S12
Microcontrollers
freescale.com
MC9S12G Family
Reference Manual
MC9S12GRMV1
Rev.1.06
November 8, 2011
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 2
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
To provide the most up-to-date information, the revision of our documents on the World Wide Web will be
the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
http://freescale.com/
A full list of family members and options is included in the appendices.
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 3
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The following revision history table summarizes changes contained in this document.
MC9S12G Family Reference Manual, Rev.1.06
4 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Revision History
Date Revision
Level Description
Feb, 2011 0.49
• Updated Chapter 1, “Device Overview MC9S12G-Family”
(Reason: Spec update)
• Updated Chapter 11, “Analog-to-Digital Converter (ADC10B8CV2)”
(Reason: Spec update)
• Updated Chapter 12, “Analog-to-Digital Converter (ADC10B12CV2)”
(Reason: Spec update)
• Updated Chapter 13, “Analog-to-Digital Converter (ADC12B12CV2)”
(Reason: Spec update)
• Updated Chapter 13, “Analog-to-Digital Converter (ADC10B16CV2)”
(Reason: Spec update)
• Updated Chapter 14, “Analog-to-Digital Converter (ADC12B16CV2)”
(Reason: Spec update)
• Updated Appendix A, “Electrical Characteristics”
(Reason: Updated electricals)
Mar, 2011 0.50
• Updated Chapter 16, “Freescale’s Scalable Controller Area Network (S12MSCANV3)”
(Reason: Spec update)
• Updated Appendix A, “Electrical Characteristics”
(Reason: Updated electricals)
Apr, 2011 0.51
• Updated Chapter 1, “Device Overview MC9S12G-Family”
(Reason: Spec update)
• Updated Chapter 8, “S12S Debug Module (S12SDBG)”
(Reason: Upated application information)
• Updated Chapter 12, “Analog-to-Digital Converter (ADC10B12CV2)”
(Reason: Corrected spec)
• Updated Chapter 13, “Analog-to-Digital Converter (ADC10B16CV2)”
(Reason: Updated spec)
• Updated Chapter 14, “Analog-to-Digital Converter (ADC12B16CV2)”
(Reason: Updated spec)
• Updated Appendix A, “Electrical Characteristics”
(Reason: Updated electricals)
Apr, 2011 0.52 • Updated Appendix A, “Electrical Characteristics”
(Reason: Updated electricals)
Apr, 2011 1.00 • Public relasease for the launch of the S12G96 and the S12G128
May, 2011 1.01
• Updated Chapter 1, “Device Overview MC9S12G-Family”
(Reason: Typos and formatting)
• Updated Appendix A, “Electrical Characteristics”
(Reason: Updated electricals)
Jun, 2011 1.02 • Updated Appendix A, “Electrical Characteristics”
(Reason: Updated electricals)
Jul, 2011 1.04 • Updated Appendix A, “Electrical Characteristics”
(Reason: Updated electricals)
Jul, 2011 1.05 • Updated Appendix A, “Electrical Characteristics”
(Reason: Updated electricals)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 5
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
This document contains information for all constituent modules, with the exception of the CPU. For CPU
information please refer to CPU12-1 in the CPU12 & CPU12X Reference Manual
Nov, 2011 1.06
• Updated Chapter 2, “Port Integration Module (S12GPIMV0)”
(Reason: Updated spec)
• Updated Appendix A, “Electrical Characteristics”
(Reason: Updated electricals)
Revision History
Date Revision
Level Description
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 7
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 1 Device Overview MC9S12G-Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Chapter 2 Port Integration Module (S12GPIMV0) . . . . . . . . . . . . . . . . . . . . . . . . . . .119
Chapter 3 5V Analog Comparator (ACMPV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .215
Chapter 4 Reference Voltage Attenuator (RVAV1) . . . . . . . . . . . . . . . . . . . . . . . . . .220
Chapter 5 S12G Memory Map Controller (S12GMMCV1) . . . . . . . . . . . . . . . . . . . . .233
Chapter 6 Interrupt Module (S12SINTV1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .247
Chapter 7 Background Debug Module (S12SBDMV1) . . . . . . . . . . . . . . . . . . . . . . .255
Chapter 8 S12S Debug Module (S12SDBG). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .279
Chapter 9 Security (S12XS9SECV2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .321
Chapter 10 S12 Clock, Reset and Power Management Unit (S12CPMU) . . . . . . . . .327
Chapter 11 Analog-to-Digital Converter (ADC10B8CV2) . . . . . . . . . . . . . . . . . . . . . .375
Chapter 12 Analog-to-Digital Converter (ADC10B12CV2) . . . . . . . . . . . . . . . . . . . . .397
Chapter 13 Analog-to-Digital Converter (ADC10B16CV2) . . . . . . . . . . . . . . . . . . . . .421
Chapter 14 Analog-to-Digital Converter (ADC12B16CV2) . . . . . . . . . . . . . . . . . . . . .445
Chapter 15 Digital Analog Converter (DAC_8B5V) . . . . . . . . . . . . . . . . . . . . . . . . . . .469
Chapter 16 Freescale’s Scalable Controller Area Network (S12MSCANV3) . . . . . .481
Chapter 17 Pulse-Width Modulator (S12PWM8B8CV2) . . . . . . . . . . . . . . . . . . . . . . .535
Chapter 18 Serial Communication Interface (S12SCIV5) . . . . . . . . . . . . . . . . . . . . . .565
Chapter 19 Serial Peripheral Interface (S12SPIV5) . . . . . . . . . . . . . . . . . . . . . . . . . . .603
Chapter 20 Timer Module (TIM16B8CV3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .631
Chapter 21 16 KByte Flash Module (S12FTMRG16K1V1) . . . . . . . . . . . . . . . . . . . . .659
Chapter 22 32 KByte Flash Module (S12FTMRG32K1V1) . . . . . . . . . . . . . . . . . . . . .707
Chapter 23 48 KByte Flash Module (S12FTMRG48K1V1) . . . . . . . . . . . . . . . . . . . . .759
Chapter 24 64 KByte Flash Module (S12FTMRG64K1V1) . . . . . . . . . . . . . . . . . . . . .811
Chapter 25 96 KByte Flash Module (S12FTMRG96K1V1) . . . . . . . . . . . . . . . . . . . . .863
Chapter 26 128 KByte Flash Module (S12FTMRG128K1V1) . . . . . . . . . . . . . . . . . . .915
Chapter 27 192 KByte Flash Module (S12FTMRG192K2V1) . . . . . . . . . . . . . . . . . . .967
Chapter 28 240 KByte Flash Module (S12FTMRG240K2V1) . . . . . . . . . . . . . . . . . .1019
Appendix A Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1071
Appendix B Detailed Register Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1119
Appendix C Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1139
Appendix D Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1141
MC9S12G Family Reference Manual, Rev.1.06
8 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 9
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 1
Device Overview MC9S12G-Family
1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
1.2.1 MC9S12G-Family Comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
1.2.2 Chip-Level Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
1.3 Module Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
1.3.1 S12 16-Bit Central Processor Unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
1.3.2 On-Chip Flash with ECC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
1.3.3 On-Chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
1.3.4 Port Integration Module (PIM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
1.3.5 Main External Oscillator (XOSCLCP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
1.3.6 Internal RC Oscillator (IRC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
1.3.7 Internal Phase-Locked Loop (IPLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
1.3.8 System Integrity Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
1.3.9 Timer (TIM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
1.3.10 Pulse Width Modulation Module (PWM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
1.3.11 Controller Area Network Module (MSCAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
1.3.12 Serial Communication Interface Module (SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
1.3.13 Serial Peripheral Interface Module (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
1.3.14 Analog-to-Digital Converter Module (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
1.3.15 Reference Voltage Attenuator (RVA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
1.3.16 Digital-to-Analog Converter Module (DAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
1.3.17 Analog Comparator (ACMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
1.3.18 On-Chip Voltage Regulator (VREG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
1.3.19 Background Debug (BDM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
1.3.20 Debugger (DBG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
1.4 Key Performance Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
1.5 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
1.6 Family Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
1.6.1 Part ID Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
1.7 Signal Description and Device Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
1.7.1 Pin Assignment Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
1.7.2 Detailed Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
1.7.3 Power Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
1.8 Device Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
1.8.1 S12GN16 and S12GN32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
1.8.2 S12GN48 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
1.8.3 S12G48 and S12G64 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
1.8.4 S12G96 and S12G128 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
1.8.5 S12G192 and S12G240 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
1.8.6 S12GA192 and S12GA240 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
1.9 System Clock Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
1.10 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
1.10.1 Chip Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
MC9S12G Family Reference Manual, Rev.1.06
10 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.10.2 Low Power Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
1.11 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
1.12 Resets and Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
1.12.1 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
1.12.2 Interrupt Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
1.12.3 Effects of Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
1.13 COP Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
1.14 Autonomous Clock (ACLK) Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
1.15 ADC External Trigger Input Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
1.16 ADC Special Conversion Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
1.17 ADC Result Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
1.18 ADC VRH/VRL Signal Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Chapter 2
Port Integration Module (S12GPIMV0)
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
2.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
2.1.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
2.1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
2.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
2.2 PIM Routing - External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
2.2.1 Package Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
2.2.2 Prioritization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
2.2.3 Signals and Priorities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
2.3 PIM Routing - Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
2.3.1 Pin BKGD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
2.3.2 Pins PA7-0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
2.3.3 Pins PB7-0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
2.3.4 Pins PC7-0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
2.3.5 Pins PD7-0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
2.3.6 Pins PE1-0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
2.3.7 Pins PT7-0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
2.3.8 Pins PS7-0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
2.3.9 Pins PM3-0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
2.3.10 Pins PP7-0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
2.3.11 Pins PJ7-0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
2.3.12 Pins AD15-0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
2.4 PIM Ports - Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
2.4.1 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
2.4.2 Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
2.4.3 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
2.5 PIM Ports - Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208
2.5.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208
2.5.2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208
2.5.3 Pin Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 11
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.5.4 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
2.6 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213
2.6.1 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213
2.6.2 Port Data and Data Direction Register writes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213
2.6.3 Enabling IRQ edge-sensitive mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213
2.6.4 ADC External Triggers ETRIG3-0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213
2.6.5 Emulation of Smaller Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
Chapter 3
5V Analog Comparator (ACMPV1)
3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215
3.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215
3.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215
3.4 External Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216
3.5 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216
3.6 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
3.6.1 Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
3.6.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
3.7 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219
Chapter 4
Reference Voltage Attenuator (RVAV1)
4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
4.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
4.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
4.4 External Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
4.5 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
4.6 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
4.6.1 Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
4.6.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
4.7 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
Chapter 5
S12G Memory Map Controller (S12GMMCV1)
5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
5.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
5.1.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
5.1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234
5.1.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234
5.1.5 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234
5.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235
5.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235
5.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235
5.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236
MC9S12G Family Reference Manual, Rev.1.06
12 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
5.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240
5.4.1 MCU Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240
5.4.2 Memory Map Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240
5.4.3 Unimplemented and Reserved Address Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244
5.4.4 Prioritization of Memory Accesses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245
5.4.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245
Chapter 6
Interrupt Module (S12SINTV1)
6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247
6.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247
6.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247
6.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248
6.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248
6.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249
6.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249
6.3.1 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249
6.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250
6.4.1 S12S Exception Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250
6.4.2 Interrupt Prioritization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250
6.4.3 Reset Exception Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251
6.4.4 Exception Priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251
6.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252
6.5.1 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252
6.5.2 Interrupt Nesting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252
6.5.3 Wake Up from Stop or Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252
Chapter 7
Background Debug Module (S12SBDMV1)
7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255
7.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255
7.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 256
7.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257
7.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257
7.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257
7.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257
7.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 258
7.3.3 Family ID Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262
7.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262
7.4.1 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262
7.4.2 Enabling and Activating BDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262
7.4.3 BDM Hardware Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263
7.4.4 Standard BDM Firmware Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264
7.4.5 BDM Command Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 13
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
7.4.6 BDM Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267
7.4.7 Serial Interface Hardware Handshake Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270
7.4.8 Hardware Handshake Abort Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272
7.4.9 SYNC — Request Timed Reference Pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275
7.4.10 Instruction Tracing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275
7.4.11 Serial Communication Time Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276
Chapter 8
S12S Debug Module (S12SDBG)
8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279
8.1.1 Glossary Of Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279
8.1.2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280
8.1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280
8.1.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 281
8.1.5 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282
8.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282
8.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282
8.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282
8.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 283
8.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 299
8.4.1 S12SDBG Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 299
8.4.2 Comparator Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300
8.4.3 Match Modes (Forced or Tagged) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304
8.4.4 State Sequence Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 305
8.4.5 Trace Buffer Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 306
8.4.6 Tagging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312
8.4.7 Breakpoints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 312
8.5 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314
8.5.1 State Machine scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314
8.5.2 Scenario 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 315
8.5.3 Scenario 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 315
8.5.4 Scenario 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 316
8.5.5 Scenario 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 316
8.5.6 Scenario 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 317
8.5.7 Scenario 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 317
8.5.8 Scenario 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 317
8.5.9 Scenario 8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 318
8.5.10 Scenario 9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 319
8.5.11 Scenario 10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 319
Chapter 9
Security (S12XS9SECV2)
9.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 321
9.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 321
MC9S12G Family Reference Manual, Rev.1.06
14 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
9.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 321
9.1.3 Securing the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 322
9.1.4 Operation of the Secured Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 323
9.1.5 Unsecuring the Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324
9.1.6 Reprogramming the Security Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324
9.1.7 Complete Memory Erase (Special Modes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 325
Chapter 10
S12 Clock, Reset and Power Management Unit (S12CPMU)
10.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 327
10.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 327
10.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 329
10.1.3 S12CPMU Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 332
10.2 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 333
10.2.1 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 333
10.2.2 EXTAL and XTAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 333
10.2.3 VDDR — Regulator Power Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 334
10.2.4 VSS — Ground Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 334
10.2.5 VDDA, VSSA — Regulator Reference Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . 334
10.2.6 VDDX, VSSX— Pad Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 334
10.2.7 VDD — Internal Regulator Output Supply (Core Logic) . . . . . . . . . . . . . . . . . . . . . . . 335
10.2.8 VDDF — Internal Regulator Output Supply (NVM Logic) . . . . . . . . . . . . . . . . . . . . . 335
10.2.9 API_EXTCLK — API external clock output pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 335
10.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 335
10.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 335
10.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 337
10.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 363
10.4.1 Phase Locked Loop with Internal Filter (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 363
10.4.2 Startup from Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 364
10.4.3 Stop Mode using PLLCLK as Bus Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 365
10.4.4 Full Stop Mode using Oscillator Clock as Bus Clock . . . . . . . . . . . . . . . . . . . . . . . . . . 365
10.4.5 External Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 366
10.4.6 System Clock Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 367
10.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 369
10.5.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 369
10.5.2 Description of Reset Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 369
10.5.3 Power-On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 371
10.5.4 Low-Voltage Reset (LVR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 371
10.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 372
10.6.1 Description of Interrupt Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 372
10.7 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 374
10.7.1 General Initialization information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 374
10.7.2 Application information for COP and API usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 374
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 15
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 11
Analog-to-Digital Converter (ADC10B8CV2)
11.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 375
11.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 375
11.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 376
11.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 377
11.2 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 378
11.2.1 Detailed Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 378
11.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 378
11.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 378
11.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 380
11.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 394
11.4.1 Analog Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 394
11.4.2 Digital Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 395
11.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 396
11.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 396
Chapter 12
Analog-to-Digital Converter (ADC10B12CV2)
12.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 397
12.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 397
12.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 398
12.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 399
12.2 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400
12.2.1 Detailed Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400
12.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400
12.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400
12.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 402
12.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 417
12.4.1 Analog Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 417
12.4.2 Digital Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 418
12.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 419
12.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 419
Chapter 13
Analog-to-Digital Converter (ADC10B16CV2)
13.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 421
13.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 421
13.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 422
13.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 423
13.2 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 424
13.2.1 Detailed Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 424
13.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 424
13.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 424
MC9S12G Family Reference Manual, Rev.1.06
16 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
13.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 426
13.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 441
13.4.1 Analog Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 441
13.4.2 Digital Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 442
13.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 443
13.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 443
Chapter 14
Analog-to-Digital Converter (ADC12B16CV2)
14.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 445
14.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 445
14.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 446
14.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 447
14.2 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 448
14.2.1 Detailed Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 448
14.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 448
14.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 448
14.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450
14.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 466
14.4.1 Analog Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 466
14.4.2 Digital Sub-Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 467
14.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 468
14.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 468
Chapter 15
Digital Analog Converter (DAC_8B5V)
15.1 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 469
15.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470
15.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470
15.2.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470
15.2.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 471
15.3 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 471
15.3.1 DACU Output Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 471
15.3.2 AMP Output Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 471
15.3.3 AMPP Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 471
15.3.4 AMPM Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 472
15.4 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 472
15.4.1 Register Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 472
15.4.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 472
15.5 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 474
15.5.1 Functional Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 474
15.5.2 Mode “Off” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 475
15.5.3 Mode “Operational Amplifier” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 475
15.5.4 Mode “Unbuffered DAC” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 476
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 17
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
15.5.5 Mode “Unbuffered DAC with Operational Amplifier” . . . . . . . . . . . . . . . . . . . . . . . . . 476
15.5.6 Mode “Buffered DAC” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 476
15.5.7 Analog output voltage calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 476
Chapter 16
Freescale’s Scalable Controller Area Network (S12MSCANV3)
16.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 481
16.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 482
16.1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 482
16.1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 483
16.1.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 483
16.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 483
16.2.1 RXCAN — CAN Receiver Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 483
16.2.2 TXCAN — CAN Transmitter Output Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 484
16.2.3 CAN System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 484
16.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 484
16.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 484
16.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 486
16.3.3 Programmer’s Model of Message Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 505
16.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 515
16.4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 515
16.4.2 Message Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 516
16.4.3 Identifier Acceptance Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 519
16.4.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525
16.4.5 Low-Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 527
16.4.6 Reset Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 531
16.4.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 531
16.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 533
16.5.1 MSCAN initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 533
16.5.2 Bus-Off Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 533
Chapter 17
Pulse-Width Modulator (S12PWM8B8CV2)
17.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 535
17.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 535
17.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 535
17.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 536
17.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 536
17.2.1 PWM7 - PWM0 — PWM Channel 7 - 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 536
17.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 537
17.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 537
17.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 537
17.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 552
17.4.1 PWM Clock Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 552
MC9S12G Family Reference Manual, Rev.1.06
18 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
17.4.2 PWM Channel Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 555
17.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 562
17.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 563
Chapter 18
Serial Communication Interface (S12SCIV5)
18.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 565
18.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 565
18.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 566
18.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 566
18.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 567
18.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 567
18.2.1 TXD — Transmit Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 567
18.2.2 RXD — Receive Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 567
18.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 567
18.3.1 Module Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 568
18.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 568
18.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 579
18.4.1 Infrared Interface Submodule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 580
18.4.2 LIN Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 581
18.4.3 Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 581
18.4.4 Baud Rate Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 583
18.4.5 Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 584
18.4.6 Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 589
18.4.7 Single-Wire Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 597
18.4.8 Loop Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 598
18.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 598
18.5.1 Reset Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 598
18.5.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 598
18.5.3 Interrupt Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 599
18.5.4 Recovery from Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601
18.5.5 Recovery from Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601
Chapter 19
Serial Peripheral Interface (S12SPIV5)
19.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 603
19.1.1 Glossary of Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 603
19.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 603
19.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 604
19.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 604
19.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 605
19.2.1 MOSI — Master Out/Slave In Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 605
19.2.2 MISO — Master In/Slave Out Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606
19.2.3 SS — Slave Select Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 19
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
19.2.4 SCK — Serial Clock Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606
19.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606
19.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606
19.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 607
19.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 615
19.4.1 Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 616
19.4.2 Slave Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 617
19.4.3 Transmission Formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 618
19.4.4 SPI Baud Rate Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 624
19.4.5 Special Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625
19.4.6 Error Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 626
19.4.7 Low Power Mode Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 627
Chapter 20
Timer Module (TIM16B8CV3)
20.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 631
20.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 631
20.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 632
20.1.3 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633
20.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 635
20.2.1 IOC7 — Input Capture and Output Compare Channel 7 . . . . . . . . . . . . . . . . . . . . . . . . 635
20.2.2 IOC6 - IOC0 — Input Capture and Output Compare Channel 6-0 . . . . . . . . . . . . . . . . 635
20.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 635
20.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 635
20.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 636
20.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 653
20.4.1 Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 655
20.4.2 Input Capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 655
20.4.3 Output Compare . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 655
20.4.4 Pulse Accumulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 656
20.4.5 Event Counter Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 657
20.4.6 Gated Time Accumulation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 657
20.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 657
20.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 657
20.6.1 Channel [7:0] Interrupt (C[7:0]F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 658
20.6.2 Pulse Accumulator Input Interrupt (PAOVI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 658
20.6.3 Pulse Accumulator Overflow Interrupt (PAOVF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 658
20.6.4 Timer Overflow Interrupt (TOF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 658
Chapter 21
16 KByte Flash Module (S12FTMRG16K1V1)
21.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 659
21.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 660
21.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 660
MC9S12G Family Reference Manual, Rev.1.06
20 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 661
21.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 662
21.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 663
21.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 663
21.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 666
21.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 683
21.4.1 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 683
21.4.2 IFR Version ID Word . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 683
21.4.3 Internal NVM resource (NVMRES) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 683
21.4.4 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 683
21.4.5 Allowed Simultaneous P-Flash and EEPROM Operations . . . . . . . . . . . . . . . . . . . . . . 688
21.4.6 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 689
21.4.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 703
21.4.8 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 704
21.4.9 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 704
21.5 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 704
21.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . 704
21.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . . 705
21.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . . 706
21.6 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 706
Chapter 22
32 KByte Flash Module (S12FTMRG32K1V1)
22.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 707
22.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 708
22.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 708
22.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 709
22.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 710
22.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 711
22.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 711
22.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 714
22.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 733
22.4.1 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 733
22.4.2 IFR Version ID Word . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 733
22.4.3 Internal NVM resource (NVMRES) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 734
22.4.4 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 734
22.4.5 Allowed Simultaneous P-Flash and EEPROM Operations . . . . . . . . . . . . . . . . . . . . . . 739
22.4.6 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 740
22.4.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 754
22.4.8 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755
22.4.9 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755
22.5 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755
22.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755
22.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . . 756
22.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . . 757
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 21
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.6 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 757
Chapter 23
48 KByte Flash Module (S12FTMRG48K1V1)
23.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 759
23.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 760
23.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 760
23.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 762
23.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 762
23.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 763
23.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 763
23.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 767
23.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 786
23.4.1 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 786
23.4.2 IFR Version ID Word . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 786
23.4.3 Internal NVM resource (NVMRES) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 787
23.4.4 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 787
23.4.5 Allowed Simultaneous P-Flash and EEPROM Operations . . . . . . . . . . . . . . . . . . . . . . 792
23.4.6 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 793
23.4.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 807
23.4.8 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 808
23.4.9 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 808
23.5 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 808
23.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . 808
23.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . . 809
23.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . . 810
23.6 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 810
Chapter 24
64 KByte Flash Module (S12FTMRG64K1V1)
24.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 811
24.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 812
24.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 812
24.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 813
24.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 814
24.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 815
24.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 815
24.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 818
24.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 837
24.4.1 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 837
24.4.2 IFR Version ID Word . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 837
24.4.3 Internal NVM resource (NVMRES) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 838
24.4.4 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 838
24.4.5 Allowed Simultaneous P-Flash and EEPROM Operations . . . . . . . . . . . . . . . . . . . . . . 843
MC9S12G Family Reference Manual, Rev.1.06
22 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.4.6 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 844
24.4.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 858
24.4.8 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 859
24.4.9 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 859
24.5 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 859
24.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . 859
24.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . . 860
24.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . . 861
24.6 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 861
Chapter 25
96 KByte Flash Module (S12FTMRG96K1V1)
25.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 863
25.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 864
25.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 864
25.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 865
25.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 866
25.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 867
25.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 867
25.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 870
25.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 889
25.4.1 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 889
25.4.2 IFR Version ID Word . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 889
25.4.3 Internal NVM resource (NVMRES) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 890
25.4.4 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 890
25.4.5 Allowed Simultaneous P-Flash and EEPROM Operations . . . . . . . . . . . . . . . . . . . . . . 895
25.4.6 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 896
25.4.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 910
25.4.8 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 911
25.4.9 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 911
25.5 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 911
25.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . 911
25.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . . 912
25.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . . 913
25.6 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 913
Chapter 26
128 KByte Flash Module (S12FTMRG128K1V1)
26.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 915
26.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 916
26.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 916
26.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 917
26.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 918
26.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 919
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 23
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 919
26.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 923
26.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 941
26.4.1 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 941
26.4.2 IFR Version ID Word . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 941
26.4.3 Internal NVM resource (NVMRES) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 942
26.4.4 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 942
26.4.5 Allowed Simultaneous P-Flash and EEPROM Operations . . . . . . . . . . . . . . . . . . . . . . 947
26.4.6 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 948
26.4.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 962
26.4.8 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 963
26.4.9 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 963
26.5 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 963
26.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . 963
26.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . . 964
26.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . . 965
26.6 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 965
Chapter 27
192 KByte Flash Module (S12FTMRG192K2V1)
27.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 967
27.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 968
27.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 968
27.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 969
27.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 970
27.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 971
27.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 971
27.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 975
27.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 993
27.4.1 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 993
27.4.2 IFR Version ID Word . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 993
27.4.3 Internal NVM resource (NVMRES) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 994
27.4.4 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 994
27.4.5 Allowed Simultaneous P-Flash and EEPROM Operations . . . . . . . . . . . . . . . . . . . . . . 999
27.4.6 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000
27.4.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1013
27.4.8 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1014
27.4.9 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1014
27.5 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1015
27.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . 1015
27.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . 1016
27.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . 1016
27.6 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1016
MC9S12G Family Reference Manual, Rev.1.06
24 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 28
240 KByte Flash Module (S12FTMRG240K2V1)
28.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1019
28.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1020
28.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1020
28.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1021
28.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1022
28.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1023
28.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1023
28.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1027
28.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1045
28.4.1 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1045
28.4.2 IFR Version ID Word . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1045
28.4.3 Internal NVM resource (NVMRES) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1046
28.4.4 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1046
28.4.5 Allowed Simultaneous P-Flash and EEPROM Operations . . . . . . . . . . . . . . . . . . . . . 1051
28.4.6 Flash Command Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1052
28.4.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1065
28.4.8 Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1066
28.4.9 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1066
28.5 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1067
28.5.1 Unsecuring the MCU using Backdoor Key Access . . . . . . . . . . . . . . . . . . . . . . . . . . . 1067
28.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM . . . . . . . . . . . . . . . . 1068
28.5.3 Mode and Security Effects on Flash Command Availability . . . . . . . . . . . . . . . . . . . . 1068
28.6 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1068
Appendix A
Electrical Characteristics
A.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1071
A.1.1 Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1072
A.1.2 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1072
A.1.3 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1072
A.1.4 Current Injection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1073
A.1.5 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1073
A.1.6 ESD Protection and Latch-up Immunity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1074
A.1.7 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1075
A.1.8 Power Dissipation and Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1076
A.2 I/O Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1080
A.2.1 Supply Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1082
A.3 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1087
A.3.1 ADC Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1087
A.3.2 Factors Influencing Accuracy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1088
A.3.3 ADC Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1089
A.3.4 ADC Temperature Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1095
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 25
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.4 ACMP Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1096
A.5 DAC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1097
A.6 NVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1098
A.6.1 Timing Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1098
A.6.2 NVM Reliability Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1106
A.7 Phase Locked Loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1107
A.7.1 Jitter Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1107
A.7.2 Electrical Characteristics for the PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1109
A.8 Electrical Characteristics for the IRC1M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1109
A.9 Electrical Characteristics for the Oscillator (XOSCLCP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1110
A.10 Reset Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1110
A.11 Electrical Specification for Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1111
A.12 Chip Power-up and Voltage Drops . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1112
A.13 MSCAN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1112
A.14 SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1113
A.14.1 Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1113
A.14.2 Slave Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1115
A.15 ADC Conversion Result Reference. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1117
Appendix B
Detailed Register Address Map
B.1 Detailed Register Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1119
Appendix C
Ordering Information
Appendix D
Package Information
D.1 100 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1142
D.2 64 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1145
D.3 48 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1148
D.4 48 QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1150
D.5 32 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1153
D.6 20 TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1156
MC9S12G Family Reference Manual, Rev.1.06
26 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 27
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 1
Device Overview MC9S12G-Family
Revision History
1.1 Introduction
The MC9S12G-Family is an optimized, automotive, 16-bit microcontroller product line focused on
low-cost, high-performance, and low pin-count. This family is intended to bridge between high-end 8-bit
microcontrollers and high-performance 16-bit microcontrollers, such as the MC9S12XS-Family. The
MC9S12G-Family is targeted at generic automotive applications requiring CAN or LIN/J2602
Version
Number
Revision
Date Description of Changes
Rev 0.17 11-Aug-2010 • Typos and formatting
Rev 0.18 12-Aug-2010 • Typos and formatting
Rev 0.19 20-Aug-2010 • Typos and formatting
Rev 0.20 17-Sep-2010 • Typos and formatting
Rev 0.21 15-Oct-2010 • Corrected Table 1-28
• Typos and formatting
Rev 0.22 8-Nov-2010 • Reformatted Section 1.8, “Device Pinouts”
• Typos and formatting
Rev 0.23 3-Jan-2010 • Corrected Figure 1-4
• Corrected Figure 1-6
• Corrected Figure 1-9
• Typos and formatting
Rev 0.24 8-Feb-2010 • Added Section 1.14, “Autonomous Clock (ACLK) Configuration”
• Corrected Figure 1-12
• Corrected Figure 1-10
• Corrected Figure 1-13
• Corrected Figure 1-11
• Typos and formatting
Rev 0.25 18-Feb-2011 • Added Section 1.14, “Autonomous Clock (ACLK) Configuration”
• Corrected Figure 1-12
• Corrected Figure 1-10
• Corrected Figure 1-13
• Corrected Figure 1-11
• Typos and formatting
Rev 0.26 21-Feb-2011 • Updated Table 1-1(added temperatur sensor feature)
• Updated Section 1.3.14, “Analog-to-Digital Converter Module (ADC)”
• Updated Table 1-31
• Typos and formatting
Rev 0.27 1-Apr-2011 • Typos and formatting
Rev 0.28 11-May-2011 •
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
28 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
communication. Typical examples of these applications include body controllers, occupant detection, door
modules, seat controllers, RKE receivers, smart actuators, lighting modules, and smart junction boxes.
The MC9S12G-Family uses many of the same features found on the MC9S12XS- and MC9S12P-Family,
including error correction code (ECC) on flash memory, a fast analog-to-digital converter (ADC) and a
frequency modulated phase locked loop (IPLL) that improves the EMC performance.
The MC9S12G-Family is optimized for lower program memory sizes down to 16k. In order to simplify
customer use it features an EEPROM with a small 4 bytes erase sector size.
The MC9S12G-Family deliver all the advantages and efficiencies of a 16-bit MCU while retaining the low
cost, power consumption, EMC, and code-size efficiency advantages currently enjoyed by users of
Freescale’s existing 8-bit and 16-bit MCU families. Like the MC9S12XS-Family, the MC9S12G-Family
run 16-bit wide accesses without wait states for all peripherals and memories. The MC9S12G-Family is
available in 100-pin LQFP, 64-pin LQFP, 48-pin LQFP/QFN, 32-pin LQFP and 20-pin TSSOP package
options and aims to maximize the amount of functionality especially for the lower pin count packages. In
addition to the I/O ports available in each module, further I/O ports are available with interrupt capability
allowing wake-up from stop or wait modes.
1.2 Features
This section describes the key features of the MC9S12G-Family.
1.2.1 MC9S12G-Family Comparison
Table 1-1 provides a summary of different members of the MC9S12G-Family and their features. This
information is intended to provide an understanding of the range of functionality offered by this
microcontroller family.
Table 1-1. MC9S12G-Family Overview1
Feature S12GN16 S12GN32 S12GN48 S12G48 S12G64 S12G96 S12G128 S12G192 S12GA192 S12G240 S12GA240
CPU CPU12V1
Flash memory
[kBytes] 16 32 48 48 64 96 128 192 192 240 240
EEPROM
[Bytes] 512 1024 1536 1536 2048 3072 4096 4096 4096 4096 4096
RAM [Bytes] 1024 2048 4096 4096 4096 8192 8192 11264 11264 11264 11264
MSCAN — — — 1 1 1 1 1111
SCI 11222333333
SPI 11222333333
16-Bit Timer
channels 66666888888
8-Bit PWM
channels 66666888888
10-Bit ADC
channels 8 8 12 12 12 12 12 16 — 16 —
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 29
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 1-2shows the maximum number of peripherals or peripheral channels per package type. Not all
peripherals are available at the same time. The maximum number of peripherals is also limited by the
device chosen as per Table 1-1.
12-Bit ADC
channels ————————16—16
Temperature
Sensor — — — — — — — — YES — YES
RVA — — — — — — — — YES — YES
8-Bit DAC — — — — — — — — 2 — 2
ACMP (analog
comparator) 1 1 111——————
PLL Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
External osc Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
Internal 1 MHz
RC oscillator Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s
20-pin TSSOP Yes Yes — — — — — ————
32-pin LQFP Yes Yes Yes Yes Yes — — ————
48-pin LQFP Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
48-pin QFN Yes Yes — — — — — ————
64-pin LQFP — — Yes Yes Yes Yes Yes Yes Yes Yes Yes
100-pin LQFP — — — — — Yes Yes Yes Yes Yes Yes
Supply voltage 3.13 V – 5.5 V
Execution speed Static – 25 MHz
1Not all peripherals are available in all package types
Table 1-2. Maximum Peripheral Availability per Package
Peripheral 20 TSSOP 32 LQFP 48 LQFP,
48 QNFN 64 LQFP 100 LQFP
MSCAN — Yes Yes Yes Yes
SCI0 Yes Yes Yes Yes Yes
SCI1 — Yes Yes Yes Yes
SCI2 — — Yes Yes Yes
SPI0 Yes Yes Yes Yes Yes
SPI1 — — Yes Yes Yes
SPI2 — — — Yes Yes
Timer Channels 4 = 0 … 3 6 = 0 … 5 8 = 0 … 7 8 = 0 … 7 8 = 0 … 7
8-Bit PWM Channels 4 = 0 … 3 6 = 0 … 5 8 = 0 … 7 8 = 0 … 7 8 = 0 … 7
Table 1-1. MC9S12G-Family Overview1
Feature S12GN16 S12GN32 S12GN48 S12G48 S12G64 S12G96 S12G128 S12G192 S12GA192 S12G240 S12GA240
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
30 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.2.2 Chip-Level Features
On-chip modules available within the family include the following features:
• S12 CPU core
• Up to 240 Kbyte on-chip flash with ECC
• Up to 4 Kbyte EEPROM with ECC
• Up to 11 Kbyte on-chip SRAM
• Phase locked loop (IPLL) frequency multiplier with internal filter
• 4–16 MHz amplitude controlled Pierce oscillator
• 1 MHz internal RC oscillator
• Timer module (TIM) supporting up to eight channels that provide a range of 16-bit input capture,
output compare, counter, and pulse accumulator functions
• Pulse width modulation (PWM) module with up to eight x 8-bit channels
• Up to 16-channel, 10 or 12-bit resolution successive approximation analog-to-digital converter
(ADC)
• Up to two 8-bit digital-to-analog converters (DAC)
• Up to one 5V analog comparator (ACMP)
• Up to three serial peripheral interface (SPI) modules
• Up to three serial communication interface (SCI) modules supporting LIN communications
• Up to one multi-scalable controller area network (MSCAN) module (supporting CAN protocol
2.0A/B)
• On-chip voltage regulator (VREG) for regulation of input supply and all internal voltages
• Autonomous periodic interrupt (API)
• Precision fixed voltage reference for ADC conversions
• Optional reference voltage attenuator module to increase ADC accuracy
1.3 Module Features
The following sections provide more details of the modules implemented on the MC9S12G-Family family.
ADC channels 6 = 0 … 5 8 = 0 … 7 12 = 0 … 11 16 = 0 … 15 16 = 0 … 15
DAC0 — — Yes Yes Yes
DAC1 — — Yes Yes Yes
ACMP Yes Yes Yes Yes —
Total GPIO 14 26 40 54 86
Table 1-2. Maximum Peripheral Availability per Package
Peripheral 20 TSSOP 32 LQFP 48 LQFP,
48 QNFN 64 LQFP 100 LQFP
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 31
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.3.1 S12 16-Bit Central Processor Unit (CPU)
S12 CPU is a high-speed 16-bit processing unit:
• Full 16-bit data paths supports efficient arithmetic operation and high-speed math execution
• Includes many single-byte instructions. This allows much more efficient use of ROM space.
• Extensive set of indexed addressing capabilities, including:
— Using the stack pointer as an indexing register in all indexed operations
— Using the program counter as an indexing register in all but auto increment/decrement mode
— Accumulator offsets using A, B, or D accumulators
— Automatic index predecrement, preincrement, postdecrement, and postincrement (by –8 to +8)
1.3.2 On-Chip Flash with ECC
On-chip flash memory on the MC9S12G-Family family features the following:
• Up to 240 Kbyte of program flash memory
— 32 data bits plus 7 syndrome ECC (error correction code) bits allow single bit error correction
and double fault detection
— Erase sector size 512 bytes
— Automated program and erase algorithm
— User margin level setting for reads
— Protection scheme to prevent accidental program or erase
• Up to 4 Kbyte EEPROM
— 16 data bits plus 6 syndrome ECC (error correction code) bits allow single bit error correction
and double fault detection
— Erase sector size 4 bytes
— Automated program and erase algorithm
— User margin level setting for reads
1.3.3 On-Chip SRAM
• Up to 11 Kbytes of general-purpose RAM
1.3.4 Port Integration Module (PIM)
• Data registers and data direction registers for ports A, B, C, D, E, T, S, M, P, J and AD when used
as general-purpose I/O
• Control registers to enable/disable pull devices and select pullups/pulldowns on ports T, S, M, P, J
and AD on per-pin basis
• Single control register to enable/disable pull devices on ports A, B, C, D and E, on per-port basis
and on BKGD pin
• Control registers to enable/disable open-drain (wired-or) mode on ports S and M
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
32 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
• Interrupt flag register for pin interrupts on ports P, J and AD
• Control register to configure IRQ pin operation
• Routing register to support programmable signal redirection in 20 TSSOP only
• Routing register to support programmable signal redirection in 100 LQFP package only
• Package code register preset by factory related to package in use, writable once after reset. Also
includes bit to reprogram routing of API_EXTCLK in all packages.
• Control register for free-running clock outputs
•
1.3.5 Main External Oscillator (XOSCLCP)
• Loop control Pierce oscillator using a 4 MHz to 16 MHz crystal
— Current gain control on amplitude output
— Signal with low harmonic distortion
— Low power
— Good noise immunity
— Eliminates need for external current limiting resistor
— Transconductance sized for optimum start-up margin for typical crystals
— Oscillator pins can be shared w/ GPIO functionality
1.3.6 Internal RC Oscillator (IRC)
• Trimmable internal reference clock.
— Frequency: 1 MHz
— Trimmed accuracy over –40˚C to +125˚C ambient temperature range:
±1.0% for temperature option C and V (see Table A-4)
±1.3% for temperature option M (see Table A-4)
1.3.7 Internal Phase-Locked Loop (IPLL)
• Phase-locked-loop clock frequency multiplier
— No external components required
— Reference divider and multiplier allow large variety of clock rates
— Automatic bandwidth control mode for low-jitter operation
— Automatic frequency lock detector
— Configurable option to spread spectrum for reduced EMC radiation (frequency modulation)
— Reference clock sources:
– External 4–16 MHz resonator/crystal (XOSCLCP)
– Internal 1 MHz RC oscillator (IRC)
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 33
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.3.8 System Integrity Support
• Power-on reset (POR)
• System reset generation
• Illegal address detection with reset
• Low-voltage detection with interrupt or reset
• Real time interrupt (RTI)
• Computer operating properly (COP) watchdog
— Configurable as window COP for enhanced failure detection
— Initialized out of reset using option bits located in flash memory
• Clock monitor supervising the correct function of the oscillator
1.3.9 Timer (TIM)
• Up to eight x 16-bit channels for input capture or output compare
• 16-bit free-running counter with 7-bit precision prescaler
• In case of eight channel timer Version an additional 16-bit pulse accumulator is available
1.3.10 Pulse Width Modulation Module (PWM)
• Up to eight channel x 8-bit or up to four channel x 16-bit pulse width modulator
— Programmable period and duty cycle per channel
— Center-aligned or left-aligned outputs
— Programmable clock select logic with a wide range of frequencies
1.3.11 Controller Area Network Module (MSCAN)
• 1 Mbit per second, CAN 2.0 A, B software compatible
— Standard and extended data frames
— 0–8 bytes data length
— Programmable bit rate up to 1 Mbps
• Five receive buffers with FIFO storage scheme
• Three transmit buffers with internal prioritization
• Flexible identifier acceptance filter programmable as:
— 2 x 32-bit
— 4 x 16-bit
— 8 x 8-bit
• Wakeup with integrated low pass filter option
• Loop back for self test
• Listen-only mode to monitor CAN bus
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
34 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
• Bus-off recovery by software intervention or automatically
• 16-bit time stamp of transmitted/received messages
1.3.12 Serial Communication Interface Module (SCI)
• Up to three SCI modules
• Full-duplex or single-wire operation
• Standard mark/space non-return-to-zero (NRZ) format
• Selectable IrDA 1.4 return-to-zero-inverted (RZI) format with programmable pulse widths
• 13-bit baud rate selection
• Programmable character length
• Programmable polarity for transmitter and receiver
• Active edge receive wakeup
• Break detect and transmit collision detect supporting LIN 1.3, 2.0, 2.1 and SAE J2602
1.3.13 Serial Peripheral Interface Module (SPI)
• Up to three SPI modules
• Configurable 8- or 16-bit data size
• Full-duplex or single-wire bidirectional
• Double-buffered transmit and receive
• Master or slave mode
• MSB-first or LSB-first shifting
• Serial clock phase and polarity options
1.3.14 Analog-to-Digital Converter Module (ADC)
Up to 16-channel, 10-bit/12-bit1 analog-to-digital converter
— 3 us conversion time
— 8-/101-bit resolution
— Left or right justified result data
— Wakeup from low power modes on analog comparison > or <= match
— Continuous conversion mode
— External triggers to initiate conversions via GPIO or peripheral outputs such as PWM or TIM
— Multiple channel scans
— Precision fixed voltage reference for ADC conversions
—
• Pins can also be used as digital I/O including wakeup capability
1. 12-bit resolution only available on S12GA192 and S12GA240 devices.
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 35
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.3.15 Reference Voltage Attenuator (RVA)
• Attenuation of ADC reference voltage with low long-term drift
1.3.16 Digital-to-Analog Converter Module (DAC)
• 1 digital-analog converter channel (per module) with:
— 8 bit resolution
— full and reduced output voltage range
— buffered or unbuffered analog output voltage usable
• operational amplifier stand alone usable
1.3.17 Analog Comparator (ACMP)
• Low offset, low long-term offset drift
• Selectable interrupt on rising, falling, or rising and falling edges of comparator output
• Option to output comparator signal on an external pin
• Option to trigger timer input capture events
1.3.18 On-Chip Voltage Regulator (VREG)
• Linear voltage regulator with bandgap reference
• Low-voltage detect (LVD) with low-voltage interrupt (LVI)
• Power-on reset (POR) circuit
• Low-voltage reset (LVR)
1.3.19 Background Debug (BDM)
• Non-intrusive memory access commands
• Supports in-circuit programming of on-chip nonvolatile memory
1.3.20 Debugger (DBG)
• Trace buffer with depth of 64 entries
• Three comparators (A, B and C)
— Access address comparisons with optional data comparisons
— Program counter comparisons
— Exact address or address range comparisons
• Two types of comparator matches
— Tagged This matches just before a specific instruction begins execution
— Force This is valid on the first instruction boundary after a match occurs
• Four trace modes
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
36 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
• Four stage state sequencer
1.4 Key Performance Parameters
The key performance parameters of S12G devices feature:
• Continuous Operating voltage of 3.15 V to 5.5 V
• Operating temperature (TA) of –40˚C to 125˚C
• Junction temperature (TJ) of up to 150˚C
• Bus frequency (fBus) of dc to 25 MHz
• Packaging:
— 100-pin LQFP, 0.5 mm pitch, 14 mm x 14 mm outline
— 64-pin LQFP, 0.5 mm pitch, 10 mm x 10 mm outline
— 48-pin LQFP, 0.5 mm pitch, 7 mm x 7 mm outline
— 48-pin QFN, 0.5 mm pitch, 7 mm x 7 mm outline
— 32-pin LQFP, 0.8 mm pitch, 7 mm x 7 mm outline
— 20 TSSOP, 0.65 mm pitch, 4.4 mm x 6.5 mm outline
1.5 Block Diagram
Figure 1-1 shows a block diagram of the MC9S12G-Family.
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 37
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 1-1. MC9S12G-Family Block Diagram
1.6 Family Memory Map
Table 1-3 shows the MC9S12G-Family register memory map.
Table 1-3. Device Register Memory Map
Address Module Size
(Bytes)
0x0000–0x0009 PIM (Port Integration Module)10
1K … 11K bytes RAM
RESET
EXTAL
XTAL
0.5K … 4K bytes EEPROM with ECC
BKGD
VDDR
Real Time Interrupt
Clock Monitor
Single-wire Background
TEST
Debug Module
ADC
Interrupt Module
(WU Int)
SCI0
PS3
PS0
PS1
PS2
PTS
AN[15:0] PAD[15:0]
10-bit 8...16 ch.
16-bit 6 … 8 channel
Timer
TIM
Asynchronous Serial IF
8-bit 6 … 8 channel
Pulse Width Modulator
PWM
PB[7:0]
PTB
PA[7:0]
PTA
16K … 240K bytes Flash with ECC
CPU12-V1
COP Watchdog
PLL with Frequency
Modulation option
Debug Module
3 comparators
64 Byte Trace Buffer
Reset Generation
and Test Entry
RXD
TXD
PJ2
PTJ (Wake-up Int)
CAN
PM3
PM0
PM1
PM2
PTM
msCAN 2.0B
RXCAN
TXCAN
Auton. Periodic Int.
PJ7
PJ6
PT3
PT0
PT1
PT2
PTT
PT7
PT4
PT5
PT6
PP3
PP0
PP1
PP2
PTP (Wake-up Int)
PP7
PP4
PP5
PWM3
PWM0
PWM1
PWM2
PWM4
PWM5
IOC3
IOC0
IOC1
IOC2
IOC7
IOC4
IOC5
IOC6
VDDA
VSSA
VRH
VDDX1/VSSX1
VDDX2/VSSX2
PJ0
PJ1
3-5V IO Supply
VSS
Low Power Pierce
Oscillator
PP6
PWM6
PWM7
SCI1
Asynchronous Serial IF
RXD
TXD
MOSI
SS
SCK
MISO
SPI0
Synchronous Serial IF
PS4
PS5
PS6
PS7
SCI2
Asynchronous Serial IF
RXD
TXD
Voltage Regulator
Input: 3.13V – 5.5V
Block Diagram shows the maximum configuration!
MOSI
SS
SCK
MISO
SPI1
Synchronous Serial IF
MOSI
SS
SCK
MISO
SPI2
Synchronous Serial IF
PJ3
PJ4
PJ5
PD[7:0]
PTD
PC[7:0]
PTC
VDDX3/VSSX3
Not all pins or all peripherals are available on all devices and packages.
Rerouting options are not shown.
PE0
PTE
PE1
PTAD
Analog-Digital
Converter
ACMP
Analog
Comparator
DAC0
Digital-Analog
Converter
AMPM
AMP
DACU
AMPP
DAC1
Digital-Analog
Converter
12-bit 16 ch. or
RVA
Internal RC Oscillator
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
38 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x000A–0x000B MMC (Memory Map Control) 2
0x000C–0x000D PIM (Port Integration Module) 2
0x000E–0x000F Reserved 2
0x0010–0x0017 MMC (Memory Map Control) 8
0x0018–0x0019 Reserved 2
0x001A–0x001B Device ID register 2
0x001C–0x001F PIM (Port Integration Module) 4
0x0020–0x002F DBG (Debug Module) 16
0x0030–0x0033 Reserved 4
0x0034–0x003F CPMU (Clock and Power Management) 12
0x0040–0x006F TIM (Timer Module <= 8 channels) 48
0x0070–0x009F ADC (Analog to Digital Converter <= 16 channels) 48
0x00A0–0x00C7 PWM (Pulse-Width Modulator <= 8 channels) 40
0x00C8–0x00CF SCI0 (Serial Communication Interface) 8
0x00D0–0x00D7 SCI1 (Serial Communication Interface)18
0x00D8–0x00DF SPI0 (Serial Peripheral Interface) 8
0x00E0–0x00E7 Reserved 8
0x00E8–0x00EF SCI2 (Serial Communication Interface)28
0x00F0–0x00F7 SPI1 (Serial Peripheral Interface)38
0x00F8–0x00FF SPI2 (Serial Peripheral Interface)48
0x0100–0x0113 FTMRG control registers 20
0x0114–0x011F Reserved 12
0x0120 INT (Interrupt Module) 1
0x0121–0x013F Reserved 31
0x0140–0x017F CAN564
0x0180–0x023F Reserved 192
0x0240–0x025F PIM (Port Integration Module) 32
0x0260–0x0261 ACMP (Analog Comparator)62
0x0262–0x0275 PIM (Port Integration Module) 20
0x0276 RVA (Reference Voltage Attenuator)71
0x0277–0x027F PIM (Port Integration Module) 9
0x0280–0x02EF Reserved 112
0x02F0–0x02FF CPMU (Clock and Power Management) 16
0x0300–0x03BF Reserved 192
0x03C0–0x03C7 DAC0 (Digital to Analog Converter)88
Address Module Size
(Bytes)
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 39
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
Reserved register space shown in Table 1-3 is not allocated to any module.
This register space is reserved for future use. Writing to these locations has
no effect. Read access to these locations returns zero.
Figure 1-2 shows S12G CPU and BDM local address translation to the global memory map as a graphical
representation. In conjunction Table 1-4 shows the address ranges and mapping to 256K global memory
space for P-Flash, EEPROM and RAM. The whole 256K global memory space is visible through the
P-Flash window located in the 64k local memory map located at 0x8000 - 0xBFFF using the PPAGE
register.
0x03C8–0x03CF DAC1 (Digital to Analog Converter)88
0x03D0–0x03FF Reserved 48
1The SCI1 is not available on the S12GN8, S12GN16, S12GN32, and S12GN32 devices
2The SCI2 is not available on the S12GN8, S12GN16, S12GN32, , S12GN32, S12G48,
and S12G64 devices
3The SPI1 is not available on the S12GN8, S12GN16, S12GN24, and S12GN32 devices
4The SPI2 is not available on the S12GN8, S12GN16, S12GN32, , S12GN32, S12G48,
and S12G64 devices
5The CAN is not available on the S12GN8, S12GN16, S12GN24, S12GN32, and
S12GN48 devices
6The ACMP is only available on the S12GN8, S12GN16, S12GN24, S12GN32,
S12GN48,S12GN48, S12G48, and S12G64 devices
7The RVA is only available on the S12GA192 and S12GA240 devices
8DAC0 and DAC1 are only available on the S12GA192 and S12GA240 devices
Table 1-4. MC9S12G-Family Memory Parameters
Feature S12GN16 S12GN32 S12G48
S12GN48 S12G64 S12G96 S12G128 S12G192
S12GA192
S12G240
S12GA240
P-Flash size 16KB 32KB 48KB 64KB 96KB 128KB 192KB 240KB
PF_LOW 0x3C000 0x38000 0x34000 0x30000 0x28000 0x20000 0x10000 0x04000
PF_LOW_UNP
(unpaged)10xC000 0x8000 0x4000 —————
PPAGES
0x0F
0x0E -
0x0F
0x0D -
0x0F
0x0C -
0x0F
0x0A -
0x0F
0x08 -
0x0F
0x04 -
0x0F
0x01 -
0x0F
EEPROM
[Bytes]
512 1024 1536 2048 3072 4096 4096 4096
EEPROM_HI 0x05FF 0x07FF 0x09FF 0x0BFF 0x0FFF 0x13FF 0x13FF 0x13FF
Address Module Size
(Bytes)
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
40 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
RAM [Bytes] 1024 2048 4096 4096 8192 8192 11264 11264
RAM_LOW 0x3C00 0x3800 0x3000 0x3000 0x2000 0x2000 0x1400 0x1400
Unpaged Flash
space left2— — — 0x0C00-
0x2FFF
0x1000-
0x1FFF
0x1400-
0x1FFF
——
Unpaged Flash2— — — 9KB 4KB 3KB — —
1While for memory sizes <64K the whole 256k space could be addressed using the PPAGE, it is more efficient to use
an unpaged memory model
2Page 0xC
Table 1-4. MC9S12G-Family Memory Parameters
Feature S12GN16 S12GN32 S12G48
S12GN48 S12G64 S12G96 S12G128 S12G192
S12GA192
S12G240
S12GA240
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 41
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 1-2. MC9S12G Global Memory Map
Paging Window
0x3_FFFF
Local CPU and BDM
Memory Map Global Memory Map
0xFFFF
0xC000
0x0_0400
0x0_0000
0x3_C000
0x0000
0x8000
0x0400
0x4000 0x0_4000
Paging Window
Flash
Space
Flash
Space
RAM
RAM
Unimplemented
Unimplemented
Flash Space
Flash Space
Flash Space
Flash Space
Flash Space
Flash Space
Register Space
Register Space
Internal
NVM
Resources
Internal
NVM
Resources
Flash Space
Flash Space
Flash Space
Flash Space
Flash Space
Flash Space
Flash Space
Flash Space
EEPROM
EEPROM EEPROM
EEPROM
Page 0x1
Page 0x1
Page 0xF
Page 0xF
Page 0xD
Page 0xD
Register Space
Register Space
Page 0xC
Page 0xC
Page 0xE
Page 0xE
Page 0xF
Page 0xF
Page 0xD
Page 0xD
Page 0xC
Page 0xC
NVMRES=0
NVMRES=0 NVMRES=1
NVMRES=1
Flash Space
Flash Space
Page 0x2
Page 0x2
0x3_0000
0x3_4000
0x3_8000
0x0_8000
RAM
RAM
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
42 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.6.1 Part ID Assignments
The part ID is located in two 8-bit registers PARTIDH and PARTIDL (addresses 0x001A and 0x001B).
The read-only value is a unique part ID for each revision of the chip. Table 1-5 shows the assigned part ID
number and Mask Set number.
1.7 Signal Description and Device Pinouts
This section describes signals that connect off-chip. It includes a pinout diagram, a table of signal
properties, and detailed discussion of signals. It is built from the signal description sections of the
individual IP blocks on the device.
1.7.1 Pin Assignment Overview
Table 1-6 provides a summary of which ports are available for each package option.
Table 1-5. Assigned Part ID Numbers
Device Mask Set Number Part ID
MC9S12GA240 0N95B 0xF080
MC9S12G240 0N95B 0xF080
MC9S12GA192 0N95B 0xF080
MC9S12G192 0N95B 0xF080
MC9S12G128 0N51A 0xF180
MC9S12G96 0N51A 0xF180
MC9S12G64 0N75C 0xF280
MC9S12G48 0N75C 0xF280
MC9S12GN48 0N75C 0xF280
MC9S12GN32 0N48A 0xF380
1N48A 0xF381
MC9S12GN16 0N48A 0xF380
1N48A 0xF381
Table 1-6. Port Availability by Package Option
Port 20 TSSOP 32 LQFP 48 LQFP
48 QFN 64 LQFP 100 LQFP
Port AD/ADC Channels 6 8 12 16 16
Port A pins 00008
Port B pins 00008
Port C pins 00008
Port D pins 00008
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 43
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
To avoid current drawn from floating inputs, the input buffers of all
non-bonded pins are disabled.
1.7.2 Detailed Signal Descriptions
This section describes the signal properties. The relation between signals and package pins is described in
section 1.8 Device Pinouts.
1.7.2.1 RESET — External Reset Signal
The RESET signal is an active low bidirectional control signal. It acts as an input to initialize the MCU to
a known start-up state, and an output when an internal MCU function causes a reset. The RESET pin has
an internal pull-up device.
1.7.2.2 TEST — Test Pin
This input only pin is reserved for factory test. This pin has an internal pull-down device.
NOTE
The TEST pin must be tied to ground in all applications.
1.7.2.3 BKGD / MODC — Background Debug and Mode Pin
The BKGD/MODC pin is used as a pseudo-open-drain pin for the background debug communication. It
is used as a MCU operating mode select pin during reset. The state of this pin is latched to the MODC bit
at the rising edge of RESET. The BKGD pin has an internal pull-up device.
Port E pins 22222
Port J 00488
Port M 02244
Port P 04688
Port S 46888
Port T 24688
Sum of Ports 14 26 40 54 86
I/O Power Pairs VDDX/VSSX 1/1 1/1 1/1 1/1 3/3
Table 1-6. Port Availability by Package Option
Port 20 TSSOP 32 LQFP 48 LQFP
48 QFN 64 LQFP 100 LQFP
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
44 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.7.2.4 EXTAL, XTAL — Oscillator Signal
EXTAL and XTAL are the crystal driver and external clock signals. On reset all the device clocks are
derived from the internal reference clock. XTAL is the oscillator output.
1.7.2.5 PAD[15:0] / KWAD[15:0] — Port AD Input Pins of ADC
PAD[15:0] are general-purpose input or output signals. These signals can have a pull-up or pull-down
device selected and enabled on per signal basis. Out of reset the pull devices are disabled.
1.7.2.6 PA[7:0] — Port A I/O Signals
PA[7:0] are general-purpose input or output signals. The signals can have pull-up devices, enabled by a
single control bit for this signal group. Out of reset the pull-up devices are disabled .
1.7.2.7 PB[7:0] — Port B I/O Signals
PB[7:0] are general-purpose input or output signals. The signals can have pull-up devices, enabled by a
single control bit for this signal group. Out of reset the pull-up devices are disabled .
1.7.2.8 PC[7:0] — Port C I/O Signals
PC[7:0] are general-purpose input or output signals. The signals can have pull-up devices, enabled by a
single control bit for this signal group. Out of reset the pull-up devices are disabled .
1.7.2.9 PD[7:0] — Port D I/O Signals
PD[7:0] are general-purpose input or output signals. The signals can have pull-up device, enabled by a
single control bit for this signal group. Out of reset the pull-up devices are disabled.
1.7.2.10 PE[1:0] — Port E I/O Signals
PE[1:0] are general-purpose input or output signals. The signals can have pull-down device, enabled by a
single control bit for this signal group. Out of reset the pull-down devices are enabled.
1.7.2.11 PJ[7:0] / KWJ[7:0] — Port J I/O Signals
PJ[7:0] are general-purpose input or output signals. The signals can be configured on per signal basis as
interrupt inputs with wakeup capability (KWJ[7:0]). They can have a pull-up or pull-down device selected
and enabled on per signal basis. Out of reset the pull devices are enabled .
1.7.2.12 PM[3:0] — Port M I/O Signals
PM[3:0] are general-purpose input or output signals. They can have a pull-up or pull-down device selected
and enabled on per signal basis. Out of reset the pull devices are disabled. The signals can be configured
on per pin basis to open-drain mode.
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 45
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.7.2.13 PP[7:0] / KWP[7:0] — Port P I/O Signals
PP[7:0] are general-purpose input or output signals. The signals can be configured on per signal basis as
interrupt inputs with wakeup capability (KWP[7:0]). They can have a pull-up or pull-down device selected
and enabled on per signal basis. Out of reset the pull devices are disabled .
1.7.2.14 PS[7:0] — Port S I/O Signals
PS[7:0] are general-purpose input or output signals. They can have a pull-up or pull-down device selected
and enabled on per signal basis. Out of reset the pull-up devices are enabled. The signals can be configured
on per pin basis in open-drain mode.
1.7.2.15 PT[7:0] — Port TI/O Signals
PT[7:0] are general-purpose input or output signals. They can have a pull-up or pull-down device selected
and enabled on per signal basis. Out of reset the pull devices are disabled .
1.7.2.16 AN[15:0] — ADC Input Signals
AN[15:0] are the analog inputs of the Analog-to-Digital Converter.
1.7.2.17 ACMP Signals
1.7.2.17.1 ACMPP — Non-Inverting Analog Comparator Input
ACMPP is the non-inverting input of the analog comparator.
1.7.2.17.2 ACMPM — Inverting Analog Comparator Input
ACMPM is the inverting input of the analog comparator.
1.7.2.17.3 ACMPO — Analog Comparator Output
ACMPO is the output of the analog comparator.
1.7.2.18 DAC Signals
1.7.2.18.1 DACU[1:0] Output Pins
These analog pins is used for the unbuffered analog output Voltages from the DAC0 and the DAC1 resistor
network output, when the according mode is selected.
1.7.2.18.2 AMP[1:0] Output Pins
These analog pins are used for the buffered analog outputs Voltage from the operational amplifier outputs,
when the according mode is selected.
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
46 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.7.2.18.3 AMPP[1:0] Input Pins
These analog input pins areused as input signals for the operational amplifiers positive input pins when the
according mode is selected.
1.7.2.18.4 AMPM[1:0] Input Pins
These analog input pins are used as input signals for the operational amplifiers negative input pin when the
according mode is selected.
1.7.2.19 SPI Signals
1.7.2.19.1 SS[2:0] Signals
Those signals are associated with the slave select SS functionality of the serial peripheral interfaces
SPI2-0.
1.7.2.19.2 SCK[2:0] Signals
Those signals are associated with the serial clock SCK functionality of the serial peripheral interfaces
SPI2-0.
1.7.2.19.3 MISO[2:0] Signals
Those signals are associated with the MISO functionality of the serial peripheral interfaces SPI2-0. They
act as master input during master mode or as slave output during slave mode.
1.7.2.19.4 MOSI[2:0] Signals
Those signals are associated with the MOSI functionality of the serial peripheral interfaces SPI2-0. They
act as master output during master mode or as slave input during slave mode.
1.7.2.20 SCI Signals
1.7.2.20.1 RXD[2:0] Signals
Those signals are associated with the receive functionality of the serial communication interfaces SCI2-0.
1.7.2.20.2 TXD[2:0] Signals
Those signals are associated with the transmit functionality of the serial communication interfaces SCI2-0.
1.7.2.21 CAN signals
1.7.2.21.1 RXCAN Signal
This signal is associated with the receive functionality of the scalable controller area network controller
(MSCAN).
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 47
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.7.2.21.2 TXCAN Signal
This signal is associated with the transmit functionality of the scalable controller area network controller
(MSCAN).
1.7.2.22 PWM[7:0] Signals
The signals PWM[7:0] are associated with the PWM module outputs.
1.7.2.23 Internal Clock outputs
1.7.2.23.1 ECLK
This signal is associated with the output of the divided bus clock (ECLK).
NOTE
This feature is only intended for debug purposes at room temperature.
It must not be used for clocking external devices in an application.
1.7.2.23.2 ECLKX2
This signal is associated with the output of twice the bus clock (ECLKX2).
NOTE
This feature is only intended for debug purposes at room temperature.
It must not be used for clocking external devices in an application.
1.7.2.23.3 API_EXTCLK
This signal is associated with the output of the API clock (API_EXTCLK).
1.7.2.24 IOC[7:0] Signals
The signals IOC[7:0] are associated with the input capture or output compare functionality of the timer
(TIM) module.
1.7.2.25 IRQ
This signal is associated with the maskable IRQ interrupt.
1.7.2.26 XIRQ
This signal is associated with the non-maskable XIRQ interrupt.
1.7.2.27 ETRIG[3:0]
These signals are inputs to the Analog-to-Digital Converter. Their purpose is to trigger ADC conversions.
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
48 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.7.3 Power Supply Pins
MC9S12G power and ground pins are described below. Because fast signal transitions place high,
short-duration current demands on the power supply, use bypass capacitors with high-frequency
characteristics and place them as close to the MCU as possible.
NOTE
All ground pins must be connected together in the application.
1.7.3.1 VDDX[3:1]/VDDX, VSSX[3:1]/VSSX— Power and Ground Pins for I/O Drivers
External power and ground for I/O drivers. Bypass requirements depend on how heavily the MCU pins are
loaded. All VDDX pins are connected together internally. All VSSX pins are connected together
internally.
NOTE
Not all VDDX[3:1]/VDDX and VSSX[3:1]VSSX pins are available on all
packages. Refer to section 1.8 Device Pinouts for further details.
1.7.3.2 VDDR — Power Pin for Internal Voltage Regulator
Power supply input to the internal voltage regulator.
NOTE
On some packages VDDR is bonded to VDDX and the pin is named
VDDXR. Refer to section 1.8 Device Pinouts for further details.
1.7.3.3 VSS — Core Ground Pin
The voltage supply of nominally 1.8V is derived from the internal voltage regulator. The return current
path is through the VSS pin.
1.7.3.4 VDDA, VSSA — Power Supply Pins for DAC,ACMP, RVA, ADC and
Voltage Regulator
These are the power supply and ground input pins for the digital-to-analog converter, the analog
comparator, the reference voltage attenuator, the analog-to-digital converter and the voltage regulator.
NOTE
On some packages VDDA is connected with VDDXR and the common pin
is named VDDXRA.
Also the VSSA is connected to VSSX and the common pin is named
VSSXA. See section Section 1.8, “Device Pinouts” for further details.
1.7.3.5 VRH — Reference Voltage Input Pin
VRH is the reference voltage input pin for the digital-to-analog converter and the analog-to-digital
converter. Refer to Section 1.18, “ADC VRH/VRL Signal Connection” for further details.
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 49
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
On some packages VRH is tied to VDDA or VDDXRA. Refer to section 1.8
Device Pinouts for further details.
1.7.3.6 Power and Ground Connection Summary
Table 1-7. Power and Ground Connection Summary
Mnemonic Nominal Voltage Description
VDDR 3.15V – 5.0 V External power supply for internal voltage regulator.
VSS 0V Return ground for the logic supply generated by the internal regulator
VDDX[3:1] 3.15V – 5.0 V External power supply for I/O drivers. The 100-pin package features 3 I/O supply pins.
VSSX[3:1] 0V Return ground for I/O drivers. The100-pin package provides 3 ground pins
VDDX 3.15V – 5.0 V External power supply for I/O drivers, All packages except 100-pin feature 1 I/O supply.
VSSX 0V Return ground for I/O drivers. All packages except 100-pin provide 1 I/O ground pin.
VDDA 3.15V – 5.0 V External power supply for the analog-to-digital converter and for the reference circuit of the
internal voltage regulator.
VSSA 0V Return ground for VDDA analog supply
VDDXR 3.15V – 5.0 V External power supply for I/O drivers and internal voltage regulator. For the 48-pin package
the VDDX and VDDR supplies are combined on one pin.
VDDXRA 3.15V – 5.0 V External power supply for I/O drivers, internal voltage regulator and analog-to-digital
converter. For the 20- and 32-pin package the VDDX, VDDR and VDDA supplies are
combined on one pin.
VSSXA 0V Return ground for I/O driver and VDDA analog supply
VRH 3.15V – 5.0 V Reference voltage for the analog-to-digital converter.
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
50 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8 Device Pinouts
1.8.1 S12GN16 and S12GN32
1.8.1.1 Pinout 20-Pin TSSOP
Figure 1-3. 20-Pin TSSOP Pinout for S12GN16 and S12GN32
Table 1-8. 20-Pin TSSOP Pinout for S12GN16 and S12GN32
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package
Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func
6th
Func
7th
Func
8th
Func CTRL Reset
State
1 PS6 IOC3 SCK0 — — — — — VDDX PERS/PPSS Up
2 PS7 ETRIG3 API_EXTCLK ECLK PWM3 TXD0 SS0 — VDDX PERS/PPSS Up
3 RESET — — — — — — — VDDX PULLUP
4 VDDXRA VRH — — — — — — — — —
5 VSSXA — — — — — — — — — —
6 PE01ETRIG0 PWM0 IOC2 RXD0 EXTAL — — VDDX PUCR/PDPEE Down
7 VSS — — — — — — — — — —
8 PE11ETRIG1 PWM1 IOC3 TXD0 XTAL — — PUCR/PDPEE Down
9 TEST — — — — — — — N.A. RESET pin Down
10 BKGD MODC — — — — — — VDDX Always on Up
11 PT1 IOC1 IRQ — — — — — VDDX PERT/PPST Disabled
12 PT0 IOC0 XIRQ — — — — — VDDX PERT/PPST Disabled
13 PAD0 KWAD0 AN0 — — — — — VDDA PER1AD/PPS1AD Disabled
14 PAD1 KWAD1 AN1 — — — — — VDDA PER1AD/PPS1AD Disabled
15 PAD2 KWAD2 AN2 — — — — — VDDA PER1AD/PPS1AD Disabled
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
S12GN16
S12GN32
20-Pin TSSOP
PS5/IOC2/MOSI0
PS4/ETRIG2/PWM2/RXD0/MISO0
PAD5/KWAD5/ETRIG3/PWM3/IOC3/TXD0/AN5/ACMPM
PAD4/KWAD4/ETRIG2/PWM2/IOC2/RXD0/AN4/ACMPP
PAD3/KWAD3/AN3/ACMPO
PAD2/KWAD2/AN2
PAD1/KWAD1/AN1
PAD0/KWAD0/AN0
PT0/IOC0/XIRQ
PT1/IOC1/IRQ
SCK0/IOC3/PS6
SS0/TXD0/PWM3/ECLK/API_EXTCLK/ETRIG3/PS7
RESET
VRH/VDDXRA
VSSXA
EXTAL/RXD0/PWM0/IOC2/ETRIG0/PE0
VSS
XTAL/TXD0/PWM1/IOC3/ETRIG1/PE1
TEST
BKGD
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 51
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16 PAD3 KWAD3 AN3 ACMPO — — — — VDDA PER1AD/PPS1AD Disabled
17 PAD4 KWAD4 ETRIG2 PWM2 IOC2 RXD0 AN4 ACMPP VDDA PER1AD/PPS1AD Disabled
18 PAD5 KWAD5 ETRIG3 PWM3 IOC3 TXD0 AN5 ACMPM VDDA PER1AD/PPS1AD Disabled
19 PS4 ETRIG2 PWM2 RXD0 MISO0 — — — VDDX PERS/PPSS Up
20 PS5 IOC2 MOSI0 — — — — — VDDX PERS/PPSS Up
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-8. 20-Pin TSSOP Pinout for S12GN16 and S12GN32
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package
Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func
6th
Func
7th
Func
8th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
52 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.1.2 Pinout 32-Pin LQFP
Figure 1-4. 32-Pin LQFP OPinout for S12GN16 and S12GN32
Table 1-9. 32-Pin LQFP OPinout for S12GN16 and S12GN32
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
1 RESET — — — — VDDX PULLUP
2 VDDXRA VRH — — — — — —
3 VSSXA — — — — — — —
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
24
23
22
21
20
19
18
17
32
31
30
29
28
27
26
25
S12GN16
s12GN32
32-Pin LQFP
PAD7/KWAD7/AN7/ACMPM
PAD6/KWAD6/AN6/ACMPP
PAD5/KWAD5/AN5/ACMPO
PAD4/KWAD4/AN4
PAD3/KWAD3/AN3
PAD2/KWAD2/AN2
PAD1/KWAD1/AN1
PAD0/KWAD0/AN0
PWM0/API_EXTCLK/ETRIG0/KWP0/PP0
PWM1/ECLKX2/ETRIG1/KWP1/PP1
PWM2/ETRIG2/KWP2/PP2
PWM3/ETRIG3/KWP3/PP3
IOC3/PT3
IOC2/PT2
IRQ/IOC1/PT1
XIRQ/IOC0/PT0
RESET
VRH/VDDXRA
VSSXA
EXTAL/PE0
VSS
XTAL/PE1
TEST
BKGD
PM1/TXD1/TXCAN
PM0/RXD1/RXCAN
PS7/API_EXTCLK/ECLK/PWM5/SS
0
PS6/IOC5/SCK0
PS5/IOC4/MOSI0
PS4/PWM4/MISO0
PS1/TXD0
PS0/RXD0
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 53
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
4 PE01EXTAL — — — — PUCR/PDPEE Down
5 VSS — — — — — — —
6 PE11XTAL — — — — PUCR/PDPEE Down
7 TEST — — — — N.A. RESET pin Down
8 BKGD MODC — — — VDDX PUCR/BKPUE Up
9 PP0 KWP0 ETRIG0 API_EXTCLK PWM0 VDDX PERP/PPSP Disabled
10 PP1 KWP1 ETRIG1 ECLKX2 PWM1 VDDX PERP/PPSP Disabled
11 PP2 KWP2 ETRIG2 PWM2 — VDDX PERP/PPSP Disabled
12 PP3 KWP3 ETRIG3 PWM3 — VDDX PERP/PPSP Disabled
13 PT3 IOC3 — — — VDDX PERT/PPST Disabled
14 PT2 IOC2 — — — VDDX PERT/PPST Disabled
15 PT1 IOC1 IRQ — — VDDX PERT/PPST Disabled
16 PT0 IOC0 XIRQ — — VDDX PERT/PPST Disabled
17 PAD0 KWAD0 AN0 — — VDDA PER1AD/PPS1AD Disabled
18 PAD1 KWAD1 AN1 — — VDDA PER1AD/PPS1AD Disabled
19 PAD2 KWAD2 AN2 — — VDDA PER1AD/PPS1AD Disabled
20 PAD3 KWAD3 AN3 — — VDDA PER1AD/PPS1AD Disabled
21 PAD4 KWAD4 AN4 — — VDDA PER1AD/PPS1AD Disabled
22 PAD5 KWAD5 AN5 ACMPO — VDDA PER1AD/PPS1AD Disabled
23 PAD6 KWAD6 AN6 ACMPP — VDDA PER1AD/PPS1AD Disabled
24 PAD7 KWAD7 AN7 ACMPM — VDDA PER1AD/PPS1AD Disabled
25 PS0 RXD0 — — — VDDX PERS/PPSS Up
26 PS1 TXD0 — — — VDDX PERS/PPSS Up
27 PS4 PWM4 MISO0 — — VDDX PERS/PPSS Up
28 PS5 IOC4 MOSI0 — — VDDX PERS/PPSS Up
29 PS6 IOC5 SCK0 — — VDDX PERS/PPSS Up
30 PS7 API_EXTCLK ECLK PWM5 SS0 VDDX PERS/PPSS Up
31 PM0 — — — — VDDX PERM/PPSM Disabled
32 PM1 — — — — VDDX PERM/PPSM Disabled
Table 1-9. 32-Pin LQFP OPinout for S12GN16 and S12GN32
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
54 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.1.3 Pinout 48-Pin LQFP/QFN
Figure 1-5. 48-Pin LQFP/QFN Pinout for S12GN16 and S12GN32
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
36
35
34
33
32
31
30
29
28
27
26
25
48
47
46
45
44
43
42
41
40
39
38
37
S12GN16
S12GN32
48-Pin LQFP/QFN
PAD7/KWAD7/AN7
PAD6/KWAD6/AN6
PAD5/KWAD5/AN5
PAD4/KWAD4/AN4
PAD11/KWAD11/ACMPM
PAD3/KWAD3/AN3
PAD10/KWAD10/ACMPP
PAD2/KWAD2/AN2
PAD9/KWAD9/ACMPO
PAD1/KWAD1/AN1
PAD8/KWAD8
PAD0/KWAD0/AN0
PWM0/API_EXTCLK/ETRIG0/KWP0/PP0
PWM1/ECLKX2/ETRIG1/KWP1/PP1
ETRIG2/KWP2/PP2
ETRIG3/KWP3/PP3
PWM4/KWP4/PP4
PWM5/KWP5/PP5
IOC5/PT5
IOC4/PT4
IOC3/PT3
IOC2/PT2
IRQ/IOC1/PT1
XIRQ/IOC0/PT0
RESET
VDDXR
VSSX
EXTAL/PE0
VSS
XTAL/PE1
TEST
KWJ0/PJ0
KWJ1/PJ1
KWJ2/PJ2
KWJ3/PJ3
BKGD
PM1
PM0
PS7/API_EXTCLK/ECLK/SS0
PS6/SCK0
PS5/MOSI0
PS4/MISO0
PS3
PS2
PS1/TXD0
PS0/RXD0
VSSA
VDDA/VRH
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 55
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 1-10. 48-Pin LQFP/QFN Pinout for S12GN16 and S12GN32
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
1 RESET — — — — VDDX PULLUP
2 VDDXR — — — — — — —
3 VSSX — — — — — — —
4 PE01EXTAL — — — VDDX PUCR/PDPEE Down
5 VSS — — — — — — —
6 PE11XTAL — — — VDDX PUCR/PDPEE Down
7 TEST — — — — N.A. RESET pin Down
8 PJ0 KWJ0 — — — VDDX PERJ/PPSJ Up
9 PJ1 KWJ1 — — — VDDX PERJ/PPSJ Up
10 PJ2 KWJ2 — — — VDDX PERJ/PPSJ Up
11 PJ3 KWJ3 — — — VDDX PERJ/PPSJ Up
12 BKGD MODC — — — VDDX PUCR/BKPUE Up
13 PP0 KWP0 ETRIG0 API_EXTCLK PWM0 VDDX PERP/PPSP Disabled
14 PP1 KWP1 ETRIG1 ECLKX2 PWM1 VDDX PERP/PPSP Disabled
15 PP2 KWP2 ETRIG2 PWM2 — VDDX PERP/PPSP Disabled
16 PP3 KWP3 ETRIG3 PWM3 — VDDX PERP/PPSP Disabled
17 PP4 KWP4 PWM4 — — VDDX PERP/PPSP Disabled
18 PP5 KWP5 PWM5 — — VDDX PERP/PPSP Disabled
19 PT5 IOC5 — — — VDDX PERT/PPST Disabled
20 PT4 IOC4 — — — VDDX PERT/PPST Disabled
21 PT3 IOC3 — — — VDDX PERT/PPST Disabled
22 PT2 IOC2 — — — VDDX PERT/PPST Disabled
23 PT1 IOC1 IRQ — — VDDX PERT/PPST Disabled
24 PT0 IOC0 XIRQ — — VDDX PERT/PPST Disabled
25 PAD0 KWAD0 AN0 — — VDDA PER1AD/PPS1AD Disabled
26 PAD8 KWAD8 — — — VDDA PER0AD/PPS0AD Disabled
27 PAD1 KWAD1 AN1 — — VDDA PER1AD/PPS1AD Disabled
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
56 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.2 S12GN48
1.8.2.1 Pinout 32-Pin LQFP
28 PAD9 KWAD9 ACMPO — — VDDA PER0AD/PPS0AD Disabled
29 PAD2 KWAD2 AN2 — — VDDA PER1AD/PPS1AD Disabled
30 PAD10 KWAD10 ACMPP VDDA PER0AD/PPS0AD Disabled
31 PAD3 KWAD3 AN3 — — VDDA PER1AD/PPS1AD Disabled
32 PAD11 KWAD11 ACMPM VDDA PER0AD/PPS0AD Disabled
33 PAD4 KWAD4 AN4 — — VDDA PER1AD/PPS1AD Disabled
34 PAD5 KWAD5 AN5 — — VDDA PER1AD/PPS0AD Disabled
35 PAD6 KWAD6 AN6 — — VDDA PER1AD/PPS1AD Disabled
36 PAD7 KWAD7 AN7 — — VDDA PER1AD/PPS1AD Disabled
37 VDDA VRH — — — — — —
38 VSSA — — — — — — —
39 PS0 RXD0 — — — VDDX PERS/PPSS Up
40 PS1 TXD0 — — — VDDX PERS/PPSS Up
41 PS2 — — — — VDDX PERS/PPSS Up
42 PS3 — — — — VDDX PERS/PPSS Up
43 PS4 MISO0 — — — VDDX PERS/PPSS Up
44 PS5 MOSI0 — — — VDDX PERS/PPSS Up
45 PS6 SCK0 — — — VDDX PERS/PPSS Up
46 PS7 API_EXTCLK ECLK SS0 — VDDX PERS/PPSS Up
47 PM0 — — — — VDDX PERM/PPSM Disabled
48 PM1 — — — — VDDX PERM/PPSM Disabled
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-10. 48-Pin LQFP/QFN Pinout for S12GN16 and S12GN32
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 57
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 1-6. 32-Pin LQFP Pinout for S12GN48
Table 1-11. 32-Pin LQFP Pinout for S12GN48
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
1 RESET — — — — VDDX PULLUP
2 VDDXRA VRH — — — — — —
3 VSSXA — — — — — — —
4 PE01EXTAL — — — — PUCR/PDPEE Down
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
24
23
22
21
20
19
18
17
32
31
30
29
28
27
26
25
S12GN48
32-Pin LQFP
PAD7/KWAD7/AN7/ACMPM
PAD6/KWAD6/AN6/ACMPP
PAD5/KWAD5/AN5/ACMPO
PAD4/KWAD4/AN4
PAD3/KWAD3/AN3
PAD2/KWAD2/AN2
PAD1/KWAD1/AN1
PAD0/KWAD0/AN0
PWM0/API_EXTCLK/ETRIG0/KWP0/PP0
PWM1/ECLKX2/ETRIG1/KWP1/PP1
PWM2/ETRIG2/KWP2/PP2
PWM3/ETRIG3/KWP3/PP3
IOC3/PT3
IOC2/PT2
IRQ/IOC1/PT1
XIRQ/IOC0/PT0
RESET
VRH/VDDXRA
VSSXA
EXTAL/PE0
VSS
XTAL/PE1
TEST
BKGD
PM1/TXD1
PM0/RXD1
PS7/API_EXTCLK/ECLK/PWM5/SS0
PS6/IOC5/SCK0
PS5/IOC4/MOSI0
PS4/PWM4/MISO0
PS1/TXD0
PS0/RXD0
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
58 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
5 VSS — — — — — — —
6 PE11XTAL — — — — PUCR/PDPEE Down
7 TEST — — — — N.A. RESET pin Down
8 BKGD MODC — — — VDDX PUCR/BKPUE Up
9 PP0 KWP0 ETRIG0 API_EXTCLK PWM0 VDDX PERP/PPSP Disabled
10 PP1 KWP1 ETRIG1 ECLKX2 PWM1 VDDX PERP/PPSP Disabled
11 PP2 KWP2 ETRIG2 PWM2 — VDDX PERP/PPSP Disabled
12 PP3 KWP3 ETRIG3 PWM3 — VDDX PERP/PPSP Disabled
13 PT3 IOC3 — — — VDDX PERT/PPST Disabled
14 PT2 IOC2 — — — VDDX PERT/PPST Disabled
15 PT1 IOC1 IRQ — — VDDX PERT/PPST Disabled
16 PT0 IOC0 XIRQ — — VDDX PERT/PPST Disabled
17 PAD0 KWAD0 AN0 — — VDDA PER1AD/PPS1AD Disabled
18 PAD1 KWAD1 AN1 — — VDDA PER1AD/PPS1AD Disabled
19 PAD2 KWAD2 AN2 — — VDDA PER1AD/PPS1AD Disabled
20 PAD3 KWAD3 AN3 — — VDDA PER1AD/PPS1AD Disabled
21 PAD4 KWAD4 AN4 — — VDDA PER1AD/PPS1AD Disabled
22 PAD5 KWAD5 AN5 ACMPO — VDDA PER1AD/PPS1AD Disabled
23 PAD6 KWAD6 AN6 ACMPP — VDDA PER1AD/PPS1AD Disabled
24 PAD7 KWAD7 AN7 ACMPM — VDDA PER1AD/PPS1AD Disabled
25 PS0 RXD0 — — — VDDX PERS/PPSS Up
26 PS1 TXD0 — — — VDDX PERS/PPSS Up
27 PS4 PWM4 MISO0 — — VDDX PERS/PPSS Up
28 PS5 IOC4 MOSI0 — — VDDX PERS/PPSS Up
29 PS6 IOC5 SCK0 — — VDDX PERS/PPSS Up
30 PS7 API_EXTCLK ECLK PWM5 SS0 VDDX PERS/PPSS Up
31 PM0 RXD1 — — — VDDX PERM/PPSM Disabled
32 PM1 TXD1 — — — VDDX PERM/PPSM Disabled
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-11. 32-Pin LQFP Pinout for S12GN48
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 59
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.2.2 Pinout 48-Pin LQFP
Figure 1-7. 48-Pin LQFP Pinout for S12GN48
Table 1-12. 48-Pin LQFP Pinout for S12GN48
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
1 RESET — — — — VDDX PULLUP
2 VDDXR — — — — — — —
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
36
35
34
33
32
31
30
29
28
27
26
25
48
47
46
45
44
43
42
41
40
39
38
37
S12GN48
48-Pin LQFP
PAD7/KWAD7/AN7
PAD6/KWAD6/AN6
PAD5/KWAD5/AN5
PAD4/KWAD4/AN4
PAD11/KWAD11/AN11/ACMPM
PAD3/KWAD3/AN3
PAD10/KWAD10/AN10/ACMPP
PAD2/KWAD2/AN2
PAD9/KWAD9/AN9/ACMPO
PAD1/KWAD1/AN1
PAD8/KWAD8/AN8
PAD0/KWAD0/AN0
PWM0/API_EXTCLK/ETRIG0/KWP0/PP0
PWM1/ECLKX2/ETRIG1/KWP1/PP1
PWM2/ETRIG2/KWP2/PP2
PWM3/ETRIG3/KWP3/PP3
PWM4/KWP4/PP4
PWM5/KWP5/PP5
IOC5/PT5
IOC4/PT4
IOC3/PT3
IOC2/PT2
IRQ/IOC1/PT1
XIRQ/IOC0/PT0
RESET
VDDXR
VSSX
EXTAL/PE0
VSS
XTAL/PE1
TEST
MISO1/KWJ0/PJ0
MOSI1/KWJ1/PJ1
SCK1/KWJ2/PJ2
SS1/KWJ3/PJ3
BKGD
PM1
PM0
PS7/API_EXTCLK/ECLK/SS0
PS6/SCK0
PS5/MOSI0
PS4/MISO0
PS3/TXD1
PS2/RXD1
PS1/TXD0
PS0/RXD0
VSSA
VDDA/VRH
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
60 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
3 VSSX — — — — — — —
4 PE01EXTAL — — — VDDX PUCR/PDPEE Down
5 VSS — — — — — — —
6 PE11XTAL — — — VDDX PUCR/PDPEE Down
7 TEST — — — — N.A. RESET pin Down
8 PJ0 KWJ0 MISO1 — — VDDX PERJ/PPSJ Up
9 PJ1 KWJ1 MOSI1 — — VDDX PERJ/PPSJ Up
10 PJ2 KWJ2 SCK1 — — VDDX PERJ/PPSJ Up
11 PJ3 KWJ3 SS1 — — VDDX PERJ/PPSJ Up
12 BKGD MODC — — — VDDX PUCR/BKPUE Up
13 PP0 KWP0 ETRIG0 API_EXTCLK PWM0 VDDX PERP/PPSP Disabled
14 PP1 KWP1 ETRIG1 ECLKX2 PWM1 VDDX PERP/PPSP Disabled
15 PP2 KWP2 ETRIG2 PWM2 — VDDX PERP/PPSP Disabled
16 PP3 KWP3 ETRIG3 PWM3 — VDDX PERP/PPSP Disabled
17 PP4 KWP4 PWM4 — — VDDX PERP/PPSP Disabled
18 PP5 KWP5 PWM5 — — VDDX PERP/PPSP Disabled
19 PT5 IOC5 — — — VDDX PERT/PPST Disabled
20 PT4 IOC4 — — — VDDX PERT/PPST Disabled
21 PT3 IOC3 — — — VDDX PERT/PPST Disabled
22 PT2 IOC2 — — — VDDX PERT/PPST Disabled
23 PT1 IOC1 IRQ — — VDDX PERT/PPST Disabled
24 PT0 IOC0 XIRQ — — VDDX PERT/PPST Disabled
25 PAD0 KWAD0 AN0 — — VDDA PER1AD/PPS1AD Disabled
26 PAD8 KWAD8 AN8 — — VDDA PER0AD/PPS0AD Disabled
27 PAD1 KWAD1 AN1 — — VDDA PER1AD/PPS1AD Disabled
28 PAD9 KWAD9 AN9 ACMPO — VDDA PER0AD/PPS0AD Disabled
29 PAD2 KWAD2 AN2 — — VDDA PER1AD/PPS1AD Disabled
30 PAD10 KWAD10 AN10 ACMPP VDDA PER0AD/PPS0AD Disabled
31 PAD3 KWAD3 AN3 — — VDDA PER1AD/PPS1AD Disabled
Table 1-12. 48-Pin LQFP Pinout for S12GN48
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 61
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
32 PAD11 KWAD11 AN11 ACMPM VDDA PER0AD/PPS0AD Disabled
33 PAD4 KWAD4 AN4 — — VDDA PER1AD/PPS1AD Disabled
34 PAD5 KWAD5 AN5 — — VDDA PER1AD/PPS0AD Disabled
35 PAD6 KWAD6 AN6 — — VDDA PER1AD/PPS1AD Disabled
36 PAD7 KWAD7 AN7 — — VDDA PER1AD/PPS1AD Disabled
37 VDDA VRH — — — — — —
38 VSSA — — — — — — —
39 PS0 RXD0 — — — VDDX PERS/PPSS Up
40 PS1 TXD0 — — — VDDX PERS/PPSS Up
41 PS2 RXD1 — — — VDDX PERS/PPSS Up
42 PS3 TXD1 — — — VDDX PERS/PPSS Up
43 PS4 MISO0 — — — VDDX PERS/PPSS Up
44 PS5 MOSI0 — — — VDDX PERS/PPSS Up
45 PS6 SCK0 — — — VDDX PERS/PPSS Up
46 PS7 API_EXTCLK ECLK SS0 — VDDX PERS/PPSS Up
47 PM0 — — — — VDDX PERM/PPSM Disabled
48 PM1 — — — — VDDX PERM/PPSM Disabled
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-12. 48-Pin LQFP Pinout for S12GN48
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
62 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.2.3 Pinout 64-Pin LQFP
Figure 1-8. 64-Pin LQFP Pinout for S12GN48
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
S12GN48
64-Pin LQFP
PWM0/API_EXTCLK/ETRIG0/KWP0/PP0
PWM1/ECLKX2/ETRIG1/KWP1/PP1
PWM2/ETRIG2/KWP2/PP2
PWM3/ETRIG3/KWP3/PP3
PWM4/KWP4/PP4
PWM5/KWP5/PP5
KWP6/PP6
KWP7/PP7
PT7
PT6
IOC5/PT5
IOC4/PT4
IOC3/PT3
IOC2/PT2
IRQ/IOC1/PT1
XIRQ/IOC0/PT0
KWJ6/PJ6
KWJ5/PJ5
KWJ4/PJ4
RESET
VDDX
VDDR
VSSX
EXTAL/PE0
VSS
XTAL/PE1
TEST
MISO1/KWJ0/PJ0
MOSI1/KWJ1/PJ1
SCK1/KWJ2/PJ2
SS1/KWJ3/PJ3
BKGD
PJ7/KWJ7
PM3
PM2
PM1
PM0
PS7/API_EXTCLK/ECLK/SS0
PS6/SCK0
PS5/MOSI0
PS4/MISO0
PS3/TXD1
PS2/RXD1
PS1/TXD0
PS0/RXD0
VSSA
VDDA
VRH
PAD15/KWAD15
PAD7/KWAD7/AN7
PAD14/KWAD14
PAD6/KWAD6/AN6
PAD13/KWAD13
PAD5/KWAD5/AN5
PAD12/KWAD12
PAD4/KWAD4/AN4
PAD11/KWAD11/AN11/ACMPM
PAD3/KWAD3/AN3
PAD10/KWAD10/AN10/ACMPP
PAD2/KWAD2/AN2
PAD9/KWAD9/AN9/ACMPO
PAD1/KWAD1/AN1
PAD8/KWAD8/AN8
PAD0/KWAD0/AN0
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 63
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 1-13. 64-Pin LQFP Pinout for S12GN48
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
1 PJ6 KWJ6 — — — VDDX PERJ/PPSJ Up
2 PJ5 KWJ5 — — — VDDX PERJ/PPSJ Up
3 PJ4 KWJ4 — — — VDDX PERJ/PPSJ Up
4 RESET — — — — VDDX PULLUP
5 VDDX — — — — — — —
6 VDDR — — — — — — —
7 VSSX — — — — — — —
8 PE01EXTAL — — — VDDX PUCR/PDPEE Down
9 VSS — — — — — — —
10 PE11XTAL — — — VDDX PUCR/PDPEE Down
11 TEST — — — — N.A. RESET pin Down
12 PJ0 KWJ0 MISO1 — — VDDX PERJ/PPSJ Up
13 PJ1 KWJ1 MOSI1 — — VDDX PERJ/PPSJ Up
14 PJ2 KWJ2 SCK1 — — VDDX PERJ/PPSJ Up
15 PJ3 KWJ3 SS1 — — VDDX PERJ/PPSJ Up
16 BKGD MODC — — — VDDX PUCR/BKPUE Up
17 PP0 KWP0 ETRIG0 API_EXTCLK PWM0 VDDX PERP/PPSP Disabled
18 PP1 KWP1 ETRIG1 ECLKX2 PWM1 VDDX PERP/PPSP Disabled
19 PP2 KWP2 ETRIG2 PWM2 — VDDX PERP/PPSP Disabled
20 PP3 KWP3 ETRIG3 PWM3 — VDDX PERP/PPSP Disabled
21 PP4 KWP4 PWM4 — — VDDX PERP/PPSP Disabled
22 PP5 KWP5 PWM5 — — VDDX PERP/PPSP Disabled
23 PP6 KWP6 — — VDDX PERP/PPSP Disabled
24 PP7 KWP7 — — VDDX PERP/PPSP Disabled
25 PT7 — — — — VDDX PERT/PPST Disabled
26 PT6 — — — — VDDX PERT/PPST Disabled
27 PT5 IOC5 — — — VDDX PERT/PPST Disabled
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
64 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28 PT4 IOC4 — — — VDDX PERT/PPST Disabled
29 PT3 IOC3 — — — VDDX PERT/PPST Disabled
30 PT2 IOC2 — — — VDDX PERT/PPST Disabled
31 PT1 IOC1 IRQ — — VDDX PERT/PPST Disabled
32 PT0 IOC0 XIRQ — — VDDX PERT/PPST Disabled
33 PAD0 KWAD0 AN0 — — VDDA PER1AD/PPS1AD Disabled
34 PAD8 KWAD8 AN8 — — VDDA PER0AD/PPS0AD Disabled
35 PAD1 KWAD1 AN1 — — VDDA PER1AD/PPS1AD Disabled
36 PAD9 KWAD9 AN9 ACMPO — VDDA PER0ADPPS0AD Disabled
37 PAD2 KWAD2 AN2 — — VDDA PER1AD/PPS1AD Disabled
38 PAD10 KWAD10 AN10 ACMPP — VDDA PER0AD/PPS0AD Disabled
39 PAD3 KWAD3 AN3 — — VDDA PER1AD/PPS1AD Disabled
40 PAD11 KWAD11 AN11 ACMPM — VDDA PER0AD/PPS0AD Disabled
41 PAD4 KWAD4 AN4 — — VDDA PER1AD/PPS1AD Disabled
42 PAD12 KWAD12 — — — VDDA PER0AD/PPS0AD Disabled
43 PAD5 KWAD5 AN5 — — VDDA PER1AD/PPS1AD Disabled
44 PAD13 KWAD13 — — — VDDA PER0AD/PPS0AD Disabled
45 PAD6 KWAD6 AN6 — — VDDA PER1AD/PPS1AD Disabled
46 PAD14 KWAD14 — — VDDA PER0AD/PPS0AD Disabled
47 PAD7 KWAD7 AN7 — — VDDA PER1AD/PPS1AD Disabled
48 PAD15 KWAD15 — — VDDA PER0AD/PPS0AD Disabled
49 VRH — — — — — — —
50 VDDA — — — — — — —
51 VSSA — — — — — — —
52 PS0 RXD0 — — — VDDX PERS/PPSS Up
53 PS1 TXD0 — — — VDDX PERS/PPSS Up
54 PS2 RXD1 — — — VDDX PERS/PPSS Up
55 PS3 TXD1 — — — VDDX PERS/PPSS Up
56 PS4 MISO0 — — — VDDX PERS/PPSS Up
Table 1-13. 64-Pin LQFP Pinout for S12GN48
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 65
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.3 S12G48 and S12G64
1.8.3.1 Pinout 32-Pin LQFP
57 PS5 MOSI0 — — — VDDX PERS/PPSS Up
58 PS6 SCK0 — — — VDDX PERS/PPSS Up
59 PS7 API_EXTCLK ECLK SS0 — VDDX PERS/PPSS Up
60 PM0 — — — — VDDX PERM/PPSM Disabled
61 PM1 — — — — VDDX PERM/PPSM Disabled
62 PM2 — — — — VDDX PERM/PPSM Disabled
63 PM3 — — — — VDDX PERM/PPSM Disabled
64 PJ7 KWJ7 — — — VDDX PERJ/PPSJ Up
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-13. 64-Pin LQFP Pinout for S12GN48
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
66 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 1-9. 32-Pin LQFP Pinout for S12G48 and S12G64
Table 1-14. 32-Pin LQFP Pinout for S12G48 and S12G64
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
1 RESET — — — — VDDX PULLUP
2 VDDXRA VRH — — — — — —
3 VSSXA — — — — — — —
4 PE01EXTAL — — — — PUCR/PDPEE Down
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
24
23
22
21
20
19
18
17
32
31
30
29
28
27
26
25
S12G48
S12G64
32-Pin LQFP
PAD7/KWAD7/AN7/ACMPM
PAD6/KWAD6/AN6/ACMPP
PAD5/KWAD5/AN5/ACMPO
PAD4/KWAD4/AN4
PAD3/KWAD3/AN3
PAD2/KWAD2/AN2
PAD1/KWAD1/AN1
PAD0/KWAD0/AN0
PWM0/API_EXTCLK/ETRIG0/KWP0/PP0
PWM1/ECLKX2/ETRIG1/KWP1/PP1
PWM2/ETRIG2/KWP2/PP2
PWM3/ETRIG3/KWP3/PP3
IOC3/PT3
IOC2/PT2
IRQ/IOC1/PT1
XIRQ/IOC0/PT0
RESET
VRH/VDDXRA
VSSXA
EXTAL/PE0
VSS
XTAL/PE1
TEST
BKGD
PM1/TXD1/TXCAN
PM0/RXD1/RXCAN
PS7/API_EXTCLK/ECLK/PWM5/SS0
PS6/IOC5/SCK0
PS5/IOC4/MOSI0
PS4/PWM4/MISO0
PS1/TXD0
PS0/RXD0
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 67
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
5 VSS — — — — — — —
6 PE11XTAL — — — — PUCR/PDPEE Down
7 TEST — — — — N.A. RESET pin Down
8 BKGD MODC — — — VDDX PUCR/BKPUE Up
9 PP0 KWP0 ETRIG0 API_EXTCLK PWM0 VDDX PERP/PPSP Disabled
10 PP1 KWP1 ETRIG1 ECLKX2 PWM1 VDDX PERP/PPSP Disabled
11 PP2 KWP2 ETRIG2 PWM2 — VDDX PERP/PPSP Disabled
12 PP3 KWP3 ETRIG3 PWM3 — VDDX PERP/PPSP Disabled
13 PT3 IOC3 — — — VDDX PERT/PPST Disabled
14 PT2 IOC2 — — — VDDX PERT/PPST Disabled
15 PT1 IOC1 IRQ — — VDDX PERT/PPST Disabled
16 PT0 IOC0 XIRQ — — VDDX PERT/PPST Disabled
17 PAD0 KWAD0 AN0 — — VDDA PER1AD/PPS1AD Disabled
18 PAD1 KWAD1 AN1 — — VDDA PER1AD/PPS1AD Disabled
19 PAD2 KWAD2 AN2 — — VDDA PER1AD/PPS1AD Disabled
20 PAD3 KWAD3 AN3 — — VDDA PER1AD/PPS1AD Disabled
21 PAD4 KWAD4 AN4 — — VDDA PER1AD/PPS1AD Disabled
22 PAD5 KWAD5 AN5 ACMPO — VDDA PER1AD/PPS1AD Disabled
23 PAD6 KWAD6 AN6 ACMPP — VDDA PER1AD/PPS1AD Disabled
24 PAD7 KWAD7 AN7 ACMPM — VDDA PER1AD/PPS1AD Disabled
25 PS0 RXD0 — — — VDDX PERS/PPSS Up
26 PS1 TXD0 — — — VDDX PERS/PPSS Up
27 PS4 PWM4 MISO0 — — VDDX PERS/PPSS Up
28 PS5 IOC4 MOSI0 — — VDDX PERS/PPSS Up
29 PS6 IOC5 SCK0 — — VDDX PERS/PPSS Up
30 PS7 API_EXTCLK ECLK PWM5 SS0 VDDX PERS/PPSS Up
31 PM0 RXD1 RXCAN — — VDDX PERM/PPSM Disabled
32 PM1 TXD1 TXCAN — — VDDX PERM/PPSM Disabled
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-14. 32-Pin LQFP Pinout for S12G48 and S12G64
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
68 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.3.2 Pinout 48-Pin LQFP
Figure 1-10. 48-Pin LQFP Pinout for S12G48 and S12G64
Table 1-15. 48-Pin LQFP Pinout for S12G48 and S12G64
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
1 RESET — — — — VDDX PULLUP
2 VDDXR — — — — — — —
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
36
35
34
33
32
31
30
29
28
27
26
25
48
47
46
45
44
43
42
41
40
39
38
37
S12G48
S12G64
48-Pin LQFP
PAD7/KWAD7/AN7
PAD6/KWAD6/AN6
PAD5/KWAD5/AN5
PAD4/KWAD4/AN4
PAD11/KWAD11/AN11/ACMPM
PAD3/KWAD3/AN3
PAD10/KWAD10/AN10/ACMPP
PAD2/KWAD2/AN2
PAD9/KWAD9/AN9/ACMPO
PAD1/KWAD1/AN1
PAD8/KWAD8/AN8
PAD0/KWAD0/AN0
PWM0/API_EXTCLK/ETRIG0/KWP0/PP0
PWM1/ECLKX2/ETRIG1/KWP1/PP1
PWM2/ETRIG2/KWP2/PP2
PWM3/ETRIG3/KWP3/PP3
PWM4/KWP4/PP4
PWM5/KWP5/PP5
IOC5/PT5
IOC4/PT4
IOC3/PT3
IOC2/PT2
IRQ/IOC1/PT1
XIRQ/IOC0/PT0
RESET
VDDXR
VSSX
EXTAL/PE0
VSS
XTAL/PE1
TEST
MISO1/KWJ0/PJ0
MOSI1/KWJ1/PJ1
SCK1/KWJ2/PJ2
SS1/KWJ3/PJ3
BKGD
PM1/TXCAN
PM0/RXCAN
PS7/API_EXTCLK/ECLK/SS0
PS6/SCK0
PS5/MOSI0
PS4/MISO0
PS3/TXD1
PS2/RXD1
PS1/TXD0
PS0/RXD0
VSSA
VDDA/VRH
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 69
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
3 VSSX — — — — — — —
4 PE01EXTAL — — — VDDX PUCR/PDPEE Down
5 VSS — — — — — — —
6 PE11XTAL — — — VDDX PUCR/PDPEE Down
7 TEST — — — — N.A. RESET pin Down
8 PJ0 KWJ0 — MISO1 — VDDX PERJ/PPSJ Up
9 PJ1 KWJ1 — MOSI1 — VDDX PERJ/PPSJ Up
10 PJ2 KWJ2 — SCK1 — VDDX PERJ/PPSJ Up
11 PJ3 KWJ3 — SS1 — VDDX PERJ/PPSJ Up
12 BKGD MODC — — — VDDX PUCR/BKPUE Up
13 PP0 KWP0 ETRIG0 API_EXTCLK PWM0 VDDX PERP/PPSP Disabled
14 PP1 KWP1 ETRIG1 ECLKX2 PWM1 VDDX PERP/PPSP Disabled
15 PP2 KWP2 ETRIG2 PWM2 — VDDX PERP/PPSP Disabled
16 PP3 KWP3 ETRIG3 PWM3 — VDDX PERP/PPSP Disabled
17 PP4 KWP4 PWM4 — — VDDX PERP/PPSP Disabled
18 PP5 KWP5 PWM5 — — VDDX PERP/PPSP Disabled
19 PT5 IOC5 — — — VDDX PERT/PPST Disabled
20 PT4 IOC4 — — — VDDX PERT/PPST Disabled
21 PT3 IOC3 — — — VDDX PERT/PPST Disabled
22 PT2 IOC2 — — — VDDX PERT/PPST Disabled
23 PT1 IOC1 IRQ — — VDDX PERT/PPST Disabled
24 PT0 IOC0 XIRQ — — VDDX PERT/PPST Disabled
25 PAD0 KWAD0 AN0 — — VDDA PER1AD/PPS1AD Disabled
26 PAD8 KWAD8 AN8 — — VDDA PER0AD/PPS0AD Disabled
27 PAD1 KWAD1 AN1 — — VDDA PER1AD/PPS1AD Disabled
28 PAD9 KWAD9 AN9 ACMPO — VDDA PER0AD/PPS0AD Disabled
29 PAD2 KWAD2 AN2 — — VDDA PER1AD/PPS1AD Disabled
30 PAD10 KWAD10 AN10 ACMPP VDDA PER0AD/PPS0AD Disabled
31 PAD3 KWAD3 AN3 — — VDDA PER1AD/PPS1AD Disabled
Table 1-15. 48-Pin LQFP Pinout for S12G48 and S12G64
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
70 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
32 PAD11 KWAD11 AN11 ACMPM VDDA PER0AD/PPS0AD Disabled
33 PAD4 KWAD4 AN4 — — VDDA PER1AD/PPS1AD Disabled
34 PAD5 KWAD5 AN5 — — VDDA PER1AD/PPS0AD Disabled
35 PAD6 KWAD6 AN6 — — VDDA PER1AD/PPS1AD Disabled
36 PAD7 KWAD7 AN7 — — VDDA PER1AD/PPS1AD Disabled
37 VDDA VRH — — — — — —
38 VSSA — — — — — — —
39 PS0 RXD0 — — — VDDX PERS/PPSS Up
40 PS1 TXD0 — — — VDDX PERS/PPSS Up
41 PS2 RXD1 — — — VDDX PERS/PPSS Up
42 PS3 TXD1 — — — VDDX PERS/PPSS Up
43 PS4 MISO0 — — — VDDX PERS/PPSS Up
44 PS5 MOSI0 — — — VDDX PERS/PPSS Up
45 PS6 SCK0 — — — VDDX PERS/PPSS Up
46 PS7 API_EXTCLK ECLK SS0 — VDDX PERS/PPSS Up
47 PM0 RXCAN — — — VDDX PERM/PPSM Disabled
48 PM1 TXCAN — — — VDDX PERM/PPSM Disabled
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-15. 48-Pin LQFP Pinout for S12G48 and S12G64
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 71
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.3.3 Pinout 64-Pin LQFP
Figure 1-11. 64-Pin LQFP Pinout for S12G48 and S12G64
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
S12G48
S12G64
64-pin LQFP
PWM0/API_EXTCLK/ETRIG0/KWP0/PP0
PWM1/ECLKX2/ETRIG1/KWP1/PP1
PWM2/ETRIG2/KWP2/PP2
PWM3/ETRIG3/KWP3/PP3
PWM4/KWP4/PP4
PWM5/KWP5/PP5
KWP6/PP6
KWP7/PP7
PT7
PT6
IOC5/PT5
IOC4/PT4
IOC3/PT3
IOC2/PT2
IRQ/IOC1/PT1
XIRQ/IOC0/PT0
KWJ6/PJ6
KWJ5/PJ5
KWJ4/PJ4
RESET
VDDX
VDDR
VSSX
EXTAL/PE0
VSS
XTAL/PE1
TEST
MISO1/KWJ0/PJ0
MOSI1/KWJ1/PJ1
SCK1/KWJ2/PJ2
SS1/KWJ3/PJ3
BKGD
PJ7/KWJ7
PM3
PM2
PM1/TXCAN
PM0/RXCAN
PS7/API_EXTCLK/ECLK/SS0
PS6/SCK0
PS5/MOSI0
PS4/MISO0
PS3/TXD1
PS2/RXD1
PS1/TXD0
PS0/RXD0
VSSA
VDDA
VRH
PAD15/KWAD15
PAD7/KWAD7/AN7
PAD14/KWAD14
PAD6/KWAD6/AN6
PAD13/KWAD13
PAD5/KWAD5/AN5
PAD12/KWAD12
PAD4/KWAD4/AN4
PAD11/KWAD11/AN11/ACMPM
PAD3/KWAD3/AN3
PAD10/KWAD10/AN10/ACMPP
PAD2/KWAD2/AN2
PAD9/KWAD9/AN9/ACMPO
PAD1/KWAD1/AN1
PAD8/KWAD8/AN8
PAD0/KWAD0/AN0
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
72 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 1-16. 64-Pin LQFP Pinout for S12G48 and S12G64
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
1 PJ6 KWJ6 — — — VDDX PERJ/PPSJ Up
2 PJ5 KWJ5 — — — VDDX PERJ/PPSJ Up
3 PJ4 KWJ4 — — — VDDX PERJ/PPSJ Up
4 RESET — — — — VDDX PULLUP
5 VDDX — — — — — — —
6 VDDR — — — — — — —
7 VSSX — — — — — — —
8 PE01EXTAL — — — VDDX PUCR/PDPEE Down
9 VSS — — — — — — —
10 PE11XTAL — — — VDDX PUCR/PDPEE Down
11 TEST — — — — N.A. RESET pin Down
12 PJ0 KWJ0 MISO1 — — VDDX PERJ/PPSJ Up
13 PJ1 KWJ1 MOSI1 — — VDDX PERJ/PPSJ Up
14 PJ2 KWJ2 SCK1 — — VDDX PERJ/PPSJ Up
15 PJ3 KWJ3 SS1 — — VDDX PERJ/PPSJ Up
16 BKGD MODC — — — VDDX PUCR/BKPUE Up
17 PP0 KWP0 ETRIG0 API_EXTCLK PWM0 VDDX PERP/PPSP Disabled
18 PP1 KWP1 ETRIG1 ECLKX2 PWM1 VDDX PERP/PPSP Disabled
19 PP2 KWP2 ETRIG2 PWM2 — VDDX PERP/PPSP Disabled
20 PP3 KWP3 ETRIG3 PWM3 — VDDX PERP/PPSP Disabled
21 PP4 KWP4 PWM4 — — VDDX PERP/PPSP Disabled
22 PP5 KWP5 PWM5 — — VDDX PERP/PPSP Disabled
23 PP6 KWP6 — — — VDDX PERP/PPSP Disabled
24 PP7 KWP7 — — — VDDX PERP/PPSP Disabled
25 PT7 — — — — VDDX PERT/PPST Disabled
26 PT6 — — — — VDDX PERT/PPST Disabled
27 PT5 IOC5 — — — VDDX PERT/PPST Disabled
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 73
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28 PT4 IOC4 — — — VDDX PERT/PPST Disabled
29 PT3 IOC3 — — — VDDX PERT/PPST Disabled
30 PT2 IOC2 — — — VDDX PERT/PPST Disabled
31 PT1 IOC1 IRQ — — VDDX PERT/PPST Disabled
32 PT0 IOC0 XIRQ — — VDDX PERT/PPST Disabled
33 PAD0 KWAD0 AN0 — — VDDA PER1AD/PPS1AD Disabled
34 PAD8 KWAD8 AN8 — — VDDA PER0AD/PPS0AD Disabled
35 PAD1 KWAD1 AN1 — — VDDA PER1AD/PPS1AD Disabled
36 PAD9 KWAD9 AN9 ACMPO — VDDA PER0ADPPS0AD Disabled
37 PAD2 KWAD2 AN2 — — VDDA PER1AD/PPS1AD Disabled
38 PAD10 KWAD10 AN10 ACMPP VDDA PER0AD/PPS0AD Disabled
39 PAD3 KWAD3 AN3 — — VDDA PER1AD/PPS1AD Disabled
40 PAD11 KWAD11 AN11 ACMPM VDDA PER0AD/PPS0AD Disabled
41 PAD4 KWAD4 AN4 — — VDDA PER1AD/PPS1AD Disabled
42 PAD12 KWAD12 — — — VDDA PER0AD/PPS0AD Disabled
43 PAD5 KWAD5 AN5 — — VDDA PER1AD/PPS1AD Disabled
44 PAD13 KWAD13 — — — VDDA PER0AD/PPS0AD Disabled
45 PAD6 KWAD6 AN6 — — VDDA PER1AD/PPS1AD Disabled
46 PAD14 KWAD14 — — — VDDA PER0AD/PPS0AD Disabled
47 PAD7 KWAD7 AN7 — — VDDA PER1AD/PPS1AD Disabled
48 PAD15 KWAD15 — — — VDDA PER0AD/PPS0AD Disabled
49 VRH — — — — — — —
50 VDDA — — — — — — —
51 VSSA — — — — — — —
52 PS0 RXD0 — — — VDDX PERS/PPSS Up
53 PS1 TXD0 — — — VDDX PERS/PPSS Up
54 PS2 RXD1 — — — VDDX PERS/PPSS Up
55 PS3 TXD1 — — — VDDX PERS/PPSS Up
56 PS4 MISO0 — — — VDDX PERS/PPSS Up
Table 1-16. 64-Pin LQFP Pinout for S12G48 and S12G64
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
74 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
57 PS5 MOSI0 — — — VDDX PERS/PPSS Up
58 PS6 SCK0 — — — VDDX PERS/PPSS Up
59 PS7 API_EXTCLK ECLK SS0 — VDDX PERS/PPSS Up
60 PM0 RXCAN — — — VDDX PERM/PPSM Disabled
61 PM1 TXCAN — — — VDDX PERM/PPSM Disabled
62 PM2 — — — — VDDX PERM/PPSM Disabled
63 PM3 — — — — VDDX PERM/PPSM Disabled
64 PJ7 KWJ7 — — — VDDX PERJ/PPSJ Up
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-16. 64-Pin LQFP Pinout for S12G48 and S12G64
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 75
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.4 S12G96 and S12G128
1.8.4.1 Pinout 48-Pin LQFP
Figure 1-12. 48-Pin LQFP Pinout for S12G96 and S12G128
Table 1-17. 48-Pin LQFP Pinout for S12G96 and S12G128
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
1 RESET — — — — VDDX PULLUP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
36
35
34
33
32
31
30
29
28
27
26
25
48
47
46
45
44
43
42
41
40
39
38
37
S12G96
S12G128
48-Pin LQFP
PAD7/KWAD7/AN7
PAD6/KWAD6/AN6
PAD5/KWAD5/AN5
PAD4/KWAD4/AN4
PAD11/KWAD11/AN11
PAD3/KWAD3/AN3
PAD10/KWAD10/AN10
PAD2/KWAD2/AN2
PAD9/KWAD9/AN9
PAD1/KWAD1/AN1
PAD8/KWAD8/AN8
PAD0/KWAD0/AN0
PWM0/API_EXTCLK/ETRIG0/KWP0/PP0
PWM1/ECLKX2/ETRIG1/KWP1/PP1
PWM2/ETRIG2/KWP2/PP2
PWM3/ETRIG3/KWP3/PP3
PWM4/KWP4/PP4
PWM5/KWP5/PP5
IOC5/PT5
IOC4/PT4
IOC3/PT3
IOC2/PT2
IRQ/IOC1/PT1
XIRQ/IOC0/PT0
RESET
VDDXR
VSSX
EXTAL/PE0
VSS
XTAL/PE1
TEST
MISO1/PWM6/KWJ0/PJ0
MOSI1/IOC6/KWJ1/PJ1
SCK1/IOC7/KWJ2/PJ2
SS1/PWM7/KWJ3/PJ3
BKGD
PM1/TXD2/TXCAN
PM0/RXD2/RXCAN
PS7/API_EXTCLK/ECLK/SS0
PS6/SCK0
PS5/MOSI0
PS4/MISO0
PS3/TXD1
PS2/RXD1
PS1/TXD0
PS0/RXD0
VSSA
VDDA/VRH
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
76 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2 VDDXR — — — — — — —
3 VSSX — — — — — — —
4 PE01EXTAL — — — VDDX PUCR/PDPEE Down
5 VSS — — — — — — —
6 PE11XTAL — — — VDDX PUCR/PDPEE Down
7 TEST — — — — N.A. RESET pin Down
8 PJ0 KWJ0 PWM6 MISO1 — VDDX PERJ/PPSJ Up
9 PJ1 KWJ1 IOC6 MOSI1 — VDDX PERJ/PPSJ Up
10 PJ2 KWJ2 IOC7 SCK1 — VDDX PERJ/PPSJ Up
11 PJ3 KWJ3 PWM7 SS1 — VDDX PERJ/PPSJ Up
12 BKGD MODC — — — VDDX PUCR/BKPUE Up
13 PP0 KWP0 ETRIG0 API_EXTCLK PWM0 VDDX PERP/PPSP Disabled
14 PP1 KWP1 ETRIG1 ECLKX2 PWM1 VDDX PERP/PPSP Disabled
15 PP2 KWP2 ETRIG2 PWM2 — VDDX PERP/PPSP Disabled
16 PP3 KWP3 ETRIG3 PWM3 — VDDX PERP/PPSP Disabled
17 PP4 KWP4 PWM4 — — VDDX PERP/PPSP Disabled
18 PP5 KWP5 PWM5 — — VDDX PERP/PPSP Disabled
19 PT5 IOC5 — — — VDDX PERT/PPST Disabled
20 PT4 IOC4 — — — VDDX PERT/PPST Disabled
21 PT3 IOC3 — — — VDDX PERT/PPST Disabled
22 PT2 IOC2 — — — VDDX PERT/PPST Disabled
23 PT1 IOC1 IRQ — — VDDX PERT/PPST Disabled
24 PT0 IOC0 XIRQ — — VDDX PERT/PPST Disabled
25 PAD0 KWAD0 AN0 — — VDDA PER1AD/PPS1AD Disabled
26 PAD8 KWAD8 AN8 — — VDDA PER0AD/PPS0AD Disabled
27 PAD1 KWAD1 AN1 — — VDDA PER1AD/PPS1AD Disabled
28 PAD9 KWAD9 AN9 — VDDA PER0AD/PPS0AD Disabled
29 PAD2 KWAD2 AN2 — — VDDA PER1AD/PPS1AD Disabled
30 PAD10 KWAD10 AN10 VDDA PER0AD/PPS0AD Disabled
Table 1-17. 48-Pin LQFP Pinout for S12G96 and S12G128
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 77
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
31 PAD3 KWAD3 AN3 — — VDDA PER1AD/PPS1AD Disabled
32 PAD11 KWAD11 AN11 — — VDDA PER0AD/PPS0AD Disabled
33 PAD4 KWAD4 AN4 — — VDDA PER1AD/PPS1AD Disabled
34 PAD5 KWAD5 AN5 — — VDDA PER1AD/PPS0AD Disabled
35 PAD6 KWAD6 AN6 — — VDDA PER1AD/PPS1AD Disabled
36 PAD7 KWAD7 AN7 — — VDDA PER1AD/PPS1AD Disabled
37 VDDA VRH — — — — — —
38 VSSA — — — — — — —
39 PS0 RXD0 — — — VDDX PERS/PPSS Up
40 PS1 TXD0 — — — VDDX PERS/PPSS Up
41 PS2 RXD1 — — — VDDX PERS/PPSS Up
42 PS3 TXD1 — — — VDDX PERS/PPSS Up
43 PS4 MISO0 — — — VDDX PERS/PPSS Up
44 PS5 MOSI0 — — — VDDX PERS/PPSS Up
45 PS6 SCK0 — — — VDDX PERS/PPSS Up
46 PS7 API_EXTCLK ECLK SS0 — VDDX PERS/PPSS Up
47 PM0 RXD2 RXCAN — — VDDX PERM/PPSM Disabled
48 PM1 TXD2 TXCAN — — VDDX PERM/PPSM Disabled
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-17. 48-Pin LQFP Pinout for S12G96 and S12G128
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
78 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.4.2 Pinout 64-Pin LQFP
Figure 1-13. 64-Pin LQFP Pinout for S12G96 and S12G128
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
S12G96
S12G128
64-Pin LQFP
PWM0/API_EXTCLK/ETRIG0/KWP0/PP0
PWM1/ECLKX2/ETRIG1/KWP1/PP1
PWM2/ETRIG2/KWP2/PP2
PWM3/ETRIG3/KWP3/PP3
PWM4/KWP4/PP4
PWM5/KWP5/PP5
PWM6/KWP6/PP6
PWM7/KWP7/PP7
IOC7/PT7
IOC6/PT6
IOC5/PT5
IOC4/PT4
IOC3/PT3
IOC2/PT2
IRQ/IOC1/PT1
XIRQ/IOC0/PT0
SCK2/KWJ6/PJ6
MOSI2/KWJ5/PJ5
MISO2/KWJ4/PJ4
RESET
VDDX
VDDR
VSSX
EXTAL/PE0
VSS
XTAL/PE1
TEST
MISO1/KWJ0/PJ0
MOSI1/KWJ1/PJ1
SCK1/KWJ2/PJ2
SS1/KWJ3/PJ3
BKGD
PJ7/KWJ7/SS2
PM3/TXD2
PM2/RXD2
PM1/TXCAN
PM0/RXCAN
PS7/API_EXTCLK/ECLK/SS0
PS6/SCK0
PS5/MOSI0
PS4/MISO0
PS3/TXD1
PS2/RXD1
PS1/TXD0
PS0/RXD0
VSSA
VDDA
VRH
PAD15/KWAD15
PAD7/KWAD7/AN7
PAD14/KWAD14
PAD6/KWAD6/AN6
PAD13/KWAD13
PAD5/KWAD5/AN5
PAD12/KWAD12
PAD4/KWAD4/AN4
PAD11/KWAD11/AN11
PAD3/KWAD3/AN3
PAD10/KWAD10/AN10
PAD2/KWAD2/AN2
PAD9/KWAD9/AN9
PAD1/KWAD1/AN1
PAD8/KWAD8/AN8
PAD0/KWAD0/AN0
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 79
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 1-18. 64-Pin LQFP Pinout for S12G96 and S12G128
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
1 PJ6 KWJ6 SCK2 — — VDDX PERJ/PPSJ Up
2 PJ5 KWJ5 MOSI2 — — VDDX PERJ/PPSJ Up
3 PJ4 KWJ4 MISO2 — — VDDX PERJ/PPSJ Up
4 RESET — — — — VDDX PULLUP
5 VDDX — — — — — — —
6 VDDR — — — — — — —
7 VSSX — — — — — — —
8 PE01EXTAL — — — VDDX PUCR/PDPEE Down
9 VSS — — — — — — —
10 PE11XTAL — — — VDDX PUCR/PDPEE Down
11 TEST — — — — N.A. RESET pin Down
12 PJ0 KWJ0 MISO1 — — VDDX PERJ/PPSJ Up
13 PJ1 KWJ1 MOSI1 — — VDDX PERJ/PPSJ Up
14 PJ2 KWJ2 SCK1 — — VDDX PERJ/PPSJ Up
15 PJ3 KWJ3 SS1 — — VDDX PERJ/PPSJ Up
16 BKGD MODC — — — VDDX PUCR/BKPUE Up
17 PP0 KWP0 ETRIG0 API_EXTCLK PWM0 VDDX PERP/PPSP Disabled
18 PP1 KWP1 ETRIG1 ECLKX2 PWM1 VDDX PERP/PPSP Disabled
19 PP2 KWP2 ETRIG2 PWM2 — VDDX PERP/PPSP Disabled
20 PP3 KWP3 ETRIG3 PWM3 — VDDX PERP/PPSP Disabled
21 PP4 KWP4 PWM4 — — VDDX PERP/PPSP Disabled
22 PP5 KWP5 PWM5 — — VDDX PERP/PPSP Disabled
23 PP6 KWP6 PWM6 — — VDDX PERP/PPSP Disabled
24 PP7 KWP7 PWM7 — — VDDX PERP/PPSP Disabled
25 PT7 IOC7 — — — VDDX PERT/PPST Disabled
26 PT6 IOC6 — — — VDDX PERT/PPST Disabled
27 PT5 IOC5 — — — VDDX PERT/PPST Disabled
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
80 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28 PT4 IOC4 — — — VDDX PERT/PPST Disabled
29 PT3 IOC3 — — — VDDX PERT/PPST Disabled
30 PT2 IOC2 — — — VDDX PERT/PPST Disabled
31 PT1 IOC1 IRQ — — VDDX PERT/PPST Disabled
32 PT0 IOC0 XIRQ — — VDDX PERT/PPST Disabled
33 PAD0 KWAD0 AN0 — — VDDA PER1AD/PPS1AD Disabled
34 PAD8 KWAD8 AN8 — — VDDA PER0AD/PPS0AD Disabled
35 PAD1 KWAD1 AN1 — — VDDA PER1AD/PPS1AD Disabled
36 PAD9 KWAD9 AN9 — — VDDA PER0ADPPS0AD Disabled
37 PAD2 KWAD2 AN2 — — VDDA PER1AD/PPS1AD Disabled
38 PAD10 KWAD10 AN10 — — VDDA PER0AD/PPS0AD Disabled
39 PAD3 KWAD3 AN3 — — VDDA PER1AD/PPS1AD Disabled
40 PAD11 KWAD11 AN11 — — VDDA PER0AD/PPS0AD Disabled
41 PAD4 KWAD4 AN4 — — VDDA PER1AD/PPS1AD Disabled
42 PAD12 KWAD12 — — VDDA PER0AD/PPS0AD Disabled
43 PAD5 KWAD5 AN5 — — VDDA PER1AD/PPS1AD Disabled
44 PAD13 KWAD13 — — VDDA PER0AD/PPS0AD Disabled
45 PAD6 KWAD6 AN6 — — VDDA PER1AD/PPS1AD Disabled
46 PAD14 KWAD14 — — VDDA PER0AD/PPS0AD Disabled
47 PAD7 KWAD7 AN7 — — VDDA PER1AD/PPS1AD Disabled
48 PAD15 KWAD15 — — VDDA PER0AD/PPS0AD Disabled
49 VRH — — — — — — —
50 VDDA — — — — — — —
51 VSSA — — — — — — —
52 PS0 RXD0 — — — VDDX PERS/PPSS Up
53 PS1 TXD0 — — — VDDX PERS/PPSS Up
54 PS2 RXD1 — — — VDDX PERS/PPSS Up
55 PS3 TXD1 — — — VDDX PERS/PPSS Up
56 PS4 MISO0 — — — VDDX PERS/PPSS Up
Table 1-18. 64-Pin LQFP Pinout for S12G96 and S12G128
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 81
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
57 PS5 MOSI0 — — — VDDX PERS/PPSS Up
58 PS6 SCK0 — — — VDDX PERS/PPSS Up
59 PS7 API_EXTCLK ECLK SS0 — VDDX PERS/PPSS Up
60 PM0 RXCAN — — — VDDX PERM/PPSM Disabled
61 PM1 TXCAN — — — VDDX PERM/PPSM Disabled
62 PM2 RXD2 — — — VDDX PERM/PPSM Disabled
63 PM3 TXD2 — — — VDDX PERM/PPSM Disabled
64 PJ7 KWJ7 SS2 — — VDDX PERJ/PPSJ Up
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-18. 64-Pin LQFP Pinout for S12G96 and S12G128
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
82 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.4.3 Pinout 100-Pin LQFP
Figure 1-14. 100-Pin LQFP Pinout for S12G96 and S12G128
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
VRH
PC7
PC6
PC5
PC4
PAD15/KWAD15/
PAD7/KWAD7/AN7
PAD14/KWAD14
PAD6/KWAD6/AN6
PAD13/KWAD13
PAD5/KWAD5/AN5
PAD12/KWAD12
PAD4/KWAD4/AN4
PAD11/KWAD11/AN11
PAD3/KWAD3/AN3
PAD10/KWAD10/AN10
PAD2/KWAD2/AN2
PAD9/KWAD9/AN9
PAD1/KWAD1/AN1
PAD8/KWAD8/AN8
PAD0/KWAD0/AN0
PC3
PC2
PC1
PC0
API_EXTCLK/PB1
ECLKX2/PB2
PB3
PWM0/ETRIG0/KWP0/PP0
PWM1/ETRIG1/KWP1/PP1
PWM2/ETRIG2/KWP2/PP2
PWM3/ETRIG3/KWP3/PP3
PWM4/KWP4/PP4
PWM5/KWP5/PP5
PWM6/KWP6/PP6
PWM7/KWP7/PP7
VDDX3
VSSX3
IOC7/PT7
IOC6/PT6
IOC5/PT5
IOC4/PT4
IOC3/PT3
IOC2/PT2
IOC1/PT1
IOC0/PT0
IRQ/PB4
XIRQ/PB5
PB6
PB7
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
SCK2/KWJ6/PJ6
MOSI2/KWJ5/PJ5
MISO2/KWJ4/PJ4
PA 0
PA 1
PA 2
PA 3
RESET
VDDX1
VDDR
VSSX1
EXTAL/PE0
VSS
XTAL/PE1
TEST
PA 4
PA 5
PA 6
PA 7
MISO1/KWJ0/PJ0
MOSI1/KWJ1/PJ1
SCK1/KWJ2/PJ2
SS1/KWJ3/PJ3
BKGD
ECLK/PB0
PJ7/KWJ7/SS2
PM3/TXD2
PM2/RXD2
PD7
PD6
PD5
PD4
PM1/TXCAN
PM0/RXCAN
VDDX2
VSSX2
PS7/API_EXTCLK/SS0
PS6/SCK0
PS5/MOSI0
PS4/MISO0
PS3/TXD1
PS2/RXD1
PS1/TXD0
PS0/RXD0
PD3
PD2
PD1
PD0
VSSA
VDDA
S12G96
S12G128
100-Pin LQFP
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 83
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 1-19. 100-Pin LQFP Pinout for S12G96 and S12G128
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func. CTRL Reset
State
1 PJ6 KWJ6 SCK2 — VDDX PERJ/PPSJ Up
2 PJ5 KWJ5 MOSI2 — VDDX PERJ/PPSJ Up
3 PJ4 KWJ4 MISO2 — VDDX PERJ/PPSJ Up
4 PA0———V
DDX PUCR/PUPAE Disabled
5 PA1———V
DDX PUCR/PUPAE Disabled
6 PA2———V
DDX PUCR/PUPAE Disabled
7 PA3———V
DDX PUCR/PUPAE Disabled
8 RESET — — — VDDX PULLUP
9 VDDX1 — — — — — —
10 VDDR — — — — — —
11 VSSX1 — — — — — —
12 PE01EXTAL — — VDDX PUCR/PDPEE Down
13 VSS — — — — — —
14 PE11XTAL — — VDDX PUCR/PDPEE Down
15 TEST — — — N.A. RESET pin Down
16PA4———V
DDX PUCR/PUPAE Disabled
17PA5———V
DDX PUCR/PUPAE Disabled
18PA6———V
DDX PUCR/PUPAE Disabled
19PA7———V
DDX PUCR/PUPAE Disabled
20 PJ0 KWJ0 MISO1 — VDDX PERJ/PPSJ Up
21 PJ1 KWJ1 MOSI1 — VDDX PERJ/PPSJ Up
22 PJ2 KWJ2 SCK1 — VDDX PERJ/PPSJ Up
23 PJ3 KWJ3 SS1 — VDDX PERJ/PPSJ Up
24 BKGD MODC — — VDDX PUCR/BKPUE Up
25 PB0 ECLK — — VDDX PUCR/PUPBE Disabled
26 PB1 API_EXTCLK ——V
DDX PUCR/PUPBE Disabled
27 PB2 ECLKX2 — — VDDX PUCR/PUPBE Disabled
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
84 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28 PB3 — — — VDDX PUCR/PUPBE Disabled
29 PP0 KWP0 ETRIG0 PWM0 VDDX PERP/PPSP Disabled
30 PP1 KWP1 ETRIG1 PWM1 VDDX PERP/PPSP Disabled
31 PP2 KWP2 ETRIG2 PWM2 VDDX PERP/PPSP Disabled
32 PP3 KWP3 ETRIG3 PWM3 VDDX PERP/PPSP Disabled
33 PP4 KWP4 PWM4 — VDDX PERP/PPSP Disabled
34 PP5 KWP5 PWM5 — VDDX PERP/PPSP Disabled
35 PP6 KWP6 PWM6 — VDDX PERP/PPSP Disabled
36 PP7 KWP7 PWM7 — VDDX PERP/PPSP Disabled
37 VDDX3 — — — — — —
38 VSSX3 — — — — — —
39 PT7 IOC7 — — VDDX PERT/PPST Disabled
40 PT6 IOC6 — — VDDX PERT/PPST Disabled
41 PT5 IOC5 — — VDDX PERT/PPST Disabled
42 PT4 IOC4 — — VDDX PERT/PPST Disabled
43 PT3 IOC3 — — VDDX PERT/PPST Disabled
44 PT2 IOC2 — — VDDX PERT/PPST Disabled
45 PT1 IOC1 — — VDDX PERT/PPST Disabled
46 PT0 IOC0 — — VDDX PERT/PPST Disabled
47 PB4 IRQ — — VDDX PUCR/PUPBE Disabled
48 PB5 XIRQ — — VDDX PUCR/PUPBE Disabled
49 PB6 — — — VDDX PUCR/PUPBE Disabled
50 PB7 — — — VDDX PUCR/PUPBE Disabled
51 PC0 — — — VDDA PUCR/PUPCE Disabled
52 PC1 — — — VDDA PUCR/PUPCE Disabled
53 PC2 — — — VDDA PUCR/PUPCE Disabled
54 PC3 — — — VDDA PUCR/PUPCE Disabled
55 PAD0 KWAD0 AN0 — VDDA PER1AD/PPS1AD Disabled
56 PAD8 KWAD8 AN8 — VDDA PER0AD/PPS0AD Disabled
Table 1-19. 100-Pin LQFP Pinout for S12G96 and S12G128
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func. CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 85
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
57 PAD1 KWAD1 AN1 — VDDA PER1AD/PPS1AD Disabled
58 PAD9 KWAD9 AN9 — VDDA PER0AD/PPS0AD Disabled
59 PAD2 KWAD2 AN2 — VDDA PER1AD/PPS1AD Disabled
60 PAD10 KWAD10 AN10 — VDDA PER0AD/PPS0AD Disabled
61 PAD3 KWAD3 AN3 — VDDA PER1AD/PPS1AD Disabled
62 PAD11 KWAD11 AN11 — VDDA PER0AD/PPS0AD Disabled
63 PAD4 KWAD4 AN4 — VDDA PER1AD/PPS1AD Disabled
64 PAD12 KWAD12 — — VDDA PER0AD/PPS0AD Disabled
65 PAD5 KWAD5 AN5 — VDDA PER1AD/PPS1AD Disabled
66 PAD13 KWAD13 — — VDDA PER0AD/PPS0AD Disabled
67 PAD6 KWAD6 AN6 — VDDA PER1AD/PPS1AD Disabled
68 PAD14 KWAD14 — — VDDA PER0AD/PPS0AD Disabled
69 PAD7 KWAD7 AN7 — VDDA PER1AD/PPS1AD Disabled
70 PAD15 KWAD15 — — VDDA PER0AD/PPS0AD Disabled
71 PC4 — — — VDDA PUCR/PUPCE Disabled
72 PC5 — — VDDA PUCR/PUPCE Disabled
73 PC6 — — VDDA PUCR/PUPCE Disabled
74 PC7 — — VDDA PUCR/PUPCE Disabled
75 VRH — — — — — —
76 VDDA — — — — — —
77 VSSA — — — — — —
78 PD0 — — — VDDX PUCR/PUPDE Disabled
79 PD1 — — — VDDX PUCR/PUPDE Disabled
80 PD2 — — — VDDX PUCR/PUPDE Disabled
81 PD3 — — — VDDX PUCR/PUPDE Disabled
82 PS0 RXD0 — — VDDX PERS/PPSS Up
83 PS1 TXD0 — — VDDX PERS/PPSS Up
84 PS2 RXD1 — — VDDX PERS/PPSS Up
85 PS3 TXD1 — — VDDX PERS/PPSS Up
Table 1-19. 100-Pin LQFP Pinout for S12G96 and S12G128
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func. CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
86 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
86 PS4 MISO0 — — VDDX PERS/PPSS Up
87 PS5 MOSI0 — — VDDX PERS/PPSS Up
88 PS6 SCK0 — — VDDX PERS/PPSS Up
89 PS7 API_EXTCLK SS0 — VDDX PERS/PPSS Up
90 VSSX2 — — — — — —
91 VDDX2 — — — — — —
92 PM0 RXCAN — — VDDX PERM/PPSM Disabled
93 PM1 TXCAN — — VDDX PERM/PPSM Disabled
94 PD4 — — — VDDX PUCR/PUPDE Disabled
95 PD5 — — — VDDX PUCR/PUPDE Disabled
96 PD6 — — — VDDX PUCR/PUPDE Disabled
97 PD7 — — — VDDX PUCR/PUPDE Disabled
98 PM2 RXD2 — — VDDX PERM/PPSM Disabled
99 PM3 TXD2 — — VDDX PERM/PPSM Disabled
100 PJ7 KWJ7 SS2 — VDDX PERJ/PPSJ Up
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-19. 100-Pin LQFP Pinout for S12G96 and S12G128
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func. CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 87
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.5 S12G192 and S12G240
1.8.5.1 Pinout 48-Pin LQFP
Figure 1-15. 48-Pin LQFP Pinout for S12G192 and S12G240
Table 1-20. 48-Pin LQFP Pinout for S12G192 and S12G240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
1 RESET — — — — VDDX PULLUP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
36
35
34
33
32
31
30
29
28
27
26
25
48
47
46
45
44
43
42
41
40
39
38
37
S12G192
S12G240
48-Pin LQFP
PAD7/KWAD7/AN7
PAD6/KWAD6/AN6
PAD5/KWAD5/AN5
PAD4/KWAD4/AN4
PAD11/KWAD11/AN11
PAD3/KWAD3/AN3
PAD10/KWAD10/AN10
PAD2/KWAD2/AN2
PAD9/KWAD9/AN9
PAD1/KWAD1/AN1
PAD8/KWAD8/AN8
PAD0/KWAD0/AN0
PWM0/API_EXTCLK/ETRIG0/KWP0/PP0
PWM1/ECLKX2/ETRIG1/KWP1/PP1
PWM2/ETRIG2/KWP2/PP2
PWM3/ETRIG3/KWP3/PP3
PWM4/KWP4/PP4
PWM5/KWP5/PP5
IOC5/PT5
IOC4/PT4
IOC3/PT3
IOC2/PT2
IRQ/IOC1/PT1
XIRQ/IOC0/PT0
RESET
VDDXR
VSSX
EXTAL/PE0
VSS
XTAL/PE1
TEST
MISO1/PWM6/KWJ0/PJ0
MOSI1/IOC6/KWJ1/PJ1
SCK1/IOC7/KWJ2/PJ2
SS1/PWM7/KWJ3/PJ3
BKGD
PM1/TXD2/TXCAN
PM0/RXD2/RXCAN
PS7/API_EXTCLK/ECLK/SS0
PS6/SCK0
PS5/MOSI0
PS4/MISO0
PS3/TXD1
PS2/RXD1
PS1/TXD0
PS0/RXD0
VSSA
VDDA/VRH
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
88 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2 VDDXR — — — — — — —
3 VSSX — — — — — — —
4 PE01EXTAL — — — VDDX PUCR/PDPEE Down
5 VSS — — — — — — —
6 PE11XTAL — — — VDDX PUCR/PDPEE Down
7 TEST — — — — N.A. RESET pin Down
8 PJ0 KWJ0 PWM6 MISO1 — VDDX PERJ/PPSJ Up
9 PJ1 KWJ1 IOC6 MOSI1 — VDDX PERJ/PPSJ Up
10 PJ2 KWJ2 IOC7 SCK1 — VDDX PERJ/PPSJ Up
11 PJ3 KWJ3 PWM7 SS1 — VDDX PERJ/PPSJ Up
12 BKGD MODC — — — VDDX PUCR/BKPUE Up
13 PP0 KWP0 ETRIG0 API_EXTCLK PWM0 VDDX PERP/PPSP Disabled
14 PP1 KWP1 ETRIG1 ECLKX2 PWM1 VDDX PERP/PPSP Disabled
15 PP2 KWP2 ETRIG2 PWM2 — VDDX PERP/PPSP Disabled
16 PP3 KWP3 ETRIG3 PWM3 — VDDX PERP/PPSP Disabled
17 PP4 KWP4 PWM4 — — VDDX PERP/PPSP Disabled
18 PP5 KWP5 PWM5 — — VDDX PERP/PPSP Disabled
19 PT5 IOC5 — — — VDDX PERT/PPST Disabled
20 PT4 IOC4 — — — VDDX PERT/PPST Disabled
21 PT3 IOC3 — — — VDDX PERT/PPST Disabled
22 PT2 IOC2 — — — VDDX PERT/PPST Disabled
23 PT1 IOC1 IRQ — — VDDX PERT/PPST Disabled
24 PT0 IOC0 XIRQ — — VDDX PERT/PPST Disabled
25 PAD0 KWAD0 AN0 — — VDDA PER1AD/PPS1AD Disabled
26 PAD8 KWAD8 AN8 — — VDDA PER0AD/PPS0AD Disabled
27 PAD1 KWAD1 AN1 — — VDDA PER1AD/PPS1AD Disabled
28 PAD9 KWAD9 AN9 — — VDDA PER0AD/PPS0AD Disabled
29 PAD2 KWAD2 AN2 — — VDDA PER1AD/PPS1AD Disabled
30 PAD10 KWAD10 AN10 — — VDDA PER0AD/PPS0AD Disabled
Table 1-20. 48-Pin LQFP Pinout for S12G192 and S12G240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 89
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
31 PAD3 KWAD3 AN3 — — VDDA PER1AD/PPS1AD Disabled
32 PAD11 KWAD11 AN11 — — VDDA PER0AD/PPS0AD Disabled
33 PAD4 KWAD4 AN4 — — VDDA PER1AD/PPS1AD Disabled
34 PAD5 KWAD5 AN5 — — VDDA PER1AD/PPS0AD Disabled
35 PAD6 KWAD6 AN6 — — VDDA PER1AD/PPS1AD Disabled
36 PAD7 KWAD7 AN7 — — VDDA PER1AD/PPS1AD Disabled
37 VDDA VRH — — — — — —
38 VSSA — — — — — — —
39 PS0 RXD0 — — — VDDX PERS/PPSS Up
40 PS1 TXD0 — — — VDDX PERS/PPSS Up
41 PS2 RXD1 — — — VDDX PERS/PPSS Up
42 PS3 TXD1 — — — VDDX PERS/PPSS Up
43 PS4 MISO0 — — — VDDX PERS/PPSS Up
44 PS5 MOSI0 — — — VDDX PERS/PPSS Up
45 PS6 SCK0 — — — VDDX PERS/PPSS Up
46 PS7 API_EXTCLK ECLK SS0 — VDDX PERS/PPSS Up
47 PM0 RXD2 RXCAN — — VDDX PERM/PPSM Disabled
48 PM1 TXD2 TXCAN — — VDDX PERM/PPSM Disabled
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-20. 48-Pin LQFP Pinout for S12G192 and S12G240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
90 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.5.2 Pinout 64-Pin LQFP
Figure 1-16. 64-Pin LQFP Pinout for S12G192 and S12G240
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
S12G192
S12G240
64-Pin LQFP
PWM0/API_EXTCLK/ETRIG0/KWP0/PP0
PWM1/ECLKX2/ETRIG1/KWP1/PP1
PWM2/ETRIG2/KWP2/PP2
PWM3/ETRIG3/KWP3/PP3
PWM4/KWP4/PP4
PWM5/KWP5/PP5
PWM6/KWP6/PP6
PWM7/KWP7/PP7
IOC7/PT7
IOC6/PT6
IOC5/PT5
IOC4/PT4
IOC3/PT3
IOC2/PT2
IRQ/IOC1/PT1
XIRQ/IOC0/PT0
SCK2/KWJ6/PJ6
MOSI2/KWJ5/PJ5
MISO2/KWJ4/PJ4
RESET
VDDX
VDDR
VSSX
EXTAL/PE0
VSS
XTAL/PE1
TEST
MISO1/KWJ0/PJ0
MOSI1/KWJ1/PJ1
SCK1/KWJ2/PJ2
SS1/KWJ3/PJ3
BKGD
PJ7/KWJ7/SS2
PM3/TXD2
PM2/RXD2
PM1/TXCAN
PM0/RXCAN
PS7/API_EXTCLK/ECLK/SS0
PS6/SCK0
PS5/MOSI0
PS4/MISO0
PS3/TXD1
PS2/RXD1
PS1/TXD0
PS0/RXD0
VSSA
VDDA
VRH
PAD15/KWAD15/AN15
PAD7/KWAD7/AN7
PAD14/KWAD14/AN14
PAD6/KWAD6/AN6
PAD13/KWAD13/AN13
PAD5/KWAD5/AN5
PAD12/KWAD12/AN12
PAD4/KWAD4/AN4
PAD11/KWAD11/AN11
PAD3/KWAD3/AN3
PAD10/KWAD10/AN10
PAD2/KWAD2/AN2
PAD9/KWAD9/AN9
PAD1/KWAD1/AN1
PAD8/KWAD8/AN8
PAD0/KWAD0/AN0
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 91
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 1-21. 64-Pin LQFP Pinout for S12G192 and S12G240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
1 PJ6 KWJ6 SCK2 — — VDDX PERJ/PPSJ Up
2 PJ5 KWJ5 MOSI2 — — VDDX PERJ/PPSJ Up
3 PJ4 KWJ4 MISO2 — — VDDX PERJ/PPSJ Up
4 RESET — — — — VDDX PULLUP
5 VDDX — — — — — — —
6 VDDR — — — — — — —
7 VSSX — — — — — — —
8 PE01EXTAL — — — VDDX PUCR/PDPEE Down
9 VSS — — — — — — —
10 PE11XTAL — — — VDDX PUCR/PDPEE Down
11 TEST — — — — N.A. RESET pin Down
12 PJ0 KWJ0 MISO1 — — VDDX PERJ/PPSJ Up
13 PJ1 KWJ1 MOSI1 — — VDDX PERJ/PPSJ Up
14 PJ2 KWJ2 SCK1 — — VDDX PERJ/PPSJ Up
15 PJ3 KWJ3 SS1 — — VDDX PERJ/PPSJ Up
16 BKGD MODC — — — VDDX PUCR/BKPUE Up
17 PP0 KWP0 ETRIG0 API_EXTCLK PWM0 VDDX PERP/PPSP Disabled
18 PP1 KWP1 ETRIG1 ECLKX2 PWM1 VDDX PERP/PPSP Disabled
19 PP2 KWP2 ETRIG2 PWM2 — VDDX PERP/PPSP Disabled
20 PP3 KWP3 ETRIG3 PWM3 — VDDX PERP/PPSP Disabled
21 PP4 KWP4 PWM4 — — VDDX PERP/PPSP Disabled
22 PP5 KWP5 PWM5 — — VDDX PERP/PPSP Disabled
23 PP6 KWP6 PWM6 — — VDDX PERP/PPSP Disabled
24 PP7 KWP7 PWM7 — — VDDX PERP/PPSP Disabled
25 PT7 IOC7 — — — VDDX PERT/PPST Disabled
26 PT6 IOC6 — — — VDDX PERT/PPST Disabled
27 PT5 IOC5 — — — VDDX PERT/PPST Disabled
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
92 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28 PT4 IOC4 — — — VDDX PERT/PPST Disabled
29 PT3 IOC3 — — — VDDX PERT/PPST Disabled
30 PT2 IOC2 — — — VDDX PERT/PPST Disabled
31 PT1 IOC1 IRQ — — VDDX PERT/PPST Disabled
32 PT0 IOC0 XIRQ — — VDDX PERT/PPST Disabled
33 PAD0 KWAD0 AN0 — — VDDA PER1AD/PPS1AD Disabled
34 PAD8 KWAD8 AN8 — — VDDA PER0AD/PPS0AD Disabled
35 PAD1 KWAD1 AN1 — — VDDA PER1AD/PPS1AD Disabled
36 PAD9 KWAD9 AN9 — — VDDA PER0ADPPS0AD Disabled
37 PAD2 KWAD2 AN2 — — VDDA PER1AD/PPS1AD Disabled
38 PAD10 KWAD10 AN10 — — VDDA PER0AD/PPS0AD Disabled
39 PAD3 KWAD3 AN3 — — VDDA PER1AD/PPS1AD Disabled
40 PAD11 KWAD11 AN11 — — VDDA PER0AD/PPS0AD Disabled
41 PAD4 KWAD4 AN4 — — VDDA PER1AD/PPS1AD Disabled
42 PAD12 KWAD12 AN12 — — VDDA PER0AD/PPS0AD Disabled
43 PAD5 KWAD5 AN5 — — VDDA PER1AD/PPS1AD Disabled
44 PAD13 KWAD13 AN13 — — VDDA PER0AD/PPS0AD Disabled
45 PAD6 KWAD6 AN6 — — VDDA PER1AD/PPS1AD Disabled
46 PAD14 KWAD14 AN14 — — VDDA PER0AD/PPS0AD Disabled
47 PAD7 KWAD7 AN7 — — VDDA PER1AD/PPS1AD Disabled
48 PAD15 KWAD15 AN15 — — VDDA PER0AD/PPS0AD Disabled
49 VRH — — — — — — —
50 VDDA — — — — — — —
51 VSSA — — — — — — —
52 PS0 RXD0 — — — VDDX PERS/PPSS Up
53 PS1 TXD0 — — — VDDX PERS/PPSS Up
54 PS2 RXD1 — — — VDDX PERS/PPSS Up
55 PS3 TXD1 — — — VDDX PERS/PPSS Up
56 PS4 MISO0 — — — VDDX PERS/PPSS Up
Table 1-21. 64-Pin LQFP Pinout for S12G192 and S12G240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 93
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
57 PS5 MOSI0 — — — VDDX PERS/PPSS Up
58 PS6 SCK0 — — — VDDX PERS/PPSS Up
59 PS7 API_EXTCLK ECLK SS0 — VDDX PERS/PPSS Up
60 PM0 RXCAN — — — VDDX PERM/PPSM Disabled
61 PM1 TXCAN — — — VDDX PERM/PPSM Disabled
62 PM2 RXD2 — — — VDDX PERM/PPSM Disabled
63 PM3 TXD2 — — — VDDX PERM/PPSM Disabled
64 PJ7 KWJ7 SS2 — — VDDX PERJ/PPSJ Up
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-21. 64-Pin LQFP Pinout for S12G192 and S12G240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
94 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.5.3 Pinout 100-Pin LQFP
Figure 1-17. 100-Pin LQFP Pinout for S12G192 and S12G240
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
VRH
PC7
PC6
PC5
PC4
PAD15/KWAD15/AN15
PAD7/KWAD7/AN7
PAD14/KWAD14/AN14
PAD6/KWAD6/AN6
PAD13/KWAD13/AN13
PAD5/KWAD5/AN5
PAD12/KWAD12/AN12
PAD4/KWAD4/AN4
PAD11/KWAD11/AN11
PAD3/KWAD3/AN3
PAD10/KWAD10/AN10
PAD2/KWAD2/AN2
PAD9/KWAD9/AN9
PAD1/KWAD1/AN1
PAD8/KWAD8/AN8
PAD0/KWAD0/AN0
PC3
PC2
PC1
PC0
API_EXTCLK/PB1
ECLKX2/PB2
PB3
PWM0/ETRIG0/KWP0/PP0
PWM1/ETRIG1/KWP1/PP1
PWM2/ETRIG2/KWP2/PP2
PWM3/ETRIG3/KWP3/PP3
PWM4/KWP4/PP4
PWM5/KWP5/PP5
PWM6/KWP6/PP6
PWM7/KWP7/PP7
VDDX3
VSSX3
IOC7/PT7
IOC6/PT6
IOC5/PT5
IOC4/PT4
IOC3/PT3
IOC2/PT2
IOC1/PT1
IOC0/PT0
IRQ/PB4
XIRQ/PB5
PB6
PB7
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
SCK2/KWJ6/PJ6
MOSI2/KWJ5/PJ5
MISO2/KWJ4/PJ4
PA 0
PA 1
PA 2
PA 3
RESET
VDDX1
VDDR
VSSX1
EXTAL/PE0
VSS
XTAL/PE1
TEST
PA 4
PA 5
PA 6
PA 7
MISO1/KWJ0/PJ0
MOSI1/KWJ1/PJ1
SCK1/KWJ2/PJ2
SS1/KWJ3/PJ3
BKGD
ECLK/PB0
PJ7/KWJ7/SS2
PM3/TXD2
PM2/RXD2
PD7
PD6
PD5
PD4
PM1/TXCAN
PM0/RXCAN
VDDX2
VSSX2
PS7/API_EXTCLK/SS0
PS6/SCK0
PS5/MOSI0
PS4/MISO0
PS3/TXD1
PS2/RXD1
PS1/TXD0
PS0/RXD0
PD3
PD2
PD1
PD0
VSSA
VDDA
S12G192
S12G240
100-Pin LQFP
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 95
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 1-22. 100-Pin LQFP Pinout for S12G192 and S12G240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func. CTRL Reset
State
1 PJ6 KWJ6 SCK2 — VDDX PERJ/PPSJ Up
2 PJ5 KWJ5 MOSI2 — VDDX PERJ/PPSJ Up
3 PJ4 KWJ4 MISO2 — VDDX PERJ/PPSJ Up
4 PA0———V
DDX PUCR/PUPAE Disabled
5 PA1———V
DDX PUCR/PUPAE Disabled
6 PA2———V
DDX PUCR/PUPAE Disabled
7 PA3———V
DDX PUCR/PUPAE Disabled
8 RESET — — — VDDX PULLUP
9 VDDX1 — — — — — —
10 VDDR — — — — — —
11 VSSX1 — — — — — —
12 PE01EXTAL — — VDDX PUCR/PDPEE Down
13 VSS — — — — — —
14 PE11XTAL — — VDDX PUCR/PDPEE Down
15 TEST — — — N.A. RESET pin Down
16PA4———V
DDX PUCR/PUPAE Disabled
17PA5———V
DDX PUCR/PUPAE Disabled
18PA6———V
DDX PUCR/PUPAE Disabled
19PA7———V
DDX PUCR/PUPAE Disabled
20 PJ0 KWJ0 MISO1 — VDDX PERJ/PPSJ Up
21 PJ1 KWJ1 MOSI1 — VDDX PERJ/PPSJ Up
22 PJ2 KWJ2 SCK1 — VDDX PERJ/PPSJ Up
23 PJ3 KWJ3 SS1 — VDDX PERJ/PPSJ Up
24 BKGD MODC — — VDDX PUCR/BKPUE Up
25 PB0 ECLK — — VDDX PUCR/PUPBE Disabled
26 PB1 API_EXTCLK ——V
DDX PUCR/PUPBE Disabled
27 PB2 ECLKX2 — — VDDX PUCR/PUPBE Disabled
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
96 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28 PB3 — — — VDDX PUCR/PUPBE Disabled
29 PP0 KWP0 ETRIG0 PWM0 VDDX PERP/PPSP Disabled
30 PP1 KWP1 ETRIG1 PWM1 VDDX PERP/PPSP Disabled
31 PP2 KWP2 ETRIG2 PWM2 VDDX PERP/PPSP Disabled
32 PP3 KWP3 ETRIG3 PWM3 VDDX PERP/PPSP Disabled
33 PP4 KWP4 PWM4 — VDDX PERP/PPSP Disabled
34 PP5 KWP5 PWM5 — VDDX PERP/PPSP Disabled
35 PP6 KWP6 PWM6 — VDDX PERP/PPSP Disabled
36 PP7 KWP7 PWM7 — VDDX PERP/PPSP Disabled
37 VDDX3 — — — — — —
38 VSSX3 — — — — — —
39 PT7 IOC7 — — VDDX PERT/PPST Disabled
40 PT6 IOC6 — — VDDX PERT/PPST Disabled
41 PT5 IOC5 — — VDDX PERT/PPST Disabled
42 PT4 IOC4 — — VDDX PERT/PPST Disabled
43 PT3 IOC3 — — VDDX PERT/PPST Disabled
44 PT2 IOC2 — — VDDX PERT/PPST Disabled
45 PT1 IOC1 — — VDDX PERT/PPST Disabled
46 PT0 IOC0 — — VDDX PERT/PPST Disabled
47 PB4 IRQ — — VDDX PUCR/PUPBE Disabled
48 PB5 XIRQ — — VDDX PUCR/PUPBE Disabled
49 PB6 — — — VDDX PUCR/PUPBE Disabled
50 PB7 — — — VDDX PUCR/PUPBE Disabled
51 PC0 — — — VDDA PUCR/PUPCE Disabled
52 PC1 — — — VDDA PUCR/PUPCE Disabled
53 PC2 — — — VDDA PUCR/PUPCE Disabled
54 PC3 — — — VDDA PUCR/PUPCE Disabled
55 PAD0 KWAD0 AN0 — VDDA PER1AD/PPS1AD Disabled
56 PAD8 KWAD8 AN8 — VDDA PER0AD/PPS0AD Disabled
Table 1-22. 100-Pin LQFP Pinout for S12G192 and S12G240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func. CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 97
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
57 PAD1 KWAD1 AN1 — VDDA PER1AD/PPS1AD Disabled
58 PAD9 KWAD9 AN9 — VDDA PER0AD/PPS0AD Disabled
59 PAD2 KWAD2 AN2 — VDDA PER1AD/PPS1AD Disabled
60 PAD10 KWAD10 AN10 — VDDA PER0AD/PPS0AD Disabled
61 PAD3 KWAD3 AN3 — VDDA PER1AD/PPS1AD Disabled
62 PAD11 KWAD11 AN11 — VDDA PER0AD/PPS0AD Disabled
63 PAD4 KWAD4 AN4 — VDDA PER1AD/PPS1AD Disabled
64 PAD12 KWAD12 AN12 — VDDA PER0AD/PPS0AD Disabled
65 PAD5 KWAD5 AN5 — VDDA PER1AD/PPS1AD Disabled
66 PAD13 KWAD13 AN13 — VDDA PER0AD/PPS0AD Disabled
67 PAD6 KWAD6 AN6 — VDDA PER1AD/PPS1AD Disabled
68 PAD14 KWAD14 AN14 — VDDA PER0AD/PPS0AD Disabled
69 PAD7 KWAD7 AN7 — VDDA PER1AD/PPS1AD Disabled
70 PAD15 KWAD15 AN15 — VDDA PER0AD/PPS0AD Disabled
71 PC4 — — — VDDA PUCR/PUPCE Disabled
72 PC5 — — — VDDA PUCR/PUPCE Disabled
73 PC6 — — — VDDA PUCR/PUPCE Disabled
74 PC7 — — — VDDA PUCR/PUPCE Disabled
75 VRH — — — — — —
76 VDDA — — — — — —
77 VSSA — — — — — —
78 PD0 — — — VDDX PUCR/PUPDE Disabled
79 PD1 — — — VDDX PUCR/PUPDE Disabled
80 PD2 — — — VDDX PUCR/PUPDE Disabled
81 PD3 — — — VDDX PUCR/PUPDE Disabled
82 PS0 RXD0 — — VDDX PERS/PPSS Up
83 PS1 TXD0 — — VDDX PERS/PPSS Up
84 PS2 RXD1 — — VDDX PERS/PPSS Up
85 PS3 TXD1 — — VDDX PERS/PPSS Up
Table 1-22. 100-Pin LQFP Pinout for S12G192 and S12G240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func. CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
98 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
86 PS4 MISO0 — — VDDX PERS/PPSS Up
87 PS5 MOSI0 — — VDDX PERS/PPSS Up
88 PS6 SCK0 — — VDDX PERS/PPSS Up
89 PS7 API_EXTCLK SS0 — VDDX PERS/PPSS Up
90 VSSX2 — — — — — —
91 VDDX2 — — — — — —
92 PM0 RXCAN — — VDDX PERM/PPSM Disabled
93 PM1 TXCAN — — VDDX PERM/PPSM Disabled
94 PD4 — — — VDDX PUCR/PUPDE Disabled
95 PD5 — — — VDDX PUCR/PUPDE Disabled
96 PD6 — — — VDDX PUCR/PUPDE Disabled
97 PD7 — — — VDDX PUCR/PUPDE Disabled
98 PM2 RXD2 — — VDDX PERM/PPSM Disabled
99 PM3 TXD2 — — VDDX PERM/PPSM Disabled
100 PJ7 KWJ7 SS2 — VDDX PERJ/PPSJ Up
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-22. 100-Pin LQFP Pinout for S12G192 and S12G240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func. CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 99
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.6 S12GA192 and S12GA240
1.8.6.1 Pinout 48-Pin LQFP
Figure 1-18. 48-Pin LQFP Pinout for S12GA192 and S12GA240
Table 1-23. 48-Pin LQFP Pinout for S12GA192 and S12GA240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
1 RESET — — — — VDDX PULLUP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
36
35
34
33
32
31
30
29
28
27
26
25
48
47
46
45
44
43
42
41
40
39
38
37
S12GA192
S12GA240
48-Pin LQFP
PAD7/KWAD7/AN7
PAD6/KWAD6/AN6
PAD5/KWAD5/AN5
PAD4/KWAD4/AN4
PAD11/KWAD11/AN11/DACU0/AMP0
PAD3/KWAD3/AN3
PAD10/KWAD10/AN10/DACU1/AMP1
PAD2/KWAD2/AN2
PAD9/KWAD9/AN9
PAD1/KWAD1/AN1
PAD8/KWAD8/AN8
PAD0/KWAD0/AN0
PWM0/API_EXTCLK/ETRIG0/KWP0/PP0
PWM1/ECLKX2/ETRIG1/KWP1/PP1
PWM2/ETRIG2/KWP2/PP2
PWM3/ETRIG3/KWP3/PP3
PWM4/KWP4/PP4
PWM5/KWP5/PP5
IOC5/PT5
IOC4/PT4
IOC3/PT3
IOC2/PT2
IRQ/IOC1/PT1
XIRQ/IOC0/PT0
RESET
VDDXR
VSSX
EXTAL/PE0
VSS
XTAL/PE1
TEST
MISO1/PWM6/KWJ0/PJ0
MOSI1/IOC6/KWJ1/PJ1
SCK1/IOC7/KWJ2/PJ2
SS1/PWM7/KWJ3/PJ3
BKGD
PM1/TXD2/TXCAN
PM0/RXD2/RXCAN
PS7/API_EXTCLK/ECLK/SS0
PS6/SCK0
PS5/MOSI0
PS4/MISO0
PS3/TXD1
PS2/RXD1
PS1/TXD0
PS0/RXD0
VSSA
VDDA/VRH
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
100 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2 VDDXR — — — — — — —
3 VSSX — — — — — — —
4 PE01EXTAL — — — VDDX PUCR/PDPEE Down
5 VSS — — — — — — —
6 PE11XTAL — — — VDDX PUCR/PDPEE Down
7 TEST — — — — N.A. RESET pin Down
8 PJ0 KWJ0 PWM6 MISO1 — VDDX PERJ/PPSJ Up
9 PJ1 KWJ1 IOC6 MOSI1 — VDDX PERJ/PPSJ Up
10 PJ2 KWJ2 IOC7 SCK1 — VDDX PERJ/PPSJ Up
11 PJ3 KWJ3 PWM7 SS1 — VDDX PERJ/PPSJ Up
12 BKGD MODC — — — VDDX PUCR/BKPUE Up
13 PP0 KWP0 ETRIG0 API_EXTCLK PWM0 VDDX PERP/PPSP Disabled
14 PP1 KWP1 ETRIG1 ECLKX2 PWM1 VDDX PERP/PPSP Disabled
15 PP2 KWP2 ETRIG2 PWM2 — VDDX PERP/PPSP Disabled
16 PP3 KWP3 ETRIG3 PWM3 — VDDX PERP/PPSP Disabled
17 PP4 KWP4 PWM4 — — VDDX PERP/PPSP Disabled
18 PP5 KWP5 PWM5 — — VDDX PERP/PPSP Disabled
19 PT5 IOC5 — — — VDDX PERT/PPST Disabled
20 PT4 IOC4 — — — VDDX PERT/PPST Disabled
21 PT3 IOC3 — — — VDDX PERT/PPST Disabled
22 PT2 IOC2 — — — VDDX PERT/PPST Disabled
23 PT1 IOC1 IRQ — — VDDX PERT/PPST Disabled
24 PT0 IOC0 XIRQ — — VDDX PERT/PPST Disabled
25 PAD0 KWAD0 AN0 — — VDDA PER1AD/PPS1AD Disabled
26 PAD8 KWAD8 AN8 — — VDDA PER0AD/PPS0AD Disabled
27 PAD1 KWAD1 AN1 — — VDDA PER1AD/PPS1AD Disabled
28 PAD9 KWAD9 AN9 — VDDA PER0AD/PPS0AD Disabled
29 PAD2 KWAD2 AN2 — — VDDA PER1AD/PPS1AD Disabled
30 PAD10 KWAD10 AN10 DACU1 AMP1 VDDA PER0AD/PPS0AD Disabled
Table 1-23. 48-Pin LQFP Pinout for S12GA192 and S12GA240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 101
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
31 PAD3 KWAD3 AN3 — — VDDA PER1AD/PPS1AD Disabled
32 PAD11 KWAD11 AN11 DACU0 AMP0 VDDA PER0AD/PPS0AD Disabled
33 PAD4 KWAD4 AN4 — — VDDA PER1AD/PPS1AD Disabled
34 PAD5 KWAD5 AN5 — — VDDA PER1AD/PPS0AD Disabled
35 PAD6 KWAD6 AN6 — — VDDA PER1AD/PPS1AD Disabled
36 PAD7 KWAD7 AN7 — — VDDA PER1AD/PPS1AD Disabled
37 VDDA VRH — — — — — —
38 VSSA — — — — — — —
39 PS0 RXD0 — — — VDDX PERS/PPSS Up
40 PS1 TXD0 — — — VDDX PERS/PPSS Up
41 PS2 RXD1 — — — VDDX PERS/PPSS Up
42 PS3 TXD1 — — — VDDX PERS/PPSS Up
43 PS4 MISO0 — — — VDDX PERS/PPSS Up
44 PS5 MOSI0 — — — VDDX PERS/PPSS Up
45 PS6 SCK0 — — — VDDX PERS/PPSS Up
46 PS7 API_EXTCLK ECLK SS0 — VDDX PERS/PPSS Up
47 PM0 RXD2 RXCAN — — VDDX PERM/PPSM Disabled
48 PM1 TXD2 TXCAN — — VDDX PERM/PPSM Disabled
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-23. 48-Pin LQFP Pinout for S12GA192 and S12GA240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
102 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.6.2 Pinout 64-Pin LQFP
Figure 1-19. 64-Pin LQFP Pinout for S12GA192 and S12GA240
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
S12GA192
S12GA240
64-Pin LQFP
PWM0/API_EXTCLK/ETRIG0/KWP0/PP0
PWM1/ECLKX2/ETRIG1/KWP1/PP1
PWM2/ETRIG2/KWP2/PP2
PWM3/ETRIG3/KWP3/PP3
PWM4/KWP4/PP4
PWM5/KWP5/PP5
PWM6/KWP6/PP6
PWM7/KWP7/PP7
IOC7/PT7
IOC6/PT6
IOC5/PT5
IOC4/PT4
IOC3/PT3
IOC2/PT2
IRQ/IOC1/PT1
XIRQ/IOC0/PT0
SCK2/KWJ6/PJ6
MOSI2/KWJ5/PJ5
MISO2/KWJ4/PJ4
RESET
VDDX
VDDR
VSSX
EXTAL/PE0
VSS
XTAL/PE1
TEST
MISO1/KWJ0/PJ0
MOSI1/KWJ1/PJ1
SCK1/KWJ2/PJ2
SS1/KWJ3/PJ3
BKGD
PJ7/KWJ7/SS2
PM3/TXD2
PM2/RXD2
PM1/TXCAN
PM0/RXCAN
PS7/API_EXTCLK/ECLK/SS0
PS6/SCK0
PS5/MOSI0
PS4/MISO0
PS3/TXD1
PS2/RXD1
PS1/TXD0
PS0/RXD0
VSSA
VDDA
VRH
PAD15/KWAD15/AN15/DACU0
PAD7/KWAD7/AN7
PAD14/KWAD14/AN14/AMPP0
PAD6/KWAD6/AN6
PAD13/KWAD13/AN13/AMPM0
PAD5/KWAD5/AN5
PAD12/KWAD12/AN12
PAD4/KWAD4/AN4
PAD11/KWAD11/AN11/AMP0
PAD3/KWAD3/AN3
PAD10/KWAD10/AN10/DACU1/AMP1
PAD2/KWAD2/AN2
PAD9/KWAD9/AN9
PAD1/KWAD1/AN1
PAD8/KWAD8/AN8
PAD0/KWAD0/AN0
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 103
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 1-24. 64-Pin LQFP Pinout for S12GA192 and S12GA240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
1 PJ6 KWJ6 SCK2 — — VDDX PERJ/PPSJ Up
2 PJ5 KWJ5 MOSI2 — — VDDX PERJ/PPSJ Up
3 PJ4 KWJ4 MISO2 — — VDDX PERJ/PPSJ Up
4 RESET — — — — VDDX PULLUP
5 VDDX — — — — — — —
6 VDDR — — — — — — —
7 VSSX — — — — — — —
8 PE01EXTAL — — — VDDX PUCR/PDPEE Down
9 VSS — — — — — — —
10 PE11XTAL — — — VDDX PUCR/PDPEE Down
11 TEST — — — — N.A. RESET pin Down
12 PJ0 KWJ0 MISO1 — — VDDX PERJ/PPSJ Up
13 PJ1 KWJ1 MOSI1 — — VDDX PERJ/PPSJ Up
14 PJ2 KWJ2 SCK1 — — VDDX PERJ/PPSJ Up
15 PJ3 KWJ3 SS1 — — VDDX PERJ/PPSJ Up
16 BKGD MODC — — — VDDX PUCR/BKPUE Up
17 PP0 KWP0 ETRIG0 API_EXTCLK PWM0 VDDX PERP/PPSP Disabled
18 PP1 KWP1 ETRIG1 ECLKX2 PWM1 VDDX PERP/PPSP Disabled
19 PP2 KWP2 ETRIG2 PWM2 — VDDX PERP/PPSP Disabled
20 PP3 KWP3 ETRIG3 PWM3 — VDDX PERP/PPSP Disabled
21 PP4 KWP4 PWM4 — — VDDX PERP/PPSP Disabled
22 PP5 KWP5 PWM5 — — VDDX PERP/PPSP Disabled
23 PP6 KWP6 PWM6 — — VDDX PERP/PPSP Disabled
24 PP7 KWP7 PWM7 — — VDDX PERP/PPSP Disabled
25 PT7 IOC7 — — — VDDX PERT/PPST Disabled
26 PT6 IOC6 — — — VDDX PERT/PPST Disabled
27 PT5 IOC5 — — — VDDX PERT/PPST Disabled
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
104 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28 PT4 IOC4 — — — VDDX PERT/PPST Disabled
29 PT3 IOC3 — — — VDDX PERT/PPST Disabled
30 PT2 IOC2 — — — VDDX PERT/PPST Disabled
31 PT1 IOC1 IRQ — — VDDX PERT/PPST Disabled
32 PT0 IOC0 XIRQ — — VDDX PERT/PPST Disabled
33 PAD0 KWAD0 AN0 — — VDDA PER1AD/PPS1AD Disabled
34 PAD8 KWAD8 AN8 — — VDDA PER0AD/PPS0AD Disabled
35 PAD1 KWAD1 AN1 — — VDDA PER1AD/PPS1AD Disabled
36 PAD9 KWAD9 AN9 — VDDA PER0ADPPS0AD Disabled
37 PAD2 KWAD2 AN2 — — VDDA PER1AD/PPS1AD Disabled
38 PAD10 KWAD10 AN10 DACU1 AMP1 VDDA PER0AD/PPS0AD Disabled
39 PAD3 KWAD3 AN3 — — VDDA PER1AD/PPS1AD Disabled
40 PAD11 KWAD11 AN11 AMP0 — VDDA PER0AD/PPS0AD Disabled
41 PAD4 KWAD4 AN4 — — VDDA PER1AD/PPS1AD Disabled
42 PAD12 KWAD12 AN12 — — VDDA PER0AD/PPS0AD Disabled
43 PAD5 KWAD5 AN5 — — VDDA PER1AD/PPS1AD Disabled
44 PAD13 KWAD13 AN13 AMPM0 — VDDA PER0AD/PPS0AD Disabled
45 PAD6 KWAD6 AN6 — — VDDA PER1AD/PPS1AD Disabled
46 PAD14 KWAD14 AN14 AMPP0 — VDDA PER0AD/PPS0AD Disabled
47 PAD7 KWAD7 AN7 — — VDDA PER1AD/PPS1AD Disabled
48 PAD15 KWAD15 AN15 DACU0 — VDDA PER0AD/PPS0AD Disabled
49 VRH — — — — — — —
50 VDDA — — — — — — —
51 VSSA — — — — — — —
52 PS0 RXD0 — — — VDDX PERS/PPSS Up
53 PS1 TXD0 — — — VDDX PERS/PPSS Up
54 PS2 RXD1 — — — VDDX PERS/PPSS Up
55 PS3 TXD1 — — — VDDX PERS/PPSS Up
56 PS4 MISO0 — — — VDDX PERS/PPSS Up
Table 1-24. 64-Pin LQFP Pinout for S12GA192 and S12GA240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 105
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
57 PS5 MOSI0 — — — VDDX PERS/PPSS Up
58 PS6 SCK0 — — — VDDX PERS/PPSS Up
59 PS7 API_EXTCLK ECLK SS0 — VDDX PERS/PPSS Up
60 PM0 RXCAN — — — VDDX PERM/PPSM Disabled
61 PM1 TXCAN — — — VDDX PERM/PPSM Disabled
62 PM2 RXD2 — — — VDDX PERM/PPSM Disabled
63 PM3 TXD2 — — — VDDX PERM/PPSM Disabled
64 PJ7 KWJ7 SS2 — — VDDX PERJ/PPSJ Up
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-24. 64-Pin LQFP Pinout for S12GA192 and S12GA240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func
5th
Func CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
106 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.8.6.3 Pinout 100-Pin LQFP
Figure 1-20. 100-Pin LQFP Pinout for S12GA192 and S12GA240
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
VRH
PC7/DACU1
PC6/AMPP1
PC5/AMPM1
PC4
PAD15/KWAD15/AN15/DACU0
PAD7/KWAD7/AN7
PAD14/KWAD14/AN14/AMPP0
PAD6/KWAD6/AN6
PAD13/KWAD13/AN13/AMPM0
PAD5/KWAD5/AN5
PAD12/KWAD12/AN12
PAD4/KWAD4/AN4
PAD11/KWAD11/AN11/AMP0
PAD3/KWAD3/AN3
PAD10/KWAD10/AN10/AMP1
PAD2/KWAD2/AN2
PAD9/KWAD9/AN9
PAD1/KWAD1/AN1
PAD8/KWAD8/AN8
PAD0/KWAD0/AN0
PC3
PC2
PC1
PC0
API_EXTCLK/PB1
ECLKX2/PB2
PB3
PWM0/ETRIG0/KWP0/PP0
PWM1/ETRIG1/KWP1/PP1
PWM2/ETRIG2/KWP2/PP2
PWM3/ETRIG3/KWP3/PP3
PWM4/KWP4/PP4
PWM5/KWP5/PP5
PWM6/KWP6/PP6
PWM7/KWP7/PP7
VDDX3
VSSX3
IOC7/PT7
IOC6/PT6
IOC5/PT5
IOC4/PT4
IOC3/PT3
IOC2/PT2
IOC1/PT1
IOC0/PT0
IRQ/PB4
XIRQ/PB5
PB6
PB7
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
SCK2/KWJ6/PJ6
MOSI2/KWJ5/PJ5
MISO2/KWJ4/PJ4
PA 0
PA 1
PA 2
PA 3
RESET
VDDX1
VDDR
VSSX1
EXTAL/PE0
VSS
XTAL/PE1
TEST
PA 4
PA 5
PA 6
PA 7
MISO1/KWJ0/PJ0
MOSI1/KWJ1/PJ1
SCK1/KWJ2/PJ2
SS1/KWJ3/PJ3
BKGD
ECLK/PB0
PJ7/KWJ7/SS2
PM3/TXD2
PM2/RXD2
PD7
PD6
PD5
PD4
PM1/TXCAN
PM0/RXCAN
VDDX2
VSSX2
PS7/API_EXTCLK/SS0
PS6/SCK0
PS5/MOSI0
PS4/MISO0
PS3/TXD1
PS2/RXD1
PS1/TXD0
PS0/RXD0
PD3
PD2
PD1
PD0
VSSA
VDDA
S12GA192
S12GA240
100-Pin LQFP
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 107
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 1-25. 100-Pin LQFP Pinout for S12GA192 and S12GA240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func. CTRL Reset
State
1 PJ6 KWJ6 SCK2 — VDDX PERJ/PPSJ Up
2 PJ5 KWJ5 MOSI2 — VDDX PERJ/PPSJ Up
3 PJ4 KWJ4 MISO2 — VDDX PERJ/PPSJ Up
4 PA0———V
DDX PUCR/PUPAE Disabled
5 PA1———V
DDX PUCR/PUPAE Disabled
6 PA2———V
DDX PUCR/PUPAE Disabled
7 PA3———V
DDX PUCR/PUPAE Disabled
8 RESET — — — VDDX PULLUP
9 VDDX1 — — — — — —
10 VDDR — — — — — —
11 VSSX1 — — — — — —
12 PE01EXTAL — — VDDX PUCR/PDPEE Down
13 VSS — — — — — —
14 PE11XTAL — — VDDX PUCR/PDPEE Down
15 TEST — — — N.A. RESET pin Down
16PA4———V
DDX PUCR/PUPAE Disabled
17PA5———V
DDX PUCR/PUPAE Disabled
18PA6———V
DDX PUCR/PUPAE Disabled
19PA7———V
DDX PUCR/PUPAE Disabled
20 PJ0 KWJ0 MISO1 — VDDX PERJ/PPSJ Up
21 PJ1 KWJ1 MOSI1 — VDDX PERJ/PPSJ Up
22 PJ2 KWJ2 SCK1 — VDDX PERJ/PPSJ Up
23 PJ3 KWJ3 SS1 — VDDX PERJ/PPSJ Up
24 BKGD MODC — — VDDX PUCR/BKPUE Up
25 PB0 ECLK — — VDDX PUCR/PUPBE Disabled
26 PB1 API_EXTCLK ——V
DDX PUCR/PUPBE Disabled
27 PB2 ECLKX2 — — VDDX PUCR/PUPBE Disabled
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
108 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28 PB3 — — — VDDX PUCR/PUPBE Disabled
29 PP0 KWP0 ETRIG0 PWM0 VDDX PERP/PPSP Disabled
30 PP1 KWP1 ETRIG1 PWM1 VDDX PERP/PPSP Disabled
31 PP2 KWP2 ETRIG2 PWM2 VDDX PERP/PPSP Disabled
32 PP3 KWP3 ETRIG3 PWM3 VDDX PERP/PPSP Disabled
33 PP4 KWP4 PWM4 — VDDX PERP/PPSP Disabled
34 PP5 KWP5 PWM5 — VDDX PERP/PPSP Disabled
35 PP6 KWP6 PWM6 — VDDX PERP/PPSP Disabled
36 PP7 KWP7 PWM7 — VDDX PERP/PPSP Disabled
37 VDDX3 — — — — — —
38 VSSX3 — — — — — —
39 PT7 IOC7 — — VDDX PERT/PPST Disabled
40 PT6 IOC6 — — VDDX PERT/PPST Disabled
41 PT5 IOC5 — — VDDX PERT/PPST Disabled
42 PT4 IOC4 — — VDDX PERT/PPST Disabled
43 PT3 IOC3 — — VDDX PERT/PPST Disabled
44 PT2 IOC2 — — VDDX PERT/PPST Disabled
45 PT1 IOC1 — — VDDX PERT/PPST Disabled
46 PT0 IOC0 — — VDDX PERT/PPST Disabled
47 PB4 IRQ — — VDDX PUCR/PUPBE Disabled
48 PB5 XIRQ — — VDDX PUCR/PUPBE Disabled
49 PB6 — — — VDDX PUCR/PUPBE Disabled
50 PB7 — — — VDDX PUCR/PUPBE Disabled
51 PC0 — — — VDDA PUCR/PUPCE Disabled
52 PC1 — — — VDDA PUCR/PUPCE Disabled
53 PC2 — — — VDDA PUCR/PUPCE Disabled
54 PC3 — — — VDDA PUCR/PUPCE Disabled
55 PAD0 KWAD0 AN0 — VDDA PER1AD/PPS1AD Disabled
56 PAD8 KWAD8 AN8 — VDDA PER0AD/PPS0AD Disabled
Table 1-25. 100-Pin LQFP Pinout for S12GA192 and S12GA240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func. CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 109
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
57 PAD1 KWAD1 AN1 — VDDA PER1AD/PPS1AD Disabled
58 PAD9 KWAD9 AN9 — VDDA PER0AD/PPS0AD Disabled
59 PAD2 KWAD2 AN2 — VDDA PER1AD/PPS1AD Disabled
60 PAD10 KWAD10 AN10 AMP1 VDDA PER0AD/PPS0AD Disabled
61 PAD3 KWAD3 AN3 — VDDA PER1AD/PPS1AD Disabled
62 PAD11 KWAD11 AN11 AMP0 VDDA PER0AD/PPS0AD Disabled
63 PAD4 KWAD4 AN4 — VDDA PER1AD/PPS1AD Disabled
64 PAD12 KWAD12 AN12 — VDDA PER0AD/PPS0AD Disabled
65 PAD5 KWAD5 AN5 — VDDA PER1AD/PPS1AD Disabled
66 PAD13 KWAD13 AN13 AMPM0 VDDA PER0AD/PPS0AD Disabled
67 PAD6 KWAD6 AN6 — VDDA PER1AD/PPS1AD Disabled
68 PAD14 KWAD14 AN14 AMPP0 VDDA PER0AD/PPS0AD Disabled
69 PAD7 KWAD7 AN7 — VDDA PER1AD/PPS1AD Disabled
70 PAD15 KWAD15 AN15 DACU0 VDDA PER0AD/PPS0AD Disabled
71 PC4 — — — VDDA PUCR/PUPCE Disabled
72 PC5 AMPM1 — — VDDA PUCR/PUPCE Disabled
73 PC6 AMPP1 — — VDDA PUCR/PUPCE Disabled
74 PC7 DACU1 — — VDDA PUCR/PUPCE Disabled
75 VRH — — — — — —
76 VDDA — — — — — —
77 VSSA — — — — — —
78 PD0 — — — VDDX PUCR/PUPDE Disabled
79 PD1 — — — VDDX PUCR/PUPDE Disabled
80 PD2 — — — VDDX PUCR/PUPDE Disabled
81 PD3 — — — VDDX PUCR/PUPDE Disabled
82 PS0 RXD0 — — VDDX PERS/PPSS Up
83 PS1 TXD0 — — VDDX PERS/PPSS Up
84 PS2 RXD1 — — VDDX PERS/PPSS Up
85 PS3 TXD1 — — VDDX PERS/PPSS Up
Table 1-25. 100-Pin LQFP Pinout for S12GA192 and S12GA240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func. CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
110 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.9 System Clock Description
For the system clock description please refer to chapter Chapter 1, “Device Overview MC9S12G-Family”.
1.10 Modes of Operation
The MCU can operate in different modes. These are described in 1.10.1 Chip Configuration Summary.
The MCU can operate in different power modes to facilitate power saving when full system performance
is not required. These are described in 1.10.2 Low Power Operation.
Some modules feature a software programmable option to freeze the module status whilst the background
debug module is active to facilitate debugging.
1.10.1 Chip Configuration Summary
The different modes and the security state of the MCU affect the debug features (enabled or disabled).
86 PS4 MISO0 — — VDDX PERS/PPSS Up
87 PS5 MOSI0 — — VDDX PERS/PPSS Up
88 PS6 SCK0 — — VDDX PERS/PPSS Up
89 PS7 API_EXTCLK SS0 — VDDX PERS/PPSS Up
90 VSSX2 — — — — — —
91 VDDX2 — — — — — —
92 PM0 RXCAN — — VDDX PERM/PPSM Disabled
93 PM1 TXCAN — — VDDX PERM/PPSM Disabled
94 PD4 — — — VDDX PUCR/PUPDE Disabled
95 PD5 — — — VDDX PUCR/PUPDE Disabled
96 PD6 — — — VDDX PUCR/PUPDE Disabled
97 PD7 — — — VDDX PUCR/PUPDE Disabled
98 PM2 RXD2 — — VDDX PERM/PPSM Disabled
99 PM3 TXD2 — — VDDX PERM/PPSM Disabled
100 PJ7 KWJ7 SS2 — VDDX PERJ/PPSJ Up
1The regular I/O characteristics (see Section A.2, “I/O Characteristics”) apply if the EXTAL/XTAL function is disabled
Table 1-25. 100-Pin LQFP Pinout for S12GA192 and S12GA240
Function
<----lowest-----PRIORITY-----highest----> Power
Supply
Internal Pull
Resistor
Package Pin Pin 2nd
Func.
3rd
Func.
4th
Func. CTRL Reset
State
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 111
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The operating mode out of reset is determined by the state of the MODC signal during reset (see
Table 1-26). The MODC bit in the MODE register shows the current operating mode and provides limited
mode switching during operation. The state of the MODC signal is latched into this bit on the rising edge
of RESET.
1.10.1.1 Normal Single-Chip Mode
This mode is intended for normal device operation. The opcode from the on-chip memory is being
executed after reset (requires the reset vector to be programmed correctly). The processor program is
executed from internal memory.
1.10.1.2 Special Single-Chip Mode
This mode is used for debugging single-chip operation, boot-strapping, or security related operations. The
background debug module BDM is active in this mode. The CPU executes a monitor program located in
an on-chip ROM. BDM firmware waits for additional serial commands through the BKGD pin.
1.10.2 Low Power Operation
The MC9S12G has two static low-power modes Pseudo Stop and Stop Mode. For a detailed description
refer to S12CPMU section.
1.11 Security
The MCU security mechanism prevents unauthorized access to the Flash memory. Refer to Chapter 9,
“Security (S12XS9SECV2)”,Section 7.4.1, “Security”, and Section 26.5, “Security”.
1.12 Resets and Interrupts
Consult the S12 CPU manual and the S12SINT section for information on exception processing.
1.12.1 Resets
Table 1-27. lists all Reset sources and the vector locations. Resets are explained in detail in the Chapter 10,
“S12 Clock, Reset and Power Management Unit (S12CPMU)”.
Table 1-26. Chip Modes
Chip Modes MODC
Normal single chip 1
Special single chip 0
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
112 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 1-27. Reset Sources and Vector Locations
1.12.2 Interrupt Vectors
Table 1-28 lists all interrupt sources and vectors in the default order of priority. The interrupt module (see
Chapter 6, “Interrupt Module (S12SINTV1)”) provides an interrupt vector base register (IVBR) to relocate
the vectors.
Vector Address Reset Source CCR
Mask Local Enable
$FFFE Power-On Reset (POR) None None
$FFFE Low Voltage Reset (LVR) None None
$FFFE External pin RESET None None
$FFFE Illegal Address Reset None None
$FFFC Clock monitor reset None OSCE Bit in CPMUOSC register
$FFFA COP watchdog reset None CR[2:0] in CPMUCOP register
Table 1-28. Interrupt Vector Locations (Sheet 1 of 2)
Vector Address1Interrupt Source CCR
Mask Local Enable Wake up
from STOP
Wakeup
from WAIT
Vector base + $F8 Unimplemented instruction trap None None - -
Vector base+ $F6 SWI None None - -
Vector base+ $F4 XIRQ X Bit None Yes Yes
Vector base+ $F2 IRQ I bit IRQCR (IRQEN) Yes Yes
Vector base+ $F0 RTI time-out interrupt I bit CPMUINT (RTIE) 10.6 Interrupts
Vector base+ $EE TIM timer channel 0 I bit TIE (C0I) No Yes
Vector base + $EC TIM timer channel 1 I bit TIE (C1I) No Yes
Vector base+ $EA TIM timer channel 2 I bit TIE (C2I) No Yes
Vector base+ $E8 TIM timer channel 3 I bit TIE (C3I) No Yes
Vector base+ $E6 TIM timer channel 4 I bit TIE (C4I) No Yes
Vector base+ $E4 TIM timer channel 5 I bit TIE (C5I) No Yes
Vector base + $E2 TIM timer channel 6 I bit TIE (C6I) No Yes
Vector base+ $E0 TIM timer channel 7 I bit TIE (C7I) No Yes
Vector base+ $DE TIM timer overflow I bit TSCR2 (TOI) No Yes
Vector base+ $DC TIM Pulse accumulator A overflow2I bit PACTL (PAOVI) No Yes
Vector base + $DA TIM Pulse accumulator input edge3I bit PACTL (PAI) No Yes
Vector base + $D8 SPI0 I bit SPI0CR1 (SPIE, SPTIE) No Yes
Vector base+ $D6 SCI0 I bit SCI0CR2
(TIE, TCIE, RIE, ILIE)
Ye s Ye s
Vector base + $D4 SCI1 I bit SCI1CR2
(TIE, TCIE, RIE, ILIE)
Ye s Ye s
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 113
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Vector base + $D2 ADC I bit ATDCTL2 (ASCIE) No Yes
Vector base + $D0 Reserved
Vector base + $CE Port J I bit PIEJ (PIEJ7-PIEJ0) Yes Yes
Vector base + $CC ACMP I bit ACMPC (ACIE) No Yes
Vector base + $CA Reserved
Vector base + $C8 Oscillator status interrupt I bit CPMUINT (OSCIE) No Yes
Vector base + $C6 PLL lock interrupt I bit CPMUINT (LOCKIE) No Yes
Vector base + $C4 Reserved
Vector base + $C2 SCI2 I bit SCI2CR2
(TIE, TCIE, RIE, ILIE)
Ye s Ye s
Vector base + $C0 Reserved
Vector base + $BE SPI1 I bit SPI1CR1 (SPIE, SPTIE) No Yes
Vector base + $BC SPI2 I bit SPI2CR1 (SPIE, SPTIE) No Yes
Vector base + $BA FLASH error I bit FERCNFG (SFDIE, DFDIE) No No
Vector base + $B8 FLASH command I bit FCNFG (CCIE) No Yes
Vector base + $B6 CAN wake-up I bit CANRIER (WUPIE) Yes Yes
Vector base + $B4 CAN errors I bit CANRIER (CSCIE, OVRIE) No Yes
Vector base + $B2 CAN receive I bit CANRIER (RXFIE) No Yes
Vector base + $B0 CAN transmit I bit CANTIER (TXEIE[2:0]) No Yes
Vector base + $AE
to
Vector base + $90
Reserved
Vector base + $8E Port P interrupt I bit PIEP (PIEP7-PIEP0) Yes Yes
Vector base+ $8C Reserved
Vector base + $8A Low-voltage interrupt (LVI) I bit CPMUCTRL (LVIE) No Yes
Vector base + $88 Autonomous periodical interrupt
(API) I bit CPMUAPICTRL (APIE) Yes Yes
Vector base + $86 Reserved
Vector base + $84 ADC compare interrupt I bit ATDCTL2 (ACMPIE) No Yes
Vector base + $82 Port AD interrupt I bit PIE1AD(PIE1AD7-PIE1AD0)
PIE0AD(PIE0AD7-PIE0AD0)
Ye s Ye s
Vector base + $80 Spurious interrupt — None - -
116 bits vector address based
2Only available if the 8 channel timer module is instantiated on the device
3Only available if the 8 channel timer module is instantiated on the device
Table 1-28. Interrupt Vector Locations (Sheet 2 of 2)
Vector Address1Interrupt Source CCR
Mask Local Enable Wake up
from STOP
Wakeup
from WAIT
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
114 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.12.3 Effects of Reset
When a reset occurs, MCU registers and control bits are initialized. Refer to the respective block sections
for register reset states.
On each reset, the Flash module executes a reset sequence to load Flash configuration registers.
1.12.3.1 Flash Configuration Reset Sequence Phase
On each reset, the Flash module holds CPU activity while loading Flash module registers from the Flash
memory. If double faults are detected in the reset phase, Flash module protection and security may be
active on leaving reset. This is explained in more detail in the Flash module Section 26.1, “Introduction”.
1.12.3.2 Reset While Flash Command Active
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The
state of the word being programmed or the sector/block being erased is not guaranteed.
1.12.3.3 I/O Pins
Refer to the PIM section for reset configurations of all peripheral module ports.
1.12.3.4 RAM
The RAM arrays are not initialized out of reset.
1.13 COP Configuration
The COP time-out rate bits CR[2:0] and the WCOP bit in the CPMUCOP register at address 0x003C are
loaded from the Flash register FOPT. See Table 1-29 and Table 1-30 for coding. The FOPT register is
loaded from the Flash configuration field byte at global address 0x3_FF0E during the reset sequence.
Table 1-29. Initial COP Rate Configuration
NV[2:0] in
FOPT Register
CR[2:0] in
CPMUCOP Register
000 111
001 110
010 101
011 100
100 011
101 010
110 001
111 000
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 115
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.14 Autonomous Clock (ACLK) Configuration
The autonomous clock1(ACLK) is not factory trimmed. The reset value of the autonomous clock trimming
register2 (CPMUACLKTR) is 0xFC.
1.15 ADC External Trigger Input Connection
The ADC module includes external trigger inputs ETRIG0, ETRIG1, ETRIG2, and ETRIG3. The external
trigger allows the user to synchronize ADC conversion to external trigger events. Chapter 2, “Port
Integration Module (S12GPIMV0)” describes the connection of the external trigger inputs. Consult the
ADC section for information about the analog-to-digital converter module. References to freeze mode are
equivalent to active BDM mode.
1.16 ADC Special Conversion Channels
Whenever the ADC’s Special Channel Conversion Bit (SC) is set, it is capable of running conversion on a
number of internal channels (see Table 12-15). Table 1-31 lists the internal reference voltages which are
connected to these special conversion channels.
Table 1-30. Initial WCOP Configuration
NV[3] in
FOPT Register
WCOP in
CPMUCOP Register
10
01
1. See Chapter 10, “S12 Clock, Reset and Power Management Unit (S12CPMU)”
2. See Section 10.3.2.15, “Autonomous Clock Trimming Register (CPMUACLKTR)”
Table 1-31. Usage of ADC Special Conversion Channels
ADC Channel Usage
Internal_0 VDDF1
1See Section 1.17, “ADC Result Reference”.
Internal_1 unused
Internal_2 unused
Internal_3 unused
Internal_4 unused
Internal_5 unused
Internal_6
unused
Temperature sense of ADC
hardmacro2
2The ADC temperature sensor is only available on S12GA192 and
S12GA240 devices.
Internal_7 unused
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
116 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1.17 ADC Result Reference
MCUs of the S12G-Family are able to measure the internal reference voltage VDDF (see Table 1-31). VDDF
is a constant voltage with a narrow distribution over temperature and external voltage supply (see
Table A-30).
A 12-bit left justified1ADC conversion result of VDDF is provided at address 0x0_4022/0x0_4023 in the
NVM’s IFR for reference.The measurement conditions of the reference conversion are listed in
Section A.15, “ADC Conversion Result Reference”. By measuring the voltage VDDF (see Table 1-31) and
comparing the result to the reference value in the IFR, it is possible to determine the ADC’s reference
voltage VRH in the application environment:
The exact absolute value of an analog conversion can be determined as follows:
With:
ConvertedADInput: Result of the analog to digital conversion of the desired pin
ConvertedReference: Result of channel “Internal_0” conversion
StoredReference: Value in IFR locatio 0x0_4022/0x0_4023
n: ADC resolution (10 bit)
CAUTION
To assure high accuracy of the VDDF reference conversion, the NVMs must
not be programmed, erased, or read while the conversion takes place. This
implies that code must be executed from RAM. The “ConvertedReference”
value must be the average of eight consecutive conversions.
CAUTION
The ADC’s reference voltage VRH must remain at a constant level
throughout the conversion process.
1.18 ADC VRH/VRL Signal Connection
On all S12G devices except for the S12GA192 and the S12GA240 the external VRH signal is directly
connected to the ADC’s VRH signal input. The ADC’s VRL input is connected to VSSA. (see
Figure 1-21).
1. The format of the stored VDDF reference value is still subject to change.
VRH
StoredReference
ConvertedReference
-------------------------------------------------------------5V•=
Result ConvertedADInput StoredReference 5V•
ConvertedReference 2n
•
-------------------------------------------------------------------------
•=
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 117
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The S12GA192 and the S12GA240 contain a Reverence Voltage Attenuator (RVA) module. The
connection of the ADC’s VRH/VRL inputs on these devices is shown in Figure 1-21.
Figure 1-21. ADC VRH/VRL Signal Connection
ADC
VRH
VRL
VRH
VSSA
S12GN16, S12GN32, S12GN48, S12G48,
S12G64, S12G96, S12G128, S12G192, S12G240
ADCRVA
VRH
VRL
VRH_INT
VRL_INT
VSSA
VRHVRH
VSSA
S12GA192, S12G240
Device Overview MC9S12G-Family
MC9S12G Family Reference Manual, Rev.1.06
118 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 119
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 2
Port Integration Module (S12GPIMV0)
Revision History
2.1 Introduction
This section describes the S12G-family port integration module (PIM) in its configurations depending on
the family devices in their available package options.
It is split up into two parts, firstly determining the routing of the various signals to the available package
pins (“PIM Routing”) and secondly describing the general-purpose port related logic (“PIM Ports”).
2.1.1 Glossary
Table 2-1. Glossary Of Terms
2.1.2 Overview
The PIM establishes the interface between the peripheral modules and the I/O pins. It controls the
electrical pin properties as well as the signal prioritization and multiplexing on shared pins.
Rev. No.
(Item No.)
Date (Submitted
By)
Sections
Affected Substantial Change(s)
V00.51 13 Sep 2010 • Changed ADC routing behavior on port AD input buffers
V00.52 07 Oct 2010 • Internal updates
•
V00.53 13 Oct 2010 • Reworked interrupt section
•
Term Definition
Pin Package terminal with a unique number defined in the device pinout section
Signal Input or output line of a peripheral module or general-purpose I/O function arbitrating
for a dedicated pin
Port Group of general-purpose I/O pins sharing peripheral signals
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
120 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The family devices share same sets of package options (refer to device overview section) determining the
availability of pins and the related PIM memory maps. The corresponding devices are referenced
throughout this section by their group name as shown in Table 2-2.
2.1.3 Features
The PIM includes these distinctive registers:
• Data registers and data direction registers for ports A, B, C, D, E, T, S, M, P, J and AD when used
as general-purpose I/O
• Control registers to enable/disable pull devices and select pullups/pulldowns on ports T, S, M, P, J
and AD on per-pin basis
• Single control register to enable/disable pull devices on ports A, B, C, D and E, on per-port basis
and on BKGD pin
• Control registers to enable/disable open-drain (wired-or) mode on ports S and M
• Interrupt flag register for pin interrupts on ports P, J and AD
• Control register to configure IRQ pin operation
• Routing register to support programmable signal redirection in 20 TSSOP only
• Routing register to support programmable signal redirection in 100 LQFP package only
• Package code register preset by factory related to package in use, writable once after reset. Also
includes bit to reprogram routing of API_EXTCLK in all packages.
• Control register for free-running clock outputs
•
A standard port pin has the following minimum features:
• Input/output selection
• 3.15 V - 5 V digital and analog input
• Input with selectable pullup or pulldown device
Optional features supported on dedicated pins:
• Open drain for wired-or connections
• Key-wakeup feature: External pin interrupt with glitch filtering, which can also be used for wakeup
from stop mode.
Table 2-2. Device Groups
Group Devices with same set of package options
G1 S12G240, S12GA240, S12G192, S12GA192, S12G128, S12G96
G2 S12G64, S12G48, S12GN48
G3 S12GN32, S12GN16
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 121
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.1.4 Block Diagram
Figure 2-1. Block Diagram
2.2 PIM Routing - External Signal Description
This section lists and describes the signals that do connect off-chip.
Table 2-3 shows the availability of I/O port pins for each group in the largest offered package option.
Table 2-3. Port Pin Availability (in largest package) per Device
Port
Device Group
G1
(100 pin)
G2
(64 pin)
G3
(48 pin)
A 7-0 - -
B 7-0 - -
C 7-0 - -
D 7-0 - -
E 1-0 1-0 1-0
T 7-0 7-0 5-0
S 7-0 7-0 7-0
M 3-0 3-0 1-0
P 7-0 7-0 5-0
J 7-0 7-0 3-0
AD 15-0 15-0 11-0
Peripheral
Module
PIM
Ports
PIM
Routing
0
1
n
Pin #0
Package Code
Pin Routing (20 TSSOP only)
Pin #n
Pin Enable, Data
Pin Enable, Data
Data
Data
Control
Control
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
122 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.2.1 Package Code
The availability of pins and the related peripheral signals are determined by a package code
(Section 2.4.3.33, “Package Code Register (PKGCR)”). The related value is loaded from a factory
programmed non-volatile memory location into the register during the reset sequence.
Based on the package code all non-bonded pins will have the input buffer disabled to avoid shoot-through
current resulting in excess current in stop mode.
2.2.2 Prioritization
If more than one output signal is attempted to be enabled on a specific pin, a priority scheme determines
the signal taking effect.
General rules:
• The peripheral with the highest amount of pins has priority on the related pins when it is enabled.
• If a peripheral can selectively disable a function, the freed up pin is used with the next enabled
peripheral signal.
• The general-purpose output function takes control if no peripheral function is enabled.
Input signals are not prioritized. Therefore the input function remains active (for example timer input
capture) even if a pin is used with the output signal of another peripheral or general-purpose output.
2.2.3 Signals and Priorities
Table 2-4 shows all pins with their related signals per device and package that are controlled by the PIM.
A signal name in squared brackets denotes the port register bit related to the digital I/O function of the pin
(port register PORT/PT not listed). It is a representative for any other port related register bit with the same
index in PTI, DDR, PER, PPS, and where applicable in PIE, PIF or WOM (see Section 2.4, “PIM Ports -
Memory Map and Register Definition”). For example pin PAD15: Signal [PT0AD7] is bit 7 of register
PT0AD; other related register bits of this pin are PTI0AD7, DDR0AD7, PER0AD7, PPS0AD7, PIE0AD7
and PIF0AD7.
NOTE
If there is more than one signal associated with a pin, the priority is indicated
by the position in the table from top (highest priority) to bottom (lowest
priority).
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 123
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 2-4. Signals and Priorities
Port Pin Signal
Signals per Device and Package
(signal priority on pin from top to bottom)
Legend
■Signal available on pin
❍Routing option on pin
❏Routing reset location
Not available on pin
GA240 / GA192
G240 / G192
G128 / G96
GA240 / GA192
G240 / G192
G128 / G96
G64 / G48
GN48
GA240 / GA192
G240 / G192
G128 / G96
G64 / G48
GN48
GN32
GN16
G64 / G48
GN48
GN32
GN16
GN32
GN16
I/O Description
100 64 48 32 20
- BKGD MODC ■■■■■■■■■■■■■■■■■■■■■ I MODC input during
RESET
BKGD ■■■■■■■■■■■■■■■■■■■■■ I/O BDM communication
A PA7-PA0 [PA7:PA0] ■■■ I/O GPIO
B PB7-PB6 [PB7:PB6] ■■■ I/O GPIO
PB5 XIRQ ■■■ I Non-maskable
level-sensitive interrupt
[PB5] ■■■ I/O GPIO
PB4 IRQ ■■■ I Maskable level- or
falling-edge sensitive
interrupt
[PB4] ■■■ I/O GPIO
PB3 [PB3] ■■■ I/O GPIO
PB2 ECLKX2 ■■■ O Free-running clock
(ECLK x 2)
[PB2] ■■■ I/O GPIO
PB1 API_EXTCLK ❏❏❏ O API Clock
[PB1] ■■■ I/O GPIO
PB0 ECLK ■■■ O Free-running clock
[PB0] ■■■ I/O GPIO
C PC7 DACU1 ■O DAC1 output unbuffered
[PC7] ■■■ I/O GPIO
PC6 AMPP1 ■I DAC1 non-inv. input (+)
[PC6] ■■■ I/O GPIO
PC5 AMPM1 ■I DAC1 inverting input (-)
[PC5] ■■■ I/O GPIO
PC4-PC2 AN15-AN13 ❍ ❍ I ADC analog
[PC4:PC2] ■■■ I/O GPIO
PC1-PC0 AN11-AN10 ❍ ❍ I ADC analog
[PC1:PC0] ■■■ I/O GPIO
D PD7-PD0 [PD7:PD0] ■■■ I/O GPIO
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
124 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
E PE1 XTAL ■■■■■■■■■■■■■■■■■■■■■ - CPMU OSC signal
TXD0 ❏ ❏ I/O SCI transmit
IOC3 ❍ ❍ I/O Timer channel
PWM1 ■ ■ O PWM channel
ETRIG1 ■ ■ I ADC external trigger
[PE1] ■■■■■■■■■■■■■■■■■■■■■ I/O GPIO
PE0 EXTAL ■■■■■■■■■■■■■■■■■■■■■ - CPMU OSC signal
RXD0 ❏ ❏ I SCI receive
IOC2 ❍ ❍ I/O Timer channel
PWM0 ■ ■ O PWM channel
ETRIG0 ■ ■ I ADC external trigger
[PE0] ■■■■■■■■■■■■■■■■■■■■■ I/O GPIO
T PT7-PT6 IOC7-IOC6 ■■■■■■ I/O Timer channel
[PTT7:PTT6] ■■■■■■■■ I/O GPIO
PT5-PT4 IOC5-IOC4 ■■■■■■■■■■■■■■■ I/O Timer channel
[PTT5:PTT4] ■■■■■■■■■■■■■■■ I/O GPIO
PT3-PT2 IOC3-IOC2 ■■■■■■■■■■■■■■■■■■■ I/O Timer channel
[PTT3:PTT2] ■■■■■■■■■■■■■■■■■■■ I/O GPIO
PT1 IRQ ■■■■■■■■■■■■■■■■■■ I Maskable level- or
falling-edge sensitive
interrupt
IOC1 ■■■■■■■■■■■■■■■■■■■■■ I/O Timer channel
[PTT1] ■■■■■■■■■■■■■■■■■■■■■ I/O GPIO
PT0 XIRQ ■■■■■■■■■■■■■■■■■■ I Non-maskable
level-sensitive interrupt
IOC0 ■■■■■■■■■■■■■■■■■■■■■ I/O Timer channel
[PTT0] ■■■■■■■■■■■■■■■■■■■■■ I/O GPIO
Table 2-4. Signals and Priorities
Port Pin Signal
Signals per Device and Package
(signal priority on pin from top to bottom)
Legend
■Signal available on pin
❍Routing option on pin
❏Routing reset location
Not available on pin
GA240 / GA192
G240 / G192
G128 / G96
GA240 / GA192
G240 / G192
G128 / G96
G64 / G48
GN48
GA240 / GA192
G240 / G192
G128 / G96
G64 / G48
GN48
GN32
GN16
G64 / G48
GN48
GN32
GN16
GN32
GN16
I/O Description
100 64 48 32 20
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 125
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
S PS7 SS0 ■■■■■■■■■■■■■■■■■■■■■ I/O SPI slave select
TXD0 ❍ ❍ I/O SCI transmit
PWM5 ■■■■ O PWM channel
PWM3 ❏ ❏ O PWM channel
ECLK ■■■■■■■■■■■■■■■■■■ O Free-running clock
API_EXTCLK ❍❍❍❍❍❍❍❍❍❍❍❍❍❍❍❍❍❍❍❍❍ O API Clock
ETRIG3 ❏ ❏ I ADC external trigger
[PTS7] ■■■■■■■■■■■■■■■■■■■■■ I/O GPIO
PS6 SCK0 ■■■■■■■■■■■■■■■■■■■■■ I/O SPI serial clock
IOC5 ■■■■ I/O Timer channel
IOC3 ❏ ❏ I/O Timer channel
[PTS6] ■■■■■■■■■■■■■■■■■■■■■ I/O GPIO
PS5 MOSI0 ■■■■■■■■■■■■■■■■■■■■■ I/O SPI master out/slave in
IOC4 ■■■■ I/O Timer channel
IOC2 ❏ ❏ I/O Timer channel
[PTS5] ■■■■■■■■■■■■■■■■■■■■■ I/O GPIO
PS4 MISO0 ■■■■■■■■■■■■■■■■■■■■■ I/O SPI master in/slave out
RXD0 ❍ ❍ I SCI receive pin
PWM4 ■■■■ O PWM channel
PWM2 ❏ ❏ O PWM channel
ETRIG2 ❏ ❏ I ADC external trigger
[PTS4] ■■■■■■■■■■■■■■■■■■■■■ I/O GPIO
PS3 TXD1 ■■■■■■■■■■■■■ I/O SCI transmit
[PTS3] ■■■■■■■■■■■■■■■ I/O GPIO
PS2 RXD1 ■■■■■■■■■■■■■ I SCI receive
[PTS2] ■■■■■■■■■■■■■■■ I/O GPIO
PS1 TXD0 ■■■■■■■■■■■■■■■■■■■ I/O SCI transmit
[PTS1] ■■■■■■■■■■■■■■■■■■■ I/O GPIO
PS0 RXD0 ■■■■■■■■■■■■■■■■■■■ I SCI receive
[PTS0] ■■■■■■■■■■■■■■■■■■■ I/O GPIO
Table 2-4. Signals and Priorities
Port Pin Signal
Signals per Device and Package
(signal priority on pin from top to bottom)
Legend
■Signal available on pin
❍Routing option on pin
❏Routing reset location
Not available on pin
GA240 / GA192
G240 / G192
G128 / G96
GA240 / GA192
G240 / G192
G128 / G96
G64 / G48
GN48
GA240 / GA192
G240 / G192
G128 / G96
G64 / G48
GN48
GN32
GN16
G64 / G48
GN48
GN32
GN16
GN32
GN16
I/O Description
100 64 48 32 20
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
126 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
M PM3 TXD2 ■■■■■■ I/O SCI transmit
[PTM3] ■■■■■■■■ I/O GPIO
PM2 RXD2 ■■■■■■ I SCI receive
[PTM2] ■■■■■■■■ I/O GPIO
PM1 TXCAN ■■■■■■■ ■■■■ ■ O MSCAN transmit
TXD2 ■■■■■ I/O SCI transmit
TXD1 ■ ■ I/O SCI transmit
[PTM1] ■■■■■■■■■■■■■■■■■■■ I/O GPIO
PM0 RXCAN ■■■■■■■ ■■■■ ■ I MSCAN receive
RXD2 ■■■■■ I SCI receive
RXD1 ■ ■ I SCI receive
[PTM0] ■■■■■■■■■■■■■■■■■■■ I/O GPIO
Table 2-4. Signals and Priorities
Port Pin Signal
Signals per Device and Package
(signal priority on pin from top to bottom)
Legend
■Signal available on pin
❍Routing option on pin
❏Routing reset location
Not available on pin
GA240 / GA192
G240 / G192
G128 / G96
GA240 / GA192
G240 / G192
G128 / G96
G64 / G48
GN48
GA240 / GA192
G240 / G192
G128 / G96
G64 / G48
GN48
GN32
GN16
G64 / G48
GN48
GN32
GN16
GN32
GN16
I/O Description
100 64 48 32 20
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 127
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
P PP7-PP6 PWM7-PWM6 ■■■■■■ O PWM channel
[PTP7:PTP6]/
KWP7-KWP6
■■■■■■■■ I/O GPIO with interrupt
PP5-PP4 PWM5-PWM4 ■■■■■■■■■■■■■■■ O PWM channel
[PTP5:PTP4]/
KWP5-KWP4
■■■■■■■■■■■■■■■ I/O GPIO with interrupt
PP3-PP2 PWM3-PWM2 ■■■■■■■■■■■■■■■■■■■ O PWM channel
ETRIG3-
ETRIG2
■■■■■■■■■■■■■■■■■■■ I ADC external trigger
[PTP3:PTP2]/
KWP3-KWP2
■■■■■■■■■■■■■■■■■■■ I/O GPIO with interrupt
PP1 PWM1 ■■■■■■■■■■■■■■■■■■■ O PWM channel
ECLKX2 ■■■■■■■■■■■■■■■■ O Free-running clock
(ECLK x 2)
ETRIG1 ■■■■■■■■■■■■■■■■■■■ I ADC external trigger
[PTP1]/
KWP1
■■■■■■■■■■■■■■■■■■■ I/O GPIO with interrupt
PP0 PWM0 ■■■■■■■■■■■■■■■■■■■ O PWM channel
API_EXTCLK ❏❏❏❏❏❏❏❏❏❏❏❏❏❏❏❏ O API Clock
ETRIG0 ■■■■■■■■■■■■■■■■■■■ I ADC external trigger
[PTP0]/
KWP0
■■■■■■■■■■■■■■■■■■■ I/O GPIO with interrupt
Table 2-4. Signals and Priorities
Port Pin Signal
Signals per Device and Package
(signal priority on pin from top to bottom)
Legend
■Signal available on pin
❍Routing option on pin
❏Routing reset location
Not available on pin
GA240 / GA192
G240 / G192
G128 / G96
GA240 / GA192
G240 / G192
G128 / G96
G64 / G48
GN48
GA240 / GA192
G240 / G192
G128 / G96
G64 / G48
GN48
GN32
GN16
G64 / G48
GN48
GN32
GN16
GN32
GN16
I/O Description
100 64 48 32 20
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
128 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
J PJ7 SS2 ■■■■■■ I/O SPI slave select
[PTJ7]/
KWJ7
■■■■■■■■ I/O GPIO with interrupt
PJ6 SCK2 ■■■■■■ I/O SPI serial clock
[PTJ6]/
KWJ6
■■■■■■■■ I/O GPIO with interrupt
PJ5 MOSI2 ■■■■■■ I/O SPI master out/slave in
[PTJ5]/
KWJ5
■■■■■■■■ I/O GPIO with interrupt
PJ4 MISO2 ■■■■■■ I/O SPI master in/slave out
[PTJ4]/
KWJ4
■■■■■■■■ I/O GPIO with interrupt
PJ3 SS1 ■■■■■■■■■■■■■ I/O SPI slave select
PWM7 ■■■ O PWM channel
[PTJ3]/
KWJ3
■■■■■■■■■■■■■■■ I/O GPIO with interrupt
PJ2 SCK1 ■■■■■■■■■■■■■ I/O SPI serial clock
IOC7 ■■■ I/O Timer channel
[PTJ2]/
KWJ2
■■■■■■■■■■■■■■■ I/O GPIO with interrupt
PJ1 MOSI1 ■■■■■■■■■■■■■ I/O SPI master out/slave in
IOC6 ■■■ I/O Timer channel
[PTJ1]/
KWJ1
■■■■■■■■■■■■■■■ I/O GPIO with interrupt
PJ0 MISO1 ■■■■■■■■■■■■■ I/O SPI master in/slave out
PWM6 ■■■ I/O Timer channel
[PTJ0]/
KWJ0
■■■■■■■■■■■■■■■ I/O GPIO with interrupt
Table 2-4. Signals and Priorities
Port Pin Signal
Signals per Device and Package
(signal priority on pin from top to bottom)
Legend
■Signal available on pin
❍Routing option on pin
❏Routing reset location
Not available on pin
GA240 / GA192
G240 / G192
G128 / G96
GA240 / GA192
G240 / G192
G128 / G96
G64 / G48
GN48
GA240 / GA192
G240 / G192
G128 / G96
G64 / G48
GN48
GN32
GN16
G64 / G48
GN48
GN32
GN16
GN32
GN16
I/O Description
100 64 48 32 20
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 129
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
AD PAD15 DACU0 ■ ■ O DAC0 output unbuffered
AN15 ❏ ❏ ■ ■ I ADC analog
[PT0AD7]/
KWAD15
■■■■■■■■ I/O GPIO with interrupt
PAD14 AMPP0 ■ ■ I DAC0 non-inv. input (+)
AN14 ❏ ❏ ■ ■ I ADC analog
[PT0AD6]/
KWAD14
■■■■■■■■ I/O GPIO with interrupt
PAD13 AMPM0 ■ ■ I DAC0 inverting input (-)
AN13 ❏ ❏ ■ ■ I ADC analog
[PT0AD5]/
KWAD13
■■■■■■■■ I/O GPIO with interrupt
PAD12 AN12 ■ ■ ■ ■ I ADC analog
[PT0AD4]/
KWAD12
■■■■■■■■ I/O GPIO with interrupt
PAD11 AMP0 ■ ■ ■ O DAC0 output buffered
DACU0 ■O DAC0 output unbuffered
ACMPM ■■ ■■■■ I ACMP inverting input (-)
AN11 ❏❏■■■■■■■■■■■ I ADC analog
[PT0AD3]/
KWAD11
■■■■■■■■■■■■■■■ I/O GPIO with interrupt
PAD10 AMP1 ■ ■ ■ O DAC1 output buffered
DACU1 ■ ■ O DAC1 output unbuffered
ACMPP ■■ ■■■■ I ACMP non-inv. input (+)
AN10 ❏❏■■■■■■■■■■■ I ADC analog
[PT0AD2]/
KWAD10
■■■■■■■■■■■■■■■ I/O GPIO with interrupt
PAD9 ACMPO ■■ ■■■■ O ACMP unsync. dig. out
AN9 ■■■■■■■■■■■■■ I ADC analog
[PT0AD1]/
KWAD9
■■■■■■■■■■■■■■■ I/O GPIO with interrupt
PAD8 AN8 ■■■■■■■■■■■■■ I ADC analog
[PT0AD0]/
KWAD8
■■■■■■■■■■■■■■■ I/O GPIO with interrupt
Table 2-4. Signals and Priorities
Port Pin Signal
Signals per Device and Package
(signal priority on pin from top to bottom)
Legend
■Signal available on pin
❍Routing option on pin
❏Routing reset location
Not available on pin
GA240 / GA192
G240 / G192
G128 / G96
GA240 / GA192
G240 / G192
G128 / G96
G64 / G48
GN48
GA240 / GA192
G240 / G192
G128 / G96
G64 / G48
GN48
GN32
GN16
G64 / G48
GN48
GN32
GN16
GN32
GN16
I/O Description
100 64 48 32 20
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
130 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
AD PAD7 ACMPM ■■■■ I ACMP inverting input (-)
AN7 ■■■■■■■■■■■■■■■■■■■ I ADC analog
[PT1AD7]/
KWAD7
■■■■■■■■■■■■■■■■■■■ I/O GPIO with interrupt
PAD6 ACMPP ■■■■ I ACMP non-inv. input (+)
AN6 ■■■■■■■■■■■■■■■■■■■ I ADC analog
[PT1AD6]/
KWAD6
■■■■■■■■■■■■■■■■■■■ I/O GPIO with interrupt
PAD5 ACMPO ■■■■ O ACMP unsync. dig. out
ACMPM ■ ■ I ACMP inverting input (-)
AN5 ■■■■■■■■■■■■■■■■■■■■■ I ADC analog
TXD0 ❍ ❍ I/O SCI transmit
IOC3 ❍ ❍ I/O Timer channel
PWM3 ❍ ❍ O PWM channel
ETRIG3 ❍ ❍ I ADC external trigger
[PT1AD5]/
KWAD5
■■■■■■■■■■■■■■■■■■■■■ I/O GPIO with interrupt
PAD4 ACMPP ■ ■ I ACMP non-inv. input (+)
AN4 ■■■■■■■■■■■■■■■■■■■■■ I ADC analog
RXD0 ❍ ❍ I SCI receive
IOC2 ❍ ❍ I/O Timer channel
PWM2 ❍ ❍ O PWM channel
ETRIG2 ❍ ❍ I ADC external trigger
[PT1AD4]/
KWAD4
■■■■■■■■■■■■■■■■■■■■■ I/O GPIO with interrupt
PAD3 ACMPO ■ ■ O ACMP unsync. dig. out
AN3 ■■■■■■■■■■■■■■■■■■■■■ I ADC analog
[PT1AD3]/
KWAD3
■■■■■■■■■■■■■■■■■■■■■ I/O GPIO with interrupt
PAD2-PAD0 AN2-AN0 ■■■■■■■■■■■■■■■■■■■■■ I ADC analog
[PT1AD2:
PT1AD0]/
KWAD2-
KWAD0
■■■■■■■■■■■■■■■■■■■■■ I/O GPIO with interrupt
Table 2-4. Signals and Priorities
Port Pin Signal
Signals per Device and Package
(signal priority on pin from top to bottom)
Legend
■Signal available on pin
❍Routing option on pin
❏Routing reset location
Not available on pin
GA240 / GA192
G240 / G192
G128 / G96
GA240 / GA192
G240 / G192
G128 / G96
G64 / G48
GN48
GA240 / GA192
G240 / G192
G128 / G96
G64 / G48
GN48
GN32
GN16
G64 / G48
GN48
GN32
GN16
GN32
GN16
I/O Description
100 64 48 32 20
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 131
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.3 PIM Routing - Functional description
This section describes the signals available on each pin.
