KAF-8300 IMAGE SENSOR
3326 (H) X 2504 (V) FULL FRAME CCD IMAGE SENSOR
JULY 20, 2012
DEVICE PERFORMANCE SPECIFICATION
REVISION 1.0 PS-0029
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 2
TABLE OF CONTENTS
Summary Specification ......................................................................................................................................................................................... 5
Description .................................................................................................................................................................................................... 5
Features ......................................................................................................................................................................................................... 5
Applications .................................................................................................................................................................................................. 5
Ordering Information ............................................................................................................................................................................................ 6
Device Description ................................................................................................................................................................................................. 7
Architecture .................................................................................................................................................................................................. 7
Dark Reference Pixels ............................................................................................................................................................................ 9
Dark Dummy Pixels ................................................................................................................................................................................. 9
Dummy Pixels ........................................................................................................................................................................................... 9
Virtual Dummy Columns ........................................................................................................................................................................ 9
Active Buffer Pixels................................................................................................................................................................................. 9
Blue Pixel Buffer ...................................................................................................................................................................................... 9
CTE Monitor Pixels ............................................................................................................................................................................... 10
Image Acquisition ..................................................................................................................................................................................... 10
Charge Transport ...................................................................................................................................................................................... 10
Horizontal Register .................................................................................................................................................................................. 11
Output Structure .................................................................................................................................................................................. 11
Output Load........................................................................................................................................................................................... 12
Physical Description ................................................................................................................................................................................. 13
Pin Description and Device Orientation ......................................................................................................................................... 13
Imaging Performance .......................................................................................................................................................................................... 14
Typical Operational Conditions............................................................................................................................................................. 14
Specifications............................................................................................................................................................................................. 14
All Devices .............................................................................................................................................................................................. 14
Color Devices ......................................................................................................................................................................................... 15
Monochrome Versions Only .............................................................................................................................................................. 16
Typical Performance Curves ............................................................................................................................................................................ 17
Defect Definitions ................................................................................................................................................................................................ 19
Operational Conditions ........................................................................................................................................................................... 19
Specifications............................................................................................................................................................................................. 19
All Devices .............................................................................................................................................................................................. 19
Color Devices ......................................................................................................................................................................................... 20
Operation .................................................................................................................................................................................................................. 21
Power-up Sequence ................................................................................................................................................................................. 21
DC Bias Operating Conditions ............................................................................................................................................................... 22
AC Operating Conditions ........................................................................................................................................................................ 22
Clock Levels ........................................................................................................................................................................................... 22
Clock Voltage Detail Characteristics ............................................................................................................................................... 23
Capacitance Equivalent Circuit.............................................................................................................................................................. 24
Timing ......................................................................................................................................................................................................................... 25
Requirements and Characteristics ....................................................................................................................................................... 25
Clock Switching Characteristics ........................................................................................................................................................ 25
Edge Alignment ........................................................................................................................................................................................ 26
Frame Timing ............................................................................................................................................................................................. 27
Frame Timing Detail............................................................................................................................................................................. 27
Line Timing ................................................................................................................................................................................................. 28
Pixel Timing ................................................................................................................................................................................................ 29
KAF-8300 Image Sensor
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Pixel Timing Detail ............................................................................................................................................................................... 30
Mode of Operation ............................................................................................................................................................................................... 31
Power-up Flush Cycle .............................................................................................................................................................................. 31
Storage and Handling .......................................................................................................................................................................................... 32
Storage Conditions................................................................................................................................................................................... 32
ESD ............................................................................................................................................................................................................... 32
Cover Glass Care and Cleanliness ......................................................................................................................................................... 32
Environmental Exposure ........................................................................................................................................................................ 32
Soldering Recommendations ................................................................................................................................................................ 32
Mechanical Information ..................................................................................................................................................................................... 33
Visual Mechanical Specifications .......................................................................................................................................................... 33
Laser Mark .............................................................................................................................................................................................. 33
Assembly/Package Integrity .............................................................................................................................................................. 33
Glass ......................................................................................................................................................................................................... 33
Completed Assembly ............................................................................................................................................................................... 34
Cover Glass ................................................................................................................................................................................................. 36
Clear Cover Glass, AR Coated (both sides) - Specification ......................................................................................................... 36
Clear Cover Glass – Specification ...................................................................................................................................................... 36
Quality Assurance and Reliability .................................................................................................................................................................. 37
Quality and Reliability ............................................................................................................................................................................. 37
Replacement .............................................................................................................................................................................................. 37
Liability of the Supplier ........................................................................................................................................................................... 37
Liability of the Customer ........................................................................................................................................................................ 37
Test Data Retention ................................................................................................................................................................................. 37
Mechanical .................................................................................................................................................................................................. 37
Life Support Applications Policy .................................................................................................................................................................... 37
Revision Changes................................................................................................................................................................................................... 38
MTD/PS-0996 ............................................................................................................................................................................................. 38
PS-0029 ....................................................................................................................................................................................................... 38
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 4
TABLE OF FIGURES
Figure 1: Block Diagram (color) ................................................................................................................................................................... 7
Figure 2: Block Diagram (monochrome) ................................................................................................................................................... 8
Figure 3: Output Architecture (Left or Right)........................................................................................................................................ 11
Figure 4: Recommended Output Structure Load Diagram ................................................................................................................ 12
Figure 5: Pinout Diagram ............................................................................................................................................................................ 13
Figure 6: Typical Quantum Efficiency, Color version ........................................................................................................................... 17
Figure 7: Typical Quantum Efficiency, all Monochrome versions ..................................................................................................... 17
Figure 8: Typical Angular Response, Color version .............................................................................................................................. 18
Figure 9: Typical Angular Response, Monochrome with microlens ................................................................................................. 18
Figure 10: Equivalent Circuit Model ......................................................................................................................................................... 24
Figure 11: H1 and H2 Edge Alignment .................................................................................................................................................... 26
Figure 12: H1L and H2 Edge Alignment .................................................................................................................................................. 26
Figure 13: Frame Timing (minimum) ........................................................................................................................................................ 27
Figure 14: Frame Timing Edge Alignment .............................................................................................................................................. 27
Figure 15: Line Timing ................................................................................................................................................................................. 28
Figure 16: Pixel Timing ................................................................................................................................................................................ 29
Figure 17: Pixel Timing Detail .................................................................................................................................................................... 30
Figure 18: Power-up Flush Cycle ............................................................................................................................................................... 31
Figure 19: Completed Assembly (1 of 2) ................................................................................................................................................. 34
Figure 20: Completed Assembly (2 of 2) ................................................................................................................................................. 35
Figure 21: Clear Cover Glass Transmission, Typical .............................................................................................................................. 36
KAF-8300 Image Sensor
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Summary Specification
KAF-8300 Image Sensor
DESCRIPTION
The KAF-8300 Image Sensor is a 22.5 mm diagonal (Four
Thirds Format) high performance color or monochrome
full frame CCD (charge-coupled device) image sensor
designed for a wide range of image sensing applications
including digital imaging. Each pixel contains blooming
protection by means of a lateral overflow drain thereby
preventing image corruption during high light level
conditions. For the color version, the 5.4 µm square pixels
are patterned with an RGB mosaic color filter with
overlying microlenses for improved color response and
reproduction. Several versions of monochrome devices
are available with or without microlenses.
