HF0AA2470A7TR\250 - AVX - Product.Network

1
011917
Multilayer Organic (MLO®)
High Pass Filters
The MLO®High Pass Filters are low profile passive devices with best in class performance based
on AVX’s patented multilayer organic high density interconnect technology. The MLO®High pass
filters utilize high dielectric constant and low loss materials to realize high Q passive printed
elements, such as inductors and capacitors, in a multilayer stack. This results in a high
performance High Pass Filter design. MLO®High Pass Filters can support both a variety of
frequency bands and multiple wireless standards, and are less than 1.0mm in thickness. All filters
are expansion matched to most organic PCB materials, thereby resulting in improved reliability
over standard silicon and ceramic devices.
HF
Series
High Pass
Filters
0B
Case Size*
0A = 2616
0B = 3116
0C = 3416
0D = 4016
0F = 5021
A
Type
1550
Frequency
in MHz
A
Reliability
Level
A = Standard
7
Termination
7 = Gold
00
Packaging
Code
00 = Waffle Pack
or Tray
HOW TO ORDER
QUALITY INSPECTION
Finished Parts are 100% electrically tested
TERMINATION
All finishes are compatible with automatic solder-
ing technologies: Pb-free reflow, wave soldering,
vapor phase, and manual soldering.
OPERATING
TEMPERATURE
-55°C to +85°C
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products, 
please select correct termination style.
ELECTRICAL SPECIFICATIONS
AVX PN Insertion Loss Typical -3dB Stopband Rejection Rated RF
(Click on PN for full Passband (dB) Cutoff Frequency Frequency (GHz) Typ. Power
part specifications) (GHz) (GHz) (DC - f) VSWR (W)
Typ. Max -20dB -30dB  -40dB
HF0DA0740A700 0.74 - 1.55 0.82 1.20 0.65 0.57 0.55 0.54 1.22:1 2.0
HF0BA0850A700 0.85 - 1.99 0.75 1.20 0.77 0.69 0.66 0.64 1.22:1 2.0
HF0BA0930A700 0.93 - 1.66 0.84 1.20 0.83 0.73 0.71 0.70 1.11:1 2.0
HF0BA0950A700 0.95 - 2.05 0.85 1.20 0.85 0.75 0.73 0.66 1.38:1 2.0
HF0BA1440A700 1.44 - 2.94 0.63 1.20 1.30 1.14 1.12 1.09 1.06:1 2.0
HF0BA1500A700 1.50 - 2.89 0.73 1.20 1.38 1.23 1.20 1.18 1.10:1 2.0
HF0BA1540A700 1.54 - 3.19 0.81 1.20 1.39 1.25 1.22 1.20 1.05:1 2.0
HF0BA1550A700 1.55 - 3.13 0.82 1.20 1.41 1.27 1.24 1.22 1.04:1 2.0
HF0BA1840A700 1.84 - 2.83 0.85 1.20 1.66 1.50 1.46 1.44 1.16:1 2.0
Case Size Length Width Height
A 2616 0.259±0.010 (6.579±0.254) 0.157±0.010 (3.975±0.254) Varies - see part specification
B 3116 0.306±0.010 (7.785±0.254) 0.156±0.010 (3.975±0.254) Varies - see part specification
C 3416 0.342±0.010 (8.674±0.254) 0.157±0.010 (3.975±0.254) Varies - see part specification
D 4016 0.401±0.010 (10.198±0.254) 0.156±0.010 (3.975±0.254) Varies - see part specification
F 5021 0.512±0.010 (12.992±0.254) 0.207±0.010 (5.245±0.254) Varies - see part specification
MECHANICAL DIMENSIONS inches (mm)
FEATURES
•  Wide Frequency Range
•  Excellent Isolation
•  Low Loss
•  Expansion matched to PCB
•  50Ω Impedance
•  Surface Mountable
•  RoHS Compliant
APPLICATIONS
•  Mobile Communication
•  GPS
•  Vehicle location systems
•  Wireless LANs
•  Satellite Receivers
•  Instrumentation
LAND GRID
ARRAY 
ADVANTAGES
•  Inherent Low Profile
•  Excellent Solderability
•  Low Parasitics
•  Better Heat Dissipation
*Note: Other case sizes and frequencies available upon request.
Click here
to see detailed
mechanical
dimensions and
pad layout.