Although trying to enable multiple signals on a shared pin is not a proper use case in most applications,
the resulting pin function will be determined by a predefined priority scheme as defined in 2.2.2 and 2.2.3.
Only enabled signals arbitrate for the pin and the highest priority defines its data direction and output value
if used as output. Signals with programmable routing options are assumed to select the appropriate target
pin to participate in the arbitration.
The priority is represented for each pin with shared signals from highest to lowest in the following format:
SignalA > SignalB > GPO
Here SignalA has priority over SignalB and general-purpose output function (GPO; represented by related
port data register bit). The general-purpose output is always of lowest priority if no other signal is enabled.
Peripheral input signals on shared pins are always connected monitoring the pin level independent of their
use.
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
132 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.3.1 Pin BKGD
2.3.2 Pins PA7-0
2.3.3 Pins PB7-0
2.3.4 Pins PC7-0
NOTE
• When using AMPM1, AMPP1 or DACU1 please refer to section 2.6.1,
“Initialization”.
Table 2-5. Pin BKGD
BKGD • The BKGD pin is associated with the BDM module in all packages. During reset, the BKGD pin is used
as MODC input.
Table 2-6. Port A Pins PA7-0
PA7-PA0 • These pins feature general-purpose I/O functionality only.
Table 2-7. Port B Pins PB7-0
PB7-PB6 • These pins feature general-purpose I/O functionality only.
PB5 • 100 LQFP: The XIRQ signal is mapped to this pin when used with the XIRQ interrupt function. The
interrupt is enabled by clearing the X mask bit in the CPU Condition Code register. The I/O state of the
pin is forced to input level upon the first clearing of the X bit and held in this state even if the bit is set
again. A STOP or WAIT recovery with the X bit set (refer to CPU12/CPU12X Reference Manual) is not
available.
• Signal priority:
100 LQFP: XIRQ > GPO
PB4 • 100 LQFP: The IRQ signal is mapped to this pin when used with the IRQ interrupt function. If enabled
(IRQEN=1) the I/O state of the pin is forced to be an input.
• Signal priority:
100 LQFP: IRQ > GPO
PB3 • This pin features general-purpose I/O functionality only.
PB2 • 100 LQFP: The ECLKX2 signal is mapped to this pin when used with the external clock function. The
enabled ECLKX2 signal forces the I/O state to an output.
• Signal priority:
100 LQFP: ECLKX2 > GPO
PB1 • 100 LQFP: The API_EXTCLK signal is mapped to this pin when used with the external clock function.
If the Autonomous Periodic Interrupt clock is enabled and routed here the I/O state is forced to output.
• Signal priority:
100 LQFP: API_EXTCLK > GPO
PB0 • 100 LQFP: The ECLK signal is mapped to this pin when used with the external clock function. The
enabled ECLK signal forces the I/O state to an output.
• Signal priority:
100 LQFP: ECLK > GPO
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 133
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
• When routing of ADC channels to PC4-PC0 is selected
(PRR1[PRR1AN]=1) the related bit in the ADC Digital Input Enable
Register (ATDDIEN) must be set to 1 to activate the digital input
function on those pins not used as ADC inputs.
Table 2-8. Port C Pins PC7-0
PC7 • 100 LQFP: The unbuffered analog output signal DACU1 of the DAC1 module is mapped to this pin if
the DAC is operating in “unbuffered DAC” mode. If this pin is used with the DAC then the digital I/O
function and pull device are disabled.
• Signal priority:
100 LQFP: DACU1 > GPO
PC6 • 100 LQFP: The non-inverting analog input signal AMPP1 of the DAC1 module is mapped to this pin if
the DAC is operating in “unbuffered DAC with operational amplifier” or “operational amplifier only”
mode. If this pin is used with the DAC then the digital input buffer is disabled.
• Signal priority:
100 LQFP: GPO
PC5 • 100 LQFP: The inverting analog input signal AMPM1 of the DAC1 module is mapped to this pin if the
DAC is operating in “unbuffered DAC with operational amplifier” or “operational amplifier only” mode.
If this pin is used with the DAC then the digital input buffer is disabled.
• Signal priority:
100 LQFP: GPO
PC4-PC2 • 100 LQFP: If routing is active (PRR1[PRR1AN]=1) the ADC analog input channel signals AN15-13 and
their related digital trigger inputs are mapped to these pins. The routed ADC function has no effect on
the output state. The input buffers are controlled by the related ATDDIEN bits and the ADC trigger
functions.
• Signal priority:
100 LQFP: GPO
PC1-PC0 • 100 LQFP: If routing is active (PRR1[PRR1AN]=1) the ADC analog input channel signals AN11-10 and
their related digital trigger inputs are mapped to these pins. The routed ADC function has no effect on
the output state. The input buffers are controlled by the related ATDDIEN bits and the ADC trigger
functions.
• Signal priority:
100 LQFP: GPO
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
134 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.3.5 Pins PD7-0
2.3.6 Pins PE1-0
2.3.7 Pins PT7-0
Table 2-9. Port D Pins PD7-0
PD7-PD0 • These pins feature general-purpose I/O functionality only.
Table 2-10. Port E Pins PE1-0
PE1 • If the CPMU OSC function is active this pin is used as XTAL signal and the pulldown device is disabled.
• 20 TSSOP: The SCI0 TXD signal is mapped to this pin when used with the SCI function. If the SCI0
TXD signal is enabled and routed here the I/O state will depend on the SCI0 configuration.
• 20 TSSOP: The TIM channel 3 signal is mapped to this pin when used with the timer function. The TIM
forces the I/O state to be an output for a timer port associated with an enabled output compare.
• 20 TSSOP: The PWM channel 1 signal is mapped to this pin when used with the PWM function. The
enabled PWM channel forces the I/O state to be an output.
• 20 TSSOP: The ADC ETRIG1 signal is mapped to this pin when used with the ADC function. The
enabled external trigger function has no effect on the I/O state. Refer to Section 2.6.4, “ADC External
Triggers ETRIG3-0”.
• Signal priority:
20 TSSOP: XTAL > TXD0 > IOC3 > PWM1 > GPO
Others: XTAL > GPO
PE0 • If the CPMU OSC function is active this pin is used as EXTAL signal and the pulldown device is
disabled.
• 20 TSSOP: The SCI0 RXD signal is mapped to this pin when used with the SCI function. If the SCI0
RXD signal is enabled and routed here the I/O state will be forced to input.
• 20 TSSOP: The TIM channel 2 signal is mapped to this pin when used with the timer function. The TIM
forces the I/O state to be an output for a timer port associated with an enabled output compare.
• 20 TSSOP: The PWM channel 0 signal is mapped to this pin when used with the PWM function. The
enabled PWM channel forces the I/O state to be an output.
• 20 TSSOP: The ADC ETRIG0 signal is mapped to this pin when used with the ADC function. The
enabled external trigger function has no effect on the I/O state. Refer to Section 2.6.4, “ADC External
Triggers ETRIG3-0”.
• Signal priority:
20 TSSOP: EXTAL > RXD0 > IOC2 > PWM0 > GPO
Others: EXTAL > GPO
Table 2-11. Port T Pins PT7-0
PT7-PT6 • 64/100 LQFP: The TIM channels 7 and 6 signal are mapped to these pins when used with the timer
function. The TIM forces the I/O state to be an output for a timer port associated with an enabled output
compare.
• Signal priority:
64/100 LQFP: IOC7-6 > GPO
PT5 • 48/64/100 LQFP: The TIM channel 5 signal is mapped to this pin when used with the timer function.
The TIM forces the I/O state to be an output for a timer port associated with an enabled output
compare. If the ACMP timer link is enabled this pin is disconnected from the timer input so that it can
still be used as general-purpose I/O or as timer output. The use case for the ACMP timer link requires
the timer input capture function to be enabled.
• Signal priority:
48/64/100 LQFP: IOC5 > GPO
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 135
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
PT4 • 48/64/100 LQFP: The TIM channel 4 signal is mapped to this pin when used with the timer function.
The TIM forces the I/O state to be an output for a timer port associated with an enabled output
compare.
• Signal priority:
48/64/100 LQFP: IOC4 > GPO
PT3-PT2 • Except 20 TSSOP: The TIM channels 3 and 2 signal are mapped to these pins when used with the
timer function. The TIM forces the I/O state to be an output for a timer port associated with an enabled
output compare.
• Signal priority:
Except 20 TSSOP: IOC3-2 > GPO
PT1 • Except 100 LQFP: The IRQ signal is mapped to this pin when used with the IRQ interrupt function. If
enabled (IRQCR[IRQEN]=1) the I/O state of the pin is forced to be an input.
• The TIM channel 1 signal is mapped to this pin when used with the timer function. The TIM forces the
I/O state to be an output for a timer port associated with an enabled output compare.
• Signal priority:
100 LQFP: IOC1 > GPO
Others: IRQ > IOC1 > GPO
PT0 • Except 100 LQFP: The XIRQ signal is mapped to this pin when used with the XIRQ interrupt
function.The interrupt is enabled by clearing the X mask bit in the CPU Condition Code register. The
I/O state of the pin is forced to input level upon the first clearing of the X bit and held in this state even
if the bit is set again. A STOP or WAIT recovery with the X bit set (refer to CPU12/CPU12X Reference
Manual) is not available.
• The TIM channel 0 signal is mapped to this pin when used with the timer function. The TIM forces the
I/O state to be an output for a timer port associated with an enabled output compare.
• Signal priority:
100 LQFP: IOC0 > GPO
Others: XIRQ > IOC0 > GPO
Table 2-11. Port T Pins PT7-0 (continued)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
136 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.3.8 Pins PS7-0
Table 2-12. Port S Pins PS7-0
PS7 • The SPI0 SS signal is mapped to this pin when used with the SPI function. Depending on the
configuration of the enabled SPI0 the I/O state is forced to be input or output.
• 20 TSSOP: The SCI0 TXD signal is mapped to this pin when used with the SCI function. If the SCI0
TXD signal is enabled and routed here the I/O state will depend on the SCI0 configuration.
• 20 TSSOP: The PWM channel 3 signal is mapped to this pin when used with the PWM function. If the
PWM channel is enabled and routed here the I/O state is forced to output.The enabled PWM channel
forces the I/O state to be an output.
• 32 LQFP: The PWM channel 5 signal is mapped to this pin when used with the PWM function. The
enabled PWM channel forces the I/O state to be an output.
• 64/48/32/20 LQFP: The ECLK signal is mapped to this pin when used with the external clock function.
If the ECLK output is enabled the I/O state will be forced to output.
• The API_EXTCLK signal is mapped to this pin when used with the external clock function. If the
Autonomous Periodic Interrupt clock is enabled and routed here the I/O state is forced to output.
• 20 TSSOP: The ADC ETRIG3 signal is mapped to this pin if PWM channel 3 is routed here. The
enabled external trigger function has no effect on the I/O state. Refer to Section 2.6.4, “ADC External
Triggers ETRIG3-0”.
• Signal priority:
20 TSSOP: SS0 > TXD0 > PWM3 > ECLK > API_EXTCLK > GPO
32 LQFP: SS0 > PWM5 > ECLK > API_EXTCLK > GPO
48/64 LQFP: SS0 > ECLK > API_EXTCLK > GPO
100 LQFP: SS0 > API_EXTCLK > GPO
PS6 • The SPI0 SCK signal is mapped to this pin when used with the SPI function. Depending on the
configuration of the enabled SPI0 the I/O state is forced to be input or output.
• 20 TSSOP: The TIM channel 3 signal is mapped to this pin when used with the timer function. If the
TIM output compare signal is enabled and routed here the I/O state will be forced to output.
• 32 LQFP: The TIM channel 5 signal is mapped to this pin when used with the timer function. If the TIM
output compare signal is enabled and routed here the I/O state will be forced to output. If the ACMP
timer link is enabled this pin is disconnected from the timer input so that it can still be used as
general-purpose I/O or as timer output. The use case for the ACMP timer link requires the timer input
capture function to be enabled.
• Signal priority:
20 TSSOP: SCK0 > IOC3 > GPO
32 LQFP: SCK0 > IOC5 > GPO
Others: SCK0 > GPO
PS5 • The SPI0 MOSI signal is mapped to this pin when used with the SPI function. Depending on the
configuration of the enabled SPI0 the I/O state is forced to be input or output.
• 20 TSSOP: The TIM channel 2 signal is mapped to this pin when used with the timer function. If the
TIM output compare signal is enabled and routed here the I/O state will be forced to output.
• 32 LQFP: The TIM channel 4 signal is mapped to this pin when used with the timer function. If the TIM
output compare signal is enabled and routed here the I/O state will be forced to output.
• Signal priority:
20 TSSOP: MOSI0 > IOC2 > GPO
32 LQFP: MOSI0 > IOC4 > GPO
Others: MOSI0 > GPO
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 137
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
PS4 • The SPI0 MISO signal is mapped to this pin when used with the SPI function. Depending on the
configuration of the enabled SPI0 the I/O state is forced to be input or output.
• 20 TSSOP: The SCI0 RXD signal is mapped to this pin when used with the SCI function. If the SCI0
RXD signal is enabled and routed here the I/O state will be forced to input.
• 20 TSSOP: The PWM channel 2 signal is mapped to this pin when used with the PWM function. If the
PWM channel is enabled and routed here the I/O state is forced to output.
• 32 LQFP: The PWM channel 4 signal is mapped to this pin when used with the PWM function. The
enabled PWM channel forces the I/O state to be an output.
• 20 TSSOP: The ADC ETRIG2 signal is mapped to this pin if PWM channel 2 is routed here. The
enabled external trigger function has no effect on the I/O state. Refer to Section 2.6.4, “ADC External
Triggers ETRIG3-0”.
• Signal priority:
20 TSSOP: MISO0 > RXD0 > PWM2 > GPO
32 LQFP: MISO0 > PWM4 > GPO
Others: MISO0 > GPO
PS3 • Except 20 TSSOP and 32 LQFP: The SCI1 TXD signal is mapped to this pin when used with the SCI
function. If the SCI1 TXD signal is enabled the I/O state will depend on the SCI1 configuration.
• Signal priority:
48/64/100 LQFP: TXD1 > GPO
PS2 • Except 20 TSSOP and 32 LQFP: The SCI1 RXD signal is mapped to this pin when used with the SCI
function. If the SCI1 RXD signal is enabled the I/O state will be forced to be input.
• Signal priority:
20 TSSOP and 32 LQFP: GPO
Others: RXD1 > GPO
PS1 • Except 20 TSSOP: The SCI0 TXD signal is mapped to this pin when used with the SCI function. If the
SCI0 TXD signal is enabled the I/O state will depend on the SCI0 configuration.
• Signal priority:
Except 20 TSSOP: TXD0 > GPO
PS0 • Except 20 TSSOP: The SCI0 RXD signal is mapped to this pin when used with the SCI function. If the
SCI0 RXD signal is enabled the I/O state will be forced to be input.
• Signal priority:
20 TSSOP: GPO
Others: RXD0 > GPO
Table 2-12. Port S Pins PS7-0 (continued)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
138 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.3.9 Pins PM3-0
2.3.10 Pins PP7-0
Table 2-13. Port M Pins PM3-0
PM3 • 64/100 LQFP: The SCI2 TXD signal is mapped to this pin when used with the SCI function. If the SCI2
TXD signal is enabled the I/O state will depend on the SCI2 configuration.
• Signal priority:
64/100 LQFP: TXD2 > GPO
PM2 • 64/100 LQFP: The SCI2 RXD signal is mapped to this pin when used with the SCI function. If the SCI2
RXD signal is enabled the I/O state will be forced to be input.
• Signal priority:
64/100 LQFP: RXD2 > GPO
PM1 • Except 20 TSSOP: The TXCAN signal is mapped to this pin when used with the CAN function. The
enabled CAN forces the I/O state to be an output.
• 32 LQFP: The SCI1 TXD signal is mapped to this pin when used with the SCI function. If the SCI1 TXD
signal is enabled the I/O state will depend on the SCI1 configuration.
• 48 LQFP: The SCI2 TXD signal is mapped to this pin when used with the SCI function. If the SCI2 TXD
signal is enabled the I/O state will depend on the SCI2 configuration.
• Signal priority:
32 LQFP: TXCAN > TXD1 > GPO
48 LQFP: TXCAN > TXD2 > GPO
64/100 LQFP: TXCAN > GPO
PM0 • Except 20 TSSOP: The RXCAN signal is mapped to this pin when used with the CAN function. The
enabled CAN forces the I/O state to be an input. If CAN is active the selection of a pulldown device on
the RXCAN input has no effect.
• 32 LQFP: The SCI1 RXD signal is mapped to this pin when used with the SCI function. The enabled
SCI1 RXD signal forces the I/O state to an input.
• 48 LQFP: The SCI2 RXD signal is mapped to this pin when used with the SCI function. The enabled
SCI2 RXD signal forces the I/O state to an input.
• Signal priority:
32 LQFP: RXCAN > RXD1 > GPO
48 LQFP: RXCAN > RXD2 > GPO
64/100 LQFP: RXCAN > GPO
Table 2-14. Port P Pins PP7-0
PP7-PP6 • 64/100 LQFP: The PWM channels 7 and 6 signal are mapped to these pins when used with the PWM
function. The enabled PWM channel forces the I/O state to be an output.
• 64/100 LQFP: Pin interrupts can be generated if enabled in input or output mode.
• Signal priority:
64/100 LQFP: PWM > GPO
PP5-PP4 • 48/64/100 LQFP: The PWM channels 5 and 4 signal are mapped to these pins when used with the
PWM function. The enabled PWM channel forces the I/O state to be an output.
• 48/64/100 LQFP: Pin interrupts can be generated if enabled in input or output mode.
• Signal priority:
48/64/100 LQFP: PWM > GPO
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 139
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
PP3-PP2 • Except 20 TSSOP: The PWM channels 3 and 2 signal are mapped to these pins when used with the
PWM function. The enabled PWM channel forces the I/O state to be an output.
• Except 20 TSSOP: The ADC ETRIG 3 and 2 signal are mapped to these pins when used with the ADC
function. The enabled external trigger function has no effect on the I/O state. Refer to Section 2.6.4,
“ADC External Triggers ETRIG3-0”.
• Except 20 TSSOP: Pin interrupts can be generated if enabled in input or output mode.
• Signal priority:
Except 20 TSSOP: PWM > GPO
PP1 • Except 20 TSSOP: The PWM channel 1 signal is mapped to this pin when used with the PWM function.
The enabled PWM channel forces the I/O state to be an output.
• Except 100 LQFP and 20 TSSOP: The ECLKX2 signal is mapped to this pin when used with the
external clock function. The enabled ECLKX2 forces the I/O state to an output.
• Except 20 TSSOP: The ADC ETRIG1 signal is mapped to this pin when used with the ADC function.
The enabled external trigger function has no effect on the I/O state. Refer to Section 2.6.4, “ADC
External Triggers ETRIG3-0”.
• Except 20 TSSOP: Pin interrupts can be generated if enabled in input or output mode.
• Signal priority:
Except 100 LQFP and 20 TSSOP: PWM1 > ECLKX2 > GPO
100 LQFP: PWM1 > GPO
PP0 • Except 20 TSSOP: The PWM channel 0 signal is mapped to this pin when used with the PWM function.
The enabled PWM channel forces the I/O state to be an output.
• Except 100 LQFP and 20 TSSOP: The API_EXTCLK signal is mapped to this pin when used with the
external clock function. If the Autonomous Periodic Interrupt clock is enabled and routed here the I/O
state is forced to output.
• Except 20 TSSOP: The ADC ETRIG0 signal is mapped to this pin when used with the ADC function.
The enabled external trigger function has no effect on the I/O state. Refer to Section 2.6.4, “ADC
External Triggers ETRIG3-0”.
• Except 20 TSSOP: Pin interrupts can be generated if enabled in input or output mode.
• Signal priority:
Except 100 LQFP and 20 TSSOP: PWM0 > API_EXTCLK > GPO
100 LQFP: PWM0 > GPO
Table 2-14. Port P Pins PP7-0 (continued)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
140 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.3.11 Pins PJ7-0
Table 2-15. Port J Pins PJ7-0
PJ7 • 64/100 LQFP: The SPI2 SS signal is mapped to this pin when used with the SPI function. Depending
on the configuration of the enabled SPI2 the I/O state is forced to be input or output.
• 64/100 LQFP: Pin interrupts can be generated if enabled in input or output mode.
• Signal priority:
64/100 LQFP: SS2 > GPO
PJ6 • 64/100 LQFP: The SPI2 SCK signal is mapped to this pin when used with the SPI function. Depending
on the configuration of the enabled SPI2 the I/O state is forced to be input or output.
• 64/100 LQFP: Pin interrupts can be generated if enabled in input or output mode.
• Signal priority:
64/100 LQFP: SCK2 > GPO
PJ5 • 64/100 LQFP: The SPI2 MOSI signal is mapped to this pin when used with the SPI function.
Depending on the configuration of the enabled SPI2 the I/O state is forced to be input or output.
• 64/100 LQFP: Pin interrupts can be generated if enabled in input or output mode.
• Signal priority:
64/100 LQFP: MOSI2 > GPO
PJ4 • 64/100 LQFP: The SPI2 MISO signal is mapped to this pin when used with the SPI function.Depending
on the configuration of the enabled SPI2 the I/O state is forced to be input or output.
• 64/100 LQFP: Pin interrupts can be generated if enabled in input or output mode.
• Signal priority:
64/100 LQFP: MISO2 > GPO
PJ3 • Except 20 TSSOP and 32 LQFP: The SPI1 SS signal is mapped to this pin when used with the SPI
function. Depending on the configuration of the enabled SPI1 the I/O state is forced to be input or
output.
• 48 LQFP: The PWM channel 7 signal is mapped to this pin when used with the PWM function. The
enabled PWM channel forces the I/O state to be an output.
• Except 20 TSSOP and 32 LQFP: Pin interrupts can be generated if enabled in input or output mode.
• Signal priority:
48 LQFP: SS1 > PWM7 > GPO
64/100 LQFP: SS1 > GPO
PJ2 • Except 20 TSSOP and 32 LQFP: The SPI1 SCK signal is mapped to this pin when used with the SPI
function. Depending on the configuration of the enabled SPI1 the I/O state is forced to be input or
output.
• 48 LQFP: The TIM channel 7 signal is mapped to this pin when used with the TIM function. The TIM
forces the I/O state to be an output for a timer port associated with an enabled output.
• Except 20 TSSOP and 32 LQFP: Pin interrupts can be generated if enabled in input or output mode.
• Signal priority:
48 LQFP: SCK1 > IOC7 > GPO
64/100 LQFP: SCK1 > GPO
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 141
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.3.12 Pins AD15-0
NOTE
To activate the digital input function the related bit in the ADC Digital Input
Enable Register (ATDDIEN) must be set to 1. If the ADC is routed to port
C the input buffers are automatically enabled on the freed up port AD pins.
Additionally on pins shared with ACMPM and ACMPP the ACDIEN bit
must be set to 1 in the ACMP Control Register (ACMPC).
PJ1 • Except 20 TSSOP and 32 LQFP: The SPI1 MOSI signal is mapped to this pin when used with the SPI
function. Depending on the configuration of the enabled SPI1 the I/O state is forced to be input or
output.
• 48 LQFP: The TIM channel 6 signal is mapped to this pin when used with the timer function. The TIM
forces the I/O state to be an output for a timer port associated with an enabled output.
• Except 20 TSSOP and 32 LQFP: Pin interrupts can be generated if enabled in input or output mode.
• Signal priority:
48 LQFP: MOSI1 > IOC6 > GPO
64/100 LQFP: MOSI1 > GPO
PJ0 • Except 20 TSSOP and 32 LQFP: The SPI1 MISO signal is mapped to this pin when used with the SPI
function. Depending on the configuration of the enabled SPI1 the I/O state is forced to be input or
output.
• 48 LQFP: The PWM channel 6 signal is mapped to this pin when used with the PWM function. The
enabled PWM channel forces the I/O state to be an output.
• Except 20 TSSOP and 32 LQFP: Pin interrupts can be generated if enabled in input or output mode.
• Signal priority:
48 LQFP: MISO1 > PWM6 > GPO
64/100 LQFP: MISO1 > GPO
Table 2-16. Port AD Pins AD15-8
PAD15 • 64/100 LQFP: The unbuffered analog output signal DACU0 of the DAC0 module is mapped to this pin
if the DAC is operating in “unbuffered DAC” mode. If this pin is used with the DAC then the digital I/O
function and pull device are disabled.
• 64/100 LQFP: If routing is inactive (PRR1[PRR1AN]=0) the ADC analog input channel signal AN15
and the related digital trigger input are mapped to this pin. The ADC function has no effect on the
output state. The input buffer is controlled by the related ATDDIEN bit and the ADC trigger function.
• 64/100 LQFP: Pin interrupts can be generated if enabled in digital input or output mode.
• Signal priority:
64/100 LQFP: DACU0 > GPO
PAD14 • 64/100 LQFP: The non-inverting analog input signal AMPP0 of the DAC0 module is mapped to this pin
if the DAC is operating in “unbuffered DAC with operational amplifier” or “operational amplifier only”
mode. If this pin is used with the DAC then the digital input buffer is disabled.
• 64/100 LQFP: If routing is inactive (PRR1[PRR1AN]=0) the ADC analog input channel signal AN14
and the related digital trigger input are mapped to this pin. The ADC function has no effect on the
output state. The input buffer is controlled by the related ATDDIEN bit and the ADC trigger function.
• 64/100 LQFP: Pin interrupts can be generated if enabled in digital input or output mode.
• Signal priority:
64/100 LQFP: GPO
Table 2-15. Port J Pins PJ7-0 (continued)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
142 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
PAD13 • 64/100 LQFP: The inverting analog input signal AMPM0 of the DAC0 module is mapped to this pin if
the DAC is operating in “unbuffered DAC with operational amplifier” or “operational amplifier only”
mode. If this pin is used with the DAC then the digital input buffer is disabled.
• 64/100 LQFP: If routing is inactive (PRR1[PRR1AN]=0) the ADC analog input channel signal AN13
and the related digital trigger input are mapped to this pin. The ADC function has no effect on the
output state. The input buffer is controlled by the related ATDDIEN bit and the ADC trigger function.
• 64/100 LQFP: Pin interrupts can be generated if enabled in digital input or output mode.
• Signal priority:
64/100 LQFP: GPO
PAD12 • 64/100 LQFP: The ADC analog input channel signal AN12 and the related digital trigger input are
mapped to this pin. The ADC function has no effect on the output state. The input buffer is controlled
by the related ATDDIEN bit and the ADC trigger function.
• 64/100 LQFP: Pin interrupts can be generated if enabled in digital input or output mode.
• Signal priority:
64/100 LQFP: GPO
PAD11 • 48/64/100 LQFP: The buffered analog output signal AMP0 of the DAC0 module is mapped to this pin
if the DAC is operating in “buffered DAC”, “unbuffered DAC with operational amplifier” or “operational
amplifier only” mode. If this pin is used with the DAC then the digital I/O function and pull device are
disabled.
• 48 LQFP: The unbuffered analog output signal DACU0 of the DAC0 module is mapped to this pin if the
DAC is operating in “unbuffered DAC” mode. If this pin is used with the DAC then the digital output
function and pull device are disabled.
• 48/64 LQFP: The inverting input signal ACMPM of the analog comparator is mapped to this pin when
used with the ACMP function. The ACMP function has no effect on the output state. The input buffer
is controlled by the ACDIEN bit .
• 48/64/100 LQFP: If routing is inactive (PRR1[PRR1AN]=0) the ADC analog input channel signal AN11
and the related digital trigger input are mapped to this pin. The ADC function has no effect on the
output state. The input buffer is controlled by the related ATDDIEN bit and the ADC trigger function.
• 48/64/100 LQFP: Pin interrupts can be generated if enabled in digital input or output mode.
• Signal priority:
48 LQFP: AMP0 | DACU0 > GPO
64/100 LQFP: AMP0 > GPO
PAD10 • 48/64 LQFP: The buffered analog output signal AMP1 of the DAC1 module is mapped to this pin if the
DAC is operating in “buffered DAC” mode. If this pin is used with the DAC then the digital output
function and pull device are disabled.
• 100 LQFP: The buffered analog output signal AMP1 of the DAC1 module is mapped to this pin if the
DAC is operating in “buffered DAC”, “unbuffered DAC with operational amplifier” or “operational
amplifier only” mode. If this pin is used with the DAC then the digital I/O function and pull device are
disabled.
• 48/64 LQFP: The unbuffered analog output signal DACU1 of the DAC1 module is mapped to this pin
if the DAC is operating in “unbuffered DAC” mode. If this pin is used with the DAC then the digital output
function and pull device are disabled.
• 48/64 LQFP: The non-inverting input signal ACMPP of the analog comparator is mapped to this pin
when used with the ACMP function. The ACMP function has no effect on the output state. The input
buffer is controlled by the ACDIEN bit .
• 48/64/100 LQFP: If routing is inactive (PRR1[PRR1AN]=0) the ADC analog input channel signal AN10
and the related digital trigger input are mapped to this pin. The ADC function has no effect on the
output state. The input buffer is controlled by the related ATDDIEN bit and the ADC trigger function.
• 48/64/100 LQFP: Pin interrupts can be generated if enabled in digital input or output mode.
• Signal priority:
48/64 LQFP: AMP1 | DACU1 > GPO
100 LQFP: AMP1 > GPO
Table 2-16. Port AD Pins AD15-8
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 143
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
PAD9 • 48/64 LQFP: The ACMPO signal of the analog comparator is mapped to this pin when used with the
ACMP function. If the ACMP output is enabled (ACMPC[ACOPE]=1) the I/O state will be forced to
output.
• 48/64/100 LQFP: The ADC analog input channel signal AN9 and the related digital trigger input are
mapped to this pin. The ADC function has no effect on the output state. The input buffer is controlled
by the related ATDDIEN bit and the ADC trigger function.
• 48/64/100 LQFP: Pin interrupts can be generated if enabled in digital input or output mode.
• Signal priority:
48 LQFP: ACMPO > GPO
64/100 LQFP: GPO
PAD8 • 48/64/100 LQFP: The ADC analog input channel signal AN8 and the related digital trigger input are
mapped to this pin. The ADC function has no effect on the output state. The input buffer is controlled
by the related ATDDIEN bit and the ADC trigger function.
• 48/64/100 LQFP: Pin interrupts can be generated if enabled in digital input or output mode.
• Signal priority:
48/64/100 LQFP: GPO
Table 2-17. Port AD Pins AD7-0
PAD7 • 32 LQFP: The inverting input signal ACMPM of the analog comparator is mapped to this pin when used
with the ACMP function. The ACMP function has no effect on the output state. The input buffer is
controlled by the ACDIEN bit .
• Except 20 TSSOP: The ADC analog input channel signal AN7 and the related digital trigger input are
mapped to this pin. The ADC function has no effect on the output state. The input buffer is controlled
by the related ATDDIEN bit and the ADC trigger function.
• Except 20 TSSOP: Pin interrupts can be generated if enabled in digital input or output mode.
• Signal priority:
Except 20 TSSOP: GPO
PAD6 • 32 LQFP: The non-inverting input signal ACMPP of the analog comparator is mapped to this pin when
used with the ACMP function. The ACMP function has no effect on the output state. The input buffer
is controlled by the ACDIEN bit .
• Except 20 TSSOP: The ADC analog input channel signal AN6 and the related digital trigger input are
mapped to this pin. The ADC function has no effect on the output state. The input buffer is controlled
by the related ATDDIEN bit and the ADC trigger function.
• Except 20 TSSOP: Pin interrupts can be generated if enabled in digital input or output mode.
• Signal priority:
Except 20 TSSOP: GPO
Table 2-16. Port AD Pins AD15-8
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
144 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
PAD5 • 32 LQFP: The ACMPO signal of the analog comparator is mapped to this pin when used with the
ACMP function. If the ACMP output is enabled (ACMPC[ACOPE]=1) the I/O state will be forced to
output.
• 20 TSSOP: The inverting input signal ACMPM of the analog comparator is mapped to this pin when
used with the ACMP function. The ACMP function has no effect on the output state. The input buffer
is controlled by the ACDIEN bit.
• The ADC analog input channel signal AN5 and the related digital trigger input are mapped to this pin.
The ADC function has no effect on the output state. The input buffer is controlled by the related
ATDDIEN bit and the ADC trigger function.
• 20 TSSOP: The SCI0 TXD signal is mapped to this pin. If the SCI0 TXD signal is enabled the I/O state
will depend on the SCI0 configuration.
• 20 TSSOP: The TIM channel 3 signal is mapped to this pin. The TIM forces the I/O state to be an output
for a timer port associated with an enabled output compare.
• 20 TSSOP: The PWM channel 3 signal is mapped to this pin. If the PWM channel is enabled and
routed here the I/O state is forced to output.
• 20 TSSOP: The ADC ETRIG3 signal is mapped to this pin if PWM channel 3 is routed here. The
enabled external trigger function has no effect on the I/O state. Refer to Section 2.6.4, “ADC External
Triggers ETRIG3-0”.
• Pin interrupts can be generated if enabled in digital input or output mode.
• Signal priority:
32 LQFP: ACMPO > GPO
20 TSSOP: TXD0 > IOC3 > PWM3 > GPO
Others: GPO
PAD4 • 20 TSSOP: The non-inverting input signal ACMPP of the analog comparator is mapped to this pin
when used with the ACMP function. The ACMP function has no effect on the output state. The input
buffer is controlled by the ACDIEN bit.
• The ADC analog input channel signal AN4 and the related digital trigger input are mapped to this pin.
The ADC function has no effect on the output state. The input buffer is controlled by the related
ATDDIEN bit and the ADC trigger function.
• 20 TSSOP: The SCI0 RXD signal is mapped to this pin. If the SCI0 RXD signal is enabled and routed
here the I/O state will be forced to input.
• 20 TSSOP: The TIM channel 2 signal is mapped to this pin. The TIM forces the I/O state to be an output
for a timer port associated with an enabled output compare.
• 20 TSSOP: The PWM channel 2 signal is mapped to this pin. If the PWM channel is enabled and
routed here the I/O state is forced to output.
• 20 TSSOP: The ADC ETRIG2 signal is mapped to this pin if PWM channel 2 is routed here. The
enabled external trigger function has no effect on the I/O state. Refer to Section 2.6.4, “ADC External
Triggers ETRIG3-0”.
• Pin interrupts can be generated if enabled in digital input or output mode.
• Signal priority:
20 TSSOP: RXD0 > IOC2 > PWM2 > GPO
Others: GPO
Table 2-17. Port AD Pins AD7-0 (continued)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 145
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4 PIM Ports - Memory Map and Register Definition
This section provides a detailed description of all PIM registers.
2.4.1 Memory Map
Table 2-18 shows the memory maps of all groups (for definitions see Table 2-2). Addresses 0x0000 to
0x0007 are only implemented in group G1 otherwise reserved.
PAD3 • 20 TSSOP: The ACMPO signal of the analog comparator is mapped to this pin when used with the
ACMP function. If the ACMP output is enabled (ACMPC[ACOPE]=1) the I/O state will be forced to
output.
• The ADC analog input channel signal AN3 and the related digital trigger input are mapped to this pin.
The ADC function has no effect on the output state. The input buffer is controlled by the related
ATDDIEN bit and the ADC trigger function.
• Pin interrupts can be generated if enabled in digital input or output mode.
• Signal priority:
20 TSSOP: ACMPO > GPO
Others: GPO
PAD2-PAD0 • The ADC analog input channel signals AN2-0 and their related digital trigger inputs are mapped to this
pin. The ADC function has no effect on the output state. The input buffers are controlled by the related
ATDDIEN bits and the ADC trigger functions.
• Pin interrupts can be generated if enabled in digital input or output mode.
• Signal priority:
GPO
Table 2-18. Block Memory Map (0x0000-0x027F)
Port Global
Address Register Access Reset Value Section/Page
(A)
(B)
0x0000 PORTA—Port A Data Register1R/W 0x00 2.4.3.1/2-164
0x0001 PORTB—Port B Data Register1R/W 0x00 2.4.3.2/2-165
0x0002 DDRA—Port A Data Direction Register1R/W 0x00 2.4.3.3/2-166
0x0003 DDRB—Port B Data Direction Register1R/W 0x00 2.4.3.4/2-166
(C)
(D)
0x0004 PORTC—Port C Data Register1R/W 0x00 2.4.3.5/2-167
0x0005 PORTD—Port D Data Register1R/W 0x00 2.4.3.6/2-168
0x0006 DDRC—Port C Data Direction Register1R/W 0x00 2.4.3.7/2-168
0x0007 DDRD—Port D Data Direction Register1R/W 0x00 2.4.3.8/2-169
E 0x0008 PORTE—Port E Data Register R/W 0x00
0x0009 DDRE—Port E Data Direction Register R/W 0x00
0x000A
:
0x000B
Non-PIM address range2- - -
Table 2-17. Port AD Pins AD7-0 (continued)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
146 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
(A)
(B)
(C)
(D)
E
0x000C PUCR—Pull Control Register R/W 0x50 2.4.3.11/2-171
0x000D Reserved R 0x00
0x000E
:
0x001B
Non-PIM address range2- - -
0x001C ECLKCTL—ECLK Control Register R/W 0xC0 2.4.3.12/2-173
0x001D Reserved R 0x00
0x001E IRQCR—IRQ Control Register R/W 0x00 2.4.3.13/2-173
0x001F Reserved R 0x00
0x0020
:
0x023F
Non-PIM address range2- - -
T 0x0240 PTT—Port T Data Register R/W 0x00 2.4.3.15/2-175
0x0241 PTIT—Port T Input Register R 32.4.3.16/2-175
0x0242 DDRT—Port T Data Direction Register R/W 0x00 2.4.3.17/2-176
0x0243 Reserved R 0x00
0x0244 PERT—Port T Pull Device Enable Register R/W 0x00 2.4.3.18/2-177
0x0245 PPST—Port T Polarity Select Register R/W 0x00 2.4.3.19/2-178
0x0246 Reserved R 0x00
0x0247 Reserved R 0x00
S 0x0248 PTS—Port S Data Register R/W 0x00 2.4.3.20/2-178
0x0249 PTIS—Port S Input Register R 32.4.3.21/2-179
0x024A DDRS—Port S Data Direction Register R/W 0x00 2.4.3.22/2-179
0x024B Reserved R 0x00
0x024C PERS—Port S Pull Device Enable Register R/W 0xFF 2.4.3.23/2-180
0x024D PPSS—Port S Polarity Select Register R/W 0x00 2.4.3.24/2-180
0x024E WOMS—Port S Wired-Or Mode Register R/W 0x00 2.4.3.25/2-181
0x024F PRR0—Pin Routing Register 04R/W 0x00 2.4.3.26/2-181
Table 2-18. Block Memory Map (0x0000-0x027F) (continued)
Port Global
Address Register Access Reset Value Section/Page
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 147
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
M 0x0250 PTM—Port M Data Register R/W 0x00 2.4.3.27/2-183
0x0251 PTIM—Port M Input Register R 32.4.3.29/2-184
0x0252 DDRM—Port M Data Direction Register R/W 0x00 2.4.3.29/2-184
0x0253 Reserved R 0x00
0x0254 PERM—Port M Pull Device Enable Register R/W 0x00 2.4.3.30/2-185
0x0255 PPSM—Port M Polarity Select Register R/W 0x00 2.4.3.31/2-186
0x0256 WOMM—Port M Wired-Or Mode Register R/W 0x00 2.4.3.32/2-186
0x0257 PKGCR—Package Code Register R/W 52.4.3.33/2-187
P 0x0258 PTP—Port P Data Register R/W 0x00 2.4.3.34/2-188
0x0259 PTIP—Port P Input Register R 32.4.3.35/2-189
0x025A DDRP—Port P Data Direction Register R/W 0x00 2.4.3.36/2-190
0x025B Reserved R 0x00
0x025C PERP—Port P Pull Device Enable Register R/W 0x00 2.4.3.37/2-190
0x025D PPSP—Port P Polarity Select Register R/W 0x00 2.4.3.38/2-191
0x025E PIEP—Port P Interrupt Enable Register R/W 0x00 2.4.3.39/2-192
0x025F PIFP—Port P Interrupt Flag Register R/W 0x00 2.4.3.40/2-192
0x0260 Reserved for ACMP available in group G2 and G3 R(/W) 0x00 (3.6.2.1/3-217)
0x0261 R(/W) 0x00 (3.6.2.2/3-218)
0x0262
:
0x0266
Reserved R 0x00
J 0x0268 PTJ—Port J Data Register R/W 0x00 2.4.3.42/2-193
0x0269 PTIJ—Port J Input Register R 32.4.3.43/2-194
0x026A DDRJ—Port J Data Direction Register R/W 0x00 2.4.3.44/2-195
0x026B Reserved R 0x00
0x026C PERJ—Port J Pull Device Enable Register R/W 0xFF (G1,G2)
0x0F (G3)
2.4.3.45/2-195
0x026D PPSJ—Port J Polarity Select Register R/W 0x00 2.4.3.46/2-196
0x026E PIEJ—Port J Interrupt Enable Register R/W 0x00 2.4.3.47/2-197
0x026F PIFJ—Port J Interrupt Flag Register R/W 0x00 2.4.3.48/2-197
Table 2-18. Block Memory Map (0x0000-0x027F) (continued)
Port Global
Address Register Access Reset Value Section/Page
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
148 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.2 Register Map
The following tables show the individual register maps of groups G1 (Table 2-19), G2 (Table 2-20) and
G3 (Table 2-21).
NOTE
To maintain SW compatibility write data to unimplemented register bits
must be zero.
AD 0x0270 PT0AD—Port AD Data Register R/W 0x00 2.4.3.49/2-198
0x0271 PT1AD—Port AD Data Register R/W 0x00 2.4.3.50/2-199
0x0272 PTI0AD—Port AD Input Register R 32.4.3.51/2-199
0x0273 PTI1AD—Port AD Input Register R 32.4.3.54/2-201
0x0274 DDR0AD—Port AD Data Direction Register R/W 0x00 2.4.3.53/2-200
0x0275 DDR1AD—Port AD Data Direction Register R/W 0x00 2.4.3.54/2-201
0x0276 Reserved for RVACTL on G(A)240 and G(A)192 only R(/W) 0x00 (4.6.2.1/4-222)
0x0277 PRR1—Pin Routing Register 16R/W 0x00 2.4.3.56/2-201
0x0278 PER0AD—Port AD Pull Device Enable Register R/W 0x00 2.4.3.57/2-203
0x0279 PER1AD—Port AD Pull Device Enable Register R/W 0x00 2.4.3.58/2-203
0x027A PPS0AD—Port AD Polarity Select Register R/W 0x00 2.4.3.59/2-204
0x027B PPS1AD—Port AD Polarity Select Register R/W 0x00 2.4.3.60/2-205
0x027C PIE0AD—Port AD Interrupt Enable Register R/W 0x00 2.4.3.61/2-205
0x027D PIE1AD—Port AD Interrupt Enable Register R/W 0x00 2.4.3.62/2-206
0x027E PIF0AD—Port AD Interrupt Flag Register R/W 0x00 2.4.3.63/2-207
0x027F PIF1AD—Port AD Interrupt Flag Register R/W 0x00 2.4.3.64/2-207
1Available in group G1 only. In any other case this address is reserved.
2Refer to device memory map to determine related module.
3Read always returns logic level on pins.
4Routing takes only effect if the PKGCR is set to 20 TSSOP.
5Preset by factory.
6Routing register only available on G(A)240 and G(A)192 only. Takes only effect if the PKGCR is set to 100 LQFP.
Table 2-18. Block Memory Map (0x0000-0x027F) (continued)
Port Global
Address Register Access Reset Value Section/Page
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 149
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.2.1 Block Register Map (G1)
Table 2-19. Block Register Map (G1)
Global Address
Register Name Bit 7 654321Bit 0
0x0000
PORTA
RPA7 PA 6 PA5 PA 4 PA3 PA 2 PA1 PA0
W
0x0001
PORTB
RPB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0
W
0x0002
DDRA
RDDRA7 DDRA6 DDRA5 DDRA4 DDRA3 DDRA2 DDRA1 DDRA0
W
0x0003
DDRB
RDDRB7 DDRB6 DDRB5 DDRB4 DDRB3 DDRB2 DDRB1 DDRB0
W
0x0004
PORTC
RPC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0
W
0x0005
PORTD
RPD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0
W
0x0006
DDRC
RDDRC7 DDRC6 DDRC5 DDRC4 DDRC3 DDRC2 DDRC1 DDRC0
W
0x0007
DDRD
RDDRD7 DDRD6 DDRD5 DDRD4 DDRD3 DDRD2 DDRD1 DDRD0
0x0008
PORTE
R000000
PE1 PE0
W
0x0009
DDRE
R000000
DDRE1 DDRE0
W
0x000A–0x000B
Non-PIM
Address Range
R
Non-PIM Address Range
W
0x000C
PUCR
R0 BKPUE 0PDPEE PUPDE PUPCE PUPBE PUPAE
W
0x000D
Reserved
R00000000
W
0x000E–0x001B
Non-PIM
Address Range
R
Non-PIM Address Range
W
= Unimplemented or Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
150 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x001C
ECLKCTL
RNECLK NCLKX2 DIV16 EDIV4 EDIV3 EDIV2 EDIV1 EDIV0
W
0x001D
Reserved
R00000000
W
0x001E
IRQCR
RIRQE IRQEN 000000
W
0x001F
Reserved
RReserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
W
0x0020–0x023F
Non-PIM
Address Range
R
Non-PIM Address Range
W
0x0240
PTT
RPTT7 PTT6 PTT5 PTT4 PTT3 PTT2 PTT1 PTT0
W
0x0241
PTIT
R PTIT7 PTIT6 PTIT5 PTIT4 PTIT3 PTIT2 PTIT1 PTIT0
W
0x0242
DDRT
RDDRT7 DDRT6 DDRT5 DDRT4 DDRT3 DDRT2 DDRT1 DDRT0
W
0x0243
Reserved
R00000000
W
0x0244
PERT
RPERT7 PERT6 PERT5 PERT4 PERT3 PERT2 PERT1 PERT0
W
0x0245
PPST
RPPST7 PPST6 PPST5 PPST4 PPST3 PPST2 PPST1 PPST0
W
0x0246
Reserved
R00000000
W
0x0247
Reserved
R00000000
W
0x0248
PTS
RPTS7 PTS6 PTS5 PTS4 PTS3 PTS2 PTS1 PTS0
W
0x0249
PTIS
R PTIS7 PTIS6 PTIS5 PTIS4 PTIS3 PTIS2 PTIS1 PTIS0
W
Table 2-19. Block Register Map (G1) (continued)
Global Address
Register Name Bit 7 654321Bit 0
= Unimplemented or Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 151
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x024A
DDRS
RDDRS7 DDRS6 DDRS5 DDRS4 DDRS3 DDRS2 DDRS1 DDRS0
W
0x024B
Reserved
R00000000
W
0x024C
PERS
RPERS7 PERS6 PERS5 PERS4 PERS3 PERS2 PERS1 PERS0
W
0x024D
PPSS
RPPSS7 PPSS6 PPSS5 PPSS4 PPSS3 PPSS2 PPSS1 PPSS0
W
0x024E
WOMS
RWOMS7 WOMS6 WOMS5 WOMS4 WOMS3 WOMS2 WOMS1 WOMS0
W
0x024F
PRR0
RPRR0P3 PRR0P2 PRR0T31 PRR0T30 PRR0T21 PRR0T20 PRR0S1 PRR0S0
W
0x0250
PTM
R0000
PTM3 PTM2 PTM1 PTM0
W
0x0251
PTIM
R0000PTIM3 PTIM2 PTIM1 PTIM0
W
0x0252
DDRM
R0000
DDRM3 DDRM2 DDRM1 DDRM0
W
0x0253
Reserved
R00000000
W
0x0254
PERM
R0000
PERM3 PERM2 PERM1 PERM0
W
0x0255
PPSM
R0000
PPSM3 PPSM2 PPSM1 PPSM0
W
0x0256
WOMM
R0000
WOMM3 WOMM2 WOMM1 WOMM0
W
0x0257
PKGCR
RAPICLKS7 0000
PKGCR2 PKGCR1 PKGCR0
W
0x0258
PTP
RPTP7 PTP6 PTP5 PTP4 PTP3 PTP2 PTP1 PTP0
W
Table 2-19. Block Register Map (G1) (continued)
Global Address
Register Name Bit 7 654321Bit 0
= Unimplemented or Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
152 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x0259
PTIP
R PTIP7 PTIP6 PTIP5 PTIP4 PTIP3 PTIP2 PTIP1 PTIP0
W
0x025A
DDRP
RDDRP7 DDRP6 DDRP5 DDRP4 DDRP3 DDRP2 DDRP1 DDRP0
W
0x025B
Reserved
R00000000
W
0x025C
PERP
RPERP7 PERP6 PERP5 PERP4 PERP3 PERP2 PERP1 PERP0
W
0x025D
PPSP
RPPSP7 PPSP6 PPSP5 PPSP4 PPSP3 PPSP2 PPSP1 PPSP0
W
0x025E
PIEP
RPIEP7 PIEP6 PIEP5 PIEP4 PIEP3 PIEP2 PIEP1 PIEP0
W
0x025F
PIFP
RPIFP7 PIFP6 PIFP5 PIFP4 PIFP3 PIFP2 PIFP1 PIFP0
W
0x0260–0x0267
Reserved
R00000000
W
0x0268
PTJ
RPTJ7 PTJ6 PTJ5 PTJ4 PTJ3 PTJ2 PTJ1 PTJ0
W
0x0269
PTIJ
R PTIJ7 PTIJ6 PTIJ5 PTIJ4 PTIJ3 PTIJ2 PTIJ1 PTIJ0
W
0x026A
DDRJ
RDDRJ7 DDRJ6 DDRJ5 DDRJ4 DDRJ3 DDRJ2 DDRJ1 DDRJ0
W
0x026B
Reserved
R00000000
W
0x026C
PERJ
RPERJ7 PERJ6 PERJ5 PERJ4 PERJ3 PERJ2 PERJ1 PERJ0
W
0x026D
PPSJ
RPPSJ7 PPSJ6 PPSJ5 PPSJ4 PPSJ3 PPSJ2 PPSJ1 PPSJ0
W
0x026E
PIEJ
RPIEJ7 PIEJ6 PIEJ5 PIEJ4 PIEJ3 PIEJ2 PIEJ1 PIEJ0
W
Table 2-19. Block Register Map (G1) (continued)
Global Address
Register Name Bit 7 654321Bit 0
= Unimplemented or Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 153
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x026F
PIFJ
RPIFJ7 PIFJ6 PIFJ5 PIFJ4 PIFJ3 PIFJ2 PIFJ1 PIFJ0
W
0x0270
PT0AD
RPT0AD7 PT0AD6 PT0AD5 PT0AD4 PT0AD3 PT0AD2 PT0AD1 PT0AD0
W
0x0271
PT1AD
RPT1AD7 PT1AD6 PT1AD5 PT1AD4 PT1AD3 PT1AD2 PT1AD1 PT1AD0
W
0x0272
PTI0AD
R PTI0AD7 PTI0AD6 PTI0AD5 PTI0AD4 PTI0AD3 PTI0AD2 PTI0AD1 PTI0AD0
W
0x0273
PTI1AD
R PTI1AD7 PTI1AD6 PTI1AD5 PTI1AD4 PTI1AD3 PTI1AD2 PTI1AD1 PTI1AD0
W
0x0274
DDR0AD
RDDR0AD7 DDR0AD6 DDR0AD5 DDR0AD4 DDR0AD3 DDR0AD2 DDR0AD1 DDR0AD0
W
0x0275
DDR1AD
RDDR1AD7 DDR1AD6 DDR1AD5 DDR1AD4 DDR1AD3 DDR1AD2 DDR1AD1 DDR1AD0
W
0x0276
Reserved
RReserved for RVACTL on G(A)240 and G(A)192
W
0x0277
PRR1
R0000000
PRR1AN
W
0x0278
PER0AD
RPER0AD7 PER0AD6 PER0AD5 PER0AD4 PER0AD3 PER0AD2 PER0AD1 PER0AD0
W
0x0279
PER1AD
RPER1AD7 PER1AD6 PER1AD5 PER1AD4 PER1AD3 PER1AD2 PER1AD1 PER1AD0
W
0x027A
PPS0AD
RPPS0AD7 PPS0AD6 PPS0AD5 PPS0AD4 PPS0AD3 PPS0AD2 PPS0AD1 PPS0AD0
W
0x027B
PPS1AD
RPPS1AD7 PPS1AD6 PPS1AD5 PPS1AD4 PPS1AD3 PPS1AD2 PPS1AD1 PPS1AD0
W
0x027C
PIE0AD
RPIE0AD7 PIE0AD6 PIE0AD5 PIE0AD4 PIE0AD3 PIE0AD2 PIE0AD1 PIE0AD0
W
0x027D
PIE1AD
RPIE1AD7 PIE1AD6 PIE1AD5 PIE1AD4 PIE1AD3 PIE1AD2 PIE1AD1 PIE1AD0
W
Table 2-19. Block Register Map (G1) (continued)
Global Address
Register Name Bit 7 654321Bit 0
= Unimplemented or Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
154 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.2.2 Block Register Map (G2)
0x027E
PIF0AD
RPIF0AD7 PIF0AD6 PIF0AD5 PIF0AD4 PIF0AD3 PIF0AD2 PIF0AD1 PIF0AD0
W
0x027F
PIF1AD
RPIF1AD7 PIF1AD6 PIF1AD5 PIF1AD4 PIF1AD3 PIF1AD2 PIF1AD1 PIF1AD0
W
Table 2-20. Block Register Map (G2)
Global Address
Register Name Bit 7 654321Bit 0
0x0000–0x0007
Reserved
R00000000
W
0x0008
PORTE
R000000
PE1 PE0
W
0x0009
DDRE
R000000
DDRE1 DDRE0
W
0x000A–0x000B
Non-PIM
Address Range
R
Non-PIM Address Range
W
0x000C
PUCR
R0 BKPUE 0PDPEE 0000
W
0x000D
Reserved
R00000000
W
0x000E–0x001B
Non-PIM
Address Range
R
Non-PIM Address Range
W
0x001C
ECLKCTL
RNECLK NCLKX2 DIV16 EDIV4 EDIV3 EDIV2 EDIV1 EDIV0
W
0x001D
Reserved
R00000000
W
= Unimplemented or Reserved
Table 2-19. Block Register Map (G1) (continued)
Global Address
Register Name Bit 7 654321Bit 0
= Unimplemented or Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 155
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x001E
IRQCR
RIRQE IRQEN 000000
W
0x001F
Reserved
RReserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
W
0x0020–0x023F
Non-PIM
Address Range
R
Non-PIM Address Range
W
0x0240
PTT
RPTT7 PTT6 PTT5 PTT4 PTT3 PTT2 PTT1 PTT0
W
0x0241
PTIT
R PTIT7 PTIT6 PTIT5 PTIT4 PTIT3 PTIT2 PTIT1 PTIT0
W
0x0242
DDRT
RDDRT7 DDRT6 DDRT5 DDRT4 DDRT3 DDRT2 DDRT1 DDRT0
W
0x0243
Reserved
R00000000
W
0x0244
PERT
RPERT7 PERT6 PERT5 PERT4 PERT3 PERT2 PERT1 PERT0
W
0x0245
PPST
RPPST7 PPST6 PPST5 PPST4 PPST3 PPST2 PPST1 PPST0
W
0x0246
Reserved
R00000000
W
0x0247
Reserved
R00000000
W
0x0248
PTS
RPTS7 PTS6 PTS5 PTS4 PTS3 PTS2 PTS1 PTS0
W
0x0249
PTIS
R PTIS7 PTIS6 PTIS5 PTIS4 PTIS3 PTIS2 PTIS1 PTIS0
W
0x024A
DDRS
RDDRS7 DDRS6 DDRS5 DDRS4 DDRS3 DDRS2 DDRS1 DDRS0
W
0x024B
Reserved
R00000000
W
Table 2-20. Block Register Map (G2) (continued)
Global Address
Register Name Bit 7 654321Bit 0
= Unimplemented or Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
156 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x024C
PERS
RPERS7 PERS6 PERS5 PERS4 PERS3 PERS2 PERS1 PERS0
W
0x024D
PPSS
RPPSS7 PPSS6 PPSS5 PPSS4 PPSS3 PPSS2 PPSS1 PPSS0
W
0x024E
WOMS
RWOMS7 WOMS6 WOMS5 WOMS4 WOMS3 WOMS2 WOMS1 WOMS0
W
0x024F
PRR0
RPRR0P3 PRR0P2 PRR0T31 PRR0T30 PRR0T21 PRR0T20 PRR0S1 PRR0S0
W
0x0250
PTM
R0000
PTM3 PTM2 PTM1 PTM0
W
0x0251
PTIM
R0000PTIM3 PTIM2 PTIM1 PTIM0
W
0x0252
DDRM
R0000
DDRM3 DDRM2 DDRM1 DDRM0
W
0x0253
Reserved
R00000000
W
0x0254
PERM
R0000
PERM3 PERM2 PERM1 PERM0
W
0x0255
PPSM
R0000
PPSM3 PPSM2 PPSM1 PPSM0
W
0x0256
WOMM
R0000
WOMM3 WOMM2 WOMM1 WOMM0
W
0x0257
PKGCR
RAPICLKS7 0000
PKGCR2 PKGCR1 PKGCR0
W
0x0258
PTP
RPTP7 PTP6 PTP5 PTP4 PTP3 PTP2 PTP1 PTP0
W
0x0259
PTIP
R PTIP7 PTIP6 PTIP5 PTIP4 PTIP3 PTIP2 PTIP1 PTIP0
W
0x025A
DDRP
RDDRP7 DDRP6 DDRP5 DDRP4 DDRP3 DDRP2 DDRP1 DDRP0
W
Table 2-20. Block Register Map (G2) (continued)
Global Address
Register Name Bit 7 654321Bit 0
= Unimplemented or Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 157
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x025B
Reserved
R00000000
W
0x025C
PERP
RPERP7 PERP6 PERP5 PERP4 PERP3 PERP2 PERP1 PERP0
W
0x025D
PPSP
RPPSP7 PPSP6 PPSP5 PPSP4 PPSP3 PPSP2 PPSP1 PPSP0
W
0x025E
PIEP
RPIEP7 PIEP6 PIEP5 PIEP4 PIEP3 PIEP2 PIEP1 PIEP0
W
0x025F
PIFP
RPIFP7 PIFP6 PIFP5 PIFP4 PIFP3 PIFP2 PIFP1 PIFP0
W
0x0260–0x0261
Reserved
RReserved for ACMP
W
0x0262–0x0266
Reserved
R00000000
W
0x0267
Reserved
RReserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
W
0x0268
PTJ
RPTJ7 PTJ6 PTJ5 PTJ4 PTJ3 PTJ2 PTJ1 PTJ0
W
0x0269
PTIJ
R PTIJ7 PTIJ6 PTIJ5 PTIJ4 PTIJ3 PTIJ2 PTIJ1 PTIJ0
W
0x026A
DDRJ
RDDRJ7 DDRJ6 DDRJ5 DDRJ4 DDRJ3 DDRJ2 DDRJ1 DDRJ0
W
0x026B
Reserved
R00000000
W
0x026C
PERJ
RPERJ7 PERJ6 PERJ5 PERJ4 PERJ3 PERJ2 PERJ1 PERJ0
W
0x026D
PPSJ
RPPSJ7 PPSJ6 PPSJ5 PPSJ4 PPSJ3 PPSJ2 PPSJ1 PPSJ0
W
0x026E
PIEJ
RPIEJ7 PIEJ6 PIEJ5 PIEJ4 PIEJ3 PIEJ2 PIEJ1 PIEJ0
W
Table 2-20. Block Register Map (G2) (continued)
Global Address
Register Name Bit 7 654321Bit 0
= Unimplemented or Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
158 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x026F
PIFJ
RPIFJ7 PIFJ6 PIFJ5 PIFJ4 PIFJ3 PIFJ2 PIFJ1 PIFJ0
W
0x0270
PT0AD
RPT0AD7 PT0AD6 PT0AD5 PT0AD4 PT0AD3 PT0AD2 PT0AD1 PT0AD0
W
0x0271
PT1AD
RPT1AD7 PT1AD6 PT1AD5 PT1AD4 PT1AD3 PT1AD2 PT1AD1 PT1AD0
W
0x0272
PTI0AD
R PTI0AD7 PTI0AD6 PTI0AD5 PTI0AD4 PTI0AD3 PTI0AD2 PTI0AD1 PTI0AD0
W
0x0273
PTI1AD
R PTI1AD7 PTI1AD6 PTI1AD5 PTI1AD4 PTI1AD3 PTI1AD2 PTI1AD1 PTI1AD0
W
0x0274
DDR0AD
RDDR0AD7 DDR0AD6 DDR0AD5 DDR0AD4 DDR0AD3 DDR0AD2 DDR0AD1 DDR0AD0
W
0x0275
DDR1AD
RDDR1AD7 DDR1AD6 DDR1AD5 DDR1AD4 DDR1AD3 DDR1AD2 DDR1AD1 DDR1AD0
W
0x0276
Reserved
R00000000
W
0x0277
Reserved
R00000000
W
0x0278
PER0AD
RPER0AD7 PER0AD6 PER0AD5 PER0AD4 PER0AD3 PER0AD2 PER0AD1 PER0AD0
W
0x0279
PER1AD
RPER1AD7 PER1AD6 PER1AD5 PER1AD4 PER1AD3 PER1AD2 PER1AD1 PER1AD0
W
0x027A
PPS0AD
RPPS0AD7 PPS0AD6 PPS0AD5 PPS0AD4 PPS0AD3 PPS0AD2 PPS0AD1 PPS0AD0
W
0x027B
PPS1AD
RPPS1AD7 PPS1AD6 PPS1AD5 PPS1AD4 PPS1AD3 PPS1AD2 PPS1AD1 PPS1AD0
W
0x027C
PIE0AD
RPIE0AD7 PIE0AD6 PIE0AD5 PIE0AD4 PIE0AD3 PIE0AD2 PIE0AD1 PIE0AD0
W
0x027D
PIE1AD
RPIE1AD7 PIE1AD6 PIE1AD5 PIE1AD4 PIE1AD3 PIE1AD2 PIE1AD1 PIE1AD0
W
Table 2-20. Block Register Map (G2) (continued)
Global Address
Register Name Bit 7 654321Bit 0
= Unimplemented or Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 159
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.2.3 Block Register Map (G3)
0x027E
PIF0AD
RPIF0AD7 PIF0AD6 PIF0AD5 PIF0AD4 PIF0AD3 PIF0AD2 PIF0AD1 PIF0AD0
W
0x027F
PIF1AD
RPIF1AD7 PIF1AD6 PIF1AD5 PIF1AD4 PIF1AD3 PIF1AD2 PIF1AD1 PIF1AD0
W
Table 2-21. Block Register Map (G3)
Global Address
Register Name Bit 7 654321Bit 0
0x0000–0x0007
Reserved
R00000000
W
0x0008
PORTE
R000000
PE1 PE0
W
0x0009
DDRE
R000000
DDRE1 DDRE0
W
0x000A–0x000B
Non-PIM
Address Range
R
Non-PIM Address Range
W
0x000C
PUCR
R0 BKPUE 0PDPEE 0000
W
0x000D
Reserved
R00000000
W
0x000E–0x001B
Non-PIM
Address Range
R
Non-PIM Address Range
W
0x001C
ECLKCTL
RNECLK NCLKX2 DIV16 EDIV4 EDIV3 EDIV2 EDIV1 EDIV0
W
0x001D
Reserved
R00000000
W
= Unimplemented or Reserved
Table 2-20. Block Register Map (G2) (continued)
Global Address
Register Name Bit 7 654321Bit 0
= Unimplemented or Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
160 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x001E
IRQCR
RIRQE IRQEN 000000
W
0x001F
Reserved
RReserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
W
0x0020–0x023F
Non-PIM
Address Range
R
Non-PIM Address Range
W
0x0240
PTT
R0 0 PTT5 PTT4 PTT3 PTT2 PTT1 PTT0
W
0x0241
PTIT
R 0 0 PTIT5 PTIT4 PTIT3 PTIT2 PTIT1 PTIT0
W
0x0242
DDRT
R0 0 DDRT5 DDRT4 DDRT3 DDRT2 DDRT1 DDRT0
W
0x0243
Reserved
R00000000
W
0x0244
PERT
R0 0 PERT5 PERT4 PERT3 PERT2 PERT1 PERT0
W
0x0245
PPST
R0 0 PPST5 PPST4 PPST3 PPST2 PPST1 PPST0
W
0x0246
Reserved
R00000000
W
0x0247
Reserved
R00000000
W
0x0248
PTS
RPTS7 PTS6 PTS5 PTS4 PTS3 PTS2 PTS1 PTS0
W
0x0249
PTIS
R PTIS7 PTIS6 PTIS5 PTIS4 PTIS3 PTIS2 PTIS1 PTIS0
W
0x024A
DDRS
RDDRS7 DDRS6 DDRS5 DDRS4 DDRS3 DDRS2 DDRS1 DDRS0
W
0x024B
Reserved
R00000000
W
Table 2-21. Block Register Map (G3) (continued)
Global Address
Register Name Bit 7 654321Bit 0
= Unimplemented or Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 161
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x024C
PERS
RPERS7 PERS6 PERS5 PERS4 PERS3 PERS2 PERS1 PERS0
W
0x024D
PPSS
RPPSS7 PPSS6 PPSS5 PPSS4 PPSS3 PPSS2 PPSS1 PPSS0
W
0x024E
WOMS
RWOMS7 WOMS6 WOMS5 WOMS4 WOMS3 WOMS2 WOMS1 WOMS0
W
0x024F
PRR0
RPRR0P3 PRR0P2 PRR0T31 PRR0T30 PRR0T21 PRR0T20 PRR0S1 PRR0S0
W
0x0250
PTM
R000000
PTM1 PTM0
W
0x0251
PTIM
R000000PTIM1 PTIM0
W
0x0252
DDRM
R000000
DDRM1 DDRM0
W
0x0253
Reserved
R00000000
W
0x0254
PERM
R000000
PERM1 PERM0
W
0x0255
PPSM
R000000
PPSM1 PPSM0
W
0x0256
WOMM
R000000
WOMM1 WOMM0
W
0x0257
PKGCR
RAPICLKS7 0000
PKGCR2 PKGCR1 PKGCR0
W
0x0258
PTP
R0 0 PTP5 PTP4 PTP3 PTP2 PTP1 PTP0
W
0x0259
PTIP
R 0 0 PTIP5 PTIP4 PTIP3 PTIP2 PTIP1 PTIP0
W
0x025A
DDRP
R0 0 DDRP5 DDRP4 DDRP3 DDRP2 DDRP1 DDRP0
W
Table 2-21. Block Register Map (G3) (continued)
Global Address
Register Name Bit 7 654321Bit 0
= Unimplemented or Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
162 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x025B
Reserved
R00000000
W
0x025C
PERP
R0 0 PERP5 PERP4 PERP3 PERP2 PERP1 PERP0
W
0x025D
PPSP
R0 0 PPSP5 PPSP4 PPSP3 PPSP2 PPSP1 PPSP0
W
0x025E
PIEP
R0 0 PIEP5 PIEP4 PIEP3 PIEP2 PIEP1 PIEP0
W
0x025F
PIFP
R0 0 PIFP5 PIFP4 PIFP3 PIFP2 PIFP1 PIFP0
W
0x0260–0x0261
Reserved
RReserved for ACMP
W
0x0262–0x0267
Reserved
R00000000
W
0x0268
PTJ
R0000
PTJ3 PTJ2 PTJ1 PTJ0
W
0x0269
PTIJ
R0000PTIJ3 PTIJ2 PTIJ1 PTIJ0
W
0x026A
DDRJ
R0000
DDRJ3 DDRJ2 DDRJ1 DDRJ0
W
0x026B
Reserved
R00000000
W
0x026C
PERJ
R0000
PERJ3 PERJ2 PERJ1 PERJ0
W
0x026D
PPSJ
R0000
PPSJ3 PPSJ2 PPSJ1 PPSJ0
W
0x026E
PIEJ
R0000
PIEJ3 PIEJ2 PIEJ1 PIEJ0
W
0x026F
PIFJ
R0000
PIFJ3 PIFJ2 PIFJ1 PIFJ0
W
Table 2-21. Block Register Map (G3) (continued)
Global Address
Register Name Bit 7 654321Bit 0
= Unimplemented or Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 163
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x0270
PT0AD
R0000
PT0AD3 PT0AD2 PT0AD1 PT0AD0
W
0x0271
PT1AD
RPT1AD7 PT1AD6 PT1AD5 PT1AD4 PT1AD3 PT1AD2 PT1AD1 PT1AD0
W
0x0272
PTI0AD
R0000PTI0AD3 PTI0AD2 PTI0AD1 PTI0AD0
W
0x0273
PTI1AD
R PTI1AD7 PTI1AD6 PTI1AD5 PTI1AD4 PTI1AD3 PTI1AD2 PTI1AD1 PTI1AD0
W
0x0274
DDR0AD
R0000
DDR0AD3 DDR0AD2 DDR0AD1 DDR0AD0
W
0x0275
DDR1AD
RDDR1AD7 DDR1AD6 DDR1AD5 DDR1AD4 DDR1AD3 DDR1AD2 DDR1AD1 DDR1AD0
W
0x0276
Reserved
R00000000
W
0x0277
Reserved
R00000000
W
0x0278
PER0AD
R0000
PER0AD3 PER0AD2 PER0AD1 PER0AD0
W
0x0279
PER1AD
RPER1AD7 PER1AD6 PER1AD5 PER1AD4 PER1AD3 PER1AD2 PER1AD1 PER1AD0
W
0x027A
PPS0AD
R0000
PPS0AD3 PPS0AD2 PPS0AD1 PPS0AD0
W
0x027B
PPS1AD
RPPS1AD7 PPS1AD6 PPS1AD5 PPS1AD4 PPS1AD3 PPS1AD2 PPS1AD1 PPS1AD0
W
0x027C
PIE0AD
R0000
PIE0AD3 PIE0AD2 PIE0AD1 PIE0AD0
W
0x027D
PIE1AD
RPIE1AD7 PIE1AD6 PIE1AD5 PIE1AD4 PIE1AD3 PIE1AD2 PIE1AD1 PIE1AD0
W
0x027E
PIF0AD
R0000
PIF0AD3 PIF0AD2 PIF0AD1 PIF0AD0
W
Table 2-21. Block Register Map (G3) (continued)
Global Address
Register Name Bit 7 654321Bit 0
= Unimplemented or Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
164 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3 Register Descriptions
This section describes the details of all configuration registers. Every register has the same functionality
in all groups if not specified separately. Refer to the register figures for reserved locations. If not stated
differently, writing to reserved bits has not effect and read returns zero.
NOTE
• All register read accesses are synchronous to internal clocks
• General-purpose data output availability depends on prioritization; input
data registers always reflect the pin status independent of the use
• Pull-device availability, pull-device polarity, wired-or mode,
key-wakeup functionality are independent of the prioritization unless
noted differently in section Section 2.3, “PIM Routing - Functional
description”.
2.4.3.1 Port A Data Register (PORTA)
0x027F
PIF1AD
RPIF1AD7 PIF1AD6 PIF1AD5 PIF1AD4 PIF1AD3 PIF1AD2 PIF1AD1 PIF1AD0
W
Address 0x0000 (G1) Access: User read/write1
1Read: Anytime. The data source is depending on the data direction value.
Write: Anytime
76543210
R
PA7 PA 6 PA5 PA4 PA3 PA2 PA1 PA0
W
Reset 0 0000000
Address 0x0000 (G2, G3) Access: User read only
76543210
R00000000
W
Reset 0 0000000
Figure 2-2. Port A Data Register (PORTA)
Table 2-21. Block Register Map (G3) (continued)
Global Address
Register Name Bit 7 654321Bit 0
= Unimplemented or Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 165
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.2 Port B Data Register (PORTB)
Table 2-22. PORTA Register Field Descriptions
Field Description
7-0
PA
Port A general-purpose input/output data—Data Register
The associated pin can be used as general-purpose I/O. In general-purpose output mode the port data register bit
value is driven to the pin.
If the associated data direction bit is set to 1, a read returns the value of the port data register bit, otherwise the
buffered pin input state is read.
Address 0x0001 (G1) Access: User read/write1
1Read: Anytime. The data source is depending on the data direction value.
Write: Anytime
76543210
R
PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0
W
Reset 0 0000000
Address 0x0001 (G2, G3) Access: User read only
76543210
R00000000
W
Reset 0 0000000
Figure 2-3. Port B Data Register (PORTB)
Table 2-23. PORTB Register Field Descriptions
Field Description
7-0
PB
Port B general-purpose input/output data—Data Register
The associated pin can be used as general-purpose I/O. In general-purpose output mode the port data register bit
value is driven to the pin.
If the associated data direction bit is set to 1, a read returns the value of the port data register bit, otherwise the
buffered pin input state is read.
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
166 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.3 Port A Data Direction Register (DDRA)
2.4.3.4 Port B Data Direction Register (DDRB)
Address 0x0002 (G1) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
DDRA7 DDRA6 DDRA5 DDRA4 DDRA3 DDRA2 DDRA1 DDRA0
W
Reset 0 0000000
Address 0x0002 (G2, G3) Access: User read only
76543210
R00000000
W
Reset 0 0000000
Figure 2-4. Port A Data Direction Register (DDRA)
Table 2-24. DDRA Register Field Descriptions
Field Description
7-0
DDRA
Port A Data Direction—
This bit determines whether the associated pin is an input or output.
1 Associated pin configured as output
0 Associated pin configured as input
Address 0x0003 (G1) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
DDRB7 DDRB6 DDRB5 DDRB4 DDRB3 DDRB2 DDRB1 DDRB0
W
Reset 0 0000000
Address 0x0003 (G2, G3) Access: User read only
76543210
R00000000
W
Reset 0 0000000
Figure 2-5. Port B Data Direction Register (DDRB)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 167
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.5 Port C Data Register (PORTC)
Table 2-25. DDRB Register Field Descriptions
Field Description
7-0
DDRB
Port B Data Direction—
This bit determines whether the associated pin is an input or output.
1 Associated pin configured as output
0 Associated pin configured as input
Address 0x0004 (G1) Access: User read/write1
1Read: Anytime. The data source is depending on the data direction value.
Write: Anytime
76543210
R
PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0
W
Reset 0 0000000
Address 0x0004 (G2, G3) Access: User read only
76543210
R00000000
W
Reset 0 0000000
Figure 2-6. Port C Data Register (PORTC)
Table 2-26. PORTC Register Field Descriptions
Field Description
7-0
PC
Port C general-purpose input/output data—Data Register
The associated pin can be used as general-purpose I/O. In general-purpose output mode the port data register bit
value is driven to the pin.
If the associated data direction bit is set to 1, a read returns the value of the port data register bit, otherwise the
buffered pin input state is read.
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
168 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.6 Port D Data Register (PORTD)
2.4.3.7 Port C Data Direction Register (DDRC)
Address 0x0005 (G1) Access: User read/write1
1Read: Anytime. The data source is depending on the data direction value.
Write: Anytime
76543210
R
PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0
W
Reset 0 0000000
Address 0x0005 (G2, G3) Access: User read only
76543210
R00000000
W
Reset 0 0000000
Figure 2-7. Port D Data Register (PORTD)
Table 2-27. PORTD Register Field Descriptions
Field Description
7-0
PD
Port D general-purpose input/output data—Data Register
The associated pin can be used as general-purpose I/O. In general-purpose output mode the port data register bit
value is driven to the pin.
If the associated data direction bit is set to 1, a read returns the value of the port data register bit, otherwise the
buffered pin input state is read.
Address 0x0006 (G1) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
DDRC7 DDRC6 DDRC5 DDRA4 DDRC3 DDRC2 DDRC1 DDRC0
W
Reset 0 0000000
Address 0x0006 (G2, G3) Access: User read only
76543210
R00000000
W
Reset 0 0000000
Figure 2-8. Port C Data Direction Register (DDRC)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 169
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.8 Port D Data Direction Register (DDRD)
2.4.3.9 Port E Data Register (PORTE)
Table 2-28. DDRC Register Field Descriptions
Field Description
7-0
DDRC
Port C Data Direction—
This bit determines whether the associated pin is an input or output.
1 Associated pin configured as output
0 Associated pin configured as input
Address 0x0007 (G1) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
DDRD7 DDRD6 DDRD5 DDRD4 DDRD3 DDRD2 DDRD1 DDRD0
W
Reset 0 0000000
Address 0x0007 (G2, G3) Access: User read only
76543210
R00000000
W
Reset 0 0000000
Figure 2-9. Port D Data Direction Register (DDRD)
Table 2-29. DDRD Register Field Descriptions
Field Description
7-0
DDRD
Port D Data Direction—
This bit determines whether the associated pin is an input or output.
1 Associated pin configured as output
0 Associated pin configured as input
Address 0x0008 Access: User read/write1
76543210
R000000
PE1 PE0
W
Reset 00000000
Figure 2-10. Port E Data Register (PORTE)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
170 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.10 Port E Data Direction Register (DDRE)
1Read: Anytime. The data source is depending on the data direction value.
Write: Anytime
Table 2-30. PORTE Register Field Descriptions
Field Description
1-0
PE
Port E general-purpose input/output data—Data Register
When not used with an alternative signal, this pin can be used as general-purpose I/O.
In general-purpose output mode the port data register bit is driven to the pin.
If the associated data direction bit of this pin is set to 1, a read returns the value of the port register, otherwise the
buffered pin input state is read.
Address 0x0009 Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R000000
DDRE1 DDRE0
W
Reset 00000000
Figure 2-11. Port E Data Direction Register (DDRE)
Table 2-31. DDRE Register Field Descriptions
Field Description
1-0
DDRE
Port E Data Direction—
This bit determines whether the associated pin is an input or output.
1 Associated pin configured as output
0 Associated pin configured as input
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 171
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.11 Ports A, B, C, D, E, BKGD pin Pull Control Register (PUCR)
Address 0x000C (G1) Access: User read/write1
1Read:Anytime in normal mode.
Write:Anytime, except BKPUE, which is writable in special mode only.
76543210
R0
BKPUE
0
PDPEE PUPDE PUPCE PUPBE PUPAE
W
Reset 0 1010000
Address 0x000C (G2, G3) Access: User read/write
76543210
R0
BKPUE
0
PDPEE
0000
W
Reset 0 1010000
Figure 2-12. Ports A, B, C, D, E, BKGD pin Pullup Control Register (PUCR)
Table 2-32. PUCR Register Field Descriptions
Field Description
6
BKPUE
BKGD pin Pullup Enable—Enable pullup device on pin
This bit configures whether a pullup device is activated, if the pin is used as input. If a pin is used as output this bit
has no effect. Out of reset the pullup device is enabled.
1 Pullup device enabled
0 Pullup device disabled
4
PDPEE
Port E Pulldown Enable—Enable pulldown devices on all port input pins
This bit configures whether a pulldown device is activated on all associated port input pins. If a pin is used as output
or used with the CPMU OSC function this bit has no effect. Out of reset the pulldown devices are enabled.
1 Pulldown devices enabled
0 Pulldown devices disabled
3
PUPDE
Port D Pullup Enable—Enable pullup devices on all port input pins
This bit configures whether a pullup device is activated on all associated port input pins. If a pin is used as output
this bit has no effect.
1 Pullup devices enabled
0 Pullup devices disabled
2
PUPCE
Port C Pullup Enable—Enable pullup devices on all port input pins
This bit configures whether a pullup device is activated on all associated port input pins. If a pin is used as output
this bit has no effect.
1 Pullup devices enabled
0 Pullup devices disabled
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
172 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
1
PUPBE
Port B Pullup Enable—Enable pullup devices on all port input pins
This bit configures whether a pullup device is activated on all associated port input pins. If a pin is used as output
this bit has no effect.
1 Pullup devices enabled
0 Pullup devices disabled
0
PUPAE
Port A Pullup Enable—Enable pullup devices on all port input pins
This bit configures whether a pullup device is activated on all associated port input pins. If a pin is used as output
this bit has no effect.
1 Pullup devices enabled
0 Pullup devices disabled
Table 2-32. PUCR Register Field Descriptions (continued)
Field Description
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 173
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.12 ECLK Control Register (ECLKCTL)
2.4.3.13 IRQ Control Register (IRQCR)
Address 0x001C Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
NECLK NCLKX2 DIV16 EDIV4 EDIV3 EDIV2 EDIV1 EDIV0
W
Reset: 11000000
Figure 2-13. ECLK Control Register (ECLKCTL)
Table 2-33. ECLKCTL Register Field Descriptions
Field Description
7
NECLK
No ECLK—Disable ECLK output
This bit controls the availability of a free-running clock on the ECLK pin. This clock has a fixed rate equivalent to the
internal bus clock.
1 ECLK disabled
0 ECLK enabled
6
NCLKX2
No ECLKX2—Disable ECLKX2 output
This bit controls the availability of a free-running clock on the ECLKX2 pin. This clock has a fixed rate of twice the
internal bus clock.
1 ECLKX2 disabled
0 ECLKX2 enabled
5
DIV16
Free-running ECLK predivider—Divide by 16
This bit enables a divide-by-16 stage on the selected EDIV rate.
1 Divider enabled: ECLK rate = EDIV rate divided by 16
0 Divider disabled: ECLK rate = EDIV rate
4-0
EDIV
Free-running ECLK Divider—Configure ECLK rate
These bits determine the rate of the free-running clock on the ECLK pin.
00000 ECLK rate = bus clock rate
00001 ECLK rate = bus clock rate divided by 2
00010 ECLK rate = bus clock rate divided by 3,...
11111 ECLK rate = bus clock rate divided by 32
Address 0x001E Access: User read/write1
76543210
R
IRQE IRQEN
000000
W
Reset 00000000
Figure 2-14. IRQ Control Register (IRQCR)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
174 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
If the input is driven to active level (IRQ=0) a write access to set either
IRQCR[IRQEN] and IRQCR[IRQE] to 1 simultaneously or to set
IRQCR[IRQEN] to 1 when IRQCR[IRQE]=1 causes an IRQ interrupt to be
generated if the I-bit is cleared. Refer to Section 2.6.3, “Enabling IRQ
edge-sensitive mode”.
2.4.3.14 Reserved Register
1Read: Anytime
Write:
IRQE: Once in normal mode, anytime in special mode
IRQEN: Anytime
Table 2-34. IRQCR Register Field Descriptions
Field Description
7
IRQE
IRQ select edge sensitive only—
1IRQ pin configured to respond only to falling edges. Falling edges on the IRQ pin are detected anytime when
IRQE=1 and will be cleared only upon a reset or the servicing of the IRQ interrupt.
0IRQ pin configured for low level recognition
6
IRQEN
IRQ enable—
1IRQ pin is connected to interrupt logic
0IRQ pin is disconnected from interrupt logic
Address 0x001F Access: User read/write1
1Read: Anytime
Write: Only in special mode
These reserved registers are designed for factory test purposes only and are
not intended for general user access. Writing to these registers when in
special mode can alter the module’s functionality.
76543210
R
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
W
Reset xxxxxxxx
Figure 2-15. Reserved Register
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 175
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.15 Port T Data Register (PTT)
2.4.3.16 Port T Input Register (PTIT)
Address 0x0240 (G1, G2) Access: User read/write1
1Read: Anytime. The data source is depending on the data direction value.
Write: Anytime
76543210
R
PTT7 PTT6 PTT5 PTT4 PTT3 PTT2 PTT1 PTT0
W
Reset 00000000
Address 0x0240 (G3) Access: User read/write1
76543210
R 0 0
PTT5 PTT4 PTT3 PTT2 PTT1 PTT0
W
Reset 00000000
Figure 2-16. Port T Data Register (PTT)
Table 2-35. PTT Register Field Descriptions
Field Description
7-0
PTT
Port T general-purpose input/output data—Data Register
When not used with an alternative signal, the associated pin can be used as general-purpose I/O. In
general-purpose output mode the port data register bit value is driven to the pin.
If the associated data direction bit is set to 1, a read returns the value of the port data register bit, otherwise the
buffered pin input state is read.
Address 0x0241 (G1, G2) Access: User read only1
1Read: Anytime
Write:Never
76543210
R PTIT7 PTIT6 PTIT5 PTIT4 PTIT3 PTIT2 PTIT1 PTIT0
W
Reset 00000000
Address 0x0241 (G3) Access: User read only1
76543210
R 0 0 PTIT5 PTIT4 PTIT3 PTIT2 PTIT1 PTIT0
W
Reset 00000000
Figure 2-17. Port T Input Register (PTIT)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
176 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.17 Port T Data Direction Register (DDRT)
Table 2-36. PTIT Register Field Descriptions
Field Description
7-0
PTIT
Port T input data—
A read always returns the buffered input state of the associated pin. It can be used to detect overload or short circuit
conditions on output pins.
Address 0x0242 (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
DDRT7 DDRT6 DDRT5 DDRT4 DDRT3 DDRT2 DDRT1 DDRT0
W
Reset 00000000
Address 0x0242 (G3) Access: User read/write1
76543210
R 0 0
DDRT5 DDRT4 DDRT3 DDRT2 DDRT1 DDRT0
W
Reset 00000000
Figure 2-18. Port T Data Direction Register (DDRT)
Table 2-37. DDRT Register Field Descriptions
Field Description
7-0
DDRT
Port T data direction—
This bit determines whether the pin is a general-purpose input or output.
1 Associated pin configured as output
0 Associated pin configured as input
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 177
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.18 Port T Pull Device Enable Register (PERT)
Address 0x0244 (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PERT7 PERT6 PERT5 PERT4 PERT3 PERT2 PERT1 PERT0
W
Reset 00000000
Address 0x0244 (G3) Access: User read/write1
76543210
R0 0
PERT5 PERT4 PERT3 PERT2 PERT1 PERT0
W
Reset 00000000
Figure 2-19. Port T Pull Device Enable Register (PERT)
Table 2-38. PERT Register Field Descriptions
Field Description
7-2
PERT
Port T pull device enable—Enable pull device on input pin
This bit controls whether a pull device on the associated port input pin is active. If a pin is used as output this bit has
no effect. The polarity is selected by the related polarity select register bit.
1 Pull device enabled
0 Pull device disabled
1
PERT
Port T pull device enable—Enable pull device on input pin
This bit controls whether a pull device on the associated port input pin is active. The polarity is selected by the related
polarity select register bit. If this pin is used as IRQ only a pullup device can be enabled.
1 Pull device enabled
0 Pull device disabled
0
PERT
Port T pull device enable—Enable pull device on input pin
This bit controls whether a pull device on the associated port input pin is active. The polarity is selected by the related
polarity select register bit. If this pin is used as XIRQ only a pullup device can be enabled.
1 Pull device enabled
0 Pull device disabled
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
178 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.19 Port T Polarity Select Register (PPST)
2.4.3.20 Port S Data Register (PTS)
Address 0x0245 (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PPST7 PPST6 PPST5 PPST4 PPST3 PPST2 PPST1 PPST0
W
Reset 00000000
Address 0x0245 (G3) Access: User read/write1
76543210
R0 0
PPST5 PPST4 PPST3 PPST2 PPST1 PPST0
W
Reset 00000000
Figure 2-20. Port T Polarity Select Register (PPST)
Table 2-39. PPST Register Field Descriptions
Field Description
7-0
PPST
Port T pull device select—Configure pull device polarity on input pin
This bit selects a pullup or a pulldown device if enabled on the associated port input pin.
1 Pulldown device selected
0 Pullup device selected
Address 0x0248 Access: User read/write1
1Read: Anytime. The data source is depending on the data direction value.
Write: Anytime
76543210
R
PTS7 PTS6 PTS5 PTS4 PTS3 PTS2 PTS1 PTS0
W
00000000
Figure 2-21. Port S Data Register (PTS)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 179
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.21 Port S Input Register (PTIS)
2.4.3.22 Port S Data Direction Register (DDRS)
Table 2-40. PTS Register Field Descriptions
Field Description
7-0
PTS
Port S general-purpose input/output data—Data Register
When not used with an alternative signal, the associated pin can be used as general-purpose I/O. In
general-purpose output mode the port data register bit value is driven to the pin.
If the associated data direction bit is set to 1, a read returns the value of the port data register bit, otherwise the
buffered pin input state is read.
Address 0x0249 Access: User read only1
1Read: Anytime
Write:Never
76543210
R PTIS7 PTIS6 PTIS5 PTIS4 PTIS3 PTIS2 PTIS1 PTIS0
W
Reset 00000000
Figure 2-22. Port S Input Register (PTIS)
Table 2-41. PTIS Register Field Descriptions
Field Description
7-0
PTIS
Port S input data—
A read always returns the buffered input state of the associated pin. It can be used to detect overload or short circuit
conditions on output pins.
Address 0x024A Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
DDRS7 DDRS6 DDRS5 DDRS4 DDRS3 DDRS2 DDRS1 DDRS0
W
Reset 00000000
Figure 2-23. Port S Data Direction Register (DDRS)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
180 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.23 Port S Pull Device Enable Register (PERS)
2.4.3.24 Port S Polarity Select Register (PPSS)
Table 2-42. DDRS Register Field Descriptions
Field Description
7-0
DDRS
Port S data direction—
This bit determines whether the associated pin is a general-purpose input or output.
1 Associated pin configured as output
0 Associated pin configured as input
Address 0x024C Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PERS7 PERS6 PERS5 PERS4 PERS3 PERS2 PERS1 PERS0
W
Reset 11111111
Figure 2-24. Port S Pull Device Enable Register (PERS)
Table 2-43. PERS Register Field Descriptions
Field Description
7-0
PERS
Port S pull device enable—Enable pull device on input pin or wired-or output pin
This bit controls whether a pull device on the associated port input pin is active. The polarity is selected by the related
polarity select register bit. If a pin is used as output this bit has only effect if used in wired-or mode with a pullup
device.
1 Pull device enabled
0 Pull device disabled
Address 0x024D Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PPSS7 PPSS6 PPSS5 PPSS4 PPSS3 PPSS2 PPSS1 PPSS0
W
Reset 00000000
Figure 2-25. Port S Polarity Select Register (PPSS)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 181
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.25 Port S Wired-Or Mode Register (WOMS)
2.4.3.26 Pin Routing Register 0 (PRR0)
NOTE
Routing takes only effect if PKGCR is set to select the 20 TSSOP package.
Table 2-44. PPSS Register Field Descriptions
Field Description
7-0
PPSS
Port S pull device select—Configure pull device polarity on input pin
This bit selects a pullup or a pulldown device if enabled on the associated port input pin.
1 Pulldown device selected
0 Pullup device selected
Address 0x024E Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
WOMS7 WOMS6 WOMS5 WOMS4 WOMS3 WOMS2 WOMS1 WOMS0
W
Reset 00000000
Figure 2-26. Port S Wired-Or Mode Register (WOMS)
Table 2-45. WOMS Register Field Descriptions
Field Description
7-0
WOMS
Port S wired-or mode—Enable open-drain functionality on output pin
This bit configures an output pin as wired-or (open-drain) or push-pull. In wired-or mode a logic “0” is driven
active-low while a logic “1” remains undriven. This allows a multipoint connection of several serial modules. The bit
has no influence on pins used as input.
1 Output buffer operates as open-drain output.
0 Output buffer operates as push-pull output.
Address 0x024F Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PRR0P3 PRR0P2 PRR0T31 PRR0T30 PRR0T21 PRR0T20 PRR0S1 PRR0S0
W
Reset 00000000
Figure 2-27. Pin Routing Register (PRR0)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
182 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 2-46. PRR0 Register Field Descriptions
Field Description
7
PRR0P3
Pin Routing Register PWM3 —Select alternative routing of PWM3 output, ETRIG3 input
This bit programs the routing of the PWM3 channel and the ETRIG3 input to a different external pin in 20 TSSOP.
See Table 2-47 for more details.
6
PRR0P2
Pin Routing Register PWM2 —Select alternative routing of PWM2 output, ETRIG2 input
This bit programs the routing of the PWM2 channel and the ETRIG2 input to a different external pin in 20 TSSOP.
See Table 2-48 for more details.
5
PRR0T31
Pin Routing Register IOC3 —Select alternative routing of IOC3 output and input
Those two bits program the routing of the timer IOC3 channel to different external pins in 20 TSSOP.
See Table 2-49 for more details.
4
PRR0T30
3
PRR0T21
Pin Routing Register IOC2 —Select alternative routing of IOC2 output and input
Those two bits program the routing of the timer IOC2 channel to different external pins in 20 TSSOP.
See Table 2-50 for more details.
2
PRR0T20
1
PRR0S1
Pin Routing Register Serial Module —Select alternative routing of SCI0 pins
Those bits program the routing of the SCI0 module pins to different external pins in 20 TSSOP.
See Table 2-51 for more details.
0
PRR0S0
Table 2-47. PWM3/ETRIG3 Routing Options
PRR0P3 PWM3/ETRIG3 Associated Pin
0 PS7 - PWM3, ETRIG3
1 PAD5 - PWM3, ETRIG3
Table 2-48. PWM2/ETRIG2 Routing Options
PRR0P2 PWM2/ETRIG2 Associated Pin
0 PS4 - PWM2, ETRIG2
1 PAD4 - PWM2, ETRIG2
Table 2-49. IOC3 Routing Options
PRR0T31 PRR0T30 IOC3 Associated Pin
0 0 PS6 - IOC3
0 1 PE1 - IOC3
1 0 PAD5 - IOC3
1 1 Reserved
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 183
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.27 Port M Data Register (PTM)
Table 2-50. IOC2 Routing Options
PRR0T21 PRR0T20 IOC2 Associated Pin
0 0 PS5 - IOC2
0 1 PE0 - IOC2
1 0 PAD4 - IOC2
1 1 Reserved
Table 2-51. SCI0 Routing Options
PRR0S1 PRR0S0 SCI0 Associated Pin
0 0 PE0 - RXD, PE1 - TXD
0 1 PS4 - RXD, PS7 - TXD
1 0 PAD4 - RXD, PAD5 - TXD
1 1 Reserved
Address 0x0250 (G1, G2) Access: User read/write1
1Read: Anytime. The data source is depending on the data direction value.
Write: Anytime
76543210
R0000
PTM3 PTM2 PTM1 PTM0
W
Reset 00000000
Address 0x0250 (G3) Access: User read/write1
76543210
R000000
PTM1 PTM0
W
Reset 00000000
Figure 2-28. Port M Data Register (PTM)
Table 2-52. PTM Register Field Descriptions
Field Description
3-0
PTM
Port M general-purpose input/output data—Data Register
When not used with an alternative signal, the associated pin can be used as general-purpose I/O. In
general-purpose output mode the port data register bit value is driven to the pin.
If the associated data direction bit is set to 1, a read returns the value of the port data register bit, otherwise the
buffered pin input state is read.
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
184 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.28 Port M Input Register (PTIM)
2.4.3.29 Port M Data Direction Register (DDRM)
Address 0x0251 (G1, G2) Access: User read only1
1Read: Anytime
Write:Never
76543210
R0000PTIM3 PTIM2 PTIM1 PTIM0
W
Reset 00000000
Address 0x0251 (G3) Access: User read only1
76543210
R000000PTIM1 PTIM0
W
Reset 00000000
Figure 2-29. Port M Input Register (PTIM)
Table 2-53. PTIM Register Field Descriptions
Field Description
3-0
PTIM
Port M input data—
A read always returns the buffered input state of the associated pin. It can be used to detect overload or short circuit
conditions on output pins.
Address 0x0252 (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R0000
DDRM3 DDRM2 DDRM1 DDRM0
W
Reset 00000000
Address 0x0252 (G3) Access: User read/write1
76543210
R000000
DDRM1 DDRM0
W
Reset 00000000
Figure 2-30. Port M Data Direction Register (DDRM)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 185
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.30 Port M Pull Device Enable Register (PERM)
Table 2-54. DDRM Register Field Descriptions
Field Description
3-0
DDRM
Port M data direction—
This bit determines whether the associated pin is a general-purpose input or output.
1 Associated pin configured as output
0 Associated pin configured as input
Address 0x0254 (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R0000
PERM3 PERM2 PERM1 PERM0
W
Reset 00000000
Address 0x0254 (G3) Access: User read/write1
76543210
R000000
PERM1 PERM0
W
Reset 00000000
Figure 2-31. Port M Pull Device Enable Register (PERM)
Table 2-55. PERM Register Field Descriptions
Field Description
3-1
PERM
Port M pull device enable—Enable pull device on input pin or wired-or output pin
This bit controls whether a pull device on the associated port input pin is active. The polarity is selected by the related
polarity select register bit. If a pin is used as output this bit has only effect if used in wired-or mode with a pullup
device.
1 Pull device enabled
0 Pull device disabled
0
PERM
Port M pull device enable—Enable pull device on input pin or wired-or output pin
This bit controls whether a pull device on the associated port input pin is active. The polarity is selected by the related
polarity select register bit. If a pin is used as output this bit has only effect if used in wired-or mode with a pullup
device.
If CAN is active the selection of a pulldown device on the RXCAN input will have no effect.
1 Pull device enabled
0 Pull device disabled
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
186 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.31 Port M Polarity Select Register (PPSM)
2.4.3.32 Port M Wired-Or Mode Register (WOMM)
Address 0x0255 (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R0000
PPSM3 PPSM2 PPSM1 PPSM0
W
Reset 00000000
Address 0x0255 (G3) Access: User read/write1
76543210
R000000
PPSM1 PPSM0
W
Reset 00000000
Figure 2-32. Port M Polarity Select Register (PPSM)
Table 2-56. PPSM Register Field Descriptions
Field Description
3-0
PPSM
Port M pull device select—Configure pull device polarity on input pin
This bit selects a pullup or a pulldown device if enabled on the associated port input pin.
1 Pulldown device selected
0 Pullup device selected
Address 0x0256 (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R0000
WOMM3 WOMM2 WOMM1 WOMM0
W
Reset 00000000
Address 0x0256 (G3) Access: User read/write1
76543210
R000000
WOMM1 WOMM0
W
Reset 00000000
Figure 2-33. Port M Wired-Or Mode Register (WOMM)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 187
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.33 Package Code Register (PKGCR)
Table 2-57. WOMM Register Field Descriptions
Field Description
3-0
WOMM
Port M wired-or mode—Enable open-drain functionality on output pin
This bit configures an output pin as wired-or (open-drain) or push-pull. In wired-or mode a logic “0” is driven
active-low while a logic “1” remains undriven. This allows a multipoint connection of several serial modules. The bit
has no influence on pins used as input.
1 Output buffer operates as open-drain output.
0 Output buffer operates as push-pull output.
Address 0x0257 Access: User read/write1
1Read: Anytime
Write:
APICLKS7: Anytime
PKGCR2-0: Once in normal mode, anytime in special mode
76543210
R
APICLKS7
0000
PKGCR2 PKGCR1 PKGCR0
W
Reset 00000FFF
After deassert of system reset the values are automatically loaded from the Flash memory. See device specification
for details.
Figure 2-34. Package Code Register (PKGCR)
Table 2-58. PKGCR Register Field Descriptions
Field Description
7
APICLKS7
Pin Routing Register API_EXTCLK —Select PS7 as API_EXTCLK output
When set to 1 the API_EXTCLK output will be routed to PS7. The default pin will be disconnected in all packages
except 20 TSSOP, which has no default location for API_EXTCLK. See Table 2-59 for more details.
2-0
PKGCR
Package Code Register —Select package in use
Those bits are preset by factory and reflect the package in use. See Table 2-60 for code definition.
The bits can be modified once after reset to allow software development for a different package. In any other
application it is recommended to re-write the actual package code once after reset to lock the register from
inadvertent changes during operation.
Writing reserved codes or codes of larger packages than the given device is offered in are illegal. In these cases the
code will be converted to PKGCR[2:0]=0b111 and select the maximum available package option for the given device.
Codes writes of smaller packages than the given device is offered in are not restricted.
Depending on the package selection the input buffers of non-bonded pins are disabled to avoid shoot-through
current. Also a predefined signal routing will take effect.
Refer also to Section 2.6.5, “Emulation of Smaller Packages”.
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
188 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.34 Port P Data Register (PTP)
Table 2-59. API_EXTCLK Routing Options
APICLKS7 API_EXTCLK Associated Pin
0 PB1 (100 LQFP)
PP0 (64/48/32 LQFP)
N.C. (20TSSOP)
1 PS7
Table 2-60. Package Options
PKGCR2 PKGCR1 PKGCR0 Selected Package
1 1 1 Reserved1
1Reading this value indicates an illegal code write or uninitialized factory programming.
1 1 0 100 LQFP
1 0 1 Reserved
1 0 0 64 LQFP
0 1 1 48 LQFP
0 1 0 Reserved
0 0 1 32 LQFP
0 0 0 20 TSSOP
Address 0x0258 (G1, G2) Access: User read/write1
1Read: Anytime. The data source is depending on the data direction value.
Write: Anytime
76543210
R
PTP7 PTP6 PTP5 PTP4 PTP3 PTP2 PTP1 PTP0
W
Reset 00000000
Address 0x0258 (G3) Access: User read/write1
76543210
R0 0
PTP5 PTP4 PTP3 PTP2 PTP1 PTP0
W
Reset 00000000
Figure 2-35. Port P Data Register (PTP)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 189
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.35 Port P Input Register (PTIP)
Table 2-61. PTP Register Field Descriptions
Field Description
7-0
PTP
Port P general-purpose input/output data—Data Register
When not used with an alternative signal, the associated pin can be used as general-purpose I/O. In
general-purpose output mode the port data register bit value is driven to the pin.
If the associated data direction bit is set to 1, a read returns the value of the port data register bit, otherwise the
buffered pin input state is read.
Address 0x0259 (G1, G2) Access: User read only1
1Read: Anytime
Write:Never
76543210
R PTIP7 PTIP6 PTIP5 PTIP4 PTIP3 PTIP2 PTIP1 PTIP0
W
Reset 00000000
Address 0x0259 (G3) Access: User read only1
76543210
R 0 0 PTIP5 PTIP4 PTIP3 PTIP2 PTIP1 PTIP0
W
Reset 00000000
Figure 2-36. Port P Input Register (PTIP)
Table 2-62. PTIP Register Field Descriptions
Field Description
7-0
PTIP
Port P input data—
A read always returns the buffered input state of the associated pin. It can be used to detect overload or short circuit
conditions on output pins.
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
190 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.36 Port P Data Direction Register (DDRP)
2.4.3.37 Port P Pull Device Enable Register (PERP)
Address 0x025A (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
DDRP7 DDRP6 DDRP5 DDRP4 DDRP3 DDRP2 DDRP1 DDRP0
W
Reset 00000000
Address 0x025A (G3) Access: User read/write1
76543210
R0 0
DDRP5 DDRP4 DDRP3 DDRP2 DDRP1 DDRP0
W
Reset 00000000
Figure 2-37. Port P Data Direction Register (DDRP)
Table 2-63. DDRP Register Field Descriptions
Field Description
7-0
DDRP
Port P data direction—
This bit determines whether the associated pin is an input or output.
1 Associated pin configured as output
0 Associated pin configured as input
Address 0x025C (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PERP7 PERP6 PERP5 PERP4 PERP3 PERP2 PERP1 PERP0
W
Reset 00000000
Address 0x025C (G3) Access: User read/write1
76543210
R0 0
PERP5 PERP4 PERP3 PERP2 PERP1 PERP0
W
Reset 00000000
Figure 2-38. Port P Pull Device Enable Register (PERP)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 191
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.38 Port P Polarity Select Register (PPSP)
Table 2-64. PERP Register Field Descriptions
Field Description
7-0
PERP
Port P pull device enable—Enable pull device on input pin
This bit controls whether a pull device on the associated port input pin is active. If a pin is used as output this bit has
no effect. The polarity is selected by the related polarity select register bit.
1 Pull device enabled
0 Pull device disabled
Address 0x025D (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PPSP7 PPSP6 PPSP5 PPSP4 PPSP3 PPSP2 PPSP1 PPSP0
W
Reset 00000000
Address 0x025D (G3) Access: User read/write1
76543210
R0 0
PPSP5 PPSP4 PPSP3 PPSP2 PPSP1 PPSP0
W
Reset 00000000
Figure 2-39. Port P Polarity Select Register (PPSP)
Table 2-65. PPSP Register Field Descriptions
Field Description
7-0
PPSP
Port P pull device select—Configure pull device and pin interrupt edge polarity on input pin
This bit selects a pullup or a pulldown device if enabled on the associated port input pin.
This bit also selects the polarity of the active pin interrupt edge.
1 Pulldown device selected; rising edge selected
0 Pullup device selected; falling edge selected
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
192 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.39 Port P Interrupt Enable Register (PIEP)
Read: Anytime
2.4.3.40 Port P Interrupt Flag Register (PIFP)
Address 0x025E (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PIEP7 PIEP6 PIEP5 PIEP4 PIEP3 PIEP2 PIEP1 PIEP0
W
Reset 00000000
Address 0x025E (G3) Access: User read/write1
76543210
R0 0
PIEP5 PIEP4 PIEP3 PIEP2 PIEP1 PIEP0
W
Reset 00000000
Figure 2-40. Port P Interrupt Enable Register (PIEP)
Table 2-66. PIEP Register Field Descriptions
Field Description
7-0
PIEP
Port P interrupt enable—
This bit enables or disables the edge sensitive pin interrupt on the associated pin. An interrupt can be generated if
the pin is operating in input or output mode when in use with the general-purpose or related peripheral function.
1 Interrupt is enabled
0 Interrupt is disabled (interrupt flag masked)
Address 0x025F (G1, G2) Access: User read/write1
76543210
R
PIFP7 PIFP6 PIFP5 PIFP4 PIFP3 PIFP2 PIFP1 PIFP0
W
Reset 00000000
Address 0x025F (G3) Access: User read/write1
76543210
R0 0
PIFP5 PIFP4 PIFP3 PIFP2 PIFP1 PIFP0
W
Reset 00000000
Figure 2-41. Port P Interrupt Flag Register (PIFP)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 193
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.41 Reserved Registers
NOTE
Addresses 0x0260-0x0261 are reserved for ACMP registers in G2 and G3
only. Refer to Section 3.6.2.1, “ACMP Control Register (ACMPC)” and
Section 3.6.2.2, “ACMP Status Register (ACMPS)”.
2.4.3.42 Port J Data Register (PTJ)
1Read: Anytime
Write: Anytime, write 1 to clear
Table 2-67. PIFP Register Field Descriptions
Field Description
7-0
PIFP
Port P interrupt flag—
If the associated interrupt enable bit is set this flag asserts after a valid active edge was detected on the related pin
(see Section 2.5.4.2, “Pin Interrupts and Wakeup”). This can be a rising or a falling edge based on the state of the
polarity select register.
Writing a logic “1” to the corresponding bit field clears the flag.
1 Active edge on the associated bit has occurred (an interrupt will occur if the associated enable bit is set)
0 No active edge occurred
Address 0x0268 (G1, G2) Access: User read/write1
1Read: Anytime. The data source is depending on the data direction value.
Write: Anytime
76543210
R
PTJ7 PTJ6 PTJ5 PTJ4 PTJ3 PTJ2 PTJ1 PTJ0
W
Reset 00000000
Address 0x0268 (G3) Access: User read/write1
76543210
R0000
PTJ3 PTJ2 PTJ1 PTJ0
W
Reset 00000000
Figure 2-42. Port J Data Register (PTJ)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
194 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.43 Port J Input Register (PTIJ)
Table 2-69. PTJ Register Field Descriptions
Field Description
7-0
PTJ
Port J general-purpose input/output data—Data Register
When not used with an alternative signal, the associated pin can be used as general-purpose I/O. In
general-purpose output mode the port data register bit value is driven to the pin.
If the associated data direction bit is set to 1, a read returns the value of the port data register bit, otherwise the
buffered pin input state is read.
Address 0x0269 (G1, G2) Access: User read only1
1Read: Anytime
Write:Never
76543210
R PTIJ7 PTIJ6 PTIJ5 PTIJ4 PTIJ3 PTIJ2 PTIJ1 PTIJ0
W
Reset 00000000
Address 0x0269 (G3) Access: User read only1
76543210
R0000PTIJ3 PTIJ2 PTIJ1 PTIJ0
W
Reset 00000000
Figure 2-43. Port J Input Register (PTIJ)
Table 2-70. PTIJ Register Field Descriptions
Field Description
7-0
PTIJ
Port J input data—
A read always returns the buffered input state of the associated pin. It can be used to detect overload or short circuit
conditions on output pins.
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 195
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.44 Port J Data Direction Register (DDRJ)
2.4.3.45 Port J Pull Device Enable Register (PERJ)
Address 0x026A (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
DDRJ7 DDRJ6 DDRJ5 DDRJ4 DDRJ3 DDRJ2 DDRJ1 DDRJ0
W
Reset 00000000
Address 0x026A (G3) Access: User read/write1
76543210
R0000
DDRJ3 DDRJ2 DDRJ1 DDRJ0
W
Reset 00000000
Figure 2-44. Port J Data Direction Register (DDRJ)
Table 2-71. DDRJ Register Field Descriptions
Field Description
7-0
DDRJ
Port J data direction—
This bit determines whether the associated pin is an input or output.
1 Associated pin configured as output
0 Associated pin configured as input
Address 0x026C (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PERJ7 PERJ6 PERJ5 PERJ4 PERJ3 PERJ2 PERJ1 PERJ0
W
Reset 11111111
Address 0x026C (G3) Access: User read/write1
76543210
R0000
PERJ3 PERJ2 PERJ1 PERJ0
W
Reset 00001111
Figure 2-45. Port J Pull Device Enable Register (PERJ)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
196 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.46 Port J Polarity Select Register (PPSJ)
Table 2-72. PERJ Register Field Descriptions
Field Description
7-0
PERJ
Port J pull device enable—Enable pull device on input pin
This bit controls whether a pull device on the associated port input pin is active. If a pin is used as output this bit has
no effect. The polarity is selected by the related polarity select register bit.
1 Pull device enabled
0 Pull device disabled
Address 0x026D (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PPSJ7 PPSJ6 PPSJ5 PPSJ4 PPSJ3 PPSJ2 PPSJ1 PPSJ0
W
Reset 00000000
Address 0x026D (G3) Access: User read/write1
76543210
R0000
PPSJ3 PPSJ2 PPSJ1 PPSJ0
W
Reset 00000000
Figure 2-46. Port J Polarity Select Register (PPSJ)
Table 2-73. PPSJ Register Field Descriptions
Field Description
7-0
PPSJ
Port J pull device select—Configure pull device and pin interrupt edge polarity on input pin
This bit selects a pullup or a pulldown device if enabled on the associated port input pin.
This bit also selects the polarity of the active pin interrupt edge.
1 Pulldown device selected; rising edge selected
0 Pullup device selected; falling edge selected
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 197
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.47 Port J Interrupt Enable Register (PIEJ)
Read: Anytime
2.4.3.48 Port J Interrupt Flag Register (PIFJ)
Address 0x026E (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PIEJ7 PIEJ6 PIEJ5 PIEJ4 PIEJ3 PIEJ2 PIEJ1 PIEJ0
W
Reset 00000000
Address 0x026E (G3) Access: User read/write1
76543210
R0000
PIEJ3 PIEJ2 PIEJ1 PIEJ0
W
Reset 00000000
Figure 2-47. Port J Interrupt Enable Register (PIEJ)
Table 2-74. PIEJ Register Field Descriptions
Field Description
7-0
PIEJ
Port J interrupt enable—
This bit enables or disables the edge sensitive pin interrupt on the associated pin. An interrupt can be generated if
the pin is operating in input or output mode when in use with the general-purpose or related peripheral function.
1 Interrupt is enabled
0 Interrupt is disabled (interrupt flag masked)
Address 0x026F (G1, G2) Access: User read/write1
76543210
R
PIFJ7 PIFJ6 PIFJ5 PIFJ4 PIFJ3 PIFJ2 PIFJ1 PIFJ0
W
Reset 00000000
Address 0x026F (G3) Access: User read/write1
76543210
R0000
PIFJ3 PIFJ2 PIFJ1 PIFJ0
W
Reset 00000000
Figure 2-48. Port J Interrupt Flag Register (PIFJ)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
198 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.49 Port AD Data Register (PT0AD)
1Read: Anytime
Write: Anytime, write 1 to clear
Table 2-75. PIFJ Register Field Descriptions
Field Description
7-0
PIFJ
Port J interrupt flag—
If the associated interrupt enable bit is set this flag asserts after a valid active edge was detected on the related pin
(see Section 2.5.4.2, “Pin Interrupts and Wakeup”). This can be a rising or a falling edge based on the state of the
polarity select register.
Writing a logic “1” to the corresponding bit field clears the flag.
1 Active edge on the associated bit has occurred (an interrupt will occur if the associated enable bit is set)
0 No active edge occurred
Address 0x0270 (G1, G2) Access: User read/write1
1Read: Anytime. The data source is depending on the data direction value.
Write: Anytime
76543210
R
PT0AD7 PT0AD6 PT0AD5 PT0AD4 PT0AD3 PT0AD2 PT0AD1 PT0AD0
W
Reset 00000000
Address 0x0270 (G3) Access: User read/write1
76543210
R0000
PT0AD3 PT0AD2 PT0AD1 PT0AD0
W
Reset 00000000
Figure 2-49. Port AD Data Register (PT0AD)
Table 2-76. PT0AD Register Field Descriptions
Field Description
7-0
PT0AD
Port AD general-purpose input/output data—Data Register
When not used with an alternative signal, the associated pin can be used as general-purpose I/O. In
general-purpose output mode the port data register bit value is driven to the pin.
If the associated data direction bit is set to 1, a read returns the value of the port data register bit, otherwise the
buffered pin input state is read if the digital input buffers are enabled (Section 2.3.12, “Pins AD15-0”).
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 199
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.50 Port AD Data Register (PT1AD)
2.4.3.51 Port AD Input Register (PTI0AD)
Address 0x0271 Access: User read/write1
1Read: Anytime. The data source is depending on the data direction value.
Write: Anytime
76543210
R
PT1AD7 PT1AD6 PT1AD5 PT1AD4 PT1AD3 PT1AD2 PT1AD1 PT1AD0
W
Reset 00000000
Figure 2-50. Port AD Data Register (PT1AD)
Table 2-77. PT1AD Register Field Descriptions
Field Description
7-0
PT1AD
Port AD general-purpose input/output data—Data Register
When not used with an alternative signal, the associated pin can be used as general-purpose I/O. In
general-purpose output mode the port data register bit value is driven to the pin.
If the associated data direction bit is set to 1, a read returns the value of the port data register bit, otherwise the
buffered pin input state is read if the digital input buffers are enabled (Section 2.3.12, “Pins AD15-0”).
Address 0x0272 (G1, G2) Access: User read only1
1Read: Anytime
Write: Never
76543210
R PTI0AD7 PTI0AD6 PTI0AD5 PTI0AD4 PTI0AD3 PTI0AD2 PTI0AD1 PTI0AD0
W
Reset 00000000
Address 0x0272 (G3) Access: User read only1
76543210
R0000PTI0AD3 PTI0AD2 PTI0AD1 PTI0AD0
W
Reset 00000000
Figure 2-51. Port AD Input Register (PTI0AD)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
200 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.52 Port AD Input Register (PTI1AD)
2.4.3.53 Port AD Data Direction Register (DDR0AD)
Table 2-78. PTI0AD Register Field Descriptions
Field Description
7-0
PTI0AD
Port AD input data—
A read always returns the buffered input state of the associated pin. It can be used to detect overload or short circuit
conditions on output pins.
Address 0x0273 Access: User read only1
1Read: Anytime
Write: Never
76543210
R PTI1AD7 PTI1AD6 PTI1AD5 PTI1AD4 PTI1AD3 PTI1AD2 PTI1AD1 PTI1AD0
W
Reset 00000000
Figure 2-52. Port AD Input Register (PTI1AD)
Table 2-79. PTI1AD Register Field Descriptions
Field Description
7-0
PTI1AD
Port AD input data—
A read always returns the buffered input state of the associated pin. It can be used to detect overload or short circuit
conditions on output pins.
Address 0x0274 (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
DDR0AD7 DDR0AD6 DDR0AD5 DDR0AD4 DDR0AD3 DDR0AD2 DDR0AD1 DDR0AD0
W
Reset 00000000
Address 0x0274 (G3) Access: User read/write1
76543210
R0000
DDR0AD3 DDR0AD2 DDR0AD1 DDR0AD0
W
Reset 00000000
Figure 2-53. Port AD Data Direction Register (DDR0AD)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 201
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.54 Port AD Data Direction Register (DDR1AD)
2.4.3.55 Reserved Register
NOTE
Address 0x0276 is reserved for RVA on G(A)240 and G(A)192 only. Refer
to Section 4.6.2.1, “RVA Control Register (RVACTL)”.
2.4.3.56 Pin Routing Register 1 (PRR1)
NOTE
Routing takes only effect if PKGCR is set to select the 100 LQFP package.
Table 2-80. DDR0AD Register Field Descriptions
Field Description
7-0
DDR0AD
Port AD data direction—
This bit determines whether the associated pin is an input or output.
1 Associated pin configured as output
0 Associated pin configured as input
Address 0x0275 Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
DDR1AD7 DDR1AD6 DDR1AD5 DDR1AD4 DDR1AD3 DDR1AD2 DDR1AD1 DDR1AD0
W
Reset 00000000
Figure 2-54. Port AD Data Direction Register (DDR1AD)
Table 2-81. DDR1AD Register Field Descriptions
Field Description
7-0
DDR1AD
Port AD data direction—
This bit determines whether the associated pin is an input or output.
1 Associated pin configured as output
0 Associated pin configured as input
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
202 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Address 0x0277 (G(A)240 and G(A)192 only) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R0000000
PRR1AN
W
Reset 00000000
Address 0x0277 (non G(A)240 and G(A)192) Access: User read/write
76543210
R00000000
W
Reset 00000000
Figure 2-55. Pin Routing Register (PRR1)
Table 2-82. PRR1 Register Field Descriptions
Field Description
0
PRR1AN
Pin Routing Register ADC channels — Select alternative routing for AN15/14/13/11/10 pins to port C
This bit programs the routing of the specific ADC channels to alternative external pins in 100 LQFP. See Table 2-83.
The routing affects the analog signals and digital input trigger paths to the ADC. Refer to the related pin descriptions
in Section 2.3.4, “Pins PC7-0” and Section 2.3.12, “Pins AD15-0”.
1 AN inputs on port C
0 AN inputs on port AD
Table 2-83. AN Routing Options
PRR1AN Associated Pins
0 AN10 - PAD10
AN11 - PAD11
AN13 - PAD13
AN14 - PAD14
AN15 - PAD15
1 AN10 - PC0
AN11 - PC1
AN13 - PC2
AN14 - PC3
AN15 - PC4
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 203
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.57 Port AD Pull Enable Register (PER0AD)
2.4.3.58 Port AD Pull Enable Register (PER1AD)
Address 0x0278 (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PER0AD7 PER0AD6 PER0AD5 PER0AD4 PER0AD3 PER0AD2 PER0AD1 PER0AD0
W
Reset 00000000
Address 0x0278 (G3) Access: User read/write1
76543210
R0000
PER0AD3 PER0AD2 PER0AD1 PER0AD0
W
Reset 00000000
Figure 2-56. Port AD Pullup Enable Register (PER0AD)
Table 2-84. PER0AD Register Field Descriptions
Field Description
7-0
PER0AD
Port AD pull enable—Enable pull device on input pin
This bit controls whether a pull device on the associated port input pin is active. If a pin is used as output this bit has
no effect. The polarity is selected by the related polarity select register bit.
1 Pull device enabled
0 Pull device disabled
Address 0x0279 Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PER1AD7 PER1AD6 PER1AD5 PER1AD4 PER1AD3 PER1AD2 PER1AD1 PER1AD0
W
Reset 00000000
Figure 2-57. Port AD Pullup Enable Register (PER1AD)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
204 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.59 Port AD Polarity Select Register (PPS0AD)
Table 2-85. PER1AD Register Field Descriptions
Field Description
7-0
PER1AD
Port AD pull enable—Enable pull device on input pin
This bit controls whether a pull device on the associated port input pin is active. If a pin is used as output this bit has
no effect. The polarity is selected by the related polarity select register bit.
1 Pull device enabled
0 Pull device disabled
Address 0x027A (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PPS0AD7 PPS0AD6 PPS0AD5 PPS0AD4 PPS0AD3 PPS0AD2 PPS0AD1 PPS0AD0
W
Reset 00000000
Address 0x027A (G3) Access: User read/write1
76543210
R0000
PPS0AD3 PPS0AD2 PPS0AD1 PPS0AD0
W
Reset 00000000
Figure 2-58. Port AD Polarity Select Register (PPS0AD)
Table 2-86. PPS0AD Register Field Descriptions
Field Description
7-0
PPS0AD
Port AD pull device select—Configure pull device and pin interrupt edge polarity on input pin
This bit selects a pullup or a pulldown device if enabled on the associated port input pin.
This bit also selects the polarity of the active pin interrupt edge.
1 Pulldown device selected; rising edge selected
0 Pullup device selected; falling edge selected
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 205
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.60 Port AD Polarity Select Register (PPS1AD)
2.4.3.61 Port AD Interrupt Enable Register (PIE0AD)
Read: Anytime
Address 0x027B Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PPS1AD7 PPS1AD6 PPS1AD5 PPS1AD4 PPS1AD3 PPS1AD2 PPS1AD1 PPS1AD0
W
Reset 00000000
Figure 2-59. Port AD Polarity Select Register (PPS1AD)
Table 2-87. PPS1AD Register Field Descriptions
Field Description
7-0
PPS1AD
Port AD pull device select—Configure pull device and pin interrupt edge polarity on input pin
This bit selects a pullup or a pulldown device if enabled on the associated port input pin.
This bit also selects the polarity of the active pin interrupt edge.
1 Pulldown device selected; rising edge selected
0 Pullup device selected; falling edge selected
Address 0x027C (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PIE0AD7 PIE0AD6 PIE0AD5 PIE0AD4 PIE0AD3 PIE0AD2 PIE0AD1 PIE0AD0
W
Reset 00000000
Address 0x027C (G3) Access: User read/write1
76543210
R0000
PIE0AD3 PIE0AD2 PIE0AD1 PIE0AD0
W
Reset 00000000
Figure 2-60. Port AD Interrupt Enable Register (PIE0AD)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
206 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.62 Port AD Interrupt Enable Register (PIE1AD)
Read: Anytime
Table 2-88. PIE0AD Register Field Descriptions
Field Description
7-0
PIE0AD
Port AD interrupt enable—
This bit enables or disables the edge sensitive pin interrupt on the associated pin. An interrupt can be generated if
the pin is operating in input or output mode when in use with the general-purpose or related peripheral function.
1 Interrupt is enabled
0 Interrupt is disabled (interrupt flag masked)
Address 0x027D Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PIE1AD7 PIE1AD6 PIE1AD5 PIE1AD4 PIE1AD3 PIE1AD2 PIE1AD1 PIE1AD0
W
Reset 00000000
Figure 2-61. Port AD Interrupt Enable Register (PIE1AD)
Table 2-89. PIE1AD Register Field Descriptions
Field Description
7-0
PIE1AD
Port AD interrupt enable—
This bit enables or disables the edge sensitive pin interrupt on the associated pin. An interrupt can be generated if
the pin is operating in input or output mode when in use with the general-purpose or related peripheral function.
1 Interrupt is enabled
0 Interrupt is disabled (interrupt flag masked)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 207
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.4.3.63 Port AD Interrupt Flag Register (PIF0AD)
2.4.3.64 Port AD Interrupt Flag Register (PIF1AD)
Address 0x027E (G1, G2) Access: User read/write1
1Read: Anytime
Write: Anytime, write 1 to clear
76543210
R
PIF0AD7 PIF0AD6 PIF0AD5 PIF0AD4 PIF0AD3 PIF0AD2 PIF0AD1 PIF0AD0
W
Reset 00000000
Address 0x027E (G3) Access: User read/write1
76543210
R0000
PIF0AD3 PIF0AD2 PIF0AD1 PIF0AD0
W
Reset 00000000
Figure 2-62. Port AD Interrupt Flag Register (PIF0AD)
Table 2-90. PIF0AD Register Field Descriptions
Field Description
7-0
PIF0AD
Port AD interrupt flag—
If the associated interrupt enable bit is set this flag asserts after a valid active edge was detected on the related pin
(see Section 2.4.2.1, “Block Register Map (G1)”). This can be a rising or a falling edge based on the state of the
polarity select register.
Writing a logic “1” to the corresponding bit field clears the flag.
1 Active edge on the associated bit has occurred (an interrupt will occur if the associated enable bit is set)
0 No active edge occurred
Address 0x027F Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
PIF1AD7 PIF1AD6 PIF1AD5 PIF1AD4 PIF1AD3 PIF1AD2 PIF1AD1 PIF1AD0
W
Reset 00000000
Figure 2-63. Port AD Interrupt Flag Register (PIF1AD)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
208 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.5 PIM Ports - Functional Description
2.5.1 General
Each pin except BKGD can act as general-purpose I/O. In addition most pins can act as an output or input
of a peripheral module.
2.5.2 Registers
A set of configuration registers is common to all ports with exception of the ADC port (Table 2-92). All
registers can be written at any time, however a specific configuration might not become active.
Example: Selecting a pullup device. This device does not become active while the port is used as a
push-pull output.
Table 2-91. PIF1AD Register Field Descriptions
Field Description
7-0
PIF1AD
Port AD interrupt flag—
If the associated interrupt enable bit is set this flag asserts after a valid active edge was detected on the related pin
(see Section 2.5.4.2, “Pin Interrupts and Wakeup”). This can be a rising or a falling edge based on the state of the
polarity select register.
Writing a logic “1” to the corresponding bit field clears the flag.
1 Active edge on the associated bit has occurred (an interrupt will occur if the associated enable bit is set)
0 No active edge occurred
Table 2-92. Register availability per port1
1Each cell represents one register with individual configuration bits
Port
Data
(Portx,
PTx)
Input
(PTIx)
Data
Direction
(DDRx)
Pull
Enable
(PERx)
Polarity
Select
(PPSx)
Wired-
Or Mode
(WOMx)
Interrupt
Enable
(PIEx)
Interrupt
Flag
(PIFx)
A yes - yes
yes
----
Byes-yes ----
Cyes-yes ----
Dyes-yes ----
Eyes-yes ----
T yes yes yes yes yes - - -
S yes yes yes yes yes yes - -
M yes yes yes yes yes yes - -
P yes yes yes yes yes - yes yes
J yes yes yes yes yes - yes yes
AD yes yes yes yes yes - yes yes
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 209
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.5.2.1 Data Register (PORTx, PTx)
This register holds the value driven out to the pin if the pin is used as a general-purpose I/O.
Writing to this register has only an effect on the pin if the pin is used as general-purpose output. When
reading this address, the buffered state of the pin is returned if the associated data direction register bit is
set to 0.
If the data direction register bits are set to 1, the contents of the data register is returned. This is independent
of any other configuration (Figure 2-64).
2.5.2.2 Input Register (PTIx)
This register is read-only and always returns the buffered state of the pin (Figure 2-64).
2.5.2.3 Data Direction Register (DDRx)
This register defines whether the pin is used as an general-purpose input or an output.
If a peripheral module controls the pin the contents of the data direction register is ignored (Figure 2-64).
Independent of the pin usage with a peripheral module this register determines the source of data when
reading the associated data register address (2.5.2.1/2-209).
NOTE
Due to internal synchronization circuits, it can take up to 2 bus clock cycles
until the correct value is read on port data or port input registers, when
changing the data direction register.
Figure 2-64. Illustration of I/O pin functionality
PT
DDR
output enable
module enable
1
0
1
1
0
0
PIN
PTI
data out
Module
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
210 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.5.2.4 Pull Device Enable Register (PERx)
This register turns on a pullup or pulldown device on the related pins determined by the associated polarity
select register (2.5.2.5/2-210).
The pull device becomes active only if the pin is used as an input or as a wired-or output. Some peripheral
module only allow certain configurations of pull devices to become active. Refer to Section 2.3, “PIM
Routing - Functional description”.
2.5.2.5 Pin Polarity Select Register (PPSx)
This register selects either a pullup or pulldown device if enabled.
It becomes only active if the pin is used as an input. A pullup device can be activated if the pin is used as
a wired-or output.
2.5.2.6 Wired-Or Mode Register (WOMx)
If the pin is used as an output this register turns off the active-high drive. This allows wired-or type
connections of outputs.
2.5.2.7 Interrupt Enable Register (PIEx)
If the pin is used as an interrupt input this register serves as a mask to the interrupt flag to enable/disable
the interrupt.
2.5.2.8 Interrupt Flag Register (PIFx)
If the pin is used as an interrupt input this register holds the interrupt flag after a valid pin event.
2.5.2.9 Pin Routing Register (PRRx)
This register allows software re-configuration of the pinouts for specific peripherals in the 20 TSSOP
package only.
2.5.2.10 Package Code Register (PKGCR)
This register determines the package in use. Pre programmed by factory.
2.5.3 Pin Configuration Summary
The following table summarizes the effect of the various configuration bits, that is data direction (DDR),
output level (IO), pull enable (PE), pull select (PS) on the pin function and pull device activity.
The configuration bit PS is used for two purposes:
1. Configure the sensitive interrupt edge (rising or falling), if interrupt is enabled.
2. Select either a pullup or pulldown device if PE is active.
Port Integration Module (S12GPIMV0)
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Freescale Semiconductor 211
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 2-93. Pin Configuration Summary
2.5.4 Interrupts
This section describes the interrupts generated by the PIM and their individual sources. Vector addresses
and interrupt priorities are defined at MCU level.
2.5.4.1 XIRQ, IRQ Interrupts
The XIRQ pin allows requesting non-maskable interrupts after reset initialization. During reset, the X bit
in the condition code register is set and any interrupts are masked until software enables them.
The IRQ pin allows requesting asynchronous interrupts. The interrupt input is disabled out of reset. To
enable the interrupt the IRQCR[IRQEN] bit must be set and the I bit cleared in the condition code register.
The interrupt can be configured for level-sensitive or falling-edge-sensitive triggering. If IRQCR[IRQEN]
is cleared while an interrupt is pending, the request will deassert.
DDR IO PE PS1
1Always “0” on port A, B, C, D, BKGD. Always “1” on port E
IE2
2Applicable only on port P, J and AD.
Function Pull Device Interrupt
0 x 0 x 0 Input3
3Port AD: Assuming digital input buffer enabled in ADC module (ATDDIEN) and ACMP module (ACDIEN)
Disabled Disabled
0 x 1 0 0 Input3Pullup Disabled
0 x 1 1 0 Input3Pulldown Disabled
0 x 0 0 1 Input3Disabled Falling edge
0 x 0 1 1 Input3Disabled Rising edge
0 x 1 0 1 Input3Pullup Falling edge
0 x 1 1 1 Input3Pulldown Rising edge
1 0 x x 0 Output, drive to 0 Disabled Disabled
1 1 x x 0 Output, drive to 1 Disabled Disabled
1 0 x 0 1 Output, drive to 0 Disabled Falling edge
1 1 x 1 1 Output, drive to 1 Disabled Rising edge
Table 2-94. PIM Interrupt Sources
Module Interrupt Sources Local Enable
XIRQ None
IRQ IRQCR[IRQEN]
Port P pin interrupt PIEP[PIEP5-PIEP0]
Port J pin interrupt PIEJ[PIEJ3-PIEJ0]
Port AD pin interrupt PIE0AD[PIE0AD3-PIE0AD0]
PIE1AD[PIE1AD7-PIE1AD0]
Port Integration Module (S12GPIMV0)
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Both interrupts are capable to wake-up the device from stop mode. Means for glitch filtering are not
provided on these pins.
2.5.4.2 Pin Interrupts and Wakeup
Ports P, J and AD offer pin interrupt capability. The related interrupt enable (PIE) as well as the sensitivity
to rising or falling edges (PPS) can be individually configured on per-pin basis. All bits/pins in a port share
the same interrupt vector. Interrupts can be used with the pins configured as inputs or outputs.
An interrupt is generated when a port interrupt flag (PIF) and its corresponding port interrupt enable (PIE)
are both set. The pin interrupt feature is also capable to wake up the CPU when it is in stop or wait mode.
A digital filter on each pin prevents short pulses from generating an interrupt. A valid edge on an input is
detected if 4 consecutive samples of a passive level are followed by 4 consecutive samples of an active
level. Else the sampling logic is restarted.
In run and wait mode the filters are continuously clocked by the bus clock. Pulses with a duration of tPULSE
<n
P_MASK/fbus are assuredly filtered out while pulses with a duration of tPULSE >n
P_PASS/fbus guarantee
a pin interrupt.
In stop mode the clock is generated by an RC-oscillator. The minimum pulse length varies over process
conditions, temperature and voltage (Figure 2-65). Pulses with a duration of tPULSE < tP_MASK are
assuredly filtered out while pulses with a duration of tPULSE > tP_PASS guarantee a wakeup event.
Please refer to the appendix table “Pin Interrupt Characteristics” for pulse length limits.
To maximize current saving the RC oscillator is active only if the following condition is true on any
individual pin:
Sample count <= 4 (at active or passive level) and interrupt enabled (PIE=1) and interrupt flag not set
(PIF=0).
Figure 2-65. Interrupt Glitch Filter (here: active low level selected)
Glitch, filtered out, no interrupt flag set
Valid pulse, interrupt flag set uncertain
tPULSE(min) tPULSE(max)
Port Integration Module (S12GPIMV0)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 213
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2.6 Initialization/Application Information
2.6.1 Initialization
After a system reset, software should:
1. Read the PKGCR and write to it with its preset content to engage the write lock on
PKGCR[PKGCR2:PKGCR0] bits protecting the device from inadvertent changes to the pin layout
in normal applications.
2. Write to PRR0 in 20 TSSOP to define the module routing and to PKGCR[APICLKS7] bit in any
package for API_EXTCLK.
GA240 / GA192 devices only:
3. In applications using the analog functions on port C pins shared with AMPM1, AMPP1 or DACU1
the input buffers should be disabled early after reset by enabling the related mode of the DAC1
module. This shortens the time of potentially increased power consumption caused by the digital
input buffers operating in the linear region.
2.6.2 Port Data and Data Direction Register writes
It is not recommended to write PORTx/PTx and DDRx in a word access. When changing the register pins
from inputs to outputs, the data may have extra transitions during the write access. Initialize the port data
register before enabling the outputs.
2.6.3 Enabling IRQ edge-sensitive mode
To avoid unintended IRQ interrupts resulting from writing to IRQCR while the IRQ pin is driven to active
level (IRQ=0) the following initialization sequence is recommended:
1. Mask I-bit
2. Set IRQCR[IRQEN]
3. Set IRQCR[IRQE]
4. Clear I-bit
2.6.4 ADC External Triggers ETRIG3-0
The ADC external trigger inputs ETRIG3-0 allow the synchronization of conversions to external trigger
events if selected as trigger source (for details refer to ATDCTL1[ETRIGSEL] and ATDCTL1[ETRIGCH]
configuration bits in ADC section). These signals are related to PWM channels 3-0 to support periodic
trigger applications with the ADC. Other pin functions can also be used as triggers.
If a PWM channel is routed to an alternative pin, the ETRIG input function will follow the relocation
accordingly.
If the related PWM channel is enabled, the PWM signal as seen on the pin will drive the ETRIG input. If
another signal of higher priority takes control of the pin or if on a port AD pin the input buffer is disabled,
Port Integration Module (S12GPIMV0)
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214 Freescale Semiconductor
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the ETRIG will be driven by the PWM internally. If the related PWM channel is not enabled, the ETRIG
function will be triggered by other functions on the pin including general-purpose input.
Table 2-95 illustrates the resulting trigger sources and their dependencies. Shaded fields apply to 20
TSSOP with shared ACMP analog input functions on port AD pins only.
2.6.5 Emulation of Smaller Packages
The Package Code Register (PKGCR) allows the emulation of smaller packages to support software
development and debugging without need to have the actual target package at hand. Cross-device
programming for the shared functions is also supported because smaller package sizes than the given
device is offered in can be selected1.
The PKGCR can be written in normal mode once after reset to overwrite the factory pre-programmed
value, which determines the actual package. Further attempts are blocked to avoid inadvertent changes
(blocking released in special mode). Trying to select a package larger than the given device is offered in
will be ignored and result in the “illegal” code being written.
When a smaller package is selected the pin availability and pin functionality changes according to the
target package specification. The input buffers of unused pins are disabled however the output functions
of unused pins are not disabled. Therefore these pins should be don’t-cared.
Depending on the different feature sets of the G-family derivatives the input buffers of specific pins, which
are shared with analog functions need to be explicitly enabled before they can be used with digital input
functions. For example devices featuring an ACMP module contain a control register for the related input
buffers, which is not available on other family members. Also larger devices in general feature more ADC
channels with individual input buffer enable bits, which are not present on smaller ones. These differences
need to be accounted for when developing cross-functional code.
Table 2-95. ETRIG Sources
ATDDIEN of ADC
&
ACDIEN of ACMP
PWM
Enable
Peripheral
Enable1
1With higher priority than PWM on pin
ETRIG
Source Comment
0 0 0 Const. 1 Forced High
0 0 1 Const. 1 Forced High
0 1 0 PWM Internal Link
0 1 1 PWM Internal Link
1 0 0 Pin Driven by General-Purpose Function
1 0 1 Pin Driven by Peripheral
1 1 0 Pin Driven by PWM
1 1 1 PWM Internal Link
1. Except G128/G96 in 20 TSSOP: Internal routing of PWM to ETRIG is not available.
5V Analog Comparator (ACMPV1)
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Freescale Semiconductor 215
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 3
5V Analog Comparator (ACMPV1)
Revision History
3.1 Introduction
The analog comparator (ACMP) provides a circuit for comparing two analog input voltages. Refer to the
device overview section for availability on a specific device.
3.2 Features
The ACMP has the following features:
• Low offset, low long-term offset drift
• Selectable interrupt on rising, falling, or rising and falling edges of comparator output
• Option to output comparator signal on an external pin
• Option to trigger timer input capture events
3.3 Block Diagram
The block diagram of the ACMP is shown below.
Rev. No.
(Item No.)
Date (Submitted
By)
Sections
Affected Substantial Change(s)
V00.07 01 Jul 2010 • Aligned to S12 register guidelines
V00.08 13 Aug 2010 • Added register name to every bitfield reference
V00.09 10 Sep 2010 • Internal updates
•
5V Analog Comparator (ACMPV1)
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216 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 3-1. ACMP Block Diagram
Figure 3-2.
3.4 External Signals
The ACMP has two analog input signals, ACMPP and ACMPM, and one digital output, ACMPO. The
associated pins are defined by the package option.
The ACMPP signal is connected to the non-inverting input of the comparator. The ACMPM signal is
connected to the inverting input of the comparator. Each of these signals can accept an input voltage that
varies across the full 5V operating voltage range. The module monitors the voltage on these inputs
independent of any other functions in use (GPIO, ADC).
The raw comparator output signal can optionally be driven on an external pin.
3.5 Modes of Operation
1. Normal Mode
The ACMP is operating when enabled and not in STOP mode.
2. Shutdown Mode
The ACMP is held in shutdown mode either when disabled or during STOP mode. In this case the
supply of the analog block is disconnected for power saving. ACMPO drives zero in shutdown
mode.
Interrupt
Control
ACMP IRQ
Control & Status
Register
ACMOD
SET ACIF
ACE ACIF
ACIE
ACOPE
ACMPO
ACO
ACMPP
ACMPM
To Input
+
_
(enable)
ACICE
Capture
SyncHold
Channel
ACDIEN
digital
buffer
input
INTERNAL BUS
5V Analog Comparator (ACMPV1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 217
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
3.6 Memory Map and Register Definition
3.6.1 Register Map
Table 3-1 shows the ACMP register map.
Table 3-1. ACMP Register Map
3.6.2 Register Descriptions
3.6.2.1 ACMP Control Register (ACMPC)
Global Address
Register Name Bit 7 654321Bit 0
0x0260
ACMPC
RACIE ACOPE ACICE ACDIEN ACMOD1 ACMOD0 0ACE
W
0x0261
ACMPS
RACIF ACO000000
W
= Unimplemented or Reserved
Address 0x0260 Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
ACIE ACOPE ACICE ACDIEN ACMOD1 ACMOD0
0
ACE
W
Reset 00000000
Figure 3-3. ACMP Control Register (ACMPC)
Table 3-2. ACMPC Register Field Descriptions
Field Description
7
ACIE
ACMP Interrupt Enable—
Enables the ACMP interrupt.
0 Interrupt disabled
1 Interrupt enabled
6
ACOPE
ACMP Output Pin Enable—
Enables raw comparator output on external ACMPO pin.
0 ACMP output not available
1 ACMP output is driven out on ACMPO
5V Analog Comparator (ACMPV1)
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218 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
3.6.2.2 ACMP Status Register (ACMPS)
5
ACICE
ACMP Input Capture Enable—
Establishes internal link to a timer input capture channel. When enabled, the associated timer pin is disconnected
from the timer input. Refer to ACE description to account for initialization delay on this path.
0 Timer link disabled
1 ACMP output connected to input capture channel 5
4
ACDIEN
ACMP Digital Input Buffer Enable—
Enables the input buffers on ACMPP and ACMPM for the pins to be used with digital functions.
Note: If this bit is set while simultaneously using the pin as an analog port, there is potentially increased power
consumption because the digital input buffer may be in the linear region.
0 Input buffers disabled on ACMPP and ACMPM
1 Input buffers enabled on ACMPP and ACMPM
3-2
ACMOD
[1:0]
ACMP Mode—
Selects the type of compare event setting ACIF.
00 Flag setting disabled
01 Comparator output rising edge
10 Comparator output falling edge
11 Comparator output rising or falling edge
0
ACE
ACMP Enable—
This bit enables the ACMP module and takes it into normal mode (see Section 3.5, “Modes of Operation”). This bit
also connects the related input pins with the module’s low pass input filters. When the module is not enabled, it
remains in low power shutdown mode.
Note: After setting ACE=1 an initialization delay of 63 bus clock cycles must be accounted for. During this time the
comparator output path to all subsequent logic (ACO, ACIF, timer link, excl. ACMPO) is held at its current state.
When resetting ACE to 0 the current state of the comparator will be maintained.
0 ACMP disabled
1 ACMP enabled
Address 0x0261 Access: User read/write1
1Read: Anytime
Write:
ACIF: Anytime, write 1 to clear
ACO: Never
76543210
R
ACIF
ACO000000
W
Reset 00000000
Figure 3-4. ACMP Status Register (ACMPS)
Table 3-2. ACMPC Register Field Descriptions (continued)
Field Description
5V Analog Comparator (ACMPV1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 219
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
3.7 Functional Description
The ACMP compares two analog input voltages applied to ACMPM and ACMPP. The comparator output
is high when the voltage at the non-inverting input is greater than the voltage at the inverting input, and is
low when the non-inverting input voltage is lower than the inverting input voltage.
The ACMP is enabled with register bit ACMPC[ACE]. When ACMPC[ACE] is set, the input pins are
connected to low-pass filters. The comparator output is disconnected from the subsequent logic, which is
held at its state for 63 bus clock cycles after setting ACMPC[ACE] to “1” to mask potential glitches. This
initialization delay must be accounted for before the first comparison result can be expected.
The initial hold state after reset is zero, thus if input voltages are set to result in “true” result
(VACMPP >V
ACMPM) before the initialization delay has passed, a flag will be set immediately after this.
Similarly the flag will also be set when disabling the ACMP, then re-enabling it with the inputs changing
to produce an opposite result to the hold state before the end of the initialization delay.
By setting the ACMPC[ACICE] bit the gated comparator output can be connected to the synchronized
timer input capture channel 5 (see Figure 3-1). This feature can be used to generate time stamps and timer
interrupts on ACMP events.
The comparator output signal synchronized to the bus clock is used to read the comparator output status
(ACMPS[ACO]) and to set the interrupt flag (ACMPS[ACIF]).
The condition causing the interrupt flag (ACMPS[ACIF]) to assert is selected with register bits
ACMPC[ACMOD1:ACMOD0]. This includes any edge configuration, that is rising, or falling, or rising
and falling (toggle) edges of the comparator output. Also flag setting can be disabled.
An interrupt will be generated if the interrupt enable bit (ACMPC[ACIE]) and the interrupt flag
(ACMPS[ACIF]) are both set. ACMPS[ACIF] is cleared by writing a 1.
The raw comparator output signal ACMPO can be driven out on an external pin by setting the
ACMPC[ACOPE] bit.
Table 3-3. ACMPS Register Field Descriptions
Field Description
7
ACIF
ACMP Interrupt Flag—
ACIF is set when a compare event occurs. Compare events are defined by ACMOD[1:0]. Writing a logic “1” to the
bit field clears the flag.
0 Compare event has not occurred
1 Compare event has occurred
6
ACO
ACMP Output—
Reading ACO returns the current value of the synchronized ACMP output. Refer to ACE description to account for
initialization delay on this path.
Reference Voltage Attenuator (RVAV1)
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220 Freescale Semiconductor
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Chapter 4
Reference Voltage Attenuator (RVAV1)
Revision History
4.1 Introduction
The reference voltage attenuator (RVA) provides a circuit for reduction of the ADC reference voltage
difference VRH-VSSA to gain more ADC resolution.
4.2 Features
The RVA has the following features:
• Attenuation of ADC reference voltage with low long-term drift
4.3 Block Diagram
The block diagram of the RVA module is shown below.
Refer to device overview section “ADC VRH/VRL Signal Connection” for connection of RVA to pins
and ADC module.
Rev. No.
(Item No.)
Date (Submitted
By)
Sections
Affected Substantial Change(s)
V00.04 26 May 2010 • Added reference to device overview for internal connections
V00.05 09 Jun 2010 • Added appendix title in note to reference reduced ADC clock
• Orthographical corrections aligned to Freescale Publications Style Guide
V00.06 01 Jul 2010 • Aligned to S12 register guidelines
Reference Voltage Attenuator (RVAV1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 221
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Figure 4-1. RVA Module Block Diagram
4.4 External Signals
The RVA has two external input signals, VRH and VSSA.
4.5 Modes of Operation
1. Attenuation Mode
The RVA is attenuating the reference voltage when enabled by the register control bit and the MCU
not being in STOP mode.
2. Bypass Mode
The RVA is in bypass mode either when disabled or during STOP mode. In these cases the resistor
ladder of the RVA is disconnected for power saving.
VRH_INT
VRL_INT
to ADC
RVA
RVAON
VSSA
VRH
5R
4R
R
STOP
Reference Voltage Attenuator (RVAV1)
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222 Freescale Semiconductor
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4.6 Memory Map and Register Definition
4.6.1 Register Map
Table 4-1 shows the RVA register map.
Table 4-1. RVA Register Map
4.6.2 Register Descriptions
4.6.2.1 RVA Control Register (RVACTL)
4.7 Functional Description
The RVA is a prescaler for the ADC reference voltage. If the attenuation is turned off the resistive divider
is disconnected from VSSA, VRH_INT is connected to VRH and VRL_INT is connected to VSSA. In this
mode the attenuation is bypassed and the resistive divider does not draw current.
Global Address
Register Name Bit 7 654321Bit 0
0x0276
RVACTL
R0000000
RVAON
W
= Unimplemented or Reserved
Address 0x0276 Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R0000000
RVAON
W
Reset 00000000
Figure 4-2. RVA Control Register (RVACTL)
Table 4-2. RVACTL Register Field Descriptions
Field Description
0
RVAON
RVA On —
This bit turns on the reference voltage attenuation.
0 RVA in bypass mode
1 RVA in attenuation mode
Reference Voltage Attenuator (RVAV1)
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Freescale Semiconductor 223
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If the attenuation is turned on the resistive divider is connected to VSSA, VRH_INT and VRL_INT are
connected to intermediate voltage levels:
VRH_INT = 0.9 * (VRH - VSSA) + VSSA Eqn. 4-1
VRL_INT = 0.4 * (VRH - VSSA) + VSSA Eqn. 4-2
The attenuated reference voltage difference (VRH_INT - VRL_INT) equals 50% of the input reference
voltage difference (VRH - VSSA). With reference voltage attenuation the resolution of the ADC is
improved by a factor of 2.
NOTE
In attenuation mode the maximum ADC clock is reduced. Please refer to the
conditions in appendix A “ATD Accuracy”, table “ATD Conversion
Performance 5V range, RVA enabled”.
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Freescale Semiconductor 224
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Reference Voltage Attenuator (RVAV1)
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Freescale Semiconductor 225
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Reference Voltage Attenuator (RVAV1)
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226 Freescale Semiconductor
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Reference Voltage Attenuator (RVAV1)
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Freescale Semiconductor 227
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Reference Voltage Attenuator (RVAV1)
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228 Freescale Semiconductor
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Reference Voltage Attenuator (RVAV1)
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Freescale Semiconductor 229
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Reference Voltage Attenuator (RVAV1)
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230 Freescale Semiconductor
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Freescale Semiconductor 231
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Reference Voltage Attenuator (RVAV1)
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232 Freescale Semiconductor
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Freescale Semiconductor 233
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Chapter 5
S12G Memory Map Controller (S12GMMCV1)
Table 5-1. Revision History Table
5.1 Introduction
The S12GMMC module controls the access to all internal memories and peripherals for the CPU12 and
S12SBDM module. It regulates access priorities and determines the address mapping of the on-chip
ressources. Figure 5-1 shows a block diagram of the S12GMMC module.
5.1.1 Glossary
5.1.2 Overview
The S12GMMC connects the CPU12’s and the S12SBDM’s bus interfaces to the MCU’s on-chip resources
(memories and peripherals). It arbitrates the bus accesses and determines all of the MCU’s memory maps.
Furthermore, the S12GMMC is responsible for constraining memory accesses on secured devices and for
selecting the MCU’s functional mode.
Rev. No.
(Item No.)
Date
(Submitted By)
Sections
Affected Substantial Change(s)
01.02 20-May 2010 Updates for S12VR48 and S12VR64
01.03 26-Jul 2010
01.04 20-Aug 2010
Table 5-2. Glossary Of Terms
Term Definition
Local Addresses Address within the CPU12’s Local Address Map (Figure 5-11)
Global Address Address within the Global Address Map (Figure 5-11)
Aligned Bus Access Bus access to an even address.
Misaligned Bus Access Bus access to an odd address.
NS Normal Single-Chip Mode
SS Special Single-Chip Mode
Unimplemented Address Ranges Address ranges which are not mapped to any on-chip resource.
NVM Non-volatile Memory; Flash or EEPROM
IFR NVM Information Row. Refer to FTMRG Block Guide
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
5.1.3 Features
The main features of this block are:
• Paging capability to support a global 256 KByte memory address space
• Bus arbitration between the masters CPU12, S12SBDM to different resources.
• MCU operation mode control
• MCU security control
• Generation of system reset when CPU12 accesses an unimplemented address (i.e., an address
which does not belong to any of the on-chip modules) in single-chip modes
5.1.4 Modes of Operation
The S12GMMC selects the MCU’s functional mode. It also determines the devices behavior in secured
and unsecured state.
5.1.4.1 Functional Modes
Two functional modes are implemented on devices of the S12G product family:
• Normal Single Chip (NS)
The mode used for running applications.
• Special Single Chip Mode (SS)
A debug mode which causes the device to enter BDM Active Mode after each reset. Peripherals
may also provide special debug features in this mode.
5.1.4.2 Security
S12G devices can be secured to prohibit external access to the on-chip flash. The S12GMMC module
determines the access permissions to the on-chip memories in secured and unsecured state.
5.1.5 Block Diagram
Figure 5-1 shows a block diagram of the S12GMMC.
S12G Memory Map Controller (S12GMMCV1)
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 5-1. S12GMMC Block Diagram
5.2 External Signal Description
The S12GMMC uses two external pins to determine the devices operating mode: RESET and MODC
(Figure 5-3) See Device User Guide (DUG) for the mapping of these signals to device pins{statement}.
5.3 Memory Map and Registers
5.3.1 Module Memory Map
A summary of the registers associated with the S12GMMC block is shown in Figure 5-2. Detailed
descriptions of the registers and bits are given in the subsections that follow.
Table 5-3. External System Pins Associated With S12GMMC
Pin Name Pin Functions Description
RESET
(See Section
Device Overview)
RESET
The RESET pin is used the select the MCU’s operating mode.
MODC
(See Section
Device Overview)
MODC The MODC pin is captured at the rising edge of the RESET pin. The captured
value determines the MCU’s operating mode.
CPU
BDM
Target Bus Controller
DBG
MMC
Address Decoder & Priority
Peripherals
FlashEEPROM RAM
S12G Memory Map Controller (S12GMMCV1)
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
5.3.2 Register Descriptions
This section consists of the S12GMMC control register descriptions in address order.
5.3.2.1 Mode Register (MODE)
Address Register
Name Bit 7 65432 1Bit 0
0x000A Reserved R 000000 0 0
W
0x000B MODE R MODC 00000 0 0
W
0x0010 Reserved R 000000 0 0
W
0x0011 DIRECT R DP15 DP14 DP13 DP12 DP11 DP10 DP9 DP8
W
0x0012 Reserved R 000000 0 0
W
0x0013 MMCCTL1 R 000000 0
NVMRES
W
0x0014 Reserved R 000000 0 0
W
0x0015 PPAGE R 0000
PIX3 PIX2 PIX1 PIX0
W
0x0016-
0x0017
Reserved R 000000 0 0
W
= Unimplemented or Reserved
Figure 5-2. MMC Register Summary
Address: 0x000B
76543210
RMODC 0000000
W
Reset MODC10000000
1. External signal (see Table 5-3).
= Unimplemented or Reserved
Figure 5-3. Mode Register (MODE)
S12G Memory Map Controller (S12GMMCV1)
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Read: Anytime.
Write: Only if a transition is allowed (see Figure 5-4).
The MODC bit of the MODE register is used to select the MCU’s operating mode.
Figure 5-4. Mode Transition Diagram when MCU is Unsecured
5.3.2.2 Direct Page Register (DIRECT)
Read: Anytime
Write: anytime in special SS, write-once in NS.
This register determines the position of the 256 Byte direct page within the memory map.It is valid for both
global and local mapping scheme.
Table 5-4. MODE Field Descriptions
Field Description
7
MODC
Mode Select Bit — This bit controls the current operating mode during RESET high (inactive). The external
mode pin MODC determines the operating mode during RESET low (active). The state of the pin is registered
into the respective register bit after the RESET signal goes inactive (see Figure 5-4).
Write restrictions exist to disallow transitions between certain modes. Figure 5-4 illustrates all allowed mode
changes. Attempting non authorized transitions will not change the MODE bit, but it will block further writes to
the register bit except in special modes.
Write accesses to the MODE register are blocked when the device is secured.
Address: 0x0011
76543210
RDP15 DP14 DP13 DP12 DP11 DP10 DP9 DP8
W
Reset 00000000
Figure 5-5. Direct Register (DIRECT)
Normal
Single-Chip
1
Special
Single-Chip
0
(SS)
RESET
(NS)
1
01
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Figure 5-6. DIRECT Address Mapping
Example 5-1. This example demonstrates usage of the Direct Addressing Mode
MOVB #$04,DIRECT ;Set DIRECT register to 0x04. From this point on, all memory
;accesses using direct addressing mode will be in the local
;address range from 0x0400 to 0x04FF.
LDY <$12 ;Load the Y index register from 0x0412 (direct access).
5.3.2.3 MMC Control Register (MMCCTL1)
Read: Anytime.
Write: Anytime.
The NVMRES bit maps 16k of internal NVM resources (see Section FTMRG) to the global address space
0x04000 to 0x07FFF.
Table 5-5. DIRECT Field Descriptions
Field Description
7–0
DP[15:8]
Direct Page Index Bits 15–8 — These bits are used by the CPU when performing accesses using the direct
addressing mode. These register bits form bits [15:8] of the local address (see Figure 5-6).
Address: 0x0013
76543210
R0000000
NVMRES
W
Reset 00000000
= Unimplemented or Reserved
Figure 5-7. MMC Control Register (MMCCTL1)
Table 5-6. MODE Field Descriptions
Field Description
0
NVMRES
Map internal NVM resources into the global memory map
Write: Anytime
This bit maps internal NVM resources into the global address space.
0 Program flash is mapped to the global address range from 0x04000 to 0x07FFF.
1 NVM resources are mapped to the global address range from 0x04000 to 0x07FFF.
Bit15 Bit0
Bit7
CPU Address [15:0]
Bit8
DP [15:8]
S12G Memory Map Controller (S12GMMCV1)
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
5.3.2.4 Program Page Index Register (PPAGE)
Read: Anytime
Write: Anytime
The four index bits of the PPAGE register select a 16K page in the global memory map (Figure 5-11). The
selected 16K page is mapped into the paging window ranging from local address 0x8000 to 0xBFFF.
Figure 5-9 illustrates the translation from local to global addresses for accesses to the paging window. The
CPU has special access to read and write this register directly during execution of CALL and RTC
instructions.
Figure 5-9. PPAGE Address Mapping
NOTE
Writes to this register using the special access of the CALL and RTC
instructions will be complete before the end of the instruction execution.
The fixed 16KB page from 0x0000 to 0x3FFF is the page number 0xC. Parts of this page are covered by
Registers, EEPROM and RAM space. See SoC Guide for details.
The fixed 16KB page from 0x4000–0x7FFF is the page number 0xD.
Address: 0x0015
76543210
R0000
PIX3 PIX2 PIX1 PIX0
W
Reset 00001110
Figure 5-8. Program Page Index Register (PPAGE)
Table 5-7. PPAGE Field Descriptions
Field Description
3–0
PIX[3:0]
Program Page Index Bits 3–0 — These page index bits are used to select which of the 256 flash array pages
is to be accessed in the Program Page Window.
Bit14 Bit0
Address [13:0]
PPAGE Register [3:0]
Global Address [17:0]
Bit13
Bit17
Address: CPU Local Address
or BDM Local Address
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The reset value of 0xE ensures that there is linear Flash space available between addresses 0x0000 and
0xFFFF out of reset.
The fixed 16KB page from 0xC000-0xFFFF is the page number 0xF.
5.4 Functional Description
The S12GMMC block performs several basic functions of the S12G sub-system operation: MCU
operation modes, priority control, address mapping, select signal generation and access limitations for the
system. Each aspect is described in the following subsections.
5.4.1 MCU Operating Modes
• Normal single chip mode
This is the operation mode for running application code. There is no external bus in this mode.
• Special single chip mode
This mode is generally used for debugging operation, boot-strapping or security related operations.
The active background debug mode is in control of the CPU code execution and the BDM firmware
is waiting for serial commands sent through the BKGD pin.
5.4.2 Memory Map Scheme
5.4.2.1 CPU and BDM Memory Map Scheme
The BDM firmware lookup tables and BDM register memory locations share addresses with other
modules; however they are not visible in the memory map during user’s code execution. The BDM
memory resources are enabled only during the READ_BD and WRITE_BD access cycles to distinguish
between accesses to the BDM memory area and accesses to the other modules. (Refer to BDM Block
Guide for further details).
When the MCU enters active BDM mode, the BDM firmware lookup tables and the BDM registers
become visible in the local memory map in the range 0xFF00-0xFFFF (global address 0x3_FF00 -
0x3_FFFF) and the CPU begins execution of firmware commands or the BDM begins execution of
hardware commands. The resources which share memory space with the BDM module will not be visible
in the memory map during active BDM mode.
Please note that after the MCU enters active BDM mode the BDM firmware lookup tables and the BDM
registers will also be visible between addresses 0xBF00 and 0xBFFF if the PPAGE register contains value
of 0x0F.
5.4.2.1.1 Expansion of the Local Address Map
Expansion of the CPU Local Address Map
The program page index register in S12GMMC allows accessing up to 256KB of address space in the
global memory map by using the four index bits (PPAGE[3:0]) to page 16x16 KB blocks into the program
page window located from address 0x8000 to address 0xBFFF in the local CPU memory map.
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The page value for the program page window is stored in the PPAGE register. The value of the PPAGE
register can be read or written by normal memory accesses as well as by the CALL and RTC instructions.
Control registers, vector space and parts of the on-chip memories are located in unpaged portions of the
64KB local CPU address space.
The starting address of an interrupt service routine must be located in unpaged memory unless the user is
certain that the PPAGE register will be set to the appropriate value when the service routine is called.
However an interrupt service routine can call other routines that are in paged memory. The upper 16KB
block of the local CPU memory space (0xC000–0xFFFF) is unpaged. It is recommended that all reset and
interrupt vectors point to locations in this area or to the other unmapped pages sections of the local CPU
memory map.
Expansion of the BDM Local Address Map
PPAGE and BDMPPR register is also used for the expansion of the BDM local address to the global
address. These registers can be read and written by the BDM.
The BDM expansion scheme is the same as the CPU expansion scheme.
The four BDMPPR Program Page index bits allow access to the full 256KB address map that can be
accessed with 18 address bits.
The BDM program page index register (BDMPPR) is used only when the feature is enabled in BDM and,
in the case the CPU is executing a firmware command which uses CPU instructions, or by a BDM
hardware commands. See the BDM Block Guide for further details. (see Figure 5-10).
S12G Memory Map Controller (S12GMMCV1)
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Figure 5-10.
BDM HARDWARE COMMAND
BDM FIRMWARE COMMAND
Bit14 Bit0
BDM Local Address [13:0]
BDMPPR Register [3:0]
Global Address [17:0]
Bit13
Bit17
Bit14 Bit0
CPU Local Address [13:0]
BDMPPR Register [3:0]
Global Address [17:0]
Bit13
Bit17
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Figure 5-11. Local to Global Address Mapping
Paging Window
0x3_FFFF
Local CPU and BDM
Memory Map Global Memory Map
0xFFFF
0xC000
0x0_0400
0x0_0000
0x3_C000
0x0000
0x8000
0x0400
0x4000 0x0_4000
Paging Window
Flash
Space
Flash
Space
RAM
RAM
Unimplemented
Unimplemented
Flash Space
Flash Space
Flash Space
Flash Space
Flash Space
Flash Space
Register Space
Register Space
Internal
NVM
Resources
Internal
NVM
Resources
Flash Space
Flash Space
Flash Space
Flash Space
Flash Space
Flash Space
Flash Space
Flash Space
EEPROM
EEPROM EEPROM
EEPROM
Page 0x1
Page 0x1
Page 0xF
Page 0xF
Page 0xD
Page 0xD
Register Space
Register Space
Page 0xC
Page 0xC
Page 0xE
Page 0xE
Page 0xF
Page 0xF
Page 0xD
Page 0xD
Page 0xC
Page 0xC
NVMRES=0
NVMRES=0 NVMRES=1
NVMRES=1
Flash Space
Flash Space
Page 0x2
Page 0x2
0x3_0000
0x3_4000
0x3_8000
0x0_8000
RAM
RAM
S12G Memory Map Controller (S12GMMCV1)
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5.4.3 Unimplemented and Reserved Address Ranges
The S12GMMC is capable of mapping up 240K of flash, up to 4K of EEPROM and up to 11K of RAM
into the global memory map{statement}. Smaller devices of the S12G-family do not utilize all of the
available address space. Address ranges which are not associated with one of the on-chip memories fall
into two categories: Unimplemented addresses and reserved addresses.
Unimplemented addresses are not mapped to any of the on-chip memories. The S12GMMC is aware that
accesses to these address location have no destination and triggers a system reset (illegal address reset)
whenever they are attempted by the CPU. The BDM is not able to trigger illegal address resets.
Reserved addresses are associated with a memory block on the device, even though the memory block does
not contain the resources to fill the address space. The S12GMMC is not aware that the associated memory
does not physically exist. It does not trigger an illegal address reset when accesses to reserved locations
are attempted.
Table 5-8 shows the global address ranges of all members of the S12G-family.
Table 5-8. Global Address Ranges
S12GN16 S12GN32 S12G48,
S12GN48 S12G64 S12G96 S12G128 S12G192 S12G240
0x00000-
0x003FF
Register Space
0x00400-
0x005FF
0.5k 1k 1.5k 2k 3k 4k 4k 4k
0x00600-
0x007FF
Reserved EEPROM
0x00800-
0x009FF
0x00A00-
0x00BFF
Reserved
0x00C00-
0x00FFF
0x01000-
0x013FF
Reserved
0x01400-
0x01FFF
Unimplemented
0x02000-
0x2FFF
0x03000-
0x037FF
RAM
0x03800-
0x03BFF
Reserved
0x03C00-
0x03FFF 1k 2k 4k 4k 8k 8k 11k 11k
S12G Memory Map Controller (S12GMMCV1)
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
5.4.4 Prioritization of Memory Accesses
On S12G devices, the CPU and the BDM are not able to access the memory in parallel. An arbitration
occurs whenever both modules attempt a memory access at the same time. CPU accesses are handled with
higher priority than BDM accesses unless the BDM module has been stalled for more then 128 bus cycles.
In this case the pending BDM access will be processed immediately.
5.4.5 Interrupts
The S12GMMC does not generate any interrupts.
0x04000-
0x07FFF
(NVMRES=1)
Internal NVM Resources (for details refert to section FTMRG)
0x04000-
0x07FFF
(NVMRES=0)
Reserved
0x08000-
0x0FFFF
0x08000-
0x1FFFF
Unimplemented
0x20000-
0x27FFF
Reserved
0x28000-
0x2FFFF
0x30000-
0x33FFF
Reserved
0x34000-
0x37FFF
Flash
0x38000-
0x3BFFF
Reserved
0x3C000-
0x3FFFF 16k 32k 48k 64k 96k 128k 192k 240k
Table 5-8. Global Address Ranges
S12GN16 S12GN32 S12G48,
S12GN48 S12G64 S12G96 S12G128 S12G192 S12G240
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MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 247
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 6
Interrupt Module (S12SINTV1)
6.1 Introduction
The INT module decodes the priority of all system exception requests and provides the applicable vector
for processing the exception to the CPU. The INT module supports:
• I bit and X bit maskable interrupt requests
• A non-maskable unimplemented op-code trap
• A non-maskable software interrupt (SWI) or background debug mode request
• Three system reset vector requests
• A spurious interrupt vector
Each of the I bit maskable interrupt requests is assigned to a fixed priority level.
6.1.1 Glossary
Table 6-2 contains terms and abbreviations used in the document.
6.1.2 Features
• Interrupt vector base register (IVBR)
• One spurious interrupt vector (at address vector base1 + 0x0080).
Version
Number
Revision
Date
Effective
Date Author Description of Changes
01.02 13 Sep
2007
updates for S12P family devices:
- re-added XIRQ and IRQ references since this functionality is used
on devices without D2D
- added low voltage reset as possible source to the pin reset vector
01.03 21 Nov
2007
added clarification of “Wake-up from STOP or WAIT by XIRQ with
X bit set” feature
01.04 20 May
2009
added footnote about availability of “Wake-up from STOP or WAIT
by XIRQ with X bit set” feature
Table 6-2. Terminology
Term Meaning
CCR Condition Code Register (in the CPU)
ISR Interrupt Service Routine
MCU Micro-Controller Unit
Interrupt Module (S12SINTV1)
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• 2–58 I bit maskable interrupt vector requests (at addresses vector base + 0x0082–0x00F2).
• I bit maskable interrupts can be nested.
• One X bit maskable interrupt vector request (at address vector base + 0x00F4).
• One non-maskable software interrupt request (SWI) or background debug mode vector request (at
address vector base + 0x00F6).
• One non-maskable unimplemented op-code trap (TRAP) vector (at address vector base + 0x00F8).
• Three system reset vectors (at addresses 0xFFFA–0xFFFE).
• Determines the highest priority interrupt vector requests, drives the vector to the bus on CPU
request
• Wakes up the system from stop or wait mode when an appropriate interrupt request occurs.
6.1.3 Modes of Operation
• Run mode
This is the basic mode of operation.
• Wait mode
In wait mode, the clock to the INT module is disabled. The INT module is however capable of
waking-up the CPU from wait mode if an interrupt occurs. Please refer to Section 6.5.3, “Wake Up
from Stop or Wait Mode” for details.
• Stop Mode
In stop mode, the clock to the INT module is disabled. The INT module is however capable of
waking-up the CPU from stop mode if an interrupt occurs. Please refer to Section 6.5.3, “Wake Up
from Stop or Wait Mode” for details.
• Freeze mode (BDM active)
In freeze mode (BDM active), the interrupt vector base register is overridden internally. Please
refer to Section 6.3.1.1, “Interrupt Vector Base Register (IVBR)” for details.
6.1.4 Block Diagram
Figure 6-1 shows a block diagram of the INT module.
1. The vector base is a 16-bit address which is accumulated from the contents of the interrupt vector base register (IVBR, used
as upper byte) and 0x00 (used as lower byte).
Interrupt Module (S12SINTV1)
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Figure 6-1. INT Block Diagram
6.2 External Signal Description
The INT module has no external signals.
6.3 Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the INT module.
6.3.1 Register Descriptions
This section describes in address order all the INT registers and their individual bits.
6.3.1.1 Interrupt Vector Base Register (IVBR)
Read: Anytime
Write: Anytime
Address: 0x0120
76543210
RIVB_ADDR[7:0]
W
Reset 11111111
Figure 6-2. Interrupt Vector Base Register (IVBR)
Wake Up
IVBR
Interrupt
Requests
Interrupt Requests CPU
Vector
Address
Peripheral
To CPU
Priority
Decoder
Non I bit Maskable Channels
I bit Maskable Channels
Interrupt Module (S12SINTV1)
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6.4 Functional Description
The INT module processes all exception requests to be serviced by the CPU module. These exceptions
include interrupt vector requests and reset vector requests. Each of these exception types and their overall
priority level is discussed in the subsections below.
6.4.1 S12S Exception Requests
The CPU handles both reset requests and interrupt requests. A priority decoder is used to evaluate the
priority of pending interrupt requests.
6.4.2 Interrupt Prioritization
The INT module contains a priority decoder to determine the priority for all interrupt requests pending for
the CPU. If more than one interrupt request is pending, the interrupt request with the higher vector address
wins the prioritization.
The following conditions must be met for an I bit maskable interrupt request to be processed.
1. The local interrupt enabled bit in the peripheral module must be set.
2. The I bit in the condition code register (CCR) of the CPU must be cleared.
3. There is no SWI, TRAP, or X bit maskable request pending.
NOTE
All non I bit maskable interrupt requests always have higher priority than
the I bit maskable interrupt requests. If the X bit in the CCR is cleared, it is
possible to interrupt an I bit maskable interrupt by an X bit maskable
interrupt. It is possible to nest non maskable interrupt requests, for example
by nesting SWI or TRAP calls.
Since an interrupt vector is only supplied at the time when the CPU requests it, it is possible that a higher
priority interrupt request could override the original interrupt request that caused the CPU to request the
vector. In this case, the CPU will receive the highest priority vector and the system will process this
interrupt request first, before the original interrupt request is processed.
Table 6-3. IVBR Field Descriptions
Field Description
7–0
IVB_ADDR[7:0]
Interrupt Vector Base Address Bits — These bits represent the upper byte of all vector addresses. Out of
reset these bits are set to 0xFF (that means vectors are located at 0xFF80–0xFFFE) to ensure compatibility
to HCS12.
Note: A system reset will initialize the interrupt vector base register with “0xFF” before it is used to determine
the reset vector address. Therefore, changing the IVBR has no effect on the location of the three reset
vectors (0xFFFA–0xFFFE).
Note: If the BDM is active (that means the CPU is in the process of executing BDM firmware code), the
contents of IVBR are ignored and the upper byte of the vector address is fixed as “0xFF”. This is done
to enable handling of all non-maskable interrupts in the BDM firmware.
Interrupt Module (S12SINTV1)
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If the interrupt source is unknown (for example, in the case where an interrupt request becomes inactive
after the interrupt has been recognized, but prior to the CPU vector request), the vector address supplied
to the CPU will default to that of the spurious interrupt vector.
NOTE
Care must be taken to ensure that all interrupt requests remain active until
the system begins execution of the applicable service routine; otherwise, the
exception request may not get processed at all or the result may be a
spurious interrupt request (vector at address (vector base + 0x0080)).
6.4.3 Reset Exception Requests
The INT module supports three system reset exception request types (please refer to the Clock and Reset
generator module for details):
1. Pin reset, power-on reset or illegal address reset, low voltage reset (if applicable)
2. Clock monitor reset request
3. COP watchdog reset request
6.4.4 Exception Priority
The priority (from highest to lowest) and address of all exception vectors issued by the INT module upon
request by the CPU is shown in Table 6-4.
Table 6-4. Exception Vector Map and Priority
Vector Address1
116 bits vector address based
Source
0xFFFE Pin reset, power-on reset, illegal address reset, low voltage reset (if applicable)
0xFFFC Clock monitor reset
0xFFFA COP watchdog reset
(Vector base + 0x00F8) Unimplemented opcode trap
(Vector base + 0x00F6) Software interrupt instruction (SWI) or BDM vector request
(Vector base + 0x00F4) X bit maskable interrupt request (XIRQ or D2D error interrupt)2
2D2D error interrupt on MCUs featuring a D2D initiator module, otherwise XIRQ pin interrupt
(Vector base + 0x00F2) IRQ or D2D interrupt request3
3D2D interrupt on MCUs featuring a D2D initiator module, otherwise IRQ pin interrupt
(Vector base + 0x00F0–0x0082) Device specific I bit maskable interrupt sources (priority determined by the low byte of the
vector address, in descending order)
(Vector base + 0x0080) Spurious interrupt
Interrupt Module (S12SINTV1)
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6.5 Initialization/Application Information
6.5.1 Initialization
After system reset, software should:
1. Initialize the interrupt vector base register if the interrupt vector table is not located at the default
location (0xFF80–0xFFF9).
2. Enable I bit maskable interrupts by clearing the I bit in the CCR.
3. Enable the X bit maskable interrupt by clearing the X bit in the CCR.
6.5.2 Interrupt Nesting
The interrupt request scheme makes it possible to nest I bit maskable interrupt requests handled by the
CPU.
• I bit maskable interrupt requests can be interrupted by an interrupt request with a higher priority.
I bit maskable interrupt requests cannot be interrupted by other I bit maskable interrupt requests per
default. In order to make an interrupt service routine (ISR) interruptible, the ISR must explicitly clear the
I bit in the CCR (CLI). After clearing the I bit, other I bit maskable interrupt requests can interrupt the
current ISR.
An ISR of an interruptible I bit maskable interrupt request could basically look like this:
1. Service interrupt, that is clear interrupt flags, copy data, etc.
2. Clear I bit in the CCR by executing the instruction CLI (thus allowing other I bit maskable interrupt
requests)
3. Process data
4. Return from interrupt by executing the instruction RTI
6.5.3 Wake Up from Stop or Wait Mode
6.5.3.1 CPU Wake Up from Stop or Wait Mode
Every I bit maskable interrupt request is capable of waking the MCU from stop or wait mode. To determine
whether an I bit maskable interrupts is qualified to wake-up the CPU or not, the same conditions as in
normal run mode are applied during stop or wait mode:
• If the I bit in the CCR is set, all I bit maskable interrupts are masked from waking-up the MCU.
Since there are no clocks running in stop mode, only interrupts which can be asserted asynchronously can
wake-up the MCU from stop mode.
The X bit maskable interrupt request can wake up the MCU from stop or wait mode at anytime, even if the
X bit in CCR is set1.
1. The capability of the XIRQ pin to wake-up the MCU with the X bit set may not be available if, for example, the XIRQ pin is
shared with other peripheral modules on the device. Please refer to the Device section of the MCU reference manual for details.
Interrupt Module (S12SINTV1)
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If the X bit maskable interrupt request is used to wake-up the MCU with the X bit in the CCR set, the
associated ISR is not called. The CPU then resumes program execution with the instruction following the
WAI or STOP instruction. This features works following the same rules like any interrupt request, that is
care must be taken that the X interrupt request used for wake-up remains active at least until the system
begins execution of the instruction following the WAI or STOP instruction; otherwise, wake-up may not
occur.
Interrupt Module (S12SINTV1)
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Chapter 7
Background Debug Module (S12SBDMV1)
Table 7-1. Revision History
7.1 Introduction
This section describes the functionality of the background debug module (BDM) sub-block of the HCS12S
core platform.
The background debug module (BDM) sub-block is a single-wire, background debug system implemented
in on-chip hardware for minimal CPU intervention. All interfacing with the BDM is done via the BKGD
pin.
The BDM has enhanced capability for maintaining synchronization between the target and host while
allowing more flexibility in clock rates. This includes a sync signal to determine the communication rate
and a handshake signal to indicate when an operation is complete. The system is backwards compatible to
the BDM of the S12 family with the following exceptions:
• TAGGO command not supported by S12SBDM
• External instruction tagging feature is part of the DBG module
• S12SBDM register map and register content modified
• Family ID readable from BDM ROM at global address 0x3_FF0F in active BDM
(value for devices with HCS12S core is 0xC2)
• Clock switch removed from BDM (CLKSW bit removed from BDMSTS register)
7.1.1 Features
The BDM includes these distinctive features:
• Single-wire communication with host development system
• Enhanced capability for allowing more flexibility in clock rates
• SYNC command to determine communication rate
Revision Number Date Sections
Affected Summary of Changes
1.03 14.May.2009 Internal Conditional text only
1.04 30.Nov.2009 Internal Conditional text only
1.05 07.Dec.2010 Standardized format of revision history table header.
1.06 02.Mar.2011 7.3.2.2/7-261
7.2/7-257
Corrected BPAE bit description.
Removed references to fixed VCO frequencies
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• GO_UNTIL command
• Hardware handshake protocol to increase the performance of the serial communication
• Active out of reset in special single chip mode
• Nine hardware commands using free cycles, if available, for minimal CPU intervention
• Hardware commands not requiring active BDM
• 14 firmware commands execute from the standard BDM firmware lookup table
• Software control of BDM operation during wait mode
• When secured, hardware commands are allowed to access the register space in special single chip
mode, if the Flash erase tests fail.
• Family ID readable from BDM ROM at global address 0x3_FF0F in active BDM
(value for devices with HCS12S core is 0xC2)
• BDM hardware commands are operational until system stop mode is entered
7.1.2 Modes of Operation
BDM is available in all operating modes but must be enabled before firmware commands are executed.
Some systems may have a control bit that allows suspending the function during background debug mode.
7.1.2.1 Regular Run Modes
All of these operations refer to the part in run mode and not being secured. The BDM does not provide
controls to conserve power during run mode.
• Normal modes
General operation of the BDM is available and operates the same in all normal modes.
• Special single chip mode
In special single chip mode, background operation is enabled and active out of reset. This allows
programming a system with blank memory.
7.1.2.2 Secure Mode Operation
If the device is in secure mode, the operation of the BDM is reduced to a small subset of its regular run
mode operation. Secure operation prevents access to Flash other than allowing erasure. For more
information please see Section 7.4.1, “Security”.
7.1.2.3 Low-Power Modes
The BDM can be used until stop mode is entered. When CPU is in wait mode all BDM firmware
commands as well as the hardware BACKGROUND command cannot be used and are ignored. In this case
the CPU can not enter BDM active mode, and only hardware read and write commands are available. Also
the CPU can not enter a low power mode (stop or wait) during BDM active mode.
In stop mode the BDM clocks are stopped. When BDM clocks are disabled and stop mode is exited, the
BDM clocks will restart and BDM will have a soft reset (clearing the instruction register, any command in
progress and disable the ACK function). The BDM is now ready to receive a new command.
Background Debug Module (S12SBDMV1)
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7.1.3 Block Diagram
A block diagram of the BDM is shown in Figure 7-1.
Figure 7-1. BDM Block Diagram
7.2 External Signal Description
A single-wire interface pin called the background debug interface (BKGD) pin is used to communicate
with the BDM system. During reset, this pin is a mode select input which selects between normal and
special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the
background debug mode. The communication rate of this pin is always the BDM clock frequency defined
at device level (refer to device overview section). When modifying the VCO clock please make sure that
the communication rate is adapted accordingly and a communication time-out (BDM soft reset) has
occurred.
7.3 Memory Map and Register Definition
7.3.1 Module Memory Map
Table 7-2 shows the BDM memory map when BDM is active.
16-Bit Shift Register
BKGD
Host
System Serial
Interface Data
Control
Register Block
Register
BDMSTS
Instruction Code
and
Execution
Standard BDM Firmware
LOOKUP TABLE
Secured BDM Firmware
LOOKUP TABLE
Bus Interface
and
Control Logic
Address
Data
Control
Clocks
BDMACT
TRACE
ENBDM
SDV
UNSEC
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7.3.2 Register Descriptions
A summary of the registers associated with the BDM is shown in Figure 7-2. Registers are accessed by
host-driven communications to the BDM hardware using READ_BD and WRITE_BD commands.
Table 7-2. BDM Memory Map
Global Address Module Size
(Bytes)
0x3_FF00–0x3_FF0B BDM registers 12
0x3_FF0C–0x3_FF0E BDM firmware ROM 3
0x3_FF0F Family ID (part of BDM firmware ROM) 1
0x3_FF10–0x3_FFFF BDM firmware ROM 240
Global
Address
Register
Name Bit 7 6 5 4 3 2 1 Bit 0
0x3_FF00 Reserved R X X X X X X 0 0
W
0x3_FF01 BDMSTS R ENBDM BDMACT 0 SDV TRACE 0 UNSEC 0
W
0x3_FF02 Reserved R X X X X X X X X
W
0x3_FF03 Reserved R X X X X X X X X
W
0x3_FF04 Reserved R X X X X X X X X
W
0x3_FF05 Reserved R X X X X X X X X
W
0x3_FF06 BDMCCR R CCR7 CCR6 CCR5 CCR4 CCR3 CCR2 CCR1 CCR0
W
0x3_FF07 Reserved R 0 0 0 0 0 0 0 0
W
= Unimplemented, Reserved = Implemented (do not alter)
X = Indeterminate 0 = Always read zero
Figure 7-2. BDM Register Summary
Background Debug Module (S12SBDMV1)
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7.3.2.1 BDM Status Register (BDMSTS)
Figure 7-3. BDM Status Register (BDMSTS)
Read: All modes through BDM operation when not secured
Write: All modes through BDM operation when not secured, but subject to the following:
— ENBDM should only be set via a BDM hardware command if the BDM firmware commands
are needed. (This does not apply in special single chip mode).
— BDMACT can only be set by BDM hardware upon entry into BDM. It can only be cleared by
the standard BDM firmware lookup table upon exit from BDM active mode.
0x3_FF08 BDMPPR R BPAE 000
BPP3 BPP2 BPP1 BPP0
W
0x3_FF09 Reserved R 0 0 0 0 0 0 0 0
W
0x3_FF0A Reserved R 0 0 0 0 0 0 0 0
W
0x3_FF0B Reserved R 0 0 0 0 0 0 0 0
W
Register Global Address 0x3_FF01
7 6 543 2 1 0
RENBDM BDMACT 0SDVTRACE 0 UNSEC 0
W
Reset
Special Single-Chip Mode 01
1ENBDM is read as 1 by a debugging environment in special single chip mode when the device is not secured or secured but
fully erased (Flash). This is because the ENBDM bit is set by the standard BDM firmware before a BDM command can be fully
transmitted and executed.
1000 0 02
2UNSEC is read as 1 by a debugging environment in special single chip mode when the device is secured and fully erased,
else it is 0 and can only be read if not secure (see also bit description).
0
All Other Modes 0 0 000 0 0 0
= Unimplemented, Reserved = Implemented (do not alter)
0 = Always read zero
Global
Address
Register
Name Bit 7 6 5 4 3 2 1 Bit 0
= Unimplemented, Reserved = Implemented (do not alter)
X = Indeterminate 0 = Always read zero
Figure 7-2. BDM Register Summary (continued)
Background Debug Module (S12SBDMV1)
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— All other bits, while writable via BDM hardware or standard BDM firmware write commands,
should only be altered by the BDM hardware or standard firmware lookup table as part of BDM
command execution.
Table 7-3. BDMSTS Field Descriptions
Field Description
7
ENBDM
Enable BDM — This bit controls whether the BDM is enabled or disabled. When enabled, BDM can be made
active to allow firmware commands to be executed. When disabled, BDM cannot be made active but BDM
hardware commands are still allowed.
0 BDM disabled
1 BDM enabled
Note: ENBDM is set out of reset in special single chip mode. In special single chip mode with the device
secured, this bit will not be set until after the Flash erase verify tests are complete.
6
BDMACT
BDM Active Status — This bit becomes set upon entering BDM. The standard BDM firmware lookup table is
then enabled and put into the memory map. BDMACT is cleared by a carefully timed store instruction in the
standard BDM firmware as part of the exit sequence to return to user code and remove the BDM memory from
the map.
0 BDM not active
1 BDM active
4
SDV
Shift Data Valid — This bit is set and cleared by the BDM hardware. It is set after data has been transmitted as
part of a BDM firmware or hardware read command or after data has been received as part of a BDM firmware
or hardware write command. It is cleared when the next BDM command has been received or BDM is exited.
SDV is used by the standard BDM firmware to control program flow execution.
0 Data phase of command not complete
1 Data phase of command is complete
3
TRACE
TRACE1 BDM Firmware Command is Being Executed — This bit gets set when a BDM TRACE1 firmware
command is first recognized. It will stay set until BDM firmware is exited by one of the following BDM commands:
GO or GO_UNTIL.
0 TRACE1 command is not being executed
1 TRACE1 command is being executed
1
UNSEC
Unsecure — If the device is secured this bit is only writable in special single chip mode from the BDM secure
firmware. It is in a zero state as secure mode is entered so that the secure BDM firmware lookup table is enabled
and put into the memory map overlapping the standard BDM firmware lookup table.
The secure BDM firmware lookup table verifies that the on-chip Flash is erased. This being the case, the UNSEC
bit is set and the BDM program jumps to the start of the standard BDM firmware lookup table and the secure
BDM firmware lookup table is turned off. If the erase test fails, the UNSEC bit will not be asserted.
0 System is in a secured mode.
1 System is in a unsecured mode.
Note: When UNSEC is set, security is off and the user can change the state of the secure bits in the on-chip
Flash EEPROM. Note that if the user does not change the state of the bits to “unsecured” mode, the
system will be secured again when it is next taken out of reset.After reset this bit has no meaning or effect
when the security byte in the Flash EEPROM is configured for unsecure mode.
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Figure 7-4. BDM CCR Holding Register (BDMCCR)
Read: All modes through BDM operation when not secured
Write: All modes through BDM operation when not secured
NOTE
When BDM is made active, the CPU stores the content of its CCR register
in the BDMCCR register. However, out of special single-chip reset, the
BDMCCR is set to 0xD8 and not 0xD0 which is the reset value of the CCR
register in this CPU mode. Out of reset in all other modes the BDMCCR
register is read zero.
When entering background debug mode, the BDM CCR holding register is used to save the condition code
register of the user’s program. It is also used for temporary storage in the standard BDM firmware mode.
The BDM CCR holding register can be written to modify the CCR value.
7.3.2.2 BDM Program Page Index Register (BDMPPR)
Figure 7-5. BDM Program Page Register (BDMPPR)
Read: All modes through BDM operation when not secured
Write: All modes through BDM operation when not secured
Register Global Address 0x3_FF06
76543210
RCCR7 CCR6 CCR5 CCR4 CCR3 CCR2 CCR1 CCR0
W
Reset
Special Single-Chip Mode 1 1 0 0 1 0 0 0
All Other Modes 0 0 0 0 0 0 0 0
Register Global Address 0x3_FF08
7 6 5 4 3 2 1 0
RBPAE 000BPP3 BPP2 BPP1 BPP0
W
Reset 0 0 0 0 0 0 0 0
= Unimplemented, Reserved
Table 7-4. BDMPPR Field Descriptions
Field Description
7
BPAE
BDM Program Page Access Enable Bit — BPAE enables program page access for BDM hardware and
firmware read/write instructions The BDM hardware commands used to access the BDM registers (READ_BD
and WRITE_BD) can not be used for program page accesses even if the BPAE bit is set.
0 BDM Program Paging disabled
1 BDM Program Paging enabled
3–0
BPP[3:0]
BDM Program Page Index Bits 3–0 — These bits define the selected program page. For more detailed
information regarding the program page window scheme, please refer to the S12S_MMC Block Guide.
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7.3.3 Family ID Assignment
The family ID is an 8-bit value located in the BDM ROM in active BDM (at global address: 0x3_FF0F).
The read-only value is a unique family ID which is 0xC2 for devices with an HCS12S core.
7.4 Functional Description
The BDM receives and executes commands from a host via a single wire serial interface. There are two
types of BDM commands: hardware and firmware commands.
Hardware commands are used to read and write target system memory locations and to enter active
background debug mode, see Section 7.4.3, “BDM Hardware Commands”. Target system memory
includes all memory that is accessible by the CPU.
Firmware commands are used to read and write CPU resources and to exit from active background debug
mode, see Section 7.4.4, “Standard BDM Firmware Commands”. The CPU resources referred to are the
accumulator (D), X index register (X), Y index register (Y), stack pointer (SP), and program counter (PC).
Hardware commands can be executed at any time and in any mode excluding a few exceptions as
highlighted (see Section 7.4.3, “BDM Hardware Commands”) and in secure mode (see Section 7.4.1,
“Security”). BDM firmware commands can only be executed when the system is not secure and is in active
background debug mode (BDM).
7.4.1 Security
If the user resets into special single chip mode with the system secured, a secured mode BDM firmware
lookup table is brought into the map overlapping a portion of the standard BDM firmware lookup table.
The secure BDM firmware verifies that the on-chip Flash EEPROM are erased. This being the case, the
UNSEC and ENBDM bit will get set. The BDM program jumps to the start of the standard BDM firmware
and the secured mode BDM firmware is turned off and all BDM commands are allowed. If the Flash does
not verify as erased, the BDM firmware sets the ENBDM bit, without asserting UNSEC, and the firmware
enters a loop. This causes the BDM hardware commands to become enabled, but does not enable the
firmware commands. This allows the BDM hardware to be used to erase the Flash.
BDM operation is not possible in any other mode than special single chip mode when the device is secured.
The device can only be unsecured via BDM serial interface in special single chip mode. For more
information regarding security, please see the S12S_9SEC Block Guide.
7.4.2 Enabling and Activating BDM
The system must be in active BDM to execute standard BDM firmware commands. BDM can be activated
only after being enabled. BDM is enabled by setting the ENBDM bit in the BDM status (BDMSTS)
register. The ENBDM bit is set by writing to the BDM status (BDMSTS) register, via the single-wire
interface, using a hardware command such as WRITE_BD_BYTE.
After being enabled, BDM is activated by one of the following1:
1. BDM is enabled and active immediately out of special single-chip reset.
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• Hardware BACKGROUND command
• CPU BGND instruction
• Breakpoint force or tag mechanism1
When BDM is activated, the CPU finishes executing the current instruction and then begins executing the
firmware in the standard BDM firmware lookup table. When BDM is activated by a breakpoint, the type
of breakpoint used determines if BDM becomes active before or after execution of the next instruction.
NOTE
If an attempt is made to activate BDM before being enabled, the CPU
resumes normal instruction execution after a brief delay. If BDM is not
enabled, any hardware BACKGROUND commands issued are ignored by
the BDM and the CPU is not delayed.
In active BDM, the BDM registers and standard BDM firmware lookup table are mapped to addresses
0x3_FF00 to 0x3_FFFF. BDM registers are mapped to addresses 0x3_FF00 to 0x3_FF0B. The BDM uses
these registers which are readable anytime by the BDM. However, these registers are not readable by user
programs.
When BDM is activated while CPU executes code overlapping with BDM firmware space the saved
program counter (PC) will be auto incremented by one from the BDM firmware, no matter what caused
the entry into BDM active mode (BGND instruction, BACKGROUND command or breakpoints). In such
a case the PC must be set to the next valid address via a WRITE_PC command before executing the GO
command.
7.4.3 BDM Hardware Commands
Hardware commands are used to read and write target system memory locations and to enter active
background debug mode. Target system memory includes all memory that is accessible by the CPU such
as on-chip RAM, Flash, I/O and control registers.
Hardware commands are executed with minimal or no CPU intervention and do not require the system to
be in active BDM for execution, although, they can still be executed in this mode. When executing a
hardware command, the BDM sub-block waits for a free bus cycle so that the background access does not
disturb the running application program. If a free cycle is not found within 128 clock cycles, the CPU is
momentarily frozen so that the BDM can steal a cycle. When the BDM finds a free cycle, the operation
does not intrude on normal CPU operation provided that it can be completed in a single cycle. However,
if an operation requires multiple cycles the CPU is frozen until the operation is complete, even though the
BDM found a free cycle.
The BDM hardware commands are listed in Table 7-5.
The READ_BD and WRITE_BD commands allow access to the BDM register locations. These locations
are not normally in the system memory map but share addresses with the application in memory. To
distinguish between physical memory locations that share the same address, BDM memory resources are
1. This method is provided by the S12S_DBG module.
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enabled just for the READ_BD and WRITE_BD access cycle. This allows the BDM to access BDM
locations unobtrusively, even if the addresses conflict with the application memory map.
7.4.4 Standard BDM Firmware Commands
BDM firmware commands are used to access and manipulate CPU resources. The system must be in active
BDM to execute standard BDM firmware commands, see Section 7.4.2, “Enabling and Activating BDM”.
Normal instruction execution is suspended while the CPU executes the firmware located in the standard
BDM firmware lookup table. The hardware command BACKGROUND is the usual way to activate BDM.
As the system enters active BDM, the standard BDM firmware lookup table and BDM registers become
visible in the on-chip memory map at 0x3_FF00–0x3_FFFF, and the CPU begins executing the standard
BDM firmware. The standard BDM firmware watches for serial commands and executes them as they are
received.
The firmware commands are shown in Table 7-6.
Table 7-5. Hardware Commands
Command Opcode
(hex) Data Description
BACKGROUND 90 None Enter background mode if BDM is enabled. If enabled, an ACK will be issued
when the part enters active background mode.
ACK_ENABLE D5 None Enable Handshake. Issues an ACK pulse after the command is executed.
ACK_DISABLE D6 None Disable Handshake. This command does not issue an ACK pulse.
READ_BD_BYTE E4 16-bit address
16-bit data out
Read from memory with standard BDM firmware lookup table in map.
Odd address data on low byte; even address data on high byte.
READ_BD_WORD EC 16-bit address
16-bit data out
Read from memory with standard BDM firmware lookup table in map.
Must be aligned access.
READ_BYTE E0 16-bit address
16-bit data out
Read from memory with standard BDM firmware lookup table out of map.
Odd address data on low byte; even address data on high byte.
READ_WORD E8 16-bit address
16-bit data out
Read from memory with standard BDM firmware lookup table out of map.
Must be aligned access.
WRITE_BD_BYTE C4 16-bit address
16-bit data in
Write to memory with standard BDM firmware lookup table in map.
Odd address data on low byte; even address data on high byte.
WRITE_BD_WORD CC 16-bit address
16-bit data in
Write to memory with standard BDM firmware lookup table in map.
Must be aligned access.
WRITE_BYTE C0 16-bit address
16-bit data in
Write to memory with standard BDM firmware lookup table out of map.
Odd address data on low byte; even address data on high byte.
WRITE_WORD C8 16-bit address
16-bit data in
Write to memory with standard BDM firmware lookup table out of map.
Must be aligned access.
NOTE:
If enabled, ACK will occur when data is ready for transmission for all BDM READ commands and will occur after the write is
complete for all BDM WRITE commands.
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7.4.5 BDM Command Structure
Hardware and firmware BDM commands start with an 8-bit opcode followed by a 16-bit address and/or a
16-bit data word, depending on the command. All the read commands return 16 bits of data despite the
byte or word implication in the command name.
8-bit reads return 16-bits of data, only one byte of which contains valid data.
If reading an even address, the valid data will appear in the MSB. If reading
an odd address, the valid data will appear in the LSB.
Table 7-6. Firmware Commands
Command1
1If enabled, ACK will occur when data is ready for transmission for all BDM READ commands and will occur after the write is
complete for all BDM WRITE commands.
Opcode
(hex) Data Description
READ_NEXT2
2When the firmware command READ_NEXT or WRITE_NEXT is used to access the BDM address space the BDM resources
are accessed rather than user code. Writing BDM firmware is not possible.
62 16-bit data out Increment X index register by 2 (X = X + 2), then read word X points to.
READ_PC 63 16-bit data out Read program counter.
READ_D 64 16-bit data out Read D accumulator.
READ_X 65 16-bit data out Read X index register.
READ_Y 66 16-bit data out Read Y index register.
READ_SP 67 16-bit data out Read stack pointer.
WRITE_NEXT242 16-bit data in Increment X index register by 2 (X = X + 2), then write word to location
pointed to by X.
WRITE_PC 43 16-bit data in Write program counter.
WRITE_D 44 16-bit data in Write D accumulator.
WRITE_X 45 16-bit data in Write X index register.
WRITE_Y 46 16-bit data in Write Y index register.
WRITE_SP 47 16-bit data in Write stack pointer.
GO 08 none Go to user program. If enabled, ACK will occur when leaving active
background mode.
GO_UNTIL3
3System stop disables the ACK function and ignored commands will not have an ACK-pulse (e.g., CPU in stop or wait mode).
The GO_UNTIL command will not get an Acknowledge if CPU executes the wait or stop instruction before the “UNTIL”
condition (BDM active again) is reached (see Section 7.4.7, “Serial Interface Hardware Handshake Protocol” last note).
0C none Go to user program. If enabled, ACK will occur upon returning to active
background mode.
TRACE1 10 none Execute one user instruction then return to active BDM. If enabled,
ACK will occur upon returning to active background mode.
TAGGO -> GO 18 none (Previous enable tagging and go to user program.)
This command will be deprecated and should not be used anymore.
Opcode will be executed as a GO command.
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16-bit misaligned reads and writes are generally not allowed. If attempted
by BDM hardware command, the BDM ignores the least significant bit of
the address and assumes an even address from the remaining bits.
For hardware data read commands, the external host must wait at least 150 bus clock cycles after sending
the address before attempting to obtain the read data. This is to be certain that valid data is available in the
BDM shift register, ready to be shifted out. For hardware write commands, the external host must wait
150 bus clock cycles after sending the data to be written before attempting to send a new command. This
is to avoid disturbing the BDM shift register before the write has been completed. The 150 bus clock cycle
delay in both cases includes the maximum 128 cycle delay that can be incurred as the BDM waits for a
free cycle before stealing a cycle.
For BDM firmware read commands, the external host should wait at least 48 bus clock cycles after sending
the command opcode and before attempting to obtain the read data. The 48 cycle wait allows enough time
for the requested data to be made available in the BDM shift register, ready to be shifted out.
For BDM firmware write commands, the external host must wait 36 bus clock cycles after sending the data
to be written before attempting to send a new command. This is to avoid disturbing the BDM shift register
before the write has been completed.
The external host should wait for at least for 76 bus clock cycles after a TRACE1 or GO command before
starting any new serial command. This is to allow the CPU to exit gracefully from the standard BDM
firmware lookup table and resume execution of the user code. Disturbing the BDM shift register
prematurely may adversely affect the exit from the standard BDM firmware lookup table.
NOTE
If the bus rate of the target processor is unknown or could be changing, it is
recommended that the ACK (acknowledge function) is used to indicate
when an operation is complete. When using ACK, the delay times are
automated.
Figure 7-6 represents the BDM command structure. The command blocks illustrate a series of eight bit
times starting with a falling edge. The bar across the top of the blocks indicates that the BKGD line idles
in the high state. The time for an 8-bit command is 8 × 16 target clock cycles.1
1. Target clock cycles are cycles measured using the target MCU’s serial clock rate. See Section 7.4.6, “BDM Serial Interface”
and Section 7.3.2.1, “BDM Status Register (BDMSTS)” for information on how serial clock rate is selected.
Background Debug Module (S12SBDMV1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 267
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 7-6. BDM Command Structure
7.4.6 BDM Serial Interface
The BDM communicates with external devices serially via the BKGD pin. During reset, this pin is a mode
select input which selects between normal and special modes of operation. After reset, this pin becomes
the dedicated serial interface pin for the BDM.
The BDM serial interface is timed based on the VCO clock (please refer to the CPMU Block Guide for
more details), which gets divided by 8. This clock will be referred to as the target clock in the following
explanation.
The BDM serial interface uses a clocking scheme in which the external host generates a falling edge on
the BKGD pin to indicate the start of each bit time. This falling edge is sent for every bit whether data is
transmitted or received. Data is transferred most significant bit (MSB) first at 16 target clock cycles per
bit. The interface times out if 512 clock cycles occur between falling edges from the host.
The BKGD pin is a pseudo open-drain pin and has an weak on-chip active pull-up that is enabled at all
times. It is assumed that there is an external pull-up and that drivers connected to BKGD do not typically
drive the high level. Since R-C rise time could be unacceptably long, the target system and host provide
brief driven-high (speedup) pulses to drive BKGD to a logic 1. The source of this speedup pulse is the host
for transmit cases and the target for receive cases.
The timing for host-to-target is shown in Figure 7-7 and that of target-to-host in Figure 7-8 and
Figure 7-9. All four cases begin when the host drives the BKGD pin low to generate a falling edge. Since
the host and target are operating from separate clocks, it can take the target system up to one full clock
cycle to recognize this edge. The target measures delays from this perceived start of the bit time while the
host measures delays from the point it actually drove BKGD low to start the bit up to one target clock cycle
Hardware
Hardware
Firmware
Firmware
GO,
48-BC
BC = Bus Clock Cycles
Command Address
150-BC
Delay
Next
DELAY
8 Bits
AT ~16 TC/Bit
16 Bits
AT ~16 TC/Bit
16 Bits
AT ~16 TC/Bit
Command Address Data Next
Data
Read
Write
Read
Write
TRACE
Command Next
Command Data
76-BC
Delay
Next
Command
150-BC
Delay
36-BC
DELAY
Command
Command
Command
Command
Data
Next
Command
TC = Target Clock Cycles
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earlier. Synchronization between the host and target is established in this manner at the start of every bit
time.
Figure 7-7 shows an external host transmitting a logic 1 and transmitting a logic 0 to the BKGD pin of a
target system. The host is asynchronous to the target, so there is up to a one clock-cycle delay from the
host-generated falling edge to where the target recognizes this edge as the beginning of the bit time. Ten
target clock cycles later, the target senses the bit level on the BKGD pin. Internal glitch detect logic
requires the pin be driven high no later that eight target clock cycles after the falling edge for a logic 1
transmission.
Since the host drives the high speedup pulses in these two cases, the rising edges look like digitally driven
signals.
Figure 7-7. BDM Host-to-Target Serial Bit Timing
The receive cases are more complicated. Figure 7-8 shows the host receiving a logic 1 from the target
system. Since the host is asynchronous to the target, there is up to one clock-cycle delay from the
host-generated falling edge on BKGD to the perceived start of the bit time in the target. The host holds the
BKGD pin low long enough for the target to recognize it (at least two target clock cycles). The host must
release the low drive before the target drives a brief high speedup pulse seven target clock cycles after the
perceived start of the bit time. The host should sample the bit level about 10 target clock cycles after it
started the bit time.
Target Senses Bit
10 Cycles
Synchronization
Uncertainty
BDM Clock
(Target MCU)
Host
Transmit 1
Host
Transmit 0
Perceived
Start of Bit Time Earliest
Start of
Next Bit
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Figure 7-8. BDM Target-to-Host Serial Bit Timing (Logic 1)
Figure 7-9 shows the host receiving a logic 0 from the target. Since the host is asynchronous to the target,
there is up to a one clock-cycle delay from the host-generated falling edge on BKGD to the start of the bit
time as perceived by the target. The host initiates the bit time but the target finishes it. Since the target
wants the host to receive a logic 0, it drives the BKGD pin low for 13 target clock cycles then briefly drives
it high to speed up the rising edge. The host samples the bit level about 10 target clock cycles after starting
the bit time.
Figure 7-9. BDM Target-to-Host Serial Bit Timing (Logic 0)
High-Impedance
Earliest
Start of
Next Bit
R-C Rise
10 Cycles
10 Cycles
Host Samples
BKGD Pin
Perceived
Start of Bit Time
BKGD Pin
BDM Clock
(Target MCU)
Host
Drive to
BKGD Pin
Target System
Speedup
Pulse
High-Impedance
High-Impedance
Earliest
Start of
Next Bit
BDM Clock
(Target MCU)
Host
Drive to
BKGD Pin
BKGD Pin
Perceived
Start of Bit Time
10 Cycles
10 Cycles
Host Samples
BKGD Pin
Target System
Drive and
Speedup Pulse
Speedup Pulse
High-Impedance
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MC9S12G Family Reference Manual, Rev.1.06
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7.4.7 Serial Interface Hardware Handshake Protocol
BDM commands that require CPU execution are ultimately treated at the MCU bus rate. Since the BDM
clock source can be modified when changing the settings for the VCO frequency (CPMUSYNR), it is very
helpful to provide a handshake protocol in which the host could determine when an issued command is
executed by the CPU. The BDM clock frequency is always VCO frequency divided by 8. The alternative
is to always wait the amount of time equal to the appropriate number of cycles at the slowest possible rate
the clock could be running. This sub-section will describe the hardware handshake protocol.
The hardware handshake protocol signals to the host controller when an issued command was successfully
executed by the target. This protocol is implemented by a 16 serial clock cycle low pulse followed by a
brief speedup pulse in the BKGD pin. This pulse is generated by the target MCU when a command, issued
by the host, has been successfully executed (see Figure 7-10). This pulse is referred to as the ACK pulse.
After the ACK pulse has finished: the host can start the bit retrieval if the last issued command was a read
command, or start a new command if the last command was a write command or a control command
(BACKGROUND, GO, GO_UNTIL or TRACE1). The ACK pulse is not issued earlier than 32 serial clock
cycles after the BDM command was issued. The end of the BDM command is assumed to be the 16th tick
of the last bit. This minimum delay assures enough time for the host to perceive the ACK pulse. Note also
that, there is no upper limit for the delay between the command and the related ACK pulse, since the
command execution depends upon the CPU bus, which in some cases could be very slow due to long
accesses taking place.This protocol allows a great flexibility for the POD designers, since it does not rely
on any accurate time measurement or short response time to any event in the serial communication.
Figure 7-10. Target Acknowledge Pulse (ACK)
NOTE
If the ACK pulse was issued by the target, the host assumes the previous
command was executed. If the CPU enters wait or stop prior to executing a
hardware command, the ACK pulse will not be issued meaning that the
BDM command was not executed. After entering wait or stop mode, the
BDM command is no longer pending.
16 Cycles
BDM Clock
(Target MCU)
Target
Transmits
ACK Pulse
High-Impedance
BKGD Pin
Minimum Delay
From the BDM Command
32 Cycles
Earliest
Start of
Next Bit
Speedup Pulse
16th Tick of the
Last Command Bit
High-Impedance
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 7-11 shows the ACK handshake protocol in a command level timing diagram. The READ_BYTE
instruction is used as an example. First, the 8-bit instruction opcode is sent by the host, followed by the
address of the memory location to be read. The target BDM decodes the instruction. A bus cycle is grabbed
(free or stolen) by the BDM and it executes the READ_BYTE operation. Having retrieved the data, the
BDM issues an ACK pulse to the host controller, indicating that the addressed byte is ready to be retrieved.
After detecting the ACK pulse, the host initiates the byte retrieval process. Note that data is sent in the form
of a word and the host needs to determine which is the appropriate byte based on whether the address was
odd or even.
Figure 7-11. Handshake Protocol at Command Level
Differently from the normal bit transfer (where the host initiates the transmission), the serial interface ACK
handshake pulse is initiated by the target MCU by issuing a negative edge in the BKGD pin. The hardware
handshake protocol in Figure 7-10 specifies the timing when the BKGD pin is being driven, so the host
should follow this timing constraint in order to avoid the risk of an electrical conflict in the BKGD pin.
NOTE
The only place the BKGD pin can have an electrical conflict is when one
side is driving low and the other side is issuing a speedup pulse (high). Other
“highs” are pulled rather than driven. However, at low rates the time of the
speedup pulse can become lengthy and so the potential conflict time
becomes longer as well.
The ACK handshake protocol does not support nested ACK pulses. If a BDM command is not
acknowledge by an ACK pulse, the host needs to abort the pending command first in order to be able to
issue a new BDM command. When the CPU enters wait or stop while the host issues a hardware command
(e.g., WRITE_BYTE), the target discards the incoming command due to the wait or stop being detected.
