The documentation and process conversion measures necessary to comply with this revision shall be completed by 4 May 2016. INCH-POUND MIL-PRF-19500/463L 4 February 2016 SUPERSEDING MIL-PRF-19500/463K 24 January 2014 PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICE, DIODE, SILICON, CURRENT REGULATOR, ENCAPSULATED (THROUGH-HOLE AND SURFACE MOUNT PACKAGES), AND UN-ENCAPSULATED (DIE), TYPES 1N5283 THROUGH 1N5314, AND, 1N7048 THROUGH 1N7055, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC This specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product described herein shall consist of this specification sheet and MIL-PRF-19500. 1. SCOPE 1.1 Scope. This specification covers the performance requirements for 100 volt, silicon, current regulator diodes. Four levels of product assurance (JAN, JANTX, JANTXV, and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500. Two levels of product assurance (JANHC and JANKC) are provided for each unencapsulated device type. * 1.2 Package outlines and die topography. The device package for the encapsulated device types are as follows: DO-7 in accordance with figure 1, surface mount version DO-213AB in accordance with figure 2, and surface mount versions UB in accordance with figure 3. The dimensions and topography for JANHC and JANKC unencapsulated die are as follows: A version die in accordance with figure 4, B version die in accordance with figure 5. * 1.3 Maximum ratings. Maximum ratings are as shown in maximum test ratings (see 3.10) and as follows: a. PT = 500 mW (DO-7) at TL = +50C, L = .375 inch (9.53 mm); both ends of case or diode body to heat sink at L = .375 inch (9.53 mm). (Derate to 0 at +175C). b. PT = 500 mW (DO-213AB) at TEC = +125C. (Derate to 0 at +175C). c. PT = 500 mW (UB) at TSP = +125C. (Derate to 0 at +175 C) d. -65C TJ +175C; -65C TSTG +175C. For UB devices, -65C TJ +175C; -65C TSTG +200C. * 1.4 Primary electrical characteristics. Primary electrical ratings are as shown in maximum test ratings (see 3.10) and as follows, (nominally .22 mA dc IS 4.70 mA dc, (symbol "IP" may be used in place of symbol "IS"): a. RJL = 250C/W (maximum) at L = .375 inch (9.53 mm) (DO-7). b. RJC = 100C/W (maximum) junction to end-caps (DO-213AB). c. RJSP(IS) = 100C/W (maximum) junction to solder pad (infinite sink) (UB). Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime, ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductor@dla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https://assist.dla.mil/. AMSC N/A FSC 5961 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L DO-7 Symbol BD BL LD LL LL 1 Dimensions Inches Millimeters Min Max Min Max .060 .107 1.52 2.72 .120 .300 3.05 7.62 .018 .023 0.46 0.58 1.000 1.500 25.40 38.10 0.050 1.27 NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. The minimum body diameter shall be maintained over .15 inch (3.81 mm) inch of body length. 4. The specified lead diameter applies in the zone between .050 inch (1.27 mm) and the end of the lead. Outside of this zone the lead diameter shall not exceed LD. 5. Both leads shall be within the specified dimension. 6. See 3.3 for L and TL definitions. 7. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. FIGURE 1. Physical dimensions (DO-7). 2 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L DO-213AB Symbol BD BL ECT S Dimensions Inches Millimeters Min Max Min Max .094 .105 2.39 2.67 .189 .205 4.80 5.21 .016 .022 0.41 0.55 .001 min 0.03 min NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. FIGURE 2. Physical dimensions (DO-213AB). 3 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L UB UBCA UB 2 UBCC UBD 1 Symbol BH BL BW CL CW LL1 LL2 NOTES: 1. 2. 3. 4. 5. Dimensions Inches Millimeters Max Min Min Max .046 .056 1.17 1.42 .115 .128 2.92 3.25 .085 .108 2.16 2.74 .128 3.25 .108 2.74 .022 .038 0.56 0.97 .017 .035 0.43 0.89 Symbol LS1 LS2 LW r r1 r2 Dimensions Inches Millimeters Min Max Min Max .035 .039 0.89 0.99 .071 .079 1.80 2.01 .016 .024 0.41 0.61 .008 0.20 .012 0.31 .022 0.56 Dimensions are in inches. Millimeters are given for general information only. Ceramic package only. Hatched areas on package denote metallized areas. Pad 4 = shielding, connected to the lid. Dimensions are pre-solder dip. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. * FIGURE 3. Physical dimensions, surface mount (UB version). 4 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L Symbol A B Dimensions Inches Millimeters Min Max Min Max .012 .014 0.305 0.355 .026 .030 0.660 0.762 Design data Metallization: Top: (Anode) ......... Al Back: (Cathode) .... Au Al thickness ............ 25000 A Min Gold thickness ........ 4000 A Min Chip thickness ....... .010 .002 inch (0.254 0.0508 mm) NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. FIGURE 4. Physical dimensions, JANHCA and JANKCA die. 5 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L Ltr A B Inches Min Max .006 .007 .022 .026 Millimeters Min Max 0.152 0.178 0.559 0.660 Design data Metallization: Top: (Anode) ......... Al Back: (Cathode) .... Au Al thickness ............ 25000 A Min Gold thickness ........ 