A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
1210.2007.12.1.4 1
www.analogictech.com
General Description
The AAT1210 is a high power DC/DC boost (step-up)
converter with an input voltage range from 2.7 to 5.5V.
The output voltage can be set from VIN + 0.5V to 18V.
The total solution is less than 1mm in height. High oper-
ating efficiency makes the AAT1210 the ideal solution for
battery powered and consumer applications.
The step-up converter operates at frequencies up to
2MHz, enabling ultra-small external filtering compo-
nents. Hysteretic current mode control provides excel-
lent transient response with no external compensation,
achieving stability across a wide operating range with
minimal design effort.
The AAT1210 true load disconnect feature extends bat-
tery life by isolating the load from the power source
when the EN/SET pin is pulled low, ensuring zero volts
output during the disable state. This feature eliminates
the external boost converter leakage path and achieves
standby quiescient current <1μA without an external
switching device.
A fixed output voltage is set using two external resistors.
Alternatively, the output may be adjusted dynamically
across a 2.0x range. The output can toggle between two
preset voltages using the SEL logic pin. Optionally, the
output can be dynamically set to any one of 16 pro-
grammed levels using AnalogicTech’s patented Simple
Serial Control™ (S2Cwire™) interface.
The AAT1210 is available in a Pb-free, thermally-
enhanced 16-pin 3x4mm TDFN low-profile package and
is rated over the -40°C to +85°C temperature range.
Features
• VIN Range: 2.7V to 5.5V
• Maximum Continuous Output
▪ 900mA at 5V
▪ 300mA at 12V
▪ 150mA at 18V
• Up to 2MHz Switching Frequency
• Ultra-Small Inductor and Capacitors
▪ 1mm Height Inductor
▪ Small Ceramic Capacitors
• Hysteretic Current Mode Control
▪ No External Compensation
▪ Excellent Transient Response
▪ High Efficiency at Light Load
• Up to 90% Efficiency
• Integrated Low RDS(ON) MOSFET Switches
• Low Inrush with Integrated Soft Start
• Cycle-by-Cycle Current Limit
• Short-Circuit and Over-Temperature Protection
• True Load Disconnect
• Optional Dynamic Voltage Programming
• TDFN34-16 Package
• -40°C to +85°C Temperature Range
Applications
• GPS Systems
• DVD Blu-Ray
• Handheld PCs
• PDA Phones
• Portable Media Players
• USB OTG
Typical Application
FB2
VIN
EN/SET
GND
FB1
LIN
SW
D1
SEL
AAT1210
TDFN34-16
L1
0.47μH
VOUT
5V @ 900m
A
VIN
3.6V
C1
4.7μF
0603 R2
4.99kΩ
R1
36.5kΩ
C2
10μF
0603
AAT1210 Boost Converter Output Capabilit
y
(TDFN34-12; TAMB = 25°
°
C; TC(RISE) = +50
°
C)
Output Voltage (V)
Output Current (mA)
0
200
400
600
800
1000
1200
1400
56789101112131415161718
VIN = 4.5V
VIN = 3.6V
VIN = 2.7V
A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
2 1210.2007.12.1.4
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A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
2 1210.2007.12.1.4
www.analogictech.com
Pin Descriptions
Pin # Symbol Function
1, 2 LIN Switched power input. Connect to the power inductor.
3 FB1 Feedback pin for high output voltage set point. Pin set to 1.2V when SEL is high and disabled when SEL is
low. Disabled with S2Cwire control. Tie directly to FB2 pin for static (fi xed) output voltage.
4 FB2
Feedback pin for low output voltage set point. Pin set to 0.6V when SEL is low and disabled when SEL is
high. Voltage is set from 0.6V to 1.2V with S2Cwire control. Tie directly to FB1 pin for static (fi xed) output
voltage.
5 GND Ground pin.
6, 7, 8 PGND Power ground for the boost converter; connected to the source of the N-channel MOSFET. Connect to the
input and output capacitor return.
9, 10 SW Boost converter switching node. Connect the power inductor between this pin and the LIN pin.
11 N/C No connection.
12 VIN Input voltage for the converter. Connect this pin directly to the VP pin.
13 SEL Logic high selects FB1 high output reference. Logic low selects FB2 low output reference. Pull low for
S2Cwire control.
14 EN/SET Active high enable pin. Alternately, input pin for S2Cwire control using the FB2 reference.
15, 16 VP Input power pin; connected internally to the source of the P-channel MOSFET. Connect externally to the
input capacitor(s).
EP Exposed paddle (bottom). Connected internally to the SW pins. Can be tied to bottom side PCB heat sink
to optimize thermal performance.
Pin Configuration
TDFN34-16
(Top View)
FB1
FB2
GND
LIN
LIN
3
PGND
PGND
PGND
EN/SET
SEL
VIN
VP
VP
N/C
SW
SW
4
5
1
2
6
7
8
14
13
12
16
15
11
10
9
A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
1210.2007.12.1.4 3
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A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
1210.2007.12.1.4 3
www.analogictech.com
Absolute Maximum Ratings1
Symbol Description Value Units
VIN, VP Input Voltage -0.3 to 6.0 V
SW Switching Node 20 V
LIN, EN/SET,
SEL, FB1, FB2 Maximum Rating VIN + 0.3 V
TJOperating Temperature Range -40 to 150 °C
TSStorage Temperature Range -65 to 150 °C
TLEAD Maximum Soldering Temperature (at leads, 10 sec) 300 °C
Recommended Operating Conditions
Symbol Description Value Units
θJA Thermal Resistance 44 °C/W
PD Maximum Power Dissipation (TA = 25°C) 2270 mW
1. Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional operation at conditions other than the operating conditions
specified is not implied. Only one Absolute Maximum Rating should be applied at any one time.
A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
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A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
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Electrical Characteristics1
VIN = 3.6V, TA = -40°C to +85°C, unless otherwise noted. Typical values are TA = 25°C.
