LB Q39G
1Version 1.5 | 2018-03-27
Produktdatenblatt | Version 1.1
www.osram-os.com
LB Q39G
CHIPLED® 0603
Applications
Electronic Equipment
Gaming, Amusement, Gambling
White Goods
Features:
Package: SMT package 0603, colorless di󰘯used resin
Chip technology: InGaN on Sapphire
Typ. Radiation: 170° (horizontal), 130° (vertical)
Color:
λ
dom = 470 nm ( blue)
Corrosion Robustness Class: 3B
ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
LB Q39G
2Version 1.5 | 2018-03-27
Ordering Information
Type Luminous Intensity 1) Ordering Code
IF = 5 mA
Iv
LB Q39G-N1OO-35-1 ≥ 28.0 mcd Q65110A7940
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3Version 1.5 | 2018-03-27
Maximum Ratings
Parameter Symbol Values
Operating Temperature Top min.
max.
-30 °C
85 °C
Storage Temperature Tstg min.
max.
-40 °C
85 °C
Junction Temperature Tjmax. 95 °C
Forward current
TA = 25 °C
IFmax. 15 mA
Surge Current
t ≤ 10 µs; D = 0.005 ; TA = 25 °C
IFS max. 100 mA
Reverse voltage 2)
TA = 25 °C
VRmax. 5 V
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
VESD 2 kV
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Characteristics
IF = 5 mA; TA = 25 °C
Parameter Symbol Values
Peak Wavelength 3)
λ
peak typ. 465 nm
Dominant Wavelength 3)
λ
dom min.
typ.
max.
464 nm
470 nm
476 nm
Spectral Bandwidth at 50% Irel,max
∆λ
typ. 22 nm
Viewing angle at 50 % IV
values for 0°, 90°
2
φ
typ.
typ.
170 °
130 °
Forward Voltage 4)
IF = 5 mA
VFmin.
typ.
max.
2.60 V
2.85 V
3.10 V
Reverse current 2)
VR = 5 V
IRtyp.
max.
0.01 µA
10 µA
Real thermal resistance junction/ambient 5), 6) RthJA real max. 650 K / W
Real thermal resistance junction/solderpoint 5) RthJS real max. 370 K / W
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5Version 1.5 | 2018-03-27
Brightness Groups
Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7)
IF = 5 mA IF = 5 mA IF = 5 mA
min. max. typ.
IvIv
Φ
V
N1 28.0 mcd 35.5 mcd 133.4 mlm
N2 35.5 mcd 45.0 mcd 169.1 mlm
P1 45.0 mcd 56.0 mcd 212.1 mlm
P2 56.0 mcd 71.0 mcd 266.7 mlm
Q1 71.0 mcd 90.0 mcd 338.1 mlm
Q2 90.0 mcd 112.0 mcd 424.2 mlm
Forward Voltage Groups
Group Forward Voltage 4) Forward Voltage 4)
IF = 5 mA IF = 5 mA
min. max.
VFVF
3X 2.60 V 2.70 V
3Y 2.70 V 2.80 V
3Z 2.80 V 2.90 V
4X 2.90 V 3.00 V
4Y 3.00 V 3.10 V
Wavelength Groups
Group Dominant Wavelength 3) Dominant Wavelength 3)
min. max.
λ
dom
λ
dom
3 464 nm 468 nm
4 468 nm 472 nm
5 472 nm 476 nm
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Group Name on Label
Example: N1-3-3X
Brightness Wavelength Forward Voltage
N1 3 3X
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LB Q39G
350 400 450 500 550 600 650 700 750
800
λ
[
nm
]
0,0
0,2
0,4
0,6
0,8
1,0
I
rel
:blue
:V
λ
Relative Spectral Emission 7)
Irel = f (
λ
); IF = 5 mA; TA = 25 °C
LB Q39G
-100°
-90°
-80°
-70°
-60°
-50°
-40°
-30°
-20°
-10° 10° 20° 30° 40° 50° 60° 70° 80° 90°
ϕ
]
0,0
0,2
0,4
0,6
0,8
1,0I
rel
:0°
:90°
Radiation Characteristics 7)
Irel = f (
ϕ
); TA = 25 °C
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8Version 1.5 | 2018-03-27
LB Q39G
0,9
1
2
3
4
56789
10
I
F
[
mA
]
0,3
0,4
0,5
0,6
0,7
0,8
0,9
1
2
3
I
V
I
V
(5mA)
Relative Luminous Intensity 7), 8)
Iv/Iv(5 mA) = f(IF); TA = 25 °C
LB Q39G
2,42,6 2,83,0
V
F
[
V
]
1
2
3
4
5
10
I
F
[
mA
]
Forward current 7), 8)
IF = f(VF); TA = 25 °C
LB Q39E
1
15
2
4
6
8
10
12
I
F
[
mA
]
-8
-6
-4
-2
0
2
4
6
8
∆λ
dom
[
nm
]
Dominant Wavelength 7)
∆λ
dom = f(IF); TA = 25 °C
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9Version 1.5 | 2018-03-27
LB Q39G
30 40 50 60 70 80
T
j
[
°C
]
0,0
0,2
0,4
0,6
0,8
1,0
1,2
I
v
I
v
(25°C)
Relative Luminous Intensity 7)
Iv/Iv(25 °C) = f(Tj); IF = 5 mA
LB Q39G
30 40 50 60 70 80
T
j
[
°C
]
-0,16
-0,14
-0,12
-0,10
-0,08
-0,06
-0,04
-0,02
0,00
V
F
[
V
]
Forward Voltage 7)
VF = VF - VF(25 °C) = f(Tj); IF = 5 mA
LB Q39G
30 40 50 60 70 80
T
j
[
°C
]
-10
-5
0
5
10
∆λ
dom
[
nm
]
Dominant Wavelength 7)
∆λ
dom =
λ
dom -
λ
dom(25 °C) = f(Tj); IF = 5 mA
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0
0˚C
T
I
F
mA
OHL03587
T
S
T
A
temp. ambient
T
temp. solder point
S
T
A
20 40 60 80 100
2
4
6
8
10
12
14
16
20
Max. Permissible Forward Current
IF = f(T)
0-5
F
I
A
t
p
s
OHL03589
-4
10 -3
10 -2
10 -1
10 0
10 1
10 2
1010
0.01
0.1
0.02
0.05
0.005
D
=
T
t
T
D
=
P
P
t
I
F
0.2
0.3
0.5
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.11
Permissible Pulse Handling Capability
IF = f(tp); D: Duty cycle; TA = 85 °C
0-5
F
I
A
t
p
s
OHL03588
-4
10 -3
10 -2
10 -1
10 0
10 1
10 2
1010
0.01
0.1
0.02
0.05
0.005
D
=
T
t
T
D
=
P
P
t
I
F
0.2
0.3
0.5
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.11
Permissible Pulse Handling Capability
IF = f(tp); D: Duty cycle; TA = 25 °C
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11 Version 1.5 | 2018-03-27
Dimensional Drawing 9)
Approximate Weight: 1.0 mg
Corrosion test: Class: 3B
Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC
60068-2-43)
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For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not
suitable for ultra sonic cleaning.
