TLP358(TP5,F) - Toshiba America Electronic Components, Inc.

TLP358/TLP358F

2009-08-10

TOSHIBA Photocoupler GaAℓAs IRED LED + Photo IC

TLP358,TLP358F

Industrial Inverter

MOS FET / IGBT Gate Driver

IH(Induction Heating)

The TOSHIBA TLP358 consists of a GaAℓAs light-emitting diode and an

integrated photodetector. This unit is an 8-lead DIP package.

The TLP358 is suitable for gate driving IGBTs or power MOSFETs.

The TLP358F is of a long creepage distance and clearance type.

z Peak output current : IOP = ± 6.0A (max)

z Guaranteed performance over temperature : −40 to 100°C

z Supply current : ICC = 2 mA (max)

z Power supply voltage : 15 to 30 V

z Input current: IFLH = 5mA (max)

z Switching time ( tpLH / tpHL) : 500 ns (max)

z Common-mode transient immunity : ±15 kV / μs (min)

z Isolation voltage : 3750 Vrms (min)

z UL under application : UL1577, File No.E67349

z c-UL under application: CSA Component Acceptance Service No. 5A, File No.E67349

z Option (D4)

VDE / TÜV under application: EN 60747-5-2

Pin Configuration (top view)

Construction Mechanical Rating

TOSHIBA 11−10C4

Weight: 0.54 g (typ.)

TOSHIBA 11−10C402

Weight: 0.54 g (typ.)

7.62 mm Pitch

TLP358 Type

10.16 mm Pitch

TLP358F Type

Creepage distance

Clearance

Insulation thickness

6.4 mm (min)

0.4 mm (min)

8.0 mm (min)

0.4 mm (min)

1: N.C

2: Anode

3: Cathode

4: N.C

5: GND

6: N.C

7: VO (output)

8: VCC

Unit: mm

TLP358

Unit: mm

TLP358F

TLP358/TLP358F

2009-08-10

Schematic Truth Table

Absolute Maximum Ratings (Ta = 25°C)

Characteristic Symbol Rating Unit

Forward current IF 20 mA

Forward current derating (Ta ≥ 85°C) ΔIF/ΔTa −0.54 mA/°C

Peak transient forward current (Note 1) IFP 1 A

LED

Reverse voltage VR 5 V

“H” peak output current IOPH -6.0 A

“L” peak output current

Ta = −40 to 100°C

(Note 2) IOPL 6.0 A

Detector

Supply voltage VCC 35 V

Operating temperature range Topr −40 to 100 °C

Storage temperature range Tstg −55 to 125 °C

Lead soldering temperature (10 s) (Note 3) Tsol 260 °C

Isolation voltage (AC, 1 minute, R.H. ≤ 60%) (Note 4) BVS 3750 Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: Pulse width PW ≤ 1 μs, 300 pps

Note 2: Exponential waveform pulse width PW ≤ 0.3μs, f ≤ 15kHz

Note 3: At 2 mm or more from the lead root.

Note 4: This device is regarded as a two terminal device: pins 1, 2, 3 and 4 are shorted together, as are pins 5, 6, 7

and 8.

Note 5: A ceramic capacitor(1.0 μF) should be connected from pin 8 to pin 5 to stabilize the operation of the high

gain linear amplifier. Failure to provide the bypass may impair the switching property.

The total lead length between capacitor and coupler should not exceed 1 cm.

Input LED M1 M2 Output

H ON ON OFF H

L OFF OFF ON L

3−

(M1)

(M2)

ICC

IF 8

SHIELD

VCC

GND

1.0

F bypass capacitor must be

connected between pins 8 and 5. (Note 5)

TLP358/TLP358F

2009-08-10

Recommended Operating Conditions

Characteristic Symbol Min Typ. Max Unit

Input current, ON (Note 6) IF (ON) 7.5 ⎯ 10 mA

Input voltage, OFF VF (OFF) 0 ⎯ 0.8 V

Supply voltage* VCC 15 ⎯ 30 V

Peak output current IOPH/IOPL ⎯ ⎯ ± 5.5 A

Operating frequency (Note 7) f ⎯ ⎯ 50 kHz

Operating temperature Topr −40 ⎯ 100 °C

*This item denotes operating ranges, not meaning of recommended operating conditions.

Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the

device. Additionally, each item is an independent guideline respectively. In developing designs using this

product, please confirm specified characteristics shown in this document.

Note 6: Input signal rise time (fall time) < 0.5 μs.

Note 7: Exponential waveform IOPH ≥ -4.0 A (≤ 0.3 μs), IOPL ≤ 4.0 A (≤ 0.3 μs)

Electrical Characteristics (Ta = −40 to 100°C, unless otherwise specified)

Characteristic Symbol

Test

Circuit Test Conditions Min Typ.* Max Unit

Forward voltage VF ⎯IF = 10 mA, Ta = 25 °C 1.45 1.57 1.75 V

Temperature coefficient of forward

voltage ∆VF/∆Ta ⎯IF = 10 mA ⎯ −2.0 ⎯ mV/°C

Input reverse current IR ⎯VR = 5 V, Ta = 25 °C ⎯ ⎯ 10 μA

Input capacitance CT ⎯V = 0 , f = 1 MHz, Ta = 25 °C ⎯ 100 ⎯ pF

VCC = 30 V, IF = 5 mA , V8-7 = -3.5 V ⎯ -4.0 -2.0

“H” Level IOPH 1

VCC = 15 V, IF = 5 mA , V8-7 = -5.5 V ⎯ ⎯ -5.0

VCC = 30 V, IF = 0 mA, V7-5 = 2.5 V 2.0 4.0 ⎯

Output current

(Note 8)

“L” Level IOPL 2

VCC = 15 V, IF = 0 mA, V7-5 = 5.5 V 5.0 ⎯ ⎯

“H” Level VOH 3 IF = 5 mA 11 13.7 ⎯

Output voltage

“L” Level VOL 4

VCC 1= +15 V

VEE 1= -15 V

RL = 100 Ω VF = 0.8 V ⎯ -14.9 -12.5

“H” Level ICCH 5 IF = 5 mA ⎯ 1.3 2.0

Supply current

“L” Level ICCL 6

VCC = 30 V

VO open IF = 0 mA ⎯ 1.3 2.0

Threshold input current L → H IFLH ⎯VCC = 15 V , VO > 1 V , IO = 0 mA ⎯ 1.8 5 mA

Threshold input voltage H → L VFHL ⎯VCC = 15 V , VO < 1 V , IO = 0 mA 0.8 ⎯ ⎯ V

Supply voltage VCC ⎯

⎯ 15 ⎯ 30 V

VUVLO+ ⎯

11.0 12.5 13.5 V

UVLO threshold VUVLO- ⎯

VO > 2.5 V , IF = 5 mA 9.5 11.0 12.0 V

UVLO hysteresis UVLOHYS ― ― ― 1.5 ― V

*: All typical values are at Ta = 25°C

Note 8: Duration of IO : ≤ 50 μs (1 PULSE)

Note 9: This product is more sensitive to static electricity (ESD) than the conventional product because of its

minimal power consumption design.

General static electricity precautions are necessary for handling this component.

TLP358/TLP358F

2009-08-10

Isolation Characteristics (Ta = 25°C)

Characteristic Symbol Test Conditions Min. Typ. Max. Unit

Capacitance input to output CS V = 0, f = 1MHz (Note4) ⎯ 1.0 ⎯ pF

Isolation resistance RS VS = 500 V, R.H. ≤ 60% (Note4) 1×1012 1014 ― Ω

AC,1 minute 3750 ― ―

AC,1 second, in oil ― 10000 ― Vrms

Isolation voltage BVS

DC,1 minute, in oil ― 10000 ― Vdc

Switching Characteristics (Ta = −40 to 100°C, unless otherwise specified)

