Features
High current transfer ratio – 2000% typical (4500 %
typical for HCNW139/138)
Low input current requirements – 0.5 mA
TTL compatible output – 0.1 V VOL typical
Performance guaranteed over temperature 0°C
to 70°C
Base access allows gain bandwidth adjustment
High output current – 60 mA
Safetyapproval
UL recognized – 3750 V rms for 1 minute and 5000 V
rms* for 1 minute per UL 1577
CSA approved
IEC/EN/DIN EN 60747-5-2 approved with VIORM = 1414
V
peak for HCNW139 and HCNW138
Available in 8-Pin DIP or SOIC-8 footprint or widebody
package
MIL-PRF-38534 hermetic version available
(HCPL-5700/1)
Applications
Ground isolate most logic families – TTL/TTL, CMOS/
TTL, CMOS/CMOS, LSTTL/TTL, CMOS/LSTTL
Low input current line receiver
High voltage insulation (HCNW139/138)
EIA RS-232C line receiver
Telephone ring detector
117 V ac line voltage status indicator – low input
power dissipation
Low power systems – ground isolation
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
*5000 V rms/1 minute rating is for HCNW139/138 and Option 020
(6N139/138) products only.
A 0.1 μF bypass capacitor connected between pins 8 and 5 is
recommended.
6N139, 6N138, HCPL-0701, HCPL-0700,
HCNW138, HCNW139
Low Input Current, High Gain Optocouplers
Data Sheet
Description
These high gain series couplers use a Light Emitting
Diode and an integrated high gain photodetec tor to
provide extremely high current transfer ratio between
input and output. Separate pins for the photodiode
and output stage result in TTL compatible saturation
voltages and high speed operation. Where desired the
VCC and VO terminals may be tied together to achieve
conven tional photodarlington operation. A base
access terminal allows a gain bandwidth adjustment to
be made.
The 6N139, HCPL-0701, and CNW139 are for use in CMOS,
LSTTL or other low power appli ca tions. A 400% mini-
mum current transfer ratio is guaranteed over 0 to 70°C
operating range for only 0.5 mA of LED current.
The 6N138, HCPL-0700, and HCNW138 are designed for
use mainly in TTL applications. Current Transfer Ratio
(CTR) is 300% minimum over 0 to 70°C for an LED current
of 1.6 mA (1 TTL Unit load ). A 300% minimum CTR
enables operation with 1 TTL Load using a 2.2 kΩ
pull-up resistor.
Functional Diagram
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
7
1
2
3
45
6
8
NC
ANODE
CATHODE
NC
VCC
VO
GND
TRUTH TABLE
LED
ON
OFF
VO
LOW
HIGH
VB
2
Selection for lower input current down to 250 μA is
available upon request.
The HCPL-0701 and HCPL-0700 are surface mount devices
packaged in an industry standard SOIC-8 footprint.
The SOIC-8 does not require “through holes” in a PCB.
This package occupies approximately one-third the
footprint area of the standard dual-in-line package. The
lead pro le is designed to be compatible with standard
surface mount processes.
The HCNW139 and HCNW138 are packaged in a
widebody encapsulation that provides creep age and
clearance dimensions suitable for safety approval by
regulatory agencies worldwide.
Selection Guide
Widebody
8-Pin DIP Package Hermetic
(300 Mil) Small Outline SO-8 (400 mil) Single and
Dual Single Dual Minimum Absolute Dual
Single Channel Channel Channel Single Input ON Maxi- Channel
Channel Package Package Package Channel Current Minimum mum Packages
Package HCPL- HCPL- HCPL- Package (IF) CTR V
CC HCPL-
6N139 2731[1] 0701 0731 HCNW139 0.5 mA 400% 18 V
6N138 2730[1] 0700 0730 HCNW138 1.6 mA 300% 7 V
HCPL-4701[1] 4731[1] 070A[1] 073A[1] 40 μA 800% 18 V
0.5 mA 300% 20 V 5701[1]
5700[1]
5731[1]
5730[1]
Note:
1. Technical data are on separate Avago publications.
3
Schematic
Ordering Information
6N138, 6N139, HCPL-0700 and HCPL-0701 are UL Recognized with 3750 Vrms for 1 minute per UL1577 and are ap-
proved under CSA Component Acceptance Notice #5, File CA 88324.
