IMPROVED CONTACT DESIGN
(PRE BEND)
0,635 0,025
DUAL TWIST
CATEGORY 5,
1 3 5 7
NOTE 3: RoHS COMPLIANT
[in]
2 4 6 8
NUMBERING
PCB HOLE
IDENT. NR.
PART NO.
NOTE 1: SIDE SHIELD PINS IN Front 3.05 mm (F)
NOTE 2: PANEL GROUND FLAN
GES BOTH SIDES AND TOP (GF5)
133172
NUMERIERUNG
REQUIREMENT
BEHANDLUNG
ÜBERTRAGUNGS-
OBERFLÄCHEN-
0,8µm Au [30µin], OVER Ni
ANFORDERUNG
LP BOHRUNGS-
TRANSMISSION CONTACT FINISH
Index Date
C 04.07.2007
21,59 MAX0,850
1 8
0,62515,88
11,43±0,13 0,450 ±0,005
PCB EDGE
LP
RECOMMENDED PANEL CUTOUT
EMPFOHLENER FRONTPLATTEN-AUSSCHNITT
14,72 0,580
0,656
16,66
0,38 ±0,10 0,015±0,004
0.05 [0.002] UNLESS NOTED
RECOMMENDED PCB LAYOUT (COMPONENT SIDE VIEW)
EMPFOHLENES LEITERPLATTEN-LAYOUT (BESTUECKUNGSSEITE)
TOL.
8
1
0,1203,05
2,54 0,100
8,89 0,350
X8
0,035
±0,003
1
,60±0,07X2
0,89
±0,07
0,450
11,43
0,063±0,003
0,610
15,49
0,050
1,27
0,1002,54
3,25
±0,07
X2
0,1
28
±0,003
1:1
13,63 0,537
3,20 ±0,20 0,126±0,008
10,89 0,429
prior notice.
contact one of the ERNI companies
MJ
8P8C, 1X1
MOD JACK - MJR
133943
2:1
Information: Tolerances Scale
All Dimensions
in mm
Class
I (1/1)
Subject to modification without
A3
Designation
www.ERNI.com
before using.
Drawing will not be updated.
All rights reserved.
Only for Information.
To insure that this is the latest
version of this drawing, please
Copyright by ERNI GmbH
Proprietary notice pursuant to ISO 16016 to be observed.
Technical spe cificatio ns
Materi als & Fini sh Stand ard appli c. Val ue T e st Data Stand ard applic . Value
Insulation body Standard description PBT 30% Me chani cal p rop e rt i es .
N 0
2.
xa
m
7-306 CEIe
cr
of lawa
r
dh
t
iw
/
noit
r
esnI)
S
IJ
.
c
ca
(
0
1
2
5
Cno
i
tpircsed
dr
a
dnat
S
lairetam t
c
atnoC
Contact finish, mating zone Thickness of plating 30 µin Au over 50 µin Ni Mechanical operations IEC 512-5, 9a min. 1.000
Contact finish termination zone Thickness of plating 80 µin matte Sn over 50 µin Ni Effectiveness of connector
N 05f5
1 ,8-
21
5 C
E
Ie
civ
e
d
g
nilpu
o
c)
SIJ
.
cc
a
(
0
862Cn
o
itpi
rc
se
d
dr
ad
n
atS
lai
ret
a
m
dle
ihs/
ll
eh
S
Shell/shield plating Thickness of plating 50 µin Ni El e ctri cal pro pe rties
Cr e epage / c l e arance distan ce s
Asse mbly p ro ce ss a) Contact - contact IEC 807-3 0,52 mm
m
m
0,
1
.
n
i
m3
-
708
C
EI
l
l
eh
s
-
t
ca
tn
oC
)
b
y
ar
Tg
ni
g
akc
aP
s5
-3 ta
C°
532
e
r
u
t
arepm
et
re
dl
oS Voltage proo f (Di e le ctr ic Wi th stand Vo ltag e)
CD/CA V
0
00.
1.
ni
m
a
4
,2-
2
15 CEI tc
at
noc -
t
ca
t
noC )ae
v
a
w
ss
e
corp
y
lb
m
essa el
b
ati
uS
b) Contact - shell/testpanel IEC 512-2, 4a min. 1.500 V AC/DC
Ap prov als Current carrying capacity IEC 512-3, 5b 1,5 A @ 25° C
m
hO
m
0
3.
x
a
ma
2
,2-2
1
5
CEIecnatsiser
tca
t
no
C
0
V
4
9
LUy
do
b
no
ital
u
sn
i
L
U
mh
OM
0
05
.nima3
,2
-
2
1
5
CEI
ecnatsise
r no
i
t
alusnI
3
16
54
1
E
.
oN
eli
F
L
U
seYt
na
il
pmo
c
S
Ho
R Env iro n me ntal p ropert i e s
C
°
0
7
-
0er
ut
a
r
e
p
met
no
ita
r
epO
