Datashee
t
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
.
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TSZ22111 • 14 • 001
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2015.08.28 Rev.001
2.7V to 5.5V Input, 2.0A Integrated MOSFET
Single Synchronous Buck DC/DC Converter
BD9B200MUV
General Description
BD9B200MUV is a synchronous buck switching
regulator with built-in low on-resistance power MOSFETs.
This IC, which is capable of providing current up to 2A,
features fast transient response by employing constant
on-time control system. It offers high oscillating
frequency at low inductance. With its original constant
on-time control method which operates low consumption
at light load, this product is ideal for equipment and
devices that demand minimal standby power
consumption.
Features
Synchronous Single DC/DC Converter
Constant on-time control suitable to Deep-SLLM
Over Current Protection
Short Circuit Protection
Thermal Shutdown Protection
Under Voltage Lockout Protection
Adjustable Soft Start
Power Good Output
VQFN016V3030 Package
(Backside Heat Dissipation)
Applications
Key Specifications
Input Voltage Range: 2.7V to 5.5V
Output Voltage Range: 0.8 V to VPVIN x 0.8 V
Maximum Operating Current: 2A (Max)
Switching Frequency: 2MHz/1MHz (Typ)
High-Side MOSFET ON Resistance: 50m (Typ)
Low-Side MOSFET ON Resistance: 50m (Typ)
Standby Current: 0A (Typ)
Package W (Typ) x D (Typ) x H (Max)
VQFN016V3030 3.00 mm x 3.00 mm x 1.00 mm
Step-down Power Supply for DSPs, FPGAs,
Microprocessors, etc.
Laptop PCs/Tablet PCs/Servers
LCD TVs
Storage Devices (HDDs/SSDs)
Printers, OA Equipment
Entertainment Devices
Distributed Power Supply, Secondary Power Supply
Typical Application Circuit
Figure 1. Application Circuit
VQFN016V3030
Datasheet
Datasheet
2/30
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TSZ22111 • 15 • 001
BD9B200MUV
TSZ02201-0J3J0AJ00790-1-2
2015.08.28 Rev.001
Pin Configuration
Pin Descriptions
Pin No. Pin Name Function
1, 2 PVIN
Power supply terminals for the switching regulator.
These terminals supply power to the output stage of the switching regulator.
Connecting a 10µF ceramic capacitor is recommended.
3, 4 PGND Ground terminals for the output stage of the switching regulator.
5 AGND Ground terminal for the control circuit.
6 FB
An inverting input node for the error amplifier and main comparator.
See page 22 for how to calculate the resistance of the output voltage setting.
7 FREQ
Terminal for setting switching frequency. Connecting this terminal to ground makes
switching to operate constant on-time corresponding to 2.0MHz. Connecting this
terminal to AVIN makes switching to operate constant on-time corresponding to
1.0MHz. Please fix this terminal to AVIN or ground in operation.
8 MODE
Terminal for setting switching control mode. Connecting this terminal to AVIN forces
the device to operate in the fixed frequency PWM mode. Connecting this terminal to
ground enables the Deep-SLLM control and the mode is automatically switched
between the Deep-SLLM control and fixed frequency PWM mode. Please fix this
terminal to AVIN or ground in operation.
9 SS
Terminal for setting the soft start time. The rise time of the output voltage can be
specified by connecting a capacitor to this terminal. See page 23 for how to calculate
the capacitance.
10, 11, 12 SW
Switch nodes. These terminals are connected to the source of the High-Side
MOSFET and drain of the Low-Side MOSFET. Connect a bootstrap capacitor of 0.1
µF between these terminals and BOOT terminal. In addition, connect an inductor of
0.47µH to 1µH (FREQ=L), 1H to 1.5H (FREQ=H) considering the direct current
superimposition characteristic.
13 BOOT
Terminal for bootstrap. Connect a bootstrap capacitor of 0.1 µF between this terminal
and SW terminals. The voltage of this terminal is the gate drive voltage of the
High-Side MOSFET.
14 PGD
A “Power Good” terminal, an open drain output. Use of pull up resistor is needed. See
page 17 for how to specify the resistance. When the FB terminal voltage reaches
more than 80% of 0.8 V, the internal Nch MOSFET turns off and the output turns High.
15 EN
Enable terminal. Turning this terminal signal Low (0.8V or lower) forces the device to
enter the shutdown mode. Turning this terminal signal High (2.0V or higher) enables
the device. This terminal must be terminated.
16 AVIN
Terminal for supplying power to the control circuit of the switching regulator.
Connecting a 0.1µF ceramic capacitor is recommended.
This terminal must be connected to PVIN.
- E-Pad
A backside heat dissipation exposed pad. Connecting to the internal PCB ground
plane by using multiple vias provides excellent heat dissipation characteristics.
