'FF2F ISR IRQ7F IRQ6F IRQ5F IRQ4F IRQ3F IRQ2F IRQ1F IRQ0F
Interrupt
controller
H'FF30
to
H'FF35
DTCER DTCE7 DTCE6 DTCE5 DTCE4 DTCE3 DTCE2 DTCE1 DTCE0 DTC 8 bits
H'FF37 DTVECR SWDTE DTVEC6 DTVEC5 DTVEC4 DTVEC3 DTVEC2 DTVEC1 DTVEC0
H'FF38 SBYCR SSBY STS2 STS1 STS0 OPE — — IRQ37S Power-
down
mode
8 bits
H'FF39 SYSCR — — INTM1 INTM0 NMIEG LWROD IRQPAS RAME MCU 8 bits
H'FF3A SCKCR PSTOP — DIV — — SCK2 SCK1 SCK0 Clock
pulse
generator
8 bits
H'FF3B MDCR — — — — — MDS2 MDS1 MDS0 MCU 8 bits
H'FF3C MSTPCRH MSTP15 MSTP14 MSTP13 MSTP12 MSTP11 MSTP10 MSTP9 MSTP8 8 bits
H'FF3D MSTPCRL MSTP7 MSTP6 MSTP5 MSTP4 MSTP3 MSTP2 MSTP1 MSTP0
Power-
down
mode
H'FF42 SYSCR2*4 — — — — FLSHE — — — MCU 8 bits
H'FF44 Reserved — — — — — — — — Reserved —
HFF45 PFCR1 — — — — A23E A22E A21E A20E Port 8 bits
H'FF46 PCR G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0 PPG 8 bits
H'FF47 PMR G3INV G2INV G1INV G0INV G3NOV G2NOV G1NOV G0NOV
H'FF48 NDERH NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 NDER8
H'FF49 NDERL NDER7 NDER6 NDER5 NDER4 NDER3 NDER2 NDER1 NDER0
H'FF4A PODRH POD15 POD14 POD13 POD12 POD11 POD10 POD9 POD8
H'FF4B PODRL POD7 POD6 POD5 POD4 POD3 POD2 POD1 POD0
H'FF4C*6 NDRH NDR15 NDR14 NDR13 NDR12 NDR11 NDR10 NDR9 NDR8
H'FF4D*6 NDRL NDR7 NDR6 NDR5 NDR4 NDR3 NDR2 NDR1 NDR0
H'FF4E*6 NDRH — — — — NDR11 NDR10 NDR9 NDR8
H'FF4F*6 NDRL — — — — NDR3 NDR2 NDR1 NDR0
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1061 of 1266
REJ09B0220-0600
Address
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
Data
Bus
Width
H'FF50 PORT1 P17 P16 P15 P14 P13 P12 P11 P10 Ports 8 bits
H'FF51 PORT2 P27 P26 P25 P24 P23 P22 P21 P20
H'FF52 PORT3 — — P35 P34 P33 P32 P31 P30
H'FF53 PORT4 P47 P46 P45 P44 P43 P42 P41 P40
H'FF54 PORT5 — — — — P53 P52 P51 P50
H'FF55 PORT6 P67 P66 P65 P64 P63 P62 P61 P60
H'FF59 PORTA PA7 PA6 PA5 PA4 PA3 PA2 PA1 PA0
H'FF5A PORTB PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0
H'FF5B PORTC PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0
H'FF5C PORTD PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0
H'FF5D PORTE PE7 PE6 PE5 PE4 PE3 PE2 PE1 PE0
H'FF5E PORTF PF7 PF6 PF5 PF4 PF3 PF2 PF1 PF0
H'FF5F PORTG — — — PG4 PG3 PG2 PG1 PG0
H'FF60 P1DR P17DR P16DR P15D R P14DR P13DR P12DR P11DR P10DR
H'FF61 P2DR P27DR P26DR P25DR P24DR P23DR P22DR P21DR P20DR
H'FF62 P3DR — — P35DR P34DR P33DR P32DR P31DR P30DR
H'FF64 P5DR — — — — P53DR P52DR P51DR P50DR
H'FF65 P6DR P67DR P66DR P65DR P64DR P63DR P62DR P61DR P60DR
H'FF69 PADR PA7DR PA6DR PA5DR PA4DR PA3DR PA2DR PA1DR PA0DR
H'FF6A PBDR PB7DR PB6DR PB5DR PB4DR PB3DR PB2DR PB1DR PB0DR
H'FF6B PCDR PC7DR PC6DR PC5DR PC4DR PC3DR PC2DR PC1DR PC0DR
H'FF6C PDDR PD7DR PD6DR PD5DR PD4DR PD3DR PD2DR PD1DR PD0DR
H'FF6D PEDR PE7DR PE6DR PE5DR PE4DR PE3DR PE2DR PE1DR PE0DR
H'FF6E PFDR PF7DR PF6DR PF5DR PF4DR PF3DR PF2DR PF1DR PF0DR
H'FF6F PGDR — — — PG4DR PG3DR PG2DR PG1DR PG0DR
H'FF70 PAPCR PA7PCR PA6PCR PA5PCR PA4PCR PA3PCR PA2PCR PA1PCR PA0PCR
H'FF71 PBPCR PB7PCR PB6PCR PB5PCR PB4PCR PB3PCR PB2PCR PB1PCR PB0PCR
H'FF72 PCPCR PC7PCR PC6PCR PC5PCR PC4PCR PC3PCR PC2PCR PC1PCR PC0PCR
H'FF73 PDPCR PD7PCR PD6PCR PD5PCR PD4PCR PD3PCR PD2PCR PD1PCR PD0PCR
H'FF74 PEPCR PE7PCR PE6PCR PE5PCR PE4PCR PE3PCR PE2PCR PE1PCR PE0PCR
H'FF76 P3ODR — — P35ODR P34ODR P33ODR P32ODR P31ODR P30ODR
H'FF77 PAODR PA7ODR PA6ODR PA5ODR PA4ODR PA3ODR PA2ODR PA1ODR PA0ODR
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1062 of 1268
REJ09B0220-0600
Address
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
Data
Bus
Width
H'FF78 SMR0 C/A/
GM*7 CHR/
BLK*8 PE O/E STOP/
BCP1*9 MP/
BCP0*10 CKS1 CKS0 8 bits
H'FF79 BRR0
H'FF7A SCR0 TIE RIE TE RE MPIE TEIE CKE1 CKE0
SCI0,
smart
card
interface 0
H'FF7B TDR0
H'FF7C SSR0 TDRE RDRF ORER FER/
ERS*11 PER TEND MPB MPBT
H'FF7D RDR0
H'FF7E SCMR0 — — — — SDIR SINV — SMIF
H'FF80 SMR1 C/A/
GM*7 CHR/
BLK*8 PE O/E STOP/
BCP1*9 MP/
BCP0*10 CKS1 CKS0 8 bits
H'FF81 BRR1
H'FF82 SCR1 TIE RIE TE RE MPIE TEIE CKE1 CKE0
SCI1,
smart
card
interface 1
H'FF83 TDR1
H'FF84 SSR1 TDRE RDRF ORER FER/
ERS*11 PER TEND MPB MPBT
H'FF85 RDR1
H'FF86 SCMR1 — — — — SDIR SINV — SMIF
H'FF88 SMR2 C/A/
GM*7 CHR/
BLK*8 PE O/E STOP/
BCP1*9 MP/
BCP0*10 CKS1 CKS0 8 bits
H'FF89 BRR2
H'FF8A SCR2 TIE RIE TE RE MPIE TEIE CKE1 CKE0
SCI2,
smart
card
interface 2
H'FF8B TDR2
H'FF8C SSR2 TDRE RDRF ORER FER/
ERS*11 PER TEND MPB MPBT
H'FF8D RDR2
H'FF8E SCMR2 — — — — SDIR SINV — SMIF
H'FF90 ADDRAH AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 8 bits
H'FF91 ADDRAL AD1 AD0 — — — — — —
H'FF92 ADDRBH AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2
A/D
converter
H'FF93 ADDRBL AD1 AD0 — — — — — —
H'FF94 ADDRCH AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2
H'FF95 ADDRCL AD1 AD0 — — — — — —
H'FF96 ADDRDH AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2
H'FF97 ADDRDL AD1 AD0 — — — — — —
H'FF98 ADCSR ADF ADIE ADST SCAN CKS CH2 CH1 CH0
H'FF99 ADCR TRGS1 TRGS0 — — CKS1 CH3 — —
H'FFA4 DADR0 8 bits
H'FFA5 DADR1
D/A
converter
H'FFA6 DACR01 DAOE1 DAOE0 DAE — — — — —
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1063 of 1266
REJ09B0220-0600
Address
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
Data
Bus
Width
H'FFAC PFCR2 WAITPS
BREQOPS CS167E CS25E ASOD — — — Ports 8 bits
H'FFB0 TCR0 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0 16 bits
H'FFB1 TCR1 CMIEB CMIEA OVIE CCLR1 CCLR0 CKS2 CKS1 CKS0
H'FFB2 TCSR0 CMFB CMFA OVF ADTE OS3 OS2 OS1 OS0
H'FFB3 TCSR1 CMFB CMFA OVF — OS3 OS2 OS1 OS0
H'FFB4 TCORA0
8-bit
timer
channel
0, 1
H'FFB5 TCORA1
H'FFB6 TCORB0
H'FFB7 TCORB1
H'FFB8 TCNT0
H'FFB9 TCNT1
H'FFBC
(read) TCSR OVF WT/IT TME — — CKS2 CKS1 CKS0 WDT 16 bits
H'FFBD
(read) TCNT
H'FFBF
(read) RSTCSR WOVF RSTE — — — — — —
H'FFC0 TSTR — — CST5 CST4 CST3 CST2 CST1 CST0 TPU 16 bits
H'FFC1 TSYR — — SYNC5 SYNC4 SYNC3 SYNC2 SYNC1 SYNC0
H'FFC8*12 FLMCR1 FWE SWE ESU PSU EV PV E P 8 bits
H'FFC9*12 FLMCR2 FLER — — — — — — —
H'FFCA*12 EBR1 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0
H'FFCB*12 EBR2 — — — — EB11 EB10 EB9 EB8
Flash
memory
(H8S/2328
F-ZTAT)
H'FFC8*13 FLMCR1 FWE SWE ESU PSU EV PV E P 8 bits
H'FFC9*13 FLMCR2 FLER — — — — — — —
H'FFCA*13 EBR1 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0
H'FFCB*13 EBR2 — — EB13 EB12 EB11 EB10 EB9 EB8
Flash
memory
(H8S/2329
F-ZTAT)
H'FFC8*14 FLMCR1 FWE SWE1 ESU1 PSU1 EV1 PV1 E1 P1 8 bits
H'FFC9*14 FLMCR2 FLER SWE2 ESU2 PSU2 EV2 PV2 E2 P2
H'FFCA*14 EBR1 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0
Flash
memory
(H8S/2326
F-ZTAT)
H'FFCB*14 EBR2 EB15 EB14 EB13 EB12 EB11 EB10 EB9 EB8
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1064 of 1268
REJ09B0220-0600
Address
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
Data
Bus
Width
H'FFD0 TCR0 CCLR2 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 TPU0 16 bits
H'FFD1 TMDR0 — — BFB BFA MD3 MD2 MD1 MD0
H'FFD2 TIOR0H IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0
H'FFD3 TIOR0L IOD3 IOD2 IOD1 IOD0 IOC3 IOC2 IOC1 IOC0
H'FFD4 TIER0 TTGE — — TCIEV TGIED TGIEC TGIEB TGIEA
H'FFD5 TSR0 — — — TCFV TGFD TGFC TGFB TGFA
H'FFD6 TCNT0
H'FFD7
H'FFD8 TGR0A
H'FFD9
H'FFDA TGR0B
H'FFDB
H'FFDC TGR0C
H'FFDD
H'FFDE TGR0D
H'FFDF
H'FFE0 TCR1 — CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 TPU1 16 bits
H'FFE1 TMDR1 — — — — MD3 MD2 MD1 MD0
H'FFE2 TIOR1 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0
H'FFE4 TIER1 TTGE — TCIEU TCIEV — — TGIEB TGIEA
H'FFE5 TSR1 TCFD — TCFU TCFV — — TGFB TGFA
H'FFE6 TCNT1
H'FFE7
H'FFE8 TGR1A
H'FFE9
H'FFEA TGR1B
H'FFEB
H'FFF0 TCR2 — CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 TPU2 16 bits
H'FFF1 TMDR2 — — — — MD3 MD2 MD1 MD0
H'FFF2 TIOR2 IOB3 IOB2 IOB1 IOB0 IOA3 IOA2 IOA1 IOA0
H'FFF4 TIER2 TTGE — TCIEU TCIEV — — TGIEB TGIEA
H'FFF5 TSR2 TCFD — TCFU TCFV — — TGFB TGFA
H'FFF6 TCNT2
H'FFF7
H'FFF8 TGR2A
H'FFF9
H'FFFA TGR2B
H'FFFB
Notes: 1. Located in on-chip RAM. The bus width is 32 bits when the DTC accesses this area as
register information, and 16 bits otherwise.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1065 of 1266
REJ09B0220-0600
2. Reserved bit in the H8S/2321.
3. Reserved in the H8S/2321.
4. Valid only in F-ZTAT versions.
5. The DMAC is not supported in the H8S/2321.
6. If the pulse output group 2 and pulse output group 3 output triggers are the same
according to the PCR setting, the NDRH address will be H'FF4C, and if different, the
address of NDRH for group 2 will be H'FF4E, and that for group 3 will be H'FF4C.
Similarly, if the pulse output group 0 and pulse output group 1 output triggers are the
same according to the PCR setting, the NDRL address will be H'FF4D, and if different,
the address of NDRL for group 0 will be H'FF4F, and that for group 1 will be H'FF4D.
7. Functions as C/A for SCI use, and as GM for smart card interface use.
8. Functions as CHR for SCI use, and as BLK for smart card interface use.
9. Functions as STOP for SCI use, and as BCP1 for smart card interface use.
10. Functions as MP for SCI use, and as BCP0 for smart card interface use.
11. Functions as FER for SCI use, and as ERS for smart card interface use.
12. Applies to the H8S/2328B F-ZTAT.
13. Applies to the H8S/2329B F-ZTAT.
14. Applies to the H8S/2326 F-ZTAT.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1066 of 1268
REJ09B0220-0600
B.2 List of Registers (By Module)
Module Register Abbreviation R/W Initial Value Address*1
System control regi ster SYSCR R/ W H'01 H'FF39
Interrupt
controller IRQ sen se control register H ISCRH R/W H'00 H'FF2C
IRQ sense control register L ISCRL R/W H'00 H'FF2D
IRQ enable register IER R/W H'00 H'FF2E
IRQ status register ISR R/(W)*2 H'00 H'FF2F
Interrupt priority register A IPRA R/W H'77 H'FEC4
Interrupt priority register B IPRB R/W H'77 H'FEC5
In terrupt priority register C IPRC R/W H'77 H'FEC6
In terrupt priority register D IPRD R/W H'77 H'FEC7
Interrupt priority register E IPRE R/W H'77 H'FEC8
Interrupt priority register F IPRF R/W H'77 H'FEC9
Interrupt priority register G IPRG R/W H'77 H'FECA
In terrupt priority register H IPRH R/W H'77 H'FECB
Interrupt priority register I IPRI R/W H'77 H'FECC
Interrupt priority register J IPRJ R/W H'77 H'FECD
Interrupt priority register K IPRK R/W H'77 H'FECE
Bus width control register ABW CR R/W H'FF/H'00*5 H'FED0 Bus
controller Access state control register ASTCR R/W H'FF H'FED1
Wait control register H WCRH R/W H'FF H'FED2
Wait control register L WCRL R/W H'FF H'FED3
Bus control register H BCRH R/W H'D0 H'FED4
Bus control register L BCRL R/W H'3C H'FED5
Memory control register MCR*6 R/W H'00 H'FED6
DRAM control register DRAMCR*6 R/W H'00 H'FED7
Refresh timer counter RTCNT*6 R/W H'00 H'FED8
Refresh tim e constant register RTCOR*6 R/W H'FF H'FED9
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1067 of 1266
REJ09B0220-0600
Module Register Abbreviation R/W Initial Value Address*1
DTC DTC mode register A MRA —*3 Undefined —*4
DTC mode register B MRB —*3 Undefined —*4
DTC source address register SAR —*3 Undefined —*4
DTC destination address register DAR —*3 Undefined —*4
DTC transfer count register A CRA — *3 Undefined —*4
DTC transfer count register B CRB — *3 Undefined —*4
DTC enable register DTCER R/W H'00 H'FF30 to
H'FF35
DTC vector register DTVECR R/W H'00 H'FF37
Module stop control register MSTPCR R/W H'3FFF H'FF3C
DMAC0 Memory address register 0A MAR0A R/W Undefined H'FEE0
I/O address register 0A IOAR0A R/W Undefined H'FEE4
Transfer count register 0A ETCR0A R/W Undefined H'FEE6
Memory address register 0B MAR0B R/W Undefined H'FEE8
I/O address register 0B IOAR0B R/W Undefined H'FEEC
Transfer count register 0B ETCR0B R/W Undefined H'FEEE
DMAC1*7 Memory address register 1A MAR1A R/W Undefined H'FEF0
I/O address register 1A IOAR1A R/W Undefined H'FEF4
Transfer count register 1A ETCR1A R/W Undefined H'FEF6
Memory address register 1B MAR1B R/W Undefined H'FEF8
I/O address register 1B IOAR1B R/W Undefined H'FEFC
Transfer count register 1B ETCR1B R/W Undefined H'FEFE
DMA write enable register DMAWER R/W H'00 H'FF00
DMA terminal control register DMATCR R/W H'00 H'FF01
Both
DMAC
channels*7 DMA control register 0A D MACR0A R/W H'00 H'FF02
DMA control register 0B DMACR0B R/W H'00 H'FF03
DMA control register 1A DMACR1A R/W H'00 H'FF04
DMA control register 1B DMACR1B R/W H'00 H'FF05
DMA band control register DMABCR R/W H'0000 H'FF06
Module stop control register MSTPCR R/W H'3FFF H'FF3C
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1068 of 1268
REJ09B0220-0600
Module Register Abbreviation R/W Initial Value Address*1
TPU0 Timer control register 0 TCR0 R/W H'00 H'FFD0
Timer mode register 0 TMDR0 R/W H'C0 H'FFD1
Timer I/O control register 0H TIOR0H R/W H'00 H'FFD2
Timer I/O control register 0L TIOR0L R/W H'00 H'FFD3
Timer interrupt enable register 0 TIER0 R/W H'40 H'FFD4
Timer status register 0 TSR0 R/(W)*2 H'C0 H'FFD5
Timer counter 0 TCNT0 R/W H'0000 H'FFD6
Timer general register 0A TGR0A R/W H'FFFF H'FFD8
Timer general register 0B TGR0B R/W H'FFFF H'FFDA
Timer general register 0C TGR0C R/W H'FFFF H'FFDC
Timer general register 0D TGR0D R/W H'FFFF H'FFDE
TPU1 Timer control register 1 TCR1 R/W H'00 H'FFE0
Timer mode register 1 TMDR1 R/W H'C0 H'FFE1
Timer I/O control register 1 TIOR1 R/W H'00 H'FFE2
Timer interrupt enable register 1 TIER1 R/W H'40 H'FFE4
Timer status register 1 TSR1 R/(W)*2 H'C0 H'FFE5
Timer counter 1 TCNT1 R/W H'0000 H'FFE6
Timer general register 1A TGR1A R/W H'FFFF H'FFE8
Timer general register 1B TGR1B R/W H'FFFF H'FFEA
TPU2 Timer control register 2 TCR2 R/W H'00 H'FFF0
Timer mode register 2 TMDR2 R/W H'C0 H'FFF1
Timer I/O control register 2 TIOR2 R/W H'00 H'FFF2
Timer interrupt enable register 2 TIER2 R/W H'40 H'FFF4
Timer status register 2 TSR2 R/(W)*2 H'C0 H'FFF5
Timer counter 2 TCNT2 R/W H'0000 H'FFF6
Timer general register 2A TGR2A R/W H'FFFF H'FFF8
Timer general register 2B TGR2B R/W H'FFFF H'FFFA
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1069 of 1266
REJ09B0220-0600
Module Register Abbreviation R/W Initial Value Address*1
TPU3 Timer control register 3 TCR3 R/W H'00 H'FE80
Timer mode register 3 TMDR3 R/W H'C0 H'FE81
Timer I/O control register 3H TIOR3H R/W H'00 H'FE82
Timer I/O control register 3L TIOR3L R/W H'00 H'FE83
Timer interrupt enable register 3 TIER3 R/W H'40 H'FE84
Timer status register 3 TSR3 R/(W)*2 H'C0 H'FE85
Timer counter 3 TCNT3 R/W H'0000 H'FE86
Timer general register 3A TGR3A R/W H'FFFF H'FE88
Timer general register 3B TGR3B R/W H'FFFF H'FE8A
Timer general register 3C TGR3C R/W H'FFFF H'FE8C
Timer general register 3D TGR3D R/W H'FFFF H'FE8E
TPU4 Timer control register 4 TCR4 R/W H'00 H'FE90
Timer mode register 4 TMDR4 R/W H'C0 H'FE91
Timer I/O control register 4 TIOR4 R/W H'00 H'FE92
Timer interrupt enable register 4 TIER4 R/W H'40 H'FE94
Timer status register 4 TSR4 R/(W)*2 H'C0 H'FE95
Timer counter 4 TCNT4 R/W H'0000 H'FE96
Timer general register 4A TGR4A R/W H'FFFF H'FE98
Timer general register 4B TGR4B R/W H'FFFF H'FE9A
TPU5 Timer control register 5 TCR5 R/W H'00 H'FEA0
Timer mode register 5 TMDR5 R/W H'C0 H'FEA1
Timer I/O control register 5 TIOR5 R/W H'00 H'FEA2
Timer interrupt enable register 5 TIER5 R/W H'40 H'FEA4
Timer status register 5 TSR5 R/(W)*2 H'C0 H'FEA5
Timer counter 5 TCNT5 R/W H'0000 H'FEA6
Timer general register 5A TGR5A R/W H'FFFF H'FEA8
Timer general register 5B TGR5B R/W H'FFFF H'FEAA
Timer start register TSTR R/W H'00 H'FFC0 ALL TPU
channels Timer syncro register TSYR R/W H'00 H'FFC1
Module stop control register MSTPCR R/W H'3FFF H'FF3C
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1070 of 1268
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Module Register Abbreviation R/W Initial Value Address*1
PPG PPG output control register PCR R/W H'FF H'FF46
PPG output mode register PMR R/W H'F0 H'FF47
Next data enable register H NDERH R/W H'00 H'FF48
Next data enable register L NDERL R/W H'00 H'FF49
Ou tput data register H PODRH R/(W)*8 H'00 H'FF4A
Output data register L PODRL R/(W)*8 H'00 H'FF4B
Next data register H NDRH R/W H'00 H'FF4C*9
H'FF4E
Next data register L NDRL R/W H'00 H'FF4D*9
H'FF4F
Po rt 1 data direction register P1DDR W H'00 H'FEB0
Po rt 2 data direction register P2DDR W H'00 H'FEB1
Module stop control register MSTPCR R/W H'3FFF H'FF3C
Timer control register 0 TCR0 R/W H'00 H'FFB0 8-bit
timer 0 Timer control/status register 0 TCSR0 R/(W)*10 H'00 H'FFB2
Timer constant register A0 TCORA0 R/W H'FF H'FFB4
Timer constant register B0 TCORB0 R/W H'FF H'FFB6
Timer counter 0 TCNT0 R/W H'00 H'FFB8
Timer control register 1 TCR1 R/W H'00 H'FFB1 8-bit
timer 1 Timer control/status register 1 TCSR1 R/(W)*10 H'10 H'FFB3
Timer constant register A1 TCORA1 R/W H'FF H'FFB5
Timer constant register B1 TCORB1 R/W H'FF H'FFB7
Timer counter 1 TCNT1 R/W H'00 H'FFB9
Both 8-bit
timer
channels
Module stop control register MSTPCR R/W H'3FFF H'FF3C
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1071 of 1266
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Module Register Abbreviation R/W Initial Value Address*1
W DT Timer control/status register TCSR R/(W)*12 H'18 H'FFBC:
Write*11
H'FFBC:
Read
Timer counter TCNT R/W H'00 H'FFBC:
Write*8
H'FFBD:
Read
Reset control/status register RSTCSR R/(W)*12 H'1F H'FFBE:
Write*11
H'FFBF:
Read
SCI0 Serial mode register 0 S MR0 R/W H'00 H'FF78
Bit rate register 0 BRR0 R/W H'FF H'FF79
Serial control regi ster 0 SCR0 R/W H'00 H'FF7A
Transmit data register 0 TDR0 R/W H'FF H'FF7B
Serial status register 0 SSR0 R/(W)*2 H'84 H'FF7C
Receive data register 0 RDR0 R H'00 H'FF7D
Smart card mode register 0 SCMR0 R/W H'F2 H'FF7E
SCI1 Serial mode register 1 S MR1 R/W H'00 H'FF80
Bit rate register 1 BRR1 R/W H'FF H'FF81
Serial control regi ster 1 SCR1 R/W H'00 H'FF82
Transmit data register 1 TDR1 R/W H'FF H'FF83
Serial status register 1 SSR1 R/(W)*2 H'84 H'FF84
Receive data register 1 RDR1 R H'00 H'FF85
Smart card mode register 1 SCMR 1 R/W H'F2 H'FF86
SCI2 Serial mode register 2 S MR2 R/W H'00 H'FF88
Bit rate register 2 BRR2 R/W H'FF H'FF89
Serial control regi ster 2 SCR2 R/W H'00 H'FF8A
Transmit data register 2 TDR2 R/W H'FF H'FF8B
Serial status register 2 SSR2 R/(W)*2 H'84 H'FF8C
Receive data register 2 RDR2 R H'00 H'FF8D
Smart card mode register 2 SCMR2 R/W H'F2 H'FF8E
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1072 of 1268
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Module Register Abbreviation R/W Initial Value Address*1
All SCI
channels Module stop control register MSTPCR R/W H'3FFF H'FF3C
SMCI0 Serial mode register 0 SMR0 R/W H'00 H'FF78
Bit rate register 0 BRR0 R/W H'FF H'FF79
Serial control regi ster 0 SCR0 R/W H'00 H'FF7A
Transmit data register 0 TDR0 R/W H'FF H'FF7B
Serial status register 0 SSR0 R/(W)*2 H'84 H'FF7C
Receive data register 0 RDR0 R H'00 H'FF7D
Smart card mode register SCMR 0 R/W H'F2 H'FF7E
SMCI1 Serial mode register 1 SMR1 R/W H'00 H'FF80
Bit rate register 1 BRR1 R/W H'FF H'FF81
Serial control regi ster 1 SCR1 R/W H'00 H'FF82
Transmit data register 1 TDR1 R/W H'FF H'FF83
Serial status register 1 SSR1 R/(W)*2 H'84 H'FF84
Receive data register 1 RDR1 R H'00 H'FF85
Smart card mode register 1 SCMR 1 R/W H'F2 H'FF86
SMCI2 Serial mode register 2 SMR2 R/W H'00 H'FF88
Bit rate register 2 BRR2 R/W H'FF H'FF89
Serial control regi ster 2 SCR2 R/W H'00 H'FF8A
Transmit data register 2 TDR2 R/W H'FF H'FF8B
Serial status register 2 SSR2 R/(W)*2 H'84 H'FF8C
Receive data register 2 RDR2 R H'00 H'FF8D
Smart card mode register 2 SCMR2 R/W H'00 H'FF8E
All SMCI
channels Module stop control register MSTPCR R/W H'3FFF H'FF3C
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1073 of 1266
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Module Register Abbreviation R/W Initial Value Address*1
ADC A/D data register AH ADDRAH R H'00 H'FF90
A/D data register AL ADDRAL R H'00 H'FF91
A/D data register BH ADDRBH R H'00 H'FF92
A/D data register BL ADDRBL R H'00 H'FF93
A/D data register CH ADDRCH R H'00 H'FF94
A/D data register CL ADDRCL R H'00 H'FF95
A/D data register DH ADDRDH R H'00 H'FF96
A/D data register DL ADDRDL R H'00 H'FF97
A/D control/status register ADCSR R/(W)*12 H'00 H'FF98
A/D control register ADCR R/W H'3F H'FF99
Module stop control register MSTPCR R/W H'3FFF H'FF3C
DAC D/A data register 0 DADR0 R/W H'00 H'FFA4
D/A data register 1 DADR1 R/W H'00 H'FFA5
D/A control register 01 DACR01 R/W H'1F H'FFA6
Module stop control register MSTPCR R/W H'3FFF H'FF3C
On-chip
RAM System control regi ster SYSCR R/ W H'01 H'FF39
Flash memory control register 1 FLMCR1*17 R/W*14 H'00/H'80*15 H'FFC8*13
Flash
memory Flash memory control register 2 FLMCR2*17 R/W*14 H'00 H'FFC9*13
Erase block regi ster 1 EBR1*17 R/W*14 H'00*16 H'FFCA*13
Erase block regi ster 2 EBR2*17 R/W*14 H'00*16 H'FFCB*13
RAM emulation register RA MER*22 R/W H'00 H'FEDB
System control register 2 SYSCR2*18 R/W H'00 H'FF42
Cloc k
pulse
generator
System clo ck con tro l regi ster SCKC R R/W H'00 H'FF3A
Standby control register SBYCR R/W H'08 H'FF38
System clo ck con tro l regi ster SCKC R R/W H'00 H'FF3A
Power-
down
mode Module stop control register H MSTPCRH R/W H'3F H'FF3C
Module stop control register L MSTPCRL R/W H'FF H'FF3D
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1074 of 1268
REJ09B0220-0600
Module Register Abbreviation R/W Initial Value Address*1
Port 1 Port 1 data direction register P1DDR W H'00 H'FEB0
Port 1 data register P1DR R/W H'00 H'FF60
Port 1 register PORT1 R Undefined H'FF50
Port 2 Port 2 data direction register P2DDR W H'00 H'FEB1
Port 2 data register P2DR R/W H'00 H'FF61
Port 2 register PORT2 R Undefined H'FF51
Port 3 Port 3 data direction register P3DDR W H'00 H'FEB2
Port 3 data register P3DR R/W H'00 H'FF62
Port 3 register PORT3 R Undefined H'FF52
Port 3 open drain control register P3ODR R/W H'00 H'FF76
Port 4 Port 4 register PORT4 R Undefined H'FF53
Port 5 Port 5 data direction register P5DDR W H'0*19 H'FEB4
Port 5 data register P5DR R/W H'0*19 H'FF64
Port 5 register PORT5 R Undefined H'FF54
Port function control register 2 PFCR2 R/W H'30 H'FFAC
System control register SYSCR R/W H'01 H'FF39
Port 6 Port 6 data direction register P6DDR W H'00 H'FEB5
Port 6 data register P6DR R/W H'00 H'FF65
Port 6 register PORT6 R Undefined H'FF55
Port function control register 2 PFCR2 R/W H'30 H'FFAC
Port A Port A da ta direction registe r PADDR W H'00 H'FEB9
Port A data register PADR R/W H'00 H'FF69
Port A register PORTA R Undefined H'FF59
Port A MOS pull-up control register PAPCR R/W H'00 H'FF70
Port A open drain control register PAODR R/W H'00 H'FF77
Port function control register 1 PFCR1 R/W H'0F H'FF45
Port B Port B da ta direction registe r PBDDR W H'00 H'FEBA
Port B data register PBDR R/W H'00 H'FF6A
Port B register PORTB R Undefined H'FF5A
Port B MOS pull-up control register PBPCR R/W H'00 H'FF71
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1075 of 1266
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Module Register Abbreviation R/W Initial Value Address*1
Port C Port C data direction register PCDDR W H'00 H'FEBB
Port C data register PCDR R/W H'00 H'FF6B
Port C register PORTC R Undefined H'FF5B
Port C MOS pull-up control register PCPCR R/W H'00 H'FF72
Port D Port D data direction register PDDDR W H'00 H'FEBC
Port D data register PDDR R/W H'00 H'FF6C
Port D register PORTD R Undefined H'FF5C
Port D MOS pull-up control register PDPCR R/W H'00 H'FF73
Port E Port E da ta direction registe r PEDDR W H'00 H'FEBD
Port E data register PEDR R/W H'00 H'FF6D
Port E register PORTE R Undefined H'FF5D
Port E MOS pull-up control register PEPCR R/W H'00 H'FF74
Port F Port F data direction register PFDDR W H'80/H'00*20 H'FEBE
Po rt F data register PFDR R/W H'00 H'FF6E
Port F register PORTF R Undefined H'FF5E
Port function control register 2 PFCR2 R/W H'30 H'FFAC
System control register SYSCR R/W H'01 H'FF39
Port G Po rt G data direction registe r PGDDR W H'10/H'00
*20 *21 H'FEBF
Port G data register PGDR R/W H'00*21 H'FF6F
Port G register PORTG R Undefined*21 H'FF5F
Port function control register 2 PFCR2 R/W H'30 H'FFAC
Notes: 1. Lower 16 bits of the address.
2. Only 0 can be written for flag clearing.
3. Registers in the DTC cannot be read or written to directly.
4. Located as register information in on-chip RAM addresses H'EBC0 to H'EFBF. Cannot
be located in external memory space. Do not clear the RAME bit in SYSCR to 0 when
using the DTC.
5. Determined by the MCU operating mode.
6. Reserved in the H8S/2321.
7. The DMAC is not supported in the H8S/2321.
8. Bits used for pulse output cannot be written to.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1076 of 1268
REJ09B0220-0600
9. If the pulse output group 2 and pulse output group 3 output triggers are the same
according to the PCR setting, the NDRH address will be H'FF4C, and if different, the
address of NDRH for group 2 will be H'FF4E, and that for group 3 will be H'FF4C.
Similarly, if the pulse output group 0 and pulse output group 1 output triggers are the
same according to the PCR setting, the NDRL address will be H'FF4D, and if different,
the address of NDRL for group 0 will be H'FF4F, and that for group 1 will be H'FF4D.