Recommended Solder Pad 9)
0.8 (0.031)
0.7 (0.028)
OHAPY606
0.8 (0.031)
0.8 (0.031)
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13 Version 1.5 | 2018-03-27
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
0
0s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Pro󰘰le Feature Symbol Pb-Free (SnAgCu) Assembly Unit
Minimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
2 3 K/s
Time tS
TSmin to TSmax
tS60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL217 °C
Time above liquidus temperature tL80 100 s
Peak temperature TP245 260 °C
Time within 5 °C of the speci󰘰ed peak
temperature TP - 5 K
tP10 20 30 s
Ramp-down rate*
TP to 100 °C
3 6 K/s
Time
25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; ful󰘰llment for the whole T-range
LB Q39G
14 Version 1.5 | 2018-03-27
Taping 9)
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Tape and Reel 10)
Reel dimensions [mm]
A W Nmin W1W2 max Pieces per PU
180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 4000
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Barcode-Product-Label (BPL)
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
Dry Packing Process and Materials 9)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%
bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
LB Q39G
17 Version 1.5 | 2018-03-27
Transportation Packing and Materials 9)
Dimensions of transportation box in mm
Width Length Height
260 ± 5 mm 230 ± 5 mm 85 ± 5 mm
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Chip Technology:
1: TSN
3: standard InGaN
4: AlGaAs
6: standard InGalP
E: ThinGaN & package with 8 kV
ESD stability
G: NOTA, Powerflip, ThinGaN
Encapsulant Type / Lens Properties
1: focusing lens (=20°)
7: clear resin or white volume conversion
8: white volume conversion
Wavelength Emission Color Color coordinates according
(λdom typ.) CIE 1931/Emission color:
B: 470 nm blue W: white
S: 633 nm super red
T: 528 nm true green
Y: 587 nm yellow
A: 617 nm amber
R/J: 625 nm red
H: 645 nm hyper-red
O: 606 nm orange
G: 570 nm green
L: Light
emitting
diode
Package Type
Q: CHIPLED 0603 / 0402
R: CHIPLED 0805
N: CHIPLED 1206 /
CHIPLED with lens
Lead / Package Properties
1: footprint: 0603 / height: 0.6 mm
3: footprint: 0603 / height: 0.35 mm
9: standard
H: footprint: 0402 / height: 0.35 mm
Type Designation System
L B Q H 9 G
LB Q39G
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Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED speci󰘰ed in this
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from
these devices. As a matter of principle, however, it should be mentioned that intense light sources have a
high secondary exposure potential due to their blinding e󰘯ect. As is also true when viewing other bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this LED contain, in addition to other substances, metal 󰘰lled materials including silver.
Metal 󰘰lled materials can be a󰘯ected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize LED exposure to aggressive substances during storage, pro-
duction, and use. LEDs that showed visible discoloration when tested using the described tests above did
show no performance deviations within failure limits during the stated test duration. Respective failure limits
are described in the IEC60810.
Based on very short life cycle times in chip technology this component is subject to frequent adaption to the
latest chip technology.
For further application related informations please visit www.osram-os.com/appnotes
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Disclaimer
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language word-
ings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please 󰘰nd the latest version on the OSRAM OS webside.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales o󰘲ce.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.
Product safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-
nate the customer-speci󰘰c request between OSRAM OS and Buyer and/or Customer.
LB Q39G
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Glossary
1) Brightness: Brightness groups are tested at a current pulse duration of 25 ms and a tolerance of
±11 %.
2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-
tion is not allowed.
3) Wavelength: Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of ±1 nm.
4) Forward Voltage: Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of
±0.1 V.
5) Thermal Resistance: Rth max is based on statistic values (6
σ
).
6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size ≥ 5 mm² per pad)
7) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data
or calculated correlations of technical parameters can only re󰘱ect statistical 󰘰gures. These do not nec-
essarily correspond to the actual parameters of each single product, which could di󰘯er from the typical
data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical
improvements, these typ. data will be changed without any further notice.
8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher di󰘯er-
ences between single LEDs within one packing unit.
9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are speci󰘰ed with ±0.1 and
dimensions are speci󰘰ed in mm.
10) Tape and Reel: All dimensions and tolerances are speci󰘰ed acc. IEC 60286-3 and speci󰘰ed in mm.
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22 Version 1.5 | 2018-03-27
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.