Figure 2. Pin Assignment
(TOP VIEW)
PGND 4
1
2
3
PVIN
PGND
SS
9
12
11
10 SW
1316 15 14
5678
AGND
FREQ
MODE
SW
SW
BOOT
PGD
EN
AVIN
PVIN
FB
E-Pad
Datasheet
Datasheet
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TSZ22111 • 15 • 001
BD9B200MUV
TSZ02201-0J3J0AJ00790-1-2
2015.08.28 Rev.001
Block Diagram
Figure 3. Block Diagram
Datasheet
Datasheet
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TSZ22111 • 15 • 001
BD9B200MUV
TSZ02201-0J3J0AJ00790-1-2
2015.08.28 Rev.001
Description of Blocks
● VREF
The VREF block generates the internal reference voltage.
● UVLO
The UVLO block is for Under Voltage lockout protection. It will shut down the IC when VIN falls to 2.45 V (Typ) or
lower. The threshold voltage has a hysteresis of 100mV (Typ).
● TSD
The TSD block is for thermal protection. The thermal protection circuit shuts down the device when the internal
temperature of IC rises to 175°C (Typ) or higher. Thermal protection circuit resets when the temperature falls. The
circuit has a hysteresis of 25°C (Typ).
● Soft Start
The Soft Start circuit slows down the rise of output voltage during start-up and controls the current, which allows the
prevention of output voltage overshoot and inrush current. A built-in soft start function is provided and a soft start is
initiated in 1msec (Typ) when the SS terminal is open.
● Control Logic + DRV
This block is a DC/DC driver. A signal from On Time is applied to drive the MOSFETs.
● PGOOD
When the FB terminal voltage reaches more than 80% of 0.8 V, the Nch MOSFET of the built-in open drain output
turns off and the output turns High.
● OCP/SCP
After soft start is completed and in condition where output voltage is below 70% (Typ) of voltage setting, it counts the
number of times of which current flowing in High side FET reaches over current limit. When 512 times is counted it
stops operation for 1m sec (Typ) and re-operates. Counting is reset when output voltage is above 80% (Typ) of
voltage setting or when EN, UVLO, SCP function is re-operated.
● Error Amplifier
Adjusts Main Comparator input to make internal reference voltage equal to FB terminal voltage.
● Main Comparator
Main comparator compares Error Amplifier output and FB terminal voltage. When FB terminal voltage becomes low it
outputs High and reports to the On Time block that the output voltage has dropped below control voltage.
● On Time
This is a block which creates On Time. Requested On Time is created when Main Comparator output becomes High.
On Time is adjusted to restrict frequency change even with input and output voltage change.
Datasheet
Datasheet
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TSZ22111 • 15 • 001
BD9B200MUV
TSZ02201-0J3J0AJ00790-1-2
2015.08.28 Rev.001
Absolute Maximum Ratings (Ta = 25°C)
Parameter Symbol Rating Unit
Supply Voltage VPVIN, VAVIN -0.3 to +7 V
EN Terminal Voltage VEN -0.3 to +7 V
MODE Terminal Voltage VMODE -0.3 to +7 V
FREQ Terminal Voltage VFREQ -0.3 to +7 V
PGD Terminal Voltage VPGD -0.3 to +7 V
Voltage from GND to BOOT VBOOT -0.3 to +14 V
Voltage from SW to BOOT ⊿VBOOT -0.3 to +7 V
FB Terminal Voltage VFB -0.3 to +7 V
SW Terminal Voltage VSW -0.3 to VPVIN + 0.3 V
Output Current IOUT 2.5 A
Allowable Power Dissipation(Note 1) Pd 2.66 W
Operating Temperature Range Topr -40 to 85 C
Storage Temperature Range Tstg -55 to 150 C
(Note 1) VQFN016V3030: Derate by 21.3mW when operating above 25C
PCB size: 70mm x 70mm x 1.6mm when mounted on a 4-layer glass epoxy board (copper foil area: 70mm x 70mm)
Copper foil thickness: Front side and reverse side 70µm be used, 2nd and 3rd 35µm be used.
Caution1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta= -40°C to +85°C)
Parameter Symbol Min Typ Max Unit
Supply Voltage VPVIN, VAVIN 2.7 - 5.5 V
Output Current (Note 2) IOUT - - 2 A
Output Voltage Range VRANGE 0.8 - VPVIN × 0.8 V
(Note 2) Pd, ASO should not be exceeded.