Part
Number
Option
Package
Surface
Mount
Gull
Wing
Tape
& Reel
UL 5000 Vrms/
1 Minute
rating
IEC/EN/DIN
EN 60747-5-2 Quantity
RoHS
Compliant
non RoHS
Compliant
6N138
6N139
-000E no option
300 mil
DIP-8
50 per tube
-300E #300 X X 50 per tube
-500E #500 X X X 1000 per reel
-020E #020 X 50 per tube
-320E #320 X X X 50 per tube
-520E #520 X X X X 1000 per reel
-060E #060 X 50 per tube
-360E #360 X X X 50 per tube
-560E #560 X X X X 1000 per reel
HCPL-0700
HCPL-0701
-000E no option
SO-8
X 100 per tube
-500E #500 X X 1500 per reel
-060E #060 X X 100 per tube
-560E #560 X X X 1500 per reel
HCNW138
HCNW139
-000E no option 400 mil
Widebody
DIP-8
42 per tube
-300E #300 X X 42 per tube
-500E #500 X X X 750 per reel
To order, choose a part number from the part number
column and combine with the desired option from
the option column to form an order entry.
Example 1:
6N138-560E to order product of 300 mil DIP Gull Wing
Surface Mount package in Tape and Reel packaging
with IEC/EN/DIN EN 60747-5-2 Safety Approval and
RoHS compliant.
Example 2:
HCPL-0700 to order product of 300 mil DIP package in
Tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales
representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing
products, while (new) products launched since July 15,
2001 and RoHS compliant will use ‘–XXXE.’
IF
8
VCC
2
3
ICC
VF
ANODE
CATHODE
+
–
VB
IB
6
5GND
VO
IO
7
SHIELD
4
Package Outline Drawings
8-Pin DIP Package (6N139/6N138)**
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138)
**JEDEC Registered Data.
1.080 ± 0.320
(0.043 ± 0.013) 2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
5° TYP. 0.254 + 0.076
- 0.051
(0.010+ 0.003)
- 0.002)
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
A XXXXZ
YYWW
DATE CODE
DIMENSIONS IN MILLIMETERS AND (INCHES).
5678
4321
OPTION CODE*
UL
RECOGNITION
UR
TYPE NUMBER
* MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
3.56 ± 0.13
(0.140 ± 0.005)
0.635 ± 0.25
(0.025 ± 0.010) 12° NOM.
9.65 ± 0.25
(0.380 ± 0.010)
0.635 ± 0.130
(0.025 ± 0.005)
7.62 ± 0.25
(0.300 ± 0.010)
5
6
7
8
4
3
2
1
9.65 ± 0.25
(0.380 ± 0.010)
6.350 ± 0.25
(0.250 ± 0.010)
1.016 (0.040)
1.27 (0.050)
10.9 (0.430)
2.0 (0.080)
LAND PATTERN RECOMMENDATION
1.080 ± 0.320
(0.043 ± 0.013)
3.56 ± 0.13
(0.140 ± 0.005)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.254 + 0.076
- 0.051
(0.010+ 0.003)
- 0.002)
5
Small Outline SO-8 Package (HCPL-0701/HCPL-0700)
8-Pin Widebody DIP Package (HCNW139/HCNW138)
7.49 (0.295)
1.9 (0.075)
0.64 (0.025)
LAND PATTERN RECOMMENDATION
XXX
YWW
8765
4321
5.994 ± 0.203
(0.236 ± 0.008)
3.937 ± 0.127
(0.155 ± 0.005)
0.406 ± 0.076
(0.016 ± 0.003) 1.270
(0.050) BSC
5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005) 1.524
(0.060)
45° X 0.432
(0.017)
0.228 ± 0.025
(0.009 ± 0.001)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
0.305
(0.012) MIN.
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
0.203 ± 0.102
(0.008 ± 0.004)
7°
PIN ONE
0 ~ 7°
*
*
5
6
7
8
4
3
2
1
11.23 ± 0.15
(0.442 ± 0.006)
1.80 ± 0.15
(0.071 ± 0.006)
5.10
(0.201)MAX.
1.55
(0.061)
MAX.
2.54 (0.100)
TYP.
DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
7° TYP.
0.254 + 0.076
- 0.0051
(0.010+ 0.003)
- 0.002)
11.00
(0.433)
9.00 ± 0.15
(0.354 ± 0.006)
MAX.
10.16 (0.400)
TYP.
