INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1303-R05 1
CPC1303
Optocoupler with
Single-Transistor Output
Part Number Description
CPC1303G 4-Pin DIP (100/Tube)
CPC1303GR 4-Pin Surface Mount, Tubed (100/Tube)
CPC1303GRTR 4-Pin Surface Mount, Tape & Reel (1000/Reel)
Parameter Rating Units
Breakdown Voltage - BVCEO 30 VP
Current Transfer Ratio 200 %
Saturation Voltage 0.5 V
Input Control Current 0.2 mA
Applications
Features
Description
Ordering Information
Pin Configuration
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment: Patient/Equipment Isolation
• Aerospace
• Industrial Controls
• 5000Vrms Input/Output Isolation
• Low Drive Power Requirements
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 4-pin Package
The CPC1303 is a unidirectional input optocoupler
with a single-transistor output, which uses optically
coupled technology to provide an enhanced 5000Vrms
isolation barrier between the input and the output.
The optically coupled output is controlled by a highly
efficient infrared LED.
This optocoupler satisfies the PD output requirements
of IXYS Integrated Circuits Division's CPC1466
Broadband ADSL/VDSL DC Termination IC.
Approvals
• UL 1577 Approved Component: File E76270
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 13 12 82667 003
1
A
K
C
E
2
4
3
INTEGRATED CIRCUITS DIVISION
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2R05
CPC1303
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements..
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
Parameters Conditions Symbol Min Typ Max Units
Output Characteristics
Phototransistor Breakdown Voltage ICEO=10µA BVCEO 30 - - VP
Phototransistor Output (Dark) Current VCEO=5V, IF=0mA ICEO - 25 500 nA
Saturation Voltage IC=0.4mA, IF=0.2mA VCEsat
- 0.1 0.45 V
IC=10mA, IF=10mA - 0.12 0.5
Current Transfer Ratio IF=0.2mA, VCE=0.5V CTR 200 1000 2500 %
Output Capacitance IF=0mA, V=25V, f=1MHz COUT -6-pF
Input Characteristics
Input Control Current IC=0.4mA, VCE=0.5V IF- - 0.2 mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Input Reverse Current VR=5V IR- - 10 µA
Common Characteristics
Capacitance, Input to Output VIO=0V, f=1MHz CIO -3-pF
Parameter Ratings Units
Breakdown Voltage 30 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Power Dissipation 2
Input 1150
mW
Phototransistor 2150
Isolation Voltage, Input to Output 5000 Vrms
Operating Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / oC
2 Derate linearly 2.00 mW / oC
Characteristic Symbol Test Condition Typ Units
Turn-On Time ton VCC=5V, IF=1mA, RL=5002s
Turn-Off Time toff 8
Switching Characteristics @ 25ºC
Switching Time Test Circuit VCC
VCE
RL
IF
Pulse Width=5ms
Duty Cycle=1%
IF
10%
90%
ton toff
VCE
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CPC1303
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R05
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
LED Forward Voltage (V)
1.1 1.2 1.3 1.4 1.5 1.6
LED Forward Current (mA)
0
10
20
30
40
50
LED Voltage vs. LED Current
(Linear)
LED Forward Voltage (V)
1.1 1.2 1.3 1.4 1.5 1.6
LED Forward Current (mA)
0.1
1
10
100
LED Voltage vs. LED Current
(LOG)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
LED Forward Voltage
vs. Temperature
IF=50mA
IF=5mA
IF=10mA
IF=20mA
IF=0.2mA
IF=1mA
IF=2mA
LED Forward Current (PA)
1 10 100 1000
CTR (%)
0
200
400
600
800
1000
1200
LED Forward Current vs. CTR
-40ºC
85ºC
25ºC
Collector Voltage (V)
012345
Collector Current (mA)
0
10
20
30
40
50
60
Typical Collector Voltage vs.
Typical Collector Current
IF=5mA
IF=3mA
IF=2mA
IF=1mA IF=0.5mA IF=0.2mA
Temperature (ºC)
-40 0 40 80 120
ICE Current (PA)
1
10
100
1000
10000
100000
ICE Current vs. Temperature
IF=1000PA
IF=1PA
IF=2PA
IF=5PA
IF=10PA
IF=20PA
IF=50PA
IF=100PA
IF=200PA
IF=500PA
Load Resistance (k:)
0 20406080100
Turn-On Time (Ps)
0.9
1.0
1.1
1.2
1.3
1.4
1.5
Turn-On Time vs. Load Resistance
(IF=1mA, VCC=5V)
Load Resistance (k:)
0 20406080100
Turn-Off Time (Ps)
0
50
100
150
200
250
300
350
Turn-Off Time vs. Load Resistance
(VCC=5V, IF=1mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Saturation Voltage (V)
0.06
0.08
0.10
0.12
0.14
0.16
Saturation Voltage vs. Temperature
(IF=1mA, ICE=2mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
87
88
89
90
91
92
93
94
95
96
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
100
200
300
400
500
Leakage Current vs. Temperature
VCE Leakage 10V
VCE Leakage 3V
VCE Leakage 5V
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*
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CPC1303
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1303G MSL 1
CPC1303GR MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1303GR, the solder
reflow profile given in Technical Brief TB-200 "Pb-Free Solder Reflow Profile for Select Devices" must be followed.
For the through-hole device, CPC1303G, and any other processes, the guidelines of J-STD-020 must be observed.
Device Maximum Body Temperature (Tc) Time
CPC1303GR 250ºC 15 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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CPC1303
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MECHANICAL DIMENSIONS
PC Board Pattern (Top View)
Dimensions
mm
(inches)
PIN 1
6.350 ± 0.127
(0.250 ± 0.005)
4.572 ± 0.127
(0.180 ± 0.005)
0.991
(0.039)
9º (ALL)
3.30 ± 0.050
(0.130 ± 0.002)
0.254
(0.010)
9.144 ± 0.508
(0.360 ± 0.020)
7.620 ± 0.250
(0.300 ± 0.010)
7.620 ± 0.127
(0.300 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
9º (ALL)
0.457 ± 0.076
(0.018 ± 0.003)
2.540 ± 0.127
(0.100 ± 0.005) 3.175
(0.125)
0.508
(0.020)
2.159
(0.085)
Dimensions
mm
(inches)
PCB Land Pattern
PIN #1
6.350 ± 0.127
(0.250 ± 0.005)
0.991
(0.039)
9.525
(0.375)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.254
(0.025 ± 0.010)
0.254
(0.010)
3.300 ± 0.050
(0.130 ± 0.002)
3.480 ± 0.076
(0.137 ± 0.003)
2.287
(0.09)
8.80
(0.346)
1.60
(0.063)
0.95
(0.037)
9º ± 1º
(ALL)
0.102 min / 0.254 max
(0.004 min / 0.010 max)
4.572 ± 0.127
(0.180 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
2.287 ± 0.127
(0.090 ± 0.005)
CPC1303G
CPC1303GR
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1303-R05
©Copyright 2016, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
1/7/2016
For additional information please visit our website at: www.ixysic.com
6
CPC1303
Dimensions
mm
(inches)
NOTES:
1. All dimensions meet EIA-481-C requirements
2. Unless otherwise noted, tolerances = ±0.10 (0.004)
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max) K0=4.20
(0.165)
K1=3.70
(0.146)
W=16.00±0.30
(0.630±0.012)
A0=10.01
(0.394)
P=12.00
(0.472)
B0=5.00
(0.197)
CPC1303GRTR Tape & Reel