Datasheet
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TSZ22111 • 15 • 001
BD9B200MUV
TSZ02201-0J3J0AJ00790-1-2
2015.08.28 Rev.001
Electrical Characteristics (Unless otherwise specified Ta=25°C, VAVIN = VPVIN = 5V, VEN = 5V, VMODE = GND)
Parameter Symbol Min Typ Max Unit Conditions
AVIN pin
Standby Supply Current ISTB - 0 10 µA EN=GND
Operating Supply Current ICC - 40 60 µA
FREQ=AVIN, IOUT=0mA
Non switching
UVLO Detection Threshold VUVLO1 2.35 2.45 2.55 V VIN falling
UVLO Release Threshold VUVLO2 2.425 2.55 2.7 V VIN rising
UVLO Hysteresis VUVLOHYS 50 100 200 mV
Enable
EN Input High Level Voltage VENH 2.0 - -
V
EN Input Low Level Voltage VENL - - 0.8 V
EN Input Current IEN - 5 10 µA EN=5V
Reference Voltage, Error Amplifier
FB Terminal Voltage VFB1 0.792 0.8 0.808 V
FB Input Bias Current IFB - - 1 µA FB=0.8V
Internal Soft Start Time TSS 0.5 1.0 2.0 ms With internal constant
Soft Start Terminal Current ISS 0.5 1.0 2.0 µA
Control
FREQ Input High Level Voltage VFRQH VAVIN-0.3 - - V
FREQ Input Low Level Voltage VFRQL - - 0.3 V
MODE Input High Level Voltage VMODEH VAVIN-0.3 - - V
MODE Input Low Level Voltage VMODEL - - 0.3 V
On time1 ONT1 96 120 144 ns VOUT=1.2V, FREQ=GND
On time2 ONT2 192 240 288 ns VOUT=1.2V, FREQ=AVIN
Power Good
Power Good Rising Threshold VPGDH 75 80 85 % FB rising, VPGDH=FB/VFBx100
Power Good Falling Threshold VPGDL 65 70 75 % FB falling, VPGDL=FB/VFBx100
Output Leakage Current ILKPGD - 0 5 µA PGD=5V
Power Good On Resistance RPGD - 100 200
Power Good Low Level Voltage PGDVL - 0.1 0.2 V IPGD=1mA
SW
High Side FET On Resistance RONH - 50 100 m BOOT-SW=5V
Low Side FET On Resistance RONL - 50 100 m
High Side Output Leakage Current RILH - 0 10 µA No switching
Low Side Output Leakage Current RILL - 0 10 µA No switching
Datasheet
Datasheet
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TSZ22111 • 15 • 001
BD9B200MUV
TSZ02201-0J3J0AJ00790-1-2
2015.08.28 Rev.001
Typical Performance Curves
0
10
20
30
40
50
60
70
80
90
100
1 10 100 1000 10000
Load Current [mA]
Efficiency[%]
0
10
20
30
40
50
60
70
80
90
100
1 10 100 1000 10000
Load Current [mA]
Efficiency [%]
0
5
10
15
20
25
30
35
40
45
-40-200 20406080
Temperature [°C]
I
CC
[uA]
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-40 -20 0 20 40 60 80
Temperature [°C]
ISTBY [uA]
Figure 4. Operating Supply Current vs Temperature Figure 5. Stand-by Supply Current vs Temperature
Figure 6. Efficiency vs Load Current
(VIN=5V, VOUT=1.2V, L=1.0µH, FREQ=L)
Figure 7. Efficiency vs Load Current
(VIN=5V, VOUT=1.2V, L=1.5µH, FREQ=H)
VIN=5V
VIN=3.3V
VIN=5V
VIN=3.3V
MODE=L
MODE=H
MODE=L
MODE=H
VOUT=1.2V
FREQ=L
VOUT=1.2V
FREQ=H
Datasheet
Datasheet
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TSZ22111 • 15 • 001
BD9B200MUV
TSZ02201-0J3J0AJ00790-1-2
2015.08.28 Rev.001
Typical Performance Curves - continued
0.792
0.794
0.796
0.798
0.800
0.802
0.804
0.806
0.808
-40-20 0 20406080
Temperature [°C]
V
FB
[V]
2.36
2.40
2.44
2.48
2.52
2.56
2.60
-40 -20 0 20 40 60 80
Temperature [°C]
V
UVLO
[V]
0
10
20
30
40
50
60
70
80
90
100
1 10 100 1000 10000
Load Current [mA]
Efficiency [%]
0
10
20
30
40
50
60
70
80
90
100
1 10 100 1000 10000
Load Current [mA]
Efficiency [%]
Figure 8. Efficiency vs Load Current
(VIN=5V, VOUT=3.3V, L=1.0µH, FREQ=L)
Figure 9. Efficiency vs Load Current
(VIN=5V, VOUT=3.3V, L=1.5µH, FREQ=H)
Figure 10. FB Voltage vs Temperature Figure 11. UVLO Threshold vs Temperature
MODE=L
MODE=H
MODE=L
MODE=H
VOUT=3.3V
FREQ=L
VOUT=3.3V
FREQ=H
VIN=5V
VIN=3.3V
Release
Detect
Datasheet
Datasheet
