TC115 PFM/PWM Step-Up DC/DC Converter Features Package Type * High Efficiency at Low Output Load Currents via PFM Mode * Assured Start-up at 0.9V * 80A (Typ) Supply Current * 85% Typical Efficiency at 100mA * 140mA Typical Output Current @ VIN = 2.0V * Low Power Shutdown Mode * No External Switching Transistor Needed * Space Saving SOT-89 Package SOT-89-5 5 4 GND LX TC115 NC PS 1 2 SHDN 3 Applications General Description * * * * * * The TC115 is a high-efficiency step-up DC/DC converter for small, low input voltage or battery powered systems. This device has a start-up voltage of 0.9V and a typical supply current of 80A. Phase compensation and soft-start circuitry are included onchip. Unlike conventional PWM step-up converters, the TC115 automatically shifts to pulse frequency modulation (PFM) at low loads, resulting in reduced supply current and improved efficiency. Pagers Cellular Phones Palmtops 1-Cell to 3-Cell Battery Powered Systems Cameras, Video Recorders Local +3V to +5V Supplies Device Selection Table Part Number Output Osc. Voltage Package Freq. (V)* (kHz) The TC115 requires only an external diode, an inductor, and a capacitor, and supports typical output currents of 140mA. Supply current is reduced to less than 0.5A, max when SHDN input is brought low. Operating Temp. Range TC115501ECT 5.0 SOT-89-5 100 -40C to +85C TC115331ECT 3.3 SOT-89-5 100 -40C to +85C TC115301ECT 3.0 SOT-89-5 100 -40C to +85C Small size, low installed cost, and low supply current make the TC115 step-up converter ideal for use in a wide range of battery powered systems. *Other output voltages are available. Please contact Microchip Technology for details. Functional Block Diagram L1 100H Sumida CD-54 + 1.5V - D1 +3V OUT + C1 10F IN5817 5 4 GND LX + C2 47F Tantalum TC115 NC PS 1 2 SHDN 3 1.5V to +3V, 50mA Supply 2002 Microchip Technology Inc. DS21361B-page 1 TC115 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Power Supply Voltage (PS) .................................... 12V Power Dissipation.............................................500mW LX Sink Current ............................................ 400mA pk SHDN Input Voltage ............................................... 12V Operating Temperature Range............. -40C to +85C Storage Temperature Range .............. -40C to +125C TC115 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VOUT = 5V, TA = 25C, unless otherwise noted. Circuit configuration per Figure 4-1. Symbol Parameter Min Typ Max Units Test Conditions VIN Operating Supply Voltage 0.9 -- 10.0 V Note 5 VSTART Start-Up Supply Voltage -- -- 0.9 V IOUT = 1mA ILXMAX LX Maximum Sink Current -- -- 350 mA fLIM LX Limit Frequency -- 200 -- kHz VLXLIM LX Limit Voltage 0.7 -- 1.3 V IDD No Load Supply Current -- 13 26 A IOUT = 0, VIN = VOUT x 0.8 (Note3) ICC Boost Mode Supply Current -- 80 135 A No external components, VIN = (0.95 x VOUT) applied to PS (or VDD ) input ISTBY Standby Supply Current -- 9 17 A No external components, VIN = (1.1 x VOUT) applied to PS (or VDD) input VLX = VLXLIM Note 2 ISD Shutdown Supply Current -- -- 0.5 A SHDN = 0V fOSC Oscillator Frequency 85 100 115 kHz Note 2, Note 4 VOUT Output Voltage VR x 0.975 VR VR x 1.025 V VIN = 2.2V minimum (Note 1) RSWON LX Output ON Resistance -- 1.4 2.4 VLX = 0.4V PFMDUTY Duty Cycle (PFM Operating Mode) 10 17 25 % No external components. MAXDUTY Maximum Duty Cycle Note 4 80 87 92 % tSS Soft Start Time 4 10 20 msec Efficiency -- 85 -- % VIH SHDN Input Logic High 0.75 -- -- V VIL SHDN Input Logic Low -- -- 0.20 V Note 1: 2: 3: 4: 5: VR is the nominal factory-programmed output voltage setting. VLXLIM is the voltage on the LX pin (with internal switch ON) that will cause the oscillator to run at twice nominal frequency in to limit the switch current through the internal N-channel switching transistor. Measured with D1 = MA735 (reverse current < 1A at a reverse voltage of 10V). With TC115 operating in PWM mode. See Section 3.4 "Behavior When VIN is Greater Than the Factory-Programmed VOUT Setting". DS21361B-page 2 2002 Microchip Technology Inc. TC115 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (SOT-89-5) Symbol 1 NC Not connected. 