The sensor utilizes the TRUESENSE Transparent Gate
Electrode to improve sensitivity compared to the use of a
standard front side illuminated polysilicon electrode.
FEATURES
TRUESENSE Transparent Gate Electrode for high
sensitivity
High Resolution
High Dynamic Range
Low Noise Architecture
APPLICATIONS
Digitization
Medical
Scientific
Parameter
Typical Value
Architecture
Full Frame CCD; with Square Pixels
Total Number of Pixels
3448 (H) x 2574 (V) = approx. 8.9M
Number of Effective Pixels
Color device
Monochrome device
3358 (H) x 2536 (V) = approx. 8.6M
3366 (H) x 2544 (V) = approx. 8.6M
Number of Active Pixels
3326 (H) x 2504 (V) = approx. 8.3M
Pixel Size
5.4 μm (H) x 5.4 µm (V)
Active Image Size
17.96 mm (H) x 13.52 mm (V)
22.5 mm (diagonal)
Aspect Ratio
4:3
Horizontal Outputs
1
Saturation Signal
> 25.5 ke-
Output Sensitivity
23 µV/e-
Quantum Efficiency, color
R(600nm), G(540nm), B(480nm)
33%, 40 %, 33%
Quantum Efficiency,
monochrome
Microlens, clear glass (540 nm)
Microlens, no glass (540 nm)
Microlens, AR glass (540 nm)
No Microlens, clear glass
(560 nm)
54%
60%
56%
37%
Total Sensor Noise
16 e-
Dark Signal
< 200 e-/s
Dark Current Doubling
Temperature
5.8 °C
Linear Dynamic Range
64.4 dB
Linearity Error at 12°C
± 10%
Charge Transfer Efficiency
0.999995
Blooming Protection
(1ms integration time)
1000x saturation exposure
Maximum Data Rate
28 MHz
Package
32-pin CERDIP, 0.070‛ pin spacing
Cover Glass
Clear or AR coated, 2sides
Parameters above are specified at T = 60 °C and a data rate of 28 MHz
unless otherwise noted
KAF-8300 Image Sensor
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Ordering Information
Catalog
Number
Product Name
Description
Marking Code
4H0827
KAF- 8300-AAB-CB-AA
Monochrome, No Microlens, CERDIP Package (sidebrazed), Clear
Cover Glass (no coatings), Standard Grade
KAF-8300XE
[Serial Number]
4H0828
KAF- 8300-AAB-CB-AE
Monochrome, No Microlens, CERDIP Package (sidebrazed), Clear
Cover Glass (no coatings), Engineering Grade
4H0927
KAF- 8300-AXC-CB-AA
Monochrome, Microlens, CERDIP Package (sidebrazed), Clear Cover
Glass (no coatings), Standard Grade
KAF-8300-AXC
[Serial Number]
4H0928
KAF- 8300-AXC-CB-AE
Monochrome, Microlens, CERDIP Package (sidebrazed), Clear Cover
Glass (no coatings), Engineering Grade
4H0929
KAF- 8300-AXC-CP-AA
Monochrome, Microlens, CERDIP Package (sidebrazed), Taped Clear
Cover Glass (no coatings), Standard Grade
KAF-8300-AXC
[Serial Number]
4H0930
KAF- 8300- AXC-CP-AE
Monochrome, Microlens, CERDIP Package (sidebrazed), Taped Clear
Cover Glass (no coatings), Engineering Grade
4H0944
KAF- 8300-AXC-CD-AA
Monochrome, Microlens, CERDIP Package (sidebrazed), Clear Cover
Glass with AR coating (both sides), Standard Grade
KAF-8300-AXC
[Serial Number]
4H0945
KAF- 8300- AXC-CD-AE
Monochrome, Microlens, CERDIP Package (sidebrazed), Clear Cover
Glass with AR coating (both sides), Engineering Grade
4H0469
KAF- 8300-CXB-CB-AA-Offset
Color (Bayer RGB), Special Microlens, CERDIP Package (sidebrazed),
Clear Cover Glass (no coatings), Standard Grade, Offset
KAF-8300CE
[Serial Number]
4H0468
KAF- 8300-CXB-CB-AE-Offset
Color (Bayer RGB), Special Microlens, CERDIP Package (sidebrazed),
Clear Cover Glass (no coatings), Engineering Grade, Offset
4H0471
KEK-4H0471-KAF- 8300-12-28
Evaluation Board (Complete Kit)
N/A
See Application Note Product Naming Convention for a full description of the naming convention used for Truesense
Imaging image sensors. For reference documentation, including information on evaluation kits, please visit our web
site at www.truesenseimaging.com.
Please address all inquiries and purchase orders to:
Truesense Imaging, Inc.
1964 Lake Avenue
Rochester, New York 14615
Phone: (585) 784-5500
E-mail: info@truesenseimaging.com
Truesense Imaging reserves the right to change any information contained herein without notice. All information
furnished by Truesense Imaging is believed to be accurate.
KAF-8300 Image Sensor
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Device Description
ARCHITECTURE
BB
R
R
GR GR
GRGR
GB
248 pixels
Last Hccd Phase: H1
3326 Active Pixels (typical active line format)
Last Vccd Phase: V2
16 Active Buffer
4 Blue Pixel Buffer
8 Dark Dummy
39 Dark
6 Dark Dummy
3 Dummy
1 Active (CTE Monitor)
H1
H2
16 Active Buffer
4 Blue Pixel Buffer
5 Dark Dummy
5 Dummy
1 Active (CTE Monitor)
8 Dummy
4 Virtual Dummy Column 2 Dummy
OG
SUB
VOUT
RG
RD
H1L
VDD
VSS
V1
V2
1 Active (CTE Monitor)
16 Active Buffer
4 Blue Pixel Buffer
3 Dark Dummy
LODT
LODB
16 Active Buffer
4 Blue Pixel Buffer
8 Dark Dummy
12 Dark
6 Dark Dummy
2504 Active Lines/Frame
Active Image Area 3326 (H) X 2504 (V)
Effective Image Area 3358 (H) X 2536 (V)
5.4 microns X 5.4 microns
4:3 Aspect Ratio
1163 pixels 1162 pixels
Figure 1: Block Diagram (color)
KAF-8300 Image Sensor
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248 pixels
Last Hccd Phase: H1
3326 Active Pixels (typical active line format)
Last Vccd Phase: V2
20 Active Buffer
8 Dark Dummy
39 Dark
6 Dark Dummy
3 Dummy
1 Active (CTE Monitor)
H1
H2
20 Active Buffer
5 Dark Dummy
5 Dummy
1 Active (CTE Monitor)
8 Dummy
4 Virtual Dummy Column 2 Dummy
OG
SUB
VOUT
RG
RD
H1L
VDD
VSS
V1
V2
1 Active (CTE Monitor)
20 Active Buffer
3 Dark Dummy
LODT
LODB
20 Active Buffer
8 Dark Dummy
12 Dark
6 Dark Dummy
2504 Active Lines/Frame
Active Image Area 3326 (H) X 2504 (V)
Effective Image Area 3366 (H) X 2544 (V)
5.4 microns X 5.4 microns
4:3 Aspect Ratio
1163 pixels 1162 pixels
Figure 2: Block Diagram (monochrome)
KAF-8300 Image Sensor
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Dark Reference Pixels
Surrounding the periphery of the device is a border of light shielded pixels creating a dark region. Within this dark
region there are light shielded pixels that include 39 trailing dark pixels on every line. There are also 12 full dark lines
at the start of every frame. Under normal circumstances, these pixels do not respond to light and may be used as a
dark reference.