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TSZ22111 • 15 • 001
BD9B200MUV
TSZ02201-0J3J0AJ00790-1-2
2015.08.28 Rev.001
Typical Performance Curves - continued
Figure 14. FREQ Threshold vs Temperature Figure 15. FREQ Input Current vs Temperature
Figure 12. EN Threshold vs Temperature Figure 13. EN Input Current vs Temperature
1.0
1.2
1.4
1.6
1.8
2.0
-40 -20 0 20 40 60 80
Temperature [°C]
V
EN
[V]
UP
DOWN
2.0
3.0
4.0
5.0
6.0
7.0
-40 -20 0 20 40 60 80
Temperature [°C]
I
EN
[A]
VIN=3.3V
VIN=5V
VIN=3.3V
VIN=5.0V
VIN =5.0V
0.5
1.0
1.5
2.0
2.5
3.0
3.5
-40 -20 0 20 40 60 80
Temperature [°C]
V
FREQ
[V]
VIN=5V
VIN=3.3V
0.0
0.5
1.0
1.5
2.0
2.5
-40 -20 0 20 40 60 80
Temperature [°C]
I
FREQ
[A]
VIN=5V
Datasheet
Datasheet
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TSZ22111 • 15 • 001
BD9B200MUV
TSZ02201-0J3J0AJ00790-1-2
2015.08.28 Rev.001
Typical Performance Curves - continued
Figure 18. High Side ON-Resistance vs Temperature Figure 19. Low Side ON-Resistance vs Temperature
Figure 16. MODE Threshold Voltage vs Temperature Figure 17. MODE Input Current vs Temperature
0.5
1.0
1.5
2.0
2.5
3.0
3.5
-40 -20 0 20 40 60 80
Temperature [°C]
V
MODE
[V]
VIN=5V
VIN=3.3V
3.0
3.5
4.0
4.5
5.0
5.5
6.0
-40 -20 0 20 40 60 80
Temperature [°C]
I
MODE
[A]
VIN=5V
20
25
30
35
40
45
50
55
60
-40-200 20406080
Temperature [°C]
R
ONH
[m
Ω
]
V
IN
=
5V
VIN=3.3V
20
25
30
35
40
45
50
55
60
-40-200 20406080
Temperature [°C]
R
ONL
[m
Ω
]
VIN=5V
VIN=3.3V
Datasheet
Datasheet
11/30
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TSZ22111 • 15 • 001
BD9B200MUV
TSZ02201-0J3J0AJ00790-1-2
2015.08.28 Rev.001
Typical Performance Curves - continued
Figure 22. Soft Start Time vs Temperature Figure 23. SS Terminal Current vs Temperature
Figure 20. PGD Threshold vs Temperature Figure 21. PGD ON ON-Resistance vs Temperature
60
70
80
90
100
110
120
-40-20 0 20406080
Temperature [°C]
R
PGD
[]
60
65
70
75
80
85
-40-200 20406080
Temperature [°C]
V
PGD
[%]
RISING
FALLING VIN=5V
VIN=3.3V
0.0
0.4
0.8
1.2
1.6
2.0
-40 -20 0 20 40 60 80
Temperature [°C]
I
SS
[A]
VIN=5V
VIN=3.3V
0.0
0.5
1.0
1.5
2.0
-40 -20 0 20 40 60 80
Temperature [°C]
T
SS
[msec]
VIN=5V
VIN=3.3V
Datasheet
Datasheet
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TSZ22111 • 15 • 001
BD9B200MUV
TSZ02201-0J3J0AJ00790-1-2
2015.08.28 Rev.001
Typical Performance Curves - continued
800
850
900
950
1000
1050
1100
1150
1200
3.0 3.5 4.0 4.5 5.0 5.5
VIN In p u t Vo l ta g e [V]
f[kHz]
1600
1700
1800
1900
2000
2100
2200
2300
2400
3.0 3.5 4.0 4.5 5.0 5.5
VIN Input Voltage [V]
f
SW
[kHz]
0
200
400
600
800
1000
1200
0 250 500 750 1000 1250 1500 1750 2000
Load Current [m A]
f
SW
[kHz]
0
400
800
1200
1600
2000
2400
0 250 500 750 1000 1250 1500 1750 2000
Load Current [mA]
f
SW
[kHz]
Figure 26. Switching Frequency vs Input Voltage
Figure 27. Switching Frequency vs Input Voltage
Figure 24. Switching Frequency vs Load Current
Figure 25. Switching Frequency vs Load Current
MODE=L
MODE=H
FREQ=H
VIN=5V MODE=L
MODE=H
FREQ=L
VIN=5V
VOUT=1.2V
MODE=H
FREQ=L
IOUT=2A
VOUT=1.2V
MODE=H
FREQ=H
IOUT=2A
fSW[kHz]
Datasheet
Datasheet
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TSZ22111 • 15 • 001
BD9B200MUV
TSZ02201-0J3J0AJ00790-1-2
2015.08.28 Rev.001
Typical Performance Curves - continued
Figure 30. Power Up Waveform with VIN
(FREQ=H, RLOAD=0.6)
Figure 31. Power Down Waveform with VIN
(FREQ=H, RLOAD=0.6)
Figure 28. Power Up Waveform with EN
(FREQ=H, RLOAD=0.6)
Figure 29. Power Down Waveform with EN
(FREQ=H, RLOAD=0.6)
Time=1ms/div Time=1ms/div
VIN=5V/div
EN=5V/div
