BD7672BG-GTR - ROHM SEMICONDUCTOR

Datasheet

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

1/17 TSZ02201-0F1F0A200160-1-1

TSZ22111・14・001

www.rohm.com

PWM Control Type

DC/DC Converter IC for AC/DC Driver

BD7672BG

●General Description

BD7672BG is a PWM controller typed DC/DC

converter for AC/DC that provides an optimum system

for all products that requires an electrical outlet. This

product supports both isolated and non-isolated devices.

IC enables simple design of low-power converters.

With switching MOSFET and current detection resistor

as external devices, it enables more freedom in design.

Since the peak current control is utilized, peak current

is controlled in each cycle, application excels wide

bandwidth and transient response.

BD7672BG includes various protective functions such

as soft start function, burst function, per-cycle over

current limiter, VCC overvoltage protection and

overload protection.

An external latch pin (COMP pin) is provided, so that

latch stopping (OFF) can be set by external signals.

This function is available as overheating protection and

over output voltage protection.

The PWM switching frequency is fixed at 65 kHz.

A frequency hopping function is included which contributes

to low EMI.

●Features

■ PWM frequency of 65kHz

■ PWM current mode method

■ Low circuit current when UVLO is ON

(12μA at VCC=12V)

■ Low circuit current in no load

(Burst operation when load is light)

■ Built-in SW frequency hopping function

■ 250nsec leading-edge blanking

■ VCC UVLO / OVP

■ Per-cycle over current protection circuit

■ Soft start

■ Output overload protection (Self-restart protection)

■ External latch function for COMP pin

(Over heating protection function)

●Key Specifications

 Power Supply Voltage range: 8.5V to 25.0V

 Operating Current: Normal: 0.60mA (Typ)

Burst: 0.40mA (Typ)

 Oscillation Frequency: 65kHz (Typ)

 Operating Temperature range: -40°C to +105°C

●Package W(Typ) x D (Typ) x H (Max)

SSOP6 2.90mm x 2.80mm x1.25mm

●Applications

AC adapters and household appliances (vacuum cleaners,

humidifiers, air cleaners, air conditioners, refrigerators, IH

cooking heaters, rice cookers, etc.)

●Typical Application Circuit

Figure 1. Application Diagram (12 V 1A Isolated Type)

ZNR1

FL1

+C5

+C1

R10

7673

R11

7672B

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Datasheet

BD7672BG

TSZ02201-0F1F0A200160-1-1

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TSZ22111・15・001

●Pin Configuratio n（SSOP6）

(Unit:mm)

Figure 2, External Dimensions of SSOP6 Package

●Pin Description

Table 1. I/O PIN Functions

NO. Pin Name I/O Function ESD protection system

VCC GND

1 GND I/O GND pin ○ -

2 FB I Feedback signal input pin ○ ○

3 COMP I Comparator input pin ○ ○

4 CS I Primary current sensor pin ○ ○

5 VCC I Power supply input pin - ○

6 OUT O External MOS drive pin ○ ○

●I/O Equivalent Circuit

Figure 3. I/O Equivalent Circuit

2 B

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BD7672BG

TSZ02201-0F1F0A200160-1-1

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●Block Diagram

FeedBack

With

Isolation

85- 265Vac

FUSE

Filter Diode

Bridge

OSC =65 kHz

PWM Control

Leading Edge

Blanking

(typ=250ns)

VCC UVLO

13.5V / 7.5V

DRIVER

Current Limit

Comparator

PWM

Comparator

Pulse Skip

Comparator

MAX

DUTY

Slope

Compensation

4.0V LineReg

20kΩ

Soft Start

0～1msec Maxduty 15%

1～8msec Maxduty 25%

OLP

Comparator

Internal Block

VCC OVP

LATCH

(27.5V)

4.0V LineReg

Timer

(250ms)

Frequency

hopping

0.5V

4.0V

LineReg

25.9kΩ

Figure 4. Block Diagram

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Datasheet

BD7672BG

TSZ02201-0F1F0A200160-1-1

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TSZ22111・15・001

●Description of Each Block

( 1 ) Start Sequences (Soft Start Operation, Light Load Operation, and Overload Protection)

Start sequences are shown in Figure 5. This is also shown the operation of overload protection.

