SCLS122D − DECEMBER 1982 − REVISED OCT OBER 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DWide Operating Voltage Range of 2 V to 6 V
DOutputs Can Drive Up To 10 LSTTL Loads
DLow Power Consumption, 80-µA Max ICC
DTypical tpd = 20 ns
D±4-mA Output Drive at 5 V
DLow Input Current of 1 µA Max
DLook-Ahead Circuitry Enhances Cascaded
Counters
DFully Synchronous in Count Modes
DParallel Asynchronous Load for Modulo-N
Count Lengths
DAsynchronous Clear
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
B
QB
QA
DOWN
UP
QC
QD
GND
VCC
A
CLR
BO
CO
LOAD
C
D
SN54HC193 ...J OR W PACKAGE
SN74HC193 . . . D, N, NS, OR PW PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
CLR
BO
NC
CO
LOAD
QA
DOWN
NC
UP
QC
Q
B
NC
D
CV
A
D
GND
NC
SN54HC193 . . . FK PACKAGE
(TOP VIEW)
NC − No internal connection
B
CC
Q
description/ordering information
The ’HC193 devices are 4-bit synchronous, reversible, up/down binary counters.
Synchronous operation is provided by having all flip-flops clocked simultaneously so that the outputs change
coincidentally with each other when so instructed by the steering logic. This mode of operation eliminates the
output counting spikes normally associated with asynchronous (ripple-clock) counters.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP − N Tube of 25 SN74HC193N SN74HC193N
Tube of 40 SN74HC193D
SOIC − D Reel of 2500 SN74HC193DR HC193
−40°C to 85°C
SOIC − D
Reel of 250 SN74HC193DT
HC193
−40°C to 85°CSOP − NS Reel of 2000 SN74HC193NSR HC193
Tube of 90 SN74HC193PW
TSSOP − PW Reel of 2000 SN74HC193PWR HC193
TSSOP − PW
Reel of 250 SN74HC193PWT
HC193
CDIP − J Tube of 25 SNJ54HC193J SNJ54HC193J
−55°C to 125°CCFP − W Tube of 150 SNJ54HC193W SNJ54HC193W
−55 C to 125 C
LCCC − FK Tube of 55 SNJ54HC193FK SNJ54HC193FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
f
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
!"#$%&" ' ()##*& %' "! +),-(%&" .%&*/
#".)(&' ("!"#$ &" '+*(!(%&"' +*# &0* &*#$' "! *1%' '&#)$*&'
'&%.%#. 2%##%&3/ #".)(&" +#"(*''4 ."*' "& *(*''%#-3 (-).*
&*'&4 "! %-- +%#%$*&*#'/
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)-*'' "&0*#2'* "&*./ %-- "&0*# +#".)(&' +#".)(&"
+#"(*''4 ."*' "& *(*''%#-3 (-).* &*'&4 "! %-- +%#%$*&*#'/
SCLS122D − DECEMBER 1982 − REVISED OCT OBER 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
The outputs of the four flip-flops are triggered on a low-to-high-level transition of either count (clock) input (UP
or DOWN). The direction of counting is determined by which count input is pulsed while the other count input
is high.
All four counters are fully programmable; that is, each output may be preset to either level by placing a low on
the load (LOAD) input and entering the desired data at the data inputs. The output changes to agree with the
data inputs independently of the count pulses. This feature allows the counters to be used as modulo-N dividers
simply by modifying the count length with the preset inputs.
A clear (CLR) input has been provided that forces all outputs to the low level when a high level is applied. The
clear function is independent of the count and LOAD inputs.
These counters were designed to be cascaded without the need for external circuitry. The borrow (BO) output
produces a low-level pulse while the count is zero (all outputs low) and DOWN is low. Similarly, the carry (CO)
output produces a low-level pulse while the count is maximum (9 or 15), and UP is low. The counters then can
be cascaded easily by feeding BO and CO to DOWN and UP, respectively, of the succeeding counter.