4000 A Min Chip thickness ....... .010 .002 inch (0.254 0.0508 mm) NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. FIGURE 5. Physical dimensions, JANHCB and JANKCB die. 6 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L * 1.5 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-19500, and as specified herein. See 6.5 for PIN construction example and 6.6 for a list of available PINs. * 1.5.1 JAN certification mark and quality level. * 1.5.1.1 Quality level designators for encapsulated devices. The quality level designators for encapsulated devices that are applicable for this specification sheet from the lowest to the highest level are as follows: "JAN", "JANTX", "JANTXV", and "JANS". * 1.5.1.2 Quality level designators for unencapsulated devices (die). The quality level designators for unencapsulated devices (die) that are applicable for this specification sheet from the lowest to the highest level are as follows: "JANHC" and "JANKC". * 1.5.2 Device type. The designation system for the device types covered by this specification sheet are as follows. * 1.5.2.1 First number and first letter symbols. The diode of this specification sheet use the first number and letter symbols "1N". * 1.5.2.2 Second number symbols. The second number symbols covered by this specification sheet are as follows: "5283" through "5314", and "7048" through "7055". 1.5.3 Suffix symbols. The following suffix symbols are incorporated in the PIN as applicable. UR Indicates a surface mount, round endcap, package (see figure 2). UB Indicates a surface mount UB package (see figure 3).(UB, UBCA, UBCC, and UBDD) -1 Indicates a high temperature metallurgical bond of a type I or II (see 3.5 and 6.4 herein). * 1.5.4 Lead finish. The lead finishes applicable to this specification sheet are listed on QPDSIS-19500. * 1.5.5 Die identifiers for unencapsulated devices (manufacturers and critical interface identifiers). The manufacturer die identifiers that are applicable for this specification sheet are "A" and "B" (see figure 4, figure 5 and 6.6.2). 2. APPLICABLE DOCUMENTS * 2.1 General. The documents listed in this section are specified in sections 3, and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-19500 - Semiconductor Devices, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-750 - Test Methods for Semiconductor Devices. * (Copies of these documents are available online at http://quicksearch.dla.mil.) 7 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L 2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained 3. REQUIREMENTS 3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein. 3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list (QML) before contract award (see 4.2 and 6.3). 3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions shall be as specified in MIL-PRF-19500 and as follows: IP IP Pinch-off current. IP pinch-off current is defined as the regulator current at specified test voltage, VS. Regulator current variation. Temperature coefficient of regulator current. IS Pinch-off current. IS pinch-off current is defined as the regulator current at specified test voltage, VS. IS is the preferred symbol however IP can still be used. Regulator current variation. Temperature coefficient of regulator current. Lead thermal path length. Lead thermal path length is the distance from the end of the diode body to the point of lead-temperature measurement. For purposes of this measurement, the same heat sinking at the same distance from the diode body shall be applied to each lead. No heat sinking shall occur between the diode body and the point of lead-temperature measurement. This measurement may be made from either end of the diode body. (The diode body includes slugs, if any, but does not include braze fillet, paint, etc., within the zone of uncontrollable lead diameter.) Steady-state power dissipation. Power dissipated under steady-state conditions. Lead temperature. Lead temperature is the temperature of the lead measured at the lead thermal path length, L. Lead temperature shall be measured by means of a No. 30 copper-constantan thermocouple, or equivalent. All reference to TL is changed to TEC for end cap temperature on "UR" devices and TSP for solder pad temperature on "UB" devices. Peak operating voltage. Peak operating voltage is the maximum voltage that shall be applied to the device. IP IS IS L PD TL VPOV 3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in MIL-PRF-19500, figure 1 (DO-7), figure 2 (DO-213AB), figure 3 (UB), figure 4 (JANHCA and JANKC die), and figure 5 (JANKCB and JANKCB) herein. * 3.5 Diode construction. These devices shall be constructed in a manner and using materials which enable the diodes to meet the applicable requirements of MIL-PRF-19500 and this document. For normal operation, the cathode is biased negative for normal operation as a current regulator (see Figure 6). a. The Dash one construction shall be of double plug construction utilizing high temperature metallurgical bonding between both sides of the silicon die and terminal pins. Metallurgical bond shall be in accordance with the requirements of category I or II in appendix A of MIL-PRF-19500. b. The `UB' devices shall be eutectically mounted and wire bonded in a ceramic package. c. The `UR' version shall be structurally identical to the axial leaded versions except for end-cap lead attachment. * 3.5.1 JANS construction. Construction shall be dash-one, category I or II metallurgical bond in accordance with appendix A of MIL-PRF-19500. The `UB' devices shall be eutectically mounted and wire bonded in a ceramic package. 8 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L 3.5.2 Encapsulant material. In addition to those categories of hermetically sealed package requirements specified in MIL-PRF-19500, fused-metal-oxide to metal shall also be acceptable. 