2011917

Return to Electrical Specifications

Click here to see detailed physical dimensions and pad layout.

Passband

0.74 - 1.55 GHz 1.2 dB Max

0.74 - 1.55 GHz 0.82 dB Typ

-3dB Cutoff 0.65 GHz Typ

VSWR 1.22:1 Typ

Stopband

20 dB DC - 0.57 GHz Min

30 dB DC - 0.55 GHz Min

40 dB DC - 0.54 GHz Min

Dimension

Thickness <0.022 Inches Max

Rated RF Power

Power 2 Watts Max

Multilayer Organic (MLO®)

HF0DA0740A700

DIMENSIONS – CASE SIZE D

Inches (mm)

➝

<0.022

(0.559)

Bottom View

Side View

S21

S11

-20

-40

-60

-80

0 2 4 6 8 10

Typical Frequency Response

Frequency (GHz)

Insertion Loss (dB)

1000

100

0 2 4 6 8 10

Frequency (GHz)

VSWR

Frequency Insertion Loss VSWR Return Loss

(GHz) (dB) (:1) (dB)

0.56 -40.71 15.44 -1.13

0.57 -30.83 13.46 -1.29

0.59 -20.06 10.11 -1.72

0.65 -2.94 1.86 -10.45

0.66 -1.99 1.41 -15.43

0.68 -1.47 1.23 -19.71

0.72 -1.00 1.23 -19.77

0.84 -0.49 1.17 -21.97

1.31 -0.50 1.72 -11.53

1.60 -1.01 2.43 -7.60

1.80 -1.54 3.11 -5.80

TYPICAL PERFORMANCE AT 25ºC

ELECTRICAL SPECIFICATIONS

011917 Return to Electrical Specifications

Passband

0.85 - 1.99 GHz 1.2 dB Max

0.85 - 1.99 GHz 0.75 dB Typ

-3dB Cutoff 0.77 GHz Typ

VSWR 1.22:1 Typ

Stopband

20 dB DC - 0.69 GHz Min

30 dB DC - 0.66 GHz Min

40 dB DC - 0.64 GHz Min

Dimension

Thickness <0.022 Inches Max

Rated RF Power

Power 2 Watts Max

Multilayer Organic (MLO®)

HF0BA0850A700

DIMENSIONS – CASE SIZE B

Inches (mm)

➝

<0.022

(0.559)

Bottom View

Side View

S21

S11

-20

-40

-60

-80

0 2 4 6 8 10

Typical Frequency Response

Frequency (GHz)

Insertion Loss (dB)

1000

100

0 2 4 6 8 10

Frequency (GHz)

VSWR

Frequency Insertion Loss VSWR Return Loss

(GHz) (dB) (:1) (dB)

0.66 -44.02 18.26 -0.95

0.68 -32.23 15.55 -1.12

0.70 -21.32 11.84 -1.47

0.77 -2.77 1.83 -10.67

0.78 -2.00 1.47 -14.42

0.80 -1.41 1.25 -19.13

0.82 -0.98 1.18 -21.64

0.91 -0.48 1.15 -23.37

1.59 -0.51 2.00 -9.56

2.05 -1.02 2.70 -6.75

2.45 -1.50 3.35 -5.35

TYPICAL PERFORMANCE AT 25ºC

ELECTRICAL SPECIFICATIONS

Click here to see detailed physical dimensions and pad layout.