See the sections below for detailed descriptions

Vout

Switing

VCC

VCC=13.5V

Soft Start

250ms

Iout

Normal Load

Light LOAD

Within

250ms

VCC＝7.5V

Over Load

Internal REF

Pull Up

Burst mode

ABCD

EFGH IJ

Switching

stop

VCC＝7.0V

Figure 5. Start Sequence Timing Chart

A: Input voltage VH is applied

B: VCC pin voltage rises by being supplied from VH line through start resistor “Rstart” and the IC starts operating when VCC >

VUVLO1 (13.5V Typ). Switching operation starts when other protection functions are judged as normal. From startup to be

stable output voltage, application should be set to stabilize output voltage during VCC > VUVLO2 (7.5V Typ) because the VCC

pin consumption current causes the VCC voltage drop.

C: Operated soft start function, maximum duty is restricted to 15% during a 1ms period to prevent any excessive rise in voltage

or current. From 1ms to 8ms, maximum duty is restricted to 25%. Maximum duty is restricted to 75% after 8ms.

D: VOUT voltage rises when the switching operation starts. Once the output voltage starts, it is set to the rated voltage level

within the TFOLP period (250ms Typ). The output voltage is regulated within TFOLP (=250ms Typ) from starting.

E: During Light Load, when FB pin voltage < VBST (=0.3V Typ), Burst method is operated to keep power consumption down.

F: Over Load condition occurs when FB pin voltage > VFOLP1A (=3.6V Typ).

G: When FB pin voltage is at VFOLP1A (= 3.6V Typ) for more than TFOLP (250ms Typ), the overload protection function is triggered

and switching is stopped. The IC’s internal 250ms timer is reset during the TFOLP period (250ms Typ) if FB < VFOLP1B even

once.

H: If the VCC voltage drops to VUVLO2 (7.5V typ) or below, restart is executed.

I: The IC’s circuit current is reduced and the VCC pin value rises. (Same as B).

J: Same as D

In Figure 4, start resistor Rstart is needed to start the application.

When the start resistor Rstart value is reduced, standby power is increased and the startup time is shortened.

Conversely, when the start resistor Rstart value is increased, standby power is reduced and the startup time is increased.

Standby current is less than 20uA at VCC UVLO is disable, and it can calculate VCC UVLO voltage from VUVLO1=14.5V

(Max).

ex） Starting resistor Rstart setting method;

Rstart = (VHmin - VUVLO1（Max）) / IOFF（Max）

In the case of Vac=100V (-20% of a margin), Rstart requirement can be found by the following formulas:

VHmin =100 × √2 × 0.8 = 113V

Because of VUVLO1 (Max) =14.5V, Rstart ≦ (113V - 14.5V) / 20μA＝4.925MΩ

Start-up time can be found by the following formulas:

Tstart = -Rstart × CVCC × ln (1-VUVLO1/VHmin)

ex）Rstart=3.0MΩ

Rstart resistor loss in this case is : Pd (Rstart) = (VH-VCC)2 / Rstart = (141V - 14.5V)2 / 3.0M = 5.33mW.

Switching

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Datasheet

BD7672BG

TSZ02201-0F1F0A200160-1-1

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TSZ22111・15・001

( 2 ) VCC Pin Protection

BD7672BG includes UVLO (Under Voltage Locked Out) and OVP (Over Voltage Protection) functions to monitor VCC pin

voltage (see Figure 6 for OVP latch operation).

The UVLO function prevents damage to MOSFET by stopping switching operations by latch protection when the VCC pin

voltage drops to VCC < VUVLO2 (= 7.5V Typ).

The VCC OVP function prevents damage to MOSFET by stopping switching operations when the VCC pin voltage exceeds

VOVP1 (= 27.5V Typ).

