SMSC USB2601/USB2602 DATASHEET Revision 1.6 (06-20-08)
Datasheet
PRODUCT FEATURES
USB2601/USB2602
4th Generation USB 2.0 Flash
Media Controller with
Integrated Card Power FETs &
HS Hub
Hub Controller
Provides Three USB 2.0 Downstream Ports via
internal USB 2.0 Hub
— Multi Transaction Translator for FS/LS devices attached
Flash Media Controller
Complete System Solution for interfacing
SmartMediaTM (SM) or xD Picture CardTM (xD)1,
Memory StickTM (MS), High Speed Memory Stick
(HSMS), Memory Stick PRO (MSPRO), MS DuoTM,
Secure Digital (SD), Mini-Secure Digital (Mini-SD),
TransFlash (SD), MultiMediaCardTM (MMC),
Reduced Size MultiMediaCard (RS-MMC), NAND
Flash, Compact FlashTM (CF) and CF UltraTM I & II,
and CF form-factor ATA hard drives to USB 2.0 bus
— Supports USB Bulk Only Mass Storage Compliant
Bootable BIOS
Support for simultaneous operation of all above
devices. (only one at a time of each of the following
groups supported: CF or ATA drive, SM or XD or
NAND, SD or MMC)
On-Chip 4-Bit High Speed Memory Stick and MS
PRO Hardware Circuitry
On-Chip firmware reads and writes High Speed
Memory Stick and MS PRO
1-bit ECC correction performed in hardware for
maximum efficiency
Hardware support for SD Security Command
Extensions
3.3 Volt I/O with 5V input tolerance on VBUS, Port
Power and Over-Current Sense pins
On-chip power FETs for supplying flash media card
power with minimum board components
8051 8 bit microprocessor
— Provides low speed control functions
— 30 MHz execution speed at 4 cycles per instruction
average
— 12K Bytes of internal SRAM for general purpose
scratchpad
— 768 Bytes of internal SRAM for general purpose
scratchpad or program execution while re-flashing
external ROM
— Double Buffered Bulk Endpoint
— Bi-directional 512 Byte Buffer for Bulk Endpoint
— 64 Byte RX Control Endpoint Buffer
— 64 Byte TX Control Endpoint Buffer
Internal Program Memory Interface
— 64K Byte Internal Code Space
On Board 24MHz Crystal Driver Circuit
Can be clocked by an external 24MHz source
On-Chip 1.8V Regulator for Low Power Core
Operation
Internal PLL for 480MHz USB 2.0 Sampling,
Configurable MCU clock
11 GPIOs for special function use: LED indicators,
button inputs, power control to memory devices, etc.
— Inputs capable of generating interrupts with either edge
sensitivity
Configuration of Hub and Flash Media features
controlled either by internal defaults or via single
external EEPROM. User configurable features:
— Full or Partial Card compliance checking
— LUN configuration and assignment
— Write Protect Polarity
— Cover Switch operation for xD compliance
— Inquiry Command operation
— SD Write Protect operation
— Older CF card support
— Force USB 1.1 reporting
— Internal or External Power FET operation
Compatible with Microsoft WinXP, WinME, Win2K
SP3&4, Apple OS10 and Linux Multi-LUN Mass
Storage Class Drivers
Win2K, Win98/98SE and Apple OS8.6 and OS9
Multi-LUN Mass Storage Class Drivers are available
from SMSC
128 Pin TQFP Package (1.0mm height, 14mm
x14mm footprint); lead-free RoHS compliant package
also available
1.xD Picture Card not applicable to USB2601
ORDER NUMBERS:
USB2601/USB2602-NE-XX FOR 128 PIN, TQFP PACKAGE
USB2601/USB2602-NU-XX FOR 128 PIN, TQFP LEAD-FREE ROHS COMPLIANT PACKAGE
“XX” in the order number indicates the internal ROM firmware revision level.
PLEASE CONTACT YOUR SMSC SALES REPRESENTATIVE FOR MORE INFORMATION.
4th Generation USB 2.0 Flash Media Controller with Integrated Card Po we r FETs & HS Hub
Datasheet
Revision 1.6 (06-20-08) 2 SMSC USB2601/USB2602
DATASHEET
80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000, FAX (631) 273-3123
Copyright © 2008 SMSC or its subsidiaries. All rights reserved.
Circuit diagrams and other informa tion relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for
construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed for inaccuracies. S MSC
reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local SMSC sales office to obtain the latest specifications
before placing your product order. The provision of this information does not convey to the purchaser of the described semiconductor devices any licenses under any patent
rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated
version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors
known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not
designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe property
damage. Any and all such uses without prior written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of
this document or other SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at http://www.smsc.com. SMSC is a registered
trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective holders.
SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY,
FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE
OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL
DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHET HER BASED ON CONTRACT;
TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS H ELD
TO HAVE FAILED OF ITS ESSENTIAL PU RPOSE, AND WHETHER OR NOT SMSC HAS BEEN A DVISED OF THE POSSIBILITY OF SUCH DAMAGES.
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
SMSC USB2601/USB2602 3 Revision 1.6 (06-20-08)
DATASHEET
Table of Contents
Chapter 1 General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1 High-Speed Hub. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.2 Flash Media Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Chapter 2 Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Chapter 3 Pin Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1 128-Pin TQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.2 128-Pin List Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Chapter 4 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Chapter 5 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Chapter 6 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.1 PIN Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.2 Buffer Type Desc rip tio ns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Chapter 7 DC Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.1 Maximum Guaranteed Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.2 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.3 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.4 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Chapter 8 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
8.1 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
8.2 Package Thermal Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Chapter 9 GPIO Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4th Generation USB 2.0 Flash Media Controller with Integrated Card Po we r FETs & HS Hub
Datasheet
Revision 1.6 (06-20-08) 4 SMSC USB2601/USB2602
DATASHEET
List of Figures
Figure 4.1 USB2601/USB2602 128-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 5.1 USB2601/USB2602 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7.1 Supply Rise Time Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 8.1 USB2601/USB2602 128-Pin TQFP Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
SMSC USB2601/USB2602 5 Revision 1.6 (06-20-08)
DATASHEET
List of Tables
Table 3.1 USB2601/USB2602 128-Pin TQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 3.2 USB2601/USB2602 128-Pin TQFP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 6.1 USB2601/USB2602 Buffer Type Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 8.1 USB2601/USB2602 128-Pin TQFP Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 8.2 128-Pin TQFP Package Thermal Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 9.1 GPIO Usage (ROM Rev -01) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4th Generation USB 2.0 Flash Media Controller with Integrated Card Po we r FETs & HS Hub
Datasheet
Revision 1.6 (06-20-08) 6 SMSC USB2601/USB2602
DATASHEET
Chapter 1 General Description
The USB2601/USB2602 is an Integrated “combo” High-Speed USB hub and Flash Media Controller.