3.6 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein. Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2). * 3.7 Marking. Marking shall be in accordance with MIL-PRF-19500. Manufacturers identification and date code shall be marked on the devices. The polarity shall be indicated with a contrasting color band to denote the cathode end. No color coding shall be permitted. Initial container package marking shall be in accordance with MIL-PRF-19500. The prefixes JAN, JANTX, JANTXV, or JANS may be abbreviated as J, JX, JV, or JS, respectively. (For example: The part number may be reduced to JS5314). All marking which is omitted from the body of the device shall appear on the initial container. All device marking, except for polarity and serial numbers, shall also appear on the unit package used as the initial protection for delivery. 3.7.1 Marking of UR devices. UR devices shall be marked with a cathode band as a minimum; or a minimum of three evenly spaced contrasting color dots around the periphery of the cathode end may be used. At the option of the manufacturer, UR devices may include laser marking on an end-cap, to include part number and lot date code for all levels. JANS devices which are laser marked shall also include serialization. The prefixes JAN, JANTX, JANTXV, or JANS may be abbreviated as J, JX, JV, or JS, respectively. (For example: The part number may be reduced to JS5314). All marking which is omitted from the body of the device shall appear on the initial container. All device marking, except for polarity and serial numbers, shall also appear on the unit package used as the initial protection for delivery. * 3.7.2 UB devices. `UB' packages do not require polarity marking. 3.8 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in 1.3, 1.4, and table I and the electrical characteristics table herein. 3.9 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I herein. 3.10 Maximum test ratings. Test ratings shall be as shown in the electrical characteristics table. 3.11 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and shall be free from other defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Classification of inspections. The inspection requirements specified herein are classified as follows: a. Qualification inspection (see 4.2). b. Screening (see 4.3). c. Conformance inspection (see 4.4). 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified herein. 4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In case qualification was awarded to a prior revision of the specification sheet that did not request the performance of group E tests, the tests specified in 4.7.4 herein shall be performed on the first inspection lot to this revision to maintain qualification. 4.2.2 JANHC and JANKC devices. Qualification for unencapsulated die shall be in accordance with appendix G of MIL-PRF-19500. 9 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L 4.3 Screening (JAN, JANTXV, JANTX, and JANS levels). Screening shall be in accordance with table E-IV of MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I herein shall not be acceptable. Screen (see table E-IV of MIL-PRF-19500) 3a JANTX and JANTXV levels JAN level (1) Temperature cycling Temperature cycling (in accordance with MIL-PRF-19500, JANTX level) Thermal impedance (see 4.3.3) Thermal impedance (see 4.3.3) Thermal impedance (see 4.3.3) 9 IS1 (3) Not applicable Not applicable 10 VPOV = Col 11, table II at TA = +25C t = 48 hours VPOV = Col 11, table II at TA = +25C t = 48 hours VPOV = Col 11, table II at TA = +25C t = 48 hours 11 Subgroup 2 of table I herein; IS1 5 percent of initial value (4) Subgroup 2 of table I herein Subgroup 2 of table I herein 12 See 4.3.2 See 4.3.2 Not applicable Subgroup 2 of table I herein; IS1 5 percent of initial value. (4) Subgroup 2 of table I herein; IS1 5 percent of initial value. (4) Not applicable (5) 13 (3) (4) (5) JANS Temperature cycling (2) 3c (1) (2) Measurement Screens 3a, 3c, 10, and 11 are the only screens required for JAN level product. Shall be performed any time after temperature cycling, screen 3a; JANTX and JANTXV levels do not need to be repeated in screening requirements. Symbol "IP1" may be used in place of "IS1". Symbol "IP1" may be used in place of "IS1". When thermal impedance is performed prior to screen 13, it is not required to be repeated in screen 13. 4.3.1 Screening (JANHC or JANKC). Screening of die shall be in accordance with appendix G of MIL-PRF-19500. As a minimum, die shall be 100-percent probed to ensure compliance with table I, subgroup 2 (with the exception of thermal impedance). 4.3.2 Power burn-in conditions. Power burn-in conditions are as follows: IR = 200 mA dc minimum; mounting and test conditions in accordance with method 1038 of MIL-STD-750, test condition B, TEC = +75C to +125C for surface mount devices. TA = room ambient as defined in the general requirements of 4.5 of MIL-STD-750. 