06035A - AVX Corporation - Product.Network

C0G (NP0) Dielectric

General Specifications

C0G (NP0) is the most popular formulation of the “tempera-

ture-compensating,” EIA Class I ceramic materials. Modern

C0G (NP0) formulations contain neodymium, samarium and

other rare earth oxides.

C0G (NP0) ceramics offer one of the most stable capacitor

dielectrics available. Capacitance change with temperature

is 0 ±30ppm/°C which is less than ±0.3% ∆C from -55°C

to +125°C. Capacitance drift or hysteresis for C0G (NP0)

ceramics is negligible at less than ±0.05% versus up to

±2% for films. Typical capacitance change with life is less

than ±0.1% for C0G (NP0), one-fifth that shown by most

other dielectrics. C0G (NP0) formulations show no aging

characteristics.

The C0G (NP0) formulation usually has a “Q” in excess

of 1000 and shows little capacitance or “Q” changes with

frequency. Their dielectric absorption is typically less than

0.6% which is similar to mica and most films.

Capacitance Range 0.5 pF to .1 µF (1.0 ±0.2 Vrms, 1kHz, for ≤100 pF use 1 MHz)

Capacitance Tolerances Preferred ±5%, ±10%

others available: ±.25 pF, ±.5 pF, ±1% (≥25pF), ±2%(≥13pF), ±20%

For values ≤10 pF preferred tolerance is ±.5 pF, also available ±.25 pF.

Operating Temperature Range -55°C to +125°C

Temperature Characteristic 0 ± 30 ppm/°C (EIA C0G)

Voltage Ratings 25, 50, 100 & 200 VDC (+125°C)

Dissipation Factor and “Q” For values >30 pF: 0.1% max. (+25°C and +125°C)

For values ≤30 pF: “Q” = 400 + 20 x C (C in pF)

Insulation Resistance (+25°C, RVDC) 100,000 megohms min. or 1000 MΩ- µF min., whichever is less

Insulation Resistance (+125°C, RVDC) 10,000 megohms min. or 100 MΩ- µF min., whichever is less

Dielectric Strength 250% of rated voltage for 5 seconds at 50 mamp max. current

Test Voltage 1 ± 0.2 Vrms

Test Frequency For values ≤100 pF: 1 MHz

For values >100 pF: 1 KHz

PERFORMANCE CHARACTERISTICS

0805

Size

(L" x W")

Voltage

25V = 3

50V = 5

100V = 1

200V = 2

Dielectric

C0G (NP0) = A

101

Capacitance

Code

Capacitance

Tolerance

Preferred

K = ±10%

J = ± 5%

Failure

Rate

A = Not

Applicable

Terminations

T = Plated Ni

and Solder

Packaging

2 = 7" Reel

4 = 13" Reel

Special

Code

A = Std.

Product

PART NUMBER (see page 3 for complete part number explanation)

C0G (NP0) Dielectric

Typical Characteristic Curves**

Typical Capacitance Change

Envelope: 0 ± 30 ppm/°C

% ⌬ Capacitance

+0.5

-0.5

-55 -35 -15 +5 +25 +45 +65 +85 +105 +125

Temperature °C

Temperature Coefficient

Insulation Resistance (Ohm-Farads)

1,000

10,000

100

0+20 +25 +40 +60 +80

Temperature °C

Insulation Resistance vs Temperature

+100

Impedance, ⍀

10 100 1000

Frequency, MHz

Variation of Impedance with Chip Size

Impedance vs. Frequency

1000 pF - C0G (NP0)