The Flash media controller permanently resides on Port 1 of the Integrated USB hub.
1.1 High-Speed Hub
The integrated SMSC Hub is fully compliant with the USB 2.0 Specification and will attach to a USB
host as a Full-Speed Hub or as a Full-/High-Speed Hub. The Hub supports Low-Speed, Full-Speed,
and High-Speed (if operating as a High-Speed Hub) downstream devices on all of the enabled
downstream ports.
A dedicated Transaction Translator (TT) is available for each downstream facing po rt. This architecture
ensures maximum USB throughput for each connected device when operating with mixed-speed
peripherals.
The Hub works with an external USB power distribution switch device to control VBUS switching to
downstream ports, and to limit current and sense over-current conditions.
All required resisto rs on the USB ports are integrated into the Hub. This i ncludes all series terminati on
resistors on D+ and D– pins and all required pull-down and pull-up resistors on D+ and D– pins. The
over-current sense inputs for the downstream facing ports have internal pull-up resistors.
Throughout this document the upstream facing port of the hub will be referred to as th e upstream port,
and the downstream facing ports will be called the downstream ports.
Three externally available ports are available for general USB device connectivity.
1.2 Flash Media Controller
The Bulk Only Mass Storage Class Peripheral Controller intended for supporting CompactFlash (CF
and CF Ultra I/II) in True IDE Mode only, SmartMedia (SM) and xD cards, Memory Stick (MS), Memory
Stick DUO (MSDUO) and Memory Stick Pro (MSPRO), Secure Digital (SD), and MultiMediaCard
(MMC) flash memory devices. It provides a single chip solution for the most popular flash memory
cards in the market.
The device consists of buffers, Fast 8051 microprocessor with expanded scratchpad, and program
SRAM, and CF, MS, SM and SD controllers. The SD controller supports both SD and MMC devices.
SM controller supports both SM and xD cards.
12K bytes of scratchpad SRAM and 768 Bytes of program SRAM are also provided.
Eleven GPIO pins are provided for indicators, external serial EEPROM for OEM ID and system
configuration information, and other special functions.
Internal power FETs are provided to directly supply power to the xD/SM, MMC/SD and MS/MSPro
cards.
The internal ROM program is capable of implementing any combination of single or multi-LUN
CF/SD/MMC/SM/MS reader functions with individual card power control and activity indication. SMSC
also provides licenses** for Win98 and Win2K drivers and setup utilities. Note: Please check with
SMSC for precise features and capabilities for the current ROM code release.
*Note: In order to develop, make, use, or sell readers and/or other products using or incorporating any of the SMSC devices made
the subject of this document or to use related SMSC software programs, technical information and licenses under patent and other
intellectual property rights from or through various persons or entities, including without limitation media standard companies,
forums, and associations, and other patent holders may be required. These media standard companies, forums, and associations
include without limitation the following: Sony Corporation (Memory Stick, Memory Stick Pro); SD3 LLC (Secure Digital); MultiMedia
Card Association (MultiMediaCard); the SSFDC Forum (SmartMedia); the Compact Flash Association (Compact Flash); and Fuji
Photo Film Co., Ltd., Olympus Optical Co., Ltd., and Toshiba Corporation (xD-Picture Card). SMSC does not make such licenses
or technical information available; does not promise or represent that any such licenses or technical information will actually be
obtainable from or through the various persons or entities (including the media standard companies, forums, and associations), or
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
SMSC USB2601/USB2602 7 Revision 1.6 (06-20-08)
DATASHEET
with respect to the terms under which they may be made available; and is not responsible for the accuracy or sufficiency of, or
otherwise with respect to, any such technical information.
SMSC's obligations (if any) under the Terms of Sale Agreement, or any other agreement with any customer, or otherwise, with
respect to infringement, including without limitation any obligations to defend or settle claims, to reimburse for costs, or to pay
damages, shall not apply to any of the devices made the subject of this document or any software programs related to any of such
devices, or to any combinations involving any of them, with respect to infringement or claimed infringe ment of any existing or future
patents related to solid state disk or other flash memory technology or applications ("Solid State Disk Patents"). By making any
purchase of any of the devices made the subject of this document, the customer represents, warrants, and agrees that it has
obtained all necessary licenses under then-existing Solid State Disk Patents for the manufacture, use and sale of solid state disk
and other flash memory products and that the customer will timely obtain at no cost or expense to SMSC all necessary licenses
under Solid State Disk Patents; that the manufacture and testing by or for SMSC of the units of any of the devices made the subject
of this document which may be sold to the customer, and any sale by SMSC of such units to the customer, are valid exercises of
the customer's rights and licenses under such Solid State Disk Patents; that SMSC shall have no obligation for royalties or otherwise
under any Solid State Disk Patents by reason of any such manufacture, use, or sale of such units; and that SMSC shall have no
obligation for any costs or expenses related to the customer's obtaining or having obtained rights or licenses under any Solid State
Disk Patents.
SMSC MAKES NO WARRANTIES, EXPRESS, IMPLIED, OR STATUTORY, IN REGARD TO INFRINGEMENT OR OTHER
VIOLATION OF INTELLECTUAL PROPERTY RIGHTS. SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES
AGAINST INFRINGEMENT AND THE LIKE.
No license is granted by SMSC expressly, by implication, by estoppel or otherwise, under any patent, trademark, copyright, mask
work right, trade secret, or other intellectual property right.
**To obtain this software program the appropriate SMSC Software License Agreement must be executed and in effect. Forms of
these Software License Agreements may be obtained by contacting SMSC.