10. Only 0 can be written to bits 7 to 5, to clear the flags.
11. For information on writing, see section 13.2.4, Notes on Register Access.
12. Only 0 can be written to bit 7, to clear the flag.
13. Flash memory registers selection is performed by means of the FLSHE bit in system
control register 2 (SYSCR2).
14. In modes in which the on-chip flash memory is disabled, a read will return H'00, and
writes are invalid. Writes are also disabled when the FWE bit in FLMCR1 is cleared
to 0 (except in the H8S/2329B F-ZTAT).
15. In the H8S/2328B F-ZTAT and H8S/2326 F-ZTAT, the initial value when a high level is
input to the FWE is H'80. The initial value in the H8S/2329B F-ZTAT is H'80.
16. In the H8S/2328B F-ZTAT, this register is initialized to H'00 when a low level is input to
the FWE pin, or when a high level is input to the FWE pin when the SWE bit in
FLMCR1 is not set.
In the H8S/2329B F-ZTAT, this register is initialized to H'00 when the SWE bit in
FLMCR1 is not set.
In the H8S/2326 F-ZTAT, bits EB11 to EB0 are initialized to 0 when a low level is input
to the FW E pin, or a high level is input and the SWE1 bit in FLMCR1 is not set. Bits
EB15 to EB12 are initialized to 0 when a low level is input to the FWE pin, or a high
level is input and the SWE2 bit is not set.
17. FLMCR1, FLMCR2, EBR1, and EBR2 are 8-bit registers. Only byte access can be
used on these registers, with the access requiring two states. (Applies to the
H8S/2329B F-ZTAT, H8S/2328B F-ZTAT, and H8S/2326 F-ZTAT.)
18. The SYSCR2 register can only be used in the F-ZTAT versions. In the mask ROM
versions this register will return an undefined value if read, and cannot be written to.
19. Value of bits 3 to 0.
20. The initial value depends on the mode.
21. Value of bits 4 to 0.
22. Valid only in the F-ZTAT versions.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1077 of 1268
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B.3 Functions
MRA—DTC Mode Register A H'F800—H'FBFF DTC
7
SM1
Undefined
—
6
SM0
Undefined
—
5
DM1
Undefined
—
4
DM0
Undefined
—
3
MD1
Undefined
—
0
Sz
Undefined
—
2
MD0
Undefined
—
1
DTS
Undefined
—
Bit
Initial value
Read/Write
:
:
:
0
1
Source Address Mode
—
0
1
0
1
Destination Address Mode
—
0
1
DTC Mode
0
1
Normal mode
Repeat mode
Block transfer mode
—
0
1
0
1
DTC Data
Transfer Size
0
1
Byte-size
transfer
DTC Transfer Mode Select
0
1
Word-size
transfer
Destination side is repeat
area or block area
Source side is repeat area
or block area
DAR is incremented after a transfer
(by +1 when Sz = 0; by +2 when Sz = 1)
DAR is decremented after a transfer
(by –1 when Sz = 0; by –2 when Sz = 1)
DAR is fixed
SAR is incremented after a transfer
(by +1 when Sz = 0; by +2 when Sz = 1)
SAR is decremented after a transfer
(by –1 when Sz = 0; by –2 when Sz = 1)
SAR is fixed
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1078 of 1268
REJ09B0220-0600
MRB—DTC Mode Register B H'F800—H'FBFF DTC
7
CHNE
Undefined
—
6
DISEL
Undefined
—
5
CHNS
Undefined
—
4
—
Undefined
—
3
—
Undefined
—
0
—
Undefined
—
2
—
Undefined
—
1
—
Undefined
—
Bit
Initial value
Read/Write
:
:
:
DTC Chain Transfer Enable
DTC Chain Transfer Select
CHNE
0
1
1
CHNS
—
0
1
Description
No chain transfer. (At end of DTC data
transfer, DTC waits for activation)
Chain transfer every time
Chain transfer only when transfer counter = 0
DTC Interrupt Select
Reserved
Only 0 should be written to these bits
0
1
After DTC data transfer ends, the CPU interrupt is
disabled unless the transfer counter is 0
After DTC data transfer ends, the CPU interrupt is enabled
SAR—DTC Source Address Register H'F800—H'FBFF DTC
23
Bit
Initial value
Read/Write
:
:
:
22 21 20 19 43210- - -
- - -
- - -
- - -
Specifies DTC transfer data source address
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined
—————
DAR—DTC Destination Address Register H'F800—H'FBFF DTC
23Bit
Initial value
Read/Write
:
:
:
22 21 20 19 43210- - -
- - -
- - -
- - -
Specifies DTC transfer data destination address
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1079 of 1268
REJ09B0220-0600
CRA—DTC Transfer Count Register A H'F800—H'FBFF DTC
15Bit
Initial value
Read/Write
:
:
:
14 13 12 11109876543210
CRAH CRAL
Specifies the number of DTC data transfers
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined
—————
Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined
—————
Unde-
fined
—
CRB—DTC Transfer Count Register B H'F800—H'FBFF DTC
15 14 13 12 11109876543210
Specifies the number of DTC block data transfers
Bit
Initial value
Read/Write
:
:
:
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Unde-
fined
—
Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined
—————
Unde-
fined Unde-
fined Unde-
fined Unde-
fined Unde-
fined
—————
Unde-
fined
—
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1080 of 1268
REJ09B0220-0600
TCR3—Timer Control Register 3 H'FE8 0 TPU3
7
CCLR2
0
R/W
6
CCLR1
0
R/W
5
CCLR0
0
R/W
4
CKEG1
0
R/W
3
CKEG0
0
R/W
0
TPSC0
0
R/W
2
TPSC2
0
R/W
1
TPSC1
0
R/W
Bit
Initial value
Read/Write
:
:
:
TCNT clearing disabled
TCNT cleared by TGRA compare match/input capture
TCNT cleared by TGRB compare match/input capture
TCNT clearing disabled
TCNT cleared by TGRC compare match/input capture *2
TCNT cleared by TGRD compare match/input capture *2
Counter Clear
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Clock Edge
0
1
—
Count at rising edge
Count at falling edge
Count at both edges
Internal clock: counts on φ/1
Internal clock: counts on φ/4
Internal clock: counts on φ/16
Internal clock: counts on φ/64
External clock: counts on TCLKA pin input
Internal clock: counts on φ/1024
Internal clock: counts on φ/256
Internal clock: counts on φ/4096
Timer Prescaler
0
1
0
1
0
1
0
1
0
1
0
1
0
1
TCNT cleared by counter clearing for another channel
performing synchronous clearing/synchronous operation *1
TCNT cleared by counter clearing for another channel
performing synchronous clearing/synchronous operation *1
Notes: 1.
2.
Synchronous operation setting is performed by setting the SYNC
bit in TSYR to 1.
When TGRC or TGRD is used as a buffer register, TCNT is not
cleared because the buffer register setting has priority, and
compare match/input capture does not occur.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1081 of 1268
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TMDR3—Timer Mode Register 3 H'FE81 TPU3
7
—
1
—
6
—
1
—
5
BFB
0
R/W
4
BFA
0
R/W
3
MD3
0
R/W
0
MD0
0
R/W
2
MD2
0
R/W
1
MD1
0
R/W
Bit
Initial value
Read/Write
:
:
:
0
Buffer Operation B
TGRB operates normally
0
Buffer Operation A
TGRA operates normally
0
1
Normal operation
Reserved
PWM mode 1
PWM mode 2
Phase counting mode 1
Phase counting mode 2
Phase counting mode 3
Phase counting mode 4
—
Mode
0
1
*
0
1
0
1
*
0
1
0
1
0
1
0
1
*
Notes: 1.
2.
* : Don’t care
MD3 is a reserved bit. In a write,
it should always be written with 0.
Phase counting mode cannot be
set for channels 0 and 3. In this
case, 0 should always be written
to MD2.
TGRA and TGRC used together
for buffer operation
1
TGRB and TGRD used together
for buffer operation
1
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1082 of 1268
REJ09B0220-0600
TIOR3H—Timer I/O Control Register 3H H'FE82 TPU3
0
1
TGR3B I/O Control
0
1
0
1
0
1
0
1
0
1
*
0
1
0
1
0
1
0
1
0
1
*
*
0
1
TGR3A
is output
compare
register
TGR3A I/O Control
0
1
0
1
0
1
0
1
0
1
*
0
1
0
1
0
1
0
1
0
1
*
*
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
0 output at compare match
1 output at compare match
Toggle output at compare match
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
* : Don’t care
* : Don’t care
7
IOB3
0
R/W
6
IOB2
0
R/W
5
IOB1
0
R/W
4
IOB0
0
R/W
3
IOA3
0
R/W
0
IOA0
0
R/W
2
IOA2
0
R/W
1
IOA1
0
R/W
Bit
Initial value
Read/Write
:
:
:
TGR3A
is input
capture
register
Initial output is
0 output
Output disabled
Initial output is
1 output
Capture input
source is
TIOCA3 pin
Capture input
source is channel
4/count clock
Input capture at TCNT4 count-up/
count-down
TGR3B
is output
compare
register
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
0 output at compare match
1 output at compare match
Toggle output at compare match
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
TGR3B
is input
capture
register
Initial output is
0 output
Output disabled
Initial output is 1
output
Capture input
source is
TIOCB3 pin
Capture input
source is channel
4/count clock
Input capture at TCNT4 count-up/
count-down*
1
Note: 1. When bits TPSC2 to TPSC0 in TCR4 are set to B'000, and φ/1 is used as
the TCNT4 count clock, this setting is invalid and input capture does not
occur.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1083 of 1268
REJ09B0220-0600
TIOR3L—Timer I/O Control Register 3L H'FE83 TPU3
0
1
TGR3D I/O Control
0
1
0
1
0
1
0
1
0
1
*
0
1
0
1
0
1
0
1
0
1
*
*
0
1
TGR3C
is output
compare
register*1
TGR3C I/O Control
0
1
0
1
0
1
0
1
0
1
*
0
1
0
1
0
1
0
1
0
1
*
*
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
* : Don’t care
* : Don’t care
Notes:
Note: 1. When the BFA bit in TMDR3 is set to 1 and TGR3C is used as a buffer
register, this setting is invalid and input capture/output compare does not
occur.
Note: When TGRC or TGRD is designated for buffer operation, this setting is invalid and the
register operates as a buffer register.
7
IOD3
0
R/W
6
IOD2
0
R/W
5
IOD1
0
R/W
4
IOD0
0
R/W
3
IOC3
0
R/W
0
IOC0
0
R/W
2
IOC2
0
R/W
1
IOC1
0
R/W
Bit
Initial value
Read/Write
:
:
:
Initial output is
0 output
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
Initial output is 1
output
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Capture input
source is
TIOCC
3
pin
TGR3C
is input
capture
register*1
Capture input
source is channel
4/count clock
Input capture at TCNT4 count-up/
count-down
TGR3D
is output
compare
register
*
2
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
Initial output is 0
output
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
Initial output is 1
output
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Capture input
source is
TIOCD
3
pin
TGR3D
is input
capture
register
*
2
Capture input
source is channel
4/count clock
Input capture at TCNT4 count-up/
count-down*
1
1. When bits TPSC2 to TPSC0 in TCR4 are set to B'000 and φ/1 is used as
the TCNT4 count clock, this setting is invalid and input capture does not
occur.
2. When the BFB bit in TMDR3 is set to 1 and TGR3D is used as a buffer
register, this setting is invalid and input capture/output compare does not
occur.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1084 of 1268
REJ09B0220-0600
TIER3—Timer Interrupt Enable Register 3 H'FE84 TPU3
7
TTGE
0
R/W
6
—
1
—
5
—
0
—
4
TCIEV
0
R/W
3
TGIED
0
R/W
0
TGIEA
0
R/W
2
TGIEC
0
R/W
1
TGIEB
0
R/W
Bit
Initial value
Read/Write
:
:
:
0
1
A/D conversion start request generation disabled
A/D conversion start request generation enabled
A/D Conversion Start Request Enable
0
1
Interrupt request (TCIV) by TCFV disabled
Interrupt request (TCIV) by TCFV enabled
Overflow Interrupt Enable
TGR Interrupt Enable D
TGR Interrupt Enable C
TGR Interrupt Enable B
0
1
Interrupt request (TGIA)
by TGFA bit disabled
TGR Interrupt Enable A
0
1
0
1
0
1
Interrupt request (TGIA)
by TGFA bit enabled
Interrupt request (TGIB)
by TGFB bit disabled
Interrupt request (TGIB)
by TGFB bit enabled
Interrupt request (TGIC) by
TGFC bit disabled
Interrupt request (TGIC) by
TGFC bit enabled
Interrupt request (TGID) by TGFD
bit disabled
Interrupt request (TGID) by TGFD
bit enabled
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1085 of 1268
REJ09B0220-0600
TSR3—Timer Status Register 3 H'FE85 TPU3
7
—
1
—
6
—
1
—
5
—
0
—
4
TCFV
0
R/(W)*
3
TGFD
0
R/(W)*
0
TGFA
0
R/(W)*
2
TGFC
0
R/(W)*
1
TGFB
0
R/(W)*
Bit
Initial value
Read/Write
:
:
:
Note: * Can only be written with 0 for flag clearing.
0 [Clearing condition]
When 0 is written to TCFV after reading TCFV = 1
Overflow Flag
1 [Setting condition]
When the TCNT value overflows (changes from H'FFFF to H'0000 )
0 [Clearing conditions]
• When DTC is activated by TGID interrupt while DISEL bit of MRB in DTC
is 0
• When 0 is written to TGFD after reading TGFD = 1
Input Capture/Output Compare Flag D
1 [Setting conditions]
0 [Clearing conditions]
• When DTC is activated by TGIC interrupt while DISEL bit of MRB in
DTC is 0
• When 0 is written to TGFC after reading TGFC = 1
Input Capture/Output Compare Flag C
1 [Setting conditions]
0 [Clearing conditions]
• When DTC is activated by TGIB interrupt while DISEL bit
of MRB in DTC is 0
• When 0 is written to TGFB after reading TGFB = 1
Input Capture/Output Compare Flag B
1 [Setting conditions]
0 [Clearing conditions]
• When DTC is activated by TGIA interrupt while
DISEL bit of MRB in DTC is 0
• When DMAC is activated by TGIA interrupt while
DTA bit of DMABCR in DMAC*
1
is 1
• When 0 is written to TGFA after reading TGFA = 1
Input Capture/Output Compare Flag A
Note: 1. The DMAC is not supported in the H8S/2321.
1 [Setting conditions]
• When TCNT=TGRA while TGRA is function-
ing as output compare register
• When TCNT value is transferred to TGRA by
input capture signal while TGRA is functioning as
input capture register
• When TCNT = TGRB while TGRB is functioning as
output compare register
• When TCNT value is transferred to TGRB by input
capture signal while TGRB is functioning as input capture
register
• When TCNT = TGRC while TGRC is functioning as output compare
register
• When TCNT value is transferred to TGRC by input capture signal
while TGRC is functioning as input capture register
• When TCNT = TGRD while TGRD is functioning as output compare register
• When TCNT value is transferred to TGRD by input capture signal while
TGRD is functioning as input capture register
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1086 of 1268
REJ09B0220-0600
TCNT3—Timer Counter 3 H'FE86 TPU3
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
8
0
R/W
10
0
R/W
9
0
R/W
Bit
Initial value
Read/Write
:
:
:
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
0
0
R/W
2
0
R/W
1
0
R/W
Up-counter
TGR3A—Timer General Register 3A H'FE88 TPU3
TGR3B—Timer General Register 3B H'FE8A TPU3
TGR3C—Timer General Register 3C H'FE8C TPU3
TGR3D—Timer General Register 3D H'FE8E TPU3
15
1
R/W
14
1
R/W
13
1
R/W
12
1
R/W
11
1
R/W
8
1
R/W
10
1
R/W
9
1
R/W
Bit
Initial value
Read/Write
:
:
:
7
1
R/W
6
1
R/W
5
1
R/W
4
1
R/W
3
1
R/W
0
1
R/W
2
1
R/W
1
1
R/W
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1087 of 1268
REJ09B0220-0600
TCR4—Timer Control Register 4 H'FE9 0 TPU4
TCNT clearing disabled
TCNT cleared by TGRA compare match/input capture
TCNT cleared by TGRB compare match/input capture
Counter Clear
0
1
0
1
0
1
0
1
Clock Edge
0
1
—
Count at rising edge
Count at falling edge
Count at both edges
Internal clock: counts on
φ
/1
Internal clock: counts on
φ
/4
Internal clock: counts on
φ
/16
Internal clock: counts on
φ
/64
External clock: counts on TCLKA pin input
External clock: counts on TCLKC pin input
Internal clock: counts on
φ
/1024
Counts on TCNT5 overflow/underflow
Timer Prescaler
0
1
0
1
0
1
0
1
0
1
0
1
0
1
7
—
0
—
6
CCLR1
0
R/W
5
CCLR0
0
R/W
4
CKEG1
0
R/W
3
CKEG0
0
R/W
0
TPSC0
0
R/W
2
TPSC2
0
R/W
1
TPSC1
0
R/W
Bit
Initial value
Read/Write
:
:
:
Note: This setting is ignored when channel 4 is in phase
counting mode.
Note: * Synchronous operation setting is performed by setting
the SYNC bit in TSYR to 1.
Note: This setting is ignored when channel
4 is in phase counting mode.
TCNT cleared by counter clearing for another channel
performing synchronous clearing/synchronous operation*
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1088 of 1268
REJ09B0220-0600
TMDR4—Timer Mode Register 4 H'FE91 TPU4
0
1
Normal operation
Reserved
PWM mode 1
PWM mode 2
Phase counting mode 1
Phase counting mode 2
Phase counting mode 3
Phase counting mode 4
—
Mode
0
1
*
0
1
0
1
*
0
1
0
1
0
1
0
1
*
Note:
* : Don’t care
7
—
1
—
6
—
1
—
5
—
0
—
4
—
0
—
3
MD3
0
R/W
0
MD0
0
R/W
2
MD2
0
R/W
1
MD1
0
R/W
Bit
Initial value
Read/Write
:
:
:
MD3 is a reserved bit. In a write, it
should always be written with 0.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1089 of 1268
REJ09B0220-0600
TIOR4—Timer I/O Control Register 4 H'FE92 TPU4
7
IOB3
0
R/W
6
IOB2
0
R/W
5
IOB1
0
R/W
4
IOB0
0
R/W
3
IOA3
0
R/W
0
IOA0
0
R/W
2
IOA2
0
R/W
1
IOA1
0
R/W
Bit
Initial value
Read/Write
:
:
:
0
1
TGR4B
is output
compare
register
TGR4B I/O Control
0
1
0
1
0
1
0
1
0
1
*
0
1
0
1
0
1
0
1
0
1
*
*
TGR4A I/O Control
* : Don’t care
0
1
TGR4A
is output
compare
register
0
1
0
1
0
1
0
1
0
1
*
0
1
0
1
0
1
0
1
0
1
*
*
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
* : Don’t care
Initial output is 0
output
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
Initial output is 1
output
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
TGR4A
is input
capture
register
Capture input
source is
TIOCA
4
pin
Input capture at generation of
TGR3A compare match/input
capture
Capture input
source is TGR3A
compare match/
input capture
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
Initial output is 0
output
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
Initial output is 1
output
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
TGR4B
is input
capture
register
Capture input
source is
TIOCB
4
pin
Input capture at generation of
TGR3C compare match/input
capture
Capture input
source is TGR3C
compare match/
input capture
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1090 of 1268
REJ09B0220-0600
TIER4—Timer Interrupt Enable Register 4 H'FE94 TPU4
7
TTGE
0
R/W
6
—
1
—
5
TCIEU
0
R/W
4
TCIEV
0
R/W
3
—
0
—
0
TGIEA
0
R/W
2
—
0
—
1
TGIEB
0
R/W
Bit
Initial value
Read/Write
:
:
:
0
1
0
1
0
1
Interrupt request (TGIA)
by TGFA bit disabled
TGR Interrupt Enable A
0
1
0
1
Interrupt request (TGIA)
by TGFA bit enabled
Interrupt request (TGIB) by
TGFB bit disabled
Interrupt request (TGIB) by
TGFB bit enabled
TGR Interrupt Enable B
Interrupt request (TCIV) by TCFV disabled
Interrupt request (TCIV) by TCFV enabled
Overflow Interrupt Enable
Underflow Interrupt Enable
Interrupt request (TCIU) by TCFU disabled
Interrupt request (TCIU) by TCFU enabled
A/D Conversion Start Request Enable
A/D conversion start request generation disabled
A/D conversion start request generation enabled
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1091 of 1268
REJ09B0220-0600
TSR4—Timer Status Register 4 H'FE95 TPU4
7
TCFD
1
R
6
—
1
—
5
TCFU
0
R/(W)*
4
TCFV
0
R/(W)*
3
—
0
—
0
TGFA
0
R/(W)*
2
—
0
—
1
TGFB
0
R/(W)*
Bit
Initial value
Read/Write
:
:
:
0
1
TCNT counts down
TCNT counts up
Count Direction Flag
0 [Clearing condition]
When 0 is written to TCFU after reading TCFU = 1
Underflow Flag
1 [Setting condition]
When the TCNT value underflows (changes from H'0000 to H'FFFF)
0 [Clearing condition]
When 0 is written to TCFV after reading TCFV = 1
Overflow Flag
1 [Setting condition]
When the TCNT value overflows (changes from H'FFFF to H'0000)
0
Input Capture/Output Compare Flag B
1
0 [Clearing conditions]
• When DTC is activated by TGIA interrupt while
DISEL bit of MRB in DTC is 0
• When DMAC is activated by TGIA interrupt while
DTA bit of DMABCR in DMAC*
1
is 1
• When 0 is written to TGFA after reading TGFA = 1
Input Capture/Output Compare Flag A
1 [Setting conditions]
Note: * Can only be written with 0 for flag clearing.
• When TCNT = TGRA while TGRA is functioning
as output compare register
• When TCNT value is transferred to TGRA by
input capture signal while TGRA is functioning
as input capture register
[Clearing conditions]
• When DTC is activated by TGIB interrupt while DISEL
bit of MRB in DTC is 0
• When 0 is written to TGFB after reading TGFB = 1
[Setting conditions]
• When TCNT = TGRB while TGRB is functioning as
output compare register
• When TCNT value is transferred to TGRB by input
capture signal while TGRB is functioning as input
capture register
Note: 1. The DMAC is not supported in the H8S/2321.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1092 of 1268
REJ09B0220-0600
TCNT4—Timer Counter 4 H'FE96 TPU4
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
8
0
R/W
10
0
R/W
9
0
R/W
Bit
Initial value
Read/Write
:
:
:
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
0
0
R/W
2
0
R/W
1
0
R/W
Note: *This timer counter can be used as an up/down-counter only in phase counting
mode or when performing overflow/underflow counting on another channel. In
other cases it functions as an up-counter.
Up/down-counter*
TGR4A—Timer General Register 4A H'FE98 TPU4
TGR4B—Timer General Register 4B H'FE9A TPU4
15
1
R/W
14
1
R/W
13
1
R/W
12
1
R/W
11
1
R/W
8
1
R/W
10
1
R/W
9
1
R/W
Bit
Initial value
Read/Write
:
:
:
7
1
R/W
6
1
R/W
5
1
R/W
4
1
R/W
3
1
R/W
0
1
R/W
2
1
R/W
1
1
R/W
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1093 of 1268
REJ09B0220-0600
TCR5—Timer Control Register 5 H'FEA0 TPU5
TCNT clearing disabled
TCNT cleared by TGRA compare match/input capture
TCNT cleared by TGRB compare match/input capture
Counter Clear
0
1
0
1
0
1
Internal clock: counts on
φ
/1
Internal clock: counts on
φ
/4
Internal clock: counts on
φ
/16
Internal clock: counts on
φ
/64
External clock: counts on TCLKA pin input
External clock: counts on TCLKC pin input
Internal clock: counts on
φ
/256
External clock: counts on TCLKD pin input
Time Prescaler
0
1
0
1
0
1
0
1
0
1
0
1
0
1
7
—
0
—
6
CCLR1
0
R/W
5
CCLR0
0
R/W
4
CKEG1
0
R/W
3
CKEG0
0
R/W
0
TPSC0
0
R/W
2
TPSC2
0
R/W
1
TPSC1
0
R/W
Bit
Initial value
Read/Write
:
:
:
Note:
0
1
Clock Edge
0
1
—
Count at rising edge
Count at falling edge
Count at both edges
This setting is ignored when channel 5 is in phase
counting mode.
Note: *Synchronous operation setting is performed by setting
the SYNC bit in TSYR to 1.
Note: This setting is ignored when channel
5 is in phase counting mode.
TCNT cleared by counter clearing for another channel
performing synchronous clearing/synchronous operation*
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1094 of 1268
REJ09B0220-0600
TMDR5 —Timer Mode Register 5 H'FEA1 TPU5
0
1
Normal operation
Reserved
PWM mode 1
PWM mode 2
Phase counting mode 1
Phase counting mode 2
Phase counting mode 3
Phase counting mode 4
—
Mode
0
1
*
0
1
0
1
*
0
1
0
1
0
1
0
1
*
Note: MD3 is a reserved bit. In a write, it
should always be written with 0.
* : Don’t care
7
—
1
—
6
—
1
—
5
—
0
—
4
—
0
—
3
MD3
0
R/W
0
MD0
0
R/W
2
MD2
0
R/W
1
MD1
0
R/W
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1095 of 1268
REJ09B0220-0600
TIOR5—Timer I/O Control Register 5 H'FEA2 TPU5
7
IOB3
0
R/W
6
IOB2
0
R/W
5
IOB1
0
R/W
4
IOB0
0
R/W
3
IOA3
0
R/W
0
IOA0
0
R/W
2
IOA2
0
R/W
1
IOA1
0
R/W
Bit
Initial value
Read/Write
:
:
:
0
1
TGR5B I/O Control
0
1
*
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
*
0
1
TGR5A
is output
compare
register
TGR5A I/O Control
0
1
*
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
*
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
* : Don’t care
TGR5A
is input
capture
register
Initial output is 0
output
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
Initial output is 1
output
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Capture input
source is TIOCA
5
pin
TGR5B
is output
compare
register
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
* : Don’t care
TGR5B
is input
capture
register
Initial output is 0
output
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
Initial output is 1
output
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Capture input
source is TIOCB
5
pin
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1096 of 1268
REJ09B0220-0600
TIER5—Timer Interrupt Enable Register 5 H'FEA4 TPU5
7
TTGE
0
R/W
6
—
1
—
5
TCIEU
0
R/W
4
TCIEV
0
R/W
3
—
0
—
0
TGIEA
0
R/W
2
—
0
—
1
TGIEB
0
R/W
Bit
Initial value
Read/Write
:
:
:
0
1
A/D conversion start request generation disabled
A/D conversion start request generation enabled
A/D Conversion Start Request Enable
0
1
Interrupt request (TCIU) by TCFU disabled
Interrupt request (TCIU) by TCFU enabled
Underflow Interrupt Enable
TGR Interrupt Enable B
0
1
Interrupt request (TGIA)
by TGFA bit disabled
TGR Interrupt Enable A
0
1
0
1
Overflow Interrupt Enable
Interrupt request (TGIA)
by TGFA bit enabled
Interrupt request (TGIB)
by TGFB bit disabled
Interrupt request (TGIB)
by TGFB bit enabled
Interrupt request (TCIV) by TCFV disabled
Interrupt request (TCIV) by TCFV enabled
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1097 of 1268
REJ09B0220-0600
TSR5—Timer Status Register 5 H'FEA5 TPU5
7
TCFD
1
R
6
—
1
—
5
TCFU
0
R/(W)*
4
TCFV
0
R/(W)*
3
—
0
—
0
TGFA
0
R/(W)*
2
—
0
—
1
TGFB
0
R/(W)*
Bit
Initial value
Read/Write
:
:
:
0
1
TCNT counts down
TCNT counts up
Count Direction Flag
0
Underflow Flag
1
0
Overflow Flag
1
0
Input Capture/Output Compare Flag B
1
0 [Clearing conditions]
• When DTC is activated by TGIA interrupt while
DISEL bit of MRB in DTC is 0
• When DMAC is activated by TGIA interrupt while
DTA bit of DMABCR in DMAC*
1
is 1
• When 0 is written to TGFA after reading TGFA = 1
Input Capture/Output Compare Flag A
1 [Setting conditions]
• When TCNT = TGRA while TGRA is functioning
as output compare register
• When TCNT value is transferred to TGRA by
input capture signal while TGRA is functioning
as input capture register
Note: * Can only be written with 0 for flag clearing.
[Clearing conditions]
• When DTC is activated by TGIB interrupt while DISEL
bit of MRB in DTC is 0
• When 0 is written to TGFB after reading TGFB = 1
[Setting conditions]
• When TCNT = TGRB while TGRB is functioning as
output compare register
• When TCNT value is transferred to TGRB by input
capture signal while TGRB is functioning as input
capture register
[Clearing condition]
When 0 is written to TCFV after reading TCFV = 1
[Setting condition]
When the TCNT value overflows (changes from H'FFFF to H'0000 )
[Clearing condition]
When 0 is written to TCFU after reading TCFU = 1
[Setting condition]
When the TCNT value underflows (changes from H'0000 to H'FFFF)
Note: 1. The DMAC is not supported in the H8S/2321.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1098 of 1268
REJ09B0220-0600
TCNT5—Timer Counter 5 H'FEA6 TPU5
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
8
0
R/W
10
0
R/W
9
0
R/W
Bit
Initial value
Read/Write
:
:
:
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
0
0
R/W
2
0
R/W
1
0
R/W
Note: *This timer counter can be used as an up/down-counter only in phase counting
mode or when performing overflow/underflow counting on another channel. In
other cases it functions as an up-counter.
Up/down-counter*
TGR5A—Timer General Register 5A H'FEA8 TPU5
TGR5B—Timer General Register 5B H'FEAA TPU5
15
1
R/W
14
1
R/W
13
1
R/W
12
1
R/W
11
1
R/W
8
1
R/W
10
1
R/W
9
1
R/W
Bit
Initial value
Read/Write
:
:
:
7
1
R/W
6
1
R/W
5
1
R/W
4
1
R/W
3
1
R/W
0
1
R/W
2
1
R/W
1
1
R/W
P1DDR—Port 1 Data Direction Register H'FEB0 Port 1
7
P17DDR
0
W
6
P16DDR
0
W
5
P15DDR
0
W
4
P14DDR
0
W
3
P13DDR
0
W
0
P10DDR
0
W
2
P12DDR
0
W
1
P11DDR
0
W
Bit
Initial value
Read/Write
:
:
:
Specify input or output for individual port 1 pins
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1099 of 1268
REJ09B0220-0600
P2DDR—Port 2 Data Direction Register H'FEB1 Port 2
7
P27DDR
0
W
6
P26DDR
0
W
5
P25DDR
0
W
4
P24DDR
0
W
3
P23DDR
0
W
0
P20DDR
0
W
2
P22DDR
0
W
1
P21DDR
0
W
Specify input or output for individual port 2 pins
Bit
Initial value
Read/Write
:
:
:
P3DDR—Port 3 Data Direction Register H'FEB2 Port 3
7
—
Undefined
—
6
—
Undefined
—
5
P35DDR
0
W
4
P34DDR
0
W
3
P33DDR
0
W
0
P30DDR
0
W
2
P32DDR
0
W
1
P31DDR
0
W
Specify input or output for individual port 3 pins
Bit
Initial value
Read/Write
:
:
:
P5DDR—Port 5 Data Direction Register H'FEB4 Port 5
7
—
Undefined
—
6
—
Undefined
—
5
—
Undefined
—
4
—
Undefined
—
3
P53DDR
0
W
0
P50DDR
0
W
2
P52DDR
0
W
1
P51DDR
0
W
Specify input or output for individual port 5 pins
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1100 of 1268
REJ09B0220-0600
P6DDR—Port 6 Data Direction Register H'FEB5 Port 6
7
P67DDR
0
W
6
P66DDR
0
W
5
P65DDR
0
W
4
P64DDR
0
W
3
P63DDR
0
W
0
P60DDR
0
W
2
P62DDR
0
W
1
P61DDR
0
W
Specify input or output for individual port 6 pins
Bit
Initial value
Read/Write
:
:
:
PADDR—Port A Data Direction Register H'FEB9 Port A
7
PA7DDR
0
W
6
PA6DDR
0
W
5
PA5DDR
0
W
4
PA4DDR
0
W
3
PA3DDR
0
W
0
PA0DDR
0
W
2
PA2DDR
0
W
1
PA1DDR
0
W
Bit
Initial value
Read/Write
:
:
:
Specify input or output for individual port A pins
PBDDR—Port B Data Direction Register H'FEBA Port B
7
PB7DDR
0
W
6
PB6DDR
0
W
5
PB5DDR
0
W
4
PB4DDR
0
W
3
PB3DDR
0
W
0
PB0DDR
0
W
2
PB2DDR
0
W
1
PB1DDR
0
W
Specify input or output for individual port B pins
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1101 of 1268
REJ09B0220-0600
PCDDR—Port C Data Direction Register H'FEBB Port C
7
PC7DDR
0
W
6
PC6DDR
0
W
5
PC5DDR
0
W
4
PC4DDR
0
W
3
PC3DDR
0
W
0
PC0DDR
0
W
2
PC2DDR
0
W
1
PC1DDR
0
W
Specify input or output for individual port C pins
Bit
Initial value
Read/Write
:
:
:
PDDDR—Port D Data Direction Register H'FEBC Port D
7
PD7DDR
0
W
6
PD6DDR
0
W
5
PD5DDR
0
W
4
PD4DDR
0
W
3
PD3DDR
0
W
0
PD0DDR
0
W
2
PD2DDR
0
W
1
PD1DDR
0
W
Bit
Initial value
Read/Write
:
:
:
Specify input or output for individual port D pins
PEDDR—Port E Data Direction Register H'FEBD Port E
7
PE7DDR
0
W
6
PE6DDR
0
W
5
PE5DDR
0
W
4
PE4DDR
0
W
3
PE3DDR
0
W
0
PE0DDR
0
W
2
PE2DDR
0
W
1
PE1DDR
0
W
Specify input or output for individual port E pins
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1102 of 1268
REJ09B0220-0600
PFDDR—Port F Data Direction Register H'FEBE Port F
7
PF7DDR
1
W
0
W
6
PF6DDR
0
W
0
W
5
PF5DDR
0
W
0
W
4
PF4DDR
0
W
0
W
3
PF3DDR
0
W
0
W
0
PF0DDR
0
W
0
W
2
PF2DDR
0
W
0
W
1
PF1DDR
0
W
0
W
Specify input or output for individual port F pins
Bit
Modes 4 to 6
Initial value
Read/Write
Mode 7
Initial value
Read/Write
:
:
:
:
:
PGDDR—Port G Data Direction Register H'FEBF Port G
7
—
Undefined
—
Undefined
—
6
—
Undefined
—
Undefined
—
5
—
Undefined
—
Undefined
—
4
PG4DDR
1
W
0
W
3
PG3DDR
0
W
0
W
0
PG0DDR
0
W
0
W
2
PG2DDR
0
W
0
W
1
PG1DDR
0
W
0
W
Specify input or output for individual port G pins
Bit
Modes 4 and 5
Initial value
Read/Write
Modes 6 and 7
Initial value
Read/Write
:
:
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1103 of 1268
REJ09B0220-0600
IPRA — Interrupt P r iority Register A H'FEC4 Interrupt Controller
IPRB — Interrupt P r iority Register B H'FEC5 Interrupt Controller
IPRC — Interrupt P r iority Register C H'FEC6 Interrupt Controller
IPRD — Interrupt P r iority Register D H'FEC7 Interrupt Controller
IPRE — Interrupt P r iority Register E H'FEC8 Interrupt Controller
IPRF — Interrupt Priority Register F H'FEC9 Interrupt Controller
IPRG — Interrupt Priority Register G H'FECA Interrupt Controller
IPRH — Interrupt Priority Register H H'FECB Interrupt Controller
IPRI — Int e r r upt Priorit y Register I H'FECC Interrupt Controller
IPRJ — Interrupt Prior ity Regist er J H'FECD Interrupt Controller
IPRK — Interrupt Priority Register K H'FECE Interrupt Controller
7
—
0
—
6
IPR6
1
R/W
5
IPR5
1
R/W
4
IPR4
1
R/W
3
—
0
—
0
IPR0
1
R/W
2
IPR2
1
R/W
1
IPR1
1
R/W
Set priority (levels 7 to 0) for interrupt sources
IPRA
IPRB
IPRC
IPRD
IPRE
IPRF
IPRG
IPRH
IPRI
IPRJ
IPRK
Register
Bits
IRQ0
IRQ2
IRQ3
IRQ6
IRQ7
WDT
—
*1
TPU channel 0
TPU channel 2
TPU channel 4
8-bit timer channel 0
DMAC
*2
SCI channel 1
IRQ1
IRQ4
IRQ5
DTC
Refresh timer
*2
A/D converter
TPU channel 1
TPU channel 3
TPU channel 5
8-bit timer channel 1
SCI channel 0
SCI channel 2
6 to 4 2 to 0
Correspondence between Interrupt Sources and IPR Settings
Notes: 1.
