Rev. B
AH
2008
04
11
EGF1A – EGF1K
TAITRON COMPONENTS INCORPORATED www.taitroncomponents.com
Page 1
of 4
Tel: (800)
TAITRON (800)
824
8766 (661)
257
6060
Fax: (800)-TAITFAX (800)-824-8329 (661)-257-6415
1.0A Sintered Glass Passivated
Super Fast Rectifier
1.0A Sintered Glass Passivated Super Fast Rectifier
Features
• Sintered glass passivated (SGP) rectifier chip
• Glass passivated cavity-free junction
• Ideal for surface mount automotive applications
• Built-in strain relief
• Easy pick and place
• High temperature soldering guaranteed:260°C/10 seconds,
at terminals
• RoHS Compliance
Mechanical Data
Case: JEDEC DO-214AC(SMA) molded plastic over passivated chip
Epoxy: Plastic package has UL flammability classification 94V-0
Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Weight: 0.002 ounces, 0.064 gram
Maximum Ratings and Electr ical Characteri stics (T
A
=25ºC unless noted otherwise)
Symbol Description EGF1A EGF1B EGF1D EGF1G EGF1J EGF1K Unit Conditions
VRRM Maximum
Repetitive Peak
Reverse Voltage 50 100 200 400 600 800 V
VRMS Maximum RMS
Voltage 35 70 140 280 420 560 V
VDC Maximum DC
Blocking Voltage 50 100 200 400 600 800 V
IF(AV) Maximum Average
Forward Rectified
Current 1.0 A TL=110° C
IFSM Peak Forward
Surge Current 30 25 A
8.3ms single half
sine-wave
superimposed on
rated load (JEDEC
Method)
SMA