4th Generation USB 2.0 Flash Media Controller with Integrated Card Po we r FETs & HS Hub
Datasheet
Revision 1.6 (06-20-08) 8 SMSC USB2601/USB2602
DATASHEET
Chapter 2 Acronyms
SM: SmartMedia
SMC: SmartMedia Controller
FM: Flash Media
FMC: Flash Media Controller
CF: CompactFlash
CFC: CompactFlash Controller
SD: Secure Digital
SDC: Secure Digital Controller
MMC: MultiMediaCard
MS: Memory Stick
MSC: Memory Stick Controller
TPC: Transport Protocol Code.
ECC: Error Checking and Correcting
CRC: Cyclic Redundancy Checking
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
SMSC USB2601/USB2602 9 Revision 1.6 (06-20-08)
DATASHEET
Chapter 3 Pin Table
3.1 128-Pin TQFP Package
Table 3.1 USB2601/USB2602 128-Pin TQFP Package
UPSTREAM USB 2.0 INTERFACE (3 PINS)
USBUP_DP USBUP_DM VBUS_DET
3-PORT USB 2.0 INTERFACE (16 PINS)
USBDN_DP2 USBDN_DM2 USBDN_DP3 USBDN_DM3
USBDN_DP4 USBDN_DM4 PRTPWR2 PRTPWR3
PRTPWR4 OCS2_N OCS3_N OCS4_N
GR2_N GR3_N GR4_N PRTPWR_POL
CompactFlash INTERFACE (28 Pins)
CF_D0 CF_D1 CF_D2 CF_D3
CF_D4 CF_D5 CF_D6 CF_D7
CF_D8 CF_D9 CF_D10 CF_D11
CF_D12 CF_D13 CF_D14 CF_D15
CF_nIOR CF_nIOW CF_IRQ CF_nRESET
CF_IORDY CF_nCS0 CF_nCS1 CF_SA0
CF_SA1 CF_SA2 CF_nCD1 CF_nCD2
SmartMedia INTERFACE (17 Pins)
SM_D0 SM_D1 SM_D2 SM_D3
SM_D4 SM_D5 SM_D6 SM_D7
SM_ALE SM_CLE SM_nRE SM_nWE
SM_nWP SM_nB/R SM_nCE SM_nCD
SM_nWPS
Memory Stick INTERFACE (7 Pins)
MS_BS MS_SDIO/MS_D0 MS_SCLK MS_INS
MS_D1 MS_D2 MS_D3
SD INTERFACE (7 Pins)
SD_CMD SD_CLK SD_DAT0 SD_DAT1
SD_DAT2 SD_DAT3 SD_nWP
4th Generation USB 2.0 Flash Media Controller with Integrated Card Po we r FETs & HS Hub
Datasheet
Revision 1.6 (06-20-08) 10 SMSC USB2601/USB2602
DATASHEET
3.2 128-Pin List Table
MISC (23 Pins)
GPIO1 GPIO2 GPIO4 GPIO5
GPIO6 GPIO7 GPIO8/CRD_PWR0 GPIO9
GPIO10/CRD_PWR1 GPIO11/CRD_PWR2 GPIO12 GPIO13
GPIO14 GPIO15 TEST RESET_N
ATEST RBIAS XTAL1/CLKIN XTAL2
CLK_SEL0 CLK_SEL1 SEL_CLKDRV
ANALOG POWER (5 Pins)
(3)VDDA33 VDD33PLL VDD18PLL
DIGITAL, POWER & GROUND (22 Pins)
(5)VDD33 (11)VSS (3)VDD18 (3)NC
To ta l 1 2 8
Table 3.2 USB2601/USB2602 128 -Pin TQFP
PI
N
#
NAME M
API
N # NAME MA PIN
#NAME MA PIN
#NAME MA
1PRTPWR_
POL - 33 VDD18 - 65 CF_D7 8 97 SD_nWP -
2 PRTPWR2 12 34 VSS - 66 CF_D15 8 98 SD_DAT1 8
3 OCS2_N - 35 VSS - 67 CF_nCS0 8 99 SD_DAT0 8
4 PRTPWR3 12 36 SM_nWPS - 68 CF_nCS1 8 100 SD_CLK 8
5 OCS3_N - 37 SM_CLE 8 69 CF_nIOR 8 101 VDD33 -
6 PRTPWR4 12 38 SM_nCE 8 70 CF_nIOW 8 102 GPIO11/
CRD_PWR2 -
7 OCS4_N - 39 SM_ALE 8 71 CF_IRQ 8 103 SD_CMD 8
8 VDDA33 - 40 SM_nRE 8 72 CF_nRESET 8 104 SD_DAT3 8
9 USBDN_D
P3 -- 41 SM_nWE 8 73 CF_IORDY 8 105 SD_DAT2 8
10 USBDN_D
M3 - 42 SM_nB/R - 74 CF_SA2 8 106 GPIO4 8
11 VSS - 43 VDD33 - 75 CF_SA1 8 107 GPIO5 8
12 USBDN_D
M4 - 44 GPIO10/
CRD_PWR1 - 76 CF_SA0 8 108 VSS -
Table 3.1 USB2601/USB2602 128-Pin TQFP Package
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
SMSC USB2601/USB2602 11 Revision 1.6 (06-20-08)
DATASHEET
Notes:
RBIAS is connected to the Analog Ground plane VSS via a resistor.
When the internal 1.8V regulators are enabled, VDD18 (Pin 86) & VDD18PLL (Pin 124), MUST
have a 10uf +/- 20%, (equivalent series resistance (ESR) <0.1ohm) bypass capacitor to VSS.
These capacitors must be as close to the pins as possible.