A
HCNWXXXX
YYWW
DATE CODE
TYPE NUMBER
0.51 (0.021) MIN.
0.40 (0.016)
0.56 (0.022)
3.10 (0.122)
3.90 (0.154)
6
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)
Solder Re ow Temperature Pro le
0
TIME (SECONDS)
TEMPERATURE (°C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160 °C
140 °C
150 °C
PEAK
TEMP.
245 °C
PEAK
TEMP.
240 °CPEAK
TEMP.
230 °C
SOLDERING
TIME
200 °C
PREHEATING TIME
150 °C, 90 + 30 SEC.
2.5 C ± 0.5 °C/SEC.
3 °C + 1 °C/–0.5 °C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
NOTE: NON-HALIDE FLUX SHOULD BE USED.
1.00 ± 0.15
(0.039 ± 0.006)
7° NOM.
12.30 ± 0.30
(0.484 ± 0.012)
0.75 ± 0.25
(0.030 ± 0.010)
11.00
(0.433)
5
6
7
8
4
3
2
1
11.23 ± 0.15
(0.442 ± 0.006)
9.00 ± 0.15
(0.354 ± 0.006)
1.3
(0.051)
13.56
(0.534)
2.29
(0.09)
LAND PATTERN RECOMMENDATION
1.80 ± 0.15
(0.071 ± 0.006)
4.00
(0.158)MAX.
1.55
(0.061)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.254 + 0.076
- 0.0051
(0.010+ 0.003)
- 0.002)
MAX.
7
Regulatory Information
The 6N139/138, HCNW139/138, and HCPL-0701/0700 have been approved by the following organizations:
IEC/EN/DIN EN 60747-5-2
Approved under
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
(HCNW139/138 only)
Recommended Pb-Free IR Pro le
Insulation and Safety Related Speci cations
8-Pin DIP Widebody
(300 Mil) SO-8 (400 Mil)
Parameter Symbol Value Value Value Units Conditions
Minimum External L(101) 7.1 4.9 9.6 mm Measured from input terminals
Air Gap (External to output terminals, shortest
Clearance) distance through air.
Minimum External L(102) 7.4 4.8 10.0 mm Measured from input terminals
Tracking (External to output terminals, shortest
Creepage) distance path along body.
Minimum Internal 0.08 0.08 1.0 mm Through insulation distance,
Plastic Gap conductor to conductor, usually
(Internal Clearance) the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
Minimum Internal NA NA 4.0 mm Measured from input terminals
Tracking (Internal to output terminals, along
Creepage) internal cavity.
Tracking Resistance CTI 200 200 200 Volts DIN IEC 112/VDE 0303 Part 1
(Comparative
Tracking Index)
Isolation Group IIIa IIIa IIIa Material Group
(DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classi cation is Class A in accordance with CECC 00802.
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
217 °C
RAMP-DOWN
6 °C/SEC. MAX.
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
* 260 +0/-5 °C
t 25 °C to PEAK
60 to 150 SEC.
15 SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
tp
ts
PREHEAT
60 to 180 SEC.
tL
TL
Tsmax
Tsmin
25
Tp
TIME
TEMPERATURE
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 °C, Tsmin = 150 °C
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE FOR
WIDEBODY 400mils PACKAGE IS 245 °C
8
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCNW139 and HCNW138)
Description Symbol Characteristic Units
Installation Classi cation per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤600 V rms I-IV
for rated mains voltage ≤1000 V rms I-III
Climatic Classi cation 55/100/21
Pollution Degree (DIN VDE 0110/1.89) 2
Maximum Working Insulation Voltage VIORM 1414 Vpeak
Input to Output Test Voltage, Method b*
V
PR = 1.875 x VIORM, 100% Production Test with tP = 1 sec, VPR 2652 Vpeak
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
V
PR = 1.5 x VIORM, Type and Sample Test, VPR 2121 Vpeak
t
P = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec) VIOTM 8000 Vpeak
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 11, Thermal Derating curve.)
Case Temperature TS 175 °C
Current (Input Current IF, PS = 0) IS,INPUT 400 mA
Output Power PS,OUTPUT 700 mW
Insulation Resistance at TS, VIO = 500 V RS > 109
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 60747-5-2, for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in applica-
tion.