1.0

0.1

1206

0805

1812

1210

Impedance, ⍀

10 100 1000

Frequency, MHz

Variation of Impedance with Ceramic Formulation

Impedance vs. Frequency

1000 pF - C0G (NP0) vs X7R

0805

0.10

0.01

1.00

X7R

NPO

10.00

% ⌬ Capacitance

-1

-2

1KHz 10 KHz 100 KHz 1 MHz 10 MHz

Frequency

⌬ Capacitance vs. Frequency

* Standard Sizes

** For additional information on performance changes with operating conditions consult AVX’s software SpiCap.

SUMMARY OF CAPACITANCE RANGES VS. CHIP SIZE

Style 25V 50V 100V 200V

0402* 0.5pF - 220pF 0.5pF - 120pF — —

0504 0.5pF - 330pF 0.5pF - 150pF 0.5pF - 68pF —

0603* 0.5pF - 1nF 0.5pF - 1nF 0.5pF - 330pF —

0805* 0.5pF - 4.7nF 0.5pF - 2.2nF 0.5pF - 1nF 0.5pF - 470pF

1206* 0.5pF - 10nF 0.5pF - 4.7nF 0.5pF - 2.2nF 0.5pF - 1nF

1210* 560pF - 10nF 560pF - 10nF 560pF - 3.9nF 560pF - 1.5nF

1505 — 10pF - 1.5nF 10pF - 820pF 10pF - 560pF

1808 →1nF - 4.7nF 1nF - 3.9nF 1nF - 2.2nF

1812* 1nF - 15nF 1nF - 10nF 1nF - 4.7nF 1nF - 3.3nF

1825* →1nF - 22nF 1nF - 12nF 1nF - 6.8nF

2220 →4.7nF - 47nF 4.7nF - 39nF 3.3nF - 27nF

2225 →1nF - 100nF 1nF - 39nF 1nF - 39nF

Impedance, ⍀

1,000

10,000

100

110 100 1000

Frequency, MHz

Variation of Impedance with Cap Value

Impedance vs. Frequency

0805 - C0G (NP0)

10 pF vs. 100 pF vs. 1000 pF

10 pF

100 pF

1000 pF

1.0

0.1

10.0

100,000

C0G (NP0) Dielectric

Capacitance Range

*Reflow soldering only.

NOTES: For higher voltage chips, see pages 20 and 21.

PREFERRED SIZES ARE SHADED

= Paper Tape

= Embossed Tape

SIZE 0402* 0504* 0603* 0805 1206 1505

Standard Reel All Paper All Embossed All Paper Paper/Embossed Paper/Embossed All Embossed

Packaging

(L) Length MM 1.00 ± .10 1.27 ± .25 1.60 ± .15 2.01 ± .20 3.20 ± .20 3.81 ± .25

(in.) (.040 ± .004) (.050 ± .010) (.063 ± .006) (.079 ± .008) (.126 ± .008) (.150 ± .010)

(W) Width MM .50 ± .10 1.02 ± .25 .81 ± .15 1.25 ± .20 1.60 ± .20 1.27 ± .25

(in.) (.020 ± .004) (.040 ± .010) (.032 ± .006) (.049 ± .008) (.063 ± .008) (.050 ± .010)

(T) Max. Thickness MM .60 1.02 .90 1.30 1.50 1.27

(in.) (.024) (.040) (.035) (.051) (.059) (.050)

(t) Terminal MM .25 ± .15 .38 ± .13 .35 ± .15 .50 ± .25 .50 ± .25 .50 ± .25

(in.) (.010 ± .006) (.015 ± .005) (.014 ± .006) (.020 ± .010) (.020 ± .010) (.020 ± .010)

WVDC 25 50 25 50 100 25 50 100 25 50 100 200 25 50 100 200 50 100 200

Cap 0.5

(pF) 1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

10000

䉲

C0G (NP0) Dielectric

Capacitance Range

*Reflow soldering only.

NOTES: For higher voltage chips, see pages 20 and 21.

PREFERRED SIZES ARE SHADED

SIZE 1210 1808* 1812* 1825* 2220* 2225*

Standard Reel Packaging Paper/Embossed All Embossed All Embossed All Embossed All Embossed All Embossed

(L) Length MM 3.20 ± .20 4.57 ± .25 4.50 ± .30 4.50 ± .30 5.7 ± .40 5.72 ± .25

(in.) (.126 ± .008) (.180 ± .010) (.177 ± .012) (.177 ± .012) (.225 ± .016) (.225 ± .010)

(W) Width MM 2.50 ± .20 2.03 ± .25 3.20 ± .20 6.40 ± .40 5.0 ± .40 6.35 ± .25

(in.) (.098 ± .008) (.080 ± .010) (.126 ± .008) (.252 ± .016) (.197 ± .016) (.250 ± .010)

