Issue No. : PC-02-060
Date of issue : November 15, 2002
Classification :
Messrs. Digi-Key
Delivery Specification
Product Description : Balun
Product Part Number : EHF1BG1800
Classification of Spec : Individual Product Specification
Applications : Cellular phone
For other applications, contact the undersigned in advance.
Term of Validity : November 14, 2007 from the date of issue.
CUSTOMER USE ONLY
This was certainly received by us.
1(one) copy is being returned to you.
Receipt Record#:
Date of receipt:
Received by:
Title:
Dept.:
Matsushita Electronic Components Co., Ltd.
Network Device Company
Module Strategic Business Unit
Engineering Group HFD Team
992-1 Aiba Ohno-cho Ibi-gun Gifu 501-0598 JAPAN
Tel: +81-0585-36-2322
Fax: +81-0585-36-2344
Prepared by : H. Ito
Checked by : M. Mizuno
Authorized by : M. Mizuno
Title : Manager of Engineering
New
Change
Renewal
Balun Delivery Specification
Enact. Date November 15, 2002
Enfo. Date November 15, 2002
P.S.M
-----
M. Mizuno
Check
M. Mizuno
Plan
H. Ito
EHF1BG1800
Appearance
Drawing No.
151
-
EHF
-
1BG1800 9
-
1
[Shape, appearance, dimension] Unit: mm
<Top view> <Bottom and side view>
Ceramic substrate
Sn-Pb (Sn:Pb=9:1) or Sn
Ni
Ag-Pd
Item
Appearance/
construction
Marking
Remarks
Description
Product surface shall be
covered with a protective film, which does not
easily separate nor present noticeable unevenness, scratches, pinholes,
color changes etc.
Terminals shall ensure practically acceptable quality
.
Substrate shall be as shown in the drawing with no excessive
chippings,
scratches, burrs, or cracks.
Shall be legible in black (with printing paste).
marked side for pin 1.
Note 1) “typ” is used where no dimensional tolerance applies.
1.6
+/
-
0.2
3.2+/
-
0.2
1.05+
/
-
0.1
OUT2
(6)
(1)
GND
NU
(5)
(2)
IN
OUT1
(4)
(3)
GND
Balun Delivery Specification
Enact. Date November 15, 2002
Enfo. Date November 15, 2002
P.S.M
-----
M. Mizuno
Check
M. Mizuno
Plan
H. Ito
EHF1BG1800
Specification and measurement
Drawing No.
151
-
EHF
-
1BG
1800 9
-
2
[Internal circuitry]
(6)
OUT
2
(4)
OUT
1
(2)
IN
(
3
)
GND
(
1)GND
[Measuring circuit]
FIG.1
GND
GND
GND
C
B
A
NETWORK ANALYZER
S
-
PARAMETER
TEST SET
IN
OUT
< Phase balance measurement
>
Phase1
A=IN, B=OUT, C=Terminal resistor (50 ohm)
Phase2
A=IN, C=OUT, B=Terminal resistor (50 ohm)
•Phase balance
Phase balance=Phase1-Phase2
< Insertion loss measurement >
Assuming the loss as “Loss” when D=IN, E=OUT
Insertion loss for a device is “Loss”/2
(3)
GND
G
ND
GND
E
D
FIG.2
Matching
Resistor
47 ohm
Unit
MHz
dB
ohm
ohm
-
dB
deg
Typ.
-
-
50
200
-
-
180
Max.
1900
0.8
-
-
2.0
1.0
190
[Absolute maximum ratings]
No.
1
2
3
Item
Maximum input power
Operating temperature
Storage temperature
Symbol
Pmax
Topr
Tstg
Rating
100
-30…+85
-40…+85
Unit
mW
degC
degC
Remarks
DC voltage is 0V.
Note: This component cannot apply a DC Bias.
[Electrical characteristics] T=-30…+85degC
No.
1
2
3
4
5
6
7
Item
Frequency
Insertion loss (Back to back)
Unbalance impedance
Balance impedance
Unbalance port VSWR
Amplitude balance
Phase balance
Test
Circuit
-
Fig-2
-
-
Fig-1
Fig-1
Fig-1
Min.
1700
-
-
-
-
-1.0
170
Specification
Balun Delivery Specification
Enact. Date November 15, 2002
Enfo. Date November 15, 2002
P.S.M
-----
M. Mizuno
Check
M. Mizuno
Plan
H. Ito
EHF1BG1800
Terminals/Recommended lands
Drawing No.
151
-
EHF
-
1BG1800 9
-
3
[Terminal dimensions ] Unit: mm
<Bottom>
Tolerance of
Terminal dimensions: +/-0.15
[Recommended PCB pad dimensions] Unit: mm
Pin No
.
Bottom View
0.3
1.0
0.3
(3)
0.4
0.4
0.6
(2)
(1)
1.0
(4)
(5)
(6)
1.0
Top View
0.45
IN
(2)
0.5
GND
(1)
GND
(3)
(5
)
NU
(6
)
OUT
2
(4
)
OUT1
2.
