47
Film Chip Capacitors
High Surge Voltage SMD Film Capacitors – CL Series
GENERAL DESCRIPTION
Film chip capacitor using a naked and stacked construction
with metallized Polyethylene Naphtalate film (PEN) Usage of a
multitrack technology results to an equivalent serial construc-
tion which gives better high voltage surge handling capability.
ADVANTAGES
• Surge Voltage up to 1500V (10/700 µs)
• Self healing
• Safe open failure mode
• Low ESR
• Surface Mount (IR/Vapor reflow) solution
APPLICATIONS
This new version of our High Voltage SMD range has been
developed to withstand high line surges common in telecom
application.
These capacitors meet the telecom lightning strike protection
standards.
PERFORMANCE CHARACTERISTICS
Climatic Category 55/125/56
Capacitance Range 6.8nF to 33nF
Tolerance on CR±5%, ±10%
Nominal Voltages 630Vdc
Test Voltage 1500V (10/700µ sec.)
Soldering methods IR or vapor phase reflow (not suitable for wave soldering)
Tangent of Loss Angle at 1kHz (DF)
< 100 x 10-4
Insulation resistance minimum: IR
for C ≤ 0.33F IR > 1000 M at 20°C
for 1 min.charge at 100VDC
Temperature range -55°C to 125°C with voltage derating of 1.25%/ºC between 105ºC and 125ºC
Outer Layer
Termination Plating :
100% matte Sn
Ni Barrier Under
Termination
Silver Epoxy
Resin
Brass
Active Layers : PEN dielectric
48
Film Chip Capacitors
High Surge Voltage SMD Film Capacitors – CL Series
CAPACITANCE VALUES (CR) AND NOMINAL VOLTAGES (VR)
VOLTAGE Vdc: 630V
Capacitance
Chip Dimensions Reel
Range Ordering *Tolerances Tape Dimensions Reel Dimensions Packaging Unit Pkg
(CR) Code (page 6) Code
L W H max T W P1 K0 A W1 W2 max Bulk Reel
0.0068µF CL057K0682+ -- 7.20 6.10 2.40 0.80 24.0 12.0 3.80 330 24.4 30.4 1000 2250 BC
(0.283) (0.240) (0.094) (0.032) (0.944) (0.472) (0.149) (12.99) (0.961) (1.196)
0.0082 CL057K0822+ -- 7.20 6.10 2.30 0.80 24.0 12.0 3.80 330 24.4 30.4 1000 2250 BC
(0.283) (0.240) (0.090) (0.032) (0.944) (0.472) (0.149) (12.99) (0.961) (1.196)
0.010µF CL057K0103+ -- 7.20 6.10 2.80 0.80 24.0 12.0 3.80 330 24.4 30.4 1000 2250 BC
(0.283) (0.240) (0.110) (0.032) (0.944) (0.472) (0.149) (12.99) (0.961) (1.196)
0.012 CL057K0123+ -- 7.20 6.10 2.40 0.80 24.0 12.0 3.80 330 24.4 30.4 1000 2250 BC
(0.283) (0.240) (0.094) (0.032) (0.944) (0.472) (0.149) (12.99) (0.961) (1.196)
0.015 CL057K0153+ -- 7.20 6.10 2.90 0.80 24.0 12.0 3.80 330 24.4 30.4 1000 2250 BC
(0.283) (0.240) (0.114) (0.032) (0.944) (0.472) (0.149) (12.99) (0.961) (1.196)
0.018 CL057K0183+ -- 7.20 6.10 3.40 0.80 16.0 12.0 3.80 330 16.4 22.4 1000 2250 BC
(0.283) (0.240) (0.134) (0.032) (0.629) (0.472) (0.149) (12.99) (0.645) (0.881)
0.022 CL957K0223+ -- 7.20 10.0 3.00 0.80 16.0 12.0 4.80 330 16.4 22.4 1000 1300 BC
(0.283) (0.394) (0.118) (0.032) (0.629) (0.472) (0.189) (12.99) (0.645) (0.881)
0.027 CL957K0273+ -- 7.20 10.0 3.70 0.80 16.0 12.0 4.80 330 16.4 22.4 1000 1300 BC
(0.283) (0.394) (0.146) (0.032) (0.629) (0.472) (0.189) (12.99) (0.645) (0.881)
0.033µF CL957K0333+ -- 7.20 10.0 4.00 0.80 16.0 12.0 5.23 330 16.4 22.4 1000 1100 BC
(0.283) (0.394) (0.158) (0.032) (0.629) (0.472) (0.206) (12.99) (0.645) (0.881)
millimeters (inches)
For other Values: upon request
Replace the + by the tolerance code: J = 5% or K = 10%
Replace the -- by the packaging suffix: -- = bulk
BC = tape & reel
W
L
H
T
49
Film Chip Capacitors
High Surge Voltage SMD Film Capacitors – CL Series
MOUNTING AND SOLDERING RECOMMENDATIONS
RECOMMENDED SOLDER PASTE THICKNESS
For optimum solderability, the recommended soldering
paste thickness: 1206 to 1812 :150 to 200µm
In case of hand soldering, the temperature of the soldering
iron should not be above 250°C. Special care must be taken
to avoid touching the capacitor body with the iron tip.