Symbol Description Conditions Min Typ Max Units
Power Supply
VIN Input Voltage Range 2.7 5.5 V
VOUT Output Voltage Range VIN +
0.5V 18 V
IOUT(MAX) Output Current2
VIN = 2.7V, VOUT = 5V 600
mAVIN = 2.7V, VOUT > 5V See note 2
VIN = 3.6V, VOUT > 5V 900
VUVLO UVLO Threshold
VIN Rising 2.7 V
Hysteresis 150 mV
VIN Falling 1.8 V
IQ Quiescent Current
SEL = GND, VOUT = 5V, No Load,
Switching3250 μA
SEL = GND, FB2 = 1.5V, Not Switching 40 70 μA
ISHDN VIN Pin Shutdown Current EN/SET = GND 1.0 μA
FB1 FB1 Reference Voltage IOUT = 0 to IOUT(MAX) mA, VIN = 2.7V to
5.0V, SEL = High 1.164 1.2 1.236 V
FB2 FB2 Reference Voltage IOUT = 0 to IOUT(MAX) mA, VIN = 2.7V to
5.0V, SEL = Low 0.582 0.6 0.618 V
ΔVLOADREG Load Regulation IOUT = 0 to IOUT(MAX) mA 0.01 %/mA
ΔVLINEREG/ΔVIN Line Regulation VIN = 3.0V to 5.5V 0.6 %/V
RDS(ON)L Low Side Switch On Resistance 0.06 Ω
RDS(ON)IN
Input Disconnect Switch On
Resistance 0.18 Ω
TSS Soft-Start Time From Enable to Output Regulation;
VOUT = 15V , COUT = 10μF2.5 ms
TSD Over-Temperature Shutdown
Threshold 140 °C
THYS Shutdown Hysteresis 15 °C
ILIM N-Channel Current Limit VIN = 3.6V , L =2.2μH 3.0 A
SEL, EN/SET
VSEL(L) SEL Threshold Low VIN = 2.7V 0.4 V
VSEL(H) SEL Threshold High VIN = 5.5V 1.4 V
VEN/SET(L) Enable Threshold Low VIN = 2.7V 0.4 V
VEN/SET(H) Enable Threshold High VIN = 5.5V 1.4 V
TEN/SET LO EN/SET Low Time 0.3 75 μs
TEN/SET HI MIN Minimum EN/SET High Time 50 ns
TEN/SET HI MAX Maximum EN/SET High Time 75 μs
TOFF EN/SET Off Timeout 500 μs
TLAT EN/SET Latch Timeout 500 μs
IEN/SET EN/SET Input Leakage -1 1 μA
1. Specifications over the -40°C to +85°C operating temperature range are assured by design, characterization and correlation with statistical process controls.
2.
Maximum output power and current is dependent upon operating efficiency and thermal/mechanical design. Output current and output power derating may apply. See Figure 1.
3. Total input current with prescribed FB resistor network can be reduced with larger resistor values.
A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
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A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
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Typical Characteristics
Efficiency vs. Load
(VOUT = 5V)
Output Current (mA)
Efficiency (%)
25
35
45
55
65
75
85
95
0.1 1 10 100 1000
VIN = 4.5V
VIN = 4.2V
VIN = 3.6V
DC Regulation
(VOUT = 5V)
Output Current (mA)
Output Error (%)
-5
-4
-3
-2
-1
0
1
2
0.1 1 10 100 1000
VIN = 4.5V
VIN = 4.2V
VIN = 3.6V
VIN = 3.0V
VIN = 2.7V
Efficiency vs. Load
(VOUT = 9V)
Output Current (mA)
Efficiency (%)
25
35
45
55
65
75
85
95
0.1 1 1 0 100 1000
VIN = 5.5V
VIN = 4.5V
VIN = 4.2V
VIN = 3.6V
DC Regulation
(VOUT = 9V)
Output Current (mA)
Output Error (%)
-5
-4
-3
-2
-1
0
1
2
0.1 1 10 100 1000
VIN = 5.5V VIN = 4.5V
VIN = 4.2V
VIN = 3.6V
VIN = 3.0V
VIN = 2.7V
Efficiency vs. Load
(VOUT = 12V)
Output Current (mA)
Efficiency (%)
25
35
45
55
65
75
85
95
0.1 1 10 100 1000
VIN = 5.5V VIN = 4.5V
VIN = 4.2V
VIN = 3.6V
DC Regulation
(VOUT = 12V)
Output Current (mA)
Output Error (%)
-5
-4
-3
-2
-1
0
1
2
0.1 1 10 100 1000
VIN = 5.5V VIN = 4.5V
VIN = 4.2V
VIN = 3.6V
VIN = 3.0V
VIN = 2.7V
A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
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A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
6 1210.2007.12.1.4
www.analogictech.com
Typical Characteristics
Efficiency vs. Load
(VOUT = 15V)
Output Current (mA)
Efficiency (%)
25
35
45
55
65
75
85
95
0.1 1 10 100 1000
VIN = 5.5V VIN = 4.5V
VIN = 4.2V
VIN = 3.6V
DC Regulation
(VOUT = 15V)
Output Current (mA)
Output Error (%)
VIN = 4.5V
-5
-4
-3
-2
-1
0
1
2
0.1 1 10 100 1000
VIN = 5.5V
VIN = 4.2V
VIN = 3.6V
VIN = 3.0V
VIN = 2.7V
Line Regulation
(VOUT = 12V)
Input Voltage (V)
Accuracy (%)
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
2.5 3 3.5 4 4.5 5 5.5 6
VIN = 2.7V
VIN = 3.0V
VIN = 3.6V
VIN = 5.5V
VIN = 4.2V
Output Voltage Error vs. Temperature
(VIN = 3.6V; VOUT = 12V; IOUT = 100mA)
Temperature (°
°
C)
Output Error (%)
-0.5
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
-40 -15 10 35 60 8
5
No Load Input Current vs. Input Voltage
(EN = High)
Input Voltage (V)
Supply Current (mA)
0
0.5
1
1.5
2
2.5
3
2.5 3 3.5 4 4.5 5 5.5 6
VOUT = 18V
VOUT = 9V
VOUT = 5V
VOUT = 12V
No Load Input Current vs. Temperature
(VIN = 3.6V; VOUT = 5V)
