PS-A (ADP5) PS-A PRESSURE SENSOR Pressure sensor with built-in amplification and temperature compensation circuit (built-in amplification and temperature compensating circuit) FEATURES Example of pressure characteristics (ADP5140) Drive voltage: 5V DC rated voltage; ambient temperature: 25C 77F 5 Output voltage, mV 1. Contains built-in amplification and temperature compensation circuit. Circuit design and adjustment of characteristics are not required by users. 2. High-level precision and high reliability realized. (Overall accuracy is 1.25% FS.) 3. Compact pressure sensor unit that saves space. Same size and footprint (7.0 mm (W) x 7.2 mm (D)) as previous PS pressure sensor. 4 3 2 1 0 0 50 100 Pressure (gauge pressure), (kPa {kgf/cm2}) TYPICAL APPLICATIONS * Gas equipment: Microprocessor gas meter, gas leakage detector * Industrial equipment: Absorption device, etc. ORDERING INFORMATION Ex. ADP 5 Part No. Terminal profile Rated pressure Pressure inlet hole length ADP5: PS-A pressure sensor 1: DIP terminal 0: 100 kPa 1: -100 kPa 2: 25 kPa 3: 50 kPa 4: 100 kPa 5: 200 kPa 6: 500 kPa 7: 1,000 kPa 0: 3 mm .118 inch 1: 5 mm .197 inch 2: SMD terminal PRODUCT TYPES Pressure inlet hole length Part No. 3mm Part No. 5mm 3mm 5mm Terminal DIP terminal DIP terminal SMD terminal SMD terminal Pressure 100kPa -100kPa 25kPa 50kPa 100kPa 200kPa 500kPa 1,000kPa ADP5100 ADP5110 ADP5120 ADP5130 ADP5140 ADP5150 ADP5160 ADP5170 ADP5101 ADP5111 ADP5121 ADP5131 ADP5141 ADP5151 ADP5161 ADP5171 ADP5200 ADP5210 ADP5220 ADP5230 ADP5240 ADP5250 ADP5260 ADP5270 PS-A PRESSURE SENSOR AKCT1B64E '03.9 http://www.nais-e.com/ ADP5201 ADP5211 ADP5221 ADP5231 ADP5241 ADP5251 ADP5261 ADP5271 New 1 PS-A (ADP5) SPECIFICATIONS Type Type of pressure Pressure medium Rated pressure Unit: kPa Drive voltage Temperature compensation range Offset voltage 100 -100 25 2.50.05 Specifications Gauge pressure Air 50 100 50.25V DC 0 to 50C 0.50.05V 4.50.05 (when +100kPa) Rated output voltage Remarks Note*1 200 500 1,000 Note*2 4.50.05V Overall accuracy Note*2 Note*2 Note*3 1.25%FS Current consumption Output impedance Source current Sink current Max. 10mA Approx. 50 Max. 0.2mA Max. 2mA Notes) 1. Please consult us for pressure media other than air. 2. Indicates output when drive voltage is 5 V. Although output fluctuates due to fluctuations in the drive voltage, this is not included. 3. Overall accuracy indicates the accuracy of the offset voltage and rated output voltage at temperatures between 0 and 50C. (FS=4V) 4. Where no particular temperature is indicated, the specification is for use at 25C DATA 1-(1) Output voltage 1-(2) Overall accuracy (Offset voltage) 1-(3) Overall accuracy (Rated output voltage) ADP5170 Drive voltage: 5V DC; temperature: 25C 77F Applied pressure: 0 to +1,000kPa ADP5170 Drive voltage: 5V DC; temperature: 0 to 50C 32 to 122F Applied pressure: 0kPa ADP5170 Drive voltage: 5V DC; temperature: 0 to 50C 32 to 122F Applied pressure: +1,000kPa Accuracy, %FS Output voltage, V 4 3 2 1 0 0 500 1.25 1.25 1.00 1.00 0.75 0.75 0.50 0.50 0.25 0.00 -0.25 -0.50 0.00 -0.25 -0.50 -0.75 -1.00 -1.00 0 +32 Pressure (kPa) 0.25 -0.75 -1.25 1000 Accuracy, %FS 5 25 +77 Temperature, C F -1.25 50 +122 0 +32 25 +77 Temperature, C F 50 +122 2-(1) Output voltage 2-(2) Overall accuracy (Offset voltage) 2-(3) Overall accuracy (Rated output voltage) ADP5100 Drive voltage: 5V DC; temperature: 25C 77F Applied pressure: -100 to +100kPa ADP5100 Drive voltage: 5V DC; temperature: 0 to 50C 32 to 122F Applied pressure: 0kPa ADP5100 Drive voltage: 5V DC; temperature: 0 to 50C 32 to 122F Applied pressure: +100kPa Accuracy, %FS Output voltage, V 4 3 2 1.25 1.00 1.00 0.75 0.75 0.50 0.50 0.25 0.00 -0.50 0 -100 0 Pressure, kPa 100 0.25 0.00 -0.25 -0.25 1 2 1.25 Accuracy, %FS 5 -0.50 -0.75 -0.75 -1.00 -1.00 -1.25 0 +32 25 +77 Temperature, C F 50 +122 -1.25 0 +32 25 +77 Temperature, C F 50 +122 PS-A (ADP5) 