Dark Dummy Pixels
Within the dark region some pixels are in close proximity to an active pixel, or the light sensitive regions that have
been added for manufacturing test purposes, (CTE Monitor). In both cases, these pixels can scavenge signal depending
on light intensity and wavelength. These pixels should not be used as a dark reference. These pixels are called dark
dummy pixels.
Within the dark region, dark dummy pixels have been identified. There are 5 leading and 14 (6 + 8) trailing dark pixels
on every line. There are also 14 (6 + 8) dark dummy lines at the start of every frame along with 3 dark dummy lines at
the end of each frame
Dummy Pixels
Within the horizontal shift register there are 13, (8 + 5), leading and 5, (2 + 3), trailing additional shift phases that are
not electrically associated with any columns of pixels within the vertical register. These pixels contain only horizontal
shift register dark current signal and do not respond to light and therefore, have been designated as dummy pixels. For
this reason, they should not be used to determine a dark reference level.
Virtual Dummy Columns
Within the horizontal shift register there is 4 leading shift phases that are not physically associated with a column of
pixels within the vertical register. These pixels contain only horizontal shift register dark current signal and do not
respond to light and therefore, have been designated as virtual dummy columns. For this reason, they also should not
be used to determine a dark reference level.
Active Buffer Pixels
For color devices, sixteen buffer pixels adjacent to the blue pixel buffer region contain a RGB mosaic color pattern. This
region is classified as active buffer pixels. These pixels are light sensitive but they are not tested for defects and non-
uniformities. The response of these pixels will not be uniform.
For monochrome devices, 20 buffer pixels adjacent to the dark dummy pixels are classified as active buffer pixels.
These pixels are light sensitive but they are not tested for defects and non-uniformities. The response of these pixels
will not be uniform.
Blue Pixel Buffer
For color devices, four buffer pixels adjacent to any leading or trailing dark reference regions contain a blue filter and
is classified as a blue pixel buffer. These pixels are light sensitive but they are not tested for defects and non-
uniformities. The response of these pixels will not be uniform.
Monochrome devices do not contain a blue pixel buffer.
KAF-8300 Image Sensor
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CTE Monitor Pixels
Within the horizontal dummy pixel region two light sensitive test pixels (one each on the leading and trailing ends) are
added and within the vertical dummy pixel region one light sensitive test pixel has been added. These CTE monitor
pixels are used for manufacturing test purposes. In order to facilitate measuring the device CTE, the pixels in the CTE
Monitor region in the horizontal and vertical portion is coated with blue pigment on the color version only. The
monochrome device is uncoated).
IMAGE ACQUISITION
An electronic representation of an image is formed when incident photons falling on the sensor plane create electron-
hole pairs within the device. These photon-induced electrons are collected locally by the formation of potential wells
at each photogate or pixel site. The number of electrons collected is linearly dependent on light level and exposure
time and non-linearly dependent on wavelength. When the pixel's capacity is reached, excess electrons are discharged
into the lateral overflow drain to prevent crosstalk or ‘blooming’. During the integration period, the V1 and V2 register
clocks are held at a constant (low) level.
CHARGE TRANSPORT
The integrated charge from each photogate is transported to the output using a two-step process. Each line (row) of
charge is first transported from the vertical CCD’s to a horizontal CCD register using the V1 and V2 register clocks. The
horizontal CCD is presented a new line on the falling edge of V2 while H1 is held high. The horizontal CCD’s then
transport each line, pixel by pixel, to the output structure by alternately clocking the H1 and H2 pins in a
complementary fashion. A separate connection to the last H1 phase (H1L) is provided to improve the transfer speed of
charge to the floating diffusion. On each falling edge of H1 a new charge packet is dumped onto a floating diffusion
and sensed by the output amplifier.
KAF-8300 Image Sensor
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HORIZONTAL REGISTER
Output Structure
Figure 3: Output Architecture (Left or Right)
Charge presented to the floating diffusion (FD) is converted into a voltage and is current amplified in order to drive
off-chip loads. The resulting voltage change seen at the output is linearly related to the amount of charge placed on
the FD. Once the signal has been sampled by the system electronics, the reset gate (RG) is clocked to remove the
signal and FD is reset to the potential applied by reset drain (RD). Increased signal at the floating diffusion reduces the
voltage seen at the output pin. To activate the output structure, an off-chip load must be added to the VOUT pin of the
device. See Figure 4.
Floating
Diffusion
HCCD
Charge
Transfer
Source
Follower
#1
Source
Follower
#2
Source
Follower
#3
RD
RG
OG
H1L
H1
H2
VOUT
VDD
VSS
KAF-8300 Image Sensor
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Output Load
Figure 4: Recommended Output Structure Load Diagram
Note:
1. Component values may be revised based on operating conditions and other design considerations.
2N3904
or Equiv.
130 Ohms Buffered
Video
Output
Iout = 5.4mA
VDD = +15V
680 Ohms
0.1uF
VOUT
KAF-8300 Image Sensor
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PHYSICAL DESCRIPTION
Pin Description and Device Orientation
Figure 5: Pinout Diagram
Pin
Name
Description
Pin
Name
Description
1
SUB
Substrate
32
N/C
No Connection
2
OG
Output Gate
31
LODT
Lateral Overflow Drain Top
3
RG
Reset Gate
30
V1
Vertical Phase 1
4
RD
Reset Drain Bias
29
V1
Vertical Phase 1
5
RD
Reset Drain Bias
28
V2
Vertical Phase 2
6
VSS
Output Amplifier Return
27
V2
Vertical Phase 2
7
VOUT
Output
26
SUB
Substrate
8
VDD
Output Amplifier Supply
25
N/C
No Connection
9
SUB
Substrate
24
V2
Vertical Phase 2
10
H1L
Horizontal Phase 1, Last Gate
23
V2
Vertical Phase 2
11
N/C
No Connection
22
V1
Vertical Phase 1
12
SUB
Substrate
21
V1
Vertical Phase 1
13
H1
Horizontal Phase 1
20
SUB
Substrate
14
H1
Horizontal Phase 1
19
N/C
No Connection
15
H2
Horizontal Phase 2
18
N/C
No Connection
16
H2
Horizontal Phase 2
17
LODB
Lateral Overflow Drain Bottom
Note:
1. Wherever possible, all N/C pins (11, 18, 19, 25, 32) should be connected to GND (0V).
SUB
OG
RG
RD
RD
VSS
VOUT
VDD
SUB
H1L
N/C
SUB
H1
H1
H2
H2
N/C
LODT
V1
V2
V2
SUB
N/C
V2
V2
V1
V1
SUB
N/C
N/C
LODB
1
16
32
17
Pin 1 Indicator
V1
KAF-8300 Image Sensor
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Imaging Performance
TYPICAL OPERATIONAL CONDITIONS
Description
Condition - Unless otherwise noted
Notes
Readout Time (treadout)
370.36 msec
Includes tVoverclock & tHoverclock
Integration time (tint)
33 msec
Horizontal clock frequency
28 MHz
Light source (LED)
Red, green, blue, orange
Mode
Flush – integrate – readout cycle
SPECIFICATIONS
All Devices
Description
Symbol
Min.