9
Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Power Supply Voltage VCC 4.5 18 V
Forward Input Current (ON) IF(ON) 0.5 12.0 mA
Forward Input Voltage (OFF) VF(OFF) 0 0.8 V
Operating Temperature TA 0 70 °C
Absolute Maximum Ratings* (No Derating Required up to 85°C)
Parameter Symbol Min. Max. Units
Storage Temperature TS -55 125 °C
Operating Temperature** TA -40 85 °C
Average Forward Input Current IF(AVG) 20 mA
Peak Forward Input Current IFPK 40 mA
(50% Duty Cycle, 1 ms Pulse Width)
Peak Transient Input Current IF(TRAN) 1.0 A
(<1 μs Pulse Width, 300 pps)
Reverse Input Voltage VR 5 V
HCNW139/138 3 V
Input Power Dissipation PI 35 mW
Output Current (Pin 6) IO 60 mA
Emitter Base Reverse Voltage (Pin 5-7) VEB 0.5 V
Supply Voltage and Output Voltage VCC -0.5 18 V
(6N139, HCPL-0701, HCNW139)
Supply Voltage and Output Voltage VCC -0.5 7 V
(6N138, HCPL-0700, HCNW138)
Output Power Dissipation PO 100 mW
Total Power Dissipation PT 135 mW
Lead Solder Temperature (for Through Hole Devices) 260°C for 10 sec., 1.6 mm below seating plane
HCNW139/138 260°C for 10 sec., up to seating plane
Re ow Temperature Pro le See Package Outline Drawings section
(for SOIC-8 and Option #300)
*JEDEC Registered Data for 6N139 and 6N138.
**0°C to 70°C on JEDEC Registration.
10
Electrical Speci cations
0°C ≤ TA ≤ 70°C, 4.5 V ≤ VCC ≤ 18 V, 0.5 mA ≤ IF(ON) ≤ 12 mA, 0 V ≤ VF(OFF) ≤ 0.8 V, unless otherwise speci ed.
All Typicals at TA = 25°C. See Note 7.
Parameter Sym. Device Min. Typ.** Max. Units Test Conditions Fig. Note
Current Transfer CTR 6N139 400* 2000 5000 % IF = 0.5 mA VCC = 4.5 2, 3 1, 2,
Ratio HCPL-0701 VO = 0.4 V 4
HCNW139 400 4500
6N139 500* 1600 2600 IF = 1.6 mA
HCPL-0701
HCNW139 500 3000
300 1600 IF = 5.0 mA
200 850 IF = 12 mA
6N138 300* 1600 2600 IF = 1.6 mA
HCPL-0700
HCNW138 1500
Logic Low Output VOL 6N139 0.1 0.4 V IF = 0.5 mA, VCC = 4.5 1 2
Voltage HCPL-0701 IO = 2 mA
HCNW139
I
F = 1.6 mA,
I
O = 8 mA
I
F = 5.0 mA,
I
O = 15 mA
0.2 IF = 12 mA,
I
O = 24 mA
6N138 0.1 IF = 1.6 mA,
HCPL-0700 IO = 4.8 mA
HCNW138
Logic High IOH 6N139 0.05 100 μA VO = VCC = 18 V IF = 0 mA 2
Output Current HCPL-0701
HCNW139
6N138 0.1 250 VO = VCC = 7 V
HCPL-0700
HCNW138
Logic Low Supply ICCL 6N138/139 0.4 1.5 mA IF = 1.6 mA, VO = Open, 10 2
Current HCPL-0701/ VCC = 18 V
0700
HCNW139 0.5 2
HCNW138
Logic High ICCH 6N138/139 0.01 10 μA IF = 0 mA, VO = Open, 2
Supply Current HCPL-0701/ VCC = 18 V
0700
HCNW139 1
HCNW138
Input Forward VF 6N138 1.25 1.40 1.7* V TA = 25°C IF = 1.6 mA 4, 8
Voltage 6N139
HCPL-0701 1.75
HCPL-0700
HCNW139 1.0 1.45 1.85 TA = 25°C
HCNW138
0.95 1.95
Input Reverse BVR 5.0* V IR = 10 μA, TA = 25°C
HCNW139 3.0 IR = 100 μA, TA = 25°C
HCNW138
Temperature ΔVF -1.8 mV/°C IF = 1.6 mA 8
Coe cient of ΔTA
Forward Voltage
Input CIN 60 pF f = 1 MHz, VF = 0 V
Capacitance HCNW139 90
HCNW138
* JEDEC Registered Data for 6N139 and 6N138.
**All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.
Breakdown Voltage
11
Switching Speci cations (AC)
Over recommended operating conditions (TA = 0 to 70°C), VCC = 5 V, unless otherwise speci ed.
Parameter Sym. Device Min. Typ.** Max. Units Test Conditions Fig. Note
T
A =25°C
Propagation tPHL 6N139 5 25* 30 s IF = 0.5 mA, 5, 6, 2, 4
Delay Time HCPL-0701 Rl = 4.7 k 7, 9,
to Logic Low HCNW139 12
6N139 0.2 1* 2 s IF = 12 mA,
HCPL-0701 Rl = 270
HCNW139 11
6N138 1.6 10* 15 s IF = 1.6 mA,
HCPL-0700 Rl = 2.2 k
HCNW138 11
Propagation tPLH 6N139 18 60* 90 s IF = 0.5 mA, 5, 6, 2, 4
Delay Time HCPL-0701 Rl = 4.7 k 7, 9,
to Logic High HCNW139 115 12
6N139 2 7* 10 s IF = 12 mA,
HCPL-0701 Rl = 270
HCNW139 11
6N138 10 35* 50 s IF = 1.6 mA,
HCPL-0700 Rl = 2.2 k
HCNW138 70
Common Mode |CMH| 1000 10000 V/s IF = 0 mA, 13 5, 6
Transient TA = 25°C
Immunity at Rl = 2.2 k
Logic High |VCM| = 10
Output Vp-p
Common Mode |CML| 1000 10000 V/s IF = 1.6 mA, 13 5, 6
Transient TA = 25°C
Immunity at Rl = 2.2 k
Logic Low |VCM| = 10
Output Vp-p
* JEDEC Registered Data for 6N139 and 6N138.
**All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.
at Output
at Output
12
Notes:
1. DC CURRENT TRANSFER RATIO (CTR) is de ned as the ratio of output collector current, IO, to the forward LED input current, IF, times 100%.
2. Pin 7 Open.
3. Device considered a two-terminal device. Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together.
4. Use of a resistor between pin 5 and 7 will decrease gain and delay time. Signi cant reduction in overall gain can occur when using resistor values
below 47 k. For more information, please contact your local Avago Components representative.
5. Common mode transient immunity in a Logic High level is the maximum toler able (positive) dVCM/dt of the common mode pulse, VCM, to assure
that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable
(negative) dVCM/dt of the common mode pulse, VCM, to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V).
6. In applications where dV/dt may exceed 50,000 V/μs (such as static discharge) a series resistor, RCC, should be included to protect the
detector IC from destructively high surge currents. The recommended value is RCC = 220 .
7. Use of a 0.1 F bypass capacitor connected between pins 8 and 5 adjacent to the device is recommended.
8. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage 4500 V rms for 1 second (leakage detection
current limit, II-O < 5 A). This test is per formed before the 100% production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation Related Char-
acteristics Table, if applicable.
9. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000 V rms for 1 second (leakage detection
current limit, II-O < 5 A). This test is per formed before the 100% production test for partial discharge (method b) shown in the IEC/EN/DIN EN
60747-5-2 Insulation Related Characteristics Table, if applicable.
Package Characteristics
Parameter Sym. Min. Typ.** Max. Units Test Conditions Fig. Note
Input-Output Momentary
Withstand Voltage†
VISO 3750 V rms RH < 50%, t = 1 min.,
TA = 25°C
3, 8
Option 020
HCNW139
HCNW138
5000 3, 9
Resistance (Input-Output) RI-O 1012 VI-O = 500 Vdc
RH < 45%
3
Capacitance (Input-Output) CI-O 0.6 pF f = 1 MHz 3
**All typicals at TA = 25°C, unless otherwise noted.
†The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating.
For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table (if applicable), your equipment level safety
speci cation or Avago Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.”
