MTFC8GLWDM-3M AIT Z
Data Sheets (1)
MTFC4GMWDM-3M AIT, MTFC8GLWDM-3M AIT Z, MTFC8GLWDM-AIT Z, MTFC16GLWDM-4M AIT Z,
MTFC32GJWEF-4M AIT Z (Controller ID= W)
File Type: PDF Updated: 07/2015
Data Sheet
R
4–32GB eMMC v4.51 TFBGA153 & TFBGA169 (Automotive, IT) Data Sheet Automotive
Embedded Memory Solutions
eMMC
Managed NAND
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Specs
Orderable Parts for: MTFC8GLWDM-3M AIT Z
Status Media FBGA
Code
SPD
Data
Chipset
Validation PLP Start
Date
Alternative
Part
MTFC8GLWDM-3M AIT
ZProduction N/A HBBSN N/A N/A No N/A
Detailed Specifications
Part
Status
Code
Production Applications Automotive Density 8GB Bus Width x8
Voltage 2.7V-3.6V Package TFBGA Pin Count 153-ball Package
Size
11.5 x 13 x
1.2
MMC
Interface 4.5 RoHS Yes Operating
Temp -40C to +85C
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RoHS Certificates
RoHS Certificate of Compliance (PDF)
Part-specific certification of how this product meets the requirements of the current DIRECTIVE
2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.
File Type: (PDF) Updated: 02/2017
RoHS Certificates
MTFC8GLWDM 3M AIT Z
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China RoHS Certificate (PDF)
Part-specific certification as required by China's Management Methods for Controlling Pollution by
Electronic Information Products.
File Type: (PDF) Updated: 02/2017
RoHS Certificates
MTFC8GLWDM 3M AIT Z
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Documentation & Support
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Technical Notes
SEARCH (54) TECHNICAL NOTES
(PDF)
(TN-00-08) Describes some considerations in thermal applications for Micron memory devices
File Type: PDF Updated: 01/24/2017
Technical Notes
TN-00-08: Thermal Applications DRAM
Managed NAND
Multichip Packages
NAND Flash
See More Tags
DOWNLOAD
(PDF)
(TN-13-49) This technical note discusses the adverse effects of high temperature and PROGRAM/
ERASE (P/E) cycles on flash memory data retention and how the REFRESH operation can be used to
mitigate these adverse effects.
File Type: PDF Updated: 10/31/2016
Technical Notes
R
TN-13-49: SLC NAND Device Refresh NAND Flash
SLC NAND
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(PDF)
(TN-29-14) This technical note highlights the significant performance gains realized when using the
PROGRAM PAGE CACHE MODE command in Micron's NAND Flash devices.
File Type: PDF Updated: 09/29/2016
Technical Notes
TN-29-14: NAND Flash Performance Increase Using PROGRAM PAGE CACHE MODE
Command
NAND Flash
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(PDF)
(TN-29-25) This technical note describes the performance benefits of Micron two-plane commands
and provides implementation guidelines for making the best use of two-plane capabilities.
File Type: PDF Updated: 09/29/2016
Technical Notes
TN-29-25: Improving NAND Flash Performance Using Two-Plane Command Enabled
Micron Devices
NAND Flash
DOWNLOAD
(PDF)
(TN-29-42) This technical note highlights the importance of wear leveling, explains two wear-
leveling techniques, and discusses implementing wear leveling.
File Type: PDF Updated: 09/29/2016
Technical Notes
TN-29-42: Wear-Leveling Techniques in NAND Flash Devices NAND Flash
DOWNLOAD
SEARCH (54) TECHNICAL NOTES
Customer Service Note
Customer Service Note
(PDF)
(CSN-04) This customer service note describes the standard shipping quantity, box quantity, and
types such as tape and reel for Micron's products.
File Type: PDF Updated: 07/18/2016
Customer Service Note
Shipping Quantities DRAM
DRAM Modules
Hybrid Memory Cube
Multichip Packages
See More Tags
DOWNLOAD
(PDF)
(CSN-20) Provides complete shipping and recycling information about each of the materials used
for shipping Micron's products.
Customer Service Note
Wafer Packaging and Packaging Materials DRAM
NAND Flash
File Type: PDF Updated: 06/21/2016 DOWNLOAD
SEARCH (2) CUSTOMER SERVICE NOTE
Parts with the same Data Sheet (4)
MTFC8GLWDM-3M AIT Z
( Current )
MTFC4GMWDM-3M AIT MTFC16GLWDM-4M AIT Z MTFC32GJWEF-4M AIT Z
Part Status
Code Production Production Production Production
Applications Automotive Automotive Automotive Automotive
Density 8GB 4GB 16GB 32GB
Bus Width x8 x8 x8 x8
Voltage 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V
Package TFBGA TFBGA TFBGA TFBGA
Pin Count 153-ball 153-ball 153-ball 169-ball
Package Size 11.5 x 13 x 1.2 11.5 x 13 x 1.2 11.5 x 13 x 1.2 14 x 18 x 1.2
MMC
Interface 4.5 4.5 4.5 4.5
RoHS Yes Yes Yes Yes
Operating
Temp -40C to +85C -40C to +85C -40C to +85C -40C to +85C
B
D
Where to Buy
Orderable Parts
Status Media FBGA
Code
SPD
Data
Chipset
Validation PLP Start
Date
Alternative
Part
MTFC8GLWDM-3M AIT
ZProduction N/A HBBSN N/A N/A No N/A
MTFC8GLWDM-3M AIT Z
( Current )
Part Status
Code Production
Applications Automotive
Density 8GB
Bus Width x8
Voltage 2.7V-3.6V
Package TFBGA
Pin Count 153-ball
Package Size 11.5 x 13 x 1.2
MMC
Interface 4.5
RoHS Yes
Operating
Temp -40C to +85C
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