(T) Max. Thickness MM 1.70 1.52 1.70 1.70 2.30 1.70

(in.) (.067) (.060) (.067) (.067) (.090) (.067)

(t) Terminal MM .50 ± .25 .64 ± .39 .61 ± .36 .61 ± .36 .64 ± .39 .64 ± .39

(in.) (.020 ± .010) (.025 ± .015) (.024 ± .014) (.024 ± .014) (.025 ± .015) (.025 ± .015)

WVDC 25 50 100 200 50 100 200 25 50 100 200 50 100 200 50 100 200 50 100 200

Cap 560

(pF) 680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

Cap. .010

(µF) .012

.015

.018

.022

.027

.033

.039

.047

.068

.082

= Paper Tape

= Embossed Tape

䉲

How to Order

Part Number Explanation

EXAMPLE: 08055A101JAT2A

0805

Size

(L" x W")

0402

0504

0603

0805

1005

0907

1206

1210

1505

1805

1808

1812

1825

2225

3640

Voltage

10V = Z

16V = Y

25V = 3

50V = 5

100V = 1

200V = 2

250V = V

500V = 7

600V = C

1000V = A

1500V = S

2000V = G

2500V = W

3000V = H

4000V = J

5000V = K

Dielectric

C0G (NP0) = A

X7R = C

X5R = D

Z5U = E

Y5V = G

101

Capacitance

Code

(2 significant

digits + no. of

zeros)

Examples:

Capacitance

Tolerance

Failure

Rate

A = Not

Applicable

Terminations

Special**

Code

10 pF = 100

100 pF = 101

1,000 pF = 102

22,000 pF = 223

220,000 pF = 224

1 µF = 105

C = ±.25 pF*

D = ±.50 pF*

F = ±1% (≥25 pF)

G = ±2% (≥13 pF)

J = ±5%

K = ±10%

M = ±20%

Z = +80%, -20%

P = +100%, -0%

Others:

7 = Bulk Cassette

9 = Bulk

*C&D tolerances for ⱕ10 pF values.

** Standard Tape and Reel material depends upon chip size and thickness.

See individual part tables for tape material type for each capacitance value.

Note: Unmarked product is standard. Marked product is available on special request, please contact AVX.

Standard packaging is shown in the individual tables.

Non-standard packaging is available on special request, please contact AVX.

Standard:

T = Ni and Tin

Plated

A = Standard

Product

Non-Standard

P = Embossed

unmarked

M = Embossed

marked

E = Standard

packaging

marked

Low Profile

Chips Only

Max. Thickness

T = .66mm (.026")

S = .56mm (.022")

R = .46mm (.018")

For values below 10 pF,

use “R” in place of

decimal point, e.g., 9.1

pfd = 9R1.

Recommended:

2 =7" Reel

4 =13" Reel

Others:

7 = Plated Ni

Gold Plated

1 = Pd/Ag

Packaging**

Surface Mounting Guide

MLC Chip Capacitors

Component Pad Design

Component pads should be designed to achieve good sol-

der filets and minimize component movement during reflow

soldering. Pad designs are given below for the most com-

mon sizes of multilayer ceramic capacitors for both wave

and reflow soldering. The basis of these designs is:

• Pad width equal to component width. It is permissible to

decrease this to as low as 85% of component width but it

is not advisable to go below this.

• Pad overlap 0.5mm beneath component.

• Pad extension 0.5mm beyond components for reflow and

1.0mm for wave soldering.

Case Size D1 D2 D3 D4 D5

0402 1.70 (0.07) 0.60 (0.02) 0.50 (0.02) 0.60 (0.02) 0.50 (0.02)

0603 2.30 (0.09) 0.80 (0.03) 0.70 (0.03) 0.80 (0.03) 0.75 (0.03)

0805 3.00 (0.12) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.25 (0.05)

1206 4.00 (0.16) 1.00 (0.04) 2.00 (0.09) 1.00 (0.04) 1.60 (0.06)

1210 4.00 (0.16) 1.00 (0.04) 2.00 (0.09) 1.00 (0.04) 2.50 (0.10)