RECOMMENDED CLEANING
To clean flux from the PC board assembly, the recommended
products are: ethanol, isopropyl alcohol, and deionized water
wash. The cleaning products to avoid are: Toluene, Xylene,
Trichloroethylene, Terpene Cleaner EC-7, surface active
agent. In case of using another solvent, please contact us.
OTHER CAUTIONS
Flame retardancy: the dielectric film is not a flame retardant
material.
Environment: contact us when chips are used in humid or
gas atmosphere and /or when using resin.
Recommended handling: do not use edged tools, so not
to damage the capacitors.
TIN WHISKERS TESTS : JEDEC STANDARD NO 22A121
Stress Type Ref. Spec. Test Conditions Analysis Results
Temperature cycling JESD22-A104 -55°C +85(+10/-0)°C air 5 SEM x 1000 Pass
to 10mn soak 3 cycles/hour
Ambient Temperature / 30+/-2°C - 60+/-3% RH -2000H SEM x 1000 Pass
Humidity Storage
High Temperature / 70+/-5°C - 93+3/-2% RH -1000H SEM x 1000 Pass
Humidity Storage
Size Code Case Size A B C
05 2824 6.00 (0.234) 2.50 (0.098) 5.70 (0.224)
95 2840 11.2 (0.440) 2.50 (0.098) 5.70 (0.224)
PAD DIMENSIONS: millimeters (inches)
A
CB
*Reflow soldering referring to JEDEC Standard with some limitations
*JEDEC J-Std 020C
SOLDERING PROFILE
The capacitors can be mounted using infrared and vapor phase soldering following recommended below.
They are NOT suitable for wave soldering.
All temperature refer to topside of the package, measured on the package body surface.
Profile Feature 2824 to 2840
Ramp-Up (Tsmax to Tp) 3°C / second max
Preheat
- Temperature Min (Tsmin) 150°C
- Temperature Min (Tsmax) 200°C
- Time (tsmin to tsmax) 180 sec. max
Time maintained above
- Temperature (TL) 217°C
- Time (tL) 75 sec. max
Peak temperature (Tp) 255°C
Time within 5°C of peak 10 sec.
temperature (tp)
Ramp-Down 6°C / sec.
030
Time (seconds)
Temperature (ºC)
60 90 120 150 180 210 240
Ramp
down
Ramp up
270 300 330
Tp
Tp - 5ºC
Ts min
Ts max
TL
tS
tp
tL
50
Film Chip Capacitors
High Surge Voltage SMD Film Capacitors – CL Series – RoHS
MATERIALS CONTROLLED BY ROHS (PPM BY WEIGHT):
Mass / unit (g) Lead Mercury Cadmium Hexavalent PBB PBDE
Chromium
CB range 000 0 00
RoHS Limit (ppm) 1000 1000 100 1000 1000 1000
Pass/Fail Pass Pass Pass Pass Pass Pass
This product has been tested and found to be compliant with all requirements, provisions, and exemptions of EU Directive 2002/95/EC of the European Parliament and
Council of January 27, 2003. On the Restriction of use of certain Hazardous Substances (RoHS) in electrical and electronic equipment and EU Directive 2000/53/EC
regarding ELV or End of Life Vehicle.
ROHS / ELV STATUS
External Plating
100% Matte Sn as standard
LEAD-FREE STATUS / MOISTURE
SENSITIVITY RANKING
Pb Free Reflow Solder compliant, MSL = 3.
Reflow soldering referring to Jedec Standard with some
limitations. Additional JESD-97 data to be phased in MSL
e3 termination.
PRODUCT LABELING:
(For informational purposes only to be phased in on reel and
container.)
PRODUCT TRACEABILITY:
Full internal material traceability by reference to unique lot
number marked on reel and external package.
RoHS Compliant:
Pb Free:
