Rev. 1.00 1 June 30, 2003
HT36A3
8-Bit Music Synthesizer MCU
Block Diagram
Features
·Operating voltage: 2.4V~5.0V
·Operating frequency: 3.58MHz~12MHz (typ. 8MHz)
·20 bidirectional I/O lines
·Two 8-bit programmable timer with 8 stage prescaler
·Watchdog Timer
·Built-in 8-bit MCU with 208´8 bits RAM
·Built-in 32K´16-bit ROM for program/data shared
·Mono output
·High D/A converter resolution: 16 bits
·Polyphonic up to 8 notes
·Independent pan and volume mix can be assigned to
each sound component
·Sampling rate of 25kHz as 6.4MHz for system
frequency
·Eight-level subroutine nesting
·HALT function and wake-up feature to reduce power
consumption
·Bit manipulation instructions
·16-bit table read instructions
·63 powerful instructions
·All instructions in 1 or 2 machine cycles
·28-pin SOP, 48-pin SSOP package
General Description
The HT36A3 is an 8-bit high performance RISC-like
microcontroller specifically designed for music applica-
tions. It provides an 8-bit MCU and a 8 channel
wavetable synthesizer. The program ROM is composed
of both program control codes and wavetable voice
codes, and can be easily programmed.
The HT36A3 has a built-in 8-bit microprocessor which
programs the synthesizer to generate the melody by
setting the special register from 20H~2AH. A HALT fea-
ture is provided to reduce power consumption.
8 - B i t
M C U
M u l t i p l i e r / P h a s e
G e n e r a l
1 6 - B i t
D A C
O S C 1
O S C 2
R E S
V D D
V S S
V D D A
V S S A
A U D
208
´
8
R A M
32K
´
1 6 - b i t
R O M
P A 0 ~ P A 7
P B 0 ~ P B 7
P C 0 ~ P C 3
Pin Assignment
Pad Assignment
Chip size: 83 ´111 (mil)2
* The IC substrate should be connected to VSS in the PCB layout artwork.
HT36A3
Rev. 1.00 2 June 30, 2003
H T 3 6 A 3
4 8 S S O P - A
P A 3
P A 2
P A 1
P A 0
P C 3
P C 2
P C 1
P C 0
N C
N C
N C
N C
N C
N C
O S C 2
O S C 1
N C
N C
R E S
N C
N C
N C
A U D
T E S T
P A 4
P A 5
P A 6
P A 7
P B 0
P B 1
P B 2
P B 3
P B 4
P B 5
P B 6
P B 7
N C
N C
V S S
V S S A
V D D
V D D A
N C
N C
N C
N C
N C
N C
4 8
4 7
4 6
4 5
4 4
4 3
4 2
4 1
4 0
3 9
3 8
3 7
3 6
3 5
3 4
3 3
3 2
3 1
3 0
2 9
2 8
2 7
2 6
2 5
1
2
3
4
5
6
7
8
9
1 0
1 1
1 2
1 3
1 4
1 5
1 6
1 7
1 8
1 9
2 0
2 1
2 2
2 3
2 4
2 8
2 7
2 6
2 5
2 4
2 3
2 2
2 1
2 0
1 9
1 8
1 7
1 6
1 5
1
2
3
4
5
6
7
8
9
1 0
1 1
1 2
1 3
1 4
H T 3 6 A 3
2 8 S O P - A
P A 4
P A 5
P A 6
P A 7
N C
N C
N C
V S S
V S S A
V D D
V D D A
N C
T E S T
A U D
P A 3
P A 2
P A 1
P A 0
N C
N C
O S C 2
N C
O S C 1
N C
R E S
N C
N C
N C
O S C 1
O S C 2
R E S
V S S
V D D
P B 4
P B 5
P B 6
1
2
3
4
5
6
7
89
2 9 2 8 2 7 2 6 2 5 2 4 2 3 2 2 2 1 2 0 1 9 1 8 1 7 1 6 1 5 1 4
( 0 , 0 )
1 0
1 1
1 2
1 3
P B 7
V S S A
V D D A
A U D
T E S T
P C 0
P C 1
P C 2
P C 3
P A 0
P A 1
P A 2
P A 3
P A 4
P A 5
P A 6
P A 7
P B 0
P B 1
P B 2
P B 3
Pad Coordinates
Pad No. X Y Pad No. X Y
1-879.100 1202.400 16 693.900 1240.150
2-879.100 1097.100 17 583.300 1240.150
3-879.100 986.500 18 483.300 1240.150
4-879.100 886.500 19 372.700 1240.150
5-898.600 -805.050 20 272.700 1240.150
6-898.600 -931.910 21 162.100 1240.150
7-847.650 -1041.910 22 62.100 1240.150
8-847.650 -1180.350 23 -48.500 1240.150
9-193.090 -1200.600 24 -148.500 1240.150
10 -81.290 -1200.600 25 -259.100 1240.150
11 875.950 -1262.274 26 -359.100 1240.150
12 875.950 -1149.626 27 -469.700 1240.150
13 875.950 -471.774 28 -569.700 1240.150
14 901.500 1240.150 29 -680.300 1240.150
15 793.900 1240.150
Pad Description
Pad Name I/O Internal
Connection Function
PA0~PA7 I/O Pull-High
or None Bidirectional 8-bit Input/Output port
PB0~PB7 I/O Pull-High
or None Bidirectional 8-bit Input/Output port
PC0~PC3 I/O Pull-High
or None Bidirectional 8-bit Input/Output port
VSS ¾¾
Negative power supply, ground
VSSA ¾¾
Negative power supply of DAC, ground
VDD ¾¾
Digital power supply
VDDA ¾¾
DAC power supply
AUD O ¾Audio output
TEST ¾¾
No connection (open)
RES I¾Reset input, active low (no pull-high)
OSC1
OSC2
I
O¾
OSC1 and OSC2 are connected to an RC network or a crystal (by mask op-
tion) for the internal system clock. In the case of RC operation, OSC2 is the
output terminal for 1/8 system clock. The system clock may come from the
crystal, the two pins cannot be floating.
HT36A3
Rev. 1.00 3 June 30, 2003
Absolute Maximum Ratings
Supply Voltage .............................VSS-0.3V to VSS+6V Storage Temperature ...........................-50°Cto125°C
Input Voltage .............................VSS-0.3V to VDD+0.3V Operating Temperature ..........................-25°Cto70°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings²may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-
ity.
D.C. Characteristics Ta=25°C
Symbol Parameter Test Conditions Min. Typ. Max. Unit
VDD Conditions
VDD Operating Voltage ¾¾ 2.2 4.5 5.5 V
IDD Operating Current 4.5V No load, fOSC=8MHz ¾816mA
ISTB Standby Current (WDT Disabled) 4.5V No load, System HALT ¾13
mA
IOH I/O Ports Source Current 4.5V VOH=4.5V 23
¾mA
IOL I/O Ports Sink Current 4.5V VOL=0.5V 23
¾mA
VIH Input High Voltage for I/O Ports 4.5V ¾0.8VDD ¾VDD V
VIL Input Low Voltage for I/O Ports 4.5V ¾0¾0.2VDD V
HT36A3
Rev. 1.00 4 June 30, 2003
Application Circuit
HT36A3
Rev. 1.00 5 June 30, 2003
H T 3 6 A 3
VD D
100k
W
0 . 1
m
F
P C 0 ~ P C 3
P A 0 ~ P A 7
P B 0 ~ P B 7
O S C 1
O S C 2
8 M H z
R E S
VD D
V
D D
S P K
8
W
1 k
W
100k
W
0 . 1
m
F
750
W
V S S A
V S S
P C 0 ~ P C 3
P A 0 ~ P A 7
P B 0 ~ P B 7
H T 3 6 A 3
A U D
O S C 1
R E S
V
D D
V D D V D D A
1 0
W
4 7
m
F0 . 1
m
F
V
D D
V D D V D D A
1 0
W
4 7
m
F0 . 1
m
F
A U D
V
D D
4 7
m
F
0 . 1
m
F
V r e f
1 0
m
F
I N V D D
H T 8 2 V 7 3 3
V S S
C E
O U T N
O U T P
S P K
8
W
20k
W
1
2
3
4
5
7
8
V S S A
V S S
Package Information
28-pin SOP (300mil) Outline Dimensions
Symbol Dimensions in mil
Min. Nom. Max.
A 394 ¾419
B 290 ¾300
C14
¾20
C¢697 ¾713
D92
¾104
E¾50 ¾
F4
¾¾
G32¾38
H4
¾12
a0°¾10°
HT36A3
Rev. 1.00 6 June 30, 2003
2 8
1
1 5
1 4
AB
C
D
F
C ' G
H
a
E
48-pin SSOP (300mil) Outline Dimensions
Symbol Dimensions in mil
Min. Nom. Max.
A 395 ¾420
B 291 ¾299
C8
¾12
C¢613 ¾637
D85
¾99
E¾25 ¾
F4
¾10
G25¾35
H4
¾12
a0°¾8°
HT36A3
Rev. 1.00 7 June 30, 2003
4 8
1
2 5
2 4
AB
C
D
F
C ' G
H
a
E
Product Tape and Reel Specifications
Reel Dimensions
SOP 28W (300mil)
Symbol Description Dimensions in mm
A Reel Outer Diameter 330±1.0
B Reel Inner Diameter 62±1.5
C Spindle Hole Diameter 13.0+0.5
-0.2
D Key Slit Width 2.0±0.5
T1 Space Between Flange 24.8+0.3
-0.2
T2 Reel Thickness 30.2±0.2
SSOP 48W
Symbol Description Dimensions in mm
A Reel Outer Diameter 330±1.0
B Reel Inner Diameter 100±0.1
C Spindle Hole Diameter 13.0+0.5
-0.2
D Key Slit Width 2.0±0.5
T1 Space Between Flange 32.2+0.3
-0.2
T2 Reel Thickness 38.2±0.2
HT36A3
Rev. 1.00 8 June 30, 2003
AC
B
T 1
T 2 D
Carrier Tape Dimensions
SOP 28W (300mil)
Symbol Description Dimensions in mm
W Carrier Tape Width 24.0±0.3
P Cavity Pitch 12.0±0.1
E Perforation Position 1.75±0.1
F Cavity to Perforation (Width Direction) 11.5±0.1
D Perforation Diameter 1.5+0.1
D1 Cavity Hole Diameter 1.5+0.25
P0 Perforation Pitch 4.0±0.1
P1 Cavity to Perforation (Length Direction) 2.0±0.1
A0 Cavity Length 10.85±0.1
B0 Cavity Width 18.34±0.1
K0 Cavity Depth 2.97±0.1
t Carrier Tape Thickness 0.35±0.01
C Cover Tape Width 21.3
HT36A3
Rev. 1.00 9 June 30, 2003
PD 1
W
P 1P 0
D
E
F
t
K 0
B 0
A 0
C
SSOP 48W
Symbol Description Dimensions in mm
W Carrier Tape Width 32.0±0.3
P Cavity Pitch 16.0±0.1
E Perforation Position 1.75±0.1
F Cavity to Perforation (Width Direction) 14.2±0.1
D Perforation Diameter 2.0 Min.
D1 Cavity Hole Diameter 1.5+0.25
P0 Perforation Pitch 4.0±0.1
P1 Cavity to Perforation (Length Direction) 2.0±0.1
A0 Cavity Length 12.0±0.1
B0 Cavity Width 16.20±0.1
K1 Cavity Depth 2.4±0.1
K2 Cavity Depth 3.2±0.1
t Carrier Tape Thickness 0.35±0.05
C Cover Tape Width 25.5
HT36A3
Rev. 1.00 10 June 30, 2003
PD 1
P 1P 0
D
E
F
t
K 2
B 0
A 0
W
K 1
C
HT36A3
Rev. 1.00 11 June 30, 2003
Copyright Ó2003 by HOLTEK SEMICONDUCTOR INC.
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sumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices
or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information,
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