Temperature (°
°
C)
Supply Current (mA)
0.25
0.26
0.27
0.28
0.29
0.3
0.31
0.32
0.33
0.34
-40 -15 10 35 60 8
5
A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
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A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
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Typical Characteristics
AC Output Ripple vs. Output Current
(VOUT = 9V)
Output Current (mA)
Output Voltage (mV)
0
10
20
30
40
50
60
70
0 50 100 150 200 250 300
VIN = 2.7V VIN = 3.0V
VIN = 3.6V VIN = 4.2V
VIN = 5.5V
Output Ripple
(VIN = 3.6V; VOUT = 15V; IOUT = 150mA; L = 1.2µH)
Time (500ns/div)
Inductor Current
(bottom) (A)
Output Voltage
(top) (V)
14.7
14.75
14.8
14.85
14.9
14.95
15
15.05
15.1
-4
-2
0
2
4
6
8
10
12
Output Ripple
(VIN = 3.6V; VOUT = 15V; No Load; L = 1.2µH)
Time (200ns/div)
Inductor Current
(bottom) (A)
Output Voltage
(top) (V)
14.7
14.75
14.8
14.85
14.9
14.95
15
15.05
15.1
-0.5
0
0.5
1
1.5
2
2.5
3
3.5
Load Transient Response
(VIN = 3.6V; VOUT = 5V; IOUT = 0mA to 600mA)
Time (20µs/div)
Output Current (A) (middle)
Inductor Current (A) (bottom)
Output Voltage
(top) (V)
3.6
3.8
4
4.2
4.4
4.6
4.8
5
5.2
-1
0
1
2
3
4
5
6
7
0mA
600mA
Load Transient Response
(VIN = 3.6V; VOUT = 5V; IOUT = 120mA to 360mA)
Time (20µs/div)
Output Current (A) (middle)
Inductor Current (A) (bottom)
Output Voltage
(top) (V)
4.65
4.7
4.75
4.8
4.85
4.9
4.95
5
5.05
-1
0
1
2
3
4
5
6
7
120mA
360mA
Load Transient Response
(VIN = 3.6V; VOUT = 12V; IOUT = 0mA to 200mA)
Time (20µs/div)
Output Current (A) (middle)
Inductor Current (A) (bottom)
Output Voltage
(top) (V)
10.8
11
11.2
11.4
11.6
11.8
12
12.2
12.4
-1
0
1
2
3
4
5
6
7
0mA
200mA
A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
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A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
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Typical Characteristics
Load Transient Response
(VIN = 3.6V; VOUT = 12V; IOUT = 40 to 120mA)
Time (20µs/div)
Output Current (middle) (A)
Inductor Current (bottom) (A)
Output Voltage
(top) (V)
10.8
11
11.2
11.4
11.6
11.8
12
12.2
12.4
-1
0
1
2
3
4
5
6
7
120mA
40mA
Line Response
(VOUT = 15V @ 100mA)
Time (100µs/div)
Input Voltage
(bottom) (V)
Output Voltage
(top) (V)
13.5
13.75
14
14.25
14.5
14.75
15
15.25
15.5
2.4
3
3.6
4.2
4.8
5.4
6
6.6
7.2
Line Response
(VOUT = 5V @ 100mA)
Time (100µs/div)
Input Voltage
(bottom) (V)
Output Voltage
(top) (V)
3.8
4
4.2
4.4
4.6
4.8
5
5.2
5.4
2.4
3
3.6
4.2
4.8
5.4
6
6.6
7.2
P-Channel RDS(ON) vs. Input Voltage
Input Voltage (V)
RDS(ON) (mΩ
Ω
)
100
120
140
160
180
200
220
240
260
280
300
2.5 3 3.5 4 4.5 5 5.5 6
120°C100°C
85°C
25°C
N-Channel RDS(ON) vs. Input Voltage
Input Voltage (V)
RDS(ON) (mΩ
Ω
)
40
50
60
70
80
90
100
110
2.5 3 3.5 4 4.5 5 5.5 6
120°C100°C
85°C
25°C
Soft Start
(VIN = 3.6V; CIN = 2.2µF; IOUT = 100mA; VOUT = 15V)
Time (500µs/div)
Input Current
(bottom) (A)
Enable Voltage (middle) (V)
Output Voltage (top) (V)
-20
-15
-10
-5
0
5
10
15
20
-0.5
0
0.5
1
1.5
2
2.5
3
3.5
1.04V
A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
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A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
1210.2007.12.1.4 9
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Typical Characteristics
Soft Start
(VIN = 3.6V; CIN = 2.2µF; IOUT = 100mA; VOUT = 5V)
Time (500µs/div)
Input Current
(bottom) (A)
Output Voltage (top) (V)
Enable Voltage (middle) (V)
-8
-6
-4
-2
0
2
4
6
8
-0.25
0
0.25
0.5
0.75
1
1.25
1.5
1.75
1.04V
A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
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Functional Description
The AAT1210 consists of a DC/DC boost (step-up) con-
troller, an integrated slew rate controlled input discon-
nect MOSFET switch, and a MOSFET power switch. A
high voltage rectifier, power inductor, capacitors and
resistor divider network are required to implement a DC/
DC boost converter. The minimum output voltage must
be 0.5V above the input voltage and the maximum out-
put voltage is 18V. The operating input voltage range is
2.7V to 5.5V.
Control Loop
The AAT1210 provides the benefits of current mode con-
trol with a simple hysteretic feedback loop. The device
maintains exceptional DC regulation, transient response,
and cycle-by-cycle current limit without additional com-
pensation components.