Nom.
Max
Units
Notes
Verification Plan
Minimum Column
MinColumn
575
mV
1, 4
die18
Linear Saturation Signal
Ne-sat
25.5K
e-
1, 3, 4
design19
Charge to Voltage Conversion
Q-V
22.5
23
µV/e-
design19
Linearity Error
LeLow10
LeLow33
LeHigh
-10
-10
-10
10
10
10
%
%
%
2, 5, 6
2, 5 ,6
2, 5, 4
die18
die18
die18
Dark Signal (Active Area Pixels)
AA_DarkSig
200
e-/s
4, 8
die18
Dark Signal (Dark Reference
Pixels)
DR_DarkSig
200
e-/s
4, 8
die18
Readout Cycle Dark Signal
Dark_Read
15
mV/s
die18
Flush Cycle Dark Signal
Dark_Flush
43
90
mV/s
die18
Dark Signal Non-Uniformity
DSNU
DSNU_Step
DSNU_H
1.30
0.14
0.4
3
0.5
1.0
mVp-p
mV p-p
mVp-p
4, 9
4, 9
4, 9
die18
die18
die18
Dark Signal Doubling
Temperature
ΔT
5.8
°C
design19
Dark Reference Difference,
Active Area
DarkStep
-3.5
0.15
3.5
mV
4
die18
Total Noise
Dfld_noi
1.08
mV
4, 10
die18
Total Sensor Noise
N
16
e- rms
19
design19
Linear Dynamic Range
DR
64.4
dB
11
design19
Horizontal Charge Transfer
Efficiency
HCTE
0.999990
0.999995
4, 13, 21
die18
Vertical Charge Transfer
Efficiency
VCTE
0.99997
0.999999
%
4, 21
die18
Blooming Protection
X_b
1000
x Esat
14
design19
Vertical Bloom on Transfer
VBloomF
-20
20
mV
4
die18
Horizontal Crosstalk
H_Xtalk
-20
20
mV
4
die18
Horizontal Overclock Noise
Hoclk_noi
0
1.08
mV
4
die18
Output Amplifier Bandwidth
f-3dB
88
159
Mhz
4, 6, 16
die18
Output Impedance, Amplifier
ROUT
100
180
Ohms
6
die18
Hclk Feedthru
Vhft
70
mV
4, 17
die18
Reset Feedthru
Vrft
500
710
1000
mV
design19
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 15
Color Devices
Description
Symbol
Min.
Nom.
Max
Units
Notes
Verification Plan
Sensitivity
red
green
blue
Rresp
Gresp
Bresp
260
442
230
420
638
420
mV
mV
mV
die18
die18
die18
QE
R(600nm)
G(540nm)
B(480nm)
QE, red
QE green
QE, blue
33
40
33
%
design19
Off-band Response
Green inband
Red response
Blue response
Red inband
Green response
Blue response
Blue inband
Red response
Green response
Gr_Gresp
Gr_Rresp
Gr_Bresp
Rd_Rresp
Rd_Gresp
Rd_Bresp
Bl_Bresp
Bl_Rresp
Bl_Gresp
362
0
0
180
0
0
90
0
0
630
130
260
430
120
45
420
40
120
mV
mV
mV
mV
mV
mV
mV
mV
mV
die18
die18
die18
die18
die18
die18
die18
die18
die18
Linearity Balance
Red_Bal
Blu_Bal
-14
-8
6.4
0.2
14
8
%
%
2, 6
2, 6
die18
die18
Photo Response Non-Uniformity
R_PRNU
G_PRNU
B_PRNU
15
15
15
%p-p
%p-p
%p-p
7
7
7
die18
die18
die18
High Frequency Noise
R_Nois
GRr_Nois
GBr_Nois
B_Nois
2
2
2
2
%rms
%rms
%rms
%rms
die18
die18
die18
die18
Red-Green Hue Shift
RGHueUnif
10
%
12
die18
Blue-Green Hue Shift
BGHueUnif
12
%
12
die18
GRr/GBr Hue Uniformity
GrGbHueUnf
7
%
12
die18
Green Light GRr/GBr Hue
Uniformity
Gr_GHueUnf
9
%
die18
Low Hue Uniformity
RGLoHueUnf
BGLoHueUnf
12
10
%
%
die18
die18
Streak/Spot
GrnStreak
RedStreak
BluStreak
40
20
20
%
%
%
Local Green Difference
white light, min
white light, max
green light, min
green light, max
red light, min
red light, max
blue light, min
blue light, max
W_GNU_Min
W_GNU_Max
Gr_GNU_Min
Gr_GNU_Max
R_GNU_Min
R_GNU_Max
B_GNU_Min
B_GNU_Max
4
6
4
4
65
65
40
40
%
%
%
%
%
%
%
%
die18
die18
die18
die18
die18
die18
die18
die18
Chroma Test
UL_Chroma
UR_Chroma
LL_Chroma
LR_Chroma
7
7
7
7
%
%
%
%
die18
die18
die18
die18
Hue Test
UL_UR_Hue
UL_LR_Hue
UL_LL_Hue
UR_LR_Hue
UR_LL_Hue
LR_LL_Hue
6
6
6
6
6
6
%
%
%
%
%
%
die18
die18
die18
die18
die18
die18
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 16
Monochrome Versions Only
Description
Symbol
Min.
Nom.
Max
Units
Notes
Verification Plan
Sensitivity
Monochrome
Resp
465
655
mV
die18
QE
Microlens, clear glass (540 nm)
Microlens, no glass (540 nm)
Microlens, AR glass (540 nm)
No Microlens, clear glass (560 nm)
QE
54%
60%
56%
37%
%
design19
Notes:
1. Increasing output load currents to improve bandwidth will decrease these values.
2. Specified from 12 °C to 60 °C.
3. Saturation signal level achieved while meeting Le specification. Specified from 0 °C to 40 °C.
4. Operating temperature = 60 °C.
5. Worst case deviation, (from 10 mV to Vsat min), relative to a linear fit applied between 0 and 500 mV exposure.
6. Operating temperature = 25 °C.
7. Peak to peak non-uniformity test based on an average of 185 x 185 blocks.
8. Average non-illuminated signal with respect to over clocked horizontal register signal.
9. Absolute difference between the maximum and minimum average signal levels of 185 x 185 blocks within the sensor.
10. Dark rms deviation of a multi-sampled pixel as measured using the KAF-8300 Evaluation Board.
11. 20log(Vsat/N)
12. Gradual variations in hue (red with respect to green pixels and blue with respect to green pixels) in regions of interest of
185 x 185 blocks.
