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1. Description
The LOPL (LiteOn Power LED) Emitter I is a 1W power LED package which is a point light source with more
energy efficient than incandescent and halogen lamps. It gives you total design freedom and unmatched
brightness, creating a new opportunities for solid state lighting to displace conventional lighting technologies.
Features
l High power LED light source
l Long life, up to 100k hours
l Instant light (less than 100 ns)
l Low voltage DC operated
l Low thermal resistance
l RoHS Compliant
l Lead free reflow solder compatible
Applications
l Portable lights
l Traffic signaling
l Backlighting
l Interior & exterior automotive lighting
l Decorative and landscape lighting
l Medical illumination
2. Outline Dimensions
Notes
1. All dimensions are in millimeters.
2. Tolerance is ±0.2 mm (.008") unless otherwise noted.
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3. Rating and Characteristics
3.1 Absolute Maximum Ratings at Ta=25°C
Parameter Symbol Rating Unit
Power Dissipation Po 1.15 W
Forward Current IF 350 mA
Forward Pulse Current IFP 500 mA
Reverse Voltage VR 5 V
Junction Temperature Tj 125 °C
Thermal Resistance, Junction-Case Rth, J-C 13.7 °C/W
Operating Temperature Range Topr -40 - 80 °C
Storage Temperature Range Tstg -40 - 120 °C
Soldering Condition 1, 2 Tsol 260°C For 5 Seconds
Notes
1. Proper current derating must be observed to maintain junction temperature below the maximum.
For more information, consult the LOPL Emitters application notes, available upon request.
2. Measured at leads, during lead soldering and heat pad attach, body temperature must not exceed
150°C. LOPL Emitters can be soldered by general IR reflow, or select heating the leads by hot bar
reflow or hand soldering.
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3.2 Electro-Optical Characteristics at Ta=25°C
Parameter Symbol
MIN. TYP. MAX.
Test Condition Unit
Forward Voltage VF 2.07 2.57 3.27 IF= 350mA V
Reverse Current IR 100 VR = 5V μA
Luminous Flux 1 ΦV 39.8 44.0 IF = 350mA lm
Dominant Wavelength lD 613 617 620 IF = 350mA nm
Temperature Coefficient of lD TCl 0.06 IF = 350mA, Topr nm/°C
Temperature Coefficient of VF TCV -2.0 IF = 350mA, Topr mV/°C
Notes
1. Luminous flux is the total luminous flux output as measured with an integrating sphere.
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3.3 Typical Electrical / Optical Characteristics Curves
0%
20%
40%
60%
80%
100%
400 450 500 550 600 650 700 750
Wavelength (nm)
Relative Intensity (%)
Fig 1. Relative Spectrum of Emission
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0
100
200
300
400
1.5 2.0 2.5 3.0
Forward Voltage VF (V)
Forward Current IF (mA)
Fig 2. Forward Current
0
100
200
300
400
0 40 80 120
Ambient Temperature (°C)
Forward Current IF (mA)
Rth, J-C
Rth, J-C
Rth, J-C
Rth, J-C
Fig 3. Forward Current Derating Curve
0%
20%
40%
60%
80%
100%
0 100 200 300 400
Forward Current I
F
(mA)
Relative Luminous Flux
Fig 4. Relative Luminous Flux
616.5
617.0
617.5
618.0
618.5
619.0
0100 200 300 400
Forward Current IF (mA)
Dominant Wavelength (nm)
Fig 5. Wavelength Shift
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4. Category Code Table
R F H1
Dominant Wavelength Categories
Code Min Max
H1 613.5 620.5
Forward Voltage Categories
Code Min Max
D 2.07 2.31
E 2.31 2.55
F 2.55 2.79
G 2.79 3.03
H 3.03 3.27
Luminous Flux Categories
Code Min Max
R 39.8 51.7
S 51.7 67.2
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5. Reflow Soldering Characteristics
Time
Temperature
tP
Preheat, t
S
tL
TSmin
TSmax
25
°
C to Peak,
TL
Ramp-down
Ramp-up
TP
`
Profile Feature Lead Free Assembly
Average Ramp-Up Rate (TSmax to TP) 3°C / second max
Preheat Temperature Min (TSmin) 150°C
Preheat Temperature Max (TSmax) 200°C
Preheat Time (tSmin to tSmax) 60 – 180 seconds
Time Maintained Above Temperature (TL) 217°C
Time Maintained Above Time (tL) 60 – 150 seconds
Peak / Classification Temperature (TP) 260°C
Time Within 5°C of Actual Peak Temperature (tP) 20 – 40 seconds
Ramp – Down Rate 6°C / second max
Time 25°C to Peak Temperature 8 minutes max
Notes: All temperatures refer to topside of the package, measured on the package body surface.
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6. Recommend Solder Pad
15.05
1.1
1.6 x 2.65
Solder Pad
8±0.05
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7. Package Dimensions of Tape and Reel
24.4
62.01.5
180.01.5
20.50.8
12.75
28.4 2.0
+0.5
-0.2
-0.1
+0.2
11.50
1.75 12.00±0.1 2.00
4.00
24.00±0.30
14.80
-0
+0.1
1.50
Progressive direction
Note:
1. 500pcs per reel.
2. Drawings not to scale.
3. The tolerance unless mentioned is ±0.1mm, Unit=mm.
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8. Cautions
8.1 Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).
8.2 Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are soldered within one week.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C
for at least 24 hours before solder assembly.
8.3 Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be
incorporated in the drive circuit, in series with each LED as shown in Circuit A below.
LED
LED
Circuit model A Circuit model B
(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs.
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8.4 ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage:
l Use a conductive wrist band or anti-electrostatic glove when handling these LEDs.
l All devices, equipment, and machinery must be properly grounded.
l Work tables, storage racks, etc. should be properly grounded.
l Use ion blower to neutralize the static charge which might have built up on surface of the LED’s
plastic lens as a result of friction between LEDs during storage and handling.
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low
forward voltage, or “no light up” at low currents. To verify for ESD damage, check for “light up” and VF
of the suspect LEDs at low currents. The V
F
of “good” LEDs should be >2.0V@0.1mA for InGaN
product.
8.5 Suggested Checking List
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel
strap or conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all
DLs?
5. All wrist strap or heel strap checkers calibration up to date?
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Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at
static-safe workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycles?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?