SDO2
SDO2
5
6
7
8 9
10
11
12
LMH0202
SDI2
RREF2
SDI2
SD/HD2
VCC2
VEE2
SDO1
SDO1
1
2
3
4 13
14
15
16
SDI1
RREF1
SDI1
SD/HD1
VCC1
VEE1
LMH0202
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SNLS212C –FEBRUARY 2006–REVISED APRIL 2013
LMH0202 Dual SMPTE 292M / 259M Serial Digital Cable Driver
Check for Samples: LMH0202
1FEATURES DESCRIPTION
The LMH0202 Dual SMPTE 292M / 259M serial
2• SMPTE 292M, SMPTE 344M and SMPTE 259M digital cable driver is a monolithic, high-speed cable
Compliant driver designed for use in SMPTE 292M / 259M serial
• Data Rates to 1.485 Gbps digital video and ITU-T G.703 serial digital data
• Dual Differential Inputs transmission applications. The LMH0202 drives 75Ω
transmission lines (Belden 8281, Belden 1694A or
• Dual 75ΩDifferential Outputs equivalent) at data rates up to 1.485 Gbps.
• Two Selectable Slew Rates The LMH0202 provides two selectable slew rates for
• Adjustable Output Amplitude SMPTE 259M and SMPTE 292M compliance. The
• Single 3.3V Supply Operation output voltage swing is adjustable via a single
• Commercial Temperature Range: 0°C to +70°C external resistor.
• Typical Power Consumption: 250 mW in SD The LMH0202 offers the flexibility to implement either
Mode and 300 mW in HD Mode dual differential inputs or a single differential input
(externally routed via PCB) to dual differential
APPLICATIONS outputs. The latter option provides an ideal solution
for DVB-ASI applications where only the non-inverted
• SMPTE 292M, SMPTE 344M, and SMPTE 259M outputs are typically used.
Serial Digital Interfaces The LMH0202 is powered from a single 3.3V supply.
• DVB-ASI Applications Power consumption is typically 250 mW in SD mode
• Sonet/SDH and ATM Interfaces and 300 mW in HD mode.
• Digital Routers and Switches
• Distribution Amplifiers
• Buffer Applications
• Video Cameras
Connection Diagram
Figure 1. 16-Pin TSSOP
See PW Package
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2006–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
50:
50:
0.1 PF
1.0 PF
1.0 PF
Differential
Input
LMH0202
SDI2
RREF2
SDI2
SDO1
SDI1
RREF1
SDI1
SDO1
SD/HD1
750:
SDO2
SDO2
SD/HD2
50:
50:
0.1 PF
1.0 PF
1.0 PF
Differential
Input
VCC
75:75:0.1 PF
75:
5.6 nH
4.7 PF
750:
VCC
VCC
75:
5.6 nH
4.7 PF
Coaxial Cable
Coaxial Cable 75:
75:
75:75:0.1 PF
75:
5.6 nH
4.7 PF
VCC
75:
5.6 nH
4.7 PF
Coaxial Cable
Coaxial Cable
75:
SD/HD2
SD/HD1
75:
LMH0202
SNLS212C –FEBRUARY 2006–REVISED APRIL 2013
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Typical Application
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SNLS212C –FEBRUARY 2006–REVISED APRIL 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)
Supply Voltage: −0.5V to 3.6V
Input Voltage (all inputs) −0.3V to VCC+0.3V
Output Current 28 mA
Storage Temperature Range −65°C to +150°C
Junction Temperature +150°C
Lead Temperature (Soldering 4 Sec) +260°C
Package Thermal Resistance
θJA 16-pin TSSOP +125°C/W
θJC 16-pin TSSOP +105°C/W
ESD Rating (HBM) 5 kV
ESD Rating (MM) 250V
(1) Absolute Maximum Ratings are those parameter values beyond which the life and operation of the device cannot be ensured. The
stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values.
The table of Electrical Characteristics specifies acceptable device operating conditions.
Recommended Operating Conditions
Supply Voltage (VCC – VEE): 3.3V ±5%
Operating Free Air Temperature (TA) 0°C to +70°C
DC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified(1)(2).
Symbol Parameter Conditions Reference Min Typ Max Units
VCMIN Input Common Mode Voltage SDI1, SDI1, 1.6 + VCC –V
SDI2, SDI2 VSDI/2 VSDI/2
VSDI Input Voltage Swing Differential 100 2000 mVP−P
VCMOUT Output Common Mode Voltage SDO1, VCC –V
SDO1, VSDO
SDO2, SDO2
VSDO Output Voltage Swing Single-ended, 75Ωload,
RREF1 = 750Ω1%, 750 800 850 mVP-P
RREF2 = 750Ω1%
Single-ended, 75Ωload,
RREF1 = 590Ω1%, 900 1000 1100 mVP-P
RREF2 = 590Ω1%
VSDHD SD/HD Input Voltage Min for SD SD/HD1, 2.4 V
SD/HD2
Max for HD 0.8 V
ISDHD SD/HD Input Current 3.7 µA
ICC Supply Current SD/HD1 = 0, SD/HD2 = 0(3) 90 98 mA
SD/HD1 = 1, SD/HD2 = 1(3) 76 86 mA
(1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to VEE = 0 Volts.