13 USBDN_D
P4 - 45 SM_nWP 8 77 CF_D0 8 109 VSS -
14 VDDA33 - 46 SM_D0 8 78 CF_D1 8 110 USBUP_DM -
15 VDD33 - 47 SM_D1 8 79 CF_D8 8 111 USBUP_DP -
16 GR2_N 8 48 SM_D7 8 80 CF_D2 8 112 VDDA33 -
17 GR3_N 8 49 SM_D2 8 81 CF_D9 8 113 USBDN_DP
2-
18 GR4_N 8 50 SM_D6 8 82 CF_D10 8 114 USBDN_DM
2-
19 GPIO6 8 51 SM_D3 8 83 CF_nCD2 - 115 VSS -
20 MS_BS 8 52 SM_D5 8 84 VSS - 116 VBUS_
DET 12
21 MS_D1 8 53 SM_D4 8 85 VSS - 117 VSS -
22 MS_SDIO/
MS_D0 8 54 SM_nCD - 86 VDD18 - 118 RESET_N -
23 MS_D2 8 55 GPIO9 8 87 VDD33 - 119 VDD18 -
24 MS_INS - 56 CF_nCD1 - 88 GPIO1 8 120 TEST -
25 MS_D3 8 57 CF_D3 8 89 GPIO2 8 121 VSS -
26 MS_
SCLK 8 58 CF_D11 8 90 GPIO7 8 122 XTAL2 -
27 SEL_CLKD
RV - 59 CF_D4 8 91 VDD33 - 123 XTAL1/
CLKIN -
28 CLK_SEL1 - 60 CF_D12 8 92 GPIO8/
CRD_PWR0 - 124 VDD18PLL -
29 CLK_SEL0 - 61 CF_D5 8 93 GPIO12 8 125 VDD33PLL -
30 NC - 62 CF_D13 8 94 GPIO13 8 126 ATEST -
31 NC - 63 CF_D6 8 95 GPIO14 8 127 RBIAS -
32 NC - 64 CF_D14 8 96 GPIO15 8 128 VSS -
Table 3.2 USB2601/USB2602 128-Pin TQFP (continued)
PI
N
#
NAME M
API
N # NAME MA PIN
#NAME MA PIN
#NAME MA
4th Generation USB 2.0 Flash Media Controller with Integrated Card Po we r FETs & HS Hub
Datasheet
Revision 1.6 (06-20-08) 12 SMSC USB2601/USB2602
DATASHEET
Chapter 4 Pin Configuration
Figure 4.1 USB2601/USB2602 128-Pin TQFP
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4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
SMSC USB2601/USB2602 13 Revision 1.6 (06-20-08)
DATASHEET
Chapter 5 Block Diagram
Figure 5.1 USB2601/USB2602 Block Diagram
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4th Generation USB 2.0 Flash Media Controller with Integrated Card Po we r FETs & HS Hub
Datasheet
Revision 1.6 (06-20-08) 14 SMSC USB2601/USB2602
DATASHEET
Chapter 6 Pin Descriptions
This section provides a detailed description of each signal. The signals are arranged in functional
groups according to their associated interface.
The “n” or “_N” symbol in the signal name indica tes that the active, or asserted state occurs w hen the
signal is at a low voltage level. When “n” is not present befo re the signal name (or “_N ” after the signal
name), the signal is asserted when at the high voltage level.
The terms assertion and negation are used exclusively. This is d one to avoid confusion when working
with a mixture of “active low” and “active high” signal. The term assert, or assertion indicates that a
signal is active, independent of whether that level is represented by a high or low voltage. The term
negate, or negation indicates that a signal is inactive.
6.1 PIN Descriptions
NAME SYMBOL BUFFER
TYPE DESCRIPTION
UPSTREAM USB INTERFACE
USB Bus Data USBUP_DM
USBUP_DP IO-U These pins connect to the Upstream USB bus data
signals.
Detect Upstream
VBUS Power VBUS_DET I/O12 Detects state of Upstream VBUS power. The SMSC
Hub monitors VBUS_DET to determine when to assert
the internal D+ pull-up resistor (signalling a connect
event).
When designing a detachable hub, this pin must be
connected to the VBUS power pin of the USB port that
is upstream of the hub.
For self-powered applications with a permanently
attached host, this pin must be pulled-up to either 3.3V
or 5.0V (typically VDD33).
3-PORT USB INTERFACE
USB Bus Data USBDN_DM
[4:2]
USBDN_DP
[4:2]
IO-U These pins connect to the Downstream USB bus data
signals.
USB Power Enable PRTPWR[4:2] I/O12 Enables power to USB peripheral devices
(downstream).
The active signal level of the PRTPWR[4:2] pins is
determined by the Power Polarity Strapping function of
the PRTPWR_POL pin.
Port Power Polarity
Strapping PRTPWR_POL I/O12 Port Power Polarity strapping determination for the
active signal polarity of the PRTPWR[4:2] pins.
While RESET_N is asserted, the logic state of this pin
will (though the use of internal combinatorial logic)
determine the active state of the PRTPWR[4:2] pins in
order to ensure that downstream port power is not
inadvertently enabled to inactive ports during a
hardware reset.
‘1’ = PRTPWR[4:2] pins have an active ‘high’ polarity
‘0’ = PRTPWR[4:2] pins have an active ‘low’ polarity
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
SMSC USB2601/USB2602 15 Revision 1.6 (06-20-08)
DATASHEET
Over Current Sense OCS[4:2]_N IPU Input from external current monitor indicating an over-
current condition. {Note: Contains internal pull-up to
3.3V supply}
Green LED GR[4:2]_N I/O8 Green indicator LED for ports 2, 3 and 4. Will be active
low when LED support is enabled via EEPROM or
SMBus.
CompactFlash (In True IDE mode) INTERFACE
CF Ch ip Sel ect 1 CF_nCS1 O8PU Thi s pin is the active low chip select 1 signal for the CF
ATA device
CF Chip Select 0 CF_nCS0 O8PU This pin is the active low chip select 0 signal for the task
file registers of CF ATA device in the True IDE mode.
CF Register
Address 2 CF_SA2 O8 This pin is the register select address bit 2 for the CF
ATA device.
CF Register
Address 1 CF_SA1 O8 This pin is the register select address bit 1 for the CF
ATA device
CF Register
Address 0 CF_SA0 O8 This pin is the register select address bit 0 for the CF
ATA device.
CF Interrupt CF_IRQ IPD This is the active high interrupt request signal from the
CF device.
CF Data [15:8] CF_D[15:8] I/O8PD The bi-directional data signals CF_D15-CF_D8 in True
IDE mode data transfer.