4011917

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Passband

0.93 - 1.66 GHz 1.2 dB Max

0.93 - 1.66 GHz 0.84 dB Typ

-3dB Cutoff 0.83 GHz Typ

VSWR 1.11:1 Typ

Stopband

20 dB DC - 0.73 GHz Min

30 dB DC - 0.71 GHz Min

40 dB DC - 0.70 GHz Min

Dimension

Thickness <0.022 Inches Max

Rated RF Power

Power 2 Watts Max

Multilayer Organic (MLO®)

HF0BA0930A700

-20

-40

-60

-80

0 2 4 6 8 10

Typical Frequency Response

Frequency (GHz)

Insertion Loss (dB)

S21

S11

1000

100

0 2 4 6 8 10

VSWR

Frequency (GHz)

VSWR

Frequency Insertion Loss VSWR Return Loss

(GHz) (dB) (:1) (dB)

0.72 -41.71 16.59 -1.05

0.74 -30.87 13.77 -1.26

0.76 -20.73 10.70 -1.63

0.83 -2.85 1.76 -11.18

0.84 -1.93 1.34 -16.75

0.86 -1.49 1.17 -22.20

0.91 -1.00 1.09 -27.56

1.05 -0.50 1.04 -33.61

1.54 -0.51 1.60 -12.07

2.11 -1.00 2.41 -7.67

2.63 -1.52 3.12 -5.76

TYPICAL PERFORMANCE AT 25ºC

ELECTRICAL SPECIFICATIONS

DIMENSIONS – CASE SIZE B

Inches (mm)

➝

<0.022

(0.559)

Bottom View

Side View

Click here to see detailed physical dimensions and pad layout.

011917 Return to Electrical Specifications

Passband

0.95 - 2.05 GHz 1.2 dB Max

0.95 - 2.05 GHz 0.85 dB Typ

-3dB Cutoff 0.85 GHz Typ

VSWR 1.38:1 Typ

Stopband

20 dB DC - 0.75 GHz Min

30 dB DC - 0.73 GHz Min

40 dB DC - 0.66 GHz Min

Dimension

Thickness <0.022 Inches Max

Rated RF Power

Power 2 Watts Max

Multilayer Organic (MLO®)

HF0BA0950A700

S21

S11

-20

-40

-60

-80

0 2 4 6 8 10

Typical Frequency Response

Frequency (GHz)

Insertion Loss (dB)

1000

100

0 2 4 6 8 10

Frequency (GHz)

VSWR

Frequency Insertion Loss VSWR Return Loss

(GHz) (dB) (:1) (dB)

0.74 -40.95 14.80 -1.18

0.75 -30.30 13.06 -1.33

0.78 -20.40 10.06 -1.73

0.85 -2.88 2.06 -9.21

0.86 -2.50 1.88 -10.28

0.87 -1.95 1.64 -12.33

0.89 -1.47 1.44 -14.87

0.93 -1.00 1.32 -17.32

1.06 -0.50 1.17 -21.95

2.11 -1.00 2.48 -7.42

5.98 -1.57 1.89 -10.23

TYPICAL PERFORMANCE AT 25ºC

ELECTRICAL SPECIFICATIONS

DIMENSIONS – CASE SIZE B

Inches (mm)

➝

<0.022

(0.559)

Bottom View

Side View

Click here to see detailed physical dimensions and pad layout.

6011917

Return to Electrical Specifications

Passband

1.44 - 2.94 GHz 1.2 dB Max

1.44 - 2.94 GHz 0.63 dB Typ

-3dB Cutoff 1.30 GHz Typ

VSWR 1.06:1 Typ

Stopband

20 dB DC - 1.14 GHz Min

30 dB DC - 1.12 GHz Min

40 dB DC - 1.09 GHz Min

Dimension

Thickness <0.022 Inches Max

Rated RF Power

Power 2 Watts Max

Multilayer Organic (MLO®)

HF0BA1440A700

S21

S11

-20

-40

-60

-80

0 2 4 6 8 10

Typical Frequency Response

Frequency (GHz)

Insertion Loss (dB)

1000

100

0 2 4 6 8 10

Frequency (GHz)

VSWR

Frequency Insertion Loss VSWR Return Loss

(GHz) (dB) (:1) (dB)

1.15 -42.44 19.73 -0.88

1.17 -30.50 15.68 -1.11

1.20 -20.36 11.34 -1.54

1.30 -2.90 1.78 -11.01

1.31 -2.24 1.48 -14.20

1.32 -1.80 1.29 -17.99

1.34 -1.39 1.12 -24.83

1.40 -0.99 1.06 -30.83

1.49 -0.49 1.13 -24.50

2.66 -0.50 1.97 -9.72

3.03 -0.81 2.45 -7.54

TYPICAL PERFORMANCE AT 25ºC

ELECTRICAL SPECIFICATIONS

DIMENSIONS – CASE SIZE B

Inches (mm)

➝

<0.022

(0.559)

Bottom View

Side View

Click here to see detailed physical dimensions and pad layout.