2. Reserved bits.
Reserved bit in the H8S/2321.
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1104 of 1268
REJ09B0220-0600
ABWCR—Bus Width Control Reg ister H'FED0 Bus Co ntroller
7
ABW7
1
R/W
0
R/W
6
ABW6
1
R/W
0
R/W
5
ABW5
1
R/W
0
R/W
4
ABW4
1
R/W
0
R/W
3
ABW3
1
R/W
0
R/W
0
ABW0
1
R/W
0
R/W
2
ABW2
1
R/W
0
R/W
1
ABW1
1
R/W
0
R/W
Bit
Modes 5 to 7
Initial value
R/W
Mode 4
Initial value
Read/Write
:
:
:
:
:
Area 7 to 0 Bus Width Control
0
1
Area n is designated for 16-bit access
Area n is designated for 8-bit access
(n = 7 to 0)
ASTCR—Access State Control Register H'FED1 Bus Controller
7
AST7
1
R/W
6
AST6
1
R/W
5
AST5
1
R/W
4
AST4
1
R/W
3
AST3
1
R/W
0
AST0
1
R/W
2
AST2
1
R/W
1
AST1
1
R/W
Bit
Initial value
Read/Write
:
:
:
Area 7 to 0 Access State Control
0
1
Area n is designated for 2-state access
Wait state insertion in area n external space is disabled
Area n is designated for 3-state access
Wait state insertion in area n external space is enabled
(n = 7 to 0)
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1105 of 1268
REJ09B0220-0600
WCRH—Wait Control Register H H'FED2 Bus Controller
7
W71
1
R/W
6
W70
1
R/W
5
W61
1
R/W
4
W60
1
R/W
3
W51
1
R/W
0
W40
1
R/W
2
W50
1
R/W
1
W41
1
R/W
Bit
Initial value
Read/Write
:
:
:
Area 7 Wait Control
Area 6 Wait Control
Area 5 Wait Control
Area 4 Wait Control
0
1
0
1
0
1
Program wait not inserted
1 program wait state inserted
2 program wait states inserted
3 program wait states inserted
0
1
0
1
0
1
Program wait not inserted
1 program wait state inserted
2 program wait states inserted
3 program wait states inserted
0
1
0
1
0
1
Program wait not inserted
1 program wait state inserted
2 program wait states inserted
3 program wait states inserted
0
1
0
1
0
1
Program wait not inserted
1 program wait state inserted
2 program wait states inserted
3 program wait states inserted
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1106 of 1268
REJ09B0220-0600
WCRL—Wait Control Reg ister L H'FED3 Bus Contro ller
7
W31
1
R/W
6
W30
1
R/W
5
W21
1
R/W
4
W20
1
R/W
3
W11
1
R/W
0
W00
1
R/W
2
W10
1
R/W
1
W01
1
R/W
Bit
Initial value
Read/Write
:
:
:
Area 3 Wait Control
Area 2 Wait Control
Area 1 Wait Control
Area 0 Wait Control
0
1
0
1
0
1
Program wait not inserted
1 program wait state inserted
2 program wait states inserted
3 program wait states inserted
0
1
0
1
0
1
Program wait not inserted
1 program wait state inserted
2 program wait states inserted
3 program wait states inserted
0
1
0
1
0
1
Program wait not inserted
1 program wait state inserted
2 program wait states inserted
3 program wait states inserted
0
1
0
1
0
1
Program wait not inserted
1 program wait state inserted
2 program wait states inserted
3 program wait states inserted
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1107 of 1268
REJ09B0220-0600
BCRH—Bus Control Register H H'FED4 Bus Controller
7
ICIS1
1
R/W
6
ICIS0
1
R/W
5
BRSTRM
0
R/W
4
BRSTS1
1
R/W
3
BRSTS0
0
R/W
0
RMTS0
0
R/W
2
RMTS2
0
R/W
1
RMTS1
0
R/W
Bit
Initial value
Read/Write
:
:
:
Idle Cycle Insert 1
0
1Idle cycle not inserted in case of successive external read cycles in different areas
Idle cycle inserted in case of successive external read cycles in different areas
Idle Cycle Insert 0
0
1Idle cycle not inserted in case of successive external read and external write cycles
Idle cycle inserted in case of successive external read and external write cycles
Area 0 Burst ROM Enable
0
1Basic bus interface
Burst ROM interface
Burst Cycle Select 1
0
1Burst cycle comprises 1 state
Burst cycle comprises 2 states
Burst Cycle Select 0
0
1Max. 4 words in burst access
Max. 8 words in burst access
RAM Type Select
RMTS2
0
1
RMTS1
0
1
—
RMTS0
0
1
0
1
—
Area 5 Area 4 Area 3 Area 2
Normal space
DRAM
space
Normal space
DRAM spaceNormal space
DRAM space
—
RMTS2
0
RMTS1
0
1
RMTS0
0
1
0
1
Area 5 Area 4 Area 3 Area 2
Normal space
DRAM space
(8-bit bus)
DRAM space
(8-bit bus)
DRAM space
(8-bit bus)
Normal space
(16-bit bus)
Normal space
(16-bit bus)
Notes: 1. When areas selected in DRAM
space are all 8-bit space, the PF2
pin can be used as an I/O port,
BREQO, or WAIT. When PF2 is
used as the WAIT pin in the
H8S/2323, normal space other than
DRAM space should be designated
as 16-bit-bus space. RAS down
mode cannot be used when this
setting is made. Sample settings
are shown below.
2. In the H8S/2321 these bits are reserved
and should only be written with 0.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1108 of 1268
REJ09B0220-0600
BCRL—Bus Contro l Register L H'FED5 Bus Controller
7
BRLE
0
R/W
6
BREQOE
0
R/W
5
EAE
1
R/W
4
—
1
R/W
3
DDS
1
R/W
0
WAITE
0
R/W
2
—
1
R/W
1
WDBE
0
R/W
Bit
Initial value
Read/Write
:
:
:
Bus Release Enable
0
1
External bus release disabled
External bus release enabled
BREQO Pin Enable
0
1
BREQO output disabled
BREQO* output enabled
0
1
• In the H8S/2329B, H8S/2328*3, and H8S/2326, addresses H'010000 to
H'03FFFF*2 are on-chip ROM
• In the H8S/2327, addresses H'010000 to H'01FFFF are on-chip ROM,
and addresses H'020000 to H'03FFFF are a reserved area*1
• In the H8S/2323, addresses H'010000 to H'03FFFF are a reserved area*1
Addresses H'010000 to H'03FFFF*2 are external addresses
in external expanded mode or reserved area*2 in single-chip mode
Reserved
Only 1 should be written to this bit
External Addresses H'010000 to H'03FFFF Enable
Write Data Buffer Enable
0
1
WAIT Pin Enable
0
1
Wait input by WAIT
pin* disabled
Wait input by WAIT
pin* enabled
Write data buffer function
not used
Write data buffer function
used
Reserved
Only 1 should be written to this bit
Notes: 1. Do not access a reserved area.
2. Address H'010000 to H'03FFFF in the H8S/2328.
Address H'010000 to H'05FFFF in the H8S/2329B.
Address H'010000 to H'07FFFF in the H8S/2326.
3. H8S/2328B in flash memory version.
DACK Timing Select
When DMAC single address transfer is performed in
DRAM space, full access is always executed. DACK
signal goes low from Tr or T1 cycle
0
1 Burst access is possible when DMAC single address
transfer is performed in DRAM space. DACK signal
goes low from Tc1 or T2 cycle
Note: * The WAIT input pin
can be switched
between PF
2
and
P5
3
by means of
WAITPS.
Note: * The BREQO output pin can be switched between
PF
2
and P5
3
by means of BREQOPS.
Note: In the H8S/2321 this bit is reserved and should only
be written with 1.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1109 of 1268
REJ09B0220-0600
MCR—Me mory Control Regist er H'FED6 Bus Controller
(Not supported in H8S/2321)
7
TPC
0
R/W
6
BE
0
R/W
5
RCDM
0
R/W
4
—
0
R/W
3
MXC1
0
R/W
0
RLW0
0
R/W
2
MXC0
0
R/W
1
RLW1
0
R/W
Bit
Initial value
Read/Write
:
:
:
TP Cycle Control
0
1
1-state precharge cycle is inserted
2-state precharge cycle is inserted
Burst Access Enable
0
1
Burst disabled (always full access)
RAS Down Mode
0
1
RAS up mode selected for DRAM interface
RAS down mode selected for DRAM interface
Reserved
Multiplex Shift Count
0
1
8-bit shift
9-bit shift
10-bit shift
—
0
1
0
1
Refresh Cycle Wait Control
0
1
No wait state inserted
1 wait state inserted
2 wait states inserted
3 wait states inserted
0
1
0
1
For DRAM space access, access in fast page mode
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1110 of 1268
REJ09B0220-0600
DRAMCR—DRAM Control Register H'FED7 Bus Controller
(Not supported in H8S/2321)
7
RFSHE
0
R/W
6
RCW
0
R/W
5
RMODE
0
R/W
4
CMF
0
R/W
3
CMIE
0
R/W
0
CKS0
0
R/W
2
CKS2
0
R/W
1
CKS1
0
R/W
Bit
Initial value
Read/Write
:
:
:
Refresh Control
0
1
Refresh control is not performed
Refresh control is performed
RAS-CAS Wait
0 Wait state insertion in CAS-before-RAS refreshing disabled
RAS falls in T
r
cycle
Refresh Mode
0
1
Self-refreshing is not performed in software standby mode
Self-refreshing is performed in software standby mode
Compare Match Flag
0
1
[Clearing condition]
When 0 is written to CMF after reading CMF = 1
[Setting condition]
When RTCNT = RTCOR
Compare Match Interrupt Enable
0
1
Interrupt request (CMI) by CMF flag disabled
Interrupt request (CMI) by CMF flag enabled
Refresh Counter Clock Select
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Count operation disabled
Count uses φ/2
Count uses φ/8
Count uses φ/32
Count uses φ/128
Count uses φ/512
Count uses φ/2048
Count uses φ/4096
One wait state inserted in CAS-before-RAS refreshing
RAS falls in T
c1
cycle
1
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1111 of 1268
REJ09B0220-0600
RTCNT—Refresh Timer Counter H'FED8 Bus Controller
(Not supported in H8S/2321)
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
0
0
R/W
2
0
R/W
1
0
R/W
Bit
Initial value
Read/Write
:
:
:
Internal clock count value
RTCOR—Refresh Ti me Co nsta nt Register H'FED9 B us Co ntroller
(Not supported in H8S/2321)
7
1
R/W
6
1
R/W
5
1
R/W
4
1
R/W
3
1
R/W
0
1
R/W
2
1
R/W
1
1
R/W
Sets the period for compare match operations with RTCNT
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1112 of 1268
REJ09B0220-0600
RAMER—RAM Emulation Register H'FEDB Bus Controller
(Valid only in F-ZTAT version)
7
—
0
—
6
—
0
—
5
—
0
—
4
—
0
—
3
RAMS
0
R/W
0
RAM0
0
R/W
2
RAM2
0
R/W
1
RAM1
0
R/W
Bit
Initial value
Read/Write
:
:
:
RAM2
*
0
1
RAMS
0
1
RAM Select, Flash Memory Area Select
RAM1
*
0
1
0
1
RAM0
*
0
1
0
1
0
1
0
1
RAM Area Block Name
*: Don't care
H'FFDC00 to H'FFEBFF
H'000000 to H'000FFF
H'001000 to H'001FFF
H'002000 to H'002FFF
H'003000 to H'003FFF
H'004000 to H'004FFF
H'005000 to H'005FFF
H'006000 to H'006FFF
H'007000 to H'007FFF
RAM area, 4 kbytes
EB0 (4 kbytes)
EB1 (4 kbytes)
EB2 (4 kbytes)
EB3 (4 kbytes)
EB4 (4 kbytes)
EB5 (4 kbytes)
EB6 (4 kbytes)
EB7 (4 kbytes)
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1113 of 1268
REJ09B0220-0600
MAR0AH—Memory Address Register 0AH H'FEE0 DMAC
(Not supported in H8S/2321)
MAR0 AL—Memory Address Register 0AL H'FEE2 DMAC
(Not supported in H8S/2321)
16
*
R/W
18
*
R/W
17
*
R/W
Bit
MAR0AH
Initial value
Read/Write
:
:
:
:
19
*
R/W
21
*
R/W
22
*
R/W
23
*
R/W
24
—
0
—
25
—
0
—
26
—
0
—
27
—
0
—
28
—
0
—
29
—
0
—
30
—
0
—
31
—
0
—
0
*
R/W
2
*
R/W
1
*
R/W
3
*
R/W
4
*
R/W
5
*
R/W
6
*
R/W
7
*
R/W
8
*
R/W
9
*
R/W
10
*
R/W
11
*
R/W
12
*
R/W
13
*
R/W
14
*
R/W
15
*
R/W
20
*
R/W
* : Undefined
Bit
MAR0AL
Initial value
Read/Write
:
:
:
:
In short address mode: Specifies transfer source/transfer destination address
In full address mode: Specifies transfer source address
IOAR0A—I/O Addres s Register 0A H'FEE4 DMAC
(Not supported in H8S/2321)
0
*
R/W
2
*
R/W
1
*
R/W
3
*
R/W
4
*
R/W
5
*
R/W
6
*
R/W
7
*
R/W
8
*
R/W
9
*
R/W
10
*
R/W
11
*
R/W
12
*
R/W
13
*
R/W
14
*
R/W
15
*
R/W
* : Undefined
In short address mode: Specifies transfer source/transfer destination address
In full address mode: Not used
Bit
IOAR0A
Initial value
Read/Write
:
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1114 of 1268
REJ09B0220-0600
ETCR0A—Transfer Count Register 0A H'FEE6 DMAC
(Not supported in H8S/2321)
0
*
R/W
2
*
R/W
1
*
R/W
3
*
R/W
4
*
R/W
5
*
R/W
6
*
R/W
7
*
R/W
8
*
R/W
9
*
R/W
10
*
R/W
11
*
R/W
12
*
R/W
13
*
R/W
14
*
R/W
15
*
R/W
* : Undefined
Transfer counter
Sequential
mode
Idle mode
Normal mode
Transfer number storage register Transfer counter
Block size storage register Block size counter
Bit
ETCR0A
Initial value
Read/Write
:
:
:
:
Block transfer
mode
Repeat mode
MAR0BH —Memory Address Register 0BH H'FEE8 DMAC
(Not supported in H8S/2321)
MAR0BL—Memory Address Reg ister 0 BL H'FEEA DMAC
(Not supported in H8S/2321)
16
*
R/W
18
*
R/W
17
*
R/W
19
*
R/W
21
*
R/W
22
*
R/W
23
*
R/W
24
—
0
—
25
—
0
—
26
—
0
—
27
—
0
—
28
—
0
—
29
—
0
—
30
—
0
—
31
—
0
—
0
*
R/W
2
*
R/W
1
*
R/W
3
*
R/W
4
*
R/W
5
*
R/W
6
*
R/W
7
*
R/W
8
*
R/W
9
*
R/W
10
*
R/W
11
*
R/W
12
*
R/W
13
*
R/W
14
*
R/W
15
*
R/W
20
*
R/W
* : Undefined
In short address mode: Specifies transfer source/transfer destination address
In full address mode: Specifies transfer destination address
Bit
MAR0BH
Initial value
Read/Write
:
:
:
:
:
:
:
:
Bit
MAR0BL
Initial value
Read/Write
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1115 of 1268
REJ09B0220-0600
IOAR0B—I/O Addre ss Register 0B H'FEEC DMAC
(Not supported in H8S/2321)
0
*
R/W
2
*
R/W
1
*
R/W
3
*
R/W
4
*
R/W
5
*
R/W
6
*
R/W
7
*
R/W
8
*
R/W
9
*
R/W
10
*
R/W
11
*
R/W
12
*
R/W
13
*
R/W
14
*
R/W
15
*
R/W
* : Undefined
In short address mode: Specifies transfer source/transfer destination address
In full address mode: Not used
Bit
IOAR0B
Initial value
Read/Write
:
:
:
:
ETCR0B—Transfer Count Register 0B H'FEEE DMAC
(Not supported in H8S/2321)
0
*
R/W
2
*
R/W
1
*
R/W
3
*
R/W
4
*
R/W
5
*
R/W
6
*
R/W
7
*
R/W
8
*
R/W
9
*
R/W
10
*
R/W
11
*
R/W
12
*
R/W
13
*
R/W
14
*
R/W
15
*
R/W
* : Undefined
Transfer counter
Sequential
mode and
idle mode
Repeat mode
Block transfer
mode
Transfer number storage register Transfer counter
Block transfer counter
Note: Not used in normal mode.
Bit
ETCR0B
Initial value
Read/Write
:
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1116 of 1268
REJ09B0220-0600
MAR1AH—Memory Address Register 1AH H'FEF0 DMAC
(Not supported in H8S/2321)
MAR1 AL—Memory Address Register 1AL H'FEF2 DMAC
(Not supported in H8S/2321)
16
*
R/W
18
*
R/W
17
*
R/W
19
*
R/W
21
*
R/W
22
*
R/W
23
*
R/W
24
—
0
—
25
—
0
—
26
—
0
—
27
—
0
—
28
—
0
—
29
—
0
—
30
—
0
—
31
—
0
—
0
*
R/W
2
*
R/W
1
*
R/W
3
*
R/W
4
*
R/W
5
*
R/W
6
*
R/W
7
*
R/W
8
*
R/W
9
*
R/W
10
*
R/W
11
*
R/W
12
*
R/W
13
*
R/W
14
*
R/W
15
*
R/W
20
*
R/W
* : Undefined
In short address mode: Specifies transfer source/transfer destination address
In full address mode: Specifies transfer source address
Bit
MAR1AH
Initial value
Read/Write
:
:
:
:
Bit
MAR1AL
Initial value
Read/Write
:
:
:
:
IOAR1A—I/O Address Register 1A H'FEF4 DMAC
(Not supported in H8S/2321)
0
*
R/W
2
*
R/W
1
*
R/W
3
*
R/W
4
*
R/W
5
*
R/W
6
*
R/W
7
*
R/W
8
*
R/W
9
*
R/W
10
*
R/W
11
*
R/W
12
*
R/W
13
*
R/W
14
*
R/W
15
*
R/W
* : Undefined
In short address mode: Specifies transfer source/transfer destination address
In full address mode: Not used
Bit
IOAR1A
Initial value
Read/Write
:
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1117 of 1268
REJ09B0220-0600
ETCR1A—Transfer Count Register 1A H'FEF6 DMAC
(Not supported in H8S/2321)
0
*
R/W
2
*
R/W
1
*
R/W
3
*
R/W
4
*
R/W
5
*
R/W
6
*
R/W
7
*
R/W
8
*
R/W
9
*
R/W
10
*
R/W
11
*
R/W
12
*
R/W
13
*
R/W
14
*
R/W
15
*
R/W
* : Undefined
Transfer counter
Sequential mode
Idle mode
Normal mode
Repeat mode
Block transfer mode
Transfer number storage register Transfer counter
Block size storage register Block size counter
Bit
ETCR1A
Initial value
Read/Write
:
:
:
:
MAR1BH—Memory Address Register 1B H H'FEF8 DMAC
(Not supported in H8S/2321)
MAR1BL—Memory Address Register 1 BL H'FEFA DMAC
(Not supported in H8S/2321)
16
*
R/W
18
*
R/W
17
*
R/W
19
*
R/W
21
*
R/W
22
*
R/W
23
*
R/W
24
—
0
—
25
—
0
—
26
—
0
—
27
—
0
—
28
—
0
—
29
—
0
—
30
—
0
—
31
—
0
—
0
*
R/W
2
*
R/W
1
*
R/W
3
*
R/W
4
*
R/W
5
*
R/W
6
*
R/W
7
*
R/W
8
*
R/W
9
*
R/W
10
*
R/W
11
*
R/W
12
*
R/W
13
*
R/W
14
*
R/W
15
*
R/W
20
*
R/W
* : Undefined
In short address mode: Specifies transfer source/transfer destination address
In full address mode: Specifies transfer destination address
Bit
MAR1BH
Initial value
Read/Write
:
:
:
:
Bit
MAR1BL
Initial value
Read/Write
:
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1118 of 1268
REJ09B0220-0600
IOAR1B—I/O Address Register 1B H'FEFC DMAC
(Not supported in H8S/2321)
0
*
R/W
2
*
R/W
1
*
R/W
3
*
R/W
4
*
R/W
5
*
R/W
6
*
R/W
7
*
R/W
8
*
R/W
9
*
R/W
10
*
R/W
11
*
R/W
12
*
R/W
13
*
R/W
14
*
R/W
15
*
R/W
* : Undefined
In short address mode: Specifies transfer source/transfer destination address
In full address mode: Not used
Bit
IOAR1B
Initial value
Read/Write
:
:
:
:
ETCR1B—Tra nsfer Co unt Register 1B H'FEFE DMAC
(Not supported in H8S/2321)
0
*
R/W
2
*
R/W
1
*
R/W
3
*
R/W
4
*
R/W
5
*
R/W
6
*
R/W
7
*
R/W
8
*
R/W
9
*
R/W
10
*
R/W
11
*
R/W
12
*
R/W
13
*
R/W
14
*
R/W
15
*
R/W
Bit
ETCR1B
Initial value
Read/Write
:
:
:
:
* : Undefined
Transfer counter
Sequential mode
and idle mode
Repeat mode
Block transfer mode
Transfer number storage register Transfer counter
Block transfer counter
Note: Not used in normal mode.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1119 of 1268
REJ09B0220-0600
DMAWER—DMA Write Enable Register H'FF00 DM AC
(Not supported in H8S/2321)
7
—
0
—
6
—
0
—
5
—
0
—
4
—
0
—
3
WE1B
0
R/W
0
WE0A
0
R/W
2
WE1A
0
R/W
1
WE0B
0
R/W
Bit
DMAWER
Initial value
Read/Write
:
:
:
:
0
1
Write Enable 1B
0
1
Write Enable 1A
0
1
Writes to all bits in DMACR0A,
and bits 8, 4, and 0 in DMABCR
are disabled
Write Enable 0A
0
1
Write Enable 0B
Writes to all bits in DMACR0A,
and bits 8, 4, and 0 in DMABCR
are enabled
Writes to all bits in DMACR0B, bits 9,
5, and 1 in DMABCR, and bit 4 in
DMATCR are disabled
Writes to all bits in DMACR0B, bits 9,
5, and 1 in DMABCR, and bit 4 in
DMATCR are enabled
Writes to all bits in DMACR1A, and bits
10, 6, and 2 in DMABCR are disabled
Writes to all bits in DMACR1A, and bits
10, 6, and 2 in DMABCR are enabled
Writes to all bits in DMACR1B, bits 11, 7, and 3 in
DMABCR, and bit 5 in DMATCR are disabled
Writes to all bits in DMACR1B, bits 11, 7, and 3 in
DMABCR, and bit 5 in DMATCR are enabled
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1120 of 1268
REJ09B0220-0600
DMATCR—DMA Terminal Contro l Register H'FF0 1 DMAC
(Not supported in H8S/2321)
7
—
0
—
6
—
0
—
5
TEE1
0
R/W
4
TEE0
0
R/W
3
—
0
—
0
—
0
—
2
—
0
—
1
—
0
—
Bit
DMATCR
Initial value
Read/Write
:
:
:
:
Transfer End Enable 1
0
1
Transfer End Enable 0
0
1
TEND
0
pin output disabled
TEND
0
pin output enabled
TEND
1
pin output disabled
TEND
1
pin output enabled
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1121 of 1268
REJ09B0220-0600
DMACR0A—DMA Control Register 0A H'FF02 DMAC
(Not supported in H8S/2321)
DMACR0B—DMA Control Register 0B H'FF03 DMAC
(Not supported in H8S/2321)
DMACR1A—DMA Control Register 1A H'FF04 DMAC
(Not supported in H8S/2321)
DMACR1B—DMA Control Register 1B H'FF05 DMAC
(Not supported in H8S/2321)
15
DTSZ
0
R/W
14
SAID
0
R/W
13
SAIDE
0
R/W
12
BLKDIR
0
R/W
11
BLKE
0
R/W
8
—
0
R/W
10
—
0
R/W
9
—
0
R/W
0
1
Byte-size transfer
Word-size transfer
Data Transfer Size
0
1
Source Address Increment/Decrement
0
1
0
1
MARA is fixed
MARA is incremented after a data transfer
MARA is fixed
MARA is decremented after a data transfer
0
1
Block Direction/Block Enable
Reserved
Only 0 should be written
to these bits
0
1
0
1
Transfer in normal mode
Transfer in block transfer mode, destination side is block area
Transfer in normal mode
Transfer in block transfer mode, source side is block area
Full address mode
Bit
DMACRA
Initial value
Read/Write
:
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1122 of 1268
REJ09B0220-0600
7
—
0
R/W
6
DAID
0
R/W
5
DAIDE
0
R/W
4
—
0
R/W
3
DTF3
0
R/W
0
DTF0
0
R/W
2
DTF2
0
R/W
1
DTF1
0
R/W
0
1
Destination Address Increment/Decrement
0
1
0
1
MARB is fixed
MARB is incremented after a data transfer
MARB is fixed
MARB is decremented after a data transfer
——
—
—
—
Auto-request (burst)
—
—
—
—
—
—
—
—
Activated by A/D converter conversion
end interrupt
Activated by DREQ pin falling edge input
Activated by DREQ pin low-level input
Activated by SCI channel 0 transmission
data-empty interrupt
Activated by SCI channel 0 reception
data-full interrupt
Activated by SCI channel 1 transmission
data-empty interrupt
Activated by SCI channel 1 reception
data-full interrupt
Activated by TPU channel 0 compare
match/input capture A interrupt
Activated by TPU channel 1 compare
match/input capture A interrupt
Activated by TPU channel 2 compare
match/input capture A interrupt
Activated by TPU channel 3 compare
match/input capture A interrupt
Activated by TPU channel 4 compare
match/input capture A interrupt
Activated by TPU channel 5 compare
match/input capture A interrupt
0
1
Data Transfer Factor
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Block Transfer Mode
DTF
3DTF
2DTF
1DTF
0
Normal Mode
—
—
Activated by DREQ
pin falling edge input
Activated by DREQ
pin low-level input
Full address mode (cont)
Bit
DMACRB
Initial value
Read/Write
:
:
:
:
Auto-request (cycle
steal)
Reserved
Only 0 should be
written to this bit
Reserved
Only 0 should be
written to this bit
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1123 of 1268
REJ09B0220-0600
7
DTSZ
0
R/W
6
DTID
0
R/W
5
RPE
0
R/W
4
DTDIR
0
R/W
3
DTF3
0
R/W
0
DTF0
0
R/W
2
DTF2
0
R/W
1
DTF1
0
R/W
Short address mode
Bit
DMACR
Initial value
Read/Write
:
:
:
:
0—
Data Transfer Factor
0 0 0
Channel A Channel B
Activated by TPU channel 5 compare
match/input capture A interrupt
Activated by TPU channel 4 compare
match/input capture A interrupt
Activated by TPU channel 3 compare
match/input capture A interrupt
Activated by TPU channel 2 compare
match/input capture A interrupt
Activated by TPU channel 1 compare
match/input capture A interrupt
Activated by TPU channel 0 compare
match/input capture A interrupt
Activated by SCI channel 1 reception
data-full interrupt
Activated by SCI channel 1 transmission
data-empty interrupt
Activated by SCI channel 0 reception
data-full interrupt
Activated by SCI channel 0 transmission
data-empty interrupt
—
Activated by A/D converter conversion
end interrupt
1
0
1
0
1
0
1
0
0
1
0
1
0
1
0
1
0
1
1
10
1
1
10
1—
—
Dual address mode: Transfer with
MAR as source address and IOAR
as destination address
Single address mode: Transfer with
MAR as source address and DACK
pin as write strobe
0
1
Byte-size transfer
Word-size transfer
Data Transfer Size
0
1
MAR is incremented after a data transfer
MAR is decremented after a data transfer
Data Transfer Increment/Decrement
0
1
Transfer in sequential mode
Transfer in repeat mode or idle mode
Repeat Enable
0
1
Data Transfer Direction
Dual address mode: Transfer with
IOAR as source address and MAR
as destination address
Single address mode: Transfer with
DACK pin as read strobe and MAR
as destination address
Activated by DREQ pin
falling edge input
Activated by DREQ pin
low-level input
—
DTF
3DTF
2DTF
1DTF
0
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1124 of 1268
REJ09B0220-0600
DMAB CRH — DMA Band Co ntrol Register H'FF06 DMAC
(Not supported in H8S/2321)
DMAB CRL — DMA Band Contro l Reg ister H'FF07 DMAC
(Not supported in H8S/2321)
15
FAE1
0
R/W
14
FAE0
0
R/W
13
—
0
R/W
12
—
0
R/W
11
DTA1
0
R/W
8
—
0
R/W
10
—
0
R/W
9
DTA0
0
R/W
Full address mode
Bit
DMABCRH
Initial value
Read/Write
:
:
:
:
0
1
Short address mode
Full address mode
Channel 1 Full Address Enable
0
1
Short address mode
Full address mode
Channel 0 Full Address Enable
0 Clearing of selected internal interrupt source
at time of DMA transfer is disabled
Channel 1 Data Transfer Acknowledge
1Clearing of selected internal interrupt source
at time of DMA transfer is enabled
0 Clearing of selected internal interrupt source
at time of DMA transfer is disabled
Channel 0 Data Transfer Acknowledge
Reserved
Only 0 should be written to this bit
Reserved
Only 0 should be written to this bit
Reserved
Only 0 should be written to these bits
1Clearing of selected internal interrupt source
at time of DMA transfer is enabled
(Continue d on next p age)
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1125 of 1268
REJ09B0220-0600
0 Data transfer disabled. In burst mode,
cleared to 0 by an NMI interrupt
Channel 1 Data Transfer Master Enable
1
Channel 1 Data Transfer Enable
0
1
Data transfer disabled
Data transfer enabled
Channel 0 Data Transfer Master Enable
0
1
Data transfer disabled
Data transfer enabled
Channel 0 Data Transfer Enable
Channel 1 Data Transfer Interrupt
Enable B
Channel 1 Data Transfer
Interrupt Enable A
Channel 0 Data Transfer
Interrupt Enable A
7
DTME1
0
R/W
6
DTE1
0
R/W
5
DTME0
0
R/W
4
DTE0
0
R/W
3
DTIE1B
0
R/W
0
DTIE0A
0
R/W
2
DTIE1A
0
R/W
1
DTIE0B
0
R/W
0
1
Transfer suspended interrupt disabled
Transfer suspended interrupt enabled
0
1
Transfer end interrupt disabled
Transfer end interrupt enabled
Channel 0 Data Transfer Interrupt
Enable B
0
1
Transfer suspended interrupt disabled
Transfer suspended interrupt enabled
0
1
Transfer end interrupt disabled
Transfer end interrupt enabled
Data transfer enabled
0 Data transfer disabled. In burst mode,
cleared to 0 by an NMI interrupt
1Data transfer enabled
Bit
DMABCRL
Initial value
Read/Write
:
:
:
:
Full address mode (cont)
(Continue d on next p age)
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1126 of 1268
REJ09B0220-0600
15
FAE1
0
R/W
14
FAE0
0
R/W
13
SAE1
0
R/W
12
SAE0
0
R/W
11
DTA1B
0
R/W
8
DTA0A
0
R/W
10
DTA1A
0
R/W
9
DTA0B
0
R/W
Short address mode
Bit
DMABCRH
Initial value
Read/Write
:
:
:
:
0
1
Short address mode
Full address mode
Channel 1 Full Address Enable
0
1
Short address mode
Full address mode
Channel 0 Full Address Enable
0
1
Transfer in dual address mode
Transfer in single address mode
Channel 1B Single Address Enable
0
1
Transfer in dual address mode
Transfer in single address mode
Channel 0B Single Address Enable
0
Clearing of selected internal interrupt
source at time of DMA transfer is disabled
Channel 1B Data Transfer Acknowledge
1
Clearing of selected internal interrupt
source at time of DMA transfer is enabled
0
Clearing of selected internal interrupt source
at time of DMA transfer is disabled
Channel 1A Data Transfer Acknowledge
1
Clearing of selected internal interrupt
source at time of DMA transfer is enabled
0
Clearing of selected internal interrupt source
at time of DMA transfer is disabled
Channel 0B Data Transfer Acknowledge
1
Clearing of selected internal interrupt
source at time of DMA transfer is enabled
0
Clearing of selected internal interrupt
source at time of DMA transfer is
disabled
Channel 0A Data Transfer Acknowledge
1
Clearing of selected internal
interrupt source at time of DMA
transfer is enabled
(Continue d on next p age)
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1127 of 1268
REJ09B0220-0600
Channel 1B Data Transfer Enable
Channel 1A Data Transfer Enable
Channel 0B Data Transfer Enable
0
1
Data transfer disabled
Data transfer enabled
Channel 0A Data Transfer Enable
Channel 1B Data Transfer Interrupt
Enable
Channel 1A Data Transfer Interrupt
Enable
Channel 0A Data Transfer
Interrupt Enable
7
DTE1B
0
R/W
6
DTE1A
0
R/W
5
DTE0B
0
R/W
4
DTE0A
0
R/W
3
DTIE1B
0
R/W
0
DTIE0A
0
R/W
2
DTIE1A
0
R/W
1
DTIE0B
0
R/W
Short address mode (cont)
Bit
DMABCRL
Initial value
Read/Write
:
:
:
:
Channel 0B Data Transfer
Interrupt Enable
0
1
Transfer end interrupt disabled
Transfer end interrupt enabled
0
1
Transfer end interrupt disabled
Transfer end interrupt enabled
0
1
Transfer end interrupt disabled
Transfer end interrupt enabled
0
1
Transfer end interrupt disabled
Transfer end interrupt enabled
0
1
Data transfer disabled
Data transfer enabled
0
1
Data transfer disabled
Data transfer enabled
0
1
Data transfer disabled
Data transfer enabled
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1128 of 1268
REJ09B0220-0600
ISCRH — IRQ Sense Control Register H H'FF2C Interrupt Controller
ISCRL — IRQ Sense Control Register L H'FF2D Interrupt Controller
15
IRQ7SCB
0
R/W
14
IRQ7SCA
0
R/W
13
IRQ6SCB
0
R/W
12
IRQ6SCA
0
R/W
11
IRQ5SCB
0
R/W
8
IRQ4SCA
0
R/W
10
IRQ5SCA
0
R/W
9
IRQ4SCB
0
R/W
Bit
Initial value
Read/Write
:
:
:
ISCRH
7
IRQ3SCB
0
R/W
6
IRQ3SCA
0
R/W
5
IRQ2SCB
0
R/W
4
IRQ2SCA
0
R/W
3
IRQ1SCB
0
R/W
0
IRQ0SCA
0
R/W
2
IRQ1SCA
0
R/W
1
IRQ0SCB
0
R/W
IRQ7 to IRQ4 Sense Control
IRQ3 to IRQ0 Sense Control
0
1
0
1
0
1
IRQ
n
input low level
Falling edge of IRQ
n
input
Rising edge of IRQ
n
input
Both falling and rising edges of IRQ
n
input
IRQnSCB IRQnSCA Interrupt Request Generation
(n = 7 to 0)
Bit
Initial value
Read/Write
:
:
:
ISCRL
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1129 of 1268
REJ09B0220-0600
IER—IRQ Enable Register H'FF2E Interrupt Controller
7
IRQ7E
0
R/W
6
IRQ6E
0
R/W
5
IRQ5E
0
R/W
4
IRQ4E
0
R/W
3
IRQ3E
0
R/W
0
IRQ0E
0
R/W
2
IRQ2E
0
R/W
1
IRQ1E
0
R/W
IRQn Enable
0
1
IRQn interrupt disabled
IRQn interrupt enabled
(n = 7 to 0)
Bit
Initial value
Read/Write
:
:
:
ISR—IRQ Status Re gister H'FF2F Interrupt Controller
7
IRQ7F
0
R/(W)*
6
IRQ6F
0
R/(W)*
5
IRQ5F
0
R/(W)*
4
IRQ4F
0
R/(W)*
3
IRQ3F
0
R/(W)*
0
IRQ0F
0
R/(W)*
2
IRQ2F
0
R/(W)*
1
IRQ1F
0
R/(W)*
Bit
Initial value
Read/Write
Note: * Can only be written with 0 for flag clearing.