VOUT=1V/div
SW=5V/div
VIN=5V/div
EN=5V/div
VOUT=1V/div
SW=5V/div
Time=1ms/div Time=1ms/div
VIN=5V/div
EN=5V/div
VOUT=1V/div
SW=5V/div
VIN=5V/div
EN=5V/div
VOUT=1V/div
SW=5V/div
Datasheet
Datasheet
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TSZ22111 • 15 • 001
BD9B200MUV
TSZ02201-0J3J0AJ00790-1-2
2015.08.28 Rev.001
Typical Performance Curves - continued
Figure 34. Switching Waveform
(VIN=5V, VOUT=1.2V, FREQ=H, IOUT=0.2A) Figure 35. Switching Waveform
(VIN=5V, VOUT=1.2V, FREQ=H, IOUT=2A)
Figure 32. Switching Waveform
(VIN=5V, VOUT=1.2V, FREQ=L, IOUT=0.1A)
Figure 33. Switching Waveform
(VIN=5V, VOUT=1.2V, FREQ=L, IOUT=2A)
Time=1µs/div
VOUT=20mV/div
SW=2V/div
Time=1
µ
s/div
VOUT=20mV/div
SW=2V/div
Time=1µs/div
VOUT=20mV/div
SW=2V/div
Time=1µs/div
VOUT=20mV/div
SW=2V/div
Datasheet
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TSZ22111 • 15 • 001
BD9B200MUV
TSZ02201-0J3J0AJ00790-1-2
2015.08.28 Rev.001
Typical Performance Curves - continued
Figure 36. Line Regulation
(VOUT=1.2V, L=1.5H, FREQ=H, IOUT=2A)
Figure 37. Load Regulation
(VIN=5V, VOUT=1.2V, L=1.5H, FREQ=H)
Figure 38. Load Transient Response IOUT=0.1A to 2A
(VIN=5V, VOUT=1.2V, FREQ=L, MODE=L, COUT=Ceramic 44µF)
Figure 39. Load Transient Response IOUT=0A to 2A
(VIN=5V, VOUT=1.2V, FREQ=L, MODE=H, COUT=Ceramic 44µF)
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
VIN Input Voltage[V]
Output Voltage Deviation[%]
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
0.0 0.3 0.5 0.8 1.0 1.3 1.5 1.8 2.0
Load Current [A]
Output Voltage Deviation[%]
MODE=H
MODE=L
MODE=L
MODE=H
Time=0.5m
/
div
VOUT=50mV/div
IOUT=1A/div Time=0.5m
/
div
VOUT=50mV/div
IOUT=1A
/
div
Datasheet
Datasheet
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TSZ22111 • 15 • 001
BD9B200MUV
TSZ02201-0J3J0AJ00790-1-2
2015.08.28 Rev.001
Application Example(s)
1. Basic Operation
(1) DC/DC Converter operation
BD9B200MUV is a synchronous rectifying step-down switching regulator that achieves faster transient response by
employing constant on-time control system. It utilizes switching operation in PWM (Pulse Width Modulation) mode
for heavier load, while it utilizes Deep-SLLM (Deep-Simple Light Load Mode) control for lighter load to improve
efficiency.
Figure 40. Efficiency (Deep-SLLM Control and PWM Control)
① Deep-SLLM Control
②PWM Control
VOUT
20mV/div
SW
2.0V/div
VOUT
20mV/div
SW
2.0V/div
② PWM Control
Efficiency [%]
Output Current IOUT [A]
① Deep-SLLM Control
Figure 41. Switching Waveform at Deep-SLLM Control
(VIN=5.0V, VOUT=1.2V, IOUT=100mA)
Figure 42. Switching Waveform at PWM Control
(VIN=5.0V, VOUT=1.2V, IOUT=2A)
Datasheet
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TSZ22111 • 15 • 001
BD9B200MUV
TSZ02201-0J3J0AJ00790-1-2
2015.08.28 Rev.001
(2) Enable Control
The IC shutdown can be controlled by the voltage applied to the EN terminal. When VEN reaches 2.0 V(Min), the
internal circuit is activated and the IC starts up. To enable shutdown control with the EN terminal, the shutdown
interval (Low level interval of EN) must be set to 100 µs or longer. Startup by EN must be at the same time or after
the input of power supply voltage.
Figure 43. Start Up and Down with Enable
(3) Power Good
When the output voltage reaches more than 80% of the voltage setting, the open drain NMOSFET, internally
connected to the PGD terminal, turns off and the PGD terminal turns to Hi-z condition. Also when the output voltage
falls below 70% of voltage setting, the open drain NMOS FET turns on and PGD terminal pulls down with 100.