The AAT1210 modulates the power MOSFET switching
current in response to changes in output voltage. This
allows the voltage loop to directly program the required
inductor current in response to changes in the output
load.
The switching cycle initiates when the N-channel MOSFET
is turned ON and current ramps up in the inductor. The
ON interval is terminated when the inductor current
reaches the programmed peak current level. During the
OFF interval, the input current decays until the lower
threshold, or zero inductor current, is reached. The lower
current is equal to the peak current minus a preset hys-
teresis threshold, which determines the inductor ripple
current. The peak current is adjusted by the controller
until the output current requirement is met.
The magnitude of the feedback error signal determines
the average input current. The AAT1210 controller imple-
ments a programmed current source connected to the
output capacitor and load resistor. There is no right-half
plane zero, and loop stability is achieved with no addi-
tional compensation components.
Functional Block Diagram
GND
SEL
FB2
FB1
EN/SET
VP LIN
Control
Soft-Start
Timer
Output
Select
VREF1
VREF2
VIN
S
W
PGND
A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
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Increased load current results in a drop in the output
feedback voltage (FB1 or FB2) sensed through the feed-
back resistors (R1, R2, R3 in Figure 2). The controller
responds by increasing the peak inductor current, result-
ing in higher average current in the inductor. Alternatively,
decreased output load results in an increase in the out-
put feedback voltage. The controller responds by
decreasing the peak inductor current, resulting in lower
average current in the inductor.
At light load, the inductor OFF interval current goes
below zero, which terminates the off period, and the
boost converter enters discontinuous mode operation.
Further reduction in the load results in a corresponding
reduction in the switching frequency. The AAT1210 pro-
vides optimized light load operation which reduces
switching losses and maintains the highest possible effi-
ciency at light load.
The AAT1210 switching frequency varies with changes in
the input voltage, output voltage, and inductor size.
Once the boost converter has reached continuous mode,
further increases in the output load will not significantly
change the operating frequency and constant ripple cur-
rent in the boost inductor is maintained.
Output Voltage Programming
The FB reference voltage is determined by the logic state
of the SEL pin. The output voltage is programmed
through a resistor divider network (R1, R2, R3) from the
positive output terminal to FB1/FB2 pins to ground.
Pulling the SEL pin high activates the FB1 pin which
maintains a 1.2V reference voltage, while the FB2 refer-
ence is disabled. Pulling the SEL pin low activates the
FB2 pin which maintains a 0.6V reference, while the FB1
reference is disabled. The FB1 and FB2 pins may be tied
together when a static DC output voltage is desired.
Toggling the SEL pin programs the output voltage
between two distinct output voltages across a 2.0X
range (maximum). With FB1, FB2 tied together, the out-
put voltage toggles between two voltages with a 2.0X
scaling factor. An additional resistor between FB1 and
FB2 pins allows toggling between two voltages with a
<2.0X scaling factor.
Alternatively, the output voltage may be dynamically
programmed to any of 16 voltage levels using the
S2Cwire serial digital input. The single-wire S2Cwire
interface provides high-speed output voltage program-
mability across a 2.0X output voltage range. S2Cwire
functionality is enabled by pulling the SEL pin low and
providing S2Cwire digital clock input to the EN/SET pin
which sets the FB2 voltage level from 0.6V to 1.2V.
Table 6 details the FB2 reference voltage versus S2Cwire
rising clock edges.
Soft Start / Enable
The input disconnect switch is activated when a valid
input voltage is present and the EN/SET pin is pulled
high. The slew rate control on the P-channel MOSFET
ensures minimal inrush current as the output voltage is
charged to the input voltage, prior to switching of the
N-channel power MOSFET. Monotonic turn-on is guaran-
teed by the integrated soft-start circuitry.
Soft-start time of approximately 2.5ms is internally pro-
grammed to minimize inrush current and eliminate out-
put voltage overshoot across the full input voltage range
under all loading conditions.
Some applications may require the output to be active
when a valid input voltage is present. In these cases,
add a 10kΩ resistor between the VIN, VP, and EN/SET
pins to avoid startup issues.
Current Limit and
Over-Temperature Protection
The switching of the N-channel MOSFET terminates if
the current limit of 3.0A (minimum) is exceeded. This
minimizes power dissipation and component stresses
under overload and short-circuit conditions. Switching
resumes when the current decays below the current
limit.
Thermal protection disables the AAT1210 if internal
power dissipation becomes excessive. Thermal protec-
tion disables both the N-channel and P-channel MOSFETs.
The junction over-temperature threshold is 140°C with
15°C of hysteresis. The output voltage automatically
recovers when the over-temperature or over-current
fault condition is removed.
Under-Voltage Lockout
Internal bias of all circuits is controlled via the VIN input.
Under-voltage lockout (UVLO) guarantees sufficient VIN
bias and proper operation of all internal circuitry prior to
activation.
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Applications Information
Output Current and Power Capability
The AAT1210 boost converter provides a high voltage,
high current, regulated DC output voltage from a low
voltage DC input. The operating input voltage range is
2.7 to 5.5V.
Figure 1 details the output current and power capability
of the AAT1210 for output voltages from 5V to 18V with
DC input of 2.7V, 3.6V and 4.5V. The maximum output
current/power curves are based on +50°C case tem-
perature rise over ambient using the TDFN34-16 pack-
age. Ambient temperature at 25°C, natural convection is
assumed. Up to 1.3A of output current is possible with
4.5V input voltage. As shown in Figure 1, the output
capability is somewhat reduced at higher output voltage
and reduced input voltage.
The AAT1210 schematic and PCB layout are provided in
Figures 2, 6, and 7. The PCB layout includes a small 1
ounce copper power plane on top and bottom layers
which is tied to the paddle of the TDFN34-16 package.
The top plane is soldered directly to the paddle, and tied
to the bottom layer with plated through vias. Details of
the PCB layout are provided in Figures 6, 7, and 8.
