SFH 4500
SFH 4505
Schnelle IR-Lumineszenzdiode (950 nm) im SMR®-Gehäuse
High-Speed Infrared Emitter (950 nm) in SMR ® Package
2001-04-18 1
SFH 4500 SFH 4505
Wesentliche Merkmale
• Hohe Pulsleistung und hoher Gesamt-
strahlungsfluß Φe
•SMR
® (Surface Mount Radial)-Gehäuse
• Sehr kurze Schaltzeiten (10 ns)
• Sehr hohe Langzeitstabilität
• Hohe Zuverlässigkeit
Anwendungen
• Bauteil mit hoher Strahlstärke zur
Oberflächenmontage (SMT)
• Schnelle Datenübertragung mit
Übertragungsraten bis 100 Mbaud
(IR Tastatur, Joystick, Multimed ia)
• Analoge und digitale Hi-Fi Audio- und
Videosignalübertragung
• Batteriebetriebene Geräte (geringe
Stromaufnahme)
• Anwendungen mit hohen
Zuverlässigkeits-ansprüchen bzw.
erhöhten Anforderungen
• Alarm- und Sicherungssysteme
• IR Freiraumübertragung
Features
• High pulse power and high radiant flux Φe
•SMR
® (Surface Mount Radial) package
• Very short switching times (10 ns)
• Very high long-time stability
• High reliability
Applications
• Device with high radiant intensity suitable for
surface mounting (SMT)
• High data transmission rate up to 100 Mbaud
(IR keyboard, Joystick, Multimedia)
• Analog and digi tal Hi-Fi audi o an d vi deo s ignal
transmission
• Low power consumption (battery) equipment
• Suitable for professional and high-reliability
applications
• Alarm and safety equipment
• IR free air transmission
2001-04-18 2
SFH 4500, SFH 4505
Typ
Type Bestellnummer
Ordering Code Gehäuse
Package
SFH 4500 Q62702-P5163 5-mm-SMR®-Gehäuse (T1 ¾), schwarzes Epoxy-
Gießharz, Anschlüsse (SFH 4500 gebogen, SFH 4505
gerade) im 2.54-mm-Raster (1/10’’),
Kathodenkennung: siehe Maßzeichnung.
5 mm SMR® package (T1 ¾), black epoxy resin, solder
tabs (SFH 4500 bent, SFH 4505 straight) lead spacing
2.54 mm (1/10’’),
cathode marking: see package outline.
SFH 4505 Q62702-P5164
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range Top; Tstg – 40 … + 100 °C
Sperrspannung
Reverse voltage VR3V
Durchlaßstrom
Forward current IF (DC) 100 mA
Stoßstrom
Surge current
tp = 10 µs, D = 0
IFSM 2.2 A
Verlustleistung
Power dissipation Ptot 180 mW
Wärmewiderstand Sperrschicht - Umgebung,
freie Beinchenlänge max. 10 mm
Thermal resistance junction - ambient,
lead length between package bottom and PCB
max. 10 mm
RthJA 375 K/W
SFH 4500, SFH 4505
2001-04-18 3
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Wellenlänge der Strahlung
Wavelength of peak emission
IF = 100 mA, tp = 20 ms
λpeak 950 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 100 mA, tp = 20 ms
∆λ 40 nm
Abstrahlwinkel
Half angle ϕ± 10 Grad
deg.
Aktive Chipfläche
Active chip area A0.09 mm2
Abmessungen der aktiven Chipfläche
Dimension of the active chip area L×B
L×W0.3 ×0.3 mm
Schaltzeiten, Ie von 10% auf 90% und
von 90% auf 10%
Switching tim es, Ie from 10% to 90% and
from 90% to 10%
IF = 100 mA, tP = 20 ms, RL = 50 Ω
tr, tf10 ns
Kapazität
Capacitance
VR = 0 V, f = 1 MHz
Co 35 pF
Durchlaβspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µsVF
VF
1.5 (≤ 1.8)
3.2 (≤ 4.0) V
V
Sperrstrom
Reverse current
VR = 3 V
IR0.01 (≤ 10) µA
Gesamtstrahlungsfluß
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe32 mW
Temperaturkoeffizient von Ie bzw. Φe
Temperature coefficient of Ie or Φe
IF = 100 mA
TCI – 0.44 %/K
2001-04-18 4
SFH 4500, SFH 4505
Temperaturkoeffizient von VF
Temperature coefficient of VF
IF = 100 mA
TCV– 1.5 mV/K
Temperaturkoeffizient von λ
Temperature coefficient of λ
IF = 100 mA
TCλ+ 0.2 nm/K
Strahlstärke Ie in Achsrichtung
gemessen bei einem Raumwinkel von Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
measured at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie min
Ie typ
40
80 mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 µs
Ie typ 500 mW/sr
Lötbedingungen
Soldering Conditions
Tauch-, Schwall- und Schlepplötung
Dip, Wave and Drag Soldering Kolbenlötung (mit 1,5-mm-Kolbenspitze)
Iron Soldering (with 1.5-mm-bit)
Lötpad-
temperatur
Temperature
of the
Soldering Bath
Maximal
zulässige
Lötzeit
Max. Perm.