011917 Return to Electrical Specifications

Passband

1.50 - 2.89 GHz 1.2 dB Max

1.50 - 2.89 GHz 0.73 dB Typ

-3dB Cutoff 1.38 GHz Typ

VSWR 1.10:1 Typ

Stopband

20 dB DC - 1.23 GHz Min

30 dB DC - 1.20 GHz Min

40 dB DC - 1.18 GHz Min

Dimension

Thickness <0.022 Inches Max

Rated RF Power

Power 2 Watts Max

Multilayer Organic (MLO®)

HF0BA1500A700

S21

S11

-20

-40

-60

-80

0 2 4 6 8 10

Typical Frequency Response

Frequency (GHz)

Insertion Loss (dB)

1000

100

0 2 4 6 8 10

Frequency (GHz)

VSWR

Frequency Insertion Loss VSWR Return Loss

(GHz) (dB) (:1) (dB)

1.22 -40.43 18.30 -0.95

1.24 -31.14 15.19 -1.15

1.27 -21.08 11.42 -1.53

1.38 -2.78 1.76 -11.20

1.39 -2.47 1.61 -12.57

1.40 -2.00 1.39 -15.68

1.42 -1.54 1.18 -21.55

1.46 -0.96 1.01 -48.69

1.59 -0.50 1.13 -24.03

2.58 -0.51 1.88 -10.31

2.98 -1.00 2.57 -7.14

TYPICAL PERFORMANCE AT 25ºC

ELECTRICAL SPECIFICATIONS

DIMENSIONS – CASE SIZE B

Inches (mm)

➝

<0.022

(0.559)

Bottom View

Side View

Click here to see detailed physical dimensions and pad layout.

8011917

Return to Electrical Specifications

Passband

1.54 - 3.19 GHz 1.2 dB Max

1.54 - 3.19 GHz 0.81 dB Typ

-3dB Cutoff 1.39 GHz Typ

VSWR 1.05:1 Typ

Stopband

20 dB DC - 1.25 GHz Min

30 dB DC - 1.22 GHz Min

40 dB DC - 1.20 GHz Min

Dimension

Thickness <0.022 Inches Max

Rated RF Power

Power 2 Watts Max

Multilayer Organic (MLO®)

HF0BA1540A700

S21

S11

-20

-40

-60

-80

0 2 4 6 8 10

Typical Frequency Response

Frequency (GHz)

Insertion Loss (dB)

1000

100

0 2 4 6 8 10

VSWR

Frequency (GHz)

VSWR

Frequency Insertion Loss VSWR Return Loss

(GHz) (dB) (:1) (dB)

1.24 -40.05 17.32 -1.00

1.26 -30.13 14.67 -0.83

1.29 -21.26 11.80 -1.48

1.39 -2.76 1.72 -11.51

1.40 -2.48 1.58 -12.93

1.42 -1.90 1.30 -17.73

1.44 -1.47 1.13 -24.33

1.50 -0.98 1.08 -28.20

1.74 -0.50 1.21 -20.41

2.58 -0.49 1.64 -12.28

3.29 -1.00 2.45 -7.53

TYPICAL PERFORMANCE AT 25ºC

ELECTRICAL SPECIFICATIONS

DIMENSIONS – CASE SIZE B

Inches (mm)

➝

<0.022

(0.559)

Bottom View

Side View

Click here to see detailed physical dimensions and pad layout.