13. Measured per transfer at 80% of Vsat.
14. Esat equals the exposure required to achieve saturation. X_b represents the number of Esat exposures the sensor can
tolerate before failure. X_b characterized at 25 °C.
15. Video level DC offset with respect to ground at clamp position. Refer to Figure 16.
16. Last stage only. CLOAD = 10pF. Then f-3dB = ( 1 / (2p*ROUT*CLOAD) ).
17. Amount of artificial signal due to H1 coupling.
18. A parameter that is measured on every sensor during production testing.
19. A parameter that is quantified during the design verification activity.
20. Calculated value subtracting the noise contribution from the KAF-8300 Evaluation Board.
21. Process optimization has effectively eliminated vertical striations.
22. CTE = 1 - CTI. Where CTE is charge transfer efficiency and CTI is charge transfer inefficiency. CTI is the measured value.
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 17
Typical Performance Curves
Figure 6: Typical Quantum Efficiency, Color version
Figure 7: Typical Quantum Efficiency, all Monochrome versions
0%
5%
10%
15%
20%
25%
30%
35%
40%
45%
350 450 550 650 750 850 950 1050 1150
Absolute QE
Wavelength (nm)
KAF-8300 Quantum Efficiency
R B GRr GBr
0%
10%
20%
30%
40%
50%
60%
70%
350 450 550 650 750 850 950 1050 1150
Absolute QE
Wavelength (nm)
KAF-8300 Quantum Efficiency
No microlens, Clear Glass
microlens, Clear Glass
microlens, No Glass
microlens, MAR Glass
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 18
Figure 8: Typical Angular Response, Color version
Note:
1. The center location of the die is as shown. The effective optical shift is 6° center-to-edge, along the diagonal.
Figure 9: Typical Angular Response, Monochrome with microlens
Note:
1. The effective optical shift is 6° center-to-edge, along the diagonal.
KAF-8300 Angle Response - White Light
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-25 -20 -15 -10 -5 0 5 10 15 20 25
Angle
Normalized Response
Horizontal - White Light
Vertical - White Light
0
0.2
0.4
0.6
0.8
1
-30 -25 -20 -15 -10 -5 0 5 10 15 20 25 30
Normalized Response
Incident Angle (Deg)
KAF-8300 Vertical Angle Response - Green Light
Top
Center
Bottom
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 19
Defect Definitions
OPERATIONAL CONDITIONS
The Defect Specifications are measured using the following conditions:
Description
Test Condition
Notes
Integration time (tint)
33 msec
Unless otherwise noted
SPECIFICATIONS
All Devices
Description
Symbol
Definition
Threshold
Maximum
Number
Allowed
Notes
Point defect
BPnt33_7
Dark field, minor, short integration time
7.5 mV
800 total
Points allowed
for this group of
tests
3
Point defect
Bfld_Pnt_D
Dark point in an illuminated field
11%
3
Point defect
Bfld_Pnt_B
Bright point in an illuminated field
7%
3
Point defect
BPnt33_100
Dark field, major, short integration time
100 mV
3
Point defect
BPnt33_500
Dark field, major, short integration time
500 mV
0
3
Point defect
BPnt333_13
Dark field, minor, long integration time, tint=1/3 sec
13 mV
32,500
1, 3, 4
Point Defect
DR_BPnts
Bright point in the dark reference region
7.5 mV
0
5
Cluster defect
Total_Clst
A cluster is a group of 2 or more defective pixels that do not
exceed the perpendicular pattern defect.
---
6 total
3
Cluster defect
Dfld_Vperp
Dark field very long exposure bright cluster where 9 or
more adjacent point defects exist, very long integration
time, tint=1 sec
3.04 mV
0
3
Cluster Defect –
Perpendicular
Pattern Defect
Dfld_Perp
Bfld_Perp
Total_Perp
Three or more adjacent point defects in the same color
plane, along a row or column.
---
0
2, 3
Column defect,
illuminated
Bfld_Col_D
Bfld_Col_B
A column which deviates above or below neighboring
columns under illuminated conditions (>300mV signal)
greater than the threshold
1.5%
1.5%
0
3
Column defect,
darkfield
Dfld_Col2
Dfld_Col4
Lo_Col_B
Lo_Col_D
Lo_Col_B1
Lo_Col_D1
A column which deviates above or below neighboring
columns under non-illuminated or low light level conditions
(~10mV) greater than the threshold
1 mV
1 mV
1 mV
1 mV
1 mV
1 mV
0
3
3
5
5
5
5
Row Defect
Dfld_Row
Row defect if row average deviates above threshold
1 mV
0
3
LOD Bright Col,
dark
Dfld_LodCol
Defines functionality and uniform efficiency of LOD
structure
1.5 mV
0
3
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 20
Color Devices
Description
Symbol
Definition
Threshold
Maximum
Number Allowed
Streak Test, color
GrnStreak
RedStreak
BluStreak
Maximum defect density gradient allowed in a color bit plane.4
40%
20%
20%
0
Notes:
1. This parameter is only a quality metric and these points will not be considered for cluster and point criteria.
2. For the color version of this device, the green pixels in a red row (GR) are considered a different color plane than the green
pixels in a blue row (GB). For monochrome version the entire active area is treated as a single color plane.
3. Operating temperature = 60 °C.
4. As the gradient threshold is defined as 8.5 mV maximum across a 16 x 16 pixel region about each pixel.
5. Operating temperature = 25 °C.
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 21
Operation
Absolute Maximum Ratings
Description9
Symbol
Minimum
Maximum
Units
Notes
Diode Pin Voltages
Vdiode
-17.5
+17.5
V
1, 2
Gate Pin Voltages
Vgate1
-13.5
+13.5
V
1, 3
Overlapping Gate Voltages
V1-2
-13.5
+13.5
V
4
Non-overlapping Gate Voltages
Vg-g
-13.5
+13.5
V
5
V1, V2 – LOD Voltages
VVVL
-13.5
+13.5
V
6
Output Bias Current
Iout
-30
mA
7
LODT Diode Voltage
VLODT
-13.0
+13.0
V
8
LODB Diode Voltage
VLODB
-18.0
+18.0
V
8
Operating Temperature
TOP
-10
70
°C
10
Guaranteed Temperature of Performance
TSP
0
60
°C
11
Notes:
1. Referenced to pin SUB
2. Includes pins: RD, VDD, VSS, and VOUT.
3. Includes pins: V1, V2, H1, H1L, H2, RG, OG.
4. Voltage difference between overlapping gates. Includes: V1 to V2; H1, H1L to H2; H1L to OG; V1 to H2.
5. Voltage difference between non-overlapping gates. Includes: V1 to H1, H1L; V2, OG to H2.
6. Voltage difference between V1 and V2 gates and LODT, LODB diode.
7. Avoid shorting output pins to ground or any low impedance source during operation. Amplifier bandwidth increases at
higher currents and lower load capacitance at the expense of reduced gain (sensitivity). Operation at these values will
reduce MTF.