Therefore, the command is not acknowledged by the target, which means that the ACK pulse will not be
issued in this case. After a certain time the host (not aware of stop or wait) should decide to abort any
possible pending ACK pulse in order to be sure a new command can be issued. Therefore, the protocol
provides a mechanism in which a command, and its corresponding ACK, can be aborted.
READ_BYTE
BDM Issues the
BKGD Pin Byte Address
BDM Executes the
READ_BYTE Command
Host Target
HostTarget
BDM Decodes
the Command
ACK Pulse (out of scale)
Host Target
(2) Bytes are
Retrieved
New BDM
Command
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NOTE
The ACK pulse does not provide a time out. This means for the GO_UNTIL
command that it can not be distinguished if a stop or wait has been executed
(command discarded and ACK not issued) or if the “UNTIL” condition
(BDM active) is just not reached yet. Hence in any case where the ACK
pulse of a command is not issued the possible pending command should be
aborted before issuing a new command. See the handshake abort procedure
described in Section 7.4.8, “Hardware Handshake Abort Procedure”.
7.4.8 Hardware Handshake Abort Procedure
The abort procedure is based on the SYNC command. In order to abort a command, which had not issued
the corresponding ACK pulse, the host controller should generate a low pulse in the BKGD pin by driving
it low for at least 128 serial clock cycles and then driving it high for one serial clock cycle, providing a
speedup pulse. By detecting this long low pulse in the BKGD pin, the target executes the SYNC protocol,
see Section 7.4.9, “SYNC — Request Timed Reference Pulse”, and assumes that the pending command
and therefore the related ACK pulse, are being aborted. Therefore, after the SYNC protocol has been
completed the host is free to issue new BDM commands. For BDM firmware READ or WRITE commands
it can not be guaranteed that the pending command is aborted when issuing a SYNC before the
corresponding ACK pulse. There is a short latency time from the time the READ or WRITE access begins
until it is finished and the corresponding ACK pulse is issued. The latency time depends on the firmware
READ or WRITE command that is issued and on the selected bus clock rate. When the SYNC command
starts during this latency time the READ or WRITE command will not be aborted, but the corresponding
ACK pulse will be aborted. A pending GO, TRACE1 or GO_UNTIL command can not be aborted. Only
the corresponding ACK pulse can be aborted by the SYNC command.
Although it is not recommended, the host could abort a pending BDM command by issuing a low pulse in
the BKGD pin shorter than 128 serial clock cycles, which will not be interpreted as the SYNC command.
The ACK is actually aborted when a negative edge is perceived by the target in the BKGD pin. The short
abort pulse should have at least 4 clock cycles keeping the BKGD pin low, in order to allow the negative
edge to be detected by the target. In this case, the target will not execute the SYNC protocol but the pending
command will be aborted along with the ACK pulse. The potential problem with this abort procedure is
when there is a conflict between the ACK pulse and the short abort pulse. In this case, the target may not
perceive the abort pulse. The worst case is when the pending command is a read command (i.e.,
READ_BYTE). If the abort pulse is not perceived by the target the host will attempt to send a new
command after the abort pulse was issued, while the target expects the host to retrieve the accessed
memory byte. In this case, host and target will run out of synchronism. However, if the command to be
aborted is not a read command the short abort pulse could be used. After a command is aborted the target
assumes the next negative edge, after the abort pulse, is the first bit of a new BDM command.
NOTE
The details about the short abort pulse are being provided only as a reference
for the reader to better understand the BDM internal behavior. It is not
recommended that this procedure be used in a real application.
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Since the host knows the target serial clock frequency, the SYNC command (used to abort a command)
does not need to consider the lower possible target frequency. In this case, the host could issue a SYNC
very close to the 128 serial clock cycles length. Providing a small overhead on the pulse length in order to
assure the SYNC pulse will not be misinterpreted by the target. See Section 7.4.9, “SYNC — Request
Timed Reference Pulse”.
Figure 7-12 shows a SYNC command being issued after a READ_BYTE, which aborts the READ_BYTE
command. Note that, after the command is aborted a new command could be issued by the host computer.
Figure 7-12. ACK Abort Procedure at the Command Level
NOTE
Figure 7-12 does not represent the signals in a true timing scale
Figure 7-13 shows a conflict between the ACK pulse and the SYNC request pulse. This conflict could
occur if a POD device is connected to the target BKGD pin and the target is already in debug active mode.
Consider that the target CPU is executing a pending BDM command at the exact moment the POD is being
connected to the BKGD pin. In this case, an ACK pulse is issued along with the SYNC command. In this
case, there is an electrical conflict between the ACK speedup pulse and the SYNC pulse. Since this is not
a probable situation, the protocol does not prevent this conflict from happening.
Figure 7-13. ACK Pulse and SYNC Request Conflict
READ_BYTE READ_STATUSBKGD Pin Memory Address New BDM Command
New BDM Command
Host Target Host Target Host Target
SYNC Response
From the Target
(Out of Scale)
BDM Decode
and Starts to Execute
the READ_BYTE Command
READ_BYTE CMD is Aborted
by the SYNC Request
(Out of Scale)
BDM Clock
(Target MCU)
Target MCU
Drives to
BKGD Pin
BKGD Pin
16 Cycles
Speedup Pulse
High-Impedance
Host
Drives SYNC
To BKGD Pin
ACK Pulse
Host SYNC Request Pulse
At Least 128 Cycles
Electrical Conflict
Host and
Target Drive
to BKGD Pin
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
This information is being provided so that the MCU integrator will be aware
that such a conflict could occur.
The hardware handshake protocol is enabled by the ACK_ENABLE and disabled by the ACK_DISABLE
BDM commands. This provides backwards compatibility with the existing POD devices which are not
able to execute the hardware handshake protocol. It also allows for new POD devices, that support the
hardware handshake protocol, to freely communicate with the target device. If desired, without the need
for waiting for the ACK pulse.
The commands are described as follows:
• ACK_ENABLE — enables the hardware handshake protocol. The target will issue the ACK pulse
when a CPU command is executed by the CPU. The ACK_ENABLE command itself also has the
ACK pulse as a response.
• ACK_DISABLE — disables the ACK pulse protocol. In this case, the host needs to use the worst
case delay time at the appropriate places in the protocol.
The default state of the BDM after reset is hardware handshake protocol disabled.
All the read commands will ACK (if enabled) when the data bus cycle has completed and the data is then
ready for reading out by the BKGD serial pin. All the write commands will ACK (if enabled) after the data
has been received by the BDM through the BKGD serial pin and when the data bus cycle is complete. See
Section 7.4.3, “BDM Hardware Commands” and Section 7.4.4, “Standard BDM Firmware Commands”
for more information on the BDM commands.
The ACK_ENABLE sends an ACK pulse when the command has been completed. This feature could be
used by the host to evaluate if the target supports the hardware handshake protocol. If an ACK pulse is
issued in response to this command, the host knows that the target supports the hardware handshake
protocol. If the target does not support the hardware handshake protocol the ACK pulse is not issued. In
this case, the ACK_ENABLE command is ignored by the target since it is not recognized as a valid
command.
The BACKGROUND command will issue an ACK pulse when the CPU changes from normal to
background mode. The ACK pulse related to this command could be aborted using the SYNC command.
The GO command will issue an ACK pulse when the CPU exits from background mode. The ACK pulse
related to this command could be aborted using the SYNC command.
The GO_UNTIL command is equivalent to a GO command with exception that the ACK pulse, in this
case, is issued when the CPU enters into background mode. This command is an alternative to the GO
command and should be used when the host wants to trace if a breakpoint match occurs and causes the
CPU to enter active background mode. Note that the ACK is issued whenever the CPU enters BDM, which
could be caused by a breakpoint match or by a BGND instruction being executed. The ACK pulse related
to this command could be aborted using the SYNC command.
The TRACE1 command has the related ACK pulse issued when the CPU enters background active mode
after one instruction of the application program is executed. The ACK pulse related to this command could
be aborted using the SYNC command.
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Freescale Semiconductor 275
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
7.4.9 SYNC — Request Timed Reference Pulse
The SYNC command is unlike other BDM commands because the host does not necessarily know the
correct communication speed to use for BDM communications until after it has analyzed the response to
the SYNC command. To issue a SYNC command, the host should perform the following steps:
1. Drive the BKGD pin low for at least 128 cycles at the lowest possible BDM serial communication
frequency (The lowest serial communication frequency is determined by the settings for the VCO
clock (CPMUSYNR). The BDM clock frequency is always VCO clock frequency divided by 8.)
2. Drive BKGD high for a brief speedup pulse to get a fast rise time (this speedup pulse is typically
one cycle of the host clock.)
3. Remove all drive to the BKGD pin so it reverts to high impedance.
4. Listen to the BKGD pin for the sync response pulse.
Upon detecting the SYNC request from the host, the target performs the following steps:
1. Discards any incomplete command received or bit retrieved.
2. Waits for BKGD to return to a logic one.
3. Delays 16 cycles to allow the host to stop driving the high speedup pulse.
4. Drives BKGD low for 128 cycles at the current BDM serial communication frequency.
5. Drives a one-cycle high speedup pulse to force a fast rise time on BKGD.
6. Removes all drive to the BKGD pin so it reverts to high impedance.
The host measures the low time of this 128 cycle SYNC response pulse and determines the correct speed
for subsequent BDM communications. Typically, the host can determine the correct communication speed
within a few percent of the actual target speed and the communication protocol can easily tolerate speed
errors of several percent.
As soon as the SYNC request is detected by the target, any partially received command or bit retrieved is
discarded. This is referred to as a soft-reset, equivalent to a time-out in the serial communication. After the
SYNC response, the target will consider the next negative edge (issued by the host) as the start of a new
BDM command or the start of new SYNC request.
Another use of the SYNC command pulse is to abort a pending ACK pulse. The behavior is exactly the
same as in a regular SYNC command. Note that one of the possible causes for a command to not be
acknowledged by the target is a host-target synchronization problem. In this case, the command may not
have been understood by the target and so an ACK response pulse will not be issued.
7.4.10 Instruction Tracing
When a TRACE1 command is issued to the BDM in active BDM, the CPU exits the standard BDM
firmware and executes a single instruction in the user code. Once this has occurred, the CPU is forced to
return to the standard BDM firmware and the BDM is active and ready to receive a new command. If the
TRACE1 command is issued again, the next user instruction will be executed. This facilitates stepping or
tracing through the user code one instruction at a time.
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If an interrupt is pending when a TRACE1 command is issued, the interrupt stacking operation occurs but
no user instruction is executed. Once back in standard BDM firmware execution, the program counter
points to the first instruction in the interrupt service routine.
Be aware when tracing through the user code that the execution of the user code is done step by step but
all peripherals are free running. Hence possible timing relations between CPU code execution and
occurrence of events of other peripherals no longer exist.
Do not trace the CPU instruction BGND used for soft breakpoints. Tracing over the BGND instruction will
result in a return address pointing to BDM firmware address space.
When tracing through user code which contains stop or wait instructions the following will happen when
the stop or wait instruction is traced:
The CPU enters stop or wait mode and the TRACE1 command can not be finished before leaving
the low power mode. This is the case because BDM active mode can not be entered after CPU
executed the stop instruction. However all BDM hardware commands except the BACKGROUND
command are operational after tracing a stop or wait instruction and still being in stop or wait
mode. If system stop mode is entered (all bus masters are in stop mode) no BDM command is
operational.
As soon as stop or wait mode is exited the CPU enters BDM active mode and the saved PC value
points to the entry of the corresponding interrupt service routine.
In case the handshake feature is enabled the corresponding ACK pulse of the TRACE1 command
will be discarded when tracing a stop or wait instruction. Hence there is no ACK pulse when BDM
active mode is entered as part of the TRACE1 command after CPU exited from stop or wait mode.
All valid commands sent during CPU being in stop or wait mode or after CPU exited from stop or
wait mode will have an ACK pulse. The handshake feature becomes disabled only when system
stop mode has been reached. Hence after a system stop mode the handshake feature must be
enabled again by sending the ACK_ENABLE command.
7.4.11 Serial Communication Time Out
The host initiates a host-to-target serial transmission by generating a falling edge on the BKGD pin. If
BKGD is kept low for more than 128 target clock cycles, the target understands that a SYNC command
was issued. In this case, the target will keep waiting for a rising edge on BKGD in order to answer the
SYNC request pulse. If the rising edge is not detected, the target will keep waiting forever without any
time-out limit.
Consider now the case where the host returns BKGD to logic one before 128 cycles. This is interpreted as
a valid bit transmission, and not as a SYNC request. The target will keep waiting for another falling edge
marking the start of a new bit. If, however, a new falling edge is not detected by the target within 512 clock
cycles since the last falling edge, a time-out occurs and the current command is discarded without affecting
memory or the operating mode of the MCU. This is referred to as a soft-reset.
If a read command is issued but the data is not retrieved within 512 serial clock cycles, a soft-reset will
occur causing the command to be disregarded. The data is not available for retrieval after the time-out has
occurred. This is the expected behavior if the handshake protocol is not enabled. In order to allow the data
to be retrieved even with a large clock frequency mismatch (between BDM and CPU) when the hardware
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handshake protocol is enabled, the time out between a read command and the data retrieval is disabled.
Therefore, the host could wait for more then 512 serial clock cycles and still be able to retrieve the data
from an issued read command. However, once the handshake pulse (ACK pulse) is issued, the time-out
feature is re-activated, meaning that the target will time out after 512 clock cycles. Therefore, the host
needs to retrieve the data within a 512 serial clock cycles time frame after the ACK pulse had been issued.
After that period, the read command is discarded and the data is no longer available for retrieval. Any
negative edge in the BKGD pin after the time-out period is considered to be a new command or a SYNC
request.
Note that whenever a partially issued command, or partially retrieved data, has occurred the time out in the
serial communication is active. This means that if a time frame higher than 512 serial clock cycles is
observed between two consecutive negative edges and the command being issued or data being retrieved
is not complete, a soft-reset will occur causing the partially received command or data retrieved to be
disregarded. The next negative edge in the BKGD pin, after a soft-reset has occurred, is considered by the
target as the start of a new BDM command, or the start of a SYNC request pulse.
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Chapter 8
S12S Debug Module (S12SDBG)
Revision History
8.1 Introduction
The S12SDBG module provides an on-chip trace buffer with flexible triggering capability to allow
non-intrusive debug of application software. The S12SDBG module is optimized for S12SCPU
debugging.
Typically the S12SDBG module is used in conjunction with the S12SBDM module, whereby the user
configures the S12SDBG module for a debugging session over the BDM interface. Once configured the
S12SDBG module is armed and the device leaves BDM returning control to the user program, which is
then monitored by the S12SDBG module. Alternatively the S12SDBG module can be configured over a
serial interface using SWI routines.
8.1.1 Glossary Of Terms
COF: Change Of Flow. Change in the program flow due to a conditional branch, indexed jump or interrupt.
Revision Number Date Author Summary of Changes
02.00 31.JUL..2007
State sequencer encoding enhanced
Simultaneous TRIG and ARM setting updated
Pure PC replaced with Compressed Pure PC Mode 8.4.5.2.4
02.01 09.AUG..2007 Enhanced compressed Pure PC mode description
02.02 10.AUG..2007 Added CompA size & databus byte compare enhancement
02.03 29.AUG..2007
DBGSCR1 encoding 1101 added.
CompA functional description improved
Swapped NDB and SZ in DBGACTL to match DBGBCTL
02.04 17.OCT.2007 Reverted to final state transition priority
02.05 19.OCT.2007 Table 8-33 DB byte access configuration corrected
02.06 22.NOV.2007
Table 8-39 Correction
Section 8.4.5.6, “Trace Buffer Reset State Added NOTE
02.07 13.DEC.2007 Section 8.5, “Application Information Added application
information
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BDM: Background Debug Mode
S12SBDM: Background Debug Module
DUG: Device User Guide, describing the features of the device into which the DBG is integrated.
WORD: 16 bit data entity
Data Line: 20 bit data entity
CPU: S12SCPU module
DBG: S12SDBG module
POR: Power On Reset
Tag: Tags can be attached to CPU opcodes as they enter the instruction pipe. If the tagged opcode reaches
the execution stage a tag hit occurs.
8.1.2 Overview
The comparators monitor the bus activity of the CPU module. A match can initiate a state sequencer
transition. On a transition to the Final State, bus tracing is triggered and/or a breakpoint can be generated.
Independent of comparator matches a transition to Final State with associated tracing and breakpoint can
be triggered immediately by writing to the TRIG control bit.
The trace buffer is visible through a 2-byte window in the register address map and can be read out using
standard 16-bit word reads. Tracing is disabled when the MCU system is secured.
8.1.3 Features
• Three comparators (A, B and C)
— Comparators A compares the full address bus and full 16-bit data bus
— Comparator A features a data bus mask register
— Comparators B and C compare the full address bus only
— Each comparator features selection of read or write access cycles
— Comparator B allows selection of byte or word access cycles
— Comparator matches can initiate state sequencer transitions
• Three comparator modes
— Simple address/data comparator match mode
— Inside address range mode, Addmin ≤ Address ≤Addmax
— Outside address range match mode, Address <Addmin or Address > Addmax
• Two types of matches
— Tagged — This matches just before a specific instruction begins execution
— Force — This is valid on the first instruction boundary after a match occurs
• Two types of breakpoints
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— CPU breakpoint entering BDM on breakpoint (BDM)
— CPU breakpoint executing SWI on breakpoint (SWI)
• Trigger mode independent of comparators
— TRIG Immediate software trigger
• Four trace modes
— Normal: change of flow (COF) PC information is stored (see Section 8.4.5.2.1, “Normal Mode)
for change of flow definition.
— Loop1: same as Normal but inhibits consecutive duplicate source address entries
— Detail: address and data for all cycles except free cycles and opcode fetches are stored
— Compressed Pure PC: all program counter addresses are stored
• 4-stage state sequencer for trace buffer control
— Tracing session trigger linked to Final State of state sequencer
— Begin and End alignment of tracing to trigger
8.1.4 Modes of Operation
The DBG module can be used in all MCU functional modes.
During BDM hardware accesses and whilst the BDM module is active, CPU monitoring is disabled. When
the CPU enters active BDM Mode through a BACKGROUND command, the DBG module, if already
armed, remains armed.
The DBG module tracing is disabled if the MCU is secure, however, breakpoints can still be generated
Table 8-1. Mode Dependent Restriction Summary
BDM
Enable
BDM
Active
MCU
Secure
Comparator
Matches Enabled
Breakpoints
Possible
Tagging
Possible
Tracing
Possible
x x 1 Yes Yes Yes No
0 0 0 Yes Only SWI Yes Yes
0 1 0 Active BDM not possible when not enabled
1 0 0 Yes Yes Yes Yes
110 No No No No
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8.1.5 Block Diagram
Figure 8-1. Debug Module Block Diagram
8.2 External Signal Description
There are no external signals associated with this module.
8.3 Memory Map and Registers
8.3.1 Module Memory Map
A summary of the registers associated with the DBG sub-block is shown in Figure 8-2. Detailed
descriptions of the registers and bits are given in the subsections that follow.
Address Name Bit 7 6 54321Bit 0
0x0020 DBGC1 RARM 00
BDM DBGBRK 0COMRV
W TRIG
0x0021 DBGSR R1TBF 0 0 0 0 SSF2 SSF1 SSF0
W
0x0022 DBGTCR R0TSOURCE 00 TRCMOD 0TALIGN
W
0x0023 DBGC2 R000000 ABCM
W
Figure 8-2. Quick Reference to DBG Registers
CPU BUS
TRACE BUFFER
BUS INTERFACE
TRANSITION
MATCH0
STATE
COMPARATOR B
COMPARATOR C
COMPARATOR A
STATE SEQUENCER
MATCH1
MATCH2
TRACE
READ TRACE DATA (DBG READ DATA BUS)
CONTROL
SECURE
BREAKPOINT REQUESTS
COMPARATOR
MATCH CONTROL
TRIGGER
TAG &
MATCH
CONTROL
LOGIC
TAG S
TAGHITS
STATE
TO CPU
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8.3.2 Register Descriptions
This section consists of the DBG control and trace buffer register descriptions in address order. Each
comparator has a bank of registers that are visible through an 8-byte window between 0x0028 and 0x002F
in the DBG module register address map. When ARM is set in DBGC1, the only bits in the DBG module
registers that can be written are ARM, TRIG, and COMRV[1:0]
0x0024 DBGTBH R Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
W
0x0025 DBGTBL R Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
W
0x0026 DBGCNT R1TBF 0 CNT
W
0x0027 DBGSCRX R0 0 0 0 SC3 SC2 SC1 SC0
W
0x0027 DBGMFR R 0 0 0 0 0 MC2 MC1 MC0
W
20x0028 DBGACTL RSZE SZ TAG BRK RW RWE NDB COMPE
W
30x0028 DBGBCTL RSZE SZ TAG BRK RW RWE 0COMPE
W
40x0028 DBGCCTL R0 0 TAG BRK RW RWE 0COMPE
W
0x0029 DBGXAH R000000
Bit 17 Bit 16
W
0x002A DBGXAM RBit 15 14 13 12 11 10 9 Bit 8
W
0x002B DBGXAL RBit 7 6 54321Bit 0
W
0x002C DBGADH RBit 15 14 13 12 11 10 9 Bit 8
W
0x002D DBGADL RBit 7 6 54321Bit 0
W
0x002E DBGADHM RBit 15 14 13 12 11 10 9 Bit 8
W
0x002F DBGADLM RBit 7 6 54321Bit 0
W
1This bit is visible at DBGCNT[7] and DBGSR[7]
2This represents the contents if the Comparator A control register is blended into this address.
3This represents the contents if the Comparator B control register is blended into this address
4This represents the contents if the Comparator C control register is blended into this address
Address Name Bit 7 6 54321Bit 0
Figure 8-2. Quick Reference to DBG Registers
S12S Debug Module (S12SDBG)
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8.3.2.1 Debug Control Register 1 (DBGC1)
Read: Anytime
Write: Bits 7, 1, 0 anytime
Bit 6 can be written anytime but always reads back as 0.
Bits 4:3 anytime DBG is not armed.
NOTE
When disarming the DBG by clearing ARM with software, the contents of
bits[4:3] are not affected by the write, since up until the write operation,
ARM = 1 preventing these bits from being written. These bits must be
cleared using a second write if required.
Address: 0x0020
76543210
RARM 00
BDM DBGBRK 0COMRV
W TRIG
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 8-3. Debug Control Register (DBGC1)
Table 8-2. DBGC1 Field Descriptions
Field Description
7
ARM
Arm Bit — The ARM bit controls whether the DBG module is armed. This bit can be set and cleared by user
software and is automatically cleared on completion of a debug session, or if a breakpoint is generated with
tracing not enabled. On setting this bit the state sequencer enters State1.
0 Debugger disarmed
1 Debugger armed
6
TRIG
Immediate Trigger Request Bit — This bit when written to 1 requests an immediate trigger independent of state
sequencer status. When tracing is complete a forced breakpoint may be generated depending upon DBGBRK
and BDM bit settings. This bit always reads back a 0. Writing a 0 to this bit has no effect. If the
DBGTCR_TSOURCE bit is clear no tracing is carried out. If tracing has already commenced using BEGIN trigger
alignment, it continues until the end of the tracing session as defined by the TALIGN bit, thus TRIG has no affect.
In secure mode tracing is disabled and writing to this bit cannot initiate a tracing session.
The session is ended by setting TRIG and ARM simultaneously.
0 Do not trigger until the state sequencer enters the Final State.
1 Trigger immediately
4
BDM
Background Debug Mode Enable — This bit determines if a breakpoint causes the system to enter Background
Debug Mode (BDM) or initiate a Software Interrupt (SWI). If this bit is set but the BDM is not enabled by the
ENBDM bit in the BDM module, then breakpoints default to SWI.
0 Breakpoint to Software Interrupt if BDM inactive. Otherwise no breakpoint.
1 Breakpoint to BDM, if BDM enabled. Otherwise breakpoint to SWI
3
DBGBRK
S12SDBG Breakpoint Enable Bit — The DBGBRK bit controls whether the debugger will request a breakpoint
on reaching the state sequencer Final State. If tracing is enabled, the breakpoint is generated on completion
of the tracing session. If tracing is not enabled, the breakpoint is generated immediately.
0 No Breakpoint generated
1 Breakpoint generated
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8.3.2.2 Debug Status Register (DBGSR)
Read: Anytime
Write: Never
1–0
COMRV
Comparator Register Visibility Bits — These bits determine which bank of comparator register is visible in the
8-byte window of the S12SDBG module address map, located between 0x0028 to 0x002F. Furthermore these
bits determine which register is visible at the address 0x0027. See Table 8-3.
Table 8-3. COMRV Encoding
COMRV Visible Comparator Visible Register at 0x0027
00 Comparator A DBGSCR1
01 Comparator B DBGSCR2
10 Comparator C DBGSCR3
11 None DBGMFR
Address: 0x0021
76543210
R TBF 0 0 0 0 SSF2 SSF1 SSF0
W
Reset
POR
—
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-4. Debug Status Register (DBGSR)
Table 8-4. DBGSR Field Descriptions
Field Description
7
TBF
Trace Buffer Full — The TBF bit indicates that the trace buffer has stored 64 or more lines of data since it was
last armed. If this bit is set, then all 64 lines will be valid data, regardless of the value of DBGCNT bits. The TBF
bit is cleared when ARM in DBGC1 is written to a one. The TBF is cleared by the power on reset initialization.
Other system generated resets have no affect on this bit
This bit is also visible at DBGCNT[7]
2–0
SSF[2:0]
State Sequencer Flag Bits — The SSF bits indicate in which state the State Sequencer is currently in. During
a debug session on each transition to a new state these bits are updated. If the debug session is ended by
software clearing the ARM bit, then these bits retain their value to reflect the last state of the state sequencer
before disarming. If a debug session is ended by an internal event, then the state sequencer returns to state0
and these bits are cleared to indicate that state0 was entered during the session. On arming the module the state
sequencer enters state1 and these bits are forced to SSF[2:0] = 001. See Table 8-5.
Table 8-2. DBGC1 Field Descriptions
Field Description
S12S Debug Module (S12SDBG)
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8.3.2.3 Debug Trace Control Register (DBGTCR)
Read: Anytime
Write: Bit 6 only when DBG is neither secure nor armed.Bits 3,2,0 anytime the module is disarmed.
Table 8-5. SSF[2:0] — State Sequence Flag Bit Encoding
SSF[2:0] Current State
000 State0 (disarmed)
001 State1
010 State2
011 State3
100 Final State
101,110,111 Reserved
Address: 0x0022
76543210
R0 TSOURCE 00 TRCMOD 0TALIGN
W
Reset 0 0 0 00000
Figure 8-5. Debug Trace Control Register (DBGTCR)
Table 8-6. DBGTCR Field Descriptions
Field Description
6
TSOURCE
Trace Source Control Bit — The TSOURCE bit enables a tracing session given a trigger condition. If the MCU
system is secured, this bit cannot be set and tracing is inhibited.
This bit must be set to read the trace buffer.
0 Debug session without tracing requested
1 Debug session with tracing requested
3–2
TRCMOD
Trace Mode Bits — See Section 8.4.5.2, “Trace Modes for detailed Trace Mode descriptions. In Normal Mode,
change of flow information is stored. In Loop1 Mode, change of flow information is stored but redundant entries
into trace memory are inhibited. In Detail Mode, address and data for all memory and register accesses is stored.
In Compressed Pure PC mode the program counter value for each instruction executed is stored. See Table 8-7.
0
TALIGN
Trigger Align Bit — This bit controls whether the trigger is aligned to the beginning or end of a tracing session.
0 Trigger at end of stored data
1 Trigger before storing data
Table 8-7. TRCMOD Trace Mode Bit Encoding
TRCMOD Description
00 Normal
01 Loop1
10 Detail
11 Compressed Pure PC
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8.3.2.4 Debug Control Register2 (DBGC2)
Read: Anytime
Write: Anytime the module is disarmed.
This register configures the comparators for range matching.
8.3.2.5 Debug Trace Buffer Register (DBGTBH:DBGTBL)
Read: Only when unlocked AND unsecured AND not armed AND TSOURCE set.
Write: Aligned word writes when disarmed unlock the trace buffer for reading but do not affect trace buffer
contents.
Address: 0x0023
76543210
R000000 ABCM
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 8-6. Debug Control Register2 (DBGC2)
Table 8-8. DBGC2 Field Descriptions
Field Description
1–0
ABCM[1:0]
A and B Comparator Match Control — These bits determine the A and B comparator match mapping as
described in Table 8-9.
Table 8-9. ABCM Encoding
ABCM Description
00 Match0 mapped to comparator A match: Match1 mapped to comparator B match.
01 Match 0 mapped to comparator A/B inside range: Match1 disabled.
10 Match 0 mapped to comparator A/B outside range: Match1 disabled.
11 Reserved1
1Currently defaults to Comparator A, Comparator B disabled
Address: 0x0024, 0x0025
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
RBit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
W
PORXXXXXXXXXXXXXXXX
Other
Resets ————————————————
Figure 8-7. Debug Trace Buffer Register (DBGTB)
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8.3.2.6 Debug Count Register (DBGCNT)
Read: Anytime
Write: Never
Table 8-10. DBGTB Field Descriptions
Field Description
15–0
Bit[15:0]
Trace Buffer Data Bits — The Trace Buffer Register is a window through which the 20-bit wide data lines of the
Trace Buffer may be read 16 bits at a time. Each valid read of DBGTB increments an internal trace buffer pointer
which points to the next address to be read. When the ARM bit is set the trace buffer is locked to prevent reading.
The trace buffer can only be unlocked for reading by writing to DBGTB with an aligned word write when the
module is disarmed. The DBGTB register can be read only as an aligned word, any byte reads or misaligned
access of these registers return 0 and do not cause the trace buffer pointer to increment to the next trace buffer
address. Similarly reads while the debugger is armed or with the TSOURCE bit clear, return 0 and do not affect
the trace buffer pointer. The POR state is undefined. Other resets do not affect the trace buffer contents.
Address: 0x0026
76543210
R TBF 0 CNT
W
Reset
POR
—
0
—
0
—
0
—
0
—
0
—
0
—
0
—
0
= Unimplemented or Reserved
Figure 8-8. Debug Count Register (DBGCNT)
Table 8-11. DBGCNT Field Descriptions
Field Description
7
TBF
Trace Buffer Full — The TBF bit indicates that the trace buffer has stored 64 or more lines of data since it was
last armed. If this bit is set, then all 64 lines will be valid data, regardless of the value of DBGCNT bits. The TBF
bit is cleared when ARM in DBGC1 is written to a one. The TBF is cleared by the power on reset initialization.
Other system generated resets have no affect on this bit
This bit is also visible at DBGSR[7]
5–0
CNT[5:0]
Count Value — The CNT bits indicate the number of valid data 20-bit data lines stored in the Trace Buffer.
Table 8-12 shows the correlation between the CNT bits and the number of valid data lines in the Trace Buffer.
When the CNT rolls over to zero, the TBF bit in DBGSR is set and incrementing of CNT will continue in
end-trigger mode. The DBGCNT register is cleared when ARM in DBGC1 is written to a one. The DBGCNT
register is cleared by power-on-reset initialization but is not cleared by other system resets. Thus should a reset
occur during a debug session, the DBGCNT register still indicates after the reset, the number of valid trace buffer
entries stored before the reset occurred. The DBGCNT register is not decremented when reading from the trace
buffer.
Table 8-12. CNT Decoding Table
TBF CNT[5:0] Description
0 000000 No data valid
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
8.3.2.7 Debug State Control Registers
There is a dedicated control register for each of the state sequencer states 1 to 3 that determines if
transitions from that state are allowed, depending upon comparator matches or tag hits, and defines the
next state for the state sequencer following a match. The three debug state control registers are located at
the same address in the register address map (0x0027). Each register can be accessed using the COMRV
bits in DBGC1 to blend in the required register. The COMRV = 11 value blends in the match flag register
(DBGMFR).
8.3.2.7.1 Debug State Control Register 1 (DBGSCR1)
Read: If COMRV[1:0] = 00
Write: If COMRV[1:0] = 00 and DBG is not armed.
This register is visible at 0x0027 only with COMRV[1:0] = 00. The state control register 1 selects the
targeted next state whilst in State1. The matches refer to the match channels of the comparator match
0 000001
000010
000100
000110
..
111111
1 line valid
2 lines valid
4 lines valid
6 lines valid
..
63 lines valid
1 000000 64 lines valid; if using Begin trigger alignment,
ARM bit will be cleared and the tracing session ends.
1 000001
..
..
111110
64 lines valid,
oldest data has been overwritten by most recent data
Table 8-13. State Control Register Access Encoding
COMRV Visible State Control Register
00 DBGSCR1
01 DBGSCR2
10 DBGSCR3
11 DBGMFR
Address: 0x0027
76543210
R0000
SC3 SC2 SC1 SC0
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 8-9. Debug State Control Register 1 (DBGSCR1)
Table 8-12. CNT Decoding Table
TBF CNT[5:0] Description
S12S Debug Module (S12SDBG)
MC9S12G Family Reference Manual, Rev.1.06
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control logic as depicted in Figure 8-1 and described in 8.3.2.8.1. Comparators must be enabled by setting
the comparator enable bit in the associated DBGXCTL control register.
The priorities described in Table 8-35 dictate that in the case of simultaneous matches, a match leading to
final state has priority followed by the match on the lower channel number (0,1,2). Thus with
SC[3:0]=1101 a simultaneous match0/match1 transitions to final state.
8.3.2.7.2 Debug State Control Register 2 (DBGSCR2)
Read: If COMRV[1:0] = 01
Write: If COMRV[1:0] = 01 and DBG is not armed.
Table 8-14. DBGSCR1 Field Descriptions
Field Description
3–0
SC[3:0]
These bits select the targeted next state whilst in State1, based upon the match event.
Table 8-15. State1 Sequencer Next State Selection
SC[3:0] Description (Unspecified matches have no effect)
0000 Any match to Final State
0001 Match1 to State3
0010 Match2 to State2
0011 Match1 to State2
0100 Match0 to State2....... Match1 to State3
0101 Match1 to State3.........Match0 to Final State
0110 Match0 to State2....... Match2 to State3
0111 Either Match0 or Match1 to State2
1000 Reserved
1001 Match0 to State3
1010 Reserved
1011 Reserved
1100 Reserved
1101 Either Match0 or Match2 to Final State........Match1 to State2
1110 Reserved
1111 Reserved
Address: 0x0027
76543210
R0000
SC3 SC2 SC1 SC0
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 8-10. Debug State Control Register 2 (DBGSCR2)
S12S Debug Module (S12SDBG)
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This register is visible at 0x0027 only with COMRV[1:0] = 01. The state control register 2 selects the
targeted next state whilst in State2. The matches refer to the match channels of the comparator match
control logic as depicted in Figure 8-1 and described in Section 8.3.2.8.1, “Debug Comparator Control
Register (DBGXCTL). Comparators must be enabled by setting the comparator enable bit in the associated
DBGXCTL control register.
The priorities described in Table 8-35 dictate that in the case of simultaneous matches, a match leading to
final state has priority followed by the match on the lower channel number (0,1,2)
8.3.2.7.3 Debug State Control Register 3 (DBGSCR3)
Read: If COMRV[1:0] = 10
Table 8-16. DBGSCR2 Field Descriptions
Field Description
3–0
SC[3:0]
These bits select the targeted next state whilst in State2, based upon the match event.
Table 8-17. State2 —Sequencer Next State Selection
SC[3:0] Description (Unspecified matches have no effect)
0000 Match0 to State1....... Match2 to State3.
0001 Match1 to State3
0010 Match2 to State3
0011 Match1 to State3....... Match0 Final State
0100 Match1 to State1....... Match2 to State3.
0101 Match2 to Final State
0110 Match2 to State1..... Match0 to Final State
0111 Either Match0 or Match1 to Final State
1000 Reserved
1001 Reserved
1010 Reserved
1011 Reserved
1100 Either Match0 or Match1 to Final State........Match2 to State3
1101 Reserved
1110 Reserved
1111 Either Match0 or Match1 to Final State........Match2 to State1
Address: 0x0027
76543210
R0000
SC3 SC2 SC1 SC0
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 8-11. Debug State Control Register 3 (DBGSCR3)
S12S Debug Module (S12SDBG)
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Write: If COMRV[1:0] = 10 and DBG is not armed.
This register is visible at 0x0027 only with COMRV[1:0] = 10. The state control register three selects the
targeted next state whilst in State3. The matches refer to the match channels of the comparator match
control logic as depicted in Figure 8-1 and described in Section 8.3.2.8.1, “Debug Comparator Control
Register (DBGXCTL). Comparators must be enabled by setting the comparator enable bit in the associated
DBGXCTL control register.
The priorities described in Table 8-35 dictate that in the case of simultaneous matches, a match leading to
final state has priority followed by the match on the lower channel number (0,1,2).
8.3.2.7.4 Debug Match Flag Register (DBGMFR)
Table 8-18. DBGSCR3 Field Descriptions
Field Description
3–0
SC[3:0]
These bits select the targeted next state whilst in State3, based upon the match event.
Table 8-19. State3 — Sequencer Next State Selection
SC[3:0] Description (Unspecified matches have no effect)
0000 Match0 to State1
0001 Match2 to State2........ Match1 to Final State
0010 Match0 to Final State....... Match1 to State1
0011 Match1 to Final State....... Match2 to State1
0100 Match1 to State2
0101 Match1 to Final State
0110 Match2 to State2........ Match0 to Final State
0111 Match0 to Final State
1000 Reserved
1001 Reserved
1010 Either Match1 or Match2 to State1....... Match0 to Final State
1011 Reserved
1100 Reserved
1101 Either Match1 or Match2 to Final State....... Match0 to State1
1110 Match0 to State2....... Match2 to Final State
1111 Reserved
Address: 0x0027
76543210
R 0 0 0 0 0 MC2 MC1 MC0
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 8-12. Debug Match Flag Register (DBGMFR)
S12S Debug Module (S12SDBG)
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Freescale Semiconductor 293
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Read: If COMRV[1:0] = 11
Write: Never
DBGMFR is visible at 0x0027 only with COMRV[1:0] = 11. It features 3 flag bits each mapped directly
to a channel. Should a match occur on the channel during the debug session, then the corresponding flag
is set and remains set until the next time the module is armed by writing to the ARM bit. Thus the contents
are retained after a debug session for evaluation purposes. These flags cannot be cleared by software, they
are cleared only when arming the module. A set flag does not inhibit the setting of other flags. Once a flag
is set, further comparator matches on the same channel in the same session have no affect on that flag.
8.3.2.8 Comparator Register Descriptions
Each comparator has a bank of registers that are visible through an 8-byte window in the DBG module
register address map. Comparator A consists of 8 register bytes (3 address bus compare registers, two data
bus compare registers, two data bus mask registers and a control register). Comparator B consists of four
register bytes (three address bus compare registers and a control register). Comparator C consists of four
register bytes (three address bus compare registers and a control register).
Each set of comparator registers can be accessed using the COMRV bits in the DBGC1 register.
Unimplemented registers (e.g. Comparator B data bus and data bus masking) read as zero and cannot be
written. The control register for comparator B differs from those of comparators A and C.
8.3.2.8.1 Debug Comparator Control Register (DBGXCTL)
The contents of this register bits 7 and 6 differ depending upon which comparator registers are visible in
the 8-byte window of the DBG module register address map.
Table 8-20. Comparator Register Layout
0x0028 CONTROL Read/Write Comparators A,B and C
0x0029 ADDRESS HIGH Read/Write Comparators A,B and C
0x002A ADDRESS MEDIUM Read/Write Comparators A,B and C
0x002B ADDRESS LOW Read/Write Comparators A,B and C
0x002C DATA HIGH COMPARATOR Read/Write Comparator A only
0x002D DATA LOW COMPARATOR Read/Write Comparator A only
0x002E DATA HIGH MASK Read/Write Comparator A only
0x002F DATA LOW MASK Read/Write Comparator A only
Address: 0x0028
76543210
RSZE SZ TAG BRK RW RWE NDB COMPE
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 8-13. Debug Comparator Control Register DBGACTL (Comparator A)
S12S Debug Module (S12SDBG)
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Read: DBGACTL if COMRV[1:0] = 00
DBGBCTL if COMRV[1:0] = 01
DBGCCTL if COMRV[1:0] = 10
Write: DBGACTL if COMRV[1:0] = 00 and DBG not armed
DBGBCTL if COMRV[1:0] = 01 and DBG not armed
DBGCCTL if COMRV[1:0] = 10 and DBG not armed
Address: 0x0028
76543210
RSZE SZ TAG BRK RW RWE 0COMPE
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 8-14. Debug Comparator Control Register DBGBCTL (Comparator B)
Address: 0x0028
76543210
R0 0 TAG BRK RW RWE 0COMPE
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 8-15. Debug Comparator Control Register DBGCCTL (Comparator C)
Table 8-21. DBGXCTL Field Descriptions
Field Description
7
SZE
(Comparators
A and B)
Size Comparator Enable Bit — The SZE bit controls whether access size comparison is enabled for the
associated comparator. This bit is ignored if the TAG bit in the same register is set.
0 Word/Byte access size is not used in comparison
1 Word/Byte access size is used in comparison
6
SZ
(Comparators
A and B)
Size Comparator Value Bit — The SZ bit selects either word or byte access size in comparison for the
associated comparator. This bit is ignored if the SZE bit is cleared or if the TAG bit in the same register is set.
0 Word access size is compared
1 Byte access size is compared
5
TAG
Tag Select— This bit controls whether the comparator match has immediate effect, causing an immediate
state sequencer transition or tag the opcode at the matched address. Tagged opcodes trigger only if they
reach the execution stage of the instruction queue.
0 Allow state sequencer transition immediately on match
1 On match, tag the opcode. If the opcode is about to be executed allow a state sequencer transition
4
BRK
Break— This bit controls whether a comparator match terminates a debug session immediately, independent
of state sequencer state. To generate an immediate breakpoint the module breakpoints must be enabled
using the DBGC1 bit DBGBRK.
0 The debug session termination is dependent upon the state sequencer and trigger conditions.
1 A match on this channel terminates the debug session immediately; breakpoints if active are generated,
tracing, if active, is terminated and the module disarmed.
S12S Debug Module (S12SDBG)
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Table 8-22 shows the effect for RWE and RW on the comparison conditions. These bits are ignored if the
corresponding TAG bit is set since the match occurs based on the tagged opcode reaching the execution
stage of the instruction queue.
8.3.2.8.2 Debug Comparator Address High Register (DBGXAH)
The DBGC1_COMRV bits determine which comparator address registers are visible in the 8-byte window
from 0x0028 to 0x002F as shown in Section Table 8-23., “Comparator Address Register Visibility
3
RW
Read/Write Comparator Value Bit — The RW bit controls whether read or write is used in compare for the
associated comparator. The RW bit is not used if RWE = 0. This bit is ignored if the TAG bit in the same
register is set.
0 Write cycle is matched1Read cycle is matched
2
RWE
Read/Write Enable Bit — The RWE bit controls whether read or write comparison is enabled for the
associated comparator.This bit is ignored if the TAG bit in the same register is set
0 Read/Write is not used in comparison
1 Read/Write is used in comparison
1
NDB
(Comparator A)
Not Data Bus — The NDB bit controls whether the match occurs when the data bus matches the comparator
register value or when the data bus differs from the register value. This bit is ignored if the TAG bit in the same
register is set. This bit is only available for comparator A.
0 Match on data bus equivalence to comparator register contents
1 Match on data bus difference to comparator register contents
0
COMPE
Determines if comparator is enabled
0 The comparator is not enabled
1 The comparator is enabled
Table 8-22. Read or Write Comparison Logic Table
RWE Bit RW Bit RW Signal Comment
0 x 0 RW not used in comparison
0 x 1 RW not used in comparison
1 0 0 Write data bus
1 0 1 No match
1 1 0 No match
1 1 1 Read data bus
Address: 0x0029
76543210
R000000
Bit 17 Bit 16
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 8-16. Debug Comparator Address High Register (DBGXAH)
Table 8-21. DBGXCTL Field Descriptions
Field Description
S12S Debug Module (S12SDBG)
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Table 8-23. Comparator Address Register Visibility
Read: Anytime. See Table 8-23 for visible register encoding.
Write: If DBG not armed. See Table 8-23 for visible register encoding.
8.3.2.8.3 Debug Comparator Address Mid Register (DBGXAM)
Read: Anytime. See Table 8-23 for visible register encoding.
Write: If DBG not armed. See Table 8-23 for visible register encoding.
COMRV Visible Comparator
00 DBGAAH, DBGAAM, DBGAAL
01 DBGBAH, DBGBAM, DBGBAL
10 DBGCAH, DBGCAM, DBGCAL
11 None
Table 8-24. DBGXAH Field Descriptions
Field Description
1–0
Bit[17:16]
Comparator Address High Compare Bits — The Comparator address high compare bits control whether the
selected comparator compares the address bus bits [17:16] to a logic one or logic zero.
0 Compare corresponding address bit to a logic zero
1 Compare corresponding address bit to a logic one
Address: 0x002A
76543210
RBit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
W
Reset 0 0 0 00000
Figure 8-17. Debug Comparator Address Mid Register (DBGXAM)
Table 8-25. DBGXAM Field Descriptions
Field Description
7–0
Bit[15:8]
Comparator Address Mid Compare Bits — The Comparator address mid compare bits control whether the
selected comparator compares the address bus bits [15:8] to a logic one or logic zero.
0 Compare corresponding address bit to a logic zero
1 Compare corresponding address bit to a logic one
S12S Debug Module (S12SDBG)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 297
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8.3.2.8.4 Debug Comparator Address Low Register (DBGXAL)
Read: Anytime. See Table 8-23 for visible register encoding.
Write: If DBG not armed. See Table 8-23 for visible register encoding.
8.3.2.8.5 Debug Comparator Data High Register (DBGADH)
Read: If COMRV[1:0] = 00
Write: If COMRV[1:0] = 00 and DBG not armed.
Address: 0x002B
76543210
RBit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
W
Reset 0 0 0 00000
Figure 8-18. Debug Comparator Address Low Register (DBGXAL)
Table 8-26. DBGXAL Field Descriptions
Field Description
7–0
Bits[7:0]
Comparator Address Low Compare Bits — The Comparator address low compare bits control whether the
selected comparator compares the address bus bits [7:0] to a logic one or logic zero.
0 Compare corresponding address bit to a logic zero
1 Compare corresponding address bit to a logic one
Address: 0x002C
76543210
RBit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
W
Reset 0 0 0 00000
Figure 8-19. Debug Comparator Data High Register (DBGADH)
Table 8-27. DBGADH Field Descriptions
Field Description
7–0
Bits[15:8]
Comparator Data High Compare Bits— The Comparator data high compare bits control whether the selected
comparator compares the data bus bits [15:8] to a logic one or logic zero. The comparator data compare bits are
only used in comparison if the corresponding data mask bit is logic 1. This register is available only for
comparator A. Data bus comparisons are only performed if the TAG bit in DBGACTL is clear.
0 Compare corresponding data bit to a logic zero
1 Compare corresponding data bit to a logic one
S12S Debug Module (S12SDBG)
MC9S12G Family Reference Manual, Rev.1.06
298 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
8.3.2.8.6 Debug Comparator Data Low Register (DBGADL)
Read: If COMRV[1:0] = 00
Write: If COMRV[1:0] = 00 and DBG not armed.
8.3.2.8.7 Debug Comparator Data High Mask Register (DBGADHM)
Read: If COMRV[1:0] = 00
Write: If COMRV[1:0] = 00 and DBG not armed.
Address: 0x002D
76543210
RBit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
W
Reset 0 0 0 00000
Figure 8-20. Debug Comparator Data Low Register (DBGADL)
Table 8-28. DBGADL Field Descriptions
Field Description
7–0
Bits[7:0]
Comparator Data Low Compare Bits — The Comparator data low compare bits control whether the selected
comparator compares the data bus bits [7:0] to a logic one or logic zero. The comparator data compare bits are
only used in comparison if the corresponding data mask bit is logic 1. This register is available only for
comparator A. Data bus comparisons are only performed if the TAG bit in DBGACTL is clear
0 Compare corresponding data bit to a logic zero
1 Compare corresponding data bit to a logic one
Address: 0x002E
76543210
RBit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
W
Reset 0 0 0 00000
Figure 8-21. Debug Comparator Data High Mask Register (DBGADHM)
Table 8-29. DBGADHM Field Descriptions
Field Description
7–0
Bits[15:8]
Comparator Data High Mask Bits — The Comparator data high mask bits control whether the selected
comparator compares the data bus bits [15:8] to the corresponding comparator data compare bits. Data bus
comparisons are only performed if the TAG bit in DBGACTL is clear
0 Do not compare corresponding data bit Any value of corresponding data bit allows match.
1 Compare corresponding data bit
S12S Debug Module (S12SDBG)
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8.3.2.8.8 Debug Comparator Data Low Mask Register (DBGADLM)
Read: If COMRV[1:0] = 00
Write: If COMRV[1:0] = 00 and DBG not armed.
8.4 Functional Description
This section provides a complete functional description of the DBG module. If the part is in secure mode,
the DBG module can generate breakpoints but tracing is not possible.
8.4.1 S12SDBG Operation
Arming the DBG module by setting ARM in DBGC1 allows triggering the state sequencer, storing of data
in the trace buffer and generation of breakpoints to the CPU. The DBG module is made up of four main
blocks, the comparators, control logic, the state sequencer, and the trace buffer.
The comparators monitor the bus activity of the CPU. All comparators can be configured to monitor
address bus activity. Comparator A can also be configured to monitor databus activity and mask out
individual data bus bits during a compare. Comparators can be configured to use R/W and word/byte
access qualification in the comparison. A match with a comparator register value can initiate a state
sequencer transition to another state (see Figure 8-24). Either forced or tagged matches are possible. Using
a forced match, a state sequencer transition can occur immediately on a successful match of system busses
and comparator registers. Whilst tagging, at a comparator match, the instruction opcode is tagged and only
if the instruction reaches the execution stage of the instruction queue can a state sequencer transition occur.
In the case of a transition to Final State, bus tracing is triggered and/or a breakpoint can be generated.
A state sequencer transition to final state (with associated breakpoint, if enabled) can be initiated by
writing to the TRIG bit in the DBGC1 control register.
The trace buffer is visible through a 2-byte window in the register address map and must be read out using
standard 16-bit word reads.
Address: 0x002F
76543210
RBit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
W
Reset 0 0 0 00000
Figure 8-22. Debug Comparator Data Low Mask Register (DBGADLM)
Table 8-30. DBGADLM Field Descriptions
Field Description
7–0
Bits[7:0]
Comparator Data Low Mask Bits — The Comparator data low mask bits control whether the selected
comparator compares the data bus bits [7:0] to the corresponding comparator data compare bits. Data bus
comparisons are only performed if the TAG bit in DBGACTL is clear
0 Do not compare corresponding data bit. Any value of corresponding data bit allows match
1 Compare corresponding data bit
S12S Debug Module (S12SDBG)
MC9S12G Family Reference Manual, Rev.1.06
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Figure 8-23. DBG Overview
8.4.2 Comparator Modes
The DBG contains three comparators, A, B and C. Each comparator compares the system address bus with
the address stored in DBGXAH, DBGXAM, and DBGXAL. Furthermore, comparator A also compares
the data buses to the data stored in DBGADH, DBGADL and allows masking of individual data bus bits.
All comparators are disabled in BDM and during BDM accesses.
The comparator match control logic (see Figure 8-23) configures comparators to monitor the buses for an
exact address or an address range, whereby either an access inside or outside the specified range generates
a match condition. The comparator configuration is controlled by the control register contents and the
range control by the DBGC2 contents.
A match can initiate a transition to another state sequencer state (see Section 8.4.4, “State Sequence
Control”). The comparator control register also allows the type of access to be included in the comparison
through the use of the RWE, RW, SZE, and SZ bits. The RWE bit controls whether read or write
comparison is enabled for the associated comparator and the RW bit selects either a read or write access
for a valid match. Similarly the SZE and SZ bits allow the size of access (word or byte) to be considered
in the compare. Only comparators A and B feature SZE and SZ.
The TAG bit in each comparator control register is used to determine the match condition. By setting TAG,
the comparator qualifies a match with the output of opcode tracking logic and a state sequencer transition
occurs when the tagged instruction reaches the CPU execution stage. Whilst tagging the RW, RWE, SZE,
and SZ bits and the comparator data registers are ignored; the comparator address register must be loaded
with the exact opcode address.
If the TAG bit is clear (forced type match) a comparator match is generated when the selected address
appears on the system address bus. If the selected address is an opcode address, the match is generated
CPU BUS
TRACE BUFFER
BUS INTERFACE
TRANSITION
MATCH0
STATE
COMPARATOR B
COMPARATOR C
COMPARATOR A
STATE SEQUENCER
MATCH1
MATCH2
TRACE
READ TRACE DATA (DBG READ DATA BUS)
CONTROL
SECURE
BREAKPOINT REQUESTS
COMPARATOR
MATCH CONTROL
TRIGGER
TAG &
MATCH
CONTROL
LOGIC
TAG S
TAGHITS
STATE
TO CPU
S12S Debug Module (S12SDBG)
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Freescale Semiconductor 301
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when the opcode is fetched from the memory, which precedes the instruction execution by an indefinite
number of cycles due to instruction pipelining. For a comparator match of an opcode at an odd address
when TAG = 0, the corresponding even address must be contained in the comparator register. Thus for an
opcode at odd address (n), the comparator register must contain address (n–1).
Once a successful comparator match has occurred, the condition that caused the original match is not
verified again on subsequent matches. Thus if a particular data value is verified at a given address, this
address may not still contain that data value when a subsequent match occurs.
Match[0, 1, 2] map directly to Comparators [A, B, C] respectively, except in range modes (see
Section 8.3.2.4, “Debug Control Register2 (DBGC2)). Comparator channel priority rules are described in
the priority section (Section 8.4.3.4, “Channel Priorities).
8.4.2.1 Single Address Comparator Match
With range comparisons disabled, the match condition is an exact equivalence of address bus with the
value stored in the comparator address registers. Further qualification of the type of access (R/W,
word/byte) and databus contents is possible, depending on comparator channel.
8.4.2.1.1 Comparator C
Comparator C offers only address and direction (R/W) comparison. The exact address is compared, thus
with the comparator address register loaded with address (n) a word access of address (n–1) also accesses
(n) but does not cause a match.
8.4.2.1.2 Comparator B
Comparator B offers address, direction (R/W) and access size (word/byte) comparison. If the SZE bit is
set the access size (word or byte) is compared with the SZ bit value such that only the specified size of
access causes a match. Thus if configured for a byte access of a particular address, a word access covering
the same address does not lead to match.
Assuming the access direction is not qualified (RWE=0), for simplicity, the size access considerations are
shown in Table 8-32.
Table 8-31. Comparator C Access Considerations
Condition For Valid Match Comp C Address RWE RW Examples
Read and write accesses of ADDR[n] ADDR[n]1
1A word access of ADDR[n-1] also accesses ADDR[n] but does not generate a match.
The comparator address register must contain the exact address from the code.
0 X LDAA ADDR[n]
STAA #$BYTE ADDR[n]
Write accesses of ADDR[n] ADDR[n] 1 0 STAA #$BYTE ADDR[n]
Read accesses of ADDR[n] ADDR[n] 1 1 LDAA #$BYTE ADDR[n]
Table 8-32. Comparator B Access Size Considerations
Condition For Valid Match Comp B Address RWE SZE SZ8 Examples
Word and byte accesses of ADDR[n] ADDR[n]10 0 X MOVB #$BYTE ADDR[n]
MOVW #$WORD ADDR[n]
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Access direction can also be used to qualify a match for Comparator B in the same way as described for
Comparator C in Table 8-31.
8.4.2.1.3 Comparator A
Comparator A offers address, direction (R/W), access size (word/byte) and data bus comparison.
Table 8-33 lists access considerations with data bus comparison. On word accesses the data byte of the
lower address is mapped to DBGADH. Access direction can also be used to qualify a match for
Comparator A in the same way as described for Comparator C in Table 8-31.
Table 8-33. Comparator A Matches When Accessing ADDR[n]
8.4.2.1.4 Comparator A Data Bus Comparison NDB Dependency
Comparator A features an NDB control bit, which allows data bus comparators to be configured to either
trigger on equivalence or trigger on difference. This allows monitoring of a difference in the contents of
an address location from an expected value.
When matching on an equivalence (NDB=0), each individual data bus bit position can be masked out by
clearing the corresponding mask bit (DBGADHM/DBGADLM) so that it is ignored in the comparison. A
Word accesses of ADDR[n] only ADDR[n] 0 1 0 MOVW #$WORD ADDR[n]
LDD ADDR[n]
Byte accesses of ADDR[n] only ADDR[n] 0 1 1 MOVB #$BYTE ADDR[n]
LDAB ADDR[n]
1A word access of ADDR[n-1] also accesses ADDR[n] but does not generate a match.
The comparator address register must contain the exact address from the code.
SZE SZ DBGADHM,
DBGADLM
Access
DH=DBGADH, DL=DBGADL Comment
0 X $0000 Byte
Word
No databus comparison
0 X $FF00 Byte, data(ADDR[n])=DH
Word, data(ADDR[n])=DH, data(ADDR[n+1])=X
Match data( ADDR[n])
0 X $00FF Word, data(ADDR[n])=X, data(ADDR[n+1])=DL Match data( ADDR[n+1])
0 X $00FF Byte, data(ADDR[n])=X, data(ADDR[n+1])=DL Possible unintended match
0 X $FFFF Word, data(ADDR[n])=DH, data(ADDR[n+1])=DL Match data( ADDR[n], ADDR[n+1])
0 X $FFFF Byte, data(ADDR[n])=DH, data(ADDR[n+1])=DL Possible unintended match
1 0 $0000 Word No databus comparison
1 0 $00FF Word, data(ADDR[n])=X, data(ADDR[n+1])=DL Match only data at ADDR[n+1]
1 0 $FF00 Word, data(ADDR[n])=DH, data(ADDR[n+1])=X Match only data at ADDR[n]
1 0 $FFFF Word, data(ADDR[n])=DH, data(ADDR[n+1])=DL Match data at ADDR[n] & ADDR[n+1]
1 1 $0000 Byte No databus comparison
1 1 $FF00 Byte, data(ADDR[n])=DH Match data at ADDR[n]
Table 8-32. Comparator B Access Size Considerations
Condition For Valid Match Comp B Address RWE SZE SZ8 Examples
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match occurs when all data bus bits with corresponding mask bits set are equivalent. If all mask register
bits are clear, then a match is based on the address bus only, the data bus is ignored.
When matching on a difference, mask bits can be cleared to ignore bit positions. A match occurs when any
data bus bit with corresponding mask bit set is different. Clearing all mask bits, causes all bits to be ignored
and prevents a match because no difference can be detected. In this case address bus equivalence does not
cause a match.
8.4.2.2 Range Comparisons
Using the AB comparator pair for a range comparison, the data bus can also be used for qualification by
using the comparator A data registers. Furthermore the DBGACTL RW and RWE bits can be used to
qualify the range comparison on either a read or a write access. The corresponding DBGBCTL bits are
ignored. The SZE and SZ control bits are ignored in range mode. The comparator A TAG bit is used to tag
range comparisons. The comparator B TAG bit is ignored in range modes. In order for a range comparison
using comparators A and B, both COMPEA and COMPEB must be set; to disable range comparisons both
must be cleared. The comparator A BRK bit is used to for the AB range, the comparator B BRK bit is
ignored in range mode.
When configured for range comparisons and tagging, the ranges are accurate only to word boundaries.
8.4.2.2.1 Inside Range (CompA_Addr ≤ address ≤ CompB_Addr)
In the Inside Range comparator mode, comparator pair A and B can be configured for range comparisons.
This configuration depends upon the control register (DBGC2). The match condition requires that a valid
match for both comparators happens on the same bus cycle. A match condition on only one comparator is
not valid. An aligned word access which straddles the range boundary is valid only if the aligned address
is inside the range.
8.4.2.2.2 Outside Range (address < CompA_Addr or address > CompB_Addr)
In the Outside Range comparator mode, comparator pair A and B can be configured for range comparisons.
A single match condition on either of the comparators is recognized as valid. An aligned word access
which straddles the range boundary is valid only if the aligned address is outside the range.
Outside range mode in combination with tagging can be used to detect if the opcode fetches are from an
unexpected range. In forced match mode the outside range match would typically be activated at any
interrupt vector fetch or register access. This can be avoided by setting the upper range limit to $3FFFF or
lower range limit to $00000 respectively.
Table 8-34. NDB and MASK bit dependency
NDB DBGADHM[n] /
DBGADLM[n] Comment
0 0 Do not compare data bus bit.
0 1 Compare data bus bit. Match on equivalence.
1 0 Do not compare data bus bit.
1 1 Compare data bus bit. Match on difference.
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8.4.3 Match Modes (Forced or Tagged)
Match modes are used as qualifiers for a state sequencer change of state. The Comparator control register
TAG bits select the match mode. The modes are described in the following sections.
8.4.3.1 Forced Match
When configured for forced matching, a comparator channel match can immediately initiate a transition
to the next state sequencer state whereby the corresponding flags in DBGSR are set. The state control
register for the current state determines the next state. Forced matches are typically generated 2-3 bus
cycles after the final matching address bus cycle, independent of comparator RWE/RW settings.
Furthermore since opcode fetches occur several cycles before the opcode execution a forced match of an
opcode address typically precedes a tagged match at the same address.
8.4.3.2 Tagged Match
If a CPU taghit occurs a transition to another state sequencer state is initiated and the corresponding
DBGSR flags are set. For a comparator related taghit to occur, the DBG must first attach tags to
instructions as they are fetched from memory. When the tagged instruction reaches the execution stage of
the instruction queue a taghit is generated by the CPU. This can initiate a state sequencer transition.
8.4.3.3 Immediate Trigger
Independent of comparator matches it is possible to initiate a tracing session and/or breakpoint by writing
to the TRIG bit in DBGC1. If configured for begin aligned tracing, this triggers the state sequencer into
the Final State, if configured for end alignment, setting the TRIG bit disarms the module, ending the
session and issues a forced breakpoint request to the CPU.
It is possible to set both TRIG and ARM simultaneously to generate an immediate trigger, independent of
the current state of ARM.
8.4.3.4 Channel Priorities
In case of simultaneous matches the priority is resolved according to Table 8-35. The lower priority is
suppressed. It is thus possible to miss a lower priority match if it occurs simultaneously with a higher
priority. The priorities described in Table 8-35 dictate that in the case of simultaneous matches, the match
pointing to final state has highest priority followed by the lower channel number (0,1,2).
Table 8-35. Channel Priorities
Priority Source Action
Highest TRIG Enter Final State
Channel pointing to Final State Transition to next state as defined by state control registers
Match0 (force or tag hit) Transition to next state as defined by state control registers
Match1 (force or tag hit) Transition to next state as defined by state control registers
Lowest Match2 (force or tag hit) Transition to next state as defined by state control registers
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8.4.4 State Sequence Control
Figure 8-24. State Sequencer Diagram
The state sequencer allows a defined sequence of events to provide a trigger point for tracing of data in the
trace buffer. Once the DBG module has been armed by setting the ARM bit in the DBGC1 register, then
state1 of the state sequencer is entered. Further transitions between the states are then controlled by the
state control registers and channel matches. From Final State the only permitted transition is back to the
disarmed state0. Transition between any of the states 1 to 3 is not restricted. Each transition updates the
SSF[2:0] flags in DBGSR accordingly to indicate the current state.
Alternatively writing to the TRIG bit in DBGSC1, provides an immediate trigger independent of
comparator matches.
Independent of the state sequencer, each comparator channel can be individually configured to generate an
immediate breakpoint when a match occurs through the use of the BRK bits in the DBGxCTL registers.
Thus it is possible to generate an immediate breakpoint on selected channels, whilst a state sequencer
transition can be initiated by a match on other channels. If a debug session is ended by a match on a channel
the state sequencer transitions through Final State for a clock cycle to state0. This is independent of tracing
and breakpoint activity, thus with tracing and breakpoints disabled, the state sequencer enters state0 and
the debug module is disarmed.
8.4.4.1 Final State
On entering Final State a trigger may be issued to the trace buffer according to the trace alignment control
as defined by the TALIGN bit (see Section 8.3.2.3, “Debug Trace Control Register (DBGTCR)”). If the
TSOURCE bit in DBGTCR is clear then the trace buffer is disabled and the transition to Final State can
only generate a breakpoint request. In this case or upon completion of a tracing session when tracing is
enabled, the ARM bit in the DBGC1 register is cleared, returning the module to the disarmed state0. If
tracing is enabled a breakpoint request can occur at the end of the tracing session. If neither tracing nor
breakpoints are enabled then when the final state is reached it returns automatically to state0 and the debug
module is disarmed.
State1
Final State State3
ARM = 1
Session Complete
(Disarm)
State2
State 0
(Disarmed)
ARM = 0
ARM = 0
ARM = 0
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8.4.5 Trace Buffer Operation
The trace buffer is a 64 lines deep by 20-bits wide RAM array. The DBG module stores trace information
in the RAM array in a circular buffer format. The system accesses the RAM array through a register
window (DBGTBH:DBGTBL) using 16-bit wide word accesses. After each complete 20-bit trace buffer
line is read, an internal pointer into the RAM increments so that the next read receives fresh information.
Data is stored in the format shown in Table 8-36 and Table 8-39. After each store the counter register
DBGCNT is incremented. Tracing of CPU activity is disabled when the BDM is active. Reading the trace
buffer whilst the DBG is armed returns invalid data and the trace buffer pointer is not incremented.
8.4.5.1 Trace Trigger Alignment
Using the TALIGN bit (see Section 8.3.2.3, “Debug Trace Control Register (DBGTCR)) it is possible to
align the trigger with the end or the beginning of a tracing session.
If End tracing is selected, tracing begins when the ARM bit in DBGC1 is set and State1 is entered; the
transition to Final State signals the end of the tracing session. Tracing with Begin-Trigger starts at the
opcode of the trigger. Using End Trigger or when the tracing is initiated by writing to the TRIG bit whilst
configured for Begin-Trigger, tracing starts in the second cycle after the DBGC1 write cycle.
8.4.5.1.1 Storing with Begin-Trigger
Storing with Begin-Trigger, data is not stored in the Trace Buffer until the Final State is entered. Once the
trigger condition is met the DBG module remains armed until 64 lines are stored in the Trace Buffer. If the
trigger is at the address of the change-of-flow instruction the change of flow associated with the trigger is
stored in the Trace Buffer. Using Begin-trigger together with tagging, if the tagged instruction is about to
be executed then the trace is started. Upon completion of the tracing session the breakpoint is generated,
thus the breakpoint does not occur at the tagged instruction boundary.
8.4.5.1.2 Storing with End-Trigger
Storing with End-Trigger, data is stored in the Trace Buffer until the Final State is entered, at which point
the DBG module becomes disarmed and no more data is stored. If the trigger is at the address of a change
of flow instruction, the trigger event is not stored in the Trace Buffer.
8.4.5.2 Trace Modes
Four trace modes are available. The mode is selected using the TRCMOD bits in the DBGTCR register.
Tracing is enabled using the TSOURCE bit in the DBGTCR register. The modes are described in the
following subsections.
8.4.5.2.1 Normal Mode
In Normal Mode, change of flow (COF) program counter (PC) addresses are stored.
COF addresses are defined as follows:
• Source address of taken conditional branches (long, short, bit-conditional, and loop primitives)
• Destination address of indexed JMP, JSR, and CALL instruction
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• Destination address of RTI, RTS, and RTC instructions
• Vector address of interrupts, except for BDM vectors
LBRA, BRA, BSR, BGND as well as non-indexed JMP, JSR, and CALL instructions are not classified as
change of flow and are not stored in the trace buffer.
Stored information includes the full 18-bit address bus and information bits, which contains a
source/destination bit to indicate whether the stored address was a source address or destination address.
NOTE
When a COF instruction with destination address is executed, the
destination address is stored to the trace buffer on instruction completion,
indicating the COF has taken place. If an interrupt occurs simultaneously
then the next instruction carried out is actually from the interrupt service
routine. The instruction at the destination address of the original program
flow gets executed after the interrupt service routine.
In the following example an IRQ interrupt occurs during execution of the
indexed JMP at address MARK1. The BRN at the destination (SUB_1) is
not executed until after the IRQ service routine but the destination address
is entered into the trace buffer to indicate that the indexed JMP COF has
taken place.
LDX #SUB_1
MARK1 JMP 0,X ; IRQ interrupt occurs during execution of this
MARK2 NOP ;
SUB_1 BRN * ; JMP Destination address TRACE BUFFER ENTRY 1
; RTI Destination address TRACE BUFFER ENTRY 3
NOP ;
ADDR1 DBNE A,PART5 ; Source address TRACE BUFFER ENTRY 4
IRQ_ISR LDAB #$F0 ; IRQ Vector $FFF2 = TRACE BUFFER ENTRY 2
STAB VAR_C1
RTI ;
The execution flow taking into account the IRQ is as follows
LDX #SUB_1
MARK1 JMP 0,X ;
IRQ_ISR LDAB #$F0 ;
STAB VAR_C1
RTI ;
SUB_1 BRN *
NOP ;
ADDR1 DBNE A,PART5 ;
8.4.5.2.2 Loop1 Mode
Loop1 Mode, similarly to Normal Mode also stores only COF address information to the trace buffer, it
however allows the filtering out of redundant information.
The intent of Loop1 Mode is to prevent the Trace Buffer from being filled entirely with duplicate
information from a looping construct such as delays using the DBNE instruction or polling loops using
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BRSET/BRCLR instructions. Immediately after address information is placed in the Trace Buffer, the
DBG module writes this value into a background register. This prevents consecutive duplicate address
entries in the Trace Buffer resulting from repeated branches.
Loop1 Mode only inhibits consecutive duplicate source address entries that would typically be stored in
most tight looping constructs. It does not inhibit repeated entries of destination addresses or vector
addresses, since repeated entries of these would most likely indicate a bug in the user’s code that the DBG
module is designed to help find.
8.4.5.2.3 Detail Mode
In Detail Mode, address and data for all memory and register accesses is stored in the trace buffer. This
mode is intended to supply additional information on indexed, indirect addressing modes where storing
only the destination address would not provide all information required for a user to determine where the
code is in error. This mode also features information bit storage to the trace buffer, for each address byte
storage. The information bits indicate the size of access (word or byte) and the type of access (read or
write).
When tracing in Detail Mode, all cycles are traced except those when the CPU is either in a free or opcode
fetch cycle.
8.4.5.2.4 Compressed Pure PC Mode
In Compressed Pure PC Mode, the PC addresses of all executed opcodes, including illegal opcodes are
stored. A compressed storage format is used to increase the effective depth of the trace buffer. This is
achieved by storing the lower order bits each time and using 2 information bits to indicate if a 64 byte
boundary has been crossed, in which case the full PC is stored.
Each Trace Buffer row consists of 2 information bits and 18 PC address bits
NOTE:
When tracing is terminated using forced breakpoints, latency in breakpoint
generation means that opcodes following the opcode causing the breakpoint
can be stored to the trace buffer. The number of opcodes is dependent on
program flow. This can be avoided by using tagged breakpoints.
8.4.5.3 Trace Buffer Organization (Normal, Loop1, Detail modes)
ADRH, ADRM, ADRL denote address high, middle and low byte respectively. The numerical suffix refers
to the tracing count. The information format for Loop1 and Normal modes is identical. In Detail mode, the
address and data for each entry are stored on consecutive lines, thus the maximum number of entries is 32.
In this case DBGCNT bits are incremented twice, once for the address line and once for the data line, on
each trace buffer entry. In Detail mode CINF comprises of R/W and size access information (CRW and
CSZ respectively).
Single byte data accesses in Detail Mode are always stored to the low byte of the trace buffer (DATAL)
and the high byte is cleared. When tracing word accesses, the byte at the lower address is always stored to
trace buffer byte1 and the byte at the higher address is stored to byte0.
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8.4.5.3.1 Information Bit Organization
The format of the bits is dependent upon the active trace mode as described below.
Field2 Bits in Detail Mode
In Detail Mode the CSZ and CRW bits indicate the type of access being made by the CPU.
Table 8-36. Trace Buffer Organization (Normal,Loop1,Detail modes)
Mode Entry
Number
4-bits 8-bits 8-bits
Field 2 Field 1 Field 0
Detail Mode
Entry 1 CINF1,ADRH1 ADRM1 ADRL1
0 DATAH1 DATAL1
Entry 2 CINF2,ADRH2 ADRM2 ADRL2
0 DATAH2 DATAL2
Normal/Loop1
Modes
Entry 1 PCH1 PCM1 PCL1
Entry 2 PCH2 PCM2 PCL2
Bit 3 Bit 2 Bit 1 Bit 0
CSZ CRW ADDR[17] ADDR[16]
Figure 8-25. Field2 Bits in Detail Mode
Table 8-37. Field Descriptions
Bit Description
3
CSZ
Access Type Indicator— This bit indicates if the access was a byte or word size when tracing in Detail Mode
0 Word Access
1 Byte Access
2
CRW
Read Write Indicator — This bit indicates if the corresponding stored address corresponds to a read or write
access when tracing in Detail Mode.
0 Write Access
1 Read Access
1
ADDR[17]
Address Bus bit 17— Corresponds to system address bus bit 17.
0
ADDR[16]
Address Bus bit 16— Corresponds to system address bus bit 16.
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Field2 Bits in Normal and Loop1 Modes
8.4.5.4 Trace Buffer Organization (Compressed Pure PC mode)
Table 8-39. Trace Buffer Organization Example (Compressed PurePC mode)
Bit 3 Bit 2 Bit 1 Bit 0
CSD CVA PC17 PC16
Figure 8-26. Information Bits PCH
Table 8-38. PCH Field Descriptions
Bit Description
3
CSD
Source Destination Indicator — In Normal and Loop1 mode this bit indicates if the corresponding stored
address is a source or destination address. This bit has no meaning in Compressed Pure PC mode.
0 Source Address
1 Destination Address
2
CVA
Vector Indicator — In Normal and Loop1 mode this bit indicates if the corresponding stored address is a vector
address. Vector addresses are destination addresses, thus if CVA is set, then the corresponding CSD is also set.
This bit has no meaning in Compressed Pure PC mode .
0 Non-Vector Destination Address
1 Vector Destination Address
1
PC17
Program Counter bit 17— In Normal and Loop1 mode this bit corresponds to program counter bit 17.
0
PC16
Program Counter bit 16— In Normal and Loop1 mode this bit corresponds to program counter bit 16.
Mode Line
Number
2-bits 6-bits 6-bits 6-bits
Field 3 Field 2 Field 1 Field 0
Compressed
Pure PC Mode
Line 1 00 PC1 (Initial 18-bit PC Base Address)
Line 2 11 PC4 PC3 PC2
Line 3 01 0 0 PC5
Line 4 00 PC6 (New 18-bit PC Base Address)
Line 5 10 0 PC8 PC7
Line 6 00 PC9 (New 18-bit PC Base Address)
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Field3 Bits in Compressed Pure PC Modes
Each time that PC[17:6] differs form the previous base PC[17:6], then a new base address is stored. The
base address zero value is the lowest address in the 64 address range
The first line of the trace buffer always gets a base PC address, this applies also on rollover.
8.4.5.5 Reading Data from Trace Buffer
The data stored in the Trace Buffer can be read provided the DBG module is not armed, is configured for
tracing (TSOURCE bit is set) and the system not secured. When the ARM bit is written to 1 the trace buffer
is locked to prevent reading. The trace buffer can only be unlocked for reading by a single aligned word
write to DBGTB when the module is disarmed.
The Trace Buffer can only be read through the DBGTB register using aligned word reads, any byte or
misaligned reads return 0 and do not cause the trace buffer pointer to increment to the next trace buffer
address. The Trace Buffer data is read out first-in first-out. By reading CNT in DBGCNT the number of
valid lines can be determined. DBGCNT does not decrement as data is read.
Whilst reading an internal pointer is used to determine the next line to be read. After a tracing session, the
pointer points to the oldest data entry, thus if no overflow has occurred, the pointer points to line0,
otherwise it points to the line with the oldest entry. In compressed Pure PC mode on rollover the line with
the oldest data entry may also contain newer data entries in fields 0 and 1. Thus if rollover is indicated by
the TBF bit, the line status must be decoded using the INF bits in field3 of that line. If both INF bits are
clear then the line contains only entires from before the last rollover.
If INF0=1 then field 0 contains post rollover data but fields 1 and 2 contain pre rollover data.
If INF1=1 then fields 0 and 1 contain post rollover data but field 2 contains pre rollover data.
The pointer is initialized by each aligned write to DBGTBH to point to the oldest data again. This enables
an interrupted trace buffer read sequence to be easily restarted from the oldest data entry.
The least significant word of line is read out first. This corresponds to the fields 1 and 0 of Table 8-36. The
next word read returns field 2 in the least significant bits [3:0] and “0” for bits [15:4].
Reading the Trace Buffer while the DBG module is armed returns invalid data and no shifting of the RAM
pointer occurs.
8.4.5.6 Trace Buffer Reset State
The Trace Buffer contents and DBGCNT bits are not initialized by a system reset. Thus should a system
reset occur, the trace session information from immediately before the reset occurred can be read out and
the number of valid lines in the trace buffer is indicated by DBGCNT. The internal pointer to the current
Table 8-40. Compressed Pure PC Mode Field 3 Information Bit Encoding
INF1 INF0 TRACE BUFFER ROW CONTENT
0 0 Base PC address TB[17:0] contains a full PC[17:0] value
0 1 Trace Buffer[5:0] contain incremental PC relative to base address zero value
1 0 Trace Buffer[11:0] contain next 2 incremental PCs relative to base address zero value
1 1 Trace Buffer[17:0] contain next 3 incremental PCs relative to base address zero value
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trace buffer address is initialized by unlocking the trace buffer and points to the oldest valid data even if a
reset occurred during the tracing session. To read the trace buffer after a reset, TSOURCE must be set,
otherwise the trace buffer reads as all zeroes. Generally debugging occurrences of system resets is best
handled using end trigger alignment since the reset may occur before the trace trigger, which in the begin
trigger alignment case means no information would be stored in the trace buffer.
The Trace Buffer contents and DBGCNT bits are undefined following a POR.
NOTE
An external pin RESET that occurs simultaneous to a trace buffer entry can,
in very seldom cases, lead to either that entry being corrupted or the first
entry of the session being corrupted. In such cases the other contents of the
trace buffer still contain valid tracing information. The case occurs when the
reset assertion coincides with the trace buffer entry clock edge.
8.4.6 Tagging
A tag follows program information as it advances through the instruction queue. When a tagged instruction
reaches the head of the queue a tag hit occurs and can initiate a state sequencer transition.
Each comparator control register features a TAG bit, which controls whether the comparator match causes
a state sequencer transition immediately or tags the opcode at the matched address. If a comparator is
enabled for tagged comparisons, the address stored in the comparator match address registers must be an
opcode address.
Using Begin trigger together with tagging, if the tagged instruction is about to be executed then the
transition to the next state sequencer state occurs. If the transition is to the Final State, tracing is started.
Only upon completion of the tracing session can a breakpoint be generated. Using End alignment, when
the tagged instruction is about to be executed and the next transition is to Final State then a breakpoint is
generated immediately, before the tagged instruction is carried out.
R/W monitoring, access size (SZ) monitoring and data bus monitoring are not useful if tagging is selected,
since the tag is attached to the opcode at the matched address and is not dependent on the data bus nor on
ta type of access. Thus these bits are ignored if tagging is selected.
When configured for range comparisons and tagging, the ranges are accurate only to word boundaries.
Tagging is disabled when the BDM becomes active.
8.4.7 Breakpoints
It is possible to generate breakpoints from channel transitions to final state or using software to write to
the TRIG bit in the DBGC1 register.
8.4.7.1 Breakpoints From Comparator Channels
Breakpoints can be generated when the state sequencer transitions to the Final State. If configured for
tagging, then the breakpoint is generated when the tagged opcode reaches the execution stage of the
instruction queue.
S12S Debug Module (S12SDBG)
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If a tracing session is selected by the TSOURCE bit, breakpoints are requested when the tracing session
has completed, thus if Begin aligned triggering is selected, the breakpoint is requested only on completion
of the subsequent trace (see Table 8-41). If no tracing session is selected, breakpoints are requested
immediately.
If the BRK bit is set, then the associated breakpoint is generated immediately independent of tracing
trigger alignment.
8.4.7.2 Breakpoints Generated Via The TRIG Bit
If a TRIG triggers occur, the Final State is entered whereby tracing trigger alignment is defined by the
TALIGN bit. If a tracing session is selected by the TSOURCE bit, breakpoints are requested when the
tracing session has completed, thus if Begin aligned triggering is selected, the breakpoint is requested only
on completion of the subsequent trace (see Table 8-41). If no tracing session is selected, breakpoints are
requested immediately. TRIG breakpoints are possible with a single write to DBGC1, setting ARM and
TRIG simultaneously.
8.4.7.3 Breakpoint Priorities
If a TRIG trigger occurs after Begin aligned tracing has already started, then the TRIG no longer has an
effect. When the associated tracing session is complete, the breakpoint occurs. Similarly if a TRIG is
followed by a subsequent comparator channel match, it has no effect, since tracing has already started.
If a forced SWI breakpoint coincides with a BGND in user code with BDM enabled, then the BDM is
activated by the BGND and the breakpoint to SWI is suppressed.
8.4.7.3.1 DBG Breakpoint Priorities And BDM Interfacing
Breakpoint operation is dependent on the state of the BDM module. If the BDM module is active, the CPU
is executing out of BDM firmware, thus comparator matches and associated breakpoints are disabled. In
addition, while executing a BDM TRACE command, tagging into BDM is disabled. If BDM is not active,
the breakpoint gives priority to BDM requests over SWI requests if the breakpoint happens to coincide
with a SWI instruction in user code. On returning from BDM, the SWI from user code gets executed.
Table 8-41. Breakpoint Setup For CPU Breakpoints
BRK TALIGN DBGBRK Breakpoint Alignment
0 0 0 Fill Trace Buffer until trigger then disarm (no breakpoints)
0 0 1 Fill Trace Buffer until trigger, then breakpoint request occurs
0 1 0 Start Trace Buffer at trigger (no breakpoints)
0 1 1 Start Trace Buffer at trigger
A breakpoint request occurs when Trace Buffer is full
1 x 1 Terminate tracing and generate breakpoint immediately on trigger
1 x 0 Terminate tracing immediately on trigger
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BDM cannot be entered from a breakpoint unless the ENABLE bit is set in the BDM. If entry to BDM via
a BGND instruction is attempted and the ENABLE bit in the BDM is cleared, the CPU actually executes
the BDM firmware code, checks the ENABLE and returns if ENABLE is not set. If not serviced by the
monitor then the breakpoint is re-asserted when the BDM returns to normal CPU flow.
If the comparator register contents coincide with the SWI/BDM vector address then an SWI in user code
could coincide with a DBG breakpoint. The CPU ensures that BDM requests have a higher priority than
SWI requests. Returning from the BDM/SWI service routine care must be taken to avoid a repeated
breakpoint at the same address.
Should a tagged or forced breakpoint coincide with a BGND in user code, then the instruction that follows
the BGND instruction is the first instruction executed when normal program execution resumes.
NOTE
When program control returns from a tagged breakpoint using an RTI or
BDM GO command without program counter modification it returns to the
instruction whose tag generated the breakpoint. To avoid a repeated
breakpoint at the same location reconfigure the DBG module in the SWI
routine, if configured for an SWI breakpoint, or over the BDM interface by
executing a TRACE command before the GO to increment the program flow
past the tagged instruction.
8.5 Application Information
8.5.1 State Machine scenarios
Defining the state control registers as SCR1,SCR2, SCR3 and M0,M1,M2 as matches on channels 0,1,2
respectively. SCR encoding supported by S12SDBGV1 are shown in black. SCR encoding supported only
in S12SDBGV2 are shown in red. For backwards compatibility the new scenarios use a 4th bit in each SCR
register. Thus the existing encoding for SCRx[2:0] is not changed.
Table 8-42. Breakpoint Mapping Summary
DBGBRK BDM Bit
(DBGC1[4])
BDM
Enabled
BDM
Active
Breakpoint
Mapping
0 X X X No Breakpoint
1 0 X 0 Breakpoint to SWI
X X 1 1 No Breakpoint
1 1 0 X Breakpoint to SWI
1 1 1 0 Breakpoint to BDM
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8.5.2 Scenario 1
A trigger is generated if a given sequence of 3 code events is executed.
Figure 8-27. Scenario 1
Scenario 1 is possible with S12SDBGV1 SCR encoding
8.5.3 Scenario 2
A trigger is generated if a given sequence of 2 code events is executed.
Figure 8-28. Scenario 2a
A trigger is generated if a given sequence of 2 code events is executed, whereby the first event is entry into
a range (COMPA,COMPB configured for range mode). M1 is disabled in range modes.
Figure 8-29. Scenario 2b
A trigger is generated if a given sequence of 2 code events is executed, whereby the second event is entry
into a range (COMPA,COMPB configured for range mode)
Figure 8-30. Scenario 2c
All 3 scenarios 2a,2b,2c are possible with the S12SDBGV1 SCR encoding
State1 Final State
State3
State2
SCR1=0011 SCR2=0010 SCR3=0111
M1 M2 M0
State1 Final State
State2
SCR1=0011 SCR2=0101
M1 M2
State1 Final State
State2
SCR1=0111 SCR2=0101
M01 M2
State1 Final State
State2
SCR1=0010 SCR2=0011
M2 M0
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8.5.4 Scenario 3
A trigger is generated immediately when one of up to 3 given events occurs
Figure 8-31. Scenario 3
Scenario 3 is possible with S12SDBGV1 SCR encoding
8.5.5 Scenario 4
Trigger if a sequence of 2 events is carried out in an incorrect order. Event A must be followed by event B
and event B must be followed by event A. 2 consecutive occurances of event A without an intermediate
event B cause a trigger. Similarly 2 consecutive occurances of event B without an intermediate event A
cause a trigger. This is possible by using CompA and CompC to match on the same address as shown.
Figure 8-32. Scenario 4a
This scenario is currently not possible using 2 comparators only. S12SDBGV2 makes it possible with 2
comparators, State 3 allowing a M0 to return to state 2, whilst a M2 leads to final state as shown.
Figure 8-33. Scenario 4b (with 2 comparators)
The advantage of using only 2 channels is that now range comparisons can be included (channel0)
State1 Final State
SCR1=0000
M012
State1
State 3 Final State
State2
M0
M0
M2
M1
M1
M1
SCR1=0100
SCR2=0011
SCR3=0001
State1
State 3 Final State
State2
M0
M01
M0
M2
M2
M2
SCR1=0110
SCR2=1100
SCR3=1110
M1 disabled in
range mode
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This however violates the S12SDBGV1 specification, which states that a match leading to final state
always has priority in case of a simultaneous match, whilst priority is also given to the lowest channel
number. For S12SDBG the corresponding CPU priority decoder is removed to support this, such that on
simultaneous taghits, taghits pointing to final state have highest priority. If no taghit points to final state
then the lowest channel number has priority. Thus with the above encoding from State3, the CPU and DBG
would break on a simultaneous M0/M2.
8.5.6 Scenario 5
Trigger if following event A, event C precedes event B. ie. the expected execution flow is A->B->C.
Figure 8-34. Scenario 5
Scenario 5 is possible with the S12SDBGV1 SCR encoding
8.5.7 Scenario 6
Trigger if event A occurs twice in succession before any of 2 other events (BC) occurs. This scenario is
not possible using the S12SDBGV1 SCR encoding. S12SDBGV2 includes additions shown in red. The
change in SCR1 encoding also has the advantage that a State1->State3 transition using M0 is now possible.
This is advantageous because range and data bus comparisons use channel0 only.
Figure 8-35. Scenario 6
8.5.8 Scenario 7
Trigger when a series of 3 events is executed out of order. Specifying the event order as M1,M2,M0 to run
in loops (120120120). Any deviation from that order should trigger. This scenario is not possible using the
State1 Final State
State2
SCR1=0011 SCR2=0110
M1 M0
M2
State1 Final State
State3
SCR1=1001 SCR3=1010
M0 M0
M12
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S12SDBGV1 SCR encoding because OR possibilities are very limited in the channel encoding. By adding
OR forks as shown in red this scenario is possible.
Figure 8-36. Scenario 7
On simultaneous matches the lowest channel number has priority so with this configuration the forking
from State1 has the peculiar effect that a simultaneous match0/match1 transitions to final state but a
simultaneous match2/match1transitions to state2.
8.5.9 Scenario 8
Trigger when a routine/event at M2 follows either M1 or M0.
Figure 8-37. Scenario 8a
Trigger when an event M2 is followed by either event M0 or event M1
Figure 8-38. Scenario 8b
Scenario 8a and 8b are possible with the S12SDBGV1 and S12SDBGV2 SCR encoding
State1 Final State
State3
State2
SCR1=1101 SCR2=1100 SCR3=1101
M1 M2 M12
M0
M02
M01
State1 Final State
State2
SCR1=0111 SCR2=0101
M01 M2
State1 Final State
State2
SCR1=0010 SCR2=0111
M2 M01
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8.5.10 Scenario 9
Trigger when a routine/event at A (M2) does not follow either B or C (M1 or M0) before they are executed
again. This cannot be realised with theS12SDBGV1 SCR encoding due to OR limitations. By changing
the SCR2 encoding as shown in red this scenario becomes possible.
Figure 8-39. Scenario 9
8.5.11 Scenario 10
Trigger if an event M0 occurs following up to two successive M2 events without the resetting event M1.
As shown up to 2 consecutive M2 events are allowed, whereby a reset to State1 is possible after either one
or two M2 events. If an event M0 occurs following the second M2, before M1 resets to State1 then a trigger
is generated. Configuring CompA and CompC the same, it is possible to generate a breakpoint on the third
consecutive occurance of event M0 without a reset M1.
Figure 8-40. Scenario 10a
Figure 8-41. Scenario 10b
Scenario 10b shows the case that after M2 then M1 must occur before M0. Starting from a particular point
in code, event M2 must always be followed by M1 before M0. If after any M2, event M0 occurs before
M1 then a trigger is generated.
State1 Final State
State2
SCR1=0111 SCR2=1111
M01 M01
M2
State1 Final State
State3
State2
SCR1=0010 SCR2=0100 SCR3=0010
M2 M2 M0
M1
M1
State1 Final State
State3
State2
SCR1=0010 SCR2=0011 SCR3=0000
M2 M1
M0
M0
S12S Debug Module (S12SDBG)
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Chapter 9
Security (S12XS9SECV2)
9.1 Introduction
This specification describes the function of the security mechanism in the MC9S12G-Family (9SEC).
NOTE
No security feature is absolutely secure. However, Freescale’s strategy is to
make reading or copying the FLASH and/or EEPROM difficult for
unauthorized users.
9.1.1 Features
The user must be reminded that part of the security must lie with the application code. An extreme example
would be application code that dumps the contents of the internal memory. This would defeat the purpose
of security. At the same time, the user may also wish to put a backdoor in the application program. An
example of this is the user downloads a security key through the SCI, which allows access to a
programming routine that updates parameters stored in another section of the Flash memory.
The security features of the MC9S12G-Family (in secure mode) are:
• Protect the content of non-volatile memories (Flash, EEPROM)
• Execution of NVM commands is restricted
• Disable access to internal memory via background debug module (BDM)
9.1.2 Modes of Operation
Table 9-2 gives an overview over availability of security relevant features in unsecure and secure modes.
Table 9-1. Revision History
Revision
Number
Revision
Date
Sections
Affected Description of Changes
02.00 27 Aug 2004 reviewed and updated for S12XD architecture
02.01 21 Feb 2007 added S12XE, S12XF and S12XS architectures
02.02 19 Apr 2007 corrected statement about Backdoor key access via BDM on XE, XF, XS
Table 9-2. Feature Availability in Unsecure and Secure Modes on S12XS
Unsecure Mode Secure Mode
NS SS NX ES EX ST NS SS NX ES EX ST
Flash Array Access ✔✔ ✔✔
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9.1.3 Securing the Microcontroller
Once the user has programmed the Flash and EEPROM, the chip can be secured by programming the
security bits located in the options/security byte in the Flash memory array. These non-volatile bits will
keep the device secured through reset and power-down.
The options/security byte is located at address 0xFF0F (= global address 0x7F_FF0F) in the Flash memory
array. This byte can be erased and programmed like any other Flash location. Two bits of this byte are used
for security (SEC[1:0]). On devices which have a memory page window, the Flash options/security byte
is also available at address 0xBF0F by selecting page 0x3F with the PPAGE register. The contents of this
byte are copied into the Flash security register (FSEC) during a reset sequence.
The meaning of the bits KEYEN[1:0] is shown in Table 9-3. Please refer to Section 9.1.5.1, “Unsecuring
the MCU Using the Backdoor Key Access” for more information.
The meaning of the security bits SEC[1:0] is shown in Table 9-4. For security reasons, the state of device
security is controlled by two bits. To put the device in unsecured mode, these bits must be programmed to
SEC[1:0] = ‘10’. All other combinations put the device in a secured mode. The recommended value to put
the device in secured state is the inverse of the unsecured state, i.e. SEC[1:0] = ‘01’.
EEPROM Array Access ✔✔ ✔✔
NVM Commands ✔1✔ ✔1✔1
BDM ✔✔ —✔2
DBG Module Trace ✔✔ ——
1Restricted NVM command set only. Please refer to the NVM wrapper block guides for detailed information.
2BDM hardware commands restricted to peripheral registers only.
76543210
0xFF0F KEYEN1 KEYEN0 NV5 NV4 NV3 NV2 SEC1 SEC0
Figure 9-1. Flash Options/Security Byte
Table 9-3. Backdoor Key Access Enable Bits
KEYEN[1:0] Backdoor Key
Access Enabled
00 0 (disabled)
01 0 (disabled)
10 1 (enabled)
11 0 (disabled)
Table 9-2. Feature Availability in Unsecure and Secure Modes on S12XS
Unsecure Mode Secure Mode
NS SS NX ES EX ST NS SS NX ES EX ST
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NOTE
Please refer to the Flash block guide for actual security configuration (in
section “Flash Module Security”).
9.1.4 Operation of the Secured Microcontroller
By securing the device, unauthorized access to the EEPROM and Flash memory contents can be prevented.
However, it must be understood that the security of the EEPROM and Flash memory contents also depends
on the design of the application program. For example, if the application has the capability of downloading
code through a serial port and then executing that code (e.g. an application containing bootloader code),
then this capability could potentially be used to read the EEPROM and Flash memory contents even when
the microcontroller is in the secure state. In this example, the security of the application could be enhanced
by requiring a challenge/response authentication before any code can be downloaded.
Secured operation has the following effects on the microcontroller:
9.1.4.1 Normal Single Chip Mode (NS)
• Background debug module (BDM) operation is completely disabled.
• Execution of Flash and EEPROM commands is restricted. Please refer to the NVM block guide for
details.
• Tracing code execution using the DBG module is disabled.
9.1.4.2 Special Single Chip Mode (SS)
• BDM firmware commands are disabled.
• BDM hardware commands are restricted to the register space.
• Execution of Flash and EEPROM commands is restricted. Please refer to the NVM block guide for
details.
• Tracing code execution using the DBG module is disabled.
Special single chip mode means BDM is active after reset. The availability of BDM firmware commands
depends on the security state of the device. The BDM secure firmware first performs a blank check of both
the Flash memory and the EEPROM. If the blank check succeeds, security will be temporarily turned off
and the state of the security bits in the appropriate Flash memory location can be changed If the blank
check fails, security will remain active, only the BDM hardware commands will be enabled, and the
accessible memory space is restricted to the peripheral register area. This will allow the BDM to be used
to erase the EEPROM and Flash memory without giving access to their contents. After erasing both Flash
Table 9-4. Security Bits
SEC[1:0] Security State
00 1 (secured)
01 1 (secured)
10 0 (unsecured)
11 1 (secured)
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memory and EEPROM, another reset into special single chip mode will cause the blank check to succeed
and the options/security byte can be programmed to “unsecured” state via BDM.
While the BDM is executing the blank check, the BDM interface is completely blocked, which means that
all BDM commands are temporarily blocked.
9.1.5 Unsecuring the Microcontroller
Unsecuring the microcontroller can be done by three different methods:
1. Backdoor key access
2. Reprogramming the security bits
3. Complete memory erase (special modes)
9.1.5.1 Unsecuring the MCU Using the Backdoor Key Access
In normal modes (single chip and expanded), security can be temporarily disabled using the backdoor key
access method. This method requires that:
• The backdoor key at 0xFF00–0xFF07 (= global addresses 0x3_FF00–0x3_FF07) has been
programmed to a valid value.
• The KEYEN[1:0] bits within the Flash options/security byte select ‘enabled’.
• In single chip mode, the application program programmed into the microcontroller must be
designed to have the capability to write to the backdoor key locations.
The backdoor key values themselves would not normally be stored within the application data, which
means the application program would have to be designed to receive the backdoor key values from an
external source (e.g. through a serial port).
The backdoor key access method allows debugging of a secured microcontroller without having to erase
the Flash. This is particularly useful for failure analysis.
NOTE
No word of the backdoor key is allowed to have the value 0x0000 or
0xFFFF.
9.1.6 Reprogramming the Security Bits
In normal single chip mode (NS), security can also be disabled by erasing and reprogramming the security
bits within Flash options/security byte to the unsecured value. Because the erase operation will erase the
entire sector from 0xFE00–0xFFFF (0x7F_FE00–0x7F_FFFF), the backdoor key and the interrupt vectors
will also be erased; this method is not recommended for normal single chip mode. The application
software can only erase and program the Flash options/security byte if the Flash sector containing the Flash
options/security byte is not protected (see Flash protection). Thus Flash protection is a useful means of
preventing this method. The microcontroller will enter the unsecured state after the next reset following
the programming of the security bits to the unsecured value.
This method requires that:
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• The application software previously programmed into the microcontroller has been designed to
have the capability to erase and program the Flash options/security byte, or security is first disabled
using the backdoor key method, allowing BDM to be used to issue commands to erase and program
the Flash options/security byte.
• The Flash sector containing the Flash options/security byte is not protected.
9.1.7 Complete Memory Erase (Special Modes)
The microcontroller can be unsecured in special modes by erasing the entire EEPROM and Flash memory
contents.
When a secure microcontroller is reset into special single chip mode (SS), the BDM firmware verifies
whether the EEPROM and Flash memory are erased. If any EEPROM or Flash memory address is not
erased, only BDM hardware commands are enabled. BDM hardware commands can then be used to write
to the EEPROM and Flash registers to mass erase the EEPROM and all Flash memory blocks.
When next reset into special single chip mode, the BDM firmware will again verify whether all EEPROM
and Flash memory are erased, and this being the case, will enable all BDM commands, allowing the Flash
options/security byte to be programmed to the unsecured value. The security bits SEC[1:0] in the Flash
security register will indicate the unsecure state following the next reset.
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Chapter 10
S12 Clock, Reset and Power Management Unit (S12CPMU)
Revision History
10.1 Introduction
This specification describes the function of the Clock, Reset and Power Management Unit (S12CPMU).
• The Pierce oscillator (XOSCLCP) provides a robust, low-noise and low-power external clock
source. It is designed for optimal start-up margin with typical quartz crystals and ceramic
resonators.
• The Voltage regulator (IVREG) operates from the range 3.13V to 5.5V. It provides all the required
chip internal voltages and voltage monitors.
• The Phase Locked Loop (PLL) provides a highly accurate frequency multiplier with internal filter.
• The Internal Reference Clock (IRC1M) provides a1MHz clock.
10.1.1 Features
The Pierce Oscillator (XOSCLCP) contains circuitry to dynamically control current gain in the output
amplitude. This ensures a signal with low harmonic distortion, low power and good noise immunity.
• Supports quartz crystals or ceramic resonators from 4MHz to 16MHz.
• High noise immunity due to input hysteresis and spike filtering.
• Low RF emissions with peak-to-peak swing limited dynamically
Version
Number
Revision
Date
Effective
Date Author Description of Changes
V04.09 22 Jun 10 22 Jun 10
Changed IP-Name from OSCLCP to XOSCLCP, added
OSCCLK_LCP clock name intoFigure 10-1 and Figure 10-2
updated description of Section 10.2.2, “EXTAL and XTAL.
V04.10 01 Jul 10 01 Jul 10 Added TC trimming to feature list
V04.11 23 Aug 10 23 Aug 10 Removed feature of adaptive oscillator filter. Register bits 6 and 4to
0in the CPMUOSC register are marked reserved and do not alter.
S12 Clock, Reset and Power Management Unit (S12CPMU)
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• Transconductance (gm) sized for optimum start-up margin for typical crystals
• Dynamic gain control eliminates the need for external current limiting resistor
• Integrated resistor eliminates the need for external bias resistor.
• Low power consumption: Operates from internal 1.8V (nominal) supply, Amplitude control limits
power
The Voltage Regulator (IVREG) has the following features:
• Input voltage range from 3.13V to 5.5V
• Low-voltage detect (LVD) with low-voltage interrupt (LVI)
• Power-on reset (POR)
• Low-voltage reset (LVR)
The Phase Locked Loop (PLL) has the following features:
• highly accurate and phase locked frequency multiplier
• Configurable internal filter for best stability and lock time.
• Frequency modulation for defined jitter and reduced emission
• Automatic frequency lock detector
• Interrupt request on entry or exit from locked condition
• Reference clock either external (crystal) or internal square wave (1MHz IRC1M) based.
• PLL stability is sufficient for LIN communication, even if using IRC1M as reference clock
The Internal Reference Clock (IRC1M) has the following features:
• Frequency trimming
(A factory trim value for 1MHz is loaded from Flash Memory into the IRCTRIM register after
reset, which can be overwritten by application if required)
• Temperature Coefficient (TC) trimming.
(A factory trim value is loaded from Flash Memory into the IRCTRIM register to turned off TC
trimming after reset. Application can trim the TC if required by overwriting the IRCTRIM
register).
•
Other features of the S12CPMU include
• Clock monitor to detect loss of crystal
• Autonomous periodical interrupt (API)
• Bus Clock Generator
— Clock switch to select either PLLCLK or external crystal/resonator based Bus Clock
— PLLCLK divider to adjust system speed
• System Reset generation from the following possible sources:
— Power-on reset (POR)
— Low-voltage reset (LVR)
— Illegal address access
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 329
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
— COP time out
— Loss of oscillation (clock monitor fail)
— External pin RESET
10.1.2 Modes of Operation
This subsection lists and briefly describes all operating modes supported by the S12CPMU.
10.1.2.1 Run Mode
The voltage regulator is in Full Performance Mode (FPM).
The Phase Locked Loop (PLL) is on.
The Internal Reference Clock (IRC1M) is on.
The API is available.
• PLL Engaged Internal (PEI)
— This is the default mode after System Reset and Power-On Reset.
— The Bus Clock is based on the PLLCLK.
— After reset the PLL is configured for 50 MHz VCOCLK operation
Post divider is 0x03, so PLLCLK is VCOCLK divided by 4, that is 12.5MHz and Bus Clock is
6.25MHz.
The PLL can be re-configured for other bus frequencies.
— The reference clock for the PLL (REFCLK) is based on internal reference clock IRC1M
• PLL Engaged External (PEE)
— The Bus Clock is based n the PLLCLK.
— This mode can be entered from default mode PEI by performing the following steps:
– Configure the PLL for desired bus frequency.
– Program the reference divider (REFDIV[3:0] bits) to divide down oscillator frequency if
necessary.
– Enable the external oscillator (OSCE bit)
– Wait for oscillator to start up (UPOSC=1) and PLL to lock (LOCK=1).
• PLL Bypassed External (PBE)
— The Bus Clock is based on the Oscillator Clock (OSCCLK).
— The PLLCLK is always on to qualify the external oscillator clock. Therefore it is necessary to
make sure a valid PLL configuration is used for the selected oscillator frequency.
— This mode can be entered from default mode PEI by performing the following steps:
– Make sure the PLL configuration is valid for the selected oscillator frequency.
– Enable the external oscillator (OSCE bit)
– Wait for oscillator to start up (UPOSC=1)
– Select the Oscillator Clock (OSCCLK) as Bus Clock (PLLSEL=0).
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
330 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
— The PLLCLK is on and used to qualify the external oscillator clock.
10.1.2.2 Wait Mode
For S12CPMU Wait Mode is the same as Run Mode.
10.1.2.3 Stop Mode
This mode is entered by executing the CPU STOP instruction.
The voltage regulator is in Reduced Power Mode (RPM).
The API is available.
The Phase Locked Loop (PLL) is off.
The Internal Reference Clock (IRC1M) is off.
Core Clock, Bus Clock and BDM Clock are stopped.
Depending on the setting of the PSTP and the OSCE bit, Stop Mode can be differentiated between Full
Stop Mode (PSTP = 0 or OSCE=0) and Pseudo Stop Mode (PSTP = 1 and OSCE=1). In addition, the
behavior of the COP in each mode will change based on the clocking method selected by
COPOSCSEL[1:0].
•Full Stop Mode (PSTP = 0 or OSCE=0)
External oscillator (XOSCLCP) is disabled.
— If COPOSCSEL1=0:
The COP and RTI counters halt during Full Stop Mode.
After wake-up from Full Stop Mode the Core Clock and Bus Clock are running on PLLCLK
(PLLSEL=1). COP and RTI are running on IRCCLK (COPOSCSEL0=0, RTIOSCSEL=0).
— If COPOSCSEL1=1:
During Full Stop Mode the COP is running on ACLK (trimmable internal RC-Oscillator clock)
and the RTI counter halts.
After wake-up from Full Stop Mode the Core Clock and Bus Clock are running on PLLCLK
(PLLSEL=1). The COP runs on ACLK and RTI is running on IRCCLK (COPOSCSEL0=0,
RTIOSCSEL=0).
•Pseudo Stop Mode (PSTP = 1 and OSCE=1)
External oscillator (XOSCLCP) continues to run.
— If COPOSCSEL1=0:
If the respective enable bits are set (PCE=1 and PRE=1) the COP and RTI will continue to run
with a clock derived from the oscillator clock.
The clock configuration bits PLLSEL, COPOSCSEL0, RTIOSCSEL are unchanged.
— If COPOSCSEL1=1:
If the respective enable bit for the RTI is set (PRE=1) the RTI will continue to run with a clock
derived from the oscillator clock.
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 331
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The COP will continue to run on ACLK.
The clock configuration bits PLLSEL, COPOSCSEL0, RTIOSCSEL are unchanged.
NOTE
When starting up the external oscillator (either by programming OSCE bit
to 1 or on exit from Full Stop Mode with OSCE bit already 1) the software
must wait for a minimum time equivalent to the startup-time of the external
oscillator tUPOSC before entering Pseudo Stop Mode.
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
332 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
10.1.3 S12CPMU Block Diagram
Figure 10-1. Block diagram of S12CPMU
S12CPMU
EXTAL
XTAL
System Reset
Power-On Detect
PLL Lock Interrupt
MMC Illegal Address Access
COP time out
Loop
Reference
Divider
COP
Watchdog
Voltage
VDDR
Internal
Reset
Generator
Divide by
Phase
Post
Divider
1,2,.,32
VCOCLK
ECLK2X
LOCKIE
IRCTRIM[9:0]
SYNDIV[5:0]
LOCK
REFDIV[3:0]
2*(SYNDIV+1)
Pierce
Oscillator
4MHz-16MHz
OSCE
ILAF
PORF
divide
by 2
ECLK
POSTDIV[4:0]
Power-On Reset
Controlled
locked
Loop with
internal
Filter (PLL)
REFCLK
FBCLK
REFFRQ[1:0]
VCOFRQ[1:0]
Lock
detect
Regulator
3.13 to 5.5V
Autonomous
Periodic
Interrupt (API)
API Interrupt
VDDA
VSSA
PLLSEL
(to MSCAN)
VDDX
VSSX
VSS Low Voltage Detect VDDX
LVRF
PLLCLK
Reference
divide
by 8 BDM Clock
Clock
(IRC1M)
Clock
Monitor
monitor fail
Real Time
Interrupt (RTI)
RTI Interrupt
PSTP
CPMURTI
Oscillator status Interrupt
(XOSCLCP)
CAN_OSCCLK
Low Voltage Interrupt
ACLK
APICLK
RTICLK
IRCCLK
OSCCLK
RTIOSCSEL
CPMUCOP
COPCLK
IRCCLK
OSCCLK
COPOSCSEL0
to Reset
Generator
COP time out
PCE
PRE
UPOSC=0 sets PLLSEL bit
API_EXTCLK
RC
Osc.
VDD, VDDF
(core supplies)
UPOSC
RESET
OSCIE
APIE
RTIE
LVDS LVIE
Low Voltage Detect VDDA
UPOSC
UPOSC=0 clears
&
OSCCLK
divide
by 4
Bus Clock
IRCCLK
(to LCD)
ACLK
COPOSCSEL1
(Bus Clock)
(Core Clock)
OSCCLK_LCP
External
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 333
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 10-2 shows a block diagram of the XOSCLCP.
Figure 10-2. XOSCLCP Block Diagram
10.2 Signal Description
This section lists and describes the signals that connect off chip.
10.2.1 RESET
Pin RESET is an active-low bidirectional pin. As an input it initializes the MCU asynchronously to a
known start-up state. As an open-drain output it indicates that an MCU-internal reset has been triggered.
10.2.2 EXTAL and XTAL
These pins provide the interface for a crystal to control the internal clock generator circuitry. EXTAL is
the input to the crystal oscillator amplifier. XTAL is the output of the crystal oscillator amplifier. If
XOSCLCP is enabled, the MCU internal OSCCLK_LCP is derived from the EXTAL input frequency. If
OSCE=0, the EXTAL pin is pulled down by an internal resistor of approximately 200 kΩ and the XTAL
pin is pulled down by an internal resistor of approximately 700 kΩ.
EXTAL XTAL
Gain Control
VDD = 1.8 V
Rf
OSCCLK_LCP
Peak
Detector
VSS
VSS VSS
C1 C2
Quartz Crystals
Ceramic Resonators
or
Clock
Monitor
monitor fail
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
334 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
Freescale recommends an evaluation of the application board and chosen
resonator or crystal by the resonator or crystal supplier.
The loop controlled circuit (XOSCLCP) is not suited for overtone
resonators and crystals.
10.2.3 VDDR — Regulator Power Input Pin
Pin VDDR is the power input of IVREG. All currents sourced into the regulator loads flow through this pin.
An off-chip decoupling capacitor (100 nF...220 nF, X7R ceramic) between VDDR and VSS can smooth
ripple on VDDR.
10.2.4 VSS — Ground Pin
VSS must be grounded.
10.2.5 VDDA, VSSA — Regulator Reference Supply Pins
Pins VDDA and VSSA are used to supply the analog parts of the regulator.
Internal precision reference circuits are supplied from these signals.
An off-chip decoupling capacitor (100 nF...220 nF, X7R ceramic) between VDDA and VSSA can improve
the quality of this supply.
10.2.6 VDDX, VSSX— Pad Supply Pins
This supply domain is monitored by the Low Voltage Reset circuit.
An off-chip decoupling capacitor (100 nF...220 nF, X7R ceramic) between VDDX and VSSX can improve
the quality of this supply.
NOTE
Depending on the device package following device supply pins are maybe
combined into one pin: VDDR, VDDX and VDDA.
Depending on the device package following device supply pins are maybe
combined into one pin: VSS, VSSX and VSSA.
Please refer to the device Reference Manual for information if device supply
pins are combined into one supply pin for certain packages and which
supply pins are combined together.
An off-chip decoupling capacitor (100 nF...220 nF, X7R ceramic) between
the combined supply pin pair can improve the quality of this supply.
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 335
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
10.2.7 VDD — Internal Regulator Output Supply (Core Logic)
Node VDD is a device internal supply output of the voltage regulator that provides the power supply for
the core logic.
This supply domain is monitored by the Low Voltage Reset circuit.
10.2.8 VDDF — Internal Regulator Output Supply (NVM Logic)
Node VDDF is a device internal supply output of the voltage regulator that provides the power supply for
the NVM logic.
This supply domain is monitored by the Low Voltage Reset circuit
10.2.9 API_EXTCLK — API external clock output pin
This pin provides the signal selected via APIES and is enabled with APIEA bit. See device specification
to which pin it connects.
10.3 Memory Map and Registers
This section provides a detailed description of all registers accessible in the S12CPMU.
10.3.1 Module Memory Map
The S12CPMU registers are shown in Figure 10-3.
Addres
sName Bit 7 6 5 4 3 2 1 Bit 0
0x0034 CPMU
SYNR
RVCOFRQ[1:0] SYNDIV[5:0]
W
0x0035 CPMU
REFDIV
RREFFRQ[1:0] 00 REFDIV[3:0]
W
0x0036 CPMU
POSTDIV
R0 0 0 POSTDIV[4:0]
W
0x0037 CPMUFLG RRTIF PORF LVRF LOCKIF LOCK ILAF OSCIF UPOSC
W
0x0038 CPMUINT RRTIE 00
LOCKIE 00
OSCIE 0
W
0x0039 CPMUCLKS RPLLSEL PSTP 0COP
OSCSEL1 PRE PCE RTI
OSCSEL
COP
OSCSEL0
W
0x003A CPMUPLL R0 0 FM1 FM0 00 0 0
W
= Unimplemented or Reserved
Figure 10-3. CPMU Register Summary
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
336 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x003B CPMURTI RRTDEC RTR6 RTR5 RTR4 RTR3 RTR2 RTR1 RTR0
W
0x003C CPMUCOP RWCOP RSBCK 000
CR2 CR1 CR0
W WRTMASK
0x003D RESERVEDCP
MUTEST0
R0 0 0 000 0 0
W
0x003E RESERVEDCP
MUTEST1
R0 0 0 000 0 0
W
0x003F CPMU
ARMCOP
R0 0 0 000 0 0
W Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x02F0 RESERVED R0 0 0 000 0 0
W
0x02F1 CPMU
LVCTL
R 0 0 0 0 0 LVDS LVIE LVIF
W
0x02F2 CPMU
APICTL
RAPICLK 00
APIES APIEA APIFE APIE APIF
W
0x02F3 CPMUACLKTR RACLKTR5 ACLKTR4 ACLKTR3 ACLKTR2 ACLKTR1 ACLKTR0 00
W
0x02F4 CPMUAPIRH RAPIR15 APIR14 APIR13 APIR12 APIR11 APIR10 APIR9 APIR8
W
0x02F5 CPMUAPIRL RAPIR7 APIR6 APIR5 APIR4 APIR3 APIR2 APIR1 APIR0
W
0x02F6 RESERVEDCP
MUTEST3
R0 0 0 000 0 0
W
0x02F7 RESERVED R0 0 0 000 0 0
W
0x02F8 CPMU
IRCTRIMH
RTCTRIM[4:0] 0IRCTRIM[9:8]
W
0x02F9 CPMU
IRCTRIML
RIRCTRIM[7:0]
W
0x02FA CPMUOSC
R
OSCE Reserved
OSCPINS_
EN Reserved
W
0x02FB CPMUPROT R0 0 0 000 0
PROT
W
0x02FC RESERVEDCP
MUTEST2
R0 0 0 000 0 0
W
Addres
sName Bit 7 6 5 4 3 2 1 Bit 0
= Unimplemented or Reserved
Figure 10-3. CPMU Register Summary
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 337
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
10.3.2 Register Descriptions
This section describes all the S12CPMU registers and their individual bits.
Address order is as listed in Figure 10-3.
10.3.2.1 S12CPMU Synthesizer Register (CPMUSYNR)
The CPMUSYNR register controls the multiplication factor of the PLL and selects the VCO frequency
range.
Read: Anytime
Write: Anytime if PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register). Else write has
no effect.
NOTE
Writing to this register clears the LOCK and UPOSC status bits.
NOTE
fVCO must be within the specified VCO frequency lock range. Bus
frequency fbus must not exceed the specified maximum.
The VCOFRQ[1:0] bits are used to configure the VCO gain for optimal stability and lock time. For correct
PLL operation the VCOFRQ[1:0] bits have to be selected according to the actual target VCOCLK
frequency as shown in Table 10-1. Setting the VCOFRQ[1:0] bits incorrectly can result in a non functional
PLL (no locking and/or insufficient stability).
0x0034
76543210
R
VCOFRQ[1:0] SYNDIV[5:0]
W
Reset 01011000
Figure 10-4. S12CPMU Synthesizer Register (CPMUSYNR)
Table 10-1. VCO Clock Frequency Selection
VCOCLK Frequency Ranges VCOFRQ[1:0]
32MHz <= fVCO<= 48MHz 00
48MHz < fVCO<= 50MHz 01
Reserved 10
fVCO 2f
REF
×SYNDIV 1+()×=
If PLL has locked (LOCK=1)
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
338 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
10.3.2.2 S12CPMU Reference Divider Register (CPMUREFDIV)
The CPMUREFDIV register provides a finer granularity for the PLL multiplier steps when using the
external oscillator as reference.
Read: Anytime
Write: Anytime if PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register). Else write has
no effect.
NOTE
Write to this register clears the LOCK and UPOSC status bits.
The REFFRQ[1:0] bits are used to configure the internal PLL filter for optimal stability and lock time. For
correct PLL operation the REFFRQ[1:0] bits have to be selected according to the actual REFCLK
frequency as shown in Table 10-2.
If IRC1M is selected as REFCLK (OSCE=0) the PLL filter is fixed configured for the 1MHz <= fREF <=
2MHz range. The bits can still be written but will have no effect on the PLL filter configuration.
For OSCE=1, setting the REFFRQ[1:0] bits incorrectly can result in a non functional PLL (no locking
and/or insufficient stability).
Reserved 11
0x0035
76543210
R
REFFRQ[1:0]
00
REFDIV[3:0]
W
Reset 00001111
Figure 10-5. S12CPMU Reference Divider Register (CPMUREFDIV)
Table 10-1. VCO Clock Frequency Selection
VCOCLK Frequency Ranges VCOFRQ[1:0]
fREF
fOSC
REFDIV 1+()
------------------------------------
=
If XOSCLCP is enabled (OSCE=1)
If XOSCLCP is disabled (OSCE=0) fREF fIRC1M
=
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 339
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
10.3.2.3 S12CPMU Post Divider Register (CPMUPOSTDIV)
The POSTDIV register controls the frequency ratio between the VCOCLK and the PLLCLK.
Read: Anytime
Write: Anytime if PLLSEL=1. Else write has no effect.
10.3.2.4 S12CPMU Flags Register (CPMUFLG)
This register provides S12CPMU status bits and flags.
Table 10-2. Reference Clock Frequency Selection if OSC_LCP is enabled
REFCLK Frequency Ranges
(OSCE=1) REFFRQ[1:0]
1MHz <= fREF <= 2MHz 00
2MHz < fREF <= 6MHz 01
6MHz < fREF <= 12MHz 10
fREF >12MHz 11
0x0036
76543210
R000
POSTDIV[4:0]
W
Reset 00000011
= Unimplemented or Reserved
Figure 10-6. S12CPMU Post Divider Register (CPMUPOSTDIV)
fPLL
fVCO
POSTDIV 1+()
-----------------------------------------
=
If PLL is locked (LOCK=1)
If PLL is not locked (LOCK=0) fPLL
fVCO
4
---------------
=
fbus
fPLL
2
-------------
=
If PLL is selected (PLLSEL=1)
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
340 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Read: Anytime
Write: Refer to each bit for individual write conditions
0x0037
76543210
R
RTIF PORF LVRF LOCKIF
LOCK
ILAF OSCIF
UPOSC
W
Reset 0 Note 1 Note 2 0 0 Note 3 0 0
1. PORF is set to 1 when a power on reset occurs. Unaffected by System Reset.
2. LVRF is set to 1 when a low voltage reset occurs. Unaffected by System Reset. Set by power on reset.
3. ILAF is set to 1 when an illegal address reset occurs. Unaffected by System Reset. Cleared by power on reset.
= Unimplemented or Reserved
Figure 10-7. S12CPMU Flags Register (CPMUFLG)
Table 10-3. CPMUFLG Field Descriptions
Field Description
7
RTIF
Real Time Interrupt Flag — RTIF is set to 1 at the end of the RTI period. This flag can only be cleared by writing
a 1. Writing a 0 has no effect. If enabled (RTIE=1), RTIF causes an interrupt request.
0 RTI time-out has not yet occurred.
1 RTI time-out has occurred.
6
PORF
Power on Reset Flag —PORF is set to 1 when a power on reset occurs. This flag can only be cleared by writing
a 1. Writing a 0 has no effect.
0 Power on reset has not occurred.
1 Power on reset has occurred.
5
LVRF
Low Voltage Reset Flag —LVRF is set to 1 when a low voltage reset occurs. This flag can only be cleared by
writing a 1. Writing a 0 has no effect.
0 Low voltage reset has not occurred.
1 Low voltage reset has occurred.
4
LOCKIF
PLL Lock Interrupt Flag —LOCKIF is set to 1 when LOCK status bit changes. This flag can only be cleared by
writing a 1. Writing a 0 has no effect.If enabled (LOCKIE=1), LOCKIF causes an interrupt request.
0 No change in LOCK bit.
1 LOCK bit has changed.
3
LOCK
Lock Status Bit —LOCK reflects the current state of PLL lock condition. Writes have no effect. While PLL is
unlocked (LOCK=0) fPLL is fVCO / 4 to protect the system from high core clock frequencies during the PLL
stabilization time tlock.
0 VCOCLK is not within the desired tolerance of the target frequency.
fPLL = fVCO/4.
1 VCOCLK is within the desired tolerance of the target frequency.
fPLL = fVCO/(POSTDIV+1).
2
ILAF
Illegal Address Reset Flag —ILAF is set to 1 when an illegal address reset occurs. Refer to MMC chapter for
details. This flag can only be cleared by writing a 1. Writing a 0 has no effect.
0 Illegal address reset has not occurred.
1 Illegal address reset has occurred.
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 341
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
10.3.2.5 S12CPMU Interrupt Enable Register (CPMUINT)
This register enables S12CPMU interrupt requests.
Read: Anytime
Write: Anytime
10.3.2.6 S12CPMU Clock Select Register (CPMUCLKS)
This register controls S12CPMU clock selection.
1
OSCIF
Oscillator Interrupt Flag —OSCIF is set to 1 when UPOSC status bit changes. This flag can only be cleared
by writing a 1. Writing a 0 has no effect.If enabled (OSCIE=1), OSCIF causes an interrupt request.
0 No change in UPOSC bit.
1 UPOSC bit has changed.
0
UPOSC
Oscillator Status Bit — UPOSC reflects the status of the oscillator. Writes have no effect. While UPOSC=0 the
OSCCLK going to the MSCAN module is off. Entering Full Stop Mode UPOSC is cleared.
0 The oscillator is off or oscillation is not qualified by the PLL.
1 The oscillator is qualified by the PLL.
0x0038
76543210
R
RTIE
00
LOCKIE
00
OSCIE
0
W
Reset 00000000
= Unimplemented or Reserved
Figure 10-8. S12CPMU Interrupt Enable Register (CPMUINT)
Table 10-4. CRGINT Field Descriptions
Field Description
7
RTIE
Real Time Interrupt Enable Bit
0 Interrupt requests from RTI are disabled.
1 Interrupt will be requested whenever RTIF is set.
4
LOCKIE
PLL Lock Interrupt Enable Bit
0 PLL LOCK interrupt requests are disabled.
1 Interrupt will be requested whenever LOCKIF is set.
1
OSCIE
Oscillator Corrupt Interrupt Enable Bit
0 Oscillator Corrupt interrupt requests are disabled.
1 Interrupt will be requested whenever OSCIF is set.
Table 10-3. CPMUFLG Field Descriptions (continued)
Field Description
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
342 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Read: Anytime
Write:
1. Only possible if PROT=0 (CPMUPROT register) in all MCU Modes (Normal and Special Mode).
2. All bits in Special Mode (if PROT=0).
3. PLLSEL, PSTP, PRE, PCE, RTIOSCSEL: In Normal Mode (if PROT=0).
4. COPOSCSEL0: In Normal Mode (if PROT=0) until CPMUCOP write once has taken place.
If COPOSCSEL0 was cleared by UPOSC=0 (entering Full Stop Mode with COPOSCSEL0=1 or
insufficient OSCCLK quality), then COPOSCSEL0 can be set once again.
5. COPOSCSEL1: In Normal Mode (if PROT=0) until CPMUCOP write once is taken.
COPOSCSEL1 will not be cleared by UPOSC=0 (entering Full Stop Mode with COPOSCSEL1=1
or insufficient OSCCLK quality if OSCCLK is used as clock source for other clock domains: for
instance core clock etc.).
NOTE
After writing CPMUCLKS register, it is strongly recommended to read
back CPMUCLKS register to make sure that write of PLLSEL,
RTIOSCSEL, COPOSCSEL0 and COPOSCSEL1 was successful.
0x0039
76543210
R
PLLSEL PSTP
0COP
OSCSEL1 PRE PCE RTI
OSCSEL
COP
OSCSEL0
W
Reset 10000000
= Unimplemented or Reserved
Figure 10-9. S12CPMU Clock Select Register (CPMUCLKS)
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 343
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 10-5. CPMUCLKS Descriptions
Field Description
7
PLLSEL
PLL Select Bit
This bit selects the PLLCLK as source of the System Clocks (Core Clock and Bus Clock).
PLLSEL can only be set to 0, if UPOSC=1.
UPOSC= 0 sets the PLLSEL bit.
Entering Full Stop Mode sets the PLLSEL bit.
0 System clocks are derived from OSCCLK if oscillator is up (UPOSC=1, fbus = fosc / 2.
1 System clocks are derived from PLLCLK, fbus = fPLL / 2.
6
PSTP
Pseudo Stop Bit
This bit controls the functionality of the oscillator during Stop Mode.
0 Oscillator is disabled in Stop Mode (Full Stop Mode).
1 Oscillator continues to run in Stop Mode (Pseudo Stop Mode), option to run RTI and COP.
Note: Pseudo Stop Mode allows for faster STOP recovery and reduces the mechanical stress and aging of the
resonator in case of frequent STOP conditions at the expense of a slightly increased power consumption.
Note: When starting up the external oscillator (either by programming OSCE bit to 1 or on exit from Full Stop
Mode with OSCE bit is already 1) the software must wait for a minimum time equivalent to the startup-time
of the external oscillator tUPOSC before entering Pseudo Stop Mode.
4
COP
OSCSEL1
COP Clock Select 1 — COPOSCSEL0 and COPOSCSEL1 combined determine the clock source to the COP
(see also Table 10-6).
If COPOSCSEL1 = 1, COPOSCSEL0 has no effect regarding clock select and changing the COPOSCSEL0 bit
does not re-start the COP time-out period.
COPOSCSEL1 selects the clock source to the COP to be either ACLK (derived from trimmable internal
RC-Oscillator) or clock selected via COPOSCSEL0 (IRCCLK or OSCCLK).
Changing the COPOSCSEL1 bit re-starts the COP time-out period.
COPOSCSEL1 can be set independent from value of UPOSC.
UPOSC= 0 does not clear the COPOSCSEL1 bit.
0 COP clock source defined by COPOSCSEL0
1 COP clock source is ACLK derived from a trimmable internal RC-Oscillator
3
PRE
RTI Enable During Pseudo Stop Bit — PRE enables the RTI during Pseudo Stop Mode.
0 RTI stops running during Pseudo Stop Mode.
1 RTI continues running during Pseudo Stop Mode if RTIOSCSEL=1.
Note: If PRE=0 or RTIOSCSEL=0 then the RTI will go static while Stop Mode is active. The RTI counter will not
be reset.
2
PCE
COP Enable During Pseudo Stop Bit — PCE enables the COP during Pseudo Stop Mode.
0 COP stops running during Pseudo Stop Mode if: COPOSCSEL1=0 and COPOSCSEL0=0
1 COP continues running during Pseudo Stop Mode if: PSTP=1, COPOSCSEL1=0 and COPOSCSEL0=1
Note: If PCE=0 or COPOSCSEL0=0 while COPOSCSEL1=0 then the COP is static during Stop Mode being
active. The COP counter will not be reset.
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
344 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 10-6. COPOSCSEL1, COPOSCSEL0 clock source select description
10.3.2.7 S12CPMU PLL Control Register (CPMUPLL)
This register controls the PLL functionality.
Read: Anytime
Write: Anytime if PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register). Else write has
no effect.
NOTE
Write to this register clears the LOCK and UPOSC status bits.
1
RTIOSCSEL
RTI Clock Select — RTIOSCSEL selects the clock source to the RTI. Either IRCCLK or OSCCLK. Changing the
RTIOSCSEL bit re-starts the RTI time-out period.
RTIOSCSEL can only be set to 1, if UPOSC=1.
UPOSC= 0 clears the RTIOSCSEL bit.
0 RTI clock source is IRCCLK.
1 RTI clock source is OSCCLK.
0
COP
OSCSEL0
COP Clock Select 0 — COPOSCSEL0 and COPOSCSEL1 combined determine the clock source to the COP
(see also Table 10-6)
If COPOSCSEL1 = 1, COPOSCSEL0 has no effect regarding clock select and changing the COPOSCSEL0 bit
does not re-start the COP time-out period.
When COPOSCSEL1=0,COPOSCSEL0 selects the clock source to the COP to be either IRCCLK or OSCCLK.
Changing the COPOSCSEL0 bit re-starts the COP time-out period.
COPOSCSEL0 can only be set to 1, if UPOSC=1.
UPOSC= 0 clears the COPOSCSEL0 bit.
0 COP clock source is IRCCLK.
1 COP clock source is OSCCLK
COPOSCSEL1 COPOSCSEL0 COP clock source
0 0 IRCCLK
0 1 OSCCLK
1 x ACLK
0x003A
76543210
R0 0
FM1 FM0
0000
W
Reset 00000000
Figure 10-10. S12CPMU PLL Control Register (CPMUPLL)
Table 10-5. CPMUCLKS Descriptions (continued)
Field Description
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 345
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
Care should be taken to ensure that the bus frequency does not exceed the
specified maximum when frequency modulation is enabled.
10.3.2.8 S12CPMU RTI Control Register (CPMURTI)
This register selects the time-out period for the Real Time Interrupt.
The clock source for the RTI is either IRCCLK or OSCCLK depending on the setting of the RTIOSCSEL
bit. In Stop Mode with PSTP=1 (Pseudo Stop Mode) and RTIOSCSEL=1 the RTI continues to run, else
the RTI counter halts in Stop Mode.
Read: Anytime
Write: Anytime
Table 10-7. CPMUPLL Field Descriptions
Field Description
5, 4
FM1, FM0
PLL Frequency Modulation Enable Bits — FM1 and FM0 enable frequency modulation on the VCOCLK. This
is to reduce noise emission. The modulation frequency is fref divided by 16. See Table 10-8 for coding.
Table 10-8. FM Amplitude selection
FM1 FM0 FM Amplitude /
fVCO Variation
0 0 FM off
01 ±1%
10 ±2%
11 ±4%
0x003B
76543210
R
RTDEC RTR6 RTR5 RTR4 RTR3 RTR2 RTR1 RTR0
W
Reset 00000000
Figure 10-11. S12CPMU RTI Control Register (CPMURTI)
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
346 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
A write to this register starts the RTI time-out period. A change of the
RTIOSCSEL bit (writing a different value or loosing UPOSC status)
re-starts the RTI time-out period.
Table 10-9. CPMURTI Field Descriptions
Field Description
7
RTDEC
Decimal or Binary Divider Select Bit — RTDEC selects decimal or binary based prescaler values.
0 Binary based divider value. See Table 10-10
1 Decimal based divider value. See Table 10-11
6–4
RTR[6:4]
Real Time Interrupt Prescale Rate Select Bits — These bits select the prescale rate for the RTI. See
Table 10-10 and Table 10-11.
3–0
RTR[3:0]
Real Time Interrupt Modulus Counter Select Bits — These bits select the modulus counter target value to
provide additional granularity.Table 10-10 and Table 10-11 show all possible divide values selectable by the
CPMURTI register.
Table 10-10. RTI Frequency Divide Rates for RTDEC = 0
RTR[3:0]
RTR[6:4] =
000
(OFF)
001
(210)
010
(211)
011
(212)
100
(213)
101
(214)
110
(215)
111
(216)
0000 (÷1) OFF1210 211 212 213 214 215 216
0001 (÷2) OFF 2x210 2x211 2x212 2x213 2x214 2x215 2x216
0010 (÷3) OFF 3x210 3x211 3x212 3x213 3x214 3x215 3x216
0011 (÷4) OFF 4x210 4x211 4x212 4x213 4x214 4x215 4x216
0100 (÷5) OFF 5x210 5x211 5x212 5x213 5x214 5x215 5x216
0101 (÷6) OFF 6x210 6x211 6x212 6x213 6x214 6x215 6x216
0110 (÷7) OFF 7x210 7x211 7x212 7x213 7x214 7x215 7x216
0111 (÷8) OFF 8x210 8x211 8x212 8x213 8x214 8x215 8x216
1000 (÷9) OFF 9x210 9x211 9x212 9x213 9x214 9x215 9x216
1001 (÷10) OFF 10x210 10x211 10x212 10x213 10x214 10x215 10x216
1010 (÷11) OFF 11x210 11x211 11x212 11x213 11x214 11x215 11x216
1011 (÷12) OFF 12x210 12x211 12x212 12x213 12x214 12x215 12x216
1100 (÷13) OFF 13x210 13x211 13x212 13x213 13x214 13x215 13x216
1101 (÷14) OFF 14x210 14x211 14x212 14x213 14x214 14x215 14x216
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 347
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
10.3.2.9 S12CPMU COP Control Register (CPMUCOP)
This register controls the COP (Computer Operating Properly) watchdog.
1110 (÷15) OFF 15x210 15x211 15x212 15x213 15x214 15x215 15x216
1111 (÷16) OFF 16x210 16x211 16x212 16x213 16x214 16x215 16x216
1Denotes the default value out of reset.This value should be used to disable the RTI to ensure future backwards compatibility.
Table 10-11. RTI Frequency Divide Rates for RTDEC=1
RTR[3:0]
RTR[6:4] =
000
(1x103)
001
(2x103)
010
(5x103)
011
(10x103)
100
(20x103)
101
(50x103)
110
(100x103)
111
(200x103)
0000 (÷1) 1x1032x1035x10310x10320x10350x103100x103200x103
0001 (÷2) 2x1034x10310x10320x10340x103100x103200x103400x103
0010 (÷3) 3x1036x10315x10330x10360x103150x103300x103600x103
0011 (÷4) 4x1038x10320x10340x10380x103200x103400x103800x103
0100 (÷5) 5x10310x10325x10350x103100x103250x103500x1031x106
0101 (÷6) 6x10312x10330x10360x103120x103300x103600x1031.2x106
0110 (÷7) 7x10314x10335x10370x103140x103350x103700x1031.4x106
0111 (÷8) 8x10316x10340x10380x103160x103400x103800x1031.6x106
1000 (÷9) 9x10318x10345x10390x103180x103450x103900x1031.8x106
1001 (÷10) 10 x10320x10350x103100x103200x103500x1031x1062x106
1010 (÷11) 11 x10322x10355x103110x103220x103550x1031.1x1062.2x106
1011 (÷12) 12x10324x10360x103120x103240x103600x1031.2x1062.4x106
1100 (÷13) 13x10326x10365x103130x103260x103650x1031.3x1062.6x106
1101 (÷14) 14x10328x10370x103140x103280x103700x1031.4x1062.8x106
1110 (÷15) 15x10330x10375x103150x103300x103750x1031.5x1063x106
1111 (÷16) 16x10332x10380x103160x103320x103800x1031.6x1063.2x106
Table 10-10. RTI Frequency Divide Rates for RTDEC = 0
RTR[3:0]
RTR[6:4] =
000
(OFF)
001
(210)
010
(211)
011
(212)
100
(213)
101
(214)
110
(215)
111
(216)
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
348 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The clock source for the COP is either ACLK, IRCCLK or OSCCLK depending on the setting of the
COPOSCSEL0 and COPOSCSEL1 bit (see also Table 10-6).
In Stop Mode with PSTP=1 (Pseudo Stop Mode), COPOSCSEL0=1 and COPOSCEL1=0 and PCE=1 the
COP continues to run, else the COP counter halts in Stop Mode with COPOSCSEL1 =0.
In Full Stop Mode and Pseudo Stop Mode with COPOSCSEL1=1 the COP continues to run.
Read: Anytime
Write:
1. RSBCK: Anytime in Special Mode; write to “1” but not to “0” in Normal Mode
2. WCOP, CR2, CR1, CR0:
— Anytime in Special Mode, when WRTMASK is 0, otherwise it has no effect
— Write once in Normal Mode, when WRTMASK is 0, otherwise it has no effect.
– Writing CR[2:0] to “000” has no effect, but counts for the “write once” condition.
– Writing WCOP to “0” has no effect, but counts for the “write once” condition.
When a non-zero value is loaded from Flash to CR[2:0] the COP time-out period is started.
A change of the COPOSCSEL0 or COPSOCSEL1 bit (writing a different value) or loosing UPOSC status
while COPOSCSEL1 is clear and COPOSCSEL0 is set, re-starts the COP time-out period.
In Normal Mode the COP time-out period is restarted if either of these conditions is true:
1. Writing a non-zero value to CR[2:0] (anytime in Special Mode, once in Normal Mode) with
WRTMASK = 0.
2. Writing WCOP bit (anytime in Special Mode, once in Normal Mode) with WRTMASK = 0.
3. Changing RSBCK bit from “0” to “1”.
In Special Mode, any write access to CPMUCOP register restarts the COP time-out period.
0x003C
76543210
R
WCOP RSBCK
000
CR2 CR1 CR0
W WRTMASK
Reset F 0 0 0 0 F F F
After de-assert of System Reset the values are automatically loaded from the Flash memory. See Device specification for
details.
= Unimplemented or Reserved
Figure 10-12. S12CPMU COP Control Register (CPMUCOP)
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 349
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 10-12. CPMUCOP Field Descriptions
Field Description
7
WCOP
Window COP Mode Bit — When set, a write to the CPMUARMCOP register must occur in the last 25% of the
selected period. A write during the first 75% of the selected period generates a COP reset. As long as all writes
occur during this window, $55 can be written as often as desired. Once $AA is written after the $55, the time-out
logic restarts and the user must wait until the next window before writing to CPMUARMCOP. Table 10-13 shows
the duration of this window for the seven available COP rates.
0 Normal COP operation
1 Window COP operation
6
RSBCK
COP and RTI Stop in Active BDM Mode Bit
0 Allows the COP and RTI to keep running in Active BDM mode.
1 Stops the COP and RTI counters whenever the part is in Active BDM mode.
5
WRTMASK
Write Mask for WCOP and CR[2:0] Bit — This write-only bit serves as a mask for the WCOP and CR[2:0] bits
while writing the CPMUCOP register. It is intended for BDM writing the RSBCK without changing the content of
WCOP and CR[2:0].
0 Write of WCOP and CR[2:0] has an effect with this write of CPMUCOP
1 Write of WCOP and CR[2:0] has no effect with this write of CPMUCOP.
(Does not count for “write once”.)
2–0
CR[2:0]
COP Watchdog Timer Rate Select — These bits select the COP time-out rate (see Table 10-13 and
Table 10-14). Writing a nonzero value to CR[2:0] enables the COP counter and starts the time-out period. A COP
counter time-out causes a System Reset. This can be avoided by periodically (before time-out) initializing the
COP counter via the CPMUARMCOP register.
While all of the following four conditions are true the CR[2:0], WCOP bits are ignored and the COP operates at
highest time-out period (224 cycles) in normal COP mode (Window COP mode disabled):
1) COP is enabled (CR[2:0] is not 000)
2) BDM mode active
3) RSBCK = 0
4) Operation in Special Mode
Table 10-13. COP Watchdog Rates if COPOSCSEL1=0
(default out of reset)
CR2 CR1 CR0
COPCLK
Cycles to Time-out
(COPCLK is either IRCCLK or
OSCCLK depending on the
COPOSCSEL0 bit)
0 0 0 COP disabled
001 2
14
010 2
16
011 2
18
100 2
20
101 2
22
110 2
23
111 2
24
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
350 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
10.3.2.10 Reserved Register CPMUTEST0
NOTE
This reserved register is designed for factory test purposes only, and is not
intended for general user access. Writing to this register when in Special
Mode can alter the S12CPMU’s functionality.
Read: Anytime
Write: Only in Special Mode
10.3.2.11 Reserved Register CPMUTEST1
NOTE
This reserved register is designed for factory test purposes only, and is not
intended for general user access. Writing to this register when in Special
Mode can alter the S12CPMU’s functionality.
Table 10-14. COP Watchdog Rates if COPOSCSEL1=1
CR2 CR1 CR0
COPCLK
Cycles to Time-out
(COPCLK is ACLK -
internal RC-Oscillator clock)
0 0 0 COP disabled
001 2
7
010 2
9
011 2
11
100 2
13
101 2
15
110 2
16
111 2
17
0x003D
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 10-13. Reserved Register (CPMUTEST0)
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 351
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Read: Anytime
Write: Only in Special Mode
10.3.2.12 S12CPMU COP Timer Arm/Reset Register (CPMUARMCOP)
This register is used to restart the COP time-out period.
Read: Always reads $00
Write: Anytime
When the COP is disabled (CR[2:0] = “000”) writing to this register has no effect.
When the COP is enabled by setting CR[2:0] nonzero, the following applies:
Writing any value other than $55 or $AA causes a COP reset. To restart the COP time-out period
write $55 followed by a write of $AA. These writes do not need to occur back-to-back, but the
sequence ($55, $AA) must be completed prior to COP end of time-out period to avoid a COP reset.
Sequences of $55 writes are allowed. When the WCOP bit is set, $55 and $AA writes must be done
in the last 25% of the selected time-out period; writing any value in the first 75% of the selected
period will cause a COP reset.
10.3.2.13 Low Voltage Control Register (CPMULVCTL)
The CPMULVCTL register allows the configuration of the low-voltage detect features.
0x003E
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 10-14. Reserved Register (CPMUTEST1)
0x003F
76543210
R00000000
W ARMCOP-Bit
7
ARMCOP-Bit
6
ARMCOP-Bit
5
ARMCOP-Bit
4
ARMCOP-Bit
3
ARMCOP-Bit
2
ARMCOP-Bit
1
ARMCOP-Bit
0
Reset 00000000
Figure 10-15. S12CPMU CPMUARMCOP Register
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
352 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Read: Anytime
Write: LVIE and LVIF are write anytime, LVDS is read only
10.3.2.14 Autonomous Periodical Interrupt Control Register (CPMUAPICTL)
The CPMUAPICTL register allows the configuration of the autonomous periodical interrupt features.
Read: Anytime
0x02F1
76543210
R00000LVDS
LVIE LVIF
W
Reset 00000U0U
The Reset state of LVDS and LVIF depends on the external supplied VDDA level
= Unimplemented or Reserved
Figure 10-16. Low Voltage Control Register (CPMULVCTL)
Table 10-15. CPMULVCTL Field Descriptions
Field Description
2
LVDS
Low-Voltage Detect Status Bit — This read-only status bit reflects the voltage level on VDDA. Writes have no
effect.
0 Input voltage VDDA is above level VLVID or RPM.
1 Input voltage VDDA is below level VLVIA and FPM.
1
LVIE
Low-Voltage Interrupt Enable Bit
0 Interrupt request is disabled.
1 Interrupt will be requested whenever LVIF is set.
0
LVIF
Low-Voltage Interrupt Flag — LVIF is set to 1 when LVDS status bit changes. This flag can only be cleared by
writing a 1. Writing a 0 has no effect. If enabled (LVIE = 1), LVIF causes an interrupt request.
0 No change in LVDS bit.
1 LVDS bit has changed.
0x02F2
76543210
RAPICLK 00
APIES APIEA APIFE APIE APIF
W
Reset 00000000
= Unimplemented or Reserved
Figure 10-17. Autonomous Periodical Interrupt Control Register (CPMUAPICTL)
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 353
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Write: Anytime
Figure 10-18. Waveform selected on API_EXTCLK pin (APIEA=1, APIFE=1)
Table 10-16. CPMUAPICTL Field Descriptions
Field Description
7
APICLK
Autonomous Periodical Interrupt Clock Select Bit — Selects the clock source for the API. Writable only if
APIFE = 0. APICLK cannot be changed if APIFE is set by the same write operation.
0 Autonomous Clock (ACLK) used as source.
1 Bus Clock used as source.
4
APIES
Autonomous Periodical Interrupt External Select Bit — Selects the waveform at the external pin
API_EXTCLK as shown in Figure 10-18. See device level specification for connectivity of API_EXTCLK pin.
0 If APIEA and APIFE are set, at the external pin API_EXTCLK periodic high pulses are visible at the end of
every selected period with the size of half of the minimum period (APIR=0x0000 in Table 10-20).
1 If APIEA and APIFE are set, at the external pin API_EXTCLK a clock is visible with 2 times the selected API
Period.
3
APIEA
Autonomous Periodical Interrupt External Access Enable Bit — If set, the waveform selected by bit APIES
can be accessed externally. See device level specification for connectivity.
0 Waveform selected by APIES can not be accessed externally.
1 Waveform selected by APIES can be accessed externally, if APIFE is set.
2
APIFE
Autonomous Periodical Interrupt Feature Enable Bit — Enables the API feature and starts the API timer
when set.
0 Autonomous periodical interrupt is disabled.
1 Autonomous periodical interrupt is enabled and timer starts running.
1
APIE
Autonomous Periodical Interrupt Enable Bit
0 API interrupt request is disabled.
1 API interrupt will be requested whenever APIF is set.
0
APIF
Autonomous Periodical Interrupt Flag — APIF is set to 1 when the in the API configured time has elapsed.
This flag can only be cleared by writing a 1. Writing a 0 has no effect. If enabled (APIE = 1), APIF causes an
interrupt request.
0 API time-out has not yet occurred.
1 API time-out has occurred.
APIES=0
APIES=1
API period
API min. period / 2
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
354 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
10.3.2.15 Autonomous Clock Trimming Register (CPMUACLKTR)
The CPMUACLKTR register configures the trimming of the Autonomous Clock (ACLK - trimmable
internal RC-Oscillator) which can be selected as clock source for some CPMU features.
Read: Anytime
Write: Anytime
10.3.2.16 Autonomous Periodical Interrupt Rate High and Low Register
(CPMUAPIRH / CPMUAPIRL)
The CPMUAPIRH and CPMUAPIRL registers allow the configuration of the autonomous periodical
interrupt rate.
0x02F3
76543210
RACLKTR5 ACLKTR4 ACLKTR3 ACLKTR2 ACLKTR1 ACLKTR0 00
W
Reset F F FFFF00
After de-assert of System Reset a value is automatically loaded from the Flash memory.
Figure 10-19. Autonomous Periodical Interrupt Trimming Register (CPMUACLKTR)
Table 10-17. CPMUACLKTR Field Descriptions
Field Description
7–2
ACLKTR[5:0]
Autonomous Clock Trimming Bits — See Table 10-18 for trimming effects. The ACLKTR[5:0] value
represents a signed number influencing the ACLK period time.
Table 10-18. Trimming Effect of ACLKTR
Bit Trimming Effect
ACLKTR[5] Increases period
ACLKTR[4] Decreases period less than ACLKTR[5] increased it
ACLKTR[3] Decreases period less than ACLKTR[4]
ACLKTR[2] Decreases period less than ACLKTR[3]
ACLKTR[1] Decreases period less than ACLKTR[2]
ACLKTR[0] Decreases period less than ACLKTR[1]
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 355
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Read: Anytime
Write: Anytime if APIFE=0. Else writes have no effect.
The period can be calculated as follows depending on logical value of the APICLK bit:
APICLK=0: Period = 2*(APIR[15:0] + 1) * fACLK
APICLK=1: Period = 2*(APIR[15:0] + 1) * Bus Clock period
NOTE
For APICLK bit clear the first time-out period of the API will show a latency
time between two to three fACLK cycles due to synchronous clock gate
release when the API feature gets enabled (APIFE bit set).
0x02F4
76543210
RAPIR15 APIR14 APIR13 APIR12 APIR11 APIR10 APIR9 APIR8
W
Reset 00000000
= Unimplemented or Reserved
Figure 10-20. Autonomous Periodical Interrupt Rate High Register (CPMUAPIRH)
0x02F5
76543210
RAPIR7 APIR6 APIR5 APIR4 APIR3 APIR2 APIR1 APIR0
W
Reset 00000000
Figure 10-21. Autonomous Periodical Interrupt Rate Low Register (CPMUAPIRL)
Table 10-19. CPMUAPIRH / CPMUAPIRL Field Descriptions
Field Description
15-0
APIR[15:0]
Autonomous Periodical Interrupt Rate Bits — These bits define the time-out period of the API. See
Table 10-20 for details of the effect of the autonomous periodical interrupt rate bits.
Table 10-20. Selectable Autonomous Periodical Interrupt Periods
APICLK APIR[15:0] Selected Period
0 0000 0.2 ms1
0 0001 0.4 ms1
0 0002 0.6 ms1
0 0003 0.8 ms1
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
356 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
10.3.2.17 Reserved Register CPMUTEST3
NOTE
This reserved register is designed for factory test purposes only, and is not
intended for general user access. Writing to this register when in Special
Mode can alter the S12CPMU’s functionality.
Read: Anytime
Write: Only in Special Mode
0 0004 1.0 ms1
0 0005 1.2 ms1
0 ..... .....
0 FFFD 13106.8 ms1
0 FFFE 13107.0 ms1
0 FFFF 13107.2 ms1
1 0000 2 * Bus Clock period
1 0001 4 * Bus Clock period
1 0002 6 * Bus Clock period
1 0003 8 * Bus Clock period
1 0004 10 * Bus Clock period
1 0005 12 * Bus Clock period
1 ..... .....
1 FFFD 131068 * Bus Clock period
1 FFFE 131070 * Bus Clock period
1 FFFF 131072 * Bus Clock period
1When fACLK is trimmed to 10KHz.
0x02F6
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 10-22. Reserved Register (CPMUTEST3)
Table 10-20. Selectable Autonomous Periodical Interrupt Periods (continued)
APICLK APIR[15:0] Selected Period
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 357
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
10.3.2.18 S12CPMU IRC1M Trim Registers (CPMUIRCTRIMH / CPMUIRCTRIML)
Read: Anytime
Write: Anytime if PROT=0 (CPMUPROT register). Else write has no effect
NOTE
Writes to these registers while PLLSEL=1 clears the LOCK and UPOSC
status bits.
0x02F8
15 14 13 12 11 10 9 8
R
TCTRIM[4:0]
0
IRCTRIM[9:8]
W
Reset F F F F 0 0 F F
After de-assert of System Reset a factory programmed trim value is automatically loaded from the Flash memory to
provide trimmed Internal Reference Frequency fIRC1M_TRIM.
Figure 10-23. S12CPMU IRC1M Trim High Register (CPMUIRCTRIMH)
0x02F9
76543210
R
IRCTRIM[7:0]
W
Reset F F FFFFFF
After de-assert of System Reset a factory programmed trim value is automatically loaded from the Flash memory to
provide trimmed Internal Reference Frequency fIRC1M_TRIM.
Figure 10-24. S12CPMU IRC1M Trim Low Register (CPMUIRCTRIML)
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
358 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 10-25. IRC1M Frequency Trimming Diagram
Table 10-22. CPMUIRCTRIMH/L Field Descriptions
Field Description
15-11
TCTRIM[4:0]
IRC1M temperature coefficient Trim Bits
Trim bits for the Temperature Coefficient (TC) of the IRC1M frequency.
Figure 10-26 shows the influence of the bits TCTRIM4:0] on the relationship between frequency and
temperature.
Figure 10-26 shows an approximate TC variation, relative to the nominal TC of the IRC1M (i.e. for
TCTRIM[4:0]=0x00000 or 0x10000).
9-0
IRCTRIM[9:0]
IRC1M Frequency Trim Bits — Trim bits for Internal Reference Clock
After System Reset the factory programmed trim value is automatically loaded into these registers, resulting in a
Internal Reference Frequency fIRC1M_TRIM. See device electrical characteristics for value of fIRC1M_TRIM.
The frequency trimming consists of two different trimming methods:
A rough trimming controlled by bits IRCTRIM[9:6] can be done with frequency leaps of about 6% in average.
A fine trimming controlled by the bits IRCTRIM[5:0] can be done with frequency leaps of about 0.3% (this
trimming determines the precision of the frequency setting of 0.15%, i.e. 0.3% is the distance between two
trimming values).
Figure 10-25 shows the relationship between the trim bits and the resulting IRC1M frequency.
IRCTRIM[9:0]
$000
IRCTRIM[9:6]
IRCTRIM[5:0]
IRC1M frequency (IRCCLK)
600KHz
1.5MHz
1MHz
$3FF
{
......
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 359
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 10-26. Influence of TCTRIM[4:0] on the Temperature Coefficient
NOTE
The frequency is not necessarily linear with the temperature (in most cases
it will not be). The above diagram is meant only to give the direction
(positive or negative) of the variation of the TC, relative to the nominal TC.
Setting TCTRIM[4:0] to 0x00000 or 0x10000 does not mean that the
temperature coefficient will be zero. These two combinations basically
switch off the TC compensation module, which results in the nominal TC of
the IRC1M.
TCTRIM[4:0] IRC1M indicative
relative TC variation
IRC1M indicative frequency drift
for relative TC variation
00000 0 (nominal TC of the IRC) 0%
00001 -0.27% -0.5%
00010 -0.54% -0.9%
00011 -0.81% -1.3%
00100 -1.08% -1.7%
00101 -1.35% -2.0%
00110 -1.63% -2.2%
frequency
temperature
TCTRIM[4:0] = 0x11111
TCTRIM[4:0] = 0x01111
- 40C 150C
TCTRIM[4:0] = 0x10000 or 0x00000 (nominal TC)
0x00001
0x00010
0x00011
0x00100
0x00101
...
0x01111
0x11111
...
0x10101
0x10100
0x10011
0x10010
0x10001
TC increases
TC decreases
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
360 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 10-23. TC trimming of the IRC1M frequency at ambient temperature
NOTE
Since the IRC1M frequency is not a linear function of the temperature, but
more like a parabola, the above relative variation is only an indication and
should be considered with care.
Be aware that the output frequency vary with TC trimming. A frequency
trimming correction is therefore necessary. The values provided in
Table 10-23 are typical values at ambient temperature which can vary from
device to device.
10.3.2.19 S12CPMU Oscillator Register (CPMUOSC)
This registers configures the external oscillator (XOSCLCP).
00111 -1.9% -2.5%
01000 -2.20% -3.0%
01001 -2.47% -3.4%
01010 -2.77% -3.9%
01011 -3.04 -4.3%
01100 -3.33% -4.7%
01101 -3.6% -5.1%
01110 -3.91% -5.6%
01111 -4.18% -5.9%
10000 0 (nominal TC of the IRC) 0%
10001 +0.27% +0.5%
10010 +0.54% +0.9%
10011 +0.81% +1.3%
10100 +1.07% +1.7%
10101 +1.34% +2.0%
10110 +1.59% +2.2%
10111 +1.86% +2.5%
11000 +2.11% +3.0%
11001 +2.38% +3.4%
11010 +2.62% +3.9%
11011 +2.89% +4.3%
11100 +3.12% +4.7%
11101 +3.39% +5.1%
11110 +3.62% +5.6%
11111 +3.89% +5.9%
TCTRIM[4:0] IRC1M indicative
relative TC variation
IRC1M indicative frequency drift
for relative TC variation
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 361
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Read: Anytime
Write: Anytime if PROT=0 (CPMUPROT register) and PLLSEL=1 (CPMUCLKS register). Else write has
no effect.
NOTE.
Write to this register clears the LOCK and UPOSC status bits.
10.3.2.20 S12CPMU Protection Register (CPMUPROT)
This register protects the following clock configuration registers from accidental overwrite:
0x02FA
76543210
R
OSCE Reserved
OSCPINS_E
NReserved]
W
Reset 00000000
Figure 10-27. S12CPMU Oscillator Register (CPMUOSC)
Table 10-24. CPMUOSC Field Descriptions
Field Description
7
OSCE
Oscillator Enable Bit — This bit enables the external oscillator (XOSCLCP). The UPOSC status bit in the
CPMUFLG register indicates when the oscillation is stable and OSCCLK can be selected as Bus Clock or source
of the COP or RTI. A loss of oscillation will lead to a clock monitor reset.
0 External oscillator is disabled.
REFCLK for PLL is IRCCLK.
1 External oscillator is enabled.Clock monitor is enabled.External oscillator is qualified by PLLCLK
REFCLK for PLL is the external oscillator clock divided by REFDIV.
Note: When starting up the external oscillator (either by programming OSCE bit to 1 or on exit from Full Stop
Mode with OSCE bit already 1) the software must wait for a minimum time equivalent to the startup-time
of the external oscillator tUPOSC before entering Pseudo Stop Mode.
6
Reserved
Do not alter this bit from its reset value. It is for Manufacturer use only and can change the PLL behavior.
5
OSCPINS_EN
Oscillator Pins EXTAL and XTAL Enable Bit
If OSCE=1 this read-only bit is set. It can only be cleared with the next reset.
Enabling the external oscillator reserves the EXTAL and XTAL pins exclusively for oscillator application.
0 EXTAL and XTAL pins are not reserved for oscillator.
1 EXTAL and XTAL pins exclusively reserved for oscillator.
4-0
Reserved
Do not alter these bits from their reset value. It is for Manufacturer use only and can change the PLL behavior.
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
362 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
CPMUSYNR, CPMUREFDIV, CPMUCLKS, CPMUPLL, CPMUIRCTRIMH/L and CPMUOSC
Read: Anytime
Write: Anytime
10.3.2.21 Reserved Register CPMUTEST2
NOTE
This reserved register is designed for factory test purposes only, and is not
intended for general user access. Writing to this register when in Special
Mode can alter the S12CPMU’s functionality.
Read: Anytime
Write: Only in Special Mode
0x02FB
76543210
R0000000
PROT
W
Reset 00000000
Figure 10-28. S12CPMU Protection Register (CPMUPROT)
Field Description
0
PROT
Clock Configuration Registers Protection Bit — This bit protects the clock configuration registers from
accidental overwrite (see list of affected registers above):
Writing 0x26 to the CPMUPROT register clears the PROT bit, other write accesses set the PROT bit.
0 Protection of clock configuration registers is disabled.
1 Protection of clock configuration registers is enabled. (see list of protected registers above).
0x02FC
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 10-29. Reserved Register CPMUTEST2
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 363
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
10.4 Functional Description
10.4.1 Phase Locked Loop with Internal Filter (PLL)
The PLL is used to generate a high speed PLLCLK based on a low frequency REFCLK.
The REFCLK is by default the IRCCLK which is trimmed to fIRC1M_TRIM=1MHz.
If using the oscillator (OSCE=1) REFCLK will be based on OSCCLK. For increased flexibility, OSCCLK
can be divided in a range of 1 to 16 to generate the reference frequency REFCLK using the REFDIV[3:0]
bits. Based on the SYNDIV[5:0] bits the PLL generates the VCOCLK by multiplying the reference clock
by a 2, 4, 6,... 126, 128. Based on the POSTDIV[4:0] bits the VCOCLK can be divided in a range of 1,2,
3, 4, 5, 6,... to 32 to generate the PLLCLK.
.
NOTE
Although it is possible to set the dividers to command a very high clock
frequency, do not exceed the specified bus frequency limit for the MCU.
Several examples of PLL divider settings are shown in Table 10-25. The following rules help to achieve
optimum stability and shortest lock time:
• Use lowest possible fVCO / fREF ratio (SYNDIV value).
• Use highest possible REFCLK frequency fREF.
Table 10-25. Examples of PLL Divider Settings
fosc
REFDIV[3:
0] fREF REFFRQ[1:0] SYNDIV[5:0] fVCO VCOFRQ[1:0] POSTDIV
[4:0] fPLL fbus
off $00 1MHz 00 $18 50MHz 01 $03 12.5MHz 6.25MHz
fVCO 2f
REF
×SYNDIV 1+()×=
fREF
fOSC
REFDIV 1+()
------------------------------------
=
If oscillator is enabled (OSCE=1)
If oscillator is disabled (OSCE=0) fREF fIRC1M
=
fPLL
fVCO
POSTDIV 1+()
-----------------------------------------
=
If PLL is locked (LOCK=1)
If PLL is not locked (LOCK=0) fPLL
fVCO
4
---------------
=
fbus
fPLL
2
-------------
=
If PLL is selected (PLLSEL=1)
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
364 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The phase detector inside the PLL compares the feedback clock (FBCLK = VCOCLK/(SYNDIV+1)) with
the reference clock (REFCLK = (IRC1M or OSCCLK)/(REFDIV+1)). Correction pulses are generated
based on the phase difference between the two signals. The loop filter alters the DC voltage on the internal
filter capacitor, based on the width and direction of the correction pulse, which leads to a higher or lower
VCO frequency.
The user must select the range of the REFCLK frequency (REFFRQ[1:0] bits) and the range of the
VCOCLK frequency (VCOFRQ[1:0] bits) to ensure that the correct PLL loop bandwidth is set.
The lock detector compares the frequencies of the FBCLK and the REFCLK. Therefore the speed of the
lock detector is directly proportional to the reference clock frequency. The circuit determines the lock
condition based on this comparison.
If PLL LOCK interrupt requests are enabled, the software can wait for an interrupt request and for instance
check the LOCK bit. If interrupt requests are disabled, software can poll the LOCK bit continuously
(during PLL start-up) or at periodic intervals. In either case, only when the LOCK bit is set, the VCOCLK
will have stabilized to the programmed frequency.
• The LOCK bit is a read-only indicator of the locked state of the PLL.
• The LOCK bit is set when the VCO frequency is within the tolerance ∆Lock and is cleared when
the VCO frequency is out of the tolerance ∆unl.
• Interrupt requests can occur if enabled (LOCKIE = 1) when the lock condition changes, toggling
the LOCK bit.
10.4.2 Startup from Reset
An example of startup of clock system from Reset is given in Figure 10-30.
off $00 1MHz 00 $18 50MHz 01 $00 50MHz 25MHz
4MHz $00 4MHz 01 $05 48MHz 00 $00 48MHz 24MHz
Table 10-25. Examples of PLL Divider Settings
fosc
REFDIV[3:
0] fREF REFFRQ[1:0] SYNDIV[5:0] fVCO VCOFRQ[1:0] POSTDIV
[4:0] fPLL fbus
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 365
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 10-30. Startup of clock system after Reset
10.4.3 Stop Mode using PLLCLK as Bus Clock
An example of what happens going into Stop Mode and exiting Stop Mode after an interrupt is shown in
Figure 10-31. Disable PLL Lock interrupt (LOCKIE=0) before going into Stop Mode.
Figure 10-31. Stop Mode using PLLCLK as Bus Clock
10.4.4 Full Stop Mode using Oscillator Clock as Bus Clock
An example of what happens going into Full Stop Mode and exiting Full Stop Mode after an interrupt is
shown in Figure 10-32.
System
PLLCLK
Reset
fVCORST
CPU reset state vector fetch, program execution
LOCK
POSTDIV $03 (default target fPLL=fVCO/4 = 12.5MHz)
fPLL increasing fPLL=16MHz
tlock
SYNDIV $18 (default target fVCO=50MHz)
$01
fPLL=32 MHz
example change
of POSTDIV
768 cycles
) (
PLLCLK
CPU
LOCK tlock
STOP instructionexecution interrupt continue execution
wakeup
tSTP_REC
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
366 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Disable PLL Lock interrupt (LOCKIE=0) and oscillator status change interrupt (OSCIE=0) before going
into Full Stop Mode.
Figure 10-32. Full Stop Mode using Oscillator Clock as Bus Clock
10.4.5 External Oscillator
10.4.5.1 Enabling the External Oscillator
An example of how to use the oscillator as Bus Clock is shown in Figure 10-33.
CPU
UPOSC
tlock
STOP instruction
execution interrupt continue execution
wakeup
tSTP_REC
Core
Clock
select OSCCLK as Core/Bus Clock by writing PLLSEL to “0”
PLLSEL
automatically set when going into Full Stop Mode
OSCCLK
PLLCLK
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 367
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 10-33. Enabling the External Oscillator
10.4.6 System Clock Configurations
10.4.6.1 PLL Engaged Internal Mode (PEI)
This mode is the default mode after System Reset or Power-On Reset.
The Bus clock is based on the PLLCLK, the reference clock for the PLL is internally generated (IRC1M).
The PLL is configured to 50 MHz VCOCLK with POSTDIV set to 0x03. If locked (LOCK=1) this results
in a PLLCLK of 12.5 MHz and a Bus clock of 6.25 MHz. The PLL can be re-configured to other bus
frequencies.
The clock sources for COP and RTI can be based on the internal reference clock generator (IRC1M) or the
RC-Oscillator (ACLK).
10.4.6.2 PLL Engaged External Mode (PEE)
In this mode, the Bus clock is based on the PLLCLK as well (like PEI). The reference clock for the PLL
is based on the external oscillator.
The clock sources for COP and RTI can be based on the internal reference clock generator or on the
external oscillator clock or the RC-Oscillator (ACLK).
This mode can be entered from default mode PEI by performing the following steps:
1. Configure the PLL for desired bus frequency.
2. Enable the external oscillator (OSCE bit).
3. Wait for oscillator to start-up and the PLL being locked (LOCK = 1) and (UPOSC =1).
PLLSEL
OSCE
EXTAL
OSCCLK
Core
enable external Oscillator by writing OSCE bit to one.
crystal/resonator starts oscillating
UPOSC
UPOSC flag is set upon successful start of oscillation
select OSCCLK as Core/Bus Clock by writing PLLSEL to zero
Clock
based on PLLCLK based on OSCCLK
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
368 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
4. Clear all flags in the CPMUFLG register to be able to detect any future status bit change.
5. Optionally status interrupts can be enabled (CPMUINT register).
Loosing PLL lock status (LOCK=0) means loosing the oscillator status information as well (UPOSC=0).
The impact of loosing the oscillator status (UPOSC=0) in PEE mode is as follows:
• The PLLCLK is derived from the VCO clock (with its actual frequency) divided by four until the
PLL locks again.
• The OSCCLK provided to the MSCAN module is off.
Application software needs to be prepared to deal with the impact of loosing the oscillator status at any
time.
10.4.6.3 PLL Bypassed External Mode (PBE)
In this mode, the Bus Clock is based on the external oscillator clock. The reference clock for the PLL is
based on the external oscillator.
The clock sources for COP and RTI can be based on the internal reference clock generator or on the
external oscillator clock or the RC-Oscillator (ACLK).
This mode can be entered from default mode PEI by performing the following steps:
1. Make sure the PLL configuration is valid.
2. Enable the external oscillator (OSCE bit)
3. Wait for the oscillator to start-up and the PLL being locked (LOCK = 1) and (UPOSC =1).
4. Clear all flags in the CPMUFLG register to be able to detect any status bit change.
5. Optionally status interrupts can be enabled (CPMUINT register).
6. Select the Oscillator Clock (OSCCLK) as Bus Clock (PLLSEL=0)
Loosing PLL lock status (LOCK=0) means loosing the oscillator status information as well (UPOSC=0).
The impact of loosing the oscillator status (UPOSC=0) in PBE mode is as follows:
• PLLSEL is set automatically and the Bus Clock is switched back to the PLLCLK.
• The PLLCLK is derived from the VCO clock (with its actual frequency) divided by four until the
PLL locks again.
• The OSCCLK provided to the MSCAN module is off.
Application software needs to be prepared to deal with the impact of loosing the oscillator status at any
time.
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 369
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
10.5 Resets
10.5.1 General
All reset sources are listed in Table 10-26. Refer to MCU specification for related vector addresses and
priorities.
10.5.2 Description of Reset Operation
Upon detection of any reset of Table 10-26, an internal circuit drives the RESET pin low for 512 PLLCLK
cycles. After 512 PLLCLK cycles the RESET pin is released. The reset generator of the S12CPMU waits
for additional 256 PLLCLK cycles and then samples the RESET pin to determine the originating source.
Table 10-27 shows which vector will be fetched.
NOTE
While System Reset is asserted the PLLCLK runs with the frequency
fVCORST.
Table 10-26. Reset Summary
Reset Source Local Enable
Power-On Reset (POR) None
Low Voltage Reset (LVR) None
External pin RESET None
Illegal Address Reset None
Clock Monitor Reset OSCE Bit in CPMUOSC register
COP Reset CR[2:0] in CPMUCOP register
Table 10-27. Reset Vector Selection
Sampled RESET Pin
(256 cycles after
release)
Oscillator monitor
fail pending
COP
time out
pending
Vector Fetch
1 0 0 POR
LVR
Illegal Address Reset
External pin RESET
1 1 X Clock Monitor Reset
1 0 1 COP Reset
0 X X POR
LVR
Illegal Address Reset
External pin RESET
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The internal reset of the MCU remains asserted while the reset generator completes the 768 PLLCLK
cycles long reset sequence. In case the RESET pin is externally driven low for more than these 768
PLLCLK cycles (External Reset), the internal reset remains asserted longer.
Figure 10-34. RESET Timing
10.5.2.1 Clock Monitor Reset
If the external oscillator is enabled (OSCE=1) in case of loss of oscillation or the oscillator frequency is
below the failure assert frequency fCMFA (see device electrical characteristics for values), the S12CPMU
generates a Clock Monitor Reset.In Full Stop Mode the external oscillator and the clock monitor are
disabled.
10.5.2.2 Computer Operating Properly Watchdog (COP) Reset
The COP (free running watchdog timer) enables the user to check that a program is running and
sequencing properly. When the COP is being used, software is responsible for keeping the COP from
timing out. If the COP times out it is an indication that the software is no longer being executed in the
intended sequence; thus COP reset is generated.
The clock source for the COP is either ACLK, IRCCLK or OSCCLK depending on the setting of the
COPOSCSEL0 and COPOSCSEL1 bit.
In Stop Mode with PSTP=1 (Pseudo Stop Mode), COPOSCSEL0=1 and COPOSCEL1=0 and PCE=1 the
COP continues to run, else the COP counter halts in Stop Mode with COPOSCSEL1 =0.
In Pseudo Stop Mode and Full Stop Mode with COPOSCSEL1=1 the COP continues to run.
Table 10-28.gives an overview of the COP condition (run, static) in Stop Mode depending on legal
configuration and status bit settings:
)
(
)
PLLCLK
512 cycles 256 cycles
S12_CPMU drives
possibly
RESET
driven
low
)
(
(
RESET
S12_CPMU releases
fVCORST
RESET pin low RESET pin
fVCORST
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 371
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 10-28. COP condition (run, static) in Stop Mode
Three control bits in the CPMUCOP register allow selection of seven COP time-out periods.
When COP is enabled, the program must write $55 and $AA (in this order) to the CPMUARMCOP
register during the selected time-out period. Once this is done, the COP time-out period is restarted. If the
program fails to do this and the COP times out, a COP reset is generated. Also, if any value other than $55
or $AA is written, a COP reset is generated.
Windowed COP operation is enabled by setting WCOP in the CPMUCOP register. In this mode, writes to
the CPMUARMCOP register to clear the COP timer must occur in the last 25% of the selected time-out
period. A premature write will immediately reset the part.
10.5.3 Power-On Reset (POR)
The on-chip POR circuitry detects when the internal supply VDD drops below an appropriate voltage
level. The POR is deasserted, if the internal supply VDD exceeds an appropriate voltage level (voltage
levels are not specified in this document because this internal supply is not visible on device pins).
10.5.4 Low-Voltage Reset (LVR)
The on-chip LVR circuitry detects when one of the supply voltages VDD, VDDF or VDDX drops below
an appropriate voltage level. If LVR is deasserted the MCU is fully operational at the specified maximum
speed. The LVR assert and deassert levels for the supply voltage VDDX are VLVRXA and VLVRXD and are
specified in the device Reference Manual.
COPOSCSEL1 PSTP PCE COPOSCSEL0 OSCE UPOSC COP counter behavior in Stop Mode
(clock source)
1 x x x x x Run (ACLK)
0 1 1 1 1 1 Run (OSCCLK)
0 1 1 0 0 x Static (IRCCLK)
0 1 1 0 1 x Static (IRCCLK)
0 1 0 0 x x Static (IRCCLK)
0 1 0 1 1 1 Static (OSCCLK)
0 0 1 1 1 1 Static (OSCCLK)
0 0 1 0 1 x Static (IRCCLK)
0 0 1 0 0 0 Static (IRCCLK)
0 0 0 1 1 1 Satic (OSCCLK)
0 0 0 0 1 1 Static (IRCCLK)
0 0 0 0 1 0 Static (IRCCLK)
0 0 0 0 0 0 Static (IRCCLK)
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
10.6 Interrupts
The interrupt/reset vectors requested by the S12CPMU are listed in Table 10-29. Refer to MCU
specification for related vector addresses and priorities.
10.6.1 Description of Interrupt Operation
10.6.1.1 Real Time Interrupt (RTI)
The clock source for the RTI is either IRCCLK or OSCCLK depending on the setting of the RTIOSCSEL
bit. In Stop Mode with PSTP=1 (Pseudo Stop Mode), RTIOSCSEL=1 and PRE=1 the RTI continues to
run, else the RTI counter halts in Stop Mode.
The RTI can be used to generate hardware interrupts at a fixed periodic rate. If enabled (by setting
RTIE=1), this interrupt will occur at the rate selected by the CPMURTI register. At the end of the RTI
time-out period the RTIF flag is set to one and a new RTI time-out period starts immediately.
A write to the CPMURTI register restarts the RTI time-out period.
10.6.1.2 PLL Lock Interrupt
The S12CPMU generates a PLL Lock interrupt when the lock condition (LOCK status bit) of the PLL
changes, either from a locked state to an unlocked state or vice versa. Lock interrupts are locally disabled
by setting the LOCKIE bit to zero. The PLL Lock interrupt flag (LOCKIF) is set to 1 when the lock
condition has changed, and is cleared to 0 by writing a 1 to the LOCKIF bit.
10.6.1.3 Oscillator Status Interrupt
When the OSCE bit is 0, then UPOSC stays 0. When OSCE = 1 the UPOSC bit is set after the LOCK bit
is set.
Upon detection of a status change (UPOSC) the OSCIF flag is set. Going into Full Stop Mode or disabling
the oscillator can also cause a status change of UPOSC.
Table 10-29. S12CPMU Interrupt Vectors
Interrupt Source CCR
Mask Local Enable
RTI time-out interrupt I bit CPMUINT (RTIE)
PLL lock interrupt I bit CPMUINT (LOCKIE)
Oscillator status
interrupt I bit CPMUINT (OSCIE)
Low voltage interrupt I bit CPMULVCTL (LVIE)
Autonomous
Periodical Interrupt I bit CPMUAPICTL (APIE)
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Any change in PLL configuration or any other event which causes the PLL lock status to be cleared leads
to a loss of the oscillator status information as well (UPOSC=0).
Oscillator status change interrupts are locally enabled with the OSCIE bit.
NOTE
Losing the oscillator status (UPOSC=0) affects the clock configuration of
the system1. This needs to be dealt with in application software.
10.6.1.4 Low-Voltage Interrupt (LVI)
In FPM the input voltage VDDA is monitored. Whenever VDDA drops below level VLVIA, the status bit
LVDS is set to 1. When VDDA rises above level VLVID the status bit LVDS is cleared to 0. An interrupt,
indicated by flag LVIF = 1, is triggered by any change of the status bit LVDS if interrupt enable bit
LVIE = 1.
10.6.1.5 Autonomous Periodical Interrupt (API)
The API sub-block can generate periodical interrupts independent of the clock source of the MCU. To
enable the timer, the bit APIFE needs to be set.
The API timer is either clocked by the Autonomous Clock (ACLK - trimmable internal RC oscillator) or
the Bus Clock. Timer operation will freeze when MCU clock source is selected and Bus Clock is turned
off. The clock source can be selected with bit APICLK. APICLK can only be written when APIFE is not
set.
The APIR[15:0] bits determine the interrupt period. APIR[15:0] can only be written when APIFE is
cleared. As soon as APIFE is set, the timer starts running for the period selected by APIR[15:0] bits. When
the configured time has elapsed, the flag APIF is set. An interrupt, indicated by flag APIF = 1, is triggered
if interrupt enable bit APIE = 1. The timer is re-started automatically again after it has set APIF.
The procedure to change APICLK or APIR[15:0] is first to clear APIFE, then write to APICLK or
APIR[15:0], and afterwards set APIFE.
The API Trimming bits APITR[5:0] must be set so the minimum period equals 0.2 ms if stable frequency
is desired.
See Table 10-18 for the trimming effect of APITR.
NOTE
The first period after enabling the counter by APIFE might be reduced by
API start up delay tsdel.
It is possible to generate with the API a waveform at the external pin API_EXTCLK by setting APIFE and
enabling the external access with setting APIEA.
1. For details please refer to “<st-blue>10.4.6 System Clock Configurations”
S12 Clock, Reset and Power Management Unit (S12CPMU)
MC9S12G Family Reference Manual, Rev.1.06
374 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
10.7 Initialization/Application Information
10.7.1 General Initialization information
Usually applications run in MCU Normal Mode.
It is recommended to write the CPMUCOP register in any case from the application program initialization
routine after reset no matter if the COP is used in the application or not, even if a configuration is loaded
via the flash memory after reset. By doing a “controlled” write access in MCU Normal Mode (with the
right value for the application) the write once for the COP configuration bits (WCOP,CR[2:0]) takes place
which protects these bits from further accidental change. In case of a program sequencing issue (code
runaway) the COP configuration can not be accidentally modified anymore.
10.7.2 Application information for COP and API usage
In many applications the COP is used to check that the program is running and sequencing properly.Often
the COP is kept running during Stop Mode and periodic wake-up events are needed to service the COP on
time and maybe to check the system status.
For such an application it is recommended to use the ACLK as clock source for both COP and API.This
guarantees lowest possible IDD current during Stop Mode.Additionally it eases software implementation
using the same clock source for both, COP and API.
The Interrupt Service Routine (ISR) of the Autonomous Periodic Interrupt API should contain the write
instruction to the CPMUARMCOP register. The value (byte) written is derived from the “main routine”
(alternating sequence of $55 and $AA) of the application software.
Using this method, then in the case of a runtime or program sequencing issue the application “main
routine” is not executed properly anymore and the alternating values are not provided properly.Hence the
COP is written at the correct time (due to independent API interrupt request) but the wrong value is written
(alternating sequence of $55 and $AA is no longer maintained) which causes a COP reset.
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 375
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 11
Analog-to-Digital Converter (ADC10B8CV2)
Revision History
11.1 Introduction
The ADC10B8C is a 8-channel, , multiplexed input successive approximation analog-to-digital converter.
Refer to device electrical specifications for ATD accuracy.
11.1.1 Features
• 8-, 10-bit resolution.
• Automatic return to low power after conversion sequence
• Automatic compare with interrupt for higher than or less/equal than programmable value
Version
Number
Revision
Date
Effective
Date Author Description of Changes
V02.00 13 May 2009 13 May 2009 Initial version copied from V01.05,
changed unused Bits in ATDDIEN to read logic 1
V02.01 17 Dec 2009 17 Dec 2009
Updated Table 11-15 Analog Input Channel Select Coding -
description of internal channels.
Updated register ATDDR (left/right justified result) description
in section 11.3.2.12.1/11-393 and 11.3.2.12.2/11-393 and
added Table 11-21 to improve feature description.
V02.02 09 Feb 2010 09 Feb 2010 Fixed typo in Table 11-9 - conversion result for 3mV and 10bit
resolution
V02.03 26 Feb 2010 26 Feb 2010 Corrected Table 11-15 Analog Input Channel Select Coding -
description of internal channels.
V02.04 14 Apr 2010 14 Apr 2010 Corrected typos to be in-line with SoC level pin naming
conventions for VDDA, VSSA, VRL and VRH.
V02.05 25 Aug 2010 25 Aug 2010
Removed feature of conversion during STOP and general
wording clean up done in Section 11.4, “Functional
Description
V02.06 09 Sep 2010 09 Sep 2010 Update of internal only information.
V02.07 11 Feb 2011 11 Feb 2011 Connectivity Information regarding internal channel_6 added
to Table 11-15.
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
376 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
• Programmable sample time.
• Left/right justified result data.
• External trigger control.
• Sequence complete interrupt.
• Analog input multiplexer for 8 analog input channels.
• Special conversions for VRH, VRL, (VRL+VRH)/2.
• 1-to-8 conversion sequence lengths.
• Continuous conversion mode.
• Multiple channel scans.
• Configurable external trigger functionality on any AD channel or any of four additional trigger
inputs. The four additional trigger inputs can be chip external or internal. Refer to device
specification for availability and connectivity.
• Configurable location for channel wrap around (when converting multiple channels in a sequence).
11.1.2 Modes of Operation
11.1.2.1 Conversion Modes
There is software programmable selection between performing single or continuous conversion on a
single channel or multiple channels.
11.1.2.2 MCU Operating Modes
• Stop Mode
Entering Stop Mode aborts any conversion sequence in progress and if a sequence was aborted
restarts it after exiting stop mode. This has the same effect/consequences as starting a conversion
sequence with write to ATDCTL5. So after exiting from stop mode with a previously aborted
sequence all flags are cleared etc.
•Wait Mode
ADC10B8C behaves same in Run and Wait Mode. For reduced power consumption continuous
conversions should be aborted before entering Wait mode.
•Freeze Mode
In Freeze Mode the ADC10B8C will either continue or finish or stop converting according to the
FRZ1 and FRZ0 bits. This is useful for debugging and emulation.
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 377
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
11.1.3 Block Diagram
Figure 11-1. ADC10B8C Block Diagram
VSSA
AN6
ATD_12B8C
Analog
MUX
Mode and
Successive
Approximation
Register (SAR)
Results
ATD 0
ATD 1
ATD 2
ATD 3
ATD 4
ATD 5
ATD 6
ATD 7
and DAC
Sample & Hold
VDDA
VRL
VRH
Sequence Complete
+
-
Comparator
Clock
Prescaler
Bus Clock
ATD Clock
AN5
AN4
AN3
AN1
AN0
AN7
ETRIG0
(See device specifi-
cation for availability
ETRIG1
ETRIG2
ETRIG3
and connectivity)
Timing Control
ATDDIENATDCTL1
Trigger
Mux Interrupt
Compare Interrupt
AN2
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
378 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
11.2 Signal Description
This section lists all inputs to the ADC10B8C block.
11.2.1 Detailed Signal Descriptions
11.2.1.1 ANx (x = 7, 6, 5, 4, 3, 2, 1, 0)
This pin serves as the analog input Channel x. It can also be configured as digital port or external trigger
for the ATD conversion.
11.2.1.2 ETRIG3, ETRIG2, ETRIG1, ETRIG0
These inputs can be configured to serve as an external trigger for the ATD conversion.
Refer to device specification for availability and connectivity of these inputs!
11.2.1.3 VRH, VRL
VRH is the high reference voltage, VRL is the low reference voltage for ATD conversion.
11.2.1.4 VDDA, VSSA
These pins are the power supplies for the analog circuitry of the ADC10B8C block.
11.3 Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the ADC10B8C.
11.3.1 Module Memory Map
Figure 11-2 gives an overview on all ADC10B8C registers.
NOTE
Register Address = Base Address + Address Offset, where the Base Address
is defined at the MCU level and the Address Offset is defined at the module
level.
Address Name Bit 7 6 5 4 3 2 1 Bit 0
0x0000 ATDCTL0 RReserved 000
WRAP3 WRAP2 WRAP1 WRAP0
W
0x0001 ATDCTL1 RETRIGSEL SRES1 SRES0 SMP_DIS ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0
W
0x0002 ATDCTL2 R0 AFFC Reserved ETRIGLE ETRIGP ETRIGE ASCIE ACMPIE
W
= Unimplemented or Reserved
Figure 11-2. ADC10B8C Register Summary (Sheet 1 of 2)
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 379
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x0003 ATDCTL3 RDJM S8C S4C S2C S1C FIFO FRZ1 FRZ0
W
0x0004 ATDCTL4 RSMP2 SMP1 SMP0 PRS[4:0]
W
0x0005 ATDCTL5 R0 SC SCAN MULT CD CC CB CA
W
0x0006 ATDSTAT0 RSCF 0ETORF FIFOR CC3 CC2 CC1 CC0
W
0x0007 Unimple-
mented
R0 000 0 0 0 0
W
0x0008 ATDCMPEH R0 000 0 0 0 0
W
0x0009 ATDCMPEL RCMPE[7:0]
W
0x000A ATDSTAT2H R0 000 0 0 0 0
W
0x000B ATDSTAT2L R CCF[7:0]
W
0x000C ATDDIENH R1 111 1 1 1 1
W
0x000D ATDDIENL RIEN[7:0]
W
0x000E ATDCMPHTH R0 000 0 0 0 0
W
0x000F ATDCMPHTL RCMPHT[7:0]
W
0x0010 ATDDR0 RSee Section 11.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 11.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0012 ATDDR1 RSee Section 11.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 11.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0014 ATDDR2 RSee Section 11.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 11.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0016 ATDDR3 RSee Section 11.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 11.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0018 ATDDR4 RSee Section 11.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 11.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x001A ATDDR5 RSee Section 11.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 11.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x001C ATDDR6 RSee Section 11.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 11.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x001E ATDDR7 RSee Section 11.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 11.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0020 -
0x002F
Unimple-
mented
R00000000
W
Address Name Bit 7 6 5 4 3 2 1 Bit 0
= Unimplemented or Reserved
Figure 11-2. ADC10B8C Register Summary (Sheet 2 of 2)
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
380 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
11.3.2 Register Descriptions
This section describes in address order all the ADC10B8C registers and their individual bits.
11.3.2.1 ATD Control Register 0 (ATDCTL0)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime, in special modes always write 0 to Reserved Bit 7.
Module Base + 0x0000
76543210
RReserved 000
WRAP3 WRAP2 WRAP1 WRAP0
W
Reset 0 0 0 01111
= Unimplemented or Reserved
Figure 11-3. ATD Control Register 0 (ATDCTL0)
Table 11-1. ATDCTL0 Field Descriptions
Field Description
3-0
WRAP[3-0]
Wrap Around Channel Select Bits — These bits determine the channel for wrap around when doing
multi-channel conversions. The coding is summarized in Table 11-2.
Table 11-2. Multi-Channel Wrap Around Coding
WRAP3 WRAP2 WRAP1 WRAP0 Multiple Channel Conversions (MULT = 1)
Wraparound to AN0 after Converting
0000 Reserved1
0001 AN1
0010 AN2
0011 AN3
0100 AN4
0101 AN5
0110 AN6
0111 AN7
1000 AN7
1001 AN7
1010 AN7
1011 AN7
1100 AN7
1101 AN7
1110 AN7
1111 AN7
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 381
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
11.3.2.2 ATD Control Register 1 (ATDCTL1)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
1If only AN0 should be converted use MULT=0.
Module Base + 0x0001
76543210
R
ETRIGSEL SRES1 SRES0 SMP_DIS ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0
W
Reset 0 0 1 01111
Figure 11-4. ATD Control Register 1 (ATDCTL1)
Table 11-3. ATDCTL1 Field Descriptions
Field Description
7
ETRIGSEL
External Trigger Source Select — This bit selects the external trigger source to be either one of the AD
channels or one of the ETRIG3-0 inputs. See device specification for availability and connectivity of ETRIG3-0
inputs. If a particular ETRIG3-0 input option is not available, writing a 1 to ETRISEL only sets the bit but has
no effect, this means that one of the AD channels (selected by ETRIGCH3-0) is configured as the source for
external trigger. The coding is summarized in Table 11-5.
6–5
SRES[1:0]
A/D Resolution Select — These bits select the resolution of A/D conversion results. See Table 11-4 for
coding.
4
SMP_DIS
Discharge Before Sampling Bit
0 No discharge before sampling.
1 The internal sample capacitor is discharged before sampling the channel. This adds 2 ATD clock cycles to
the sampling time. This can help to detect an open circuit instead of measuring the previous sampled
channel.
3–0
ETRIGCH[3:0]
External Trigger Channel Select — These bits select one of the AD channels or one of the ETRIG3-0 inputs
as source for the external trigger. The coding is summarized in Table 11-5.
Table 11-4. A/D Resolution Coding
SRES1 SRES0 A/D Resolution
0 0 8-bit data
0 1 10-bit data
10
1 1 Reserved
Table 11-5. External Trigger Channel Select Coding
ETRIGSEL ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0 External trigger source is
0 0 0 0 0 AN0
0 0 0 0 1 AN1
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
382 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
11.3.2.3 ATD Control Register 2 (ATDCTL2)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
0 0 0 1 0 AN2
0 0 0 1 1 AN3
0 0 1 0 0 AN4
0 0 1 0 1 AN5
0 0 1 1 0 AN6
0 0 1 1 1 AN7
0 1 0 0 0 AN7
0 1 0 0 1 AN7
0 1 0 1 0 AN7
0 1 0 1 1 AN7
0 1 1 0 0 AN7
0 1 1 0 1 AN7
0 1 1 1 0 AN7
0 1 1 1 1 AN7
1 0 0 0 0 ETRIG01
1 0 0 0 1 ETRIG11
1 0 0 1 0 ETRIG21
1 0 0 1 1 ETRIG31
1 0 1 X X Reserved
1 1 X X X Reserved
1Only if ETRIG3-0 input option is available (see device specification), else ETRISEL is ignored, that means
external trigger source is still on one of the AD channels selected by ETRIGCH3-0
Module Base + 0x0002
76543210
R0
AFFC Reserved ETRIGLE ETRIGP ETRIGE ASCIE ACMPIE
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 11-5. ATD Control Register 2 (ATDCTL2)
Table 11-5. External Trigger Channel Select Coding
ETRIGSEL ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0 External trigger source is
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 383
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
11.3.2.4 ATD Control Register 3 (ATDCTL3)
Writes to this register will abort current conversion sequence.
Table 11-6. ATDCTL2 Field Descriptions
Field Description
6
AFFC
ATD Fast Flag Clear All
0 ATD flag clearing done by write 1 to respective CCF[n] flag.
1 Changes all ATD conversion complete flags to a fast clear sequence.
For compare disabled (CMPE[n]=0) a read access to the result register will cause the associated CCF[n] flag
to clear automatically.
For compare enabled (CMPE[n]=1) a write access to the result register will cause the associated CCF[n] flag
to clear automatically.
5
Reserved
Do not alter this bit from its reset value.It is for Manufacturer use only and can change the ATD behavior.
4
ETRIGLE
External Trigger Level/Edge Control — This bit controls the sensitivity of the external trigger signal. See
Table 11-7 for details.
3
ETRIGP
External Trigger Polarity — This bit controls the polarity of the external trigger signal. See Table 11-7 for details.
2
ETRIGE
External Trigger Mode Enable — This bit enables the external trigger on one of the AD channels or one of the
ETRIG3-0 inputs as described in Table 11-5. If the external trigger source is one of the AD channels, the digital
input buffer of this channel is enabled. The external trigger allows to synchronize the start of conversion with
external events.
0 Disable external trigger
1 Enable external trigger
1
ASCIE
ATD Sequence Complete Interrupt Enable
0 ATD Sequence Complete interrupt requests are disabled.
1 ATD Sequence Complete interrupt will be requested whenever SCF=1 is set.
0
ACMPIE
ATD Compare Interrupt Enable — If automatic compare is enabled for conversion n(CMPE[n]=1 in ATDCMPE
register) this bit enables the compare interrupt. If the CCF[n] flag is set (showing a successful compare for
conversion n), the compare interrupt is triggered.
0 ATD Compare interrupt requests are disabled.
1 For the conversions in a sequence for which automatic compare is enabled (CMPE[n]=1), an ATD Compare
Interrupt will be requested whenever any of the respective CCF flags is set.
Table 11-7. External Trigger Configurations
ETRIGLE ETRIGP External Trigger Sensitivity
0 0 Falling edge
0 1 Rising edge
1 0 Low level
1 1 High level
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Read: Anytime
Write: Anytime
Module Base + 0x0003
76543210
R
DJM S8C S4C S2C S1C FIFO FRZ1 FRZ0
W
Reset 0 0 1 00000
= Unimplemented or Reserved
Figure 11-6. ATD Control Register 3 (ATDCTL3)
Table 11-8. ATDCTL3 Field Descriptions
Field Description
7
DJM
Result Register Data Justification — Result data format is always unsigned. This bit controls justification of
conversion data in the result registers.
0 Left justified data in the result registers.
1 Right justified data in the result registers.
Table 11-9 gives example ATD results for an input signal range between 0 and 5.12 Volts.
6–3
S8C, S4C,
S2C, S1C
Conversion Sequence Length — These bits control the number of conversions per sequence. Table 11-10
shows all combinations. At reset, S4C is set to 1 (sequence length is 4). This is to maintain software continuity
to HC12 family.
2
FIFO
Result Register FIFO Mode — If this bit is zero (non-FIFO mode), the A/D conversion results map into the result
registers based on the conversion sequence; the result of the first conversion appears in the first result register
(ATDDR0), the second result in the second result register (ATDDR1), and so on.
If this bit is one (FIFO mode) the conversion counter is not reset at the beginning or end of a conversion
sequence; sequential conversion results are placed in consecutive result registers. In a continuously scanning
conversion sequence, the result register counter will wrap around when it reaches the end of the result register
file. The conversion counter value (CC3-0 in ATDSTAT0) can be used to determine where in the result register
file, the current conversion result will be placed.
Aborting a conversion or starting a new conversion clears the conversion counter even if FIFO=1. So the first
result of a new conversion sequence, started by writing to ATDCTL5, will always be place in the first result register
(ATDDDR0). Intended usage of FIFO mode is continuos conversion (SCAN=1) or triggered conversion
(ETRIG=1).
Which result registers hold valid data can be tracked using the conversion complete flags. Fast flag clear mode
may be useful in a particular application to track valid data.
If this bit is one, automatic compare of result registers is always disabled, that is ADC10B8C will behave as if
ACMPIE and all CPME[n] were zero.
0 Conversion results are placed in the corresponding result register up to the selected sequence length.
1 Conversion results are placed in consecutive result registers (wrap around at end).
1–0
FRZ[1:0]
Background Debug Freeze Enable — When debugging an application, it is useful in many cases to have the
ATD pause when a breakpoint (Freeze Mode) is encountered. These 2 bits determine how the ATD will respond
to a breakpoint as shown in Table 11-11. Leakage onto the storage node and comparator reference capacitors
may compromise the accuracy of an immediately frozen conversion depending on the length of the freeze period.
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 385
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 11-9. Examples of ideal decimal ATD Results
Input Signal
VRL = 0 Volts
VRH = 5.12 Volts
8-Bit
Codes
(resolution=20mV)
10-Bit
Codes
(resolution=5mV)
5.120 Volts
...
0.022
0.020
0.018
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.003
0.002
0.000
255
...
1
1
1
1
1
1
1
0
0
0
0
0
0
1023
...
4
4
4
3
3
2
2
2
1
1
1
0
0
Table 11-10. Conversion Sequence Length Coding
S8C S4C S2C S1C Number of Conversions
per Sequence
00 0 0 8
00 0 1 1
00 1 0 2
00 1 1 3
01 0 0 4
01 0 1 5
01 1 0 6
01 1 1 7
10 0 0 8
10 0 1 8
10 1 0 8
10 1 1 8
11 0 0 8
11 0 1 8
11 1 0 8
11 1 1 8
Table 11-11. ATD Behavior in Freeze Mode (Breakpoint)
FRZ1 FRZ0 Behavior in Freeze Mode
0 0 Continue conversion
0 1 Reserved
1 0 Finish current conversion, then freeze
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
386 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
11.3.2.5 ATD Control Register 4 (ATDCTL4)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
1 1 Freeze Immediately
Module Base + 0x0004
76543210
R
SMP2 SMP1 SMP0 PRS[4:0]
W
Reset 0 0 0 00101
Figure 11-7. ATD Control Register 4 (ATDCTL4)
Table 11-12. ATDCTL4 Field Descriptions
Field Description
7–5
SMP[2:0]
Sample Time Select — These three bits select the length of the sample time in units of ATD conversion clock
cycles. Note that the ATD conversion clock period is itself a function of the prescaler value (bits PRS4-0).
Table 11-13 lists the available sample time lengths.
4–0
PRS[4:0]
ATD Clock Prescaler — These 5 bits are the binary prescaler value PRS. The ATD conversion clock frequency
is calculated as follows:
Refer to Device Specification for allowed frequency range of fATDCLK.
Table 11-13. Sample Time Select
SMP2 SMP1 SMP0
Sample Time
in Number of
ATD Clock Cycles
000 4
001 6
010 8
011 10
100 12
101 16
110 20
111 24
Table 11-11. ATD Behavior in Freeze Mode (Breakpoint)
FRZ1 FRZ0 Behavior in Freeze Mode
fATDCLK
fBUS
2 PRS 1+()×
-------------------------------------=
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 387
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
11.3.2.6 ATD Control Register 5 (ATDCTL5)
Writes to this register will abort current conversion sequence and start a new conversion sequence. If the
external trigger function is enabled (ETRIGE=1) an initial write to ATDCTL5 is required to allow starting
of a conversion sequence which will then occur on each trigger event. Start of conversion means the
beginning of the sampling phase.
Read: Anytime
Write: Anytime
Module Base + 0x0005
76543210
R0
SC SCAN MULT CD CC CB CA
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 11-8. ATD Control Register 5 (ATDCTL5)
Table 11-14. ATDCTL5 Field Descriptions
Field Description
6
SC
Special Channel Conversion Bit — If this bit is set, then special channel conversion can be selected using CD,
CC, CB and CA of ATDCTL5. Table 11-15 lists the coding.
0 Special channel conversions disabled
1 Special channel conversions enabled
5
SCAN
Continuous Conversion Sequence Mode — This bit selects whether conversion sequences are performed
continuously or only once. If the external trigger function is enabled (ETRIGE=1) setting this bit has no effect,
thus the external trigger always starts a single conversion sequence.
0 Single conversion sequence
1 Continuous conversion sequences (scan mode)
4
MULT
Multi-Channel Sample Mode — When MULT is 0, the ATD sequence controller samples only from the specified
analog input channel for an entire conversion sequence. The analog channel is selected by channel selection
code (control bits CD/CC/CB/CA located in ATDCTL5). When MULT is 1, the ATD sequence controller samples
across channels. The number of channels sampled is determined by the sequence length value (S8C, S4C, S2C,
S1C). The first analog channel examined is determined by channel selection code (CD, CC, CB, CA control bits);
subsequent channels sampled in the sequence are determined by incrementing the channel selection code or
wrapping around to AN0 (channel 0).
0 Sample only one channel
1 Sample across several channels
3–0
CD, CC,
CB, CA
Analog Input Channel Select Code — These bits select the analog input channel(s). Table 11-15 lists the
coding used to select the various analog input channels.
In the case of single channel conversions (MULT=0), this selection code specifies the channel to be examined.
In the case of multiple channel conversions (MULT=1), this selection code specifies the first channel to be
examined in the conversion sequence. Subsequent channels are determined by incrementing the channel
selection code or wrapping around to AN0 (after converting the channel defined by the Wrap Around Channel
Select Bits WRAP3-0 in ATDCTL0). When starting with a channel number higher than the one defined by
WRAP3-0 the first wrap around will be AN7 to AN0.
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
388 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
11.3.2.7 ATD Status Register 0 (ATDSTAT0)
This register contains the Sequence Complete Flag, overrun flags for external trigger and FIFO mode, and
the conversion counter.
Table 11-15. Analog Input Channel Select Coding
SC CD CC CB CA Analog Input
Channel
00000 AN0
0001 AN1
0010 AN2
0011 AN3
0100 AN4
0101 AN5
0110 AN6
0111 AN7
1000 AN7
1001 AN7
1010 AN7
1011 AN7
1100 AN7
1101 AN7
1110 AN7
1111 AN7
1 0 0 0 0 Internal_6,
0 0 0 1 Internal_7
0 0 1 0 Internal_0
0 0 1 1 Internal_1
0100 VRH
0101 VRL
0 1 1 0 (VRH+VRL) / 2
0 1 1 1 Reserved
1 0 0 0 Internal_2
1 0 0 1 Internal_3
1 0 1 0 Internal_4
1 0 1 1 Internal_5
1 1 X X Reserved
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 389
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Read: Anytime
Write: Anytime (No effect on (CC3, CC2, CC1, CC0))
Module Base + 0x0006
76543210
R
SCF
0
ETORF FIFOR
CC3 CC2 CC1 CC0
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 11-9. ATD Status Register 0 (ATDSTAT0)
Table 11-16. ATDSTAT0 Field Descriptions
Field Description
7
SCF
Sequence Complete Flag — This flag is set upon completion of a conversion sequence. If conversion
sequences are continuously performed (SCAN=1), the flag is set after each one is completed. This flag is cleared
when one of the following occurs:
A) Write “1” to SCF
B) Write to ATDCTL5 (a new conversion sequence is started)
C) If AFFC=1 and a result register is read
0 Conversion sequence not completed
1 Conversion sequence has completed
5
ETORF
External Trigger Overrun Flag — While in edge sensitive mode (ETRIGLE=0), if additional active edges are
detected while a conversion sequence is in process the overrun flag is set. This flag is cleared when one of the
following occurs:
A) Write “1” to ETORF
B) Write to ATDCTL0,1,2,3,4, ATDCMPE or ATDCMPHT (a conversion sequence is aborted)
C) Write to ATDCTL5 (a new conversion sequence is started)
0 No External trigger overrun error has occurred
1 External trigger overrun error has occurred
4
FIFOR
Result Register Overrun Flag — This bit indicates that a result register has been written to before its associated
conversion complete flag (CCF) has been cleared. This flag is most useful when using the FIFO mode because
the flag potentially indicates that result registers are out of sync with the input channels. However, it is also
practical for non-FIFO modes, and indicates that a result register has been overwritten before it has been read
(i.e. the old data has been lost). This flag is cleared when one of the following occurs:
A) Write “1” to FIFOR
B) Write to ATDCTL0,1,2,3,4, ATDCMPE or ATDCMPHT (a conversion sequence is aborted)
C) Write to ATDCTL5 (a new conversion sequence is started)
0 No overrun has occurred
1 Overrun condition exists (result register has been written while associated CCFx flag was still set)
3–0
CC[3:0]
Conversion Counter — These 4 read-only bits are the binary value of the conversion counter. The conversion
counter points to the result register that will receive the result of the current conversion. E.g. CC3=0, CC2=1,
CC1=1, CC0=0 indicates that the result of the current conversion will be in ATD Result Register 6. If in non-FIFO
mode (FIFO=0) the conversion counter is initialized to zero at the beginning and end of the conversion sequence.
If in FIFO mode (FIFO=1) the register counter is not initialized. The conversion counter wraps around when its
maximum value is reached.
Aborting a conversion or starting a new conversion clears the conversion counter even if FIFO=1.
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
390 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
11.3.2.8 ATD Compare Enable Register (ATDCMPE)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
11.3.2.9 ATD Status Register 2 (ATDSTAT2)
This read-only register contains the Conversion Complete Flags CCF[7:0].
Read: Anytime
Write: Anytime, no effect
Module Base + 0x0008
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R 0 0 0 0 0 000 CMPE[7:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 11-10. ATD Compare Enable Register (ATDCMPE)
Table 11-17. ATDCMPE Field Descriptions
Field Description
7–0
CMPE[7:0]
Compare Enable for Conversion Number n(n= 7, 6, 5, 4, 3, 2, 1, 0) of a Sequence (n conversion number,
NOT channel number!) — These bits enable automatic compare of conversion results individually for
conversions of a sequence. The sense of each comparison is determined by the CMPHT[n] bit in the ATDCMPHT
register.
For each conversion number with CMPE[n]=1 do the following:
1) Write compare value to ATDDRnresult register
2) Write compare operator with CMPHT[n] in ATDCPMHT register
CCF[n] in ATDSTAT2 register will flag individual success of any comparison.
0 No automatic compare
1 Automatic compare of results for conversion n of a sequence is enabled.
Module Base + 0x000A
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R 0 0 0 0 0 0 0 0 CCF[7:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 11-11. ATD Status Register 2 (ATDSTAT2)
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 391
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
11.3.2.10 ATD Input Enable Register (ATDDIEN)
Read: Anytime
Write: Anytime
Table 11-18. ATDSTAT2 Field Descriptions
Field Description
7–0
CCF[7:0]
Conversion Complete Flag n (n= 7, 6, 5, 4, 3, 2, 1, 0) (n conversion number, NOT channel number!)— A
conversion complete flag is set at the end of each conversion in a sequence. The flags are associated with the
conversion position in a sequence (and also the result register number). Therefore in non-fifo mode, CCF[4] is
set when the fifth conversion in a sequence is complete and the result is available in result register ATDDR4;
CCF[5] is set when the sixth conversion in a sequence is complete and the result is available in ATDDR5, and
so forth.
If automatic compare of conversion results is enabled (CMPE[n]=1 in ATDCMPE), the conversion complete flag
is only set if comparison with ATDDRnis true. If ACMPIE=1 a compare interrupt will be requested. In this case,
as the ATDDRnresult register is used to hold the compare value, the result will not be stored there at the end of
the conversion but is lost.
A flag CCF[n] is cleared when one of the following occurs:
A) Write to ATDCTL5 (a new conversion sequence is started)
B) If AFFC=0, write “1” to CCF[n]
C) If AFFC=1 and CMPE[n]=0, read of result register ATDDRn
D) If AFFC=1 and CMPE[n]=1, write to result register ATDDRn
In case of a concurrent set and clear on CCF[n]: The clearing by method A) will overwrite the set. The clearing
by methods B) or C) or D) will be overwritten by the set.
0 Conversion number n not completed or successfully compared
1 If (CMPE[n]=0): Conversion number n has completed. Result is ready in ATDDRn.
If (CMPE[n]=1): Compare for conversion result number n with compare value in ATDDRn, using compare
operator CMPGT[n] is true. (No result available in ATDDRn)
Module Base + 0x000C
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R 1 1 1 1 1 111 IEN[7:0]
W
Reset 1 1 1 1 1 1 1 1 0 0000000
= Unimplemented or Reserved
Figure 11-12. ATD Input Enable Register (ATDDIEN)
Table 11-19. ATDDIEN Field Descriptions
Field Description
7–0
IEN[7:0]
ATD Digital Input Enable on channel x(x=7,6,5,4,3,2,1,0)— This bit controls the digital input buffer from
the analog input pin (ANx) to the digital data register.
0 Disable digital input buffer to ANx pin
1 Enable digital input buffer on ANx pin.
Note: Setting this bit will enable the corresponding digital input buffer continuously. If this bit is set while
simultaneously using it as an analog port, there is potentially increased power consumption because the
digital input buffer maybe in the linear region.
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
392 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
11.3.2.11 ATD Compare Higher Than Register (ATDCMPHT)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
11.3.2.12 ATD Conversion Result Registers (ATDDRn)
The A/D conversion results are stored in 8 result registers. Results are always in unsigned data
representation. Left and right justification is selected using the DJM control bit in ATDCTL3.
If automatic compare of conversions results is enabled (CMPE[n]=1 in ATDCMPE), these registers must
be written with the compare values in left or right justified format depending on the actual value of the
DJM bit. In this case, as the ATDDRn register is used to hold the compare value, the result will not be
stored there at the end of the conversion but is lost.
Attention, n is the conversion number, NOT the channel number!
Read: Anytime
Write: Anytime
NOTE
For conversions not using automatic compare, results are stored in the result
registers after each conversion. In this case avoid writing to ATDDRn except
for initial values, because an A/D result might be overwritten.
Module Base + 0x000E
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R 0 0 0 0 0 000 CMPHT[7:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 11-13. ATD Compare Higher Than Register (ATDCMPHT)
Table 11-20. ATDCMPHT Field Descriptions
Field Description
7–0
CMPHT[7:0]
Compare Operation Higher Than Enable for conversion number n(n= 7, 6, 5, 4, 3, 2, 1, 0) of a Sequence
(n conversion number, NOT channel number!) — This bit selects the operator for comparison of conversion
results.
0 If result of conversion n is lower or same than compare value in ATDDRn, this is flagged in ATDSTAT2
1 If result of conversion n is higher than compare value in ATDDRn, this is flagged in ATDSTAT2
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 393
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
11.3.2.12.1 Left Justified Result Data (DJM=0)
Table 11-21 shows how depending on the A/D resolution the conversion result is transferred to the ATD
result registers for left justified data. Compare is always done using all 12 bits of both the conversion result
and the compare value in ATDDRn.
11.3.2.12.2 Right Justified Result Data (DJM=1)
Table 11-22 shows how depending on the A/D resolution the conversion result is transferred to the ATD
result registers for right justified data. Compare is always done using all 12 bits of both the conversion
result and the compare value in ATDDRn.
Module Base +
0x0010 = ATDDR0, 0x0012 = ATDDR1, 0x0014 = ATDDR2, 0x0016 = ATDDR3
0x0018 = ATDDR4, 0x001A = ATDDR5, 0x001C = ATDDR6, 0x001E = ATDDR7
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
RResult-Bit[11:0] 0000
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 11-14. Left justified ATD conversion result register (ATDDRn)
Table 11-21. Conversion result mapping to ATDDRn
A/D
resolution DJM conversion result mapping to ATDDRn
8-bit data 0 Result-Bit[11:4] = conversion result,
Result-Bit[3:0]=0000
10-bit data 0 Result-Bit[11:2] = conversion result,
Result-Bit[1:0]=00
Module Base +
0x0010 = ATDDR0, 0x0012 = ATDDR1, 0x0014 = ATDDR2, 0x0016 = ATDDR3
0x0018 = ATDDR4, 0x001A = ATDDR5, 0x001C = ATDDR6, 0x001E = ATDDR7
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R 0 000 Result-Bit[11:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 11-15. Right justified ATD conversion result register (ATDDRn)
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
394 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
11.4 Functional Description
The ADC10B8C consists of an analog sub-block and a digital sub-block.
11.4.1 Analog Sub-Block
The analog sub-block contains all analog electronics required to perform a single conversion. Separate
power supplies VDDA and VSSA allow to isolate noise of other MCU circuitry from the analog sub-block.
11.4.1.1 Sample and Hold Machine
The Sample and Hold Machine controls the storage and charge of the sample capacitor to the voltage level
of the analog signal at the selected ADC input channel.
During the sample process the analog input connects directly to the storage node.
The input analog signals are unipolar and must be within the potential range of VSSA to VDDA.
During the hold process the analog input is disconnected from the storage node.
11.4.1.2 Analog Input Multiplexer
The analog input multiplexer connects one of the 8 external analog input channels to the sample and hold
machine.
11.4.1.3 Analog-to-Digital (A/D) Machine
The A/D Machine performs analog to digital conversions. The resolution is program selectable to be either
8 or 10 bits. The A/D machine uses a successive approximation architecture. It functions by comparing the
sampled and stored analog voltage with a series of binary coded discrete voltages.
By following a binary search algorithm, the A/D machine identifies the discrete voltage that is nearest to
the sampled and stored voltage.
When not converting the A/D machine is automatically powered down.
Table 11-22. Conversion result mapping to ATDDRn
A/D
resolution DJM conversion result mapping to ATDDRn
8-bit data 1 Result-Bit[7:0] = result,
Result-Bit[11:8]=0000
10-bit data 1 Result-Bit[9:0] = result,
Result-Bit[11:10]=00
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 395
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Only analog input signals within the potential range of VRL to VRH (A/D reference potentials) will result
in a non-railed digital output code.
11.4.2 Digital Sub-Block
This subsection describes some of the digital features in more detail. See Section 11.3.2, “Register
Descriptions” for all details.
11.4.2.1 External Trigger Input
The external trigger feature allows the user to synchronize ATD conversions to an external event rather
than relying only on software to trigger the ATD module when a conversion is about to take place. The
external trigger signal (out of reset ATD channel 7, configurable in ATDCTL1) is programmable to be edge
or level sensitive with polarity control. Table 11-23 gives a brief description of the different combinations
of control bits and their effect on the external trigger function.
In either level or edge sensitive mode, the first conversion begins when the trigger is received.
Once ETRIGE is enabled a conversion must be triggered externally after writing the ATDCTL5 register.
During a conversion in edge sensitive mode, if additional trigger events are detected the overrun error flag
ETORF is set.
If level sensitive mode is active and the external trigger de-asserts and later asserts again during a
conversion sequence, this does not constitute an overrun. Therefore, the flag is not set. If the trigger is left
active in level sensitive mode when a sequence is about to complete, another sequence will be triggered
immediately.
Table 11-23. External Trigger Control Bits
ETRIGLE ETRIGP ETRIGE SCAN Description
X X 0 0 Ignores external trigger. Performs one
conversion sequence and stops.
X X 0 1 Ignores external trigger. Performs
continuous conversion sequences.
0 0 1 X Trigger falling edge sensitive. Performs
one conversion sequence per trigger.
0 1 1 X Trigger rising edge sensitive. Performs one
conversion sequence per trigger.
1 0 1 X Trigger low level sensitive. Performs
continuous conversions while trigger level
is active.
1 1 1 X Trigger high level sensitive. Performs
continuous conversions while trigger level
is active.
Analog-to-Digital Converter (ADC10B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
396 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
11.4.2.2 General-Purpose Digital Port Operation
Each ATD input pin can be switched between analog or digital input functionality. An analog multiplexer
makes each ATD input pin selected as analog input available to the A/D converter.
The pad of the ATD input pin is always connected to the analog input channel of the analog mulitplexer.
Each pad input signal is buffered to the digital port register.
This buffer can be turned on or off with the ATDDIEN register for each ATD input pin.
This is important so that the buffer does not draw excess current when an ATD input pin is selected as
analog input to the ADC10B8C.
11.5 Resets
At reset the ADC10B8C is in a power down state. The reset state of each individual bit is listed within the
Register Description section (see Section 11.3.2, “Register Descriptions”) which details the registers and
their bit-field.
11.6 Interrupts
The interrupts requested by the ADC10B8C are listed in Table 11-24. Refer to MCU specification for
related vector address and priority.
See Section 11.3.2, “Register Descriptions” for further details.
Table 11-24. ATD Interrupt Vectors
Interrupt Source CCR
Mask Local Enable
Sequence Complete Interrupt I bit ASCIE in ATDCTL2
Compare Interrupt I bit ACMPIE in ATDCTL2
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 397
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 12
Analog-to-Digital Converter (ADC10B12CV2)
Revision History
12.1 Introduction
The ADC10B12C is a 12-channel, , multiplexed input successive approximation analog-to-digital
converter. Refer to device electrical specifications for ATD accuracy.
12.1.1 Features
• 8-, 10-bit resolution.
Version
Number
Revision
Date
Effective
Date Author Description of Changes
V02.00 13 May 2009 13 May 2009 Initial version copied from V01.06,
changed unused Bits in ATDDIEN to read logic 1
V02.01 30.Nov 2009 30.Nov 2009
Updated Table 12-15 Analog Input Channel Select Coding -
description of internal channels.