In the True IDE Mode, all of task file register operation
occur on the CF_D[7:0], while the data transfer is on
CF_D[15:0].
The bi-directional data signal has an internal weak pull-
down resistor.
CF Data [7:0] CF_D[7:0] I/O8PD The bi-directional data signals CF_D7-CF_D0 in the
True IDE mode data transfer.
In the True IDE Mode, all of task file register operation
occur on the CF_D[7:0], while the data transfer is on
CF_D[15:0].
The bi-directional data signal has an internal weak pull-
down resistor.
IO Ready CF_IORDY IPU This pin is active high input signal.
This pin has an internally controlled weak pull-up
resistor.
CF
Card Detection2 CF_nCD2 IPU This card detection pin is connected to the ground on
the CF device, when the CF device is inserted.
This pin has an internally controlled weak pull-up
resistor.
CF
Card Detection1 CF_nCD1 IPU This card detection pin is connected to ground on the
CF device, when the CF device is inserted.
This pin has an internally controlled weak pull-up
resistor.
CF
Hardware Reset CF_nRESET O8 This pin is an active low hardware reset signal to CF
device.
NAME SYMBOL BUFFER
TYPE DESCRIPTION
4th Generation USB 2.0 Flash Media Controller with Integrated Card Po we r FETs & HS Hub
Datasheet
Revision 1.6 (06-20-08) 16 SMSC USB2601/USB2602
DATASHEET
CF
IO Read CF_nIOR O8 This pin is an active low read strobe signal for CF
device.
CF
IO Write Strobe CF_nIOW O8 This pin is an active low write strobe signal for CF
device.
SmartMedia INTERFACE
SM
Write Protect SM_nWP O8PD T his pin is an active low write protect signal fo r the SM
device.
This pin has a weak pull-down resistor that is
permanently enabled
SM
Address Strobe SM_ALE O8PD This pin is an active high Address Latch Enable signal
for the SM device.
This pin has a weak pull-down resistor that is
permanently enabled
SM
Command Strobe SM_CLE O8PD This pin is an active high Command Latch Enable signal
for the SM device.
This pin has a weak pull-down resistor that is
permanently enabled
SM
Data[7:0] SM_D[7:0] I/O8PD These pins are the bi-directional data signal SM_D7-
SM_D0.
The bi-directional data signal has an internal weak pull-
down resistor.
SM
Read Enable SM_nRE 08PU This pin is an active low read strobe signal for SM
device.
When using the internal FET, this pin has an internal
weak pull-up resistor that is tied to the output of the
internal Power FET.
08 If an external FET is used (Internal FET is disabled),
then the internal pull-up is not available (external pull-
ups must be used, and should be connected to the
applicable Card Power Supply).
SM
Write Enable SM_nWE O8PU This pin is an active low write strobe signal for SM
device.
When using the internal FET, this pin has an internal
weak pull-up resistor that is tied to the output of the
internal Power FET.
08 If an external FET is used (Internal FET is disabled),
then the internal pull-up is not available (external pull-
ups must be used, and should be connected to the
applicable Card Power Supply).
SM
Write Protect Switch SM_nWPS IPU A write-protect seal is detected, when this pin is low.
This pin has an internally controlled weak pull-up
resistor.
SM
Busy or Data Ready SM_nB/R I This pin is connected to the BSY/RDY pin of the SM
device.
An external pull-up resistor is required on this signal.
The pull-up resistor must be pulled up to the same
power source that powers the SM/NAND flash device.
NAME SYMBOL BUFFER
TYPE DESCRIPTION
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
SMSC USB2601/USB2602 17 Revision 1.6 (06-20-08)
DATASHEET
SM
Chip Enable SM_nCE O8PU This pin is the active low chip enable signal to the SM
device.
When using the internal FET, this pin has an internal
weak pull-up resistor that is tied to the output of the
internal Power FET.
08 If an external FET is used (Internal FET is disabled),
then the internal pull-up is not available (external pull-
ups must be used, and should be connected to the
applicable Card Power Supply).
SM
Card Detection SM_nCD IPU This is the card detection signal from SM device to
indicate if the device is inserted.
This pin has an internally controlled weak pull-up
resistor.
MEMORY STICK INTERFACE
MS
Bus State MS_BS O8 This pin is connected to the BS pin of the MS device.
It is used to control the Bus States 0, 1, 2 and 3 (BS0,
BS1, BS2 and BS3) of the MS device.
MS
System
Data In/Out
MS_SDIO/MS_
D0 I/O8PD This pin is a bi-directi onal data signal for the MS device.
Most significant bit (MSB) of each byte is transmitted
first by either MSC or MS device.
The bi-directional data signal has an internal weak pull-
down resistor.
MS
System Data In/Out MS_D1 I/O8PD This pin is a bi-di rectional data signal for the MS device.
This pin has internally controlled weak pull-up and pull-
down resistors for various operational modes.
MS
System
Data In/Out
MS_D[3:2] I/O8PD This pin is a bi-directi onal data signal for the MS device.
The bi-directional data signal has an internal weak pull-
down resistor.
MS
Card Insertion MS_INS IPU This pin is the card detection sign al from the MS device
to indicate, if the device is inserted.
This pin has an internally controlled weak pull-up
resistor.
MS
System CLK MS_SCLK O8 This pin is an output clock signal to the MS device.
The clock frequency is software configurable.
SD INTERFACE
SD
Data [3:0] SD_DAT[3:0] I/O8PU These are bi-directional data signals.
These pins have internally controlled weak pull-up
resistors.
SD Clock SD_CLK O8 This is an output clock signal to SD/MMC device.
The clock frequency is software configurable.
NAME SYMBOL BUFFER
TYPE DESCRIPTION
4th Generation USB 2.0 Flash Media Controller with Integrated Card Po we r FETs & HS Hub
Datasheet
Revision 1.6 (06-20-08) 18 SMSC USB2601/USB2602
DATASHEET
SD Command SD_CMD I/O8PU This is a bi-directional signal that conne cts to the CMD
signal of SD/MMC device.
This pin has an internally controlled weak pull-up
resistor.
SD
Write Protected SD_nWP IPD This pin is an input signal with an internal weak pull-
down.
This pin has an internally controlled weak pull-down
resistor.