8. V1, H1, V2, H2, H1L, OG, and RD are tied to 0V.
9. Absolute maximum rating is defined as a level or condition that should not be exceeded at any time per the description. If
the level or condition is exceeded, the device will be degraded and may be damaged.
10. Noise performance will degrade at higher temperatures.
11. See section for Imaging Performance Specifications.
POWER-UP SEQUENCE
The sequence chosen to perform an initial power-up is not critical for device reliability. A coordinated sequence may
minimize noise and the following sequence is recommended:
1. Connect the ground pins (SUB).
2. Supply the appropriate biases and clocks to the remaining pins.
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 22
DC BIAS OPERATING CONDITIONS
Description
Symbol
Minimum
Nominal
Maximum
Units
Maximum DC
Current (mA)
Notes
Reset Drain
RD
11.3
11.5
11.7
V
IRD = 0.01
Output Amplifier Return
VSS
1.05
1.25
1.45
V
ISS = -3.0
Output Amplifier Supply
VDD
14.5
15.0
15.5
V
IOUT + ISS
Substrate
SUB
GND
V
-0.01
2
Output Gate
OG
-3
-2.8
-2.6
V
0.1
Lateral Drain
LODT, LODB
9.5
9.75
10.0
V
0.2
2
Video Output Current
IOUT
-3
-5
-8
mA
1
Notes:
1. An output load sink must be applied to VOUT to activate output amplifier – see Figure 4.
2. Maximum current expected up to saturation exposure (Esat).
AC OPERATING CONDITIONS
Clock Levels
Description
Symbol
Level
Minimum
Nominal
Maximum
Units
Effective
Capacitance
Notes
V1 Low Level
V1L
Low
-9.5
-9.25
-9.0
V
76 nF
1
V1 High Level
V1H
High
2.4
2.6
2.85
V
1
V2 Low Level
V2L
Low
-9.5
-9.25
-9.0
V
81 nF
1
V2 High Level
V2H
High
2.4
2.6
2.8
V
1
RG, H1, H2,
amplitude
RGamp
H1amp
H2amp
Amp
5.5
6.0
6.5
V
RG = 7 pF
H1 = 224 pF
H2 = 168 pF
1
H1L, amplitude
H1Lamp
Amp
7.5
8.0
8.5
V
7 pF
1
H1 Low Level
H1low
Low
-4.7
-4.5
-4.3
V
1
H1L Low Level
H1Llow
Low
-6.7
-6.5
-6.3
V
H2 Low Level
H2low
Low
-5.2
-5
-4.8
V
RG Low Level
RG low
Low
1.8
2.0
2.2
V
1
Note:
1. All pins draw less than 10 mA DC current. Capacitance values relative to SUB (substrate).
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 23
Clock Voltage Detail Characteristics
Description
Symbol
Min
Nom
Max
Units
Notes
V1 High-level variation
V1HH
-
0.50
1
V
High-level coupling
V2 High-level variation
V2HL
-
0.28
1
V
High-level coupling
V2 Low-level variation
V2LH
-
0.46
1
V
Low-level coupling
V1 Low-level variation
V1LL
-
0.14
1
V
Low-level coupling
V1-V2 Cross-over
V1CR
-2
-0.5
1
V
Referenced to ground
H1 High-level variation
H1HH
-
0.30
1
V
H1 High-level variation
H1HL
-
0.07
1
V
H1 Low-level variation
H1LH
-
0.16
1
V
H1 Low-level variation
H1LL
-
0.25
1
V
H2 High-level variation
H2HH
-
0.40
1
V
H2 High-level variation
H2HL
-
0.06
1
V
H2 Low-level variation
H2LH
-
0.10
1
V
H2 Low-level variation
H2LL
-
0.27
1
V
H1 – H2 Cross-over
H1CR1
-3
-1.23
0
V
Rising side of H1
H1 – H2 Cross-over
H1CR2
-3
-0.59
0
V
Falling side of H1
H1L High-level variation
H1LHH
-
0.64
1
V
H1L High-level variation
H1LHL
-
0.32
1
V
H1Llow-level variation
H1LLH
-
0.27
1
V
H1Llow-level variation
H1LLL
-
0.23
1
V
H1L – H2 Cross-over
H1LCR1
-1
-
-3
V
Rising side of H1L
RG High-level variation
RGHH
-
0.19
1
V
RG High-level variation
RGHL
-
0.20
1
V
RG Low-level variation
RGLH
-
0.11
1
V
RG Low-level variation
RGLL
-
0.30
1
V
Notes:
1. H1, H2 clock frequency: 28 MHz. The maximum and minimum values in this table are supplied for reference. The actual
clock levels were measured using the KAF-8300 Evaluation Board. Testing against the device performance specifications is
performed using the nominal values.
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 24
CAPACITANCE EQUIVALENT CIRCUIT
Figure 10: Equivalent Circuit Model
Note:
1. The external pin names are actual pins on this image sensor. See the pinout diagram (Figure 5) for more information.
2. The components shown in this schematic model do not correspond to actual components inside the image sensor.
Parameter
Value
(typical)
Units
CφV1
61
nF
CφV12
15
nF
CφV2
67
nF
CφH1
153
pF
CφH12
36
pF
CφH2
97
pF
CφH1L
7
pF
RH1LH1
52
Kohms
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 25
Timing
REQUIREMENTS AND CHARACTERISTICS
Description
Symbol
Minimum
Nominal
Maximum
Units
Notes
H1, H2 Clock Frequency
fH
28
MHz
1, 2
V1, V2 Clock Frequency
fV
125
kHz
2
Pixel Period (1 Count)
te
35.7
ns
2
H1, H2 Setup Time
tHS
1
µs
H1L – VOUT Delay
tHV
3
ns
RG – VOUT Delay
tRV
1
ns
Readout Time
treadout
340.2
ms
4, 5
Integration Time
tint
3, 4
Line Time
tline
132.2
ms
4
Flush Time
tflush
21.23
ms
6
Notes:
1. 50% duty cycle values.
2. CTE will degrade above the nominal frequency.
3. Integration time is user specified.
4. Longer times will degrade noise performance.
5. treadout = tline * 2574 lines.