The latch release condition is when VCC < VLATCH (VUVLO2 - 0.5V, Typ = 7.0V). A latch blanking time is used for protecting

mal-function. This time is 100us.

7. 5 V

13. 5V

VCC

Switing

Time

OFF

Time

27.5V

7. 0V

OFF

OUT

100 us

Figure 6. VCC UVLO/OVP Operation (Latch)

Switching

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TSZ22111・15・001

( 3 ) DCDC Driver (PWM Comparator, Frequency Hopping, Slope Compensation, OSC, Burst)

BD7672BG uses current mode PWM control. In the internal generator, the average switching frequency is 65 kHz.

Furthermore, switching frequency hopping function is built-in while the switching frequency fluctuation is shown as in

Figure 7. Fluctuation cycle is 125Hz (=8ms).

Figure 7. Frequency Hopping Function

The max-duty cycle is fix to 75% (Typ) at OUT pin and minimum pulse width is fix at 500ns (Typ). When the duty cycle

exceeds 50% at Current Mode control, the sub-harmonic oscillation occurs. To prevent it, IC is built-in slope

compensation function.

BD7672BG has burst mode function to attain less power consumption when load is light. This function monitors FB pin

voltage and detects light load when FB voltage < VBST (=0.3V Typ).

The secondary output voltage, the FB voltage and the DCDC function are shown in Figure 8.

FB pin is pulled up by RFB (=20kΩ Typ). At light load, when the secondary output voltage rises, the FB pin voltage will

drop and when this goes below VBST (=0.3V Typ) burst function will follow to reduce the power consumption.

Figure 8. Switching Operation Status Changes by FB Pin Voltage

+4kHz

(+6%)

-4kHz

(-6%)

Switching frequency

65kHz

Burst

0.3V 3.6V

FB PIN Voltage

Overload

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Datasheet

BD7672BG

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( 4 ) Over Current Limiter and Leading Edge Blanking Period

BD7672BG has over current limiter for each switching cycle.

When the CS pin voltage exceeds the VCS voltage (=0.5V Typ), switching is turned OFF.

In addition, when the driver MOSFET is turned ON, surge current occurs at each capacitor component and drive current.

Therefore, when the CS pin voltage rises temporarily, the detection errors may occur in the over current limiter circuit. To

prevent detection errors, the OUT pin is switched from low to high and the CS signal is blanked for 250nsec by the LEB

(Leading Edge Blanking) function. This blanking function enables a reduction of CS pin noise filtering in response to noise

that occurs when the OUT pin is switched from low to high.

( 5 ) Output Overload Protection Function (FB OLP Comparator )

Overload Protection Function monitors the load status of secondary output through FB pin and stops the switching of OUT

pin during excessive load. In over load condition, there is no current in photo-coupler because output voltage decreases

(drops) while FB pin voltage rises.

When FB pin voltage exceeds VFOLP1A (=3.6V Typ) at TFOLP (=250ms Typ) interval continuously, a load is excessive and

OUT pin is fixed to L. The timer of overload protection is reset when FB pin drops further than VFOLP1B (=3.4V Typ) within

TFOLP (=250ms Typ) after exceeding VFOLP1A (=3.6V Typ). Switching functions within this TFOLP (=250ms Typ).

FB voltage, which is pulled up in resistance to IC internal voltage operates from VFOLP1A (=3.6V Typ) or more at start-up. For

this matter, set the start-up time of the secondary output voltage such that the FB voltage is always VFOLP1B (=3.4V Typ) or

less within TFOLP (=250ms Typ) at start-up.

Figure 9. Overload Protection (Self-restart)

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Datasheet

BD7672BG

TSZ02201-0F1F0A200160-1-1

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TSZ22111・15・001

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

16.0

18.0

20.0

0 20 40 60 80 100 120 140 160 180 200

Resistervalue R[kΩ]

Temparature T[℃]

t(typ3.7kΩ)

Detect

( 6 ) COMP Pin External Latch Function

IC is latched when the COMP pin voltage goes below VCOMP (0.5V Typ). A latch timer for TLATCH (100us Typ) added to

prevent operation errors caused by noise.