Connecting a pull up resistor (10K to 100K) is recommended.
Figure 44. Power Good Timing Chart
(4) Soft Start
When EN terminal is turned High, Soft Start operates and output voltage gradually rises. With the Soft Start Function,
over shoot of output voltage and rush current can be prevented. Rising time of output voltage when SS terminal is
open is 1msec (Typ). Capacitor connected to SS terminal makes rising time more than 1msec. Please refer to page
23 for the method of setting rising time.
Figure 45. Soft Start Timing Chart
VEN
0
VOUT
0Soft start 1 msec
(typ.)
VENH
VENL
EN terminal
Output setting voltage
t
t
Datasheet
Datasheet
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2. Protection
The protective circuits are intended for p revention of d amage caused b y unexpe cted acciden ts. Do not use them
for continuous protective operation
(1) Over Current Protection (OCP) / Short Circuit Protection (SCP)
Setting of Over current protection is 4.5A (Typ). When OCP is triggered, over current protection is realized by
restricting On / Off Duty of current flowing in upper MOSFET by each switching cycle. Also, if Over current protection
operates 512 cycles in a condition where FB terminal voltage reaches below 70% of internal standard voltage, Short
Circuit protection (SCP) operates and stops switching for 1msec (Typ) before it initiates restart. However, during
startup, Short circuit protection will not operate even if the IC is still in the SCP condition.
Table 1. Over Current Protection / Short Circuit Protection Function
EN terminal PGD Startup Over current
protection
Short circuit
protection
More than 2.0V L While start up Valid Invalid
Startup completed Valid Valid
H ＊ Valid Invalid
Less than 0.8V ＊ ＊ Invalid Invalid
Figure 46. Short Circuit Protection (SCP) Timing Chart
VOUT
FB
High side
MOSFET gate
1ms(typ.)
Low side
MOSFET gate
Coil current
Inside IC
OCP signal
PGD
OCP threshold
512 Cycle
Datasheet
Datasheet
19/30
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(2) Under Voltage Lockout Protection (UVLO)
The Under Voltage Lockout Protection circuit monitors the AVIN terminal voltage.
The operation enters standby when the AVIN terminal voltage is 2.45V (Typ) or lower.
The operation starts when the AVIN terminal voltage is 2.55V (Typ) or higher.
Figure 47. UVLO Timing Chart
(3) Thermal Shutdown
When the chip temperature exceeds Tj=175C (Typ), the DC/DC converter output is stopped. The circuits are
automatically restored to normal operation when the chip temperature falls. It has a hysteresis of 25C (Typ). The
thermal shutdown circuit is intended for shutting down the IC from thermal runaway in an abnormal state with the
temperature exceeding Tjmax=150C. It is not meant to protect or guarantee the soundness of the application. Do
not use the function of this circuit for application protection design.
VIN
0V
VOUT
High side
MOSFET gate
FB
terminal
Soft start
hys
UVLO OFF
UVLO ON
Normal operation Normal operationUVLO
Low side
MOSFET gate
Datasheet
Datasheet
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Application Example
Figure 48. Application Circuit
Table 2. Recommended Component Values (VIN=5V, FREQ=H)
Reference
Designator
VOUT Description
1.0V 1.2V 1.5V 1.8V 3.3V
R5 100k 100k 100k 100k 100k -
R7 75k 75k 160k 150k 160k -
R8 300k 150k 180k 120k 51k -
C2(Note 3) 10F 10F 10F 10F 10F 10V, X5R, 3216
C4 0.1F 0.1F 0.1F 0.1F 0.1F 25V, X5R, 1608
C8(Note 4) 0.1F 0.1F 0.1F 0.1F 0.1F -
C9 22F 22F 22F 22F 22F 6.3V, X5R, 3225
C10 22F 22F 22F 22F 22F 6.3V, X5R, 3225
C14 120p 120pF 150pF 180pF 180pF -
L1 1.5H 1.5H 1.5H 1.5H 1.5H TOKO, FDSD0420
Table 3. Recommended Component Values (VIN=5V, FREQ=L)
Reference
Designator
VOUT Description
1.0V 1.2V 1.5V 1.8V 3.3V
R5 100k 100k 100k 100k 100k -
R7 75k 75k 160k 150k 160k -
R8 300k 150k 180k 120k 51k -
C2(Note 3) 10F 10F 10F 10F 10F 10V, X5R, 3216
C4 0.1F 0.1F 0.1F 0.1F 0.1F 25V, X5R, 1608
C8(Note 4) 0.1F 0.1F 0.1F 0.1F 0.1F -
C9 22F 22F 22F 22F 22F 6.3V, X5R, 3225
C10 22F 22F 22F 22F 22F 6.3V, X5R, 3225
C14 100p 120pF 100pF 120pF 120pF -
L1 1.0H 1.0H 1.0H 1.0H 1.0H TOKO, FDSD0420
(Note 3) For capacitance of input capacitor take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value to no
less than 4.7F.