6. See Figure 18 for a detailed description.
Clock Switching Characteristics
Description
Symbol
Min
Nom
Max
Units
Notes
V1 Rise Time
tV1r
-
0.26
1
µs
3
V2 Rise Time
tV2r
-
0.55
1
µs
3
V1 Fall Time
tV1f
-
0.43
1
µs
3
V2 Fall Time
tV2f
-
0.31
1
µs
3
V1 Pulse Width
tV1w
5.0
-
-
µs
4, 5
V2 Pulse Width
tV2w
3.0
-
-
µs
4, 5
H1 Rise Time
tH1r
-
9.0
10
ns
3
H2 Rise Time
tH2r
-
6.9
10
ns
3
H1 Fall Time
tH1f
-
5.8
10
ns
3
H2 Fall Time
tH2f
-
5.4
10
ns
3
H1 – H2 Pulse Width
tH1w, tH2w
14
18
22
ns
H1L Rise Time
tH1Lr
1.8
4
ns
3
H1L Fall Time
tH1Lf
2.5
4
ns
3
H1L Pulse Width
tH1Lw
14
19.0
22
ns
RG Rise Time
tRGr
-
2.0
4
ns
3
RG Fall Time
tRGf
-
2.2
4
ns
3
RG Pulse Width
tRGw
-
6.7
-
ns
2
Notes:
1. H1, H2 clock frequency: 28 MHz. The maximum and minimum values in this table are supplied for reference. The actual
clock timing was measured using the KAF-8300 Evaluation Board. Testing against the device performance specifications is
performed using the nominal values.
2. RG should be clocked continuously.
3. Relative to the pulse width (based on 50% of high/low levels).
4. CTE
5. Longer times will degrade noise performance.
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 26
EDGE ALIGNMENT
Figure 11: H1 and H2 Edge Alignment
Figure 12: H1L and H2 Edge Alignment
100%
90%
10%
0%
50%
H1
H2
H1CR1
H1CR2
tH1r tH2r
t
tH1f tH2f
H1LH H1LL H2LH H2LL
10%
0%
H1HL
H1HH
tH2w
H2HL
H2HH
tH1w
100%
90%
H2
H1
50%
H2
H1
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 27
FRAME TIMING
Figure 13: Frame Timing (minimum)
Frame Timing Detail
Figure 14: Frame Timing Edge Alignment
treadout
tint
H2
H1, H1L
Line 1 2 3 2573 2574
V1
V2
100%
90%
10%
0%
50%
V1HH
V2LH V1LL
tV2w
trtf
V1 V2 V2HL
V1CR
(referenced to ground)
tV1w
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 28
LINE TIMING
V1
V2
t line
tHS
H1, H1L
H2
RG
1
pixel count:
te
*** Lines 1 - 6, 19-26, and 2571 - 2574 are lines mostly composed of dark dummy pixels
and are not to be used for imaging purposes or as a dark reference.
27
11
12
13
14
43
44
45
46
3447
3448
47
3446
3444
3437
3438
3442
3443
3441
3391
3395
3397
3398
3396
3436
3390
3385
3370
3365
3366
3367
3369
3368
18
19
22
23
24
(8) Dummy Pixels
(1) CTE Monitor Pixels
(6) Dark Dummy Pixels
(39) Dark Pixels
(8) Dark Dummy Pixels
(16) Active Buffer Pixels
(3326) Active Pixels
(4) Blue Pixel Buffer
(5) Dark Dummy Pixels
(2) Dummy Pixels
(3) Dummy Pixels
(5) Dummy Pixels
(1) CTE Monitor Pixels
KAF-8300 has 2574 lines (rows) in a single frame.
Line shown above represents the device output for lines 1164-1411 only.
Quantity in grouping:
* Lines 7-18 are lines mostly composed of dark reference pixels.
** Lines 31 - 46 and 2555 - 2570 are lines mostly composed of photoactive buffer pixels.
5
4(4) Virtual Dummy Columns
For lines 1412 thru 2570 are as shown above with the following exception: pixel 13 are denoted as a dark
dummy pixels for these lines.
The device output for the other lines are detailed below:
3445
For lines 1 thru 1163 are as shown above with the following exception: pixel 13 are denoted as a test pixel, of
which all are dark dummy except for one photoactive pixel for which row location may vary.
test
(16) Active Buffer Pixels
28
(4) Blue Pixel Buffer
3386
3389
**** Lines 27 - 30 and 2551 - 2554 are lines mostly composed of blue photoactive buffer pixels.
Figure 15: Line Timing
Note:
1. Schematic reference regions that contain a blue filter represent the color version only; monochrome version is uncoated
for these pixels.
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 29
PIXEL TIMING
Figure 16: Pixel Timing
RG
VOUT
tRGw
RGlow
H1
RGamp
H1low
H1amp
te1
count
tRV
Vsat
Vodc
GND
tHV
Vrft
Vdark+Vhft
H2 H2low
H2amp
H1L H1Llow
H1Lamp
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 30
Pixel Timing Detail
Figure 17: Pixel Timing Detail
100%
90%
10%
0%
50%
RGHL RGHH
RGLL
RGLH
tRGw
tRGr tRGf
RG
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 31
Mode of Operation
POWER-UP FLUSH CYCLE
Figure 18: Power-up Flush Cycle
tVflush tint treadout
3448 (min)
2574+64 (min)
V2
H
2
V1
H1,H1L
te
KAF-8300 Image Sensor
www.truesenseimaging.com Revision 1.0 PS-0029 Pg 32
Storage and Handling
STORAGE CONDITIONS
Description
Symbol
Minimum
Maximum
Units
Notes
Storage
Temperature
TST
-20
80
°C
1
Humidity
RH
5
90
%
2
Notes:
1. Storage toward the maximum temperature will
accelerate color filter degradation.
2. T=25 °C. Excessive humidity will degrade MTTF.
ESD
1. This device contains limited protection against
Electrostatic Discharge (ESD). ESD events may
cause irreparable damage to a CCD image sensor
either immediately or well after the ESD event
occurred. Failure to protect the sensor from
electrostatic discharge may affect device
performance and reliability.
2. Devices should be handled in accordance with
strict ESD procedures for Class 0 (<250V per
JESD22 Human Body Model test), or Class A
(<200V JESD22 Machine Model test) devices.
Devices are shipped in static-safe containers and
should only be handled at static-safe
workstations.
3. See Application Note Image Sensor Handling Best
Practices for proper handling and grounding
procedures. This application note also contains
workplace recommendations to minimize
electrostatic discharge.
4. Store devices in containers made of electro-
conductive materials.
COVER GLASS CARE AND CLEANLINESS
1. The cover glass is highly susceptible to particles
and other contamination. Perform all assembly
operations in a clean environment.
2. Touching the cover glass must be avoided.
3. Improper cleaning of the cover glass may
damage these devices. Refer to Application Note
Image Sensor Handling Best Practices.
ENVIRONMENTAL EXPOSURE
1. Extremely bright light can potentially harm CCD
image sensors. Do not expose to strong sunlight
for long periods of time, as the color filters
and/or microlenses may become discolored. In
addition, long time exposures to a static high
contrast scene should be avoided. Localized
changes in response may occur from color
filter/microlens aging. For Interline devices, refer
to Application Note Using Interline CCD Image
Sensors in High Intensity Visible lighting
Conditions.
2. Exposure to temperatures exceeding maximum
specified levels should be avoided for storage
and operation, as device performance and
reliability may be affected.
3. Avoid sudden temperature changes.
4. Exposure to excessive humidity may affect
device characteristics and may alter device
performance and reliability, and therefore should
be avoided.