:
:
:
Indicate the status of IRQ7 to IRQ0 interrupt requests
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1130 of 1268
REJ09B0220-0600
DTCERA to DTCERF—DTC Enable Registers H'FF30 to H'FF35 DTC
7
DTCE7
0
R/W
6
DTCE6
0
R/W
5
DTCE5
0
R/W
4
DTCE4
0
R/W
3
DTCE3
0
R/W
0
DTCE0
0
R/W
2
DTCE2
0
R/W
1
DTCE1
0
R/W
DTC Activation Enable
Bit
Initial value
Read/Write
:
:
:
DTC activation by this interrupt is disabled
[Clearing conditions]
• When the DISEL bit is 1 and data transfer has ended
• When the specified number of transfers have ended
0
1 DTC activation by this interrupt is enabled
[Holding condition]
When the DISEL bit is 0 and the specified number of
transfers have not ended
Correspondence between Interrupt Sources and DTCER
Bits
Register 7 6 5 4 3 2 1 0
DTCERA IRQ0 IRQ1 IRQ2 IRQ3 IRQ4 IRQ5 IRQ6 IRQ7
DTCERB — ADI TGI0A TGI0B TGI0C TGI0D TGI1A TGI1B
DTCERC TGI2A TGI2B TGI3A TGI3B TGI3C TGI3D TGI4A TGI4B
DTCERD — — TGI5A TGI5B CMIA0 CMIB0 CMIA1 CMIB1
DTCERE DMTEND0A DMTEND0B DMTEND1A DMTEND1B RXI0 TXI0 RXI1 TXI1
DTCERF RXI2 TXI2 — — — — — —
Note: For DTCE bit setting, read/write operations must be performed using bit-manipulation
instructions such as BSET and BCLR. For the initial setting only, however, when multiple
activation sources are set at one time, it is possible to disable interrupts and write after
executing a dummy read on the relevant register.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1131 of 1268
REJ09B0220-0600
DTVECR—DTC Vector Register H'FF3 7 DTC
7
SWDTE
0
R/W
6
DTVEC6
0
R/(W)*
5
DTVEC5
0
R/(W)*
4
DTVEC4
0
R/(W)*
3
DTVEC3
0
R/(W)*
0
DTVEC0
0
R/(W)*
2
DTVEC2
0
R/(W)*
1
DTVEC1
0
R/(W)*
DTVEC6 to DTVEC 0 bits can be written to when SWDTE = 0.Note: *
DTC Software Activation Enable
0
1
DTC software activation is disabled
[Clearing conditions]
• When the DISEL bit is 0 and the specified number of transfers have
not ended
• When SWDTEND is requested to the CPU, then 0 is written to the
SWDTE bit
DTC software activation is enabled
[Holding conditions]
• When the DISEL bit is 1 and data transfer has ended
• When the specified number of transfers have ended
• During data transfer due to software activation
Sets vector number for DTC software activation
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1132 of 1268
REJ09B0220-0600
SBYCR—Standby Control Register H'FF38 Pow er-Down State
7
SSBY
0
R/W
6
STS2
0
R/W
5
STS1
0
R/W
4
STS0
0
R/W
3
OPE
1
R/W
0
IRQ37S
0
R/W
2
—
0
—
1
—
0
—
Software Standby
0
1
Transition to sleep mode after execution of SLEEP instruction
Transition to software standby mode after execution of SLEEP instruction
Standby Timer Select
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Standby time = 8192 states
Standby time = 16384 states
Standby time = 32768 states
Standby time = 65536 states
Standby time = 131072 states
Standby time = 262144 states
Reserved
Standby time = 16 states
Output Port Enable
Bit
Initial value
Read/Write
:
:
:
IRQ37 Software Standby Clear Select
0
1
IRQ3 to IRQ7 cannot be used as software
standby mode clearing sources
IRQ3 to IRQ7 can be used as software
standby mode clearing sources
0
1
In software standby mode, address bus and
bus control signals are high-impedance
In software standby mode, address bus and
bus control signals retain output state
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1133 of 1268
REJ09B0220-0600
SYSCR—Syst em Control Register H'F F39 MCU
7
—
0
R/W
6
—
0
—
5
INTM1
0
R/W
4
INTM0
0
R/W
3
NMIEG
0
R/W
0
RAME
1
R/W
2
LWROD
0
R/W
1
IRQPAS
0
R/W
Bit
Initial value
Read/Write
:
:
:
Reserved
Only 0 should be written to this bit
RAM Enable
0 On-chip RAM disabled
1 On-chip RAM enabled
NMI Input Edge Select
0 Falling edge
1 Rising edge
Interrupt Control Mode Selection
0
1
Interrupt control mode 00
1
0
1
Setting prohibited
Interrupt control mode 2
Setting prohibited
LWR Output Disable
0PF
3
is designated as LWR output pin
1PF
3
is designated as I/O port, and
does not function as LWR output pin
IRQ Port Switching Select
0IRQ
4
to IRQ
7
can be input
from PA
4
to PA
7
1IRQ
4
to IRQ
7
can be input
from P5
0
to P5
3
Note: IRQ
4
to IRQ
7
input is always
performed from only one of
the ports.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1134 of 1268
REJ09B0220-0600
SCKCR—System Clock Control Register H'FF3A Clock Pulse Generator
7
PSTOP
0
R/W
6
—
0
R/W
5
DIV
0
R/W
4
—
0
—
3
—
0
—
0
SCK0
0
R/W
2
SCK2
0
R/W
1
SCK1
0
R/W
0
1
PSTOP Normal Operation
φ
output
Fixed high
High impedance
High impedance
Fixed high
Fixed high
φ
Clock Output Control
System Clock Select
SCK0SCK1SCK2 DIV = 0 DIV = 1
0
1
0
1
0
1
0
1
0
1
0
1
—
Bus master is in high-speed mode
Medium-speed clock is
φ
/2
Medium-speed clock is
φ
/4
Medium-speed clock is
φ
/8
Medium-speed clock is
φ
/16
Medium-speed clock is
φ
/32
—
Bus master is in high-speed mode
Clock supplied to entire chip is
φ
/2
Clock supplied to entire chip is
φ
/4
Clock supplied to entire chip is
φ
/8
—
—
—
φ
output
Fixed high
Sleep Mode
Bit
Initial value
Read/Write
:
:
:
Software
Standby Mode Hardware
Standby Mode
Division
Ratio
Select
Reserved
Only 0 should be
written to this bit
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1135 of 1268
REJ09B0220-0600
MDCR—Mode Control Register H'FF3B MCU
7
—
1
—
6
—
0
—
5
—
0
—
4
—
0
—
3
—
0
—
0
MDS0
—*
R
2
MDS2
—*
R
1
MDS1
—*
R
Current mode pin operating mode
Bit
Initial value
Read/Write
:
:
:
Note: * Determined by pins MD2 to MD0
MSTPCRH — Module Sto p Co ntrol Register H H'FF3C Pow er-Down State
MSTPCRL — Module Stop Contro l Reg ister L H'FF3D Power-Down State
15
0
R/W
14
0
R/W
13
1
R/W
12
1
R/W
11
1
R/W
10
1
R/W
9
1
R/W
8
1
R/W
7
1
R/W
6
1
R/W
5
1
R/W
4
1
R/W
3
1
R/W
2
1
R/W
1
1
R/W
0
1
R/W
MSTPCRH MSTPCRL
Specifies module stop mode
0
1
Module stop mode cleared
Module stop mode set
Bit
Initial value
Read/Write
:
:
:
MSTP Bits and On-Chip Supporting Modules
Register
MSTPCRH
MSTPCRL
Bits
MSTP15
MSTP14
MSTP13
MSTP12
MSTP11
MSTP10
MSTP9
MSTP8
MSTP7
MSTP6
MSTP5
MSTP4
MSTP3
MSTP2
MSTP1
MSTP0
Module
DMAC*
DTC
TPU
8-bit timer
PPG
D/A
A/D
—
SCI2
SCI1
SCI0
—
—
—
—
—
Note: * Reserved bit in the H8S/2321.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1136 of 1268
REJ09B0220-0600
SYSCR2—Syste m Control Register 2 H'FF42 MCU
(Valid only in F- ZTAT versions)
7
—
0
—
6
—
0
—
5
—
0
—
4
—
0
—
3
FLSHE
0
R/W
0
—
0
— (R/W)
2
—
0
—
1
—
0
—
Bit
Initial value
Read/Write
:
:
:
0 H8S/2329B F-ZTAT, H8S/2328B F-ZTAT, and
H8S/2326 F-ZTAT
• Flash control registers are not selected for
addresses H'FFFFC8 to H'FFFFCB
1 H8S/2329B F-ZTAT, H8S/2328B F-ZTAT, and
H8S/2326 F-ZTAT
• Flash control registers are not selected for
addresses H'FFFFC8 to H'FFFFCB
Flash Memory Control Register Enable
In the H8S/2329B only this bit is
R/W, and should only be written
with 0
Reserved Register H'FF44
7
—
0
—
6
—
0
—
5
—
0
R/W
4
—
0
—
3
—
0
—
0
—
0
—
2
—
0
—
1
—
0
—
Reserved
Only 0 should be written to these bits
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1137 of 1268
REJ09B0220-0600
PFCR1—Port Function Control Register 1 H'FF4 5
7
—
0
R/W
6
—
0
R/W
5
—
0
R/W
4
—
0
R/W
3
A23E
1
R/W
0
A20E
1
R/W
2
A22E
1
R/W
1
A21E
1
R/W
Bit
Initial value
Read/Write
:
:
:
0
1PA4DR is output when PA4DDR = 1
A20 is output when PA4DDR = 1
Address 20 Output Enable*
0
1PA5DR is output when PA5DDR = 1
A21 is output when PA5DDR = 1
Address 21 Output Enable*
0
1PA6DR is output when PA6DDR = 1
A22 is output when PA6DDR = 1
Address 22 Output Enable*
0
1PA7DR is output when PA7DDR = 1
A23 is output when PA7DDR = 1
Address 23 Output Enable*
Reserved
Only 0 should be written to these bits
Note: * Valid only in modes 4 to 6.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1138 of 1268
REJ09B0220-0600
PCR—PPG Output Control Register H'FF46 PPG
7
G3CMS1
1
R/W
6
G3CMS0
1
R/W
5
G2CMS1
1
R/W
4
G2CMS0
1
R/W
3
G1CMS1
1
R/W
0
G0CMS0
1
R/W
2
G1CMS0
1
R/W
1
G0CMS1
1
R/W
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Output Trigger for Pulse Output Group 1
0
1
0
1
0
1
Compare match in TPU channel 0
Compare match in TPU channel 1
Compare match in TPU channel 2
Compare match in TPU channel 3
Output Trigger for Pulse Output Group 0
Bit
Initial value
Read/Write
:
:
:
Compare match in TPU channel 0
Compare match in TPU channel 1
Compare match in TPU channel 2
Compare match in TPU channel 3
Output Trigger for Pulse Output Group 2
Compare match in TPU channel 0
Compare match in TPU channel 1
Compare match in TPU channel 2
Compare match in TPU channel 3
Output Trigger for Pulse Output Group 3
Compare match in TPU channel 0
Compare match in TPU channel 1
Compare match in TPU channel 2
Compare match in TPU channel 3
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1139 of 1268
REJ09B0220-0600
PMR—PPG Output Mode Register H'FF47 PPG
7
G3INV
1
R/W
6
G2INV
1
R/W
5
G1INV
1
R/W
4
G0INV
1
R/W
3
G3NOV
0
R/W
0
G0NOV
0
R/W
2
G2NOV
0
R/W
1
G1NOV
0
R/W
0
1
Inverse output for pulse output group n
(low-level output at pin for a 1 in PODRH)
Pulse Output Group n Direct/Inverse Output
0
1
Normal operation in pulse output group n (output
values updated at compare match A in the selected
TPU channel)
Pulse Output Group n Normal/Non-Overlap
Operation Select
(n = 3 to 0)
(n = 3 to 0)
Bit
Initial value
Read/Write
:
:
:
Non-overlapping operation in pulse output group n
(independent 1 and 0 output at compare match A
or B in the selected TPU channel)
Direct output for pulse output group n
(high-level output at pin for a 1 in PODRH)
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1140 of 1268
REJ09B0220-0600
NDERH — Next Data Enable Register H H'FF48 PPG
NDERL — Next Data Enable Register L H'FF49 PPG
7
NDER15
0
R/W
6
NDER14
0
R/W
5
NDER13
0
R/W
4
NDER12
0
R/W
3
NDER11
0
R/W
0
NDER8
0
R/W
2
NDER10
0
R/W
1
NDER9
0
R/W
NDERH
7
NDER7
0
R/W
6
NDER6
0
R/W
5
NDER5
0
R/W
4
NDER4
0
R/W
3
NDER3
0
R/W
0
NDER0
0
R/W
2
NDER2
0
R/W
1
NDER1
0
R/W
0
1
Pulse outputs PO15 to PO8 are disabled
Pulse outputs PO15 to PO8 are enabled
Pulse Output Enable/Disable
0
1
Pulse Output Enable/Disable
Bit
Initial value
Read/Write
:
:
:
NDERL
Bit
Initial value
Read/Write
:
:
:
Pulse outputs PO7 to PO0 are disabled
Pulse outputs PO7 to PO0 are enabled
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1141 of 1268
REJ09B0220-0600
PODRH — Output Data Register H H'FF4A PPG
PODRL — Output Data Register L H'FF4B PPG
7
POD15
0
R/(W)*
6
POD14
0
R/(W)*
5
POD13
0
R/(W)*
4
POD12
0
R/(W)*
3
POD11
0
R/(W)*
0
POD8
0
R/(W)*
2
POD10
0
R/(W)*
1
POD9
0
R/(W)*
7
POD7
0
R/(W)*
6
POD6
0
R/(W)*
5
POD5
0
R/(W)*
4
POD4
0
R/(W)*
3
POD3
0
R/(W)*
0
POD0
0
R/(W)*
2
POD2
0
R/(W)*
1
POD1
0
R/(W)*
Note: * A bit that has been set for pulse output by NDER is read-only.
Stores output data for use in pulse output
Stores output data for use in pulse output
PODRH
Bit
Initial value
Read/Write
:
:
:
PODRL
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1142 of 1268
REJ09B0220-0600
NDRH—Next Data Register H H'FF4C (FF4E) PPG
7
NDR15
0
R/W
6
NDR14
0
R/W
5
NDR13
0
R/W
4
NDR12
0
R/W
3
NDR11
0
R/W
0
NDR8
0
R/W
2
NDR10
0
R/W
1
NDR9
0
R/W
(1) When pulse output group output triggers are the same
(a) Address: H'FF4C
7
—
1
—
6
—
1
—
5
—
1
—
4
—
1
—
3
—
1
—
0
—
1
—
2
—
1
—
1
—
1
—
(b) Address: H'FF4E
7
NDR15
0
R/W
6
NDR14
0
R/W
5
NDR13
0
R/W
4
NDR12
0
R/W
3
—
1
—
0
—
1
—
2
—
1
—
1
—
1
—
(2) When pulse output group output triggers are different
(a) Address: H'FF4C
(b) Address: H'FF4E
7
—
1
—
6
—
1
—
5
—
1
—
4
—
1
—
3
NDR11
0
R/W
0
NDR8
0
R/W
2
NDR10
0
R/W
1
NDR9
0
R/W
Bit
Initial value
Read/Write
:
:
:
Bit
Initial value
Read/Write
:
:
:
Bit
Initial value
Read/Write
:
:
:
Bit
Initial value
Read/Write
:
:
:
Stores the next data for pulse output groups 3 and 2
Stores the next data for pulse output group 3
Stores the next data for pulse output group 2
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1143 of 1268
REJ09B0220-0600
NDRL—Next Data Register L H'FF4D (FF4F) PPG
7
—
1
—
6
—
1
—
5
—
1
—
4
—
1
—
3
—
1
—
0
—
1
—
2
—
1
—
1
—
1
—
(b) Address: H'FF4F
(b) Address: H'FF4F
7
NDR7
0
R/W
6
NDR6
0
R/W
5
NDR5
0
R/W
4
NDR4
0
R/W
3
NDR3
0
R/W
0
NDR0
0
R/W
2
NDR2
0
R/W
1
NDR1
0
R/W
7
NDR7
0
R/W
6
NDR6
0
R/W
5
NDR5
0
R/W
4
NDR4
0
R/W
3
—
1
—
0
—
1
—
2
—
1
—
1
—
1
—
7
—
1
—
6
—
1
—
5
—
1
—
4
—
1
—
3
NDR3
0
R/W
0
NDR0
0
R/W
2
NDR2
0
R/W
1
NDR1
0
R/W
Bit
Initial value
Read/Write
:
:
:
Bit
Initial value
Read/Write
:
:
:
Bit
Initial value
Read/Write
:
:
:
(1) When pulse output group output triggers are the same
(a) Address: H'FF4D
(2) When pulse output group output triggers are different
(a) Address: H'FF4D
Bit
Initial value
Read/Write
:
:
:
Stores the next data for pulse output groups 1 and 0
Stores the next data for pulse output group 1
Stores the next data for pulse output group 0
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1144 of 1268
REJ09B0220-0600
PORT1—Port 1 Register H'FF50 Port 1
7
P17
—*
R
6
P16
—*
R
5
P15
—*
R
4
P14
—*
R
3
P13
—*
R
0
P10
—*
R
2
P12
—*
R
1
P11
—*
R
Note: * Determined by the state of pins P17 to P10.
State of port 1 pins
Bit
Initial value
Read/Write
:
:
:
PORT2—Port 2 Register H'FF51 Port 2
7
P27
—*
R
6
P26
—*
R
5
P25
—*
R
4
P24
—*
R
3
P23
—*
R
0
P20
—*
R
2
P22
—*
R
1
P21
—*
R
State of port 2 pins
Note: * Determined by the state of pins P2
7
to P2
0
.
Bit
Initial value
Read/Write
:
:
:
PORT3—Port 3 Register H'FF52 Port 3
7
—
Undefined
—
6
—
Undefined
—
5
P35
—*
R
4
P34
—*
R
3
P33
—*
R
0
P30
—*
R
2
P32
—*
R
1
P31
—*
R
State of port 3 pins
Note: * Determined by the state of pins P35 to P30.
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1145 of 1268
REJ09B0220-0600
PORT4—Port 4 Register H'FF53 Port 4
7
P47
—*
R
6
P46
—*
R
5
P45
—*
R
4
P44
—*
R
3
P43
—*
R
0
P40
—*
R
2
P42
—*
R
1
P41
—*
R
State of port 4 pins
Note: * Determined by the state of pins P47 to P40.
Bit
Initial value
Read/Write
:
:
:
PORT5—Port 5 Register H'FF54 Port 5
7
—
—*
R
6
—
—*
R
5
—
—*
R
4
—
—*
R
3
P53
—*
R
0
P50
—*
R
2
P52
—*
R
1
P51
—*
R
State of port 5 pins
Note: * Determined by the state of pins P5
3
to P5
0
.
Bit
Initial value
Read/Write
:
:
:
PORT6—Port 6 Register H'FF55 Port 6
7
P67
—*
R
6
P66
—*
R
5
P65
—*
R
4
P64
—*
R
3
P63
—*
R
0
P60
—*
R
2
P62
—*
R
1
P61
—*
R
State of port 6 pins
Note: * Determined by the state of pins P67 to P60.
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1146 of 1268
REJ09B0220-0600
PORTA—Port A Register H'FF59 Port A
7
PA7
—*
R
6
PA6
—*
R
5
PA5
—*
R
4
PA4
—*
R
3
PA3
—*
R
0
PA0
—*
R
2
PA2
—*
R
1
PA1
—*
R
State of port A pins
Note: * Determined by the state of pins PA
7
to PA
0
.
Bit
Initial value
Read/Write
:
:
:
PORTB—Port B Register H'FF5A Port B
7
PB7
—*
R
6
PB6
—*
R
5
PB5
—*
R
4
PB4
—*
R
3
PB3
—*
R
0
PB0
—*
R
2
PB2
—*
R
1
PB1
—*
R
State of port B pins
Note: * Determined by the state of pins PB7 to PB0.
Bit
Initial value
Read/Write
:
:
:
PORTC—Port C Register H'FF5B Port C
7
PC7
—*
R
6
PC6
—*
R
5
PC5
—*
R
4
PC4
—*
R
3
PC3
—*
R
0
PC0
—*
R
2
PC2
—*
R
1
PC1
—*
R
State of port C pins
Note: * Determined by the state of pins PC7 to PC0.
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1147 of 1268
REJ09B0220-0600
PORTD—Port D Register H'FF5C Port D
7
PD7
—*
R
6
PD6
—*
R
5
PD5
—*
R
4
PD4
—*
R
3
PD3
—*
R
0
PD0
—*
R
2
PD2
—*
R
1
PD1
—*
R
State of port D pins
Note: * Determined by the state of pins PD7 to PD0.
Bit
Initial value
Read/Write
:
:
:
PORTE—Port E Register H'FF5D Port E
7
PE7
—*
R
6
PE6
—*
R
5
PE5
—*
R
4
PE4
—*
R
3
PE3
—*
R
0
PE0
—*
R
2
PE2
—*
R
1
PE1
—*
R
State of port E pins
Note: * Determined by the state of pins PE
7
to PE
0
.
Bit
Initial value
Read/Write
:
:
:
PORTF—Port F Register H'FF5E Port F
7
PF7
—*
R
6
PF6
—*
R
5
PF5
—*
R
4
PF4
—*
R
3
PF3
—*
R
0
PF0
—*
R
2
PF2
—*
R
1
PF1
—*
R
State of port F pins
Note: * Determined by the state of pins PF7 to PF0.
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1148 of 1268
REJ09B0220-0600
PORTG—Port G Register H'FF5F Port G
7
—
Undefined
—
6
—
Undefined
—
5
—
Undefined
—
4
PG4
—*
R
3
PG3
—*
R
0
PG0
—*
R
2
PG2
—*
R
1
PG1
—*
R
State of port G pins
Note: * Determined by the state of pins PG4 to PG0.
Bit
Initial value
Read/Write
:
:
:
P1DR—Port 1 Data Register H'FF60 Port 1
7
P17DR
0
R/W
6
P16DR
0
R/W
5
P15DR
0
R/W
4
P14DR
0
R/W
3
P13DR
0
R/W
0
P10DR
0
R/W
2
P12DR
0
R/W
1
P11DR
0
R/W
Stores output data for port 1 pins (P17 to P10)
Bit
Initial value
Read/Write
:
:
:
P2DR—Port 2 Data Register H'FF61 Port 2
7
P27DR
0
R/W
6
P26DR
0
R/W
5
P25DR
0
R/W
4
P24DR
0
R/W
3
P23DR
0
R/W
0
P20DR
0
R/W
2
P22DR
0
R/W
1
P21DR
0
R/W
Stores output data for port 2 pins (P2
7
to P2
0
)
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1149 of 1268
REJ09B0220-0600
P3DR—Port 3 Data Register H'FF62 Port 3
7
—
Undefined
—
6
—
Undefined
—
5
P35DR
0
R/W
4
P34DR
0
R/W
3
P33DR
0
R/W
0
P30DR
0
R/W
2
P32DR
0
R/W
1
P31DR
0
R/W
Stores output data for port 3 pins (P3
5
to P3
0
)
Bit
Initial value
Read/Write
:
:
:
P5DR—Port 5 Data Register H'FF64 Port 5
7
—
Undefined
—
6
—
Undefined
—
5
—
Undefined
—
4
—
Undefined
—
3
P53DR
0
R/W
0
P50DR
0
R/W
2
P52DR
0
R/W
1
P51DR
0
R/W
Stores output data for port 5 pins (P53 to P50)
Bit
Initial value
Read/Write
:
:
:
P6DR—Port 6 Data Register H'FF65 Port 6
7
P67DR
0
R/W
6
P66DR
0
R/W
5
P65DR
0
R/W
4
P64DR
0
R/W
3
P63DR
0
R/W
0
P60DR
0
R/W
2
P62DR
0
R/W
1
P61DR
0
R/W
Stores output data for port 6 pins (P6
7
to
P6
0
)
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1150 of 1268
REJ09B0220-0600
PADR—Port A Data Register H'FF6 9 Port A
7
PA7DR
0
R/W
6
PA6DR
0
R/W
5
PA5DR
0
R/W
4
PA4DR
0
R/W
3
PA3DR
0
R/W
0
PA0DR
0
R/W
2
PA2DR
0
R/W
1
PA1DR
0
R/W
Stores output data for port A pins (PA
7
to
PA
0
)
Bit
Initial value
Read/Write
:
:
:
PBDR—Port B Data Register H'FF6A Port B
7
PB7DR
0
R/W
6
PB6DR
0
R/W
5
PB5DR
0
R/W
4
PB4DR
0
R/W
3
PB3DR
0
R/W
0
PB0DR
0
R/W
2
PB2DR
0
R/W
1
PB1DR
0
R/W
Stores output data for port B pins (PB
7
to PB
0
)
Bit
Initial value
Read/Write
:
:
:
PCDR—Port C Data Register H'FF6B Port C
7
PC7DR
0
R/W
6
PC6DR
0
R/W
5
PC5DR
0
R/W
4
PC4DR
0
R/W
3
PC3DR
0
R/W
0
PC0DR
0
R/W
2
PC2DR
0
R/W
1
PC1DR
0
R/W
Stores output data for port C pins (PC7 to PC0)
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1151 of 1268
REJ09B0220-0600
PDDR—Port D Data Register H'FF6 C Port D
7
PD7DR
0
R/W
6
PD6DR
0
R/W
5
PD5DR
0
R/W
4
PD4DR
0
R/W
3
PD3DR
0
R/W
0
PD0DR
0
R/W
2
PD2DR
0
R/W
1
PD1DR
0
R/W
Stores output data for port D pins (PD
7
to PD
0
)
Bit
Initial value
Read/Write
:
:
:
PEDR—Port E Data Register H'FF6D Port E
7
PE7DR
0
R/W
6
PE6DR
0
R/W
5
PE5DR
0
R/W
4
PE4DR
0
R/W
3
PE3DR
0
R/W
0
PE0DR
0
R/W
2
PE2DR
0
R/W
1
PE1DR
0
R/W
Stores output data for port E pins (PE
7
to PE
0
)
Bit
Initial value
Read/Write
:
:
:
PFDR—Port F Data Register H'FF6E Port F
7
PF7DR
0
R/W
6
PF6DR
0
R/W
5
PF5DR
0
R/W
4
PF4DR
0
R/W
3
PF3DR
0
R/W
0
PF0DR
0
R/W
2
PF2DR
0
R/W
1
PF1DR
0
R/W
Stores output data for port F pins (PF
7
to PF
0
)
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1152 of 1268
REJ09B0220-0600
PGDR—Port G Data Register H'FF6F Port G
7
—
Undefined
—
6
—
Undefined
—
5
—
Undefined
—
4
PG4DR
0
R/W
3
PG3DR
0
R/W
0
PG0DR
0
R/W
2
PG2DR
0
R/W
1
PG1DR
0
R/W
Stores output data for port G pins (PG
4
to PG
0
)
Bit
Initial value
Read/Write
:
:
:
PAPCR—Port A MOS Pull-Up Control Reg ister H'FF70 Po rt A
7
PA7PCR
0
R/W
6
PA6PCR
0
R/W
5
PA5PCR
0
R/W
4
PA4PCR
0
R/W
3
PA3PCR
0
R/W
0
PA0PCR
0
R/W
2
PA2PCR
0
R/W
1
PA1PCR
0
R/W
Controls the MOS input pull-up function incorporated into port A on a bit-by-bit basis
Bit
Initial value
Read/Write
:
:
:
PBPCR—Port B MOS Pull-Up Control Register H'FF71 Port B
7
PB7PCR
0
R/W
6
PB6PCR
0
R/W
5
PB5PCR
0
R/W
4
PB4PCR
0
R/W
3
PB3PCR
0
R/W
0
PB0PCR
0
R/W
2
PB2PCR
0
R/W
1
PB1PCR
0
R/W
Controls the MOS input pull-up function incorporated into port B on a bit-by-bit basis
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1153 of 1268
REJ09B0220-0600
PCPCR—Port C MOS Pull-Up Control Reg ister H'FF72 Po rt C
7
PC7PCR
0
R/W
6
PC6PCR
0
R/W
5
PC5PCR
0
R/W
4
PC4PCR
0
R/W
3
PC3PCR
0
R/W
0
PC0PCR
0
R/W
2
PC2PCR
0
R/W
1
PC1PCR
0
R/W
Controls the MOS input pull-up function incorporated into port C on a bit-by-bit basis
Bit
Initial value
Read/Write
:
:
:
PDPCR—Port D MOS Pull-Up Control Reg ister H'FF73 Po rt D
7
PD7PCR
0
R/W
6
PD6PCR
0
R/W
5
PD5PCR
0
R/W
4
PD4PCR
0
R/W
3
PD3PCR
0
R/W
0
PD0PCR
0
R/W
2
PD2PCR
0
R/W
1
PD1PCR
0
R/W
Controls the MOS input pull-up function incorporated into port D on a bit-by-bit basis
Bit
Initial value
Read/Write
:
:
:
PEPCR—Port E MOS Pull-Up Control Register H'FF74 Port E
7
PE7PCR
0
R/W
6
PE6PCR
0
R/W
5
PE5PCR
0
R/W
4
PE4PCR
0
R/W
3
PE3PCR
0
R/W
0
PE0PCR
0
R/W
2
PE2PCR
0
R/W
1
PE1PCR
0
R/W
Controls the MOS input pull-up function incorporated into port E on a bit-by-bit basis
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1154 of 1268
REJ09B0220-0600
P3ODR—Port 3 Open Drain Control Register H'FF76 Port 3
7
—
Undefined
—
6
—
Undefined
—
5
P35ODR
0
R/W
4
P34ODR
0
R/W
3
P33ODR
0
R/W
0
P30ODR
0
R/W
2
P32ODR
0
R/W
1
P31ODR
0
R/W
Controls the PMOS on/off status for each port 3 pin (P3
5
to P3
0
)
Bit
Initial value
Read/Write
:
:
:
PAODR—Port A Open Drain Control Register H'FF77 Port A
7
PA7ODR
0
R/W
6
PA6ODR
0
R/W
5
PA5ODR
0
R/W
4
PA4ODR
0
R/W
3
PA3ODR
0
R/W
0
PA0ODR
0
R/W
2
PA2ODR
0
R/W
1
PA1ODR
0
R/W
Controls the PMOS on/off status for each port A pin (PA7 to PA0)
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1155 of 1268
REJ09B0220-0600
SMR0 —Serial Mode Reg i ster 0 H'FF78 SCI0
7
C/A
0
R/W
6
CHR
0
R/W
5
PE
0
R/W
4
O/E
0
R/W
3
STOP
0
R/W
0
CKS0
0
R/W
2
MP
0
R/W
1
CKS1
0
R/W
0
1
Asynchronous mode
Synchronous mode
Asynchronous Mode/Synchronous Mode Select
0
1
Parity bit addition and checking disabled
Parity bit addition and checking enabled
Parity Enable
0
1
Even parity
Odd parity
Parity Mode
0
1
0
1
0
1
φ clock
φ/4 clock
φ/16 clock
φ/64 clock
Clock Select
Bit
Initial value
Read/Write
:
:
:
0
1
Multiprocessor function
disabled
Multiprocessor format
selected
Multiprocessor Mode
0
11 stop bit
2 stop bits
Stop Bit Length
0
18-bit data
7-bit data*
Character Length
Note: * When 7-bit data is selected, the MSB (bit 7)
of TDR is not transmitted.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1156 of 1268
REJ09B0220-0600
SMR0 —Serial Mode Reg ister 0 H'FF78 Smart Card Interface 0
7
GM
0
R/W
6
BLK
0
R/W
5
PE
0
R/W
4
O/E
0
R/W
3
BCP1
0
R/W
0
CKS0
0
R/W
2
BCP0
0
R/W
1
CKS1
0
R/W
0
1
GSM Mode
0
1
Setting prohibited
Parity bit addition and checking enabled
Parity Enable
(Set to 1 when using the smart card interface)
0
1
Even parity
Odd parity
Parity Mode
0
1
0
1
0
1
φ clock
φ/4 clock
φ/16 clock
φ/64 clock
Clock Select
Bit
Initial value
Read/Write
:
:
:
Note: etu: Elementary time unit (time for transfer of 1 bit)
0
1
0
1
0
1
32 clocks
64 clocks
372 clocks
256 clocks
Base Clock Pulse
BCP1 BCP0 Base Clock Pulse
0
1
Normal smart card interface mode
Block transfer mode
Block Transfer Mode Select
Normal smart card interface mode operation
• TEND flag generated 12.5 etu (11.5 etu in block transfer mode) after beginning of start bit
• Clock output on/off control only
GSM mode smart card interface mode operation
• TEND flag generated 11.0 etu after beginning of start bit
• Fixed high/low-level control possible (set in SCR) in addition to clock output on/off control
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1157 of 1268
REJ09B0220-0600
BRR0—Bit Rate Register 0 H'FF79 SCI0, Smart Card Interface 0
7
1
R/W
6
1
R/W
5
1
R/W
4
1
R/W
3
1
R/W
0
1
R/W
2
1
R/W
1
1
R/W
Sets the serial transfer bit rate
Note: For details, see section 14.2.8, Bit Rate Register (BRR).
