SM6HT High temperature TransilTM for automotive applications Features High performance TRANSIL designed to fit high temperature environment like automotive applications High reliability planar technology High performance in voltage regulation mode Very low leakage current: IR max. = 5 A @ Tamb = 150 C Peak pulse power: 600 W (10/1000 s) Fast response time Unidirectional type Low clamping factor A K o r P SMB (JEDEC DO-214AA) e t le Description This high performance Transil series has been designed to fit high temperature environment such as automotive applications, using surface mount technology. (s) o s b O - Order codes These devices are using high reliability planar technology resulting in high performances in voltage regulation mode and low leakage current at high temperature. ct o r P e c u d ) s t( du t e l o Part number Marking SM6HT24A EMB SM6HT27A EPB SM6HT30A ERB SM6HT36A EVB SM6HT39A EXB SM6HT43A EYB s b O TM: TRANSIL is a trademark of STMicroelectronics March 2007 Rev 7 1/8 www.st.com 8 Characteristics SM6HT 1 Characteristics Table 1. Absolute maximum rating (Tamb = 25 C) Symbol PPP P IFSM Tstg / Tj Parameter Value Peak pulse power dissipation (1) Tj initial = Tamb 600 W Power dissipation on infinite heatsink Tamb = 50 C 6 W Non repetitive surge peak forward current for unidirectional types tp = 10 ms Tj initial = Tamb 75 A -65 to 175 C 260 C Value Unit Storage and operating junction temperature range Maximum lead temperature for soldering during 10 s. TL Unit 1. for a surge greater than the maximum values, the diode will fail in short circuit. Table 2. Thermal resistances Symbol Parameter Rth(j-l) Junction to leads 20 Rth(j-a) Junction to ambient on printed circuit on recommended pad layout 100 Table 3. Electrical characteristics (Tamb = 25 C) Symbol Parameter I IF VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IRM Leakage current IPP Peak pulse current VF Forward voltage drop VF < 3.5 V @ IF = 50 A (pulse test: tp 500 s) IZ Continuous regulation current Types t e l o SM6HT24A so ) s ( ct u d o r P e Marking e t le b O - A C/W o r P VF V IRM IPP VBR @ IR (1) IRM @ VBR VCL @ IPP T (2) 10/1000 s max A c u d VCL VBR VRM Tamb=25 C Tamb=150 C max ) s t( C/W min nom max V V max mA V A IZ @ Tamb=50C max max -4 10 /C mA V V 24 25.2 33.2 18.0 9.4 50 EMB 20.5 22.8 SM6HT27A EPB 23.1 25.7 27 28.4 37.5 16.0 9.6 44 SM6HT30A ERB 25.6 28.5 30 31.5 41.5 14.5 9.7 40 SM6HT36A EVB 30.8 34.2 36 37.8 49.9 12.0 9.9 33 SM6HT39A EXB 33.3 37.1 39 41.0 53.9 11.1 10.0 20 SM6HT43A EYB 36.8 40.9 43 45.2 59.3 10.1 10.1 28 s b O 2 1. Pulse test: tp < 50 ms 2. VBR = T x (Tamb - 25) x VBR (25 C) 2/8 5 1 SM6HT Characteristics Figure 1. Peak power dissipation versus initial junction temperature Figure 2. % Continuous power dissipation versus ambient temperature P(W) 110 7 100 Rth(j-a)=Rth(j-l) 6 90 80 5 70 4 60 50 3 40 2 30 20 Rth(j-a)=100C/W 1 10 Tj initial(C) Tamb(C) 0 0 0 25 Figure 3. 50 75 100 125 150 175 200 Peak pulse power versus exponential pulse duration (Tj initial = 25 C) 0 25 Figure 4. 50 PPP(kW) 75 100 125 c u d 1.0E+02 Tj initial = 25 C Tj initial=25 C 1.0 so 1.0E+00 tp(ms) 0.01 0.10 Figure 5. 