3. Evaluation test Tested item Storage at high temperature Storage at low temperature Environmental characteristics Humidity Temperature cycle Endurance characteristics High temperature/high humidity operation Vibration resistance Mechanical characteristics Dropping resistance Terminal strength Soldering Resistance Soldered in DIP soldering bath Temperature (DIP) Tested condition Temperature: Left in a 85C 185F constant temperature bath Time: 100 hrs. Temperature: Left in a -20C -4F constant temperature bath Time: 100 hrs. Temperature/humidity: Left at 40C 104F, 90% RH Time: 100 hrs. Temperature: -20C to 85C -4F to 185F 1 cycle: 30 min. Times of cycle: 100 Temperature/humidity: 40C 104F, 90% RH Operation times: 106, rated voltage applied Double amplitude: 1.5 mm .059 inch Vibration: 10 to 55 Hz Applied vibration direction: X, Y, Z 3 directions Times: 2 hrs each Dropping height: 75 cm 29.528 inch Times: 2 times Pulling strength: 9.8 N {1 kgf}, 10 sec. Bending strength: 4.9 N {0.5 kgf}, left and right 90 1 time Temperature: 230C 446F Time: 5 sec. Temperature: 260C 500F Time: 10 sec. Result Passed Passed Passed Passed Passed Passed Passed Passed Passed Passed Note: For details other than listed above, please consult us. DIMENSIONS mm inch General tolerance: 0.3 .012 1. DIP terminal (Pressure inlet hole: 3mm) ADP51*0 Recommended PC board pattern (TOP VIEW 2:1) Pressure inlet hole 2.2 dia. .087 dia. Vcc NC Vout 6-0.9 dia. 6-.35 dia. 7.5 .295 7.0 7.2 .276 .283 2.5 .098 4R GND NC NC 4-R 0.7 .0 28 0 3.0 -0.1 dia. .2 0 R0 .008 .118 -.004 dia. R 3.0 6.5 .118 1.8 .256 .071 Terminal connection diagram Vcc (5V DC) 0.50.1 .020.004 0.25 0.25 2.5 .098.010 Atmospheric pressure inlet hole 2.5 .098.010 Y T R GND NC NC JAPAN Vcc NC Vout 7.0 .276 Q W E 7.2 .283 2.5 .098 Vout C (0.1F) 9.51.5 .374.059 0.25 0.1 .010 .004 GND Terminal No. 1 2 3 4 5 6 Name Vcc (Power supply [+]) NC (No connection) Vout (Output) NC (No connection) NC (No connection) GND (Ground) 3 PS-A (ADP5) 2. DIP terminal (Pressure inlet hole: 5mm) ADP51*1 mm inch General tolerance: 0.3 .012 Recommended PC board pattern (TOP VIEW 2:1) Pressure inlet hole 2.2 dia. .087 dia. Vcc NC Vout 6-0.9 dia. 6-.35 dia. 7.5 .295 7.0 7.2 .276 .283 2.5 .098 4R GND NC NC 4-R 0.7 .0 0 .2 8 28 3.0 -0.1 dia. 0 R .00 0 .118 -.004 dia. R 5.0 8.5 .197 .335 2.5 .098 Terminal connection diagram Vcc (5V DC) Vout 1.8 .071 C (0.1F) 0.50.1 .020.004 2.50.25 2.50.25 .098.010 .098.010 Y T R GND NC NC Atmospheric pressure inlet hole GND 9.51.5 .374.059 0.25 0.1 .010 .004 Terminal No. 1 2 3 4 5 6 7.2 .283 JAPAN Vcc NC Vout 7.0 .276 Q W E Name Vcc (Power supply [+]) NC (No connection) Vout (Output) NC (No connection) NC (No connection) GND (Ground) 3. SMD terminal (Pressure inlet hole: 3mm) ADP52*0 Pressure inlet hole 2.2 dia. .087 dia. Recommended PC board pattern (TOP VIEW 2:1) Vcc NC Vout 1.1 .043 1.9 .075 7.0 7.2 .276 .283 4 4- -R0 GND NC NC R.0 .7 28 0 2 3.0 -0.1 dia. 0. 08 R 0 0 .118 -.004 dia. R.1.8 3.0 .071 .118 6.5 0.2 .256 .01 5 0.1 0 .004 0.50.1 .020.004 2.50.25 .098.010 2.50.25 .098.010 Atmospheric pressure inlet hole 2.5 .098 Terminal connection diagram 0.5 .020 10.00.3 .394.012 Vcc (5V DC) 0.150.1 .006.004 Vout C (0.1F) GND 7.2 .283 Vcc NC Vout 7.0 .276 Q W E 4 2.5 .098 Y T R GND NC NC JAPAN 9.5 .374 Terminal No. 1 2 3 4 5 6 Name Vcc (Power supply [+]) NC (No connection) Vout (Output) NC (No connection) NC (No connection) GND (Ground) PS-A (ADP5) 4. SMD terminal (Pressure inlet hole: 5mm) ADP52*1 Pressure inlet hole 2.2 dia. .087 dia. mm inch General tolerance: 0.3 .012 Recommended PC board pattern (TOP VIEW 2:1) Vcc NC Vout 1.1 .043 1.9 .075 7.0 7.2 .276 .283 4 4- -R0 GND NC NC R.0 .7 28 0 .2 3.0 -0.1 dia. R0 008 0 .118 -.004 dia. R. 5.0 8.5 .197 .335 2.5 .098 2.5 .098 Terminal connection diagram 1.8 .071 Vcc (5V DC) 0.2 .01 5 0.1 0 .004 0.50.1 .020.004 2.50.25 2.50.25 .098.010 .098.010 Y T R NC NC GND Atmospheric pressure inlet hole JAPAN 9.5 .374 0.5 .020 10.00.3 .394.012 Vout 0.1 .004 0.15 .006 7.2 .283 Vcc NC Vout 7.0 .276 Q W E C (0.1F) GND Terminal No. 1 2 3 4 5 6 Name Vcc (Power supply [+]) NC (No connection) Vout (Output) NC (No connection) NC (No connection) GND (Ground) NOTES 1. Mounting Use lands on the printed-circuit boards to which the sensor can be securely fixed. 