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©2010-2011 by RF Monolithics, Inc. XTC7004G - 4/4/11
Electrical Characteristics
Characteristic Sym Notes Minimum Typical Maximum Units
Nominal Frequency FO16.367667 MHz
Frequency Tolerance after Reflow ±2 ppm maximum @ 25 ±3 °C
Storage Temperature Range in Tape and Reel -40 +85 °C
Operating Temperature Range -30 +85 °C
Power Supply Voltage Range VCC 2.70 2.85 3.00 V
Output Voltage with 10 pF || 10 KΩ Load 0.8 VP-P
Output Waveform Clipped Sinewave
Power Supply Current ICC 1.5 mA
Frequency Stability versus:
Temperature, -30 to 85 °C ±0.5 ppm
Load Variation, 10 pF || 10 KΩ ±10% ±0.2 ppm
Supply Voltage, 2.85 V ±5% ±0.2 ppm
Start Up Time, 90% of Final RF Level in VP-P 2.0 ms
Harmonics -5.0 dBc
Frequency Slope, measured at least every 2 °C, -20 to +75 °C ±0.1 ppm/°C
Static Temperat ure Hyst eresis 0.6 ppm
SSB Phase Noise @ 1 kHz Carrier Offset -130 dBc/Hz
Aging @ 25 °C ±1.0 ppm/yr
Stanard Shipping Quantity on 180 mm (7”) Reel 1000 units
Lid Symbolization 3P
• Temperature Compensated Crystal Oscillator
• Ultra-miniature 2.5 x 2.0 x 0.8 mm Package
• Excellent Frequency Stability
• Low Phase Noise
• Complies wit h Di rec ti ve 20 02/ 95/EC (RoHS)
16.367667 MHz
TCXO
XTC7004G
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1. The design, manufacturing process, and specifications of this device are subj ect to change witho ut notice.
Preliminary
2 >
4-Terminal SMD Case
Pin Connections
Connecti on Terminals
Ground 1
Ground 2
TCXO Output 3
VDD 4
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©2010-2011 by RF Monolithics, Inc. XTC7004G - 4/4/11
V
D D
1 0 n F
O u t p u t
T e m p e r a t u r e
C o m p e n s a t e d
C r y s t a l
O s c i l l a t o r
1
2 3
4
A
B
C
D
E
FG
H
I
1 2
34
1
34
2
J
K
L
M
1
34
2
4 Terminal Surface Mount Seam Welded Case
2.5 x 2.0 mm Nominal Footprint
Case and PCB Land Dimensions
Case Materials
Dimension mm Inches
Min Nom Max Min Nom Max
A2.30 2.50 2.70 0.091 0.098 0.106
B1.80 2.00 2.20 0.071 0.079 0.087
C- - 0.80 - - 0.031
D-2.39- -0.094-
E-1.45- -0.057-
F-1.89- -0.074-
G-0.65- -0.026-
H-0.47- -0.019-
I-0.62- -0.024-
J-2.97- -0.117-
K-1.25- -0.049-
L-2.45- -0.096-
M-0.45- -0.018-
Materials
Solder Pad
Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
Lid Plating 2.0 to 3.0 µm Nickel
Body Al2O3 Ceramic
Pb Free
TCXO Application Circuit
PCB Land Patter n
(Top View)
Top
Side Bottom
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©2010-2011 by RF Monolithics, Inc. XTC7004G - 4/4/11
Reel Dimensions
Tap e Dime nsio ns
