Memory Module Specifications HX328C12T2K2/8 8GB (4GB 512M x 64-Bit x 2 pcs.) DDR3-2800 CL12 240-Pin DIMM Kit SPECIFICATIONS CL(IDD) 11 cycles Row Cycle Time (tRCmin) 48.125ns (min.) Refresh to Active/Refresh Command Time (tRFCmin) 260ns (min.) Row Active Time (tRASmin) 35ns (min.) Maximum Operating Power 2.160 W* (per module) UL Rating 94 V - 0 Operating Temperature 0o C to 85o C Storage Temperature -55o C to +100o C *Power will vary depending on the SDRAM used. FEATURES DESCRIPTION * * * * JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply * * * * Programmable CAS Latency: 11, 10, 9, 8, 7, 6 Bi-directional Differential Data Strobe XMP TIMING PARAMETERS * * * * * * * On Die Termination using ODT pin * * Asynchronous Reset Kingston's HX328C12T2K2/8 is a kit of two 512M x 64-bit (4GB) DDR3-2800 CL12 SDRAM (Synchronous DRAM), 1Rx8 memory modules, based on eight 512M x 8-bit FBGA components per module. Each module kit supports Intel XMP (R) (Extreme Memory Profiles). Total kit capacity is 8GB. Each module kit has been tested to run at DDR3-2800 at a low latency timing of 12-15-15 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold contac fingers. The JEDEC standard electrical and mechanical specifications are as follows: JEDEC: DDR3-1600 CL11-11-11 @1.5V XMP Profile #1: D3-2800 CL12-15-15 @1.65V XMP Profile #2: D3-2666 CL11-15-15 @1.65V VDDQ = 1.5V (1.425V ~ 1.575V) 800MHz fCK for 1600Mb/sec/pin 8 independent internal bank Programmable Additive Latency: 0, CL - 2, or CL - 1 clock 8-bit pre-fetch Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm 1%) Average Refresh Period 7.8us at lower than TCASE 85C, 3.9us at 85C < TCASE < 95C PCB : Height 2.118" (53.80mm) w/heatsink, single sided component Continued >> Document No. 4807276-001.B00 04/22/15 Page 1 continued HyperX MODULE WITH HEAT SPREADER 8.12 mm 53.8 mm 133.35 mm MODULE DIMENSIONS FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components. Document No. 4807276-001.B00 Page 2