The COMP pin is pulled up by RCOMP (25.9kΩ Typ), and when RT (3.7kΩ Typ) is pulled down at the COMP pin, latch

protection is operated. Some application examples are shown in Figure 10, Figure 11, and Figure 12.

Overheating Protection by NTC Thermistor

A thermistor is attached to the COMP pin so that latching can be stopped when overheating occurs.

In the case of this application, it should be designed so that the thermistor resistance becomes RT (3.70kΩ Typ) when

overheating is detected.

(Figure 10 and Figure 11 are application circuit examples in which latch operation occurs when Ta = 110℃)

The variation in RT (=3.70kΩ Typ) shown in an electrical property includes only IC.

Please add the variation of external thermistor resistance to it and design.

Figure 10. COMP Pin Overheating Protection Application Figure 11. Temperature-Thermistor Resistance Value

Secondary Output Voltage Overvoltage Protection

A photo-coupler is attached to the COMP pin to perform detection of secondary output overvoltage.

COMP

LA T C H

(typ25.9k Ω)

RCOMP

(Typ=25.9kΩ)

Figure 12. Output Overvoltage Protection Application

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Datasheet

BD7672BG

TSZ02201-0F1F0A200160-1-1

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TSZ22111・15・001

●Absolute Maximum Ratings （Ta=25℃）

Parameter Symbol Rating Unit Conditions

Maximum Applied Voltage 1 Vmax1 30 V VCC, OUT

Maximum Applied Voltage 2 Vmax2 6.5 V CS, FB, COMP

OUT pin output Peak Current IOUT ±1.0 A

Allowable Dissipation Pd 674.9 (Note1) mW When implemented

Operating Temperature Range Topr -40 to +105 oC

Storage Temperature Range Tstr -55 to +150 oC

(Note1) SSOP6: Derate by 5.399 mW/°C when operating above Ta=25°C (when mounted on 70 mm × 70 mm, 1.6 mm thick,

glass epoxy on single-layer substrate).

●Recommended Operatin g Ratings（Ta=25℃）

Parameter Symbol Rating Unit Conditions

Power Supply Voltage Range VCC 8.5 to 25.0 V VCC pin voltage

●Electrical Characteristics (Unl ess otherwise no ted, Ta = 25C, VCC=12V)

Parameter Symbol Specifications Unit Conditions

MIN TYP MAX

［Circuit Current］

Circuit Current (OFF) IOFF - 12 20 μA VCC = 12V

(UVLO = Detection)

Circuit Current (ON) 1 ION1 - 600 1000 μA FB = 2.0V COMP: 100kΩ

(during pulse operation)

Circuit Current (ON) 2 ION2 - 400 650 μA

FB = 0.0V COMP:100kΩ

(during pulse operation

when OFF

)

［VCC Pin Protection Function］

VCC UVLO Voltage 1 VUVLO1 12.50 13.50 14.50 V VCC rise

VCC UVLO Voltage 2 VUVLO2 6.50 7.50 8.50 V VCC drop

VCC UVLO Hysteresis VUVLO3 - 6.00 - V VUVLO3= VUVLO1- VUVLO2

VCC OVP Voltage 1 VOVP1 25.0 27.5 30.0 V VCC rise

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●Electrical Characteristics o f control block (Unless otherwise noted , Ta = 25C, VCC=12V)

Parameter Symbol Specifications Unit Conditions

MIN TYP MAX

[PWM Type DCDC Driver Block]

Oscillation Frequency FSW1 60 65 70 KHz

FB=2.0V

average frequency

Frequency Hopping Width 1 FDEL1 - 4.0 - KHz FB=2.0V

Hopping Fluctuation Frequency FCH 93 125 157 Hz

Minimum Pulse Width Tmin - 500 - ns

Soft Start Time 1 TSS1 0.75 1.00 1.25 ms

Soft Start Time 2 TSS2 6.00 8.00 10.00 ms

Maximum Duty 1 Dmax 68.0 75.0 82.0 % During normal operation

Maximum Duty 2 DSS1 5.0 15.0 25.0 %

During soft start

0[ms] to Tss1[ms]