10 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L 4.3.3 Thermal impedance ZJX measurements for screening. The ZJX measurements shall be performed in accordance with method 3101 of MIL-STD-750, (VR to be used in lieu of VF). The maximum limit (not to exceed the table I, subgroup 2 limit) for ZJX in screening (table E-IV of MIL-PRF-19500) shall be derived by each vendor bymeans of statistical process control. When the process has exhibited control and capability, the capability data shall be used to establish the fixed screening limit. In addition to screening, once a fixed limit has been established, monitor all future sealing lots using a random five piece sample from each lot to be plotted on the applicable X, R chart. If a lot exhibits an out of control condition, the entire lot shall be removed from the line and held for engineering evaluation and disposition. a. IM measurement current 1 mA - 10 mA. b. IH forward heating current .5 A - 1.0 A. c. tH heating time 10 ms. d. tMD measurement delay time 70 s maximum. 4.3.3.1 For initial qualification or requalification. Read and record data (ZJX) shall be supplied to the qualifying activity on one lot (random sample of 500 devices minimum) prior to shipment. Twenty-two samples shall be serialized and provided to the qualifying activity for test correlation. 4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as specified herein. 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I herein. 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in tables E-VIA (JANS) and E-VIB (JAN, JANTX and JANTXV) of MIL-PRF-19500, and as follows. Electrical measurements (end-points) and delta measurements shall be in accordance with table I, subgroup 2 herein. 4.4.2.1 Group B inspection, table E-VIA (JANS) of MIL-PRF-19500. Subgroup Method Condition B4 1037 2,000 cycles; test conditions in accordance with 4.3.2: ton = toff 30 seconds minimum. B5 1027 IR = 200 mA dc, TA = +125C or adjusted as required to give an average lot TJ = +175C. Marking legibility requirements shall not apply. 4.4.2.2 Group B inspection, table E- VIB (JAN, JANTX, and JANTXV) of MIL-PRF-19500. * Subgroup Method B3 1027 B5 B6 Condition VPOV = Col 11, table II; TA = +25C; L = .375 inch (9.53 mm) (non-surface mount), L = 0 inch for surface mount (UR and UB). Not applicable. 1032 TA = +175C. 11 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L * 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in table E-VII of MIL-PRF-19500, and as follows. Electrical measurements (end-points) and delta measurements shall be in accordance with table I, subgroup 2 herein. Subgroup Method C2 2036 C5 3101 or 4081 Condition Axial devices - Tension: test condition A; weight = 10 pounds (4.54 Kg), t = 15 s; lead fatigue = condition E (not applicable to `UR' suffix types). RJL at L = .375 inch (9.52 mm) 250C/W, RJEC at L = 0 lead length 100C/W, see 4.5. RJEC = 100C/W (maximum) at zero lead length (for UR). RJSP(IS) = 100C/W (maximum) (for UB). RJSP(IS) can be calculated but shall be measured once in the same package with a similar die size to confirm calculations(may apply to multiple specification sheets) C6 * C8 1026 VPOV = Col 11, table II; TA = +25C; L = .375 inch (9.53 mm) (non-surface mount), L = 0 inch for surface mount (UR and UB). See 4.6 and 4.7.3. * 4.5 Thermal resistance. Thermal resistance measurement shall be in accordance with method 3101 of MIL-STD-750. Forced moving air or draft shall not be permitted across the device during heat. The maximum limit for RJL under these test conditions shall be RJL (max) = 250C/W, RJEC = 100C/W or RJSP(IS) = 100C/W. The following conditions shall apply: a. IH 200 mA to 400 mA. b. IM 1 mA to 10 mA. c. tH 30 seconds minimum. d. tMD 70 s maximum. 4.5.1 For initial qualifications and re-qualifications. Read and record data in accordance with 4.7.4 herein and shall be included in the qualification report. 4.6 Temperature coefficient of regulator current. The temperature coefficient of regulator current shall be tested under the following conditions: Sampling plan: 22 devices, c = 0. a. Test 1: VS = 25 V dc, TL1 = -55C, TL2 = +25C, L = .375 inch (9.53 mm) (non-surface mount), L = 0 inch (surface mount) (see 3.3 and 4.7.3) with the maximum limit in accordance with column 8 of table II herein. b. Test 2: VS = 25 V dc, TL1 = +25C, TL2 = +150C, L = .375 inch (9.53 mm) (non-surface mount), L = 0 inch (surface mount) (see 3.3 and 4.7.3) with the maximum limit in accordance with column 9 of table II herein. 4.7 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows: 4.7.1 Regulator impedance (ZS) at test voltage VS. To test for ZS, a 90 Hz signal VS (mod) with rms value equal to 10 percent of test voltage, VS, is superimposed on the test voltage (see the regulator impedance test circuit figure herein). 4.7.2 Knee ac impedance (Zk) at test voltage VK. To test for Zk, a 90 Hz signal VK (mod) with rms value equal to 10 percent of test voltage, VK, is superimposed on the test voltage (see the knee impedance test circuit figure herein). 12 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L 4.7.3 Temperature coefficient of regulator current (IS). Temperature coefficient of regulator current shall be calculated as follows: IS (TL2 ) - IS (TL1 ) ____ _ x 100 IS = _________ IS (TL = +25C)TL 4.7.3.1 Alternate definition of temperature coefficient of regulator current (IS). Temperature coefficient of regulator current is allowed to also be calculated as follows: IP (TL2 ) - IP (TL1 ) ____ x 100 IS = ____________ IP (TL = +25C)TL 4.7.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for subgroup testing in table E-IX of MIL-PRF-19500. Electrical measurements (end-points) and delta measurements shall be in accordance with the applicable steps and footnotes of table I, subgroup 2 herein. 