13
01.02.0
VO – OUTPUT VOLTAGE – V
IO – OUTPUT CURRENT – mA
50
25
0
5.0 mA
T
A = 25° C
VCC = 5 V
4.5 mA
4.0 mA
3.5 mA
3.0 mA
2.5 mA
2.0 mA
1.5 mA
1.0 mA
0.5 mA
IF – FORWARD CURRENT – mA
2000
1600
800
400
0.1 1.0
CTR – CURRENT TRANSFER RATIO – %
10
1200
0
VCC = 5 V
VO
= 0.4 V
85°C
70°C
25°C
70°C
-40°C
IF – INPUT DIODE FORWARD CURRENT – mA
0.01
0.01 0.1 10
IO – OUTPUT CURRENT – mA
0.1
1.0
10
100
TA = 25° C
TA = 0° C
TA = 70° C
TA = 85° C
TA = -40° C
1
VF – FORWARD VOLTAGE – V
100
10
0.1
0.01
1.11.2 1.31.4
IF – FORWARD CURRENT – mA
1.61.5
1.0
0.001
1000
–
V
F
+
TA = 25°C
TA = 0°C
IF
TA = 85°C
TA = 70°C
TA = -40°C
40
35
30
25
20
10
-60 -20 20 40 100
tP – PROPAGATION DELAY – μs
TA – TEMPERATURE – °C
5
60 80
0
-40
0
IF = 0.5 mA
RL = 4.7 kΩ
1/f = 50 μs
15
tPLH
tPHL
24
21
18
15
12
6
-60 -20 20 40 100
tP – PROPAGATION DELAY – μs
TA – TEMPERATURE – °C
3
60 80
0
-40
0
IF = 1.6 mA
RL = 2.2 kΩ
1/f = 50 μs
9
tPLH
tPHL
4
3
2
1
-60 -20 20 40 100
tP – PROPAGATION DELAY – μs
TA – TEMPERATURE – °C
60 80
0
-40
0
IF = 12 mA
RL = 270 kΩ
1/f = 50 μstPLH
tPHL
1.6
1.5
1.4
1.3
-60 -20 20 40 100
VF – FORWARD VOLTAGE – V
TA – TEMPERATURE – °C
60 80
0
-40
1.2
IF = 1.6 mA
RL – LOAD RESISTANCE – kΩ
100
0.1 1.0
TIME – μs
10
10
1
IF – ADJUSTED FOR VOL = 2 V
TA = 25° C tf
tr
Figure 1. 6N138/6N139 DC transfer character-
istics
Figure 6. Propagation delay vs. temperatureFigure 5. Propagation delay vs. temperature
Figure 2. Current transfer ratio vs. forward
current 6N138/6N139
Figure 3. 6N138/6N139 output current vs. input
diode forward current
Figure 4. Input diode forward current vs.
forward voltage
Figure 7. Propagation delay vs. temperature Figure 8. Forward voltage vs. temperature Figure 9. Nonsaturated rise and fall times vs.
load resistance
VO
PULSE
GEN.
Z = 50 Ω
t = 5 ns
O
r
I MONITOR
F
IF
0.1 μF
L
R
CL = 15 pF*
RM
0
tPHL tPLH
O
V
IF
OL
V
1.5 V 1.5 V
5 V
+5 V
7
1
2
3
45
6
8
10% DUTY CYCLE
I/f < 100 μs
(SATURATED
RESPONSE)
tftr
O
V
(NON-SATURATED
RESPONSE)
5 V
90%
10%
90%
10%
* INCLUDES PROBE AND
FIXTURE CAPACITANCE
VO
IF
L
R
A
B
PULSE GEN.
VCM
+
VFF
O
V
OL
V
O
V
0 V 10%
90% 90%
10%
SWITCH AT A: I = 0 mA
F
SWITCH AT B: I = 1.6 mA
F
CM
V
trtf
5 V
+5 V
–
7
1
2
3
45
6
8
RCC (SEE NOTE 6)
10 V tr, tf = 16 ns
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0543EN
AV02-1359EN - July 27, 2012
Figure 12. Switching test circuit
Figure 11. Thermal derating curve, dependence of safety limiting value
with case temperature per IEC/EN/DIN EN 60747-5-2
Figure 10. Logic low supply current vs. forward current
Figure 13. Test circuit for transient immunity and typical waveforms
0.8
0.6
0.4
0.2
04 810 16
ICCL – LOGIC LOW SUPPLY CURRENT – mA
IF – FORWARD CURRENT
12 14
6
2
0
VCC = 18 V
0.1
0.3
0.5
0.7
VCC = 5 V
OUTPUT POWER – PS, INPUT CURRENT – IS
0
0
TS – CASE TEMPERATURE – °C
175
1000
50
400
12525 75 100 150
600
800
200
100
300
500
700
900 PS (mW)
IS (mA)
WIDEBODY