2 PS Power and voltage sense input. This dual function input provides both feedback voltage sensing and internal chip power. It should be connected to the regulator output. (See Section 4.0, Applications). 3 SHDN Shutdown input. A logic low on this input suspends device operation and supply current is reduced to less than 0.5A. The device resumes normal operation when SHDN is again brought high. 4 LX Inductor switch output. LX is the drain of an internal N-channel switching transistor. This terminal drives the external inductor, which ultimately provides current to the load. 5 GND 2002 Microchip Technology Inc. Description Ground terminal. DS21361B-page 3 TC115 3.0 DETAILED DESCRIPTION The TC115 is a combination PFM/PWM step-up (boost) regulator. It is particularly useful in 1, 2 and 3 cell applications where the required output current is 140mA or less, and size/cost issues are a concern. The device operates in PWM mode when the output load is sufficient to demand a 10% (or greater) duty cycle. While in PWM mode, the TC115 behaves as any other PWM switching regulator, to a maximum duty cycle of 92%. At low output loads (i.e., output loads requiring < 10% duty cycle to support); the TC115 automatically switches to pulse frequency modulation (PFM) operating mode with a fixed duty cycle of 25%, max, (17%, typical). While in PFM mode, the inductor is modulated with individual fixed width pulses only as needed to maintain output voltage. This action reduces supply current, thereby improving power efficiency at low output loads. 3.1 Input Power and Sensing The TC115 is powered from the PS input, which must be connected to the regulated output as shown in Figure 4-1. PS also senses output voltage for closedloop regulation. Start-up current is furnished through the inductor when input voltage is initially applied. This action starts the oscillator, causing the voltage at the PS input to rise, bootstrapping the regulator into full operation. 3.2 Output Diode 3.3 Low Power Shutdown Mode The TC115 enters a low power shutdown mode when SHDN is brought low. While in shutdown, the oscillator is disabled and the internal switch is shut off. Normal regulator operation resumes when SHDN is brought high. SHDN may be tied to the input supply if not used. Note: 3.4 Because the TC115 uses an external diode, a leakage path between the input voltage and the output node (through the inductor and diode) exists while the regulator is in shutdown. Care must be taken in system design to assure the input supply is isolated from the load during shutdown. Behavior When VIN is Greater Than the Factory-Programmed VOUT Setting The TC115 is designed to operate as a step-up regulator only. As such, VIN is assumed to always be less than the factory-programmed VOUT setting (VR). Operating the TC115 with VIN > VR causes regulating action to be suspended (and corresponding supply current reduction to 9A, typical) until VIN is again less than VR. While regulating action is suspended, VIN is connected to VOUT through the series combination of the inductor and Schottky diode. Care must be taken to add the appropriate isolation (MOSFET output switch or post LDO with shutdown) during system design if this VIN/VOUT leakage path is problematic. For best results, use a Schottky diode such as the MA735, 1N5817, EC10 or equivalent. Connect the diode between the PS and LX pins as close to the IC as possible. Do not use ordinary rectifier diodes since the higher forward voltages reduce efficiency. DS21361B-page 4 2002 Microchip Technology Inc. TC115 4.0 APPLICATIONS 4.1 Input Bypass Capacitors Using an input bypass capacitor reduces peak current transients drawn from the input supply and reduces