4.7.4.1 Group E inspection, table E- IX of MIL-PRF-19500. MIL-STD-750 Inspections Sample plan Method Subgroup 1 1051 Condition 45 devices, c=0 500 cycles. Temperature cycling (air to air) 45 devices, c=0 Subgroup 2 Intermittent operating life 1037 6,000 cycles (see 4.3.2) ton = toff = 30 seconds minimum. 3 devices, c=0 Subgroup 3 2101 Cross section; scribe and break. Separate samples to be used for each test. Subgroup 4 See table E-IX of MIL-PRF-19500, subgroup 4. c=0 Subgroup 6 ESD 1020 As applicable. 13 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L * TABLE I. Group A inspection. MIL-STD-750 Limit 2/ Inspection 1/ Symbol Method Conditions Unit Min Max Column 3 Column 4 mA dc Subgroup 1 Visual and mechanical examination 2071 Subgroup 2 Regulator current VS = 25 V dc, t = 90 s or thermal equilibrium, 1N5283-1 through 1N5314-1 IS1 3/ t = pulse measurement, 10 ms max 1N7048-1 through 1N7055-1, TL = +30C 3C (see figure 6) Limiting voltage IL = .8 IS1 (min) 3/, column 3 of table II (see figure 7) VL Column 7 V dc Reverse voltage IR = 200 mA VR 2.5 V dc Axial and US ZJX 25 C/W UB ZJX 40 C/W Thermal impedance 3101 See 4.3.3 Subgroup 3 Not applicable Subgroup 4 Regulator impedance VS = 25 V dc; (see figure 8 and 4.7.1) ZS Column 5 M Knee impedance VK = 6.0 V dc, (see figure 9 and 4.7.2) ZK Column 6 M Subgroups 5 and 6 Not applicable Subgroup 7 Regulator current VS = column 11 of table II, t = 90 s or thermal equilibrium, 1N5283-1 through 1N5314-1 IS2 4/ t = pulse measurement, 10 ms max 1N7048-1 through 1N7055-1, TL = +30C 3C (see figure 6) 1/ 2/ 3/ 4/ For sampling plan, see MIL-PRF-19500. Column references are to table II herein. Symbol "IP1" may be used in place of "IS1". Symbol "IP2" may be used in place of "IS2". 14 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. Column 10 mA dc TABLE II. Electrical characteristics. 1/ Col 1 Type (Electrical characteristics for "UR" "UB", and "-1" suffix devices are identical.) Col 3 Col 4 IS1 regulator current (mA) at VS = 25 V 2/ Col 5 Zs minimum regulator impedance at VS = 25 V Col 6 Zk minimum knee impedance at VK = 6 V Col 7 VL maximum limiting voltage at IL = 0.8 IS1 (min) 2/ Nom 0.22 0.24 0.27 0.30 0.33 0.39 0.43 0.47 0.56 0.62 0.68 0.75 0.82 0.91 1.00 1.10 1.20 1.30 1.40 1.50 Min 0.198 0.216 0.243 0.270 0.297 0.351 0.387 0.423 0.504 0.558 0.612 0.675 0.738 0.819 0.900 0.990 1.08 1.17 1.26 1.35 Max 0.242 0.264 0.297 0.330 0.363 0.429 0.473 0.517 0.616 0.682 0.748 0.825 0.902 1.001 1.100 1.210 1.32 1.43 1.54 1.65 M 25.0 19.0 14.0 9.0 6.6 4.10 3.30 2.70 1.90 1.55 1.35 1.15 1.00 0.880 0.800 0.700 0.640 0.580 0.540 0.510 M 2.75 2.35 1.95 1.60 1.35 1.00 0.870 0.750 0.560 0.470 0.400 0.335 0.290 0.240 0.205 0.180 0.155 0.135 0.115 0.105 Volts 1.00 1.00 1.00 1.00 1.00 1.05 1.05 1.05 1.10 1.13 1.15 1.20 1.25 1.29 1.35 1.40 1.45 1.50 1.55 1.60 Col 8 Col 9 IS maximum regulator current TC at V = 25V S IS maximum regulator current TC at V = 25V S -55C +25C +25C (%/C) Min -.20 -.20 -.30 -.35 -.40 -.50 -.52 -.55 -.60 -.62 -.65 -.70 -.72 -.76 -.78 -.80 -.83 -.85 -.88 -.90 Max 1.15 1.05 0.95 0.85 0.75 0.62 0.55 0.50 0.35 0.25 0.20 0.15 0.07 0.0 0.05 -.10 -.15 -.20 -.20 -.20 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. Col 10 +150C (%/C) Min -.16 -.20 -.22 -.25 -.26 -.30 -.32 -.33 -.36 -.37 -.38 -.40 -.41 -.42 -.44 -.46 -.47 -.48 -.49 -.50 Max 0.60 0.56 0.48 0.42 0.37 0.28 0.23 0.18 0.10 0.05 0.02 -.03 -.07 -.10 -.10 -.10 -.10 -.10 -.10 -.10 IS2 regulator current (mA) at VS = Col 11 3/ Max .27 .30 .33 .36 .40 .47 .52 .57 .68 .75 .82 .91 .99 1.10 1.21 1.33 1.45 1.57 1.69 1.81 Col 11 VPOV peak operating volts (DC) Volts 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 MIL-PRF-19500/463L 15 1N5283-1 1N5284-1 1N5285-1 1N5286-1 1N5287-1 1N5288-1 1N5289-1 1N5290-1 1N5291-1 1N5292-1 1N5293-1 1N5294-1 1N5295-1 1N5296-1 1N5297-1 1N5298-1 1N5299-1 1N5300-1 1N5301-1 1N5302-1 Col 2 TABLE II. Electrical characteristics - Continued. 1/ Col 1 Type (Electrical characteristics for "UR", "UB", and "-1" suffix devices are identical) 1/ 2/ 3/ Col 3 Col 4 IS1 regulator current (mA) at VS = 25 V 2/ Nom 1.60 1.80 2.00 2.20 2.40 2.70 3.00 3.30 3.60 3.90 4.30 4.70 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10.0 Min 1.44 1.62 1.80 1.98 2.16 2.43 2.70 2.97 3.24 3.51 3.87 4.23 4.59 5.04 5.58 6.12 6.75 7.38 8.19 9.00 Max 1.76 1.98 2.20 2.42 2.64 2.97 3.30 3.63 3.96 4.29 4.73 5.17 5.61 6.16 6.82 7.48 8.25 9.02 10.01 11.10 Col 5 ZS minimum regulator impedance at VS = 25 V M 0.475 0.420 0.395 0.370 0.345 0.320 0.300 0.280 0.265 0.255 0.245 0.235 0.100 0.090 0.080 0.070 0.050 0.030 0.020 0.010 Col 6 Zk minimum knee impedance at VK = 6 V M 0.092 0.074 0.061 0.052 0.044 0.035 0.029 0.024 0.020 0.017 0.014 0.012 0.004 0.004 0.003 0.002 0.0015 0.0015 0.001 0.001 Col 7 V L maximum limiting voltage at IL = 0.8 IS1 (min) 2/ Volts 1.65 1.75 1.85 1.95 2.00 2.15 2.25 2.35 2.50 2.60 2.75 2.90 3.67 4.03 4.46 4.90 5.40 5.90 6.55 7.20 Col 8 Col 9 Col 10 IS maximum regulator current TC at V = 25V S IS maximum regulator current TC at V = 25V S IS2 -55C +25C +25C (%/C) Min Max -.90 -.20 -.92 -.20 -.95 -.20 -.96 -.20 -.98 -.20 -1.0 -.20 -1.01 -.20 -1.02 -.20 -1.03 -.20 -1.04 -.20 -1.05 -.20 -1.06 -.20 -1.06 -.20 -1.06 -.20 -1.06 -.20 -1.06 -.20 -1.06 -.20 -1.06 -.20 -1.06 -.20 -1.06 -.20 Electrical characteristics are for all package styles. Symbol "IP1" may be used in place of "IS1". Symbol "IP2" may be used in place of "IS2". Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. +150C (%/C) Min Max -.50 -.10 -.51 -.10 -.52 -.10 -.52 -.10 -.53 -.10 -.53 -.10 -.53 -.10 -.54 -.10 -.54 -.10 -.55 -.10 -.55 -.10 -.55 -.10 -.55 -.10 -.55 -.10 -.55 -.10 -.55 -.10 -.55 -.10 -.55 -.10 -.55 -.10 -.55 -.10 regulator current (mA) at VS = Col 11 3/ Max 1.92 2.18 2.42 2.66 2.90 3.27 3.63 3.99 4.36 4.72 5.20 5.69 6.89 7.54 8.38 9.20 10.20 11.20 12.40 14.40 Col 11 VPOV peak operating volts (DC) Volts 100 100 100 100 100 100 100 100 100 100 100 100 80 80 70 70 60 60 50 50 MIL-PRF-19500/463L 16 1N5303-1 1N5304-1 1N5305-1 1N5306-1 1N5307-1 1N5308-1 1N5309-1 1N5310-1 1N5311-1 1N5312-1 1N5313-1 1N5314-1 1N7048-1 1N7049-1 1N7050-1 1N7051-1 1N7052-1 1N7053-1 1N7054-1 1N7055-1 Col 2 MIL-PRF-19500/463L IS1 NOTES: 1. Adjust voltage source so that VS = 25 V dc. 2. 3. 4. Measure current IS1. Symbol "IP1" may be used in place of "IS1". The device is acceptable if the current falls within the limits specified. The ammeter shall represent essentially a short-circuit to the terminals between which the current is being measured. If not, the voltmeter reading shall be corrected for the drop across the ammeter. FIGURE 6. Regulator current test circuit. NOTES: 1. 2. 3. 4. Adjust current source so that IL = .8 IS1 (min). Symbol "IP1" may be used in place of "IS1". Measure voltage VL. The device is acceptable if the voltage is less than the limit specified. The ammeter shall represent essentially a short-circuit to the terminals between which the current is being measured. If not, the voltmeter reading shall be corrected for the drop across the ammeter. FIGURE 7. Limiting voltage test circuit. 17 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L NOTES: 1. 2. 3. 4. 5. Adjust voltage source so that VS = 25 V dc. Apply an ac signal of 2.5 V rms at 90 Hz through an isolating capacitor C. Measure the ac rms voltage. ZS = VS mod x (R1 / V ac) where VS mod equals ac signal for note 2 and V ac equals the voltage across R1. Device is acceptable if the regulator impedance meets the specified minimum limit. FIGURE 8. Regulator impedance test circuit. NOTES: 1. 2. 3. 4. Adjust voltage source so that VK = 6.0 V dc. Apply an ac signal of .6 Vrms at 90 Hz through an isolating capacitor C. Measure the ac rms voltage. ZK = VK mod x (R1 / V ac) where VK mod equals ac signal for note 2 and V ac equals the voltage across R1. Device is acceptable if the knee impedance meets the specified minimum limit. FIGURE 9. Knee impedance test circuit. 18 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Point's packaging activities within the Military Service or Defense Agency, or within the Military Service's system commands. Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory. The notes specified in MIL-PRF-19500 are applicable to this specification.) 6.1 Intended use. Semiconductors devices conforming to this specification are intended for original equipment design applications and logistic support of existing equipment. * 6.2 Acquisition requirements. Acquisition documents should specify the following: a. Title, number, and date of this specification. b. Packaging requirements (see 5.1). c. Lead finish (see 3.6). d. The complete PIN, see 1.5. 6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List (QML 19500) whether or not such products have actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded contracts or orders for the products covered by this specification. Information pertaining to qualification of products may be obtained from DLA Land and Maritime, ATTN: VQE, P.O. Box 3990, Columbus, OH 43218-3990 or e-mail vqe.chief@dla.mil. An online listing of products qualified to this specification may be found in the Qualified Products Database (QPD) at https://assist.dla.mil. 19 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L 6.4 Substitutability of dash-one parts. Non-dash-one devices have been deleted from this specification. Dash-one devices are a direct substitute for non dash-one devices and are preferred. Superseded part number Superseding part number Superseded part number Superseding part number Superseded part number Superseding part number 1N5283 1N5283UR 1N5284 1N5284UR 1N5285 1N5285UR 1N5286 1N5286UR 1N5287 1N5287UR 1N5288 1N5288UR 1N5289 1N5289UR 1N5290 1N5290UR 1N5291 1N5291UR 1N5292 1N5292UR 1N5293 1N5293UR 1N5283-1 1N5283UR-1 1N5284-1 1N5284UR-1 1N5285-1 1N5285UR-1 1N5286-1 1N5286UR-1 1N5287-1 1N5287UR-1 1N5288-1 1N5288UR-1 1N5289-1 1N5289UR-1 1N5290-1 1N5290UR-1 1N5291-1 1N5291UR-1 1N5292-1 1N5292UR-1 1N5293-1 1N5293UR-1 1N5294 1N5294UR 1N5295 1N5295UR 1N5296 1N5296UR 1N5297 1N5297UR 1N5298 1N5298UR 1N5299 1N5299UR 1N5300 1N5300UR 1N5301 1N5301UR 1N5302 1N5302UR 1N5303 1N5303UR 1N5304 1N5304UR 1N5294-1 1N5294UR-1 1N5295-1 1N5295UR-1 1N5296-1 1N5296UR-1 1N5297-1 1N5297UR-1 1N5298-1 1N5298UR-1 1N5299-1 1N5299UR-1 1N5300-1 1N5300UR-1 1N5301-1 1N5301UR-1 1N5302-1 1N5302UR-1 1N5303-1 1N5303UR-1 1N5304-1 1N5304UR-1 1N5305 1N5305UR 1N5306 1N5306UR 1N5307 1N5307UR 1N5308 1N5308UR 1N5309 1N5309UR 1N5310 1N5310UR 1N5311 1N5311UR 1N5312 1N5312UR 1N5313 1N5313UR 1N5314 1N5314UR 1N5305-1 1N5305UR-1 1N5306-1 1N5306UR-1 1N5307-1 1N5307UR-1 1N5308-1 1N5308UR-1 1N5309-1 1N5309UR-1 1N5310-1 1N5310UR-1 1N5311-1 1N5311UR-1 1N5312-1 1N5312UR-1 1N5313-1 1N5313UR-1 1N5314-1 1N5314UR-1 * 6.5 PIN construction example. * 6.5.1 Encapsulated devices The PINs for encapsulated devices are constructed using the following form. JANTX 1N 5283 UR-1 JAN certification mark and quality level (see 1.5.1.1) First number and first letter symbols (see 1.5.2.1) Second number symbols (see 1.5.2.2) Suffix symbol, if applicable (see 1.5.3) * 6.5.2 Un-encapsulated devices. The PINs for un-encapsulated devices are constructed using the following form. JANHC A 1N JAN certification mark and quality level (see 1.5.1.2) Die identifier for unencapsulated devices (see 1.5.5) First number and first letter symbols (see 1.5.2.1) Second number symbols (see 1.5.2.2) 20 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. 