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1158 of 1268
REJ09B0220-0600
SCR0—Serial Control Register 0 H'FF7A SCI0
7
TIE
0
R/W
6
RIE
0
R/W
5
TE
0
R/W
4
RE
0
R/W
3
MPIE
0
R/W
0
CKE0
0
R/W
2
TEIE
0
R/W
1
CKE1
0
R/W
0 0 Asynchronous
mode Internal clock/SCK pin functions
as I/O port
Clock Enable
0
1Transmit-end interrupt (TEI) request disabled
Transmit-end interrupt (TEI) request enabled
Transmit End Interrupt Enable
0 Multiprocessor interrupts disabled
[Clearing conditions]
• When the MPIE bit is cleared to 0
• When data with MPB = 1 is received
Multiprocessor Interrupt Enable
0
1Reception disabled
Reception enabled
Receive Enable
0
1Transmission disabled
Transmission enabled
Transmit Enable
0 Receive-data-full interrupt (RXI) request and
receive-error interrupt (ERI) request disabled
Receive Interrupt Enable
0
1Transmit-data-empty interrupt (TXI) request disabled
Transmit-data-empty interrupt (TXI) request enabled
Transmit Interrupt Enable
Notes:
Bit
Initial value
Read/Write
:
:
:
Synchronous
mode Internal clock/SCK pin functions
as serial clock output
Asynchronous
mode Internal clock/SCK pin functions
as clock output*
1
Synchronous
mode Internal clock/SCK pin functions
as serial clock output
Asynchronous
mode External clock/SCK pin functions
as clock input*
2
Synchronous
mode External clock/SCK pin functions
as serial clock input
Asynchronous
mode External clock/SCK pin functions
as clock input*
2
Synchronous
mode External clock/SCK pin functions
as serial clock input
1. Outputs a clock of the same frequency as the bit rate.
2. Inputs a clock with a frequency 16 times the bit rate.
Multiprocessor interrupts enabled
Receive-data-full interrupt (RXI) requests, receive error interrupt
(ERI) requests, and setting of the RDRF, FER, and ORER flags
in SSR are disabled until data with the multiprocessor bit set to 1
is received
1
0
1
1
1
1 Receive-data-full interrupt (RXI) request and
receive-error interrupt (ERI) request enabled
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1159 of 1268
REJ09B0220-0600
SCR0—Serial Control Register 0 H'FF7A Smart Card Interface 0
7
TIE
0
R/W
6
RIE
0
R/W
5
TE
0
R/W
4
RE
0
R/W
3
MPIE
0
R/W
0
CKE0
0
R/W
2
TEIE
0
R/W
1
CKE1
0
R/W
SCMR
SMIF
0
1
1
1
1
1
1
0
0
1
1
1
1
0
0
0
0
1
1
0
1
0
1
0
1
SMR
GM CKE1 CKE0
See SCI specification
SCK pin function
Clock Enable
SCR setting
0
1Transmit-end interrupt (TEI) request disabled
Transmit-end interrupt (TEI) request enabled
Transmit End Interrupt Enable
0 Multiprocessor interrupts disabled
[Clearing conditions]
• When the MPIE bit is cleared to 0
• When data with MPB = 1 is received
Multiprocessor Interrupt Enable
0
1Reception disabled
Reception enabled
Receive Enable
0
1Transmission disabled
Transmission enabled
Transmit Enable
0 Receive-data-full interrupt (RXI) request and
receive-error interrupt (ERI) request disabled
Receive Interrupt Enable
0
1Transmit-data-empty interrupt (TXI) request disabled
Transmit-data-empty interrupt (TXI) request enabled
Transmit Interrupt Enable
Bit
Initial value
Read/Write
:
:
:
Multiprocessor interrupts enabled
Receive-data-full interrupt (RXI) requests, receive error interrupt
(ERI) requests, and setting of the RDRF, FER, and ORER flags
in SSR are disabled until data with the multiprocessor bit set to 1
is received
1
1 Receive-data-full interrupt (RXI) request and
receive-error interrupt (ERI) request enabled
Operates as port I/O
pin
Clock output as SCK
output pin
Fixed-low output as
SCK output pin
Clock output as SCK
output pin
Fixed-high output as
SCK output pin
Clock output as SCK
output pin
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1160 of 1268
REJ09B0220-0600
TDR0—Transmit Data Register 0 H'FF7B SCI0, Smart Card Interface 0
7
1
R/W
6
1
R/W
5
1
R/W
4
1
R/W
3
1
R/W
0
1
R/W
2
1
R/W
1
1
R/W
Stores data for serial transmission
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1161 of 1268
REJ09B0220-0600
SSR0—Serial Sta tus Register 0 H'FF7C SCI0
[Setting condition]
When serial reception ends normally and receive data is transferred
from RSR to RDR
7
TDRE
1
R/(W)*
6
RDRF
0
R/(W)*
5
ORER
0
R/(W)*
4
FER
0
R/(W)*
3
PER
0
R/(W)*
0
MPBT
0
R/W
2
TEND
1
R
1
MPB
0
R
Note: * Can only be written with 0 for flag clearing.
Note: 1. The DMAC is not supported in the H8S/2321.
0
Transmit Data Register Empty
0
Receive Data Register Full
Note: 1. The DMAC is not supported in the H8S/2321.
0
Overrun Error
0
Framing Error
0
Parity Error
0
Transmit End
Note: 1. The DMAC is not supported in the H8S/2321.
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the DMAC*
1
or DTC is activated by a TXI interrupt
and writes data to TDR
0
Multiprocessor Bit
[Clearing condition]
When data with a 0 multiprocessor bit is received
[Setting condition]
When data with a 1 multiprocessor bit is received
Multiprocessor Bit Transfer
0
1Data with a 0 multiprocessor bit is transmitted
Data with a 1 multiprocessor bit is transmitted
Bit
Initial value
Read/Write
:
:
:
[Setting conditions]
• When the TE bit in SCR is 0
• When TDRE = 1 at transmission of the last bit of a 1-byte
serial transmit character
[Clearing condition]
When 0 is written to PER after reading PER = 1
[Setting condition]
When, in reception, the number of 1 bits in the receive data plus the parity bit
does not match the parity setting (even or odd) specified by the O/E bit in SMR
[Clearing condition]
When 0 is written to FER after reading FER = 1
[Setting condition]
When the SCI checks the stop bit at the end of the receive
data when reception ends, and the stop bit is 0
[Clearing condition]
When 0 is written to ORER after reading ORER = 1
[Setting condition]
When the next serial reception is completed while
RDRF = 1
[Clearing conditions]
• When 0 is written to RDRF after reading RDRF = 1
• When the DMAC*
1
or DTC is activated by an RXI interrupt and reads data from RDR
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the DMAC*
1
or DTC is activated by a TXI interrupt and writes data to TDR
[Setting conditions]
• When the TE bit in SCR is 0
• When data is transferred from TDR to TSR and data can be written to TDR
1
1
1
1
1
1
1
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1162 of 1268
REJ09B0220-0600
SSR0—Serial Sta tus Register 0 H'FF7C Smart Card Interface 0
7
TDRE
1
R/(W)*
6
RDRF
0
R/(W)*
5
ORER
0
R/(W)*
4
ERS
0
R/(W)*
3
PER
0
R/(W)*
0
MPBT
0
R/W
2
TEND
1
R
1
MPB
0
R
Note: * Can only be written with 0 for flag clearing.
0
Transmit Data Register Empty
Note: 1. The DMAC is not supported in the H8S/2321.
0
Receive Data Register Full
Note: 1. The DMAC is not supported in the H8S/2321.
0
Overrun Error
0
Error Signal Status
0
Parity Error
0
Transmit End
Transmission in progress
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the DMAC*
1
or DTC is activated by a TXI interrupt and
writes data to TDR
0
Multiprocessor Bit
[Clearing condition]
When data with a 0 multiprocessor bit is received
[Setting condition]
When data with a 1 multiprocessor bit is received
Multiprocessor Bit Transfer
0
1Data with a 0 multiprocessor bit is transmitted
Data with a 1 multiprocessor bit is transmitted
Bit
Initial value
Read/Write
:
:
:
[Clearing condition]
When 0 is written to PER after reading PER = 1
[Setting condition]
When, in reception, the number of 1 bits in the receive data plus the parity bit
does not match the parity setting (even or odd) specified by the O/E bit in SMR
Data has been received normally, and there is no error signal
[Clearing conditions]
• On reset, or in standby mode or module stop mode
• When 0 is written to ERS after reading ERS = 1
Error signal indicating detection of parity error has been sent by receiving device
[Setting condition]
When the error signal is sampled at the low level
[Clearing condition]
When 0 is written to ORER after reading ORER = 1
[Setting condition]
When the next serial reception is completed while RDRF = 1
[Clearing conditions]
• When 0 is written to RDRF after reading RDRF = 1
• When the DMAC*
1
or DTC is activated by an RXI interrupt and reads data from RDR
[Setting condition]
When serial reception ends normally and receive data is transferred from RSR to RDR
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the DMAC*
1
or DTC is activated by a TXI interrupt and writes data to TDR
[Setting conditions]
• When the TE bit in SCR is 0
• When data is transferred from TDR to TSR and data can be written to TDR
Note: etu: Elementary time unit (time for transfer of 1 bit)
1. The DMAC is not supported in the H8S/2321.
Note: Clearing the TE bit in SCR to 0 does not affect the ERS flag, which retains its prior state.
1
1
1
1
1
1
1
Transmission has ended
[Setting conditions]
• On reset, or in standby mode or module stop mode
• When the TE bit in SCR is 0 and the ERS bit is 0
• When TDRE = 1 and ERS = 0 (normal transmission) 2.5 etu after
transmission of a 1-byte serial character when GM = 0 and BLK = 0
• When TDRE = 1 and ERS = 0 (normal transmission) 1.5 etu after
transmission of a 1-byte serial character when GM = 0 and BLK = 1
• When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after
transmission of a 1-byte serial character when GM = 1 and BLK = 0
• When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after
transmission of a 1-byte serial character when GM = 1 and BLK = 1
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1163 of 1268
REJ09B0220-0600
RDR0—Receive Data Register 0 H'FF7D SCI0, S mart Card Interface 0
7
0
R
6
0
R
5
0
R
4
0
R
3
0
R
0
0
R
2
0
R
1
0
R
Bit
Initial value
Read/Write
:
:
:
Stores received serial data
SCMR0—Smart Card Mode Register 0 H'FF7E SCI0, Smart Card Interface 0
7
—
1
—
6
—
1
—
5
—
1
—
4
—
1
—
3
SDIR
0
R/W
0
SMIF
0
R/W
2
SINV
0
R/W
1
—
1
—
0
1
TDR contents are transmitted LSB-first
Receive data is stored in RDR LSB-first
Smart Card Data Direction
0
1
TDR contents are transmitted as they are
Receive data is stored in RDR as it is
Smart Card Data Invert
0
1
Smart card interface
function is disabled
Smart Card
Interface Mode Select
Bit
Initial value
Read/Write
:
:
:
Smart card interface
function is enabled
TDR contents are inverted before
being transmitted
Receive data is stored in RDR
in inverted form
TDR contents are transmitted MSB-first
Receive data is stored in RDR MSB-first
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1164 of 1268
REJ09B0220-0600
SMR1 —Serial Mode Reg i ster 1 H'FF80 SCI1
7
C/A
0
R/W
6
CHR
0
R/W
5
PE
0
R/W
4
O/E
0
R/W
3
STOP
0
R/W
0
CKS0
0
R/W
2
MP
0
R/W
1
CKS1
0
R/W
0
1
Asynchronous mode
Synchronous mode
Asynchronous Mode/Synchronous Mode Select
0
1
Parity bit addition and checking disabled
Parity bit addition and checking enabled
Parity Enable
0
1
Even parity
Odd parity
Parity Mode
0
1
0
1
0
1
φ clock
φ/4 clock
φ/16 clock
φ/64 clock
Clock Select
Bit
Initial value
Read/Write
:
:
:
0
11 stop bit
2 stop bits
Stop Bit Length
0
1
Multiprocessor function
disabled
Multiprocessor format
selected
Multiprocessor Mode
0
18-bit data
7-bit data*
Character Length
Note: * When 7-bit data is selected, the MSB (bit 7)
of TDR is not transmitted.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1165 of 1268
REJ09B0220-0600
SMR1 —Serial Mode Reg ister 1 H'FF80 Smart Card Interface 1
7
GM
0
R/W
6
BLK
0
R/W
5
PE
0
R/W
4
O/E
0
R/W
3
BCP1
0
R/W
0
CKS0
0
R/W
2
BCP0
0
R/W
1
CKS1
0
R/W
0
1
GSM Mode
0
1
Setting prohibited
Parity bit addition and checking enabled
Parity Enable
0
1
Even parity
Odd parity
Parity Mode
(Set to 1 when using the smart card interface)
0
1
0
1
0
1
φ clock
φ/4 clock
φ/16 clock
φ/64 clock
Clock Select
Bit
Initial value
Read/Write
:
:
:
Note: etu: Elementary time unit (time for transfer of 1 bit)
0
1
0
1
0
1
32 clocks
64 clocks
372 clocks
256 clocks
Base Clock Pulse
BCP1 BCP0 Base Clock Pulse
0
1
Normal smart card interface mode
Block transfer mode
Block Transfer Mode Select
Normal smart card interface mode operation
• TEND flag generated 12.5 etu (11.5 etu in block transfer mode) after beginning of start bit
• Clock output on/off control only
GSM mode smart card interface mode operation
• TEND flag generated 11.0 etu after beginning of start bit
• Fixed high/low-level control possible (set in SCR) in addition to clock output on/off control
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1166 of 1268
REJ09B0220-0600
BRR1—Bit Rate Register 1 H'FF81 SCI1, Smart Card Interface 1
7
1
R/W
6
1
R/W
5
1
R/W
4
1
R/W
3
1
R/W
0
1
R/W
2
1
R/W
1
1
R/W
Note: For details, see section 14.2.8, Bit Rate Register (BRR).
Sets the serial transfer bit rate
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1167 of 1268
REJ09B0220-0600
SCR1—Serial Control Register 1 H'FF82 SCI1
7
TIE
0
R/W
6
RIE
0
R/W
5
TE
0
R/W
4
RE
0
R/W
3
MPIE
0
R/W
0
CKE0
0
R/W
2
TEIE
0
R/W
1
CKE1
0
R/W
1
0 Asynchronous
mode Internal clock/SCK pin functions
as I/O port
Clock Enable
0
1Transmit-end interrupt (TEI) request disabled
Transmit-end interrupt (TEI) request enabled
Transmit End Interrupt Enable
0Multiprocessor interrupts disabled
[Clearing conditions]
• When the MPIE bit is cleared to 0
• When data with MPB = 1 is received
Multiprocessor Interrupt Enable
0
1Reception disabled
Reception enabled
Receive Enable
0
1Transmission disabled
Transmission enabled
Transmit Enable
0Receive-data-full interrupt (RXI) request and
receive-error interrupt (ERI) request disabled
Receive Interrupt Enable
0
1Transmit-data-empty interrupt (TXI) request disabled
Transmit-data-empty interrupt (TXI) request enabled
Transmit Interrupt Enable
Notes:
Bit
Initial value
Read/Write
:
:
:
Synchronous
mode Internal clock/SCK pin functions
as serial clock output
Asynchronous
mode Internal clock/SCK pin functions
as clock output*
1
Synchronous
mode Internal clock/SCK pin functions
as serial clock output
Asynchronous
mode External clock/SCK pin functions
as clock input*
2
Synchronous
mode External clock/SCK pin functions
as serial clock input
Asynchronous
mode External clock/SCK pin functions
as clock input*
2
Synchronous
mode External clock/SCK pin functions
as serial clock input
1. Outputs a clock of the same frequency as the bit rate.
2. Inputs a clock with a frequency 16 times the bit rate.
Multiprocessor interrupts enabled
Receive-data-full interrupt (RXI) requests, receive error interrupt
(ERI) requests, and setting of the RDRF, FER, and ORER flags
in SSR are disabled until data with the multiprocessor bit set to 1
is received
1
1 Receive-data-full interrupt (RXI) request and
receive-error interrupt (ERI) request enabled
1
0
1
0
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1168 of 1268
REJ09B0220-0600
SCR1—Serial Control Register 1 H'FF82 Smart Card Interface 1
7
TIE
0
R/W
6
RIE
0
R/W
5
TE
0
R/W
4
RE
0
R/W
3
MPIE
0
R/W
0
CKE0
0
R/W
2
TEIE
0
R/W
1
CKE1
0
R/W
SCMR
SMIF
0
1
1
1
1
1
1
0
0
1
1
1
1
0
0
0
0
1
1
0
1
0
1
0
1
SMR
GM CKE1 CKE0
See SCI specification
SCK pin function
Clock Enable SCR setting
0
1Transmit-end interrupt (TEI) request disabled
Transmit-end interrupt (TEI) request enabled
Transmit End Interrupt Enable
0 Multiprocessor interrupts disabled
[Clearing conditions]
• When the MPIE bit is cleared to 0
• When data with MPB = 1 is received
Multiprocessor Interrupt Enable
0
1Reception disabled
Reception enabled
Receive Enable
0
1Transmission disabled
Transmission enabled
Transmit Enable
0 Receive-data-full interrupt (RXI) request and
receive-error interrupt (ERI) request disabled
Receive Interrupt Enable
0
1Transmit-data-empty interrupt (TXI) request disabled
Transmit-data-empty interrupt (TXI) request enabled
Transmit Interrupt Enable
Bit
Initial value
Read/Write
:
:
:
Multiprocessor interrupts enabled
Receive-data-full interrupt (RXI) requests, receive error interrupt
(ERI) requests, and setting of the RDRF, FER, and ORER flags
in SSR are disabled until data with the multiprocessor bit set to 1
is received
1
1 Receive-data-full interrupt (RXI) request and
receive-error interrupt (ERI) request enabled
Operates as port I/O
pin
Clock output as SCK
output pin
Fixed-low output as
SCK output pin
Clock output as SCK
output pin
Fixed-high output as
SCK output pin
Clock output as SCK
output pin
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1169 of 1268
REJ09B0220-0600
TDR1—Transmit Data Register 1 H'FF83 SCI1, Smart Card Interface 1
7
1
R/W
6
1
R/W
5
1
R/W
4
1
R/W
3
1
R/W
0
1
R/W
2
1
R/W
1
1
R/W
Stores data for serial transmission
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1170 of 1268
REJ09B0220-0600
SSR1—Serial Status Regi ster 1 H'FF84 SCI1
7
TDRE
1
R/(W)*
6
RDRF
0
R/(W)*
5
ORER
0
R/(W)*
4
FER
0
R/(W)*
3
PER
0
R/(W)*
0
MPBT
0
R/W
2
TEND
1
R
1
MPB
0
R
Note: * Can only be written with 0 for flag clearing.
0
Transmit Data Register Empty
0
Receive Data Register Full
0
Overrun Error
0
Framing Error
0
Parity Error
0
Transmit End
Note: 1. The DMAC is not supported in the H8S/2321.
Note: 1. The DMAC is not supported in the H8S/2321.
Note: 1. The DMAC is not supported in the H8S/2321.
0
Multiprocessor Bit
[Clearing condition]
When data with a 0 multiprocessor bit is received
Multiprocessor Bit Transfer
0
1Data with a 0 multiprocessor bit is transmitted
Data with a 1 multiprocessor bit is transmitted
Bit
Initial value
Read/Write
:
:
:
[Setting condition]
When data with a 1 multiprocessor bit is received
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the DMAC
*1
or DTC is activated by a TXI interrupt
and writes data to TDR
[Setting conditions]
• When the TE bit in SCR is 0
• When TDRE = 1 at transmission of the last bit of a 1-byte
serial transmit character
1
[Clearing condition]
When 0 is written to PER after reading PER = 1
[Setting condition]
When, in reception, the number of 1 bits in the receive data plus the parity bit
does not match the parity setting (even or odd) specified by the O/E bit in SMR
1
[Clearing condition]
When 0 is written to FER after reading FER = 1
[Setting condition]
When the SCI checks the stop bit at the end of the receive
data when reception ends, and the stop bit is 0
[Clearing condition]
When 0 is written to ORER after reading ORER = 1
[Setting condition]
When the next serial reception is completed while RDRF = 1
[Clearing conditions]
• When 0 is written to RDRF after reading RDRF = 1
• When the DMAC
*1
or DTC is activated by an RXI interrupt and reads data from RDR
[Setting condition]
When serial reception ends normally and receive data is transferred
from RSR to RDR
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the DMAC
*1
or DTC is activated by a TXI interrupt and writes data to TDR
[Setting conditions]
• When the TE bit in SCR is 0
• When data is transferred from TDR to TSR and data can be written to TDR
1
1
1
1
1
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1171 of 1268
REJ09B0220-0600
SSR1—Serial Sta tus Register 1 H'FF84 Smart Card Interface 1
7
TDRE
1
R/(W)*
6
RDRF
0
R/(W)*
5
ORER
0
R/(W)*
4
ERS
0
R/(W)*
3
PER
0
R/(W)*
0
MPBT
0
R/W
2
TEND
1
R
1
MPB
0
R
Note: * Can only be written with 0 for flag clearing.
Transmit Data Register Empty
0
Receive Data Register Full
0
Overrun Error
0
Error Signal Status
0
Parity Error
0
Transmit End
0
Multiprocessor Bit
[Clearing condition]
When data with a 0 multiprocessor bit is received
Multiprocessor Bit Transfer
0
1Data with a 0 multiprocessor bit is transmitted
Data with a 1 multiprocessor bit is transmitted
Bit
Initial value
Read/Write
:
:
:
[Setting condition]
When data with a 1 multiprocessor bit is received
Transmission in progress
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the DMAC*1 or DTC is activated by a TXI interrupt
and writes data to TDR
1
[Clearing condition]
When 0 is written to PER after reading PER = 1
[Setting condition]
When, in reception, the number of 1 bits in the receive data plus the parity bit
does not match the parity setting (even or odd) specified by the O/E bit in SMR
1
Data has been received normally, and there is no error signal
[Clearing conditions]
• On reset, or in standby mode or module stop mode
• When 0 is written to ERS after reading ERS =1
Error signal indicating detection of parity error has been sent by receiving device
[Setting condition]
When the error signal is sampled at the low level
[Clearing condition]
When 0 is written to ORER after reading ORER = 1
[Setting condition]
When the next serial reception is completed while RDRF = 1
[Clearing conditions]
• When 0 is written to RDRF after reading RDRF = 1
• When the DMAC*1 or DTC is activated by an RXI interrupt and reads data from RDR
[Setting condition]
When serial reception ends normally and receive data is transferred from RSR to RDR
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the DMAC*1 or DTC is activated by a TXI interrupt and writes data to TDR
[Setting conditions]
• When the TE bit in SCR is 0
• When data is transferred from TDR to TSR and data can be written to TDR
Notes: etu: Elementary time
unit (time for transfer of 1 bit)
1. The DMAC is not supported in the H8S/2321.
1
Note: Clearing the TE bit in SCR to 0 does not affect the ERS flag, which retains its prior state.
1
1
1
0
1
Transmission has ended
[Setting conditions]
• On reset, or in standby mode or module stop mode
• When the TE bit in SCR is 0 and the ERS bit is 0
• When TDRE = 1 and ERS = 0 (normal transmission) 2.5 etu after
transmission of a 1-byte serial character when GM = 0 and BLK = 0
• When TDRE = 1 and ERS = 0 (normal transmission) 1.5 etu after
transmission of a 1-byte serial character when GM = 0 and BLK = 1
• When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after
transmission of a 1-byte serial character when GM = 1 and BLK = 0
• When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after
transmission of a 1-byte serial character when GM = 1 and BLK = 1
Note: 1. The DMAC is not supported in the H8S/2321.
Note: 1. The DMAC is not supported in the H8S/2321.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1172 of 1268
REJ09B0220-0600
RDR1—Receive Data Register 1 H'FF85 SCI1, Smart Card Interface 1
7
0
R
6
0
R
5
0
R
4
0
R
3
0
R
0
0
R
2
0
R
1
0
R
Stores received serial data
Bit
Initial value
Read/Write
:
:
:
SCMR1—Smart Card Mode Register 1 H'FF86 SCI1, Smart Card Interface 1
7
—
1
—
6
—
1
—
5
—
1
—
4
—
1
—
3
SDIR
0
R/W
0
SMIF
0
R/W
2
SINV
0
R/W
1
—
1
—
0
1
TDR contents are transmitted LSB-first
Receive data is stored in RDR LSB-first
Smart Card Data Direction
0TDR contents are transmitted as they are
Receive data is stored in RDR as it is
Smart Card Data Invert
0
1
Smart card interface
function is disabled
Smart Card
Interface Mode Select
Bit
Initial value
Read/Write
:
:
:
Smart card interface
function is enabled
TDR contents are inverted before
being transmitted
Receive data is stored in RDR
in inverted form
1
TDR contents are transmitted MSB-first
Receive data is stored in RDR MSB-first
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1173 of 1268
REJ09B0220-0600
SMR2 —Serial Mode Reg i ster 2 H'FF88 SCI2
7
C/A
0
R/W
6
CHR
0
R/W
5
PE
0
R/W
4
O/E
0
R/W
3
STOP
0
R/W
0
CKS0
0
R/W
2
MP
0
R/W
1
CKS1
0
R/W
0
1
Asynchronous mode
Synchronous mode
Asynchronous Mode/Synchronous Mode Select
0
1
Parity bit addition and checking disabled
Parity bit addition and checking enabled
Parity Enable
0
1
Even parity
Odd parity
Parity Mode
0
1
0
1
0
1
φ clock
φ/4 clock
φ/16 clock
φ/64 clock
Clock Select
Bit
Initial value
Read/Write
:
:
:
0
11 stop bit
2 stop bits
Stop Bit Length
0
1
Multiprocessor function
disabled
Multiprocessor format
selected
Multiprocessor Mode
0
18-bit data
7-bit data*
Character Length
Note: * When 7-bit data is selected, the MSB (bit 7)
of TDR is not transmitted.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1174 of 1268
REJ09B0220-0600
SMR2 —Serial Mode Reg ister 2 H'FF88 Smart Card Interface 2
7
GM
0
R/W
6
BLK
0
R/W
5
PE
0
R/W
4
O/E
0
R/W
3
BCP1
0
R/W
0
CKS0
0
R/W
2
BCP0
0
R/W
1
CKS1
0
R/W
0
1
GSM Mode
0
1
Setting prohibited
Parity bit addition and checking enabled
Parity Enable
0
1
Even parity
Odd parity
Parity Mode
(Set to 1 when using the smart card interface)
0
1
0
1
0
1
φ clock
φ/4 clock
φ/16 clock
φ/64 clock
Clock Select
Bit
Initial value
Read/Write
:
:
:
Note: etu: Elementary time unit (time for transfer of 1 bit)
0
1
0
1
0
1
32 clocks
64 clocks
372 clocks
256 clocks
Base Clock Pulse
BCP1 BCP0 Base Clock Pulse
0
1
Normal smart card interface mode
Block transfer mode
Block Transfer Mode Select
Normal smart card interface mode operation
• TEND flag generated 12.5 etu (11.5 etu in block transfer mode) after beginning of start bit
• Clock output on/off control only
GSM mode smart card interface mode operation
• TEND flag generated 11.0 etu after beginning of start bit
• Fixed high/low-level control possible (set in SCR) in addition to clock output on/off control
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1175 of 1268
REJ09B0220-0600
BRR2—Bit Rate Register 2 H'FF89 SCI2, Smart Card Interface 2
7
1
R/W
6
1
R/W
5
1
R/W
4
1
R/W
3
1
R/W
0
1
R/W
2
1
R/W
1
1
R/W
Note: For details, see section 14.2.8, Bit Rate Register (BRR).
Sets the serial transfer bit rate
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1176 of 1268
REJ09B0220-0600
SCR2—Serial Control Register 2 H'FF8A SCI2
7
TIE
0
R/W
6
RIE
0
R/W
5
TE
0
R/W
4
RE
0
R/W
3
MPIE
0
R/W
0
CKE0
0
R/W
2
TEIE
0
R/W
1
CKE1
0
R/W
1
0 Asynchronous
mode Internal clock/SCK pin functions
as I/O port
Clock Enable
0
1Transmit-end interrupt (TEI) request disabled
Transmit-end interrupt (TEI) request enabled
Transmit End Interrupt Enable
0Multiprocessor interrupts disabled
[Clearing conditions]
• When the MPIE bit is cleared to 0
• When data with MPB = 1 is received
Multiprocessor Interrupt Enable
0
1Reception disabled
Reception enabled
Receive Enable
0
1Transmission disabled
Transmission enabled
Transmit Enable
0Receive-data-full interrupt (RXI) request and
receive-error interrupt (ERI) request disabled
Receive Interrupt Enable
0
1Transmit-data-empty interrupt (TXI) request disabled
Transmit-data-empty interrupt (TXI) request enabled
Transmit Interrupt Enable
Notes:
Bit
Initial value
Read/Write
:
:
:
Synchronous
mode Internal clock/SCK pin functions
as serial clock output
Asynchronous
mode Internal clock/SCK pin functions
as clock output*1
Synchronous
mode Internal clock/SCK pin functions
as serial clock output
Asynchronous
mode External clock/SCK pin functions
as clock input*2
Synchronous
mode External clock/SCK pin functions
as serial clock input
Asynchronous
mode External clock/SCK pin functions
as clock input*2
Synchronous
mode External clock/SCK pin functions
as serial clock input
1. Outputs a clock of the same frequency as the bit rate.
2. Inputs a clock with a frequency 16 times the bit rate.
Multiprocessor interrupts enabled
Receive-data-full interrupt (RXI) requests, receive error interrupt
(ERI) requests, and setting of the RDRF, FER, and ORER flags
in SSR are disabled until data with the multiprocessor bit set to 1
is received
1
1 Receive-data-full interrupt (RXI) request and
receive-error interrupt (ERI) request enabled
1
0
1
0
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1177 of 1268
REJ09B0220-0600
SCR2—Serial Control Register 2 H'FF8A Smart Card Interface 2
7
TIE
0
R/W
6
RIE
0
R/W
5
TE
0
R/W
4
RE
0
R/W
3
MPIE
0
R/W
0
CKE0
0
R/W
2
TEIE
0
R/W
1
CKE1
0
R/W
SCMR
SMIF
0
1
1
1
1
1
1
0
0
1
1
1
1
0
0
0
0
1
1
0
1
0
1
0
1
SMR
GM CKE1 CKE0
See SCI specification
SCK pin function
Clock Enable SCR setting
0
1Transmit-end interrupt (TEI) request disabled
Transmit-end interrupt (TEI) request enabled
Transmit End Interrupt Enable
0 Multiprocessor interrupts disabled
[Clearing conditions]
• When the MPIE bit is cleared to 0
• When data with MPB = 1 is received
Multiprocessor Interrupt Enable
0
1Reception disabled
Reception enabled
Receive Enable
0
1Transmission disabled
Transmission enabled
Transmit Enable
0 Receive-data-full interrupt (RXI) request and
receive-error interrupt (ERI) request disabled
Receive Interrupt Enable
0
1Transmit-data-empty interrupt (TXI) request disabled
Transmit-data-empty interrupt (TXI) request enabled
Transmit Interrupt Enable
Bit
Initial value
Read/Write
:
:
:
Multiprocessor interrupts enabled
Receive-data-full interrupt (RXI) requests, receive error interrupt
(ERI) requests, and setting of the RDRF, FER, and ORER flags
in SSR are disabled until data with the multiprocessor bit set to 1
is received
1
1 Receive-data-full interrupt (RXI) request and
receive-error interrupt (ERI) request enabled
Operates as port I/O
pin
Clock output as SCK
output pin
Fixed-low output as
SCK output pin
Clock output as SCK
output pin
Fixed-high output as
SCK output pin
Clock output as SCK
output pin
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1178 of 1268
REJ09B0220-0600
TDR2—Transmit Data Register 2 H'FF8B SCI2, Smart Card Interface 2
7
1
R/W
6
1
R/W
5
1
R/W
4
1
R/W
3
1
R/W
0
1
R/W
2
1
R/W
1
1
R/W
Stores data for serial transmission
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1179 of 1268
REJ09B0220-0600
SSR2—Serial Sta tus Register 2 H'FF8C SCI2
7
TDRE
1
R/(W)*
6
RDRF
0
R/(W)*
5
ORER
0
R/(W)*
4
FER
0
R/(W)*
3
PER
0
R/(W)*
0
MPBT
0
R/W
2
TEND
1
R
1
MPB
0
R
Note: * Can only be written with 0 for flag clearing.