Actual case temperature may vary and depends on the
boost converter efficiency and the system thermal
design; including, but not limited to airflow, local heat
sources, etc. Additional derating may apply.
Selecting the Output Diode
To ensure minimum forward voltage drop and no recov-
ery, a high voltage Schottky diode is considered the best
choice for use with the AAT1210 boost converter. The
AAT1210 output diode is sized to maintain acceptable
efficiency and reasonable operating junction tempera-
ture under full load operating conditions. Forward volt-
age (VF) and package thermal resistance (θJA) are the
dominant factors to consider in selecting a diode. The
diode’s published current rating may not reflect actual
operating conditions and should be used only as a com-
parative measure between similarly rated devices. 20V
rated Schottky diodes are recommended for outputs less
than 15V, while 30V rated Schottky diodes are recom-
mended for outputs greater than 15V.
The switching period is divided between ON and OFF
time intervals.
= TON + TOFF
1
FS
AAT1210 Boost Converter Maximum Output Capability
Output Voltage (V)
Maximum Output Current (mA)
Maximum Output Power (W)
0
200
400
600
800
1000
1200
1400
5 6 7 8 91011 1213 1415 1617 18
0
1
2
3
4
5
6
7
VIN = 4.5V
VIN = 3.6V
Output Current
Output Power
VIN = 2.7V
Figure 1: Maximum Output Power Vs. Output Voltage for TC(RISE) = +50ºC
(assumes TDFN34-16 paddle heatsinking; see Figures 6, 7, and 8).
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During the ON time, the N-channel power MOSFET is
conducting and storing energy in the boost inductor.
During the OFF time, the N-channel power MOSFET is
not conducting. Stored energy is transferred from the
input supply and boost inductor to the output load
through the output diode. Duty cycle is defined as the
ON time divided by the total switching interval.
T
ON
T
ON
+ T
OFF
D =
= T
ON
⋅ F
S
The maximum duty cycle can be estimated from the
relationship for a continuous mode boost converter.
Maximum duty cycle (DMAX) is the duty cycle at minimum
input voltage (VIN(MIN)).
V
OUT
- V
IN(MIN)
V
OUT
D
MAX
=
The average diode current during the OFF time can be
estimated.
I
OUT
1 - D
MAX
I
AVG(OFF)
=
The following curves show the VF characteristics for dif-
ferent Schottky diodes (100°C case). The VF of the
Schottky diode can be estimated from the average cur-
rent during the off time.
Forward Voltage (V)
Forward Current (mA)
10
100
1000
10000
0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70
B340LA
MBR0530
ZHCS350
BAT42W
Figure 3: Forward Voltage vs. Forward Current
for Various Schottky Diodes.
The average diode current is equal to the output current.
IAVG(TOT) = IOUT
D1 Schottky
1
2
3
Enable
JP1
1
2
3
Select
JP2
4.7μF
C1
U1 AAT1210 TDFN34-16
C1 6.3V 0603 4.7μF
C2 10V 0805 10μF
D1 30V 0.5A MBR0530T1 SOD-123
L1 0.47μH SD10-R47-R
R1 36.5k 0603
R2 549 0603
R3 4.99k 0603
R4 10k 0603
VP
16
VP
15
EN/SET
14
SEL
13
PGND
8
PGND
7
PGND
6
GND
5
FB2
4
FB1
3
LIN
2
LIN
1
VIN
12
N/C
11
SW
10
SW
9
AAT1210_TDFN34-16
U1 VIN: 2.7V to 5.5V
C2
10μF
10V R2
549
R1
36.5k
R3
4.99k
9V at 300mA
5V at 600mA
L1
0.47μH
R4
10K
Figure 2: AAT1210 Demo Board Schematic.
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The average output current multiplied by the forward
diode voltage determines the loss of the output diode.
PLOSS_DIODE = IAVG · VF
= IOUT · VF
Diode junction temperature can be estimated.
TJ= TAMB + ΘJA · PLOSS_DIODE
The junction temperature should be maintained below
110ºC, but may vary depending on application and/or
system guidelines. The diode θJA can be minimized with
additional PCB area on the cathode. PCB heatsinking the
anode may degrade EMI performance.
The reverse leakage current of the rectifier must be con-
sidered to maintain low quiescent (input) current and
high efficiency under light load. The rectifier reverse cur-
rent increases dramatically at high temperatures.
Additional considerations may apply to satisfy short cir-
cuit conditions. A short circuit across the output termi-
nals results in high currents through the inductor and
output diode. The output diode must be sized to prevent
damage and possible failure of the diode under short
circuit conditions. The inductor may saturate without
incurring damage.
When current limit of (3A minimum) is reached, switch-
ing of the low side N-channel MOSFET is disabled.
Although switching is disabled, DC current continues to
build to a level determined by the DC resistance in the
path of current flow. For portable applications, the
source resistance (RSOURCE) of the Li-ion battery pack is
between 100-300mΩ and should also be considered.
ISHT-CKT(MAX) = (VIN(MAX) - VF)
(RSOURCE + RDC + RDS(ON)IN)
The AAT1210 controller will generate an over-tempera-
ture (OT) event under extended short circuit conditions.
OT disables the high side P-channel MOSFET, which ter-
minates current flow in the output diode. Current flow
continues when OT hysteresis (cool-down) is met. This
continues until the short circuit condition is removed. In
portable applications, the battery pack over-current pro-
tection may be enabled prior to an OT event.
The diode non-repetitive peak surge current (IFSM) rating
should be greater than ISHT_CKT(MAX) to ensure diode reli-
ability under short circuit conditions. Typically, IFSM cur-
rent is specified for conduction periods from 8-10ms. If
short circuit survivability is required, it is recommended
to verify ISHT_CKT(MAX) under actual operating conditions
across the expected operating temperature range.
Selecting the Boost Inductor
The AAT1210 controller utilizes hysteretic control and
the switching frequency varies with output load and
input voltage. The value of the inductor determines the
maximum switching frequency of the boost converter.
