Messrs. Issue No. : PC-02-060 Date of issue : November 15, 2002 Classification : New Change Renewal Digi-Key Delivery Specification Product Description Product Part Number : Balun : EHF1BG1800 Classification of Spec Applications : Individual Product Specification : Cellular phone For other applications, contact the undersigned in advance. : November 14, 2007 from the date of issue. Term of Validity CUSTOMER USE ONLY Receipt Record#: This was certainly received by us. 1(one) copy is being returned to you. Date of receipt: Received by: Title: Dept.: Matsushita Electronic Components Co., Ltd. Network Device Company Module Strategic Business Unit Engineering Group HFD Team Prepared by Checked by : H. Ito : M. Mizuno 992-1 Aiba Ohno-cho Ibi-gun Gifu 501-0598 JAPAN Tel: +81-0585-36-2322 Fax: +81-0585-36-2344 Authorized by Title : M. Mizuno : Manager of Engineering [Shape, appearance, dimension] Unit: mm <Top view> <Bottom and side view> NU (5) OUT1 (4) (1) GND (2) IN (3) GND 3.2+/-0.2 1.05+/-0.1 1.6+/-0.2 OUT2 (6) Sn-Pb (Sn:Pb=9:1) or Sn Ni Ceramic substrate Ag-Pd Note 1) "typ" is used where no dimensional tolerance applies. Item Appearance/ construction Description Product surface shall be covered with a protective film, which does not easily separate nor present noticeable unevenness, scratches, pinholes, color changes etc. Terminals shall ensure practically acceptable quality. Substrate shall be as shown in the drawing with no excessive chippings, scratches, burrs, or cracks. Marking Remarks Shall be legible in black (with printing paste). marked side for pin 1. Balun Delivery Specification Enact. Date Enfo. Date November 15, 2002 November 15, 2002 P.S.M Approval Check Plan ----- M. Mizuno M. Mizuno H. Ito EHF1BG1800 Appearance Drawing No. 151-EHF-1BG1800 9-1 [Absolute maximum ratings] No. Item Symbol Rating Unit 1 Maximum input power Pmax 100 2 Operating temperature Topr -30...+85 3 Storage temperature Tstg -40...+85 Note: This component cannot apply a DC Bias. [Electrical characteristics] No. Item 1 Frequency 2 3 4 5 Insertion loss (Back to back) Unbalance impedance Balance impedance Unbalance port VSWR 6 Amplitude balance 7 Phase balance [Internal circuitry] mW DC voltage is 0V. degC degC T=-30...+85degC Specification Test Circuit - Min. 1700 Typ. - Max. 1900 MHz Fig-2 Fig-1 - 50 200 - 0.8 2.0 dB ohm ohm - Fig-1 Fig-1 -1.0 170 180 1.0 190 dB deg Unit (2)IN (3)GND (3)GND (1)GND (6)OUT2 (4)OUT1 [Measuring circuit] < Phase balance measurement > *Phase1 A=IN, B=OUT, C=Terminal resistor (50 ohm) *Phase2 A=IN, C=OUT, B=Terminal resistor (50 ohm) *Phase balance Phase balance=Phase1-Phase2 < Insertion loss measurement > Assuming the loss as "Loss" when D=IN, E=OUT Insertion loss for a device is "Loss"/2 NETWORK ANALYZER S-PARAMETER TEST SET IN OUT A FIG.1 Remarks GND GND B FIG.2 Matching Resistor 47 ohm GND E C D GND GND Balun Delivery Specification Enact. Date Enfo. Date November 15, 2002 November 15, 2002 P.S.M Approval Check Plan ----- M. Mizuno M. Mizuno H. Ito EHF1BG1800 Specification and measurement Drawing No. 151-EHF-1BG1800 9-2 [Terminal dimensions] Unit: mm <Bottom> 1.0 Pin No. 1.0 (5) (6) 1.0 0.3 (4) 0.3 Bottom View 0.4 (3) 0.4 (2) (1) 0.6 Tolerance of Terminal dimensions : +/-0.15 (6) OUT 2 (4) OUT1 0.8 GND (1) Balun IN (2) GND (3) 0.5 Delivery Specification Enact. Date PCB Pad Top View 0.45 Enfo. Date (5) NU Product 0.8 2.4 0.8 [Recommended PCB pad dimensions] Unit: mm November 15, 2002 November 15, 2002 P.S.M Approval Check Plan ----- M. Mizuno M. Mizuno H. Ito EHF1BG1800 Terminals/Recommended lands Drawing No. 151-EHF-1BG1800 9-3 [Quality characteristics] Test item Test condition Judgment criteria No abnormality shall be observed in appearance or electrical characteristics. High temperature +85degC, 1000h Low temperature -40degC, 1000 h High-temperature high-humidity storage +60degC, 90%RH, 1000h Pressure Pot +121degC, 99%RH, 2.026x10 Pa, 100h Temperature cycling -40...