12-Bit A/D Converter AD1671 1.0 2.0 2.1 SCOPE This specification documents the detail requirements for space qualified product manufactured on Analog Devices, Inc.'s QML certified line per MIL-PRF-38535 Level V except as modified herein. The manufacturing flow described in the STANDARD SPACE LEVEL PRODUCTS PROGRAM brochure is to be considered a part of this specification. This brochure can be found at: http://www.analog.com/aerospace This data sheet specifically details the space grade version of this product. A more detailed operational description and a complete data sheet for commercial product grades can be found at www.analog.com/AD1671 Part Number. The complete part number(s) of this specification follow: Part Number Description AD1671-703D 12-Bit A/D Converter AD1671-703F 12-Bit A/D Converter AD1671-713D 12-Bit A/D Converter with radiation test AD1671-713F 12-Bit A/D Converter with radiation test Case Outline. Letter Descriptive designator Case Outline (Lead Finish per MIL-PRF-38535) D CDIP2-T28 28-Lead sidebrazed DIP (.6") F CDFP3-F28 28-Lead bottom-brazed flatpack Figure 1 - Terminal connections. ASD0010777 Rev. I Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.326.8703 (c) 2009 Analog Devices, Inc. All rights reserved. AD1671 3.0 Absolute Maximum Ratings. (TA = 25C, unless otherwise noted) VCC to ACOM................................................................................................-0.5V to +6.5V VEE to ACOM................................................................................................-6.5V to +0.5V VLOGIC to DCOM........................................................................................... -0.5V to +6.5V ACOM to DCOM......................................................................................... -1.0V to +1.0V VCC to VLOGIC ................................................................................................ -6.5V to +6.5V ENCODE to DCOM......................................................................... -0.5V to VLOGIC +0.5V REF IN, BPO/UPO to ACOM ............................................................. -0.5V to VCC +0.5V AIN to ACOM............................................................................................... -11V to +11V Power Dissipation ..................................................................................................1000mW Operating Temperature Range...................................................................-55C to +125C Storage Temperature Range.......................................................................-65C to +150C Lead Temperature (Soldering, 60 sec.) ....................................................................+300C Junction Temperature (TJ)........................................................................................+150C 3.1 Thermal Characteristics: Thermal Resistance, SBDIP (D) Package Junction-to-Case ( JC) = 28C/W Max Junction-to-Ambient ( JA) = 60C/W Max Thermal Resistance, Bottom brazed (F) Package Junction-to-Case ( JC) = 22C/W Max Junction-to-Ambient ( JA) = 60C/W Max Figure 2. Functional block diagram ASD0010777 Rev. I | Page 2 of 7 AD1671 4.0 Electrical Table: TABLE I Parameter See notes at end of table Resolution Integral nonLinearity Symbol Differential nonLinearity Unipolar offset error Unipolar offset drift DNL VOSE TCVOS Gain Error Gain drift Bipolar zero error Bipolar zero drift Analog input ranges AE TCA BPOE TCBPO VIN Reference voltage Reference drift VRO TCVRO Reference Current IREF Power dissipation Power Supply Current PD ICC IEE PSRR Input Logic voltages Input Logic Current Output Logic Voltage Output Logic Current Signal to noise plus distortion Effective number of bits Total harmonic distortion Peak spurious of peak harmonic component Intermodulation