Maximum Duty 3 DSS2 15.0 25.0 35.0 %

During soft start

TSS1 [ms] to TSS2 [ms]

FB pin Pull-up Resistance RFB 15 20 25 kΩ

⊿

FB / ⊿

CS Rain Gain - 5 - V/V

FB Burst Voltage VBST 0.20 0.30 0.40 V During FB drop

FB OLP Voltage 1a VFOLP1A 3.3 3.6 3.9 V

When overload is detected

(FB rise)

FB OLP Voltage 1b VFOLP1B -

VFOLP1A-0.2

V When overload is detected

(FB drop)

FB OLP Timer TFOLP 187 250 312 ms

Latch Release Voltage

(VCC pin voltage) VLATCH -

VUVLO2-0.5 - V

Latch release voltage

VCCUVLO2-0.5 [V]

Latch Mask Time TLATCH 50 100 200 us

VCCOVP, COMP

Mask time

[Overcurrent Detection Block]

Overcurrent Detection Voltage VCS 0.475 0.500 0.525 V

Leading Edge Blanking Time TLEB - 250 - ns

[Output Driver Block]

OUT pin Pch MOS Ron RPOUT 10 25 39 Ω

OUT pin Nch MOS Ron RNOUT 3 7 12 Ω

[External Latch Comparator Block]

COMP pin Latch Detection

Voltage VCOMP - 0.5 - V

COMP pin Pull-up Resistance RCOMP - 25.9 - kΩ

Thermistor Resistance

Detection Value RT 3.30 3.70 4.10 kΩ Thermistor connected

to COMP pin

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Datasheet

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TSZ22111・15・001

●Typical Performance Curves

(This is not a guarantee sin ce this is the reference data. Figure 36 shows the measurement circuit diagram.)

Figure 13, Typ Frequency Fsw1 Figure 14, MAXDUTY1 (With Typ frequency) Figure 15, MAXDUTY2 (With Typ frequency）

Figure 16, MAXDUTY3 (With Typ frequency） Figure 17, MAXDUTY SS1 (VCC=15） Figure 18, MAXDUTY SS2 (VCC=15)

Figure 19, NMOS RON (VCC=12)

Figure 23, FBRES (VCC=12)

Figure 20, PMOS RON (VCC=12) Figure 21, Timer Latch

Figure 22, ICC (VCC) OFF (VCC=12)

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Figure 24, FB OVP 256ms(VCC=12) Figure 25, CURLIM Voltage (VCC=12) Figure 26, FB Burst Voltage (VCC=12)

Figure 27, COMP Latch Detect Voltage Figure 28, COMP Latch Detect Voltage Error Figure 29, COMP Pull-up RES (VCC=12)

Figure 30, COMP Pull-up RES Error (VCC=12) Figure 31, RCOMP (VCC=12) Figure 32, RCOMP Error

60.0

62.0

64.0

66.0

68.0

70.0

8.5 14.0 19.5 25.0

TYPFREQ[kHz]

VCC[V]

0.480

0.485

0.490

0.495

0.500

0.505

0.510

0.515

0.520

0.525

0.530

8.5 14.0 19.5 25.0

CURLIM VOLTAGE(VCC=12)[V]

VCC[V]

3.32

3.42

3.52

3.62

3.72

3.82

3.92

4.02

8.5 14.0 19.5 25.0

RCOMP(VCC=12)[kΩ]

VCC[V]

Figure 33, Typ Frequency Fsw1 (temp=25℃) Figure 34, CURLIM Voltage (temp=25℃) Figure 35, RCOMP (temp=25℃)

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Datasheet

BD7672BG

TSZ02201-0F1F0A200160-1-1

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TSZ22111・15・001

BD7672BG

GND

COMP CS

OUT

VCC

Figure 36, Measurement Circuit Diagram

●Power Dissipation

The thermal design should set the operation for the following conditions.

(Since the temperature shown below is the guaranteed temperature, be sure to take margin into account.)