2. Soldering Due to its small size, the thermal capacity of the pressure sensor DIP type is low. Therefore, take steps to minimize the effects of external heat. Damage and changes to characteristics may occur due to heat deformation. Use a non-corrosive resin type of flux. Since the pressure sensor DIP type is exposed to the atmosphere, do not allow flux to enter inside. 1) Manual soldering * Set the soldering tip from 260 to 300C (30W), and solder for no more than 5 seconds. * Please note that output may change if the pressure is applied on the terminals when the soldering. * Thoroughly clean the soldering iron. 2) DIP soldering (DIP terminal type) * Please keep the DIP solder bath temperature no higher than 260C. When soldering, heat should be applied no longer than five seconds. * When mounting onto a PCB of low thermal capacity, please avoid DIP soldering as this may cause heat deformity. 3) Reflow soldering (SMD terminal type) * The recommended reflow temperature profile conditions are given below. * We recommend the screen solder printing method as the method for cream solder printing. * Please refer to the recommended PCB specification diagram for the PCB foot pattern. * Self alignment may not always work as expected; therefore, please carefully adjust the position of the terminals and pattern. * The profile temperature is the value measured on the PCB near the terminals. * When doing reflow soldering on the back of the PC board after performing sensor reflow, please fix the sensor with adhesive and so on. 4) Solder reworking * Finish reworking in one operation. * For reworking of the solder bridge, use a soldering iron with a flat tip. Please do not add more flux when reworking. * Please use a soldering iron that is below the temperature given in the specifications in order to maintain the correct temperature at the tip of the soldering iron. 5) Too much force on the terminals will cause deformation and loss in effectiveness of the solder. Therefore, please avoid dropping and careless handling of the product. 6) Please control warping of the PCB within 0.05 mm of the sensor width. 7) When cut folding the PCB after mounting the sensor, take measures to prevent stress to the soldered parts. 8) The sensor terminals are designed to be exposed, so contact of the terminals with metal shards and the like will cause output errors. Therefore, please be careful and prevent things such as metal shards and hands from contacting the terminals. 9) To prevent degradation of the PCB insulation after soldering, please be careful not to get chemicals on the sensor when coating. 10) Please consult us regarding the use of lead-free solder. Temperature 230C 446F 150C 302F Peak temperature Preheating With in (230C 60 sec. 446F max. and 10 sec. max.) Time 3. Connections 1) Please perform connections correctly in accordance with the terminal connection diagram. In particular, be careful not to reverse wire the power supply as this will cause damage or degrade to the product. 2) Do not connect terminals that are not used. This can cause malfunction of the sensor. 5 PS-A (ADP5) 4. Cleaning 1) Since the pressure sensor chip is exposed to the atmosphere, do not allow cleaning fluid to enter inside. 2) Avoid ultrasonic cleaning since this may cause breaks or disconnections in the wiring. 