Increased output inductance decreases the switching
frequency, resulting in higher peak currents and increased
output voltage ripple. The required inductance increases
with increasing output voltage. The inductor is sized
from 0.47μH to 2.2μH for output voltages from 5V to
18V. This selection maintains high frequency switching
(up to 2MHz), low output ripple and minimum solution
size. A summary of recommended inductors and capaci-
tors for 5V to 18V fixed outputs is provided in Table 2.
The physical size of the inductor may be reduced when
operating at greater than 2.7V input voltage and/or less
than maximum rated output power is desired (see Figure
1 for maximum output power estimate). Figure 4 pro-
vides the peak inductor current (IPEAK) versus output
power for different input voltage levels. The curves are
valid for all output voltages and assume the correspond-
ing inductance value provided in Figure 4. The inductor
is selected to maintain IPEAK current less than the speci-
fied saturation current (ISAT).
Output Power (W)
Peak Inductor Current (mA)
0
500
1000
1500
2000
2500
3000
3500
0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0
VIN = 4.5V
VIN = 3.6V
VIN = 2.7V
Figure 4: Peak Inductor Current (IPEAK)
vs. Output Power.
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The RMS current flowing through the boost inductor is
equal to the DC plus AC ripple components. Under
worst-case RMS conditions, the current waveform is
critically continuous. The resulting RMS calculation yields
worst-case inductor loss. The RMS value should be com-
pared against the manufacturer’s temperature rise, or
thermal derating, guidelines.
I
PEAK
I
RMS
=
3
In most cases, the inductor’s specified IRMS current will
be greater than the IRMS current required by the boost
inductor.
For a given inductor type, smaller inductor size leads to
an increase in DCR winding resistance and, in most
cases, increased thermal impedance. Winding resistance
degrades boost converter efficiency and increases the
inductor operating temperature.
PLOSS_INDUCTOR = IRMS2 · DCR
To ensure high reliability, the inductor temperature
should not exceed 100°C. Manufacturer’s recommenda-
tions should be consulted. In some cases, PCB heatsink-
ing applied to the AAT1210 LIN node (non-switching)
can improve the inductor’s thermal capability. PCB heat-
sinking may degrade EMI performance when applied to
the SW node (switching) of the AAT1210.
Shielded inductors provide decreased EMI and may be
required in noise sensitive applications. Unshielded chip
inductors provide significant space savings at a reduced
cost compared to shielded (wound and gapped) induc-
tors. Chip-type inductors have increased winding resis-
tance when compared to shielded, wound varieties.
Selecting DC/DC Boost Capacitors
Recommended input and output capacitors for output
voltages from 5V to 18V are provided in Table 4.
The high output ripple inherent in the boost converter
necessitates low impedance output filtering. Multi-layer
ceramic (MLC) capacitors provide small size and high
capacitance, low parasitic equivalent series resistance
(ESR) and equivalent series inductance (ESL), and are
well suited for use with the AAT1210 boost regulator.
MLC capacitors of type X7R or X5R are recommended to
ensure good capacitance stability over the full operating
temperature range.
The output capacitor is sized to maintain the output load
without significant voltage droop (ΔVOUT) during the
power switch ON interval, when the output diode is not
conducting. A ceramic output capacitor from 4.7μF to
10μF is recommended. Output capacitors should be rated
from 10V to 25V, depending on the maximum desired
output voltage. Ceramic capacitors sized as small as
0603 are available which meet these requirements.
Manufacturer Part Number
Rated Forward
Current (A)
Non-Repetitive
Peak Surge
Current (A)
Rated
Voltage (V)
Thermal
Resistance
(θJA, °C/W) Case
Diodes, Inc. BAT42W 0.2 4.0 30 500 SOD-123
ON Semi MBR0530T 0.5 5.5 30 206 SOD-123
Zetex ZHCS350 0.35 4.2 40 330 SOD-523
Central Semi CMDSH2-3 0.2 1.0 30 500 SOD-323
Table 1: Typical Surface Mount Schottky Rectifiers for Various Output Levels.
VOUT C1 (Input Capacitor) C2 (Output Capacitor) L1 (Boost Inductor)
5.0 4.7μF10μF/6.3V, 10V 0.47μH
9.0 4.7μF10μF/10V 0.47μH
12.0 4.7μF10μF/16V 1.0/1.2μH
15.0 4.7μF10μF/16V 1.0/1.2μH
18.0 4.7μF 4.7μF/25V 2.2μH
Table 2: Output Inductor and Capacitor Values Vs. Output Voltage
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Manufacturer Part Number
Inductance
(μH)
Max
DC ISAT
Current
(A)
Max
IRMS
Current
(A)
DCR
(mΩ)
Size
LxWxH
(mm) Type
Sumida
www.sumida.com
CDRH5D16-1R4 1.4 4.7 4.7 14.6 5.8x5.8x1.8 Shielded
CDRH5D16-1R4 2.2 3.0 2.85 35.9 5.8x5.8x1.8 Shielded
CDRH3D11/HP-1R5 1.5 2.0 1.45 80 4.0x4.0x1.2 Shielded
CDRH3D11/HP-2R7 2.7 1.55 1.3 100 4.0x4.0x1.2 Shielded
Murata
www.murata.com
LQH55DNR47M03 0.47 4.8 - 13 5.7x5.0x4.7 Non-Shielded
LQH55DN1R0M03 1.0 4.0 - 19 5.7x5.0x4.7 Non-Shielded
LQH55DN1R5M03 1.5 3.7 - 22 5.7x5.0x4.7 Non-Shielded
LQH55DN2R2M03 2.2 3.2 - 29 5.7x5.0x4.7 Non-Shielded
Cooper
www.cooperet.com
SD3814-R47 0.47 4.44 2.81 20 4.0x4.0x1.4 Shielded
SD3814-1R2 1.2 2.67 1.85 46 4.0x4.0x1.4 Shielded
SD3814-2R2 2.2 1.9 1.43 77 4.0x4.0x1.4 Shielded
SD10-R47-R 0.47 3.54 2.59 24.9 5.2x5.2x1.0 Shielded
SD10-1R0-R 1 2.25 1.93 44.8 5.2x5.2x1.0 Shielded
SD10-2R2-R 2.2 1.65 1.35 91.2 5.2x5.2x1.0 Shielded
SD18-2R2-R 2.2 2.16 2.55 39.8 5.2x5.2x1.8 Shielded
Table 3: Recommended Inductors.