MISC
General Purpose
I/O GPIO1 I/O8 This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
I/O GPIO2 I/O8 This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
I/O GPIO4 I/O8 This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
I/O GPIO5 I/O8 This pin may be used either as input, edge sensitive
interrupt input, or output.
GPIO6 GPIO6 IPU This pin has an internal weak pull-up resistor that is
enabled or disabled by the state of RESET_N.
The pull-up is enabled when RESET_N is active.
The pull-up is disabled, when the RESET_N is inactive
(some clock cycles later, after the rising edge of
RESET_N).
The state of this pin is latched internally on the rising
edge of RESET_N to determine if internal or external
program memory is used.
The state latched is stored in ROMEN bit of GPIO_IN1
register.
I/O8 After the rising edge of RESET_N, this pin may be used
as GPIO6.
When this pin is left unconnected or pulled high by a
weak pull-up resistor, the USB2601/USB2602 uses the
internal ROM for program execution.
This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
I/O GPIO7 I/O8 This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
I/O
Or
Card Power
GPIO8/
CRD_PWR0 I/O8 GPIO: This pin may be used either as input, edge
sensitive interrupt input, or output.
CRD_PWR: Card Power drive of 3.3V @ 100mA.
General Purpose
I/O GPIO9 I/O8 This pin may be used either as input, edge sensitive
interrupt input, or output.
General Purpose
I/O
Or
Card Power
GPIO10/
CRD_PWR1 I/O8 GPIO: This pin may be used either as input, edge
sensitive interrupt input, or output.
CRD_PWR: Card Power drive of 3.3V @ 100mA.
NAME SYMBOL BUFFER
TYPE DESCRIPTION
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
SMSC USB2601/USB2602 19 Revision 1.6 (06-20-08)
DATASHEET
General Purpose
I/O
Or
Card Power
GPIO11/
CRD_PWR2 I/O8 GPIO: These pins may be used either as input, edge
sensitive interrupt input, or output.
CRD_PWR: Card Power drive of 3.3V @ 200mA.
General Purpose
I/O GPIO[15:12] I/O8 These pins may be used either as input, or output.
RESET input RESET_N IS This active low signal is used by the system to reset the
chip. The active low pulse should be at least 1μs wide.
TEST Input TEST IPD Used for testing the IC. User must treat either as a no-
connect, or connect to the ground.
USB Transceiver
Bias RBIAS I A 12.0kΩ, ± 1.0% resistor is attached from VSS to this
pin, in order to set the transceiver’s internal bias
currents.
Analog Test ATEST AIO T his signal is used for testing the analog section of the
chip and should be connected to VDDA33 for normal
operation.
Crystal
Input/External Clock
Input
XTAL1/
CLKIN ICLKx 24MHz Crystal or external clock input.
This pin can be connected to one terminal of the crystal
or can be conne cted to an external 24MHz clock when
a crystal is not used.
Note: The ‘SEL_CLKDRV and CLK_SEL[1:0]’ pins
will be sampled while RESET_N is asserted,
and the value will be latched upon RESET_N
negation. This will determin e the clock source
and value.
Crystal Output XTAL2 OCLKx 24MHz Crystal
This is the other terminal of the crystal, or left open
when an external clock source is used to drive
XTAL1/CLKIN. It may no t be used to dr ive an y ex te rnal
circuitry other than the crystal circuit.
Select Clock Drive SEL_CLKDRV I/O8PD SEL_CLKDRV. During RESET_N assertion, this pin will
select the operating clock mode (crystal or externally
driven clock source), and a weak pull-down resistor is
enabled. When RESET_ N is ne gated, the value will be
internally latched and the internal pull-down will be
disabled.
‘0’ = Crystal operation (24MHz)
‘1’ = Externally driven clock source (24MHz)
Clock Select CLK_SEL[1:0] I/O8PD SEL[1:0]. During RESET_N assertion, these pins will
select the operating frequency of the external clock, and
the corresponding weak pull-down resistors are
enabled. When RESET_N is negated, the value on
these pins will be internal latched and the internal pull-
downs will be disabled.
SEL[1:0] = ‘00’. 24MHz
SEL[1:0] = ‘01’. RESERVED
SEL[1:0] = ‘10’. RESERVED
SEL[1:0] = ‘11’. RESERVED
ANALOG POWER
1.8V PLL Power VDD18PLL 1.8V Output from the internal 1.8V PLL regulator
3.3V PLL Power VDD33PLL 3.3V Input to the internal 1.8V PLL regulator.
NAME SYMBOL BUFFER
TYPE DESCRIPTION
4th Generation USB 2.0 Flash Media Controller with Integrated Card Po we r FETs & HS Hub
Datasheet
Revision 1.6 (06-20-08) 20 SMSC USB2601/USB2602
DATASHEET
Notes:
Hot-insertion capable card connectors are required for all flash media. It is required for SD
connector to have Write Protect switch. This allows the chip to detect MMC card.
nMCE is normally asserted except when the 8051 is in standby mode.
6.2 Buffer Type Descriptions
3.3V Analog Power VDDA33 3.3v Analog PHY Power
DIGITAL POWER, GROUNDS, and NO CONNECTS
1.8V Digital Core
Power VDD18 +1.8V Core power
All VDD18 pins must be connected together on the
circuit board.
3.3v Power & &
Voltage Regulator
Input
VDD33 3.3V Power & Regulator Input.
Pin 87 supplies 3.3V power to the internal 1.8V
regulator.
Ground VSS Ground Reference
No Connect NC No Connect. No trace or signal should be
routed/attached to these pins.
Table 6.1 USB2601/USB2602 Buffer Type Descriptions
BUFFER DESCRIPTION
I Input
IPU Input with internal weak pull-up resistor.
IPD Input with internal weak pull-down resistor.
IS Input with Schmitt trigger
I/O8 Input/Output buffer with 8mA sink and 8mA source.
I/O8PU Input/Output buffer with 8mA sink and 8mA source, with an internal weak pull-up resistor.
I/O8PD Input/Output buffer with 8mA sink and 8mA source, with an internal weak pull-down
resistor.
I/O12 Input/Output, 12mA
O8 Output buffer with 8mA sink and 8mA source.