Updated register ATDDR (left/right justified result) description
in section 12.3.2.12.1/12-415 and 12.3.2.12.2/12-416 and
added table Table 12-21 to improve feature description.
V02.02 09 Feb 2010 09 Feb 2010 Fixed typo in Table 12-9- conversion result for 3mV and 10bit
resolution
V02.03 26 Feb 2010 26 Feb 2010 Corrected Table 12-15 Analog Input Channel Select Coding -
description of internal channels.
V02.04 14 Apr 2010 14 Apr 2010 Corrected typos to be in-line with SoC level pin naming
conventions for VDDA, VSSA, VRL and VRH.
V02.05 25 Aug 2010 25 Aug 2010
Removed feature of conversion during STOP and general
wording clean up done in Section 12.4, “Functional
Description
V02.06 09 Sep 2010 09 Sep 2010 Update of internal only information.
V02.07 11 Feb 2011 11 Feb 2011 Connectivity Information regarding internal channel_6 added
to Table 12-15.
V02.08 29 Mar 2011 29 Mar 2011
Fixed typo in bit description field Table 12-14 for bits CD, CC,
CB, CA. Last sentence contained a wrong highest channel
number (it is not AN7 to AN0 instead it is AN11 to AN0).
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
398 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
• Automatic return to low power after conversion sequence
• Automatic compare with interrupt for higher than or less/equal than programmable value
• Programmable sample time.
• Left/right justified result data.
• External trigger control.
• Sequence complete interrupt.
• Analog input multiplexer for 8 analog input channels.
• Special conversions for VRH, VRL, (VRL+VRH)/2.
• 1-to-12 conversion sequence lengths.
• Continuous conversion mode.
• Multiple channel scans.
• Configurable external trigger functionality on any AD channel or any of four additional trigger
inputs. The four additional trigger inputs can be chip external or internal. Refer to device
specification for availability and connectivity.
• Configurable location for channel wrap around (when converting multiple channels in a sequence).
12.1.2 Modes of Operation
12.1.2.1 Conversion Modes
There is software programmable selection between performing single or continuous conversion on a
single channel or multiple channels.
12.1.2.2 MCU Operating Modes
• Stop Mode
Entering Stop Mode aborts any conversion sequence in progress and if a sequence was aborted
restarts it after exiting stop mode. This has the same effect/consequences as starting a conversion
sequence with write to ATDCTL5. So after exiting from stop mode with a previously aborted
sequence all flags are cleared etc.
•Wait Mode
ADC10B12C behaves same in Run and Wait Mode. For reduced power consumption continuous
conversions should be aborted before entering Wait mode.
•Freeze Mode
In Freeze Mode the ADC10B12C will either continue or finish or stop converting according to the
FRZ1 and FRZ0 bits. This is useful for debugging and emulation.
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 399
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
12.1.3 Block Diagram
Figure 12-1. ADC10B12C Block Diagram
VSSA
AN6
ATD_12B12C
Analog
MUX
Mode and
Successive
Approximation
Register (SAR)
Results
ATD 0
ATD 1
ATD 2
ATD 3
ATD 4
ATD 5
ATD 6
ATD 7
and DAC
Sample & Hold
VDDA
VRL
VRH
Sequence Complete
+
-
Comparator
Clock
Prescaler
Bus Clock
ATD Clock
AN5
AN4
AN3
AN1
AN0
AN7
ETRIG0
(See device specifi-
cation for availability
ETRIG1
ETRIG2
ETRIG3
and connectivity)
Timing Control
ATDDIENATDCTL1
Trigger
Mux Interrupt
Compare Interrupt
AN2
AN8
AN9
AN10
AN11
ATD 8
ATD 9
ATD 10
ATD 11
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
400 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
12.2 Signal Description
This section lists all inputs to the ADC10B12C block.
12.2.1 Detailed Signal Descriptions
12.2.1.1 ANx (x = 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0)
This pin serves as the analog input Channel x. It can also be configured as digital port or external trigger
for the ATD conversion.
12.2.1.2 ETRIG3, ETRIG2, ETRIG1, ETRIG0
These inputs can be configured to serve as an external trigger for the ATD conversion.
Refer to device specification for availability and connectivity of these inputs!
12.2.1.3 VRH, VRL
VRH is the high reference voltage, VRL is the low reference voltage for ATD conversion.
12.2.1.4 VDDA, VSSA
These pins are the power supplies for the analog circuitry of the ADC10B12C block.
12.3 Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the ADC10B12C.
12.3.1 Module Memory Map
Figure 12-2 gives an overview on all ADC10B12C registers.
NOTE
Register Address = Base Address + Address Offset, where the Base Address
is defined at the MCU level and the Address Offset is defined at the module
level.
Address Name Bit 7 6 5 4 3 2 1 Bit 0
0x0000 ATDCTL0 RReserved 000
WRAP3 WRAP2 WRAP1 WRAP0
W
0x0001 ATDCTL1 RETRIGSEL SRES1 SRES0 SMP_DIS ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0
W
0x0002 ATDCTL2 R0 AFFC Reserved ETRIGLE ETRIGP ETRIGE ASCIE ACMPIE
W
= Unimplemented or Reserved
Figure 12-2. ADC10B12C Register Summary (Sheet 1 of 3)
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 401
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x0003 ATDCTL3 RDJM S8C S4C S2C S1C FIFO FRZ1 FRZ0
W
0x0004 ATDCTL4 RSMP2 SMP1 SMP0 PRS[4:0]
W
0x0005 ATDCTL5 R0 SC SCAN MULT CD CC CB CA
W
0x0006 ATDSTAT0 RSCF 0ETORF FIFOR CC3 CC2 CC1 CC0
W
0x0007 Unimple-
mented
R0 000 0 0 0 0
W
0x0008 ATDCMPEH R0 000 CMPE[11:8]
W
0x0009 ATDCMPEL RCMPE[7:0]
W
0x000A ATDSTAT2H R 0 0 0 0 CCF[11:8]
W
0x000B ATDSTAT2L R CCF[7:0]
W
0x000C ATDDIENH R1 111 IEN[11:8]
W
0x000D ATDDIENL RIEN[7:0]
W
0x000E ATDCMPHTH R0 000 CMPHT[11:8]
W
0x000F ATDCMPHTL RCMPHT[7:0]
W
0x0010 ATDDR0 RSee Section 12.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 12.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0012 ATDDR1 RSee Section 12.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 12.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0014 ATDDR2 RSee Section 12.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 12.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0016 ATDDR3 RSee Section 12.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 12.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0018 ATDDR4 RSee Section 12.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 12.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x001A ATDDR5 RSee Section 12.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 12.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x001C ATDDR6 RSee Section 12.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 12.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x001E ATDDR7 RSee Section 12.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 12.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0020 ATDDR8 RSee Section 12.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 12.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0022 ATDDR9 RSee Section 12.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 12.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
Address Name Bit 7 6 5 4 3 2 1 Bit 0
= Unimplemented or Reserved
Figure 12-2. ADC10B12C Register Summary (Sheet 2 of 3)
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
402 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
12.3.2 Register Descriptions
This section describes in address order all the ADC10B12C registers and their individual bits.
12.3.2.1 ATD Control Register 0 (ATDCTL0)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime, in special modes always write 0 to Reserved Bit 7.
0x0024 ATDDR10 RSee Section 12.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 12.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0026 ATDDR11 RSee Section 12.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 12.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0028 -
0x002F
Unimple-
mented
R00000000
W
Module Base + 0x0000
76543210
RReserved 000
WRAP3 WRAP2 WRAP1 WRAP0
W
Reset 0 0 0 01111
= Unimplemented or Reserved
Figure 12-3. ATD Control Register 0 (ATDCTL0)
Table 12-1. ATDCTL0 Field Descriptions
Field Description
3-0
WRAP[3-0]
Wrap Around Channel Select Bits — These bits determine the channel for wrap around when doing
multi-channel conversions. The coding is summarized in Table 12-2.
Table 12-2. Multi-Channel Wrap Around Coding
WRAP3 WRAP2 WRAP1 WRAP0 Multiple Channel Conversions (MULT = 1)
Wraparound to AN0 after Converting
0000 Reserved1
0001 AN1
0010 AN2
0011 AN3
0100 AN4
0101 AN5
Address Name Bit 7 6 5 4 3 2 1 Bit 0
= Unimplemented or Reserved
Figure 12-2. ADC10B12C Register Summary (Sheet 3 of 3)
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 403
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
12.3.2.2 ATD Control Register 1 (ATDCTL1)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
0110 AN6
0111 AN7
1000 AN8
1001 AN9
1010 AN10
1011 AN11
1100 AN11
1101 AN11
1110 AN11
1111 AN11
1If only AN0 should be converted use MULT=0.
Module Base + 0x0001
76543210
R
ETRIGSEL SRES1 SRES0 SMP_DIS ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0
W
Reset 0 0 1 01111
Figure 12-4. ATD Control Register 1 (ATDCTL1)
Table 12-3. ATDCTL1 Field Descriptions
Field Description
7
ETRIGSEL
External Trigger Source Select — This bit selects the external trigger source to be either one of the AD
channels or one of the ETRIG3-0 inputs. See device specification for availability and connectivity of ETRIG3-0
inputs. If a particular ETRIG3-0 input option is not available, writing a 1 to ETRISEL only sets the bit but has
no effect, this means that one of the AD channels (selected by ETRIGCH3-0) is configured as the source for
external trigger. The coding is summarized in Table 12-5.
6–5
SRES[1:0]
A/D Resolution Select — These bits select the resolution of A/D conversion results. See Table 12-4 for
coding.
Table 12-2. Multi-Channel Wrap Around Coding
WRAP3 WRAP2 WRAP1 WRAP0 Multiple Channel Conversions (MULT = 1)
Wraparound to AN0 after Converting
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
404 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
4
SMP_DIS
Discharge Before Sampling Bit
0 No discharge before sampling.
1 The internal sample capacitor is discharged before sampling the channel. This adds 2 ATD clock cycles to
the sampling time. This can help to detect an open circuit instead of measuring the previous sampled
channel.
3–0
ETRIGCH[3:0]
External Trigger Channel Select — These bits select one of the AD channels or one of the ETRIG3-0 inputs
as source for the external trigger. The coding is summarized in Table 12-5.
Table 12-4. A/D Resolution Coding
SRES1 SRES0 A/D Resolution
0 0 8-bit data
0 1 10-bit data
10
1 1 Reserved
Table 12-5. External Trigger Channel Select Coding
ETRIGSEL ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0 External trigger source is
0 0 0 0 0 AN0
0 0 0 0 1 AN1
0 0 0 1 0 AN2
0 0 0 1 1 AN3
0 0 1 0 0 AN4
0 0 1 0 1 AN5
0 0 1 1 0 AN6
0 0 1 1 1 AN7
0 1 0 0 0 AN8
0 1 0 0 1 AN9
0 1 0 1 0 AN10
0 1 0 1 1 AN11
0 1 1 0 0 AN11
0 1 1 0 1 AN11
0 1 1 1 0 AN11
0 1 1 1 1 AN11
1 0 0 0 0 ETRIG01
1Only if ETRIG3-0 input option is available (see device specification), else ETRISEL is ignored, that means
external trigger source is still on one of the AD channels selected by ETRIGCH3-0
1 0 0 0 1 ETRIG11
1 0 0 1 0 ETRIG21
1 0 0 1 1 ETRIG31
1 0 1 X X Reserved
1 1 X X X Reserved
Table 12-3. ATDCTL1 Field Descriptions (continued)
Field Description
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 405
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
12.3.2.3 ATD Control Register 2 (ATDCTL2)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
Module Base + 0x0002
76543210
R0
AFFC Reserved ETRIGLE ETRIGP ETRIGE ASCIE ACMPIE
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 12-5. ATD Control Register 2 (ATDCTL2)
Table 12-6. ATDCTL2 Field Descriptions
Field Description
6
AFFC
ATD Fast Flag Clear All
0 ATD flag clearing done by write 1 to respective CCF[n] flag.
1 Changes all ATD conversion complete flags to a fast clear sequence.
For compare disabled (CMPE[n]=0) a read access to the result register will cause the associated CCF[n] flag
to clear automatically.
For compare enabled (CMPE[n]=1) a write access to the result register will cause the associated CCF[n] flag
to clear automatically.
5
Reserved
Do not alter this bit from its reset value.It is for Manufacturer use only and can change the ATD behavior.
4
ETRIGLE
External Trigger Level/Edge Control — This bit controls the sensitivity of the external trigger signal. See
Table 12-7 for details.
3
ETRIGP
External Trigger Polarity — This bit controls the polarity of the external trigger signal. See Table 12-7 for details.
2
ETRIGE
External Trigger Mode Enable — This bit enables the external trigger on one of the AD channels or one of the
ETRIG3-0 inputs as described in Table 12-5. If the external trigger source is one of the AD channels, the digital
input buffer of this channel is enabled. The external trigger allows to synchronize the start of conversion with
external events.
0 Disable external trigger
1 Enable external trigger
1
ASCIE
ATD Sequence Complete Interrupt Enable
0 ATD Sequence Complete interrupt requests are disabled.
1 ATD Sequence Complete interrupt will be requested whenever SCF=1 is set.
0
ACMPIE
ATD Compare Interrupt Enable — If automatic compare is enabled for conversion n(CMPE[n]=1 in ATDCMPE
register) this bit enables the compare interrupt. If the CCF[n] flag is set (showing a successful compare for
conversion n), the compare interrupt is triggered.
0 ATD Compare interrupt requests are disabled.
1 For the conversions in a sequence for which automatic compare is enabled (CMPE[n]=1), an ATD Compare
Interrupt will be requested whenever any of the respective CCF flags is set.
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
406 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
12.3.2.4 ATD Control Register 3 (ATDCTL3)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
Table 12-7. External Trigger Configurations
ETRIGLE ETRIGP External Trigger Sensitivity
0 0 Falling edge
0 1 Rising edge
1 0 Low level
1 1 High level
Module Base + 0x0003
76543210
R
DJM S8C S4C S2C S1C FIFO FRZ1 FRZ0
W
Reset 0 0 1 00000
= Unimplemented or Reserved
Figure 12-6. ATD Control Register 3 (ATDCTL3)
Table 12-8. ATDCTL3 Field Descriptions
Field Description
7
DJM
Result Register Data Justification — Result data format is always unsigned. This bit controls justification of
conversion data in the result registers.
0 Left justified data in the result registers.
1 Right justified data in the result registers.
Table 12-9 gives example ATD results for an input signal range between 0 and 5.12 Volts.
6–3
S8C, S4C,
S2C, S1C
Conversion Sequence Length — These bits control the number of conversions per sequence. Table 12-10
shows all combinations. At reset, S4C is set to 1 (sequence length is 4). This is to maintain software continuity
to HC12 family.
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 407
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
2
FIFO
Result Register FIFO Mode — If this bit is zero (non-FIFO mode), the A/D conversion results map into the result
registers based on the conversion sequence; the result of the first conversion appears in the first result register
(ATDDR0), the second result in the second result register (ATDDR1), and so on.
If this bit is one (FIFO mode) the conversion counter is not reset at the beginning or end of a conversion
sequence; sequential conversion results are placed in consecutive result registers. In a continuously scanning
conversion sequence, the result register counter will wrap around when it reaches the end of the result register
file. The conversion counter value (CC3-0 in ATDSTAT0) can be used to determine where in the result register
file, the current conversion result will be placed.
Aborting a conversion or starting a new conversion clears the conversion counter even if FIFO=1. So the first
result of a new conversion sequence, started by writing to ATDCTL5, will always be place in the first result register
(ATDDDR0). Intended usage of FIFO mode is continuos conversion (SCAN=1) or triggered conversion
(ETRIG=1).
Which result registers hold valid data can be tracked using the conversion complete flags. Fast flag clear mode
may be useful in a particular application to track valid data.
If this bit is one, automatic compare of result registers is always disabled, that is ADC10B12C will behave as if
ACMPIE and all CPME[n] were zero.
0 Conversion results are placed in the corresponding result register up to the selected sequence length.
1 Conversion results are placed in consecutive result registers (wrap around at end).
1–0
FRZ[1:0]
Background Debug Freeze Enable — When debugging an application, it is useful in many cases to have the
ATD pause when a breakpoint (Freeze Mode) is encountered. These 2 bits determine how the ATD will respond
to a breakpoint as shown in Table 12-11. Leakage onto the storage node and comparator reference capacitors
may compromise the accuracy of an immediately frozen conversion depending on the length of the freeze period.
Table 12-9. Examples of ideal decimal ATD Results
Input Signal
VRL = 0 Volts
VRH = 5.12 Volts
8-Bit
Codes
(resolution=20mV)
10-Bit
Codes
(resolution=5mV)
5.120 Volts
...
0.022
0.020
0.018
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.003
0.002
0.000
255
...
1
1
1
1
1
1
1
0
0
0
0
0
0
1023
...
4
4
4
3
3
2
2
2
1
1
1
0
0
Table 12-8. ATDCTL3 Field Descriptions (continued)
Field Description
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
408 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
12.3.2.5 ATD Control Register 4 (ATDCTL4)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
Table 12-10. Conversion Sequence Length Coding
S8C S4C S2C S1C Number of Conversions
per Sequence
00 0 0 12
00 0 1 1
00 1 0 2
00 1 1 3
01 0 0 4
01 0 1 5
01 1 0 6
01 1 1 7
10 0 0 8
10 0 1 9
10 1 0 10
10 1 1 11
11 0 0 12
11 0 1 12
11 1 0 12
11 1 1 12
Table 12-11. ATD Behavior in Freeze Mode (Breakpoint)
FRZ1 FRZ0 Behavior in Freeze Mode
0 0 Continue conversion
0 1 Reserved
1 0 Finish current conversion, then freeze
1 1 Freeze Immediately
Module Base + 0x0004
76543210
R
SMP2 SMP1 SMP0 PRS[4:0]
W
Reset 0 0 0 00101
Figure 12-7. ATD Control Register 4 (ATDCTL4)
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 409
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
12.3.2.6 ATD Control Register 5 (ATDCTL5)
Writes to this register will abort current conversion sequence and start a new conversion sequence. If the
external trigger function is enabled (ETRIGE=1) an initial write to ATDCTL5 is required to allow starting
of a conversion sequence which will then occur on each trigger event. Start of conversion means the
beginning of the sampling phase.
Read: Anytime
Write: Anytime
Table 12-12. ATDCTL4 Field Descriptions
Field Description
7–5
SMP[2:0]
Sample Time Select — These three bits select the length of the sample time in units of ATD conversion clock
cycles. Note that the ATD conversion clock period is itself a function of the prescaler value (bits PRS4-0).
Table 12-13 lists the available sample time lengths.
4–0
PRS[4:0]
ATD Clock Prescaler — These 5 bits are the binary prescaler value PRS. The ATD conversion clock frequency
is calculated as follows:
Refer to Device Specification for allowed frequency range of fATDCLK.
Table 12-13. Sample Time Select
SMP2 SMP1 SMP0
Sample Time
in Number of
ATD Clock Cycles
000 4
001 6
010 8
011 10
100 12
101 16
110 20
111 24
Module Base + 0x0005
76543210
R0
SC SCAN MULT CD CC CB CA
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 12-8. ATD Control Register 5 (ATDCTL5)
fATDCLK
fBUS
2 PRS 1+()×
-------------------------------------=
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
410 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 12-14. ATDCTL5 Field Descriptions
Field Description
6
SC
Special Channel Conversion Bit — If this bit is set, then special channel conversion can be selected using CD,
CC, CB and CA of ATDCTL5. Table 12-15 lists the coding.
0 Special channel conversions disabled
1 Special channel conversions enabled
5
SCAN
Continuous Conversion Sequence Mode — This bit selects whether conversion sequences are performed
continuously or only once. If the external trigger function is enabled (ETRIGE=1) setting this bit has no effect,
thus the external trigger always starts a single conversion sequence.
0 Single conversion sequence
1 Continuous conversion sequences (scan mode)
4
MULT
Multi-Channel Sample Mode — When MULT is 0, the ATD sequence controller samples only from the specified
analog input channel for an entire conversion sequence. The analog channel is selected by channel selection
code (control bits CD/CC/CB/CA located in ATDCTL5). When MULT is 1, the ATD sequence controller samples
across channels. The number of channels sampled is determined by the sequence length value (S8C, S4C, S2C,
S1C). The first analog channel examined is determined by channel selection code (CD, CC, CB, CA control bits);
subsequent channels sampled in the sequence are determined by incrementing the channel selection code or
wrapping around to AN0 (channel 0).
0 Sample only one channel
1 Sample across several channels
3–0
CD, CC,
CB, CA
Analog Input Channel Select Code — These bits select the analog input channel(s). Table 12-15 lists the
coding used to select the various analog input channels.
In the case of single channel conversions (MULT=0), this selection code specifies the channel to be examined.
In the case of multiple channel conversions (MULT=1), this selection code specifies the first channel to be
examined in the conversion sequence. Subsequent channels are determined by incrementing the channel
selection code or wrapping around to AN0 (after converting the channel defined by the Wrap Around Channel
Select Bits WRAP3-0 in ATDCTL0). When starting with a channel number higher than the one defined by
WRAP3-0 the first wrap around will be AN11 to AN0.
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 411
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
12.3.2.7 ATD Status Register 0 (ATDSTAT0)
This register contains the Sequence Complete Flag, overrun flags for external trigger and FIFO mode, and
the conversion counter.
Table 12-15. Analog Input Channel Select Coding
SC CD CC CB CA Analog Input
Channel
00000 AN0
0001 AN1
0010 AN2
0011 AN3
0100 AN4
0101 AN5
0110 AN6
0111 AN7
1000 AN8
1001 AN9
1 0 1 0 AN10
1 0 1 1 AN11
1 1 0 0 AN11
1 1 0 1 AN11
1 1 1 0 AN11
1 1 1 1 AN11
1 0 0 0 0 Internal_6,
0 0 0 1 Internal_7
0 0 1 0 Internal_0
0 0 1 1 Internal_1
0100 VRH
0101 VRL
0 1 1 0 (VRH+VRL) / 2
0 1 1 1 Reserved
1 0 0 0 Internal_2
1 0 0 1 Internal_3
1 0 1 0 Internal_4
1 0 1 1 Internal_5
1 1 X X Reserved
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
412 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Read: Anytime
Write: Anytime (No effect on (CC3, CC2, CC1, CC0))
Module Base + 0x0006
76543210
R
SCF
0
ETORF FIFOR
CC3 CC2 CC1 CC0
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 12-9. ATD Status Register 0 (ATDSTAT0)
Table 12-16. ATDSTAT0 Field Descriptions
Field Description
7
SCF
Sequence Complete Flag — This flag is set upon completion of a conversion sequence. If conversion
sequences are continuously performed (SCAN=1), the flag is set after each one is completed. This flag is cleared
when one of the following occurs:
A) Write “1” to SCF
B) Write to ATDCTL5 (a new conversion sequence is started)
C) If AFFC=1 and a result register is read
0 Conversion sequence not completed
1 Conversion sequence has completed
5
ETORF
External Trigger Overrun Flag — While in edge sensitive mode (ETRIGLE=0), if additional active edges are
detected while a conversion sequence is in process the overrun flag is set. This flag is cleared when one of the
following occurs:
A) Write “1” to ETORF
B) Write to ATDCTL0,1,2,3,4, ATDCMPE or ATDCMPHT (a conversion sequence is aborted)
C) Write to ATDCTL5 (a new conversion sequence is started)
0 No External trigger overrun error has occurred
1 External trigger overrun error has occurred
4
FIFOR
Result Register Overrun Flag — This bit indicates that a result register has been written to before its associated
conversion complete flag (CCF) has been cleared. This flag is most useful when using the FIFO mode because
the flag potentially indicates that result registers are out of sync with the input channels. However, it is also
practical for non-FIFO modes, and indicates that a result register has been overwritten before it has been read
(i.e. the old data has been lost). This flag is cleared when one of the following occurs:
A) Write “1” to FIFOR
B) Write to ATDCTL0,1,2,3,4, ATDCMPE or ATDCMPHT (a conversion sequence is aborted)
C) Write to ATDCTL5 (a new conversion sequence is started)
0 No overrun has occurred
1 Overrun condition exists (result register has been written while associated CCFx flag was still set)
3–0
CC[3:0]
Conversion Counter — These 4 read-only bits are the binary value of the conversion counter. The conversion
counter points to the result register that will receive the result of the current conversion. E.g. CC3=0, CC2=1,
CC1=1, CC0=0 indicates that the result of the current conversion will be in ATD Result Register 6. If in non-FIFO
mode (FIFO=0) the conversion counter is initialized to zero at the beginning and end of the conversion sequence.
If in FIFO mode (FIFO=1) the register counter is not initialized. The conversion counter wraps around when its
maximum value is reached.
Aborting a conversion or starting a new conversion clears the conversion counter even if FIFO=1.
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 413
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
12.3.2.8 ATD Compare Enable Register (ATDCMPE)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
12.3.2.9 ATD Status Register 2 (ATDSTAT2)
This read-only register contains the Conversion Complete Flags CCF[11:0].
Read: Anytime
Write: Anytime, no effect
Module Base + 0x0008
15 14 13 11 10 9 8 7 6 5 4 3 2 1 0
R 0 0 0 0 CMPE[11:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 12-10. ATD Compare Enable Register (ATDCMPE)
Table 12-17. ATDCMPE Field Descriptions
Field Description
11–0
CMPE[11:0]
Compare Enable for Conversion Number n(n= 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) of a Sequence (n conversion
number, NOT channel number!) — These bits enable automatic compare of conversion results individually for
conversions of a sequence. The sense of each comparison is determined by the CMPHT[n] bit in the ATDCMPHT
register.
For each conversion number with CMPE[n]=1 do the following:
1) Write compare value to ATDDRnresult register
2) Write compare operator with CMPHT[n] in ATDCPMHT register
CCF[n] in ATDSTAT2 register will flag individual success of any comparison.
0 No automatic compare
1 Automatic compare of results for conversion n of a sequence is enabled.
Module Base + 0x000A
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R 0 0 0 0 CCF[11:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 12-11. ATD Status Register 2 (ATDSTAT2)
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
414 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
12.3.2.10 ATD Input Enable Register (ATDDIEN)
Read: Anytime
Write: Anytime
Table 12-18. ATDSTAT2 Field Descriptions
Field Description
11–0
CCF[11:0]
Conversion Complete Flag n (n= 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) (n conversion number, NOT channel
number!)— A conversion complete flag is set at the end of each conversion in a sequence. The flags are
associated with the conversion position in a sequence (and also the result register number). Therefore in non-fifo
mode, CCF[4] is set when the fifth conversion in a sequence is complete and the result is available in result
register ATDDR4; CCF[5] is set when the sixth conversion in a sequence is complete and the result is available
in ATDDR5, and so forth.
If automatic compare of conversion results is enabled (CMPE[n]=1 in ATDCMPE), the conversion complete flag
is only set if comparison with ATDDRnis true. If ACMPIE=1 a compare interrupt will be requested. In this case,
as the ATDDRnresult register is used to hold the compare value, the result will not be stored there at the end of
the conversion but is lost.
A flag CCF[n] is cleared when one of the following occurs:
A) Write to ATDCTL5 (a new conversion sequence is started)
B) If AFFC=0, write “1” to CCF[n]
C) If AFFC=1 and CMPE[n]=0, read of result register ATDDRn
D) If AFFC=1 and CMPE[n]=1, write to result register ATDDRn
In case of a concurrent set and clear on CCF[n]: The clearing by method A) will overwrite the set. The clearing
by methods B) or C) or D) will be overwritten by the set.
0 Conversion number n not completed or successfully compared
1 If (CMPE[n]=0): Conversion number n has completed. Result is ready in ATDDRn.
If (CMPE[n]=1): Compare for conversion result number n with compare value in ATDDRn, using compare
operator CMPGT[n] is true. (No result available in ATDDRn)
Module Base + 0x000C
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R 1 1 1 1 IEN[11:0]
W
Reset 1 1 1 1 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 12-12. ATD Input Enable Register (ATDDIEN)
Table 12-19. ATDDIEN Field Descriptions
Field Description
11–0
IEN[11:0]
ATD Digital Input Enable on channel x(x= 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) — This bit controls the digital input
buffer from the analog input pin (ANx) to the digital data register.
0 Disable digital input buffer to ANx pin
1 Enable digital input buffer on ANx pin.
Note: Setting this bit will enable the corresponding digital input buffer continuously. If this bit is set while
simultaneously using it as an analog port, there is potentially increased power consumption because the
digital input buffer maybe in the linear region.
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 415
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
12.3.2.11 ATD Compare Higher Than Register (ATDCMPHT)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
12.3.2.12 ATD Conversion Result Registers (ATDDRn)
The A/D conversion results are stored in 12 result registers. Results are always in unsigned data
representation. Left and right justification is selected using the DJM control bit in ATDCTL3.
If automatic compare of conversions results is enabled (CMPE[n]=1 in ATDCMPE), these registers must
be written with the compare values in left or right justified format depending on the actual value of the
DJM bit. In this case, as the ATDDRn register is used to hold the compare value, the result will not be
stored there at the end of the conversion but is lost.
Attention, n is the conversion number, NOT the channel number!
Read: Anytime
Write: Anytime
NOTE
For conversions not using automatic compare, results are stored in the result
registers after each conversion. In this case avoid writing to ATDDRn except
for initial values, because an A/D result might be overwritten.
12.3.2.12.1 Left Justified Result Data (DJM=0)
Module Base + 0x000E
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R 0 0 0 0 CMPHT[11:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 12-13. ATD Compare Higher Than Register (ATDCMPHT)
Table 12-20. ATDCMPHT Field Descriptions
Field Description
11–0
CMPHT[11:0]
Compare Operation Higher Than Enable for conversion number n(n= 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) of
a Sequence (n conversion number, NOT channel number!) — This bit selects the operator for comparison
of conversion results.
0 If result of conversion n is lower or same than compare value in ATDDRn, this is flagged in ATDSTAT2
1 If result of conversion n is higher than compare value in ATDDRn, this is flagged in ATDSTAT2
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
416 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 12-21 shows how depending on the A/D resolution the conversion result is transferred to the ATD
result registers for left justified data. Compare is always done using all 12 bits of both the conversion result
and the compare value in ATDDRn.
Table 12-21. Conversion result mapping to ATDDRn
12.3.2.12.2 Right Justified Result Data (DJM=1)
Table 12-22 shows how depending on the A/D resolution the conversion result is transferred to the ATD
result registers for right justified data. Compare is always done using all 12 bits of both the conversion
result and the compare value in ATDDRn.
Module Base +
0x0010 = ATDDR0, 0x0012 = ATDDR1, 0x0014 = ATDDR2, 0x0016 = ATDDR3
0x0018 = ATDDR4, 0x001A = ATDDR5, 0x001C = ATDDR6, 0x001E = ATDDR7
0x0020 = ATDDR8, 0x0022 = ATDDR9, 0x0024 = ATDDR10, 0x0026 = ATDDR11
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
RResult-Bit[11:0] 0000
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 12-14. Left justified ATD conversion result register (ATDDRn)
A/D
resolution DJM conversion result mapping to ATDDRn
8-bit data 0 Result-Bit[11:4] = conversion result,
Result-Bit[3:0]=0000
10-bit data 0 Result-Bit[11:2] = conversion result,
Result-Bit[1:0]=00
Module Base +
0x0010 = ATDDR0, 0x0012 = ATDDR1, 0x0014 = ATDDR2, 0x0016 = ATDDR3
0x0018 = ATDDR4, 0x001A = ATDDR5, 0x001C = ATDDR6, 0x001E = ATDDR7
0x0020 = ATDDR8, 0x0022 = ATDDR9, 0x0024 = ATDDR10, 0x0026 = ATDDR11
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R 0 000 Result-Bit[11:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 12-15. Right justified ATD conversion result register (ATDDRn)
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 417
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
12.4 Functional Description
The ADC10B12C consists of an analog sub-block and a digital sub-block.
12.4.1 Analog Sub-Block
The analog sub-block contains all analog electronics required to perform a single conversion. Separate
power supplies VDDA and VSSA allow to isolate noise of other MCU circuitry from the analog sub-block.
12.4.1.1 Sample and Hold Machine
The Sample and Hold Machine controls the storage and charge of the sample capacitor to the voltage level
of the analog signal at the selected ADC input channel.
During the sample process the analog input connects directly to the storage node.
The input analog signals are unipolar and must be within the potential range of VSSA to VDDA.
During the hold process the analog input is disconnected from the storage node.
12.4.1.2 Analog Input Multiplexer
The analog input multiplexer connects one of the 8 external analog input channels to the sample and hold
machine.
12.4.1.3 Analog-to-Digital (A/D) Machine
The A/D Machine performs analog to digital conversions. The resolution is program selectable to be either
8 or 10 bits. The A/D machine uses a successive approximation architecture. It functions by comparing the
sampled and stored analog voltage with a series of binary coded discrete voltages. By following a binary
search algorithm, the A/D machine identifies the discrete voltage that is nearest to the sampled and stored
voltage.
When not converting the A/D machine is automatically powered down.
Only analog input signals within the potential range of VRL to VRH (A/D reference potentials) will result
in a non-railed digital output code.
Table 12-22. Conversion result mapping to ATDDRn
A/D
resolution DJM conversion result mapping to ATDDRn
8-bit data 1 Result-Bit[11:8]=0000,
Result-Bit[7:0] = conversion result
10-bit data 1 Result-Bit[11:10]=00,
Result-Bit[9:0] = conversion result
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
418 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
12.4.2 Digital Sub-Block
This subsection describes some of the digital features in more detail. See Section 12.3.2, “Register
Descriptions” for all details.
12.4.2.1 External Trigger Input
The external trigger feature allows the user to synchronize ATD conversions to an external event rather
than relying only on software to trigger the ATD module when a conversions is about to take place. The
external trigger signal (out of reset ATD channel 11, configurable in ATDCTL1) is programmable to be
edge or level sensitive with polarity control. Table 12-23 gives a brief description of the different
combinations of control bits and their effect on the external trigger function.
In either level or edge sensitive modes, the first conversion begins when the trigger is received.
Once ETRIGE is enabled a conversion must be triggered externally after writing to ATDCTL5 register.
During a conversion in edge sensitive mode, if additional trigger events are detected the overrun error flag
ETORF is set.
If level sensitive mode is active and the external trigger de-asserts and later asserts again during a
conversion sequence, this does not constitute an overrun. Therefore, the flag is not set. If the trigger is left
active in level sensitive mode when a sequence is about to complete, another sequence will be triggered
immediately.
Table 12-23. External Trigger Control Bits
ETRIGLE ETRIGP ETRIGE SCAN Description
X X 0 0 Ignores external trigger. Performs one
conversion sequence and stops.
X X 0 1 Ignores external trigger. Performs
continuous conversion sequences.
0 0 1 X Trigger falling edge sensitive. Performs
one conversion sequence per trigger.
0 1 1 X Trigger rising edge sensitive. Performs one
conversion sequence per trigger.
1 0 1 X Trigger low level sensitive. Performs
continuous conversions while trigger level
is active.
1 1 1 X Trigger high level sensitive. Performs
continuous conversions while trigger level
is active.
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 419
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
12.4.2.2 General-Purpose Digital Port Operation
Each ATD input pin can be switched between analog or digital input functionality. An analog multiplexer
makes each ATD input pin selected as analog input available to the A/D converter.
The pad of the ATD input pin is always connected to the analog input channel of the analog mulitplexer.
Each pad input signal is buffered to the digital port register.
This buffer can be turned on or off with the ATDDIEN register for each ATD input pin.
This is important so that the buffer does not draw excess current when an ATD input pin is selected as
analog input to the ADC10B12C.
12.5 Resets
At reset the ADC10B12C is in a power down state. The reset state of each individual bit is listed within
the Register Description section (see Section 12.3.2, “Register Descriptions”) which details the registers
and their bit-field.
12.6 Interrupts
The interrupts requested by the ADC10B12C are listed in Table 12-24. Refer to MCU specification for
related vector address and priority.
See Section 12.3.2, “Register Descriptions” for further details.
Table 12-24. ATD Interrupt Vectors
Interrupt Source CCR
Mask Local Enable
Sequence Complete Interrupt I bit ASCIE in ATDCTL2
Compare Interrupt I bit ACMPIE in ATDCTL2
Analog-to-Digital Converter (ADC10B12CV2)
MC9S12G Family Reference Manual, Rev.1.06
420 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 421
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 13
Analog-to-Digital Converter (ADC10B16CV2)
Revision History
13.1 Introduction
The ADC10B16C is a 16-channel, , multiplexed input successive approximation analog-to-digital
converter. Refer to device electrical specifications for ATD accuracy.
13.1.1 Features
• 8-, 10-bit resolution.
Version
Number
Revision
Date
Effective
Date Author Description of Changes
V02.00 18 June 2009 18 June 2009 Initial version copied 12 channel block guide
V02.01 09 Feb 2010 09 Feb 2010
Updated Table 13-15 Analog Input Channel Select Coding -
description of internal channels.
Updated register ATDDR (left/right justified result) description
in section 13.3.2.12.1/13-440 and 13.3.2.12.2/13-440 and
added Table 13-21 to improve feature description.
Fixed typo in Table 13-9 - conversion result for 3mV and 10bit
resolution
V02.03 26 Feb 2010 26 Feb 2010 Corrected Table 13-15 Analog Input Channel Select Coding -
description of internal channels.
V02.04 26 Mar 2010 16 Mar 2010 Corrected typo: Reset value of ATDDIEN register
V02.05 14 Apr 2010 14 Apr 2010 Corrected typos to be in-line with SoC level pin naming
conventions for VDDA, VSSA, VRL and VRH.
V02.06 25 Aug 2010 25 Aug 2010
Removed feature of conversion during STOP and general
wording clean up done in Section 13.4, “Functional
Description
v02.07 09 Sep 2010 09 Sep 2010 Update of internal only information.
V02.08 11 Feb 2011 11 Feb 2011 Connectivity Information regarding internal channel_6 added
to Table 13-15.
V02.09 29 Mar 2011 29 Mar 2011
Fixed typo in bit description field Table 13-14 for bits CD, CC,
CB, CA. Last sentence contained a wrong highest channel
number (it is not AN7 to AN0 instead it is AN15 to AN0).
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
422 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
• Automatic return to low power after conversion sequence
• Automatic compare with interrupt for higher than or less/equal than programmable value
• Programmable sample time.
• Left/right justified result data.
• External trigger control.
• Sequence complete interrupt.
• Analog input multiplexer for 8 analog input channels.
• Special conversions for VRH, VRL, (VRL+VRH)/2.
• 1-to-16 conversion sequence lengths.
• Continuous conversion mode.
• Multiple channel scans.
• Configurable external trigger functionality on any AD channel or any of four additional trigger
inputs. The four additional trigger inputs can be chip external or internal. Refer to device
specification for availability and connectivity.
• Configurable location for channel wrap around (when converting multiple channels in a sequence).
13.1.2 Modes of Operation
13.1.2.1 Conversion Modes
There is software programmable selection between performing single or continuous conversion on a
single channel or multiple channels.
13.1.2.2 MCU Operating Modes
• Stop Mode
Entering Stop Mode aborts any conversion sequence in progress and if a sequence was aborted
restarts it after exiting stop mode. This has the same effect/consequences as starting a conversion
sequence with write to ATDCTL5. So after exiting from stop mode with a previously aborted
sequence all flags are cleared etc.
•Wait Mode
ADC10B16C behaves same in Run and Wait Mode. For reduced power consumption continuous
conversions should be aborted before entering Wait mode.
•Freeze Mode
In Freeze Mode the ADC10B16C will either continue or finish or stop converting according to the
FRZ1 and FRZ0 bits. This is useful for debugging and emulation.
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 423
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
13.1.3 Block Diagram
Figure 13-1. ADC10B16C Block Diagram
VSSA
AN9
ATD_12B12C
Analog
MUX
Mode and
Successive
Approximation
Register (SAR)
Results
ATD 0
ATD 1
ATD 2
ATD 3
ATD 4
ATD 5
ATD 6
ATD 7
and DAC
Sample & Hold
VDDA
VRL
VRH
Sequence Complete
+
-
Comparator
Clock
Prescaler
Bus Clock
ATD Clock
AN7
AN6
AN5
AN10
ETRIG0
(See device specifi-
cation for availability
ETRIG1
ETRIG2
ETRIG3
and connectivity)
Timing Control
ATDDIENATDCTL1
Trigger
Mux Interrupt
Compare Interrupt
AN4
AN11
AN12
AN13
AN14
ATD 8
ATD 9
ATD 10
ATD 11
ATD 13
ATD 14
ATD 12
ATD 15
AN3
AN2
AN1
AN0
AN8
AN15
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
424 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
13.2 Signal Description
This section lists all inputs to the ADC10B16C block.
13.2.1 Detailed Signal Descriptions
13.2.1.1 ANx (x = 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0)
This pin serves as the analog input Channel x. It can also be configured as digital port or external trigger
for the ATD conversion.
13.2.1.2 ETRIG3, ETRIG2, ETRIG1, ETRIG0
These inputs can be configured to serve as an external trigger for the ATD conversion.
Refer to device specification for availability and connectivity of these inputs!
13.2.1.3 VRH, VRL
VRH is the high reference voltage, VRL is the low reference voltage for ATD conversion.
13.2.1.4 VDDA, VSSA
These pins are the power supplies for the analog circuitry of the ADC10B16C block.
13.3 Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the ADC10B16C.
13.3.1 Module Memory Map
Figure 13-2 gives an overview on all ADC10B16C registers.
NOTE
Register Address = Base Address + Address Offset, where the Base Address
is defined at the MCU level and the Address Offset is defined at the module
level.
Address Name Bit 7 6 5 4 3 2 1 Bit 0
0x0000 ATDCTL0 RReserved 000
WRAP3 WRAP2 WRAP1 WRAP0
W
0x0001 ATDCTL1 RETRIGSEL SRES1 SRES0 SMP_DIS ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0
W
0x0002 ATDCTL2 R0 AFFC Reserved ETRIGLE ETRIGP ETRIGE ASCIE ACMPIE
W
= Unimplemented or Reserved
Figure 13-2. ADC10B16C Register Summary (Sheet 1 of 3)
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 425
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x0003 ATDCTL3 RDJM S8C S4C S2C S1C FIFO FRZ1 FRZ0
W
0x0004 ATDCTL4 RSMP2 SMP1 SMP0 PRS[4:0]
W
0x0005 ATDCTL5 R0 SC SCAN MULT CD CC CB CA
W
0x0006 ATDSTAT0 RSCF 0ETORF FIFOR CC3 CC2 CC1 CC0
W
0x0007 Unimple-
mented
R0 000 0 0 0 0
W
0x0008 ATDCMPEH RCMPE[15:8]
W
0x0009 ATDCMPEL RCMPE[7:0]
W
0x000A ATDSTAT2H R CCF[15:8]
W
0x000B ATDSTAT2L R CCF[7:0]
W
0x000C ATDDIENH RIEN[15:8]
W
0x000D ATDDIENL RIEN[7:0]
W
0x000E ATDCMPHTH RCMPHT[15:8]
W
0x000F ATDCMPHTL RCMPHT[7:0]
W
0x0010 ATDDR0 RSee Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0012 ATDDR1 RSee Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0014 ATDDR2 RSee Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0016 ATDDR3 RSee Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0018 ATDDR4 RSee Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x001A ATDDR5 RSee Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x001C ATDDR6 RSee Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x001E ATDDR7 RSee Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0020 ATDDR8 RSee Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0022 ATDDR9 RSee Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
Address Name Bit 7 6 5 4 3 2 1 Bit 0
= Unimplemented or Reserved
Figure 13-2. ADC10B16C Register Summary (Sheet 2 of 3)
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
426 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
13.3.2 Register Descriptions
This section describes in address order all the ADC10B16C registers and their individual bits.
13.3.2.1 ATD Control Register 0 (ATDCTL0)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime, in special modes always write 0 to Reserved Bit 7.
0x0024 ATDDR10 RSee Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0026 ATDDR11 RSee Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0028 ATDDR12 RSee Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x002A ATDDR13 RSee Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x002C ATDDR14 RSee Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x002E ATDDR15 RSee Section 13.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 13.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
W
Module Base + 0x0000
76543210
RReserved 000
WRAP3 WRAP2 WRAP1 WRAP0
W
Reset 0 0 0 01111
= Unimplemented or Reserved
Figure 13-3. ATD Control Register 0 (ATDCTL0)
Table 13-1. ATDCTL0 Field Descriptions
Field Description
3-0
WRAP[3-0]
Wrap Around Channel Select Bits — These bits determine the channel for wrap around when doing
multi-channel conversions. The coding is summarized in Table 13-2.
Address Name Bit 7 6 5 4 3 2 1 Bit 0
= Unimplemented or Reserved
Figure 13-2. ADC10B16C Register Summary (Sheet 3 of 3)
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 427
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
13.3.2.2 ATD Control Register 1 (ATDCTL1)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
Table 13-2. Multi-Channel Wrap Around Coding
WRAP3 WRAP2 WRAP1 WRAP0 Multiple Channel Conversions (MULT = 1)
Wraparound to AN0 after Converting
0000 Reserved1
1If only AN0 should be converted use MULT=0.
0001 AN1
0010 AN2
0011 AN3
0100 AN4
0101 AN5
0110 AN6
0111 AN7
1000 AN8
1001 AN9
1010 AN10
1011 AN11
1100 AN12
1101 AN13
1110 AN14
1111 AN15
Module Base + 0x0001
76543210
R
ETRIGSEL SRES1 SRES0 SMP_DIS ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0
W
Reset 0 0 1 01111
Figure 13-4. ATD Control Register 1 (ATDCTL1)
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
428 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 13-3. ATDCTL1 Field Descriptions
Field Description
7
ETRIGSEL
External Trigger Source Select — This bit selects the external trigger source to be either one of the AD
channels or one of the ETRIG3-0 inputs. See device specification for availability and connectivity of ETRIG3-0
inputs. If a particular ETRIG3-0 input option is not available, writing a 1 to ETRISEL only sets the bit but has
no effect, this means that one of the AD channels (selected by ETRIGCH3-0) is configured as the source for
external trigger. The coding is summarized in Table 13-5.
6–5
SRES[1:0]
A/D Resolution Select — These bits select the resolution of A/D conversion results. See Table 13-4 for
coding.
4
SMP_DIS
Discharge Before Sampling Bit
0 No discharge before sampling.
1 The internal sample capacitor is discharged before sampling the channel. This adds 2 ATD clock cycles to
the sampling time. This can help to detect an open circuit instead of measuring the previous sampled
channel.
3–0
ETRIGCH[3:0]
External Trigger Channel Select — These bits select one of the AD channels or one of the ETRIG3-0 inputs
as source for the external trigger. The coding is summarized in Table 13-5.
Table 13-4. A/D Resolution Coding
SRES1 SRES0 A/D Resolution
0 0 8-bit data
0 1 10-bit data
10
1 1 Reserved
Table 13-5. External Trigger Channel Select Coding
ETRIGSEL ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0 External trigger source is
0 0 0 0 0 AN0
0 0 0 0 1 AN1
0 0 0 1 0 AN2
0 0 0 1 1 AN3
0 0 1 0 0 AN4
0 0 1 0 1 AN5
0 0 1 1 0 AN6
0 0 1 1 1 AN7
0 1 0 0 0 AN8
0 1 0 0 1 AN9
0 1 0 1 0 AN10
0 1 0 1 1 AN11
0 1 1 0 0 AN12
0 1 1 0 1 AN13
0 1 1 1 0 AN14
0 1 1 1 1 AN15
1 0 0 0 0 ETRIG01
1 0 0 0 1 ETRIG11
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 429
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
13.3.2.3 ATD Control Register 2 (ATDCTL2)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
1 0 0 1 0 ETRIG21
1 0 0 1 1 ETRIG31
1 0 1 X X Reserved
1 1 X X X Reserved
1Only if ETRIG3-0 input option is available (see device specification), else ETRISEL is ignored, that means
external trigger source is still on one of the AD channels selected by ETRIGCH3-0
Module Base + 0x0002
76543210
R0
AFFC Reserved ETRIGLE ETRIGP ETRIGE ASCIE ACMPIE
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 13-5. ATD Control Register 2 (ATDCTL2)
Table 13-6. ATDCTL2 Field Descriptions
Field Description
6
AFFC
ATD Fast Flag Clear All
0 ATD flag clearing done by write 1 to respective CCF[n] flag.
1 Changes all ATD conversion complete flags to a fast clear sequence.
For compare disabled (CMPE[n]=0) a read access to the result register will cause the associated CCF[n] flag
to clear automatically.
For compare enabled (CMPE[n]=1) a write access to the result register will cause the associated CCF[n] flag
to clear automatically.
5
Reserved
Do not alter this bit from its reset value.It is for Manufacturer use only and can change the ATD behavior.
4
ETRIGLE
External Trigger Level/Edge Control — This bit controls the sensitivity of the external trigger signal. See
Table 13-7 for details.
3
ETRIGP
External Trigger Polarity — This bit controls the polarity of the external trigger signal. See Table 13-7 for details.
2
ETRIGE
External Trigger Mode Enable — This bit enables the external trigger on one of the AD channels or one of the
ETRIG3-0 inputs as described in Table 13-5. If the external trigger source is one of the AD channels, the digital
input buffer of this channel is enabled. The external trigger allows to synchronize the start of conversion with
external events.
0 Disable external trigger
1 Enable external trigger
Table 13-5. External Trigger Channel Select Coding
ETRIGSEL ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0 External trigger source is
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
430 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
13.3.2.4 ATD Control Register 3 (ATDCTL3)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
1
ASCIE
ATD Sequence Complete Interrupt Enable
0 ATD Sequence Complete interrupt requests are disabled.
1 ATD Sequence Complete interrupt will be requested whenever SCF=1 is set.
0
ACMPIE
ATD Compare Interrupt Enable — If automatic compare is enabled for conversion n(CMPE[n]=1 in ATDCMPE
register) this bit enables the compare interrupt. If the CCF[n] flag is set (showing a successful compare for
conversion n), the compare interrupt is triggered.
0 ATD Compare interrupt requests are disabled.
1 For the conversions in a sequence for which automatic compare is enabled (CMPE[n]=1), an ATD Compare
Interrupt will be requested whenever any of the respective CCF flags is set.
Table 13-7. External Trigger Configurations
ETRIGLE ETRIGP External Trigger Sensitivity
0 0 Falling edge
0 1 Rising edge
1 0 Low level
1 1 High level
Module Base + 0x0003
76543210
R
DJM S8C S4C S2C S1C FIFO FRZ1 FRZ0
W
Reset 0 0 1 00000
= Unimplemented or Reserved
Figure 13-6. ATD Control Register 3 (ATDCTL3)
Table 13-6. ATDCTL2 Field Descriptions (continued)
Field Description
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 431
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 13-8. ATDCTL3 Field Descriptions
Field Description
7
DJM
Result Register Data Justification — Result data format is always unsigned. This bit controls justification of
conversion data in the result registers.
0 Left justified data in the result registers.
1 Right justified data in the result registers.
Table 13-9 gives example ATD results for an input signal range between 0 and 5.12 Volts.
6–3
S8C, S4C,
S2C, S1C
Conversion Sequence Length — These bits control the number of conversions per sequence. Table 13-10
shows all combinations. At reset, S4C is set to 1 (sequence length is 4). This is to maintain software continuity
to HC12 family.
2
FIFO
Result Register FIFO Mode — If this bit is zero (non-FIFO mode), the A/D conversion results map into the result
registers based on the conversion sequence; the result of the first conversion appears in the first result register
(ATDDR0), the second result in the second result register (ATDDR1), and so on.
If this bit is one (FIFO mode) the conversion counter is not reset at the beginning or end of a conversion
sequence; sequential conversion results are placed in consecutive result registers. In a continuously scanning
conversion sequence, the result register counter will wrap around when it reaches the end of the result register
file. The conversion counter value (CC3-0 in ATDSTAT0) can be used to determine where in the result register
file, the current conversion result will be placed.
Aborting a conversion or starting a new conversion clears the conversion counter even if FIFO=1. So the first
result of a new conversion sequence, started by writing to ATDCTL5, will always be place in the first result register
(ATDDDR0). Intended usage of FIFO mode is continuos conversion (SCAN=1) or triggered conversion
(ETRIG=1).
Which result registers hold valid data can be tracked using the conversion complete flags. Fast flag clear mode
may be useful in a particular application to track valid data.
If this bit is one, automatic compare of result registers is always disabled, that is ADC10B16C will behave as if
ACMPIE and all CPME[n] were zero.
0 Conversion results are placed in the corresponding result register up to the selected sequence length.
1 Conversion results are placed in consecutive result registers (wrap around at end).
1–0
FRZ[1:0]
Background Debug Freeze Enable — When debugging an application, it is useful in many cases to have the
ATD pause when a breakpoint (Freeze Mode) is encountered. These 2 bits determine how the ATD will respond
to a breakpoint as shown in Table 13-11. Leakage onto the storage node and comparator reference capacitors
may compromise the accuracy of an immediately frozen conversion depending on the length of the freeze period.
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
432 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 13-9. Examples of ideal decimal ATD Results
Input Signal
VRL = 0 Volts
VRH = 5.12 Volts
8-Bit
Codes
(resolution=20mV)
10-Bit
Codes
(resolution=5mV)
5.120 Volts
...
0.022
0.020
0.018
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.003
0.002
0.000
255
...
1
1
1
1
1
1
1
0
0
0
0
0
0
1023
...
4
4
4
3
3
2
2
2
1
1
1
0
0
Table 13-10. Conversion Sequence Length Coding
S8C S4C S2C S1C Number of Conversions
per Sequence
00 0 0 16
00 0 1 1
00 1 0 2
00 1 1 3
01 0 0 4
01 0 1 5
01 1 0 6
01 1 1 7
10 0 0 8
10 0 1 9
10 1 0 10
10 1 1 11
11 0 0 12
11 0 1 13
11 1 0 14
11 1 1 15
Table 13-11. ATD Behavior in Freeze Mode (Breakpoint)
FRZ1 FRZ0 Behavior in Freeze Mode
0 0 Continue conversion
0 1 Reserved
1 0 Finish current conversion, then freeze
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 433
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
13.3.2.5 ATD Control Register 4 (ATDCTL4)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
1 1 Freeze Immediately
Module Base + 0x0004
76543210
R
SMP2 SMP1 SMP0 PRS[4:0]
W
Reset 0 0 0 00101
Figure 13-7. ATD Control Register 4 (ATDCTL4)
Table 13-12. ATDCTL4 Field Descriptions
Field Description
7–5
SMP[2:0]
Sample Time Select — These three bits select the length of the sample time in units of ATD conversion clock
cycles. Note that the ATD conversion clock period is itself a function of the prescaler value (bits PRS4-0).
Table 13-13 lists the available sample time lengths.
4–0
PRS[4:0]
ATD Clock Prescaler — These 5 bits are the binary prescaler value PRS. The ATD conversion clock frequency
is calculated as follows:
Refer to Device Specification for allowed frequency range of fATDCLK.
Table 13-13. Sample Time Select
SMP2 SMP1 SMP0
Sample Time
in Number of
ATD Clock Cycles
000 4
001 6
010 8
011 10
100 12
101 16
110 20
111 24
Table 13-11. ATD Behavior in Freeze Mode (Breakpoint)
FRZ1 FRZ0 Behavior in Freeze Mode
fATDCLK
fBUS
2 PRS 1+()×
-------------------------------------=
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
434 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
13.3.2.6 ATD Control Register 5 (ATDCTL5)
Writes to this register will abort current conversion sequence and start a new conversion sequence. If the
external trigger function is enabled (ETRIGE=1) an initial write to ATDCTL5 is required to allow starting
of a conversion sequence which will then occur on each trigger event. Start of conversion means the
beginning of the sampling phase.
Read: Anytime
Write: Anytime
Module Base + 0x0005
76543210
R0
SC SCAN MULT CD CC CB CA
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 13-8. ATD Control Register 5 (ATDCTL5)
Table 13-14. ATDCTL5 Field Descriptions
Field Description
6
SC
Special Channel Conversion Bit — If this bit is set, then special channel conversion can be selected using CD,
CC, CB and CA of ATDCTL5. Table 13-15 lists the coding.
0 Special channel conversions disabled
1 Special channel conversions enabled
5
SCAN
Continuous Conversion Sequence Mode — This bit selects whether conversion sequences are performed
continuously or only once. If the external trigger function is enabled (ETRIGE=1) setting this bit has no effect,
thus the external trigger always starts a single conversion sequence.
0 Single conversion sequence
1 Continuous conversion sequences (scan mode)
4
MULT
Multi-Channel Sample Mode — When MULT is 0, the ATD sequence controller samples only from the specified
analog input channel for an entire conversion sequence. The analog channel is selected by channel selection
code (control bits CD/CC/CB/CA located in ATDCTL5). When MULT is 1, the ATD sequence controller samples
across channels. The number of channels sampled is determined by the sequence length value (S8C, S4C, S2C,
S1C). The first analog channel examined is determined by channel selection code (CD, CC, CB, CA control bits);
subsequent channels sampled in the sequence are determined by incrementing the channel selection code or
wrapping around to AN0 (channel 0).
0 Sample only one channel
1 Sample across several channels
3–0
CD, CC,
CB, CA
Analog Input Channel Select Code — These bits select the analog input channel(s). Table 13-15 lists the
coding used to select the various analog input channels.
In the case of single channel conversions (MULT=0), this selection code specifies the channel to be examined.
In the case of multiple channel conversions (MULT=1), this selection code specifies the first channel to be
examined in the conversion sequence. Subsequent channels are determined by incrementing the channel
selection code or wrapping around to AN0 (after converting the channel defined by the Wrap Around Channel
Select Bits WRAP3-0 in ATDCTL0). When starting with a channel number higher than the one defined by
WRAP3-0 the first wrap around will be AN16 to AN0.
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 435
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
13.3.2.7 ATD Status Register 0 (ATDSTAT0)
This register contains the Sequence Complete Flag, overrun flags for external trigger and FIFO mode, and
the conversion counter.
Table 13-15. Analog Input Channel Select Coding
SC CD CC CB CA Analog Input
Channel
00000 AN0
0001 AN1
0010 AN2
0011 AN3
0100 AN4
0101 AN5
0110 AN6
0111 AN7
1000 AN8
1001 AN9
1 0 1 0 AN10
1 0 1 1 AN11
1 1 0 0 AN12
1 1 0 1 AN13
1 1 1 0 AN14
1 1 1 1 AN15
1 0 0 0 0 Internal_6,
0 0 0 1 Internal_7
0 0 1 0 Internal_0
0 0 1 1 Internal_1
0100 VRH
0101 VRL
0 1 1 0 (VRH+VRL) / 2
0 1 1 1 Reserved
1 0 0 0 Internal_2
1 0 0 1 Internal_3
1 0 1 0 Internal_4
1 0 1 1 Internal_5
1 1 X X Reserved
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
436 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Read: Anytime
Write: Anytime (No effect on (CC3, CC2, CC1, CC0))
Module Base + 0x0006
76543210
R
SCF
0
ETORF FIFOR
CC3 CC2 CC1 CC0
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 13-9. ATD Status Register 0 (ATDSTAT0)
Table 13-16. ATDSTAT0 Field Descriptions
Field Description
7
SCF
Sequence Complete Flag — This flag is set upon completion of a conversion sequence. If conversion
sequences are continuously performed (SCAN=1), the flag is set after each one is completed. This flag is cleared
when one of the following occurs:
A) Write “1” to SCF
B) Write to ATDCTL5 (a new conversion sequence is started)
C) If AFFC=1 and a result register is read
0 Conversion sequence not completed
1 Conversion sequence has completed
5
ETORF
External Trigger Overrun Flag — While in edge sensitive mode (ETRIGLE=0), if additional active edges are
detected while a conversion sequence is in process the overrun flag is set. This flag is cleared when one of the
following occurs:
A) Write “1” to ETORF
B) Write to ATDCTL0,1,2,3,4, ATDCMPE or ATDCMPHT (a conversion sequence is aborted)
C) Write to ATDCTL5 (a new conversion sequence is started)
0 No External trigger overrun error has occurred
1 External trigger overrun error has occurred
4
FIFOR
Result Register Overrun Flag — This bit indicates that a result register has been written to before its associated
conversion complete flag (CCF) has been cleared. This flag is most useful when using the FIFO mode because
the flag potentially indicates that result registers are out of sync with the input channels. However, it is also
practical for non-FIFO modes, and indicates that a result register has been overwritten before it has been read
(i.e. the old data has been lost). This flag is cleared when one of the following occurs:
A) Write “1” to FIFOR
B) Write to ATDCTL0,1,2,3,4, ATDCMPE or ATDCMPHT (a conversion sequence is aborted)
C) Write to ATDCTL5 (a new conversion sequence is started)
0 No overrun has occurred
1 Overrun condition exists (result register has been written while associated CCFx flag was still set)
3–0
CC[3:0]
Conversion Counter — These 4 read-only bits are the binary value of the conversion counter. The conversion
counter points to the result register that will receive the result of the current conversion. E.g. CC3=0, CC2=1,
CC1=1, CC0=0 indicates that the result of the current conversion will be in ATD Result Register 6. If in non-FIFO
mode (FIFO=0) the conversion counter is initialized to zero at the beginning and end of the conversion sequence.
If in FIFO mode (FIFO=1) the register counter is not initialized. The conversion counter wraps around when its
maximum value is reached.
Aborting a conversion or starting a new conversion clears the conversion counter even if FIFO=1.
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 437
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
13.3.2.8 ATD Compare Enable Register (ATDCMPE)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
13.3.2.9 ATD Status Register 2 (ATDSTAT2)
This read-only register contains the Conversion Complete Flags CCF[15:0].
Read: Anytime
Write: Anytime, no effect
Module Base + 0x0008
15 14 13 11 10 9 8 7 6 5 4 3 2 1 0
RCMPE[15:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 13-10. ATD Compare Enable Register (ATDCMPE)
Table 13-17. ATDCMPE Field Descriptions
Field Description
15–0
CMPE[15:0]
Compare Enable for Conversion Number n(n= 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) of a Sequence
(n conversion number, NOT channel number!) — These bits enable automatic compare of conversion results
individually for conversions of a sequence. The sense of each comparison is determined by the CMPHT[n] bit in
the ATDCMPHT register.
For each conversion number with CMPE[n]=1 do the following:
1) Write compare value to ATDDRnresult register
2) Write compare operator with CMPHT[n] in ATDCPMHT register
CCF[n] in ATDSTAT2 register will flag individual success of any comparison.
0 No automatic compare
1 Automatic compare of results for conversion n of a sequence is enabled.
Module Base + 0x000A
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R CCF[15:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 13-11. ATD Status Register 2 (ATDSTAT2)
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
438 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
13.3.2.10 ATD Input Enable Register (ATDDIEN)
Read: Anytime
Write: Anytime
Table 13-18. ATDSTAT2 Field Descriptions
Field Description
15–0
CCF[15:0]
Conversion Complete Flag n(n= 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) (n conversion number, NOT
channel number!)— A conversion complete flag is set at the end of each conversion in a sequence. The flags
are associated with the conversion position in a sequence (and also the result register number). Therefore in
non-fifo mode, CCF[4] is set when the fifth conversion in a sequence is complete and the result is available in
result register ATDDR4; CCF[5] is set when the sixth conversion in a sequence is complete and the result is
available in ATDDR5, and so forth.
If automatic compare of conversion results is enabled (CMPE[n]=1 in ATDCMPE), the conversion complete flag
is only set if comparison with ATDDRnis true. If ACMPIE=1 a compare interrupt will be requested. In this case,
as the ATDDRnresult register is used to hold the compare value, the result will not be stored there at the end of
the conversion but is lost.
A flag CCF[n] is cleared when one of the following occurs:
A) Write to ATDCTL5 (a new conversion sequence is started)
B) If AFFC=0, write “1” to CCF[n]
C) If AFFC=1 and CMPE[n]=0, read of result register ATDDRn
D) If AFFC=1 and CMPE[n]=1, write to result register ATDDRn
In case of a concurrent set and clear on CCF[n]: The clearing by method A) will overwrite the set. The clearing
by methods B) or C) or D) will be overwritten by the set.
0 Conversion number n not completed or successfully compared
1 If (CMPE[n]=0): Conversion number n has completed. Result is ready in ATDDRn.
If (CMPE[n]=1): Compare for conversion result number n with compare value in ATDDRn, using compare
operator CMPGT[n] is true. (No result available in ATDDRn)
Module Base + 0x000C
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
RIEN[15:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 13-12. ATD Input Enable Register (ATDDIEN)
Table 13-19. ATDDIEN Field Descriptions
Field Description
15–0
IEN[15:0]
ATD Digital Input Enable on channel x(x= 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) — This bit controls
the digital input buffer from the analog input pin (ANx) to the digital data register.
0 Disable digital input buffer to ANx pin
1 Enable digital input buffer on ANx pin.
Note: Setting this bit will enable the corresponding digital input buffer continuously. If this bit is set while
simultaneously using it as an analog port, there is potentially increased power consumption because the
digital input buffer maybe in the linear region.
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 439
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
13.3.2.11 ATD Compare Higher Than Register (ATDCMPHT)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
13.3.2.12 ATD Conversion Result Registers (ATDDRn)
The A/D conversion results are stored in 16 result registers. Results are always in unsigned data
representation. Left and right justification is selected using the DJM control bit in ATDCTL3.
If automatic compare of conversions results is enabled (CMPE[n]=1 in ATDCMPE), these registers must
be written with the compare values in left or right justified format depending on the actual value of the
DJM bit. In this case, as the ATDDRn register is used to hold the compare value, the result will not be
stored there at the end of the conversion but is lost.
Attention, n is the conversion number, NOT the channel number!
Read: Anytime
Write: Anytime
NOTE
For conversions not using automatic compare, results are stored in the result
registers after each conversion. In this case avoid writing to ATDDRn except
for initial values, because an A/D result might be overwritten.
Module Base + 0x000E
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
RCMPHT[15:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 13-13. ATD Compare Higher Than Register (ATDCMPHT)
Table 13-20. ATDCMPHT Field Descriptions
Field Description
15–0
CMPHT[15:0]
Compare Operation Higher Than Enable for conversion number n(n= 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5,
4, 3, 2, 1, 0) of a Sequence (n conversion number, NOT channel number!) — This bit selects the operator
for comparison of conversion results.
0 If result of conversion n is lower or same than compare value in ATDDRn, this is flagged in ATDSTAT2
1 If result of conversion n is higher than compare value in ATDDRn, this is flagged in ATDSTAT2
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
440 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
13.3.2.12.1 Left Justified Result Data (DJM=0)
Table 13-21 shows how depending on the A/D resolution the conversion result is transferred to the ATD
result registers for left justified data. Compare is always done using all 12 bits of both the conversion result
and the compare value in ATDDRn.
13.3.2.12.2 Right Justified Result Data (DJM=1)
Module Base +
0x0010 = ATDDR0, 0x0012 = ATDDR1, 0x0014 = ATDDR2, 0x0016 = ATDDR3
0x0018 = ATDDR4, 0x001A = ATDDR5, 0x001C = ATDDR6, 0x001E = ATDDR7
0x0020 = ATDDR8, 0x0022 = ATDDR9, 0x0024 = ATDDR10, 0x0026 = ATDDR11
0x0028 = ATDDR12, 0x002A = ATDDR13, 0x002C = ATDDR14, 0x002E = ATDDR15
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
RResult-Bit[11:0] 0000
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 13-14. Left justified ATD conversion result register (ATDDRn)
Table 13-21. Conversion result mapping to ATDDRn
A/D
resolution DJM conversion result mapping to ATDDRn
8-bit data 0 Result-Bit[11:4] = conversion result,
Result-Bit[3:0]=0000
10-bit data 0 Result-Bit[11:2] = conversion result,
Result-Bit[1:0]=00
Module Base +
0x0010 = ATDDR0, 0x0012 = ATDDR1, 0x0014 = ATDDR2, 0x0016 = ATDDR3
0x0018 = ATDDR4, 0x001A = ATDDR5, 0x001C = ATDDR6, 0x001E = ATDDR7
0x0020 = ATDDR8, 0x0022 = ATDDR9, 0x0024 = ATDDR10, 0x0026 = ATDDR11
0x0028 = ATDDR12, 0x002A = ATDDR13, 0x002C = ATDDR14, 0x002E = ATDDR15
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R 0 000 Result-Bit[11:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 13-15. Right justified ATD conversion result register (ATDDRn)
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 441
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 13-22 shows how depending on the A/D resolution the conversion result is transferred to the ATD
result registers for right justified data. Compare is always done using all 12 bits of both the conversion
result and the compare value in ATDDRn.
13.4 Functional Description
The ADC10B16C consists of an analog sub-block and a digital sub-block.
13.4.1 Analog Sub-Block
The analog sub-block contains all analog electronics required to perform a single conversion. Separate
power supplies VDDA and VSSA allow to isolate noise of other MCU circuitry from the analog sub-block.
13.4.1.1 Sample and Hold Machine
The Sample and Hold Machine controls the storage and charge of the sample capacitor to the voltage level
of the analog signal at the selected ADC input channel.
During the sample process the analog input connects directly to the storage node.
The input analog signals are unipolar and must be within the potential range of VSSA to VDDA.
During the hold process the analog input is disconnected from the storage node.
13.4.1.2 Analog Input Multiplexer
The analog input multiplexer connects one of the 8 external analog input channels to the sample and hold
machine.
13.4.1.3 Analog-to-Digital (A/D) Machine
The A/D Machine performs analog to digital conversions. The resolution is program selectable to be either
8 or 10 bits. The A/D machine uses a successive approximation architecture. It functions by comparing the
sampled and stored analog voltage with a series of binary coded discrete voltages.
By following a binary search algorithm, the A/D machine identifies the discrete voltage that is nearest to
the sampled and stored voltage.
When not converting the A/D machine is automatically powered down.
Table 13-22. Conversion result mapping to ATDDRn
A/D
resolution DJM conversion result mapping to ATDDRn
8-bit data 1 Result-Bit[7:0] = result,
Result-Bit[11:8]=0000
10-bit data 1 Result-Bit[9:0] = result,
Result-Bit[11:10]=00
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
442 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Only analog input signals within the potential range of VRL to VRH (A/D reference potentials) will result
in a non-railed digital output code.
13.4.2 Digital Sub-Block
This subsection describes some of the digital features in more detail. See Section 13.3.2, “Register
Descriptions” for all details.
13.4.2.1 External Trigger Input
The external trigger feature allows the user to synchronize ATD conversions to an external event rather
than relying only on software to trigger the ATD module when a conversion is about to take place. The
external trigger signal (out of reset ATD channel 15, configurable in ATDCTL1) is programmable to be
edge or level sensitive with polarity control. Table 13-23 gives a brief description of the different
combinations of control bits and their effect on the external trigger function.
In either level or edge sensitive mode, the first conversion begins when the trigger is received.
Once ETRIGE is enabled a conversion must be triggered externally after writing to ATDCTL5 register.
During a conversion in edge sensitive mode, if additional trigger events are detected the overrun error flag
ETORF is set.
If level sensitive mode is active and the external trigger de-asserts and later asserts again during a
conversion sequence, this does not constitute an overrun. Therefore, the flag is not set. If the trigger is left
active in level sensitive mode when a sequence is about to complete, another sequence will be triggered
immediately.
Table 13-23. External Trigger Control Bits
ETRIGLE ETRIGP ETRIGE SCAN Description
X X 0 0 Ignores external trigger. Performs one
conversion sequence and stops.
X X 0 1 Ignores external trigger. Performs
continuous conversion sequences.
0 0 1 X Trigger falling edge sensitive. Performs
one conversion sequence per trigger.
0 1 1 X Trigger rising edge sensitive. Performs one
conversion sequence per trigger.
1 0 1 X Trigger low level sensitive. Performs
continuous conversions while trigger level
is active.
1 1 1 X Trigger high level sensitive. Performs
continuous conversions while trigger level
is active.
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 443
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
13.4.2.2 General-Purpose Digital Port Operation
Each ATD input pin can be switched between analog or digital input functionality. An analog multiplexer
makes each ATD input pin selected as analog input available to the A/D converter.
The pad of the ATD input pin is always connected to the analog input channel of the analog mulitplexer.
Each pad input signal is buffered to the digital port register.
This buffer can be turned on or off with the ATDDIEN register for each ATD input pin.
This is important so that the buffer does not draw excess current when an ATD input pin is selected as
analog input to the ADC10B16C.
13.5 Resets
At reset the ADC10B16C is in a power down state. The reset state of each individual bit is listed within
the Register Description section (see Section 13.3.2, “Register Descriptions”) which details the registers
and their bit-field.
13.6 Interrupts
The interrupts requested by the ADC10B16C are listed in Table 13-24. Refer to MCU specification for
related vector address and priority.
See Section 13.3.2, “Register Descriptions” for further details.
Table 13-24. ATD Interrupt Vectors
Interrupt Source CCR
Mask Local Enable
Sequence Complete Interrupt I bit ASCIE in ATDCTL2
Compare Interrupt I bit ACMPIE in ATDCTL2
Analog-to-Digital Converter (ADC10B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
444 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 445
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 14
Analog-to-Digital Converter (ADC12B16CV2)
Revision History
14.1 Introduction
The ADC12B16C is a 16-channel, 12-bit, multiplexed input successive approximation analog-to-digital
converter. Refer to device electrical specifications for ATD accuracy.
14.1.1 Features
• 8-, 10-, or 12-bit resolution.
Version
Number
Revision
Date
Effective
Date Author Description of Changes
V02.00 18 June 2009 18 June 2009 Initial version copied 12 channel block guide
V02.01 09 Feb 2010 09 Feb 2010
Updated Table 14-15 Analog Input Channel Select Coding -
description of internal channels.
Updated register ATDDR (left/right justified result) description
in section 14.3.2.12.1/14-465 and 14.3.2.12.2/14-465 and
added Table 14-21 to improve feature description.
Fixed typo in Table 14-9 - conversion result for 3mV and 10bit
resolution
V02.03 26 Feb 2010 26 Feb 2010 Corrected Table 14-15 Analog Input Channel Select Coding -
description of internal channels.
V02.04 26 Mar 2010 16 Mar 2010 Corrected typo: Reset value of ATDDIEN register
V02.05 14 Apr 2010 14 Apr 2010 Corrected typos to be in-line with SoC level pin naming
conventions for VDDA, VSSA, VRL and VRH.
V02.06 25 Aug 2010 25 Aug 2010
Removed feature of conversion during STOP and general
wording clean up done in Section 14.4, “Functional
Description
v02.07 09 Sep 2010 09 Sep 2010 Update of internal only information.
V02.08 11 Feb 2011 11 Feb 2011 Connectivity Information regarding internal channel_6 added
to Table 14-15.
V02.09 29 Mar 2011 29 Mar 2011
Fixed typo in bit description field Table 14-14 for bits CD, CC,
CB, CA. Last sentence contained a wrong highest channel
number (it is not AN7 to AN0 instead it is AN15 to AN0).
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
446 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
• Automatic return to low power after conversion sequence
• Automatic compare with interrupt for higher than or less/equal than programmable value
• Programmable sample time.
• Left/right justified result data.
• External trigger control.
• Sequence complete interrupt.
• Analog input multiplexer for 8 analog input channels.
• Special conversions for VRH, VRL, (VRL+VRH)/2 and ADC temperature sensor.
• 1-to-16 conversion sequence lengths.
• Continuous conversion mode.
• Multiple channel scans.
• Configurable external trigger functionality on any AD channel or any of four additional trigger
inputs. The four additional trigger inputs can be chip external or internal. Refer to device
specification for availability and connectivity.
• Configurable location for channel wrap around (when converting multiple channels in a sequence).
14.1.2 Modes of Operation
14.1.2.1 Conversion Modes
There is software programmable selection between performing single or continuous conversion on a
single channel or multiple channels.
14.1.2.2 MCU Operating Modes
• Stop Mode
Entering Stop Mode aborts any conversion sequence in progress and if a sequence was aborted
restarts it after exiting stop mode. This has the same effect/consequences as starting a conversion
sequence with write to ATDCTL5. So after exiting from stop mode with a previously aborted
sequence all flags are cleared etc.
•Wait Mode
ADC12B16C behaves same in Run and Wait Mode. For reduced power consumption continuous
conversions should be aborted before entering Wait mode.
•Freeze Mode
In Freeze Mode the ADC12B16C will either continue or finish or stop converting according to the
FRZ1 and FRZ0 bits. This is useful for debugging and emulation.
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 447
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
14.1.3 Block Diagram
Figure 14-1. ADC12B16C Block Diagram
VSSA
AN9
ATD_12B12C
Analog
MUX
Mode and
Successive
Approximation
Register (SAR)
Results
ATD 0
ATD 1
ATD 2
ATD 3
ATD 4
ATD 5
ATD 6
ATD 7
and DAC
Sample & Hold
VDDA
VRL
VRH
Sequence Complete
+
-
Comparator
Clock
Prescaler
Bus Clock
ATD Clock
AN7
AN6
AN5
AN10
ETRIG0
(See device specifi-
cation for availability
ETRIG1
ETRIG2
ETRIG3
and connectivity)
Timing Control
ATDDIENATDCTL1
Trigger
Mux Interrupt
Compare Interrupt
AN4
AN11
AN12
AN13
AN14
ATD 8
ATD 9
ATD 10
ATD 11
ATD 13
ATD 14
ATD 12
ATD 15
AN3
AN2
AN1
AN0
AN8
AN15
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
448 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
14.2 Signal Description
This section lists all inputs to the ADC12B16C block.
14.2.1 Detailed Signal Descriptions
14.2.1.1 ANx (x = 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0)
This pin serves as the analog input Channel x. It can also be configured as digital port or external trigger
for the ATD conversion.
14.2.1.2 ETRIG3, ETRIG2, ETRIG1, ETRIG0
These inputs can be configured to serve as an external trigger for the ATD conversion.
Refer to device specification for availability and connectivity of these inputs!
14.2.1.3 VRH, VRL
VRH is the high reference voltage, VRL is the low reference voltage for ATD conversion.
14.2.1.4 VDDA, VSSA
These pins are the power supplies for the analog circuitry of the ADC12B16C block.
14.3 Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the ADC12B16C.
14.3.1 Module Memory Map
Figure 14-2 gives an overview on all ADC12B16C registers.
NOTE
Register Address = Base Address + Address Offset, where the Base Address
is defined at the MCU level and the Address Offset is defined at the module
level.
Address Name Bit 7 6 5 4 3 2 1 Bit 0
0x0000 ATDCTL0 RReserved 000
WRAP3 WRAP2 WRAP1 WRAP0
W
0x0001 ATDCTL1 RETRIGSEL SRES1 SRES0 SMP_DIS ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0
W
0x0002 ATDCTL2 R0 AFFC Reserved ETRIGLE ETRIGP ETRIGE ASCIE ACMPIE
W
= Unimplemented or Reserved
Figure 14-2. ADC12B16C Register Summary (Sheet 1 of 3)
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 449
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x0003 ATDCTL3 RDJM S8C S4C S2C S1C FIFO FRZ1 FRZ0
W
0x0004 ATDCTL4 RSMP2 SMP1 SMP0 PRS[4:0]
W
0x0005 ATDCTL5 R0 SC SCAN MULT CD CC CB CA
W
0x0006 ATDSTAT0 RSCF 0ETORF FIFOR CC3 CC2 CC1 CC0
W
0x0007 Unimple-
mented
R0 000 0 0 0 0
W
0x0008 ATDCMPEH RCMPE[15:8]
W
0x0009 ATDCMPEL RCMPE[7:0]
W
0x000A ATDSTAT2H R CCF[15:8]
W
0x000B ATDSTAT2L R CCF[7:0]
W
0x000C ATDDIENH RIEN[15:8]
W
0x000D ATDDIENL RIEN[7:0]
W
0x000E ATDCMPHTH RCMPHT[15:8]
W
0x000F ATDCMPHTL RCMPHT[7:0]
W
0x0010 ATDDR0 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0012 ATDDR1 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0014 ATDDR2 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0016 ATDDR3 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0018 ATDDR4 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x001A ATDDR5 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x001C ATDDR6 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x001E ATDDR7 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0020 ATDDR8 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0022 ATDDR9 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
Address Name Bit 7 6 5 4 3 2 1 Bit 0
= Unimplemented or Reserved
Figure 14-2. ADC12B16C Register Summary (Sheet 2 of 3)
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
450 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
14.3.2 Register Descriptions
This section describes in address order all the ADC12B16C registers and their individual bits.
14.3.2.1 ATD Control Register 0 (ATDCTL0)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime, in special modes always write 0 to Reserved Bit 7.
0x0024 ATDDR10 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0026 ATDDR11 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0028 ATDDR12 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x002A ATDDR13 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x002C ATDDR14 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x002E ATDDR15 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
W
Module Base + 0x0000
76543210
RReserved 000
WRAP3 WRAP2 WRAP1 WRAP0
W
Reset 0 0 0 01111
= Unimplemented or Reserved
Figure 14-3. ATD Control Register 0 (ATDCTL0)
Table 14-1. ATDCTL0 Field Descriptions
Field Description
3-0
WRAP[3-0]
Wrap Around Channel Select Bits — These bits determine the channel for wrap around when doing
multi-channel conversions. The coding is summarized in Table 14-2.
Address Name Bit 7 6 5 4 3 2 1 Bit 0
= Unimplemented or Reserved
Figure 14-2. ADC12B16C Register Summary (Sheet 3 of 3)
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 451
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
14.3.2.2 ATD Control Register 1 (ATDCTL1)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
Table 14-2. Multi-Channel Wrap Around Coding
WRAP3 WRAP2 WRAP1 WRAP0 Multiple Channel Conversions (MULT = 1)
Wraparound to AN0 after Converting
0000 Reserved1
1If only AN0 should be converted use MULT=0.
0001 AN1
0010 AN2
0011 AN3
0100 AN4
0101 AN5
0110 AN6
0111 AN7
1000 AN8
1001 AN9
1010 AN10
1011 AN11
1100 AN12
1101 AN13
1110 AN14
1111 AN15
Module Base + 0x0001
76543210
R
ETRIGSEL SRES1 SRES0 SMP_DIS ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0
W
Reset 0 0 1 01111
Figure 14-4. ATD Control Register 1 (ATDCTL1)
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
452 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 14-3. ATDCTL1 Field Descriptions
Field Description
7
ETRIGSEL
External Trigger Source Select — This bit selects the external trigger source to be either one of the AD
channels or one of the ETRIG3-0 inputs. See device specification for availability and connectivity of ETRIG3-0
inputs. If a particular ETRIG3-0 input option is not available, writing a 1 to ETRISEL only sets the bit but has
no effect, this means that one of the AD channels (selected by ETRIGCH3-0) is configured as the source for
external trigger. The coding is summarized in Table 14-5.
6–5
SRES[1:0]
A/D Resolution Select — These bits select the resolution of A/D conversion results. See Table 14-4 for
coding.
4
SMP_DIS
Discharge Before Sampling Bit
0 No discharge before sampling.
1 The internal sample capacitor is discharged before sampling the channel. This adds 2 ATD clock cycles to
the sampling time. This can help to detect an open circuit instead of measuring the previous sampled
channel.
3–0
ETRIGCH[3:0]
External Trigger Channel Select — These bits select one of the AD channels or one of the ETRIG3-0 inputs
as source for the external trigger. The coding is summarized in Table 14-5.
Table 14-4. A/D Resolution Coding
SRES1 SRES0 A/D Resolution
0 0 8-bit data
0 1 10-bit data
1 0 12-bit data
1 1 Reserved
Table 14-5. External Trigger Channel Select Coding
ETRIGSEL ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0 External trigger source is
0 0 0 0 0 AN0
0 0 0 0 1 AN1
0 0 0 1 0 AN2
0 0 0 1 1 AN3
0 0 1 0 0 AN4
0 0 1 0 1 AN5
0 0 1 1 0 AN6
0 0 1 1 1 AN7
0 1 0 0 0 AN8
0 1 0 0 1 AN9
0 1 0 1 0 AN10
0 1 0 1 1 AN11
0 1 1 0 0 AN12
0 1 1 0 1 AN13
0 1 1 1 0 AN14
0 1 1 1 1 AN15
1 0 0 0 0 ETRIG01
1 0 0 0 1 ETRIG11
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 453
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
14.3.2.3 ATD Control Register 2 (ATDCTL2)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
1 0 0 1 0 ETRIG21
1 0 0 1 1 ETRIG31
1 0 1 X X Reserved
1 1 X X X Reserved
1Only if ETRIG3-0 input option is available (see device specification), else ETRISEL is ignored, that means
external trigger source is still on one of the AD channels selected by ETRIGCH3-0
Module Base + 0x0002
76543210
R0
AFFC Reserved ETRIGLE ETRIGP ETRIGE ASCIE ACMPIE
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 14-5. ATD Control Register 2 (ATDCTL2)
Table 14-6. ATDCTL2 Field Descriptions
Field Description
6
AFFC
ATD Fast Flag Clear All
0 ATD flag clearing done by write 1 to respective CCF[n] flag.
1 Changes all ATD conversion complete flags to a fast clear sequence.
For compare disabled (CMPE[n]=0) a read access to the result register will cause the associated CCF[n] flag
to clear automatically.
For compare enabled (CMPE[n]=1) a write access to the result register will cause the associated CCF[n] flag
to clear automatically.
5
Reserved
Do not alter this bit from its reset value.It is for Manufacturer use only and can change the ATD behavior.
4
ETRIGLE
External Trigger Level/Edge Control — This bit controls the sensitivity of the external trigger signal. See
Table 14-7 for details.
3
ETRIGP
External Trigger Polarity — This bit controls the polarity of the external trigger signal. See Table 14-7 for details.
2
ETRIGE
External Trigger Mode Enable — This bit enables the external trigger on one of the AD channels or one of the
ETRIG3-0 inputs as described in Table 14-5. If the external trigger source is one of the AD channels, the digital
input buffer of this channel is enabled. The external trigger allows to synchronize the start of conversion with
external events.
0 Disable external trigger
1 Enable external trigger
Table 14-5. External Trigger Channel Select Coding
ETRIGSEL ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0 External trigger source is
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
454 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
14.3.2.4 ATD Control Register 3 (ATDCTL3)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
1
ASCIE
ATD Sequence Complete Interrupt Enable
0 ATD Sequence Complete interrupt requests are disabled.
1 ATD Sequence Complete interrupt will be requested whenever SCF=1 is set.
0
ACMPIE
ATD Compare Interrupt Enable — If automatic compare is enabled for conversion n(CMPE[n]=1 in ATDCMPE
register) this bit enables the compare interrupt. If the CCF[n] flag is set (showing a successful compare for
conversion n), the compare interrupt is triggered.
0 ATD Compare interrupt requests are disabled.
1 For the conversions in a sequence for which automatic compare is enabled (CMPE[n]=1), an ATD Compare
Interrupt will be requested whenever any of the respective CCF flags is set.
Table 14-7. External Trigger Configurations
ETRIGLE ETRIGP External Trigger Sensitivity
0 0 Falling edge
0 1 Rising edge
1 0 Low level
1 1 High level
Module Base + 0x0003
76543210
R
DJM S8C S4C S2C S1C FIFO FRZ1 FRZ0
W
Reset 0 0 1 00000
= Unimplemented or Reserved
Figure 14-6. ATD Control Register 3 (ATDCTL3)
Table 14-6. ATDCTL2 Field Descriptions (continued)
Field Description
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 455
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 14-8. ATDCTL3 Field Descriptions
Field Description
7
DJM
Result Register Data Justification — Result data format is always unsigned. This bit controls justification of
conversion data in the result registers.
0 Left justified data in the result registers.
1 Right justified data in the result registers.
Table 14-9 gives example ATD results for an input signal range between 0 and 5.12 Volts.
6–3
S8C, S4C,
S2C, S1C
Conversion Sequence Length — These bits control the number of conversions per sequence. Table 14-10
shows all combinations. At reset, S4C is set to 1 (sequence length is 4). This is to maintain software continuity
to HC12 family.
2
FIFO
Result Register FIFO Mode — If this bit is zero (non-FIFO mode), the A/D conversion results map into the result
registers based on the conversion sequence; the result of the first conversion appears in the first result register
(ATDDR0), the second result in the second result register (ATDDR1), and so on.
If this bit is one (FIFO mode) the conversion counter is not reset at the beginning or end of a conversion
sequence; sequential conversion results are placed in consecutive result registers. In a continuously scanning
conversion sequence, the result register counter will wrap around when it reaches the end of the result register
file. The conversion counter value (CC3-0 in ATDSTAT0) can be used to determine where in the result register
file, the current conversion result will be placed.
Aborting a conversion or starting a new conversion clears the conversion counter even if FIFO=1. So the first
result of a new conversion sequence, started by writing to ATDCTL5, will always be place in the first result register
(ATDDDR0). Intended usage of FIFO mode is continuos conversion (SCAN=1) or triggered conversion
(ETRIG=1).
Which result registers hold valid data can be tracked using the conversion complete flags. Fast flag clear mode
may be useful in a particular application to track valid data.
If this bit is one, automatic compare of result registers is always disabled, that is ADC12B16C will behave as if
ACMPIE and all CPME[n] were zero.
0 Conversion results are placed in the corresponding result register up to the selected sequence length.
1 Conversion results are placed in consecutive result registers (wrap around at end).
1–0
FRZ[1:0]
Background Debug Freeze Enable — When debugging an application, it is useful in many cases to have the
ATD pause when a breakpoint (Freeze Mode) is encountered. These 2 bits determine how the ATD will respond
to a breakpoint as shown in Table 14-11. Leakage onto the storage node and comparator reference capacitors
may compromise the accuracy of an immediately frozen conversion depending on the length of the freeze period.
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
456 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 14-9. Examples of ideal decimal ATD Results
Input Signal
VRL = 0 Volts
VRH = 5.12 Volts
8-Bit
Codes
(resolution=20mV)
10-Bit
Codes
(resolution=5mV)
12-Bit
Codes
(transfer curve has
1.25mV offset)
(resolution=1.25mV)
5.120 Volts
...
0.022
0.020
0.018
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.003
0.002
0.000
255
...
1
1
1
1
1
1
1
0
0
0
0
0
0
1023
...
4
4
4
3
3
2
2
2
1
1
1
0
0
4095
...
17
16
14
12
11
9
8
6
4
3
2
1
0
Table 14-10. Conversion Sequence Length Coding
S8C S4C S2C S1C Number of Conversions
per Sequence
00 0 0 16
00 0 1 1
00 1 0 2
00 1 1 3
01 0 0 4
01 0 1 5
01 1 0 6
01 1 1 7
10 0 0 8
10 0 1 9
10 1 0 10
10 1 1 11
11 0 0 12
11 0 1 13
11 1 0 14
11 1 1 15
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 457
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
14.3.2.5 ATD Control Register 4 (ATDCTL4)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
Table 14-11. ATD Behavior in Freeze Mode (Breakpoint)
FRZ1 FRZ0 Behavior in Freeze Mode
0 0 Continue conversion
0 1 Reserved
1 0 Finish current conversion, then freeze
1 1 Freeze Immediately
Module Base + 0x0004
76543210
R
SMP2 SMP1 SMP0 PRS[4:0]
W
Reset 0 0 0 00101
Figure 14-7. ATD Control Register 4 (ATDCTL4)
Table 14-12. ATDCTL4 Field Descriptions
Field Description
7–5
SMP[2:0]
Sample Time Select — These three bits select the length of the sample time in units of ATD conversion clock
cycles. Note that the ATD conversion clock period is itself a function of the prescaler value (bits PRS4-0).
Table 14-13 lists the available sample time lengths.
4–0
PRS[4:0]
ATD Clock Prescaler — These 5 bits are the binary prescaler value PRS. The ATD conversion clock frequency
is calculated as follows:
Refer to Device Specification for allowed frequency range of fATDCLK.
Table 14-13. Sample Time Select
SMP2 SMP1 SMP0
Sample Time
in Number of
ATD Clock Cycles
000 4
001 6
010 8
011 10
100 12
101 16
110 20
fATDCLK
fBUS
2 PRS 1+()×
-------------------------------------=
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
458 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
14.3.2.6 ATD Control Register 5 (ATDCTL5)
Writes to this register will abort current conversion sequence and start a new conversion sequence. If the
external trigger function is enabled (ETRIGE=1) an initial write to ATDCTL5 is required to allow starting
of a conversion sequence which will then occur on each trigger event. Start of conversion means the
beginning of the sampling phase.
Read: Anytime
Write: Anytime
111 24
Module Base + 0x0005
76543210
R0
SC SCAN MULT CD CC CB CA
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 14-8. ATD Control Register 5 (ATDCTL5)
Table 14-14. ATDCTL5 Field Descriptions
Field Description
6
SC
Special Channel Conversion Bit — If this bit is set, then special channel conversion can be selected using CD,
CC, CB and CA of ATDCTL5. Table 14-15 lists the coding.
0 Special channel conversions disabled
1 Special channel conversions enabled
5
SCAN
Continuous Conversion Sequence Mode — This bit selects whether conversion sequences are performed
continuously or only once. If the external trigger function is enabled (ETRIGE=1) setting this bit has no effect,
thus the external trigger always starts a single conversion sequence.
0 Single conversion sequence
1 Continuous conversion sequences (scan mode)
Table 14-13. Sample Time Select
SMP2 SMP1 SMP0
Sample Time
in Number of
ATD Clock Cycles
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 459
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
4
MULT
Multi-Channel Sample Mode — When MULT is 0, the ATD sequence controller samples only from the specified
analog input channel for an entire conversion sequence. The analog channel is selected by channel selection
code (control bits CD/CC/CB/CA located in ATDCTL5). When MULT is 1, the ATD sequence controller samples
across channels. The number of channels sampled is determined by the sequence length value (S8C, S4C, S2C,
S1C). The first analog channel examined is determined by channel selection code (CD, CC, CB, CA control bits);
subsequent channels sampled in the sequence are determined by incrementing the channel selection code or
wrapping around to AN0 (channel 0).
0 Sample only one channel
1 Sample across several channels
3–0
CD, CC,
CB, CA
Analog Input Channel Select Code — These bits select the analog input channel(s). Table 14-15 lists the
coding used to select the various analog input channels.
In the case of single channel conversions (MULT=0), this selection code specifies the channel to be examined.
In the case of multiple channel conversions (MULT=1), this selection code specifies the first channel to be
examined in the conversion sequence. Subsequent channels are determined by incrementing the channel
selection code or wrapping around to AN0 (after converting the channel defined by the Wrap Around Channel
Select Bits WRAP3-0 in ATDCTL0). When starting with a channel number higher than the one defined by
WRAP3-0 the first wrap around will be AN16 to AN0.
Table 14-15. Analog Input Channel Select Coding
SC CD CC CB CA Analog Input
Channel
00000 AN0
0001 AN1
0010 AN2
0011 AN3
0100 AN4
0101 AN5
0110 AN6
0111 AN7
1000 AN8
1001 AN9
1 0 1 0 AN10
1 0 1 1 AN11
1 1 0 0 AN12
1 1 0 1 AN13
1 1 1 0 AN14
1 1 1 1 AN15
Table 14-14. ATDCTL5 Field Descriptions (continued)
Field Description
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
460 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
14.3.2.7 ATD Status Register 0 (ATDSTAT0)
This register contains the Sequence Complete Flag, overrun flags for external trigger and FIFO mode, and
the conversion counter.
Read: Anytime
Write: Anytime (No effect on (CC3, CC2, CC1, CC0))
1 0 0 0 0 Internal_6,
Temperature sense of ADC
hardmacro
0 0 0 1 Internal_7
0 0 1 0 Internal_0
0 0 1 1 Internal_1
0100 VRH
0101 VRL
0 1 1 0 (VRH+VRL) / 2
0 1 1 1 Reserved
1 0 0 0 Internal_2
1 0 0 1 Internal_3
1 0 1 0 Internal_4
1 0 1 1 Internal_5
1 1 X X Reserved
Module Base + 0x0006
76543210
R
SCF
0
ETORF FIFOR
CC3 CC2 CC1 CC0
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 14-9. ATD Status Register 0 (ATDSTAT0)
Table 14-15. Analog Input Channel Select Coding
SC CD CC CB CA Analog Input
Channel
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 461
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
14.3.2.8 ATD Compare Enable Register (ATDCMPE)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
Table 14-16. ATDSTAT0 Field Descriptions
Field Description
7
SCF
Sequence Complete Flag — This flag is set upon completion of a conversion sequence. If conversion
sequences are continuously performed (SCAN=1), the flag is set after each one is completed. This flag is cleared
when one of the following occurs:
A) Write “1” to SCF
B) Write to ATDCTL5 (a new conversion sequence is started)
C) If AFFC=1 and a result register is read
0 Conversion sequence not completed
1 Conversion sequence has completed
5
ETORF
External Trigger Overrun Flag — While in edge sensitive mode (ETRIGLE=0), if additional active edges are
detected while a conversion sequence is in process the overrun flag is set. This flag is cleared when one of the
following occurs:
A) Write “1” to ETORF
B) Write to ATDCTL0,1,2,3,4, ATDCMPE or ATDCMPHT (a conversion sequence is aborted)
C) Write to ATDCTL5 (a new conversion sequence is started)
0 No External trigger overrun error has occurred
1 External trigger overrun error has occurred
4
FIFOR
Result Register Overrun Flag — This bit indicates that a result register has been written to before its associated
conversion complete flag (CCF) has been cleared. This flag is most useful when using the FIFO mode because
the flag potentially indicates that result registers are out of sync with the input channels. However, it is also
practical for non-FIFO modes, and indicates that a result register has been overwritten before it has been read
(i.e. the old data has been lost). This flag is cleared when one of the following occurs:
A) Write “1” to FIFOR
B) Write to ATDCTL0,1,2,3,4, ATDCMPE or ATDCMPHT (a conversion sequence is aborted)
C) Write to ATDCTL5 (a new conversion sequence is started)
0 No overrun has occurred
1 Overrun condition exists (result register has been written while associated CCFx flag was still set)
3–0
CC[3:0]
Conversion Counter — These 4 read-only bits are the binary value of the conversion counter. The conversion
counter points to the result register that will receive the result of the current conversion. E.g. CC3=0, CC2=1,
CC1=1, CC0=0 indicates that the result of the current conversion will be in ATD Result Register 6. If in non-FIFO
mode (FIFO=0) the conversion counter is initialized to zero at the beginning and end of the conversion sequence.
If in FIFO mode (FIFO=1) the register counter is not initialized. The conversion counter wraps around when its
maximum value is reached.
Aborting a conversion or starting a new conversion clears the conversion counter even if FIFO=1.
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
462 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
14.3.2.9 ATD Status Register 2 (ATDSTAT2)
This read-only register contains the Conversion Complete Flags CCF[15:0].
Read: Anytime
Write: Anytime, no effect
Module Base + 0x0008
15 14 13 11 10 9 8 7 6 5 4 3 2 1 0
RCMPE[15:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 14-10. ATD Compare Enable Register (ATDCMPE)
Table 14-17. ATDCMPE Field Descriptions
Field Description
15–0
CMPE[15:0]
Compare Enable for Conversion Number n(n= 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) of a Sequence
(n conversion number, NOT channel number!) — These bits enable automatic compare of conversion results
individually for conversions of a sequence. The sense of each comparison is determined by the CMPHT[n] bit in
the ATDCMPHT register.
For each conversion number with CMPE[n]=1 do the following:
1) Write compare value to ATDDRnresult register
2) Write compare operator with CMPHT[n] in ATDCPMHT register
CCF[n] in ATDSTAT2 register will flag individual success of any comparison.
0 No automatic compare
1 Automatic compare of results for conversion n of a sequence is enabled.
Module Base + 0x000A
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R CCF[15:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 14-11. ATD Status Register 2 (ATDSTAT2)
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 463
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
14.3.2.10 ATD Input Enable Register (ATDDIEN)
Read: Anytime
Write: Anytime
Table 14-18. ATDSTAT2 Field Descriptions
Field Description
15–0
CCF[15:0]
Conversion Complete Flag n(n= 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) (n conversion number, NOT
channel number!)— A conversion complete flag is set at the end of each conversion in a sequence. The flags
are associated with the conversion position in a sequence (and also the result register number). Therefore in
non-fifo mode, CCF[4] is set when the fifth conversion in a sequence is complete and the result is available in
result register ATDDR4; CCF[5] is set when the sixth conversion in a sequence is complete and the result is
available in ATDDR5, and so forth.
If automatic compare of conversion results is enabled (CMPE[n]=1 in ATDCMPE), the conversion complete flag
is only set if comparison with ATDDRnis true. If ACMPIE=1 a compare interrupt will be requested. In this case,
as the ATDDRnresult register is used to hold the compare value, the result will not be stored there at the end of
the conversion but is lost.
A flag CCF[n] is cleared when one of the following occurs:
A) Write to ATDCTL5 (a new conversion sequence is started)
B) If AFFC=0, write “1” to CCF[n]
C) If AFFC=1 and CMPE[n]=0, read of result register ATDDRn
D) If AFFC=1 and CMPE[n]=1, write to result register ATDDRn
In case of a concurrent set and clear on CCF[n]: The clearing by method A) will overwrite the set. The clearing
by methods B) or C) or D) will be overwritten by the set.
0 Conversion number n not completed or successfully compared
1 If (CMPE[n]=0): Conversion number n has completed. Result is ready in ATDDRn.
If (CMPE[n]=1): Compare for conversion result number n with compare value in ATDDRn, using compare
operator CMPGT[n] is true. (No result available in ATDDRn)
Module Base + 0x000C
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
RIEN[15:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 14-12. ATD Input Enable Register (ATDDIEN)
Table 14-19. ATDDIEN Field Descriptions
Field Description
15–0
IEN[15:0]
ATD Digital Input Enable on channel x(x= 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5, 4, 3, 2, 1, 0) — This bit controls
the digital input buffer from the analog input pin (ANx) to the digital data register.
0 Disable digital input buffer to ANx pin
1 Enable digital input buffer on ANx pin.
Note: Setting this bit will enable the corresponding digital input buffer continuously. If this bit is set while
simultaneously using it as an analog port, there is potentially increased power consumption because the
digital input buffer maybe in the linear region.
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
464 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
14.3.2.11 ATD Compare Higher Than Register (ATDCMPHT)
Writes to this register will abort current conversion sequence.
Read: Anytime
Write: Anytime
14.3.2.12 ATD Conversion Result Registers (ATDDRn)
The A/D conversion results are stored in 16 result registers. Results are always in unsigned data
representation. Left and right justification is selected using the DJM control bit in ATDCTL3.
If automatic compare of conversions results is enabled (CMPE[n]=1 in ATDCMPE), these registers must
be written with the compare values in left or right justified format depending on the actual value of the
DJM bit. In this case, as the ATDDRn register is used to hold the compare value, the result will not be
stored there at the end of the conversion but is lost.
Attention, n is the conversion number, NOT the channel number!
Read: Anytime
Write: Anytime
NOTE
For conversions not using automatic compare, results are stored in the result
registers after each conversion. In this case avoid writing to ATDDRn except
for initial values, because an A/D result might be overwritten.
Module Base + 0x000E
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
RCMPHT[15:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 14-13. ATD Compare Higher Than Register (ATDCMPHT)
Table 14-20. ATDCMPHT Field Descriptions
Field Description
15–0
CMPHT[15:0]
Compare Operation Higher Than Enable for conversion number n(n= 15, 14, 13, 12, 11, 10, 9, 8, 7, 6, 5,
4, 3, 2, 1, 0) of a Sequence (n conversion number, NOT channel number!) — This bit selects the operator
for comparison of conversion results.
0 If result of conversion n is lower or same than compare value in ATDDRn, this is flagged in ATDSTAT2
1 If result of conversion n is higher than compare value in ATDDRn, this is flagged in ATDSTAT2
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 465
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14.3.2.12.1 Left Justified Result Data (DJM=0)
Table 14-21 shows how depending on the A/D resolution the conversion result is transferred to the ATD
result registers for left justified data. Compare is always done using all 12 bits of both the conversion result
and the compare value in ATDDRn.
14.3.2.12.2 Right Justified Result Data (DJM=1)
Module Base +
0x0010 = ATDDR0, 0x0012 = ATDDR1, 0x0014 = ATDDR2, 0x0016 = ATDDR3
0x0018 = ATDDR4, 0x001A = ATDDR5, 0x001C = ATDDR6, 0x001E = ATDDR7
0x0020 = ATDDR8, 0x0022 = ATDDR9, 0x0024 = ATDDR10, 0x0026 = ATDDR11
0x0028 = ATDDR12, 0x002A = ATDDR13, 0x002C = ATDDR14, 0x002E = ATDDR15
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
RResult-Bit[11:0] 0000
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 14-14. Left justified ATD conversion result register (ATDDRn)
Table 14-21. Conversion result mapping to ATDDRn
A/D
resolution DJM conversion result mapping to ATDDRn
8-bit data 0 Result-Bit[11:4] = conversion result,
Result-Bit[3:0]=0000
10-bit data 0 Result-Bit[11:2] = conversion result,
Result-Bit[1:0]=00
12-bit data 0 Result-Bit[11:0] = result
Module Base +
0x0010 = ATDDR0, 0x0012 = ATDDR1, 0x0014 = ATDDR2, 0x0016 = ATDDR3
0x0018 = ATDDR4, 0x001A = ATDDR5, 0x001C = ATDDR6, 0x001E = ATDDR7
0x0020 = ATDDR8, 0x0022 = ATDDR9, 0x0024 = ATDDR10, 0x0026 = ATDDR11
0x0028 = ATDDR12, 0x002A = ATDDR13, 0x002C = ATDDR14, 0x002E = ATDDR15
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R 0 000 Result-Bit[11:0]
W
Reset 0 0 0 0 0 0 0 0 0 0000000
= Unimplemented or Reserved
Figure 14-15. Right justified ATD conversion result register (ATDDRn)
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
466 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 14-22 shows how depending on the A/D resolution the conversion result is transferred to the ATD
result registers for right justified data. Compare is always done using all 12 bits of both the conversion
result and the compare value in ATDDRn.
14.4 Functional Description
The ADC12B16C consists of an analog sub-block and a digital sub-block.
14.4.1 Analog Sub-Block
The analog sub-block contains all analog electronics required to perform a single conversion. Separate
power supplies VDDA and VSSA allow to isolate noise of other MCU circuitry from the analog sub-block.
14.4.1.1 Sample and Hold Machine
The Sample and Hold Machine controls the storage and charge of the sample capacitor to the voltage level
of the analog signal at the selected ADC input channel.
During the sample process the analog input connects directly to the storage node.
The input analog signals are unipolar and must be within the potential range of VSSA to VDDA.
During the hold process the analog input is disconnected from the storage node.
14.4.1.2 Analog Input Multiplexer
The analog input multiplexer connects one of the 8 external analog input channels to the sample and hold
machine.
14.4.1.3 Analog-to-Digital (A/D) Machine
The A/D Machine performs analog to digital conversions. The resolution is program selectable to be either
8 or 10 or 12 bits. The A/D machine uses a successive approximation architecture. It functions by
comparing the sampled and stored analog voltage with a series of binary coded discrete voltages.
By following a binary search algorithm, the A/D machine identifies the discrete voltage that is nearest to
the sampled and stored voltage.
When not converting the A/D machine is automatically powered down.
Table 14-22. Conversion result mapping to ATDDRn
A/D
resolution DJM conversion result mapping to ATDDRn
8-bit data 1 Result-Bit[7:0] = result,
Result-Bit[11:8]=0000
10-bit data 1 Result-Bit[9:0] = result,
Result-Bit[11:10]=00
12-bit data 1 Result-Bit[11:0] = result
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 467
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Only analog input signals within the potential range of VRL to VRH (A/D reference potentials) will result
in a non-railed digital output code.
14.4.2 Digital Sub-Block
This subsection describes some of the digital features in more detail. See Section 14.3.2, “Register
Descriptions” for all details.
14.4.2.1 External Trigger Input
The external trigger feature allows the user to synchronize ATD conversions to an external event rather
than relying only on software to trigger the ATD module when a conversion is about to take place. The
external trigger signal (out of reset ATD channel 15, configurable in ATDCTL1) is programmable to be
edge or level sensitive with polarity control. Table 14-23 gives a brief description of the different
combinations of control bits and their effect on the external trigger function.
In either level or edge sensitive mode, the first conversion begins when the trigger is received.
Once ETRIGE is enabled a conversion must be triggered externally after writing to ATDCTL5 register.
During a conversion in edge sensitive mode, if additional trigger events are detected the overrun error flag
ETORF is set.
If level sensitive mode is active and the external trigger de-asserts and later asserts again during a
conversion sequence, this does not constitute an overrun. Therefore, the flag is not set. If the trigger is left
active in level sensitive mode when a sequence is about to complete, another sequence will be triggered
immediately.
Table 14-23. External Trigger Control Bits
ETRIGLE ETRIGP ETRIGE SCAN Description
X X 0 0 Ignores external trigger. Performs one
conversion sequence and stops.
X X 0 1 Ignores external trigger. Performs
continuous conversion sequences.
0 0 1 X Trigger falling edge sensitive. Performs
one conversion sequence per trigger.
0 1 1 X Trigger rising edge sensitive. Performs one
conversion sequence per trigger.
1 0 1 X Trigger low level sensitive. Performs
continuous conversions while trigger level
is active.
1 1 1 X Trigger high level sensitive. Performs
continuous conversions while trigger level
is active.
Analog-to-Digital Converter (ADC12B16CV2)
MC9S12G Family Reference Manual, Rev.1.06
468 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
14.4.2.2 General-Purpose Digital Port Operation
Each ATD input pin can be switched between analog or digital input functionality. An analog multiplexer
makes each ATD input pin selected as analog input available to the A/D converter.
The pad of the ATD input pin is always connected to the analog input channel of the analog mulitplexer.
Each pad input signal is buffered to the digital port register.
This buffer can be turned on or off with the ATDDIEN register for each ATD input pin.
This is important so that the buffer does not draw excess current when an ATD input pin is selected as
analog input to the ADC12B16C.
14.5 Resets
At reset the ADC12B16C is in a power down state. The reset state of each individual bit is listed within
the Register Description section (see Section 14.3.2, “Register Descriptions”) which details the registers
and their bit-field.
14.6 Interrupts
The interrupts requested by the ADC12B16C are listed in Table 14-24. Refer to MCU specification for
related vector address and priority.
See Section 14.3.2, “Register Descriptions” for further details.
Table 14-24. ATD Interrupt Vectors
Interrupt Source CCR
Mask Local Enable
Sequence Complete Interrupt I bit ASCIE in ATDCTL2
Compare Interrupt I bit ACMPIE in ATDCTL2
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 469
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 15
Digital Analog Converter (DAC_8B5V)
15.1 Revision History
Glossary
Table 15-1. Revision History Table
Rev. No.
(Item No.)
Data Sections
Affected Substantial Change(s)
0.1 28-Oct.-09 all Initial Version
0.4 28-Oct.-09 (Thomas Becker) all Initial Version
0.5 12-Nov.-09 (Thomas Becker) all Reworked all sections, renamed pin names
0.6 17-Nov.-09 (Thomas Becker) 1.2.4 Added CPU stop mode
0.7 18-Nov.-09 (Thomas Becker) 1.2, 1.3 Update block diagram, removed analog and digital submodule,
added section 1.3
0.8 04-Dec.-09 (Thomas Becker) 1.4.2 - changed reset value of FVR bit to 1’b1
- added new bit “Load” to DACCTL register
- removed S3 switch description
0.9 05-Jan.-10 (Thomas Becker) 1.3, 1.4.2.1, 1.5 - renamed register bit “Load” to “Drive”, request by analog team
- renamed pin DAC to DACU
0.91 13-Jan.-10 (Thomas Becker) 1.4.2.3 - added debug register
0.92 12-Feb.-10 (Thomas Becker) all - fixed typo
1.0 12-Apr.-10 1.4.2.1 Added DACCTL register bit DACDIEN
1.01 04-May-10, Table 1.2,
Section 1.4
Replaced VRL,VRL with variable
correct wrong figure, table numbering
1.02 12-May-10 Section 1.4 replaced ipt_test_mode with ips_test_access
new description/address of DACDEBUG register
1.1 25-May-10 15.4.2.1 Removed DACCTL register bit DACDIEN
1.2 25-Jun.-10 15.4 Correct table and figure title format
1.3 29-Jul.-10 15.2 Fixed typos
1.4 17-Nov.-10 15.2.2 Update the behavior of the DACU pin during stop mode
Table 15-2. Terminology
Term Meaning
DAC Digital to Analog Converter
VRL Low Reference Voltage
Digital Analog Converter (DAC_8B5V)
MC9S12G Family Reference Manual, Rev.1.06
470 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
15.2 Introduction
The DAC_8B5V module is a digital to analog converter. The converter works with a resolution of 8 bit and
generates an output voltage between VRL and VRH.
The module consists of configuration registers and two analog functional units, a DAC resistor network
and an operational amplifier.
The configuration registers provide all required control bits for the DAC resistor network and for the
operational amplifier.
The DAC resistor network generates the desired analog output voltage. The unbuffered voltage from the
DAC resistor network output can be routed to the external DACU pin. When enabled, the buffered voltage
from the operational amplifier output is available on the external AMP pin.
The operational amplifier is also stand alone usable.
Figure 15-1 shows the block diagram of the DAC_8B5V module.
15.2.1 Features
The DAC_8B5V module includes these distinctive features:
• 1 digital-analog converter channel with:
— 8 bit resolution
— full and reduced output voltage range
— buffered or unbuffered analog output voltage usable
• operational amplifier stand alone usable
15.2.2 Modes of Operation
The DAC_8B5V module behaves as follows in the system power modes:
1. CPU run mode
The functionality of the DAC_8B5V module is available.
2. CPU stop mode
Independent from the mode settings, the operational amplifier is disabled, switch S1 and S2 are
open.
VRH High Reference Voltage
FVR Full Voltage Range
SSC Special Single Chip
Table 15-2. Terminology (continued)
Term Meaning
Digital Analog Converter (DAC_8B5V)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 471
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
If the “Unbuffered DAC” mode was used before entering stop mode, then the DACU pin will reach
VRH voltage level during stop mode.
The content of the configuration registers is unchanged.
15.2.3 Block Diagram
Figure 15-1. DAC_8B5V Block Diagram
15.3 External Signal Description
This section lists the name and description of all external ports.
15.3.1 DACU Output Pin
This analog pin drives the unbuffered analog output voltage from the DAC resistor network output, if the
according mode is selected.
15.3.2 AMP Output Pin
This analog pin is used for the buffered analog output voltage from the operational amplifier output, if the
according mode is selected.
15.3.3 AMPP Input Pin
This analog input pin is used as input signal for the operational amplifier positive input pin, if the according
mode is selected.
+
–
Internal
Bus
Operational Amplifier
Resistor
Network
DACU
AMPM
AMP
AMPP
S1
S1
S2
S2
Configuration
Registers
DAC
S3
VRH
VRL
Digital Analog Converter (DAC_8B5V)
MC9S12G Family Reference Manual, Rev.1.06
472 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
15.3.4 AMPM Input Pin
This analog pin is used as input for the operational amplifier negative input pin, if the according mode is
selected.
15.4 Memory Map and Register Definition
This sections provides the detailed information of all registers for the DAC_8B5V module.
15.4.1 Register Summary
Figure 15-2 shows the summary of all implemented registers inside the DAC_8B5V module.
NOTE
Register Address = Module Base Address + Address Offset, where the
Module Base Address is defined at the MCU level and the Address Offset is
defined at the module level.
15.4.2 Register Descriptions
This section consists of register descriptions in address order. Each description includes a standard register
diagram with an associated figure number. Details of register bit and field function follow the register
diagrams, in bit order.
Address Offset
Register Name Bit 7 6 5 4 3 2 1 Bit 0
0x0000
DACCTL
R
FVR DRIVE
000
DACM[2:0]
W
0x0001
Reserved
R00000000
W
0x0002
DACVOL
R
VOLTAGE[7:0]
W
0x0003 - 0x0006
Reserved
R00000000
W
0x0007
Reserved
R
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
W
= Unimplemented
Figure 15-2. DAC_8B5V Register Summaryfv_dac_8b5v_RESERVED
Digital Analog Converter (DAC_8B5V)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 473
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
15.4.2.1 Control Register (DACCTL)
)
Module Base + 0x0000 Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
FVR DRIVE
000
DACM[2:0]
W
Reset 10000000
= Unimplemented
Figure 15-3. Control Register (DACCTL)
Table 15-3. DACCTL Field Description
Field Description
7
FVR
Full Voltage Range — This bit defines the voltage range of the DAC.
0 DAC resistor network operates with the reduced voltage range
1 DAC resistor network operates with the full voltage range
Note: For more details see Section 15.5.7, “Analog output voltage calculation”.
6
DRIVE
Drive Select — This bit selects the output drive capability of the operational amplifier, see electrical Spec. for
more details.
0 Low output drive for high resistive loads
1 High output drive for low resistive loads
2:0
DACM[2:0]
Mode Select — These bits define the mode of the DAC. A write access with an unsupported mode will be ignored.
000 Off
001 Operational Amplifier
100 Unbuffered DAC
101 Unbuffered DAC with Operational Amplifier
111 Buffered DAC
other Reserved
Digital Analog Converter (DAC_8B5V)
MC9S12G Family Reference Manual, Rev.1.06
474 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
15.4.2.2 Analog Output Voltage Level Register (DACVOL)
15.4.2.3 Reserved Register
15.5 Functional Description
15.5.1 Functional Overview
The DAC resistor network and the operational amplifier can be used together or stand alone. Following
modes are supported:
Module Base + 0x0002 Access: User read/write1
1Read: Anytime
Write: Anytime
76543210
R
VOLTAGE[7:0]
W
Reset 00000000
Figure 15-4. Analog Output Voltage Level Register (DACVOL)
Table 15-4. DACVOL Field Description
Field Description
7:0
VOLTAGE[7:0]
VOLTAGE — This register defines (together with the FVR bit) the analog output voltage. For more detail see
Equation 15-1 and Equation 15-2.
Module Base + 0x0007 Access: User read/write1
1Read: Anytime
Write: Only in special mode
76543210
R
Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
W
Reset xxxxxxxx
Figure 15-5. Reserved Registerfv_dac_8b5v_RESERVED
Table 15-5. DAC Modes of Operation
DACM[2:0]
Description
Submodules Output
DAC resistor
network
Operational
Amplifier
DACU AMP
Off 000 disabled disabled disconnected disconnected
Digital Analog Converter (DAC_8B5V)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 475
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The DAC resistor network itself can work on two different voltage ranges:
Table 15-7 shows the control signal decoding for each mode. For more detailed mode description see the
sections below.
15.5.2 Mode “Off”
The “Off” mode is the default mode after reset and is selected by DACCTL.DACM[2:0] = 0x0. During this
mode the DAC resistor network and the operational amplifier are disabled and all switches are open. This
mode provides the lowest power consumption. For decoding of the control signals see Table 15-7.
15.5.3 Mode “Operational Amplifier”
The “Operational Amplifier” mode is selected by DACCTL.DACM[2:0] = 0x1. During this mode the
operational amplifier can be used independent from the DAC resister network. All required amplifier
signals, AMP, AMPP and AMPM are available on the pins. The DAC resistor network output is
disconnected from the DACU pin. The connection between the amplifier output and the negative amplifier
input is open. For decoding of the control signals see Table 15-7.
Operational amplifier 001 disabled enabled disabled depend on AMPP
and AMPM input
Unbuffered DAC 100 enabled disabled unbuffered resistor
output voltage
disconnected
Unbuffered DAC with
Operational amplifier
101 enabled enabled unbuffered resistor
output voltage
depend on AMPP
and AMPM input
Buffered DAC 111 enabled enabled disconnected buffered resistor
output voltage
Table 15-6. DAC Resistor Network Voltage ranges
DAC Mode Description
Full Voltage Range (FVR) DAC resistor network provides a output voltage over the complete input voltage range,
default after reset
Reduced Voltage Range DAC resistor network provides a output voltage over a reduced input voltage range
Table 15-7. DAC Control Signals
DACM DAC resistor
network
Operational
Amplifier Switch S1 Switch S2 Switch S3
Off 000 disabled disabled open open open
Operational amplifier 001 disabled enabled closed open open
Unbuffered DAC 100 enabled disabled open open closed
Unbuffered DAC with
Operational amplifier
101 enabled enabled closed open closed
Buffered DAC 111 enabled enabled open closed open
Table 15-5. DAC Modes of Operation
Digital Analog Converter (DAC_8B5V)
MC9S12G Family Reference Manual, Rev.1.06
476 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
15.5.4 Mode “Unbuffered DAC”
The “Unbuffered DAC” mode is selected by DACCNTL.DACM[2:0] = 0x4. During this mode the
unbuffered analog voltage from the DAC resistor network output is available on the DACU output pin. The
operational amplifier is disabled and the operational amplifier signals are disconnected from the AMP pins.
For decoding of the control signals see Table 15-7.
15.5.5 Mode “Unbuffered DAC with Operational Amplifier”
The “Unbuffered DAC with Operational Amplifier” mode is selected by DACCTL.DACM[2:0] = 0x5.
During this mode the DAC resistor network and the operational amplifier are enabled and usable
independent from each other. The unbuffered analog voltage from the DAC resistor network output is
available on the DACU output pin.
The operational amplifier is disconnected from the DAC resistor network. All required amplifier signals,
AMP, AMPP and AMPM are available on the pins. The connection between the amplifier output and the
negative amplifier input is open. For decoding of the control signals see Table 15-7.
15.5.6 Mode “Buffered DAC”
The “Buffered DAC” mode is selected by DACCTL.DACM[2:0] = 0x7. During this is mode the DAC
resistor network and the operational amplifier are enabled. The analog output voltage from the DAC
resistor network output is buffered by the operational amplifier and is available on the AMP output pin.
The DAC resistor network output is disconnected from the DACU pin. For the decoding of the control
signals see Table 15-7.
15.5.7 Analog output voltage calculation
The DAC can provide an analog output voltage in two different voltage ranges:
• FVR = 0, reduced voltage range
The DAC generates an analog output voltage inside the range from 0.1 x (VRH - VRL) + VRL to
0.9 x (VRH-VRL) + VRL with a resolution ((VRH-VRL) x 0.8) / 256, see equation below:
analog output voltage = VOLATGE[7:0] x ((VRH-VRL) x 0.8) / 256) + 0.1 x (VRH-VRL) + VRL Eqn. 15-1
• FVR = 1, full voltage range
The DAC generates an analog output voltage inside the range from VRL to VRH with a resolution
(VRH-VRL) / 256, see equation below:
analog output voltage = VOLTAGE[7:0] x (VRH-VRL) / 256 +VRL Eqn. 15-2
Digital Analog Converter (DAC_8B5V)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 477
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
See Table 15-8 for an example for VRL = 0.0 V and VRH = 5.0 V.
Table 15-8. Analog output voltage calculation
FVR min.
voltage
max.
voltage Resolution Equation
0 0.5V 4.484V 15.625mV VOLTAGE[7:0] x (4.0V) / 256) + 0.5V
1 0.0V 4.980V 19.531mV VOLTAGE[7:0] x (5.0V) / 256
Digital Analog Converter (DAC_8B5V)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 478
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Digital Analog Converter (DAC_8B5V)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 479
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Digital Analog Converter (DAC_8B5V)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 480
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 481
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 16
Freescale’s Scalable Controller Area Network
(S12MSCANV3)
16.1 Introduction
Freescale’s scalable controller area network (S12MSCANV3) definition is based on the MSCAN12
definition, which is the specific implementation of the MSCAN concept targeted for the M68HC12
microcontroller family.
The module is a communication controller implementing the CAN 2.0A/B protocol as defined in the
Bosch specification dated September 1991. For users to fully understand the MSCAN specification, it is
recommended that the Bosch specification be read first to familiarize the reader with the terms and
concepts contained within this document.
Though not exclusively intended for automotive applications, CAN protocol is designed to meet the
specific requirements of a vehicle serial data bus: real-time processing, reliable operation in the EMI
environment of a vehicle, cost-effectiveness, and required bandwidth.
MSCAN uses an advanced buffer arrangement resulting in predictable real-time behavior and simplified
application software.
Table 16-1. Revision History
Revision
Number Revision Date Sections
Affected Description of Changes
V03.11 31 Mar 2009 • Orthographic corrections
V03.12 09 Aug 2010 Table 16-37 • Added ‘Bosch CAN 2.0A/B’ to bit time settings table
V03.13 03 Mar 2011 Figure 16-4
Table 16-3
• Corrected CANE write restrictions
• Removed footnote from RXFRM bit
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
482 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.1.1 Glossary
16.1.2 Block Diagram
Figure 16-1. MSCAN Block Diagram
Table 16-2. Terminology
ACK Acknowledge of CAN message
CAN Controller Area Network
CRC Cyclic Redundancy Code
EOF End of Frame
FIFO First-In-First-Out Memory
IFS Inter-Frame Sequence
SOF Start of Frame
CPU bus CPU related read/write data bus
CAN bus CAN protocol related serial bus
oscillator clock Direct clock from external oscillator
bus clock CPU bus related clock
CAN clock CAN protocol related clock
RXCAN
TXCAN
Receive/
Transmit
Engine
Message
Filtering
and
Buffering
Control
and
Status
Wake-Up Interrupt Req.
Errors Interrupt Req.
Receive Interrupt Req.
Transmit Interrupt Req.
CANCLK
Bus Clock
Configuration
Oscillator Clock
MUX
Presc.
Tq Clk
MSCAN
Low Pass Filter
Wake-Up
Registers
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 483
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.1.3 Features
The basic features of the MSCAN are as follows:
• Implementation of the CAN protocol — Version 2.0A/B
— Standard and extended data frames
— Zero to eight bytes data length
— Programmable bit rate up to 1 Mbps1
— Support for remote frames
• Five receive buffers with FIFO storage scheme
• Three transmit buffers with internal prioritization using a “local priority” concept
• Flexible maskable identifier filter supports two full-size (32-bit) extended identifier filters, or four
16-bit filters, or eight 8-bit filters
• Programmable wake-up functionality with integrated low-pass filter
• Programmable loopback mode supports self-test operation
• Programmable listen-only mode for monitoring of CAN bus
• Programmable bus-off recovery functionality
• Separate signalling and interrupt capabilities for all CAN receiver and transmitter error states
(warning, error passive, bus-off)
• Programmable MSCAN clock source either bus clock or oscillator clock
• Internal timer for time-stamping of received and transmitted messages
• Three low-power modes: sleep, power down, and MSCAN enable
• Global initialization of configuration registers
16.1.4 Modes of Operation
For a description of the specific MSCAN modes and the module operation related to the system operating
modes refer to Section 16.4.4, “Modes of Operation”.
16.2 External Signal Description
The MSCAN uses two external pins.
NOTE
On MCUs with an integrated CAN physical interface (transceiver) the
MSCAN interface is connected internally to the transceiver interface. In
these cases the external availability of signals TXCAN and RXCAN is
optional.
16.2.1 RXCAN — CAN Receiver Input Pin
RXCAN is the MSCAN receiver input pin.
1. Depending on the actual bit timing and the clock jitter of the PLL.
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
484 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.2.2 TXCAN — CAN Transmitter Output Pin
TXCAN is the MSCAN transmitter output pin. The TXCAN output pin represents the logic level on the
CAN bus:
0 = Dominant state
1 = Recessive state
16.2.3 CAN System
A typical CAN system with MSCAN is shown in Figure 16-2. Each CAN station is connected physically
to the CAN bus lines through a transceiver device. The transceiver is capable of driving the large current
needed for the CAN bus and has current protection against defective CAN or defective stations.
Figure 16-2. CAN System
16.3 Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the MSCAN.
16.3.1 Module Memory Map
Figure 16-3 gives an overview on all registers and their individual bits in the MSCAN memory map. The
register address results from the addition of base address and address offset. The base address is
determined at the MCU level and can be found in the MCU memory map description. The address offset
is defined at the module level.
The MSCAN occupies 64 bytes in the memory space. The base address of the MSCAN module is
determined at the MCU level when the MCU is defined. The register decode map is fixed and begins at the
first address of the module address offset.
CAN Bus
CAN Controller
(MSCAN)
Transceiver
CAN node 1
CAN node 2
CAN node n
CANL
CANH
MCU
TXCAN RXCAN
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 485
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The detailed register descriptions follow in the order they appear in the register map.
Register
Name Bit 7 6 5 4 3 2 1 Bit 0
0x0000
CANCTL0
RRXFRM RXACT CSWAI SYNCH TIME WUPE SLPRQ INITRQ
W
0x0001
CANCTL1
RCANE CLKSRC LOOPB LISTEN BORM WUPM SLPAK INITAK
W
0x0002
CANBTR0
RSJW1 SJW0 BRP5 BRP4 BRP3 BRP2 BRP1 BRP0
W
0x0003
CANBTR1
RSAMP TSEG22 TSEG21 TSEG20 TSEG13 TSEG12 TSEG11 TSEG10
W
0x0004
CANRFLG
RWUPIF CSCIF RSTAT1 RSTAT0 TSTAT1 TSTAT0 OVRIF RXF
W
0x0005
CANRIER
RWUPIE CSCIE RSTATE1 RSTATE0 TSTATE1 TSTATE0 OVRIE RXFIE
W
0x0006
CANTFLG
R0 0000
TXE2 TXE1 TXE0
W
0x0007
CANTIER
R00000
TXEIE2 TXEIE1 TXEIE0
W
0x0008
CANTARQ
R00000
ABTRQ2 ABTRQ1 ABTRQ0
W
0x0009
CANTAAK
R00000ABTAK2 ABTAK1 ABTAK0
W
0x000A
CANTBSEL
R00000
TX2 TX1 TX0
W
0x000B
CANIDAC
R0 0 IDAM1 IDAM0 0 IDHIT2 IDHIT1 IDHIT0
W
0x000C
Reserved
R00000000
W
0x000D
CANMISC
R0000000
BOHOLD
W
= Unimplemented or Reserved
Figure 16-3. MSCAN Register Summary
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
486 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.3.2 Register Descriptions
This section describes in detail all the registers and register bits in the MSCAN module. Each description
includes a standard register diagram with an associated figure number. Details of register bit and field
function follow the register diagrams, in bit order. All bits of all registers in this module are completely
synchronous to internal clocks during a register read.
16.3.2.1 MSCAN Control Register 0 (CANCTL0)
The CANCTL0 register provides various control bits of the MSCAN module as described below.
0x000E
CANRXERR
R RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0
W
0x000F
CANTXERR
R TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0
W
0x0010–0x0013
CANIDAR0–3
RAC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0
W
0x0014–0x0017
CANIDMRx
RAM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0
W
0x0018–0x001B
CANIDAR4–7
RAC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0
W
0x001C–0x001F
CANIDMR4–7
RAM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0
W
0x0020–0x002F
CANRXFG
RSee Section 16.3.3, “Programmer’s Model of Message Storage”
W
0x0030–0x003F
CANTXFG
RSee Section 16.3.3, “Programmer’s Model of Message Storage”
W
Register
Name Bit 7 6 5 4 3 2 1 Bit 0
= Unimplemented or Reserved
Figure 16-3. MSCAN Register Summary (continued)
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 487
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
The CANCTL0 register, except WUPE, INITRQ, and SLPRQ, is held in the
reset state when the initialization mode is active (INITRQ = 1 and
INITAK = 1). This register is writable again as soon as the initialization
mode is exited (INITRQ = 0 and INITAK = 0).
Module Base + 0x0000 Access: User read/write1
1Read: Anytime
Write: Anytime when out of initialization mode; exceptions are read-only RXACT and SYNCH, RXFRM (which is set by the
module only), and INITRQ (which is also writable in initialization mode)
76543210
R
RXFRM
RXACT
CSWAI
SYNCH
TIME WUPE SLPRQ INITRQ
W
Reset: 00000001
= Unimplemented
Figure 16-4. MSCAN Control Register 0 (CANCTL0)
Table 16-3. CANCTL0 Register Field Descriptions
Field Description
7
RXFRM
Received Frame Flag — This bit is read and clear only. It is set when a receiver has received a valid message
correctly, independently of the filter configuration. After it is set, it remains set until cleared by software or reset.
Clearing is done by writing a 1. Writing a 0 is ignored. This bit is not valid in loopback mode.
0 No valid message was received since last clearing this flag
1 A valid message was received since last clearing of this flag
6
RXACT
Receiver Active Status — This read-only flag indicates the MSCAN is receiving a message1. The flag is
controlled by the receiver front end. This bit is not valid in loopback mode.
0 MSCAN is transmitting or idle
1 MSCAN is receiving a message (including when arbitration is lost)
5
CSWAI2CAN Stops in Wait Mode — Enabling this bit allows for lower power consumption in wait mode by disabling all
the clocks at the CPU bus interface to the MSCAN module.
0 The module is not affected during wait mode
1 The module ceases to be clocked during wait mode
4
SYNCH
Synchronized Status — This read-only flag indicates whether the MSCAN is synchronized to the CAN bus and
able to participate in the communication process. It is set and cleared by the MSCAN.
0 MSCAN is not synchronized to the CAN bus
1 MSCAN is synchronized to the CAN bus
3
TIME
Timer Enable — This bit activates an internal 16-bit wide free running timer which is clocked by the bit clock rate.
If the timer is enabled, a 16-bit time stamp will be assigned to each transmitted/received message within the
active TX/RX buffer. Right after the EOF of a valid message on the CAN bus, the time stamp is written to the
highest bytes (0x000E, 0x000F) in the appropriate buffer (see Section 16.3.3, “Programmer’s Model of Message
Storage”). The internal timer is reset (all bits set to 0) when disabled. This bit is held low in initialization mode.
0 Disable internal MSCAN timer
1 Enable internal MSCAN timer
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
488 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.3.2.2 MSCAN Control Register 1 (CANCTL1)
The CANCTL1 register provides various control bits and handshake status information of the MSCAN
module as described below.
2
WUPE3Wake-Up Enable — This configuration bit allows the MSCAN to restart from sleep mode or from power down
mode (entered from sleep) when traffic on CAN is detected (see Section 16.4.5.5, “MSCAN Sleep Mode”). This
bit must be configured before sleep mode entry for the selected function to take effect.
0 Wake-up disabled — The MSCAN ignores traffic on CAN
1 Wake-up enabled — The MSCAN is able to restart
1
SLPRQ4Sleep Mode Request — This bit requests the MSCAN to enter sleep mode, which is an internal power saving
mode (see Section 16.4.5.5, “MSCAN Sleep Mode”). The sleep mode request is serviced when the CAN bus is
idle, i.e., the module is not receiving a message and all transmit buffers are empty. The module indicates entry
to sleep mode by setting SLPAK = 1 (see Section 16.3.2.2, “MSCAN Control Register 1 (CANCTL1)”). SLPRQ
cannot be set while the WUPIF flag is set (see Section 16.3.2.5, “MSCAN Receiver Flag Register (CANRFLG)”).
Sleep mode will be active until SLPRQ is cleared by the CPU or, depending on the setting of WUPE, the MSCAN
detects activity on the CAN bus and clears SLPRQ itself.
0 Running — The MSCAN functions normally
1 Sleep mode request — The MSCAN enters sleep mode when CAN bus idle
0
INITRQ5,6 Initialization Mode Request — When this bit is set by the CPU, the MSCAN skips to initialization mode (see
Section 16.4.4.5, “MSCAN Initialization Mode”). Any ongoing transmission or reception is aborted and
synchronization to the CAN bus is lost. The module indicates entry to initialization mode by setting INITAK = 1
(Section 16.3.2.2, “MSCAN Control Register 1 (CANCTL1)”).
The following registers enter their hard reset state and restore their default values: CANCTL07, CANRFLG8,
CANRIER9, CANTFLG, CANTIER, CANTARQ, CANTAAK, and CANTBSEL.
The registers CANCTL1, CANBTR0, CANBTR1, CANIDAC, CANIDAR0-7, and CANIDMR0-7 can only be
written by the CPU when the MSCAN is in initialization mode (INITRQ = 1 and INITAK = 1). The values of the
error counters are not affected by initialization mode.
When this bit is cleared by the CPU, the MSCAN restarts and then tries to synchronize to the CAN bus. If the
MSCAN is not in bus-off state, it synchronizes after 11 consecutive recessive bits on the CAN bus; if the MSCAN
is in bus-off state, it continues to wait for 128 occurrences of 11 consecutive recessive bits.
Writing to other bits in CANCTL0, CANRFLG, CANRIER, CANTFLG, or CANTIER must be done only after
initialization mode is exited, which is INITRQ = 0 and INITAK = 0.
0 Normal operation
1 MSCAN in initialization mode
1See the Bosch CAN 2.0A/B specification for a detailed definition of transmitter and receiver states.
2In order to protect from accidentally violating the CAN protocol, TXCAN is immediately forced to a recessive state when the
CPU enters wait (CSWAI = 1) or stop mode (see Section 16.4.5.2, “Operation in Wait Mode” and Section 16.4.5.3, “Operation
in Stop Mode”).
3The CPU has to make sure that the WUPE register and the WUPIE wake-up interrupt enable register (see Section 16.3.2.6,
“MSCAN Receiver Interrupt Enable Register (CANRIER)) is enabled, if the recovery mechanism from stop or wait is required.
4The CPU cannot clear SLPRQ before the MSCAN has entered sleep mode (SLPRQ = 1 and SLPAK = 1).
5The CPU cannot clear INITRQ before the MSCAN has entered initialization mode (INITRQ = 1 and INITAK = 1).
6In order to protect from accidentally violating the CAN protocol, TXCAN is immediately forced to a recessive state when the
initialization mode is requested by the CPU. Thus, the recommended procedure is to bring the MSCAN into sleep mode
(SLPRQ = 1 and SLPAK = 1) before requesting initialization mode.
7Not including WUPE, INITRQ, and SLPRQ.
8TSTAT1 and TSTAT0 are not affected by initialization mode.
9RSTAT1 and RSTAT0 are not affected by initialization mode.
Table 16-3. CANCTL0 Register Field Descriptions (continued)
Field Description
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 489
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Module Base + 0x0001 Access: User read/write1
1Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1), except CANE which is write once in normal and anytime in
special system operation modes when the MSCAN is in initialization mode (INITRQ = 1 and INITAK = 1)
76543210
R
CANE CLKSRC LOOPB LISTEN BORM WUPM
SLPAK INITAK
W
Reset: 00010001
= Unimplemented
Figure 16-5. MSCAN Control Register 1 (CANCTL1)
Table 16-4. CANCTL1 Register Field Descriptions
Field Description
7
CANE
MSCAN Enable
0 MSCAN module is disabled
1 MSCAN module is enabled
6
CLKSRC
MSCAN Clock Source — This bit defines the clock source for the MSCAN module (only for systems with a clock
generation module; Section 16.4.3.2, “Clock System,” and Section Figure 16-43., “MSCAN Clocking Scheme,”).
0 MSCAN clock source is the oscillator clock
1 MSCAN clock source is the bus clock
5
LOOPB
Loopback Self Test Mode — When this bit is set, the MSCAN performs an internal loopback which can be used
for self test operation. The bit stream output of the transmitter is fed back to the receiver internally. The RXCAN
input is ignored and the TXCAN output goes to the recessive state (logic 1). The MSCAN behaves as it does
normally when transmitting and treats its own transmitted message as a message received from a remote node.
In this state, the MSCAN ignores the bit sent during the ACK slot in the CAN frame acknowledge field to ensure
proper reception of its own message. Both transmit and receive interrupts are generated.
0 Loopback self test disabled
1 Loopback self test enabled
4
LISTEN
Listen Only Mode — This bit configures the MSCAN as a CAN bus monitor. When LISTEN is set, all valid CAN
messages with matching ID are received, but no acknowledgement or error frames are sent out (see
Section 16.4.4.4, “Listen-Only Mode”). In addition, the error counters are frozen. Listen only mode supports
applications which require “hot plugging” or throughput analysis. The MSCAN is unable to transmit any
messages when listen only mode is active.
0 Normal operation
1 Listen only mode activated
3
BORM
Bus-Off Recovery Mode — This bit configures the bus-off state recovery mode of the MSCAN. Refer to
Section 16.5.2, “Bus-Off Recovery,” for details.
0 Automatic bus-off recovery (see Bosch CAN 2.0A/B protocol specification)
1 Bus-off recovery upon user request
2
WUPM
Wake-Up Mode — If WUPE in CANCTL0 is enabled, this bit defines whether the integrated low-pass filter is
applied to protect the MSCAN from spurious wake-up (see Section 16.4.5.5, “MSCAN Sleep Mode”).
0 MSCAN wakes up on any dominant level on the CAN bus
1 MSCAN wakes up only in case of a dominant pulse on the CAN bus that has a length of Twup
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
490 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.3.2.3 MSCAN Bus Timing Register 0 (CANBTR0)
The CANBTR0 register configures various CAN bus timing parameters of the MSCAN module.
1
SLPAK
Sleep Mode Acknowledge — This flag indicates whether the MSCAN module has entered sleep mode (see
Section 16.4.5.5, “MSCAN Sleep Mode”). It is used as a handshake flag for the SLPRQ sleep mode request.
Sleep mode is active when SLPRQ = 1 and SLPAK = 1. Depending on the setting of WUPE, the MSCAN will
clear the flag if it detects activity on the CAN bus while in sleep mode.
0 Running — The MSCAN operates normally
1 Sleep mode active — The MSCAN has entered sleep mode
0
INITAK
Initialization Mode Acknowledge — This flag indicates whether the MSCAN module is in initialization mode
(see Section 16.4.4.5, “MSCAN Initialization Mode”). It is used as a handshake flag for the INITRQ initialization
mode request. Initialization mode is active when INITRQ = 1 and INITAK = 1. The registers CANCTL1,
CANBTR0, CANBTR1, CANIDAC, CANIDAR0–CANIDAR7, and CANIDMR0–CANIDMR7 can be written only by
the CPU when the MSCAN is in initialization mode.
0 Running — The MSCAN operates normally
1 Initialization mode active — The MSCAN has entered initialization mode
Module Base + 0x0002 Access: User read/write1
1Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
76543210
R
SJW1 SJW0 BRP5 BRP4 BRP3 BRP2 BRP1 BRP0
W
Reset: 00000000
Figure 16-6. MSCAN Bus Timing Register 0 (CANBTR0)
Table 16-5. CANBTR0Register Field Descriptions
Field Description
7-6
SJW[1:0]
Synchronization Jump Width — The synchronization jump width defines the maximum number of time quanta
(Tq) clock cycles a bit can be shortened or lengthened to achieve resynchronization to data transitions on the
CAN bus (see Table 16-6).
5-0
BRP[5:0]
Baud Rate Prescaler — These bits determine the time quanta (Tq) clock which is used to build up the bit timing
(see Table 16-7).
Table 16-6. Synchronization Jump Width
SJW1 SJW0 Synchronization Jump Width
0 0 1 Tq clock cycle
0 1 2 Tq clock cycles
1 0 3 Tq clock cycles
1 1 4 Tq clock cycles
Table 16-4. CANCTL1 Register Field Descriptions (continued)
Field Description
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
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16.3.2.4 MSCAN Bus Timing Register 1 (CANBTR1)
The CANBTR1 register configures various CAN bus timing parameters of the MSCAN module.
Table 16-7. Baud Rate Prescaler
BRP5 BRP4 BRP3 BRP2 BRP1 BRP0 Prescaler value (P)
000000 1
000001 2
000010 3
000011 4
:::::: :
111111 64
Module Base + 0x0003 Access: User read/write1
1Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
76543210
R
SAMP TSEG22 TSEG21 TSEG20 TSEG13 TSEG12 TSEG11 TSEG10
W
Reset: 00000000
Figure 16-7. MSCAN Bus Timing Register 1 (CANBTR1)
Table 16-8. CANBTR1 Register Field Descriptions
Field Description
7
SAMP
Sampling — This bit determines the number of CAN bus samples taken per bit time.
0 One sample per bit.
1 Three samples per bit1.
If SAMP = 0, the resulting bit value is equal to the value of the single bit positioned at the sample point. If
SAMP = 1, the resulting bit value is determined by using majority rule on the three total samples. For higher bit
rates, it is recommended that only one sample is taken per bit time (SAMP = 0).
1In this case, PHASE_SEG1 must be at least 2 time quanta (Tq).
6-4
TSEG2[2:0]
Time Segment 2 — Time segments within the bit time fix the number of clock cycles per bit time and the location
of the sample point (see Figure 16-44). Time segment 2 (TSEG2) values are programmable as shown in
Table 16-9.
3-0
TSEG1[3:0]
Time Segment 1 — Time segments within the bit time fix the number of clock cycles per bit time and the location
of the sample point (see Figure 16-44). Time segment 1 (TSEG1) values are programmable as shown in
Table 16-10.
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MC9S12G Family Reference Manual, Rev.1.06
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The bit time is determined by the oscillator frequency, the baud rate prescaler, and the number of time
quanta (Tq) clock cycles per bit (as shown in Table 16-9 and Table 16-10).
Eqn. 16-1
16.3.2.5 MSCAN Receiver Flag Register (CANRFLG)
A flag can be cleared only by software (writing a 1 to the corresponding bit position) when the condition
which caused the setting is no longer valid. Every flag has an associated interrupt enable bit in the
CANRIER register.
Table 16-9. Time Segment 2 Values
TSEG22 TSEG21 TSEG20 Time Segment 2
0 0 0 1 Tq clock cycle1
1This setting is not valid. Please refer to Table 16-37 for valid settings.
0 0 1 2 Tq clock cycles
::: :
1 1 0 7 Tq clock cycles
1 1 1 8 Tq clock cycles
Table 16-10. Time Segment 1 Values
TSEG13 TSEG12 TSEG11 TSEG10 Time segment 1
0 0 0 0 1 Tq clock cycle1
1This setting is not valid. Please refer to Table 16-37 for valid settings.
0 0 0 1 2 Tq clock cycles1
0 0 1 0 3 Tq clock cycles1
0 0 1 1 4 Tq clock cycles
:::: :
1 1 1 0 15 Tq clock cycles
1 1 1 1 16 Tq clock cycles
Bit Time Prescaler value()
fCANCLK
------------------------------------------------------1 TimeSegment1 TimeSegment2++()•=
Freescale’s Scalable Controller Area Network (S12MSCANV3)
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NOTE
The CANRFLG register is held in the reset state1 when the initialization
mode is active (INITRQ = 1 and INITAK = 1). This register is writable again
as soon as the initialization mode is exited (INITRQ = 0 and INITAK = 0).
Module Base + 0x0004 Access: User read/write1
1Read: Anytime
Write: Anytime when not in initialization mode, except RSTAT[1:0] and TSTAT[1:0] flags which are read-only; write of 1 clears
flag; write of 0 is ignored
76543210
R
WUPIF CSCIF
RSTAT1 RSTAT0 TSTAT1 TSTAT0
OVRIF RXF
W
Reset: 00000000
= Unimplemented
Figure 16-8. MSCAN Receiver Flag Register (CANRFLG)
1. The RSTAT[1:0], TSTAT[1:0] bits are not affected by initialization mode.
Table 16-11. CANRFLG Register Field Descriptions
Field Description
7
WUPIF
Wake-Up Interrupt Flag — If the MSCAN detects CAN bus activity while in sleep mode (see Section 16.4.5.5,
“MSCAN Sleep Mode,”) and WUPE = 1 in CANTCTL0 (see Section 16.3.2.1, “MSCAN Control Register 0
(CANCTL0)”), the module will set WUPIF. If not masked, a wake-up interrupt is pending while this flag is set.
0 No wake-up activity observed while in sleep mode
1 MSCAN detected activity on the CAN bus and requested wake-up
6
CSCIF
CAN Status Change Interrupt Flag — This flag is set when the MSCAN changes its current CAN bus status
due to the actual value of the transmit error counter (TEC) and the receive error counter (REC). An additional
4-bit (RSTAT[1:0], TSTAT[1:0]) status register, which is split into separate sections for TEC/REC, informs the
system on the actual CAN bus status (see Section 16.3.2.6, “MSCAN Receiver Interrupt Enable Register
(CANRIER)”). If not masked, an error interrupt is pending while this flag is set. CSCIF provides a blocking
interrupt. That guarantees that the receiver/transmitter status bits (RSTAT/TSTAT) are only updated when no
CAN status change interrupt is pending. If the TECs/RECs change their current value after the CSCIF is
asserted, which would cause an additional state change in the RSTAT/TSTAT bits, these bits keep their status
until the current CSCIF interrupt is cleared again.
0 No change in CAN bus status occurred since last interrupt
1 MSCAN changed current CAN bus status
5-4
RSTAT[1:0]
Receiver Status Bits — The values of the error counters control the actual CAN bus status of the MSCAN. As
soon as the status change interrupt flag (CSCIF) is set, these bits indicate the appropriate receiver related CAN
bus status of the MSCAN. The coding for the bits RSTAT1, RSTAT0 is:
00 RxOK: 0 ≤ receive error counter ≤ 96
01 RxWRN: 96 < receive error counter ≤ 127
10 RxERR: 127 < receive error counter
11 Bus-off1: transmit error counter > 255
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
494 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.3.2.6 MSCAN Receiver Interrupt Enable Register (CANRIER)
This register contains the interrupt enable bits for the interrupt flags described in the CANRFLG register.
NOTE
The CANRIER register is held in the reset state when the initialization mode
is active (INITRQ=1 and INITAK=1). This register is writable when not in
initialization mode (INITRQ=0 and INITAK=0).
The RSTATE[1:0], TSTATE[1:0] bits are not affected by initialization
mode.
3-2
TSTAT[1:0]
Transmitter Status Bits — The values of the error counters control the actual CAN bus status of the MSCAN.
As soon as the status change interrupt flag (CSCIF) is set, these bits indicate the appropriate transmitter related
CAN bus status of the MSCAN. The coding for the bits TSTAT1, TSTAT0 is:
00 TxOK: 0 ≤transmit error counter ≤ 96
01 TxWRN: 96 < transmit error counter ≤ 127
10 TxERR: 127 < transmit error counter ≤ 255
11 Bus-Off: transmit error counter > 255
1
OVRIF
Overrun Interrupt Flag — This flag is set when a data overrun condition occurs. If not masked, an error interrupt
is pending while this flag is set.
0 No data overrun condition
1 A data overrun detected
0
RXF2Receive Buffer Full Flag — RXF is set by the MSCAN when a new message is shifted in the receiver FIFO.
This flag indicates whether the shifted buffer is loaded with a correctly received message (matching identifier,
matching cyclic redundancy code (CRC) and no other errors detected). After the CPU has read that message
from the RxFG buffer in the receiver FIFO, the RXF flag must be cleared to release the buffer. A set RXF flag
prohibits the shifting of the next FIFO entry into the foreground buffer (RxFG). If not masked, a receive interrupt
is pending while this flag is set.
0 No new message available within the RxFG
1 The receiver FIFO is not empty. A new message is available in the RxFG
1Redundant Information for the most critical CAN bus status which is “bus-off”. This only occurs if the Tx error counter exceeds
a number of 255 errors. Bus-off affects the receiver state. As soon as the transmitter leaves its bus-off state the receiver state
skips to RxOK too. Refer also to TSTAT[1:0] coding in this register.
2To ensure data integrity, do not read the receive buffer registers while the RXF flag is cleared. For MCUs with dual CPUs,
reading the receive buffer registers while the RXF flag is cleared may result in a CPU fault condition.
Module Base + 0x0005 Access: User read/write1
1Read: Anytime
Write: Anytime when not in initialization mode
76543210
R
WUPIE CSCIE RSTATE1 RSTATE0 TSTATE1 TSTATE0 OVRIE RXFIE
W
Reset: 00000000
Figure 16-9. MSCAN Receiver Interrupt Enable Register (CANRIER)
Table 16-11. CANRFLG Register Field Descriptions (continued)
Field Description
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 495
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.3.2.7 MSCAN Transmitter Flag Register (CANTFLG)
The transmit buffer empty flags each have an associated interrupt enable bit in the CANTIER register.
Table 16-12. CANRIER Register Field Descriptions
Field Description
7
WUPIE1
1WUPIE and WUPE (see Section 16.3.2.1, “MSCAN Control Register 0 (CANCTL0)”) must both be enabled if the recovery
mechanism from stop or wait is required.
Wake-Up Interrupt Enable
0 No interrupt request is generated from this event.
1 A wake-up event causes a Wake-Up interrupt request.
6
CSCIE
CAN Status Change Interrupt Enable
0 No interrupt request is generated from this event.
1 A CAN Status Change event causes an error interrupt request.
5-4
RSTATE[1:0]
Receiver Status Change Enable — These RSTAT enable bits control the sensitivity level in which receiver state
changes are causing CSCIF interrupts. Independent of the chosen sensitivity level the RSTAT flags continue to
indicate the actual receiver state and are only updated if no CSCIF interrupt is pending.
00 Do not generate any CSCIF interrupt caused by receiver state changes.
01 Generate CSCIF interrupt only if the receiver enters or leaves “bus-off” state. Discard other receiver state
changes for generating CSCIF interrupt.
10 Generate CSCIF interrupt only if the receiver enters or leaves “RxErr” or “bus-off”2 state. Discard other
receiver state changes for generating CSCIF interrupt.
11 Generate CSCIF interrupt on all state changes.
2Bus-off state is only defined for transmitters by the CAN standard (see Bosch CAN 2.0A/B protocol specification). Because
the only possible state change for the transmitter from bus-off to TxOK also forces the receiver to skip its current state to RxOK,
the coding of the RXSTAT[1:0] flags define an additional bus-off state for the receiver (see Section 16.3.2.5, “MSCAN Receiver
Flag Register (CANRFLG)”).
3-2
TSTATE[1:0]
Transmitter Status Change Enable — These TSTAT enable bits control the sensitivity level in which transmitter
state changes are causing CSCIF interrupts. Independent of the chosen sensitivity level, the TSTAT flags
continue to indicate the actual transmitter state and are only updated if no CSCIF interrupt is pending.
00 Do not generate any CSCIF interrupt caused by transmitter state changes.
01 Generate CSCIF interrupt only if the transmitter enters or leaves “bus-off” state. Discard other transmitter
state changes for generating CSCIF interrupt.
10 Generate CSCIF interrupt only if the transmitter enters or leaves “TxErr” or “bus-off” state. Discard other
transmitter state changes for generating CSCIF interrupt.
11 Generate CSCIF interrupt on all state changes.
1
OVRIE
Overrun Interrupt Enable
0 No interrupt request is generated from this event.
1 An overrun event causes an error interrupt request.
0
RXFIE
Receiver Full Interrupt Enable
0 No interrupt request is generated from this event.
1 A receive buffer full (successful message reception) event causes a receiver interrupt request.
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
496 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
The CANTFLG register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK = 1). This register is writable when
not in initialization mode (INITRQ = 0 and INITAK = 0).
16.3.2.8 MSCAN Transmitter Interrupt Enable Register (CANTIER)
This register contains the interrupt enable bits for the transmit buffer empty interrupt flags.
Module Base + 0x0006 Access: User read/write1
1Read: Anytime
Write: Anytime when not in initialization mode; write of 1 clears flag, write of 0 is ignored
76543210
R0 0000
TXE2 TXE1 TXE0
W
Reset: 00000111
= Unimplemented
Figure 16-10. MSCAN Transmitter Flag Register (CANTFLG)
Table 16-13. CANTFLG Register Field Descriptions
Field Description
2-0
TXE[2:0]
Transmitter Buffer Empty — This flag indicates that the associated transmit message buffer is empty, and thus
not scheduled for transmission. The CPU must clear the flag after a message is set up in the transmit buffer and
is due for transmission. The MSCAN sets the flag after the message is sent successfully. The flag is also set by
the MSCAN when the transmission request is successfully aborted due to a pending abort request (see
Section 16.3.2.9, “MSCAN Transmitter Message Abort Request Register (CANTARQ)”). If not masked, a
transmit interrupt is pending while this flag is set.
Clearing a TXEx flag also clears the corresponding ABTAKx (see Section 16.3.2.10, “MSCAN Transmitter
Message Abort Acknowledge Register (CANTAAK)”). When a TXEx flag is set, the corresponding ABTRQx bit
is cleared (see Section 16.3.2.9, “MSCAN Transmitter Message Abort Request Register (CANTARQ)”).
When listen-mode is active (see Section 16.3.2.2, “MSCAN Control Register 1 (CANCTL1)”) the TXEx flags
cannot be cleared and no transmission is started.
Read and write accesses to the transmit buffer will be blocked, if the corresponding TXEx bit is cleared
(TXEx = 0) and the buffer is scheduled for transmission.
0 The associated message buffer is full (loaded with a message due for transmission)
1 The associated message buffer is empty (not scheduled)
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 497
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
The CANTIER register is held in the reset state when the initialization mode
is active (INITRQ = 1 and INITAK = 1). This register is writable when not
in initialization mode (INITRQ = 0 and INITAK = 0).
16.3.2.9 MSCAN Transmitter Message Abort Request Register (CANTARQ)
The CANTARQ register allows abort request of queued messages as described below.
NOTE
The CANTARQ register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK = 1). This register is writable when
not in initialization mode (INITRQ = 0 and INITAK = 0).
Module Base + 0x0007 Access: User read/write1
1Read: Anytime
Write: Anytime when not in initialization mode
76543210
R00000
TXEIE2 TXEIE1 TXEIE0
W
Reset: 00000000
= Unimplemented
Figure 16-11. MSCAN Transmitter Interrupt Enable Register (CANTIER)
Table 16-14. CANTIER Register Field Descriptions
Field Description
2-0
TXEIE[2:0]
Transmitter Empty Interrupt Enable
0 No interrupt request is generated from this event.
1 A transmitter empty (transmit buffer available for transmission) event causes a transmitter empty interrupt
request.
Module Base + 0x0008 Access: User read/write1
1Read: Anytime
Write: Anytime when not in initialization mode
76543210
R00000
ABTRQ2 ABTRQ1 ABTRQ0
W
Reset: 00000000
= Unimplemented
Figure 16-12. MSCAN Transmitter Message Abort Request Register (CANTARQ)
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
498 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.3.2.10 MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK)
The CANTAAK register indicates the successful abort of a queued message, if requested by the
appropriate bits in the CANTARQ register.
NOTE
The CANTAAK register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK = 1).
16.3.2.11 MSCAN Transmit Buffer Selection Register (CANTBSEL)
The CANTBSEL register allows the selection of the actual transmit message buffer, which then will be
accessible in the CANTXFG register space.
Table 16-15. CANTARQ Register Field Descriptions
Field Description
2-0
ABTRQ[2:0]
Abort Request — The CPU sets the ABTRQx bit to request that a scheduled message buffer (TXEx = 0) be
aborted. The MSCAN grants the request if the message has not already started transmission, or if the
transmission is not successful (lost arbitration or error). When a message is aborted, the associated TXE (see
Section 16.3.2.7, “MSCAN Transmitter Flag Register (CANTFLG)”) and abort acknowledge flags (ABTAK, see
Section 16.3.2.10, “MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK)”) are set and a
transmit interrupt occurs if enabled. The CPU cannot reset ABTRQx. ABTRQx is reset whenever the associated
TXE flag is set.
0 No abort request
1 Abort request pending
Module Base + 0x0009 Access: User read/write1
1Read: Anytime
Write: Unimplemented
76543210
R00000ABTAK2 ABTAK1 ABTAK0
W
Reset: 00000000
= Unimplemented
Figure 16-13. MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK)
Table 16-16. CANTAAK Register Field Descriptions
Field Description
2-0
ABTAK[2:0]
Abort Acknowledge — This flag acknowledges that a message was aborted due to a pending abort request
from the CPU. After a particular message buffer is flagged empty, this flag can be used by the application
software to identify whether the message was aborted successfully or was sent anyway. The ABTAKx flag is
cleared whenever the corresponding TXE flag is cleared.
0 The message was not aborted.
1 The message was aborted.
Freescale’s Scalable Controller Area Network (S12MSCANV3)
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
The CANTBSEL register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK=1). This register is writable when
not in initialization mode (INITRQ = 0 and INITAK = 0).
The following gives a short programming example of the usage of the CANTBSEL register:
To get the next available transmit buffer, application software must read the CANTFLG register and write
this value back into the CANTBSEL register. In this example Tx buffers TX1 and TX2 are available. The
value read from CANTFLG is therefore 0b0000_0110. When writing this value back to CANTBSEL, the
Tx buffer TX1 is selected in the CANTXFG because the lowest numbered bit set to 1 is at bit position 1.
Reading back this value out of CANTBSEL results in 0b0000_0010, because only the lowest numbered
bit position set to 1 is presented. This mechanism eases the application software’s selection of the next
available Tx buffer.
• LDAA CANTFLG; value read is 0b0000_0110
• STAA CANTBSEL; value written is 0b0000_0110
• LDAA CANTBSEL; value read is 0b0000_0010
If all transmit message buffers are deselected, no accesses are allowed to the CANTXFG registers.
16.3.2.12 MSCAN Identifier Acceptance Control Register (CANIDAC)
The CANIDAC register is used for identifier acceptance control as described below.
Module Base + 0x000A Access: User read/write1
1Read: Find the lowest ordered bit set to 1, all other bits will be read as 0
Write: Anytime when not in initialization mode
76543210
R00000
TX2 TX1 TX0
W
Reset: 00000000
= Unimplemented
Figure 16-14. MSCAN Transmit Buffer Selection Register (CANTBSEL)
Table 16-17. CANTBSEL Register Field Descriptions
Field Description
2-0
TX[2:0]
Transmit Buffer Select — The lowest numbered bit places the respective transmit buffer in the CANTXFG
register space (e.g., TX1 = 1 and TX0 = 1 selects transmit buffer TX0; TX1 = 1 and TX0 = 0 selects transmit
buffer TX1). Read and write accesses to the selected transmit buffer will be blocked, if the corresponding TXEx
bit is cleared and the buffer is scheduled for transmission (see Section 16.3.2.7, “MSCAN Transmitter Flag
Register (CANTFLG)”).
0 The associated message buffer is deselected
1 The associated message buffer is selected, if lowest numbered bit
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MC9S12G Family Reference Manual, Rev.1.06
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The IDHITx indicators are always related to the message in the foreground buffer (RxFG). When a
message gets shifted into the foreground buffer of the receiver FIFO the indicators are updated as well.
Module Base + 0x000B Access: User read/write1
1Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1), except bits IDHITx, which are read-only
76543210
R0 0
IDAM1 IDAM0
0 IDHIT2 IDHIT1 IDHIT0
W
Reset: 00000000
= Unimplemented
Figure 16-15. MSCAN Identifier Acceptance Control Register (CANIDAC)
Table 16-18. CANIDAC Register Field Descriptions
Field Description
5-4
IDAM[1:0]
Identifier Acceptance Mode — The CPU sets these flags to define the identifier acceptance filter organization
(see Section 16.4.3, “Identifier Acceptance Filter”). Table 16-19 summarizes the different settings. In filter closed
mode, no message is accepted such that the foreground buffer is never reloaded.
2-0
IDHIT[2:0]
Identifier Acceptance Hit Indicator — The MSCAN sets these flags to indicate an identifier acceptance hit (see
Section 16.4.3, “Identifier Acceptance Filter”). Table 16-20 summarizes the different settings.
Table 16-19. Identifier Acceptance Mode Settings
IDAM1 IDAM0 Identifier Acceptance Mode
0 0 Two 32-bit acceptance filters
0 1 Four 16-bit acceptance filters
1 0 Eight 8-bit acceptance filters
1 1 Filter closed
Table 16-20. Identifier Acceptance Hit Indication
IDHIT2 IDHIT1 IDHIT0 Identifier Acceptance Hit
0 0 0 Filter 0 hit
0 0 1 Filter 1 hit
0 1 0 Filter 2 hit
0 1 1 Filter 3 hit
1 0 0 Filter 4 hit
1 0 1 Filter 5 hit
1 1 0 Filter 6 hit
1 1 1 Filter 7 hit
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 501
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.3.2.13 MSCAN Reserved Register
This register is reserved for factory testing of the MSCAN module and is not available in normal system
operating modes.
NOTE
Writing to this register when in special system operating modes can alter the
MSCAN functionality.
16.3.2.14 MSCAN Miscellaneous Register (CANMISC)
This register provides additional features.
Module Base + 0x000C to Module Base + 0x000D Access: User read/write1
1Read: Always reads zero in normal system operation modes
Write: Unimplemented in normal system operation modes
76543210
R00000000
W
Reset: 00000000
= Unimplemented
Figure 16-16. MSCAN Reserved Register
Module Base + 0x000D Access: User read/write1
1Read: Anytime
Write: Anytime; write of ‘1’ clears flag; write of ‘0’ ignored
76543210
R0000000
BOHOLD
W
Reset: 00000000
= Unimplemented
Figure 16-17. MSCAN Miscellaneous Register (CANMISC)
Table 16-21. CANMISC Register Field Descriptions
Field Description
0
BOHOLD
Bus-off State Hold Until User Request — If BORM is set in MSCAN Control Register 1 (CANCTL1), this bit
indicates whether the module has entered the bus-off state. Clearing this bit requests the recovery from bus-off.
Refer to Section 16.5.2, “Bus-Off Recovery,” for details.
0 Module is not bus-off or recovery has been requested by user in bus-off state
1 Module is bus-off and holds this state until user request
Freescale’s Scalable Controller Area Network (S12MSCANV3)
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16.3.2.15 MSCAN Receive Error Counter (CANRXERR)
This register reflects the status of the MSCAN receive error counter.
NOTE
Reading this register when in any other mode other than sleep or
initialization mode may return an incorrect value. For MCUs with dual
CPUs, this may result in a CPU fault condition.
Writing to this register when in special modes can alter the MSCAN
functionality.
16.3.2.16 MSCAN Transmit Error Counter (CANTXERR)
This register reflects the status of the MSCAN transmit error counter.
NOTE
Reading this register when in any other mode other than sleep or
initialization mode, may return an incorrect value. For MCUs with dual
CPUs, this may result in a CPU fault condition.
Module Base + 0x000E Access: User read/write1
1Read: Only when in sleep mode (SLPRQ = 1 and SLPAK = 1) or initialization mode (INITRQ = 1 and INITAK = 1)
Write: Unimplemented
76543210
R RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0
W
Reset: 00000000
= Unimplemented
Figure 16-18. MSCAN Receive Error Counter (CANRXERR)
Module Base + 0x000F Access: User read/write1
1Read: Only when in sleep mode (SLPRQ = 1 and SLPAK = 1) or initialization mode (INITRQ = 1 and INITAK = 1)
Write: Unimplemented
76543210
R TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0
W
Reset: 00000000
= Unimplemented
Figure 16-19. MSCAN Transmit Error Counter (CANTXERR)
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 503
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Writing to this register when in special modes can alter the MSCAN
functionality.
16.3.2.17 MSCAN Identifier Acceptance Registers (CANIDAR0-7)
On reception, each message is written into the background receive buffer. The CPU is only signalled to
read the message if it passes the criteria in the identifier acceptance and identifier mask registers
(accepted); otherwise, the message is overwritten by the next message (dropped).
The acceptance registers of the MSCAN are applied on the IDR0–IDR3 registers (see Section 16.3.3.1,
“Identifier Registers (IDR0–IDR3)”) of incoming messages in a bit by bit manner (see Section 16.4.3,
“Identifier Acceptance Filter”).
For extended identifiers, all four acceptance and mask registers are applied. For standard identifiers, only
the first two (CANIDAR0/1, CANIDMR0/1) are applied.
Module Base + 0x0010 to Module Base + 0x0013 Access: User read/write1
1Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
76543210
R
AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0
W
Reset 00000000
Figure 16-20. MSCAN Identifier Acceptance Registers (First Bank) — CANIDAR0–CANIDAR3
Table 16-22. CANIDAR0–CANIDAR3 Register Field Descriptions
Field Description
7-0
AC[7:0]
Acceptance Code Bits — AC[7:0] comprise a user-defined sequence of bits with which the corresponding bits
of the related identifier register (IDRn) of the receive message buffer are compared. The result of this comparison
is then masked with the corresponding identifier mask register.
Module Base + 0x0018 to Module Base + 0x001B Access: User read/write1
1Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
76543210
R
AC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0
W
Reset 00000000
Figure 16-21. MSCAN Identifier Acceptance Registers (Second Bank) — CANIDAR4–CANIDAR7
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
504 Freescale Semiconductor
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16.3.2.18 MSCAN Identifier Mask Registers (CANIDMR0–CANIDMR7)
The identifier mask register specifies which of the corresponding bits in the identifier acceptance register
are relevant for acceptance filtering. To receive standard identifiers in 32 bit filter mode, it is required to
program the last three bits (AM[2:0]) in the mask registers CANIDMR1 and CANIDMR5 to “don’t care.”
To receive standard identifiers in 16 bit filter mode, it is required to program the last three bits (AM[2:0])
in the mask registers CANIDMR1, CANIDMR3, CANIDMR5, and CANIDMR7 to “don’t care.”
Table 16-23. CANIDAR4–CANIDAR7 Register Field Descriptions
Field Description
7-0
AC[7:0]
Acceptance Code Bits — AC[7:0] comprise a user-defined sequence of bits with which the corresponding bits
of the related identifier register (IDRn) of the receive message buffer are compared. The result of this comparison
is then masked with the corresponding identifier mask register.
Module Base + 0x0014 to Module Base + 0x0017 Access: User read/write1
1Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
76543210
R
AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0
W
Reset 00000000
Figure 16-22. MSCAN Identifier Mask Registers (First Bank) — CANIDMR0–CANIDMR3
Table 16-24. CANIDMR0–CANIDMR3 Register Field Descriptions
Field Description
7-0
AM[7:0]
Acceptance Mask Bits — If a particular bit in this register is cleared, this indicates that the corresponding bit in
the identifier acceptance register must be the same as its identifier bit before a match is detected. The message
is accepted if all such bits match. If a bit is set, it indicates that the state of the corresponding bit in the identifier
acceptance register does not affect whether or not the message is accepted.
0 Match corresponding acceptance code register and identifier bits
1 Ignore corresponding acceptance code register bit
Module Base + 0x001C to Module Base + 0x001F Access: User read/write1
76543210
R
AM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0
W
Reset 00000000
Figure 16-23. MSCAN Identifier Mask Registers (Second Bank) — CANIDMR4–CANIDMR7
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 505
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.3.3 Programmer’s Model of Message Storage
The following section details the organization of the receive and transmit message buffers and the
associated control registers.
To simplify the programmer interface, the receive and transmit message buffers have the same outline.
Each message buffer allocates 16 bytes in the memory map containing a 13 byte data structure.
An additional transmit buffer priority register (TBPR) is defined for the transmit buffers. Within the last
two bytes of this memory map, the MSCAN stores a special 16-bit time stamp, which is sampled from an
internal timer after successful transmission or reception of a message. This feature is only available for
transmit and receiver buffers, if the TIME bit is set (see Section 16.3.2.1, “MSCAN Control Register 0
(CANCTL0)”).
The time stamp register is written by the MSCAN. The CPU can only read these registers.
1Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 16-25. CANIDMR4–CANIDMR7 Register Field Descriptions
Field Description
7-0
AM[7:0]
Acceptance Mask Bits — If a particular bit in this register is cleared, this indicates that the corresponding bit in
the identifier acceptance register must be the same as its identifier bit before a match is detected. The message
is accepted if all such bits match. If a bit is set, it indicates that the state of the corresponding bit in the identifier
acceptance register does not affect whether or not the message is accepted.
0 Match corresponding acceptance code register and identifier bits
1 Ignore corresponding acceptance code register bit
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
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Figure 16-24 shows the common 13-byte data structure of receive and transmit buffers for extended
identifiers. The mapping of standard identifiers into the IDR registers is shown in Figure 16-25.
All bits of the receive and transmit buffers are ‘x’ out of reset because of RAM-based implementation1.
All reserved or unused bits of the receive and transmit buffers always read ‘x’.
Table 16-26. Message Buffer Organization
Offset
Address Register Access
0x00X0 Identifier Register 0 R/W
0x00X1 Identifier Register 1 R/W
0x00X2 Identifier Register 2 R/W
0x00X3 Identifier Register 3 R/W
0x00X4 Data Segment Register 0 R/W
0x00X5 Data Segment Register 1 R/W
0x00X6 Data Segment Register 2 R/W
0x00X7 Data Segment Register 3 R/W
0x00X8 Data Segment Register 4 R/W
0x00X9 Data Segment Register 5 R/W
0x00XA Data Segment Register 6 R/W
0x00XB Data Segment Register 7 R/W
0x00XC Data Length Register R/W
0x00XD Transmit Buffer Priority Register1
1Not applicable for receive buffers
R/W
0x00XE Time Stamp Register (High Byte) R
0x00XF Time Stamp Register (Low Byte) R
1. Exception: The transmit buffer priority registers are 0 out of reset.
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
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Figure 16-24. Receive/Transmit Message Buffer — Extended Identifier Mapping
Register
Name Bit 7 654321Bit0
0x00X0
IDR0
R
ID28 ID27 ID26 ID25 ID24 ID23 ID22 ID21
W
0x00X1
IDR1
R
ID20 ID19 ID18 SRR (=1) IDE (=1) ID17 ID16 ID15
W
0x00X2
IDR2
R
ID14 ID13 ID12 ID11 ID10 ID9 ID8 ID7
W
0x00X3
IDR3
R
ID6 ID5 ID4 ID3 ID2 ID1 ID0 RTR
W
0x00X4
DSR0
R
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
W
0x00X5
DSR1
R
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
W
0x00X6
DSR2
R
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
W
0x00X7
DSR3
R
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
W
0x00X8
DSR4
R
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
W
0x00X9
DSR5
R
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
W
0x00XA
DSR6
R
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
W
0x00XB
DSR7
R
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
W
0x00XC
DLR
R
DLC3 DLC2 DLC1 DLC0
W
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MC9S12G Family Reference Manual, Rev.1.06
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Read:
• For transmit buffers, anytime when TXEx flag is set (see Section 16.3.2.7, “MSCAN Transmitter
Flag Register (CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see
Section 16.3.2.11, “MSCAN Transmit Buffer Selection Register (CANTBSEL)”).
• For receive buffers, only when RXF flag is set (see Section 16.3.2.5, “MSCAN Receiver Flag
Register (CANRFLG)”).
Write:
• For transmit buffers, anytime when TXEx flag is set (see Section 16.3.2.7, “MSCAN Transmitter
Flag Register (CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see
Section 16.3.2.11, “MSCAN Transmit Buffer Selection Register (CANTBSEL)”).
• Unimplemented for receive buffers.
Reset: Undefined because of RAM-based implementation
16.3.3.1 Identifier Registers (IDR0–IDR3)
The identifier registers for an extended format identifier consist of a total of 32 bits: ID[28:0], SRR, IDE,
and RTR. The identifier registers for a standard format identifier consist of a total of 13 bits: ID[10:0],
RTR, and IDE.
= Unused, always read ‘x’
Figure 16-25. Receive/Transmit Message Buffer — Standard Identifier Mapping
Register
Name Bit 7 654321Bit 0
IDR0
0x00X0
R
ID10 ID9 ID8 ID7 ID6 ID5 ID4 ID3
W
IDR1
0x00X1
R
ID2 ID1 ID0 RTR IDE (=0)
W
IDR2
0x00X2
R
W
IDR3
0x00X3
R
W
= Unused, always read ‘x’
Figure 16-24. Receive/Transmit Message Buffer — Extended Identifier Mapping (continued)
Register
Name Bit 7 654321Bit0
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 509
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.3.3.1.1 IDR0–IDR3 for Extended Identifier Mapping
Module Base + 0x00X0
76543210
R
ID28 ID27 ID26 ID25 ID24 ID23 ID22 ID21
W
Reset: xxxxxxxx
Figure 16-26. Identifier Register 0 (IDR0) — Extended Identifier Mapping
Table 16-27. IDR0 Register Field Descriptions — Extended
Field Description
7-0
ID[28:21]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
Module Base + 0x00X1
76543210
R
ID20 ID19 ID18 SRR (=1) IDE (=1) ID17 ID16 ID15
W
Reset: xxxxxxxx
Figure 16-27. Identifier Register 1 (IDR1) — Extended Identifier Mapping
Table 16-28. IDR1 Register Field Descriptions — Extended
Field Description
7-5
ID[20:18]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
4
SRR
Substitute Remote Request — This fixed recessive bit is used only in extended format. It must be set to 1 by
the user for transmission buffers and is stored as received on the CAN bus for receive buffers.
3
IDE
ID Extended — This flag indicates whether the extended or standard identifier format is applied in this buffer. In
the case of a receive buffer, the flag is set as received and indicates to the CPU how to process the buffer
identifier registers. In the case of a transmit buffer, the flag indicates to the MSCAN what type of identifier to send.
0 Standard format (11 bit)
1 Extended format (29 bit)
2-0
ID[17:15]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
510 Freescale Semiconductor
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Module Base + 0x00X2
76543210
R
ID14 ID13 ID12 ID11 ID10 ID9 ID8 ID7
W
Reset: xxxxxxxx
Figure 16-28. Identifier Register 2 (IDR2) — Extended Identifier Mapping
Table 16-29. IDR2 Register Field Descriptions — Extended
Field Description
7-0
ID[14:7]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
Module Base + 0x00X3
76543210
R
ID6 ID5 ID4 ID3 ID2 ID1 ID0 RTR
W
Reset: xxxxxxxx
Figure 16-29. Identifier Register 3 (IDR3) — Extended Identifier Mapping
Table 16-30. IDR3 Register Field Descriptions — Extended
Field Description
7-1
ID[6:0]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
0
RTR
Remote Transmission Request — This flag reflects the status of the remote transmission request bit in the
CAN frame. In the case of a receive buffer, it indicates the status of the received frame and supports the
transmission of an answering frame in software. In the case of a transmit buffer, this flag defines the setting of
the RTR bit to be sent.
0 Data frame
1 Remote frame
Freescale’s Scalable Controller Area Network (S12MSCANV3)
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16.3.3.1.2 IDR0–IDR3 for Standard Identifier Mapping
Module Base + 0x00X0
76543210
R
ID10 ID9 ID8 ID7 ID6 ID5 ID4 ID3
W
Reset: xxxxxxxx
Figure 16-30. Identifier Register 0 — Standard Mapping
Table 16-31. IDR0 Register Field Descriptions — Standard
Field Description
7-0
ID[10:3]
Standard Format Identifier — The identifiers consist of 11 bits (ID[10:0]) for the standard format. ID10 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number. See also ID bits in Table 16-32.
Module Base + 0x00X1
76543210
R
ID2 ID1 ID0 RTR IDE (=0)
W
Reset: xxxxxxxx
= Unused; always read ‘x’
Figure 16-31. Identifier Register 1 — Standard Mapping
Table 16-32. IDR1 Register Field Descriptions
Field Description
7-5
ID[2:0]
Standard Format Identifier — The identifiers consist of 11 bits (ID[10:0]) for the standard format. ID10 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number. See also ID bits in Table 16-31.
4
RTR
Remote Transmission Request — This flag reflects the status of the Remote Transmission Request bit in the
CAN frame. In the case of a receive buffer, it indicates the status of the received frame and supports the
transmission of an answering frame in software. In the case of a transmit buffer, this flag defines the setting of
the RTR bit to be sent.
0 Data frame
1 Remote frame
3
IDE
ID Extended — This flag indicates whether the extended or standard identifier format is applied in this buffer. In
the case of a receive buffer, the flag is set as received and indicates to the CPU how to process the buffer
identifier registers. In the case of a transmit buffer, the flag indicates to the MSCAN what type of identifier to send.
0 Standard format (11 bit)
1 Extended format (29 bit)
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MC9S12G Family Reference Manual, Rev.1.06
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16.3.3.2 Data Segment Registers (DSR0-7)
The eight data segment registers, each with bits DB[7:0], contain the data to be transmitted or received.
The number of bytes to be transmitted or received is determined by the data length code in the
corresponding DLR register.
Module Base + 0x00X2
76543210
R
W
Reset: xxxxxxxx
= Unused; always read ‘x’
Figure 16-32. Identifier Register 2 — Standard Mapping
Module Base + 0x00X3
76543210
R
W
Reset: xxxxxxxx
= Unused; always read ‘x’
Figure 16-33. Identifier Register 3 — Standard Mapping
Module Base + 0x00X4 to Module Base + 0x00XB
76543210
R
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
W
Reset: xxxxxxxx
Figure 16-34. Data Segment Registers (DSR0–DSR7) — Extended Identifier Mapping
Table 16-33. DSR0–DSR7 Register Field Descriptions
Field Description
7-0
DB[7:0]
Data bits 7-0
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16.3.3.3 Data Length Register (DLR)
This register keeps the data length field of the CAN frame.
16.3.3.4 Transmit Buffer Priority Register (TBPR)
This register defines the local priority of the associated message buffer. The local priority is used for the
internal prioritization process of the MSCAN and is defined to be highest for the smallest binary number.
The MSCAN implements the following internal prioritization mechanisms:
• All transmission buffers with a cleared TXEx flag participate in the prioritization immediately
before the SOF (start of frame) is sent.
Module Base + 0x00XC
76543210
R
DLC3 DLC2 DLC1 DLC0
W
Reset: xxxxxxxx
= Unused; always read “x”
Figure 16-35. Data Length Register (DLR) — Extended Identifier Mapping
Table 16-34. DLR Register Field Descriptions
Field Description
3-0
DLC[3:0]
Data Length Code Bits — The data length code contains the number of bytes (data byte count) of the respective
message. During the transmission of a remote frame, the data length code is transmitted as programmed while
the number of transmitted data bytes is always 0. The data byte count ranges from 0 to 8 for a data frame.
Table 16-35 shows the effect of setting the DLC bits.
Table 16-35. Data Length Codes
Data Length Code Data Byte
Count
DLC3 DLC2 DLC1 DLC0
00000
00011
00102
00113
01004
01015
01106
01117
10008
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• The transmission buffer with the lowest local priority field wins the prioritization.
In cases of more than one buffer having the same lowest priority, the message buffer with the lower index
number wins.
16.3.3.5 Time Stamp Register (TSRH–TSRL)
If the TIME bit is enabled, the MSCAN will write a time stamp to the respective registers in the active
transmit or receive buffer right after the EOF of a valid message on the CAN bus (see Section 16.3.2.1,
“MSCAN Control Register 0 (CANCTL0)”). In case of a transmission, the CPU can only read the time
stamp after the respective transmit buffer has been flagged empty.
The timer value, which is used for stamping, is taken from a free running internal CAN bit clock. A timer
overrun is not indicated by the MSCAN. The timer is reset (all bits set to 0) during initialization mode. The
CPU can only read the time stamp registers.
Module Base + 0x00XD Access: User read/write1
1Read: Anytime when TXEx flag is set (see Section 16.3.2.7, “MSCAN Transmitter Flag Register (CANTFLG)”) and the
corresponding transmit buffer is selected in CANTBSEL (see Section 16.3.2.11, “MSCAN Transmit Buffer Selection Register
(CANTBSEL)”)
Write: Anytime when TXEx flag is set (see Section 16.3.2.7, “MSCAN Transmitter Flag Register (CANTFLG)”) and the
corresponding transmit buffer is selected in CANTBSEL (see Section 16.3.2.11, “MSCAN Transmit Buffer Selection Register
(CANTBSEL)”)
76543210
R
PRIO7 PRIO6 PRIO5 PRIO4 PRIO3 PRIO2 PRIO1 PRIO0
W
Reset: 00000000
Figure 16-36. Transmit Buffer Priority Register (TBPR)
Module Base + 0x00XE Access: User read/write1
1Read: Anytime when TXEx flag is set (see Section 16.3.2.7, “MSCAN Transmitter Flag Register (CANTFLG)”) and the
corresponding transmit buffer is selected in CANTBSEL (see Section 16.3.2.11, “MSCAN Transmit Buffer Selection Register
(CANTBSEL)”)
Write: Unimplemented
76543210
R TSR15 TSR14 TSR13 TSR12 TSR11 TSR10 TSR9 TSR8
W
Reset: xxxxxxxx
Figure 16-37. Time Stamp Register — High Byte (TSRH)
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 515
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.4 Functional Description
16.4.1 General
This section provides a complete functional description of the MSCAN.
Module Base + 0x00XF Access: User read/write1
1Read: Anytime when TXEx flag is set (see Section 16.3.2.7, “MSCAN Transmitter Flag Register (CANTFLG)”) and the
corresponding transmit buffer is selected in CANTBSEL (see Section 16.3.2.11, “MSCAN Transmit Buffer Selection Register
(CANTBSEL)”)
Write: Unimplemented
76543210
R TSR7 TSR6 TSR5 TSR4 TSR3 TSR2 TSR1 TSR0
W
Reset: xxxxxxxx
Figure 16-38. Time Stamp Register — Low Byte (TSRL)
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16.4.2 Message Storage
Figure 16-39. User Model for Message Buffer Organization
The MSCAN facilitates a sophisticated message storage system which addresses the requirements of a
broad range of network applications.
16.4.2.1 Message Transmit Background
Modern application layer software is built upon two fundamental assumptions:
MSCAN
Rx0
Rx1
CAN Receive / Transmit Engine Memory Mapped I/O
CPU bus
MSCAN
Tx2
TXE2
PRIO
Receiver
Transmitter
RxBG
TxBG
Tx0
TXE0
PRIO
TxBG
Tx1
PRIO
TXE1
TxFG
CPU bus
Rx2
Rx3
Rx4
RXF
RxFG
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• Any CAN node is able to send out a stream of scheduled messages without releasing the CAN bus
between the two messages. Such nodes arbitrate for the CAN bus immediately after sending the
previous message and only release the CAN bus in case of lost arbitration.
• The internal message queue within any CAN node is organized such that the highest priority
message is sent out first, if more than one message is ready to be sent.
The behavior described in the bullets above cannot be achieved with a single transmit buffer. That buffer
must be reloaded immediately after the previous message is sent. This loading process lasts a finite amount
of time and must be completed within the inter-frame sequence (IFS) to be able to send an uninterrupted
stream of messages. Even if this is feasible for limited CAN bus speeds, it requires that the CPU reacts
with short latencies to the transmit interrupt.
A double buffer scheme de-couples the reloading of the transmit buffer from the actual message sending
and, therefore, reduces the reactiveness requirements of the CPU. Problems can arise if the sending of a
message is finished while the CPU re-loads the second buffer. No buffer would then be ready for
transmission, and the CAN bus would be released.
At least three transmit buffers are required to meet the first of the above requirements under all
circumstances. The MSCAN has three transmit buffers.
The second requirement calls for some sort of internal prioritization which the MSCAN implements with
the “local priority” concept described in Section 16.4.2.2, “Transmit Structures.”
16.4.2.2 Transmit Structures
The MSCAN triple transmit buffer scheme optimizes real-time performance by allowing multiple
messages to be set up in advance. The three buffers are arranged as shown in Figure 16-39.
All three buffers have a 13-byte data structure similar to the outline of the receive buffers (see
Section 16.3.3, “Programmer’s Model of Message Storage”). An additional Transmit Buffer Priority
Register (TBPR) contains an 8-bit local priority field (PRIO) (see Section 16.3.3.4, “Transmit Buffer
Priority Register (TBPR)”). The remaining two bytes are used for time stamping of a message, if required
(see Section 16.3.3.5, “Time Stamp Register (TSRH–TSRL)”).
To transmit a message, the CPU must identify an available transmit buffer, which is indicated by a set
transmitter buffer empty (TXEx) flag (see Section 16.3.2.7, “MSCAN Transmitter Flag Register
(CANTFLG)”). If a transmit buffer is available, the CPU must set a pointer to this buffer by writing to the
CANTBSEL register (see Section 16.3.2.11, “MSCAN Transmit Buffer Selection Register
(CANTBSEL)”). This makes the respective buffer accessible within the CANTXFG address space (see
Section 16.3.3, “Programmer’s Model of Message Storage”). The algorithmic feature associated with the
CANTBSEL register simplifies the transmit buffer selection. In addition, this scheme makes the handler
software simpler because only one address area is applicable for the transmit process, and the required
address space is minimized.
The CPU then stores the identifier, the control bits, and the data content into one of the transmit buffers.
Finally, the buffer is flagged as ready for transmission by clearing the associated TXE flag.
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The MSCAN then schedules the message for transmission and signals the successful transmission of the
buffer by setting the associated TXE flag. A transmit interrupt (see Section 16.4.7.2, “Transmit Interrupt”)
is generated1 when TXEx is set and can be used to drive the application software to re-load the buffer.
If more than one buffer is scheduled for transmission when the CAN bus becomes available for arbitration,
the MSCAN uses the local priority setting of the three buffers to determine the prioritization. For this
purpose, every transmit buffer has an 8-bit local priority field (PRIO). The application software programs
this field when the message is set up. The local priority reflects the priority of this particular message
relative to the set of messages being transmitted from this node. The lowest binary value of the PRIO field
is defined to be the highest priority. The internal scheduling process takes place whenever the MSCAN
arbitrates for the CAN bus. This is also the case after the occurrence of a transmission error.
When a high priority message is scheduled by the application software, it may become necessary to abort
a lower priority message in one of the three transmit buffers. Because messages that are already in
transmission cannot be aborted, the user must request the abort by setting the corresponding abort request
bit (ABTRQ) (see Section 16.3.2.9, “MSCAN Transmitter Message Abort Request Register
(CANTARQ)”.) The MSCAN then grants the request, if possible, by:
1. Setting the corresponding abort acknowledge flag (ABTAK) in the CANTAAK register.
2. Setting the associated TXE flag to release the buffer.
3. Generating a transmit interrupt. The transmit interrupt handler software can determine from the
setting of the ABTAK flag whether the message was aborted (ABTAK = 1) or sent (ABTAK = 0).
16.4.2.3 Receive Structures
The received messages are stored in a five stage input FIFO. The five message buffers are alternately
mapped into a single memory area (see Figure 16-39). The background receive buffer (RxBG) is
exclusively associated with the MSCAN, but the foreground receive buffer (RxFG) is addressable by the
CPU (see Figure 16-39). This scheme simplifies the handler software because only one address area is
applicable for the receive process.
All receive buffers have a size of 15 bytes to store the CAN control bits, the identifier (standard or
extended), the data contents, and a time stamp, if enabled (see Section 16.3.3, “Programmer’s Model of
Message Storage”).
The receiver full flag (RXF) (see Section 16.3.2.5, “MSCAN Receiver Flag Register (CANRFLG)”)
signals the status of the foreground receive buffer. When the buffer contains a correctly received message
with a matching identifier, this flag is set.
On reception, each message is checked to see whether it passes the filter (see Section 16.4.3, “Identifier
Acceptance Filter”) and simultaneously is written into the active RxBG. After successful reception of a
valid message, the MSCAN shifts the content of RxBG into the receiver FIFO, sets the RXF flag, and
generates a receive interrupt2 (see Section 16.4.7.3, “Receive Interrupt”) to the CPU. The user’s receive
handler must read the received message from the RxFG and then reset the RXF flag to acknowledge the
interrupt and to release the foreground buffer. A new message, which can follow immediately after the IFS
field of the CAN frame, is received into the next available RxBG. If the MSCAN receives an invalid
1. The transmit interrupt occurs only if not masked. A polling scheme can be applied on TXEx also.
2. The receive interrupt occurs only if not masked. A polling scheme can be applied on RXF also.
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message in its RxBG (wrong identifier, transmission errors, etc.) the actual contents of the buffer will be
over-written by the next message. The buffer will then not be shifted into the FIFO.
When the MSCAN module is transmitting, the MSCAN receives its own transmitted messages into the
background receive buffer, RxBG, but does not shift it into the receiver FIFO, generate a receive interrupt,
or acknowledge its own messages on the CAN bus. The exception to this rule is in loopback mode (see
Section 16.3.2.2, “MSCAN Control Register 1 (CANCTL1)”) where the MSCAN treats its own messages
exactly like all other incoming messages. The MSCAN receives its own transmitted messages in the event
that it loses arbitration. If arbitration is lost, the MSCAN must be prepared to become a receiver.
An overrun condition occurs when all receive message buffers in the FIFO are filled with correctly
received messages with accepted identifiers and another message is correctly received from the CAN bus
with an accepted identifier. The latter message is discarded and an error interrupt with overrun indication
is generated if enabled (see Section 16.4.7.5, “Error Interrupt”). The MSCAN remains able to transmit
messages while the receiver FIFO is being filled, but all incoming messages are discarded. As soon as a
receive buffer in the FIFO is available again, new valid messages will be accepted.
16.4.3 Identifier Acceptance Filter
The MSCAN identifier acceptance registers (see Section 16.3.2.12, “MSCAN Identifier Acceptance
Control Register (CANIDAC)”) define the acceptable patterns of the standard or extended identifier
(ID[10:0] or ID[28:0]). Any of these bits can be marked ‘don’t care’ in the MSCAN identifier mask
registers (see Section 16.3.2.18, “MSCAN Identifier Mask Registers (CANIDMR0–CANIDMR7)”).
A filter hit is indicated to the application software by a set receive buffer full flag (RXF = 1) and three bits
in the CANIDAC register (see Section 16.3.2.12, “MSCAN Identifier Acceptance Control Register
(CANIDAC)”). These identifier hit flags (IDHIT[2:0]) clearly identify the filter section that caused the
acceptance. They simplify the application software’s task to identify the cause of the receiver interrupt. If
more than one hit occurs (two or more filters match), the lower hit has priority.
A very flexible programmable generic identifier acceptance filter has been introduced to reduce the CPU
interrupt loading. The filter is programmable to operate in four different modes:
• Two identifier acceptance filters, each to be applied to:
— The full 29 bits of the extended identifier and to the following bits of the CAN 2.0B frame:
– Remote transmission request (RTR)
– Identifier extension (IDE)
– Substitute remote request (SRR)
— The 11 bits of the standard identifier plus the RTR and IDE bits of the CAN 2.0A/B messages.
This mode implements two filters for a full length CAN 2.0B compliant extended identifier.
Although this mode can be used for standard identifiers, it is recommended to use the four or
eight identifier acceptance filters.
Figure 16-40 shows how the first 32-bit filter bank (CANIDAR0–CANIDAR3,
CANIDMR0–CANIDMR3) produces a filter 0 hit. Similarly, the second filter bank
(CANIDAR4–CANIDAR7, CANIDMR4–CANIDMR7) produces a filter 1 hit.
• Four identifier acceptance filters, each to be applied to:
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— The 14 most significant bits of the extended identifier plus the SRR and IDE bits of CAN 2.0B
messages.
— The 11 bits of the standard identifier, the RTR and IDE bits of CAN 2.0A/B messages.
Figure 16-41 shows how the first 32-bit filter bank (CANIDAR0–CANIDAR3,
CANIDMR0–CANIDMR3) produces filter 0 and 1 hits. Similarly, the second filter bank
(CANIDAR4–CANIDAR7, CANIDMR4–CANIDMR7) produces filter 2 and 3 hits.
• Eight identifier acceptance filters, each to be applied to the first 8 bits of the identifier. This mode
implements eight independent filters for the first 8 bits of a CAN 2.0A/B compliant standard
identifier or a CAN 2.0B compliant extended identifier.
Figure 16-42 shows how the first 32-bit filter bank (CANIDAR0–CANIDAR3,
CANIDMR0–CANIDMR3) produces filter 0 to 3 hits. Similarly, the second filter bank
(CANIDAR4–CANIDAR7, CANIDMR4–CANIDMR7) produces filter 4 to 7 hits.
• Closed filter. No CAN message is copied into the foreground buffer RxFG, and the RXF flag is
never set.
Figure 16-40. 32-bit Maskable Identifier Acceptance Filter
ID28 ID21IDR0
ID10 ID3IDR0
ID20 ID15IDR1
ID2 IDEIDR1
ID14 ID7IDR2
ID10 ID3IDR2
ID6 RTRIDR3
ID10 ID3IDR3
AC7 AC0CANIDAR0
AM7 AM0CANIDMR0
AC7 AC0CANIDAR1
AM7 AM0CANIDMR1
AC7 AC0CANIDAR2
AM7 AM0CANIDMR2
AC7 AC0CANIDAR3
AM7 AM0CANIDMR3
ID Accepted (Filter 0 Hit)
CAN 2.0B
Extended Identifier
CAN 2.0A/B
Standard Identifier
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Figure 16-41. 16-bit Maskable Identifier Acceptance Filters
ID28 ID21IDR0
ID10 ID3IDR0
ID20 ID15IDR1
ID2 IDEIDR1
ID14 ID7IDR2
ID10 ID3IDR2
ID6 RTRIDR3
ID10 ID3IDR3
AC7 AC0CANIDAR0
AM7 AM0CANIDMR0
AC7 AC0CANIDAR1
AM7 AM0CANIDMR1
ID Accepted (Filter 0 Hit)
AC7 AC0CANIDAR2
AM7 AM0CANIDMR2
AC7 AC0CANIDAR3
AM7 AM0CANIDMR3
ID Accepted (Filter 1 Hit)
CAN 2.0B
Extended Identifier
CAN 2.0A/B
Standard Identifier
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Figure 16-42. 8-bit Maskable Identifier Acceptance Filters
CAN 2.0B
Extended Identifier
CAN 2.0A/B
Standard Identifier
AC7 AC0CIDAR3
AM7 AM0CIDMR3
ID Accepted (Filter 3 Hit)
AC7 AC0CIDAR2
AM7 AM0CIDMR2
ID Accepted (Filter 2 Hit)
AC7 AC0CIDAR1
AM7 AM0CIDMR1
ID Accepted (Filter 1 Hit)
ID28 ID21IDR0
ID10 ID3IDR0
ID20 ID15IDR1
ID2 IDEIDR1
ID14 ID7IDR2
ID10 ID3IDR2
ID6 RTRIDR3
ID10 ID3IDR3
AC7 AC0CIDAR0
AM7 AM0CIDMR0
ID Accepted (Filter 0 Hit)
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16.4.3.1 Protocol Violation Protection
The MSCAN protects the user from accidentally violating the CAN protocol through programming errors.
The protection logic implements the following features:
• The receive and transmit error counters cannot be written or otherwise manipulated.
• All registers which control the configuration of the MSCAN cannot be modified while the MSCAN
is on-line. The MSCAN has to be in Initialization Mode. The corresponding INITRQ/INITAK
handshake bits in the CANCTL0/CANCTL1 registers (see Section 16.3.2.1, “MSCAN Control
Register 0 (CANCTL0)”) serve as a lock to protect the following registers:
— MSCAN control 1 register (CANCTL1)
— MSCAN bus timing registers 0 and 1 (CANBTR0, CANBTR1)
— MSCAN identifier acceptance control register (CANIDAC)
— MSCAN identifier acceptance registers (CANIDAR0–CANIDAR7)
— MSCAN identifier mask registers (CANIDMR0–CANIDMR7)
• The TXCAN is immediately forced to a recessive state when the MSCAN goes into the power
down mode or initialization mode (see Section 16.4.5.6, “MSCAN Power Down Mode,” and
Section 16.4.4.5, “MSCAN Initialization Mode”).
• The MSCAN enable bit (CANE) is writable only once in normal system operation modes, which
provides further protection against inadvertently disabling the MSCAN.
16.4.3.2 Clock System
Figure 16-43 shows the structure of the MSCAN clock generation circuitry.
Figure 16-43. MSCAN Clocking Scheme
The clock source bit (CLKSRC) in the CANCTL1 register (16.3.2.2/16-488) defines whether the internal
CANCLK is connected to the output of a crystal oscillator (oscillator clock) or to the bus clock.
The clock source has to be chosen such that the tight oscillator tolerance requirements (up to 0.4%) of the
CAN protocol are met. Additionally, for high CAN bus rates (1 Mbps), a 45% to 55% duty cycle of the
clock is required.
If the bus clock is generated from a PLL, it is recommended to select the oscillator clock rather than the
bus clock due to jitter considerations, especially at the faster CAN bus rates.
Bus Clock
Oscillator Clock
MSCAN
CANCLK
CLKSRC
CLKSRC
Prescaler
(1 .. 64)
Time quanta clock (Tq)
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For microcontrollers without a clock and reset generator (CRG), CANCLK is driven from the crystal
oscillator (oscillator clock).
A programmable prescaler generates the time quanta (Tq) clock from CANCLK. A time quantum is the
atomic unit of time handled by the MSCAN.
Eqn. 16-2
A bit time is subdivided into three segments as described in the Bosch CAN 2.0A/B specification. (see
Figure 16-44):
• SYNC_SEG: This segment has a fixed length of one time quantum. Signal edges are expected to
happen within this section.
• Time Segment 1: This segment includes the PROP_SEG and the PHASE_SEG1 of the CAN
standard. It can be programmed by setting the parameter TSEG1 to consist of 4 to 16 time quanta.
• Time Segment 2: This segment represents the PHASE_SEG2 of the CAN standard. It can be
programmed by setting the TSEG2 parameter to be 2 to 8 time quanta long.
Eqn. 16-3
Figure 16-44. Segments within the Bit Time
Tq
fCANCLK
Prescaler value(
)
----------------------------------------------------
--
=
Bit Rate fTq
number of Time Quanta()
---------------------------------------------------------------------------------=
SYNC_SEG Time Segment 1 Time Segment 2
1 4 ... 16 2 ... 8
8 ... 25 Time Quanta
= 1 Bit Time
NRZ Signal
Sample Point
(single or triple sampling)
(PROP_SEG + PHASE_SEG1) (PHASE_SEG2)
Transmit Point
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The synchronization jump width (see the Bosch CAN 2.0A/B specification for details) can be programmed
in a range of 1 to 4 time quanta by setting the SJW parameter.
The SYNC_SEG, TSEG1, TSEG2, and SJW parameters are set by programming the MSCAN bus timing
registers (CANBTR0, CANBTR1) (see Section 16.3.2.3, “MSCAN Bus Timing Register 0 (CANBTR0)”
and Section 16.3.2.4, “MSCAN Bus Timing Register 1 (CANBTR1)”).
Table 16-37 gives an overview of the Bosch CAN 2.0A/B specification compliant segment settings and the
related parameter values.
NOTE
It is the user’s responsibility to ensure the bit time settings are in compliance
with the CAN standard.
16.4.4 Modes of Operation
16.4.4.1 Normal System Operating Modes
The MSCAN module behaves as described within this specification in all normal system operating modes.
Write restrictions exist for some registers.
Table 16-36. Time Segment Syntax
Syntax Description
SYNC_SEG System expects transitions to occur on the CAN bus during this
period.
Transmit Point A node in transmit mode transfers a new value to the CAN bus at
this point.
Sample Point
A node in receive mode samples the CAN bus at this point. If the
three samples per bit option is selected, then this point marks the
position of the third sample.
Table 16-37. Bosch CAN 2.0A/B Compliant Bit Time Segment Settings
Time Segment 1 TSEG1 Time Segment 2 TSEG2 Synchronization
Jump Width SJW
5 .. 10 4 .. 9 2 1 1 .. 2 0 .. 1
4 .. 11 3 .. 10 3 2 1 .. 3 0 .. 2
5 .. 12 4 .. 11 4 3 1 .. 4 0 .. 3
6 .. 13 5 .. 12 5 4 1 .. 4 0 .. 3
7 .. 14 6 .. 13 6 5 1 .. 4 0 .. 3
8 .. 15 7 .. 14 7 6 1 .. 4 0 .. 3
9 .. 16 8 .. 15 8 7 1 .. 4 0 .. 3
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16.4.4.2 Special System Operating Modes
The MSCAN module behaves as described within this specification in all special system operating modes.
Write restrictions which exist on specific registers in normal modes are lifted for test purposes in special
modes.
16.4.4.3 Emulation Modes
In all emulation modes, the MSCAN module behaves just like in normal system operating modes as
described within this specification.
16.4.4.4 Listen-Only Mode
In an optional CAN bus monitoring mode (listen-only), the CAN node is able to receive valid data frames
and valid remote frames, but it sends only “recessive” bits on the CAN bus. In addition, it cannot start a
transmission.
If the MAC sub-layer is required to send a “dominant” bit (ACK bit, overload flag, or active error flag), the
bit is rerouted internally so that the MAC sub-layer monitors this “dominant” bit, although the CAN bus
may remain in recessive state externally.
16.4.4.5 MSCAN Initialization Mode
The MSCAN enters initialization mode when it is enabled (CANE=1).
When entering initialization mode during operation, any on-going transmission or reception is
immediately aborted and synchronization to the CAN bus is lost, potentially causing CAN protocol
violations. To protect the CAN bus system from fatal consequences of violations, the MSCAN
immediately drives TXCAN into a recessive state.
NOTE
The user is responsible for ensuring that the MSCAN is not active when
initialization mode is entered. The recommended procedure is to bring the
MSCAN into sleep mode (SLPRQ = 1 and SLPAK = 1) before setting the
INITRQ bit in the CANCTL0 register. Otherwise, the abort of an on-going
message can cause an error condition and can impact other CAN bus
devices.
In initialization mode, the MSCAN is stopped. However, interface registers remain accessible. This mode
is used to reset the CANCTL0, CANRFLG, CANRIER, CANTFLG, CANTIER, CANTARQ,
CANTAAK, and CANTBSEL registers to their default values. In addition, the MSCAN enables the
configuration of the CANBTR0, CANBTR1 bit timing registers; CANIDAC; and the CANIDAR,
CANIDMR message filters. See Section 16.3.2.1, “MSCAN Control Register 0 (CANCTL0),” for a
detailed description of the initialization mode.
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Figure 16-45. Initialization Request/Acknowledge Cycle
Due to independent clock domains within the MSCAN, INITRQ must be synchronized to all domains by
using a special handshake mechanism. This handshake causes additional synchronization delay (see
Figure 16-45).
If there is no message transfer ongoing on the CAN bus, the minimum delay will be two additional bus
clocks and three additional CAN clocks. When all parts of the MSCAN are in initialization mode, the
INITAK flag is set. The application software must use INITAK as a handshake indication for the request
(INITRQ) to go into initialization mode.
NOTE
The CPU cannot clear INITRQ before initialization mode (INITRQ = 1 and
INITAK = 1) is active.
16.4.5 Low-Power Options
If the MSCAN is disabled (CANE = 0), the MSCAN clocks are stopped for power saving.
If the MSCAN is enabled (CANE = 1), the MSCAN has two additional modes with reduced power
consumption, compared to normal mode: sleep and power down mode. In sleep mode, power consumption
is reduced by stopping all clocks except those to access the registers from the CPU side. In power down
mode, all clocks are stopped and no power is consumed.
Table 16-38 summarizes the combinations of MSCAN and CPU modes. A particular combination of
modes is entered by the given settings on the CSWAI and SLPRQ/SLPAK bits.
SYNC
SYNC
Bus Clock Domain CAN Clock Domain
CPU
Init Request
INIT
Flag
INITAK
Flag
INITRQ
sync.
INITAK
sync.
INITRQ
INITAK
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16.4.5.1 Operation in Run Mode
As shown in Table 16-38, only MSCAN sleep mode is available as low power option when the CPU is in
run mode.
16.4.5.2 Operation in Wait Mode
The WAI instruction puts the MCU in a low power consumption stand-by mode. If the CSWAI bit is set,
additional power can be saved in power down mode because the CPU clocks are stopped. After leaving
this power down mode, the MSCAN restarts and enters normal mode again.
While the CPU is in wait mode, the MSCAN can be operated in normal mode and generate interrupts
(registers can be accessed via background debug mode).
16.4.5.3 Operation in Stop Mode
The STOP instruction puts the MCU in a low power consumption stand-by mode. In stop mode, the
MSCAN is set in power down mode regardless of the value of the SLPRQ/SLPAK and CSWAI bits
(Table 16-38).
16.4.5.4 MSCAN Normal Mode
This is a non-power-saving mode. Enabling the MSCAN puts the module from disabled mode into normal
mode. In this mode the module can either be in initialization mode or out of initialization mode. See
Section 16.4.4.5, “MSCAN Initialization Mode”.
Table 16-38. CPU vs. MSCAN Operating Modes
CPU Mode
MSCAN Mode
Normal
Reduced Power Consumption
Sleep Power Down Disabled
(CANE=0)
RUN
CSWAI = X1
SLPRQ = 0
SLPAK = 0
1‘X’ means don’t care.
CSWAI = X
SLPRQ = 1
SLPAK = 1
CSWAI = X
SLPRQ = X
SLPAK = X
WAIT
CSWAI = 0
SLPRQ = 0
SLPAK = 0
CSWAI = 0
SLPRQ = 1
SLPAK = 1
CSWAI = 1
SLPRQ = X
SLPAK = X
CSWAI = X
SLPRQ = X
SLPAK = X
STOP
CSWAI = X
SLPRQ = X
SLPAK = X
CSWAI = X
SLPRQ = X
SLPAK = X
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 529
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.4.5.5 MSCAN Sleep Mode
The CPU can request the MSCAN to enter this low power mode by asserting the SLPRQ bit in the
CANCTL0 register. The time when the MSCAN enters sleep mode depends on a fixed synchronization
delay and its current activity:
• If there are one or more message buffers scheduled for transmission (TXEx = 0), the MSCAN will
continue to transmit until all transmit message buffers are empty (TXEx = 1, transmitted
successfully or aborted) and then goes into sleep mode.
• If the MSCAN is receiving, it continues to receive and goes into sleep mode as soon as the CAN
bus next becomes idle.
• If the MSCAN is neither transmitting nor receiving, it immediately goes into sleep mode.
Figure 16-46. Sleep Request / Acknowledge Cycle
NOTE
The application software must avoid setting up a transmission (by clearing
one or more TXEx flag(s)) and immediately request sleep mode (by setting
SLPRQ). Whether the MSCAN starts transmitting or goes into sleep mode
directly depends on the exact sequence of operations.
If sleep mode is active, the SLPRQ and SLPAK bits are set (Figure 16-46). The application software must
use SLPAK as a handshake indication for the request (SLPRQ) to go into sleep mode.
When in sleep mode (SLPRQ = 1 and SLPAK = 1), the MSCAN stops its internal clocks. However, clocks
that allow register accesses from the CPU side continue to run.
If the MSCAN is in bus-off state, it stops counting the 128 occurrences of 11 consecutive recessive bits
due to the stopped clocks. TXCAN remains in a recessive state. If RXF = 1, the message can be read and
RXF can be cleared. Shifting a new message into the foreground buffer of the receiver FIFO (RxFG) does
not take place while in sleep mode.
It is possible to access the transmit buffers and to clear the associated TXE flags. No message abort takes
place while in sleep mode.
SYNC
SYNC
Bus Clock Domain CAN Clock Domain
MSCAN
in Sleep Mode
CPU
Sleep Request
SLPRQ
Flag
SLPAK
Flag
SLPRQ
sync.
SLPAK
sync.
SLPRQ
SLPAK
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
530 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
If the WUPE bit in CANCTL0 is not asserted, the MSCAN will mask any activity it detects on CAN.
RXCAN is therefore held internally in a recessive state. This locks the MSCAN in sleep mode. WUPE
must be set before entering sleep mode to take effect.
The MSCAN is able to leave sleep mode (wake up) only when:
• CAN bus activity occurs and WUPE = 1
or
• the CPU clears the SLPRQ bit
NOTE
The CPU cannot clear the SLPRQ bit before sleep mode (SLPRQ = 1 and
SLPAK = 1) is active.
After wake-up, the MSCAN waits for 11 consecutive recessive bits to synchronize to the CAN bus. As a
consequence, if the MSCAN is woken-up by a CAN frame, this frame is not received.
The receive message buffers (RxFG and RxBG) contain messages if they were received before sleep mode
was entered. All pending actions will be executed upon wake-up; copying of RxBG into RxFG, message
aborts and message transmissions. If the MSCAN remains in bus-off state after sleep mode was exited, it
continues counting the 128 occurrences of 11 consecutive recessive bits.
16.4.5.6 MSCAN Power Down Mode
The MSCAN is in power down mode (Table 16-38) when
• CPU is in stop mode
or
• CPU is in wait mode and the CSWAI bit is set
When entering the power down mode, the MSCAN immediately stops all ongoing transmissions and
receptions, potentially causing CAN protocol violations. To protect the CAN bus system from fatal
consequences of violations to the above rule, the MSCAN immediately drives TXCAN into a recessive
state.
NOTE
The user is responsible for ensuring that the MSCAN is not active when
power down mode is entered. The recommended procedure is to bring the
MSCAN into Sleep mode before the STOP or WAI instruction (if CSWAI
is set) is executed. Otherwise, the abort of an ongoing message can cause an
error condition and impact other CAN bus devices.
In power down mode, all clocks are stopped and no registers can be accessed. If the MSCAN was not in
sleep mode before power down mode became active, the module performs an internal recovery cycle after
powering up. This causes some fixed delay before the module enters normal mode again.
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 531
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.4.5.7 Disabled Mode
The MSCAN is in disabled mode out of reset (CANE=0). All module clocks are stopped for power saving,
however the register map can still be accessed as specified.
16.4.5.8 Programmable Wake-Up Function
The MSCAN can be programmed to wake up from sleep or power down mode as soon as CAN bus activity
is detected (see control bit WUPE in MSCAN Control Register 0 (CANCTL0). The sensitivity to existing
CAN bus action can be modified by applying a low-pass filter function to the RXCAN input line (see
control bit WUPM in Section 16.3.2.2, “MSCAN Control Register 1 (CANCTL1)”).
This feature can be used to protect the MSCAN from wake-up due to short glitches on the CAN bus lines.
Such glitches can result from—for example—electromagnetic interference within noisy environments.
16.4.6 Reset Initialization
The reset state of each individual bit is listed in Section 16.3.2, “Register Descriptions,” which details all
the registers and their bit-fields.
16.4.7 Interrupts
This section describes all interrupts originated by the MSCAN. It documents the enable bits and generated
flags. Each interrupt is listed and described separately.
16.4.7.1 Description of Interrupt Operation
The MSCAN supports four interrupt vectors (see Table 16-39), any of which can be individually masked
(for details see Section 16.3.2.6, “MSCAN Receiver Interrupt Enable Register (CANRIER)” to
Section 16.3.2.8, “MSCAN Transmitter Interrupt Enable Register (CANTIER)”).
Refer to the device overview section to determine the dedicated interrupt vector addresses.
16.4.7.2 Transmit Interrupt
At least one of the three transmit buffers is empty (not scheduled) and can be loaded to schedule a message
for transmission. The TXEx flag of the empty message buffer is set.
Table 16-39. Interrupt Vectors
Interrupt Source CCR Mask Local Enable
Wake-Up Interrupt (WUPIF) I bit CANRIER (WUPIE)
Error Interrupts Interrupt (CSCIF, OVRIF) I bit CANRIER (CSCIE, OVRIE)
Receive Interrupt (RXF) I bit CANRIER (RXFIE)
Transmit Interrupts (TXE[2:0]) I bit CANTIER (TXEIE[2:0])
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
532 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.4.7.3 Receive Interrupt
A message is successfully received and shifted into the foreground buffer (RxFG) of the receiver FIFO.
This interrupt is generated immediately after receiving the EOF symbol. The RXF flag is set. If there are
multiple messages in the receiver FIFO, the RXF flag is set as soon as the next message is shifted to the
foreground buffer.