Soldering
Time
Abstand
Lötstelle –
Gehäuse
Distance
Between
Solder Joint
and Case
Temperatur
des Kolbens
Temperature
of the Solder-
ing Iron
Maximale
zulässige
Lötzeit
Max. Permis-
sible Solder-
ing Time
Abstand
Lötstelle –
Gehäuse
Distance
between
Solder Joint
and Case
260 °C 10 s ≥ 1.5 mm 300 °C3 s ≥ 1.5 mm
Kennwerte (TA = 25 °C) (cont’d)
Characteristics
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
SFH 4500, SFH 4505
2001-04-18 5
Relati ve Sp ectral Emission
Ierel = f (λ)
Forward Cu rrent IF = f (VF)
single pu ls e, tp = 20 µs
Permissible Pulse Handling
Capability IF = f (τ), TA = 25 °C,
duty cycle D = parameter
OHF00777
nm800
Ιerel
λ
0
850 900 950 1000 1100
20
40
60
80
100
OHF00784
10
-3
V
mA
0
Ι
F
V
F
0.5 11.5 22.5 33.5 4.5
10
-2
10
-1
10
0
10
1
10
2
10
3
10
4
OHF00041
10-5
F
I
T
P
t
=
D
P
t
T
p
t
F
I
0.005
0.01
0.02
0.05
D
10-4 10-3 10-2 10-1 100101 2
10s
0.1
0.2
0.5
1
=
5
-1
10
5
A
100
1
10
Radiant Intensity Ιe/Ιe (100 mA) = f (IF)
Single pulse , tp = 20 µs
Radiation Characteristic
Ierel = f (ϕ)
e
e (100 mA)
mA
OHF00809
F
Ι
ΙΙ
10 40
10 10 110 23
10
10
-3
10
-2
10
10
-1
0
10
2
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
0˚10˚20˚40˚ 30˚
OHF01019
50˚
60˚
70˚
80˚
90˚
100˚ 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
Max. Permissible Forward Current
IF = f (TA)
OHF01534
0
I
F
T
0
25
50
75
100
125
mA
10 20 30 40 50 60 70 80 ˚C 100
2001-04-18 6
SFH 4500, SFH 4505
Maßzeichnungen
Package Outlines
Maße werden wi e fo lgt angegeben: mm (inch) / Dimensio ns are s pecified as follow s: m m (inc h).
GEOY6968
3.9 (0.154)
4.5 (0.177)
Cathode/
7.1 (0.280)
7.7 (0.303)
2.54 (0.100)
spacing
13.1 (0.516)
14.7 (0.579)
5.5 (0.217)
7.5 (0.295)
1.95 (0.077)
2.05 (0.081)
R((3.2) (0.126))
5.4 (0.213)
6.0 (0.236)
((3.2) (0.126))
2.7 (0.106)
2.4 (0.094)
4.4 (0.173)
4.8 (0.189)
((R2.8 (0.110))
(-0.004...0.008)
3.7 (0.146)
3.3 (0.130)
2.8 (0.110)
2.4 (0.094)
4.5 (0.177)
3.9 (0.154)
Chip position
Collector
-0.1...0.2
SFH 4500
GEOY6961
3.9 (0.154)
4.5 (0.177)
Cathode
7.1 (0.280)
7.7 (0.303)
2.54 (0.100)
spacing
14.7 (0.579)
15.5 (0.610)
7.4 (0.291)
8.0 (0.315) ((3.2) (0.126))
5.4 (0.213)
6.0 (0.236)
((3.2) (0.126))
2.7 (0.106)
2.4 (0.094)
4.4 (0.173)
4.8 (0.189)
((R2.8 (0.110))
R2.05 (0.081)
1.95 (0.077)
Chip position
3.9 (0.154)
4.5 (0.177)
(-0.006...0.006)
-0.15...0.15
SFH 4505
SFH 4500, SFH 4505
2001-04-18 7
Published by OSRAM Opto Semiconductors GmbH & Co. OHG
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The inform at ion describe s the type of compon ent and shall not be considered as assur ed c haracteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recyc ling operat ors known t o you. We can also help y ou – get in touch wit h your near est sales offic e.
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material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Compo nents use d in life-support de vices or syste ms must be express ly authorize d for such purp ose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critica l component is a co mponent usedin a l ife-support devi ce or system whose failure can re asonably be expec ted
to cause t he fail ure of tha t life -suppo rt dev ice or s ystem, or to affe ct i ts saf ety or effecti venes s of t hat device o r sy stem.
2 Life sup port device s or syst ems ar e int ended (a ) to b e imp lanted in t he hu man body , or ( b) to supp ort a nd/or main tain
and sust ain human life. If th ey fail , it is rea so nable to assume th at the health of the user may be endangered.