SCLS122D − DECEMBER 1982 − REVISED OCT OBER 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram (positive logic)
Pin numbers shown are for the D, J, N, NS, PW , and W packages.
SC1
1D
R
7
9
11
4
5
14
12
13
QD
BO
LOAD
CO
CLR
D
SC1
1D
R
6
10
QC
C
SC1
1D
R
2
1
QB
B
SC1
1D
R
3
15 QA
A
UP
DOWN S
R
SCLS122D − DECEMBER 1982 − REVISED OCT OBER 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
typical clear, load, and count sequence
The following sequence is illustrated below:
1. Clear outputs to 0
2. Load (preset) to binary 13
3. Count up to 14, 15, carry, 0, 1, and 2
4. Count down to 1, 0, borrow, 15, 14, and 13
Data
Inputs
Data
Outputs
LOAD
A
B
C
D
UP
CO
QA
QB
QC
QD
Clear
Count Up
013 14 012
BO
Count Down
15 14 13
DOWN
CLR
15 1 0
Preset
NOTES: A. CLR overrides LOAD, data, and count inputs.
B. When counting up, count-down input must be high; when counting down, count-up input must be high.
SCLS122D − DECEMBER 1982 − REVISED OCT OBER 2003
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 64°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 108°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HC193 SN74HC193
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 2 5 6 2 5 6 V
VCC = 2 V 1.5 1.5
V
IH
High-level input voltage VCC = 4.5 V 3.15 3.15 V
VIH
High-level input voltage
VCC = 6 V 4.2 4.2
V
VCC = 2 V 0.5 0.5
V
IL
Low-level input voltage VCC = 4.5 V 1.35 1.35 V
VIL
Low-level input voltage
VCC = 6 V 1.8 1.8
V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
VCC = 2 V 1000 1000
∆t/∆v‡Input transition rise/fall time VCC = 4.5 V 500 500 ns
∆t/∆v‡
Input transition rise/fall time
VCC = 6 V 400 400
ns
TAOperating free-air temperature −55 125 −40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
‡If this device is used in the threshold region (from VILmax = 0.5 V to VIHmin = 1.5 V), there is a potential to go into the wrong state from induced
grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device; however, functionally,
the CLK inputs are not ensured while in the shift, count, or toggle operating modes.
SCLS122D − DECEMBER 1982 − REVISED OCT OBER 2003
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C SN54HC193 SN74HC193
UNIT
PARAMETER
TEST CONDITIONS
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 1.9 1.998 1.9 1.9
I
OH
= −20 µA4.5 V 4.4 4.499 4.4 4.4
V
OH
V
I
= V
IH
or V
IL
IOH = −20 µA
6 V 5.9 5.999 5.9 5.9 V
VOH
VI = VIH or VIL
IOH = −4 mA 4.5 V 3.98 4.3 3.7 3.84
V
IOH = −5.2 mA 6 V 5.48 5.8 5.2 5.34
2 V 0.002 0.1 0.1 0.1
I
OL
= 20 µA4.5 V 0.001 0.1 0.1 0.1
V
OL
V
I
= V
IH
or V
IL
IOL = 20 µA
6 V 0.001 0.1 0.1 0.1 V
VOL
VI = VIH or VIL
IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33
V
IOL = 5.2 mA 6 V 0.15 0.26 0.4 0.33
IIVI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA
ICC VI = VCC or 0, IO = 0 6 V 8 160 80 µA
Ci2 V to 6 V 3 10 10 10 pF
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
VCC
TA = 25°C SN54HC193 SN74HC193
UNIT
V
CC MIN MAX MIN MAX MIN MAX
UNIT
2 V 4.2 2.8 3.3
f
clock
Clock frequency 4.5 V 21 14 17 MHz
fclock
Clock frequency
6 V 24 16 19
MHz
2 V 120 180 150
CLR high 4.5 V 24 36 30
CLR high
6 V 21 31 26
2 V 120 180 150
t
w
Pulse duration LOAD low 4.5 V 24 36 30 ns
tw
Pulse duration
LOAD low
6 V 21 31 26
ns
2 V 120 180 150
UP or DOWN high or low 4.5 V 24 36 30
UP or DOWN high or low
6 V 21 31 26
2 V 110 165 140
Data before LOAD inactive 4.5 V 22 33 28
Data before LOAD inactive
6 V 19 28 24
2 V 110 165 140
t
su
Setup time CLR inactive before UP↑ or DOWN↑4.5 V 22 33 28 ns
tsu
Setup time
CLR inactive before UP↑ or DOWN↑