1. The ambient temperature Ta must be 105℃ or less.

2. The IC’s loss must be within the allowable dissipation Pd.

The thermal reduction characteristics are as follows.

(PCB : 70mm×70mm×1.6mm mounted on glass epoxy single-layer substrate)

Figure 37, SSOP6 Thermal Reduction Characteristics

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Datasheet

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TSZ22111・15・001

●Operational Notes

（2017） Absolute Maximum Ratings

Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all

destructive situations such as short-circuit modes or open circuit modes. Therefore, it is important to consider circuit

protection measures, like adding a fuse, in case the IC is expected to be operated in a special mode exceeding the

absolute maximum ratings.

（2）Power Supply and Ground Lines

Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply

lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting

the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of

temperature and aging on the capacitance value when using electrolytic capacitors.

（3）Ground Voltage

The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that

no pins are at a voltage below the ground pin at any time, even during transient condition.

（4）Short between pins and mounting errors

Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong

orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the

pins.

（5）Operation under strong magnetic fields

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

（6）Regarding input pins of the IC

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that causes these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided. Also, do not apply voltage to an input pin when there is no power supply voltage being applied to the IC.

In fact, even if a power supply voltage is being applied, the voltage applied to each input pin should be either below

the power supply voltage or within the guaranteed values in the electrical characteristics.

（7）External capacitors

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

（8）Thermal Consideration

Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd)

in actual operating conditions.

Also, use these products within ranges that do not put output Tr beyond the rated voltage and ASO.

（9）Rush current

In a CMOS IC, momentary rush current may flow if the internal logic is undefined when the power supply is turned

ON, so caution is needed with regard to the power supply coupling capacitance, the width of power supply and GND

pattern wires, and how they are laid out.

（10）Unused input terminals

Input terminals of an IC especially logic inputs are often connected to the gate of a CMOS transistor. The gate has

extremely high impedance and extremely low capacitance. It can be easily charged by the electric field from the

outside if left unconnected. The small charge acquired in this way is enough to produce a significant effect on the

conduction through the transistor and cause unexpected operation of IC. So unless otherwise specified, input

terminals not being used should be connected to the power supply or ground line.

（11）About this Document

Although the functional description and application notes given in this document are reliable, it does not mean that

the particular application a user designs with this IC is guaranteed to work. It is the user’s responsibility to check well

the design application including other external devices used together with the IC.

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Datasheet

BD7672BG

TSZ02201-0F1F0A200160-1-1

www.rohm.com

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●Ordering Information

B D 7 6 7 2 B G - GTR

Part Number Package

G:SSOP6

Packaging and forming specification

TR: Embossed tape and reel

●Marking Diagram

2 B

Part Number Marking

1PIN MARK LOT Number

SSOP6 (TOP VIEW)

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Datasheet

BD7672BG

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●Physical Dimension, Tape and Reel Information

Package Name SSOP-6

Direction of feed

Reel

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

()

1pin

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TSZ22111・15・001

●Revision History

Date Revision Changes

2013.5.28 001 New preparation

2015.7.16 002

P1 Modify circuit Figure1

P4 Modify Figure4

P6 Modify written error

P6 Modify circuit Figure6

P8 Modify written error

P9 Modify written error

P10 Modify t written error

P13 Modify circuit Figure36

P13 Modify circuit Figure37

P16 Move Physical dimension page

2017.3.22 003

P7 Modify written erro

P8 Modify written error

P9 Note of package power

2017.7.16 004 P1, P9 Change operating temperature

ange from 85 deg to 105 deg.

P13 Figure37 Change thermal reduction characteristics

2017.7.16 005 P13 Change temperature from 85 to 105℃ at 4-colum

Notice-PGA-E Rev.003

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅡb

CLASSⅢ

CLASSⅣ

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or

concerning such information.

Datasheet

Part Number bd7672bg

Package SSOP6

Unit Quantity 3000

Minimum Package Quantity 3000

Packing Type Taping

Constitution Materials List inquiry

RoHS Yes

bd7672bg - Web Page

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