(Note 4) For capacitance of bootstrap capacitor take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value
to no less than 0.047F.
※Evaluation using the actual machine must be done for above constant is only a value on our evaluation board.
Datasheet
Datasheet
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Selection of Components Externally Connected
1. Output LC Filter Constant
In order to supply a continuous current to the load, the DC/DC converter requires an LC filter for smoothing the
output voltage. It is recommended to use inductors of values 0.47µH to 1.0µH when FREQ=L or 1.0µH to 1.5µH at
FREQ=H.
Figure 49. Waveform of current through inductor Figure 50. Output LC filter circuit
Inductor ripple current IL
Where:
VIN= 5V
VOUT= 1.2V
L=1.5µH
FSW =1MHz (switching frequency)
The saturation current of the inductor must be larger than the sum of the maximum output current and 1/2 of the inductor
ripple current IL.
The output capacitor COUT affects the output ripple voltage characteristics. The output capacitor COUT must satisfy the
required ripple voltage characteristics.
The output ripple voltage can be represented by the following equation.
where RESR is the Equivalent Series Resistance (ESR) of the output capacitor.
* The capacitor rating must allow a sufficient margin with respect to the output voltage.
The output ripple voltage can be decreased with a smaller ESR.
A ceramic capacitor of about 22 µF to 47 µF is recommended.
*Be careful of total capacitance value, when additional capacitor CLOAD is connected in addition to output capacitor COUT.
Use maximum additional capacitor CLOAD (Max) condition which satisfies the following condition.
Maximum starting inductor ripple current ILSTART can be expressed using the following equation.
IL
t
Inductor saturation current > IOUTMAX +⊿IL /2
IOUTMAX
Average inductor current
⊿IL
mA
60
8
L
F
V
1
V
V
V
Δ
S
W
IN
OU
T
INOU
T
-
L
I
2.9AMin
limi
t
Curren
t
Ove
r
I
L
curren
t
rippl
e
inducto
r
startin
g
Maximu
m
STAR
T
2
Δ
I
I
capacitor
outpu
t
t
o
curren
t
Charg
e
current
I
outpu
t
startin
g
Maximu
m
I
L
L
CA
P
OMA
X
STAR
T
V
F
C
8
1
R
Δ
I
ΔV
S
W
OU
T
ES
R
L
RP
L
Datasheet
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Charge current to output capacitor ICAP can be expressed using the following equation.
For example, given VIN= 5V, VOUT= 3.3V, L= 1.5µH, switching frequency FSW= 800kHz(Min), Output capacitor COUT=
44µF, Soft Start time TSS= 0.5ms(Min), and load current during soft start IOSS= 2A, maximum CLOAD can be computed
using the following equation.
If the value of CLOAD is large, and cannot meet the above equation, adjust the value of the capacitor CSS to meet the
condition below.
(Refer to the following items (3) Soft Start Setting equation of time TSS and soft-start value of the capacitor to be
connected to the CSS.)
For example, given VIN = 5V, VOUT = 3.3V, L = 1.5µH, load current during soft start IOSS = 2A, switching frequency FSW=
800kHz (Min), Output capacitor COUT = 44µF, VFB = 0.792V(Max), ISS = 2.0µA(Max), with CLOAD = 220uF, capacitor CSS
is computed as follows.
2. Output Voltage Setting
The output voltage value can be set by the feedback resistance ratio.
For stable operation, it is recommended to use feedback resistance R1 of more than 20k.
Figure 51. Feedback Resistor Circuit
VOUT
R1
R2
FB
Error Amplifier
0.8V
V
0.
8
R
2
R
2
R
1
V
OUT
[]
A
S
S
OU
T
LOA
D
OU
T
CA
P
T
V
C
C
I
F
21.
6
C
‐
V
T
/
2
Δ
I
‐
I
‐
2.
9
Max
C
OU
T
OU
T
S
S
L
OS
S
LOA
D
OU
T
S
S
S
S
OU
T
F
B
L
OS
S
LOA
D
C
‐
C
I
V
V
/
2
ΔI‐I‐2.
9
Max
C
pF
508
6
C
C
V
/
2
Δ
I
‐
I
‐
2.
9
I
V
C
OU
T
LOA
D
F
B
L
OS
S
S
S
OU
T
S
S
Ω
OU
T
R
1
0.
8
‐
V
0.
8
R
2
Datasheet
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3. Soft Start Setting
Turning the EN terminal signal High activates the soft start function. This causes the output voltage to rise gradually
while the current at startup is placed under control. This allows the prevention of output voltage overshoot and inrush
current. The rise time depends on the value of the capacitor connected to the SS terminal.
Turning the EN terminal signal High with the SS terminal open or with the terminal signal High (no capacitor
connected) causes the output voltage to rise in 1msec (Typ).