+85degC, Each 30 min., 200cy Vibration 10...500Hz, 10G, in each direction of XYZ, 2h30min. Impact 100G, 6mS, Half sinusoidal wave, in each direction of XYZ, 3 times Shock (Drop) 1.8m , 6 facesx6cy(36 times with 100g Dummy Load) Electro static discharge 200pF, 0 ohm, +/-200V, Each 5 times Soldering heat resistance Manual hot gas: 260+/-10degC, 30 sec., 2 times 5 Over 90% of the terminal surface shall be covered with solder. Soldering iron: 260+/-10degC, 3 sec., 2 times Reflow: 260degC peak, 2 times Solder ability Over 95% of the terminal surface shall be covered with solder. Solder bath: 235+/-5degC, 2 sec. Reflow: 230degC Board warping Assemble this component on a PC board with 0.8mm thickness using the recommended soldering condition shown below, and apply a bending force of 3mm warping at a rate of 1mm/sec. 5 seconds and 5 times. 45mm 45mm t=0.8mm 3mm There should not be any cracks in the component or solder joints, no abnormality in electrical characteristics. Terminal removal Solder a component on a PC board using the recommended condition shown below and then press the component sideways at 1mm/sec. Destruction limit 9.8N or greater. Seating plane co-planarity Within 0.1mm < Recommended soldering condition > Diagram1 Shown below is a recommended reflow soldering condition . Temperature degC 250 230 200 170 140 30~60 sec. Balun Delivery Specification Enact. Date Enfo. Date 60~180 sec. November 15, 2002 November 15, 2002 P.S.M Approval Check Plan ----- M. Mizuno M. Mizuno H. Ito Time EHF1BG1800 Quality Characteristics Drawing No. 151-EHF-1BG1800 9-4 [Cautions for use] (1) Operating a product over the maximum rating for even a moment may result in a product failure or breakage. Never use a product in such a condition that it may cause a safety problem. (2) Opening or short-circuiting the product terminals or inserting a product in the reverse orientation while power is being supplied may cause a breakage. Always avoid such circumstances. (3) Operations in a corrosive gas atmosphere or improper environments such as hightemperature, high-humidity or dewy conditions may lead to product performance deterioration, a breakage, a change in appearance etc. Please avoid such conditions, as they are unsafe. (4) Always ground the soldering iron or soldering bath used for assembly operation to avoid any excessive voltage applied to a product. (5) After soldering with solder bridges, incomplete soldering or in the reverse orientation, supplying power may result in a product breakage. Please confirm the soldered condition before supplying power to the product. (6) Excessive stress on the terminals may cause a contact failure or performance deterioration. Please use caution. (7) Please provide a fail-safe provision in the product you design by taking any failure of our product into consideration. (8) This product does not include a DC-cutting device. Application of a DC voltage between the Balance port and the Unbalance port may cause product deterioration or breakage. * If any question arises about the safety of this product, please contact us immediately with a request for an engineering examination. [Remarks] *1: All of the materials used in this product are those listed as the existing chemical substances based on the "Law for examination and regulation of manufacture of chemical substances". *2: The production process of this product does not use any ozone-depleting chemicals (OZC) regulated by the Montreal Protocol. *3: Validity of this specification is 5 years from the date of issue, but the validity is considered on going unless any changes are made. Balun Delivery Specification Enact. Date Enfo. Date November 15, 2002 November 15, 2002 P.S.M Approval Check Plan ----- M. Mizuno M. Mizuno H. Ito EHF1BG1800 Cautions Drawing No. 151-EHF-1BG1800 9-5 [Packaging materials] 1. Materials 