0
Transmit Data Register Empty
0
Receive Data Register Full
0
Overrun Error
0
Framing Error
0
Parity Error
0
Transmit End
Note: 1. The DMAC is not supported in the H8S/2321.
Note: 1. The DMAC is not supported in the H8S/2321.
Note: 1. The DMAC is not supported in the H8S/2321.
0
Multiprocessor Bit
[Clearing condition]
When data with a 0 multiprocessor bit is received
Multiprocessor Bit Transfer
0
1Data with a 0 multiprocessor bit is transmitted
Data with a 1 multiprocessor bit is transmitted
Bit
Initial value
Read/Write
:
:
:
[Setting condition]
When data with a 1 multiprocessor bit is received
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the DMAC
*1
or DTC is activated by a TXI interrupt
and writes data to TDR
[Setting conditions]
• When the TE bit in SCR is 0
• When TDRE = 1 at transmission of the last bit of a 1-byte
serial transmit character
1
[Clearing condition]
When 0 is written to PER after reading PER = 1
[Setting condition]
When, in reception, the number of 1 bits in the receive data plus the parity bit
does not match the parity setting (even or odd) specified by the O/E bit in SMR
1
[Clearing condition]
When 0 is written to FER after reading FER = 1
[Setting condition]
When the SCI checks the stop bit at the end of the receive
data when reception ends, and the stop bit is 0
[Clearing condition]
When 0 is written to ORER after reading ORER = 1
[Setting condition]
When the next serial reception is completed while RDRF = 1
[Clearing conditions]
• When 0 is written to RDRF after reading RDRF = 1
• When the DMAC
*1
or DTC is activated by an RXI interrupt and reads data from RDR
[Setting condition]
When serial reception ends normally and receive data is transferred
from RSR to RDR
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the DMAC
*1
or DTC is activated by a TXI interrupt and writes data to TDR
[Setting conditions]
• When the TE bit in SCR is 0
• When data is transferred from TDR to TSR and data can be written to TDR
1
1
1
1
1
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1180 of 1268
REJ09B0220-0600
SSR2—Serial Sta tus Register 2 H'FF8C Smart Card Interface 2
7
TDRE
1
R/(W)*
6
RDRF
0
R/(W)*
5
ORER
0
R/(W)*
4
ERS
0
R/(W)*
3
PER
0
R/(W)*
0
MPBT
0
R/W
2
TEND
1
R
1
MPB
0
R
Note: * Can only be written with 0 for flag clearing.
Transmit Data Register Empty
0
Receive Data Register Full
0
Overrun Error
0
Error Signal Status
0
Parity Error
0
Transmit End
0
Multiprocessor Bit
[Clearing condition]
When data with a 0 multiprocessor bit is received
Multiprocessor Bit Transfer
0
1Data with a 0 multiprocessor bit is transmitted
Data with a 1 multiprocessor bit is transmitted
Bit
Initial value
Read/Write
:
:
:
[Setting condition]
When data with a 1 multiprocessor bit is received
Transmission in progress
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the DMAC
*1
or DTC is activated by a TXI interrupt
and writes data to TDR
1
[Clearing condition]
When 0 is written to PER after reading PER = 1
[Setting condition]
When, in reception, the number of 1 bits in the receive data plus the parity bit
does not match the parity setting (even or odd) specified by the O/E bit in SMR
1
Data has been received normally, and there is no error signal
[Clearing conditions]
• On reset, or in standby mode or module stop mode
• When 0 is written to ERS after reading ERS =1
Error signal indicating detection of parity error has been sent by receiving device
[Setting condition]
When the error signal is sampled at the low level
[Clearing condition]
When 0 is written to ORER after reading ORER = 1
[Setting condition]
When the next serial reception is completed while RDRF = 1
[Clearing conditions]
• When 0 is written to RDRF after reading RDRF = 1
• When the DMAC
*1
or DTC is activated by an RXI interrupt and reads data from RDR
[Setting condition]
When serial reception ends normally and receive data is transferred from RSR to RDR
[Clearing conditions]
• When 0 is written to TDRE after reading TDRE = 1
• When the DMAC
*1
or DTC is activated by a TXI interrupt and writes data to TDR
[Setting conditions]
• When the TE bit in SCR is 0
• When data is transferred from TDR to TSR and data can be written to TDR
Notes: etu: Elementary time unit (time for transfer of 1 bit)
1. The DMAC is not supported in the H8S/2321.
1
Note: Clearing the TE bit in SCR to 0 does not affect the ERS flag, which retains its prior state.
1
1
1
0
1
Transmission has ended
[Setting conditions]
• On reset, or in standby mode or module stop mode
• When the TE bit in SCR is 0 and the ERS bit is 0
• When TDRE = 1 and ERS = 0 (normal transmission) 2.5 etu after
transmission of a 1-byte serial character when GM = 0 and BLK = 0
• When TDRE = 1 and ERS = 0 (normal transmission) 1.5 etu after
transmission of a 1-byte serial character when GM = 0 and BLK = 1
• When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after
transmission of a 1-byte serial character when GM = 1 and BLK = 0
• When TDRE = 1 and ERS = 0 (normal transmission) 1.0 etu after
transmission of a 1-byte serial character when GM = 1 and BLK = 1
Note: 1. The DMAC is not supported in the H8S/2321.
Note: 1. The DMAC is not supported in the H8S/2321.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1181 of 1268
REJ09B0220-0600
RDR2—Receive Data Register 2 H'FF8D SCI2, Smart Card Interface 2
7
0
R
6
0
R
5
0
R
4
0
R
3
0
R
0
0
R
2
0
R
1
0
R
Stores received serial data
Bit
Initial value
Read/Write
:
:
:
SCMR2—Smart Card Mode Register 2 H'FF8E SCI2, Smart Card Interface 2
7
—
1
—
6
—
1
—
5
—
1
—
4
—
1
—
3
SDIR
0
R/W
0
SMIF
0
R/W
2
SINV
0
R/W
1
—
1
—
0
1
TDR contents are transmitted LSB-first
Receive data is stored in RDR LSB-first
Smart Card Data Direction
0TDR contents are transmitted as they are
Receive data is stored in RDR as it is
Smart Card Data Invert
0
1
Smart card interface
function is disabled
Smart Card
Interface Mode Select
Bit
Initial value
Read/Write
:
:
:
Smart card interface
function is enabled
TDR contents are inverted before
being transmitted
Receive data is stored in RDR
in inverted form
1
TDR contents are transmitted MSB-first
Receive data is stored in RDR MSB-first
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1182 of 1268
REJ09B0220-0600
ADDRAH — A/D Data Register AH H'FF90 A/D Co nverter
ADDRAL — A/D Data Register AL H'FF91 A/D Converter
ADDRBH — A/D Data Register BH H'FF92 A/D Co nverter
ADDRBL — A/D Data Register BL H'FF93 A/D Converter
ADDRCH — A/D Data Register CH H'FF94 A/D Co nverter
ADDRCL — A/D Data Register CL H'FF95 A/D Converter
ADDRDH — A/D Data Register DH H'FF96 A/D Co nverter
ADDRDL — A/D Data Register DL H'FF97 A/D Converter
15
AD9
0
R
14
AD8
0
R
13
AD7
0
R
12
AD6
0
R
11
AD5
0
R
10
AD4
0
R
9
AD3
0
R
8
AD2
0
R
7
AD1
0
R
6
AD0
0
R
5
—
0
R
4
—
0
R
3
—
0
R
2
—
0
R
1
—
0
R
0
—
0
R
Stores the results of A/D conversion
Analog Input Channel A/D Data Register
Bit
Initial value
Read/Write
:
:
:
Group 0
AN0
AN1
AN2
AN3
Group 1
AN4
AN5
AN6
AN7
ADDRA
ADDRB
ADDRC
ADDRD
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1183 of 1268
REJ09B0220-0600
ADCSR—A/D Control/Sta tus Reg ister H'FF98 A/D Co nverter
[Clearing conditions]
• When 0 is written to the ADF flag after reading ADF = 1
• When the DMAC*2 or DTC is activated by an ADI interrupt, and ADDR is read
7
ADF
0
R/(W)*1
6
ADIE
0
R/W
5
ADST
0
R/W
4
SCAN
0
R/W
3
CKS
0
R/W
0
CH0
0
R/W
2
CH2
0
R/W
1
CH1
0
R/W
Notes: 1. Can only be written with 0 for flag clearing.
2. The DMAC is not supported in the H8S/2321.
0
1
A/D conversion end interrupt request disabled
A/D conversion end interrupt request enabled
A/D Interrupt Enable
0
1
Single mode
Scan mode
Scan Mode
0
1
A/D conversion stopped
A/D Start
0
A/D End Flag
CH1
0
1
0
1
CH0
0
1
0
1
0
1
0
1
Single Mode
(SCAN = 0)
AN0
AN0, AN1
AN0 to AN2
AN0 to AN3
AN4
AN4, AN5
AN4 to AN6
AN4 to AN7
Bit
Initial value
Read/Write
:
:
:
• Single mode: A/D conversion is started. Cleared to 0
automatically when conversion ends
• Scan mode: A/D conversion is started. Conversion continues
sequentially on the selected channels until ADST is cleared to
0 by software, a reset, or transition to standby mode or
module stop mode
[Setting conditions]
• Single mode: When A/D conversion ends
• Scan mode: When A/D conversion ends on all specified channels
1
CH2
0
1
Group
Selection Channel
Selection
AN0
(Initial value)
AN1
AN2
AN3
AN4
AN5
AN6
AN7
Scan Mode
(SCAN = 1)
Clock Select
Note: CKS is used in combination with bit 3 (CKS1)
of ADCR.
See ADCR—A/D Control Register
H'FF99 A/D Converter.
Channel Select
Note: These bits select the analog input channels.
Ensure that conversion is halted (ADST = 0)
before making a channel selection.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1184 of 1268
REJ09B0220-0600
ADCR—A/D Control Register H'FF9 9 A/D Conv erter
7
TRGS1
0
R/W
6
TRGS0
0
R/W
5
—
1
—
4
—
1
—
3
CKS1
1
R/W
0
—
1
—
2
CH3
1
R/W
1
—
1
—
0
1
0
1
0
1
Description
Channel Select
Reserved
Only 1 should be written
to this bit
Timer Trigger Select
Bit
Initial value
Read/Write
:
:
:
A/D conversion start by external trigger is disabled
A/D conversion start by external trigger (TPU) is enabled
A/D conversion start by external trigger (8-bit timer) is enabled
A/D conversion start by external trigger pin (ADTRG) is enabled
TRGS1TRGS1
0
1
0
1
0
1
Description
Clock Select
Conversion time = 530 states (max)
Conversion time = 68 states (max)
Conversion time = 266 states (max) (Initial value)
Conversion time = 134 states (max)
CKSCKS1
ADCSR
Bit 3Bit 3
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1185 of 1268
REJ09B0220-0600
DADR0—D/A Data Register 0 H'FFA4 D/A Converter
DADR1—D/A Data Register 1 H'FFA5 D/A Converter
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
0
0
R/W
2
0
R/W
1
0
R/W
Stores data for D/A conversion
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1186 of 1268
REJ09B0220-0600
DACR01—D/A Control Register 0 1 H'FFA6 D/A Converter
7
DAOE1
0
R/W
6
DAOE0
0
R/W
5
DAE
0
R/W
4
—
1
—
3
—
1
—
0
—
1
—
2
—
1
—
1
—
1
—
D/A Conversion Control
DAOE1 DAOE0 DAE Description
0
1
0
1
0
1
*
0
1
0
1
*
Channel 0 and 1 D/A conversion disabled
Channel 0 D/A conversion enabled
Channel 1 D/A conversion disabled
Channel 0 and 1 D/A conversion enabled
Channel 0 D/A conversion disabled
Channel 1 D/A conversion enabled
Channel 0 and 1 D/A conversion enabled
Channel 0 and 1 D/A conversion enabled
* : Don’t care
0
1
Analog output DA
0
is disabled
Channel 0 D/A conversion is enabled
D/A Output Enable 0
0
1
Analog output DA
1
is disabled
Channel 1 D/A conversion is enabled
D/A Output Enable 1
Bit
Initial value
Read/Write
:
:
:
Analog output DA
0
is enabled
Analog output DA
1
is enabled
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1187 of 1268
REJ09B0220-0600
PFCR2—Port Function Control Register 2 H'FFAC Ports
0
1
CS2, CS3, CS4, and CS5 output disabled
(can be used as I/O ports)
CS2, CS3, CS4, and CS5 output enabled
CS25 Enable
0
1
CS1, CS6, and CS7 output disabled
(can be used as I/O ports)
CS1, CS6, and CS7 output enabled
CS167 Enable
0
1
BREQO output is PF2 pin
BREQO output is P53 pin
BREQO Pin Select
0
1
WAIT input is PF2 pin
WAIT input is P53 pin
WAIT Pin Select
7
WAITPS
0
R/W
6
BREQOPS
0
R/W
5
CS167E
1
R/W
4
CS25E
1
R/W
3
ASOD
R/W
0
—
0
R
2
—
0
R
1
—
0
R
Bit
Initial value
Read/Write
:
:
:
0
1PF6 is designated as AS output pin
PF6 is designated as I/O port, and
does not function as AS output pin
AS Output Disable
Note: This bit is valid in modes 4 to 6.
Note: Clear the DDR bits to 0 before changing
the CS25E setting.
Note: Clear the DDR bits to 0 before changing
the CS167E setting.
Note: Set BREQOPS before setting
the BREQOE bit in BCRL to 1.
Note: Set WAITPS before setting
the WAITE bit in BCRL to 1.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1188 of 1268
REJ09B0220-0600
TCR0—Time Control Register 0 H'FFB0 8-Bit Timer Channel 0
TCR1—Time Control Register 1 H'FFB1 8-Bit Timer Channel 1
7
CMIEB
0
R/W
6
CMIEA
0
R/W
5
OVIE
0
R/W
4
CCLR1
0
R/W
3
CCLR0
0
R/W
0
CKS0
0
R/W
2
CKS2
0
R/W
1
CKS1
0
R/W
Note: *
000
1
Clock input disabled
Internal clock: counted at falling edge
of ø/8
Internal clock: counted at falling edge
of ø/64
10
Internal clock: counted at falling edge
of ø/8192
1
1 0 0 For channel 0:
Count at TCNT1 overflow signal*
For channel 1:
Count at TCNT0 compare match A*
External clock: counted at rising edge
External clock: counted at falling edge
1
0
1External clock: counted at both rising and
falling edges
1
Clock Select
0
1
CMFB interrupt requests (CMIB) are disabled
CMFB interrupt requests (CMIB) are enabled
Compare Match Interrupt Enable B
0
1
CMFA interrupt requests (CMIA) are disabled
CMFA interrupt requests (CMIA) are enabled
Compare Match Interrupt Enable A
0
1
OVF interrupt requests (OVI) are disabled
OVF interrupt requests (OVI) are enabled
Timer Overflow Interrupt Enable
0
1
Clear is disabled
Clear by compare match A
Clear by compare match B
Clear by rising edge of external reset input
0
1
0
1
Counter Clear
Bit
Initial value
Read/Write
If the count input of channel 0 is the TCNT1 overflow
signal and that of channel 1 is the TCNT0 compare
match signal, no incrementing clock is generated.
Do not use this setting.
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1189 of 1268
REJ09B0220-0600
TCSR0—Timer Control/Status Register 0 H'FFB2 8-Bit Timer Channel 0
TCSR1—Timer Control/Status Register 1 H'FFB3 8-Bit Timer Channel 1
7
CMFB
0
R/(W)*
6
CMFA
0
R/(W)*
5
OVF
0
R/(W)*
4
—
1
—
3
OS3
0
R/W
0
OS0
0
R/W
2
OS2
0
R/W
1
OS1
0
R/W
TCSR1
7
CMFB
0
R/(W)*
6
CMFA
0
R/(W)*
5
OVF
0
R/(W)*
4
ADTE
0
R/W
3
OS3
0
R/W
0
OS0
0
R/W
2
OS2
0
R/W
1
OS1
0
R/W
TCSR0
Note: * Only 0 can be written to bits 7 to 5, to clear these flags.
0
1
Compare Match Flag B
0
1
Compare Match Flag A
0 [Clearing condition]
When 0 is written to OVF after reading OVF = 1
1
Timer Overflow Flag
0
1
A/D converter start requests by compare match A are disabled
A/D converter start requests by compare match A are enabled
A/D Trigger Enable (TCSR0 only)
0
1
No change when compare match B occurs
0 is output when compare match B occurs
1 is output when compare match B occurs
0
1
0
1
Output Select
Bit
Initial value
Read/Write
:
:
:
Bit
Initial value
Read/Write
:
:
:
[Setting condition]
When TCNT overflows (changes from H'FF to H'00)
[Clearing conditions]
• When 0 is written to CMFA after reading CMFA = 1
• When the DTC is activated by a CMIA interrupt, while the DISEL bit of MRB in DTC is 0
[Setting condition]
When TCNT matches TCORA
[Clearing conditions]
• When 0 is written to CMFB after reading CMFB = 1
• When the DTC is activated by a CMIB interrupt, while the DISEL bit of MRB in DTC is 0
[Setting condition]
When TCNT matches TCORB
Output is inverted when compare match B
occurs (toggle output)
0 No change when compare
match A occurs
0
Output Select
Output is inverted when
compare match A
occurs (toggle output)
1 is output when compare
match A occurs
0 is output when compare
match A occurs
1
1
0
1
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1190 of 1268
REJ09B0220-0600
TCORA0—Time Constant Register A0 H'FFB4 8-Bit Timer Channel 0
TCORA1—Time Constant Register A1 H'FFB5 8-Bit Timer Channel 1
15
1
R/W
14
1
R/W
13
1
R/W
12
1
R/W
11
1
R/W
10
1
R/W
9
1
R/W
8
1
R/W
7
1
R/W
6
1
R/W
5
1
R/W
4
1
R/W
3
1
R/W
2
1
R/W
1
1
R/W
0
1
R/W
TCORA0 TCORA1
Bit
Initial value
Read/Write
:
:
:
TCORB0—Time Constant Register B0 H'FFB6 8-Bit Timer Channel 0
TCORB1—Time Constant Register B1 H'FFB7 8-Bit Timer Channel 1
15
1
R/W
14
1
R/W
13
1
R/W
12
1
R/W
11
1
R/W
10
1
R/W
9
1
R/W
8
1
R/W
7
1
R/W
6
1
R/W
5
1
R/W
4
1
R/W
3
1
R/W
2
1
R/W
1
1
R/W
0
1
R/W
TCORB0 TCORB1
Bit
Initial value
Read/Write
:
:
:
TCNT0—Timer Counter 0 H'FFB8 8-Bit Timer Channel 0
TCNT1—Timer Counter 1 H'FFB9 8-Bit Timer Channel 1
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
0
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
0
R/W
TCNT0 TCNT1
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1191 of 1268
REJ09B0220-0600
TCSR—Timer Control/Status Register H'FFBC (W), H'FFBC (R) WDT
Notes: 1. The method for writing to TCSR is different from that for general registers to prevent
accidental overwriting. For details, see section 13.2.4, Notes on Register Access.
2. Can only be written with 0 for flag clearing.
0 [Clearing condition]
When 0 is written to OVF after reading OVF = 1
1
Overflow Flag
0 Interval timer mode: Sends the CPU an interval timer interrupt
request (WOVI) when TCNT overflows
Watchdog timer mode: Generates the WDTOVF signal*1 when
TCNT overflows*2
1
Timer Mode Select
0
1TCNT is initialized to H'00 and halted
TCNT counts
Timer Enable
Clock Select
CKS2 CKS1 CKS0 Clock Overflow period*
(when φ = 20 MHz)
0
1
0
1
0
1
0
1
0
1
0
1
0
1
φ/2 (Initial value)
φ/64
φ/128
φ/512
φ/2048
φ/8192
φ/32768
φ/131072
25.6 µs
819.2 µs
1.6 ms
6.6 ms
26.2 ms
104.9 ms
419.4 ms
1.68 s
Note: * The overflow period is the time from when TCNT
starts counting up from H'00 until overflow occurs.
[Setting condition]
When TCNT overflows from H'FF to H'00 in interval timer mode
7
OVF
0
R/(W)*2
6
WT/IT
0
R/W
5
TME
0
R/W
4
—
1
—
3
—
1
—
0
CKS0
0
R/W
2
CKS2
0
R/W
1
CKS1
0
R/W
Bit
Initial value
Read/Write*1
:
:
:
Notes: 1. The WDTOVF pin function is not available in the F-ZTAT versions.
2. For details of the case where TCNT overflows in watchdog timer
mode, see section 13.2.3, Reset Control/Status Register (RSTCSR).
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1192 of 1268
REJ09B0220-0600
TCNT—Timer Counter H'FFBC (W), H'FFBD (R) WDT
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
0
0
R/W
2
0
R/W
1
0
R/W
Bit
Initial value
Read/Write
:
:
:
RSTCSR—Re set Control/Status Register H'FFBE (W), H'FFBF (R) WDT
7
WOVF
0
R/(W)*
6
RSTE
0
R/W
5
—
0
R/W
4
—
1
—
3
—
1
—
0
—
1
—
2
—
1
—
1
—
1
—
0
1
[Clearing condition]
When 0 is written to WOVF after reading RSTCSR when WOVF = 1
Watchdog Timer Overflow Flag
0
1
Reset Enable
Reset signal is not generated if TCNT overflows*
Reset signal is generated if TCNT overflows
Reserved
This bit should be written with 0
Bit
Initial value
Read/Write
:
:
:
[Setting condition]
When TCNT overflows (changes from H'FF to H'00) during watchdog
timer operation
Note: * The modules in the H8S/2329 and H8S/2328 Groups are
not reset, but TCNT and TCSR in WDT are reset.
Note: * Can only be written with 0 for flag clearing.
The method for writing to RSTCSR is different from that for general registers to prevent accidental
overwriting. For details, see section 13.2.4, Notes on Register Access.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1193 of 1268
REJ09B0220-0600
TSTR—Timer Start Register H'FFC0 TPU
7
—
0
—
6
—
0
—
5
CST5
0
R/W
4
CST4
0
R/W
3
CST3
0
R/W
0
CST0
0
R/W
2
CST2
0
R/W
1
CST1
0
R/W
Counter Start
0
1
TCNTn count operation is stopped
TCNTn performs count operation
Note:
(n = 5 to 0)
If 0 is written to the CST bit during operation with the TIOC pin designated for output,
the counter stops but the TIOC pin output compare output level is retained. If TIOR
is written to when the CST bit is cleared to 0, the pin output level will be changed to
the set initial output value.
Bit
Initial value
Read/Write
:
:
:
TSYR—Timer Synchro Reg ister H'FFC1 TPU
7
—
0
—
6
—
0
—
5
SYNC5
0
R/W
4
SYNC4
0
R/W
3
SYNC3
0
R/W
0
SYNC0
0
R/W
2
SYNC2
0
R/W
1
SYNC1
0
R/W
Timer Synchronization
0
1
TCNTn operates independently (TCNT presetting/
clearing is unrelated to other channels)
(n = 5 to 0)
Notes: To set synchronous operation, the SYNC bits for at least two channels must
be set to 1.
To set synchronous clearing, in addition to the SYNC bit , the TCNT clearing
source must also be set by means of bits CCLR2 to CCLR0 in TCR.
1.
2.
Bit
Initial value
Read/Write
:
:
:
TCNTn performs synchronous operation
TCNT synchronous presetting/synchronous clearing
is possible
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1194 of 1268
REJ09B0220-0600
FLMCR1—Flash Memory Control Register 1 H'FFC8 Flash Memory
(H8S/2329B F-ZTAT, H8S/2328B F-ZTAT)
7
FWE
—*
R
6
SWE
0
R/W
5
ESU
0
R/W
4
PSU
0
R/W
3
EV
0
R/W
0
P
0
R/W
2
PV
0
R/W
1
E
0
R/W
Bit
Initial value
Read/Write
:
:
:
Program
0 Program mode cleared
1 Transition to program mode
[Setting condition]
When FWE = 1, SWE = 1, and PSU = 1
Erase
0 Erase mode cleared
1 Transition to erase mode
[Setting condition]
When FWE = 1, SWE = 1, and ESU = 1
Program-Verify
0 Program-verify mode cleared
1 Transition to program-verify mode
[Setting condition]
When FWE = 1 and SWE = 1
Software Write Enable
0 Writes disabled
1 Writes enabled
[Setting condition]
When FWE = 1
Flash Write Enable
Note: * Determined by the state of the FWE pin (H8S/2328B F-ZTAT).
The FWE bit is fixed high in the H8S/2329B F-ZTAT.
0 When a low level is input to the FWE pin (hardware-protected state)
1 When a high level is input to the FWE pin
Erase-Verify
0 Erase-verify mode cleared
1 Transition to erase-verify mode
[Setting condition]
When FWE = 1 and SWE = 1
Program Setup
0 Program setup cleared
1 Program setup
[Setting condition]
When FWE = 1 and SWE = 1
Erase Setup
0 Erase setup cleared
1 Erase setup
[Setting condition]
When FWE = 1 and SWE = 1
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1195 of 1268
REJ09B0220-0600
FLMCR1—Flash Memory Control Register 1 H'FFC8 Flash Memory
(H8S/2326 F-ZTAT)
7
FWE
—
*1
R
6
SWE1
0
R/W
5
ESU1
0
R/W
4
PSU1
0
R/W
3
EV1
0
R/W
0
P1
0
R/W
2
PV1
0
R/W
1
E1
0
R/W
Erase 1*2
Program 1*2
Bit
Initial value
R/W
:
:
:
0 Program mode cleared
1 Transition to program mode
[Setting condition]
When FWE = 1, SWE1 = 1,
and PSU1 = 1
0 Erase mode cleared
1 Transition to erase mode
[Setting condition]
When FWE = 1, SWE1 = 1,
and ESU1 = 1
Program-Verify 1*2
0 Program-verify mode cleared
1 Transition to program-verify mode
[Setting condition]
When FWE = 1 and SWE1 = 1
Erase-Verify 1*2
0 Erase-verify mode cleared
1 Transition to erase-verify mode
[Setting condition]
When FWE = 1 and SWE1 = 1
Erase Setup 1*2
0 Erase setup cleared
1 Erase setup
[Setting condition]
When FWE = 1 and SWE1 = 1
Program Setup 1*2
0 Program setup cleared
1 Program setup
[Setting condition]
When FWE = 1 and SWE1 = 1
Software Write Enable 1*2
0 Writes disabled
1 Writes enabled
[Setting condition]
When FWE = 1
Flash Write Enable
Notes: 1. Determined by the state of the FWE pin.
2. Applicable addresses are H'000000 to H'03FFFF.
0 When a low level is input to the FWE pin (hardware-protected state)
1 When a high level is input to the FWE pin
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1196 of 1268
REJ09B0220-0600
FLMCR2—Flash Memory Control Register 2 H'FFC9 Flash Memory
(H8S/2329B F-ZTAT, H8S/2328B F-ZTAT)
7
FLER
0
R
6
—
0
—
5
—
0
—
4
—
0
—
3
—
0
—
0
—
0
—
2
—
0
—
1
—
0
—
Bit
Initial value
Read/Write
:
:
:
Flash Memory Error
0 Flash memory is operating normally
Flash memory program/erase protection (error protection) is disabled
[Clearing condition]
Reset or hardware standby mode
1 An error has occurred during flash memory programming/erasing
Flash memory program/erase protection (error protection) is enabled
[Setting condition]
See section 19.8.3, Error Protection. (H8S/2329B F-ZTAT)
See section 19.17.3, Error Protection. (H8S/2328B F-ZTAT)
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1197 of 1268
REJ09B0220-0600
FLMCR2—Flash Memory Control Register 2 H'FFC9 Flash Memory
(H8S/2326 F-ZTAT)
7
FLER
0
R
6
SWE2
0
R/W
5
ESU2
0
R/W
4
PSU2
0
R/W
3
EV2
0
R/W
0
P2
0
R/W
2
PV2
0
R/W
1
E2
0
R/W
Erase 2*
Program 2*
Bit
Initial value
R/W
:
:
:
0 Program mode cleared
1 Transition to program mode
[Setting condition]
When FWE = 1, SWE2 = 1,
and PSU2 = 2
0 Erase mode cleared
1 Transition to erase mode
[Setting condition]
When FWE = 1, SWE2 = 1,
and ESU2 = 1
Program-Verify 2*
0 Program-verify mode cleared
1 Transition to program-verify mode
[Setting condition]
When FWE = 1 and SWE2 = 1
Erase-Verify 2*
0 Erase-verify mode cleared
1 Transition to erase-verify mode
[Setting condition]
When FWE = 1 and SWE2 = 1
Erase Setup 2*
0 Erase setup cleared
1 Erase setup
[Setting condition]
When FWE = 1 and SWE2 = 1
Program Setup 2*
0 Program setup cleared
1 Program setup
[Setting condition]
When FWE = 1 and SWE2 = 1
Software Write Enable 2*
0 Writes disabled
1 Writes enabled
[Setting condition]
When FWE = 1
Flash Memory Error
Note: * Applicable addresses are H'040000 to H'07FFFF.
0 Flash memory is operating normally
Flash memory program/erase protection (error protection) disabled
[Clearing condition]
Reset or hardware standby mode
1 An error occurred during flash memory programming/erasing
Flash memory program/erase protection (error protection) enabled
[Setting condition]
See section 19.26.3, Error Protection
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1198 of 1268
REJ09B0220-0600
EBR1—Erase Blo ck Register 1 H'FFCA Flash M emory
(H8S/2329B F-ZTAT, H8S/2328B F-ZTAT)
EBR2—Erase Block Register 2 H'FFCB Flash Memory
(H8S/2329B F-ZTAT, H8S/2328B F-ZTAT)
7
EB7
0
R/W
6
EB6
0
R/W
5
EB5
0
R/W
4
EB4
0
R/W
3
EB3
0
R/W
0
EB0
0
R/W
2
EB2
0
R/W
1
EB1
0
R/W
Bit
EBR1
Initial value
Read/Write
:
:
:
7
—
0
—
6
—
0
—
5
EB13*
0
R/W
4
EB12*
0
R/W
3
EB11
0
R/W
0
EB8
0
R/W
2
EB10
0
R/W
1
EB9
0
R/W
Bit
EBR2
Initial value
Read/Write
:
:
:
Note: * Valid only in the H8S/2329B F-ZTAT.
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1199 of 1268
REJ09B0220-0600
EBR1—Erase Blo ck Register 1 H'FFCA Flash M emory
(H8S/2326 F-ZTAT)
EBR2—Erase Block Register 2 H'FFCB Flash Memory
(H8S/2326 F-ZTAT)
7
EB7
0
R/W
6
EB6
0
R/W
5
EB5
0
R/W
4
EB4
0
R/W
3
EB3
0
R/W
0
EB0
0
R/W
2
EB2
0
R/W
1
EB1
0
R/W
Bit
EBR1
Initial value
Read/Write
:
:
:
7
EB15
0
R/W
6
EB14
0
R/W
5
EB13
0
R/W
4
EB12
0
R/W
3
EB11
0
R/W
0
EB8
0
R/W
2
EB10
0
R/W
1
EB9
0
R/W
Bit
EBR2
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1200 of 1268
REJ09B0220-0600
TCR0—Timer Control Register 0 H'FFD0 TPU0
7
CCLR2
0
R/W
6
CCLR1
0
R/W
5
CCLR0
0
R/W
4
CKEG1
0
R/W
3
CKEG0
0
R/W
0
TPSC0
0
R/W
2
TPSC2
0
R/W
1
TPSC1
0
R/W
TCNT clearing disabled
TCNT cleared by TGRA compare match/input capture
TCNT cleared by TGRB compare match/input capture
TCNT cleared by counter clearing for another channel
Counter Clear
00
1
0
1
0
1
0
1
Clock Edge
0
1
—
Count at rising edge
Count at falling edge
Count at both edges
Internal clock: counts on φ/1
Internal clock: counts on φ/4
Internal clock: counts on φ/16
Internal clock: counts on φ/64
External clock: counts on TCLKA pin input
External clock: counts on TCLKB pin input
External clock: counts on TCLKC pin input
External clock: counts on TCLKD pin input
Time Prescaler
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Bit
Initial value
Read/Write
:
:
:
Notes: 1. Synchronous operation setting is performed by setting the
SYNC bit in TSYR to 1.