O8PU Output buffer with 8mA sink and 8mA source, with an internal weak pull-up resistor.
O8PD Output buffer with 8mA sink and 8mA source, with an internal weak pull-down resistor.
ICLKx XTAL clock input
OCLKx XTAL clock output
I/O-U Analog Input/Output Defined in USB specification
AIO Analog Input/Output
NAME SYMBOL BUFFER
TYPE DESCRIPTION
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
SMSC USB2601/USB2602 21 Revision 1.6 (06-20-08)
DATASHEET
Chapter 7 DC Parameters
7.1 Maximum Guaranteed Ratings
Operating Temperature Range*...........................................................................................0oC to +70oC
Storage Temperature Range ............................................................................................. -55o to +150oC
Lead Temperature Range (soldering, 10 seconds)...................................................................... +325oC
Positive Voltage on GPIO3, with respect to Ground .........................................................................5.5V
Positive Voltage on any signal pin, with respect to Ground.............................................................4.6V
Positive Voltage on XTAL1, with respect to Ground.........................................................................4.0V
Negative Voltage on GPIO8, 10 & 11, with respect to Ground (see Note 7.2)...............................-0.5V
Negative Voltage on any pin, with respect to Ground.....................................................................-0.5V
Maximum VDD18, VDD18PLL..............................................................................................................+2.5V
Maximum VDD33, VDDA33 .................................................................................................................+4.6V
*Stresses above the specified parameters could cause permanent damage to the device. This is a
stress rating only and functional operation of the device at any other condition above those indicated
in the operation sections of this specification is not implied.
Note 7.1 When powering this device from laboratory or system power supplies, it is important that
the Absolute Maximum Ratings n ot be exceeded or device failure can resu lt. Some power
supplies exhibit voltage spikes on their outputs when the AC power is switched on or off.
In addition, voltage transients on the AC power line may appear on the DC output. When
this possibility exists, it is suggested that a clamp circuit be used.
Note 7.2 When internal power FET operation of these pins is enabled, these pins may be
simultaneously shorted to ground or any voltage up to 3.63V indefinitely, without damage
to the device a s long as VDD33 and VDDA33 are less than 3.63V and TA is less than 70°C.
4th Generation USB 2.0 Flash Media Controller with Integrated Card Po we r FETs & HS Hub
Datasheet
Revision 1.6 (06-20-08) 22 SMSC USB2601/USB2602
DATASHEET
7.2 Operating Conditions
Figure 7.1 Supply Rise Time Model
Note 7.3 When powering the device, the maximum power supply ramp time should be set at a rate
faster than 400 micro seconds. This speed is important to ensure that the device resets
properly. Measure rise time at 10% and 90%.
7.3 DC Electrical Characteristics
PARAMETER SYMBOL MIN MAX UNITS COMMENTS
Operating Temperature TA0 70 °C *Ambient temperature in still air.
1.8V supply voltage VDD18,
VDD18PLL 1.62 1.98 V
3.3V supply voltage VDD33,
VDDA33 3.0 3.6 V
3.3V supply rise time tRT 0400 μs (See Figure 7.1, "Supply Rise Time
Model")
Voltage on XTAL1 -0.3 VDDA33 V
PARAMETER SYMBOL MIN TYP MAX UNITS COMMENTS
I,IPU & IPD Type Input Buffer
Low Input Level
High Input Level
Pull Down
Pull Up
VILI
VIHI
PD
PU
2.0
72
58
0.8 V
V
μA
μA
TTL Levels
t10%
10%
90%
Voltage tRT
t90% Time
100%
3.3V
VSS
VDD33
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
SMSC USB2601/USB2602 23 Revision 1.6 (06-20-08)
DATASHEET
IS Type Input Buffer
Low Input Level
High Input Level
Hysteresis
VILI
VIHI
VHYSI
2.0
500
0.8 V
V
mV
TTL Levels
ICLK Input Buffer
Low Input Level
High Input Level
VILCK
VIHCK 2.2
0.4 V
V
Input Leakage
(All I and IS buffers)
Low Input Leakage
High Input Leakage
IIL
IIH
-10
-10
+10
+10
μA
mA
VIN = 0
VIN = VDD33
O8. O8PU & 08PD Type
Buffer
Low Output Level
High Output Level
Output Leakage
Pull Down
Pull Up
VOL
VOH
IOL
PD
PU
VDD33
- 0.4
-10
72
58
0.4
+10
V
V
μA
μA
μA
IOL = 8 mA @
VDD33= 3.3V
IOH = -8mA @
VDD33= 3.3V
VIN = 0 to VDD33
(Note 7.4)
I/O8, I/O8PU & I/O8PD Type
Buffer
Low Output Level
High Output Level
Output Leakage
Pull Down
Pull Up
VOL
VOH
IOL
PD
PU
VDD33
-0.4
-10
72
58
0.4
+10
V
V
µA
µA
µA
IOL = 8 mA @
VDD33= 3.3V
IOH = -8 mA @
VDD33= 3.3V
VIN = 0 to VDD33
(Note 7.4)
PARAMETER SYMBOL MIN TYP MAX UNITS COMMENTS
4th Generation USB 2.0 Flash Media Controller with Integrated Card Po we r FETs & HS Hub
Datasheet
Revision 1.6 (06-20-08) 24 SMSC USB2601/USB2602
DATASHEET
I/O12 Type Buffer
Low Output Level
High Output Level
Output Leakage
VOL
VOH
IOL
2.4
0.4
+10
V
V
uA
IOL = 12mA @
VDD33 = 3.3V
IOH = -4mA @
VDD33 = 3.3V
VIN = 0 to VDD33
(Note 1)
IO-U
(Note 7.5)
Integrated Power FET for
GPIO8 & GPIO10
Output Current
Short Circuit Current Limit
On Resistance
Output Voltage Rise Time
IOUT
ISC
RDSON
tDSON
100
140
2.1
800
mA
mA
Ω
μs
GPIO8, or 10;
VdropFET = 0.23V
GPIO8, or 10;
VoutFET = 0V
GPIO8, or 10;
IFET = 70mA
GPIO8, or 10;
CLOAD = 10μF
Integrated Power FET for
GPIO11
Output Current
Short Circuit Current Limit
On Resistance
Output Voltage Rise Time
IOUT
ISC
RDSON
tDSON
200
181
2.1
800
mA
mA
Ω
μs
GPIO11;
VdropFET = 0.46V
GPIO11;
VoutFET = 0V
GPIO11;
IFET = 70mA
GPIO11;
CLOAD = 10μF
Supply Current Hub, Card
Reader, Unconfigured
High-Speed Host
Full-Speed Host
ICCINIT
ICCINIT 90
83 mA
mA
PARAMETER SYMBOL MIN TYP MAX UNITS COMMENTS
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
SMSC USB2601/USB2602 25 Revision 1.6 (06-20-08)
DATASHEET
Note 7.4 Output leakage is measured with the current pins in high impedance.