5. Environment 1) Please avoid using or storing the pressure sensor chip in a place exposed to corrosive gases (such as the gases given off by organic solvents, sulfurous acid gas, hydrogen sulfides, etc.) which will adversely affect the performance of the pressure sensor chip. 2) To ensure resistance to power supply superimposed noise, you must provide a capacitor at the power supply input terminal of the sensor in order to stabilize the power supply voltage. We recommend to provide 0.1 F and 1,000 pF capacitor in parallel. Please confirm the noise resistance with the actual equipment and choose adequate capacitor. 3) Since the internal circuitry may be destroyed if an external surge voltages is supplied, provide an element which will absorb the surges. 4) Malfunctioning may occur if the product is in the vicinity of electrical noise such as that from static electricity, lightning, a broadcasting station, an amateur radio, or a mobile phone. 5) Since this pressure sensor chip does not have a water-proof construction, please do not use the sensor in a location where it may be sprayed with water, etc. 6) Avoid using the pressure sensors chip in an environment where condensation may form. Furthermore, its output may fluctuate if any moisture adhering to it freezes. 7) The pressure sensor chip is constructed in such a way that its output will fluctuate when it is exposed to light. Especially when pressure is to be applied by means of a transparent tube, take steps to prevent the pressure sensor chip from being exposed to light. 8) Avoid using the pressure sensor chip where it will be susceptible to ultrasonic or other high-frequency vibration. 6. Quality check under actual loading conditions To assure reliability, check the sensor under actual loading conditions. Avoid any situation that may adversely affect its performance. 7. Other handling precautions 1) That using the wrong pressure range or mounting method may result in accidents. 2) The only direct pressure medium you can use is dry air. The use of other media, in particular, corrosive gases (organic solvent based gases, sulfurous acid based gases, and hydrogen sulfide based gases, etc.) and media that contains moisture or foreign substances will cause malfunction and damage. Please do not use them. 3) The pressure sensor chip is positioned inside the pressure inlet. Never poke wires or other foreign matter through the pressure inlet since they may damage the chip or block the inlet. Avoid use when the atmospheric pressure inlet is blocked. 4) Use an operating pressure which is within the rated pressure range. Using a pressure beyond this range may cause damage. 5) Since static charge can damage the pressure sensor chip, bear in mind the following handling precautions. * When storing the pressure sensor chips, use a conductive material to short the pins or wrap the entire chip in aluminum foil. Plastic containers should not be used to store or transport the chips since they readily become charged. * When using the pressure sensor chips, all the charged articles on the bench surface and the work personnel should be grounded so that any ambient static will be safely discharged. 6) Based on the pressure involved, give due consideration to the securing of the pressure sensor DIP type and to the securing and selection of the inlet tube. Consult us if you have any queries. Internet Homepage North America : http://www.aromat.com/ Europe : http://www.mew-europe.com/ Asia & others : http://www.nais-e.com/ * (Japanese) : http://www.mac-j.co.jp/ * (Chinese) : http://www.cmew.com.cn/ These materials are printed on ECF pulp. These materials are printed with earth-friendly vegetable-based (soybean oil) ink. Please contact .......... Matsushita Electric Works, Ltd. Automation Controls Company Head Office: 1048, Kadoma, Kadoma-shi, Osaka 571-8686, Japan Telephone: Japan (81) Osaka (06) 6908-1050 Facsimile: Japan (81) Osaka (06) 6908-5781 http://www.nais-e.com/ COPYRIGHT (c) 2003 All Rights Reserved AKCT1B64E 200309-3YT 6 Specifications are subject to change without notice. Printed in Japan.