1808 5.60 (0.22) 1.00 (0.04) 3.60 (0.14) 1.00 (0.04) 2.00 (0.08)

1812 5.60 (0.22) 1.00 (0.04)) 3.60 (0.14) 1.00 (0.04) 3.00 (0.12)

1825 5.60 (0.22) 1.00 (0.04) 3.60 (0.14) 1.00 (0.04) 6.35 (0.25)

2220 6.60 (0.26) 1.00 (0.04) 4.60 (0.18) 1.00 (0.04) 5.00 (0.20)

2225 6.60 (0.26) 1.00 (0.04) 4.60 (0.18) 1.00 (0.04) 6.35 (0.25)

Dimensions in millimeters (inches)

REFLOW SOLDERING

WAVE SOLDERING

Component Spacing

For wave soldering components, must be spaced sufficiently

far apart to avoid bridging or shadowing (inability of solder

to penetrate properly into small spaces). This is less impor-

tant for reflow soldering but sufficient space must be

allowed to enable rework should it be required.

Preheat & Soldering

The rate of preheat should not exceed 4°C/second to

prevent thermal shock. A better maximum figure is about

2°C/second.

For capacitors size 1206 and below, with a maximum

thickness of 1.25mm, it is generally permissible to allow a

temperature differential from preheat to soldering of 150°C.

In all other cases this differential should not exceed 100°C.

For further specific application or process advice, please

consult AVX.

Cleaning

Care should be taken to ensure that the capacitors are

thoroughly cleaned of flux residues especially the space

beneath the capacitor. Such residues may otherwise

become conductive and effectively offer a low resistance

bypass to the capacitor.

Ultrasonic cleaning is permissible, the recommended

conditions being 8 Watts/litre at 20-45 kHz, with a process

cycle of 2 minutes vapor rinse, 2 minutes immersion in the

ultrasonic solvent bath and finally 2 minutes vapor rinse.

Surface Mounting Guide

MLC Chip Capacitors

Case Size D1 D2 D3 D4 D5

0603 3.10 (0.12) 1.20 (0.05) 0.70 (0.03) 1.20 (0.05) 0.75 (0.03)

0805 4.00 (0.15) 1.50 (0.06) 1.00 (0.04) 1.50 (0.06) 1.25 (0.05)

1206 5.00 (0.19) 1.50 (0.06) 2.00 (0.09) 1.50 (0.06) 1.60 (0.06)

1210 5.00 (0.19) 1.50 (0.06) 2.00 (0.09) 1.50 (0.06) 2.50 (0.10)

Dimensions in millimeters (inches)

≥1mm (0.04)

≥1.5mm (0.06)

≥1mm (0.04)

Surface Mounting Guide

MLC Chip Capacitors

APPLICATION NOTES

Storage

Good solderability is maintained for at least twelve months,

provided the components are stored in their “as received”

packaging at less than 40°C and 70% RH.

Solderability

Terminations to be well soldered after immersion in a 60/40

tin/lead solder bath at 235 ±5°C for 2±1 seconds.

Leaching

Terminations will resist leaching for at least the immersion

times and conditions shown below.

Recommended Soldering Profiles

General

Surface mounting chip multilayer ceramic capacitors

are designed for soldering to printed circuit boards or other

substrates. The construction of the components is such that

they will withstand the time/temperature profiles used in both

wave and reflow soldering methods.

Handling

Chip multilayer ceramic capacitors should be handled with

care to avoid damage or contamination from perspiration

and skin oils. The use of tweezers or vacuum pick ups

is strongly recommended for individual components. Bulk

handling should ensure that abrasion and mechanical shock

are minimized. Taped and reeled components provides the

ideal medium for direct presentation to the placement

machine. Any mechanical shock should be minimized during

handling chip multilayer ceramic capacitors.

Preheat

It is important to avoid the possibility of thermal shock during

soldering and carefully controlled preheat is therefore

required. The rate of preheat should not exceed 4°C/second

and a target figure 2°C/second is recommended. Although

an 80°C to 120°C temperature differential is preferred,

recent developments allow a temperature differential

between the component surface and the soldering temper-

ature of 150°C (Maximum) for capacitors of 1210 size and

below with a maximum thickness of 1.25mm. The user is

cautioned that the risk of thermal shock increases as chip

size or temperature differential increases.