6 V 19 28 24
ns
2 V 110 165 140
LOAD inactive before UP↑ or DOWN↑4.5 V 22 33 28
LOAD inactive before UP↑ or DOWN↑
6 V 19 28 24
2 V 5 5 5
t
h
Hold time Data after LOAD inactive 4.5 V 5 5 5 ns
th
Hold time
Data after LOAD inactive
6 V 5 5 5
ns
SCLS122D − DECEMBER 1982 − REVISED OCT OBER 2003
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HC193 SN74HC193
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 4.2 8 2.8 3.3
f
max
4.5 V 21 55 14 17 MHz
fmax
6 V 24 60 16 19
MHz
2 V 75 165 250 205
UP CO 4.5 V 24 33 50 41
UP
CO
6 V 20 28 43 35
2 V 75 165 250 205
DOWN BO 4.5 V 24 33 50 41
tpd
DOWN
BO
6 V 20 28 43 35
ns
tpd 2 V 190 250 375 315 ns
UP or DOWN Any Q 4.5 V 40 50 75 63
UP or DOWN
Any Q
6 V 35 43 64 54
2 V 190 260 390 325
LOAD Any Q 4.5 V 40 52 78 65
LOAD
Any Q
6 V 35 44 66 55
2 V 170 240 360 300
t
PHL
CLR Any Q 4.5 V 36 48 72 60 ns
tPHL
CLR
Any Q
6 V 31 41 61 51
ns
2 V 38 75 110 95
t
t
Any 4.5 V 8 15 22 19 ns
tt
Any
6 V 6 13 19 16
ns
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load 50 pF
SCLS122D − DECEMBER 1982 − REVISED OCT OBER 2003
8POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PULSE DURATIONS
th
tsu
50%
50%50% 10%10% 90% 90%
VCC
VCC
0 V
0 V
trtf
Reference
Input
Data
Input
50%
High-Level
Pulse 50%
V
CC
0 V
50% 50%
VCC
0 V
tw
Low-Level
Pulse
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%50% 10%10% 90% 90%
VC
C
VO
H
VO
L
0 V
trtf
Input
In-Phase
Output
50%
tPLH tPHL
50% 50%
10% 10% 90%90% VO
H
VO
L
tr
tf
tPHL tPLH
Out-of-Phase
Output
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. For clock inputs, fmax is measured when the input duty cycle is 50%.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLH and tPHL are the same as tpd.
Test
Point
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-87724012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-8772401EA ACTIVE CDIP J 16 1 TBD Call TI Call TI
SN54HC193J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN74HC193D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193DT ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193DTE4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193DTG4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74HC193NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74HC193NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193NSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193NSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193PW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74HC193PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193PWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193PWT ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC193PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54HC193FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54HC193J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 3
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC193, SN74HC193 :
•Catalog: SN74HC193
•Automotive: SN74HC193-Q1, SN74HC193-Q1
•Military: SN54HC193
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HC193DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74HC193NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74HC193PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC193PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC193DR SOIC D 16 2500 333.2 345.9 28.6
SN74HC193NSR SO NS 16 2000 367.0 367.0 38.0
SN74HC193PWR TSSOP PW 16 2000 367.0 367.0 35.0
SN74HC193PWT TSSOP PW 16 250 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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