011917 Return to Electrical Specifications

Passband

1.55 - 3.13 GHz 1.2 dB Max

1.55 - 3.13 GHz 0.82 dB Typ

-3dB Cutoff 1.41 GHz Typ

VSWR 1.04:1 Typ

Stopband

20 dB DC - 1.27 GHz Min

30 dB DC - 1.24 GHz Min

40 dB DC - 1.22 GHz Min

Dimension

Thickness <0.022 Inches Max

Rated RF Power

Power 2 Watts Max

Multilayer Organic (MLO®)

HF0BA1550A700

S21

S11

-20

-40

-60

-80

0 2 4 6 8 10

Typical Frequency Response

Frequency (GHz)

Insertion Loss (dB)

1000

100

0 2 4 6 8 10

VSWR

Frequency (GHz)

VSWR

Frequency Insertion Loss VSWR Return Loss

(GHz) (dB) (:1) (dB)

1.25 -41.30 15.75 -1.10

1.27 -31.03 14.03 -1.24

1.31 -20.16 10.15 -1.72

1.41 -2.91 1.76 -11.22

1.42 -2.40 1.51 -13.82

1.43 -1.92 1.29 -17.98

1.45 -1.45 1.07 -28.85

1.51 -0.99 1.06 -30.28

1.72 -0.49 1.16 -22.40

2.71 -0.49 1.67 -11.98

3.36 -1.00 2.45 -7.52

TYPICAL PERFORMANCE AT 25ºC

ELECTRICAL SPECIFICATIONS

DIMENSIONS – CASE SIZE B

Inches (mm)

➝

<0.022

(0.559)

Bottom View

Side View

Click here to see detailed physical dimensions and pad layout.

10 011917

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Passband

1.84 - 2.83 GHz 1.2 dB Max

1.84 - 2.83 GHz 0.85 dB Typ

-3dB Cutoff 1.66 GHz Typ

VSWR 1.16:1 Typ

Stopband

20 dB DC - 1.50 GHz Min

30 dB DC - 1.46 GHz Min

40 dB DC - 1.44 GHz Min

Dimension

Thickness <0.022 Inches Max

Rated RF Power

Power 2 Watts Max

Multilayer Organic (MLO®)

HF0BA1840A700

S21

S11

-20

-40

-60

-80

0 2 4 6 8 10

Typical Frequency Response

Frequency (GHz)

Insertion Loss (dB)

1000

100

0 2 4 6 8 10

Frequency (GHz)

VSWR

Frequency Insertion Loss VSWR Return Loss

(GHz) (dB) (:1) (dB)

1.49 -40.48 18.71 -0.93

1.51 -30.10 14.76 -1.18

1.55 -20.49 11.54 -1.51

1.66 -2.96 1.68 -11.96

1.67 -2.40 1.39 -15.74

1.68 -1.91 1.14 -23.43

1.71 -1.47 1.08 -28.50

1.78 -0.99 1.19 -21.24

2.05 -0.50 1.18 -21.65

2.52 -0.51 1.53 -13.64

2.92 -1.01 2.25 -8.31

TYPICAL PERFORMANCE AT 25ºC

ELECTRICAL SPECIFICATIONS

DIMENSIONS – CASE SIZE B

Inches (mm)

➝

<0.022

(0.559)

Bottom View

Side View

Click here to see detailed physical dimensions and pad layout.

011917

Multilayer Organic (MLO®) Filters

Detailed Mechanical Specifications,

Pad Layout and Mounting

Recommendations

12 011917

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Multilayer Organic (MLO®)

High Pass Filters

MECHANICAL SPECIFICATIONS – CASE SIZE A

RECOMMENDED PCB LAYOUT

Dimensions in inches (mm)

Tolerances are ±0.002 (0.05), unless noted.

All contact areas are gold plated, including I/O pads.

Blue pads denote I/O pads, gray pads denote ground pads

Dimensions in inches (mm).

Line width should be designed to match 50ohm characteristic impedance, depending on PCB material and thickness.

Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Blue pads denote I/O pads, gray pads denote ground pads.

DXF Files available upon request.

011917 Return to Electrical Specifications

Multilayer Organic (MLO®)

High Pass Filters

MECHANICAL SPECIFICATIONS – CASE SIZE B

RECOMMENDED PCB LAYOUT

Dimensions in inches (mm)

Tolerances are ±0.002 (0.05), unless noted.

All contact areas are gold plated, including I/O pads.

Blue pads denote I/O pads, gray pads denote ground pads

Dimensions in inches (mm).

Line width should be designed to match 50ohm characteristic impedance, depending on PCB material and thickness.

Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Blue pads denote I/O pads, gray pads denote ground pads.

DXF Files available upon request.

14 011917

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Multilayer Organic (MLO®)

High Pass Filters

MECHANICAL SPECIFICATIONS – CASE SIZE C

RECOMMENDED PCB LAYOUT

Dimensions in inches (mm)

Tolerances are ±0.002 (0.05), unless noted.

All contact areas are gold plated, including I/O pads.

Blue pads denote I/O pads, gray pads denote ground pads

Dimensions in inches (mm).

Line width should be designed to match 50ohm characteristic impedance, depending on PCB material and thickness.

Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Blue pads denote I/O pads, gray pads denote ground pads.

DXF Files available upon request.

011917 Return to Electrical Specifications

Multilayer Organic (MLO®)

High Pass Filters

MECHANICAL SPECIFICATIONS – CASE SIZE D

RECOMMENDED PCB LAYOUT

Dimensions in inches (mm)

Tolerances are ±0.002 (0.05), unless noted.

All contact areas are gold plated, including I/O pads.

Blue pads denote I/O pads, gray pads denote ground pads

Dimensions in inches (mm).

Line width should be designed to match 50ohm characteristic impedance, depending on PCB material and thickness.

Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Blue pads denote I/O pads, gray pads denote ground pads.

DXF Files available upon request.

16 011917

Return to Electrical Specifications

Multilayer Organic (MLO®)

High Pass Filters

MECHANICAL SPECIFICATIONS – CASE SIZE F

RECOMMENDED PCB LAYOUT

Dimensions in inches (mm)

Tolerances are ±0.002 (0.05), unless noted.

All contact areas are gold plated, including I/O pads.

Blue pads denote I/O pads, gray pads denote ground pads

Dimensions in inches (mm).

Line width should be designed to match 50ohm characteristic impedance, depending on PCB material and thickness.

Grounding is solid copper under solder mask, with solder mask defined pads for ground openings. I/O pads are not shorted to ground.

Blue pads denote I/O pads, gray pads denote ground pads.

DXF Files available upon request.

011917 Return to Electrical Specifications

Multilayer Organic (MLO®)

High Pass Filters

AUTOMATED SMT ASSEMBLY

SMT REFLOW PROFILE

The following section describes the guidelines for automated

SMT assembly of MLO®RF devices which are typically Land

Grid Array (LGA) packages or side termination SMT pacages.

Control of solder and solder paste volume is critical for

surface mount assembly of MLO®RF devices onto the PCB.

Stencil thickness and aperture openings should be adjusted

according to the optimal solder volume. The following are

general recommendations for SMT mounting of MLO®

devices onto the PCB.

Common IR or convection reflow SMT processes shall be

used for the assembly. Standard SMT reflow profiles, for

eutectic and Pb free solders, can be used to surface mount

the MLO®devices onto the PCB. In all cases, a temperature

gradient of 3°C/sec, or less, should be maintained to prevent

warpage of the package and to ensure that all joints reflow

properly. Additional soak time and slower preheating time

may be required to improve the out-gassing of solder paste.

In addition, the reflow profile depends on the PCB density

and the type of solder paste used. Standard no-clean solder

paste is generally recommended. If another type of flux is

used, complete removal of flux residual may be necessary.

Example of a typical lead free reflow profile is shown below.

Profile Parameter Pb free, Convection, IR/Convection

Ramp-up rate (Tsmax to Tp 3ºC/second max.

Preheat temperature (Ts min to Ts max) 150ºC to 200ºC

Preheat time (ts) 60 – 180 seconds

Time above TL, 217ºC (tL) 60 – 120 seconds

Peak temperature (Tp) 260°C

Time within 5ºC of peak temperature (tp) 10 – 20 seconds

Ramp-down rate 4ºC/second max.

Time 25ºC to peak temperature 6 minutes max.

Critical Zone

TL to Tp

Ramp-down

Ramp-up

Ts max

t 25ºC to Peak

Ts min

Preheat

Tp tp

TLtL

Time

Temperature

Figure A. Typical Lead Free Profile and Parameters

MOUNTING RECOMMENDATIONS