5283 MIL-PRF-19500/463L * 6.6 List of PINs. * 6.6.1 List of PINs for encapsulated devices. The following is a list of possible PINs for encapsulated devices available on this specification sheet. PINs for devices of the base quality level (1) JAN1N5283-1 JAN1N5283UR-1 JAN1N5283UB JAN1N5284-1 JAN1N5284UR-1 JAN1N5284UB JAN1N5285-1 JAN1N5285UR-1 JAN1N5285UB JAN1N5286-1 JAN1N5286UR-1 JAN1N5286UB JAN1N5287-1 JAN1N5287UR-1 JAN1N5287UB JAN1N5288-1 JAN1N5288UR-1 JAN1N5288UB JAN1N5289-1 JAN1N5289UR-1 JAN1N5289UB JAN1N5290-1 JAN1N5290UR-1 JAN1N5290UB JAN1N5291-1 JAN1N5291UR-1 JAN1N5291UB JAN1N5292-1 JAN1N5292UR-1 JAN1N5292UB JAN1N5293-1 JAN1N5293UR-1 JAN1N5293UB JAN1N5294-1 JAN1N5294UR-1 JAN1N5294UB JAN1N5295-1 JAN1N5295UR-1 JAN1N5295UB JAN1N5296-1 JAN1N5296UR-1 JAN1N5296UB JAN1N5297-1 JAN1N5297UR-1 JAN1N5297UB JAN1N5298-1 JAN1N5298UR-1 JAN1N5298UB JAN1N5299-1 JAN1N5299UR-1 JAN1N5299UB JAN1N5300-1 JAN1N5300UR-1 JAN1N5300UB JAN1N5301-1 JAN1N5301UR-1 JAN1N5301UB JAN1N5302-1 JAN1N5302UR-1 JAN1N5302UB JAN1N5303-1 JAN1N5303UR-1 JAN1N5303UB JAN1N5304-1 JAN1N5304UR-1 JAN1N5304UB JAN1N5305-1 JAN1N5305UR-1 JAN1N5305UB JAN1N5306-1 JAN1N5306UR-1 JAN1N5306UB JAN1N5307-1 JAN1N5307UR-1 JAN1N5307UB JAN1N5308-1 JAN1N5308UR-1 JAN1N5308UB JAN1N5309-1 JAN1N5309UR-1 JAN1N5309UB JAN1N5310-1 JAN1N5310UR-1 JAN1N5310UB JAN1N5311-1 JAN1N5311UR-1 JAN1N5311UB JAN1N5312-1 JAN1N5312UR-1 JAN1N5312UB JAN1N5313-1 JAN1N5313UR-1 JAN1N5313UB JAN1N5314-1 JAN1N5314UR-1 JAN1N5314UB JAN1N7048-1 JAN1N7048UR-1 JAN1N7048UB JAN1N7049-1 JAN1N7049UR-1 JAN1N7049UB JAN1N7050-1 JAN1N7050UR-1 JAN1N7050UB JAN1N7051-1 JAN1N7051UR-1 JAN1N7051UB JAN1N7052-1 JAN1N7052UR-1 JAN1N7052UB JAN1N7053-1 JAN1N7053UR-1 JAN1N7053UB JAN1N7054-1 JAN1N7054UR-1 JAN1N7054UB JAN1N7055-1 JAN1N7055UR-1 JAN1N7055UB PINs for devices of the "TX" quality level (1) JANTX1N5283-1 JANTX1N5283UR-1 JANTX1N5283UB JANTX1N5284-1 JANTX1N5284UR-1 JANTX1N5284UB JANTX1N5285-1 JANTX1N5285UR-1 JANTX1N5285UB JANTX1N5286-1 JANTX1N5286UR-1 JANTX1N5286UB JANTX1N5287-1 JANTX1N5287UR-1 JANTX1N5287UB JANTX1N5288-1 JANTX1N5288UR-1 JANTX1N5288UB JANTX1N5289-1 JANTX1N5289UR-1 JANTX1N5289UB JANTX1N5290-1 JANTX1N5290UR-1 JANTX1N5290UB JANTX1N5291-1 JANTX1N5291UR-1 JANTX1N5291UB JANTX1N5292-1 JANTX1N5292UR-1 JANTX1N5292UB JANTX1N5293-1 JANTX1N5293UR-1 JANTX1N5293UB JANTX1N5294-1 JANTX1N5294UR-1 JANTX1N5294UB JANTX1N5295-1 JANTX1N5295UR-1 JANTX1N5295UB JANTX1N5296-1 JANTX1N5296UR-1 JANTX1N5296UB JANTX1N5297-1 JANTX1N5297UR-1 JANTX1N5297UB JANTX1N5298-1 JANTX1N5298UR-1 JANTX1N5298UB JANTX1N5299-1 JANTX1N5299UR-1 JANTX1N5299UB JANTX1N5300-1 JANTX1N5300UR-1 JANTX1N5300UB JANTX1N5301-1 JANTX1N5301UR-1 JANTX1N5301UB JANTX1N5302-1 JANTX1N5302UR-1 JANTX1N5302UB JANTX1N5303-1 JANTX1N5303UR-1 JANTX1N5303UB JANTX1N5304-1 JANTX1N5304UR-1 JANTX1N5304UB JANTX1N5305-1 JANTX1N5305UR-1 JANTX1N5305UB JANTX1N5306-1 JANTX1N5306UR-1 JANTX1N5306UB JANTX1N5307-1 JANTX1N5307UR-1 JANTX1N5307UB JANTX1N5308-1 JANTX1N5308UR-1 JANTX1N5308UB JANTX1N5309-1 JANTX1N5309UR-1 JANTX1N5309UB JANTX1N5310-1 JANTX1N5310UR-1 JANTX1N5310UB JANTX1N5311-1 JANTX1N5311UR-1 JANTX1N5311UB JANTX1N5312-1 JANTX1N5312UR-1 JANTX1N5312UB JANTX1N5313-1 JANTX1N5313UR-1 JANTX1N5313UB JANTX1N5314-1 JANTX1N5314UR-1 JANTX1N5314UB JANTX1N7048-1 JANTX1N7048UR-1 JANTX1N7048UB JANTX1N7049-1 JANTX1N7049UR-1 JANTX1N7049UB JANTX1N7050-1 JANTX1N7050UR-1 JANTX1N7050UB JANTX1N7051-1 JANTX1N7051UR-1 JANTX1N7051UB JANTX1N7052-1 JANTX1N7052UR-1 JANTX1N7052UB JANTX1N7053-1 JANTX1N7053UR-1 JANTX1N7053UB JANTX1N7054-1 JANTX1N7054UR-1 JANTX1N7054UB JANTX1N7055-1 JANTX1N7055UR-1 JANTX1N7055UB 21 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L * 6.6.1 List of PINs for encapsulated devices. Continued. PINs for devices of the "TXV" quality level (1) JANTXV1N5283-1 JANTXV1N5283UR-1 JANTXV1N5283UB JANTXV1N5284-1 JANTXV1N5284UR-1 JANTXV1N5284UB JANTXV1N5285-1 JANTXV1N5285UR-1 JANTXV1N5285UB JANTXV1N5286-1 JANTXV1N5286UR-1 JANTXV1N5286UB JANTXV1N5287-1 JANTXV1N5287UR-1 JANTXV1N5287UB JANTXV1N5288-1 JANTXV1N5288UR-1 JANTXV1N5288UB JANTXV1N5289-1 JANTXV1N5289UR-1 JANTXV1N5289UB JANTXV1N5290-1 JANTXV1N5290UR-1 JANTXV1N5290UB JANTXV1N5291-1 JANTXV1N5291UR-1 JANTXV1N5291UB JANTXV1N5292-1 JANTXV1N5292UR-1 JANTXV1N5292UB JANTXV1N5293-1 JANTXV1N5293UR-1 JANTXV1N5293UB JANTXV1N5294-1 JANTXV1N5294UR-1 JANTXV1N5294UB JANTXV1N5295-1 JANTXV1N5295UR-1 JANTXV1N5295UB JANTXV1N5296-1 JANTXV1N5296UR-1 JANTXV1N5296UB JANTXV1N5297-1 JANTXV1N5297UR-1 JANTXV1N5297UB JANTXV1N5298-1 JANTXV1N5298UR-1 JANTXV1N5298UB JANTXV1N5299-1 JANTXV1N5299UR-1 JANTXV1N5299UB JANTXV1N5300-1 JANTXV1N5300UR-1 JANTXV1N5300UB JANTXV1N5301-1 JANTXV1N5301UR-1 JANTXV1N5301UB JANTXV1N5302-1 JANTXV1N5302UR-1 JANTXV1N5302UB JANTXV1N5303-1 JANTXV1N5303UR-1 JANTXV1N5303UB JANTXV1N5304-1 JANTXV1N5304UR-1 JANTXV1N5304UB JANTXV1N5305-1 JANTXV1N5305UR-1 JANTXV1N5305UB JANTXV1N5306-1 JANTXV1N5306UR-1 JANTXV1N5306UB JANTXV1N5307-1 