Note 7.5 See Appendix A for USB DC electrical characteristics.
Note 7.6 The Maximum power dissipation parameters of the package should not be exceeded
Note 7.7 The assignment of each Integrated Card Power FET to a designated Card Connector is
controlled by both firmware and the specific board impl ementation. Firmware will default to
the settings listed in Table 9.1, “GPIO Usage (ROM Rev -01),” on page 29
Supply Current
Configured
(High-Speed Host)
3 Ext Ports @HS
Card Reader Active
302 mA
Total from all
supplies
Supply Current
Configured
(High-Speed Host)
1 Ext Port @HS
Card Reader Active
242 mA
Total from all
supplies
Supply Current
Configured
(Full-Speed Host)
1 Ext Port @ FS/LS
Card Reader Active
200 mA
Total from all
supplies
Supply Current
Suspend ICSBY 298 μATotal from all
supplies.
Supply Current
Reset IRST 91 μATotal from all
supplies.
PARAMETER SYMBOL MIN TYP MAX UNITS COMMENTS
4th Generation USB 2.0 Flash Media Controller with Integrated Card Po we r FETs & HS Hub
Datasheet
Revision 1.6 (06-20-08) 26 SMSC USB2601/USB2602
DATASHEET
7.4 Capacitance
TA = 25°C; fc = 1MHz; VDD18, VDD18PLL = 1.8V
LIMITS
PARAMETER SYMBOL MIN TYP MAX UNIT TEST CONDITION
Clock Input Capacitance CIN 20 pF All pins except USB pins
(and pins under test tied to
AC ground)
Input Capacitance CIN 10 pF
Output Capacitance COUT 20 pF
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
SMSC USB2601/USB2602 27 Revision 1.6 (06-20-08)
DATASHEET
Chapter 8 Package Information
8.1 Package Outline
Figure 8.1 USB2601/USB2602 128-Pin TQFP Package Outline
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.035 mm maximum.
Package body dimensions D1 and E1 do not include the mold protrusion.
3. Maximum mold protrusion is 0.25 mm.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Table 8.1 USB2601/USB2602 128-Pin TQFP Package Parameters
MIN NOMINAL MAX REMARKS
A ~ ~ 1.20 Overall Package Height
A1 0.05 ~ 0.15 Standoff
A2 0.95 ~ 1.05 Body Thickness
D 15.80 ~ 16.20 X Span
D1 13.80 ~ 14.20 X body Size
E 15.80 ~ 16.20 Y Span
E1 13.80 ~ 14.20 Y body Size
H 0.09 ~ 0.20 Lead Frame Thickness
L 0.45 0.60 0.75 Lead Foot Length
L1 ~ 1.00 ~ Lead Length
e 0.40 Basic Lead Pitch
q0
o~7
oLead Foot Angle
W 0.13 0.18 0.23 Lead Width
R1 0.08 ~ ~ Lead Shoulder Radius
R2 0.08 ~ 0.20 Lead Foot Radius
ccc ~ ~ 0.08 Coplanarity
4th Generation USB 2.0 Flash Media Controller with Integrated Card Po we r FETs & HS Hub
Datasheet
Revision 1.6 (06-20-08) 28 SMSC USB2601/USB2602
DATASHEET
8.2 Package Thermal Specifications
Tab le 8.2 12 8-Pin TQFP Package Thermal Param eters
PARAMETER SYMBOL VALUE UNIT COMMENTS
Thermal Resistance ΘJA 53.1 oC/W From the die to the ambient air
Junction-to-Top-of-Package ΘJT 0.3 oC/W
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub
Datasheet
SMSC USB2601/USB2602 29 Revision 1.6 (06-20-08)
DATASHEET
Chapter 9 GPIO Usage
Table 9.1 GPIO Usage (ROM Rev -01)
NAME ACTIVE
LEVEL SYMBOL DESCRIPTION AND NOTE
GPIO1 H Flash Media Activity LED/
xD_Door Indicates media activity. Media or USB
cable must not be removed with LED lit.
Also may be used for xD Door
functionality.
GPIO2 H EE_CS Serial EE PROM chip select.
GPIO3 H V_BUS USB V bus detect.
GPIO4 H EE_DIN/EE_DOUT/xDID Serial EE PROM input/output and xD
Identify.
GPIO5 H HS_IND/SD_CD HS Indicator LED or SD Card Detect
Switch input.
GPIO6 H A16/ROMEN A16 address line connect for DFU or
debug LED indicator optional.
GPIO7 H EE_CLK/
UNCONF_LED Serial EE PROM clock output or
Unconfigured LED.
GPIO8 L MS_PWR_CTRL/
CRD_PWR0 Memory Stick Card Power Control, or
Internal Power FET0.
GPIO9 L CF_PWR_CTRL CompactFlash Card Power Control.
GPIO10 L SM_PWR_CTRL/
CRD_PWR1 SmartMedia Card Power Control, or
Internal Power FET1.
GPIO11 L SD/MMC_PWR_CTRL/
CRD_PWR2 SD/MMC Card Power Control, or
Internal Power FET2.
GPIO12 H MS_ACT_IND/
Media Activity Memory Stick Activity Indicator, or
Media Activity LED.
GPIO13 H CF_ACT_IND CompactFlash Activity Indicator.
GPIO14 H SM_ACT_IND SmartMedia Activity Indicator.
GPIO15 H SD/MMC_ACT_IND SD/MMC Activity Indicator.