Manufacturer Part Number Value (μF)
Voltage
Rating (V)
Temp.
Co. Case Size
Murata
www.murata.com
GRM188R60J475KEAD 4.7 6.3 X5R 0603
GRM21BR61A475KA73L 4.7 10 X5R 0805
GRM21BR61E475KA12L 4.7 25 X5R 0805
GRM188R60J106ME47D 10 6.3 X5R 0603
GRM21BR61A106KE19L 10 10 X5R 0805
GRM219R61A106KE44D 10 10 X5R 0805 (H = 0.85mm)
GRM21BR61C106KE15L 10 16 X5R 0805
Table 4: Recommended MLC Capacitors.
Minimum 6.3V rated ceramic capacitors are required at
the input. Ceramic capacitors sized as small as 0603 are
available which meet these requirements. Output capac-
itors should be rated from 6.3V to 25V, depending on the
maximum desired output voltage.
MLC capacitors exhibit significant capacitance reduction
with applied voltage. Output ripple measurements should
confirm that output voltage droop and converter stability
is acceptable. Voltage derating can minimize this factor,
but results may vary with package size and among spe-
cific manufacturers.
Output capacitor size can be estimated at a switching
frequency (FSW) of 500kHz (worst-case).
I
OUT
· D
MAX
F
S
· ΔV
OUT
C
OUT
=
The boost converter input current flows during both ON
and OFF switching intervals. The input ripple current is
less than the output ripple and, as a result, less input
capacitance is required. A ceramic output capacitor from
4.7μF to 10μF is recommended. The voltage rating of
the capacitor must be greater than, or equal to, the
maximum operating output voltage. X5R ceramic capac-
itors are available in 6.3V, 10V, 16V and 25V rating.
Ceramic capacitors sized as small as 0603 are available
which meet these requirements.
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Minimum 6.3V rated ceramic capacitors are required at
the input. Ceramic capacitors sized as small as 0603 are
available which meet these requirements.
Setting the Output Voltage
The minimum output voltage must be greater than the
specified maximum input voltage plus 0.5V margin to
maintain proper operation of the AAT1210 boost con-
verter. The output voltage may be programmed through
a resistor divider network located from the output to FB1
and FB2 pins to ground. Pulling the SEL pin high acti-
vates the FB1 pin which maintains a 1.2V reference volt-
age, while the FB2 reference is disabled. Pulling the SEL
pin low activates the FB2 pin which maintains a 0.6V
reference, while the FB1 reference is disabled.
The AAT1210 output voltage can be programmed by one
of three methods. First, the output voltage can be static
by pulling the SEL logic pin either high or low. Second,
the output voltage can be dynamically adjusted between
two pre-set levels within a 2X operating range by tog-
gling the SEL logic pin. Third, the output can be dynam-
ically adjusted to any of 16 preset levels within a 2X
operating range using the integrated S2Cwire single wire
interface via the EN/SET pin. See Table 5 for static and
dynamic output voltage settings.
Table 5 provides details of resistor values for common
output voltages from 5V to 18V for SEL = High and SEL
= Low options. SEL = High corresponds to VOUT(1) and
SEL = Low corresponds to VOUT(2).
Option 1: Static Output Voltage
Most DC/DC boost converter applications require a
static (fixed) output voltage. If a static voltage is
desired, the FB1 pin should be connected directly to FB2
and a resistor between FB1 and FB2 pins is not
required.
A static output voltage can be configured by pulling the
SEL either high or low. SEL pin high activates the FB1
reference pin to 1.2V (nominal). Alternatively, the SEL
pin is pulled low to activate the FB2 reference at 0.6V
(nominal). Table 5 provides details of resistor values for
common output voltages from 5V to 18V for SEL = High
and SEL = Low options.
Option 2: Dynamic Voltage Control Using
SEL Pin
The output may be dynamically adjusted between two
output voltages by toggling the SEL logic pin. Output
voltages VOUT(1) and VOUT(2) correspond to the two output
references, FB1 and FB2. Pulling the SEL logic pin high
activates VOUT(1), while pulling the SEL logic pin low acti-
vates VOUT(2).
In addition, the ratio of output voltages VOUT(2)/VOUT(1) is
always less than 2.0, corresponding to a 2X (maximum)
programmable range.
Option 3: Dynamic Voltage Control Using
S2Cwire Interface
The output can be dynamically adjusted by the host
controller to any of 16 pre-set output voltage levels
using the integrated S2Cwire interface. The EN/SET pin
serves as the S2Cwire interface input. The SEL pin must
be pulled low when using the S2Cwire interface.
S2Cwire Serial Interface
AnalogicTech’s S2Cwire serial interface is a proprietary
high-speed single-wire interface. The S2Cwire interface
records rising edges of the EN/SET input and decodes
into 16 different states. Each state corresponds to a
voltage setting on the FB2 pin, as shown in Table 6.
S2Cwire Output Voltage Programming
The AAT1210 is programmed through the S2Cwire inter-
face according to Table 6. The rising clock edges received
through the EN/SET pin determine the feedback refer-
ence and output voltage set-point. Upon power-up with
the SEL pin low and prior to S2Cwire programming, the
default feedback reference voltage is set to 0.6V.