distortion Conversion time Sample Rate RES INL ILOGIC VCC VEE VLOGIC VIH VIL IIH IIL VOH VOL IOH IOL SINAD ENOB THD PS 2nd 3rd TCONV Conditions Note 1/ All codes histogram All codes histogram 2.5V, 5V span 2.5V, 5V span TA = -55C, +125C Unipolar & bipolar Unipolar & Bipolar TA = -55C, +125C 2.5V, 5V span 2.5V, 5V span TA = -55C, +125C Unipolar Rin=10M 3/ Mode Rin=10K 3/ Bipolar Mode Rin=10M 3/ Rin=10K 3/ Unipolar & Bipolar 2/ Unipolar & Bipolar 2/ TA = -55C, +125C Unipolar Mode 2/ Bipolar Mode 2/ VS = 5.25V, VLOGIC = +5.5V Tested under static conditions Sub group 1, 2, 3 1 2, 3 1, 2, 3 1 8 1 8 1 8 1,2,3 1,2,3 1,2,3 1,2,3 1 8 2.475 1 1 1,2,3 1,2,3 Full-Scale Change measured 1,2,3 Encode Input 1,2,3 IOH = 500A IOL = 1.6mA Limit Min 1,2,3 -10 1,2,3 2.4 9,10,11 9 9,10,11 9,10,11 Bits LSB Bits LSB ppm/ C %FSR ppm/ C LSB ppm/ C V 2.5 1 750 75 -75 5 4 mA V ppm/ C mW mA LSB V 0.8 10 A V 0.4 500 -1.6 68 11 -73 -75 2nd order products 3rd order products 9,10,11 -75 See figure 3 2/ 9,10,11 9,10,11 800 1.25 ASD0010777 Rev. I | Page 3 of 7 Units 0.37 40 10 30 2.5 5 2.5 5 2.525 30 2.0 1,2,3 fIN = 100KHz, fS = 1MHz, -0.5 dB input Limit Max 12 2.5 3 11 9 20 A mA dB Bits dB ns MSPS AD1671 TABLE I (continued) Parameter See notes at end of table Encode width high (short encode) Encode width Low (long encode) DAV pulse width Encode falling edge delay Start new conversion delay Data and QTR delay from DAV falling edge Data and OTR delay from DAV rising edge Symbol Conditions Note 1/ tENC See figure 3 2/ Sub group 9,10,11 tENCL See figure 3 2/ 9,10,11 20 tDAV tF tR tDD See figure 3 See figure 3 2/ See figure 3 2/ See figure 3 2/ 9,10,11 9 9 9 150 0 0 20 tSS See figure 3 2/ 9 20 TABLE I NOTES: 1/ VCC = +5V, VEE = -5V, VLOGIC = +5V, unless otherwise specified. 2/ This parameter is guaranteed, but not necessarily tested. 3/ RIN values are typical values only. Encode Pulse High Figure 3. Timing Diagrams ASD0010777 Rev. I | Page 4 of 7 Limit Min 20 Limit Max 50 300 Units ns AD1671 Encode Pulse Low Figure 3. Timing diagram. 4.1 Electrical Test Requirements: Table II Test Requirements Interim Electrical Parameters Final Electrical Parameters Group A Test Requirements Group C end-point electrical parameters Group D end-point electrical parameters Group E end-point electrical parameters 1/ 2/ Subgroups (in accordance with MIL-PRF-38535, Table III) 1 1, 2, 3, 8, 9, 10, 11 1/ 2/ 1, 2, 3, 9, 10, 11 1 2/ 1 1 PDA applies to Subgroup 1 only. Deltas excluded from PDA. See table III for delta parameters. ASD0010777 Rev. I | Page 5 of 7 AD1671 4.2 Table III. Lifetest / Burn-in delta limits. Table III TEST TITLE ICC VOH VOL 5.0 BURN-IN ENDPOINT 75 2.4 0.4 LIFETEST ENDPOINT 75 2.4 0.4 DELTA 7.5 0.24 0.1 UNITS mA max V min V max Life Test/Burn-In Circuit: 5.1 HTRB is not applicable for this drawing. 5.2 Burn-in is per MIL-STD-883 Method 1015, test condition B. 5.3 Steady state life test is per MIL-STD-883 Method 1005, test condition B. ASD0010777 Rev. I | Page 6 of 7 AD1671 Rev A B C D Description of Change Initiate Add flatpack. Add radiation part number. Exclude Delta's from PDA. Delete reference to unused subgroups in table II. Update Table III. Update web address. Change Table I AC parameters from subgroups 1, 2, 3 to subgroups 9, 10, 11. (SINAD, THD, PS, 2nd and 3 ) Delete burn-in circuit Change TCVOS, TCA, TCBPO, TCVRO from subgroups 2, 3 to subgroup 8. Add subgroup 8 to Table II. Update header/footer and add to 1.0 Scope description. Add Junction Temperature (TJ).....+150C Change subgroup for ENOB to 9 Date Feb. 29, 2000 Aug. 21, 2001 Feb. 14, 2002 Jan. 9, 2003 RD E F G H I (c) 2009 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective companies. Printed in the U.S.A. 8/09 ASD0010777 Rev. I | Page 7 of 7 Aug. 5, 2003 Jun. 14, 2004 Feb. 12, 2008 April 4, 2008 Aug. 3, 2009