16.4.7.4 Wake-Up Interrupt
A wake-up interrupt is generated if activity on the CAN bus occurs during MSCAN sleep or power-down
mode.
NOTE
This interrupt can only occur if the MSCAN was in sleep mode (SLPRQ = 1
and SLPAK = 1) before entering power down mode, the wake-up option is
enabled (WUPE = 1), and the wake-up interrupt is enabled (WUPIE = 1).
16.4.7.5 Error Interrupt
An error interrupt is generated if an overrun of the receiver FIFO, error, warning, or bus-off condition
occurrs. MSCAN Receiver Flag Register (CANRFLG) indicates one of the following conditions:
•Overrun — An overrun condition of the receiver FIFO as described in Section 16.4.2.3, “Receive
Structures,” occurred.
•CAN Status Change — The actual value of the transmit and receive error counters control the
CAN bus state of the MSCAN. As soon as the error counters skip into a critical range
(Tx/Rx-warning, Tx/Rx-error, bus-off) the MSCAN flags an error condition. The status change,
which caused the error condition, is indicated by the TSTAT and RSTAT flags (see
Section 16.3.2.5, “MSCAN Receiver Flag Register (CANRFLG)” and Section 16.3.2.6, “MSCAN
Receiver Interrupt Enable Register (CANRIER)”).
16.4.7.6 Interrupt Acknowledge
Interrupts are directly associated with one or more status flags in either the MSCAN Receiver Flag Register
(CANRFLG) or the MSCAN Transmitter Flag Register (CANTFLG). Interrupts are pending as long as
one of the corresponding flags is set. The flags in CANRFLG and CANTFLG must be reset within the
interrupt handler to handshake the interrupt. The flags are reset by writing a 1 to the corresponding bit
position. A flag cannot be cleared if the respective condition prevails.
NOTE
It must be guaranteed that the CPU clears only the bit causing the current
interrupt. For this reason, bit manipulation instructions (BSET) must not be
used to clear interrupt flags. These instructions may cause accidental
clearing of interrupt flags which are set after entering the current interrupt
service routine.
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 533
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16.5 Initialization/Application Information
16.5.1 MSCAN initialization
The procedure to initially start up the MSCAN module out of reset is as follows:
1. Assert CANE
2. Write to the configuration registers in initialization mode
3. Clear INITRQ to leave initialization mode
If the configuration of registers which are only writable in initialization mode shall be changed:
1. Bring the module into sleep mode by setting SLPRQ and awaiting SLPAK to assert after the CAN
bus becomes idle.
2. Enter initialization mode: assert INITRQ and await INITAK
3. Write to the configuration registers in initialization mode
4. Clear INITRQ to leave initialization mode and continue
16.5.2 Bus-Off Recovery
The bus-off recovery is user configurable. The bus-off state can either be left automatically or on user
request.
For reasons of backwards compatibility, the MSCAN defaults to automatic recovery after reset. In this
case, the MSCAN will become error active again after counting 128 occurrences of 11 consecutive
recessive bits on the CAN bus (see the Bosch CAN 2.0 A/B specification for details).
If the MSCAN is configured for user request (BORM set in MSCAN Control Register 1 (CANCTL1)), the
recovery from bus-off starts after both independent events have become true:
• 128 occurrences of 11 consecutive recessive bits on the CAN bus have been monitored
• BOHOLD in MSCAN Miscellaneous Register (CANMISC) has been cleared by the user
These two events may occur in any order.
Freescale’s Scalable Controller Area Network (S12MSCANV3)
MC9S12G Family Reference Manual, Rev.1.06
534 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 535
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 17
Pulse-Width Modulator (S12PWM8B8CV2)
17.1 Introduction
The Version 2 of S12 PWM module is a channel scalable and optimized implementation of S12
PWM8B8C Version 1. The channel is scalable in pairs from PWM0 to PWM7 and the available channel
number is 2, 4, 6 and 8. The shutdown feature has been removed and the flexibility to select one of four
clock sources per channel has improved. If the corresponding channels exist and shutdown feature is not
used, the Version 2 is fully software compatible to Version 1.
17.1.1 Features
The scalable PWM block includes these distinctive features:
• Up to eight independent PWM channels, scalable in pairs (PWM0 to PWM7)
• Available channel number could be 2, 4, 6, 8 (refer to device specification for exact number)
• Programmable period and duty cycle for each channel
• Dedicated counter for each PWM channel
• Programmable PWM enable/disable for each channel
• Software selection of PWM duty pulse polarity for each channel
• Period and duty cycle are double buffered. Change takes effect when the end of the effective period
is reached (PWM counter reaches zero) or when the channel is disabled.
• Programmable center or left aligned outputs on individual channels
• Up to eight 8-bit channel or four 16-bit channel PWM resolution
• Four clock sources (A, B, SA, and SB) provide for a wide range of frequencies
• Programmable clock select logic
17.1.2 Modes of Operation
There is a software programmable option for low power consumption in wait mode that disables the input
clock to the prescaler.
In freeze mode there is a software programmable option to disable the input clock to the prescaler. This is
useful for emulation.
Wait: The prescaler keeps on running, unless PSWAI in PWMCTL is set to 1.
Freeze: The prescaler keeps on running, unless PFRZ in PWMCTL is set to 1.
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
536 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
17.1.3 Block Diagram
Figure 17-1 shows the block diagram for the 8-bit up to 8-channel scalable PWM block.
Figure 17-1. Scalable PWM Block Diagram
17.2 External Signal Description
The scalable PWM module has a selected number of external pins. Refer to device specification for exact
number.
17.2.1 PWM7 - PWM0 — PWM Channel 7 - 0
Those pins serve as waveform output of PWM channel 7 - 0.
Period and Duty Counter
Channel 6
Clock Select PWM Clock
Period and Duty Counter
Channel 5
Period and Duty Counter
Channel 4
Period and Duty Counter
Channel 3
Period and Duty Counter
Channel 2
Period and Duty Counter
Channel 1
Alignment
Polarity
Control
PWM8B8C
PWM6
PWM5
PWM4
PWM3
PWM2
PWM1
Enable
PWM Channels
Period and Duty Counter
Channel 7
Period and Duty Counter
Channel 0
PWM0
PWM7
Bus Clock
Maximum possible channels, scalable in pairs from PWM0 to PWM7.
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 537
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
17.3 Memory Map and Register Definition
17.3.1 Module Memory Map
This section describes the content of the registers in the scalable PWM module. The base address of the
scalable PWM module is determined at the MCU level when the MCU is defined. The register decode map
is fixed and begins at the first address of the module address offset. The figure below shows the registers
associated with the scalable PWM and their relative offset from the base address. The register detail
description follows the order they appear in the register map.
Reserved bits within a register will always read as 0 and the write will be unimplemented. Unimplemented
functions are indicated by shading the bit.
NOTE
Register Address = Base Address + Address Offset, where the Base Address
is defined at the MCU level and the Address Offset is defined at the module
level.
17.3.2 Register Descriptions
This section describes in detail all the registers and register bits in the scalable PWM module.
Register
Name Bit 7 6 5 4 3 2 1 Bit 0
0x0000
PWME1RPWME7 PWME6 PWME5 PWME4 PWME3 PWME2 PWME1 PWME0
W
0x0001
PWMPOL1RPPOL7 PPOL6 PPOL5 PPOL4 PPOL3 PPOL2 PPOL1 PPOL0
W
0x0002
PWMCLK1RPCLK7 PCLKL6 PCLK5 PCLK4 PCLK3 PCLK2 PCLK1 PCLK0
W
0x0003
PWMPRCLK
R0 PCKB2 PCKB1 PCKB0 0PCKA2 PCKA1 PCKA0
W
0x0004
PWMCAE1RCAE7 CAE6 CAE5 CAE4 CAE3 CAE2 CAE1 CAE0
W
0x0005
PWMCTL1RCON67 CON45 CON23 CON01 PSWAI PFRZ 00
W
0x0006
PWMCLKAB1RPCLKAB7 PCLKAB6 PCLKAB5 PCLKAB4 PCLKAB3 PCLKAB2 PCLKAB1 PCLKAB0
W
= Unimplemented or Reserved
Figure 17-2. The scalable PWM Register Summary (Sheet 1 of 4)
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
538 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x0007
RESERVED
R00 0 00000
W
0x0008
PWMSCLA
RBit 7 6 5 4 3 2 1 Bit 0
W
0x0009
PWMSCLB
RBit 7 6 5 4 3 2 1 Bit 0
W
0x000A
RESERVED
R00 0 00000
W
0x000B
RESERVED
R00 0 00000
W
0x000C
PWMCNT02R Bit 7 6 5 4 3 2 1 Bit 0
W00 0 00000
0x000D
PWMCNT12R Bit 7 6 5 4 3 2 1 Bit 0
W00 0 00000
0x000E
PWMCNT22R Bit 7 6 5 4 3 2 1 Bit 0
W00 0 00000
0x000F
PWMCNT32R Bit 7 6 5 4 3 2 1 Bit 0
W00 0 00000
0x0010
PWMCNT42R Bit 7 6 5 4 3 2 1 Bit 0
W00 0 00000
0x0011
PWMCNT52R Bit 7 6 5 4 3 2 1 Bit 0
W00 0 00000
0x0012
PWMCNT62R Bit 7 6 5 4 3 2 1 Bit 0
W00 0 00000
0x0013
PWMCNT72R Bit 7 6 5 4 3 2 1 Bit 0
W00 0 00000
0x0014
PWMPER02RBit 7 6 5 4 3 2 1 Bit 0
W
0x0015
PWMPER12RBit 7 6 5 4 3 2 1 Bit 0
W
Register
Name Bit 7 6 5 4 3 2 1 Bit 0
= Unimplemented or Reserved
Figure 17-2. The scalable PWM Register Summary (Sheet 1 of 4)
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 539
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x0016
PWMPER22RBit 7 6 5 4 3 2 1 Bit 0
W
0x0017
PWMPER32RBit 7 6 5 4 3 2 1 Bit 0
W
0x0018
PWMPER42RBit 7 6 5 4 3 2 1 Bit 0
W
0x0019
PWMPER52RBit 7 6 5 4 3 2 1 Bit 0
W
0x001A
PWMPER62RBit 7 6 5 4 3 2 1 Bit 0
W
0x001B
PWMPER72RBit 7 6 5 4 3 2 1 Bit 0
W
0x001C
PWMDTY02RBit 7 6 5 4 3 2 1 Bit 0
W
0x001D
PWMDTY12RBit 7 6 5 4 3 2 1 Bit 0
W
0x001E
PWMDTY22RBit 7 6 5 4 3 2 1 Bit 0
W
0x001F
PWMDTY32RBit 7 6 5 4 3 2 1 Bit 0
W
0x0010
PWMDTY42RBit 7 6 5 4 3 2 1 Bit 0
W
0x0021
PWMDTY52RBit 7 6 5 4 3 2 1 Bit 0
W
0x0022
PWMDTY62RBit 7 6 5 4 3 2 1 Bit 0
W
0x0023
PWMDTY72RBit 7 6 5 4 3 2 1 Bit 0
W
0x0024
RESERVED
R00 0 00000
W
Register
Name Bit 7 6 5 4 3 2 1 Bit 0
= Unimplemented or Reserved
Figure 17-2. The scalable PWM Register Summary (Sheet 1 of 4)
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
540 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
17.3.2.1 PWM Enable Register (PWME)
Each PWM channel has an enable bit (PWMEx) to start its waveform output. When any of the PWMEx
bits are set (PWMEx = 1), the associated PWM output is enabled immediately. However, the actual PWM
waveform is not available on the associated PWM output until its clock source begins its next cycle due to
the synchronization of PWMEx and the clock source.
NOTE
The first PWM cycle after enabling the channel can be irregular.
An exception to this is when channels are concatenated. Once concatenated mode is enabled (CONxx bits
set in PWMCTL register), enabling/disabling the corresponding 16-bit PWM channel is controlled by the
low order PWMEx bit. In this case, the high order bytes PWMEx bits have no effect and their
corresponding PWM output lines are disabled.
While in run mode, if all existing PWM channels are disabled (PWMEx–0 = 0), the prescaler counter shuts
off for power savings.
Read: Anytime
Write: Anytime
0x0025
RESERVED
R00 0 00000
W
0x0026
RESERVED
R00 0 00000
W
0x0027
RESERVED
R00 0 00000
W
1The related bit is available only if corresponding channel exists.
2The register is available only if corresponding channel exists.
Module Base + 0x0000
76543210
RPWME7 PWME6 PWME5 PWME4 PWME3 PWME2 PWME1 PWME0
W
Reset 0 0 0 00000
Figure 17-3. PWM Enable Register (PWME)
Register
Name Bit 7 6 5 4 3 2 1 Bit 0
= Unimplemented or Reserved
Figure 17-2. The scalable PWM Register Summary (Sheet 1 of 4)
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 541
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
17.3.2.2 PWM Polarity Register (PWMPOL)
The starting polarity of each PWM channel waveform is determined by the associated PPOLx bit in the
PWMPOL register. If the polarity bit is one, the PWM channel output is high at the beginning of the cycle
and then goes low when the duty count is reached. Conversely, if the polarity bit is zero, the output starts
low and then goes high when the duty count is reached.
Table 17-2. PWME Field Descriptions
Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from
unavailable bits return a zero
Field Description
7
PWME7
Pulse Width Channel 7 Enable
0 Pulse width channel 7 is disabled.
1 Pulse width channel 7 is enabled. The pulse modulated signal becomes available at PWM output bit 7 when
its clock source begins its next cycle.
6
PWME6
Pulse Width Channel 6 Enable
0 Pulse width channel 6 is disabled.
1 Pulse width channel 6 is enabled. The pulse modulated signal becomes available at PWM output bit 6 when
its clock source begins its next cycle. If CON67=1, then bit has no effect and PWM output line 6 is disabled.
5
PWME5
Pulse Width Channel 5 Enable
0 Pulse width channel 5 is disabled.
1 Pulse width channel 5 is enabled. The pulse modulated signal becomes available at PWM output bit 5 when
its clock source begins its next cycle.
4
PWME4
Pulse Width Channel 4 Enable
0 Pulse width channel 4 is disabled.
1 Pulse width channel 4 is enabled. The pulse modulated signal becomes available at PWM, output bit 4 when
its clock source begins its next cycle. If CON45 = 1, then bit has no effect and PWM output line 4 is disabled.
3
PWME3
Pulse Width Channel 3 Enable
0 Pulse width channel 3 is disabled.
1 Pulse width channel 3 is enabled. The pulse modulated signal becomes available at PWM, output bit 3 when
its clock source begins its next cycle.
2
PWME2
Pulse Width Channel 2 Enable
0 Pulse width channel 2 is disabled.
1 Pulse width channel 2 is enabled. The pulse modulated signal becomes available at PWM, output bit 2 when
its clock source begins its next cycle. If CON23 = 1, then bit has no effect and PWM output line 2 is disabled.
1
PWME1
Pulse Width Channel 1 Enable
0 Pulse width channel 1 is disabled.
1 Pulse width channel 1 is enabled. The pulse modulated signal becomes available at PWM, output bit 1 when
its clock source begins its next cycle.
0
PWME0
Pulse Width Channel 0 Enable
0 Pulse width channel 0 is disabled.
1 Pulse width channel 0 is enabled. The pulse modulated signal becomes available at PWM, output bit 0 when
its clock source begins its next cycle. If CON01 = 1, then bit has no effect and PWM output line 0 is disabled.
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
542 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Read: Anytime
Write: Anytime
NOTE
PPOLx register bits can be written anytime. If the polarity is changed while
a PWM signal is being generated, a truncated or stretched pulse can occur
during the transition
17.3.2.3 PWM Clock Select Register (PWMCLK)
Each PWM channel has a choice of four clocks to use as the clock source for that channel as described
below.
Read: Anytime
Write: Anytime
NOTE
Register bits PCLK0 to PCLK7 can be written anytime. If a clock select is
changed while a PWM signal is being generated, a truncated or stretched
pulse can occur during the transition.
Module Base + 0x0001
76543210
RPPOL7 PPOL6 PPOL5 PPOL4 PPOL3 PPOL2 PPOL1 PPOL0
W
Reset 0 0 0 00000
Figure 17-4. PWM Polarity Register (PWMPOL)
Table 17-3. PWMPOL Field Descriptions
Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from
unavailable bits return a zero
Field Description
7–0
PPOL[7:0]
Pulse Width Channel 7–0 Polarity Bits
0 PWM channel 7–0 outputs are low at the beginning of the period, then go high when the duty count is
reached.
1 PWM channel 7–0 outputs are high at the beginning of the period, then go low when the duty count is
reached.
Module Base + 0x0002
76543210
RPCLK7 PCLKL6 PCLK5 PCLK4 PCLK3 PCLK2 PCLK1 PCLK0
W
Reset 0 0 0 00000
Figure 17-5. PWM Clock Select Register (PWMCLK)
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 543
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The clock source of each PWM channel is determined by PCLKx bits in PWMCLK and PCLKABx bits
in PWMCLKAB (see Section 17.3.2.7, “PWM Clock A/B Select Register (PWMCLKAB)). For Channel
0, 1, 4, 5, the selection is shown in Table 17-5; For Channel 2, 3, 6, 7, the selection is shown in Table 17-6.
Table 17-5. PWM Channel 0, 1, 4, 5 Clock Source Selection
Table 17-6. PWM Channel 2, 3, 6, 7 Clock Source Selection
17.3.2.4 PWM Prescale Clock Select Register (PWMPRCLK)
This register selects the prescale clock source for clocks A and B independently.
Read: Anytime
Write: Anytime
NOTE
PCKB2–0 and PCKA2–0 register bits can be written anytime. If the clock
pre-scale is changed while a PWM signal is being generated, a truncated or
stretched pulse can occur during the transition.
Table 17-4. PWMCLK Field Descriptions
Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from
unavailable bits return a zero
Field Description
7-0
PCLK[7:0]
Pulse Width Channel 7-0 Clock Select
0 Clock A or B is the clock source for PWM channel 7-0, as shown in Table 17-5 and Table 17-6.
1 Clock SA or SB is the clock source for PWM channel 7-0, as shown in Table 17-5 and Table 17-6.
PCLKAB[0,1,4,5] PCLK[0,1,4,5] Clock Source Selection
0 0 Clock A
0 1 Clock SA
1 0 Clock B
1 1 Clock SB
PCLKAB[2,3,6,7] PCLK[2,3,6,7] Clock Source Selection
0 0 Clock B
0 1 Clock SB
1 0 Clock A
1 1 Clock SA
Module Base + 0x0003
76543210
R0 PCKB2 PCKB1 PCKB0 0PCKA2 PCKA1 PCKA0
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 17-6. PWM Prescale Clock Select Register (PWMPRCLK)
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
544 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
s
17.3.2.5 PWM Center Align Enable Register (PWMCAE)
The PWMCAE register contains eight control bits for the selection of center aligned outputs or left aligned
outputs for each PWM channel. If the CAEx bit is set to a one, the corresponding PWM output will be
center aligned. If the CAEx bit is cleared, the corresponding PWM output will be left aligned. See
Section 17.4.2.5, “Left Aligned Outputs” and Section 17.4.2.6, “Center Aligned Outputs” for a more
detailed description of the PWM output modes.
Read: Anytime
Write: Anytime
NOTE
Write these bits only when the corresponding channel is disabled.
Table 17-7. PWMPRCLK Field Descriptions
Field Description
6–4
PCKB[2:0]
Prescaler Select for Clock B — Clock B is one of two clock sources which can be used for all channels. These
three bits determine the rate of clock B, as shown in Table 17-8.
2–0
PCKA[2:0]
Prescaler Select for Clock A — Clock A is one of two clock sources which can be used for all channels. These
three bits determine the rate of clock A, as shown in Table 17-8.
Table 17-8. Clock A or Clock B Prescaler Selects
PCKA/B2 PCKA/B1 PCKA/B0 Value of Clock A/B
0 0 0 Bus clock
0 0 1 Bus clock / 2
0 1 0 Bus clock / 4
0 1 1 Bus clock / 8
1 0 0 Bus clock / 16
1 0 1 Bus clock / 32
1 1 0 Bus clock / 64
1 1 1 Bus clock / 128
Module Base + 0x0004
76543210
RCAE7 CAE6 CAE5 CAE4 CAE3 CAE2 CAE1 CAE0
W
Reset 0 0 0 00000
Figure 17-7. PWM Center Align Enable Register (PWMCAE)
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 545
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
17.3.2.6 PWM Control Register (PWMCTL)
The PWMCTL register provides for various control of the PWM module.
Read: Anytime
Write: Anytime
There are up to four control bits for concatenation, each of which is used to concatenate a pair of PWM
channels into one 16-bit channel. If the corresponding channels do not exist on a particular derivative, then
writes to these bits have no effect and reads will return zeroes. When channels 6 and 7are concatenated,
channel 6 registers become the high order bytes of the double byte channel. When channels 4 and 5 are
concatenated, channel 4 registers become the high order bytes of the double byte channel. When channels
2 and 3 are concatenated, channel 2 registers become the high order bytes of the double byte channel.
When channels 0 and 1 are concatenated, channel 0 registers become the high order bytes of the double
byte channel.
See Section 17.4.2.7, “PWM 16-Bit Functions” for a more detailed description of the concatenation PWM
Function.
NOTE
Change these bits only when both corresponding channels are disabled.
Table 17-9. PWMCAE Field Descriptions
Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from
unavailable bits return a zero
Field Description
7–0
CAE[7:0]
Center Aligned Output Modes on Channels 7–0
0 Channels 7–0 operate in left aligned output mode.
1 Channels 7–0 operate in center aligned output mode.
Module Base + 0x0005
76543210
RCON67 CON45 CON23 CON01 PSWAI PFRZ 00
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 17-8. PWM Control Register (PWMCTL)
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
546 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
17.3.2.7 PWM Clock A/B Select Register (PWMCLKAB)
Each PWM channel has a choice of four clocks to use as the clock source for that channel as described
below.
Table 17-10. PWMCTL Field Descriptions
Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from
unavailable bits return a zero
Field Description
7
CON67
Concatenate Channels 6 and 7
0 Channels 6 and 7 are separate 8-bit PWMs.
1 Channels 6 and 7 are concatenated to create one 16-bit PWM channel. Channel 6 becomes the high order
byte and channel 7 becomes the low order byte. Channel 7 output pin is used as the output for this 16-bit
PWM (bit 7 of port PWMP). Channel 7 clock select control-bit determines the clock source, channel 7 polarity
bit determines the polarity, channel 7 enable bit enables the output and channel 7 center aligned enable bit
determines the output mode.
6
CON45
Concatenate Channels 4 and 5
0 Channels 4 and 5 are separate 8-bit PWMs.
1 Channels 4 and 5 are concatenated to create one 16-bit PWM channel. Channel 4 becomes the high order
byte and channel 5 becomes the low order byte. Channel 5 output pin is used as the output for this 16-bit
PWM (bit 5 of port PWMP). Channel 5 clock select control-bit determines the clock source, channel 5 polarity
bit determines the polarity, channel 5 enable bit enables the output and channel 5 center aligned enable bit
determines the output mode.
5
CON23
Concatenate Channels 2 and 3
0 Channels 2 and 3 are separate 8-bit PWMs.
1 Channels 2 and 3 are concatenated to create one 16-bit PWM channel. Channel 2 becomes the high order
byte and channel 3 becomes the low order byte. Channel 3 output pin is used as the output for this 16-bit
PWM (bit 3 of port PWMP). Channel 3 clock select control-bit determines the clock source, channel 3 polarity
bit determines the polarity, channel 3 enable bit enables the output and channel 3 center aligned enable bit
determines the output mode.
4
CON01
Concatenate Channels 0 and 1
0 Channels 0 and 1 are separate 8-bit PWMs.
1 Channels 0 and 1 are concatenated to create one 16-bit PWM channel. Channel 0 becomes the high order
byte and channel 1 becomes the low order byte. Channel 1 output pin is used as the output for this 16-bit
PWM (bit 1 of port PWMP). Channel 1 clock select control-bit determines the clock source, channel 1 polarity
bit determines the polarity, channel 1 enable bit enables the output and channel 1 center aligned enable bit
determines the output mode.
3
PSWAI
PWM Stops in Wait Mode — Enabling this bit allows for lower power consumption in wait mode by disabling the
input clock to the prescaler.
0 Allow the clock to the prescaler to continue while in wait mode.
1 Stop the input clock to the prescaler whenever the MCU is in wait mode.
2
PFRZ
PWM Counters Stop in Freeze Mode — In freeze mode, there is an option to disable the input clock to the
prescaler by setting the PFRZ bit in the PWMCTL register. If this bit is set, whenever the MCU is in freeze mode,
the input clock to the prescaler is disabled. This feature is useful during emulation as it allows the PWM function
to be suspended. In this way, the counters of the PWM can be stopped while in freeze mode so that once normal
program flow is continued, the counters are re-enabled to simulate real-time operations. Since the registers can
still be accessed in this mode, to re-enable the prescaler clock, either disable the PFRZ bit or exit freeze mode.
0 Allow PWM to continue while in freeze mode.
1 Disable PWM input clock to the prescaler whenever the part is in freeze mode. This is useful for emulation.
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 547
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Read: Anytime
Write: Anytime
NOTE
Register bits PCLKAB0 to PCLKAB7 can be written anytime. If a clock
select is changed while a PWM signal is being generated, a truncated or
stretched pulse can occur during the transition.
Module Base + 0x00006
76543210
RPCLKAB7 PCLKAB6 PCLKAB5 PCLKAB4 PCLKAB3 PCLKAB2 PCLKAB1 PCLKAB0
W
Reset 0 0 0 00000
Figure 17-9. PWM Clock Select Register (PWMCLKAB)
Table 17-11. PWMCLK Field Descriptions
Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from
unavailable bits return a zero
Field Description
7
PCLKAB7
Pulse Width Channel 7 Clock A/B Select
0 Clock B or SB is the clock source for PWM channel 7, as shown in Table 17-6.
1 Clock A or SA is the clock source for PWM channel 7, as shown in Table 17-6.
6
PCLKAB6
Pulse Width Channel 6 Clock A/B Select
0 Clock B or SB is the clock source for PWM channel 6, as shown in Table 17-6.
1 Clock A or SA is the clock source for PWM channel 6, as shown in Table 17-6.
5
PCLKAB5
Pulse Width Channel 5 Clock A/B Select
0 Clock A or SA is the clock source for PWM channel 5, as shown in Table 17-5.
1 Clock B or SB is the clock source for PWM channel 5, as shown in Table 17-5.
4
PCLKAB4
Pulse Width Channel 4 Clock A/B Select
0 Clock A or SA is the clock source for PWM channel 4, as shown in Table 17-5.
1 Clock B or SB is the clock source for PWM channel 4, as shown in Table 17-5.
3
PCLKAB3
Pulse Width Channel 3 Clock A/B Select
0 Clock B or SB is the clock source for PWM channel 3, as shown in Table 17-6.
1 Clock A or SA is the clock source for PWM channel 3, as shown in Table 17-6.
2
PCLKAB2
Pulse Width Channel 2 Clock A/B Select
0 Clock B or SB is the clock source for PWM channel 2, as shown in Table 17-6.
1 Clock A or SA is the clock source for PWM channel 2, as shown in Table 17-6.
1
PCLKAB1
Pulse Width Channel 1 Clock A/B Select
0 Clock A or SA is the clock source for PWM channel 1, as shown in Table 17-5.
1 Clock B or SB is the clock source for PWM channel 1, as shown in Table 17-5.
0
PCLKAB0
Pulse Width Channel 0 Clock A/B Select
0 Clock A or SA is the clock source for PWM channel 0, as shown in Table 17-5.
1 Clock B or SB is the clock source for PWM channel 0, as shown in Table 17-5.
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
548 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The clock source of each PWM channel is determined by PCLKx bits in PWMCLK (see Section 17.3.2.3,
“PWM Clock Select Register (PWMCLK)) and PCLKABx bits in PWMCLKAB as shown in Table 17-5
and Table 17-6.
17.3.2.8 PWM Scale A Register (PWMSCLA)
PWMSCLA is the programmable scale value used in scaling clock A to generate clock SA. Clock SA is
generated by taking clock A, dividing it by the value in the PWMSCLA register and dividing that by two.
Clock SA = Clock A / (2 * PWMSCLA)
NOTE
When PWMSCLA = $00, PWMSCLA value is considered a full scale value
of 256. Clock A is thus divided by 512.
Any value written to this register will cause the scale counter to load the new scale value (PWMSCLA).
Read: Anytime
Write: Anytime (causes the scale counter to load the PWMSCLA value)
17.3.2.9 PWM Scale B Register (PWMSCLB)
PWMSCLB is the programmable scale value used in scaling clock B to generate clock SB. Clock SB is
generated by taking clock B, dividing it by the value in the PWMSCLB register and dividing that by two.
Clock SB = Clock B / (2 * PWMSCLB)
NOTE
When PWMSCLB = $00, PWMSCLB value is considered a full scale value
of 256. Clock B is thus divided by 512.
Any value written to this register will cause the scale counter to load the new scale value (PWMSCLB).
Read: Anytime
Write: Anytime (causes the scale counter to load the PWMSCLB value).
Module Base + 0x0008
76543210
RBit 7 6 5 4 3 2 1 Bit 0
W
Reset 0 0 0 00000
Figure 17-10. PWM Scale A Register (PWMSCLA)
Module Base + 0x0009
76543210
RBit 7 6 5 4 3 2 1 Bit 0
W
Reset 0 0 0 00000
Figure 17-11. PWM Scale B Register (PWMSCLB)
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 549
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
17.3.2.10 PWM Channel Counter Registers (PWMCNTx)
Each channel has a dedicated 8-bit up/down counter which runs at the rate of the selected clock source.
The counter can be read at any time without affecting the count or the operation of the PWM channel. In
left aligned output mode, the counter counts from 0 to the value in the period register - 1. In center aligned
output mode, the counter counts from 0 up to the value in the period register and then back down to 0.
Any value written to the counter causes the counter to reset to $00, the counter direction to be set to up,
the immediate load of both duty and period registers with values from the buffers, and the output to change
according to the polarity bit. The counter is also cleared at the end of the effective period (see
Section 17.4.2.5, “Left Aligned Outputs” and Section 17.4.2.6, “Center Aligned Outputs” for more
details). When the channel is disabled (PWMEx = 0), the PWMCNTx register does not count. When a
channel becomes enabled (PWMEx = 1), the associated PWM counter starts at the count in the
PWMCNTx register. For more detailed information on the operation of the counters, see Section 17.4.2.4,
“PWM Timer Counters”.
In concatenated mode, writes to the 16-bit counter by using a 16-bit access or writes to either the low or
high order byte of the counter will reset the 16-bit counter. Reads of the 16-bit counter must be made by
16-bit access to maintain data coherency.
NOTE
Writing to the counter while the channel is enabled can cause an irregular
PWM cycle to occur.
1This register is available only when the corresponding channel exists and is reserved if that channel does not exist. Writes to
a reserved register have no functional effect. Reads from a reserved register return zeroes.
Read: Anytime
Write: Anytime (any value written causes PWM counter to be reset to $00).
17.3.2.11 PWM Channel Period Registers (PWMPERx)
There is a dedicated period register for each channel. The value in this register determines the period of
the associated PWM channel.
The period registers for each channel are double buffered so that if they change while the channel is
enabled, the change will NOT take effect until one of the following occurs:
• The effective period ends
Module Base + 0x000C = PWMCNT0, 0x000D = PWMCNT1, 0x000E = PWMCNT2, 0x000F = PWMCNT3
Module Base + 0x0010 = PWMCNT4, 0x0011 = PWMCNT5, 0x0012 = PWMCNT6, 0x0013 = PWMCNT7
76543210
R Bit 7 6 5 4 3 2 1 Bit 0
W00000000
Reset 0 0 0 00000
Figure 17-12. PWM Channel Counter Registers (PWMCNTx)
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
550 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
• The counter is written (counter resets to $00)
• The channel is disabled
In this way, the output of the PWM will always be either the old waveform or the new waveform, not some
variation in between. If the channel is not enabled, then writes to the period register will go directly to the
latches as well as the buffer.
NOTE
Reads of this register return the most recent value written. Reads do not
necessarily return the value of the currently active period due to the double
buffering scheme.
See Section 17.4.2.3, “PWM Period and Duty” for more information.
To calculate the output period, take the selected clock source period for the channel of interest (A, B, SA,
or SB) and multiply it by the value in the period register for that channel:
• Left aligned output (CAEx = 0)
PWMx Period = Channel Clock Period * PWMPERx
• Center Aligned Output (CAEx = 1)
PWMx Period = Channel Clock Period * (2 * PWMPERx)
For boundary case programming values, please refer to Section 17.4.2.8, “PWM Boundary Cases”.
1This register is available only when the corresponding channel exists and is reserved if that channel does not exist. Writes to
a reserved register have no functional effect. Reads from a reserved register return zeroes.
Read: Anytime
Write: Anytime
17.3.2.12 PWM Channel Duty Registers (PWMDTYx)
There is a dedicated duty register for each channel. The value in this register determines the duty of the
associated PWM channel. The duty value is compared to the counter and if it is equal to the counter value
a match occurs and the output changes state.
The duty registers for each channel are double buffered so that if they change while the channel is enabled,
the change will NOT take effect until one of the following occurs:
• The effective period ends
• The counter is written (counter resets to $00)
Module Base + 0x0014 = PWMPER0, 0x0015 = PWMPER1, 0x0016 = PWMPER2, 0x0017 = PWMPER3
Module Base + 0x0018 = PWMPER4, 0x0019 = PWMPER5, 0x001A = PWMPER6, 0x001B = PWMPER7
76543210
RBit 7 6 5 4 3 2 1 Bit 0
W
Reset 1 1 1 11111
Figure 17-13. PWM Channel Period Registers (PWMPERx)
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 551
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
• The channel is disabled
In this way, the output of the PWM will always be either the old duty waveform or the new duty waveform,
not some variation in between. If the channel is not enabled, then writes to the duty register will go directly
to the latches as well as the buffer.
NOTE
Reads of this register return the most recent value written. Reads do not
necessarily return the value of the currently active duty due to the double
buffering scheme.
See Section 17.4.2.3, “PWM Period and Duty” for more information.
NOTE
Depending on the polarity bit, the duty registers will contain the count of
either the high time or the low time. If the polarity bit is one, the output starts
high and then goes low when the duty count is reached, so the duty registers
contain a count of the high time. If the polarity bit is zero, the output starts
low and then goes high when the duty count is reached, so the duty registers
contain a count of the low time.
To calculate the output duty cycle (high time as a% of period) for a particular channel:
• Polarity = 0 (PPOL x =0)
Duty Cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100%
• Polarity = 1 (PPOLx = 1)
Duty Cycle = [PWMDTYx / PWMPERx] * 100%
For boundary case programming values, please refer to Section 17.4.2.8, “PWM Boundary Cases”.
1This register is available only when the corresponding channel exists and is reserved if that channel does not exist. Writes to
a reserved register have no functional effect. Reads from a reserved register return zeroes.
Read: Anytime
Write: Anytime
Module Base + 0x001C = PWMDTY0, 0x001D = PWMDTY1, 0x001E = PWMDTY2, 0x001F = PWMDTY3
Module Base + 0x0020 = PWMDTY4, 0x0021 = PWMDTY5, 0x0022 = PWMDTY6, 0x0023 = PWMDTY7
76543210
RBit 7 6 5 4 3 2 1 Bit 0
W
Reset 1 1 1 11111
Figure 17-14. PWM Channel Duty Registers (PWMDTYx)
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
552 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
17.4 Functional Description
17.4.1 PWM Clock Select
There are four available clocks: clock A, clock B, clock SA (scaled A), and clock SB (scaled B). These
four clocks are based on the bus clock.
Clock A and B can be software selected to be 1, 1/2, 1/4, 1/8,..., 1/64, 1/128 times the bus clock. Clock SA
uses clock A as an input and divides it further with a reloadable counter. Similarly, clock SB uses clock B
as an input and divides it further with a reloadable counter. The rates available for clock SA are software
selectable to be clock A divided by 2, 4, 6, 8,..., or 512 in increments of divide by 2. Similar rates are
available for clock SB. Each PWM channel has the capability of selecting one of four clocks, clock A,
Clock B, clock SA or clock SB.
The block diagram in Figure 17-15 shows the four different clocks and how the scaled clocks are created.
17.4.1.1 Prescale
The input clock to the PWM prescaler is the bus clock. It can be disabled whenever the part is in freeze
mode by setting the PFRZ bit in the PWMCTL register. If this bit is set, whenever the MCU is in freeze
mode (freeze mode signal active) the input clock to the prescaler is disabled. This is useful for emulation
in order to freeze the PWM. The input clock can also be disabled when all available PWM channels are
disabled (PWMEx-0 = 0). This is useful for reducing power by disabling the prescale counter.
Clock A and clock B are scaled values of the input clock. The value is software selectable for both clock
A and clock B and has options of 1, 1/2, 1/4, 1/8, 1/16, 1/32, 1/64, or 1/128 times the bus clock. The value
selected for clock A is determined by the PCKA2, PCKA1, PCKA0 bits in the PWMPRCLK register. The
value selected for clock B is determined by the PCKB2, PCKB1, PCKB0 bits also in the PWMPRCLK
register.
17.4.1.2 Clock Scale
The scaled A clock uses clock A as an input and divides it further with a user programmable value and
then divides this by 2. The scaled B clock uses clock B as an input and divides it further with a user
programmable value and then divides this by 2. The rates available for clock SA are software selectable to
be clock A divided by 2, 4, 6, 8,..., or 512 in increments of divide by 2. Similar rates are available for clock
SB.
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 553
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 17-15. PWM Clock Select Block Diagram
1282 4 8 16 32 64
PCKB2
PCKB1
PCKB0
M
U
X
Clock A
Clock B
Clock SA
Clock A/2, A/4, A/6,....A/512
Prescale Scale
Divide by
PFRZ
Freeze Mode Signal
Bus Clock
Clock Select
M
U
X
Clock to
PWM Ch 0
M
U
X
Clock to
PWM Ch 2
M
U
X
Clock to
PWM Ch 1
M
U
X
Clock to
PWM Ch 4
M
U
X
Clock to
PWM Ch 5
M
U
X
Clock to
PWM Ch 6
M
U
X
Clock to
PWM Ch 7
M
U
X
Clock to
PWM Ch 3
Load
DIV 2
PWMSCLB Clock SB
Clock B/2, B/4, B/6,....B/512
M
U
X
PCKA2
PCKA1
PCKA0
PWME7-0
Count = 1
Load
DIV 2
PWMSCLA
Count = 1
8-Bit Down
Counter
8-Bit Down
Counter
Prescaler Taps:
Maximum possible channels, scalable in pairs from PWM0 to PWM7.
PCLK0 PCLKAB0
PCLK1 PCLKAB1
PCLK7 PCLKAB7
PCLK6 PCLKAB6
PCLK5 PCLKAB5
PCLK4 PCLKAB4
PCLK3 PCLKAB3
PCLK2 PCLKAB2
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
554 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Clock A is used as an input to an 8-bit down counter. This down counter loads a user programmable scale
value from the scale register (PWMSCLA). When the down counter reaches one, a pulse is output and the
8-bit counter is re-loaded. The output signal from this circuit is further divided by two. This gives a greater
range with only a slight reduction in granularity. Clock SA equals clock A divided by two times the value
in the PWMSCLA register.
NOTE
Clock SA = Clock A / (2 * PWMSCLA)
When PWMSCLA = $00, PWMSCLA value is considered a full scale value
of 256. Clock A is thus divided by 512.
Similarly, clock B is used as an input to an 8-bit down counter followed by a divide by two producing clock
SB. Thus, clock SB equals clock B divided by two times the value in the PWMSCLB register.
NOTE
Clock SB = Clock B / (2 * PWMSCLB)
When PWMSCLB = $00, PWMSCLB value is considered a full scale value
of 256. Clock B is thus divided by 512.
As an example, consider the case in which the user writes $FF into the PWMSCLA register. Clock A for
this case will be E (bus clock) divided by 4. A pulse will occur at a rate of once every 255x4 E cycles.
Passing this through the divide by two circuit produces a clock signal at an E divided by 2040 rate.
Similarly, a value of $01 in the PWMSCLA register when clock A is E divided by 4 will produce a clock
at an E divided by 8 rate.
Writing to PWMSCLA or PWMSCLB causes the associated 8-bit down counter to be re-loaded.
Otherwise, when changing rates the counter would have to count down to $01 before counting at the proper
rate. Forcing the associated counter to re-load the scale register value every time PWMSCLA or
PWMSCLB is written prevents this.
NOTE
Writing to the scale registers while channels are operating can cause
irregularities in the PWM outputs.
17.4.1.3 Clock Select
Each PWM channel has the capability of selecting one of four clocks, clock A, clock SA, clock B or clock
SB. The clock selection is done with the PCLKx control bits in the PWMCLK register and PCLKABx
control bits in PWMCLKAB register. For backward compatibility consideration, the reset value of
PWMCLK and PWMCLKAB configures following default clock selection.
For channels 0, 1, 4, and 5 the clock choices are clock A.
For channels 2, 3, 6, and 7 the clock choices are clock B.
NOTE
Changing clock control bits while channels are operating can cause
irregularities in the PWM outputs.
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 555
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
17.4.2 PWM Channel Timers
The main part of the PWM module are the actual timers. Each of the timer channels has a counter, a period
register and a duty register (each are 8-bit). The waveform output period is controlled by a match between
the period register and the value in the counter. The duty is controlled by a match between the duty register
and the counter value and causes the state of the output to change during the period. The starting polarity
of the output is also selectable on a per channel basis. Shown below in Figure 17-16 is the block diagram
for the PWM timer.
Figure 17-16. PWM Timer Channel Block Diagram
17.4.2.1 PWM Enable
Each PWM channel has an enable bit (PWMEx) to start its waveform output. When any of the PWMEx
bits are set (PWMEx = 1), the associated PWM output signal is enabled immediately. However, the actual
PWM waveform is not available on the associated PWM output until its clock source begins its next cycle
due to the synchronization of PWMEx and the clock source. An exception to this is when channels are
concatenated. Refer to Section 17.4.2.7, “PWM 16-Bit Functions” for more detail.
NOTE
The first PWM cycle after enabling the channel can be irregular.
Clock Source
T
R
Q
Q
PPOLx
From Port PWMP
Data Register
PWMEx
To Pin
Driver
Gate
8-bit Compare =
PWMDTYx
8-bit Compare =
PWMPERx
CAEx
T
R
Q
Q
8-Bit Counter
PWMCNTx
M
U
X
M
U
X
(Clock Edge
Sync)
Up/Down Reset
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
556 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
On the front end of the PWM timer, the clock is enabled to the PWM circuit by the PWMEx bit being high.
There is an edge-synchronizing circuit to guarantee that the clock will only be enabled or disabled at an
edge. When the channel is disabled (PWMEx = 0), the counter for the channel does not count.
17.4.2.2 PWM Polarity
Each channel has a polarity bit to allow starting a waveform cycle with a high or low signal. This is shown
on the block diagram Figure 17-16 as a mux select of either the Q output or the Q output of the PWM
output flip flop. When one of the bits in the PWMPOL register is set, the associated PWM channel output
is high at the beginning of the waveform, then goes low when the duty count is reached. Conversely, if the
polarity bit is zero, the output starts low and then goes high when the duty count is reached.
17.4.2.3 PWM Period and Duty
Dedicated period and duty registers exist for each channel and are double buffered so that if they change
while the channel is enabled, the change will NOT take effect until one of the following occurs:
• The effective period ends
• The counter is written (counter resets to $00)
• The channel is disabled
In this way, the output of the PWM will always be either the old waveform or the new waveform, not some
variation in between. If the channel is not enabled, then writes to the period and duty registers will go
directly to the latches as well as the buffer.
A change in duty or period can be forced into effect “immediately” by writing the new value to the duty
and/or period registers and then writing to the counter. This forces the counter to reset and the new duty
and/or period values to be latched. In addition, since the counter is readable, it is possible to know where
the count is with respect to the duty value and software can be used to make adjustments
NOTE
When forcing a new period or duty into effect immediately, an irregular
PWM cycle can occur.
Depending on the polarity bit, the duty registers will contain the count of
either the high time or the low time.
17.4.2.4 PWM Timer Counters
Each channel has a dedicated 8-bit up/down counter which runs at the rate of the selected clock source (see
Section 17.4.1, “PWM Clock Select” for the available clock sources and rates). The counter compares to
two registers, a duty register and a period register as shown in Figure 17-16. When the PWM counter
matches the duty register, the output flip-flop changes state, causing the PWM waveform to also change
state. A match between the PWM counter and the period register behaves differently depending on what
output mode is selected as shown in Figure 17-16 and described in Section 17.4.2.5, “Left Aligned
Outputs” and Section 17.4.2.6, “Center Aligned Outputs”.
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 557
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Each channel counter can be read at anytime without affecting the count or the operation of the PWM
channel.
Any value written to the counter causes the counter to reset to $00, the counter direction to be set to up,
the immediate load of both duty and period registers with values from the buffers, and the output to change
according to the polarity bit. When the channel is disabled (PWMEx = 0), the counter stops. When a
channel becomes enabled (PWMEx = 1), the associated PWM counter continues from the count in the
PWMCNTx register. This allows the waveform to continue where it left off when the channel is
re-enabled. When the channel is disabled, writing “0” to the period register will cause the counter to reset
on the next selected clock.
NOTE
If the user wants to start a new “clean” PWM waveform without any
“history” from the old waveform, the user must write to channel counter
(PWMCNTx) prior to enabling the PWM channel (PWMEx = 1).
Generally, writes to the counter are done prior to enabling a channel in order to start from a known state.
However, writing a counter can also be done while the PWM channel is enabled (counting). The effect is
similar to writing the counter when the channel is disabled, except that the new period is started
immediately with the output set according to the polarity bit.
NOTE
Writing to the counter while the channel is enabled can cause an irregular
PWM cycle to occur.
The counter is cleared at the end of the effective period (see Section 17.4.2.5, “Left Aligned Outputs” and
Section 17.4.2.6, “Center Aligned Outputs” for more details).
17.4.2.5 Left Aligned Outputs
The PWM timer provides the choice of two types of outputs, left aligned or center aligned. They are
selected with the CAEx bits in the PWMCAE register. If the CAEx bit is cleared (CAEx = 0), the
corresponding PWM output will be left aligned.
In left aligned output mode, the 8-bit counter is configured as an up counter only. It compares to two
registers, a duty register and a period register as shown in the block diagram in Figure 17-16. When the
PWM counter matches the duty register the output flip-flop changes state causing the PWM waveform to
also change state. A match between the PWM counter and the period register resets the counter and the
output flip-flop, as shown in Figure 17-16, as well as performing a load from the double buffer period and
duty register to the associated registers, as described in Section 17.4.2.3, “PWM Period and Duty”. The
counter counts from 0 to the value in the period register – 1.
Table 17-12. PWM Timer Counter Conditions
Counter Clears ($00) Counter Counts Counter Stops
When PWMCNTx register written to
any value
When PWM channel is enabled
(PWMEx = 1). Counts from last value in
PWMCNTx.
When PWM channel is disabled
(PWMEx = 0)
Effective period ends
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
558 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
Changing the PWM output mode from left aligned to center aligned output
(or vice versa) while channels are operating can cause irregularities in the
PWM output. It is recommended to program the output mode before
enabling the PWM channel.
Figure 17-17. PWM Left Aligned Output Waveform
To calculate the output frequency in left aligned output mode for a particular channel, take the selected
clock source frequency for the channel (A, B, SA, or SB) and divide it by the value in the period register
for that channel.
• PWMx Frequency = Clock (A, B, SA, or SB) / PWMPERx
• PWMx Duty Cycle (high time as a% of period):
— Polarity = 0 (PPOLx = 0)
Duty Cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100%
— Polarity = 1 (PPOLx = 1)
Duty Cycle = [PWMDTYx / PWMPERx] * 100%
As an example of a left aligned output, consider the following case:
Clock Source = E, where E = 10 MHz (100 ns period)
PPOLx = 0
PWMPERx = 4
PWMDTYx = 1
PWMx Frequency = 10 MHz/4 = 2.5 MHz
PWMx Period = 400 ns
PWMx Duty Cycle = 3/4 *100% = 75%
The output waveform generated is shown in Figure 17-18.
Figure 17-18. PWM Left Aligned Output Example Waveform
PWMDTYx
Period = PWMPERx
PPOLx = 0
PPOLx = 1
Period = 400 ns
E = 100 ns
Duty Cycle = 75%
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 559
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
17.4.2.6 Center Aligned Outputs
For center aligned output mode selection, set the CAEx bit (CAEx = 1) in the PWMCAE register and the
corresponding PWM output will be center aligned.
The 8-bit counter operates as an up/down counter in this mode and is set to up whenever the counter is
equal to $00. The counter compares to two registers, a duty register and a period register as shown in the
block diagram in Figure 17-16. When the PWM counter matches the duty register, the output flip-flop
changes state, causing the PWM waveform to also change state. A match between the PWM counter and
the period register changes the counter direction from an up-count to a down-count. When the PWM
counter decrements and matches the duty register again, the output flip-flop changes state causing the
PWM output to also change state. When the PWM counter decrements and reaches zero, the counter
direction changes from a down-count back to an up-count and a load from the double buffer period and
duty registers to the associated registers is performed, as described in Section 17.4.2.3, “PWM Period and
Duty”. The counter counts from 0 up to the value in the period register and then back down to 0. Thus the
effective period is PWMPERx*2.
NOTE
Changing the PWM output mode from left aligned to center aligned output
(or vice versa) while channels are operating can cause irregularities in the
PWM output. It is recommended to program the output mode before
enabling the PWM channel.
Figure 17-19. PWM Center Aligned Output Waveform
To calculate the output frequency in center aligned output mode for a particular channel, take the selected
clock source frequency for the channel (A, B, SA, or SB) and divide it by twice the value in the period
register for that channel.
• PWMx Frequency = Clock (A, B, SA, or SB) / (2*PWMPERx)
• PWMx Duty Cycle (high time as a% of period):
— Polarity = 0 (PPOLx = 0)
Duty Cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100%
— Polarity = 1 (PPOLx = 1)
Duty Cycle = [PWMDTYx / PWMPERx] * 100%
As an example of a center aligned output, consider the following case:
PPOLx = 0
PPOLx = 1
PWMDTYx PWMDTYx
Period = PWMPERx*2
PWMPERx
PWMPERx
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
560 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Clock Source = E, where E = 10 MHz (100 ns period)
PPOLx = 0
PWMPERx = 4
PWMDTYx = 1
PWMx Frequency = 10 MHz/8 = 1.25 MHz
PWMx Period = 800 ns
PWMx Duty Cycle = 3/4 *100% = 75%
Shown in Figure 17-20 is the output waveform generated.
Figure 17-20. PWM Center Aligned Output Example Waveform
17.4.2.7 PWM 16-Bit Functions
The scalable PWM timer also has the option of generating up to 8-channels of 8-bits or 4-channels of
16-bits for greater PWM resolution. This 16-bit channel option is achieved through the concatenation of
two 8-bit channels.
The PWMCTL register contains four control bits, each of which is used to concatenate a pair of PWM
channels into one 16-bit channel. Channels 6 and 7 are concatenated with the CON67 bit, channels 4 and
5 are concatenated with the CON45 bit, channels 2 and 3 are concatenated with the CON23 bit, and
channels 0 and 1 are concatenated with the CON01 bit.
NOTE
Change these bits only when both corresponding channels are disabled.
When channels 6 and 7 are concatenated, channel 6 registers become the high order bytes of the double
byte channel, as shown in Figure 17-21. Similarly, when channels 4 and 5 are concatenated, channel 4
registers become the high order bytes of the double byte channel. When channels 2 and 3 are concatenated,
channel 2 registers become the high order bytes of the double byte channel. When channels 0 and 1 are
concatenated, channel 0 registers become the high order bytes of the double byte channel.
When using the 16-bit concatenated mode, the clock source is determined by the low order 8-bit channel
clock select control bits. That is channel 7 when channels 6 and 7 are concatenated, channel 5 when
channels 4 and 5 are concatenated, channel 3 when channels 2 and 3 are concatenated, and channel 1 when
channels 0 and 1 are concatenated. The resulting PWM is output to the pins of the corresponding low order
8-bit channel as also shown in Figure 17-21. The polarity of the resulting PWM output is controlled by the
PPOLx bit of the corresponding low order 8-bit channel as well.
E = 100 ns
DUTY CYCLE = 75%
E = 100 ns
PERIOD = 800 ns
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 561
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 17-21. PWM 16-Bit Mode
Once concatenated mode is enabled (CONxx bits set in PWMCTL register), enabling/disabling the
corresponding 16-bit PWM channel is controlled by the low order PWMEx bit. In this case, the high order
bytes PWMEx bits have no effect and their corresponding PWM output is disabled.
PWMCNT6 PWMCNT7
PWM7
Clock Source 7 High Low
Period/Duty Compare
PWMCNT4 PWMCNT5
PWM5
Clock Source 5
High Low
Period/Duty Compare
PWMCNT2 PWMCNT3
PWM3
Clock Source 3
High Low
Period/Duty Compare
PWMCNT0 PWMCNT1
PWM1
Clock Source 1
High Low
Period/Duty Compare
Maximum possible 16-bit channels
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
562 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
In concatenated mode, writes to the 16-bit counter by using a 16-bit access or writes to either the low or
high order byte of the counter will reset the 16-bit counter. Reads of the 16-bit counter must be made by
16-bit access to maintain data coherency.
Either left aligned or center aligned output mode can be used in concatenated mode and is controlled by
the low order CAEx bit. The high order CAEx bit has no effect.
Table 17-13 is used to summarize which channels are used to set the various control bits when in 16-bit
mode.
17.4.2.8 PWM Boundary Cases
Table 17-14 summarizes the boundary conditions for the PWM regardless of the output mode (left aligned
or center aligned) and 8-bit (normal) or 16-bit (concatenation).
17.5 Resets
The reset state of each individual bit is listed within the Section 17.3.2, “Register Descriptions” which
details the registers and their bit-fields. All special functions or modes which are initialized during or just
following reset are described within this section.
• The 8-bit up/down counter is configured as an up counter out of reset.
• All the channels are disabled and all the counters do not count.
Table 17-13. 16-bit Concatenation Mode Summary
Note: Bits related to available channels have functional significance.
CONxx PWMEx PPOLx PCLKx CAEx PWMx
Output
CON67 PWME7 PPOL7 PCLK7 CAE7 PWM7
CON45 PWME5 PPOL5 PCLK5 CAE5 PWM5
CON23 PWME3 PPOL3 PCLK3 CAE3 PWM3
CON01 PWME1 PPOL1 PCLK1 CAE1 PWM1
Table 17-14. PWM Boundary Cases
PWMDTYx PWMPERx PPOLx PWMx Output
$00
(indicates no duty)
>$00 1 Always low
$00
(indicates no duty)
>$00 0 Always high
XX $001
(indicates no period)
1Counter = $00 and does not count.
1 Always high
XX $001
(indicates no period)
0 Always low
>= PWMPERx XX 1 Always high
>= PWMPERx XX 0 Always low
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 563
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
• For channels 0, 1, 4, and 5 the clock choices are clock A.
• For channels 2, 3, 6, and 7 the clock choices are clock B.
17.6 Interrupts
The PWM module has no interrupt.
Pulse-Width Modulator (S12PWM8B8CV2)
MC9S12G Family Reference Manual, Rev.1.06
564 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 565
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 18
Serial Communication Interface (S12SCIV5)
18.1 Introduction
This block guide provides an overview of the serial communication interface (SCI) module.
The SCI allows asynchronous serial communications with peripheral devices and other CPUs.
18.1.1 Glossary
IR: InfraRed
IrDA: Infrared Design Associate
IRQ: Interrupt Request
LIN: Local Interconnect Network
LSB: Least Significant Bit
MSB: Most Significant Bit
NRZ: Non-Return-to-Zero
RZI: Return-to-Zero-Inverted
RXD: Receive Pin
SCI : Serial Communication Interface
TXD: Transmit Pin
Table 18-1. Revision History
Version
Number
Revision
Date
Effective
Date Author Description of Changes
05.03 12/25/2008 remove redundancy comments in Figure1-2
05.04 08/05/2009 fix typo, SCIBDL reset value be 0x04, not 0x00
05.05 06/03/2010 fix typo, Table 18-4,SCICR1 Even parity should be PT=0
fix typo, on page 18-586,should be BKDIF,not BLDIF
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
566 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
18.1.2 Features
The SCI includes these distinctive features:
• Full-duplex or single-wire operation
• Standard mark/space non-return-to-zero (NRZ) format
• Selectable IrDA 1.4 return-to-zero-inverted (RZI) format with programmable pulse widths
• 13-bit baud rate selection
• Programmable 8-bit or 9-bit data format
• Separately enabled transmitter and receiver
• Programmable polarity for transmitter and receiver
• Programmable transmitter output parity
• Two receiver wakeup methods:
— Idle line wakeup
— Address mark wakeup
• Interrupt-driven operation with eight flags:
— Transmitter empty
— Transmission complete
— Receiver full
— Idle receiver input
— Receiver overrun
— Noise error
— Framing error
— Parity error
— Receive wakeup on active edge
— Transmit collision detect supporting LIN
— Break Detect supporting LIN
• Receiver framing error detection
• Hardware parity checking
• 1/16 bit-time noise detection
18.1.3 Modes of Operation
The SCI functions the same in normal, special, and emulation modes. It has two low power modes, wait
and stop modes.
• Run mode
• Wait mode
• Stop mode
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 567
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
18.1.4 Block Diagram
Figure 18-1 is a high level block diagram of the SCI module, showing the interaction of various function
blocks.
Figure 18-1. SCI Block Diagram
18.2 External Signal Description
The SCI module has a total of two external pins.
18.2.1 TXD — Transmit Pin
The TXD pin transmits SCI (standard or infrared) data. It will idle high in either mode and is high
impedance anytime the transmitter is disabled.
18.2.2 RXD — Receive Pin
The RXD pin receives SCI (standard or infrared) data. An idle line is detected as a line high. This input is
ignored when the receiver is disabled and should be terminated to a known voltage.
18.3 Memory Map and Register Definition
This section provides a detailed description of all the SCI registers.
SCI Data Register
RXD Data In
Data Out TXD
Receive Shift Register
Infrared
Decoder
Receive & Wakeup
Control
Data Format Control
Transmit Control
Baud Rate
Generator
Bus Clock
1/16
Transmit Shift Register
SCI Data Register
Receive
Interrupt
Generation
Transmit
Interrupt
Generation
Infrared
Encoder
IDLE
RDRF/OR
TC
TDRE
BRKD
BERR
RXEDG
SCI
Interrupt
Request
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
568 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
18.3.1 Module Memory Map and Register Definition
The memory map for the SCI module is given below in Figure 18-2. The address listed for each register is
the address offset. The total address for each register is the sum of the base address for the SCI module and
the address offset for each register.
18.3.2 Register Descriptions
This section consists of register descriptions in address order. Each description includes a standard register
diagram with an associated figure number. Writes to a reserved register locations do not have any effect
and reads of these locations return a zero. Details of register bit and field function follow the register
diagrams, in bit order.
Register
Name Bit 7 6 5 4 3 2 1 Bit 0
0x0000
SCIBDH1RIREN TNP1 TNP0 SBR12 SBR11 SBR10 SBR9 SBR8
W
0x0001
SCIBDL1RSBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0
W
0x0002
SCICR11RLOOPS SCISWAI RSRC M WAKE ILT PE PT
W
0x0000
SCIASR12RRXEDGIF 0000
BERRV BERRIF BKDIF
W
0x0001
SCIACR12RRXEDGIE 00000
BERRIE BKDIE
W
0x0002
SCIACR22R00000
BERRM1 BERRM0 BKDFE
W
0x0003
SCICR2
RTIE TCIE RIE ILIE TE RE RWU SBK
W
0x0004
SCISR1
R TDRE TC RDRF IDLE OR NF FE PF
W
0x0005
SCISR2
RAMAP 00
TXPOL RXPOL BRK13 TXDIR RAF
W
= Unimplemented or Reserved
Figure 18-2. SCI Register Summary (Sheet 1 of 2)
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 569
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
18.3.2.1 SCI Baud Rate Registers (SCIBDH, SCIBDL)
Read: Anytime, if AMAP = 0. If only SCIBDH is written to, a read will not return the correct data until
SCIBDL is written to as well, following a write to SCIBDH.
Write: Anytime, if AMAP = 0.
NOTE
Those two registers are only visible in the memory map if AMAP = 0 (reset
condition).
The SCI baud rate register is used by to determine the baud rate of the SCI, and to control the infrared
modulation/demodulation submodule.
0x0006
SCIDRH
RR8 T8 000000
W
0x0007
SCIDRL
RR7R6R5R4R3R2R1R0
WT7T6T5T4T3T2T1T0
1.These registers are accessible if the AMAP bit in the SCISR2 register is set to zero.
2,These registers are accessible if the AMAP bit in the SCISR2 register is set to one.
Module Base + 0x0000
76543210
RIREN TNP1 TNP0 SBR12 SBR11 SBR10 SBR9 SBR8
W
Reset 0 0 0 00000
Figure 18-3. SCI Baud Rate Register (SCIBDH)
Module Base + 0x0001
76543210
RSBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0
W
Reset 0 0 0 00100
Figure 18-4. SCI Baud Rate Register (SCIBDL)
Register
Name Bit 7 6 5 4 3 2 1 Bit 0
= Unimplemented or Reserved
Figure 18-2. SCI Register Summary (Sheet 2 of 2)
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
570 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
18.3.2.2 SCI Control Register 1 (SCICR1)
Read: Anytime, if AMAP = 0.
Write: Anytime, if AMAP = 0.
NOTE
This register is only visible in the memory map if AMAP = 0 (reset
condition).
Table 18-2. SCIBDH and SCIBDL Field Descriptions
Field Description
7
IREN
Infrared Enable Bit — This bit enables/disables the infrared modulation/demodulation submodule.
0 IR disabled
1 IR enabled
6:5
TNP[1:0]
Transmitter Narrow Pulse Bits — These bits enable whether the SCI transmits a 1/16, 3/16, 1/32 or 1/4 narrow
pulse. See Table 18-3.
4:0
7:0
SBR[12:0]
SCI Baud Rate Bits — The baud rate for the SCI is determined by the bits in this register. The baud rate is
calculated two different ways depending on the state of the IREN bit.
The formulas for calculating the baud rate are:
When IREN = 0 then,
SCI baud rate = SCI bus clock / (16 x SBR[12:0])
When IREN = 1 then,
SCI baud rate = SCI bus clock / (32 x SBR[12:1])
Note: The baud rate generator is disabled after reset and not started until the TE bit or the RE bit is set for the
first time. The baud rate generator is disabled when (SBR[12:0] = 0 and IREN = 0) or (SBR[12:1] = 0 and
IREN = 1).
Note: Writing to SCIBDH has no effect without writing to SCIBDL, because writing to SCIBDH puts the data in
a temporary location until SCIBDL is written to.
Table 18-3. IRSCI Transmit Pulse Width
TNP[1:0] Narrow Pulse Width
11 1/4
10 1/32
01 1/16
00 3/16
Module Base + 0x0002
76543210
RLOOPS SCISWAI RSRC M WAKE ILT PE PT
W
Reset 0 0 0 00000
Figure 18-5. SCI Control Register 1 (SCICR1)
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 571
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 18-4. SCICR1 Field Descriptions
Field Description
7
LOOPS
Loop Select Bit — LOOPS enables loop operation. In loop operation, the RXD pin is disconnected from the SCI
and the transmitter output is internally connected to the receiver input. Both the transmitter and the receiver must
be enabled to use the loop function.
0 Normal operation enabled
1 Loop operation enabled
The receiver input is determined by the RSRC bit.
6
SCISWAI
SCI Stop in Wait Mode Bit — SCISWAI disables the SCI in wait mode.
0 SCI enabled in wait mode
1 SCI disabled in wait mode
5
RSRC
Receiver Source Bit — When LOOPS = 1, the RSRC bit determines the source for the receiver shift register
input. See Table 18-5.
0 Receiver input internally connected to transmitter output
1 Receiver input connected externally to transmitter
4
M
Data Format Mode Bit — MODE determines whether data characters are eight or nine bits long.
0 One start bit, eight data bits, one stop bit
1 One start bit, nine data bits, one stop bit
3
WAKE
Wakeup Condition Bit — WAKE determines which condition wakes up the SCI: a logic 1 (address mark) in the
most significant bit position of a received data character or an idle condition on the RXD pin.
0 Idle line wakeup
1 Address mark wakeup
2
ILT
Idle Line Type Bit — ILT determines when the receiver starts counting logic 1s as idle character bits. The
counting begins either after the start bit or after the stop bit. If the count begins after the start bit, then a string of
logic 1s preceding the stop bit may cause false recognition of an idle character. Beginning the count after the
stop bit avoids false idle character recognition, but requires properly synchronized transmissions.
0 Idle character bit count begins after start bit
1 Idle character bit count begins after stop bit
1
PE
Parity Enable Bit — PE enables the parity function. When enabled, the parity function inserts a parity bit in the
most significant bit position.
0 Parity function disabled
1 Parity function enabled
0
PT
Parity Type Bit — PT determines whether the SCI generates and checks for even parity or odd parity. With even
parity, an even number of 1s clears the parity bit and an odd number of 1s sets the parity bit. With odd parity, an
odd number of 1s clears the parity bit and an even number of 1s sets the parity bit.
0 Even parity
1 Odd parity
Table 18-5. Loop Functions
LOOPS RSRC Function
0 x Normal operation
1 0 Loop mode with transmitter output internally connected to receiver input
1 1 Single-wire mode with TXD pin connected to receiver input
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
572 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
18.3.2.3 SCI Alternative Status Register 1 (SCIASR1)
Read: Anytime, if AMAP = 1
Write: Anytime, if AMAP = 1
18.3.2.4 SCI Alternative Control Register 1 (SCIACR1)
Read: Anytime, if AMAP = 1
Write: Anytime, if AMAP = 1
Module Base + 0x0000
76543210
RRXEDGIF 0 0 0 0 BERRV BERRIF BKDIF
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 18-6. SCI Alternative Status Register 1 (SCIASR1)
Table 18-6. SCIASR1 Field Descriptions
Field Description
7
RXEDGIF
Receive Input Active Edge Interrupt Flag — RXEDGIF is asserted, if an active edge (falling if RXPOL = 0,
rising if RXPOL = 1) on the RXD input occurs. RXEDGIF bit is cleared by writing a “1” to it.
0 No active receive on the receive input has occurred
1 An active edge on the receive input has occurred
2
BERRV
Bit Error Value — BERRV reflects the state of the RXD input when the bit error detect circuitry is enabled and
a mismatch to the expected value happened. The value is only meaningful, if BERRIF = 1.
0 A low input was sampled, when a high was expected
1 A high input reassembled, when a low was expected
1
BERRIF
Bit Error Interrupt Flag — BERRIF is asserted, when the bit error detect circuitry is enabled and if the value
sampled at the RXD input does not match the transmitted value. If the BERRIE interrupt enable bit is set an
interrupt will be generated. The BERRIF bit is cleared by writing a “1” to it.
0 No mismatch detected
1 A mismatch has occurred
0
BKDIF
Break Detect Interrupt Flag — BKDIF is asserted, if the break detect circuitry is enabled and a break signal is
received. If the BKDIE interrupt enable bit is set an interrupt will be generated. The BKDIF bit is cleared by writing
a “1” to it.
0 No break signal was received
1 A break signal was received
Module Base + 0x0001
76543210
RRXEDGIE 00000
BERRIE BKDIE
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 18-7. SCI Alternative Control Register 1 (SCIACR1)
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 573
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
18.3.2.5 SCI Alternative Control Register 2 (SCIACR2)
Read: Anytime, if AMAP = 1
Write: Anytime, if AMAP = 1
Table 18-7. SCIACR1 Field Descriptions
Field Description
7
RSEDGIE
Receive Input Active Edge Interrupt Enable — RXEDGIE enables the receive input active edge interrupt flag,
RXEDGIF, to generate interrupt requests.
0 RXEDGIF interrupt requests disabled
1 RXEDGIF interrupt requests enabled
1
BERRIE
Bit Error Interrupt Enable — BERRIE enables the bit error interrupt flag, BERRIF, to generate interrupt
requests.
0 BERRIF interrupt requests disabled
1 BERRIF interrupt requests enabled
0
BKDIE
Break Detect Interrupt Enable — BKDIE enables the break detect interrupt flag, BKDIF, to generate interrupt
requests.
0 BKDIF interrupt requests disabled
1 BKDIF interrupt requests enabled
Module Base + 0x0002
76543210
R00000
BERRM1 BERRM0 BKDFE
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 18-8. SCI Alternative Control Register 2 (SCIACR2)
Table 18-8. SCIACR2 Field Descriptions
Field Description
2:1
BERRM[1:0]
Bit Error Mode — Those two bits determines the functionality of the bit error detect feature. See Table 18-9.
0
BKDFE
Break Detect Feature Enable — BKDFE enables the break detect circuitry.
0 Break detect circuit disabled
1 Break detect circuit enabled
Table 18-9. Bit Error Mode Coding
BERRM1 BERRM0 Function
0 0 Bit error detect circuit is disabled
0 1 Receive input sampling occurs during the 9th time tick of a transmitted bit
(refer to Figure 18-19)
1 0 Receive input sampling occurs during the 13th time tick of a transmitted bit
(refer to Figure 18-19)
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
574 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
18.3.2.6 SCI Control Register 2 (SCICR2)
Read: Anytime
Write: Anytime
1 1 Reserved
Module Base + 0x0003
76543210
RTIE TCIE RIE ILIE TE RE RWU SBK
W
Reset 0 0 0 00000
Figure 18-9. SCI Control Register 2 (SCICR2)
Table 18-10. SCICR2 Field Descriptions
Field Description
7
TIE
Transmitter Interrupt Enable Bit — TIE enables the transmit data register empty flag, TDRE, to generate
interrupt requests.
0 TDRE interrupt requests disabled
1 TDRE interrupt requests enabled
6
TCIE
Transmission Complete Interrupt Enable Bit — TCIE enables the transmission complete flag, TC, to generate
interrupt requests.
0 TC interrupt requests disabled
1 TC interrupt requests enabled
5
RIE
Receiver Full Interrupt Enable Bit — RIE enables the receive data register full flag, RDRF, or the overrun flag,
OR, to generate interrupt requests.
0 RDRF and OR interrupt requests disabled
1 RDRF and OR interrupt requests enabled
4
ILIE
Idle Line Interrupt Enable Bit — ILIE enables the idle line flag, IDLE, to generate interrupt requests.
0 IDLE interrupt requests disabled
1 IDLE interrupt requests enabled
3
TE
Transmitter Enable Bit — TE enables the SCI transmitter and configures the TXD pin as being controlled by
the SCI. The TE bit can be used to queue an idle preamble.
0 Transmitter disabled
1 Transmitter enabled
2
RE
Receiver Enable Bit — RE enables the SCI receiver.
0 Receiver disabled
1 Receiver enabled
Table 18-9. Bit Error Mode Coding
BERRM1 BERRM0 Function
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 575
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
18.3.2.7 SCI Status Register 1 (SCISR1)
The SCISR1 and SCISR2 registers provides inputs to the MCU for generation of SCI interrupts. Also,
these registers can be polled by the MCU to check the status of these bits. The flag-clearing procedures
require that the status register be read followed by a read or write to the SCI data register.It is permissible
to execute other instructions between the two steps as long as it does not compromise the handling of I/O,
but the order of operations is important for flag clearing.
Read: Anytime
Write: Has no meaning or effect
1
RWU
Receiver Wakeup Bit — Standby state
0 Normal operation.
1 RWU enables the wakeup function and inhibits further receiver interrupt requests. Normally, hardware wakes
the receiver by automatically clearing RWU.
0
SBK
Send Break Bit — Toggling SBK sends one break character (10 or 11 logic 0s, respectively 13 or 14 logics 0s
if BRK13 is set). Toggling implies clearing the SBK bit before the break character has finished transmitting. As
long as SBK is set, the transmitter continues to send complete break characters (10 or 11 bits, respectively 13
or 14 bits).
0 No break characters
1 Transmit break characters
Module Base + 0x0004
76543210
R TDRE TC RDRF IDLE OR NF FE PF
W
Reset 1 1 0 00000
= Unimplemented or Reserved
Figure 18-10. SCI Status Register 1 (SCISR1)
Table 18-10. SCICR2 Field Descriptions (continued)
Field Description
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
576 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 18-11. SCISR1 Field Descriptions
Field Description
7
TDRE
Transmit Data Register Empty Flag — TDRE is set when the transmit shift register receives a byte from the
SCI data register. When TDRE is 1, the transmit data register (SCIDRH/L) is empty and can receive a new value
to transmit.Clear TDRE by reading SCI status register 1 (SCISR1), with TDRE set and then writing to SCI data
register low (SCIDRL).
0 No byte transferred to transmit shift register
1 Byte transferred to transmit shift register; transmit data register empty
6
TC
Transmit Complete Flag — TC is set low when there is a transmission in progress or when a preamble or break
character is loaded. TC is set high when the TDRE flag is set and no data, preamble, or break character is being
transmitted.When TC is set, the TXD pin becomes idle (logic 1). Clear TC by reading SCI status register 1
(SCISR1) with TC set and then writing to SCI data register low (SCIDRL). TC is cleared automatically when data,
preamble, or break is queued and ready to be sent. TC is cleared in the event of a simultaneous set and clear of
the TC flag (transmission not complete).
0 Transmission in progress
1 No transmission in progress
5
RDRF
Receive Data Register Full Flag — RDRF is set when the data in the receive shift register transfers to the SCI
data register. Clear RDRF by reading SCI status register 1 (SCISR1) with RDRF set and then reading SCI data
register low (SCIDRL).
0 Data not available in SCI data register
1 Received data available in SCI data register
4
IDLE
Idle Line Flag — IDLE is set when 10 consecutive logic 1s (if M = 0) or 11 consecutive logic 1s (if M =1) appear
on the receiver input. Once the IDLE flag is cleared, a valid frame must again set the RDRF flag before an idle
condition can set the IDLE flag.Clear IDLE by reading SCI status register 1 (SCISR1) with IDLE set and then
reading SCI data register low (SCIDRL).
0 Receiver input is either active now or has never become active since the IDLE flag was last cleared
1 Receiver input has become idle
Note: When the receiver wakeup bit (RWU) is set, an idle line condition does not set the IDLE flag.
3
OR
Overrun Flag — OR is set when software fails to read the SCI data register before the receive shift register
receives the next frame. The OR bit is set immediately after the stop bit has been completely received for the
second frame. The data in the shift register is lost, but the data already in the SCI data registers is not affected.
Clear OR by reading SCI status register 1 (SCISR1) with OR set and then reading SCI data register low
(SCIDRL).
0 No overrun
1 Overrun
Note: OR flag may read back as set when RDRF flag is clear. This may happen if the following sequence of
events occurs:
1. After the first frame is received, read status register SCISR1 (returns RDRF set and OR flag clear);
2. Receive second frame without reading the first frame in the data register (the second frame is not
received and OR flag is set);
3. Read data register SCIDRL (returns first frame and clears RDRF flag in the status register);
4. Read status register SCISR1 (returns RDRF clear and OR set).
Event 3 may be at exactly the same time as event 2 or any time after. When this happens, a dummy
SCIDRL read following event 4 will be required to clear the OR flag if further frames are to be received.
2
NF
Noise Flag — NF is set when the SCI detects noise on the receiver input. NF bit is set during the same cycle as
the RDRF flag but does not get set in the case of an overrun. Clear NF by reading SCI status register 1(SCISR1),
and then reading SCI data register low (SCIDRL).
0 No noise
1 Noise
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 577
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
18.3.2.8 SCI Status Register 2 (SCISR2)
Read: Anytime
Write: Anytime
1
FE
Framing Error Flag — FE is set when a logic 0 is accepted as the stop bit. FE bit is set during the same cycle
as the RDRF flag but does not get set in the case of an overrun. FE inhibits further data reception until it is
cleared. Clear FE by reading SCI status register 1 (SCISR1) with FE set and then reading the SCI data register
low (SCIDRL).
0 No framing error
1 Framing error
0
PF
Parity Error Flag — PF is set when the parity enable bit (PE) is set and the parity of the received data does not
match the parity type bit (PT). PF bit is set during the same cycle as the RDRF flag but does not get set in the
case of an overrun. Clear PF by reading SCI status register 1 (SCISR1), and then reading SCI data register low
(SCIDRL).
0 No parity error
1 Parity error
Module Base + 0x0005
76543210
RAMAP 00
TXPOL RXPOL BRK13 TXDIR RAF
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 18-11. SCI Status Register 2 (SCISR2)
Table 18-12. SCISR2 Field Descriptions
Field Description
7
AMAP
Alternative Map — This bit controls which registers sharing the same address space are accessible. In the reset
condition the SCI behaves as previous versions. Setting AMAP=1 allows the access to another set of control and
status registers and hides the baud rate and SCI control Register 1.
0 The registers labelled SCIBDH (0x0000),SCIBDL (0x0001), SCICR1 (0x0002) are accessible
1 The registers labelled SCIASR1 (0x0000),SCIACR1 (0x0001), SCIACR2 (0x00002) are accessible
4
TXPOL
Transmit Polarity — This bit control the polarity of the transmitted data. In NRZ format, a one is represented by
a mark and a zero is represented by a space for normal polarity, and the opposite for inverted polarity. In IrDA
format, a zero is represented by short high pulse in the middle of a bit time remaining idle low for a one for normal
polarity, and a zero is represented by short low pulse in the middle of a bit time remaining idle high for a one for
inverted polarity.
0 Normal polarity
1 Inverted polarity
Table 18-11. SCISR1 Field Descriptions (continued)
Field Description
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
578 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
18.3.2.9 SCI Data Registers (SCIDRH, SCIDRL)
Read: Anytime; reading accesses SCI receive data register
Write: Anytime; writing accesses SCI transmit data register; writing to R8 has no effect
3
RXPOL
Receive Polarity — This bit control the polarity of the received data. In NRZ format, a one is represented by a
mark and a zero is represented by a space for normal polarity, and the opposite for inverted polarity. In IrDA
format, a zero is represented by short high pulse in the middle of a bit time remaining idle low for a one for normal
polarity, and a zero is represented by short low pulse in the middle of a bit time remaining idle high for a one for
inverted polarity.
0 Normal polarity
1 Inverted polarity
2
BRK13
Break Transmit Character Length — This bit determines whether the transmit break character is 10 or 11 bit
respectively 13 or 14 bits long. The detection of a framing error is not affected by this bit.
0 Break character is 10 or 11 bit long
1 Break character is 13 or 14 bit long
1
TXDIR
Transmitter Pin Data Direction in Single-Wire Mode — This bit determines whether the TXD pin is going to
be used as an input or output, in the single-wire mode of operation. This bit is only relevant in the single-wire
mode of operation.
0 TXD pin to be used as an input in single-wire mode
1 TXD pin to be used as an output in single-wire mode
0
RAF
Receiver Active Flag — RAF is set when the receiver detects a logic 0 during the RT1 time period of the start
bit search. RAF is cleared when the receiver detects an idle character.
0 No reception in progress
1 Reception in progress
Module Base + 0x0006
76543210
RR8 T8 000000
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 18-12. SCI Data Registers (SCIDRH)
Module Base + 0x0007
76543210
RR7R6R5R4R3R2R1R0
WT7 T6 T5 T4 T3 T2 T1 T0
Reset 0 0 0 00000
Figure 18-13. SCI Data Registers (SCIDRL)
Table 18-12. SCISR2 Field Descriptions (continued)
Field Description
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 579
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
If the value of T8 is the same as in the previous transmission, T8 does not
have to be rewritten.The same value is transmitted until T8 is rewritten
In 8-bit data format, only SCI data register low (SCIDRL) needs to be
accessed.
When transmitting in 9-bit data format and using 8-bit write instructions,
write first to SCI data register high (SCIDRH), then SCIDRL.
18.4 Functional Description
This section provides a complete functional description of the SCI block, detailing the operation of the
design from the end user perspective in a number of subsections.
Figure 18-14 shows the structure of the SCI module. The SCI allows full duplex, asynchronous, serial
communication between the CPU and remote devices, including other CPUs. The SCI transmitter and
receiver operate independently, although they use the same baud rate generator. The CPU monitors the
status of the SCI, writes the data to be transmitted, and processes received data.
Table 18-13. SCIDRH and SCIDRL Field Descriptions
Field Description
SCIDRH
7
R8
Received Bit 8 — R8 is the ninth data bit received when the SCI is configured for 9-bit data format (M = 1).
SCIDRH
6
T8
Transmit Bit 8 — T8 is the ninth data bit transmitted when the SCI is configured for 9-bit data format (M = 1).
SCIDRL
7:0
R[7:0]
T[7:0]
R7:R0 — Received bits seven through zero for 9-bit or 8-bit data formats
T7:T0 — Transmit bits seven through zero for 9-bit or 8-bit formats
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
580 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 18-14. Detailed SCI Block Diagram
18.4.1 Infrared Interface Submodule
This module provides the capability of transmitting narrow pulses to an IR LED and receiving narrow
pulses and transforming them to serial bits, which are sent to the SCI. The IrDA physical layer
specification defines a half-duplex infrared communication link for exchange data. The full standard
includes data rates up to 16 Mbits/s. This design covers only data rates between 2.4 Kbits/s and 115.2
Kbits/s.
The infrared submodule consists of two major blocks: the transmit encoder and the receive decoder. The
SCI transmits serial bits of data which are encoded by the infrared submodule to transmit a narrow pulse
SCI Data
Receive
Shift Register
SCI Data
Register
Transmit
Shift Register
Register
Baud Rate
Generator
SBR12:SBR0
Bus
Transmit
Control
÷16
Receive
and Wakeup
Data Format
Control
Control
T8
PF
FE
NF
RDRF
IDLE
TIE
OR
TCIE
TDRE
TC
R8
RAF
LOOPS
RWU
RE
PE
ILT
PT
WAKE
M
Clock
ILIE
RIE
RXD
RSRC
SBK
LOOPS
TE
RSRC
IREN
R16XCLK
Ir_RXD
TXD
Ir_TXD
R16XCLK
R32XCLK
TNP[1:0] IREN
Transmit
Encoder
Receive
Decoder
SCRXD
SCTXD
Infrared
Infrared
TC
TDRE
RDRF/OR
IDLE
Active Edge
Detect
Break Detect
RXD
BKDFE
BERRM[1:0]
BKDIE
BKDIF
RXEDGIE
RXEDGIF
BERRIE
BERRIF
SCI
Interrupt
Request
LIN Transmit
Collision
Detect
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 581
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
for every zero bit. No pulse is transmitted for every one bit. When receiving data, the IR pulses should be
detected using an IR photo diode and transformed to CMOS levels by the IR receive decoder (external
from the MCU). The narrow pulses are then stretched by the infrared submodule to get back to a serial bit
stream to be received by the SCI.The polarity of transmitted pulses and expected receive pulses can be
inverted so that a direct connection can be made to external IrDA transceiver modules that uses active low
pulses.
The infrared submodule receives its clock sources from the SCI. One of these two clocks are selected in
the infrared submodule in order to generate either 3/16, 1/16, 1/32 or 1/4 narrow pulses during
transmission. The infrared block receives two clock sources from the SCI, R16XCLK and R32XCLK,
which are configured to generate the narrow pulse width during transmission. The R16XCLK and
R32XCLK are internal clocks with frequencies 16 and 32 times the baud rate respectively. Both
R16XCLK and R32XCLK clocks are used for transmitting data. The receive decoder uses only the
R16XCLK clock.
18.4.1.1 Infrared Transmit Encoder
The infrared transmit encoder converts serial bits of data from transmit shift register to the TXD pin. A
narrow pulse is transmitted for a zero bit and no pulse for a one bit. The narrow pulse is sent in the middle
of the bit with a duration of 1/32, 1/16, 3/16 or 1/4 of a bit time. A narrow high pulse is transmitted for a
zero bit when TXPOL is cleared, while a narrow low pulse is transmitted for a zero bit when TXPOL is set.
18.4.1.2 Infrared Receive Decoder
The infrared receive block converts data from the RXD pin to the receive shift register. A narrow pulse is
expected for each zero received and no pulse is expected for each one received. A narrow high pulse is
expected for a zero bit when RXPOL is cleared, while a narrow low pulse is expected for a zero bit when
RXPOL is set. This receive decoder meets the edge jitter requirement as defined by the IrDA serial infrared
physical layer specification.
18.4.2 LIN Support
This module provides some basic support for the LIN protocol. At first this is a break detect circuitry
making it easier for the LIN software to distinguish a break character from an incoming data stream. As a
further addition is supports a collision detection at the bit level as well as cancelling pending transmissions.
18.4.3 Data Format
The SCI uses the standard NRZ mark/space data format. When Infrared is enabled, the SCI uses RZI data
format where zeroes are represented by light pulses and ones remain low. See Figure 18-15 below.
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
582 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 18-15. SCI Data Formats
Each data character is contained in a frame that includes a start bit, eight or nine data bits, and a stop bit.
Clearing the M bit in SCI control register 1 configures the SCI for 8-bit data characters. A frame with eight
data bits has a total of 10 bits. Setting the M bit configures the SCI for nine-bit data characters. A frame
with nine data bits has a total of 11 bits.
When the SCI is configured for 9-bit data characters, the ninth data bit is the T8 bit in SCI data register
high (SCIDRH). It remains unchanged after transmission and can be used repeatedly without rewriting it.
A frame with nine data bits has a total of 11 bits.
Table 18-14. Example of 8-Bit Data Formats
Start
Bit
Data
Bits
Address
Bits
Parity
Bits
Stop
Bit
18001
17011
17 1
1
1The address bit identifies the frame as an address
character. See Section 18.4.6.6, “Receiver Wakeup”.
01
Table 18-15. Example of 9-Bit Data Formats
Start
Bit
Data
Bits
Address
Bits
Parity
Bits
Stop
Bit
19001
18011
18 1
1
1The address bit identifies the frame as an address
character. See Section 18.4.6.6, “Receiver Wakeup”.
01
Bit 5
Start
Bit Bit 0 Bit 1
Next
STOP
Bit
Start
Bit
8-Bit Data Format
(Bit M in SCICR1 Clear)
Start
Bit Bit 0
NEXT
STOP
Bit
START
Bit
9-Bit Data Format
(Bit M in SCICR1 Set)
Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Bit 8
Bit 2 Bit 3 Bit 4 Bit 6 Bit 7
POSSIBLE
PARITY
Bit
Possible
Parity
Bit Standard
SCI Data
Infrared
SCI Data
Standard
SCI Data
Infrared
SCI Data
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 583
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
18.4.4 Baud Rate Generation
A 13-bit modulus counter in the baud rate generator derives the baud rate for both the receiver and the
transmitter. The value from 0 to 8191 written to the SBR12:SBR0 bits determines the bus clock divisor.
The SBR bits are in the SCI baud rate registers (SCIBDH and SCIBDL). The baud rate clock is
synchronized with the bus clock and drives the receiver. The baud rate clock divided by 16 drives the
transmitter. The receiver has an acquisition rate of 16 samples per bit time.
Baud rate generation is subject to one source of error:
• Integer division of the bus clock may not give the exact target frequency.
Table 18-16 lists some examples of achieving target baud rates with a bus clock frequency of 25 MHz.
When IREN = 0 then,
SCI baud rate = SCI bus clock / (16 * SCIBR[12:0])
Table 18-16. Baud Rates (Example: Bus Clock = 25 MHz)
Bits
SBR[12:0]
Receiver
Clock (Hz)
Transmitter
Clock (Hz)
Target
Baud Rate
Error
(%)
41 609,756.1 38,109.8 38,400 .76
81 308,642.0 19,290.1 19,200 .47
163 153,374.2 9585.9 9,600 .16
326 76,687.1 4792.9 4,800 .15
651 38,402.5 2400.2 2,400 .01
1302 19,201.2 1200.1 1,200 .01
2604 9600.6 600.0 600 .00
5208 4800.0 300.0 300 .00
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
584 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
18.4.5 Transmitter
Figure 18-16. Transmitter Block Diagram
18.4.5.1 Transmitter Character Length
The SCI transmitter can accommodate either 8-bit or 9-bit data characters. The state of the M bit in SCI
control register 1 (SCICR1) determines the length of data characters. When transmitting 9-bit data, bit T8
in SCI data register high (SCIDRH) is the ninth bit (bit 8).
18.4.5.2 Character Transmission
To transmit data, the MCU writes the data bits to the SCI data registers (SCIDRH/SCIDRL), which in turn
are transferred to the transmitter shift register. The transmit shift register then shifts a frame out through
the TXD pin, after it has prefaced them with a start bit and appended them with a stop bit. The SCI data
registers (SCIDRH and SCIDRL) are the write-only buffers between the internal data bus and the transmit
shift register.
PE
PT
H876543210L
11-Bit Transmit Register
Stop
Start
T8
TIE
TDRE
TCIE
SBK
TC
Parity
Generation
MSB
SCI Data Registers
Load from SCIDR
Shift Enable
Preamble (All 1s)
Break (All 0s)
Transmitter Control
M
Internal Bus
SBR12:SBR0
Baud Divider ÷16
Bus
Clock
TE
SCTXD
TXPOL
LOOPS
LOOP
RSRC
CONTROL To Receiver
Transmit
Collision Detect
TDRE IRQ
TC IRQ
SCTXD
SCRXD
(From Receiver)
TCIE
BERRIF
BER IRQ
BERRM[1:0]
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 585
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The SCI also sets a flag, the transmit data register empty flag (TDRE), every time it transfers data from the
buffer (SCIDRH/L) to the transmitter shift register.The transmit driver routine may respond to this flag by
writing another byte to the Transmitter buffer (SCIDRH/SCIDRL), while the shift register is still shifting
out the first byte.
To initiate an SCI transmission:
1. Configure the SCI:
a) Select a baud rate. Write this value to the SCI baud registers (SCIBDH/L) to begin the baud
rate generator. Remember that the baud rate generator is disabled when the baud rate is zero.
Writing to the SCIBDH has no effect without also writing to SCIBDL.
b) Write to SCICR1 to configure word length, parity, and other configuration bits
(LOOPS,RSRC,M,WAKE,ILT,PE,PT).
c) Enable the transmitter, interrupts, receive, and wake up as required, by writing to the SCICR2
register bits (TIE,TCIE,RIE,ILIE,TE,RE,RWU,SBK). A preamble or idle character will now
be shifted out of the transmitter shift register.
2. Transmit Procedure for each byte:
a) Poll the TDRE flag by reading the SCISR1 or responding to the TDRE interrupt. Keep in mind
that the TDRE bit resets to one.
b) If the TDRE flag is set, write the data to be transmitted to SCIDRH/L, where the ninth bit is
written to the T8 bit in SCIDRH if the SCI is in 9-bit data format. A new transmission will not
result until the TDRE flag has been cleared.
3. Repeat step 2 for each subsequent transmission.
NOTE
The TDRE flag is set when the shift register is loaded with the next data to
be transmitted from SCIDRH/L, which happens, generally speaking, a little
over half-way through the stop bit of the previous frame. Specifically, this
transfer occurs 9/16ths of a bit time AFTER the start of the stop bit of the
previous frame.
Writing the TE bit from 0 to a 1 automatically loads the transmit shift register with a preamble of 10 logic
1s (if M = 0) or 11 logic 1s (if M = 1). After the preamble shifts out, control logic transfers the data from
the SCI data register into the transmit shift register. A logic 0 start bit automatically goes into the least
significant bit position of the transmit shift register. A logic 1 stop bit goes into the most significant bit
position.
Hardware supports odd or even parity. When parity is enabled, the most significant bit (MSB) of the data
character is the parity bit.
The transmit data register empty flag, TDRE, in SCI status register 1 (SCISR1) becomes set when the SCI
data register transfers a byte to the transmit shift register. The TDRE flag indicates that the SCI data
register can accept new data from the internal data bus. If the transmit interrupt enable bit, TIE, in SCI
control register 2 (SCICR2) is also set, the TDRE flag generates a transmitter interrupt request.
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
586 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
When the transmit shift register is not transmitting a frame, the TXD pin goes to the idle condition, logic
1. If at any time software clears the TE bit in SCI control register 2 (SCICR2), the transmitter enable signal
goes low and the transmit signal goes idle.
If software clears TE while a transmission is in progress (TC = 0), the frame in the transmit shift register
continues to shift out. To avoid accidentally cutting off the last frame in a message, always wait for TDRE
to go high after the last frame before clearing TE.
To separate messages with preambles with minimum idle line time, use this sequence between messages:
1. Write the last byte of the first message to SCIDRH/L.
2. Wait for the TDRE flag to go high, indicating the transfer of the last frame to the transmit shift
register.
3. Queue a preamble by clearing and then setting the TE bit.
4. Write the first byte of the second message to SCIDRH/L.
18.4.5.3 Break Characters
Writing a logic 1 to the send break bit, SBK, in SCI control register 2 (SCICR2) loads the transmit shift
register with a break character. A break character contains all logic 0s and has no start, stop, or parity bit.
Break character length depends on the M bit in SCI control register 1 (SCICR1). As long as SBK is at logic
1, transmitter logic continuously loads break characters into the transmit shift register. After software
clears the SBK bit, the shift register finishes transmitting the last break character and then transmits at least
one logic 1. The automatic logic 1 at the end of a break character guarantees the recognition of the start bit
of the next frame.
The SCI recognizes a break character when there are 10 or 11(M = 0 or M = 1) consecutive zero received.
Depending if the break detect feature is enabled or not receiving a break character has these effects on SCI
registers.
If the break detect feature is disabled (BKDFE = 0):
• Sets the framing error flag, FE
• Sets the receive data register full flag, RDRF
• Clears the SCI data registers (SCIDRH/L)
• May set the overrun flag, OR, noise flag, NF, parity error flag, PE, or the receiver active flag, RAF
(see 3.4.4 and 3.4.5 SCI Status Register 1 and 2)
If the break detect feature is enabled (BKDFE = 1) there are two scenarios1
The break is detected right from a start bit or is detected during a byte reception.
• Sets the break detect interrupt flag, BKDIF
• Does not change the data register full flag, RDRF or overrun flag OR
• Does not change the framing error flag FE, parity error flag PE.
• Does not clear the SCI data registers (SCIDRH/L)
• May set noise flag NF, or receiver active flag RAF.
1. A Break character in this context are either 10 or 11 consecutive zero received bits
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 587
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 18-17 shows two cases of break detect. In trace RXD_1 the break symbol starts with the start bit,
while in RXD_2 the break starts in the middle of a transmission. If BRKDFE = 1, in RXD_1 case there
will be no byte transferred to the receive buffer and the RDRF flag will not be modified. Also no framing
error or parity error will be flagged from this transfer. In RXD_2 case, however the break signal starts later
during the transmission. At the expected stop bit position the byte received so far will be transferred to the
receive buffer, the receive data register full flag will be set, a framing error and if enabled and appropriate
a parity error will be set. Once the break is detected the BRKDIF flag will be set.
Figure 18-17. Break Detection if BRKDFE = 1 (M = 0)
18.4.5.4 Idle Characters
An idle character (or preamble) contains all logic 1s and has no start, stop, or parity bit. Idle character
length depends on the M bit in SCI control register 1 (SCICR1). The preamble is a synchronizing idle
character that begins the first transmission initiated after writing the TE bit from 0 to 1.
If the TE bit is cleared during a transmission, the TXD pin becomes idle after completion of the
transmission in progress. Clearing and then setting the TE bit during a transmission queues an idle
character to be sent after the frame currently being transmitted.
NOTE
When queueing an idle character, return the TE bit to logic 1 before the stop
bit of the current frame shifts out through the TXD pin. Setting TE after the
stop bit appears on TXD causes data previously written to the SCI data
register to be lost. Toggle the TE bit for a queued idle character while the
TDRE flag is set and immediately before writing the next byte to the SCI
data register.
If the TE bit is clear and the transmission is complete, the SCI is not the
master of the TXD pin
Start Bit Position Stop Bit Position
BRKDIF = 1
FE = 1 BRKDIF = 1
RXD_1
RXD_2
123 4567 8 910
123 4567 8 910
Zero Bit Counter
Zero Bit Counter . . .
. . .
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
588 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
18.4.5.5 LIN Transmit Collision Detection
This module allows to check for collisions on the LIN bus.
Figure 18-18. Collision Detect Principle
If the bit error circuit is enabled (BERRM[1:0] = 0:1 or = 1:0]), the error detect circuit will compare the
transmitted and the received data stream at a point in time and flag any mismatch. The timing checks run
when transmitter is active (not idle). As soon as a mismatch between the transmitted data and the received
data is detected the following happens:
• The next bit transmitted will have a high level (TXPOL = 0) or low level (TXPOL = 1)
• The transmission is aborted and the byte in transmit buffer is discarded.
• the transmit data register empty and the transmission complete flag will be set
• The bit error interrupt flag, BERRIF, will be set.
• No further transmissions will take place until the BERRIF is cleared.
Figure 18-19. Timing Diagram Bit Error Detection
If the bit error detect feature is disabled, the bit error interrupt flag is cleared.
NOTE
The RXPOL and TXPOL bit should be set the same when transmission
collision detect feature is enabled, otherwise the bit error interrupt flag may
be set incorrectly.
TXD Pin
RXD Pin
LIN Physical Interface
Synchronizer Stage
Bus Clock
Receive Shift
Register
Transmit Shift
Register
LIN Bus
Compare
Sample
Bit Error
Point
Output Transmit
Shift Register
01234567891011121314150
Input Receive
Shift Register
BERRM[1:0] = 0:1 BERRM[1:0] = 1:1
Compare Sample Points
Sampling Begin
Sampling Begin
Sampling End
Sampling End
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 589
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
18.4.6 Receiver
Figure 18-20. SCI Receiver Block Diagram
18.4.6.1 Receiver Character Length
The SCI receiver can accommodate either 8-bit or 9-bit data characters. The state of the M bit in SCI
control register 1 (SCICR1) determines the length of data characters. When receiving 9-bit data, bit R8 in
SCI data register high (SCIDRH) is the ninth bit (bit 8).
18.4.6.2 Character Reception
During an SCI reception, the receive shift register shifts a frame in from the RXD pin. The SCI data register
is the read-only buffer between the internal data bus and the receive shift register.
After a complete frame shifts into the receive shift register, the data portion of the frame transfers to the
SCI data register. The receive data register full flag, RDRF, in SCI status register 1 (SCISR1) becomes set,
All 1s
M
WAKE
ILT
PE
PT
RE
H876543210L
11-Bit Receive Shift Register
Stop
Start
Data
Wakeup
Parity
Checking
MSB
SCI Data Register
R8
ILIE
RWU
RDRF
OR
NF
FE
PE
Internal Bus
Bus
SBR12:SBR0
Baud Divider
Clock
IDLE
RAF
Recovery
Logic
RXPOL
LOOPS
Loop
RSRC
Control
SCRXD
From TXD Pin
or Transmitter
Idle IRQ
RDRF/OR
IRQ
Break
Detect Logic
Active Edge
Detect Logic
BRKDFE
BRKDIE
BRKDIF
RXEDGIE
RXEDGIF
Break IRQ
RX Active Edge IRQ
RIE
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
590 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
indicating that the received byte can be read. If the receive interrupt enable bit, RIE, in SCI control
register 2 (SCICR2) is also set, the RDRF flag generates an RDRF interrupt request.
18.4.6.3 Data Sampling
The RT clock rate. The RT clock is an internal signal with a frequency 16 times the baud rate. To adjust
for baud rate mismatch, the RT clock (see Figure 18-21) is re-synchronized:
• After every start bit
• After the receiver detects a data bit change from logic 1 to logic 0 (after the majority of data bit
samples at RT8, RT9, and RT10 returns a valid logic 1 and the majority of the next RT8, RT9, and
RT10 samples returns a valid logic 0)
To locate the start bit, data recovery logic does an asynchronous search for a logic 0 preceded by three logic
1s.When the falling edge of a possible start bit occurs, the RT clock begins to count to 16.
Figure 18-21. Receiver Data Sampling
To verify the start bit and to detect noise, data recovery logic takes samples at RT3, RT5, and RT7.
Figure 18-17 summarizes the results of the start bit verification samples.
If start bit verification is not successful, the RT clock is reset and a new search for a start bit begins.
Table 18-17. Start Bit Verification
RT3, RT5, and RT7 Samples Start Bit Verification Noise Flag
000 Yes 0
001 Yes 1
010 Yes 1
011 No 0
100 Yes 1
101 No 0
110 No 0
111 No 0
Reset RT Clock
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT2
RT3
RT4
RT5
RT8
RT7
RT6
RT11
RT10
RT9
RT15
RT14
RT13
RT12
RT16
RT1
RT2
RT3
RT4
Samples
RT Clock
RT CLock Count
Start Bit
RXD
Start Bit
Qualification
Start Bit Data
Sampling
111111110000000
LSB
Verification
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 591
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
To determine the value of a data bit and to detect noise, recovery logic takes samples at RT8, RT9, and
RT10. Table 18-18 summarizes the results of the data bit samples.
NOTE
The RT8, RT9, and RT10 samples do not affect start bit verification. If any
or all of the RT8, RT9, and RT10 start bit samples are logic 1s following a
successful start bit verification, the noise flag (NF) is set and the receiver
assumes that the bit is a start bit (logic 0).
To verify a stop bit and to detect noise, recovery logic takes samples at RT8, RT9, and RT10. Table 18-19
summarizes the results of the stop bit samples.
In Figure 18-22 the verification samples RT3 and RT5 determine that the first low detected was noise and
not the beginning of a start bit. The RT clock is reset and the start bit search begins again. The noise flag
is not set because the noise occurred before the start bit was found.
Table 18-18. Data Bit Recovery
RT8, RT9, and RT10 Samples Data Bit Determination Noise Flag
000 0 0
001 0 1
010 0 1
011 1 1
100 0 1
101 1 1
110 1 1
111 1 0
Table 18-19. Stop Bit Recovery
RT8, RT9, and RT10 Samples Framing Error Flag Noise Flag
000 1 0
001 1 1
010 1 1
011 0 1
100 1 1
101 0 1
110 0 1
111 0 0
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
592 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 18-22. Start Bit Search Example 1
In Figure 18-23, verification sample at RT3 is high. The RT3 sample sets the noise flag. Although the
perceived bit time is misaligned, the data samples RT8, RT9, and RT10 are within the bit time and data
recovery is successful.
Figure 18-23. Start Bit Search Example 2
In Figure 18-24, a large burst of noise is perceived as the beginning of a start bit, although the test sample
at RT5 is high. The RT5 sample sets the noise flag. Although this is a worst-case misalignment of perceived
bit time, the data samples RT8, RT9, and RT10 are within the bit time and data recovery is successful.
Reset RT Clock
RT1
RT1
RT1
RT1
RT2
RT3
RT4
RT5
RT1
RT1
RT2
RT3
RT4
RT7
RT6
RT5
RT10
RT9
RT8
RT14
RT13
RT12
RT11
RT15
RT16
RT1
RT2
RT3
Samples
RT Clock
RT Clock Count
Start Bit
RXD
110111100000
LSB
0 0
Reset RT Clock
RT1
RT1
RT1
RT1
RT1
RT1
RT2
RT3
RT4
RT5
RT6
RT7
RT8
RT11
RT10
RT9
RT14
RT13
RT12
RT2
RT1
RT16
RT15
RT3
RT4
RT5
RT6
RT7
Samples
RT Clock
RT Clock Count
Actual Start Bit
RXD
1111110000
LSB
00
Perceived Start Bit
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 593
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 18-24. Start Bit Search Example 3
Figure 18-25 shows the effect of noise early in the start bit time. Although this noise does not affect proper
synchronization with the start bit time, it does set the noise flag.
Figure 18-25. Start Bit Search Example 4
Figure 18-26 shows a burst of noise near the beginning of the start bit that resets the RT clock. The sample
after the reset is low but is not preceded by three high samples that would qualify as a falling edge.
Depending on the timing of the start bit search and on the data, the frame may be missed entirely or it may
set the framing error flag.
Reset RT Clock
RT1
RT1
RT1
RT1
RT2
RT3
RT4
RT5
RT6
RT7
RT8
RT9
RT10
RT13
RT12
RT11
RT16
RT15
RT14
RT4
RT3
RT2
RT1
RT5
RT6
RT7
RT8
RT9
Samples
RT Clock
RT Clock Count
Actual Start Bit
RXD
101110000
LSB
0
Perceived Start Bit
Reset RT Clock
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT2
RT3
RT4
RT7
RT6
RT5
RT10
RT9
RT8
RT14
RT13
RT12
RT11
RT15
RT16
RT1
RT2
RT3
Samples
RT Clock
RT Clock Count
Perceived and Actual Start Bit
RXD
11111001
LSB
11 1 1
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
594 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 18-26. Start Bit Search Example 5
In Figure 18-27, a noise burst makes the majority of data samples RT8, RT9, and RT10 high. This sets the
noise flag but does not reset the RT clock. In start bits only, the RT8, RT9, and RT10 data samples are
ignored.
Figure 18-27. Start Bit Search Example 6
18.4.6.4 Framing Errors
If the data recovery logic does not detect a logic 1 where the stop bit should be in an incoming frame, it
sets the framing error flag, FE, in SCI status register 1 (SCISR1). A break character also sets the FE flag
because a break character has no stop bit. The FE flag is set at the same time that the RDRF flag is set.
18.4.6.5 Baud Rate Tolerance
A transmitting device may be operating at a baud rate below or above the receiver baud rate. Accumulated
bit time misalignment can cause one of the three stop bit data samples (RT8, RT9, and RT10) to fall outside
the actual stop bit. A noise error will occur if the RT8, RT9, and RT10 samples are not all the same logical
values. A framing error will occur if the receiver clock is misaligned in such a way that the majority of the
RT8, RT9, and RT10 stop bit samples are a logic zero.
Reset RT Clock
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT2
RT3
RT4
RT7
RT6
RT5
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
Samples
RT Clock
RT Clock Count
Start Bit
RXD
11111010
LSB
11 1 1 1 0000000 0
No Start Bit Found
Reset RT Clock
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT1
RT2
RT3
RT4
RT7
RT6
RT5
RT10
RT9
RT8
RT14
RT13
RT12
RT11
RT15
RT16
RT1
RT2
RT3
Samples
RT Clock
RT Clock Count
Start Bit
RXD
11111000
LSB
11 1 1 0 110
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 595
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
As the receiver samples an incoming frame, it re-synchronizes the RT clock on any valid falling edge
within the frame. Re synchronization within frames will correct a misalignment between transmitter bit
times and receiver bit times.
18.4.6.5.1 Slow Data Tolerance
Figure 18-28 shows how much a slow received frame can be misaligned without causing a noise error or
a framing error. The slow stop bit begins at RT8 instead of RT1 but arrives in time for the stop bit data
samples at RT8, RT9, and RT10.
Figure 18-28. Slow Data
Let’s take RTr as receiver RT clock and RTt as transmitter RT clock.
For an 8-bit data character, it takes the receiver 9 bit times x 16 RTr cycles +7 RTr cycles = 151 RTr cycles
to start data sampling of the stop bit.
With the misaligned character shown in Figure 18-28, the receiver counts 151 RTr cycles at the point when
the count of the transmitting device is 9 bit times x 16 RTt cycles = 144 RTt cycles.
The maximum percent difference between the receiver count and the transmitter count of a slow 8-bit data
character with no errors is:
((151 – 144) / 151) x 100 = 4.63%
For a 9-bit data character, it takes the receiver 10 bit times x 16 RTr cycles + 7 RTr cycles = 167 RTr cycles
to start data sampling of the stop bit.
With the misaligned character shown in Figure 18-28, the receiver counts 167 RTr cycles at the point when
the count of the transmitting device is 10 bit times x 16 RTt cycles = 160 RTt cycles.
The maximum percent difference between the receiver count and the transmitter count of a slow 9-bit
character with no errors is:
((167 – 160) / 167) X 100 = 4.19%
18.4.6.5.2 Fast Data Tolerance
Figure 18-29 shows how much a fast received frame can be misaligned. The fast stop bit ends at RT10
instead of RT16 but is still sampled at RT8, RT9, and RT10.
MSB Stop
RT1
RT2
RT3
RT4
RT5
RT6
RT7
RT8
RT9
RT10
RT11
RT12
RT13
RT14
RT15
RT16
Data
Samples
Receiver
RT Clock
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
596 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 18-29. Fast Data
For an 8-bit data character, it takes the receiver 9 bit times x 16 RTr cycles + 10 RTr cycles = 154 RTr cycles
to finish data sampling of the stop bit.
With the misaligned character shown in Figure 18-29, the receiver counts 154 RTr cycles at the point when
the count of the transmitting device is 10 bit times x 16 RTt cycles = 160 RTt cycles.
The maximum percent difference between the receiver count and the transmitter count of a fast 8-bit
character with no errors is:
((160 – 154) / 160) x 100 = 3.75%
For a 9-bit data character, it takes the receiver 10 bit times x 16 RTr cycles + 10 RTr cycles = 170 RTr cycles
to finish data sampling of the stop bit.
With the misaligned character shown in Figure 18-29, the receiver counts 170 RTr cycles at the point when
the count of the transmitting device is 11 bit times x 16 RTt cycles = 176 RTt cycles.
The maximum percent difference between the receiver count and the transmitter count of a fast 9-bit
character with no errors is:
((176 – 170) /176) x 100 = 3.40%
18.4.6.6 Receiver Wakeup
To enable the SCI to ignore transmissions intended only for other receivers in multiple-receiver systems,
the receiver can be put into a standby state. Setting the receiver wakeup bit, RWU, in SCI control register 2
(SCICR2) puts the receiver into standby state during which receiver interrupts are disabled.The SCI will
still load the receive data into the SCIDRH/L registers, but it will not set the RDRF flag.
The transmitting device can address messages to selected receivers by including addressing information in
the initial frame or frames of each message.
The WAKE bit in SCI control register 1 (SCICR1) determines how the SCI is brought out of the standby
state to process an incoming message. The WAKE bit enables either idle line wakeup or address mark
wakeup.
18.4.6.6.1 Idle Input line Wakeup (WAKE = 0)
In this wakeup method, an idle condition on the RXD pin clears the RWU bit and wakes up the SCI. The
initial frame or frames of every message contain addressing information. All receivers evaluate the
addressing information, and receivers for which the message is addressed process the frames that follow.
Any receiver for which a message is not addressed can set its RWU bit and return to the standby state. The
Idle or Next FrameStop
RT1
RT2
RT3
RT4
RT5
RT6
RT7
RT8
RT9
RT10
RT11
RT12
RT13
RT14
RT15
RT16
Data
Samples
Receiver
RT Clock
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 597
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
RWU bit remains set and the receiver remains on standby until another idle character appears on the RXD
pin.
Idle line wakeup requires that messages be separated by at least one idle character and that no message
contains idle characters.
The idle character that wakes a receiver does not set the receiver idle bit, IDLE, or the receive data register
full flag, RDRF.
The idle line type bit, ILT, determines whether the receiver begins counting logic 1s as idle character bits
after the start bit or after the stop bit. ILT is in SCI control register 1 (SCICR1).
18.4.6.6.2 Address Mark Wakeup (WAKE = 1)
In this wakeup method, a logic 1 in the most significant bit (MSB) position of a frame clears the RWU bit
and wakes up the SCI. The logic 1 in the MSB position marks a frame as an address frame that contains
addressing information. All receivers evaluate the addressing information, and the receivers for which the
message is addressed process the frames that follow.Any receiver for which a message is not addressed can
set its RWU bit and return to the standby state. The RWU bit remains set and the receiver remains on
standby until another address frame appears on the RXD pin.
The logic 1 MSB of an address frame clears the receiver’s RWU bit before the stop bit is received and sets
the RDRF flag.
Address mark wakeup allows messages to contain idle characters but requires that the MSB be reserved
for use in address frames.
NOTE
With the WAKE bit clear, setting the RWU bit after the RXD pin has been
idle can cause the receiver to wake up immediately.
18.4.7 Single-Wire Operation
Normally, the SCI uses two pins for transmitting and receiving. In single-wire operation, the RXD pin is
disconnected from the SCI. The SCI uses the TXD pin for both receiving and transmitting.
Figure 18-30. Single-Wire Operation (LOOPS = 1, RSRC = 1)
Enable single-wire operation by setting the LOOPS bit and the receiver source bit, RSRC, in SCI control
register 1 (SCICR1). Setting the LOOPS bit disables the path from the RXD pin to the receiver. Setting
the RSRC bit connects the TXD pin to the receiver. Both the transmitter and receiver must be enabled
(TE = 1 and RE = 1).The TXDIR bit (SCISR2[1]) determines whether the TXD pin is going to be used as
an input (TXDIR = 0) or an output (TXDIR = 1) in this mode of operation.
RXD
Transmitter
Receiver
TXD
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
598 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
In single-wire operation data from the TXD pin is inverted if RXPOL is set.
18.4.8 Loop Operation
In loop operation the transmitter output goes to the receiver input. The RXD pin is disconnected from the
SCI.
Figure 18-31. Loop Operation (LOOPS = 1, RSRC = 0)
Enable loop operation by setting the LOOPS bit and clearing the RSRC bit in SCI control register 1
(SCICR1). Setting the LOOPS bit disables the path from the RXD pin to the receiver. Clearing the RSRC
bit connects the transmitter output to the receiver input. Both the transmitter and receiver must be enabled
(TE = 1 and RE = 1).
NOTE
In loop operation data from the transmitter is not recognized by the receiver
if RXPOL and TXPOL are not the same.
18.5 Initialization/Application Information
18.5.1 Reset Initialization
See Section 18.3.2, “Register Descriptions”.
18.5.2 Modes of Operation
18.5.2.1 Run Mode
Normal mode of operation.
To initialize a SCI transmission, see Section 18.4.5.2, “Character Transmission”.
18.5.2.2 Wait Mode
SCI operation in wait mode depends on the state of the SCISWAI bit in the SCI control register 1
(SCICR1).
• If SCISWAI is clear, the SCI operates normally when the CPU is in wait mode.
• If SCISWAI is set, SCI clock generation ceases and the SCI module enters a power-conservation
state when the CPU is in wait mode. Setting SCISWAI does not affect the state of the receiver
enable bit, RE, or the transmitter enable bit, TE.
RXD
Transmitter
Receiver
TXD
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 599
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
If SCISWAI is set, any transmission or reception in progress stops at wait mode entry. The
transmission or reception resumes when either an internal or external interrupt brings the CPU out
of wait mode. Exiting wait mode by reset aborts any transmission or reception in progress and
resets the SCI.
18.5.2.3 Stop Mode
The SCI is inactive during stop mode for reduced power consumption. The STOP instruction does not
affect the SCI register states, but the SCI bus clock will be disabled. The SCI operation resumes from
where it left off after an external interrupt brings the CPU out of stop mode. Exiting stop mode by reset
aborts any transmission or reception in progress and resets the SCI.
The receive input active edge detect circuit is still active in stop mode. An active edge on the receive input
can be used to bring the CPU out of stop mode.
18.5.3 Interrupt Operation
This section describes the interrupt originated by the SCI block.The MCU must service the interrupt
requests. Table 18-20 lists the eight interrupt sources of the SCI.
18.5.3.1 Description of Interrupt Operation
The SCI only originates interrupt requests. The following is a description of how the SCI makes a request
and how the MCU should acknowledge that request. The interrupt vector offset and interrupt number are
chip dependent. The SCI only has a single interrupt line (SCI Interrupt Signal, active high operation) and
all the following interrupts, when generated, are ORed together and issued through that port.
18.5.3.1.1 TDRE Description
The TDRE interrupt is set high by the SCI when the transmit shift register receives a byte from the SCI
data register. A TDRE interrupt indicates that the transmit data register (SCIDRH/L) is empty and that a
Table 18-20. SCI Interrupt Sources
Interrupt Source Local Enable Description
TDRE SCISR1[7] TIE Active high level. Indicates that a byte was transferred from SCIDRH/L to the
transmit shift register.
TC SCISR1[6] TCIE Active high level. Indicates that a transmit is complete.
RDRF SCISR1[5] RIE Active high level. The RDRF interrupt indicates that received data is available
in the SCI data register.
OR SCISR1[3] Active high level. This interrupt indicates that an overrun condition has occurred.
IDLE SCISR1[4] ILIE Active high level. Indicates that receiver input has become idle.
RXEDGIF SCIASR1[7] RXEDGIE Active high level. Indicates that an active edge (falling for RXPOL = 0, rising for
RXPOL = 1) was detected.
BERRIF SCIASR1[1] BERRIE Active high level. Indicates that a mismatch between transmitted and received data
in a single wire application has happened.
BKDIF SCIASR1[0] BRKDIE Active high level. Indicates that a break character has been received.
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
600 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
new byte can be written to the SCIDRH/L for transmission.Clear TDRE by reading SCI status register 1
with TDRE set and then writing to SCI data register low (SCIDRL).
18.5.3.1.2 TC Description
The TC interrupt is set by the SCI when a transmission has been completed. Transmission is completed
when all bits including the stop bit (if transmitted) have been shifted out and no data is queued to be
transmitted. No stop bit is transmitted when sending a break character and the TC flag is set (providing
there is no more data queued for transmission) when the break character has been shifted out. A TC
interrupt indicates that there is no transmission in progress. TC is set high when the TDRE flag is set and
no data, preamble, or break character is being transmitted. When TC is set, the TXD pin becomes idle
(logic 1). Clear TC by reading SCI status register 1 (SCISR1) with TC set and then writing to SCI data
register low (SCIDRL).TC is cleared automatically when data, preamble, or break is queued and ready to
be sent.
18.5.3.1.3 RDRF Description
The RDRF interrupt is set when the data in the receive shift register transfers to the SCI data register. A
RDRF interrupt indicates that the received data has been transferred to the SCI data register and that the
byte can now be read by the MCU. The RDRF interrupt is cleared by reading the SCI status register one
(SCISR1) and then reading SCI data register low (SCIDRL).
18.5.3.1.4 OR Description
The OR interrupt is set when software fails to read the SCI data register before the receive shift register
receives the next frame. The newly acquired data in the shift register will be lost in this case, but the data
already in the SCI data registers is not affected. The OR interrupt is cleared by reading the SCI status
register one (SCISR1) and then reading SCI data register low (SCIDRL).
18.5.3.1.5 IDLE Description
The IDLE interrupt is set when 10 consecutive logic 1s (if M = 0) or 11 consecutive logic 1s (if M = 1)
appear on the receiver input. Once the IDLE is cleared, a valid frame must again set the RDRF flag before
an idle condition can set the IDLE flag. Clear IDLE by reading SCI status register 1 (SCISR1) with IDLE
set and then reading SCI data register low (SCIDRL).
18.5.3.1.6 RXEDGIF Description
The RXEDGIF interrupt is set when an active edge (falling if RXPOL = 0, rising if RXPOL = 1) on the
RXD pin is detected. Clear RXEDGIF by writing a “1” to the SCIASR1 SCI alternative status register 1.
18.5.3.1.7 BERRIF Description
The BERRIF interrupt is set when a mismatch between the transmitted and the received data in a single
wire application like LIN was detected. Clear BERRIF by writing a “1” to the SCIASR1 SCI alternative
status register 1. This flag is also cleared if the bit error detect feature is disabled.
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 601
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
18.5.3.1.8 BKDIF Description
The BKDIF interrupt is set when a break signal was received. Clear BKDIF by writing a “1” to the
SCIASR1 SCI alternative status register 1. This flag is also cleared if break detect feature is disabled.
18.5.4 Recovery from Wait Mode
The SCI interrupt request can be used to bring the CPU out of wait mode.
18.5.5 Recovery from Stop Mode
An active edge on the receive input can be used to bring the CPU out of stop mode.
Serial Communication Interface (S12SCIV5)
MC9S12G Family Reference Manual, Rev.1.06
602 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 603
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 19
Serial Peripheral Interface (S12SPIV5)
Revision History
19.1 Introduction
The SPI module allows a duplex, synchronous, serial communication between the MCU and peripheral
devices. Software can poll the SPI status flags or the SPI operation can be interrupt driven.
19.1.1 Glossary of Terms
19.1.2 Features
The SPI includes these distinctive features:
• Master mode and slave mode
• Selectable 8 or 16-bit transfer width
• Bidirectional mode
• Slave select output
• Mode fault error flag with CPU interrupt capability
Revision Number Date Author Summary of Changes
05.00 24 MAR 2005 Added 16-bit transfer width feature.
SPI Serial Peripheral Interface
SS Slave Select
SCK Serial Clock
MOSI Master Output, Slave Input
MISO Master Input, Slave Output
MOMI Master Output, Master Input
SISO Slave Input, Slave Output
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
604 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
• Double-buffered data register
• Serial clock with programmable polarity and phase
• Control of SPI operation during wait mode
19.1.3 Modes of Operation
The SPI functions in three modes: run, wait, and stop.
• Run mode
This is the basic mode of operation.
• Wait mode
SPI operation in wait mode is a configurable low power mode, controlled by the SPISWAI bit
located in the SPICR2 register. In wait mode, if the SPISWAI bit is clear, the SPI operates like in
run mode. If the SPISWAI bit is set, the SPI goes into a power conservative state, with the SPI clock
generation turned off. If the SPI is configured as a master, any transmission in progress stops, but
is resumed after CPU goes into run mode. If the SPI is configured as a slave, reception and
transmission of data continues, so that the slave stays synchronized to the master.
• Stop mode
The SPI is inactive in stop mode for reduced power consumption. If the SPI is configured as a
master, any transmission in progress stops, but is resumed after CPU goes into run mode. If the SPI
is configured as a slave, reception and transmission of data continues, so that the slave stays
synchronized to the master.
For a detailed description of operating modes, please refer to Section 19.4.7, “Low Power Mode Options”.
19.1.4 Block Diagram
Figure 19-1 gives an overview on the SPI architecture. The main parts of the SPI are status, control and
data registers, shifter logic, baud rate generator, master/slave control logic, and port control logic.
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 605
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 19-1. SPI Block Diagram
19.2 External Signal Description
This section lists the name and description of all ports including inputs and outputs that do, or may, connect
off chip. The SPI module has a total of four external pins.
19.2.1 MOSI — Master Out/Slave In Pin
This pin is used to transmit data out of the SPI module when it is configured as a master and receive data
when it is configured as slave.
SPI Control Register 1
SPI Control Register 2
SPI Baud Rate Register
SPI Status Register
SPI Data Register
Shifter
Port
Control
Logic
MOSI
SCK
Interrupt Control
SPI
MSB LSB
LSBFE=1 LSBFE=0
LSBFE=0 LSBFE=1
Data In
LSBFE=1
LSBFE=0
Data Out
Baud Rate Generator
Prescaler
Bus Clock
Counter
Clock Select
SPPR 33
SPR
Baud Rate
Phase +
Polarity
Control
Master
Slave
SCK In
SCK Out
Master Baud Rate
Slave Baud Rate
Phase +
Polarity
Control
Control
Control CPOL CPHA
2
BIDIROE
SPC0
2
Shift Sample
ClockClock
MODF
SPIF SPTEF
SPI
Request
Interrupt
SS
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
606 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
19.2.2 MISO — Master In/Slave Out Pin
This pin is used to transmit data out of the SPI module when it is configured as a slave and receive data
when it is configured as master.
19.2.3 SS — Slave Select Pin
This pin is used to output the select signal from the SPI module to another peripheral with which a data
transfer is to take place when it is configured as a master and it is used as an input to receive the slave select
signal when the SPI is configured as slave.
19.2.4 SCK — Serial Clock Pin
In master mode, this is the synchronous output clock. In slave mode, this is the synchronous input clock.
19.3 Memory Map and Register Definition
This section provides a detailed description of address space and registers used by the SPI.
19.3.1 Module Memory Map
The memory map for the SPI is given in Figure 19-2. The address listed for each register is the sum of a
base address and an address offset. The base address is defined at the SoC level and the address offset is
defined at the module level. Reads from the reserved bits return zeros and writes to the reserved bits have
no effect.
Register
Name Bit 7 6 5 4 3 2 1 Bit 0
SPICR1 R SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE
W
SPICR2 R 0 XFRW 0MODFEN BIDIROE 0SPISWAI SPC0
W
SPIBR R 0 SPPR2 SPPR1 SPPR0 0SPR2 SPR1 SPR0
W
SPISR R SPIF 0 SPTEF MODF 0 0 0 0
W
SPIDRH R R15 R14 R13 R12 R11 R10 R9 R8
T15 T14 T13 T12 T11 T10 T9 T8W
= Unimplemented or Reserved
Figure 19-2. SPI Register Summary
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 607
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
19.3.2 Register Descriptions
This section consists of register descriptions in address order. Each description includes a standard register
diagram with an associated figure number. Details of register bit and field function follow the register
diagrams, in bit order.
19.3.2.1 SPI Control Register 1 (SPICR1)
Read: Anytime
Write: Anytime
SPIDRL R R7 R6 R5 R4 R3 R2 R1 R0
T7 T6 T5 T4 T3 T2 T1 T0W
Reserved R
W
Reserved R
W
76543210
RSPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE
W
Reset 0 0 0 00100
Figure 19-3. SPI Control Register 1 (SPICR1)
Table 19-1. SPICR1 Field Descriptions
Field Description
7
SPIE
SPI Interrupt Enable Bit — This bit enables SPI interrupt requests, if SPIF or MODF status flag is set.
0 SPI interrupts disabled.
1 SPI interrupts enabled.
6
SPE
SPI System Enable Bit — This bit enables the SPI system and dedicates the SPI port pins to SPI system
functions. If SPE is cleared, SPI is disabled and forced into idle state, status bits in SPISR register are reset.
0 SPI disabled (lower power consumption).
1 SPI enabled, port pins are dedicated to SPI functions.
5
SPTIE
SPI Transmit Interrupt Enable — This bit enables SPI interrupt requests, if SPTEF flag is set.
0 SPTEF interrupt disabled.
1 SPTEF interrupt enabled.
4
MSTR
SPI Master/Slave Mode Select Bit — This bit selects whether the SPI operates in master or slave mode.
Switching the SPI from master to slave or vice versa forces the SPI system into idle state.
0 SPI is in slave mode.
1 SPI is in master mode.
Register
Name Bit 7 6 5 4 3 2 1 Bit 0
= Unimplemented or Reserved
Figure 19-2. SPI Register Summary
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
608 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
19.3.2.2 SPI Control Register 2 (SPICR2)
Read: Anytime
Write: Anytime; writes to the reserved bits have no effect
3
CPOL
SPI Clock Polarity Bit — This bit selects an inverted or non-inverted SPI clock. To transmit data between SPI
modules, the SPI modules must have identical CPOL values. In master mode, a change of this bit will abort a
transmission in progress and force the SPI system into idle state.
0 Active-high clocks selected. In idle state SCK is low.
1 Active-low clocks selected. In idle state SCK is high.
2
CPHA
SPI Clock Phase Bit — This bit is used to select the SPI clock format. In master mode, a change of this bit will
abort a transmission in progress and force the SPI system into idle state.
0 Sampling of data occurs at odd edges (1,3,5,...) of the SCK clock.
1 Sampling of data occurs at even edges (2,4,6,...) of the SCK clock.
1
SSOE
Slave Select Output Enable — The SS output feature is enabled only in master mode, if MODFEN is set, by
asserting the SSOE as shown in Table 19-2. In master mode, a change of this bit will abort a transmission in
progress and force the SPI system into idle state.
0
LSBFE
LSB-First Enable — This bit does not affect the position of the MSB and LSB in the data register. Reads and
writes of the data register always have the MSB in the highest bit position. In master mode, a change of this bit
will abort a transmission in progress and force the SPI system into idle state.
0 Data is transferred most significant bit first.
1 Data is transferred least significant bit first.
Table 19-2. SS Input / Output Selection
MODFEN SSOE Master Mode Slave Mode
00 SS not used by SPI SS input
01 SS not used by SPI SS input
10SS input with MODF feature SS input
11 SS is slave select output SS input
76543210
R0 XFRW 0MODFEN BIDIROE 0SPISWAI SPC0
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 19-4. SPI Control Register 2 (SPICR2)
Table 19-1. SPICR1 Field Descriptions
Field Description
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 609
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 19-3. SPICR2 Field Descriptions
Field Description
6
XFRW
Transfer Width — This bit is used for selecting the data transfer width. If 8-bit transfer width is selected, SPIDRL
becomes the dedicated data register and SPIDRH is unused. If 16-bit transfer width is selected, SPIDRH and
SPIDRL form a 16-bit data register. Please refer to Section 19.3.2.4, “SPI Status Register (SPISR) for
information about transmit/receive data handling and the interrupt flag clearing mechanism. In master mode, a
change of this bit will abort a transmission in progress and force the SPI system into idle state.
0 8-bit Transfer Width (n = 8)1
1 16-bit Transfer Width (n = 16)1
1n is used later in this document as a placeholder for the selected transfer width.
4
MODFEN
Mode Fault Enable Bit — This bit allows the MODF failure to be detected. If the SPI is in master mode and
MODFEN is cleared, then the SS port pin is not used by the SPI. In slave mode, the SS is available only as an
input regardless of the value of MODFEN. For an overview on the impact of the MODFEN bit on the SS port pin
configuration, refer to Table 19-2. In master mode, a change of this bit will abort a transmission in progress and
force the SPI system into idle state.
0SS port pin is not used by the SPI.
1SS port pin with MODF feature.
3
BIDIROE
Output Enable in the Bidirectional Mode of Operation — This bit controls the MOSI and MISO output buffer
of the SPI, when in bidirectional mode of operation (SPC0 is set). In master mode, this bit controls the output
buffer of the MOSI port, in slave mode it controls the output buffer of the MISO port. In master mode, with SPC0
set, a change of this bit will abort a transmission in progress and force the SPI into idle state.
0 Output buffer disabled.
1 Output buffer enabled.
1
SPISWAI
SPI Stop in Wait Mode Bit — This bit is used for power conservation while in wait mode.
0 SPI clock operates normally in wait mode.
1 Stop SPI clock generation when in wait mode.
0
SPC0
Serial Pin Control Bit 0 — This bit enables bidirectional pin configurations as shown in Table 19-4. In master
mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state.
Table 19-4. Bidirectional Pin Configurations
Pin Mode SPC0 BIDIROE MISO MOSI
Master Mode of Operation
Normal 0 X Master In Master Out
Bidirectional 1 0 MISO not used by SPI Master In
1 Master I/O
Slave Mode of Operation
Normal 0 X Slave Out Slave In
Bidirectional 1 0 Slave In MOSI not used by SPI
1 Slave I/O
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
610 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
19.3.2.3 SPI Baud Rate Register (SPIBR)
Read: Anytime
Write: Anytime; writes to the reserved bits have no effect
The baud rate divisor equation is as follows:
BaudRateDivisor = (SPPR + 1) • 2(SPR + 1) Eqn. 19-1
The baud rate can be calculated with the following equation:
Baud Rate = BusClock / BaudRateDivisor Eqn. 19-2
NOTE
For maximum allowed baud rates, please refer to the SPI Electrical
Specification in the Electricals chapter of this data sheet.
76543210
R0 SPPR2 SPPR1 SPPR0 0SPR2 SPR1 SPR0
W
Reset 0 0 0 00000
= Unimplemented or Reserved
Figure 19-5. SPI Baud Rate Register (SPIBR)
Table 19-5. SPIBR Field Descriptions
Field Description
6–4
SPPR[2:0]
SPI Baud Rate Preselection Bits —These bits specify the SPI baud rates as shown in Table 19-6. In master
mode, a change of these bits will abort a transmission in progress and force the SPI system into idle state.
2–0
SPR[2:0]
SPI Baud Rate Selection Bits —These bits specify the SPI baud rates as shown in Table 19-6. In master mode,
a change of these bits will abort a transmission in progress and force the SPI system into idle state.
Table 19-6. Example SPI Baud Rate Selection (25 MHz Bus Clock)
SPPR2 SPPR1 SPPR0 SPR2 SPR1 SPR0 Baud Rate
Divisor Baud Rate
0 0 0 0 0 0 2 12.5 Mbit/s
0 0 0 0 0 1 4 6.25 Mbit/s
0 0 0 0 1 0 8 3.125 Mbit/s
0 0 0 0 1 1 16 1.5625 Mbit/s
0 0 0 1 0 0 32 781.25 kbit/s
0 0 0 1 0 1 64 390.63 kbit/s
0 0 0 1 1 0 128 195.31 kbit/s
0 0 0 1 1 1 256 97.66 kbit/s
0 0 1 0 0 0 4 6.25 Mbit/s
0 0 1 0 0 1 8 3.125 Mbit/s
0 0 1 0 1 0 16 1.5625 Mbit/s
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 611
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0 0 1 0 1 1 32 781.25 kbit/s
0 0 1 1 0 0 64 390.63 kbit/s
0 0 1 1 0 1 128 195.31 kbit/s
0 0 1 1 1 0 256 97.66 kbit/s
0 0 1 1 1 1 512 48.83 kbit/s
0 1 0 0 0 0 6 4.16667 Mbit/s
0 1 0 0 0 1 12 2.08333 Mbit/s
0 1 0 0 1 0 24 1.04167 Mbit/s
0 1 0 0 1 1 48 520.83 kbit/s
0 1 0 1 0 0 96 260.42 kbit/s
0 1 0 1 0 1 192 130.21 kbit/s
0 1 0 1 1 0 384 65.10 kbit/s
0 1 0 1 1 1 768 32.55 kbit/s
0 1 1 0 0 0 8 3.125 Mbit/s
0 1 1 0 0 1 16 1.5625 Mbit/s
0 1 1 0 1 0 32 781.25 kbit/s
0 1 1 0 1 1 64 390.63 kbit/s
0 1 1 1 0 0 128 195.31 kbit/s
0 1 1 1 0 1 256 97.66 kbit/s
0 1 1 1 1 0 512 48.83 kbit/s
0 1 1 1 1 1 1024 24.41 kbit/s
1 0 0 0 0 0 10 2.5 Mbit/s
1 0 0 0 0 1 20 1.25 Mbit/s
1 0 0 0 1 0 40 625 kbit/s
1 0 0 0 1 1 80 312.5 kbit/s
1 0 0 1 0 0 160 156.25 kbit/s
1 0 0 1 0 1 320 78.13 kbit/s
1 0 0 1 1 0 640 39.06 kbit/s
1 0 0 1 1 1 1280 19.53 kbit/s
1 0 1 0 0 0 12 2.08333 Mbit/s
1 0 1 0 0 1 24 1.04167 Mbit/s
1 0 1 0 1 0 48 520.83 kbit/s
1 0 1 0 1 1 96 260.42 kbit/s
1 0 1 1 0 0 192 130.21 kbit/s
1 0 1 1 0 1 384 65.10 kbit/s
1 0 1 1 1 0 768 32.55 kbit/s
1 0 1 1 1 1 1536 16.28 kbit/s
1 1 0 0 0 0 14 1.78571 Mbit/s
1 1 0 0 0 1 28 892.86 kbit/s
Table 19-6. Example SPI Baud Rate Selection (25 MHz Bus Clock)
SPPR2 SPPR1 SPPR0 SPR2 SPR1 SPR0 Baud Rate
Divisor Baud Rate
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
612 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
19.3.2.4 SPI Status Register (SPISR)
Read: Anytime
Write: Has no effect
1 1 0 0 1 0 56 446.43 kbit/s
1 1 0 0 1 1 112 223.21 kbit/s
1 1 0 1 0 0 224 111.61 kbit/s
1 1 0 1 0 1 448 55.80 kbit/s
1 1 0 1 1 0 896 27.90 kbit/s
1 1 0 1 1 1 1792 13.95 kbit/s
1 1 1 0 0 0 16 1.5625 Mbit/s
1 1 1 0 0 1 32 781.25 kbit/s
1 1 1 0 1 0 64 390.63 kbit/s
1 1 1 0 1 1 128 195.31 kbit/s
1 1 1 1 0 0 256 97.66 kbit/s
1 1 1 1 0 1 512 48.83 kbit/s
1 1 1 1 1 0 1024 24.41 kbit/s
1 1 1 1 1 1 2048 12.21 kbit/s
76543210
R SPIF 0 SPTEF MODF 0000
W
Reset 0 0 1 00000
= Unimplemented or Reserved
Figure 19-6. SPI Status Register (SPISR)
Table 19-7. SPISR Field Descriptions
Field Description
7
SPIF
SPIF Interrupt Flag — This bit is set after received data has been transferred into the SPI data register. For
information about clearing SPIF Flag, please refer to Table 19-8.
0 Transfer not yet complete.
1 New data copied to SPIDR.
Table 19-6. Example SPI Baud Rate Selection (25 MHz Bus Clock)
SPPR2 SPPR1 SPPR0 SPR2 SPR1 SPR0 Baud Rate
Divisor Baud Rate
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 613
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 19-8. SPIF Interrupt Flag Clearing Sequence
Table 19-9. SPTEF Interrupt Flag Clearing Sequence
5
SPTEF
SPI Transmit Empty Interrupt Flag — If set, this bit indicates that the transmit data register is empty. For
information about clearing this bit and placing data into the transmit data register, please refer to Table 19-9.
0 SPI data register not empty.
1 SPI data register empty.
4
MODF
Mode Fault Flag — This bit is set if the SS input becomes low while the SPI is configured as a master and mode
fault detection is enabled, MODFEN bit of SPICR2 register is set. Refer to MODFEN bit description in
Section 19.3.2.2, “SPI Control Register 2 (SPICR2)”. The flag is cleared automatically by a read of the SPI status
register (with MODF set) followed by a write to the SPI control register 1.
0 Mode fault has not occurred.
1 Mode fault has occurred.
XFRW Bit SPIF Interrupt Flag Clearing Sequence
0 Read SPISR with SPIF == 1 then Read SPIDRL
1 Read SPISR with SPIF == 1
then
Byte Read SPIDRL 1
1Data in SPIDRH is lost in this case.
or
Byte Read SPIDRH 2
2SPIDRH can be read repeatedly without any effect on SPIF. SPIF Flag is cleared only by the read
of SPIDRL after reading SPISR with SPIF == 1.
Byte Read SPIDRL
or
Word Read (SPIDRH:SPIDRL)
XFRW Bit SPTEF Interrupt Flag Clearing Sequence
0 Read SPISR with SPTEF == 1 then Write to SPIDRL 1
1Any write to SPIDRH or SPIDRL with SPTEF == 0 is effectively ignored.
1 Read SPISR with SPTEF == 1
then
Byte Write to SPIDRL 12
2Data in SPIDRH is undefined in this case.
or
Byte Write to SPIDRH 13 Byte Write to SPIDRL 1
or
Word Write to (SPIDRH:SPIDRL) 1
Table 19-7. SPISR Field Descriptions
Field Description
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
614 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
19.3.2.5 SPI Data Register (SPIDR = SPIDRH:SPIDRL)
Read: Anytime; read data only valid when SPIF is set
Write: Anytime
The SPI data register is both the input and output register for SPI data. A write to this register
allows data to be queued and transmitted. For an SPI configured as a master, queued data is
transmitted immediately after the previous transmission has completed. The SPI transmitter empty
flag SPTEF in the SPISR register indicates when the SPI data register is ready to accept new data.
Received data in the SPIDR is valid when SPIF is set.
If SPIF is cleared and data has been received, the received data is transferred from the receive shift
register to the SPIDR and SPIF is set.
If SPIF is set and not serviced, and a second data value has been received, the second received data
is kept as valid data in the receive shift register until the start of another transmission. The data in
the SPIDR does not change.
If SPIF is set and valid data is in the receive shift register, and SPIF is serviced before the start of
a third transmission, the data in the receive shift register is transferred into the SPIDR and SPIF
remains set (see Figure 19-9).
If SPIF is set and valid data is in the receive shift register, and SPIF is serviced after the start of a
third transmission, the data in the receive shift register has become invalid and is not transferred
into the SPIDR (see Figure 19-10).
3SPIDRH can be written repeatedly without any effect on SPTEF. SPTEF Flag is cleared only by
writing to SPIDRL after reading SPISR with SPTEF == 1.
76543210
RR15 R14 R13 R12 R11 R10 R9 R8
WT15 T14 T13 T12 T11 T10 T9 T8
Reset 0 0 0 00000
Figure 19-7. SPI Data Register High (SPIDRH)
76543210
RR7 R6 R5 R4 R3 R2 R1 R0
WT7 T6 T5 T4 T3 T2 T1 T0
Reset 0 0 0 00000
Figure 19-8. SPI Data Register Low (SPIDRL)
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 615
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 19-9. Reception with SPIF serviced in Time
Figure 19-10. Reception with SPIF serviced too late
19.4 Functional Description
The SPI module allows a duplex, synchronous, serial communication between the MCU and peripheral
devices. Software can poll the SPI status flags or SPI operation can be interrupt driven.
The SPI system is enabled by setting the SPI enable (SPE) bit in SPI control register 1. While SPE is set,
the four associated SPI port pins are dedicated to the SPI function as:
• Slave select (SS)
• Serial clock (SCK)
• Master out/slave in (MOSI)
• Master in/slave out (MISO)
Receive Shift Register
SPIF
SPI Data Register
Data A Data B
Data A
Data A Received Data B Received
Data C
Data C
SPIF Serviced
Data C Received
Data B
= Unspecified = Reception in progress
Receive Shift Register
SPIF
SPI Data Register
Data A Data B
Data A
Data A Received Data B Received
Data C
Data C
SPIF Serviced
Data C Received
Data B Lost
= Unspecified = Reception in progress
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
616 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The main element of the SPI system is the SPI data register. The n-bit1data register in the master and the
n-bit1 data register in the slave are linked by the MOSI and MISO pins to form a distributed 2n-bit1
register. When a data transfer operation is performed, this 2n-bit1register is serially shifted n1bit positions
by the S-clock from the master, so data is exchanged between the master and the slave. Data written to the
master SPI data register becomes the output data for the slave, and data read from the master SPI data
register after a transfer operation is the input data from the slave.
A read of SPISR with SPTEF = 1 followed by a write to SPIDR puts data into the transmit data register.
When a transfer is complete and SPIF is cleared, received data is moved into the receive data register. This
data register acts as the SPI receive data register for reads and as the SPI transmit data register for writes.
A common SPI data register address is shared for reading data from the read data buffer and for writing
data to the transmit data register.
The clock phase control bit (CPHA) and a clock polarity control bit (CPOL) in the SPI control register 1
(SPICR1) select one of four possible clock formats to be used by the SPI system. The CPOL bit simply
selects a non-inverted or inverted clock. The CPHA bit is used to accommodate two fundamentally
different protocols by sampling data on odd numbered SCK edges or on even numbered SCK edges (see
Section 19.4.3, “Transmission Formats”).
The SPI can be configured to operate as a master or as a slave. When the MSTR bit in SPI control register1
is set, master mode is selected, when the MSTR bit is clear, slave mode is selected.
NOTE
A change of CPOL or MSTR bit while there is a received byte pending in
the receive shift register will destroy the received byte and must be avoided.
19.4.1 Master Mode
The SPI operates in master mode when the MSTR bit is set. Only a master SPI module can initiate
transmissions. A transmission begins by writing to the master SPI data register. If the shift register is
empty, data immediately transfers to the shift register. Data begins shifting out on the MOSI pin under the
control of the serial clock.
• Serial clock
The SPR2, SPR1, and SPR0 baud rate selection bits, in conjunction with the SPPR2, SPPR1, and
SPPR0 baud rate preselection bits in the SPI baud rate register, control the baud rate generator and
determine the speed of the transmission. The SCK pin is the SPI clock output. Through the SCK
pin, the baud rate generator of the master controls the shift register of the slave peripheral.
• MOSI, MISO pin
In master mode, the function of the serial data output pin (MOSI) and the serial data input pin
(MISO) is determined by the SPC0 and BIDIROE control bits.
•SS pin
If MODFEN and SSOE are set, the SS pin is configured as slave select output. The SS output
becomes low during each transmission and is high when the SPI is in idle state.
1. n depends on the selected transfer width, please refer to Section 19.3.2.2, “SPI Control Register 2 (SPICR2)
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 617
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
If MODFEN is set and SSOE is cleared, the SS pin is configured as input for detecting mode fault
error. If the SS input becomes low this indicates a mode fault error where another master tries to
drive the MOSI and SCK lines. In this case, the SPI immediately switches to slave mode, by
clearing the MSTR bit and also disables the slave output buffer MISO (or SISO in bidirectional
mode). So the result is that all outputs are disabled and SCK, MOSI, and MISO are inputs. If a
transmission is in progress when the mode fault occurs, the transmission is aborted and the SPI is
forced into idle state.
This mode fault error also sets the mode fault (MODF) flag in the SPI status register (SPISR). If
the SPI interrupt enable bit (SPIE) is set when the MODF flag becomes set, then an SPI interrupt
sequence is also requested.
When a write to the SPI data register in the master occurs, there is a half SCK-cycle delay. After
the delay, SCK is started within the master. The rest of the transfer operation differs slightly,
depending on the clock format specified by the SPI clock phase bit, CPHA, in SPI control register 1
(see Section 19.4.3, “Transmission Formats”).
NOTE
A change of the bits CPOL, CPHA, SSOE, LSBFE, XFRW, MODFEN,
SPC0, or BIDIROE with SPC0 set, SPPR2-SPPR0 and SPR2-SPR0 in
master mode will abort a transmission in progress and force the SPI into idle
state. The remote slave cannot detect this, therefore the master must ensure
that the remote slave is returned to idle state.
19.4.2 Slave Mode
The SPI operates in slave mode when the MSTR bit in SPI control register 1 is clear.
• Serial clock
In slave mode, SCK is the SPI clock input from the master.
• MISO, MOSI pin
In slave mode, the function of the serial data output pin (MISO) and serial data input pin (MOSI)
is determined by the SPC0 bit and BIDIROE bit in SPI control register 2.
•SS pin
The SS pin is the slave select input. Before a data transmission occurs, the SS pin of the slave SPI
must be low. SS must remain low until the transmission is complete. If SS goes high, the SPI is
forced into idle state.
The SS input also controls the serial data output pin, if SS is high (not selected), the serial data
output pin is high impedance, and, if SS is low, the first bit in the SPI data register is driven out of
the serial data output pin. Also, if the slave is not selected (SS is high), then the SCK input is
ignored and no internal shifting of the SPI shift register occurs.
Although the SPI is capable of duplex operation, some SPI peripherals are capable of only
receiving SPI data in a slave mode. For these simpler devices, there is no serial data out pin.
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
618 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
When peripherals with duplex capability are used, take care not to
simultaneously enable two receivers whose serial outputs drive the same
system slave’s serial data output line.
As long as no more than one slave device drives the system slave’s serial data output line, it is possible for
several slaves to receive the same transmission from a master, although the master would not receive return
information from all of the receiving slaves.
If the CPHA bit in SPI control register 1 is clear, odd numbered edges on the SCK input cause the data at
the serial data input pin to be latched. Even numbered edges cause the value previously latched from the
serial data input pin to shift into the LSB or MSB of the SPI shift register, depending on the LSBFE bit.
If the CPHA bit is set, even numbered edges on the SCK input cause the data at the serial data input pin to
be latched. Odd numbered edges cause the value previously latched from the serial data input pin to shift
into the LSB or MSB of the SPI shift register, depending on the LSBFE bit.
When CPHA is set, the first edge is used to get the first data bit onto the serial data output pin. When CPHA
is clear and the SS input is low (slave selected), the first bit of the SPI data is driven out of the serial data
output pin. After the nth1shift, the transfer is considered complete and the received data is transferred into
the SPI data register. To indicate transfer is complete, the SPIF flag in the SPI status register is set.
NOTE
A change of the bits CPOL, CPHA, SSOE, LSBFE, MODFEN, SPC0, or
BIDIROE with SPC0 set in slave mode will corrupt a transmission in
progress and must be avoided.
19.4.3 Transmission Formats
During an SPI transmission, data is transmitted (shifted out serially) and received (shifted in serially)
simultaneously. The serial clock (SCK) synchronizes shifting and sampling of the information on the two
serial data lines. A slave select line allows selection of an individual slave SPI device; slave devices that
are not selected do not interfere with SPI bus activities. Optionally, on a master SPI device, the slave select
line can be used to indicate multiple-master bus contention.
Figure 19-11. Master/Slave Transfer Block Diagram
1. n depends on the selected transfer width, please refer to Section 19.3.2.2, “SPI Control Register 2 (SPICR2)
SHIFT REGISTER
SHIFT REGISTER
BAUD RATE
GENERATOR
MASTER SPI SLAVE SPI
MOSI MOSI
MISO MISO
SCK SCK
SS SS
VDD
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 619
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
19.4.3.1 Clock Phase and Polarity Controls
Using two bits in the SPI control register 1, software selects one of four combinations of serial clock phase
and polarity.
The CPOL clock polarity control bit specifies an active high or low clock and has no significant effect on
the transmission format.
The CPHA clock phase control bit selects one of two fundamentally different transmission formats.
Clock phase and polarity should be identical for the master SPI device and the communicating slave
device. In some cases, the phase and polarity are changed between transmissions to allow a master device
to communicate with peripheral slaves having different requirements.
19.4.3.2 CPHA = 0 Transfer Format
The first edge on the SCK line is used to clock the first data bit of the slave into the master and the first
data bit of the master into the slave. In some peripherals, the first bit of the slave’s data is available at the
slave’s data out pin as soon as the slave is selected. In this format, the first SCK edge is issued a half cycle
after SS has become low.
A half SCK cycle later, the second edge appears on the SCK line. When this second edge occurs, the value
previously latched from the serial data input pin is shifted into the LSB or MSB of the shift register,
depending on LSBFE bit.
After this second edge, the next bit of the SPI master data is transmitted out of the serial data output pin of
the master to the serial input pin on the slave. This process continues for a total of 16 edges on the SCK
line, with data being latched on odd numbered edges and shifted on even numbered edges.
Data reception is double buffered. Data is shifted serially into the SPI shift register during the transfer and
is transferred to the parallel SPI data register after the last bit is shifted in.
After 2n1 (last) SCK edges:
• Data that was previously in the master SPI data register should now be in the slave data register and
the data that was in the slave data register should be in the master.
• The SPIF flag in the SPI status register is set, indicating that the transfer is complete.
Figure 19-12 is a timing diagram of an SPI transfer where CPHA = 0. SCK waveforms are shown for
CPOL = 0 and CPOL = 1. The diagram may be interpreted as a master or slave timing diagram because
the SCK, MISO, and MOSI pins are connected directly between the master and the slave. The MISO signal
is the output from the slave and the MOSI signal is the output from the master. The SS pin of the master
must be either high or reconfigured as a general-purpose output not affecting the SPI.
1. n depends on the selected transfer width, please refer to Section 19.3.2.2, “SPI Control Register 2 (SPICR2)
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
620 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 19-12. SPI Clock Format 0 (CPHA = 0), with 8-bit Transfer Width selected (XFRW = 0)
tL
Begin End
SCK (CPOL = 0)
SAMPLE I
CHANGE O
SEL SS (O)
Transfer
SCK (CPOL = 1)
MSB first (LSBFE = 0):
LSB first (LSBFE = 1):
MSB
LSB
LSB
MSB
Bit 5
Bit 2
Bit 6
Bit 1
Bit 4
Bit 3
Bit 3
Bit 4
Bit 2
Bit 5
Bit 1
Bit 6
CHANGE O
SEL SS (I)
MOSI pin
MISO pin
Master only
MOSI/MISO
tT
If next transfer begins here
for tT
, tl, tL
Minimum 1/2 SCK
tItL
tL = Minimum leading time before the first SCK edge
tT = Minimum trailing time after the last SCK edge
tI = Minimum idling time between transfers (minimum SS high time)
tL, tT
, and tI are guaranteed for the master mode and required for the slave mode.
1 234 56 78910111213141516
SCK Edge Number
End of Idle State Begin of Idle State
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 621
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 19-13. SPI Clock Format 0 (CPHA = 0), with 16-Bit Transfer Width selected (XFRW = 1)
In slave mode, if the SS line is not deasserted between the successive transmissions then the content of the
SPI data register is not transmitted; instead the last received data is transmitted. If the SS line is deasserted
for at least minimum idle time (half SCK cycle) between successive transmissions, then the content of the
SPI data register is transmitted.
In master mode, with slave select output enabled the SS line is always deasserted and reasserted between
successive transfers for at least minimum idle time.
19.4.3.3 CPHA = 1 Transfer Format
Some peripherals require the first SCK edge before the first data bit becomes available at the data out pin,
the second edge clocks data into the system. In this format, the first SCK edge is issued by setting the
CPHA bit at the beginning of the n1-cycle transfer operation.
The first edge of SCK occurs immediately after the half SCK clock cycle synchronization delay. This first
edge commands the slave to transfer its first data bit to the serial data input pin of the master.
1. n depends on the selected transfer width, please refer to Section 19.3.2.2, “SPI Control Register 2 (SPICR2)
tL
Begin End
SCK (CPOL = 0)
SAMPLE I
CHANGE O
SEL SS (O)
Transfer
SCK (CPOL = 1)
MSB first (LSBFE = 0)
LSB first (LSBFE = 1)
MSB
LSB
LSB
MSB
Bit 13
Bit 2
Bit 14
Bit 1
Bit 12
Bit 3
Bit 11
Bit 4
Bit 5
CHANGE O
SEL SS (I)
MOSI pin
MISO pin
Master only
MOSI/MISO
tT
If next transfer begins here
for tT
, tl, tL
Minimum 1/2 SCK
tItL
tL = Minimum leading time before the first SCK edge
tT = Minimum trailing time after the last SCK edge
tI = Minimum idling time between transfers (minimum SS high time)
tL, tT
, and tI are guaranteed for the master mode and required for the slave mode.
12345678910111213141516
SCK Edge Number
End of Idle State Begin of Idle State
17181920212223242526272829303132
Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 4 Bit 3 Bit 2 Bit 1
Bit 6Bit 5 Bit 7 Bit 8 Bit 9 Bit 10Bit 11Bit 12Bit 13Bit 14
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
622 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A half SCK cycle later, the second edge appears on the SCK pin. This is the latching edge for both the
master and slave.
When the third edge occurs, the value previously latched from the serial data input pin is shifted into the
LSB or MSB of the SPI shift register, depending on LSBFE bit. After this edge, the next bit of the master
data is coupled out of the serial data output pin of the master to the serial input pin on the slave.
This process continues for a total of n1edges on the SCK line with data being latched on even numbered
edges and shifting taking place on odd numbered edges.
Data reception is double buffered, data is serially shifted into the SPI shift register during the transfer and
is transferred to the parallel SPI data register after the last bit is shifted in.
After 2n1 SCK edges:
• Data that was previously in the SPI data register of the master is now in the data register of the
slave, and data that was in the data register of the slave is in the master.
• The SPIF flag bit in SPISR is set indicating that the transfer is complete.
Figure 19-14 shows two clocking variations for CPHA = 1. The diagram may be interpreted as a master or
slave timing diagram because the SCK, MISO, and MOSI pins are connected directly between the master
and the slave. The MISO signal is the output from the slave, and the MOSI signal is the output from the
master. The SS line is the slave select input to the slave. The SS pin of the master must be either high or
reconfigured as a general-purpose output not affecting the SPI.
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 623
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 19-14. SPI Clock Format 1 (CPHA = 1), with 8-Bit Transfer Width selected (XFRW = 0)
tLtT
for tT
, tl, tL
Minimum 1/2 SCK
tItL
If next transfer begins here
Begin End
SCK (CPOL = 0)
SAMPLE I
CHANGE O
SEL SS (O)
Transfer
SCK (CPOL = 1)
MSB first (LSBFE = 0):
LSB first (LSBFE = 1):
MSB
LSB
LSB
MSB
Bit 5
Bit 2
Bit 6
Bit 1
Bit 4
Bit 3
Bit 3
Bit 4
Bit 2
Bit 5
Bit 1
Bit 6
CHANGE O
SEL SS (I)
MOSI pin
MISO pin
Master only
MOSI/MISO
tL = Minimum leading time before the first SCK edge, not required for back-to-back transfers
tT = Minimum trailing time after the last SCK edge
tI = Minimum idling time between transfers (minimum SS high time), not required for back-to-back transfers
1 234 56 78910111213141516SCK Edge Number
End of Idle State Begin of Idle State
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
624 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 19-15. SPI Clock Format 1 (CPHA = 1), with 16-Bit Transfer Width selected (XFRW = 1)
The SS line can remain active low between successive transfers (can be tied low at all times). This format
is sometimes preferred in systems having a single fixed master and a single slave that drive the MISO data
line.
• Back-to-back transfers in master mode
In master mode, if a transmission has completed and new data is available in the SPI data register,
this data is sent out immediately without a trailing and minimum idle time.
The SPI interrupt request flag (SPIF) is common to both the master and slave modes. SPIF gets set one
half SCK cycle after the last SCK edge.
19.4.4 SPI Baud Rate Generation
Baud rate generation consists of a series of divider stages. Six bits in the SPI baud rate register (SPPR2,
SPPR1, SPPR0, SPR2, SPR1, and SPR0) determine the divisor to the SPI module clock which results in
the SPI baud rate.
The SPI clock rate is determined by the product of the value in the baud rate preselection bits
(SPPR2–SPPR0) and the value in the baud rate selection bits (SPR2–SPR0). The module clock divisor
equation is shown in Equation 19-3.
tL
Begin End
SCK (CPOL = 0)
SAMPLE I
CHANGE O
SEL SS (O)
Transfer
SCK (CPOL = 1)
MSB first (LSBFE = 0)
LSB first (LSBFE = 1)
MSB
LSB
LSB
MSB
Bit 13
Bit 2
Bit 14
Bit 1
Bit 12
Bit 3
Bit 11
Bit 4
Bit 5
CHANGE O
SEL SS (I)
MOSI pin
MISO pin
Master only
MOSI/MISO
tT
If next transfer begins here
for tT
, tl, tL
Minimum 1/2 SCK
tItL
tL = Minimum leading time before the first SCK edge, not required for back-to-back transfers
tT = Minimum trailing time after the last SCK edge
tI = Minimum idling time between transfers (minimum SS high time), not required for back-to-back transfers
12345678910111213141516
SCK Edge Number
End of Idle State Begin of Idle State
17181920212223242526272829303132
Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 4 Bit 3 Bit 2 Bit 1
Bit 6Bit 5 Bit 7 Bit 8 Bit 9 Bit 10Bit 11Bit 12Bit 13Bit 14
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 625
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
BaudRateDivisor = (SPPR + 1) • 2(SPR + 1) Eqn. 19-3
When all bits are clear (the default condition), the SPI module clock is divided by 2. When the selection
bits (SPR2–SPR0) are 001 and the preselection bits (SPPR2–SPPR0) are 000, the module clock divisor
becomes 4. When the selection bits are 010, the module clock divisor becomes 8, etc.
When the preselection bits are 001, the divisor determined by the selection bits is multiplied by 2. When
the preselection bits are 010, the divisor is multiplied by 3, etc. See Table 19-6 for baud rate calculations
for all bit conditions, based on a 25 MHz bus clock. The two sets of selects allows the clock to be divided
by a non-power of two to achieve other baud rates such as divide by 6, divide by 10, etc.
The baud rate generator is activated only when the SPI is in master mode and a serial transfer is taking
place. In the other cases, the divider is disabled to decrease IDD current.
NOTE
For maximum allowed baud rates, please refer to the SPI Electrical
Specification in the Electricals chapter of this data sheet.
19.4.5 Special Features
19.4.5.1 SS Output
The SS output feature automatically drives the SS pin low during transmission to select external devices
and drives it high during idle to deselect external devices. When SS output is selected, the SS output pin
is connected to the SS input pin of the external device.
The SS output is available only in master mode during normal SPI operation by asserting SSOE and
MODFEN bit as shown in Table 19-2.
The mode fault feature is disabled while SS output is enabled.
NOTE
Care must be taken when using the SS output feature in a multimaster
system because the mode fault feature is not available for detecting system
errors between masters.
19.4.5.2 Bidirectional Mode (MOMI or SISO)
The bidirectional mode is selected when the SPC0 bit is set in SPI control register 2 (see Table 19-10). In
this mode, the SPI uses only one serial data pin for the interface with external device(s). The MSTR bit
decides which pin to use. The MOSI pin becomes the serial data I/O (MOMI) pin for the master mode, and
the MISO pin becomes serial data I/O (SISO) pin for the slave mode. The MISO pin in master mode and
MOSI pin in slave mode are not used by the SPI.
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
626 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The direction of each serial I/O pin depends on the BIDIROE bit. If the pin is configured as an output,
serial data from the shift register is driven out on the pin. The same pin is also the serial input to the shift
register.
• The SCK is output for the master mode and input for the slave mode.
• The SS is the input or output for the master mode, and it is always the input for the slave mode.
• The bidirectional mode does not affect SCK and SS functions.
NOTE
In bidirectional master mode, with mode fault enabled, both data pins MISO
and MOSI can be occupied by the SPI, though MOSI is normally used for
transmissions in bidirectional mode and MISO is not used by the SPI. If a
mode fault occurs, the SPI is automatically switched to slave mode. In this
case MISO becomes occupied by the SPI and MOSI is not used. This must
be considered, if the MISO pin is used for another purpose.
19.4.6 Error Conditions
The SPI has one error condition:
• Mode fault error
19.4.6.1 Mode Fault Error
If the SS input becomes low while the SPI is configured as a master, it indicates a system error where more
than one master may be trying to drive the MOSI and SCK lines simultaneously. This condition is not
permitted in normal operation, the MODF bit in the SPI status register is set automatically, provided the
MODFEN bit is set.
In the special case where the SPI is in master mode and MODFEN bit is cleared, the SS pin is not used by
the SPI. In this special case, the mode fault error function is inhibited and MODF remains cleared. In case
Table 19-10. Normal Mode and Bidirectional Mode
When SPE = 1 Master Mode MSTR = 1 Slave Mode MSTR = 0
Normal Mode
SPC0 = 0
Bidirectional Mode
SPC0 = 1
SPI
MOSI
MISO
Serial Out
Serial In
SPI
MOSI
MISO
Serial In
Serial Out
SPI
MOMI
Serial Out
Serial In
BIDIROE SPI
SISO
Serial In
Serial Out
BIDIROE
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 627
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
the SPI system is configured as a slave, the SS pin is a dedicated input pin. Mode fault error doesn’t occur
in slave mode.
If a mode fault error occurs, the SPI is switched to slave mode, with the exception that the slave output
buffer is disabled. So SCK, MISO, and MOSI pins are forced to be high impedance inputs to avoid any
possibility of conflict with another output driver. A transmission in progress is aborted and the SPI is
forced into idle state.
If the mode fault error occurs in the bidirectional mode for a SPI system configured in master mode, output
enable of the MOMI (MOSI in bidirectional mode) is cleared if it was set. No mode fault error occurs in
the bidirectional mode for SPI system configured in slave mode.
The mode fault flag is cleared automatically by a read of the SPI status register (with MODF set) followed
by a write to SPI control register 1. If the mode fault flag is cleared, the SPI becomes a normal master or
slave again.
NOTE
If a mode fault error occurs and a received data byte is pending in the receive
shift register, this data byte will be lost.
19.4.7 Low Power Mode Options
19.4.7.1 SPI in Run Mode
In run mode with the SPI system enable (SPE) bit in the SPI control register clear, the SPI system is in a
low-power, disabled state. SPI registers remain accessible, but clocks to the core of this module are
disabled.
19.4.7.2 SPI in Wait Mode
SPI operation in wait mode depends upon the state of the SPISWAI bit in SPI control register 2.
• If SPISWAI is clear, the SPI operates normally when the CPU is in wait mode
• If SPISWAI is set, SPI clock generation ceases and the SPI module enters a power conservation
state when the CPU is in wait mode.
– If SPISWAI is set and the SPI is configured for master, any transmission and reception in
progress stops at wait mode entry. The transmission and reception resumes when the SPI exits
wait mode.
– If SPISWAI is set and the SPI is configured as a slave, any transmission and reception in
progress continues if the SCK continues to be driven from the master. This keeps the slave
synchronized to the master and the SCK.
If the master transmits several bytes while the slave is in wait mode, the slave will continue to
send out bytes consistent with the operation mode at the start of wait mode (i.e., if the slave is
currently sending its SPIDR to the master, it will continue to send the same byte. Else if the
slave is currently sending the last received byte from the master, it will continue to send each
previous master byte).
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
628 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
Care must be taken when expecting data from a master while the slave is in
wait or stop mode. Even though the shift register will continue to operate,
the rest of the SPI is shut down (i.e., a SPIF interrupt will not be generated
until exiting stop or wait mode). Also, the byte from the shift register will
not be copied into the SPIDR register until after the slave SPI has exited wait
or stop mode. In slave mode, a received byte pending in the receive shift
register will be lost when entering wait or stop mode. An SPIF flag and
SPIDR copy is generated only if wait mode is entered or exited during a
tranmission. If the slave enters wait mode in idle mode and exits wait mode
in idle mode, neither a SPIF nor a SPIDR copy will occur.
19.4.7.3 SPI in Stop Mode
Stop mode is dependent on the system. The SPI enters stop mode when the module clock is disabled (held
high or low). If the SPI is in master mode and exchanging data when the CPU enters stop mode, the
transmission is frozen until the CPU exits stop mode. After stop, data to and from the external SPI is
exchanged correctly. In slave mode, the SPI will stay synchronized with the master.
The stop mode is not dependent on the SPISWAI bit.
19.4.7.4 Reset
The reset values of registers and signals are described in Section 19.3, “Memory Map and Register
Definition”, which details the registers and their bit fields.
• If a data transmission occurs in slave mode after reset without a write to SPIDR, it will transmit
garbage, or the data last received from the master before the reset.
• Reading from the SPIDR after reset will always read zeros.
19.4.7.5 Interrupts
The SPI only originates interrupt requests when SPI is enabled (SPE bit in SPICR1 set). The following is
a description of how the SPI makes a request and how the MCU should acknowledge that request. The
interrupt vector offset and interrupt priority are chip dependent.
The interrupt flags MODF, SPIF, and SPTEF are logically ORed to generate an interrupt request.
19.4.7.5.1 MODF
MODF occurs when the master detects an error on the SS pin. The master SPI must be configured for the
MODF feature (see Table 19-2). After MODF is set, the current transfer is aborted and the following bit is
changed:
• MSTR = 0, The master bit in SPICR1 resets.
The MODF interrupt is reflected in the status register MODF flag. Clearing the flag will also clear the
interrupt. This interrupt will stay active while the MODF flag is set. MODF has an automatic clearing
process which is described in Section 19.3.2.4, “SPI Status Register (SPISR)”.
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 629
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
19.4.7.5.2 SPIF
SPIF occurs when new data has been received and copied to the SPI data register. After SPIF is set, it does
not clear until it is serviced. SPIF has an automatic clearing process, which is described in
Section 19.3.2.4, “SPI Status Register (SPISR)”.
19.4.7.5.3 SPTEF
SPTEF occurs when the SPI data register is ready to accept new data. After SPTEF is set, it does not clear
until it is serviced. SPTEF has an automatic clearing process, which is described in Section 19.3.2.4, “SPI
Status Register (SPISR)”.
Serial Peripheral Interface (S12SPIV5)
MC9S12G Family Reference Manual, Rev.1.06
630 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 631
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 20
Timer Module (TIM16B8CV3)
20.1 Introduction
The basic scalable timer consists of a 16-bit, software-programmable counter driven by a flexible
programmable prescaler.
This timer can be used for many purposes, including input waveform measurements while simultaneously
generating an output waveform. Pulse widths can vary from microseconds to many seconds.
This timer could contain up to 8 (0....7) input capture/output compare channels with one pulse accumulator
available only on channel 7. The input capture function is used to detect a selected transition edge and
record the time. The output compare function is used for generating output signals or for timer software
delays. The 16-bit pulse accumulator is used to operate as a simple event counter or a gated time
accumulator. The pulse accumulator shares timer channel 7 when the channel is available and when in
event mode.
A full access for the counter registers or the input capture/output compare registers should take place in
one clock cycle. Accessing high byte and low byte separately for all of these registers may not yield the
same result as accessing them in one word.
20.1.1 Features
The TIM16B8CV3 includes these distinctive features:
• Up to 8 channels available. (refer to device specification for exact number)
• All channels have same input capture/output compare functionality.
Table 20-1.
V03.00 Jan. 28, 2009 Initial version
V03.01 Aug. 26, 2009 20.1.2/20-632
Figure 20-4./20-
635
20.3.2.15/20-64
8
20.3.2.2/20-638,
20.3.2.3/20-639,
20.3.2.4/20-639,
20.4.3/20-655
- Correct typo: TSCR ->TSCR1;
- Correct typo: ECTxxx->TIMxxx
- Correct reference: Figure 20-25 -> Figure 20-30
- Add description, “a counter overflow when TTOV[7] is set”, to be the
condition of channel 7 override event.
- Phrase the description of OC7M to make it more explicit
V03.02 Apri,12,2010 20.3.2.8/20-642
20.3.2.11/20-64
5
20.4.3/20-655
-Add Table 20-10
-update TCRE bit description
-add Figure 20-31
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
632 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
• Clock prescaling.
• 16-bit counter.
• 16-bit pulse accumulator on channel 7 if channel 7 exists.
20.1.2 Modes of Operation
Stop: Timer is off because clocks are stopped.
Freeze: Timer counter keeps on running, unless TSFRZ in TSCR1 is set to 1.
Wait: Counters keeps on running, unless TSWAI in TSCR1 is set to 1.
Normal: Timer counter keep on running, unless TEN in TSCR1 is cleared to 0.
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 633
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
20.1.3 Block Diagrams
Figure 20-1. TIM16B8CV3 Block Diagram
Prescaler
16-bit Counter
Input capture
Output compare
16-bit
Pulse accumulator
IOC0
IOC2
IOC1
IOC5
IOC3
IOC4
IOC6
IOC7
PA input
interrupt
PA overflow
interrupt
Timer overflow
interrupt
Timer channel 0
interrupt
Timer channel 7
interrupt
Registers
Bus clock
Input capture
Output compare
Input capture
Output compare
Input capture
Output compare
Input capture
Output compare
Input capture
Output compare
Input capture
Output compare
Input capture
Output compare
Channel 0
Channel 1
Channel 2
Channel 3
Channel 4
Channel 5
Channel 6
Channel 7
Maximum possible channels, scalable from 0 to 7.
Pulse Accumulator is available only if channel 7 exists.
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
634 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 20-2. 16-Bit Pulse Accumulator Block Diagram
Figure 20-3. Interrupt Flag Setting
Edge detector
Intermodule Bus
IOC7
M clock
Divide by 64
Clock select
CLK0
CLK1 4:1 MUX
TIMCLK
PACLK
PACLK / 256
PACLK / 65536
Prescaled clock
(PCLK)
(Timer clock)
Interrupt
MUX
(PAMOD)
PACNT
IOCn
Edge detector
16-bit Main Timer
TCn Input Capture Reg.
Set CnF Interrupt
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 635
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 20-4. Channel 7 Output Compare/Pulse Accumulator Logic
20.2 External Signal Description
The TIM16B8CV3 module has a selected number of external pins. Refer to device specification for exact
number.
20.2.1 IOC7 — Input Capture and Output Compare Channel 7
This pin serves as input capture or output compare for channel 7 if this channel is available. This can also
be configured as pulse accumulator input.
20.2.2 IOC6 - IOC0 — Input Capture and Output Compare Channel 6-0
Those pins serve as input capture or output compare for TIM168CV3 channel if the corresponding channel
is available.
NOTE
For the description of interrupts see Section 20.6, “Interrupts”.
20.3 Memory Map and Register Definition
This section provides a detailed description of all memory and registers.
20.3.1 Module Memory Map
The memory map for the TIM16B8CV3 module is given below in Figure 20-5. The address listed for each
register is the address offset. The total address for each register is the sum of the base address for the
TIM16B8CV3 module and the address offset for each register.
PULSE
ACCUMULATOR PAD
TEN
CHANNEL 7 OUTPUT COMPARE
OCPD
TIOS7
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
636 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
20.3.2 Register Descriptions
This section consists of register descriptions in address order. Each description includes a standard register
diagram with an associated figure number. Details of register bit and field function follow the register
diagrams, in bit order.
Only bits related to implemented channels are valid.
Register
Name Bit 7 654321Bit 0
0x0000
TIOS1RIOS7 IOS6 IOS5 IOS4 IOS3 IOS2 IOS1 IOS0
W
0x0001
CFORC1R00000000
W FOC7 FOC6 FOC5 FOC4 FOC3 FOC2 FOC1 FOC0
0x0002
OC7M2ROC7M7 OC7M6 OC7M5 OC7M4 OC7M3 OC7M2 OC7M1 OC7M0
W
0x0003
OC7D2ROC7D7 OC7D6 OC7D5 OC7D4 OC7D3 OC7D2 OC7D1 OC7D0
W
0x0004
TCNTH
RTCNT15 TCNT14 TCNT13 TCNT12 TCNT11 TCNT10 TCNT9 TCNT8
W
0x0005
TCNTL
RTCNT7 TCNT6 TCNT5 TCNT4 TCNT3 TCNT2 TCNT1 TCNT0
W
0x0006
TSCR1
RTEN TSWAI TSFRZ TFFCA PRNT 000
W
0x0007
TTOV1RTOV7 TOV6 TOV5 TOV4 TOV3 TOV2 TOV1 TOV0
W
0x0008
TCTL11ROM7 OL7 OM6 OL6 OM5 OL5 OM4 OL4
W
0x0009
TCTL21ROM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0
W
0x000A
TCTL31REDG7B EDG7A EDG6B EDG6A EDG5B EDG5A EDG4B EDG4A
W
0x000B
TCTL41REDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A
W
0x000C
TIE1RC7I C6I C5I C4I C3I C2I C1I C0I
W
0x000D
TSCR21RTOI 000
TCRE PR2 PR1 PR0
W
= Unimplemented or Reserved
Figure 20-5. TIM16B8CV3 Register Summary (Sheet 1 of 2)
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 637
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x000E
TFLG11RC7F C6F C5F C4F C3F C2F C1F C0F
W
0x000F
TFLG2
RTOF 0000000
W
0x0010–0x001F
TCxH–TCxL3RBit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
W
RBit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
W
0x0020
PACTL2R0 PAEN PAMOD PEDGE CLK1 CLK0 PAOVI PAI
W
0x0021
PAFLG2R000000
PAOVF PAIF
W
0x0022
PACNTH2RPACNT15 PACNT14 PACNT13 PACNT12 PACNT11 PACNT10 PACNT9 PACNT8
W
0x0023
PACNTL2RPACNT7 PACNT6 PACNT5 PACNT4 PACNT3 PACNT2 PACNT1 PACNT0
W
0x0024–0x002B
Reserved
R
W
0x002C
OCPD1ROCPD7 OCPD6 OCPD5 OCPD4 OCPD3 OCPD2 OCPD1 OCPD0
W
0x002D
Reserved
R
0x002E
PTPSR
RPTPS7 PTPS6 PTPS5 PTPS4 PTPS3 PTPS2 PTPS1 PTPS0
W
0x002F
Reserved
R
W
1The related bit is available only if corresponding channel exists
2The register is available only if channel 7 exists.
3The register is available only if corresponding channel exists.
Register
Name Bit 7 654321Bit 0
= Unimplemented or Reserved
Figure 20-5. TIM16B8CV3 Register Summary (Sheet 2 of 2)
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
638 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
20.3.2.1 Timer Input Capture/Output Compare Select (TIOS)
Read: Anytime
Write: Anytime
20.3.2.2 Timer Compare Force Register (CFORC)
Read: Anytime but will always return 0x0000 (1 state is transient)
Write: Anytime
76543210
R
IOS7 IOS6 IOS5 IOS4 IOS3 IOS2 IOS1 IOS0
W
Reset 00000000
Figure 20-6. Timer Input Capture/Output Compare Select (TIOS)
Table 20-2. TIOS Field Descriptions
Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from
unavailable bits return a zero.
Field Description
7:0
IOS[7:0]
Input Capture or Output Compare Channel Configuration
0 The corresponding implemented channel acts as an input capture.
1 The corresponding implemented channel acts as an output compare.
76543210
R00000000
W FOC7 FOC6 FOC5 FOC4 FOC3 FOC2 FOC1 FOC0
Reset 00000000
Figure 20-7. Timer Compare Force Register (CFORC)
Table 20-3. CFORC Field Descriptions
Note: Bits related to available channels have functional effect. Writing to unavailable bits has no effect. Read from unavailable
bits return a zero.
Field Description
7:0
FOC[7:0]
Force Output Compare Action for Channel 7:0 — A write to this register with the corresponding data bit(s) set
causes the action which is programmed for output compare “x” to occur immediately. The action taken is the
same as if a successful comparison had just taken place with the TCx register except the interrupt flag does not
get set.
Note: A channel 7 event, which can be a counter overflow when TTOV[7] is set or a successful output compare
on channel 7, overrides any channel 6:0 compares. If forced output compare on any channel occurs at the
same time as the successful output compare then forced output compare action will take precedence and
interrupt flag won’t get set.
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 639
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
20.3.2.3 Output Compare 7 Mask Register (OC7M)
1This register is available only when channel 7 exists and is reserved if that channel does not exist. Writes to a reserved register
have no functional effect. Reads from a reserved register return zeroes.
Read: Anytime
Write: Anytime
20.3.2.4 Output Compare 7 Data Register (OC7D)
1This register is available only when channel 7 exists and is reserved if that channel does not exist. Writes to a reserved register
have no functional effect. Reads from a reserved register return zeroes.
Read: Anytime
Write: Anytime
76543210
R
OC7M7 OC7M6 OC7M5 OC7M4 OC7M3 OC7M2 OC7M1 OC7M0
W
Reset 00000000
Figure 20-8. Output Compare 7 Mask Register (OC7M)
Table 20-4. OC7M Field Descriptions
Field Description
7:0
OC7M[7:0]
Output Compare 7 Mask — A channel 7 event, which can be a counter overflow when TTOV[7] is set or a
successful output compare on channel 7, overrides any channel 6:0 compares. For each OC7M bit that is set,
the output compare action reflects the corresponding OC7D bit.
0 The corresponding OC7Dx bit in the output compare 7 data register will not be transferred to the timer port on
a channel 7 event, even if the corresponding pin is setup for output compare.
1 The corresponding OC7Dx bit in the output compare 7 data register will be transferred to the timer port on a
channel 7 event.
Note: The corresponding channel must also be setup for output compare (IOSx = 1 and OCPDx = 0) for data to
be transferred from the output compare 7 data register to the timer port.
76543210
R
OC7D7 OC7D6 OC7D5 OC7D4 OC7D3 OC7D2 OC7D1 OC7D0
W
Reset 00000000
Figure 20-9. Output Compare 7 Data Register (OC7D)
Table 20-5. OC7D Field Descriptions
Field Description
7:0
OC7D[7:0]
Output Compare 7 Data — A channel 7 event, which can be a counter overflow when TTOV[7] is set or a
successful output compare on channel 7, can cause bits in the output compare 7 data register to transfer to the
timer port data register depending on the output compare 7 mask register.
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
640 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
20.3.2.5 Timer Count Register (TCNT)
The 16-bit main timer is an up counter.
A full access for the counter register should take place in one clock cycle. A separate read/write for high
byte and low byte will give a different result than accessing them as a word.
Read: Anytime
Write: Has no meaning or effect in the normal mode; only writable in special modes (test_mode = 1).
The period of the first count after a write to the TCNT registers may be a different size because the write
is not synchronized with the prescaler clock.
20.3.2.6 Timer System Control Register 1 (TSCR1)
Read: Anytime
Write: Anytime
15 14 13 12 11 10 9 9
R
TCNT15 TCNT14 TCNT13 TCNT12 TCNT11 TCNT10 TCNT9 TCNT8
W
Reset 00000000
Figure 20-10. Timer Count Register High (TCNTH)
76543210
R
TCNT7 TCNT6 TCNT5 TCNT4 TCNT3 TCNT2 TCNT1 TCNT0
W
Reset 00000000
Figure 20-11. Timer Count Register Low (TCNTL)
76543210
R
TEN TSWAI TSFRZ TFFCA PRNT
000
W
Reset 00000000
= Unimplemented or Reserved
Figure 20-12. Timer System Control Register 1 (TSCR1)
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 641
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
20.3.2.7 Timer Toggle On Overflow Register 1 (TTOV)
Read: Anytime
Write: Anytime
Table 20-6. TSCR1 Field Descriptions
Field Description
7
TEN
Timer Enable
0 Disables the main timer, including the counter. Can be used for reducing power consumption.
1 Allows the timer to function normally.
If for any reason the timer is not active, there is no ÷64 clock for the pulse accumulator because the ÷64 is
generated by the timer prescaler.
6
TSWAI
Timer Module Stops While in Wait
0 Allows the timer module to continue running during wait.
1 Disables the timer module when the MCU is in the wait mode. Timer interrupts cannot be used to get the MCU
out of wait.
TSWAI also affects pulse accumulator.
5
TSFRZ
Timer Stops While in Freeze Mode
0 Allows the timer counter to continue running while in freeze mode.
1 Disables the timer counter whenever the MCU is in freeze mode. This is useful for emulation.
TSFRZ does not stop the pulse accumulator.
4
TFFCA
Timer Fast Flag Clear All
0 Allows the timer flag clearing to function normally.
1 For TFLG1(0x000E), a read from an input capture or a write to the output compare channel (0x0010–0x001F)
causes the corresponding channel flag, CnF, to be cleared. For TFLG2 (0x000F), any access to the TCNT
register (0x0004, 0x0005) clears the TOF flag. Any access to the PACNT registers (0x0022, 0x0023) clears
the PAOVF and PAIF flags in the PAFLG register (0x0021) if channel 7 exists. This has the advantage of
eliminating software overhead in a separate clear sequence. Extra care is required to avoid accidental flag
clearing due to unintended accesses.
3
PRNT
Precision Timer
0 Enables legacy timer. PR0, PR1, and PR2 bits of the TSCR2 register are used for timer counter prescaler
selection.
1 Enables precision timer. All bits of the PTPSR register are used for Precision Timer Prescaler Selection, and
all bits.
This bit is writable only once out of reset.
76543210
R
TOV7 TOV6 TOV5 TOV4 TOV3 TOV2 TOV1 TOV0
W
Reset 00000000
Figure 20-13. Timer Toggle On Overflow Register 1 (TTOV)
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
642 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
20.3.2.8 Timer Control Register 1/Timer Control Register 2 (TCTL1/TCTL2)
Read: Anytime
Write: Anytime
Table 20-7. TTOV Field Descriptions
Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from
unavailable bits return a zero.
Field Description
7:0
TOV[7:0]
Toggle On Overflow Bits — TOVx toggles output compare pin on overflow. This feature only takes effect when
in output compare mode. When set, it takes precedence over forced output compare but not channel 7 override
events.
0 Toggle output compare pin on overflow feature disabled.
1 Toggle output compare pin on overflow feature enabled.
76543210
R
OM7 OL7 OM6 OL6 OM5 OL5 OM4 OL4
W
Reset 00000000
Figure 20-14. Timer Control Register 1 (TCTL1)
76543210
R
OM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0
W
Reset 00000000
Figure 20-15. Timer Control Register 2 (TCTL2)
Table 20-8. TCTL1/TCTL2 Field Descriptions
Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from
unavailable bits return a zero
Field Description
7:0
OMx
Output Mode — These eight pairs of control bits are encoded to specify the output action to be taken as a result
of a successful OCx compare. When either OMx or OLx is 1, the pin associated with OCx becomes an output
tied to OCx.
Note: To enable output action by OMx bits on timer port, the corresponding bit in OC7M should be cleared. For
an output line to be driven by an OCx the OCPDx must be cleared.
7:0
OLx
Output Level — These eight pairs of control bits are encoded to specify the output action to be taken as a result
of a successful OCx compare. When either OMx or OLx is 1, the pin associated with OCx becomes an output
tied to OCx.
Note: To enable output action by OLx bits on timer port, the corresponding bit in OC7M should be cleared. For
an output line to be driven by an OCx the OCPDx must be cleared.
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 643
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Note: To enable output action using the OM7 and OL7 bits on the timer port,the corresponding bit OC7M7
in the OC7M register must also be cleared. The settings for these bits can be seen inTable 20-10.
Note: in Table 20-10, the IOS7 and IOSx should be set to 1
IOSx is the register TIOS bit x,
OC7Mx is the register OC7M bit x,
TCx is timer Input Capture/Output Compare register,
IOCx is channel x,
OMx/OLx is the register TCTL1/TCTL2,
OC7Dx is the register OC7D bit x.
IOCx = OC7Dx+ OMx/OLx, means that both OC7 event and OCx event will change channel x value.
Table 20-9. Compare Result Output Action
OMx OLx Action
0 0 No output compare
action on the timer output signal
0 1 Toggle OCx output line
1 0 Clear OCx output line to zero
1 1 Set OCx output line to one
Table 20-10. The OC7 and OCx event priority
OC7M7=0 OC7M7=1
OC7Mx=1 OC7Mx=0 OC7Mx=1 OC7Mx=0
TC7=TCx TC7>TCx TC7=TCx TC7>TCx TC7=TCx TC7>TCx TC7=TCx TC7>TCx
IOCx=OC7Dx
IOC7=OM7/O
L7
IOCx=OC7Dx
+OMx/OLx
IOC7=OM7/O
L7
IOCx=OMx/OLx
IOC7=OM7/OL7
IOCx=OC7Dx
IOC7=OC7D7
IOCx=OC7Dx
+OMx/OLx
IOC7=OC7D7
IOCx=OMx/OLx
IOC7=OC7D7
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
644 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
20.3.2.9 Timer Control Register 3/Timer Control Register 4 (TCTL3 and TCTL4)
Read: Anytime
Write: Anytime.
20.3.2.10 Timer Interrupt Enable Register (TIE)
76543210
R
EDG7B EDG7A EDG6B EDG6A EDG5B EDG5A EDG4B EDG4A
W
Reset 00000000
Figure 20-16. Timer Control Register 3 (TCTL3)
76543210
R
EDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A
W
Reset 00000000
Figure 20-17. Timer Control Register 4 (TCTL4)
Table 20-11. TCTL3/TCTL4 Field Descriptions
Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from
unavailable bits return a zero.
Field Description
7:0
EDGnB
EDGnA
Input Capture Edge Control — These eight pairs of control bits configure the input capture edge detector
circuits.
Table 20-12. Edge Detector Circuit Configuration
EDGnB EDGnA Configuration
0 0 Capture disabled
0 1 Capture on rising edges only
1 0 Capture on falling edges only
1 1 Capture on any edge (rising or falling)
76543210
R
C7I C6I C5I C4I C3I C2I C1I C0I
W
Reset 00000000
Figure 20-18. Timer Interrupt Enable Register (TIE)
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 645
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Read: Anytime
Write: Anytime.
20.3.2.11 Timer System Control Register 2 (TSCR2)
Read: Anytime
Write: Anytime.
Table 20-13. TIE Field Descriptions
Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from
unavailable bits return a zero
Field Description
7:0
C7I:C0I
Input Capture/Output Compare “x” Interrupt Enable — The bits in TIE correspond bit-for-bit with the bits in
the TFLG1 status register. If cleared, the corresponding flag is disabled from causing a hardware interrupt. If set,
the corresponding flag is enabled to cause a interrupt.
76543210
R
TOI
000
TCRE PR2 PR1 PR0
W
Reset 00000000
= Unimplemented or Reserved
Figure 20-19. Timer System Control Register 2 (TSCR2)
Table 20-14. TSCR2 Field Descriptions
Field Description
7
TOI
Timer Overflow Interrupt Enable
0 Interrupt inhibited.
1 Hardware interrupt requested when TOF flag set.
3
TCRE
Timer Counter Reset Enable — This bit allows the timer counter to be reset by a successful output compare 7
event. This mode of operation is similar to an up-counting modulus counter.
0 Counter reset inhibited and counter free runs.
1 Counter reset by a successful output compare 7.
Note: If TC7 = 0x0000 and TCRE = 1, TCNT will stay at 0x0000 continuously. If TC7 = 0xFFFF and TCRE = 1,
TOF will never be set when TCNT is reset from 0xFFFF to 0x0000.
Note: TCRE=1 and TC7!=0, the TCNT cycle period will be TC7 x "prescaler counter width" + "1 Bus Clock", for
a more detail explanation please refer to Section 20.4.3, “Output Compare
Note: This bit and feature is available only when channel 7 exists. If channel 7 doesn’t exist, this bit is reserved.
Writing to reserved bit has no effect. Read from reserved bit return a zero.
2
PR[2:0]
Timer Prescaler Select — These three bits select the frequency of the timer prescaler clock derived from the
Bus Clock as shown in Table 20-15.
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
646 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
The newly selected prescale factor will not take effect until the next
synchronized edge where all prescale counter stages equal zero.
20.3.2.12 Main Timer Interrupt Flag 1 (TFLG1)
Read: Anytime
Write: Used in the clearing mechanism (set bits cause corresponding bits to be cleared). Writing a zero
will not affect current status of the bit.
Table 20-15. Timer Clock Selection
PR2 PR1 PR0 Timer Clock
0 0 0 Bus Clock / 1
0 0 1 Bus Clock / 2
0 1 0 Bus Clock / 4
0 1 1 Bus Clock / 8
1 0 0 Bus Clock / 16
1 0 1 Bus Clock / 32
1 1 0 Bus Clock / 64
1 1 1 Bus Clock / 128
76543210
R
C7F C6F C5F C4F C3F C2F C1F C0F
W
Reset 00000000
Figure 20-20. Main Timer Interrupt Flag 1 (TFLG1)
Table 20-16. TRLG1 Field Descriptions
Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from
unavailable bits return a zero.
Field Description
7:0
C[7:0]F
Input Capture/Output Compare Channel “x” Flag — These flags are set when an input capture or output
compare event occurs. Clearing requires writing a one to the corresponding flag bit while TEN or PAEN is set to
one.
Note: When TFFCA bit in TSCR register is set, a read from an input capture or a write into an output compare
channel (0x0010–0x001F) will cause the corresponding channel flag CxF to be cleared.
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 647
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
20.3.2.13 Main Timer Interrupt Flag 2 (TFLG2)
TFLG2 indicates when interrupt conditions have occurred. To clear a bit in the flag register, write the bit
to one while TEN bit of TSCR1 or PAEN bit of PACTL is set to one.
Read: Anytime
Write: Used in clearing mechanism (set bits cause corresponding bits to be cleared).
Any access to TCNT will clear TFLG2 register if the TFFCA bit in TSCR register is set.
20.3.2.14 Timer Input Capture/Output Compare Registers High and Low 0–7
(TCxH and TCxL)
1This register is available only when the corresponding channel exists and is reserved if that channel does not exist. Writes to
a reserved register have no functional effect. Reads from a reserved register return zeroes.
76543210
R
TOF
0000000
W
Reset 00000000
Unimplemented or Reserved
Figure 20-21. Main Timer Interrupt Flag 2 (TFLG2)
Table 20-17. TRLG2 Field Descriptions
Field Description
7
TOF
Timer Overflow Flag — Set when 16-bit free-running timer overflows from 0xFFFF to 0x0000. Clearing this bit
requires writing a one to bit 7 of TFLG2 register while the TEN bit of TSCR1 or PAEN bit of PACTL is set to one
(See also TCRE control bit explanation.)
15 14 13 12 11 10 9 0
R
Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
W
Reset 00000000
Figure 20-22. Timer Input Capture/Output Compare Register x High (TCxH)
76543210
R
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
W
Reset 00000000
Figure 20-23. Timer Input Capture/Output Compare Register x Low (TCxL)
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
648 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Depending on the TIOS bit for the corresponding channel, these registers are used to latch the value of the
free-running counter when a defined transition is sensed by the corresponding input capture edge detector
or to trigger an output action for output compare.
Read: Anytime
Write: Anytime for output compare function.Writes to these registers have no meaning or effect during
input capture. All timer input capture/output compare registers are reset to 0x0000.
NOTE
Read/Write access in byte mode for high byte should takes place before low
byte otherwise it will give a different result.
20.3.2.15 16-Bit Pulse Accumulator Control Register (PACTL)
1This register is available only when channel 7 exists and is reserved if that channel does not exist. Writes to a reserved register
have no functional effect. Reads from a reserved register return zeroes.
Read: Any time
Write: Any time
When PAEN is set, the Pulse Accumulator counter is enabled.The Pulse Accumulator counter shares the
input pin with IOC7.
76543210
R0
PAEN PAMOD PEDGE CLK1 CLK0 PAOVI PAI
W
Reset 00000000
Unimplemented or Reserved
Figure 20-24. 16-Bit Pulse Accumulator Control Register (PACTL)
Table 20-18. PACTL Field Descriptions
Field Description
6
PAEN
Pulse Accumulator System Enable — PAEN is independent from TEN. With timer disabled, the pulse
accumulator can function unless pulse accumulator is disabled.
0 16-Bit Pulse Accumulator system disabled.
1 Pulse Accumulator system enabled.
5
PAMOD
Pulse Accumulator Mode — This bit is active only when the Pulse Accumulator is enabled (PAEN = 1). See
Table 20-19.
0 Event counter mode.
1 Gated time accumulation mode.
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 649
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
If the timer is not active (TEN = 0 in TSCR), there is no divide-by-64
because the ÷64 clock is generated by the timer prescaler.
For the description of PACLK please refer Figure 20-30.
If the pulse accumulator is disabled (PAEN = 0), the prescaler clock from the timer is always used as an
input clock to the timer counter. The change from one selected clock to the other happens immediately
after these bits are written.
4
PEDGE
Pulse Accumulator Edge Control — This bit is active only when the Pulse Accumulator is enabled (PAEN = 1).
For PAMOD bit = 0 (event counter mode). See Table 20-19.
0 Falling edges on IOC7 pin cause the count to be increased.
1 Rising edges on IOC7 pin cause the count to be increased.
For PAMOD bit = 1 (gated time accumulation mode).
0 IOC7 input pin high enables M (bus clock) divided by 64 clock to Pulse Accumulator and the trailing falling
edge on IOC7 sets the PAIF flag.
1 IOC7 input pin low enables M (bus clock) divided by 64 clock to Pulse Accumulator and the trailing rising edge
on IOC7 sets the PAIF flag.
3:2
CLK[1:0]
Clock Select Bits — Refer to Table 20-20.
1
PAOVI
Pulse Accumulator Overflow Interrupt Enable
0 Interrupt inhibited.
1 Interrupt requested if PAOVF is set.
0
PAI
Pulse Accumulator Input Interrupt Enable
0 Interrupt inhibited.
1 Interrupt requested if PAIF is set.
Table 20-19. Pin Action
PAMOD PEDGE Pin Action
0 0 Falling edge
0 1 Rising edge
1 0 Div. by 64 clock enabled with pin high level
1 1 Div. by 64 clock enabled with pin low level
Table 20-20. Timer Clock Selection
CLK1 CLK0 Timer Clock
0 0 Use timer prescaler clock as timer counter clock
0 1 Use PACLK as input to timer counter clock
1 0 Use PACLK/256 as timer counter clock frequency
1 1 Use PACLK/65536 as timer counter clock frequency
Table 20-18. PACTL Field Descriptions (continued)
Field Description
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
650 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
20.3.2.16 Pulse Accumulator Flag Register (PAFLG)
1This register is available only when channel 7 exists and is reserved if that channel does not exist. Writes to a reserved register
have no functional effect. Reads from a reserved register return zeroes.
Read: Anytime
Write: Anytime
When the TFFCA bit in the TSCR register is set, any access to the PACNT register will clear all the flags
in the PAFLG register. Timer module or Pulse Accumulator must stay enabled (TEN=1 or PAEN=1) while
clearing these bits.
20.3.2.17 Pulse Accumulators Count Registers (PACNT)
76543210
R000000
PAOVF PAIF
W
Reset 00000000
Unimplemented or Reserved
Figure 20-25. Pulse Accumulator Flag Register (PAFLG)
Table 20-21. PAFLG Field Descriptions
Field Description
1
PAOVF
Pulse Accumulator Overflow Flag — Set when the 16-bit pulse accumulator overflows from 0xFFFF to 0x0000.
Clearing this bit requires writing a one to this bit in the PAFLG register while TEN bit of TSCR1 or PAEN bit of
PACTL register is set to one.
0
PAIF
Pulse Accumulator Input edge Flag — Set when the selected edge is detected at the IOC7 input pin.In event
mode the event edge triggers PAIF and in gated time accumulation mode the trailing edge of the gate signal at
the IOC7 input pin triggers PAIF.
Clearing this bit requires writing a one to this bit in the PAFLG register while TEN bit of TSCR1 or PAEN bit of
PACTL register is set to one. Any access to the PACNT register will clear all the flags in this register when TFFCA
bit in register TSCR(0x0006) is set.
15 14 13 12 11 10 9 0
R
PACNT15 PACNT14 PACNT13 PACNT12 PACNT11 PACNT10 PACNT9 PACNT8
W
Reset 00000000
Figure 20-26. Pulse Accumulator Count Register High (PACNTH)
Timer Module (TIM16B8CV3)
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1This register is available only when channel 7 exists and is reserved if that channel does not exist. Writes to a reserved register
have no functional effect. Reads from a reserved register return zeroes.
Read: Anytime
Write: Anytime
These registers contain the number of active input edges on its input pin since the last reset.
When PACNT overflows from 0xFFFF to 0x0000, the Interrupt flag PAOVF in PAFLG (0x0021) is set.
Full count register access should take place in one clock cycle. A separate read/write for high byte and low
byte will give a different result than accessing them as a word.
NOTE
Reading the pulse accumulator counter registers immediately after an active
edge on the pulse accumulator input pin may miss the last count because the
input has to be synchronized with the bus clock first.
20.3.2.18 Output Compare Pin Disconnect Register(OCPD)
Read: Anytime
Write: Anytime
All bits reset to zero.
76543210
R
PACNT7 PACNT6 PACNT5 PACNT4 PACNT3 PACNT2 PACNT1 PACNT0
W
Reset 00000000
Figure 20-27. Pulse Accumulator Count Register Low (PACNTL)
76543210
R
OCPD7 OCPD6 OCPD5 OCPD4 OCPD3 OCPD2 OCPD1 OCPD0
W
Reset 00000000
Figure 20-28. Output Compare Pin Disconnect Register (OCPD)
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
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20.3.2.19 Precision Timer Prescaler Select Register (PTPSR)
Read: Anytime
Write: Anytime
All bits reset to zero.
...
The Prescaler can be calculated as follows depending on logical value of the PTPS[7:0] and PRNT bit:
PRNT = 1 : Prescaler = PTPS[7:0] + 1
Table 20-24. Precision Timer Prescaler Selection Examples when PRNT = 1
Table 20-22. OCPD Field Description
Note: Bits related to available channels have functional significance. Writing to unavailable bits has no effect. Read from
unavailable bits return a zero.
Field Description
OCPD[7:0}
Output Compare Pin Disconnect Bits
0 Enables the timer channel port. Output Compare action will occur on the channel pin. These bits do not affect
the input capture or pulse accumulator functions
1 Disables the timer channel port. Output Compare action will not occur on the channel pin, but the output
compare flag still become set.
76543210
R
PTPS7 PTPS6 PTPS5 PTPS4 PTPS3 PTPS2 PTPS1 PTPS0
W
Reset 00000000
Figure 20-29. Precision Timer Prescaler Select Register (PTPSR)
Table 20-23. PTPSR Field Descriptions
Field Description
7:0
PTPS[7:0]
Precision Timer Prescaler Select Bits — These eight bits specify the division rate of the main Timer prescaler.
These are effective only when the PRNT bit of TSCR1 is set to 1. Table 20-24 shows some selection examples
in this case.
The newly selected prescale factor will not take effect until the next synchronized edge where all prescale counter
stages equal zero.
PTPS7 PTPS6 PTPS5 PTPS4 PTPS3 PTPS2 PTPS1 PTPS0 Prescale
Factor
00000000 1
00000001 2
00000010 3
Timer Module (TIM16B8CV3)
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20.4 Functional Description
This section provides a complete functional description of the timer TIM16B8CV3 block. Please refer to
the detailed timer block diagram in Figure 20-30 as necessary.
00000011 4
-------- -
-------- -
-------- -
00010011 20
00010100 21
00010101 22
-------- -
-------- -
-------- -
11111100 253
11111101 254
11111110 255
11111111 256
PTPS7 PTPS6 PTPS5 PTPS4 PTPS3 PTPS2 PTPS1 PTPS0 Prescale
Factor
Timer Module (TIM16B8CV3)
MC9S12G Family Reference Manual, Rev.1.06
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Figure 20-30. Detailed Timer Block Diagram
PRESCALER
CHANNEL 0
IOC0 PIN
16-BIT COUNTER
LOGIC
PR[2:1:0]
DIVIDE-BY-64
TC0
EDGE
DETECT
PACNT(hi):PACNT(lo)
PAOVF PEDGE
PAOVI
TEN
PAEN
16-BIT COMPARATOR
TCNT(hi):TCNT(lo)
CHANNEL 1
TC1
16-BIT COMPARATOR
16-BIT COUNTER
INTERRUPT
LOGIC
TOF
TOI
C0F
C1F
EDGE
DETECT
IOC1 PIN
LOGIC
EDGE
DETECT
CxF
CHANNEL7
TC7
16-BIT COMPARATOR C7F
IOC7 PIN
LOGIC
EDGE
DETECT
OM:OL0
TOV0
OM:OL1
TOV1
OM:OL7
TOV7
EDG1A EDG1B
EDG7A
EDG7B
EDG0B
TCRE
PAIF
CLEAR COUNTER
PAIF
PAI
INTERRUPT
LOGIC
CxI
INTERRUPT
REQUEST
PAOVF
CH. 7 COMPARE
CH.7 CAPTURE
CH. 1 CAPTURE
MUX
CLK[1:0]
PACLK
PACLK/256
PACLK/65536
IOC1 PIN
IOC0 PIN
IOC7 PIN
PACLK
PACLK/256
PACLK/65536
TE
CH. 1 COMPARE
CH. 0COMPARE
CH. 0 CAPTURE
PA INPUT
CHANNEL2
EDG0A
channel 7 output
compare
IOC0
IOC1
IOC7
Bus Clock
PAOVF
PAOVI
TOF
C0F
C1F
C7F
MUX
PRE-PRESCALER
PTPSR[7:0]
Bus Clock
1
0
PRNT
Maximum possible channels, scalable from 0 to 7.
Pulse Accumulator is available only if channel 7 exists.
MUX
PAMOD
PEDGE
Timer Module (TIM16B8CV3)
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20.4.1 Prescaler
The prescaler divides the bus clock by 1, 2, 4, 8, 16, 32, 64 or 128. The prescaler select bits, PR[2:0], select
the prescaler divisor. PR[2:0] are in timer system control register 2 (TSCR2).
The prescaler divides the bus clock by a prescalar value. Prescaler select bits PR[2:0] of in timer system
control register 2 (TSCR2) are set to define a prescalar value that generates a divide by 1, 2, 4, 8, 16, 32,
64 and 128 when the PRNT bit in TSCR1 is disabled.
By enabling the PRNT bit of the TSCR1 register, the performance of the timer can be enhanced. In this
case, it is possible to set additional prescaler settings for the main timer counter in the present timer by
using PTPSR[7:0] bits of PTPSR register generating divide by 1, 2, 3, 4,....20, 21, 22, 23,......255, or 256.
20.4.2 Input Capture
Clearing the I/O (input/output) select bit, IOSx, configures channel x as an input capture channel. The
input capture function captures the time at which an external event occurs. When an active edge occurs on
the pin of an input capture channel, the timer transfers the value in the timer counter into the timer channel
registers, TCx.
The minimum pulse width for the input capture input is greater than two bus clocks.
An input capture on channel x sets the CxF flag. The CxI bit enables the CxF flag to generate interrupt
requests. Timer module or Pulse Accumulator must stay enabled (TEN bit of TSCR1 or PAEN bit of
PACTL register must be set to one) while clearing CxF (writing one to CxF).
20.4.3 Output Compare
Setting the I/O select bit, IOSx, configures channel x when available as an output compare channel. The
output compare function can generate a periodic pulse with a programmable polarity, duration, and
frequency. When the timer counter reaches the value in the channel registers of an output compare channel,
the timer can set, clear, or toggle the channel pin if the corresponding OCPDx bit is set to zero. An output
compare on channel x sets the CxF flag. The CxI bit enables the CxF flag to generate interrupt requests.
Timer module or Pulse Accumulator must stay enabled (TEN bit of TSCR1 or PAEN bit of PACTL register
must be set to one) while clearing CxF (writing one to CxF).
The output mode and level bits, OMx and OLx, select set, clear, toggle on output compare. Clearing both
OMx and OLx results in no output compare action on the output compare channel pin.
Setting a force output compare bit, FOCx, causes an output compare on channel x. A forced output
compare does not set the channel flag.
The following channel 7 feature is available only when channel 7 exists. A channel 7 event, which can be
a counter overflow when TTOV[7] is set or a successful output compare on channel 7, overrides output
compares on all other output compare channels. The output compare 7 mask register masks the bits in the
output compare 7 data register. The timer counter reset enable bit, TCRE, enables channel 7 output
compares to reset the timer counter. A channel 7 output compare can reset the timer counter even if the
IOC7 pin is being used as the pulse accumulator input.
Timer Module (TIM16B8CV3)
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Writing to the timer port bit of an output compare pin does not affect the pin state. The value written is
stored in an internal latch. When the pin becomes available for general-purpose output, the last value
written to the bit appears at the pin.
When TCRE is set and TC7 is not equal to 0, then TCNT will cycle from 0 to TC7. When TCNT reaches
TC7 value, it will last only one bus cycle then reset to 0.
Note: in Figure 20-31,if PR[2:0] is equal to 0, one prescaler counter equal to one bus clock
Figure 20-31. The TCNT cycle diagram under TCRE=1 condition
20.4.3.1 OC Channel Initialization
The internal register whose output drives OCx can be programmed before the timer drives OCx. The
desired state can be programmed to this internal register by writing a one to CFORCx bit with TIOSx,
OCPDx and TEN bits set to one.
Set OCx: Write a 1 to FOCx while TEN=1, IOSx=1, OMx=1, OLx=1 and OCPDx=1
Clear OCx: Write a 1 to FOCx while TEN=1, IOSx=1, OMx=1, OLx=0 and OCPDx=1
Setting OCPDx to zero allows the internal register to drive the programmed state to OCx. This allows a
glitch free switch over of port from general purpose I/O to timer output once the OCPDx bit is set to zero.
20.4.4 Pulse Accumulator
The following Pulse Accumulator feature is available only when channel 7 exists.
The pulse accumulator (PACNT) is a 16-bit counter that can operate in two modes:
Event counter mode — Counting edges of selected polarity on the pulse accumulator input pin, PAI.
Gated time accumulation mode — Counting pulses from a divide-by-64 clock. The PAMOD bit selects the
mode of operation.
The minimum pulse width for the PAI input is greater than two bus clocks.
TC7 01----- TC7-1 TC7 0
TC7 event TC7 event
prescaler
counter 1 bus
clock
Timer Module (TIM16B8CV3)
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20.4.5 Event Counter Mode
Clearing the PAMOD bit configures the PACNT for event counter operation. An active edge on the IOC7
pin increments the pulse accumulator counter. The PEDGE bit selects falling edges or rising edges to
increment the count.
NOTE
The PACNT input and timer channel 7 use the same pin IOC7. To use the
IOC7, disconnect it from the output logic by clearing the channel 7 output
mode and output level bits, OM7 and OL7. Also clear the channel 7 output
compare 7 mask bit, OC7M7.
The Pulse Accumulator counter register reflect the number of active input edges on the PACNT input pin
since the last reset.
The PAOVF bit is set when the accumulator rolls over from 0xFFFF to 0x0000. The pulse accumulator
overflow interrupt enable bit, PAOVI, enables the PAOVF flag to generate interrupt requests.
NOTE
The pulse accumulator counter can operate in event counter mode even
when the timer enable bit, TEN, is clear.
20.4.6 Gated Time Accumulation Mode
Setting the PAMOD bit configures the pulse accumulator for gated time accumulation operation. An active
level on the PACNT input pin enables a divided-by-64 clock to drive the pulse accumulator. The PEDGE
bit selects low levels or high levels to enable the divided-by-64 clock.
The trailing edge of the active level at the IOC7 pin sets the PAIF. The PAI bit enables the PAIF flag to
generate interrupt requests.
The pulse accumulator counter register reflect the number of pulses from the divided-by-64 clock since the
last reset.
NOTE
The timer prescaler generates the divided-by-64 clock. If the timer is not
active, there is no divided-by-64 clock.
20.5 Resets
The reset state of each individual bit is listed within Section 20.3, “Memory Map and Register Definition”
which details the registers and their bit fields.
20.6 Interrupts
This section describes interrupts originated by the TIM16B8CV3 block. Table 20-25 lists the interrupts
generated by the TIM16B8CV3 to communicate with the MCU.
Timer Module (TIM16B8CV3)
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The TIM16B8CV3 could use up to 11 interrupt vectors. The interrupt vector offsets and interrupt numbers
are chip dependent.
20.6.1 Channel [7:0] Interrupt (C[7:0]F)
This active high outputs will be asserted by the module to request a timer channel 7 – 0 interrupt. The TIM
block only generates the interrupt and does not service it. Only bits related to implemented channels are
valid.
20.6.2 Pulse Accumulator Input Interrupt (PAOVI)
This interrupt is available only when channel 7 exists. This active high output will be asserted by the
module to request a timer pulse accumulator input interrupt. The TIM block only generates the interrupt
and does not service it.
20.6.3 Pulse Accumulator Overflow Interrupt (PAOVF)
This interrupt is available only when channel 7 exists. This active high output will be asserted by the
module to request a timer pulse accumulator overflow interrupt. The TIM block only generates the
interrupt and does not service it.
20.6.4 Timer Overflow Interrupt (TOF)
This active high output will be asserted by the module to request a timer overflow interrupt. The TIM block
only generates the interrupt and does not service it.
Table 20-25. TIM16B8CV1 Interrupts
Interrupt Offset1
1Chip Dependent.
2 This feature is available only when channel 7 exists.
3 Bits related to available channels have functional significance
Vector1Priority1Source Description
C[7:0]F3— — — Timer Channel 7–0 Active high timer channel interrupts 7–0
PAOVI 2— — — Pulse Accumulator
Input
Active high pulse accumulator input interrupt
PAOVF 2— — — Pulse Accumulator
Overflow
Pulse accumulator overflow interrupt
TOF — — — Timer Overflow Timer Overflow interrupt
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Chapter 21
16 KByte Flash Module (S12FTMRG16K1V1)
21.1 Introduction
The FTMRG16K1 module implements the following:
• 16Kbytes of P-Flash (Program Flash) memory
• 512 bytes of EEPROM memory
The Flash memory is ideal for single-supply applications allowing for field reprogramming without
requiring external high voltage sources for program or erase operations. The Flash module includes a
memory controller that executes commands to modify Flash memory contents. The user interface to the
memory controller consists of the indexed Flash Common Command Object (FCCOB) register which is
written to with the command, global address, data, and any required command parameters. The memory
controller must complete the execution of a command before the FCCOB register can be written to with a
new command.
CAUTION
A Flash word or phrase must be in the erased state before being
programmed. Cumulative programming of bits within a Flash word or
phrase is not allowed.
Table 21-1. Revision History
Revision
Number
Revision
Date
Sections
Affected Description of Changes
V01.04 17 Jun 2010 21.4.6.1/21-689
21.4.6.2/21-690
21.4.6.3/21-690
21.4.6.14/21-70
0
Clarify Erase Verify Commands Descriptions related to the bits MGSTAT[1:0]
of the register FSTAT.
V01.05 20 aug 2010 21.4.6.2/21-690
21.4.6.12/21-69
7
21.4.6.13/21-69
9
Updated description of the commands RD1BLK, MLOADU and MLOADF
Rev.1.06 31 Jan 2011 21.3.2.9/21-675 Updated description of protection on Section 21.3.2.9
MC9S12G Family Reference Manual, Rev.1.06
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The Flash memory may be read as bytes and aligned words. Read access time is one bus cycle for bytes
and aligned words. For misaligned words access, the CPU has to perform twice the byte read access
command. For Flash memory, an erased bit reads 1 and a programmed bit reads 0.
It is possible to read from P-Flash memory while some commands are executing on EEPROM memory. It
is not possible to read from EEPROM memory while a command is executing on P-Flash memory.
Simultaneous P-Flash and EEPROM operations are discussed in Section 21.4.5.
Both P-Flash and EEPROM memories are implemented with Error Correction Codes (ECC) that can
resolve single bit faults and detect double bit faults. For P-Flash memory, the ECC implementation
requires that programming be done on an aligned 8 byte basis (a Flash phrase). Since P-Flash memory is
always read by half-phrase, only one single bit fault in an aligned 4 byte half-phrase containing the byte
or word accessed will be corrected.
21.1.1 Glossary
Command Write Sequence — An MCU instruction sequence to execute built-in algorithms (including
program and erase) on the Flash memory.
EEPROM Memory — The EEPROM memory constitutes the nonvolatile memory store for data.
EEPROM Sector — The EEPROM sector is the smallest portion of the EEPROM memory that can be
erased. The EEPROM sector consists of 4 bytes.
NVM Command Mode — An NVM mode using the CPU to setup the FCCOB register to pass parameters
required for Flash command execution.
Phrase — An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes two
sets of aligned double words with each set including 7 ECC bits for single bit fault correction and double
bit fault detection within each double word.
P-Flash Memory — The P-Flash memory constitutes the main nonvolatile memory store for applications.
P-Flash Sector — The P-Flash sector is the smallest portion of the P-Flash memory that can be erased.
Each P-Flash sector contains 512 bytes.
Program IFR — Nonvolatile information register located in the P-Flash block that contains the Version
ID, and the Program Once field.
21.1.2 Features
21.1.2.1 P-Flash Features
• 16 Kbytes of P-Flash memory composed of one 16 Kbyte Flash block divided into 32 sectors of
512 bytes
16 KByte Flash Module (S12FTMRG16K1V1)
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• Single bit fault correction and double bit fault detection within a 32-bit double word during read
operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and phrase program operation
• Ability to read the P-Flash memory while programming a word in the EEPROM memory
• Flexible protection scheme to prevent accidental program or erase of P-Flash memory
21.1.2.2 EEPROM Features
• 512 bytes of EEPROM memory composed of one 512 byte Flash block divided into 128 sectors of
4 bytes
• Single bit fault correction and double bit fault detection within a word during read operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and word program operation
• Protection scheme to prevent accidental program or erase of EEPROM memory
• Ability to program up to four words in a burst sequence
21.1.2.3 Other Flash Module Features
• No external high-voltage power supply required for Flash memory program and erase operations
• Interrupt generation on Flash command completion and Flash error detection
• Security mechanism to prevent unauthorized access to the Flash memory
21.1.3 Block Diagram
The block diagram of the Flash module is shown in Figure 21-1.