Characteristic Symbol

Test

Circuit Test Conditions Min Typ.* Max Unit

L → H tpLH I

F = 0 → 5 mA 50 230 500

Propagation delay time

H → L tpHL

VCC = 30 V,

Rg = 10 Ω,

Cg = 10 nF IF = 5 → 0 mA 50 230 500

Switching Time Dispersion

between ON and OFF |tpHL-tpLH|

VCC = 30 V,

Rg = 10 Ω,

Cg = 10 nF

⎯ ⎯ 250

Output rise time (10-90%) tr I

F = 0 → 5 mA ⎯ 17 ⎯

Output fall time (90-10%) tf

VCC = 30 V,

Rg = 10 Ω,

Cg = 10 nF IF = 5 → 0 mA ⎯ 17 ⎯

Common mode transient immunity

at high level output CMH IF = 5 mA,

VO (min) =26V - 15000 ⎯ ⎯

Common mode transient immunity

at low level output CML

VCM = 1000 Vp-p

Ta = 25 °C,

VCC = 30 V IF = 0 mA,

VO (max) =1V 15000 ⎯ ⎯

V/μs

*: All typical values are at Ta = 25°C

Test Circuit 1: IOPH Test Circuit 2: IOPL

Test Circuit 3: VOH Test Circuit 4: VOL

IF A

IOPH

V8-7

VOH VEE1

VCC1

RL VF

VOL VEE1

VCC1

1.0μF

IOPL

VCC

V7-5

1.0μF

VCC

TLP358/TLP358F

2009-08-10

Test Circuit 5: ICCH Test Circuit 6: ICCL

Test Circuit 7: tpLH, tpHL, tr, tf

Test Circuit 8: CMH, CML

CML (CMH) is the maximum rate of rise (fall) of the common mode voltage that can be

sustained with the output voltage in the low (high) state.

VCC

4 5

+ −

VCM

90%

10%

1000 V

26V

CMH

CML

VCM

SW A: IF = 5 mA

SW B: IF = 0 mA

)(

)(800

)(

)(800

90%

50%

10%

trVOH

VOL

VCC

Rg = 10 Ω

Cg =10 nF

4 5

VCC

ICCL

VCC

ICCH

1.0μF 1.0μF

1.0μF

TLP358/TLP358F

2009-08-10

Soldering and Storage

(1) Precautions for Soldering

1) When Using Soldering Reflow

z An example of a temperature profile when Sn-Pb eutectic solder is used:

z An example of a temperature profile when lead(Pb)-free solder is used:

z Reflow soldering must be performed once or twice.

z The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)

z Apply preheating of 150 deg.C for 60 to 120 seconds.

z Mounting condition of 260 deg.C or less within 10 seconds is recommended.

z Flow soldering must be performed once

3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)

z Complete soldering within 10 seconds for lead temperature not exceeding 260 deg.C or within 3 seconds

not exceeding 350 deg.C.

z Heating by soldering iron must be only once per 1 lead

TLP358/TLP358F

2009-08-10

(2) Precautions for General Storage

1) Do not store devices at any place where they will be exposed to moisture or direct sunlight.

2) When transportation or storage of devices, follow the cautions indicated on the carton box.

3) The storage area temperature should be kept within a temperature range of 5 degree C

to 35 degree C, and relative humidity should be maintained at between 45% and 75%.

4) Do not store devices in the presence of harmful (especially corrosive) gases, or in dusty conditions.

5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature

changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion,

as a result, the solderability of the leads will be degraded.

6) When repacking devices, use anti-static containers.

7) Do not apply any external force or load directly to devices while they are in storage.

8) If devices have been stored for more than two years, even though the above conditions have been

followed, it is recommended that solderability of them should be tested before they are used.

TLP358/TLP358F

2009-08-10

DIP8 Package Dimensions

TOSHIBA 11−10C401

Weight: 0.54 g (typ.)

TOSHIBA 11−10C404

Weight: 0.54 g (typ.)

TOSHIBA 11−10C405

Weight: 0.54 g (typ.)

DIP8（LF1）/（TP1） Unit: mm DIP8（LF4）/（TP4） Unit: mm

DIP8（LF5）/（TP5） Unit: mm

TLP358/TLP358F

2009-08-10

Specifications for Embossed-Tape Packing

for DIP8 Type Photocoupler：(TP1), (TP4), (TP5)

1. Applicable Package

Package Name Product Type

DIP8LF1 / DIP8LF5 TLP358

DIP8LF4 TLP358F

2. Product Naming System

Type of package used for shipment is denoted by a symbol suffix after a product number. The method of

classification is as below.