4. FB Capacitor
Generally, in fixed ON time control (hysteresis control), sufficient ripple voltage in FB voltage is needed to operate
comparator stably. Regarding this IC, by injecting ripple voltage to FB voltage inside IC it is designed to correspond
to low ESR output capacitor. Please set the FB capacitor within the range of the following expression to inject an
appropriate ripple.
msec
AVF
with
CurrentSourceTerminalStartSoft is
(Typ))(0.8VVoltageTerminalFB is
TerminalTimeStartSofttoconnectedCapacitor is
TimeStartSoft is
:Where
8.
0
/
1.
0
0.
8
0.0
1
T
0.01C
I
V
C
T
/
V
T
I
C
/
I
V
C
T
SS
SS
SS
FB
SS
SS
FBSSSSSS
S
S
F
B
S
S
S
S
)
,
Fμ
))(1.0μA(Typ
Frequency Switching is
VoltageOutput is
VoltageInput is
SW
OUT
IN
3
SW
IN
OUT
OUT
FB
3
SW
IN
OUT
OUT
F
V
V
103.3F
V
V
‐
1
V
C
107.65F
V
V
‐
1
V
: Where
Datasheet
Datasheet
24/30
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PCB Layout Design
In the step-down DC/DC converter, a large pulse current flows into two loops. The first loop is the one into which the current
flows when the High-Side FET is turned ON. The flow starts from the input capacitor CIN, runs through the FET, inductor L
and output capacitor COUT and back to GND of CIN via GND of COUT. The second loop is the one into which the current
flows when the Low-Side FET is turned on. The flow starts from the Low-Side FET, runs through the inductor L and output
capacitor COUT and back to GND of the Low-Side FET via GND of COUT. Route these two loops as thick and as short as
possible to allow noise to be reduced for improved efficiency. It is recommended to connect the input and output capacitors
directly to the GND plane. The PCB layout has a great influence on the DC/DC converter in terms of all of the heat
generation, noise and efficiency characteristics.
Accordingly, design the PCB layout considering the following points.
Connect an input capacitor as close as possible to the IC PVIN terminal on the same plane as the IC.
If there is any unused area on the PCB, provide a copper foil plane for the GND node to assist heat dissipation from
the IC and the surrounding components.
Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Route the coil pattern as
thick and as short as possible.
Provide lines connected to FB far from the SW nodes.
Place the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input.
Power Dissipation
When designing the PCB layout and peripheral circuitry, sufficient consideration must be given to ensure that the power
dissipation is within the allowable dissipation curve.
Figure 52. Current Loop of Buck Converter
Figure 53. Thermal Derating Characteristics
(VQFN016V3030)
A
llowable power dissipation: Pd [W]
Ambient temperature: Ta [°C]
(1) 4-layer board (surface heat dissipation copper foil 5505 mm
2
)
(copper foil laminated on each layer)
JA = 47.0°C/W
(2) 4-layer board (surface heat dissipation copper foil 6.28 mm2)
(copper foil laminated on each layer)
JA = 70.62°C/W
(3) 1-layer board (surface heat dissipation copper foil 6.28 mm2)
JA = 201.6°C/W
(4) IC only
JA = 462.9°C/W
Board specification: Glass-Epoxy, 70mm x 70mm x 1.6mm
Copper foil thickness: Front side and reverse side 70µm be used,
2nd and 3rd 35µm be used.
0 25 50 75 100 125 150
0
2.0
3.0
4.0
(2)1.77 W
(1)2.66 W
(3)0.62 W
(4)0.27 W
Datasheet
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I/O equivalence circuit(s)
6. FB 7. FREQ
8. MODE 9. SS
10.11.12. SW 13. BOOT
14. PGD 15. EN
SW
PVIN
BOOT
BOOT
PVIN
SW
PVIN
Datasheet
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Ap plication Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Datasheet
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Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 54. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
16. Over Current Protectio n Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
Datasheet
Datasheet
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Ordering Information
B D 9 B 2 0 0 M U V - E 2
Part Number
Package
VQFN016V3030
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
VQFN016V3030 (TOP VIEW)
D9B Part Number Marking
LOT Number
1PIN MARK
200
Datasheet
Datasheet
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Physical Dimension, Tape and Reel Information
Package Name VQFN016V3030
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
E2
()
Direction of feed
Reel 1pin
Datasheet
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Revision History
Date Revision Changes
28.Aug.2015 001 New Release
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliabili ty, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radi ation-proof design.
5. Please verify and confirm ch aracteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) dependi ng on Ambient temp erature (T a). When used i n sealed area, confirm the actual
ambient temperature.
8. Confirm that operati on temperature is within the specified range d escribed in the product specification.
9. ROHM shall not be in any way responsible or liable for fail ure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. W hen a highl y active halogen ous (chlori ne, bromin e, etc.) flux is used, the residue of flux ma y negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteri orate if the Products are store d in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommende d by ROHM
[c] the Products are exposed to direct sunshine or condensatio n
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage c ondition, solderabil ity of products out of recommended storage time perio d
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