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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Figure 21-1. FTMRG16K1 Block Diagram
21.2 External Signal Description
The Flash module contains no signals that connect off-chip.
Bus
Clock
Divider
Clock
Command
Interrupt
Request
FCLK
Protection
Security
Registers
Flash
Interface
16bit
internal
bus
sector 0
sector 1
sector 31
4Kx39
P-Flash
Error
Interrupt
Request
CPU
256x22
sector 0
sector 1
sector 127
EEPROM
Memory Controller
16 KByte Flash Module (S12FTMRG16K1V1)
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21.3 Memory Map and Registers
This section describes the memory map and registers for the Flash module. Read data from unimplemented
memory space in the Flash module is undefined. Write access to unimplemented or reserved memory space
in the Flash module will be ignored by the Flash module.
CAUTION
Writing to the Flash registers while a Flash command is executing (that is
indicated when the value of flag CCIF reads as ’0’) is not allowed. If such
action is attempted the write operation will not change the register value.
Writing to the Flash registers is allowed when the Flash is not busy
executing commands (CCIF = 1) and during initialization right after reset,
despite the value of flag CCIF in that case (refer to Section 21.6 for a
complete description of the reset sequence).
.
21.3.1 Module Memory Map
The S12 architecture places the P-Flash memory between global addresses 0x3_C000 and 0x3_FFFF as
shown in Table 21-3.The P-Flash memory map is shown in Figure 21-2.
Table 21-2. FTMRG Memory Map
Global Address (in Bytes) Size
(Bytes) Description
0x0_0000 - 0x0_03FF 1,024 Register Space
0x0_0400 – 0x0_05FF 512 EEPROM Memory
0x0_0600 – 0x0_07FF 512 FTMRG reserved area
0x0_4000 – 0x0_7FFF 16,284 NVMRES1=1 : NVM Resource area (see Figure 21-3)
1See NVMRES description in Section 21.4.3
0x3_8000 – 0x3_BFFF 16,384 FTMRG reserved area
0x3_C000 – 0x3_FFFF 16,384 P-Flash Memory
Table 21-3. P-Flash Memory Addressing
Global Address Size
(Bytes) Description
0x3_C000 – 0x3_FFFF 16 K
P-Flash Block
Contains Flash Configuration Field
(see Table 21-4)
16 KByte Flash Module (S12FTMRG16K1V1)
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The FPROT register, described in Section 21.3.2.9, can be set to protect regions in the Flash memory from
accidental program or erase. Two separate memory regions, one growing downward from global address
0x3_FFFF in the Flash memory (called the higher region), and the remaining addresses in the Flash
memory, can be activated for protection. The Flash memory addresses covered by these protectable regions
are shown in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader
code since it covers the vector space. Default protection settings as well as security information that allows
the MCU to restrict access to the Flash module are stored in the Flash configuration field as described in
Table 21-4.
Figure 21-2. P-Flash Memory Map
Table 21-4. Flash Configuration Field
Global Address Size
(Bytes) Description
0x3_FF00-0x3_FF07 8
Backdoor Comparison Key
Refer to Section 21.4.6.11, “Verify Backdoor Access Key Command,” and
Section 21.5.1, “Unsecuring the MCU using Backdoor Key Access”
0x3_FF08-0x3_FF0B1
10x3FF08-0x3_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in
the 0x3_FF08 - 0x3_FF0B reserved field should be programmed to 0xFF.
4 Reserved
0x3_FF0C11P-Flash Protection byte.
Refer to Section 21.3.2.9, “P-Flash Protection Register (FPROT)”
0x3_FF0D11EEPROM Protection byte.
Refer to Section 21.3.2.10, “EEPROM Protection Register (EEPROT)”
0x3_FF0E11Flash Nonvolatile byte
Refer to Section 21.3.2.16, “Flash Option Register (FOPT)”
0x3_FF0F11Flash Security byte
Refer to Section 21.3.2.2, “Flash Security Register (FSEC)”
Flash Configuration Field
P-Flash START = 0x3_C000
P-Flash END = 0x3_FFFF
0x3_F800
0x3_F000
0x3_E000 Flash Protected/Unprotected Higher Region
2, 4, 8, 16 Kbytes
16 bytes (0x3_FF00 - 0x3_FF0F)
Protection
Protection
Movable End
Fixed End
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 665
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 21-5. Program IFR Fields
Global Address Size
(Bytes) Field Description
0x0_4000 – 0x0_4007 8 Reserved
0x0_4008 – 0x0_40B5 174 Reserved
0x0_40B6 – 0x0_40B7 2 Version ID1
1Used to track firmware patch versions, see Section 21.4.2
0x0_40B8 – 0x0_40BF 8 Reserved
0x0_40C0 – 0x0_40FF 64 Program Once Field
Refer to Section 21.4.6.6, “Program Once Command”
Table 21-6. Memory Controller Resource Fields (NVMRES1=1)
1NVMRES - See Section 21.4.3 for NVMRES (NVM Resource) detail.
Global Address Size
(Bytes) Description
0x0_4000 – 0x040FF 256 P-Flash IFR (see Table 21-5)
0x0_4100 – 0x0_41FF 256 Reserved.
0x0_4200 – 0x0_57FF Reserved
0x0_5800 – 0x0_59FF 512 Reserved
0x0_5A00 – 0x0_5FFF 1,536 Reserved
0x0_6000 – 0x0_6BFF 3,072 Reserved
0x0_6C00 – 0x0_7FFF 5,120 Reserved
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
666 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 21-3. Memory Controller Resource Memory Map (NVMRES=1)
21.3.2 Register Descriptions
The Flash module contains a set of 20 control and status registers located between Flash module base +
0x0000 and 0x0013.
In the case of the writable registers, the write accesses are forbidden during Fash command execution (for
more detail, see Caution note in Section 21.3).
A summary of the Flash module registers is given in Figure 21-4 with detailed descriptions in the
following subsections.
Address
& Name 76543210
0x0000
FCLKDIV
R FDIVLD FDIVLCK FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0
W
0x0001
FSEC
R KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0
W
0x0002
FCCOBIX
R0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0
W
Figure 21-4. FTMRG16K1 Register Summary
P-Flash IFR 1 Kbyte (NVMRES=1)
0x0_4000
RAM End = 0x0_59FF
RAM Start = 0x0_5800
Reserved 5120 bytes
Reserved 4608 bytes
0x0_6C00
0x0_7FFF
0x0_4400 Reserved 5k bytes
Reserved 512 bytes
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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0x0003
FRSV0
R00000000
W
0x0004
FCNFG
RCCIE 00
IGNSF 00
FDFD FSFD
W
0x0005
FERCNFG
R0 0 0 0 0 0 DFDIE SFDIE
W
0x0006
FSTAT
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT1 MGSTAT0
W
0x0007
FERSTAT
R0 0 0 0 0 0 DFDIF SFDIF
W
0x0008
FPROT
RFPOPEN RNV6 FPHDIS FPHS1 FPHS0 RNV2 RNV1 RNV0
W
0x0009
EEPROT
RDPOPEN 00
DPS4 DPS3 DPS2 DPS1 DPS0
W
0x000A
FCCOBHI
RCCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8
W
0x000B
FCCOBLO
RCCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0
W
0x000C
FRSV1
R00000000
W
0x000D
FRSV2
R00000000
W
0x000E
FRSV3
R00000000
W
0x000F
FRSV4
R00000000
W
0x0010
FOPT
R NV7 NV6 NV5 NV4 NV3 NV2 NV1 NV0
W
Address
& Name 76543210
Figure 21-4. FTMRG16K1 Register Summary (continued)
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
668 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.3.2.1 Flash Clock Divider Register (FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
All bits in the FCLKDIV register are readable, bit 7 is not writable, bit 6 is write-once-hi and controls the
writability of the FDIV field in normal mode. In special mode, bits 6-0 are writable any number of times
but bit 7 remains unwritable.
CAUTION
The FCLKDIV register should never be written while a Flash command is
executing (CCIF=0).
0x0011
FRSV5
R00000000
W
0x0012
FRSV6
R00000000
W
0x0013
FRSV7
R00000000
W
= Unimplemented or Reserved
Offset Module Base + 0x0000
76543210
R FDIVLD FDIVLCK FDIV[5:0]
W
Reset 00000000
= Unimplemented or Reserved
Figure 21-5. Flash Clock Divider Register (FCLKDIV)
Table 21-7. FCLKDIV Field Descriptions
Field Description
7
FDIVLD
Clock Divider Loaded
0 FCLKDIV register has not been written since the last reset
1 FCLKDIV register has been written since the last reset
Address
& Name 76543210
Figure 21-4. FTMRG16K1 Register Summary (continued)
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 669
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.3.2.2 Flash Security Register (FSEC)
The FSEC register holds all bits associated with the security of the MCU and Flash module.
6
FDIVLCK
Clock Divider Locked
0 FDIV field is open for writing
1 FDIV value is locked and cannot be changed. Once the lock bit is set high, only reset can clear this bit and
restore writability to the FDIV field in normal mode.
5–0
FDIV[5:0]
Clock Divider Bits — FDIV[5:0] must be set to effectively divide BUSCLK down to 1 MHz to control timed events
during Flash program and erase algorithms. Table 21-8 shows recommended values for FDIV[5:0] based on the
BUSCLK frequency. Please refer to Section 21.4.4, “Flash Command Operations,” for more information.
Table 21-8. FDIV values for various BUSCLK Frequencies
BUSCLK Frequency
(MHz) FDIV[5:0]
BUSCLK Frequency
(MHz) FDIV[5:0]
MIN1
1BUSCLK is Greater Than this value.
MAX2
2BUSCLK is Less Than or Equal to this value.
MIN1MAX2
1.0 1.6 0x00 16.6 17.6 0x10
1.6 2.6 0x01 17.6 18.6 0x11
2.6 3.6 0x02 18.6 19.6 0x12
3.6 4.6 0x03 19.6 20.6 0x13
4.6 5.6 0x04 20.6 21.6 0x14
5.6 6.6 0x05 21.6 22.6 0x15
6.6 7.6 0x06 22.6 23.6 0x16
7.6 8.6 0x07 23.6 24.6 0x17
8.6 9.6 0x08 24.6 25.6 0x18
9.6 10.6 0x09
10.6 11.6 0x0A
11.6 12.6 0x0B
12.6 13.6 0x0C
13.6 14.6 0x0D
14.6 15.6 0x0E
15.6 16.6 0x0F
Table 21-7. FCLKDIV Field Descriptions (continued)
Field Description
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
670 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FSEC register are readable but not writable.
During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the
Flash configuration field at global address 0x3_FF0F located in P-Flash memory (see Table 21-4) as
indicated by reset condition F in Figure 21-6. If a double bit fault is detected while reading the P-Flash
phrase containing the Flash security byte during the reset sequence, all bits in the FSEC register will be set
to leave the Flash module in a secured state with backdoor key access disabled.
Offset Module Base + 0x0001
76543210
R KEYEN[1:0] RNV[5:2] SEC[1:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 21-6. Flash Security Register (FSEC)
Table 21-9. FSEC Field Descriptions
Field Description
7–6
KEYEN[1:0]
Backdoor Key Security Enable Bits — The KEYEN[1:0] bits define the enabling of backdoor key access to the
Flash module as shown in Table 21-10.
5–2
RNV[5:2]
Reserved Nonvolatile Bits — The RNV bits should remain in the erased state for future enhancements.
1–0
SEC[1:0]
Flash Security Bits — The SEC[1:0] bits define the security state of the MCU as shown in Table 21-11. If the
Flash module is unsecured using backdoor key access, the SEC bits are forced to 10.
Table 21-10. Flash KEYEN States
KEYEN[1:0] Status of Backdoor Key Access
00 DISABLED
01 DISABLED1
1Preferred KEYEN state to disable backdoor key access.
10 ENABLED
11 DISABLED
Table 21-11. Flash Security States
SEC[1:0] Status of Security
00 SECURED
01 SECURED1
1Preferred SEC state to set MCU to secured state.
10 UNSECURED
11 SECURED
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 671
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The security function in the Flash module is described in Section 21.5.
21.3.2.3 Flash CCOB Index Register (FCCOBIX)
The FCCOBIX register is used to index the FCCOB register for Flash memory operations.
CCOBIX bits are readable and writable while remaining bits read 0 and are not writable.
21.3.2.4 Flash Reserved0 Register (FRSV0)
This Flash register is reserved for factory testing.
All bits in the FRSV0 register read 0 and are not writable.
21.3.2.5 Flash Configuration Register (FCNFG)
The FCNFG register enables the Flash command complete interrupt and forces ECC faults on Flash array
read access from the CPU.
Offset Module Base + 0x0002
76543210
R00000 CCOBIX[2:0]
W
Reset 00000000
= Unimplemented or Reserved
Figure 21-7. FCCOB Index Register (FCCOBIX)
Table 21-12. FCCOBIX Field Descriptions
Field Description
2–0
CCOBIX[1:0]
Common Command Register Index— The CCOBIX bits are used to select which word of the FCCOB register
array is being read or written to. See <st-blue>21.3.2.11 Flash Common Command Object Register (FCCOB),”
for more details.
Offset Module Base + 0x000C
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 21-8. Flash Reserved0 Register (FRSV0)
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
672 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
CCIE, IGNSF, FDFD, and FSFD bits are readable and writable while remaining bits read 0 and are not
writable.
21.3.2.6 Flash Error Configuration Register (FERCNFG)
The FERCNFG register enables the Flash error interrupts for the FERSTAT flags.
Offset Module Base + 0x0004
76543210
RCCIE 00
IGNSF 00
FDFD FSFD
W
Reset 00000000
= Unimplemented or Reserved
Figure 21-9. Flash Configuration Register (FCNFG)
Table 21-13. FCNFG Field Descriptions
Field Description
7
CCIE
Command Complete Interrupt Enable — The CCIE bit controls interrupt generation when a Flash command
has completed.
0 Command complete interrupt disabled
1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see Section 21.3.2.7)
4
IGNSF
Ignore Single Bit Fault — The IGNSF controls single bit fault reporting in the FERSTAT register (see
Section 21.3.2.8).
0 All single bit faults detected during array reads are reported
1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be
generated
1
FDFD
Force Double Bit Fault Detect — The FDFD bit allows the user to simulate a double bit fault during Flash array
read operations and check the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD.
0 Flash array read operations will set the DFDIF flag in the FERSTAT register only if a double bit fault is detected
1 Any Flash array read operation will force the DFDIF flag in the FERSTAT register to be set (see
Section 21.3.2.7) and an interrupt will be generated as long as the DFDIE interrupt enable in the FERCNFG
register is set (see Section 21.3.2.6)
0
FSFD
Force Single Bit Fault Detect —The FSFD bit allows the user to simulate a single bit fault during Flash array
read operations and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD.
0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected
1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see Section 21.3.2.7)
and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set (see
Section 21.3.2.6)
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 673
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All assigned bits in the FERCNFG register are readable and writable.
21.3.2.7 Flash Status Register (FSTAT)
The FSTAT register reports the operational status of the Flash module.
CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable
but not writable, while remaining bits read 0 and are not writable.
Offset Module Base + 0x0005
76543210
R000000
DFDIE SFDIE
W
Reset 00000000
= Unimplemented or Reserved
Figure 21-10. Flash Error Configuration Register (FERCNFG)
Table 21-14. FERCNFG Field Descriptions
Field Description
1
DFDIE
Double Bit Fault Detect Interrupt Enable — The DFDIE bit controls interrupt generation when a double bit fault
is detected during a Flash block read operation.
0 DFDIF interrupt disabled
1 An interrupt will be requested whenever the DFDIF flag is set (see Section 21.3.2.8)
0
SFDIE
Single Bit Fault Detect Interrupt Enable — The SFDIE bit controls interrupt generation when a single bit fault
is detected during a Flash block read operation.
0 SFDIF interrupt disabled whenever the SFDIF flag is set (see Section 21.3.2.8)
1 An interrupt will be requested whenever the SFDIF flag is set (see Section 21.3.2.8)
Offset Module Base + 0x0006
76543210
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT[1:0]
W
Reset 1000000
1
1Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see Section 21.6).
01
= Unimplemented or Reserved
Figure 21-11. Flash Status Register (FSTAT)
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
674 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.3.2.8 Flash Error Status Register (FERSTAT)
The FERSTAT register reflects the error status of internal Flash operations.
All flags in the FERSTAT register are readable and only writable to clear the flag.
Table 21-15. FSTAT Field Descriptions
Field Description
7
CCIF
Command Complete Interrupt Flag — The CCIF flag indicates that a Flash command has completed. The
CCIF flag is cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command
completion or command violation.
0 Flash command in progress
1 Flash command has completed
5
ACCERR
Flash Access Error Flag — The ACCERR bit indicates an illegal access has occurred to the Flash memory
caused by either a violation of the command write sequence (see Section 21.4.4.2) or issuing an illegal Flash
command. While ACCERR is set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is
cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR bit has no effect on ACCERR.
0 No access error detected
1 Access error detected
4
FPVIOL
Flash Protection Violation Flag —The FPVIOL bit indicates an attempt was made to program or erase an
address in a protected area of P-Flash or EEPROM memory during a command write sequence. The FPVIOL
bit is cleared by writing a 1 to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL
is set, it is not possible to launch a command or start a command write sequence.
0 No protection violation detected
1 Protection violation detected
3
MGBUSY
Memory Controller Busy Flag — The MGBUSY flag reflects the active state of the Memory Controller.
0 Memory Controller is idle
1 Memory Controller is busy executing a Flash command (CCIF = 0)
2
RSVD
Reserved Bit — This bit is reserved and always reads 0.
1–0
MGSTAT[1:0]
Memory Controller Command Completion Status Flag — One or more MGSTAT flag bits are set if an error
is detected during execution of a Flash command or during the Flash reset sequence. See Section 21.4.6,
“Flash Command Description,” and Section 21.6, “Initialization” for details.
Offset Module Base + 0x0007
76543210
R000000
DFDIF SFDIF
W
Reset 00000000
= Unimplemented or Reserved
Figure 21-12. Flash Error Status Register (FERSTAT)
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 675
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.3.2.9 P-Flash Protection Register (FPROT)
The FPROT register defines which P-Flash sectors are protected against program and erase operations.
The (unreserved) bits of the FPROT register are writable with the restriction that the size of the protected
region can only be increased. While the RNV[2:0] bits are writable, they should be left in an erased state.
During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte
in the Flash configuration field at global address 0x3_FF0C located in P-Flash memory (see Table 21-4)
as indicated by reset condition ‘F’ in Figure 21-13. To change the P-Flash protection that will be loaded
during the reset sequence, the upper sector of the P-Flash memory must be unprotected, then the P-Flash
protection byte must be reprogrammed. If a double bit fault is detected while reading the P-Flash phrase
containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and
remaining bits in the FPROT register will be set to leave the P-Flash memory fully protected.
Table 21-16. FERSTAT Field Descriptions
Field Description
1
DFDIF
Double Bit Fault Detect Interrupt Flag — The setting of the DFDIF flag indicates that a double bit fault was
detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation
returning invalid data was attempted on a Flash block that was under a Flash command operation.1The DFDIF
flag is cleared by writing a 1 to DFDIF. Writing a 0 to DFDIF has no effect on DFDIF.2
0 No double bit fault detected
1 Double bit fault detected or a Flash array read operation returning invalid data was attempted while command
running
1 The single bit fault and double bit fault flags are mutually exclusive for parity errors (an ECC fault occurrence can be either
single fault or double fault but never both). A simultaneous access collision (Flash array read operation returning invalid data
attempted while command running) is indicated when both SFDIF and DFDIF flags are high.
2There is a one cycle delay in storing the ECC DFDIF and SFDIF fault flags in this register. At least one NOP is required after
a flash memory read before checking FERSTAT for the occurrence of ECC errors.
0
SFDIF
Single Bit Fault Detect Interrupt Flag — With the IGNSF bit in the FCNFG register clear, the SFDIF flag
indicates that a single bit fault was detected in the stored parity and data bits during a Flash array read operation
or that a Flash array read operation returning invalid data was attempted on a Flash block that was under a Flash
command operation.1 The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on
SFDIF.
0 No single bit fault detected
1 Single bit fault detected and corrected or a Flash array read operation returning invalid data was attempted
while command running
Offset Module Base + 0x0008
76543210
RFPOPEN RNV6 FPHDIS FPHS[1:0] RNV[2:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 21-13. Flash Protection Register (FPROT)
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
676 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error
and the FPVIOL bit will be set in the FSTAT register. The block erase of a P-Flash block is not possible if
any of the P-Flash sectors contained in the same P-Flash block are protected.
Although the protection scheme is loaded from the Flash memory at global address 0x3_FF0C during the
reset sequence, it can be changed by the user. The P-Flash protection scheme can be used by applications
requiring reprogramming in single chip mode while providing as much protection as possible if
reprogramming is not required.
Table 21-17. FPROT Field Descriptions
Field Description
7
FPOPEN
Flash Protection Operation Enable — The FPOPEN bit determines the protection function for program or
erase operations as shown in Table 21-18 for the P-Flash block.
0 When FPOPEN is clear, the FPHDIS bit defines an unprotected address range as specified by the FPHS bits
1 When FPOPEN is set, the FPHDIS bit enables protection for the address range specified by the FPHS bits
6
RNV[6]
Reserved Nonvolatile Bit — The RNV bit should remain in the erased state for future enhancements.
5
FPHDIS
Flash Protection Higher Address Range Disable — The FPHDIS bit determines whether there is a
protected/unprotected area in a specific region of the P-Flash memory ending with global address 0x3_FFFF.
0 Protection/Unprotection enabled
1 Protection/Unprotection disabled
4–3
FPHS[1:0]
Flash Protection Higher Address Size — The FPHS bits determine the size of the protected/unprotected area
in P-Flash memory as shown inTable 21-19. The FPHS bits can only be written to while the FPHDIS bit is set.
2–0
RNV[2:0]
Reserved Nonvolatile Bits — These RNV bits should remain in the erased state.
Table 21-18. P-Flash Protection Function
FPOPEN FPHDIS Function1
1For range sizes, refer to Table 21-19.
1 1 No P-Flash Protection
1 0 Protected High Range
0 1 Full P-Flash Memory Protected
0 0 Unprotected High Range
Table 21-19. P-Flash Protection Higher Address Range
FPHS[1:0] Global Address Range Protected Size
00 0x3_F800–0x3_FFFF 2 Kbytes
01 0x3_F000–0x3_FFFF 4 Kbytes
10 0x3_E000–0x3_FFFF 8 Kbytes
11 0x3_C000–0x3_FFFF 16 Kbytes
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 677
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.3.2.10 EEPROM Protection Register (EEPROT)
The EEPROT register defines which EEPROM sectors are protected against program and erase operations.
The (unreserved) bits of the EEPROT register are writable with the restriction that protection can be added
but not removed. Writes must increase the DPS value and the DPOPEN bit can only be written from 1
(protection disabled) to 0 (protection enabled). If the DPOPEN bit is set, the state of the DPS bits is
irrelevant.
During the reset sequence, fields DPOPEN and DPS of the EEPROT register are loaded with the contents
of the EEPROM protection byte in the Flash configuration field at global address 0x3_FF0D located in
P-Flash memory (see Table 21-4) as indicated by reset condition F in Table 21-21. To change the
EEPROM protection that will be loaded during the reset sequence, the P-Flash sector containing the
EEPROM protection byte must be unprotected, then the EEPROM protection byte must be programmed.
If a double bit fault is detected while reading the P-Flash phrase containing the EEPROM protection byte
during the reset sequence, the DPOPEN bit will be cleared and DPS bits will be set to leave the EEPROM
memory fully protected.
Trying to alter data in any protected area in the EEPROM memory will result in a protection violation error
and the FPVIOL bit will be set in the FSTAT register. Block erase of the EEPROM memory is not possible
if any of the EEPROM sectors are protected.
Offset Module Base + 0x0009
76543210
RDPOPEN 00 DPS[4:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
00F
1F1F1F1F1
= Unimplemented or Reserved
Figure 21-14. EEPROM Protection Register (EEPROT)
Table 21-20. EEPROT Field Descriptions
Field Description
7
DPOPEN
EEPROM Protection Control
0 Enables EEPROM memory protection from program and erase with protected address range defined by DPS
bits
1 Disables EEPROM memory protection from program and erase
4–0
DPS[4:0]
EEPROM Protection Size — The DPS[4:0] bits determine the size of the protected area in the EEPROM
memory as shown inTable 21-21 .
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
678 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.3.2.11 Flash Common Command Object Register (FCCOB)
The FCCOB is an array of six words addressed via the CCOBIX index found in the FCCOBIX register.
Byte wide reads and writes are allowed to the FCCOB register.
21.3.2.11.1 FCCOB - NVM Command Mode
NVM command mode uses the indexed FCCOB register to provide a command code and its relevant
parameters to the Memory Controller. The user first sets up all required FCCOB fields and then initiates
Table 21-21. EEPROM Protection Address Range
DPS[4:0] Global Address Range Protected Size
00000 0x0_0400 – 0x0_041F 32 bytes
00001 0x0_0400 – 0x0_043F 64 bytes
00010 0x0_0400 – 0x0_045F 96 bytes
00011 0x0_0400 – 0x0_047F 128 bytes
00100 0x0_0400 – 0x0_049F 160 bytes
00101 0x0_0400 – 0x0_04BF 192 bytes
The Protection Size goes on enlarging in step of 32 bytes, for each DPS
value increasing of one.
.
.
.
01111 - to - 11111 0x0_0400 – 0x0_05FF 512 bytes
Offset Module Base + 0x000A
76543210
RCCOB[15:8]
W
Reset 00000000
Figure 21-15. Flash Common Command Object High Register (FCCOBHI)
Offset Module Base + 0x000B
76543210
RCCOB[7:0]
W
Reset 00000000
Figure 21-16. Flash Common Command Object Low Register (FCCOBLO)
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 679
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
the command’s execution by writing a 1 to the CCIF bit in the FSTAT register (a 1 written by the user clears
the CCIF command completion flag to 0). When the user clears the CCIF bit in the FSTAT register all
FCCOB parameter fields are locked and cannot be changed by the user until the command completes (as
evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the
FCCOB register array.
The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 21-22. The
return values are available for reading after the CCIF flag in the FSTAT register has been returned to 1 by
the Memory Controller. Writes to the unimplemented parameter fields (CCOBIX = 110 and CCOBIX =
111) are ignored with reads from these fields returning 0x0000.
Table 21-22 shows the generic Flash command format. The high byte of the first word in the CCOB array
contains the command code, followed by the parameters for this specific Flash command. For details on
the FCCOB settings required by each command, see the Flash command descriptions in Section 21.4.6.
21.3.2.12 Flash Reserved1 Register (FRSV1)
This Flash register is reserved for factory testing.
All bits in the FRSV1 register read 0 and are not writable.
Table 21-22. FCCOB - NVM Command Mode (Typical Usage)
CCOBIX[2:0] Byte FCCOB Parameter Fields (NVM Command Mode)
000 HI FCMD[7:0] defining Flash command
LO 6’h0, Global address [17:16]
001 HI Global address [15:8]
LO Global address [7:0]
010 HI Data 0 [15:8]
LO Data 0 [7:0]
011 HI Data 1 [15:8]
LO Data 1 [7:0]
100 HI Data 2 [15:8]
LO Data 2 [7:0]
101 HI Data 3 [15:8]
LO Data 3 [7:0]
Offset Module Base + 0x000C
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 21-17. Flash Reserved1 Register (FRSV1)
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
680 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.3.2.13 Flash Reserved2 Register (FRSV2)
This Flash register is reserved for factory testing.
All bits in the FRSV2 register read 0 and are not writable.
21.3.2.14 Flash Reserved3 Register (FRSV3)
This Flash register is reserved for factory testing.
All bits in the FRSV3 register read 0 and are not writable.
21.3.2.15 Flash Reserved4 Register (FRSV4)
This Flash register is reserved for factory testing.
All bits in the FRSV4 register read 0 and are not writable.
Offset Module Base + 0x000D
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 21-18. Flash Reserved2 Register (FRSV2)
Offset Module Base + 0x000E
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 21-19. Flash Reserved3 Register (FRSV3)
Offset Module Base + 0x000F
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 21-20. Flash Reserved4 Register (FRSV4)
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 681
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.3.2.16 Flash Option Register (FOPT)
The FOPT register is the Flash option register.
All bits in the FOPT register are readable but are not writable.
During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash
configuration field at global address 0x3_FF0E located in P-Flash memory (see Table 21-4) as indicated
by reset condition F in Figure 21-21. If a double bit fault is detected while reading the P-Flash phrase
containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT register will be set.
21.3.2.17 Flash Reserved5 Register (FRSV5)
This Flash register is reserved for factory testing.
All bits in the FRSV5 register read 0 and are not writable.
21.3.2.18 Flash Reserved6 Register (FRSV6)
This Flash register is reserved for factory testing.
Offset Module Base + 0x0010
76543210
R NV[7:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 21-21. Flash Option Register (FOPT)
Table 21-23. FOPT Field Descriptions
Field Description
7–0
NV[7:0]
Nonvolatile Bits — The NV[7:0] bits are available as nonvolatile bits. Refer to the device user guide for proper
use of the NV bits.
Offset Module Base + 0x0011
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 21-22. Flash Reserved5 Register (FRSV5)
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
682 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FRSV6 register read 0 and are not writable.
21.3.2.19 Flash Reserved7 Register (FRSV7)
This Flash register is reserved for factory testing.
All bits in the FRSV7 register read 0 and are not writable.
Offset Module Base + 0x0012
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 21-23. Flash Reserved6 Register (FRSV6)
Offset Module Base + 0x0013
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 21-24. Flash Reserved7 Register (FRSV7)
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 683
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.4 Functional Description
21.4.1 Modes of Operation
The FTMRG16K1 module provides the modes of operation normal and special . The operating mode is
determined by module-level inputs and affects the FCLKDIV, FCNFG, and EEPROT registers (see
Table 21-25).
21.4.2 IFR Version ID Word
The version ID word is stored in the IFR at address 0x0_40B6. The contents of the word are defined in
Table 21-24.
• VERNUM: Version number. The first version is number 0b_0001 with both 0b_0000 and 0b_1111
meaning ‘none’.
21.4.3 Internal NVM resource (NVMRES)
IFR is an internal NVM resource readable by CPU , when NVMRES is active. The IFR fields are shown
in Table 21-5.
The NVMRES global address map is shown in Table 21-6.
21.4.4 Flash Command Operations
Flash command operations are used to modify Flash memory contents.
The next sections describe:
• How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from
BUSCLK for Flash program and erase command operations
• The command write sequence used to set Flash command parameters and launch execution
• Valid Flash commands available for execution, according to MCU functional mode and MCU
security state.
21.4.4.1 Writing the FCLKDIV Register
Prior to issuing any Flash program or erase command after a reset, the user is required to write the
FCLKDIV register to divide BUSCLK down to a target FCLK of 1 MHz. Table 21-8 shows recommended
values for the FDIV field based on BUSCLK frequency.
Table 21-24. IFR Version ID Fields
[15:4] [3:0]
Reserved VERNUM
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
684 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
Programming or erasing the Flash memory cannot be performed if the bus
clock runs at less than 0.8 MHz. Setting FDIV too high can destroy the Flash
memory due to overstress. Setting FDIV too low can result in incomplete
programming or erasure of the Flash memory cells.
When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the
FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written,
any Flash program or erase command loaded during a command write sequence will not execute and the
ACCERR bit in the FSTAT register will set.
21.4.4.2 Command Write Sequence
The Memory Controller will launch all valid Flash commands entered using a command write sequence.
Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see
Section 21.3.2.7) and the CCIF flag should be tested to determine the status of the current command write
sequence. If CCIF is 0, the previous command write sequence is still active, a new command write
sequence cannot be started, and all writes to the FCCOB register are ignored.
21.4.4.2.1 Define FCCOB Contents
The FCCOB parameter fields must be loaded with all required parameters for the Flash command being
executed. Access to the FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX
register (see Section 21.3.2.3).
The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears
the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag
will remain clear until the Flash command has completed. Upon completion, the Memory Controller will
return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic
command write sequence is shown in Figure 21-25.
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 685
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 21-25. Generic Flash Command Write Sequence Flowchart
Write to FCCOBIX register
Write: FSTAT register (to launch command)
Clear CCIF 0x80
Clear ACCERR/FPVIOL 0x30
Write: FSTAT register
yes
no
Access Error and
Protection Violation
Read: FSTAT register
START
Check
FCCOB
ACCERR/
FPVIOL
Set?
EXIT
Write: FCLKDIV register
Read: FCLKDIV register
yes
no
FDIV
Correct?
no
Bit Polling for
Command Completion
Check
yes
CCIF Set?
to identify specific command
parameter to load.
Write to FCCOB register
to load required command parameter.
yes
no
More
Parameters?
Availability Check
Results from previous Command
Note: FCLKDIV must be
set after each reset
Read: FSTAT register
no
yes
CCIF
Set?
no
yes
CCIF
Set?
Clock Divider
Value Check Read: FSTAT register
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
686 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.4.4.3 Valid Flash Module Commands
Table 21-25 present the valid Flash commands, as enabled by the combination of the functional MCU
mode (Normal SingleChip NS, Special Singlechip SS) with the MCU security state (Unsecured, Secured).
Special Singlechip mode is selected by input mmc_ss_mode_ts2 asserted. MCU Secured state is selected
by input mmc_secure input asserted.
+
21.4.4.4 P-Flash Commands
Table 21-26 summarizes the valid P-Flash commands along with the effects of the commands on the
P-Flash block and other resources within the Flash module.
Table 21-25. Flash Commands by Mode and Security State
FCMD Command
Unsecured Secured
NS1
1Unsecured Normal Single Chip mode
SS2
2Unsecured Special Single Chip mode.
NS3
3Secured Normal Single Chip mode.
SS4
4Secured Special Single Chip mode.
0x01 Erase Verify All Blocks ∗∗∗∗
0x02 Erase Verify Block ∗∗∗∗
0x03 Erase Verify P-Flash Section ∗∗∗
0x04 Read Once ∗∗∗
0x06 Program P-Flash ∗∗∗
0x07 Program Once ∗∗∗
0x08 Erase All Blocks ∗∗
0x09 Erase Flash Block ∗∗∗
0x0A Erase P-Flash Sector ∗∗∗
0x0B Unsecure Flash ∗∗
0x0C Verify Backdoor Access Key ∗∗
0x0D Set User Margin Level ∗∗∗
0x0E Set Field Margin Level ∗
0x10 Erase Verify EEPROM Section ∗∗∗
0x11 Program EEPROM ∗∗∗
0x12 Erase EEPROM Sector ∗∗∗
Table 21-26. P-Flash Commands
FCMD Command Function on P-Flash Memory
0x01 Erase Verify All
Blocks
Verify that all P-Flash (and EEPROM) blocks are erased.
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 687
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.4.4.5 EEPROM Commands
Table 21-27 summarizes the valid EEPROM commands along with the effects of the commands on the
EEPROM block.
0x02 Erase Verify Block Verify that a P-Flash block is erased.
0x03 Erase Verify
P-Flash Section
Verify that a given number of words starting at the address provided are erased.
0x04 Read Once Read a dedicated 64 byte field in the nonvolatile information register in P-Flash block that
was previously programmed using the Program Once command.
0x06 Program P-Flash Program a phrase in a P-Flash block.
0x07 Program Once Program a dedicated 64 byte field in the nonvolatile information register in P-Flash block
that is allowed to be programmed only once.
0x08 Erase All Blocks
Erase all P-Flash (and EEPROM) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN
bits in the FPROT register and the DPOPEN bit in the EEPROT register are set prior to
launching the command.
0x09 Erase Flash Block
Erase a P-Flash (or EEPROM) block.
An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN
bits in the FPROT register are set prior to launching the command.
0x0A Erase P-Flash
Sector
Erase all bytes in a P-Flash sector.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all P-Flash (and EEPROM)
blocks and verifying that all P-Flash (and EEPROM) blocks are erased.
0x0C Verify Backdoor
Access Key
Supports a method of releasing MCU security by verifying a set of security keys.
0x0D Set User Margin
Level
Specifies a user margin read level for all P-Flash blocks.
0x0E Set Field Margin
Level
Specifies a field margin read level for all P-Flash blocks (special modes only).
Table 21-27. EEPROM Commands
FCMD Command Function on EEPROM Memory
0x01 Erase Verify All
Blocks
Verify that all EEPROM (and P-Flash) blocks are erased.
0x02 Erase Verify Block Verify that the EEPROM block is erased.
Table 21-26. P-Flash Commands
FCMD Command Function on P-Flash Memory
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
688 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.4.5 Allowed Simultaneous P-Flash and EEPROM Operations
Only the operations marked ‘OK’ in Table 21-28 are permitted to be run simultaneously on the Program
Flash and EEPROM blocks. Some operations cannot be executed simultaneously because certain hardware
resources are shared by the two memories. The priority has been placed on permitting Program Flash reads
while program and erase operations execute on the EEPROM, providing read (P-Flash) while write
(EEPROM) functionality.
0x08 Erase All Blocks
Erase all EEPROM (and P-Flash) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN
bits in the FPROT register and the DPOPEN bit in the EEPROT register are set prior to
launching the command.
0x09 Erase Flash Block
Erase a EEPROM (or P-Flash) block.
An erase of the full EEPROM block is only possible when DPOPEN bit in the EEPROT
register is set prior to launching the command.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all EEPROM (and P-Flash)
blocks and verifying that all EEPROM (and P-Flash) blocks are erased.
0x0D Set User Margin
Level
Specifies a user margin read level for the EEPROM block.
0x0E Set Field Margin
Level
Specifies a field margin read level for the EEPROM block (special modes only).
0x10 Erase Verify
EEPROM Section
Verify that a given number of words starting at the address provided are erased.
0x11 Program
EEPROM
Program up to four words in the EEPROM block.
0x12 Erase EEPROM
Sector
Erase all bytes in a sector of the EEPROM block.
Table 21-28. Allowed P-Flash and EEPROM Simultaneous Operations
EEPROM
Program Flash Read Margin
Read1Program Sector
Erase
Mass
Erase2
Read OK OK OK
Margin Read1
1A ‘Margin Read’ is any read after executing the margin setting commands
‘Set User Margin Level’ or ‘Set Field Margin Level’ with anything but the
‘normal’ level specified. See the Note on margin settings in Section 21.4.6.12
and Section 21.4.6.13.
Program
Sector Erase
Mass Erase2
2The ‘Mass Erase’ operations are commands ‘Erase All Blocks’ and ‘Erase
Flash Block’
OK
Table 21-27. EEPROM Commands
FCMD Command Function on EEPROM Memory
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 689
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.4.6 Flash Command Description
This section provides details of all available Flash commands launched by a command write sequence. The
ACCERR bit in the FSTAT register will be set during the command write sequence if any of the following
illegal steps are performed, causing the command not to be processed by the Memory Controller:
• Starting any command write sequence that programs or erases Flash memory before initializing the
FCLKDIV register
• Writing an invalid command as part of the command write sequence
• For additional possible errors, refer to the error handling table provided for each command
If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation
will return invalid data if both flags SFDIF and DFDIF are set. If the SFDIF or DFDIF flags were not
previously set when the invalid read operation occurred, both the SFDIF and DFDIF flags will be set.
If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting
any command write sequence (see Section 21.3.2.7).
CAUTION
A Flash word or phrase must be in the erased state before being
programmed. Cumulative programming of bits within a Flash word or
phrase is not allowed.
21.4.6.1 Erase Verify All Blocks Command
The Erase Verify All Blocks command will verify that all P-Flash and EEPROM blocks have been erased.
Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify
that the entire Flash memory space is erased. The CCIF flag will set after the Erase Verify All Blocks
operation has completed. If all blocks are not erased, it means blank check failed, both MGSTAT bits will
be set.
Table 21-29. Erase Verify All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x01 Not required
Table 21-30. Erase Verify All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read1or if blank check failed .
1As found in the memory map for FTMRG32K1.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
690 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.4.6.2 Erase Verify Block Command
The Erase Verify Block command allows the user to verify that an entire P-Flash or EEPROM block has
been erased. The FCCOB FlashBlockSelectionCode[1:0] bits determine which block must be verified.
Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that
the selected P-Flash or EEPROM block is erased. The CCIF flag will set after the Erase Verify Block
operation has completed.If the block is not erased, it means blank check failed, both MGSTAT bits will be
set.
21.4.6.3 Erase Verify P-Flash Section Command
The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is
erased. The Erase Verify P-Flash Section command defines the starting point of the code to be verified and
the number of phrases.
Table 21-31. Erase Verify Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x02
Flash block
selection code [1:0]. See
Table 21-32
Table 21-32. Flash block selection code description
Selection code[1:0] Flash block to be verified
00 EEPROM
01 Invalid (ACCERR)
10 Invalid (ACCERR)
11 P-Flash
Table 21-33. Erase Verify Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if an invalid FlashBlockSelectionCode[1:0] is supplied1
1As defined by the memory map for FTMRG32K1.
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read2or if blank check failed.
2As found in the memory map for FTMRG32K1.
MGSTAT0 Set if any non-correctable errors have been encountered during the read2 or if
blank check failed.
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 691
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will
verify the selected section of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash
Section operation has completed. If the section is not erased, it means blank check failed, both MGSTAT
bits will be set.
21.4.6.4 Read Once Command
The Read Once command provides read access to a reserved 64 byte field (8 phrases) located in the
nonvolatile information register of P-Flash. The Read Once field is programmed using the Program Once
command described in Section 21.4.6.6. The Read Once command must not be executed from the Flash
block containing the Program Once reserved field to avoid code runaway.
Table 21-34. Erase Verify P-Flash Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x03 Global address [17:16] of
a P-Flash block
001 Global address [15:0] of the first phrase to be verified
010 Number of phrases to be verified
Table 21-35. Erase Verify P-Flash Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 21-25)
Set if an invalid global address [17:0] is supplied see Table 21-3)1
1As defined by the memory map for FTMRG32K1.
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
Set if the requested section crosses a the P-Flash address boundary
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read2or if blank check failed.
2As found in the memory map for FTMRG32K1.
MGSTAT0 Set if any non-correctable errors have been encountered during the read2 or if
blank check failed.
Table 21-36. Read Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x04 Not Required
001 Read Once phrase index (0x0000 - 0x0007)
010 Read Once word 0 value
011 Read Once word 1 value
100 Read Once word 2 value
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
692 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the
FCCOB indexed register. The CCIF flag will set after the Read Once operation has completed. Valid
phrase index values for the Read Once command range from 0x0000 to 0x0007. During execution of the
Read Once command, any attempt to read addresses within P-Flash block will return invalid data.
8
21.4.6.5 Program P-Flash Command
The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an
embedded algorithm.
CAUTION
A P-Flash phrase must be in the erased state before being programmed.
Cumulative programming of bits within a Flash phrase is not allowed.
Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the
data words to the supplied global address and will then proceed to verify the data words read back as
expected. The CCIF flag will set after the Program P-Flash operation has completed.
101 Read Once word 3 value
Table 21-37. Read Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 21-25)
Set if an invalid phrase index is supplied
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read
MGSTAT0 Set if any non-correctable errors have been encountered during the read
Table 21-38. Program P-Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x06 Global address [17:16] to
identify P-Flash block
001 Global address [15:0] of phrase location to be programmed1
1Global address [2:0] must be 000
010 Word 0 program value
011 Word 1 program value
100 Word 2 program value
101 Word 3 program value
Table 21-36. Read Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 693
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.4.6.6 Program Once Command
The Program Once command restricts programming to a reserved 64 byte field (8 phrases) in the
nonvolatile information register located in P-Flash. The Program Once reserved field can be read using the
Read Once command as described in Section 21.4.6.4. The Program Once command must only be issued
once since the nonvolatile information register in P-Flash cannot be erased. The Program Once command
must not be executed from the Flash block containing the Program Once reserved field to avoid code
runaway.
Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the
selected phrase is erased. If erased, then the selected phrase will be programmed and then verified with
read back. The CCIF flag will remain clear, setting only after the Program Once operation has completed.
The reserved nonvolatile information register accessed by the Program Once command cannot be erased
and any attempt to program one of these phrases a second time will not be allowed. Valid phrase index
values for the Program Once command range from 0x0000 to 0x0007. During execution of the Program
Once command, any attempt to read addresses within P-Flash will return invalid data.
Table 21-39. Program P-Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 21-25)
Set if an invalid global address [17:0] is supplied see Table 21-3)1
1As defined by the memory map for FTMRG32K1.
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the global address [17:0] points to a protected area
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 21-40. Program Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x07 Not Required
001 Program Once phrase index (0x0000 - 0x0007)
010 Program Once word 0 value
011 Program Once word 1 value
100 Program Once word 2 value
101 Program Once word 3 value
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
694 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.4.6.7 Erase All Blocks Command
The Erase All Blocks operation will erase the entire P-Flash and EEPROM memory space.
Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire
Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash
memory space was properly erased, security will be released. During the execution of this command
(CCIF=0) the user must not write to any Flash module register. The CCIF flag will set after the Erase All
Blocks operation has completed.
21.4.6.8 Erase Flash Block Command
The Erase Flash Block operation will erase all addresses in a P-Flash or EEPROM block.
Table 21-41. Program Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 21-25)
Set if an invalid phrase index is supplied
Set if the requested phrase has already been programmed1
1If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will
be allowed to execute again on that same phrase.
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 21-42. Erase All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x08 Not required
Table 21-43. Erase All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 21-25)
FPVIOL Set if any area of the P-Flash or EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation1
1As found in the memory map for FTMRG32K1.
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation1
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 695
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Erase Flash Block command, the Memory Controller will erase the
selected Flash block and verify that it is erased. The CCIF flag will set after the Erase Flash Block
operation has completed.
21.4.6.9 Erase P-Flash Sector Command
The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector.
Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the
selected Flash sector and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash
Sector operation has completed.
Table 21-44. Erase Flash Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x09 Global address [17:16] to
identify Flash block
001 Global address [15:0] in Flash block to be erased
Table 21-45. Erase Flash Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 21-25)
Set if an invalid global address [17:16] is supplied1
1As defined by the memory map for FTMRG32K1.
Set if the supplied P-Flash address is not phrase-aligned or if the EEPROM
address is not word-aligned
FPVIOL Set if an area of the selected Flash block is protected
MGSTAT1 Set if any errors have been encountered during the verify operation2
2As found in the memory map for FTMRG32K1.
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation2
Table 21-46. Erase P-Flash Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0A Global address [17:16] to identify
P-Flash block to be erased
001 Global address [15:0] anywhere within the sector to be erased.
Refer to Section 21.1.2.1 for the P-Flash sector size.
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
696 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.4.6.10 Unsecure Flash Command
The Unsecure Flash command will erase the entire P-Flash and EEPROM memory space and, if the erase
is successful, will release security.
Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire
P-Flash and EEPROM memory space and verify that it is erased. If the Memory Controller verifies that
the entire Flash memory space was properly erased, security will be released. If the erase verify is not
successful, the Unsecure Flash operation sets MGSTAT1 and terminates without changing the security
state. During the execution of this command (CCIF=0) the user must not write to any Flash module
register. The CCIF flag is set after the Unsecure Flash operation has completed.
Table 21-47. Erase P-Flash Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 21-25)
Set if an invalid global address [17:16] is supplied see Table 21-3)1
1As defined by the memory map for FTMRG32K1.
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the selected P-Flash sector is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 21-48. Unsecure Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0B Not required
Table 21-49. Unsecure Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 21-25)
FPVIOL Set if any area of the P-Flash or EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation1
1As found in the memory map for FTMRG32K1.
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation1
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 697
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.4.6.11 Verify Backdoor Access Key Command
The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the
FSEC register (see Table 21-10). The Verify Backdoor Access Key command releases security if
user-supplied keys match those stored in the Flash security bytes of the Flash configuration field (see
Table 21-4). The Verify Backdoor Access Key command must not be executed from the Flash block
containing the backdoor comparison key to avoid code runaway.
Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will
check the FSEC KEYEN bits to verify that this command is enabled. If not enabled, the Memory
Controller sets the ACCERR bit in the FSTAT register and terminates. If the command is enabled, the
Memory Controller compares the key provided in FCCOB to the backdoor comparison key in the Flash
configuration field with Key 0 compared to 0x3_FF00, etc. If the backdoor keys match, security will be
released. If the backdoor keys do not match, security is not released and all future attempts to execute the
Verify Backdoor Access Key command are aborted (set ACCERR) until a reset occurs. The CCIF flag is
set after the Verify Backdoor Access Key operation has completed.
21.4.6.12 Set User Margin Level Command
The Set User Margin Level command causes the Memory Controller to set the margin level for future read
operations of the P-Flash or EEPROM block.
Table 21-50. Verify Backdoor Access Key Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0C Not required
001 Key 0
010 Key 1
011 Key 2
100 Key 3
Table 21-51. Verify Backdoor Access Key Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 100 at command launch
Set if an incorrect backdoor key is supplied
Set if backdoor key access has not been enabled (KEYEN[1:0] != 10, see
Section 21.3.2.2)
Set if the backdoor key has mismatched since the last reset
FPVIOL None
MGSTAT1 None
MGSTAT0 None
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
698 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the
user margin level for the targeted block and then set the CCIF flag.
NOTE
When the EEPROM block is targeted, the EEPROM user margin levels are
applied only to the EEPROM reads. However, when the P-Flash block is
targeted, the P-Flash user margin levels are applied to both P-Flash and
EEPROM reads. It is not possible to apply user margin levels to the P-Flash
block only.
Valid margin level settings for the Set User Margin Level command are defined in Table 21-53.
Table 21-52. Set User Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0D Flash block selection code [1:0]. See
Table 21-32
001 Margin level setting.
Table 21-53. Valid Set User Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level1
1Read margin to the erased state
0x0002 User Margin-0 Level2
2Read margin to the programmed state
Table 21-54. Set User Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 21-25)
Set if an invalid FlashBlockSelectionCode[1:0] is supplied (See Table 21-32 )
Set if an invalid margin level setting is supplied
FPVIOL None
MGSTAT1 None
MGSTAT0 None
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 699
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
User margin levels can be used to check that Flash memory contents have
adequate margin for normal level read operations. If unexpected results are
encountered when checking Flash memory contents at user margin levels, a
potential loss of information has been detected.
21.4.6.13 Set Field Margin Level Command
The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set
the margin level specified for future read operations of the P-Flash or EEPROM block.
Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the
field margin level for the targeted block and then set the CCIF flag.
NOTE
When the EEPROM block is targeted, the EEPROM field margin levels are
applied only to the EEPROM reads. However, when the P-Flash block is
targeted, the P-Flash field margin levels are applied to both P-Flash and
EEPROM reads. It is not possible to apply field margin levels to the P-Flash
block only.
Valid margin level settings for the Set Field Margin Level command are defined in Table 21-56.
Table 21-55. Set Field Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0E Flash block selection code [1:0]. See
Table 21-32
001 Margin level setting.
Table 21-56. Valid Set Field Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level1
1Read margin to the erased state
0x0002 User Margin-0 Level2
2Read margin to the programmed state
0x0003 Field Margin-1 Level1
0x0004 Field Margin-0 Level2
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
700 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
CAUTION
Field margin levels must only be used during verify of the initial factory
programming.
NOTE
Field margin levels can be used to check that Flash memory contents have
adequate margin for data retention at the normal level setting. If unexpected
results are encountered when checking Flash memory contents at field
margin levels, the Flash memory contents should be erased and
reprogrammed.
21.4.6.14 Erase Verify EEPROM Section Command
The Erase Verify EEPROM Section command will verify that a section of code in the EEPROM is erased.
The Erase Verify EEPROM Section command defines the starting point of the data to be verified and the
number of words.
Upon clearing CCIF to launch the Erase Verify EEPROM Section command, the Memory Controller will
verify the selected section of EEPROM memory is erased. The CCIF flag will set after the Erase Verify
EEPROM Section operation has completed. If the section is not erased, it means blank check failed, both
MGSTAT bits will be set.
Table 21-57. Set Field Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 21-25)
Set if an invalid FlashBlockSelectionCode[1:0] is supplied (See Table 21-32 )1
1As defined by the memory map for FTMRG32K1.
Set if an invalid margin level setting is supplied
FPVIOL None
MGSTAT1 None
MGSTAT0 None
Table 21-58. Erase Verify EEPROM Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x10
Global address [17:16] to
identify the EEPROM
block
001 Global address [15:0] of the first word to be verified
010 Number of words to be verified
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 701
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.4.6.15 Program EEPROM Command
The Program EEPROM operation programs one to four previously erased words in the EEPROM block.
The Program EEPROM operation will confirm that the targeted location(s) were successfully programmed
upon completion.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
Upon clearing CCIF to launch the Program EEPROM command, the user-supplied words will be
transferred to the Memory Controller and be programmed if the area is unprotected. The CCOBIX index
value at Program EEPROM command launch determines how many words will be programmed in the
EEPROM block. The CCIF flag is set when the operation has completed.
Table 21-59. Erase Verify EEPROM Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 21-25)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested section breaches the end of the EEPROM block
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
Table 21-60. Program EEPROM Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x11 Global address [17:16] to
identify the EEPROM block
001 Global address [15:0] of word to be programmed
010 Word 0 program value
011 Word 1 program value, if desired
100 Word 2 program value, if desired
101 Word 3 program value, if desired
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
702 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.4.6.16 Erase EEPROM Sector Command
The Erase EEPROM Sector operation will erase all addresses in a sector of the EEPROM block.
Upon clearing CCIF to launch the Erase EEPROM Sector command, the Memory Controller will erase the
selected Flash sector and verify that it is erased. The CCIF flag will set after the Erase EEPROM Sector
operation has completed.
Table 21-61. Program EEPROM Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] < 010 at command launch
Set if CCOBIX[2:0] > 101 at command launch
Set if command not available in current mode (see Table 21-25)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested group of words breaches the end of the EEPROM block
FPVIOL Set if the selected area of the EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 21-62. Erase EEPROM Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x12 Global address [17:16] to identify
EEPROM block
001 Global address [15:0] anywhere within the sector to be erased.
See Section 21.1.2.2 for EEPROM sector size.
Table 21-63. Erase EEPROM Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 21-25)
Set if an invalid global address [17:0] is suppliedsee Table 21-3)
Set if a misaligned word address is supplied (global address [0] != 0)
FPVIOL Set if the selected area of the EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 703
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.4.7 Interrupts
The Flash module can generate an interrupt when a Flash command operation has completed or when a
Flash command operation has detected an ECC fault.
NOTE
Vector addresses and their relative interrupt priority are determined at the
MCU level.
21.4.7.1 Description of Flash Interrupt Operation
The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the
Flash command interrupt request. The Flash module uses the DFDIF and SFDIF flags in combination with
the DFDIE and SFDIE interrupt enable bits to generate the Flash error interrupt request. For a detailed
description of the register bits involved, refer to Section 21.3.2.5, “Flash Configuration Register
(FCNFG)”, Section 21.3.2.6, “Flash Error Configuration Register (FERCNFG)”, Section 21.3.2.7, “Flash
Status Register (FSTAT)”, and Section 21.3.2.8, “Flash Error Status Register (FERSTAT)”.
The logic used for generating the Flash module interrupts is shown in Figure 21-26.
Figure 21-26. Flash Module Interrupts Implementation
Table 21-64. Flash Interrupt Sources
Interrupt Source Interrupt Flag Local Enable Global (CCR)
Mask
Flash Command Complete CCIF
(FSTAT register)
CCIE
(FCNFG register)
I Bit
ECC Double Bit Fault on Flash Read DFDIF
(FERSTAT register)
DFDIE
(FERCNFG register)
I Bit
ECC Single Bit Fault on Flash Read SFDIF
(FERSTAT register)
SFDIE
(FERCNFG register)
I Bit
Flash Error Interrupt Request
CCIF
CCIE
DFDIF
DFDIE
SFDIF
SFDIE
Flash Command Interrupt Request
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
704 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
21.4.8 Wait Mode
The Flash module is not affected if the MCU enters wait mode. The Flash module can recover the MCU
from wait via the CCIF interrupt (see Section 21.4.7, “Interrupts”).
21.4.9 Stop Mode
If a Flash command is active (CCIF = 0) when the MCU requests stop mode, the current Flash operation
will be completed before the MCU is allowed to enter stop mode.
21.5 Security
The Flash module provides security information to the MCU. The Flash security state is defined by the
SEC bits of the FSEC register (see Table 21-11). During reset, the Flash module initializes the FSEC
register using data read from the security byte of the Flash configuration field at global address 0x3_FF0F.
The security state out of reset can be permanently changed by programming the security byte assuming
that the MCU is starting from a mode where the necessary P-Flash erase and program commands are
available and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully
programmed, its new value will take affect after the next MCU reset.
The following subsections describe these security-related subjects:
• Unsecuring the MCU using Backdoor Key Access
• Unsecuring the MCU in Special Single Chip Mode using BDM
• Mode and Security Effects on Flash Command Availability
21.5.1 Unsecuring the MCU using Backdoor Key Access
The MCU may be unsecured by using the backdoor key access feature which requires knowledge of the
contents of the backdoor keys (four 16-bit words programmed at addresses 0x3_FF00-0x3_FF07). If the
KEYEN[1:0] bits are in the enabled state (see Section 21.3.2.2), the Verify Backdoor Access Key
command (see Section 21.4.6.11) allows the user to present four prospective keys for comparison to the
keys stored in the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor
Access Key command match the backdoor keys stored in the Flash memory, the SEC bits in the FSEC
register (see Table 21-11) will be changed to unsecure the MCU. Key values of 0x0000 and 0xFFFF are
not permitted as backdoor keys. While the Verify Backdoor Access Key command is active, P-Flash
memory and EEPROM memory will not be available for read access and will return invalid data.
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 705
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an
external stimulus. This external stimulus would typically be through one of the on-chip serial ports.
If the KEYEN[1:0] bits are in the enabled state (see Section 21.3.2.2), the MCU can be unsecured by the
backdoor key access sequence described below:
1. Follow the command sequence for the Verify Backdoor Access Key command as explained in
Section 21.4.6.11
2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the
SEC[1:0] bits in the FSEC register are forced to the unsecure state of 10
The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will
prohibit future use of the Verify Backdoor Access Key command. A reset of the MCU is the only method
to re-enable the Verify Backdoor Access Key command. The security as defined in the Flash security byte
(0x3_FF0F) is not changed by using the Verify Backdoor Access Key command sequence. The backdoor
keys stored in addresses 0x3_FF00-0x3_FF07 are unaffected by the Verify Backdoor Access Key
command sequence. The Verify Backdoor Access Key command sequence has no effect on the program
and erase protections defined in the Flash protection register, FPROT.
After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is
unsecured, the sector containing the Flash security byte can be erased and the Flash security byte can be
reprogrammed to the unsecure state, if desired. In the unsecure state, the user has full control of the
contents of the backdoor keys by programming addresses 0x3_FF00-0x3_FF07 in the Flash configuration
field.
21.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM
A secured MCU can be unsecured in special single chip mode by using the following method to erase the
P-Flash and EEPROM memory:
1. Reset the MCU into special single chip mode
2. Delay while the BDM executes the Erase Verify All Blocks command write sequence to check if
the P-Flash and EEPROM memories are erased
3. Send BDM commands to disable protection in the P-Flash and EEPROM memory
4. Execute the Erase All Blocks command write sequence to erase the P-Flash and EEPROM
memory. Alternatively the Unsecure Flash command can be executed, if so the steps 5 and 6 below
are skeeped.
5. After the CCIF flag sets to indicate that the Erase All Blocks operation has completed, reset the
MCU into special single chip mode
6. Delay while the BDM executes the Erase Verify All Blocks command write sequence to verify that
the P-Flash and EEPROM memory are erased
If the P-Flash and EEPROM memory are verified as erased, the MCU will be unsecured. All BDM
commands will now be enabled and the Flash security byte may be programmed to the unsecure state by
continuing with the following steps:
7. Send BDM commands to execute the Program P-Flash command write sequence to program the
Flash security byte to the unsecured state
16 KByte Flash Module (S12FTMRG16K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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8. Reset the MCU
21.5.3 Mode and Security Effects on Flash Command Availability
The availability of Flash module commands depends on the MCU operating mode and security state as
shown in Table 21-25.
21.6 Initialization
On each system reset the flash module executes an initialization sequence which establishes initial values
for the Flash Block Configuration Parameters, the FPROT and EEPROT protection registers, and the FOPT
and FSEC registers. The initialization routine reverts to built-in default values that leave the module in a
fully protected and secured state if errors are encountered during execution of the reset sequence. If a
double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT register will be set.
CCIF is cleared throughout the initialization sequence. The Flash module holds off all CPU access for a
portion of the initialization sequence. Flash reads are allowed once the hold is removed. Completion of the
initialization sequence is marked by setting CCIF high which enables user commands.
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The
state of the word being programmed or the sector/block being erased is not guaranteed.
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Chapter 22
32 KByte Flash Module (S12FTMRG32K1V1)
22.1 Introduction
The FTMRG32K1 module implements the following:
• 32Kbytes of P-Flash (Program Flash) memory
• 1 Kbytes of EEPROM memory
The Flash memory is ideal for single-supply applications allowing for field reprogramming without
requiring external high voltage sources for program or erase operations. The Flash module includes a
memory controller that executes commands to modify Flash memory contents. The user interface to the
memory controller consists of the indexed Flash Common Command Object (FCCOB) register which is
written to with the command, global address, data, and any required command parameters. The memory
controller must complete the execution of a command before the FCCOB register can be written to with a
new command.
CAUTION
A Flash word or phrase must be in the erased state before being
programmed. Cumulative programming of bits within a Flash word or
phrase is not allowed.
Table 22-1. Revision History
Revision
Number
Revision
Date
Sections
Affected Description of Changes
V01.04 17 Jun 2010 22.4.6.1/22-740
22.4.6.2/22-741
22.4.6.3/22-741
22.4.6.14/22-75
1
Clarify Erase Verify Commands Descriptions related to the bits MGSTAT[1:0]
of the register FSTAT.
V01.05 20 aug 2010 22.4.6.2/22-741
22.4.6.12/22-74
8
22.4.6.13/22-75
0
Updated description of the commands RD1BLK, MLOADU and MLOADF
Rev.1.06 31 Jan 2011 22.3.2.9/22-723 Updated description of protection on Section 22.3.2.9
MC9S12G Family Reference Manual, Rev.1.06
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The Flash memory may be read as bytes and aligned words. Read access time is one bus cycle for bytes
and aligned words. For misaligned words access, the CPU has to perform twice the byte read access
command. For Flash memory, an erased bit reads 1 and a programmed bit reads 0.
It is possible to read from P-Flash memory while some commands are executing on EEPROM memory. It
is not possible to read from EEPROM memory while a command is executing on P-Flash memory.
Simultaneous P-Flash and EEPROM operations are discussed in Section 22.4.5.
Both P-Flash and EEPROM memories are implemented with Error Correction Codes (ECC) that can
resolve single bit faults and detect double bit faults. For P-Flash memory, the ECC implementation
requires that programming be done on an aligned 8 byte basis (a Flash phrase). Since P-Flash memory is
always read by half-phrase, only one single bit fault in an aligned 4 byte half-phrase containing the byte
or word accessed will be corrected.
22.1.1 Glossary
Command Write Sequence — An MCU instruction sequence to execute built-in algorithms (including
program and erase) on the Flash memory.
EEPROM Memory — The EEPROM memory constitutes the nonvolatile memory store for data.
EEPROM Sector — The EEPROM sector is the smallest portion of the EEPROM memory that can be
erased. The EEPROM sector consists of 4 bytes.
NVM Command Mode — An NVM mode using the CPU to setup the FCCOB register to pass parameters
required for Flash command execution.
Phrase — An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes two
sets of aligned double words with each set including 7 ECC bits for single bit fault correction and double
bit fault detection within each double word.
P-Flash Memory — The P-Flash memory constitutes the main nonvolatile memory store for applications.
P-Flash Sector — The P-Flash sector is the smallest portion of the P-Flash memory that can be erased.
Each P-Flash sector contains 512 bytes.
Program IFR — Nonvolatile information register located in the P-Flash block that contains the Version
ID, and the Program Once field.
22.1.2 Features
22.1.2.1 P-Flash Features
• 32 Kbytes of P-Flash memory composed of one 32 Kbyte Flash block divided into 64 sectors of
512 bytes
32 KByte Flash Module (S12FTMRG32K1V1)
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• Single bit fault correction and double bit fault detection within a 32-bit double word during read
operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and phrase program operation
• Ability to read the P-Flash memory while programming a word in the EEPROM memory
• Flexible protection scheme to prevent accidental program or erase of P-Flash memory
22.1.2.2 EEPROM Features
• 1 Kbyte of EEPROM memory composed of one 1 Kbyte Flash block divided into 256 sectors of 4
bytes
• Single bit fault correction and double bit fault detection within a word during read operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and word program operation
• Protection scheme to prevent accidental program or erase of EEPROM memory
• Ability to program up to four words in a burst sequence
22.1.2.3 Other Flash Module Features
• No external high-voltage power supply required for Flash memory program and erase operations
• Interrupt generation on Flash command completion and Flash error detection
• Security mechanism to prevent unauthorized access to the Flash memory
22.1.3 Block Diagram
The block diagram of the Flash module is shown in Figure 22-1.
32 KByte Flash Module (S12FTMRG32K1V1)
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Figure 22-1. FTMRG32K1 Block Diagram
22.2 External Signal Description
The Flash module contains no signals that connect off-chip.
Bus
Clock
Divider
Clock
Command
Interrupt
Request
FCLK
Protection
Security
Registers
Flash
Interface
16bit
internal
bus
sector 0
sector 1
sector 63
8Kx39
P-Flash
Error
Interrupt
Request
CPU
512x22
sector 0
sector 1
sector 255
EEPROM
Memory Controller
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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22.3 Memory Map and Registers
This section describes the memory map and registers for the Flash module. Read data from unimplemented
memory space in the Flash module is undefined. Write access to unimplemented or reserved memory space
in the Flash module will be ignored by the Flash module.
CAUTION
Writing to the Flash registers while a Flash command is executing (that is
indicated when the value of flag CCIF reads as ’0’) is not allowed. If such
action is attempted the write operation will not change the register value.
Writing to the Flash registers is allowed when the Flash is not busy
executing commands (CCIF = 1) and during initialization right after reset,
despite the value of flag CCIF in that case (refer to Section 22.6 for a
complete description of the reset sequence).
.
22.3.1 Module Memory Map
The S12 architecture places the P-Flash memory between global addresses 0x3_8000 and 0x3_FFFF as
shown in Table 22-3.The P-Flash memory map is shown in Figure 22-2.
Table 22-2. FTMRG Memory Map
Global Address (in Bytes) Size
(Bytes) Description
0x0_0000 - 0x0_03FF 1,024 Register Space
0x0_0400 – 0x0_07FF 1,024 EEPROM Memory
0x0_4000 – 0x0_7FFF 16,284 NVMRES1=1 : NVM Resource area (see Figure 22-3)
1See NVMRES description in Section 22.4.3
0x3_8000 – 0x3_FFFF 32,768 P-Flash Memory
Table 22-3. P-Flash Memory Addressing
Global Address Size
(Bytes) Description
0x3_8000 – 0x3_FFFF 32 K
P-Flash Block
Contains Flash Configuration Field
(see Table 22-4)
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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The FPROT register, described in Section 22.3.2.9, can be set to protect regions in the Flash memory from
accidental program or erase. Three separate memory regions, one growing upward from global address
0x3_8000 in the Flash memory (called the lower region), one growing downward from global address
0x3_FFFF in the Flash memory (called the higher region), and the remaining addresses in the Flash
memory, can be activated for protection. The Flash memory addresses covered by these protectable regions
are shown in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader
code since it covers the vector space. Default protection settings as well as security information that allows
the MCU to restrict access to the Flash module are stored in the Flash configuration field as described in
Table 22-4.
Table 22-4. Flash Configuration Field
Global Address Size
(Bytes) Description
0x3_FF00-0x3_FF07 8
Backdoor Comparison Key
Refer to Section 22.4.6.11, “Verify Backdoor Access Key Command,” and
Section 22.5.1, “Unsecuring the MCU using Backdoor Key Access”
0x3_FF08-0x3_FF0B1
10x3FF08-0x3_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in
the 0x3_FF08 - 0x3_FF0B reserved field should be programmed to 0xFF.
4 Reserved
0x3_FF0C11P-Flash Protection byte.
Refer to Section 22.3.2.9, “P-Flash Protection Register (FPROT)”
0x3_FF0D11EEPROM Protection byte.
Refer to Section 22.3.2.10, “EEPROM Protection Register (EEPROT)”
0x3_FF0E11Flash Nonvolatile byte
Refer to Section 22.3.2.16, “Flash Option Register (FOPT)”
0x3_FF0F11Flash Security byte
Refer to Section 22.3.2.2, “Flash Security Register (FSEC)”
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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Figure 22-2. P-Flash Memory Map
Table 22-5. Program IFR Fields
Global Address Size
(Bytes) Field Description
0x0_4000 – 0x0_4007 8 Reserved
0x0_4008 – 0x0_40B5 174 Reserved
0x0_40B6 – 0x0_40B7 2 Version ID1
1Used to track firmware patch versions, see Section 22.4.2
0x0_40B8 – 0x0_40BF 8 Reserved
0x0_40C0 – 0x0_40FF 64 Program Once Field
Refer to Section 22.4.6.6, “Program Once Command”
Flash Configuration Field
0x3_C000
Flash Protected/Unprotected Lower Region
1, 2, 4, 8 Kbytes
P-Flash START = 0x3_8000
0x3_9000
0x3_8400
0x3_8800
0x3_A000
P-Flash END = 0x3_FFFF
0x3_F800
0x3_F000
0x3_E000 Flash Protected/Unprotected Higher Region
2, 4, 8, 16 Kbytes
Flash Protected/Unprotected Region
8 Kbytes (up to 29 Kbytes)
16 bytes (0x3_FF00 - 0x3_FF0F)
Protection
Protection
Protection
Movable End
Fixed End
Fixed End
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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Figure 22-3. Memory Controller Resource Memory Map (NVMRES=1)
22.3.2 Register Descriptions
The Flash module contains a set of 20 control and status registers located between Flash module base +
0x0000 and 0x0013.
In the case of the writable registers, the write accesses are forbidden during Fash command execution (for
more detail, see Caution note in Section 22.3).
Table 22-6. Memory Controller Resource Fields (NVMRES1=1)
1NVMRES - See Section 22.4.3 for NVMRES (NVM Resource) detail.
Global Address Size
(Bytes) Description
0x0_4000 – 0x040FF 256 P-Flash IFR (see Table 22-5)
0x0_4100 – 0x0_41FF 256 Reserved.
0x0_4200 – 0x0_57FF Reserved
0x0_5800 – 0x0_59FF 512 Reserved
0x0_5A00 – 0x0_5FFF 1,536 Reserved
0x0_6000 – 0x0_6BFF 3,072 Reserved
0x0_6C00 – 0x0_7FFF 5,120 Reserved
P-Flash IFR 1 Kbyte (NVMRES=1)
0x0_4000
RAM End = 0x0_59FF
RAM Start = 0x0_5800
Reserved 5120 bytes
Reserved 4608 bytes
0x0_6C00
0x0_7FFF
0x0_4400 Reserved 5k bytes
Reserved 512 bytes
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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A summary of the Flash module registers is given in Figure 22-4 with detailed descriptions in the
following subsections.
Address
& Name 76543210
0x0000
FCLKDIV
R FDIVLD FDIVLCK FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0
W
0x0001
FSEC
R KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0
W
0x0002
FCCOBIX
R0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0
W
0x0003
FRSV0
R00000000
W
0x0004
FCNFG
RCCIE 00
IGNSF 00
FDFD FSFD
W
0x0005
FERCNFG
R0 0 0 0 0 0 DFDIE SFDIE
W
0x0006
FSTAT
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT1 MGSTAT0
W
0x0007
FERSTAT
R0 0 0 0 0 0 DFDIF SFDIF
W
0x0008
FPROT
RFPOPEN RNV6 FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0
W
0x0009
EEPROT
RDPOPEN 00
DPS4 DPS3 DPS2 DPS1 DPS0
W
0x000A
FCCOBHI
RCCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8
W
0x000B
FCCOBLO
RCCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0
W
0x000C
FRSV1
R00000000
W
Figure 22-4. FTMRG32K1 Register Summary
32 KByte Flash Module (S12FTMRG32K1V1)
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22.3.2.1 Flash Clock Divider Register (FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
All bits in the FCLKDIV register are readable, bit 7 is not writable, bit 6 is write-once-hi and controls the
writability of the FDIV field in normal mode. In special mode, bits 6-0 are writable any number of times
but bit 7 remains unwritable.
0x000D
FRSV2
R00000000
W
0x000E
FRSV3
R00000000
W
0x000F
FRSV4
R00000000
W
0x0010
FOPT
R NV7 NV6 NV5 NV4 NV3 NV2 NV1 NV0
W
0x0011
FRSV5
R00000000
W
0x0012
FRSV6
R00000000
W
0x0013
FRSV7
R00000000
W
= Unimplemented or Reserved
Offset Module Base + 0x0000
76543210
R FDIVLD FDIVLCK FDIV[5:0]
W
Reset 00000000
= Unimplemented or Reserved
Figure 22-5. Flash Clock Divider Register (FCLKDIV)
Address
& Name 76543210
Figure 22-4. FTMRG32K1 Register Summary (continued)
32 KByte Flash Module (S12FTMRG32K1V1)
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CAUTION
The FCLKDIV register should never be written while a Flash command is
executing (CCIF=0).
Table 22-7. FCLKDIV Field Descriptions
Field Description
7
FDIVLD
Clock Divider Loaded
0 FCLKDIV register has not been written since the last reset
1 FCLKDIV register has been written since the last reset
6
FDIVLCK
Clock Divider Locked
0 FDIV field is open for writing
1 FDIV value is locked and cannot be changed. Once the lock bit is set high, only reset can clear this bit and
restore writability to the FDIV field in normal mode.
5–0
FDIV[5:0]
Clock Divider Bits — FDIV[5:0] must be set to effectively divide BUSCLK down to 1 MHz to control timed events
during Flash program and erase algorithms. Table 22-8 shows recommended values for FDIV[5:0] based on the
BUSCLK frequency. Please refer to Section 22.4.4, “Flash Command Operations,” for more information.
Table 22-8. FDIV values for various BUSCLK Frequencies
BUSCLK Frequency
(MHz) FDIV[5:0]
BUSCLK Frequency
(MHz) FDIV[5:0]
MIN1
1BUSCLK is Greater Than this value.
MAX2
2BUSCLK is Less Than or Equal to this value.
MIN1MAX2
1.0 1.6 0x00 16.6 17.6 0x10
1.6 2.6 0x01 17.6 18.6 0x11
2.6 3.6 0x02 18.6 19.6 0x12
3.6 4.6 0x03 19.6 20.6 0x13
4.6 5.6 0x04 20.6 21.6 0x14
5.6 6.6 0x05 21.6 22.6 0x15
6.6 7.6 0x06 22.6 23.6 0x16
7.6 8.6 0x07 23.6 24.6 0x17
8.6 9.6 0x08 24.6 25.6 0x18
9.6 10.6 0x09
10.6 11.6 0x0A
11.6 12.6 0x0B
12.6 13.6 0x0C
13.6 14.6 0x0D
14.6 15.6 0x0E
15.6 16.6 0x0F
32 KByte Flash Module (S12FTMRG32K1V1)
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22.3.2.2 Flash Security Register (FSEC)
The FSEC register holds all bits associated with the security of the MCU and Flash module.
All bits in the FSEC register are readable but not writable.
During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the
Flash configuration field at global address 0x3_FF0F located in P-Flash memory (see Table 22-4) as
indicated by reset condition F in Figure 22-6. If a double bit fault is detected while reading the P-Flash
phrase containing the Flash security byte during the reset sequence, all bits in the FSEC register will be set
to leave the Flash module in a secured state with backdoor key access disabled.
Offset Module Base + 0x0001
76543210
R KEYEN[1:0] RNV[5:2] SEC[1:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 22-6. Flash Security Register (FSEC)
Table 22-9. FSEC Field Descriptions
Field Description
7–6
KEYEN[1:0]
Backdoor Key Security Enable Bits — The KEYEN[1:0] bits define the enabling of backdoor key access to the
Flash module as shown in Table 22-10.
5–2
RNV[5:2]
Reserved Nonvolatile Bits — The RNV bits should remain in the erased state for future enhancements.
1–0
SEC[1:0]
Flash Security Bits — The SEC[1:0] bits define the security state of the MCU as shown in Table 22-11. If the
Flash module is unsecured using backdoor key access, the SEC bits are forced to 10.
Table 22-10. Flash KEYEN States
KEYEN[1:0] Status of Backdoor Key Access
00 DISABLED
01 DISABLED1
1Preferred KEYEN state to disable backdoor key access.
10 ENABLED
11 DISABLED
32 KByte Flash Module (S12FTMRG32K1V1)
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The security function in the Flash module is described in Section 22.5.
22.3.2.3 Flash CCOB Index Register (FCCOBIX)
The FCCOBIX register is used to index the FCCOB register for Flash memory operations.
CCOBIX bits are readable and writable while remaining bits read 0 and are not writable.
22.3.2.4 Flash Reserved0 Register (FRSV0)
This Flash register is reserved for factory testing.
All bits in the FRSV0 register read 0 and are not writable.
Table 22-11. Flash Security States
SEC[1:0] Status of Security
00 SECURED
01 SECURED1
1Preferred SEC state to set MCU to secured state.
10 UNSECURED
11 SECURED
Offset Module Base + 0x0002
76543210
R00000 CCOBIX[2:0]
W
Reset 00000000
= Unimplemented or Reserved
Figure 22-7. FCCOB Index Register (FCCOBIX)
Table 22-12. FCCOBIX Field Descriptions
Field Description
2–0
CCOBIX[1:0]
Common Command Register Index— The CCOBIX bits are used to select which word of the FCCOB register
array is being read or written to. See <st-blue>22.3.2.11 Flash Common Command Object Register (FCCOB),”
for more details.
Offset Module Base + 0x000C
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 22-8. Flash Reserved0 Register (FRSV0)
32 KByte Flash Module (S12FTMRG32K1V1)
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22.3.2.5 Flash Configuration Register (FCNFG)
The FCNFG register enables the Flash command complete interrupt and forces ECC faults on Flash array
read access from the CPU.
CCIE, IGNSF, FDFD, and FSFD bits are readable and writable while remaining bits read 0 and are not
writable.
22.3.2.6 Flash Error Configuration Register (FERCNFG)
The FERCNFG register enables the Flash error interrupts for the FERSTAT flags.
Offset Module Base + 0x0004
76543210
RCCIE 00
IGNSF 00
FDFD FSFD
W
Reset 00000000
= Unimplemented or Reserved
Figure 22-9. Flash Configuration Register (FCNFG)
Table 22-13. FCNFG Field Descriptions
Field Description
7
CCIE
Command Complete Interrupt Enable — The CCIE bit controls interrupt generation when a Flash command
has completed.
0 Command complete interrupt disabled
1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see Section 22.3.2.7)
4
IGNSF
Ignore Single Bit Fault — The IGNSF controls single bit fault reporting in the FERSTAT register (see
Section 22.3.2.8).
0 All single bit faults detected during array reads are reported
1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be
generated
1
FDFD
Force Double Bit Fault Detect — The FDFD bit allows the user to simulate a double bit fault during Flash array
read operations and check the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD.
0 Flash array read operations will set the DFDIF flag in the FERSTAT register only if a double bit fault is detected
1 Any Flash array read operation will force the DFDIF flag in the FERSTAT register to be set (see
Section 22.3.2.7) and an interrupt will be generated as long as the DFDIE interrupt enable in the FERCNFG
register is set (see Section 22.3.2.6)
0
FSFD
Force Single Bit Fault Detect —The FSFD bit allows the user to simulate a single bit fault during Flash array
read operations and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD.
0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected
1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see Section 22.3.2.7)
and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set (see
Section 22.3.2.6)
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 721
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All assigned bits in the FERCNFG register are readable and writable.
22.3.2.7 Flash Status Register (FSTAT)
The FSTAT register reports the operational status of the Flash module.
CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable
but not writable, while remaining bits read 0 and are not writable.
Offset Module Base + 0x0005
76543210
R000000
DFDIE SFDIE
W
Reset 00000000
= Unimplemented or Reserved
Figure 22-10. Flash Error Configuration Register (FERCNFG)
Table 22-14. FERCNFG Field Descriptions
Field Description
1
DFDIE
Double Bit Fault Detect Interrupt Enable — The DFDIE bit controls interrupt generation when a double bit fault
is detected during a Flash block read operation.
0 DFDIF interrupt disabled
1 An interrupt will be requested whenever the DFDIF flag is set (see Section 22.3.2.8)
0
SFDIE
Single Bit Fault Detect Interrupt Enable — The SFDIE bit controls interrupt generation when a single bit fault
is detected during a Flash block read operation.
0 SFDIF interrupt disabled whenever the SFDIF flag is set (see Section 22.3.2.8)
1 An interrupt will be requested whenever the SFDIF flag is set (see Section 22.3.2.8)
Offset Module Base + 0x0006
76543210
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT[1:0]
W
Reset 1000000
1
1Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see Section 22.6).
01
= Unimplemented or Reserved
Figure 22-11. Flash Status Register (FSTAT)
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
722 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.3.2.8 Flash Error Status Register (FERSTAT)
The FERSTAT register reflects the error status of internal Flash operations.
All flags in the FERSTAT register are readable and only writable to clear the flag.
Table 22-15. FSTAT Field Descriptions
Field Description
7
CCIF
Command Complete Interrupt Flag — The CCIF flag indicates that a Flash command has completed. The
CCIF flag is cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command
completion or command violation.
0 Flash command in progress
1 Flash command has completed
5
ACCERR
Flash Access Error Flag — The ACCERR bit indicates an illegal access has occurred to the Flash memory
caused by either a violation of the command write sequence (see Section 22.4.4.2) or issuing an illegal Flash
command. While ACCERR is set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is
cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR bit has no effect on ACCERR.
0 No access error detected
1 Access error detected
4
FPVIOL
Flash Protection Violation Flag —The FPVIOL bit indicates an attempt was made to program or erase an
address in a protected area of P-Flash or EEPROM memory during a command write sequence. The FPVIOL
bit is cleared by writing a 1 to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL
is set, it is not possible to launch a command or start a command write sequence.
0 No protection violation detected
1 Protection violation detected
3
MGBUSY
Memory Controller Busy Flag — The MGBUSY flag reflects the active state of the Memory Controller.
0 Memory Controller is idle
1 Memory Controller is busy executing a Flash command (CCIF = 0)
2
RSVD
Reserved Bit — This bit is reserved and always reads 0.
1–0
MGSTAT[1:0]
Memory Controller Command Completion Status Flag — One or more MGSTAT flag bits are set if an error
is detected during execution of a Flash command or during the Flash reset sequence. See Section 22.4.6,
“Flash Command Description,” and Section 22.6, “Initialization” for details.
Offset Module Base + 0x0007
76543210
R000000
DFDIF SFDIF
W
Reset 00000000
= Unimplemented or Reserved
Figure 22-12. Flash Error Status Register (FERSTAT)
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 723
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.3.2.9 P-Flash Protection Register (FPROT)
The FPROT register defines which P-Flash sectors are protected against program and erase operations.
The (unreserved) bits of the FPROT register are writable with the restriction that the size of the protected
region can only be increased (see Section 22.3.2.9.1, “P-Flash Protection Restrictions,” and Table 22-21).
During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte
in the Flash configuration field at global address 0x3_FF0C located in P-Flash memory (see Table 22-4)
as indicated by reset condition ‘F’ in Figure 22-13. To change the P-Flash protection that will be loaded
during the reset sequence, the upper sector of the P-Flash memory must be unprotected, then the P-Flash
protection byte must be reprogrammed. If a double bit fault is detected while reading the P-Flash phrase
containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and
remaining bits in the FPROT register will be set to leave the P-Flash memory fully protected.
Table 22-16. FERSTAT Field Descriptions
Field Description
1
DFDIF
Double Bit Fault Detect Interrupt Flag — The setting of the DFDIF flag indicates that a double bit fault was
detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation
returning invalid data was attempted on a Flash block that was under a Flash command operation.1The DFDIF
flag is cleared by writing a 1 to DFDIF. Writing a 0 to DFDIF has no effect on DFDIF.2
0 No double bit fault detected
1 Double bit fault detected or a Flash array read operation returning invalid data was attempted while command
running
1 The single bit fault and double bit fault flags are mutually exclusive for parity errors (an ECC fault occurrence can be either
single fault or double fault but never both). A simultaneous access collision (Flash array read operation returning invalid data
attempted while command running) is indicated when both SFDIF and DFDIF flags are high.
2There is a one cycle delay in storing the ECC DFDIF and SFDIF fault flags in this register. At least one NOP is required after
a flash memory read before checking FERSTAT for the occurrence of ECC errors.
0
SFDIF
Single Bit Fault Detect Interrupt Flag — With the IGNSF bit in the FCNFG register clear, the SFDIF flag
indicates that a single bit fault was detected in the stored parity and data bits during a Flash array read operation
or that a Flash array read operation returning invalid data was attempted on a Flash block that was under a Flash
command operation.1 The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on
SFDIF.
0 No single bit fault detected
1 Single bit fault detected and corrected or a Flash array read operation returning invalid data was attempted
while command running
Offset Module Base + 0x0008
76543210
RFPOPEN RNV6 FPHDIS FPHS[1:0] FPLDIS FPLS[1:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 22-13. Flash Protection Register (FPROT)
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
724 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error
and the FPVIOL bit will be set in the FSTAT register. The block erase of a P-Flash block is not possible if
any of the P-Flash sectors contained in the same P-Flash block are protected.
Table 22-17. FPROT Field Descriptions
Field Description
7
FPOPEN
Flash Protection Operation Enable — The FPOPEN bit determines the protection function for program or
erase operations as shown in Table 22-18 for the P-Flash block.
0 When FPOPEN is clear, the FPHDIS and FPLDIS bits define unprotected address ranges as specified by the
corresponding FPHS and FPLS bits
1 When FPOPEN is set, the FPHDIS and FPLDIS bits enable protection for the address range specified by the
corresponding FPHS and FPLS bits
6
RNV[6]
Reserved Nonvolatile Bit — The RNV bit should remain in the erased state for future enhancements.
5
FPHDIS
Flash Protection Higher Address Range Disable — The FPHDIS bit determines whether there is a
protected/unprotected area in a specific region of the P-Flash memory ending with global address 0x3_FFFF.
0 Protection/Unprotection enabled
1 Protection/Unprotection disabled
4–3
FPHS[1:0]
Flash Protection Higher Address Size — The FPHS bits determine the size of the protected/unprotected area
in P-Flash memory as shown inTable 22-19. The FPHS bits can only be written to while the FPHDIS bit is set.
2
FPLDIS
Flash Protection Lower Address Range Disable — The FPLDIS bit determines whether there is a
protected/unprotected area in a specific region of the P-Flash memory beginning with global address 0x3_8000.
0 Protection/Unprotection enabled
1 Protection/Unprotection disabled
1–0
FPLS[1:0]
Flash Protection Lower Address Size — The FPLS bits determine the size of the protected/unprotected area
in P-Flash memory as shown in Table 22-20. The FPLS bits can only be written to while the FPLDIS bit is set.
Table 22-18. P-Flash Protection Function
FPOPEN FPHDIS FPLDIS Function1
1For range sizes, refer to Table 22-19 and Table 22-20.
1 1 1 No P-Flash Protection
1 1 0 Protected Low Range
1 0 1 Protected High Range
1 0 0 Protected High and Low Ranges
0 1 1 Full P-Flash Memory Protected
0 1 0 Unprotected Low Range
0 0 1 Unprotected High Range
0 0 0 Unprotected High and Low Ranges
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 725
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All possible P-Flash protection scenarios are shown in Figure 22-14 . Although the protection scheme is
loaded from the Flash memory at global address 0x3_FF0C during the reset sequence, it can be changed
by the user. The P-Flash protection scheme can be used by applications requiring reprogramming in single
chip mode while providing as much protection as possible if reprogramming is not required.
Table 22-19. P-Flash Protection Higher Address Range
FPHS[1:0] Global Address Range Protected Size
00 0x3_F800–0x3_FFFF 2 Kbytes
01 0x3_F000–0x3_FFFF 4 Kbytes
10 0x3_E000–0x3_FFFF 8 Kbytes
11 0x3_C000–0x3_FFFF 16 Kbytes
Table 22-20. P-Flash Protection Lower Address Range
FPLS[1:0] Global Address Range Protected Size
00 0x3_8000–0x3_83FF 1 Kbyte
01 0x3_8000–0x3_87FF 2 Kbytes
10 0x3_8000–0x3_8FFF 4 Kbytes
11 0x3_8000–0x3_9FFF 8 Kbytes
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
726 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 22-14. P-Flash Protection Scenarios
7654
FPHS[1:0] FPLS[1:0]
3210
FPHS[1:0] FPLS[1:0]
FPHDIS = 1
FPLDIS = 1
FPHDIS = 1
FPLDIS = 0
FPHDIS = 0
FPLDIS = 1
FPHDIS = 0
FPLDIS = 0
Scenario
Scenario
Unprotected region Protected region with size
Protected region Protected region with size
defined by FPLS
defined by FPHSnot defined by FPLS, FPHS
0x3_8000
0x3_FFFF
0x3_8000
0x3_FFFF
FLASH START
FLASH START
FPOPEN = 1FPOPEN = 0
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 727
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.3.2.9.1 P-Flash Protection Restrictions
The general guideline is that P-Flash protection can only be added and not removed. Table 22-21 specifies
all valid transitions between P-Flash protection scenarios. Any attempt to write an invalid scenario to the
FPROT register will be ignored. The contents of the FPROT register reflect the active protection scenario.
See the FPHS and FPLS bit descriptions for additional restrictions.
22.3.2.10 EEPROM Protection Register (EEPROT)
The EEPROT register defines which EEPROM sectors are protected against program and erase operations.
The (unreserved) bits of the EEPROT register are writable with the restriction that protection can be added
but not removed. Writes must increase the DPS value and the DPOPEN bit can only be written from 1
(protection disabled) to 0 (protection enabled). If the DPOPEN bit is set, the state of the DPS bits is
irrelevant.
Table 22-21. P-Flash Protection Scenario Transitions
From
Protection
Scenario
To Protection Scenario1
1Allowed transitions marked with X, see Figure 22-14 for a definition of the scenarios.
01234567
0XXXX
1XX
2XX
3X
4XX
5XXXX
6XXXX
7XXXXXXXX
Offset Module Base + 0x0009
76543210
RDPOPEN 00 DPS[4:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
00F
1F1F1F1F1
= Unimplemented or Reserved
Figure 22-15. EEPROM Protection Register (EEPROT)
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
728 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
During the reset sequence, fields DPOPEN and DPS of the EEPROT register are loaded with the contents
of the EEPROM protection byte in the Flash configuration field at global address 0x3_FF0D located in
P-Flash memory (see Table 22-4) as indicated by reset condition F in Table 22-23. To change the
EEPROM protection that will be loaded during the reset sequence, the P-Flash sector containing the
EEPROM protection byte must be unprotected, then the EEPROM protection byte must be programmed.
If a double bit fault is detected while reading the P-Flash phrase containing the EEPROM protection byte
during the reset sequence, the DPOPEN bit will be cleared and DPS bits will be set to leave the EEPROM
memory fully protected.
Trying to alter data in any protected area in the EEPROM memory will result in a protection violation error
and the FPVIOL bit will be set in the FSTAT register. Block erase of the EEPROM memory is not possible
if any of the EEPROM sectors are protected.
Table 22-22. EEPROT Field Descriptions
Field Description
7
DPOPEN
EEPROM Protection Control
0 Enables EEPROM memory protection from program and erase with protected address range defined by DPS
bits
1 Disables EEPROM memory protection from program and erase
4–0
DPS[4:0]
EEPROM Protection Size — The DPS[4:0] bits determine the size of the protected area in the EEPROM
memory as shown inTable 22-23 .
Table 22-23. EEPROM Protection Address Range
DPS[4:0] Global Address Range Protected Size
00000 0x0_0400 – 0x0_041F 32 bytes
00001 0x0_0400 – 0x0_043F 64 bytes
00010 0x0_0400 – 0x0_045F 96 bytes
00011 0x0_0400 – 0x0_047F 128 bytes
00100 0x0_0400 – 0x0_049F 160 bytes
00101 0x0_0400 – 0x0_04BF 192 bytes
The Protection Size goes on enlarging in step of 32 bytes, for each DPS
value increasing of one.
.
.
.
11111 - to - 11111 0x0_0400 – 0x0_07FF 1,024 bytes
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 729
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.3.2.11 Flash Common Command Object Register (FCCOB)
The FCCOB is an array of six words addressed via the CCOBIX index found in the FCCOBIX register.
Byte wide reads and writes are allowed to the FCCOB register.
22.3.2.11.1 FCCOB - NVM Command Mode
NVM command mode uses the indexed FCCOB register to provide a command code and its relevant
parameters to the Memory Controller. The user first sets up all required FCCOB fields and then initiates
the command’s execution by writing a 1 to the CCIF bit in the FSTAT register (a 1 written by the user clears
the CCIF command completion flag to 0). When the user clears the CCIF bit in the FSTAT register all
FCCOB parameter fields are locked and cannot be changed by the user until the command completes (as
evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the
FCCOB register array.
The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 22-24. The
return values are available for reading after the CCIF flag in the FSTAT register has been returned to 1 by
the Memory Controller. Writes to the unimplemented parameter fields (CCOBIX = 110 and CCOBIX =
111) are ignored with reads from these fields returning 0x0000.
Table 22-24 shows the generic Flash command format. The high byte of the first word in the CCOB array
contains the command code, followed by the parameters for this specific Flash command. For details on
the FCCOB settings required by each command, see the Flash command descriptions in Section 22.4.6.
Offset Module Base + 0x000A
76543210
RCCOB[15:8]
W
Reset 00000000
Figure 22-16. Flash Common Command Object High Register (FCCOBHI)
Offset Module Base + 0x000B
76543210
RCCOB[7:0]
W
Reset 00000000
Figure 22-17. Flash Common Command Object Low Register (FCCOBLO)
Table 22-24. FCCOB - NVM Command Mode (Typical Usage)
CCOBIX[2:0] Byte FCCOB Parameter Fields (NVM Command Mode)
000 HI FCMD[7:0] defining Flash command
LO 6’h0, Global address [17:16]
001 HI Global address [15:8]
LO Global address [7:0]
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
730 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.3.2.12 Flash Reserved1 Register (FRSV1)
This Flash register is reserved for factory testing.
All bits in the FRSV1 register read 0 and are not writable.
22.3.2.13 Flash Reserved2 Register (FRSV2)
This Flash register is reserved for factory testing.
All bits in the FRSV2 register read 0 and are not writable.
22.3.2.14 Flash Reserved3 Register (FRSV3)
This Flash register is reserved for factory testing.
010 HI Data 0 [15:8]
LO Data 0 [7:0]
011 HI Data 1 [15:8]
LO Data 1 [7:0]
100 HI Data 2 [15:8]
LO Data 2 [7:0]
101 HI Data 3 [15:8]
LO Data 3 [7:0]
Offset Module Base + 0x000C
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 22-18. Flash Reserved1 Register (FRSV1)
Offset Module Base + 0x000D
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 22-19. Flash Reserved2 Register (FRSV2)
Table 22-24. FCCOB - NVM Command Mode (Typical Usage)
CCOBIX[2:0] Byte FCCOB Parameter Fields (NVM Command Mode)
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 731
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FRSV3 register read 0 and are not writable.
22.3.2.15 Flash Reserved4 Register (FRSV4)
This Flash register is reserved for factory testing.
All bits in the FRSV4 register read 0 and are not writable.
22.3.2.16 Flash Option Register (FOPT)
The FOPT register is the Flash option register.
All bits in the FOPT register are readable but are not writable.
During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash
configuration field at global address 0x3_FF0E located in P-Flash memory (see Table 22-4) as indicated
by reset condition F in Figure 22-22. If a double bit fault is detected while reading the P-Flash phrase
containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT register will be set.
Offset Module Base + 0x000E
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 22-20. Flash Reserved3 Register (FRSV3)
Offset Module Base + 0x000F
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 22-21. Flash Reserved4 Register (FRSV4)
Offset Module Base + 0x0010
76543210
R NV[7:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 22-22. Flash Option Register (FOPT)
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
732 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.3.2.17 Flash Reserved5 Register (FRSV5)
This Flash register is reserved for factory testing.
All bits in the FRSV5 register read 0 and are not writable.
22.3.2.18 Flash Reserved6 Register (FRSV6)
This Flash register is reserved for factory testing.
All bits in the FRSV6 register read 0 and are not writable.
22.3.2.19 Flash Reserved7 Register (FRSV7)
This Flash register is reserved for factory testing.
Table 22-25. FOPT Field Descriptions
Field Description
7–0
NV[7:0]
Nonvolatile Bits — The NV[7:0] bits are available as nonvolatile bits. Refer to the device user guide for proper
use of the NV bits.
Offset Module Base + 0x0011
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 22-23. Flash Reserved5 Register (FRSV5)
Offset Module Base + 0x0012
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 22-24. Flash Reserved6 Register (FRSV6)
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 733
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FRSV7 register read 0 and are not writable.
22.4 Functional Description
22.4.1 Modes of Operation
The FTMRG32K1 module provides the modes of operation normal and special . The operating mode is
determined by module-level inputs and affects the FCLKDIV, FCNFG, and EEPROT registers (see
Table 22-27).
22.4.2 IFR Version ID Word
The version ID word is stored in the IFR at address 0x0_40B6. The contents of the word are defined in
Table 22-26.
• VERNUM: Version number. The first version is number 0b_0001 with both 0b_0000 and 0b_1111
meaning ‘none’.
Offset Module Base + 0x0013
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 22-25. Flash Reserved7 Register (FRSV7)
Table 22-26. IFR Version ID Fields
[15:4] [3:0]
Reserved VERNUM
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
734 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.4.3 Internal NVM resource (NVMRES)
IFR is an internal NVM resource readable by CPU , when NVMRES is active. The IFR fields are shown
in Table 22-5.
The NVMRES global address map is shown in Table 22-6.
22.4.4 Flash Command Operations
Flash command operations are used to modify Flash memory contents.
The next sections describe:
• How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from
BUSCLK for Flash program and erase command operations
• The command write sequence used to set Flash command parameters and launch execution
• Valid Flash commands available for execution, according to MCU functional mode and MCU
security state.
22.4.4.1 Writing the FCLKDIV Register
Prior to issuing any Flash program or erase command after a reset, the user is required to write the
FCLKDIV register to divide BUSCLK down to a target FCLK of 1 MHz. Table 22-8 shows recommended
values for the FDIV field based on BUSCLK frequency.
NOTE
Programming or erasing the Flash memory cannot be performed if the bus
clock runs at less than 0.8 MHz. Setting FDIV too high can destroy the Flash
memory due to overstress. Setting FDIV too low can result in incomplete
programming or erasure of the Flash memory cells.
When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the
FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written,
any Flash program or erase command loaded during a command write sequence will not execute and the
ACCERR bit in the FSTAT register will set.
22.4.4.2 Command Write Sequence
The Memory Controller will launch all valid Flash commands entered using a command write sequence.
Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see
Section 22.3.2.7) and the CCIF flag should be tested to determine the status of the current command write
sequence. If CCIF is 0, the previous command write sequence is still active, a new command write
sequence cannot be started, and all writes to the FCCOB register are ignored.
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 735
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.4.4.2.1 Define FCCOB Contents
The FCCOB parameter fields must be loaded with all required parameters for the Flash command being
executed. Access to the FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX
register (see Section 22.3.2.3).
The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears
the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag
will remain clear until the Flash command has completed. Upon completion, the Memory Controller will
return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic
command write sequence is shown in Figure 22-26.
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
736 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 22-26. Generic Flash Command Write Sequence Flowchart
Write to FCCOBIX register
Write: FSTAT register (to launch command)
Clear CCIF 0x80
Clear ACCERR/FPVIOL 0x30
Write: FSTAT register
yes
no
Access Error and
Protection Violation
Read: FSTAT register
START
Check
FCCOB
ACCERR/
FPVIOL
Set?
EXIT
Write: FCLKDIV register
Read: FCLKDIV register
yes
no
FDIV
Correct?
no
Bit Polling for
Command Completion
Check
yes
CCIF Set?
to identify specific command
parameter to load.
Write to FCCOB register
to load required command parameter.
yes
no
More
Parameters?
Availability Check
Results from previous Command
Note: FCLKDIV must be
set after each reset
Read: FSTAT register
no
yes
CCIF
Set?
no
yes
CCIF
Set?
Clock Divider
Value Check Read: FSTAT register
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 737
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.4.4.3 Valid Flash Module Commands
Table 22-27 present the valid Flash commands, as enabled by the combination of the functional MCU
mode (Normal SingleChip NS, Special Singlechip SS) with the MCU security state (Unsecured, Secured).
Special Singlechip mode is selected by input mmc_ss_mode_ts2 asserted. MCU Secured state is selected
by input mmc_secure input asserted.
+
22.4.4.4 P-Flash Commands
Table 22-28 summarizes the valid P-Flash commands along with the effects of the commands on the
P-Flash block and other resources within the Flash module.
Table 22-27. Flash Commands by Mode and Security State
FCMD Command
Unsecured Secured
NS1
1Unsecured Normal Single Chip mode
SS2
2Unsecured Special Single Chip mode.
NS3
3Secured Normal Single Chip mode.
SS4
4Secured Special Single Chip mode.
0x01 Erase Verify All Blocks ∗∗∗∗
0x02 Erase Verify Block ∗∗∗∗
0x03 Erase Verify P-Flash Section ∗∗∗
0x04 Read Once ∗∗∗
0x06 Program P-Flash ∗∗∗
0x07 Program Once ∗∗∗
0x08 Erase All Blocks ∗∗
0x09 Erase Flash Block ∗∗∗
0x0A Erase P-Flash Sector ∗∗∗
0x0B Unsecure Flash ∗∗
0x0C Verify Backdoor Access Key ∗∗
0x0D Set User Margin Level ∗∗∗
0x0E Set Field Margin Level ∗
0x10 Erase Verify EEPROM Section ∗∗∗
0x11 Program EEPROM ∗∗∗
0x12 Erase EEPROM Sector ∗∗∗
Table 22-28. P-Flash Commands
FCMD Command Function on P-Flash Memory
0x01 Erase Verify All
Blocks
Verify that all P-Flash (and EEPROM) blocks are erased.
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
738 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.4.4.5 EEPROM Commands
Table 22-29 summarizes the valid EEPROM commands along with the effects of the commands on the
EEPROM block.
0x02 Erase Verify Block Verify that a P-Flash block is erased.
0x03 Erase Verify
P-Flash Section
Verify that a given number of words starting at the address provided are erased.
0x04 Read Once Read a dedicated 64 byte field in the nonvolatile information register in P-Flash block that
was previously programmed using the Program Once command.
0x06 Program P-Flash Program a phrase in a P-Flash block.
0x07 Program Once Program a dedicated 64 byte field in the nonvolatile information register in P-Flash block
that is allowed to be programmed only once.
0x08 Erase All Blocks
Erase all P-Flash (and EEPROM) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN
bits in the FPROT register and the DPOPEN bit in the EEPROT register are set prior to
launching the command.
0x09 Erase Flash Block
Erase a P-Flash (or EEPROM) block.
An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN
bits in the FPROT register are set prior to launching the command.
0x0A Erase P-Flash
Sector
Erase all bytes in a P-Flash sector.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all P-Flash (and EEPROM)
blocks and verifying that all P-Flash (and EEPROM) blocks are erased.
0x0C Verify Backdoor
Access Key
Supports a method of releasing MCU security by verifying a set of security keys.
0x0D Set User Margin
Level
Specifies a user margin read level for all P-Flash blocks.
0x0E Set Field Margin
Level
Specifies a field margin read level for all P-Flash blocks (special modes only).
Table 22-29. EEPROM Commands
FCMD Command Function on EEPROM Memory
0x01 Erase Verify All
Blocks
Verify that all EEPROM (and P-Flash) blocks are erased.
0x02 Erase Verify Block Verify that the EEPROM block is erased.
Table 22-28. P-Flash Commands
FCMD Command Function on P-Flash Memory
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 739
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.4.5 Allowed Simultaneous P-Flash and EEPROM Operations
Only the operations marked ‘OK’ in Table 22-30 are permitted to be run simultaneously on the Program
Flash and EEPROM blocks. Some operations cannot be executed simultaneously because certain hardware
resources are shared by the two memories. The priority has been placed on permitting Program Flash reads
while program and erase operations execute on the EEPROM, providing read (P-Flash) while write
(EEPROM) functionality.
0x08 Erase All Blocks
Erase all EEPROM (and P-Flash) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN
bits in the FPROT register and the DPOPEN bit in the EEPROT register are set prior to
launching the command.
0x09 Erase Flash Block
Erase a EEPROM (or P-Flash) block.
An erase of the full EEPROM block is only possible when DPOPEN bit in the EEPROT
register is set prior to launching the command.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all EEPROM (and P-Flash)
blocks and verifying that all EEPROM (and P-Flash) blocks are erased.
0x0D Set User Margin
Level
Specifies a user margin read level for the EEPROM block.
0x0E Set Field Margin
Level
Specifies a field margin read level for the EEPROM block (special modes only).
0x10 Erase Verify
EEPROM Section
Verify that a given number of words starting at the address provided are erased.
0x11 Program
EEPROM
Program up to four words in the EEPROM block.
0x12 Erase EEPROM
Sector
Erase all bytes in a sector of the EEPROM block.
Table 22-30. Allowed P-Flash and EEPROM Simultaneous Operations
EEPROM
Program Flash Read Margin
Read1Program Sector
Erase
Mass
Erase2
Read OK OK OK
Margin Read1
1A ‘Margin Read’ is any read after executing the margin setting commands
‘Set User Margin Level’ or ‘Set Field Margin Level’ with anything but the
‘normal’ level specified. See the Note on margin settings in Section 22.4.6.12
and Section 22.4.6.13.
Program
Sector Erase
Mass Erase2
2The ‘Mass Erase’ operations are commands ‘Erase All Blocks’ and ‘Erase
Flash Block’
OK
Table 22-29. EEPROM Commands
FCMD Command Function on EEPROM Memory
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
740 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.4.6 Flash Command Description
This section provides details of all available Flash commands launched by a command write sequence. The
ACCERR bit in the FSTAT register will be set during the command write sequence if any of the following
illegal steps are performed, causing the command not to be processed by the Memory Controller:
• Starting any command write sequence that programs or erases Flash memory before initializing the
FCLKDIV register
• Writing an invalid command as part of the command write sequence
• For additional possible errors, refer to the error handling table provided for each command
If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation
will return invalid data if both flags SFDIF and DFDIF are set. If the SFDIF or DFDIF flags were not
previously set when the invalid read operation occurred, both the SFDIF and DFDIF flags will be set.
If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting
any command write sequence (see Section 22.3.2.7).
CAUTION
A Flash word or phrase must be in the erased state before being
programmed. Cumulative programming of bits within a Flash word or
phrase is not allowed.
22.4.6.1 Erase Verify All Blocks Command
The Erase Verify All Blocks command will verify that all P-Flash and EEPROM blocks have been erased.
Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify
that the entire Flash memory space is erased. The CCIF flag will set after the Erase Verify All Blocks
operation has completed. If all blocks are not erased, it means blank check failed, both MGSTAT bits will
be set.
Table 22-31. Erase Verify All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x01 Not required
Table 22-32. Erase Verify All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read1or if blank check failed .
1As found in the memory map for FTMRG32K1.
MGSTAT0 Set if any non-correctable errors have been encountered during the read1 or if
blank check failed.
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 741
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.4.6.2 Erase Verify Block Command
The Erase Verify Block command allows the user to verify that an entire P-Flash or EEPROM block has
been erased. The FCCOB FlashBlockSelectionCode[1:0] bits determine which block must be verified.
Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that
the selected P-Flash or EEPROM block is erased. The CCIF flag will set after the Erase Verify Block
operation has completed.If the block is not erased, it means blank check failed, both MGSTAT bits will be
set.
22.4.6.3 Erase Verify P-Flash Section Command
The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is
erased. The Erase Verify P-Flash Section command defines the starting point of the code to be verified and
the number of phrases.
Table 22-33. Erase Verify Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x02
Flash block
selection code [1:0]. See
Table 22-34
Table 22-34. Flash block selection code description
Selection code[1:0] Flash block to be verified
00 EEPROM
01 Invalid (ACCERR)
10 Invalid (ACCERR)
11 P-Flash
Table 22-35. Erase Verify Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if an invalid FlashBlockSelectionCode[1:0] is supplied
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
742 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will
verify the selected section of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash
Section operation has completed. If the section is not erased, it means blank check failed, both MGSTAT
bits will be set.
22.4.6.4 Read Once Command
The Read Once command provides read access to a reserved 64 byte field (8 phrases) located in the
nonvolatile information register of P-Flash. The Read Once field is programmed using the Program Once
command described in Section 22.4.6.6. The Read Once command must not be executed from the Flash
block containing the Program Once reserved field to avoid code runaway.
Table 22-36. Erase Verify P-Flash Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x03 Global address [17:16] of
a P-Flash block
001 Global address [15:0] of the first phrase to be verified
010 Number of phrases to be verified
Table 22-37. Erase Verify P-Flash Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 22-27)
Set if an invalid global address [17:0] is supplied see Table 22-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
Set if the requested section crosses a the P-Flash address boundary
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
Table 22-38. Read Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x04 Not Required
001 Read Once phrase index (0x0000 - 0x0007)
010 Read Once word 0 value
011 Read Once word 1 value
100 Read Once word 2 value
101 Read Once word 3 value
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 743
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the
FCCOB indexed register. The CCIF flag will set after the Read Once operation has completed. Valid
phrase index values for the Read Once command range from 0x0000 to 0x0007. During execution of the
Read Once command, any attempt to read addresses within P-Flash block will return invalid data.
8
22.4.6.5 Program P-Flash Command
The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an
embedded algorithm.
CAUTION
A P-Flash phrase must be in the erased state before being programmed.
Cumulative programming of bits within a Flash phrase is not allowed.
Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the
data words to the supplied global address and will then proceed to verify the data words read back as
expected. The CCIF flag will set after the Program P-Flash operation has completed.
Table 22-39. Read Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 22-27)
Set if an invalid phrase index is supplied
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read
MGSTAT0 Set if any non-correctable errors have been encountered during the read
Table 22-40. Program P-Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x06 Global address [17:16] to
identify P-Flash block
001 Global address [15:0] of phrase location to be programmed1
1Global address [2:0] must be 000
010 Word 0 program value
011 Word 1 program value
100 Word 2 program value
101 Word 3 program value
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
744 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.4.6.6 Program Once Command
The Program Once command restricts programming to a reserved 64 byte field (8 phrases) in the
nonvolatile information register located in P-Flash. The Program Once reserved field can be read using the
Read Once command as described in Section 22.4.6.4. The Program Once command must only be issued
once since the nonvolatile information register in P-Flash cannot be erased. The Program Once command
must not be executed from the Flash block containing the Program Once reserved field to avoid code
runaway.
Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the
selected phrase is erased. If erased, then the selected phrase will be programmed and then verified with
read back. The CCIF flag will remain clear, setting only after the Program Once operation has completed.
The reserved nonvolatile information register accessed by the Program Once command cannot be erased
and any attempt to program one of these phrases a second time will not be allowed. Valid phrase index
values for the Program Once command range from 0x0000 to 0x0007. During execution of the Program
Once command, any attempt to read addresses within P-Flash will return invalid data.
Table 22-41. Program P-Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 22-27)
Set if an invalid global address [17:0] is supplied see Table 22-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the global address [17:0] points to a protected area
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 22-42. Program Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x07 Not Required
001 Program Once phrase index (0x0000 - 0x0007)
010 Program Once word 0 value
011 Program Once word 1 value
100 Program Once word 2 value
101 Program Once word 3 value
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 745
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.4.6.7 Erase All Blocks Command
The Erase All Blocks operation will erase the entire P-Flash and EEPROM memory space.
Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire
Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash
memory space was properly erased, security will be released. During the execution of this command
(CCIF=0) the user must not write to any Flash module register. The CCIF flag will set after the Erase All
Blocks operation has completed.
22.4.6.8 Erase Flash Block Command
The Erase Flash Block operation will erase all addresses in a P-Flash or EEPROM block.
Table 22-43. Program Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 22-27)
Set if an invalid phrase index is supplied
Set if the requested phrase has already been programmed1
1If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will
be allowed to execute again on that same phrase.
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 22-44. Erase All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x08 Not required
Table 22-45. Erase All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 22-27)
FPVIOL Set if any area of the P-Flash or EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation1
1As found in the memory map for FTMRG32K1.
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
746 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Erase Flash Block command, the Memory Controller will erase the
selected Flash block and verify that it is erased. The CCIF flag will set after the Erase Flash Block
operation has completed.
22.4.6.9 Erase P-Flash Sector Command
The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector.
Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the
selected Flash sector and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash
Sector operation has completed.
Table 22-46. Erase Flash Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x09 Global address [17:16] to
identify Flash block
001 Global address [15:0] in Flash block to be erased
Table 22-47. Erase Flash Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 22-27)
Set if an invalid global address [17:16] is supplied
Set if the supplied P-Flash address is not phrase-aligned or if the EEPROM
address is not word-aligned
FPVIOL Set if an area of the selected Flash block is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 22-48. Erase P-Flash Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0A Global address [17:16] to identify
P-Flash block to be erased
001 Global address [15:0] anywhere within the sector to be erased.
Refer to Section 22.1.2.1 for the P-Flash sector size.
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 747
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
22.4.6.10 Unsecure Flash Command
The Unsecure Flash command will erase the entire P-Flash and EEPROM memory space and, if the erase
is successful, will release security.
Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire
P-Flash and EEPROM memory space and verify that it is erased. If the Memory Controller verifies that
the entire Flash memory space was properly erased, security will be released. If the erase verify is not
successful, the Unsecure Flash operation sets MGSTAT1 and terminates without changing the security
state. During the execution of this command (CCIF=0) the user must not write to any Flash module
register. The CCIF flag is set after the Unsecure Flash operation has completed.
22.4.6.11 Verify Backdoor Access Key Command
The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the
FSEC register (see Table 22-10). The Verify Backdoor Access Key command releases security if
Table 22-49. Erase P-Flash Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 22-27)
Set if an invalid global address [17:16] is supplied see Table 22-3)1
1As defined by the memory map for FTMRG32K1.
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the selected P-Flash sector is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 22-50. Unsecure Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0B Not required
Table 22-51. Unsecure Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 22-27)
FPVIOL Set if any area of the P-Flash or EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
32 KByte Flash Module (S12FTMRG32K1V1)
MC9S12G Family Reference Manual, Rev.1.06
748 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
user-supplied keys match those stored in the Flash security bytes of the Flash configuration field (see
Table 22-4). The Verify Backdoor Access Key command must not be executed from the Flash block
containing the backdoor comparison key to avoid code runaway.
Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will
check the FSEC KEYEN bits to verify that this command is enabled. If not enabled, the Memory
Controller sets the ACCERR bit in the FSTAT register and terminates. If the command is enabled, the
Memory Controller compares the key provided in FCCOB to the backdoor comparison key in the Flash
configuration field with Key 0 compared to 0x3_FF00, etc. If the backdoor keys match, security will be
released. If the backdoor keys do not match, security is not released and all future attempts to execute the
Verify Backdoor Access Key command are aborted (set ACCERR) until a reset occurs. The CCIF flag is
set after the Verify Backdoor Access Key operation has completed.
22.4.6.12 Set User Margin Level Command
The Set User Margin Level command causes the Memory Controller to set the margin level for future read
operations of the P-Flash or EEPROM block.
Table 22-52. Verify Backdoor Access Key Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0C Not required
001 Key 0
010 Key 1
011 Key 2
100 Key 3
Table 22-53. Verify Backdoor Access Key Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 100 at command launch
Set if an incorrect backdoor key is supplied
Set if backdoor key access has not been enabled (KEYEN[1:0] != 10, see
Section 22.3.2.2)
Set if the backdoor key has mismatched since the last reset
FPVIOL None
MGSTAT1 None
MGSTAT0 None
Table 22-54. Set User Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0D Flash block selection code [1:0]. See
Table 22-34
001 Margin level setting.
32 KByte Flash Module (S12FTMRG32K1V1)
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Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the
user margin level for the targeted block and then set the CCIF flag.
NOTE
When the EEPROM block is targeted, the EEPROM user margin levels are
applied only to the EEPROM reads. However, when the P-Flash block is
targeted, the P-Flash user margin levels are applied to both P-Flash and
EEPROM reads. It is not possible to apply user margin levels to the P-Flash
block only.
Valid margin level settings for the Set User Margin Level command are defined in Table 22-55.
NOTE
User margin levels can be used to check that Flash memory contents have
adequate margin for normal level read operations. If unexpected results are
encountered when checking Flash memory contents at user margin levels, a
potential loss of information has been detected.
Table 22-55. Valid Set User Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level1
1Read margin to the erased state
0x0002 User Margin-0 Level2
2Read margin to the programmed state
Table 22-56. Set User Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 22-27)
Set if an invalid FlashBlockSelectionCode[1:0] is supplied (See Table 22-34 )
Set if an invalid margin level setting is supplied
FPVIOL None
MGSTAT1 None
MGSTAT0 None
32 KByte Flash Module (S12FTMRG32K1V1)
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22.4.6.13 Set Field Margin Level Command
The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set
the margin level specified for future read operations of the P-Flash or EEPROM block.
Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the
field margin level for the targeted block and then set the CCIF flag.
NOTE
When the EEPROM block is targeted, the EEPROM field margin levels are
applied only to the EEPROM reads. However, when the P-Flash block is
targeted, the P-Flash field margin levels are applied to both P-Flash and
EEPROM reads. It is not possible to apply field margin levels to the P-Flash
block only.
Valid margin level settings for the Set Field Margin Level command are defined in Table 22-58.
Table 22-57. Set Field Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0E Flash block selection code [1:0]. See
Table 22-34
001 Margin level setting.
Table 22-58. Valid Set Field Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level1
1Read margin to the erased state
0x0002 User Margin-0 Level2
2Read margin to the programmed state
0x0003 Field Margin-1 Level1
0x0004 Field Margin-0 Level2
32 KByte Flash Module (S12FTMRG32K1V1)
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CAUTION
Field margin levels must only be used during verify of the initial factory
programming.
NOTE
Field margin levels can be used to check that Flash memory contents have
adequate margin for data retention at the normal level setting. If unexpected
results are encountered when checking Flash memory contents at field
margin levels, the Flash memory contents should be erased and
reprogrammed.
22.4.6.14 Erase Verify EEPROM Section Command
The Erase Verify EEPROM Section command will verify that a section of code in the EEPROM is erased.
The Erase Verify EEPROM Section command defines the starting point of the data to be verified and the
number of words.
Upon clearing CCIF to launch the Erase Verify EEPROM Section command, the Memory Controller will
verify the selected section of EEPROM memory is erased. The CCIF flag will set after the Erase Verify
EEPROM Section operation has completed. If the section is not erased, it means blank check failed, both
MGSTAT bits will be set.
Table 22-59. Set Field Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 22-27)
Set if an invalid FlashBlockSelectionCode[1:0] is supplied (See Table 22-34 )
Set if an invalid margin level setting is supplied
FPVIOL None
MGSTAT1 None
MGSTAT0 None
Table 22-60. Erase Verify EEPROM Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x10
Global address [17:16] to
identify the EEPROM
block
001 Global address [15:0] of the first word to be verified
010 Number of words to be verified
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22.4.6.15 Program EEPROM Command
The Program EEPROM operation programs one to four previously erased words in the EEPROM block.
The Program EEPROM operation will confirm that the targeted location(s) were successfully programmed
upon completion.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
Upon clearing CCIF to launch the Program EEPROM command, the user-supplied words will be
transferred to the Memory Controller and be programmed if the area is unprotected. The CCOBIX index
value at Program EEPROM command launch determines how many words will be programmed in the
EEPROM block. The CCIF flag is set when the operation has completed.
Table 22-61. Erase Verify EEPROM Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 22-27)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested section breaches the end of the EEPROM block
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
Table 22-62. Program EEPROM Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x11 Global address [17:16] to
identify the EEPROM block
001 Global address [15:0] of word to be programmed
010 Word 0 program value
011 Word 1 program value, if desired
100 Word 2 program value, if desired
101 Word 3 program value, if desired
32 KByte Flash Module (S12FTMRG32K1V1)
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22.4.6.16 Erase EEPROM Sector Command
The Erase EEPROM Sector operation will erase all addresses in a sector of the EEPROM block.
Upon clearing CCIF to launch the Erase EEPROM Sector command, the Memory Controller will erase the
selected Flash sector and verify that it is erased. The CCIF flag will set after the Erase EEPROM Sector
operation has completed.
Table 22-63. Program EEPROM Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] < 010 at command launch
Set if CCOBIX[2:0] > 101 at command launch
Set if command not available in current mode (see Table 22-27)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested group of words breaches the end of the EEPROM block
FPVIOL Set if the selected area of the EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 22-64. Erase EEPROM Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x12 Global address [17:16] to identify
EEPROM block
001 Global address [15:0] anywhere within the sector to be erased.
See Section 22.1.2.2 for EEPROM sector size.
Table 22-65. Erase EEPROM Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 22-27)
Set if an invalid global address [17:0] is suppliedsee Table 22-3)
Set if a misaligned word address is supplied (global address [0] != 0)
FPVIOL Set if the selected area of the EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
32 KByte Flash Module (S12FTMRG32K1V1)
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22.4.7 Interrupts
The Flash module can generate an interrupt when a Flash command operation has completed or when a
Flash command operation has detected an ECC fault.
NOTE
Vector addresses and their relative interrupt priority are determined at the
MCU level.
22.4.7.1 Description of Flash Interrupt Operation
The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the
Flash command interrupt request. The Flash module uses the DFDIF and SFDIF flags in combination with
the DFDIE and SFDIE interrupt enable bits to generate the Flash error interrupt request. For a detailed
description of the register bits involved, refer to Section 22.3.2.5, “Flash Configuration Register
(FCNFG)”, Section 22.3.2.6, “Flash Error Configuration Register (FERCNFG)”, Section 22.3.2.7, “Flash
Status Register (FSTAT)”, and Section 22.3.2.8, “Flash Error Status Register (FERSTAT)”.
The logic used for generating the Flash module interrupts is shown in Figure 22-27.
Figure 22-27. Flash Module Interrupts Implementation
Table 22-66. Flash Interrupt Sources
Interrupt Source Interrupt Flag Local Enable Global (CCR)
Mask
Flash Command Complete CCIF
(FSTAT register)
CCIE
(FCNFG register)
I Bit
ECC Double Bit Fault on Flash Read DFDIF
(FERSTAT register)
DFDIE
(FERCNFG register)
I Bit
ECC Single Bit Fault on Flash Read SFDIF
(FERSTAT register)
SFDIE
(FERCNFG register)
I Bit
Flash Error Interrupt Request
CCIF
CCIE
DFDIF
DFDIE
SFDIF
SFDIE
Flash Command Interrupt Request
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22.4.8 Wait Mode
The Flash module is not affected if the MCU enters wait mode. The Flash module can recover the MCU
from wait via the CCIF interrupt (see Section 22.4.7, “Interrupts”).
22.4.9 Stop Mode
If a Flash command is active (CCIF = 0) when the MCU requests stop mode, the current Flash operation
will be completed before the MCU is allowed to enter stop mode.
22.5 Security
The Flash module provides security information to the MCU. The Flash security state is defined by the
SEC bits of the FSEC register (see Table 22-11). During reset, the Flash module initializes the FSEC
register using data read from the security byte of the Flash configuration field at global address 0x3_FF0F.
The security state out of reset can be permanently changed by programming the security byte assuming
that the MCU is starting from a mode where the necessary P-Flash erase and program commands are
available and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully
programmed, its new value will take affect after the next MCU reset.
The following subsections describe these security-related subjects:
• Unsecuring the MCU using Backdoor Key Access
• Unsecuring the MCU in Special Single Chip Mode using BDM
• Mode and Security Effects on Flash Command Availability
22.5.1 Unsecuring the MCU using Backdoor Key Access
The MCU may be unsecured by using the backdoor key access feature which requires knowledge of the
contents of the backdoor keys (four 16-bit words programmed at addresses 0x3_FF00-0x3_FF07). If the
KEYEN[1:0] bits are in the enabled state (see Section 22.3.2.2), the Verify Backdoor Access Key
command (see Section 22.4.6.11) allows the user to present four prospective keys for comparison to the
keys stored in the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor
Access Key command match the backdoor keys stored in the Flash memory, the SEC bits in the FSEC
register (see Table 22-11) will be changed to unsecure the MCU. Key values of 0x0000 and 0xFFFF are
not permitted as backdoor keys. While the Verify Backdoor Access Key command is active, P-Flash
memory and EEPROM memory will not be available for read access and will return invalid data.
32 KByte Flash Module (S12FTMRG32K1V1)
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The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an
external stimulus. This external stimulus would typically be through one of the on-chip serial ports.
If the KEYEN[1:0] bits are in the enabled state (see Section 22.3.2.2), the MCU can be unsecured by the
backdoor key access sequence described below:
1. Follow the command sequence for the Verify Backdoor Access Key command as explained in
Section 22.4.6.11
2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the
SEC[1:0] bits in the FSEC register are forced to the unsecure state of 10
The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will
prohibit future use of the Verify Backdoor Access Key command. A reset of the MCU is the only method
to re-enable the Verify Backdoor Access Key command. The security as defined in the Flash security byte
(0x3_FF0F) is not changed by using the Verify Backdoor Access Key command sequence. The backdoor
keys stored in addresses 0x3_FF00-0x3_FF07 are unaffected by the Verify Backdoor Access Key
command sequence. The Verify Backdoor Access Key command sequence has no effect on the program
and erase protections defined in the Flash protection register, FPROT.
After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is
unsecured, the sector containing the Flash security byte can be erased and the Flash security byte can be
reprogrammed to the unsecure state, if desired. In the unsecure state, the user has full control of the
contents of the backdoor keys by programming addresses 0x3_FF00-0x3_FF07 in the Flash configuration
field.
22.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM
A secured MCU can be unsecured in special single chip mode by using the following method to erase the
P-Flash and EEPROM memory:
1. Reset the MCU into special single chip mode
2. Delay while the BDM executes the Erase Verify All Blocks command write sequence to check if
the P-Flash and EEPROM memories are erased
3. Send BDM commands to disable protection in the P-Flash and EEPROM memory
4. Execute the Erase All Blocks command write sequence to erase the P-Flash and EEPROM
memory. Alternatively the Unsecure Flash command can be executed, if so the steps 5 and 6 below
are skeeped.
5. After the CCIF flag sets to indicate that the Erase All Blocks operation has completed, reset the
MCU into special single chip mode
6. Delay while the BDM executes the Erase Verify All Blocks command write sequence to verify that
the P-Flash and EEPROM memory are erased
If the P-Flash and EEPROM memory are verified as erased, the MCU will be unsecured. All BDM
commands will now be enabled and the Flash security byte may be programmed to the unsecure state by
continuing with the following steps:
7. Send BDM commands to execute the Program P-Flash command write sequence to program the
Flash security byte to the unsecured state
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8. Reset the MCU
22.5.3 Mode and Security Effects on Flash Command Availability
The availability of Flash module commands depends on the MCU operating mode and security state as
shown in Table 22-27.
22.6 Initialization
On each system reset the flash module executes an initialization sequence which establishes initial values
for the Flash Block Configuration Parameters, the FPROT and EEPROT protection registers, and the FOPT
and FSEC registers. The initialization routine reverts to built-in default values that leave the module in a
fully protected and secured state if errors are encountered during execution of the reset sequence. If a
double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT register will be set.
CCIF is cleared throughout the initialization sequence. The Flash module holds off all CPU access for a
portion of the initialization sequence. Flash reads are allowed once the hold is removed. Completion of the
initialization sequence is marked by setting CCIF high which enables user commands.
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The
state of the word being programmed or the sector/block being erased is not guaranteed.
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Chapter 23
48 KByte Flash Module (S12FTMRG48K1V1)
23.1 Introduction
The FTMRG48K1 module implements the following:
• 48Kbytes of P-Flash (Program Flash) memory
• 1,536bytes of EEPROM memory
The Flash memory is ideal for single-supply applications allowing for field reprogramming without
requiring external high voltage sources for program or erase operations. The Flash module includes a
memory controller that executes commands to modify Flash memory contents. The user interface to the
memory controller consists of the indexed Flash Common Command Object (FCCOB) register which is
written to with the command, global address, data, and any required command parameters. The memory
controller must complete the execution of a command before the FCCOB register can be written to with a
new command.
CAUTION
A Flash word or phrase must be in the erased state before being
programmed. Cumulative programming of bits within a Flash word or
phrase is not allowed.
Table 23-1. Revision History
Revision
Number
Revision
Date
Sections
Affected Description of Changes
V01.04 17 Jun 2010 23.4.6.1/23-793
23.4.6.2/23-794
23.4.6.3/23-794
23.4.6.14/23-80
4
Clarify Erase Verify Commands Descriptions related to the bits MGSTAT[1:0]
of the register FSTAT.
V01.05 20 aug 2010 23.4.6.2/23-794
23.4.6.12/23-80
1
23.4.6.13/23-80
3
Updated description of the commands RD1BLK, MLOADU and MLOADF
Rev.1.06 31 Jan 2011 23.3.2.9/23-776 Updated description of protection on Section 23.3.2.9
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The Flash memory may be read as bytes and aligned words. Read access time is one bus cycle for bytes
and aligned words. For misaligned words access, the CPU has to perform twice the byte read access
command. For Flash memory, an erased bit reads 1 and a programmed bit reads 0.
It is possible to read from P-Flash memory while some commands are executing on EEPROM memory. It
is not possible to read from EEPROM memory while a command is executing on P-Flash memory.
Simultaneous P-Flash and EEPROM operations are discussed in Section 23.4.5.
Both P-Flash and EEPROM memories are implemented with Error Correction Codes (ECC) that can
resolve single bit faults and detect double bit faults. For P-Flash memory, the ECC implementation
requires that programming be done on an aligned 8 byte basis (a Flash phrase). Since P-Flash memory is
always read by half-phrase, only one single bit fault in an aligned 4 byte half-phrase containing the byte
or word accessed will be corrected.
23.1.1 Glossary
Command Write Sequence — An MCU instruction sequence to execute built-in algorithms (including
program and erase) on the Flash memory.
EEPROM Memory — The EEPROM memory constitutes the nonvolatile memory store for data.
EEPROM Sector — The EEPROM sector is the smallest portion of the EEPROM memory that can be
erased. The EEPROM sector consists of 4 bytes.
NVM Command Mode — An NVM mode using the CPU to setup the FCCOB register to pass parameters
required for Flash command execution.
Phrase — An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes two
sets of aligned double words with each set including 7 ECC bits for single bit fault correction and double
bit fault detection within each double word.
P-Flash Memory — The P-Flash memory constitutes the main nonvolatile memory store for applications.
P-Flash Sector — The P-Flash sector is the smallest portion of the P-Flash memory that can be erased.
Each P-Flash sector contains 512 bytes.
Program IFR — Nonvolatile information register located in the P-Flash block that contains the Version
ID, and the Program Once field.
23.1.2 Features
23.1.2.1 P-Flash Features
• 48 Kbytes of P-Flash memory composed of one 48 Kbyte Flash block divided into 96 sectors of
512 bytes
48 KByte Flash Module (S12FTMRG48K1V1)
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• Single bit fault correction and double bit fault detection within a 32-bit double word during read
operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and phrase program operation
• Ability to read the P-Flash memory while programming a word in the EEPROM memory
• Flexible protection scheme to prevent accidental program or erase of P-Flash memory
23.1.2.2 EEPROM Features
• 1.5Kbytes of EEPROM memory composed of one 1.5Kbyte Flash block divided into 384 sectors
of 4 bytes
• Single bit fault correction and double bit fault detection within a word during read operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and word program operation
• Protection scheme to prevent accidental program or erase of EEPROM memory
• Ability to program up to four words in a burst sequence
23.1.2.3 Other Flash Module Features
• No external high-voltage power supply required for Flash memory program and erase operations
• Interrupt generation on Flash command completion and Flash error detection
• Security mechanism to prevent unauthorized access to the Flash memory
48 KByte Flash Module (S12FTMRG48K1V1)
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23.1.3 Block Diagram
The block diagram of the Flash module is shown in Figure 23-1.
Figure 23-1. FTMRG48K1 Block Diagram
23.2 External Signal Description
The Flash module contains no signals that connect off-chip.
Bus
Clock
Divider
Clock
Command
Interrupt
Request
FCLK
Protection
Security
Registers
Flash
Interface
16bit
internal
bus
sector 0
sector 1
sector 95
12Kx39
P-Flash
Error
Interrupt
Request
CPU
768x22
sector 0
sector 1
sector 383
EEPROM
Memory Controller
48 KByte Flash Module (S12FTMRG48K1V1)
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23.3 Memory Map and Registers
This section describes the memory map and registers for the Flash module. Read data from unimplemented
memory space in the Flash module is undefined. Write access to unimplemented or reserved memory space
in the Flash module will be ignored by the Flash module.
CAUTION
Writing to the Flash registers while a Flash command is executing (that is
indicated when the value of flag CCIF reads as ’0’) is not allowed. If such
action is attempted the write operation will not change the register value.
Writing to the Flash registers is allowed when the Flash is not busy
executing commands (CCIF = 1) and during initialization right after reset,
despite the value of flag CCIF in that case (refer to Section 23.6 for a
complete description of the reset sequence).
.
23.3.1 Module Memory Map
The S12 architecture places the P-Flash memory between global addresses 0x3_4000 and 0x3_FFFF as
shown in Table 23-3 .The P-Flash memory map is shown in Figure 23-2.
Table 23-2. FTMRG Memory Map
Global Address (in Bytes) Size
(Bytes) Description
0x0_0000 - 0x0_03FF 1,024 Register Space
0x0_0400 – 0x0_09FF 1,536 EEPROM Memory
0x0_0A00 – 0x0_0BFF 512 FTMRG reserved area
0x0_4000 – 0x0_7FFF 16,284 NVMRES1=1 : NVM Resource area (see Figure 23-3)
1See NVMRES description in Section 23.4.3
0x3_0000 – 0x3_3FFF 16,384 FTMRG reserved area
0x3_4000 – 0x3_FFFF 49,152 P-Flash Memory
48 KByte Flash Module (S12FTMRG48K1V1)
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The FPROT register, described in Section 23.3.2.9, can be set to protect regions in the Flash memory from
accidental program or erase. The Flash memory addresses covered by these protectable regions are shown
in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader code
since it covers the vector space. Default protection settings as well as security information that allows the
MCU to restrict access to the Flash module are stored in the Flash configuration field as described in
Table 23-4.
Table 23-3. P-Flash Memory Addressing
Global Address Size
(Bytes) Description
0x3_4000 – 0x3_FFFF 48 K
P-Flash Block
Contains Flash Configuration Field
(see Table 23-4).
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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Table 23-4. Flash Configuration Field
Global Address Size
(Bytes) Description
0x3_FF00-0x3_FF07 8
Backdoor Comparison Key
Refer to Section 23.4.6.11, “Verify Backdoor Access Key Command,” and
Section 23.5.1, “Unsecuring the MCU using Backdoor Key Access”
0x3_FF08-0x3_FF0B1
10x3FF08-0x3_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in
the 0x3_FF08 - 0x3_FF0B reserved field should be programmed to 0xFF.
4 Reserved
0x3_FF0C11P-Flash Protection byte.
Refer to Section 23.3.2.9, “P-Flash Protection Register (FPROT)”
0x3_FF0D11EEPROM Protection byte.
Refer to Section 23.3.2.10, “EEPROM Protection Register (EEPROT)”
0x3_FF0E11Flash Nonvolatile byte
Refer to Section 23.3.2.16, “Flash Option Register (FOPT)”
0x3_FF0F11Flash Security byte
Refer to Section 23.3.2.2, “Flash Security Register (FSEC)”
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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Figure 23-2. P-Flash Memory Map
Table 23-5. Program IFR Fields
Global Address Size
(Bytes) Field Description
0x0_4000 – 0x0_4007 8 Reserved
0x0_4008 – 0x0_40B5 174 Reserved
0x0_40B6 – 0x0_40B7 2 Version ID1
1Used to track firmware patch versions, see Section 23.4.2
0x0_40B8 – 0x0_40BF 8 Reserved
0x0_40C0 – 0x0_40FF 64 Program Once Field
Refer to Section 23.4.6.6, “Program Once Command”
Flash Configuration Field
0x3_C000
Flash Protected/Unprotected Lower Region
1, 2, 4, 8 Kbytes
0x3_8000
0x3_9000
0x3_8400
0x3_8800
0x3_A000
P-Flash END = 0x3_FFFF
0x3_F800
0x3_F000
0x3_E000 Flash Protected/Unprotected Higher Region
2, 4, 8, 16 Kbytes
Flash Protected/Unprotected Region
8 Kbytes (up to 29 Kbytes)
16 bytes (0x3_FF00 - 0x3_FF0F)
Flash Protected/Unprotected Region
16 Kbytes
P-Flash START = 0x3_4000
Protection
Protection
Protection
Movable End
Fixed End
Fixed End
48 KByte Flash Module (S12FTMRG48K1V1)
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Figure 23-3. Memory Controller Resource Memory Map (NVMRES=1)
23.3.2 Register Descriptions
The Flash module contains a set of 20 control and status registers located between Flash module base +
0x0000 and 0x0013.
In the case of the writable registers, the write accesses are forbidden during Fash command execution (for
more detail, see Caution note in Section 23.3).
Table 23-6. Memory Controller Resource Fields (NVMRES1=1)
1NVMRES - See Section 23.4.3 for NVMRES (NVM Resource) detail.
Global Address Size
(Bytes) Description
0x0_4000 – 0x040FF 256 P-Flash IFR (see Table 23-5)
0x0_4100 – 0x0_41FF 256 Reserved.
0x0_4200 – 0x0_57FF Reserved
0x0_5800 – 0x0_59FF 512 Reserved
0x0_5A00 – 0x0_5FFF 1,536 Reserved
0x0_6000 – 0x0_6BFF 3,072 Reserved
0x0_6C00 – 0x0_7FFF 5,120 Reserved
P-Flash IFR 1 Kbyte (NVMRES=1)
0x0_4000
RAM End = 0x0_59FF
RAM Start = 0x0_5800
Reserved 5120 bytes
Reserved 4608 bytes
0x0_6C00
0x0_7FFF
0x0_4400 Reserved 5k bytes
Reserved 512 bytes
48 KByte Flash Module (S12FTMRG48K1V1)
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A summary of the Flash module registers is given in Figure 23-4 with detailed descriptions in the
following subsections.
Address
& Name 76543210
0x0000
FCLKDIV
R FDIVLD FDIVLCK FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0
W
0x0001
FSEC
R KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0
W
0x0002
FCCOBIX
R0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0
W
0x0003
FRSV0
R00000000
W
0x0004
FCNFG
RCCIE 00
IGNSF 00
FDFD FSFD
W
0x0005
FERCNFG
R0 0 0 0 0 0 DFDIE SFDIE
W
0x0006
FSTAT
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT1 MGSTAT0
W
0x0007
FERSTAT
R0 0 0 0 0 0 DFDIF SFDIF
W
0x0008
FPROT
RFPOPEN RNV6 FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0
W
0x0009
EEPROT
RDPOPEN 0DPS5 DPS4 DPS3 DPS2 DPS1 DPS0
W
0x000A
FCCOBHI
RCCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8
W
0x000B
FCCOBLO
RCCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0
W
0x000C
FRSV1
R00000000
W
Figure 23-4. FTMRG48K1 Register Summary
48 KByte Flash Module (S12FTMRG48K1V1)
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23.3.2.1 Flash Clock Divider Register (FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
All bits in the FCLKDIV register are readable, bit 7 is not writable, bit 6 is write-once-hi and controls the
writability of the FDIV field in normal mode. In special mode, bits 6-0 are writable any number of times
but bit 7 remains unwritable.
0x000D
FRSV2
R00000000
W
0x000E
FRSV3
R00000000
W
0x000F
FRSV4
R00000000
W
0x0010
FOPT
R NV7 NV6 NV5 NV4 NV3 NV2 NV1 NV0
W
0x0011
FRSV5
R00000000
W
0x0012
FRSV6
R00000000
W
0x0013
FRSV7
R00000000
W
= Unimplemented or Reserved
Offset Module Base + 0x0000
76543210
R FDIVLD FDIVLCK FDIV[5:0]
W
Reset 00000000
= Unimplemented or Reserved
Figure 23-5. Flash Clock Divider Register (FCLKDIV)
Address
& Name 76543210
Figure 23-4. FTMRG48K1 Register Summary (continued)
48 KByte Flash Module (S12FTMRG48K1V1)
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CAUTION
The FCLKDIV register should never be written while a Flash command is
executing (CCIF=0).
Table 23-7. FCLKDIV Field Descriptions
Field Description
7
FDIVLD
Clock Divider Loaded
0 FCLKDIV register has not been written since the last reset
1 FCLKDIV register has been written since the last reset
6
FDIVLCK
Clock Divider Locked
0 FDIV field is open for writing
1 FDIV value is locked and cannot be changed. Once the lock bit is set high, only reset can clear this bit and
restore writability to the FDIV field in normal mode.
5–0
FDIV[5:0]
Clock Divider Bits — FDIV[5:0] must be set to effectively divide BUSCLK down to 1 MHz to control timed events
during Flash program and erase algorithms. Table 23-8 shows recommended values for FDIV[5:0] based on the
BUSCLK frequency. Please refer to Section 23.4.4, “Flash Command Operations,” for more information.
Table 23-8. FDIV values for various BUSCLK Frequencies
BUSCLK Frequency
(MHz) FDIV[5:0]
BUSCLK Frequency
(MHz) FDIV[5:0]
MIN1
1BUSCLK is Greater Than this value.
MAX2
2BUSCLK is Less Than or Equal to this value.
MIN1MAX2
1.0 1.6 0x00 16.6 17.6 0x10
1.6 2.6 0x01 17.6 18.6 0x11
2.6 3.6 0x02 18.6 19.6 0x12
3.6 4.6 0x03 19.6 20.6 0x13
4.6 5.6 0x04 20.6 21.6 0x14
5.6 6.6 0x05 21.6 22.6 0x15
6.6 7.6 0x06 22.6 23.6 0x16
7.6 8.6 0x07 23.6 24.6 0x17
8.6 9.6 0x08 24.6 25.6 0x18
9.6 10.6 0x09
10.6 11.6 0x0A
11.6 12.6 0x0B
12.6 13.6 0x0C
13.6 14.6 0x0D
14.6 15.6 0x0E
15.6 16.6 0x0F
48 KByte Flash Module (S12FTMRG48K1V1)
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23.3.2.2 Flash Security Register (FSEC)
The FSEC register holds all bits associated with the security of the MCU and Flash module.
All bits in the FSEC register are readable but not writable.
During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the
Flash configuration field at global address 0x3_FF0F located in P-Flash memory (see Table 23-4) as
indicated by reset condition F in Figure 23-6. If a double bit fault is detected while reading the P-Flash
phrase containing the Flash security byte during the reset sequence, all bits in the FSEC register will be set
to leave the Flash module in a secured state with backdoor key access disabled.
Offset Module Base + 0x0001
76543210
R KEYEN[1:0] RNV[5:2] SEC[1:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 23-6. Flash Security Register (FSEC)
Table 23-9. FSEC Field Descriptions
Field Description
7–6
KEYEN[1:0]
Backdoor Key Security Enable Bits — The KEYEN[1:0] bits define the enabling of backdoor key access to the
Flash module as shown in Table 23-10.
5–2
RNV[5:2]
Reserved Nonvolatile Bits — The RNV bits should remain in the erased state for future enhancements.
1–0
SEC[1:0]
Flash Security Bits — The SEC[1:0] bits define the security state of the MCU as shown in Table 23-11. If the
Flash module is unsecured using backdoor key access, the SEC bits are forced to 10.
Table 23-10. Flash KEYEN States
KEYEN[1:0] Status of Backdoor Key Access
00 DISABLED
01 DISABLED1
1Preferred KEYEN state to disable backdoor key access.
10 ENABLED
11 DISABLED
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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The security function in the Flash module is described in Section 23.5.
23.3.2.3 Flash CCOB Index Register (FCCOBIX)
The FCCOBIX register is used to index the FCCOB register for Flash memory operations.
CCOBIX bits are readable and writable while remaining bits read 0 and are not writable.
23.3.2.4 Flash Reserved0 Register (FRSV0)
This Flash register is reserved for factory testing.
All bits in the FRSV0 register read 0 and are not writable.
Table 23-11. Flash Security States
SEC[1:0] Status of Security
00 SECURED
01 SECURED1
1Preferred SEC state to set MCU to secured state.
10 UNSECURED
11 SECURED
Offset Module Base + 0x0002
76543210
R00000 CCOBIX[2:0]
W
Reset 00000000
= Unimplemented or Reserved
Figure 23-7. FCCOB Index Register (FCCOBIX)
Table 23-12. FCCOBIX Field Descriptions
Field Description
2–0
CCOBIX[1:0]
Common Command Register Index— The CCOBIX bits are used to select which word of the FCCOB register
array is being read or written to. See <st-blue>23.3.2.11 Flash Common Command Object Register (FCCOB),”
for more details.
Offset Module Base + 0x000C
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 23-8. Flash Reserved0 Register (FRSV0)
48 KByte Flash Module (S12FTMRG48K1V1)
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23.3.2.5 Flash Configuration Register (FCNFG)
The FCNFG register enables the Flash command complete interrupt and forces ECC faults on Flash array
read access from the CPU.
CCIE, IGNSF, FDFD, and FSFD bits are readable and writable while remaining bits read 0 and are not
writable.
23.3.2.6 Flash Error Configuration Register (FERCNFG)
The FERCNFG register enables the Flash error interrupts for the FERSTAT flags.
Offset Module Base + 0x0004
76543210
RCCIE 00
IGNSF 00
FDFD FSFD
W
Reset 00000000
= Unimplemented or Reserved
Figure 23-9. Flash Configuration Register (FCNFG)
Table 23-13. FCNFG Field Descriptions
Field Description
7
CCIE
Command Complete Interrupt Enable — The CCIE bit controls interrupt generation when a Flash command
has completed.
0 Command complete interrupt disabled
1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see Section 23.3.2.7)
4
IGNSF
Ignore Single Bit Fault — The IGNSF controls single bit fault reporting in the FERSTAT register (see
Section 23.3.2.8).
0 All single bit faults detected during array reads are reported
1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be
generated
1
FDFD
Force Double Bit Fault Detect — The FDFD bit allows the user to simulate a double bit fault during Flash array
read operations and check the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD.
0 Flash array read operations will set the DFDIF flag in the FERSTAT register only if a double bit fault is detected
1 Any Flash array read operation will force the DFDIF flag in the FERSTAT register to be set (see
Section 23.3.2.7) and an interrupt will be generated as long as the DFDIE interrupt enable in the FERCNFG
register is set (see Section 23.3.2.6)
0
FSFD
Force Single Bit Fault Detect —The FSFD bit allows the user to simulate a single bit fault during Flash array
read operations and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD.
0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected
1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see Section 23.3.2.7)
and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set (see
Section 23.3.2.6)
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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All assigned bits in the FERCNFG register are readable and writable.
23.3.2.7 Flash Status Register (FSTAT)
The FSTAT register reports the operational status of the Flash module.
CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable
but not writable, while remaining bits read 0 and are not writable.
Offset Module Base + 0x0005
76543210
R000000
DFDIE SFDIE
W
Reset 00000000
= Unimplemented or Reserved
Figure 23-10. Flash Error Configuration Register (FERCNFG)
Table 23-14. FERCNFG Field Descriptions
Field Description
1
DFDIE
Double Bit Fault Detect Interrupt Enable — The DFDIE bit controls interrupt generation when a double bit fault
is detected during a Flash block read operation.
0 DFDIF interrupt disabled
1 An interrupt will be requested whenever the DFDIF flag is set (see Section 23.3.2.8)
0
SFDIE
Single Bit Fault Detect Interrupt Enable — The SFDIE bit controls interrupt generation when a single bit fault
is detected during a Flash block read operation.
0 SFDIF interrupt disabled whenever the SFDIF flag is set (see Section 23.3.2.8)
1 An interrupt will be requested whenever the SFDIF flag is set (see Section 23.3.2.8)
Offset Module Base + 0x0006
76543210
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT[1:0]
W
Reset 1000000
1
1Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see Section 23.6).
01
= Unimplemented or Reserved
Figure 23-11. Flash Status Register (FSTAT)
48 KByte Flash Module (S12FTMRG48K1V1)
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23.3.2.8 Flash Error Status Register (FERSTAT)
The FERSTAT register reflects the error status of internal Flash operations.
All flags in the FERSTAT register are readable and only writable to clear the flag.
Table 23-15. FSTAT Field Descriptions
Field Description
7
CCIF
Command Complete Interrupt Flag — The CCIF flag indicates that a Flash command has completed. The
CCIF flag is cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command
completion or command violation.
0 Flash command in progress
1 Flash command has completed
5
ACCERR
Flash Access Error Flag — The ACCERR bit indicates an illegal access has occurred to the Flash memory
caused by either a violation of the command write sequence (see Section 23.4.4.2) or issuing an illegal Flash
command. While ACCERR is set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is
cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR bit has no effect on ACCERR.
0 No access error detected
1 Access error detected
4
FPVIOL
Flash Protection Violation Flag —The FPVIOL bit indicates an attempt was made to program or erase an
address in a protected area of P-Flash or EEPROM memory during a command write sequence. The FPVIOL
bit is cleared by writing a 1 to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL
is set, it is not possible to launch a command or start a command write sequence.
0 No protection violation detected
1 Protection violation detected
3
MGBUSY
Memory Controller Busy Flag — The MGBUSY flag reflects the active state of the Memory Controller.
0 Memory Controller is idle
1 Memory Controller is busy executing a Flash command (CCIF = 0)
2
RSVD
Reserved Bit — This bit is reserved and always reads 0.
1–0
MGSTAT[1:0]
Memory Controller Command Completion Status Flag — One or more MGSTAT flag bits are set if an error
is detected during execution of a Flash command or during the Flash reset sequence. See Section 23.4.6,
“Flash Command Description,” and Section 23.6, “Initialization” for details.
Offset Module Base + 0x0007
76543210
R000000
DFDIF SFDIF
W
Reset 00000000
= Unimplemented or Reserved
Figure 23-12. Flash Error Status Register (FERSTAT)
48 KByte Flash Module (S12FTMRG48K1V1)
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23.3.2.9 P-Flash Protection Register (FPROT)
The FPROT register defines which P-Flash sectors are protected against program and erase operations.
The (unreserved) bits of the FPROT register are writable with the restriction that the size of the protected
region can only be increased (see Section 23.3.2.9.1, “P-Flash Protection Restrictions,” and Table 23-21).
During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte
in the Flash configuration field at global address 0x3_FF0C located in P-Flash memory (see Table 23-4)
as indicated by reset condition ‘F’ in Figure 23-13. To change the P-Flash protection that will be loaded
during the reset sequence, the upper sector of the P-Flash memory must be unprotected, then the P-Flash
protection byte must be reprogrammed. If a double bit fault is detected while reading the P-Flash phrase
containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and
remaining bits in the FPROT register will be set to leave the P-Flash memory fully protected.
Table 23-16. FERSTAT Field Descriptions
Field Description
1
DFDIF
Double Bit Fault Detect Interrupt Flag — The setting of the DFDIF flag indicates that a double bit fault was
detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation
returning invalid data was attempted on a Flash block that was under a Flash command operation.1The DFDIF
flag is cleared by writing a 1 to DFDIF. Writing a 0 to DFDIF has no effect on DFDIF.2
0 No double bit fault detected
1 Double bit fault detected or a Flash array read operation returning invalid data was attempted while command
running
1 The single bit fault and double bit fault flags are mutually exclusive for parity errors (an ECC fault occurrence can be either
single fault or double fault but never both). A simultaneous access collision (Flash array read operation returning invalid data
attempted while command running) is indicated when both SFDIF and DFDIF flags are high.
2There is a one cycle delay in storing the ECC DFDIF and SFDIF fault flags in this register. At least one NOP is required after
a flash memory read before checking FERSTAT for the occurrence of ECC errors.
0
SFDIF
Single Bit Fault Detect Interrupt Flag — With the IGNSF bit in the FCNFG register clear, the SFDIF flag
indicates that a single bit fault was detected in the stored parity and data bits during a Flash array read operation
or that a Flash array read operation returning invalid data was attempted on a Flash block that was under a Flash
command operation.1 The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on
SFDIF.
0 No single bit fault detected
1 Single bit fault detected and corrected or a Flash array read operation returning invalid data was attempted
while command running
Offset Module Base + 0x0008
76543210
RFPOPEN RNV6 FPHDIS FPHS[1:0] FPLDIS FPLS[1:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 23-13. Flash Protection Register (FPROT)
48 KByte Flash Module (S12FTMRG48K1V1)
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Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error
and the FPVIOL bit will be set in the FSTAT register. The block erase of a P-Flash block is not possible if
any of the P-Flash sectors contained in the same P-Flash block are protected.
Table 23-17. FPROT Field Descriptions
Field Description
7
FPOPEN
Flash Protection Operation Enable — The FPOPEN bit determines the protection function for program or
erase operations as shown in Table 23-18 for the P-Flash block.
0 When FPOPEN is clear, the FPHDIS and FPLDIS bits define unprotected address ranges as specified by the
corresponding FPHS and FPLS bits
1 When FPOPEN is set, the FPHDIS and FPLDIS bits enable protection for the address range specified by the
corresponding FPHS and FPLS bits
6
RNV[6]
Reserved Nonvolatile Bit — The RNV bit should remain in the erased state for future enhancements.
5
FPHDIS
Flash Protection Higher Address Range Disable — The FPHDIS bit determines whether there is a
protected/unprotected area in a specific region of the P-Flash memory ending with global address 0x3_FFFF.
0 Protection/Unprotection enabled
1 Protection/Unprotection disabled
4–3
FPHS[1:0]
Flash Protection Higher Address Size — The FPHS bits determine the size of the protected/unprotected area
in P-Flash memory as shown inTable 23-19. The FPHS bits can only be written to while the FPHDIS bit is set.
2
FPLDIS
Flash Protection Lower Address Range Disable — The FPLDIS bit determines whether there is a
protected/unprotected area in a specific region of the P-Flash memory beginning with global address 0x3_8000.
0 Protection/Unprotection enabled
1 Protection/Unprotection disabled
1–0
FPLS[1:0]
Flash Protection Lower Address Size — The FPLS bits determine the size of the protected/unprotected area
in P-Flash memory as shown in Table 23-20. The FPLS bits can only be written to while the FPLDIS bit is set.
Table 23-18. P-Flash Protection Function
FPOPEN FPHDIS FPLDIS Function1
1For range sizes, refer to Table 23-19 and Table 23-20.
1 1 1 No P-Flash Protection
1 1 0 Protected Low Range
1 0 1 Protected High Range
1 0 0 Protected High and Low Ranges
0 1 1 Full P-Flash Memory Protected
0 1 0 Unprotected Low Range
0 0 1 Unprotected High Range
0 0 0 Unprotected High and Low Ranges
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All possible P-Flash protection scenarios are shown in Figure 23-14 . Although the protection scheme is
loaded from the Flash memory at global address 0x3_FF0C during the reset sequence, it can be changed
by the user. The P-Flash protection scheme can be used by applications requiring reprogramming in single
chip mode while providing as much protection as possible if reprogramming is not required.
Table 23-19. P-Flash Protection Higher Address Range
FPHS[1:0] Global Address Range Protected Size
00 0x3_F800–0x3_FFFF 2 Kbytes
01 0x3_F000–0x3_FFFF 4 Kbytes
10 0x3_E000–0x3_FFFF 8 Kbytes
11 0x3_C000–0x3_FFFF 16 Kbytes
Table 23-20. P-Flash Protection Lower Address Range
FPLS[1:0] Global Address Range Protected Size
00 0x3_8000–0x3_83FF 1 Kbyte
01 0x3_8000–0x3_87FF 2 Kbytes
10 0x3_8000–0x3_8FFF 4 Kbytes
11 0x3_8000–0x3_9FFF 8 Kbytes
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 779
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 23-14. P-Flash Protection Scenarios
7654
FPHS[1:0] FPLS[1:0]
3210
FPHS[1:0] FPLS[1:0]
FPHDIS = 1
FPLDIS = 1
FPHDIS = 1
FPLDIS = 0
FPHDIS = 0
FPLDIS = 1
FPHDIS = 0
FPLDIS = 0
Scenario
Scenario
Unprotected region Protected region with size
Protected region Protected region with size
defined by FPLS
defined by FPHSnot defined by FPLS, FPHS
0x3_8000
0x3_FFFF
0x3_8000
0x3_FFFF
FLASH START
FLASH START
FPOPEN = 1FPOPEN = 0
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
780 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.3.2.9.1 P-Flash Protection Restrictions
The general guideline is that P-Flash protection can only be added and not removed. Table 23-21 specifies
all valid transitions between P-Flash protection scenarios. Any attempt to write an invalid scenario to the
FPROT register will be ignored. The contents of the FPROT register reflect the active protection scenario.
See the FPHS and FPLS bit descriptions for additional restrictions.
23.3.2.10 EEPROM Protection Register (EEPROT)
The EEPROT register defines which EEPROM sectors are protected against program and erase operations.
The (unreserved) bits of the EEPROT register are writable with the restriction that protection can be added
but not removed. Writes must increase the DPS value and the DPOPEN bit can only be written from 1
(protection disabled) to 0 (protection enabled). If the DPOPEN bit is set, the state of the DPS bits is
irrelevant.
Table 23-21. P-Flash Protection Scenario Transitions
From
Protection
Scenario
To Protection Scenario1
1Allowed transitions marked with X, see Figure 23-14 for a definition of the scenarios.
01234567
0XXXX
1XX
2XX
3X
4XX
5XXXX
6XXXX
7XXXXXXXX
Offset Module Base + 0x0009
76543210
RDPOPEN 0DPS[5:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
0F
1F1F1F1F1F1
= Unimplemented or Reserved
Figure 23-15. EEPROM Protection Register (EEPROT)
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 781
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
During the reset sequence, fields DPOPEN and DPS of the EEPROT register are loaded with the contents
of the EEPROM protection byte in the Flash configuration field at global address 0x3_FF0D located in
P-Flash memory (see Table 23-4) as indicated by reset condition F in Table 23-23. To change the
EEPROM protection that will be loaded during the reset sequence, the P-Flash sector containing the
EEPROM protection byte must be unprotected, then the EEPROM protection byte must be programmed.
If a double bit fault is detected while reading the P-Flash phrase containing the EEPROM protection byte
during the reset sequence, the DPOPEN bit will be cleared and DPS bits will be set to leave the EEPROM
memory fully protected.
Trying to alter data in any protected area in the EEPROM memory will result in a protection violation error
and the FPVIOL bit will be set in the FSTAT register. Block erase of the EEPROM memory is not possible
if any of the EEPROM sectors are protected.
Table 23-22. EEPROT Field Descriptions
Field Description
7
DPOPEN
EEPROM Protection Control
0 Enables EEPROM memory protection from program and erase with protected address range defined by DPS
bits
1 Disables EEPROM memory protection from program and erase
5–0
DPS[5:0]
EEPROM Protection Size — The DPS[5:0] bits determine the size of the protected area in the EEPROM
memory as shown in Table 23-23 .
Table 23-23. EEPROM Protection Address Range
DPS[5:0] Global Address Range Protected Size
000000 0x0_0400 – 0x0_041F 32 bytes
000001 0x0_0400 – 0x0_043F 64 bytes
000010 0x0_0400 – 0x0_045F 96 bytes
000011 0x0_0400 – 0x0_047F 128 bytes
000100 0x0_0400 – 0x0_049F 160 bytes
000101 0x0_0400 – 0x0_04BF 192 bytes
The Protection Size goes on enlarging in step of 32 bytes, for each DPS value
increasing of one.
.
.
.
101111 - to - 111111 0x0_0400 – 0x0_09FF 1,536 bytes
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
782 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.3.2.11 Flash Common Command Object Register (FCCOB)
The FCCOB is an array of six words addressed via the CCOBIX index found in the FCCOBIX register.
Byte wide reads and writes are allowed to the FCCOB register.
23.3.2.11.1 FCCOB - NVM Command Mode
NVM command mode uses the indexed FCCOB register to provide a command code and its relevant
parameters to the Memory Controller. The user first sets up all required FCCOB fields and then initiates
the command’s execution by writing a 1 to the CCIF bit in the FSTAT register (a 1 written by the user clears
the CCIF command completion flag to 0). When the user clears the CCIF bit in the FSTAT register all
FCCOB parameter fields are locked and cannot be changed by the user until the command completes (as
evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the
FCCOB register array.
The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 23-24. The
return values are available for reading after the CCIF flag in the FSTAT register has been returned to 1 by
the Memory Controller. Writes to the unimplemented parameter fields (CCOBIX = 110 and CCOBIX =
111) are ignored with reads from these fields returning 0x0000.
Table 23-24 shows the generic Flash command format. The high byte of the first word in the CCOB array
contains the command code, followed by the parameters for this specific Flash command. For details on
the FCCOB settings required by each command, see the Flash command descriptions in Section 23.4.6.
Offset Module Base + 0x000A
76543210
RCCOB[15:8]
W
Reset 00000000
Figure 23-16. Flash Common Command Object High Register (FCCOBHI)
Offset Module Base + 0x000B
76543210
RCCOB[7:0]
W
Reset 00000000
Figure 23-17. Flash Common Command Object Low Register (FCCOBLO)
Table 23-24. FCCOB - NVM Command Mode (Typical Usage)
CCOBIX[2:0] Byte FCCOB Parameter Fields (NVM Command Mode)
000 HI FCMD[7:0] defining Flash command
LO 6’h0, Global address [17:16]
001 HI Global address [15:8]
LO Global address [7:0]
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 783
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.3.2.12 Flash Reserved1 Register (FRSV1)
This Flash register is reserved for factory testing.
All bits in the FRSV1 register read 0 and are not writable.
23.3.2.13 Flash Reserved2 Register (FRSV2)
This Flash register is reserved for factory testing.
All bits in the FRSV2 register read 0 and are not writable.
23.3.2.14 Flash Reserved3 Register (FRSV3)
This Flash register is reserved for factory testing.
010 HI Data 0 [15:8]
LO Data 0 [7:0]
011 HI Data 1 [15:8]
LO Data 1 [7:0]
100 HI Data 2 [15:8]
LO Data 2 [7:0]
101 HI Data 3 [15:8]
LO Data 3 [7:0]
Offset Module Base + 0x000C
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 23-18. Flash Reserved1 Register (FRSV1)
Offset Module Base + 0x000D
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 23-19. Flash Reserved2 Register (FRSV2)
Table 23-24. FCCOB - NVM Command Mode (Typical Usage)
CCOBIX[2:0] Byte FCCOB Parameter Fields (NVM Command Mode)
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
784 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FRSV3 register read 0 and are not writable.
23.3.2.15 Flash Reserved4 Register (FRSV4)
This Flash register is reserved for factory testing.
All bits in the FRSV4 register read 0 and are not writable.
23.3.2.16 Flash Option Register (FOPT)
The FOPT register is the Flash option register.
All bits in the FOPT register are readable but are not writable.
During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash
configuration field at global address 0x3_FF0E located in P-Flash memory (see Table 23-4) as indicated
by reset condition F in Figure 23-22. If a double bit fault is detected while reading the P-Flash phrase
containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT register will be set.
Offset Module Base + 0x000E
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 23-20. Flash Reserved3 Register (FRSV3)
Offset Module Base + 0x000F
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 23-21. Flash Reserved4 Register (FRSV4)
Offset Module Base + 0x0010
76543210
R NV[7:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 23-22. Flash Option Register (FOPT)
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 785
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.3.2.17 Flash Reserved5 Register (FRSV5)
This Flash register is reserved for factory testing.
All bits in the FRSV5 register read 0 and are not writable.
23.3.2.18 Flash Reserved6 Register (FRSV6)
This Flash register is reserved for factory testing.
All bits in the FRSV6 register read 0 and are not writable.
23.3.2.19 Flash Reserved7 Register (FRSV7)
This Flash register is reserved for factory testing.
Table 23-25. FOPT Field Descriptions
Field Description
7–0
NV[7:0]
Nonvolatile Bits — The NV[7:0] bits are available as nonvolatile bits. Refer to the device user guide for proper
use of the NV bits.
Offset Module Base + 0x0011
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 23-23. Flash Reserved5 Register (FRSV5)
Offset Module Base + 0x0012
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 23-24. Flash Reserved6 Register (FRSV6)
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
786 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FRSV7 register read 0 and are not writable.
23.4 Functional Description
23.4.1 Modes of Operation
The FTMRG48K1 module provides the modes of operation normal and special . The operating mode is
determined by module-level inputs and affects the FCLKDIV, FCNFG, and EEPROT registers (see
Table 23-27).
23.4.2 IFR Version ID Word
The version ID word is stored in the IFR at address 0x0_40B6. The contents of the word are defined in
Table 23-26.
• VERNUM: Version number. The first version is number 0b_0001 with both 0b_0000 and 0b_1111
meaning ‘none’.
Offset Module Base + 0x0013
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 23-25. Flash Reserved7 Register (FRSV7)
Table 23-26. IFR Version ID Fields
[15:4] [3:0]
Reserved VERNUM
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 787
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.4.3 Internal NVM resource (NVMRES)
IFR is an internal NVM resource readable by CPU , when NVMRES is active. The IFR fields are shown
in Table 23-5.
The NVMRES global address map is shown in Table 23-6.
23.4.4 Flash Command Operations
Flash command operations are used to modify Flash memory contents.
The next sections describe:
• How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from
BUSCLK for Flash program and erase command operations
• The command write sequence used to set Flash command parameters and launch execution
• Valid Flash commands available for execution, according to MCU functional mode and MCU
security state.
23.4.4.1 Writing the FCLKDIV Register
Prior to issuing any Flash program or erase command after a reset, the user is required to write the
FCLKDIV register to divide BUSCLK down to a target FCLK of 1 MHz. Table 23-8 shows recommended
values for the FDIV field based on BUSCLK frequency.
NOTE
Programming or erasing the Flash memory cannot be performed if the bus
clock runs at less than 0.8 MHz. Setting FDIV too high can destroy the Flash
memory due to overstress. Setting FDIV too low can result in incomplete
programming or erasure of the Flash memory cells.
When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the
FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written,
any Flash program or erase command loaded during a command write sequence will not execute and the
ACCERR bit in the FSTAT register will set.
23.4.4.2 Command Write Sequence
The Memory Controller will launch all valid Flash commands entered using a command write sequence.
Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see
Section 23.3.2.7) and the CCIF flag should be tested to determine the status of the current command write
sequence. If CCIF is 0, the previous command write sequence is still active, a new command write
sequence cannot be started, and all writes to the FCCOB register are ignored.
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
788 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.4.4.2.1 Define FCCOB Contents
The FCCOB parameter fields must be loaded with all required parameters for the Flash command being
executed. Access to the FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX
register (see Section 23.3.2.3).
The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears
the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag
will remain clear until the Flash command has completed. Upon completion, the Memory Controller will
return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic
command write sequence is shown in Figure 23-26.
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 789
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 23-26. Generic Flash Command Write Sequence Flowchart
Write to FCCOBIX register
Write: FSTAT register (to launch command)
Clear CCIF 0x80
Clear ACCERR/FPVIOL 0x30
Write: FSTAT register
yes
no
Access Error and
Protection Violation
Read: FSTAT register
START
Check
FCCOB
ACCERR/
FPVIOL
Set?
EXIT
Write: FCLKDIV register
Read: FCLKDIV register
yes
no
FDIV
Correct?
no
Bit Polling for
Command Completion
Check
yes
CCIF Set?
to identify specific command
parameter to load.
Write to FCCOB register
to load required command parameter.
yes
no
More
Parameters?
Availability Check
Results from previous Command
Note: FCLKDIV must be
set after each reset
Read: FSTAT register
no
yes
CCIF
Set?
no
yes
CCIF
Set?
Clock Divider
Value Check Read: FSTAT register
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
790 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.4.4.3 Valid Flash Module Commands
Table 23-27 present the valid Flash commands, as enabled by the combination of the functional MCU
mode (Normal SingleChip NS, Special Singlechip SS) with the MCU security state (Unsecured, Secured).
Special Singlechip mode is selected by input mmc_ss_mode_ts2 asserted. MCU Secured state is selected
by input mmc_secure input asserted.
+
23.4.4.4 P-Flash Commands
Table 23-28 summarizes the valid P-Flash commands along with the effects of the commands on the
P-Flash block and other resources within the Flash module.
Table 23-27. Flash Commands by Mode and Security State
FCMD Command
Unsecured Secured
NS1
1Unsecured Normal Single Chip mode
SS2
2Unsecured Special Single Chip mode.
NS3
3Secured Normal Single Chip mode.
SS4
4Secured Special Single Chip mode.
0x01 Erase Verify All Blocks ∗∗∗∗
0x02 Erase Verify Block ∗∗∗∗
0x03 Erase Verify P-Flash Section ∗∗∗
0x04 Read Once ∗∗∗
0x06 Program P-Flash ∗∗∗
0x07 Program Once ∗∗∗
0x08 Erase All Blocks ∗∗
0x09 Erase Flash Block ∗∗∗
0x0A Erase P-Flash Sector ∗∗∗
0x0B Unsecure Flash ∗∗
0x0C Verify Backdoor Access Key ∗∗
0x0D Set User Margin Level ∗∗∗
0x0E Set Field Margin Level ∗
0x10 Erase Verify EEPROM Section ∗∗∗
0x11 Program EEPROM ∗∗∗
0x12 Erase EEPROM Sector ∗∗∗
Table 23-28. P-Flash Commands
FCMD Command Function on P-Flash Memory
0x01 Erase Verify All
Blocks
Verify that all P-Flash (and EEPROM) blocks are erased.
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 791
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.4.4.5 EEPROM Commands
Table 23-29 summarizes the valid EEPROM commands along with the effects of the commands on the
EEPROM block.
0x02 Erase Verify Block Verify that a P-Flash block is erased.
0x03 Erase Verify
P-Flash Section
Verify that a given number of words starting at the address provided are erased.
0x04 Read Once Read a dedicated 64 byte field in the nonvolatile information register in P-Flash block that
was previously programmed using the Program Once command.
0x06 Program P-Flash Program a phrase in a P-Flash block.
0x07 Program Once Program a dedicated 64 byte field in the nonvolatile information register in P-Flash block
that is allowed to be programmed only once.
0x08 Erase All Blocks
Erase all P-Flash (and EEPROM) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN
bits in the FPROT register and the DPOPEN bit in the EEPROT register are set prior to
launching the command.
0x09 Erase Flash Block
Erase a P-Flash (or EEPROM) block.
An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN
bits in the FPROT register are set prior to launching the command.
0x0A Erase P-Flash
Sector
Erase all bytes in a P-Flash sector.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all P-Flash (and EEPROM)
blocks and verifying that all P-Flash (and EEPROM) blocks are erased.
0x0C Verify Backdoor
Access Key
Supports a method of releasing MCU security by verifying a set of security keys.
0x0D Set User Margin
Level
Specifies a user margin read level for all P-Flash blocks.
0x0E Set Field Margin
Level
Specifies a field margin read level for all P-Flash blocks (special modes only).
Table 23-29. EEPROM Commands
FCMD Command Function on EEPROM Memory
0x01 Erase Verify All
Blocks
Verify that all EEPROM (and P-Flash) blocks are erased.
0x02 Erase Verify Block Verify that the EEPROM block is erased.
Table 23-28. P-Flash Commands
FCMD Command Function on P-Flash Memory
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
792 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.4.5 Allowed Simultaneous P-Flash and EEPROM Operations
Only the operations marked ‘OK’ in Table 23-30 are permitted to be run simultaneously on the Program
Flash and EEPROM blocks. Some operations cannot be executed simultaneously because certain hardware
resources are shared by the two memories. The priority has been placed on permitting Program Flash reads
while program and erase operations execute on the EEPROM, providing read (P-Flash) while write
(EEPROM) functionality.
0x08 Erase All Blocks
Erase all EEPROM (and P-Flash) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN
bits in the FPROT register and the DPOPEN bit in the EEPROT register are set prior to
launching the command.
0x09 Erase Flash Block
Erase a EEPROM (or P-Flash) block.
An erase of the full EEPROM block is only possible when DPOPEN bit in the EEPROT
register is set prior to launching the command.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all EEPROM (and P-Flash)
blocks and verifying that all EEPROM (and P-Flash) blocks are erased.
0x0D Set User Margin
Level
Specifies a user margin read level for the EEPROM block.
0x0E Set Field Margin
Level
Specifies a field margin read level for the EEPROM block (special modes only).
0x10 Erase Verify
EEPROM Section
Verify that a given number of words starting at the address provided are erased.
0x11 Program
EEPROM
Program up to four words in the EEPROM block.
0x12 Erase EEPROM
Sector
Erase all bytes in a sector of the EEPROM block.
Table 23-30. Allowed P-Flash and EEPROM Simultaneous Operations
EEPROM
Program Flash Read Margin
Read1Program Sector
Erase
Mass
Erase2
Read OK OK OK
Margin Read1
1A ‘Margin Read’ is any read after executing the margin setting commands
‘Set User Margin Level’ or ‘Set Field Margin Level’ with anything but the
‘normal’ level specified. See the Note on margin settings in Section 23.4.6.12
and Section 23.4.6.13.
Program
Sector Erase
Mass Erase2
2The ‘Mass Erase’ operations are commands ‘Erase All Blocks’ and ‘Erase
Flash Block’
OK
Table 23-29. EEPROM Commands
FCMD Command Function on EEPROM Memory
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 793
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.4.6 Flash Command Description
This section provides details of all available Flash commands launched by a command write sequence. The
ACCERR bit in the FSTAT register will be set during the command write sequence if any of the following
illegal steps are performed, causing the command not to be processed by the Memory Controller:
• Starting any command write sequence that programs or erases Flash memory before initializing the
FCLKDIV register
• Writing an invalid command as part of the command write sequence
• For additional possible errors, refer to the error handling table provided for each command
If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation
will return invalid data if both flags SFDIF and DFDIF are set. If the SFDIF or DFDIF flags were not
previously set when the invalid read operation occurred, both the SFDIF and DFDIF flags will be set.
If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting
any command write sequence (see Section 23.3.2.7).
CAUTION
A Flash word or phrase must be in the erased state before being
programmed. Cumulative programming of bits within a Flash word or
phrase is not allowed.
23.4.6.1 Erase Verify All Blocks Command
The Erase Verify All Blocks command will verify that all P-Flash and EEPROM blocks have been erased.
Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify
that the entire Flash memory space is erased. The CCIF flag will set after the Erase Verify All Blocks
operation has completed. If all blocks are not erased, it means blank check failed, both MGSTAT bits will
be set.
Table 23-31. Erase Verify All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x01 Not required
Table 23-32. Erase Verify All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the reador if blank check failed .
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
794 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.4.6.2 Erase Verify Block Command
The Erase Verify Block command allows the user to verify that an entire P-Flash or EEPROM block has
been erased. The FCCOB FlashBlockSelectionCode[1:0] bits determine which block must be verified.
Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that
the selected P-Flash or EEPROM block is erased. The CCIF flag will set after the Erase Verify Block
operation has completed.If the block is not erased, it means blank check failed, both MGSTAT bits will be
set.
23.4.6.3 Erase Verify P-Flash Section Command
The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is
erased. The Erase Verify P-Flash Section command defines the starting point of the code to be verified and
the number of phrases.
Table 23-33. Erase Verify Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x02
Flash block
selection code [1:0]. See
Table 23-34
Table 23-34. Flash block selection code description
Selection code[1:0] Flash block to be verified
00 EEPROM
01 Invalid (ACCERR)
10 Invalid (ACCERR)
11 P-Flash
Table 23-35. Erase Verify Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if an invalid FlashBlockSelectionCode[1:0] is supplied
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 795
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will
verify the selected section of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash
Section operation has completed. If the section is not erased, it means blank check failed, both MGSTAT
bits will be set.
23.4.6.4 Read Once Command
The Read Once command provides read access to a reserved 64 byte field (8 phrases) located in the
nonvolatile information register of P-Flash. The Read Once field is programmed using the Program Once
command described in Section 23.4.6.6. The Read Once command must not be executed from the Flash
block containing the Program Once reserved field to avoid code runaway.
Table 23-36. Erase Verify P-Flash Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x03 Global address [17:16] of
a P-Flash block
001 Global address [15:0] of the first phrase to be verified
010 Number of phrases to be verified
Table 23-37. Erase Verify P-Flash Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 23-27)
Set if an invalid global address [17:0] is supplied see Table 23-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
Set if the requested section crosses a the P-Flash address boundary
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
Table 23-38. Read Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x04 Not Required
001 Read Once phrase index (0x0000 - 0x0007)
010 Read Once word 0 value
011 Read Once word 1 value
100 Read Once word 2 value
101 Read Once word 3 value
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
796 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the
FCCOB indexed register. The CCIF flag will set after the Read Once operation has completed. Valid
phrase index values for the Read Once command range from 0x0000 to 0x0007. During execution of the
Read Once command, any attempt to read addresses within P-Flash block will return invalid data.
8
23.4.6.5 Program P-Flash Command
The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an
embedded algorithm.
CAUTION
A P-Flash phrase must be in the erased state before being programmed.
Cumulative programming of bits within a Flash phrase is not allowed.
Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the
data words to the supplied global address and will then proceed to verify the data words read back as
expected. The CCIF flag will set after the Program P-Flash operation has completed.
Table 23-39. Read Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 23-27)
Set if an invalid phrase index is supplied
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read
MGSTAT0 Set if any non-correctable errors have been encountered during the read
Table 23-40. Program P-Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x06 Global address [17:16] to
identify P-Flash block
001 Global address [15:0] of phrase location to be programmed1
1Global address [2:0] must be 000
010 Word 0 program value
011 Word 1 program value
100 Word 2 program value
101 Word 3 program value
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 797
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.4.6.6 Program Once Command
The Program Once command restricts programming to a reserved 64 byte field (8 phrases) in the
nonvolatile information register located in P-Flash. The Program Once reserved field can be read using the
Read Once command as described in Section 23.4.6.4. The Program Once command must only be issued
once since the nonvolatile information register in P-Flash cannot be erased. The Program Once command
must not be executed from the Flash block containing the Program Once reserved field to avoid code
runaway.
Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the
selected phrase is erased. If erased, then the selected phrase will be programmed and then verified with
read back. The CCIF flag will remain clear, setting only after the Program Once operation has completed.
The reserved nonvolatile information register accessed by the Program Once command cannot be erased
and any attempt to program one of these phrases a second time will not be allowed. Valid phrase index
values for the Program Once command range from 0x0000 to 0x0007. During execution of the Program
Once command, any attempt to read addresses within P-Flash will return invalid data.
Table 23-41. Program P-Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 23-27)
Set if an invalid global address [17:0] is supplied see Table 23-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the global address [17:0] points to a protected area
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 23-42. Program Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x07 Not Required
001 Program Once phrase index (0x0000 - 0x0007)
010 Program Once word 0 value
011 Program Once word 1 value
100 Program Once word 2 value
101 Program Once word 3 value
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
798 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.4.6.7 Erase All Blocks Command
The Erase All Blocks operation will erase the entire P-Flash and EEPROM memory space.
Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire
Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash
memory space was properly erased, security will be released. During the execution of this command
(CCIF=0) the user must not write to any Flash module register. The CCIF flag will set after the Erase All
Blocks operation has completed.
23.4.6.8 Erase Flash Block Command
The Erase Flash Block operation will erase all addresses in a P-Flash or EEPROM block.
Table 23-43. Program Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 23-27)
Set if an invalid phrase index is supplied
Set if the requested phrase has already been programmed1
1If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will
be allowed to execute again on that same phrase.
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 23-44. Erase All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x08 Not required
Table 23-45. Erase All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 23-27)
FPVIOL Set if any area of the P-Flash or EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 799
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Erase Flash Block command, the Memory Controller will erase the
selected Flash block and verify that it is erased. The CCIF flag will set after the Erase Flash Block
operation has completed.
23.4.6.9 Erase P-Flash Sector Command
The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector.
Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the
selected Flash sector and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash
Sector operation has completed.
Table 23-46. Erase Flash Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x09 Global address [17:16] to
identify Flash block
001 Global address [15:0] in Flash block to be erased
Table 23-47. Erase Flash Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 23-27)
Set if an invalid global address [17:16] is supplied
Set if the supplied P-Flash address is not phrase-aligned or if the EEPROM
address is not word-aligned
FPVIOL Set if an area of the selected Flash block is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 23-48. Erase P-Flash Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0A Global address [17:16] to identify
P-Flash block to be erased
001 Global address [15:0] anywhere within the sector to be erased.
Refer to Section 23.1.2.1 for the P-Flash sector size.
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
800 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.4.6.10 Unsecure Flash Command
The Unsecure Flash command will erase the entire P-Flash and EEPROM memory space and, if the erase
is successful, will release security.
Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire
P-Flash and EEPROM memory space and verify that it is erased. If the Memory Controller verifies that
the entire Flash memory space was properly erased, security will be released. If the erase verify is not
successful, the Unsecure Flash operation sets MGSTAT1 and terminates without changing the security
state. During the execution of this command (CCIF=0) the user must not write to any Flash module
register. The CCIF flag is set after the Unsecure Flash operation has completed.
23.4.6.11 Verify Backdoor Access Key Command
The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the
FSEC register (see Table 23-10). The Verify Backdoor Access Key command releases security if
user-supplied keys match those stored in the Flash security bytes of the Flash configuration field (see
Table 23-49. Erase P-Flash Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 23-27)
Set if an invalid global address [17:16] is supplied see Table 23-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the selected P-Flash sector is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 23-50. Unsecure Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0B Not required
Table 23-51. Unsecure Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 23-27)
FPVIOL Set if any area of the P-Flash or EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 801
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 23-4). The Verify Backdoor Access Key command must not be executed from the Flash block
containing the backdoor comparison key to avoid code runaway.
Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will
check the FSEC KEYEN bits to verify that this command is enabled. If not enabled, the Memory
Controller sets the ACCERR bit in the FSTAT register and terminates. If the command is enabled, the
Memory Controller compares the key provided in FCCOB to the backdoor comparison key in the Flash
configuration field with Key 0 compared to 0x3_FF00, etc. If the backdoor keys match, security will be
released. If the backdoor keys do not match, security is not released and all future attempts to execute the
Verify Backdoor Access Key command are aborted (set ACCERR) until a reset occurs. The CCIF flag is
set after the Verify Backdoor Access Key operation has completed.
23.4.6.12 Set User Margin Level Command
The Set User Margin Level command causes the Memory Controller to set the margin level for future read
operations of the P-Flash or EEPROM block.
Table 23-52. Verify Backdoor Access Key Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0C Not required
001 Key 0
010 Key 1
011 Key 2
100 Key 3
Table 23-53. Verify Backdoor Access Key Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 100 at command launch
Set if an incorrect backdoor key is supplied
Set if backdoor key access has not been enabled (KEYEN[1:0] != 10, see
Section 23.3.2.2)
Set if the backdoor key has mismatched since the last reset
FPVIOL None
MGSTAT1 None
MGSTAT0 None
Table 23-54. Set User Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0D Flash block selection code [1:0]. See
001 Margin level setting.
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
802 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the
user margin level for the targeted block and then set the CCIF flag.
NOTE
When the EEPROM block is targeted, the EEPROM user margin levels are
applied only to the EEPROM reads. However, when the P-Flash block is
targeted, the P-Flash user margin levels are applied to both P-Flash and
EEPROM reads. It is not possible to apply user margin levels to the P-Flash
block only.
Valid margin level settings for the Set User Margin Level command are defined in Table 23-55.
NOTE
User margin levels can be used to check that Flash memory contents have
adequate margin for normal level read operations. If unexpected results are
encountered when checking Flash memory contents at user margin levels, a
potential loss of information has been detected.
Table 23-55. Valid Set User Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level1
1Read margin to the erased state
0x0002 User Margin-0 Level2
2Read margin to the programmed state
Table 23-56. Set User Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 23-27)
Set if an invalid FlashBlockSelectionCode[1:0] is supplied (See Table 23-34 )
Set if an invalid margin level setting is supplied
FPVIOL None
MGSTAT1 None
MGSTAT0 None
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 803
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.4.6.13 Set Field Margin Level Command
The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set
the margin level specified for future read operations of the P-Flash or EEPROM block.
Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the
field margin level for the targeted block and then set the CCIF flag.
NOTE
When the EEPROM block is targeted, the EEPROM field margin levels are
applied only to the EEPROM reads. However, when the P-Flash block is
targeted, the P-Flash field margin levels are applied to both P-Flash and
EEPROM reads. It is not possible to apply field margin levels to the P-Flash
block only.
Valid margin level settings for the Set Field Margin Level command are defined in Table 23-58.
Table 23-57. Set Field Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0E Flash block selection code [1:0]. See
Table 23-34
001 Margin level setting.
Table 23-58. Valid Set Field Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level1
1Read margin to the erased state
0x0002 User Margin-0 Level2
2Read margin to the programmed state
0x0003 Field Margin-1 Level1
0x0004 Field Margin-0 Level2
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
804 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
CAUTION
Field margin levels must only be used during verify of the initial factory
programming.
NOTE
Field margin levels can be used to check that Flash memory contents have
adequate margin for data retention at the normal level setting. If unexpected
results are encountered when checking Flash memory contents at field
margin levels, the Flash memory contents should be erased and
reprogrammed.
23.4.6.14 Erase Verify EEPROM Section Command
The Erase Verify EEPROM Section command will verify that a section of code in the EEPROM is erased.
The Erase Verify EEPROM Section command defines the starting point of the data to be verified and the
number of words.
Upon clearing CCIF to launch the Erase Verify EEPROM Section command, the Memory Controller will
verify the selected section of EEPROM memory is erased. The CCIF flag will set after the Erase Verify
EEPROM Section operation has completed. If the section is not erased, it means blank check failed, both
MGSTAT bits will be set.
Table 23-59. Set Field Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 23-27)
Set if an invalid FlashBlockSelectionCode[1:0] is supplied (See Table 23-34 )
Set if an invalid margin level setting is supplied
FPVIOL None
MGSTAT1 None
MGSTAT0 None
Table 23-60. Erase Verify EEPROM Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x10
Global address [17:16] to
identify the EEPROM
block
001 Global address [15:0] of the first word to be verified
010 Number of words to be verified
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 805
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.4.6.15 Program EEPROM Command
The Program EEPROM operation programs one to four previously erased words in the EEPROM block.
The Program EEPROM operation will confirm that the targeted location(s) were successfully programmed
upon completion.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
Upon clearing CCIF to launch the Program EEPROM command, the user-supplied words will be
transferred to the Memory Controller and be programmed if the area is unprotected. The CCOBIX index
value at Program EEPROM command launch determines how many words will be programmed in the
EEPROM block. The CCIF flag is set when the operation has completed.
Table 23-61. Erase Verify EEPROM Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 23-27)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested section breaches the end of the EEPROM block
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
Table 23-62. Program EEPROM Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x11 Global address [17:16] to
identify the EEPROM block
001 Global address [15:0] of word to be programmed
010 Word 0 program value
011 Word 1 program value, if desired
100 Word 2 program value, if desired
101 Word 3 program value, if desired
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
806 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.4.6.16 Erase EEPROM Sector Command
The Erase EEPROM Sector operation will erase all addresses in a sector of the EEPROM block.
Upon clearing CCIF to launch the Erase EEPROM Sector command, the Memory Controller will erase the
selected Flash sector and verify that it is erased. The CCIF flag will set after the Erase EEPROM Sector
operation has completed.
Table 23-63. Program EEPROM Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] < 010 at command launch
Set if CCOBIX[2:0] > 101 at command launch
Set if command not available in current mode (see Table 23-27)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested group of words breaches the end of the EEPROM block
FPVIOL Set if the selected area of the EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 23-64. Erase EEPROM Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x12 Global address [17:16] to identify
EEPROM block
001 Global address [15:0] anywhere within the sector to be erased.
See Section 23.1.2.2 for EEPROM sector size.
Table 23-65. Erase EEPROM Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 23-27)
Set if an invalid global address [17:0] is suppliedsee Table 23-3)
Set if a misaligned word address is supplied (global address [0] != 0)
FPVIOL Set if the selected area of the EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 807
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.4.7 Interrupts
The Flash module can generate an interrupt when a Flash command operation has completed or when a
Flash command operation has detected an ECC fault.
NOTE
Vector addresses and their relative interrupt priority are determined at the
MCU level.
23.4.7.1 Description of Flash Interrupt Operation
The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the
Flash command interrupt request. The Flash module uses the DFDIF and SFDIF flags in combination with
the DFDIE and SFDIE interrupt enable bits to generate the Flash error interrupt request. For a detailed
description of the register bits involved, refer to Section 23.3.2.5, “Flash Configuration Register
(FCNFG)”, Section 23.3.2.6, “Flash Error Configuration Register (FERCNFG)”, Section 23.3.2.7, “Flash
Status Register (FSTAT)”, and Section 23.3.2.8, “Flash Error Status Register (FERSTAT)”.
The logic used for generating the Flash module interrupts is shown in Figure 23-27.
Figure 23-27. Flash Module Interrupts Implementation
Table 23-66. Flash Interrupt Sources
Interrupt Source Interrupt Flag Local Enable Global (CCR)
Mask
Flash Command Complete CCIF
(FSTAT register)
CCIE
(FCNFG register)
I Bit
ECC Double Bit Fault on Flash Read DFDIF
(FERSTAT register)
DFDIE
(FERCNFG register)
I Bit
ECC Single Bit Fault on Flash Read SFDIF
(FERSTAT register)
SFDIE
(FERCNFG register)
I Bit
Flash Error Interrupt Request
CCIF
CCIE
DFDIF
DFDIE
SFDIF
SFDIE
Flash Command Interrupt Request
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
23.4.8 Wait Mode
The Flash module is not affected if the MCU enters wait mode. The Flash module can recover the MCU
from wait via the CCIF interrupt (see Section 23.4.7, “Interrupts”).
23.4.9 Stop Mode
If a Flash command is active (CCIF = 0) when the MCU requests stop mode, the current Flash operation
will be completed before the MCU is allowed to enter stop mode.
23.5 Security
The Flash module provides security information to the MCU. The Flash security state is defined by the
SEC bits of the FSEC register (see Table 23-11). During reset, the Flash module initializes the FSEC
register using data read from the security byte of the Flash configuration field at global address 0x3_FF0F.
The security state out of reset can be permanently changed by programming the security byte assuming
that the MCU is starting from a mode where the necessary P-Flash erase and program commands are
available and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully
programmed, its new value will take affect after the next MCU reset.
The following subsections describe these security-related subjects:
• Unsecuring the MCU using Backdoor Key Access
• Unsecuring the MCU in Special Single Chip Mode using BDM
• Mode and Security Effects on Flash Command Availability
23.5.1 Unsecuring the MCU using Backdoor Key Access
The MCU may be unsecured by using the backdoor key access feature which requires knowledge of the
contents of the backdoor keys (four 16-bit words programmed at addresses 0x3_FF00-0x3_FF07). If the
KEYEN[1:0] bits are in the enabled state (see Section 23.3.2.2), the Verify Backdoor Access Key
command (see Section 23.4.6.11) allows the user to present four prospective keys for comparison to the
keys stored in the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor
Access Key command match the backdoor keys stored in the Flash memory, the SEC bits in the FSEC
register (see Table 23-11) will be changed to unsecure the MCU. Key values of 0x0000 and 0xFFFF are
not permitted as backdoor keys. While the Verify Backdoor Access Key command is active, P-Flash
memory and EEPROM memory will not be available for read access and will return invalid data.
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 809
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an
external stimulus. This external stimulus would typically be through one of the on-chip serial ports.
If the KEYEN[1:0] bits are in the enabled state (see Section 23.3.2.2), the MCU can be unsecured by the
backdoor key access sequence described below:
1. Follow the command sequence for the Verify Backdoor Access Key command as explained in
Section 23.4.6.11
2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the
SEC[1:0] bits in the FSEC register are forced to the unsecure state of 10
The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will
prohibit future use of the Verify Backdoor Access Key command. A reset of the MCU is the only method
to re-enable the Verify Backdoor Access Key command. The security as defined in the Flash security byte
(0x3_FF0F) is not changed by using the Verify Backdoor Access Key command sequence. The backdoor
keys stored in addresses 0x3_FF00-0x3_FF07 are unaffected by the Verify Backdoor Access Key
command sequence. The Verify Backdoor Access Key command sequence has no effect on the program
and erase protections defined in the Flash protection register, FPROT.
After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is
unsecured, the sector containing the Flash security byte can be erased and the Flash security byte can be
reprogrammed to the unsecure state, if desired. In the unsecure state, the user has full control of the
contents of the backdoor keys by programming addresses 0x3_FF00-0x3_FF07 in the Flash configuration
field.
23.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM
A secured MCU can be unsecured in special single chip mode by using the following method to erase the
P-Flash and EEPROM memory:
1. Reset the MCU into special single chip mode
2. Delay while the BDM executes the Erase Verify All Blocks command write sequence to check if
the P-Flash and EEPROM memories are erased
3. Send BDM commands to disable protection in the P-Flash and EEPROM memory
4. Execute the Erase All Blocks command write sequence to erase the P-Flash and EEPROM
memory. Alternatively the Unsecure Flash command can be executed, if so the steps 5 and 6 below
are skeeped.
5. After the CCIF flag sets to indicate that the Erase All Blocks operation has completed, reset the
MCU into special single chip mode
6. Delay while the BDM executes the Erase Verify All Blocks command write sequence to verify that
the P-Flash and EEPROM memory are erased
If the P-Flash and EEPROM memory are verified as erased, the MCU will be unsecured. All BDM
commands will now be enabled and the Flash security byte may be programmed to the unsecure state by
continuing with the following steps:
7. Send BDM commands to execute the Program P-Flash command write sequence to program the
Flash security byte to the unsecured state
48 KByte Flash Module (S12FTMRG48K1V1)
MC9S12G Family Reference Manual, Rev.1.06
810 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
8. Reset the MCU
23.5.3 Mode and Security Effects on Flash Command Availability
The availability of Flash module commands depends on the MCU operating mode and security state as
shown in Table 23-27.
23.6 Initialization
On each system reset the flash module executes an initialization sequence which establishes initial values
for the Flash Block Configuration Parameters, the FPROT and EEPROT protection registers, and the FOPT
and FSEC registers. The initialization routine reverts to built-in default values that leave the module in a
fully protected and secured state if errors are encountered during execution of the reset sequence. If a
double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT register will be set.
CCIF is cleared throughout the initialization sequence. The Flash module holds off all CPU access for a
portion of the initialization sequence. Flash reads are allowed once the hold is removed. Completion of the
initialization sequence is marked by setting CCIF high which enables user commands.
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The
state of the word being programmed or the sector/block being erased is not guaranteed.
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 811
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 24
64 KByte Flash Module (S12FTMRG64K1V1)
24.1 Introduction
The FTMRG64K1 module implements the following:
• 64Kbytes of P-Flash (Program Flash) memory
• 2 Kbytes of EEPROM memory
The Flash memory is ideal for single-supply applications allowing for field reprogramming without
requiring external high voltage sources for program or erase operations. The Flash module includes a
memory controller that executes commands to modify Flash memory contents. The user interface to the
memory controller consists of the indexed Flash Common Command Object (FCCOB) register which is
written to with the command, global address, data, and any required command parameters. The memory
controller must complete the execution of a command before the FCCOB register can be written to with a
new command.
CAUTION
A Flash word or phrase must be in the erased state before being
programmed. Cumulative programming of bits within a Flash word or
phrase is not allowed.
Table 24-1. Revision History
Revision
Number
Revision
Date
Sections
Affected Description of Changes
V01.04 17 Jun 2010 24.4.6.1/24-844
24.4.6.2/24-845
24.4.6.3/24-845
24.4.6.14/24-85
5
Clarify Erase Verify Commands Descriptions related to the bits MGSTAT[1:0]
of the register FSTAT.
V01.05 20 aug 2010 24.4.6.2/24-845
24.4.6.12/24-85
2
24.4.6.13/24-85
4
Updated description of the commands RD1BLK, MLOADU and MLOADF
Rev.1.06 31 Jan 2011 24.3.2.9/24-827 Updated description of protection on Section 24.3.2.9
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 812
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The Flash memory may be read as bytes and aligned words. Read access time is one bus cycle for bytes
and aligned words. For misaligned words access, the CPU has to perform twice the byte read access
command. For Flash memory, an erased bit reads 1 and a programmed bit reads 0.
It is possible to read from P-Flash memory while some commands are executing on EEPROM memory. It
is not possible to read from EEPROM memory while a command is executing on P-Flash memory.
Simultaneous P-Flash and EEPROM operations are discussed in Section 24.4.5.
Both P-Flash and EEPROM memories are implemented with Error Correction Codes (ECC) that can
resolve single bit faults and detect double bit faults. For P-Flash memory, the ECC implementation
requires that programming be done on an aligned 8 byte basis (a Flash phrase). Since P-Flash memory is
always read by half-phrase, only one single bit fault in an aligned 4 byte half-phrase containing the byte
or word accessed will be corrected.
24.1.1 Glossary
Command Write Sequence — An MCU instruction sequence to execute built-in algorithms (including
program and erase) on the Flash memory.
EEPROM Memory — The EEPROM memory constitutes the nonvolatile memory store for data.
EEPROM Sector — The EEPROM sector is the smallest portion of the EEPROM memory that can be
erased. The EEPROM sector consists of 4 bytes.
NVM Command Mode — An NVM mode using the CPU to setup the FCCOB register to pass parameters
required for Flash command execution.
Phrase — An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes two
sets of aligned double words with each set including 7 ECC bits for single bit fault correction and double
bit fault detection within each double word.
P-Flash Memory — The P-Flash memory constitutes the main nonvolatile memory store for applications.
P-Flash Sector — The P-Flash sector is the smallest portion of the P-Flash memory that can be erased.
Each P-Flash sector contains 512 bytes.
Program IFR — Nonvolatile information register located in the P-Flash block that contains the Version
ID, and the Program Once field.
24.1.2 Features
24.1.2.1 P-Flash Features
• 64 Kbytes of P-Flash memory composed of one 64 Kbyte Flash block divided into 128 sectors of
512 bytes
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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• Single bit fault correction and double bit fault detection within a 32-bit double word during read
operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and phrase program operation
• Ability to read the P-Flash memory while programming a word in the EEPROM memory
• Flexible protection scheme to prevent accidental program or erase of P-Flash memory
24.1.2.2 EEPROM Features
• 2 Kbytes of EEPROM memory composed of one 2 Kbyte Flash block divided into 512 sectors of
4 bytes
• Single bit fault correction and double bit fault detection within a word during read operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and word program operation
• Protection scheme to prevent accidental program or erase of EEPROM memory
• Ability to program up to four words in a burst sequence
24.1.2.3 Other Flash Module Features
• No external high-voltage power supply required for Flash memory program and erase operations
• Interrupt generation on Flash command completion and Flash error detection
• Security mechanism to prevent unauthorized access to the Flash memory
24.1.3 Block Diagram
The block diagram of the Flash module is shown in Figure 24-1.
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
814 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 24-1. FTMRG64K1 Block Diagram
24.2 External Signal Description
The Flash module contains no signals that connect off-chip.
Bus
Clock
Divider
Clock
Command
Interrupt
Request
FCLK
Protection
Security
Registers
Flash
Interface
16bit
internal
bus
sector 0
sector 1
sector 127
16Kx39
P-Flash
Error
Interrupt
Request
CPU
1Kx22
sector 0
sector 1
sector 511
EEPROM
Memory Controller
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 815
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.3 Memory Map and Registers
This section describes the memory map and registers for the Flash module. Read data from unimplemented
memory space in the Flash module is undefined. Write access to unimplemented or reserved memory space
in the Flash module will be ignored by the Flash module.
CAUTION
Writing to the Flash registers while a Flash command is executing (that is
indicated when the value of flag CCIF reads as ’0’) is not allowed. If such
action is attempted the write operation will not change the register value.
Writing to the Flash registers is allowed when the Flash is not busy
executing commands (CCIF = 1) and during initialization right after reset,
despite the value of flag CCIF in that case (refer to Section 24.6 for a
complete description of the reset sequence).
.
24.3.1 Module Memory Map
The S12 architecture places the P-Flash memory between global addresses 0x3_0000 and 0x3_FFFF as
shown in Table 24-3.The P-Flash memory map is shown in Figure 24-2.
Table 24-2. FTMRG Memory Map
Global Address (in Bytes) Size
(Bytes) Description
0x0_0000 - 0x0_03FF 1,024 Register Space
0x0_0400 – 0x0_0BFF 2,048 EEPROM Memory
0x0_4000 – 0x0_7FFF 16,284 NVMRES1=1 : NVM Resource area (see Figure 24-3)
1See NVMRES description in Section 24.4.3
0x3_0000 – 0x3_FFFF 65,536 P-Flash Memory
Table 24-3. P-Flash Memory Addressing
Global Address Size
(Bytes) Description
0x3_0000 – 0x3_FFFF 64 K
P-Flash Block
Contains Flash Configuration Field
(see Table 24-4)
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
816 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The FPROT register, described in Section 24.3.2.9, can be set to protect regions in the Flash memory from
accidental program or erase. Three separate memory regions, one growing upward from global address
0x3_8000 in the Flash memory (called the lower region), one growing downward from global address
0x3_FFFF in the Flash memory (called the higher region), and the remaining addresses in the Flash
memory, can be activated for protection. The Flash memory addresses covered by these protectable regions
are shown in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader
code since it covers the vector space. Default protection settings as well as security information that allows
the MCU to restrict access to the Flash module are stored in the Flash configuration field as described in
Table 24-4.
Table 24-4. Flash Configuration Field
Global Address Size
(Bytes) Description
0x3_FF00-0x3_FF07 8
Backdoor Comparison Key
Refer to Section 24.4.6.11, “Verify Backdoor Access Key Command,” and
Section 24.5.1, “Unsecuring the MCU using Backdoor Key Access”
0x3_FF08-0x3_FF0B1
10x3FF08-0x3_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in
the 0x3_FF08 - 0x3_FF0B reserved field should be programmed to 0xFF.
4 Reserved
0x3_FF0C11P-Flash Protection byte.
Refer to Section 24.3.2.9, “P-Flash Protection Register (FPROT)”
0x3_FF0D11EEPROM Protection byte.
Refer to Section 24.3.2.10, “EEPROM Protection Register (EEPROT)”
0x3_FF0E11Flash Nonvolatile byte
Refer to Section 24.3.2.16, “Flash Option Register (FOPT)”
0x3_FF0F11Flash Security byte
Refer to Section 24.3.2.2, “Flash Security Register (FSEC)”
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 817
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 24-2. P-Flash Memory Map
Table 24-5. Program IFR Fields
Global Address Size
(Bytes) Field Description
0x0_4000 – 0x0_4007 8 Reserved
0x0_4008 – 0x0_40B5 174 Reserved
0x0_40B6 – 0x0_40B7 2 Version ID1
1Used to track firmware patch versions, see Section 24.4.2
0x0_40B8 – 0x0_40BF 8 Reserved
0x0_40C0 – 0x0_40FF 64 Program Once Field
Refer to Section 24.4.6.6, “Program Once Command”
Flash Configuration Field
0x3_C000
Flash Protected/Unprotected Lower Region
1, 2, 4, 8 Kbytes
0x3_8000
0x3_9000
0x3_8400
0x3_8800
0x3_A000
P-Flash END = 0x3_FFFF
0x3_F800
0x3_F000
0x3_E000 Flash Protected/Unprotected Higher Region
2, 4, 8, 16 Kbytes
Flash Protected/Unprotected Region
8 Kbytes (up to 29 Kbytes)
16 bytes (0x3_FF00 - 0x3_FF0F)
Flash Protected/Unprotected Region
32 Kbytes
P-Flash START = 0x3_0000
Protection
Protection
Protection
Movable End
Fixed End
Fixed End
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
818 Freescale Semiconductor
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Figure 24-3. Memory Controller Resource Memory Map (NVMRES=1)
24.3.2 Register Descriptions
The Flash module contains a set of 20 control and status registers located between Flash module base +
0x0000 and 0x0013.
In the case of the writable registers, the write accesses are forbidden during Fash command execution (for
more detail, see Caution note in Section 24.3).
Table 24-6. Memory Controller Resource Fields (NVMRES1=1)
1NVMRES - See Section 24.4.3 for NVMRES (NVM Resource) detail.
Global Address Size
(Bytes) Description
0x0_4000 – 0x040FF 256 P-Flash IFR (see Table 24-5)
0x0_4100 – 0x0_41FF 256 Reserved.
0x0_4200 – 0x0_57FF Reserved
0x0_5800 – 0x0_59FF 512 Reserved
0x0_5A00 – 0x0_5FFF 1,536 Reserved
0x0_6000 – 0x0_6BFF 3,072 Reserved
0x0_6C00 – 0x0_7FFF 5,120 Reserved
P-Flash IFR 1 Kbyte (NVMRES=1)
0x0_4000
RAM End = 0x0_59FF
RAM Start = 0x0_5800
Reserved 5120 bytes
Reserved 4608 bytes
0x0_6C00
0x0_7FFF
0x0_4400 Reserved 5k bytes
Reserved 512 bytes
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 819
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A summary of the Flash module registers is given in Figure 24-4 with detailed descriptions in the
following subsections.
Address
& Name 76543210
0x0000
FCLKDIV
R FDIVLD FDIVLCK FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0
W
0x0001
FSEC
R KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0
W
0x0002
FCCOBIX
R0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0
W
0x0003
FRSV0
R00000000
W
0x0004
FCNFG
RCCIE 00
IGNSF 00
FDFD FSFD
W
0x0005
FERCNFG
R0 0 0 0 0 0 DFDIE SFDIE
W
0x0006
FSTAT
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT1 MGSTAT0
W
0x0007
FERSTAT
R0 0 0 0 0 0 DFDIF SFDIF
W
0x0008
FPROT
RFPOPEN RNV6 FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0
W
0x0009
EEPROT
RDPOPEN 0DPS5 DPS4 DPS3 DPS2 DPS1 DPS0
W
0x000A
FCCOBHI
RCCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8
W
0x000B
FCCOBLO
RCCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0
W
0x000C
FRSV1
R00000000
W
Figure 24-4. FTMRG64K1 Register Summary
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
820 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.3.2.1 Flash Clock Divider Register (FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
All bits in the FCLKDIV register are readable, bit 7 is not writable, bit 6 is write-once-hi and controls the
writability of the FDIV field in normal mode. In special mode, bits 6-0 are writable any number of times
but bit 7 remains unwritable.
0x000D
FRSV2
R00000000
W
0x000E
FRSV3
R00000000
W
0x000F
FRSV4
R00000000
W
0x0010
FOPT
R NV7 NV6 NV5 NV4 NV3 NV2 NV1 NV0
W
0x0011
FRSV5
R00000000
W
0x0012
FRSV6
R00000000
W
0x0013
FRSV7
R00000000
W
= Unimplemented or Reserved
Offset Module Base + 0x0000
76543210
R FDIVLD FDIVLCK FDIV[5:0]
W
Reset 00000000
= Unimplemented or Reserved
Figure 24-5. Flash Clock Divider Register (FCLKDIV)
Address
& Name 76543210
Figure 24-4. FTMRG64K1 Register Summary (continued)
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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CAUTION
The FCLKDIV register should never be written while a Flash command is
executing (CCIF=0).
Table 24-7. FCLKDIV Field Descriptions
Field Description
7
FDIVLD
Clock Divider Loaded
0 FCLKDIV register has not been written since the last reset
1 FCLKDIV register has been written since the last reset
6
FDIVLCK
Clock Divider Locked
0 FDIV field is open for writing
1 FDIV value is locked and cannot be changed. Once the lock bit is set high, only reset can clear this bit and
restore writability to the FDIV field in normal mode.
5–0
FDIV[5:0]
Clock Divider Bits — FDIV[5:0] must be set to effectively divide BUSCLK down to 1 MHz to control timed events
during Flash program and erase algorithms. Table 24-8 shows recommended values for FDIV[5:0] based on the
BUSCLK frequency. Please refer to Section 24.4.4, “Flash Command Operations,” for more information.
Table 24-8. FDIV values for various BUSCLK Frequencies
BUSCLK Frequency
(MHz) FDIV[5:0]
BUSCLK Frequency
(MHz) FDIV[5:0]
MIN1
1BUSCLK is Greater Than this value.
MAX2
2BUSCLK is Less Than or Equal to this value.
MIN1MAX2
1.0 1.6 0x00 16.6 17.6 0x10
1.6 2.6 0x01 17.6 18.6 0x11
2.6 3.6 0x02 18.6 19.6 0x12
3.6 4.6 0x03 19.6 20.6 0x13
4.6 5.6 0x04 20.6 21.6 0x14
5.6 6.6 0x05 21.6 22.6 0x15
6.6 7.6 0x06 22.6 23.6 0x16
7.6 8.6 0x07 23.6 24.6 0x17
8.6 9.6 0x08 24.6 25.6 0x18
9.6 10.6 0x09
10.6 11.6 0x0A
11.6 12.6 0x0B
12.6 13.6 0x0C
13.6 14.6 0x0D
14.6 15.6 0x0E
15.6 16.6 0x0F
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
822 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.3.2.2 Flash Security Register (FSEC)
The FSEC register holds all bits associated with the security of the MCU and Flash module.
All bits in the FSEC register are readable but not writable.
During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the
Flash configuration field at global address 0x3_FF0F located in P-Flash memory (see Table 24-4) as
indicated by reset condition F in Figure 24-6. If a double bit fault is detected while reading the P-Flash
phrase containing the Flash security byte during the reset sequence, all bits in the FSEC register will be set
to leave the Flash module in a secured state with backdoor key access disabled.
Offset Module Base + 0x0001
76543210
R KEYEN[1:0] RNV[5:2] SEC[1:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 24-6. Flash Security Register (FSEC)
Table 24-9. FSEC Field Descriptions
Field Description
7–6
KEYEN[1:0]
Backdoor Key Security Enable Bits — The KEYEN[1:0] bits define the enabling of backdoor key access to the
Flash module as shown in Table 24-10.
5–2
RNV[5:2]
Reserved Nonvolatile Bits — The RNV bits should remain in the erased state for future enhancements.
1–0
SEC[1:0]
Flash Security Bits — The SEC[1:0] bits define the security state of the MCU as shown in Table 24-11. If the
Flash module is unsecured using backdoor key access, the SEC bits are forced to 10.
Table 24-10. Flash KEYEN States
KEYEN[1:0] Status of Backdoor Key Access
00 DISABLED
01 DISABLED1
1Preferred KEYEN state to disable backdoor key access.
10 ENABLED
11 DISABLED
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 823
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The security function in the Flash module is described in Section 24.5.
24.3.2.3 Flash CCOB Index Register (FCCOBIX)
The FCCOBIX register is used to index the FCCOB register for Flash memory operations.
CCOBIX bits are readable and writable while remaining bits read 0 and are not writable.
24.3.2.4 Flash Reserved0 Register (FRSV0)
This Flash register is reserved for factory testing.
All bits in the FRSV0 register read 0 and are not writable.
Table 24-11. Flash Security States
SEC[1:0] Status of Security
00 SECURED
01 SECURED1
1Preferred SEC state to set MCU to secured state.
10 UNSECURED
11 SECURED
Offset Module Base + 0x0002
76543210
R00000 CCOBIX[2:0]
W
Reset 00000000
= Unimplemented or Reserved
Figure 24-7. FCCOB Index Register (FCCOBIX)
Table 24-12. FCCOBIX Field Descriptions
Field Description
2–0
CCOBIX[1:0]
Common Command Register Index— The CCOBIX bits are used to select which word of the FCCOB register
array is being read or written to. See <st-blue>24.3.2.11 Flash Common Command Object Register (FCCOB),”
for more details.
Offset Module Base + 0x000C
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 24-8. Flash Reserved0 Register (FRSV0)
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
824 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.3.2.5 Flash Configuration Register (FCNFG)
The FCNFG register enables the Flash command complete interrupt and forces ECC faults on Flash array
read access from the CPU.
CCIE, IGNSF, FDFD, and FSFD bits are readable and writable while remaining bits read 0 and are not
writable.
24.3.2.6 Flash Error Configuration Register (FERCNFG)
The FERCNFG register enables the Flash error interrupts for the FERSTAT flags.
Offset Module Base + 0x0004
76543210
RCCIE 00
IGNSF 00
FDFD FSFD
W
Reset 00000000
= Unimplemented or Reserved
Figure 24-9. Flash Configuration Register (FCNFG)
Table 24-13. FCNFG Field Descriptions
Field Description
7
CCIE
Command Complete Interrupt Enable — The CCIE bit controls interrupt generation when a Flash command
has completed.
0 Command complete interrupt disabled
1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see Section 24.3.2.7)
4
IGNSF
Ignore Single Bit Fault — The IGNSF controls single bit fault reporting in the FERSTAT register (see
Section 24.3.2.8).
0 All single bit faults detected during array reads are reported
1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be
generated
1
FDFD
Force Double Bit Fault Detect — The FDFD bit allows the user to simulate a double bit fault during Flash array
read operations and check the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD.
0 Flash array read operations will set the DFDIF flag in the FERSTAT register only if a double bit fault is detected
1 Any Flash array read operation will force the DFDIF flag in the FERSTAT register to be set (see
Section 24.3.2.7) and an interrupt will be generated as long as the DFDIE interrupt enable in the FERCNFG
register is set (see Section 24.3.2.6)
0
FSFD
Force Single Bit Fault Detect —The FSFD bit allows the user to simulate a single bit fault during Flash array
read operations and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD.
0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected
1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see Section 24.3.2.7)
and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set (see
Section 24.3.2.6)
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 825
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All assigned bits in the FERCNFG register are readable and writable.
24.3.2.7 Flash Status Register (FSTAT)
The FSTAT register reports the operational status of the Flash module.
CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable
but not writable, while remaining bits read 0 and are not writable.
Offset Module Base + 0x0005
76543210
R000000
DFDIE SFDIE
W
Reset 00000000
= Unimplemented or Reserved
Figure 24-10. Flash Error Configuration Register (FERCNFG)
Table 24-14. FERCNFG Field Descriptions
Field Description
1
DFDIE
Double Bit Fault Detect Interrupt Enable — The DFDIE bit controls interrupt generation when a double bit fault
is detected during a Flash block read operation.
