This is information on a product in full production.
January 2016 DocID027131 Rev 3 1/12
12
BALF-NRF01E3
50 Ω nominal input / conjugate match balun to nRF51822-QFAA
/AB/AC and nRF51422-QFAA/AB/AC with integrated filter
Datasheet production data
Features
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Coated CSP on glass
Small footprint: < 1.5 mm2
Benefits
Very low profile
High RF performance
PCB space saving versus discrete solution
BOM count reduction
Efficient manufacturability
Applications
2.45 GHz balun with integrated matching
network
Matching optimized for following chipsets:
nRF51822-QFAA/AB/AC and
nRF51422-QFAA/AB/AC (see Figure 19:
nRF51822 and nRF51422 compatibility
matrix).
Description
STMicroelectronics BALF-NRF01E3 is an
ultraminiature balun. The BALF-NRF01E3
integrates matching network in a monolithic glass
substrate. Matching impedance has been
customized for the nRF51822-QFAA/AB/AC and
nRF51422-QFAA/AB/AC RF transceivers.
It uses STMicroelectronics IPD technology on
non-conductive glass substrate which optimizes
RF performance.
Figure 1. Pinout diagram (bottom view)
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Characteristics BALF-NRF01E3
2/12 DocID027131 Rev 3
1 Characteristics
Table 1. Absolute maximum ratings (limiting values)
Symbol Parameter Value Unit
Min. Typ. Max.
PIN Input power RFIN -20dBm
VESD
ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 k Ω, air discharge) 2000 -
VESD ratings charge device model (JESD22-C101-C) 500 -
ESD ratings machine model (MM: C = 200 pF, R = 25 Ω, L = 500 nH) 500 -
TOP Operating temperature -40 - +105 °C
Table 2. Electrical characteristics (Tamb = 25 °C)
Symbol Parameter Value Unit
Min. Typ. Max.
ZOUT Nominal differential output impedance
Conjugate match to:
– nRF51822-QFAA/AB/AC
– nRF51422-QFAA/AB/AC
Ω
ZIN Nominal input impedance 50 Ω
F Frequency range (bandwidth) 2400 2540 MHz
ILInsertion loss in bandwidth 2.2 2.7 dB
RL Return loss in band 14 15 dB
imb Phase imbalance -10 4 10 °
Aimb Amplitude imbalance -1 0.3 1 dB
2f0 (4800-5080 MHz) 15.8 16.3 dB
3f0 (7200-7620 MHz) 22.7 24.1 dB
DocID027131 Rev 3 3/12
BALF-NRF01E3 Characteristics
1.1 RF performance (Tamb = 25 °C)
Figure 2. Wide band fre quency response Figure 3. Insertion loss
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Figure 6. Return loss on SE port Figure 7. Conducted measurement
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Application information BALF-NRF01E3
4/12 DocID027131 Rev 3
2 Application information
Figure 8. Application schematic
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DocID027131 Rev 3 5/12
BALF-NRF01E3 Package information
3 Package information
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
3.1 LGA package information
Figure 9. LGA package outline
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Package information BALF-NRF01E3
6/12 DocID027131 Rev 3
Figure 10. PCB layout recommendation
Table 3. LGA package mechanical data
Dim. mm
Min. Typ. Max.
L 1.40 1.50 1.60
W 0.90 1.00 1.10
T 0.42 0.45 0.48
a 0.18 0.20 0.20
b 0.18 0.20 0.20
c 0.38 0.40 0.42
d 0.28 0.30 0.32
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DocID027131 Rev 3 7/12
BALF-NRF01E3 Package information
Figure 11. Solder-mask recommendation
Solder paste
100 µm solder stencil thickness is recommended.
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
“No Clean” solder paste is recommended.
Offers a high tack force to resist component movement during high speed.
Solder paste with fine particles: powder particle size is 20-45 µm.
Placement
Manual positioning is not recommended.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
Standard tolerance of ±0.05 mm is recommended.
3.5 N placement force is recommended. Too much placement force can lead to
squeeze out solder paste and cause solder joints to short. Too low placement force can
lead to insufficient contact between package and solder paste that could cause open
solder joints or badly centered packages.
To improve the package placement accuracy, a bottom side optical control should be
performed with high resolution.
For assembly, a strong PCB support is recommended (especially on low thickness
PCB) during solder paste printing, pick and place and reflow soldering by using
optimized tools.
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Package information BALF-NRF01E3
8/12 DocID027131 Rev 3
Figure 14. Tape and reel specifications
Note: More information is available in the STMicroelectronics technical note:
TN11 97 : “IPAD™, CSPG w/o bu m p: package descr ipt ion an d re comm e nd at ion s for use ”.
Figure 12. Marking Figure 13. Pad bottom view
Ta bl e 4. Pad as signment details
LGA Name Description
6 NC Not connected
5 VCC Common collector voltage
4 BAL+ Balun positive output
3 BAL- Balun negative output
2 GND Ground
1 ANT Antenna connection
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DocID027131 Rev 3 9/12
BALF-NRF01E3 Package information
Figure 15. Footprint - 3 mils stencil - non solder
mask defined Figure 16. Footprint - 3 mils stencil - solder
mask defined
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Package information BALF-NRF01E3
10/12 DocID027131 Rev 3
Figure 19. nRF51822 and nRF51422 compatibility matrix
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DocID027131 Rev 3 11/12
BALF-NRF01E3 Ordering information
4 Ordering information
Figure 20. Ordering information scheme
5 Revision history
Table 5. Ordering information
Order code Marking Package Weight Base Qty Delivery mode
BALF-NRF01E3 SYN LGA 1.324 mg 5000 Tape and Reel(7”)
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Table 6. Document revision history
Date Revision Changes
28-Nov-2014 1 Initial release.
07-Jul-2015 2 Updated Table 1.
22-Jan-2016 3
Updated document title and cover page.
Updated Table 2 and Figure 8 and Figure 20.
Added Figure 19.
Format updated to current standard.
BALF-NRF01E3
12/12 DocID027131 Rev 3
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