JANTXV1N5307UR-1 JANTXV1N5307UB JANTXV1N5308-1 JANTXV1N5308UR-1 JANTXV1N5308UB JANTXV1N5309-1 JANTXV1N5309UR-1 JANTXV1N5309UB JANTXV1N5310-1 JANTXV1N5310UR-1 JANTXV1N5310UB JANTXV1N5311-1 JANTXV1N5311UR-1 JANTXV1N5311UB JANTXV1N5312-1 JANTXV1N5312UR-1 JANTXV1N5312UB JANTXV1N5313-1 JANTXV1N5313UR-1 JANTXV1N5313UB JANTXV1N5314-1 JANTXV1N5314UR-1 JANTXV1N5314UB JANTXV1N7048-1 JANTXV1N7048UR-1 JANTXV1N7048UB JANTXV1N7049-1 JANTXV1N7049UR-1 JANTXV1N7049UB JANTXV1N7050-1 JANTXV1N7050UR-1 JANTXV1N7050UB JANTXV1N7051-1 JANTXV1N7051UR-1 JANTXV1N7051UB JANTXV1N7052-1 JANTXV1N7052UR-1 JANTXV1N7052UB JANTXV1N7053-1 JANTXV1N7053UR-1 JANTXV1N7053UB JANTXV1N7054-1 JANTXV1N7054UR-1 JANTXV1N7054UB JANTXV1N7055-1 JANTXV1N7055UR-1 JANTXV1N7055UB PINs for devices of the "S" quality level (1) JANS1N5283-1 JANS1N5283UR-1 JANS1N5283UB JANS1N5284-1 JANS1N5284UR-1 JANS1N5284UB JANS1N5285-1 JANS1N5285UR-1 JANS1N5285UB JANS1N5286-1 JANS1N5286UR-1 JANS1N5286UB JANS1N5287-1 JANS1N5287UR-1 JANS1N5287UB JANS1N5288-1 JANS1N5288UR-1 JANS1N5288UB JANS1N5289-1 JANS1N5289UR-1 JANS1N5289UB JANS1N5290-1 JANS1N5290UR-1 JANS1N5290UB JANS1N5291-1 JANS1N5291UR-1 JANS1N5291UB JANS1N5292-1 JANS1N5292UR-1 JANS1N5292UB JANS1N5293-1 JANS1N5293UR-1 JANS1N5293UB JANS1N5294-1 JANS1N5294UR-1 JANS1N5294UB JANS1N5295-1 JANS1N5295UR-1 JANS1N5295UB JANS1N5296-1 JANS1N5296UR-1 JANS1N5296UB JANS1N5297-1 JANS1N5297UR-1 JANS1N5297UB JANS1N5298-1 JANS1N5298UR-1 JANS1N5298UB JANS1N5299-1 JANS1N5299UR-1 JANS1N5299UB JANS1N5300-1 JANS1N5300UR-1 JANS1N5300UB JANS1N5301-1 JANS1N5301UR-1 JANS1N5301UB JANS1N5302-1 JANS1N5302UR-1 JANS1N5302UB JANS1N5303-1 JANS1N5303UR-1 JANS1N5303UB JANS1N5304-1 JANS1N5304UR-1 JANS1N5304UB JANS1N5305-1 JANS1N5305UR-1 JANS1N5305UB JANS1N5306-1 JANS1N5306UR-1 JANS1N5306UB JANS1N5307-1 JANS1N5307UR-1 JANS1N5307UB JANS1N5308-1 JANS1N5308UR-1 JANS1N5308UB JANS1N5309-1 JANS1N5309UR-1 JANS1N5309UB JANS1N5310-1 JANS1N5310UR-1 JANS1N5310UB JANS1N5311-1 JANS1N5311UR-1 JANS1N5311UB JANS1N5312-1 JANS1N5312UR-1 JANS1N5312UB JANS1N5313-1 JANS1N5313UR-1 JANS1N5313UB JANS1N5314-1 JANS1N5314UR-1 JANS1N5314UB JANS1N7048-1 JANS1N7048UR-1 JANS1N7048UB JANS1N7049-1 JANS1N7049UR-1 JANS1N7049UB JANS1N7050-1 JANS1N7050UR-1 JANS1N7050UB JANS1N7051-1 JANS1N7051UR-1 JANS1N7051UB JANS1N7052-1 JANS1N7052UR-1 JANS1N7052UB JANS1N7053-1 JANS1N7053UR-1 JANS1N7053UB JANS1N7054-1 JANS1N7054UR-1 JANS1N7054UB JANS1N7055-1 JANS1N7055UR-1 JANS1N7055UB (1) For UB suffix devices, UBCA, UBCC, and UBDD suffix devices are also available. 22 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L * 6.6.2 List of PINs for unencapsulated devices. The following is a list of possible PINs available on this specification sheet. The qualified die suppliers with the applicable letter version (e.g., JANHCA1N5283) will be identified on the QML. PIN 1N5283-1 1N5284-1 1N5285-1 1N5286-1 1N5287-1 1N5288-1 1N5289-1 1N5290-1 1N5291-1 1N5292-1 1N5293-1 1N5294-1 1N5295-1 1N5296-1 1N5297-1 1N5298-1 1N5299-1 1N5300-1 1N5301-1 1N5302-1 1N5303-1 1N5304-1 1N5305-1 1N5306-1 1N5307-1 1N5308-1 1N5309-1 1N5310-1 1N5311-1 1N5312-1 1N5313-1 1N5314-1 1N7048-1 1N7049-1 1N7050-1 1N7051-1 1N7052-1 1N7053-1 1N7054-1 1N7055-1 JANC ordering information Manufacturer CAGE 43611 (1) 52GC4 (1) JANHCA1N5283 JANHCA1N5284 JANHCA1N5285 JANHCA1N5286 JANHCA1N5287 JANHCA1N5288 JANHCA1N5289 JANHCA1N5290 JANHCA1N5291 JANHCA1N5292 JANHCA1N5293 JANHCA1N5294 JANHCA1N5295 JANHCA1N5296 JANHCA1N5297 JANHCA1N5298 JANHCA1N5299 JANHCA1N5300 JANHCA1N5301 JANHCA1N5302 JANHCA1N5303 JANHCA1N5304 JANHCA1N5305 JANHCA1N5306 JANHCA1N5307 JANHCA1N5308 JANHCA1N5309 JANHCA1N5310 JANHCA1N5311 JANHCA1N5312 JANHCA1N5313 JANHCA1N5314 JANHCA1N7048 JANHCA1N7049 JANHCA1N7050 JANHCA1N7051 JANHCA1N7052 JANHCA1N7053 JANHCA1N7054 JANHCA1N7055 JANHCB1N5283 JANHCB1N5284 JANHCB1N5285 JANHCB1N5286 JANHCB1N5287 JANHCB1N5288 JANHCB1N5289 JANHCB1N5290 JANHCB1N5291 JANHCB1N5292 JANHCB1N5293 JANHCB1N5294 JANHCB1N5295 JANHCB1N5296 JANHCB1N5297 JANHCB1N5298 JANHCB1N5299 JANHCB1N5300 JANHCB1N5301 JANHCB1N5302 JANHCB1N5303 JANHCB1N5304 JANHCB1N5305 JANHCB1N5306 JANHCB1N5307 JANHCB1N5308 JANHCB1N5309 JANHCB1N5310 JANHCB1N5311 JANHCB1N5312 JANHCB1N5313 JANHCB1N5314 JANHCB1N7048 JANHCB1N7049 JANHCB1N7050 JANHCB1N7051 JANHCB1N7052 JANHCB1N7053 JANHCB1N7054 JANHCB1N7055 (1) For JANKC level, replace "JANHC" with "JANKC". 23 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use. MIL-PRF-19500/463L 6.7 Changes from previous issue. The margins of this specification are marked with asterisks to indicate where changes from the previous issue were made. This was done as a convenience only and the Government assumes no liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to evaluate the requirements of this document based on the entire content irrespective of the marginal notations and relationship to the last previous issue. Custodians: Army - CR Navy - EC Air Force - 85 NASA - NA DLA - CC Preparing activity: DLA - CC (Project 5961-2016-018) Review activities: Army - AR, MI, SM Navy - AS, MC Air Force - 19, 99 NOTE: The activities listed above were interested in this document as of the date of this document. Since organizations and responsibilities can change, you should verify the currency of the information above using the ASSIST Online database at https://assist.dla.mil. 24 Source: https://assist.dla.mil -- Downloaded: 2016-02-19T15:22Z Check the source to verify that this is the current version before use.