0 DFDIF interrupt disabled
1 An interrupt will be requested whenever the DFDIF flag is set (see Section 24.3.2.8)
0
SFDIE
Single Bit Fault Detect Interrupt Enable — The SFDIE bit controls interrupt generation when a single bit fault
is detected during a Flash block read operation.
0 SFDIF interrupt disabled whenever the SFDIF flag is set (see Section 24.3.2.8)
1 An interrupt will be requested whenever the SFDIF flag is set (see Section 24.3.2.8)
Offset Module Base + 0x0006
76543210
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT[1:0]
W
Reset 1000000
1
1Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see Section 24.6).
01
= Unimplemented or Reserved
Figure 24-11. Flash Status Register (FSTAT)
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
826 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.3.2.8 Flash Error Status Register (FERSTAT)
The FERSTAT register reflects the error status of internal Flash operations.
All flags in the FERSTAT register are readable and only writable to clear the flag.
Table 24-15. FSTAT Field Descriptions
Field Description
7
CCIF
Command Complete Interrupt Flag — The CCIF flag indicates that a Flash command has completed. The
CCIF flag is cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command
completion or command violation.
0 Flash command in progress
1 Flash command has completed
5
ACCERR
Flash Access Error Flag — The ACCERR bit indicates an illegal access has occurred to the Flash memory
caused by either a violation of the command write sequence (see Section 24.4.4.2) or issuing an illegal Flash
command. While ACCERR is set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is
cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR bit has no effect on ACCERR.
0 No access error detected
1 Access error detected
4
FPVIOL
Flash Protection Violation Flag —The FPVIOL bit indicates an attempt was made to program or erase an
address in a protected area of P-Flash or EEPROM memory during a command write sequence. The FPVIOL
bit is cleared by writing a 1 to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL
is set, it is not possible to launch a command or start a command write sequence.
0 No protection violation detected
1 Protection violation detected
3
MGBUSY
Memory Controller Busy Flag — The MGBUSY flag reflects the active state of the Memory Controller.
0 Memory Controller is idle
1 Memory Controller is busy executing a Flash command (CCIF = 0)
2
RSVD
Reserved Bit — This bit is reserved and always reads 0.
1–0
MGSTAT[1:0]
Memory Controller Command Completion Status Flag — One or more MGSTAT flag bits are set if an error
is detected during execution of a Flash command or during the Flash reset sequence. See Section 24.4.6,
“Flash Command Description,” and Section 24.6, “Initialization” for details.
Offset Module Base + 0x0007
76543210
R000000
DFDIF SFDIF
W
Reset 00000000
= Unimplemented or Reserved
Figure 24-12. Flash Error Status Register (FERSTAT)
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 827
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.3.2.9 P-Flash Protection Register (FPROT)
The FPROT register defines which P-Flash sectors are protected against program and erase operations.
The (unreserved) bits of the FPROT register are writable with the restriction that the size of the protected
region can only be increased (see Section 24.3.2.9.1, “P-Flash Protection Restrictions,” and Table 24-21).
During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte
in the Flash configuration field at global address 0x3_FF0C located in P-Flash memory (see Table 24-4)
as indicated by reset condition ‘F’ in Figure 24-13. To change the P-Flash protection that will be loaded
during the reset sequence, the upper sector of the P-Flash memory must be unprotected, then the P-Flash
protection byte must be reprogrammed. If a double bit fault is detected while reading the P-Flash phrase
containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and
remaining bits in the FPROT register will be set to leave the P-Flash memory fully protected.
Table 24-16. FERSTAT Field Descriptions
Field Description
1
DFDIF
Double Bit Fault Detect Interrupt Flag — The setting of the DFDIF flag indicates that a double bit fault was
detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation
returning invalid data was attempted on a Flash block that was under a Flash command operation.1The DFDIF
flag is cleared by writing a 1 to DFDIF. Writing a 0 to DFDIF has no effect on DFDIF.2
0 No double bit fault detected
1 Double bit fault detected or a Flash array read operation returning invalid data was attempted while command
running
1 The single bit fault and double bit fault flags are mutually exclusive for parity errors (an ECC fault occurrence can be either
single fault or double fault but never both). A simultaneous access collision (Flash array read operation returning invalid data
attempted while command running) is indicated when both SFDIF and DFDIF flags are high.
2There is a one cycle delay in storing the ECC DFDIF and SFDIF fault flags in this register. At least one NOP is required after
a flash memory read before checking FERSTAT for the occurrence of ECC errors.
0
SFDIF
Single Bit Fault Detect Interrupt Flag — With the IGNSF bit in the FCNFG register clear, the SFDIF flag
indicates that a single bit fault was detected in the stored parity and data bits during a Flash array read operation
or that a Flash array read operation returning invalid data was attempted on a Flash block that was under a Flash
command operation.1 The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on
SFDIF.
0 No single bit fault detected
1 Single bit fault detected and corrected or a Flash array read operation returning invalid data was attempted
while command running
Offset Module Base + 0x0008
76543210
RFPOPEN RNV6 FPHDIS FPHS[1:0] FPLDIS FPLS[1:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 24-13. Flash Protection Register (FPROT)
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
828 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error
and the FPVIOL bit will be set in the FSTAT register. The block erase of a P-Flash block is not possible if
any of the P-Flash sectors contained in the same P-Flash block are protected.
Table 24-17. FPROT Field Descriptions
Field Description
7
FPOPEN
Flash Protection Operation Enable — The FPOPEN bit determines the protection function for program or
erase operations as shown in Table 24-18 for the P-Flash block.
0 When FPOPEN is clear, the FPHDIS and FPLDIS bits define unprotected address ranges as specified by the
corresponding FPHS and FPLS bits
1 When FPOPEN is set, the FPHDIS and FPLDIS bits enable protection for the address range specified by the
corresponding FPHS and FPLS bits
6
RNV[6]
Reserved Nonvolatile Bit — The RNV bit should remain in the erased state for future enhancements.
5
FPHDIS
Flash Protection Higher Address Range Disable — The FPHDIS bit determines whether there is a
protected/unprotected area in a specific region of the P-Flash memory ending with global address 0x3_FFFF.
0 Protection/Unprotection enabled
1 Protection/Unprotection disabled
4–3
FPHS[1:0]
Flash Protection Higher Address Size — The FPHS bits determine the size of the protected/unprotected area
in P-Flash memory as shown inTable 24-19. The FPHS bits can only be written to while the FPHDIS bit is set.
2
FPLDIS
Flash Protection Lower Address Range Disable — The FPLDIS bit determines whether there is a
protected/unprotected area in a specific region of the P-Flash memory beginning with global address 0x3_8000.
0 Protection/Unprotection enabled
1 Protection/Unprotection disabled
1–0
FPLS[1:0]
Flash Protection Lower Address Size — The FPLS bits determine the size of the protected/unprotected area
in P-Flash memory as shown in Table 24-20. The FPLS bits can only be written to while the FPLDIS bit is set.
Table 24-18. P-Flash Protection Function
FPOPEN FPHDIS FPLDIS Function1
1For range sizes, refer to Table 24-19 and Table 24-20.
1 1 1 No P-Flash Protection
1 1 0 Protected Low Range
1 0 1 Protected High Range
1 0 0 Protected High and Low Ranges
0 1 1 Full P-Flash Memory Protected
0 1 0 Unprotected Low Range
0 0 1 Unprotected High Range
0 0 0 Unprotected High and Low Ranges
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 829
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All possible P-Flash protection scenarios are shown in Figure 24-14 . Although the protection scheme is
loaded from the Flash memory at global address 0x3_FF0C during the reset sequence, it can be changed
by the user. The P-Flash protection scheme can be used by applications requiring reprogramming in single
chip mode while providing as much protection as possible if reprogramming is not required.
Table 24-19. P-Flash Protection Higher Address Range
FPHS[1:0] Global Address Range Protected Size
00 0x3_F800–0x3_FFFF 2 Kbytes
01 0x3_F000–0x3_FFFF 4 Kbytes
10 0x3_E000–0x3_FFFF 8 Kbytes
11 0x3_C000–0x3_FFFF 16 Kbytes
Table 24-20. P-Flash Protection Lower Address Range
FPLS[1:0] Global Address Range Protected Size
00 0x3_8000–0x3_83FF 1 Kbyte
01 0x3_8000–0x3_87FF 2 Kbytes
10 0x3_8000–0x3_8FFF 4 Kbytes
11 0x3_8000–0x3_9FFF 8 Kbytes
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
830 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 24-14. P-Flash Protection Scenarios
7654
FPHS[1:0] FPLS[1:0]
3210
FPHS[1:0] FPLS[1:0]
FPHDIS = 1
FPLDIS = 1
FPHDIS = 1
FPLDIS = 0
FPHDIS = 0
FPLDIS = 1
FPHDIS = 0
FPLDIS = 0
Scenario
Scenario
Unprotected region Protected region with size
Protected region Protected region with size
defined by FPLS
defined by FPHSnot defined by FPLS, FPHS
0x3_8000
0x3_FFFF
0x3_8000
0x3_FFFF
FLASH START
FLASH START
FPOPEN = 1FPOPEN = 0
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 831
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.3.2.9.1 P-Flash Protection Restrictions
The general guideline is that P-Flash protection can only be added and not removed. Table 24-21 specifies
all valid transitions between P-Flash protection scenarios. Any attempt to write an invalid scenario to the
FPROT register will be ignored. The contents of the FPROT register reflect the active protection scenario.
See the FPHS and FPLS bit descriptions for additional restrictions.
24.3.2.10 EEPROM Protection Register (EEPROT)
The EEPROT register defines which EEPROM sectors are protected against program and erase operations.
The (unreserved) bits of the EEPROT register are writable with the restriction that protection can be added
but not removed. Writes must increase the DPS value and the DPOPEN bit can only be written from 1
(protection disabled) to 0 (protection enabled). If the DPOPEN bit is set, the state of the DPS bits is
irrelevant.
Table 24-21. P-Flash Protection Scenario Transitions
From
Protection
Scenario
To Protection Scenario1
1Allowed transitions marked with X, see Figure 24-14 for a definition of the scenarios.
01234567
0XXXX
1XX
2XX
3X
4XX
5XXXX
6XXXX
7XXXXXXXX
Offset Module Base + 0x0009
76543210
RDPOPEN 0DPS[5:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
0F
1F1F1F1F1F1
= Unimplemented or Reserved
Figure 24-15. EEPROM Protection Register (EEPROT)
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
832 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
During the reset sequence, fields DPOPEN and DPS of the EEPROT register are loaded with the contents
of the EEPROM protection byte in the Flash configuration field at global address 0x3_FF0D located in
P-Flash memory (see Table 24-4) as indicated by reset condition F in Table 24-23. To change the
EEPROM protection that will be loaded during the reset sequence, the P-Flash sector containing the
EEPROM protection byte must be unprotected, then the EEPROM protection byte must be programmed.
If a double bit fault is detected while reading the P-Flash phrase containing the EEPROM protection byte
during the reset sequence, the DPOPEN bit will be cleared and DPS bits will be set to leave the EEPROM
memory fully protected.
Trying to alter data in any protected area in the EEPROM memory will result in a protection violation error
and the FPVIOL bit will be set in the FSTAT register. Block erase of the EEPROM memory is not possible
if any of the EEPROM sectors are protected.
Table 24-22. EEPROT Field Descriptions
Field Description
7
DPOPEN
EEPROM Protection Control
0 Enables EEPROM memory protection from program and erase with protected address range defined by DPS
bits
1 Disables EEPROM memory protection from program and erase
5–0
DPS[5:0]
EEPROM Protection Size — The DPS[5:0] bits determine the size of the protected area in the EEPROM
memory as shown in Table 24-23 .
Table 24-23. EEPROM Protection Address Range
DPS[5:0] Global Address Range Protected Size
000000 0x0_0400 – 0x0_041F 32 bytes
000001 0x0_0400 – 0x0_043F 64 bytes
000010 0x0_0400 – 0x0_045F 96 bytes
000011 0x0_0400 – 0x0_047F 128 bytes
000100 0x0_0400 – 0x0_049F 160 bytes
000101 0x0_0400 – 0x0_04BF 192 bytes
The Protection Size goes on enlarging in step of 32 bytes, for each DPS value
increasing of one.
.
.
.
111111 0x0_0400 – 0x0_0BFF 2,048 bytes
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 833
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.3.2.11 Flash Common Command Object Register (FCCOB)
The FCCOB is an array of six words addressed via the CCOBIX index found in the FCCOBIX register.
Byte wide reads and writes are allowed to the FCCOB register.
24.3.2.11.1 FCCOB - NVM Command Mode
NVM command mode uses the indexed FCCOB register to provide a command code and its relevant
parameters to the Memory Controller. The user first sets up all required FCCOB fields and then initiates
the command’s execution by writing a 1 to the CCIF bit in the FSTAT register (a 1 written by the user clears
the CCIF command completion flag to 0). When the user clears the CCIF bit in the FSTAT register all
FCCOB parameter fields are locked and cannot be changed by the user until the command completes (as
evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the
FCCOB register array.
The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 24-24. The
return values are available for reading after the CCIF flag in the FSTAT register has been returned to 1 by
the Memory Controller. Writes to the unimplemented parameter fields (CCOBIX = 110 and CCOBIX =
111) are ignored with reads from these fields returning 0x0000.
Table 24-24 shows the generic Flash command format. The high byte of the first word in the CCOB array
contains the command code, followed by the parameters for this specific Flash command. For details on
the FCCOB settings required by each command, see the Flash command descriptions in Section 24.4.6.
Offset Module Base + 0x000A
76543210
RCCOB[15:8]
W
Reset 00000000
Figure 24-16. Flash Common Command Object High Register (FCCOBHI)
Offset Module Base + 0x000B
76543210
RCCOB[7:0]
W
Reset 00000000
Figure 24-17. Flash Common Command Object Low Register (FCCOBLO)
Table 24-24. FCCOB - NVM Command Mode (Typical Usage)
CCOBIX[2:0] Byte FCCOB Parameter Fields (NVM Command Mode)
000 HI FCMD[7:0] defining Flash command
LO 6’h0, Global address [17:16]
001 HI Global address [15:8]
LO Global address [7:0]
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
834 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.3.2.12 Flash Reserved1 Register (FRSV1)
This Flash register is reserved for factory testing.
All bits in the FRSV1 register read 0 and are not writable.
24.3.2.13 Flash Reserved2 Register (FRSV2)
This Flash register is reserved for factory testing.
All bits in the FRSV2 register read 0 and are not writable.
24.3.2.14 Flash Reserved3 Register (FRSV3)
This Flash register is reserved for factory testing.
010 HI Data 0 [15:8]
LO Data 0 [7:0]
011 HI Data 1 [15:8]
LO Data 1 [7:0]
100 HI Data 2 [15:8]
LO Data 2 [7:0]
101 HI Data 3 [15:8]
LO Data 3 [7:0]
Offset Module Base + 0x000C
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 24-18. Flash Reserved1 Register (FRSV1)
Offset Module Base + 0x000D
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 24-19. Flash Reserved2 Register (FRSV2)
Table 24-24. FCCOB - NVM Command Mode (Typical Usage)
CCOBIX[2:0] Byte FCCOB Parameter Fields (NVM Command Mode)
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 835
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FRSV3 register read 0 and are not writable.
24.3.2.15 Flash Reserved4 Register (FRSV4)
This Flash register is reserved for factory testing.
All bits in the FRSV4 register read 0 and are not writable.
24.3.2.16 Flash Option Register (FOPT)
The FOPT register is the Flash option register.
All bits in the FOPT register are readable but are not writable.
During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash
configuration field at global address 0x3_FF0E located in P-Flash memory (see Table 24-4) as indicated
by reset condition F in Figure 24-22. If a double bit fault is detected while reading the P-Flash phrase
containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT register will be set.
Offset Module Base + 0x000E
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 24-20. Flash Reserved3 Register (FRSV3)
Offset Module Base + 0x000F
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 24-21. Flash Reserved4 Register (FRSV4)
Offset Module Base + 0x0010
76543210
R NV[7:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 24-22. Flash Option Register (FOPT)
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
836 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.3.2.17 Flash Reserved5 Register (FRSV5)
This Flash register is reserved for factory testing.
All bits in the FRSV5 register read 0 and are not writable.
24.3.2.18 Flash Reserved6 Register (FRSV6)
This Flash register is reserved for factory testing.
All bits in the FRSV6 register read 0 and are not writable.
24.3.2.19 Flash Reserved7 Register (FRSV7)
This Flash register is reserved for factory testing.
Table 24-25. FOPT Field Descriptions
Field Description
7–0
NV[7:0]
Nonvolatile Bits — The NV[7:0] bits are available as nonvolatile bits. Refer to the device user guide for proper
use of the NV bits.
Offset Module Base + 0x0011
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 24-23. Flash Reserved5 Register (FRSV5)
Offset Module Base + 0x0012
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 24-24. Flash Reserved6 Register (FRSV6)
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 837
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FRSV7 register read 0 and are not writable.
24.4 Functional Description
24.4.1 Modes of Operation
The FTMRG64K1 module provides the modes of operation normal and special . The operating mode is
determined by module-level inputs and affects the FCLKDIV, FCNFG, and EEPROT registers (see
Table 24-27).
24.4.2 IFR Version ID Word
The version ID word is stored in the IFR at address 0x0_40B6. The contents of the word are defined in
Table 24-26.
• VERNUM: Version number. The first version is number 0b_0001 with both 0b_0000 and 0b_1111
meaning ‘none’.
Offset Module Base + 0x0013
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 24-25. Flash Reserved7 Register (FRSV7)
Table 24-26. IFR Version ID Fields
[15:4] [3:0]
Reserved VERNUM
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
838 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.4.3 Internal NVM resource (NVMRES)
IFR is an internal NVM resource readable by CPU , when NVMRES is active. The IFR fields are shown
in Table 24-5.
The NVMRES global address map is shown in Table 24-6.
24.4.4 Flash Command Operations
Flash command operations are used to modify Flash memory contents.
The next sections describe:
• How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from
BUSCLK for Flash program and erase command operations
• The command write sequence used to set Flash command parameters and launch execution
• Valid Flash commands available for execution, according to MCU functional mode and MCU
security state.
24.4.4.1 Writing the FCLKDIV Register
Prior to issuing any Flash program or erase command after a reset, the user is required to write the
FCLKDIV register to divide BUSCLK down to a target FCLK of 1 MHz. Table 24-8 shows recommended
values for the FDIV field based on BUSCLK frequency.
NOTE
Programming or erasing the Flash memory cannot be performed if the bus
clock runs at less than 0.8 MHz. Setting FDIV too high can destroy the Flash
memory due to overstress. Setting FDIV too low can result in incomplete
programming or erasure of the Flash memory cells.
When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the
FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written,
any Flash program or erase command loaded during a command write sequence will not execute and the
ACCERR bit in the FSTAT register will set.
24.4.4.2 Command Write Sequence
The Memory Controller will launch all valid Flash commands entered using a command write sequence.
Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see
Section 24.3.2.7) and the CCIF flag should be tested to determine the status of the current command write
sequence. If CCIF is 0, the previous command write sequence is still active, a new command write
sequence cannot be started, and all writes to the FCCOB register are ignored.
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 839
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.4.4.2.1 Define FCCOB Contents
The FCCOB parameter fields must be loaded with all required parameters for the Flash command being
executed. Access to the FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX
register (see Section 24.3.2.3).
The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears
the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag
will remain clear until the Flash command has completed. Upon completion, the Memory Controller will
return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic
command write sequence is shown in Figure 24-26.
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
840 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 24-26. Generic Flash Command Write Sequence Flowchart
Write to FCCOBIX register
Write: FSTAT register (to launch command)
Clear CCIF 0x80
Clear ACCERR/FPVIOL 0x30
Write: FSTAT register
yes
no
Access Error and
Protection Violation
Read: FSTAT register
START
Check
FCCOB
ACCERR/
FPVIOL
Set?
EXIT
Write: FCLKDIV register
Read: FCLKDIV register
yes
no
FDIV
Correct?
no
Bit Polling for
Command Completion
Check
yes
CCIF Set?
to identify specific command
parameter to load.
Write to FCCOB register
to load required command parameter.
yes
no
More
Parameters?
Availability Check
Results from previous Command
Note: FCLKDIV must be
set after each reset
Read: FSTAT register
no
yes
CCIF
Set?
no
yes
CCIF
Set?
Clock Divider
Value Check Read: FSTAT register
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 841
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.4.4.3 Valid Flash Module Commands
Table 24-27 present the valid Flash commands, as enabled by the combination of the functional MCU
mode (Normal SingleChip NS, Special Singlechip SS) with the MCU security state (Unsecured, Secured).
Special Singlechip mode is selected by input mmc_ss_mode_ts2 asserted. MCU Secured state is selected
by input mmc_secure input asserted.
+
24.4.4.4 P-Flash Commands
Table 24-28 summarizes the valid P-Flash commands along with the effects of the commands on the
P-Flash block and other resources within the Flash module.
Table 24-27. Flash Commands by Mode and Security State
FCMD Command
Unsecured Secured
NS1
1Unsecured Normal Single Chip mode
SS2
2Unsecured Special Single Chip mode.
NS3
3Secured Normal Single Chip mode.
SS4
4Secured Special Single Chip mode.
0x01 Erase Verify All Blocks ∗∗∗∗
0x02 Erase Verify Block ∗∗∗∗
0x03 Erase Verify P-Flash Section ∗∗∗
0x04 Read Once ∗∗∗
0x06 Program P-Flash ∗∗∗
0x07 Program Once ∗∗∗
0x08 Erase All Blocks ∗∗
0x09 Erase Flash Block ∗∗∗
0x0A Erase P-Flash Sector ∗∗∗
0x0B Unsecure Flash ∗∗
0x0C Verify Backdoor Access Key ∗∗
0x0D Set User Margin Level ∗∗∗
0x0E Set Field Margin Level ∗
0x10 Erase Verify EEPROM Section ∗∗∗
0x11 Program EEPROM ∗∗∗
0x12 Erase EEPROM Sector ∗∗∗
Table 24-28. P-Flash Commands
FCMD Command Function on P-Flash Memory
0x01 Erase Verify All
Blocks
Verify that all P-Flash (and EEPROM) blocks are erased.
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
842 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.4.4.5 EEPROM Commands
Table 24-29 summarizes the valid EEPROM commands along with the effects of the commands on the
EEPROM block.
0x02 Erase Verify Block Verify that a P-Flash block is erased.
0x03 Erase Verify
P-Flash Section
Verify that a given number of words starting at the address provided are erased.
0x04 Read Once Read a dedicated 64 byte field in the nonvolatile information register in P-Flash block that
was previously programmed using the Program Once command.
0x06 Program P-Flash Program a phrase in a P-Flash block.
0x07 Program Once Program a dedicated 64 byte field in the nonvolatile information register in P-Flash block
that is allowed to be programmed only once.
0x08 Erase All Blocks
Erase all P-Flash (and EEPROM) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN
bits in the FPROT register and the DPOPEN bit in the EEPROT register are set prior to
launching the command.
0x09 Erase Flash Block
Erase a P-Flash (or EEPROM) block.
An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN
bits in the FPROT register are set prior to launching the command.
0x0A Erase P-Flash
Sector
Erase all bytes in a P-Flash sector.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all P-Flash (and EEPROM)
blocks and verifying that all P-Flash (and EEPROM) blocks are erased.
0x0C Verify Backdoor
Access Key
Supports a method of releasing MCU security by verifying a set of security keys.
0x0D Set User Margin
Level
Specifies a user margin read level for all P-Flash blocks.
0x0E Set Field Margin
Level
Specifies a field margin read level for all P-Flash blocks (special modes only).
Table 24-29. EEPROM Commands
FCMD Command Function on EEPROM Memory
0x01 Erase Verify All
Blocks
Verify that all EEPROM (and P-Flash) blocks are erased.
0x02 Erase Verify Block Verify that the EEPROM block is erased.
Table 24-28. P-Flash Commands
FCMD Command Function on P-Flash Memory
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 843
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.4.5 Allowed Simultaneous P-Flash and EEPROM Operations
Only the operations marked ‘OK’ in Table 24-30 are permitted to be run simultaneously on the Program
Flash and EEPROM blocks. Some operations cannot be executed simultaneously because certain hardware
resources are shared by the two memories. The priority has been placed on permitting Program Flash reads
while program and erase operations execute on the EEPROM, providing read (P-Flash) while write
(EEPROM) functionality.
0x08 Erase All Blocks
Erase all EEPROM (and P-Flash) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN
bits in the FPROT register and the DPOPEN bit in the EEPROT register are set prior to
launching the command.
0x09 Erase Flash Block
Erase a EEPROM (or P-Flash) block.
An erase of the full EEPROM block is only possible when DPOPEN bit in the EEPROT
register is set prior to launching the command.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all EEPROM (and P-Flash)
blocks and verifying that all EEPROM (and P-Flash) blocks are erased.
0x0D Set User Margin
Level
Specifies a user margin read level for the EEPROM block.
0x0E Set Field Margin
Level
Specifies a field margin read level for the EEPROM block (special modes only).
0x10 Erase Verify
EEPROM Section
Verify that a given number of words starting at the address provided are erased.
0x11 Program
EEPROM
Program up to four words in the EEPROM block.
0x12 Erase EEPROM
Sector
Erase all bytes in a sector of the EEPROM block.
Table 24-30. Allowed P-Flash and EEPROM Simultaneous Operations
EEPROM
Program Flash Read Margin
Read1Program Sector
Erase
Mass
Erase2
Read OK OK OK
Margin Read1
1A ‘Margin Read’ is any read after executing the margin setting commands
‘Set User Margin Level’ or ‘Set Field Margin Level’ with anything but the
‘normal’ level specified. See the Note on margin settings in Section 24.4.6.12
and Section 24.4.6.13.
Program
Sector Erase
Mass Erase2
2The ‘Mass Erase’ operations are commands ‘Erase All Blocks’ and ‘Erase
Flash Block’
OK
Table 24-29. EEPROM Commands
FCMD Command Function on EEPROM Memory
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
844 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.4.6 Flash Command Description
This section provides details of all available Flash commands launched by a command write sequence. The
ACCERR bit in the FSTAT register will be set during the command write sequence if any of the following
illegal steps are performed, causing the command not to be processed by the Memory Controller:
• Starting any command write sequence that programs or erases Flash memory before initializing the
FCLKDIV register
• Writing an invalid command as part of the command write sequence
• For additional possible errors, refer to the error handling table provided for each command
If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation
will return invalid data if both flags SFDIF and DFDIF are set. If the SFDIF or DFDIF flags were not
previously set when the invalid read operation occurred, both the SFDIF and DFDIF flags will be set.
If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting
any command write sequence (see Section 24.3.2.7).
CAUTION
A Flash word or phrase must be in the erased state before being
programmed. Cumulative programming of bits within a Flash word or
phrase is not allowed.
24.4.6.1 Erase Verify All Blocks Command
The Erase Verify All Blocks command will verify that all P-Flash and EEPROM blocks have been erased.
Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify
that the entire Flash memory space is erased. The CCIF flag will set after the Erase Verify All Blocks
operation has completed. If all blocks are not erased, it means blank check failed, both MGSTAT bits will
be set.
Table 24-31. Erase Verify All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x01 Not required
Table 24-32. Erase Verify All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the reador if blank check failed .
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 845
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.4.6.2 Erase Verify Block Command
The Erase Verify Block command allows the user to verify that an entire P-Flash or EEPROM block has
been erased. The FCCOB FlashBlockSelectionCode[1:0] bits determine which block must be verified.
Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that
the selected P-Flash or EEPROM block is erased. The CCIF flag will set after the Erase Verify Block
operation has completed.If the block is not erased, it means blank check failed, both MGSTAT bits will be
set.
24.4.6.3 Erase Verify P-Flash Section Command
The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is
erased. The Erase Verify P-Flash Section command defines the starting point of the code to be verified and
the number of phrases.
Table 24-33. Erase Verify Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x02
Flash block
selection code [1:0]. See
Table 24-34
Table 24-34. Flash block selection code description
Selection code[1:0] Flash block to be verified
00 EEPROM
01 Invalid (ACCERR)
10 Invalid (ACCERR)
11 P-Flash
Table 24-35. Erase Verify Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if an invalid FlashBlockSelectionCode[1:0] is supplied
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
846 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will
verify the selected section of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash
Section operation has completed. If the section is not erased, it means blank check failed, both MGSTAT
bits will be set.
24.4.6.4 Read Once Command
The Read Once command provides read access to a reserved 64 byte field (8 phrases) located in the
nonvolatile information register of P-Flash. The Read Once field is programmed using the Program Once
command described in Section 24.4.6.6. The Read Once command must not be executed from the Flash
block containing the Program Once reserved field to avoid code runaway.
Table 24-36. Erase Verify P-Flash Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x03 Global address [17:16] of
a P-Flash block
001 Global address [15:0] of the first phrase to be verified
010 Number of phrases to be verified
Table 24-37. Erase Verify P-Flash Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 24-27)
Set if an invalid global address [17:0] is supplied see Table 24-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
Set if the requested section crosses a the P-Flash address boundary
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
Table 24-38. Read Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x04 Not Required
001 Read Once phrase index (0x0000 - 0x0007)
010 Read Once word 0 value
011 Read Once word 1 value
100 Read Once word 2 value
101 Read Once word 3 value
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 847
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the
FCCOB indexed register. The CCIF flag will set after the Read Once operation has completed. Valid
phrase index values for the Read Once command range from 0x0000 to 0x0007. During execution of the
Read Once command, any attempt to read addresses within P-Flash block will return invalid data.
8
24.4.6.5 Program P-Flash Command
The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an
embedded algorithm.
CAUTION
A P-Flash phrase must be in the erased state before being programmed.
Cumulative programming of bits within a Flash phrase is not allowed.
Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the
data words to the supplied global address and will then proceed to verify the data words read back as
expected. The CCIF flag will set after the Program P-Flash operation has completed.
Table 24-39. Read Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 24-27)
Set if an invalid phrase index is supplied
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read
MGSTAT0 Set if any non-correctable errors have been encountered during the read
Table 24-40. Program P-Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x06 Global address [17:16] to
identify P-Flash block
001 Global address [15:0] of phrase location to be programmed1
1Global address [2:0] must be 000
010 Word 0 program value
011 Word 1 program value
100 Word 2 program value
101 Word 3 program value
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
848 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.4.6.6 Program Once Command
The Program Once command restricts programming to a reserved 64 byte field (8 phrases) in the
nonvolatile information register located in P-Flash. The Program Once reserved field can be read using the
Read Once command as described in Section 24.4.6.4. The Program Once command must only be issued
once since the nonvolatile information register in P-Flash cannot be erased. The Program Once command
must not be executed from the Flash block containing the Program Once reserved field to avoid code
runaway.
Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the
selected phrase is erased. If erased, then the selected phrase will be programmed and then verified with
read back. The CCIF flag will remain clear, setting only after the Program Once operation has completed.
The reserved nonvolatile information register accessed by the Program Once command cannot be erased
and any attempt to program one of these phrases a second time will not be allowed. Valid phrase index
values for the Program Once command range from 0x0000 to 0x0007. During execution of the Program
Once command, any attempt to read addresses within P-Flash will return invalid data.
Table 24-41. Program P-Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 24-27)
Set if an invalid global address [17:0] is supplied see Table 24-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the global address [17:0] points to a protected area
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 24-42. Program Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x07 Not Required
001 Program Once phrase index (0x0000 - 0x0007)
010 Program Once word 0 value
011 Program Once word 1 value
100 Program Once word 2 value
101 Program Once word 3 value
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 849
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.4.6.7 Erase All Blocks Command
The Erase All Blocks operation will erase the entire P-Flash and EEPROM memory space.
Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire
Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash
memory space was properly erased, security will be released. During the execution of this command
(CCIF=0) the user must not write to any Flash module register. The CCIF flag will set after the Erase All
Blocks operation has completed.
24.4.6.8 Erase Flash Block Command
The Erase Flash Block operation will erase all addresses in a P-Flash or EEPROM block.
Table 24-43. Program Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 24-27)
Set if an invalid phrase index is supplied
Set if the requested phrase has already been programmed1
1If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will
be allowed to execute again on that same phrase.
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 24-44. Erase All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x08 Not required
Table 24-45. Erase All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 24-27)
FPVIOL Set if any area of the P-Flash or EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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Upon clearing CCIF to launch the Erase Flash Block command, the Memory Controller will erase the
selected Flash block and verify that it is erased. The CCIF flag will set after the Erase Flash Block
operation has completed.
24.4.6.9 Erase P-Flash Sector Command
The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector.
Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the
selected Flash sector and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash
Sector operation has completed.
Table 24-46. Erase Flash Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x09 Global address [17:16] to
identify Flash block
001 Global address [15:0] in Flash block to be erased
Table 24-47. Erase Flash Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 24-27)
Set if an invalid global address [17:16] is supplied
Set if the supplied P-Flash address is not phrase-aligned or if the EEPROM
address is not word-aligned
FPVIOL Set if an area of the selected Flash block is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 24-48. Erase P-Flash Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0A Global address [17:16] to identify
P-Flash block to be erased
001 Global address [15:0] anywhere within the sector to be erased.
Refer to Section 24.1.2.1 for the P-Flash sector size.
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 851
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24.4.6.10 Unsecure Flash Command
The Unsecure Flash command will erase the entire P-Flash and EEPROM memory space and, if the erase
is successful, will release security.
Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire
P-Flash and EEPROM memory space and verify that it is erased. If the Memory Controller verifies that
the entire Flash memory space was properly erased, security will be released. If the erase verify is not
successful, the Unsecure Flash operation sets MGSTAT1 and terminates without changing the security
state. During the execution of this command (CCIF=0) the user must not write to any Flash module
register. The CCIF flag is set after the Unsecure Flash operation has completed.
24.4.6.11 Verify Backdoor Access Key Command
The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the
FSEC register (see Table 24-10). The Verify Backdoor Access Key command releases security if
user-supplied keys match those stored in the Flash security bytes of the Flash configuration field (see
Table 24-49. Erase P-Flash Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 24-27)
Set if an invalid global address [17:16] is supplied see Table 24-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the selected P-Flash sector is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 24-50. Unsecure Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0B Not required
Table 24-51. Unsecure Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 24-27)
FPVIOL Set if any area of the P-Flash or EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
852 Freescale Semiconductor
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Table 24-4). The Verify Backdoor Access Key command must not be executed from the Flash block
containing the backdoor comparison key to avoid code runaway.
Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will
check the FSEC KEYEN bits to verify that this command is enabled. If not enabled, the Memory
Controller sets the ACCERR bit in the FSTAT register and terminates. If the command is enabled, the
Memory Controller compares the key provided in FCCOB to the backdoor comparison key in the Flash
configuration field with Key 0 compared to 0x3_FF00, etc. If the backdoor keys match, security will be
released. If the backdoor keys do not match, security is not released and all future attempts to execute the
Verify Backdoor Access Key command are aborted (set ACCERR) until a reset occurs. The CCIF flag is
set after the Verify Backdoor Access Key operation has completed.
24.4.6.12 Set User Margin Level Command
The Set User Margin Level command causes the Memory Controller to set the margin level for future read
operations of the P-Flash or EEPROM block.
Table 24-52. Verify Backdoor Access Key Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0C Not required
001 Key 0
010 Key 1
011 Key 2
100 Key 3
Table 24-53. Verify Backdoor Access Key Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 100 at command launch
Set if an incorrect backdoor key is supplied
Set if backdoor key access has not been enabled (KEYEN[1:0] != 10, see
Section 24.3.2.2)
Set if the backdoor key has mismatched since the last reset
FPVIOL None
MGSTAT1 None
MGSTAT0 None
Table 24-54. Set User Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0D Flash block selection code [1:0]. See
Table 24-34
001 Margin level setting.
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the
user margin level for the targeted block and then set the CCIF flag.
NOTE
When the EEPROM block is targeted, the EEPROM user margin levels are
applied only to the EEPROM reads. However, when the P-Flash block is
targeted, the P-Flash user margin levels are applied to both P-Flash and
EEPROM reads. It is not possible to apply user margin levels to the P-Flash
block only.
Valid margin level settings for the Set User Margin Level command are defined in Table 24-55.
NOTE
User margin levels can be used to check that Flash memory contents have
adequate margin for normal level read operations. If unexpected results are
encountered when checking Flash memory contents at user margin levels, a
potential loss of information has been detected.
Table 24-55. Valid Set User Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level1
1Read margin to the erased state
0x0002 User Margin-0 Level2
2Read margin to the programmed state
Table 24-56. Set User Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 24-27)
Set if an invalid FlashBlockSelectionCode[1:0] is supplied (See Table 24-34 )
Set if an invalid margin level setting is supplied
FPVIOL None
MGSTAT1 None
MGSTAT0 None
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
854 Freescale Semiconductor
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24.4.6.13 Set Field Margin Level Command
The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set
the margin level specified for future read operations of the P-Flash or EEPROM block.
Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the
field margin level for the targeted block and then set the CCIF flag.
NOTE
When the EEPROM block is targeted, the EEPROM field margin levels are
applied only to the EEPROM reads. However, when the P-Flash block is
targeted, the P-Flash field margin levels are applied to both P-Flash and
EEPROM reads. It is not possible to apply field margin levels to the P-Flash
block only.
Valid margin level settings for the Set Field Margin Level command are defined in Table 24-58.
Table 24-57. Set Field Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0E Flash block selection code [1:0]. See
Table 24-34
001 Margin level setting.
Table 24-58. Valid Set Field Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level1
1Read margin to the erased state
0x0002 User Margin-0 Level2
2Read margin to the programmed state
0x0003 Field Margin-1 Level1
0x0004 Field Margin-0 Level2
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 855
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CAUTION
Field margin levels must only be used during verify of the initial factory
programming.
NOTE
Field margin levels can be used to check that Flash memory contents have
adequate margin for data retention at the normal level setting. If unexpected
results are encountered when checking Flash memory contents at field
margin levels, the Flash memory contents should be erased and
reprogrammed.
24.4.6.14 Erase Verify EEPROM Section Command
The Erase Verify EEPROM Section command will verify that a section of code in the EEPROM is erased.
The Erase Verify EEPROM Section command defines the starting point of the data to be verified and the
number of words.
Upon clearing CCIF to launch the Erase Verify EEPROM Section command, the Memory Controller will
verify the selected section of EEPROM memory is erased. The CCIF flag will set after the Erase Verify
EEPROM Section operation has completed. If the section is not erased, it means blank check failed, both
MGSTAT bits will be set.
Table 24-59. Set Field Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 24-27)
Set if an invalid FlashBlockSelectionCode[1:0] is supplied (See Table 24-34 )
Set if an invalid margin level setting is supplied
FPVIOL None
MGSTAT1 None
MGSTAT0 None
Table 24-60. Erase Verify EEPROM Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x10
Global address [17:16] to
identify the EEPROM
block
001 Global address [15:0] of the first word to be verified
010 Number of words to be verified
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
856 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
24.4.6.15 Program EEPROM Command
The Program EEPROM operation programs one to four previously erased words in the EEPROM block.
The Program EEPROM operation will confirm that the targeted location(s) were successfully programmed
upon completion.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
Upon clearing CCIF to launch the Program EEPROM command, the user-supplied words will be
transferred to the Memory Controller and be programmed if the area is unprotected. The CCOBIX index
value at Program EEPROM command launch determines how many words will be programmed in the
EEPROM block. The CCIF flag is set when the operation has completed.
Table 24-61. Erase Verify EEPROM Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 24-27)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested section breaches the end of the EEPROM block
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
Table 24-62. Program EEPROM Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x11 Global address [17:16] to
identify the EEPROM block
001 Global address [15:0] of word to be programmed
010 Word 0 program value
011 Word 1 program value, if desired
100 Word 2 program value, if desired
101 Word 3 program value, if desired
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 857
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24.4.6.16 Erase EEPROM Sector Command
The Erase EEPROM Sector operation will erase all addresses in a sector of the EEPROM block.
Upon clearing CCIF to launch the Erase EEPROM Sector command, the Memory Controller will erase the
selected Flash sector and verify that it is erased. The CCIF flag will set after the Erase EEPROM Sector
operation has completed.
Table 24-63. Program EEPROM Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] < 010 at command launch
Set if CCOBIX[2:0] > 101 at command launch
Set if command not available in current mode (see Table 24-27)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested group of words breaches the end of the EEPROM block
FPVIOL Set if the selected area of the EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 24-64. Erase EEPROM Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x12 Global address [17:16] to identify
EEPROM block
001 Global address [15:0] anywhere within the sector to be erased.
See Section 24.1.2.2 for EEPROM sector size.
Table 24-65. Erase EEPROM Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 24-27)
Set if an invalid global address [17:0] is suppliedsee Table 24-3)
Set if a misaligned word address is supplied (global address [0] != 0)
FPVIOL Set if the selected area of the EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
858 Freescale Semiconductor
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24.4.7 Interrupts
The Flash module can generate an interrupt when a Flash command operation has completed or when a
Flash command operation has detected an ECC fault.
NOTE
Vector addresses and their relative interrupt priority are determined at the
MCU level.
24.4.7.1 Description of Flash Interrupt Operation
The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the
Flash command interrupt request. The Flash module uses the DFDIF and SFDIF flags in combination with
the DFDIE and SFDIE interrupt enable bits to generate the Flash error interrupt request. For a detailed
description of the register bits involved, refer to Section 24.3.2.5, “Flash Configuration Register
(FCNFG)”, Section 24.3.2.6, “Flash Error Configuration Register (FERCNFG)”, Section 24.3.2.7, “Flash
Status Register (FSTAT)”, and Section 24.3.2.8, “Flash Error Status Register (FERSTAT)”.
The logic used for generating the Flash module interrupts is shown in Figure 24-27.
Figure 24-27. Flash Module Interrupts Implementation
Table 24-66. Flash Interrupt Sources
Interrupt Source Interrupt Flag Local Enable Global (CCR)
Mask
Flash Command Complete CCIF
(FSTAT register)
CCIE
(FCNFG register)
I Bit
ECC Double Bit Fault on Flash Read DFDIF
(FERSTAT register)
DFDIE
(FERCNFG register)
I Bit
ECC Single Bit Fault on Flash Read SFDIF
(FERSTAT register)
SFDIE
(FERCNFG register)
I Bit
Flash Error Interrupt Request
CCIF
CCIE
DFDIF
DFDIE
SFDIF
SFDIE
Flash Command Interrupt Request
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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24.4.8 Wait Mode
The Flash module is not affected if the MCU enters wait mode. The Flash module can recover the MCU
from wait via the CCIF interrupt (see Section 24.4.7, “Interrupts”).
24.4.9 Stop Mode
If a Flash command is active (CCIF = 0) when the MCU requests stop mode, the current Flash operation
will be completed before the MCU is allowed to enter stop mode.
24.5 Security
The Flash module provides security information to the MCU. The Flash security state is defined by the
SEC bits of the FSEC register (see Table 24-11). During reset, the Flash module initializes the FSEC
register using data read from the security byte of the Flash configuration field at global address 0x3_FF0F.
The security state out of reset can be permanently changed by programming the security byte assuming
that the MCU is starting from a mode where the necessary P-Flash erase and program commands are
available and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully
programmed, its new value will take affect after the next MCU reset.
The following subsections describe these security-related subjects:
• Unsecuring the MCU using Backdoor Key Access
• Unsecuring the MCU in Special Single Chip Mode using BDM
• Mode and Security Effects on Flash Command Availability
24.5.1 Unsecuring the MCU using Backdoor Key Access
The MCU may be unsecured by using the backdoor key access feature which requires knowledge of the
contents of the backdoor keys (four 16-bit words programmed at addresses 0x3_FF00-0x3_FF07). If the
KEYEN[1:0] bits are in the enabled state (see Section 24.3.2.2), the Verify Backdoor Access Key
command (see Section 24.4.6.11) allows the user to present four prospective keys for comparison to the
keys stored in the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor
Access Key command match the backdoor keys stored in the Flash memory, the SEC bits in the FSEC
register (see Table 24-11) will be changed to unsecure the MCU. Key values of 0x0000 and 0xFFFF are
not permitted as backdoor keys. While the Verify Backdoor Access Key command is active, P-Flash
memory and EEPROM memory will not be available for read access and will return invalid data.
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
860 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an
external stimulus. This external stimulus would typically be through one of the on-chip serial ports.
If the KEYEN[1:0] bits are in the enabled state (see Section 24.3.2.2), the MCU can be unsecured by the
backdoor key access sequence described below:
1. Follow the command sequence for the Verify Backdoor Access Key command as explained in
Section 24.4.6.11
2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the
SEC[1:0] bits in the FSEC register are forced to the unsecure state of 10
The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will
prohibit future use of the Verify Backdoor Access Key command. A reset of the MCU is the only method
to re-enable the Verify Backdoor Access Key command. The security as defined in the Flash security byte
(0x3_FF0F) is not changed by using the Verify Backdoor Access Key command sequence. The backdoor
keys stored in addresses 0x3_FF00-0x3_FF07 are unaffected by the Verify Backdoor Access Key
command sequence. The Verify Backdoor Access Key command sequence has no effect on the program
and erase protections defined in the Flash protection register, FPROT.
After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is
unsecured, the sector containing the Flash security byte can be erased and the Flash security byte can be
reprogrammed to the unsecure state, if desired. In the unsecure state, the user has full control of the
contents of the backdoor keys by programming addresses 0x3_FF00-0x3_FF07 in the Flash configuration
field.
24.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM
A secured MCU can be unsecured in special single chip mode by using the following method to erase the
P-Flash and EEPROM memory:
1. Reset the MCU into special single chip mode
2. Delay while the BDM executes the Erase Verify All Blocks command write sequence to check if
the P-Flash and EEPROM memories are erased
3. Send BDM commands to disable protection in the P-Flash and EEPROM memory
4. Execute the Erase All Blocks command write sequence to erase the P-Flash and EEPROM
memory. Alternatively the Unsecure Flash command can be executed, if so the steps 5 and 6 below
are skeeped.
5. After the CCIF flag sets to indicate that the Erase All Blocks operation has completed, reset the
MCU into special single chip mode
6. Delay while the BDM executes the Erase Verify All Blocks command write sequence to verify that
the P-Flash and EEPROM memory are erased
If the P-Flash and EEPROM memory are verified as erased, the MCU will be unsecured. All BDM
commands will now be enabled and the Flash security byte may be programmed to the unsecure state by
continuing with the following steps:
7. Send BDM commands to execute the Program P-Flash command write sequence to program the
Flash security byte to the unsecured state
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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8. Reset the MCU
24.5.3 Mode and Security Effects on Flash Command Availability
The availability of Flash module commands depends on the MCU operating mode and security state as
shown in Table 24-27.
24.6 Initialization
On each system reset the flash module executes an initialization sequence which establishes initial values
for the Flash Block Configuration Parameters, the FPROT and EEPROT protection registers, and the FOPT
and FSEC registers. The initialization routine reverts to built-in default values that leave the module in a
fully protected and secured state if errors are encountered during execution of the reset sequence. If a
double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT register will be set.
CCIF is cleared throughout the initialization sequence. The Flash module holds off all CPU access for a
portion of the initialization sequence. Flash reads are allowed once the hold is removed. Completion of the
initialization sequence is marked by setting CCIF high which enables user commands.
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The
state of the word being programmed or the sector/block being erased is not guaranteed.
64 KByte Flash Module (S12FTMRG64K1V1)
MC9S12G Family Reference Manual, Rev.1.06
862 Freescale Semiconductor
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MC9S12G Family Reference Manual, Rev.1.06
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Chapter 25
96 KByte Flash Module (S12FTMRG96K1V1)
25.1 Introduction
The FTMRG96K1 module implements the following:
• 96Kbytes of P-Flash (Program Flash) memory
• 3 Kbytes of EEPROM memory
The Flash memory is ideal for single-supply applications allowing for field reprogramming without
requiring external high voltage sources for program or erase operations. The Flash module includes a
memory controller that executes commands to modify Flash memory contents. The user interface to the
memory controller consists of the indexed Flash Common Command Object (FCCOB) register which is
written to with the command, global address, data, and any required command parameters. The memory
controller must complete the execution of a command before the FCCOB register can be written to with a
new command.
CAUTION
A Flash word or phrase must be in the erased state before being
programmed. Cumulative programming of bits within a Flash word or
phrase is not allowed.
Table 25-1. Revision History
Revision
Number
Revision
Date
Sections
Affected Description of Changes
V01.04 17 Jun 2010 25.4.6.1/25-896
25.4.6.2/25-897
25.4.6.3/25-898
25.4.6.14/25-90
7
Clarify Erase Verify Commands Descriptions related to the bits MGSTAT[1:0]
of the register FSTAT.
V01.05 20 aug 2010 25.4.6.2/25-897
25.4.6.12/25-90
4
25.4.6.13/25-90
6
Updated description of the commands RD1BLK, MLOADU and MLOADF
Rev.1.06 31 Jan 2011 25.3.2.9/25-879 Updated description of protection on Section 25.3.2.9
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 864
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The Flash memory may be read as bytes and aligned words. Read access time is one bus cycle for bytes
and aligned words. For misaligned words access, the CPU has to perform twice the byte read access
command. For Flash memory, an erased bit reads 1 and a programmed bit reads 0.
It is possible to read from P-Flash memory while some commands are executing on EEPROM memory. It
is not possible to read from EEPROM memory while a command is executing on P-Flash memory.
Simultaneous P-Flash and EEPROM operations are discussed in Section 25.4.5.
Both P-Flash and EEPROM memories are implemented with Error Correction Codes (ECC) that can
resolve single bit faults and detect double bit faults. For P-Flash memory, the ECC implementation
requires that programming be done on an aligned 8 byte basis (a Flash phrase). Since P-Flash memory is
always read by half-phrase, only one single bit fault in an aligned 4 byte half-phrase containing the byte
or word accessed will be corrected.
25.1.1 Glossary
Command Write Sequence — An MCU instruction sequence to execute built-in algorithms (including
program and erase) on the Flash memory.
EEPROM Memory — The EEPROM memory constitutes the nonvolatile memory store for data.
EEPROM Sector — The EEPROM sector is the smallest portion of the EEPROM memory that can be
erased. The EEPROM sector consists of 4 bytes.
NVM Command Mode — An NVM mode using the CPU to setup the FCCOB register to pass parameters
required for Flash command execution.
Phrase — An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes two
sets of aligned double words with each set including 7 ECC bits for single bit fault correction and double
bit fault detection within each double word.
P-Flash Memory — The P-Flash memory constitutes the main nonvolatile memory store for applications.
P-Flash Sector — The P-Flash sector is the smallest portion of the P-Flash memory that can be erased.
Each P-Flash sector contains 512 bytes.
Program IFR — Nonvolatile information register located in the P-Flash block that contains the Version
ID, and the Program Once field.
25.1.2 Features
25.1.2.1 P-Flash Features
• 96 Kbytes of P-Flash memory composed of one 96 Kbyte Flash block divided into 192 sectors of
512 bytes
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
• Single bit fault correction and double bit fault detection within a 32-bit double word during read
operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and phrase program operation
• Ability to read the P-Flash memory while programming a word in the EEPROM memory
• Flexible protection scheme to prevent accidental program or erase of P-Flash memory
25.1.2.2 EEPROM Features
• 3 Kbytes of EEPROM memory composed of one 3 Kbyte Flash block divided into 768 sectors of
4 bytes
• Single bit fault correction and double bit fault detection within a word during read operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and word program operation
• Protection scheme to prevent accidental program or erase of EEPROM memory
• Ability to program up to four words in a burst sequence
25.1.2.3 Other Flash Module Features
• No external high-voltage power supply required for Flash memory program and erase operations
• Interrupt generation on Flash command completion and Flash error detection
• Security mechanism to prevent unauthorized access to the Flash memory
25.1.3 Block Diagram
The block diagram of the Flash module is shown in Figure 25-1.
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
866 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 25-1. FTMRG96K1 Block Diagram
25.2 External Signal Description
The Flash module contains no signals that connect off-chip.
Bus
Clock
Divider
Clock
Command
Interrupt
Request
FCLK
Protection
Security
Registers
Flash
Interface
16bit
internal
bus
sector 0
sector 1
sector 191
24Kx39
P-Flash
Error
Interrupt
Request
CPU
1.5Kx22
sector 0
sector 1
sector 767
EEPROM
Memory Controller
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.3 Memory Map and Registers
This section describes the memory map and registers for the Flash module. Read data from unimplemented
memory space in the Flash module is undefined. Write access to unimplemented or reserved memory space
in the Flash module will be ignored by the Flash module.
CAUTION
Writing to the Flash registers while a Flash command is executing (that is
indicated when the value of flag CCIF reads as ’0’) is not allowed. If such
action is attempted the write operation will not change the register value.
Writing to the Flash registers is allowed when the Flash is not busy
executing commands (CCIF = 1) and during initialization right after reset,
despite the value of flag CCIF in that case (refer to Section 25.6 for a
complete description of the reset sequence).
.
25.3.1 Module Memory Map
The S12 architecture places the P-Flash memory between global addresses 0x2_8000 and 0x3_FFFF as
shown in Table 25-3.The P-Flash memory map is shown in Figure 25-2.
Table 25-2. FTMRG Memory Map
Global Address (in Bytes) Size
(Bytes) Description
0x0_0000 - 0x0_03FF 1,024 Register Space
0x0_0400 – 0x0_0FFF 3,072 EEPROM Memory
0x0_1000 – 0x0_13FF 1,024 FTMRG reserved area
0x0_4000 – 0x0_7FFF 16,284 NVMRES1=1 : NVM Resource area (see Figure 25-3)
1See NVMRES description in Section 25.4.3
0x2_0000 – 0x2_7FFF 32,767 FTMRG reserved area
0x2_8000 – 0x3_FFFF 98,304 P-Flash Memory
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
868 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The FPROT register, described in Section 25.3.2.9, can be set to protect regions in the Flash memory from
accidental program or erase. Three separate memory regions, one growing upward from global address
0x3_8000 in the Flash memory (called the lower region), one growing downward from global address
0x3_FFFF in the Flash memory (called the higher region), and the remaining addresses in the Flash
memory, can be activated for protection. The Flash memory addresses covered by these protectable regions
are shown in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader
code since it covers the vector space. Default protection settings as well as security information that allows
the MCU to restrict access to the Flash module are stored in the Flash configuration field as described in
Table 25-4.
Table 25-3. P-Flash Memory Addressing
Global Address Size
(Bytes) Description
0x2_8000 – 0x3_FFFF 96 K
P-Flash Block
Contains Flash Configuration Field
(see Table 25-4)
Table 25-4. Flash Configuration Field
Global Address Size
(Bytes) Description
0x3_FF00-0x3_FF07 8
Backdoor Comparison Key
Refer to Section 25.4.6.11, “Verify Backdoor Access Key Command,” and
Section 25.5.1, “Unsecuring the MCU using Backdoor Key Access”
0x3_FF08-0x3_FF0B1
10x3FF08-0x3_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in
the 0x3_FF08 - 0x3_FF0B reserved field should be programmed to 0xFF.
4 Reserved
0x3_FF0C11P-Flash Protection byte.
Refer to Section 25.3.2.9, “P-Flash Protection Register (FPROT)”
0x3_FF0D11EEPROM Protection byte.
Refer to Section 25.3.2.10, “EEPROM Protection Register (EEPROT)”
0x3_FF0E11Flash Nonvolatile byte
Refer to Section 25.3.2.16, “Flash Option Register (FOPT)”
0x3_FF0F11Flash Security byte
Refer to Section 25.3.2.2, “Flash Security Register (FSEC)”
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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Figure 25-2. P-Flash Memory Map
Table 25-5. Program IFR Fields
Global Address Size
(Bytes) Field Description
0x0_4000 – 0x0_4007 8 Reserved
0x0_4008 – 0x0_40B5 174 Reserved
0x0_40B6 – 0x0_40B7 2 Version ID1
1Used to track firmware patch versions, see Section 25.4.2
0x0_40B8 – 0x0_40BF 8 Reserved
0x0_40C0 – 0x0_40FF 64 Program Once Field
Refer to Section 25.4.6.6, “Program Once Command”
Flash Configuration Field
0x3_C000
Flash Protected/Unprotected Lower Region
1, 2, 4, 8 Kbytes
0x3_8000
0x3_9000
0x3_8400
0x3_8800
0x3_A000
P-Flash END = 0x3_FFFF
0x3_F800
0x3_F000
0x3_E000 Flash Protected/Unprotected Higher Region
2, 4, 8, 16 Kbytes
Flash Protected/Unprotected Region
8 Kbytes (up to 29 Kbytes)
16 bytes (0x3_FF00 - 0x3_FF0F)
Flash Protected/Unprotected Region
64 Kbytes
P-Flash START = 0x2_8000
Protection
Protection
Protection
Movable End
Fixed End
Fixed End
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
870 Freescale Semiconductor
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Figure 25-3. Memory Controller Resource Memory Map (NVMRES=1)
25.3.2 Register Descriptions
The Flash module contains a set of 20 control and status registers located between Flash module base +
0x0000 and 0x0013.
In the case of the writable registers, the write accesses are forbidden during Fash command execution (for
more detail, see Caution note in Section 25.3).
Table 25-6. Memory Controller Resource Fields (NVMRES1=1)
1NVMRES - See Section 25.4.3 for NVMRES (NVM Resource) detail.
Global Address Size
(Bytes) Description
0x0_4000 – 0x040FF 256 P-Flash IFR (see Table 25-5)
0x0_4100 – 0x0_41FF 256 Reserved.
0x0_4200 – 0x0_57FF Reserved
0x0_5800 – 0x0_59FF 512 Reserved
0x0_5A00 – 0x0_5FFF 1,536 Reserved
0x0_6000 – 0x0_6BFF 3,072 Reserved
0x0_6C00 – 0x0_7FFF 5,120 Reserved
P-Flash IFR 1 Kbyte (NVMRES=1)
0x0_4000
RAM End = 0x0_59FF
RAM Start = 0x0_5800
Reserved 5120 bytes
Reserved 4608 bytes
0x0_6C00
0x0_7FFF
0x0_4400 Reserved 5k bytes
Reserved 512 bytes
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A summary of the Flash module registers is given in Figure 25-4 with detailed descriptions in the
following subsections.
Address
& Name 76543210
0x0000
FCLKDIV
R FDIVLD FDIVLCK FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0
W
0x0001
FSEC
R KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0
W
0x0002
FCCOBIX
R0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0
W
0x0003
FRSV0
R00000000
W
0x0004
FCNFG
RCCIE 00
IGNSF 00
FDFD FSFD
W
0x0005
FERCNFG
R0 0 0 0 0 0 DFDIE SFDIE
W
0x0006
FSTAT
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT1 MGSTAT0
W
0x0007
FERSTAT
R0 0 0 0 0 0 DFDIF SFDIF
W
0x0008
FPROT
RFPOPEN RNV6 FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0
W
0x0009
EEPROT
RDPOPEN DPS6 DPS5 DPS4 DPS3 DPS2 DPS1 DPS0
W
0x000A
FCCOBHI
RCCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8
W
0x000B
FCCOBLO
RCCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0
W
0x000C
FRSV1
R00000000
W
Figure 25-4. FTMRG96K1 Register Summary
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
872 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.3.2.1 Flash Clock Divider Register (FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
All bits in the FCLKDIV register are readable, bit 7 is not writable, bit 6 is write-once-hi and controls the
writability of the FDIV field in normal mode. In special mode, bits 6-0 are writable any number of times
but bit 7 remains unwritable.
0x000D
FRSV2
R00000000
W
0x000E
FRSV3
R00000000
W
0x000F
FRSV4
R00000000
W
0x0010
FOPT
R NV7 NV6 NV5 NV4 NV3 NV2 NV1 NV0
W
0x0011
FRSV5
R00000000
W
0x0012
FRSV6
R00000000
W
0x0013
FRSV7
R00000000
W
= Unimplemented or Reserved
Offset Module Base + 0x0000
76543210
R FDIVLD FDIVLCK FDIV[5:0]
W
Reset 00000000
= Unimplemented or Reserved
Figure 25-5. Flash Clock Divider Register (FCLKDIV)
Address
& Name 76543210
Figure 25-4. FTMRG96K1 Register Summary (continued)
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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CAUTION
The FCLKDIV register should never be written while a Flash command is
executing (CCIF=0).
Table 25-7. FCLKDIV Field Descriptions
Field Description
7
FDIVLD
Clock Divider Loaded
0 FCLKDIV register has not been written since the last reset
1 FCLKDIV register has been written since the last reset
6
FDIVLCK
Clock Divider Locked
0 FDIV field is open for writing
1 FDIV value is locked and cannot be changed. Once the lock bit is set high, only reset can clear this bit and
restore writability to the FDIV field in normal mode.
5–0
FDIV[5:0]
Clock Divider Bits — FDIV[5:0] must be set to effectively divide BUSCLK down to 1 MHz to control timed events
during Flash program and erase algorithms. Table 25-8 shows recommended values for FDIV[5:0] based on the
BUSCLK frequency. Please refer to Section 25.4.4, “Flash Command Operations,” for more information.
Table 25-8. FDIV values for various BUSCLK Frequencies
BUSCLK Frequency
(MHz) FDIV[5:0]
BUSCLK Frequency
(MHz) FDIV[5:0]
MIN1
1BUSCLK is Greater Than this value.
MAX2
2BUSCLK is Less Than or Equal to this value.
MIN1MAX2
1.0 1.6 0x00 16.6 17.6 0x10
1.6 2.6 0x01 17.6 18.6 0x11
2.6 3.6 0x02 18.6 19.6 0x12
3.6 4.6 0x03 19.6 20.6 0x13
4.6 5.6 0x04 20.6 21.6 0x14
5.6 6.6 0x05 21.6 22.6 0x15
6.6 7.6 0x06 22.6 23.6 0x16
7.6 8.6 0x07 23.6 24.6 0x17
8.6 9.6 0x08 24.6 25.6 0x18
9.6 10.6 0x09
10.6 11.6 0x0A
11.6 12.6 0x0B
12.6 13.6 0x0C
13.6 14.6 0x0D
14.6 15.6 0x0E
15.6 16.6 0x0F
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.3.2.2 Flash Security Register (FSEC)
The FSEC register holds all bits associated with the security of the MCU and Flash module.
All bits in the FSEC register are readable but not writable.
During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the
Flash configuration field at global address 0x3_FF0F located in P-Flash memory (see Table 25-4) as
indicated by reset condition F in Figure 25-6. If a double bit fault is detected while reading the P-Flash
phrase containing the Flash security byte during the reset sequence, all bits in the FSEC register will be set
to leave the Flash module in a secured state with backdoor key access disabled.
Offset Module Base + 0x0001
76543210
R KEYEN[1:0] RNV[5:2] SEC[1:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 25-6. Flash Security Register (FSEC)
Table 25-9. FSEC Field Descriptions
Field Description
7–6
KEYEN[1:0]
Backdoor Key Security Enable Bits — The KEYEN[1:0] bits define the enabling of backdoor key access to the
Flash module as shown in Table 25-10.
5–2
RNV[5:2]
Reserved Nonvolatile Bits — The RNV bits should remain in the erased state for future enhancements.
1–0
SEC[1:0]
Flash Security Bits — The SEC[1:0] bits define the security state of the MCU as shown in Table 25-11. If the
Flash module is unsecured using backdoor key access, the SEC bits are forced to 10.
Table 25-10. Flash KEYEN States
KEYEN[1:0] Status of Backdoor Key Access
00 DISABLED
01 DISABLED1
1Preferred KEYEN state to disable backdoor key access.
10 ENABLED
11 DISABLED
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The security function in the Flash module is described in Section 25.5.
25.3.2.3 Flash CCOB Index Register (FCCOBIX)
The FCCOBIX register is used to index the FCCOB register for Flash memory operations.
CCOBIX bits are readable and writable while remaining bits read 0 and are not writable.
25.3.2.4 Flash Reserved0 Register (FRSV0)
This Flash register is reserved for factory testing.
All bits in the FRSV0 register read 0 and are not writable.
Table 25-11. Flash Security States
SEC[1:0] Status of Security
00 SECURED
01 SECURED1
1Preferred SEC state to set MCU to secured state.
10 UNSECURED
11 SECURED
Offset Module Base + 0x0002
76543210
R00000 CCOBIX[2:0]
W
Reset 00000000
= Unimplemented or Reserved
Figure 25-7. FCCOB Index Register (FCCOBIX)
Table 25-12. FCCOBIX Field Descriptions
Field Description
2–0
CCOBIX[1:0]
Common Command Register Index— The CCOBIX bits are used to select which word of the FCCOB register
array is being read or written to. See <st-blue>25.3.2.11 Flash Common Command Object Register (FCCOB),”
for more details.
Offset Module Base + 0x000C
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 25-8. Flash Reserved0 Register (FRSV0)
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
876 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.3.2.5 Flash Configuration Register (FCNFG)
The FCNFG register enables the Flash command complete interrupt and forces ECC faults on Flash array
read access from the CPU.
CCIE, IGNSF, FDFD, and FSFD bits are readable and writable while remaining bits read 0 and are not
writable.
25.3.2.6 Flash Error Configuration Register (FERCNFG)
The FERCNFG register enables the Flash error interrupts for the FERSTAT flags.
Offset Module Base + 0x0004
76543210
RCCIE 00
IGNSF 00
FDFD FSFD
W
Reset 00000000
= Unimplemented or Reserved
Figure 25-9. Flash Configuration Register (FCNFG)
Table 25-13. FCNFG Field Descriptions
Field Description
7
CCIE
Command Complete Interrupt Enable — The CCIE bit controls interrupt generation when a Flash command
has completed.
0 Command complete interrupt disabled
1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see Section 25.3.2.7)
4
IGNSF
Ignore Single Bit Fault — The IGNSF controls single bit fault reporting in the FERSTAT register (see
Section 25.3.2.8).
0 All single bit faults detected during array reads are reported
1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be
generated
1
FDFD
Force Double Bit Fault Detect — The FDFD bit allows the user to simulate a double bit fault during Flash array
read operations and check the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD.
0 Flash array read operations will set the DFDIF flag in the FERSTAT register only if a double bit fault is detected
1 Any Flash array read operation will force the DFDIF flag in the FERSTAT register to be set (see
Section 25.3.2.7) and an interrupt will be generated as long as the DFDIE interrupt enable in the FERCNFG
register is set (see Section 25.3.2.6)
0
FSFD
Force Single Bit Fault Detect —The FSFD bit allows the user to simulate a single bit fault during Flash array
read operations and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD.
0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected
1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see Section 25.3.2.7)
and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set (see
Section 25.3.2.6)
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All assigned bits in the FERCNFG register are readable and writable.
25.3.2.7 Flash Status Register (FSTAT)
The FSTAT register reports the operational status of the Flash module.
CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable
but not writable, while remaining bits read 0 and are not writable.
Offset Module Base + 0x0005
76543210
R000000
DFDIE SFDIE
W
Reset 00000000
= Unimplemented or Reserved
Figure 25-10. Flash Error Configuration Register (FERCNFG)
Table 25-14. FERCNFG Field Descriptions
Field Description
1
DFDIE
Double Bit Fault Detect Interrupt Enable — The DFDIE bit controls interrupt generation when a double bit fault
is detected during a Flash block read operation.
0 DFDIF interrupt disabled
1 An interrupt will be requested whenever the DFDIF flag is set (see Section 25.3.2.8)
0
SFDIE
Single Bit Fault Detect Interrupt Enable — The SFDIE bit controls interrupt generation when a single bit fault
is detected during a Flash block read operation.
0 SFDIF interrupt disabled whenever the SFDIF flag is set (see Section 25.3.2.8)
1 An interrupt will be requested whenever the SFDIF flag is set (see Section 25.3.2.8)
Offset Module Base + 0x0006
76543210
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT[1:0]
W
Reset 1000000
1
1Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see Section 25.6).
01
= Unimplemented or Reserved
Figure 25-11. Flash Status Register (FSTAT)
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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25.3.2.8 Flash Error Status Register (FERSTAT)
The FERSTAT register reflects the error status of internal Flash operations.
All flags in the FERSTAT register are readable and only writable to clear the flag.
Table 25-15. FSTAT Field Descriptions
Field Description
7
CCIF
Command Complete Interrupt Flag — The CCIF flag indicates that a Flash command has completed. The
CCIF flag is cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command
completion or command violation.
0 Flash command in progress
1 Flash command has completed
5
ACCERR
Flash Access Error Flag — The ACCERR bit indicates an illegal access has occurred to the Flash memory
caused by either a violation of the command write sequence (see Section 25.4.4.2) or issuing an illegal Flash
command. While ACCERR is set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is
cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR bit has no effect on ACCERR.
0 No access error detected
1 Access error detected
4
FPVIOL
Flash Protection Violation Flag —The FPVIOL bit indicates an attempt was made to program or erase an
address in a protected area of P-Flash or EEPROM memory during a command write sequence. The FPVIOL
bit is cleared by writing a 1 to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL
is set, it is not possible to launch a command or start a command write sequence.
0 No protection violation detected
1 Protection violation detected
3
MGBUSY
Memory Controller Busy Flag — The MGBUSY flag reflects the active state of the Memory Controller.
0 Memory Controller is idle
1 Memory Controller is busy executing a Flash command (CCIF = 0)
2
RSVD
Reserved Bit — This bit is reserved and always reads 0.
1–0
MGSTAT[1:0]
Memory Controller Command Completion Status Flag — One or more MGSTAT flag bits are set if an error
is detected during execution of a Flash command or during the Flash reset sequence. See Section 25.4.6,
“Flash Command Description,” and Section 25.6, “Initialization” for details.
Offset Module Base + 0x0007
76543210
R000000
DFDIF SFDIF
W
Reset 00000000
= Unimplemented or Reserved
Figure 25-12. Flash Error Status Register (FERSTAT)
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 879
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.3.2.9 P-Flash Protection Register (FPROT)
The FPROT register defines which P-Flash sectors are protected against program and erase operations.
The (unreserved) bits of the FPROT register are writable with the restriction that the size of the protected
region can only be increased (see Section 25.3.2.9.1, “P-Flash Protection Restrictions,” and Table 25-21).
During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte
in the Flash configuration field at global address 0x3_FF0C located in P-Flash memory (see Table 25-4)
as indicated by reset condition ‘F’ in Figure 25-13. To change the P-Flash protection that will be loaded
during the reset sequence, the upper sector of the P-Flash memory must be unprotected, then the P-Flash
protection byte must be reprogrammed. If a double bit fault is detected while reading the P-Flash phrase
containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and
remaining bits in the FPROT register will be set to leave the P-Flash memory fully protected.
Table 25-16. FERSTAT Field Descriptions
Field Description
1
DFDIF
Double Bit Fault Detect Interrupt Flag — The setting of the DFDIF flag indicates that a double bit fault was
detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation
returning invalid data was attempted on a Flash block that was under a Flash command operation.1The DFDIF
flag is cleared by writing a 1 to DFDIF. Writing a 0 to DFDIF has no effect on DFDIF.2
0 No double bit fault detected
1 Double bit fault detected or a Flash array read operation returning invalid data was attempted while command
running
1 The single bit fault and double bit fault flags are mutually exclusive for parity errors (an ECC fault occurrence can be either
single fault or double fault but never both). A simultaneous access collision (Flash array read operation returning invalid data
attempted while command running) is indicated when both SFDIF and DFDIF flags are high.
2There is a one cycle delay in storing the ECC DFDIF and SFDIF fault flags in this register. At least one NOP is required after
a flash memory read before checking FERSTAT for the occurrence of ECC errors.
0
SFDIF
Single Bit Fault Detect Interrupt Flag — With the IGNSF bit in the FCNFG register clear, the SFDIF flag
indicates that a single bit fault was detected in the stored parity and data bits during a Flash array read operation
or that a Flash array read operation returning invalid data was attempted on a Flash block that was under a Flash
command operation.1 The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on
SFDIF.
0 No single bit fault detected
1 Single bit fault detected and corrected or a Flash array read operation returning invalid data was attempted
while command running
Offset Module Base + 0x0008
76543210
RFPOPEN RNV6 FPHDIS FPHS[1:0] FPLDIS FPLS[1:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 25-13. Flash Protection Register (FPROT)
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
880 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error
and the FPVIOL bit will be set in the FSTAT register. The block erase of a P-Flash block is not possible if
any of the P-Flash sectors contained in the same P-Flash block are protected.
Table 25-17. FPROT Field Descriptions
Field Description
7
FPOPEN
Flash Protection Operation Enable — The FPOPEN bit determines the protection function for program or
erase operations as shown in Table 25-18 for the P-Flash block.
0 When FPOPEN is clear, the FPHDIS and FPLDIS bits define unprotected address ranges as specified by the
corresponding FPHS and FPLS bits
1 When FPOPEN is set, the FPHDIS and FPLDIS bits enable protection for the address range specified by the
corresponding FPHS and FPLS bits
6
RNV[6]
Reserved Nonvolatile Bit — The RNV bit should remain in the erased state for future enhancements.
5
FPHDIS
Flash Protection Higher Address Range Disable — The FPHDIS bit determines whether there is a
protected/unprotected area in a specific region of the P-Flash memory ending with global address 0x3_FFFF.
0 Protection/Unprotection enabled
1 Protection/Unprotection disabled
4–3
FPHS[1:0]
Flash Protection Higher Address Size — The FPHS bits determine the size of the protected/unprotected area
in P-Flash memory as shown inTable 25-19. The FPHS bits can only be written to while the FPHDIS bit is set.
2
FPLDIS
Flash Protection Lower Address Range Disable — The FPLDIS bit determines whether there is a
protected/unprotected area in a specific region of the P-Flash memory beginning with global address 0x3_8000.
0 Protection/Unprotection enabled
1 Protection/Unprotection disabled
1–0
FPLS[1:0]
Flash Protection Lower Address Size — The FPLS bits determine the size of the protected/unprotected area
in P-Flash memory as shown in Table 25-20. The FPLS bits can only be written to while the FPLDIS bit is set.
Table 25-18. P-Flash Protection Function
FPOPEN FPHDIS FPLDIS Function1
1For range sizes, refer to Table 25-19 and Table 25-20.
1 1 1 No P-Flash Protection
1 1 0 Protected Low Range
1 0 1 Protected High Range
1 0 0 Protected High and Low Ranges
0 1 1 Full P-Flash Memory Protected
0 1 0 Unprotected Low Range
0 0 1 Unprotected High Range
0 0 0 Unprotected High and Low Ranges
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 881
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All possible P-Flash protection scenarios are shown in Figure 25-14 . Although the protection scheme is
loaded from the Flash memory at global address 0x3_FF0C during the reset sequence, it can be changed
by the user. The P-Flash protection scheme can be used by applications requiring reprogramming in single
chip mode while providing as much protection as possible if reprogramming is not required.
Table 25-19. P-Flash Protection Higher Address Range
FPHS[1:0] Global Address Range Protected Size
00 0x3_F800–0x3_FFFF 2 Kbytes
01 0x3_F000–0x3_FFFF 4 Kbytes
10 0x3_E000–0x3_FFFF 8 Kbytes
11 0x3_C000–0x3_FFFF 16 Kbytes
Table 25-20. P-Flash Protection Lower Address Range
FPLS[1:0] Global Address Range Protected Size
00 0x3_8000–0x3_83FF 1 Kbyte
01 0x3_8000–0x3_87FF 2 Kbytes
10 0x3_8000–0x3_8FFF 4 Kbytes
11 0x3_8000–0x3_9FFF 8 Kbytes
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
882 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 25-14. P-Flash Protection Scenarios
7654
FPHS[1:0] FPLS[1:0]
3210
FPHS[1:0] FPLS[1:0]
FPHDIS = 1
FPLDIS = 1
FPHDIS = 1
FPLDIS = 0
FPHDIS = 0
FPLDIS = 1
FPHDIS = 0
FPLDIS = 0
Scenario
Scenario
Unprotected region Protected region with size
Protected region Protected region with size
defined by FPLS
defined by FPHSnot defined by FPLS, FPHS
0x3_8000
0x3_FFFF
0x3_8000
0x3_FFFF
FLASH START
FLASH START
FPOPEN = 1FPOPEN = 0
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 883
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.3.2.9.1 P-Flash Protection Restrictions
The general guideline is that P-Flash protection can only be added and not removed. Table 25-21 specifies
all valid transitions between P-Flash protection scenarios. Any attempt to write an invalid scenario to the
FPROT register will be ignored. The contents of the FPROT register reflect the active protection scenario.
See the FPHS and FPLS bit descriptions for additional restrictions.
25.3.2.10 EEPROM Protection Register (EEPROT)
The EEPROT register defines which EEPROM sectors are protected against program and erase operations.
The (unreserved) bits of the EEPROT register are writable with the restriction that protection can be added
but not removed. Writes must increase the DPS value and the DPOPEN bit can only be written from 1
(protection disabled) to 0 (protection enabled). If the DPOPEN bit is set, the state of the DPS bits is
irrelevant.
During the reset sequence, fields DPOPEN and DPS of the EEPROT register are loaded with the contents
of the EEPROM protection byte in the Flash configuration field at global address 0x3_FF0D located in
Table 25-21. P-Flash Protection Scenario Transitions
From
Protection
Scenario
To Protection Scenario1
1Allowed transitions marked with X, see Figure 25-14 for a definition of the scenarios.
01234567
0XXXX
1XX
2XX
3X
4XX
5XXXX
6XXXX
7XXXXXXXX
Offset Module Base + 0x0009
76543210
RDPOPEN DPS[6:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
Figure 25-15. EEPROM Protection Register (EEPROT)
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
884 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
P-Flash memory (see Table 25-4) as indicated by reset condition F in Table 25-23. To change the
EEPROM protection that will be loaded during the reset sequence, the P-Flash sector containing the
EEPROM protection byte must be unprotected, then the EEPROM protection byte must be programmed.
If a double bit fault is detected while reading the P-Flash phrase containing the EEPROM protection byte
during the reset sequence, the DPOPEN bit will be cleared and DPS bits will be set to leave the EEPROM
memory fully protected.
Trying to alter data in any protected area in the EEPROM memory will result in a protection violation error
and the FPVIOL bit will be set in the FSTAT register. Block erase of the EEPROM memory is not possible
if any of the EEPROM sectors are protected.
Table 25-22. EEPROT Field Descriptions
Field Description
7
DPOPEN
EEPROM Protection Control
0 Enables EEPROM memory protection from program and erase with protected address range defined by DPS
bits
1 Disables EEPROM memory protection from program and erase
6–0
DPS[6:0]
EEPROM Protection Size — The DPS[6:0] bits determine the size of the protected area in the EEPROM
memory, this size increase in step of 32 bytes, as shown in Table 25-23 .
Table 25-23. EEPROM Protection Address Range
DPS[6:0] Global Address Range Protected Size
0000000 0x0_0400 – 0x0_041F 32 bytes
0000001 0x0_0400 – 0x0_043F 64 bytes
0000010 0x0_0400 – 0x0_045F 96 bytes
0000011 0x0_0400 – 0x0_047F 128 bytes
0000100 0x0_0400 – 0x0_049F 160 bytes
0000101 0x0_0400 – 0x0_04BF 192 bytes
The Protection Size goes on enlarging in step of 32 bytes, for each DPS value
increasing of one.
.
.
.
1011111 - to - 1111111 0x0_0400 – 0x0_0FFF 3,072 bytes
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 885
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.3.2.11 Flash Common Command Object Register (FCCOB)
The FCCOB is an array of six words addressed via the CCOBIX index found in the FCCOBIX register.
Byte wide reads and writes are allowed to the FCCOB register.
25.3.2.11.1 FCCOB - NVM Command Mode
NVM command mode uses the indexed FCCOB register to provide a command code and its relevant
parameters to the Memory Controller. The user first sets up all required FCCOB fields and then initiates
the command’s execution by writing a 1 to the CCIF bit in the FSTAT register (a 1 written by the user clears
the CCIF command completion flag to 0). When the user clears the CCIF bit in the FSTAT register all
FCCOB parameter fields are locked and cannot be changed by the user until the command completes (as
evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the
FCCOB register array.
The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 25-24. The
return values are available for reading after the CCIF flag in the FSTAT register has been returned to 1 by
the Memory Controller. Writes to the unimplemented parameter fields (CCOBIX = 110 and CCOBIX =
111) are ignored with reads from these fields returning 0x0000.
Table 25-24 shows the generic Flash command format. The high byte of the first word in the CCOB array
contains the command code, followed by the parameters for this specific Flash command. For details on
the FCCOB settings required by each command, see the Flash command descriptions in Section 25.4.6.
Offset Module Base + 0x000A
76543210
RCCOB[15:8]
W
Reset 00000000
Figure 25-16. Flash Common Command Object High Register (FCCOBHI)
Offset Module Base + 0x000B
76543210
RCCOB[7:0]
W
Reset 00000000
Figure 25-17. Flash Common Command Object Low Register (FCCOBLO)
Table 25-24. FCCOB - NVM Command Mode (Typical Usage)
CCOBIX[2:0] Byte FCCOB Parameter Fields (NVM Command Mode)
000 HI FCMD[7:0] defining Flash command
LO 6’h0, Global address [17:16]
001 HI Global address [15:8]
LO Global address [7:0]
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
886 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.3.2.12 Flash Reserved1 Register (FRSV1)
This Flash register is reserved for factory testing.
All bits in the FRSV1 register read 0 and are not writable.
25.3.2.13 Flash Reserved2 Register (FRSV2)
This Flash register is reserved for factory testing.
All bits in the FRSV2 register read 0 and are not writable.
25.3.2.14 Flash Reserved3 Register (FRSV3)
This Flash register is reserved for factory testing.
010 HI Data 0 [15:8]
LO Data 0 [7:0]
011 HI Data 1 [15:8]
LO Data 1 [7:0]
100 HI Data 2 [15:8]
LO Data 2 [7:0]
101 HI Data 3 [15:8]
LO Data 3 [7:0]
Offset Module Base + 0x000C
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 25-18. Flash Reserved1 Register (FRSV1)
Offset Module Base + 0x000D
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 25-19. Flash Reserved2 Register (FRSV2)
Table 25-24. FCCOB - NVM Command Mode (Typical Usage)
CCOBIX[2:0] Byte FCCOB Parameter Fields (NVM Command Mode)
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 887
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FRSV3 register read 0 and are not writable.
25.3.2.15 Flash Reserved4 Register (FRSV4)
This Flash register is reserved for factory testing.
All bits in the FRSV4 register read 0 and are not writable.
25.3.2.16 Flash Option Register (FOPT)
The FOPT register is the Flash option register.
All bits in the FOPT register are readable but are not writable.
During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash
configuration field at global address 0x3_FF0E located in P-Flash memory (see Table 25-4) as indicated
by reset condition F in Figure 25-22. If a double bit fault is detected while reading the P-Flash phrase
containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT register will be set.
Offset Module Base + 0x000E
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 25-20. Flash Reserved3 Register (FRSV3)
Offset Module Base + 0x000F
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 25-21. Flash Reserved4 Register (FRSV4)
Offset Module Base + 0x0010
76543210
R NV[7:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 25-22. Flash Option Register (FOPT)
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
888 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.3.2.17 Flash Reserved5 Register (FRSV5)
This Flash register is reserved for factory testing.
All bits in the FRSV5 register read 0 and are not writable.
25.3.2.18 Flash Reserved6 Register (FRSV6)
This Flash register is reserved for factory testing.
All bits in the FRSV6 register read 0 and are not writable.
25.3.2.19 Flash Reserved7 Register (FRSV7)
This Flash register is reserved for factory testing.
Table 25-25. FOPT Field Descriptions
Field Description
7–0
NV[7:0]
Nonvolatile Bits — The NV[7:0] bits are available as nonvolatile bits. Refer to the device user guide for proper
use of the NV bits.
Offset Module Base + 0x0011
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 25-23. Flash Reserved5 Register (FRSV5)
Offset Module Base + 0x0012
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 25-24. Flash Reserved6 Register (FRSV6)
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 889
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FRSV7 register read 0 and are not writable.
25.4 Functional Description
25.4.1 Modes of Operation
The FTMRG96K1 module provides the modes of operation normal and special . The operating mode is
determined by module-level inputs and affects the FCLKDIV, FCNFG, and EEPROT registers (see
Table 25-27).
25.4.2 IFR Version ID Word
The version ID word is stored in the IFR at address 0x0_40B6. The contents of the word are defined in
Table 25-26.
• VERNUM: Version number. The first version is number 0b_0001 with both 0b_0000 and 0b_1111
meaning ‘none’.
Offset Module Base + 0x0013
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 25-25. Flash Reserved7 Register (FRSV7)
Table 25-26. IFR Version ID Fields
[15:4] [3:0]
Reserved VERNUM
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
890 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.4.3 Internal NVM resource (NVMRES)
IFR is an internal NVM resource readable by CPU , when NVMRES is active. The IFR fields are shown
in Table 25-5.
The NVMRES global address map is shown in Table 25-6.
25.4.4 Flash Command Operations
Flash command operations are used to modify Flash memory contents.
The next sections describe:
• How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from
BUSCLK for Flash program and erase command operations
• The command write sequence used to set Flash command parameters and launch execution
• Valid Flash commands available for execution, according to MCU functional mode and MCU
security state.
25.4.4.1 Writing the FCLKDIV Register
Prior to issuing any Flash program or erase command after a reset, the user is required to write the
FCLKDIV register to divide BUSCLK down to a target FCLK of 1 MHz. Table 25-8 shows recommended
values for the FDIV field based on BUSCLK frequency.
NOTE
Programming or erasing the Flash memory cannot be performed if the bus
clock runs at less than 0.8 MHz. Setting FDIV too high can destroy the Flash
memory due to overstress. Setting FDIV too low can result in incomplete
programming or erasure of the Flash memory cells.
When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the
FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written,
any Flash program or erase command loaded during a command write sequence will not execute and the
ACCERR bit in the FSTAT register will set.
25.4.4.2 Command Write Sequence
The Memory Controller will launch all valid Flash commands entered using a command write sequence.
Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see
Section 25.3.2.7) and the CCIF flag should be tested to determine the status of the current command write
sequence. If CCIF is 0, the previous command write sequence is still active, a new command write
sequence cannot be started, and all writes to the FCCOB register are ignored.
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 891
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.4.4.2.1 Define FCCOB Contents
The FCCOB parameter fields must be loaded with all required parameters for the Flash command being
executed. Access to the FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX
register (see Section 25.3.2.3).
The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears
the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag
will remain clear until the Flash command has completed. Upon completion, the Memory Controller will
return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic
command write sequence is shown in Figure 25-26.
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
892 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 25-26. Generic Flash Command Write Sequence Flowchart
Write to FCCOBIX register
Write: FSTAT register (to launch command)
Clear CCIF 0x80
Clear ACCERR/FPVIOL 0x30
Write: FSTAT register
yes
no
Access Error and
Protection Violation
Read: FSTAT register
START
Check
FCCOB
ACCERR/
FPVIOL
Set?
EXIT
Write: FCLKDIV register
Read: FCLKDIV register
yes
no
FDIV
Correct?
no
Bit Polling for
Command Completion
Check
yes
CCIF Set?
to identify specific command
parameter to load.
Write to FCCOB register
to load required command parameter.
yes
no
More
Parameters?
Availability Check
Results from previous Command
Note: FCLKDIV must be
set after each reset
Read: FSTAT register
no
yes
CCIF
Set?
no
yes
CCIF
Set?
Clock Divider
Value Check Read: FSTAT register
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 893
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.4.4.3 Valid Flash Module Commands
Table 25-27 present the valid Flash commands, as enabled by the combination of the functional MCU
mode (Normal SingleChip NS, Special Singlechip SS) with the MCU security state (Unsecured, Secured).
Special Singlechip mode is selected by input mmc_ss_mode_ts2 asserted. MCU Secured state is selected
by input mmc_secure input asserted.
+
25.4.4.4 P-Flash Commands
Table 25-28 summarizes the valid P-Flash commands along with the effects of the commands on the
P-Flash block and other resources within the Flash module.
Table 25-27. Flash Commands by Mode and Security State
FCMD Command
Unsecured Secured
NS1
1Unsecured Normal Single Chip mode
SS2
2Unsecured Special Single Chip mode.
NS3
3Secured Normal Single Chip mode.
SS4
4Secured Special Single Chip mode.
0x01 Erase Verify All Blocks ∗∗∗∗
0x02 Erase Verify Block ∗∗∗∗
0x03 Erase Verify P-Flash Section ∗∗∗
0x04 Read Once ∗∗∗
0x06 Program P-Flash ∗∗∗
0x07 Program Once ∗∗∗
0x08 Erase All Blocks ∗∗
0x09 Erase Flash Block ∗∗∗
0x0A Erase P-Flash Sector ∗∗∗
0x0B Unsecure Flash ∗∗
0x0C Verify Backdoor Access Key ∗∗
0x0D Set User Margin Level ∗∗∗
0x0E Set Field Margin Level ∗
0x10 Erase Verify EEPROM Section ∗∗∗
0x11 Program EEPROM ∗∗∗
0x12 Erase EEPROM Sector ∗∗∗
Table 25-28. P-Flash Commands
FCMD Command Function on P-Flash Memory
0x01 Erase Verify All
Blocks
Verify that all P-Flash (and EEPROM) blocks are erased.
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
894 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.4.4.5 EEPROM Commands
Table 25-29 summarizes the valid EEPROM commands along with the effects of the commands on the
EEPROM block.
0x02 Erase Verify Block Verify that a P-Flash block is erased.
0x03 Erase Verify
P-Flash Section
Verify that a given number of words starting at the address provided are erased.
0x04 Read Once Read a dedicated 64 byte field in the nonvolatile information register in P-Flash block that
was previously programmed using the Program Once command.
0x06 Program P-Flash Program a phrase in a P-Flash block.
0x07 Program Once Program a dedicated 64 byte field in the nonvolatile information register in P-Flash block
that is allowed to be programmed only once.
0x08 Erase All Blocks
Erase all P-Flash (and EEPROM) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN
bits in the FPROT register and the DPOPEN bit in the EEPROT register are set prior to
launching the command.
0x09 Erase Flash Block
Erase a P-Flash (or EEPROM) block.
An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN
bits in the FPROT register are set prior to launching the command.
0x0A Erase P-Flash
Sector
Erase all bytes in a P-Flash sector.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all P-Flash (and EEPROM)
blocks and verifying that all P-Flash (and EEPROM) blocks are erased.
0x0C Verify Backdoor
Access Key
Supports a method of releasing MCU security by verifying a set of security keys.
0x0D Set User Margin
Level
Specifies a user margin read level for all P-Flash blocks.
0x0E Set Field Margin
Level
Specifies a field margin read level for all P-Flash blocks (special modes only).
Table 25-29. EEPROM Commands
FCMD Command Function on EEPROM Memory
0x01 Erase Verify All
Blocks
Verify that all EEPROM (and P-Flash) blocks are erased.
0x02 Erase Verify Block Verify that the EEPROM block is erased.
Table 25-28. P-Flash Commands
FCMD Command Function on P-Flash Memory
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 895
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.4.5 Allowed Simultaneous P-Flash and EEPROM Operations
Only the operations marked ‘OK’ in Table 25-30 are permitted to be run simultaneously on the Program
Flash and EEPROM blocks. Some operations cannot be executed simultaneously because certain hardware
resources are shared by the two memories. The priority has been placed on permitting Program Flash reads
while program and erase operations execute on the EEPROM, providing read (P-Flash) while write
(EEPROM) functionality.
0x08 Erase All Blocks
Erase all EEPROM (and P-Flash) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN
bits in the FPROT register and the DPOPEN bit in the EEPROT register are set prior to
launching the command.
0x09 Erase Flash Block
Erase a EEPROM (or P-Flash) block.
An erase of the full EEPROM block is only possible when DPOPEN bit in the EEPROT
register is set prior to launching the command.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all EEPROM (and P-Flash)
blocks and verifying that all EEPROM (and P-Flash) blocks are erased.
0x0D Set User Margin
Level
Specifies a user margin read level for the EEPROM block.
0x0E Set Field Margin
Level
Specifies a field margin read level for the EEPROM block (special modes only).
0x10 Erase Verify
EEPROM Section
Verify that a given number of words starting at the address provided are erased.
0x11 Program
EEPROM
Program up to four words in the EEPROM block.
0x12 Erase EEPROM
Sector
Erase all bytes in a sector of the EEPROM block.
Table 25-30. Allowed P-Flash and EEPROM Simultaneous Operations
EEPROM
Program Flash Read Margin
Read1Program Sector
Erase
Mass
Erase2
Read OK OK OK
Margin Read1
1A ‘Margin Read’ is any read after executing the margin setting commands
‘Set User Margin Level’ or ‘Set Field Margin Level’ with anything but the
‘normal’ level specified. See the Note on margin settings in Section 25.4.6.12
and Section 25.4.6.13.
Program
Sector Erase
Mass Erase2
2The ‘Mass Erase’ operations are commands ‘Erase All Blocks’ and ‘Erase
Flash Block’
OK
Table 25-29. EEPROM Commands
FCMD Command Function on EEPROM Memory
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
896 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.4.6 Flash Command Description
This section provides details of all available Flash commands launched by a command write sequence. The
ACCERR bit in the FSTAT register will be set during the command write sequence if any of the following
illegal steps are performed, causing the command not to be processed by the Memory Controller:
• Starting any command write sequence that programs or erases Flash memory before initializing the
FCLKDIV register
• Writing an invalid command as part of the command write sequence
• For additional possible errors, refer to the error handling table provided for each command
If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation
will return invalid data if both flags SFDIF and DFDIF are set. If the SFDIF or DFDIF flags were not
previously set when the invalid read operation occurred, both the SFDIF and DFDIF flags will be set.
If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting
any command write sequence (see Section 25.3.2.7).
CAUTION
A Flash word or phrase must be in the erased state before being
programmed. Cumulative programming of bits within a Flash word or
phrase is not allowed.
25.4.6.1 Erase Verify All Blocks Command
The Erase Verify All Blocks command will verify that all P-Flash and EEPROM blocks have been erased.
Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify
that the entire Flash memory space is erased. The CCIF flag will set after the Erase Verify All Blocks
operation has completed. If all blocks are not erased, it means blank check failed, both MGSTAT bits will
be set.
Table 25-31. Erase Verify All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x01 Not required
Table 25-32. Erase Verify All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read1or if blank check failed .
1As found in the memory map for FTMRG96K1.
MGSTAT0 Set if any non-correctable errors have been encountered during the read1 or if
blank check failed.
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 897
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.4.6.2 Erase Verify Block Command
The Erase Verify Block command allows the user to verify that an entire P-Flash or EEPROM block has
been erased. The FCCOB FlashBlockSelectionCode[1:0] bits determine which block must be verified.
Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that
the selected P-Flash or EEPROM block is erased. The CCIF flag will set after the Erase Verify Block
operation has completed.If the block is not erased, it means blank check failed, both MGSTAT bits will be
set.
Table 25-33. Erase Verify Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x02
Flash block
selection code [1:0]. See
Table 25-34
Table 25-34. Flash block selection code description
Selection code[1:0] Flash block to be verified
00 EEPROM
01 Invalid (ACCERR)
10 P-Flash
11 P-Flash
Table 25-35. Erase Verify Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if an invalid FlashBlockSelectionCode[1:0] is supplied1
1As defined by the memory map for FTMRG96K1.
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read2or if blank check failed.
2As found in the memory map for FTMRG96K1.
MGSTAT0 Set if any non-correctable errors have been encountered during the read2 or if
blank check failed.
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
898 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.4.6.3 Erase Verify P-Flash Section Command
The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is
erased. The Erase Verify P-Flash Section command defines the starting point of the code to be verified and
the number of phrases.
Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will
verify the selected section of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash
Section operation has completed. If the section is not erased, it means blank check failed, both MGSTAT
bits will be set.
25.4.6.4 Read Once Command
The Read Once command provides read access to a reserved 64 byte field (8 phrases) located in the
nonvolatile information register of P-Flash. The Read Once field is programmed using the Program Once
command described in Section 25.4.6.6. The Read Once command must not be executed from the Flash
block containing the Program Once reserved field to avoid code runaway.
Table 25-36. Erase Verify P-Flash Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x03 Global address [17:16] of
a P-Flash block
001 Global address [15:0] of the first phrase to be verified
010 Number of phrases to be verified
Table 25-37. Erase Verify P-Flash Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 25-27)
Set if an invalid global address [17:0] is supplied see Table 25-3)1
1As defined by the memory map for FTMRG96K1.
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
Set if the requested section crosses a the P-Flash address boundary
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read2or if blank check failed.
2As found in the memory map for FTMRG96K1.
MGSTAT0 Set if any non-correctable errors have been encountered during the read2 or if
blank check failed.
Table 25-38. Read Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x04 Not Required
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 899
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the
FCCOB indexed register. The CCIF flag will set after the Read Once operation has completed. Valid
phrase index values for the Read Once command range from 0x0000 to 0x0007. During execution of the
Read Once command, any attempt to read addresses within P-Flash block will return invalid data.
8
25.4.6.5 Program P-Flash Command
The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an
embedded algorithm.
CAUTION
A P-Flash phrase must be in the erased state before being programmed.
Cumulative programming of bits within a Flash phrase is not allowed.
001 Read Once phrase index (0x0000 - 0x0007)
010 Read Once word 0 value
011 Read Once word 1 value
100 Read Once word 2 value
101 Read Once word 3 value
Table 25-39. Read Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 25-27)
Set if an invalid phrase index is supplied
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read
MGSTAT0 Set if any non-correctable errors have been encountered during the read
Table 25-40. Program P-Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x06 Global address [17:16] to
identify P-Flash block
001 Global address [15:0] of phrase location to be programmed1
010 Word 0 program value
011 Word 1 program value
100 Word 2 program value
101 Word 3 program value
Table 25-38. Read Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
900 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the
data words to the supplied global address and will then proceed to verify the data words read back as
expected. The CCIF flag will set after the Program P-Flash operation has completed.
25.4.6.6 Program Once Command
The Program Once command restricts programming to a reserved 64 byte field (8 phrases) in the
nonvolatile information register located in P-Flash. The Program Once reserved field can be read using the
Read Once command as described in Section 25.4.6.4. The Program Once command must only be issued
once since the nonvolatile information register in P-Flash cannot be erased. The Program Once command
must not be executed from the Flash block containing the Program Once reserved field to avoid code
runaway.
Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the
selected phrase is erased. If erased, then the selected phrase will be programmed and then verified with
read back. The CCIF flag will remain clear, setting only after the Program Once operation has completed.
1Global address [2:0] must be 000
Table 25-41. Program P-Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 25-27)
Set if an invalid global address [17:0] is supplied see Table 25-3)1
1As defined by the memory map for FTMRG96K1.
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the global address [17:0] points to a protected area
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 25-42. Program Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x07 Not Required
001 Program Once phrase index (0x0000 - 0x0007)
010 Program Once word 0 value
011 Program Once word 1 value
100 Program Once word 2 value
101 Program Once word 3 value
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 901
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The reserved nonvolatile information register accessed by the Program Once command cannot be erased
and any attempt to program one of these phrases a second time will not be allowed. Valid phrase index
values for the Program Once command range from 0x0000 to 0x0007. During execution of the Program
Once command, any attempt to read addresses within P-Flash will return invalid data.
25.4.6.7 Erase All Blocks Command
The Erase All Blocks operation will erase the entire P-Flash and EEPROM memory space.
Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire
Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash
memory space was properly erased, security will be released. During the execution of this command
(CCIF=0) the user must not write to any Flash module register. The CCIF flag will set after the Erase All
Blocks operation has completed.
Table 25-43. Program Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 25-27)
Set if an invalid phrase index is supplied
Set if the requested phrase has already been programmed1
1If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will
be allowed to execute again on that same phrase.
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 25-44. Erase All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x08 Not required
Table 25-45. Erase All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 25-27)
FPVIOL Set if any area of the P-Flash or EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation1
1As found in the memory map for FTMRG96K1.
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation1
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
902 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.4.6.8 Erase Flash Block Command
The Erase Flash Block operation will erase all addresses in a P-Flash or EEPROM block.
Upon clearing CCIF to launch the Erase Flash Block command, the Memory Controller will erase the
selected Flash block and verify that it is erased. The CCIF flag will set after the Erase Flash Block
operation has completed.
25.4.6.9 Erase P-Flash Sector Command
The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector.
Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the
selected Flash sector and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash
Sector operation has completed.
Table 25-46. Erase Flash Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x09 Global address [17:16] to
identify Flash block
001 Global address [15:0] in Flash block to be erased
Table 25-47. Erase Flash Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 25-27)
Set if an invalid global address [17:16] is supplied1
1As defined by the memory map for FTMRG96K1.
Set if the supplied P-Flash address is not phrase-aligned or if the EEPROM
address is not word-aligned
FPVIOL Set if an area of the selected Flash block is protected
MGSTAT1 Set if any errors have been encountered during the verify operation2
2As found in the memory map for FTMRG96K1.
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation2
Table 25-48. Erase P-Flash Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0A Global address [17:16] to identify
P-Flash block to be erased
001 Global address [15:0] anywhere within the sector to be erased.
Refer to Section 25.1.2.1 for the P-Flash sector size.
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 903
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.4.6.10 Unsecure Flash Command
The Unsecure Flash command will erase the entire P-Flash and EEPROM memory space and, if the erase
is successful, will release security.
Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire
P-Flash and EEPROM memory space and verify that it is erased. If the Memory Controller verifies that
the entire Flash memory space was properly erased, security will be released. If the erase verify is not
successful, the Unsecure Flash operation sets MGSTAT1 and terminates without changing the security
state. During the execution of this command (CCIF=0) the user must not write to any Flash module
register. The CCIF flag is set after the Unsecure Flash operation has completed.
Table 25-49. Erase P-Flash Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 25-27)
Set if an invalid global address [17:16] is supplied see Table 25-3)1
1As defined by the memory map for FTMRG96K1.
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the selected P-Flash sector is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 25-50. Unsecure Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0B Not required
Table 25-51. Unsecure Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 25-27)
FPVIOL Set if any area of the P-Flash or EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation1
1As found in the memory map for FTMRG96K1.
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation1
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
904 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
25.4.6.11 Verify Backdoor Access Key Command
The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the
FSEC register (see Table 25-10). The Verify Backdoor Access Key command releases security if
user-supplied keys match those stored in the Flash security bytes of the Flash configuration field (see
Table 25-4). The Verify Backdoor Access Key command must not be executed from the Flash block
containing the backdoor comparison key to avoid code runaway.
Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will
check the FSEC KEYEN bits to verify that this command is enabled. If not enabled, the Memory
Controller sets the ACCERR bit in the FSTAT register and terminates. If the command is enabled, the
Memory Controller compares the key provided in FCCOB to the backdoor comparison key in the Flash
configuration field with Key 0 compared to 0x3_FF00, etc. If the backdoor keys match, security will be
released. If the backdoor keys do not match, security is not released and all future attempts to execute the
Verify Backdoor Access Key command are aborted (set ACCERR) until a reset occurs. The CCIF flag is
set after the Verify Backdoor Access Key operation has completed.
25.4.6.12 Set User Margin Level Command
The Set User Margin Level command causes the Memory Controller to set the margin level for future read
operations of the P-Flash or EEPROM block.
Table 25-52. Verify Backdoor Access Key Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0C Not required
001 Key 0
010 Key 1
011 Key 2
100 Key 3
Table 25-53. Verify Backdoor Access Key Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 100 at command launch
Set if an incorrect backdoor key is supplied
Set if backdoor key access has not been enabled (KEYEN[1:0] != 10, see
Section 25.3.2.2)
Set if the backdoor key has mismatched since the last reset
FPVIOL None
MGSTAT1 None
MGSTAT0 None
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 905
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the
user margin level for the targeted block and then set the CCIF flag.
NOTE
When the EEPROM block is targeted, the EEPROM user margin levels are
applied only to the EEPROM reads. However, when the P-Flash block is
targeted, the P-Flash user margin levels are applied to both P-Flash and
EEPROM reads. It is not possible to apply user margin levels to the P-Flash
block only.
Valid margin level settings for the Set User Margin Level command are defined in Table 25-55.
Table 25-54. Set User Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0D Flash block selection code [1:0]. See
Table 25-34
001 Margin level setting.
Table 25-55. Valid Set User Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level1
1Read margin to the erased state
0x0002 User Margin-0 Level2
2Read margin to the programmed state
Table 25-56. Set User Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 25-27)
Set if an invalid FlashBlockSelectionCode[1:0] is supplied (See Table 25-34 )
Set if an invalid margin level setting is supplied
FPVIOL None
MGSTAT1 None
MGSTAT0 None
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
906 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
User margin levels can be used to check that Flash memory contents have
adequate margin for normal level read operations. If unexpected results are
encountered when checking Flash memory contents at user margin levels, a
potential loss of information has been detected.
25.4.6.13 Set Field Margin Level Command
The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set
the margin level specified for future read operations of the P-Flash or EEPROM block.
Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the
field margin level for the targeted block and then set the CCIF flag.
NOTE
When the EEPROM block is targeted, the EEPROM field margin levels are
applied only to the EEPROM reads. However, when the P-Flash block is
targeted, the P-Flash field margin levels are applied to both P-Flash and
EEPROM reads. It is not possible to apply field margin levels to the P-Flash
block only.
Valid margin level settings for the Set Field Margin Level command are defined in Table 25-58.
Table 25-57. Set Field Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0E Flash block selection code [1:0]. See
Table 25-34
001 Margin level setting.
Table 25-58. Valid Set Field Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level1
1Read margin to the erased state
0x0002 User Margin-0 Level2
2Read margin to the programmed state
0x0003 Field Margin-1 Level1
0x0004 Field Margin-0 Level2
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 907
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
CAUTION
Field margin levels must only be used during verify of the initial factory
programming.
NOTE
Field margin levels can be used to check that Flash memory contents have
adequate margin for data retention at the normal level setting. If unexpected
results are encountered when checking Flash memory contents at field
margin levels, the Flash memory contents should be erased and
reprogrammed.
25.4.6.14 Erase Verify EEPROM Section Command
The Erase Verify EEPROM Section command will verify that a section of code in the EEPROM is erased.
The Erase Verify EEPROM Section command defines the starting point of the data to be verified and the
number of words.
Upon clearing CCIF to launch the Erase Verify EEPROM Section command, the Memory Controller will
verify the selected section of EEPROM memory is erased. The CCIF flag will set after the Erase Verify
EEPROM Section operation has completed. If the section is not erased, it means blank check failed, both
MGSTAT bits will be set.
Table 25-59. Set Field Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 25-27)
Set if an invalid FlashBlockSelectionCode[1:0] is supplied (See Table 25-34 )1
1As defined by the memory map for FTMRG96K1.
Set if an invalid margin level setting is supplied
FPVIOL None
MGSTAT1 None
MGSTAT0 None
Table 25-60. Erase Verify EEPROM Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x10
Global address [17:16] to
identify the EEPROM
block
001 Global address [15:0] of the first word to be verified
010 Number of words to be verified
96 KByte Flash Module (S12FTMRG96K1V1)
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25.4.6.15 Program EEPROM Command
The Program EEPROM operation programs one to four previously erased words in the EEPROM block.
The Program EEPROM operation will confirm that the targeted location(s) were successfully programmed
upon completion.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
Upon clearing CCIF to launch the Program EEPROM command, the user-supplied words will be
transferred to the Memory Controller and be programmed if the area is unprotected. The CCOBIX index
value at Program EEPROM command launch determines how many words will be programmed in the
EEPROM block. The CCIF flag is set when the operation has completed.
Table 25-61. Erase Verify EEPROM Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 25-27)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested section breaches the end of the EEPROM block
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
Table 25-62. Program EEPROM Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x11 Global address [17:16] to
identify the EEPROM block
001 Global address [15:0] of word to be programmed
010 Word 0 program value
011 Word 1 program value, if desired
100 Word 2 program value, if desired
101 Word 3 program value, if desired
96 KByte Flash Module (S12FTMRG96K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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25.4.6.16 Erase EEPROM Sector Command
The Erase EEPROM Sector operation will erase all addresses in a sector of the EEPROM block.
Upon clearing CCIF to launch the Erase EEPROM Sector command, the Memory Controller will erase the
selected Flash sector and verify that it is erased. The CCIF flag will set after the Erase EEPROM Sector
operation has completed.
Table 25-63. Program EEPROM Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] < 010 at command launch
Set if CCOBIX[2:0] > 101 at command launch
Set if command not available in current mode (see Table 25-27)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested group of words breaches the end of the EEPROM block
FPVIOL Set if the selected area of the EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 25-64. Erase EEPROM Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x12 Global address [17:16] to identify
EEPROM block
001 Global address [15:0] anywhere within the sector to be erased.
See Section 25.1.2.2 for EEPROM sector size.
Table 25-65. Erase EEPROM Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 25-27)
Set if an invalid global address [17:0] is suppliedsee Table 25-3)
Set if a misaligned word address is supplied (global address [0] != 0)
FPVIOL Set if the selected area of the EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
96 KByte Flash Module (S12FTMRG96K1V1)
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25.4.7 Interrupts
The Flash module can generate an interrupt when a Flash command operation has completed or when a
Flash command operation has detected an ECC fault.
NOTE
Vector addresses and their relative interrupt priority are determined at the
MCU level.
25.4.7.1 Description of Flash Interrupt Operation
The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the
Flash command interrupt request. The Flash module uses the DFDIF and SFDIF flags in combination with
the DFDIE and SFDIE interrupt enable bits to generate the Flash error interrupt request. For a detailed
description of the register bits involved, refer to Section 25.3.2.5, “Flash Configuration Register
(FCNFG)”, Section 25.3.2.6, “Flash Error Configuration Register (FERCNFG)”, Section 25.3.2.7, “Flash
Status Register (FSTAT)”, and Section 25.3.2.8, “Flash Error Status Register (FERSTAT)”.
The logic used for generating the Flash module interrupts is shown in Figure 25-27.
Figure 25-27. Flash Module Interrupts Implementation
Table 25-66. Flash Interrupt Sources
Interrupt Source Interrupt Flag Local Enable Global (CCR)
Mask
Flash Command Complete CCIF
(FSTAT register)
CCIE
(FCNFG register)
I Bit
ECC Double Bit Fault on Flash Read DFDIF
(FERSTAT register)
DFDIE
(FERCNFG register)
I Bit
ECC Single Bit Fault on Flash Read SFDIF
(FERSTAT register)
SFDIE
(FERCNFG register)
I Bit
Flash Error Interrupt Request
CCIF
CCIE
DFDIF
DFDIE
SFDIF
SFDIE
Flash Command Interrupt Request
96 KByte Flash Module (S12FTMRG96K1V1)
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25.4.8 Wait Mode
The Flash module is not affected if the MCU enters wait mode. The Flash module can recover the MCU
from wait via the CCIF interrupt (see Section 25.4.7, “Interrupts”).
25.4.9 Stop Mode
If a Flash command is active (CCIF = 0) when the MCU requests stop mode, the current Flash operation
will be completed before the MCU is allowed to enter stop mode.
25.5 Security
The Flash module provides security information to the MCU. The Flash security state is defined by the
SEC bits of the FSEC register (see Table 25-11). During reset, the Flash module initializes the FSEC
register using data read from the security byte of the Flash configuration field at global address 0x3_FF0F.
The security state out of reset can be permanently changed by programming the security byte assuming
that the MCU is starting from a mode where the necessary P-Flash erase and program commands are
available and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully
programmed, its new value will take affect after the next MCU reset.
The following subsections describe these security-related subjects:
• Unsecuring the MCU using Backdoor Key Access
• Unsecuring the MCU in Special Single Chip Mode using BDM
• Mode and Security Effects on Flash Command Availability
25.5.1 Unsecuring the MCU using Backdoor Key Access
The MCU may be unsecured by using the backdoor key access feature which requires knowledge of the
contents of the backdoor keys (four 16-bit words programmed at addresses 0x3_FF00-0x3_FF07). If the
KEYEN[1:0] bits are in the enabled state (see Section 25.3.2.2), the Verify Backdoor Access Key
command (see Section 25.4.6.11) allows the user to present four prospective keys for comparison to the
keys stored in the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor
Access Key command match the backdoor keys stored in the Flash memory, the SEC bits in the FSEC
register (see Table 25-11) will be changed to unsecure the MCU. Key values of 0x0000 and 0xFFFF are
not permitted as backdoor keys. While the Verify Backdoor Access Key command is active, P-Flash
memory and EEPROM memory will not be available for read access and will return invalid data.
96 KByte Flash Module (S12FTMRG96K1V1)
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The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an
external stimulus. This external stimulus would typically be through one of the on-chip serial ports.
If the KEYEN[1:0] bits are in the enabled state (see Section 25.3.2.2), the MCU can be unsecured by the
backdoor key access sequence described below:
1. Follow the command sequence for the Verify Backdoor Access Key command as explained in
Section 25.4.6.11
2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the
SEC[1:0] bits in the FSEC register are forced to the unsecure state of 10
The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will
prohibit future use of the Verify Backdoor Access Key command. A reset of the MCU is the only method
to re-enable the Verify Backdoor Access Key command. The security as defined in the Flash security byte
(0x3_FF0F) is not changed by using the Verify Backdoor Access Key command sequence. The backdoor
keys stored in addresses 0x3_FF00-0x3_FF07 are unaffected by the Verify Backdoor Access Key
command sequence. The Verify Backdoor Access Key command sequence has no effect on the program
and erase protections defined in the Flash protection register, FPROT.
After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is
unsecured, the sector containing the Flash security byte can be erased and the Flash security byte can be
reprogrammed to the unsecure state, if desired. In the unsecure state, the user has full control of the
contents of the backdoor keys by programming addresses 0x3_FF00-0x3_FF07 in the Flash configuration
field.
25.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM
A secured MCU can be unsecured in special single chip mode by using the following method to erase the
P-Flash and EEPROM memory:
1. Reset the MCU into special single chip mode
2. Delay while the BDM executes the Erase Verify All Blocks command write sequence to check if
the P-Flash and EEPROM memories are erased
3. Send BDM commands to disable protection in the P-Flash and EEPROM memory
4. Execute the Erase All Blocks command write sequence to erase the P-Flash and EEPROM
memory. Alternatively the Unsecure Flash command can be executed, if so the steps 5 and 6 below
are skeeped.
5. After the CCIF flag sets to indicate that the Erase All Blocks operation has completed, reset the
MCU into special single chip mode
6. Delay while the BDM executes the Erase Verify All Blocks command write sequence to verify that
the P-Flash and EEPROM memory are erased
If the P-Flash and EEPROM memory are verified as erased, the MCU will be unsecured. All BDM
commands will now be enabled and the Flash security byte may be programmed to the unsecure state by
continuing with the following steps:
7. Send BDM commands to execute the Program P-Flash command write sequence to program the
Flash security byte to the unsecured state
96 KByte Flash Module (S12FTMRG96K1V1)
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8. Reset the MCU
25.5.3 Mode and Security Effects on Flash Command Availability
The availability of Flash module commands depends on the MCU operating mode and security state as
shown in Table 25-27.
25.6 Initialization
On each system reset the flash module executes an initialization sequence which establishes initial values
for the Flash Block Configuration Parameters, the FPROT and EEPROT protection registers, and the FOPT
and FSEC registers. The initialization routine reverts to built-in default values that leave the module in a
fully protected and secured state if errors are encountered during execution of the reset sequence. If a
double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT register will be set.
CCIF is cleared throughout the initialization sequence. The Flash module holds off all CPU access for a
portion of the initialization sequence. Flash reads are allowed once the hold is removed. Completion of the
initialization sequence is marked by setting CCIF high which enables user commands.
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The
state of the word being programmed or the sector/block being erased is not guaranteed.
96 KByte Flash Module (S12FTMRG96K1V1)
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Chapter 26
128 KByte Flash Module (S12FTMRG128K1V1)
26.1 Introduction
The FTMRG128K1 module implements the following:
• 128Kbytes of P-Flash (Program Flash) memory
• 4 Kbytes of EEPROM memory
The Flash memory is ideal for single-supply applications allowing for field reprogramming without
requiring external high voltage sources for program or erase operations. The Flash module includes a
memory controller that executes commands to modify Flash memory contents. The user interface to the
memory controller consists of the indexed Flash Common Command Object (FCCOB) register which is
written to with the command, global address, data, and any required command parameters. The memory
controller must complete the execution of a command before the FCCOB register can be written to with a
new command.
CAUTION
A Flash word or phrase must be in the erased state before being
programmed. Cumulative programming of bits within a Flash word or
phrase is not allowed.
Table 26-1. Revision History
Revision
Number
Revision
Date
Sections
Affected Description of Changes
V01.11 17 Jun 2010 26.4.6.1/26-948
26.4.6.2/26-949
26.4.6.3/26-949
26.4.6.14/26-95
9
Clarify Erase Verify Commands Descriptions related to the bits MGSTAT[1:0]
of the register FSTAT.
V01.12 31 aug 2010 26.4.6.2/26-949
26.4.6.12/26-95
6
26.4.6.13/26-95
8
Updated description of the commands RD1BLK, MLOADU and MLOADF
Rev.1.06 31 Jan 2011 26.3.2.9/26-932 Updated description of protection on Section 26.3.2.9
MC9S12G Family Reference Manual, Rev.1.06
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The Flash memory may be read as bytes and aligned words. Read access time is one bus cycle for bytes
and aligned words. For misaligned words access, the CPU has to perform twice the byte read access
command. For Flash memory, an erased bit reads 1 and a programmed bit reads 0.
It is possible to read from P-Flash memory while some commands are executing on EEPROM memory. It
is not possible to read from EEPROM memory while a command is executing on P-Flash memory.
Simultaneous P-Flash and EEPROM operations are discussed in Section 26.4.5.
Both P-Flash and EEPROM memories are implemented with Error Correction Codes (ECC) that can
resolve single bit faults and detect double bit faults. For P-Flash memory, the ECC implementation
requires that programming be done on an aligned 8 byte basis (a Flash phrase). Since P-Flash memory is
always read by half-phrase, only one single bit fault in an aligned 4 byte half-phrase containing the byte
or word accessed will be corrected.
26.1.1 Glossary
Command Write Sequence — An MCU instruction sequence to execute built-in algorithms (including
program and erase) on the Flash memory.
EEPROM Memory — The EEPROM memory constitutes the nonvolatile memory store for data.
EEPROM Sector — The EEPROM sector is the smallest portion of the EEPROM memory that can be
erased. The EEPROM sector consists of 4 bytes.
NVM Command Mode — An NVM mode using the CPU to setup the FCCOB register to pass parameters
required for Flash command execution.
Phrase — An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes two
sets of aligned double words with each set including 7 ECC bits for single bit fault correction and double
bit fault detection within each double word.
P-Flash Memory — The P-Flash memory constitutes the main nonvolatile memory store for applications.
P-Flash Sector — The P-Flash sector is the smallest portion of the P-Flash memory that can be erased.
Each P-Flash sector contains 512 bytes.
Program IFR — Nonvolatile information register located in the P-Flash block that contains the Version
ID, and the Program Once field.
26.1.2 Features
26.1.2.1 P-Flash Features
• 128 Kbytes of P-Flash memory composed of one 128 Kbyte Flash block divided into 256 sectors
of 512 bytes
128 KByte Flash Module (S12FTMRG128K1V1)
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• Single bit fault correction and double bit fault detection within a 32-bit double word during read
operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and phrase program operation
• Ability to read the P-Flash memory while programming a word in the EEPROM memory
• Flexible protection scheme to prevent accidental program or erase of P-Flash memory
26.1.2.2 EEPROM Features
• 4 Kbytes of EEPROM memory composed of one 4 Kbyte Flash block divided into 1024 sectors of
4 bytes
• Single bit fault correction and double bit fault detection within a word during read operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and word program operation
• Protection scheme to prevent accidental program or erase of EEPROM memory
• Ability to program up to four words in a burst sequence
26.1.2.3 Other Flash Module Features
• No external high-voltage power supply required for Flash memory program and erase operations
• Interrupt generation on Flash command completion and Flash error detection
• Security mechanism to prevent unauthorized access to the Flash memory
26.1.3 Block Diagram
The block diagram of the Flash module is shown in Figure 26-1.
128 KByte Flash Module (S12FTMRG128K1V1)
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Figure 26-1. FTMRG128K1 Block Diagram
26.2 External Signal Description
The Flash module contains no signals that connect off-chip.
Bus
Clock
Divider
Clock
Command
Interrupt
Request
FCLK
Protection
Security
Registers
Flash
Interface
16bit
internal
bus
sector 0
sector 1
sector 255
32Kx39
P-Flash
Error
Interrupt
Request
CPU
sector 0
sector 1
sector 1023
2Kx22
EEPROM
Memory Controller
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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26.3 Memory Map and Registers
This section describes the memory map and registers for the Flash module. Read data from unimplemented
memory space in the Flash module is undefined. Write access to unimplemented or reserved memory space
in the Flash module will be ignored by the Flash module.
CAUTION
Writing to the Flash registers while a Flash command is executing (that is
indicated when the value of flag CCIF reads as ’0’) is not allowed. If such
action is attempted the write operation will not change the register value.
Writing to the Flash registers is allowed when the Flash is not busy
executing commands (CCIF = 1) and during initialization right after reset,
despite the value of flag CCIF in that case (refer to Section 26.6 for a
complete description of the reset sequence).
.
26.3.1 Module Memory Map
The S12 architecture places the P-Flash memory between global addresses 0x2_0000 and 0x3_FFFF as
shown in Table 26-3.The P-Flash memory map is shown in Figure 26-2.
Table 26-2. FTMRG Memory Map
Global Address (in Bytes) Size
(Bytes) Description
0x0_0000 - 0x0_03FF 1,024 Register Space
0x0_0400 – 0x0_13FF 4,096 EEPROM Memory
0x0_4000 – 0x0_7FFF 16,284 NVMRES1=1 : NVM Resource area (see Figure 26-3)
1See NVMRES description in Section 26.4.3
0x2_0000 – 0x3_FFFF 131,072 P-Flash Memory
Table 26-3. P-Flash Memory Addressing
Global Address Size
(Bytes) Description
0x2_0000 – 0x3_FFFF 128 K
P-Flash Block
Contains Flash Configuration Field
(see Table 26-4)
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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The FPROT register, described in Section 26.3.2.9, can be set to protect regions in the Flash memory from
accidental program or erase. Three separate memory regions, one growing upward from global address
0x3_8000 in the Flash memory (called the lower region), one growing downward from global address
0x3_FFFF in the Flash memory (called the higher region), and the remaining addresses in the Flash
memory, can be activated for protection. The Flash memory addresses covered by these protectable regions
are shown in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader
code since it covers the vector space. Default protection settings as well as security information that allows
the MCU to restrict access to the Flash module are stored in the Flash configuration field as described in
Table 26-4.
Table 26-4. Flash Configuration Field
Global Address Size
(Bytes) Description
0x3_FF00-0x3_FF07 8
Backdoor Comparison Key
Refer to Section 26.4.6.11, “Verify Backdoor Access Key Command,” and
Section 26.5.1, “Unsecuring the MCU using Backdoor Key Access”
0x3_FF08-0x3_FF0B1
10x3FF08-0x3_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in
the 0x3_FF08 - 0x3_FF0B reserved field should be programmed to 0xFF.
4 Reserved
0x3_FF0C11P-Flash Protection byte.
Refer to Section 26.3.2.9, “P-Flash Protection Register (FPROT)”
0x3_FF0D11EEPROM Protection byte.
Refer to Section 26.3.2.10, “EEPROM Protection Register (DFPROT)”
0x3_FF0E11Flash Nonvolatile byte
Refer to Section 26.3.2.16, “Flash Option Register (FOPT)”
0x3_FF0F11Flash Security byte
Refer to Section 26.3.2.2, “Flash Security Register (FSEC)”
128 KByte Flash Module (S12FTMRG128K1V1)
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Figure 26-2. P-Flash Memory Map
Table 26-5. Program IFR Fields
Global Address Size
(Bytes) Field Description
0x0_4000 – 0x0_4007 8 Reserved
0x0_4008 – 0x0_40B5 174 Reserved
0x0_40B6 – 0x0_40B7 2 Version ID1
Flash Configuration Field
0x3_C000
Flash Protected/Unprotected Lower Region
1, 2, 4, 8 Kbytes
0x3_8000
0x3_9000
0x3_8400
0x3_8800
0x3_A000
P-Flash END = 0x3_FFFF
0x3_F800
0x3_F000
0x3_E000 Flash Protected/Unprotected Higher Region
2, 4, 8, 16 Kbytes
Flash Protected/Unprotected Region
8 Kbytes (up to 29 Kbytes)
16 bytes (0x3_FF00 - 0x3_FF0F)
Flash Protected/Unprotected Region
96 Kbytes
P-Flash START = 0x2_0000
Protection
Protection
Protection
Movable End
Fixed End
Fixed End
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
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Figure 26-3. Memory Controller Resource Memory Map (NVMRES=1)
0x0_40B8 – 0x0_40BF 8 Reserved
0x0_40C0 – 0x0_40FF 64 Program Once Field
Refer to Section 26.4.6.6, “Program Once Command”
1Used to track firmware patch versions, see Section 26.4.2
Table 26-6. Memory Controller Resource Fields (NVMRES1=1)
1NVMRES - See Section 26.4.3 for NVMRES (NVM Resource) detail.
Global Address Size
(Bytes) Description
0x0_4000 – 0x040FF 256 P-Flash IFR (see Table 26-5)
0x0_4100 – 0x0_41FF 256 Reserved.
0x0_4200 – 0x0_57FF Reserved
0x0_5800 – 0x0_59FF 512 Reserved
0x0_5A00 – 0x0_5FFF 1,536 Reserved
0x0_6000 – 0x0_6BFF 3,072 Reserved
0x0_6C00 – 0x0_7FFF 5,120 Reserved
Table 26-5. Program IFR Fields
Global Address Size
(Bytes) Field Description
P-Flash IFR 1 Kbyte (NVMRES=1)
0x0_4000
RAM End = 0x0_59FF
RAM Start = 0x0_5800
Reserved 5120 bytes
Reserved 4608 bytes
0x0_6C00
0x0_7FFF
0x0_4400 Reserved 5k bytes
Reserved 512 bytes
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 923
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.3.2 Register Descriptions
The Flash module contains a set of 20 control and status registers located between Flash module base +
0x0000 and 0x0013.
In the case of the writable registers, the write accesses are forbidden during Fash command execution (for
more detail, see Caution note in Section 26.3).
A summary of the Flash module registers is given in Figure 26-4 with detailed descriptions in the
following subsections.
Address
& Name 76543210
0x0000
FCLKDIV
R FDIVLD FDIVLCK FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0
W
0x0001
FSEC
R KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0
W
0x0002
FCCOBIX
R0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0
W
0x0003
FRSV0
R00000000
W
0x0004
FCNFG
RCCIE 00
IGNSF 00
FDFD FSFD
W
0x0005
FERCNFG
R0 0 0 0 0 0 DFDIE SFDIE
W
0x0006
FSTAT
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT1 MGSTAT0
W
0x0007
FERSTAT
R0 0 0 0 0 0 DFDIF SFDIF
W
0x0008
FPROT
RFPOPEN RNV6 FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0
W
0x0009
DFPROT
RDPOPEN DPS6 DPS5 DPS4 DPS3 DPS2 DPS1 DPS0
W
Figure 26-4. FTMRG128K1 Register Summary
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
924 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.3.2.1 Flash Clock Divider Register (FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
0x000A
FCCOBHI
RCCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8
W
0x000B
FCCOBLO
RCCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0
W
0x000C
FRSV1
R00000000
W
0x000D
FRSV2
R00000000
W
0x000E
FRSV3
R00000000
W
0x000F
FRSV4
R00000000
W
0x0010
FOPT
R NV7 NV6 NV5 NV4 NV3 NV2 NV1 NV0
W
0x0011
FRSV5
R00000000
W
0x0012
FRSV6
R00000000
W
0x0013
FRSV7
R00000000
W
= Unimplemented or Reserved
Address
& Name 76543210
Figure 26-4. FTMRG128K1 Register Summary (continued)
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 925
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FCLKDIV register are readable, bit 7 is not writable, bit 6 is write-once-hi and controls the
writability of the FDIV field in normal mode. In special mode, bits 6-0 are writable any number of times
but bit 7 remains unwritable.
CAUTION
The FCLKDIV register should never be written while a Flash command is
executing (CCIF=0).
Offset Module Base + 0x0000
76543210
R FDIVLD FDIVLCK FDIV[5:0]
W
Reset 00000000
= Unimplemented or Reserved
Figure 26-5. Flash Clock Divider Register (FCLKDIV)
Table 26-7. FCLKDIV Field Descriptions
Field Description
7
FDIVLD
Clock Divider Loaded
0 FCLKDIV register has not been written since the last reset
1 FCLKDIV register has been written since the last reset
6
FDIVLCK
Clock Divider Locked
0 FDIV field is open for writing
1 FDIV value is locked and cannot be changed. Once the lock bit is set high, only reset can clear this bit and
restore writability to the FDIV field in normal mode.
5–0
FDIV[5:0]
Clock Divider Bits — FDIV[5:0] must be set to effectively divide BUSCLK down to 1 MHz to control timed events
during Flash program and erase algorithms. Table 26-8 shows recommended values for FDIV[5:0] based on the
BUSCLK frequency. Please refer to Section 26.4.4, “Flash Command Operations,” for more information.
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
926 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.3.2.2 Flash Security Register (FSEC)
The FSEC register holds all bits associated with the security of the MCU and Flash module.
All bits in the FSEC register are readable but not writable.
During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the
Flash configuration field at global address 0x3_FF0F located in P-Flash memory (see Table 26-4) as
Table 26-8. FDIV values for various BUSCLK Frequencies
BUSCLK Frequency
(MHz) FDIV[5:0]
BUSCLK Frequency
(MHz) FDIV[5:0]
MIN1
1BUSCLK is Greater Than this value.
MAX2
2BUSCLK is Less Than or Equal to this value.
MIN1MAX2
1.0 1.6 0x00 16.6 17.6 0x10
1.6 2.6 0x01 17.6 18.6 0x11
2.6 3.6 0x02 18.6 19.6 0x12
3.6 4.6 0x03 19.6 20.6 0x13
4.6 5.6 0x04 20.6 21.6 0x14
5.6 6.6 0x05 21.6 22.6 0x15
6.6 7.6 0x06 22.6 23.6 0x16
7.6 8.6 0x07 23.6 24.6 0x17
8.6 9.6 0x08 24.6 25.6 0x18
9.6 10.6 0x09
10.6 11.6 0x0A
11.6 12.6 0x0B
12.6 13.6 0x0C
13.6 14.6 0x0D
14.6 15.6 0x0E
15.6 16.6 0x0F
Offset Module Base + 0x0001
76543210
R KEYEN[1:0] RNV[5:2] SEC[1:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 26-6. Flash Security Register (FSEC)
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 927
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
indicated by reset condition F in Figure 26-6. If a double bit fault is detected while reading the P-Flash
phrase containing the Flash security byte during the reset sequence, all bits in the FSEC register will be set
to leave the Flash module in a secured state with backdoor key access disabled.
The security function in the Flash module is described in Section 26.5.
26.3.2.3 Flash CCOB Index Register (FCCOBIX)
The FCCOBIX register is used to index the FCCOB register for Flash memory operations.
Table 26-9. FSEC Field Descriptions
Field Description
7–6
KEYEN[1:0]
Backdoor Key Security Enable Bits — The KEYEN[1:0] bits define the enabling of backdoor key access to the
Flash module as shown in Table 26-10.
5–2
RNV[5:2]
Reserved Nonvolatile Bits — The RNV bits should remain in the erased state for future enhancements.
1–0
SEC[1:0]
Flash Security Bits — The SEC[1:0] bits define the security state of the MCU as shown in Table 26-11. If the
Flash module is unsecured using backdoor key access, the SEC bits are forced to 10.
Table 26-10. Flash KEYEN States
KEYEN[1:0] Status of Backdoor Key Access
00 DISABLED
01 DISABLED1
1Preferred KEYEN state to disable backdoor key access.
10 ENABLED
11 DISABLED
Table 26-11. Flash Security States
SEC[1:0] Status of Security
00 SECURED
01 SECURED1
1Preferred SEC state to set MCU to secured state.
10 UNSECURED
11 SECURED
Offset Module Base + 0x0002
76543210
R00000 CCOBIX[2:0]
W
Reset 00000000
= Unimplemented or Reserved
Figure 26-7. FCCOB Index Register (FCCOBIX)
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
928 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
CCOBIX bits are readable and writable while remaining bits read 0 and are not writable.
26.3.2.4 Flash Reserved0 Register (FRSV0)
This Flash register is reserved for factory testing.
All bits in the FRSV0 register read 0 and are not writable.
26.3.2.5 Flash Configuration Register (FCNFG)
The FCNFG register enables the Flash command complete interrupt and forces ECC faults on Flash array
read access from the CPU.
CCIE, IGNSF, FDFD, and FSFD bits are readable and writable while remaining bits read 0 and are not
writable.
Table 26-12. FCCOBIX Field Descriptions
Field Description
2–0
CCOBIX[1:0]
Common Command Register Index— The CCOBIX bits are used to select which word of the FCCOB register
array is being read or written to. See <st-blue>26.3.2.11 Flash Common Command Object Register (FCCOB),”
for more details.
Offset Module Base + 0x000C
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 26-8. Flash Reserved0 Register (FRSV0)
Offset Module Base + 0x0004
76543210
RCCIE 00
IGNSF 00
FDFD FSFD
W
Reset 00000000
= Unimplemented or Reserved
Figure 26-9. Flash Configuration Register (FCNFG)
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 929
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.3.2.6 Flash Error Configuration Register (FERCNFG)
The FERCNFG register enables the Flash error interrupts for the FERSTAT flags.
All assigned bits in the FERCNFG register are readable and writable.
Table 26-13. FCNFG Field Descriptions
Field Description
7
CCIE
Command Complete Interrupt Enable — The CCIE bit controls interrupt generation when a Flash command
has completed.
0 Command complete interrupt disabled
1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see Section 26.3.2.7)
4
IGNSF
Ignore Single Bit Fault — The IGNSF controls single bit fault reporting in the FERSTAT register (see
Section 26.3.2.8).
0 All single bit faults detected during array reads are reported
1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be
generated
1
FDFD
Force Double Bit Fault Detect — The FDFD bit allows the user to simulate a double bit fault during Flash array
read operations and check the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD.
0 Flash array read operations will set the DFDIF flag in the FERSTAT register only if a double bit fault is detected
1 Any Flash array read operation will force the DFDIF flag in the FERSTAT register to be set (see
Section 26.3.2.7) and an interrupt will be generated as long as the DFDIE interrupt enable in the FERCNFG
register is set (see Section 26.3.2.6)
0
FSFD
Force Single Bit Fault Detect —The FSFD bit allows the user to simulate a single bit fault during Flash array
read operations and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD.
0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected
1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see Section 26.3.2.7)
and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set (see
Section 26.3.2.6)
Offset Module Base + 0x0005
76543210
R000000
DFDIE SFDIE
W
Reset 00000000
= Unimplemented or Reserved
Figure 26-10. Flash Error Configuration Register (FERCNFG)
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
930 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.3.2.7 Flash Status Register (FSTAT)
The FSTAT register reports the operational status of the Flash module.
CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable
but not writable, while remaining bits read 0 and are not writable.
Table 26-14. FERCNFG Field Descriptions
Field Description
1
DFDIE
Double Bit Fault Detect Interrupt Enable — The DFDIE bit controls interrupt generation when a double bit fault
is detected during a Flash block read operation.
0 DFDIF interrupt disabled
1 An interrupt will be requested whenever the DFDIF flag is set (see Section 26.3.2.8)
0
SFDIE
Single Bit Fault Detect Interrupt Enable — The SFDIE bit controls interrupt generation when a single bit fault
is detected during a Flash block read operation.
0 SFDIF interrupt disabled whenever the SFDIF flag is set (see Section 26.3.2.8)
1 An interrupt will be requested whenever the SFDIF flag is set (see Section 26.3.2.8)
Offset Module Base + 0x0006
76543210
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT[1:0]
W
Reset 1000000
1
1Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see Section 26.6).
01
= Unimplemented or Reserved
Figure 26-11. Flash Status Register (FSTAT)
Table 26-15. FSTAT Field Descriptions
Field Description
7
CCIF
Command Complete Interrupt Flag — The CCIF flag indicates that a Flash command has completed. The
CCIF flag is cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command
completion or command violation.
0 Flash command in progress
1 Flash command has completed
5
ACCERR
Flash Access Error Flag — The ACCERR bit indicates an illegal access has occurred to the Flash memory
caused by either a violation of the command write sequence (see Section 26.4.4.2) or issuing an illegal Flash
command. While ACCERR is set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is
cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR bit has no effect on ACCERR.
0 No access error detected
1 Access error detected
4
FPVIOL
Flash Protection Violation Flag —The FPVIOL bit indicates an attempt was made to program or erase an
address in a protected area of P-Flash or EEPROM memory during a command write sequence. The FPVIOL
bit is cleared by writing a 1 to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL
is set, it is not possible to launch a command or start a command write sequence.
0 No protection violation detected
1 Protection violation detected
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 931
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.3.2.8 Flash Error Status Register (FERSTAT)
The FERSTAT register reflects the error status of internal Flash operations.
All flags in the FERSTAT register are readable and only writable to clear the flag.
3
MGBUSY
Memory Controller Busy Flag — The MGBUSY flag reflects the active state of the Memory Controller.
0 Memory Controller is idle
1 Memory Controller is busy executing a Flash command (CCIF = 0)
2
RSVD
Reserved Bit — This bit is reserved and always reads 0.
1–0
MGSTAT[1:0]
Memory Controller Command Completion Status Flag — One or more MGSTAT flag bits are set if an error
is detected during execution of a Flash command or during the Flash reset sequence. See Section 26.4.6,
“Flash Command Description,” and Section 26.6, “Initialization” for details.
Offset Module Base + 0x0007
76543210
R000000
DFDIF SFDIF
W
Reset 00000000
= Unimplemented or Reserved
Figure 26-12. Flash Error Status Register (FERSTAT)
Table 26-16. FERSTAT Field Descriptions
Field Description
1
DFDIF
Double Bit Fault Detect Interrupt Flag — The setting of the DFDIF flag indicates that a double bit fault was
detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation
returning invalid data was attempted on a Flash block that was under a Flash command operation.1The DFDIF
flag is cleared by writing a 1 to DFDIF. Writing a 0 to DFDIF has no effect on DFDIF.2
0 No double bit fault detected
1 Double bit fault detected or a Flash array read operation returning invalid data was attempted while command
running
1 The single bit fault and double bit fault flags are mutually exclusive for parity errors (an ECC fault occurrence can be either
single fault or double fault but never both). A simultaneous access collision (Flash array read operation returning invalid data
attempted while command running) is indicated when both SFDIF and DFDIF flags are high.
2There is a one cycle delay in storing the ECC DFDIF and SFDIF fault flags in this register. At least one NOP is required after
a flash memory read before checking FERSTAT for the occurrence of ECC errors.
0
SFDIF
Single Bit Fault Detect Interrupt Flag — With the IGNSF bit in the FCNFG register clear, the SFDIF flag
indicates that a single bit fault was detected in the stored parity and data bits during a Flash array read operation
or that a Flash array read operation returning invalid data was attempted on a Flash block that was under a Flash
command operation.1 The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on
SFDIF.
0 No single bit fault detected
1 Single bit fault detected and corrected or a Flash array read operation returning invalid data was attempted
while command running
Table 26-15. FSTAT Field Descriptions (continued)
Field Description
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
932 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.3.2.9 P-Flash Protection Register (FPROT)
The FPROT register defines which P-Flash sectors are protected against program and erase operations.
The (unreserved) bits of the FPROT register are writable with the restriction that the size of the protected
region can only be increased (see Section 26.3.2.9.1, “P-Flash Protection Restrictions,” and Table 26-21).
During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte
in the Flash configuration field at global address 0x3_FF0C located in P-Flash memory (see Table 26-4)
as indicated by reset condition ‘F’ in Figure 26-13. To change the P-Flash protection that will be loaded
during the reset sequence, the upper sector of the P-Flash memory must be unprotected, then the P-Flash
protection byte must be reprogrammed. If a double bit fault is detected while reading the P-Flash phrase
containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and
remaining bits in the FPROT register will be set to leave the P-Flash memory fully protected.
Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error
and the FPVIOL bit will be set in the FSTAT register. The block erase of a P-Flash block is not possible if
any of the P-Flash sectors contained in the same P-Flash block are protected.
Offset Module Base + 0x0008
76543210
RFPOPEN RNV6 FPHDIS FPHS[1:0] FPLDIS FPLS[1:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 26-13. Flash Protection Register (FPROT)
Table 26-17. FPROT Field Descriptions
Field Description
7
FPOPEN
Flash Protection Operation Enable — The FPOPEN bit determines the protection function for program or
erase operations as shown in Table 26-18 for the P-Flash block.
0 When FPOPEN is clear, the FPHDIS and FPLDIS bits define unprotected address ranges as specified by the
corresponding FPHS and FPLS bits
1 When FPOPEN is set, the FPHDIS and FPLDIS bits enable protection for the address range specified by the
corresponding FPHS and FPLS bits
6
RNV[6]
Reserved Nonvolatile Bit — The RNV bit should remain in the erased state for future enhancements.
5
FPHDIS
Flash Protection Higher Address Range Disable — The FPHDIS bit determines whether there is a
protected/unprotected area in a specific region of the P-Flash memory ending with global address 0x3_FFFF.
0 Protection/Unprotection enabled
1 Protection/Unprotection disabled
4–3
FPHS[1:0]
Flash Protection Higher Address Size — The FPHS bits determine the size of the protected/unprotected area
in P-Flash memory as shown inTable 26-19. The FPHS bits can only be written to while the FPHDIS bit is set.
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 933
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All possible P-Flash protection scenarios are shown in Figure 26-14 . Although the protection scheme is
loaded from the Flash memory at global address 0x3_FF0C during the reset sequence, it can be changed
by the user. The P-Flash protection scheme can be used by applications requiring reprogramming in single
chip mode while providing as much protection as possible if reprogramming is not required.
2
FPLDIS
Flash Protection Lower Address Range Disable — The FPLDIS bit determines whether there is a
protected/unprotected area in a specific region of the P-Flash memory beginning with global address 0x3_8000.
0 Protection/Unprotection enabled
1 Protection/Unprotection disabled
1–0
FPLS[1:0]
Flash Protection Lower Address Size — The FPLS bits determine the size of the protected/unprotected area
in P-Flash memory as shown in Table 26-20. The FPLS bits can only be written to while the FPLDIS bit is set.
Table 26-18. P-Flash Protection Function
FPOPEN FPHDIS FPLDIS Function1
1For range sizes, refer to Table 26-19 and Table 26-20.
1 1 1 No P-Flash Protection
1 1 0 Protected Low Range
1 0 1 Protected High Range
1 0 0 Protected High and Low Ranges
0 1 1 Full P-Flash Memory Protected
0 1 0 Unprotected Low Range
0 0 1 Unprotected High Range
0 0 0 Unprotected High and Low Ranges
Table 26-19. P-Flash Protection Higher Address Range
FPHS[1:0] Global Address Range Protected Size
00 0x3_F800–0x3_FFFF 2 Kbytes
01 0x3_F000–0x3_FFFF 4 Kbytes
10 0x3_E000–0x3_FFFF 8 Kbytes
11 0x3_C000–0x3_FFFF 16 Kbytes
Table 26-20. P-Flash Protection Lower Address Range
FPLS[1:0] Global Address Range Protected Size
00 0x3_8000–0x3_83FF 1 Kbyte
01 0x3_8000–0x3_87FF 2 Kbytes
10 0x3_8000–0x3_8FFF 4 Kbytes
11 0x3_8000–0x3_9FFF 8 Kbytes
Table 26-17. FPROT Field Descriptions (continued)
Field Description
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
934 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 26-14. P-Flash Protection Scenarios
7654
FPHS[1:0] FPLS[1:0]
3210
FPHS[1:0] FPLS[1:0]
FPHDIS = 1
FPLDIS = 1
FPHDIS = 1
FPLDIS = 0
FPHDIS = 0
FPLDIS = 1
FPHDIS = 0
FPLDIS = 0
Scenario
Scenario
Unprotected region Protected region with size
Protected region Protected region with size
defined by FPLS
defined by FPHSnot defined by FPLS, FPHS
0x3_8000
0x3_FFFF
0x3_8000
0x3_FFFF
FLASH START
FLASH START
FPOPEN = 1FPOPEN = 0
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 935
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.3.2.9.1 P-Flash Protection Restrictions
The general guideline is that P-Flash protection can only be added and not removed. Table 26-21 specifies
all valid transitions between P-Flash protection scenarios. Any attempt to write an invalid scenario to the
FPROT register will be ignored. The contents of the FPROT register reflect the active protection scenario.
See the FPHS and FPLS bit descriptions for additional restrictions.
26.3.2.10 EEPROM Protection Register (DFPROT)
The DFPROT register defines which EEPROM sectors are protected against program and erase operations.
The (unreserved) bits of the DFPROT register are writable with the restriction that protection can be added
but not removed. Writes must increase the DPS value and the DPOPEN bit can only be written from 1
(protection disabled) to 0 (protection enabled). If the DPOPEN bit is set, the state of the DPS bits is
irrelevant.
During the reset sequence, fields DPOPEN and DPS of the DFPROT register are loaded with the contents
of the EEPROM protection byte in the Flash configuration field at global address 0x3_FF0D located in
Table 26-21. P-Flash Protection Scenario Transitions
From
Protection
Scenario
To Protection Scenario1
1Allowed transitions marked with X, see Figure 26-14 for a definition of the scenarios.
01234567
0XXXX
1XX
2XX
3X
4XX
5XXXX
6XXXX
7XXXXXXXX
Offset Module Base + 0x0009
76543210
RDPOPEN DPS[6:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
Figure 26-15. EEPROM Protection Register (DFPROT)
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
936 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
P-Flash memory (see Table 26-4) as indicated by reset condition F in Table 26-23. To change the
EEPROM protection that will be loaded during the reset sequence, the P-Flash sector containing the
EEPROM protection byte must be unprotected, then the EEPROM protection byte must be programmed.
If a double bit fault is detected while reading the P-Flash phrase containing the EEPROM protection byte
during the reset sequence, the DPOPEN bit will be cleared and DPS bits will be set to leave the EEPROM
memory fully protected.
Trying to alter data in any protected area in the EEPROM memory will result in a protection violation error
and the FPVIOL bit will be set in the FSTAT register. Block erase of the EEPROM memory is not possible
if any of the EEPROM sectors are protected.
Table 26-22. DFPROT Field Descriptions
Field Description
7
DPOPEN
EEPROM Protection Control
0 Enables EEPROM memory protection from program and erase with protected address range defined by DPS
bits
1 Disables EEPROM memory protection from program and erase
6–0
DPS[6:0]
EEPROM Protection Size — The DPS[6:0] bits determine the size of the protected area in the EEPROM
memory, this size increase in step of 32 bytes, as shown in Table 26-23 .
Table 26-23. EEPROM Protection Address Range
DPS[6:0] Global Address Range Protected Size
0000000 0x0_0400 – 0x0_041F 32 bytes
0000001 0x0_0400 – 0x0_043F 64 bytes
0000010 0x0_0400 – 0x0_045F 96 bytes
0000011 0x0_0400 – 0x0_047F 128 bytes
0000100 0x0_0400 – 0x0_049F 160 bytes
0000101 0x0_0400 – 0x0_04BF 192 bytes
The Protection Size goes on enlarging in step of 32 bytes, for each DPS value
increasing of one.
.
.
.
1111111 0x0_0400 – 0x0_13FF 4,096 bytes
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 937
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.3.2.11 Flash Common Command Object Register (FCCOB)
The FCCOB is an array of six words addressed via the CCOBIX index found in the FCCOBIX register.
Byte wide reads and writes are allowed to the FCCOB register.
26.3.2.11.1 FCCOB - NVM Command Mode
NVM command mode uses the indexed FCCOB register to provide a command code and its relevant
parameters to the Memory Controller. The user first sets up all required FCCOB fields and then initiates
the command’s execution by writing a 1 to the CCIF bit in the FSTAT register (a 1 written by the user clears
the CCIF command completion flag to 0). When the user clears the CCIF bit in the FSTAT register all
FCCOB parameter fields are locked and cannot be changed by the user until the command completes (as
evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the
FCCOB register array.
The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 26-24. The
return values are available for reading after the CCIF flag in the FSTAT register has been returned to 1 by
the Memory Controller. Writes to the unimplemented parameter fields (CCOBIX = 110 and CCOBIX =
111) are ignored with reads from these fields returning 0x0000.
Table 26-24 shows the generic Flash command format. The high byte of the first word in the CCOB array
contains the command code, followed by the parameters for this specific Flash command. For details on
the FCCOB settings required by each command, see the Flash command descriptions in Section 26.4.6.
Offset Module Base + 0x000A
76543210
RCCOB[15:8]
W
Reset 00000000
Figure 26-16. Flash Common Command Object High Register (FCCOBHI)
Offset Module Base + 0x000B
76543210
RCCOB[7:0]
W
Reset 00000000
Figure 26-17. Flash Common Command Object Low Register (FCCOBLO)
Table 26-24. FCCOB - NVM Command Mode (Typical Usage)
CCOBIX[2:0] Byte FCCOB Parameter Fields (NVM Command Mode)
000 HI FCMD[7:0] defining Flash command
LO 6’h0, Global address [17:16]
001 HI Global address [15:8]
LO Global address [7:0]
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
938 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.3.2.12 Flash Reserved1 Register (FRSV1)
This Flash register is reserved for factory testing.
All bits in the FRSV1 register read 0 and are not writable.
26.3.2.13 Flash Reserved2 Register (FRSV2)
This Flash register is reserved for factory testing.
All bits in the FRSV2 register read 0 and are not writable.
26.3.2.14 Flash Reserved3 Register (FRSV3)
This Flash register is reserved for factory testing.
010 HI Data 0 [15:8]
LO Data 0 [7:0]
011 HI Data 1 [15:8]
LO Data 1 [7:0]
100 HI Data 2 [15:8]
LO Data 2 [7:0]
101 HI Data 3 [15:8]
LO Data 3 [7:0]
Offset Module Base + 0x000C
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 26-18. Flash Reserved1 Register (FRSV1)
Offset Module Base + 0x000D
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 26-19. Flash Reserved2 Register (FRSV2)
Table 26-24. FCCOB - NVM Command Mode (Typical Usage)
CCOBIX[2:0] Byte FCCOB Parameter Fields (NVM Command Mode)
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 939
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FRSV3 register read 0 and are not writable.
26.3.2.15 Flash Reserved4 Register (FRSV4)
This Flash register is reserved for factory testing.
All bits in the FRSV4 register read 0 and are not writable.
26.3.2.16 Flash Option Register (FOPT)
The FOPT register is the Flash option register.
All bits in the FOPT register are readable but are not writable.
During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash
configuration field at global address 0x3_FF0E located in P-Flash memory (see Table 26-4) as indicated
by reset condition F in Figure 26-22. If a double bit fault is detected while reading the P-Flash phrase
containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT register will be set.
Offset Module Base + 0x000E
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 26-20. Flash Reserved3 Register (FRSV3)
Offset Module Base + 0x000F
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 26-21. Flash Reserved4 Register (FRSV4)
Offset Module Base + 0x0010
76543210
R NV[7:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 26-22. Flash Option Register (FOPT)
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
940 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.3.2.17 Flash Reserved5 Register (FRSV5)
This Flash register is reserved for factory testing.
All bits in the FRSV5 register read 0 and are not writable.
26.3.2.18 Flash Reserved6 Register (FRSV6)
This Flash register is reserved for factory testing.
All bits in the FRSV6 register read 0 and are not writable.
26.3.2.19 Flash Reserved7 Register (FRSV7)
This Flash register is reserved for factory testing.
Table 26-25. FOPT Field Descriptions
Field Description
7–0
NV[7:0]
Nonvolatile Bits — The NV[7:0] bits are available as nonvolatile bits. Refer to the device user guide for proper
use of the NV bits.
Offset Module Base + 0x0011
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 26-23. Flash Reserved5 Register (FRSV5)
Offset Module Base + 0x0012
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 26-24. Flash Reserved6 Register (FRSV6)
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 941
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FRSV7 register read 0 and are not writable.
26.4 Functional Description
26.4.1 Modes of Operation
The FTMRG128K1 module provides the modes of operation normal and special . The operating mode is
determined by module-level inputs and affects the FCLKDIV, FCNFG, and DFPROT registers (see
Table 26-27).
26.4.2 IFR Version ID Word
The version ID word is stored in the IFR at address 0x0_40B6. The contents of the word are defined in
Table 26-26.
• VERNUM: Version number. The first version is number 0b_0001 with both 0b_0000 and 0b_1111
meaning ‘none’.
Offset Module Base + 0x0013
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 26-25. Flash Reserved7 Register (FRSV7)
Table 26-26. IFR Version ID Fields
[15:4] [3:0]
Reserved VERNUM
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
942 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.4.3 Internal NVM resource (NVMRES)
IFR is an internal NVM resource readable by CPU , when NVMRES is active. The IFR fields are shown
in Table 26-5.
The NVMRES global address map is shown in Table 26-6.
26.4.4 Flash Command Operations
Flash command operations are used to modify Flash memory contents.
The next sections describe:
• How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from
BUSCLK for Flash program and erase command operations
• The command write sequence used to set Flash command parameters and launch execution
• Valid Flash commands available for execution, according to MCU functional mode and MCU
security state.
26.4.4.1 Writing the FCLKDIV Register
Prior to issuing any Flash program or erase command after a reset, the user is required to write the
FCLKDIV register to divide BUSCLK down to a target FCLK of 1 MHz. Table 26-8 shows recommended
values for the FDIV field based on BUSCLK frequency.
NOTE
Programming or erasing the Flash memory cannot be performed if the bus
clock runs at less than 0.8 MHz. Setting FDIV too high can destroy the Flash
memory due to overstress. Setting FDIV too low can result in incomplete
programming or erasure of the Flash memory cells.
When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the
FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written,
any Flash program or erase command loaded during a command write sequence will not execute and the
ACCERR bit in the FSTAT register will set.
26.4.4.2 Command Write Sequence
The Memory Controller will launch all valid Flash commands entered using a command write sequence.
Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see
Section 26.3.2.7) and the CCIF flag should be tested to determine the status of the current command write
sequence. If CCIF is 0, the previous command write sequence is still active, a new command write
sequence cannot be started, and all writes to the FCCOB register are ignored.
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 943
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.4.4.2.1 Define FCCOB Contents
The FCCOB parameter fields must be loaded with all required parameters for the Flash command being
executed. Access to the FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX
register (see Section 26.3.2.3).
The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears
the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag
will remain clear until the Flash command has completed. Upon completion, the Memory Controller will
return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic
command write sequence is shown in Figure 26-26.
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
944 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 26-26. Generic Flash Command Write Sequence Flowchart
Write to FCCOBIX register
Write: FSTAT register (to launch command)
Clear CCIF 0x80
Clear ACCERR/FPVIOL 0x30
Write: FSTAT register
yes
no
Access Error and
Protection Violation
Read: FSTAT register
START
Check
FCCOB
ACCERR/
FPVIOL
Set?
EXIT
Write: FCLKDIV register
Read: FCLKDIV register
yes
no
FDIV
Correct?
no
Bit Polling for
Command Completion
Check
yes
CCIF Set?
to identify specific command
parameter to load.
Write to FCCOB register
to load required command parameter.
yes
no
More
Parameters?
Availability Check
Results from previous Command
Note: FCLKDIV must be
set after each reset
Read: FSTAT register
no
yes
CCIF
Set?
no
yes
CCIF
Set?
Clock Divider
Value Check Read: FSTAT register
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 945
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.4.4.3 Valid Flash Module Commands
Table 26-27 present the valid Flash commands, as enabled by the combination of the functional MCU
mode (Normal SingleChip NS, Special Singlechip SS) with the MCU security state (Unsecured, Secured).
Special Singlechip mode is selected by input mmc_ss_mode_ts2 asserted. MCU Secured state is selected
by input mmc_secure input asserted.
+
26.4.4.4 P-Flash Commands
Table 26-28 summarizes the valid P-Flash commands along with the effects of the commands on the
P-Flash block and other resources within the Flash module.
Table 26-27. Flash Commands by Mode and Security State
FCMD Command
Unsecured Secured
NS1
1Unsecured Normal Single Chip mode
SS2
2Unsecured Special Single Chip mode.
NS3
3Secured Normal Single Chip mode.
SS4
4Secured Special Single Chip mode.
0x01 Erase Verify All Blocks ∗∗∗∗
0x02 Erase Verify Block ∗∗∗∗
0x03 Erase Verify P-Flash Section ∗∗∗
0x04 Read Once ∗∗∗
0x06 Program P-Flash ∗∗∗
0x07 Program Once ∗∗∗
0x08 Erase All Blocks ∗∗
0x09 Erase Flash Block ∗∗∗
0x0A Erase P-Flash Sector ∗∗∗
0x0B Unsecure Flash ∗∗
0x0C Verify Backdoor Access Key ∗∗
0x0D Set User Margin Level ∗∗∗
0x0E Set Field Margin Level ∗
0x10 Erase Verify EEPROM Section ∗∗∗
0x11 Program EEPROM ∗∗∗
0x12 Erase EEPROM Sector ∗∗∗
Table 26-28. P-Flash Commands
FCMD Command Function on P-Flash Memory
0x01 Erase Verify All
Blocks
Verify that all P-Flash (and EEPROM) blocks are erased.
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
946 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.4.4.5 EEPROM Commands
Table 26-29 summarizes the valid EEPROM commands along with the effects of the commands on the
EEPROM block.
0x02 Erase Verify Block Verify that a P-Flash block is erased.
0x03 Erase Verify
P-Flash Section
Verify that a given number of words starting at the address provided are erased.
0x04 Read Once Read a dedicated 64 byte field in the nonvolatile information register in P-Flash block that
was previously programmed using the Program Once command.
0x06 Program P-Flash Program a phrase in a P-Flash block.
0x07 Program Once Program a dedicated 64 byte field in the nonvolatile information register in P-Flash block
that is allowed to be programmed only once.
0x08 Erase All Blocks
Erase all P-Flash (and EEPROM) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN
bits in the FPROT register and the DPOPEN bit in the DFPROT register are set prior to
launching the command.
0x09 Erase Flash Block
Erase a P-Flash (or EEPROM) block.
An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN
bits in the FPROT register are set prior to launching the command.
0x0A Erase P-Flash
Sector
Erase all bytes in a P-Flash sector.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all P-Flash (and EEPROM)
blocks and verifying that all P-Flash (and EEPROM) blocks are erased.
0x0C Verify Backdoor
Access Key
Supports a method of releasing MCU security by verifying a set of security keys.
0x0D Set User Margin
Level
Specifies a user margin read level for all P-Flash blocks.
0x0E Set Field Margin
Level
Specifies a field margin read level for all P-Flash blocks (special modes only).
Table 26-29. EEPROM Commands
FCMD Command Function on EEPROM Memory
0x01 Erase Verify All
Blocks
Verify that all EEPROM (and P-Flash) blocks are erased.
0x02 Erase Verify Block Verify that the EEPROM block is erased.
Table 26-28. P-Flash Commands
FCMD Command Function on P-Flash Memory
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 947
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.4.5 Allowed Simultaneous P-Flash and EEPROM Operations
Only the operations marked ‘OK’ in Table 26-30 are permitted to be run simultaneously on the Program
Flash and EEPROM blocks. Some operations cannot be executed simultaneously because certain hardware
resources are shared by the two memories. The priority has been placed on permitting Program Flash reads
while program and erase operations execute on the EEPROM, providing read (P-Flash) while write
(EEPROM) functionality.
0x08 Erase All Blocks
Erase all EEPROM (and P-Flash) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN
bits in the FPROT register and the DPOPEN bit in the DFPROT register are set prior to
launching the command.
0x09 Erase Flash Block
Erase a EEPROM (or P-Flash) block.
An erase of the full EEPROM block is only possible when DPOPEN bit in the DFPROT
register is set prior to launching the command.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all EEPROM (and P-Flash)
blocks and verifying that all EEPROM (and P-Flash) blocks are erased.
0x0D Set User Margin
Level
Specifies a user margin read level for the EEPROM block.
0x0E Set Field Margin
Level
Specifies a field margin read level for the EEPROM block (special modes only).
0x10 Erase Verify
EEPROM Section
Verify that a given number of words starting at the address provided are erased.
0x11 Program
EEPROM
Program up to four words in the EEPROM block.
0x12 Erase EEPROM
Sector
Erase all bytes in a sector of the EEPROM block.
Table 26-30. Allowed P-Flash and EEPROM Simultaneous Operations
EEPROM
Program Flash Read Margin
Read1Program Sector
Erase
Mass
Erase2
Read OK OK OK
Margin Read1
1A ‘Margin Read’ is any read after executing the margin setting commands
‘Set User Margin Level’ or ‘Set Field Margin Level’ with anything but the
‘normal’ level specified. See the Note on margin settings in Section 26.4.6.12
and Section 26.4.6.13.
Program
Sector Erase
Mass Erase2
2The ‘Mass Erase’ operations are commands ‘Erase All Blocks’ and ‘Erase
Flash Block’
OK
Table 26-29. EEPROM Commands
FCMD Command Function on EEPROM Memory
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
948 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.4.6 Flash Command Description
This section provides details of all available Flash commands launched by a command write sequence. The
ACCERR bit in the FSTAT register will be set during the command write sequence if any of the following
illegal steps are performed, causing the command not to be processed by the Memory Controller:
• Starting any command write sequence that programs or erases Flash memory before initializing the
FCLKDIV register
• Writing an invalid command as part of the command write sequence
• For additional possible errors, refer to the error handling table provided for each command
If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation
will return invalid data if both flags SFDIF and DFDIF are set. If the SFDIF or DFDIF flags were not
previously set when the invalid read operation occurred, both the SFDIF and DFDIF flags will be set.
If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting
any command write sequence (see Section 26.3.2.7).
CAUTION
A Flash word or phrase must be in the erased state before being
programmed. Cumulative programming of bits within a Flash word or
phrase is not allowed.
26.4.6.1 Erase Verify All Blocks Command
The Erase Verify All Blocks command will verify that all P-Flash and EEPROM blocks have been erased.
Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify
that the entire Flash memory space is erased. The CCIF flag will set after the Erase Verify All Blocks
operation has completed. If all blocks are not erased, it means blank check failed, both MGSTAT bits will
be set.
Table 26-31. Erase Verify All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x01 Not required
Table 26-32. Erase Verify All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the reador if blank check failed .
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 949
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.4.6.2 Erase Verify Block Command
The Erase Verify Block command allows the user to verify that an entire P-Flash or EEPROM block has
been erased. The FCCOB FlashBlockSelectionCode[1:0] bits determine which block must be verified.
Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that
the selected P-Flash or EEPROM block is erased. The CCIF flag will set after the Erase Verify Block
operation has completed.If the block is not erased, it means blank check failed, both MGSTAT bits will be
set.
26.4.6.3 Erase Verify P-Flash Section Command
The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is
erased. The Erase Verify P-Flash Section command defines the starting point of the code to be verified and
the number of phrases.
Table 26-33. Erase Verify Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x02
Flash block
selection code [1:0]. See
Table 26-34
Table 26-34. Flash block selection code description
Selection code[1:0] Flash block to be verified
00 EEPROM
01 Invalid (ACCERR)
10 P-Flash
11 P-Flash
Table 26-35. Erase Verify Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if an invalid FlashBlockSelectionCode[1:0] is supplied
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
950 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will
verify the selected section of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash
Section operation has completed. If the section is not erased, it means blank check failed, both MGSTAT
bits will be set.
26.4.6.4 Read Once Command
The Read Once command provides read access to a reserved 64 byte field (8 phrases) located in the
nonvolatile information register of P-Flash. The Read Once field is programmed using the Program Once
command described in Section 26.4.6.6. The Read Once command must not be executed from the Flash
block containing the Program Once reserved field to avoid code runaway.
Table 26-36. Erase Verify P-Flash Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x03 Global address [17:16] of
a P-Flash block
001 Global address [15:0] of the first phrase to be verified
010 Number of phrases to be verified
Table 26-37. Erase Verify P-Flash Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 26-27)
Set if an invalid global address [17:0] is supplied (see Table 26-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
Set if the requested section crosses a the P-Flash address boundary
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
Table 26-38. Read Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x04 Not Required
001 Read Once phrase index (0x0000 - 0x0007)
010 Read Once word 0 value
011 Read Once word 1 value
100 Read Once word 2 value
101 Read Once word 3 value
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 951
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the
FCCOB indexed register. The CCIF flag will set after the Read Once operation has completed. Valid
phrase index values for the Read Once command range from 0x0000 to 0x0007. During execution of the
Read Once command, any attempt to read addresses within P-Flash block will return invalid data.
8
26.4.6.5 Program P-Flash Command
The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an
embedded algorithm.
CAUTION
A P-Flash phrase must be in the erased state before being programmed.
Cumulative programming of bits within a Flash phrase is not allowed.
Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the
data words to the supplied global address and will then proceed to verify the data words read back as
expected. The CCIF flag will set after the Program P-Flash operation has completed.
Table 26-39. Read Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 26-27)
Set if an invalid phrase index is supplied
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read
MGSTAT0 Set if any non-correctable errors have been encountered during the read
Table 26-40. Program P-Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x06 Global address [17:16] to
identify P-Flash block
001 Global address [15:0] of phrase location to be programmed1
1Global address [2:0] must be 000
010 Word 0 program value
011 Word 1 program value
100 Word 2 program value
101 Word 3 program value
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
952 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.4.6.6 Program Once Command
The Program Once command restricts programming to a reserved 64 byte field (8 phrases) in the
nonvolatile information register located in P-Flash. The Program Once reserved field can be read using the
Read Once command as described in Section 26.4.6.4. The Program Once command must only be issued
once since the nonvolatile information register in P-Flash cannot be erased. The Program Once command
must not be executed from the Flash block containing the Program Once reserved field to avoid code
runaway.
Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the
selected phrase is erased. If erased, then the selected phrase will be programmed and then verified with
read back. The CCIF flag will remain clear, setting only after the Program Once operation has completed.
The reserved nonvolatile information register accessed by the Program Once command cannot be erased
and any attempt to program one of these phrases a second time will not be allowed. Valid phrase index
values for the Program Once command range from 0x0000 to 0x0007. During execution of the Program
Once command, any attempt to read addresses within P-Flash will return invalid data.
Table 26-41. Program P-Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 26-27)
Set if an invalid global address [17:0] is supplied (see Table 26-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the global address [17:0] points to a protected area
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 26-42. Program Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x07 Not Required
001 Program Once phrase index (0x0000 - 0x0007)
010 Program Once word 0 value
011 Program Once word 1 value
100 Program Once word 2 value
101 Program Once word 3 value
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 953
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.4.6.7 Erase All Blocks Command
The Erase All Blocks operation will erase the entire P-Flash and EEPROM memory space.
Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire
Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash
memory space was properly erased, security will be released. During the execution of this command
(CCIF=0) the user must not write to any Flash module register. The CCIF flag will set after the Erase All
Blocks operation has completed.
26.4.6.8 Erase Flash Block Command
The Erase Flash Block operation will erase all addresses in a P-Flash or EEPROM block.
Table 26-43. Program Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 26-27)
Set if an invalid phrase index is supplied
Set if the requested phrase has already been programmed1
1If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will
be allowed to execute again on that same phrase.
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 26-44. Erase All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x08 Not required
Table 26-45. Erase All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 26-27)
FPVIOL Set if any area of the P-Flash or EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
954 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Erase Flash Block command, the Memory Controller will erase the
selected Flash block and verify that it is erased. The CCIF flag will set after the Erase Flash Block
operation has completed.
26.4.6.9 Erase P-Flash Sector Command
The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector.
Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the
selected Flash sector and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash
Sector operation has completed.
Table 26-46. Erase Flash Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x09 Global address [17:16] to
identify Flash block
001 Global address [15:0] in Flash block to be erased
Table 26-47. Erase Flash Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 26-27)
Set if an invalid global address [17:16] is supplied
Set if the supplied P-Flash address is not phrase-aligned or if the EEPROM
address is not word-aligned
FPVIOL Set if an area of the selected Flash block is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 26-48. Erase P-Flash Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0A Global address [17:16] to identify
P-Flash block to be erased
001 Global address [15:0] anywhere within the sector to be erased.
Refer to Section 26.1.2.1 for the P-Flash sector size.
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 955
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.4.6.10 Unsecure Flash Command
The Unsecure Flash command will erase the entire P-Flash and EEPROM memory space and, if the erase
is successful, will release security.
Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire
P-Flash and EEPROM memory space and verify that it is erased. If the Memory Controller verifies that
the entire Flash memory space was properly erased, security will be released. If the erase verify is not
successful, the Unsecure Flash operation sets MGSTAT1 and terminates without changing the security
state. During the execution of this command (CCIF=0) the user must not write to any Flash module
register. The CCIF flag is set after the Unsecure Flash operation has completed.
26.4.6.11 Verify Backdoor Access Key Command
The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the
FSEC register (see Table 26-10). The Verify Backdoor Access Key command releases security if
user-supplied keys match those stored in the Flash security bytes of the Flash configuration field (see
Table 26-49. Erase P-Flash Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 26-27)
Set if an invalid global address [17:16] is supplied (see Table 26-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the selected P-Flash sector is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 26-50. Unsecure Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0B Not required
Table 26-51. Unsecure Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 26-27)
FPVIOL Set if any area of the P-Flash or EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
956 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 26-4). The Verify Backdoor Access Key command must not be executed from the Flash block
containing the backdoor comparison key to avoid code runaway.
Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will
check the FSEC KEYEN bits to verify that this command is enabled. If not enabled, the Memory
Controller sets the ACCERR bit in the FSTAT register and terminates. If the command is enabled, the
Memory Controller compares the key provided in FCCOB to the backdoor comparison key in the Flash
configuration field with Key 0 compared to 0x3_FF00, etc. If the backdoor keys match, security will be
released. If the backdoor keys do not match, security is not released and all future attempts to execute the
Verify Backdoor Access Key command are aborted (set ACCERR) until a reset occurs. The CCIF flag is
set after the Verify Backdoor Access Key operation has completed.
26.4.6.12 Set User Margin Level Command
The Set User Margin Level command causes the Memory Controller to set the margin level for future read
operations of the P-Flash or EEPROM block.
Table 26-52. Verify Backdoor Access Key Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0C Not required
001 Key 0
010 Key 1
011 Key 2
100 Key 3
Table 26-53. Verify Backdoor Access Key Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 100 at command launch
Set if an incorrect backdoor key is supplied
Set if backdoor key access has not been enabled (KEYEN[1:0] != 10, see
Section 26.3.2.2)
Set if the backdoor key has mismatched since the last reset
FPVIOL None
MGSTAT1 None
MGSTAT0 None
Table 26-54. Set User Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0D Flash block selection code [1:0]. See
Table 26-34
001 Margin level setting.
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 957
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the
user margin level for the targeted block and then set the CCIF flag.
NOTE
When the EEPROM block is targeted, the EEPROM user margin levels are
applied only to the EEPROM reads. However, when the P-Flash block is
targeted, the P-Flash user margin levels are applied to both P-Flash and
EEPROM reads. It is not possible to apply user margin levels to the P-Flash
block only.
Valid margin level settings for the Set User Margin Level command are defined in Table 26-55.
NOTE
User margin levels can be used to check that Flash memory contents have
adequate margin for normal level read operations. If unexpected results are
encountered when checking Flash memory contents at user margin levels, a
potential loss of information has been detected.
Table 26-55. Valid Set User Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level1
1Read margin to the erased state
0x0002 User Margin-0 Level2
2Read margin to the programmed state
Table 26-56. Set User Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 26-27)
Set if an invalid FlashBlockSelectionCode[1:0] is supplied (See Table 26-34 )
Set if an invalid margin level setting is supplied
FPVIOL None
MGSTAT1 None
MGSTAT0 None
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
958 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.4.6.13 Set Field Margin Level Command
The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set
the margin level specified for future read operations of the P-Flash or EEPROM block.
Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the
field margin level for the targeted block and then set the CCIF flag.
NOTE
When the EEPROM block is targeted, the EEPROM field margin levels are
applied only to the EEPROM reads. However, when the P-Flash block is
targeted, the P-Flash field margin levels are applied to both P-Flash and
EEPROM reads. It is not possible to apply field margin levels to the P-Flash
block only.
Valid margin level settings for the Set Field Margin Level command are defined in Table 26-58.
Table 26-57. Set Field Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0E Flash block selection code [1:0]. See
Table 26-34
001 Margin level setting.
Table 26-58. Valid Set Field Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level1
1Read margin to the erased state
0x0002 User Margin-0 Level2
2Read margin to the programmed state
0x0003 Field Margin-1 Level1
0x0004 Field Margin-0 Level2
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 959
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
CAUTION
Field margin levels must only be used during verify of the initial factory
programming.
NOTE
Field margin levels can be used to check that Flash memory contents have
adequate margin for data retention at the normal level setting. If unexpected
results are encountered when checking Flash memory contents at field
margin levels, the Flash memory contents should be erased and
reprogrammed.
26.4.6.14 Erase Verify EEPROM Section Command
The Erase Verify EEPROM Section command will verify that a section of code in the EEPROM is erased.
The Erase Verify EEPROM Section command defines the starting point of the data to be verified and the
number of words.
Upon clearing CCIF to launch the Erase Verify EEPROM Section command, the Memory Controller will
verify the selected section of EEPROM memory is erased. The CCIF flag will set after the Erase Verify
EEPROM Section operation has completed. If the section is not erased, it means blank check failed, both
MGSTAT bits will be set.
Table 26-59. Set Field Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 26-27)
Set if an invalid FlashBlockSelectionCode[1:0] is supplied (See Table 26-34 )
Set if an invalid margin level setting is supplied
FPVIOL None
MGSTAT1 None
MGSTAT0 None
Table 26-60. Erase Verify EEPROM Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x10
Global address [17:16] to
identify the EEPROM
block
001 Global address [15:0] of the first word to be verified
010 Number of words to be verified
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
960 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.4.6.15 Program EEPROM Command
The Program EEPROM operation programs one to four previously erased words in the EEPROM block.
The Program EEPROM operation will confirm that the targeted location(s) were successfully programmed
upon completion.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
Upon clearing CCIF to launch the Program EEPROM command, the user-supplied words will be
transferred to the Memory Controller and be programmed if the area is unprotected. The CCOBIX index
value at Program EEPROM command launch determines how many words will be programmed in the
EEPROM block. The CCIF flag is set when the operation has completed.
Table 26-61. Erase Verify EEPROM Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 26-27)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested section breaches the end of the EEPROM block
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
Table 26-62. Program EEPROM Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x11 Global address [17:16] to
identify the EEPROM block
001 Global address [15:0] of word to be programmed
010 Word 0 program value
011 Word 1 program value, if desired
100 Word 2 program value, if desired
101 Word 3 program value, if desired
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 961
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.4.6.16 Erase EEPROM Sector Command
The Erase EEPROM Sector operation will erase all addresses in a sector of the EEPROM block.
Upon clearing CCIF to launch the Erase EEPROM Sector command, the Memory Controller will erase the
selected Flash sector and verify that it is erased. The CCIF flag will set after the Erase EEPROM Sector
operation has completed.
Table 26-63. Program EEPROM Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] < 010 at command launch
Set if CCOBIX[2:0] > 101 at command launch
Set if command not available in current mode (see Table 26-27)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested group of words breaches the end of the EEPROM block
FPVIOL Set if the selected area of the EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 26-64. Erase EEPROM Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x12 Global address [17:16] to identify
EEPROM block
001 Global address [15:0] anywhere within the sector to be erased.
See Section 26.1.2.2 for EEPROM sector size.
Table 26-65. Erase EEPROM Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 26-27)
Set if an invalid global address [17:0] is supplied (see Table 26-3)
Set if a misaligned word address is supplied (global address [0] != 0)
FPVIOL Set if the selected area of the EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
962 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.4.7 Interrupts
The Flash module can generate an interrupt when a Flash command operation has completed or when a
Flash command operation has detected an ECC fault.
NOTE
Vector addresses and their relative interrupt priority are determined at the
MCU level.
26.4.7.1 Description of Flash Interrupt Operation
The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the
Flash command interrupt request. The Flash module uses the DFDIF and SFDIF flags in combination with
the DFDIE and SFDIE interrupt enable bits to generate the Flash error interrupt request. For a detailed
description of the register bits involved, refer to Section 26.3.2.5, “Flash Configuration Register
(FCNFG)”, Section 26.3.2.6, “Flash Error Configuration Register (FERCNFG)”, Section 26.3.2.7, “Flash
Status Register (FSTAT)”, and Section 26.3.2.8, “Flash Error Status Register (FERSTAT)”.
The logic used for generating the Flash module interrupts is shown in Figure 26-27.
Figure 26-27. Flash Module Interrupts Implementation
Table 26-66. Flash Interrupt Sources
Interrupt Source Interrupt Flag Local Enable Global (CCR)
Mask
Flash Command Complete CCIF
(FSTAT register)
CCIE
(FCNFG register)
I Bit
ECC Double Bit Fault on Flash Read DFDIF
(FERSTAT register)
DFDIE
(FERCNFG register)
I Bit
ECC Single Bit Fault on Flash Read SFDIF
(FERSTAT register)
SFDIE
(FERCNFG register)
I Bit
Flash Error Interrupt Request
CCIF
CCIE
DFDIF
DFDIE
SFDIF
SFDIE
Flash Command Interrupt Request
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 963
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
26.4.8 Wait Mode
The Flash module is not affected if the MCU enters wait mode. The Flash module can recover the MCU
from wait via the CCIF interrupt (see Section 26.4.7, “Interrupts”).
26.4.9 Stop Mode
If a Flash command is active (CCIF = 0) when the MCU requests stop mode, the current Flash operation
will be completed before the MCU is allowed to enter stop mode.
26.5 Security
The Flash module provides security information to the MCU. The Flash security state is defined by the
SEC bits of the FSEC register (see Table 26-11). During reset, the Flash module initializes the FSEC
register using data read from the security byte of the Flash configuration field at global address 0x3_FF0F.
The security state out of reset can be permanently changed by programming the security byte assuming
that the MCU is starting from a mode where the necessary P-Flash erase and program commands are
available and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully
programmed, its new value will take affect after the next MCU reset.
The following subsections describe these security-related subjects:
• Unsecuring the MCU using Backdoor Key Access
• Unsecuring the MCU in Special Single Chip Mode using BDM
• Mode and Security Effects on Flash Command Availability
26.5.1 Unsecuring the MCU using Backdoor Key Access
The MCU may be unsecured by using the backdoor key access feature which requires knowledge of the
contents of the backdoor keys (four 16-bit words programmed at addresses 0x3_FF00-0x3_FF07). If the
KEYEN[1:0] bits are in the enabled state (see Section 26.3.2.2), the Verify Backdoor Access Key
command (see Section 26.4.6.11) allows the user to present four prospective keys for comparison to the
keys stored in the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor
Access Key command match the backdoor keys stored in the Flash memory, the SEC bits in the FSEC
register (see Table 26-11) will be changed to unsecure the MCU. Key values of 0x0000 and 0xFFFF are
not permitted as backdoor keys. While the Verify Backdoor Access Key command is active, P-Flash
memory and EEPROM memory will not be available for read access and will return invalid data.
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
964 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an
external stimulus. This external stimulus would typically be through one of the on-chip serial ports.
If the KEYEN[1:0] bits are in the enabled state (see Section 26.3.2.2), the MCU can be unsecured by the
backdoor key access sequence described below:
1. Follow the command sequence for the Verify Backdoor Access Key command as explained in
Section 26.4.6.11
2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the
SEC[1:0] bits in the FSEC register are forced to the unsecure state of 10
The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will
prohibit future use of the Verify Backdoor Access Key command. A reset of the MCU is the only method
to re-enable the Verify Backdoor Access Key command. The security as defined in the Flash security byte
(0x3_FF0F) is not changed by using the Verify Backdoor Access Key command sequence. The backdoor
keys stored in addresses 0x3_FF00-0x3_FF07 are unaffected by the Verify Backdoor Access Key
command sequence. The Verify Backdoor Access Key command sequence has no effect on the program
and erase protections defined in the Flash protection register, FPROT.
After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is
unsecured, the sector containing the Flash security byte can be erased and the Flash security byte can be
reprogrammed to the unsecure state, if desired. In the unsecure state, the user has full control of the
contents of the backdoor keys by programming addresses 0x3_FF00-0x3_FF07 in the Flash configuration
field.
26.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM
A secured MCU can be unsecured in special single chip mode by using the following method to erase the
P-Flash and EEPROM memory:
1. Reset the MCU into special single chip mode
2. Delay while the BDM executes the Erase Verify All Blocks command write sequence to check if
the P-Flash and EEPROM memories are erased
3. Send BDM commands to disable protection in the P-Flash and EEPROM memory
4. Execute the Erase All Blocks command write sequence to erase the P-Flash and EEPROM
memory. Alternatively the Unsecure Flash command can be executed, if so the steps 5 and 6 below
are skeeped.
5. After the CCIF flag sets to indicate that the Erase All Blocks operation has completed, reset the
MCU into special single chip mode
6. Delay while the BDM executes the Erase Verify All Blocks command write sequence to verify that
the P-Flash and EEPROM memory are erased
If the P-Flash and EEPROM memory are verified as erased, the MCU will be unsecured. All BDM
commands will now be enabled and the Flash security byte may be programmed to the unsecure state by
continuing with the following steps:
7. Send BDM commands to execute the Program P-Flash command write sequence to program the
Flash security byte to the unsecured state
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 965
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
8. Reset the MCU
26.5.3 Mode and Security Effects on Flash Command Availability
The availability of Flash module commands depends on the MCU operating mode and security state as
shown in Table 26-27.
26.6 Initialization
On each system reset the flash module executes an initialization sequence which establishes initial values
for the Flash Block Configuration Parameters, the FPROT and DFPROT protection registers, and the
FOPT and FSEC registers. The initialization routine reverts to built-in default values that leave the module
in a fully protected and secured state if errors are encountered during execution of the reset sequence. If a
double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT register will be set.
CCIF is cleared throughout the initialization sequence. The Flash module holds off all CPU access for a
portion of the initialization sequence. Flash reads are allowed once the hold is removed. Completion of the
initialization sequence is marked by setting CCIF high which enables user commands.
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The
state of the word being programmed or the sector/block being erased is not guaranteed.
128 KByte Flash Module (S12FTMRG128K1V1)
MC9S12G Family Reference Manual, Rev.1.06
966 Freescale Semiconductor
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MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 967
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Chapter 27
192 KByte Flash Module (S12FTMRG192K2V1)
27.1 Introduction
The FTMRG192K2 module implements the following:
• 192Kbytes of P-Flash (Program Flash) memory
• 4Kbytes of EEPROM memory
The Flash memory is ideal for single-supply applications allowing for field reprogramming without
requiring external high voltage sources for program or erase operations. The Flash module includes a
memory controller that executes commands to modify Flash memory contents. The user interface to the
memory controller consists of the indexed Flash Common Command Object (FCCOB) register which is
written to with the command, global address, data, and any required command parameters. The memory
controller must complete the execution of a command before the FCCOB register can be written to with a
new command.
CAUTION
A Flash word or phrase must be in the erased state before being
programmed. Cumulative programming of bits within a Flash word or
phrase is not allowed.
Table 27-1. Revision History
Revision
Number
Revision
Date
Sections
Affected Description of Changes
V01.06 23 Jun 2010 27.4.6.2/27-100
1
27.4.6.12/27-10
08
27.4.6.13/27-10
09
Updated description of the commands RD1BLK, MLOADU and MLOADF
V01.07 20 aug 2010 27.4.6.2/27-100
1
27.4.6.12/27-10
08
27.4.6.13/27-10
09
Updated description of the commands RD1BLK, MLOADU and MLOADF
Rev.1.06 31 Jan 2011 27.3.2.9/27-984 Updated description of protection on Section 27.3.2.9
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 968
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The Flash memory may be read as bytes and aligned words. Read access time is one bus cycle for bytes
and aligned words. For misaligned words access, the CPU has to perform twice the byte read access
command. For Flash memory, an erased bit reads 1 and a programmed bit reads 0.
It is possible to read from P-Flash memory while some commands are executing on EEPROM memory. It
is not possible to read from EEPROM memory while a command is executing on P-Flash memory.
Simultaneous P-Flash and EEPROM operations are discussed in Section 27.4.5.
Both P-Flash and EEPROM memories are implemented with Error Correction Codes (ECC) that can
resolve single bit faults and detect double bit faults. For P-Flash memory, the ECC implementation
requires that programming be done on an aligned 8 byte basis (a Flash phrase). Since P-Flash memory is
always read by half-phrase, only one single bit fault in an aligned 4 byte half-phrase containing the byte
or word accessed will be corrected.
27.1.1 Glossary
Command Write Sequence — An MCU instruction sequence to execute built-in algorithms (including
program and erase) on the Flash memory.
EEPROM Memory — The EEPROM memory constitutes the nonvolatile memory store for data.
EEPROM Sector — The EEPROM sector is the smallest portion of the EEPROM memory that can be
erased. The EEPROM sector consists of 4 bytes.
NVM Command Mode — An NVM mode using the CPU to setup the FCCOB register to pass parameters
required for Flash command execution.
Phrase — An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes two
sets of aligned double words with each set including 7 ECC bits for single bit fault correction and double
bit fault detection within each double word.
P-Flash Memory — The P-Flash memory constitutes the main nonvolatile memory store for applications.
P-Flash Sector — The P-Flash sector is the smallest portion of the P-Flash memory that can be erased.
Each P-Flash sector contains 512 bytes.
Program IFR — Nonvolatile information register located in the P-Flash block that contains the Version
ID, and the Program Once field.
27.1.2 Features
27.1.2.1 P-Flash Features
• 192 Kbytes of P-Flash memory divided into 384 sectors of 512 bytes
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
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• Single bit fault correction and double bit fault detection within a 32-bit double word during read
operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and phrase program operation
• Ability to read the P-Flash memory while programming a word in the EEPROM memory
• Flexible protection scheme to prevent accidental program or erase of P-Flash memory
27.1.2.2 EEPROM Features
• 4Kbytes of EEPROM memory composed of one 4 Kbyte Flash block divided into 1024 sectors of
4 bytes
• Single bit fault correction and double bit fault detection within a word during read operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and word program operation
• Protection scheme to prevent accidental program or erase of EEPROM memory
• Ability to program up to four words in a burst sequence
27.1.2.3 Other Flash Module Features
• No external high-voltage power supply required for Flash memory program and erase operations
• Interrupt generation on Flash command completion and Flash error detection
• Security mechanism to prevent unauthorized access to the Flash memory
27.1.3 Block Diagram
The block diagram of the Flash module is shown in Figure 27-1.
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
970 Freescale Semiconductor
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Figure 27-1. FTMRG192K2 Block Diagram
27.2 External Signal Description
The Flash module contains no signals that connect off-chip.
Bus
Clock
Divider
Clock
Command
Interrupt
Request
FCLK
Protection
Security
Registers
Flash
Interface
16bit
internal
bus
sector 0
sector 1
sector 383
48Kx39
P-Flash
Error
Interrupt
Request
CPU
sector 0
sector 1
sector 1023
2Kx22
EEPROM
Memory Controller
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 971
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27.3 Memory Map and Registers
This section describes the memory map and registers for the Flash module. Read data from unimplemented
memory space in the Flash module is undefined. Write access to unimplemented or reserved memory space
in the Flash module will be ignored by the Flash module.
CAUTION
Writing to the Flash registers while a Flash command is executing (that is
indicated when the value of flag CCIF reads as ’0’) is not allowed. If such
action is attempted the write operation will not change the register value.
Writing to the Flash registers is allowed when the Flash is not busy
executing commands (CCIF = 1) and during initialization right after reset,
despite the value of flag CCIF in that case (refer to Section 27.6 for a
complete description of the reset sequence).
.
27.3.1 Module Memory Map
The S12 architecture places the P-Flash memory between global addresses 0x1_0000 and 0x3_FFFF as
shown in Table 27-3 .The P-Flash memory map is shown in Figure 27-2.
Table 27-2. FTMRG Memory Map
Global Address (in Bytes) Size
(Bytes) Description
0x0_0000 - 0x0_03FF 1,024 Register Space
0x0_0400 – 0x0_13FF 4,096 EEPROM Memory
0x0_4000 – 0x0_7FFF 16,284 NVMRES1=1 : NVM Resource area (see Figure 27-3)
1See NVMRES description in Section 27.4.3
0x0_4000 – 0x0_FFFF 49,152 FTMRG reserved area
0x1_0000 – 0x3_FFFF 196,608 P-Flash Memory
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
972 Freescale Semiconductor
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The FPROT register, described in Section 27.3.2.9, can be set to protect regions in the Flash memory from
accidental program or erase. The Flash memory addresses covered by these protectable regions are shown
in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader code
since it covers the vector space. Default protection settings as well as security information that allows the
MCU to restrict access to the Flash module are stored in the Flash configuration field as described in
Table 27-4.
Table 27-3. P-Flash Memory Addressing
Global Address Size
(Bytes) Description
0x1_0000 – 0x3_FFFF 192 K
P-Flash Block
Contains Flash Configuration Field
(see Table 27-4).
Table 27-4. Flash Configuration Field
Global Address Size
(Bytes) Description
0x3_FF00-0x3_FF07 8
Backdoor Comparison Key
Refer to Section 27.4.6.11, “Verify Backdoor Access Key Command,” and
Section 27.5.1, “Unsecuring the MCU using Backdoor Key Access”
0x3_FF08-0x3_FF0B1
10x3FF08-0x3_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in
the 0x3_FF08 - 0x3_FF0B reserved field should be programmed to 0xFF.
4 Reserved
0x3_FF0C11P-Flash Protection byte.
Refer to Section 27.3.2.9, “P-Flash Protection Register (FPROT)”
0x3_FF0D11EEPROM Protection byte.
Refer to Section 27.3.2.10, “EEPROM Protection Register (EEPROT)”
0x3_FF0E11Flash Nonvolatile byte
Refer to Section 27.3.2.16, “Flash Option Register (FOPT)”
0x3_FF0F11Flash Security byte
Refer to Section 27.3.2.2, “Flash Security Register (FSEC)”
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
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Figure 27-2. P-Flash Memory Map
Table 27-5. Program IFR Fields
Global Address Size
(Bytes) Field Description
0x0_4000 – 0x0_4007 8 Reserved
0x0_4008 – 0x0_40B5 174 Reserved
0x0_40B6 – 0x0_40B7 2 Version ID1
Flash Configuration Field
0x3_C000
Flash Protected/Unprotected Lower Region
1, 2, 4, 8 Kbytes
0x3_8000
0x3_9000
0x3_8400
0x3_8800
0x3_A000
P-Flash END = 0x3_FFFF
0x3_F800
0x3_F000
0x3_E000 Flash Protected/Unprotected Higher Region
2, 4, 8, 16 Kbytes
Flash Protected/Unprotected Region
8 Kbytes (up to 29 Kbytes)
16 bytes (0x3_FF00 - 0x3_FF0F)
Flash Protected/Unprotected Region
160 Kbytes
P-Flash START = 0x1_0000
Protection
Protection
Protection
Movable End
Fixed End
Fixed End
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
974 Freescale Semiconductor
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Figure 27-3. Memory Controller Resource Memory Map (NVMRES=1)
0x0_40B8 – 0x0_40BF 8 Reserved
0x0_40C0 – 0x0_40FF 64 Program Once Field
Refer to Section 27.4.6.6, “Program Once Command”
1Used to track firmware patch versions, see Section 27.4.2
Table 27-6. Memory Controller Resource Fields (NVMRES1=1)
1NVMRES - See Section 27.4.3 for NVMRES (NVM Resource) detail.
Global Address Size
(Bytes) Description
0x0_4000 – 0x040FF 256 P-Flash IFR (see Table 27-5)
0x0_4100 – 0x0_41FF 256 Reserved.
0x0_4200 – 0x0_57FF Reserved
0x0_5800 – 0x0_5AFF 768 Reserved
0x0_5B00 – 0x0_5FFF 1,280 Reserved
0x0_6000 – 0x0_67FF 2,048 Reserved
0x0_6800 – 0x0_7FFF 6,144 Reserved
Table 27-5. Program IFR Fields
Global Address Size
(Bytes) Field Description
P-Flash IFR 128 bytes (NVMRES=1)
0x0_4000
Reserved 6144 bytes
Reserved 3328 bytes
0x0_6800
0x0_7FFF
0x0_4100
Reserved 5632 bytes
Reserved 768 bytes
0x0_4200
Reserved 128 bytes
0x0_5800
0x0_5AFF
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
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27.3.2 Register Descriptions
The Flash module contains a set of 20 control and status registers located between Flash module base +
0x0000 and 0x0013.
In the case of the writable registers, the write accesses are forbidden during Fash command execution (for
more detail, see Caution note in Section 27.3).
A summary of the Flash module registers is given in Figure 27-4 with detailed descriptions in the
following subsections.
Address
& Name 76543210
0x0000
FCLKDIV
R FDIVLD FDIVLCK FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0
W
0x0001
FSEC
R KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0
W
0x0002
FCCOBIX
R0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0
W
0x0003
FRSV0
R00000000
W
0x0004
FCNFG
RCCIE 00
IGNSF 00
FDFD FSFD
W
0x0005
FERCNFG
R0 0 0 0 0 0 DFDIE SFDIE
W
0x0006
FSTAT
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT1 MGSTAT0
W
0x0007
FERSTAT
R0 0 0 0 0 0 DFDIF SFDIF
W
0x0008
FPROT
RFPOPEN RNV6 FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0
W
0x0009
EEPROT
RDPOPEN DPS6 DPS5 DPS4 DPS3 DPS2 DPS1 DPS0
W
Figure 27-4. FTMRG192K2 Register Summary
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
976 Freescale Semiconductor
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27.3.2.1 Flash Clock Divider Register (FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
0x000A
FCCOBHI
RCCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8
W
0x000B
FCCOBLO
RCCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0
W
0x000C
FRSV1
R00000000
W
0x000D
FRSV2
R00000000
W
0x000E
FRSV3
R00000000
W
0x000F
FRSV4
R00000000
W
0x0010
FOPT
R NV7 NV6 NV5 NV4 NV3 NV2 NV1 NV0
W
0x0011
FRSV5
R00000000
W
0x0012
FRSV6
R00000000
W
0x0013
FRSV7
R00000000
W
= Unimplemented or Reserved
Address
& Name 76543210
Figure 27-4. FTMRG192K2 Register Summary (continued)
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
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All bits in the FCLKDIV register are readable, bit 7 is not writable, bit 6 is write-once-hi and controls the
writability of the FDIV field in normal mode. In special mode, bits 6-0 are writable any number of times
but bit 7 remains unwritable.
CAUTION
The FCLKDIV register should never be written while a Flash command is
executing (CCIF=0).
Offset Module Base + 0x0000
76543210
R FDIVLD FDIVLCK FDIV[5:0]
W
Reset 00000000
= Unimplemented or Reserved
Figure 27-5. Flash Clock Divider Register (FCLKDIV)
Table 27-7. FCLKDIV Field Descriptions
Field Description
7
FDIVLD
Clock Divider Loaded
0 FCLKDIV register has not been written since the last reset
1 FCLKDIV register has been written since the last reset
6
FDIVLCK
Clock Divider Locked
0 FDIV field is open for writing
1 FDIV value is locked and cannot be changed. Once the lock bit is set high, only reset can clear this bit and
restore writability to the FDIV field in normal mode.
5–0
FDIV[5:0]
Clock Divider Bits — FDIV[5:0] must be set to effectively divide BUSCLK down to 1 MHz to control timed events
during Flash program and erase algorithms. Table 27-8 shows recommended values for FDIV[5:0] based on the
BUSCLK frequency. Please refer to Section 27.4.4, “Flash Command Operations,” for more information.
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
978 Freescale Semiconductor
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27.3.2.2 Flash Security Register (FSEC)
The FSEC register holds all bits associated with the security of the MCU and Flash module.
All bits in the FSEC register are readable but not writable.
During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the
Flash configuration field at global address 0x3_FF0F located in P-Flash memory (see Table 27-4) as
Table 27-8. FDIV values for various BUSCLK Frequencies
BUSCLK Frequency
(MHz) FDIV[5:0]
BUSCLK Frequency
(MHz) FDIV[5:0]
MIN1
1BUSCLK is Greater Than this value.
MAX2
2BUSCLK is Less Than or Equal to this value.
MIN1MAX2
1.0 1.6 0x00 16.6 17.6 0x10
1.6 2.6 0x01 17.6 18.6 0x11
2.6 3.6 0x02 18.6 19.6 0x12
3.6 4.6 0x03 19.6 20.6 0x13
4.6 5.6 0x04 20.6 21.6 0x14
5.6 6.6 0x05 21.6 22.6 0x15
6.6 7.6 0x06 22.6 23.6 0x16
7.6 8.6 0x07 23.6 24.6 0x17
8.6 9.6 0x08 24.6 25.6 0x18
9.6 10.6 0x09
10.6 11.6 0x0A
11.6 12.6 0x0B
12.6 13.6 0x0C
13.6 14.6 0x0D
14.6 15.6 0x0E
15.6 16.6 0x0F
Offset Module Base + 0x0001
76543210
R KEYEN[1:0] RNV[5:2] SEC[1:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 27-6. Flash Security Register (FSEC)
192 KByte Flash Module (S12FTMRG192K2V1)
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indicated by reset condition F in Figure 27-6. If a double bit fault is detected while reading the P-Flash
phrase containing the Flash security byte during the reset sequence, all bits in the FSEC register will be set
to leave the Flash module in a secured state with backdoor key access disabled.
The security function in the Flash module is described in Section 27.5.
27.3.2.3 Flash CCOB Index Register (FCCOBIX)
The FCCOBIX register is used to index the FCCOB register for Flash memory operations.
Table 27-9. FSEC Field Descriptions
Field Description
7–6
KEYEN[1:0]
Backdoor Key Security Enable Bits — The KEYEN[1:0] bits define the enabling of backdoor key access to the
Flash module as shown in Table 27-10.
5–2
RNV[5:2]
Reserved Nonvolatile Bits — The RNV bits should remain in the erased state for future enhancements.
1–0
SEC[1:0]
Flash Security Bits — The SEC[1:0] bits define the security state of the MCU as shown in Table 27-11. If the
Flash module is unsecured using backdoor key access, the SEC bits are forced to 10.
Table 27-10. Flash KEYEN States
KEYEN[1:0] Status of Backdoor Key Access
00 DISABLED
01 DISABLED1
1Preferred KEYEN state to disable backdoor key access.
10 ENABLED
11 DISABLED
Table 27-11. Flash Security States
SEC[1:0] Status of Security
00 SECURED
01 SECURED1
1Preferred SEC state to set MCU to secured state.
10 UNSECURED
11 SECURED
Offset Module Base + 0x0002
76543210
R00000 CCOBIX[2:0]
W
Reset 00000000
= Unimplemented or Reserved
Figure 27-7. FCCOB Index Register (FCCOBIX)
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
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CCOBIX bits are readable and writable while remaining bits read 0 and are not writable.
27.3.2.4 Flash Reserved0 Register (FRSV0)
This Flash register is reserved for factory testing.
All bits in the FRSV0 register read 0 and are not writable.
27.3.2.5 Flash Configuration Register (FCNFG)
The FCNFG register enables the Flash command complete interrupt and forces ECC faults on Flash array
read access from the CPU.
CCIE, IGNSF, FDFD, and FSFD bits are readable and writable while remaining bits read 0 and are not
writable.
Table 27-12. FCCOBIX Field Descriptions
Field Description
2–0
CCOBIX[1:0]
Common Command Register Index— The CCOBIX bits are used to select which word of the FCCOB register
array is being read or written to. See <st-blue>27.3.2.11 Flash Common Command Object Register (FCCOB),”
for more details.
Offset Module Base + 0x000C
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 27-8. Flash Reserved0 Register (FRSV0)
Offset Module Base + 0x0004
76543210
RCCIE 00
IGNSF 00
FDFD FSFD
W
Reset 00000000
= Unimplemented or Reserved
Figure 27-9. Flash Configuration Register (FCNFG)
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 981
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.3.2.6 Flash Error Configuration Register (FERCNFG)
The FERCNFG register enables the Flash error interrupts for the FERSTAT flags.
All assigned bits in the FERCNFG register are readable and writable.
Table 27-13. FCNFG Field Descriptions
Field Description
7
CCIE
Command Complete Interrupt Enable — The CCIE bit controls interrupt generation when a Flash command
has completed.
0 Command complete interrupt disabled
1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see Section 27.3.2.7)
4
IGNSF
Ignore Single Bit Fault — The IGNSF controls single bit fault reporting in the FERSTAT register (see
Section 27.3.2.8).
0 All single bit faults detected during array reads are reported
1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be
generated
1
FDFD
Force Double Bit Fault Detect — The FDFD bit allows the user to simulate a double bit fault during Flash array
read operations and check the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD.
0 Flash array read operations will set the DFDIF flag in the FERSTAT register only if a double bit fault is detected
1 Any Flash array read operation will force the DFDIF flag in the FERSTAT register to be set (see
Section 27.3.2.7) and an interrupt will be generated as long as the DFDIE interrupt enable in the FERCNFG
register is set (see Section 27.3.2.6)
0
FSFD
Force Single Bit Fault Detect —The FSFD bit allows the user to simulate a single bit fault during Flash array
read operations and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD.
0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected
1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see Section 27.3.2.7)
and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set (see
Section 27.3.2.6)
Offset Module Base + 0x0005
76543210
R000000
DFDIE SFDIE
W
Reset 00000000
= Unimplemented or Reserved
Figure 27-10. Flash Error Configuration Register (FERCNFG)
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
982 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.3.2.7 Flash Status Register (FSTAT)
The FSTAT register reports the operational status of the Flash module.
CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable
but not writable, while remaining bits read 0 and are not writable.
Table 27-14. FERCNFG Field Descriptions
Field Description
1
DFDIE
Double Bit Fault Detect Interrupt Enable — The DFDIE bit controls interrupt generation when a double bit fault
is detected during a Flash block read operation.
0 DFDIF interrupt disabled
1 An interrupt will be requested whenever the DFDIF flag is set (see Section 27.3.2.8)
0
SFDIE
Single Bit Fault Detect Interrupt Enable — The SFDIE bit controls interrupt generation when a single bit fault
is detected during a Flash block read operation.
0 SFDIF interrupt disabled whenever the SFDIF flag is set (see Section 27.3.2.8)
1 An interrupt will be requested whenever the SFDIF flag is set (see Section 27.3.2.8)
Offset Module Base + 0x0006
76543210
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT[1:0]
W
Reset 1000000
1
1Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see Section 27.6).
01
= Unimplemented or Reserved
Figure 27-11. Flash Status Register (FSTAT)
Table 27-15. FSTAT Field Descriptions
Field Description
7
CCIF
Command Complete Interrupt Flag — The CCIF flag indicates that a Flash command has completed. The
CCIF flag is cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command
completion or command violation.
0 Flash command in progress
1 Flash command has completed
5
ACCERR
Flash Access Error Flag — The ACCERR bit indicates an illegal access has occurred to the Flash memory
caused by either a violation of the command write sequence (see Section 27.4.4.2) or issuing an illegal Flash
command. While ACCERR is set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is
cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR bit has no effect on ACCERR.
0 No access error detected
1 Access error detected
4
FPVIOL
Flash Protection Violation Flag —The FPVIOL bit indicates an attempt was made to program or erase an
address in a protected area of P-Flash or EEPROM memory during a command write sequence. The FPVIOL
bit is cleared by writing a 1 to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL
is set, it is not possible to launch a command or start a command write sequence.
0 No protection violation detected
1 Protection violation detected
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 983
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.3.2.8 Flash Error Status Register (FERSTAT)
The FERSTAT register reflects the error status of internal Flash operations.
All flags in the FERSTAT register are readable and only writable to clear the flag.
3
MGBUSY
Memory Controller Busy Flag — The MGBUSY flag reflects the active state of the Memory Controller.
0 Memory Controller is idle
1 Memory Controller is busy executing a Flash command (CCIF = 0)
2
RSVD
Reserved Bit — This bit is reserved and always reads 0.
1–0
MGSTAT[1:0]
Memory Controller Command Completion Status Flag — One or more MGSTAT flag bits are set if an error
is detected during execution of a Flash command or during the Flash reset sequence. See Section 27.4.6,
“Flash Command Description,” and Section 27.6, “Initialization” for details.
Offset Module Base + 0x0007
76543210
R000000
DFDIF SFDIF
W
Reset 00000000
= Unimplemented or Reserved
Figure 27-12. Flash Error Status Register (FERSTAT)
Table 27-16. FERSTAT Field Descriptions
Field Description
1
DFDIF
Double Bit Fault Detect Interrupt Flag — The setting of the DFDIF flag indicates that a double bit fault was
detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation
returning invalid data was attempted on a Flash block that was under a Flash command operation.1The DFDIF
flag is cleared by writing a 1 to DFDIF. Writing a 0 to DFDIF has no effect on DFDIF.2
0 No double bit fault detected
1 Double bit fault detected or a Flash array read operation returning invalid data was attempted while command
running
1 The single bit fault and double bit fault flags are mutually exclusive for parity errors (an ECC fault occurrence can be either
single fault or double fault but never both). A simultaneous access collision (Flash array read operation returning invalid data
attempted while command running) is indicated when both SFDIF and DFDIF flags are high.
2There is a one cycle delay in storing the ECC DFDIF and SFDIF fault flags in this register. At least one NOP is required after
a flash memory read before checking FERSTAT for the occurrence of ECC errors.
0
SFDIF
Single Bit Fault Detect Interrupt Flag — With the IGNSF bit in the FCNFG register clear, the SFDIF flag
indicates that a single bit fault was detected in the stored parity and data bits during a Flash array read operation
or that a Flash array read operation returning invalid data was attempted on a Flash block that was under a Flash
command operation.1 The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on
SFDIF.
0 No single bit fault detected
1 Single bit fault detected and corrected or a Flash array read operation returning invalid data was attempted
while command running
Table 27-15. FSTAT Field Descriptions (continued)
Field Description
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
984 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.3.2.9 P-Flash Protection Register (FPROT)
The FPROT register defines which P-Flash sectors are protected against program and erase operations.
The (unreserved) bits of the FPROT register are writable with the restriction that the size of the protected
region can only be increased (see Section 27.3.2.9.1, “P-Flash Protection Restrictions,” and Table 27-21).
During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte
in the Flash configuration field at global address 0x3_FF0C located in P-Flash memory (see Table 27-4)
as indicated by reset condition ‘F’ in Figure 27-13. To change the P-Flash protection that will be loaded
during the reset sequence, the upper sector of the P-Flash memory must be unprotected, then the P-Flash
protection byte must be reprogrammed. If a double bit fault is detected while reading the P-Flash phrase
containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and
remaining bits in the FPROT register will be set to leave the P-Flash memory fully protected.
Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error
and the FPVIOL bit will be set in the FSTAT register. The block erase of a P-Flash block is not possible if
any of the P-Flash sectors contained in the same P-Flash block are protected.
Offset Module Base + 0x0008
76543210
RFPOPEN RNV6 FPHDIS FPHS[1:0] FPLDIS FPLS[1:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 27-13. Flash Protection Register (FPROT)
Table 27-17. FPROT Field Descriptions
Field Description
7
FPOPEN
Flash Protection Operation Enable — The FPOPEN bit determines the protection function for program or
erase operations as shown in Table 27-18 for the P-Flash block.
0 When FPOPEN is clear, the FPHDIS and FPLDIS bits define unprotected address ranges as specified by the
corresponding FPHS and FPLS bits
1 When FPOPEN is set, the FPHDIS and FPLDIS bits enable protection for the address range specified by the
corresponding FPHS and FPLS bits
6
RNV[6]
Reserved Nonvolatile Bit — The RNV bit should remain in the erased state for future enhancements.
5
FPHDIS
Flash Protection Higher Address Range Disable — The FPHDIS bit determines whether there is a
protected/unprotected area in a specific region of the P-Flash memory ending with global address 0x3_FFFF.
0 Protection/Unprotection enabled
1 Protection/Unprotection disabled
4–3
FPHS[1:0]
Flash Protection Higher Address Size — The FPHS bits determine the size of the protected/unprotected area
in P-Flash memory as shown inTable 27-19. The FPHS bits can only be written to while the FPHDIS bit is set.
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 985
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All possible P-Flash protection scenarios are shown in Figure 27-14 . Although the protection scheme is
loaded from the Flash memory at global address 0x3_FF0C during the reset sequence, it can be changed
by the user. The P-Flash protection scheme can be used by applications requiring reprogramming in single
chip mode while providing as much protection as possible if reprogramming is not required.
2
FPLDIS
Flash Protection Lower Address Range Disable — The FPLDIS bit determines whether there is a
protected/unprotected area in a specific region of the P-Flash memory beginning with global address 0x3_8000.
0 Protection/Unprotection enabled
1 Protection/Unprotection disabled
1–0
FPLS[1:0]
Flash Protection Lower Address Size — The FPLS bits determine the size of the protected/unprotected area
in P-Flash memory as shown in Table 27-20. The FPLS bits can only be written to while the FPLDIS bit is set.
Table 27-18. P-Flash Protection Function
FPOPEN FPHDIS FPLDIS Function1
1For range sizes, refer to Table 27-19 and Table 27-20.
1 1 1 No P-Flash Protection
1 1 0 Protected Low Range
1 0 1 Protected High Range
1 0 0 Protected High and Low Ranges
0 1 1 Full P-Flash Memory Protected
0 1 0 Unprotected Low Range
0 0 1 Unprotected High Range
0 0 0 Unprotected High and Low Ranges
Table 27-19. P-Flash Protection Higher Address Range
FPHS[1:0] Global Address Range Protected Size
00 0x3_F800–0x3_FFFF 2 Kbytes
01 0x3_F000–0x3_FFFF 4 Kbytes
10 0x3_E000–0x3_FFFF 8 Kbytes
11 0x3_C000–0x3_FFFF 16 Kbytes
Table 27-20. P-Flash Protection Lower Address Range
FPLS[1:0] Global Address Range Protected Size
00 0x3_8000–0x3_83FF 1 Kbyte
01 0x3_8000–0x3_87FF 2 Kbytes
10 0x3_8000–0x3_8FFF 4 Kbytes
11 0x3_8000–0x3_9FFF 8 Kbytes
Table 27-17. FPROT Field Descriptions (continued)
Field Description
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
986 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 27-14. P-Flash Protection Scenarios
7654
FPHS[1:0] FPLS[1:0]
3210
FPHS[1:0] FPLS[1:0]
FPHDIS = 1
FPLDIS = 1
FPHDIS = 1
FPLDIS = 0
FPHDIS = 0
FPLDIS = 1
FPHDIS = 0
FPLDIS = 0
Scenario
Scenario
Unprotected region Protected region with size
Protected region Protected region with size
defined by FPLS
defined by FPHSnot defined by FPLS, FPHS
0x3_8000
0x3_FFFF
0x3_8000
0x3_FFFF
FLASH START
FLASH START
FPOPEN = 1FPOPEN = 0
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 987
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.3.2.9.1 P-Flash Protection Restrictions
The general guideline is that P-Flash protection can only be added and not removed. Table 27-21 specifies
all valid transitions between P-Flash protection scenarios. Any attempt to write an invalid scenario to the
FPROT register will be ignored. The contents of the FPROT register reflect the active protection scenario.
See the FPHS and FPLS bit descriptions for additional restrictions.
27.3.2.10 EEPROM Protection Register (EEPROT)
The EEPROT register defines which EEPROM sectors are protected against program and erase operations.
The (unreserved) bits of the EEPROT register are writable with the restriction that protection can be added
but not removed. Writes must increase the DPS value and the DPOPEN bit can only be written from 1
(protection disabled) to 0 (protection enabled). If the DPOPEN bit is set, the state of the DPS bits is
irrelevant.
During the reset sequence, fields DPOPEN and DPS of the EEPROT register are loaded with the contents
of the EEPROM protection byte in the Flash configuration field at global address 0x3_FF0D located in
Table 27-21. P-Flash Protection Scenario Transitions
From
Protection
Scenario
To Protection Scenario1
1Allowed transitions marked with X, see Figure 27-14 for a definition of the scenarios.
01234567
0XXXX
1XX
2XX
3X
4XX
5XXXX
6XXXX
7XXXXXXXX
Offset Module Base + 0x0009
76543210
RDPOPEN DPS[6:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
Figure 27-15. EEPROM Protection Register (EEPROT)
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
988 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
P-Flash memory (see Table 27-4) as indicated by reset condition F in Table 27-23. To change the
EEPROM protection that will be loaded during the reset sequence, the P-Flash sector containing the
EEPROM protection byte must be unprotected, then the EEPROM protection byte must be programmed.
If a double bit fault is detected while reading the P-Flash phrase containing the EEPROM protection byte
during the reset sequence, the DPOPEN bit will be cleared and DPS bits will be set to leave the EEPROM
memory fully protected.
Trying to alter data in any protected area in the EEPROM memory will result in a protection violation error
and the FPVIOL bit will be set in the FSTAT register. Block erase of the EEPROM memory is not possible
if any of the EEPROM sectors are protected.
Table 27-22. EEPROT Field Descriptions
Field Description
7
DPOPEN
EEPROM Protection Control
0 Enables EEPROM memory protection from program and erase with protected address range defined by DPS
bits
1 Disables EEPROM memory protection from program and erase
6–0
DPS[6:0]
EEPROM Protection Size — The DPS[6:0] bits determine the size of the protected area in the EEPROM
memory, this size increase in step of 32 bytes, as shown in Table 27-23 .
Table 27-23. EEPROM Protection Address Range
DPS[6:0] Global Address Range Protected Size
0000000 0x0_0400 – 0x0_041F 32 bytes
0000001 0x0_0400 – 0x0_043F 64 bytes
0000010 0x0_0400 – 0x0_045F 96 bytes
0000011 0x0_0400 – 0x0_047F 128 bytes
0000100 0x0_0400 – 0x0_049F 160 bytes
0000101 0x0_0400 – 0x0_04BF 192 bytes
The Protection Size goes on enlarging in step of 32 bytes, for each DPS value
increasing of one.
.
.
.
1111111 0x0_0400 – 0x0_13FF 4,096 bytes
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 989
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.3.2.11 Flash Common Command Object Register (FCCOB)
The FCCOB is an array of six words addressed via the CCOBIX index found in the FCCOBIX register.
Byte wide reads and writes are allowed to the FCCOB register.
27.3.2.11.1 FCCOB - NVM Command Mode
NVM command mode uses the indexed FCCOB register to provide a command code and its relevant
parameters to the Memory Controller. The user first sets up all required FCCOB fields and then initiates
the command’s execution by writing a 1 to the CCIF bit in the FSTAT register (a 1 written by the user clears
the CCIF command completion flag to 0). When the user clears the CCIF bit in the FSTAT register all
FCCOB parameter fields are locked and cannot be changed by the user until the command completes (as
evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the
FCCOB register array.