2. When TGRC or TGRD is used as a buffer register, TCNT is
not cleared because the buffer register setting has priority,
and compare match/input capture does not occur.
TCNT cleared by counter clearing for another channel
performing synchronous clearing/synchronous operation*
1
TCNT cleared by counter clearing for another channel
performing synchronous clearing/synchronous operation*
1
10
1
0
1
0
1
TCNT clearing disabled
TCNT cleared by TGRC compare match/input capture*
2
TCNT cleared by TGRD compare match/input capture*
2
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1201 of 1268
REJ09B0220-0600
TMDR0—Timer Mode Register 0 H'FFD1 TPU0
7
—
1
—
6
—
1
—
5
BFB
0
R/W
4
BFA
0
R/W
3
MD3
0
R/W
0
MD0
0
R/W
2
MD2
0
R/W
1
MD1
0
R/W
0
1
TGRB Buffer Operation
TGRB operates normally
0
1
TGRA Buffer Operation
TGRA operates normally
0
1
Normal operation
Reserved
PWM mode 1
PWM mode 2
Phase counting mode 1
Phase counting mode 2
Phase counting mode 3
Phase counting mode 4
—
Mode
0
1
*
0
1
0
1
*
0
1
0
1
0
1
0
1
*
Notes: 1.
2.
MD3 is a reserved bit. In a write, it
should always be written with 0.
Phase counting mode cannot be
set for channels 0 and 3. In this
case, 0 should always be written to
MD2.
* : Don’t care
Bit
Initial value
Read/Write
:
:
:
TGRA and TGRC used together
for buffer operation
TGRB and TGRD used together
for buffer operation
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1202 of 1268
REJ09B0220-0600
TIOR0H—Timer I/O Control Register 0H H'FFD2 TPU0
7
IOB3
0
R/W
6
IOB2
0
R/W
5
IOB1
0
R/W
4
IOB0
0
R/W
3
IOA3
0
R/W
0
IOA0
0
R/W
2
IOA2
0
R/W
1
IOA1
0
R/W
0
1
TGR0B I/O Control
0
1
0
1
0
1
0
1
0
1
*
0
1
0
1
0
1
0
1
0
1
*
*
0
1
TGR0A
is output
compare
register
TGR0A I/O Control
0
1
0
1
0
1
0
1
0
1
*
0
1
0
1
0
1
0
1
0
1
*
*
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
0 output at compare match
1 output at compare match
Toggle output at compare match
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
* : Don’t care
* : Don’t care
Note: 1. When bits TPSC2 to TPSC0 in TCR1 are set to B'000, and φ/1 is used as
the TCNT1 count clock, this setting is invalid and input capture does not occur.
Bit
Initial value
Read/Write
:
:
:
Initial output is
0 output
TGR0A
is input
capture
register
Output disabled
Initial output is
1 output
Capture input
source is
TIOCA
0
pin
Capture input
source is channel
1/count clock
Input capture at TCNT1 count-up/
count-down
TGR0B
is output
compare
register
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
0 output at compare match
1 output at compare match
Toggle output at compare match
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Initial output is
0 output
TGR0B
is input
capture
register
Output disabled
Initial output is
0 output
Capture input
source is
TIOCB
0
pin
Capture input
source is channel
1/count clock
Input capture at TCNT1 count-up/
count-down*
1
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1203 of 1268
REJ09B0220-0600
TIOR0L—Timer I/O Control Register 0L H'FFD3 TPU0
0
1
TGR0D I/O Control
0
1
0
1
0
1
0
1
0
1
*
0
1
0
1
0
1
0
1
0
1
*
*
0
1
TGR0C I/O Control
0
1
0
1
0
1
0
1
0
1
*
0
1
0
1
0
1
0
1
0
1
*
*
* : Don’t care
*
: Don’t care
Notes: 1. When bits TPSC2 to TPSC0 in TCR1 are set to B'000, and φ/1 is used as
the TCNT1 count clock, this setting is invalid and input capture does not
occur.
2. When the BFB bit in TMDR0 is set to 1 and TGR0D is used as a buffer
register, this setting is invalid and input capture/output compare does not
occur.
Note: When the BFA bit in TMDR0 is set to 1 and TGR0C is used as a buffer
register, this setting is invalid and input capture/output compare does not
occur.
7
IOD3
0
R/W
6
IOD2
0
R/W
5
IOD1
0
R/W
4
IOD0
0
R/W
3
IOC3
0
R/W
0
IOC0
0
R/W
2
IOC2
0
R/W
1
IOC1
0
R/W
Note: When TGRC or TGRD is designated for buffer operation, this setting is invalid and the register operates as a buffer register.
Bit
Initial value
Read/Write
:
:
:
:
TGR0C
is output
compare
register
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
0 output at compare match
1 output at compare match
Toggle output at compare match
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Initial output is
0 output
TGR0C
is input
capture
register
Output disabled
Initial output is
1 output
Capture input
source is
TIOCC
0
pin
Capture input
source is channel
1/count clock
Input capture at TCNT1 count-up/
count-down
TGR0D
is output
compare
register
*
2
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
0 output at compare match
1 output at compare match
Toggle output at compare match
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Initial output is
0 output
TGR0D
is input
capture
register
*
2
Output disabled
Initial output is
1 output
Capture input
source is
TIOCD
0
pin
Capture input
source is channel
1/count clock
Input capture at TCNT1 count-up/
count-down*
1
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1204 of 1268
REJ09B0220-0600
TIER0—Timer Interrupt Enable Register 0 H'FFD4 TPU0
7
TTGE
0
R/W
6
—
1
—
5
—
0
—
4
TCIEV
0
R/W
3
TGIED
0
R/W
0
TGIEA
0
R/W
2
TGIEC
0
R/W
1
TGIEB
0
R/W
0
1
A/D conversion start request generation disabled
A/D conversion start request generation enabled
A/D Conversion Start Request Enable
0
1
Interrupt request (TCIV) by TCFV disabled
Interrupt request (TCIV) by TCFV enabled
Overflow Interrupt Enable
TGR Interrupt Enable D
TGR Interrupt Enable C
TGR Interrupt Enable B
0
1
Interrupt request (TGIA)
by TGFA bit disabled
TGR Interrupt Enable A
0
1
Interrupt request (TGIB)
by TGFB bit disabled
0
1
Interrupt request (TGIC) by
TGFC bit disabled
0
1
Interrupt request (TGID) by TGFD
bit disabled
Bit
Initial value
Read/Write
:
:
:
Interrupt request (TGIA)
by TGFA bit enabled
Interrupt request (TGIB)
by TGFB bit enabled
Interrupt request (TGIC) by
TGFC bit enabled
Interrupt request (TGID) by TGFD
bit enabled
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1205 of 1268
REJ09B0220-0600
TSR0—Timer Status Register 0 H'FFD5 TPU0
7
—
1
—
6
—
1
—
5
—
0
—
4
TCFV
0
R/(W)*
3
TGFD
0
R/(W)*
0
TGFA
0
R/(W)*
2
TGFC
0
R/(W)*
1
TGFB
0
R/(W)*
Note: * Can only be written with 0 for flag clearing.
0
Overflow Flag
1
0
Input Capture/Output Compare Flag D
1
0
Input Capture/Output Compare Flag C
1
0
Input Capture/Output Compare Flag B
1
0 [Clearing conditions]
• When DTC is activated by TGIA interrupt while
DISEL bit of MRB in DTC is 0
• When DMAC*1 is activated by TGIA interrupt
while DTA bit of DMABCR in DMAC*1 is 1
• When 0 is written to TGFA after reading
TGFA = 1
Input Capture/Output Compare Flag A
Note: 1. The DMAC is not supported in the H8S/2321.
1
Bit
Initial value
Read/Write
:
:
:
[Setting conditions]
• When TCNT = TGRA while TGRA is functioning
as output compare register
• When TCNT value is transferred to TGRA by
input capture signal while TGRA is functioning
as input capture register
[Clearing conditions]
• When DTC is activated by TGIB interrupt while DISEL bit
of MRB in DTC is 0
• When 0 is written to TGFB after reading TGFB = 1
[Setting conditions]
• When TCNT = TGRB while TGRB is functioning as
output compare register
• When TCNT value is transferred to TGRB by input
capture signal while TGRB is functioning as input capture
register
[Clearing conditions]
• When DTC is activated by TGIC interrupt while DISEL bit of MRB in
DTC is 0
• When 0 is written to TGFC after reading TGFC = 1
[Setting conditions]
• When TCNT = TGRC while TGRC is functioning as output compare
register
• When TCNT value is transferred to TGRC by input capture signal
while TGRC is functioning as input capture register
[Clearing conditions]
• When DTC is activated by TGID interrupt while DISEL bit of MRB in DTC
is 0
• When 0 is written to TGFD after reading TGFD = 1
[Setting conditions]
• When TCNT = TGRD while TGRD is functioning as output compare register
• When TCNT value is transferred to TGRD by input capture signal while
TGRD is functioning as input capture register
[Clearing condition]
When 0 is written to TCFV after reading TCFV = 1
[Setting condition]
When the TCNT value overflows (changes from H'FFFF to H'0000 )
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1206 of 1268
REJ09B0220-0600
TCNT0—Timer Counter 0 H'FFD6 TPU0
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
8
0
R/W
10
0
R/W
9
0
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
0
0
R/W
2
0
R/W
1
0
R/W
Note: *
Up/down-counter*
Bit
Initial value
Read/Write
:
:
:
This timer counter can be used as an up/down-counter only in phase counting
mode or when performing overflow/underflow counting on another channel. In
other cases it functions as an up-counter.
TGR0A—Timer General Register 0A H'FFD8 TPU0
TGR0B—Timer General Register 0B H'FFDA TPU0
TGR0C—Timer General Register 0C H'FFDC TPU0
TGR0D—Timer General Register 0D H'FFDE TPU0
15
1
R/W
14
1
R/W
13
1
R/W
12
1
R/W
11
1
R/W
8
1
R/W
10
1
R/W
9
1
R/W
7
1
R/W
6
1
R/W
5
1
R/W
4
1
R/W
3
1
R/W
0
1
R/W
2
1
R/W
1
1
R/W
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1207 of 1268
REJ09B0220-0600
TCR1—Timer Control Register 1 H'FFE0 TPU1
TCNT clearing disabled
TCNT cleared by TGRA compare match/input capture
TCNT cleared by TGRB compare match/input capture
Counter Clear
0
1
0
1
0
1
0
1
Clock Edge*
0
1
—
Count at rising edge
Count at falling edge
Count at both edges
Internal clock: counts on φ/1
Internal clock: counts on φ/4
Internal clock: counts on φ/16
Internal clock: counts on φ/64
External clock: counts on TCLKA pin input
External clock: counts on TCLKB pin input
Internal clock: counts on φ/256
Counts on TCNT2 overflow/underflow
Time Prescaler
0
1
0
1
0
1
0
1
0
1
0
1
0
1
7
—
0
—
6
CCLR1
0
R/W
5
CCLR0
0
R/W
4
CKEG1
0
R/W
3
CKEG0
0
R/W
0
TPSC0
0
R/W
2
TPSC2
0
R/W
1
TPSC1
0
R/W
Note: This setting is ignored when channel 1 is in phase
counting mode.
Note: *Synchronous operation setting is performed by setting
the SYNC bit in TSYR to 1.
Bit
Initial value
Read/Write
:
:
:
Note: This setting is ignored when channel
1 is in phase counting mode.
TCNT cleared by counter clearing for another channel
performing synchronous clearing/synchronous operation*
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1208 of 1268
REJ09B0220-0600
TMDR1—Timer Mode Register 1 H'FFE1 TPU1
0
1
Normal operation
Reserved
PWM mode 1
PWM mode 2
Phase counting mode 1
Phase counting mode 2
Phase counting mode 3
Phase counting mode 4
—
Mode
0
1
*
0
1
0
1
*
0
1
0
1
0
1
0
1
*
Note: MD3 is a reserved bit. In a write, it
should always be written with 0.
* : Don’t care
7
—
1
—
6
—
1
—
5
—
0
—
4
—
0
—
3
MD3
0
R/W
0
MD0
0
R/W
2
MD2
0
R/W
1
MD1
0
R/W
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1209 of 1268
REJ09B0220-0600
TIOR1—Timer I/O Control Register 1 H'FFE2 TPU1
7
IOB3
0
R/W
6
IOB2
0
R/W
5
IOB1
0
R/W
4
IOB0
0
R/W
3
IOA3
0
R/W
0
IOA0
0
R/W
2
IOA2
0
R/W
1
IOA1
0
R/W
0
1
TGR1B I/O Control
0
1
0
1
0
1
0
1
0
1
*
0
1
0
1
0
1
0
1
0
1
*
*
TGR1A I/O Control
* : Don’t care
0
1
0
1
0
1
0
1
0
1
0
1
*
0
1
0
1
0
1
0
1
0
1
*
*
* : Don’t care
Bit
Initial value
Read/Write
:
:
:
TGR1A
is output
compare
register
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
0 output at compare match
1 output at compare match
Toggle output at compare match
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Initial output is
0 output
TGR1A
is input
capture
register
Output disabled
Initial output is
1 output
Capture input
source is
TIOCA
1
pin
Capture input
source is TGR0A
compare match/
input capture
Input capture at generation of
channel 0/TGR0A compare match/
input capture
TGR1B
is output
compare
register
Output disabled
0 output at compare match
1 output at compare match
Toggle output at compare match
0 output at compare match
1 output at compare match
Toggle output at compare match
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Initial output is
0 output
TGR1B
is input
capture
register
Output disabled
Initial output is
1 output
Capture input
source is
TIOCB
1
pin
Capture input
source is TGR0C
compare match/
input capture
Input capture at generation of
TGR0C compare match/input
capture
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1210 of 1268
REJ09B0220-0600
TIER1—Timer Interrupt Enable Register 1 H'FFE4 TPU1
7
TTGE
0
R/W
6
—
1
—
5
TCIEU
0
R/W
4
TCIEV
0
R/W
3
—
0
—
0
TGIEA
0
R/W
2
—
0
—
1
TGIEB
0
R/W
0
1
A/D conversion start request generation disabled
A/D conversion start request generation enabled
A/D Conversion Start Request Enable
0
1
Interrupt request (TCIU) by TCFU disabled
Interrupt request (TCIU) by TCFU enabled
Underflow Interrupt Enable
TGR Interrupt Enable B
0
1
Interrupt request (TGIA)
by TGFA bit disabled
TGR Interrupt Enable A
0
1
Interrupt request (TGIB)
by TGFB bit disabled
0
1
Interrupt request (TCIV) by TCFV disabled
Interrupt request (TCIV) by TCFV enabled
Overflow Interrupt Enable
Bit
Initial value
Read/Write
:
:
:
Interrupt request (TGIA)
by TGFA bit enabled
Interrupt request (TGIB)
by TGFB bit enabled
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1211 of 1268
REJ09B0220-0600
TSR1—Timer Status Register 1 H'FFE5 TPU1
7
TCFD
1
R
6
—
1
—
5
TCFU
0
R/(W)*
4
TCFV
0
R/(W)*
3
—
0
—
0
TGFA
0
R/(W)*
2
—
0
—
1
TGFB
0
R/(W)*
0
1
TCNT counts down
TCNT counts up
Count Direction Flag
0
Underflow Flag
1
0
Overflow Flag
1
0
Input Capture/Output Compare Flag B
1
0 [Clearing conditions]
• When DTC is activated by TGIA interrupt while
DISEL bit of MRB in DTC is 0
• When DMAC
*1
is activated by TGIA interrupt
while DTA bit of DMABCR in DMAC
*1
is 1
• When 0 is written to TGFA after reading
TGFA = 1
Input Capture/Output Compare Flag A
Note: 1. The DMAC is not supported in the H8S/2321.
1
Note: * Can only be written with 0 for flag clearing.
Bit
Initial value
Read/Write
:
:
:
[Setting conditions]
• When TCNT = TGRA while TGRA is functioning
as output compare register
• When TCNT value is transferred to TGRA by
input capture signal while TGRA is functioning
as input capture register
[Clearing conditions]
• When DTC is activated by TGIB interrupt while DISEL
bit of MRB in DTC is 0
• When 0 is written to TGFB after reading TGFB = 1
[Setting conditions]
• When TCNT = TGRB while TGRB is functioning as
output compare register
• When TCNT value is transferred to TGRB by input
capture signal while TGRB is functioning as input
capture register
[Clearing condition]
When 0 is written to TCFV after reading TCFV = 1
[Setting condition]
When the TCNT value overflows (changes from H'FFFF to H'0000 )
[Clearing condition]
When 0 is written to TCFU after reading TCFU = 1
[Setting condition]
When the TCNT value underflows (changes from H'0000 to H'FFFF)
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1212 of 1268
REJ09B0220-0600
TCNT1—Timer Counter 1 H'FFE6 TPU1
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
8
0
R/W
10
0
R/W
9
0
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
0
0
R/W
2
0
R/W
1
0
R/W
Note: *
Up/down-counter*
Bit
Initial value
Read/Write
:
:
:
This timer counter can be used as an up/down-counter only in phase counting
mode or when performing overflow/underflow counting on another channel. In
other cases it functions as an up-counter.
TGR1A—Timer General Register 1A H'FFE8 TPU1
TGR1B—Timer General Register 1B H'FFEA TPU1
15
1
R/W
14
1
R/W
13
1
R/W
12
1
R/W
11
1
R/W
8
1
R/W
10
1
R/W
9
1
R/W
7
1
R/W
6
1
R/W
5
1
R/W
4
1
R/W
3
1
R/W
0
1
R/W
2
1
R/W
1
1
R/W
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1213 of 1268
REJ09B0220-0600
TCR2—Timer Control Register 2 H'FFF0 TPU2
TCNT clearing disabled
TCNT cleared by TGRA compare match/input capture
TCNT cleared by TGRB compare match/input capture
Counter Clear
0
1
0
1
0
1
0
1
Clock Edge
0
1
—
Count at rising edge
Count at falling edge
Count at both edges
Internal clock: counts on φ/1
Internal clock: counts on φ/4
Internal clock: counts on φ/16
Internal clock: counts on φ/64
External clock: counts on TCLKA pin input
External clock: counts on TCLKB pin input
External clock: counts on TCLKC pin input
Internal clock: counts on φ/1024
Time Prescaler
0
1
0
1
0
1
0
1
0
1
0
1
0
1
7
—
0
—
6
CCLR1
0
R/W
5
CCLR0
0
R/W
4
CKEG1
0
R/W
3
CKEG0
0
R/W
0
TPSC0
0
R/W
2
TPSC2
0
R/W
1
TPSC1
0
R/W
Note: This setting is ignored when channel 2 is in phase
counting mode.
Note: *Synchronous operation setting is performed by setting
the SYNC bit in TSYR to 1.
Bit
Initial value
Read/Write
:
:
:
Note: This setting is ignored when channel
2 is in phase counting mode.
TCNT cleared by counter clearing for another channel
performing synchronous clearing/synchronous operation*
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1214 of 1268
REJ09B0220-0600
TMDR2—Timer Mode Register 2 H'FFF1 TPU2
0
1
Normal operation
Reserved
PWM mode 1
PWM mode 2
Phase counting mode 1
Phase counting mode 2
Phase counting mode 3
Phase counting mode 4
—
Mode
0
1
*
0
1
0
1
*
0
1
0
1
0
1
0
1
*
Note: MD3 is a reserved bit. In a write, it
should always be written with 0.
* : Don’t care
7
—
1
—
6
—
1
—
5
—
0
—
4
—
0
—
3
MD3
0
R/W
0
MD0
0
R/W
2
MD2
0
R/W
1
MD1
0
R/W
Bit
Initial value
Read/Write
:
:
:
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1215 of 1268
REJ09B0220-0600
TIOR2—Timer I/O Control Register 2 H'FFF2 TPU2
7
IOB3
0
R/W
6
IOB2
0
R/W
5
IOB1
0
R/W
4
IOB0
0
R/W
3
IOA3
0
R/W
0
IOA0
0
R/W
2
IOA2
0
R/W
1
IOA1
0
R/W
0
1
TGR2B I/O Control
0
1
*
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
*
* : Don’t care
0
1
TGR2A
is output
compare
register
TGR2A I/O Control
0
1
*
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
*
0 output at compare match
1 output at compare match
Toggle output at compare match
0 output at compare match
1 output at compare match
Toggle output at compare match
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
* : Don’t care
Bit
Initial value
Read/Write
:
:
:
Output disabled
Initial output is
0 output
Output disabled
Initial output is
1 output
TGR2A
is input
capture
register
Capture input
source is
TIOCA
2
pin
TGR2B
is output
compare
register 0 output at compare match
1 output at compare match
Toggle output at compare match
0 output at compare match
1 output at compare match
Toggle output at compare match
Input capture at rising edge
Input capture at falling edge
Input capture at both edges
Output disabled
Initial output is
0 output
Output disabled
Initial output is
1 output
TGR2B
is input
capture
register
Capture input
source is
TIOCB
2
pin
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1216 of 1268
REJ09B0220-0600
TIER2—Timer Interrupt Enable Register 2 H'FFF4 TPU2
7
TTGE
0
R/W
6
—
1
—
5
TCIEU
0
R/W
4
TCIEV
0
R/W
3
—
0
—
0
TGIEA
0
R/W
2
—
0
—
1
TGIEB
0
R/W
0
1
A/D conversion start request generation disabled
A/D conversion start request generation enabled
A/D Conversion Start Request Enable
0
1
Interrupt request (TCIU) by TCFU disabled
Interrupt request (TCIU) by TCFU enabled
Underflow Interrupt Enable
TGR Interrupt Enable B
0
1
Interrupt request (TGIA)
by TGFA bit disabled
TGR Interrupt Enable A
0
1
Interrupt request (TGIB)
by TGFB bit disabled
0
1
Interrupt request (TCIV) by TCFV disabled
Interrupt request (TCIV) by TCFV enabled
Overflow Interrupt Enable
Bit
Initial value
Read/Write
:
:
:
Interrupt request (TGIA)
by TGFA bit enabled
Interrupt request (TGIB)
by TGFB bit enabled
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1217 of 1268
REJ09B0220-0600
TSR2—Timer Status Register 2 H'FFF5 TPU2
7
TCFD
1
R
6
—
1
—
5
TCFU
0
R/(W)*
4
TCFV
0
R/(W)*
3
—
0
—
0
TGFA
0
R/(W)*
2
—
0
—
1
TGFB
0
R/(W)*
0
1
TCNT counts down
TCNT counts up
Count Direction Flag
0
Underflow Flag
1
0
Overflow Flag
1
0
Input Capture/Output Compare Flag B
1
0 [Clearing conditions]
• When DTC is activated by TGIA interrupt
while DISEL bit of MRB in DTC is 0
• When DMAC*1 is activated by TGIA interrupt
while DTA bit of DMABCR in DMAC*1 is 1
• When 0 is written to TGFA after reading
TGFA = 1
Input Capture/Output Compare Flag A
Note: 1. The DMAC is not supported in the H8S/2321.
1
Note: * Can only be written with 0 for flag clearing.
Bit
Initial value
Read/Write
:
:
:
[Setting conditions]
• When TCNT = TGRA while TGRA is
functioning as output compare register
• When TCNT value is transferred to TGRA by
input capture signal while TGRA is functioning
as input capture register
[Clearing conditions]
• When DTC is activated by TGIB interrupt while DISEL
bit of MRB in DTC is 0
• When 0 is written to TGFB after reading
TGFB = 1
[Setting conditions]
• When TCNT = TGRB while TGRB is functioning as
output compare register
• When TCNT value is transferred to TGRB by input
capture signal while TGRB is functioning as input
capture register
[Clearing condition]
When 0 is written to TCFV after reading TCFV = 1
[Setting condition]
When the TCNT value overflows (changes from H'FFFF to H'0000 )
[Clearing condition]
When 0 is written to TCFU after reading TCFU = 1
[Setting condition]
When the TCNT value underflows (changes from H'0000 to H'FFFF)
Appendix B Internal I/O Registers
Rev.6.00 Sep. 27, 2007 Page 1218 of 1268
REJ09B0220-0600
TCNT2—Timer Counter 2 H'FFF6 TPU2
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
8
0
R/W
10
0
R/W
9
0
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
0
0
R/W
2
0
R/W
1
0
R/W
Note: *This timer counter can be used as an up/down-counter only in phase counting
mode or when performing overflow/underflow counting on another channel. In
other cases it functions as an up-counter.
Up/down-counter*
Bit
Initial value
Read/Write
:
:
:
TGR2A—Timer General Register 2A H'FFF8 TPU2
TGR2B—Timer General Register 2B H'FFFA TPU2
15
1
R/W
14
1
R/W
13
1
R/W
12
1
R/W
11
1
R/W
8
1
R/W
10
1
R/W
9
1
R/W
7
1
R/W
6
1
R/W
5
1
R/W
4
1
R/W
3
1
R/W
0
1
R/W
2
1
R/W
1
1
R/W
Bit
Initial value
Read/Write
:
:
:
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1219 of 1268
REJ09B0220-0600
Appendix C I/O Port Block Diagram s
C.1 Port 1
R
P1nDDR
C
QD
Reset
WDDR1
Reset
WDR1
R
P1nDR
C
QD
P1
n
RDR1
RPOR1
Internal data bus
PPG module
DMA controller*
TPU module
Pulse output enable
DMA transfer
acknowledge enable
Pulse output
DMA transfer
acknowledge
Output compare output/
PWM output enable
Output compare output/
PWM output
Input capture input
Legend:
WDDR1: Write to P1DDR
WDR1: Write to P1DR
RDR1: Read P1DR
RPOR1: Read port 1
Notes: n = 0 or 1
* The DMAC is not supported in the H8S/2321.
Figure C.1 (a) Port 1 Block Diagram (Pins P10 and P11)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1220 of 1268
REJ09B0220-0600
R
P1nDDR
C
QD
Reset
WDDR1
Reset
WDR1
R
P1nDR
C
QD
P1
n
RDR1
RPOR1
Internal data bus
PPG module
TPU module
Pulse output enable
Output compare output
/
PWM output enable
Output compare output
/
PWM output
Pulse output
External clock input
Input capture input
Legend:
WDDR1: Write to P1DDR
WDR1: Write to P1DR
RDR1: Read P1DR
RPOR1: Read port 1
Note: n = 2, 3, 5, 7
Figure C.1 (b) Port 1 Block Diagram (Pins P12, P13, P15, and P17)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1221 of 1268
REJ09B0220-0600
R
P1nDDR
C
QD
Reset
WDDR1
Reset
WDR1
R
P1nDR
C
QD
P1
n
RDR1
RPOR1
Internal data bus
PPG module
TPU module
Pulse output enable
Output compare output
/
PWM output enable
Output compare output
/
PWM output
Pulse output
Input capture input
Legend:
WDDR1: Write to P1DDR
WDR1: Write to P1DR
RDR1: Read P1DR
RPOR1: Read port 1
Note: n = 4 or 6
Figure C.1 (c) Port 1 Block Diagram (Pins P14 and P16)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1222 of 1268
REJ09B0220-0600
C.2 Port 2
R
P2nDDR
C
QD
Reset
WDDR2
Reset
WDR2
R
P2nDR
C
QD
P2
n
RDR2
RPOR2
PPG module
TPU module
Pulse output enable
Output compare output
/
PWM output enable
Output compare output
/
PWM output
Pulse output
Input capture input
Legend:
WDDR2: Write to P2DDR
WDR2: Write to P2DR
RDR2: Read P2DR
RPOR2: Read port 2
Note: n = 0 or 1
Internal data bus
Figure C.2 (a) Port 2 Block Diagram (Pins P20 and P21)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1223 of 1268
REJ09B0220-0600
R
P2nDDR
C
QD
Reset
WDDR2
Reset
WDR2
R
P2nDR
C
QD
P2
n
RDR2
RPOR2
PPG module
TPU module
Pulse output enable
Output compare output
/
PWM output enable
Counter external reset
input
Output compare output
/
PWM output
Pulse output
8-bit timer module
Input capture input
Legend:
WDDR2: Write to P2DDR
WDR2: Write to P2DR
RDR2: Read P2DR
RPOR2: Read port 2
Note: n = 2 or 4
Internal data bus
Figure C.2 (b) Port 2 Block Diagram (Pins P22 and P24)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1224 of 1268
REJ09B0220-0600
R
P2nDDR
C
QD
Reset
WDDR2
Reset
WDR2
R
P2nDR
C
QD
P2
n
RDR2
RPOR2
PPG module
TPU module
Pulse output enable
Output compare output
/
PWM output enable
Counter external clock
inpu
Output compare output
/
PWM output
Pulse output
8-bit timer module
Input capture input
Legend:
WDDR2: Write to P2DDR
WDR2: Write to P2DR
RDR2: Read P2DR
RPOR2: Read port 2
Note: n = 3 or 5
Internal data bus
Figure C.2 (c) Port 2 Block Diagram (Pins P23 and P25)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1225 of 1268
REJ09B0220-0600
R
P2nDDR
C
QD
Reset
WDDR2
Reset
WDR2
R
P2nDR
C
QD
P2
n
RDR2
RPOR2
PPG module
8-bit timer module
TPU module
Pulse output enable
Compare match output
enable
Pulse output
Compare match output
Output compare output
/
PWM output enable
Output compare output
/
PWM output
Input capture input
Legend:
WDDR2: Write to P2DDR
WDR2: Write to P2DR
RDR2: Read P2DR
RPOR2: Read port 2
Note: n = 6 or 7
Internal data bus
Figure C.2 (d) Port 2 Block Diagram (Pins P26 and P27)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1226 of 1268
REJ09B0220-0600
C.3 Port 3
R
P3nDDR
C
QD
Reset
WDDR3
Reset
WDR3
R
C
QD
P3
n
RDR3
RODR3
RPOR3
Internal data bus
SCI module
Serial transmit enable
Serial transmit data
P3nDR
Reset
WODR3
R
C
QD
P3nODR
*1
*2
Legend:
WDDR3: Write to P3DDR
WDR3: Write to P3DR
WODR3: Write to P3ODR
RDR3: Read P3DR
RPOR3: Read port 3
RODR3: Read P3ODR
Notes: n = 0 or 1
1. Output enable signal
2. Open drain control signal
Figure C.3 (a) Port 3 Block Diagram (Pins P30 and P31)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1227 of 1268
REJ09B0220-0600
R
P3nDDR
C
QD
Reset
WDDR3
Reset
WDR3
R
C
QD
P3
n
RDR3
RODR3
RPOR3
Internal data bus
SCI module
Serial receive data
enable
Serial receive data
P3nDR
Reset
WODR3
R
C
QD
P3nODR
*1
*2
Legend:
WDDR3: Write to P3DDR
WDR3: Write to P3DR
WODR3: Write to P3ODR
RDR3: Read P3DR
RPOR3: Read port 3
RODR3: Read P3ODR
Notes: n = 2 or 3
1. Output enable signal
2. Open drain control signal
Figure C.3 (b) Port 3 Block Diagram (Pins P32 and P33)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1228 of 1268
REJ09B0220-0600
R
P3nDDR
C
QD
Reset
WDDR3
Reset
WDR3
R
C
QD
P3
n
RDR3
RODR3
RPOR3
Internal data bus
SCI module
Serial clock output
enable
Serial clock input
enable
P3nDR
Reset
WODR3
R
C
QD
P3nODR
*1
*2
Serial clock
input
Legend:
WDDR3: Write to P3DDR
WDR3: Write to P3DR
WODR3: Write to P3ODR
RDR3: Read P3DR
RPOR3: Read port 3
RODR3: Read P3ODR
Notes: n = 4 or 5
1. Output enable signal
2. Open drain control signal
Serial clock output
Figure C.3 (c) Port 3 Block Diagram (Pins P34 and P35)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1229 of 1268
REJ09B0220-0600
C.4 Port 4
RPOR4
Internal data bus
A/D converter module
Analog input
Legend:
RPOR4: Read port 4
Note: n = 0 to 5
P4
n
Figure C.4 (a) Port 4 Block Diagram (Pins P40 to P45)
Legend:
RPOR4: Read port 4
Note: n = 6 or 7
P4
n
RPOR4
Internal data bus
A/D converter module
Analog input
D/A converter module
Output enable
Analog output
Figure C.4 (b) Port 4 Block Diagram (Pins P46 and P47)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1230 of 1268
REJ09B0220-0600
C.5 Port 5
R
P50DDR
C
QD
Reset
WDDR0
Reset
WDR5
R
C
QD
P5
0
RDR5
RPOR5
Internal data bus
SCI module
IRQPAS
IRQ4 interrupt input
Serial transmit output
enable
P50DR
Legend:
WDDR5: Write to P5DDR
WDR5: Write to P5DR
RDR5: Read P5DR
RPOR5: Read port 5
IRQPAS: IRQ port switching select
Serial transmit data
Figure C.5 (a) Port 5 Block Diagram (Pin P50)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1231 of 1268
REJ09B0220-0600
R
P51DDR
C
QD
Reset
WDDR5
Reset
WDR5
R
C
QD
P5
1
RDR5
RPOR5
Internal data bus
SCI module
Serial receive data
enable
P51DR
Serial receive data
Legend:
WDDR5: Write to P5DDR
WDR5: Write to P5DR
RDR5: Read P5DR
RPOR5: Read port 5
IRQPAS: IRQ port switching select
IRQPAS
IRQ5 interrupt input
Figure C.5 (b) Port 5 Block Diagram (Pin P51)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1232 of 1268
REJ09B0220-0600
R
P52DDR
C
QD
Reset
WDDR5
Reset
WDR5
R
C
QD
P5
2
Internal data bus
SCI module
Serial clock output
enable
Serial clock output
Serial clock input
enable
P52DR
RDR5
RPOR5
Serial clock input
Legend:
WDDR5: Write to P5DDR
WDR5: Write to P5DR
RDR5: Read P5DR
RPOR5: Read port 5
IRQPAS: IRQ port switching select
IRQPAS
IRQ6 interrupt input
Figure C.5 (c) Port 5 Block Diagram (Pin P52)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1233 of 1268
REJ09B0220-0600
R
P53DDR
C
QD
Reset
WDDR5
Reset
Modes
4 to 6
WDR5
R
C
QD
P5
3
RDR5
RPOR5
Internal data bus
A/D converter
Bus controller
A/D converter external
trigger input
Bus request output
enable
IRQPAS
IRQ7 interrupt input
WAITPS
Wait input
Wait input pin enable
Modes 4 to 6
BREQOPS
Bus request output
P53DR
Legend:
WDDR5: Write to P5DDR
WDR5: Write to P5DR
RDR5: Read P5DR
RPOR5: Read port 5
IRQPAS: IRQ port switching select
WAITPS: Wait pin select
BREQOPS: BREQO pin select
Bus controller
Figure C.5 (d) Port 5 Block Diagram (Pin P53)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1234 of 1268
REJ09B0220-0600
C.6 Port 6
R
P60DDR
C
QD
Reset
WDDR6
Mode 7
Modes
4 to 6
Reset
WDR6
R
P60DR
C
QD
P6
0
RDR6
RPOR6
DMA controller*
Bus controller
Chip select
DMA request input
Legend:
WDDR6: Write to P6DDR
WDR6: Write to P6DR
RDR6: Read P6DR
RPOR6: Read port 6
CS25E: CS25 enable
Note: * The DMAC is not supported in the H8S/2321.