Soldering

Mildly activated rosin fluxes are preferred. The minimum

amount of solder to give a good joint should be used.

Excessive solder can lead to damage from the stresses

caused by the difference in coefficients of expansion

between solder, chip and substrate. AVX terminations are

suitable for all wave and reflow soldering systems. If hand

soldering cannot be avoided, the preferred technique is the

utilization of hot air soldering tools.

Cooling

Natural cooling in air is preferred, as this minimizes stresses

within the soldered joint. When forced air cooling is used,

cooling rate should not exceed 4°C/second. Quenching

is not recommended but if used, maximum temperature

differentials should be observed according to the preheat

conditions above.

Cleaning

Flux residues may be hygroscopic or acidic and must be

removed. AVX MLC capacitors are acceptable for use with

all of the solvents described in the specifications MIL-STD-

202 and EIA-RS-198. Alcohol based solvents are acceptable

and properly controlled water cleaning systems are also

acceptable. Many other solvents have been proven successful,

and most solvents that are acceptable to other components

on circuit assemblies are equally acceptable for use with

ceramic capacitors.

Termination Type Solder Solder Immersion Time

Tin/Lead/Silver Temp. °C Seconds

Nickel Barrier 60/40/0 260±5 30±1

Reflow

300

250

200

150

100

Solder Temp.

10 sec. max

1min

(Minimize soldering time)

Natural

Cooling

220°C

250°C

Preheat

Wave

300

250

200

150

100

Solder Temp.

(Preheat chips before soldering)

T/maximum 150°C

3 sec. max

1 to 2 min

Preheat Natural

Cooling

230°C

250°C

Packaging of Chip Components

Automatic Insertion Packaging

TAPE & REEL QUANTITIES

All tape and reel specifications are in compliance with RS481.

8mm 12mm

Paper or Embossed Carrier 0805, 1005, 1206,

1210

Embossed Only 0504, 0907 1505, 1805, 1812, 1825

1808 2220, 2225

Paper Only 0402, 0603

Qty. per Reel/7" Reel 2,000 or 4,000(1) 3,000 1,000

Qty. per Reel/13" Reel 10,000 10,000 4,000

(1) Dependent on chip thickness. Low profile chips shown on page 27 are 5,000 per reel for 7" reel. 0402 size chips are 10,000 per 7" reels and are

not available on 13" reels. For 3640 size chip contact factory for quantity per reel.

REEL DIMENSIONS

Tape A B* CD* N W1W2W3

Size(1) Max. Min. Min. Min. Max.

+1.0 7.9 Min.

8mm 8.4 –0.0 14.4 (.311)

(.331 +.060 ) (.567) 10.9 Max.

330 1.5 13.0±0.20 20.2 50

–0.0 (.429)

(12.992) (.059) (.512±.008) (.795) (1.969)

+2.0 11.9 Min.

12mm 12.4 –0.0 18.4 (.469)

(.488 +.076) (.724) 15.4 Max.

–0.0 (.607)

Metric dimensions will govern.

English measurements rounded and for reference only.

(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.

Tape Size B1D1FP

1RT

2WA

0 B0 K0

Max. Min. Min.

See Note 6 See Note 5 See Note 2

8mm 4.55 1.0 3.5 ± 0.05 4.0 ± 0.10 25 2.5 Max See Note 1

(.179) (.039) (.138 ± .002) (.157 ± .004) (.984) (.098)

12mm 8.2 1.5 5.5 ± 0.05 4.0 ± 0.10 30 6.5 Max. 12.0 ± .30 See Note 1

(.323) (.059) (.217 ± .002) (.157 ± .004) (1.181) (.256) (.472 ± .012)

8mm 4.55 1.0 3.5 ± 0.05 2.0 ± 0.10 25 2.5 Max. See Note 1

1/2 Pitch (.179) (.039) (.138 ± .002) 0.79 ± .004 (.984) (.098)