5. Avoid storage of the product in the presence of
dust or corrosive agents or gases, as
deterioration of lead solderability may occur. It is
advised that the solderability of the device leads
be assessed after an extended period of storage,
over one year.
SOLDERING RECOMMENDATIONS
1. The soldering iron tip temperature is not to
exceed 370 °C. Higher temperatures may alter
device performance and reliability.
2. Flow soldering method is not recommended.
Solder dipping can cause damage to the glass
and harm the imaging capability of the device.
Recommended method is by partial heating using
a grounded 30 W soldering iron. Heat each pin
for less than 2 seconds duration.
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Mechanical Information
VISUAL MECHANICAL SPECIFICATIONS
Laser Mark
Item
Description
Device Name
KAF-8300CE, KAF-8300XE, or KAF-8300-AXC.
(Multiple versions available) See ORDERING INFORMATION section of this document
Serial Number
nnn –a numeric field containing a maximum of three characters denoting a unique unit identifier for a device from the before
mentioned production lot. The start of the sequence starts with ‚1‛. ‚001‛ is not a valid marking.
All markings shall be readable, consistent in size with no unusual debris left on the package.
Assembly/Package Integrity
Criteria
Description
Cracks
None allowed
Corner and edge
chip-outs
None – exceeding 0.020‛ (0.50 mm)
Chip-outs exposing
buried metal traces
None allowed
Chip-outs, other
None allowed deeper than 50% of the ceramic layer thickness in which it resides
Scratches
None – that exceed 0.20‛ (0.50 mm) in the major dimension and are deeper than 50% of the ceramic layer thickness in which it
resides.
Lead conditions
No bent, missing, damaged, or short leads. No lead cut-off burrs exceeding 0.005‛ (0.13 mm) in the dimension away from the
lead.
Internal
Appearance And
Die Condition
Local Non-Uniformity: Local Non-Uniformity region (LNU) is allowed whose size is not greater than 200 um2 within the
effective image area. Inspection equipment for these steps are performed using a microscope 7-50X and direct lighting (ring-
light). LNU is described as a spot or streak that tends to change from light to dark in appearance as the operator rotates the
part under angled lighting conditions. These non-uniformities are not visible or very hard to see under direct lighting. They
tend to disappear or become much less visible under higher magnification.
Conditions Other than LNU: No scratches, digs, contamination, marks, or blemishes that is attached to the die that touches 9
or more pixels in the effective image area. No loose contamination allowed when viewed at 7X and 50X magnification. No
scratches, digs, contamination, marks, or blemishes greater than 10 μm are allowed on the bottom side of the cover glass
region that is contained in or extends into the effective image area. Tools used to verify are 7X and 50X magnification.
Glass
Criteria
Description
Tilt
The reject condition is when the glass is incorrectly seated on the package or is not parallel to glass seal area. (‚parallel‛ is
defined as 0.25 mm maximum end to end).
Seal
Glass seal must be greater than 50% of the width of the epoxy bond line and must not extend over the ceramic package.
Alignment
There are 4 ‚+‛ fiducials on the corners the die that must not be covered by the epoxy light shield. The 4 ‚+‛ marks must be in
total view when the lid is placed looking directly down on the device with a microscope. All 4 ‚+‛ alignment marks are required
to be visible in their entirety with a zero clearance tolerance.
Chips
None allowed.
Appearance
No fogged cover allowed.
Contamination
No immobile scratches, digs, contamination, marks, or blemishes are allowed on the cover glass region that is contained in or
extends into the effective image area. Within the effective image area, the limit for such conditions is 10um or less. This
criterion pertains to either the top or the bottom glass surface. Tools used to verify are 7X and 50X magnification.
KAF-8300 Image Sensor
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COMPLETED ASSEMBLY
Figure 19: Completed Assembly (1 of 2)
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Figure 20: Completed Assembly (2 of 2)
KAF-8300 Image Sensor
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COVER GLASS
Clear Cover Glass, AR Coated (both sides) - Specification
1. Scratch and dig: 10 micron max
2. Substrate material Schott D263T eco or equivalent
3. Multilayer anti-reflective coating
Wavelength
Total Reflectance
420-450
2%
450-630
1%
630-680
2%
Clear Cover Glass – Specification
1. Scratch and dig: 10 micron max
2. Substrate material Schott D263T eco or equivalent
Figure 21: Clear Cover Glass Transmission, Typical
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
300 350 400 450 500 550 600 650 700 750 800 850 900
Wavelength (nm)
Transmission (%)
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Quality Assurance and Reliability
QUALITY AND RELIABILITY
All image sensors conform to the specifications stated in this document. This is accomplished through a combination
of statistical process control and visual inspection and electrical testing at key points of the manufacturing process,
using industry standard methods. Information concerning the quality assurance and reliability testing procedures and
results are available from Truesense Imaging upon request. For further information refer to Application Note Quality
and Reliability.
REPLACEMENT
All devices are warranted against failure in accordance with the Terms of Sale. Devices that fail due to mechanical and
electrical damage caused by the customer will not be replaced.
LIABILITY OF THE SUPPLIER
A reject is defined as an image sensor that does not meet all of the specifications in this document upon receipt by the
customer. Product liability is limited to the cost of the defective item, as defined in the Terms of Sale.
LIABILITY OF THE CUSTOMER
Damage from mishandling (scratches or breakage), electrostatic discharge (ESD), or other electrical misuse of the
device beyond the stated operating or storage limits, which occurred after receipt of the sensor by the customer, shall
be the responsibility of the customer.
TEST DATA RETENTION
Image sensors shall have an identifying number traceable to a test data file. Test data shall be kept for a period of 2
years after date of delivery.
MECHANICAL
The device assembly drawing is provided as a reference.
Truesense Imaging reserves the right to change any information contained herein without notice. All information
furnished by Truesense Imaging is believed to be accurate.
Life Support Applications Policy
Truesense Imaging image sensors are not authorized for and should not be used within Life Support Systems without
the specific written consent of Truesense Imaging, Inc.
KAF-8300 Image Sensor
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©Truesense Imaging Inc., 2012. TRUESENSE is a registered trademark of Truesense Imaging, Inc.
Revision Changes
MTD/PS-0996
Revision Number
Description of Changes
1.0
Initial Release.
2.0
Add monochrome versions and the allowance of differentiating high volume packing.
3.0
Reference to Web Site noted on Ordering Information page. Added references to Application Note Image Sensor
Handling and Best Practices. Removed descriptions and drawings related to high level packing.
4.0
Corrected Active Image Size to 17.96mm x 13.52mm
5.0
Changed Sample Plan to Verification Plan. Added new revision of completed assembly drawing
5.1
Corrected units in table in Capacitance Equivalent Circuit section.
5.2
Corrected Evaluation Board Kit Name to KEK-4H0471-KAF- 8300-12-28
5.3
Changed cover glass material to D263T eco or equivalent
5.4
Changed units for H1, H2 Setup Time from ms to µs
PS-0029
Revision Number
Description of Changes
1.0
Initial release with new document number, updated branding and document template.
Updated Storage and Handling and Quality Assurance and Reliability sections.
Updated Imaging Performance tables.