(2) Typical values are stated for VCC = +3.3V and TA= +25°C.
(3) Maximum ICC is measured at VCC = +3.465V and TA= +70°C.
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SNLS212C –FEBRUARY 2006–REVISED APRIL 2013
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AC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified(1).
Symbol Parameter Conditions Reference Min Typ Max Units
DRSDI Input Data Rate (2)SDI1, SDI1, 1485 Mbps
SDI2, SDI2
tjit Additive Jitter 1.485 Gbps SDO1, SDO1, 26 psP-P
SDO2, SDO2
270 Mbps 18 psP-P
tr,tfOutput Rise Time, Fall Time SD/HD1 = 0, SD/HD2 = 0, 120 220 ps
20% – 80%(3)
SD/HD1 = 1, SD/HD2 = 1, 400 560 800 ps
20% – 80%(3)
Mismatch in Rise/Fall Time (2) 30 ps
tOS Output Overshoot (2) 8 %
RLSDO Output Return Loss (4) 15 20 dB
(1) Typical values are stated for VCC = +3.3V and TA= +25°C.
(2) Specification is ensured by characterization.
(3) Specification is ensured by characterization and verified by test.
(4) Output return loss is dependent on board design. The LMH0202 meets this specification on the SD202 evaluation board from 5 MHz to
1.5 GHz.
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10 k:
SDI
SDI
VCC
10 k:
5 k:
80:
VCC
10 k:
LMH0202
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SNLS212C –FEBRUARY 2006–REVISED APRIL 2013
Table 1. PIN DESCRIPTIONS
Pin # Name Description
1 SDI1 Serial data true input.
2 SDI1 Serial data complement input.
3 VEE1 Negative power supply (ground).
4 RREF1 Output driver level control. Connect a resistor to VCC to set output voltage swing.
5 SDI2 Serial data true input.
6 SDI2 Serial data complement input.
7 VEE2 Negative power supply (ground).
8 RREF2 Output driver level control. Connect a resistor to VCC to set output voltage swing.
9 VCC2 Positive power supply (+3.3V).
10 SD/HD2 Output slew rate control. Output rise/fall time complies with SMPTE 292M when low and SMPTE 259M
when high.
11 SDO2 Serial data complement output.
12 SDO2 Serial data true output.
13 VCC1 Positive power supply (+3.3V).
14 SD/HD1 Output slew rate control. Output rise/fall time complies with SMPTE 292M when low and SMPTE 259M
when high.
15 SDO1 Serial data complement output.
16 SDO1 Serial data true output.
DEVICE OPERATION
INPUT INTERFACING
The LMH0202 accepts either differential or single-ended input. The inputs are self-biased, allowing for simple AC
or DC coupling. DC-coupled inputs must be kept within the specified common-mode range. SDI and SDI are self-
biased at approximately 2.1V with VCC = 3.3V. Figure 2 shows the differential input stage for SDI and SDI.
Figure 2. Differential Input Stage for SDI and SDI.
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50:
50:
0.1 PF
1.0 PF
1.0 PF
Differential
Input
LMH0202
SDI2
SDI2
SDI1
SDI1
25:
25:
25:
25:
LMH0202
SNLS212C –FEBRUARY 2006–REVISED APRIL 2013
www.ti.com
DVB-ASI APPLICATIONS
The dual differential inputs of the LMH0202 may be externally routed to a single differential input as shown in
Figure 3. This provides a solution for DVB-ASI applications where two non-inverted outputs are needed.
Figure 3. Single Differential Input for DVB-ASI
OUTPUT INTERFACING
The LMH0202 uses current mode outputs. Single-ended output levels are 800 mVP-P into 75ΩAC-coupled
coaxial cable (with RREF = 750Ω). Output level is controlled by the value of the resistor connected between the
RREF pin and VCC.
The RREF resistor should be placed as close as possible to the RREF pin. In addition, the copper in the plane
layers below the RREF network should be removed to minimize parasitic capacitance.
OUTPUT SLEW RATE CONTROL
The LMH0202 output rise and fall times are selectable for either SMPTE 259M or SMPTE 292M compliance via
the SD/HD pin. For slower rise and fall times, or SMPTE 259M compliance, SD/HD is set high. For faster rise
and fall times, or SMPTE 292M compliance, SD/HD is set low.
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LMH0202
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SNLS212C –FEBRUARY 2006–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 6
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PACKAGE OPTION ADDENDUM
www.ti.com 23-Aug-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMH0202MT/NOPB ACTIVE TSSOP PW 16 92 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 L202
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
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provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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