1) Embossed carrier tape (Refer to the attachment) 2) Top tape: Anti-static 3) Packaging box (Refer to the attachment) 4) Packaging tape, carrier-securing adhesive tape 2. Specification No. Item 1 Reel outer diameter 2 3 4 5 Condition Refer to the attachment . Reel inner diameter Refer to the attachment . Reel inner width Refer to the attachment . Quantity in a reel 3000 pieces/reel Taping direction 6 Top tape attachment position Remarks Tape unreeling direction (with markings facing up) Top tape 8.0+/-0.2mm 5.5mm < Top tape attachment area > Embossed tape Top tape edge must stay inside the sprocket holes of the embossed carrier (Sprocket holes shall not be covered). Tape unreeling direction 7 Label attachment position Label Tape breaks force. Min. 10N Top cover tape strength. Min. 10N Tape peel force. 0.1...1.0N Tape peel angle. 165...180degree Reel weight. Max 1500g Indicated Item Pat No., Lot No. Quantity, Maker Country Leader part 8 Tape leader part and tape ending part Ending part Product -loaded part Embossed carrier 200~220mm (Product-unloaded part) 100~150mm, 25~38 pieces worth, (Product-unloaded part) 9 Missing products No missing products shall be allowed. 10 Packaged quantity in a box 21 reels/box (Max) Balun Delivery Specification Enact. Date Enfo. Date November 15, 2002 November 15, 2002 P.S.M Approval Check Plan ----- M. Mizuno M. Mizuno H. Ito Top tape 300~ 400mm 63000 pieces/box(Max) EHF1BG1800 Packaging specification 1 Drawing No. 151-EHF-1BG1800 9-6 1. Method 1) Load products in each cavity of an embossed carrier tape, in the correct orientation, by leaving the product-unloaded part shown in Item No. 8(P9-6) of the packaging specification. 2) Heat-seal a top tape in good alignment on the carrier tape. 3) After 3000 pieces are loaded and reeled, provide a product-unloaded part at the tape-leader portion. Secure the tip of the carrier tape with a piece of adhesive tape. 4) Stack the reels (21 reels max.) and enclose them in a packaging box. Close the flaps with a piece of adhesive tape. 5) Provide markings on the packaging box. < Items to be indicated > 1. Part No. 2. Quantity 3. Lot No. 4. Manufacturer name 5. Country of origin Marking on the packaging box Packaging box shape varies with the number of reels enclosed. Reel label Number of stacking, 21 reels max. * Insert cushion material in the empty spaces to secure reels . Balun Delivery Specification Enact. Date Enfo. Date November 15, 2002 November 15, 2002 P.S.M Approval Check Plan ----- M. Mizuno M. Mizuno H. Ito EHF1BG1800 Packaging specification 2 Drawing No. 151-EHF-1BG1800 9-7 [Embossed tape dimensions] Unit: mm +/-0.1 4 2+/-0.06 0.2+/-0.05 d1.55+/-0.05 1.75+/-0.1 0.3 3.5+/-0.05 +/-0.2 8 3.5 +/-0.1 3.5+/-0.1 (2.75) +/-0.1 d1.05+/-0.05 4+/-0.1 1.3 1.95 +/-0.1 0.3 1.9 +/-0.1 <Remarks> (1) Unspecified corner radius shall be 0.3mm max. (2) Cumulative pitch error of sprocket holes shall be +/-0.2mm for 10 pitches. Balun Delivery Specification Enact. Date Enfo. Date November 15, 2002 November 15, 2002 P.S.M Approval Check Plan ----- M. Mizuno M. Mizuno H. Ito EHF1BG1800 Packaging specification 3 Drawing No. 151-EHF-1BG1800 9-8 O A O 18 0 -3 0 R85 O 3 [Reel dimensions] Unit: mm (1) This reel conforms to EIAJ -RRM-08B based on EIAJ standard. (2) Material: PS (Polystyrene) 44 Center area .2 H } 0 * 1 2-R 18 .0 2 2-R1 2 } 0. * MI N .0 18 * 120 120 * N MI 2*} 0.2 2 R10.5 *} 0. 2 N O 60+1 0 W1 10 W2 O MIN 18.0 3 *} 0.2 O 13 B 5 R0. O 3 4 3 B 3 B Label 105...50 0.2 0.4 0.6 0.8 0.8 0.6 H 0.4 0.2 5 4 Scale 3 Rim , Hub Rim A 180 0 -3 Hub N 60 +1 0 Inner width , Outer width Tape width 8 Inner width W1 Outer width W2 9+/-0.3 11+/-1.0 Number 105 110 Balun Delivery Specification Enact. Date Enfo. Date November 15, 2002 November 15, 2002 P.S.M Approval Check Plan ----- M. Mizuno M. Mizuno H. Ito EHF1BG1800 Packaging specification 4 Drawing No. 151-EHF-1BG1800 9-9