Internal data bus
CS25E
Figure C.6 (a) Port 6 Block Diagram (Pin P60)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1235 of 1268
REJ09B0220-0600
R
P61DDR
C
QD
Reset
WDDR6
Reset
WDR6
R
P61DR
C
QD
P6
1
RDR6
RPOR6
Bus controller
Chip select
DMA controller*
DMA transfer end enable
Legend:
WDDR6: Write to P6DDR
WDR6: Write to P6DR
RDR6: Read P6DR
RPOR6: Read port 6
CS25E: CS25 enable
Note: * The DMAC is not supported in the H8S/2321.
Mode 7
Modes
4 to 6
Internal data bus
CS25E
DMA transfer end
Figure C.6 (b) Port 6 Block Diagram (Pin P61)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1236 of 1268
REJ09B0220-0600
R
P62DDR
C
QD
Reset
WDDR6
Reset
WDR6
R
P62DR
C
QD
P6
2
RDR6
RPOR6
Internal data bus
DMA controller*
DMA request input
Legend:
WDDR6: Write to P6DDR
WDR6: Write to P6DR
RDR6: Read P6DR
RPOR6: Read port 6
Note: * The DMAC is not supported in the H8S/2321.
Figure C.6 (c) Port 6 Block Diagram (Pin P62)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1237 of 1268
REJ09B0220-0600
R
P63DDR
C
QD
Reset
WDDR6
Reset
WDR6
R
C
QD
P6
3
RDR6
RPOR6
Internal data bus
DMA controller*
DMA transfer end enable
DMA transfer end
P63DR
Legend:
WDDR6: Write to P6DDR
WDR6: Write to P6DR
RDR6: Read P6DR
RPOR6: Read port 6
Note: * The DMAC is not supported in the H8S/2321.
Figure C.6 (d) Port 6 Block Diagram (Pin P63)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1238 of 1268
REJ09B0220-0600
R
P6nDDR
C
QD
Reset
WDDR6
Reset
WDR6
R
P6nDR
C
QD
P6
n
RDR6
RPOR6
Internal data bus
IRQm interrupt input
Legend:
WDDR6: Write to P6DDR
WDR6: Write to P6DR
RDR6: Read P6DR
RPOR6: Read port 6
Note: n = 4 or 5
m = 0 or 1
Figure C.6 (e) Port 6 Block Diagram (Pins P64 and P65)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1239 of 1268
REJ09B0220-0600
R
P6nDDR
C
QD
Reset
WDDR6
Reset
WDR6
R
P6nDR
C
QD
P6
n
RDR6
RPOR6
Bus controller
Chip select
IRQm interrupt input
Legend:
WDDR6: Write to P6DDR
WDR6: Write to P6DR
RDR6: Read P6DR
RPOR6: Read port 6
CS167E: CS167 enable
Note: n = 6 or 7
m = 2 or 3
Mode 7
Modes
4 to 6
Internal data bus
CS167E
Figure C.6 (f) Port 6 Block Diagram (Pins P66 and P67)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1240 of 1268
REJ09B0220-0600
C.7 Port A
R
PAnPCR
C
QD
Reset
WPCRA
Reset
Reset
WDRA
R
C
QD
PA
n
RDRA
RODRA
RPORA
Internal address bus
PAnDR
Reset
WDDRA
R
C
QD
PAnDDR
WODRA
RPCRA
R
C
QD
PAnODR
*1
*2
Mode 7
Modes 4 to 6
Modes 4 and 5
Modes 6 and 7
Legend:
WDDRA: Write to PADDR
WDRA: Write to PADR
WODRA: Write to PAODR
WPCRA: Write to PAPCR
RDRA: Read PADR
RPORA: Read port A
RODRA: Read PAODR
RPCRA: Read PAPCR
Internal data bus
Notes: n = 0 to 3
1. Output enable signal
2. Open drain control signal
Figure C.7 (a) Port A Block Diagram (Pins PA0 to PA3)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1241 of 1268
REJ09B0220-0600
R
PA4PCR
C
QD
Reset
WPCRA
Reset
WDRA
R
C
QD
PA
4
RDRA
RODRA
RPORA
Internal address bus
PA4DR
Reset
WDDRA
R
C
QD
PA4DDR
Reset
WODRA
RPCRA
R
C
QD
PA4ODR
*1
*2
Mode 7
Modes 4 to 6
Modes 4 and 5
Modes 6 and 7
IRQ4 interrupt
input
IRQPAS
Legend:
WDDRA: Write to PADDR
WDRA: Write to PADR
WODRA: Write to PAODR
WPCRA: Write to PAPCR
RDRA: Read PADR
RPORA: Read port A
RODRA: Read PAODR
RPCRA: Read PAPCR
A20E: Address 20 enable
IRQPAS: IRQ port switching select
Internal data bus
A20E
Notes: 1. Output enable signal
2. Open drain control signal
Figure C.7 (b) Port A Block Diagram (Pin PA4)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1242 of 1268
REJ09B0220-0600
R
PAnPCR
C
QD
Reset
WPCRA
Reset
WDRA
R
C
QD
PA
n
RDRA
RODRA
RPORA
Internal address bus
PAnDR
WDDRA
C
QD
PAnDDR
Reset
WODRA
RPCRA
R
C
QD
PAnODR
*1
*2
Modes 4 to 6
Mode 7
Mode 7
IRQ
n
interrupt
input
Reset
R
Legend:
WDDRA: Write to PADDR
WDRA: Write to PADR
WODRA: Write to PAODR
WPCRA: Write to PAPCR
RDRA: Read PADR
RPORA: Read port A
RODRA: Read PAODR
RPCRA: Read PAPCR
A
mE: Address output enable
IRQPAS: IRQ port switching select
Internal data bus
IRQPAS
AmE
Modes 4 to 7
Notes: n = 5 to 7
m = 21 to 23
1. Output enable signal
2. Open drain control signal
Figure C.7 (c) Port A Block Diagram (Pins PA5 to PA7)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1243 of 1268
REJ09B0220-0600
C.8 Port B
R
PBnPCR
C
QD
Reset
WPCRB
Reset
WDRB
R
C
QD
PB
n
RDRB
RPORB
Internal address bus
PBnDR
Reset
WDDRB
R
C
QD
PBnDDR
RPCRB
Mode 7
Modes 4 to 6
Legend:
WDDRB: Write to PBDDR
WDRB: Write to PBDR
WPCRB: Write to PBPCR
RDRB: Read PBDR
RPORB: Read port B
RPCRB: Read PBPCR
Note: n = 0 to 7
Internal data bus
Modes
4 and 5
Modes 6 and 7
Figure C.8 Port B Block Diagram (Pins PB0 to PB7)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1244 of 1268
REJ09B0220-0600
C.9 Port C
R
PCnPCR
C
QD
Reset
WPCRC
Reset
WDRC
R
C
QD
PC
n
RDRC
RPORC
Internal address bus
PCnDR
Reset
WDDRC
R
C
QD
PCnDDR
RPCRC
Mode 7
Modes 4 to 6
Legend:
WDDRC: Write to PCDDR
WDRC: Write to PCDR
WPCRC: Write to PCPCR
RDRC: Read PCDR
RPORC: Read port C
RPCRC: Read PCPCR
Note: n = 0 to 7
Internal data bus
Modes 4
and 5
Modes 6 and 7
Figure C.9 Port C Block Diagram (Pins PC0 to PC7)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1245 of 1268
REJ09B0220-0600
C.10 Port D
R
PDnPCR
C
QD
Reset
WPCRD
Reset
WDRD
R
C
QD
PD
n
RDRD
RPORD
External address
upper write
External address
lower write
PDnDR
WDDRD
C
QD
PDnDDR
RPCRD
Mode 7
Modes 4 to 6
External
address write
Modes
4 to 6
Mode 7
Reset
R
External address
upper read
External address
lower read
Legend:
WDDRD: Write to PDDDR
WDRD: Write to PDDR
WPCRD: Write to PDPCR
RDRD: Read PDDR
RPORD: Read port D
RPCRD: Read PDPCR
Note: n = 0 to 7
Internal upper data bus
Internal lower data bus
Figure C.10 Port D Block Diagram (Pins PD0 to PD7)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1246 of 1268
REJ09B0220-0600
C.11 Port E
R
PEnPCR
C
QD
Reset
WPCRE
Reset
WDRE
R
C
QD
PE
n
RDRE
RPORE
PEnDR
WDDRE
C
QD
PEnDDR
RPCRE
Modes 4 to 6
Reset
Bus controller
R
External address
lower read
Legend:
WDDRE: Write to PEDDR
WDRE: Write to PEDR
WPCRE: Write to PEPCR
RDRE: Read PEDR
RPORE: Read port E
RPCRE: Read PEPCR
Note: n = 0 to 7
Internal upper data bus
Internal lower data bus
External
address write
Modes 4 to 6
8-bit bus mode
Mode 7
Figure C.11 Port E Block Diagram (Pins PE0 to PE7)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1247 of 1268
REJ09B0220-0600
C.12 Port F
R
PF0DDR
C
QD
Reset
WDDRF
Reset
WDRF
R
C
QD
PF
0
RDRF
RPORF
Bus request input
PF0DR
Bus controller
BRLE bit
Modes 4 to 6
Legend:
WDDRF: Write to PFDDR
WDRF: Write to PFDR
RDRF: Read PFDR
RPORF: Read port F
Internal data bus
Figure C.12 (a) Port F Block Diagram (Pin PF0)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1248 of 1268
REJ09B0220-0600
R
PF1DDR
C
QD
Reset
WDDRF
Modes 4 to 6
Reset
WDRF
R
PF1DR
C
QD
PF
1
RDRF
RPORF
Bus controller
BRLE bit
Legend:
WDDRF: Write to PFDDR
WDRF: Write to PFDR
RDRF: Read PFDR
RPORF: Read port F
Internal data bus
Bus request
acknowledge output
Figure C.12 (b) Port F Block Diagram (Pin PF1)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1249 of 1268
REJ09B0220-0600
R
PF2DDR
C
QD
Reset
WDDRF
Reset
WDRF
R
PF2DR
C
QD
PF
2
RDRF
RPORF
Bus request output
enable
Bus request output
Wait input
Wait enable
LCAS output enable*
LCAS output*
BREQOPS
WAITPS
Bus controller
Modes 4 to 6
Modes 4 to 6
Modes 4 and 6
Legend:
WDDRF: Write to PFDDR
WDRF: Write to PFDR
RDRF: Read PFDR
RPORF: Read port F
WAITPS: WAIT pin select
BREQOPS: BREQO pin select
Note: * Not supported in the H8S/2321.
Internal data bus
Figure C.12 (c) Port F Block Diagram (Pin PF2)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1250 of 1268
REJ09B0220-0600
R
PF3DDR
C
QD
Reset
WDDRF
Reset
WDRF
R
PF3DR
C
QD
PF
3
RDRF
RPORF
Bus controller
Interrupt controlle
r
LWR output
LWROD
Modes 4 to 6
Mode 7
Modes 4 to 6
Legend:
WDDRF: Write to PFDDR
WDRF: Write to PFDR
RDRF: Read PFDR
RPORF: Read port F
LWROD: LWR output disable
Internal data bus
Figure C.12 (d) Port F Block Diagram (Pin PF3)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1251 of 1268
REJ09B0220-0600
R
PF4DDR
C
QD
Reset
WDDRF
Reset
WDRF
R
PF4DR
C
QD
PF
4
RDRF
RPORF
Bus controlle
r
HWR output
Modes 4 to 6
Modes 4 to 6
Mode 7
Legend:
WDDRF: Write to PFDDR
WDRF: Write to PFDR
RDRF: Read PFDR
RPORF: Read port F
Internal data bus
Figure C.12 (e) Port F Block Diagram (Pin PF4)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1252 of 1268
REJ09B0220-0600
R
PF5DDR
C
QD
Reset
WDDRF
Reset
WDRF
R
PF5DR
C
QD
PF5
RDRF
RPORF
Bus controlle
r
RD output
Modes 4 to 6
Modes 4 to 6
Mode 7
Legend:
WDDRF: Write to PFDDR
WDRF: Write to PFDR
RDRF: Read PFDR
RPORF: Read port F
Internal data bus
Figure C.12 (f) Port F Block Diagram (Pin PF5)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1253 of 1268
REJ09B0220-0600
R
PF6DDR
C
QD
Reset
WDDRF
Modes 4 to 6
Modes 4 to 6
Mode 7 Reset
WDRF
R
PF6DR
C
QD
PF
6
RDRF
RPORF
Bus controller
AS output
Legend:
WDDRF: Write to PFDDR
WDRF: Write to PFDR
RDRF: Read PFDR
RPORF: Read port F
ASOD: AS output disable
Internal data bus
Interrupt controlle
r
ASOD
Figure C.12 (g) Port F Block Diagram (Pin PF6)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1254 of 1268
REJ09B0220-0600
D
WDDRF
Reset
Reset
WDRF
R
PF7DR
C
QD
PF
7
RDRF
RPORF
φ
RS
C
Q
PF7DDR
Legend:
WDDRF: Write to PFDDR
WDRF: Write to PFDR
RDRF: Read PFDR
RPORF: Read port F
Internal data bus
Modes 4 to 6 Mode 7
Figure C.12 (h) Port F Block Diagram (Pin PF7)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1255 of 1268
REJ09B0220-0600
C.13 Port G
R
PG0DDR
C
QD
Reset
WDDRG
Modes 4 to 6
Reset
WDRG
R
PG0DR
C
QD
PG
0
RDRG
RPORG
Bus controller
CAS enable*
Legend:
WDDRG: Write to PGDDR
WDRG: Write to PGDR
RDRG: Read PGDR
RPORG: Read port G
Note: * Not supported in the H8S/2321.
Internal data bus
CAS output*
Figure C.13 (a) Port G Block Diagram (Pin PG0)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1256 of 1268
REJ09B0220-0600
R
PGnDDR
C
QD
Reset
WDDRG
Reset
WDRG
R
PGnDR
C
QD
PG
n
RDRG
RPORG
Bus controller
Chip select
Mode 7
Modes
4 to 6
Legend:
WDDRG: Write to PGDDR
WDRG: Write to PGDR
RDRG: Read PGDR
RPORG: Read port G
CS25E: CS25 enable
Note: n = 1 or 2
Internal data bus
Interrupt controlle
r
CS25E
Figure C.13 (b) Port G Block Diagram (Pins PG1 and PG2)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1257 of 1268
REJ09B0220-0600
R
PG3DDR
C
QD
Reset
WDDRG
Reset
WDRG
R
PG3DR
C
QD
PG
3
RDRG
RPORG
Bus controller
Chip select
Mode 7
Modes
4 to 6
Legend:
WDDRG: Write to PGDDR
WDRG: Write to PGDR
RDRG: Read PGDR
RPORG: Read port G
CS167E: CS167 enable
Internal data bus
Interrupt controlle
r
CS167E
Figure C.13 (c) Port G Block Diagram (Pin PG3)
Appendix C I/O Port Block Diagrams
Rev.6.00 Sep. 27, 2007 Page 1258 of 1268
REJ09B0220-0600
QD
WDDRG
Reset
Reset
WDRG
R
PG4DR
C
QD
PG
4
RDRG
RPORG
Bus controlle
r
Chip select
Mode 7
Modes 4 to 6
Modes 4 and 5 Modes 6 and 7
D
SR
C
PG4DDR
Legend:
WDDRG: Write to PGDDR
WDRG: Write to PGDR
RDRG: Read PGDR
RPORG: Read port G
Internal data bus
Figure C.13 (d) Port G Block Diagram (Pin PG4)
Appendix D Pin States
Rev.6.00 Sep. 27, 2007 Page 1259 of 1268
REJ09B0220-0600
Appendix D Pin States
D.1 Port States in Each Mode
Table D.1 I/O Port States in Each Processing State
Port Name
Pin Name
MCU
Operating
Mode
Reset
Hardware
Standby
Mode
Software
Standby Mode
Bus-Released
State
Program
Execution State
Sleep Mode
Port 1 4 to 7 T T kept kept I/O port
Port 2 4 to 7 T T kept kept I/O port
Port 3 4 to 7 T T kept kept I/O port
P47/DA1 4 to 7 T T [DAOE1 = 1]
kept
[DAOE1 = 0]
T
kept I/O port
P46/DA0 4 to 7 T T [DAOE0 = 1]
kept
[DAOE0 = 0]
T
kept I/O port
P45 to P40 4 to 7 T T T T Input port
P53/WAIT/
BREQO 4 to 6 T T [BREQOE ·
BREQOPS +
WAITE · WAITPS
= 0]
kept
[BREQOE ·
BREQOPS = 1]
kept
[BREQOE ·
BREQOPS = 0]
and
[WAITE · WAITPS ·
DDR = 1]
T
[BREQOE ·
BREQOPS +
WAITE · WA ITP S
= 0]
kept
[BREQOE ·
BREQOPS = 1]
BREQO
[BREQOE ·
BREQOPS = 0]
and
[WAITE · WAI TPS ·
DDR = 1]
T
[BREQOE ·
BREQOPS +
WAITE · WA ITP S
= 0]
I/O port
[BREQOE ·
BREQOPS = 1]
BREQO
[BREQOE ·
BREQOPS = 0]
and
[WAITE · WAI TPS ·
DDR = 1]
WAIT
7 T T kept kept I/O port
P52 to P50 4 to 7 T T kept kept I/O port
Appendix D Pin States
Rev.6.00 Sep. 27, 2007 Page 1260 of 1268
REJ09B0220-0600
Port Name
Pin Name
MCU
Operating
Mode
Reset
Hardware
Standby
Mode
Software
Standby Mode
Bus-Released
State
Program
Execution State
Sleep Mode
P67/CS7
P66/CS6
4 to 6 T T [CS167E = 0],
[CS167E · DDR = 1]
kept
[CS167E · DDR ·
OPE = 1]
T
[CS167E · DDR ·
OPE = 1]
H
[CS167E = 0]
kept
[CS167E · DDR = 1]
kept
[CS167E · DDR = 1]
T
[CS167E = 0]
I/O port
[CS167E ·
DDR = 1]
Input port
[CS167E ·
DDR = 1]
CS7 to CS6
7 T T kept kept I/O port
P65 to P62 4 to 7 T T kept kept I/O port
P61/CS5
P60/CS4
4 to 6 T T [CS25E · DDR ·
OPE = 1]
T
[CS25E · DDR ·
OPE = 1]
H
[CS25E = 0],
[CS25E · DDR = 1]
kept
[CS25E = 0]
kept
[CS25E · DDR = 1]
kept
[CS25E · DDR = 1]
T
[CS25E = 0]
I/O port
[CS25E · DDR = 1]
Input port
[CS25E · DDR = 1]
CS5 to CS4
7 T T kept kept I/O port
PA7/A23
PA6/A22
PA5/A21
4 to 6 T T [AnE = 0]
kept
[AnE · DDR = 1]
T
[AnE · DDR · OPE
= 1]
T
[AnE · DDR · OPE
= 1]
kept
[AnE = 0]
kept
[AnE · DDR = 1]
T
[AnE · DDR = 1]
T
[AnE = 0]
I/O port
[AnE · DDR = 1]
Input port
[AnE · DDR = 1]
Address output
7 T T kept kept I/O port
Appendix D Pin States
Rev.6.00 Sep. 27, 2007 Page 1261 of 1268
REJ09B0220-0600
Port Name
Pin Name
MCU
Operating
Mode
Reset
Hardware
Standby
Mode
Software
Standby Mode
Bus-Released
State
Program
Execution State
Sleep Mode
PA4/A20 4, 5 L T [A20E · DDR = 1]
kept
[A20E · OPE = 1]
T
[A20E · OPE = 1]
kept
[A20E · DDR = 1]
kept
[A20E+A20E ·
DDR = 1]
T
[A20E · DDR = 1]
Output port
[A20E+A20E ·
DDR = 1]
Address output
6 T T [A20E = 0],
[A20E · DDR = 1]
kept
[A20E · DDR ·
OPE = 1]
T
[A20E · DDR ·
OPE = 1]
kept
[A20E = 0]
kept
[A20E · DDR = 1]
kept
[A20E · DDR = 1]
T
[A20E = 0]
I/O port
[A20E · DDR = 1]
Output port
[A20E · DDR = 1]
Address output
7 T T kept kept I/O port
PA3/A19
PA2/A18
PA1/A17
PA0/A16
4, 5 L T [OPE = 0]
T
[OPE = 1]
kept
T Address output
6 T T [DDR · OPE = 0]
T
[DDR · OPE = 1]
kept
T [DDR = 0]
Input port
[DDR = 1]
Address output
7 T T kept kept I/O port
Port B 4, 5 L T [OPE = 0]
T
[OPE = 1]
kept
T Address output
6 T T [DDR · OPE = 0]
T
[DDR · OPE = 1]
kept
T [DDR = 0]
Input port
[DDR = 1]
Address output
7 T T kept kept I/O port
Appendix D Pin States
Rev.6.00 Sep. 27, 2007 Page 1262 of 1268
REJ09B0220-0600
Port Name
Pin Name
MCU
Operating
Mode
Reset
Hardware
Standby
Mode
Software
Standby Mode
Bus-Released
State
Program
Execution State
Sleep Mode
Port C 4, 5 L T [OPE = 0]
T
[OPE = 1]
kept
T Address output
6 T T [DDR · OPE = 0]
T
[DDR · OPE = 1]
kept
T [DDR = 0]
Input port
[DDR = 1]
Address output
7 T T kept kept I/O port
Port D 4 to 6 T T T T Data bus
7 T T kept kept I/O port
Port E 4 to
6 8-bit
bus T T kept kept I/O port
16-bit
bus T T T T Data bus
7 T kept kept I/O port
PF7/φ 4 to 6
Clock
output T [DDR = 0]
Input port
[DDR = 1]
H
[DDR = 0]
Input port
[DDR = 1]
Clock output
[DDR = 0]
Input port
[DDR = 1]
Clock output
7 T T [DDR = 0]
Input port
[DDR = 1]
H
[DDR = 0]
Input port
[DDR = 1]
Clock output
[DDR = 0]
Input port
[DDR = 1]
Clock output
PF6/AS 4 to 6 H T [ASOD = 1]
kept
[ASOD · OPE = 1]
T
[ASOD · OPE = 1]
H
[ASOD = 1]
kept
[ASOD = 0]
T
[ASOD = 1]
I/O port
[ASOD = 0]
AS
7 T T kept kept I/O port
PF5/RD
PF4/HWR
4 to 6 H T [OPE = 0]
T
[OPE = 1]
H
T RD, HWR
7 T T kept kept I/O port
Appendix D Pin States
Rev.6.00 Sep. 27, 2007 Page 1263 of 1268
REJ09B0220-0600
Port Name
Pin Name
MCU
Operating
Mode
Reset
Hardware
Standby
Mode
Software
Standby Mode
Bus-Released
State
Program
Execution State
Sleep Mode
PF3/LWR 4 to 6 H T [LWROD = 1]
kept
[LWROD · OPE = 1]
T
[LWROD · OPE = 1]
H
[LWROD = 1]
kept
[LWROD = 0]
T
[LWROD = 1]
I/O port
[LWROD = 0]
LWR
7 T T kept kept I/O port
PF2/LCAS*1/
WAIT/
BREQO
4 to 6 T T [LCASE*2 +
BREQO E ·
BREQOPS +
WAITE · WAITPS
= 0
kept
[BREQOE ·
BREQOPS = 1]
and
[LCASE*2 = 0]
kept
[WAITE · WAITPS
· DDR = 1]
and
[LCASE*2 +
BREQO E ·
BREQOPS = 0]
T
[LCASE*2 = 1,
OPE = 0]
T
[LCASE*2 = 1,
OPE = 1]
H
[LCASE*2 +
BREQO E ·
BREQOPS +
WAITE · WAITPS
= 0
kept
[BREQOE ·
BREQOPS = 1]
and
[LCASE*2 = 0]
BREQO
[WAITE · WAITPS
· DDR = 1]
and
[LCASE*2 +
BREQO E ·
BREQOPS = 0]
T
[LCASE*2 = 1]
T
[LCASE*2 +
BREQO E ·
BREQOPS +
WAITE · WAITPS
= 0
I/O port
[BREQOE ·
BREQOPS = 1]
and
[LCASE*2 = 0]
BREQO
[WAITE · WAITPS
· DDR = 1]
and
[LCASE*2 +
BREQO E ·
BREQOPS = 0]
WAIT
[LCASE*2 = 1]
LCAS*1
7 T T kept kept I/O port
PF1/BACK 4 to 6 T T [BRLE=0]
kept
[BRLE=1]
BACK
L [BRLE = 0]
I/O port
[BRLE = 1]
BACK
7 T T kept kept I/O port
Appendix D Pin States
Rev.6.00 Sep. 27, 2007 Page 1264 of 1268
REJ09B0220-0600
Port Name
Pin Name
MCU
Operating
Mode
Reset
Hardware
Standby
Mode
Software
Standby Mode
Bus-Released
State
Program
Execution State
Sleep Mode
PF0/BREQ 4 to 6 T T [BRLE=0]
kept
[BRLE=1]
T
T [BRLE = 0]
I/O port
[BRLE = 1]
BREQ
7 T T kept kept I/O port
PG4/CS0 4, 5 H T T
6 T
[DDR · OPE = 0]
T
[DDR · OPE = 1]
H
[DDR = 0]
Input port
[DDR = 1]
CS0
7 T T kept kept I/O port
PG3/CS1 4 to 6 T T [CS167E = 0]
kept
[CS167E · DDR = 1]
T
[CS167E · DDR ·
OPE = 1]
T
[CS167E · DDR ·
OPE = 1]
H
[CS167E = 0]
kept
[CS167E = 1]
T
[CS167E = 0]
I/O port
[CS167E ·
DDR = 1]
Input port
[CS167E ·
DDR = 1]
CS1
7 T T kept kept I/O port
PG2/CS2
PG1/CS3
4 to 6 T T [CS25E = 0]
kept
[CS25E · DDR = 1]
T
[CS25E · DDR ·
OPE = 1]
T
[CS25E · DDR ·
OPE = 1]
H
[CS25E = 0]
kept
[CS25E = 1]
T
[CS25E = 0]
I/O port
[CS25E · DDR = 1]
Input port
[CS25E · DDR = 1]
CS2 to CS3
7 T T kept kept I/O port
WDTOVF*5 4 to 7 H H H H H*6
Appendix D Pin States
Rev.6.00 Sep. 27, 2007 Page 1265 of 1268
REJ09B0220-0600
Port Name
Pin Name
MCU
Operating
Mode
Reset
Hardware
Standby
Mode
Software
Standby Mode
Bus-Released
State
Program
Execution State
Sleep Mode
PG0/CAS*3 4 to 6 T T [DRAME*4 = 0]
kept
[DRAME*4 ·
OPE = 1]
T
[DRAME*4 ·
OPE = 1]
CAS*3
T [DRAME*4 = 0]
Input port
[DRAME*4 = 1]
CAS*3
7 T T kept kept I/O port
Legend:
H: High level
L: Low level
T: High impedance
kept: Input port becomes high-impedance, output port retains state
DDR: Data direction register
OPE: Output port enable
WAITE: Wait input enable
WAITPS: WAIT pin select
BRLE: Bus release enable
BREQOE: BREQO pin enable
BREQOPS: BREQO pin select
DRAME: DRAM space setting
LCASE: DRAM space setting, 16-bit access setting
AnE: Address n enable (n = 23 to 21)
A20E: Address 20 enable
ASOD: AS output disable
CS167E: CS167 enable
CS25E: CS25 enable
LWROD: LWR output disable
Notes: 1. LCAS is not supported in the H8S/2321.
2. As the DRAM interface is not supported in the H8S/2321, LCASE is always 0.
3. CAS is not supported in the H8S/2321.
4. As the DRAM interface is not supported in the H8S/2321, DRAME is always 0.
5. The WDTOVF pin function is not usable on the F-ZTAT version.
6. A low level is output if a W DT overflow occurs while WT/IT is set to 1.
Appendix E Product Lineup
Rev.6.00 Sep. 27, 2007 Page 1266 of 1268
REJ09B0220-0600
Appendix E Product Lineup
Table E.1 H8S/2329 Group, H8S/2328 Group Product Lineup
Product Type Model Marking Package (Package Code)
H8S/2329 F-ZTAT™ HD64F2329B HD64F2329BVTE 120-pin TFP (TFP-120)
HD64F2329BVF 128-pin FP (FP-128B)
HD64F2329E* HD64F2329EVTE 120-pin TFP (TFP-120)
HD64F2329EVF 128-pin FP (FP-128B)
H8S/2328 HD6432328 HD6432328TE 120-pin TQFP (TFP-120)
Mask ROM
version HD6432328F 128-pin QFP (FP-128B)
F-ZTAT™ HD64F2328B HD64F2328BVTE 120-pin TFP (TFP-120)
HD64F2328BVF 128-pin FP (FP-128B)
H8S/2327 HD6432327 HD6432327TE 120-pin TQFP (TFP-120)
Mask ROM
version HD6432327F 128-pin QFP (FP-128B)
H8S/2326 F-ZTAT™ HD64F2326 HD64F2326VTE 120-pin TFP (TFP-120)
HD64F2326VF 128-pin FP (FP-128B)
H8S/2324S HD6412324S HD6412324SVTE 120-pin TQFP (TFP-120)
ROMless
version HD6412324SVF 128-pin QFP (FP-128B)
H8S/2323 HD6432323 HD6432323TE 120-pin TQFP (TFP-120)
Mask ROM
version HD6432323F 128-pin QFP (FP-128B)
H8S/2322R HD6412322R HD6412322RVTE 120-pin TQFP (TFP-120)
ROMless
version HD6412322RVF 128-pin QFP (FP-128B)
H8S/2321 HD6412321 HD6412321VTE 120-pin TFP (TFP-120)
ROMless
version HD6412321VF 128-pin FP (FP-128B)
H8S/2320 HD6412320 HD6412320VTE 120-pin TQFP (TFP-120)
ROMless
version HD6412320VF 128-pin QFP (FP-128B)
Note: * The on-chip debug function can be used with the E10A emulator (E10A compatible
version). However, some function modules and pin functions are unavailable when the on-
chip debug function is in use. R efer to figures 1.7 and 1.8.
Appendix F Package Dimensions
Rev.6.00 Sep. 27, 2007 Page 1267 of 1268
REJ09B0220-0600
Appendix F Package Dimensions
The package dimension that is shown in the Renesas Semiconductor Package Data Book has
priority.
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
1.20
1.20 0.10
0.07
0.4 8°0°
1.20
0.15
0.15
0.200.100.00 0.220.170.12
0.220.170.12
15.8 16.0 16.2
L
1
L
Z
E
Z
D
y
x
e
e
c
1
c
D
b
1
b
p
A
H
D
A
2
E
A
1
H
E
0.60.50.4
MaxNomMin
Dimension in Millimeters
Symbol
Reference
14
1.00 16.216.015.8
1.0
14
Index mark
*1
*2
*3p
E
D
E
D
F
xMy
120
130
31
90
91 60
61
Z
Z
b
H
E
H
D
2
1
1
Detail F
c
A A
L
A
L
Terminal cross section
p
1
1
b
c
b
c
θ
θ
P-TQFP120-14x14-0.40 0.5g
MASS[Typ.]
TFP-120/TFP-120VPTQP0120LA-A
RENESAS CodeJEITA Package Code Previous Code
Figure F.1 TFP-120 Package Dimensions
Appendix F Package Dimensions
Rev.6.00 Sep. 27, 2007 Page 1268 of 1268
REJ09B0220-0600
0.75
0.75
15.8 16.0 16.2
0.10
0.70.50.3
0.15
0.20
14
2.70
22.222.021.8
3.15
0.250.100.00
0.270.220.17
0.220.170.12
0.5
8˚0˚
0.10
1.0
20
MaxNomMin
Dimension in Millimeters
Symbol
Reference
L
1
Z
E
Z
D
y
x
c
b
1
b
p
A
H
D
A
2
E
D
A
1
c
1
e
L
H
E
Index mark
*1
*2
*3
128
1
yMx
F
38
39
103
102
64
65
D
E
D
E
p
Z
Z
b
H
D
H
E
Detail F
1
12
c
L
A
A
A
L
1
1
p
Terminal cross section
b
c
c
b
θ
θ
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
e
P-QFP128-14x20-0.50 1.7g
MASS[Typ.]
FP-128B/FP-128BVPRQP0128KB-A
RENESAS CodeJEITA Package Code Previous Code
Figure F.2 FP-128B Package Dimensions
Renesas 16-Bit Single-Chip Microcomputer
Hardware Manual
H8S/2329 Group
Publication Date: 1st Edition, March 1999
Rev.6.00, September 27, 2007
Published by: Sales Strategic Planning Div.
Renesas Technology Corp.
Edited by: Customer Support Department
Global Strategic Communication Div.
Renesas Solutions Corp.
© 2007. Renesas Technology Corp., All rights reserved. Printed in Japan.
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