4
0.8
PCB Pad
Product
0.8
0.8
Balun Delivery Specification
Enact. Date November 15, 2002
Enfo. Date November 15, 2002
P.S.M
-----
M. Mizuno
Check
M. Mizuno
Plan
H. Ito
EHF1BG1800
Quality Characteristics
Drawing No.
151
-
EHF
-
1BG1800 9
-
4
Assemble this component on a PC board with 0.8mm t
hickness using
the recommended soldering condition shown below, and apply a
bending force of 3mm warping at a rate of 1mm/sec. 5 seconds and 5
times.
Judgment criteria
No abnormality shall
be observed in
appearance or
electrical
characteristics.
Over 90% of the terminal
surface sh
all be covered
with solder.
Over 95% of the terminal
surface shall be covered
with solder.
There should not be
any cracks in the
component or solder
joints, no abnormality
in electrical
characteristics.
Test condition
+85degC, 1000h
-40degC, 1000h
+60degC, 90%RH, 1000h
+121degC, 99%RH, 2.026x105Pa, 100h
-40…+85degC, Each 30 min., 200cy
10…500Hz, 10G, in each direction of XYZ, 2h30min.
100G, 6mS, Half sinusoidal wave, in each direction of XYZ, 3 times
1.8m, 6 facesx6cy(36 times with 100g Dummy Load)
200pF, 0 ohm, +/-200V, Each 5 times
Manual hot gas: 260+/-10degC, 30 sec., 2 times
Soldering iron: 260+/-10degC, 3 sec., 2 times
Reflow: 260degC peak, 2 times
Solder bath: 235+/-5degC, 2 sec.
Reflow: 230degC
Test item
High temperature
Low temperature
High-temperature high-humidity storage
Pressure Pot
Temperature cycling
Vibration
Impact
Shock (Drop)
Electro static discharge
Soldering heat resistance
Solder ability
Board warping
Terminal removal
Seating plane co-planarity
[
Quality characteristics
]
<
Recommended soldering condition
>
Diagram1 Shown below is a recommended reflow soldering condition.
degC
250
230
200
170
140
Temperature
60~180 sec.
Time
30~60 sec.
3mm
45mm
t=0.8mm
45mm
Within 0.1mm
Solder a component on a PC board using the recommended condition shown below and
then press the component sideways at 1mm/sec. Destruction limit 9.8N or greater.
Balun Delivery Specification
Enact. Date November 15, 2002
Enfo. Date November 15, 2002
P.S.M
-----
M. Mizuno
Check
M. Mizuno
Plan
H. Ito
EHF1BG1800
Cautions
Drawing No.
151
-
EHF
-
1BG1800 9
-
5
[
Cautions for use
]
(1) Operating a product over the maximum rating for even a moment may result in a
product failure or breakage. Never use a product in such a condition that it may
cause a safety problem.
(2) Opening or short-circuiting the product terminals or inserting a product in the
reverse orientation while power is being supplied may cause a breakage. Always
avoid such circumstances.
(3) Operations in a corrosive gas atmosphere or improper environments such as high-
temperature, high -humidity or dewy conditions may lead to product performance
deterioration, a breakage, a change in appearance etc. Please avoid such
conditions, as they are unsafe.
(4) Always ground the soldering iron or soldering bath used for assembly operation to
avoid any excessive voltage applied to a product.
(5) After soldering with solder bridges, incomplete soldering or in the reverse
orientation, supplying power may result in a product breakage. Please confirm the
soldered condition before supplying power to the product.
(6) Excessive stress on the terminals may cause a contact failure or performance
deterioration. Please use caution.
(7) Please provide a fail-safe provision in the product you design by taking any failure
of our product into consideration.
(8) This product does not include a DC-cutting device. Application of a DC voltage
between the Balance port and the Unbalance port may cause product deterioration
or breakage.
* If any question arises about the safety of this product, please contact us immediately with a
request for an engineering examination.
[Remarks]
*1: All of the materials used in this product are those listed as the existing chemical
substances based on the “Law for examination and regulation of manufacture of
chemical substances”.
*2: The production process of this product does not use any ozone-depleting
chemicals (OZC) regulated by the Montreal Protocol.
*3: Validity of this specification is 5 years from the date of issue, but the validity is
considered on going unless any changes are made.
Balun Delivery Specification
Enact. Date November 15, 2002
Enfo. Date November 15, 2002
P.S.M
-----
M. Mizuno
Check
M. Mizuno
Plan
H. Ito
EHF1BG1800
Packaging specification 1
Drawing No.
151
-
EHF
-
1BG1800 9
-
6
[
Packaging materials
]
1. Materials 1) Embossed carrier tape (Refer to the attachment)
2) Top tape: Anti-static
3) Packaging box (Refer to the attachment)
4) Packaging tape, carrier-securing adhesive tape
2. Specification
No.