the switching noise generated by the regulator. The source impedance of the input supply determines the size of the capacitor that should be used. FIGURE 4-1: VIN + L1 D1 C2 + 4 EQUATION 4-2: VRIPPLE ESR [(VIN - VSW)tON] L LX GND Solving for L: TC115 NC PS 1 2 EQUATION 4-3: SHDN 3 OFF ON (Tie to VIN or VOUT if not used) 4.2 VRIPPLE ESR(di) Expressing di in terms of switch ON resistance and time: VOUT 5 EQUATION 4-1: where ESR is the equivalent series resistance of the output filter capacitor, and VRIPPLE is in volts. TC115 TYPICAL APPLICATION C1 The inductor value directly affects the output ripple voltage. Equation 4-3 is derived as shown below, and can be used to calculate an inductor value, given the required output ripple voltage (VRIPPLE) and output capacitor series resistance: Inductor Selection Selecting the proper inductor value is a trade-off between physical size and power conversion requirements. Lower value inductors cost less, but result in higher ripple current and core losses. They are also more prone to saturate since the coil current ramps to a higher value. Larger inductor values reduce both ripple current and core losses, but are larger in physical size and tend to increase the start-up time slightly. Practical inductor values, therefore, range from 50H to 300H. Inductors with a ferrite core (or equivalent) are recommended. For highest efficiency, use an inductor with a series resistance less than 20 m). 2002 Microchip Technology Inc. L ESR [(VIN - VSW)tON] VRIPPLE Care must be taken to ensure the inductor can handle peak switching currents, which can be several times load currents. Exceeding rated peak current will result in core saturation and loss of inductance. The inductor should be selected to withstand currents greater than IPK (Equation 4-10) without saturating. Calculating the peak inductor current is straightforward. Inductor current consists of an AC (sawtooth) current centered on an average DC current (i.e., input current). Equation 4-6 calculates the average DC current. Note that minimum input voltage and maximum load current values should be used: EQUATION 4-4: Input Power = Output Power Efficiency DS21361B-page 5 TC115 Re-writing in terms of input and output currents and voltages: EQUATION 4-5: (VINMIN) (IINMAX) = (VOUTMAX) (IOUTMAX) Efficiency Solving for input curent: EQUATION 4-6: IINMAX = (VOUTMAX)(IOUTMAX) (Efficiency)(VINMAX) The sawtooth current is centered on the DC current level; swinging equally above and below the DC current calculated in Equation 4-6. The peak inductor current is the sum of the DC current plus half the AC current. Note that minimum input voltage should be used when calculating the AC inductor current (Equation 4-9). EQUATION 4-7: V = L(di) dt di = V(dt) dt EQUATION 4-8: EQUATION 4-9: 4.3 The LX pin has a typical ON resistance of 1.4, therefore peak switch current is given by (VIN/1.4). The internal transistor switch has a maximum design rating of 350mA. An oscillator frequency doubling circuit is an included guard against high switching currents. Should the voltage on the LX pin rise above 1.3V, max, while the internal N-channel switch is ON, the oscillator frequency automatically doubles to minimize ON time. Although reduced, switch current still flows because the PWM remains in operation. Therefore, the LX input is not internally current limited and care must be taken never to exceed the 350mA maximum limit. Failure to observe this will result in damage to the regulator. 4.4 where: VSW = The voltage drop across the internal N-channel MOSFET. Combining the DC current calculated in Equation 4-6, with half the peak AC current calculated in Equation 49, the peak inductor current is given by: EQUATION 4-10: Output Capacitor The effective series resistance of the output capacitor directly affects the amplitude of the output voltage ripple. (The product of the peak inductor current and the ESR determines output ripple amplitude.) Therefore, a capacitor with the lowest possible ESR should be selected. Smaller capacitors are acceptable for light loads or in applications where ripple is not a concern. The Sprague 595D series of tantalum capacitors are among the smallest of all low ESR surface mount capacitors available. Table 4-1 lists suggested components and suppliers. 