10.00 SM6HT27A SM6HT30A SM6HT39A SM6HT43A 10 100 Peak forward voltage drop versus peak forward current (typical values) IFM(A) t e l o s b O SM6HT36A VCL(V) Figure 6. u d o r P e 10/1000 s SM6HT24A 1.0E-01 Junction capacitance versus reverse applied voltage (typical values) C(pF) 1000 ) s ( ct 1.00 b O - ) s t( o r P 8/20 s e t le 1.0E+01 0.1 175 Clamping voltage versus peak pulse current (Tj initial = 25 C) IPP(A) 10.0 150 100.0 F=1MHz VOSC=30mVRMS Tj=25C Tj=175C 10.0 Tj=25C SM6HT24A 1.0 SM6HT27A SM6HT30A SM6HT36A SM6HT39A VR(V) VFM(V) SM6HT43A 0.1 100 0.5 1 10 1.0 1.5 2.0 2.5 3.0 3.5 100 3/8 Characteristics SM6HT Figure 8. Variation of thermal impedance junction to ambient versus pulse duration (Printed circuit board FR4 with recommended pad layout) Figure 7. Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board FR4, eCu = 35 m) Rth(j-a)(C/W) Zth(j-a)(C/W) 110 100.0 Recommended pad layout 100 90 80 10.0 70 60 50 40 1.0 30 20 tp(ms) 10 S(cm) 0 0.1 1.0E-03 1.0E-02 Figure 9. 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 0.0 0.5 1.0 1.5 VR = VRM e t le ) s ( ct Tj(C) 1.0E-01 50 75 100 125 u d o r P e t e l o 4/8 3.0 150 o s b O 175 3.5 4.0 c u d IR(A) s b O 2.5 Variation of leakage current versus junction temperature (typical values) 1.0E+00 25 2.0 o r P 4.5 5.0 ) s t( SM6HT 2 Order information scheme Order information scheme SM 6 HT 43 A Surface Mount Peak Pulse Power 6 = 600 W High Temperature Breakdown voltage 43 = 43 V Type A = Unidirectional c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O 5/8 Package information 3 SM6HT Package information Case: JEDEC DO-214AA molded plastic over Planar junction Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: For unidirectional types the band indicates cathode. Flammability: Epoxy is rated UL94V-0 RoHS package Table 4. SMB dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 b 1.95 2.20 c 0.15 0.40 E 5.10 uc E1 4.05 L o r P e t e l o s b O 6/8 ) s ( ct 2.60 du 5.84 1.62 so 3.30 od 0.087 0.006 0.016 0.201 0.220 4.60 0.159 0.181 3.95 0.130 0.156 1.50 0.030 0.059 Pr 5.60 0.75 0.008 b O - Figure 10. SMB footprint dimensions 1.62 e t le D b 0.077 ) s t( Figure 11. Marking information Cathode bar (unidirectional devices only ) e3 2.18 x x x z y ww e3: ECOPACK ( Leadfree) XXX: Marking Z: Manufacturing location Y: Year WW: week SM6HT 4 Ordering information 5 Ordering information Part number Marking SM6HT24A EMB SM6HT27A EPB SM6HT30A ERB SM6HT36A EVB SM6HT39A EXB SM6HT43A EYB Package Weight Base qty Delivery mode SMB 0.12 g 5000 Tape and reel Revision history c u d Date Revision Apr-1999 4A 26-Jan-2005 5 Figure 9 on page 4: leakage current improved. 18-Mar-2005 6 Table 3: Electrical characteristics (Tamb = 25 C) on page 2: VF specification added. 7 Table 1 on page 2: Power dissipation upgraded from 5 W to 6 W. Table 3 on page 2: IZ max parameter added. Figure 2 on page 3: Updated for 6 W power dissipation. 21-Mar-2007 Changes ) s t( Last release. e t le ) s ( ct o r P o s b O - u d o r P e t e l o s b O 7/8 SM6HT Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. c u d ) s t( Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. e t le o r P UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. o s b O - UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. ) s ( ct u d o Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. r P e t e l o s b O ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8