1
2
3
4
5
6
7
8
9
10
Item
Reel outer diameter
Reel inner diameter
Reel inner width
Quantity in a reel
Taping direction
Top tape
attachment
position
Label attachment
position
Tape leader part
and tape ending
part
Missing products
Packaged quantity in a box
Remarks
Tape breaks force.
Min. 10N
Top cover tape strength.
Min. 10N
Tape peel force.
0.1…1.0N
Tape peel angle.
165…180degree
Reel weight.
Max 1500g
Indicated Item
Pat No., Lot No.
Quantity, Maker
Country
63000 pieces/box(Max)
Condition
Refer to the attachment.
Refer to the attachment.
Refer to the attachment.
3000 pieces/reel
Tape unreeling direction
(with markings facing up)
Top tape
< Top tape attachment area > Embossed tape
Top tape edge must stay inside the sprocket holes of the embossed
carrier (Sprocket holes shall not be covered).
Tape unreeling direction
Label
Leader part
No missing products shall be allowed.
21 reels/box (Max)
8.0+/-0.2mm 5.5mm
200~220mm
(Product-unloaded part)
100~150mm, 25~38 pieces
worth, (Product-unloaded part)
300~
400mm
Ending part
Product-loaded part
Top tape
Embossed carrier
Balun Delivery Specification
Enact. Date November 15, 2002
Enfo. Date
N
ovember 15, 2002
P.S.M
-----
M. Mizuno
Check
M. Mizuno
Plan
H. Ito
EHF1BG1800
Packaging specification 2
Drawing No.
151
-
EHF
-
1BG1800 9
-
7
1. Method
1) Load products in each cavity of an embossed carrier tape, in the correct orientation, by
leaving the product-unloaded part shown in Item No. 8(P9-6) of the packaging specification.
2) Heat-seal a top tape in good alignment on the carrier tape.
3) After 3000 pieces are loaded and reeled, provide a product-unloaded part at the tape-
leader
portion. Secure the tip of the carrier tape with a piece of adhesive tape.
4) Stack the reels (21 reels max.) and enclose them in a packaging box. Close the flaps with a
piece of adhesive tape.
5) Provide markings on the packaging box.
< Items to be indicated >
1. Part No.
2. Quantity
3. Lot No.
4. Manufacturer name
5. Country of origin
* Insert cushion material in the empty
spaces to secure reels.
Number of
stacking, 21
reels max.
Packaging box shape varies
with the number of reels enclosed.
Reel label
Marking on the packaging box
Balun Delivery Specification
Enact. Date November 15, 2002
Enfo. Date November 15, 2002
P.S.M
-----
M. Mizuno
Check
M. Mizuno
Plan
H. Ito
EHF1BG1800
Packaging specification 3
Drawing No.
151
-
EHF
-
1BG1800 9
-
8
[Embossed tape dimensions] Unit: mm
<Remarks>
(1) Unspecified corner radius shall be 0.3mm max.
(2) Cumulative pitch error of sprocket holes shall be +/-0.2mm for 10 pitches.
0.2
3.5
3.5
1.
3
+/
-
0.05
+/
-
0.1
+/
-
0.1
4
+/
-
0.1
2
4
d
1.05
d
1.55
+/
-
0.06
+/
-
0.05
+/
-
0.1
+/-0.05
1.75
3.5
(2.75)
8
+/
-
0.1
+/
-
0.05
+/
-
0.2
1.95
1.9
0.3
+/
-
0.1
+/
-
0.1
0.3
+/
-
0.1
Balun Delivery Specification
Enact. Date November 15, 2002
Enfo. Date November 15, 2002
P.S.M
-----
M. Mizuno
Check
M. Mizuno
Plan
H. Ito
EHF1BG1800
Packaging specification 4
Drawing No.
151
-
EHF
-
1BG1800 9
-
9
[Reel dimensions] Unit: mm
(1) This reel conforms to EIAJ-RRM-08B based on EIAJ standard.
(2) Material: PS (Polystyrene)
Number
ƒÓ 44
ƒÓ 44
ƒÓ 3
R85
A ƒÓ 180 0
-3
H
N ƒÓ 60
+1
0
ƒÓ 13
B
3 B
3 B
W1
W2
H3
5
4
110
105
0.8
0.6
0.4
0.2
0.8
0.6
0.4
0.2
Scale
ƒÓ 3
2
MIN 18.0
3}0. 2
2
MIN 18.0
2
MIN 18.0
2}0.2
R10.5}0.4
ƒÓ 10
120}0.2
120}0.2
R0.5
2-R1
2-R1
Rim , Hub
Rim A Hub N
180 0
-3 60 +1
0
Inner width , Outer width
Tape width Inner width W1 Outer width W2
8 9+/-0.3 11+/-1.0
Center area
Label
105...50