The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 27-24. The
return values are available for reading after the CCIF flag in the FSTAT register has been returned to 1 by
the Memory Controller. Writes to the unimplemented parameter fields (CCOBIX = 110 and CCOBIX =
111) are ignored with reads from these fields returning 0x0000.
Table 27-24 shows the generic Flash command format. The high byte of the first word in the CCOB array
contains the command code, followed by the parameters for this specific Flash command. For details on
the FCCOB settings required by each command, see the Flash command descriptions in Section 27.4.6.
Offset Module Base + 0x000A
76543210
RCCOB[15:8]
W
Reset 00000000
Figure 27-16. Flash Common Command Object High Register (FCCOBHI)
Offset Module Base + 0x000B
76543210
RCCOB[7:0]
W
Reset 00000000
Figure 27-17. Flash Common Command Object Low Register (FCCOBLO)
Table 27-24. FCCOB - NVM Command Mode (Typical Usage)
CCOBIX[2:0] Byte FCCOB Parameter Fields (NVM Command Mode)
000 HI FCMD[7:0] defining Flash command
LO 6’h0, Global address [17:16]
001 HI Global address [15:8]
LO Global address [7:0]
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
990 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.3.2.12 Flash Reserved1 Register (FRSV1)
This Flash register is reserved for factory testing.
All bits in the FRSV1 register read 0 and are not writable.
27.3.2.13 Flash Reserved2 Register (FRSV2)
This Flash register is reserved for factory testing.
All bits in the FRSV2 register read 0 and are not writable.
27.3.2.14 Flash Reserved3 Register (FRSV3)
This Flash register is reserved for factory testing.
010 HI Data 0 [15:8]
LO Data 0 [7:0]
011 HI Data 1 [15:8]
LO Data 1 [7:0]
100 HI Data 2 [15:8]
LO Data 2 [7:0]
101 HI Data 3 [15:8]
LO Data 3 [7:0]
Offset Module Base + 0x000C
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 27-18. Flash Reserved1 Register (FRSV1)
Offset Module Base + 0x000D
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 27-19. Flash Reserved2 Register (FRSV2)
Table 27-24. FCCOB - NVM Command Mode (Typical Usage)
CCOBIX[2:0] Byte FCCOB Parameter Fields (NVM Command Mode)
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 991
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FRSV3 register read 0 and are not writable.
27.3.2.15 Flash Reserved4 Register (FRSV4)
This Flash register is reserved for factory testing.
All bits in the FRSV4 register read 0 and are not writable.
27.3.2.16 Flash Option Register (FOPT)
The FOPT register is the Flash option register.
All bits in the FOPT register are readable but are not writable.
During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash
configuration field at global address 0x3_FF0E located in P-Flash memory (see Table 27-4) as indicated
by reset condition F in Figure 27-22. If a double bit fault is detected while reading the P-Flash phrase
containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT register will be set.
Offset Module Base + 0x000E
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 27-20. Flash Reserved3 Register (FRSV3)
Offset Module Base + 0x000F
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 27-21. Flash Reserved4 Register (FRSV4)
Offset Module Base + 0x0010
76543210
R NV[7:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 27-22. Flash Option Register (FOPT)
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
992 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.3.2.17 Flash Reserved5 Register (FRSV5)
This Flash register is reserved for factory testing.
All bits in the FRSV5 register read 0 and are not writable.
27.3.2.18 Flash Reserved6 Register (FRSV6)
This Flash register is reserved for factory testing.
All bits in the FRSV6 register read 0 and are not writable.
27.3.2.19 Flash Reserved7 Register (FRSV7)
This Flash register is reserved for factory testing.
Table 27-25. FOPT Field Descriptions
Field Description
7–0
NV[7:0]
Nonvolatile Bits — The NV[7:0] bits are available as nonvolatile bits. Refer to the device user guide for proper
use of the NV bits.
Offset Module Base + 0x0011
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 27-23. Flash Reserved5 Register (FRSV5)
Offset Module Base + 0x0012
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 27-24. Flash Reserved6 Register (FRSV6)
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 993
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FRSV7 register read 0 and are not writable.
27.4 Functional Description
27.4.1 Modes of Operation
The FTMRG192K2 module provides the modes of operation normal and special . The operating mode is
determined by module-level inputs and affects the FCLKDIV, FCNFG, and EEPROT registers (see
Table 27-27).
27.4.2 IFR Version ID Word
The version ID word is stored in the IFR at address 0x0_40B6. The contents of the word are defined in
Table 27-26.
• VERNUM: Version number. The first version is number 0b_0001 with both 0b_0000 and 0b_1111
meaning ‘none’.
Offset Module Base + 0x0013
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 27-25. Flash Reserved7 Register (FRSV7)
Table 27-26. IFR Version ID Fields
[15:4] [3:0]
Reserved VERNUM
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
994 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.4.3 Internal NVM resource (NVMRES)
IFR is an internal NVM resource readable by CPU , when NVMRES is active. The IFR fields are shown
in Table 27-5.
The NVMRES global address map is shown in Table 27-6.
27.4.4 Flash Command Operations
Flash command operations are used to modify Flash memory contents.
The next sections describe:
• How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from
BUSCLK for Flash program and erase command operations
• The command write sequence used to set Flash command parameters and launch execution
• Valid Flash commands available for execution, according to MCU functional mode and MCU
security state.
27.4.4.1 Writing the FCLKDIV Register
Prior to issuing any Flash program or erase command after a reset, the user is required to write the
FCLKDIV register to divide BUSCLK down to a target FCLK of 1 MHz. Table 27-8 shows recommended
values for the FDIV field based on BUSCLK frequency.
NOTE
Programming or erasing the Flash memory cannot be performed if the bus
clock runs at less than 0.8 MHz. Setting FDIV too high can destroy the Flash
memory due to overstress. Setting FDIV too low can result in incomplete
programming or erasure of the Flash memory cells.
When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the
FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written,
any Flash program or erase command loaded during a command write sequence will not execute and the
ACCERR bit in the FSTAT register will set.
27.4.4.2 Command Write Sequence
The Memory Controller will launch all valid Flash commands entered using a command write sequence.
Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see
Section 27.3.2.7) and the CCIF flag should be tested to determine the status of the current command write
sequence. If CCIF is 0, the previous command write sequence is still active, a new command write
sequence cannot be started, and all writes to the FCCOB register are ignored.
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 995
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.4.4.2.1 Define FCCOB Contents
The FCCOB parameter fields must be loaded with all required parameters for the Flash command being
executed. Access to the FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX
register (see Section 27.3.2.3).
The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears
the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag
will remain clear until the Flash command has completed. Upon completion, the Memory Controller will
return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic
command write sequence is shown in Figure 27-26.
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
996 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 27-26. Generic Flash Command Write Sequence Flowchart
Write to FCCOBIX register
Write: FSTAT register (to launch command)
Clear CCIF 0x80
Clear ACCERR/FPVIOL 0x30
Write: FSTAT register
yes
no
Access Error and
Protection Violation
Read: FSTAT register
START
Check
FCCOB
ACCERR/
FPVIOL
Set?
EXIT
Write: FCLKDIV register
Read: FCLKDIV register
yes
no
FDIV
Correct?
no
Bit Polling for
Command Completion
Check
yes
CCIF Set?
to identify specific command
parameter to load.
Write to FCCOB register
to load required command parameter.
yes
no
More
Parameters?
Availability Check
Results from previous Command
Note: FCLKDIV must be
set after each reset
Read: FSTAT register
no
yes
CCIF
Set?
no
yes
CCIF
Set?
Clock Divider
Value Check Read: FSTAT register
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 997
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.4.4.3 Valid Flash Module Commands
Table 27-27 present the valid Flash commands, as enabled by the combination of the functional MCU
mode (Normal SingleChip NS, Special Singlechip SS) with the MCU security state (Unsecured, Secured).
Special Singlechip mode is selected by input mmc_ss_mode_ts2 asserted. MCU Secured state is selected
by input mmc_secure input asserted.
+
27.4.4.4 P-Flash Commands
Table 27-28 summarizes the valid P-Flash commands along with the effects of the commands on the
P-Flash block and other resources within the Flash module.
Table 27-27. Flash Commands by Mode and Security State
FCMD Command
Unsecured Secured
NS1
1Unsecured Normal Single Chip mode
SS2
2Unsecured Special Single Chip mode.
NS3
3Secured Normal Single Chip mode.
SS4
4Secured Special Single Chip mode.
0x01 Erase Verify All Blocks ∗∗∗∗
0x02 Erase Verify Block ∗∗∗∗
0x03 Erase Verify P-Flash Section ∗∗∗
0x04 Read Once ∗∗∗
0x06 Program P-Flash ∗∗∗
0x07 Program Once ∗∗∗
0x08 Erase All Blocks ∗∗
0x09 Erase Flash Block ∗∗∗
0x0A Erase P-Flash Sector ∗∗∗
0x0B Unsecure Flash ∗∗
0x0C Verify Backdoor Access Key ∗∗
0x0D Set User Margin Level ∗∗∗
0x0E Set Field Margin Level ∗
0x10 Erase Verify EEPROM Section ∗∗∗
0x11 Program EEPROM ∗∗∗
0x12 Erase EEPROM Sector ∗∗∗
Table 27-28. P-Flash Commands
FCMD Command Function on P-Flash Memory
0x01 Erase Verify All
Blocks
Verify that all P-Flash (and EEPROM) blocks are erased.
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
998 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.4.4.5 EEPROM Commands
Table 27-29 summarizes the valid EEPROM commands along with the effects of the commands on the
EEPROM block.
0x02 Erase Verify Block Verify that a P-Flash block is erased.
0x03 Erase Verify
P-Flash Section
Verify that a given number of words starting at the address provided are erased.
0x04 Read Once Read a dedicated 64 byte field in the nonvolatile information register in P-Flash block that
was previously programmed using the Program Once command.
0x06 Program P-Flash Program a phrase in a P-Flash block.
0x07 Program Once Program a dedicated 64 byte field in the nonvolatile information register in P-Flash block
that is allowed to be programmed only once.
0x08 Erase All Blocks
Erase all P-Flash (and EEPROM) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN
bits in the FPROT register and the DPOPEN bit in the EEPROT register are set prior to
launching the command.
0x09 Erase Flash Block
Erase a P-Flash (or EEPROM) block.
An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN
bits in the FPROT register are set prior to launching the command.
0x0A Erase P-Flash
Sector
Erase all bytes in a P-Flash sector.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all P-Flash (and EEPROM)
blocks and verifying that all P-Flash (and EEPROM) blocks are erased.
0x0C Verify Backdoor
Access Key
Supports a method of releasing MCU security by verifying a set of security keys.
0x0D Set User Margin
Level
Specifies a user margin read level for all P-Flash blocks.
0x0E Set Field Margin
Level
Specifies a field margin read level for all P-Flash blocks (special modes only).
Table 27-29. EEPROM Commands
FCMD Command Function on EEPROM Memory
0x01 Erase Verify All
Blocks
Verify that all EEPROM (and P-Flash) blocks are erased.
0x02 Erase Verify Block Verify that the EEPROM block is erased.
Table 27-28. P-Flash Commands
FCMD Command Function on P-Flash Memory
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 999
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.4.5 Allowed Simultaneous P-Flash and EEPROM Operations
Only the operations marked ‘OK’ in Table 27-30 are permitted to be run simultaneously on the Program
Flash and EEPROM blocks. Some operations cannot be executed simultaneously because certain hardware
resources are shared by the two memories. The priority has been placed on permitting Program Flash reads
while program and erase operations execute on the EEPROM, providing read (P-Flash) while write
(EEPROM) functionality.
0x08 Erase All Blocks
Erase all EEPROM (and P-Flash) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN
bits in the FPROT register and the DPOPEN bit in the EEPROT register are set prior to
launching the command.
0x09 Erase Flash Block
Erase a EEPROM (or P-Flash) block.
An erase of the full EEPROM block is only possible when DPOPEN bit in the EEPROT
register is set prior to launching the command.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all EEPROM (and P-Flash)
blocks and verifying that all EEPROM (and P-Flash) blocks are erased.
0x0D Set User Margin
Level
Specifies a user margin read level for the EEPROM block.
0x0E Set Field Margin
Level
Specifies a field margin read level for the EEPROM block (special modes only).
0x10 Erase Verify
EEPROM Section
Verify that a given number of words starting at the address provided are erased.
0x11 Program
EEPROM
Program up to four words in the EEPROM block.
0x12 Erase EEPROM
Sector
Erase all bytes in a sector of the EEPROM block.
Table 27-30. Allowed P-Flash and EEPROM Simultaneous Operations
EEPROM
Program Flash Read Margin
Read1Program Sector
Erase
Mass
Erase2
Read OK OK OK
Margin Read1
1A ‘Margin Read’ is any read after executing the margin setting commands
‘Set User Margin Level’ or ‘Set Field Margin Level’ with anything but the
‘normal’ level specified. See the Note on margin settings in Section 27.4.6.12
and Section 27.4.6.13.
Program
Sector Erase
Mass Erase2
2The ‘Mass Erase’ operations are commands ‘Erase All Blocks’ and ‘Erase
Flash Block’
OK
Table 27-29. EEPROM Commands
FCMD Command Function on EEPROM Memory
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1000 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.4.6 Flash Command Description
This section provides details of all available Flash commands launched by a command write sequence. The
ACCERR bit in the FSTAT register will be set during the command write sequence if any of the following
illegal steps are performed, causing the command not to be processed by the Memory Controller:
• Starting any command write sequence that programs or erases Flash memory before initializing the
FCLKDIV register
• Writing an invalid command as part of the command write sequence
• For additional possible errors, refer to the error handling table provided for each command
If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation
will return invalid data if both flags SFDIF and DFDIF are set. If the SFDIF or DFDIF flags were not
previously set when the invalid read operation occurred, both the SFDIF and DFDIF flags will be set.
If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting
any command write sequence (see Section 27.3.2.7).
CAUTION
A Flash word or phrase must be in the erased state before being
programmed. Cumulative programming of bits within a Flash word or
phrase is not allowed.
27.4.6.1 Erase Verify All Blocks Command
The Erase Verify All Blocks command will verify that all P-Flash and EEPROM blocks have been erased.
Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify
that the entire Flash memory space is erased. The CCIF flag will set after the Erase Verify All Blocks
operation has completed. If all blocks are not erased, it means blank check failed, both MGSTAT bits will
be set.
Table 27-31. Erase Verify All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x01 Not required
Table 27-32. Erase Verify All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the reador if blank check failed .
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1001
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.4.6.2 Erase Verify Block Command
The Erase Verify Block command allows the user to verify that an entire P-Flash or EEPROM block has
been erased. The FCCOB FlashBlockSelectionCode[1:0]bits determine which block must be verified.
Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that
the selected P-Flash or EEPROM block is erased. The CCIF flag will set after the Erase Verify Block
operation has completed.If the block is not erased, it means blank check failed, both MGSTAT bits will be
set.
27.4.6.3 Erase Verify P-Flash Section Command
The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is
erased. The Erase Verify P-Flash Section command defines the starting point of the code to be verified and
the number of phrases.
Table 27-33. Erase Verify Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x02
Flash block
selection code [1:0]. See
Table 27-34
Table 27-34. Flash block selection code description
Selection code[1:0] Flash block to be verified
00 EEPROM
01 P-Flash
10 P-Flash
11 P-Flash
Table 27-35. Erase Verify Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch.
FPVIOL None.
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read1 or if
blank check failed.
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1002 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will
verify the selected section of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash
Section operation has completed. If the section is not erased, it means blank check failed, both MGSTAT
bits will be set.
27.4.6.4 Read Once Command
The Read Once command provides read access to a reserved 64 byte field (8 phrases) located in the
nonvolatile information register of P-Flash. The Read Once field is programmed using the Program Once
command described in Section 27.4.6.6. The Read Once command must not be executed from the Flash
block containing the Program Once reserved field to avoid code runaway.
Table 27-36. Erase Verify P-Flash Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x03 Global address [17:16] of
a P-Flash block
001 Global address [15:0] of the first phrase to be verified
010 Number of phrases to be verified
Table 27-37. Erase Verify P-Flash Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 27-27)
Set if an invalid global address [17:0] is supplied see Table 27-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
Set if the requested section crosses a the P-Flash address boundary
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
Table 27-38. Read Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x04 Not Required
001 Read Once phrase index (0x0000 - 0x0007)
010 Read Once word 0 value
011 Read Once word 1 value
100 Read Once word 2 value
101 Read Once word 3 value
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1003
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the
FCCOB indexed register. The CCIF flag will set after the Read Once operation has completed. Valid
phrase index values for the Read Once command range from 0x0000 to 0x0007. During execution of the
Read Once command, any attempt to read addresses within P-Flash block will return invalid data.
8
27.4.6.5 Program P-Flash Command
The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an
embedded algorithm.
CAUTION
A P-Flash phrase must be in the erased state before being programmed.
Cumulative programming of bits within a Flash phrase is not allowed.
Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the
data words to the supplied global address and will then proceed to verify the data words read back as
expected. The CCIF flag will set after the Program P-Flash operation has completed.
Table 27-39. Read Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 27-27)
Set if an invalid phrase index is supplied
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read
MGSTAT0 Set if any non-correctable errors have been encountered during the read
Table 27-40. Program P-Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x06 Global address [17:16] to
identify P-Flash block
001 Global address [15:0] of phrase location to be programmed1
1Global address [2:0] must be 000
010 Word 0 program value
011 Word 1 program value
100 Word 2 program value
101 Word 3 program value
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1004 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.4.6.6 Program Once Command
The Program Once command restricts programming to a reserved 64 byte field (8 phrases) in the
nonvolatile information register located in P-Flash. The Program Once reserved field can be read using the
Read Once command as described in Section 27.4.6.4. The Program Once command must only be issued
once since the nonvolatile information register in P-Flash cannot be erased. The Program Once command
must not be executed from the Flash block containing the Program Once reserved field to avoid code
runaway.
Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the
selected phrase is erased. If erased, then the selected phrase will be programmed and then verified with
read back. The CCIF flag will remain clear, setting only after the Program Once operation has completed.
The reserved nonvolatile information register accessed by the Program Once command cannot be erased
and any attempt to program one of these phrases a second time will not be allowed. Valid phrase index
values for the Program Once command range from 0x0000 to 0x0007. During execution of the Program
Once command, any attempt to read addresses within P-Flash will return invalid data.
Table 27-41. Program P-Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 27-27)
Set if an invalid global address [17:0] is supplied see Table 27-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the global address [17:0] points to a protected area
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 27-42. Program Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x07 Not Required
001 Program Once phrase index (0x0000 - 0x0007)
010 Program Once word 0 value
011 Program Once word 1 value
100 Program Once word 2 value
101 Program Once word 3 value
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1005
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.4.6.7 Erase All Blocks Command
The Erase All Blocks operation will erase the entire P-Flash and EEPROM memory space.
Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire
Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash
memory space was properly erased, security will be released. During the execution of this command
(CCIF=0) the user must not write to any Flash module register. The CCIF flag will set after the Erase All
Blocks operation has completed.
27.4.6.8 Erase Flash Block Command
The Erase Flash Block operation will erase all addresses in a P-Flash or EEPROM block.
Table 27-43. Program Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 27-27)
Set if an invalid phrase index is supplied
Set if the requested phrase has already been programmed1
1If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will
be allowed to execute again on that same phrase.
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 27-44. Erase All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x08 Not required
Table 27-45. Erase All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 27-27)
FPVIOL Set if any area of the P-Flash or EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1006 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Erase Flash Block command, the Memory Controller will erase the
selected Flash block and verify that it is erased. The CCIF flag will set after the Erase Flash Block
operation has completed.
27.4.6.9 Erase P-Flash Sector Command
The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector.
Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the
selected Flash sector and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash
Sector operation has completed.
Table 27-46. Erase Flash Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x09 Global address [17:16] to
identify Flash block
001 Global address [15:0] in Flash block to be erased
Table 27-47. Erase Flash Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 27-27)
Set if an invalid global address [17:16] is supplied
Set if the supplied P-Flash address is not phrase-aligned or if the EEPROM
address is not word-aligned
FPVIOL Set if an area of the selected Flash block is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 27-48. Erase P-Flash Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0A Global address [17:16] to identify
P-Flash block to be erased
001 Global address [15:0] anywhere within the sector to be erased.
Refer to Section 27.1.2.1 for the P-Flash sector size.
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1007
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
27.4.6.10 Unsecure Flash Command
The Unsecure Flash command will erase the entire P-Flash and EEPROM memory space and, if the erase
is successful, will release security.
Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire
P-Flash and EEPROM memory space and verify that it is erased. If the Memory Controller verifies that
the entire Flash memory space was properly erased, security will be released. If the erase verify is not
successful, the Unsecure Flash operation sets MGSTAT1 and terminates without changing the security
state. During the execution of this command (CCIF=0) the user must not write to any Flash module
register. The CCIF flag is set after the Unsecure Flash operation has completed.
27.4.6.11 Verify Backdoor Access Key Command
The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the
FSEC register (see Table 27-10). The Verify Backdoor Access Key command releases security if
user-supplied keys match those stored in the Flash security bytes of the Flash configuration field (see
Table 27-49. Erase P-Flash Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 27-27)
Set if an invalid global address [17:16] is supplied see Table 27-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the selected P-Flash sector is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 27-50. Unsecure Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0B Not required
Table 27-51. Unsecure Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 27-27)
FPVIOL Set if any area of the P-Flash or EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
192 KByte Flash Module (S12FTMRG192K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1008 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 27-4). The Verify Backdoor Access Key command must not be executed from the Flash block
containing the backdoor comparison key to avoid code runaway.
Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will
check the FSEC KEYEN bits to verify that this command is enabled. If not enabled, the Memory
Controller sets the ACCERR bit in the FSTAT register and terminates. If the command is enabled, the
Memory Controller compares the key provided in FCCOB to the backdoor comparison key in the Flash
configuration field with Key 0 compared to 0x3_FF00, etc. If the backdoor keys match, security will be
released. If the backdoor keys do not match, security is not released and all future attempts to execute the
Verify Backdoor Access Key command are aborted (set ACCERR) until a reset occurs. The CCIF flag is
set after the Verify Backdoor Access Key operation has completed.
27.4.6.12 Set User Margin Level Command
The Set User Margin Level command causes the Memory Controller to set the margin level for future read
operations of the P-Flash or EEPROM block.
Table 27-52. Verify Backdoor Access Key Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0C Not required
001 Key 0
010 Key 1
011 Key 2
100 Key 3
Table 27-53. Verify Backdoor Access Key Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 100 at command launch
Set if an incorrect backdoor key is supplied
Set if backdoor key access has not been enabled (KEYEN[1:0] != 10, see
Section 27.3.2.2)
Set if the backdoor key has mismatched since the last reset
FPVIOL None
MGSTAT1 None
MGSTAT0 None
Table 27-54. Set User Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0D Flash block selection code [1:0]. See
Table 27-34
001 Margin level setting.
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Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the
user margin level for the targeted block and then set the CCIF flag.
NOTE
When the EEPROM block is targeted, the EEPROM user margin levels are
applied only to the EEPROM reads. However, when the P-Flash block is
targeted, the P-Flash user margin levels are applied to both P-Flash and
EEPROM reads. It is not possible to apply user margin levels to the P-Flash
block only.
Valid margin level settings for the Set User Margin Level command are defined in Table 27-55.
NOTE
User margin levels can be used to check that Flash memory contents have
adequate margin for normal level read operations. If unexpected results are
encountered when checking Flash memory contents at user margin levels, a
potential loss of information has been detected.
27.4.6.13 Set Field Margin Level Command
The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set
the margin level specified for future read operations of the P-Flash or EEPROM block.
Table 27-55. Valid Set User Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level1
1Read margin to the erased state
0x0002 User Margin-0 Level2
2Read margin to the programmed state
Table 27-56. Set User Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch.
Set if command not available in current mode (see Table 27-27).
Set if an invalid margin level setting is supplied.
FPVIOL None
MGSTAT1 None
MGSTAT0 None
192 KByte Flash Module (S12FTMRG192K2V1)
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Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the
field margin level for the targeted block and then set the CCIF flag.
NOTE
When the EEPROM block is targeted, the EEPROM field margin levels are
applied only to the EEPROM reads. However, when the P-Flash block is
targeted, the P-Flash field margin levels are applied to both P-Flash and
EEPROM reads. It is not possible to apply field margin levels to the P-Flash
block only.
Valid margin level settings for the Set Field Margin Level command are defined in Table 27-58.
Table 27-57. Set Field Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0E Flash block selection code [1:0]. See
Table 27-34
001 Margin level setting.
Table 27-58. Valid Set Field Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level1
1Read margin to the erased state
0x0002 User Margin-0 Level2
2Read margin to the programmed state
0x0003 Field Margin-1 Level1
0x0004 Field Margin-0 Level2
Table 27-59. Set Field Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch.
Set if command not available in current mode (see Table 27-27).
Set if an invalid margin level setting is supplied.
FPVIOL None
MGSTAT1 None
MGSTAT0 None
192 KByte Flash Module (S12FTMRG192K2V1)
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CAUTION
Field margin levels must only be used during verify of the initial factory
programming.
NOTE
Field margin levels can be used to check that Flash memory contents have
adequate margin for data retention at the normal level setting. If unexpected
results are encountered when checking Flash memory contents at field
margin levels, the Flash memory contents should be erased and
reprogrammed.
27.4.6.14 Erase Verify EEPROM Section Command
The Erase Verify EEPROM Section command will verify that a section of code in the EEPROM is erased.
The Erase Verify EEPROM Section command defines the starting point of the data to be verified and the
number of words.
Upon clearing CCIF to launch the Erase Verify EEPROM Section command, the Memory Controller will
verify the selected section of EEPROM memory is erased. The CCIF flag will set after the Erase Verify
EEPROM Section operation has completed. If the section is not erased, it means blank check failed, both
MGSTAT bits will be set.
Table 27-60. Erase Verify EEPROM Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x10
Global address [17:16] to
identify the EEPROM
block
001 Global address [15:0] of the first word to be verified
010 Number of words to be verified
Table 27-61. Erase Verify EEPROM Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 27-27)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested section breaches the end of the EEPROM block
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
192 KByte Flash Module (S12FTMRG192K2V1)
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27.4.6.15 Program EEPROM Command
The Program EEPROM operation programs one to four previously erased words in the EEPROM block.
The Program EEPROM operation will confirm that the targeted location(s) were successfully programmed
upon completion.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
Upon clearing CCIF to launch the Program EEPROM command, the user-supplied words will be
transferred to the Memory Controller and be programmed if the area is unprotected. The CCOBIX index
value at Program EEPROM command launch determines how many words will be programmed in the
EEPROM block. The CCIF flag is set when the operation has completed.
27.4.6.16 Erase EEPROM Sector Command
The Erase EEPROM Sector operation will erase all addresses in a sector of the EEPROM block.
Table 27-62. Program EEPROM Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x11 Global address [17:16] to
identify the EEPROM block
001 Global address [15:0] of word to be programmed
010 Word 0 program value
011 Word 1 program value, if desired
100 Word 2 program value, if desired
101 Word 3 program value, if desired
Table 27-63. Program EEPROM Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] < 010 at command launch
Set if CCOBIX[2:0] > 101 at command launch
Set if command not available in current mode (see Table 27-27)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested group of words breaches the end of the EEPROM block
FPVIOL Set if the selected area of the EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
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Upon clearing CCIF to launch the Erase EEPROM Sector command, the Memory Controller will erase the
selected Flash sector and verify that it is erased. The CCIF flag will set after the Erase EEPROM Sector
operation has completed.
27.4.7 Interrupts
The Flash module can generate an interrupt when a Flash command operation has completed or when a
Flash command operation has detected an ECC fault.
Table 27-64. Erase EEPROM Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x12 Global address [17:16] to identify
EEPROM block
001 Global address [15:0] anywhere within the sector to be erased.
See Section 27.1.2.2 for EEPROM sector size.
Table 27-65. Erase EEPROM Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 27-27)
Set if an invalid global address [17:0] is suppliedsee Table 27-3)
Set if a misaligned word address is supplied (global address [0] != 0)
FPVIOL Set if the selected area of the EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 27-66. Flash Interrupt Sources
Interrupt Source Interrupt Flag Local Enable Global (CCR)
Mask
Flash Command Complete CCIF
(FSTAT register)
CCIE
(FCNFG register)
I Bit
ECC Double Bit Fault on Flash Read DFDIF
(FERSTAT register)
DFDIE
(FERCNFG register)
I Bit
ECC Single Bit Fault on Flash Read SFDIF
(FERSTAT register)
SFDIE
(FERCNFG register)
I Bit
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NOTE
Vector addresses and their relative interrupt priority are determined at the
MCU level.
27.4.7.1 Description of Flash Interrupt Operation
The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the
Flash command interrupt request. The Flash module uses the DFDIF and SFDIF flags in combination with
the DFDIE and SFDIE interrupt enable bits to generate the Flash error interrupt request. For a detailed
description of the register bits involved, refer to Section 27.3.2.5, “Flash Configuration Register
(FCNFG)”, Section 27.3.2.6, “Flash Error Configuration Register (FERCNFG)”, Section 27.3.2.7, “Flash
Status Register (FSTAT)”, and Section 27.3.2.8, “Flash Error Status Register (FERSTAT)”.
The logic used for generating the Flash module interrupts is shown in Figure 27-27.
Figure 27-27. Flash Module Interrupts Implementation
27.4.8 Wait Mode
The Flash module is not affected if the MCU enters wait mode. The Flash module can recover the MCU
from wait via the CCIF interrupt (see Section 27.4.7, “Interrupts”).
27.4.9 Stop Mode
If a Flash command is active (CCIF = 0) when the MCU requests stop mode, the current Flash operation
will be completed before the MCU is allowed to enter stop mode.
Flash Error Interrupt Request
CCIF
CCIE
DFDIF
DFDIE
SFDIF
SFDIE
Flash Command Interrupt Request
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27.5 Security
The Flash module provides security information to the MCU. The Flash security state is defined by the
SEC bits of the FSEC register (see Table 27-11). During reset, the Flash module initializes the FSEC
register using data read from the security byte of the Flash configuration field at global address 0x3_FF0F.
The security state out of reset can be permanently changed by programming the security byte assuming
that the MCU is starting from a mode where the necessary P-Flash erase and program commands are
available and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully
programmed, its new value will take affect after the next MCU reset.
The following subsections describe these security-related subjects:
• Unsecuring the MCU using Backdoor Key Access
• Unsecuring the MCU in Special Single Chip Mode using BDM
• Mode and Security Effects on Flash Command Availability
27.5.1 Unsecuring the MCU using Backdoor Key Access
The MCU may be unsecured by using the backdoor key access feature which requires knowledge of the
contents of the backdoor keys (four 16-bit words programmed at addresses 0x3_FF00-0x3_FF07). If the
KEYEN[1:0] bits are in the enabled state (see Section 27.3.2.2), the Verify Backdoor Access Key
command (see Section 27.4.6.11) allows the user to present four prospective keys for comparison to the
keys stored in the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor
Access Key command match the backdoor keys stored in the Flash memory, the SEC bits in the FSEC
register (see Table 27-11) will be changed to unsecure the MCU. Key values of 0x0000 and 0xFFFF are
not permitted as backdoor keys. While the Verify Backdoor Access Key command is active, P-Flash
memory and EEPROM memory will not be available for read access and will return invalid data.
The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an
external stimulus. This external stimulus would typically be through one of the on-chip serial ports.
If the KEYEN[1:0] bits are in the enabled state (see Section 27.3.2.2), the MCU can be unsecured by the
backdoor key access sequence described below:
1. Follow the command sequence for the Verify Backdoor Access Key command as explained in
Section 27.4.6.11
2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the
SEC[1:0] bits in the FSEC register are forced to the unsecure state of 10
The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will
prohibit future use of the Verify Backdoor Access Key command. A reset of the MCU is the only method
to re-enable the Verify Backdoor Access Key command. The security as defined in the Flash security byte
(0x3_FF0F) is not changed by using the Verify Backdoor Access Key command sequence. The backdoor
keys stored in addresses 0x3_FF00-0x3_FF07 are unaffected by the Verify Backdoor Access Key
command sequence. The Verify Backdoor Access Key command sequence has no effect on the program
and erase protections defined in the Flash protection register, FPROT.
After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is
unsecured, the sector containing the Flash security byte can be erased and the Flash security byte can be
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reprogrammed to the unsecure state, if desired. In the unsecure state, the user has full control of the
contents of the backdoor keys by programming addresses 0x3_FF00-0x3_FF07 in the Flash configuration
field.
27.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM
A secured MCU can be unsecured in special single chip mode by using the following method to erase the
P-Flash and EEPROM memory:
1. Reset the MCU into special single chip mode
2. Delay while the BDM executes the Erase Verify All Blocks command write sequence to check if
the P-Flash and EEPROM memories are erased
3. Send BDM commands to disable protection in the P-Flash and EEPROM memory
4. Execute the Erase All Blocks command write sequence to erase the P-Flash and EEPROM
memory. Alternatively the Unsecure Flash command can be executed, if so the steps 5 and 6 below
are skeeped.
5. After the CCIF flag sets to indicate that the Erase All Blocks operation has completed, reset the
MCU into special single chip mode
6. Delay while the BDM executes the Erase Verify All Blocks command write sequence to verify that
the P-Flash and EEPROM memory are erased
If the P-Flash and EEPROM memory are verified as erased, the MCU will be unsecured. All BDM
commands will now be enabled and the Flash security byte may be programmed to the unsecure state by
continuing with the following steps:
7. Send BDM commands to execute the Program P-Flash command write sequence to program the
Flash security byte to the unsecured state
8. Reset the MCU
27.5.3 Mode and Security Effects on Flash Command Availability
The availability of Flash module commands depends on the MCU operating mode and security state as
shown in Table 27-27.
27.6 Initialization
On each system reset the flash module executes an initialization sequence which establishes initial values
for the Flash Block Configuration Parameters, the FPROT and EEPROT protection registers, and the FOPT
and FSEC registers. The initialization routine reverts to built-in default values that leave the module in a
fully protected and secured state if errors are encountered during execution of the reset sequence. If a
double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT register will be set.
CCIF is cleared throughout the initialization sequence. The Flash module holds off all CPU access for a
portion of the initialization sequence. Flash reads are allowed once the hold is removed. Completion of the
initialization sequence is marked by setting CCIF high which enables user commands.
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If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The
state of the word being programmed or the sector/block being erased is not guaranteed.
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Chapter 28
240 KByte Flash Module (S12FTMRG240K2V1)
28.1 Introduction
The FTMRG240K2 module implements the following:
• 240Kbytes of P-Flash (Program Flash) memory
• 4Kbytes of EEPROM memory
The Flash memory is ideal for single-supply applications allowing for field reprogramming without
requiring external high voltage sources for program or erase operations. The Flash module includes a
memory controller that executes commands to modify Flash memory contents. The user interface to the
memory controller consists of the indexed Flash Common Command Object (FCCOB) register which is
written to with the command, global address, data, and any required command parameters. The memory
controller must complete the execution of a command before the FCCOB register can be written to with a
new command.
CAUTION
A Flash word or phrase must be in the erased state before being
programmed. Cumulative programming of bits within a Flash word or
phrase is not allowed.
Table 28-1. Revision History
Revision
Number
Revision
Date
Sections
Affected Description of Changes
V01.06 23 Jun 2010 28.4.6.2/28-105
3
28.4.6.12/28-10
60
28.4.6.13/28-10
61
Updated description of the commands RD1BLK, MLOADU and MLOADF
V01.07 20 aug 2010 28.4.6.2/28-105
3
28.4.6.12/28-10
60
28.4.6.13/28-10
61
Updated description of the commands RD1BLK, MLOADU and MLOADF
Rev.1.06 31 Jan 2011 28.3.2.9/28-103
6
Updated description of protection on Section 28.3.2.9
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The Flash memory may be read as bytes and aligned words. Read access time is one bus cycle for bytes
and aligned words. For misaligned words access, the CPU has to perform twice the byte read access
command. For Flash memory, an erased bit reads 1 and a programmed bit reads 0.
It is possible to read from P-Flash memory while some commands are executing on EEPROM memory. It
is not possible to read from EEPROM memory while a command is executing on P-Flash memory.
Simultaneous P-Flash and EEPROM operations are discussed in Section 28.4.5.
Both P-Flash and EEPROM memories are implemented with Error Correction Codes (ECC) that can
resolve single bit faults and detect double bit faults. For P-Flash memory, the ECC implementation
requires that programming be done on an aligned 8 byte basis (a Flash phrase). Since P-Flash memory is
always read by half-phrase, only one single bit fault in an aligned 4 byte half-phrase containing the byte
or word accessed will be corrected.
28.1.1 Glossary
Command Write Sequence — An MCU instruction sequence to execute built-in algorithms (including
program and erase) on the Flash memory.
EEPROM Memory — The EEPROM memory constitutes the nonvolatile memory store for data.
EEPROM Sector — The EEPROM sector is the smallest portion of the EEPROM memory that can be
erased. The EEPROM sector consists of 4 bytes.
NVM Command Mode — An NVM mode using the CPU to setup the FCCOB register to pass parameters
required for Flash command execution.
Phrase — An aligned group of four 16-bit words within the P-Flash memory. Each phrase includes two
sets of aligned double words with each set including 7 ECC bits for single bit fault correction and double
bit fault detection within each double word.
P-Flash Memory — The P-Flash memory constitutes the main nonvolatile memory store for applications.
P-Flash Sector — The P-Flash sector is the smallest portion of the P-Flash memory that can be erased.
Each P-Flash sector contains 512 bytes.
Program IFR — Nonvolatile information register located in the P-Flash block that contains the Version
ID, and the Program Once field.
28.1.2 Features
28.1.2.1 P-Flash Features
• 240 Kbytes of P-Flash memory divided into 480 sectors of 512 bytes
240 KByte Flash Module (S12FTMRG240K2V1)
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• Single bit fault correction and double bit fault detection within a 32-bit double word during read
operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and phrase program operation
• Ability to read the P-Flash memory while programming a word in the EEPROM memory
• Flexible protection scheme to prevent accidental program or erase of P-Flash memory
28.1.2.2 EEPROM Features
• 4 Kbytes of EEPROM memory composed of one 4 Kbyte Flash block divided into 1024 sectors of
4 bytes
• Single bit fault correction and double bit fault detection within a word during read operations
• Automated program and erase algorithm with verify and generation of ECC parity bits
• Fast sector erase and word program operation
• Protection scheme to prevent accidental program or erase of EEPROM memory
• Ability to program up to four words in a burst sequence
28.1.2.3 Other Flash Module Features
• No external high-voltage power supply required for Flash memory program and erase operations
• Interrupt generation on Flash command completion and Flash error detection
• Security mechanism to prevent unauthorized access to the Flash memory
28.1.3 Block Diagram
The block diagram of the Flash module is shown in Figure 28-1.
240 KByte Flash Module (S12FTMRG240K2V1)
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Figure 28-1. FTMRG240K2 Block Diagram
28.2 External Signal Description
The Flash module contains no signals that connect off-chip.
Bus
Clock
Divider
Clock
Command
Interrupt
Request
FCLK
Protection
Security
Registers
Flash
Interface
16bit
internal
bus
sector 0
sector 1
sector 479
60Kx39
P-Flash
Error
Interrupt
Request
CPU
sector 0
sector 1
sector 1023
2Kx22
EEPROM
Memory Controller
240 KByte Flash Module (S12FTMRG240K2V1)
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28.3 Memory Map and Registers
This section describes the memory map and registers for the Flash module. Read data from unimplemented
memory space in the Flash module is undefined. Write access to unimplemented or reserved memory space
in the Flash module will be ignored by the Flash module.
CAUTION
Writing to the Flash registers while a Flash command is executing (that is
indicated when the value of flag CCIF reads as ’0’) is not allowed. If such
action is attempted the write operation will not change the register value.
Writing to the Flash registers is allowed when the Flash is not busy
executing commands (CCIF = 1) and during initialization right after reset,
despite the value of flag CCIF in that case (refer to Section 28.6 for a
complete description of the reset sequence).
.
28.3.1 Module Memory Map
The S12 architecture places the P-Flash memory between global addresses 0x0_4000 and 0x3_FFFF as
shown in Table 28-3 .The P-Flash memory map is shown in Figure 28-2.
Table 28-2. FTMRG Memory Map
Global Address (in Bytes) Size
(Bytes) Description
0x0_0000 - 0x0_03FF 1,024 Register Space
0x0_0400 – 0x0_13FF 4,096 EEPROM Memory
0x0_4000 – 0x0_7FFF 16,284 NVMRES=0 : P-Flash Memory area active
0x0_4000 – 0x0_7FFF 16,284 NVMRES1=1 : NVM Resource area (see Figure 28-3)
1See NVMRES description in Section 28.4.3
0x0_8000 – 0x3_FFFF 229,376 P-Flash Memory
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1024 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
The FPROT register, described in Section 28.3.2.9, can be set to protect regions in the Flash memory from
accidental program or erase. The Flash memory addresses covered by these protectable regions are shown
in the P-Flash memory map. The higher address region is mainly targeted to hold the boot loader code
since it covers the vector space. Default protection settings as well as security information that allows the
MCU to restrict access to the Flash module are stored in the Flash configuration field as described in
Table 28-4.
Table 28-3. P-Flash Memory Addressing
Global Address Size
(Bytes) Description
0x0_4000 – 0x3_FFFF 240 K
P-Flash Block
Contains Flash Configuration Field
(see Table 28-4).
Table 28-4. Flash Configuration Field
Global Address Size
(Bytes) Description
0x3_FF00-0x3_FF07 8
Backdoor Comparison Key
Refer to Section 28.4.6.11, “Verify Backdoor Access Key Command,” and
Section 28.5.1, “Unsecuring the MCU using Backdoor Key Access”
0x3_FF08-0x3_FF0B1
10x3FF08-0x3_FF0F form a Flash phrase and must be programmed in a single command write sequence. Each byte in
the 0x3_FF08 - 0x3_FF0B reserved field should be programmed to 0xFF.
4 Reserved
0x3_FF0C11P-Flash Protection byte.
Refer to Section 28.3.2.9, “P-Flash Protection Register (FPROT)”
0x3_FF0D11EEPROM Protection byte.
Refer to Section 28.3.2.10, “EEPROM Protection Register (EEPROT)”
0x3_FF0E11Flash Nonvolatile byte
Refer to Section 28.3.2.16, “Flash Option Register (FOPT)”
0x3_FF0F11Flash Security byte
Refer to Section 28.3.2.2, “Flash Security Register (FSEC)”
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1025
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Figure 28-2. P-Flash Memory Map
Table 28-5. Program IFR Fields
Global Address Size
(Bytes) Field Description
0x0_4000 – 0x0_4007 8 Reserved
0x0_4008 – 0x0_40B5 174 Reserved
0x0_40B6 – 0x0_40B7 2 Version ID1
Flash Configuration Field
0x3_C000
Flash Protected/Unprotected Lower Region
1, 2, 4, 8 Kbytes
0x3_8000
0x3_9000
0x3_8400
0x3_8800
0x3_A000
P-Flash END = 0x3_FFFF
0x3_F800
0x3_F000
0x3_E000 Flash Protected/Unprotected Higher Region
2, 4, 8, 16 Kbytes
Flash Protected/Unprotected Region
8 Kbytes (up to 29 Kbytes)
16 bytes (0x3_FF00 - 0x3_FF0F)
Flash Protected/Unprotected Region
208 Kbytes
P-Flash START = 0x0_4000
Protection
Protection
Protection
Movable End
Fixed End
Fixed End
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1026 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 28-3. Memory Controller Resource Memory Map (NVMRES=1)
0x0_40B8 – 0x0_40BF 8 Reserved
0x0_40C0 – 0x0_40FF 64 Program Once Field
Refer to Section 28.4.6.6, “Program Once Command”
1Used to track firmware patch versions, see Section 28.4.2
Table 28-6. Memory Controller Resource Fields (NVMRES1=1)
1NVMRES - See Section 28.4.3 for NVMRES (NVM Resource) detail.
Global Address Size
(Bytes) Description
0x0_4000 – 0x040FF 256 P-Flash IFR (see Table 28-5)
0x0_4100 – 0x0_41FF 256 Reserved.
0x0_4200 – 0x0_57FF Reserved
0x0_5800 – 0x0_5AFF 768 Reserved
0x0_5B00 – 0x0_5FFF 1,280 Reserved
0x0_6000 – 0x0_67FF 2,048 Reserved
0x0_6800 – 0x0_7FFF 6,144 Reserved
Table 28-5. Program IFR Fields
Global Address Size
(Bytes) Field Description
P-Flash IFR 128 bytes (NVMRES=1)
0x0_4000
Reserved 6144 bytes
Reserved 3328 bytes
0x0_6800
0x0_7FFF
0x0_4100
Reserved 5632 bytes
Reserved 768 bytes
0x0_4200
Reserved 128 bytes
0x0_5800
0x0_5AFF
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1027
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.3.2 Register Descriptions
The Flash module contains a set of 20 control and status registers located between Flash module base +
0x0000 and 0x0013.
In the case of the writable registers, the write accesses are forbidden during Fash command execution (for
more detail, see Caution note in Section 28.3).
A summary of the Flash module registers is given in Figure 28-4 with detailed descriptions in the
following subsections.
Address
& Name 76543210
0x0000
FCLKDIV
R FDIVLD FDIVLCK FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0
W
0x0001
FSEC
R KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0
W
0x0002
FCCOBIX
R0 0 0 0 0 CCOBIX2 CCOBIX1 CCOBIX0
W
0x0003
FRSV0
R00000000
W
0x0004
FCNFG
RCCIE 00
IGNSF 00
FDFD FSFD
W
0x0005
FERCNFG
R0 0 0 0 0 0 DFDIE SFDIE
W
0x0006
FSTAT
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT1 MGSTAT0
W
0x0007
FERSTAT
R0 0 0 0 0 0 DFDIF SFDIF
W
0x0008
FPROT
RFPOPEN RNV6 FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0
W
0x0009
EEPROT
RDPOPEN DPS6 DPS5 DPS4 DPS3 DPS2 DPS1 DPS0
W
Figure 28-4. FTMRG240K2 Register Summary
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1028 Freescale Semiconductor
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28.3.2.1 Flash Clock Divider Register (FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
0x000A
FCCOBHI
RCCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8
W
0x000B
FCCOBLO
RCCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0
W
0x000C
FRSV1
R00000000
W
0x000D
FRSV2
R00000000
W
0x000E
FRSV3
R00000000
W
0x000F
FRSV4
R00000000
W
0x0010
FOPT
R NV7 NV6 NV5 NV4 NV3 NV2 NV1 NV0
W
0x0011
FRSV5
R00000000
W
0x0012
FRSV6
R00000000
W
0x0013
FRSV7
R00000000
W
= Unimplemented or Reserved
Address
& Name 76543210
Figure 28-4. FTMRG240K2 Register Summary (continued)
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
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All bits in the FCLKDIV register are readable, bit 7 is not writable, bit 6 is write-once-hi and controls the
writability of the FDIV field in normal mode. In special mode, bits 6-0 are writable any number of times
but bit 7 remains unwritable.
CAUTION
The FCLKDIV register should never be written while a Flash command is
executing (CCIF=0).
Offset Module Base + 0x0000
76543210
R FDIVLD FDIVLCK FDIV[5:0]
W
Reset 00000000
= Unimplemented or Reserved
Figure 28-5. Flash Clock Divider Register (FCLKDIV)
Table 28-7. FCLKDIV Field Descriptions
Field Description
7
FDIVLD
Clock Divider Loaded
0 FCLKDIV register has not been written since the last reset
1 FCLKDIV register has been written since the last reset
6
FDIVLCK
Clock Divider Locked
0 FDIV field is open for writing
1 FDIV value is locked and cannot be changed. Once the lock bit is set high, only reset can clear this bit and
restore writability to the FDIV field in normal mode.
5–0
FDIV[5:0]
Clock Divider Bits — FDIV[5:0] must be set to effectively divide BUSCLK down to 1 MHz to control timed events
during Flash program and erase algorithms. Table 28-8 shows recommended values for FDIV[5:0] based on the
BUSCLK frequency. Please refer to Section 28.4.4, “Flash Command Operations,” for more information.
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1030 Freescale Semiconductor
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28.3.2.2 Flash Security Register (FSEC)
The FSEC register holds all bits associated with the security of the MCU and Flash module.
All bits in the FSEC register are readable but not writable.
During the reset sequence, the FSEC register is loaded with the contents of the Flash security byte in the
Flash configuration field at global address 0x3_FF0F located in P-Flash memory (see Table 28-4) as
Table 28-8. FDIV values for various BUSCLK Frequencies
BUSCLK Frequency
(MHz) FDIV[5:0]
BUSCLK Frequency
(MHz) FDIV[5:0]
MIN1
1BUSCLK is Greater Than this value.
MAX2
2BUSCLK is Less Than or Equal to this value.
MIN1MAX2
1.0 1.6 0x00 16.6 17.6 0x10
1.6 2.6 0x01 17.6 18.6 0x11
2.6 3.6 0x02 18.6 19.6 0x12
3.6 4.6 0x03 19.6 20.6 0x13
4.6 5.6 0x04 20.6 21.6 0x14
5.6 6.6 0x05 21.6 22.6 0x15
6.6 7.6 0x06 22.6 23.6 0x16
7.6 8.6 0x07 23.6 24.6 0x17
8.6 9.6 0x08 24.6 25.6 0x18
9.6 10.6 0x09
10.6 11.6 0x0A
11.6 12.6 0x0B
12.6 13.6 0x0C
13.6 14.6 0x0D
14.6 15.6 0x0E
15.6 16.6 0x0F
Offset Module Base + 0x0001
76543210
R KEYEN[1:0] RNV[5:2] SEC[1:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 28-6. Flash Security Register (FSEC)
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1031
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
indicated by reset condition F in Figure 28-6. If a double bit fault is detected while reading the P-Flash
phrase containing the Flash security byte during the reset sequence, all bits in the FSEC register will be set
to leave the Flash module in a secured state with backdoor key access disabled.
The security function in the Flash module is described in Section 28.5.
28.3.2.3 Flash CCOB Index Register (FCCOBIX)
The FCCOBIX register is used to index the FCCOB register for Flash memory operations.
Table 28-9. FSEC Field Descriptions
Field Description
7–6
KEYEN[1:0]
Backdoor Key Security Enable Bits — The KEYEN[1:0] bits define the enabling of backdoor key access to the
Flash module as shown in Table 28-10.
5–2
RNV[5:2]
Reserved Nonvolatile Bits — The RNV bits should remain in the erased state for future enhancements.
1–0
SEC[1:0]
Flash Security Bits — The SEC[1:0] bits define the security state of the MCU as shown in Table 28-11. If the
Flash module is unsecured using backdoor key access, the SEC bits are forced to 10.
Table 28-10. Flash KEYEN States
KEYEN[1:0] Status of Backdoor Key Access
00 DISABLED
01 DISABLED1
1Preferred KEYEN state to disable backdoor key access.
10 ENABLED
11 DISABLED
Table 28-11. Flash Security States
SEC[1:0] Status of Security
00 SECURED
01 SECURED1
1Preferred SEC state to set MCU to secured state.
10 UNSECURED
11 SECURED
Offset Module Base + 0x0002
76543210
R00000 CCOBIX[2:0]
W
Reset 00000000
= Unimplemented or Reserved
Figure 28-7. FCCOB Index Register (FCCOBIX)
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1032 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
CCOBIX bits are readable and writable while remaining bits read 0 and are not writable.
28.3.2.4 Flash Reserved0 Register (FRSV0)
This Flash register is reserved for factory testing.
All bits in the FRSV0 register read 0 and are not writable.
28.3.2.5 Flash Configuration Register (FCNFG)
The FCNFG register enables the Flash command complete interrupt and forces ECC faults on Flash array
read access from the CPU.
CCIE, IGNSF, FDFD, and FSFD bits are readable and writable while remaining bits read 0 and are not
writable.
Table 28-12. FCCOBIX Field Descriptions
Field Description
2–0
CCOBIX[1:0]
Common Command Register Index— The CCOBIX bits are used to select which word of the FCCOB register
array is being read or written to. See <st-blue>28.3.2.11 Flash Common Command Object Register (FCCOB),”
for more details.
Offset Module Base + 0x000C
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 28-8. Flash Reserved0 Register (FRSV0)
Offset Module Base + 0x0004
76543210
RCCIE 00
IGNSF 00
FDFD FSFD
W
Reset 00000000
= Unimplemented or Reserved
Figure 28-9. Flash Configuration Register (FCNFG)
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1033
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.3.2.6 Flash Error Configuration Register (FERCNFG)
The FERCNFG register enables the Flash error interrupts for the FERSTAT flags.
All assigned bits in the FERCNFG register are readable and writable.
Table 28-13. FCNFG Field Descriptions
Field Description
7
CCIE
Command Complete Interrupt Enable — The CCIE bit controls interrupt generation when a Flash command
has completed.
0 Command complete interrupt disabled
1 An interrupt will be requested whenever the CCIF flag in the FSTAT register is set (see Section 28.3.2.7)
4
IGNSF
Ignore Single Bit Fault — The IGNSF controls single bit fault reporting in the FERSTAT register (see
Section 28.3.2.8).
0 All single bit faults detected during array reads are reported
1 Single bit faults detected during array reads are not reported and the single bit fault interrupt will not be
generated
1
FDFD
Force Double Bit Fault Detect — The FDFD bit allows the user to simulate a double bit fault during Flash array
read operations and check the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD.
0 Flash array read operations will set the DFDIF flag in the FERSTAT register only if a double bit fault is detected
1 Any Flash array read operation will force the DFDIF flag in the FERSTAT register to be set (see
Section 28.3.2.7) and an interrupt will be generated as long as the DFDIE interrupt enable in the FERCNFG
register is set (see Section 28.3.2.6)
0
FSFD
Force Single Bit Fault Detect —The FSFD bit allows the user to simulate a single bit fault during Flash array
read operations and check the associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD.
0 Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is detected
1 Flash array read operation will force the SFDIF flag in the FERSTAT register to be set (see Section 28.3.2.7)
and an interrupt will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set (see
Section 28.3.2.6)
Offset Module Base + 0x0005
76543210
R000000
DFDIE SFDIE
W
Reset 00000000
= Unimplemented or Reserved
Figure 28-10. Flash Error Configuration Register (FERCNFG)
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1034 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.3.2.7 Flash Status Register (FSTAT)
The FSTAT register reports the operational status of the Flash module.
CCIF, ACCERR, and FPVIOL bits are readable and writable, MGBUSY and MGSTAT bits are readable
but not writable, while remaining bits read 0 and are not writable.
Table 28-14. FERCNFG Field Descriptions
Field Description
1
DFDIE
Double Bit Fault Detect Interrupt Enable — The DFDIE bit controls interrupt generation when a double bit fault
is detected during a Flash block read operation.
0 DFDIF interrupt disabled
1 An interrupt will be requested whenever the DFDIF flag is set (see Section 28.3.2.8)
0
SFDIE
Single Bit Fault Detect Interrupt Enable — The SFDIE bit controls interrupt generation when a single bit fault
is detected during a Flash block read operation.
0 SFDIF interrupt disabled whenever the SFDIF flag is set (see Section 28.3.2.8)
1 An interrupt will be requested whenever the SFDIF flag is set (see Section 28.3.2.8)
Offset Module Base + 0x0006
76543210
RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT[1:0]
W
Reset 1000000
1
1Reset value can deviate from the value shown if a double bit fault is detected during the reset sequence (see Section 28.6).
01
= Unimplemented or Reserved
Figure 28-11. Flash Status Register (FSTAT)
Table 28-15. FSTAT Field Descriptions
Field Description
7
CCIF
Command Complete Interrupt Flag — The CCIF flag indicates that a Flash command has completed. The
CCIF flag is cleared by writing a 1 to CCIF to launch a command and CCIF will stay low until command
completion or command violation.
0 Flash command in progress
1 Flash command has completed
5
ACCERR
Flash Access Error Flag — The ACCERR bit indicates an illegal access has occurred to the Flash memory
caused by either a violation of the command write sequence (see Section 28.4.4.2) or issuing an illegal Flash
command. While ACCERR is set, the CCIF flag cannot be cleared to launch a command. The ACCERR bit is
cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR bit has no effect on ACCERR.
0 No access error detected
1 Access error detected
4
FPVIOL
Flash Protection Violation Flag —The FPVIOL bit indicates an attempt was made to program or erase an
address in a protected area of P-Flash or EEPROM memory during a command write sequence. The FPVIOL
bit is cleared by writing a 1 to FPVIOL. Writing a 0 to the FPVIOL bit has no effect on FPVIOL. While FPVIOL
is set, it is not possible to launch a command or start a command write sequence.
0 No protection violation detected
1 Protection violation detected
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1035
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28.3.2.8 Flash Error Status Register (FERSTAT)
The FERSTAT register reflects the error status of internal Flash operations.
All flags in the FERSTAT register are readable and only writable to clear the flag.
3
MGBUSY
Memory Controller Busy Flag — The MGBUSY flag reflects the active state of the Memory Controller.
0 Memory Controller is idle
1 Memory Controller is busy executing a Flash command (CCIF = 0)
2
RSVD
Reserved Bit — This bit is reserved and always reads 0.
1–0
MGSTAT[1:0]
Memory Controller Command Completion Status Flag — One or more MGSTAT flag bits are set if an error
is detected during execution of a Flash command or during the Flash reset sequence. See Section 28.4.6,
“Flash Command Description,” and Section 28.6, “Initialization” for details.
Offset Module Base + 0x0007
76543210
R000000
DFDIF SFDIF
W
Reset 00000000
= Unimplemented or Reserved
Figure 28-12. Flash Error Status Register (FERSTAT)
Table 28-16. FERSTAT Field Descriptions
Field Description
1
DFDIF
Double Bit Fault Detect Interrupt Flag — The setting of the DFDIF flag indicates that a double bit fault was
detected in the stored parity and data bits during a Flash array read operation or that a Flash array read operation
returning invalid data was attempted on a Flash block that was under a Flash command operation.1The DFDIF
flag is cleared by writing a 1 to DFDIF. Writing a 0 to DFDIF has no effect on DFDIF.2
0 No double bit fault detected
1 Double bit fault detected or a Flash array read operation returning invalid data was attempted while command
running
1 The single bit fault and double bit fault flags are mutually exclusive for parity errors (an ECC fault occurrence can be either
single fault or double fault but never both). A simultaneous access collision (Flash array read operation returning invalid data
attempted while command running) is indicated when both SFDIF and DFDIF flags are high.
2There is a one cycle delay in storing the ECC DFDIF and SFDIF fault flags in this register. At least one NOP is required after
a flash memory read before checking FERSTAT for the occurrence of ECC errors.
0
SFDIF
Single Bit Fault Detect Interrupt Flag — With the IGNSF bit in the FCNFG register clear, the SFDIF flag
indicates that a single bit fault was detected in the stored parity and data bits during a Flash array read operation
or that a Flash array read operation returning invalid data was attempted on a Flash block that was under a Flash
command operation.1 The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on
SFDIF.
0 No single bit fault detected
1 Single bit fault detected and corrected or a Flash array read operation returning invalid data was attempted
while command running
Table 28-15. FSTAT Field Descriptions (continued)
Field Description
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1036 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.3.2.9 P-Flash Protection Register (FPROT)
The FPROT register defines which P-Flash sectors are protected against program and erase operations.
The (unreserved) bits of the FPROT register are writable with the restriction that the size of the protected
region can only be increased (see Section 28.3.2.9.1, “P-Flash Protection Restrictions,” and Table 28-21).
During the reset sequence, the FPROT register is loaded with the contents of the P-Flash protection byte
in the Flash configuration field at global address 0x3_FF0C located in P-Flash memory (see Table 28-4)
as indicated by reset condition ‘F’ in Figure 28-13. To change the P-Flash protection that will be loaded
during the reset sequence, the upper sector of the P-Flash memory must be unprotected, then the P-Flash
protection byte must be reprogrammed. If a double bit fault is detected while reading the P-Flash phrase
containing the P-Flash protection byte during the reset sequence, the FPOPEN bit will be cleared and
remaining bits in the FPROT register will be set to leave the P-Flash memory fully protected.
Trying to alter data in any protected area in the P-Flash memory will result in a protection violation error
and the FPVIOL bit will be set in the FSTAT register. The block erase of a P-Flash block is not possible if
any of the P-Flash sectors contained in the same P-Flash block are protected.
Offset Module Base + 0x0008
76543210
RFPOPEN RNV6 FPHDIS FPHS[1:0] FPLDIS FPLS[1:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 28-13. Flash Protection Register (FPROT)
Table 28-17. FPROT Field Descriptions
Field Description
7
FPOPEN
Flash Protection Operation Enable — The FPOPEN bit determines the protection function for program or
erase operations as shown in Table 28-18 for the P-Flash block.
0 When FPOPEN is clear, the FPHDIS and FPLDIS bits define unprotected address ranges as specified by the
corresponding FPHS and FPLS bits
1 When FPOPEN is set, the FPHDIS and FPLDIS bits enable protection for the address range specified by the
corresponding FPHS and FPLS bits
6
RNV[6]
Reserved Nonvolatile Bit — The RNV bit should remain in the erased state for future enhancements.
5
FPHDIS
Flash Protection Higher Address Range Disable — The FPHDIS bit determines whether there is a
protected/unprotected area in a specific region of the P-Flash memory ending with global address 0x3_FFFF.
0 Protection/Unprotection enabled
1 Protection/Unprotection disabled
4–3
FPHS[1:0]
Flash Protection Higher Address Size — The FPHS bits determine the size of the protected/unprotected area
in P-Flash memory as shown inTable 28-19. The FPHS bits can only be written to while the FPHDIS bit is set.
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1037
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All possible P-Flash protection scenarios are shown in Figure 28-14 . Although the protection scheme is
loaded from the Flash memory at global address 0x3_FF0C during the reset sequence, it can be changed
by the user. The P-Flash protection scheme can be used by applications requiring reprogramming in single
chip mode while providing as much protection as possible if reprogramming is not required.
2
FPLDIS
Flash Protection Lower Address Range Disable — The FPLDIS bit determines whether there is a
protected/unprotected area in a specific region of the P-Flash memory beginning with global address 0x3_8000.
0 Protection/Unprotection enabled
1 Protection/Unprotection disabled
1–0
FPLS[1:0]
Flash Protection Lower Address Size — The FPLS bits determine the size of the protected/unprotected area
in P-Flash memory as shown in Table 28-20. The FPLS bits can only be written to while the FPLDIS bit is set.
Table 28-18. P-Flash Protection Function
FPOPEN FPHDIS FPLDIS Function1
1For range sizes, refer to Table 28-19 and Table 28-20.
1 1 1 No P-Flash Protection
1 1 0 Protected Low Range
1 0 1 Protected High Range
1 0 0 Protected High and Low Ranges
0 1 1 Full P-Flash Memory Protected
0 1 0 Unprotected Low Range
0 0 1 Unprotected High Range
0 0 0 Unprotected High and Low Ranges
Table 28-19. P-Flash Protection Higher Address Range
FPHS[1:0] Global Address Range Protected Size
00 0x3_F800–0x3_FFFF 2 Kbytes
01 0x3_F000–0x3_FFFF 4 Kbytes
10 0x3_E000–0x3_FFFF 8 Kbytes
11 0x3_C000–0x3_FFFF 16 Kbytes
Table 28-20. P-Flash Protection Lower Address Range
FPLS[1:0] Global Address Range Protected Size
00 0x3_8000–0x3_83FF 1 Kbyte
01 0x3_8000–0x3_87FF 2 Kbytes
10 0x3_8000–0x3_8FFF 4 Kbytes
11 0x3_8000–0x3_9FFF 8 Kbytes
Table 28-17. FPROT Field Descriptions (continued)
Field Description
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1038 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 28-14. P-Flash Protection Scenarios
7654
FPHS[1:0] FPLS[1:0]
3210
FPHS[1:0] FPLS[1:0]
FPHDIS = 1
FPLDIS = 1
FPHDIS = 1
FPLDIS = 0
FPHDIS = 0
FPLDIS = 1
FPHDIS = 0
FPLDIS = 0
Scenario
Scenario
Unprotected region Protected region with size
Protected region Protected region with size
defined by FPLS
defined by FPHSnot defined by FPLS, FPHS
0x3_8000
0x3_FFFF
0x3_8000
0x3_FFFF
FLASH START
FLASH START
FPOPEN = 1FPOPEN = 0
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1039
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.3.2.9.1 P-Flash Protection Restrictions
The general guideline is that P-Flash protection can only be added and not removed. Table 28-21 specifies
all valid transitions between P-Flash protection scenarios. Any attempt to write an invalid scenario to the
FPROT register will be ignored. The contents of the FPROT register reflect the active protection scenario.
See the FPHS and FPLS bit descriptions for additional restrictions.
28.3.2.10 EEPROM Protection Register (EEPROT)
The EEPROT register defines which EEPROM sectors are protected against program and erase operations.
The (unreserved) bits of the EEPROT register are writable with the restriction that protection can be added
but not removed. Writes must increase the DPS value and the DPOPEN bit can only be written from 1
(protection disabled) to 0 (protection enabled). If the DPOPEN bit is set, the state of the DPS bits is
irrelevant.
During the reset sequence, fields DPOPEN and DPS of the EEPROT register are loaded with the contents
of the EEPROM protection byte in the Flash configuration field at global address 0x3_FF0D located in
Table 28-21. P-Flash Protection Scenario Transitions
From
Protection
Scenario
To Protection Scenario1
1Allowed transitions marked with X, see Figure 28-14 for a definition of the scenarios.
01234567
0XXXX
1XX
2XX
3X
4XX
5XXXX
6XXXX
7XXXXXXXX
Offset Module Base + 0x0009
76543210
RDPOPEN DPS[6:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
Figure 28-15. EEPROM Protection Register (EEPROT)
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1040 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
P-Flash memory (see Table 28-4) as indicated by reset condition F in Table 28-23. To change the
EEPROM protection that will be loaded during the reset sequence, the P-Flash sector containing the
EEPROM protection byte must be unprotected, then the EEPROM protection byte must be programmed.
If a double bit fault is detected while reading the P-Flash phrase containing the EEPROM protection byte
during the reset sequence, the DPOPEN bit will be cleared and DPS bits will be set to leave the EEPROM
memory fully protected.
Trying to alter data in any protected area in the EEPROM memory will result in a protection violation error
and the FPVIOL bit will be set in the FSTAT register. Block erase of the EEPROM memory is not possible
if any of the EEPROM sectors are protected.
Table 28-22. EEPROT Field Descriptions
Field Description
7
DPOPEN
EEPROM Protection Control
0 Enables EEPROM memory protection from program and erase with protected address range defined by DPS
bits
1 Disables EEPROM memory protection from program and erase
6–0
DPS[6:0]
EEPROM Protection Size — The DPS[6:0] bits determine the size of the protected area in the EEPROM
memory, this size increase in step of 32 bytes, as shown in Table 28-23 .
Table 28-23. EEPROM Protection Address Range
DPS[6:0] Global Address Range Protected Size
0000000 0x0_0400 – 0x0_041F 32 bytes
0000001 0x0_0400 – 0x0_043F 64 bytes
0000010 0x0_0400 – 0x0_045F 96 bytes
0000011 0x0_0400 – 0x0_047F 128 bytes
0000100 0x0_0400 – 0x0_049F 160 bytes
0000101 0x0_0400 – 0x0_04BF 192 bytes
The Protection Size goes on enlarging in step of 32 bytes, for each DPS value
increasing of one.
.
.
.
1111111 0x0_0400 – 0x0_13FF 4,096 bytes
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1041
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.3.2.11 Flash Common Command Object Register (FCCOB)
The FCCOB is an array of six words addressed via the CCOBIX index found in the FCCOBIX register.
Byte wide reads and writes are allowed to the FCCOB register.
28.3.2.11.1 FCCOB - NVM Command Mode
NVM command mode uses the indexed FCCOB register to provide a command code and its relevant
parameters to the Memory Controller. The user first sets up all required FCCOB fields and then initiates
the command’s execution by writing a 1 to the CCIF bit in the FSTAT register (a 1 written by the user clears
the CCIF command completion flag to 0). When the user clears the CCIF bit in the FSTAT register all
FCCOB parameter fields are locked and cannot be changed by the user until the command completes (as
evidenced by the Memory Controller returning CCIF to 1). Some commands return information to the
FCCOB register array.
The generic format for the FCCOB parameter fields in NVM command mode is shown in Table 28-24. The
return values are available for reading after the CCIF flag in the FSTAT register has been returned to 1 by
the Memory Controller. Writes to the unimplemented parameter fields (CCOBIX = 110 and CCOBIX =
111) are ignored with reads from these fields returning 0x0000.
Table 28-24 shows the generic Flash command format. The high byte of the first word in the CCOB array
contains the command code, followed by the parameters for this specific Flash command. For details on
the FCCOB settings required by each command, see the Flash command descriptions in Section 28.4.6.
Offset Module Base + 0x000A
76543210
RCCOB[15:8]
W
Reset 00000000
Figure 28-16. Flash Common Command Object High Register (FCCOBHI)
Offset Module Base + 0x000B
76543210
RCCOB[7:0]
W
Reset 00000000
Figure 28-17. Flash Common Command Object Low Register (FCCOBLO)
Table 28-24. FCCOB - NVM Command Mode (Typical Usage)
CCOBIX[2:0] Byte FCCOB Parameter Fields (NVM Command Mode)
000 HI FCMD[7:0] defining Flash command
LO 6’h0, Global address [17:16]
001 HI Global address [15:8]
LO Global address [7:0]
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1042 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.3.2.12 Flash Reserved1 Register (FRSV1)
This Flash register is reserved for factory testing.
All bits in the FRSV1 register read 0 and are not writable.
28.3.2.13 Flash Reserved2 Register (FRSV2)
This Flash register is reserved for factory testing.
All bits in the FRSV2 register read 0 and are not writable.
28.3.2.14 Flash Reserved3 Register (FRSV3)
This Flash register is reserved for factory testing.
010 HI Data 0 [15:8]
LO Data 0 [7:0]
011 HI Data 1 [15:8]
LO Data 1 [7:0]
100 HI Data 2 [15:8]
LO Data 2 [7:0]
101 HI Data 3 [15:8]
LO Data 3 [7:0]
Offset Module Base + 0x000C
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 28-18. Flash Reserved1 Register (FRSV1)
Offset Module Base + 0x000D
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 28-19. Flash Reserved2 Register (FRSV2)
Table 28-24. FCCOB - NVM Command Mode (Typical Usage)
CCOBIX[2:0] Byte FCCOB Parameter Fields (NVM Command Mode)
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1043
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FRSV3 register read 0 and are not writable.
28.3.2.15 Flash Reserved4 Register (FRSV4)
This Flash register is reserved for factory testing.
All bits in the FRSV4 register read 0 and are not writable.
28.3.2.16 Flash Option Register (FOPT)
The FOPT register is the Flash option register.
All bits in the FOPT register are readable but are not writable.
During the reset sequence, the FOPT register is loaded from the Flash nonvolatile byte in the Flash
configuration field at global address 0x3_FF0E located in P-Flash memory (see Table 28-4) as indicated
by reset condition F in Figure 28-22. If a double bit fault is detected while reading the P-Flash phrase
containing the Flash nonvolatile byte during the reset sequence, all bits in the FOPT register will be set.
Offset Module Base + 0x000E
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 28-20. Flash Reserved3 Register (FRSV3)
Offset Module Base + 0x000F
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 28-21. Flash Reserved4 Register (FRSV4)
Offset Module Base + 0x0010
76543210
R NV[7:0]
W
Reset F1
1Loaded from IFR Flash configuration field, during reset sequence.
F1F1F1F1F1F1F1
= Unimplemented or Reserved
Figure 28-22. Flash Option Register (FOPT)
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1044 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.3.2.17 Flash Reserved5 Register (FRSV5)
This Flash register is reserved for factory testing.
All bits in the FRSV5 register read 0 and are not writable.
28.3.2.18 Flash Reserved6 Register (FRSV6)
This Flash register is reserved for factory testing.
All bits in the FRSV6 register read 0 and are not writable.
28.3.2.19 Flash Reserved7 Register (FRSV7)
This Flash register is reserved for factory testing.
Table 28-25. FOPT Field Descriptions
Field Description
7–0
NV[7:0]
Nonvolatile Bits — The NV[7:0] bits are available as nonvolatile bits. Refer to the device user guide for proper
use of the NV bits.
Offset Module Base + 0x0011
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 28-23. Flash Reserved5 Register (FRSV5)
Offset Module Base + 0x0012
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 28-24. Flash Reserved6 Register (FRSV6)
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1045
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
All bits in the FRSV7 register read 0 and are not writable.
28.4 Functional Description
28.4.1 Modes of Operation
The FTMRG240K2 module provides the modes of operation normal and special . The operating mode is
determined by module-level inputs and affects the FCLKDIV, FCNFG, and EEPROT registers (see
Table 28-27).
28.4.2 IFR Version ID Word
The version ID word is stored in the IFR at address 0x0_40B6. The contents of the word are defined in
Table 28-26.
• VERNUM: Version number. The first version is number 0b_0001 with both 0b_0000 and 0b_1111
meaning ‘none’.
Offset Module Base + 0x0013
76543210
R00000000
W
Reset 00000000
= Unimplemented or Reserved
Figure 28-25. Flash Reserved7 Register (FRSV7)
Table 28-26. IFR Version ID Fields
[15:4] [3:0]
Reserved VERNUM
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1046 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.4.3 Internal NVM resource (NVMRES)
IFR is an internal NVM resource readable by CPU , when NVMRES is active. The IFR fields are shown
in Table 28-5.
The NVMRES global address map is shown in Table 28-6.
For FTMRG240K2 the NVMRES address area is shared with 16K space of P-Flash area, as shown in
Figure 28-2.
28.4.4 Flash Command Operations
Flash command operations are used to modify Flash memory contents.
The next sections describe:
• How to write the FCLKDIV register that is used to generate a time base (FCLK) derived from
BUSCLK for Flash program and erase command operations
• The command write sequence used to set Flash command parameters and launch execution
• Valid Flash commands available for execution, according to MCU functional mode and MCU
security state.
28.4.4.1 Writing the FCLKDIV Register
Prior to issuing any Flash program or erase command after a reset, the user is required to write the
FCLKDIV register to divide BUSCLK down to a target FCLK of 1 MHz. Table 28-8 shows recommended
values for the FDIV field based on BUSCLK frequency.
NOTE
Programming or erasing the Flash memory cannot be performed if the bus
clock runs at less than 0.8 MHz. Setting FDIV too high can destroy the Flash
memory due to overstress. Setting FDIV too low can result in incomplete
programming or erasure of the Flash memory cells.
When the FCLKDIV register is written, the FDIVLD bit is set automatically. If the FDIVLD bit is 0, the
FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written,
any Flash program or erase command loaded during a command write sequence will not execute and the
ACCERR bit in the FSTAT register will set.
28.4.4.2 Command Write Sequence
The Memory Controller will launch all valid Flash commands entered using a command write sequence.
Before launching a command, the ACCERR and FPVIOL bits in the FSTAT register must be clear (see
Section 28.3.2.7) and the CCIF flag should be tested to determine the status of the current command write
sequence. If CCIF is 0, the previous command write sequence is still active, a new command write
sequence cannot be started, and all writes to the FCCOB register are ignored.
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1047
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.4.4.2.1 Define FCCOB Contents
The FCCOB parameter fields must be loaded with all required parameters for the Flash command being
executed. Access to the FCCOB parameter fields is controlled via the CCOBIX bits in the FCCOBIX
register (see Section 28.3.2.3).
The contents of the FCCOB parameter fields are transferred to the Memory Controller when the user clears
the CCIF command completion flag in the FSTAT register (writing 1 clears the CCIF to 0). The CCIF flag
will remain clear until the Flash command has completed. Upon completion, the Memory Controller will
return CCIF to 1 and the FCCOB register will be used to communicate any results. The flow for a generic
command write sequence is shown in Figure 28-26.
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1048 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure 28-26. Generic Flash Command Write Sequence Flowchart
Write to FCCOBIX register
Write: FSTAT register (to launch command)
Clear CCIF 0x80
Clear ACCERR/FPVIOL 0x30
Write: FSTAT register
yes
no
Access Error and
Protection Violation
Read: FSTAT register
START
Check
FCCOB
ACCERR/
FPVIOL
Set?
EXIT
Write: FCLKDIV register
Read: FCLKDIV register
yes
no
FDIV
Correct?
no
Bit Polling for
Command Completion
Check
yes
CCIF Set?
to identify specific command
parameter to load.
Write to FCCOB register
to load required command parameter.
yes
no
More
Parameters?
Availability Check
Results from previous Command
Note: FCLKDIV must be
set after each reset
Read: FSTAT register
no
yes
CCIF
Set?
no
yes
CCIF
Set?
Clock Divider
Value Check Read: FSTAT register
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1049
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.4.4.3 Valid Flash Module Commands
Table 28-27 present the valid Flash commands, as enabled by the combination of the functional MCU
mode (Normal SingleChip NS, Special Singlechip SS) with the MCU security state (Unsecured, Secured).
Special Singlechip mode is selected by input mmc_ss_mode_ts2 asserted. MCU Secured state is selected
by input mmc_secure input asserted.
+
28.4.4.4 P-Flash Commands
Table 28-28 summarizes the valid P-Flash commands along with the effects of the commands on the
P-Flash block and other resources within the Flash module.
Table 28-27. Flash Commands by Mode and Security State
FCMD Command
Unsecured Secured
NS1
1Unsecured Normal Single Chip mode
SS2
2Unsecured Special Single Chip mode.
NS3
3Secured Normal Single Chip mode.
SS4
4Secured Special Single Chip mode.
0x01 Erase Verify All Blocks ∗∗∗∗
0x02 Erase Verify Block ∗∗∗∗
0x03 Erase Verify P-Flash Section ∗∗∗
0x04 Read Once ∗∗∗
0x06 Program P-Flash ∗∗∗
0x07 Program Once ∗∗∗
0x08 Erase All Blocks ∗∗
0x09 Erase Flash Block ∗∗∗
0x0A Erase P-Flash Sector ∗∗∗
0x0B Unsecure Flash ∗∗
0x0C Verify Backdoor Access Key ∗∗
0x0D Set User Margin Level ∗∗∗
0x0E Set Field Margin Level ∗
0x10 Erase Verify EEPROM Section ∗∗∗
0x11 Program EEPROM ∗∗∗
0x12 Erase EEPROM Sector ∗∗∗
Table 28-28. P-Flash Commands
FCMD Command Function on P-Flash Memory
0x01 Erase Verify All
Blocks
Verify that all P-Flash (and EEPROM) blocks are erased.
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1050 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.4.4.5 EEPROM Commands
Table 28-29 summarizes the valid EEPROM commands along with the effects of the commands on the
EEPROM block.
0x02 Erase Verify Block Verify that a P-Flash block is erased.
0x03 Erase Verify
P-Flash Section
Verify that a given number of words starting at the address provided are erased.
0x04 Read Once Read a dedicated 64 byte field in the nonvolatile information register in P-Flash block that
was previously programmed using the Program Once command.
0x06 Program P-Flash Program a phrase in a P-Flash block.
0x07 Program Once Program a dedicated 64 byte field in the nonvolatile information register in P-Flash block
that is allowed to be programmed only once.
0x08 Erase All Blocks
Erase all P-Flash (and EEPROM) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN
bits in the FPROT register and the DPOPEN bit in the EEPROT register are set prior to
launching the command.
0x09 Erase Flash Block
Erase a P-Flash (or EEPROM) block.
An erase of the full P-Flash block is only possible when FPLDIS, FPHDIS and FPOPEN
bits in the FPROT register are set prior to launching the command.
0x0A Erase P-Flash
Sector
Erase all bytes in a P-Flash sector.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all P-Flash (and EEPROM)
blocks and verifying that all P-Flash (and EEPROM) blocks are erased.
0x0C Verify Backdoor
Access Key
Supports a method of releasing MCU security by verifying a set of security keys.
0x0D Set User Margin
Level
Specifies a user margin read level for all P-Flash blocks.
0x0E Set Field Margin
Level
Specifies a field margin read level for all P-Flash blocks (special modes only).
Table 28-29. EEPROM Commands
FCMD Command Function on EEPROM Memory
0x01 Erase Verify All
Blocks
Verify that all EEPROM (and P-Flash) blocks are erased.
0x02 Erase Verify Block Verify that the EEPROM block is erased.
Table 28-28. P-Flash Commands
FCMD Command Function on P-Flash Memory
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1051
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.4.5 Allowed Simultaneous P-Flash and EEPROM Operations
Only the operations marked ‘OK’ in Table 28-30 are permitted to be run simultaneously on the Program
Flash and EEPROM blocks. Some operations cannot be executed simultaneously because certain hardware
resources are shared by the two memories. The priority has been placed on permitting Program Flash reads
while program and erase operations execute on the EEPROM, providing read (P-Flash) while write
(EEPROM) functionality.
0x08 Erase All Blocks
Erase all EEPROM (and P-Flash) blocks.
An erase of all Flash blocks is only possible when the FPLDIS, FPHDIS, and FPOPEN
bits in the FPROT register and the DPOPEN bit in the EEPROT register are set prior to
launching the command.
0x09 Erase Flash Block
Erase a EEPROM (or P-Flash) block.
An erase of the full EEPROM block is only possible when DPOPEN bit in the EEPROT
register is set prior to launching the command.
0x0B Unsecure Flash Supports a method of releasing MCU security by erasing all EEPROM (and P-Flash)
blocks and verifying that all EEPROM (and P-Flash) blocks are erased.
0x0D Set User Margin
Level
Specifies a user margin read level for the EEPROM block.
0x0E Set Field Margin
Level
Specifies a field margin read level for the EEPROM block (special modes only).
0x10 Erase Verify
EEPROM Section
Verify that a given number of words starting at the address provided are erased.
0x11 Program
EEPROM
Program up to four words in the EEPROM block.
0x12 Erase EEPROM
Sector
Erase all bytes in a sector of the EEPROM block.
Table 28-30. Allowed P-Flash and EEPROM Simultaneous Operations
EEPROM
Program Flash Read Margin
Read1Program Sector
Erase
Mass
Erase2
Read OK OK OK
Margin Read1
1A ‘Margin Read’ is any read after executing the margin setting commands
‘Set User Margin Level’ or ‘Set Field Margin Level’ with anything but the
‘normal’ level specified. See the Note on margin settings in Section 28.4.6.12
and Section 28.4.6.13.
Program
Sector Erase
Mass Erase2
2The ‘Mass Erase’ operations are commands ‘Erase All Blocks’ and ‘Erase
Flash Block’
OK
Table 28-29. EEPROM Commands
FCMD Command Function on EEPROM Memory
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1052 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.4.6 Flash Command Description
This section provides details of all available Flash commands launched by a command write sequence. The
ACCERR bit in the FSTAT register will be set during the command write sequence if any of the following
illegal steps are performed, causing the command not to be processed by the Memory Controller:
• Starting any command write sequence that programs or erases Flash memory before initializing the
FCLKDIV register
• Writing an invalid command as part of the command write sequence
• For additional possible errors, refer to the error handling table provided for each command
If a Flash block is read during execution of an algorithm (CCIF = 0) on that same block, the read operation
will return invalid data if both flags SFDIF and DFDIF are set. If the SFDIF or DFDIF flags were not
previously set when the invalid read operation occurred, both the SFDIF and DFDIF flags will be set.
If the ACCERR or FPVIOL bits are set in the FSTAT register, the user must clear these bits before starting
any command write sequence (see Section 28.3.2.7).
CAUTION
A Flash word or phrase must be in the erased state before being
programmed. Cumulative programming of bits within a Flash word or
phrase is not allowed.
28.4.6.1 Erase Verify All Blocks Command
The Erase Verify All Blocks command will verify that all P-Flash and EEPROM blocks have been erased.
Upon clearing CCIF to launch the Erase Verify All Blocks command, the Memory Controller will verify
that the entire Flash memory space is erased. The CCIF flag will set after the Erase Verify All Blocks
operation has completed. If all blocks are not erased, it means blank check failed, both MGSTAT bits will
be set.
Table 28-31. Erase Verify All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x01 Not required
Table 28-32. Erase Verify All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the reador if blank check failed .
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1053
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.4.6.2 Erase Verify Block Command
The Erase Verify Block command allows the user to verify that an entire P-Flash or EEPROM block has
been erased. The FCCOB FlashBlockSelectionCode[1:0]bits determine which block must be verified.
Upon clearing CCIF to launch the Erase Verify Block command, the Memory Controller will verify that
the selected P-Flash or EEPROM block is erased. The CCIF flag will set after the Erase Verify Block
operation has completed.If the block is not erased, it means blank check failed, both MGSTAT bits will be
set.
28.4.6.3 Erase Verify P-Flash Section Command
The Erase Verify P-Flash Section command will verify that a section of code in the P-Flash memory is
erased. The Erase Verify P-Flash Section command defines the starting point of the code to be verified and
the number of phrases.
Table 28-33. Erase Verify Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x02
Flash block
selection code [1:0]. See
Table 28-34
Table 28-34. Flash block selection code description
Selection code[1:0] Flash block to be verified
00 EEPROM
01 P-Flash
10 P-Flash
11 P-Flash
Table 28-35. Erase Verify Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch.
FPVIOL None.
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read1 or if
blank check failed.
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1054 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Erase Verify P-Flash Section command, the Memory Controller will
verify the selected section of Flash memory is erased. The CCIF flag will set after the Erase Verify P-Flash
Section operation has completed. If the section is not erased, it means blank check failed, both MGSTAT
bits will be set.
28.4.6.4 Read Once Command
The Read Once command provides read access to a reserved 64 byte field (8 phrases) located in the
nonvolatile information register of P-Flash. The Read Once field is programmed using the Program Once
command described in Section 28.4.6.6. The Read Once command must not be executed from the Flash
block containing the Program Once reserved field to avoid code runaway.
Table 28-36. Erase Verify P-Flash Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x03 Global address [17:16] of
a P-Flash block
001 Global address [15:0] of the first phrase to be verified
010 Number of phrases to be verified
Table 28-37. Erase Verify P-Flash Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 28-27)
Set if an invalid global address [17:0] is supplied see Table 28-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
Set if the requested section crosses a the P-Flash address boundary
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
Table 28-38. Read Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x04 Not Required
001 Read Once phrase index (0x0000 - 0x0007)
010 Read Once word 0 value
011 Read Once word 1 value
100 Read Once word 2 value
101 Read Once word 3 value
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1055
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Read Once command, a Read Once phrase is fetched and stored in the
FCCOB indexed register. The CCIF flag will set after the Read Once operation has completed. Valid
phrase index values for the Read Once command range from 0x0000 to 0x0007. During execution of the
Read Once command, any attempt to read addresses within P-Flash block will return invalid data.
8
28.4.6.5 Program P-Flash Command
The Program P-Flash operation will program a previously erased phrase in the P-Flash memory using an
embedded algorithm.
CAUTION
A P-Flash phrase must be in the erased state before being programmed.
Cumulative programming of bits within a Flash phrase is not allowed.
Upon clearing CCIF to launch the Program P-Flash command, the Memory Controller will program the
data words to the supplied global address and will then proceed to verify the data words read back as
expected. The CCIF flag will set after the Program P-Flash operation has completed.
Table 28-39. Read Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 28-27)
Set if an invalid phrase index is supplied
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read
MGSTAT0 Set if any non-correctable errors have been encountered during the read
Table 28-40. Program P-Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x06 Global address [17:16] to
identify P-Flash block
001 Global address [15:0] of phrase location to be programmed1
1Global address [2:0] must be 000
010 Word 0 program value
011 Word 1 program value
100 Word 2 program value
101 Word 3 program value
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1056 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.4.6.6 Program Once Command
The Program Once command restricts programming to a reserved 64 byte field (8 phrases) in the
nonvolatile information register located in P-Flash. The Program Once reserved field can be read using the
Read Once command as described in Section 28.4.6.4. The Program Once command must only be issued
once since the nonvolatile information register in P-Flash cannot be erased. The Program Once command
must not be executed from the Flash block containing the Program Once reserved field to avoid code
runaway.
Upon clearing CCIF to launch the Program Once command, the Memory Controller first verifies that the
selected phrase is erased. If erased, then the selected phrase will be programmed and then verified with
read back. The CCIF flag will remain clear, setting only after the Program Once operation has completed.
The reserved nonvolatile information register accessed by the Program Once command cannot be erased
and any attempt to program one of these phrases a second time will not be allowed. Valid phrase index
values for the Program Once command range from 0x0000 to 0x0007. During execution of the Program
Once command, any attempt to read addresses within P-Flash will return invalid data.
Table 28-41. Program P-Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 28-27)
Set if an invalid global address [17:0] is supplied see Table 28-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the global address [17:0] points to a protected area
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 28-42. Program Once Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x07 Not Required
001 Program Once phrase index (0x0000 - 0x0007)
010 Program Once word 0 value
011 Program Once word 1 value
100 Program Once word 2 value
101 Program Once word 3 value
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1057
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.4.6.7 Erase All Blocks Command
The Erase All Blocks operation will erase the entire P-Flash and EEPROM memory space.
Upon clearing CCIF to launch the Erase All Blocks command, the Memory Controller will erase the entire
Flash memory space and verify that it is erased. If the Memory Controller verifies that the entire Flash
memory space was properly erased, security will be released. During the execution of this command
(CCIF=0) the user must not write to any Flash module register. The CCIF flag will set after the Erase All
Blocks operation has completed.
28.4.6.8 Erase Flash Block Command
The Erase Flash Block operation will erase all addresses in a P-Flash or EEPROM block.
Table 28-43. Program Once Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 101 at command launch
Set if command not available in current mode (see Table 28-27)
Set if an invalid phrase index is supplied
Set if the requested phrase has already been programmed1
1If a Program Once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the Program Once command will
be allowed to execute again on that same phrase.
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 28-44. Erase All Blocks Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x08 Not required
Table 28-45. Erase All Blocks Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 28-27)
FPVIOL Set if any area of the P-Flash or EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1058 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Erase Flash Block command, the Memory Controller will erase the
selected Flash block and verify that it is erased. The CCIF flag will set after the Erase Flash Block
operation has completed.
28.4.6.9 Erase P-Flash Sector Command
The Erase P-Flash Sector operation will erase all addresses in a P-Flash sector.
Upon clearing CCIF to launch the Erase P-Flash Sector command, the Memory Controller will erase the
selected Flash sector and then verify that it is erased. The CCIF flag will be set after the Erase P-Flash
Sector operation has completed.
Table 28-46. Erase Flash Block Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x09 Global address [17:16] to
identify Flash block
001 Global address [15:0] in Flash block to be erased
Table 28-47. Erase Flash Block Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 28-27)
Set if an invalid global address [17:16] is supplied
Set if the supplied P-Flash address is not phrase-aligned or if the EEPROM
address is not word-aligned
FPVIOL Set if an area of the selected Flash block is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 28-48. Erase P-Flash Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0A Global address [17:16] to identify
P-Flash block to be erased
001 Global address [15:0] anywhere within the sector to be erased.
Refer to Section 28.1.2.1 for the P-Flash sector size.
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1059
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.4.6.10 Unsecure Flash Command
The Unsecure Flash command will erase the entire P-Flash and EEPROM memory space and, if the erase
is successful, will release security.
Upon clearing CCIF to launch the Unsecure Flash command, the Memory Controller will erase the entire
P-Flash and EEPROM memory space and verify that it is erased. If the Memory Controller verifies that
the entire Flash memory space was properly erased, security will be released. If the erase verify is not
successful, the Unsecure Flash operation sets MGSTAT1 and terminates without changing the security
state. During the execution of this command (CCIF=0) the user must not write to any Flash module
register. The CCIF flag is set after the Unsecure Flash operation has completed.
28.4.6.11 Verify Backdoor Access Key Command
The Verify Backdoor Access Key command will only execute if it is enabled by the KEYEN bits in the
FSEC register (see Table 28-10). The Verify Backdoor Access Key command releases security if
user-supplied keys match those stored in the Flash security bytes of the Flash configuration field (see
Table 28-49. Erase P-Flash Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 28-27)
Set if an invalid global address [17:16] is supplied see Table 28-3)
Set if a misaligned phrase address is supplied (global address [2:0] != 000)
FPVIOL Set if the selected P-Flash sector is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 28-50. Unsecure Flash Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0B Not required
Table 28-51. Unsecure Flash Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR Set if CCOBIX[2:0] != 000 at command launch
Set if command not available in current mode (see Table 28-27)
FPVIOL Set if any area of the P-Flash or EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1060 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table 28-4). The Verify Backdoor Access Key command must not be executed from the Flash block
containing the backdoor comparison key to avoid code runaway.
Upon clearing CCIF to launch the Verify Backdoor Access Key command, the Memory Controller will
check the FSEC KEYEN bits to verify that this command is enabled. If not enabled, the Memory
Controller sets the ACCERR bit in the FSTAT register and terminates. If the command is enabled, the
Memory Controller compares the key provided in FCCOB to the backdoor comparison key in the Flash
configuration field with Key 0 compared to 0x3_FF00, etc. If the backdoor keys match, security will be
released. If the backdoor keys do not match, security is not released and all future attempts to execute the
Verify Backdoor Access Key command are aborted (set ACCERR) until a reset occurs. The CCIF flag is
set after the Verify Backdoor Access Key operation has completed.
28.4.6.12 Set User Margin Level Command
The Set User Margin Level command causes the Memory Controller to set the margin level for future read
operations of the P-Flash or EEPROM block.
Table 28-52. Verify Backdoor Access Key Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0C Not required
001 Key 0
010 Key 1
011 Key 2
100 Key 3
Table 28-53. Verify Backdoor Access Key Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 100 at command launch
Set if an incorrect backdoor key is supplied
Set if backdoor key access has not been enabled (KEYEN[1:0] != 10, see
Section 28.3.2.2)
Set if the backdoor key has mismatched since the last reset
FPVIOL None
MGSTAT1 None
MGSTAT0 None
Table 28-54. Set User Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0D Flash block selection code [1:0]. See
Table 28-34
001 Margin level setting.
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1061
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Set User Margin Level command, the Memory Controller will set the
user margin level for the targeted block and then set the CCIF flag.
NOTE
When the EEPROM block is targeted, the EEPROM user margin levels are
applied only to the EEPROM reads. However, when the P-Flash block is
targeted, the P-Flash user margin levels are applied to both P-Flash and
EEPROM reads. It is not possible to apply user margin levels to the P-Flash
block only.
Valid margin level settings for the Set User Margin Level command are defined in Table 28-55.
NOTE
User margin levels can be used to check that Flash memory contents have
adequate margin for normal level read operations. If unexpected results are
encountered when checking Flash memory contents at user margin levels, a
potential loss of information has been detected.
28.4.6.13 Set Field Margin Level Command
The Set Field Margin Level command, valid in special modes only, causes the Memory Controller to set
the margin level specified for future read operations of the P-Flash or EEPROM block.
Table 28-55. Valid Set User Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level1
1Read margin to the erased state
0x0002 User Margin-0 Level2
2Read margin to the programmed state
Table 28-56. Set User Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch.
Set if command not available in current mode (see Table 28-27).
Set if an invalid margin level setting is supplied.
FPVIOL None
MGSTAT1 None
MGSTAT0 None
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1062 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Set Field Margin Level command, the Memory Controller will set the
field margin level for the targeted block and then set the CCIF flag.
NOTE
When the EEPROM block is targeted, the EEPROM field margin levels are
applied only to the EEPROM reads. However, when the P-Flash block is
targeted, the P-Flash field margin levels are applied to both P-Flash and
EEPROM reads. It is not possible to apply field margin levels to the P-Flash
block only.
Valid margin level settings for the Set Field Margin Level command are defined in Table 28-58.
Table 28-57. Set Field Margin Level Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x0E Flash block selection code [1:0]. See
Table 28-34
001 Margin level setting.
Table 28-58. Valid Set Field Margin Level Settings
CCOB
(CCOBIX=001) Level Description
0x0000 Return to Normal Level
0x0001 User Margin-1 Level1
1Read margin to the erased state
0x0002 User Margin-0 Level2
2Read margin to the programmed state
0x0003 Field Margin-1 Level1
0x0004 Field Margin-0 Level2
Table 28-59. Set Field Margin Level Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch.
Set if command not available in current mode (see Table 28-27).
Set if an invalid margin level setting is supplied.
FPVIOL None
MGSTAT1 None
MGSTAT0 None
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1063
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
CAUTION
Field margin levels must only be used during verify of the initial factory
programming.
NOTE
Field margin levels can be used to check that Flash memory contents have
adequate margin for data retention at the normal level setting. If unexpected
results are encountered when checking Flash memory contents at field
margin levels, the Flash memory contents should be erased and
reprogrammed.
28.4.6.14 Erase Verify EEPROM Section Command
The Erase Verify EEPROM Section command will verify that a section of code in the EEPROM is erased.
The Erase Verify EEPROM Section command defines the starting point of the data to be verified and the
number of words.
Upon clearing CCIF to launch the Erase Verify EEPROM Section command, the Memory Controller will
verify the selected section of EEPROM memory is erased. The CCIF flag will set after the Erase Verify
EEPROM Section operation has completed. If the section is not erased, it means blank check failed, both
MGSTAT bits will be set.
Table 28-60. Erase Verify EEPROM Section Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x10
Global address [17:16] to
identify the EEPROM
block
001 Global address [15:0] of the first word to be verified
010 Number of words to be verified
Table 28-61. Erase Verify EEPROM Section Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Set if command not available in current mode (see Table 28-27)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested section breaches the end of the EEPROM block
FPVIOL None
MGSTAT1 Set if any errors have been encountered during the read or if blank check failed.
MGSTAT0 Set if any non-correctable errors have been encountered during the read or if
blank check failed.
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1064 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.4.6.15 Program EEPROM Command
The Program EEPROM operation programs one to four previously erased words in the EEPROM block.
The Program EEPROM operation will confirm that the targeted location(s) were successfully programmed
upon completion.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
Upon clearing CCIF to launch the Program EEPROM command, the user-supplied words will be
transferred to the Memory Controller and be programmed if the area is unprotected. The CCOBIX index
value at Program EEPROM command launch determines how many words will be programmed in the
EEPROM block. The CCIF flag is set when the operation has completed.
28.4.6.16 Erase EEPROM Sector Command
The Erase EEPROM Sector operation will erase all addresses in a sector of the EEPROM block.
Table 28-62. Program EEPROM Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x11 Global address [17:16] to
identify the EEPROM block
001 Global address [15:0] of word to be programmed
010 Word 0 program value
011 Word 1 program value, if desired
100 Word 2 program value, if desired
101 Word 3 program value, if desired
Table 28-63. Program EEPROM Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] < 010 at command launch
Set if CCOBIX[2:0] > 101 at command launch
Set if command not available in current mode (see Table 28-27)
Set if an invalid global address [17:0] is supplied
Set if a misaligned word address is supplied (global address [0] != 0)
Set if the requested group of words breaches the end of the EEPROM block
FPVIOL Set if the selected area of the EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1065
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Upon clearing CCIF to launch the Erase EEPROM Sector command, the Memory Controller will erase the
selected Flash sector and verify that it is erased. The CCIF flag will set after the Erase EEPROM Sector
operation has completed.
28.4.7 Interrupts
The Flash module can generate an interrupt when a Flash command operation has completed or when a
Flash command operation has detected an ECC fault.
Table 28-64. Erase EEPROM Sector Command FCCOB Requirements
CCOBIX[2:0] FCCOB Parameters
000 0x12 Global address [17:16] to identify
EEPROM block
001 Global address [15:0] anywhere within the sector to be erased.
See Section 28.1.2.2 for EEPROM sector size.
Table 28-65. Erase EEPROM Sector Command Error Handling
Register Error Bit Error Condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 28-27)
Set if an invalid global address [17:0] is suppliedsee Table 28-3)
Set if a misaligned word address is supplied (global address [0] != 0)
FPVIOL Set if the selected area of the EEPROM memory is protected
MGSTAT1 Set if any errors have been encountered during the verify operation
MGSTAT0 Set if any non-correctable errors have been encountered during the verify
operation
Table 28-66. Flash Interrupt Sources
Interrupt Source Interrupt Flag Local Enable Global (CCR)
Mask
Flash Command Complete CCIF
(FSTAT register)
CCIE
(FCNFG register)
I Bit
ECC Double Bit Fault on Flash Read DFDIF
(FERSTAT register)
DFDIE
(FERCNFG register)
I Bit
ECC Single Bit Fault on Flash Read SFDIF
(FERSTAT register)
SFDIE
(FERCNFG register)
I Bit
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1066 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NOTE
Vector addresses and their relative interrupt priority are determined at the
MCU level.
28.4.7.1 Description of Flash Interrupt Operation
The Flash module uses the CCIF flag in combination with the CCIE interrupt enable bit to generate the
Flash command interrupt request. The Flash module uses the DFDIF and SFDIF flags in combination with
the DFDIE and SFDIE interrupt enable bits to generate the Flash error interrupt request. For a detailed
description of the register bits involved, refer to Section 28.3.2.5, “Flash Configuration Register
(FCNFG)”, Section 28.3.2.6, “Flash Error Configuration Register (FERCNFG)”, Section 28.3.2.7, “Flash
Status Register (FSTAT)”, and Section 28.3.2.8, “Flash Error Status Register (FERSTAT)”.
The logic used for generating the Flash module interrupts is shown in Figure 28-27.
Figure 28-27. Flash Module Interrupts Implementation
28.4.8 Wait Mode
The Flash module is not affected if the MCU enters wait mode. The Flash module can recover the MCU
from wait via the CCIF interrupt (see Section 28.4.7, “Interrupts”).
28.4.9 Stop Mode
If a Flash command is active (CCIF = 0) when the MCU requests stop mode, the current Flash operation
will be completed before the MCU is allowed to enter stop mode.
Flash Error Interrupt Request
CCIF
CCIE
DFDIF
DFDIE
SFDIF
SFDIE
Flash Command Interrupt Request
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1067
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
28.5 Security
The Flash module provides security information to the MCU. The Flash security state is defined by the
SEC bits of the FSEC register (see Table 28-11). During reset, the Flash module initializes the FSEC
register using data read from the security byte of the Flash configuration field at global address 0x3_FF0F.
The security state out of reset can be permanently changed by programming the security byte assuming
that the MCU is starting from a mode where the necessary P-Flash erase and program commands are
available and that the upper region of the P-Flash is unprotected. If the Flash security byte is successfully
programmed, its new value will take affect after the next MCU reset.
The following subsections describe these security-related subjects:
• Unsecuring the MCU using Backdoor Key Access
• Unsecuring the MCU in Special Single Chip Mode using BDM
• Mode and Security Effects on Flash Command Availability
28.5.1 Unsecuring the MCU using Backdoor Key Access
The MCU may be unsecured by using the backdoor key access feature which requires knowledge of the
contents of the backdoor keys (four 16-bit words programmed at addresses 0x3_FF00-0x3_FF07). If the
KEYEN[1:0] bits are in the enabled state (see Section 28.3.2.2), the Verify Backdoor Access Key
command (see Section 28.4.6.11) allows the user to present four prospective keys for comparison to the
keys stored in the Flash memory via the Memory Controller. If the keys presented in the Verify Backdoor
Access Key command match the backdoor keys stored in the Flash memory, the SEC bits in the FSEC
register (see Table 28-11) will be changed to unsecure the MCU. Key values of 0x0000 and 0xFFFF are
not permitted as backdoor keys. While the Verify Backdoor Access Key command is active, P-Flash
memory and EEPROM memory will not be available for read access and will return invalid data.
The user code stored in the P-Flash memory must have a method of receiving the backdoor keys from an
external stimulus. This external stimulus would typically be through one of the on-chip serial ports.
If the KEYEN[1:0] bits are in the enabled state (see Section 28.3.2.2), the MCU can be unsecured by the
backdoor key access sequence described below:
1. Follow the command sequence for the Verify Backdoor Access Key command as explained in
Section 28.4.6.11
2. If the Verify Backdoor Access Key command is successful, the MCU is unsecured and the
SEC[1:0] bits in the FSEC register are forced to the unsecure state of 10
The Verify Backdoor Access Key command is monitored by the Memory Controller and an illegal key will
prohibit future use of the Verify Backdoor Access Key command. A reset of the MCU is the only method
to re-enable the Verify Backdoor Access Key command. The security as defined in the Flash security byte
(0x3_FF0F) is not changed by using the Verify Backdoor Access Key command sequence. The backdoor
keys stored in addresses 0x3_FF00-0x3_FF07 are unaffected by the Verify Backdoor Access Key
command sequence. The Verify Backdoor Access Key command sequence has no effect on the program
and erase protections defined in the Flash protection register, FPROT.
After the backdoor keys have been correctly matched, the MCU will be unsecured. After the MCU is
unsecured, the sector containing the Flash security byte can be erased and the Flash security byte can be
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1068 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
reprogrammed to the unsecure state, if desired. In the unsecure state, the user has full control of the
contents of the backdoor keys by programming addresses 0x3_FF00-0x3_FF07 in the Flash configuration
field.
28.5.2 Unsecuring the MCU in Special Single Chip Mode using BDM
A secured MCU can be unsecured in special single chip mode by using the following method to erase the
P-Flash and EEPROM memory:
1. Reset the MCU into special single chip mode
2. Delay while the BDM executes the Erase Verify All Blocks command write sequence to check if
the P-Flash and EEPROM memories are erased
3. Send BDM commands to disable protection in the P-Flash and EEPROM memory
4. Execute the Erase All Blocks command write sequence to erase the P-Flash and EEPROM
memory. Alternatively the Unsecure Flash command can be executed, if so the steps 5 and 6 below
are skeeped.
5. After the CCIF flag sets to indicate that the Erase All Blocks operation has completed, reset the
MCU into special single chip mode
6. Delay while the BDM executes the Erase Verify All Blocks command write sequence to verify that
the P-Flash and EEPROM memory are erased
If the P-Flash and EEPROM memory are verified as erased, the MCU will be unsecured. All BDM
commands will now be enabled and the Flash security byte may be programmed to the unsecure state by
continuing with the following steps:
7. Send BDM commands to execute the Program P-Flash command write sequence to program the
Flash security byte to the unsecured state
8. Reset the MCU
28.5.3 Mode and Security Effects on Flash Command Availability
The availability of Flash module commands depends on the MCU operating mode and security state as
shown in Table 28-27.
28.6 Initialization
On each system reset the flash module executes an initialization sequence which establishes initial values
for the Flash Block Configuration Parameters, the FPROT and EEPROT protection registers, and the FOPT
and FSEC registers. The initialization routine reverts to built-in default values that leave the module in a
fully protected and secured state if errors are encountered during execution of the reset sequence. If a
double bit fault is detected during the reset sequence, both MGSTAT bits in the FSTAT register will be set.
CCIF is cleared throughout the initialization sequence. The Flash module holds off all CPU access for a
portion of the initialization sequence. Flash reads are allowed once the hold is removed. Completion of the
initialization sequence is marked by setting CCIF high which enables user commands.
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1069
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The
state of the word being programmed or the sector/block being erased is not guaranteed.
240 KByte Flash Module (S12FTMRG240K2V1)
MC9S12G Family Reference Manual, Rev.1.06
1070 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1071
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Appendix A
Electrical Characteristics
Revision History
A.1 General
This supplement contains the most accurate electrical information for the MC9S12G microcontroller
available at the time of publication.
This introduction is intended to give an overview on several common topics like power supply, current
injection etc.
Version
Number
Revision
Date Description of Changes
Rev 0.24 19-Apr-2011 • Updated Table A-11
• Updated Table A-16
• Updated Table A-17
• Updated Table A-18
• Updated Table A-19
• Updated Table A-26
• Updated Table A-29
Rev 0.25 21-Apr-2011 • Clean-up
Rev 0.26 11-May-2011 • Updated Table A-28
Rev 0.27 7-Jun-2011 • Updated Table A-11 (Num 1, 2, 3)
• Updated Table A-12 (Num 1, 2, 3)
• Updated Table A-13 (Num 1, 2, 3)
Rev 0.28 8-Jun-2011 • Updated Table A-11 (Num 1, 2, 3)
• Updated Table A-12 (Num 1, 2, 3, 4, 5, 6)
• Updated Table A-13 (Num 1, 2, 3)
Rev 0.29 4-Jul-2011 • Updated Table A-5 (Num 15-22, 29-42)
Rev 0.30 26-Jul-2011 • Updated Table A-30 (Num 3, 4)
Rev 0.31 18-Aug-2011 • Updated Table A-11 (Num 10, 12)
• Updated Table A-12 (Num 19, 20, 21, 22, 23, 24)
• Updated Table A-13 (Num 10, 11, 12)
Rev 0.32 22-Sep-2011 • Updated Table A-11 (Num 10, 12)
• Updated Table A-12 (Num 19, 20, 21, 22, 23, 24)
• Updated Table A-13 (Num 10, 11, 12)
• Added A.3.4, “ADC Temperature Sensor”
• Updated Table A-30 (Num 11)
• Updated A.15, “ADC Conversion Result Reference”
Rev 0.33 8-Nov-2011 • Updated Table A-11 (Num 1 - 12)
• Updated Table A-12 (Num 1 - 24)
• Updated Table A-13 (Num 1 12)
• Updated Table A-20 (Num 1 - 10)
• Updated Table A-30 (Num 3, 4
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1072 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.1.1 Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods. To give the
customer a better understanding the following classification is used and the parameters are tagged
accordingly in the tables where appropriate.
NOTE
This classification is shown in the column labeled “C” in the parameter
tables where appropriate.
P: Those parameters are guaranteed during production testing on each individual device.
C: Those parameters are achieved by the design characterization by measuring a statistically relevant
sample size across process variations.
T: Those parameters are achieved by design characterization on a small sample size from typical
devices under typical conditions unless otherwise noted. All values shown in the typical column
are within this category.
D: Those parameters are derived mainly from simulations.
A.1.2 Power Supply
The VDDA, VSSA pin pairs supply the A/D converter and parts of the internal voltage regulator.
The VDDX, VSSX pin pairs [3:1] supply the I/O pins.
VDDR supplies the internal voltage regulator.
The VDDF, VSS1 pin pair supplies the internal NVM logic.
All VDDX pins are internally connected by metal.
All VSSX pins are internally connected by metal.
VDDA, VDDX and VSSA, VSSX are connected by diodes for ESD protection.
NOTE
In the following context VDD35 is used for either VDDA, VDDR, and
VDDX; VSS35 is used for either VSSA and VSSX unless otherwise noted.
IDD35 denotes the sum of the currents flowing into the VDDA, VDDX and
VDDR pins.
A.1.3 Pins
There are four groups of functional pins.
A.1.3.1 I/O Pins
The I/O pins have a level in the range of 3.13V to 5.5V. This class of pins is comprised of all port I/O pins,
the analog inputs, BKGD and the RESET pins. Some functionality may be disabled.
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1073
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.1.3.2 Analog Reference
This group consists of the VRH pin.
A.1.3.3 Oscillator
The pins EXTAL, XTAL dedicated to the oscillator have a nominal 1.8V level.
A.1.3.4 TEST
This pin is used for production testing only. The TEST pin must be tied to ground in all applications.
A.1.4 Current Injection
Power supply must maintain regulation within operating VDD35 or VDD range during instantaneous and
operating maximum current conditions. If positive injection current (Vin > VDD35) is greater than IDD35,
the injection current may flow out of VDD35 and could result in external power supply going out of
regulation. Ensure external VDD35 load will shunt current greater than maximum injection current. This
will be the greatest risk when the MCU is not consuming power; e.g., if no system clock is present, or if
clock rate is very low which would reduce overall power consumption.
A.1.5 Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only. A functional operation under or outside those maxima
is not guaranteed. Stress beyond those limits may affect the reliability or cause permanent damage of the
device.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either VSS35 or VDD35).
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1074 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.1.6 ESD Protection and Latch-up Immunity
All ESD testing is in conformity with CDF-AEC-Q100 stress test qualification for automotive grade
integrated circuits. During the device qualification ESD stresses were performed for the Human Body
Model (HBM) and the Charge Device Model.
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
Table A-1. Absolute Maximum Ratings1
1Beyond absolute maximum ratings device might be damaged.
Num Rating Symbol Min Max Unit
1 I/O, regulator and analog supply voltage VDD35 –0.3 6.0 V
2 Voltage difference VDDX to VDDA ∆VDDX –6.0 0.3 V
3 Voltage difference VSSX to VSSA ∆VSSX –0.3 0.3 V
4 Digital I/O input voltage VIN –0.3 6.0 V
5 Analog reference VRH –0.3 6.0 V
6 EXTAL, XTAL VILV –0.3 2.16 V
7 Instantaneous maximum current
Single pin limit for all digital I/O pins2
2All digital I/O pins are internally clamped to VSSX and VDDX, or VSSA and VDDA.
ID–25 +25 mA
8 Instantaneous maximum current
Single pin limit for EXTAL, XTAL
IDL –25 +25 mA
9 Storage temperature range Tstg –65 155 °C
Table A-2. ESD and Latch-up Test Conditions
Model Description Symbol Value Unit
Human Body
Series Resistance R1 1500 Ω
Storage Capacitance C 100 pF
Number of Pulse per pin
positive
negative
-
-
3
3
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1075
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.1.7 Operating Conditions
This section describes the operating conditions of the device. Unless otherwise noted those conditions
apply to all the following data.
NOTE
Please refer to the temperature rating of the device (C, V, M) with regards to
the ambient temperature TA and the junction temperature TJ. For power
dissipation calculations refer to Section A.1.8, “Power Dissipation and
Thermal Characteristics”.
NOTE
Operation is guaranteed when powering down until low voltage reset
assertion.
Table A-3. ESD and Latch-Up Protection Characteristics
Num C Rating Symbol Min Max Unit
1C
Human Body Model (HBM) VHBM 2000 - V
2C
Charge Device Model (CDM) VCDM 500 - V
3C
Charge Device Model (CDM) (Corner Pins) VCDM 750 - V
Table A-4. Operating Conditions
Rating Symbol Min Typ Max Unit
I/O, regulator and analog supply voltage VDD35 3.13 5 5.5 V
Oscillator fosc 4 — 16 MHz
Bus frequency fbus 0.5 — 25 MHz
Temperature Option C
Operating ambient temperature range1
Operating junction temperature range
1Please refer to Section A.1.8, “Power Dissipation and Thermal Characteristics” for more details about the relation between
ambient temperature TA and device junction temperature TJ.
TA
TJ
–40
–40
27
—
85
105
°C
Temperature Option V
Operating ambient temperature range1
Operating junction temperature range
TA
TJ
–40
–40
27
—
105
125
°C
Temperature Option M
Operating ambient temperature range1
Operating junction temperature range
TA
TJ
–40
–40
27
—
125
150
°C
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1076 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (TJ) in °C can be
obtained from:
The total power dissipation can be calculated from:
PIO is the sum of all output currents on I/O ports associated with VDDX, whereby
TJTAPDΘJA
•()+=
TJJunction Temperature, [°C]=
TAAmbient Temperature, [°C]=
PDTotal Chip Power Dissipation, [W]=
ΘJA Package Thermal Resistance, [°C/W]=
PDPINT PIO
+=
PINT Chip Internal Power Dissipation, [W]=
PIO RDSON
i
∑IIOi
2
⋅=
RDSON
VOL
IOL
------------ for outputs driven low;=
RDSON
VDD35 VOH
–
IOH
--------------------------------------- for outputs driven high;=
PINT IDDR VDDR
⋅IDDA VDDA
⋅+=
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1077
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1078 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table A-5. Thermal Package Characteristics1
Num C Rating Symbol S12GN32,
S12GN16
S12G64,
S12G48,
S12GN48
S12G128,
S12G96
S12G240,
S12GA240,
S12G192,
S12GA192
Unit
20-pin TSSOP
1D
Thermal resistance single sided PCB,
natural convection2θJA 91 °C/W
2D
Thermal resistance single sided PCB
@ 200 ft/min3θJMA 72 °C/W
3D
Thermal resistance double sided PCB
with 2 internal planes, natural convection3θJA 58 °C/W
4D
Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min3θJMA 51 °C/W
5 D Junction to Board4θJB 29 °C/W
6 D Junction to Case5θJC 20 °C/W
7 D Junction to Package Top6ΨJT 4°C/W
32-pin LQFP
8D
Thermal resistance single sided PCB,
natural convection2θJA 81 84 °C/W
9D
Thermal resistance single sided PCB
@ 200 ft/min3θJMA 68 70 °C/W
10 D Thermal resistance double sided PCB
with 2 internal planes, natural convection3θJA 57 56 °C/W
11 D Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min3θJMA 50 49 °C/W
12 D Junction to Board4θJB 35 32 °C/W
13 D Junction to Case5θJC 25 23 °C/W
14 D Junction to Package Top6ΨJT 86 °C/W
48-pin LQFP
15 D Thermal resistance single sided PCB,
natural convection2θJA 81 80 79 75 °C/W
16 D Thermal resistance single sided PCB
@ 200 ft/min3θJMA 68 67 66 62 °C/W
17 D Thermal resistance double sided PCB
with 2 internal planes, natural convection3θJA 57 56 56 51 °C/W
18 D Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min3θJMA 50 50 49 45 °C/W
19 D Junction to Board4θJB 35 34 33 30 °C/W
20 D Junction to Case5θJC 25 24 21 19 °C/W
21 D Junction to Package Top6ΨJT 8 6 4 N/A °C/W
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1079
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
48-pin QFN
22 D Thermal resistance single sided PCB,
natural convection2θJA 82 °C/W
23 D Thermal resistance single sided PCB
@ 200 ft/min3θJMA 67 °C/W
24 D Thermal resistance double sided PCB
with 2 internal planes, natural convection3θJA 28 °C/W
25 D Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min3θJMA 23 °C/W
26 D Junction to Board4θJB 11 °C/W
27 D Junction to Case5θJC N/A °C/W
28 D Junction to Package Top6ΨJT 4°C/W
64-pin LQFP
29 D Thermal resistance single sided PCB,
natural convection2θJA 70 70 70 °C/W
30 D Thermal resistance single sided PCB
@ 200 ft/min3θJMA 59 58 58 °C/W
31 D Thermal resistance double sided PCB
with 2 internal planes, natural convection3θJA 52 52 52 °C/W
32 D Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min3θJMA 46 46 45 °C/W
33 D Junction to Board4θJB 34 34 35 °C/W
34 D Junction to Case5θJC 20 18 17 °C/W
35 D Junction to Package Top6ΨJT 5 4 N/A °C/W
100-pin LQFP
36 D Thermal resistance single sided PCB,
natural convection2θJA 61 62 °C/W
37 D Thermal resistance single sided PCB
@ 200 ft/min3θJMA 51 55 °C/W
38 D Thermal resistance double sided PCB
with 2 internal planes, natural convection3θJA 49 51 °C/W
39 D Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min3θJMA 43 47 °C/W
40 D Junction to Board4θJB 34 37 °C/W
41 D Junction to Case5θJC 16 17 °C/W
42 D Junction to Package Top6ΨJT 3 N/A °C/W
1The values for thermal resistance are achieved by package simulations
Table A-5. Thermal Package Characteristics1
Num C Rating Symbol S12GN32,
S12GN16
S12G64,
S12G48,
S12GN48
S12G128,
S12G96
S12G240,
S12GA240,
S12G192,
S12GA192
Unit
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1080 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.2 I/O Characteristics
This section describes the characteristics of all I/O pins except EXTAL, XTAL, TEST, and supply pins.
2Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.J
3Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4.Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured in
simulation on the top surface of the board near the package.
5Thermal resistance between the die and the case top surface as measured in simulation by the cold plate method (MIL
SPEC-883 Method 1012.1).
6Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. ΨJT is a useful value to use to estimate junction temperature in a steady state customer enviroment.
Table A-6. 3.3-V I/O Characteristics
ALL 3.3V RANGE I/O PARAMETERS ARE SUBJECT TO CHANGE FOLLOWING CHARACTERIZATION
Conditions are 3.15 V < VDD35 < 3.6 V junction temperature from –40°C to +150°C, unless otherwise noted
I/O Characteristics for all I/O pins except EXTAL, XTAL,TEST and supply pins.
Num C Rating Symbol Min Typ Max Unit
1 P Input high voltage VIH 0.65V*VDD35 ——V
2 T Input high voltage VIH ——V
DD35+0.3 V
3 P Input low voltage VIL — — 0.35*VDD35 V
4 T Input low voltage VIL VSS35 – 0.3 — — V
5 C Input hysteresis VHYS 0.06V*VDD35 —0.3V*VDD35 mV
6
P
Input leakage current (pins in high impedance input
mode)1 Vin = VDD35 or VSS35
M temperature range
V temperature range
C temperature range
Iin
-1
-0.5
-0.4
—
—
—
1
0.5
0.4
µA
7 P Output high voltage (pins in output mode)
IOH = –1.75 mA
VOH VDD35-0.4 — — V
8 C Output low voltage (pins in output mode)
IOL = +1.75 mA
VOL ——
0.4 V
9 P Internal pull up device current
VIH min > input voltage > VIL max
IPUL -1 — –70 µA
10 P Internal pull down device current
VIH min > input voltage > VIL max
IPDH 1—70 µA
11 D Input capacitance Cin —7—pF
12 T Injection current2
Single pin limit
Total device limit, sum of all injected currents
IICS
IICP
–2.5
–25
—
2.5
25
mA
13 P Port J, P, AD interrupt input pulse filtered (STOP)3tP_MASK —— 3µs
14 P Port J, P, AD interrupt input pulse passed (STOP)3tP_PASS 10 — — µs
15 D Port J, P, AD interrupt input pulse filtered (STOP) in
number of bus clock cycles of period 1/fbus
nP_MASK —— 3
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1081
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
16 D Port J, P, AD interrupt input pulse passed (STOP) in
number of bus clock cycles of period 1/fbus
nP_PASS 4——
17 D IRQ pulse width, edge-sensitive mode (STOP) in
number of bus clock cycles of period 1/fbus
nIRQ 1——
1Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each
8°C to 12 C° in the temperature range from 50°C to 125°C.
2Refer to Section A.1.4, “Current Injection” for more details
3Parameter only applies in stop or pseudo stop mode.
Table A-6. 3.3-V I/O Characteristics
ALL 3.3V RANGE I/O PARAMETERS ARE SUBJECT TO CHANGE FOLLOWING CHARACTERIZATION
Conditions are 3.15 V < VDD35 < 3.6 V junction temperature from –40°C to +150°C, unless otherwise noted
I/O Characteristics for all I/O pins except EXTAL, XTAL,TEST and supply pins.
Num C Rating Symbol Min Typ Max Unit
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1082 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.2.1 Supply Currents
This section describes the current consumption characteristics of the device as well as the conditions for
the measurements.
Table A-7. 5-V I/O Characteristics
ALL 5V RANGE I/O PARAMETERS ARE SUBJECT TO CHANGE FOLLOWING CHARACTERIZATION
Conditions are 4.5 V < VDD35 < 5.5 V junction temperature from –40°C to +150°C, unless otherwise noted
I/O Characteristics for all I/O pins except EXTAL, XTAL,TEST and supply pins.
Num C Rating Symbol Min Typ Max Unit
1 P Input high voltage VIH 0.65*VDD35 ——V
2 T Input high voltage VIH ——V
DD35+0.3 V
3 P Input low voltage VIL — — 0.35*VDD35 V
4 T Input low voltage VIL VSSRX–0.3 — — V
5 C Input hysteresis VHYS 0.06V*VDD35 —0.3V*VDD35 mV
6
P
Input leakage current (pins in high impedance input
mode)1 Vin = VDD35 or VSS35
M temperature range
V temperature range
C temperature range
Iin
-1
-0.5
-0.4
—
—
—
1
0.5
0.4
µA
7 P Output high voltage (pins in output mode)
IOH = –4 mA
VOH VDD35 – 0.8 — — V
8 P Output low voltage (pins in output mode)
IOL = +4mA
VOL — — 0.8 V
9 P Internal pull up current
VIH min > input voltage > VIL max
IPUL -10 — -130 µA
10 P Internal pull down current
VIH min > input voltage > VIL max
IPDH 10 — 130 µA
11 D Input capacitance Cin —7—pF
12 T Injection current2
Single pin limit
Total device Limit, sum of all injected currents
IICS
IICP
–2.5
–25
—
2.5
25
mA
13 P Port J, P, AD interrupt input pulse filtered (STOP)3tP_MASK —— 3µs
14 P Port J, P, AD interrupt input pulse passed (STOP)3tP_PASS 10 — — µs
15 D Port J, P, AD interrupt input pulse filtered (STOP) in
number of bus clock cycles of period 1/fbus
nP_MASK —— 3
16 D Port J, P, AD interrupt input pulse passed (STOP) in
number of bus clock cycles of period 1/fbus
nP_PASS 4——
17 D IRQ pulse width, edge-sensitive mode (STOP) in
number of bus clock cycles of period 1/fbus
nIRQ 1——
1Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each
8°C to 12 C° in the temperature range from 50°C to 125°C.
2Refer to Section A.1.4, “Current Injection” for more details
3Parameter only applies in stop or pseudo stop mode.
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1083
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.2.1.1 Measurement Conditions
Run current is measured on VDDR pin. It does not include the current to drive external loads. Unless
otherwise noted the currents are measured in special single chip mode and the CPU code is executed from
RAM. For Run and Wait current measurements PLL is on and the reference clock is the IRC1M trimmed
to 1MHz. The bus frequency is 25MHz and the CPU frequency is 50MHz. Table A-8., Table A-9. and
Table A-10. show the configuration of the CPMU module and the peripherals for Run, Wait and Stop
current measurement.
Table A-8. CPMU Configuration for Pseudo Stop Current Measurement
CPMU REGISTER Bit settings/Conditions
CPMUCLKS PLLSEL=0, PSTP=1,
PRE=PCE=RTIOSCSEL=COPOSCSEL=1
CPMUOSC OSCE=1, External Square wave on EXTAL fEXTAL=4MHz,
VIH= 1.8V, VIL=0V
CPMURTI RTDEC=0, RTR[6:4]=111, RTR[3:0]=1111;
CPMUCOP WCOP=1, CR[2:0]=111
Table A-9. CPMU Configuration for Run/Wait and Full Stop Current Measurement
CPMU REGISTER Bit settings/Conditions
CPMUSYNR VCOFRQ[1:0]=01,SYNDIV[5:0] = 24
CPMUPOSTDIV POSTDIV[4:0]=0
CPMUCLKS PLLSEL=1
CPMUOSC OSCE=0,
Reference clock for PLL is fref=firc1m trimmed to 1MHz
API settings for STOP current measurement
CPMUAPICTL APIEA=0, APIFE=1, APIE=0
CPMUAPITR trimmed to 10Khz
CPMUAPIRH/RL set to $FFFF
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1084 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table A-10. Peripheral Configurations for Run & Wait Current Measurement
Peripheral Configuration
MSCAN Configured to loop-back mode using a bit rate of 1Mbit/s
SPI Configured to master mode, continuously transmit data
(0x55 or 0xAA) at 1Mbit/s
SCI Configured into loop mode, continuously transmit data
(0x55) at speed of 57600 baud
PWM Configured to toggle its pins at the rate of 40kHz
ADC
The peripheral is configured to operate at its maximum
specified frequency and to continuously convert voltages on
all input channels in sequence.
DBG
The module is enabled and the comparators are configured
to trigger in outside range.The range covers all the code
executed by the core.
TIM The peripheral shall be configured to output compare mode,
pulse accumulator and modulus counter enabled.
COP & RTI Both modules are enabled.
ACMP1
1Onlly available on S12GN16, S12GN32, S12GN48, S12G48, and S12G64
The module is enabled with analog output on. The ACMPP
and ACMPM are toggling with 0-1 and 1-0.
DAC2
2Only available on S12G192, S12GA192, S12G340, and S12GA240
DAC0 and DAC1 is buffered at full voltage range
(DACxCTL = $87).
RVA3
3Only available on S12GA192 and S12GA240
The module is enabled and ADC is running at 6.25MHz with
maximum bus freq
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1085
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table A-11. Run and Wait Current Characteristics
Conditions are: VDDR=5.5V, TA=125°C, see Table A-9. and Table A-10.
Num C Rating Symbol Min Typ Max Unit
S12GN16, S12GN32
1 P IDD Run Current (code execution from RAM) IDDRr 12.5 16 mA
2 C IDD Run Current (code execution from flash) IDDRf 13 mA
3 P IDD Wait Current IDDW 7.2 10 mA
S12GN48, S12G48, S12G64
4 P IDD Run Current (code execution from RAM) IDDRr 14 19 mA
5 C IDD Run Current (code execution from flash) IDDRf 15.5 mA
6 P IDD Wait Current IDDW 8.7 11 mA
S12G96, S12G128
7 P IDD Run Current (code execution from RAM) IDDRr 15 21 mA
8 C IDD Run Current (code execution from flash) IDDRf 17 mA
9 P IDD Wait Current IDDW 9 11.5 mA
S12G192, S12GA192, S12G240, S12GA240
10 P IDD Run Current (code execution from RAM) IDDRr 18 22.5 mA
11 C IDD Run Current (code execution from flash) IDDRf 17 mA
12 P IDD Wait Current IDDW 9.5 12 mA
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1086 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table A-12. Full Stop Current Characteristics
Conditions are: Typ: VDDX,VDDR,VDDA=5V, Max: VDDX,VDDR,VDDA=5.5V API see Table A-9.
Num C Rating Symbol Min Typ Max Unit
S12GN16, S12GN32
Stop Current API disabled
1 P -40°CI
DDS 14.4 24 µA
2P25°CI
DDS 16.5 28 µA
3 P 150°CI
DDS 120 320 µA
Stop Current API enabled
4 C -40°CI
DDS 18.5 µA
5C25°CI
DDS 21.5 µA
6 C 150°CI
DDS 130 µA
S12GN48, S12G48, S12G64
Stop Current API disabled
7 P -40°CI
DDS 16 27 µA
8P25°CI
DDS 18.5 30 µA
9 P 150°CI
DDS 140 360 µA
Stop Current API enabled
10 C -40°CI
DDS 20 µA
11 C 25°CI
DDS 23.5 µA
12 C 150°CI
DDS 150 µA
S12G96, S12G128
Stop Current API disabled
13 P -40°CI
DDS 16.5 28 µA
14 P 25°CI
DDS 19 32 µA
15 P 150°CI
DDS 150 400 µA
Stop Current API enabled
16 C -40°CI
DDS 20.5 µA
17 C 25°CI
DDS 24 µA
18 C 150°CI
DDS 160 µA
S12G192, S12GA192, S12G240, S12GA240
Stop Current API disabled
19 P -40°CI
DDS 17 30 µA
20 P 25°CI
DDS 19.5 34 µA
21 P 150°CI
DDS 155 420 µA
Stop Current API enabled
22 C -40°CI
DDS 21 µA
23 C 25°CI
DDS 24.5 µA
24 C 150°CI
DDS 160 µA
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1087
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table A-13. Pseudo Stop Current Characteristics
A.3 ADC Characteristics
This section describes the characteristics of the analog-to-digital converter.
A.3.1 ADC Operating Characteristics
The Table A-14 and Table A-15 show conditions under which the ADC operates.
The following constraints exist to obtain full-scale, full range results:
VSSA ≤VRL ≤ VIN ≤ VRH ≤ VDDA.
Conditions are: VDDX=5V, VDDR=5V, VDDA=5V, RTI and COP and API enabled, see Table A-8.
Num C Rating Symbol Min Typ Max Unit
S12GN16, S12GN32
1 C -40°CI
DDPS 300 µA
2C25°CI
DDPS 310 µA
3 C 150°CI
DDPS 430 µA
S12GN48, S12G48, S12G64
4 C -40°CI
DDPS 320 µA
5C25°CI
DDPS 330 µA
6 C 150°CI
DDPS 510 µA
S12G96, S12G128
7 C -40°CI
DDPS 340 µA
8C25°CI
DDPS 350 µA
9 C 150°CI
DDPS 520 µA
S12G192, S12GA192, S12G240, S12GA240
10 C -40°CI
DDPS 370 µA
11 C 25°CI
DDPS 380 µA
12 C 150°CI
DDPS 550 µA
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1088 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
This constraint exists since the sample buffer amplifier can not drive beyond the power supply levels that
it ties to. If the input level goes outside of this range it will effectively be clipped.
Table A-14. ADC Operating Characteristics
A.3.2 Factors Influencing Accuracy
Source resistance, source capacitance and current injection have an influence on the accuracy of the ADC.
A further factor is that PortAD pins that are configured as output drivers switching.
A.3.2.1 Port AD Output Drivers Switching
PortAD output drivers switching can adversely affect the ADC accuracy whilst converting the analog
voltage on other PortAD pins because the output drivers are supplied from the VDDA/VSSA ADC supply
pins. Although internal design measures are implemented to minimize the affect of output driver noise, it
is recommended to configure PortAD pins as outputs only for low frequency, low load outputs. The impact
on ADC accuracy is load dependent and not specified. The values specified are valid under condition that
no PortAD output drivers switch during conversion.
A.3.2.2 Source Resistance
Due to the input pin leakage current as specified in conjunction with the source resistance there will be a
voltage drop from the signal source to the ADC input. The maximum source resistance RSspecifies results
in an error (10-bit resolution) of less than 1/2 LSB (2.5 mV) at the maximum leakage current. If device or
operating conditions are less than worst case or leakage-induced error is acceptable, larger values of source
resistance of up to 10Kohm are allowed.
Supply voltage 3.13 V < VDDA < 5.5 V, -40oC < TJ < 150oC
Num C Rating Symbol Min Typ Max Unit
1 D Reference potential
Low
High
VRL
VRH
VSSA
VDDA/2
—
—
VDDA/2
VDDA
V
V
2 D Voltage difference VDDX to VDDA ∆VDDX –2.35 0 0.1 V
3 D Voltage difference VSSX to VSSA ∆VSSX –0.1 0 0.1 V
4 C Differential reference voltage1
1Full accuracy is not guaranteed when differential voltage is less than 4.50 V
VRH-VRL 3.13 5.0 5.5 V
5 C ADC Clock Frequency (derived from bus clock via the
prescaler bus) fADCCLk
0.25 8.0 MHz
8D
ADC Conversion Period2
12 bit resolution:
10 bit resolution:
8 bit resolution:
2The minimum time assumes a sample time of 4 ADC clock cycles. The maximum time assumes a sample time of 24 ADC
clock cycles and the discharge feature (SMP_DIS) enabled, which adds 2 ADC clock cycles.
NCONV12
NCONV10
NCONV8
20
19
17
42
41
39
ADC
clock
Cycles
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1089
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.3.2.3 Source Capacitance
When sampling an additional internal capacitor is switched to the input. This can cause a voltage drop due
to charge sharing with the external and the pin capacitance. For a maximum sampling error of the input
voltage ≤ 1LSB (10-bit resilution), then the external filter capacitor, Cf≥ 1024 * (CINS–CINN).
A.3.2.4 Current Injection
There are two cases to consider.
1. A current is injected into the channel being converted. The channel being stressed has conversion
values of $3FF (in 10-bit mode) for analog inputs greater than VRH and $000 for values less than
VRL unless the current is higher than specified as disruptive condition.
2. Current is injected into pins in the neighborhood of the channel being converted. A portion of this
current is picked up by the channel (coupling ratio K), This additional current impacts the accuracy
of the conversion depending on the source resistance.
The additional input voltage error on the converted channel can be calculated as:
VERR = K * RS * IINJ
with IINJ being the sum of the currents injected into the two pins adjacent to the converted channel.
A.3.3 ADC Accuracy
Table A-16 and Table A-18 specifies the ADC conversion performance excluding any errors due to
current injection, input capacitance and source resistance.
Table A-15. ADC Electrical Characteristics
Supply voltage 3.13 V < VDDA < 5.5 V, -40oC < TJ < 150oC
Num C Rating Symbol Min Typ Max Unit
1 C Max input source resistance1
11 Refer to A.3.2.2 for further information concerning source resistance
RS—— 1KΩ
2 D Total input capacitance Non sampling
Total input capacitance Sampling
CINN
CINS
—
—
—
—
10
16
pF
3 D Input internal Resistance RINA - 5 15 kΩ
4 C Disruptive analog input current INA -2.5 — 2.5 mA
5 C Coupling ratio positive current injection Kp— — 1E-4 A/A
6 C Coupling ratio negative current injection Kn— — 5E-3 A/A
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1090 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.3.3.1 ADC Accuracy Definitions
For the following definitions see also Figure A-1.
Differential non-linearity (DNL) is defined as the difference between two adjacent switching steps.
The integral non-linearity (INL) is defined as the sum of all DNLs:
DNL i() ViVi1–
–
1LSB
--------------------------1–=
INL n() DNL i()
i1=
n
∑VnV0
–
1LSB
---------------------n–==
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1091
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure A-1. ADC Accuracy Definitions
NOTE
Figure A-1 shows only definitions, for specification values refer to
Table A-16 and Table A-18.
1
5Vin
mV
10 15 20 25 30 35 40 85 90 95 100 105 110 115 12065 70 75 8060
0
3
2
5
4
7
6
45
$3F7
$3F9
$3F8
$3FB
$3FA
$3FD
$3FC
$3FE
$3FF
$3F4
$3F6
$3F5
8
9
1
2
$FF
$FE
$FD
$3F3
10-Bit Resolution
8-Bit Resolution
Ideal Transfer Curve
10-Bit Transfer Curve
8-Bit Transfer Curve
55
10-Bit Absolute Error Boundary
8-Bit Absolute Error Boundary
LSB
Vi-1 Vi
DNL
5000 +
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1092 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table A-16. ADC Conversion Performance 5V range
S12GA192 and S12GA240
Supply voltage VDDA =5.12 V, -40oC < TJ < 150oC. VREF = VRH - VRL = 5.12V. fADCCLK = 8.0MHz
The values are tested to be valid with no PortAD output drivers switching simultaneous with conversions.
Num C Rating1
1The 8-bit and 10-bit mode operation is structurally tested in production test. Absolute values are tested in 12-bit mode.
Symbol Min Typ Max Unit
1 P Resolution 12-Bit LSB 1.25 mV
2 P Differential Nonlinearity 12-Bit DNL -4 ±2 4 counts
3 P Integral Nonlinearity 12-Bit INL -5 ±2.5 5 counts
4 P Absolute Error2
2These values include the quantization error which is inherently 1/2 count for any A/D converter.
12-Bit AE -7 ±4 7 counts
5 C Resolution 10-Bit LSB 5 mV
6 C Differential Nonlinearity 10-Bit DNL -1 ±0.5 1 counts
7 C Integral Nonlinearity 10-Bit INL -2 ±1 2 counts
8 C Absolute Error210-Bit AE -3 ±2 3 counts
9 C Resolution 8-Bit LSB 20 mV
10 C Differential Nonlinearity 8-Bit DNL -0.5 ±0.3 0.5 counts
11 C Integral Nonlinearity 8-Bit INL -1 ±0.5 1 counts
12 C Absolute Error28-Bit AE -1.5 ±1 1.5 counts
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1093
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table A-17. ADC Conversion Performance 5V range
Table A-18. ADC Conversion Performance 3.3V range
S12GN16, S12GN32, S12GN48, S12G48, S12GS48, S12G64, S12G96, S12G128, S12G192, and S12G240
Supply voltage VDDA =5.12 V, -40oC < TJ < 150oC. VREF = VRH - VRL = 5.12V. fADCCLK = 8.0MHz
The values are tested to be valid with no PortAD output drivers switching simultaneous with conversions.
Num C Rating1
1The 8-bit mode operation is structurally tested in production test. Absolute values are tested in 10-bit mode.
Symbol Min Typ Max Unit
1 P Resolution 10-Bit LSB 5 mV
2 P Differential Nonlinearity 10-Bit DNL -1 ±0.5 1 counts
3 P Integral Nonlinearity 10-Bit INL -2 ±1 2 counts
4 P Absolute Error2
2These values include the quantization error which is inherently 1/2 count for any A/D converter.
10-Bit3
10-Bit4
3LQFP 48 and bigger
4LQFP 32 and smaller
AE -3
TBD
±2
±2
3
TBD
counts
5 C Resolution 8-Bit LSB 20 mV
6 C Differential Nonlinearity 8-Bit DNL -0.5 ±0.3 0.5 counts
7 C Integral Nonlinearity 8-Bit INL -1 ±0.5 1 counts
8 C Absolute Error28-Bit AE -1.5 ±1 1.5 counts
S12GA192 and S12GA240
Supply voltage VDDA = 3.3V, -40oC < TJ < 150oC. VREF = VRH - VRL = 3.3V. fADCCLK = 8.0MHz
The values are tested to be valid with no PortAD output drivers switching simultaneous with conversions.
Num C Rating1Symbol Min Typ Max Unit
1 P Resolution 12-Bit LSB 0.80 mV
2 P Differential Nonlinearity 12-Bit DNL -6 ±3 6 counts
3 P Integral Nonlinearity 12-Bit INL -7 ±3 7 counts
4 P Absolute Error212-Bit AE -8 ±4 8 counts
5 C Resolution 10-Bit LSB 3.22 mV
6 C Differential Nonlinearity 10-Bit DNL -1.5 ±1 1.5 counts
7 C Integral Nonlinearity 10-Bit INL -2 ±1 2 counts
8 C Absolute Error210-Bit3
10-Bit4AE -3
TBD
±2
±2
3
TBD
counts
9 C Resolution 8-Bit LSB 12.89 mV
10 C Differential Nonlinearity 8-Bit DNL -0.5 ±0.3 0.5 counts
11 C Integral Nonlinearity 8-Bit INL -1 ±0.5 1 counts
12 C Absolute Error28-Bit AE -1.5 ±1 1.5 counts
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1094 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table A-19. ADC Conversion Performance 3.3V range
1The 8-bit and 10-bit mode operation is structurally tested in production test. Absolute values are tested in 12-bit mode.
2These values include the quantization error which is inherently 1/2 count for any A/D converter.
3LQFP 48 and bigger
4LQFP 32 and smaller
S12GN16, S12GN32, S12GN48, S12G48, S12GS48, S12G64, S12G96, S12G128, S12G192, and S12G240
Supply voltage VDDA = 3.3V, -40oC < TJ < 150oC. VREF = VRH - VRL = 3.3V. fADCCLK = 8.0MHz
The values are tested to be valid with no PortAD output drivers switching simultaneous with conversions.
Num C Rating1
1The 8-bit mode operation is structurally tested in production test. Absolute values are tested in 10-bit mode.
Symbol Min Typ Max Unit
1 P Resolution 10-Bit LSB 3.22 mV
2 P Differential Nonlinearity 10-Bit DNL -1.5 ±1 1.5 counts
3 P Integral Nonlinearity 10-Bit INL -2 ±1 2 counts
4 P Absolute Error2
2These values include the quantization error which is inherently 1/2 count for any A/D converter.
10-Bit3
10-Bit4
3LQFP 48 and bigger
4LQFP 32 and smaller
AE -3
TBD
±2
±2
3
TBD
counts
5 C Resolution 8-Bit LSB 12.89 mV
6 C Differential Nonlinearity 8-Bit DNL -0.5 ±0.3 0.5 counts
7 C Integral Nonlinearity 8-Bit INL -1 ±0.5 1 counts
8 C Absolute Error28-Bit AE -1.5 ±1 1.5 counts
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1095
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table A-20. ADC Conversion Performance 5V range, RVA enabled
A.3.4 ADC Temperature Sensor
Table A-21. ADC Temperature Sensor
Supply voltage VDDA =5.0 V, -40oC < TJ < 150oC. VRH = 5.0V. fADCCLK = 0.25 .. 2MHz 1
The values are tested to be valid with no PortAD/C output drivers switching simultaneous with conversions.
1Upper limit of fADCCLK is restricted when rva attenuation mode is enaged.
Num C Rating Symbol Min Typ Max Unit
1 P Resolution 12-Bit LSB 0.61 mV
2 P Differential Nonlinearity 12-Bit DNL ±3±4 counts
3 P Integral Nonlinearity 12-Bit INL ±3.5 ±5 counts
4 C Absolute Error2
2These values include the quantization error which is inherently 1/2 count for any A/D converter.
12-Bit AE ±8 counts
5 P internal VRH reference voltage Vvrh_int 4.495 4.505 V
6 P internal VRL reference voltage Vvrl_int 1.995 2.005V V
7 C VRH_INT drift vs temperature3
3Please note: although different in value, drift of vrh_int and vrl_int will go in the same direction.
Vvrh_drift -2 2 mV
8 C VRL_INT drift vs temperature Vvrl_drift -2.5 2.5 mV
9 C rva turn on settling time tsettling_on 2.5 µs
10 C rva turn off settling time tsettling_off 1µs
Num C Rating Symbol Min Typ Max Unit
1 T Temperature Sensor Slope dVTS -4.0 -3.8 -3.6 mV/°C
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1096 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.4 ACMP Characteristics
This section describes the electrical characteristics of the analog comparator.
Figure A-2. Input Offset and Hysteresis
Table A-22. ACMP Electrical Characteristics
Characteristics noted under conditions 3.13V <= VDDA <= 5.5V, -40oC < Tj , 150oC unless otherwise noted. Typical values
noted reflect the approximate parameter mean at TA = 25˚C under nominal conditions unless otherwise noted.
Num C Ratings Symbol Min Typ Max Unit
1
D
C
Supply Current of ACMP
module disabled
module enabled ∆Vin > 0.1V
Ioff
Irun 100
-
180
5
270
µA
µA
2 P Common mode Input voltage range ACMPM,
ACMPP
Vin 0-V
DDA-1.5V V
3 P Input Offset Voffset -40 0 40 mV
4 C Input Hysteresis Vhyst 3 7 20 mV
5 P Switch delay for -0.1V to 0.1V input step (w/o
synchronize delay)
tdelay - 0.3 0.6 µs
Offset Hysteresis
ACMPM
ACMPP
ACMPO
V
t
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1097
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.5 DAC Characteristics
This section describes the electrical characteristics of the digital to analog converter.
Table A-23. Static Electrical Characteristics - DAC_8B5V
Characteristics noted under conditions 3.13V <= VDDA <= 5.5V>, -40˚C < Tj < 150˚C >, VRH=VDDA, VRL=VSSA
unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25˚C under nominal
conditions unless otherwise noted.
Num C Ratings Symbol Min Typ Max Unit
1
D
P
Supply Current of DAC_8B5V
buffer disabled
buffer enabled
Ibuf -
200
-
600
5
1000
µA
2
D
P
Reference current
reference disabled
reference enabled
Iref --
50
1
150
µA
3 D Resolution 8 bit
4 C Relative Accuracy @ amplifier output INL -0.5 +0.5 LSB
5 P Differential Nonlinearity @ amplifier output DNL -0.5 +0.5 LSB
6 D DAC Range A (FVR bit = 1) Vout 0...255/256(VRH-VRL)+VRL V
7 D DAC Range B (FVR bit = 0 Vout 32...287/320(VRH-VRL)+VRL V
8 C Output Voltage
unbuffered range A or B (load >= 50MΩ)V
out full DAC Range A or B V
9 P Output Voltage (DRIVE bit = 0)1
buffered range A (load >= 100KΩ to VSSA)
buffered range A (load >= 100KΩto VDDA)
buffered range B (load >= 100KΩ to VSSA)
buffered range B (load >= 100KΩ to VDDA)
1DRIVE bit = 1 is not recomended in this case.
Vout
0
0.15
-
-
VDDA-0.15
VDDA V
full DAC Range B
10 P Output Voltage (DRIVE bit = 1)2
buffered range B with 6.4KΩload into resistor
divider of 800Ω /6.56KΩ between VDDA and
VSSA.
(equivalent load is >= 65KΩto VSSA) or
(equivalent load is >= 7.5KΩ to VDDA)
2DRIVE bit = 0 is not allowed with this high load.
Vout full DAC Range B V
11 D Buffer Output Capacitive load Cload 0 - 100 pF
12 P Buffer Output Offset Voffset -30 - +30 mV
13 P Settling time tdelay -35µs
14 D Reverence voltage high Vrefh VDDA-0.1V VDDA VDDA+0.1V V
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1098 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.6 NVM
A.6.1 Timing Parameters
The time base for all NVM program or erase operations is derived from the bus clock using the FCLKDIV
register. The frequency of this derived clock must be set within the limits specified as fNVMOP
. The NVM
module does not have any means to monitor the frequency and will not prevent program or erase operation
at frequencies above or below the specified minimum. When attempting to program or erase the NVM
module at a lower frequency, a full program or erase transition is not assured.
The following sections provide equations which can be used to determine the time required to execute
specific flash commands. All timing parameters are a function of the bus clock frequency, fNVMBUS. All
program and erase times are also a function of the NVM operating frequency, fNVMOP
. A summary of key
timing parameters can be found in Table A-24.
A.6.1.1 Erase Verify All Blocks (Blank Check) (FCMD=0x01)
The time required to perform a blank check on all blocks is dependent on the location of the first non-blank
word starting at relative address zero. It takes one bus cycle per phrase to verify plus a setup of the
command. Assuming that no non-blank location is found, then the time to erase verify all blocks is given
by:
FTMRG240K2, FTMRG192K2:
FTMRG128K1,FTMRG96K1:
FTMRG64K1, FTMRG48K1:
FTMRG32K1,FTMRG16K1:
A.6.1.2 Erase Verify Block (Blank Check) (FCMD=0x02)
The time required to perform a blank check is dependent on the location of the first non-blank word starting
at relative address zero. It takes one bus cycle per phrase to verify plus a setup of the command.
tcheck 64400 1
fNVMBUS
---------------------
⋅=
tcheck 33600 1
fNVMBUS
---------------------
⋅=
tcheck 18000 1
fNVMBUS
---------------------
⋅=
tcheck 9300 1
fNVMBUS
---------------------
⋅=
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1099
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Assuming that no non-blank location is found, then the time to erase verify a P-Flash block is given by:
FTMRG240K2, FTMRG192K2:
FTMRG128K1, FTMRG96K1:
FTMRG64K1, FTMRG48K1:
FTMRG32K1, FTMRG16K1:
Assuming that no non-blank location is found, then the time to erase verify a EEPROM block is given by:
FTMRG240K2, FTMRG192K2:
FTMRG128K1, FTMRG96K1:
FTMRG64K1, FTMRG48K1:
tpcheck 62200 1
fNVMBUS
---------------------
⋅=
tpcheck 33400 1
fNVMBUS
---------------------
⋅=
tpcheck 16700 1
fNVMBUS
---------------------
⋅=
tpcheck 33400 1
fNVMBUS
---------------------
⋅=
tdcheck 2620 1
fNVMBUS
---------------------
⋅=
tdcheck 2620 1
fNVMBUS
---------------------
⋅=
tdcheck 1540 1
fNVMBUS
---------------------
⋅=
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1100 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
FTMRG32K1, FTMRG16K1:
A.6.1.3 Erase Verify P-Flash Section (FCMD=0x03)
The maximum time to erase verify a section of P-Flash depends on the number of phrases being verified
(NVP) and is given by:
A.6.1.4 Read Once (FCMD=0x04)
The maximum read once time is given by:
A.6.1.5 Program P-Flash (FCMD=0x06)
The programming time for a single phrase of four P-Flash words and the two seven-bit ECC fields is
dependent on the bus frequency, fNVMBUS, as well as on the NVM operating frequency, fNVMOP
.
The typical phrase programming time is given by:
The maximum phrase programming time is given by:
A.6.1.6 Program Once (FCMD=0x07)
The maximum time required to program a P-Flash Program Once field is given by:
A.6.1.7 Erase All Blocks (FCMD=0x08)
The time required to erase all blocks is given by:
tdcheck 2620 1
fNVMBUS
---------------------
⋅=
t 550 NVP
+()
1
fNVMBUS
---------------------
⋅≈
t 550 1
fNVMBUS
---------------------
⋅=
tppgm 62 1
fNVMOP
------------------ 2900 1
fNVMBUS
---------------------
⋅+⋅≈
tppgm 62 1
fNVMOP
------------------ 3100 1
fNVMBUS
---------------------
⋅+⋅≈
t62 1
fNVMOP
------------------ 2900 1
fNVMBUS
---------------------
⋅+⋅≈
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1101
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
FTMRG240K2, FTMRG192K2:
FTMRG128K1, FTMRG96K1:
FTMRG64K1, FTMRG48K1:
FTMRG32K1, FTMRG16K1:
A.6.1.8 Erase P-Flash Block (FCMD=0x09)
The time required to erase the P-Flash block is given by:
FTMRG240K2, FTMRG192K1:
FTMRG128K1, FTMRG96K1:
FTMRG64K1, FTMRG64K1:
FTMRG32K1, FTMRG16K1:
tmass 200130 1
fNVMOP
------------------ 65000 1
fNVMBUS
---------------------
⋅+⋅≈
tmass 100068 1
fNVMOP
------------------ 33500 1
fNVMBUS
---------------------
⋅+⋅≈
tmass 100068 1
fNVMOP
------------------ 18300 1
fNVMBUS
---------------------
⋅+⋅≈
tmass 100068 1
fNVMOP
------------------ 9600 1
fNVMBUS
---------------------
⋅+⋅≈
tpmass 200124 1
fNVMOP
------------------ 62700 1
fNVMBUS
---------------------
⋅+⋅≈
tpmass 100062 1
fNVMOP
------------------ 31300 1
fNVMBUS
---------------------
⋅+⋅≈
tpmass 100062 1
fNVMOP
------------------ 17100 1
fNVMBUS
---------------------
⋅+⋅≈
tpmass 100062 1
fNVMOP
------------------ 9000 1
fNVMBUS
---------------------
⋅+⋅≈
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1102 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.6.1.9 Erase P-Flash Sector (FCMD=0x0A)
The typical time to erase a 512-byte P-Flash sector is given by:
The maximum time to erase a 512-byte P-Flash sector is given by:
A.6.1.10 Unsecure Flash (FCMD=0x0B)
The maximum time required to erase and unsecure the Flash is given by:
FTMRG240K2, FTMRG192K2:
FTMRG128K1, FTMRG96K1:
FTMRG64K1, FTMRG48K1:
FTMRG32K1, FTMRG16K1:
A.6.1.11 Verify Backdoor Access Key (FCMD=0x0C)
The maximum verify backdoor access key time is given by:
A.6.1.12 Set User Margin Level (FCMD=0x0D)
The maximum set user margin level time is given by:
tpera 20400 1
fNVMOP
------------------
⋅720 1
fNVMBUS
---------------------
⋅+≈
tpera 20400 1
fNVMOP
------------------
⋅1700 1
fNVMBUS
---------------------
⋅+≈
tuns 200130 1
fNVMOP
------------------ 65100 1
fNVMBUS
---------------------
⋅+⋅≈
tuns 100070 1
fNVMOP
------------------ 33500 1
fNVMBUS
---------------------
⋅+⋅≈
tuns 100070 1
fNVMOP
------------------ 18300 1
fNVMBUS
---------------------
⋅+⋅≈
tuns 100070 1
fNVMOP
------------------ 9600 1
fNVMBUS
---------------------
⋅+⋅≈
t 520 1
fNVMBUS
---------------------
⋅=
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1103
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.6.1.13 Set Field Margin Level (FCMD=0x0E)
The maximum set field margin level time is given by:
A.6.1.14 Erase Verify EEPROM Section (FCMD=0x10)
The time required to Erase Verify EEPROM for a given number of words NWis given by:
A.6.1.15 Program EEPROM (FCMD=0x11)
EEPROM programming time is dependent on the number of words being programmed and their location
with respect to a row boundary since programming across a row boundary requires extra steps.
The typical EEPROM programming time is given by the following equation, where NWdenotes the
number of words:
The maximum EEPROM programming time is given by:
A.6.1.16 Erase EEPROM Sector (FCMD=0x12)
Typical EEPROM sector erase times, expected on a new device where no margin verify fails occur, is given
by:
t 500 1
fNVMBUS
---------------------
⋅=
t 510 1
fNVMBUS
---------------------
⋅=
tdcheck 520 NW
+()
1
fNVMBUS
---------------------
⋅≈
tdpgm 34 NW
⋅()
1
fNVMOP
------------------
⋅
⎝
⎛⎠
⎞600 940 NW
⋅()+()
1
fNVMBUS
---------------------
⋅
⎝
⎛⎠
⎞
+≈
tdpgm 34 NW
⋅()
1
fNVMOP
------------------
⋅
⎝
⎛⎠
⎞600 1020(NW)⋅+()
1
fNVMBUS
---------------------
⋅
⎝
⎛⎠
⎞
+≈
tdera 5025 1
fNVMOP
------------------ 710 1
fNVMBUS
---------------------
⋅+⋅≈
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1104 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Maximum EEPROM sector erase times is given by:
The EEPROM sector erase time is ~5ms on a new device and can extend to ~20ms as the flash is cycled.
tdera 20400 1
fNVMOP
------------------ 750 1
fNVMBUS
---------------------
⋅+⋅≈
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1105
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Table A-24. NVM Timing Characteristics
Num C Rating Symbol Min Typ1Max2Unit3
1 Bus frequency fNVMBUS 1 — 25 MHz
2 Operating frequency fNVMOP 0.8 1.0 1.05 MHz
3 D Erase all blocks (mass erase) time
(FTMRG240K2, TMRG192K2)
tmass — 200 260 ms
Erase all blocks (mass erase) time
(FTMRG128K1, FTMRG96K1)
tmass — 100 130 ms
Erase all blocks (mass erase) time
(FTMRG128K1, FTMRG96K1)
tmass — 100 130 ms
Erase all blocks (mass erase) time
(FTMRG32K1, FTMRG16K1
tmass — 100 130 ms
4 D Erase verify all blocks (blank check) time
(FTMRG240K2, TMRG192K2)
tcheck — — 64400 tcyc
Erase verify all blocks (blank check) time
(FTMRG128K1, FTMRG96K1)
tcheck — — 33600 tcyc
Erase verify all blocks (blank check) time
(FTMRG64K1, FTMRG48K1)
tcheck — — 18000 tcyc
Erase verify all blocks (blank check) time
(FTMRG32K1, FTMRG16K1)
tcheck — — 9300 tcyc
5 D Unsecure Flash time
(FTMRG240K2, TMRG192K2)
tuns — 200 260 ms
Unsecure Flash time
(FTMRG128K1, FTMRG96K1)
tuns — 100 130 ms
Unsecure Flash time
(FTMRG64K1, FTMRG48K1)
tuns — 100 130 ms
Unsecure Flash time
(FTMRG32K1, FTMRG16K1)
tuns — 100 130 ms
6 D P-Flash block erase time
(FTMRG240K2, TMRG192K2)
tpmass — 200 260 ms
P-Flash block erase time
(FTMRG128K1, FTMRG96K1)
tpmass — 100 130 ms
P-Flash block erase time
(FTMRG64K1, FTMRG48K1)
tpmass — 100 130 ms
P-Flash block erase time
(FTMRG32K1, FTMRG16K1)
tpmass — 100 130 ms
7 D P-Flash erase verify (blank check) time
(FTMRG240K2, FTMRG192K2)
tpcheck — — 62200 tcyc
P-Flash erase verify (blank check) time
(FTMRG128K1, FTMRG96K1)
tpcheck — — 33400 tcyc
P-Flash erase verify (blank check) time
(FTMRG64K1, FTMRG48K1)
tpcheck — — 16700 tcyc
P-Flash erase verify (blank check) time
(FTMRG32K1, FTMRG16K1)
tpcheck — — 33400 tcyc
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1106 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.6.2 NVM Reliability Parameters
The reliability of the NVM blocks is guaranteed by stress test during qualification, constant process
monitors and burn-in to screen early life failures.
The data retention and program/erase cycling failure rates are specified at the operating conditions noted.
The program/erase cycle count on the sector is incremented every time a sector or mass erase event is
executed.
8 D P-Flash sector erase time tpera —2026ms
9 D P-Flash phrase programming time tppgm — 185 200 µs
10 D EEPROM sector erase time tdera —5
426 ms
11 D EEPROM erase verify (blank check) time
(FTMRG240K2, TMRG192K2)
tdcheck — — 2620 tcyc
EEPROM erase verify (blank check) time
(FTMRG128K1, FTMRG96K1)
tdcheck — — 2620 tcyc
EEPROM erase verify (blank check) time
(FTMRG64K1, FTMRG48K1)
tdcheck — — 1540 tcyc
EEPROM erase verify (blank check) time
(FTMRG32K1, FTMRG16K1)
tdcheck — — 1030 tcyc
12a D EEPROM one word programming time tdpgm1 — 97 106 µs
12b D EEPROM two word programming time tdpgm2 — 140 154 µs
1Typical program and erase times are based on typical fNVMOP and maximum fNVMBUS
2Maximum program and erase times are based on minimum fNVMOP and maximum fNVMBUS
3tcyc = 1 / fNVMBUS
4Typical value for a new device
Num C Rating Symbol Min Typ1Max2Unit3
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1107
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.7 Phase Locked Loop
A.7.1 Jitter Definitions
With each transition of the feedback clock, the deviation from the reference clock is measured and input
voltage to the VCO is adjusted accordingly.The adjustment is done continuously with no abrupt changes
in the VCOCLK frequency. Noise, voltage, temperature and other factors cause slight variations in the
control loop resulting in a clock jitter. This jitter affects the real minimum and maximum clock periods as
illustrated in Figure A-3.
Table A-25. NVM Reliability Characteristics
Conditions are shown in Table A-11 unless otherwise noted
NUM C Rating Symbol Min Typ Max Unit
Program Flash Arrays
1 C Data retention at an average junction temperature of TJavg = 85°C1
after up to 10,000 program/erase cycles
1TJavg does not exceed 85°C in a typical temperature profile over the lifetime of a consumer, industrial or automotive application.
tNVMRET 20 1002
2Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated to
25°C using the Arrhenius equation. For additional information on how Freescale defines Typical Data Retention, please refer to
Engineering Bulletin EB618
— Years
2 C Program Flash number of program/erase cycles
(-40°C≤ Tj ≤ 150°C)
nFLPE 10K 100K3
3Spec table quotes typical endurance evaluated at 25°C for this product family. For additional information on how Freescale defines
Typical Endurance, please refer to Engineering Bulletin EB619.
— Cycles
EEPROM Array
3 C Data retention at an average junction temperature of TJavg = 85°C1
after up to 100,000 program/erase cycles
tNVMRET 5 1002— Years
4 C Data retention at an average junction temperature of TJavg = 85°C1
after up to 10,000 program/erase cycles
tNVMRET 10 1002— Years
5 C Data retention at an average junction temperature of TJavg = 85°C1
after less than 100 program/erase cycles
tNVMRET 20 1002— Years
6 C EEPROM number of program/erase cycles (-40°C≤ Tj ≤ 150°C)nFLPE 100K 500K3— Cycles
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1108 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Figure A-3. Jitter Definitions
The relative deviation of tnom is at its maximum for one clock period, and decreases towards zero for larger
number of clock periods (N).
Defining the jitter as:
For N < 100, the following equation is a good fit for the maximum jitter:
Figure A-4. Maximum Bus Clock Jitter Approximation
NOTE
On timers and serial modules a prescaler will eliminate the effect of the jitter
to a large extent.
2 3 N-1 N1
0
tnom
tmax1
tmin1
tmaxN
tminN
JN() max 1
tmax N()
Nt
nom
⋅
-----------------------
–1
tmin N()
Nt
nom
⋅
-----------------------
–,
⎝⎠
⎜⎟
⎛⎞
=
JN() j1
N
--------
=
1 5 10 20 N
J(N)
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1109
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.7.2 Electrical Characteristics for the PLL
A.8 Electrical Characteristics for the IRC1M
Table A-26. PLL Characteristics
Conditions are shown in Table A-11 unless otherwise noted
Num C Rating Symbol Min Typ Max Unit
1 D VCO frequency during system reset fVCORST 8 25 MHz
2 C VCO locking range fVCO 32 50 MHz
3 C Reference Clock fREF 1 MHz
4 D Lock Detection |∆Lock| 0 1.5 %1
1% deviation from target frequency
5 D Un-Lock Detection |∆unl| 0.5 2.5 %1
6 C Time to lock tlock 150 +
256/fREF
µs
7 C Jitter fit parameter 12
IRC as reference clock source
2fREF = 1MHz (IRC), fBUS = 25MHz equivalent fPLL = 50MHz, CPMUSYNR=0x58, CPMUREFDIV=0x00, CPMUPOSTDIV=0x00
jirc 1.4 %
8 C Jitter fit parameter 13
XOSCLCP as reference clock source
3fREF = 4MHz (XOSCLCP), fBUS = 24MHz equivalent fPLL = 48MHz, CPMUSYNR=0x05, CPMUREFDIV=0x40,
CPMUPOSTDIV=0x00
jext 1.0 %
Table A-27. IRC1M Characteristics
Conditions are: Temperature option M, C, or V (see Table A-4)
Num C Rating Symbol Min Typ Max Unit
1 P Internal Reference Frequency, factory trimmed fIRC1M_TRIM 0.987 1 1.013 MHz
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1110 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.9 Electrical Characteristics for the Oscillator (XOSCLCP)
A.10 Reset Characteristics
Table A-28. XOSCLCP Characteristics
Conditions are shown in Table A-11 unless otherwise noted
Num C Rating Symbol Min Typ Max Unit
1CNominal crystal or resonator frequency fOSC 4.0 16 MHz
2PStartup Current iOSC 100 µA
3a COscillator start-up time (4MHz)1
1These values apply for carefully designed PCB layouts with capacitors that match the crystal/resonator requirements.
tUPOSC —210ms
3b COscillator start-up time (8MHz)1tUPOSC —1.6 8 ms
3c COscillator start-up time (16MHz)1tUPOSC —15ms
4PClock Monitor Failure Assert Frequency fCMFA 200 450 1200 KHz
5DInput Capacitance (EXTAL, XTAL pins) CIN 7pF
6CEXTAL Pin Input Hysteresis VHYS,EXTAL —120 —mV
7CEXTAL Pin oscillation amplitude (loop
controlled Pierce) VPP,EXTAL
—1.0 —V
8D EXTAL Pin oscillation required amplitude2
2Needs to be measured at room temperature on the application board using a probe with very low (<=5pF) input
capacitance.
VPP,EXTAL 0.8 —1.5 V
Table A-29. Reset and Stop Characteristics
Conditions are shown in Table A-11 unless otherwise noted
Num C Rating Symbol Min Typ Max Unit
1 C Reset input pulse width, minimum input time PWRSTL 2t
VCORST
2 C Startup from Reset nRST 768 tVCORST
3 C STOP recovery time tSTP_REC 23 µs
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1111
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.11 Electrical Specification for Voltage Regulator
NOTE
The LVR monitors the voltages VDD,V
DDF and VDDX. As soon as voltage
drops on these supplies which would prohibit the correct function of the
microcontroller, the LVR is triggering a reset.
Table A-30. Voltage Regulator Characteristics
Num C Characteristic Symbol Min Typical Max Unit
1P Input Voltages VVDDR,A 3.13 — 5.5 V
2PVDDA Low Voltage Interrupt Assert Level 1
VDDA Low Voltage Interrupt Deassert Level
1Monitors VDDA, active only in Full Performance Mode. Indicates I/O & ADC performance degradation due to low supply
voltage.
VLVIA
VLVID
4.04
4.19
4.23
4.38
4.40
4.49
V
V
3PVDDX Low Voltage Reset Deassert 234
2Device functionality is guaranteed on power down to the LVR assert level
3Monitors VDDX, active only in Full Performance Mode. MCU is monitored by the POR in RPM (see Figure A-5)
4VLVRXA < VLVRXD. The hysteresis is unspecified and untested.
VLVRXD — 3.05 3.13 V
4PVDDX Low Voltage Reset Assert 234 VLVRXA 2.95 3.02 — V
5TCPMU ACLK frequency
(CPMUACLKTR[5:0] = %000000) fACLK — 10 — KHz
6CTrimmed ACLK internal clock5∆f / fnominal
5The ACLK Trimming CPMUACLKTR[5:0] bits must be set so that fACLK=10KHz.
dfACLK - 5% — + 5% —
7
D
The first period after enabling the counter
by APIFE might be reduced by ACLK start
up delay
tsdel — — 100 us
8DThe first period after enabling the COP
might be reduced by ACLK start up delay tsdel — — 100 us
9
P
Output Voltage Flash
Full Performance Mode
Reduced Power Mode (MCU STOP mode)
VDDF 2.6
1.1
2.82
1.6
2.9
2.98
V
V
10
C
VDDF Voltage Distribution
over input voltage VDDA6
4.5V ≤ VDDA ≤ 5.5V, TA = 27oC
compared to VDDA = 5.0V
6VDDR ≥ 3.13V
∆VDDF -5 0 5 mV
11
C
VDDF Voltage Distribution
over ambient temperature TA
VDDA = 5V, -40°C≤ TA≤ 125°C
compared to VDDF production test value
(see A.15, “ADC Conversion Result
Reference”)
∆VDDF -20 - +20 mV
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1112 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.12 Chip Power-up and Voltage Drops
LVI (low voltage interrupt), POR (power-on reset) and LVRs (low voltage reset) handle chip power-up or
drops of the supply voltage.
Figure A-5. Chip Power-up and Voltage Drops
A.13 MSCAN
Table A-31. MSCAN Wake-up Pulse Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num C Rating Symbol Min Typ Max Unit
1 P MSCAN wakeup dominant pulse filtered tWUP — — 1.5 µs
2 P MSCAN wakeup dominant pulse pass tWUP 5——µs
VLVID
VLVIA
VLVRD
VLVRA
VPORD
LVI
POR
LVR
t
VVDDA/VDDX
VDD
LVI enabled LVI disabled due to LVR
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1113
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
A.14 SPI Timing
This section provides electrical parametrics and ratings for the SPI. In Table A-32 the measurement
conditions are listed.
A.14.1 Master Mode
In Figure A-6 the timing diagram for master mode with transmission format CPHA = 0 is depicted.
Figure A-6. SPI Master Timing (CPHA = 0)
Table A-32. Measurement Conditions
Conditions are 4.5 V < VDD35 < 5.5 V junction temperature from –40°C to +150°C.
Description Value Unit
Drive mode Full drive mode —
Load capacitance CLOAD1,on all outputs
1Timing specified for equal load on all SPI output pins. Avoid asymmetric load.
50 pF
Thresholds for delay measurement points (35% / 65%) VDDX V
SCK
(Output)
SCK
(Output)
MISO
(Input)
MOSI
(Output)
SS
(Output)
1
9
5 6
MSB IN2
Bit MSB-1. . . 1
LSB IN
MSB OUT2 LSB OUT
Bit MSB-1. . . 1
11
4
4
2
10
(CPOL = 0)
(CPOL = 1)
3
13
13
1. If configured as an output.
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, bit 2... MSB.
12
12
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1114 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
In Figure A-7 the timing diagram for master mode with transmission format CPHA=1 is depicted.
Figure A-7. SPI Master Timing (CPHA = 1)
SCK
(Output)
SCK
(Output)
MISO
(Input)
MOSI
(Output)
1
5 6
MSB IN2
Bit MSB-1. . . 1
LSB IN
Master MSB OUT2 Master LSB OUT
Bit MSB-1. . . 1
4
4
9
12 13
11
Port Data
(CPOL = 0)
(CPOL = 1)
Port Data
SS
(Output)
212 13 3
1.If configured as output
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1,bit 2... MSB.
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1115
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
In Table A-33 the timing characteristics for master mode are listed.
A.14.2 Slave Mode
In Figure A-8 the timing diagram for slave mode with transmission format CPHA = 0 is depicted.
Figure A-8. SPI Slave Timing (CPHA = 0)
Table A-33. SPI Master Mode Timing Characteristics
Conditions are 4.5 V < VDD35 < 5.5 V junction temperature from –40°C to +150°C.
Num C Characteristic Symbol Min Typ Max Unit
1 D SCK Frequency fsck 1/2048 — 1/2fbus
1 D SCK Period tsck 2 — 2048 tbus
2 D Enable Lead Time tL— 1/2 — tsck
3 D Enable Trail Time tT— 1/2 — tsck
4 D Clock (SCK) High or Low Time twsck — 1/2 — tsck
5 D Data Setup Time (Inputs) tsu 8——ns
6 D Data Hold Time (Inputs) thi 8——ns
9 D Data Valid after SCK Edge tvsck — — 15 ns
10 D Data Valid after SS fall (CPHA=0) tvss — — 15 ns
11 D Data Hold Time (Outputs) tho 0——ns
12 D Rise and Fall Time Inputs trfi —— 9 ns
13 D Rise and Fall Time Outputs trfo —— 9 ns
SCK
(Input)
SCK
(Input)
MOSI
(Input)
MISO
(Output)
SS
(Input)
1
9
5 6
MSB IN
Bit MSB-1 . . . 1
LSB IN
Slave MSB Slave LSB OUT
Bit MSB-1. . . 1
11
4
4
2
7
(CPOL = 0)
(CPOL = 1)
3
13
NOTE: Not defined
12
12
11
See
13
Note
8
10
See
Note
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1116 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
In Figure A-9 the timing diagram for slave mode with transmission format CPHA = 1 is depicted.
Figure A-9. SPI Slave Timing (CPHA = 1)
SCK
(Input)
SCK
(Input)
MOSI
(Input)
MISO
(Output)
1
5 6
MSB IN
Bit MSB-1 . . . 1
LSB IN
MSB OUT Slave LSB OUT
Bit MSB-1 . . . 1
4
4
9
12 13
11
(CPOL = 0)
(CPOL = 1)
SS
(Input)
212 13
3
NOTE: Not defined
Slave
7
8
See
Note
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1117
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
In Table A-34 the timing characteristics for slave mode are listed.
A.15 ADC Conversion Result Reference
The reference voltage VDDF is measured under the conditions shown in Table A-35. The value stored in
the IFR is the average of eight consecutive conversions at Tj=150 °Cand eight consecutive conversions at
Tj=-40 °C.
Table A-34. SPI Slave Mode Timing Characteristics
Conditions are 4.5 V < VDD35 < 5.5 V junction temperature from –40°C to +150°C.
Num C Characteristic Symbol Min Typ Max Unit
1 D SCK Frequency fsck DC — 1/4fbus
1 D SCK Period tsck 4— tbus
2 D Enable Lead Time tL4— — tbus
3 D Enable Trail Time tT4— — tbus
4 D Clock (SCK) High or Low Time twsck 4— — tbus
5 D Data Setup Time (Inputs) tsu 8— — ns
6 D Data Hold Time (Inputs) thi 8— — ns
7D
Slave Access Time (time to data
active) ta— — 20 ns
8 D Slave MISO Disable Time tdis — — 22 ns
9 D Data Valid after SCK Edge tvsck —— 1
10.5tbus added due to internal synchronization delay
ns
10 D Data Valid after SS fall tvss —— 1ns
11 D Data Hold Time (Outputs) tho 20 — — ns
12 D Rise and Fall Time Inputs trfi —— 9 ns
13 D Rise and Fall Time Outputs trfo —— 9 ns
Table A-35. Measurement Conditions
Description Symbol Value Unit
Regulator supply voltage VDDR 5V
I/O supply voltage VDDX 5V
Analog supply voltage VDDA 5V
ADC reference voltage VRH 5V
ADC clock fADCCLK 2 MHz
ADC sample time tSMP 4 ADC clock cycles
Bus frequency fbus 24 MHz
Junction temperature Tj150 and -40 °C
Code execution from RAM
∞
28 0.5 tbus
⋅+
28 0.5 tbus
⋅+
Electrical Characteristics
MC9S12G Family Reference Manual, Rev.1.06
1118 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
NVM activity none
Table A-35. Measurement Conditions
Description Symbol Value Unit
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1119
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Appendix B
Detailed Register Address Map
Revision History
B.1 Detailed Register Map
The following tables show the detailed register map of the MC9S12G-Family.
NOTE
This is a summary of all register bits implemented on MC9S12G devices.
Each member of the MC9S12G-Family implements the subset of registers,
which is associated with its feature set (see Table 1-1).
Version
Number
Revision
Date Description of Changes
Rev 0.05 30-Aug-2010 • Updated ADCCTL2 register in Appendix B, “Detailed Register Address Map”.
• Updated CPMUOSC register in Appendix B, “Detailed Register Address Map”.
Rev 0.06 18-Oct-2010 • Updated ADC registers in Appendix B, “Detailed Register Address Map”.
Rev 0.07 9-Nov-2010 • Updated CPMU registers in Appendix B, “Detailed Register Address Map”.
Rev 0.08 4-Dec-2010 • Updated PIM registers in Appendix B, “Detailed Register Address Map”.
0x0000–0x0009 Port Integration Module (PIM) Map 1 of 6
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0000 PORTA RPA7 PA6 PA5 PA4 PA3 PA2 PA1 PA 0
W
0x0001 PORTB RPB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0
W
0x0002 DDRA RDDRA7 DDRA6 DDRA5 DDRA4 DDRA3 DDRA2 DDRA1 DDRA0
W
0x0003 DDRB RDDRB7 DDRB6 DDRB5 DDRB4 DDRB3 DDRB2 DDRB1 DDRB0
W
0x0004 PORTC RPC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0
W
0x0005 PORTD RPD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0
W
0x0006 DDRC RDDRC7 DDRC6 DDRC5 DDRC4 DDRC3 DDRC2 DDRC1 DDRC0
W
0x0007 DDRD RDDRD7 DDRD6 DDRD5 DDRD4 DDRD3 DDRD2 DDRD1 DDRD0
W
0x0008 PORTE R000000
PE1 PE0
W
0x0009 DDRE R000000
DDRE1 DDRE0
W
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
1120 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x000A–0x000B Memory Map Control (MMC) Map 1 of 2
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x000A Reserved R00000000
W
0x000B MODE RMODC 0000000
W
0x000C–0x000D Port Integration Module (PIM) Map 2 of 6
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x000C PUCR R0 BKPUE 0PDPEE PUPDE PUPCE PUPBE PUPAE
W
0x000D Reserved R00000000
W
0x000E–0x000F Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x000E-
0x000F Reserved R00000000
W
0x0010–0x0017 Memory Map Control (MMC) Map 2 of 2
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0010 Reserved R00000000
W
0x0011 DIRECT RDP15 DP14 DP13 DP12 DP11 DP10 DP9 DP8
W
0x0012 Reserved R00000000
W
0x0013 MMCCTL R0000000
NVMRES
W
0x0014 Reserved R00000000
W
0x0015 PPAGE R0 0 0 0 PIX3 PIX2 PIX1 PIX0
W
0x0016-
0x0017 Reserved R00000000
W
0x0018–0x0019 Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0018-
0x0019 Reserved R00000000
W
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1121
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x001A–0x001B Device ID Register (PARTIDH/PARTIDL)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x001A PARTIDH R PARTIDH
W
0x001B PARTIDL R PARTIDL
W
0x001C–0x001F Port Integration Module (PIM) Map 3 of 6
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x001C ECLKCTL RNECLK NCLKX2 DIV16 EDIV4 EDIV3 EDIV2 EDIV1 EDIV0
W
0x001D Reserved R00000000
W
0x001E IRQCR RIRQE IRQEN 000000
W
0x001F Reserved R00000000
W
0x0020–0x002F Debug Module (DBG)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0020 DBGC1 RARM 00
BDM DBGBRK 0COMRV
W TRIG
0x0021 DBGSR R TBF 0 0 0 0 SSF2 SSF1 SSF0
W
0x0022 DBGTCR R0TSOURCE 00 TRCMOD 0TALIGN
W
0x0023 DBGC2 R000000 ABCM
W
0x0024 DBGTBH R Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
W
0x0025 DBGTBL R Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
W
0x0026 DBGCNT R1TBF 0 CNT
W
0x0027
DBGSCRX R0 0 0 0 SC3 SC2 SC1 SC0
W
DBGMFR R 0 0 0 0 0 MC2 MC1 MC0
W
0x0028
DBGACTL RSZE SZ TAG BRK RW RWE NDB COMPE
W
DBGBCTL RSZE SZ TAG BRK RW RWE 0COMPE
W
DBGCCTL R0 0 TAG BRK RW RWE 0COMPE
W
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
1122 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x0029 DBGXAH R000000
Bit 17 Bit 16
W
0x002A DBGXAM RBit 15 14 13 12 11 10 9 Bit 8
W
0x002B DBGXAL RBit 7 6 54321Bit 0
W
0x002C DBGADH RBit 15 14 13 12 11 10 9 Bit 8
W
0x002D DBGADL RBit 7 6 54321Bit 0
W
0x002E DBGADHM RBit 15 14 13 12 11 10 9 Bit 8
W
0x002F DBGADLM RBit 7 6 54321Bit 0
W
0x0030–0x033 Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0030-
0x0033 Reserved R00000000
W
0x0034–0x003F Clock and Power Management (CPMU) Map 1 of 2
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0034 CPMU
SYNR
RVCOFRQ[1:0] SYNDIV[5:0]
W
0x0035 CPMU
REFDIV
RREFFRQ[1:0] 00 REFDIV[3:0]
W
0x0036 CPMU
POSTDIV
R0 0 0 POSTDIV[4:0]
W
0x0037 CPMUFLG RRTIF PORF LVRF LOCKIF LOCK ILAF OSCIF UPOSC
W
0x0038 CPMUINT RRTIE 00
LOCKIE 00
OSCIE 0
W
0x0039 CPMUCLKS RPLLSEL PSTP 00
PRE PCE RTI
OSCSEL
COP
OSCSEL
W
0x003A CPMUPLL R0 0 FM1 FM0 0000
W
0x003B CPMURTI RRTDEC RTR6 RTR5 RTR4 RTR3 RTR2 RTR1 RTR0
W
0x003C CPMUCOP RWCOP RSBCK 000
CR2 CR1 CR0
WWRTMASK
0x0020–0x002F Debug Module (DBG)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1123
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x003D Reserved R00000000
W
0x003E Reserved R00000000
W
0x003F CPMU
ARMCOP
R00000000
W Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0040–0x067 Timer Module (TIM)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0040 TIOS RIOS7 IOS6 IOS5 IOS4 IOS3 IOS2 IOS1 IOS0
W
0x0041 CFORC R00000000
W FOC7 FOC6 FOC5 FOC4 FOC3 FOC2 FOC1 FOC0
0x0042 OC7M ROC7M7 OC7M6 OC7M5 OC7M4 OC7M3 OC7M2 OC7M1 OC7M0
W
0x0043 OC7D ROC7D7 OC7D6 OC7D5 OC7D4 OC7D3 OC7D2 OC7D1 OC7D0
W
0x0044 TCNTH RTCNT15 TCNT14 TCNT13 TCNT12 TCNT11 TCNT10 TCNT9 TCNT8
W
0x0045 TCNTL RTCNT7 TCNT6 TCNT5 TCNT4 TCNT3 TCNT2 TCNT1 TCNT0
W
0x0046 TSCR1 RTEN TSWAI TSFRZ TFFCA PRNT 000
W
0x0047 TTOV RTOV7 TOV6 TOV5 TOV4 TOV3 TOV2 TOV1 TOV0
W
0x0048 TCTL1 ROM7 OL7 OM6 OL6 OM5 OL5 OM4 OL4
W
0x0049 TCTL2 ROM3 OL3 OM2 OL2 OM1 OL1 OM0 OL0
W
0x004A TCTL3 REDG7B EDG7A EDG6B EDG6A EDG5B EDG5A EDG4B EDG4A
W
0x004B TCTL4 REDG3B EDG3A EDG2B EDG2A EDG1B EDG1A EDG0B EDG0A
W
0x004C TIE RC7I C6I C5I C4I C3I C2I C1I C0I
W
0x004D TSCR2 RTOI 000
TCRE PR2 PR1 PR0
W
0x004E TFLG1 RC7F C6F C5F C4F C3F C2F C1F C0F
W
0x004F TFLG2 RTOF 0000000
W
0x0034–0x003F Clock and Power Management (CPMU) Map 1 of 2
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
1124 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x0050
–
0x005F
TCxH – TCxL
RBit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
W
RBit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
W
0x0060 PACTL R0 PAEN PAMOD PEDGE CLK1 CLK0 PAOVI PAI
W
0x0061 PAFLG R000000
PAOVF PAIF
W
0x0062 PACNTH RPACNT15 PACNT14 PACNT13 PACNT12 PACNT11 PACNT10 PACNT9 PACNT8
W
0x0063 PACNTL RPACNT7 PACNT6 PACNT5 PACNT4 PACNT3 PACNT2 PACNT1 PACNT0
W
0x0064-
0x006B Reserved R
W
0x006C OCPD ROCPD7 OCPD6 OCPD5 OCPD4 OCPD3 OCPD2 OCPD1 OCPD0
W
0x006D Reserved R
W
0x006E PTPSR RPTPS7 PTPS6 PTPS5 PTPS4 PTPS3 PTPS2 PTPS1 PTPS0
W
0x006F Reserved R
W
0x0070–0x09F Analog to Digital Converter (ADC)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0070 ATDCTL0 RReserved 000
WRAP3 WRAP2 WRAP1 WRAP0
W
0x0071 ATDCTL1 RETRIGSEL SRES1 SRES0 SMP_DIS ETRIGCH3 ETRIGCH2 ETRIGCH1 ETRIGCH0
W
0x0072 ATDCTL2 R0 AFFC Reseved ETRIGLE ETRIGP ETRIGE ASCIE ACMPIE
W
0x0073 ATDCTL3 RDJM S8C S4C S2C S1C FIFO FRZ1 FRZ0
W
0x0074 ATDCTL4 RSMP2 SMP1 SMP0 PRS[4:0]
W
0x0075 ATDCTL5 R0 SC SCAN MULT CD CC CB CA
W
0x0076 ATDSTAT0 RSCF 0ETORF FIFOR CC3 CC2 CC1 CC0
W
0x0077 Reserved R00000000
W
0x0078 ATDCMPEH RCMPE[15:8]
W
0x0079 ATDCMPEL RCMPE[7:0]
W
0x0040–0x067 Timer Module (TIM)
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1125
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x007A ATDSTAT2H R CCF[15:8]
W
0x007B ATDSTAT2L R CCF[7:0]
W
0x007C ATDDIENH RIEN[15:8]
W
0x007D ATDDIENL RIEN[7:0]
W
0x007E ATDCMPHTH RCMPHT[15:8]
W
0x007F ATDCMPHTL RCMPHT[7:0]
W
0x0080-
0x0091 ATDDR0 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0082-
0x0083 ATDDR1 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0084-
0x0085 ATDDR2 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0086-
0x0087 ATDDR3 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0088-
0x0089 ATDDR4 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x008A-
0x008B ATDDR5 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x008C-
0x008D ATDDR6 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x008E-
0x008F ATDDR7 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0090-
0x0091 ATDDR8 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0092-
0x0093 ATDDR9 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0094-
0x0095 ATDDR10 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0096-
0x0097 ATDDR11 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0098-
0x0099 ATDDR12 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x009A-
0x009B ATDDR13 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x009C-
0x009D ATDDR14 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x009E-
0x009F ATDDR15 RSee Section 14.3.2.12.1, “Left Justified Result Data (DJM=0)”
and Section 14.3.2.12.2, “Right Justified Result Data (DJM=1)”
W
0x0070–0x09F Analog to Digital Converter (ADC)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
1126 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x00A0–0x0C7 Pulse-Width-Modulator (PWM)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x00A0 PWME RPWME7 PWME6 PWME5 PWME4 PWME3 PWME2 PWME1 PWME0
W
0x00A1 PWMPOL RPPOL7 PPOL6 PPOL5 PPOL4 PPOL3 PPOL2 PPOL1 PPOL0
W
0x00A2 PWMCLK RPCLK7 PCLKL6 PCLK5 PCLK4 PCLK3 PCLK2 PCLK1 PCLK0
W
0x00A3 PWMPRCLK R0 PCKB2 PCKB1 PCKB0 0PCKA2 PCKA1 PCKA0
W
0x00A4 PWMCAE RCAE7 CAE6 CAE5 CAE4 CAE3 CAE2 CAE1 CAE0
W
0x00A5 PWMCTL RCON67 CON45 CON23 CON01 PSWAI PFRZ 00
W
0x00A6 PWMCLKAB RPCLKAB7 PCLKAB6 PCLKAB5 PCLKAB4 PCLKAB3 PCLKAB2 PCLKAB1 PCLKAB0
W
0x00A7 Reserved R00000000
W
0x00A8 PWMSCLA RBit 7 6 5 4 3 2 1 Bit 0
W
0x00A9 PWMSCLB RBit 7 6 5 4 3 2 1 Bit 0
W
0x00AA -
0x00AB Reserved R00000000
W
0x00AC PWMCNT0 R Bit 7 6 5 4 3 2 1 Bit 0
W00000000
0x00AD PWMCNT1 R Bit 7 6 5 4 3 2 1 Bit 0
W00000000
0x00AE PWMCNT2 R Bit 7 6 5 4 3 2 1 Bit 0
W00000000
0x00AF PWMCNT3 R Bit 7 6 5 4 3 2 1 Bit 0
W00000000
0x0B0 PWMCNT4 R Bit 7 6 5 4 3 2 1 Bit 0
W00000000
0x00B1 PWMCNT5 R Bit 7 6 5 4 3 2 1 Bit 0
W00000000
0x00B2 PWMCNT6 R Bit 7 6 5 4 3 2 1 Bit 0
W00000000
0x00B3 PWMCNT7 R Bit 7 6 5 4 3 2 1 Bit 0
W00000000
0x00B4 PWMPER0 RBit 7 6 5 4 3 2 1 Bit 0
W
0x00B5 PWMPER1 RBit 7 6 5 4 3 2 1 Bit 0
W
0x00B6 PWMPER2 RBit 7 6 5 4 3 2 1 Bit 0
W
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1127
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x00B7 PWMPER3 RBit 7 6 5 4 3 2 1 Bit 0
W
0x00B8 PWMPER4 RBit 7 6 5 4 3 2 1 Bit 0
W
0x00B9 PWMPER5 RBit 7 6 5 4 3 2 1 Bit 0
W
0x00BA PWMPER6 RBit 7 6 5 4 3 2 1 Bit 0
W
0x00BB PWMPER7 RBit 7 6 5 4 3 2 1 Bit 0
W
0x00BC PWMDTY0 RBit 7 6 5 4 3 2 1 Bit 0
W
0x00BD PWMDTY1 RBit 7 6 5 4 3 2 1 Bit 0
W
0x00BE PWMDTY2 RBit 7 6 5 4 3 2 1 Bit 0
W
0x00BF PWMDTY3 RBit 7 6 5 4 3 2 1 Bit 0
W
0x00C0 PWMDTY4 RBit 7 6 5 4 3 2 1 Bit 0
W
0x00C1 PWMDTY5 RBit 7 6 5 4 3 2 1 Bit 0
W
0x00C2 PWMDTY6 RBit 7 6 5 4 3 2 1 Bit 0
W
0x00C3 PWMDTY7 RBit 7 6 5 4 3 2 1 Bit 0
W
0x00C4-
0x00C7 Reserved R00000000
W
0x00C8–0x0CF Serial Communication Interface (SCI0)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x00C8 SCI0BDH RIREN TNP1 TNP0 SBR12 SBR11 SBR10 SBR9 SBR8
W
0x00C8 SCI0ASR1 RRXEDGIF 0000
BERRV BERRIF BKDIF
W
0x00C9 SCI0BDL RSBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0
W
0x00C9 SCI0ACR1 RRXEDGIE 00000
BERRIE BKDIE
W
0x00CA SCI0CR1 RLOOPS SCISWAI RSRC M WAKE ILT PE PT
W
0x00CA SCI0ACR2 R00000
BERRM1 BERRM0 BKDFE
W
0x00CB SCI0CR2 RTIE TCIE RIE ILIE TE RE RWU SBK
W
0x00A0–0x0C7 Pulse-Width-Modulator (PWM)
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
1128 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x00CC SCI0SR1 R TDRE TC RDRF IDLE OR NF FE PF
W
0x00CD SCI0SR2 RAMAP 00
TXPOL RXPOL BRK13 TXDIR RAF
W
0x00CE SCI0DRH RR8 T8 000000
W
0x00CF SCI0DRL RR7R6R5R4R3R2R1R0
WT7T6T5T4T3T2T1T0
0x00D0–0x0D7 Serial Communication Interface (SCI1)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x00D0 SCI1BDH RIREN TNP1 TNP0 SBR12 SBR11 SBR10 SBR9 SBR8
W
0x00D0 SCI1ASR1 RRXEDGIF 0000
BERRV BERRIF BKDIF
W
0x00D1 SCI1BDL RSBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0
W
0x00D1 SCI1ACR1 RRXEDGIE 00000
BERRIE BKDIE
W
0x00D2 SCI1CR1 RLOOPS SCISWAI RSRC M WAKE ILT PE PT
W
0x00D2 SCI1ACR2 R00000
BERRM1 BERRM0 BKDFE
W
0x00D3 SCI1CR2 RTIE TCIE RIE ILIE TE RE RWU SBK
W
0x00D4 SCI1SR1 R TDRE TC RDRF IDLE OR NF FE PF
W
0x00D5 SCI1SR2 RAMAP 00
TXPOL RXPOL BRK13 TXDIR RAF
W
0x00D6 SCI1DRH RR8 T8 000000
W
0x00D7 SCI1DRL RR7R6R5R4R3R2R1R0
WT7T6T5T4T3T2T1T0
0x00D8–0x0DF Serial Peripheral Interface (SPI0)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x00D8 SPI0CR1 RSPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE
W
0x00D9 SPI0CR2 R0 XFRW 0MODFEN BIDIROE 0SPISWAI SPC0
W
0x00DA SPI0BR R0 SPPR2 SPPR1 SPPR0 0SPR2 SPR1 SPR0
W
0x00DB SPI0SR R SPIF 0 SPTEF MODF 0 0 0 0
W
0x00C8–0x0CF Serial Communication Interface (SCI0)
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1129
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x00DC SPI0DRH R R15 R14 R13 R12 R11 R10 R9 R8
W T15 T14 T13 T12 T11 T10 T9 T8
0x00DD SPI0DRL RR7R6R5R4R3R2R1R0
WT7T6T5T4T3T2T1T0
0x00DE-
0x00DF Reserved R
W
0x00E0–0x0E7 Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x00E0-
0x00E7 Reserved R00000000
W
0x00E8–0x0EF Serial Communication Interface (SCI2)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x00E8 SCI2BDH RIREN TNP1 TNP0 SBR12 SBR11 SBR10 SBR9 SBR8
W
0x00E8 SCI2ASR1 RRXEDGIF 0000
BERRV BERRIF BKDIF
W
0x00E9 SCI2BDL RSBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0
W
0x00E9 SCI2ACR1 RRXEDGIE 00000
BERRIE BKDIE
W
0x00EA SCI2CR1 RLOOPS SCISWAI RSRC M WAKE ILT PE PT
W
0x00EA SCI2ACR2 R00000
BERRM1 BERRM0 BKDFE
W
0x00EB SCI2CR2 RTIE TCIE RIE ILIE TE RE RWU SBK
W
0x00EC SCI2SR1 R TDRE TC RDRF IDLE OR NF FE PF
W
0x00ED SCI2SR2 RAMAP 00
TXPOL RXPOL BRK13 TXDIR RAF
W
0x00EE SCI2DRH RR8 T8 000000
W
0x00EF SCI2DRL RR7R6R5R4R3R2R1R0
WT7T6T5T4T3T2T1T0
0x00F0–0x0F7 Serial Peripheral Interface (SPI1)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x00F0 SPI1CR1 RSPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE
W
0x00F1 SPI1CR2 R0 XFRW 0MODFEN BIDIROE 0SPISWAI SPC0
W
0x00D8–0x0DF Serial Peripheral Interface (SPI0)
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
1130 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x00F2 SPI1BR R0 SPPR2 SPPR1 SPPR0 0SPR2 SPR1 SPR0
W
0x00F3 SPI1SR R SPIF 0 SPTEF MODF 0 0 0 0
W
0x00F4 SPI1DRH R R15 R14 R13 R12 R11 R10 R9 R8
W T15 T14 T13 T12 T11 T10 T9 T8
0x00F5 SPI1DRL RR7R6R5R4R3R2R1R0
WT7T6T5T4T3T2T1T0
0x00F6-
0x00F7 Reserved R
W
0x00F8–0x0FF Serial Peripheral Interface (SPI2)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x00F8 SPI2CR1 RSPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE
W
0x00F9 SPI2CR2 R0 XFRW 0MODFEN BIDIROE 0SPISWAI SPC0
W
0x00FA SPI2BR R0 SPPR2 SPPR1 SPPR0 0SPR2 SPR1 SPR0
W
0x00FB SPI2SR R SPIF 0 SPTEF MODF 0 0 0 0
W
0x00FC SPI2DRH R R15 R14 R13 R12 R11 R10 R9 R8
W T15 T14 T13 T12 T11 T10 T9 T8
0x00FD SPI2DRL RR7R6R5R4R3R2R1R0
WT7T6T5T4T3T2T1T0
0x00FE-
0x00FF Reserved R
W
0x0100–0x0113 Flash Module (FTMRG)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0100 FCLKDIV R FDIVLD FDIVLCK FDIV5 FDIV4 FDIV3 FDIV2 FDIV1 FDIV0
W
0x0101 FSEC R KEYEN1 KEYEN0 RNV5 RNV4 RNV3 RNV2 SEC1 SEC0
W
0x0102 FCCOBIX R00000
CCOBIX2 CCOBIX1 CCOBIX0
W
0x0103 Reserved R00000000
W
0x0104 FCNFG RCCIE 00
IGNSF 00
FDFD FSFD
W
0x0105 FERCNFG R000000
DFDIE SFDIE
W
0x0106 FSTAT RCCIF 0ACCERR FPVIOL MGBUSY RSVD MGSTAT1 MGSTAT0
W
0x00F0–0x0F7 Serial Peripheral Interface (SPI1)
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1131
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x0107 FERSTAT R000000
DFDIF SFDIF
W
0x0108 FPROT RFPOPEN RNV6 FPHDIS FPHS1 FPHS0 FPLDIS FPLS1 FPLS0
W
0x0109 DFPROT RDPOPEN 000
DPS3 DPS2 DPS1 DPS0
W
0x010A FCCOBHI RCCOB15 CCOB14 CCOB13 CCOB12 CCOB11 CCOB10 CCOB9 CCOB8
W
0x010B FCCOBLO RCCOB7 CCOB6 CCOB5 CCOB4 CCOB3 CCOB2 CCOB1 CCOB0
W
0x010C Reserved R00000000
W
0x010D Reserved R00000000
W
0x010E Reserved R00000000
W
0x010F Reserved R00000000
W
0x0110 FOPT R NV7 NV6 NV5 NV4 NV3 NV2 NV1 NV0
W
0x0111 Reserved R00000000
W
0x0112 Reserved R00000000
W
0x0113 Reserved R00000000
W
0x0114–0x11F Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0114-
0x011F Reserved R00000000
W
0x0120 Interrupt Module (INT)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0120 IVBR RIVB_ADDR[7:0]
W
0x0121–0x13F Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0121-
0x013F Reserved R00000000
W
0x0100–0x0113 Flash Module (FTMRG)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
1132 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x0140–0x017F CAN Controller (MSCAN)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0140 CANCTL0 RRXFRM RXACT CSWAI SYNCH TIME WUPE SLPRQ INITRQ
W
0x0141 CANCTL1 RCANE CLKSRC LOOPB LISTEN BORM WUPM SLPAK INITAK
W
0x0142 CANBTR0 RSJW1 SJW0 BRP5 BRP4 BRP3 BRP2 BRP1 BRP0
W
0x0143 CANBTR1 RSAMP TSEG22 TSEG21 TSEG20 TSEG13 TSEG12 TSEG11 TSEG10
W
0x0144 CANRFLG RWUPIF CSCIF RSTAT1 RSTAT0 TSTAT1 TSTAT0 OVRIF RXF
W
0x0145 CANRIER RWUPIE CSCIE RSTATE1 RSTATE0 TSTATE1 TSTATE0 OVRIE RXFIE
W
0x0146 CANTFLG R0 0 0 00
TXE2 TXE1 TXE0
W
0x0147 CANTIER R00000
TXEIE2 TXEIE1 TXEIE0
W
0x0148 CANTARQ R00000
ABTRQ2 ABTRQ1 ABTRQ0
W
0x0149 CANTAAK R00000
ABTAK2 ABTAK1 ABTAK0
W
0x014A CANTBSEL R00000
TX2 TX1 TX0
W
0x014B CANIDAC R0 0 IDAM1 IDAM0 0 IDHIT2 IDHIT1 IDHIT0
W
0x014C Reserved R00000000
W
0x014D CANMISC R0000000
BOHOLD
W
0x014E CANRXERR R RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0
W
0x014F CANTXERR R TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0
W
0x0150-
0x0153 CANIDAR0–3 RAC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0
W
0x0154-
0x0157 CANIDMRx RAM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0
W
0x0158-
0x015B CANIDAR4–7 RAC7 AC6 AC5 AC4 AC3 AC2 AC1 AC0
W
0x015C-
0x015F CANIDMR4–7 RAM7 AM6 AM5 AM4 AM3 AM2 AM1 AM0
W
0x0160-
0x016F CANRXFG RSee Section 16.3.3, “Programmer’s Model of Message Storage”
W
0x0170-
0x017F CANTXFG RSee Section 16.3.3, “Programmer’s Model of Message Storage”
W
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1133
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x0180–0x023F Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0180-
0x023F Reserved R00000000
W
0x0240–0x025F Port Integration Module (PIM) Map 4 of 6
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0240 PTT RPTT7 PTT6 PTT5 PTT4 PTT3 PTT2 PTT1 PTT0
W
0x0241 PTIT R PTIT7 PTIT6 PTIT5 PTIT4 PTIT3 PTIT2 PTIT1 PTIT0
W
0x0242 DDRT RDDRT7 DDRT6 DDRT5 DDRT4 DDRT3 DDRT2 DDRT1 DDRT0
W
0x0243 Reserved R00000000
W
0x0244 PERT RPERT7 PERT6 PERT5 PERT4 PERT3 PERT2 PERT1 PERT0
W
0x0245 PPST RPPST7 PPST6 PPST5 PPST4 PPST3 PPST2 PPST1 PPST0
W
0x0246-
0x0247 Reserved R00000000
W
0x0248 PTS RPTS7 PTS6 PTS5 PTS4 PTS3 PTS2 PTS1 PTS0
W
0x0249 PTIS R PTIS7 PTIS6 PTIS5 PTIS4 PTIS3 PTIS2 PTIS1 PTIS0
W
0x024A DDRS RDDRS7 DDRS6 DDRS5 DDRS4 DDRS3 DDRS2 DDRS1 DDRS0
W
0x024B Reserved R00000000
W
0x024C PERS RPERS7 PERS6 PERS5 PERS4 PERS3 PERS2 PERS1 PERS0
W
0x024D PPSS RPPSS7 PPSS6 PPSS5 PPSS4 PPSS3 PPSS2 PPSS1 PPSS0
W
0x024E WOMS RWOMS7 WOMS6 WOMS5 WOMS4 WOMS3 WOMS2 WOMS1 WOMS0
W
0x024F PRR0 RPRR0P3 PRR0P2 PRR0T31 PRR0T30 PRR0T21 PRR0T20 PRR0S1 PRR0S0
W
0x0250 PTM R0000
PTM3 PTM2 PTM1 PTM0
W
0x0251 PTIM R 0 0 0 0 PTIM3 PTIM2 PTIM1 PTIM0
W
0x0252 DDRM R0000
DDRM3 DDRM2 DDRM1 DDRM0
W
0x0253 Reserved R00000000
W
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
1134 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x0254 PERM R0000
RDRM3 RDRM2 RDRM1 RDRM0
W
0x0255 PPSM R0000
PPSM3 PPSM2 PPSM1 PPSM0
W
0x0256 WOMM R0000
WOMM3 WOMM2 WOMM1 WOMM0
W
0x0257 PKGCR RAPICLKS7 0000
PKGCR2 PKGCR1 PKGCR0
W
0x0258 PTP RPTP7 PTP6 PTP5 PTP4 PTP3 PTP2 PTP1 PTP0
W
0x0259 PTIP R PTIP7 PTIP6 PTIP5 PTIP4 PTIP3 PTIP2 PTIP1 PTIP0
W
0x025A DDRP RDDRP7 DDRP6 DDRP5 DDRP4 DDRP3 DDRP2 DDRP1 DDRP0
W
0x025B Reserved R00000000
W
0x025C PERP RPERP7 PERP6 PERP5 PERP4 PERP3 PERP2 PERP1 PERP0
W
0x025D PPSP RPPSP7 PPSP6 PPSP5 PPSP4 PPSP3 PPSP2 PPSP1 PPSP0
W
0x025E PIEP RPIEP7 PIEP6 PIEP5 PIEP4 PIEP3 PIEP2 PIEP1 PIEP0
W
0x025F PIFP RPIFP7 PIFP6 PIFP5 PIFP4 PIFP3 PIFP2 PIFP1 PIFP0
W
0x0260–0x0261 Analog Comparator(ACMP)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
W
0x0260 ACMPC RACIE ACOPE ACICE 0ACMOD1 ACMOD0 0ACE
W
0x0261 ACMPS RACIF ACO 0 0 0 0 0 0
W
0x0262–0x0275 Port Integration Module (PIM) Map 5 of 6
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0262-
0x0267 Reserved R00000000
W
0x0268 PTJ RPTJ7 PTJ6 PTJ5 PTJ4 PTJ3 PTJ2 PTJ1 PTJ0
W
0x0269 PTIJ R PTIJ7 PTIJ6 PTIJ5 PTIJ4 PTIJ3 PTIJ2 PTIJ1 PTIJ0
W
0x026A DDRJ RDDRJ7 DDRJ6 DDRJ5 DDRJ4 DDRJ3 DDRJ2 DDRJ1 DDRJ0
W
0x0240–0x025F Port Integration Module (PIM) Map 4 of 6
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1135
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x026B Reserved R00000000
W
0x026C PERJ RPERJ7 PERJ6 PERJ5 PERJ4 PERJ3 PERJ2 PERJ1 PERJ0
W
0x026D PPSJ RPPSJ7 PPSJ6 PPSJ5 PPSJ4 PPSJ3 PPSJ2 PPSJ1 PPSJ0
W
0x026E PIEJ RPIEJ7 PIEJ6 PIEJ5 PIEJ4 PIEJ3 PIEJ2 PIEJ1 PIEJ0
W
0x026F PIFJ RPIFJ7 PIFJ6 PIFJ5 PIFJ4 PIFJ3 PIFJ2 PIFJ1 PIFJ0
W
0x0270 PT0AD RPT0AD7 PT0AD6 PT0AD5 PT0AD4 PT0AD3 PT0AD2 PT0AD1 PT0AD0
W
0x0271 PT1AD RPT1AD7 PT1AD6 PT1AD5 PT1AD4 PT1AD3 PT1AD2 PT1AD1 PT1AD0
W
0x0272 PTI0AD RPTI0AD7 PTI0AD6 PTI0AD5 PTI0AD4 PTI0AD3 PTI0AD2 PTI0AD1 PTI0AD0
W
0x0273 PTI1AD RPTI1AD7 PTI1AD6 PTI1AD5 PTI1AD4 PTI1AD3 PTI1AD2 PTI1AD1 PTI1AD0
W
0x0274 DDR0AD RDDR0AD7 DDR0AD6 DDR0AD5 DDR0AD4 DDR0AD3 DDR0AD2 DDR0AD1 DDR0AD0
W
0x0275 DDR1AD RDDR1AD7 DDR1AD6 DDR1AD5 DDR1AD4 DDR1AD3 DDR1AD2 DDR1AD1 DDR1AD0
W
0x0276 Reference Voltage Attenuator (RVA)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0276 RVACTL R0000000
RVAON
W
0x0277–0x027F Port Integration Module (PIM) Map 6 of 6
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0277 PRR1 R0000000
PRR1AN
W
0x0278 PER0AD RPER0AD7 PER0AD6 PER0AD5 PER0AD4 PER0AD3 PER0AD2 PER0AD1 PER0AD0
W
0x0279 PER1AD RPER1AD7 PER1AD6 PER1AD5 PER1AD4 PER1AD3 PER1AD2 PER1AD1 PER1AD0
W
0x027A PPS0AD RPPS0AD7 PPS0AD6 PPS0AD5 PPS0AD4 PPS0AD3 PPS0AD2 PPS0AD1 PPS0AD0
W
0x027B PPS1AD RPPS1AD7 PPS1AD6 PPS1AD5 PPS1AD4 PPS1AD3 PPS1AD2 PPS1AD1 PPS1AD0
W
0x027C PIE0AD RPIE0AD7 PIE0AD6 PIE0AD5 PIE0AD4 PIE0AD3 PIE0AD2 PIE0AD1 PIE0AD0
W
0x0262–0x0275 Port Integration Module (PIM) Map 5 of 6
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
1136 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x027D PIE1AD RPIE1AD7 PIE1AD6 PIE1AD5 PIE1AD4 PIE1AD3 PIE1AD2 PIE1AD1 PIE1AD0
W
0x027E PIF0AD RPIF0AD7 PIF0AD6 PIF0AD5 PIF0AD4 PIF0AD3 PIF0AD2 PIF0AD1 PIF0AD0
W
0x027F PIF1AD RPIF1AD7 PIF1AD6 PIF1AD5 PIF1AD4 PIF1AD3 PIF1AD2 PIF1AD1 PIF1AD0
W
0x0288–0x2EF Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0288-
0x02EF Reserved R00000000
W
0x02F0–0x02FF Clock and Power Management (CPMU) Map 2 of 2
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x02F0 Reserved R00000000
W
0x02F1 CPMULVCTL R00000LVDS
LVIE LVIF
W
0x02F2 CPMUAPICTL RAPICLK 00
APIES APIEA APIFE APIE APIF
W
0x02F3 CPMUACLKTR RACLKTR5 ACLKTR4 ACLKTR3 ACLKTR2 ACLKTR1 ACLKTR0 00
W
0x02F4 CPMUAPIRH RAPIR15 APIR14 APIR13 APIR12 APIR11 APIR10 APIR9 APIR8
W
0x02F5 CPMUAPIRL RAPIR7 APIR6 APIR5 APIR4 APIR3 APIR2 APIR1 APIR0
W
0x02F6 Reserved R00000000
W
0x02F7 Reserved R00000000
W
0x02F8 CPMU
IRCTRIMH
RTCTRIM[3:0] 00IRCTRIM[9:8]
W
0x02F9 CPMU
IRCTRIML
RIRCTRIM[7:0]
W
0x02FA CPMUOSC ROSCE Reserved OSCPINS_EN Reserved
W
0x02FB CPMUPROT R0000000
PROT
W
0x02FC Reserved R00000000
W
0x02FD-
0x02FF Reserved R00000000
W
0x0277–0x027F Port Integration Module (PIM) Map 6 of 6
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1137
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x0300–0x03BF Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x0300-
0x03BF Reserved R00000000
W
0x03C0–0x03C7 Digital to Analog Converter (DAC0)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x03C0 DAC0CTL RFVR Drive 000 Mode[2:0]
W
0x03C1 Reserved R00000000
W
0x03C2 DAC0VOLTAGE RVoltage[7:0]
W
0x03C3 Reserved R00000000
W
0x03C4 Reserved R00000000
W
0x03C5 Reserved R00000000
W
0x03C6 Reserved R00000000
W
0x03C7 Reserved R00000000
W
0x03C8–0x03CF Digital to Analog Converter (DAC1)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x03C8 DAC1CTL RFVR Drive 000 Mode[2:0]
W
0x03C9 Reserved R00000000
W
0x03CA DAC1VOLTAGE RVoltage[7:0]
W
0x03CB Reserved R00000000
W
0x03CC Reserved R00000000
W
0x03CD Reserved R00000000
W
0x03CE Reserved R00000000
W
0x03CF Reserved R00000000
W
Detailed Register Address Map
MC9S12G Family Reference Manual, Rev.1.06
1138 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
0x03D0–0x03FF Reserved
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x03D0-
0x03FF Reserved R00000000
W
Ordering Information
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1139
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Appendix C
Ordering Information
The following figure provides an ordering partnumber example for the devices covered by this data book.
There are two options when ordering a device. Customers must choose between ordering either the
mask-specific partnumber or the generic / mask-independent partnumber. Ordering the mask-specific
partnumber enables the customer to specify which particular maskset they will receive whereas ordering
the generic maskset means that FSL will ship the currently preferred maskset (which may change over
time).
In either case, the marking on the device will always show the generic / mask-independent partnumber and
the mask set number.
NOTE
The mask identifier suffix and the Tape & Reel suffix are always both omitted from the
partnumber which is actually marked on the device.
For specific partnumbers to order, please contact your local sales office. The below figure illustrates the
structure of a typical mask-specific ordering number for the MC9S12G devices
Ordering Information
MC9S12G Family Reference Manual, Rev.1.06
1140 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
S 9 S12 G128 F0 M LL R
Package Option:
Temperature Option:
Device Title
Controller Family
C = -40˚C to 85˚C
V = -40˚C to 105˚C
M = -40˚C to 125˚C
TJ = 20 TSSOP
LC = 32 LQFP
LF = 48 LQFP
Status / Partnumber type:
S or SC = Maskset specific partnumber
MC = Generic / mask-independent partnumber
P or PC = prototype status (pre qualification)
Main Memory Type:
9 = Flash
3 = ROM (if available)
Maskset identifier Suffix:
First digit usually references wafer fab
Second digit usually differentiates mask rev
(This suffix is omitted in generic partnumbers)
Tape & Reel:
R = Tape & Reel
No R = No Tape & Reel
LH = 64 LQFP
LL = 100 LQFP
FT = 48 QFN
Package Information
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1141
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Appendix D
Package Information
Package Information
MC9S12G Family Reference Manual, Rev.1.06
1142 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
D.1 100 LQFP
Package Information
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1143
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Package Information
MC9S12G Family Reference Manual, Rev.1.06
1144 Freescale Semiconductor
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Package Information
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1145
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D.2 64 LQFP
Package Information
MC9S12G Family Reference Manual, Rev.1.06
1146 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Package Information
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1147
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Package Information
MC9S12G Family Reference Manual, Rev.1.06
1148 Freescale Semiconductor
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D.3 48 LQFP
Package Information
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1149
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Package Information
MC9S12G Family Reference Manual, Rev.1.06
1150 Freescale Semiconductor
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D.4 48 QFN
Package Information
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1151
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Package Information
MC9S12G Family Reference Manual, Rev.1.06
1152 Freescale Semiconductor
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Package Information
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1153
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D.5 32 LQFP
Package Information
MC9S12G Family Reference Manual, Rev.1.06
1154 Freescale Semiconductor
This document is valid for S12GN16, S12GN32, S12GN48, S12G96, S12G128, S12G192, S12GA192, S12D240, and S12GA240 devices. All information related to other devices is preliminary.
Package Information
MC9S12G Family Reference Manual, Rev.1.06
Freescale Semiconductor 1155
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Package Information
MC9S12G Family Reference Manual, Rev.1.06
1156 Freescale Semiconductor
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D.6 20 TSSOP
Package Information
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Package Information
MC9S12G Family Reference Manual, Rev.1.06
1158 Freescale Semiconductor
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Package Information
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.
Package Information
MC9S12G Family Reference Manual, Rev.1.06
1160 Freescale Semiconductor
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© Freescale Semiconductor, Inc. 2006
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