12mm 8.2 1.5 5.5 ± 0.05 8.0 ± 0.10 30 6.5 Max. 12.0 ± .30 See Note 1

Double (.323) (.059) (.217 ± .002) (.315 ± .004) (1.181) (.256) (.472 ± .012)

Pitch

Embossed Carrier Configuration

8 & 12mm Tape Only

8 & 12mm Embossed Tape

Metric Dimensions Will Govern

CONSTANT DIMENSIONS

Tape Size D0EP

0P2T Max. T1G1G2

8mm 8.4 +0.10 1.75 ± 0.10 4.0 ± 0.10 2.0 ± 0.05 0.600 0.10 0.75 0.75-0.0

and (.059 +.004) (.069 ± .004) (.157 ± .004) (.079 ± .002) (.024) (.004) (.030) (.030)

12mm -0.0 Max. Min. Min.

See Note 3 See Note 4

VARIABLE DIMENSIONS

NOTES:

1. A0, B0, and K0are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The

clearance between the end of the terminals or body of the component to the sides and depth of the cavity (A0, B0, and K0) must be within 0.05 mm (.002) min. and 0.50 mm

(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches C & D).

2. Tape with components shall pass around radius “R” without damage. The minimum trailer length (Note 2 Fig. 3) may require additional length to provide R min. for 12 mm

embossed tape for reels with hub diameters approaching N min. (Table 4).

3. G1dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the

cavity whichever is less.

4. G2dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity

or to the edge of the cavity whichever is less.

5. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment.

Dimensions of embossment location and hole location shall be applied independent of each other.

6. B1dimension is a reference dimension for tape feeder clearance only.

8.0 +0.3

-0.1

(.315 +.012 )-.004

8.0 +0.3

-0.1

(.315 +.012 )-.004

Tape Size P1FWA

0 B0T

8mm 4.0 ± 0.10 3.5 ± 0.05 See Note 1 See Note 3

(.157 ± .004) (.138 ± .002)

12mm 4.0 ± .010 5.5 ± 0.05 12.0 ± 0.3

(.157 ± .004) (.217 ± .002) (.472 ± .012)

8mm 2.0 ± 0.10 3.5 ± 0.05

1/2 Pitch (.079 ± .004) (.138 ± .002)

12mm 8.0 ± 0.10 5.5 ± 0.05 12.0 ± 0.3

Double (.315 ± .004) (.217 ± .002) (.472 ± .012)

Pitch

Paper Carrier Configuration

8 & 12mm Tape Only

8 & 12mm Paper Tape

Metric Dimensions Will Govern

CONSTANT DIMENSIONS

Tape Size D0EP

0P2T1G1G2R MIN.

8mm 1.5 +0.1 1.75 ± 0.10 4.0 ± 0.10 2.0 ± 0.05 0.10 0.75 0.75 25 (.984)-0.0

and (.059 +.004) (.069 ± .004) (.157 ± .004) (.079 ± .002) (.004) (.030) (.030) See Note 2

12mm -.000 Max. Min. Min.

VARIABLE DIMENSIONS

NOTES:

1. A0, B0, and T are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The

clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0, and T) must be within 0.05 mm (.002) min. and 0.50 mm

(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches A & B).

2. Tape with components shall pass around radius “R” without damage.

3. 1.1 mm (.043) Base Tape and 1.6 mm (.063) Max. for Non-Paper Base Compositions.

8.0 +0.3

-0.1

(.315 +.012 )-.004

8.0 +0.3

-0.1

(.315 +.012 )-.004

Bar Code Labeling Standard

AVX bar code labeling is available and follows latest version of EIA-556-A.

Bulk Case Packaging

CASE QUANTITIES

Part Size 0402 0603 0805

Qty. 10,000 (T=0.6mm)

(pcs / cassette) 80,000 15,000 5,000 (T¯≥0.6mm)

BENEFITS BULK FEEDER

• Easier handling

• Smaller packaging volume

(1/20 of T/R packaging)

• Easier inventory control

• Flexibility

• Recyclable

CASE DIMENSIONS

Shutter

Slider

Attachment Base

110mm

12mm

36mm

Case

Cassette

Gate

Shooter

Chips

Expanded Drawing Mounter

Head