4.5 [(VINMIN - VSW)tON] di = L Internal Transistor Switch Board Layout Guidelines As with all inductive switching regulators, the TC115 generates fast switching waveforms which radiate noise. Interconnecting lead lengths should be minimized to keep stray capacitance, trace resistance and radiated noise as low as possible. In addition, the GND pin, input bypass capacitor and output filter capacitor ground leads should be connected to a single point. The input capacitor should be placed as close to power and ground pins of the TC115 as possible. IPK = IINMAX + 0.5(di) TABLE 4-1: Type Surface Mount SUGGESTED COMPONENTS AND SUPPLIERS Inductors Sumida CD54 Series CDR125 Series Coiltronics CTX Series Through-Hole Sumida RCH855 Series RCH110 Series Renco RL1284-12 DS21361B-page 6 Capacitors Diodes Matsuo 267 Series Nihon EC10 Series Sprague 595D Series Matsushita MA735 Series Nichicon F93 Series Sanyo OS-CON Series ON Semiconductor 1N5817 - 1N5822 Nichicon PL Series 2002 Microchip Technology Inc. TC115 FIGURE 4-2: TYPICAL RIPPLE WAVEFORMS TC115301 VIN = 1.0V ILOAD = 10mA CH1: VOUT (DC) CH2: VOUT (AC Ripple) L = 100H C = 47F D1 = MA735 TC115301 VIN = 2.0V ILOAD = 40mA CH1: VOUT (DC) CH2: VOUT (AC Ripple) L = 100H C = 47F D1 = MA735 TC115301 VIN = 2.5V ILOAD = 80mA CH1: VOUT (DC) CH2: VOUT (AC Ripple) L = 100H C = 47F D1 = MA735 2002 Microchip Technology Inc. DS21361B-page 7 TC115 5.0 TYPICAL CHARACTERISTICS (Unless Otherwise Specified, All Parts Are Measured At Temperature = 25C) Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Efficiency vs. Output Current TC115301EMT Output Voltage vs. Output Current TC115301EMT 100 80 2.9 EFFICIENCY (%) OUTPUT VOLTAGE VOUT (V) 3.1 2.0V VIN = 1.0V 1.5V 2.7 VIN = 1.0V 40 20 L1 = 100H C2 = 47F (Tantalum) 1.5V L1 = 100H 0 2.5 0 40 80 120 160 200 0 40 80 120 160 200 OUTPUT CURRENT IOUT (mA) OUTPUT CURRENT IOUT (mA) No Load Input Current vs. Input Voltage TC115301EMT Ripple Voltage vs. Output Current TC115301EMT 200 100 RIPPLE VOLTAGE Vr(mVp-p) L1 = 100H INPUT CURRENT IIN (A) 2.0V 60 150 100 50 0 1.0 80 60 2.0V 1.5V VIN = 1.0V 40 10 0 1.2 1.4 1.6 1.8 INPUT VOLTAGE VIN (V) DS21361B-page 8 L1 = 100H 2.0 0 40 80 120 160 200 OUTPUT CURRENT IOUT (mA) 2002 Microchip Technology Inc. TC115 6.0 6.1 PACKAGING INFORMATION 3 represents first decimal of voltage and frequency Package Marking Information 1 represents product classification; TC115 = 1 2 represents first integer of voltage and frequency Symbol (100kHz) Voltage 1 2 3 4 5 6 1. 2. 3. 4. 5. 6. 2002 Microchip Technology Inc. 4 Symbol (100kHz) Voltage 0 1 2 3 4 5 6 7 8 9 .0 .1 .2 .3 .4 .5 .6 .7 .8 .9 represents production lot ID code Example: For TC115331, the marking code is: 3 X 1 3 DS21361B-page 9 TC115 6.2 Taping Form Component Taping Orientation for 5-Pin SOT-89 Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 1000 7 in 5-Pin SOT-89 6.3 Package Dimensions SOT-89-5 .181 (4.60) .173 (4.40) .071 (1.80) .055 (1.40) .063 (1.60) .055 (1.40) .016 (0.40) REF. .019 (0.48) .014 (0.32) .102 (2.60) .177 (4.50) MAX. .094 (2.40) PIN 1 .031 (0.80) MIN. .021 (0.53) .016 (0.41) .017 (0.44) .014 (0.37) .063 (1.60) .055 (1.40) .019 (0.48) .014 (0.36) Dimensions: inches (mm) DS21361B-page 10 2002 Microchip Technology Inc. TC115 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21361B-page11 TC115 NOTES: DS21361B-page12 2002 Microchip Technology Inc. TC115 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro (R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. 2002 Microchip Technology Inc. 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