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VOUT(1)
(SEL = High)
VOUT(2)
(SEL = Low)
R3 = 4.99kΩ
R1 (kΩ) R2 (kΩ)
5.0V - 15.8 0
6.0V - 20.0 0
7.0V - 24.3 0
8.0V - 28.0 0
9.0V - 32.4 0
10.0V - 36.5 0
12.0V - 44.2 0
15.0V - 57.6 0
16.0V - 61.9 0
18.0V - 69.8 0
- 5.0V 36.5 0
- 6.0V 45.3 0
- 7.0V 53.6 0
- 8.0V 61.9 0
- 9.0V 69.8 0
- 10.0V 78.7 0
- 12.0V 95.3 0
- 15.0V 121 0
- 16.0V 127 0
- 18.0V 143 0
9.0V 5.0V 36.5 0.549
10.0V 9.0V 66.5 4.02
12.0V 10.0V 75 3.32
15.0V 10.0V 76.8 1.65
15.0V 12.0V 90.9 3.01
16.0V 10.0V 76.8 1.24
18.0V 10.0V 78.7 0.562
15.0V 12.0V 90.9 3.01
16.0V 12.0V 93.1 2.49
18.0V 12.0V 93.1 1.65
18.0V 15.0V 115 3.32
Table 5: SEL Pin Voltage Control Resistor Values
(1% resistor tolerance).
EN/SET
Rising
Edges
FB2
Reference
Voltage (V)
EN/SET
Rising
Edges
FB2
Reference
Voltage (V)
1 0.60 (Default) 9 0.92
2 0.64 10 0.96
3 0.68 11 1.00
4 0.72 12 1.04
5 0.76 13 1.08
6 0.80 14 1.12
7 0.84 15 1.16
8 0.88 16 1.20
Table 6: S2Cwire Voltage Control Settings
(SEL = Low).
S2Cwire Serial Interface Timing
The S2Cwire serial interface has flexible timing. Data can
be clocked-in at speeds up to 1MHz. After data has been
submitted, EN/SET is held high to latch the data for a
period TLAT
. The output is subsequently changed to the
predetermined voltage. When EN/SET is set low for a time
greater than TOFF
, the AAT1210 is disabled. When disabled,
the register is reset to the default value, which sets the
FB2 pin to 0.6V if EN is subsequently pulled high.
PCB Layout
Boost converter performance can be adversely affected by
poor layout. Possible impact includes high input and out-
put voltage ripple, poor EMI performance, and reduced
operating efficiency. Every attempt should be made to
optimize the layout in order to minimize parasitic PCB
effects (stray resistance, capacitance, inductance) and
EMI coupling from the high frequency SW node.
A suggested PCB layout for the AAT1210 boost converter
is shown in Figures 6, 7, and 8. The following PCB layout
guidelines should be considered:
1.
Minimize the distance from Capacitor C1 and C2 nega-
tive terminal to the PGND pins. This is especially true
with output capacitor C2, which conducts high ripple
current from the output diode back to the PGND pins.
2.
Place the feedback resistors close to the output termi-
nals. Route the output pin directly to resistor R1 to
maintain good output regulation. R3 should be rout-
ed close to the output GND pin, but should not share
a significant return path with output capacitor C2.
3. Minimize the distance between L1 to D1 and switch-
ing pin SW; minimize the size of the PCB area con-
nected to the SW pin.
4. Maintain a ground plane and connect to the IC PGND
pin(s) as well as the GND terminals of C1 and C2.
5. Consider additional PCB area on D1 cathode to
maximize heatsinking capability. This may be neces-
sary when using a diode with a high VF and/or ther-
mal resistance.
6. To maximize thermal capacity, connect the exposed
paddle to the top and bottom power planes using
plated through vias. Top and bottom planes should
not extend far beyond the TDFN34-16 package
boundary to minimize stray EMI.
7. To avoid problems at startup, add a 10kΩ resistor
between the VIN, VP and EN/SET pins (R4). This is
critical in applications requiring immunity from input
noise during “hot plug” events, e.g. when plugged
into an active USB port.
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1
EN/SET
2n-1 n ≤ 16
Data Reg 0n-1
0
THI
TLO TLAT TOFF
Figure 5: S2Cwire Timing Diagram.
Figure 6: AAT1210 Evaluation Board Figure 7: AAT1210 Evaluation Board
Top Side Layout. Bottom Side Layout.
Figure 8: Exploded View of AAT1210 Evaluation Board
Top Side Layout Detailing Plated Through Vias.
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PRODUCT DATASHEET
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A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
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Ordering Information
Package Marking1Part Number (Tape and Reel)2
TDFN34-16 VDXYY AAT1210IRN-0.6-T1
All AnalogicTech products are offered in Pb-free packaging. The term “Pb-free” means semiconductor
products that are in compliance with current RoHS standards, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. For more information, please visit our website at
http://www.analogictech.com/about/quality.aspx.
Package Information3
TDFN34-16
3.000
±
0.050 1.600
±
0.050
0.050
±
0.050 0.229
±
0.051
(4x)
0.850 MAX
4.000
±
0.050
3.300
±
0.050
Index Area
Detail "A"
Top View Bottom View
Side View
0.350
±
0.100
0.230
±
0.0500.450
±
0.050
Detail "A"
Pin 1 Indicator
(optional)
C0.3
All dimensions in millimeters.
1. XYY = assembly and date code.
2. Sample stock is generally held on part numbers listed in BOLD.
3. The leadless package family, which includes QFN, TQFN, DFN, TDFN and STDFN, has exposed copper (unplated) at the end of the lead terminals due to the manufacturing
process. A solder fillet at the exposed copper edge cannot be guaranteed and is not required to ensure a proper bottom solder connection.
A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
1210.2007.12.1.4 21
www.analogictech.com
A AT 1210
High Power DC/DC Boost Converter with Optional Dynamic Voltage ProgrammingSwitchRegTM
PRODUCT DATASHEET
1210.2007.12.1.4 21
www.analogictech.com
Advanced Analogic Technologies, Inc.
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Phone (408) 737-4600
Fax (408) 737-4611
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