(Example１)

ＴＬＰ３５８（ＴＰ１，Ｆ）

[[G]]/RoHS COMPATIBLE (Note 10)

Tape type

Device name

(Example２)

ＴＬＰ３５８Ｆ（ＴＰ４，Ｆ）

[[G]]/RoHS COMPATIBLE (Note 10)

Tape type

Device name

3. Tape Dimensions

3.1 Orientation of Devices in Relation to Direction of Tape Movement

Device orientation in the recesses is as shown in Figure 1.

Figure 1 Device Orientation

3.2 Tape Packing Quantity

DIP8LF1 / DIP8LF5 ：1,500 devices per reel

DIP8LF4 ：1,000 devices per reel

Tape feed

TLP358/TLP358F

2009-08-10

3.3 Empty Device Recesses Are as Shown in Table 1.

Table 1 Empty Device Recesses

Standard Remarks

Occurrences of 2 or more

successive empty device

recesses

0 Within any given 40-mm section of

tape, not including leader and trailer

Single empty device

recesses 6 devices (max) per reel Not including leader and trailer

3.4 Start and End of Tape:

The start of the tape has 30 or more empty holes. The end of the tape has 30 or more empty holes

and two empty turns only for a cover tape.

3.5 Tape Specification

(1) Tape material: Plastic (protection against electrostatics)

(2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 2.

Figure 2 Tape Forms

Table 2 Tape Dimension

Unit: mm

Unless otherwise specified: ±0.1

Dimensions

Symbol

(TP1), (TP5) (TP4)

Remark

A 10.4 12.3 ⎯

B 10.1 10.1 ⎯

D 7.5 7.5 Center line of indented square hole and sprocket hole

E 1.75 1.75 Distance between tape edge and hole center

F 16.0 16.0 Cumulative error (max) per 10 feed holes

G 4.0 4.0 Cumulative error (max) per 10 feed holes

K0 4.1 4.1 Internal space

φ1.6 ± 0.1

4.55

0.2

2.0 ± 0.1

16.0 ± 0.3

φ1.5

+0.1

−0

0.4

0.05

0.1

−

0.3

0.1

−

0.3

TLP358/TLP358F

2009-08-10

3.6 Reel

(1) Material: Plastic

(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.

Figure 3 Reel Forms

4. Packing

Either one reel or five reels of photocouplers are packed in a shipping carton.

5. Label Indication

The carton bears a label indicating the product number, the symbol representing classification of

standard, the quantity, the lot number and the Toshiba company name.

6. Ordering Method

When placing an order, please specify the product number, the tape type and the quantity as shown in

the following example.

(Example 1)

ＴＬＰ３５８（ＴＰ１，Ｆ）１５００pcs

Quantity (must be a multiple of 1500)

[[G]]/RoHS COMPATIBLE (Note 10)

Tape type

Device name

(Example 2)

ＴＬＰ３５８Ｆ（ＴＰ４，Ｆ）２０００pcs

Quantity (must be a multiple of 1000)

[[G]]/RoHS COMPATIBLE(Note 10)

Tape type

Device name

Note 10 : Please contact your TOSHIBA sales representative for details as to environmental matters such as the

RoHS compatibility of Product.

RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on

the restriction of the use of certain hazardous substances in electrical and electronics equipment.

Symbol Dimensions

A φ380 ± 2

B φ80 ± 1

C φ13 ± 0.5

E 2.0 ± 0.5

U 4.0 ± 0.5

W1 17.5 ± 0.5

W2 21.5 ± 1.0

Table 3 Reel Dimension

Unit: mm

TLP358/TLP358F

2009-08-10

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively “Product”) without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must

also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,

the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA

Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are

solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the

appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any

information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other

referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO

LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.

• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.

Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or

reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious

public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used

in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling

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power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this

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WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

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SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or

vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without

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technology products (mass destruction weapons). Product and related software and technology may be controlled under the

Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product

or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of

noncompliance with applicable laws and regulations.